TW201637772A - Multi-station abrasive flow polishing machining device - Google Patents

Multi-station abrasive flow polishing machining device Download PDF

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Publication number
TW201637772A
TW201637772A TW104113327A TW104113327A TW201637772A TW 201637772 A TW201637772 A TW 201637772A TW 104113327 A TW104113327 A TW 104113327A TW 104113327 A TW104113327 A TW 104113327A TW 201637772 A TW201637772 A TW 201637772A
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TW
Taiwan
Prior art keywords
polishing
abrasive
station
abrasive flow
upper mold
Prior art date
Application number
TW104113327A
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Chinese (zh)
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TWI615237B (en
Inventor
Wen-Jie Wu
Wen-Qin Jiang
Da-Yu Lin
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Metal Ind Res & Dev Ct
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Priority to TW104113327A priority Critical patent/TWI615237B/en
Publication of TW201637772A publication Critical patent/TW201637772A/en
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Publication of TWI615237B publication Critical patent/TWI615237B/en

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to a multi-station abrasive flow polishing Machining device comprising an abrasive flow driving module, a multi-station polishing module, a vertical displacement module, and a water level displacement module. The multi-station polishing module is connected to the abrasive flow driving module. The vertical displacement module and the water level displacement module drive the multi-station polishing module to perform vertical displacement and water level displacement. The abrasive flow driving module drives the abrasive to enter the multi-station polishing module. The multi-station polishing module polishes a workpiece piecewisely. Accordingly, the complexity of the polishing fixture can be reduced, and it can also be applied in workpieces having different shapes.

Description

多站式磨料流動拋光加工裝置Multi-station abrasive flow polishing device 【0001】【0001】

本發明係有關於一種拋光加工裝置,尤指一種多站式磨料流動拋光加工裝置。

The present invention relates to a polishing apparatus, and more particularly to a multi-station abrasive flow polishing apparatus.

【0002】【0002】

對工件進行拋光之方式通常包含物理拋光、化學拋光、電解拋光或液體拋光,使工件粗糙度降低,以獲得光亮、平整表面。粗糙度降低,以獲得光亮、平整表面。The method of polishing the workpiece usually involves physical polishing, chemical polishing, electrolytic polishing or liquid polishing to reduce the roughness of the workpiece to obtain a bright, flat surface. The roughness is reduced to obtain a bright, flat surface.

【0003】[0003]

磨料流動加工(Abrasive Flow Machining,AFM)是一種對工件表面進行拋光處理之加工方式,其藉由具有磨粒之半固態柔軟之黏彈性磨料在工件表面流動,磨料在工件表面進行相對運動時係會被施壓,被施壓之黏彈性磨料的磨粒即會對工件表面進行微量去除,進而對工件之表面進行連續拋光加工,達成工件表面拋光效果。目前磨料流動加工裝置僅使用一拋光治具對一工件進行拋光加工,因此在拋光工件上有諸多限制。

Abrasive Flow Machining (AFM) is a method of polishing the surface of a workpiece by flowing a semi-solid soft viscoelastic abrasive with abrasive particles on the surface of the workpiece. The abrasive is moved relative to the surface of the workpiece. It will be pressed, and the abrasive particles of the viscoelastic abrasive that is pressed will remove the surface of the workpiece in a small amount, and then the surface of the workpiece is continuously polished to achieve the surface polishing effect of the workpiece. At present, the abrasive flow processing device uses only one polishing fixture to polish a workpiece, and thus has many limitations on polishing the workpiece.

【0004】[0004]

本發明之目的,在於提供一種多站式磨料流動拋光加工裝置,其可降低拋光治具之複雜度,並可減少換模之次數,有效降低製模成本,並提升加工精度及均勻性。The object of the present invention is to provide a multi-station abrasive flow polishing processing device, which can reduce the complexity of the polishing fixture, reduce the number of mold changes, effectively reduce the molding cost, and improve the processing precision and uniformity.

【0005】[0005]

本發明提供一種多站式磨料流動拋光加工裝置,其包含:一磨料流動驅動模組;一多站式拋光模組,其連接該磨料流動驅動模組,並具有複數上模單元及複數下模單元;一垂直位移模組,其連動該些上模單元或該些下模單元作垂直位移;以及一水平位移模組,其連動該些上模單元或該些下模單元作水平位移。

The invention provides a multi-station abrasive flow polishing processing device, comprising: an abrasive flow driving module; a multi-station polishing module connected to the abrasive flow driving module, and having a plurality of upper mold units and a plurality of lower molds a vertical displacement module that interlocks the upper mold units or the lower mold units for vertical displacement; and a horizontal displacement module that interlocks the upper mold units or the lower mold units for horizontal displacement.

1‧‧‧多站式磨料流動拋光加工裝置
10‧‧‧磨料流動驅動模組
101‧‧‧磨料缸
1011‧‧‧穿孔
102‧‧‧推料桿
11‧‧‧多站式拋光模組
111‧‧‧上模座
1111‧‧‧連通孔
112‧‧‧上模單元
1121‧‧‧上模套
1122‧‧‧分段拋光治具
1123‧‧‧孔洞
1124‧‧‧第一圓柱體
1125‧‧‧第二圓柱體
1126‧‧‧螺旋溝槽
113‧‧‧下模單元
1131‧‧‧下模套
1132‧‧‧孔洞
114‧‧‧下模座
1141‧‧‧連通孔
1142‧‧‧滑軌
12‧‧‧垂直位移模組
13‧‧‧水平位移模組
131‧‧‧轉盤
1311‧‧‧孔洞
132‧‧‧致動器
133‧‧‧軌道
2‧‧‧工件
22‧‧‧第一拋光部位
221‧‧‧第一凹槽
23‧‧‧第二拋光部位
231‧‧‧第二凹槽
3‧‧‧磨料
1‧‧‧Multi-station abrasive flow polishing device
10‧‧‧Abrasive flow drive module
101‧‧‧Abrasive cylinder
1011‧‧‧Perforation
102‧‧‧Pushing rod
11‧‧‧Multi-station polishing module
111‧‧‧Upper mold base
1111‧‧‧Connected holes
112‧‧‧Upper unit
1121‧‧‧Upper mold sleeve
1122‧‧‧Segmented polishing fixture
1123‧‧‧ Hole
1124‧‧‧First cylinder
1125‧‧‧Second cylinder
1126‧‧‧Spiral groove
113‧‧‧Under die unit
1131‧‧‧ lower mold sleeve
1132‧‧‧ holes
114‧‧‧ lower mold base
1141‧‧‧Connected holes
1142‧‧‧rails
12‧‧‧Vertical displacement module
13‧‧‧Horizontal displacement module
131‧‧‧ Turntable
1311‧‧‧ hole
132‧‧‧Actuator
133‧‧‧ Track
2‧‧‧Workpiece
22‧‧‧First polished part
221‧‧‧first groove
23‧‧‧Second polished part
231‧‧‧second groove
3‧‧‧Abrasive

【0006】[0006]


第一圖:其為多站式磨料流動拋光加工裝置之第一實施例之示意圖;
第二圖:其為多站式磨料流動拋光加工裝置之第一實施例之多站式拋光模組之示意圖;
第三A圖至第三E圖:其為多站式磨料流動拋光加工裝置之第一實施例之使用狀態圖;
第四圖:其為多站式磨料流動拋光加工裝置之第二實施例之使用狀態圖;
第五圖:其為多站式磨料流動拋光加工裝置之第三實施例之示意圖;
第六圖:其為多站式磨料流動拋光加工裝置之第四實施例之示意圖;以及
第七圖:其為多站式磨料流動拋光加工裝置之第五實施例之示意圖。


First: it is a schematic view of a first embodiment of a multi-station abrasive flow polishing apparatus;
Second: a schematic view of a multi-station polishing module of a first embodiment of a multi-station abrasive flow polishing apparatus;
3A to 3E: FIG. 1 is a use state diagram of the first embodiment of the multi-station abrasive flow polishing apparatus;
Fourth: it is a state of use of the second embodiment of the multi-station abrasive flow polishing apparatus;
Figure 5 is a schematic view showing a third embodiment of a multi-station abrasive flow polishing apparatus;
Figure 6 is a schematic view of a fourth embodiment of a multi-station abrasive flow polishing apparatus; and a seventh diagram: a schematic view of a fifth embodiment of a multi-station abrasive flow polishing apparatus.

【0007】【0007】

為使特徵及所達成之功效有更進一步之瞭解與認識,謹佐以實施例及配合詳細之說明,說明如後:In order to have a better understanding and understanding of the features and the efficacies achieved, please follow the examples and the detailed explanations, as explained below:

【0008】[0008]

請參閱第一圖,揭示多站式磨料流動拋光加工裝置1之第一實施例之示意圖;如圖所示,本實施例之多站式磨料流動拋光加工裝置1包含一磨料流動驅動模組10、一多站式拋光模組11、一垂直位移模組12及一水平位移模組13。磨料流動驅動模組10具有二磨料缸101及二推料桿102,二磨料缸101分別設置於一加工機台之一上機座(圖中未示)及一下機座(圖中未示),並分別容置一磨料。二推料桿102分別設置於二磨料缸101,並推動二磨料缸101內之磨料。二推料桿102可以油壓或氣壓或螺桿等方式驅動,並於對應之磨料缸101內作上下往復運動。Referring to the first figure, a schematic view of a first embodiment of a multi-station abrasive flow polishing apparatus 1 is disclosed; as shown, the multi-station abrasive flow polishing apparatus 1 of the present embodiment includes an abrasive flow drive module 10 A multi-station polishing module 11, a vertical displacement module 12 and a horizontal displacement module 13. The abrasive flow drive module 10 has two abrasive cylinders 101 and two pusher rods 102. The two abrasive cylinders 101 are respectively disposed on one of the processing machines (not shown) and the lower base (not shown). And respectively accommodate an abrasive. The two push rods 102 are respectively disposed in the two abrasive cylinders 101 and push the abrasives in the two abrasive cylinders 101. The two push rods 102 can be driven by oil pressure or air pressure or a screw, and reciprocated up and down in the corresponding abrasive cylinder 101.

【0009】【0009】

多站式拋光模組11連接磨料流動驅動模組10,即位於二磨料缸101之間。請一併參閱第二圖,揭示多站式磨料流動拋光加工裝置1之第一實施例之多站式拋光模組11之示意圖;如圖所示,多站式拋光模組11包含一上模座111、複數上模單元112、複數下模單元113及一下模座114。上模座111設置在位於上機座之磨料缸101的底部(如第一圖所示),該些上模單元112分隔設置於上模座111。每一上模單元112具有一上模套1121,每一上模套1121可設置一分段拋光治具1122。復參閱第一圖,磨料缸101之底部具有一穿孔1011,對應穿孔1011之上模座111具有複數連通孔1111,如第二圖所示,然上模套1121具有複數孔洞1123,該些孔洞1123對應該些連通孔1111,如此使磨料缸101、上模座111與每一上模單元112之上模套1121相互連通。The multi-station polishing module 11 is connected to the abrasive flow drive module 10, that is, between the two abrasive cylinders 101. Referring to the second figure, a schematic diagram of the multi-station polishing module 11 of the first embodiment of the multi-station abrasive flow polishing apparatus 1 is disclosed; as shown, the multi-station polishing module 11 includes an upper mold. The block 111, the plurality of upper die units 112, the plurality of lower die units 113, and the lower mold base 114. The upper mold base 111 is disposed at the bottom of the abrasive cylinder 101 at the upper base (as shown in the first figure), and the upper mold units 112 are spaced apart from the upper mold base 111. Each upper die unit 112 has an upper die set 1121, and each upper die set 1121 can be provided with a segmented polishing fixture 1122. Referring to the first figure, the bottom of the abrasive cylinder 101 has a through hole 1011. The die holder 111 corresponding to the through hole 1011 has a plurality of communicating holes 1111. As shown in the second figure, the upper die set 1121 has a plurality of holes 1123. 1123 corresponds to the communication holes 1111, such that the abrasive cylinder 101, the upper mold base 111 and the upper mold unit 112 of each upper mold unit 112 communicate with each other.

【0010】[0010]

本實施例可設有二個下模單元113,每一下模單元113包含一下模套1131,其設置於下模座114,下模座114設置於位於下機座之磨料缸101的頂部(如第一圖所示),其中位於下機座之磨料缸101的頂部具有一穿孔1011,下模座114具有二連通孔1141,二連通孔1141對應穿孔1011,每一下模套1131設有一孔洞1132,二孔洞1132對應二連通孔1141,以使位於下機座之磨料缸101、下模座114與每一下模單元113之下模套1131相連通。本實施例之二下模單元113之一者的下模套1131供一工件2設置。In this embodiment, two lower die units 113 may be provided. Each lower die unit 113 includes a lower die set 1131 disposed on the lower die holder 114, and the lower die holder 114 is disposed on the top of the abrasive cylinder 101 at the lower base (eg In the first figure, the top of the abrasive cylinder 101 in the lower base has a through hole 1011, the lower die base 114 has two communicating holes 1141, the two communicating holes 1141 correspond to the through holes 1011, and each lower die set 1131 is provided with a hole 1132. The two holes 1132 correspond to the two communication holes 1141, so that the abrasive cylinder 101 and the lower die base 114 located at the lower base communicate with the lower die 1131 of each lower die unit 113. The lower die set 1131 of one of the two lower die units 113 of the present embodiment is provided for a workpiece 2.

【0011】[0011]

上述每一上模單元112設有分段拋光治具1122,每一上模單元112之分段拋光治具1122的大小形狀係依據工件2之形狀尺寸及工件2欲進行拋光加工的部位之形狀尺寸設計。分段拋光治具1122用於控制磨料通過工件2之通道(分段拋光治具1122與工件2間之間隙)的大小,即控制通道的截面積,磨料通過工件2之表面的通道小,則磨料經過工件2之表面進行相對運動時,磨料即會受壓而對工件2之表面進行拋光,同時也加快磨料之流速,進而加快工件2之表面材料的去除作用。因此,控制分段拋光治具1122之形狀尺寸,即可控制分段拋光治具1122之表面與工件2之表面間的間隙,兩者間隙小即可對工件2之表面進行拋光,所以該些分段拋治具1122會對應工件2之不同拋光部位而設計。Each of the upper mold units 112 is provided with a segment polishing fixture 1122, and the size of the segment polishing fixture 1122 of each upper mold unit 112 is determined according to the shape and size of the workpiece 2 and the shape of the portion of the workpiece 2 to be polished. Dimensional design. The segment polishing fixture 1122 is used to control the size of the passage of the abrasive through the workpiece 2 (the gap between the segment polishing fixture 1122 and the workpiece 2), that is, the cross-sectional area of the control passage, and the passage of the abrasive through the surface of the workpiece 2 is small. When the abrasive moves relative to the surface of the workpiece 2, the abrasive is pressed to polish the surface of the workpiece 2, and the flow rate of the abrasive is also accelerated, thereby accelerating the removal of the surface material of the workpiece 2. Therefore, by controlling the shape and size of the segment polishing fixture 1122, the gap between the surface of the segment polishing fixture 1122 and the surface of the workpiece 2 can be controlled, and the surface of the workpiece 2 can be polished with a small gap, so these The segmented jig 1122 will be designed to correspond to different polished portions of the workpiece 2.

【0012】[0012]

舉例說明,本實施例之工件2可分成一第一拋光部位22及一第二拋光部位23,第一拋光部位22具有一第一凹槽221,第二拋光部位23位於第一拋光部位22之上方,並具有直徑大於第一凹槽221之直徑的一第二凹槽231。然本實施例具有二個上模單元112,二上模單元112分別具有一分段拋光治具1122,圖中排列於左側之分段拋光治具1122預設為對第一拋光部位22進行拋光加工,其包含一第一圓柱體1124及一第二圓柱體1125,第一圓柱體1124位於第二拋光部位23,第二圓柱體1125連接第一圓柱體1124之下方,並位於第一拋光部位22內,第一圓柱體1124之直徑較第二圓柱體1125之直徑大。第一圓柱體1124用於連接第二圓柱體1125及上模套1121,使第二圓柱體1125可固定於上模套1121,由於此分段拋光治具1122主要是針對第一拋光部位22進行拋光加工,所以第一圓柱體1124未對第二拋光部位23進行拋光加工,如此第一圓柱體1124之表面與第二拋光部位23之表面間之間隙較大。第二圓柱體1125用於對第一拋光部位22進行拋光加工,所以第二圓柱體1125之表面與第一拋光部位22之表面間之間隙較小。For example, the workpiece 2 of the embodiment can be divided into a first polishing portion 22 and a second polishing portion 23. The first polishing portion 22 has a first recess 221, and the second polishing portion 23 is located at the first polishing portion 22. Above, and having a second groove 231 having a diameter larger than the diameter of the first groove 221. However, the embodiment has two upper mold units 112, and the two upper mold units 112 respectively have a segment polishing fixture 1122. The segment polishing fixture 1122 arranged on the left side is preset to polish the first polishing portion 22. Processing, comprising a first cylinder 1124 and a second cylinder 1125, the first cylinder 1124 is located at the second polishing portion 23, the second cylinder 1125 is connected below the first cylinder 1124, and is located at the first polishing portion Within 22, the diameter of the first cylinder 1124 is greater than the diameter of the second cylinder 1125. The first cylinder 1124 is used to connect the second cylinder 1125 and the upper mold sleeve 1121 so that the second cylinder 1125 can be fixed to the upper mold sleeve 1121. Since the segment polishing fixture 1122 is mainly for the first polishing portion 22 Since the first cylinder 1124 does not polish the second polishing portion 23, the gap between the surface of the first cylinder 1124 and the surface of the second polishing portion 23 is large. The second cylinder 1125 is used for polishing the first polishing portion 22, so that the gap between the surface of the second cylinder 1125 and the surface of the first polishing portion 22 is small.

【0013】[0013]

如第二圖所示,圖中排列於右側之分段拋光治具1122預設為欲對第二拋光部位23進行拋光加工,所以位於右側之分段拋光治具1122為一圓柱體,相對於第二拋光部位23,並未延伸至第一拋光部位22,此分段拋光治具1122之表面與第二拋光部位23之表面的間隙較小(如第三E圖所示)。如此可知,每一分段拋光治具1122之表面與工件2之表面間之間隙大小均不相同。As shown in the second figure, the segment polishing fixture 1122 arranged on the right side of the figure is preset to be polished for the second polishing portion 23, so the segment polishing fixture 1122 located on the right side is a cylinder, as opposed to The second polishing portion 23 does not extend to the first polishing portion 22, and the gap between the surface of the segment polishing jig 1122 and the surface of the second polishing portion 23 is small (as shown in FIG. 3E). As can be seen, the gap between the surface of each segment polishing jig 1122 and the surface of the workpiece 2 is different.

【0014】[0014]

本實施例之垂直位移模組12及水平位移模組13可分別設置於上機座或下機座,換句話說,可分別帶動該些上模單元112或下模單元113作垂直位移或/及水平位移。再回至第一圖,於本實施例中,垂直位移模組12設置於上機座,以帶動該些上模單元112相對該些下模單元113作垂直位移。因垂直位移模組12設置於上機座,所以同時也帶動上模座111及位於上機座之磨料缸101作垂直位移。水平位移模組13設置於下機座,以帶動該些下模單元113相對該些上模單元112作水平位移,於此之水平位移可為直線移動或旋轉。同樣地,水平位移模組13設置於下機座,可使下模座114作水平位移。下述會再說明水平位移模組13之結構,於此不詳述。The vertical displacement module 12 and the horizontal displacement module 13 of the embodiment can be respectively disposed on the upper base or the lower base. In other words, the upper die unit 112 or the lower die unit 113 can be respectively driven to be vertically displaced or/ And horizontal displacement. Returning to the first figure, in the embodiment, the vertical displacement module 12 is disposed on the upper frame to drive the upper die units 112 to be vertically displaced relative to the lower die units 113. Since the vertical displacement module 12 is disposed on the upper base, the upper die base 111 and the abrasive cylinder 101 located on the upper base are also vertically displaced. The horizontal displacement module 13 is disposed on the lower base to drive the lower die units 113 to be horizontally displaced relative to the upper die units 112, wherein the horizontal displacement can be linearly moved or rotated. Similarly, the horizontal displacement module 13 is disposed on the lower base, and the lower mold base 114 can be horizontally displaced. The structure of the horizontal displacement module 13 will be described below, and will not be described in detail herein.

【0015】[0015]

上述已說明多站式磨料流動拋光加工裝置1之結構,於下述開始說明多站式磨料流動拋光加工裝置1之加工方式,請一併參閱第三A至三E圖,揭示多站式磨料流動拋光加工裝置之第一實施例之使用狀態圖;如第三A圖所示,先將二磨料缸101內填滿磨料3,並藉由垂直位移模組12帶動該些上模單元112相對該些下模單元113往下移動,使該些上模單元112閉合於對應之下模單元113,如第三A圖所示,位於左側之分段拋光治具1122先置入下模單元113之工件2的第一拋光部位22內。接著如第三B圖所示,位於上機座之磨料缸101內的推料桿102推壓磨料缸101內之磨料3進入上模套1121,磨料3沿著分段拋光治具1122與第二拋光部位23間之間隙及分段拋光治具1122與第一拋光部位22間之間隙流動。然分段拋光治具1122與第一拋光部位22間之間隙較小,以使流動於分段拋光治具1122與第一拋光部位22間之間隙的磨料3對第一拋光部位22之表面進行拋光加工。隨著位於上機座之磨料缸101內的推料桿102持續推壓,流經第一拋光部位22之磨料流入位於下機座之磨料缸101。The structure of the multi-station abrasive flow polishing apparatus 1 has been described above, and the processing method of the multi-station abrasive flow polishing apparatus 1 will be described below. Please refer to the third to third E drawings together to disclose the multi-station abrasive. A state diagram of the first embodiment of the flow polishing apparatus; as shown in FIG. 3A, the two abrasive cylinders 101 are filled with the abrasive 3, and the upper mold unit 112 is driven by the vertical displacement module 12. The lower die unit 113 moves downward to close the upper die unit 112 to the corresponding lower die unit 113. As shown in FIG. 3A, the segment polishing fixture 1122 located on the left side is first placed in the lower die unit 113. The first polishing portion 22 of the workpiece 2 is inside. Then, as shown in FIG. B, the push rod 102 located in the abrasive cylinder 101 of the upper base presses the abrasive 3 in the abrasive cylinder 101 into the upper mold sleeve 1121, and the abrasive 3 follows the segment polishing fixture 1122 and the first The gap between the two polishing portions 23 and the gap between the segment polishing fixture 1122 and the first polishing portion 22 flow. The gap between the segment polishing fixture 1122 and the first polishing portion 22 is small, so that the abrasive 3 flowing in the gap between the segment polishing fixture 1122 and the first polishing portion 22 faces the surface of the first polishing portion 22. Polishing. As the push rod 102 in the abrasive cylinder 101 of the upper frame continues to push, the abrasive flowing through the first polishing portion 22 flows into the abrasive cylinder 101 at the lower base.

【0016】[0016]

待位於上機座之磨料缸101內推抵磨料3之推料桿102達預定位置後,如第三C圖所示,位於下機座之磨料缸101內的推料桿102開始推壓磨料缸101內之磨料3進入下模套1131,磨料3流至分段拋光治具1122與第一拋光部位22間之間隙,分段拋光治具1122即會迫使磨料3可對第一拋光部位22進行拋光加工。接著磨料3受擠壓而流至分段拋光治具1122與第二拋光部位23間之間隙,最後磨料3再流入上機座之磨料缸101。然後不斷地反覆上述動作,直到第一拋光部位22完成拋光加工。After the pusher rod 102 in the abrasive cylinder 101 of the upper base is pushed to the predetermined position of the abrasive 3, as shown in FIG. 3C, the pusher bar 102 located in the abrasive cylinder 101 of the lower base starts to push the abrasive. The abrasive 3 in the cylinder 101 enters the lower die set 1131, and the abrasive 3 flows to the gap between the segmented polishing fixture 1122 and the first polishing portion 22, and the segmented polishing fixture 1122 forces the abrasive 3 to the first polishing portion 22 Polishing. Then, the abrasive 3 is pressed to flow to the gap between the segment polishing jig 1122 and the second polishing portion 23, and finally the abrasive 3 flows into the abrasive cylinder 101 of the upper frame. The above action is then continuously repeated until the first polishing portion 22 completes the polishing process.

【0017】[0017]

待第一拋光部位22完成拋光加工後,如第三D圖所示,垂直位移模組12帶動該些上模單元112相對該些下模單元113向上移動,即分離上模單元112與下模單元113,以分離分段拋光治具1122與工件2。接著水平位移模組13以移動或旋轉方式帶動該些下模單元113相對該些上模單元112作水平位移,於此實施例中,水平位移模組13帶動該些下模單元113作水平位移,使原位於左側之下模單元113對應位於右側之上模單元112,原位於右側之下模單元113對應位於左側之上模單元112。完成上述定位過程後,如第三E圖所示,垂直位移模組12帶動該些上模單元112相對該些下模單元113向下運動,位於右側之分段拋光治具1122進入下模單元113之工件2的第二拋光部位23。然後通入磨料3至分段拋光治具1122與第二拋光部位23間之間隙,分段拋光治具1122迫使磨料3對第二拋光部位23進行拋光加工,其中磨料3之驅動及流動方式已於上述揭露,於此不再贅述。After the first polishing portion 22 finishes the polishing process, as shown in FIG. 3D, the vertical displacement module 12 drives the upper mold units 112 to move upward relative to the lower mold units 113, that is, the upper mold unit 112 and the lower mold are separated. The unit 113 is configured to separate the segment polishing fixture 1122 from the workpiece 2. Then, the horizontal displacement module 13 drives the lower mold units 113 to be horizontally displaced relative to the upper mold units 112 in a moving or rotating manner. In this embodiment, the horizontal displacement module 13 drives the lower mold units 113 to perform horizontal displacement. The lower die unit 113 is located on the right upper die unit 112, and the lower right die unit 113 is located on the left upper die unit 112. After the positioning process is completed, as shown in FIG. E, the vertical displacement module 12 drives the upper die unit 112 to move downward relative to the lower die units 113, and the segment polishing fixture 1122 located on the right side enters the lower die unit. The second polishing portion 23 of the workpiece 2 of 113. Then, the abrasive 3 is passed to the gap between the segment polishing fixture 1122 and the second polishing portion 23, and the segment polishing fixture 1122 forces the abrasive 3 to polish the second polishing portion 23, wherein the driving and flowing manner of the abrasive 3 has been As disclosed above, it will not be repeated here.

【0018】[0018]

上述另一未容置工件2之下模單元113與位於上機座之磨料缸101、上模座111、對應之上模單元112、下模座114及位於下機座之磨料缸101相互連通,因此當二磨料缸101內的二推料桿102作上下往復運動時,磨料3還是會流入未容置工件2之下模單元113,並流動於位於上機座之磨料缸101、上模座111、未容置工件2之下模單元113對應之上模單元112、未容置工件2之下模單元113、下模座114及位於下機座之磨料缸101,如第三C圖所示。The other unsupported workpiece 2 lower mold unit 113 is connected to the abrasive cylinder 101, the upper mold base 111, the corresponding upper mold unit 112, the lower mold base 114 and the abrasive cylinder 101 located at the lower base of the upper base. Therefore, when the two push rods 102 in the two abrasive cylinders 101 reciprocate up and down, the abrasive 3 still flows into the mold unit 113 below the workpiece 2, and flows to the abrasive cylinder 101 and the upper mold located in the upper base. The mold 111, the mold unit 113 under the workpiece 2 is not corresponding to the upper mold unit 112, the mold unit 113 under the workpiece 2, the lower mold base 114, and the abrasive cylinder 101 located at the lower base, as shown in the third C diagram. Shown.

【0019】[0019]

另參閱第四圖,未容置工件2之下模套1131的底部也可作成封閉的,以阻斷下模單元113與位於下機座之磨料缸101之連通,所以磨料3填滿下模單元113及與其連通之上模單元112,並不會影響整體之運作。Referring to the fourth figure, the bottom of the mold sleeve 1131 which is not accommodated under the workpiece 2 can also be closed to block the communication between the lower mold unit 113 and the abrasive cylinder 101 located at the lower base, so that the abrasive material 3 fills the lower mold. Unit 113 and its associated upper die unit 112 do not affect the overall operation.

【0020】[0020]

由上述可知,多站式磨料流動拋光加工裝置1藉由該些分段拋光治具1122依序對工件2之各拋光部位進行拋光加工,如此可以簡化拋光治具之設計,可降低治具之製造成本,也可增加拋光加工之精度。It can be seen from the above that the multi-station abrasive flow polishing device 1 sequentially polishes the polished portions of the workpiece 2 by the segment polishing fixtures 1122, thereby simplifying the design of the polishing fixture and reducing the fixture. Manufacturing costs can also increase the precision of the polishing process.

【0021】[0021]

請參閱第五圖,揭示多站式磨料流動拋光加工裝置之第三實施例之示意圖;如圖所示,上述多站式磨料流動拋光加工裝置僅使用二下模單元113之一者。本實施例之多站式磨料流動拋光加工裝置之二下模單元113分別設置一工件2,二上模單元112可同時對應二下模單元113之工件2,以進行拋光加工。舉例說明,位於左側之分段拋光治具1122可對位於左側之下模單元113之工件2的第一拋光部位22,以進行拋光加工,位於右側之分段拋光治具1122可對位於右側之下模單元113之工件2的第二拋光部位23,以進行拋光加工。Referring to the fifth drawing, a schematic view of a third embodiment of a multi-station abrasive flow polishing apparatus is disclosed; as shown, the multi-station abrasive flow polishing apparatus uses only one of the two lower mold units 113. The two lower die units 113 of the multi-station abrasive flow polishing apparatus of the present embodiment respectively provide a workpiece 2, and the two upper mold units 112 can simultaneously correspond to the workpiece 2 of the two lower mold units 113 for polishing. For example, the segmented polishing fixture 1122 on the left side may be polished to the first polishing portion 22 of the workpiece 2 located on the lower left mold unit 113, and the segment polishing fixture 1122 located on the right side may be located on the right side. The second polishing portion 23 of the workpiece 2 of the lower mold unit 113 is subjected to a polishing process.

【0022】[0022]

當完成上述拋光加工時,水平位移模組13帶動該二下模單元113相對二上模單元112轉動,使位於左側之分段拋光治具1122可對原位於右側之下模單元113之工件2的第一拋光部位22進行拋光加工,位於右側之分段拋光治具1122可對原位於左側之下模單元113之工件2的第二拋光部23進行拋光加工。由上述可知,多站式磨料流動拋光加工裝置可同時對多個工件2進行拋光加工,如此可提升拋光加工之速率。When the above polishing process is completed, the horizontal displacement module 13 drives the two lower die units 113 to rotate relative to the two upper die units 112, so that the segmented polishing fixture 1122 located on the left side can work on the workpiece 2 originally located on the lower right die unit 113. The first polishing portion 22 is subjected to a polishing process, and the segment polishing fixture 1122 located on the right side can polish the second polishing portion 23 of the workpiece 2 originally located on the lower left mold unit 113. As can be seen from the above, the multi-station abrasive flow polishing apparatus can simultaneously polish a plurality of workpieces 2, thereby increasing the rate of polishing processing.

【0023】[0023]

上述說明水平位移模組13帶動二下模單元113相對二上模單元112轉動,水平位移模組13包含一轉盤131,轉盤131設置於磨料缸101與下模座114之間,轉盤131具有複數孔洞1311,並分別對應磨料缸101之穿孔1011,下模座114之該些連通孔1141,使磨料缸101、下模座114與下模套1131保持連通。欲改變二下模單元113之位置時,可以手動方式轉動轉盤131,轉盤131可帶動二下模單元113轉動,以改變二下模單元113之位置。當然水平位移模組13更包含一致動器132,致動器132可為一馬達,並連接轉盤131,以驅動轉盤131轉動。然本實施例之下模單元113的數量可為二個以上,並呈環狀排列,該些上模單元112對應該些下模單元113,其亦呈環狀排列。此外,本發明之上模單元112之數量會依據工件2欲進行拋光加工之部位的複雜度而決定,複雜度高之加工部位可分多段進行拋光加工,如此上模單元112之數量即會增加。The horizontal displacement module 13 drives the two lower die units 113 to rotate relative to the two upper die units 112. The horizontal displacement module 13 includes a turntable 131. The turntable 131 is disposed between the abrasive cylinder 101 and the lower die holder 114. The turntable 131 has a plurality of The holes 1311 respectively correspond to the through holes 1011 of the abrasive cylinder 101 and the communication holes 1141 of the lower die holder 114, so that the abrasive cylinder 101 and the lower die holder 114 are kept in communication with the lower die set 1131. To change the position of the two lower die units 113, the turntable 131 can be manually rotated, and the turntable 131 can drive the two lower die units 113 to rotate to change the position of the two lower die units 113. Of course, the horizontal displacement module 13 further includes an actuator 132. The actuator 132 can be a motor and is connected to the turntable 131 to drive the turntable 131 to rotate. However, the number of the die units 113 in the present embodiment may be two or more and arranged in a ring shape, and the upper die units 112 correspond to the lower die units 113, which are also arranged in a ring shape. In addition, the number of the upper mold units 112 of the present invention is determined according to the complexity of the portion of the workpiece 2 to be polished, and the processing portion with high complexity can be polished in multiple stages, so that the number of the upper mold units 112 is increased. .

【0024】[0024]

請參閱第六圖,揭示多站式磨料流動拋光加工裝置之第四實施例之示意圖;如圖所示,上述實施例之該些上模單元112及該些下模單元113分別為環狀排列並相互對應,而本實施例之該些上模單元112及該些下模單元113分別為直線排列,該些上模單元122對應該些下模單元113之相鄰二者,而水平位移模組13帶動該些下模單元113相對該些上模單元112作直線移動。所以水平位移模組13包含一軌道133,其設置於下模座114與磨料缸101之間,下模座114之底部具有一滑軌1142,滑軌1142設置於軌道133,使下模座114可沿著軌道133作直線移動,以帶動該些下模單元113作直線移動。上述驅動滑軌1142滑動於軌道133可採人工推動或利用致動器驅動。Referring to FIG. 6 , a schematic diagram of a fourth embodiment of a multi-station abrasive flow polishing apparatus is disclosed. As shown in the figure, the upper mold unit 112 and the lower mold units 113 of the above embodiment are respectively arranged in a ring shape. And corresponding to each other, and the upper mold unit 112 and the lower mold unit 113 of the embodiment are respectively arranged in a straight line, and the upper mold units 122 correspond to the adjacent two of the lower mold units 113, and the horizontal displacement mode The group 13 drives the lower die units 113 to move linearly with respect to the upper die units 112. Therefore, the horizontal displacement module 13 includes a rail 133 disposed between the lower mold base 114 and the abrasive cylinder 101. The bottom of the lower mold base 114 has a slide rail 1142. The slide rail 1142 is disposed on the rail 133 to lower the mold base 114. The linear movement can be performed along the track 133 to drive the lower die units 113 to move linearly. The above-described driving slide 1142 is slid on the rail 133 and can be manually driven or driven by an actuator.

【0025】[0025]

請參閱第七圖,揭示多站式磨料流動拋光加工裝置之第五實施例之示意圖;如圖所示,上述位於左側之分段拋光治具1122的表面為光滑平面,本實施例之位於左側之分段拋光治具1122之第二圓柱體1125之表面設有一螺旋溝槽1126。當此分段拋光治具1122對工件2進行拋光加工時,磨料3流經第二圓柱體1125與第二拋光部位23間之間隙時,第二圓柱體1125之表面的螺旋溝槽1126可改變磨料3之流場,以改變磨料之拋光路徑,進而可增加磨料3對拋光部位之表面研磨面積與研磨切削力,磨料作用於工件2之研磨切削力的方向有縱向方向、螺旋溝槽1126之切線方向與法線方向,並可改變拋光部位之表面粗糙度與均勻性,即提升工件之表面品質,同時也提升拋工速率。上述螺旋溝槽1126也可佈滿整個分段拋光治具1122之表面。此外,另一分段拋光治具1122之表面也可設有螺旋溝槽1126。Referring to the seventh drawing, a schematic view of a fifth embodiment of the multi-station abrasive flow polishing apparatus is disclosed. As shown in the figure, the surface of the segment polishing fixture 1122 on the left side is a smooth plane, and the embodiment is located on the left side. A surface of the second cylinder 1125 of the segmented polishing fixture 1122 is provided with a spiral groove 1126. When the segment polishing fixture 1122 performs the polishing process on the workpiece 2, when the abrasive 3 flows through the gap between the second cylinder 1125 and the second polishing portion 23, the spiral groove 1126 on the surface of the second cylinder 1125 can be changed. The flow field of the abrasive 3 is used to change the polishing path of the abrasive, thereby increasing the surface grinding area and the grinding cutting force of the abrasive 3 on the polished portion, and the direction of the grinding cutting force acting on the workpiece 2 by the abrasive has a longitudinal direction, a spiral groove 1126 The tangential direction and the normal direction, and can change the surface roughness and uniformity of the polished portion, that is, improve the surface quality of the workpiece, and also increase the throwing rate. The spiral groove 1126 described above may also cover the surface of the entire segmented polishing fixture 1122. In addition, the surface of the other segmented polishing fixture 1122 may also be provided with a spiral groove 1126.

【0026】[0026]

綜上所述,本發明揭示一種多站式磨料流動拋光加工裝置,其可分段地對工件進行拋光加工,可有效降低拋光治具的複雜度,進而可降低拋光治具之製造成本。然多站式磨料流動拋光加工裝置可同時對多個工件進行拋光加工,可有效提升拋光效率。此外,分段拋光治具可設有螺紋溝槽而可改變磨料之流場,進而可提升拋光部位之表面品質,也能可再提升整體之拋光效率。另外,多站式磨料流動拋光加工裝置可減少換模,而可簡化拋光加工製程,以可省時。In summary, the present invention discloses a multi-station abrasive flow polishing apparatus capable of polishing a workpiece in stages, which can effectively reduce the complexity of the polishing fixture, thereby reducing the manufacturing cost of the polishing fixture. However, the multi-station abrasive flow polishing device can simultaneously polish a plurality of workpieces, which can effectively improve the polishing efficiency. In addition, the segmented polishing fixture can be provided with a threaded groove to change the flow field of the abrasive, thereby improving the surface quality of the polishing portion and improving the overall polishing efficiency. In addition, the multi-station abrasive flow polishing unit reduces mold change and simplifies the polishing process, saving time.

【0027】[0027]

惟以上所述者,僅為本發明之實施例而已,並非用來限定本發明實施之範圍,故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。The above is only the embodiment of the present invention, and is not intended to limit the scope of the present invention, so that the shapes, structures, features, and spirits described in the claims of the present invention are equally changed and modified. All should be included in the scope of the patent application of the present invention.

1‧‧‧多站式磨料流動拋光加工裝置 1‧‧‧Multi-station abrasive flow polishing device

10‧‧‧磨料流動驅動模組 10‧‧‧Abrasive flow drive module

101‧‧‧磨料缸 101‧‧‧Abrasive cylinder

1011‧‧‧穿孔 1011‧‧‧Perforation

102‧‧‧推料桿 102‧‧‧Pushing rod

11‧‧‧多站式拋光模組 11‧‧‧Multi-station polishing module

12‧‧‧垂直位移模組 12‧‧‧Vertical displacement module

13‧‧‧水平位移模組 13‧‧‧Horizontal displacement module

Claims (10)

【第1項】[Item 1] 一種多站式磨料流動拋光加工裝置,其包含:
一磨料流動驅動模組;
一多站式拋光模組,其連接該磨料流動驅動模組,並具有複數上模單元及複數下模單元;
一垂直位移模組,其連動該些上模單元或該些下模單元作垂直位移;以及
一水平位移模組,其連動該些上模單元或該些下模單元作水平位移。
A multi-station abrasive flow polishing apparatus comprising:
An abrasive flow drive module;
a multi-station polishing module connected to the abrasive flow driving module, and having a plurality of upper mold units and a plurality of lower mold units;
a vertical displacement module that interlocks the upper mold units or the lower mold units for vertical displacement; and a horizontal displacement module that interlocks the upper mold units or the lower mold units for horizontal displacement.
【第2項】[Item 2] 如申請專利範圍第1項所述之多站式磨料流動拋光加工裝置,其中每一該上模單元更包含一分段拋光治具。The multi-station abrasive flow polishing apparatus of claim 1, wherein each of the upper mold units further comprises a segmented polishing fixture. 【第3項】[Item 3] 如申請專利範圍第2項所述之多站式磨料流動拋光加工裝置,其中該些分段拋光治具之至少一之一表面具有一螺旋溝槽。The multi-station abrasive flow polishing apparatus of claim 2, wherein at least one of the surfaces of the segmented polishing fixtures has a spiral groove. 【第4項】[Item 4] 如申請專利範圍第2項所述之多站式磨料流動拋光加工裝置,其中該多站式拋光模組更包含:
一上模座,其設置該些上模單元;以及
一下模座,其對應該上模座設置,並設置該些下模單元。
The multi-station abrasive flow polishing apparatus according to claim 2, wherein the multi-station polishing module further comprises:
An upper mold base, which is provided with the upper mold units; and a lower mold base which is disposed corresponding to the upper mold base and which is provided with the lower mold units.
【第5項】[Item 5] 如申請專利範圍第4項所述之多站式磨料流動拋光加工裝置,其中每一該上模單元包含:
一上模套,其設置於該上模座,並設置該分段拋光治具。
The multi-station abrasive flow polishing apparatus of claim 4, wherein each of the upper mold units comprises:
An upper mold sleeve is disposed on the upper mold base, and the segment polishing fixture is disposed.
【第6項】[Item 6] 如申請專利範圍第4項所述之多站式磨料流動拋光加工裝置,其中每一該下模單元包含:
一下模套,其設置於該下模座。
The multi-station abrasive flow polishing apparatus of claim 4, wherein each of the lower mold units comprises:
A die sleeve is disposed on the lower die holder.
【第7項】[Item 7] 如申請專利範圍第6項所述之多站式磨料流動拋光加工裝置,其中該些下模套之至少一者的底部為封閉。The multi-station abrasive flow polishing apparatus of claim 6, wherein the bottom of at least one of the lower mold sleeves is closed. 【第8項】[Item 8] 如申請專利範圍第6項所述之多站式磨料流動拋光加工裝置,其中該些下模套之至少一者容置一工件,該分段拋光治具與該工件之表面間之間隙不同。The multi-station abrasive flow polishing apparatus according to claim 6, wherein at least one of the lower mold sleeves houses a workpiece, and the gap between the segment polishing fixture and the surface of the workpiece is different. 【第9項】[Item 9] 如申請專利範圍第1項所述之多站式磨料流動拋光加工裝置,其中該些上模單元係呈環狀排列或線性排列,該些下模單元分別對應該些上模單元,該些下模單元係呈環狀排列或直線排列。The multi-station abrasive flow polishing apparatus according to claim 1, wherein the upper mold units are arranged in a ring shape or in a linear arrangement, and the lower mold units respectively correspond to the upper mold units, and the lower mold units respectively The modular units are arranged in a ring shape or in a straight line. 【第10項】[Item 10] 如申請專利範圍第1項所述之多站式磨料流動拋光加工裝置,其中該磨料流動驅動模組係包含:
二磨料缸,其分別與該些上模單元及該些下模單元連通,並分別容置一磨料;以及
二推料桿,其分別設置於該二磨料缸。
The multi-station abrasive flow polishing apparatus according to claim 1, wherein the abrasive flow driving module comprises:
The two abrasive cylinders are respectively connected to the upper mold unit and the lower mold units, and respectively accommodate an abrasive; and two push rods are respectively disposed on the two abrasive cylinders.
TW104113327A 2015-04-24 2015-04-24 Multi-station abrasive flow polishing device TWI615237B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109732494A (en) * 2019-01-07 2019-05-10 南京航空航天大学 A kind of Special shaped Waveguide Pipes abrasive flows skin processing special fixture
TWI753725B (en) * 2020-12-28 2022-01-21 國圓五金股份有限公司 Servo-driven polishing equipment and servo-driven polishing method

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* Cited by examiner, † Cited by third party
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US6306011B1 (en) * 1998-05-11 2001-10-23 Dynetics Corporation System for controlling the size and surface geometry of an orifice
CN202622544U (en) * 2012-05-04 2012-12-26 太仓市弧螺机电有限公司 Extruding, grinding and polishing device
CN204123247U (en) * 2014-05-30 2015-01-28 浙江海洋学院 A kind of screw polishing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109732494A (en) * 2019-01-07 2019-05-10 南京航空航天大学 A kind of Special shaped Waveguide Pipes abrasive flows skin processing special fixture
TWI753725B (en) * 2020-12-28 2022-01-21 國圓五金股份有限公司 Servo-driven polishing equipment and servo-driven polishing method

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