TW201612459A - LED heat dissipation substrate manufacturing process and structure thereof - Google Patents

LED heat dissipation substrate manufacturing process and structure thereof

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Publication number
TW201612459A
TW201612459A TW103132209A TW103132209A TW201612459A TW 201612459 A TW201612459 A TW 201612459A TW 103132209 A TW103132209 A TW 103132209A TW 103132209 A TW103132209 A TW 103132209A TW 201612459 A TW201612459 A TW 201612459A
Authority
TW
Taiwan
Prior art keywords
conducting
conducting plate
manufacturing process
cutout
flexible substrate
Prior art date
Application number
TW103132209A
Other languages
Chinese (zh)
Other versions
TWI588405B (en
Inventor
Wei-Jia Huang
Original Assignee
Wei-Jia Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wei-Jia Huang filed Critical Wei-Jia Huang
Priority to TW103132209A priority Critical patent/TWI588405B/en
Publication of TW201612459A publication Critical patent/TW201612459A/en
Application granted granted Critical
Publication of TWI588405B publication Critical patent/TWI588405B/en

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Abstract

The present invention relates to a LED heat dissipation substrate manufacturing process and a structure thereof. The method mainly includes: performing a first-time cutout on a flexible substrate and defining a first conducting plate, a second conducting plate, and third conducting plates connected to each other; arranging a cover film on a surface of the flexible substrate for partially covering each of adjacent first cutout areas; forming a plurality of second cutout areas on the cover film and simultaneously performing a second-time cutout on the flexible substrate so as to allow the first conducting plate, the second conducting plate and the third conducting plates not to be connected to each other; connecting each LED die between each of the third conducting plates; and using a first conducting section and a second conducting section to connect the first conducting plate, the second conducting plate and the third conducting plates in series, and respectively connecting a positive wire and a negative wire to the first conducting plate and the second conducting plate for energizing and exciting the LED dies. Accordingly, the present invention can be flexible, have unlimited length, and be manufactured continuously without conventional plating and etching processes during the manufacturing process. Therefore, it does not need any washing and generate any waste water and thereby achieves the purpose of environmental protection.
TW103132209A 2014-09-18 2014-09-18 LED cooling substrate process and its structure TWI588405B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103132209A TWI588405B (en) 2014-09-18 2014-09-18 LED cooling substrate process and its structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103132209A TWI588405B (en) 2014-09-18 2014-09-18 LED cooling substrate process and its structure

Publications (2)

Publication Number Publication Date
TW201612459A true TW201612459A (en) 2016-04-01
TWI588405B TWI588405B (en) 2017-06-21

Family

ID=56360819

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132209A TWI588405B (en) 2014-09-18 2014-09-18 LED cooling substrate process and its structure

Country Status (1)

Country Link
TW (1) TWI588405B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106439684A (en) * 2016-09-30 2017-02-22 武汉通畅汽车电子照明有限公司 Automobile signal lamp adopting laser etching technique
CN108831982A (en) * 2018-05-03 2018-11-16 曾玠澄 LED circuit processing procedure and its structure
TWI693694B (en) * 2018-04-19 2020-05-11 曾玠澄 Process and structure of LED circuit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201117952A (en) * 2009-11-20 2011-06-01 Tian-De Lan Composite heat dissipation substrate
CN102117867A (en) * 2010-10-15 2011-07-06 陈林 Manufacturing method of LED (light emitting diode) heat radiating substrate
CN101975384A (en) * 2010-10-15 2011-02-16 陈林 Manufacturing method of radiating structure of LED (Light Emitting Diode) lamp
TWI467819B (en) * 2011-12-23 2015-01-01 Ind Tech Res Inst Light emitting chip and mathod of fabricating light emitting chip
TWM437430U (en) * 2012-05-22 2012-09-11 Green Crystal Energy Ltd Illumination equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106439684A (en) * 2016-09-30 2017-02-22 武汉通畅汽车电子照明有限公司 Automobile signal lamp adopting laser etching technique
TWI693694B (en) * 2018-04-19 2020-05-11 曾玠澄 Process and structure of LED circuit
CN108831982A (en) * 2018-05-03 2018-11-16 曾玠澄 LED circuit processing procedure and its structure

Also Published As

Publication number Publication date
TWI588405B (en) 2017-06-21

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MM4A Annulment or lapse of patent due to non-payment of fees