TW201628223A - Mounting base for electronic device, method for manufacturing the same and lighting assembly having the same - Google Patents

Abstract

A method for manufacturing a mounting base comprises: providing a base body having an insulating surface; and forming a patterned conductive layer having a circuit pattern and a heat dissipation pattern on the insulating surface. The circuit pattern has a plurality of conductive sections which are disposed in a row and every two adjacent ones of which define a mounting region for mounting an electronic device. The heat dissipation pattern has a heat dissipation portion which covers at least a portion of the insulating surface that is not covered by the circuit pattern, and a plurality of connecting portions which are connected to the heat dissipation portion and each of which extends through the coprresponding one of the mounting regions for thermally connecting with the electronic device that is mounted thereon.

Description

Method for manufacturing electronic component base, product thereof and light-emitting device

The present invention relates to a manufacturing method, and more particularly to a method of manufacturing an electronic component base and an article thereof, and a light-emitting device having the same.

Electronic components that generate heat during normal operation, such as light-emitting diodes, require a good heat dissipation environment to maintain stable operation of electronic components and increase service life.

However, referring to FIG. 1, a prior art electronic component base 9 includes a plastic body 91, and a conductive line 92 is disposed on the surface of the base 91 for electrically connecting the plurality of electronic components 93. Due to the low thermal conductivity of the plastic material, the heat generated by the electronic component 93 is less likely to be conducted and diffused by the plastic body 91 to help dissipate heat.

Accordingly, it is an object of the present invention to provide a method of manufacturing an electronic component pedestal having a surface having a large heat dissipation area.

Accordingly, another object of the present invention is to provide a susceptor for an electronic component having a surface having a large heat dissipation area.

Another object of the present invention is to provide a light-emitting device having the aforementioned susceptor.

Therefore, in some embodiments, the method for manufacturing the electronic component pedestal of the present invention comprises the steps of: providing a body having an insulating surface; and forming a patterned conductive metal layer on the insulating surface. The conductive metal layer has a circuit pattern and a heat dissipation pattern. The circuit pattern has a plurality of spaced apart conductive segments and each of the adjacent conductive segments defines a mounting region for the electronic component. The heat dissipation pattern has a cover. The insulating surface is provided with a heat dissipating portion of at least a portion of the circuit pattern and a plurality of connecting portions respectively passing through the mounting regions and connected to the heat dissipating portion, and the connecting portions are used for the electrons disposed in the corresponding mounting regions The components are thermally connected.

Thus, in some embodiments, the susceptor of the electronic component of the present invention comprises: a body having an insulating surface, and a conductive metal layer. The conductive metal layer is formed on the insulating surface and has a circuit pattern and a heat dissipation pattern. The circuit pattern has a plurality of spaced apart conductive segments and defines a mounting region for the electronic component between each adjacent conductive segment. The heat dissipation pattern has a heat dissipation portion covering the insulation surface except the circuit pattern, and a plurality of connection portions respectively passing through the installation regions and connected to the heat dissipation portion, and the connection portions are configured to correspond to the heat dissipation portion. The electronic components of the mounting area are thermally connected.

Thus, in some embodiments, the illumination device of the present invention is The invention comprises: a body, an activation layer containing a catalytic metal, a conductive metal layer and at least one light emitting diode. The seat body has an insulating surface. The active layer is on the insulating surface. The conductive metal layer is located on the active layer and has a circuit pattern and a heat dissipation pattern. The light-emitting diode has a thermoelectrically separated type of lead frame, the lead frame includes a two-electrode frame body and a heat-dissipating frame body, and each of the electrode frame bodies is electrically connected to the circuit pattern of the conductive metal layer, and the heat-dissipating frame body is thermally connected a heat dissipation pattern to the conductive metal layer.

Thus, in some embodiments, the light-emitting device of the present invention comprises: a body, an active layer containing a catalytic metal, a conductive metal layer, and at least one light-emitting diode. The seat body has an insulating surface. The active layer is on the insulating surface. The conductive metal layer is located on the active layer and has a circuit pattern and a heat dissipation pattern. The light emitting diode has a thermoelectric connection type lead frame, the lead frame includes a large electrode frame body and a small electrode frame body, the large electrode frame body is electrically connected to the circuit pattern of the conductive metal layer and is thermally connected thereto. The heat dissipation pattern of the conductive metal layer is electrically connected only to the circuit pattern of the conductive metal layer.

The effect of the invention is that the heat conduction generated by the electronic component is diffused to the large-area heat dissipation portion by the heat dissipation pattern of the conductive metal layer, thereby increasing the heat dissipation area which can be thermally convected with the outside, and improving the heat dissipation efficiency.

100‧‧‧Electronic component base

1‧‧‧ body

11‧‧‧Insulated surface

2‧‧‧ Conductive metal layer

20‧‧‧metal layer

21‧‧‧ circuit pattern

211‧‧‧Electrical section

212‧‧‧Installation area

22‧‧‧heating pattern

221‧‧‧ Department of heat dissipation

2211‧‧‧Heat block

222‧‧‧Connecting Department

3‧‧‧Active layer

4‧‧‧Electronic components

41‧‧‧ lead frame

411‧‧‧electrode frame

412‧‧‧heating frame

413‧‧‧ Large electrode holder

414‧‧‧Small electrode holder

42‧‧‧ wafer

S1‧‧‧ steps

S2‧‧‧ steps

Other features and advantages of the present invention will be apparent from the detailed description of the embodiments of the present invention. FIG. 1 is a schematic view showing a conductive circuit of a conventional electronic component base; 2 is a block diagram showing the flow of steps of an embodiment of a method for manufacturing an electronic component pedestal of the present invention; FIG. 3 is a schematic view showing a body of the embodiment; FIG. 4 is a schematic flow chart illustrating the embodiment FIG. 5 is a schematic view showing a pattern of the conductive metal layer formed in the embodiment; FIG. 6 is a schematic view showing the article and the electronic component formed by the embodiment. FIG. 7 is a partial enlarged view of FIG. 6 illustrating the connection relationship between the conductive metal layer and the electronic component formed in the embodiment; FIG. 8 is a schematic view showing another conductive metal layer formed in the embodiment. FIG. 9 is a schematic view showing the assembled relationship between another pattern of the conductive metal layer and the electronic component of the embodiment; and FIG. 10 is a partial enlarged view of FIG. 9 illustrating the conduction formed by the embodiment. The connection relationship between the metal layer and the electronic component.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 2 to FIG. 5, the first embodiment of the method for manufacturing the electronic component pedestal of the present invention comprises the following main steps: Step S1: providing a body 1 having an insulating surface 11; Step S2: forming a patterned conductive metal layer 2 on the insulating surface 11, the conductive metal layer 2 having a circuit pattern 21 and a heat dissipation pattern 22.

In the embodiment, the seat body 1 provided in the step S1 is made of a plastic material, and the insulating surface 11 is integrally formed on the seat body 1. Moreover, although the insulating surface 11 is exemplified by a plane in the embodiment, it may be a curved surface or a concave-convex surface. In other embodiments, the base 1 may also include a metal plate (not shown) made of a metal material, and a conventional paint, screen, pad, coating or electrocoating. An insulating layer (not shown) formed on the surface of the metal layer, and the surface of the insulating layer is used as the insulating surface 11, wherein the metal material is, for example, aluminum, and is preferably a good heat conducting material to further improve heat dissipation efficiency. The insulating layer material may be, for example, epoxy.

Referring to FIG. 4, in the embodiment, step S2 includes forming an active layer 3 containing a catalytic metal on the insulating surface 11, and depositing a conductive metal on the active layer 3 by an electroless plating process to form a metal layer 20, and then patterning the metal layer. 20 and the active layer 3, that is, the patterned conductive metal layer 2 is formed. In detail, the active layer 3 contains a catalytic metal selected from the group consisting of palladium (Pd), platinum (Pt), gold (Au), silver (Ag), copper (Cu), and the like, and can be spray-coated, digitally printed, Screen printing, pad printing, transfer, immersion plating or powder coating are formed on the insulating surface 11. After the activation layer 3 is formed, the body 1 is immersed in an electroless plating solution to form a metal layer 20 on the activation layer 3. The material of the metal layer 20 may be copper or nickel. In the present embodiment, the metal layer 20 is formed by electroless plating, but the metal layer 20 may be formed by another plating process such as sputtering or vapor deposition. Work. The method of patterning the metal layer 20 and the active layer 3 may be performed by using a laser to remove a partial region or by using a photolithography etching process. In addition, in other embodiments, when the active layer 3 is formed of, for example, a non-conductive metal oxide without conductive properties, the steps of patterning the metal layer 20 and the active layer 3 may be omitted for the metal layer 20 only. Patterning, for example, removing a portion of the metal layer 20 by laser, the active layer 3 can remain intact without affecting the conductive or insulating requirements of the metal layer 20.

Referring to FIG. 5 and FIG. 6 , the circuit pattern 21 has a plurality of spaced apart conductive segments 211 and each of the adjacent conductive segments 211 defines a mounting region 212 for the electronic component 4 . The heat dissipation pattern 22 has A cover insulating surface 11 is provided with a heat dissipating portion 221 in a region outside the circuit pattern 21 and a plurality of connecting portions 222 respectively connected to the heat dissipating portion 221 through the mounting regions 212, and the connecting portion 222 is disposed in the corresponding mounting region 212. The electronic component 4 is thermally connected. Forming the patterned conductive metal layer 2, the electronic component pedestal 100 is fabricated. It should be noted that, in this example, the heat dissipating portion 221 is exemplified by all the regions except the circuit pattern 21 disposed on the insulating surface 11. However, the present invention is not limited thereto, that is, the heat dissipating portion 221 may cover only the insulating surface. 11 is provided with a partial area other than the circuit pattern 21.

Referring to FIG. 7, in the embodiment, the electronic component 4 is specifically, for example, a light emitting diode, and the present embodiment is suitable for providing a light emitting diode packaged in a thermoelectrically separated type of lead frame 41. That is, the lead frame 41 of the general thermoelectric separation type generally includes two electrode holder bodies 411 and a heat dissipation frame body 412 located between the two electrode frame bodies 411 for mounting the wafers 42. When the electronic component 4 is disposed in the mounting area 212, two of the electronic components 4 The electrode frame body 411 can be electrically connected to the two conductive segments 211 adjacent to the mounting region 212, for example, soldering the electrode frame body 411 and the conductive segment 211 to form an electrical connection, and the heat dissipation frame body 412 can be located in the mounting area. The connection portion 222 of the 212 is thermally connected, for example, by soldering the heat dissipation frame body 412 and the connection portion 222 to form a thermal connection.

By radiating the heat dissipation pattern 22 of the metal layer 2, the heat conduction generated by the electronic component 4 can be diffused to the large-area heat dissipation portion 221, and the heat dissipation area that can be thermally convected with the outside can be increased, and the heat dissipation efficiency can be improved. In addition, the embodiment can be applied to the manufacture of the lamp holder, that is, the electronic component base 100 can be specifically a lamp holder.

Referring to FIG. 8 and FIG. 9 , another embodiment of the heat dissipation pattern 22 , wherein the heat dissipation portion 221 has a plurality of spaced heat dissipation blocks 2211 and the heat dissipation blocks 2211 are connected to the connection portions 222 one-to-one, and the connection portions 222 are connected to each other. They are respectively connected to one of the adjacent conductive segments 211. This embodiment is suitable for the electronic component 4 provided in the lead frame 41 of the thermoelectric connection type. Referring to FIG. 10, the lead frame 41 of the general thermoelectric connection type generally includes a large electrode holder body 413 and a small electrode holder body 414. The large electrode holder body 413 is used for mounting the wafer 42 and electrically connecting one of the electrodes of the wafer 42. The electrode holder body 413 is used to electrically connect the other electrode of the wafer 42. When the electronic component 4 is disposed in the mounting area 212, the large electrode frame body 413 of the electronic component 4 can be soldered to the connecting portion 222 and the conductive segment 211 connected to the connecting portion 222. Since the connecting portion 222 is connected to the conductive segment 211, the two are substantially The upper electrode frame 414 can be soldered to the adjacent mounting region 212 but not to the conductive segment 211. This can also be achieved by conducting metal layer 2 The heat dissipation pattern 22 diffuses the heat conduction generated by the electronic component 4 to the large-area heat dissipation portion 221, thereby increasing the heat dissipation area that can be thermally convected with the outside, and improving the heat dissipation efficiency.

In summary, the heat conduction generated by the electronic component 4 is diffused to the large-area heat dissipation portion 221 by the heat dissipation pattern 22 of the conductive metal layer 2, thereby increasing the heat dissipation area that can be thermally convected with the outside, thereby improving the heat dissipation efficiency. The object of the invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

S1‧‧‧ steps

S2‧‧‧ steps

Claims (14)

A method for manufacturing an electronic component pedestal, comprising the steps of: providing a body having an insulating surface; and forming a patterned conductive metal layer on the insulating surface, the conductive metal layer having a circuit pattern and a a heat dissipation pattern, wherein the circuit pattern has a plurality of spaced apart conductive segments and each of the adjacent conductive segments defines a mounting region for the electronic component, the heat dissipation pattern having a circuit pattern covering the insulating surface a heat dissipating portion of at least a portion of the outer portion and a plurality of connecting portions respectively passing through the mounting regions and connected to the heat dissipating portion, and the connecting portions are for thermally connecting with the electronic components provided in the corresponding mounting regions. The method of manufacturing an electronic component pedestal according to claim 1, wherein the step of forming the patterned conductive metal layer comprises forming an active layer containing a catalytic metal on the insulating surface, and depositing the active layer on the active layer by an electroless plating process. The conductive metal forms a metal layer. The method of manufacturing the electronic component pedestal of claim 2, wherein the step of forming the patterned conductive metal layer further comprises patterning the metal layer after forming the metal layer. The method of manufacturing an electronic component pedestal according to claim 1, wherein the heat dissipating portion has a plurality of spaced heat dissipating blocks, and the heat dissipating blocks are connected to the connecting portions one-to-one, and the connecting portions are respectively associated with each other One of the adjacent conductive segments is connected. A method of manufacturing an electronic component pedestal according to claim 1, wherein the insulating surface is a curved surface. The method of manufacturing the electronic component pedestal of claim 1, wherein the base body comprises a metal layer and an insulating layer formed on a surface of the metal layer, and the insulating surface is a surface of the insulating layer. A susceptor for an electronic component, comprising: a body having an insulating surface; and a conductive metal layer formed on the insulating surface and having a circuit pattern and a heat dissipation pattern, the circuit The pattern has a plurality of spaced apart conductive segments and each of the adjacent conductive segments defines a mounting region for each of the electronic components, the heat dissipation pattern having at least a portion of the insulating surface disposed outside the circuit pattern The heat dissipating portion and the plurality of connecting portions respectively passing through the mounting regions and connected to the heat dissipating portion, and the connecting portions are configured to be thermally connected to the electronic component disposed in the corresponding mounting region. The susceptor of the electronic component of claim 7, wherein the heat dissipating portion has a plurality of spaced heat dissipating blocks, and the heat dissipating blocks are connected to the connecting portions one-to-one, and the connecting portions are respectively adjacent thereto One of the conductive segments is connected. The susceptor of the electronic component of claim 7, wherein the base body comprises a metal layer and an insulating layer formed on a surface of the metal layer, and an insulating surface of the base body is a surface of the insulating layer, the heat dissipating portion There are a plurality of spaced apart heat dissipating blocks and the heat dissipating blocks are connected to the connecting portions one-to-one, and the connecting portions are respectively connected to one of the adjacent conductive segments. The susceptor of the electronic component of claim 7, wherein the pedestal comprises a metal layer and an insulating layer formed on a surface of the metal layer, and the pedestal The insulating surface is the surface of the insulating layer. A method for manufacturing an electronic component pedestal comprising the steps of: providing a body having an insulating surface; forming an active layer containing a catalytic metal on the insulating surface; and forming a circuit pattern on the active layer And a conductive metal layer of the heat dissipation pattern, wherein the circuit pattern and the heat dissipation pattern are respectively electrically and thermally connected to corresponding portions of the at least one electronic component. A susceptor for an electronic component for providing at least one electronic component, comprising: a body having an insulating surface; an active layer containing a catalytic metal on the insulating surface; and a conductive metal layer on the active layer The circuit pattern and the heat dissipation pattern are respectively electrically and thermally connected to corresponding portions of the at least one electronic component. A light-emitting device comprising: a body having an insulating surface; an active layer containing a catalytic metal on the insulating surface; and a conductive metal layer on the active layer and having a circuit pattern and a heat dissipation pattern; a light-emitting diode having a thermoelectrically separated type of lead frame, the lead frame comprising a two-electrode frame body and a heat-dissipating frame body, each of the electrode frame bodies being electrically connected to the circuit pattern of the conductive metal layer, the heat-dissipating frame body being hot A heat dissipation pattern connected to the conductive metal layer. A light emitting device comprising: a body having an insulating surface; an active layer containing a catalytic metal on the insulating surface; and a conductive metal layer on the active layer having a circuit pattern and a heat dissipation pattern; and at least one light emitting diode, a lead frame having a thermoelectric connection type, the lead frame comprising a large electrode frame body and a small electrode frame body, the large electrode frame body being electrically connected to the circuit pattern of the conductive metal layer and thermally connected to the heat dissipation of the conductive metal layer The pattern, the small electrode holder body is only electrically connected to the circuit pattern of the conductive metal layer.