TW201610795A - Touch module - Google Patents

Touch module Download PDF

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Publication number
TW201610795A
TW201610795A TW103130899A TW103130899A TW201610795A TW 201610795 A TW201610795 A TW 201610795A TW 103130899 A TW103130899 A TW 103130899A TW 103130899 A TW103130899 A TW 103130899A TW 201610795 A TW201610795 A TW 201610795A
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TW
Taiwan
Prior art keywords
sensing units
touch module
wires
processor
electrode layer
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TW103130899A
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Chinese (zh)
Inventor
林 招慶
李文定
沈宗毅
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源貿科技股份有限公司
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Priority to TW103130899A priority Critical patent/TW201610795A/en
Priority to CN201410553430.6A priority patent/CN105573537A/en
Publication of TW201610795A publication Critical patent/TW201610795A/en

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Abstract

A touch module includes a substrate and an electrode layer. The electrode layer is formed on a surface of the substrate, and the electrode layer includes a plurality of spaced sensing units. At least one sensing unit of the plurality of spaced sensing units is coupled to a wire, and the wire is installed in spaces between the plurality of spaced sensing units.

Description

觸控模組 Touch module

本發明是有關於一種觸控模組,尤指一種利用觸控模組中的複數個感應單元之間的空間耦接於複數個感應單元的複數條導線中的部分或全部以減少應用觸控模組的手機的體積。 The present invention relates to a touch module, in particular, a part or all of a plurality of wires coupled to a plurality of sensing units by using a space between a plurality of sensing units in the touch module to reduce application touch. The size of the module's phone.

目前用以連接觸控面板內感應單元與處理器的導線均是設置於感應單元所屬的電極層的邊緣。當至少一感應單元產生至少一觸碰信號時,至少一觸碰信號即可通過至少一相對應的導線傳送至處理器執行相對應的操作。然而用以連接觸控面板內感應單元與處理器的導線將會隨著手機螢幕尺寸增加而增加,導致電極層的邊緣用以設置導線的區域亦增加。如此,電極層的邊緣用以設置導線的區域增加不僅增加了手機的體積,亦會影響手機的美觀。 Currently, the wires for connecting the sensing unit and the processor in the touch panel are disposed at the edge of the electrode layer to which the sensing unit belongs. When the at least one sensing unit generates at least one touch signal, the at least one touch signal can be transmitted to the processor through the at least one corresponding wire to perform a corresponding operation. However, the wires used to connect the sensing unit and the processor in the touch panel will increase as the screen size of the mobile phone increases, and the area where the edge of the electrode layer is used to set the wires also increases. In this way, the increase of the area of the electrode layer for setting the wire not only increases the volume of the mobile phone, but also affects the appearance of the mobile phone.

本發明的一實施例提供一種觸控模組。該觸控模組包含一基板及一電極層。該電極層是形成於該基板表面,並包含有複數個間隔排列的感應單元。該複數個感應單元中的至少一感應單元耦接一走線,且該走線佈設於該複數個感應單元之間的間隙。 An embodiment of the invention provides a touch module. The touch module includes a substrate and an electrode layer. The electrode layer is formed on the surface of the substrate and includes a plurality of sensing units arranged at intervals. At least one of the plurality of sensing units is coupled to a trace, and the trace is disposed in a gap between the plurality of sensing units.

本發明的另一實施例提供一種觸控模組。該觸控模組包含一基板及一電極層。該電極層是形成於該基板表面,並包含有呈一矩陣式排列的複數個間隔排列的第一感應單元以及複數個間隔排列的第二感應單元。該複數 個第一感應單元中的至少一第一感應單元耦接一走線,且該走線佈設於該複數個第二感應單元之間的間隙。 Another embodiment of the present invention provides a touch module. The touch module includes a substrate and an electrode layer. The electrode layer is formed on the surface of the substrate, and includes a plurality of first sensing units arranged in a matrix and a plurality of spaced second sensing units. The plural At least one first sensing unit of the first sensing unit is coupled to a trace, and the trace is disposed in a gap between the plurality of second sensing units.

本發明提供一種觸控模組。該觸控模組是利用一電極層的感應單元之間的空間設置耦接於該電極層的感應單元的複數條導線中的部分或全部,所以本發明可減少該電極層的邊緣用以設置導線的區域。因此,相較於現有技術,該電極層的邊緣用以設置導線的區域減少不僅減少了應用該觸控模組的手機的體積,亦會增加該手機的美觀。 The invention provides a touch module. The touch module uses a space between the sensing units of one electrode layer to set part or all of the plurality of wires coupled to the sensing unit of the electrode layer, so the invention can reduce the edge of the electrode layer for setting The area of the wire. Therefore, compared with the prior art, the reduction of the area of the electrode layer for setting the wire not only reduces the volume of the mobile phone to which the touch module is applied, but also increases the aesthetic appearance of the mobile phone.

100、200、400、500‧‧‧觸控模組 100, 200, 400, 500‧‧‧ touch modules

102‧‧‧基板 102‧‧‧Substrate

104‧‧‧電極層 104‧‧‧electrode layer

108‧‧‧處理器 108‧‧‧Processor

C1-C8‧‧‧第一感應單元 C1-C8‧‧‧First sensing unit

C9-C16‧‧‧第二感應單元 C9-C16‧‧‧Second sensing unit

第1圖是本發明的第一實施例說明一種觸控模組的橫切面的示意圖。 FIG. 1 is a schematic view showing a cross section of a touch module according to a first embodiment of the present invention.

第2圖是說明電極層包含16個感應單元的示意圖。 Fig. 2 is a schematic view showing that the electrode layer contains 16 sensing units.

第3圖是本發明的第二實施例說明觸控模組的感應單元與處理器之間的導線的設置位置的示意圖。 FIG. 3 is a schematic diagram showing the arrangement position of the wires between the sensing unit and the processor of the touch module according to the second embodiment of the present invention.

第4圖是本發明的第三實施例說明一種觸控模組的17個感應單元與處理器之間的17條導線的設置位置的示意圖。 FIG. 4 is a schematic view showing the arrangement position of 17 wires between 17 sensing units and a processor of a touch module according to a third embodiment of the present invention.

第5圖是本發明的第四實施例說明一種觸控模組的17個感應單元與處理器之間的17條導線的設置位置的示意圖。 FIG. 5 is a schematic view showing the arrangement position of 17 wires between the 17 sensing units and the processor of the touch module according to the fourth embodiment of the present invention.

請參照第1圖,第1圖是本發明的一第一實施例說明一種觸控模組100的橫切面的示意圖。如第1圖所示,觸控模組100包含一基板102和一電極層104,其中電極層104是形成於基板102的表面以及基板102可為一玻璃。但本發明並不受限於基板102為一玻璃。電極層104包含矩陣式排列的8個間隔排列的第一感應單元C1-C8以及8個間隔排列的第二感應單元C9-C16(如第2圖所示)。另外,如第2圖所示的第一感應單元C1-C8以及第 二感應單元C9-C16僅是用以說明本發明,亦即本發明並不受限於電極層104包含8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16,亦不受限於8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16中的每一感應單元的形狀是一直角三角形。如第2圖所示,耦接於8個感應單元C1-C8與一處理器108之間的8條導線是設置於感應單元C12、C13之間。但本發明並不受限於耦接於8個第一感應單元C1-C8與處理器108之間的8條導線是設置於第二感應單元C12、C13之間,亦即只要耦接於8個第一感應單元C1-C8的16條導線的部分是設置於8個第二感應單元C9-C16之間即落入本發明的範疇。另外,耦接於8個第二感應單元C9-C16與處理器108之間的8條導線是向下延伸至處理器108。如第2圖所示,因為耦接於8個第一感應單元C1-C8與處理器108之間的8條導線是設置於第二感應單元C12、C13之間,所以電極層104的邊緣用以設置其餘導線的區域減少。如此,電極層104的邊緣用以設置其餘導線的區域減少不僅減少了應用觸控模組100的手機的體積,亦會增加手機的美觀。另外,因為耦接於8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16的16條導線的每一導線的線寬皆很小,所以設置於第二感應單元C12、C13之間的8條導線的每一導線所造成的電容變化也很小,亦即設置於第二感應單元C12、C13之間的8條導線的每一導線所造成的電容變化可忽略不計。然而亦可利用現有技術所提供的電荷分配公式消除設置於第二感應單元C12、C13之間的8條導線的每一導線所造成的電容變化的影響。另外,在本發明的另一實施例中,觸控模組100另包含處理器108。 Please refer to FIG. 1 . FIG. 1 is a schematic diagram showing a cross section of a touch module 100 according to a first embodiment of the present invention. As shown in FIG. 1 , the touch module 100 includes a substrate 102 and an electrode layer 104 , wherein the electrode layer 104 is formed on the surface of the substrate 102 and the substrate 102 can be a glass. However, the present invention is not limited to the substrate 102 being a glass. The electrode layer 104 includes eight spaced-apart first sensing units C1-C8 arranged in a matrix and eight spaced second sensing units C9-C16 (as shown in FIG. 2). In addition, the first sensing unit C1-C8 and the first shown in FIG. The two sensing units C9-C16 are only for explaining the present invention, that is, the invention is not limited to the electrode layer 104 comprising eight first sensing units C1-C8 and eight second sensing units C9-C16, The shape of each of the first sensing units C1-C8 and the eight second sensing units C9-C16 that are not limited to eight is a right-angled triangle. As shown in FIG. 2, eight wires coupled between the eight sensing units C1-C8 and a processor 108 are disposed between the sensing units C12 and C13. However, the present invention is not limited to being connected between the eight first sensing units C1-C8 and the processor 108. The eight wires are disposed between the second sensing units C12 and C13, that is, as long as they are coupled to The portion of the 16 wires of the first sensing units C1-C8 disposed between the eight second sensing units C9-C16 falls within the scope of the present invention. In addition, the eight wires coupled between the eight second sensing units C9-C16 and the processor 108 extend downward to the processor 108. As shown in FIG. 2, since the eight wires coupled between the eight first sensing units C1-C8 and the processor 108 are disposed between the second sensing units C12 and C13, the edge of the electrode layer 104 is used. The area where the remaining wires are set is reduced. Thus, the reduction of the area of the electrode layer 104 for arranging the remaining wires not only reduces the size of the mobile phone to which the touch module 100 is applied, but also increases the aesthetics of the mobile phone. In addition, since each of the 16 wires of the first sensing units C1-C8 and the eight second sensing units C9-C16 coupled to the eight sensing units has a small line width, the second sensing unit C12 is disposed. The change in capacitance caused by each of the eight wires between C13 is also small, that is, the change in capacitance caused by each of the eight wires disposed between the second sensing units C12 and C13 is negligible. . However, the charge distribution formula provided by the prior art can also be used to eliminate the influence of the capacitance change caused by each of the eight wires disposed between the second sensing units C12 and C13. In addition, in another embodiment of the present invention, the touch module 100 further includes a processor 108.

請參照第3圖,第3圖是本發明的一第二實施例說明觸控模組200的8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16與處理器108之間的16條導線的設置位置的示意圖。如第3圖所示,耦接於4個第一感應單元C1、C2、C7、C8與處理器108之間的4條導線是沿電極層104的邊緣 設置,以及耦接於4個第一感應單元C3-C6與處理器108之間的4條導線是設置於第二感應單元C12、C13之間。但本發明並不受限於耦接於4個第一感應單元C1、C2、C7、C8與處理器108之間的4條導線是沿電極層104的邊緣設置,以及耦接於4個第一感應單元C3-C6與處理器108之間的4條導線是設置於第二感應單元C12、C13之間,亦即只要耦接於8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16的16條導線的部分是沿電極層104的邊緣設置,以及耦接於8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16的16條導線的部分是設置於8個第二感應單元C9-C16之間即落入本發明的範疇。另外,耦接於8個第二感應單元C9-C16與處理器108之間的8條導線是向下延伸至處理器108。另外,觸控模組200的其餘原理皆和觸控模組100相同,在此不再贅述。 Please refer to FIG. 3 , which is a second embodiment of the present invention. The first sensing units C1 - C8 and the eight second sensing units C9 - C16 and the processor 108 of the touch module 200 are illustrated. Schematic diagram of the set position between the 16 wires. As shown in FIG. 3, the four wires coupled between the four first sensing units C1, C2, C7, C8 and the processor 108 are along the edge of the electrode layer 104. The four wires disposed between the four first sensing units C3-C6 and the processor 108 are disposed between the second sensing units C12 and C13. However, the present invention is not limited to being connected to the four wires between the four first sensing units C1, C2, C7, and C8 and the processor 108, and is disposed along the edge of the electrode layer 104, and coupled to the four The four wires between the sensing unit C3-C6 and the processor 108 are disposed between the second sensing units C12 and C13, that is, as long as the first sensing units C1-C8 and eight of the eight sensing units are coupled. Portions of the 16 wires of the two sensing units C9-C16 are disposed along the edge of the electrode layer 104, and 16 wires coupled to the eight first sensing units C1-C8 and the eight second sensing units C9-C16 The portion disposed between the eight second sensing units C9-C16 falls within the scope of the present invention. In addition, the eight wires coupled between the eight second sensing units C9-C16 and the processor 108 extend downward to the processor 108. In addition, the remaining principles of the touch module 200 are the same as those of the touch module 100, and are not described herein again.

請參照第4圖,第4圖是本發明的一第三實施例說明觸控模組400的8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16與處理器108之間的16條導線的設置位置的示意圖。如第4圖所示,耦接於2個第一感應單元C1、C2與處理器108之間的2條導線是設置於第二感應單元C10、C11之間,以及耦接於2個第一感應單元C7、C8與處理器108之間的2條導線是設置於第二感應單元C14、C15之間。但本發明並不受限於耦接於2個第一感應單元C1、C2與處理器108之間的2條導線是設置於第二感應單元C10、C11之間,以及耦接於2個第一感應單元C7、C8與處理器108之間的2條導線是設置於第二感應單元C14、C15之間,亦即只要耦接於8個第一感應單元C1-C8的16條導線的部分是設置於8個第二感應單元C9-C16之間即落入本發明的範疇。另外,耦接於8個第二感應單元C9-C16與處理器108之間的8條導線是向下延伸至處理器108。另外,觸控模組400的其餘原理皆和觸控模組100相同,在此不再贅述。 Please refer to FIG. 4 , which is a third embodiment of the present invention. The first sensing units C1 - C8 and the eight second sensing units C9 - C16 and the processor 108 of the touch module 400 are illustrated. Schematic diagram of the set position between the 16 wires. As shown in FIG. 4, two wires coupled between the two first sensing units C1 and C2 and the processor 108 are disposed between the second sensing units C10 and C11 and coupled to the first two. The two wires between the sensing units C7, C8 and the processor 108 are disposed between the second sensing units C14, C15. However, the present invention is not limited to being connected between the two first sensing units C1, C2 and the processor 108. The two wires are disposed between the second sensing units C10 and C11, and are coupled to the two The two wires between the sensing unit C7, C8 and the processor 108 are disposed between the second sensing units C14 and C15, that is, the portions of the 16 wires that are coupled to the eight first sensing units C1-C8. It is within the scope of the present invention to be disposed between the eight second sensing units C9-C16. In addition, the eight wires coupled between the eight second sensing units C9-C16 and the processor 108 extend downward to the processor 108. In addition, the remaining principles of the touch module 400 are the same as those of the touch module 100, and are not described herein again.

請參照第5圖,第5圖是本發明的一第四實施例說明觸控模組500的8個的第一感應單元C1-C8以及8個的第二感應單元C9-C16與處理器108之間的16條導線的設置位置的示意圖。如第5圖所示,耦接於第一感應單元C3、C5與處理器108之間的2條導線是設置於第一感應單元C4、C5之間與第二感應單元C12、C13之間,以及耦接於第一感應單元C1、C2、C4、C6、C7、C8與處理器108之間的6條導線是設置於第二感應單元C12、C13之間。但本發明並不受限於耦接於第一感應單元C3、C5與處理器108之間的24條導線是設置於第一感應單元C4、C5之間與第二感應單元C12、C13之間,以及耦接於第一感應單元C1、C2、C4、C6、C7、C8與處理器108之間的4條導線是設置於第二感應單元C12、C13之間,亦即只要耦接於8個第一感應單元C1-C8的16條導線的部分是設置於8個第一感應單元C1-C8與8個第一感應單元C9-C16之間即落入本發明的範疇。另外,耦接於8個第二感應單元C9-C16與處理器108之間的8條導線是向下延伸至處理器108。另外,觸控模組500的其餘原理皆和觸控模組100相同,在此不再贅述。 Please refer to FIG. 5 , which is a fourth embodiment of the present invention. The first sensing units C1 - C8 and the eight second sensing units C9 - C16 and the processor 108 of the touch module 500 are illustrated. Schematic diagram of the set position between the 16 wires. As shown in FIG. 5, the two wires that are coupled between the first sensing units C3 and C5 and the processor 108 are disposed between the first sensing units C4 and C5 and between the second sensing units C12 and C13. And six wires coupled between the first sensing units C1, C2, C4, C6, C7, and C8 and the processor 108 are disposed between the second sensing units C12 and C13. However, the present invention is not limited to being connected between the first sensing units C3, C5 and the processor 108, and is disposed between the first sensing units C4 and C5 and between the second sensing units C12 and C13. And the four wires that are coupled between the first sensing unit C1, C2, C4, C6, C7, and C8 and the processor 108 are disposed between the second sensing units C12 and C13, that is, as long as they are coupled to The portions of the 16 wires of the first sensing units C1-C8 are disposed between the eight first sensing units C1-C8 and the eight first sensing units C9-C16, which fall within the scope of the present invention. In addition, the eight wires coupled between the eight second sensing units C9-C16 and the processor 108 extend downward to the processor 108. In addition, the remaining principles of the touch module 500 are the same as those of the touch module 100, and are not described herein again.

綜上所述,本發明所提供的觸控模組是利用電極層的感應單元之間的空間設置耦接於電極層的感應單元的複數條導線中的部分或全部,所以本發明可減少電極層的邊緣用以設置導線的區域。因此,相較於現有技術,電極層的邊緣用以設置導線的區域減少不僅減少了應用觸控模組的手機的體積,亦會增加手機的美觀。 In summary, the touch module provided by the present invention uses a space between the sensing units of the electrode layer to set part or all of the plurality of wires coupled to the sensing unit of the electrode layer, so the present invention can reduce the electrode. The edge of the layer is used to set the area of the wire. Therefore, compared with the prior art, the reduction of the area of the electrode layer for setting the wire not only reduces the volume of the mobile phone to which the touch module is applied, but also increases the aesthetic appearance of the mobile phone.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100‧‧‧觸控模組 100‧‧‧ touch module

104‧‧‧電極層 104‧‧‧electrode layer

108‧‧‧處理器 108‧‧‧Processor

C1-C8‧‧‧第一感應單元 C1-C8‧‧‧First sensing unit

C9-C16‧‧‧第二感應單元 C9-C16‧‧‧Second sensing unit

Claims (6)

一種觸控模組,包含:一基板;及一電極層,形成於該基板表面,並包含有複數個間隔排列的感應單元;其中該複數個感應單元中的至少一感應單元耦接一走線,且該走線佈設於該複數個感應單元之間的間隙。 A touch module includes: a substrate; and an electrode layer formed on the surface of the substrate and including a plurality of sensing units arranged at intervals; wherein at least one of the plurality of sensing units is coupled to a trace And the trace is disposed in a gap between the plurality of sensing units. 如申請專利範圍第1項所述的觸控模組,另包含:一處理器,用以耦接該走線。 The touch module of claim 1, further comprising: a processor for coupling the trace. 如申請專利範圍第1項所述的觸控模組,其中該基板是一玻璃。 The touch module of claim 1, wherein the substrate is a glass. 一種觸控模組,包含:一基板;及一電極層,形成於該基板表面,並包含有呈一矩陣式排列的複數個間隔排列的第一感應單元以及複數個間隔排列的第二感應單元;其中該複數個第一感應單元中的至少一第一感應單元耦接一走線,且該走線佈設於該複數個第二感應單元之間的間隙。 A touch module includes: a substrate; and an electrode layer formed on the surface of the substrate, and includes a plurality of first sensing units arranged in a matrix and a plurality of spaced second sensing units The at least one first sensing unit of the plurality of first sensing units is coupled to a trace, and the trace is disposed in a gap between the plurality of second sensing units. 如申請專利範圍第4項所述的觸控模組,另包含:一處理器,用以耦接該走線。 The touch module of claim 4, further comprising: a processor for coupling the trace. 如申請專利範圍第4項所述的觸控模組,其中該基板是一玻璃。 The touch module of claim 4, wherein the substrate is a glass.
TW103130899A 2014-09-05 2014-09-05 Touch module TW201610795A (en)

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