TW201614088A - Sputtering target - Google Patents
Sputtering targetInfo
- Publication number
- TW201614088A TW201614088A TW104132009A TW104132009A TW201614088A TW 201614088 A TW201614088 A TW 201614088A TW 104132009 A TW104132009 A TW 104132009A TW 104132009 A TW104132009 A TW 104132009A TW 201614088 A TW201614088 A TW 201614088A
- Authority
- TW
- Taiwan
- Prior art keywords
- sputtering target
- base material
- ppm
- metallic element
- metal member
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C7/00—Alloys based on mercury
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Ceramic Products (AREA)
Abstract
One object of the present invention is to provide a sputtering target, to prevent cracking of the sputtering target material, and to keep it stably on the base material. A sputtering target is provided, comprising: a base material made of a metal, a sputtering target material provided on a surface of the base material and a bonding material provided between the base material and above-described sputtering target material. The bonding material at least comprises a first metallic element and a second metallic element, the concentration of the second metal member relative to the first metal member is 10 ppm to 5000 ppm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014206310 | 2014-10-07 | ||
JP2015179471A JP5937731B2 (en) | 2014-10-07 | 2015-09-11 | Sputtering target |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614088A true TW201614088A (en) | 2016-04-16 |
TWI606133B TWI606133B (en) | 2017-11-21 |
Family
ID=55950947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104132009A TWI606133B (en) | 2014-10-07 | 2015-09-30 | Sputtering target |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP5937731B2 (en) |
KR (3) | KR20160041800A (en) |
TW (1) | TWI606133B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3271496B1 (en) | 2015-03-18 | 2018-12-19 | Umicore | Lithium-containing transition metal oxide target. |
JP6689309B2 (en) * | 2018-03-26 | 2020-04-28 | Jx金属株式会社 | Sputtering target member, sputtering target assembly, and method for manufacturing sputtering target member |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006257511A (en) * | 2005-03-17 | 2006-09-28 | Mitsui Mining & Smelting Co Ltd | Solder alloy for manufacturing sputtering target, and sputtering target using the same |
JP5727740B2 (en) * | 2010-09-24 | 2015-06-03 | 株式会社高純度化学研究所 | Manufacturing method of backing plate |
CN102686767B (en) * | 2010-11-08 | 2014-05-28 | 三井金属矿业株式会社 | Divided sputtering target and method for producing same |
JP5672537B2 (en) * | 2010-12-28 | 2015-02-18 | 東ソー株式会社 | Cylindrical sputtering target and manufacturing method thereof |
JP2012184469A (en) * | 2011-03-04 | 2012-09-27 | Mitsubishi Materials Corp | METHOD FOR PRODUCING In SPUTTERING TARGET |
-
2015
- 2015-09-11 JP JP2015179471A patent/JP5937731B2/en active Active
- 2015-09-30 TW TW104132009A patent/TWI606133B/en active
- 2015-10-06 KR KR1020150140351A patent/KR20160041800A/en active Application Filing
-
2016
- 2016-05-12 JP JP2016095730A patent/JP6053977B2/en active Active
-
2017
- 2017-05-04 KR KR1020170056851A patent/KR20170055020A/en active Search and Examination
-
2018
- 2018-11-12 KR KR1020180138442A patent/KR20180124003A/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20170055020A (en) | 2017-05-18 |
KR20180124003A (en) | 2018-11-20 |
JP5937731B2 (en) | 2016-06-22 |
JP2016176147A (en) | 2016-10-06 |
JP2016074977A (en) | 2016-05-12 |
KR20160041800A (en) | 2016-04-18 |
JP6053977B2 (en) | 2016-12-27 |
TWI606133B (en) | 2017-11-21 |
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