TW201611043A - Conductive film - Google Patents

Abstract

A conductive film comprises insulation substrates, conductive layers formed thereon and terminals that electric connecting to the aforesaid conductive layers. The conductive layers consist of metal thin wires and then form random patterns in the shape of a polygon opening section. Among the conductive layers, the number of metal thin wires that connecting to each aforesaid terminal is more than two respectively and the maximum distance between the junction points of the metal thin wires and the terminals is above 60 [mu]m.

Description

Conductive film

The present invention relates to a conductive film having a conductive layer in which a shape in which an opening portion is formed by a metal thin wire is a polygonal random pattern, and particularly relates to a conductive film excellent in reliability related to conduction.

In recent years, as an input device of a portable terminal and a computer, a touch panel is often used. The touch panel is disposed on the surface of a display device such as an LCD (Liquid Crystal Display), and detects a position where a finger or the like contacts, and performs an input operation. As the position detecting method in the touch panel, for example, a resistive film method and a capacitive method are known.

There is a touch panel in which a plurality of grid-shaped conductive layers functioning as electrodes are provided on an insulating substrate, and terminal portions are provided in the respective electrodes, and each terminal portion is connected by wiring and detection of contact position or proximity position is detected. Control department.

For example, in Patent Document 1, a plurality of first conductive patterns having a mesh pattern in which different mesh shapes are randomly arranged without a gap are formed on one main surface of a transparent substrate. A plurality of second conductive patterns having the same mesh pattern as the first conductive pattern are formed on the other main surface of the transparent substrate. A first wiring portion is provided at each end of each of the first conductive patterns. Further, each of the first conductive patterns is electrically connected to the first terminal wiring pattern via each of the first wiring portions. Further, a second wiring portion is provided at each end portion of each of the second conductive patterns. Further, each of the second conductive patterns is electrically connected to the second terminal wiring pattern via each of the second wiring portions.

Prior art literature

Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2013-37683

[Problems to be solved by the invention]

In the case of the conductive layer having the random pattern shown in Patent Document 1, as shown in FIG. 8, the thin metal wires 106 constituting the random pattern 104 are sometimes concentrated on the connection portion between the conductive layer 100 and the terminal portion 102. In addition, reference numeral 108 in Fig. 8 denotes a wiring connected to the terminal portion 102. This is a problem that is unlikely to occur when the polygons constituting the mesh are periodic, and this is a significant problem in a random pattern in which the connection of the terminal portions is not always the same shape.

In the step of forming the conductive layer 100, when foreign matter or the like adheres to the pattern portion of the region A in which the fine metal wires 106 are concentrated, when the conductive layer 100 is formed, patterning is likely to occur at the connection portion between the conductive layer 100 and the terminal portion 102. bad. As a result, contact failure between the conductive layer 100 and the terminal portion 102 is likely to occur, reliability associated with conduction is lowered, and yield is deteriorated.

Further, when the conductive layer 100 and the terminal portion 102 are connected by one thin metal wire 106, when foreign matter or the like adheres to the pattern portion of one metal thin wire 106 to be connected, patterning failure occurs at the joint portion, and a conductive layer is easily generated. The contact with the terminal portion 102 is poor, the reliability associated with conduction is lowered, and the yield is deteriorated.

An object of the present invention is to provide a conductive film excellent in reliability related to conduction based on the problems of the prior art.

[Means for solving problems]

In order to achieve the above object, the present invention provides a conductive film having: an insulating substrate; a conductive layer formed on the insulating substrate; and a terminal portion electrically connected to the conductive layer, the conductive layer being composed of a thin metal wire In the configuration, the shape of the opening is a polygonal random pattern, and the number of the thin metal wires connected to each terminal portion in the conductive layer is two or more, and the maximum between the connection points of the metal thin wires and the terminal portion The distance is 60 μm or more.

Preferably, the conductive film has wiring for connecting the terminal portion to an external device. Preferably, the width of the terminal portion is narrower than the width of the conductive layer.

For example, the random pattern is a pattern in which at least one of the arrangement pitch, the angle, the length, and the shape is not fixed with respect to the polygon constituting the pattern. Here, as for the polygon, a part or all of the side may be curved as long as it is substantially a polygon.

In this case, for example, the random pattern is a pattern obtained by maintaining a regular rhombus shape holding angle and imparting irregularity to the pitch, and the opening portion is a parallelogram. Further, the random pattern may be a pattern obtained by giving an irregularity to the angle with respect to the angle of the rhombic shape.

The terminal portion may be formed of a frame-shaped, mesh-shaped or linear conductor. For example, in the case where the terminal portion is constituted by a mesh-shaped conductor, the mesh of the terminal portion is a fixed mesh. Further, for example, when the terminal portion is formed of a mesh-shaped conductor, the pitch of the mesh of the terminal portion is smaller than the pitch of the opening of the conductive layer. Further, for example, the wiring may be formed of a grid-shaped conductor.

[Effect of the invention]

According to the present invention, it is possible to obtain a conductive film excellent in reliability related to conduction. Moreover, the manufacturing yield is good, and productivity can be improved.

Hereinafter, the conductive film of the present invention will be described in detail based on preferred embodiments shown in the drawings. Further, the present invention is not limited to the embodiments shown below.

In addition, in the following, "~" which shows a numerical range contains the numerical value shown on both sides. For example, ε is a numerical value α to a numerical value β, and means that the range of ε is a range including the numerical value α and the numerical value β, and if expressed by a mathematical symbol, α ≦ ε ≦ β.

Briefly, transparent means that the light transmittance is at least 60% or more, preferably 80% or more, more preferably 90% or more, and still more preferably 95% or more in the visible light wavelength (wavelength: 400 nm to 800 nm).

1(a) is a schematic plan view showing a touch panel having a conductive film according to an embodiment of the present invention, and FIG. 1(b) is a schematic cross-sectional view of a touch panel using a conductive film according to an embodiment of the present invention.

The conductive film of the present invention can be used, for example, for a touch panel. As a specific example, for example, the touch panel 10 using the conductive film 12 shown in (a) and (b) of FIG. 1 is demonstrated.

The touch panel 10 is used together with a display device such as an LCD, and is provided on the display device. Therefore, in order to recognize the image displayed in the display device, it is transparent. The display device is not particularly limited as long as it can display an image including an animation or the like on the screen. For example, a liquid crystal display device, an organic EL device, electronic paper, or the like can be used.

The touch panel 10 has a conductive film 12 and a controller 14, and the conductive film 12 and the controller 14 are connected by, for example, an FPC (Flexible Circuit Substrate) 15. Regarding the contact with the touch panel 10, the controller 14 detects a position in the touch panel 10 in which the electrostatic capacitance changes due to contact of a finger or the like. The controller 14 is an external device of the conductive film 12, and is constituted, for example, by a known structure used for position detection of the capacitive touch panel.

The X direction and the Y direction shown in (a) of Fig. 1 are orthogonal. In the conductive film 12, a plurality of first conductive layers 20 extending in the X direction are disposed on the insulating substrate 16 with a space in the Y direction. Further, a plurality of second conductive layers 30 extending in the Y direction are disposed with a space in the X direction.

Each of the first conductive layers 20 is electrically connected to the first terminal portion 22 at one end thereof. Further, each of the first terminal portions 22 is electrically connected to the first wiring 24. Each of the first wires 24 is collected in the connector portion 26, and is connected to the controller 14 via the FPC 15.

Each of the second conductive layers 30 is electrically connected to the second terminal portion 32 at one end thereof. Each of the second terminal portions 32 is electrically connected to the conductive second wiring 34. Each of the second wires 34 is collected in the connector portion 36, and is connected to the controller 14 via the FPC 15. The terminal portion may be disposed not only at one end of the conductive layer but also at both ends, and electrically connected to the wiring and collected in the respective connector portions.

The first conductive layer 20, the first terminal portion 22, the first wiring 24, and the connector portion 26 have the same configuration as the second conductive layer 30, the second terminal portion 32, the second wiring 34, and the connector portion 36.

Each of the first conductive layer 20 and the second conductive layer 30 is schematically illustrated as a rod shape, but the structure thereof will be described in detail later.

As shown in FIG. 1(b), in the conductive film 12, the first conductive layer 20 is formed on the surface 16a of the insulating base material 16, and the second conductive layer 30 is formed on the back surface 16b of the insulating base material 16. Each of the first conductive layer 20 and the second conductive layer 30 is composed of a thin metal wire 40. Each of the first conductive layer 20 and the second conductive layer 30 functions as a detecting electrode in the touch panel 10. The protective layer 42 is provided on the first conductive layer 20 via the adhesive layer 41, and the protective layer 44 is provided on the second conductive layer 30 via the adhesive layer 43.

By forming the first conductive layer 20 and the second conductive layer 30 on each surface of one insulating base material 16, the positional relationship between the first conductive layer 20 and the second conductive layer 30 can be reduced even if the insulating base material 16 is shrunk. shift.

The insulating base material 16 supports the first conductive layer 20 and the second conductive layer 30, and is made of an electrically insulating material. The insulating substrate 16 is transparent. As the insulating base material 16, for example, a plastic film, a plastic plate, a glass plate, or the like can be used. The plastic film and the plastic plate may be, for example, polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyethylene (PE), polypropylene (PP), Polyolefins, ethylene vinyl acetate (EVA), cycloolefin polymers (COP), cycloolefin copolymers (COC) and other polyolefins, vinyl resins, and other polycarbonates (PC), polyamines, It is composed of polyimine, acrylic resin, triacetyl cellulose (TAC), and the like. From the viewpoints of light transmittance, heat shrinkability, and processability, it is preferably composed of polyolefins such as polyethylene terephthalate (PET), cycloolefin polymer (COP), and cyclic olefin copolymer (COC). .

As the insulating base material 16, a processed support body subjected to at least one of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment can be used. By performing the above treatment, a hydrophilic group such as an OH group is introduced onto the surface of the treated support, and the adhesion to the first conductive layer 20 and the second conductive layer 30 is further improved. In the above treatment, atmospheric pressure plasma treatment is preferred in terms of further improving the adhesion to the first conductive layer 20 and the second conductive layer 30.

In the first conductive layer 20 and the second conductive layer 30, a random pattern 60 in which the opening 46 is formed by the metal thin wires 40 and the shape of the opening 46 is polygonal is formed (see FIG. 2(a)). The random pattern 60 is not particularly limited as long as the shape of the opening portion 46 is a polygon. The random pattern 60 is, for example, a pattern in which at least one of the arrangement pitch, the angle, the length, and the shape is not fixed to the polygon constituting the pattern.

The shape of the opening portion 46 formed of the thin metal wires 40 is not limited to a specific shape, and is, for example, a combination of an equilateral triangle, an isosceles triangle, a right triangle, or the like, a triangle, a square, a rectangle, a rhombus, a parallelogram, a trapezoid, or the like. (positive) hexagonal, (positive) octagon, etc. (positive) n-gon, star, etc.

In addition, the "polygon" contains not only the complete polygon in geometry, but also the "substantial polygon" that has been slightly modified to the full polygon. As an example of a slight change, a point element and a line element which are smaller than the shape of the opening 46 formed by the thin metal wire 40, a partial defect of each side of the thin metal wire 40 forming the opening 46, and a side curve are used. The situation, etc.

The fine metal wire 40 is not particularly limited, and is formed, for example, of ITO (Indium Tin Oxide), Au, Ag, or Cu. Further, the metal thin wires 40 may be made of a material containing a binder in ITO, Au, Ag or Cu. The metal thin wire 40 is easily subjected to bending processing by containing an adhesive, and the bending resistance is improved. Therefore, it is preferable that the metal thin wires 40 are composed of a conductor including a binder. As the binder, a binder used in the wiring of the conductive film can be suitably used. For example, the binder described in JP-A-2013-149236 can be used.

The method of forming the metal thin wires 40 of the first conductive layer 20 and the second conductive layer 30 is not particularly limited. For example, it can be formed by exposing a photosensitive material having an emulsion layer containing a photosensitive silver halide salt, and performing a development treatment. Further, a metal foil is formed on the insulating base material 16, and the resist is printed in a pattern on each of the metal foils, or the entire surface-coated resist is exposed and developed to be patterned, and the metal is opened to the opening. Etching is performed, whereby the first conductive layer 20 and the second conductive layer 30 can be formed. In addition, as a method of forming the first conductive layer 20 and the second conductive layer 30, there is a method of printing a paste containing fine particles of the material constituting the conductor, and performing metal plating on the paste, and using the composition. The inkjet method of the ink of the material of the above-mentioned conductor.

The first terminal portion 22, the first wiring 24, the second terminal portion 32, and the second wiring 34 can be formed, for example, by the method of forming the metal thin wires 40 described above.

The line width of the fine metal wires 40 is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 7 μm or less, and most preferably 4 μm or less, and preferably 0.5 μm or more, and more preferably 1.0 μm or more. If it is in the above range, the first conductive layer 20 and the second conductive layer 30 can be relatively easily made low in resistance.

When the metal thin wires 40 are applied as the peripheral wiring (lead wiring) in the conductive film for a touch panel, the line width of the metal thin wires 40 is preferably 500 μm or less, more preferably 50 μm or less, and particularly preferably 30 μm or less. If it is the above range, the touch panel electrode of low resistance can be formed relatively easily.

In the case where the metal thin wires 40 are applied as the peripheral wiring in the conductive film for a touch panel, the peripheral wiring in the conductive film for the touch panel may be a mesh pattern electrode. In this case, the line width is not particularly limited, but The thickness is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 9 μm or less, and most preferably 7 μm or less, preferably 0.5 μm or more, and more preferably 1.0 μm or more. If it is the above range, it is possible to form an electrode having a low resistance relatively easily. By wiring the periphery of the conductive film for the touch panel as a grid pattern electrode, in the step of irradiating the pulsed light from the xenon flash lamp, the uniformity of the low resistance of the conductive layer, the terminal portion, and the peripheral wiring by irradiation can be improved. In addition, when the transparent adhesive layer is bonded, the peeling strength of the conductive layer, the terminal portion, and the peripheral wiring can be fixed, and the in-plane distribution can be reduced, which is preferable in this respect.

The thickness of the fine metal wire 40 is not particularly limited, but is preferably 0.01 μm to 200 μm, more preferably 30 μm or less, further preferably 20 μm or less, particularly preferably 0.01 μm to 9 μm, and most preferably 0.05 μm to 5 μm. If it is in the above range, an electrode having a low resistance electrode and an excellent durability can be formed relatively easily.

Further, the width (electrode width) of the first conductive layer 20 and the second conductive layer 30 is about 0.5 mm to 5 mm.

The protective layer 42 serves to protect the first conductive layer 20, and the protective layer 44 serves to protect the second conductive layer 30. The structure of the protective layers 42 and 44 is not particularly limited. For example, glass, polycarbonate (PC), polyethylene terephthalate (PET), acrylic resin (PMMA), or the like can be used.

The adhesive layers 41, 43 fix the protective layers 42, 44 to the insulating substrate 16. For example, an optically transparent resin (OCR) such as an optically clear adhesive (OCA) or a UV (ultraviolet) curing resin can be used.

Next, the first conductive layer 20 and the second conductive layer 30 will be described in detail. In addition, since the first conductive layer 20 and the second conductive layer 30 have the same configuration, only the first conductive layer 20 will be described, and the description of the second conductive layer 30 will be omitted.

(a) of FIG. 2 is a schematic view showing an example of a conductive layer of a conductive film, and (b) of FIG. 2 is a schematic view showing another example of a conductive layer of a conductive film. (a) to (c) of FIG. 3 are schematic views showing a configuration of a terminal portion of a conductive film.

As shown in FIG. 2( a ), the first conductive layer 20 has a random pattern 60 in which the shape of the opening 46 formed by the metal thin wires 40 is polygonal. The random pattern 60 is as described above.

The first conductive layer 20 and the first terminal portion 22 are electrically connected by a plurality of, for example, four thin metal wires 40 to ensure conduction. A portion where the metal thin wires 40 of the first conductive layer 20 and the first terminal portion 22 are in contact with each other is referred to as a connection point 48.

The first terminal portion 22 is formed of, for example, a frame-shaped conductor. Thereby, the resistance value can be reduced. Further, the width Wc of the first terminal portion 22 is narrower than the width W of the first conductive layer 20. Since the terminal portion is likely to have a large parasitic capacitance, the first terminal portion 22 is formed by a frame-shaped conductor, whereby the parasitic capacitance can be reduced to reduce the possibility of malfunction. Further, the width Wc of the first terminal portion 22 and the width W of the first conductive layer 20 are both lengths in the Y direction. In the first conductive layer 20, the opening portion 46 is not closed at the end portion in the Y direction. However, in this case, the width W of the first conductive layer 20 means the maximum length in the Y direction including a part of the opening portion 46. Further, although not shown, the width of the second conductive layer 30 is the length in the X direction, and when the end portion of the opening 46 in the X direction is not closed, the width of the second conductive layer 30 means that the opening is included. The maximum length of a portion of portion 46 in the X direction.

In the first conductive layer 20 and the first terminal portion 22, the number of the metal thin wires 40 is two or more, and the maximum distance D between the connection points of the metal thin wires 40 and the first terminal portion 22 is 60 μm. the above. In addition, in FIG. 2(a), there are four connection points 48, and the maximum distance D between the connection points means the width direction of the first conductive layer 20 and the connection point 48 in the Y direction among the connection points 48. The maximum distance between them. In (a) of FIG. 2, the distance between the two outer connecting points 48 of the four connection points 48 is the maximum distance D between the connection points.

In the first conductive layer 20 and the first terminal portion 22, the number of the connecting wires of the metal thin wires 40 is two or more, and the maximum distance D between the connection points of the connecting portions of the metal thin wires 40 and the first terminal portions 22 is set. When the thickness is 60 μm or more, the reliability of conduction between the first conductive layer 20 and the first terminal portion 22 can be sufficiently ensured.

When the number of the metal thin wires 40 is one, the reliability of the conduction between the first conductive layer 20 and the first terminal portion 22 cannot be sufficiently ensured.

When the maximum distance D between the connection points is less than 60 μm, when patterning is performed in a state where foreign matter adheres to the pattern region of the joint portion of the metal thin wire 40 and the first terminal portion 22 at the time of formation of the metal thin wire 40, It is easy to produce poor composition. Thereby, the metal thin wires 40 and the first terminal portion 22 may not be connected, and the reliability of the conduction between the first conductive layer 20 and the first terminal portion 22 cannot be sufficiently ensured.

Preferably, the maximum distance D between the connection points is 200 μm or more. When the probe for the conduction test is in contact with the first terminal portion 22, when the diameter of the probe is considered, if the maximum distance D between the connection points is 200 μm or more, the probe for conduction inspection and the first can be further suppressed. The conduction failure caused by the damage of the thin metal wires 40 when the terminal portions 22 are in contact with each other. Therefore, it is preferable to set the maximum distance D between the connection points to 200 μm or more.

Further, when the maximum distance D is wider than the terminal width Wc, it cannot be connected to the terminal, so the upper limit is the terminal width Wc.

As in the case of the first conductive layer 20 shown in FIG. 2( b ), when the region A where the connection points 48 are concentrated is present, foreign matter adheres to the pattern region as the region A in the step of forming the metal thin wires 40 . When the pattern exposure is performed in the same state, when the patterning failure occurs, the thin metal wires 40 are not connected to the first terminal portion 22. Therefore, for example, it is changed to the random pattern 62 in which one metal thin wire 40a is added to each of the metal thin wires 40 located on both sides of the region A, and the maximum distance D is 60 μm or more. Thereby, even if there is the pattern 62 of the area A in which the connection points 48 are concentrated, the number of connection lines can be two or more, and the maximum distance D can be 60 μm or more.

In addition, the number of the metal thin wires 40 can be maintained at a maximum distance D of 60 μm or more, and the upper limit of the number of the strips is not particularly limited.

When the number of the connecting wires is large, for example, when the number of connecting wires is large, only the electrostatic capacitance of the portion increases, which is a detection failure. Therefore, the upper limit of the number of connecting lines of the metal thin wires 40 is preferably set to a value obtained by dividing the terminal width Wc by the average cell pitch of the random mesh.

Here, as described above, when the metal thin wires 40a are added to the connection point 48, the distance between the connection point 48 between the metal thin wires 40a and the first terminal portion 22 and the connection point 48 of the adjacent other thin wires, metal The distance between the connection point 48 of the thin wire 40a and the metal thin wire 40 and the connection point 48 of the adjacent metal thin wire 40 is the average distance between the connection points 48 of the thin metal wires 40 on the first conductive layer 20 (electrode), The capacitance value in the vicinity of the connection region between the first terminal portion 22 and the thin metal wire 40a can be suppressed from being larger than the other portions of the first conductive layer 20 (electrode).

The inventors investigated the size of a pattern defect due to a foreign matter from a product manufactured in a certain period of time for a conductive film. Table 1 below shows the results.

As shown in the following Table 1, the size of the pattern defect due to foreign matter of 60 μm or more is zero. As described above, when the maximum distance D between the connection points is 60 μm or more, all the metal thin wires 40 are not damaged, and generation can be suppressed. The conduction between the first conductive layer 20 and the first terminal portion 22 is poor.

In addition, since the probability of pattern defect is extremely low when two foreign objects are arranged in parallel in the connection region between the thin metal wire and the terminal portion, the maximum distance D is 60 μm or more. All of the fine metal wires are not damaged, and the above-described conduction failure can be suppressed.

[Table 1]

Further, the configuration of the first terminal portion 22 is not limited to the configuration shown in FIGS. 2(a) and 2(b).

For example, as shown in FIG. 3( a ), the width Wc of the first terminal portion 50 may be the same as the width W of the first conductive layer 20 . The first terminal portion 50 has the same configuration as the first terminal portion 22 (see (a) and (b) of FIG. 2) except for the difference in width, and thus detailed description thereof will be omitted.

Further, as in the first terminal portion 52 shown in FIG. 3(b), it may be formed of a linear conductor. In this case, it is preferable that the width Wc of the first terminal portion 52 is narrower than the width W of the first conductive layer 20. In addition, the first terminal portion 52 has the same configuration as the first terminal portion 22 (see (a) and (b) of FIG. 2) except for the shape of the terminal portion, and therefore detailed description thereof will be omitted.

Further, as in the first terminal portion 54 shown in FIG. 3(c), the mesh conductor 55 may be used. The mesh-shaped conductor 55 can be composed of, for example, a thin metal wire. In this case, it is preferable that the width Wc of the first terminal portion 54 is narrower than the width W of the first conductive layer 20. In addition, the first terminal portion 54 has the same configuration as the first terminal portion 22 (see (a) and (b) of FIG. 2) except for the shape of the terminal portion, and therefore detailed description thereof will be omitted.

When the first terminal portion 54 is formed of a mesh-shaped conductor 55, for example, the mesh of the first terminal portion 54 may be a fixed mesh. In this case, the pitch of the mesh of the first terminal portion 54 can be smaller than the pitch of the opening 46 of the first conductive layer 20 (see (a) of FIG. 2 and (c) of FIG. 3). The random pattern 60 is formed by the opening 46 (see (a) of FIG. 2 and (c) of FIG. 3), and the pitch is also various. However, the pitch of the mesh of the first terminal portion 54 is smaller than the minimum pitch of the opening portion 46. small. Since the second conductive layer 30 has the same configuration as that of the first conductive layer 20, detailed description thereof will be omitted.

When the conduction inspection of the conductive film is performed, the probe is brought into contact with the terminal portion. However, as described above, the pitch of the mesh of the first terminal portion 54 is made larger than the opening 46 of the first conductive layer 20 (see FIG. 2 (see FIG. 2). a) The pitch of (c) of FIG. 3 is small, the number of meshes in the first terminal portion 54 is increased, and the reliability of contact with the probe is improved. Further, even if the first terminal portion 54 is damaged by the probe, since the mesh is present in addition to the contact portion, it is possible to prevent the first wiring 24 and the first conductive layer 20 from being completely disconnected. In the second conductive layer 30, as described above, the mesh pitch of the second terminal portion 32 (see FIG. 1(a)) is larger than the opening of the second conductive layer 30 (see FIG. 1(a)). When the pitch (not shown) is small, the above-described reliability of contact with the probe can be improved and the effect of preventing disconnection can be obtained.

Further, the fixed mesh refers to a regular mesh pattern obtained by regularly arranging a plurality of openings of the same shape in a regular manner.

In the configuration of any one of the first conductive layers 20 in (a) and (b) of FIG. 2 and (a) to (c) of FIG. 3, the first wiring 24 may be formed of a thin metal wire 40. Grid-like wiring. Of course, the second conductive layer 30 may have the same structure as the first conductive layer 20. Further, when the first wiring 24 is formed by a mesh, a portion where the first wiring 24 and the first conductive layer 20 can be connected can be regarded as a terminal, and if the design of the present invention is applied to the connection portion, the improvement is obtained. The effect of yield.

Further, the structure of the conductive film 12 is not limited to a structure in which a conductive layer is formed on each surface of one insulating substrate 16 as shown in FIG. 1(b). For example, it is also possible to provide a conductive layer on an insulating substrate 16.

4 is a schematic cross-sectional view showing another example of the conductive film of the embodiment of the present invention. In the conductive film 12a shown in FIG. 4, the same components as those of the conductive film 12 shown in FIG. 1(b) are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the conductive film 12a shown in FIG. 4, the first conductive layer 20 may be formed on the surface 16a of one insulating substrate 16, and the back surface 16b of the insulating substrate 16 may be laminated via the adhesive layer 47. The insulating base material 16 having the second conductive layer 30 formed on the surface 16a. In the conductive film 12a, the protective layer 42 is provided on the first conductive layer 20 via the adhesive layer 41. Further, although not shown, an electrode may be provided on one side of the insulating base material, and the present invention can be applied even if a conductive layer is directly provided on the protective substrate.

As shown in (a) of FIG. 2 described above, in the first conductive layer 20, the random pattern 60 is formed by the thin metal wires 40, but the present invention is not limited thereto. Next, another example of the random pattern of the first conductive layer 20 and the second conductive layer 30 will be described. In addition, since the random patterns of the first conductive layer 20 and the second conductive layer 30 are the same, the first conductive layer 20 will be described, and the description of the second conductive layer 30 will be omitted.

FIG. 5 is a plan view schematically showing an example of a random pattern of a conductive layer to which irregularities are applied. Fig. 6 is a plan view schematically showing a pattern having a regular rhombus shape. FIG. 7 is a plan view schematically showing another example of a random pattern of a conductive layer to which irregularities are imparted.

For example, the random pattern 64 shown in FIG. 5 is a mesh pattern in which the openings 46 having a shape in which a plurality of metal thin wires 40 are formed to intersect each other are arranged.

The random pattern 64 shown in FIG. 5 is an irregular pattern having an opening portion 46 between the metal thin wires 40 and the adjacent metal thin wires 40, and continuously connected in two directions at an angle θ having each other in plan view The opening portion 46 having a shape of a parallelogram having a different size depending on the pitch P is maintained at an angle θ.

Here, the random pattern 64 of the conductive layer to which the irregularity is applied as shown in FIG. 5 is obtained by regularly repeating the plurality of rhombic openings 67 having the same shape as shown in FIG. 6 while maintaining the angle θ. The pitch P of the rhombic shape of the opening portion 67 of the so-called fixed pattern of the regular diamond-shaped pattern 66 gives a predetermined range of irregularities (randomness).

Here, in the random pattern 64, the predetermined range of the irregularity imparted to the rhombic shape of the opening portion 67 of the diamond-shaped pattern 66 in the state of holding the angle θ is preferably more than 0% and 10% or less, and more preferably 2%. ～10%, more preferably 2% to 8%.

In the random pattern 64, the irregularity given to the pitch P of the rhombic shape of the opening 67 of the regular rhombic pattern 66 is not particularly limited, and may be any, but for example, The distribution of irregularities may be a normal distribution or a uniform distribution.

In addition to the random pattern 64 shown in FIG. 5, for example, the random pattern 68 shown in FIG. 7 may be used. The random pattern 68 is a mesh pattern in which the polygonal opening portions 46 formed by intersecting the plurality of metal thin wires 40 with each other are arranged.

The random pattern 68 shown in FIG. 7 is an irregular pattern in which a plurality of sides having opposite sides in a plan view are continuously connected in two directions by metal thin wires 40, and are inclined with respect to the other side so as not to be parallel to each other. The opening 46 of the quadrangular shape obtained by the rhombic deformation. The random pattern 68 is a pattern in which the angles are changed without being held in the plurality of openings 46 of the adjacent quadrangular shape, and as a result, the pitch P or the side length is also changed without being maintained with the change in the angle. In other words, the random pattern 68 is a pattern in which the angles θ of the adjacent plurality of quadrangular opening portions 46 are different, and the resulting pitch P or the quadrilateral which is different in side length, angle, and shape is irregular.

The random pattern 68 of the conductive layer to which the irregularity is applied shown in FIG. 7 is given a predetermined range of irregularities with respect to the angle θ of the rhombic shape of the opening portion 67 of the diamond pattern 66 shown in FIG. (random) pattern obtained.

Here, in the random pattern 68, the predetermined range of the irregularity imparted to the angle θ of the rhombic shape of the opening portion 67 of the regular diamond-shaped pattern 66 is preferably more than 0% and 3% or less, and more preferably 0.2% to 3 % is further preferably 0.5% to 3%.

In the random pattern 68, the irregularity given to the angle θ of the rhombic shape of the opening 67 of the regular rhombic pattern 66 is not particularly limited, and may be any, but for example, The distribution of irregularities may be a normal distribution or a uniform distribution.

Further, the diamond-shaped pattern 66 shown in FIG. 6 which is the basis of the random patterns 64 and 68 is a grid-like pattern based on the opening 67 of the metal thin wire 40 and the adjacent metal thin wires 40. In the diamond pattern 66, a disconnection may occur at the side of the thin metal wire 40 constituting the opening portion 67.

In the conductive film 12 of the present embodiment, as described above, the number of the connection lines of the metal thin wires 40 is two or more, and the maximum distance D between the connection points of the metal thin wires 40 and the first terminal portion 22 is 60 μm or more. The reliability of the conduction between the first conductive layer 20 and the first terminal portion 22 can be sufficiently ensured. Since the reliability is high, the manufacturing yield is excellent, and therefore productivity can be improved.

As shown in FIG. 1( a ), when the conductive film 12 is applied to the touch panel 10 , a highly reliable touch panel can be obtained, and since productivity is also high, production cost can be suppressed.

In addition to the above-described touch panel 10, the conductive films 12 and 12a can be used as various electrodes such as an electrode for an inorganic EL element, an electrode for an organic EL element, or an electrode for a solar cell, a heat generating sheet, or a printed wiring board. For other uses, the conductive films 12 and 12a can also be used as electromagnetic wave shields for blocking electromagnetic waves such as radio waves or microwaves (very ultrashort waves) generated from personal computers, workstations, and the like, and preventing static electricity. Further, in addition to the electromagnetic wave mask used in the main body of the personal computer, it can also be used as an electromagnetic wave mask used in an image capturing apparatus, an electronic medical apparatus, or the like. Further, the conductive films 12, 12a can also be used as a transparent heat generating body.

In applications other than the touch panel, the conductive films 12, 12a are connected to an external device corresponding to the use.

The present invention is basically constructed as described above. Although the conductive film of the present invention has been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

<present invention>

10‧‧‧ touch panel;

12, 12a‧‧‧ conductive film;

14‧‧‧ controller;

15‧‧‧FPC;

16‧‧‧Insulating substrate;

16a‧‧‧ surface;

16b‧‧‧ back;

20‧‧‧1st conductive layer;

22, 50, 52, 54‧ ‧ the first terminal part;

24‧‧‧1st wiring;

30‧‧‧2nd conductive layer;

32‧‧‧2nd terminal section;

26, 36‧‧‧ connector parts;

34‧‧‧2nd wiring;

40, 40a‧‧‧ metal thin wires;

41, 43‧‧‧ bonding layer;

42, 44‧‧ ‧ protective layer;

46, 67‧‧‧ openings;

48‧‧‧ connection points;

60, 62‧‧‧ patterns;

64, 68‧‧‧ random patterns;

66‧‧‧ Diamond-shaped pattern.

<existing>

100‧‧‧ conductive layer;

102‧‧‧ Terminals;

104‧‧‧ random patterns;

106‧‧‧Metal thin wires;

108‧‧‧Wiring.

1(a) is a schematic plan view showing a touch panel having a conductive film according to an embodiment of the present invention, and FIG. 1(b) is a schematic cross-sectional view of a touch panel using a conductive film according to an embodiment of the present invention.

(a) of FIG. 2 is a schematic view showing an example of a conductive layer of a conductive film, and (b) is a schematic view showing another example of a conductive layer of a conductive film.

(a) to (c) of FIG. 3 are schematic views showing a configuration of a terminal portion of a conductive film.

4 is a schematic cross-sectional view showing another example of the conductive film of the embodiment of the present invention.

FIG. 5 is a plan view schematically showing an example of a random pattern of a conductive layer to which irregularities are applied.

Fig. 6 is a plan view schematically showing a pattern having a regular rhombus shape.

FIG. 7 is a plan view schematically showing another example of a random pattern of a conductive layer to which irregularities are imparted.

Fig. 8 is a schematic view showing the configuration of a conductive layer of a conventional conductive film.

10‧‧‧ touch panel

12‧‧‧Electrical film

14‧‧‧ Controller

15‧‧‧FPC

16‧‧‧Insulating substrate

16a‧‧‧Surface

16b‧‧‧Back

20‧‧‧1st conductive layer

22‧‧‧1st terminal part

24‧‧‧1st wiring

26, 36‧‧‧ Connector Department

30‧‧‧2nd conductive layer

32‧‧‧2nd terminal section

34‧‧‧2nd wiring

40‧‧‧Metal thin wire

41, 43‧‧‧ bonding layer

42, 44‧‧ ‧ protective layer

46‧‧‧ openings

Claims (10)

A conductive film, comprising: an insulating substrate; a conductive layer formed on the insulating substrate; and a terminal portion electrically connected to the conductive layer, the conductive layer being composed of thin metal wires, The metal thin wire forms a random pattern in which the shape of the opening is a polygon, and in the conductive layer, the number of the thin metal wires connected to each of the terminal portions is two or more, and the metal thin wires are The maximum distance between the connection points of the terminal portions is 60 μm or more. The conductive film according to claim 1, wherein the conductive film has a wiring that connects the terminal portion to an external device. The conductive film according to claim 1 or 2, wherein a width of the terminal portion is narrower than a width of the conductive layer. The conductive film according to claim 1 or 2, wherein the random pattern is a pattern in which at least one of arrangement pitch, angle, length, and shape is not fixed to a polygon constituting the pattern. The conductive film according to claim 1 or 2, wherein the random pattern is a pattern in which a regular diamond shape is maintained at an angle and an irregularity is imparted to the pitch, and the opening is a parallelogram. The conductive film according to claim 1 or 2, wherein the random pattern is a pattern in which the opening portion has a rhombus shape, and an angle is given to an angle with respect to a rhombic shape. The conductive film according to claim 1 or 2, wherein the terminal portion is formed of a frame-shaped, mesh-shaped or linear conductor. The conductive film according to claim 7, wherein when the terminal portion is formed of the mesh-shaped conductor, the mesh of the terminal portion is a shaped mesh. The conductive film according to claim 7, wherein, in a case where the terminal portion is formed of the mesh-shaped conductor, a pitch of a mesh of the terminal portion is larger than a width of the opening portion of the conductive layer The spacing is small. The conductive film according to claim 1 or 2, wherein the wiring is composed of a mesh-shaped conductor.