TW201612975A - Coating material, pattern forming method, and method for manufacturing electronic device - Google Patents

Coating material, pattern forming method, and method for manufacturing electronic device

Info

Publication number
TW201612975A
TW201612975A TW104130511A TW104130511A TW201612975A TW 201612975 A TW201612975 A TW 201612975A TW 104130511 A TW104130511 A TW 104130511A TW 104130511 A TW104130511 A TW 104130511A TW 201612975 A TW201612975 A TW 201612975A
Authority
TW
Taiwan
Prior art keywords
coating material
electronic device
pattern forming
pattern
forming method
Prior art date
Application number
TW104130511A
Other languages
Chinese (zh)
Other versions
TWI664675B (en
Inventor
Kenichi Umeda
Fumihiko Mochizuki
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201612975A publication Critical patent/TW201612975A/en
Application granted granted Critical
Publication of TWI664675B publication Critical patent/TWI664675B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
    • H01L21/471—Inorganic layers
    • H01L21/473—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

A coating material of the invention is configured to form a pattern having the highest point of droplet ejection in a region of within 20% from the center of the droplet ejection. The coating material includes a raw material, and two types of solvents A and B being good solvents having a solubility parameter (SP value) of 20.3 MPa<SP>1/2</SP> or less. The solvent A has higher surface tension and higher vapor pressure than the solvent B, and is contained in 20% to 50% in terms of solvent volume content. A pattern forming method of the invention forms the pattern using the coating material. A method for manufacturing an electronic device of the invention manufactures at least one layer of an electronic device according to a pattern obtained by film formation by the pattern forming method.
TW104130511A 2014-09-26 2015-09-16 Coating material, pattern forming method, and method for manufacturing electronic device TWI664675B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014197000 2014-09-26
JP2014-197000 2014-09-26

Publications (2)

Publication Number Publication Date
TW201612975A true TW201612975A (en) 2016-04-01
TWI664675B TWI664675B (en) 2019-07-01

Family

ID=55580891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104130511A TWI664675B (en) 2014-09-26 2015-09-16 Coating material, pattern forming method, and method for manufacturing electronic device

Country Status (4)

Country Link
JP (1) JP6385449B2 (en)
KR (1) KR101981408B1 (en)
TW (1) TWI664675B (en)
WO (1) WO2016047362A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170014946A (en) * 2015-07-31 2017-02-08 삼성에스디아이 주식회사 Composition for forming silica layer, method for manufacturing silica layer, and silica layer
JP2020111651A (en) * 2019-01-09 2020-07-27 凸版印刷株式会社 Coating agent, printed matter and production method of printed matter
KR102707503B1 (en) * 2019-12-17 2024-09-13 코니카 미놀타 가부시키가이샤 Ink composition for forming an electronic device sealing layer, method for forming an electronic device sealing layer, and electronic device sealing layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09125006A (en) * 1995-10-30 1997-05-13 Tokyo Ohka Kogyo Co Ltd Polysilazane coating liquid and formation of ceramic coating layer using the same
JPH1191039A (en) * 1997-09-19 1999-04-06 Teijin Ltd Medical mold-releasing film
JP2000208774A (en) * 1999-01-18 2000-07-28 Seiko Epson Corp Thin-film transistor, photoelectric device, and their manufacture
CN1223011C (en) * 1999-03-30 2005-10-12 精工爱普生株式会社 Method of manufacturing solar cell
CA2363098C (en) * 1999-12-16 2004-11-30 Asahi Glass Company, Limited Polysilazane composition and coated molded product having its cured material
JP2001279134A (en) * 2000-03-31 2001-10-10 Seiko Epson Corp Delivery composition and method for manufacturing functional membrane
JP4836061B2 (en) * 2005-05-26 2011-12-14 株式会社豊田自動織機 Coating composition, method for preparing coating composition, method for producing transparent protective film using coating composition, and organic glass having transparent protective film
JP2008066567A (en) 2006-09-08 2008-03-21 Ricoh Co Ltd Wiring pattern, electronic element using it, organic semiconductor element, laminating wiring pattern and laminating wiring substrate
JP5480510B2 (en) * 2008-03-31 2014-04-23 住友化学株式会社 Organic semiconductor composition, organic thin film, and organic thin film element comprising the same
JP2010180301A (en) * 2009-02-04 2010-08-19 Canon Chemicals Inc Modified polysilazane and coating liquid
JP2014051637A (en) * 2012-09-10 2014-03-20 Tokyo Institute Of Technology Silica composite material, coating composition, and method for producing silica composite membrane
WO2014061710A1 (en) * 2012-10-17 2014-04-24 三菱瓦斯化学株式会社 Resist composition

Also Published As

Publication number Publication date
TWI664675B (en) 2019-07-01
JPWO2016047362A1 (en) 2017-07-06
JP6385449B2 (en) 2018-09-05
KR20170045287A (en) 2017-04-26
WO2016047362A1 (en) 2016-03-31
KR101981408B1 (en) 2019-05-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees