TW201613851A - Stabilization of tris(2-hydroxyethyl)methylammonium hydroxide against decomposition with dialkyhydroxylamine - Google Patents
Stabilization of tris(2-hydroxyethyl)methylammonium hydroxide against decomposition with dialkyhydroxylamineInfo
- Publication number
- TW201613851A TW201613851A TW104123286A TW104123286A TW201613851A TW 201613851 A TW201613851 A TW 201613851A TW 104123286 A TW104123286 A TW 104123286A TW 104123286 A TW104123286 A TW 104123286A TW 201613851 A TW201613851 A TW 201613851A
- Authority
- TW
- Taiwan
- Prior art keywords
- hydroxyethyl
- tris
- dialkyhydroxylamine
- stabilization
- methylammonium hydroxide
- Prior art date
Links
- IJGSGCGKAAXRSC-UHFFFAOYSA-M tris(2-hydroxyethyl)-methylazanium;hydroxide Chemical compound [OH-].OCC[N+](C)(CCO)CCO IJGSGCGKAAXRSC-UHFFFAOYSA-M 0.000 title abstract 3
- 238000000354 decomposition reaction Methods 0.000 title 1
- 230000006641 stabilisation Effects 0.000 title 1
- 238000011105 stabilization Methods 0.000 title 1
- 239000007864 aqueous solution Substances 0.000 abstract 2
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 230000000087 stabilizing effect Effects 0.000 abstract 2
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- -1 organic acid salts Chemical class 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3272—Urea, guanidine or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462026082P | 2014-07-18 | 2014-07-18 | |
| US62/026,082 | 2014-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613851A true TW201613851A (en) | 2016-04-16 |
| TWI663148B TWI663148B (zh) | 2019-06-21 |
Family
ID=55079077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104123286A TWI663148B (zh) | 2014-07-18 | 2015-07-17 | 使用二烷基羥胺對抗分解以穩定三（２－羥乙基）甲基氫氧化胺 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170158993A1 (zh) |
| EP (1) | EP3169744A1 (zh) |
| JP (1) | JP2017529318A (zh) |
| KR (1) | KR20170036708A (zh) |
| CN (1) | CN106536668A (zh) |
| TW (1) | TWI663148B (zh) |
| WO (1) | WO2016011329A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10100272B2 (en) * | 2014-07-18 | 2018-10-16 | Cabot Microelectronics Corporation | Cleaning composition following CMP and methods related thereto |
| TWI673357B (zh) * | 2016-12-14 | 2019-10-01 | 美商卡博特微電子公司 | 自化學機械平坦化基板移除殘留物之組合物及方法 |
| JP7245840B2 (ja) * | 2018-01-12 | 2023-03-24 | アジレント・テクノロジーズ・インク | 電気泳動分離用分解剤としてのトリ－およびテトラ－ヒドロキシル第四級アンモニウム化合物の使用 |
| JP6518822B1 (ja) * | 2018-06-07 | 2019-05-22 | 内外化学製品株式会社 | カルボヒドラジドの安定化方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59134752A (ja) * | 1983-01-18 | 1984-08-02 | Sanyo Chem Ind Ltd | 第４級アンモニウム水酸化物の組成物 |
| US5176849A (en) * | 1992-04-15 | 1993-01-05 | W. R. Grace & Co.-Conn. | Composition and method for scavenging oxygen |
| US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| JP5224228B2 (ja) * | 2006-09-15 | 2013-07-03 | Ｎｌｔテクノロジー株式会社 | 薬液を用いた基板処理方法 |
| TW200940706A (en) * | 2007-10-29 | 2009-10-01 | Ekc Technology Inc | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions |
| JP2011502281A (ja) * | 2007-10-31 | 2011-01-20 | イー．ケー．シー．テクノロジー．インコーポレーテッド | フォトレジスト剥離用化合物 |
| US8404626B2 (en) * | 2007-12-21 | 2013-03-26 | Lam Research Corporation | Post-deposition cleaning methods and formulations for substrates with cap layers |
| WO2010084033A2 (en) * | 2009-01-22 | 2010-07-29 | Basf Se | Composition for post chemical-mechanical polishing cleaning |
| US8101561B2 (en) * | 2009-11-17 | 2012-01-24 | Wai Mun Lee | Composition and method for treating semiconductor substrate surface |
| CA2851406C (en) * | 2012-04-13 | 2019-12-17 | Huntsman Petrochemical Llc | Using novel amines to stabilize quaternary trialkylalkanolamines |
-
2015
- 2015-07-17 EP EP15821985.7A patent/EP3169744A1/en not_active Withdrawn
- 2015-07-17 WO PCT/US2015/040871 patent/WO2016011329A1/en active Application Filing
- 2015-07-17 CN CN201580039281.4A patent/CN106536668A/zh active Pending
- 2015-07-17 TW TW104123286A patent/TWI663148B/zh not_active IP Right Cessation
- 2015-07-17 US US15/327,336 patent/US20170158993A1/en not_active Abandoned
- 2015-07-17 JP JP2017502783A patent/JP2017529318A/ja active Pending
- 2015-07-17 KR KR1020177004151A patent/KR20170036708A/ko unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017529318A (ja) | 2017-10-05 |
| CN106536668A (zh) | 2017-03-22 |
| KR20170036708A (ko) | 2017-04-03 |
| WO2016011329A1 (en) | 2016-01-21 |
| EP3169744A1 (en) | 2017-05-24 |
| US20170158993A1 (en) | 2017-06-08 |
| TWI663148B (zh) | 2019-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |