TW201622100A - Package structure for light emitting devices - Google Patents

Abstract

A package structure for light emitting devices is provided, wherein an anisotropic conductive film (ACF) and flip-chip bonding technique can be applied for bonding the light emitting device to a carrying substrate. In addition, plural package units are stacked by performing a build-up process or a lamination process to form a full color microdisplay. The package structure for light emitting devices provides simple and quick manufacturing process and suitable for mass production. Furthermore, solutions for optical issues such as light guiding or light mixing are also provided.

Description

Light-emitting component packaging structure

The present disclosure relates to a package structure, and more particularly to a package structure of a light-emitting element.

With the advancement of optoelectronic technology, the volume of many optoelectronic components has gradually grown to miniaturization. In recent years, various micro-display technologies have been introduced, in which a micro-light-emitting diode (micro-LED) display and an organic light-emitting diode (OLED) display adopt active light-emitting element display technology. In particular, the miniature LED display is inferior to the organic light-emitting diode display in terms of contrast and energy consumption, and has an absolute advantage in reliability and longevity. It has great potential to become the future of mobile communication electronics and the Internet of Things (Internet of Things, IoT) applies mainstream display technology for wearable electronics.

The present disclosure provides a package structure of a light-emitting element, which is adapted to be connected by an anisotropic conductive film (ACF) and a flip chip package technology. The light-emitting element and the carrier plate can realize low process temperature, are compatible with the thin line process, and have a simple and fast packaging process, and are suitable for mass production.

The package structure of the light-emitting element of the present disclosure includes a carrier, a plurality of light-emitting elements, and an anisotropic conductive film. The carrier board has a bearing surface and a plurality of electrode contacts disposed on the bearing surface. The plurality of light emitting elements are arranged in an array and disposed above the carrying surface. Each of the light emitting elements includes a top portion facing the carrier, a bottom portion opposite the top portion, and a first electrode at the top portion. The anisotropic conductive film is disposed on the carrying surface and covers at least the plurality of electrode contacts, the top of each of the light emitting elements, the first electrode, and a portion of the side surface of each of the light emitting elements. The anisotropic conductive film includes an insulator and a plurality of conductive particles located in the insulator, and the first electrode of each of the light emitting elements is electrically connected to the corresponding electrode contact by the plurality of conductive particles.

In an embodiment of the disclosure, the bottoms of the plurality of light emitting elements are coplanar.

In an embodiment of the present disclosure, the anisotropic conductive film exposes the bottom of each of the light-emitting elements.

In an embodiment of the present disclosure, a first surface of the anisotropic conductive film is coplanar with a bottom of each of the light emitting elements.

In an embodiment of the present disclosure, the package structure of the light emitting device further includes an epitaxial substrate disposed on the anisotropic conductive film and covering the bottom of each of the light emitting elements.

In an embodiment of the present disclosure, the package structure of the light emitting element further includes a circuit layer disposed on the anisotropic conductive film and the plurality of light emitting elements. each The light emitting element further includes a second electrode located at the bottom, and the circuit layer is connected in series with the second electrode of the plurality of light emitting elements.

In an embodiment of the present disclosure, each of the light-emitting elements further includes a second electrode at the top, and the first electrode and the second electrode of each of the light-emitting elements are electrically connected to the corresponding by the plurality of conductive particles Electrode contacts.

In an embodiment of the present disclosure, the plurality of light emitting elements include a plurality of light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the disclosure, the plurality of light emitting elements include a plurality of first color light emitting diodes and a plurality of second color light emitting diodes.

In an embodiment of the disclosure, the plurality of light emitting elements comprise a first color strip light emitting unit and a second color strip light emitting unit, wherein the first color strip light emitting unit comprises a plurality of sequentially connected a first color light emitting diode, wherein the second color strip light emitting unit comprises a plurality of second color light emitting diodes connected in sequence.

In an embodiment of the present disclosure, the carrier board includes a semiconductor substrate, a glass substrate, or a circuit substrate.

The present disclosure provides another package structure for a light-emitting element that can realize full-color display. The package unit having the light-emitting element array can be formed by flip-chip bonding technology, and then the plurality of package units are combined in a lamination manner. . For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. The package structure of the light-emitting element proposed by the disclosure has a simple and rapid process and is suitable for mass production. At the same time, the disclosure can also propose solutions for optical quality issues such as light guiding and light mixing.

The package structure of the light emitting device according to the present disclosure includes a first package unit and at least a second package unit. The first package unit includes a first carrier, a plurality of first illuminating elements, a plurality of first conductive members, and a first encapsulant. The first carrier has a first bearing surface and a plurality of first electrode contacts disposed on the first bearing surface. The plurality of first light-emitting elements are arranged in an array and disposed above the first bearing surface. Each of the first illuminating elements includes a first top facing the first carrier, a first bottom opposite the first top, and a first electrode at the first top. The plurality of first conductive members are electrically connected to the corresponding first electrodes and the first electrode contacts, respectively. The first encapsulant is disposed on the first carrying surface and covers at least the plurality of first electrode contacts, the first top of each of the first light emitting elements, the first electrode, and a side surface of each of the first light emitting elements. Furthermore, a first surface of the first encapsulation is coplanar with the first bottom of each of the first illuminating elements. The at least one second package unit is stacked on the first package unit. The second package unit includes a second carrier, a plurality of second illuminating elements, a plurality of second conductive members, and a second encapsulant. The second carrier has a second bearing surface, a back surface opposite to the second bearing surface, and a plurality of second electrode contacts disposed on the second bearing surface. The plurality of second light emitting elements are arranged in an array and disposed above the second bearing surface. Each of the second illuminating elements includes a second top facing the second carrier, a second bottom opposite the second top, and a third electrode at the second top. The plurality of second conductive members are electrically connected to the corresponding third electrode and the second electrode contact, respectively. The second encapsulant is disposed on the second carrying surface and covers at least the plurality of second electrode contacts, the second top portion of each of the second light emitting elements, the third electrode, and a side surface of each of the second light emitting elements. Furthermore, a first surface of the second encapsulation is coplanar with the second bottom of each of the second illuminating elements.

In an embodiment of the disclosure, the first package unit further includes a first circuit layer disposed on the first carrier surface of the first carrier, and the first circuit layer is electrically connected to the plurality of An electrode contact.

In an embodiment of the disclosure, the first package unit further includes a second circuit layer disposed on the first encapsulant and the plurality of first illuminating elements. Each of the first light emitting elements further includes a second electrode located at the first bottom, and the second circuit layer is connected in series with the second electrodes of the plurality of first light emitting elements.

In an embodiment of the present disclosure, each of the first light-emitting elements further includes a second electrode on the first top, and the first electrode and the second electrode of each of the first light-emitting elements are respectively A conductive member is electrically connected to the corresponding first electrode contact.

In an embodiment of the disclosure, the plurality of first light emitting elements comprise a plurality of first color light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the disclosure, the second package unit further includes a third circuit layer disposed on the second carrier surface of the second carrier, and the third circuit layer is electrically connected to the plurality of second electrodes contact.

In an embodiment of the disclosure, the second package unit further includes a fourth circuit layer disposed on the second encapsulant and the plurality of second illuminating elements. Each of the second light emitting elements further includes a fourth electrode located at the second bottom, and the fourth circuit layer is connected in series with the fourth electrode of the plurality of second light emitting elements.

In an embodiment of the present disclosure, each of the second light emitting elements further includes a fourth electrode located at the second top, and the third electrode and the fourth of each of the second light emitting elements The electrodes are electrically connected to the corresponding second electrode contacts by the plurality of second conductive members, respectively.

In an embodiment of the disclosure, the plurality of second light emitting elements comprise a plurality of second color light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the disclosure, the at least one second package unit includes two second package units stacked on each other, wherein the plurality of second light-emitting elements of one second package unit are included on the same epitaxial substrate. The plurality of second color light emitting diodes are fabricated, and the plurality of second light emitting elements of the other second package unit comprise a plurality of third color light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the present disclosure, the package structure of the light emitting element further includes a plurality of light guiding structures respectively disposed above the corresponding first light emitting element and the second light emitting element. One end of each light guiding structure is connected to the first bottom of the corresponding first light emitting element or the second bottom of the second light emitting element, and penetrates at least one second package unit of the upper layer.

In an embodiment of the present disclosure, the light guiding structure includes a through hole exposing a first bottom of the corresponding first light emitting element or a second bottom of the second light emitting element.

In an embodiment of the present disclosure, each of the light guiding structures includes a through hole and a light transmissive material filled in the through hole, and the refractive index of the light transmissive material is greater than the refractive index of the second encapsulant.

In an embodiment of the present disclosure, each light guiding structure includes a through hole and a reflective material covering the inner wall of the through hole.

In an embodiment of the disclosure, the package structure of the light-emitting element further includes at least one adhesive layer disposed between the adjacent first package unit and the second package unit, or two adjacent second package units. between.

In an embodiment of the disclosure, the first package unit further includes a first circuit layer disposed on the first carrier surface of the first carrier. The first circuit layer is electrically connected to the plurality of first electrode contacts, and the first encapsulant exposes a periphery of the first carrier and a portion of the first circuit layer. The second package unit further includes a third circuit layer disposed on the second carrier surface of the second carrier. The third circuit layer is electrically connected to the plurality of second electrode contacts, and the second encapsulant exposes a periphery of the second carrier and a portion of the third circuit layer. The package structure of the light-emitting element further includes a plurality of wires electrically connected between the first circuit layer and the third circuit layer or electrically connected between the corresponding two third circuit layers.

In an embodiment of the present disclosure, the first package unit further includes a first circuit layer disposed on the first carrier surface of the first carrier, and the first circuit layer is electrically connected to the plurality of first electrodes point. The second package unit further includes a third circuit layer disposed on the second carrier surface of the second carrier, and the third circuit layer is electrically connected to the plurality of second electrode contacts. The package structure further includes a plurality of via holes, each of the via holes penetrating through the second carrier of the at least one second package unit, and electrically connected between the corresponding third circuit layer and the first light-emitting element below it. Or electrically connected between the corresponding third circuit layer and the second light-emitting element below it.

In an embodiment of the disclosure, the package structure of the light emitting device further includes a black matrix layer disposed on the at least one second package unit and the black matrix The layer has a plurality of light transmissive regions corresponding to the plurality of first light emitting elements and the plurality of second light emitting elements, respectively.

In an embodiment of the present disclosure, the vertical projections of the plurality of first light-emitting elements and the plurality of second light-emitting elements on the first bearing surface do not overlap each other and are arranged in an array on one side.

In an embodiment of the present disclosure, the back side of the second carrier has a plurality of optical microstructures.

In an embodiment of the disclosure, the plurality of optical microstructures comprise a plurality of microlenses or a plurality of light modulation patterns.

In an embodiment of the present disclosure, the first carrier includes a semiconductor substrate, a glass substrate, or a wiring substrate.

In an embodiment of the present disclosure, the second carrier includes a light transmissive substrate.

In an embodiment of the present disclosure, the thickness of the second carrier is less than the thickness of the first carrier.

In an embodiment of the present disclosure, the first encapsulant and the plurality of first conductive members are respectively a first insulator of a first anisotropic conductive film and a plurality of first conductive layers located in the first insulator And the second encapsulant and the plurality of second conductive members are respectively a second insulator of a second anisotropic conductive film and a plurality of second conductive particles located in the second insulator.

In an embodiment of the present disclosure, the plurality of first conductive members include a plurality of first conductive bumps, and the plurality of second conductive members include a plurality of second conductive bumps.

In an embodiment of the disclosure, the package structure of the light emitting component is further included. A heat sink is disposed on a back surface of the first carrier.

The present disclosure provides another package structure of a light-emitting element capable of real-color display, which is formed by a flip-chip bonding technique and a build-up method to form a plurality of package units having an array of light-emitting elements and stacked on each other. For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. The package structure of the light-emitting element proposed by the disclosure has a simple and rapid process and is suitable for mass production. At the same time, the disclosure can also propose solutions for optical quality issues such as light guiding and light mixing.

The package structure of the light-emitting element proposed by the present disclosure includes a carrier, a plurality of package units, and an interconnect structure. The carrier has a bearing surface. The plurality of package units are sequentially stacked on the carrying surface, and each of the package units includes an envelope, a plurality of light emitting elements, and a plurality of conductive bumps. The encapsulant has a first surface and an opposite second surface, wherein the encapsulant of the upper layer is bonded to the first surface of the encapsulation of another encapsulation unit of the lower layer with the second surface. The plurality of light emitting elements are arranged in an array and buried in the first surface of the encapsulation. Each of the light-emitting elements includes a top portion facing the carrier, a bottom portion opposite to the top portion, and a first electrode at the top portion, and the first surface of the envelope body is coplanar with the bottom of each of the light-emitting elements. The plurality of conductive bumps are buried in the second surface of the encapsulation. The interconnect structure is located in the encapsulation of the plurality of package units, and the interconnect structure includes a plurality of first circuit layers and a plurality of via holes. The plurality of first circuit layers are disposed between the adjacent two encapsulants or between the adjacent carrier and the encapsulant, and are electrically connected to the corresponding light-emitting elements respectively by the conductive bumps. The plurality of via holes extend through the respective encapsulants and are electrically connected between the respective first circuit layers.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a plurality of second circuit layers and at least one insulating layer. The plurality of second circuit layers are respectively disposed on the first surfaces of the encapsulants. Each of the light emitting elements further includes a second electrode located at a bottom of the light emitting element, and the second circuit layer is connected in series with the second electrode of the plurality of light emitting elements. The at least one insulating layer is disposed between the adjacent two encapsulants for isolating the corresponding second circuit layer and the interconnect structure.

In an embodiment of the present disclosure, each of the light-emitting elements further includes a second electrode located at the top of the light-emitting element, and the first electrode and the second electrode of each of the light-emitting elements are electrically connected to the corresponding conductive bumps, respectively.

In an embodiment of the disclosure, the plurality of light emitting elements of each package unit includes a plurality of light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the present disclosure, the plurality of light emitting elements of different package units are adapted to emit light of different colors.

In an embodiment of the disclosure, the plurality of package units include a first package unit, a second package unit, and a third package unit stacked on each other. The plurality of light emitting elements of the first package unit include a plurality of first color light emitting diodes fabricated on the same epitaxial substrate. The plurality of light emitting elements of the second package unit include a plurality of second color light emitting diodes fabricated on another epitaxial substrate. The plurality of light emitting elements of the third package unit include a plurality of third color light emitting diodes fabricated on a further epitaxial substrate.

In an embodiment of the present disclosure, the package structure of the light emitting element further includes a plurality of light guiding structures respectively disposed above the corresponding light emitting elements. Light guiding structure One end is connected to the bottom of the corresponding light-emitting element and penetrates at least one package unit of the upper layer.

In an embodiment of the present disclosure, each of the light guiding structures includes a through hole to expose a bottom of the corresponding light emitting element.

In an embodiment of the present disclosure, each of the light guiding structures includes a through hole and a light transmissive material filled in the through hole, and the refractive index of the light transmissive material is greater than the refractive index of the encapsulant.

In an embodiment of the present disclosure, each light guiding structure includes a through hole and a reflective material covering the inner wall of the through hole.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a cladding layer disposed on the plurality of package units, and each light guiding structure further penetrates the batch layer.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a black matrix layer disposed on the plurality of package units, and the black matrix layer has a plurality of light transmissive regions corresponding to the A plurality of light emitting elements.

In an embodiment of the present disclosure, the vertical projections of the plurality of light-emitting elements on the bearing surface do not overlap each other and are arranged in an array on one side.

In an embodiment of the present disclosure, the carrier board includes a semiconductor substrate, a glass substrate, or a wiring substrate.

In an embodiment of the present disclosure, the package structure of the light emitting element further includes a heat sink disposed on a back surface of the carrier.

In an embodiment of the disclosure, the package structure of the light emitting device further includes an epitaxial substrate disposed on the uppermost package unit and covering the package unit. a first surface of the encapsulant and a bottom of the plurality of light emitting elements.

The present disclosure provides a package structure of a light-emitting element that can realize full-color display. The package unit having the light-emitting element array can be formed by flip chip bonding technology, and then multiple package units are combined in a lamination manner. . For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. Each package unit itself has an interconnect structure and is electrically connected to each other by an interconnect structure. The package structure of the light-emitting element proposed by the disclosure has a simple and rapid process and is suitable for mass production. At the same time, the disclosure can also propose solutions for optical quality issues such as light guiding and light mixing.

The package structure of the light-emitting element proposed by the present disclosure includes a plurality of package units, a plurality of first conductive bumps, and an adhesive layer. The plurality of package units are stacked on each other, and each package unit includes an envelope, a plurality of light emitting elements, and a line structure. The encapsulant has a first surface and an opposite second surface, wherein the encapsulant of the upper layer is bonded to the second surface of the encapsulation of another encapsulation unit of the lower layer with the first surface. The plurality of light emitting elements are arranged in an array and buried in the first surface of the encapsulation. Each of the light-emitting elements includes a top portion, a bottom portion opposite to the top portion, and a first electrode at the top portion, and the first surface of the envelope body is coplanar with the bottom of each of the light-emitting elements. The circuit structure is disposed on the second surface of the encapsulation body or the encapsulation body and electrically connected to the corresponding first electrode. The plurality of first conductive bumps are disposed between two adjacent package units and electrically connected to the circuit structure of the two package units. The adhesive layer is disposed between the adjacent two package units and covers the first conductive bumps.

In an embodiment of the disclosure, the package structure of the light emitting component is further included. A carrier board is disposed to carry the plurality of package units stacked on each other, and a second surface of each package body faces the carrier board, wherein a line structure of the lowermost package body is electrically connected to the carrier board.

In an embodiment of the present disclosure, the package structure of the light-emitting element further includes a plurality of second conductive bumps disposed between the carrier and the lowermost package unit for electrically connecting the circuit structure of the package unit. To the carrier board.

In an embodiment of the present disclosure, the package structure of the light-emitting element further includes a carrier plate carrying the plurality of package units stacked on each other, and the first surface of each package body faces the carrier board, wherein the lowermost layer The wiring structure of the encapsulation is electrically connected to the carrier.

In an embodiment of the present disclosure, the package structure of the light-emitting element further includes a plurality of second conductive bumps disposed between the carrier and the lowermost package unit for electrically connecting the circuit structure of the package unit. To the carrier board.

In an embodiment of the present disclosure, the package structure of the light emitting element further includes an epitaxial substrate carrying the plurality of package units stacked on each other, and the first surface of the encapsulation of the lowermost package unit is bonded Epitaxial substrate.

In an embodiment of the present disclosure, each of the light emitting elements further includes a second electrode located at the bottom of the light emitting element and electrically connected to the corresponding line structure.

In an embodiment of the present disclosure, each of the light emitting elements further includes a second electrode located at the top of the light emitting element and electrically connected to the corresponding line structure.

In an embodiment of the disclosure, the plurality of light emitting elements of each package unit includes a plurality of light emitting diodes fabricated on the same epitaxial substrate.

In an embodiment of the present disclosure, the plurality of light emitting elements of different package units are adapted to emit light of different colors.

In an embodiment of the disclosure, the plurality of package units include a first package unit, a second package unit, and a third package unit stacked on each other, wherein the plurality of light emitting elements of the first package unit include a plurality of first color light emitting diodes fabricated on the same epitaxial substrate, the plurality of light emitting elements of the second package unit comprising a plurality of second color light emitting diodes fabricated on another epitaxial substrate, The plurality of light emitting elements of the three package unit include a plurality of third color light emitting diodes fabricated on a further epitaxial substrate.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a plurality of light guiding structures. Each of the light-emitting elements has a light-emitting direction, and one end of each light-conducting structure is connected to the corresponding light-emitting element and penetrates at least one package unit in the light-emitting direction.

In an embodiment of the present disclosure, each of the light-emitting elements emits light from the top, and one end of each light-conducting structure is connected to the top of the corresponding light-emitting element.

In an embodiment of the present disclosure, each of the light-emitting elements emits light from the bottom, and one end of each light-guiding structure is connected to the bottom of the corresponding light-emitting element.

In an embodiment of the present disclosure, each light guiding structure includes a through hole to expose a corresponding light emitting element.

In an embodiment of the present disclosure, each of the light guiding structures includes a through hole and a light transmissive material filled in the through hole, and the refractive index of the light transmissive material is greater than the refractive index of the encapsulant.

In an embodiment of the disclosure, each light guiding structure includes a through hole and a cover a reflective material on the inner wall of the through hole.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a cladding layer disposed on the plurality of package units, and each light guiding structure further penetrates the batch layer.

In an embodiment of the disclosure, the package structure of the light emitting element further includes a black matrix layer disposed on the plurality of package units, and the black matrix layer has a plurality of light transmissive regions corresponding to the A plurality of light emitting elements.

In an embodiment of the present disclosure, the vertical projections of the plurality of light-emitting elements on the bearing surface do not overlap each other and are arranged in an array on one side.

In an embodiment of the present disclosure, the carrier board includes a semiconductor substrate, a glass substrate, or a wiring substrate.

In an embodiment of the present disclosure, each of the light-emitting elements further includes an insulating layer at the bottom of the light-emitting element.

The above described features and advantages of the present invention will be more apparent from the following description.

100, 300, 400, 500, 800, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2500, 2600, 2700, 2800, 2900, 3000, 3100, 3200, 3300, 3600, 3700, 3800, 3900, 4000, 4100, 4200, 4300, 4400, 4500 ‧ ‧ package structure

110, 610‧‧‧ carrier board

112‧‧‧ bearing surface

114, 614‧‧‧ electrode contacts

120, 622, 624, 626‧ ‧ luminescent components

122‧‧‧Top of the light-emitting element

124‧‧‧Bottom of the light-emitting element

126‧‧‧first electrode

128‧‧‧second electrode

129‧‧‧Side side of the light-emitting element

130‧‧‧ anisotropic conductive film

130a‧‧‧The first surface of the anisotropic conductive film

132‧‧‧Insulator

134‧‧‧ conductive particles

140‧‧‧ epitaxial substrate

150‧‧‧circuit layer

660‧‧‧ Vehicles

662‧‧‧ Surface of the vehicle

664‧‧‧ Groove

670‧‧‧ release layer

702‧‧‧ wafer

710‧‧‧First color strip light unit

712‧‧‧First color LED

720‧‧‧Second color strip light unit

722‧‧‧Second color light-emitting diode

730‧‧‧The third color strip light unit

732‧‧‧Third-color light-emitting diode

801‧‧‧First package unit

802, 803‧‧‧ second package unit

810-1‧‧‧First carrier board

810-2, 810-3‧‧‧ second carrier

812-1‧‧‧First bearing surface

812-2, 812-3‧‧‧ second bearing surface

814-2, 814-3‧‧‧ back of the second carrier

816-1‧‧‧First electrode contact

816-2, 816-3‧‧‧ second electrode contacts

820-1‧‧‧First light-emitting element

820-2, 820-3‧‧‧ second light-emitting element

822-1‧‧‧The first top of the first illuminating element

822-2, 822-3‧‧‧ second top of the second illuminating element

824-1‧‧‧The first bottom of the first illuminating element

824-2, 824-3‧‧‧ second bottom of the second illuminating element

826-1‧‧‧First electrode

826-2, 826-3‧‧‧ third electrode

828-1‧‧‧Second electrode

828-2, 828-3‧‧‧ fourth electrode

829-1‧‧‧Side side of the first illuminating element

829-2, 829-3‧‧‧ side of the second illuminating element

830-1‧‧‧First conductive parts

830-2, 830-3‧‧‧ second conductive parts

840-1‧‧‧First Envelope

842-1‧‧‧ a first surface of the first envelope

840-2, 840-3‧‧‧Second Envelope

842-2, 842-3‧‧‧ a first surface of the second envelope

862-1‧‧‧First circuit layer

862-2, 862-3‧‧‧ third circuit layer

B‧‧‧Blue

G‧‧‧Green Light

R‧‧‧Red Light

1010‧‧‧through hole

1020‧‧‧High refractive index light transmissive material

1030‧‧‧Reflecting materials

1310, 1320‧‧‧ adhesive layer

1510‧‧‧Wire

1610‧‧‧through holes

1710‧‧‧Black matrix layer

1712‧‧‧Transparent area

1810‧‧‧Second circuit layer

1820‧‧‧ fourth circuit layer

2010‧‧‧Optical microstructure

2110‧‧‧ Heat sink

2202‧‧‧Package unit

2202-1‧‧‧First package unit

2202-2‧‧‧Second package unit

2202-3‧‧‧The third package unit

2210‧‧‧ Carrier Board

2212‧‧‧ bearing surface

2214‧‧‧Back of the carrier board

2220, 2220-1, 2220-2, 2220-3‧‧‧Lighting elements

2221-1, 2221-2, 2221-3‧‧‧ epitaxial substrate

2222, 2222-1, 2222-2, 2222-3‧‧‧ top of the illuminating element

2224, 2224-1, 2242-2, 2224-3‧‧‧ bottom of the light-emitting element

2226, 2226-1, 2226-2, 2226-3‧‧‧ first electrode

2228-1, 2228-2, 2228-3‧‧‧ second electrode

2230, 2230-1, 2230-2, 2230-3‧‧‧ conductive bumps

2240, 2240-1, 2240-2, 2240-3‧‧‧ Encapsulation

2242‧‧‧ The first surface of the enclosure

2244‧‧‧Second surface of the enclosure

2250‧‧‧Inline structure

2252, 2252-1, 2252-2, 2252-3‧‧‧ first line layer

2254, 2254-1, 2254-2‧‧‧ vias

2256-1, 2256-2, 2256-3‧‧‧ second circuit layer

2510‧‧‧through hole

2520‧‧‧High refractive index light transmissive material

2530‧‧‧Reflecting materials

2810‧‧‧coating

2910‧‧‧Black matrix layer

2912‧‧‧Transparent area

3010, 3020‧‧‧Insulation

3210‧‧‧ Heat sink

3302‧‧‧Package unit

3302-1‧‧‧First package unit

3302-2‧‧‧Second package unit

3302-3‧‧‧The third package unit

3305‧‧‧Insulation

3310‧‧‧ Carrier Board

3320, 3320-1, 3320-2, 3320-3‧‧‧Lighting elements

3321-1‧‧‧ epitaxial substrate

3322, 3322-1, 3322-2, 3322-3‧‧‧ top of the light-emitting element

3324, 3324-1, 3234-2, 3324-3‧‧‧ bottom of the light-emitting element

3326-1, 3326-2, 3326-3‧‧‧ first electrode

3328-1, 3328-2, 3328-3‧‧‧ second electrode

3340, 3340-1, 3340-2, 3340-3‧‧‧ Encapsulation

3342‧‧‧ First surface of the enclosure

3344, 3344-1‧‧‧ second surface of the enclosure

3349-1‧‧‧through hole

3350‧‧‧Line structure

3360‧‧‧First conductive bump

3370‧‧‧Adhesive layer

3380‧‧‧Second conductive bump

4010, 4110‧‧‧through holes

4020‧‧‧Lighting material

4030‧‧‧Reflecting materials

4410‧‧‧coating

4510‧‧‧Black matrix layer

FIG. 1 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

2A-2D illustrate a packaging process of the package structure of FIG. 1.

FIG. 3 illustrates a package junction of a light emitting device according to an embodiment of the present disclosure. Structure.

FIG. 4 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 5 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

6A-6H illustrate a packaging process of a light emitting device according to an embodiment of the present disclosure.

FIG. 7 illustrates a singulation process of a wafer to form a strip-shaped light-emitting unit in accordance with an embodiment of the present disclosure.

FIG. 8 illustrates a package structure of a light-emitting element that can realize full color display according to an embodiment of the present disclosure.

9A-9C are vertical projections of the light-emitting elements of the package structure of FIG. 8 on a plane, respectively.

FIG. 10 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 11 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 12 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 13 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 14 illustrates a package junction of a light emitting device according to an embodiment of the present disclosure. Structure.

FIG. 15 is a partial schematic view showing a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 16 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 17 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 18 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 19 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 20 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 21 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 22 illustrates a package structure of a light-emitting element that can realize full-color display according to an embodiment of the present disclosure.

23A-23G illustrate a packaging process of the package structure of FIG. 22.

24A-24C are vertical projections of the light-emitting elements of the package structure of FIG. 22 on a plane, respectively.

FIG. 25 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 26 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 27 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 28 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 29 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 30 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 31 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 32 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 33 illustrates a package structure of a light-emitting element that can realize full color display according to an embodiment of the present disclosure.

34A to 34G illustrate a packaging process of the package structure of FIG.

35A to 35C respectively illustrate vertical projections of the light-emitting elements of the package structure of FIG. 33 on a plane.

FIG. 36 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 37 illustrates a package junction of a light emitting device according to an embodiment of the present disclosure. Structure.

FIG. 38 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 39 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 40 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 41 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 42 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 43 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 44 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 45 illustrates a package structure of a light emitting device according to an embodiment of the present disclosure.

FIG. 1 illustrates a package structure 100 of a light emitting device in accordance with an embodiment of the present disclosure. In this embodiment, the light-emitting element and the carrier are bonded by an anisotropic conductive film and a flip chip packaging technology to achieve a low process temperature, which is compatible with the thin line process, and The packaging process is simple and fast, and is suitable for mass production.

As shown in FIG. 1 , the package structure 100 includes a carrier 110 , a plurality of light emitting elements 120 , and an anisotropic conductive film 130 . The carrier 110 has a carrying surface 112 and a plurality of electrode contacts 114 disposed on the carrying surface 112. Here, the carrier 110 is, for example, a semiconductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving IC including an electronic circuit.

The light emitting elements 120 are arranged in an array and disposed above the carrying surface 112. The light-emitting element 120 of the present embodiment is, for example, a light-emitting diode. In the process, a carrier 110 having electrode contacts 114 can be provided as shown in FIG. 2A. After the bearing surface 112 of the carrier 110 is cleaned, the anisotropic conductive film 130 may be adhered to the bearing surface 112 of the carrier 110 as shown in FIG. 2B, wherein the anisotropic conductive film 130 covers the electrode contacts 114. Further, a plurality of light-emitting elements 120 are formed on the epitaxial substrate 140, and the pitch of the adjacent light-emitting elements 120 is, for example, less than 50 micrometers (μm). Then, as shown in FIG. 2C, the epitaxial substrate 140, together with the light-emitting element 120 thereon, is flip-bonded to the electrode contact 114 on the carrier 110 by flip chip packaging. Thereafter, a package structure 100 as shown in FIG. 2D is formed.

Here, if the light-emitting element 120 and the electrode contact 114 are bonded by conventional solder, the difference in thermal expansion coefficient between the elements may be large, so that the package structure 100 is affected by a large thermal stress to generate warpage and reduce reliability. . Therefore, in this embodiment, the anisotropic conductive film is used as the bonding material, and the light emitting element 120 is electrically connected to the corresponding electrode contact 114.

Specifically, as shown in FIG. 1 , each of the light emitting elements 120 includes a carrier facing plate A top portion 122 of the 110, a bottom portion 124 relative to the top portion 122, and a first electrode 126 at the top portion 122. The anisotropic conductive film 130 is disposed on the carrying surface 112 and covers at least the electrode contact 114, the top portion 122 of each of the light emitting elements 120, the first electrode 126, and a portion of the side surface 129 of each of the light emitting elements 120. In the present embodiment, the anisotropic conductive film 130 fills the space between the carrier 110 and the epitaxial substrate 140, that is, the anisotropic conductive film 130 completely covers the side surface 129 of the light emitting element 120. It should be noted that the light-emitting element 120 of this embodiment or other embodiments described below may be a vertical light-emitting diode or a horizontal light-emitting diode unless otherwise specified. In other words, except for the first electrode 126 located at the top portion 122; if it is a vertical light-emitting diode, the bottom portion 124 of the light-emitting element 120 may have a second electrode; or, if it is a horizontal light-emitting diode The top portion 124 of the light emitting element 120 may also have a second electrode. In order to clearly express a particular feature, the second electrode may be omitted in the drawings of some embodiments, but one of ordinary skill in the art can still infer the second from other embodiments that clearly depict the second electrode. Possible position of the electrode.

In addition, the foregoing epitaxial substrate 140 or the epitaxial substrate described below may be replaced by other types of substrates. For example, after the LED is fabricated on the epitaxial substrate, it is transferred to a germanium substrate or other substrate, and then a related process (such as a packaging process) is performed.

The anisotropic conductive film 130 includes an insulator 132 and a plurality of conductive particles 134 located in the insulator 132. The first electrode 126 of each of the light-emitting elements 120 is electrically connected to the corresponding electrode contact by the plurality of conductive particles 134. 114. Here, the insulator 132 may be a thermosetting or thermoplastic polymer material. When the carrier 110 and the epitaxial substrate When the gap between the light-emitting element 120 and the electrode contact 114 is changed due to warpage caused by thermal stress between the plates 140, the conductive particles 134 can compensate for this. In addition, based on the characteristics of the anisotropic conductive film 130, the package structure 100 of the present embodiment has a low process temperature (<200 ° C) and is compatible with the thin line process. Since the steps of filling the underfill and the like are not required, and wafer level packaging can be realized, all the light emitting elements 120 on the epitaxial substrate 140 are bonded to the carrier 110 by a bonding step, so that the process is simple, Fast, suitable for mass production. In addition, since the conventional solder is not used for bonding, the process material does not contain lead or halogen, and is environmentally friendly.

FIG. 3 illustrates a package structure 300 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 300 of the present embodiment is similar to the package structure 100 of the previous embodiment, and the main difference is that the package structure 300 of the present embodiment does not have the epitaxial substrate 140. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, as shown in FIG. 3, in order to meet the requirements of heat dissipation, optical characteristics, and thinning, the present embodiment may further perform laser, mechanical grinding, or chemistry after completing the packaging process as described in the foregoing embodiments. The epitaxial substrate 140 is removed in a manner. As such, the bottom portion 124 of the light-emitting element 120 of the present embodiment is coplanar, and the anisotropic conductive film 130 exposes the bottom portion 124 of each of the light-emitting elements 120, and the first surface 130a of the anisotropic conductive film 130 is also associated with each of the light-emitting elements 120. The bottom 124 is coplanar.

FIG. 4 illustrates a package structure 400 of a light emitting device in accordance with an embodiment of the present disclosure. This embodiment employs the same component symbols as in the previous embodiment to indicate the phase. The same or similar elements, or the elements that have been clearly explained, are omitted. Therefore, the related description of the elements can be referred to the foregoing embodiment, and the main differences between the present embodiment and the foregoing embodiments will be described below.

In the present embodiment, the light-emitting element 120 is, for example, a vertical light-emitting diode. Each of the light-emitting elements 120 includes a second electrode 128 at the bottom portion 124 in addition to the first electrode 126 at the top portion 122, wherein the first electrode 126 is, for example, the P-pole of the light-emitting diode, and the second electrode 128 is, for example, The N pole of the light-emitting diode. This embodiment can select a series connection of the second electrodes 128 to form a common N-pole design. Therefore, the wiring layer 150 can be formed on the first surface 130a of the anisotropic conductive film 130 after the epitaxial substrate 140 is removed in the foregoing embodiment. Here, the wiring layer 150 is, for example, a transparent conductive layer formed of a metal (such as gold, copper, aluminum, chromium, titanium, etc.) or a metal oxide (such as indium tin oxide or indium zinc oxide), and the wiring layer 150 is connected in series. The second electrode 128 of each of the light emitting elements 120. Here, the second electrode 128 may also be a conductive layer that is entirely coated on the first surface 130a, such as a transparent conductive layer such as indium tin oxide or indium zinc oxide, or a line or electrode formed by patterning the conductive layer.

FIG. 5 illustrates a package structure 500 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 500 of the present embodiment is similar to the package structure 100 of the previous embodiment, and the main difference is that the light-emitting element 120 of the package structure 500 of the present embodiment is a horizontal light-emitting diode. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

As shown in FIG. 5, the top portion 122 of each of the light-emitting elements 120 of the present embodiment has The first electrode 126 and the second electrode 128 are electrically connected to the corresponding electrode contact 114 by the conductive particles 134 of the anisotropic conductive film 130, respectively.

In the foregoing various embodiments, the light-emitting elements 120 are, for example, a plurality of light-emitting diodes fabricated on the same epitaxial substrate 140, and thus emit the same color light. However, the disclosure is not limited thereto. In other embodiments, the light-emitting element 120 may also include a first color (eg, red light) light emitting diode that emits different color lights, a second color (such as a green light) light emitting diode, or even a third color (such as blue light). A light-emitting diode, or even a fourth or more color light-emitting diode. The following describes several packaging processes as an example.

6A-6H illustrate a packaging process of a light emitting device according to an embodiment of the present disclosure. First, as shown in FIG. 6A, a plurality of grooves 664 are formed on a surface 662 of a carrier 660, and as shown in FIG. 6B, a release layer is formed on the surface 662 of the carrier 660 (de- Bonding layer) 670. Next, as shown in FIG. 6C, light-emitting elements (for example, light-emitting diodes) 622, 624, and 626 capable of emitting different color lights are respectively placed in the grooves 664, and the light-emitting elements 622, 624, and 626 are separated by light. Layer 670 is secured to carrier 660. The function of forming the groove 664 is to assist in positioning the light-emitting elements 622, 624, 626 to improve the alignment accuracy of the subsequent bonding process.

On the other hand, as shown in FIG. 6D, a carrier 610 having a plurality of electrode contacts 614 is provided. Here, the carrier 610 is, for example, a semiconductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving IC including an electronic circuit. Next, as shown in FIG. 6E, an anisotropic conductive film 630 covering the electrode contact 614 is formed on the carrier 610. Special feature of the anisotropic conductive film 630 The anisotropic conductive film 130 of the foregoing embodiment is not described herein. Then, as shown in FIG. 6F, the carrier 610 is flip-bonded to the carrier 660 along with the electrode contacts 614 thereon by the flip chip packaging technique, so that the electrode contacts 614 pass through the anisotropic conductive film 630 and the corresponding The light-emitting elements 622, 624, and 626 are electrically connected to each other to form a structure as shown in FIG. 6G. Thereafter, as shown in FIG. 6H, the release layer 670 and the carrier 660 are removed to expose the light-emitting elements 622, 624, 626 to obtain the package structure 600.

Thereby, the packaging process of the embodiment can integrate a plurality of light-emitting elements 622, 624, 626 capable of emitting different colors of light on the carrier 610. Since the anisotropic conductive film 630 is used as the bonding material, it is not necessary to additionally perform steps such as filling the primer, and wafer level packaging can be realized, and all the light-emitting elements 622, 624, and 626 are bonded to each other by a bonding step. The plate 610 is therefore simple and fast, and is suitable for mass production. In addition, since the conventional solder is not used for bonding, the process material does not contain lead or halogen, and is environmentally friendly.

The light-emitting elements 622, 624, and 626 of the foregoing embodiments are, for example, light-emitting diodes fabricated on an epitaxial substrate. In practice, the light-emitting elements 622, 624, and 626 may be wafer-type light-emitting diodes after the wafer process is completed and singulation is performed. However, the disclosure is not limited thereto. For example, the light-emitting elements 622, 624, 626 of the package structure 600 are typically arranged in an array of faces to provide display of a full color picture. Considering the simplicity and efficiency of the process and the alignment accuracy of the bonding process, the wafer can be cut into strip-shaped light-emitting units during the singulation step of the wafer. As shown in FIG. 7, the first color strip light emitting unit 710 is formed by, for example, cutting a wafer 702, and includes a plurality of first color light emitting diodes 712 connected in sequence. Similarly, by other wafers The second color strip light emitting unit 720 and the third color strip light emitting unit 730 formed by cutting (not shown) respectively include a plurality of second color light emitting diodes 722 and a plurality of third color light emitting diodes sequentially connected. Body 732. Referring to FIG. 6 and FIG. 7 simultaneously, when the first color strip light emitting unit 710, the second color strip light emitting unit 720, and the third color strip light emitting unit 730 are applied to the packaging process of the foregoing embodiment, only the change is required. The groove 664 on the carrier 660 is strip-shaped to accommodate the first color strip-shaped light-emitting unit 710, the second color strip-shaped light-emitting unit 720, and the third color strip-shaped light-emitting unit 730, and the same steps can be followed. Packaging process.

FIG. 8 illustrates a package structure 800 of a light-emitting element that can achieve full color display in accordance with an embodiment of the present disclosure. In this embodiment, a package unit having an array of light-emitting elements may be formed by a flip chip bonding technique, and then a plurality of package units may be bonded in a lamination manner. For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. The package structure of the light-emitting element proposed in this embodiment is simple, fast, and suitable for mass production. At the same time, other embodiments extended by this embodiment can also propose solutions for optical quality issues such as light guiding and light mixing.

As shown in FIG. 8 , the package structure 800 of the present embodiment includes a first package unit 801 and two second package units 802 and 803 stacked on the first package unit 801 . The first package unit 801 includes a first carrier 810-1, a plurality of first light-emitting elements 820-1, a plurality of first conductive members 830-1, and a first envelope 840-1. The first carrier 810-1 has a first bearing surface 812-1 and a plurality of first electrode contacts 816-1 disposed on the first bearing surface 812-1. Here, the carrier board 810-1 is, for example, a half A conductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving wafer including an electronic circuit. In addition, the plurality of first light-emitting elements 820-1 are arranged in an array and disposed above the first bearing surface 812-1. In the process, the first package unit 801 can be formed, for example, by the method of the foregoing various embodiments. More specifically, the first light-emitting element 820-1 and the carrier plate 810-1 can be bonded by an anisotropic conductive film and a flip chip packaging technique using, for example, the processes shown in FIGS. 2A to 2D. Also, after the bonding step, the epitaxial substrate (not shown) that may be present is removed to form a base surface that can be stacked by the subsequent second package units 802 and 803.

Those skilled in the art should be able to understand and implement the possible manufacturing process of the first packaging unit 801 after referring to the description of the foregoing various embodiments, and thus the description of the same process steps will not be repeated.

Structurally, as shown in FIG. 8 , the plurality of first light-emitting elements 820-1 of the first package unit 801 are, for example, a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate, for example, above the drawing surface. A light-emitting diode that emits blue light B. Each of the first light-emitting elements 820-1 includes a first top portion 822-1 facing the first carrier 810-1, a first bottom 824-1 opposite the first top 822-1, and a first top 822-1. A first electrode 826-1. The first conductive members 830-1 are electrically connected to the corresponding first electrodes 826-1 and the first electrode contacts 816-1, respectively. The first encapsulation body 840-1 is disposed on the first bearing surface 812-1 and covers at least the first electrode contact 816-1, the first top portion 822-1 of each first light emitting element 820-1, and the first electrode. 826-1 and the side surface 829.1 of each of the first light-emitting elements 820-1. In addition, a first surface 842-1 of the first encapsulation 840-1 is coplanar with the first bottom portion 824-1 of each of the first illuminating elements 820-1.

In the above, the first encapsulant 840-1 and the first conductive member 830-1 are, for example, a first insulator 840-1 of the first anisotropic conductive film and a plurality of the first insulator 840-1, respectively. A conductive particle 830-1. The first insulator 840-1 may be a thermosetting or thermoplastic polymer material. The effect of using the first anisotropic conductive film as a bonding material can be referred to the description of the foregoing embodiment, and details are not described herein again.

Similarly, the second package units 802 and 803 can be fabricated using the same process as the first package unit 801. In addition, it is considered that the second package units 802 and 803 are stacked above the first package unit 801, and the carrier plate may affect the overall light output intensity, so that the carrier plates of the second package units 802 and 803 may be further thinned or light-transmitted. Material to make the carrier board.

Specifically, as shown in FIG. 8, the second package unit 802 is stacked on the first package unit 801, and the second package unit 802 includes a second carrier 810-2, a plurality of second light-emitting elements 820-2, A plurality of second conductive members 830-2 and a second envelope 840-2. The second carrier 810-2 has a second bearing surface 812-2, a back surface 814-2 opposite to the second bearing surface 812-2, and a plurality of second electrodes disposed on the second bearing surface 812-2. Point 816-2. The second carrier 810-2 is bonded to the first surface 842-1 of the lower first encapsulation 840-1 and the first bottom portion 824-1 of each of the first illuminating elements 820-1 by the back surface 814-2. In addition, in order to increase the light output of the first package unit 801 below, the thickness of the second carrier 810-2 may be smaller than the thickness of the first carrier 810-1, or the second carrier 810-2 may be a transparent substrate. Of course, in other embodiments, the first carrier 810-1 may also be thinned to reduce the thickness of the overall package structure 800.

In this embodiment, the plurality of second light emitting elements of the second package unit 802 820-2 is, for example, a plurality of second color light-emitting diodes formed on the same epitaxial substrate, for example, a light-emitting diode that emits green light G toward the upper side of the drawing. The second light-emitting elements 820-2 are arranged in an array and disposed above the second bearing surface 812-2. Each of the second light-emitting elements 820-2 includes a second top 822-2 facing the second carrier 810-2, a second bottom 824-2 opposite the second top 822-2, and a second top 822-2. A third electrode 826-2. The second conductive members 830-2 are electrically connected to the corresponding third electrodes 826-2 and the second electrode contacts 816-2, respectively. The second encapsulation body 840-2 is disposed on the second bearing surface 812-2, and covers at least the second electrode contact 816-2, the second top portion 822-2 of each second light emitting element 820-2, and the third electrode. 826-2 and side 829-2 of each of the second light-emitting elements 820-2. In addition, a first surface 842-2 of the second encapsulant 840-2 is coplanar with the second bottom 824-2 of each of the second illuminating elements 820-2.

In this embodiment, the second encapsulant 840-2 and the second conductive member 830-2 are respectively a second insulator 840-2 of a second anisotropic conductive film and are located in the second insulator 840-2. A plurality of second conductive particles 830-2. The second insulator 840-2 may be a thermosetting or thermoplastic polymer material. The effect of using the second anisotropic conductive film as a bonding material can be referred to the description of the foregoing embodiment, and details are not described herein again.

In addition, the second package unit 803 is stacked on the second package unit 802, and the second package unit 803 includes a second carrier 810-3, a plurality of second illuminating elements 820-3, and a plurality of second conductive members 830- 3 and a second enveloping body 840-3. The second carrier 810-3 has a second bearing surface 812-3, a back surface 814-3 opposite to the second bearing surface 812-3, and a plurality of second electrodes disposed on the second bearing surface 812-3. Point 816-3. The second carrier 810-3 is bonded to the lower second encapsulant by the back surface 814-3 The first surface 842-2 of the 840-2 and the second bottom 824-2 of each of the second light emitting elements 820-2. In addition, in order to increase the light output of the first package unit 801 and the second package unit 802, the thickness of the second carrier 810-3 may be smaller than the thickness of the first carrier 810-1, or the second carrier 810-3 may It is a transparent substrate. Of course, in other embodiments, the first carrier 810-1 may also be thinned to reduce the thickness of the overall package structure 800.

In this embodiment, the plurality of second light-emitting elements 820-3 of the second package unit 803 are, for example, a plurality of third color light-emitting diodes fabricated on the same epitaxial substrate, for example, emitting red light above the surface. Light-emitting diode of R. The second light-emitting elements 820-3 are arranged in an array and disposed above the second carrying surface 812-3. Each of the second light-emitting elements 820-3 includes a second top 822-3 facing the second carrier 810-3, a second bottom 824-3 opposite the second top 822-3, and a second top 822-3. A third electrode 826-3. The second conductive members 830-3 are electrically connected to the corresponding third electrodes 826-3 and the second electrode contacts 816-3, respectively. The second encapsulation body 840-3 is disposed on the second bearing surface 812-3 and covers at least the second electrode contact 816-3, the second top portion 822-3 of each second light emitting element 820-3, and the third electrode. 826-3 and side 829-3 of each of the second light-emitting elements 820-3. In addition, a first surface 842-3 of the second encapsulation 840-3 is coplanar with the second bottom portion 824-3 of each of the second illuminating elements 820-3.

In this embodiment, the second encapsulant 840-3 and the second conductive member 830-3 are respectively a second insulator 840-3 of a second anisotropic conductive film and located in the second insulator 840-3. A plurality of second conductive particles 830-3. The second insulator 840-3 may be a thermosetting or thermoplastic polymer material. The effect of using the second anisotropic conductive film as a bonding material can be referred to the description of the foregoing embodiment, and details are not described herein again.

In addition, as shown in FIG. 8 , in the embodiment, the first package unit 801 may include a first circuit layer 862-1 disposed on the first bearing surface 812-1 of the first carrier 810-1. And the first encapsulation 840-1 exposes the periphery of the first carrier 810-1 and a portion of the first wiring layer 862-1. The first circuit layer 862-1 is electrically connected to the first electrode contact 816-1 as a bridge for externally transmitting electrical signals to the first electrode contact 816-1. The second encapsulation unit 802 can include a third circuit layer 862-2 disposed on the first carrier surface 812-2 of the second carrier 810-2, and the second encapsulation 840-2 exposing the second carrier The periphery of the board 810-2 and a portion of the third line layer 862-2. The third circuit layer 862-2 is electrically connected to the second electrode contact 816-2 as a bridge for externally transmitting the electrical signal to the second electrode contact 816-2. In addition, the second encapsulating unit 803 can include a third circuit layer 862-3 disposed on the first bearing surface 812-3 of the second carrier 810-3, and the second encapsulation 840-3 is exposed. The periphery of the second carrier 810-3 and a portion of the third wiring layer 862-3. The third circuit layer 862-3 is electrically connected to the second electrode contact 814-3 as a bridge for externally transmitting the electrical signal to the second electrode contact 816-3.

9A to 9C illustrate a first light emitting element 820-1 of the first package unit 801, a second light emitting element 820-2 of the second package unit 802, and a second light emitting element 820-3 of the second package unit 803, respectively. A vertical projection of the first bearing surface 812-1 of the carrier plate 810-1 (please refer to FIG. 8). 9A to 9C, the vertical projections of the first light-emitting element 820-1, the second light-emitting element 820-2, and the second light-emitting element 820-3 on the first bearing surface 812-1 (please refer to FIG. 8) are mutually Interlaced and do not overlap each other to form an array. Thereby, the light emitted by the lower layer of the light-emitting element in the vertical direction can be blocked by the light-shielding elements (such as contacts or lines) of the other layer, and the oblique light can be emitted. Blocked by the shading elements of his layer to reduce the occurrence of color mixing.

FIG. 10 illustrates a package structure 1000 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 1000 of the present embodiment is similar to the package structure 800 of the foregoing embodiment, and the main difference is that the present embodiment is formed as a light guide over the first light-emitting element 820-1 and the second light-emitting element 820-2 after the package is completed. A plurality of through holes 1010 of the structure are used to maintain a high light output rate. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, the present embodiment removes the second package unit 802 and/or the second package unit 802 that may exist above the second light-emitting element 820-2 by, for example, laser, mechanical drilling, or chemical etching. The second package unit 803 is formed to form the through hole 1010. One end of each of the through holes 1010 is connected to the first bottom portion 824-1 of the corresponding first light emitting element 820-1 or the second bottom portion 824-2 of the second light emitting element 820-2, and the first light emitting element 820-1 is exposed. The first bottom portion 824-1 or the second bottom portion 824-2 of the second light emitting element 820-2 enables the blue light B emitted by the first light emitting element 820-1 and the green light G emitted by the second light emitting element 820-2 to pass through The hole 1010 is emitted to the outside.

In this embodiment, since the through holes 1010 penetrating the second package unit 802 and/or the second package unit 803 are formed, the second envelopes 840-2 and 840-3 and the second carrier plates 810-2 and 810 are formed. The material of -3 is flexible and can be made of light or opaque material.

FIG. 11 illustrates a package structure 1100 of a light emitting device in accordance with an embodiment of the present disclosure. This embodiment adopts the same component symbols as those of the foregoing embodiment to represent The same or similar components are omitted, or the components that have been clearly described are omitted. Therefore, the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1100 of the present embodiment is similar to the package structure 1000 of the previous embodiment, and the main difference is that the present embodiment further fills the through-hole 1010 with a high-refractive-index light-transmitting material 1020 to thereby pass through the high refractive index. The total reflection generated by the optical material 1020 and the second encapsulants 840-2, 840-3 outside the through hole 1010 realizes the effect of the optical waveguide, and transmits the blue light B emitted by the first light emitting element 820-1 and the second light emitting element 820- 2 emitted green light G. Here, the refractive index of the light transmissive material 1020 is greater than the refractive index of the second encapsulants 840-2, 840-3.

FIG. 12 illustrates a package structure 1200 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1200 of the present embodiment is similar to the package structure 1000 of the previous embodiment, and the main difference is that the inner wall of the through hole 1010 covers the reflective material 1030 such as metal to reflect on the through hole 1010 by the reflective material 1030. The blue light B emitted from the first light-emitting element 820-1 and the green light G emitted from the second light-emitting element 820-2.

FIG. 13 illustrates a package structure 1300 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1300 of this embodiment is similar to the package structure 800 of the previous embodiment, and the main difference is that The package structure 1300 of the present embodiment further includes an adhesive layer 1310 disposed between the adjacent first package unit 801 and the second package unit 802, and an adhesive layer 1320 disposed adjacent to the adjacent second package unit 802. Between 803. Here, the adhesive layers 1310 and 1320 are, for example, a non-conductive film or a UV adhesive. The bonding between the first package unit 801 and the second package units 802, 803 by the adhesive layers 1310 and 1320 can make the material selection range wider and the process parameters can be more widely modified.

FIG. 14 illustrates a package structure 1400 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1400 of the present embodiment is similar to the package structure 1300 of the foregoing embodiment, and the main difference is that the package structure 1400 of the embodiment does not use an anisotropic conductive film to bond the light-emitting elements and the electrode contacts in the package unit. In order to use solder as a bonding material.

More specifically, as shown in FIG. 14, the first conductive member 830-1, the second conductive member 830-2, and the second conductive member 830-3 of the present embodiment are respectively a plurality of conductive bumps formed of solder. In addition, the first encapsulant 840-1, the second encapsulant 840-2, and the second encapsulant 840-3 may be selected from a non-conductive film, an underfill or an ultraviolet adhesive. UV glue) and so on.

FIG. 15 is a partial schematic view of a package structure 1500 of a light emitting device according to an embodiment of the present disclosure. The present embodiment uses the same reference numerals as the above-described embodiments to denote the same or similar elements, or the elements that have been clearly explained are omitted. Therefore, the related description of the components can be referred to the foregoing embodiment, and details are not described herein again. The package structure 1500 of the present embodiment is similar to the package structure 800 of the foregoing embodiment, and the main difference is that the package structure 1500 of the embodiment further includes a plurality of wires 1510 electrically connected to the first circuit layer 862-1 and the third layer, respectively. Between the circuit layers 862-2 or 862-3, or electrically connected between the corresponding two third circuit layers 862-2 and 862-3. In other words, even if the second carrier plates 810-2 and 810-3 are thinned, since the first envelope body 840-1 and the second envelope body 840-2 are supported underneath, sufficient structural strength can be maintained. A wire bonding process is performed to integrate and drive the layer signals to the first carrier board 810-1 of the bottom layer for driving and regulation.

FIG. 16 illustrates a package structure 1600 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1600 of the present embodiment is similar to the package structure 1500 of the previous embodiment, and the main difference is that the package structure 1600 of the present embodiment replaces the wire 1510 of the foregoing embodiment with a via hole 1610 for interconnecting the signals of the layers. Integrate and regulate. More specifically, the package structure 1600 includes a plurality of vias 1610 extending through the second carrier 810-2 or the second carrier 810-3 for electrically connecting to the third circuit layer 862-2 and the first portion thereof Between the light-emitting elements 820-1, or electrically connected between the corresponding third circuit layer 862-3 and the second light-emitting element 820-2 below it.

FIG. 17 illustrates a package structure 1700 of a light emitting device in accordance with an embodiment of the present disclosure. This embodiment adopts the same component symbols as those of the foregoing embodiment to represent The same or similar components are omitted, or the components that have been clearly described are omitted. Therefore, the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 1700 of the present embodiment is similar to the package structure 800 of the previous embodiment, and the main difference is that the package structure 1700 of the present embodiment further includes a black matrix layer 1710 disposed on the second package unit 803 and having a black matrix layer. The 1710 has a plurality of light transmissive regions 1712 corresponding to the first light emitting element 820-1 and the second light emitting elements 820-2, 820-3, respectively, to define a plurality of pixel regions on the full color display surface. Here, the black matrix layer 1710 is, for example, a transparent cover plate having a black light-shielding region formed on its surface.

FIG. 18 illustrates a package structure 1800 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar elements in the embodiment, or the elements that have been clearly described are omitted. Therefore, the related description of the elements can be referred to the foregoing embodiment, and the present embodiment and the foregoing The main differences of the embodiments are explained.

In the present embodiment, the first light-emitting element 820-1, the second light-emitting element 820-2, and the second light-emitting element 820-3 are, for example, vertical light-emitting diodes. More specifically, the first light-emitting element 820-1 includes a second electrode 827-1 located at the first bottom portion 824-1, in addition to the first electrode 826-1 of the first top portion 822-1, wherein One electrode 826-1 is, for example, a P pole of a light emitting diode, and the second electrode 820-1 is, for example, an N pole of a light emitting diode. The second light emitting element 820-2 includes a fourth electrode 828-2 located at the second bottom portion 824-2 in addition to the third electrode 826-2 of the second top portion 822-2, wherein the third electrode 826-2 For example, it is the P pole of the light emitting diode, and the fourth electrode 828-2 is, for example, the N pole of the light emitting diode. In addition, the second light emitting element 820-3 In addition to the third electrode 826-3 located at the second top portion 822-3, a fourth electrode 828-3 at the second bottom portion 824-3 is further included, wherein the third electrode 826-3 is, for example, a light emitting diode The P pole, and the fourth electrode 828-3 is, for example, the N pole of the light emitting diode.

In this embodiment, after the epitaxial substrate (not shown) of the first package unit 801 is removed, the second circuit layer 1810 is formed on the first encapsulation body 840-1 to be separated by the second circuit layer 1810. The second electrode 822-1 is connected to form a common N-pole design. Alternatively, after the epitaxial substrate (not shown) of the second package unit 802, 803 is removed, the fourth circuit layer 1820 is formed on the second encapsulations 840-2, 840-3. The fourth circuit layer 1820 is connected in series with the fourth electrode 828-2 or 828-3 to form a common N-pole design. Here, the second wiring layer 1810 or the fourth wiring layer 1820 is, for example, a conductive layer formed of a metal such as gold, copper, aluminum, chromium, titanium, or a metal oxide such as indium tin oxide or indium zinc oxide. .

FIG. 19 illustrates a package structure 1900 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 1900 of the present embodiment is similar to the package structure 1800 of the previous embodiment, and the main difference is the first light-emitting element 820-1, the second light-emitting element 820-2, and the second light-emitting element 820 of the package structure 1900 of the present embodiment. -3 is a horizontal light-emitting diode. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

As shown in FIG. 19, the first top portion 822-1 of the first light emitting element 820-1 of the present embodiment has a first electrode 826-1 and a second electrode 827-1, and the first electrode 826-1 and the second electrode 828-1 is electrically connected to the first conductive member 830-1 to A corresponding first electrode contact 816-1. The second top portion 822-2 of the second light emitting element 820-2 has a third electrode 826-2 and a fourth electrode 828-2, and the third electrode 826-2 and the fourth electrode 828-2 respectively pass the second conductive member 830-2 is electrically connected to the corresponding second electrode contact 816-2. In addition, the second top portion 822-3 of the second light emitting element 820-3 has a third electrode 826-3 and a fourth electrode 828-3, and the third electrode 826-3 and the fourth electrode 828-3 are respectively The conductive member 830-3 is electrically connected to the corresponding second electrode contact 816-3.

FIG. 20 illustrates a package structure 2000 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2000 of the present embodiment is similar to the package structure 800 of the foregoing embodiment, and the main difference is the back surface 814-2 of the second carrier 810-2 of the package structure 2000 of the present embodiment and the second carrier 810-3. The back side 814-3 has a plurality of optical microstructures 2010. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, as shown in FIG. 20, the optical microstructure 2010 of the present embodiment is, for example, formed on the back surface 814-2 of the second carrier 810-2 and the back surface 814-3 of the second carrier 810-3. One microlens or multiple light modulation patterns. In other words, the present embodiment can use the micro-lens or light modulation pattern or the like to generate a condensed or specific optical effect of the optical microstructure 2010 in the package structure 2000, such that the first illuminating element 820-1, the second illuminating element 820-2, and The light angle of 820-3 is more convergent.

FIG. 21 illustrates a package structure 2100 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2100 of the embodiment and the package structure of the foregoing embodiment The main difference is that the package structure 2100 of the present embodiment further includes a heat sink 2110 disposed on the back surface 814-1 of the first carrier 810-1 to provide a good package structure 2100 by the heat sink 2110. heat radiation. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

FIG. 22 illustrates a package structure 2200 of a light-emitting element that can realize full color display according to an embodiment of the present disclosure. In the present embodiment, a plurality of package units having an array of light-emitting elements and stacked on each other are formed by a flip chip bonding technique in conjunction with a build-up method. For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. The package structure of the light-emitting element proposed by the disclosure has a simple and rapid process and is suitable for mass production. At the same time, the disclosure can also propose solutions for optical quality issues such as light guiding and light mixing.

As shown in FIG. 22, the package structure 2200 of the light-emitting element of the present disclosure includes a carrier 2210, a plurality of package units 2202, and an interconnect structure 2250. The carrier 2210 has a bearing surface 2212. Here, the carrier 2210 is, for example, a semiconductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving IC including an electronic circuit.

The plurality of package units 2202 are sequentially stacked on the carrying surface 2212 , and each of the package units 2202 includes an encapsulant 2240 , a plurality of light emitting elements 2220 , and a plurality of conductive bumps 2230 . The encapsulation 2240 has a first surface 2242 and an opposite second surface 2244, wherein the upper encapsulation 2240 is joined by the second surface 2244. The first surface 2242 of the encapsulation 2240 of the other encapsulation unit 2202 of the lower layer. The plurality of light emitting elements 2220 are arranged in an array and buried in the first surface 2242 of the encapsulation 2240.

Each of the light-emitting elements 2220 includes a top portion 2222 facing the carrier 2210, a bottom portion 2224 opposite the top portion 2222, and a first electrode 2226 at the top portion 2222. The first surface 2242 of the encapsulation 2240 is coplanar with the bottom 2224 of each of the light emitting elements 2220. The plurality of conductive bumps 2230 are buried in the second surface 2244 of the encapsulation 2240. The interconnect structure 2250 is located within the encapsulation 2240 of the plurality of package units 2202, and the interconnect structure 2250 includes a plurality of first circuit layers 2252 and a plurality of vias 2254. The plurality of first circuit layers 2252 are disposed between the adjacent two encapsulants 2240 or between the adjacent carrier 2210 and the encapsulation 2240, and are electrically connected to the corresponding by the conductive bumps 2230, respectively. Light-emitting element 2220. The plurality of vias 2254 extend through the respective encapsulants 2240 and are electrically connected between the respective first circuit layers 2252.

In this embodiment, the light-emitting elements 2220 of the package units 2202 are, for example, a plurality of light-emitting diodes fabricated on the same epitaxial substrate, and the light-emitting elements 2220 of the different package units 2202 are adapted to emit light of different colors.

More specifically, as shown in FIG. 22, the package structure 2200 of the present embodiment includes a first package unit 2202-1, a second package unit 2202-2, and a third package unit 2202-3 stacked on each other. The plurality of light-emitting elements 2220-1 of the first package unit 2202-1 are, for example, a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate, for example, light-emitting diodes that emit blue light B toward the upper side of the drawing. Second package unit The plurality of light-emitting elements 2220-2 of 2202-2 are, for example, a plurality of second color light-emitting diodes formed on the same epitaxial substrate, for example, a light-emitting diode that emits green light G toward the upper side of the drawing. The plurality of light-emitting elements 2220-3 of the third package unit 2202-3 are, for example, a plurality of third color light-emitting diodes fabricated on the same epitaxial substrate, for example, a light-emitting diode that emits red light R upward. .

23A-23G illustrate a packaging process of the package structure 2200 of FIG. 22. First, as shown in FIG. 23A, the light-emitting element 2220-1 of the first layer is bonded to the carrier 2210 by flip-chip bonding technology together with the epitaxial substrate 2221-1, wherein the light-emitting element 2220-1 is electrically transmitted through the conductive bump 2230-1. The first line layer 2252-1 is attached to the carrier 2210. In this step, conductive bumps 2230-1 can be formed using known solder. In addition, a non-conductive adhesive (Non-Conductive Film), an underfill or an ultraviolet adhesive (UV adhesive) may be used to fill the between the epitaxial substrate 2221-1 and the carrier 2210 to form an encapsulation. Body 2240-1.

Next, as shown in FIG. 23B, the epitaxial substrate 2221-1 is removed using a Lift-off technique. So far, the first package unit 2202-1 of the lowermost layer can be formed. Then, as shown in FIG. 23C, another first wiring layer 2252-2 is formed on the first package unit 2202-1 by a possible step of etching, deposition, printing, plating, etc., and the through-package body 2240-1 is inserted. One via hole 2254-1, and a plurality of conductive bumps 2230-2.

Thereafter, the foregoing steps are repeated, as shown in FIGS. 23D and 23E, the light-emitting element 2220-2 of the second layer is bonded to the first package unit 2202-1 in a flip-chip bonding technique together with the epitaxial substrate 2221-2, and the epitaxial layer is to be epitaxial. The substrate 2221-2 is removed to form a second package unit 2202-2 on the first package unit 2202-1. Light-emitting element 2220-2 transmits through The electrical bump 2230-2 is electrically connected to the first wiring layer 2252-2 on the first package unit 2202-1, and the first wiring layer 2252-2 can be connected to the lower layer via the via hole 2254-1.

Then, as shown in FIG. 23F, another first circuit layer 2252-3 is formed on the second package unit 2202-2 by a possible step of etching, deposition, printing, plating, etc., and the through-package 2240-2 is penetrated. One via hole 2254-2, and a plurality of conductive bumps 2230-3.

Thereafter, as shown in FIG. 23G, the light-emitting element 2220-3 of the third layer is bonded to the second package unit 2202-2 in a flip-chip bonding technique together with the epitaxial substrate 2221-3 to be on the second package unit 2202-2. A third package unit 2202-3 is formed. At this time, the epitaxial substrate 2221-3 may be selectively removed, or the epitaxial substrate 2221-3 may be retained to protect the uppermost third package unit 2202-3, and the structural strength of the package structure 2200 is increased. The light emitting element 2220-3 is electrically connected to the first circuit layer 2252-3 on the first package unit 2202-2 through the conductive bump 2230-3, and the first circuit layer 2252-3 can be connected to the via hole 2254-2. Lower line.

24A to 24C illustrate the light-emitting element 2220-1 of the first package unit 2202-1, the light-emitting element 2220-2 of the second package unit 2202-2, and the light-emitting element 2220-3 of the third package unit 2202-3, respectively. The vertical projection of the bearing surface 2212 of the plate 2210 (please refer to Figure 22). 24A to 24C, the vertical projections of the light-emitting element 2220-1, the light-emitting element 2220-2, and the light-emitting element 2220-3 on the carrying surface 2212 (refer to FIG. 22) are mutually staggered and do not overlap each other to form one side. Array. Thereby, the light emitted by the lower layer of the light-emitting element in the vertical direction can be prevented from being blocked by the light-shielding element of the layer (eg The contact or line is blocked, and the oblique light is blocked by the shading elements of the layer to reduce the occurrence of color mixing.

FIG. 25 illustrates a package structure 2500 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2500 of the present embodiment is similar to the package structure 2200 of the previous embodiment, and the main difference is that the present embodiment forms a plurality of light guiding structures over the light-emitting elements 2220-1 and the light-emitting elements 2220-2 after the package is completed. Through hole 2510 to maintain high light output. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, the present embodiment removes the light emitting element 2220-1 and the second package unit 2202-2 and/or the third package unit 2202-3 that may exist above the light emitting element 2220-2 by, for example, laser or chemical etching. To form a through hole 2510. One end of each of the through holes 2510 is connected to the bottom 2224-1 of the corresponding light emitting element 2220-1 or the bottom portion 2224-2 of the light emitting element 2220-2, and exposes the bottom portion 2224-1 of the light emitting element 2220-1 or the light emitting element 2220-2. The bottom portion 2224-2 allows the blue light B emitted from the light-emitting element 2220-1 and the green light G emitted from the light-emitting element 2220-2 to be emitted to the outside through the through hole 2510.

In this embodiment, since the through holes 2510 are formed through the package unit 2202-2 and/or the package unit 2202-3, the materials of the enclosures 2240-2 and 2240-3 are selected to be more flexible, and light transmission or An opaque material.

FIG. 26 illustrates a package structure 2600 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2600 of the embodiment and the package structure of the foregoing embodiment 2500 is similar, and the main difference is that the present embodiment further fills the through hole 2510 with the high refractive index light transmissive material 2520 to thereby form the high refractive index transparent material 2520 and the encapsulant 2240 outside the through hole 2510. 2. The total reflection generated by 2240-3 realizes the effect of the optical waveguide, and transmits the blue light B emitted from the light-emitting element 2220-1 and the green light G emitted from the light-emitting element 2220-2. Here, the refractive index of the light transmissive material 2520 is greater than the refractive indices of the encapsulants 2240-2, 2240-3. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

FIG. 27 illustrates a package structure 2700 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2700 of the present embodiment is similar to the package structure 2500 of the previous embodiment, and the main difference is that the inner wall of the through hole 2510 covers the reflective material 2530 such as metal to reflect on the through hole 2510 by the reflective material 2530. The blue light B emitted from the light-emitting element 2220-1 and the green light G emitted from the light-emitting element 2220-2. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

FIG. 28 illustrates a package structure 2800 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2800 of the present embodiment is similar to the package structure 2500, 2600 or 2700 of the foregoing embodiment, and the main difference is that the present embodiment further forms a cladding layer 2810 on the third package unit 2202-3, and the light guiding structure is made. For example, the through hole 2510, the high refractive index light transmissive material 2520 (please refer to FIG. 26), the reflective material 2530 (please refer to FIG. 27), and the like are passed through the batch coating 2810. Similarly, the light-emitting element 2220-3 can also be above To form a similar light guiding structure. In this manner, the light-emitting angles of the respective light-emitting elements 2220-1, 2220-2, and 2220-3 are restrained to improve the overall light-emitting quality. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

FIG. 29 illustrates a package structure 2900 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 2900 of the present embodiment is similar to the package structure 2200 of the previous embodiment, and the main difference is that the package structure 2900 of the present embodiment further includes a black matrix layer 2910 disposed on the third package unit 2202-3 and black. The matrix layer 2910 has a plurality of light transmissive regions 2912 corresponding to the light emitting elements 2220-1, 2220-2, 2220-3, respectively, to define a plurality of pixel regions on the full color display surface. Here, the black matrix layer 2910 is, for example, a transparent cover plate having a black light-shielding region formed on its surface. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

FIG. 30 illustrates a package structure 3000 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar elements in the embodiment, or the elements that have been clearly described are omitted. Therefore, the related description of the elements can be referred to the foregoing embodiment, and the present embodiment and the foregoing The main differences of the embodiments are explained.

In the present embodiment, the light-emitting elements 2220-1, 2220-2, and 2220-3 are, for example, vertical light-emitting diodes. More specifically, the light-emitting element 2220-1 is in addition to the bit In addition to the first electrode 2226-1 of the top portion 2222-1, a second electrode 2228-1 at the bottom portion 2224-1 is further included, wherein the first electrode 2226-1 is, for example, a P pole of the light emitting diode, and the first The two electrodes 2228-1 are, for example, N poles of the light emitting diode. The light-emitting element 2220-2 includes a second electrode 2228-2 at the bottom portion 2224-2 in addition to the first electrode 2226-2 at the top portion 2222-2, wherein the first electrode 2226-2 is, for example, a light-emitting diode. The P pole, and the second electrode 2228-2 is, for example, the N pole of the light emitting diode. In addition, the light-emitting element 2220-3 includes a second electrode 2228-3 at the bottom portion 2224-3 in addition to the first electrode 2226-3 at the top portion 2222-3, wherein the first electrode 2226-3 is, for example, a light-emitting diode The P pole of the polar body, and the second electrode 2228-3 is, for example, the N pole of the light emitting diode.

In this embodiment, after the epitaxial substrate 2221-1 of the first package unit 2202-1 is removed (please refer to FIG. 23A), the second circuit layer 2256-1 is formed on the encapsulation body 2240-1. The second circuit layer 2256-1 is connected in series with the second electrode 2228-1 to form a common N-pole design. Alternatively, after removing the epitaxial substrate (not shown) of the second package unit 2202-2, the second circuit layer 2256-2 is formed on the encapsulation 2240-2 to be separated by the second circuit layer 2256. -2 is connected in series with the second electrode 2228-2 to form a common N-pole design. Alternatively, after the epitaxial substrate (not shown) of the third package unit 2202-3 is removed, the second circuit layer 2256-3 is formed on the encapsulation 2240-3 to form the second circuit layer. 2256-3 is connected in series with the second electrode 2228-3 to form a common N-pole design. Here, the second wiring layer 2256-1, 2256-2 or 2256-3 is, for example, a metal (such as gold, copper, aluminum, chromium, titanium, etc.) or a metal oxide (such as indium tin oxide or indium zinc oxide). A conductive layer formed.

In addition, the package structure of the present embodiment further includes insulating layers 3010 and 3020 disposed between the encapsulants 2240-1 and 2240-2 and the encapsulants 2240-2 and 2240-3, respectively, for isolating the corresponding Two circuit layers 2256-1, 2256-2 and other interconnect structures.

FIG. 31 illustrates a package structure 3100 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 3100 of the present embodiment is similar to the package structure 3000 of the previous embodiment, and the main difference is that the light-emitting elements 2220-1, 2220-2, and 2220-3 of the package structure 3100 of the present embodiment are horizontal light-emitting diodes. .

As shown in FIG. 31, the top portion 2222-1 of the light-emitting element 2220-1 of the present embodiment has a first electrode 2226-1 and a second electrode 2228-1, and the first electrode 2226-1 and the second electrode 2228-1 respectively The conductive bumps 2230-1 are electrically connected to the corresponding first circuit layer 2252-1. The top portion 2222-2 of the light-emitting element 2220-2 has a first electrode 2226-2 and a second electrode 2228-2, and the first electrode 2226-2 and the second electrode 2228-2 are electrically connected by the conductive bump 2230-2, respectively. Connected to the corresponding first circuit layer 2252-2. The top portion 2222-3 of the light emitting element 2220-3 has a first electrode 2226-3 and a second electrode 2228-3, and the first electrode 2226-3 and the second electrode 2228-3 are electrically connected by the conductive bump 2230-3, respectively. Connected to the corresponding first circuit layer 2252-3.

FIG. 32 illustrates a package structure 3200 of a light emitting device in accordance with an embodiment of the present disclosure. This embodiment adopts the same component symbols as those of the foregoing embodiment to represent The same or similar components are omitted, or the components that have been clearly described are omitted. Therefore, the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 3200 of the present embodiment is similar to the package structure 2200 of the previous embodiment, and the main difference is that the package structure 3200 of the present embodiment further includes a heat sink 3210 disposed on the back surface 2214 of the carrier 2210 to support the heat sink 3210. To provide a good heat dissipation effect on the package structure 3200.

FIG. 33 illustrates a package structure 3300 of a light-emitting element that can realize full color display according to an embodiment of the present disclosure. In the present embodiment, after the package unit having the light-emitting element array is formed by a flip chip bonding technique, a plurality of package units are bonded in a lamination manner. For example, package units having light-emitting elements of different colors such as red, green, and blue may be stacked to form a full-color microdisplay. Each package unit itself has an interconnect structure and is electrically connected to each other by an interconnect structure. The package structure of the light-emitting element proposed by the disclosure has a simple and rapid process and is suitable for mass production. At the same time, the disclosure can also propose solutions for optical quality issues such as light guiding and light mixing.

As shown in FIG. 33, the package structure 3300 of the light-emitting element according to the present disclosure includes a plurality of package units 3302, a plurality of first conductive bumps 3360, and an adhesive layer 3370. The plurality of package units 3302 are stacked on each other, and each package unit 3302 includes an envelope 3340, a plurality of light-emitting elements 3320, and a line structure 3350. The encapsulation 3340 has a first surface 3342 and an opposite second surface 3344, wherein the upper encapsulation 3340 is bonded to the second surface 3344 of the encapsulation 3340 of the other encapsulation unit 3302 of the lower layer by the first surface 3342. . Light-emitting elements 3320 are arranged in an array The first surface 3342 of the corresponding encapsulant 3340 is buried. Each of the light-emitting elements 3320 includes a top portion 3322 and a bottom portion 3324 opposite the top portion 3322, and the first surface 3342 of the envelope body 3340 is coplanar with the bottom portion 3324 of each of the light-emitting elements 3320. The line structure 3350 is disposed within the enclosure 3340 or the second surface 3344 of the enclosure 3340. The plurality of first conductive bumps 3360 are disposed between the adjacent two package units 3302 and electrically connected to the circuit structure 3350 of the two package units 3302. The adhesive layer 3370 is disposed between the adjacent two package units 3302 and covers the first conductive bumps 3360.

In this embodiment, the light-emitting elements 3320 of the package units 3302 are, for example, a plurality of light-emitting diodes fabricated on the same epitaxial substrate, and the light-emitting elements 3320 of the different package units 3302 are adapted to emit light of different colors.

More specifically, as shown in FIG. 33, the package structure 3300 of the present embodiment includes a first package unit 3302-1, a second package unit 3302-2, and a third package unit 3302-3 stacked on each other. The plurality of light-emitting elements 3320-1 of the first package unit 3302-1 are, for example, a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate, for example, light-emitting diodes that emit blue light B toward the upper side of the drawing. The plurality of light-emitting elements 3320-2 of the second package unit 3302-2 are, for example, a plurality of second color light-emitting diodes fabricated on the same epitaxial substrate, for example, a light-emitting diode that emits green light G toward the upper side of the drawing. . The plurality of light-emitting elements 3320-3 of the third package unit 3302-3 are, for example, a plurality of third color light-emitting diodes fabricated on the same epitaxial substrate, for example, a light-emitting diode that emits red light R upward. .

The light-emitting elements 3320-1, 3320-2, and 3320-3 of the present embodiment are horizontal Light-emitting diode. In other words, the top portion 3322-1 of the light-emitting element 3320-1 has the first electrode 3326-1 and the second electrode 3328-1, and the first electrode 3326-1 and the second electrode 3328-1 are electrically connected to the corresponding line structures, respectively. 3350. Further, the bottom portion 3324-1 of the light-emitting element 3320-1 covers the insulating layer 3305 to prevent the bottom portion 3324-1 of the light-emitting element 3320-1 from being short-circuited with the wiring structure 3350. The top portion 3322-2 of the light-emitting element 3320-2 has a first electrode 3326-2 and a second electrode 3328-2, and the first electrode 3326-2 and the second electrode 3328-2 are electrically connected to the corresponding line structure 3350, respectively. In addition, the bottom portion 3324-2 of the light-emitting element 3320-2 covers the insulating layer 3305 to prevent the bottom portion 3324-2 of the light-emitting element 3320-2 from being short-circuited with the line structure 3350. The top portion 3322-3 of the light-emitting element 3320-3 has a first electrode 3326-3 and a second electrode 3328-3, and the first electrode 3326-3 and the second electrode 3328-3 are electrically connected to the corresponding line structure 3350, respectively. Further, the bottom portion 3324-3 of the light-emitting element 3320-3 covers the insulating layer 3305 to prevent the bottom portion 3324-3 of the light-emitting element 3320-3 from being short-circuited with the wiring structure 3350.

In this embodiment, the insulating layer 3305 may be fabricated in an additional process, or a non-implanting layer may be formed in the epitaxial process of the light-emitting elements 3320-1, 3320-2, and 3320-3 as the insulating layer 3305. .

34A-34G illustrate a packaging process of the package structure 3300 of FIG. First, as shown in FIG. 34A, an epitaxial substrate 3321-1 is provided, and the epitaxial substrate 3321-1 has a plurality of light-emitting elements 3320-1 formed by an epitaxial process. And, as shown in FIG. 34B, a layer of non-conductive layer is overlaid on the epitaxial substrate 3321-1 to form an encapsulation body 3340-1, and the encapsulation body 3340-1 is removed by laser or etching to Encapsulation A through hole 3349-1 is formed in the body 3340-1. The through hole 3349-1 may expose a portion of the light emitting element 3320-1 or penetrate the envelope 3340-1. Here, the non-conductive layer is, for example, a non-conductive film, an underfill or an ultraviolet glue (UV glue).

Next, as shown in FIG. 34C, a conductive material (for example, copper) is filled in the via hole 3349-1 and a circuit is formed on the second surface 3344-1 of the encapsulant 3340-1 to form a wiring structure 3350. Thereafter, as shown in FIG. 34D, the epitaxial substrate 3321-1 is removed by a Lift-off technique, and an insulating layer 3305 may be formed at the bottom 3324-1 of the light-emitting element 3320-1. So far, the first package unit 3302-1 of the lowermost layer can be formed.

Then, as shown in FIG. 34E, the foregoing steps of FIGS. 34A to 34D may be repeated to form a second package unit 3302-2 and a third package unit 3302-3. Also, the first conductive bumps 3360 may be formed at appropriate positions of the first package unit 3302-1, the second package unit 3302-2, and the third package unit 3302-3. Then, as shown in FIG. 34F, the first package unit 3302-1, the second package unit 3302-2, and the third package unit 3302-3 are stacked to be electrically connected to each other by the first conductive bumps 3360. Moreover, an adhesive layer 3370 is formed between the first package unit 3302-1 and the second package unit 3302-2, and between the second package unit 3302-2 and the third package unit 3302-3, so that the adhesive layer 3370 is covered. First conductive bump 3360. So far, the fabrication of the package structure 3300 of the present embodiment has been substantially completed.

In addition, in order to connect the package structure 3300 to an external circuit, as shown in FIG. 34G, a line structure 3350 may be formed on the top or bottom of the package structure 3300. Second conductive bumps 3380 electrically connected to each other.

35A to 35C illustrate the light-emitting elements 3320-1 of the first package unit 3302-1, the light-emitting elements 3320-2 of the second package unit 3302-2, and the light-emitting elements 3320-3 of the third package unit 3302-3, respectively. Vertical projection on a plane in the direction of light exit. 35A to 35C, the vertical projections of the light-emitting elements 3320-1, the light-emitting elements 3320-2, and the light-emitting elements 3320-3 on the plane are interlaced with each other and do not overlap each other to form an array of one side. Thereby, the light emitted by the lower layer light-emitting element in the vertical direction can be blocked by the light-shielding elements of other layers (such as contacts or lines), and the oblique light output can be blocked by the light-shielding elements of the other layer to reduce the color mixture. occur.

Of course, in other embodiments, since the size of the light-emitting elements 3320-1, 3320-2, and 3320-3 is very small (about 3 um), the influence on the light output after lamination is limited, and therefore, the first package unit 3302-1 The light-emitting element 3320-1, the light-emitting element 3320-2 of the second package unit 3302-2, and the light-emitting element 3320-3 of the third package unit 3302-3 may also have the same layout, that is, aligned with each other in the vertical direction. And the vertical projections on the plane partially overlap or completely overlap.

FIG. 36 illustrates a package structure 3600 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 3600 of the present embodiment is similar to the package structure 3300 of the previous embodiment, and the main difference is that after the fabrication of the package structure 3300 is completed, the package structure 3300 is bonded to the carrier by the second conductive bumps 3380. 3310.

In the present embodiment, the light-emitting elements 3320-1, 3320-2, and 3320-3 are top-emitting type light-emitting diodes. That is, the light-emitting direction of the light-emitting element 3320-1 is the same as that of the first electrode 3326-1 and the second electrode 3328-1, and the light-emitting direction of the light-emitting element 3320-2 is opposite to the first electrode 3326-2 and the second electrode 3328-2. In the same direction, the light-emitting direction of the light-emitting element 3320-3 is in the same direction as the first electrode 3326-3 and the second electrode 3328-3. Therefore, the first surface 3342 of each of the encapsulants 3340 faces the carrier 3310, and the line structure 3350 of the lowermost encapsulant 3340 is electrically connected to the carrier 3310 via the second conductive bumps 3380. Here, the carrier 3310 is, for example, a semiconductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving IC including an electronic circuit.

FIG. 37 illustrates a package structure 3700 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 3700 of the present embodiment is similar to the package structure 3600 of the previous embodiment, with the main difference being that the light-emitting directions of the two are opposite.

More specifically, the light-emitting elements 3320-1, 3320-2, and 3320-3 of the present embodiment are bottom-emitting type light-emitting diodes. That is, the light-emitting direction of the light-emitting element 3320-1 is opposite to the first electrode 3326-1 and the second electrode 3328-1, and the light-emitting direction of the light-emitting element 3320-2 is opposite to the first electrode 3326-2 and the second electrode 3328-2. In the opposite direction, the light-emitting direction of the light-emitting element 3320-3 is opposite to the first electrode 3326-3 and the second electrode 3328-3. Therefore, the second surface 3344 of each of the encapsulants 3340 faces the carrier 3310, which The wiring structure 3350 of the lowermost encapsulation 3340 is electrically connected to the carrier 3310 via the second conductive bumps 3380. Here, the carrier 3310 is, for example, a semiconductor substrate, a glass substrate, a wiring substrate, or other suitable types of substrates, wherein the semiconductor substrate may also be a driving IC including an electronic circuit.

FIG. 38 illustrates a package structure 3800 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 3800 of the present embodiment is similar to the package structure 3300 of the foregoing embodiment, and the main difference is that the present embodiment retains and does not remove the epitaxial substrate 3321-1 when the lowermost first package unit 3302-1 is fabricated. The structure is preferably supported by the epitaxial substrate 3321-1 in a subsequent process. At the same time, the epitaxial substrate 3321-1 can also protect the light-emitting element 3320-1.

FIG. 39 illustrates a package structure 3900 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar elements in the embodiment, or the elements that have been clearly described are omitted. Therefore, the related description of the elements can be referred to the foregoing embodiment, and the present embodiment and the foregoing The main differences of the embodiments are explained. The package structure 3900 of the present embodiment is similar to the package structure 3300 of the previous embodiment, and the main difference is that the light-emitting elements 3320-1, 3320-2, and 3320-3 of the present embodiment are vertical light-emitting diodes.

More specifically, the light-emitting element 3320-1 includes a first electrode 3326-1 at the top 3322-1 and a second electrode 3328-1 at the bottom 3324-1, wherein the first The electrode 3326-1 is, for example, the P pole of the light emitting diode, and the second electrode 3328-1 is, for example, the N pole of the light emitting diode. The light-emitting element 3320-2 includes a first electrode 3326-2 at the top portion 3322-2 and a second electrode 3328-2 at the bottom portion 3324-2, wherein the first electrode 3326-2 is, for example, a P-pole of the light-emitting diode, and The second electrode 3328-2 is, for example, an N pole of a light emitting diode. Further, the light-emitting element 3320-3 includes a first electrode 3326-3 at the top 3322-3 and a second electrode 3328-3 at the bottom portion 3324-3, wherein the first electrode 3326-3 is, for example, a P-pole of the light-emitting diode And the second electrode 3328-3 is, for example, an N pole of the light emitting diode.

FIG. 40 illustrates a package structure 4000 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 4000 of the present embodiment is similar to the package structure 3300 of the foregoing embodiment, and the main difference is that the present embodiment is formed as a light guiding structure over the light-emitting elements 3320-1, 3320-2, and 3320-3 after the package is completed. A plurality of through holes 4010 are provided to maintain a high light extraction rate. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, the present embodiment removes the encapsulant 3340 and the adhesive layer 3370 that may exist above the light-emitting elements 3320-1, 3320-2, 3320-3 by, for example, laser or chemical etching to form the vias 4010. One end of each of the through holes 4010 is connected and exposes the top 3322-1 of the corresponding light emitting element 3320-1, the top 3322-2 of the light emitting element 3320-2, or the top 3322-3 of the light emitting element 3320-3, so that the light emitting element 3320- The blue light B emitted by the light, the green light G emitted from the light-emitting element 3320-2, and the red light R emitted from the light-emitting element 3320-3 can be emitted to the outside through the through hole 4010.

In the present embodiment, since the through holes 4010 penetrating the envelope 3340 and the adhesive layer 3370 are formed, the material of the encapsulant 3340 and the adhesive layer 3370 is selected to have high elasticity, and a material that transmits light or is opaque can be used.

FIG. 41 illustrates a package structure 4100 of a light emitting device in accordance with an embodiment of the present disclosure. The package structure 4100 of the present embodiment is similar to the package structure 4000 of the previous embodiment, and the main difference is that the light-emitting directions of the two are opposite, so the position of the through-holes to be formed also needs to be adjusted accordingly. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again.

More specifically, the present embodiment removes the encapsulant 3340 and the adhesive layer 3370 which may exist above the light-emitting elements 3320-2, 3320-3 by, for example, laser or chemical etching to form the vias 4110. One end of each of the through holes 4110 is connected and exposes the bottom portion 3324-2 of the corresponding light emitting element 3320-2 or the bottom portion 3324-3 of the light emitting element 3320-3, such that the green light G emitted by the light emitting element 3320-2 and the light emitting element 3320- The red light R emitted by 3 can be emitted to the outside through the through hole 4110.

FIG. 42 illustrates a package structure 4200 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 4200 of the present embodiment is similar to the package structure 4000 of the previous embodiment, and the main difference is that the present embodiment further fills the through-hole 4010 with a high refractive index light transmissive material 4020 to thereby pass through the high refractive index. The light material 4020 is generated from the encapsulant 3340 outside the through hole 4010. The total reflection realizes the effect of the optical waveguide, and transmits the blue light B emitted from the light-emitting element 3320-1, the green light G emitted from the light-emitting element 3320-2, and the red light R emitted from the light-emitting element 3320-3. Here, the refractive index of the light transmissive material 4020 is greater than the refractive index of the encapsulant 3340.

Of course, the package structure 4100 shown in FIG. 41 can also adopt the design of the embodiment, and the light-transmitting material 4020 is filled in the through hole 4010 to achieve a similar effect.

FIG. 43 illustrates a package structure 4300 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 4300 of the present embodiment is similar to the package structure 4000 of the previous embodiment, and the main difference is that the inner wall of the through hole 4010 covers the reflective material 4030 such as metal to reflect on the through hole 4010 by the reflective material 4030. The blue light B emitted from the light-emitting element 3320-1 transmitted therein, the green light G emitted from the light-emitting element 3320-2, and the red light R emitted from the light-emitting element 3320-3.

Of course, the package structure 4100 shown in FIG. 41 can also adopt the design of the embodiment, and the inner wall of the through hole 4010 is covered with a reflective material 4030 such as metal to achieve a similar effect.

FIG. 44 illustrates a package structure 4400 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 4400 of the present embodiment is similar to the package structure 4000, 4200 or 4300 of the previous embodiment. The main difference is that the present embodiment further forms a cladding layer 4410 on the third package unit 3302-3, and makes the light guiding structure, such as the through hole 4010, the high refractive index light transmissive material 4020 (please refer to FIG. 42), The reflective material 4030 (please refer to FIG. 42) or the like penetrates the batch layer 4410. In this manner, the light-emitting angles of the respective light-emitting elements 3320-1, 3320-2, and 3320-3 are restrained to improve the overall light-emitting quality.

FIG. 45 illustrates a package structure 4500 of a light emitting device in accordance with an embodiment of the present disclosure. The same reference numerals are used to designate the same or similar components, or the components that have been clearly described are omitted, and the related description of the components can be referred to the foregoing embodiments, and details are not described herein again. The package structure 4500 of the present embodiment is similar to the package structure 3300 of the previous embodiment, and the main difference is that the package structure 4500 of the present embodiment further includes a black matrix layer 4510 disposed on the third package unit 3302-3 and black. The matrix layer 4510 has a plurality of light transmissive regions 4512 corresponding to the light emitting elements 3320-1, 3320-2, and 3320-3, respectively, to define a plurality of pixel regions on the full color display surface. Here, the black matrix layer 4510 is, for example, a transparent cover plate having a black light-shielding region formed on its surface.

In summary, the present disclosure proposes a package structure and a process for a plurality of light-emitting elements, which can realize a low process temperature, is compatible with a thin line process, and has a simple and fast packaging process, and is suitable for mass production. Although the foregoing various embodiments have been described by taking two or three colors of light-emitting diodes as an example, the present invention does not limit the number of colors of the light-emitting diodes. For example, it is more likely to include four color or five color LEDs to meet different light-emitting requirements.

Although the disclosure has been disclosed above by way of example, it is not intended to limit the present. It is to be understood that those skilled in the art will be able to make a few changes and modifications without departing from the spirit and scope of the disclosure, and the scope of the disclosure is defined by the scope of the appended claims. quasi.

100‧‧‧Package structure

110‧‧‧ Carrier Board

112‧‧‧ bearing surface

114‧‧‧Electrode contacts

120‧‧‧Lighting elements

122‧‧‧Top of the light-emitting element

124‧‧‧Bottom of the light-emitting element

126‧‧‧first electrode

129‧‧‧Side side of the light-emitting element

130‧‧‧ anisotropic conductive film

132‧‧‧Insulator

134‧‧‧ conductive particles

140‧‧‧ epitaxial substrate

Claims (76)

A package structure of a light-emitting element, comprising: a carrier plate having a bearing surface and a plurality of electrode contacts disposed on the bearing surface; a plurality of light-emitting elements arranged in an array and disposed above the bearing surface, each of the The light-emitting elements include a top portion facing the carrier, a bottom portion opposite to the top portion, and a first electrode at the top portion; and an anisotropic conductive film (ACF) disposed on the bearing surface And covering at least the electrode contacts, the top portion of each of the light-emitting elements, the first electrode, and a portion of each of the light-emitting elements, the anisotropic conductive film includes an insulator and a body located in the insulator And a plurality of conductive particles, and the first electrodes of each of the light-emitting elements are electrically connected to the corresponding electrode contacts by the conductive particles. The package structure of the light-emitting element according to claim 1, wherein the bottom of each of the light-emitting elements is coplanar. The package structure of the light-emitting element according to claim 1, wherein the anisotropic conductive film exposes the bottom of each of the light-emitting elements. The package structure of the light-emitting element according to claim 1, wherein a first surface of the anisotropic conductive film is coplanar with the bottom of each of the light-emitting elements. The package structure of the light-emitting device of claim 1, further comprising a substrate disposed on the anisotropic conductive film and covering the bottom of each of the light-emitting elements. The package structure of the light-emitting device of claim 1, further comprising a circuit layer disposed on the anisotropic conductive film and the light-emitting elements, each of the light-emitting elements further comprising a second electrode The bottom layer, and the circuit layer is connected in series with the second electrodes of the light-emitting elements. The package structure of the light-emitting device of claim 1, wherein each of the light-emitting elements further includes a second electrode at the top, and the first electrode and the second electrode of each of the light-emitting elements The conductive particles are electrically connected to the corresponding electrode contacts respectively. The package structure of the light-emitting element according to claim 1, wherein the light-emitting elements comprise a plurality of light-emitting diodes fabricated on the same epitaxial substrate. The package structure of the light-emitting element according to claim 1, wherein the light-emitting elements comprise a plurality of first color light-emitting diodes and a plurality of second color light-emitting diodes. The package structure of the light-emitting device of claim 1, wherein the light-emitting elements comprise a first color strip-shaped light-emitting unit and a second color strip-shaped light-emitting unit, wherein the first color strip-shaped light-emitting unit comprises And sequentially connecting the plurality of first color light emitting diodes, wherein the second color strip light emitting unit comprises a plurality of second color light emitting diodes connected in sequence. The package structure of the light-emitting element according to claim 1, wherein the carrier board comprises a semiconductor substrate, a glass substrate, a printed circuit board, or a wiring substrate. A package structure of a light-emitting component, comprising: a first package unit, comprising: a first carrier plate having a first bearing surface and a plurality of first electrode contacts disposed on the first carrier surface; a light emitting element arranged in an array and disposed above the first bearing surface, each of the first light emitting elements including a first top facing the first carrier, a first bottom opposite the first top, and a first electrode located at the first top portion; a plurality of first conductive members electrically connecting the first electrodes of each of the first light emitting elements to the corresponding first electrode contacts; and a first An envelope body disposed on the first bearing surface and covering at least the first electrode contacts, the first top portion of each of the first light emitting elements, the first electrode, and each of the first light emitting portions a first surface of the first encapsulant is coplanar with the first bottom of each of the first illuminating elements; at least one second encapsulating unit is stacked on the first encapsulating unit, The at least one second package unit comprises: a first The carrier plate having a second bearing surface, a back surface with respect to the second supporting surface and a plurality of second electrodes arranged in the contact of the second bearing surface; a plurality of second light-emitting elements arranged in an array and disposed above the second bearing surface, each of the second light-emitting elements including a second top facing the second carrier, and a second portion opposite to the second top a second bottom portion and a third electrode at the second top portion; a plurality of second conductive members electrically connected to the third electrode of each of the second light emitting elements to the corresponding second electrode contacts; a second encapsulating body disposed on the second carrying surface and covering at least the second electrode contacts, the second top portion of each of the second light emitting elements, the third electrode, and each of the plurality of second light emitting elements a side surface of the second light emitting element, and a first surface of the second envelope body is coplanar with the second bottom of each of the second light emitting elements. The package structure of the illuminating device of claim 12, wherein the first package unit further comprises: a first circuit layer disposed on the first bearing surface of the first carrier, and the first The circuit layer is electrically connected to the first electrode contacts. The package structure of the illuminating device of claim 12, wherein the first package unit further comprises: a second circuit layer disposed on the first encapsulant and the first illuminating elements, each The first light emitting elements further include a second electrode located at the first bottom, and the second circuit layer is serially connected to the second electrode of the first light emitting elements. The package structure of the light-emitting element of claim 12, wherein each of the first light-emitting elements further comprises a second electrode located at the first top The first electrode and the second electrode of each of the first light-emitting elements are electrically connected to the corresponding first electrode contacts by the first conductive members. The package structure of the light-emitting element according to claim 12, wherein the first light-emitting elements comprise a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate. The package structure of the illuminating device of claim 12, wherein the at least one second package unit further comprises: a third circuit layer disposed on the second bearing surface of the second carrier, and the The third circuit layer is electrically connected to the second electrode contacts. The package structure of the light-emitting device of claim 12, wherein the at least one second package unit further comprises: a fourth circuit layer disposed on the second envelope and the second light-emitting elements, Each of the second light-emitting elements further includes a fourth electrode located at the second bottom, and the fourth circuit layer is serially connected to the fourth electrode of the second light-emitting elements. The package structure of the light-emitting element of claim 12, wherein each of the second light-emitting elements further comprises a fourth electrode at the second top, and the third of each of the second light-emitting elements The electrodes and the fourth electrode are electrically connected to the corresponding second electrode contacts by the second conductive members. The package structure of the light-emitting element according to claim 12, wherein the second light-emitting elements comprise a plurality of second color light-emitting diodes fabricated on the same epitaxial substrate. The package structure of the light-emitting element of claim 12, wherein the at least one second package unit comprises two second package units stacked on each other, wherein the second light-emitting elements of one of the second package units are included The plurality of second color light emitting diodes formed on the same epitaxial substrate, and the second light emitting elements of the other second package unit comprise a plurality of third color light emitting diodes fabricated on the same epitaxial substrate. The package structure of the light-emitting device of claim 12, further comprising a plurality of light-guiding structures disposed on the respective first light-emitting elements and the second light-emitting elements, each of the light guides One end of the structure is connected to the first bottom of the first first light-emitting elements or the second bottom of the second light-emitting elements, and penetrates the at least one second package unit of the upper layer. The package structure of the light-emitting device of claim 22, wherein each of the light-guiding structures comprises a through hole exposing the corresponding first bottom portion of the first light-emitting element or the second light-emitting element Second bottom. The package structure of the light-emitting device of claim 22, wherein each of the light-guiding structures comprises a through hole and a light transmissive material filled in the through hole, and the refractive index of the light transmissive material is greater than the first The refractive index of the second envelope. The package structure of the light-emitting element of claim 22, wherein each of the light-guiding structures comprises a through hole and a reflective material covering the inner wall of the through hole. The package structure of the light-emitting device of claim 12, further comprising at least one adhesive layer disposed between the adjacent first package unit and the at least one second package unit, or two adjacent Between the at least one second package unit. The package structure of the illuminating device of claim 12, wherein the first package unit further comprises: a first circuit layer disposed on the first bearing surface of the first carrier, the first line The first electrical contact is electrically connected to the first electrode contacts, and the first encapsulant exposes a periphery of the first carrier and a portion of the first circuit layer, and the at least one second package unit further includes: a third a circuit layer disposed on the second carrier surface of the second carrier, the third circuit layer electrically connecting the second electrode contacts, and the second envelope exposing the periphery of the second carrier And a portion of the third circuit layer, and the package structure further includes a plurality of wires electrically connected between the first circuit layer and the third circuit layer, or electrically connected to the corresponding two of the third lines Between the layers. The package structure of the illuminating device of claim 12, wherein the first package unit further comprises: a first circuit layer disposed on the first bearing surface of the first carrier, the first line The layer is electrically connected to the first electrode contacts, and the at least one second package unit further includes: a third circuit layer disposed on the second bearing surface of the second carrier, the third circuit layer is electrically Connecting the second electrode contacts, and the package structure further includes a plurality of via holes, each of the through holes extending through the Having the second carrier of the second package unit and connected between the corresponding third circuit layer and the first light-emitting element below it, or electrically connected to the corresponding third circuit layer and the lower portion thereof Between the second light-emitting elements. The package structure of the light-emitting device of claim 12, further comprising a black matrix layer disposed on the at least one second package unit, wherein the black matrix layer has a plurality of light-transmissive regions, respectively corresponding to The first light emitting elements and the second light emitting elements. The package structure of the light-emitting device of claim 12, wherein the vertical projections of the first light-emitting elements and the second light-emitting elements on the first bearing surface do not overlap each other and are arranged in an array. The package structure of a light-emitting element according to claim 12, wherein the back surface of the second carrier has a plurality of optical microstructures. The package structure of a light-emitting element according to claim 30, wherein the optical microstructures comprise a plurality of microlenses or a plurality of light modulation patterns. The package structure of a light-emitting element according to claim 12, wherein the first carrier comprises a semiconductor substrate, a glass substrate, a printed circuit board, or a circuit substrate. The package structure of the light-emitting element according to claim 12, wherein the second carrier comprises a light-transmitting substrate. The package structure of the light-emitting element according to claim 12, wherein the thickness of the second carrier is less than or equal to the thickness of the first carrier. The package structure of the light-emitting device of claim 12, wherein the first envelope and the first conductive members are respectively a first anisotropic conductive film (ACF) An insulator and a plurality of first conductive particles located in the first insulator, and the second envelope and the second conductive members are respectively a second anisotropic conductive film (ACF) a second insulator and a plurality of second conductive particles located in the second insulator. The package structure of the light-emitting element of claim 12, wherein the first conductive members comprise a plurality of first conductive bumps, and the second conductive members comprise a plurality of second conductive bumps. The package structure of the light-emitting device of claim 12, further comprising a heat sink disposed on a back surface of the first carrier. A package structure of a light-emitting component, comprising: a carrier plate having a bearing surface; a plurality of package units stacked on the carrier surface in sequence, each of the package units having a first surface and an opposite second surface The method includes: a plurality of light emitting elements arranged in an array and buried in the first surface of each of the package units, each of the light emitting elements including a top facing the carrier, a bottom opposite to the top, and a first electrode of the top portion, and the bottom of each of the light emitting elements is coplanar with the first surface of each of the plurality of packaged units; and a plurality of conductive bumps are embedded in each of the plurality of conductive elements The second table of the package unit And an interconnect structure, located in the package unit, the interconnect structure includes: a plurality of first circuit layers disposed between two adjacent package units or adjacent to the load Between the board and the package unit, and electrically connected to the corresponding light-emitting elements by the conductive bumps respectively; and a plurality of via holes, through the corresponding package units, and electrically connected to the corresponding ones Between the first line layers. The package structure of the light-emitting device of claim 39, further comprising: a plurality of second circuit layers respectively disposed on the first surfaces of each of the package units, each of the light-emitting elements The second electrode layer is disposed in the bottom of the second electrode layer, and the second electrode layer is connected in series with the second electrode of the light-emitting elements; and at least one insulating layer is disposed between the two adjacent package units. The corresponding second circuit layer and the interconnect structure are isolated. The package structure of the light-emitting device of claim 39, wherein each of the light-emitting elements further comprises a second electrode at the top, and the first electrode and the second electrode of each of the light-emitting elements They are electrically connected to the corresponding conductive bumps respectively. The package structure of the light-emitting device of claim 39, wherein the light-emitting elements of each of the package units comprise a plurality of light-emitting diodes fabricated on the same epitaxial substrate. The package structure of the light-emitting element according to claim 39, wherein the light-emitting elements of each of the package units emit different colors of light. The package structure of the light-emitting device of claim 39, wherein the package unit comprises a first package unit, a second package unit and a third package unit stacked on each other, wherein the first package unit The light-emitting elements include a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate, and the light-emitting elements of the second package unit include a plurality of second color light-emitting diodes fabricated on another epitaxial substrate In the polar body, the light emitting elements of the third package unit comprise a plurality of third color light emitting diodes fabricated on a further epitaxial substrate. The package structure of the light-emitting device of claim 39, further comprising a plurality of light-guiding structures respectively disposed on the corresponding light-emitting elements, one end of each of the light-guiding structures being connected to each of the light-emitting elements The bottom of the light emitting element and penetrates to the exposed surface of the package unit. The package structure of the light-emitting element of claim 45, wherein each of the light-guiding structures comprises a through hole respectively exposing the bottom of each of the light-emitting elements. The package structure of the light-emitting device of claim 45, wherein each of the light-guiding structures comprises a through hole and a light transmissive material filled in the through hole, and the light transmissive material has a refractive index greater than the package. The refractive index of the structure. The package structure of the light-emitting element of claim 45, wherein each of the light-guiding structures comprises a through hole and a reflective material covering the inner wall of the through hole. The package structure of the light-emitting device of claim 45, further comprising a coating layer disposed on an uppermost surface of the package unit, and each of the light guiding structures further penetrates the batch of layers. The package structure of the light-emitting device of claim 39, further comprising a black matrix layer disposed on the package units, wherein the black matrix layer has a plurality of light-transmissive regions respectively corresponding to the light-emitting regions element. The package structure of the light-emitting element according to claim 39, wherein the vertical projections of the light-emitting elements on the bearing surface do not overlap each other and are arranged in an array on one side. The package structure of a light-emitting element according to claim 39, wherein the carrier board comprises a semiconductor substrate, a glass substrate, a printed circuit board, or a wiring substrate. The package structure of the light-emitting element according to claim 39, further comprising a heat sink disposed on a back surface of the carrier. The package structure of the light-emitting element according to claim 39, further comprising a substrate covering the exposed surface of the package unit. A package structure of a light-emitting element, comprising: a plurality of package units stacked on each other, and each of the package units has a first surface and an opposite second surface, comprising: a plurality of light-emitting elements arranged in an array and embedded Each of the first surface of each of the package units includes a top portion, a bottom portion opposite to the top portion, and a first electrode at the top portion, and each of the plurality of light emitting elements The bottom of the light emitting element is coplanar with the first surface of each of the plurality of packaged units; and a line structure disposed in each of the plurality of package units or the second surface of each of the package units And electrically connected to the corresponding first electrodes; the plurality of first conductive bumps are disposed between the two adjacent package units, and electrically connected to the two adjacent package units The circuit structure; and an adhesive layer disposed between the two adjacent package units and covering the first conductive bumps. The package structure of the light-emitting device of claim 55, further comprising: a carrier plate carrying the package units stacked on each other, and the second surface of each of the package units faces the carrier, wherein The line structure of the lowermost layer of the package units is electrically connected to the carrier board. The package structure of the light-emitting device of claim 56, further comprising: a plurality of second conductive bumps disposed between the carrier and the package units for lowering the package units The line structure is electrically connected to the carrier. The package structure of the light-emitting device of claim 55, further comprising: a carrier plate carrying the package units stacked on each other, and the first surface of each of the package units faces the carrier, wherein The lowermost layer of the package unit The structure is electrically connected to the carrier. The package structure of the light-emitting device of claim 58, further comprising: a plurality of second conductive bumps disposed between the carrier and the package units for lowering the package units The line structure is electrically connected to the carrier. The package structure of the light-emitting device of claim 55, further comprising: a substrate carrying the package units stacked on each other, and the first surface of the lowermost layer of the package units is attached to the substrate. The package structure of the light-emitting element of claim 55, wherein each of the light-emitting elements further comprises a second electrode at the bottom and electrically connected to the corresponding line structure. The package structure of the light-emitting element of claim 55, wherein each of the light-emitting elements further comprises a second electrode located at the top portion and electrically connected to the corresponding line structure. The package structure of the light-emitting device of claim 55, wherein the light-emitting elements of each of the package units comprise a plurality of light-emitting diodes fabricated on the same epitaxial substrate. The package structure of the light-emitting element of claim 55, wherein the light-emitting elements of each of the package units emit different colors of light. The package structure of the light-emitting device of claim 55, wherein the package units comprise a first package unit and a second package stacked on each other And the third package unit, wherein the light-emitting elements of the first package unit comprise a plurality of first color light-emitting diodes fabricated on the same epitaxial substrate, and the light-emitting elements of the second package unit are included And a plurality of second color light emitting diodes formed on the other epitaxial substrate, wherein the light emitting elements of the third package unit comprise a plurality of third color light emitting diodes fabricated on the further epitaxial substrate. The package structure of the light-emitting device of claim 55, further comprising a plurality of light-guiding structures, each of the light-emitting elements having a light-emitting direction, and one end of each of the light-guiding structures is connected to each of the light-emitting elements The light-emitting elements penetrate through the surface of the package units in the light-emitting direction. The package structure of the light-emitting element of claim 66, wherein each of the light-emitting elements emits light from the top, and one end of each of the light-guiding structures is connected to the top of each of the light-emitting elements. The package structure of the light-emitting element of claim 66, wherein each of the light-emitting elements emits light from the bottom, and one end of each of the light-guiding structures is connected to the bottom of each of the light-emitting elements. The package structure of the light-emitting element of claim 66, wherein each of the light-guiding structures comprises a through hole exposing each of the light-emitting elements. The package structure of the light-emitting device of claim 66, wherein each of the light-guiding structures comprises a through hole and a light transmissive material filled in the through hole, and the light transmissive material has a refractive index greater than the package The refractive index of the structure. The package structure of the light-emitting element of claim 66, wherein each of the light-guiding structures comprises a through hole and a reflective material covering the inner wall of the through hole. The package structure of the light-emitting device of claim 66, further comprising a coating layer disposed on an uppermost surface of the package unit, and each of the light guiding structures further penetrates the coating layer. The package structure of the light-emitting device of claim 55, further comprising a black matrix layer disposed on the package units, wherein the black matrix layer has a plurality of light-transmissive regions respectively corresponding to the light-emitting regions element. The package structure of the light-emitting element according to claim 55, wherein the vertical projections of the light-emitting elements on the bearing surface do not overlap each other and are arranged in an array on one side. The package structure of a light-emitting element according to claim 55, wherein the carrier board comprises a semiconductor substrate, a glass substrate or a wiring substrate. The package structure of the light-emitting element of claim 55, wherein each of the light-emitting elements further comprises an insulating layer at the bottom.