TW201619999A - Multifunctional protection device and electronic device - Google Patents

Multifunctional protection device and electronic device Download PDF

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Publication number
TW201619999A
TW201619999A TW103141170A TW103141170A TW201619999A TW 201619999 A TW201619999 A TW 201619999A TW 103141170 A TW103141170 A TW 103141170A TW 103141170 A TW103141170 A TW 103141170A TW 201619999 A TW201619999 A TW 201619999A
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upper electrode
electrode
substrate
disposed
protection device
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TW103141170A
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Chinese (zh)
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陳莎莉
陳聰文
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陳莎莉
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

A multifunctional protection device includes a substrate, an upper electrode, a lower electrode, a heat generating assembly, and at least a fusible conductor. The upper electrode is provided on the substrate, and includes a first upper electrode and a second upper electrode. The lower electrode is provided on the substrate, and includes a third lower electrode. The heat generating assembly is provided on the substrate. One end of the heat generating assembly is electrically connected to the second upper electrode. The other end is electrically connected to the third lower electrode. The fusible conductor is electrically connected to the first upper electrode and second upper electrode. The multifunctional protection device of the invention can provide variety of protection functions such as composite protection functions for combination of over current, over voltage, and over temperature.

Description

多功能保護裝置與電子裝置 Multi-function protection device and electronic device

本發明是有關於一種多功能保護裝置,特別是應用於行動電子產品中二次電池組或電子元件的保護元件,與主電路配合設計可用來防止如過電流、過電壓以及過溫等組合的多項保護功能。 The invention relates to a multifunctional protection device, in particular to a protection element of a secondary battery pack or an electronic component in a mobile electronic product, which is designed to prevent combinations such as overcurrent, overvoltage and overtemperature. Multiple protection features.

習知的保護元件如台灣專利證書號:TW I385695B1、TW I385696B1、TW I452592B、TW I456617B、TW I456618B等所提出一種保護元件,該保護元件大部分的結構包含一基板;上電極;中間電極(或第一延伸部);下電極;連接上與下電極的端電極以及連接下電極與中間電極(或第一延伸部)的端電極;金屬塊;以及加熱器(發熱電阻)來設計相關的保護元件,其等效電路使用兩個熔絲元件(或保險絲元件)串聯與一加熱器(發熱電阻)來組成,該保護元件是將加熱器設計在基板的下表面,問題一:當過電壓事件發生時,加熱器發熱,基板的厚度愈厚則熱阻愈大,其次才是基板材料的導熱率,絕緣材質的導熱率都不佳,若要導熱率高一些的材料則成本大幅提升,且導熱率仍低於金屬材料很多,因此如何將加熱器產生的熱快速且集中的傳導至上表面的中間電極或第一延伸部,又不會均勻地擴散到基板內或其他電極,所以有的基板加了一些絕緣層或低導熱部,或在基板內的材料分成高導熱率與低導熱部的設計,為了讓加熱器產生的熱能快速且集中地將熱傳到中間電極或第一延伸部,基板結構過於複雜且成本增 加許多,問題二:因加熱器在基板的下表面,須經由下電極、側電極、上電極或中間電極或第一延伸部連接金屬塊,因下電極、側電極、上電極或中間電極或第一延伸部都外露在基板表面,且特別是側電極(或端電極)最容易受外在溫度的影響,或容易散失熱能,使加熱器產生的熱需更多的時間或更多的熱能才能熔斷金屬塊,也就是保護元件之保護動作的時間變長或慢。問題三:當保護元件需求的額定電流增大時,勢必需加大金屬塊或低熔點金屬的截面積,也就是金屬塊或低熔點金屬的厚度需增加,如此加熱器所需產生的熱能就更難快速的熔斷金屬塊或低熔點金屬,甚至使保護元件的功能失效。 A conventional protective element such as Taiwan Patent No. TW I385695B1, TW I385696B1, TW I452592B, TW I456617B, TW I456618B, etc., has a protective element, most of which comprises a substrate; an upper electrode; an intermediate electrode (or a first extension; a lower electrode; a terminal electrode connecting the upper and lower electrodes; and a terminal electrode connecting the lower electrode and the intermediate electrode (or the first extension); a metal block; and a heater (heating resistor) to design related protection The component, its equivalent circuit is composed of two fuse elements (or fuse elements) connected in series with a heater (heating resistor), which is designed to design the heater on the lower surface of the substrate. Problem 1: When an overvoltage event occurs When it occurs, the heater heats up. The thicker the thickness of the substrate, the higher the thermal resistance. The second is the thermal conductivity of the substrate material. The thermal conductivity of the insulating material is not good. If the material with higher thermal conductivity is higher, the cost is greatly increased. The thermal conductivity is still much lower than that of the metal material, so how to quickly and concentratedly transfer the heat generated by the heater to the intermediate electrode or the first extension of the upper surface is not uniform Diffusion into the substrate or other electrodes, so some substrates are added with some insulating layer or low thermal conductivity, or the material in the substrate is divided into high thermal conductivity and low thermal conductivity design, in order to make the heat generated by the heater fast and concentrated Passing heat to the middle electrode or the first extension, the substrate structure is too complicated and costly Add a lot, problem two: because the heater is on the lower surface of the substrate, the metal block must be connected via the lower electrode, the side electrode, the upper electrode or the intermediate electrode or the first extension, because the lower electrode, the side electrode, the upper electrode or the middle electrode or The first extension is exposed on the surface of the substrate, and in particular, the side electrode (or the terminal electrode) is most susceptible to external temperature, or is easily lost in thermal energy, so that the heat generated by the heater requires more time or more heat. In order to melt the metal block, that is, the protection action of the protection element becomes longer or slower. Question 3: When the rated current required by the protection component increases, it is necessary to increase the cross-sectional area of the metal block or the low melting point metal, that is, the thickness of the metal block or the low melting point metal needs to be increased, so that the heat energy required by the heater is It is more difficult to quickly break the metal block or the low melting point metal, and even disable the function of the protective element.

本發明為了解決加熱器設計在第二表面或下表面,基板熱傳導不佳,無法集中到中間電極(或第一延伸部)的問題以及電氣連接加熱器與中間電極(或第一延伸部)的側電極外露在基板側表面,加熱器產生的熱在傳遞的路經容易受外在環境溫度的影響或熱流失的問題,以及一樣厚度的低熔點金屬或金屬塊,增加了加熱器熔斷低熔點金屬或金屬塊的時間,甚至無法熔斷的問題。又,本發明為提供更多樣的選擇,本發明之多功能保護裝置的可熔導體與上電極的設計可分為兩種,第一種是其等效電路包含一保險絲(Fuse)元件,可熔導體只電氣連接第一上電極與第二上電極(沒有中間電極或第一延伸部)。第二種是其等效電路包含兩串聯的保險絲(Fuse)元件,可熔導體電氣連接第一上電極、集熱電極與第二上電極,且集熱電極配置在基板內並延伸至第一上電極與第二上電極之間的基板上,讓應用電路的 設計者可依實際需要選擇本發明多樣選擇的多功能保護裝置。 The present invention solves the problem of poor heat conduction of the substrate, the inability to concentrate to the intermediate electrode (or the first extension), and the electrical connection of the heater and the intermediate electrode (or the first extension) in order to solve the problem that the heater is designed on the second surface or the lower surface. The side electrode is exposed on the side surface of the substrate, the heat generated by the heater is easily affected by the external ambient temperature or the heat loss problem, and the low-melting metal or metal block of the same thickness increases the melting point of the heater. The time of metal or metal block can't even be blown. Moreover, the present invention provides a variety of options. The design of the fusible conductor and the upper electrode of the multifunctional protection device of the present invention can be divided into two types. The first one is that the equivalent circuit includes a fuse element. The fusible conductor only electrically connects the first upper electrode and the second upper electrode (without the intermediate electrode or the first extension). The second type is that the equivalent circuit includes two Fuse elements connected in series, the fusible conductor is electrically connected to the first upper electrode, the collector electrode and the second upper electrode, and the collector electrode is disposed in the substrate and extends to the first On the substrate between the upper electrode and the second upper electrode, allowing application of the circuit The designer can select various multifunctional protection devices of the present invention according to actual needs.

本發明提供一種多功能保護裝置包括基板,該基板可以是一單層絕緣基板或一多層絕緣基板;上電極,配置在基板上,包含第一上電極與第二上電極;下電極,配置在基板上,包含第三下電極;熱產生組件,配置在基板上,該熱產生組件的一端電氣連接第二上電極,另一端電氣連接第三下電極;以及一可熔導體或複數個可熔導體,配置在上電極上,且電氣連接第一上電極與第二上電極。特別值得一提的是熱產生組件的一端電氣連接第二上電極的方法是經由在基板內的傳導層電氣連接熱產生組件與第二上電極,如此熱傳遞的路徑不易受外在環境溫度的影響,先前的技術因熱傳遞路徑外露在基板的側表面,容易受外在環境溫度的影響,使熱能流失。另,第二上電極的形狀可以是任意的形狀或圖形,較佳的是該第二上電極包含集熱部、狹窄部以及外接部。本發明提供之多功能保護裝置其等效電路包含一保險絲(Fuse)元件與一發熱電阻。 The present invention provides a multi-function protection device including a substrate, which may be a single-layer insulating substrate or a multi-layer insulating substrate; an upper electrode disposed on the substrate, including a first upper electrode and a second upper electrode; a lower electrode, configured On the substrate, comprising a third lower electrode; a heat generating component disposed on the substrate, the heat generating component electrically connecting one end of the second upper electrode and the other end electrically connecting the third lower electrode; and a fusible conductor or a plurality of The fuse conductor is disposed on the upper electrode and electrically connects the first upper electrode and the second upper electrode. It is particularly worth mentioning that the method of electrically connecting the second upper electrode at one end of the heat generating component is to electrically connect the heat generating component and the second upper electrode via a conductive layer in the substrate, such that the path of heat transfer is not susceptible to the external ambient temperature. Influence, the prior art is exposed to the side surface of the substrate due to the heat transfer path, and is easily affected by the external environment temperature, so that heat energy is lost. In addition, the shape of the second upper electrode may be any shape or pattern, and it is preferable that the second upper electrode includes a heat collecting portion, a narrow portion, and an external portion. The equivalent circuit of the multi-function protection device provided by the invention comprises a fuse element and a heating resistor.

在本發明之一實施例中,上述之多功能保護裝置其中該第二上電極另包含內集熱部,該第二上電極的內集熱部配置在基板內或延伸至基板內。內集熱部距離熱產生組件或加熱器非常的近,可以很快的聚集熱產生組件所產生的熱能,並傳導到在基板表面上的第二上電極,可以很快的熔斷可熔導體,達到改善或縮短多功能保護裝置保護動作的時間。又,本實施例之多功能保護裝置另包含一輔助材料,配置在第二上電極上或可熔導體上或第二上電極與可熔導體上,且該輔助材料的熔點或液化點溫度低於可熔斷導體的熔點或液化點溫度。 In an embodiment of the present invention, the second upper electrode further includes an inner heat collecting portion, and the inner heat collecting portion of the second upper electrode is disposed in the substrate or extends into the substrate. The inner heat collecting portion is very close to the heat generating component or the heater, and can quickly collect the heat energy generated by the heat generating component and conduct it to the second upper electrode on the surface of the substrate, so that the fusible conductor can be quickly melted. Achieve the time to improve or shorten the protection action of the multi-function protection device. Moreover, the multifunctional protection device of the embodiment further includes an auxiliary material disposed on the second upper electrode or on the soluble conductor or the second upper electrode and the fusible conductor, and the auxiliary material has a low melting point or a liquefaction point temperature. The melting point or liquefaction point temperature of the fusible conductor.

在本發明之一實施例中,上述之多功能保護裝置,另包含一吸附線,該吸附線配置在第二上電極上的一端且延伸跨越可熔導體至第二上電極上相反的另一端,該輔助材料配置在吸附線與可熔導體之間,以及吸附線與第二上電極之間,且該輔助材料的熔點或液化點溫度低於可熔斷導體的熔點或液化點溫度。 In an embodiment of the present invention, the multi-function protection device further includes an adsorption line disposed at one end of the second upper electrode and extending across the fusible conductor to the opposite end of the second upper electrode The auxiliary material is disposed between the adsorption line and the fusible conductor, and between the adsorption line and the second upper electrode, and the melting point or liquefaction point temperature of the auxiliary material is lower than the melting point or the liquefaction point temperature of the fusible conductor.

在本發明之一實施例中,上述之多功能保護裝置,另包含絕緣外殼與下絕緣層,該下絕緣層配置在熱產生組件上,該絕緣外殼配置在基板上,且覆蓋基板上表面之所有物件。 In an embodiment of the invention, the multi-function protection device further includes an insulating outer casing and a lower insulating layer, wherein the lower insulating layer is disposed on the heat generating component, and the insulating shell is disposed on the substrate and covers the upper surface of the substrate. All objects.

在本發明之一實施例中,上述之多功能保護裝置,其中該可熔導體包含寬薄部與窄厚部,寬薄部電氣連接第二上電極,窄厚部電氣連接第一上電極。 In an embodiment of the invention, the multi-function protection device, wherein the fusible conductor comprises a wide portion and a narrow portion, the wide portion is electrically connected to the second upper electrode, and the narrow portion is electrically connected to the first upper electrode.

本發明提供一種多功能保護裝置,包括:基板,是一多層絕緣基板,包含傳導層,該傳導層配置在基板內;上電極,配置在基板上,包含第一上電極與第二上電極;集熱電極,配置在基板內且延伸至第一上電極與第二上電極之間的基板上,集熱電極與熱產生組件最近的距離介於0.001~0.1mm之間;下電極,配置在基板上,包括一第三下電極;熱產生組件,配置在基板上,該熱產生組件的一端經由傳導層電氣連接集熱電極,另一端電氣連接第三下電極;以及一可熔導體或複數個可熔導體,配置在上電極與集熱電極上,且電氣連接第一上電極、集熱電極以及第二上電極。集熱電極的技術特徵是它配置在基板內且延伸至基板上,基板內集熱電極的材質是金屬材料,有很高的熱傳導率,較之前技術中的基板的熱傳導率高很多,且距離熱產生組件非常 的近,可以很快的聚集熱產生組件所產生的熱能,並傳導到基板的表面上,可以很快的熔斷可熔導體。本發明之多功能保護裝置其等效電路包含兩串聯的保險絲(Fuse)元件與一發熱電阻,該發熱電阻的一端電氣連接兩串聯保險絲(Fuse)元件的共接點或串接點。 The present invention provides a multi-function protection device comprising: a substrate, a multi-layered insulating substrate, comprising a conductive layer disposed in the substrate; and an upper electrode disposed on the substrate, including the first upper electrode and the second upper electrode a collecting electrode disposed in the substrate and extending to the substrate between the first upper electrode and the second upper electrode, the closest distance of the collecting electrode to the heat generating component is between 0.001 and 0.1 mm; the lower electrode is configured On the substrate, including a third lower electrode; a heat generating component disposed on the substrate, one end of the heat generating component is electrically connected to the collector electrode via the conductive layer, the other end is electrically connected to the third lower electrode; and a fusible conductor or A plurality of fusible conductors are disposed on the upper electrode and the heat collecting electrode, and electrically connect the first upper electrode, the heat collecting electrode and the second upper electrode. The technical feature of the collector electrode is that it is disposed in the substrate and extends to the substrate. The material of the collector electrode in the substrate is a metal material, which has a high thermal conductivity, which is much higher than the thermal conductivity of the substrate in the prior art, and the distance. Heat generating component is very The heat generated by the heat generating component can be quickly collected and conducted to the surface of the substrate, and the fusible conductor can be quickly melted. The equivalent circuit of the multifunctional protection device of the present invention comprises two fuse elements in series and a heat generating resistor, one end of which is electrically connected to a common contact or a series connection point of two series fuse elements.

本發明提供一種多功能保護裝置,包括:低溫共燒陶瓷(LTCC)基板,是一多層絕緣基板,包含第一上電極、集熱電極、第二上電極、傳導層以及複數個貫孔,第一上電極與第二上電極配置在基板上,集熱電極配置在基板內且延伸到第一上電極與第二上電極之間的基板上,傳導層與部分集熱電極配置在不同之貫孔內,該低溫共燒陶瓷(LTCC)基板是以低溫共燒陶瓷(LTCC)材料與製程技術以及燒結製程共燒製成,燒結溫度在100℃至1100℃之間,且該低溫共燒陶瓷(LTCC)基板之絕緣材料的熱傳導率小於5W/m.K,較佳的是小於2W/m.K;第三下電極,配置在基板上;熱產生組件,配置在基板上,該熱產生組件的一端經由傳導層電氣連接集熱電極,另一端電氣連接第三下電極,集熱電極與熱產生組件最近的距離介於0.001~0.1mm之間;以及一可熔導體或複數個可熔導體,配置在第一上電極、集熱電極與第二上電極上,且電氣連接第一上電極、集熱電極以及第二上電極。 The present invention provides a multifunctional protection device comprising: a low temperature co-fired ceramic (LTCC) substrate, which is a multilayer insulating substrate comprising a first upper electrode, a collector electrode, a second upper electrode, a conductive layer, and a plurality of through holes. The first upper electrode and the second upper electrode are disposed on the substrate, and the heat collecting electrode is disposed in the substrate and extends to the substrate between the first upper electrode and the second upper electrode, and the conductive layer and the partial heat collecting electrode are disposed differently In the through hole, the low temperature co-fired ceramic (LTCC) substrate is co-fired by a low temperature co-fired ceramic (LTCC) material and a process technology and a sintering process, and the sintering temperature is between 100 ° C and 1100 ° C, and the low temperature co-firing The thermal conductivity of the insulating material of ceramic (LTCC) substrate is less than 5W/m. K, preferably less than 2W/m. K; a third lower electrode disposed on the substrate; a heat generating component disposed on the substrate, one end of the heat generating component electrically connected to the collector electrode via the conductive layer, and the other end electrically connected to the third lower electrode, the collector electrode and the heat The closest distance of the generating component is between 0.001 and 0.1 mm; and a fusible conductor or a plurality of fusible conductors disposed on the first upper electrode, the collector electrode and the second upper electrode, and electrically connected to the first upper electrode a collector electrode and a second upper electrode.

在本發明之一實施例中,上述之多功能保護裝置,其中該可熔導體包含一中間的寬薄部與一兩端的窄厚部,中間的寬薄部電氣連接集熱電極,兩端的窄厚部分別各自電氣連接第一上電極與第二上電極。 In an embodiment of the present invention, the multi-function protection device, wherein the fusible conductor comprises a middle wide portion and a narrow portion at both ends, the middle thin portion is electrically connected to the collector electrode, and the two ends are narrow. The thick portions are each electrically connected to the first upper electrode and the second upper electrode, respectively.

在本發明之一實施例中,上述之多功能保護裝置,另包含 一抑制電弧層,配置在第一上電極與第上二電極之間的可熔導體表面上。 In an embodiment of the present invention, the above multi-function protection device further includes An arc suppression layer is disposed on the surface of the fusible conductor between the first upper electrode and the second upper electrode.

本發明之基板的種類可包含有機系基板或玻纖環氧基板(如:FR4或FR5)或玻纖環氧印刷電路基板或無機系基板或陶瓷基板(如:LTCC基板或HTCC基板)等,較佳的包含氧化鋁基板或低溫共燒陶瓷(LTCC)基板,最佳或最適合本發明所有多功能保護裝置的基板是低溫共燒陶瓷(LTCC)基板,它是以低溫共燒陶瓷(LTCC)的材料與製程來製作,其製程具有如下之步驟:採用包含無機陶瓷粉、玻璃粉與有機黏結劑等材料混合成泥狀的漿料,經過刮刀成型乾燥後製成一張張的薄生胚或一張厚生胚;於各層薄生胚打出所需要的貫孔;填入傳導層材料,可供上電極與下電極之間或內電極與上電極之間或內電極與集熱電極之間的電流與熱能的傳遞;再利用網版印刷將內電極材料、熱產生元件、上電極材料、下電極材料印在所需之各層薄生胚上面;再將多層薄生胚堆疊;後再經燒結爐以低於1100℃的溫度一次或多次共燒完成。 The type of the substrate of the present invention may include an organic substrate or a glass epoxy substrate (for example, FR4 or FR5) or a glass epoxy printed circuit substrate or an inorganic substrate or a ceramic substrate (such as an LTCC substrate or an HTCC substrate). Preferably, the substrate comprising an alumina substrate or a low temperature co-fired ceramic (LTCC) substrate, which is optimal or most suitable for all of the multifunctional protection devices of the present invention, is a low temperature co-fired ceramic (LTCC) substrate which is a low temperature co-fired ceramic (LTCC). The material and the process are manufactured, and the process has the following steps: using a slurry containing inorganic ceramic powder, glass powder and organic binder to form a slurry, which is formed into a sheet by a doctor blade and dried. Embryo or a thick embryo; the through holes required for each layer of thin green embryos; filled with conductive layer material for between the upper and lower electrodes or between the inner and upper electrodes or between the inner and the collector electrodes The transfer of current and heat energy; and then screen printing the inner electrode material, the heat generating element, the upper electrode material, and the lower electrode material on the desired thin layers of the raw embryo; and then stacking the plurality of thin green embryos; Sintered furnace 1100 ℃ temperature of the one or more co-firing is completed.

本發明另提出一種電子裝置,包括:電源供應器或負載,負責提供充電電壓與電流的電源供應器或接收放電電流的負載;儲能裝置,包含一個或複數個可充放電的電池;異常偵測控制電路,負責偵測儲能裝置或被保護元件的電壓或溫度,若有異常,則輸出一信號給開關元件;開關元件,正常時,關閉多功能保護裝置內之熱產生組件的電流路徑,收到異常偵測控制電路的信號時,開啟熱產生組件的電流路徑,熱產生組件因電流流過而發熱;以及如本發明所述之多功能保護裝置,第一上電極電氣連接電源供應器或負載,第二上電極電氣連接儲能裝置,第三下電極電 氣連接開關元件,異常發生時熔斷第一上電極與第二上電極之間的電流路徑。 The invention further provides an electronic device comprising: a power supply or a load, a power supply for supplying a voltage and a current, or a load for receiving a discharge current; and an energy storage device comprising one or a plurality of rechargeable and dischargeable batteries; The measurement control circuit is responsible for detecting the voltage or temperature of the energy storage device or the protected component, and if there is an abnormality, outputting a signal to the switching component; and the switching component, when normal, closing the current path of the heat generating component in the multifunctional protection device When receiving the signal of the abnormality detecting control circuit, turning on the current path of the heat generating component, the heat generating component generates heat due to the current flowing; and the multifunctional protection device according to the present invention, the first upper electrode is electrically connected to the power supply Or load, the second upper electrode is electrically connected to the energy storage device, and the third lower electrode is electrically The gas is connected to the switching element, and when a abnormality occurs, the current path between the first upper electrode and the second upper electrode is blown.

100、100a、100b、100c、100d、100e、100f、100g、100h‧‧‧多功能保護裝置 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h‧‧‧ multi-function protection device

110、110b、110g‧‧‧基板 110, 110b, 110g‧‧‧ substrate

11‧‧‧上表面 11‧‧‧ upper surface

12‧‧‧下表面 12‧‧‧ Lower surface

13‧‧‧第一層絕緣基板下表面或第二層絕緣基板上表面 13‧‧‧The lower surface of the first insulating substrate or the upper surface of the second insulating substrate

111b、111g‧‧‧第一層絕緣基板 111b, 111g‧‧‧ first insulating substrate

112b、112g‧‧‧第二層絕緣基板 112b, 112g‧‧‧second insulating substrate

111b1、111b2、111b3、111b4‧‧‧絕緣生胚 111b1, 111b2, 111b3, 111b4‧‧‧ insulated raw embryos

117‧‧‧貫孔 117‧‧‧through holes

118‧‧‧傳導層 118‧‧‧Transmission layer

120、120a、120b、120g‧‧‧上電極 120, 120a, 120b, 120g‧‧‧ upper electrode

121、121g‧‧‧第一上電極 121, 121g‧‧‧ first upper electrode

122、122a、122b、122g‧‧‧第二上電極 122, 122a, 122b, 122g‧‧‧ second upper electrode

122a1、122b1‧‧‧外接部 122a1, 122b1‧‧‧ External Department

122a2、122b2‧‧‧狹窄部 122a2, 122b2‧‧‧ stenosis

122a3、122b3‧‧‧集熱部 122a3, 122b3‧‧ ‧ heat collection department

122b4‧‧‧內集熱部 122b4‧‧In the heat collection department

125‧‧‧集熱電極 125‧‧ ‧ collector electrode

127‧‧‧吸附線 127‧‧‧Adsorption line

128‧‧‧輔助材料 128‧‧‧Auxiliary materials

129‧‧‧抑制電弧層 129‧‧‧Suppression of the arc layer

130‧‧‧下電極 130‧‧‧ lower electrode

170、170f、170g‧‧‧可熔導體 170, 170f, 170g‧‧‧ fusible conductor

170f1‧‧‧寬薄部 170f1‧‧‧ wide section

170f2‧‧‧窄厚部 170f2‧‧‧narrow section

170g1‧‧‧右邊可熔導體 170g1‧‧‧Right fusible conductor

170g2‧‧‧左邊可熔導體 170g2‧‧‧left fusible conductor

173h‧‧‧兩端的窄厚部 173h‧‧‧ narrow and thick ends

174h‧‧‧中間的寬薄部 174h‧‧‧ middle and wide section

170(T1)、170(T4)、170(T4a)、170(T4b)、170(T4c)、170(T4d)170(T4e)、170(T7)、170(T7a)‧‧‧第一層可熔導體 170 (T1), 170 (T4), 170 (T4a), 170 (T4b), 170 (T4c), 170 (T4d) 170 (T4e), 170 (T7), 170 (T7a) ‧ ‧ first layer Melt conductor

170(T2)、170(T5)、170(T5a)、170(T5b)、170(T5c)、170(T5d)、170(T5e)、170(T8)、170(T8a)‧‧‧第二層可熔導體 170 (T2), 170 (T5), 170 (T5a), 170 (T5b), 170 (T5c), 170 (T5d), 170 (T5e), 170 (T8), 170 (T8a) ‧ ‧ second layer Fusible conductor

170(T3)、170(T6)‧‧‧第三層可熔導體 170 (T3), 170 (T6) ‧ ‧ third layer fusible conductor

180‧‧‧熱產生組件 180‧‧‧Heat generating components

188‧‧‧熱產生元件 188‧‧‧heat generating components

181‧‧‧內電極 181‧‧‧ internal electrodes

189‧‧‧下絕緣層 189‧‧‧lower insulation

190‧‧‧絕緣外殼 190‧‧‧Insulated casing

20‧‧‧電源供應器或負載 20‧‧‧Power supply or load

21‧‧‧儲能裝置 21‧‧‧ energy storage device

22‧‧‧異常偵測控制電路 22‧‧‧Anomaly Detection Control Circuit

23‧‧‧開關元件 23‧‧‧Switching elements

D‧‧‧吸附線與可熔導體之間的距離 D‧‧‧Distance between the absorbing line and the fusible conductor

H1‧‧‧內集熱部與熱產生元件之間的距離 Distance between the heat collecting part and the heat generating element in H1‧‧

H2‧‧‧集熱電極與熱產生元件之間的距離 H2‧‧‧Distance between collector electrode and heat generating element

1、2‧‧‧電子裝置 1, 2‧‧‧ electronic devices

圖1是第一實施例之多功能保護裝置100的等效電路圖。 1 is an equivalent circuit diagram of the multi-function protection device 100 of the first embodiment.

圖1A係本發明第一實施例之多功能保護裝置100的俯視示意圖。 1A is a top plan view of a multi-function protection device 100 according to a first embodiment of the present invention.

圖1B係本發明第一實施例之多功能保護裝置100的仰視示意圖。 1B is a schematic bottom view of the multi-function protection device 100 of the first embodiment of the present invention.

圖1C繪示為圖1A之多功能保護裝置100沿線X-X’的剖面示意圖。 1C is a cross-sectional view of the multifunction protection device 100 of FIG. 1A taken along line X-X'.

圖1D繪示為圖1A之多功能保護裝置100沿線Y-Y’的剖面示意圖。 1D is a cross-sectional view of the multi-function protection device 100 of FIG. 1A taken along line Y-Y'.

圖1E係本發明第一實施例中之第二上電極變形例的俯視示意圖。 Fig. 1E is a schematic plan view showing a modification of the second upper electrode in the first embodiment of the present invention.

圖1F係本發明第二實施例之多功能保護裝置100b的俯視示意圖。 1F is a top plan view of a multi-function protection device 100b according to a second embodiment of the present invention.

圖1G繪示為圖1F之多功能保護裝置100沿線X-X’的剖面示意圖。 1G is a cross-sectional view of the multifunction protection device 100 of FIG. 1F taken along line X-X'.

圖1G-a、圖1G-b、圖1G-c、圖1G-d、圖1G-e、圖1G-f、圖1G-g、圖1G-h、圖1G-i是基板使用低溫共燒陶瓷LTCC的製作步驟示意圖。 1G-a, 1G-b, 1G-c, 1G-d, 1G-e, 1G-f, 1G-g, 1G-h, and 1G-i are low temperature co-fired substrates. Schematic diagram of the fabrication steps of ceramic LTCC.

圖1H繪示為圖1A之多功能保護裝置100沿線Y-Y’的剖面示意圖。 1H is a cross-sectional view of the multifunction protection device 100 of FIG. 1A taken along line Y-Y'.

圖1I係本發明第三實施例之多功能保護裝置100c的剖面示意圖。 1I is a schematic cross-sectional view of a multi-function protection device 100c according to a third embodiment of the present invention.

圖1J係本發明第三實施例之多功能保護裝置100c的剖面示意圖。 1J is a schematic cross-sectional view of a multi-function protection device 100c according to a third embodiment of the present invention.

圖1K係本發明第三實施例之多功能保護裝置100d的剖面示意圖。 1K is a schematic cross-sectional view of a multi-function protection device 100d according to a third embodiment of the present invention.

圖1L係本發明第四實施例之多功能保護裝置100e的剖面示意圖。 1L is a schematic cross-sectional view of a multi-function protection device 100e according to a fourth embodiment of the present invention.

圖1M係本發明第五實施例之多功能保護裝置100f的剖面示意圖。 1M is a schematic cross-sectional view of a multi-function protection device 100f according to a fifth embodiment of the present invention.

圖1N係本發明第六實施例之多功能保護裝置110g的俯視示意圖。 1N is a top plan view of a multi-function protection device 110g according to a sixth embodiment of the present invention.

圖1O係本發明第六實施例之多功能保護裝置100g的仰視示意圖。 Figure 10 is a bottom plan view of a multi-function protection device 100g according to a sixth embodiment of the present invention.

圖1P繪示為圖1N之多功能保護裝置100g沿線X-X’的剖面示意圖。 1P is a cross-sectional view of the multi-function protection device 100g of FIG. 1N taken along line X-X'.

圖1Q繪示為圖1N之多功能保護裝置100g沿線Y-Y’的剖面示意圖。 Figure 1Q is a cross-sectional view of the multi-function protection device 100g of Figure 1N taken along line Y-Y'.

圖1R係本發明第七實施例之多功能保護裝置110h的剖面示意圖。 1R is a schematic cross-sectional view of a multi-function protection device 110h according to a seventh embodiment of the present invention.

圖2是第六實施例之多功能保護裝置100g的等效電路圖 2 is an equivalent circuit diagram of the multi-function protection device 100g of the sixth embodiment

圖3-1繪示兩層包覆式可熔導體示意圖 Figure 3-1 shows a schematic diagram of a two-layer coated fusible conductor

圖3-2繪示三層包覆式可熔導體示意圖 Figure 3-2 shows a schematic diagram of a three-layer coated fusible conductor

圖3-3繪示三層分層式可熔導體示意圖 Figure 3-3 shows a three-layer layered fusible conductor

圖3-4、圖3-5、圖3-6、圖3-7、圖3-8、圖3-9、圖3-10繪示不同的兩層分層式可熔導體示意圖 Figure 3-4, Figure 3-5, Figure 3-6, Figure 3-7, Figure 3-8, Figure 3-9, Figure 3-10 show different two-layer layered fusible conductors

圖4是本發明之一種電子裝置1之方塊示意圖 4 is a block diagram of an electronic device 1 of the present invention.

圖4-1是本發明之一種電子裝置2之方塊示意圖 4-1 is a block diagram of an electronic device 2 of the present invention.

為使能更進一步瞭解本發明之特徵和技術內容,請參閱以下相關的實施例,並配合所附圖式作詳細說明如下: In order to further understand the features and technical contents of the present invention, please refer to the following related embodiments, and the detailed description is as follows:

圖1A係本發明第一實施例之多功能保護裝置100的俯視示意圖。圖1B係本發明第一實施例之多功能保護裝置100的仰視示意圖。圖1C繪示為圖1A之多功能保護裝置100沿線X-X’的剖面示意圖。圖1D繪示為圖1A之多功能保護裝置100沿線Y-Y’的剖面示意圖。請同時參考圖1A、圖1B、圖1C與圖1D,本實施例之多功能保護裝置100包括基板110,該基板110可以是一單層絕緣基板或一多層絕緣基板;上電極120,配置在基板110上,包含第一上電極121與第二上電極122;下電極130,配置在 基板110上,包含第三下電極133:熱產生組件180,配置在基板110上,該熱產生組件180的一端電氣連接第二上電極122,另一端電氣連接第三下電極133;以及一可熔導體170或複數個可熔導體170(未繪示),配置在上電極120上,且電氣連接第一上電極121與第二上電極122。詳細來說,基板110包含一貫孔117或複數個貫孔117(圖1A繪示三貫孔)與傳導層118,該貫孔117連接基板的上表面11與下表面12,該傳導層118配置在貫孔117內,基板110可以是一單層絕緣基板或一多層絕緣基板,基板110的材料包括無機陶瓷材料、低溫共燒陶瓷(LTCC)、玻璃陶瓷、玻璃粉、氧化鋁、氮化鋁、氧化鋯、氮化矽、氮化硼以及有機黏結劑等其中之一或其部分組合,其方法可採用包含所需的基板110材料混合成泥狀的漿料,經過刮刀成型乾燥後製成一張張的薄生胚或一張厚生胚。貫孔117可以機械鑽孔、雷鑽、模具沖孔或其他業界熟習的技術在各層生胚打出所需的孔。傳導層118的材質包含金、銀、鎳、錫、鉛、鉑、銅等其中之一或其部分組合,將傳導層118的材料填入各層生坯的貫孔117內,該傳導層118負責電氣連接與熱連接熱產生組件180以及第二上電極122,因該傳導層118配置在基板110內,並未外露在基板110的表面,所以不會因外在環境的溫度受到影響(如:熱流失或散熱),而增加多功能保護裝置100的動作時間。熱產生組件180包括一熱產生元件188與一內電極181,熱產生元件188的材料包括二氧化釕(RuO2)、氧化釕、釕、銅、鈀、白金、鉑、鉬、鎢、有機結合劑或無機結合劑等其中之一或其中部分組合,可以將熱產生元件188的材料製成漿料,將熱產生元件188的圖形印刷在基板110的下表面12上,內電極181的材料包含銅、錫、鉛、鐵、鎳、鉑、鎢、鈀、銀、金等其中之一或其部分組合,可以將內電極181的材料與圖 形印刷在基板110的下表面12上,並覆蓋在部分熱產生元件188上與傳導層118材料上,使熱產生元件188的一端經由內電極181與傳導層118電氣連接。上電極120包含第一上電極121與第二上電極122,上電極120的材料包含銅、錫、鉛、鐵、鎳、鉑、鎢、鈀、銀、金等其中之一或其部分組合,可以印刷技術將第一上電極121與第二上電極112的圖形(如圖1A所示)印刷在基板110的上表面11上,且第二上電極112覆蓋在傳導層118材料上,使第二上電極112經由傳導層118、內電極181與熱產生元件188的一端電氣連接,第一上電極121與第二上電極112的圖形可以是任何形狀,值得一提的是第二上電極112的變形設計:如圖1E所示第二上電極122a包含集熱部122a3、狹窄部122a2以及外接部122a1,集熱部122a3的特徵是聚集熱產生組件180所產生的熱且負責熔斷可熔斷材料170,狹窄部122a2的特徵是隔絕或降低集熱部122a3熱能的流失或受外接部122a1溫度的影響,外接部的特徵是可電氣連接外部電路。下電極130包含第三下電極133,下電極130的材料包含銅、錫、鉛、鐵、鎳、鉑、鎢、鈀、銀、金等其中之一或其部分組合,可以印刷技術將第三下電極133的材料與圖形印刷在基板110的下表面12上,且覆蓋在部分熱產生元件188上,使第三下電極133電氣連接熱產生元件188的另一端,且可電氣連接外部電路。可熔導體170配置於第一上電極121與第二上電極122上,並電氣連結第一上電極121與第二上電極122(圖1A繪示一可熔導體170,當然也可是複數個可熔導體170,未繪示)。可熔導體170可以是一單層或一多層結構,若可熔導體170是一多層結構,請同時參考圖3-1、圖3-2、圖3-3、圖3-4、圖3-5、圖3-6、圖3-7、圖3-8、圖3-9以及圖3-10,其多層的結構可以是包覆式或分層式,如圖3-1是兩層包覆式,第一層可熔導體 170(T1)包覆第二層可熔導體170(T2)。如圖3-2是三層包覆式,第一層可熔導體170(T1)包覆第二層可熔導體170(T2),且第二層可熔導體170(T2)包覆第三層可熔導體170(T3)。如圖3-3是三層分層式,其中第一層可熔導體170(T4)與第三層可熔導體170(T6)比第二層可熔導體170(T5)薄。如圖3-4與圖3-5是兩種不同的兩層分層式,其中第一層可熔導體170(T4a)、170(T4b)的厚度比第二層可熔導體170(T5a、170(T5b)的厚度薄,第一層可熔導體170(T4a)配置在第二層可熔導體170(T5a)上,另一分層式可熔導體170,第一層可熔導體170(T4b)配置在第二層可熔導體170(T5b)的上面與兩個側表面上。需說明的是,請參考圖3-7,分層式中的第一層可熔導體170(T4d)的面積可以小於或等於第二層可熔導體170(T5d)的面積,就是第一層可熔導體170(T4d)只配置在部分的第二層可熔導體170(T5d)上,此特徵也適用在其他分層式的可熔導體上。如圖3-6與圖3-8中的可熔導體是包含中間的寬薄部與兩端的窄厚部且是兩層分層式,其中第一層可熔導體170(T4c)、170(T4e)的厚度比第二層可熔導體170(T5c)、170(T5e)的厚度薄。如圖3-9中的可熔導體是兩層分層式,其中第一層可熔導體170(T7)的厚度比第二層可熔導體170(T8)的厚度厚。如圖3-10中的可熔導體是包含中間的寬薄部與兩端的窄厚部且是兩層分層式,其中第一層可熔導體170(T7a)的厚度比第二層可熔導體170(T8a)的厚度厚。以上多層結構的可熔導體170其相鄰的各層熔點溫度可以是不同的(T1至Txx代表熔點溫度),例如:第一層可熔導體170(T1)與第二層可熔導體170(T2)的熔點溫度不同,第二層可熔導體170(T2)與第三層可熔導體170(T3)的熔點溫度不同,可熔導體170中各層的材料或材質包括金、銀、銅、鋁、鈀、鉑、錫、鉛、銦、鉍、銻等其中之一或其部分組合。另外,本實施例中可熔導體170 與上電極120電氣連接的材料其材質包括錫膏、銀膠、錫、銅、銀、金、鉍、錫銀合金、錫鉛合金…等其中之一或其部分組合成的合金,其方法是藉此材料可固定可熔導體170於第一上電極121與第二上電極122之上,這些都可視為電氣連接的方法與材料之一,然並不以此為限,任何業界習知的焊接方式或固定技術或電氣連接的方法,也可以不需要任何電氣連接的材料,只要能達到電氣連接都屬本發明的範圍之內。圖1是第一實施例之多功能保護裝置100的等效電路圖,包含一保險絲(Fuse)元件(可熔導體170)與一發熱電阻(熱產生組件180)。其中與圖1A、1B、1C與1D中相關主要的符號都有標示出來。 1A is a top plan view of a multi-function protection device 100 according to a first embodiment of the present invention. 1B is a schematic bottom view of the multi-function protection device 100 of the first embodiment of the present invention. 1C is a cross-sectional view of the multi-function protection device 100 of FIG. 1A taken along line XX'. 1D is a cross-sectional view of the multi-function protection device 100 of FIG. 1A taken along line Y-Y'. Referring to FIG. 1A, FIG. 1B, FIG. 1C and FIG. 1D, the multi-function protection device 100 of the present embodiment includes a substrate 110, which may be a single-layer insulating substrate or a multi-layer insulating substrate; the upper electrode 120 is configured. On the substrate 110, a first upper electrode 121 and a second upper electrode 122 are disposed. The lower electrode 130 is disposed on the substrate 110, and includes a third lower electrode 133: a heat generating component 180 disposed on the substrate 110. The heat generating component One end of 180 is electrically connected to the second upper electrode 122, and the other end is electrically connected to the third lower electrode 133; and a fusible conductor 170 or a plurality of fusible conductors 170 (not shown) are disposed on the upper electrode 120 and electrically connected The first upper electrode 121 and the second upper electrode 122. In detail, the substrate 110 includes a uniform hole 117 or a plurality of through holes 117 (three through holes are shown in FIG. 1A ) and a conductive layer 118 that connects the upper surface 11 and the lower surface 12 of the substrate. The conductive layer 118 is configured. In the through hole 117, the substrate 110 may be a single insulating substrate or a multilayer insulating substrate. The material of the substrate 110 includes an inorganic ceramic material, a low temperature co-fired ceramic (LTCC), a glass ceramic, a glass frit, an alumina, and a nitride. A combination of aluminum, zirconia, tantalum nitride, boron nitride, and an organic binder, or a part thereof, may be prepared by mixing a desired substrate 110 material into a slurry, which is dried by a doctor blade. A thin piece of raw embryo or a thick embryo. The through holes 117 can be used to machine the desired holes in each layer of green embryos by mechanical drilling, ray drilling, die punching, or other techniques well known in the art. The material of the conductive layer 118 comprises one or a combination of gold, silver, nickel, tin, lead, platinum, copper, etc., and the material of the conductive layer 118 is filled into the through holes 117 of the green layers of the layers, the conductive layer 118 is responsible for The electrical connection and the thermal connection heat generating component 180 and the second upper electrode 122 are disposed in the substrate 110 and are not exposed on the surface of the substrate 110, so that the temperature of the external environment is not affected (eg, The heat loss or heat dissipation increases the operating time of the multi-function protection device 100. The heat generating component 180 includes a heat generating component 188 and an inner electrode 181. The material of the heat generating component 188 includes ruthenium dioxide (RuO 2 ), ruthenium oxide, iridium, copper, palladium, platinum, platinum, molybdenum, tungsten, and organic combination. A material or an inorganic binder or the like may be combined to form a slurry of the material of the heat generating element 188, and a pattern of the heat generating element 188 is printed on the lower surface 12 of the substrate 110, the material of the inner electrode 181 comprising A material or a combination of copper, tin, lead, iron, nickel, platinum, tungsten, palladium, silver, gold, or the like, may be printed on the lower surface 12 of the substrate 110 and covered with A portion of the heat generating element 188 and the conductive layer 118 are material such that one end of the heat generating element 188 is electrically coupled to the conductive layer 118 via the inner electrode 181. The upper electrode 120 includes a first upper electrode 121 and a second upper electrode 122. The material of the upper electrode 120 includes one or a combination of copper, tin, lead, iron, nickel, platinum, tungsten, palladium, silver, gold, or the like. A pattern of the first upper electrode 121 and the second upper electrode 112 (shown in FIG. 1A) may be printed on the upper surface 11 of the substrate 110, and the second upper electrode 112 may be overlaid on the material of the conductive layer 118. The second upper electrode 112 is electrically connected to one end of the heat generating element 188 via the conductive layer 118 and the inner electrode 181. The pattern of the first upper electrode 121 and the second upper electrode 112 may be any shape, and it is worth mentioning that the second upper electrode 112 Deformation design: as shown in FIG. 1E, the second upper electrode 122a includes a heat collecting portion 122a3, a narrow portion 122a2, and an external portion 122a1. The heat collecting portion 122a3 is characterized by collecting heat generated by the heat generating assembly 180 and is responsible for fusing the fusible material. 170. The narrow portion 122a2 is characterized by isolating or reducing the loss of thermal energy of the heat collecting portion 122a3 or by the temperature of the external portion 122a1, and the external portion is characterized by being electrically connectable to an external circuit. The lower electrode 130 includes a third lower electrode 133, and the material of the lower electrode 130 includes one or a combination of copper, tin, lead, iron, nickel, platinum, tungsten, palladium, silver, gold, etc., which can be printed by a third technique. The material and pattern of the lower electrode 133 are printed on the lower surface 12 of the substrate 110 and overlying the portion of the heat generating element 188 such that the third lower electrode 133 is electrically connected to the other end of the heat generating element 188 and is electrically connectable to an external circuit. The soluble conductor 170 is disposed on the first upper electrode 121 and the second upper electrode 122, and electrically connects the first upper electrode 121 and the second upper electrode 122 (FIG. 1A shows a fusible conductor 170, and of course, a plurality of The fuse conductor 170, not shown). The fusible conductor 170 may be a single layer or a multi-layer structure. If the fusible conductor 170 is a multi-layer structure, please refer to FIG. 3-1, FIG. 3-2, FIG. 3-3, FIG. 3-4, and FIG. 3-5, Figure 3-6, Figure 3-7, Figure 3-8, Figure 3-9 and Figure 3-10, the multi-layer structure can be covered or layered, as shown in Figure 3-1 In a layer-wrapped manner, a first layer of fusible conductor 170 (T1) encases a second layer of fusible conductor 170 (T2). As shown in Figure 3-2, the first layer of fusible conductor 170 (T1) covers the second layer of fusible conductor 170 (T2), and the second layer of fusible conductor 170 (T2) is coated with the third layer. Layer fusible conductor 170 (T3). 3-3 is a three layer layered form in which the first layer of fusible conductor 170 (T4) is thinner than the third layer of fusible conductor 170 (T6) than the second layer of fusible conductor 170 (T5). Figures 3-4 and 3-5 are two different two-layered layers in which the thickness of the first layer of fusible conductors 170 (T4a), 170 (T4b) is greater than the thickness of the second layer of fusible conductors 170 (T5a, The thickness of 170 (T5b) is thin, the first layer of fusible conductor 170 (T4a) is disposed on the second layer of fusible conductor 170 (T5a), the other layered fusible conductor 170, and the first layer of fusible conductor 170 ( T4b) is disposed on the upper surface and the two side surfaces of the second layer of fusible conductor 170 (T5b). It should be noted that, referring to FIG. 3-7, the first layer of fusible conductor 170 (T4d) in the layered manner The area may be less than or equal to the area of the second layer of fusible conductor 170 (T5d), that is, the first layer of fusible conductor 170 (T4d) is disposed only on a portion of the second layer of fusible conductor 170 (T5d). Applicable to other layered fusible conductors. The fusible conductors in Figures 3-6 and 3-8 are narrow and thick sections containing the middle wide and thin sections and are two-layered, where The thickness of one layer of fusible conductors 170 (T4c), 170 (T4e) is thinner than the thickness of the second layer of fusible conductors 170 (T5c), 170 (T5e). The fusible conductors in Figures 3-9 are two layers. a layer in which the thickness of the first layer of fusible conductor 170 (T7) is greater than that of the second layer The thickness of the conductor 170 (T8) is thick. The fusible conductor in FIGS. 3-10 is a thick and thick portion including the middle wide portion and both ends and is a two-layer layered type in which the first layer of the fusible conductor 170 (T7a) The thickness of the second layer of the fusible conductor 170 (T8a) is thicker than the thickness of the second layer of the fusible conductor 170 (T8a). The melting temperature of the adjacent layers of the above-mentioned multilayer structure of the soluble conductor 170 may be different (T1 to Txx represents the melting point temperature), for example: first The melting point temperature of the layer of fusible conductor 170 (T1) is different from that of the second layer of fusible conductor 170 (T2), and the melting temperature of the second layer of fusible conductor 170 (T2) is different from that of the third layer of fusible conductor 170 (T3). The material or material of each layer in the fusible conductor 170 includes one or a combination of parts of gold, silver, copper, aluminum, palladium, platinum, tin, lead, indium, antimony, bismuth, etc. In addition, the fusible conductor in this embodiment The material electrically connected to the upper electrode 120 is made of a solder paste, a silver paste, a tin, a copper, a silver, a gold, a tantalum, a tin-silver alloy, a tin-lead alloy, or the like, or a combination thereof. The material can be used to fix the fusible conductor 170 above the first upper electrode 121 and the second upper electrode 122, which can be regarded as electrical connections. One of the methods and materials of the connection is not limited thereto. Any conventional welding method or fixed technology or electrical connection method may not require any electrical connection material, as long as the electrical connection is achieved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an equivalent circuit diagram of a multi-function protection device 100 of a first embodiment, comprising a fuse element (a fusible conductor 170) and a heat generating resistor (heat generating component 180). The main symbols associated with Figures 1A, 1B, 1C and 1D are labeled.

圖1F係本發明第二實施例之多功能保護裝置100b的俯視示意圖。圖1G繪示為圖1F之多功能保護裝置100沿線X-X’的剖面示意圖。圖1H繪示為圖1A之多功能保護裝置100沿線Y-Y’的剖面示意圖。請同時參考圖1F、圖1G與圖1H,本實施例之多功能保護裝置100b與第一實施例之多功能保護裝置100相似,主要的差異在第二上電極另包含一內集熱部122b4,配置在基板110b內或延伸至基板110b內。內集熱部122b4負責聚集熱產生組件180所產生的熱能並傳導至在基板110b上表面11上的第二上電極122b或第二上電極122b之集熱部122b3。內集熱部122b4與熱產生元件188之間有一層絕緣基板112b,兩者之間的距離H1小於0.15mm,內集熱部122b4的結構可以任何形狀與大小,較佳的是內集熱部122b4距離熱產生元件188最近的平面,其面積與熱產生元件188的面積相似,且兩者之間的距離H1介於0.001~0.1mm,如此內集熱部122b4與熱產生元件188之間的熱阻會最小,熱傳導會較佳,基板110b上的第二上電極122b聚集熱產生元件188所產生的 熱能也愈快。當熱產生組件180發熱時,因本實施例之多功能保護裝置100b之第二上電極122b包含一內集熱部122b4,所以會比第一實施例中之第二上電極122更快速地熔斷可熔導體170。又,本實施例之多功能保護裝置100b另包含輔助材料128,配置在第二上電極122b上或可熔導體170上或第二上電極122b與可熔導體170上,該輔助材料128其主要的作用為防止可熔導體170與第二上電極122b的表面氧化,且當熱產生組件180發熱時或可熔導體170發熱時,輔助材料128會比可熔導體170早熔融或早液化,有助於可熔導體170的熔融,也可以提升第二上電極122b表面的濕潤性(Wetting)與吸附力,使稍後熔融的可熔導體170可以快速地與未熔融的可熔導體170斷開,迅速地與輔助材料128共熔且擴散附著在第二上電極122b上。輔助材料128的材料包括錫、銅、銀、金、鉛、鉍、助焊濟、松香樹脂、表面活性劑、活化劑、軟化劑、有機溶劑等其中之一或其部分組合之複合物。本發明的多功能保護裝置100b在應用上,較佳地是,輔助材料128的熔點或液相點溫度低於可熔導體170的熔點或液相點溫度。本實施例之多功能保護裝置100b中之上電極120b、傳導層118可用低溫共燒陶瓷LTCC之基板110b材料、傳導層118材料與上電極120材料與製程製成一複合基板或低溫共燒陶瓷LTCC基板,請同時參考圖1G-a、圖1G-b、圖1G-c、圖1G-d、圖1G-e、圖1G-f、圖1G-g、圖1G-h以及圖1G-i,其步驟如下:採用包含無機陶瓷粉、玻璃粉與有機黏結劑等基板材料混合成泥狀的漿料,經過刮刀成型乾燥後製成一張張的薄生胚111b1、111b2、111b3、111b4、112b如圖1G-f與圖1G-g或一張厚生胚111b與一張薄生胚112b如圖1G-a與圖1G-b;於各層薄生胚打出所需要的貫孔117如圖1G-f、圖1G-g、圖1G-b與圖1G-a;將傳導層118材料與第二上電極122b 材料填入貫孔117,可供第二上電極122b的集熱部122b3與內集熱部122b4之間或內電極181與第二上電極122b之間的電流或熱能的傳遞;再利用網版印刷將上電極120b材料印在所需之各層薄生胚上面,如圖1G-c將第一上電極121與第二上電極122b之集熱部122b3、狹窄部122b2與外接部122b1印在基板110b或第一層絕緣基板111b的上表面11,如圖1G-d將內集熱部122b4印在第二層絕緣基板112b的上表面13,如圖1G-h將第一上電極121與第二上電極122b之集熱部122b3、狹窄部122b2與外接部122b1印在絕緣生胚111b1上,將第二上電極122b之內集熱部122b4印在絕緣生胚111b4上;如圖1G-h與圖1G-i再將多層薄生胚111b1、111b2、111b3、111b4以及112b或如圖1G-h與圖1G-i將一張厚生胚111b與一張薄生胚112b堆疊如圖1G-e;後再經燒結爐以低於1100℃的溫度一次共燒完成,後再將熱產生元件188與內電極181以及下電極130印在基板110b的下表面12;後再經燒結爐以低於1100℃的溫度燒結完成。低溫共燒陶瓷LTCC之基板製程是業界熟知的技術,但本發明將之運用在多功能保護裝置的製造,本發明所有的實施例都可用低溫共燒陶瓷LTCC之相關技術來製造本發明所有多功能保護裝置的不同的基板110x,最後再將可熔斷導體170固定在上電極120b上。 1F is a top plan view of a multi-function protection device 100b according to a second embodiment of the present invention. 1G is a cross-sectional view of the multifunction protection device 100 of FIG. 1F taken along line X-X'. 1H is a cross-sectional view of the multifunction protection device 100 of FIG. 1A taken along line Y-Y'. Referring to FIG. 1F, FIG. 1G and FIG. 1H, the multi-function protection device 100b of the present embodiment is similar to the multi-function protection device 100 of the first embodiment. The main difference is that the second upper electrode further includes an inner heat collecting portion 122b4. , disposed in the substrate 110b or extending into the substrate 110b. The inner heat collecting portion 122b4 is responsible for collecting the heat energy generated by the heat generating assembly 180 and conducting it to the heat collecting portion 122b3 of the second upper electrode 122b or the second upper electrode 122b on the upper surface 11 of the substrate 110b. There is a layer of insulating substrate 112b between the inner heat collecting portion 122b4 and the heat generating element 188, and the distance H1 between the two is less than 0.15 mm. The structure of the inner heat collecting portion 122b4 can be any shape and size, and preferably the inner heat collecting portion. 122b4 is the closest plane to the heat generating element 188, the area of which is similar to the area of the heat generating element 188, and the distance H1 between the two is between 0.001 and 0.1 mm, such that the inner heat collecting portion 122b4 and the heat generating element 188 are The thermal resistance is minimal, heat conduction is preferred, and the second upper electrode 122b on the substrate 110b collects the heat generating element 188. The faster the heat is. When the heat generating component 180 generates heat, since the second upper electrode 122b of the multifunctional protection device 100b of the present embodiment includes an inner heat collecting portion 122b4, it is blown more quickly than the second upper electrode 122 in the first embodiment. Fusible conductor 170. Moreover, the multifunctional protection device 100b of the present embodiment further includes an auxiliary material 128 disposed on the second upper electrode 122b or on the soluble conductor 170 or the second upper electrode 122b and the fusible conductor 170. The auxiliary material 128 is mainly The function is to prevent oxidation of the surface of the fusible conductor 170 and the second upper electrode 122b, and when the heat generating component 180 generates heat or when the fusible conductor 170 generates heat, the auxiliary material 128 may melt or liquefy earlier than the fusible conductor 170, Helping the melting of the fusible conductor 170, it is also possible to increase the wetting and adsorption of the surface of the second upper electrode 122b so that the melted conductor 170 that is later melted can be quickly disconnected from the unmelted fusible conductor 170. It is rapidly fused with the auxiliary material 128 and diffused and adhered to the second upper electrode 122b. The material of the auxiliary material 128 includes a composite of one of or a combination of tin, copper, silver, gold, lead, antimony, flux, rosin resin, surfactant, activator, softener, organic solvent, and the like. In the application of the multi-function protection device 100b of the present invention, preferably, the melting point or liquidus point temperature of the auxiliary material 128 is lower than the melting point or liquidus point temperature of the fusible conductor 170. In the multi-function protection device 100b of the embodiment, the upper electrode 120b and the conductive layer 118 can be made of a low temperature co-fired ceramic LTCC substrate 110b material, a conductive layer 118 material and an upper electrode 120 material and a process to form a composite substrate or a low temperature co-fired ceramic. For the LTCC substrate, please refer to FIG. 1G-a, FIG. 1G-b, FIG. 1G-c, FIG. 1G-d, FIG. 1G-e, FIG. 1G-f, FIG. 1G-g, FIG. 1G-h, and FIG. 1G-i The steps are as follows: a slurry containing inorganic ceramic powder, glass powder and an organic binder is mixed into a slurry, and dried by a doctor blade to form a sheet of thin green embryos 111b1, 111b2, 111b3, 111b4, 112b is as shown in FIG. 1G-f and FIG. 1G-g or a thick embryo 111b and a thin green embryo 112b as shown in FIG. 1G-a and FIG. 1G-b; the through hole 117 required for each thin layer of embryos is as shown in FIG. 1G. -f, FIG. 1G-g, FIG. 1G-b and FIG. 1G-a; the conductive layer 118 material and the second upper electrode 122b The material is filled in the through hole 117 for the transfer of current or heat between the heat collecting portion 122b3 of the second upper electrode 122b and the inner heat collecting portion 122b4 or between the inner electrode 181 and the second upper electrode 122b; Printing prints the material of the upper electrode 120b on the desired thin layers of the green embryo, and prints the heat collecting portion 122b3, the narrow portion 122b2 and the outer portion 122b1 of the first upper electrode 121 and the second upper electrode 122b on the substrate as shown in FIG. 1G-c. 110b or the upper surface 11 of the first insulating substrate 111b, as shown in FIG. 1G-d, the inner heat collecting portion 122b4 is printed on the upper surface 13 of the second insulating substrate 112b, and the first upper electrode 121 and the first electrode are as shown in FIG. 1G-h. The heat collecting portion 122b3, the narrow portion 122b2 and the outer portion 122b1 of the second upper electrode 122b are printed on the insulating green sheet 111b1, and the inner heat collecting portion 122b4 of the second upper electrode 122b is printed on the insulating green sheet 111b4; as shown in Fig. 1G-h 1G-i, a plurality of thin green embryos 111b1, 111b2, 111b3, 111b4, and 112b or 1G-h and 1G-i are stacked with a thin green embryo 111b and a thin green embryo 112b as shown in Fig. 1G-e. And then co-firing at a temperature lower than 1100 ° C in a sintering furnace, and then printing the heat generating element 188 and the inner electrode 181 and the lower electrode 130 on the substrate 110b. The lower surface 12 is then sintered at a temperature below 1100 ° C in a sintering furnace. The substrate process of the low temperature co-fired ceramic LTCC is a well-known technology in the industry, but the present invention is applied to the manufacture of the multifunctional protection device, and all the embodiments of the present invention can be used to manufacture all of the present invention by the related art of low temperature co-fired ceramic LTCC. The different substrates 110x of the functional protection device are finally fixed to the upper electrode 120b with the fusible conductor 170.

圖1I係本發明第三實施例之多功能保護裝置100c沿線X-X’的剖面示意圖。圖1J係本發明第三實施例之多功能保護裝置100c沿線Y-Y’的剖面示意圖。請同時參考圖1I、圖1J、圖1G與圖1H,本實施例之多功能保護裝置100c與第二實施例之多功能保護裝置100b相似,主要的差異在:本實施例之多功能保護裝置100c另包含吸附線127。該吸附線127配置在第二上電極122b之集熱部122b3的一端且延伸跨越可熔導體170與 輔助材料128上方至集熱部122b3的另一端,在可熔導體170上方的部分吸附線127,其與可熔導體170之間的距離D小於0.3mm,較佳地是介於0.001mm至0.15mm之間,該吸附線127是一單層的或一多層包覆式的結構,其各層材質包含銅、錫、鉛、鐵、鎳、鋁、鈦、鉑、鎢、鋅、銥、鈷、鈀、銀、金、白金等其中之一或其部分組合成的合金(例如:銅鎳錫合金、鎳錫合金)或其部分組合成的多層金屬(例如:銅鍍錫、銅鍍金),該吸附線127可藉由錫膏焊接、電弧焊接、雷射焊接、熱壓焊接、超音波焊接等製作方法,將吸附線127的兩端,固定且電氣連接在第二上電極122b或集熱部122b3的兩相反端,然並不以此為限,任何業界習知的焊接方式或固定技術或電氣連接的方法,能達到固定且電氣連接都屬本發明的範圍之內。本實施例之吸附線127在所繪示的圖示中為一條圓柱體金屬線,其形狀類似弧形或拱型,然並不以此為限,該吸附線127也可以是一長方體(未繪示)的金屬線,其形狀也可以是ㄇ字型(未繪示),且部分吸附線127的表面與部分可熔導體170的表面也可以相連接(距離0mm),所以該吸附線127跨越可熔導體170與輔助材料128的形狀可以是任何形狀、本身可以是任何形狀的導熱線、該吸附線127的表面可以與可熔導體170的表面相連接或不連接,都屬本發明的範圍之內。該輔助材料128配置在吸附線127與可熔導體170之間且實際物理連接吸附線127與可熔導體170,或該輔助材料128配置在吸附線127與可熔導體170之間以及在吸附線127與第二上電極122b之集熱部122b3之間,且實際物理連接吸附線127與可熔導體170,亦實際物理連接吸附線127與第二上電極122b之集熱部122b3。該輔助材料128其功能是可同時具有防止可熔導體170的表面與吸附線127的表面氧化、傳導熱能以及助熔的作用,藉由表面張力 與毛細現象,導引熔融(或液化)的可熔導體170吸附在吸附線127上,也可導引熔融(或液化)的可熔導體170流向第二上電極122b之集熱部122b3外圍的部分,加速與未熔融之可熔導體170的分離或斷開,減少過電壓或過溫保護所需的動作時間。 Fig. 1I is a schematic cross-sectional view of the multi-function protection device 100c of the third embodiment of the present invention taken along line X-X'. Fig. 1J is a schematic cross-sectional view of the multi-function protection device 100c of the third embodiment of the present invention taken along line Y-Y'. Referring to FIG. 1I, FIG. 1J, FIG. 1G and FIG. 1H, the multi-function protection device 100c of the present embodiment is similar to the multi-function protection device 100b of the second embodiment, and the main difference is: the multi-function protection device of the embodiment 100c additionally includes an adsorption line 127. The adsorption line 127 is disposed at one end of the heat collecting portion 122b3 of the second upper electrode 122b and extends across the fusible conductor 170 and Above the auxiliary material 128 to the other end of the heat collecting portion 122b3, a portion of the adsorption line 127 above the fusible conductor 170 has a distance D from the fusible conductor 170 of less than 0.3 mm, preferably between 0.001 mm and 0.15. Between mm, the adsorption line 127 is a single layer or a multi-layered structure, and the layers thereof are composed of copper, tin, lead, iron, nickel, aluminum, titanium, platinum, tungsten, zinc, lanthanum, cobalt. An alloy (for example: copper-nickel-tin alloy, nickel-tin alloy) or a combination thereof in which one or a combination of palladium, silver, gold, platinum, or the like is combined (for example, copper tin plating, copper gold plating), The adsorption line 127 can fix and electrically connect the two ends of the adsorption line 127 to the second upper electrode 122b or the heat collection by solder paste welding, arc welding, laser welding, hot press welding, ultrasonic welding, or the like. The opposite ends of the portion 122b3 are not limited thereto, and any conventional welding method or fixing technique or electrical connection method can achieve a fixed and electrical connection within the scope of the present invention. The adsorption line 127 of the present embodiment is a cylindrical metal wire in the illustrated figure, and its shape is similar to an arc shape or an arch shape. However, the adsorption line 127 may also be a rectangular parallelepiped. The metal wire may be in the shape of a U-shape (not shown), and the surface of the partial adsorption line 127 may be connected to the surface of the partially fusible conductor 170 (distance 0 mm), so the adsorption line 127 The shape across the fusible conductor 170 and the auxiliary material 128 may be any shape, a heat conductive line which may be any shape itself, and the surface of the adsorption line 127 may or may not be connected to the surface of the fusible conductor 170, which is a Within the scope. The auxiliary material 128 is disposed between the adsorption line 127 and the fusible conductor 170 and physically physically connects the adsorption line 127 with the fusible conductor 170, or the auxiliary material 128 is disposed between the adsorption line 127 and the fusible conductor 170 and at the adsorption line. 127 and the heat collecting portion 122b3 of the second upper electrode 122b, and physically connecting the adsorption line 127 and the fusible conductor 170, and physically connecting the adsorption line 127 and the heat collecting portion 122b3 of the second upper electrode 122b. The auxiliary material 128 functions to simultaneously prevent oxidation of the surface of the fusible conductor 170 and the surface of the adsorption line 127, conduction of thermal energy, and fluxing by surface tension. With the capillary phenomenon, the meltable conductor 170 guided to melt (or liquefy) is adsorbed on the adsorption line 127, and the molten (or liquefied) fusible conductor 170 can also be guided to the periphery of the heat collecting portion 122b3 of the second upper electrode 122b. In part, the separation or disconnection of the non-melted fusible conductor 170 is accelerated to reduce the operating time required for overvoltage or overtemperature protection.

圖1K係本發明第三實施例之多功能保護裝置100d沿線Y-Y’的剖面示意圖。請同時參考圖1K與圖1D,本實施例之多功能保護裝置100d與第一實施例之多功能保護裝置100相似,主要的差異在:本發明第三實施例之多功能保護裝置100d,另包含抑制電弧層129,其配置在第一上電極121與第二上電極122之間,並包覆在第一上電極121與第二上電極122之間部分的可熔導體170表面。該抑制電弧層129的材料包括矽橡膠、無機陶瓷、金屬氧化物、氫氧化鎂以及水玻璃等其中之一或其部分的組合複合物,該抑制電弧層129的技術特徵是當可熔導體170因熱熔融且開始斷開時,因剛開始斷開時的距離很近或似斷不斷時,可能產生電弧而產生高熱,造成多功能保護裝置100d的損壞,所以將抑制電弧層129包覆可熔導體170的表面,當在第一上電極121與第二上電極122之間部分的可熔導體170開始熔斷時,在可熔導體170表面上的抑制電弧層129,可以抑制電弧的產生,降低因電弧產生的高熱,達到保護多功能保護裝置100d的功能。 Fig. 1K is a schematic cross-sectional view of the multi-function protection device 100d of the third embodiment of the present invention taken along line Y-Y'. Referring to FIG. 1K and FIG. 1D simultaneously, the multi-function protection device 100d of the present embodiment is similar to the multi-function protection device 100 of the first embodiment, and the main difference is: the multi-function protection device 100d according to the third embodiment of the present invention, An arc suppression layer 129 is disposed between the first upper electrode 121 and the second upper electrode 122 and covers the surface of the fusible conductor 170 between the first upper electrode 121 and the second upper electrode 122. The material of the arc suppression layer 129 includes a composite composite of one or a portion of ruthenium rubber, inorganic ceramics, metal oxide, magnesium hydroxide, and water glass, and the technical feature of the arc suppression layer 129 is when the fusible conductor 170 When the heat is melted and starts to be disconnected, since the distance at the beginning of the disconnection is very close or continuous, an arc may be generated to generate high heat, causing damage to the multifunctional protection device 100d, so that the arc layer 129 may be suppressed. The surface of the fuse conductor 170, when the fusible conductor 170 between the first upper electrode 121 and the second upper electrode 122 starts to be blown, the arc suppression layer 129 on the surface of the fusible conductor 170 can suppress the generation of an arc. The function of protecting the multifunctional protection device 100d is achieved by reducing the high heat generated by the arc.

圖1L係本發明第四實施例之多功能保護裝置100e沿線X-X’的剖面示意圖。請同時參考圖1L與圖1C,本實施例之多功能保護裝置100e與第一實施例之多功能保護裝置100相似,主要的差異在:本發明第四實施例之多功能保護裝置100e,另包含絕緣外殼190與下絕緣層189,該下絕緣層189配置在熱產生組件180上,該絕緣外殼190配置在基板110上, 且覆蓋基板110上表面之所有物件。該絕緣外殼190的功能是保護基板110上表面的所有物件不受外力或外物的破壞,其材料包含氧化鋁、聚二醚酮、尼龍、橡膠、熱塑型樹脂、熱固型樹脂、紫外光硬化樹脂以及酚甲醛樹脂等其中之一或其部分組合之複合物,該下絕緣層189的技術特徵是可保護熱產生組件180不會受到損壞且有隔熱的效果,使熱不易傳遞到應用系統電路的基板上,其材料包含熱塑型樹脂、熱固型樹脂、環氧樹脂、無機陶瓷材料、低溫共燒陶瓷(LTCC)、玻璃陶瓷、玻璃粉、氧化鋁等其中之一或其部分組合之複合物。 Fig. 1L is a schematic cross-sectional view of the multi-function protection device 100e of the fourth embodiment of the present invention taken along line X-X'. Referring to FIG. 1L and FIG. 1C, the multi-function protection device 100e of the present embodiment is similar to the multi-function protection device 100 of the first embodiment. The main difference is: the multi-function protection device 100e according to the fourth embodiment of the present invention, An insulating housing 190 and a lower insulating layer 189 are disposed. The lower insulating layer 189 is disposed on the heat generating component 180. The insulating housing 190 is disposed on the substrate 110. And covering all the objects on the upper surface of the substrate 110. The function of the insulating housing 190 is to protect all the objects on the upper surface of the substrate 110 from external force or foreign objects, and the material thereof includes alumina, polydiether ketone, nylon, rubber, thermoplastic resin, thermosetting resin, ultraviolet A composite of one of or a combination of a photo-curing resin and a phenol-formaldehyde resin, the technical feature of the lower insulating layer 189 is that the heat-generating component 180 can be protected from damage and has an insulating effect, so that heat is not easily transmitted to The substrate of the application system circuit comprises one of thermoplastic resin, thermosetting resin, epoxy resin, inorganic ceramic material, low temperature co-fired ceramic (LTCC), glass ceramic, glass powder, alumina or the like or Partially combined complex.

圖1M係本發明第五實施例之多功能保護裝置100f沿線Y-Y’的剖面示意圖。請同時參考圖1M與圖1D,本實施例之多功能保護裝置100f與第一實施例之多功能保護裝置100相似,主要的差異在:本實施例之多功能保護裝置100f的可熔導體170f包含寬薄部170f1與厚窄部17f2,寬薄部170f1配置在第二上電極122,厚窄部170f2配置在第一上電極121。寬薄部170f1的截面積與厚窄部170f2的截面積相近(或相同),但厚度不同,寬薄部170f1的厚度低於或小於厚窄部170f2的厚度,寬薄部170f1的寬度大於厚窄部170f2的寬度,寬薄部170f1與第二上電極122電氣連接,厚窄部170f2與第一上電極121電氣連接。本實施例之多功能保護裝置100f的可熔導體170f的技術特徵或優點是:當過電流事件發生時,因可熔導體170f的寬薄部170f1與厚窄部170f2有相近(或相同)的截面積,所以可通過可熔導體170f寬薄部170f1與厚窄部170f2的電流是相同的,所以當過電流通過可熔導體170f時,可熔導體170f會發熱而熔斷,達到過電流保護的功能。當過電壓或過溫事件發生時,熱產生組件180會發熱,第二上電極122聚集熱產生組件180所產生 的熱,且與第二上電極122電氣連接的可熔導體170f之寬薄部170f1的厚度較薄,所以熱產生組件180只需產生較少的熱能來達到更快速熔斷可熔導體170f的效果(或功能),第一實施例中之可熔導體170的厚度相同,故若要熔斷較厚的可熔導體170,需要熱產生組件180產生較多的熱能,才能熔斷可熔導體170,也就是說需要較久的時間才能熔斷可熔導體170,因此第一實施例的多功能保護裝置100,過電壓或過溫保護動作的速度會較第五實施例的多功能保護裝置100f的速度慢。本實施例中有關可熔導體170f的設計,在第一到第四實施例中任一實施例都可依據實際需要加以組合或替換,以達到所需的技術特徵或效果。 Fig. 1M is a schematic cross-sectional view of the multifunction protection device 100f of the fifth embodiment of the present invention taken along line Y-Y'. Referring to FIG. 1M and FIG. 1D simultaneously, the multi-function protection device 100f of the present embodiment is similar to the multi-function protection device 100 of the first embodiment. The main difference is: the fusible conductor 170f of the multi-function protection device 100f of the present embodiment. The wide portion 170f1 and the thick portion 17f2 are included, the wide portion 170f1 is disposed on the second upper electrode 122, and the thick portion 170f2 is disposed on the first upper electrode 121. The cross-sectional area of the wide portion 170f1 is similar to (or the same as) the cross-sectional area of the thick portion 170f2, but the thickness is different, the thickness of the wide portion 170f1 is lower or smaller than the thickness of the thick portion 170f2, and the width of the wide portion 170f1 is larger than the thickness. The width of the narrow portion 170f2, the wide portion 170f1 is electrically connected to the second upper electrode 122, and the thick portion 170f2 is electrically connected to the first upper electrode 121. The technical feature or advantage of the fusible conductor 170f of the multi-function protection device 100f of the present embodiment is that when the overcurrent event occurs, the wide portion 170f1 of the fusible conductor 170f is similar (or identical) to the thick portion 170f2. Since the cross-sectional area is the same as the current of the thick portion 170f1 and the thick portion 170f2 through the fusible conductor 170f, when the overcurrent passes through the fusible conductor 170f, the fusible conductor 170f is heated and melted to achieve overcurrent protection. Features. When an overvoltage or overtemperature event occurs, the heat generating component 180 generates heat, and the second upper electrode 122 collects the heat generating component 180. The heat is thin, and the thickness of the wide portion 170f1 of the fusible conductor 170f electrically connected to the second upper electrode 122 is thin, so that the heat generating assembly 180 only needs to generate less heat to achieve the effect of melting the fusible conductor 170f more quickly. (or function), the thickness of the fusible conductor 170 in the first embodiment is the same, so if the thicker fusible conductor 170 is to be blown, the heat generating component 180 is required to generate more heat energy to melt the fusible conductor 170. That is, it takes a long time to melt the fusible conductor 170. Therefore, the multi-function protection device 100 of the first embodiment has a slower over-voltage or over-temperature protection action than the multi-function protection device 100f of the fifth embodiment. . In the present embodiment, regarding the design of the fusible conductor 170f, any of the first to fourth embodiments can be combined or replaced according to actual needs to achieve the desired technical features or effects.

圖1N係本發明第六實施例之多功能保護裝置100g的俯視示意圖。圖1O係本發明第六實施例之多功能保護裝置100g的仰視示意圖。圖1P繪示為圖1N之多功能保護裝置100g沿線X-X’的剖面示意圖。圖1Q繪示為圖1N之多功能保護裝置100g沿線Y-Y’的剖面示意圖。請同時參考圖1N、圖1O、圖1P、圖1Q、圖1A、圖1B、圖1C以及圖1D,本實施例之多功能保護裝置100g與第一實施例之多功能保護裝置100相似,本實施例之多功能保護裝置100g包括基板110g,是一多層絕緣基板,包含傳導層118,配置在基板110g內;上電極120g,配置在基板110g上,包含第一上電極121g與第二上電極122g;集熱電極125,配置在基板110g內且延伸到第一上電極121g與第二上電極122g之間的基板110g上,集熱電極125與熱產生組件180最近的距離H2介於0.001~0.1mm之間;下電極130,配置在基板110g上,包括一第三下電極133;熱產生組件180,配置在基板110g上,該熱產生組件180的一端經由傳導層118電氣連接集熱電極125,另一端電氣連接 第三下電極133:以及一可熔導體170g或複數個可熔導體170g,配置在上電極120與集熱電極125上,且電氣連接上電極120與集熱電極125。主要的差異在:該集熱電極125,配置在基板110g內且延伸到第一上電極121g與第二上電極122g之間的基板上,且電氣連接可熔導體170g,熱產生組件180的內電極181經傳導層118電氣連接集熱電極125,因此在電氣的等效電路圖上,可熔導體170g被分為在第一上電極121g端的右邊可熔導體170g1與在第二上電極122g端的左邊可熔導體170g2,第二上電極122g的形狀與位置與第一實施例中的第二上電極122不同,且第二上電極122g未與傳導層118電氣連接或實際物理連接。詳細來說,該基板110g是一多層絕緣基板,基板110g內的集熱電極125負責聚集熱產生組件180所產生的熱能並傳導至在基板110g上表面11上的集熱電極125,當然熱產生組件180所產生的熱能也可經由傳導層118傳遞至基板110g上的集熱電極125。基板110g內的集熱電極125與熱產生元件188之間有一層絕緣基板112g,兩者之間的絕緣基板112g的厚度H2小於0.15mm,基板110g內的集熱電極125的結構可以任何形狀或大小,較佳的是基板110g內的集熱電極125距離熱產生元件188最近的平面,其面積與熱產生元件188的面積相似,且兩者之間絕緣基板的厚度H2介於0.001~0.1mm,如此基板110g內的集熱電極125與熱產生元件188之間的熱阻會最小,熱傳導會較佳,基板110g上的集熱電極125聚集熱產生元件188所產生的熱能也愈快。當熱產生組件180發熱時,因本實施例之多功能保護裝置100g之集熱電極125,配置在基板110g內且延伸到第一上電極121g與第二上電極122g之間的基板上,所以本實施例之多功能保護裝置100g中的熱產生組件180加熱到熔斷可熔導體170g的時間會比第一實施例之多功能保護裝置100的時間短或快。圖2 是第六實施例之多功能保護裝置100g的等效電路圖,包含兩保險絲(Fuse)元件(右邊可熔導體170g1與左邊可熔導體170g2)以及一發熱電阻(熱產生組件180)。其中與圖1N、1O、1P與1Q中相關主要的符號都有標示出來。 1N is a schematic plan view of a multi-function protection device 100g according to a sixth embodiment of the present invention. Figure 10 is a bottom plan view of a multi-function protection device 100g according to a sixth embodiment of the present invention. 1P is a cross-sectional view of the multi-function protection device 100g of FIG. 1N taken along line X-X'. Figure 1Q is a cross-sectional view of the multi-function protection device 100g of Figure 1N taken along line Y-Y'. Referring to FIG. 1N, FIG. 10, FIG. 1P, FIG. 1Q, FIG. 1A, FIG. 1B, FIG. 1C, and FIG. 1D, the multi-function protection device 100g of the present embodiment is similar to the multi-function protection device 100 of the first embodiment. The multi-function protection device 100g of the embodiment includes a substrate 110g, which is a multi-layered insulating substrate, and includes a conductive layer 118 disposed in the substrate 110g. The upper electrode 120g is disposed on the substrate 110g and includes a first upper electrode 121g and a second upper surface. The electrode 122g and the heat collecting electrode 125 are disposed in the substrate 110g and extend to the substrate 110g between the first upper electrode 121g and the second upper electrode 122g. The closest distance H2 between the heat collecting electrode 125 and the heat generating component 180 is 0.001. The lower electrode 130 is disposed on the substrate 110g and includes a third lower electrode 133. The heat generating component 180 is disposed on the substrate 110g. One end of the heat generating component 180 is electrically connected to the heat collecting layer via the conductive layer 118. Electrode 125, electrical connection at the other end The third lower electrode 133: and a fusible conductor 170g or a plurality of fusible conductors 170g are disposed on the upper electrode 120 and the collector electrode 125, and electrically connect the upper electrode 120 and the collector electrode 125. The main difference is that the heat collecting electrode 125 is disposed in the substrate 110g and extends onto the substrate between the first upper electrode 121g and the second upper electrode 122g, and electrically connects the fusible conductor 170g to the inside of the heat generating component 180. The electrode 181 is electrically connected to the collector electrode 125 via the conductive layer 118, so on the electrical equivalent circuit diagram, the fusible conductor 170g is divided into the right fusible conductor 170g1 at the end of the first upper electrode 121g and the left end at the end of the second upper electrode 122g. The shape and position of the fusible conductor 170g2 and the second upper electrode 122g are different from those of the second upper electrode 122 in the first embodiment, and the second upper electrode 122g is not electrically connected or physically connected to the conductive layer 118. In detail, the substrate 110g is a multi-layered insulating substrate, and the heat collecting electrode 125 in the substrate 110g is responsible for collecting the heat energy generated by the heat generating component 180 and conducting it to the heat collecting electrode 125 on the upper surface 11 of the substrate 110g, of course, heat. The thermal energy generated by the generating assembly 180 can also be transferred to the collector electrode 125 on the substrate 110g via the conductive layer 118. An insulating substrate 112g is disposed between the heat collecting electrode 125 and the heat generating element 188 in the substrate 110g, and the thickness H2 of the insulating substrate 112g therebetween is less than 0.15 mm, and the structure of the heat collecting electrode 125 in the substrate 110g may be any shape or Preferably, the size of the heat collecting electrode 125 in the substrate 110g is the closest to the heat generating element 188, and the area thereof is similar to the area of the heat generating element 188, and the thickness H2 of the insulating substrate between the two is between 0.001 and 0.1 mm. Therefore, the thermal resistance between the heat collecting electrode 125 and the heat generating element 188 in the substrate 110g is minimized, heat conduction is better, and the heat generated by the heat collecting electrode 125 on the substrate 110g to collect the heat generating element 188 is also faster. When the heat generating component 180 generates heat, the heat collecting electrode 125 of the multifunctional protection device 100g of the present embodiment is disposed in the substrate 110g and extends to the substrate between the first upper electrode 121g and the second upper electrode 122g. The time during which the heat generating component 180 in the multi-function protection device 100g of the present embodiment is heated to fuse the fusible conductor 170g may be shorter or faster than the time of the multi-function protection device 100 of the first embodiment. figure 2 It is an equivalent circuit diagram of the multi-function protection device 100g of the sixth embodiment, comprising two fuse elements (the right fusible conductor 170g1 and the left fusible conductor 170g2) and a heat generating resistor (heat generating component 180). The main symbols associated with Figures 1N, 1O, 1P and 1Q are indicated.

圖1R係本發明第七實施例之多功能保護裝置110h的剖面示意圖。請同時參考圖1R與圖1Q,本實施例之多功能保護裝置100h與第六實施例之多功能保護裝置100g相似,主要的差異在:本實施例之多功能保護裝置100h中之可熔斷導體170h包含中間的寬薄部174h與兩端的窄厚部173h,中間的寬薄部174h電氣連接集熱電極125,兩端的窄厚部173h分別各自電氣連接第一上電極121g與第二上電極122g。需詳細說明的是,可熔導體170h之中間的寬薄部174h配置在集熱電極125上,並電氣連接集熱電極125,可熔導體170h之兩端的窄厚部173h,分別配置在第一上電極121g與第二上電極122g上,並電氣連接第一上電極121g與第二上電極122g。本實施例之多功能保護裝置110h中的可熔導體170h的技術特徵是,假設第六實施例之多功能保護裝置110g中的可熔導體170g的寬度以及厚度,與第七實施例之多功能保護裝置110h中的可熔導體170h之窄厚部173h相同,又可熔導體170h之窄厚部173h與寬薄部174h的寬度以及厚度不同,但剖面的截面積相同,所以可以流經可熔導體170g與可熔導體170h的電流相同,需特別說明的是,當熱產生組件180發熱時,集熱電極125所需熔斷可熔導體170g的熱能會比所需熔斷可熔導體170h的熱能高,理由是,在第七實施例之多功能保護裝置110h之集熱電極125上的可熔導體170h的寬薄部174h其厚度較薄,所以熱產生組件180只需較低的熱能就能熔斷寬薄部174h,反觀,在第六實施例之多功能保護裝置110g之集熱電極125上的可熔導體170g其厚度較厚,所以 需要熱產生組件180產生較高的熱能才能熔斷,結論是因第七實施例之多功能保護裝置110h中的可熔導體170h包括一中間的寬薄部174h以及一兩端的窄厚部173h的設計,所以過電壓或過充或過溫保護的動作速度較快。 1R is a schematic cross-sectional view of a multi-function protection device 110h according to a seventh embodiment of the present invention. Referring to FIG. 1R and FIG. 1Q simultaneously, the multi-function protection device 100h of the present embodiment is similar to the multi-function protection device 100g of the sixth embodiment, and the main difference is: the fusible conductor in the multi-function protection device 100h of the embodiment The 170h includes a middle wide portion 174h and a narrow portion 173h at both ends, and the middle wide portion 174h is electrically connected to the heat collecting electrode 125, and the narrow portions 173h at both ends are electrically connected to the first upper electrode 121g and the second upper electrode 122g, respectively. . It should be noted that the wide portion 174h in the middle of the fusible conductor 170h is disposed on the heat collecting electrode 125, and is electrically connected to the heat collecting electrode 125. The narrow and thick portions 173h of the both ends of the fusible conductor 170h are respectively disposed at the first The upper electrode 121g and the second upper electrode 122g are electrically connected to the first upper electrode 121g and the second upper electrode 122g. The technical feature of the fusible conductor 170h in the multi-function protection device 110h of the present embodiment is that the width and thickness of the fusible conductor 170g in the multi-function protection device 110g of the sixth embodiment are the same as those of the seventh embodiment. The narrow portion 173h of the fusible conductor 170h in the protection device 110h is the same, and the width and thickness of the narrow portion 173h and the wide portion 174h of the meltable conductor 170h are different, but the cross-sectional area of the cross section is the same, so that it can flow through the fusible The current of the conductor 170g is the same as the current of the fusible conductor 170h. Specifically, when the heat generating component 180 generates heat, the heat energy of the heat collecting electrode 125 required to melt the meltable conductor 170g is higher than the heat energy of the desired fusible conductor 170h. The reason is that the wide portion 174h of the fusible conductor 170h on the heat collecting electrode 125 of the multi-function protection device 110h of the seventh embodiment is thin, so that the heat generating assembly 180 can be blown with only low heat energy. The wide portion 174h, in contrast, the thickness of the fusible conductor 170g on the collector electrode 125 of the multi-function protection device 110g of the sixth embodiment is thick, so The heat generating component 180 is required to generate higher thermal energy to be blown, and it is concluded that the soluble conductor 170h in the multifunctional protection device 110h of the seventh embodiment includes a middle wide portion 174h and a narrow thickness portion 173h at both ends. Therefore, overvoltage or overcharge or overtemperature protection is faster.

圖4是本發明之一種電子裝置1之方塊示意圖,本電子裝置1包括電源供應器20或負載20、儲能裝置21、異常偵測控制電路22、開關元件23以及多功能保護裝置100。儲能裝置21包含一個或複數個可充放電的電池,異常偵測控制電路22可偵測儲能裝置21的多點電壓,若發生過電壓事件,則會輸出一信號至開關元件23,請同時參考圖1、圖1A、1B、1C、1D以及圖4,本電子裝置1如何動作說明如下:詳細來說,當本電子裝置1處於充電模式,電源供應器20提供充電電流經第一上電極121、可熔導體170、第二上電極122,到儲能裝置21的一端,提供給儲能裝置21所需要的充電電流,當本電子裝置1處於放電模式,儲能裝置21會輸出電流經第二上電極122、可熔導體170、第一上電極121,到負載20,提供給負載20所需的電壓與電流。當過電流(或異常電流)的事件發生時,可熔導體170會因通過的電流過大或異常而發熱,當功率大過可熔導體170的規格時,就會熔斷可熔導體170,而達到過電流保護的功能。另一異常事件就是過電壓(或過充)或過溫事件,過電壓或過溫事件發生時,流經可熔導體170的電流並無發生異常狀況,所以流經可熔導體170的電流並無法產生足夠的熱能來熔斷可熔導體170,此時異常偵測控制電路22偵測到儲能裝置21發生過電壓事件,且經由輸出端提供一訊號給開關元件23,將接到第三下電極133的開關元件23開通,也就是將外接熱產生組件180的開關元件23的兩端切換至低阻抗或導通狀態,使電流流經熱 產生組件180(從內電極181到熱產生元件188到第三下電極133)到開關元件23的輸出端,正常的狀態,開關元件兩端的電阻或阻抗是很高的,呈現斷路狀態,不容許電流流經熱產生組件180到開關元件的輸出端,經選擇適當的多功能保護裝置100的規格(例如:熱產生組件180的阻值或消耗功率),就可讓此時的電流在流經熱產生組件180時,產生足夠的熱能,達到熔斷可熔導體170的目的,進而將充電電流的路徑切斷,無法繼續進行充電的動作,達到過電壓保護的功能,因多功能保護裝置100其等效電路圖只有一保險絲(Fuse)元件,當可熔導體170熔斷後,儲能裝置21仍處在過電壓狀態,因熱產生組件180的電流迴路仍在,故儲能裝置21可經由熱產生組件180放電,進而解除儲能裝置21過電壓的狀態。當然若異常偵測控制電路22可偵測過溫事件的發生,同理也可達到過溫保護的功能。本發明中其他所有實施例其等效電路圖包含一保險絲(Fuse)元件與一發熱電阻之多功能保護裝置,視實際的需要亦都可適用於圖4所繪示之電子裝置1。 4 is a block diagram of an electronic device 1 of the present invention. The electronic device 1 includes a power supply 20 or a load 20, an energy storage device 21, an abnormality detection control circuit 22, a switching element 23, and a multi-function protection device 100. The energy storage device 21 includes one or a plurality of rechargeable batteries, and the abnormality detection control circuit 22 detects the multi-point voltage of the energy storage device 21. If an overvoltage event occurs, a signal is output to the switching element 23, 1 , 1A, 1B, 1C, 1D and FIG. 4, how the electronic device 1 operates is as follows: In detail, when the electronic device 1 is in the charging mode, the power supply 20 provides a charging current through the first The electrode 121, the fusible conductor 170, and the second upper electrode 122 are supplied to the end of the energy storage device 21 to supply a charging current required by the energy storage device 21. When the electronic device 1 is in the discharging mode, the energy storage device 21 outputs a current. The voltage and current required for the load 20 are supplied to the load 20 via the second upper electrode 122, the fusible conductor 170, and the first upper electrode 121 to the load 20. When an overcurrent (or abnormal current) event occurs, the fusible conductor 170 may generate heat due to excessive or abnormal current passing through. When the power is greater than the specification of the fusible conductor 170, the fusible conductor 170 is blown to reach Overcurrent protection function. Another abnormal event is an overvoltage (or overcharge) or overtemperature event. When an overvoltage or overtemperature event occurs, the current flowing through the fusible conductor 170 does not have an abnormal condition, so the current flowing through the fusible conductor 170 is Sufficient thermal energy is not generated to blow the fusible conductor 170. At this time, the abnormality detecting control circuit 22 detects that an overvoltage event has occurred in the energy storage device 21, and provides a signal to the switching element 23 via the output terminal, which is connected to the third The switching element 23 of the electrode 133 is turned on, that is, both ends of the switching element 23 of the external heat generating component 180 are switched to a low impedance or conduction state, so that current flows through the heat. The generating component 180 (from the inner electrode 181 to the heat generating element 188 to the third lower electrode 133) to the output end of the switching element 23, in a normal state, the resistance or impedance across the switching element is high, exhibiting an open state, and is not allowed Current flows through the heat generating component 180 to the output of the switching element, and by selecting the appropriate specifications of the multi-function protection device 100 (eg, the resistance or power consumption of the heat generating component 180), the current at this time can flow through When the heat generating unit 180 is generated, sufficient heat energy is generated to achieve the purpose of melting the fusible conductor 170, thereby cutting off the path of the charging current, and the charging operation cannot be continued, thereby achieving the function of overvoltage protection, because the multifunctional protection device 100 The equivalent circuit diagram has only one fuse element. When the fusible conductor 170 is blown, the energy storage device 21 is still in an overvoltage state, and since the current loop of the heat generating component 180 is still present, the energy storage device 21 can be generated via heat. The assembly 180 is discharged, thereby releasing the state of the overvoltage of the energy storage device 21. Of course, if the abnormality detection control circuit 22 can detect the occurrence of an over-temperature event, the same function of over-temperature protection can be achieved. The equivalent circuit diagram of all other embodiments of the present invention includes a fuse element and a heat-generating multi-function protection device, which can be applied to the electronic device 1 shown in FIG. 4 according to actual needs.

圖4-1是本發明之一種電子裝置2之方塊示意圖,本電子裝置2包括電源供應器20或負載20、儲能裝置21、異常偵測控制電路22、開關元件23以及多功能保護裝置100g。儲能裝置21包含一個或複數個可充放電的電池,異常偵測控制電路22可偵測儲能裝置21的多點電壓,若發生過電壓事件,則會輸出一信號至開關元件23,請同時參考圖2、圖1N、1O、1P、1Q以及圖4-1,本電子裝置2如何動作說明如下:詳細來說,當本電子裝置2處於充電模式,電源供應器20提供充電電流經第一上電極121g、可熔導體170g、第二上電極122g,到儲能裝置21的一端,提供給儲能裝置21 所需要的充電電流,當本電子裝置2處於放電模式,儲能裝置21會輸出電流經第二上電極122g、可熔導體170g、第一上電極121g,到負載20,提供給負載20所需的電壓與電流。當過電流(或異常電流)的事件發生時,可熔導體170g會因通過的電流過大或異常而發熱,當功率大過可熔導體170g的規格時,就會熔斷可熔導體170g,而達到過電流保護的功能。另一異常事件就是過電壓(或過充)或過溫事件,過電壓或過溫事件發生時,流經可熔導體170g的電流並無發生異常狀況,所以流經可熔導體170g的電流並無法產生足夠的熱能來熔斷可熔導體170g,此時異常偵測控制電路22偵測到儲能裝置21發生過電壓事件,且經由輸出端提供一訊號給開關元件23,將接到第三下電極133的開關元件23開通,也就是將外接熱產生組件180的開關元件23的兩端切換至低阻抗或導通狀態,使電流流經熱產生組件180(從內電極181到熱產生元件188到第三下電極133)到開關元件23的輸出端,正常的狀態,開關元件兩端的電阻或阻抗是很高的,呈現斷路狀態,不容許電流流經熱產生組件180到開關元件的輸出端,經選擇適當的多功能保護裝置100g的規格(例如:熱產生組件180的阻值或消耗功率),就可讓此時的電流在流經熱產生組件180時,產生足夠的熱能,達到熔斷可熔導體170g的目的,進而將充電電流的路徑切斷,無法繼續進行充電的動作,達到過電壓保護的功能,因多功能保護裝置100g其等效電路圖有兩保險絲(Fuse)元件,當可熔導體170g熔斷後,儲能裝置21仍處在過電壓狀態,因熱產生組件180的電流迴路已斷,所以若要解除儲能裝置21的過電壓狀態,必須另外再增加一高阻抗的旁路電阻,作為放電電流的路徑。當然若異常偵測控制電 路22可偵測過溫事件的發生,同理也可達到過溫保護的功能。本發明中其他所有實施例其等效電路圖包含兩保險絲(Fuse)元件與一發熱電阻之多功能保護裝置,視實際的需要亦都可適用於圖4-2所繪示之電子裝置2。 4-1 is a block diagram of an electronic device 2 of the present invention. The electronic device 2 includes a power supply 20 or a load 20, an energy storage device 21, an abnormality detection control circuit 22, a switching element 23, and a multi-function protection device 100g. . The energy storage device 21 includes one or a plurality of rechargeable batteries, and the abnormality detection control circuit 22 detects the multi-point voltage of the energy storage device 21. If an overvoltage event occurs, a signal is output to the switching element 23, 2, FIG. 1N, 1O, 1P, 1Q and FIG. 4-1, how the electronic device 2 operates is as follows: In detail, when the electronic device 2 is in the charging mode, the power supply 20 provides a charging current. An upper electrode 121g, a fusible conductor 170g, and a second upper electrode 122g are supplied to the energy storage device 21 at one end of the energy storage device 21. The required charging current, when the electronic device 2 is in the discharge mode, the energy storage device 21 outputs current through the second upper electrode 122g, the fusible conductor 170g, the first upper electrode 121g, to the load 20, and is supplied to the load 20 Voltage and current. When an overcurrent (or abnormal current) event occurs, the fusible conductor 170g generates heat due to excessive or abnormal current passing through. When the power is larger than the specification of the fusible conductor 170g, the fusible conductor 170g is blown to reach Overcurrent protection function. Another abnormal event is an overvoltage (or overcharge) or overtemperature event. When an overvoltage or overtemperature event occurs, the current flowing through the fusible conductor 170g does not have an abnormal condition, so the current flowing through the soluble conductor 170g is Sufficient thermal energy is not generated to blow the fusible conductor 170g. At this time, the abnormality detecting control circuit 22 detects an overvoltage event of the energy storage device 21, and provides a signal to the switching element 23 via the output terminal, which is connected to the third The switching element 23 of the electrode 133 is turned on, that is, both ends of the switching element 23 of the external heat generating component 180 are switched to a low impedance or conducting state, so that a current flows through the heat generating component 180 (from the inner electrode 181 to the heat generating element 188). The third lower electrode 133) is connected to the output end of the switching element 23. In a normal state, the resistance or impedance across the switching element is high, exhibiting an open state, and does not allow current to flow through the heat generating component 180 to the output end of the switching element. By selecting the appropriate multi-function protection device 100g specifications (e.g., the resistance or power consumption of the heat generating component 180), the current at this time can be generated to generate sufficient heat as it flows through the heat generating assembly 180. The purpose of melting the fusible conductor 170g is achieved, and the path of the charging current is cut off, and the charging operation cannot be continued, thereby achieving the function of overvoltage protection. Since the equivalent circuit diagram of the multi-function protection device 100g has two fuses (Fuse) After the fusible conductor 170g is blown, the energy storage device 21 is still in an overvoltage state, and the current loop of the heat generating component 180 is broken. Therefore, if the overvoltage state of the energy storage device 21 is to be released, an additional one must be added. A high impedance shunt resistor acts as a path for the discharge current. Of course, if abnormal detection control The road 22 can detect the occurrence of an over-temperature event, and the same function can also achieve the function of over-temperature protection. The equivalent circuit diagram of all other embodiments of the present invention includes a two-fuse (Fuse) component and a heat-generating multi-function protection device, which can be applied to the electronic device 2 illustrated in FIG. 4-2 according to actual needs.

本發明所有實施例中所述包含基板110、貫孔117、傳導層118、熱產生組件180、上電極120以及下電極130,都可以用低溫共燒陶瓷(LTCC)材料與製程技術來製作,堆疊後再經燒結爐以低於1100℃的溫度一次或多次共燒完成。 All of the embodiments of the present invention include a substrate 110, a through hole 117, a conductive layer 118, a heat generating component 180, an upper electrode 120, and a lower electrode 130, all of which can be fabricated using low temperature co-fired ceramic (LTCC) materials and process technology. After stacking, it is completed by one or more co-firing at a temperature lower than 1100 ° C through a sintering furnace.

雖然本發明已以實施例揭露如上,本發明的許多特點如上電極、集熱電極有不同的設計,可熔導體有不同設計,都屬於本發明的範圍內,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準,凡合於本發明申請專利範圍之精神與其運用本發明說明書及圖式內容所為之類似變化,均包含於本發明之專利範圍內。 Although the present invention has been disclosed in the above embodiments, many of the features of the present invention, such as electrodes and collector electrodes, have different designs, and different designs of the fusible conductor are within the scope of the present invention, which is not intended to limit the present invention. The scope of protection of the present invention is defined by the scope of the appended claims, and the scope of the present invention is subject to the scope of the appended claims. The spirit of the present invention is similar to the scope of the present invention and the use of the description of the present invention and the accompanying drawings are included in the scope of the present invention.

110‧‧‧基板 110‧‧‧Substrate

130‧‧‧下電極 130‧‧‧ lower electrode

120‧‧‧上電極 120‧‧‧Upper electrode

133‧‧‧第三下電極 133‧‧‧third lower electrode

121‧‧‧第一上電極 121‧‧‧First upper electrode

180‧‧‧熱產生組件 180‧‧‧Heat generating components

122‧‧‧第二上電極 122‧‧‧Second upper electrode

170‧‧‧可熔導體 170‧‧‧Solid conductor

Claims (11)

一種多功能保護裝置,包括:基板,該基板可以是一單層絕緣基板或一多層絕緣基板;上電極,配置在基板上,包含第一上電極與第二上電極;下電極,配置在基板上,包含第三下電極;熱產生組件,配置在基板上,該熱產生組件的一端電氣連接第二上電極,另一端電氣連接第三下電極;以及一可熔導體或複數個可熔導體,配置在上電極上,且電氣連接第一上電極與第二上電極。 A multi-functional protection device includes: a substrate, which may be a single-layer insulating substrate or a multi-layer insulating substrate; an upper electrode disposed on the substrate, including a first upper electrode and a second upper electrode; and a lower electrode disposed at a third lower electrode is disposed on the substrate; a heat generating component is disposed on the substrate, one end of the heat generating component is electrically connected to the second upper electrode, and the other end is electrically connected to the third lower electrode; and a fusible conductor or a plurality of fusible The conductor is disposed on the upper electrode and electrically connects the first upper electrode and the second upper electrode. 如申請專利範圍第1項所述之一種多功能保護裝置,其中該第二上電極另包含內集熱部,該第二上電極之內集熱部配置在基板內或延伸至基板內。 The multi-function protection device of claim 1, wherein the second upper electrode further comprises an inner heat collecting portion, and the inner heat collecting portion of the second upper electrode is disposed in the substrate or extends into the substrate. 如申請專利範圍第1項所述之一種多功能保護裝置,其中該可熔導體可以是一單層的或一多層的結構,多層結構可以是一分層式結構或是一包覆式結構,其相鄰之各層的材料可以有不同的熔點溫度。 The multi-function protection device of claim 1, wherein the fusible conductor can be a single layer or a multi-layer structure, and the multi-layer structure can be a layered structure or a cladding structure. The materials of the adjacent layers may have different melting point temperatures. 如申請專利範圍第1項所述之一種多功能保護裝置,另包含一輔助材料,該輔助材料可配置在第二上電極上或在集熱電極上或在第二上電極與寬薄部上或在集熱電極與寬薄部上,且該輔助材料的熔點或液化點溫度低於可熔斷導體的熔點或液化點溫度。 A multifunctional protection device according to claim 1, further comprising an auxiliary material, which may be disposed on the second upper electrode or on the heat collecting electrode or on the second upper electrode and the wide portion or On the collector electrode and the wide portion, and the melting point or liquefaction point temperature of the auxiliary material is lower than the melting point or liquefaction point temperature of the fusible conductor. 如申請專利範圍第1項所述之一種多功能保護裝置,另包含一吸附線與一輔助材料,該吸附線配置在第二上電極上的一端且延伸跨越可熔導體至第二上電極上相反的另一端,該輔助材料配置在吸附線與可熔導 體之間,以及吸附線與第二上電極之間,且該輔助材料的熔點或液化點溫度低於可熔斷導體的熔點或液化點溫度。 A multifunctional protection device according to claim 1, further comprising an adsorption line and an auxiliary material disposed at one end of the second upper electrode and extending across the fusible conductor to the second upper electrode On the opposite end, the auxiliary material is placed on the adsorption line and the fusible guide Between the bodies, and between the adsorption line and the second upper electrode, and the melting point or liquefaction point temperature of the auxiliary material is lower than the melting point or liquefaction point temperature of the fusible conductor. 如申請專利範圍第1項至第5項中任一項所述之一種多功能保護裝置,其中該可熔導體包含寬薄部與窄厚部,寬薄部電氣連接第二上電極或集熱電極,窄厚部電氣連接第一上電極。 A multi-function protection device according to any one of claims 1 to 5, wherein the fusible conductor comprises a wide thin portion and a narrow thick portion, the wide thin portion electrically connecting the second upper electrode or collecting heat The electrode, the narrow portion is electrically connected to the first upper electrode. 一種多功能保護裝置,包括:基板,是一多層絕緣基板,包含傳導層,配置在基板內;上電極,配置在基板上,包含第一上電極與第二上電極;集熱電極,配置在基板內且延伸到第一上電極與第二上電極之間的基板上,集熱電極與熱產生組件最近的距離介於0.001~0.1mm之間;下電極,配置在基板上,包括一第三下電極;熱產生組件,配置在基板上,該熱產生組件的一端經由傳導層電氣連接集熱電極,另一端電氣連接第三下電極;以及一可熔導體或複數個可熔導體,配置在上電極與集熱電極上,且電氣連接第一上電極、集熱電極以及第二上電極。 A multi-functional protection device comprising: a substrate, a multi-layered insulating substrate, comprising a conductive layer disposed in the substrate; an upper electrode disposed on the substrate, comprising a first upper electrode and a second upper electrode; a collector electrode, configured In the substrate and extending to the substrate between the first upper electrode and the second upper electrode, the closest distance of the heat collecting electrode to the heat generating component is between 0.001 and 0.1 mm; and the lower electrode is disposed on the substrate, including a a third lower electrode; a heat generating component disposed on the substrate, one end of the heat generating component electrically connecting the collector electrode via the conductive layer, the other end electrically connecting the third lower electrode; and a fusible conductor or a plurality of fusible conductors The upper electrode and the heat collecting electrode are disposed, and the first upper electrode, the heat collecting electrode and the second upper electrode are electrically connected. 一種多功能保護裝置,包括:低溫共燒陶瓷(LTCC)基板,是一多層絕緣基板,包含第一上電極、集熱電極、第二上電極、傳導層以及複數個貫孔,第一上電極與第二上電極配置在基板上,集熱電極配置在基板內且延伸到第一上電極與第二上電極之間的基板上,傳導層與部分集熱電極配置在不同之貫孔內,該低溫共燒陶瓷(LTCC)基板是以低溫共燒陶瓷(LTCC)材料與製程技術以及燒結製程共燒製成,燒結溫度在100℃至1100℃之間,且該低溫共燒陶瓷 (LTCC)基板之絕緣材料的熱傳導率小於5W/m.K;第三下電極,配置在基板上;熱產生組件,配置在基板上,該熱產生組件的一端經由傳導層電氣連接集熱電極,另一端電氣連接第三下電極,集熱電極與熱產生組件最近的距離介於0.001~0.1mm之間;以及一可熔導體或複數個可熔導體,配置在第一上電極、集熱電極與第二上電極上,且電氣連接第一上電極、集熱電極以及第二上電極。 A multifunctional protection device comprising: a low temperature co-fired ceramic (LTCC) substrate, which is a multilayer insulating substrate comprising a first upper electrode, a collector electrode, a second upper electrode, a conductive layer and a plurality of through holes, first on The electrode and the second upper electrode are disposed on the substrate, the collector electrode is disposed in the substrate and extends to the substrate between the first upper electrode and the second upper electrode, and the conductive layer and the partial collector electrode are disposed in different through holes The low temperature co-fired ceramic (LTCC) substrate is co-fired by a low temperature co-fired ceramic (LTCC) material and a process technology and a sintering process, and the sintering temperature is between 100 ° C and 1100 ° C, and the low temperature co-fired ceramic (LTCC) substrate insulation material thermal conductivity is less than 5W / m. K; a third lower electrode disposed on the substrate; a heat generating component disposed on the substrate, one end of the heat generating component electrically connected to the collector electrode via the conductive layer, and the other end electrically connected to the third lower electrode, the collector electrode and the heat The closest distance of the generating component is between 0.001 and 0.1 mm; and a fusible conductor or a plurality of fusible conductors disposed on the first upper electrode, the collector electrode and the second upper electrode, and electrically connected to the first upper electrode a collector electrode and a second upper electrode. 如申請專利範圍第7項或第8項所述之一種多功能保護裝置,其中該可熔導體包含中間的寬薄部與兩端的窄厚部,中間的寬薄部電氣連接集熱電極,兩端的窄厚部分別各自電氣連接第一上電極與第二上電極。 A multi-function protection device according to claim 7 or 8, wherein the fusible conductor comprises a wide portion at the middle and a narrow portion at both ends, and the wide portion in the middle is electrically connected to the collector electrode, two The narrow and thick portions of the ends are each electrically connected to the first upper electrode and the second upper electrode, respectively. 如申請專利範圍第1項或第2項或第7項或第8項所述之一種多功能保護裝置,另包含一抑制電弧層,配置在第一上電極與第上二電極之間的可熔導體表面上。 A multifunctional protection device according to claim 1 or 2 or 7 or 8 further comprising a suppression arc layer disposed between the first upper electrode and the second upper electrode On the surface of the fuse conductor. 一種電子裝置,包含:電源供應器或負載,負責提供充電電壓與電流的電源供應器或接收儲能裝置放電電流的負載;儲能裝置,包含一個或複數個可充放電的電池;異常偵測控制電路,負責偵測儲能裝置的電壓或溫度,若有異常則輸出一信號給開關元件;開關元件,正常時關閉多功能保護裝置內之熱產生組件的電流路徑,收到異常偵測控制電路的信號時,開啟熱產生組件的電流路徑,熱產生組 件因電流流過而發熱;以及如申請專利範圍第1項或第2項或第7項或第8項所述之一種多功能保護裝置,第一上電極電氣連接電源供應器或負載,第二上電極電氣連接儲能裝置,第三下電極電氣連接開關元件,異常發生時熔斷第一上電極與第二上電極之間的電流路徑。 An electronic device comprising: a power supply or a load, a power supply for supplying a voltage and a current, or a load for receiving a discharge current of the energy storage device; and an energy storage device comprising one or more rechargeable batteries; an abnormality detection The control circuit is responsible for detecting the voltage or temperature of the energy storage device, and if there is an abnormality, outputting a signal to the switching component; the switching component normally turns off the current path of the heat generating component in the multifunctional protection device, and receives the abnormality detection control. When the signal of the circuit is turned on, the current path of the heat generating component is turned on, and the heat generating group a device that generates heat due to the flow of current; and a multi-function protection device as described in claim 1 or 2 or item 7 or item 8, the first upper electrode is electrically connected to a power supply or load, The upper electrode is electrically connected to the energy storage device, and the third lower electrode is electrically connected to the switching element. When an abnormality occurs, the current path between the first upper electrode and the second upper electrode is blown.
TW103141170A 2014-11-27 2014-11-27 Multifunctional protection device and electronic device TW201619999A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689961B (en) * 2017-07-07 2020-04-01 陳葆萱 Switching element
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689961B (en) * 2017-07-07 2020-04-01 陳葆萱 Switching element
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

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