TW201623391A - Siloxane resin composition, transparent cured product using same, transparent pixel, microlens, and solid-state imaging element - Google Patents

Siloxane resin composition, transparent cured product using same, transparent pixel, microlens, and solid-state imaging element Download PDF

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TW201623391A
TW201623391A TW104135328A TW104135328A TW201623391A TW 201623391 A TW201623391 A TW 201623391A TW 104135328 A TW104135328 A TW 104135328A TW 104135328 A TW104135328 A TW 104135328A TW 201623391 A TW201623391 A TW 201623391A
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mass
resin composition
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TWI666245B (en
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Tetsuya Kamimura
Hideki Takakuwa
Makoto Kubota
Shoichi Nakamura
Yoshinori Taguchi
Naotsugu Muro
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Fujifilm Corp
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    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
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    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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Abstract

The siloxane resin composition according to the present invention contains metal-containing particles, a siloxane resin, and a solvent, the siloxane resin having at least an acidic group (A), and contains metal-containing particles, a siloxane resin, an alkali-soluble resin, and a solvent, the refractive index of a cured film thereof being at least 1.5, wherein the siloxane resin has a silanol group.

Description

矽氧烷樹脂組成物、利用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件a decane resin composition, a transparent cured product using the decane resin composition, a transparent pixel, a microlens, and a solid-state imaging device

本發明係有關一種矽氧烷樹脂組成物、利用該矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡以及固體攝像元件。The present invention relates to a siloxane oxide resin composition, a transparent cured product using the siloxane oxide resin composition, a transparent pixel, a microlens, and a solid-state image sensor.

作為固體攝像元件等之透明構件,可舉出微透鏡或透明像素。或者,可舉出塗覆該些之防反射膜、位於其下部之透明像素、透明絕緣膜、平坦化膜等。對於各個構件,要求與其功能相應之特性。例如,對於上述微透鏡和透明像素,要求較高折射率以及較高透光率。又,近來,為了實現日益發展之元件的微小化,對各材料要求適於微細的加工精度之製造適應性。Examples of the transparent member such as a solid-state image sensor include a microlens or a transparent pixel. Alternatively, an antireflection film coated with these, a transparent pixel located at a lower portion thereof, a transparent insulating film, a planarizing film, or the like can be given. For each component, characteristics corresponding to its function are required. For example, for the above microlenses and transparent pixels, a higher refractive index and a higher transmittance are required. Further, recently, in order to realize the miniaturization of increasingly developed components, it is required for each material to have a manufacturing suitability suitable for fine machining accuracy.

具體而言,研究對透明樹脂導入高折射率粒子之技術。專利文獻1中,提出有在聚醯亞胺中含有氧化鈦等粒子之正型感光性樹脂組成物。Specifically, a technique of introducing a high refractive index particle into a transparent resin has been studied. Patent Document 1 proposes a positive photosensitive resin composition containing particles such as titanium oxide in polyimine.

【先前技術文獻】[Previous Technical Literature]

【專利文獻】[Patent Literature]

【專利文獻1】國際公開第2005/088396號[Patent Document 1] International Publication No. 2005/088396

本發明的目的為提供一種適合作為透鏡和透明像素等透明構件的材料之矽氧烷樹脂組成物。又,其目的為提供如下矽氧烷樹脂組成物,其並不限定於正型,亦能夠作為加熱硬化型樹脂或負型感光性樹脂而應對,還能夠適當應對微透鏡和透明像素的微細加工,能夠依據需要優化其製造適應性以及硬化膜的特性。又,本發明的目的為提供一種利用上述矽氧烷樹脂組成物之透明硬化物、透明像素、微透鏡、固體攝像元件。An object of the present invention is to provide a decane resin composition suitable as a material for a transparent member such as a lens and a transparent pixel. Moreover, the object of the present invention is to provide a composition of a nonanethane resin which is not limited to a positive type, and can be handled as a heat-curable resin or a negative-type photosensitive resin, and can also appropriately handle micro-machining of microlenses and transparent pixels. It is possible to optimize its manufacturing suitability and properties of the cured film as needed. Further, an object of the present invention is to provide a transparent cured product, a transparent pixel, a microlens, and a solid-state imaging device using the above-described decane resin composition.

上述課題藉由下述手段解決。The above problems are solved by the following means.

〔1〕一種矽氧烷樹脂組成物,其含有含金屬粒子、矽氧烷樹脂以及溶劑,上述矽氧烷樹脂至少具有酸性基(A)。[1] A siloxane oxide resin composition comprising metal-containing particles, a siloxane oxide resin, and a solvent, wherein the siloxane oxide resin has at least an acidic group (A).

〔2〕如〔1〕所述之矽氧烷樹脂組成物,其進一步含有鹼可溶性樹脂。[2] The oxirane resin composition according to [1], which further contains an alkali-soluble resin.

〔3〕一種矽氧烷樹脂組成物,其含有含金屬粒子、矽氧烷樹脂、鹼可溶性樹脂以及溶劑,硬化膜的折射率為1.5以上,其中,上述矽氧烷樹脂係具有矽烷醇基之矽氧烷樹脂。[3] A siloxane oxide resin composition comprising metal-containing particles, a siloxane oxide resin, an alkali-soluble resin, and a solvent, wherein the cured film has a refractive index of 1.5 or more, wherein the siloxane oxide resin has a decyl alcohol group. A siloxane resin.

〔4〕如〔1〕或〔2〕所述之矽氧烷樹脂組成物,其中,上述酸性基(A)的pKa為5.5以下。[4] The oxirane resin composition according to [1] or [2] wherein the acidic group (A) has a pKa of 5.5 or less.

〔5〕如〔1〕~〔4〕中任一個所述之矽氧烷樹脂組成物,其進一步含有選自聚合起始劑以及紫外線吸收劑之至少一種。[5] The oxirane resin composition according to any one of [1] to [4] further comprising at least one selected from the group consisting of a polymerization initiator and an ultraviolet absorber.

〔6〕如〔5〕所述之矽氧烷樹脂組成物,其中,上述紫外線吸收劑選自苯并三唑化合物、二苯甲酮化合物、三嗪化合物、二烯化合物、苯并二硫醇化合物以及阿伏苯宗化合物。[6] The hafnium oxide resin composition according to [5], wherein the ultraviolet absorber is selected from the group consisting of a benzotriazole compound, a benzophenone compound, a triazine compound, a diene compound, and a benzodithiol. Compounds and avobenzone compounds.

〔7〕如〔1〕、〔2〕或〔4〕所述之矽氧烷樹脂組成物,其中,上述酸性基(A)係選自羧基、磷酸基、膦酸基以及磺酸基之至少一種。[7] The oxirane resin composition according to [1], [2] or [4] wherein the acidic group (A) is at least selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, and a sulfonic acid group. One.

〔8〕如〔1〕、〔2〕、〔4〕或〔7〕中任一個所述之矽氧烷樹脂組成物,其中,上述矽氧烷樹脂為含有以下述式(S)表示之矽烷化合物而製備之水解縮合物。 (RS1e Si(RS2f (ORS3g (S) RS1 係含有酸性基(A)之基團。RS2 以及RS3 分別獨立地表示氫原子或烴基。e為1~3的整數。f為0~2的整數。g為1~3的整數。e+g+f為4。The oxirane resin composition according to any one of the above [1], wherein the decane resin is a decane represented by the following formula (S). A hydrolysis condensate prepared by the compound. (R S1 ) e Si(R S2 ) f (OR S3 ) g (S) R S1 is a group containing an acidic group (A). R S2 and R S3 each independently represent a hydrogen atom or a hydrocarbon group. e is an integer from 1 to 3. f is an integer from 0 to 2. g is an integer from 1 to 3. e+g+f is 4.

〔9〕如〔2〕或〔3〕所述之矽氧烷樹脂組成物,其中,上述鹼可溶性樹脂為丙烯酸樹脂。[9] The oxirane resin composition according to [2] or [3] wherein the alkali-soluble resin is an acrylic resin.

〔10〕如〔2〕或〔3〕所述之矽氧烷樹脂組成物,其中,上述鹼可溶性樹脂為以下述式(R1)表示之樹脂。 【化學式1】LX1 表示單鍵或連結基。RX1 、RY1 分別獨立地為氫原子、甲基、乙基、丙基或氰基。RA 為酸性基(A)。RY2 表示取代基。nx、ny為莫耳分率。[10] The oxirane resin composition according to [2] or [3], wherein the alkali-soluble resin is a resin represented by the following formula (R1). [Chemical Formula 1] L X1 represents a single bond or a linking group. R X1 and R Y1 are each independently a hydrogen atom, a methyl group, an ethyl group, a propyl group or a cyano group. R A is an acidic group (A). R Y2 represents a substituent. Nx and ny are the molar fractions.

〔11〕如〔1〕~〔10〕中任一個所述之矽氧烷樹脂組成物,其中,調配於矽氧烷樹脂組成物中之樹脂的總計酸值為50mgKOH/g以上。[11] The oxirane resin composition according to any one of [1] to [10] wherein the total acid value of the resin blended in the decane resin composition is 50 mgKOH/g or more.

〔12〕如〔1〕~〔11〕中任一個所述之矽氧烷樹脂組成物,其中,相對於上述含金屬粒子100質量份,矽氧烷樹脂的含量為1質量份以上且80質量份以下。The oxime resin composition according to any one of the above [1], wherein the content of the siloxane resin is 1 part by mass or more and 80% by mass based on 100 parts by mass of the metal-containing particles. The following.

〔13〕如〔1〕~〔12〕中任一個所述之矽氧烷樹脂組成物,其中,組成物的固體成分中含有40質量%以上且80質量%以下的上述含金屬粒子。[13] The oxirane resin composition according to any one of [1] to [12], wherein the solid content of the composition contains 40% by mass or more and 80% by mass or less of the metal-containing particles.

〔14〕如〔1〕~〔13〕中任一個所述之矽氧烷樹脂組成物,其含有選自Ti、Ta、W、Y、Ba、Hf、Zr、Sn、Nb、V以及Si之金屬作為構成上述含金屬粒子之元素。[14] The hafnium oxide resin composition according to any one of [1] to [13], which is selected from the group consisting of Ti, Ta, W, Y, Ba, Hf, Zr, Sn, Nb, V, and Si. The metal serves as an element constituting the above metal-containing particles.

〔15〕如〔1〕~〔14〕中任一個所述之矽氧烷樹脂組成物,其中,上述矽氧烷樹脂係在上述含金屬粒子的存在下進行水解縮合反應而獲得者。[15] The oxirane resin composition according to any one of [1] to [14] wherein the siloxane oxide resin is obtained by performing a hydrolysis condensation reaction in the presence of the metal-containing particles.

〔16〕如〔1〕~〔15〕中任一個所述之矽氧烷樹脂組成物,其中,硬化膜的折射率為1.6以上且2.0以下。[16] The hafnium oxide resin composition according to any one of [1] to [15] wherein the cured film has a refractive index of 1.6 or more and 2.0 or less.

〔17〕一種透明硬化物,其是使〔1〕~〔16〕中任一個所述之矽氧烷樹脂組成物硬化而成。[17] A transparent cured product obtained by curing the oxirane resin composition according to any one of [1] to [16].

〔18〕一種透明像素,其包括〔17〕所述之透明硬化物。[18] A transparent pixel comprising the transparent cured product according to [17].

〔19〕一種微透鏡,其包括〔17〕所述之透明硬化物。[19] A microlens comprising the transparent cured product according to [17].

〔20〕一種固體攝像元件,其具備〔18〕所述之透明像素、〔19〕所述之微透鏡或該兩者。[20] A solid-state imaging device comprising the transparent pixel according to [18], the microlens of [19], or both.

本說明書中的基團(原子團)的表述中,未記述取代以及未取代之表述係同時包含不具有取代基者以及具有取代基者。例如,“烷基”係不僅包含不具有取代基之烷基(未取代烷基),還包含具有取代基之烷基(取代烷基)者。In the expression of the group (atomic group) in the present specification, the unsubstituted and unsubstituted expressions are not included in the formula and the substituent group. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

又,本說明書中的“放射線”係指例如以水銀燈的明線光譜、準分子雷射為代表之遠紫外線、極紫外線(EUV光)、X射線、電子束等。又,本發明中,光表示活性光線或放射線。本說明書中的“曝光”除非特別指明,則不僅包含藉由以水銀燈的明線光譜、準分子雷射為代表之遠紫外線、X射線、EUV光等進行之曝光,藉由電子束、離子束等粒子束進行之描繪亦包含於曝光。In addition, the term "radiation" in the present specification means, for example, a far-line ultraviolet ray represented by a bright line spectrum of a mercury lamp, an excimer laser, an extreme ultraviolet ray (EUV light), an X-ray, an electron beam, or the like. Further, in the present invention, light means active light or radiation. The "exposure" in the present specification includes not only exposure by far-field ultraviolet rays, X-rays, EUV light, etc. represented by a bright line spectrum of a mercury lamp, an excimer laser, but also an ion beam, unless otherwise specified. The depiction of the particle beam is also included in the exposure.

又,本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯以及丙烯酸甲酯兩者或任一者,“(甲基)丙烯酸”表示丙烯酸以及甲基丙烯酸兩者或任一者,“(甲基)丙烯醯基”表示丙烯醯基以及甲基丙烯醯基兩者或任一者。In the present specification, "(meth) acrylate" means either or both of acrylate and methyl acrylate, and "(meth)acrylic acid" means either or both of acrylic acid and methacrylic acid, "( The "methyl) acrylonitrile group means either or both of an acryloyl group and a methacryl group.

又,本說明書中,“單量體”與“單體(monomer)”係相同含義。本說明書中的單量體與寡聚物以及聚合物有所區分,指重量平均分子量為2,000以下的化合物。本說明書中,聚合性化合物係指具有聚合性官能團之化合物,可以係單量體,亦可以係聚合物。聚合性官能團係指參與聚合反應之基團。In addition, in this specification, "single quantity" and "monomer" have the same meaning. The monoliths in the present specification are distinguished from oligomers and polymers, and refer to compounds having a weight average molecular weight of 2,000 or less. In the present specification, the polymerizable compound means a compound having a polymerizable functional group, and may be a single body or a polymer. The polymerizable functional group refers to a group that participates in the polymerization reaction.

重量平均分子量以及數量平均分子量能夠藉由凝膠滲透色譜法(GPC)求出。The weight average molecular weight and the number average molecular weight can be determined by gel permeation chromatography (GPC).

本說明書中,化學式中的Me表示甲基,Et表示乙基,Pr表示丙基,Bu表示丁基,Ph表示苯基。In the present specification, Me in the chemical formula represents a methyl group, Et represents an ethyl group, Pr represents a propyl group, Bu represents a butyl group, and Ph represents a phenyl group.

本說明書中,“製程”這一術語不僅包括獨立的製程,即使在無法與其他製程明確地區別之情況下,只要實現其製程的所期望之作用,便包含於本術語中。In this specification, the term "process" includes not only an independent process, but even if it is not clearly distinguishable from other processes, as long as the desired effect of the process is achieved, it is included in the term.

本發明的矽氧烷樹脂組成物適合作為透鏡和透明像素等透明構件的材料。其並不限定於正型感光性樹脂,亦能夠使用加熱硬化型樹脂或負型感光性樹脂,還能夠適當應對微透鏡和透明像素的微細加工。而且,能夠依據需要優化圖案形成時的製造適應性(尤其是分辨率)以及硬化膜的特性(耐光性、殘渣缺陷的抑制)。又,能夠提供利用上述矽氧烷樹脂組成物之品質優良的透明硬化物、透明像素、微透鏡、固體攝像元件。The decane resin composition of the present invention is suitable as a material for a transparent member such as a lens or a transparent pixel. It is not limited to the positive photosensitive resin, and a heat curing resin or a negative photosensitive resin can be used, and fine processing of the microlens and the transparent pixel can be appropriately handled. Moreover, the manufacturing suitability (especially the resolution) at the time of pattern formation and the characteristics (light resistance, suppression of residue defects) of the cured film can be optimized as needed. Further, it is possible to provide a transparent cured product, a transparent pixel, a microlens, and a solid-state imaging element which are excellent in quality by using the above-described silicone resin composition.

本發明的矽氧烷樹脂組成物含有含金屬粒子、矽氧烷樹脂(或矽氧烷樹脂與鹼可溶性樹脂的組合)以及溶劑。以下,關於其較佳之實施形態進行詳細說明。The naphthenic resin composition of the present invention contains a metal-containing particle, a siloxane oxide resin (or a combination of a siloxane oxide resin and an alkali-soluble resin), and a solvent. Hereinafter, preferred embodiments thereof will be described in detail.

<含金屬粒子><Metal-containing particles>

含金屬粒子廣泛包含將金屬作為構成元素而包含之粒子。在此,“金屬”這一詞應在最廣泛的意義上解釋,設為硼、矽、砷等類金屬亦包含在此。含金屬粒子包含氧原子而構成時,有時特別稱為金屬氧化物粒子。The metal-containing particles broadly include particles containing a metal as a constituent element. Here, the term "metal" should be interpreted in the broadest sense, and metals such as boron, antimony, and arsenic are also included herein. When the metal-containing particles are composed of an oxygen atom, they may be specifically referred to as metal oxide particles.

本發明中,含金屬粒子含有選自Ti、Ta、W、Y、Ba、Hf、Zr、Sn、Nb、V以及Si之金屬為較佳。其中,係包含其中的2種以上之複合金屬的氧化物粒子為較佳。例如,Ti與Zr(依據需要還包含Si)、Ti與Sn(依據需要還包含Si)、Ti與Zr與Sn(依據需要還包含Si)之組合為較佳,具有Ti、Zr、Sn以及Si之組合為進一步較佳。In the present invention, the metal-containing particles preferably contain a metal selected from the group consisting of Ti, Ta, W, Y, Ba, Hf, Zr, Sn, Nb, V, and Si. Among them, oxide particles containing two or more kinds of composite metals therein are preferred. For example, a combination of Ti and Zr (including Si as needed), Ti and Sn (including Si as needed), and Ti and Zr and Sn (including Si if necessary) are preferable, and have Ti, Zr, Sn, and Si. The combination is further preferred.

作為含金屬粒子的構成材料,例如可舉出氧化鈦、氧化鋯、氧化矽、鈦酸鋇、硫酸鋇、氧化鋇、氧化鉿、氧化鉭、氧化鎢、氧化釔。該些構成材料可含有2種以上,至少含有氧化鈦以及氧化鋯為較佳,含有氧化鈦、氧化鋯以及氧化錫為進一步較佳,含有氧化鈦、氧化鋯、氧化錫以及氧化矽為特佳。Examples of the constituent material of the metal-containing particles include titanium oxide, zirconium oxide, cerium oxide, barium titanate, barium sulfate, cerium oxide, cerium oxide, cerium oxide, tungsten oxide, and cerium oxide. These constituent materials may contain two or more kinds, and at least titanium oxide and zirconium oxide are preferable, and titanium oxide, zirconium oxide, and tin oxide are further preferably contained, and titanium oxide, zirconium oxide, tin oxide, and antimony oxide are particularly preferable. .

作為構成材料含有氧化鈦時,含有金紅石型氧化鈦為較佳。而且,相對於氧化鈦的總量含有80質量%以上的金紅石型氧化鈦為較佳,含有90質量%以上為更佳,含有95質量%以上為特佳。上限為100質量%。When titanium oxide is contained as a constituent material, rutile-type titanium oxide is preferable. In addition, the rutile-type titanium oxide is preferably contained in an amount of 80% by mass or more based on the total amount of the titanium oxide, more preferably 90% by mass or more, and particularly preferably 95% by mass or more. The upper limit is 100% by mass.

從獲得高折射率之觀點出發,含金屬粒子的折射率為1.75~2.90為較佳,1.75~2.70為更佳,1.90~2.70為特佳。From the viewpoint of obtaining a high refractive index, the refractive index of the metal-containing particles is preferably 1.75 to 2.90, more preferably 1.75 to 2.70, and particularly preferably 1.90 to 2.70.

作為含金屬粒子的數量平均粒徑,500nm以下為較佳,200nm以下為更佳,100nm以下為進一步較佳,50nm以下進一步更佳,30nm以下為特佳。作為下限値,1nm以上為較佳,3nm以上為更佳。經由設為上述數量平均粒徑的範圍,硬化膜的透明度得到提高,故較佳。又,能夠依據硬化膜等的均質性以及需要而賦予絕緣性和耐久性,故較佳。關於含金屬粒子,能夠準備適當的粒子的粉體,利用珠磨機等分散機來進行粉碎或分散。The number average particle diameter of the metal-containing particles is preferably 500 nm or less, more preferably 200 nm or less, still more preferably 100 nm or less, still more preferably 50 nm or less, and particularly preferably 30 nm or less. As the lower limit 値, 1 nm or more is preferable, and 3 nm or more is more preferable. It is preferable to set the range of the above-mentioned number average particle diameter to improve the transparency of the cured film. Moreover, it is preferable to provide insulation and durability depending on the homogeneity and the like of the cured film. The metal-containing particles can be prepared by pulverizing or dispersing a powder of an appropriate particle using a disperser such as a bead mill.

~粒子的折射率的測定~~Measurement of refractive index of particles~

能夠以以下方法測定含金屬粒子的折射率。將含金屬粒子的含有率製備為0質量%、20質量%、30質量%、40質量%、50質量%,製作將含金屬粒子與基體樹脂混合而成之混合溶液樣品。各混合溶液樣品的固體成分濃度設為10%。將各個混合溶液樣品在矽晶片上,以厚度成為0.3~1.0μm之方式,利用旋轉塗佈機進行塗佈,接著以200℃的加熱板進行5分鐘的加熱、乾燥,從而獲得塗膜。接著,例如能夠利用橢圓偏振計(Otsuka Electronics Co.,Ltd.製造)求出波長633nm(25℃)下的折射率,並藉由外插而求出含金屬粒子100質量%的值。The refractive index of the metal-containing particles can be measured by the following method. The content of the metal-containing particles was prepared to be 0% by mass, 20% by mass, 30% by mass, 40% by mass, or 50% by mass, and a mixed solution sample obtained by mixing the metal-containing particles and the matrix resin was prepared. The solid content concentration of each mixed solution sample was set to 10%. Each mixed solution sample was applied onto a tantalum wafer by a spin coater so as to have a thickness of 0.3 to 1.0 μm, and then heated and dried by a hot plate at 200 ° C for 5 minutes to obtain a coating film. Then, for example, a refractive index at a wavelength of 633 nm (25 ° C) can be obtained by an ellipsometer (manufactured by Otsuka Electronics Co., Ltd.), and a value of 100% by mass of the metal-containing particles can be obtained by extrapolation.

~平均粒徑的測定~~ Determination of average particle size ~

關於含金屬粒子的數量平均粒徑(表示一次粒徑中的平均粒徑),能夠從藉由透射型電子顯微鏡觀察粒子而獲得之照片求出。求出粒子的投影面積,由此求出等效圓直徑來作為平均粒徑。另外,為了求出平均粒徑而對100個粒子測定粒徑,在所測定之粒徑中,將減去最大側10個以及最小側10個之後的80個的平均值作為平均粒徑。本說明書中,關於“平均粒徑”的表述,除非特別說明,則表示數量平均粒徑。The number average particle diameter of the metal-containing particles (indicating the average particle diameter in the primary particle diameter) can be determined from a photograph obtained by observing the particles by a transmission electron microscope. The projected area of the particles was determined, and the equivalent circle diameter was determined as the average particle diameter. Further, in order to determine the average particle diameter, the particle diameter was measured for 100 particles, and among the measured particle diameters, the average value of 80 after the maximum side 10 and the minimum side 10 were subtracted as the average particle diameter. In the present specification, the expression "average particle diameter" means a number average particle diameter unless otherwise specified.

作為市售的含金屬粒子,例如可舉出T-BTO-020RF(鈦酸鋇;Toda Kogyo Corporation製造)、UEP-100(氧化鋯;DAIICHI KIGENSO KAGAKU KOGYO CO., LTD.製造)或STR-100N、STR-100W、STR-100WLPT(氧化鈦;均為Sakai Chemical Industry Co.,Ltd.製造)。Examples of commercially available metal-containing particles include T-BTO-020RF (barium titanate; manufactured by Toda Kogyo Corporation), UEP-100 (zirconia; manufactured by DAIICHI KIGENSO KAGAKU KOGYO CO., LTD.) or STR-100N. STR-100W, STR-100WLPT (titanium oxide; all manufactured by Sakai Chemical Industry Co., Ltd.).

含金屬粒子還能夠作為分散於液體中之分散體來獲得。作為氧化矽-氧化鈦粒子,例如可舉出“Optolake”(註冊商標)TR-502、“Optolake”TR-503、“Optolake”TR-504、“Optolake”TR-513、“Optolake”TR-520、“Optolake”TR-527、“Optolake”TR-528、“Optolake”TR-529、“Optolake”TR-544或“Optolake”TR-550(均為JGC Catalysts and Chemicals Ltd.製造)。作為氧化鋯粒子,例如可舉出“Bairaru”註冊商標Zr-C20(平均粒徑=20nm;Taki CHEMICALCo., Ltd.製造)、ZSL-10A(平均粒徑=60-100nm;DAIICHI KIGENSO KAGAKU KOGYO CO., LTD.製造)、“Nanouse”(註冊商標)OZ-30M(平均粒徑=7nm;Nissan CHEMICALIndustries, Limited製造)、SZR-M(Sakai CHEMICALIndustry Co.,Ltd.製造)或HXU-120JC(SUMITOMO Osaka Cement Company, Limited製造)。The metal-containing particles can also be obtained as a dispersion dispersed in a liquid. Examples of the cerium oxide-titanium oxide particles include "Optolake" (registered trademark) TR-502, "Optolake" TR-503, "Optolake" TR-504, "Optolake" TR-513, and "Optolake" TR-520. "Optolake" TR-527, "Optolake" TR-528, "Optolake" TR-529, "Optolake" TR-544 or "Optolake" TR-550 (all manufactured by JGC Catalysts and Chemicals Ltd.). Examples of the zirconia particles include "Bairaru" registered trademark Zr-C20 (average particle diameter = 20 nm; manufactured by Taki CHEMICAL Co., Ltd.), ZSL-10A (average particle diameter = 60-100 nm; DAIICHI KIGENSO KAGAKU KOGYO CO ., manufactured by LTD., "Nanouse" (registered trademark) OZ-30M (average particle size = 7 nm; manufactured by Nissan CHEMICAL Industries, Limited), SZR-M (manufactured by Sakai CHEMICAL Industry Co., Ltd.) or HXU-120JC (SUMITOMO) Made by Osaka Cement Company, Limited).

作為含金屬粒子中的金屬元素的含有比率(元素組成),含有Ti以及Zr且其比例以Ti/Zr比計1~40為較佳,1~30為更佳,3~20為進一步較佳,4~12為更佳,4~9為最佳。滿足該種數値範圍時,能夠在維持高折射率之同時提高組成物的保存性,因此較佳。The content ratio (elemental composition) of the metal element in the metal-containing particles contains Ti and Zr, and the ratio thereof is preferably from 1 to 40 in terms of Ti/Zr ratio, more preferably from 1 to 30, still more preferably from 3 to 20. 4 to 12 is better, and 4 to 9 is the best. When such a range of numbers is satisfied, it is preferable to maintain the high refractive index while improving the preservability of the composition.

含有Ti以及Si時,其比例以Ti/Si比計1~40為較佳,1~30為更佳,1~10進一步較佳。When Ti and Si are contained, the ratio is preferably from 1 to 40 in terms of Ti/Si ratio, more preferably from 1 to 30, still more preferably from 1 to 10.

含有Ti以及Sn時,其比例以Ti/Sn比計1~30為較佳,1~20為更佳,1~10為進一步較佳。When Ti and Sn are contained, the ratio is preferably 1 to 30 in terms of Ti/Sn ratio, more preferably 1 to 20, and still more preferably 1 to 10.

~金屬元素的含有率的測定~- Determination of the content of metal elements ~

另外,關於含金屬粒子的金屬元素的含有率,以利用X射線熒光分析法(Rigaku Co., Ltd製造 Primus II型X射線熒光分析裝置)來確定之元素組成(原子%)進行評價。關於複數個元素的比率,求出各元素組成(原子%),並以各自的元素組成(原子%)的比率進行評價。另外,作為莫耳數的比率來求出元素組成比時,亦為相同含義。In addition, the content ratio of the metal element containing the metal particle was evaluated by the elemental composition (atomic %) determined by X-ray fluorescence analysis (primus type II X-ray fluorescence analyzer manufactured by Rigaku Co., Ltd.). Regarding the ratio of the plurality of elements, the composition of each element (atomic %) was determined and evaluated in terms of the ratio of the respective elemental compositions (atomic %). Further, when the element composition ratio is obtained as the ratio of the molar number, the same meaning is also obtained.

含金屬粒子的表面處理可以係任意態様,例如可舉出藉由後述之界面活性劑處理之態様、以含有其他金屬之處理劑處理之態様等。例如可舉出,形成特定含金屬粒子,並在其表面形成另一種含金屬物質等的被覆膜之態様。或者,亦可將另一種含金物質等的被覆膜設為較厚來作為核殼型含金屬粒子。關於核與殼的比率,將整個粒子設為100質量份時,核的比率為85質量份以上為較佳,87質量份以上為更佳,90質量份以上為特佳。上限實際上為97質量份以下。關於構成核與殼之材料的組合,可舉出以含有Ti、Sn等之粒子構成核,並以含有Zr之被覆膜、含有Si之被覆膜或含有Zr以及Si之被覆膜構成殼之例子。The surface treatment of the metal-containing particles may be in any state, and examples thereof include a state in which a surfactant is treated by a later-described surfactant, a state in which a treatment agent containing another metal is used, and the like. For example, a state in which a specific metal-containing particle is formed and a coating film containing another metal-containing substance or the like is formed on the surface thereof can be mentioned. Alternatively, another coating film containing a gold-containing substance or the like may be made thick as a core-shell type metal-containing particle. When the ratio of the core to the shell is 100 parts by mass, the ratio of the core is preferably 85 parts by mass or more, more preferably 87 parts by mass or more, and particularly preferably 90 parts by mass or more. The upper limit is actually 97 parts by mass or less. The combination of the material constituting the core and the shell is a core composed of particles containing Ti, Sn, or the like, and is formed of a coating film containing Zr, a coating film containing Si, or a coating film containing Zr and Si. An example.

含金屬粒子的含量在組成物的固體成分中10質量%以上為較佳,20質量%以上為更佳,30質量%以上為進一步較佳,40質量%以上為特佳。作為上限,95質量%以下為較佳,90質量%以下為更佳,85質量%以下為進一步較佳,80質量%以下為特佳。The content of the metal-containing particles is preferably 10% by mass or more, more preferably 20% by mass or more, more preferably 30% by mass or more, and particularly preferably 40% by mass or more. The upper limit is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less, and particularly preferably 80% by mass or less.

含金屬粒子可單獨使用1種,亦可組合2種以上來使用。The metal-containing particles may be used singly or in combination of two or more.

另外,本說明書中,固體成分(固體含量)係,以170℃進行6個小時乾燥處理時不會因揮發或蒸發而消失之成分。典型地指溶劑和分散介質以外的成分。In the present specification, the solid content (solid content) is a component which does not disappear by volatilization or evaporation when dried at 170 ° C for 6 hours. It generally refers to components other than the solvent and dispersion medium.

本發明中使用之含金屬粒子能夠藉由常規方法製造。例如,如後述實施例,將成為構成元素之金屬的鹽添加到形成溶膠之介質中,進一步依據需要添加鹼或酸,藉此獲得分散溶膠(濾餅)。另外,介質係酸或鹼時,無需追加添加該些。可舉出藉由加熱該溶膠,進行固體化並粉末化之例子。此時,藉由將欲混合之金屬元素的鹽添加到上述溶膠中,能夠獲得複合金屬的粒子。或者,預先一次性形成核粒子,而且與此同時與上述同樣地形成含有所希望的金屬鹽之溶膠。藉由對溶膠進行加熱,並對已固體化者進行粉碎等,能夠獲得核殼型的粒子。The metal-containing particles used in the present invention can be produced by a conventional method. For example, as described in the following examples, a salt of a metal which is a constituent element is added to a medium which forms a sol, and a base or an acid is further added as needed, thereby obtaining a dispersion sol (filter cake). Further, when the medium is an acid or a base, it is not necessary to add these additional amounts. An example of solidifying and pulverizing by heating the sol is mentioned. At this time, by adding the salt of the metal element to be mixed to the above sol, particles of the composite metal can be obtained. Alternatively, the core particles are formed in advance at a time, and at the same time, a sol containing a desired metal salt is formed in the same manner as described above. The core-shell type particles can be obtained by heating the sol and pulverizing the solidified person.

作為成為原料之金屬鹽,可舉出上述中例示之各金屬的鹽。具體而言,可舉出四氯化鈦、錫酸鉀、氧氯化鋯、氧氯化鋁、氯化鋁等。The metal salt to be used as a raw material may, for example, be a salt of each of the metals exemplified above. Specific examples thereof include titanium tetrachloride, potassium stannate, zirconium oxychloride, aluminum oxychloride, and aluminum chloride.

作為形成溶膠之溶劑,可舉出:氨水、氫氧化鉀、氫氧化鈉等鹼性水溶液;鹽酸、硝酸、硫酸等酸性水溶液等。或者,還可舉出使用水或各種有機介質來溶解金屬醇鹽之溶膠凝膠法等。Examples of the solvent for forming the sol include an aqueous alkaline solution such as ammonia water, potassium hydroxide or sodium hydroxide; an acidic aqueous solution such as hydrochloric acid, nitric acid or sulfuric acid. Alternatively, a sol-gel method or the like in which a metal alkoxide is dissolved using water or various organic media may be mentioned.

作為能夠在本發明中適用之含金屬粒子的製造方法,例如能夠參閱日本特開2008-69193的段落<0015>~<0043>中記載的方法。又,作為其具體含金屬粒子,能夠利用日本特開2008-69193的段落<0015>~<0043>中記載者,藉由引用引入本申請中。For example, the method described in paragraphs <0015> to <0043> of JP-A-2008-69193 can be referred to as a method for producing a metal-containing particle which can be used in the present invention. Further, the specific metal-containing particles can be referred to in the paragraphs <0015> to <0043> of JP-A-2008-69193, which is incorporated herein by reference.

<矽氧烷樹脂><矽 oxyalkylene resin>

以下述條件(a)或(b)含有矽氧烷樹脂。The rhodium oxide resin is contained under the following conditions (a) or (b).

(條件(a))(Condition (a))

條件(a)中,規定矽氧烷樹脂具有酸性基(A)。將滿足該條件者稱為矽氧烷樹脂(I)。矽氧烷樹脂(I)所具有之酸性基(A)的pKa為5.5以下為較佳,5以下為更佳,4以下為特佳。雖然並無特別下限值,但實際上為-3以上。In the condition (a), the oxirane resin is defined to have an acidic group (A). The person who satisfies this condition is referred to as a decane resin (I). The pKa of the acidic group (A) of the decane resin (I) is preferably 5.5 or less, more preferably 5 or less, and particularly preferably 4 or less. Although there is no special lower limit, it is actually -3 or more.

pKa係用於定量地表示酸強度的指標之一,與酸度常數的含義相同。係考慮到從酸放出氫離子之離解反應,將其平衡常數Ka以其負的常用對數pKa表示者。pKa越小,表示酸度越強。本說明書中無特別限定,採用利用ACD/Labs(Advanced Chemistry Development Ltd.製造)等計算出之值。下述內容表示代表性的取代基的計算例。The pKa is one of the indexes for quantitatively indicating the acid strength, and has the same meaning as the acidity constant. Considering the dissociation reaction of hydrogen ions from the acid, the equilibrium constant Ka is expressed by its negative common logarithm pKa. The smaller the pKa, the stronger the acidity. In the present specification, the value calculated by ACD/Labs (manufactured by Advanced Chemistry Development Ltd.) or the like is used. The following examples show calculation examples of representative substituents.

取代基      pKa -COOH     4.14 -SO3 H     -2.80 -PO4 H2 2.12、(2段 7.06)Substituent pKa -COOH 4.14 -SO 3 H -2.80 -PO 4 H 2 2.12, (2 segments 7.06)

上述酸性基(A)係選自羧基、磷酸基、膦酸基以及磺酸基之至少一種為較佳,羧基、膦酸基以及磺酸基為更佳。The acidic group (A) is preferably at least one selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, and a sulfonic acid group, and a carboxyl group, a phosphonic acid group, and a sulfonic acid group are more preferred.

矽氧烷樹脂(I)至少係使包含下述式(S)的烷氧基矽烷化合物之矽烷化合物進行水解縮合反應而成之樹脂(水解縮合物)為較佳。至少係包括下述式(S)的烷氧基矽烷化合物與以下述式(1)~(3)的任一個表示之烷氧基矽烷化合物之矽烷化合物的水解縮合物為更佳。至少係包括下述式(S)的烷氧基矽烷化合物與以下述式(1)表示之烷氧基矽烷化合物之矽烷化合物的水解縮合物反應物為進一步較佳。The oxime resin (I) is preferably a resin (hydrolysis condensate) obtained by subjecting a decane compound containing an alkoxy decane compound of the following formula (S) to a hydrolysis condensation reaction. The hydrolyzed condensate of the alkoxy decane compound of the following formula (S) and the decane compound of the alkoxy decane compound represented by any one of the following formulas (1) to (3) is more preferable. It is further preferred to include at least a hydrolysis condensate reactant of an alkoxydecane compound of the following formula (S) and a decane compound of an alkoxydecane compound represented by the following formula (1).

(RS1e Si(RS2f (ORS3g (S)(R S1 ) e Si(R S2 ) f (OR S3 ) g (S)

RS1 係含有酸性基(A)之基團。如上所述,酸性基(A)的較佳者亦與上述含義相同。酸性基(A)經由連結基與Si鍵結時,作為其連結基的例子,可舉出後述連結基L。R S1 is a group containing an acidic group (A). As described above, the preferred one of the acidic group (A) is also the same as defined above. When the acidic group (A) is bonded to Si via a linking group, examples of the linking group thereof include a linking group L to be described later.

其中,RS1 係以下述式(S1)表示之基團為較佳。Among them, R S1 is preferably a group represented by the following formula (S1).

RA -Lt-Ls-(Lu)ns -*     (S1)R A -Lt-Ls-(Lu) ns -* (S1)

RA 係酸性基(A)。R A is an acidic group (A).

Lt與以單鍵或後述連結基L定義之烴連結基的含義相同,其較佳之範圍亦相同含義。其中,Lt係碳原子數1~10的亞烷基(碳原子數1~6為更佳,1~3為進一步較佳)或碳原子數6~22的亞芳基(碳原子數6~10為更佳)為較佳。Lt可進一步具有取代基T。又,作為取代基,可舉出羥基和烷基(碳原子數1~6為較佳,1~3為進一步較佳)、芳基(碳原子數6~10為較佳)等。Lt has the same meaning as a hydrocarbon linking group defined by a single bond or a linking group L described later, and the preferred range thereof has the same meaning. Among them, Lt is an alkylene group having 1 to 10 carbon atoms (more preferably 1 to 6 carbon atoms, further preferably 1 to 3) or an arylene group having 6 to 22 carbon atoms (carbon number 6~) 10 is better) is preferred. Lt may further have a substituent T. Further, examples of the substituent include a hydroxyl group and an alkyl group (preferably having 1 to 6 carbon atoms, more preferably 1 to 3), and an aryl group (having preferably 6 to 10 carbon atoms).

Ls與以後述連結基L定義之雜連結基的含義相同,其較佳之範圍亦相同含義。其中,Ls係醚基(-O-)或銨連結基(-NRN 2 + -)為較佳。Ls has the same meaning as the hetero-linking group defined by the linking group L described later, and the preferred range thereof has the same meaning. Among them, an Ls-based ether group (-O-) or an ammonium linking group (-NR N 2 + -) is preferred.

Lu與以後述連結基L定義之烴連結基的含義相同,其較佳之範圍亦相同含義。其中,Lu係碳原子數為1~10的亞烷基(碳原子數1~6為更佳,1~3為進一步較佳)或碳原子數6~22的亞芳基(碳原子數6~10為更佳)為較佳。Lu可進一步具有取代基T。Lu has the same meaning as the hydrocarbon linking group defined by the linking group L described later, and the preferred range thereof has the same meaning. Among them, Lu is an alkylene group having 1 to 10 carbon atoms (more preferably 1 to 6 carbon atoms, further preferably 1 to 3) or an arylene group having 6 to 22 carbon atoms (carbon number 6) ~10 is better) is preferred. Lu may further have a substituent T.

ns係0或1。上述Ls係醚基時,ns係0為較佳。上述Ls係銨連結基時,ns係1為較佳。Ns is 0 or 1. When the Ls is an ether group, ns is preferably 0. When the Ls is an ammonium linkage, the ns system 1 is preferred.

另外,酸性基(A)可形成鹽。但是,不包括形成酯或酸酐者。銨連結基亦可形成鹽。或者,亦可消除其末端的酸性基和電荷而形成甜菜鹼結構。Further, the acidic group (A) can form a salt. However, those which form esters or anhydrides are not included. The ammonium linking group can also form a salt. Alternatively, the acid group and charge at the end may be eliminated to form a betaine structure.

RS2 以及RS3 係分別獨立地與後述R1 相同含義的基團。其較佳之範圍亦相同含義。R S2 and R S3 are each a group having the same meaning as R 1 described below. The preferred range also has the same meaning.

RS1 ~RS3 亦可分別獨立地具有任意取代基T。或者,亦可相鄰者相互鍵結乃至縮合而形成環。R S1 to R S3 may each independently have an arbitrary substituent T. Alternatively, the adjacent ones may be bonded to each other or even condensed to form a ring.

e係1~3的整數,1或2為較佳,1為特佳。f係0~2的整數,0或1為較佳。g係1~3的整數,2或3為較佳。e+g+f係4。e is an integer from 1 to 3, preferably 1 or 2, and 1 is particularly preferred. f is an integer from 0 to 2, and 0 or 1 is preferred. g is an integer from 1 to 3, and 2 or 3 is preferred. e+g+f is 4.

另外,可單獨利用式(S1)的化合物,亦可組合2種以上來使用。Further, the compound of the formula (S1) may be used singly or in combination of two or more.

作為滿足上述式(S)之矽烷化合物的具體例子,例如可舉出以後述實施例表示之AX-1~AX-6等。Specific examples of the decane compound satisfying the above formula (S) include AX-1 to AX-6 and the like which are shown in Examples to be described later.

具有酸性基(A)之烷氧基矽烷化合物的合成依據常規方法即可。作為其具體的化合物,例如能夠利用日本專利公開2012-180334的<0016>~<0026>段落中公開的烷氧基矽烷化合物,引用並收進本說明書中。The synthesis of the alkoxydecane compound having an acidic group (A) can be carried out according to a conventional method. As the specific compound, for example, the alkoxydecane compound disclosed in the paragraphs <0016> to <0026> of Japanese Patent Laid-Open Publication No. 2012-180334 can be referred to and incorporated herein by reference.

(條件(b))(Condition (b))

該條件(b)中,矽氧烷樹脂係具有矽烷醇基之矽氧烷樹脂(稱為矽氧烷樹脂(II)),並且還包括鹼可溶性樹脂。關於鹼可溶性樹脂,改變項目,在後面進行詳細敘述。具有矽烷醇基之矽氧烷樹脂(II)無特別限制,不具有酸性基(A)為較佳,能夠適當地使用一般用作該種樹脂者。例如,能夠恰當地利用恰當利用烷氧基矽烷化合物或者進行組合並經過水解縮合反應而得之樹脂。In the condition (b), the decane resin is a decyl alcohol-based decane resin (referred to as a decane resin (II)), and further includes an alkali-soluble resin. The item of the alkali-soluble resin will be described in detail later. The nonanelkene resin (II) having a stanol group is not particularly limited, and an acidic group (A) is not preferred, and those generally used as such a resin can be suitably used. For example, a resin obtained by suitably using an alkoxydecane compound or combining and undergoing a hydrolysis condensation reaction can be suitably used.

矽氧烷樹脂(II)係使以下述式(1)~(3)的任一個表示之烷氧基矽烷化合物進行水解縮合反應而成之樹脂為較佳。又,使以使(1)表示之化合物與以式(2)表示之化合物一同進行水解縮合反應而得者為較佳。或者,可使式(1)的化合物與式(3)的化合物一同進行水解縮合反應,亦可設為使式(2)的化合物與式(3)的化合物、或者式(1)的化合物、式(2)的化合物以及式(3)的化合物一同進行水解縮合反應而得者。另外,可將各式的化合物分別利用一種,亦可利用2種以上。The oxime resin (II) is preferably a resin obtained by subjecting an alkoxy decane compound represented by any one of the following formulas (1) to (3) to a hydrolysis condensation reaction. Further, it is preferred that the compound represented by the formula (1) is subjected to a hydrolysis condensation reaction together with the compound represented by the formula (2). Alternatively, the compound of the formula (1) may be subjected to a hydrolysis condensation reaction together with the compound of the formula (3), or a compound of the formula (2) and a compound of the formula (3) or a compound of the formula (1) may be used. The compound of the formula (2) and the compound of the formula (3) are subjected to a hydrolysis condensation reaction. In addition, one type of each of the compounds may be used alone or two or more types may be used.

(R1a Si(OR24-a (1)(R 1 ) a Si(OR 2 ) 4-a (1)

R1 以及R2 分別獨立地表示氫原子或烴基。烴基為烷基(碳原子數1~12為較佳,1~6為更佳,1~3為特佳)、烯基(碳原子數2~12為較佳,2~6為更佳)、炔基(碳原子數2~12為較佳,2~6為更佳)、芳基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)、芳烷基(碳原子數7~23為較佳,7~15為更佳,7~11為特佳)為較佳,烷基、芳基或烯基為更佳。R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group. The hydrocarbon group is an alkyl group (preferably having 1 to 12 carbon atoms, more preferably 1 to 6 or more preferably 1 to 3), or an alkenyl group (having preferably 2 to 12 carbon atoms and more preferably 2 to 6 carbon atoms). An alkynyl group (preferably having 2 to 12 carbon atoms, more preferably 2 to 6) or an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 14 or more preferably 6 to 10). An aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 15 and most preferably 7 to 11) is preferred, and an alkyl group, an aryl group or an alkenyl group is more preferred.

a為0、1或2。a is 0, 1, or 2.

R3 Si(R4C (OR53-C (2)R 3 Si(R 4 ) C (OR 5 ) 3-C (2)

R3 係含官能基之基團(除了酸性基(A))。作為官能基,在結構內含有雜原子(S、O、N、P、Si等)之基團為較佳。或者,包含聚合性基或者鹼性基為較佳。係(甲基)丙烯醯氧基、硫醇基(氫硫基(Sulfanyl group))、環氧基、氧雜環丁烷基、縮水甘油基、環氧丙氧基、羥基、酚羥基、氨基、異氰酸酯基、尿素基或具有該些的取代基之基團。R3 經由連結基與Si鍵結時,作為其連結基的例子,可舉出後述連結基L,其中,烴連結基為較佳。即便係酸性基(A)(羧基、磺酸基、磷酸基、膦酸基),其酯或酸酐包含於R3 的官能基中。氨基亦可形成鹽。另外,本說明書中,稱為“丙烯酸”或“丙烯醯”時,廣泛地指不僅包括丙烯醯基,還包括其衍生結構者,視為包括在丙烯醯基的α位具有特定的取代基之結構者。但是,狹義上,將α位係氫原子時,有時稱為丙烯酸或丙烯醯。有時將在α位具有甲基者稱為甲基丙烯酸,且指丙烯酸(α位為氫原子)和甲基丙烯酸(α位為甲基)的任一者,而稱為(甲基)丙烯酸等。R 3 is a group containing a functional group (except for the acidic group (A)). As the functional group, a group containing a hetero atom (S, O, N, P, Si, etc.) in the structure is preferred. Alternatively, a polymerizable group or a basic group is preferred. (Meth) propylene decyloxy, thiol group (Sulfanyl group), epoxy group, oxetane group, glycidyl group, glycidoxy group, hydroxyl group, phenolic hydroxyl group, amino group , isocyanate group, urea group or a group having such a substituent. When R 3 is bonded to Si via a linking group, examples of the linking group include a linking group L which will be described later, and a hydrocarbon linking group is preferred. Even based acidic group (A) (carboxyl group, a sulfonic acid group, a phosphoric acid group, phosphonic acid group), an ester or anhydride functional group contained in R 3. The amino group can also form a salt. In addition, in the present specification, when it is referred to as "acrylic acid" or "acrylonitrile", it is broadly understood to include not only an acrylonitrile group but also a derivative structure thereof, and it is considered to include a specific substituent at the α-position of the acryl fluorenyl group. Structure. However, in the narrow sense, when the α-position is a hydrogen atom, it is sometimes called acrylic acid or acrylonitrile. Sometimes a person having a methyl group at the α position is referred to as methacrylic acid, and refers to any one of acrylic acid (the α position is a hydrogen atom) and methacrylic acid (the α position is a methyl group), and is called (meth)acrylic acid. Wait.

R4 以及R5 係分別獨立地為與R1 相同含義的基團。R 4 and R 5 are each independently a group having the same meaning as R 1 .

c為0~2的整數,0或1為較佳。c is an integer from 0 to 2, and 0 or 1 is preferred.

R6 3 Si-X-(SiR7 3d (3)R 6 3 Si-X-(SiR 7 3 ) d (3)

R6 以及R7 分別獨立地為與上述R1 相同含義的基團,或者為烷氧基(碳原子數1~12為較佳,1~6為更佳,1~3為特佳)、鏈烯氧基(碳原子數2~12為較佳,2~6為更佳)、炔氧基(碳原子數2~12為較佳,2~6為更佳)、芳氧基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)或芳烷氧基(碳原子數7~23為較佳,7~15為更佳,7~11為特佳)。複數個R6 以及R7 中1~4個可以是R3 的基團。R 6 and R 7 are each independently a group having the same meaning as the above R 1 or an alkoxy group (preferably having 1 to 12 carbon atoms, more preferably 1 to 6 or more preferably 1 to 3). Alkenyloxy group (preferably having 2 to 12 carbon atoms, more preferably 2 to 6), alkynyloxy group (preferably having 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms) or aryloxy group (carbon) The number of atoms is preferably from 6 to 22, more preferably from 6 to 14, more preferably from 6 to 10, or from aralkyloxy groups (from 7 to 23, more preferably from 7 to 15 and from 7 to 11). Very good). One to four of the plurality of R 6 and R 7 may be a group of R 3 .

X為2價以上的連結基。X為2價的連結基時,可舉出後述連結基L的例子。具體而言,可舉出S、O、CO、NRN 、聚硫基(S為2~6個)等。X為3價的連結基時,例如可舉出異氰脲酸骨架。d為1~4的整數,1或2為較佳。X is a linking group of two or more valences. When X is a divalent linking group, an example of a linking group L to be described later may be mentioned. Specific examples thereof include S, O, CO, NR N and a polysulfide group (S to 2 or 6). When X is a trivalent linking group, for example, an isocyanuric acid skeleton can be mentioned. d is an integer of 1-4, and 1 or 2 is preferable.

R1 ~R7 可分別獨立地具有任意取代基T。又,可在發揮本發明的效果之範圍內,與連結基L一同與矽原子鍵結。或者相鄰者可相互鍵結乃至縮合而形成環。R 1 to R 7 may each independently have an arbitrary substituent T. Further, in the range in which the effects of the present invention are exerted, it is bonded to the ruthenium atom together with the linking group L. Alternatively, the adjacent members may be bonded to each other or even condensed to form a ring.

以式(1)表示之矽烷化合物的例子:An example of a decane compound represented by the formula (1):

作為3官能性矽烷化合物,例如可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三丙氧基矽烷、甲基三異丙氧基矽烷、甲基三正丁氧基矽烷、甲基三叔丁氧基矽烷、甲基三仲叔丁氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、丙基三甲氧基矽烷、丁基三甲氧基矽烷、戊基三甲氧基矽烷、環戊基三甲氧基矽烷、己基三甲氧基矽烷、環己基三甲氧基矽烷、十八烷基三甲氧基矽烷、十八烷基三乙氧基矽烷、苯基三甲氧基矽烷、苯基三乙氧基矽烷、苯基三異丙氧基、1-萘基三甲氧基矽烷、2-萘基三甲氧基矽烷、十七氟癸基三甲氧基矽烷、十七氟癸基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、p-苯乙烯基三甲氧基矽烷、烯丙基三甲氧基矽烷等。Examples of the trifunctional decane compound include methyltrimethoxydecane, methyltriethoxydecane, methyltripropoxydecane, methyltriisopropoxydecane, and methyltri-n-butoxy group. Decane, methyl tri-tert-butoxy decane, methyl tri-sec-butoxybutane, ethyl trimethoxy decane, ethyl triethoxy decane, propyl trimethoxy decane, butyl trimethoxy decane, Amyl methoxy decane, cyclopentyl trimethoxy decane, hexyl trimethoxy decane, cyclohexyl trimethoxy decane, octadecyl trimethoxy decane, octadecyl triethoxy decane, phenyl trimethyl Oxydecane, phenyltriethoxydecane, phenyltriisopropoxy, 1-naphthyltrimethoxynonane, 2-naphthyltrimethoxynonane, heptadecafluorodecyltrimethoxydecane, seventeen Fluorinated triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, p-styryl trimethoxy decane, allyl trimethoxy decane, and the like.

作為2官能性矽烷化合物,例如可舉出二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二苯基二甲氧基矽烷、二苯基二乙氧基矽烷、甲基苯基二甲氧基矽烷、甲基乙烯基二甲氧基矽烷、甲基乙烯基二乙氧基矽烷、環己基甲基二甲氧基矽烷等。Examples of the bifunctional decane compound include dimethyl dimethoxy decane, dimethyl diethoxy decane, diphenyl dimethoxy decane, diphenyl diethoxy decane, and methyl benzene. Dimethoxy decane, methyl vinyl dimethoxy decane, methyl vinyl diethoxy decane, cyclohexyl methyl dimethoxy decane, and the like.

作為4官能性矽烷化合物,例如可舉出四甲氧基矽烷、四乙氧基矽烷等。The tetrafunctional decane compound may, for example, be tetramethoxy decane or tetraethoxy decane.

以式(2)表示之矽烷化合物的例子:An example of a decane compound represented by the formula (2):

作為3官能性矽烷化合物,例如可舉出3-縮水甘油醚丙基三甲氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-甲基烯丙基氧基丙基三乙氧基矽烷、γ-丙烯醯氧基三甲氧基矽烷、γ-丙烯醯氧基丙基三乙氧基矽烷、縮水甘油醚甲基三甲氧基矽烷、縮水甘油醚甲基三乙氧基矽烷、α-縮水甘油醚乙基三甲氧基矽烷、α-縮水甘油醚乙基三乙氧基矽烷、β-縮水甘油醚乙基三甲氧基矽烷、β-縮水甘油醚乙基三乙氧基矽烷、α-縮水甘油醚丙基三甲氧基矽烷、α-縮水甘油醚丙基三乙氧基矽烷、β-縮水甘油醚丙基三甲氧基矽烷、β-縮水甘油醚丙基三乙氧基矽烷、γ-縮水甘油醚丙基三甲氧基矽烷、γ-縮水甘油醚丙基三乙氧基矽烷、γ-縮水甘油醚丙基三丙氧基矽烷、γ-縮水甘油醚丙基三異丙氧基矽烷、γ-縮水甘油醚丙基三正丁氧基矽烷、γ-縮水甘油醚丙基三叔丁氧基矽烷、γ-縮水甘油醚丙基三仲丁氧基矽烷、γ-縮水甘油醚丙基三甲氧基矽烷、α-縮水甘油醚丁基三甲氧基矽烷、α-縮水甘油醚叔丁基三甲氧基矽烷、α-縮水甘油醚叔丁基三乙氧基矽烷、α-縮水甘油醚叔丁基三乙氧基矽烷、β-縮水甘油醚丁基三甲氧基矽烷、β-縮水甘油醚丁基三乙氧基矽烷、γ-縮水甘油醚丁基三甲氧基矽烷、γ-縮水甘油醚丁基三乙氧基矽烷、δ-縮水甘油醚丁基三甲氧基矽烷、δ-縮水甘油醚丁基三乙氧基矽烷、(3,4-環氧環己基)甲基三甲氧基矽烷、(3,4-環氧環己基)甲基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷、2-(3,4-環氧環己基)乙基三丙氧基矽烷、2-(3,4-環氧環己基)乙基三叔丁氧基矽烷、2-(3,4-環氧環己基)乙基三正丁氧基矽烷、2-(3,4-環氧環己基)乙基三仲丁氧基矽烷、3-(3,4-環氧環己基)丙基三甲氧基矽烷、3-(3,4-環氧環己基)丙基三乙氧基矽烷、4-(3,4-環氧環己基)丁基三甲氧基矽烷、4-(3,4-環氧環己基)丁基三乙氧基矽烷、3-氨丙基三甲氧基矽烷、N-2-(氨乙基)-3-氨丙基三甲氧基矽烷、3-巰丙基三甲氧基矽烷、3-異氰酸酯丙基三乙氧基矽烷、3-三甲氧基甲矽烷基丙基琥珀酸酸酐、3-脲丙基三乙氧基矽烷等。Examples of the trifunctional decane compound include 3-glycidyl ether propyl trimethoxy decane, γ-methyl propylene methoxy propyl trimethoxy decane, and γ-methyl allyoxypropyl three. Ethoxy decane, γ-propylene decyloxytrimethoxy decane, γ-propylene methoxy propyl triethoxy decane, glycidyl ether methyl trimethoxy decane, glycidyl ether methyl triethoxy decane , α-glycidyl ether ethyl trimethoxy decane, α-glycidyl ether ethyl triethoxy decane, β-glycidyl ether ethyl trimethoxy decane, β-glycidyl ether ethyl triethoxy decane , α-glycidyl ether propyl trimethoxy decane, α-glycidyl ether propyl triethoxy decane, β-glycidyl ether propyl trimethoxy decane, β-glycidyl ether propyl triethoxy decane , γ-glycidyl ether propyl trimethoxy decane, γ-glycidyl ether propyl triethoxy decane, γ-glycidyl ether propyl tripropoxy decane, γ-glycidyl ether propyl triisopropyloxide Base decane, γ-glycidyl ether propyl tri-n-butoxy decane, γ-glycidyl ether propyl tri-tert-butoxy decane Γ-glycidyl ether propyl tri-sec-butoxy oxane, γ-glycidyl ether propyl trimethoxy decane, α-glycidyl ether butyl trimethoxy decane, α-glycidyl ether tert-butyl trimethoxy decane , α-glycidyl ether tert-butyl triethoxy decane, α-glycidyl ether tert-butyl triethoxy decane, β-glycidyl ether butyl trimethoxy decane, β-glycidyl ether butyl triethyl Oxydecane, γ-glycidyl ether butyl trimethoxy decane, γ-glycidyl ether butyl triethoxy decane, δ-glycidyl ether butyl trimethoxy decane, δ-glycidyl ether butyl triethyl Oxydecane, (3,4-epoxycyclohexyl)methyltrimethoxydecane, (3,4-epoxycyclohexyl)methyltriethoxydecane, 2-(3,4-epoxycyclohexyl Ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltripropoxydecane, 2- (3,4-epoxycyclohexyl)ethyltri-tert-butoxydecane, 2-(3,4-epoxycyclohexyl)ethyltri-n-butoxydecane, 2-(3,4-epoxy ring Hexyl)ethyl tri-sec-butoxy Alkanes, 3-(3,4-epoxycyclohexyl)propyltrimethoxydecane, 3-(3,4-epoxycyclohexyl)propyltriethoxydecane, 4-(3,4-epoxy Cyclohexyl)butyltrimethoxydecane, 4-(3,4-epoxycyclohexyl)butyltriethoxydecane, 3-aminopropyltrimethoxydecane, N-2-(aminoethyl)- 3-aminopropyltrimethoxydecane, 3-mercaptopropyltrimethoxydecane, 3-isocyanatepropyltriethoxydecane, 3-trimethoxyformamidopropylsuccinic anhydride, 3-ureidopropyl Triethoxy decane and the like.

作為2官能性矽烷化合物,例如可舉出γ-縮水甘油醚丙基甲基二甲氧基矽烷、γ-丙烯醯氧基丙基甲基二甲氧基矽烷、γ-丙烯醯氧基丙基甲基二乙氧基矽烷、γ-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、γ-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、縮水甘油醚甲基二甲氧基矽烷、縮水甘油醚甲基甲基二乙氧基矽烷、α-縮水甘油醚乙基甲基二甲氧基矽烷、α-縮水甘油醚乙基甲基二乙氧基矽烷、β-縮水甘油醚乙基甲基二甲氧基矽烷、β-縮水甘油醚乙基甲基二乙氧基矽烷、α-縮水甘油醚丙基甲基二甲氧基矽烷、α-縮水甘油醚丙基甲基二乙氧基矽烷、β-縮水甘油醚丙基甲基二甲氧基矽烷、β-縮水甘油醚丙基甲基二乙氧基矽烷、γ-縮水甘油醚丙基甲基二甲氧基矽烷、γ-縮水甘油醚丙基甲基二乙氧基矽烷、γ-縮水甘油醚丙基甲基二丙氧基矽烷、β-縮水甘油醚丙基甲基二丁氧基矽烷、γ-縮水甘油醚丙基甲基二甲氧基乙氧基矽烷、γ-縮水甘油醚丙基乙基二甲氧基矽烷、γ-縮水甘油醚丙基乙基二乙氧基矽烷、γ-縮水甘油醚丙基乙烯基二甲氧基矽烷、γ-縮水甘油醚丙基乙烯基二乙氧基矽烷、3-甲基丙烯醯氧基丙基二甲氧基矽烷等。Examples of the bifunctional decane compound include γ-glycidyl ether propyl methyl dimethoxy decane, γ-propylene methoxy propyl methyl dimethoxy decane, and γ-propylene methoxy propyl group. Methyl diethoxy decane, γ-methyl propylene methoxy propyl methyl dimethoxy decane, γ-methyl propylene methoxy propyl methyl diethoxy decane, glycidyl ether methyl diol Methoxy decane, glycidyl ether methyl methyl diethoxy decane, α-glycidyl ether ethyl methyl dimethoxy decane, α-glycidyl ether ethyl methyl diethoxy decane, β- Glycidyl ether ethyl methyl dimethoxy decane, β-glycidyl ether ethyl methyl diethoxy decane, α-glycidyl ether propyl methyl dimethoxy decane, α-glycidyl ether propyl Methyl diethoxy decane, β-glycidyl ether propyl methyl dimethoxy decane, β-glycidyl ether propyl methyl diethoxy decane, γ-glycidyl ether propyl methyl dimethoxy Base decane, γ-glycidyl ether propyl methyl diethoxy decane, γ-glycidyl ether propyl methyl dipropoxy decane, β-glycidyl ether propyl methyl 2 Butoxy decane, γ-glycidyl ether propyl methyl dimethoxy ethoxy decane, γ-glycidyl ether propyl ethyl dimethoxy decane, γ-glycidyl ether propyl ethyl diethoxy Basear, γ-glycidyl ether propyl vinyl dimethoxy decane, γ-glycidyl ether propyl vinyl diethoxy decane, 3-methyl propylene methoxy propyl dimethoxy decane, and the like.

作為以式(3)表示之矽烷化合物,例如可舉出1,3-雙(3-氨丙基)四甲基二矽氧烷、1,3-雙(3-氨乙基)四甲基二矽氧烷、1,3-雙(3-氨丙基)四乙基二矽氧烷等。Examples of the decane compound represented by the formula (3) include 1,3-bis(3-aminopropyl)tetramethyldioxane and 1,3-bis(3-aminoethyl)tetramethyl. Dioxane, 1,3-bis(3-aminopropyl)tetraethyldioxane, and the like.

矽氧烷樹脂能夠利用上述之烷氧基矽烷化合物,經由水解反應以及縮合反應來獲得。作為水解縮合反應,能夠使用公知的方法,可依據需要而使用酸或鹼等催化劑。作為催化劑,只要是變更pH者,則並無特別限制,具體而言,作為酸(有機酸、無機酸),可舉出硝酸、磷酸、草酸、乙酸、蟻酸、鹽酸等。作為鹼,例如可舉出氨、三乙胺、乙二胺等。關於所使用之量,只要矽氧烷樹脂滿足規定分子量,則並無特別限定。The decane resin can be obtained by a hydrolysis reaction and a condensation reaction using the above alkoxydecane compound. As the hydrolysis condensation reaction, a known method can be used, and a catalyst such as an acid or a base can be used as needed. The catalyst is not particularly limited as long as it is a pH change. Specific examples of the acid (organic acid or inorganic acid) include nitric acid, phosphoric acid, oxalic acid, acetic acid, formic acid, and hydrochloric acid. Examples of the base include ammonia, triethylamine, ethylenediamine, and the like. The amount to be used is not particularly limited as long as the decane resin satisfies a predetermined molecular weight.

水解縮合反應的反應系統中,可依據需要添加溶劑。作為溶劑,只要能夠實施水解縮合反應,則並無特別限制,可舉出後述的溶劑的例子。其中,例如可舉出:水、甲醇、乙醇、丙醇、二丙酮醇、四氫糠醇等醇化合物;乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、二丙二醇甲醚等醚化合物;乙酸甲基、乙酸乙酯、乙酸丁基、γ-丁內酯、丙二醇單甲醚乙酸酯等酯化合物;丙酮、甲基乙基酮、甲基異戊基酮等酮化合物。In the reaction system of the hydrolysis condensation reaction, a solvent may be added as needed. The solvent is not particularly limited as long as it can carry out the hydrolysis condensation reaction, and examples of the solvent to be described later can be mentioned. Examples thereof include alcohol compounds such as water, methanol, ethanol, propanol, diacetone alcohol, and tetrahydrofurfuryl alcohol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and dipropylene glycol An ether compound such as ether; an ester compound such as methyl acetate, ethyl acetate, butyl acetate, γ-butyrolactone, propylene glycol monomethyl ether acetate; ketone such as acetone, methyl ethyl ketone or methyl isoamyl ketone; Compound.

關於水解縮合反應的條件(溫度、時間、溶劑量),依據所使用之材料的種類適當選擇較佳條件即可。The conditions (temperature, time, and amount of solvent) of the hydrolysis condensation reaction may be appropriately selected depending on the type of the material to be used.

本實施形態中使用之矽氧烷樹脂的重量平均分子量為2,000以上為較佳,3,000以上為特佳。作為上限,500,000以下為較佳,450,000以下為更佳,250,000以下為特佳。The weight average molecular weight of the decane resin used in the present embodiment is preferably 2,000 or more, and particularly preferably 3,000 or more. As the upper limit, 500,000 or less is preferable, 450,000 or less is more preferable, and 250,000 or less is particularly preferable.

本發明中,對於聚合物的分子量,除非另外指明,則指重量平均分子量,藉由凝膠滲透色譜法(GPC)以標準聚苯乙烯換算進行測量。測定裝置使用TOSOH CORPORATION製造的裝置。作為條件,設為基於下述條件1之條件。但是,依據聚合物種類,可進一步適當選用較佳載體(溶出劑)以及適於該載體之色譜柱。In the present invention, the molecular weight of the polymer, unless otherwise specified, means the weight average molecular weight, which is measured by gel permeation chromatography (GPC) in terms of standard polystyrene. The measuring device used a device manufactured by TOSOH CORPORATION. As conditions, the conditions based on the following condition 1 are set. However, depending on the kind of the polymer, a preferred carrier (dissolving agent) and a column suitable for the carrier can be further suitably selected.

(條件1)(Condition 1)

色譜柱:使用連接TOSOH TSKgel Super HZM-H、TOSOH TSKgel Super HZ4000、TOSOH TSKgel Super HZ2000之色譜柱 載體:四氫呋喃 測定溫度:40℃ 載體流量:1.0ml/min 試料濃度:0.1質量% 檢測器:RI(折射率)檢測器Column: using TOSOH TSKgel Super HZM-H, TOSOH TSKgel Super HZ4000, TOSOH TSKgel Super HZ2000 column carrier: tetrahydrofuran Determination temperature: 40 ° C Carrier flow rate: 1.0 ml / min Sample concentration: 0.1% by mass Detector: RI ( Refractive index) detector

矽氧烷樹脂的情況下,藉由二甲基甲醯胺以試料濃度成為0.3質量%之方式調整矽氧烷樹脂並進行測定。但是,依據其種類和分子量,可依據上述條件1進行測定。In the case of a decyl alkane resin, the decane resin was adjusted and measured by dimethylformamide at a sample concentration of 0.3% by mass. However, depending on the kind and molecular weight, the measurement can be carried out in accordance with the above condition 1.

雖然有部分重複之部分,但作為較佳矽氧烷樹脂(II),還可舉出下述者。Although there is a part which is repeated, as the preferred alkane resin (II), the following may be mentioned.

作為具有4個以上的烷氧基之烷氧基矽烷,例如,可舉出四甲氧基矽烷、四乙氧基矽烷、四乙醯氧基矽烷、四苯氧基矽烷、四甲氧基二矽氧烷、四乙氧基二矽氧烷、雙(三乙氧基丙基)四硫化物、三-(3-甲氧基甲矽烷基丙基)異氰脲酸酯、三-(3-三乙氧基甲矽烷基丙基)異氰脲酸酯。從提高硬化膜的耐化學性的觀點出發,為了使分量較高之9官能性矽烷與立體位阻較小之4官能性矽烷相互發生反應,4官能性矽烷與9官能性矽烷的混合物為較佳。Examples of the alkoxydecane having four or more alkoxy groups include tetramethoxynonane, tetraethoxydecane, tetraethoxydecane, tetraphenoxydecane, and tetramethoxy. Oxane, tetraethoxydioxane, bis(triethoxypropyl)tetrasulfide, tris-(3-methoxyformamidopropyl)isocyanurate, tri-(3) - Triethoxymethane alkyl propyl) isocyanurate. From the viewpoint of improving the chemical resistance of the cured film, in order to react a higher-component hexadecane decane with a tetrafunctional decane having a smaller steric hindrance, a mixture of a tetrafunctional decane and a hexa-functional decane is more preferable. good.

矽氧烷樹脂係與2官能或者3官能的烷氧基矽烷化合物的水解物縮合反應物為較佳。作為構成矽氧烷樹脂之烷氧基矽烷化合物,例如可舉出二甲氧基二甲基矽烷、二乙氧基二甲基矽烷、二甲氧基二苯基矽烷、二乙氧基二苯基矽烷、二羥基二苯基矽烷、二甲氧基(甲基)(苯基)矽烷、二乙氧基(甲基)(苯基)矽烷、二甲氧基(甲基)(苯乙基)矽烷、二環戊基二甲氧基矽烷或環己基二甲氧基(甲基)矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷或3-丙烯醯氧基丙基三乙氧基矽烷、3-三甲氧基甲矽烷基丙基琥珀酸酐、3-三乙氧基甲矽烷基丙基琥珀酸酐、3-三甲氧基甲矽烷基乙基琥珀酸酐、3-三甲氧基甲矽烷基丁基琥珀酸酐、3-縮水甘油基氧丙基三甲氧基矽烷、3-縮水甘油基氧丙基三乙氧基矽烷、3-(3,4-環氧環己基)丙基三甲氧基矽烷、3-(3,4-環氧環己基)丙基三乙氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷、苯基三甲氧基矽烷、苯乙基三甲氧基矽烷、萘基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三乙氧基矽烷、苯基三乙氧基矽烷、苯乙基三乙氧基矽烷、萘基三乙氧基矽烷、四甲氧基矽烷或四乙氧基矽烷。A hydrolyzate condensation reaction of a decane resin with a bifunctional or trifunctional alkoxydecane compound is preferred. Examples of the alkoxydecane compound constituting the siloxane oxide resin include dimethoxy dimethyl decane, diethoxy dimethyl decane, dimethoxy diphenyl decane, and diethoxy diphenyl. Baseline, dihydroxydiphenylnonane, dimethoxy(methyl)(phenyl)decane, diethoxy(methyl)(phenyl)decane,dimethoxy(methyl)(phenethyl) ) decane, dicyclopentyldimethoxydecane or cyclohexyldimethoxy(methyl)decane, 3-methylpropenyloxypropyltrimethoxydecane, 3-methylpropenyloxypropyl Triethoxydecane, 3-propenyloxypropyltrimethoxydecane or 3-propenyloxypropyltriethoxydecane, 3-trimethoxymethylidenepropyl succinic anhydride, 3-triethyl Oxymethane alkyl succinic anhydride, 3-trimethoxymethyl decyl ethyl succinic anhydride, 3-trimethoxymethyl decyl butyl succinic anhydride, 3-glycidoxy propyl trimethoxy decane, 3 - glycidyloxypropyltriethoxydecane, 3-(3,4-epoxycyclohexyl)propyltrimethoxydecane, 3-(3,4-epoxycyclohexyl)propyltriethyl Base decane, methyltrimethoxy decane, ethyltrimethoxy decane, phenyltrimethoxydecane, phenethyltrimethoxydecane, naphthyltrimethoxydecane, methyltriethoxydecane, ethyltri Ethoxy decane, phenyl triethoxy decane, phenethyl triethoxy decane, naphthyl triethoxy decane, tetramethoxy decane or tetraethoxy decane.

關於矽氧烷樹脂的含量,含有鹼可溶性樹脂時(條件(b)),減少矽氧烷樹脂的含量為較佳,不含有鹼可溶性樹脂時,加大矽氧烷樹脂的含量為較佳。亦即,含有鹼可溶性樹脂時,矽氧烷樹脂的含量在組成物的固體成分中為1質量%以上為較佳,2質量%以上為更佳,3質量%以上為特佳。作為上限,40質量%以下為較佳,30質量%以下為更佳。When the content of the decane resin is such that the alkali-soluble resin is contained (condition (b)), the content of the decane resin is preferably reduced. When the alkali-soluble resin is not contained, the content of the siloxane resin is preferably increased. In other words, when the alkali-soluble resin is contained, the content of the siloxane oxide is preferably 1% by mass or more, more preferably 2% by mass or more, and particularly preferably 3% by mass or more. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less.

另外,不含有鹼可溶性樹脂時,矽氧烷樹脂的含量在組成物的固體成分中為10質量%以上為較佳,15質量%以上為更佳,20質量%以上為特佳。作為上限,50質量%以下為較佳,40質量%以下為更佳。In addition, when the alkali-soluble resin is not contained, the content of the decane resin is preferably 10% by mass or more, more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less.

相對於含金屬粒子100質量份,1質量份以上為較佳,10質量份以上為更佳,15質量份以上為特佳。作為上限,80質量份以下為較佳,70質量份以下為更佳。With respect to 100 parts by mass of the metal-containing particles, 1 part by mass or more is preferable, 10 parts by mass or more is more preferable, and 15 parts by mass or more is particularly preferable. The upper limit is preferably 80 parts by mass or less, more preferably 70 parts by mass or less.

同時使用矽氧烷樹脂(I)和矽氧烷樹脂(II)時,其比率依據顯影性等所要求之性能進行調節即可,但是在將矽氧烷樹脂(II)設為100質量份時,矽氧烷樹脂(I)係20質量份以上為較佳,30質量份以上為更佳,50質量份以上為特佳。作為上限,90質量份以下為較佳,80質量份以下為更佳,70質量份以下為特佳。藉由在該範圍內適用具有顯影性之矽氧烷樹脂(I),即使不依據鹼可溶性樹脂,亦可獲得良好的顯影性,適合在條件(a)中應用。另一方面,即使係條件(b),也不會阻礙組合矽氧烷樹脂(I)來應用。換言之,作為其較佳之實施形態,本發明之條件(a)或(b)中包含下述態樣。When the decane resin (I) and the decane resin (II) are used at the same time, the ratio thereof is adjusted depending on the properties required for developability, etc., but when the siloxane oxide resin (II) is set to 100 parts by mass. The hafnium oxide resin (I) is preferably 20 parts by mass or more, more preferably 30 parts by mass or more, and particularly preferably 50 parts by mass or more. The upper limit is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, and particularly preferably 70 parts by mass or less. By applying the developable oxime resin (I) within this range, good developability can be obtained even without depending on the alkali-soluble resin, and it is suitable for use in the condition (a). On the other hand, even if the condition (b) is satisfied, the combined siloxane resin (I) is not hindered from being applied. In other words, as a preferred embodiment, the following aspects are included in the condition (a) or (b) of the present invention.

(i)雖然包含具有酸性基(A)之矽氧烷樹脂,但不包含鹼可溶性樹脂(i) Although it contains a siloxane resin having an acidic group (A), it does not contain an alkali-soluble resin.

(ii)包含具有酸性基(A)之矽氧烷樹脂,又,包含鹼可溶性樹脂(ii) a rhodium oxide resin having an acidic group (A), and further comprising an alkali soluble resin

(iii)包含不具有酸性基(A)之矽氧烷樹脂,又,包含鹼可溶性樹脂(iii) comprising a decyl alkane resin having no acidic group (A), and further comprising an alkali-soluble resin

上述中,(ii)或(iii)的態樣為特佳。Among the above, the aspect of (ii) or (iii) is particularly preferable.

矽氧烷樹脂可同時滿足條件(a)以及(b)。The decane resin can satisfy both conditions (a) and (b).

另外,本說明書中稱為矽氧烷樹脂時,基本上係指經烷氧基矽烷化合物的水解縮合反應而獲得之聚合物,但係亦包含基於其他反應之聚合物和成為原料之矽烷化合物其本身之含義。然而,在本發明中,矽氧烷樹脂係矽烷化合物的水解縮合反應物為較佳。另外,矽烷化合物的水解縮合反應可在含金屬粒子的共存下進行。此時,可形成矽烷化合物與含金屬粒子在其表面進行反應之“粒子-樹脂基體”或核為含金屬粒子、殼為矽烷化合物之“核殼結構”。Further, in the present specification, when it is referred to as a decane resin, it basically means a polymer obtained by a hydrolysis condensation reaction of an alkoxydecane compound, but also includes a polymer based on other reactions and a decane compound which becomes a raw material. The meaning of itself. However, in the present invention, a hydrolyzed condensation reaction product of a decane compound is a decane compound. Further, the hydrolysis condensation reaction of the decane compound can be carried out in the presence of metal-containing particles. At this time, a "particle-resin matrix" in which a decane compound and a metal-containing particle react on the surface thereof or a "core-shell structure" in which a core is a metal-containing particle and a shell is a decane compound can be formed.

<紫外線吸收劑><UV absorber>

本發明中,使用紫外線吸收劑為較佳。在其波長365nm下之莫耳吸光係數(單位:1mol-1 cm-1 )為5000以上為較佳,6500以上為更佳,8000以上為進一步較佳,10000以上為特佳。另一方面,波長400nm下之莫耳吸光係數為3500以下為較佳,2500以下為更佳,1500以下為特佳。另外,本說明書中,莫耳吸光係數除非另有指明,則係基於下述測定條件者。In the present invention, an ultraviolet absorber is preferably used. The molar absorption coefficient (unit: 1 mol -1 cm -1 ) at a wavelength of 365 nm is preferably 5,000 or more, more preferably 6500 or more, still more preferably 8,000 or more, and particularly preferably 10,000 or more. On the other hand, the Mohr absorption coefficient at a wavelength of 400 nm is preferably 3,500 or less, more preferably 2,500 or less, and particularly preferably 1,500 or less. In addition, in this specification, the molar absorption coefficient is based on the following measurement conditions unless otherwise specified.

<莫耳吸光係數的測定方法><Method for measuring Mohr absorption coefficient>

製備1.00×10-3 mol/L的氯仿溶液,並以以下順序測定吸光度,藉此計算各紫外線吸收劑的莫耳吸光係數。A 1.00 × 10 -3 mol/L chloroform solution was prepared, and the absorbance was measured in the following order, whereby the molar absorption coefficient of each ultraviolet absorber was calculated.

將調整為上述濃度之氯仿溶液放入內部空間的寬度為1cm之玻璃槽中,利用Agilent Technologies, Inc.製造的UV-Vis-NIR光譜儀(Cary5000)[商品名]測定吸光度。測定溫度設為25℃。將在此獲得之吸光度A代入下述式來計算莫耳吸光係數(mol-1 ・L・cm-1 )。The chloroform solution adjusted to the above concentration was placed in a glass tank having a width of 1 cm in the internal space, and the absorbance was measured using a UV-Vis-NIR spectrometer (Cary 5000) [trade name] manufactured by Agilent Technologies, Inc. The measurement temperature was set to 25 °C. The absorbance A obtained here was substituted into the following formula to calculate the molar absorptivity (mol -1 · L · cm -1 ).

ε=A/clε=A/cl

另外,上述式中,ε表示莫耳吸光係數(mol-1 ・L・cm-1 ),A表示吸光度,c表示濃度(mol/L),l表示光學路徑長度(cm)。濃度c為1.00×10-3 mol/L。光學路徑長度l相當於上述玻璃槽的內部空間的寬度,藉此成為1cm。Further, in the above formula, ε represents a molar absorption coefficient (mol -1 ·L·cm -1 ), A represents absorbance, c represents a concentration (mol/L), and 1 represents an optical path length (cm). The concentration c is 1.00 × 10 -3 mol / L. The optical path length l corresponds to the width of the internal space of the above-mentioned glass groove, thereby becoming 1 cm.

紫外線吸收劑只要具有上述光學特性,則能夠廣泛選用,具體而言,可舉出(苯并)三唑化合物、二苯甲酮化合物、二烯化合物、阿伏苯宗化合物、(苯并)二噻唑化合物、(苯并)二硫醇化合物、香豆素化合物或三嗪化合物等。此處的( )標記表示可以是苯并取代體亦可以不是。其中,若考慮高分辨率以及耐光性,則二烯化合物、阿伏苯宗化合物、苯并二硫醇化合物或三嗪化合物為較佳,二烯化合物、阿伏苯宗化合物或苯并二硫醇化合物為更佳,二烯化合物、阿伏苯宗化合物為進一步較佳。The ultraviolet absorber can be widely used as long as it has the above optical characteristics, and specific examples thereof include a (benzo)triazole compound, a benzophenone compound, a diene compound, an avobenzone compound, and a (benzo) compound. A thiazole compound, a (benzo)dithiol compound, a coumarin compound or a triazine compound. The ( ) mark here indicates that it may or may not be a benzo substituent. Among them, a diene compound, an avobenzone compound, a benzodithiol compound or a triazine compound is preferable in view of high resolution and light resistance, and a diene compound, an avobenzone compound or benzo disulfide compound. The alcohol compound is more preferable, and the diene compound and the avobenzone compound are further preferable.

本發明中使用之紫外線吸收劑由具有下述式(a)~(g)的任一骨架之化合物構成為較佳,其中,由具有式(d)~(g)的骨架之化合物構成為更佳,由具有式(d)~(f)的骨架之化合物構成為進一步較佳,由具有式(d)或(f)的骨架之化合物構成為特佳。作為該些骨架,能夠利用在規定範圍內具有任意取代基之化合物。作為任意的取代基,可舉出後述取代基T的例子。其中,可舉出烷基(碳原子數1~24為較佳,1~12為更佳,1~6為更佳,1~3為特佳)、羥基、烷氧基(碳原子數1~24為較佳,1~12為更佳,1~6為進一步較佳,1~3為特佳)、醯基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、芳基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)、雜環基(碳原子數1~12為較佳,2~5為更佳)。雜環基係含有N、O、S的任一個者為較佳,其中,含有N者為較佳。雜環基為5~7員環為較佳,5或6員環為更佳。尤其,式(a)~(f)的苯環中具有1個以上的上述取代基為較佳。苯環上的任意取代基有複數個時,可形成環。The ultraviolet absorber used in the present invention is preferably composed of a compound having any one of the following formulas (a) to (g), and is composed of a compound having a skeleton of the formulae (d) to (g). Preferably, it is further preferably composed of a compound having a skeleton of the formula (d) to (f), and is particularly preferably composed of a compound having a skeleton of the formula (d) or (f). As the skeleton, a compound having an arbitrary substituent within a predetermined range can be used. Examples of the optional substituent include an example of the substituent T described later. Among them, an alkyl group (preferably having 1 to 24 carbon atoms, more preferably 1 to 12, more preferably 1 to 6 or more preferably 1 to 3), a hydroxyl group or an alkoxy group (having 1 carbon atom) ~24 is more preferred, 1 to 12 is more preferred, 1 to 6 is further preferred, 1-3 is particularly preferred, and fluorenyl group is preferred (carbon number 2 to 24 is preferred, and 2 to 12 is more preferred, 2 ~6 is further preferred, 2 to 3 is particularly preferred), aryl (preferably having 6 to 22 carbon atoms, more preferably 6 to 14 or more preferably 6 to 10), and a heterocyclic group (carbon number) 1 to 12 is preferred, and 2 to 5 is more preferred). It is preferred that the heterocyclic group contains N, O or S, and those containing N are preferred. The heterocyclic group is preferably a 5 to 7 membered ring, and a 5 or 6 membered ring is more preferred. In particular, it is preferred that the benzene ring of the formulae (a) to (f) has one or more substituents. When there are a plurality of substituents on the benzene ring, a ring can be formed.

【化學式2】 [Chemical Formula 2]

式(f)中,RU1 以及RU2 分別獨立為取代基T,其中,氰基或醯基(碳原子數1~24為較佳,4~18為更佳)為較佳。RU1 以及RU2 可相同亦可不同。In the formula (f), R U1 and R U2 are each independently a substituent T, and a cyano group or a fluorenyl group (preferably having 1 to 24 carbon atoms and more preferably 4 to 18 carbon atoms) is preferred. R U1 and R U2 may be the same or different.

式(g)中,RU3 以及RU4 分別獨立地為取代基T,其中,烷基(碳原子數1~24為較佳,1~12為更佳,1~6為進一步較佳,1~3為特佳)為較佳,具有氰基或羧基之烷基為較佳。RU5 以及RU6 分別與RU1 以及RU2 相同含義的基團為較佳。In the formula (g), R U3 and R U4 are each independently a substituent T, wherein the alkyl group (having preferably 1 to 24 carbon atoms, more preferably 1 to 12, still more preferably 1 to 6) Preferably, ~3 is particularly preferred, and an alkyl group having a cyano group or a carboxyl group is preferred. It is preferred that R U5 and R U6 have the same meanings as R U1 and R U2 , respectively.

RU1 與RU2 、RU3 與RU4 、RU5 與RU6 可鍵結乃至縮合而形成環。R U1 and R U2 , R U3 and R U4 , R U5 and R U6 may be bonded or even condensed to form a ring.

作為紫外線吸收劑,更具體而言,例如可舉出:Uvinul A、Uvinul 3000、Uvinul 3008、Uvinul 3049、Uvinul 3050(BASF SE製造)、Sumisorb 130、Sumisorb 140、Sumisorb 200、Sumisorb 250、Sumisorb 320、Sumisorb 340、Sumisorb 350(SUMITOMO CHEMICALCOMPANY, LIMITED製造)、EVERSORB10、EVERSORB11、EVERSORB12(EVERLIGHT CHEMICAL INDUSTRIAl CORPORATION製造)、Tomisob800(API CORPORATION製造)、SEESORB100、SEESORB101、SEESORB101S、SEESORB102、SEESORB103、SEESORB105、SEESORB106、SEESORB107、SEESORB151(SHIPRO KASEI KAISHA.LTD.製造)、Jisuraiza M(SANKYO KASEI SANGYOO Co.,Ltd.)等二苯甲酮化合物;Specific examples of the ultraviolet absorber include Uvinul A, Uvinul 3000, Uvinul 3008, Uvinul 3049, Uvinul 3050 (manufactured by BASF SE), Sumisorb 130, Sumisorb 140, Sumisorb 200, Sumisorb 250, and Sumisorb 320. Sumisorb 340, Sumisorb 350 (manufactured by SUMITOMO CHEMICALCOMPANY, LIMITED), EVERSORB10, EVERSORB11, EVERSORB12 (manufactured by EVERLIGHT CHEMICAL INDUSTRIAl CORPORATION), Tomisob800 (manufactured by API CORPORATION), SEESORB100, SEESORB101, SEESORB101S, SEESORB102, SEESORB103, SEESORB105, SEESORB106, SEESORB107, SEESORB151 (Manufactured by SHIPRO KASEI KAISHA. LTD.), benzophenone compound such as Jisuraiza M (SANKYO KASEI SANGYOO Co., Ltd.);

Sumisorb200、Sumisorb250、Sumisorb300、Sumisorb340、Sumisorb350(SUMITOMO CHEMICALCOMPANY, LIMITED製造)、JF77、JF78、JF79、JF80、JF83(JOHOKU CHEMICALCO.,LTD製造)、TINUVIN PS、TINUVIN 99-2、TINUVIN 109、TINUVIN 171、TINUVIN 384-2、TINUVIN 900、TINUVIN 928、TINUVIN 1130(BASF SE製造)、TINUVIN 70、TINUVIN 71、TINUVIN 72、TINUVIN 73、TINUVIN 74、TINUVIN 75、TINUVIN 76、TINUVIN 234、TINUVIN 77、TINUVIN 78、TINUVIN 80、TINUVIN 81(EVERLIGHT CHEMICALINDUSTRIAl CORPORATION製造)、Tomisob100、Tomisob600(API CORPORATION製造)、SEESORB701、SEESORB702、SEESORB703、SEESORB704、SEESORB706、SEESORB707、SEESORB709(SHIPRO KASEI KAISHA.LTD.製造)等苯并三唑化合物;Sumisorb 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by SUMITOMO CHEMICALCOMPANY, LIMITED), JF77, JF78, JF79, JF80, JF83 (manufactured by JOHOKU CHEMICALCO., LTD), TINUVIN PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 171, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 1130 (manufactured by BASF SE), TINUVIN 70, TINUVIN 71, TINUVIN 72, TINUVIN 73, TINUVIN 74, TINUVIN 75, TINUVIN 76, TINUVIN 234, TINUVIN 77, TINUVIN 78, TINUVIN 80 a benzotriazole compound such as TINUVIN 81 (manufactured by EVERLIGHT CHEMICAL INDUSTRIA CORPORATION), Tomisob 100, Tomisob 600 (manufactured by API CORPORATION), SEESORB 701, SEESORB 702, SEESORB 703, SEESORB 704, SEESORB 706, SEESORB 707, SEESORB 709 (manufactured by SHIPRO KASEI KAISHA. LTD.);

Sumisorb400(SUMITOMO CHEMICALCOMPANY, LIMITED製造)、水楊酸苯酯等苯甲酸酯化合物;a benzoate compound such as Sumisorb 400 (manufactured by SUMITOMO CHEMICALCOMPANY, LIMITED) or phenyl salicylate;

TINUVIN400、TINUVIN405、TINUVIN460、TINUVIN477DW、TINUVIN479(BASF SE製造)等羥基苯基三嗪化合物。Hydroxyphenyl triazine compounds such as TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477 DW, and TINUVIN 479 (manufactured by BASF SE).

作為二烯化合物,能夠使用日本特開2010-78729號公報的段落0144~0164一欄的化合物,能夠援用該些內容,並引入本申請說明書中。As the diene compound, a compound of the paragraphs 0144 to 0164 of JP-A-2010-78729 can be used, and the contents can be referred to and incorporated in the specification of the present application.

矽氧烷樹脂組成物的固體成分中,紫外線吸收劑為0.01質量%以上為較佳,0.1質量%以上為更佳,1質量%以上為特佳。作為上限,20質量%以下為較佳,15質量%以下為更佳,10質量%以下為特佳。Among the solid components of the decane resin composition, the ultraviolet absorber is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and particularly preferably 1% by mass or more. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and particularly preferably 10% by mass or less.

紫外線吸收劑可單獨使用1種亦可組合2種以上來使用。The ultraviolet absorber may be used singly or in combination of two or more.

<聚合起始劑><Polymerization initiator>

本發明的矽氧烷樹脂組成物中可含有聚合起始劑。作為聚合起始劑,可以係熱聚合起始劑亦可以係光聚合起始劑,但光聚合性起始劑為較佳。例如可舉出有機鹵素化合物、噁二唑化合物、羰基化合物、縮酮化合物、安息香化合物、吖啶化合物、有機過氧化物、偶氮化合物、香豆素化合物、疊氮化合物、茂金屬化合物、六芳基雙咪唑化合物、有機硼酸化合物、二磺酸化合物、肟化合物、鎓鹽化合物、羥基苯乙酮化合物、氨基苯乙酮化合物、醯基氧化膦化合物、三鹵甲基三嗪化合物、苄基二甲基縮酮化合物、α-羥基酮化合物、α-氨基酮化合物、醯基膦化合物、氧化膦化合物、茂金屬化合物、三芳基咪唑二聚體、鎓類化合物、苯并噻唑化合物、二苯甲酮化合物、環戊二烯-苯-鐵絡合物、鹵代甲基噁二唑化合物、3-芳基取代香豆素化合物、α-氨基烷基苯基酮化合物、安息香酸酯化合物。The polymerization initiator of the present invention may contain a polymerization initiator. The polymerization initiator may be a thermal polymerization initiator or a photopolymerization initiator, but a photopolymerization initiator is preferred. For example, an organohalogen compound, an oxadiazole compound, a carbonyl compound, a ketal compound, a benzoin compound, an acridine compound, an organic peroxide, an azo compound, a coumarin compound, an azide compound, a metallocene compound, and six Aryl biimidazole compound, organoboric acid compound, disulfonic acid compound, hydrazine compound, phosphonium salt compound, hydroxyacetophenone compound, aminoacetophenone compound, mercaptophosphine oxide compound, trihalomethyltriazine compound, benzyl group Dimethyl ketal compound, α-hydroxyketone compound, α-aminoketone compound, mercaptophosphine compound, phosphine oxide compound, metallocene compound, triaryl imidazole dimer, anthraquinone compound, benzothiazole compound, diphenyl A ketone compound, a cyclopentadiene-benzene-iron complex, a halogenated methyl oxadiazole compound, a 3-aryl substituted coumarin compound, an α-aminoalkyl phenyl ketone compound, and a benzoic acid ester compound.

作為該些的具體例,能夠參閱日本特開2010-106268號公報<0135>段落(所對應之美國專利申請公開第2011/0124824號說明書的<0163>)之後的記載,該些內容引入本申請說明書中。As a specific example of the above, it is possible to refer to the following paragraphs of the paragraph [0135] of the Japanese Patent Laid-Open Publication No. 2010-106268 (the <0163> of the specification of the corresponding US Patent Application Publication No. 2011/0124824), which is incorporated herein by reference. In the manual.

具體而言,例如可舉出日本特開平10-291969號公報中記載的氨基苯乙酮系起始劑、日本專利第4225898號公報中記載的醯基氧化膦系起始劑。Specifically, for example, an aminoacetophenone-based initiator described in JP-A-10-291969, and a sulfhydrylphosphine oxide-based initiator described in Japanese Patent No. 4,258,899.

作為羥基苯乙酮系起始劑,可舉出IRGACURE-184、DAROCUR-1173、IRGACURE-500、IRGACURE-2959,IRGACURE-127(商品名:均為BASF SE製造)。Examples of the hydroxyacetophenone-based initiator include IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, and IRGACURE-127 (trade names: all manufactured by BASF SE).

作為氨基苯乙酮系起始劑的市售品,可舉出IRGACURE-907、IRGACURE-369、IRGACURE-379(商品名:均為BASF SE製造)等。又,亦能夠使用將吸收波長匹配於365nm或405nm等長波光源之日本特開2009-191179公報中記載的化合物。Commercial products of the aminoacetophenone-based initiators include IRGACURE-907, IRGACURE-369, and IRGACURE-379 (trade names: all manufactured by BASF SE). Further, a compound described in JP-A-2009-191179, which incorporates a long-wavelength light source having an absorption wavelength of 365 nm or 405 nm, can also be used.

作為醯基膦系起始劑的市售品,能夠使用IRGACURE-819、DAROCUR4265、DAROCUR-TPO(商品名:均為BASF SE製造)。As a commercial item of a mercaptophosphine-based initiator, IRGACURE-819, DAROCUR 4265, and DAROCUR-TPO (trade names: all manufactured by BASF SE) can be used.

作為偶氮化合物,可舉出2,2-偶氮雙異丁腈(AIBN)、3-羧丙腈、偶氮雙馬來酸腈、二甲基-2,2’-偶氮雙(2-甲基丙酸酯)[V-601](Wako Pure Chemical Industries, Ltd.製造)等。Examples of the azo compound include 2,2-azobisisobutyronitrile (AIBN), 3-carboxypropionitrile, azobismaleic acid nitrile, and dimethyl-2,2'-azobis (2). -Methylpropionate) [V-601] (manufactured by Wako Pure Chemical Industries, Ltd.) or the like.

本發明中,使用肟化合物為較佳。肟化合物在本發明的矽氧烷樹脂組成物中有效地發揮作為起始、促進聚合之聚合起始劑的功能。又,肟化合物在後加熱中的著色較少,且硬化性亦良好。尤其,本發明中,能夠優化圖案的分辨率和硬化物的耐光性,在這一方面為較佳。其中,能夠適當使用IRGACURE OXE01(下式)、IRGACURE OXE02(下式)等市售品(均為BASF SE製造)。In the present invention, a ruthenium compound is preferably used. The ruthenium compound effectively functions as a polymerization initiator which initiates and promotes polymerization in the oxirane resin composition of the present invention. Further, the ruthenium compound has less coloration in post-heating and is also excellent in hardenability. In particular, in the present invention, the resolution of the pattern and the light resistance of the cured product can be optimized, which is preferable in this respect. Among them, commercially available products such as IRGACURE OXE01 (the following formula) and IRGACURE OXE02 (the following formula) (all manufactured by BASF SE) can be suitably used.

【化學式3】 [Chemical Formula 3]

作為成為聚合起始劑之肟化合物,以下述式(OX)表示者為較佳,以式(OX-1)表示者為更佳。The hydrazine compound to be a polymerization initiator is preferably represented by the following formula (OX), and more preferably represented by the formula (OX-1).

【化學式4】 [Chemical Formula 4]

・A1 ・A 1

A1 係式(OX-1)的-A-C或烷基為較佳。烷基係碳原子數1~12為較佳,1~6為更佳。烷基可具有後述取代基T。又,取代基T可經由後述連結基L而取代。The -AC or alkyl group of the A 1 formula (OX-1) is preferred. The alkyl group has preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms. The alkyl group may have a substituent T described later. Further, the substituent T can be substituted with a linking group L which will be described later.

・C・C

C表示Ar、-SAr或者-COAr。C represents Ar, -SAr or -COAr.

・R・R

R表示一價取代基,為一價非金屬原子團為較佳。作為上述一價非金屬原子團,可舉出烷基(碳原子數1~12為較佳,1~6為更佳,1~3為特佳)、芳基(碳原子數6~14為較佳,6~10為更佳)、醯基(碳原子數2~12為較佳,2~6為更佳,2~3為特佳)、芳醯基(碳原子數7~15為較佳,7~11為更佳)、烷氧基羰基(碳原子數2~12為較佳,2~6為更佳,2~3為特佳)、芳氧基羰基(碳原子數7~15為較佳,7~11為更佳)、雜環基(碳原子數2~12為較佳,2~6為更佳)、烷基硫基羰基(碳原子數2~12為較佳,2~6為更佳,2~3為特佳)、芳基硫基羰基(碳原子數7~15為較佳,7~11為更佳)等。又,該些基團可具有1個以上的取代基。又,前述之取代基可進一步被其他取代基T取代。取代基T中,鹵原子、烷基(碳原子數1~12為較佳,1~6為更佳,1~3為特佳)、芳基(碳原子數6~14為較佳,6~10為更佳)、芳硫基(碳原子數6~14為較佳,6~10為更佳)、芳醯基(碳原子數7~15為較佳,7~11為更佳))等為較佳。連結基L中,碳原子數1~6的亞烷基、O、S、CO、NRN 或該些的組合為較佳。R represents a monovalent substituent, and is preferably a monovalent non-metal atomic group. The monovalent non-metal atomic group may, for example, be an alkyl group (preferably having 1 to 12 carbon atoms, more preferably 1 to 6 or more preferably 1 to 3) or an aryl group (having a carbon number of 6 to 14). Preferably, 6 to 10 is more preferred), sulfhydryl groups (2 to 12 carbon atoms are preferred, 2 to 6 are more preferred, 2 to 3 are particularly preferred), and aryl sulfonyl groups (7 to 15 carbon atoms are preferred). Preferably, 7 to 11 is more preferred), alkoxycarbonyl group (2 to 12 carbon atoms is preferred, 2 to 6 is more preferred, 2 to 3 is particularly preferred), and aryloxycarbonyl group (carbon number is 7 to 7). 15 is more preferred, 7 to 11 is more preferred, a heterocyclic group (2 to 12 carbon atoms is preferred, 2 to 6 is more preferred), and an alkylthiocarbonyl group (2 to 12 carbon atoms is preferred). 2 to 6 is more preferable, 2 to 3 is particularly preferred, and an arylthiocarbonyl group (preferably having 7 to 15 carbon atoms, more preferably 7 to 11 carbon atoms). Further, these groups may have one or more substituents. Further, the aforementioned substituent may be further substituted with another substituent T. In the substituent T, a halogen atom or an alkyl group (preferably having 1 to 12 carbon atoms, more preferably 1 to 6 or more preferably 1 to 3) or an aryl group (having preferably 6 to 14 carbon atoms, 6) ~10 is more preferable), an arylthio group (preferably having 6 to 14 carbon atoms, more preferably 6 to 10), and an aryl fluorenyl group (having preferably 7 to 15 carbon atoms, more preferably 7 to 11) ) is preferred. In the linking group L, an alkylene group having 1 to 6 carbon atoms, O, S, CO, NR N or a combination thereof is preferred.

・B・B

B表示一價取代基、烷基(碳原子數1~12為較佳)、芳基(碳原子數6~14為較佳,碳原子數6~10為更佳)、雜環基(碳原子數2~18為較佳,碳原子數2~12為更佳)。該些基可經由連結基L而鍵結。又,該些基可具有1個以上的取代基T。取代基T亦可經由任意連結基L而取代。其中,連結基L亦為碳原子數1~6的亞烷基、O、S、CO、NRN 或該些的組合為較佳。作為B的具體基團,可舉出下述內容。*表示鍵結位置,可在不同位置鍵結。又,該些基可進一步伴有取代基T。具體而言,可舉出苯甲醯基、苯基硫基、苯基氧基。B represents a monovalent substituent, an alkyl group (preferably having 1 to 12 carbon atoms), an aryl group (preferably having 6 to 14 carbon atoms, more preferably 6 to 10 carbon atoms), or a heterocyclic group (carbon). The number of atoms is preferably from 2 to 18, and the number of carbon atoms is preferably from 2 to 12. These groups may be bonded via a linking group L. Further, these groups may have one or more substituents T. The substituent T may also be substituted via any linking group L. Among them, the linking group L is also an alkylene group having 1 to 6 carbon atoms, O, S, CO, NR N or a combination thereof. Specific examples of B include the following. * indicates the bonding position, which can be bonded at different positions. Further, the groups may be further accompanied by a substituent T. Specific examples thereof include a benzamidine group, a phenylthio group, and a phenyloxy group.

【化學式5】 [Chemical Formula 5]

・A・A

A係單鍵或連結基。作為連結基的較佳例,為上述連結基L或亞芳基(碳原子數6~14為較佳,碳原子數6~10為更佳)或雜環連結基(芳香族雜環連結基為較佳)(碳原子數2~18為較佳,碳原子數2~12為更佳)。A is a single bond or a linking group. A preferred example of the linking group is the above-mentioned linking group L or an arylene group (preferably having 6 to 14 carbon atoms, more preferably 6 to 10 carbon atoms) or a heterocyclic linking group (aromatic heterocyclic linking group). Preferably, it is preferably 2 to 18 carbon atoms and more preferably 2 to 12 carbon atoms.

・Ar・Ar

Ar係芳基或雜芳(芳香族雜環基)。作為芳基,碳原子數6~14為較佳,碳原子數6~10為更佳,苯基、萘基為較佳。作為雜芳基,碳原子數2~18為較佳,碳原子數2~12為更佳,可在N位具有烷基等取代基之咔唑基為較佳。Ar is an aryl group or a heteroaryl group (aromatic heterocyclic group). As the aryl group, a carbon number of 6 to 14 is preferred, a carbon number of 6 to 10 is more preferred, and a phenyl group or a naphthyl group is preferred. As the heteroaryl group, a carbon number of 2 to 18 is preferred, and a carbon number of 2 to 12 is more preferable, and a carbazolyl group having a substituent such as an alkyl group at the N position is preferable.

作為肟起始劑,能夠參閱日本特開2012-208494號公報的段落0513(所對應之美國專利申請公開第2012/235099號說明書的<0632>)以後的以式(OX-1)、(OX-2)或(OX-3)表示之化合物的說明,該些內容引入本申請說明書中。As the oxime initiator, the formula (OX-1), (OX) after paragraph 0513 of the Japanese Patent Application Laid-Open No. 2012-208494 (the <0632> of the specification of the corresponding US Patent Application Publication No. 2012/235099) can be referred to. -2) or a description of the compound represented by (OX-3), which is incorporated in the specification of the present application.

聚合起始劑在350nm~500nm的波長區域具有極大吸收波長為較佳,在360nm~480nm的波長區域具有吸收波長者為更佳,365nm以及455nm的吸光度較高者為特佳。從靈敏度的観點出發,365nm或405nm下的莫耳吸光係數為1,000~300,000為較佳,2,000~300,000為更佳,5,000~200,000為特佳。The polymerization initiator preferably has a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, more preferably has an absorption wavelength in a wavelength region of 360 nm to 480 nm, and particularly preferably has a higher absorbance at 365 nm and 455 nm. From the viewpoint of sensitivity, the molar absorption coefficient at 365 nm or 405 nm is preferably from 1,000 to 300,000, more preferably from 2,000 to 300,000, and particularly preferably from 5,000 to 200,000.

聚合起始劑的含量(2種以上時為總含量)相對於組成物的總固體含量為0.1質量%以上10質量%以下為較佳,0.3質量%以上8質量%以下為更佳、0.5質量%以上5質量%以下進一步較佳。該範圍中可獲得良好的硬化性以及透明性。The content of the polymerization initiator (the total content in the case of two or more kinds) is preferably 0.1% by mass or more and 10% by mass or less based on the total solid content of the composition, and more preferably 0.3% by mass or more and 8% by mass or less. More preferably, it is more than 5% by mass or less. Good hardenability and transparency are obtained in this range.

又,聚合起始劑可單獨使用亦可同時使用2種以上。Further, the polymerization initiator may be used singly or in combination of two or more kinds.

<溶劑><solvent>

本發明的矽氧烷樹脂組成物中含有溶劑。關於該溶劑,可將在上述矽烷化合物的水解縮合反應中使用之溶劑直接用作組成物的溶劑,或者亦可除了該溶劑或代替該溶劑使用下述溶劑。The rhodium oxide resin composition of the present invention contains a solvent. With respect to the solvent, the solvent used in the hydrolysis condensation reaction of the above decane compound can be directly used as a solvent of the composition, or the following solvent can be used in addition to or instead of the solvent.

作為溶劑,例如可舉出水、脂肪族化合物、鹵化烴化合物、醇化合物、醚化合物、酯化合物、酮化合物、腈化合物、醯胺化合物、亞碸化合物、芳香族化合物。該些溶劑可混合使用。下述內容中列舉各個例子。Examples of the solvent include water, an aliphatic compound, a halogenated hydrocarbon compound, an alcohol compound, an ether compound, an ester compound, a ketone compound, a nitrile compound, a guanamine compound, an anthraquinone compound, and an aromatic compound. These solvents can be used in combination. Each example is listed below.

・水·water

・脂肪族化合物・Fatty compounds

己烷、庚烷、環己烷、甲基環己烷、辛烷、戊烷、環戊烷等Hexane, heptane, cyclohexane, methylcyclohexane, octane, pentane, cyclopentane, etc.

・鹵化烴化合物・Halogenated hydrocarbon compounds

氯甲烷、氯仿、二氯甲烷、二氯乙烷、四氯化碳、三氯乙烯、四氯乙烯、表氯醇、一氯苯、鄰二氯苯、氯丙烯、HCFC、氯乙酸甲酯、氯乙酸乙酯、氯乙酸三氯乙酸、臭甲烷、碘甲烷、三(四)氯乙烯等Methyl chloride, chloroform, dichloromethane, dichloroethane, carbon tetrachloride, trichloroethylene, tetrachloroethylene, epichlorohydrin, monochlorobenzene, o-dichlorobenzene, chloropropene, HCFC, methyl chloroacetate, Ethyl chloroacetate, chloroacetic acid trichloroacetic acid, malodorous methane, methyl iodide, tris(tetra)vinyl chloride, etc.

・醇化合物・Alcohol compound

甲醇、乙醇、1-丙醇、2-丙醇、2-丁醇、乙二醇、丙二醇、丙三醇、1,6-己二醇、環己二醇、山梨糖醇、木糖醇、2-甲基-2,4-戊二醇、1,3-丁二醇、1,4-丁二醇、二丙酮醇、四氫糠醇等Methanol, ethanol, 1-propanol, 2-propanol, 2-butanol, ethylene glycol, propylene glycol, glycerol, 1,6-hexanediol, cyclohexanediol, sorbitol, xylitol, 2-methyl-2,4-pentanediol, 1,3-butanediol, 1,4-butanediol, diacetone alcohol, tetrahydrofurfuryl alcohol, etc.

・醚化合物(包含羥基含有醚化合物)・Ether compound (including hydroxyl group containing ether compound)

二甲醚、二乙醚、二異丙醚、二丁醚、叔丁基甲基醚、環己基甲基醚、苯甲醚、四氫呋喃、亞烷基二醇烷基醚(乙二醇單甲醚、乙二醇單丁醚、二乙二醇、二丙二醇、丙二醇單甲醚、二乙二醇單甲醚、三乙二醇、聚乙二醇、丙二醇單甲醚、二丙二醇單甲醚、三丙二醇單甲醚、二乙二醇單丁醚、二乙二醇單丁醚等)等Dimethyl ether, diethyl ether, diisopropyl ether, dibutyl ether, tert-butyl methyl ether, cyclohexyl methyl ether, anisole, tetrahydrofuran, alkylene glycol alkyl ether (ethylene glycol monomethyl ether, B Glycol monobutyl ether, diethylene glycol, dipropylene glycol, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol, polyethylene glycol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol Monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether, etc.)

・酯化合物・Ester compound

乙酸乙酯、乳酸乙酯、2-(1-甲氧基)丙基乙酸酯、丙二醇單甲醚乙酸酯等Ethyl acetate, ethyl lactate, 2-(1-methoxy)propyl acetate, propylene glycol monomethyl ether acetate, etc.

・酮化合物Ketone compound

丙酮、甲基乙基酮、甲基異丁基酮、環己酮、2-庚酮、環戊酮等Acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, cyclopentanone, etc.

・腈化合物・Nitrile compound

乙腈等Acetonitrile

・醯胺化合物・醯amine compound

N,N-二甲基甲醯胺、1-甲基-2-吡咯烷酮、2-吡咯烷酮、1,3-二甲基-2-咪唑啉酮、2-吡咯烷酮、ε-己內醯胺、甲醯胺、N-甲基甲醯胺、乙醯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基丙醯胺、六甲基磷醯三胺等N,N-dimethylformamide, 1-methyl-2-pyrrolidone, 2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, 2-pyrrolidone, ε-caprolactam, A Indoleamine, N-methylformamide, acetamide, N-methylacetamide, N,N-dimethylacetamide, N-methylpropionamide, hexamethylphosphonium triamine, etc.

・亞碸化合物・Azo compound

二甲基亞碸等Dimethyl hydrazine

・芳香族化合物・Aromatic compounds

苯、甲苯等Benzene, toluene, etc.

作為溶劑,為了均勻地溶解組成物的各成分,醇化合物、酯化合物、或醚化合物為較佳。例如,可舉出丙二醇單甲醚、丙二醇單甲醚乙酸酯、二丙酮醇、乙二醇單丁醚、乙酸2-乙氧乙基、1-甲氧基丙基-2-乙酸酯、3-甲氧基-3-甲基丁醇、3-甲氧基-3-甲基丁醇乙酸酯、3-甲氧基丁基乙酸酯、1,3-丁二醇二乙酸酯,乙二醇單丁醚乙酸酯、二乙二醇單丁醚乙酸酯、乳酸乙酯、乳酸丁酯、乙醯乙酸乙酯或γ―丁內酯。As the solvent, in order to uniformly dissolve the components of the composition, an alcohol compound, an ester compound, or an ether compound is preferred. For example, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diacetone alcohol, ethylene glycol monobutyl ether, 2-ethoxyethyl acetate, 1-methoxypropyl-2-acetate , 3-methoxy-3-methylbutanol, 3-methoxy-3-methylbutanol acetate, 3-methoxybutyl acetate, 1,3-butanediol diethyl Acid ester, ethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether acetate, ethyl lactate, butyl lactate, ethyl acetate or γ-butyrolactone.

關於溶劑的使用量,如作為塗佈液時,設為固體成分成為5質量%以上為較佳,作成為8質量%以上為更佳,作成為10質量%以上為特佳。作為上限,作成為50質量%以下為較佳,作成為40質量%以下為更佳,作成為35質量%以下為特佳。When the amount of the solvent to be used is, for example, the solid content is preferably 5% by mass or more, more preferably 8% by mass or more, and even more preferably 10% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less, and particularly preferably 35% by mass or less.

溶劑可單獨使用1種亦可組合2種以上來使用。The solvent may be used alone or in combination of two or more.

<聚合性化合物><Polymerizable compound>

本發明的矽氧烷樹脂組成物中可含有聚合性化合物。聚合性化合物係具有至少1個乙烯性不飽和雙鍵、環氧基、氧雜環丁基等聚合性基之加成聚合性化合物為較佳。選自至少具有1個聚合性基為之化合物較佳、選自具有2個以上聚合基之化合物為更佳。並沒有特別的上限,但實際上為12個以下。例如可以是具有單體、預聚物(亦即二聚體、三聚體等多聚體以及寡聚物)或該些的混合物以及該些的共聚物等化學形態者。作為單體以及其共聚物的例子,可舉出不飽和羧酸(例如,丙烯酸、甲基丙烯酸、衣康酸、巴豆酸、異巴豆酸、馬來酸等)或其酯類、醯胺類。使用不飽和羧酸與脂肪族多元醇化合物的酯、不飽和羧酸與脂肪族多元胺化合物的醯胺類為較佳。又,還適當地使用具有羥基或氨基、巰基等親核性取代基之不飽和羧酸酯類或者不飽和羧酸醯胺類與單官能或多官能異氰酸酯類或者環氧類的加成反應物;以及不飽和羧酸酯類或者不飽和羧酸醯胺類與單官能或多官能的羧酸的脱水縮合反應物等。又,具有異氰酸酯基或環氧基等親電性取代基之不飽和羧酸酯或者不飽和羧酸醯胺類、與單官能或者多官能醇類、胺類、硫醇類的加成反應物;進一步具有鹵素基團或甲苯磺酸氧基等脱離性取代基之不飽和羧酸酯或者不飽和羧酸醯胺類、與單官能或者多官能醇類、胺類、硫醇類的取代反應物亦適合。又,作為其他例,還能夠代替上述不飽和羧酸而使用取代為不飽和膦酸、苯乙烯、乙烯基醚等之化合物組。作為該些的具體化合物,能夠將日本特開2009-288705號公報的段落號0095~段落號0108中記載之化合物適當用於本發明中。The rhodium oxide resin composition of the present invention may contain a polymerizable compound. The polymerizable compound is preferably an addition polymerizable compound having at least one polymerizable group such as an ethylenically unsaturated double bond, an epoxy group or an oxetanyl group. It is more preferable that a compound selected from at least one polymerizable group is selected from a compound having two or more polymerizable groups. There is no special upper limit, but it is actually 12 or less. For example, it may be a chemical form having a monomer, a prepolymer (i.e., a dimer, a trimer, or the like, and an oligomer) or a mixture thereof, and a copolymer such as these. Examples of the monomer and the copolymer thereof include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.) or esters thereof, guanamines. . It is preferred to use an ester of an unsaturated carboxylic acid and an aliphatic polyol compound, an amide of an unsaturated carboxylic acid and an aliphatic polyamine compound. Further, an addition reaction product of an unsaturated carboxylic acid ester having a nucleophilic substituent such as a hydroxyl group, an amino group or a fluorenyl group or an unsaturated carboxylic acid oxime amine and a monofunctional or polyfunctional isocyanate or epoxy group is also suitably used. And a dehydration condensation reaction of an unsaturated carboxylic acid ester or an unsaturated carboxylic acid amide with a monofunctional or polyfunctional carboxylic acid. Further, an addition reaction product of an unsaturated carboxylic acid ester having an electrophilic substituent such as an isocyanate group or an epoxy group or an oxime amine of an unsaturated carboxylic acid, and a monofunctional or polyfunctional alcohol, an amine or a thiol Further, an unsaturated carboxylic acid ester having a detachable substituent such as a halogen group or a toluene sulfonic acid oxy group or a carboxylic acid amide containing an unsaturated group, and a substitution with a monofunctional or polyfunctional alcohol, an amine or a thiol The reactants are also suitable. Further, as another example, a compound group substituted with an unsaturated phosphonic acid, styrene, vinyl ether or the like can be used instead of the above unsaturated carboxylic acid. As the specific compound, the compound described in Paragraph No. 0095 to Paragraph No. 0108 of JP-A-2009-288705 can be suitably used in the present invention.

聚合性化合物係以下述式(MO-1)~(MO-6)表示者進一步較佳。The polymerizable compound is further preferably represented by the following formulas (MO-1) to (MO-6).

【化學式6】 [Chemical Formula 6]

式中、n分別為0~14,m分別為1~8。在一分子內存在複數個之R、T以及Z可分別相同或互不相同。T為氧化烯基時,碳原子側的末端與R鍵結。R中至少1個係聚合性基。In the formula, n is 0 to 14, respectively, and m is 1 to 8, respectively. Within a molecule, a plurality of R, T, and Z may be the same or different from each other. When T is an oxyalkylene group, the terminal on the carbon atom side is bonded to R. At least one of R is a polymerizable group.

n為0~5為較佳,1~3為更佳。It is preferable that n is 0 to 5, and 1 to 3 is more preferable.

m為1~5為較佳,1~3為更佳。m is preferably from 1 to 5, more preferably from 1 to 3.

作為以上述式(MO-1)~(MO-6)表示之聚合性化合物的具體例,能夠將日本特開2007-269779號公報的段落號0248~段落號0251中記載之化合物適當用於本實施形態中。As a specific example of the polymerizable compound represented by the above formula (MO-1) to (MO-6), the compound described in Paragraph No. 0248 to No. 0251 of JP-A-2007-269779 can be suitably used in the present invention. In the embodiment.

其中,作為聚合性化合物等,二季戊四醇三丙烯酸酯(作為市售品有KAYARAD D-330;Nippon Kayaku Co.,Ltd.製造)、二季戊四醇四丙烯酸酯(作為市售品有KAYARAD D-320;Nippon Kayaku Co.,Ltd.製造)二季戊四醇五(甲基)丙烯酸酯(作為市售品有KAYARAD D-310;Nippon Kayaku Co.,Ltd.製造)、二季戊四醇六(甲基)丙烯酸酯(作為市售品有KAYARAD DPHA;Nippon Kayaku Co.,Ltd.製造)以及該些(甲基)丙烯醯基隔著乙二醇、丙二醇残基之結構或二甘油EO(環氧乙烷)改性(甲基)丙烯酸酯(作為市售品有M-460;Toagosei Company, Limited製造)為較佳。亦能夠使用該些的寡聚物類型。Among them, as a polymerizable compound, dipentaerythritol triacrylate (available as KAYARAD D-330 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.) and dipentaerythritol tetraacrylate (a commercially available product is KAYARAD D-320; Nippon Kayaku Co., Ltd. manufactured) dipentaerythritol penta (meth) acrylate (available as KAYARAD D-310 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth) acrylate (as a product) Commercially available products are KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.) and these (meth)acrylonitrile groups are modified by a structure of ethylene glycol, a propylene glycol residue or diglycerin EO (ethylene oxide) ( Methyl) acrylate (commercially available as M-460; manufactured by Toagosei Company, Limited) is preferred. These types of oligomers can also be used.

作為聚合性化合物,可具有羧基、磺酸基、磷酸基等酸性基。藉此,乙烯性化合物可以係如為混合物之情況那樣具有未反應的羧基者,還可直接利用此。可依據需要使上述的乙烯性化合物的羥基與非芳香族羧酸酐反應來導入酸性基。此時,作為所使用之非芳香族羧酸酐的具體例,可舉出四氫鄰苯二甲酸酐、烷化四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、烷化六氫鄰苯二甲酸酐、琥珀酸酐、馬來酸酐。The polymerizable compound may have an acidic group such as a carboxyl group, a sulfonic acid group or a phosphoric acid group. Thereby, the ethylenic compound can have an unreacted carboxyl group as in the case of a mixture, and can also be used as it is. The acidic group can be introduced by reacting the hydroxyl group of the above-mentioned ethylenic compound with a non-aromatic carboxylic acid anhydride as needed. In this case, specific examples of the non-aromatic carboxylic anhydride to be used include tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and alkylated hexahydroortane. Phthalic anhydride, succinic anhydride, maleic anhydride.

聚合性化合物的分子量係300以上1500以下為較佳,400以上700以下為更佳。The molecular weight of the polymerizable compound is preferably 300 or more and 1,500 or less, more preferably 400 or more and 700 or less.

相對於組成物中的總固體含量,聚合性化合物的含量在1質量%~50質量%的範圍為較佳,在3質量%~40質量%的範圍為更佳,在5質量%~30質量%的範圍進一步較佳。若在該範圍內,則不會使折射率和透明性過度降低,硬化性良好,故較佳。The content of the polymerizable compound is preferably in the range of 1% by mass to 50% by mass, more preferably in the range of 3% by mass to 40% by mass, and preferably 5% by mass to 30% by mass based on the total solid content in the composition. The range of % is further preferred. If it is in this range, the refractive index and transparency are not excessively lowered, and the curability is good, which is preferable.

聚合性化合物可單獨使用1種亦可組合2種以上來使用。The polymerizable compound may be used alone or in combination of two or more.

<鹼可溶性樹脂><alkali soluble resin>

本發明的矽氧烷樹脂組成物中可含有鹼可溶性樹脂(條件(b)中成為必須成分)。作為鹼可溶性樹脂,能夠從線性有機高分子聚合物且在分子(以丙烯酸共聚物、苯乙烯共聚物為主鏈之分子為較佳)中至少具有1個促進鹼可溶性之基團之鹼可溶性樹脂中適當選擇。The naphthenic resin composition of the present invention may contain an alkali-soluble resin (an essential component in the condition (b)). As the alkali-soluble resin, it is possible to obtain an alkali-soluble resin having at least one alkali-soluble group from a linear organic polymer and a molecule (preferably a molecule having an acrylic copolymer or a styrene copolymer as a main chain) Choose the appropriate one.

從耐熱性觀點出發,聚羥基苯乙烯樹脂、聚矽氧烷樹脂、丙烯酸樹脂、丙烯醯胺樹脂、丙烯酸/丙烯醯胺共聚物樹脂為較佳。從顯影性控制的觀點出發,丙烯酸樹脂、丙烯醯胺樹脂、丙烯酸/丙烯醯胺共聚物樹脂為較佳,丙烯酸樹脂為特佳。作為促進鹼可溶性之基團(以下,還稱為酸性基),例如可舉出上述酸性基(A)。可溶於溶劑且能夠藉由弱鹼水溶液顯影者為較佳,作為尤其較佳者,可舉出(甲基)丙烯酸。該些酸性基可僅為1種,亦可為2種以上。From the viewpoint of heat resistance, a polyhydroxystyrene resin, a polyoxyalkylene resin, an acrylic resin, an acrylamide resin, or an acrylic/acrylamide copolymer resin is preferable. From the viewpoint of developability control, an acrylic resin, an acrylamide resin, an acrylic acid/acrylamide copolymer resin is preferable, and an acrylic resin is particularly preferable. The group which promotes alkali solubility (hereinafter, also referred to as an acidic group) is exemplified by the above acidic group (A). It is preferably soluble in a solvent and can be developed by a weak aqueous alkali solution, and particularly preferably, (meth)acrylic acid is mentioned. These acidic groups may be used alone or in combination of two or more.

作為用作鹼可溶性樹脂之線性有機高分子聚合物,在側鏈具有羧酸之聚合物為較佳,可舉出甲基丙烯酸共聚物、丙烯酸共聚物、衣康酸共聚物、巴豆酸共聚物、馬來酸共聚物、部分酯化馬來酸共聚物、酚醛型樹脂等鹼可溶性酚醛樹脂等、以及在側鏈具有羧酸之酸性纖維素衍生物、在具有羥基之聚合物中加成酸酐者。尤其,(甲基)丙烯酸和能夠與其共聚之其他單量體的共聚物適合作為鹼可溶性樹脂。作為能夠與(甲基)丙烯酸共聚之其他單量體,可舉出烷基(甲基)丙烯酸酯、芳基(甲基)丙烯酸酯、乙烯基化合物等。作為烷基(甲基)丙烯酸酯以及芳基(甲基)丙烯酸酯,可舉出甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、丙基(甲基)丙烯酸酯、正丁基(甲基)丙烯酸酯、異丁基(甲基)丙烯酸酯、(異)戊(甲基)丙烯酸酯、2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、己基(甲基)丙烯酸酯、辛基(甲基)丙烯酸酯、苯基(甲基)丙烯酸酯、苄基(甲基)丙烯酸酯、甲苯基(甲基)丙烯酸酯、萘基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯等。作為乙烯基化合物,可舉出苯乙烯、α-甲基苯乙烯、乙烯基甲苯、甲基丙烯酸縮水甘油酯、丙烯腈、乙酸乙烯酯、N-乙烯基吡咯烷酮、甲基丙烯酸四氫糠酯、聚苯乙烯大分子單體、聚甲基丙烯酸甲酯大分子單體等,作為日本特開平10-300922號公報中記載的N位取代馬來醯亞胺單體,可舉出N-苯基馬來醯亞胺、N-環己基馬來醯亞胺等。As the linear organic high molecular polymer used as the alkali-soluble resin, a polymer having a carboxylic acid in a side chain is preferred, and examples thereof include a methacrylic acid copolymer, an acrylic copolymer, an itaconic acid copolymer, and a crotonic acid copolymer. An alkali-soluble phenolic resin such as a maleic acid copolymer, a partially esterified maleic acid copolymer or a phenolic resin, and an acid anhydride derivative having a carboxylic acid in a side chain, and an acid anhydride added to a polymer having a hydroxyl group By. In particular, a copolymer of (meth)acrylic acid and other monomeric materials capable of copolymerizing therewith is suitable as the alkali-soluble resin. Examples of the other monomer which can be copolymerized with (meth)acrylic acid include an alkyl (meth) acrylate, an aryl (meth) acrylate, a vinyl compound and the like. Examples of the alkyl (meth) acrylate and the aryl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, and propyl (meth) acrylate. Butyl (meth) acrylate, isobutyl (meth) acrylate, (iso) pentyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (methyl) Acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, tolyl (meth) acrylate, naphthyl (Meth) acrylate, cyclohexyl (meth) acrylate, and the like. Examples of the vinyl compound include styrene, α-methylstyrene, vinyltoluene, glycidyl methacrylate, acrylonitrile, vinyl acetate, N-vinylpyrrolidone, and tetrahydrofurfuryl methacrylate. A polystyrene macromonomer, a polymethyl methacrylate macromonomer, etc., and the N-substituted maleimide monomer described in Japanese Laid-Open Patent Publication No. Hei 10-300922, the N-phenyl group is exemplified. Maleic imine, N-cyclohexylmaleimide, and the like.

鹼可溶性樹脂係下述式的聚合物為較佳。The alkali-soluble resin is preferably a polymer of the following formula.

【化學式7】 [Chemical Formula 7]

LX1 表示單鍵或後述連結基L。其中,單鍵為較佳。L X1 represents a single bond or a linking group L which will be described later. Among them, a single bond is preferred.

RX1 、RY1 係氫原子、碳原子素1~10的烷基(碳原子數1~6為較佳,1~3為更佳)或者氰基。其中,RX1 、RY1 分別獨立地為氫原子、甲基、乙基、丙基或氰基為較佳,氫原子或甲基為更佳。R X1 and R Y1 are a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (preferably having 1 to 6 carbon atoms, more preferably 1 to 3) or a cyano group, wherein R X1 and R Y1 are each independently It is preferably a hydrogen atom, a methyl group, an ethyl group, a propyl group or a cyano group, and a hydrogen atom or a methyl group is more preferable.

RA 係酸性基(A)。R A is an acidic group (A).

RY2 表示取代基T,其中,烷基(碳原子數1~12為較佳,1~6為更佳,1~3為特佳)、芳基(碳原子數6~22為較佳,6~14為更佳、6~10為特佳)、芳烷基(碳原子數7~23為較佳,7~15為更佳,7~11為特佳)為較佳。該些基團可進一步具有取代基T,作為進一步的取代基,可舉出羥基、羧基等。R Y2 represents a substituent T in which an alkyl group (having preferably 1 to 12 carbon atoms, more preferably 1 to 6 or more preferably 1 to 3), and an aryl group (having preferably 6 to 22 carbon atoms). 6~14 is better, 6~10 is especially good), aralkyl (better 7~23 is preferred, 7~15 is better, 7~11 is especially good). The group may further have a substituent T, and examples of the further substituent include a hydroxyl group and a carboxyl group.

nx、ny係莫耳分率,nx+ny可小於1(指可具有其他重複單元),但1為較佳。作為nx的下限,0.05以上為較佳,0.1以上為更佳,0.2以上為特佳。作為上限,0.7以下為較佳,0.6以下為更佳,0.5以下為特佳。作為ny的下限,0.3以上為較佳,0.4以上為更佳,0.6以上為特佳。作為上限,0.9以下為較佳,0.8以下為更佳。Nx, ny is the molar fraction, nx+ny can be less than 1 (meaning that there may be other repeating units), but 1 is preferred. The lower limit of nx is preferably 0.05 or more, more preferably 0.1 or more, and particularly preferably 0.2 or more. As the upper limit, 0.7 or less is preferable, 0.6 or less is more preferable, and 0.5 or less is particularly preferable. As the lower limit of ny, 0.3 or more is preferable, 0.4 or more is more preferable, and 0.6 or more is particularly preferable. As the upper limit, 0.9 or less is preferable, and 0.8 or less is more preferable.

作為鹼可溶性樹脂的具體例子,可舉出以後述的BX編號之例示化合物。Specific examples of the alkali-soluble resin include exemplified compounds of the BX number described later.

作為鹼可溶性樹脂,苄基(甲基)丙烯酸酯/(甲基)丙烯酸共聚物或由苄基(甲基)丙烯酸酯/(甲基)丙烯酸/其他單體構成之多元共聚物尤其適合。此外,可舉出將2-羥基乙基甲基丙烯酸酯進行共聚者、日本專利公開平7-140654號公報中記載的、2-羥基丙基(甲基)丙烯酸酯/聚苯乙烯大分子單體/苄基甲基丙烯酸酯/甲基丙烯酸共聚物、2-羥基-3-苯氧基丙基丙烯酸酯/聚甲基丙烯酸甲酯大分子單體/苄基甲基丙烯酸酯/甲基丙烯酸共聚物、2-羥基乙基甲基丙烯酸酯/聚苯乙烯大分子單體/甲基丙烯酸甲酯/甲基丙烯酸共聚物、2-羥基乙基甲基丙烯酸酯/聚苯乙烯大分子單體/苄基甲基丙烯酸酯/甲基丙烯酸共聚物等。As the alkali-soluble resin, a benzyl (meth) acrylate / (meth) acryl copolymer or a multicomponent copolymer composed of benzyl (meth) acrylate / (meth) acrylate / other monomer is particularly suitable. Further, a 2-hydroxypropyl (meth) acrylate/polystyrene macromonomer described in JP-A-7-140654, which is a copolymer of 2-hydroxyethyl methacrylate, may be mentioned. /benzyl methacrylate / methacrylic acid copolymer, 2-hydroxy-3-phenoxypropyl acrylate / polymethyl methacrylate macromer / benzyl methacrylate / methacrylic acid Copolymer, 2-hydroxyethyl methacrylate/polystyrene macromer/methyl methacrylate/methacrylic acid copolymer, 2-hydroxyethyl methacrylate/polystyrene macromonomer /benzyl methacrylate / methacrylic acid copolymer and the like.

作為鹼可溶性樹脂的重量平均分子量(Mw),2,000~50,000為較佳,5,000~30,000為進一步較佳,7,000~20,000為特佳。The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 2,000 to 50,000, more preferably 5,000 to 30,000, and particularly preferably 7,000 to 20,000.

作為鹼可溶性樹脂的含量,相對於組成物的總固體含量,10~50質量%為較佳,15~40質量%為更佳,20~35質量%為特佳。在條件(b)中與矽氧烷樹脂(II)組合時,相對於矽氧烷樹脂(II)100質量份,鹼可溶性樹脂的下限為30質量份以上為較佳,40質量份以上為更佳,50質量份以上為特佳。作為上限,90質量份以下為較佳,80質量份以下為更佳,70質量份以下為特佳。The content of the alkali-soluble resin is preferably 10 to 50% by mass, more preferably 15 to 40% by mass, even more preferably 20 to 35% by mass, based on the total solid content of the composition. In the condition (b) When the siloxane oxide resin (II) is combined, the lower limit of the alkali-soluble resin is preferably 30 parts by mass or more, more preferably 40 parts by mass or more, and 50 parts by mass or more, based on 100 parts by mass of the siloxane oxide resin (II). Very good. The upper limit is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, and particularly preferably 70 parts by mass or less.

鹼可溶性樹脂能夠單獨使用1種亦可組合2種以上來使用。The alkali-soluble resin can be used alone or in combination of two or more.

<低分子有機酸><Low molecular organic acid>

本發明的矽氧烷樹脂組成物可含有低分子的有機酸(低分子有機酸)。低分子有機酸係,只要為單一的分子,便為實際上不具有分子量分佈之分子、並且具有酸性官能基之有機化合物。酸性官能基的pKa係5.5以下為較佳,5以下為更佳,4以下為特佳。下限値無特別限定,但實際上為-3以上。作為具體的結構,含有選自羧基、磷酸基、膦酸基以及磺酸基之至少1種為較佳。酸值係50mgKOH/g以上為較佳,100mgKOH/g以上為更佳,150mgKOH/g以上為進一步較佳,200mgKOH/g以上為特佳。上限値係700mgKOH/g以下為較佳,500mgKOH/g以下為更佳。The naphthenic resin composition of the present invention may contain a low molecular organic acid (low molecular organic acid). The low molecular organic acid system is a molecule having virtually no molecular weight distribution and having an acidic function as long as it is a single molecule. The organic functional group has a pKa of 5.5 or less, more preferably 5 or less, more preferably 4 or less, and the lower limit is not particularly limited, but is actually -3 or more. At least one of a carboxyl group, a phosphoric acid group, a phosphonic acid group, and a sulfonic acid group is preferred. The acid value is preferably 50 mgKOH/g or more, more preferably 100 mgKOH/g or more, further preferably 150 mgKOH/g or more, and 200 mgKOH. More preferably, the upper limit is 700 mgKOH/g or less, and more preferably 500 mgKOH/g or less.

低分子有機酸的添加量在矽氧烷樹脂組成物中0.1質量%以上為較佳,0.2質量%以上為更佳,0.3質量%以上為進一步較佳。上限値係3質量%以下為較佳,2質量%以下為更佳,1質量%以下為進一步較佳。固體成分中,1質量%以上為較佳,1.5質量%以上為更佳,2質量%以上為進一步較佳。上限値係10質量%以下為較佳,8質量%以下為更佳,7質量%以下為進一步較佳。The amount of the low molecular organic acid to be added is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and still more preferably 0.3% by mass or more, more preferably 0.3% by mass or more. 2% by mass or less is more preferably 1% by mass or less. Further, 1% by mass or more of the solid content is preferable, and 1.5% by mass or more is more preferable, and 2% by mass or more is more preferable. 10% by mass or less is preferable, 8% by mass or less is more preferable, and 7% by mass or less is further more preferable.

矽氧烷樹脂與低分子有機酸的比率“矽氧烷樹脂”/“低分子有機酸”係3~50為較佳,5~30為更佳,6~25為進一步較佳,7~20為特佳。藉由設為該範圍,能夠使膜良好地滲入顯影液中,從而進一步提高分辨率。The ratio of the decane resin to the low molecular organic acid is preferably 3 to 50, more preferably 5 to 30, and further preferably 6 to 25. It is especially good. By setting it as this range, the film can be infiltrated into the developing solution favorably, and the resolution can be improved further.

<顯影性><developability>

本發明之滿足條件(a)或(b)之矽氧烷樹脂或者其組合(以下,稱為“特定鹼可溶性樹脂組”)係在23℃下可溶於0.1質量%以上的濃度的四甲基氫氧化銨(TMAH)水溶液者為較佳。可溶於1質量%以上的TMAH水溶液為進一步較佳,可溶於2質量%以上的TMAH水溶液為進一步較佳。The decyl alkane resin satisfying the condition (a) or (b) of the present invention or a combination thereof (hereinafter referred to as "specific alkali-soluble resin group") is a tetramethyl group which is soluble in a concentration of 0.1% by mass or more at 23 ° C. Aqueous ammonium hydroxide (TMAH) aqueous solution is preferred. Further, a TMAH aqueous solution which is soluble in 1% by mass or more is more preferably, and a TMAH aqueous solution which is soluble in 2% by mass or more is further preferable.

作為特定鹼可溶性樹脂組的酸值,30mgKOH/g以上為較佳,50mgKOH/g以上為更佳,70mgKOH/g以上為特佳。作為上限,200mgKOH/g以下為較佳,150mgKOH/g以下為更佳,120mgKOH/g以下為特佳。藉由設為該種範圍,既能發揮所希望的光學特性,又能有效地降低未曝光部的顯影殘渣。另外,條件(a)中,矽氧烷樹脂(I)係上述酸值的範圍為較佳。條件(b)中,鹼可溶性樹脂係上述酸值的範圍為較佳。藉由矽氧烷樹脂(I)具有上述酸值,能夠以較高之水平實現光學特性和顯影性的相容性,因此為特佳。The acid value of the specific alkali-soluble resin group is preferably 30 mgKOH/g or more, more preferably 50 mgKOH/g or more, and particularly preferably 70 mgKOH/g or more. The upper limit is preferably 200 mgKOH/g or less, and 150 mgKOH/g or less is preferably 150 mgKOH/g or less. More preferably, it is particularly preferably 120 mgKOH/g or less. By setting it as such a range, it is possible to exhibit desired optical characteristics and to effectively reduce the development residue of the unexposed portion. Further, in the condition (a), oxygen is contained. The range of the above acid value of the alkane resin (I) is preferred. In the condition (b), the alkali-soluble resin is preferably in the range of the acid value described above. By having the above-mentioned acid value, the oxirane resin (I) can achieve compatibility between optical properties and developability at a high level. Therefore it is especially good.

・酸值的測定・Measurement of acid value

本說明書中,在0.1N・KOH乙醇溶液中滴定來計算酸值。具體項目依據JIS K 0070:1992的酸值的測定方法。具體而言,使一定量的樹脂溶解於1-甲氧基-2-丙基醋酸酯中,以酚酞作為指示劑,在KOH/乙醇溶液中滴定來進行測定。In the present specification, the acid value is calculated by titration in a 0.1 N KOH ethanol solution. The specific item is based on the method for measuring the acid value in JIS K 0070: 1992. Specifically, a certain amount of the resin is dissolved in 1-methoxy- Among the 2-propyl acetates, phenolphthalein was used as an indicator and titrated in a KOH/ethanol solution to carry out measurement.

<聚合抑制劑><Polymerization inhibitor>

本發明的矽氧烷樹脂組成物中可含有聚合抑制劑。作為聚合抑制劑,可舉出含酚羥基化合物、N-氧化物類、哌啶1-氧基自由基化合物類、吡咯烷1-氧基自由基化合物類、N-亞硝基苯胲銨類、重氮化合物類以及陽離子染料類、含硫醚基化合物類、含硝基化合物類、FeCl3 、CuCl2 等過渡金屬化合物類。作為聚合抑制劑,具體而言能夠參閱日本特開2010-106268號公報的段落0260~0280(所對應之美國專利申請公開第2011/0124824號說明書的<0284>~<0296>)的說明,該些內容引入本申請說明書中。The polymerization inhibitor may be contained in the rhodium oxide resin composition of the present invention. Examples of the polymerization inhibitor include a phenolic hydroxyl group-containing compound, an N-oxide compound, a piperidine 1-oxyl radical compound, a pyrrolidine 1-oxyl radical compound, and an N-nitrosobenzamide. And transition metal compounds such as diazo compounds and cationic dyes, sulfur-containing ether-based compounds, nitro-containing compounds, FeCl 3 , and CuCl 2 . As a polymerization inhibitor, the description of paragraphs 0260 to 0280 of the Japanese Patent Laid-Open Publication No. 2010-106268 (the <0284> to <0296> of the specification of the corresponding US Patent Application Publication No. 2011/0124824) can be referred to. These are incorporated in the specification of the present application.

作為聚合抑制劑的較佳添加量,相對於聚合起始劑100質量份,0.01質量份以上10質量份以下為較佳,0.01質量份以上8質量份以下進一步較佳,在0.05質量份以上5質量份以下的範圍為最佳。The amount of the polymerization inhibitor to be added is preferably 0.01 parts by mass or more and 10 parts by mass or less, more preferably 0.01 parts by mass or more and 8 parts by mass or less, and more preferably 0.05 parts by mass or more, based on 100 parts by mass of the polymerization initiator. The range below the mass fraction is optimal.

聚合抑制劑可單獨使用1種亦可組合2種以上來使用。The polymerization inhibitor may be used singly or in combination of two or more.

<分散劑><dispersant>

作為分散劑,以日本特開2007-277514號公報的申請專利範圍第1項(所對應之US2010/0233595的申請專利範圍第1項)的通式(1)表示之高分子化合物為較佳。能夠參閱日本特開2007-277514號公報(所對應之US2010/0233595)的記載,該些內容引入本申請說明書中。As the dispersing agent, a polymer compound represented by the formula (1) represented by the first aspect of the application of the Japanese Patent Application Laid-Open No. 2007-277514 (corresponding to the first application of US2010/0233595) is preferred. The description of Japanese Patent Publication No. 2007-277514 (corresponding to US 2010/0233595) is incorporated herein by reference.

以上述通式(1)表示之高分子化合物並無特別限定,但能夠依據日本特開2007-277514號公報的段落0114~0140以及段落0266~0348中記載的合成方法進行合成。The polymer compound represented by the above formula (1) is not particularly limited, and can be synthesized in accordance with the synthesis methods described in paragraphs 0114 to 0140 and paragraphs 0266 to 0348 of JP-A-2007-277514.

作為分散劑的含量,相對於含金屬粒子100質量份,10~1000質量份為較佳,30~1000質量份為更佳,50~800質量份進一步較佳。又,相對於組成物的總固體含量,10~30質量%為較佳。該些分散劑可單獨使用亦可組合2種以上來使用。The content of the dispersant is preferably 10 to 1000 parts by mass, more preferably 30 to 1000 parts by mass, even more preferably 50 to 800 parts by mass, per 100 parts by mass of the metal-containing particles. Further, it is preferably 10 to 30% by mass based on the total solid content of the composition. These dispersing agents may be used singly or in combination of two or more.

<界面活性劑><Surfactant>

本發明的矽氧烷樹脂組成物可包含界面活性劑。作為界面活性劑,例如可舉出矽酮系界面活性劑、有機聚矽氧烷系等矽系界面活性劑、氟系界面活性劑、聚氧乙烯十二烷基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇月桂酸酯或者聚乙二醇二硬脂酸酯等非離子系界面活性劑、聚環氧烷系界面活性劑、聚(甲基)丙烯酸酯系界面活性劑或由丙烯酸系或者甲基丙烯酸系的聚合物構成之界面活性劑。作為市售品的界面活性劑,例如可舉出“Megafac”(註冊商標)F142D、F172、F173、F183、F445、F470、F475或者F477(均為DIC Corporation Co., Ltd.製造)或NBX-15或者FTX-218(均為NEOS COMPANYLIMITED製造)等氟系界面活性劑、BYK-333、BYK-301、BYK-331、BYK-345或者BYK-307(均為BYK Additives & Instruments製造)等矽酮系界面活性劑。The decane resin composition of the present invention may comprise a surfactant. Examples of the surfactant include an anthrone-based surfactant, an anthraquinone surfactant such as an organic polyoxyalkylene-based surfactant, a fluorine-based surfactant, a polyoxyethylene lauryl ether, and a polyoxyethylene oleyl ether. Non-ionic surfactants such as polyoxyethylene octyl phenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol laurate or polyethylene glycol distearate, and polyalkylene oxide interface An active agent, a poly(meth)acrylate surfactant, or a surfactant composed of an acrylic or methacrylic polymer. The surfactant which is a commercial item is, for example, "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475 or F477 (all manufactured by DIC Corporation Co., Ltd.) or NBX- 15 or FTX-218 (both manufactured by NEOS COMPANYLIMITED) and other fluorine-based surfactants, BYK-333, BYK-301, BYK-331, BYK-345 or BYK-307 (all manufactured by BYK Additives & Instruments) Is a surfactant.

關於界面活性劑的添加量,在組成物的固體成分中,1質量%以上為較佳,1.5質量%以上為更佳,5質量%以上為特佳。上限値係30質量%以下為較佳,15質量%以下為更佳。The amount of the surfactant to be added is preferably 1% by mass or more, more preferably 1.5% by mass or more, and particularly preferably 5% by mass or more, based on the solid content of the composition. The upper limit 値 is preferably 30% by mass or less, more preferably 15% by mass or less.

界面活性劑可單獨使用1種亦可組合2種以上來使用。The surfactant may be used singly or in combination of two or more.

本發明的矽氧烷樹脂組成物可依據需要而含有其他溶解抑制劑、穩定劑或消泡劑等添加劑。The rhodium oxide resin composition of the present invention may contain other additives such as a dissolution inhibitor, a stabilizer or an antifoaming agent as needed.

<顯影液><developer>

作為顯影液,使用鹼性溶液為較佳。例如將鹼性化合物的濃度設為0.001~10質量%為較佳,設為0.01~5質量%為更佳。鹼性化合物例如可舉出氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨、乙基胺、二乙基胺、二甲基乙醇胺、四甲基氫氧化銨、四乙基氫氧化銨、四丙基氫氧化銨、四丁基銨羥基、氫氧化苄基三甲銨、膽鹼、吡咯、哌啶、1,8-二氮雜雙環[5.4.0]-7-十一碳烯等。其中,本發明中,有機鹼為較佳。另外,將鹼性水溶液用作顯影液時,通常在顯影之後用水實施清洗處理。該些顯影液中,第四級銨鹽為較佳,四甲基氫氧化銨(TMAH)或者膽鹼為更佳。As the developer, an alkaline solution is preferably used. For example, the concentration of the basic compound is preferably 0.001 to 10% by mass, more preferably 0.01 to 5% by mass. Examples of the basic compound include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, ammonia, ethylamine, diethylamine, dimethylethanolamine, and tetramethylammonium hydroxide. Tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxy, benzyltrimethylammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7 - undecene and the like. Among them, in the present invention, an organic base is preferred. Further, when an alkaline aqueous solution is used as the developer, the cleaning treatment is usually carried out with water after development. Among the developing solutions, a fourth-order ammonium salt is preferred, and tetramethylammonium hydroxide (TMAH) or choline is more preferred.

顯影液可單獨使用1種亦可組合2種以上來使用。The developer may be used singly or in combination of two or more.

另外,對於本說明書中化合物的表示(例如,於末尾附加化合物而稱呼時),除了上述化合物本身之外,還以包含其鹽、其離子之含義使用。又,係指在可發揮所希望的效果的範圍內,包含導入取代基等使一部分發生變化之衍生物。In addition, the expression of the compound in the present specification (for example, when a compound is added at the end) is used in addition to the above-mentioned compound itself in the meaning of including a salt thereof and an ion thereof. In addition, it means a derivative in which a part is changed such that a substituent is introduced, within a range in which a desired effect can be exhibited.

本說明書中對於未標明取代、未取代之取代基(對於連結基亦相同),係指在該基團上可具有任意取代基。這對於未標明取代、未取代之化合物而言亦為相同含義。作為較佳取代基,可舉出下述取代基T。In the present specification, a substituent which is not indicated to be substituted or unsubstituted (the same for the linking group) means that any substituent may be present on the group. This also has the same meaning for compounds that are not labeled as substituted or unsubstituted. As a preferable substituent, the following substituent T is mentioned.

作為取代基T,可舉出下述取代基。The substituent T is exemplified by the following substituents.

可舉出烷基(碳原子數1~20的烷基為較佳,例如甲基、乙基、異丙基、第三丁基、戊基、庚基、1-乙基戊基、苄基、2-乙氧基乙基、1-羧基甲基等)、烯基(碳原子數2~20的烯基為較佳,例如,乙烯基、烯丙基、油烯基等)、炔基(碳原子數2~20的炔基為較佳,例如,乙炔基、丁二炔基、苯基乙炔基等)、環烷基(碳原子數3~20的環烷基為較佳,例如,環丙基、環戊基、環己基、4-甲基環己基等,但記為烷基時通常係包含環烷基之含義。)、芳基(碳原子數6~26的芳基為較佳,例如,苯基、1-萘基、4-甲氧基苯基、2-氯苯基、3-甲基苯基等)、雜環基(碳原子數2~20的雜環基為較佳,具有至少1個氧原子、硫黄原子、氮原子之5或6員環的雜環基為較佳,例如,四氫吡喃、四氫呋喃、2-吡啶基、4-吡啶基、2-咪唑基、2-苯并咪唑基、2-噻唑基、2-噁唑基、吡咯烷酮基等)、烷氧基(碳原子數1~20的烷氧基為較佳,例如,甲氧基、乙氧基、異丙氧基、苄氧基等)、芳氧基(碳原子數6~26的芳氧基為較佳,例如,苯氧基、1-萘氧基、3-甲基苯氧基、4-甲氧基苯氧基等)、烷氧基羰基(碳原子數2~20的烷氧基羰基為較佳、例如,乙氧基羰基、2-乙基己基氧基羰基等)、芳氧基羰基(碳原子數6~26的芳氧基羰基為較佳,例如,苯氧基羰基、1-萘基氧基羰基、3-甲基苯氧基羰基、4-甲氧基苯氧基羰基等)、氨基(碳原子數0~20的氨基為較佳,包含烷基氨基、芳基氨基,例如,氨、N,N-二甲基氨、N,N-二乙基氨、N-乙基氨基、苯胺基等)、胺磺醯基(碳原子數0~20的胺磺醯基為較佳,例如,N,N-二甲基胺磺醯基、N-苯基胺磺醯基等)、醯基(碳原子數1~20的醯基為較佳,例如,乙醯基、丙醯基、丁醯基等)、芳醯基(碳原子數7~23的芳醯基為較佳,例如,苯甲醯等)、醯氧基(碳原子數1~20的醯氧基為較佳,例如,乙醯氧基等)、芳醯氧基(碳原子數7~23的芳醯氧基為較佳,例如,苯甲醯氧基等)、胺甲醯基(碳原子數1~20的胺甲醯基為較佳,例如,N,N-二甲基胺甲醯基、N-苯基胺甲醯基等)、醯氨基(碳原子數1~20的醯氨基為較佳,例如,乙醯氨基、苯甲醯氨基等)、烷硫基(碳原子數1~20的烷硫基為較佳,例如,甲硫基、乙硫基、異丙硫基、苄基硫基等)、芳硫基(碳原子數6~26的芳硫基為較佳,例如,苯硫基、1-萘硫基、3-甲基苯硫基、4-甲氧基苯硫基等)、烷基磺醯基(碳原子數1~20的烷基磺醯基為較佳,例如,甲基磺醯基、乙基磺醯基等)、芳基磺醯基(碳原子數6~22的芳基磺醯基為較佳,例如,苯磺醯基等)、烷基甲矽烷基(碳原子數1~20的烷基甲矽烷基為較佳,例如,單甲基甲矽烷基、二甲基甲矽烷基、三甲基甲矽烷基、三乙基甲矽烷基等)、芳基甲矽烷基(碳原子數6~42的芳基甲矽烷基為較佳,例如,三苯基甲矽烷基等)、膦醯基(碳原子數0~20的膦醯基為較佳,例如,-OP(=O)(RP2 )、膦醯基(碳原子數0~20的膦醯基為較佳,例如,-P(=O)(RP2 )、氧膦基(碳原子數0~20的氧膦基為較佳,例如,-P(RP2 )、(甲基)丙烯醯基、(甲基)丙烯醯氧基、(甲基)丙烯醯亞氨基((甲基)丙烯醯氨基)、羥基、硫醇基、羧基、磷酸基、膦酸基、磺酸基、氰基、鹵素原子(例如氟原子、氯原子、溴原子、碘原子等)。The alkyl group (alkyl group having 1 to 20 carbon atoms is preferred, and examples thereof include a methyl group, an ethyl group, an isopropyl group, a tert-butyl group, a pentyl group, a heptyl group, a 1-ethylpentyl group, and a benzyl group. , 2-ethoxyethyl, 1-carboxymethyl, etc.), alkenyl (alkenyl having 2 to 20 carbon atoms is preferred, for example, vinyl, allyl, oleyl, etc.), alkynyl (Alkynyl group having 2 to 20 carbon atoms is preferable, for example, an ethynyl group, a butadiynyl group or a phenylethynyl group), and a cycloalkyl group (a cycloalkyl group having 3 to 20 carbon atoms is preferable, for example, , cyclopropyl, cyclopentyl, cyclohexyl, 4-methylcyclohexyl, etc., but when it is referred to as an alkyl group, it usually contains a meaning of a cycloalkyl group.), an aryl group (an aryl group having 6 to 26 carbon atoms is Preferred, for example, phenyl, 1-naphthyl, 4-methoxyphenyl, 2-chlorophenyl, 3-methylphenyl, etc.), heterocyclic group (heterocyclic group having 2 to 20 carbon atoms) Preferably, a heterocyclic group having at least one oxygen atom, a sulfur atom, a nitrogen atom or a 5- or 6-membered ring is preferred, for example, tetrahydropyran, tetrahydrofuran, 2-pyridyl, 4-pyridyl, 2 -imidazolyl, 2-benzimidazolyl, 2-thiazolyl, 2-oxazolyl, pyrrolidine A ketone group or the like), an alkoxy group (an alkoxy group having 1 to 20 carbon atoms is preferable, for example, a methoxy group, an ethoxy group, an isopropoxy group, a benzyloxy group or the like), an aryloxy group (a carbon atom) An aryloxy group of 6 to 26 is preferred, for example, a phenoxy group, a 1-naphthyloxy group, a 3-methylphenoxy group, a 4-methoxyphenoxy group, etc.), an alkoxycarbonyl group (a carbon atom) The alkoxycarbonyl group having 2 to 20 is preferably, for example, an ethoxycarbonyl group, a 2-ethylhexyloxycarbonyl group or the like, and an aryloxycarbonyl group (an aryloxycarbonyl group having 6 to 26 carbon atoms is preferred). For example, a phenoxycarbonyl group, a 1-naphthyloxycarbonyl group, a 3-methylphenoxycarbonyl group, a 4-methoxyphenoxycarbonyl group, or the like), an amino group (an amino group having 0 to 20 carbon atoms is preferred) , comprising an alkylamino group, an arylamino group, for example, ammonia, N,N-dimethylamino, N,N-diethylamino, N-ethylamino, anilino, etc.), an amine sulfonyl group (carbon atom) Aminosulfonyl group of 0 to 20 is preferred, for example, N,N-dimethylaminesulfonyl, N-phenylaminesulfonyl, etc., fluorenyl (fluorenyl group having 1 to 20 carbon atoms) Preferred, for example, ethyl thiol, propyl fluorenyl, butyl fluorenyl, etc., aryl fluorenyl (carbon number 7) Preferably, the aryl group of ~23 is, for example, benzamidine or the like), a decyloxy group (an oxiranyl group having 1 to 20 carbon atoms is preferable, for example, an ethoxy group, etc.), and an aryloxy group (for example). An aryloxy group having 7 to 23 carbon atoms is preferred, for example, a benzylideneoxy group or the like, and an aminomethyl group (an aminopyridyl group having 1 to 20 carbon atoms is preferred, for example, N, N). - dimethylaminomethyl hydrazino group, N-phenylamine carbhydryl group, etc.), fluorenylamino group (p-amino group having 1 to 20 carbon atoms is preferable, for example, acetylamino group, benzamidine amino group, etc.), and alkane a sulfur group (an alkylthio group having 1 to 20 carbon atoms is preferred, for example, a methylthio group, an ethylthio group, an isopropylthio group, a benzylthio group, etc.), and an arylthio group (having a carbon number of 6 to 26) An arylthio group is preferred, for example, a phenylthio group, a 1-naphthylthio group, a 3-methylphenylthio group, a 4-methoxyphenylthio group, etc.), an alkylsulfonyl group (having a carbon number of 1 to 20) The alkylsulfonyl group is preferably, for example, a methylsulfonyl group or an ethylsulfonyl group, or an arylsulfonyl group (an arylsulfonyl group having 6 to 22 carbon atoms is preferred, for example, a phenyl sulfonyl group, etc., an alkyl formamyl group (an alkyl formyl group having 1 to 20 carbon atoms) Preferably, for example, monomethylformamidinyl, dimethylformamidinyl, trimethylformamidinyl, triethylcarbinyl, etc.), arylmethanyl (aryl group having 6 to 42 carbon atoms) A decyl group is preferred, for example, a triphenylcarbenyl group, etc., a phosphinium group (a phosphonium group having 0 to 20 carbon atoms is preferred, for example, -OP(=O)(R P ) 2 ), A phosphinium group (phosphono group having 0 to 20 carbon atoms is preferred, for example, -P(=O)(R P ) 2 ), and a phosphinyl group (oxyphosphinyl group having 0 to 20 carbon atoms is preferred). , for example, -P(R P ) 2 ), (meth)acrylylene, (meth)acryloxy, (meth)acrylimidoimino ((meth)acryloylamino), hydroxyl, sulfur An alcohol group, a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, a cyano group, a halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or the like).

又,在該些取代基T中舉出之各基團中,上述取代基T可進一步進行取代。Further, in each of the groups described in the substituents T, the substituent T may be further substituted.

又,上述取代基為酸性基或鹼性基時,可形成其鹽。Further, when the above substituent is an acidic group or a basic group, a salt thereof can be formed.

化合物乃至取代基、連結基等包含烷基、亞烷基、烯基、亞烯基、炔基、亞炔基等時,該些可以是環狀亦可以是鏈狀,並且可以是直鏈亦可以支鏈,可如上述那樣被取代亦可未取代。When the compound or the substituent, the linking group or the like contains an alkyl group, an alkylene group, an alkenyl group, an alkenylene group, an alkynyl group, an alkynylene group or the like, these may be cyclic or chain-like, and may be a straight chain. It may be branched and may be substituted or unsubstituted as described above.

本說明書中規定之各取代基可在發揮本發明的效果之範圍內經由下述連結基L被取代,亦可在其結構中介入有連結基L。例如,烷基、亞烷基、烯基、亞烯基等可進一步在結構中介入有下述雜連結基。Each of the substituents defined in the present specification may be substituted by the following linking group L within the range in which the effects of the present invention are exerted, or a linking group L may be interposed in the structure. For example, an alkyl group, an alkylene group, an alkenyl group, an alkenylene group or the like may further have a hetero-linking group interposed in the structure.

作為連結基L,烴連結基〔碳原子數1~10的亞烷基(碳原子數1~6為更佳,1~3進一步較佳)、碳原子數2~10的亞烯基(碳原子數2~6為更佳,2~4進一步較佳)、碳原子數2~10的亞炔基(碳原子數2~6為更佳,2~4進一步較佳)、碳原子數6~22的亞芳基(碳原子數6~10為更佳)、或該些的組合〕、雜連結基〔羰基(-CO-)、硫羰基(-CS-)、醚基(-O-)、硫醚基(-S-)、亞氨基(-NRN -)、銨連結基(-NRN 2 +-)、聚硫基(S的數為1~8個)、亞胺連結基(RN -N=C<,-N=C(RN )-)、磺醯基(-SO2 -)、亞磺醯基(-SO-)、磷酸連結基(-O-P(OH)(O)-O-)、膦酸連結基(-P(OH)(O)-O-)、或該些的組合〕、或組合該些之連結基為較佳。另外,縮合而形成環時,上述烴連結基可適當形成雙鍵或三鍵來連接。作為所形成之環較佳為5員環或6員環為較佳。作為5員環,含氮的5員環為較佳,若例示為構成其環之化合物,則可舉出吡咯、咪唑、吡唑、吲唑、吲哚、苯并咪唑、哌啶、咪唑烷、吡唑烷、吲哚啉、咔唑或該些的衍生物等。作為6員環,可舉出哌啶、嗎啉、哌嗪或該些的衍生物等。又,包含芳基、雜環基等時,它們可以是單環亦可以是縮環,同樣地可被取代亦可未取代。As the linking group L, a hydrocarbon linking group [alkylene group having 1 to 10 carbon atoms (more preferably 1 to 6 carbon atoms, further preferably 1 to 3) or an alkenylene group having 2 to 10 carbon atoms (carbon) The number of atoms is preferably 2 to 6 and more preferably 2 to 4, and the alkynylene group having 2 to 10 carbon atoms (more preferably 2 to 6 carbon atoms, still more preferably 2 to 4), and 6 carbon atoms. An arylene group of ~22 (more preferably 6 to 10 carbon atoms) or a combination thereof; a hetero linkage group [carbonyl (-CO-), thiocarbonyl (-CS-), ether group (-O-) ), a thioether group (-S-), an imino group (-NR N -), an ammonium linking group (-NR N 2 +-), a polysulfide group (the number of S is 1 to 8), an imine linking group (R N -N=C<, -N=C(R N )-), sulfonyl (-SO 2 -), sulfinyl (-SO-), phosphate linkage (-OP(OH)( O)-O-), a phosphonic acid linkage (-P(OH)(O)-O-), or a combination thereof, or a combination of these is preferred. Further, when the ring is formed by condensation, the hydrocarbon linking group may be appropriately bonded to form a double bond or a triple bond. The ring formed is preferably a 5-membered ring or a 6-membered ring. As the 5-membered ring, a nitrogen-containing 5-membered ring is preferred. Examples of the compound constituting the ring include pyrrole, imidazole, pyrazole, oxazole, indole, benzimidazole, piperidine, and imidazolidine. , pyrazolidine, porphyrin, carbazole or derivatives thereof. Examples of the 6-membered ring include piperidine, morpholine, piperazine, and derivatives thereof. Further, when an aryl group, a heterocyclic group or the like is contained, they may be a monocyclic ring or a condensed ring, and may be substituted or unsubstituted in the same manner.

RN 係氫原子或取代基。作為取代基,烷基(碳原子數1~24為較佳,1~12為更佳,1~6為進一步較佳,1~3為特佳)、烯基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、炔基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、芳烷基(碳原子數7~22為較佳,7~14為更佳,7~10為特佳)、芳基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)為較佳。R N is a hydrogen atom or a substituent. The alkyl group (preferably having 1 to 24 carbon atoms, more preferably 1 to 12, more preferably 1 to 6 or more preferably 1 to 3) or an alkenyl group (having 2 to 24 carbon atoms) is preferred. Preferably, 2 to 12 are more preferred, 2 to 6 are further preferred, 2 to 3 are particularly preferred, and alkynyl groups are preferred (carbon number 2 to 24 is preferred, 2 to 12 is more preferred, and 2 to 6 is Further preferably, 2 to 3 are particularly preferred), an aralkyl group (preferably having 7 to 22 carbon atoms, more preferably 7 to 14 carbon atoms, and 7 to 10 is particularly preferred) and an aryl group (carbon number 6 to 22). Preferably, 6 to 14 is more preferred, and 6 to 10 is particularly preferred.

RP 係氫原子、羥基或取代基。作為取代基,烷基(碳原子數1~24為較佳,1~12為更佳,1~6為進一步較佳,1~3為特佳)、烯基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、炔基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、芳烷基(碳原子數7~22為較佳,7~14為更佳,7~10為特佳)、芳基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)、烷氧基(碳原子數1~24為較佳,1~12為更佳,1~6為進一步較佳,1~3為特佳)、鏈烯氧基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、炔氧基(碳原子數2~24為較佳,2~12為更佳,2~6為進一步較佳,2~3為特佳)、芳烷氧基(碳原子數7~22為較佳,7~14為更佳,7~10為特佳)、芳氧基(碳原子數6~22為較佳,6~14為更佳,6~10為特佳)為較佳。R P is a hydrogen atom, a hydroxyl group or a substituent. The alkyl group (preferably having 1 to 24 carbon atoms, more preferably 1 to 12, more preferably 1 to 6 or more preferably 1 to 3) or an alkenyl group (having 2 to 24 carbon atoms) is preferred. Preferably, 2 to 12 are more preferred, 2 to 6 are further preferred, 2 to 3 are particularly preferred, and alkynyl groups are preferred (carbon number 2 to 24 is preferred, 2 to 12 is more preferred, and 2 to 6 is Further preferably, 2 to 3 are particularly preferred), an aralkyl group (preferably having 7 to 22 carbon atoms, more preferably 7 to 14 carbon atoms, and 7 to 10 is particularly preferred) and an aryl group (carbon number 6 to 22). Preferably, 6 to 14 is more preferable, 6 to 10 is particularly preferred, and an alkoxy group (having preferably 1 to 24 carbon atoms, more preferably 1 to 12, still more preferably 1 to 6; 3 is particularly preferred), alkenyloxy group (2 to 24 carbon atoms is preferred, 2 to 12 is more preferred, 2 to 6 is further preferred, 2 to 3 is particularly preferred), alkynyloxy group (carbon atom) The number is preferably from 2 to 24, more preferably from 2 to 12, further preferably from 2 to 6, more preferably from 2 to 3, and an aralkoxy group (from 7 to 22, preferably from 7 to 14). More preferably, 7 to 10 is particularly preferred, and an aryloxy group (preferably having 6 to 22 carbon atoms, more preferably 6 to 14 or more preferably 6 to 10) is preferred.

構成連結基L之原子的數為1~36為較佳,1~24為更佳,1~12為進一步較佳,1~6為特佳。連結基的連接原子數為10以下為較佳,8以下為更佳。作為下限,為1以上。上述連接原子數是指位連結於規定的結構部之間之路徑並參與連接之最少的原子數。例如,-CH2 -C(=O)-O-時,構成連結基之原子的數為6,但連接原子數為3。The number of atoms constituting the linking group L is preferably from 1 to 36, more preferably from 1 to 24, further preferably from 1 to 12, particularly preferably from 1 to 6. The number of linking atoms of the linking group is preferably 10 or less, and more preferably 8 or less. The lower limit is 1 or more. The number of connected atoms refers to the number of atoms that are connected to a path between predetermined structural portions and participate in the connection. For example, in the case of -CH 2 -C(=O)-O-, the number of atoms constituting the linking group is 6, but the number of linking atoms is 3.

具體而言,作為連結基的組合,可舉出以下者。氧基羰基(-OCO-)、碳酸酯基(-OCOO-)、醯氨基(-CONH-)、氨酯基(-NHCOO-)、脲基(-NHCONH-)、(聚)亞烷氧基(-(Lr-O)x-)、羰基(聚)氧基亞烷基(-CO-(O-Lr)x-、羰基(聚)亞烷氧基(-CO-(Lr-O)x-)、羰基氧基(聚)亞烷氧基(-COO-(Lr-O)x-)、(聚)亞烷基亞氨基(-(Lr-NRN )x)、亞烷基(聚)亞氨基亞烷基(-Lr-(NRN -Lr)x-)、羰基(聚)亞氨基亞烷基(-CO-(NRN -Lr)x-)、羰基(聚)亞烷基亞氨基(-CO-(Lr-NRN )x-)、(聚)酯基(-(CO-O-Lr)x-、-(O-CO-Lr)x-、-(O-Lr-CO)x-、-(Lr-CO-O)x-、-(Lr-O-CO)x-)、(聚)醯氨基(-(CO-NRN -Lr)x-、-(NRN -CO-Lr)x-、-(NRN -Lr-CO)x-、-(Lr-CO-NRN )x-、-(Lr-NRN -CO)x-)等。x為1以上的整數,1~500為較佳,1~100為更佳。Specifically, the combination of the linking groups is exemplified below. Oxycarbonyl (-OCO-), carbonate (-OCOO-), decylamino (-CONH-), urethane (-NHCOO-), ureido (-NHCONH-), (poly)alkyleneoxy (-(Lr-O)x-), carbonyl (poly)oxyalkylene (-CO-(O-Lr)x-, carbonyl (poly)alkyleneoxy (-CO-(Lr-O)x) -), carbonyloxy (poly)alkyleneoxy (-COO-(Lr-O)x-), (poly)alkyleneimino (-(Lr-NR N )x), alkylene (poly Iminoalkylene (-Lr-(NR N -Lr)x-), carbonyl (poly)iminoalkylene (-CO-(NR N -Lr)x-), carbonyl (poly)alkylene Imino (-CO-(Lr-NR N )x-), (poly)ester (-(CO-O-Lr)x-, -(O-CO-Lr)x-, -(O-Lr- CO) x -, - (Lr -CO-O) x -, - (Lr-O-CO) x -), ( poly) acyl amino group (- (CO-NR N -Lr ) x -, - (NR N -CO-Lr)x-, -(NR N -Lr-CO)x-, -(Lr-CO-NR N )x-, -(Lr-NR N -CO)x-), etc. x is 1 or more The integer is preferably from 1 to 500, more preferably from 1 to 100.

Lr為亞烷基、亞烯基、亞炔基為較佳。Lr的碳原子數為1~12為較佳,1~6為更佳,1~3為特佳。複數個Lr和RN 、RP 、x等無需相同。連結基的取向並不受上述記載的限定,可理解為適當結合規定化學式之取向。Lr is preferably an alkylene group, an alkenylene group or an alkynylene group. The number of carbon atoms of Lr is preferably from 1 to 12, more preferably from 1 to 6, and particularly preferably from 1 to 3. The plural Lr and R N , R P , x, etc. need not be the same. The orientation of the linking group is not limited to the above description, and it can be understood that the orientation of the predetermined chemical formula is appropriately combined.

<透明硬化物的形成><Formation of transparent cured product>

對於利用本發明的矽氧烷樹脂組成物之透明硬化物(膜)的形成方法,舉例進行說明。將矽氧烷樹脂組成物作為塗佈液時,能夠藉由微型凹版塗佈法、旋塗法、浸塗法、簾流塗法(Curtain Flow Coating)、輥塗法、噴塗法或狹縫塗佈法等公知的方法塗佈於基底基板上。之後,能夠以加熱板或烘箱等加熱裝置進行預烘烤,從而形成膜。預烘烤在50~150℃進行30秒~30分鐘為較佳。預烘烤後的膜厚0.1~15μm為較佳。A method of forming a transparent cured product (film) using the decane resin composition of the present invention will be described by way of example. When the rhodium oxide resin composition is used as a coating liquid, it can be applied by a micro gravure coating method, a spin coating method, a dip coating method, a Curtain Flow Coating method, a roll coating method, a spray coating method or a slit coating method. A known method such as cloth method is applied to the base substrate. Thereafter, prebaking can be performed by a heating means such as a hot plate or an oven to form a film. Prebaking is preferably carried out at 50 to 150 ° C for 30 seconds to 30 minutes. The film thickness after prebaking is preferably 0.1 to 15 μm.

預烘烤後,例如使用步進機、鏡相投影曝光機(MPA)或平行光光刻機(以下,PLA)等曝光機,經由或不經由所希望的遮罩而照射10~4000J/m2 左右(波長365nm曝光量換算)的光。曝光光源(活性放射線)並無限制,能夠使用i射線(波長365nm)、g射線(波長436nm)或者h射線(波長405nm)等紫外線、KrF(波長248nm)雷射或ArF(波長193nm)雷射等。之後,亦可利用加熱板或烘箱等加熱裝置對該膜進行在150~450℃下加熱1小時左右之曝光後烘烤。本發明中,使用i射線為較佳。After the prebaking, for example, an exposure machine such as a stepper, a mirror projection machine (MPA) or a parallel photolithography machine (hereinafter, PLA) is used to irradiate 10 to 4000 J/m with or without a desired mask. Light of about 2 (wavelength of 365 nm exposure). The exposure light source (active radiation) is not limited, and ultraviolet rays such as i-ray (wavelength 365 nm), g-ray (wavelength 436 nm), or h-ray (wavelength 405 nm), KrF (wavelength 248 nm) laser or ArF (wavelength 193 nm) laser can be used. Wait. Thereafter, the film may be subjected to post-exposure baking by heating at 150 to 450 ° C for 1 hour using a heating means such as a hot plate or an oven. In the present invention, it is preferred to use i-rays.

圖案化曝光之後,藉由顯影,非曝光部溶解,從而能夠獲得負型圖案。作為顯影方法,以噴淋、浸漬或攪拌式(Paddle)等方法在顯影液中浸漬5秒~10分鐘之方法為較佳。作為顯影液,可舉出之前例示者。顯影之後,用水沖洗膜為較佳。接著,亦可在50~150℃下進行乾燥烘乾。之後,利用加熱板或烘箱等加熱裝置,在120~280℃下對該膜進行1小時左右的熱硬化,藉此獲得硬化物(膜)。After the patterning exposure, the non-exposed portion is dissolved by development, whereby a negative pattern can be obtained. As the developing method, a method of immersing in a developing solution for 5 seconds to 10 minutes by a method such as spraying, dipping or stirring is preferred. The developer will be exemplified as the developer. After development, it is preferred to rinse the film with water. Then, drying and drying can be carried out at 50 to 150 °C. Thereafter, the film is thermally cured at 120 to 280 ° C for about 1 hour by a heating means such as a hot plate or an oven to obtain a cured product (film).

組裝於固體攝像元件之透明像素等能夠以該種順序形成於基板上。Transparent pixels or the like assembled to the solid-state image sensor can be formed on the substrate in this order.

所獲得之硬化物(膜)的膜厚為0.1~10μm為較佳。漏電流為10-6 A/cm2 以下、介電常數為6.0以上為較佳。The film thickness of the obtained cured product (film) is preferably 0.1 to 10 μm. The leakage current is 10 -6 A/cm 2 or less, and the dielectric constant is 6.0 or more.

本發明的矽氧烷樹脂組成物的硬化膜的折射率為1.5以上為較佳,1.6以上為更佳,1.7以上為進一步較佳,1.8以上為特佳。並無特別的上限,但實際上為2.0以下。關於折射率,除非另有指明,則作為基於後述實施例中測定之條件者。The cured film of the decane resin composition of the present invention has a refractive index of preferably 1.5 or more, more preferably 1.6 or more, further preferably 1.7 or more, and particularly preferably 1.8 or more. There is no special upper limit, but it is actually 2.0 or less. Regarding the refractive index, unless otherwise specified, it is based on the conditions measured in the examples described later.

本發明的矽氧烷樹脂組成物的硬化膜的透明性較高為較佳。可見光的透射率為80%以上為較佳,88%以上為更佳,90%以上為特佳。並無特別的上限,但實際上為99%以下。對於可見光的透射率,除非另有指明,則作為基於後述實施例中測定之條件者。The cured film of the siloxane oxide resin composition of the present invention preferably has high transparency. The transmittance of visible light is preferably 80% or more, more preferably 88% or more, and particularly preferably 90% or more. There is no special upper limit, but it is actually 99% or less. The transmittance of visible light is used as a condition based on the measurement in the examples described later unless otherwise specified.

對本發明的矽氧烷樹脂組成物進行硬化來獲得之硬化膜尤其能夠適當用作固體攝像元件的微透鏡或透明像素。The cured film obtained by hardening the siloxane oxide resin composition of the present invention can be suitably used as a microlens or a transparent pixel of a solid-state image sensor.

<微透鏡陣列的形成方法><Method of Forming Microlens Array>

作為微透鏡的形成方法的一形態,對微透鏡陣列的形成步驟的一例進行說明。依據需要,藉由透明樹脂的旋轉塗佈法,填充具有凹凸之元件的表面等,使其平坦化。在已平坦化之表面均勻地塗佈透鏡材料。在透鏡材料上均勻地塗佈抗蝕劑。用步進機以十字線(Reticle)作為遮罩來進行紫外線照射,對透鏡間空間部分進行曝光。用顯影液對已感光之部分進行分解去除而形成圖案。藉由進行加熱,獲得半球狀的圖案。此時,抗蝕劑熔融而成為液相,成為半球狀態之後,改變為固相。之後,藉由乾式蝕刻對透鏡材料的層進行蝕刻。藉此,能夠形成排列有半球狀的透鏡之透鏡陣列。An example of a step of forming a microlens array will be described as an aspect of a method of forming a microlens. If necessary, the surface of the element having irregularities is filled by a spin coating method of a transparent resin to planarize it. The lens material is uniformly coated on the flattened surface. The resist is uniformly applied on the lens material. Ultraviolet irradiation was performed using a stepping machine with a cross wire (Reticle) as a mask to expose the space between the lenses. The photosensitive portion is decomposed and removed with a developer to form a pattern. By heating, a hemispherical pattern is obtained. At this time, the resist melts and becomes a liquid phase, and after changing to a hemispherical state, it changes to a solid phase. Thereafter, the layer of lens material is etched by dry etching. Thereby, a lens array in which hemispherical lenses are arranged can be formed.

作為透鏡陣列的形成步驟的其他實施形態,可舉出省略使用上述抗蝕劑而藉由曝光對透鏡材料進行圖案化之方法。該實施形態中,直接熔融已圖案化之透鏡材料,從而獲得半球狀的透鏡。As another embodiment of the step of forming the lens array, a method of patterning the lens material by exposure using the above-described resist is omitted. In this embodiment, the patterned lens material is directly melted to obtain a hemispherical lens.

<固體攝像元件><Solid image sensor>

本發明的較佳實施形態之固體攝像元件具有由本發明的矽氧烷樹脂組成物的硬化物構成之透明像素和/或微透鏡。在半導體受光單元上具有透鏡單元,並以透鏡陣列構件與濾色器相鄰之方式組裝。受光元件接收以透明樹脂膜、透鏡以及濾色器順序透過之光,作為圖像感測器發揮作用。具體而言,透明樹脂膜作為防反射膜發揮作用,提高透鏡的聚光效率,藉由透鏡有效地聚集之光經由濾色器而被受光元件檢測。該些轉移到檢測對應於每個RGB之光之整個元件而發揮作用。因此,即使在受光元件與透鏡以高密度排列時,亦能夠獲得極其鮮明的圖像。作為介入於上述透鏡和RGB的像素排列中之透明像素,能夠適當地利用本發明的矽氧烷樹脂組成物的硬化物。A solid-state image sensor according to a preferred embodiment of the present invention has a transparent pixel and/or a microlens composed of a cured product of the siloxane oxide resin composition of the present invention. A lens unit is provided on the semiconductor light receiving unit, and is assembled in such a manner that the lens array member is adjacent to the color filter. The light-receiving element receives light transmitted through the transparent resin film, the lens, and the color filter in order, and functions as an image sensor. Specifically, the transparent resin film functions as an antireflection film, and the condensing efficiency of the lens is improved, and the light that is efficiently collected by the lens is detected by the light receiving element via the color filter. These transitions play a role in detecting the entire component of the light corresponding to each RGB. Therefore, even when the light-receiving element and the lens are arranged at a high density, an extremely sharp image can be obtained. As the transparent pixel involved in the above-described lens and RGB pixel arrangement, the cured product of the siloxane oxide resin composition of the present invention can be suitably used.

作為適用透鏡陣列之固體攝像元件的例子,可舉出日本特開2007-119744號公報中記載者。具體而言,在形成於半導體基板表面之CCD區域或光電轉換部之間具有轉移電極,在其之上經由層間膜形成有遮光膜。在遮光膜上層疊有基於BPSG(Boro-Phospho-Silicate Glass)等之層間絶縁膜、鈍化膜以及基於丙烯酸系樹脂等之低折射率的透明平坦化膜,在其之上形成有組合了R.G.B.之濾色器。進一步經由保護膜,以位於受光區域亦即光電轉換部上方之方式排列形成多數個微透鏡而成。An example of a solid-state imaging device to which a lens array is applied is described in Japanese Laid-Open Patent Publication No. 2007-119744. Specifically, a transfer electrode is provided between the CCD region or the photoelectric conversion portion formed on the surface of the semiconductor substrate, and a light shielding film is formed thereon via the interlayer film. An interlayer insulating film based on BPSG (Boro-Phospho-Silicate Glass), a passivation film, and a transparent planarizing film having a low refractive index based on an acrylic resin or the like are laminated on the light-shielding film, and RGB is formed thereon. Color filter. Further, a plurality of microlenses are formed by arranging the protective film so as to be positioned above the photoelectric conversion portion, that is, the photoelectric conversion portion.

【實施例】[Examples]

以下,舉出實施例對本發明進行進一步詳細說明,但本發明並不被該些實施例限定來解釋。另外,本實施例中,“份”以及“%”除非另外指明,則均為質量基準。The invention is further illustrated by the following examples, but the invention is not to be construed as limited. In addition, in the present embodiment, "parts" and "%" are quality references unless otherwise specified.

<含有金屬氧化物微粒之矽氧烷樹脂A-1的合成例><Synthesis Example of Cerium Oxide Resin A-1 Containing Metal Oxide Fine Particles>

<核微粒的水分散溶膠(AA-1)的製備><Preparation of water-dispersed sol (AA-1) of nuclear particles>

將含有以TiO2 換算基準計7.8質量%的四氯化鈦之四氯化鈦水溶液7.6kg以及含有15質量%的氨之氨水3.0kg進行混合,從而製備pH9.5的白色漿料液。接著,過濾該白色漿液之後,以離子交換水清洗,從而獲得固體成分含量為10質量%的含水鈦酸濾餅6.2kg。7.6 kg of an aqueous titanium tetrachloride solution containing 7.8 mass% of titanium tetrachloride in terms of TiO 2 and 3.0 kg of ammonia water containing 15% by mass of ammonia were mixed to prepare a white slurry liquid having a pH of 9.5. Next, the white slurry was filtered, and then washed with ion-exchanged water to obtain 6.2 kg of an aqueous titanic acid filter cake having a solid content of 10% by mass.

接著,在該濾餅中添加含有35質量%的過氧化氫之過氧化氫水7.1kg與離子交換水20.0kg之後,在80℃的溫度下攪拌並加熱1小時,再添加離子交換水28.9kg,從而獲得含有以TiO2 換算基準計1質量%的過氧化鈦酸之過氧化鈦酸水溶液62.2kg。該過氧化鈦酸水溶液為透明的黃褐色,且pH為8.5。Next, 7.1 kg of hydrogen peroxide water containing 35% by mass of hydrogen peroxide and 20.0 kg of ion-exchanged water were added to the cake, and then stirred and heated at a temperature of 80 ° C for 1 hour, and then 28.9 kg of ion-exchanged water was added. Thus, 62.2 kg of an aqueous solution of titania acid containing 1% by mass of perovskinic acid based on TiO 2 conversion was obtained. The aqueous solution of titania acid was transparent yellowish brown and had a pH of 8.5.

接著,在上述過氧化鈦酸水溶液62.2kg中混合陽離子交換樹脂3.0kg,在攪拌下向其中緩慢添加含有以SnO2 換算基準計1質量%的錫酸鉀之錫酸鉀水溶液7.8kg。接著,分離引入鉀離子等之陽離子交換樹脂之後,將該混合水溶液在高壓釜中以165℃的溫度加熱18小時。Then, 3.0 kg of a cation exchange resin was mixed with 62.2 kg of the above aqueous solution of titania, and 7.8 kg of an aqueous potassium stannate solution containing 1% by mass of potassium stannate in terms of SnO 2 was slowly added thereto with stirring. Next, after separating the cation exchange resin into which potassium ions or the like were introduced, the mixed aqueous solution was heated in an autoclave at a temperature of 165 ° C for 18 hours.

接著,將所獲得之混合水溶液冷卻至室溫之後,以超濾膜裝置(Asahi Kasei Corporation.製造,ACV-3010)進行濃縮,從而獲得固體成分含量為10質量%的核微粒的水分散溶膠(AA-1)7.0kg。Then, the obtained mixed aqueous solution was cooled to room temperature, and then concentrated by an ultrafiltration membrane apparatus (Asahi Kasei Corporation., ACV-3010) to obtain a water-dispersed sol of core particles having a solid content of 10% by mass ( AA-1) 7.0kg.

如此獲得之含有金屬氧化物微粒之水分散溶膠(AA-1)為透明的乳白色。而且,測定該金屬氧化物微粒中所含之金屬成分的含量時,以各金屬成分的氧化物換算基準計,TiO2 為87.5質量%,SnO2 為10.6質量%以及K2 O為1.8質量%。The water-dispersed sol (AA-1) containing the metal oxide fine particles thus obtained was a transparent milky white color. In addition, when the content of the metal component contained in the metal oxide fine particles is measured, TiO 2 is 87.5 mass%, SnO 2 is 10.6 mass%, and K 2 O is 1.8 mass% in terms of oxides of each metal component. .

<表面處理金屬氧化物微粒的水分散溶膠(AB-1)的製備><Preparation of water-dispersed sol (AB-1) of surface-treated metal oxide fine particles>

對上述中獲得之核微粒的水分散溶膠(AA-1)7.0kg,以氫氧化鉀水溶液將pH調整為7.0之同時緩慢添加以ZrO2 質量換算計3.6%濃度的八水合氧氯化鋯水溶液1.5kg,在40℃下攪拌混合1小時,從而獲得以鋯進行表面處理之金屬氧化物微粒的水分散液。此時,鋯的量相對於核微粒中所含之金屬元素,以氧化物換算基準計為5.0莫耳%。7.0 kg of the water-dispersed sol (AA-1) of the core fine particles obtained above, and a pH of 7.0 adjusted with potassium hydroxide aqueous solution while slowly adding a 3.6% strength aqueous solution of zirconium octachloride octahydrate in terms of ZrO 2 mass conversion 1.5 kg was stirred and mixed at 40 ° C for 1 hour to obtain an aqueous dispersion of metal oxide fine particles surface-treated with zirconium. In this case, the amount of zirconium is 5.0 mol% based on the oxide equivalent of the metal element contained in the core fine particles.

接著,將以鋯進行表面處理之金屬氧化物微粒的水分散液8.5kg放入噴霧乾燥裝置(NIRO社製造NIRO ATOMIZER)來進行噴霧乾燥。藉此,獲得由平均粒徑約為2μm的表面處理金屬氧化物微粒構成之乾燥粉體0.9kg。Next, 8.5 kg of an aqueous dispersion of metal oxide fine particles surface-treated with zirconium was placed in a spray drying apparatus (NIRO ATOMIZER manufactured by NIRO Co., Ltd.) to carry out spray drying. Thereby, 0.9 kg of a dry powder composed of surface-treated metal oxide fine particles having an average particle diameter of about 2 μm was obtained.

接著,將上述中獲得之表面處理金屬氧化物微粒的乾燥粉體0.9kg,在空氣氣氛下,在500℃的溫度下燒成2小時,從而獲得表面處理金屬氧化物微粒的燒成粉體0.8kg。將上述中獲得之表面處理金屬氧化物微粒的燒成粉體0.2kg分散於純水0.2kg中,在其中添加濃度28.6%的酒石酸水溶液0.1kg、濃度50質量%的KOH水溶液0.06kg並充份攪拌。接著,添加粒徑0.1mm的氧化鋁珠(TAIMEI Chemicals Co.,Ltd.製造的高純度氧化鋁珠),將此供至濕式粉碎機(KANSAI PAINT CO.,LTD.製造的間歇式台式砂磨機),進行180分鐘的上述表面處理金屬氧化物微粒(二氧化鈦系複合氧化物微粒)的燒成粉體的粉碎以及分散處理。之後,將氧化鋁珠利用孔徑44μm的不鏽鋼製過濾器分離、去除之後,進一步添加純水1.4kg並攪拌,從而獲得固體成分含量為11質量%的表面處理金屬氧化物微粒的水分散液1.7kg。Next, 0.9 kg of the dry powder of the surface-treated metal oxide fine particles obtained above was baked in an air atmosphere at a temperature of 500 ° C for 2 hours to obtain a calcined powder of the surface-treated metal oxide fine particles 0.8 Kg. 0.2 kg of the calcined powder of the surface-treated metal oxide fine particles obtained above was dispersed in 0.2 kg of pure water, and 0.1 kg of a tartaric acid aqueous solution having a concentration of 28.6% and 0.06 kg of a KOH aqueous solution having a concentration of 50% by mass were added thereto and sufficiently filled. Stir. Next, alumina beads having a particle diameter of 0.1 mm (high-purity alumina beads manufactured by TAIMEI Chemicals Co., Ltd.) were added, and this was supplied to a wet pulverizer (intermittent table sand manufactured by KANSAI PAINT CO., LTD.). In the mill, the calcined powder of the surface-treated metal oxide fine particles (titanium dioxide-based composite oxide fine particles) was pulverized and dispersed for 180 minutes. After that, the alumina beads were separated and removed by a stainless steel filter having a pore size of 44 μm, and then 1.4 kg of pure water was further added and stirred to obtain an aqueous dispersion of surface-treated metal oxide fine particles having a solid content of 11% by mass of 1.7 kg. .

接著,使用超濾膜並以離子交換水清洗該水分散液之後,添加陰離子交換樹脂(Mitsubishi Chemical Corporation製造:SANUPC)0.09kg來進行去離子處理。接著,供至離心分離機(Hitachi Koki Co., Ltd.製造的CR-21G),以12,000rpm的速度處理1小時之後,添加離子交換水來製備固體成分濃度10質量%的表面處理金屬氧化物微粒的水分散溶膠(AB-1)1.9kg。Next, after the aqueous dispersion was washed with ion-exchanged water using an ultrafiltration membrane, 0.09 kg of an anion exchange resin (manufactured by Mitsubishi Chemical Corporation: SANUPC) was added to carry out deionization treatment. Then, it was supplied to a centrifugal separator (CR-21G manufactured by Hitachi Koki Co., Ltd.), and treated at a rate of 12,000 rpm for 1 hour, and then ion-exchanged water was added to prepare a surface-treated metal oxide having a solid concentration of 10% by mass. The water-dispersed sol (AB-1) of the microparticles was 1.9 kg.

測定該表面處理金屬氧化物微粒中所含之金屬成分的含量時,以各金屬成分的氧化物換算基準計,TiO2 為82.6質量%,SnO2 為10.3質量%,ZrO2 為4.9質量%以及K2 O為2.2質量%。此時的Ti/Zr比率(元素組成)為26.00。Ti/Sn比率(元素組成)為10/1。所獲得之金屬氧化物微粒的平均粒徑約為15nm。When the content of the metal component contained in the surface-treated metal oxide fine particles is measured, TiO 2 is 82.6 mass%, SnO 2 is 10.3 mass%, and ZrO 2 is 4.9% by mass, based on the oxide of each metal component. K 2 O was 2.2% by mass. The Ti/Zr ratio (element composition) at this time was 26.00. The Ti/Sn ratio (element composition) was 10/1. The metal oxide fine particles obtained had an average particle diameter of about 15 nm.

<表面處理金屬氧化物微粒的甲醇分散溶膠(AC-1)的製備><Preparation of surface-treated metal oxide fine particles of methanol-dispersed sol (AC-1)>

在攪拌下向在上述中製備之表面處理金屬氧化物微粒的水分散液(AB-1)0.6kg中添加陽離子交換樹脂9.6g之後,分離樹脂來製備已去離子之表面處理金屬氧化物微粒的水分散液。接著,將上述已去離子之表面處理金屬氧化物微粒的水分散液,使用超濾膜裝置(Asahi Kasei Corporation.製造的過濾膜、SIP-1013),將分散介質從水取代為甲醇並濃縮來獲得表面處理金屬氧化物微粒的甲醇分散溶膠(AC-1)0.3kg。其結果,所獲得之甲醇分散液中所含之固體成分濃度為30質量%,並且水分含量為約0.3質量%。After adding 9.6 g of a cation exchange resin to 0.6 kg of the aqueous dispersion (AB-1) of the surface-treated metal oxide fine particles prepared above, the resin was separated to prepare deionized surface-treated metal oxide fine particles. Aqueous dispersion. Next, the aqueous dispersion of the deionized surface-treated metal oxide fine particles was replaced with water by a superfiltration membrane apparatus (filter membrane manufactured by Asahi Kasei Corporation, SIP-1013), and concentrated. 0.3 kg of a methanol-dispersed sol (AC-1) of surface-treated metal oxide fine particles was obtained. As a result, the solid content concentration contained in the obtained methanol dispersion liquid was 30% by mass, and the moisture content was about 0.3% by mass.

<矽氧烷系樹脂組成物(A-1)的製備><Preparation of oxirane-based resin composition (A-1)>

將甲基三甲氧基矽烷10.9g(0.08mol)、苯基三甲氧基矽烷63.5g(0.32mol)、甲醇分散溶膠(AC-1)(固體成分濃度30質量%、甲醇70質量%)440.0g、DAA370.0g放入反應容器中,將水32.0g以及磷酸1.0g以反應溫度不超過40℃之方式攪拌的同時,滴下至該溶液中。滴下之後,將蒸留裝置安裝於燒瓶,將獲得之溶液在浴溫105℃下加熱攪拌2.5小時,蒸餾除去藉由水解而生成之甲醇的同時,使其反應。之後,將溶液在浴溫130℃下再加熱攪拌2小時之後,冷卻至室溫,獲得了矽氧烷系樹脂組成物(A-1)(固體成分35.8質量%、組成物固體成分中的金屬氧化物微粒濃度64質量%)。10.9 g (0.08 mol) of methyltrimethoxydecane, 63.5 g (0.32 mol) of phenyltrimethoxydecane, and methanol dispersion sol (AC-1) (solid content concentration: 30% by mass, methanol: 70% by mass) 440.0 g DADA 370.0g was placed in a reaction vessel, and 32.0 g of water and 1.0 g of phosphoric acid were added to the solution while stirring at a reaction temperature of not more than 40 ° C. After dripping, the distillation apparatus was attached to a flask, and the obtained was obtained. The solution was heated and stirred at a bath temperature of 105 ° C for 2.5 hours, and the methanol formed by the hydrolysis was distilled off and reacted. Thereafter, the solution was further heated and stirred at a bath temperature of 130 ° C for 2 hours, and then cooled to room temperature. The decane-based resin composition (A-1) (solid content: 35.8 mass%, metal oxide fine particle concentration in the composition solid content: 64 mass%) was obtained.

(矽烷化合物的水解縮合物(AX-1)等的製備)(Preparation of hydrolysis condensate of decane compound (AX-1), etc.)

關於上述矽氧烷系樹脂組成物(A-1)的製備,使用羧甲氧基甲基二甲氧基矽烷來代替苯基三甲氧基矽烷,未使用甲醇分散溶膠(AC-1)以及DAA,除此之外以相同的方式獲得了矽烷化合物的水解縮合物(AX-1)。關於以其他AX編號之樹脂,亦以相同的方式,代替苯基三甲氧基矽烷,應用各烷氧基矽烷化合物來進行製備。另外,矽烷化合物的水解縮合物(AX-1)的酸值係3.2。Regarding the preparation of the above siloxane-based resin composition (A-1), carboxymethoxymethyldimethoxydecane was used instead of phenyltrimethoxydecane, and methanol-dispersed sol (AC-1) and DAA were not used. A hydrolysis condensate (AX-1) of a decane compound was obtained in the same manner except for the other AX-numbered resins, and in the same manner, instead of phenyltrimethoxydecane, each alkoxy group was used. The decane compound was prepared by the decane compound, and the acid value of the hydrolysis condensate (AX-1) of the decane compound was 3.2.

(實施例1、比較例1)(Example 1, Comparative Example 1)

使用上述中獲得之矽氧烷系樹脂組成物(A-1)等,以成為以下表1的組成之方式混合各成分或者進行溶劑取代等來獲得實施例以及比較例的硬化性樹脂組成物(試料101~112、201~207、c01、c02)。利用所獲得之實施例以及比較例的硬化性樹脂組成物,進行了以下所示之評價。The curable resin composition of the examples and the comparative examples was obtained by mixing the components or the solvent substitution so as to have the composition of the following Table 1 by using the azide-based resin composition (A-1) obtained in the above ( Samples 101 to 112, 201 to 207, c01, and c02). The evaluations shown below were carried out using the curable resin compositions of the obtained examples and the comparative examples.

金屬氧化物粒子                          70質量份 矽氧烷樹脂(I)                               15質量份 矽氧烷樹脂(II)                              25質量份 PEGMEA                                    135質量份 DAA                                        266質量份(*) KAYARAD DPHA(Nippon Kayaku Co.,Ltd.製造) 2質量份(*) 光聚合起始劑                                  1質量份(*) 表1中記載的結構的紫外線吸收劑                 2質量份 聚合抑制劑(p-甲氧基苯酚)                  0.01質量份(*) 鹼可溶性樹脂                                 15質量份Metal oxide particles 70 parts by mass of a decyl alkane resin (I) 15 parts by mass of a decyl alkane resin (II) 25 parts by mass of PEGMEA 135 parts by mass of DAA 266 parts by mass (*) KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) 2 parts by mass (*) Photopolymerization initiator 1 part by mass (*) Ultraviolet absorber of the structure described in Table 1 2 parts by mass of polymerization inhibitor (p-methoxyphenol) 0.01 part by mass (*) Alkali-soluble resin 15 parts by mass

(*)表1中省略記載之成分 PGMEA:丙二醇單甲醚乙酸酯 DAA:二丙酮醇 KAYARAD DPHA 具有不飽和雙鍵之化合物 OXE02:BASF SE製造 IRGACURE OXE02(商品名) 鹼可溶性樹脂 以下述BX編號之各化合物(*) Component PGIEA omitted in Table 1: propylene glycol monomethyl ether acetate DAA: diacetone alcohol KAYARAD DPHA Compound with unsaturated double bond OXE02: manufactured by BASF SE IRGACURE OXE02 (trade name) Alkali-soluble resin with the following BX Numbered compound

關於實施例以及比較例的硬化性樹脂組成物的硬化膜,按以下進行透射率測定。The cured films of the curable resin compositions of the examples and the comparative examples were measured for transmittance as follows.

在高折射率玻璃(SUMITA OPTICAL GLASS,Inc.製造的SFLD-6[商品名])上以旋轉塗佈機(H-360S[商品名]MIKASA CO.,LTD製造)對硬化性樹脂組成物進行塗佈。利用加熱板在100℃下對塗佈硬化性樹脂組成物之高折射率玻璃進行2分鐘的預烘烤來獲得塗佈膜。接著,藉由USHIO INC.製造的超高壓水銀燈“USH-500BY”,以1000mJ/cm2 將該塗佈膜進行曝光。在空氣氣氛下的加熱板上以200℃將該塗佈膜加熱5分鐘,獲得了膜厚為0.5μm的硬化膜。利用Otsuka Electronics Co.,Ltd..製造的“MCPD-3000”,以400nm~700nm對所獲得之硬化膜測定了實施例以及比較例各自的硬化膜的透光率。實施例的硬化膜的透光率均為400~700nm的最低透射率,超過了90%。The curable resin composition was applied to a high-refractive-index glass (SFLD-6 [trade name] manufactured by SUMITA OPTICAL GLASS, Inc.) by a spin coater (H-360S [trade name] MIKASA CO., LTD.). Coating. The high refractive index glass coated with the curable resin composition was prebaked at 100 ° C for 2 minutes using a hot plate to obtain a coating film. Next, the coated film was exposed at 1000 mJ/cm 2 by an ultrahigh pressure mercury lamp "USH-500BY" manufactured by USHIO INC. The coating film was heated at 200 ° C for 5 minutes on a hot plate under an air atmosphere to obtain a cured film having a film thickness of 0.5 μm. The light transmittance of each of the cured films of the examples and the comparative examples was measured by using "MCPD-3000" manufactured by Otsuka Electronics Co., Ltd., from 400 nm to 700 nm. The light transmittance of the cured film of the examples was the lowest transmittance of 400 to 700 nm, exceeding 90%.

另外,此時以相同的硬化膜樣品,利用橢圓偏振計(Otsuka Electronics Co.,Ltd.製造),測定了室溫25℃下的波長633nm下的折射率。其結果,實施例的硬化膜的折射率均為約1.8,實現了所希望的高折射率。Further, at this time, the refractive index at a wavelength of 633 nm at room temperature of 25 ° C was measured with an ellipsometer (manufactured by Otsuka Electronics Co., Ltd.) using the same cured film sample. As a result, the cured films of the examples all had a refractive index of about 1.8, and a desired high refractive index was achieved.

<耐光性[1-1]><Light resistance [1-1]>

關於在透射率測定中使用之硬化膜,利用耐光試驗機(Suga Test Instruments Co.,Ltd.製造的Xenon Weather Meter),進行了500万lxh的耐光試驗。耐光試驗之後,藉由硬化膜的透射率測定,對耐光性進行了評價。依據以下基準,對光刻性能進行了評價。對各試料進行5次試驗,採用去除最大值以及最小值之3次結果的平均值。With respect to the cured film used for the transmittance measurement, a light resistance test of 5 million lx was performed using a light resistance tester (Xenon Weather Meter manufactured by Suga Test Instruments Co., Ltd.). After the light resistance test, the light resistance was evaluated by the transmittance measurement of the cured film. The lithographic performance was evaluated according to the following criteria. Five tests were carried out on each sample, and the average value of the three results of the removal of the maximum value and the minimum value was used.

“5”:透射率的変化量為±5%以下 “4”:透射率的変化量超過±5%且±8%以下 “3”:透射率的変化量超過±8%且±10%以下 “2”:透射率的変化量超過±10%且±20%以下 “1”:透射率的変化量超過±20%"5": the amount of change in transmittance is ±5% or less "4": the amount of change in transmittance exceeds ±5% and ±8% or less "3": the amount of change in transmittance exceeds ±8% and ±10% or less "2": the amount of transmission of the transmittance exceeds ±10% and ±20% or less "1": the amount of transmission is more than ±20%

<分辨率試驗[1-2]><Resolution test [1-2]>

以塗佈後的膜厚成為0.8μm之方式,利用Tokyo Electron Limited製造的Act8[商品名],以旋轉塗佈法將在上述中獲得之各硬化性樹脂組成物塗佈在帶有底塗層之8英吋的矽晶片上,之後在加熱板上在100℃下加熱2分鐘來獲得硬化性組成物層。The curable resin composition obtained in the above was applied to the undercoat layer by a spin coating method using Act8 [trade name] manufactured by Tokyo Electron Limited, in a thickness of 0.8 μm after coating. The hardened composition layer was obtained by heating on a hot plate at 8 ° C for 2 minutes on a hot plate of 8 inches.

接著,對所獲得之硬化性組成物層,利用i射線步進機曝光裝置FPA-3000i5+[商品名](Canon Inc.製造),經由遮罩對1.1μm四方的拜耳圖案進行了曝光(曝光量50~1700mJ/cm2 )。Next, the obtained hardenable composition layer was exposed to a 1.1 μm square Bayer pattern via a mask using an i-ray stepper exposure apparatus FPA-3000i5+ [trade name] (manufactured by Canon Inc.). 50 to 1700 mJ/cm 2 ).

接著,對於曝光後的硬化性組成物層,使用顯影裝置(Tokyo Electron Limited製造的Act8[商品名])進行顯影性的評價。作為顯影液,使用四甲基氫氧化銨(TMAH)0.3%水溶液,在23℃下進行60秒的噴淋顯影。之後,以使用純水之旋轉噴淋法進行沖洗,從而獲得圖案。藉由掃描型電子顕微鏡(SEM)(S-4800H[商品名]、Hitachi High-Technologies製造)観察(倍率:20000倍)評價了所獲得之圖案的應變。依據以下基準評價了光刻性能。對各試料進行3次試驗,並綜合其結果來進行判定。Next, the developability of the curable composition layer after the exposure was evaluated using a developing device (Act8 [trade name] manufactured by Tokyo Electron Limited). As a developing solution, a 0.3% aqueous solution of tetramethylammonium hydroxide (TMAH) was used, and spray development was carried out at 23 ° C for 60 seconds. Thereafter, rinsing was performed by a rotary spray method using pure water to obtain a pattern. The strain of the obtained pattern was evaluated by scanning electron micromirror (SEM) (S-4800H [trade name], manufactured by Hitachi High-Technologies) (magnification: 20000 times). The lithographic performance was evaluated in accordance with the following criteria. Three samples were tested for each sample, and the results were combined to determine.

“5”:圖案明顯,無殘渣。 “4”:圖案呈略錐形形狀,但無殘渣。 “3”:圖案呈錐形形狀,但殘渣較少。 “2”:圖案呈錐形形狀,且殘渣較多。 “1”:無法成為圖案。"5": The pattern is obvious and there is no residue. "4": The pattern has a slightly conical shape but no residue. "3": The pattern has a tapered shape but less residue. "2": The pattern has a tapered shape and has a large amount of residue. "1": Cannot be a pattern.

<殘渣凝膠缺陷數[1-3]><residue gel defect number [1-3]>

利用缺陷檢查裝置ComPlus(Applied Materials, Inc. 製造),對在透射率測定中使用之硬化膜測定了大小為0.4μm以上的凝膠狀缺陷的產生個數。將結果示於下述表中。觀察視場選定了10cm四方的任意區域。對各試料進行5次試驗,採用了去除最大值和最小值之3次結果的平均值。The number of gel-like defects having a size of 0.4 μm or more was measured for the cured film used for the transmittance measurement by the defect inspection device ComPlus (manufactured by Applied Materials, Inc.). The results are shown in the following table. Observe the field of view and select any area of 10 cm square. Five tests were performed on each sample, and the average of three results of removing the maximum value and the minimum value was used.

“5”未發現缺陷 “4”缺陷數為1個以上且不到2個 “3”缺陷數為2個以上且不到3個 “2”缺陷數為3個以上且不到4個 “1”缺陷數為4個以上且不到5個"5" found no defect "4" number of defects is one or more, less than two "3" defects are two or more, and less than three "2" defects are three or more and less than four "1" "The number of defects is 4 or more and less than 5

[表1] 配合:質量份 No.從c開始者係比較例 Si樹脂:矽氧烷樹脂 UV吸收劑:紫外線吸收劑[Table 1] Coordination: mass part No. from c to the comparative example Si resin: decane resin UV absorber: UV absorber

【化學式8】 [Chemical Formula 8]

【化學式9】 [Chemical Formula 9]

紫外線吸收劑UV absorber

TINUVIN PS:2-(2-羥基-5-叔丁基苯基)-2H-苯并三唑TINUVIN PS: 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole

【化學式10】 [Chemical Formula 10]

――――――――――――――――――――――――――――――UV吸收劑  系統      ε@365nm  ε@400nm ―――――――――――――――――――――――――――――― PS       苯并三唑     35821     1021 U-1      阿伏苯宗     41752      612 U-2      二烯         54636      487 U-3      二烯         49091     3432 U-4      苯并二硫     28132     1913 ―――――――――――――――――――――――――――――― PS: TINUVIN PS——————————————————————————————UV absorber system ε@365nm ε@400nm —————————— ———————————————————— PS benzotriazole 35821 1021 U-1 avobenzone 41752 612 U-2 diene 54636 487 U-3 diene 49091 3432 U-4 benzodisulfide 28132 1913 ———————————————————————————— PS: TINUVIN PS

由上述結果可知,藉由使用滿足條件(a)或(b)之矽氧烷樹脂組成物,本發明的矽氧烷樹脂組成物在作為其硬化膜時,使殘渣缺陷的抑制性變得良好,而且分辨率優異,在耐光性方面亦能夠發揮較高性能。並且可知,藉由選定並含有適合用作紫外線吸收劑者,其效果變得進一步顯著。From the above results, it is understood that the rhodium oxide resin composition of the present invention has good suppression of residue defects when used as a cured film by using a naphthene resin composition satisfying the condition (a) or (b). It also has excellent resolution and high performance in terms of light resistance. Further, it is understood that the effect is further remarkable by selecting and containing a suitable ultraviolet absorber.

(實施例2)(Example 2)

表1的試料101中,改變導入至矽氧烷樹脂之酸性基(A)來製作了包括各矽氧烷樹脂之組成物。又,對該些組成物進行了耐光試験、顯影性試験以及殘渣凝膠缺陷數的測定。其結果確認到,在任一試料中都示出了良好的結果,但酸性基(A)的pKa為-3~4時,顯示出了尤其良好的顯影性、耐光性以及残渣結果的抑制性。In the sample 101 of Table 1, the acidic group (A) introduced into the siloxane resin was changed to prepare a composition including each siloxane oxide resin. Further, these compositions were subjected to light resistance test, developability test, and residue. The number of gel defects was measured. As a result, it was confirmed that good results were obtained in any of the samples. However, when the pKa of the acidic group (A) was -3 to 4, particularly excellent developability and light resistance were exhibited. And the inhibition of the residue results.

(實施例3)(Example 3)

表1的試料101中,製備水分散溶膠(AB-1)時,代替八水合氧氯化鋯,適當地使用預定的金屬鹽,將該金屬導入至金屬微粒,製備了組成物。所導入之金屬分別為Ta、W、Y、Ba、Hf、Nb、V以及Si,以代替Zr。對該些組成物進行了上述顯影性、耐光性以及残渣的抑制性的評價。其結果確認到,在任一試料中,都顯示出了良好的結果。In the sample 101 of Table 1, when the water-dispersed sol (AB-1) was prepared, a predetermined metal salt was used instead of the zirconium oxychloride octachloride, and the metal was introduced into the metal fine particles to prepare a composition. The metals were Ta, W, Y, Ba, Hf, Nb, V, and Si, respectively, in place of Zr. The above-mentioned compositions were evaluated for the developability, light resistance, and suppression of the residue. In the sample, all showed good results.

(實施例4)(Example 4)

表1的試料101中,代替表1的溶劑(PEGMEA),分別使用甲基乙基酮、二丙酮醇、PGME、二丙二醇單甲醚、環己酮、環戊酮來製備了組成物。對該些組成物進行了上述顯影性、耐光性以及残渣的抑制性的評價。其結果確認到,在任一試料中都顯示出了良好的結果。In the sample 101 of Table 1, a composition was prepared by using methyl ethyl ketone, diacetone alcohol, PGME, dipropylene glycol monomethyl ether, cyclohexanone, and cyclopentanone instead of the solvent (PEGMEA) of Table 1. These compositions were evaluated for the above-mentioned developability, light resistance, and suppression of residue. As a result, it was confirmed that good results were obtained in any of the samples.

(實施例5)(Example 5)

<改變了TiO2 、ZrO2 以及SnO2 的比率之、表面處理金屬氧化物微粒的甲醇分散溶膠(AC-2~AC-11)的製備><Preparation of a methanol-dispersed sol (AC-2~AC-11) of surface-treated metal oxide fine particles with a ratio of TiO 2 , ZrO 2 and SnO 2 changed>

製備在實施例1中使用之甲醇分散溶膠(AC-1)時,以TiO2 、ZrO2 以及SnO2 的含有比成為表2所示之值的方式,調整各試料的添加量來製備了甲醇分散溶膠(AC-2~AC-11)。甲醇分散溶膠(AC-1)的含有比亦包括在內記載於表2中。When the methanol dispersion sol (AC-1) used in Example 1 was prepared, methanol was prepared so that the content ratio of TiO 2 , ZrO 2 and SnO 2 was as shown in Table 2, and the amount of each sample was adjusted. The dispersion sol (AC-2 to AC-11) and the content ratio of the methanol dispersion sol (AC-1) are also included in Table 2.

[表2] [Table 2]

<非核殼型微粒的水分散溶膠(E-1)的製備><Preparation of water-dispersed sol (E-1) of non-core-shell type particles>

將含有以TiO2 換算基準計7.75質量%的四氯化鈦的四氯化鈦水溶液7.60kg和含有15質量%的氨的氨水2.91kg進行混合。混合該些的同時,經24小時滴下以ZrO2 質量換算計1.23%濃度的八水合氧氯化鋯水溶液7.6kg,從而製備pH8.8的白色漿料液。接著,以離子交換水將該白色漿料液稀釋為5倍之後進行過濾,進一步以離子交換水清洗,從而獲得固體成分含量為10質量%的含水鈦鋯酸濾餅5.2kg。7.60 kg of an aqueous solution of titanium tetrachloride containing 7.75 mass% of titanium tetrachloride in terms of TiO 2 and 2.91 kg of aqueous ammonia containing 15% by mass of ammonia were mixed. While mixing these, 7.6 kg of a 1.23% strength aqueous solution of zirconium octahydrate hydrate in a mass ratio of ZrO 2 was dropped over 24 hours to prepare a white slurry liquid of pH 8.8. Then, the white slurry liquid was diluted to 5 times with ion-exchanged water, filtered, and further washed with ion-exchange water to obtain 5.2 kg of an aqueous titanium zirconate filter cake having a solid content of 10% by mass.

接著,在該濾餅中添加含有35質量%的過氧化氫之過氧化氫水7.1kg以及離子交換水20.0kg之後,在80℃的溫度下攪拌並加熱1小時,進一步添加離子交換水28.90kg,從而獲得含有以TiO2 換算基準計1質量%之過氧化鈦鋯酸之過氧化鈦鋯酸水溶液61.39kg。該過氧化鈦鋯酸水溶液為透明的黄褐色,pH為8.9。Next, 7.1 kg of hydrogen peroxide water containing 35% by mass of hydrogen peroxide and 20.0 kg of ion-exchanged water were added to the cake, and the mixture was stirred and heated at a temperature of 80 ° C for 1 hour to further add ion-exchanged water of 28.90 kg. Thus, 61.39 kg of a titanium peroxide zirconic acid aqueous solution containing 1% by mass of titanium peroxide zirconic acid in terms of TiO 2 was obtained. The titanium peroxide zirconic acid aqueous solution was transparent yellowish brown and had a pH of 8.9.

接著,在上述過氧化鈦鋯酸水溶液60.78kg中混合陽離子交換樹脂(Mitsubishi Chemical Corporation製造)4.00kg,在攪拌下向其中緩慢添加含有以SnO2 換算基準計1質量%的錫酸鉀之錫酸鉀水溶液8.01kg。接著,分離引入鉀離子等之陽離子交換樹脂之後,在高壓釜中於168℃的溫度下將該混合水溶液加熱20小時。Next, the mixed cation 60.78kg above titanium peroxide aqueous zirconate exchange resin (Mitsubishi Chemical Corporation manufactured) 4.00 kg, was slowly added potassium containing the terms of SnO 2 tin basis 1% by mass of stannic acid thereto with stirring The potassium aqueous solution was 8.01 kg. Next, after separating the cation exchange resin into which potassium ions or the like were introduced, the mixed aqueous solution was heated in an autoclave at a temperature of 168 ° C for 20 hours.

接著,將所獲得之混合水溶液冷卻至室溫之後,用超濾膜裝置進行濃縮,從而獲得固體成分含量為10質量%的微粒的水分散液6.89kg。Then, the obtained mixed aqueous solution was cooled to room temperature, and then concentrated by an ultrafiltration membrane apparatus to obtain 6.89 kg of an aqueous dispersion of fine particles having a solid content of 10% by mass.

如此獲得之包含金屬氧化物微粒之水分散溶膠(E-1)為透明的乳白色。測定該金屬氧化物微粒中所含之金屬成分的含量時,以各金屬成分的氧化物換算基準計,TiO2 為90.0質量%,SnO2 為4.2質量%,K2 O為0.5質量%以及ZrO2 為5.3質量%。The water-dispersed sol (E-1) containing the metal oxide fine particles thus obtained was a transparent milky white color. When the content of the metal component contained in the metal oxide fine particles is measured, TiO 2 is 90.0% by mass, SnO 2 is 4.2% by mass, K 2 O is 0.5% by mass, and ZrO is calculated based on the oxide of each metal component. 2 is 5.3% by mass.

<非核殼型金屬氧化物微粒的甲醇分散溶膠(EM-1)的製備><Preparation of Methanol Dispersion Sol (EM-1) of Non-core-Shell Metal Oxide Particles>

藉由噴霧乾燥器對上述的水分散溶膠(E-1)7.51kg進行噴霧乾燥。藉此,獲得由平均粒徑約為2μm的金屬氧化物微粒構成之乾燥粉體0.90kg。7.51 kg of the above water-dispersible sol (E-1) was spray-dried by a spray dryer. Thereby, 0.90 kg of a dry powder composed of metal oxide fine particles having an average particle diameter of about 2 μm was obtained.

接著,在空氣氣氛下,在500℃的溫度下對該乾燥粉體0.90kg進行2小時燒成,從而獲得金屬氧化物微粒的燒成粉體0.90kg。將該燒成粉體0.20kg分散於純水0.18kg中,並在其中添加濃度28.6%的酒石酸水溶液0.13kg、濃度50質量%的KOH水溶液0.06kg,並充份攪拌。Then, 0.90 kg of the dry powder was calcined in an air atmosphere at a temperature of 500 ° C for 2 hours to obtain 0.90 kg of a calcined powder of metal oxide fine particles. 0.20 kg of the calcined powder was dispersed in 0.18 kg of pure water, and 0.13 kg of a tartaric acid aqueous solution having a concentration of 28.6% and 0.06 kg of a KOH aqueous solution having a concentration of 50% by mass were added thereto, and the mixture was stirred sufficiently.

接著,添加粒徑0.1mm的氧化鋁珠(TAIMEI Chemicals Co.,Ltd.製造的高純度氧化鋁珠),將此供至濕式粉碎機(KANSAI PAINT CO.,LTD.製造的間歇式台式砂磨機),進行180分鐘的上述燒成粉體的粉碎以及分散處理。之後,將氧化鋁珠利用孔徑44μm的不鏽鋼製過濾器分離、去除之後,進一步添加純水1.39kg並攪拌,從而獲得固體成分含量為11.0質量%的金屬氧化物微粒的水分散液1.70kg。Next, alumina beads having a particle diameter of 0.1 mm (high-purity alumina beads manufactured by TAIMEI Chemicals Co., Ltd.) were added, and this was supplied to a wet pulverizer (intermittent table sand manufactured by KANSAI PAINT CO., LTD.). The mill was subjected to pulverization and dispersion treatment of the calcined powder for 180 minutes. After that, the alumina beads were separated and removed by a stainless steel filter having a pore size of 44 μm, and then 1.39 kg of pure water was further added thereto and stirred to obtain 1.70 kg of an aqueous dispersion of metal oxide fine particles having a solid content of 11.0% by mass.

接著,利用超濾膜以離子交換水清洗之後,添加陰離子交換樹脂(Mitsubishi Chemical Corporation製造:SANUPC)0.09kg來進行去離子處理之後,供至離心分離機(Hitachi Koki Co., Ltd.製造的CR-21G),並以11,000rpm的速度進行1小時處理之後,添加離子交換水來製備固體成分濃度10質量%的金屬氧化物微粒的水分散溶膠(EZ-1)1.86kg。Next, after washing with ion-exchanged water using an ultrafiltration membrane, 0.09 kg of an anion exchange resin (manufactured by Mitsubishi Chemical Corporation: SANUPC) was added for deionization treatment, and then supplied to a centrifuge (CR manufactured by Hitachi Koki Co., Ltd.). -21G), and the treatment was carried out at a rate of 11,000 rpm for 1 hour, and ion-exchanged water was added to prepare 1.86 kg of a water-dispersed sol (EZ-1) of metal oxide fine particles having a solid concentration of 10% by mass.

而且,測定該金屬氧化物微粒中所含之金屬成分的含量時,各金屬成分以氧化物換算基準計,TiO2 為88.9質量%,SnO2 為5.3質量%,ZrO2 為5.3質量%以及K2 O為0.5質量%(TiO2 為79.87g/mol,ZrO2 為123.2g/mol,上述配合中的Ti/Zr(莫耳比)成為26)。Further, when the content of the metal component contained in the fine metal oxide particles in the measurement, in terms of oxides of each metal component basis, TiO 2 was 88.9 mass%, SnO 2 was 5.3 mass%, ZrO 2 5.3% by mass, and K 2 O was 0.5% by mass (TiO 2 was 79.87 g/mol, ZrO 2 was 123.2 g/mol, and Ti/Zr (Morby ratio) in the above-mentioned compound was 26).

接著,在冷卻之後利用超濾膜裝置(Asahi Kasei Corporation.製造的過濾膜,SIP-1013),將水分散溶膠(EZ-1)的分散介質從水取代為甲醇來獲得金屬氧化物微粒的甲醇分散溶膠(EM-1)0.32kg。所獲得之甲醇分散溶膠(EM-1)中所含之固體成分濃度約為30質量%,水分含量為0.28質量%。Next, after cooling, an ultrafiltration membrane device (filter membrane manufactured by Asahi Kasei Corporation., SIP-1013) was used, and a dispersion medium of the water-dispersed sol (EZ-1) was replaced with water to methanol to obtain methanol of metal oxide fine particles. The dispersed sol (EM-1) was 0.32 kg. The solid content concentration contained in the obtained methanol dispersion sol (EM-1) was about 30% by mass, and the moisture content was 0.28% by mass.

<改變了TiO2 、ZrO2 以及SnO2 的比率之、甲醇分散溶膠(EM-2~3)的製作><Changing the production ratio of TiO 2, ZrO 2 and SnO 2, and methanol-dispersed sol (EM-2 ~ 3) of>

在製備水分散溶膠(E-1)時,以Ti/Zr比率以及Ti/Sn比率成為表3所示之值的方式,調整各試料的添加量來製備了甲醇分散溶膠(EM-2~3)。甲醇分散溶膠(AC-1)的Ti/Zr比率以及Ti/Sn比率亦包括在內記載於表3中。In the preparation of the water-dispersible sol (E-1), a methanol-dispersed sol (EM-2~3) was prepared by adjusting the amount of each sample by adjusting the Ti/Zr ratio and the Ti/Sn ratio to the values shown in Table 3. The Ti/Zr ratio and the Ti/Sn ratio of the methanol-dispersed sol (AC-1) are also included in Table 3.

[表3] [table 3]

<改變了平均粒徑之甲醇分散溶膠(EM-4~7)的製作><Preparation of Methanol Dispersion Sol (EM-4 to 7) with Changed Average Particle Size>

在製備應用於甲醇分散溶膠(EM-2)的製作之水分散溶膠(E-1)時,調節金屬氧化物微粒的熱處理溫度以及處理時間,除此之外,以與甲醇分散溶膠(EM-2)的製備相同的方式,製作了不同平均粒徑的分散液EM-4~7。各個分散液(溶膠)中所含之粒子的數量平均粒徑(Mn)示於表3。另外,測定方法如上所述。In the preparation of the water-dispersible sol (E-1) applied to the production of the methanol-dispersed sol (EM-2), the heat treatment temperature and the treatment time of the metal oxide fine particles are adjusted, in addition to the methanol-dispersed sol (EM- 2) Preparation of the dispersion EM-4~7 of different average particle diameters were prepared in the same manner. The number average particle diameter (Mn) of the particles contained in each dispersion (sol) is shown in Table 3. In addition, the measurement method is as described above.

<核殼型無機氧化物微粒的甲醇分散溶膠(CSTM-1)的製備><Preparation of a methanol-dispersed sol (CSTM-1) of core-shell type inorganic oxide fine particles>

矽酸液的製備Preparation of citric acid

用純水稀釋市售的水玻璃(AGC Si-Tech.Co.,Ltd.製造)0.31kg之後,利用陽離子交換樹脂(Mitsubishi Chemical Corporation製造)進行脱鹼,從而獲得含有以SiO2 換算基準計2.0重量%的矽酸之矽酸水溶液3.00kg。另外,該矽酸水溶液的pH為2.3。After 0.31 kg of a commercially available water glass (manufactured by AGC Si-Tech Co., Ltd.) was diluted with pure water, the alkali was removed by a cation exchange resin (manufactured by Mitsubishi Chemical Corporation) to obtain 2.0 in terms of SiO 2 conversion. The weight % of citric acid aqueous solution of citric acid was 3.00 kg. Further, the pH of the aqueous citric acid solution was 2.3.

在甲醇分散溶膠(EM-1)1.80kg中添加純水12.3kg並攪拌,加熱至90℃的溫度之後,向其中緩慢添加上述矽酸水溶液2.39kg。添加結束之後,保持為90℃的溫度之同時,在攪拌下熟化10小時。此時,塗覆金屬氧化物微粒之複合氧化物的量相對於該金屬氧化物微粒100重量份為12重量份。12.3 kg of pure water was added to 1.80 kg of the methanol dispersion sol (EM-1) and stirred, and after heating to a temperature of 90 ° C, 2.39 kg of the above aqueous solution of citric acid was slowly added thereto. After the end of the addition, the mixture was aged under stirring for 10 hours while maintaining the temperature at 90 °C. At this time, the amount of the composite oxide coated with the metal oxide fine particles was 12 parts by weight based on 100 parts by weight of the metal oxide fine particles.

接著,將該混合液放入高壓釜(Trirtsu Techno製造),在165℃的溫度下進行18小時的加熱處理。接著,將該混合溶液冷卻至室溫之後,利用超濾膜(Asahi Kasei Corporation.製造,SIP-1013)進行濃縮,從而獲得固體成分含量為10.0重量%的水分散溶膠。藉此,獲得了以包含矽元素之氧化物塗覆表面處理金屬氧化物微粒的表面而成之核殼型金屬氧化物微粒的水分散溶膠(CST-1)。Next, this mixed liquid was placed in an autoclave (manufactured by Trirtsu Techno), and heat treatment was performed at a temperature of 165 ° C for 18 hours. Then, the mixed solution was cooled to room temperature, and then concentrated using an ultrafiltration membrane (manufactured by Asahi Kasei Corporation., SIP-1013) to obtain a water-dispersed sol having a solid content of 10.0% by weight. Thereby, a water-dispersed sol (CST-1) of core-shell type metal oxide fine particles obtained by coating the surface of the surface-treated metal oxide fine particles with an oxide of cerium element was obtained.

測定所獲得之核殼型金屬氧化物微粒中所含之金屬成分的含量時,以各金屬成分的氧化物換算基準計,TiO2 為86.3質量%、SnO2 為5.1質量%、ZrO2 為5.1質量%以及K2 O為0.5質量%(TiO2 為79.87g/mol,ZrO2 為123.2g/mol,上述配合中的Ti/Zr(莫耳比)成為26)。When the content of the metal component contained in the core-shell type metal oxide fine particles obtained is measured, TiO 2 is 86.3 mass%, SnO 2 is 5.1 mass%, and ZrO 2 is 5.1 based on the oxide of each metal component. The mass% and K 2 O were 0.5% by mass (TiO 2 was 79.87 g/mol, ZrO 2 was 123.2 g/mol, and Ti/Zr (Morby ratio) in the above-mentioned compounding was 26).

接著,在冷卻之後,利用超濾膜裝置(Asahi Kasei Corporation.製造的過濾膜,SIP-1013)將水分散溶膠(CST-1)的分散介質由水取代為甲醇,獲得了金屬氧化物微粒的甲醇分散溶膠(CSTM-1)。其結果,所獲得之甲醇分散溶膠(CSTM-1)中所含之固體成分濃度約為30質量%,水分含量為0.28質量%。Then, after cooling, the dispersion medium of the water-dispersed sol (CST-1) was replaced with water to methanol by an ultrafiltration membrane device (filter membrane manufactured by Asahi Kasei Corporation., SIP-1013) to obtain metal oxide fine particles. Methanol dispersion sol (CSTM-1). As a result, the solid content concentration contained in the obtained methanol dispersion sol (CSTM-1) was about 30% by mass, and the moisture content was 0.28% by mass.

<改變了TiO2 、ZrO2 以及SnO2 的比率之、核殼型無機氧化物微粒的甲醇分散溶膠(CSTM-2~3)的製備><Preparation of a methanol-dispersed sol (CSTM-2~3) of core-shell type inorganic oxide fine particles with a ratio of TiO 2 , ZrO 2 and SnO 2 changed>

在製備甲醇分散溶膠(CSTM-1)時,以Ti/Zr比率以及Ti/Sn比率成為表3所示之値的方式,調整各試料的添加量來製備了甲醇分散溶膠(CSTM-2~3)。In the preparation of the methanol dispersion sol (CSTM-1), the Ti/Zr ratio and the Ti/Sn ratio were used as the enthalpy shown in Table 3, and the amount of each sample was adjusted to prepare a methanol dispersion sol (CSTM-2~3). ).

<矽氧烷系樹脂組成物(A-1-2~A-1-11、A-1-EM-1~A-1-EM-7、A-1-CSTM-1~3)的製備<Preparation of oxirane resin composition (A-1-2~A-1-11, A-1-EM-1~A-1-EM-7, A-1-CSTM-1~3)

在製備矽氧烷系樹脂組成物(A-1)時,將甲醇分散溶膠(A-1)改為表4的甲醇分散溶膠,除此之外,以相同的方法製備了矽氧烷系樹脂組成物(A-1-2~A-1-11、A-1-EM-1~A-1-EM-7、A-1-CSTM-1~3)。In the preparation of the decane-based resin composition (A-1), the methanol-dispersed sol (A-1) was changed to the methanol-dispersed sol of Table 4, and in addition, a decane-based resin was prepared in the same manner. Composition (A-1-2~A-1-11, A-1-EM-1~A-1-EM-7, A-1-CSTM-1~3).

[表4] [Table 4]

關於上述各試料,以與實施例1相同的方式獲得了成為表5的組成之硬化性樹脂組成物。對該些硬化性樹脂組成物進行了與表1相同的項目(耐光性[1-1]、分辨率試験[1-2]以及殘渣凝膠缺陷數[1-3])的試験。又,對在更嚴苛的條件下的耐光性(嚴苛耐光性)進行了評價。具體而言,對上述的耐光性試験[1-1]的條件,將被檢體周邊的溫度(裝置內溫度)設為63℃,將濕度設為90%RH。光的照射時間設為50小時。另外,評價基準依據耐光性試験進行。將評價結果總結在表5中。In each of the above samples, a curable resin composition having the composition shown in Table 5 was obtained in the same manner as in Example 1. The same items as those in Table 1 were observed for the curable resin compositions (light resistance [1-1] ], the resolution test [1-2] and the number of residue gel defects [1-3]). In addition, the light resistance (severe light resistance) under more severe conditions was evaluated. In the above-mentioned conditions of the light resistance test [1-1], the temperature around the subject (in-device temperature) was set to 63 ° C, and the humidity was set to 90% RH. The irradiation time of light was 50 hours. In addition, the evaluation criteria were based on the light resistance test. The evaluation results are summarized in Table 5.

[表5] [table 5]

表5的結果均顯示出了良好的分辨率、耐光性以及透明性。藉此,只要Ti/Zr係1~40,無論其形狀是核殼型(No.301~310、501~503)還是非核殼型(No.401~407),都顯示出了良好的結果。The results in Table 5 show good resolution, light resistance, and transparency. Therefore, as long as the Ti/Zr system is 1 to 40, the shape is core-shell type (No. 301 to 310, 501 to 503). Non-core shell types (No. 401 ~ 407) have shown good results.

矽氧烷系樹脂組成物(A-2)的製備Preparation of a decane-based resin composition (A-2)

在製備矽氧烷系樹脂組成物(A-1)時,使用1-萘基三甲氧基矽烷來代替苯基三甲氧基矽烷,除此之外,以相同的方法和份量製備了矽氧烷系樹脂組成物(A-2)。In the preparation of the decane-based resin composition (A-1), 1-naphthyltrimethoxydecane was used instead of phenyltrimethoxydecane, and in addition, oxiranes were prepared in the same manner and in portions. Resin composition (A-2).

矽氧烷系樹脂組成物(A-3)的製備Preparation of a decane-based resin composition (A-3)

在製備矽氧烷系樹脂組成物(A-1)時,使用9-菲基三甲氧基矽烷來代替苯基三甲氧基矽烷,除此之外,以相同的方法和份量製備了矽氧烷系樹脂組成物(A-3)。In the preparation of the decane-based resin composition (A-1), 9-phenanthryltrimethoxydecane was used instead of phenyltrimethoxydecane, and in addition, oxirane was prepared in the same manner and in the same amount. Resin composition (A-3).

矽氧烷系樹脂組成物(A-4)的製備Preparation of a decane-based resin composition (A-4)

在製備矽氧烷系樹脂組成物(A-1)時,使用1,4-雙(三甲氧基甲矽烷基)萘基來代替苯基三甲氧基矽烷,除此之外,以相同的方法和份量製備了矽氧烷系樹脂組成物(A-4)。In the preparation of the decane-based resin composition (A-1), 1,4-bis(trimethoxyformamido)naphthyl is used instead of phenyltrimethoxydecane, except in the same manner. The oxirane-based resin composition (A-4) was prepared in portions.

矽氧烷系樹脂組成物(A-5)的製備Preparation of a decane-based resin composition (A-5)

在製備矽氧烷系樹脂組成物(A-1)時,使用1-蒽基三甲氧基矽烷來代替苯基三甲氧基矽烷,除此之外,以相同的方法和份量製備了矽氧烷系樹脂組成物(A-5)。In the preparation of the decane-based resin composition (A-1), 1-mercaptotrimethoxydecane was used instead of phenyltrimethoxydecane, and in addition, oxiranes were prepared in the same manner and in portions. Resin composition (A-5).

又,進行了加入下述所示之低分子有機酸(D-1)之實驗(No.701~703)。另外,低分子有機酸(D-1)係具有羧酸之化合物,酸值係340mgKOH/g。關於添加量,“Si樹脂(I)+Si樹脂(II)+低分子有機酸”的質量總計量設成與實施例1的“Si樹脂(I)+Si樹脂(II)”的質量總計量相同,並且以質量比計,以“Si樹脂(I)+Si樹脂(II)”/“低分子有機酸”=9/1的方式進行設定。將評價結果總結在表6中。在計算方面,在組成物中含有0.8~1質量%的低分子有機酸(D-1),在固體成分中含有3~4質量%的低分子有機酸(D-1)。Further, an experiment (No. 701 to 703) in which a low molecular organic acid (D-1) shown below was added was carried out. Further, the low molecular organic acid (D-1) was a compound having a carboxylic acid, and the acid value was 340 mg KOH / g. Regarding the amount of addition, the total mass measurement of "Si resin (I) + Si resin (II) + low molecular organic acid" is set to be the total mass measurement of "Si resin (I) + Si resin (II)" of Example 1. The same, and in terms of mass ratio, "Si resin (I) + Si resin (II)" / "Low molecular organic acid" = 9 / 1. The evaluation results are summarized in Table 6. In terms of calculation The composition contains 0.8 to 1% by mass of a low molecular organic acid (D-1), and the solid content contains 3 to 4% by mass of a low molecular organic acid (D-1).

【化學式11】 [Chemical Formula 11]

[表6] [Table 6]

實施例1中,製備將聚合性化合物DAYARAD DPHA(Nippon Kayaku Co.,Ltd.製造)改為三環癸烷二甲醇二丙烯酸酯之組成物,對該組成物進行相同的評價,結果同樣顯示出了良好的性能。In the example 1, a composition in which the polymerizable compound DAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) was changed to tricyclodecane dimethanol diacrylate was prepared, and the composition was subjected to the same evaluation, and the results were similarly shown. Good performance.

no

no

no

Claims (21)

一種矽氧烷樹脂組成物,其含有含金屬粒子、矽氧烷樹脂以及溶劑, 上述矽氧烷樹脂至少具有酸性基(A)。A siloxane oxide resin composition comprising metal-containing particles, a decane resin, and a solvent, wherein the siloxane oxide resin has at least an acidic group (A). 如申請專利範圍第1項所述之矽氧烷樹脂組成物,其進一步含有鹼可溶性樹脂。The oxirane resin composition according to claim 1, which further comprises an alkali-soluble resin. 如申請專利範圍第1項或第2項所述之矽氧烷樹脂組成物,其中,上述酸性基(A)的pKa為5.5以下。The oxirane resin composition according to the first or second aspect of the invention, wherein the acidic group (A) has a pKa of 5.5 or less. 如申請專利範圍第1項或第2項所述之矽氧烷樹脂組成物,其中,上述酸性基(A)係選自羧基、磷酸基、膦酸基以及磺酸基之至少一種。The oxirane resin composition according to the first or second aspect of the invention, wherein the acidic group (A) is at least one selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, and a sulfonic acid group. 如申請專利範圍第1項或第2項所述之矽氧烷樹脂組成物,其中,上述矽氧烷樹脂係含有以下述式(S)表示之矽烷化合物而製備之水解縮合物: (RS1e Si(RS2f (ORS3g (S) RS1 係含有酸性基(A)之基團, RS2 以及RS3 分別獨立地表示氫原子或烴基, e為1~3的整數, f為0~2的整數, g為1~3的整數, e+g+f為4。The oxime resin composition according to the first or second aspect of the invention, wherein the oxime resin contains a hydrolyzed condensate prepared by a decane compound represented by the following formula (S): (R S1 e Si(R S2 ) f (OR S3 ) g (S) R S1 is a group containing an acidic group (A), and R S2 and R S3 each independently represent a hydrogen atom or a hydrocarbon group, and e is an integer of 1 to 3 , f is an integer from 0 to 2, g is an integer from 1 to 3, and e+g+f is 4. 一種矽氧烷樹脂組成物,其含有含金屬粒子、矽氧烷樹脂、鹼可溶性樹脂以及溶劑,硬化膜的折射率為1.5以上,其中,上述矽氧烷樹脂係具有矽烷醇基之矽氧烷樹脂。A cerium oxide resin composition comprising metal-containing particles, a decyl alkane resin, an alkali-soluble resin, and a solvent, wherein the cured film has a refractive index of 1.5 or more, wherein the siloxane oxide has a decyl alcohol-based oxime Resin. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其進一步含有選自聚合起始劑以及紫外線吸收劑之至少一種。The oxirane resin composition according to claim 1 or 6, further comprising at least one selected from the group consisting of a polymerization initiator and an ultraviolet absorber. 如申請專利範圍第7項所述之矽氧烷樹脂組成物,其中,上述紫外線吸收劑選自苯并三唑化合物、二苯甲酮化合物、三嗪化合物、二烯化合物、苯并二硫醇化合物以及阿伏苯宗化合物。The oxirane resin composition according to claim 7, wherein the ultraviolet absorbing agent is selected from the group consisting of a benzotriazole compound, a benzophenone compound, a triazine compound, a diene compound, and a benzodithiol. Compounds and avobenzone compounds. 如申請專利範圍第2項或第6項所述之矽氧烷樹脂組成物,其中,上述鹼可溶性樹脂為丙烯酸樹脂。The oxirane resin composition according to Item 2 or Item 6, wherein the alkali-soluble resin is an acrylic resin. 如申請專利範圍第2項或第6項所述之矽氧烷樹脂組成物,其中,上述鹼可溶性樹脂為以下述式(R1)表示之樹脂: 【化學式1】LX1 表示單鍵或連結基, RX1 、RY1 分別獨立地為氫原子、甲基、乙基、丙基或氰基, RA 為酸性基(A), RY2 表示取代基, nx、ny為莫耳分率。The oxirane resin composition according to the second or sixth aspect of the invention, wherein the alkali-soluble resin is a resin represented by the following formula (R1): [Chemical Formula 1] L X1 represents a single bond or a linking group, and R X1 and R Y1 are each independently a hydrogen atom, a methyl group, an ethyl group, a propyl group or a cyano group, R A is an acidic group (A), and R Y2 represents a substituent, nx, Ny is the mole rate. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其中,調配於矽氧烷樹脂組成物中之樹脂的總計酸值為50mgKOH/g以上。The oxirane resin composition according to the first or sixth aspect of the invention, wherein the resin having a rhodium oxide resin composition has a total acid value of 50 mgKOH/g or more. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其中,相對於上述含金屬粒子100質量份,上述矽氧烷樹脂的含量為1質量份以上且80質量份以下。The oxirane resin composition according to the first or sixth aspect of the invention, wherein the content of the siloxane oxide resin is 1 part by mass or more and 80 parts by mass or less based on 100 parts by mass of the metal particle-containing particles. . 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其中,在上述矽氧烷樹脂組成物的固體成分中,上述含金屬粒子的含量為40質量%以上且80質量%以下。The oxime resin composition according to the first or sixth aspect of the invention, wherein the content of the metal-containing particles is 40% by mass or more and 80% by mass in the solid content of the siloxane oxide resin composition. %the following. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其含有選自Ti、Ta、W、Y、Ba、Hf、Zr、Sn、Nb、V以及Si之金屬作為構成上述含金屬粒子之元素。The oxirane resin composition according to the first or sixth aspect of the invention, which comprises a metal selected from the group consisting of Ti, Ta, W, Y, Ba, Hf, Zr, Sn, Nb, V and Si. The above element containing metal particles. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其中,上述矽氧烷樹脂係在上述含金屬粒子的存在下進行水解縮合反應而獲得者。The oxirane resin composition according to the first or sixth aspect of the invention, wherein the siloxane oxide resin is obtained by performing a hydrolysis condensation reaction in the presence of the metal-containing particles. 如申請專利範圍第1項或第6項所述之矽氧烷樹脂組成物,其中,硬化膜的折射率為1.6以上且2.0以下。The pyrithion resin composition according to the first or sixth aspect of the invention, wherein the cured film has a refractive index of 1.6 or more and 2.0 or less. 一種透明硬化物,其是使申請專利範圍第1項~第16項中任一項所述之矽氧烷樹脂組成物硬化而成。A transparent cured product obtained by curing the siloxane oxide resin composition according to any one of the first to sixteenth aspects of the invention. 一種透明像素,其包括申請專利範圍第17項所述之透明硬化物。A transparent pixel comprising the transparent cured product of claim 17 of the patent application. 一種微透鏡,其包括申請專利範圍第17項所述之透明硬化物。A microlens comprising the transparent cured product of claim 17 of the patent application. 一種固體攝像元件,其具備申請專利範圍第18項所述之透明像素。A solid-state imaging device comprising the transparent pixel described in claim 18 of the patent application. 一種固體攝像元件,其具備申請專利範圍第19項所述之微透鏡。A solid-state imaging device comprising the microlens described in claim 19.
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