TW201629274A - Conductive device for electroplating holder - Google Patents

Abstract

The present invention discloses a conductive device for electroplating holder, which is installed onto the clamp to be used to transmit the current for each clamp claw, and which includes the conducting fixing plate and a plurality of mobile conductive copper blocks. The mentioned mobile conductive copper blocks are disposed onto the lower end face of the conducting fixing plate and is "L" shape including the first connection part and the second connection part. The connection location of the first and second connection part is disposed with a certain radian. The upper end of the mentioned first connection part is fixed and connected with the lower end of the conducting fixing plate, while the end portion of the mentioned second connection part is connected with the lower end of the conducting fixing plate by means of a spring. The present invention is simple and reasonable in the structure to design the mobile conductive copper blocks into the "L" shape, and provided with the spring in between the mobile conductive copper block and the conducting fixing plate. By means of the acting force of spring, the stable contact between the mobile conductive copper block and the contact surface of the cathode power-supply copper plate can be assured to further assure the current stability of the clamp claw, which enhances the quality of electroplated circuit board and also enhances the electroplating yield and work efficiency.

Description

Electroplating fixture conductive device

The present invention relates to a conductive device, and more particularly to a plating fixture conductive device that can stabilize the current to which the jaws of the clamp are shunted during the plating operation, thereby improving the efficiency of plating productivity.

A typical circuit board plating apparatus generally includes a jig 1 provided with jaws for holding a workpiece to be processed, and current distribution on the jaws is realized by a conductive plate 6. A conductive seat 5 is mounted on the conventional conductive plate 6, as shown in FIG. 1-3, the conduction of the jaws is conducted by the conductive seat 5, and the conductive seat is electrically conductive by contacting the anode-powered copper plate 4 through the entire surface. Since the effective conductive contact surface is only point contact or line contact during the actual transmission process, even because the clamp body does not smoothly float during the moving process, the power is disconnected, which may cause the currents shunted by the jaws to be inconsistent, thereby affecting the plating circuit board. The quality of the product is difficult to increase due to the limited current flow.

In view of this, there is an urgent need in the industry for a plating fixture conductive device that can ensure the quality of an electroplated circuit board while improving the efficiency of plating productivity.

In order to solve the above-mentioned shortcomings in the prior art, it is an object of the present invention to provide a plating fixture conductive device that can divert the jaws of the clamp to the electricity during the plating operation. The flow is stable, improving the quality of the electroplated circuit board, and improving the plating capacity and work efficiency.

In order to achieve the above object, the technical solution adopted by the present invention is: a plating fixture conductive device mounted on a fixture for transmitting current to each jaw, the plating fixture conductive device comprising a conductive fixing plate and a plurality of movable conductive copper blocks, The movable conductive copper block is mounted on a lower end surface of the conductive fixing plate, and the movable copper conductive block is in a "∟" shape, and includes a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion The joint is provided with a certain arc, the first joint is provided with a certain arc to ensure the movable range of the movable conductive copper block, and the second joint is provided with a certain arc to ensure the between the movable conductive copper block and the cathode power supply copper plate. The upper end of the first connecting portion is fixedly connected to the lower end surface of the conductive fixing plate, and the end portion of the second connecting portion is connected to the lower end surface of the conductive fixing plate by a spring.

As one of the preferred embodiments of the present invention, a copper conductive sheet is further disposed between the movable copper conductive block and the upper end surface of the conductive fixing plate.

More preferably, the copper conductive sheet is disposed on one side of the movable copper conductive block and the conductive fixing plate.

Further, a lower end surface of the second connecting portion is in contact with a transmission portion in the plating fixture, and the transmission portion is in electrical communication with the clamping jaw.

Further, the movable conductive copper block has a one-to-one correspondence with the jaws in the clamp.

Preferably, the copper conductive sheet is connected with a wire, and is electrically connected to each of the clamps in the clamp for powering on.

Preferably, the conductive copper block is integrally formed.

More preferably, the movable conductive copper block and the conductive fixing plate are connected by a rotating shaft.

Compared with the prior art, the beneficial effects of the present invention are: The structure of the invention is simple and reasonable, and the movable copper conductive block is designed as a "∟" shape, and a spring is arranged between the movable copper conductive block and the conductive fixed plate, and the contact between the movable conductive copper block and the cathode power supply copper plate is ensured by the force of the spring. The stable contact overcomes the problem that the clamp body is powered off due to floating during the moving process, thereby ensuring the stability of the current on the jaws, improving the quality of the plated circuit board, and improving the plating capacity and working efficiency.

1‧‧‧ fixture

2‧‧‧claw

3‧‧‧ Conductive fixing plate

4‧‧‧Anode-powered copper plate

5‧‧‧Electric seat

6‧‧‧ Conductive plate

41‧‧‧Activity conductive copper block

42‧‧‧ Spring

43‧‧‧copper conductive sheet

44‧‧‧ copper wire

41a‧‧‧First connection

41b‧‧‧Second connection

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. 1 is a schematic view of the application structure of the prior art; FIG. 2 is a schematic structural view of a conductive plate in the prior art; FIG. 3 is a schematic structural view of a conductive seat in the prior art; FIG. 5 is a schematic view showing another structure of the electroplating fixture conductive device disclosed in the present invention; FIG. 6 is a schematic structural view of the conductive fixing plate and the movable conductive copper block; FIG. 7 is a schematic view showing the working state of the present invention when applied to the jig; FIG. 8 is a second schematic view showing the working state of the present invention when applied to a jig; and FIG. 9 is a third schematic view showing the working state of the present invention when applied to a jig.

The technical solutions in the embodiments will be specifically, clearly and completely described in the following with reference to the accompanying drawings in the embodiments.

As shown in FIG. 4-5, the electroplating fixture conductive device of the embodiment comprises a conductive fixing plate 3 and a plurality of movable conductive seats, and the movable conductive copper block 41 is mounted on the conductive fixing plate 1 The lower end surface of the movable conductive copper block 41 is "∟" shaped and integrally formed, and includes a first connecting portion 41a and a second connecting portion 41b. The first connecting portion 41a and the second connecting portion 41b are connected. The upper end of the first connecting portion 41a and the lower end surface of the conductive fixing plate 3 are fixedly connected by a rotating shaft, and the end of the second connecting portion 42a is lower than the conductive fixing plate 3 The end surface is connected by a spring 42. The lower end surface of the second connecting portion 42a is in contact with the transmitting portion of the plating jig 1, and the transmitting portion is in electrical communication with the clamping jaw 2, and the conductive seat and the clamping jaw in the clamp 1 In a one-to-one correspondence, each of the conductive seats corresponds to one of the jaws 2 to ensure the stability of the current.

A copper conductive sheet 43 is further disposed between the movable conductive copper block 41 and the upper end surface of the conductive fixing plate 3. The copper conductive sheet 43 is disposed on one side of the movable conductive copper block 41 and the conductive fixing plate 3, and the copper conductive wire 43 is connected with the copper wire 44, and each of the clamping jaws 2 in the clamp 1 is electrically connected. Connected to power on.

In the specific work, because the movable conductive copper block is designed as a "∟" shape, and a spring is disposed between the movable conductive copper block and the conductive fixed plate, the bottom end surface of the second connecting portion of the conductive seat is ensured by the force of the spring. The contact between the faces is smooth, which overcomes the problem that the clamp body is powered off due to floating during the moving process, thereby ensuring the stability of the current on the jaws, improving the quality of the plated circuit board, and improving the plating capacity and work efficiency.

The above specific embodiments are merely illustrative of the technical concept and structural features of the present invention, and are intended to enable those skilled in the art to implement the present invention, but the above description does not limit the scope of the present invention, and is in accordance with the present invention. Any equivalent changes or modifications made by the spirit of the invention are intended to fall within the scope of the invention.

3‧‧‧ Conductive fixing plate

41‧‧‧Activity conductive copper block

43‧‧‧copper conductive sheet

44‧‧‧ copper wire

Claims (8)

A plating fixture conductive device is mounted on the fixture for transmitting current to each jaw, wherein the electroplating fixture conductive device comprises a conductive fixing plate and a plurality of movable conductive copper blocks, wherein the movable conductive copper block is mounted on the conductive fixed The lower end surface of the plate, the movable conductive copper block is " a shape including a first connecting portion and a second connecting portion, wherein the first connecting portion and the second connecting portion are connected at a certain arc, and the upper end of the first connecting portion is fixedly connected to the lower end surface of the conductive fixing plate The end of the second connecting portion is connected to the lower end surface of the conductive fixing plate by a spring. The electroplating jig conductive device according to claim 1, wherein a copper conductive sheet is further disposed between the movable conductive copper block and the upper end surface of the conductive fixing plate. The electroplating jig conductive device according to claim 2, wherein the copper conductive sheet is disposed on one side of the movable conductive copper block and the conductive fixing plate. The electroplating jig conductive device according to claim 1 or 2, wherein the lower end surface of the second connecting portion is in contact with a transfer portion in the plating jig, and the transfer portion is in electrical communication with the jig. The electroplating jig conductive device according to claim 4, wherein the movable conductive copper block is in one-to-one correspondence with the jaws in the jig. The electroplating jig conductive device according to claim 3, wherein the copper conductive sheet is connected with a wire electrically connected to each of the clamps for powering on. The electroplating jig conductive device according to claim 1, wherein the movable conductive copper block is integrally formed. The electroplating jig conductive device according to claim 7, wherein the movable conductive copper block and the conductive fixing plate are connected by a rotating shaft.