TW201617216A - Device for sticking adhesive tape - Google Patents

Device for sticking adhesive tape Download PDF

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Publication number
TW201617216A
TW201617216A TW103138450A TW103138450A TW201617216A TW 201617216 A TW201617216 A TW 201617216A TW 103138450 A TW103138450 A TW 103138450A TW 103138450 A TW103138450 A TW 103138450A TW 201617216 A TW201617216 A TW 201617216A
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TW
Taiwan
Prior art keywords
tape
tray
component
receiving cavity
positioning
Prior art date
Application number
TW103138450A
Other languages
Chinese (zh)
Inventor
林立文
向健華
付昭國
Original Assignee
鴻海精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 鴻海精密工業股份有限公司 filed Critical 鴻海精密工業股份有限公司
Priority to TW103138450A priority Critical patent/TW201617216A/en
Publication of TW201617216A publication Critical patent/TW201617216A/en

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Abstract

The invention relates to a manufacturing field, especially relates to a device for sticking adhesive tape. The device for sticking adhesive tape includes a pallet and a moveable part. The pallet includes a receiving cavity. The receiving cavity is used to receive a component on which there is an adhesive tape. The moveable part is located above the pallet. An adhesive tape is placed on the pallet. The moveable part is used to move downward to press the component received in the receiving cavity in response to a drive by a driving part so that the adhesive tape placed on the pallet is able to attach on the component evenly and tightly. The device of the present invention is convenient to use and meet the requirement that the adhesive tape is smoothly attached on the component.

Description

膠帶貼合裝置Tape bonding device

本發明涉及生產製造領域,特別涉及一種用於膠帶貼合的裝置。The present invention relates to the field of manufacturing, and in particular to a device for tape bonding.

在現代電子產品的生產製造中,往往需要將電子產品某些元件表面部分或全部貼上膠帶,以便該元件的組裝,例如,在元件的表面安裝雙面膠或單面膠。然而生產作業員在將膠帶貼合到產品元件的過程中難以保證膠帶平整地貼合到元件上,需要耗費較多的時間,從而影響了生產效率,提高了生產成本。In the manufacture of modern electronic products, it is often necessary to apply some or all of the surface of some components of the electronic product to the tape for assembly of the component, for example, mounting double-sided tape or single-sided tape on the surface of the component. However, in the process of attaching the tape to the product component, the production worker has difficulty in ensuring that the tape is flatly attached to the component, which requires a lot of time, thereby affecting production efficiency and increasing production cost.

有鑑於此,有必要提供一種膠帶貼合裝置,以解決將膠帶貼合到產品元件的過程中難以保證膠帶在元件上的平整性的問題。In view of the above, it is necessary to provide a tape bonding apparatus to solve the problem that it is difficult to ensure the flatness of the tape on the component during the process of bonding the tape to the product component.

一種膠帶貼合裝置,用於將膠帶貼合在一元件上,該膠帶貼合裝置包括托盤和活動部,該托盤包括收容腔,該收容腔用於收容放置有膠帶的元件,該活動部位於該托盤的上方,用於響應一驅動部的驅動向下運動而貼壓收容在托盤上的放置有膠帶的元件,使得放置在元件上的膠帶緊密貼合在元件上。A tape bonding device for attaching an adhesive tape to a component, the tape bonding device comprising a tray and a movable portion, the tray comprising a receiving cavity for receiving an element placed with a tape, the movable portion being located Above the tray, the tape-mounted member housed on the tray is pressed against the downward movement of a drive portion so that the tape placed on the member fits snugly on the member.

本發明中的膠帶貼合裝置,通過驅動部帶動活動部向下運動從而將放置在元件上的膠帶壓合到元件上,使用方便,同時滿足了膠帶平整地貼合在元件上的要求。In the tape bonding device of the present invention, the movable portion is driven downward by the driving portion to press the tape placed on the component onto the component, which is convenient to use and satisfies the requirement that the tape is flatly attached to the component.

圖1為本發明膠帶貼合裝置整體示意圖。1 is a schematic overall view of a tape bonding apparatus of the present invention.

圖2為圖1中的爆炸圖。Figure 2 is an exploded view of Figure 1.

圖3為圖1中托盤結構的俯視圖。Figure 3 is a top plan view of the tray structure of Figure 1.

下面結合附圖及實施方式對本發明提供的膠帶貼合裝置進行進一步的詳細說明。The tape bonding apparatus provided by the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

請一併參考圖1-3。該膠帶貼合裝置100用於將膠帶30貼合在元件12上。例如,該元件12可為平板電腦蓋板,該膠帶貼合裝置100將膠帶30貼合在平板電腦蓋板四周的邊沿位置處等。該貼合裝置100包括托盤10、活動部20和驅動部(圖中未示),該托盤10用於裝載放置有膠帶30的元件12。其中,該膠帶30放置在元件12的上表面。該活動部20位於該托盤10的上方,用於響應驅動部的帶動/驅動而向下運動,而貼壓該托盤10上的元件12,使得放置在元件12上的膠帶30緊密貼合在元件12上。本實施方式中,該膠帶貼合裝置100中的托盤10、活動部20和驅動部(圖中未示)構成一個整體部件,該驅動部為一氣缸,該活動部20可以在氣缸的帶動下在豎直方向上遠離或靠近該托盤10。顯然,該驅動部可為其他任何可驅動兩個部件上下遠離或靠近運動的部件。Please refer to Figure 1-3 together. The tape bonding apparatus 100 is used to attach the tape 30 to the component 12. For example, the component 12 can be a tablet cover that fits the tape 30 to the edge of the tablet cover and the like. The bonding apparatus 100 includes a tray 10, a movable portion 20, and a driving portion (not shown) for loading the component 12 on which the tape 30 is placed. Among them, the tape 30 is placed on the upper surface of the element 12. The movable portion 20 is located above the tray 10 for moving downward in response to the driving/driving of the driving portion, and presses the member 12 on the tray 10 so that the tape 30 placed on the member 12 fits snugly on the member 12 on. In the present embodiment, the tray 10, the movable portion 20, and the driving portion (not shown) in the tape bonding apparatus 100 constitute an integral member, and the driving portion is a cylinder, and the movable portion 20 can be driven by a cylinder. It is away from or close to the tray 10 in the vertical direction. Obviously, the drive can be any other component that can drive the two components up and down or close to the movement.

該托盤10大致為長方形,托盤10面向活動部20的一面的中心位置處設置有收容腔14。該收容腔14用於收容該元件12,在托盤10與活動部20相互遠離時,可將元件12放置於該收容腔14內。其中,該收容腔14為長方形且該收容腔14的深度不大於該元件12的厚度,從而使得元件12放置於收容腔14中時,元件12的上表面外露於該收容腔14。如圖2所示,該托盤10上沿該收容腔14的周邊附近凸設有若干定位針16,該膠帶30粘貼在一膠帶定位膜32的下表面,該膠帶定位膜32上與該定位針16對應的位置處開設有定位孔3201。當元件12收容在該收容腔14中後,該粘貼有膠帶30的膠帶定位膜32上的定位孔與托盤10上的定位針16套接在一起,而使膠帶30固定放置在元件12上。The tray 10 is substantially rectangular, and a receiving cavity 14 is provided at a center position of one side of the tray 10 facing the movable portion 20. The receiving cavity 14 is for receiving the component 12, and the component 12 can be placed in the receiving cavity 14 when the tray 10 and the movable portion 20 are away from each other. The receiving cavity 14 is rectangular and the depth of the receiving cavity 14 is not greater than the thickness of the component 12 such that the upper surface of the component 12 is exposed to the receiving cavity 14 when the component 12 is placed in the receiving cavity 14. As shown in FIG. 2, a plurality of positioning pins 16 are protruded from the vicinity of the periphery of the receiving cavity 14 on the tray 10. The tape 30 is adhered to a lower surface of the tape positioning film 32. The tape positioning film 32 and the positioning pin are disposed. A positioning hole 3201 is opened at a corresponding position of 16. After the component 12 is received in the receiving cavity 14, the positioning hole on the tape positioning film 32 to which the tape 30 is attached is sleeved with the positioning pin 16 on the tray 10, and the tape 30 is fixedly placed on the component 12.

本實施方式中,可以通過預先設置膠帶30和膠帶定位膜32的位置關係,使得粘貼有膠帶30的膠帶定位膜32上的定位孔與托盤10上的定位針16套接在一起後,而使膠帶30固定放置在元件12上需要貼有膠帶的位置處。例如,如圖2所示,若膠帶30需貼合在元件12四周的邊沿處,則將膠帶30設置在膠帶定位膜32四周的邊沿處,從而當膠帶定位膜32上的定位孔與托盤10上的定位針16套接在一起時,可將膠帶30固定放置在元件12的四周的邊沿處。In this embodiment, the positional relationship between the adhesive tape 30 and the tape positioning film 32 can be set in advance, so that the positioning holes on the tape positioning film 32 to which the adhesive tape 30 is attached are sleeved with the positioning pins 16 on the tray 10, thereby making The tape 30 is fixedly placed on the component 12 at a position where the tape needs to be attached. For example, as shown in FIG. 2, if the tape 30 needs to be attached to the edge around the component 12, the tape 30 is placed at the edge of the tape positioning film 32 so that the positioning hole on the tape positioning film 32 and the tray 10 When the upper positioning pins 16 are nested together, the tape 30 can be fixedly placed at the periphery of the component 12.

具體的,該收容腔14的一角向外延伸有一缺口15,用戶可以通過該缺口15可以方便地放置或移除該元件12。Specifically, a corner of the receiving cavity 14 extends outwardly through a notch 15 through which the user can conveniently place or remove the component 12.

該活動部20包括固定板22以及與該固定板22相固定連接的位於固定板22下方的壓板24。該固定板22與壓板24均為長方形,該壓板24的形狀與該收容腔14相配。該固定板22與驅動部相連接且能在驅動部的帶動下向下或向上運動。該固定板22上面向該托盤10一面的兩寬邊的中間位置附近均安裝有一導向杆26,該托盤10上面向固定板22的一面對應位置處開設有與導向杆26相配的收容孔18。當驅動部帶動固定板22以及與該固定板22相連接的壓板24向下運動時,該導向杆26逐漸收容於該收容孔18中。其中,該收容孔18的深度小於該導向杆26的長度。當該壓板24將該膠帶30及膠帶定位膜32緊緊地壓合在元件12上而使膠帶30平整地粘貼在元件12上時,安裝在固定板22上的導向杆26部分收容在該收容孔18中並抵觸在該收容孔18的封閉處,從而限制該壓板24的進一步向下運動。這樣,防止了壓板24將膠帶壓合在元件12上時過分向下運動而壓壞元件12。在一較佳實施方式中,該導向杆26為一彈簧。The movable portion 20 includes a fixing plate 22 and a pressing plate 24 located below the fixing plate 22 and fixedly connected to the fixing plate 22. The fixing plate 22 and the pressing plate 24 are both rectangular, and the shape of the pressing plate 24 matches the receiving cavity 14. The fixing plate 22 is connected to the driving portion and can be moved downward or upward by the driving portion. A guiding rod 26 is mounted on the fixing plate 22 facing the intermediate position of the two wide sides of the one side of the tray 10. The receiving hole 18 of the tray 10 corresponding to the guiding rod 26 is disposed at a corresponding position on the surface of the tray 10 facing the fixing plate 22. When the driving portion drives the fixing plate 22 and the pressing plate 24 connected to the fixing plate 22 to move downward, the guiding rod 26 is gradually received in the receiving hole 18. The depth of the receiving hole 18 is smaller than the length of the guiding rod 26. When the pressure plate 24 presses the tape 30 and the tape positioning film 32 tightly against the component 12 to cause the tape 30 to be flatly pasted on the component 12, the guide bar 26 mounted on the fixing plate 22 is partially housed in the housing. The hole 18 is in contact with the closure of the receiving aperture 18 to limit further downward movement of the pressure plate 24. In this way, the pressure plate 24 is prevented from excessively moving downward when the tape is pressed against the element 12 to crush the element 12. In a preferred embodiment, the guide rod 26 is a spring.

當經過預設的時間後,驅動部帶動壓板24向上運動,作業員從膠帶30上撕除該膠帶定位膜32後,膠帶30就平整地貼合在元件12上。可以理解的是,該膠帶貼合裝置100還可包括一開關(圖中未示),用於啟動該驅動部或關閉該驅動部。After a predetermined period of time, the driving portion drives the pressing plate 24 to move upward, and after the operator tears off the tape positioning film 32 from the tape 30, the tape 30 is flatly attached to the member 12. It can be understood that the tape bonding apparatus 100 can further include a switch (not shown) for starting the driving portion or closing the driving portion.

其中,該托盤10上可包括多個驅動杆(圖中未示),該固定板22還包括多個驅動孔(圖中未示),並通過驅動孔套設於該驅動杆上,該活動部20在驅動部的驅動下沿著該驅動杆上下移動而遠離或靠近托盤10。The tray 10 may include a plurality of driving rods (not shown), and the fixing plate 22 further includes a plurality of driving holes (not shown), and the driving holes are sleeved on the driving rod, the activity The portion 20 is moved up and down along the drive rod by the driving portion to move away from or near the tray 10.

以上實施例僅用於說明本發明的技術方案而非限制,儘管參照較佳實施例對本發明進行了詳細說明,本領域的普通技術人員應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神和實質。The above embodiments are only used to illustrate the technical solutions of the present invention, and the present invention is not limited thereto. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or substituted. Without departing from the spirit and essence of the technical solutions of the present invention.

100‧‧‧膠帶貼合裝置100‧‧‧Adhesive bonding device

10‧‧‧托盤10‧‧‧Tray

20‧‧‧活動部20‧‧‧ Activities Department

30‧‧‧膠帶30‧‧‧ Tape

12‧‧‧元件12‧‧‧ components

14‧‧‧收容腔14‧‧‧ containment chamber

15‧‧‧缺口15‧‧‧ gap

16‧‧‧定位針16‧‧‧ Positioning needle

18‧‧‧收容孔18‧‧‧ receiving holes

22‧‧‧固定板22‧‧‧ Fixed plate

24‧‧‧壓板24‧‧‧Press

26‧‧‧導向杆26‧‧‧ Guide rod

32‧‧‧膠帶定位膜32‧‧‧ Tape positioning film

3201‧‧‧定位孔3201‧‧‧Positioning holes

no

10‧‧‧托盤 10‧‧‧Tray

12‧‧‧元件 12‧‧‧ components

14‧‧‧收容腔 14‧‧‧ containment chamber

15‧‧‧缺口 15‧‧‧ gap

16‧‧‧定位針 16‧‧‧ Positioning needle

18‧‧‧收容孔 18‧‧‧ receiving holes

22‧‧‧固定板 22‧‧‧ Fixed plate

24‧‧‧壓板 24‧‧‧Press

26‧‧‧導向杆 26‧‧‧ Guide rod

30‧‧‧膠帶 30‧‧‧ Tape

32‧‧‧膠帶定位膜 32‧‧‧ Tape positioning film

3201‧‧‧定位孔 3201‧‧‧Positioning holes

Claims (6)

一種膠帶貼合裝置,用於將膠帶貼合在一元件上,其改良在於,該膠帶貼合裝置包括托盤和活動部,該托盤包括一收容腔,該收容腔用於收容放置有膠帶的元件,該活動部位於該托盤的上方,用於響應一驅動部的驅動向下運動而貼壓收容在托盤上的放置有膠帶的元件,使得放置在元件上的膠帶貼合在元件上。A tape bonding device for bonding a tape to a component, wherein the tape bonding apparatus comprises a tray and a movable portion, the tray comprising a receiving cavity for receiving a component on which the tape is placed The movable portion is located above the tray for pressing the tape-mounted member housed on the tray in response to the downward movement of the driving of the driving portion, so that the tape placed on the member is attached to the member. 如申請專利範圍第1項所述的膠帶貼合裝置,其中,該收容腔的深度小於該元件的厚度。The tape bonding apparatus of claim 1, wherein the receiving cavity has a depth smaller than a thickness of the component. 如申請專利範圍第1項所述的膠帶貼合裝置,其中,該收容腔的一角向外延伸有一缺口。The tape bonding apparatus of claim 1, wherein a corner of the receiving cavity extends outwardly. 如申請專利範圍第1項所述的膠帶貼合裝置,其中,包括一膠帶定位膜用於粘貼膠帶,該托盤上沿該收容腔的周邊附近凸設有若干定位針,該膠帶定位膜上與該定位針對應的位置處開設有定位孔,當元件收容在該收容腔中後,該粘貼有膠帶的膠帶定位膜上的定位孔與托盤上的定位針套接在一起而使膠帶固定放置在元件上。The tape bonding device of claim 1, wherein the tape positioning film is used for affixing a tape, and a plurality of positioning pins are protruded along the periphery of the receiving cavity on the tray, and the tape is positioned on the film. The positioning is provided with a positioning hole at a position corresponding to the position. After the component is received in the receiving cavity, the positioning hole on the adhesive tape positioning film of the tape is sleeved with the positioning pin on the tray to fix the tape. On the component. 如申請專利範圍第1項所述的膠帶貼合裝置,其中,該活動部包括固定板以及與該固定板相固定連接的位於固定板下方的壓板,該壓板的形狀與該收容腔相配,該固定板上面向該托盤一面的兩寬邊的中間位置附近均安裝有一導向杆,該托盤上面向壓板的一面對應位置處開設有與導向杆相配的收容孔,該收容孔的深度小於該導向杆的長度。The tape bonding device of claim 1, wherein the movable portion comprises a fixing plate and a pressing plate fixedly connected to the fixing plate and located under the fixing plate, the pressing plate is shaped to match the receiving cavity, A guiding rod is disposed adjacent to an intermediate position of the two sides of the fixing plate facing the two sides of the tray, and a receiving hole corresponding to the guiding rod is disposed at a corresponding position of the tray facing the pressing plate, and the receiving hole has a depth smaller than the guiding rod length. 如申請專利範圍第5項所述的膠帶貼合裝置,其中,該導向杆為一彈簧。
The tape bonding apparatus of claim 5, wherein the guide bar is a spring.
TW103138450A 2014-11-05 2014-11-05 Device for sticking adhesive tape TW201617216A (en)

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TW103138450A TW201617216A (en) 2014-11-05 2014-11-05 Device for sticking adhesive tape

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TW103138450A TW201617216A (en) 2014-11-05 2014-11-05 Device for sticking adhesive tape

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107932984A (en) * 2017-12-19 2018-04-20 上海新洲包装印刷有限公司 A kind of cardboard window film positioning laminating apparatus and its application process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107932984A (en) * 2017-12-19 2018-04-20 上海新洲包装印刷有限公司 A kind of cardboard window film positioning laminating apparatus and its application process

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