TW201624536A - Substrate treating apparatus having vortex prevention gate and manufacturing method thereof - Google Patents

Abstract

The present invention provides a substrate handling apparatus having vortex prevention gate and manufacturing method thereof, which may prevent the occurrence of vortex in the door leaf for opening and closing the port of chamber body. Thus, the substrate handling apparatus comprises a chamber body (100), a door leaf (200), and a door leaf open/close driving portion (300). The chamber body (100) is constructed as a cylinder. The door leaf is constructed as a curved surface for opening and closing a port (110) on one side of the chamber body (100). The door leaf open/close driving portion (300) provides the driving force which may force the door leaf (200) moving in a direction vertical to the outer side of the chamber body (100) to open or close the door leaf (200) at the port (110).

Description

Substrate processing device with anti-vortex door leaf and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a substrate processing apparatus having an anti-vortex door leaf, and a method of manufacturing the same, and more particularly to a substrate having an anti-vortex flow door that prevents turbulence generated by a gas flowing into a chamber for processing a substrate due to a door leaf entering and exiting the substrate. Processing device and method of manufacturing the same.

Generally, the substrate processing apparatus performs a predetermined process using the process gas on the substrate disposed on the carrier after the door is closed and the inside is sealed in a state where the substrate is loaded inside the process chamber.

The semiconductor process includes a chemical vapor deposition process, a plasma dry etching process, etc., wherein the chemical vapor deposition process decomposes a compound in a gaseous state by high-frequency discharge, and then initiates a chemical reaction to form a thin film on the substrate, plasma dry etching. The process etches the substrate material by means of ions in a plasma state. In these processes, if eddy currents are generated in the gas injected into the chamber, the uniformity of deposition and etching may decrease.

Moreover, in the apparatus for performing reflow soldering as a semiconductor post-processing program, in the case where the gas is injected into the chamber to perform the processing of the substrate, if the eddy current is generated in the injected gas, the uniformity of the substrate (Uniformity) ) may also fall.

Fig. 1 is a diagram of a conventional substrate processing apparatus.

The substrate processing apparatus includes a cylindrical chamber main body 10, a door leaf 20 for opening and closing the opening portion 11 formed on the chamber body 10 side, and a door opening and closing driving portion 30 for providing a driving force to allow the door leaf 20 to open and close the opening portion. 11; a carrier 40 for arranging the substrate W; a lifting pin 45 for lifting the substrate W on the carrier 40; the shower head 50, spraying gas to process the substrate W disposed on the carrier 40; The port 60 is for discharging the gas inside the chamber body 10 to the outside.

In the space (Part A) formed by the presence of the opening portion 11 and the door leaf 20, the flow of the gas is not complete, and thus eddy current will be generated. Such eddy currents have a negative influence on the uniformity of the substrate W after processing.

The reason why the space of the portion A is formed in this way is because the door leaf 20 is formed in a flat plate shape, and in order to maintain the airtightness by adhering the flat-shaped door leaf 20 to the cylindrical chamber body 10, it is necessary to form the protruding portion 12, which is prominent. The portion 12 protrudes to the outside of the chamber body 10 in which the opening portion 11 is formed.

The door leaf 20 that is in contact with the protruding portion 12 has a seal (not shown) for maintaining airtightness.

In order to prevent the problem caused by the eddy current of the gas as described above, a plasma vacuum apparatus is disclosed in Korean Laid-Open Patent Publication No. 10-2006-0021136.

In the Korean Patent Publication No. 10-2006-0021136, in order to prevent a gas eddy phenomenon caused by a vacant space in which a substrate is placed, a plate inside the chamber connected to the gate valve is provided.

However, according to such a configuration, the plate provided inside the chamber needs to be moved up and down in a state of coming into contact with the inner wall surface of the chamber, so that debris due to abrasion may occur. In addition, if a seal is provided at a position in contact with the wall surface of the chamber, there is a problem that the wear rate of the seal is remarkably accelerated.

The present invention has been made to solve the above problems, and an object of the invention is to provide a substrate processing apparatus capable of preventing eddy currents generated in a door leaf for opening and closing an opening of a chamber body, and a method of manufacturing the same.

Further, an object of the present invention is to provide a substrate processing apparatus and a method of manufacturing the same that can save manufacturing costs by simplifying the structure and manufacturing method of the door leaf of the eddy current prevention structure.

A substrate processing apparatus according to the present invention for achieving the object as described above, comprising: a chamber body having a cylindrical shape; and a door leaf having a curved shape for opening and closing an opening portion on one side of the chamber body; The door opening and closing drive unit provides a driving force that moves the door leaf in a direction perpendicular to the outer side surface of the chamber body to open and close the door leaf in the opening.

The curvature of the door leaf can be equal to the curvature of the chamber body.

The curvature of the door leaf can be greater than the curvature of the chamber body.

In the door leaf, a recessed seal slot may be formed toward the inner side surface of the chamber body, and the seal slot is inserted into the seal slot, and the seal member is tightly attached to the chamber body to maintain airtightness when the door leaf closes the opening portion. .

The door leaf is formed in such a manner that a seal slot is formed on a flat plate-shaped plate and then formed into a curved surface by bending.

The door opening and closing driving portion may be configured by a first driving portion that moves the door leaf in a direction perpendicular to an outer side surface of the chamber body, and a second driving portion that causes the door leaf to be parallel with respect to an outer side surface of the chamber body mobile.

A method of manufacturing a substrate processing apparatus according to the present invention is for manufacturing a substrate processing apparatus including a structure in which a chamber body is formed in a cylindrical shape, and a door leaf is formed in a curved shape for opening and closing one side of the chamber body The opening portion of the door opening and closing drive unit provides a driving force for moving the door leaf in a direction perpendicular to the outer side surface of the chamber body to open and close the door leaf in the opening portion, wherein the door leaf is manufactured according to the following steps: Step a Forming a recessed seal slot toward the inner side of the chamber body on the plate-shaped plate; step b, forming the plate forming the seal slot into a curved surface by bending; step c, sealing the plate Insert into the seal slot.

The bending process of step b is performed in such a manner that the curvature of the door leaf is equal to the curvature of the chamber body.

The bending process of step b is performed in such a manner that the curvature of the door leaf is greater than the curvature of the chamber body.

According to the present invention, generation of a gas vortex in the interior of the chamber body for performing substrate processing can be prevented, so that process uniformity (Uniformity) can be improved.

Further, the door leaf for opening and closing the opening of the chamber body is formed into a curved surface so that the curvature of the door leaf corresponds to the curvature of the cylindrical chamber body, whereby the structure of the door opening and closing drive portion can be simplified.

Further, after the seal groove is formed on the inner side surface of the door leaf, the door leaf is formed into a curved shape by bending, whereby the processing of the seal groove can be facilitated.

Hereinafter, the configuration and action of the preferred embodiment of the present invention will be described in detail with reference to the drawings.

Fig. 2 (a) and (b) are a horizontal sectional view and an erect sectional view of a substrate processing apparatus according to the present invention.

A substrate processing apparatus having an anti-vortex door leaf according to the present invention includes a chamber main body 100, a door leaf 200, and a door opening and closing drive unit 300. The chamber body 100 is formed in a cylindrical shape. The door fan 200 is formed in a curved shape to open and close the opening portion 110 on one side of the chamber body 100. The door opening and closing drive unit 300 is for supplying a driving force that causes the door leaf 200 to move in a direction perpendicular to the outer side surface of the chamber body 100 to open and close the door leaf 200 from the opening portion 110.

The chamber body 100 is formed of a cylindrical shape having a circular cross section. An opening portion 110 for realizing insertion or removal of the substrate W is formed at one side of the chamber body 100. The opening portion 110 is configured by a shape that penetrates a predetermined portion of the chamber body 100. The robot arm (not shown) enters the internal space of the chamber body 100 through the opening portion 110, thereby placing the substrate W on the carrier 400 or unloading the processed substrate W to the outside.

The upper portion of the chamber body 100 has a shower head 500 for uniformly injecting the inflowing process gas over the entire range of the substrate W. The upper side of the showerhead 500 can have an upper heater (not shown).

The inside of the chamber body 100 has a carrier 400 for arranging the substrate W. The carrier 400 may have a lower heater (not shown) for performing a process in a state where heat is applied to the substrate W.

In order to raise the substrate W placed on the carrier 400 or to place the substrate W placed inside the chamber body 100 on the carrier 400, a lift pin 450 is provided. The lift pin 450 is raised or lowered in the vertical direction by a driving portion (not shown) while being configured to penetrate the carrier 400, thereby raising or lowering the substrate W.

The bottom of the chamber body 100 is formed with an exhaust port 600 for exhausting gas inside the chamber body 100.

In order to close or open the opening portion 110, the door leaf 200 moves in a direction (horizontal direction in FIG. 2) perpendicular to the outer side surface of the chamber body 100.

The door fan 200 is formed in a curved shape so as to correspond to the outer peripheral surface of the chamber main body 100 composed of a cylindrical shape, the curvature of the door fan 200 may be equal to the curvature of the chamber main body 100, or may be configured to have a curvature larger than the curvature of the chamber main body 100.

The door leaf 200 is formed into a curved shape by bending a flat stainless steel material plate. When the door leaf 200 is pressed toward the opening portion 110 under the control of the door opening and closing drive unit 300 by closing the opening portion 110 with the door fan 200, the door leaf 200 may be deformed to change the curvature. Therefore, if the door leaf 200 is formed to have a curvature larger than the curvature of the chamber main body 100, the above-described change in the curvature of the door leaf 200 due to the pressurization can be absorbed, and the sealing force of the opening portion 110 can be improved.

The door opening and closing drive unit 300 is composed of a first drive unit 310 and a second drive unit 320. The first driving portion 310 is for moving the door leaf 200 in a direction perpendicular to the outer side surface of the chamber body 100 (horizontal direction in FIG. 2); the second driving portion 320 is for causing the door leaf 200 to face the cavity The outer side surface of the chamber main body 100 moves in a direction parallel to the vertical direction (the vertical direction in FIG. 2).

The door fan 200 is moved away from the opening portion 110 or close to the opening portion 110 by the first driving portion 310, and the door fan 200 and the first driving portion 310 are integrally moved up and down by the second driving portion 320.

A seal 220 is interposed between the inner side surface of the door fan 200 and the outer side surface of the chamber main body 100, and when the door fan 200 is pressurized toward the chamber main body 100, the seal 220 is compacted to maintain airtightness.

Fig. 3 (a) and (b) are a plan view and a front view showing a state before the door leaf according to the present invention is bent. Fig. 4 is a plan view taken along line A-A of Fig. 3, and Fig. 5(a) and (b) are a plan view and a front view showing a state in which the door leaf of Fig. 3 is bent.

The door leaf 200 according to the present invention is formed of a curved shape so as to correspond to the outer peripheral surface of the chamber main body 100 composed of a cylindrical shape, and an inner side surface facing the chamber main body 100 on the door leaf 200 is formed with a seal member 220 for inserting the seal 220. Seal slot 210.

The seal slot 210 is formed to be recessed in a quadrangular shape along the circumference of the inner side of the door leaf 200. If the opening portion 110 is closed by the door fan 200 in a state where the sealing member 220 is inserted into the sealing member slot 210, the sealing member 220 is in close contact with the chamber main body 100 to maintain airtightness.

The door fan 200 is formed in a curved shape, however, it is a difficult task to machine the seal slot 210 on the inner side of the curved door fan 200. Therefore, as shown in FIGS. 3 and 5, it is preferable to machine the seal slot 210 on a flat plate and then shape it into a curved shape by bending.

That is, as shown in Fig. 3, the seal slot 210 is machined in a quadrangular shape on the inner side surface of the door leaf 200 which is formed of a flat plate.

If the seal slot 210 is thus machined, the seal slot 210 of the cross-sectional shape as shown in Fig. 4 is formed.

The processing of the seal slot 210 is performed in a state where the door fan 200 assumes a flat plate shape, so that the processing process becomes easy.

If the processing of the seal slot 210 is completed, the door fan 200 is bent. When the bending process is completed, the door fan 200 is formed into a curved shape as shown in FIG. 5, and is formed into an outer side surface corresponding to the chamber body 100.

As described above, in the case where the door leaf 200 is formed into a curved shape by the bending process, the sealing member 220 is inserted into the inside of the seal slot 210 and assembled to the chamber body 100, thereby manufacturing the substrate processing apparatus.

According to the invention constructed as described above, the cavity main body 100 is not formed with a structure such as the projection 12 employed in the prior art, and thus eddy current is not formed in the flow of the gas for processing the substrate W, thereby Can improve process uniformity (Uniformity).

Further, if the door leaf 200 is formed into a curved surface, the opening and closing of the opening portion 110 can be realized by a driving for pressing the door leaf 200 toward the chamber body 100 or separating the door leaf 200 from the chamber body 100, thereby contacting the chamber. The wear of the seal 220 of the body 100 is prevented and debris is not generated inside the chamber body 100.

The present invention has been described in detail above, but the present invention is not limited to the above-described embodiments, and it is not difficult for a person having ordinary knowledge in the technical field to which the present invention pertains without departing from the technical idea of the present invention claimed in the claims. Obvious modifications are implemented, and such variant implementations are within the scope of the invention.

10, 100‧‧‧ chamber main body
11, 110‧‧‧ openings
12‧‧‧Protruding
20, 200‧‧‧ door fans
210‧‧‧Seal slot
220‧‧‧Seal
30, 300‧‧‧ door opening and closing drive department
310‧‧‧First Drive Department
320‧‧‧Second drive department
40, 400‧‧‧ bearing seat
45, 450‧‧ ‧ lift pins
50, 500‧‧‧ sprinkler head
60, 600‧‧ vents
W‧‧‧Substrate

Fig. 1 (a) and (b) are a horizontal sectional view and an erect sectional view of a conventional substrate processing apparatus.

Fig. 2 (a) and (b) are a horizontal sectional view and an erect sectional view of a substrate processing apparatus according to the present invention.

Fig. 3 (a) and (b) are a plan view and a front view showing a state before the door leaf according to the present invention is subjected to bending processing.

Figure 4 is a plan view of A-A of Figure 3.

Fig. 5 (a) and (b) are a plan view and a front view showing a state in which the door leaf of Fig. 3 is subjected to bending processing.

100‧‧‧ chamber body

110‧‧‧ openings

200‧‧‧ door leaf

220‧‧‧Seal

300‧‧‧door fan opening and closing drive department

310‧‧‧First Drive Department

320‧‧‧Second drive department

400‧‧‧ bearing seat

450‧‧‧lifting pin

500‧‧‧ sprinkler head

600‧‧ vent

W‧‧‧Substrate

Claims (9)

A substrate processing apparatus having an anti-vortex door, comprising: a chamber body (100) formed in a cylindrical shape; a door fan (200) formed in a curved shape for opening and closing one of the chamber bodies (100) An opening portion (110) on the side; a door opening and closing driving portion (300) that provides a driving force for moving the door leaf (200) in a direction perpendicular to an outer side surface of the chamber body (100), The door leaf (200) is opened and closed in the opening (110). A substrate processing apparatus having an anti-vortex door as described in claim 1, wherein the curvature of the door leaf (200) is equal to the curvature of the chamber body (100). A substrate processing apparatus having an anti-vortex door as described in claim 1, wherein the curvature of the door leaf (200) is greater than the curvature of the chamber body (100). A substrate processing apparatus having an anti-vortex door as described in claim 1, wherein in the door leaf (200), a seal slot (210) is formed toward the inner side surface of the chamber body (100). a seal member (220) is inserted into the seal slot (210), and when the door (200) closes the opening portion (110), the seal member (220) is in close contact with the chamber body (100) Maintain air tightness. A substrate processing apparatus having an anti-vortex door as described in claim 4, wherein the door leaf (200) is formed in the following manner: the seal slot (210) is machined on a flat plate-shaped board, and then It is bent to form a curved surface. The substrate processing apparatus with an anti-vortex door as described in claim 1, wherein the door opening and closing unit (300) comprises: a first driving part (310), wherein the door leaf (200) is opposite to the door The outer side surface of the chamber body (100) moves in a vertical direction; a second driving portion (320) moves the door leaf (200) in a direction parallel to the outer side surface of the chamber body (100). A method of manufacturing a substrate processing apparatus for manufacturing a substrate processing apparatus comprising: a chamber body (100) having a cylindrical shape; and a door fan (200) having a curved shape for opening and closing the An opening portion (110) on one side of the chamber body (100); a door opening and closing driving portion (300) providing a driving force for causing the door leaf (200) to be opposite to the chamber body (100) The outer side surface is moved in a vertical direction to open and close the door leaf (200) at the opening portion (110), wherein the door leaf (200) is manufactured according to the following steps: Step a, facing the chamber on the plate-shaped plate The inner side of the body (100) forms a recessed seal slot (210); in step b, the plate formed with the seal slot (210) is formed into a curved surface by bending; step c, a seal A piece (220) is inserted into the seal slot (210). The method of manufacturing a substrate processing apparatus according to claim 7, wherein the bending of the step b is performed in such a manner that the curvature of the door leaf (200) is equal to the curvature of the chamber body (100). The method of manufacturing a substrate processing apparatus according to claim 7, wherein the bending of the step b is performed in such a manner that the curvature of the door leaf (200) is larger than the curvature of the chamber body (100).