TW201631851A - Electrical connector and method of making the same - Google Patents

Abstract

The present invention relates to an electrical connector and method of making the same. The electrical connector includes an internal circuit board, a shield member and a contact assembly. The internal circuit board is provided with a number of first metal pads on at least one side surface thereof and a number of conductive lines connected with the first metal pads. The first metal pads are exposed in the air. The shield member has a first shield unit covering said side surface of the first internal circuit board. The contact assembly electrically connects the internal circuit board and a mother board.

Description

Electrical connector and preparation method thereof 【0001】

The invention relates to an electrical connector and a preparation method thereof, in particular to an electrical connector with simple manufacturing process and a preparation method thereof.

【0002】

At the end of 2008, the USB Association released the USB standard version 3.0. This USB 3.0 connector is based on the conventional USB 2.0 connector. Two pairs of differential signal terminals and one ground terminal are added to enhance the original. There is a USB connector transfer rate. The USB 3.0 connector has a signal transmission rate of 5G per second and can be plugged into both USB 2.0 and USB 3.0 docking connectors. However, with the development of the electronics industry, even the transmission rate of the USB 3.0 connector is gradually unable to meet the needs of consumers. In 2014, the USB Association released the C version of the USB standard, which can be used for forward and reverse plug-in, and the signal transmission rate and shielding effect have been improved accordingly. However, the overall structure of the USB connector is complicated, and the process and installation are troublesome.

[0003]

In view of this, it is necessary to further improve the conventional electrical connector and its preparation method to solve the above problems.

[0004]

The object of the present invention is to provide an electrical connector with simple process and good signal transmission effect and a preparation method thereof.

[0005]

In order to achieve the above object, the present invention relates to an electrical connector mounted on a mother circuit board, comprising: a built-in circuit board, the front end of at least one side of the built-in circuit board forming a plurality of first gold fingers exposed to the air medium, And forming, on the built-in circuit board, a plurality of conductive lines correspondingly connected to the first gold finger; and a signal shielding unit used in cooperation with the built-in circuit board, the signal shielding unit includes a partial coverage of the built-in circuit a first shielding portion on at least one side of the board; and a pin combination coupled to the built-in circuit board and for electrically connecting the built-in circuit board to the mother circuit board.

[0006]

As a further improvement of the present invention, the first gold finger and the conductive line correspondingly constitute a conductive path, the conductive path includes a ground path, and the built-in circuit board provides a combined space supply behind the first gold finger The first shielding portion is mounted thereon and connected to the ground path.

【0007】

As a further improvement of the present invention, the signal shielding unit further includes a second shielding portion disposed opposite to the first shielding portion, and the first gold finger and the first portion are disposed on the upper and lower sides of the built-in circuit board The gold finger corresponds to the conductive line connected, and the first shielding portion and the second shielding portion respectively cover a part of the upper side surface and a part of the lower side surface of the built-in circuit board.

[0008]

As a further improvement of the present invention, the first gold finger and the conductive line respectively constitute a conductive path, and the conductive paths in the lower and lower sides of the built-in circuit board each include a ground path, and the built-in circuit board is on the first gold A combined space is provided behind the finger for the first shielding portion and the second shielding portion to be mounted thereon and connected to the ground path.

【0009】

As a further improvement of the present invention, the first shielding portion is disposed separately from the second shielding portion, and the first shielding portion has a cover covering the upper surface of the upper surface of the built-in circuit board and is bent downward from both sides of the upper cover portion An extended grounding leg, the grounding leg is soldered to the mother circuit board, and the second shielding portion has a covering portion covering a lower surface of the lower side surface of the built-in circuit board and a positioning convex portion extending outward from both sides of the lower covering portion, The upper side of the grounding leg is provided with a notch that is engaged with the positioning convex portion.

[0010]

As a further improvement of the present invention, the first shielding portion and the second shielding portion are integrally formed and sleeved behind the first gold finger on the built-in circuit board.

[0011]

According to a further improvement of the present invention, the signal shielding unit further includes a third shielding portion, the third shielding portion has a lap portion overlapping the first shielding portion and a ground extending downward from the lap portion The foot is located behind the built-in circuit board for soldering to the mother board.

[0012]

According to a further improvement of the present invention, the built-in circuit board is provided with a plurality of second gold fingers or a plurality of solder holes at a distance from the other end of the first gold finger, and the plurality of second gold fingers or the plurality of solder holes and the first gold finger A corresponding arrangement is provided by a conductive line, the pin combination having a plurality of pins, each of the pins having a connection portion electrically connected to the second gold finger or the soldering hole and a soldering portion soldered to the mother circuit board.

[0013]

As a further improvement of the present invention, the pin combination includes an insulating block that fixes a plurality of the pins.

[0014]

As a further improvement of the present invention, the electrical connector further includes a plastic body injection-molded on a rear side of the built-in circuit board and an outer side of the pin combination, wherein the rear side portion and the side edges of the first shielding portion are covered by the plastic body. The side portion that covers the side of the built-in board is still exposed to the air medium.

[0015]

As a further improvement of the present invention, the built-in circuit board has an upper conductive layer on an upper side, a lower conductive layer on a lower side, and a ground layer formed between the upper conductive layer and the lower conductive layer, the first gold finger And conductive lines are distributed on the upper conductive layer and the lower conductive layer.

[0016]

As a further improvement of the present invention, the conductive path in the conductive layer and the lower conductive layer on the built-in circuit board includes two ground paths on both sides and a complex signal transmission path between the two ground paths; The signal transmission paths in the conductive layer and the lower conductive layer respectively include two pairs of high-frequency signal transmission paths disposed inside the two adjacent ground paths, and two power transmission paths disposed inside the adjacent two pairs of high-frequency signal transmission paths. And four low-frequency signal transmission paths between the two power transmission paths, wherein the signal transmission paths in the upper conductive layer and the lower conductive layer are of the same type and arranged in reverse.

[0017]

As a further improvement of the present invention, the ground layer is provided with a grounded copper foil located between the high frequency signal transmission path and the ground path of the upper conductive layer and the high frequency signal transmission path and the ground path in the lower conductive layer, the built-in circuit board The upper conductive layer and the lower conductive layer communicate the grounding path and the grounding copper foil of the ground layer up and down by electroplating.

[0018]

As a further improvement of the present invention, the ground layer is provided with an intermediate copper foil between the power transmission path in the upper conductive layer and the power transmission path in the lower conductive layer, and the conductive layer and the lower conductive layer on the built-in circuit board The power transmission path and the intermediate copper foil are connected up and down by electroplating.

[0019]

In order to achieve the above object, the present invention also relates to a method of fabricating an electrical connector, comprising: providing a built-in circuit board, at least one side front end of the built-in circuit board forming a plurality of first gold fingers exposed to an air medium, and Forming a plurality of conductive lines correspondingly connected to the first gold finger on the built-in circuit board, the first gold fingers and the conductive lines correspondingly forming a conductive path; providing a socket combination and connecting the socket combination The built-in circuit board for electrically connecting the built-in circuit board to the mother circuit board; at least providing a first shielding portion, and mounting the first shielding portion on the built-in circuit board The first shielding portion at least partially covers the aforementioned at least one side of the built-in circuit board.

[0020]

As a further improvement of the present invention, the first gold finger and the conductive line corresponding to the first gold finger are disposed on the upper and lower sides of the built-in circuit board; the preparation method further includes providing the first Providing a second shielding portion while shielding the portion, and mounting the second shielding portion on the built-in circuit board while the first shielding portion is mounted, and covering the first shielding portion and the second shielding portion respectively a portion of the upper side surface and a portion of the lower side surface of the built-in circuit board.

[0021]

As a further improvement of the present invention, the built-in circuit board has an upper conductive layer on an upper side, a lower conductive layer on a lower side, and a ground layer formed between the upper conductive layer and the lower conductive layer, the first gold finger And conductive lines are distributed on the upper conductive layer and the lower conductive layer; the conductive paths in the conductive layer and the lower conductive layer on the built-in circuit board respectively comprise two ground paths on both sides and between the two ground paths a plurality of signal transmission paths; and the signal transmission paths in the upper conductive layer and the lower conductive layer respectively comprise two pairs of high-frequency signal transmission paths disposed inside the two adjacent ground paths, and two pairs of adjacent high-frequency signal transmission paths The two power transmission paths are disposed and four low-frequency signal transmission paths between the two power transmission paths, and the signal transmission paths in the upper conductive layer and the lower conductive layer are of the same type and arranged in reverse.

[0022]

As a further improvement of the present invention, the ground layer is provided with a ground copper foil located between the high-frequency signal transmission path and the ground path of the upper conductive layer and the high-frequency signal transmission path and the ground path of the lower conductive layer, and is located in the upper conductive layer. An intermediate copper foil between the power transmission path and the power transmission path in the lower conductive layer, and the conductive layer and the lower conductive layer on the built-in circuit board connect the grounding path and the grounding copper foil of the ground layer up and down by the plating filling hole, and simultaneously The power transmission path and the intermediate copper foil are connected up and down by electroplating.

[0023]

As a further improvement of the present invention, the preparation method further comprises positioning a built-in circuit board mounted with the signal shielding unit and the socket assembly into an injection mold, and molding a plastic body on the outer side of the rear side of the built-in circuit board and the pin combination. At least part of the rear side of the first shielding portion and the two side edges are covered by the plastic body, and other portions covering the side of the built-in circuit board are still exposed in the air medium.

[0024]

As a further improvement of the present invention, wherein the rear side of the first shielding portion has an exposed portion exposed to the top of the plastic body, the preparation method further includes providing a third shielding portion and covering the third shielding portion on the rear side of the plastic body At the same time, the third shielding portion is overlapped with the exposed portion of the first shielding portion; the third shielding portion has a lap portion overlapping the exposed portion and a grounding leg extending downward from the lap portion, The grounding feet are located behind the built-in board for soldering to the motherboard.

[0025]

The invention provides a built-in circuit board inside the electrical connector, thereby eliminating the embedded forming arrangement of the central grounding piece and the insulating body in the middle of the conventional USB connector, simplifying the structure and process of the electrical connector, and reducing the production cost and Signal transmission is good. In addition, the electrical connector of the present invention can shield the external messy signal by the signal shielding unit covering the surface of the built-in circuit board, thereby ensuring the high-frequency signal transmission effect of the electrical connector of the present invention. Moreover, the electrical connector of the present invention does not have a large outer casing around the front end of the built-in circuit board, so that the customer has more application possibilities in the space utilization of the device.

[0049]

100‧‧‧Electrical connector
1‧‧‧ Built-in board
10‧‧‧ conductive path
101‧‧‧ Grounding path
102‧‧‧Power transmission path
11‧‧‧First Golden Finger
121‧‧‧second golden finger
122‧‧‧ welding holes
13‧‧‧Upper conductive layer
14‧‧‧lower conductive layer
15‧‧‧ Grounding layer
151‧‧‧Ground copper foil
152‧‧‧Intermediate copper foil
19‧‧‧Lock groove
2‧‧‧Signal Shading Unit
21‧‧‧First shaded part
22‧‧‧second shaded part
23‧‧‧The third shaded part
211‧‧‧Upper cover
2111‧‧‧ Guide surface
2112‧‧‧Depression
2121‧‧‧ gap
2122‧‧‧ Notch
212, 234‧‧‧ Grounding feet
213‧‧‧Exposed Department
221‧‧‧ under the cover
222‧‧‧ positioning convex
231‧‧‧ lap joint
232‧‧‧ Holding Department
2321‧‧‧ holding hole
233‧‧‧Back cover
3‧‧‧ Pin combination
31‧‧‧ pins
311‧‧‧Connecting Department
312‧‧‧Weld Department
32‧‧‧Insulation block
4‧‧‧Plastic body
41‧‧‧ base
42‧‧‧ front side
411‧‧‧ docking surface
412‧‧‧ Positioning block

[0026]

The first figure is a perspective view of a preferred embodiment of the electrical connector of the present invention.
The second figure is a partially exploded view of the electrical connector of the present invention with the back cover separated.
The third figure is a partially exploded view of another angle of the electrical connector shown in the second figure.
The fourth figure is a partially exploded schematic view of the electrical connector shown in the first figure, showing the distribution of the first shielding portion and the second shielding portion on the built-in circuit board.
The fifth figure is a partially exploded view of another angle of the electrical connector shown in the fourth figure.
The sixth figure is an exploded perspective view of the electrical connector shown in the first figure.
Figure 7 is an exploded perspective view of another angle of the electrical connector shown in Figure 6.
The eighth figure is an exploded view of the built-in circuit board in the electrical connector of the present invention, showing the structural arrangement of the built-in circuit board.

[0027]

Referring to FIG. 1 to FIG. 8 , a preferred embodiment of the electrical connector 100 of the present invention is shown. The electrical connector 100 can be mounted on a mother circuit board and includes a built-in circuit board 1 and a built-in circuit. a signal shielding unit 2 for use with the board 1 is connected to the built-in circuit board 1 and is used for electrically connecting the built-in circuit board 1 to the pin combination 3 on the mother circuit board, and is injection molded on the built-in circuit board 1 The plastic body 4 on the outer side of the rear side and the pin combination 3.

[0028]

The front end of at least one side of the built-in circuit board 1 forms a plurality of first gold fingers 11 exposed to the air medium, and is formed on the built-in circuit board 1 as shown in the fourth to eighth figures. There are a plurality of conductive lines (not shown) that are connected to the first gold finger 11. The plurality of first gold fingers 11 and the conductive lines correspond to form a plurality of conductive paths 10. The conductive path 10 includes a ground path 101. Corresponding to the arrangement of the built-in circuit board 1 , the signal shielding unit 2 includes at least a first shielding portion 21 partially covering at least one side of the built-in circuit board 1 . The built-in circuit board 1 is provided with a combined space behind the first gold finger 11 for the first shielding portion 21 to be mounted thereon and connected to the ground path 101.

[0029]

In the embodiment, the electrical connector 100 is configured as a USB Type-C socket connector, so that the first gold finger 11 and the first gold finger 11 are disposed on the upper and lower sides of the built-in circuit board 1 . Correspondingly connected to the conductive line, that is, the conductive path 10; in addition, the built-in circuit board 1 is provided with a tongue of a front end of the first gold finger 11 and a standard USB Type-C socket connector (not shown) The front end of the chip is the same size for easy connection to a standard USB Type-C plug connector (not shown). Moreover, the two sides of the built-in circuit board 1 are respectively recessed with a locking groove 19 for locking with the mating connector.

[0030]

Specifically, in the present embodiment, the built-in circuit board 1 is disposed to have an upper conductive layer 13 on the upper side, a lower conductive layer 14 on the lower side, and a connection formed between the upper conductive layer 13 and the lower conductive layer 14. Formation 15. The first gold finger 11 and the conductive line are distributed on the upper conductive layer 13 and the lower conductive layer 14. The conductive path 10 in the conductive layer 13 and the lower conductive layer 14 on the built-in circuit board 1 includes two ground paths 101 on both sides and a plurality of signal transmission paths between the two ground paths 101; The signal transmission paths in the upper conductive layer 13 and the lower conductive layer 14 respectively include two pairs of high-frequency signal transmission paths disposed inside the two adjacent ground paths 101, and are disposed inside the adjacent two pairs of high-frequency signal transmission paths. Two power transmission paths 102 and four low frequency signal transmission paths between the two power transmission paths 102. Corresponding to the signal transmission layout of the USB Type-C socket connector, in the electrical connector 100 of the present invention, the signal transmission paths in the conductive layer 13 and the lower conductive layer 14 on the built-in circuit board 1 are of the same type and arranged in reverse. .

[0031]

In addition, in the embodiment, the ground layer 15 is provided with a ground copper foil 151 located between the high-frequency signal transmission path and the ground path 101 of the upper conductive layer 13 and the high-frequency signal transmission path and the ground path 101 in the lower conductive layer 14. . The ground copper foil 151 can effectively prevent crosstalk from occurring on the upper and lower high frequency signal transmission paths. At the same time, the side edge of the grounding copper foil 151 is exposed in the latching groove 19, so that when the electrical connector 100 of the present invention is connected with the mating connector, the grounding copper foil 151 can simultaneously connect the latch of the mating connector. Shrapnel to further improve grounding and signal shielding.

[0032]

Moreover, the conductive layer 13 and the lower conductive layer 14 on the built-in circuit board 1 further connect the grounding path 101 and the grounding copper foil 151 of the ground layer 15 up and down by electroplating and filling holes, thereby increasing the grounding effect, thereby further The grounding and shielding effect of the inventive electrical connector 100 is further enhanced.

[0033]

In addition, the ground layer 15 is further provided with an intermediate copper foil 152 between the power transmission path 102 in the upper conductive layer 13 and the power transmission path 102 in the lower conductive layer 14, the conductive layer 13 above the built-in circuit board 1 and The lower conductive layer 14 connects the power transmission path 102 and the intermediate copper foil 152 up and down by electroplating and filling holes, thereby connecting the power transmission path 102 of the upper conductive layer 13 and the lower conductive layer 14 and the intermediate copper foil 152 in parallel to reduce the resistance. The value, in turn, allows the electrical connector 100 of the present invention to carry large currents.

[0034]

Referring to the third to eighth figures, the pin combination 3 is fixed to the lower side of the rear side of the built-in circuit board 1. In order to facilitate the electrical connection of the pin assembly 3 and the built-in circuit board 1 , the built-in circuit board 1 is provided with a plurality of second gold fingers 121 or a plurality of solder holes 122 away from the other end edge of the first gold finger 11 . The plurality of second gold fingers 121 or the plurality of solder holes 122 are disposed in one-to-one correspondence with the first gold fingers 11 and are connected by a conductive line.

[0035]

In the present embodiment, in order to facilitate soldering, the built-in circuit board 1 is provided with a plurality of second gold fingers 121 corresponding to the first gold fingers 11 on the rear side of the lower conductive layer 14. A plurality of solder holes 122 corresponding to the first gold fingers 11 on the upper conductive layer 14 are disposed above and below the entire rear end of the built-in circuit board 1. The second gold finger 121 and the welding hole 122 are spaced apart in the front-rear direction.

[0036]

The pin combination 3 has a plurality of pins 31 and an insulating block 32 that fixes the plurality of pins 31. In the embodiment, the pins 31 are embedded in the insulating block 32. Moreover, the pins 31 are disposed in two groups for electrically connecting to the conductive paths 10 of the upper conductive layer 13 and the lower conductive layer 14 in the built-in circuit board 1.

[0037]

Each of the pins 31 has a connection portion 311 extending from the top of the insulating block 32 and a solder portion 312 for soldering to the mother board. Wherein, the set of pins 31 are electrically connected to the conductive path 10 of the lower conductive layer 14; and the connecting portion 311 of the set of pins 31 is disposed in parallel with the built-in circuit board 1 to be surface soldered and the second gold The finger 121 is soldered. In addition, the soldering portion 312 of the set of pins 31 extends vertically to the built-in circuit board 1 to be soldered to the mother board in a socket soldering manner, thereby facilitating the electrical connector 100 of the present invention on the mother board. Positioning on. Moreover, the other set of pins 31 electrically connected to the conductive path 10 of the upper conductive layer 13 are disposed rearward, and the connecting portion 311 of the set of pins 31 is vertically disposed in the built-in circuit board 1 and is used for penetrating into the soldering hole 122. The soldering portion 312 of the set of pins 31 extends parallel to the built-in circuit board 1 to be surface soldered to the mother board.

[0038]

As shown in the first to seventh embodiments, the signal shielding unit 2 in the present embodiment further includes a second shielding portion 22 disposed opposite to the first shielding portion 21. The first shielding portion 21 and the second shielding portion 22 respectively cover a part of the upper side surface and a part of the lower side surface of the built-in circuit board 1, and are respectively in the conductive layer 13 and the lower conductive layer 14 above the built-in circuit board 1. The grounding path 101 is in contact with each other, so that the electrical connector 100 of the present invention can shield the messy signals on the upper and lower sides of the built-in circuit board 1 by the first shielding portion 21 and the second shielding portion 22, thereby ensuring high-frequency signal transmission. In addition, in order to prevent the first shielding portion 21 and the second shielding portion 22 from contacting other signal paths on the built-in circuit board 1, the built-in circuit board 1 is shielded by the first shielding portion 21 and the second shielding layer in the foregoing other signal paths. An outer portion of the portion covered by the portion 22 is also provided with an insulating cover, which is an insulating varnish.

[0039]

Specifically, in the embodiment, the first shielding portion 21 and the second shielding portion 22 are separately provided. The first shielding portion 21 has a covering portion 211 covering a portion of the upper side surface of the built-in circuit board 1, and a grounding leg 212 extending downward from both sides of the upper covering portion 211, and the back side of the upper covering portion 211 is first The rearward extension is further extended to expose the exposed portion 213 on the outer side of the plastic body 4. The grounding leg 212 is for soldering to the mother circuit board.

[0040]

The front end of the upper cover portion 211 is formed with a guiding surface 2111 extending obliquely from the top surface thereof toward the upper surface of the built-in circuit board 1 to facilitate the insertion of the mating connector and prevent the abutment of the spring in the top span docking connector (not shown). Show). In addition, the two sides of the upper cover portion 211 are respectively provided with a recessed portion 2112 for inserting the plastic body 4 into the recessed portion 2112 during injection molding to ensure the fixing effect of the first shielding portion 21. A notch 2121 is defined in a portion of the upper side of the grounding leg 212 and the second shielding portion 22 corresponding to the horizontal direction. Moreover, the grounding legs 212 on both sides of the first shielding portion 21 are respectively disposed in pairs in the front-rear direction, and a notch 2122 is respectively disposed on the rear side edge of the lower side of each of the grounding legs 212 to facilitate solder integration. Stable soldering is achieved with the mother board.

[0041]

The second shielding portion 22 has a cover portion 221 covering a lower surface of the lower surface of the built-in circuit board 1 and a positioning convex portion 222 extending outward from both sides of the lower cover portion 221 . The positioning protrusion 222 is buckled and positioned in the notch 2121 . In the above embodiment, the first shielding portion 21 and the second shielding portion 22 are separately disposed, and are positioned by the positioning convex portion 222 and the notch 2121; indeed, as another preferred embodiment of the present invention, The first shielding portion 21 and the second shielding portion 22 may also be integrally formed and sleeved on the built-in circuit board 1 behind the first gold finger 11 .

[0042]

The plastic body 4 is formed on the periphery of the built-in circuit board 1 and the pin combination 3 after the first shielding portion 21 and the second shielding portion 22 are mounted on the built-in circuit board 1. The plastic body 4 has a base portion 41 disposed on a rear side of the first shielding portion 21, a rear side of the second shielding portion 22, and a periphery of the pin combination 3, and a front side of the first shielding portion 21 and a front side of the second shielding portion 22. Front side portion 42 of both side edges. The front side surface of the base portion 41 is formed as an abutting surface 411 that abuts the butt connector. A positioning block 412 protruding outward is formed on both sides of the base portion 41.

[0043]

The first shielding portion 21 and the second shielding portion 22 cover the upper side surface and the lower side surface of the built-in circuit board 1 and the front side portion is still exposed to the air medium. In addition, the exposed portion 213 of the first shielding portion 21 is exposed on the top surface of the base portion 41.

[0044]

In the embodiment, the signal shielding unit 2 further includes a third shielding portion 23. The third shielding portion 23 has a lap portion 231 that overlaps with the first shielding portion 21, a holding portion 232 that is bent downward from the outer edge of the lap portion 231, and is bent downward from the rear end of the lap portion 231. The extended rear cover portion 233 and the grounding leg 234 extending downward from the rear cover portion 233. The overlapping portion 231 abuts against the exposed portion 213 of the first shielding portion 21 . The holding portion 232 is provided with a holding hole 2321 that is fastened to the positioning block 412 on the plastic body 4 . The rear cover portion 233 covers the rear side of the plastic body 4 to shield the messy signal on the rear side of the electrical connector 100 of the present invention. The grounding leg 234 is located behind the built-in circuit board 1 for soldering to the mother board.

[0045]

As can be seen from the above, the present invention also relates to a method of fabricating an electrical connector 100, comprising at least: first, providing the built-in circuit board 1; secondly, providing the socket assembly 3 and connecting the socket assembly 3 to The built-in circuit board 1 is for electrically connecting the built-in circuit board 1 to the mother circuit board; again, at least a first shielding portion 21 is provided, and the first shielding portion 21 is mounted on the The first shielding portion 21 is at least partially covered on the at least one side surface of the built-in circuit board 1 on the built-in circuit board 1.

[0046]

In addition, in the embodiment, the preparation method further includes: providing the second shielding portion 22 while providing the first shielding portion 21, and simultaneously installing the second shielding portion 22 while installing the first shielding portion 21. Also mounted on the built-in circuit board 1 and covering the first shielding portion 21 and the second shielding portion 22 to a portion of the upper side surface and a portion of the lower side surface of the built-in circuit board 1, respectively; then, signal shielding is installed The built-in circuit board 1 of the unit 2 and the socket combination 3 is positioned in an injection mold (not shown), and a plastic body 4 is injection molded on the outer side of the built-in circuit board 1 and the pin combination 3, the first shielding portion 21 At least a portion and both side edges of the rear side are covered by the plastic body 4, and the side portion is still exposed to the air medium before the side surface of the built-in circuit board 1; finally, the third shielding portion 23 is provided, and the third shielding portion is provided 23 is covered on the rear side of the plastic body 4, and the third shielding portion 23 is overlapped on the exposed portion 213 of the first shielding portion 21.

[0047]

In summary, the present invention utilizes the built-in circuit board 1 inside the electrical connector 100, thereby eliminating the need for the embedded formation of the central grounding strip and the insulating body in the middle of the conventional USB connector, simplifying the electrical connector 100. Structure and process, reducing production costs and good signal transmission. In addition, the electrical connector 100 of the present invention can shield the external signal by the signal shielding unit 2 covering the surface of the built-in circuit board 1 to ensure the high-frequency signal transmission effect of the electrical connector 100 of the present invention. Moreover, the electrical connector 100 of the present invention does not surround the outer periphery of the front end of the built-in circuit board 1, so that the customer has more application possibilities in the space utilization of the device.

[0048]

It is to be understood that the equivalents of the invention are intended to be included within the scope of the invention as claimed.

100‧‧‧Electrical connector

1‧‧‧ Built-in board

11‧‧‧First Golden Finger

2‧‧‧Signal Shading Unit

21‧‧‧First shaded part

4‧‧‧Plastic body

Claims (20)

[Item 1] An electrical connector mounted on a motherboard, comprising:
a built-in circuit board, the front end of the at least one side of the built-in circuit board forming a plurality of first gold fingers exposed to the air medium, and forming a plurality of conductive lines corresponding to the first gold finger on the built-in circuit board;
a signal shielding unit for use with the built-in circuit board, the signal shielding unit includes a first shielding portion partially covering at least one side of the built-in circuit board; and a pin combination connected to the built-in circuit board and used for The built-in circuit board is electrically connected to the mother circuit board. [Item 2] The electrical connector of claim 1, wherein the first gold finger and the conductive line respectively constitute a conductive path, the conductive path includes a ground path, and the built-in circuit board is behind the first gold finger The square provides a combined space for the first shield portion to be mounted thereto and connected to the ground path. [Item 3] The electrical connector of claim 1, wherein the signal shielding unit further includes a second shielding portion disposed opposite to the first shielding portion, wherein the upper and lower sides of the built-in circuit board are provided with the a gold finger and the conductive line correspondingly connected to the first gold finger, the first shielding portion and the second shielding portion respectively covering a part of the upper side surface and a part of the lower side surface of the built-in circuit board. [Item 4] The electrical connector of claim 3, wherein the first gold finger and the conductive line respectively form a conductive path, and the conductive paths in the lower and lower sides of the built-in circuit board each include a ground path, the built-in A circuit board provides a combined space behind the first gold finger for the first shielding portion and the second shielding portion to be mounted thereon and connected to the ground path. [Item 5] The electrical connector of claim 3, wherein the first shielding portion is disposed separately from the second shielding portion, and the first shielding portion has a cover covering the upper surface of the upper surface of the built-in circuit board and the self-covering a grounding leg extending downwardly on both sides of the portion, the grounding leg is soldered to the mother circuit board, and the second shielding portion has a cover portion covering the lower surface of the lower surface of the built-in circuit board and a side surface from the lower cover portion The positioning protrusion is extended outward, and the upper side of the grounding leg is provided with a notch that is engaged with the positioning protrusion. [Item 6] The electrical connector of claim 3, wherein the first shielding portion and the second shielding portion are integrally formed and disposed behind the first gold finger on the built-in circuit board. [Item 7] The electrical connector of claim 1 or 3, wherein the signal shielding unit further includes a third shielding portion, the third shielding portion having a lap jointing with the first shielding portion and The grounding leg extends downward from the lap portion, and the grounding leg is located behind the built-in circuit board for soldering to the mother circuit board. [Item 8] The electrical connector of claim 1, wherein the built-in circuit board is provided with a plurality of second gold fingers or a plurality of soldering holes, and a plurality of second gold fingers or a plurality of soldering holes away from the other end edge of the first gold finger. The holes are disposed in one-to-one correspondence with the first gold fingers, and are connected by a conductive line, the pin combination has a plurality of pins, each of the pins has a connection portion electrically connected to the second gold finger or the welding hole and is soldered to the female circuit The welded part on the board. [Item 9] The electrical connector of claim 8, wherein the pin combination comprises an insulating block that secures a plurality of the pins. [Item 10] The electrical connector of claim 1, wherein the electrical connector further comprises a plastic body injection molded on a rear side of the built-in circuit board and an outer side of the pin combination, the rear side portion and the two sides of the first shielding portion The edge is covered by the plastic body, and the side portion of the side of the built-in circuit board is still exposed to the air medium. [Item 11] The electrical connector of claim 3, wherein the built-in circuit board has an upper conductive layer on an upper side, a lower conductive layer on a lower side, and a ground layer formed between the upper conductive layer and the lower conductive layer. The first gold finger and the conductive line are distributed on the upper conductive layer and the lower conductive layer. [Item 12] The electrical connector of claim 11, wherein the conductive path in the conductive layer and the lower conductive layer on the built-in circuit board comprises two ground paths on both sides and between the two ground paths a plurality of signal transmission paths; and the signal transmission paths in the upper conductive layer and the lower conductive layer respectively comprise two pairs of high-frequency signal transmission paths disposed inside the two adjacent ground paths, and two pairs of adjacent high-frequency signal transmission paths The two power transmission paths are disposed and four low-frequency signal transmission paths between the two power transmission paths, and the signal transmission paths in the upper conductive layer and the lower conductive layer are of the same type and arranged in reverse. [Item 13] The electrical connector of claim 12, wherein the ground layer is provided with a ground copper between the high frequency signal transmission path and the ground path in the upper conductive layer and the high frequency signal transmission path and the ground path in the lower conductive layer The foil, the conductive layer and the lower conductive layer on the built-in circuit board connect the grounding path and the grounding copper foil of the grounding layer up and down by using a plating hole. [Item 14] The electrical connector of claim 12, wherein the ground layer is provided with an intermediate copper foil between the power transmission path in the upper conductive layer and the power transmission path in the lower conductive layer, the built-in circuit board The upper conductive layer and the lower conductive layer communicate the power transmission path and the intermediate copper foil up and down by electroplating. [Item 15] A method of manufacturing an electrical connector according to claim 1 or 2, comprising:
Providing a built-in circuit board, the front end of at least one side of the built-in circuit board forming a plurality of first gold fingers exposed to the air medium, and forming a plurality of corresponding numbers connected to the first gold finger on the built-in circuit board a conductive line, the first gold finger and the conductive line corresponding to form a conductive path;
Providing a socket assembly and connecting the socket assembly to the built-in circuit board for electrically connecting the built-in circuit board to the mother circuit board;
Providing at least a first shielding portion, and mounting the first shielding portion on the built-in circuit board such that the first shielding portion at least partially covers the at least one side surface of the built-in circuit board. [Item 16] The method of manufacturing the electrical connector of claim 15, wherein the first gold finger and the conductive line corresponding to the first gold finger are disposed on the upper and lower sides of the built-in circuit board; The preparation method further includes providing a second shielding portion while providing the first shielding portion, and mounting the second shielding portion on the built-in circuit board while installing the first shielding portion, and A shielding portion and a second shielding portion respectively cover a portion of the upper side surface and a portion of the lower side surface of the built-in circuit board. [Item 17] The method of manufacturing the electrical connector of claim 16, wherein the built-in circuit board has an upper conductive layer on an upper side, a lower conductive layer on a lower side, and is formed between the upper conductive layer and the lower conductive layer. a grounding layer, the first gold finger and the conductive line are distributed on the upper conductive layer and the lower conductive layer; the conductive paths in the conductive layer and the lower conductive layer on the built-in circuit board respectively comprise two grounds on both sides a path and a plurality of signal transmission paths between the two ground paths; and the signal transmission paths in the upper conductive layer and the lower conductive layer respectively comprise two pairs of high-frequency signal transmission paths disposed inside the two adjacent ground paths, Two power transmission paths disposed inside the two adjacent pairs of high-frequency signal transmission paths and four low-frequency signal transmission paths between the two power transmission paths, wherein the signal transmission paths in the upper conductive layer and the lower conductive layer are of the same type and Reverse arrangement. [Item 18] The method of manufacturing the electrical connector of claim 17, wherein the ground layer is disposed between the high frequency signal transmission path and the ground path in the upper conductive layer and the high frequency signal transmission path and the ground path in the lower conductive layer. a grounding copper foil, an intermediate copper foil between the power transmission path of the upper conductive layer and the power transmission path of the lower conductive layer, the conductive layer and the lower conductive layer above the built-in circuit board are grounded by the plating hole and The grounding copper foil of the grounding layer is connected up and down, and the power transmission path and the intermediate copper foil are connected up and down by the plating filling hole. [Item 19] The method of manufacturing the electrical connector of claim 15, wherein the manufacturing method further comprises positioning a built-in circuit board mounted with the signal shielding unit and the socket assembly into an injection mold, and after the built-in circuit board The plastic body is injection molded on the outside of the side and the pin combination. At least part of the rear side of the first shielding portion and the two side edges are covered by the plastic body, and other portions covering the side of the built-in circuit board are still exposed in the air medium. [Item 20] The method of manufacturing the electrical connector of claim 19, wherein the rear side of the first shielding portion has an exposed portion exposed to the top of the plastic body, the preparation method further comprising providing a third shielding portion, and The third shielding portion covers the rear side of the plastic body, and the third shielding portion is overlapped with the exposed portion of the first shielding portion; the third shielding portion has a lap portion overlapping with the exposed portion and the self-lap portion The grounding leg is bent and extended, and the grounding leg is located behind the built-in circuit board for soldering to the mother circuit board.