TW201610769A - Touch panel - Google Patents

Touch panel Download PDF

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Publication number
TW201610769A
TW201610769A TW103130480A TW103130480A TW201610769A TW 201610769 A TW201610769 A TW 201610769A TW 103130480 A TW103130480 A TW 103130480A TW 103130480 A TW103130480 A TW 103130480A TW 201610769 A TW201610769 A TW 201610769A
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TW
Taiwan
Prior art keywords
layer
touch panel
substrate
ruthenium
disposed
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TW103130480A
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Chinese (zh)
Inventor
洪鉦杰
張惠喻
陳健忠
王文俊
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勝華科技股份有限公司
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Priority to TW103130480A priority Critical patent/TW201610769A/en
Publication of TW201610769A publication Critical patent/TW201610769A/en

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Abstract

A touch panel includes a rigid substrate, a touch-control element, and a silicon-based strengthening layer. The touch-control element has a plurality of electrodes disposed on a surface of the substrate. The strengthening layer is disposed on the surface of the substrate and at least between a portion of the electrodes and the substrate such that the contact area of the electrodes and the substrate is less than 50% of the area of the substrate. The Young's Modulus of the silicon-based strengthening layer is less than 6.

Description

觸控面板 Touch panel

本發明有關於一種觸控面板,尤指一種能提高基板之耐撞強度的觸控面板。 The present invention relates to a touch panel, and more particularly to a touch panel capable of improving the impact strength of a substrate.

由於觸控面板具有人機互動的特性,已被廣泛應用於智慧型手機(smart phone)、衛星導航系統(GPS navigator system)、平板電腦(tablet PC)、個人數位助理(PDA)以及筆記型電腦(laptop PC)等電子產品上。 Due to the human-computer interaction characteristics of the touch panel, it has been widely used in smart phones, GPS navigator systems, tablet PCs, personal digital assistants (PDAs), and notebook computers. (laptop PC) and other electronic products.

一般觸控面板或觸控裝置會包括一片以上的硬質基板,例如由玻璃或強化玻璃製作,而觸控面板的電子元件則會直接製作在硬質基板表面。然而,在將用來製作電子元件的導電膜層製作在硬質基板表面以後,硬質基板的耐撞強度會明顯降低,進而影響觸控面板的使用壽命與信賴性。因此,如何改善硬質基板的耐撞強度仍為業界需要研究之課題。 Generally, a touch panel or a touch device may include more than one hard substrate, such as glass or tempered glass, and the electronic components of the touch panel are directly formed on the surface of the rigid substrate. However, after the conductive film layer for fabricating the electronic component is formed on the surface of the hard substrate, the impact strength of the hard substrate is significantly reduced, thereby affecting the service life and reliability of the touch panel. Therefore, how to improve the impact strength of a hard substrate is still a subject of research in the industry.

本發明觸控面板包括一矽基強化層(silicon-based strengthening layer),設於硬質之基板與至少部分導電層之間,以減少基板與導電層的接觸面積,且矽基強化層的揚氏模數(Young’s Modulus)不大於60Gpa,進而降低撞擊時震波在基板和導電層的接觸介面發生反射之情形,以提高基板之耐撞強度與觸控面板的使用壽命。 The touch panel of the present invention comprises a silicon-based strengthening layer disposed between the hard substrate and at least a portion of the conductive layer to reduce the contact area between the substrate and the conductive layer, and the 矽-based strengthening layer of the Young's The Young's Modulus is no more than 60Gpa, which reduces the reflection of the shock wave on the contact interface between the substrate and the conductive layer during impact to improve the impact strength of the substrate and the service life of the touch panel.

本發明之實施例揭露了一種觸控面板,其包括一硬質之基板、一觸控元件及一矽基強化層。其中,觸控元件具有多個電極設置於基板之一表面上,而矽基強化層設置於基板之該表面上並至少位於部分該等電極與基板 之間,以使該等電極與基板的接觸面積小於基板面積的50%,且該矽基強化層的揚氏模數(Young’s Modulus)不大於60Gpa。 The embodiment of the invention discloses a touch panel comprising a rigid substrate, a touch component and a germanium-based strengthening layer. The touch element has a plurality of electrodes disposed on a surface of the substrate, and the ruthenium-based strengthening layer is disposed on the surface of the substrate and at least partially located at the electrodes and the substrate The contact area between the electrodes and the substrate is less than 50% of the substrate area, and the Young's Modulus of the ruthenium-based strengthening layer is not more than 60 GPa.

100‧‧‧觸控面板 100‧‧‧ touch panel

102‧‧‧基板 102‧‧‧Substrate

102a‧‧‧表面 102a‧‧‧ surface

102b‧‧‧側壁 102b‧‧‧ sidewall

104‧‧‧透光區 104‧‧‧Light transmission area

106‧‧‧遮光區 106‧‧‧ shading area

108‧‧‧觸控元件 108‧‧‧Touch components

108X‧‧‧第一軸向電極 108X‧‧‧first axial electrode

108X1‧‧‧第一電極部 108X1‧‧‧First electrode section

108X2‧‧‧第一連接部 108X2‧‧‧First connection

108Y‧‧‧第二軸向電極 108Y‧‧‧second axial electrode

108Y1‧‧‧第二電極部 108Y1‧‧‧Second electrode part

108Y2‧‧‧第二連接部 108Y2‧‧‧Second connection

1081‧‧‧電極 1081‧‧‧electrode

1082、1083、1084‧‧‧電極部 1082,1083, 1084‧‧‧Electrode

1085‧‧‧第一電極 1085‧‧‧First electrode

1086‧‧‧第二電極 1086‧‧‧second electrode

110‧‧‧矽基強化層 110‧‧‧矽基层层

110a‧‧‧粗糙表面 110a‧‧‧Rough surface

1101‧‧‧接觸洞 1101‧‧‧Contact hole

112‧‧‧裝飾層 112‧‧‧Decorative layer

114‧‧‧周邊走線 114‧‧‧ perimeter wiring

1141‧‧‧下部走線 1141‧‧‧Lower wiring

1142‧‧‧上部走線 1142‧‧‧ upper line

116‧‧‧保護層 116‧‧‧Protective layer

1161‧‧‧第一保護層 1161‧‧‧First protective layer

1162‧‧‧第二保護層 1162‧‧‧Second protective layer

118‧‧‧絕緣層 118‧‧‧Insulation

120、122‧‧‧導電層 120, 122‧‧‧ conductive layer

124、126‧‧‧保護部 124, 126‧ ‧Protection Department

128、130‧‧‧介質層 128, 130‧‧‧ dielectric layer

132‧‧‧接合區 132‧‧‧ junction area

136‧‧‧接合墊 136‧‧‧ joint pad

138‧‧‧第一網格層 138‧‧‧First mesh layer

1381‧‧‧第一網格線 1381‧‧‧First grid line

140‧‧‧第二網格層 140‧‧‧Second grid layer

1401‧‧‧第二網格線 1401‧‧‧second grid line

142、144‧‧‧圖案化電極層 142, 144‧‧‧ patterned electrode layer

T‧‧‧總厚度 T‧‧‧ total thickness

第1圖為本發明觸控面板之第一實施例的俯視示意圖。 FIG. 1 is a top plan view of a first embodiment of a touch panel of the present invention.

第2圖為第1圖所示觸控面板沿著切線A-A’的局部剖面示意圖。 Fig. 2 is a partial cross-sectional view showing the touch panel shown in Fig. 1 along a tangential line A-A'.

第3圖為本發明觸控面板之第二實施例的部分剖面示意圖。 3 is a partial cross-sectional view showing a second embodiment of the touch panel of the present invention.

第4圖為本發明觸控面板之第三實施例的部分剖面示意圖。 4 is a partial cross-sectional view showing a third embodiment of the touch panel of the present invention.

第5圖為本發明觸控面板之第四實施例的部分剖面示意圖。 FIG. 5 is a partial cross-sectional view showing a fourth embodiment of the touch panel of the present invention.

第6圖為本發明觸控面板之第五實施例的部分剖面示意圖。 FIG. 6 is a partial cross-sectional view showing a fifth embodiment of the touch panel of the present invention.

第7圖為本發明觸控面板之第六實施例的部分剖面示意圖。 FIG. 7 is a partial cross-sectional view showing a sixth embodiment of the touch panel of the present invention.

第8圖為本發明觸控面板之第七實施例的部分剖面示意圖。 FIG. 8 is a partial cross-sectional view showing a seventh embodiment of the touch panel of the present invention.

第9圖為本發明觸控面板之第八實施例的部分剖面示意圖。 Figure 9 is a partial cross-sectional view showing an eighth embodiment of the touch panel of the present invention.

第10圖為本發明觸控面板之第九實施例的部分剖面示意圖。 FIG. 10 is a partial cross-sectional view showing a ninth embodiment of the touch panel of the present invention.

第11圖為本發明觸控面板之第十實施例的部分剖面示意圖。 11 is a partial cross-sectional view showing a tenth embodiment of the touch panel of the present invention.

第12圖為本發明觸控面板之第十一實施例的俯視示意圖。 FIG. 12 is a top plan view showing an eleventh embodiment of the touch panel of the present invention.

第13圖為第12圖所示觸控面板沿著切線B-B’的局部剖面示意圖。 Figure 13 is a partial cross-sectional view of the touch panel shown in Figure 12 along a tangential line B-B'.

第14圖為本發明觸控面板之第十二實施例的俯視示意圖。 Figure 14 is a top plan view showing a twelfth embodiment of the touch panel of the present invention.

第15圖為本發明觸控面板之第十三實施例的俯視示意圖。 Figure 15 is a top plan view showing a thirteenth embodiment of the touch panel of the present invention.

第16圖為本發明觸控面板之第十四實施例的部分剖面示意圖。 Figure 16 is a partial cross-sectional view showing the fourteenth embodiment of the touch panel of the present invention.

第17圖為本發明觸控面板之第十五實施例的俯視示意圖。 Figure 17 is a top plan view showing a fifteenth embodiment of the touch panel of the present invention.

第18圖為第17圖所示觸控面板沿著切線C-C’的局部剖面示意圖。 Figure 18 is a partial cross-sectional view of the touch panel shown in Figure 17 along a tangential line C-C'.

第19圖為本發明觸控面板之第十六實施例的俯視示意圖。 Figure 19 is a top plan view showing a sixteenth embodiment of the touch panel of the present invention.

第20圖為本發明觸控面板之觸控元件的網格圖案的放大示意圖。 FIG. 20 is an enlarged schematic view showing a mesh pattern of a touch element of the touch panel of the present invention.

第21圖為本發明觸控面板之第十七實施例的部分剖面示意圖。 Figure 21 is a partial cross-sectional view showing the seventeenth embodiment of the touch panel of the present invention.

第22圖為本發明觸控面板之第十八實施例的部分剖面示意圖。 Figure 22 is a partial cross-sectional view showing the eighteenth embodiment of the touch panel of the present invention.

第23圖為本發明觸控面板之第十九實施例的部分剖面示意圖。 Figure 23 is a partial cross-sectional view showing the nineteenth embodiment of the touch panel of the present invention.

第24圖為本發明觸控面板之第二十實施例的部分剖面示意圖。 Figure 24 is a partial cross-sectional view showing a twentieth embodiment of the touch panel of the present invention.

第25圖為本發明觸控面板之第二十一實施例的部分剖面示意圖。 Figure 25 is a partial cross-sectional view showing the twenty-first embodiment of the touch panel of the present invention.

表一為習知觸控面板與本發明觸控面板在落球實驗中的數據表。 Table 1 is a data table of a conventional touch panel and a touch panel of the present invention in a ball drop experiment.

為使熟習本發明所屬技術領域之一般技藝者能更進一步瞭解本發明,下文特列舉本發明之較佳實施例,並配合所附圖式,詳細說明本發明的構成內容及所欲達成之功效。 The present invention will be further understood by those of ordinary skill in the art to which the present invention pertains. .

請參考第1圖與第2圖,第1圖為本發明觸控面板之第一實施例的俯視示意圖,第2圖為第1圖所示觸控面板沿著切線A-A’的局部剖面示意圖。根據本發明之第一實施例,觸控面板100舉例為一單片基板式/單片玻璃式(one glass solution,OGS)觸控面板,但不以此為限。觸控面板100具有一透光區104與位於透光區104之至少一側的一遮光區106,本實施例的遮光區106環繞包圍透光區104,但不以此為限。本發明觸控基板100包括一透明硬質之基板102、一觸控元件108(例如是電容式觸控元件)以及一矽基強化層(silicon-based strengthening layer)110。其中,基板102的材料具有剛性,舉例為玻璃基板或塑膠基板,但不以此為限。觸控元件108包括多個電極設置於基板102之一表面上,例如第2圖所示之基板102上側之表面102a。本實施例的觸控元件108包括複數個第一軸向電極108X與複數個第二軸向電極108Y,分別沿著不同方向延伸排列且彼此絕緣。各第一軸向電極108X包括複數個第一電極部108X1與複數個第一連接部108X2,其中第一連接部108X2係用來連接同一條第一軸向電極108X的第一電極部108X1,類似地,各第二軸向電極108Y包括複數個第二電極部108Y1與複數個第二連接部108Y2,其中第二連接部108Y2係用來連接同一條第二軸向電極108Y的第二電極部108V1。在本實施例 中,第一電極部108X1、第二電極部108Y1及第二連接部108Y2係由同一層經圖案化之透明的導電層120所製作,而第一連接部108X2由另一經圖案化之透明的導電層122所製作,其中導電層122設置於導電層120相反於基板102之一側。透明的導電層120與122之材料舉例為氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)與氧化鋁鋅(aluminum zinc oxide,AZO),但不以此為限。然後,在其他實施例中,導電層120、120也可以包括其他適合之非透明導電材料,例如銀、鋁、銅、鎂、鉬、上述材料之複合層或上述材料之合金,例如導電層120、120可以由包含非透明材料構成的網格導電層。此外,觸控面板100可選擇性地另包括一絕緣層118,其至少局部設置在第一軸向電極108X與第二軸向電極108Y之間,例如設置在第一軸向電極108X與第二軸向電極108Y的相交處,以使第一軸向電極108X絕緣於第二軸向電極108Y。絕緣層118可以為無機絕緣層,材料例如氧化矽(SiO2)、氮化矽(SiNx)或氮氧化矽(SiOxNy),也可以為如環氧樹脂之有機絕緣層。在本實施例中,絕緣層118包括多個島狀的絕緣結構設置於第一連接部108X2與第二連接部108Y2之間,但不限於此。在其他實施例中,絕緣層118也可以是條狀的絕緣結構或是整面覆蓋於透光區104中。本設計可以利用第一電極部與第二電極部之間的邊緣效應來進行觸控感測。 Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a top plan view of a touch panel according to a first embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the touch panel along the line A-A′ of FIG. 1 . schematic diagram. According to the first embodiment of the present invention, the touch panel 100 is exemplified by a one-piece substrate/one-glass (OGS) touch panel, but is not limited thereto. The touch panel 100 has a light-transmitting region 104 and a light-shielding region 106 on at least one side of the light-transmitting region 104. The light-shielding region 106 of the present embodiment surrounds the light-transmitting region 104, but is not limited thereto. The touch substrate 100 of the present invention comprises a transparent hard substrate 102, a touch element 108 (for example, a capacitive touch element), and a silicon-based strengthening layer 110. The material of the substrate 102 is rigid, and is, for example, a glass substrate or a plastic substrate, but is not limited thereto. The touch element 108 includes a plurality of electrodes disposed on a surface of the substrate 102, such as the surface 102a on the upper side of the substrate 102 shown in FIG. The touch element 108 of the present embodiment includes a plurality of first axial electrodes 108X and a plurality of second axial electrodes 108Y extending in different directions and insulated from each other. Each of the first axial electrodes 108X includes a plurality of first electrode portions 108X1 and a plurality of first connecting portions 108X2, wherein the first connecting portion 108X2 is used to connect the first electrode portions 108X1 of the same first axial electrode 108X, similar to The second axial electrode 108Y includes a plurality of second electrode portions 108Y1 and a plurality of second connecting portions 108Y2, wherein the second connecting portion 108Y2 is used to connect the second electrode portion 108V1 of the same second axial electrode 108Y. . In this embodiment The first electrode portion 108X1, the second electrode portion 108Y1, and the second connecting portion 108Y2 are made of the same layer of the patterned transparent conductive layer 120, and the first connecting portion 108X2 is formed by another patterned transparent conductive layer. The layer 122 is fabricated, wherein the conductive layer 122 is disposed on the side of the conductive layer 120 opposite to the substrate 102. The materials of the transparent conductive layers 120 and 122 are exemplified by indium tin oxide (ITO), indium zinc oxide (IZO) and aluminum zinc oxide (AZO), but not limited thereto. . Then, in other embodiments, the conductive layers 120, 120 may also include other suitable non-transparent conductive materials, such as silver, aluminum, copper, magnesium, molybdenum, composite layers of the above materials, or alloys of the above materials, such as the conductive layer 120. 120 may be a grid conductive layer comprising a non-transparent material. In addition, the touch panel 100 can further include an insulating layer 118 at least partially disposed between the first axial electrode 108X and the second axial electrode 108Y, for example, disposed on the first axial electrode 108X and the second The intersection of the axial electrodes 108Y is such that the first axial electrode 108X is insulated from the second axial electrode 108Y. The insulating layer 118 may be an inorganic insulating layer such as yttrium oxide (SiO2), tantalum nitride (SiNx) or lanthanum oxynitride (SiOxNy), or may be an organic insulating layer such as an epoxy resin. In the present embodiment, the insulating layer 118 includes a plurality of island-shaped insulating structures disposed between the first connecting portion 108X2 and the second connecting portion 108Y2, but is not limited thereto. In other embodiments, the insulating layer 118 may also be a strip-shaped insulating structure or cover the entire area of the light-transmitting region 104. The design can utilize the edge effect between the first electrode portion and the second electrode portion to perform touch sensing.

再者,矽基強化層110設置於基板102之表面上且位於至少部分第一軸向電極108X/第二軸向電極108Y與基板102之間,以使由透明之導電層120、122製作的觸控元件108或第一軸向電極108X和第二軸向電極108Y與基板102的接觸面積小於基板102之總面積的50%,因此矽基強化層110至少會設置於透光區104內,或是說,透光區104內的矽基強化層110至少有一部分會位於觸控元件108與基板102之間或直接與基板102的表面102a相接觸。在本實施例中,透光區104內的矽基強化層110是設置在觸控元件108與基板102之間,因此觸控元件108並未與基板102直接接觸。需注意的是,矽基強化層110的材料應具有波阻抗小於基板102的波阻抗的特性,且在較佳情況下,基板102的 波阻抗與矽基強化層110的波阻抗之差異應大於5%,其中波阻抗為物質內部抵抗動量傳遞的能力,也可稱為特徵阻抗,可以定義為物質的密度與波在物質內傳播的速度之乘積。舉例而言,當基板102的材料為玻璃時,則矽基強化層110可選用揚氏模數(Young’s Modulus)不大於60Gpa者,例如聚矽氧烷材料,且在較佳情況下,聚矽氧烷材料中的反應性官能基(亦即矽與氧之外的其他組成,於本實施例中例如是芳香族羥基或/及烯基)較佳係佔3~50重量百分比,且聚矽氧烷的揚氏模數係控制在小於6Gpa,較佳介於2~5Gpa之間;當然,在其他實施例中,反應性官能基亦可以是其他官能基團,例如甲基,具體而言例如是聚二甲基矽氧烷,但不限於此,舉凡以無機矽氧鍵為主體且揚氏模數不大於60Gpa的聚矽氧烷,均適用於本發明。再者,聚矽氧烷可以是用溶凝膠法合成,或是以其他習知方式所合成而得的熱固型聚矽氧烷,於本實施例係為熱固型聚矽氧烷。此外,矽基強化層110係可以採用例如但不限於旋轉塗佈或狹縫塗佈(slot-die)之方式形成於基板102上,並且再施以200~350℃予以固化,於本實施例中,考量到盡量能夠不破壞觸控面板之元件(例如玻璃覆蓋板、油墨裝飾層)的特性,固化溫度較佳控制在介於200~280℃之溫度予以固化,更佳控制在260℃以下;例如採用200度以上的固化溫度以及奈米壓痕測試實驗所得到的結果,當固化溫度越高,揚氏模數越低,但當溫度越高,官能基團的含量會越少,理論上揚氏模數應該會升高,但實驗所得到的結果是揚氏模數反而降低的,推論矽基強化層110的內部形成有多數孔隙,才造成這樣的實驗結果;並且,矽基強化層110的厚度例如是控制在大於約0.4微米至約50微米,較佳是大於約0.8微米至約50微米,最佳是大於約1.2微米至約50微米,於本實施例中是採用2.5微米作為舉例說明。再者,矽基強化層110可以是一層或多層結構之堆疊,例如可包括相同或不同材料層之堆疊結構。另一提的是,上述矽基強化層110的固化程序較佳是在大氣下進行,但本發明不限於此,例如也可以在氮氣環境下進行。上述矽基強化層110的材料與製程條件也適用於本發明所有的實施例。 Furthermore, the ruthenium-based strengthening layer 110 is disposed on the surface of the substrate 102 and located between at least a portion of the first axial electrode 108X / the second axial electrode 108Y and the substrate 102 to be made of the transparent conductive layers 120, 122. The contact area of the touch element 108 or the first axial electrode 108X and the second axial electrode 108Y with the substrate 102 is less than 50% of the total area of the substrate 102. Therefore, the bismuth-based strengthening layer 110 is disposed at least in the transparent region 104. In other words, at least a portion of the ruthenium-based enhancement layer 110 in the light-transmissive region 104 may be located between the touch element 108 and the substrate 102 or directly in contact with the surface 102a of the substrate 102. In the present embodiment, the germanium-based strengthening layer 110 in the light-transmitting region 104 is disposed between the touch element 108 and the substrate 102, so that the touch element 108 is not in direct contact with the substrate 102. It should be noted that the material of the ruthenium-based strengthening layer 110 should have a characteristic that the wave impedance is smaller than the wave impedance of the substrate 102, and in the preferred case, the substrate 102 The difference between the wave impedance and the wave impedance of the ruthenium-based strengthening layer 110 should be greater than 5%. The wave impedance is the ability of the material to resist the transfer of momentum inside, and can also be called characteristic impedance, which can be defined as the density of the substance and the wave propagating within the substance. The product of speed. For example, when the material of the substrate 102 is glass, the ruthenium-based strengthening layer 110 may be selected from a Young's Modulus of not more than 60 GPa, such as a polyoxyalkylene material, and preferably, a polyfluorene. The reactive functional group in the oxyalkylene material (that is, the composition other than ruthenium and oxygen, in the present embodiment, for example, an aromatic hydroxy group or/and an alkenyl group) preferably accounts for 3 to 50% by weight, and the polyfluorene The Young's modulus of the oxyalkylene is controlled to be less than 6 GPa, preferably between 2 and 5 GPa; of course, in other embodiments, the reactive functional group may also be another functional group, such as a methyl group, specifically, for example It is a polydimethyl siloxane, but is not limited thereto, and a polyoxy siloxane having an inorganic oxime bond as a main component and a Young's modulus of not more than 60 GPa is suitable for use in the present invention. Further, the polyoxyalkylene oxide may be a thermosetting polyoxyalkylene which is synthesized by a lyotropic method or synthesized in another conventional manner, and is a thermosetting polyoxyalkylene in this embodiment. In addition, the ruthenium-based strengthening layer 110 may be formed on the substrate 102 by, for example, but not limited to, spin coating or slot-die, and then cured at 200-350 ° C, in this embodiment. In the above, it is considered that the characteristics of the components of the touch panel (such as the glass cover plate and the ink decorative layer) are not damaged as much as possible, and the curing temperature is preferably controlled at a temperature of 200 to 280 ° C to be cured, and more preferably controlled below 260 ° C. For example, using a curing temperature of 200 degrees or more and a result of a nanoindentation test, the higher the curing temperature, the lower the Young's modulus, but the higher the temperature, the less the functional group content. The upper Young's modulus should increase, but the experimental results show that the Young's modulus is reduced, and it is inferred that a large number of pores are formed inside the ruthenium-based strengthening layer 110 to cause such experimental results; and, the ruthenium-based strengthening layer The thickness of 110 is, for example, controlled to be greater than about 0.4 microns to about 50 microns, preferably greater than about 0.8 microns to about 50 microns, and most preferably greater than about 1.2 microns to about 50 microns, in this embodiment 2.5 microns is used. for example . Further, the ruthenium-based strengthening layer 110 may be a stack of one or more layers of structure, for example, may comprise a stack of the same or different layers of materials. It is to be noted that the curing process of the ruthenium-based strengthening layer 110 is preferably carried out under the atmosphere, but the invention is not limited thereto, and for example, it may be carried out under a nitrogen atmosphere. The materials and process conditions of the above-described ruthenium-based strengthening layer 110 are also applicable to all embodiments of the present invention.

上述的硬質之基板102可以是經化物理方式或化學方式處理而形成的強化玻璃基板(strenghened glass substrate)。舉例而言,化學強化處理可為一化學離子強化處理,於化學離子強化處理過程中,可將待強化的玻璃基板置入熔融的鉀鹽中,使鉀離子與玻璃基板表層的鈉離子進行離子交換而產生一化學強化層,如此可使玻璃基板表層形成一壓應力層DOL,並使玻璃基板內部衍生出適當的張應力TS以使整體達到力平衡。當壓應力層DOL越厚,約束玻璃表層裂縫成長的能力越強,使強化玻璃基板的強度越高,可以提高玻璃表面抵抗外物撞擊(impact)的能力。在這個例子中,化學強化層是指鉀離子從玻璃表面擴散進入玻璃內的平均深度,較佳的定義是指最大擴散深度的平均值。擴散深度一般可以藉由儀器偵測鉀離子是否存在而得知。由於即使在同一道製程下,擴散深度仍會有深淺不一的情形存在,因此取擴散深度的平均值作為判定標準。化學強化層與壓應力層DOL的關係,舉例而言在Varshneya(1975)的文獻中指出,離子交換層深度會略大於壓應力層DOL的深度。於一片玻璃製程中,若是對已完成初次化學強化後的強化玻璃基板進行機械加工或材料移除處理(例如切割強化玻璃基板),該些處理可能會使強化玻璃基板衍生出不存在強化層的新生成表面(例如強化玻璃基板的被切割面),未被強化層覆蓋的新生成表面裂縫較易成長而可能降低強化玻璃基板的強度。因此,可再利用二次化學強化處理(例如以HF蝕刻)新生成表面區域、或補強因機械加工或材料移除處理等原因而被削弱或局部移除的原先的強化層(例如在強化玻璃基板的被切割面塗佈一膠層並固化此膠層),以提供良好的強化玻璃強度。 The hard substrate 102 described above may be a strengthened glass substrate formed by chemical or chemical treatment. For example, the chemical strengthening treatment may be a chemical ion strengthening treatment. During the chemical ion strengthening treatment, the glass substrate to be strengthened may be placed in a molten potassium salt to ionize the potassium ions and the sodium ions on the surface of the glass substrate. The exchange produces a chemical strengthening layer, so that the surface layer of the glass substrate forms a compressive stress layer DOL, and an appropriate tensile stress TS is derived inside the glass substrate to achieve a force balance. The thicker the compressive stress layer DOL, the stronger the ability to restrain the crack growth of the glass surface layer, and the higher the strength of the strengthened glass substrate, the higher the ability of the glass surface to resist the impact of foreign objects. In this example, the chemical strengthening layer refers to the average depth at which potassium ions diffuse from the surface of the glass into the glass, and is preferably defined as the average of the maximum diffusion depth. The depth of diffusion can generally be known by the instrument detecting the presence of potassium ions. Since the diffusion depth still has different depths even under the same process, the average value of the diffusion depth is taken as the criterion. The relationship between the chemically strengthened layer and the compressive stress layer DOL, for example, is pointed out in the literature by Varshneya (1975), the depth of the ion exchange layer is slightly greater than the depth of the compressive stress layer DOL. In a glass process, if the tempered glass substrate after the initial chemical strengthening has been machined or material removed (for example, a cut tempered glass substrate), the treatment may cause the strengthened glass substrate to be derivatized without a strengthening layer. The newly formed surface (for example, the cut surface of the tempered glass substrate), the newly formed surface crack not covered by the reinforcing layer is relatively easy to grow and may lower the strength of the tempered glass substrate. Therefore, it is possible to reuse a secondary chemical strengthening treatment (for example, HF etching) to newly generate a surface region, or to reinforce the original strengthening layer which is weakened or partially removed due to machining or material removal treatment, etc. (for example, in tempered glass). The cut surface of the substrate is coated with a glue layer and the glue layer is cured to provide good tempered glass strength.

習知技術中,當觸控面板的基板表面形成了例如透明導電層(例如ITO的波阻抗為17.07*106)的導電層時,由於透明導電層的波阻抗大於硬質基板的波阻抗,因此當基板表面受到外界物體撞擊時,撞擊的震波在經過基板內部傳導到基板與導電層的介面時,震波會反射回到基板內並在基板內部產生干涉,讓基板容易破裂損傷。反觀本發明係在基板102的非撞擊面(即 表面102a)上配置波阻抗小於基板102且揚氏模數(Young’s Modulus)不大於60Gpa的矽基強化層110,且其設置面積至少為基板102之面積的50%以上,當撞擊的震波從基板102衝擊面進入到基板102內部並傳導到基板102與矽基強化層110的介面(即表面102a)時,因為矽基強化層110的波阻抗小於基板102的波阻抗且揚氏模數(Young’s Modulus)不大於60Gpa,因此能增加震波穿透基板102的比例,使得震波在基板102內部產生干涉的狀況大幅降低,外力所引起的震波可以更有效地從基板102經由基板102與矽基強化層110介面往矽基強化層110傳遞,能分散外力對基板102所造成的破壞,即使矽基強化層110上側的透明導電層120的波阻抗為高達17.07*106而大於矽基強化層110,矽基強化層110的設置仍能提供基板102良好的防撞能力。 In the prior art, when a conductive layer such as a transparent conductive layer (for example, a wave impedance of ITO is 17.07*10 6 ) is formed on the surface of the substrate of the touch panel, since the wave impedance of the transparent conductive layer is larger than the wave impedance of the hard substrate, When the surface of the substrate is struck by an external object, when the shock wave is transmitted through the substrate to the interface between the substrate and the conductive layer, the shock wave is reflected back into the substrate and interference is generated inside the substrate, so that the substrate is easily broken and damaged. In contrast, the present invention provides a ruthenium-based strengthening layer 110 having a wave impedance smaller than that of the substrate 102 and a Young's Modulus of not more than 60 GPa on the non-impinging surface of the substrate 102 (ie, the surface 102a), and the installation area is at least the substrate 102. More than 50% of the area, when the shock wave of the impact enters the inside of the substrate 102 from the impact surface of the substrate 102 and is conducted to the interface of the substrate 102 and the ruthenium-based strengthening layer 110 (ie, the surface 102a), because of the wave impedance of the ruthenium-based strengthening layer 110 It is smaller than the wave impedance of the substrate 102 and the Young's Modulus is not more than 60 GPa, so that the ratio of the seismic wave penetrating the substrate 102 can be increased, so that the interference of the shock wave inside the substrate 102 is greatly reduced, and the shock wave caused by the external force can be further reduced. Effectively transferring from the substrate 102 to the ruthenium-based strengthening layer 110 via the substrate 102 and the ruthenium-based strengthening layer 110, the external force can be dissipated to damage the substrate 102 even if the wave resistance of the transparent conductive layer 120 on the upper side of the ruthenium-based strengthening layer 110 is Up to 17.07*10 6 and larger than the ruthenium-based strengthening layer 110, the arrangement of the ruthenium-based strengthening layer 110 can still provide good collision resistance of the substrate 102.

請參考表一,表一為習知觸控面板與本發明觸控面板在落球實驗中的數據表。在實驗中,將落球由不同高度對著觸控面板的中/心點落下,紀錄基板破裂的高度,其中落球重量為130克,基板表面的導電材料膜層朝下,而落球的最高測試高度為110公分,且本發明觸控面板與習知觸控面板皆使用相同的基板材料和導電材料。由表一可知,習知觸控面板在基板表面設有導電材料時,基板破裂的落球高度平均值為5公分,而在本發明觸控面板的基板表面設置了前述矽基強化層時,基板破裂的落球高度平均值為78.5公分,由此可知,本發明觸控面板在基板表面設置了矽基強化層後,即使基板上設置了導電材料,基板的防撞能力仍然能夠大幅提昇約15倍,效果相當顯著。 Please refer to Table 1. Table 1 is a data table of a conventional touch panel and a touch panel of the present invention in a ball drop experiment. In the experiment, the falling ball is dropped from the height to the center/heart point of the touch panel, and the height of the substrate is broken. The weight of the falling ball is 130 grams, the conductive material layer on the surface of the substrate faces downward, and the highest test height of the falling ball. It is 110 cm, and both the touch panel of the present invention and the conventional touch panel use the same substrate material and conductive material. It can be seen from Table 1 that when the conventional touch panel is provided with a conductive material on the surface of the substrate, the average ball landing height of the substrate is 5 cm, and when the ruthenium-based strengthening layer is disposed on the surface of the substrate of the touch panel of the present invention, the substrate is The average height of the falling ball is 78.5 cm. It can be seen that after the touch panel of the present invention is provided with a ruthenium-based strengthening layer on the surface of the substrate, even if a conductive material is disposed on the substrate, the collision resistance of the substrate can be greatly improved by about 15 times. The effect is quite remarkable.

請再參考第2圖,本發明觸控面板100可另包括一裝飾層112設於遮光區106內,裝飾層112可由油墨或光阻材料所構成,但不以此為限。當裝飾層112為非黑油墨材料時,其總厚度T介於約5至40微米,可以為單層油墨或多層油墨堆疊、單層光阻或多層光阻堆疊或由至少一層光阻層與一層油墨層所堆疊之結構。在不同實施例中,裝飾層112也可以是由不同顏色之油墨層或光阻層所堆疊而成。如第2圖所示,矽基強化層110可以至少局部延伸設置到裝飾層112上並覆蓋裝飾層112,而觸控元件108也部分覆蓋裝飾層112,因此本實施例的裝飾層112位於部分矽基強化層110與基板102之間,也位於遮光區106之觸控元件108與基板102之間。此外,觸控面板100另包括至少一周邊走線114(第2圖繪出3條)設置於裝飾層112上並電連接於各相對應的第一軸向電極108X與第二軸向電極108Y,本實施例之觸控元件108是直接延伸至裝飾層112而與對應的周邊走線114相接觸而與其電連接,且第2圖的矽基強化層110沒有覆蓋周邊走線114。此外,周邊走線114之另一端則可與外部驅動電路(圖未示)電性連接。再者,觸控面板100還包括一保護層(passivation)116全面覆蓋周邊走線114與觸控元件108,其中本實施例的保護層116可以由無機材料所構成,例如包括氧化矽(SiO2)、氮化矽(SiNx)或氮氧化矽(SiOxNy)材料,保護層116也可以由有機材料所構成,例如包括光阻或PI等樹脂材料, 但不限於此。或者,保護層116的材料也可以相同於矽基強化層110,以減少製造程序與條件的複雜性。當然,在其他實施例中,也可以先形成矽基強化層之後再形成裝飾層,如此,較佳可在矽基強化層表面先形成一保護層(材料可以同上述保護層116)或是進行表面改質(例如表面電漿處理),以使裝飾層能夠更穩固附著在矽基強化層上。 Referring to FIG. 2 again, the touch panel 100 of the present invention may further include a decorative layer 112 disposed in the light shielding region 106. The decorative layer 112 may be formed of an ink or a photoresist material, but is not limited thereto. When the decorative layer 112 is a non-black ink material, the total thickness T thereof is between about 5 and 40 microns, and may be a single layer ink or a multilayer ink stack, a single layer photoresist or a multilayer photoresist stack or by at least one photoresist layer. A structure in which a layer of ink is stacked. In various embodiments, the decorative layer 112 may also be formed by stacking ink layers or photoresist layers of different colors. As shown in FIG. 2, the ruthenium-based strengthening layer 110 may be at least partially extended to the decorative layer 112 and cover the decorative layer 112, and the touch element 108 also partially covers the decorative layer 112. Therefore, the decorative layer 112 of the embodiment is located at a portion. The ruthenium-based enhancement layer 110 and the substrate 102 are also located between the touch element 108 and the substrate 102 of the light-shielding region 106. In addition, the touch panel 100 further includes at least one peripheral trace 114 (three strips are drawn in FIG. 2 ) disposed on the decorative layer 112 and electrically connected to the corresponding first axial electrode 108X and second axial electrode 108Y. The touch element 108 of the present embodiment extends directly to the decorative layer 112 to be in electrical contact with the corresponding peripheral trace 114, and the germanium-based enhancement layer 110 of FIG. 2 does not cover the peripheral trace 114. In addition, the other end of the peripheral trace 114 can be electrically connected to an external driving circuit (not shown). In addition, the touch panel 100 further includes a passivation 116 covering the peripheral traces 114 and the touch elements 108. The protective layer 116 of the embodiment may be made of an inorganic material, for example, including yttrium oxide (SiO2). a material of tantalum nitride (SiNx) or yttrium oxynitride (SiOxNy), and the protective layer 116 may also be composed of an organic material, for example, a resin material such as photoresist or PI. But it is not limited to this. Alternatively, the material of the protective layer 116 may be the same as the ruthenium based strengthening layer 110 to reduce the complexity of the manufacturing process and conditions. Of course, in other embodiments, the ruthenium-based strengthening layer may be formed first, and then the decorative layer may be formed. Therefore, a protective layer (the material may be the same as the protective layer 116) may be formed on the surface of the ruthenium-based strengthening layer. Surface modification (such as surface plasma treatment) to allow the decorative layer to adhere more firmly to the ruthenium-based reinforcement layer.

請參考第3圖,第3圖為本發明觸控面板之第二實施例的部分剖面示意圖。與前一實施例相較,本實施例中的矽基強化層110可經過一表面處理以形成一粗糙表面110a,此設計可降低後續導電層對光線的反射,特別是當觸控元件108包含金屬材料時,具粗糙表面110a的矽基強化層110可進一步降低視覺亮點的現象。此外,本實施例的矽基強化層110向外延伸到基板102的側壁102b並包覆在側壁102b,可進一步提升基板102的側邊保護。需注意的是,本實施例矽基強化層110的粗糙表面110a和包覆側壁102b的設計可應用於後續本發明之各實施例及變化形中,不再贅述。 Please refer to FIG. 3 , which is a partial cross-sectional view showing a second embodiment of the touch panel of the present invention. Compared with the previous embodiment, the ruthenium-based strengthening layer 110 in this embodiment may be subjected to a surface treatment to form a rough surface 110a, which reduces the reflection of the light by the subsequent conductive layer, especially when the touch element 108 includes In the case of a metallic material, the ruthenium-based strengthening layer 110 having a rough surface 110a can further reduce the phenomenon of visual bright spots. In addition, the ruthenium-based strengthening layer 110 of the present embodiment extends outward to the sidewall 102b of the substrate 102 and is coated on the sidewall 102b to further enhance the side protection of the substrate 102. It should be noted that the design of the rough surface 110a and the cladding sidewall 102b of the ruthenium-based strengthening layer 110 of the present embodiment can be applied to various embodiments and variations of the present invention, and details are not described herein.

請參考第4圖,第4圖為本發明觸控面板之第三實施例的部分剖面示意圖。本實施例與第一實施例的不同處在於保護層116可包括第一保護層1161與第二保護層1162,第一保護層1161與第二保護層1162的至少其中之一可以由無機材料或有機材料所構成。舉例而言,第一保護層1161由較薄的無機材料層構成,而第二保護層1162由較厚的有機材料層構成,但不以此為限,兩者製作順序可互換。再者,第一保護層1161與第二保護層1162的其中一者之材料可相同於矽基強化層110的材料,以降低製程與條件的複雜性。 Please refer to FIG. 4, which is a partial cross-sectional view showing a third embodiment of the touch panel of the present invention. The difference between this embodiment and the first embodiment is that the protective layer 116 may include a first protective layer 1161 and a second protective layer 1162, and at least one of the first protective layer 1161 and the second protective layer 1162 may be made of inorganic materials or Made up of organic materials. For example, the first protective layer 1161 is composed of a thinner inorganic material layer, and the second protective layer 1162 is composed of a thicker organic material layer, but not limited thereto, the order of the two is interchangeable. Moreover, the material of one of the first protective layer 1161 and the second protective layer 1162 may be the same as the material of the ruthenium-based strengthening layer 110 to reduce the complexity of the process and conditions.

請參考第5圖,第5圖為本發明觸控面板之第四實施例的部分剖面示意圖。本實施例與第三實施例的差別在於第二保護層1162具有圖案化的設計,第二保護層1162在遮光區106覆蓋了裝飾層112與周邊走線114,而在透光區104僅於第二連接部108Y2與第一連接部108X2相交處覆蓋觸控元件108。值得注意的是,本實施例與前述實施例中保護層116具有第一與第二保護層1161、1162的設計可以應用於後續各實施例及其變化形中,且第二保護層1162可以 依需要而具有圖案化設計,即使後續實施例之對應圖式沒有繪出保護層116,但將第4圖與第5圖的保護層116應用於本發明各實施例皆屬本發明之揭露範圍。 Please refer to FIG. 5. FIG. 5 is a partial cross-sectional view showing a fourth embodiment of the touch panel of the present invention. The difference between this embodiment and the third embodiment is that the second protective layer 1162 has a patterned design. The second protective layer 1162 covers the decorative layer 112 and the peripheral traces 114 in the light-shielding region 106, and only in the transparent region 104. The second connecting portion 108Y2 overlaps the first connecting portion 108X2 to cover the touch element 108. It should be noted that the design of the first and second protective layers 1161, 1162 of the protective layer 116 in this embodiment and the foregoing embodiment may be applied to subsequent embodiments and variations thereof, and the second protective layer 1162 may be If there is a patterned design as needed, even if the corresponding pattern of the subsequent embodiment does not depict the protective layer 116, applying the protective layer 116 of FIGS. 4 and 5 to the embodiments of the present invention is within the scope of the present invention. .

請參考第6圖,第6圖為本發明觸控面板之第五實施例的部分剖面示意圖。與第2圖所示之第一實施例相較,本實施例的矽基強化層110在裝飾層112區域可以覆蓋周邊走線114之至少一部分,以提供周邊走線114進一步的保護。由於周邊走線114一般需與所對應的觸控元件108之電極相電連接,因此本實施例之矽基強化層110較佳包括至少一接觸洞1101,曝露出部分周邊走線114,而觸控元件108的電極的至少其中一者係藉由接觸洞1101而電連接於周邊走線114。本實施例的周邊走線114與觸控元件108的電極係由不同的膜層所構成,例如周邊走線114由金屬或導電性良好的材料層所構成,例如銀、鋁、銅、鎂、鉬等金屬層、上述材料之複合層或上述材料之合金層,而觸控元件108的電極由透明之導電層120所構成,其材料如前述實施例所述,不再贅述。然而,本發明的周邊走線114與觸控元件108的材料並不以本實施例為限。再者,圖案化之透明導電層120可另包括複數個保護部124,設置在矽基強化層110的表面上並對應於周邊走線114,例如保護部124可與周邊走線124有相同的形狀或圖案,或者,保護部124至少部分覆蓋周邊走線114。保護部124能更進一步保護周邊走線110,避免在後續形成觸控元件108時,圖案化導電層120的化學液體滲入矽基強化層110而傷害周邊走線114,導致斷線或發生電性不良之問題,由第6圖可知,本實施例的保護部124與第一電極部108X1、第二電極部108Y1和第二連接部108Y2皆由相同的透明導電層120經圖案化後所構成。此外,本實施例的保護層116雖然類似於第一實施例僅具有單層結構,但在其他變化形中,觸控面板100的保護層也可以如第4圖或第5圖所示,具有雙層保護層,且其中的上層保護層可以有圖案化的設計。 Please refer to FIG. 6. FIG. 6 is a partial cross-sectional view showing a fifth embodiment of the touch panel of the present invention. In contrast to the first embodiment illustrated in FIG. 2, the ruthenium-based enhancement layer 110 of the present embodiment may cover at least a portion of the perimeter traces 114 in the region of the trim layer 112 to provide further protection of the perimeter traces 114. Since the peripheral traces 114 are generally electrically connected to the electrodes of the corresponding touch elements 108, the ruthenium-based enhancement layer 110 of the present embodiment preferably includes at least one contact hole 1101, exposing a portion of the peripheral traces 114, and touching At least one of the electrodes of the control element 108 is electrically coupled to the peripheral trace 114 by the contact hole 1101. The peripheral traces 114 of the present embodiment and the electrodes of the touch element 108 are formed by different film layers. For example, the peripheral traces 114 are made of metal or a layer of conductive material, such as silver, aluminum, copper, magnesium, The metal layer of molybdenum or the like, the composite layer of the above materials or the alloy layer of the above materials, and the electrode of the touch element 108 is composed of the transparent conductive layer 120, and the materials thereof are as described in the foregoing embodiments, and will not be described again. However, the material of the peripheral trace 114 and the touch element 108 of the present invention is not limited to this embodiment. Moreover, the patterned transparent conductive layer 120 may further include a plurality of protection portions 124 disposed on the surface of the ruthenium-based enhancement layer 110 and corresponding to the peripheral traces 114. For example, the protection portion 124 may have the same structure as the peripheral traces 124. The shape or pattern, or the guard 124 at least partially covers the perimeter trace 114. The protection portion 124 can further protect the peripheral traces 110, so as to prevent the chemical liquid of the patterned conductive layer 120 from infiltrating the ruthenium-based enhancement layer 110 and damage the peripheral traces 114 when the touch element 108 is subsequently formed, thereby causing wire breakage or electrical occurrence. The problem of the defect is as shown in Fig. 6. The protective portion 124 of the present embodiment and the first electrode portion 108X1, the second electrode portion 108Y1, and the second connecting portion 108Y2 are each formed by patterning the same transparent conductive layer 120. In addition, although the protective layer 116 of the present embodiment has only a single layer structure similar to the first embodiment, in other variations, the protective layer of the touch panel 100 may also have the same as shown in FIG. 4 or FIG. A double layer of protective layer, and the upper protective layer therein may have a patterned design.

請參考第7圖,第7圖為本發明觸控面板之第六實施例的部分剖面 示意圖。本實施例與前一實施例的差異處在於周邊走線114上側的保護部126具有塊狀設計,其同時橫跨覆蓋了複數條周邊走線114,同樣能提供保護周邊走線114的功能。 Please refer to FIG. 7. FIG. 7 is a partial cross-sectional view showing a sixth embodiment of the touch panel of the present invention. schematic diagram. The difference between this embodiment and the previous embodiment is that the protection portion 126 on the upper side of the peripheral trace 114 has a block design, which simultaneously covers a plurality of peripheral traces 114, and can also provide the function of protecting the peripheral traces 114.

請參考第8圖,第8圖為本發明觸控面板之第七實施例的部分剖面示意圖。本實施例觸控面板100與第二圖所示之第一實施例的主要差別在於周邊走線114是設置在矽基強化層110上,因此矽基強化層110在遮光區106是位於周邊走線114與裝飾層112之間。由於觸控元件108與周邊走線114皆位於矽基強化層110上,因此延伸至遮光區106的觸控元件108可經由與周邊走線114直接接觸而電連接於所對應之周邊走線114。在變化實施例中,周邊走線114與觸控元件108的一部分也可以由相同的圖案化導電層所構成,也就是說觸控元件108延伸至遮光區106的部分可視為周邊走線114。再者,本實施例的矽基強化層110係延伸覆蓋整個裝飾層112,但不以此為限。需注意的是,第8圖中雖沒有畫出覆蓋在周邊走線114與觸控元件108表面的保護層,本實施例觸控面板100仍可包括如前述實施例的保護層116,例如保護層可具有單層或雙層結構,又其中一層保護層可具有圖案化設計,後續實施例亦同,不再贅述。 Please refer to FIG. 8. FIG. 8 is a partial cross-sectional view showing a seventh embodiment of the touch panel of the present invention. The main difference between the touch panel 100 of the present embodiment and the first embodiment shown in the second figure is that the peripheral traces 114 are disposed on the ruthenium-based enhancement layer 110, so that the ruthenium-based enhancement layer 110 is located at the periphery of the opaque region 106. Between the line 114 and the decorative layer 112. Since the touch element 108 and the peripheral traces 114 are both located on the germanium-based enhancement layer 110, the touch elements 108 extending to the light-shielding region 106 can be electrically connected to the corresponding peripheral traces 114 via direct contact with the peripheral traces 114. . In a variant embodiment, the peripheral trace 114 and a portion of the touch element 108 may also be formed by the same patterned conductive layer, that is, the portion of the touch element 108 extending to the light-shielding region 106 may be regarded as the peripheral trace 114. Furthermore, the ruthenium-based strengthening layer 110 of the present embodiment extends over the entire decorative layer 112, but is not limited thereto. It should be noted that, in FIG. 8 , the protective layer covering the surface of the peripheral trace 114 and the touch component 108 is not shown. The touch panel 100 of the embodiment may further include the protective layer 116 as in the foregoing embodiment, for example, protection. The layer may have a single layer or a double layer structure, and one of the protective layers may have a patterned design, and the subsequent embodiments are the same, and will not be described again.

請參考第9圖,第9圖為本發明觸控面板之第八實施例的部分剖面示意圖。本實施例與前述實施例的最大差異處在於周邊走線114包括下部走線1141與上部走線1142雙層結構,其中下部走線1141可由金屬或高導電性材料所構成,而上部走線1142可由構成第一電極部108X1、第二電極部108Y1和第二連接部108Y2的圖案化透明之導電層120所形成,其中各周邊走線114的上部走線1142較佳包覆在下部走線1141外側,以進一步保護下部走線1141。然而,本實施例的上部走線1142也可視為第6圖的保護部124,分別對應一條走線114(即第9圖的下部走線1141)並包覆整條所對應之走線114。 Please refer to FIG. 9. FIG. 9 is a partial cross-sectional view showing the eighth embodiment of the touch panel of the present invention. The biggest difference between this embodiment and the foregoing embodiment is that the peripheral trace 114 includes a double layer structure of the lower trace 1141 and the upper trace 1142, wherein the lower trace 1141 can be composed of metal or highly conductive material, and the upper trace 1142 The patterned transparent conductive layer 120 constituting the first electrode portion 108X1, the second electrode portion 108Y1, and the second connecting portion 108Y2 may be formed, wherein the upper trace 1142 of each peripheral trace 114 is preferably coated on the lower trace 1141. The outer side is to further protect the lower trace 1141. However, the upper traces 1142 of the present embodiment can also be regarded as the protection portions 124 of FIG. 6, corresponding to one trace 114 (ie, the lower trace 1141 of FIG. 9) and covering the entire trace 114.

請參考第10圖,第10圖為本發明觸控面板之第九實施例的部分剖 面示意圖。與第一實施例相較,本實施例觸控面板10另包括一介質層128設置於矽基強化層110與基板102之間,以增加後續膜層與基板102之間介面的附著性。介質層128較佳為無機材料,例如氧化矽(SiO2)、氮化矽(SiNx)或氮氧化矽(SiOxNy)等。較佳地,介質層128的波阻抗相近於與基板102的波阻抗,例如介質層128與基板102的波阻抗差異小於5%。本實施例介質層128的設置可應用於本發明其他各實施例中,不再贅述。 Please refer to FIG. 10 , which is a partial cross-sectional view of a ninth embodiment of the touch panel of the present invention. Schematic diagram. Compared with the first embodiment, the touch panel 10 of the present embodiment further includes a dielectric layer 128 disposed between the ruthenium-based enhancement layer 110 and the substrate 102 to increase the adhesion between the subsequent layers and the substrate 102. The dielectric layer 128 is preferably an inorganic material such as cerium oxide (SiO2), cerium nitride (SiNx) or cerium oxynitride (SiOxNy). Preferably, the wave impedance of the dielectric layer 128 is similar to the wave impedance of the substrate 102, for example, the difference in wave impedance between the dielectric layer 128 and the substrate 102 is less than 5%. The arrangement of the medium layer 128 in this embodiment can be applied to other embodiments of the present invention, and details are not described herein again.

請參考第11圖,第11圖為本發明觸控面板之第十實施例的部分剖面示意圖。本實施例與第一實施例的主要不同處在於,觸控面板100另包括一介質層130設置於矽基強化層110上,以增加後續膜層與矽基強化層110之間的介面附著性。介質層130可為無機材料層,例如包括氧化矽、氮化矽或氮氧化矽等。此外,在遮光區106,介質層130位於周邊走線114與矽基強化層110之間。本實施例介質層130的設置可應用於本發明其他各實施例中,不再贅述。 Please refer to FIG. 11. FIG. 11 is a partial cross-sectional view showing a tenth embodiment of the touch panel of the present invention. The main difference between this embodiment and the first embodiment is that the touch panel 100 further includes a dielectric layer 130 disposed on the ruthenium-based enhancement layer 110 to increase the interface adhesion between the subsequent film layer and the ruthenium-based reinforcement layer 110. . The dielectric layer 130 may be an inorganic material layer including, for example, cerium oxide, cerium nitride or cerium oxynitride. Further, in the light-shielding region 106, the dielectric layer 130 is located between the peripheral traces 114 and the ruthenium-based enhancement layer 110. The arrangement of the dielectric layer 130 in this embodiment can be applied to other embodiments of the present invention and will not be described again.

請參考第12圖與第13圖,第12圖為本發明觸控面板之第十一實施例的俯視示意圖,第13圖為第12圖所示觸控面板沿著切線B-B’的局部剖面示意圖。在本實施例中,觸控元件108包括複數條電極1081與複數個電極部1082,且各電極1081與各電極部1082為互相絕緣配置,觸控面板100係利用相鄰之電極1081與電極部1082之間的邊緣效應來進行觸控感測。電極1081與電極部1082較佳由同一層圖案化之電極層所構成,例如透明之導電層120或金屬網格層(圖未示),但不以此為限。電極1081與電極部1082可分別與一條周邊走線114電性連接。本實施例觸控面板100另包括裝飾層112、矽基強化層110及保護層116設於硬質之基板102的表面102a上。在變化實施例中,矽基強化層110與周邊走線114、裝飾層112的相對位置與配置關係可參考前述實施例之其他設置方式,不再贅述。 Please refer to FIG. 12 and FIG. 13 . FIG. 12 is a top plan view of the eleventh embodiment of the touch panel of the present invention, and FIG. 13 is a partial view of the touch panel along the tangential line B-B′ of FIG. 12 . Schematic diagram of the section. In this embodiment, the touch element 108 includes a plurality of electrodes 1081 and a plurality of electrode portions 1082, and each of the electrodes 1081 and the electrode portions 1082 are insulated from each other, and the touch panel 100 utilizes adjacent electrodes 1081 and electrode portions. The edge effect between 1082 is used for touch sensing. The electrode 1081 and the electrode portion 1082 are preferably formed by the same layer of patterned electrode layers, such as a transparent conductive layer 120 or a metal mesh layer (not shown), but are not limited thereto. The electrode 1081 and the electrode portion 1082 can be electrically connected to a peripheral trace 114, respectively. The touch panel 100 of the present embodiment further includes a decorative layer 112, a ruthenium-based strengthening layer 110 and a protective layer 116 disposed on the surface 102a of the rigid substrate 102. For a change of the relative position and arrangement relationship of the ruthenium-based layer 110 and the slabs 114 and the slabs 112, reference may be made to other arrangements of the foregoing embodiments, and details are not described herein.

請參考第14圖,第14圖為本發明觸控面板之第十二實施例的俯視示意圖。本實施例與前一實施例的不同處在於觸控元件108可包括兩兩相對設置且寬度變換趨勢相反的電極部1083、1084,其中電極部1083、1084較佳由 同一層圖案化之導電層所組成,如前述實施例中的導電層120。本實施例觸控面板100除了觸控元件108的形狀結構設計不同於前述實施之外,其矽基強化層、周邊走線、保護層及裝飾層的結構與設置方式皆可參考前述各實施例,不再贅述。 Please refer to FIG. 14 , which is a top plan view of a twelfth embodiment of the touch panel of the present invention. The difference between this embodiment and the previous embodiment is that the touch component 108 can include two opposite electrode portions 1083 and 1084 whose opposite width directions are opposite, wherein the electrode portions 1083 and 1084 are preferably The same layer of patterned conductive layers are formed, such as conductive layer 120 in the previous embodiment. In the touch panel 100 of the present embodiment, in addition to the shape and structure design of the touch element 108, the structure and arrangement of the ruthenium-based reinforcing layer, the peripheral trace, the protective layer and the decorative layer can be referred to the foregoing embodiments. ,No longer.

請參考第15圖,第15圖為本發明觸控面板之第十三實施例的俯視示意圖。本實施例觸控面板100的觸控元件108包括雙層圖案化電極層142、144,兩者之間配置有絕緣層(圖未示)以構成複數個電容感測結構。圖案化電極層142包括複數個條狀之第一電極1085,而圖案化電極層144包括複數個條狀之第二電極1086,其中第一電極1085與第二電極1086互相交叉設置,在一垂直投影方向上,第一電極1085與第二電極1086大體上相互垂直交叉,但不以此為限。觸控面板100係利用第一電極1085與第二電極1086之間的電容感測變化以提供觸控感測功能。第一電極1085與第二電極1086的重疊面積或線寬可視感應電容值的考量分別加以調整。在其他實施例中,第一電極1085與第二電極1086也可以具有其他形狀,而不限於第15圖中的條狀電極。當觸控面板100設置於一顯示元件上,且圖案化電極層142較圖案化電極層144更接近該顯示元件時,第一電極1085之面積或線寬較佳大於第二電極1086之面積或線寬,但不以此為限。舉例而言,圖案化電極層142、144可分別為透明導電層或為金屬網格層。此外,第一電極1085與第二電極1086分別電連接於一周邊走線114,且本實施例觸控面板100另包括前述實施例所提及之矽基強化層,其中矽基強化層與周邊走線、裝飾層之相對位置與配置關係可參考前述實施例,不再贅述。 Please refer to FIG. 15 , which is a top plan view of a thirteenth embodiment of the touch panel of the present invention. The touch element 108 of the touch panel 100 of the present embodiment includes double-layer patterned electrode layers 142 and 144 with an insulating layer (not shown) disposed therebetween to form a plurality of capacitive sensing structures. The patterned electrode layer 142 includes a plurality of strip-shaped first electrodes 1085, and the patterned electrode layer 144 includes a plurality of strip-shaped second electrodes 1086, wherein the first electrodes 1085 and the second electrodes 1086 are disposed to cross each other, in a vertical In the projection direction, the first electrode 1085 and the second electrode 1086 are substantially perpendicular to each other, but are not limited thereto. The touch panel 100 utilizes a capacitive sensing change between the first electrode 1085 and the second electrode 1086 to provide a touch sensing function. The overlapping area or the line width of the first electrode 1085 and the second electrode 1086 can be adjusted separately in consideration of the value of the sensing capacitance. In other embodiments, the first electrode 1085 and the second electrode 1086 may have other shapes, and are not limited to the strip electrodes in FIG. When the touch panel 100 is disposed on a display element, and the patterned electrode layer 142 is closer to the display element than the patterned electrode layer 144, the area or line width of the first electrode 1085 is preferably larger than the area of the second electrode 1086 or Line width, but not limited to this. For example, the patterned electrode layers 142, 144 may be transparent conductive layers or metal mesh layers, respectively. In addition, the first electrode 1085 and the second electrode 1086 are electrically connected to a peripheral trace 114, respectively, and the touch panel 100 of the embodiment further includes the ruthenium-based strengthening layer mentioned in the foregoing embodiment, wherein the ruthenium-based strengthening layer and the periphery For the relative position and configuration relationship of the routing and the decorative layer, refer to the foregoing embodiment, and details are not described herein.

請參考第16圖,第16圖為本發明觸控面板之第十四實施例的部分剖面示意圖。與第2圖相較,本實施例的主要不同處在於先在基板102的表面102a製作矽基強化層110,才製作裝飾層112,然後再在矽基強化層110和裝飾層112上製作其他如觸控元件108、周邊走線114等元件。亦即,在本實施例觸控面板100的遮光區106,矽基強化層110係位於裝飾層112與基板102之間。 Please refer to FIG. 16. FIG. 16 is a partial cross-sectional view showing the fourteenth embodiment of the touch panel of the present invention. Compared with FIG. 2, the main difference of this embodiment is that the ruthenium-based strengthening layer 110 is first formed on the surface 102a of the substrate 102 to form the decorative layer 112, and then the ruthenium-based strengthening layer 110 and the decorative layer 112 are fabricated. Such as the touch element 108, the peripheral trace 114 and other components. That is, in the light shielding region 106 of the touch panel 100 of the present embodiment, the ruthenium-based strengthening layer 110 is located between the decorative layer 112 and the substrate 102.

請參考第17圖與第18圖,第17圖為本發明觸控面板之第十五實施例的俯視示意圖,第18圖為第17圖所示觸控面板沿著切線C-C’的局部剖面示意圖。與第1圖和第2圖所示之第一實施例相較,本實施例導電層122(形成第一連接部108X2)係設於導電層120(形成第一電極部108X1、第二電極部108Y1及第二連接部108Y2)之下側,由於第一連接部108X2的寬度一般是小於200微米,所以圖案化的導電層122所佔面積明顯小於第一電極部108X1與第二電極部108Y1,且小於基板102的面積之50%,更可以小於基板102的面積之10%,甚至更可以小於基板102的面積之1%,因此本實施例設計第一連接部108X2或導電層122可直接形成於基板102的表面102a上,然後再形成矽基強化層110,由圖中可知,矽基強化層110直接接觸基板102的面積明顯大於基板102之面積的50%,仍可有效降低撞擊震波傳導到基板102與導電層122之介面時發生的震波反射,提高觸控面板100的整體耐撞強度。甚至,矽基強化層110直接接觸基板102的面積大於基板102之面積的90%以上可以觸控面板提供更佳的抗撞擊能力,例如強化玻璃基板在落球測試實驗時的抗破裂能力。此外,本實施例的變化形可參考前述實施例有關單層或雙層保護層及具有圖案化圖案的保護層等設計、遮光區的矽基強化層、周邊走線、裝飾層及第一、第二電極部的相對位置設計以及上述各膜層元件的材料選擇,不再贅述。另外一種實施方式是,第17圖與第18圖中的絕緣層118可以與矽基強化層110是同一道製程所形成,此時,等同於是在矽基強化層110挖出孔洞(via)後再設置第一電極部108X1、第二電極部108Y1及第二連接部108Y2,使第一電極部108X1藉由via與第一連接部108X2電性連接。 Please refer to FIG. 17 and FIG. 18 , FIG. 17 is a top view of the fifteenth embodiment of the touch panel of the present invention, and FIG. 18 is a partial view of the touch panel along the line C-C′ of FIG. 17 . Schematic diagram of the section. Compared with the first embodiment shown in FIG. 1 and FIG. 2, the conductive layer 122 (forming the first connecting portion 108X2) of the present embodiment is disposed on the conductive layer 120 (forming the first electrode portion 108X1 and the second electrode portion). The lower side of the 108Y1 and the second connecting portion 108Y2), since the width of the first connecting portion 108X2 is generally less than 200 micrometers, the patterned conductive layer 122 occupies a smaller area than the first electrode portion 108X1 and the second electrode portion 108Y1, And less than 50% of the area of the substrate 102, and more than 10% of the area of the substrate 102, and even less than 1% of the area of the substrate 102. Therefore, the first connection portion 108X2 or the conductive layer 122 can be directly formed in this embodiment. On the surface 102a of the substrate 102, a ruthenium-based enhancement layer 110 is then formed. As can be seen from the figure, the area of the ruthenium-based enhancement layer 110 directly contacting the substrate 102 is significantly larger than 50% of the area of the substrate 102, which can effectively reduce the impact wave transmission. The shock reflection occurring when the interface between the substrate 102 and the conductive layer 122 is increased improves the overall impact strength of the touch panel 100. Even if the area of the ruthenium-based strengthening layer 110 directly contacting the substrate 102 is greater than 90% of the area of the substrate 102, the touch panel can provide better impact resistance, such as strengthening the glass substrate against cracking during the ball drop test. In addition, in the variation of the embodiment, reference may be made to the design of the single-layer or double-layer protective layer and the protective layer having the patterned pattern, the ruthenium-based strengthening layer of the light-shielding region, the peripheral trace, the decorative layer, and the first embodiment. The relative position design of the second electrode portion and the material selection of each of the above-mentioned film layer elements will not be described again. In another embodiment, the insulating layer 118 in FIGS. 17 and 18 may be formed in the same process as the ruthenium-based strengthening layer 110. In this case, it is equivalent to burying the via in the ruthenium-based strengthening layer 110. The first electrode portion 108X1, the second electrode portion 108Y1, and the second connecting portion 108Y2 are further provided, and the first electrode portion 108X1 is electrically connected to the first connecting portion 108X2 via via.

請參考第19圖與第20圖,第19圖為本發明觸控面板之第十六實施例的俯視示意圖,第20圖為本發明觸控面板之觸控元件的網格圖案的放大示意圖。當本發明觸控面板100的觸控元件108是由網格電極所組成,例如由金屬網格層所構成時,因為網格電極所佔整個透光區104的面積大致會介於1%至15%,所以本發明觸控面板100的基板102表面也可以先設置由網格電極形 成的觸控元件108,再設置矽基強化層110。如第19圖所示,本實施例的觸控元件108包括複數個第一軸向電極108X與複數個第二軸向電極108Y,分別沿著不同方向延伸設置,且兩者皆為網格電極,例如分別由不同的金屬網格層所構成,在此二金屬網格層之間設有絕緣層,以使第一軸向電極108X與複數個第二軸向電極108Y互相絕緣。舉例而言,構成本實施例觸控元件108之網格電極的網格圖案可以如第20圖的圖示(一)所示,具有連續堆疊的六邊形圖案,而相鄰的第一軸向電極108X或相鄰的第二軸向電極108Y之間,其絕緣部分的網格圖案可如第20圖的圖示(二)所示,在六邊形網格具有斷線圖案,以達到絕緣效果。需注意的是,本發明之網格圖案並不限於六邊形圖案,也可以是其他不同的多邊形、圓形、橢圓形或不規則圖案等設計。再者,雖然第19圖以直條狀的第一與第二軸向電極108X與108Y作為示意說明,但本發明觸控面板100的觸控元件108也可以具有其他形狀,例如具有菱形或前述其他實施例的圖案,不以此為限。 Referring to FIG. 19 and FIG. 20, FIG. 19 is a top plan view of a sixteenth embodiment of the touch panel of the present invention, and FIG. 20 is an enlarged schematic view showing a grid pattern of the touch element of the touch panel of the present invention. When the touch element 108 of the touch panel 100 of the present invention is composed of a grid electrode, for example, a metal mesh layer, the area of the entire light-transmissive area 104 of the grid electrode is approximately 1% to 15%, so the surface of the substrate 102 of the touch panel 100 of the present invention may also be first set by the grid electrode shape. The touch element 108 is formed, and the germanium-based strengthening layer 110 is further disposed. As shown in FIG. 19, the touch element 108 of the present embodiment includes a plurality of first axial electrodes 108X and a plurality of second axial electrodes 108Y extending in different directions, and both are grid electrodes. For example, they are respectively composed of different metal mesh layers, and an insulating layer is disposed between the two metal mesh layers to insulate the first axial electrode 108X from the plurality of second axial electrodes 108Y from each other. For example, the mesh pattern of the grid electrode constituting the touch element 108 of the present embodiment may have a hexagonal pattern of continuous stacking as shown in the diagram (1) of FIG. 20, and the adjacent first axis Between the electrode 108X or the adjacent second axial electrode 108Y, the mesh pattern of the insulating portion thereof may be as shown in the diagram (2) of FIG. 20, and the hexagonal grid has a broken pattern to achieve Insulation effect. It should be noted that the mesh pattern of the present invention is not limited to a hexagonal pattern, and may be other different designs such as a polygon, a circle, an ellipse or an irregular pattern. Furthermore, although the first and second axial electrodes 108X and 108Y in the form of a straight strip are schematically illustrated in FIG. 19, the touch element 108 of the touch panel 100 of the present invention may have other shapes, for example, having a diamond shape or the foregoing. The patterns of other embodiments are not limited thereto.

以下繼續介紹有關網格電極應用在本發明之結構設計的其他實施例。請參考第21圖,第21圖為本發明觸控面板之第十七實施例的部分剖面示意圖。本實施例之觸控面板100包含複數個第一網格電極與第二網格電極,例如第20圖所示之第一軸向電極108X與第二軸向電極108Y,但不以此為限。第一軸向電極108X由第一網格層138所構成,包含複數個第一網格線1381,其直接設置在基板102的表面102a上,其上設置了具絕緣特性之矽基強化層110,而第二軸向電極108Y由第二網格層140所構成,包含複數個第一網格線1401,設置在矽基強化層110上,藉由矽基強化層110可使第二網格層140與第一網格層138互相絕緣。本實施例的第一網格層138另形成至少一周邊走線114與一接合墊(bonding pin)136,位於遮光區106並設置在裝飾層112上,其中接合墊136所設置之區域定義為接合區132,第二網格層140亦包括至少一周邊走線114位於遮光區106並設置在矽基強化層110上,其中由第二網格層140所形成的周邊走線114可經由矽基強化層110中的接觸洞1101而電連接於對應的接合 墊136,以使第一軸向電極108X與第二軸向電極108Y可分別經由對應的周邊走線114而電連接於一個接合墊136並連接於外部控制元件。如第21圖所示,雖然本實施例的第一軸向電極108X直接設置在基板102表面,但因為第一軸向電極108X是由第一網格層138所構成,而一般網格電極的寬度是介於0.5微米到10微米之間,所以其第一網格線1381與基板102的表面102a的接觸面積會小於基板102的面積之50%,更可以小於基板102的面積之15%,甚至更可以小於基板102的面積之5%,而矽基強化層110與基板102的直接接觸面積會大於基板102之面積的50%,因此仍可有效降低撞擊震波在基板102與導電膜層(例如第一網格層138)介面發生的震波反射,增強基板102的撞擊承受力。需注意的是,本實施例以網格層製作觸控元件108的設計可應用於前述實施例之觸控元件108的各式設計,且周邊走線114可以與觸控元件108的至少一部分經由相同製程一起製作。 Further embodiments relating to the grid electrode application in the structural design of the present invention are continued below. Please refer to FIG. 21. FIG. 21 is a partial cross-sectional view showing the seventeenth embodiment of the touch panel of the present invention. The touch panel 100 of the present embodiment includes a plurality of first grid electrodes and second grid electrodes, such as the first axial electrode 108X and the second axial electrode 108Y shown in FIG. 20, but not limited thereto. . The first axial electrode 108X is composed of a first mesh layer 138, and includes a plurality of first grid lines 1381 disposed directly on the surface 102a of the substrate 102, on which the ruthenium-based strengthening layer 110 having insulating properties is disposed. The second axial electrode 108Y is composed of the second mesh layer 140, and includes a plurality of first mesh lines 1401 disposed on the ruthenium-based enhancement layer 110, and the second mesh can be formed by the ruthenium-based enhancement layer 110. Layer 140 is insulated from first mesh layer 138. The first mesh layer 138 of the present embodiment further forms at least one peripheral trace 114 and a bonding pin 136 located in the light shielding region 106 and disposed on the decorative layer 112, wherein the region where the bonding pad 136 is disposed is defined as The splicing region 132, the second mesh layer 140 also includes at least one peripheral trace 114 located in the opaque region 106 and disposed on the ruthenium-based enhancement layer 110, wherein the peripheral traces 114 formed by the second grid layer 140 are via 矽Contact holes 1101 in the base reinforcement layer 110 are electrically connected to corresponding joints Pad 136 is configured to electrically connect first axial electrode 108X and second axial electrode 108Y to a bond pad 136 via respective peripheral traces 114 and to an external control element. As shown in FIG. 21, although the first axial electrode 108X of the present embodiment is directly disposed on the surface of the substrate 102, since the first axial electrode 108X is composed of the first mesh layer 138, the general grid electrode is The width is between 0.5 micrometers and 10 micrometers, so the contact area of the first grid line 1381 with the surface 102a of the substrate 102 is less than 50% of the area of the substrate 102, and may be less than 15% of the area of the substrate 102. Even more than 5% of the area of the substrate 102, and the direct contact area of the ruthenium-based strengthening layer 110 with the substrate 102 is greater than 50% of the area of the substrate 102, so that the impact wave is still effectively reduced on the substrate 102 and the conductive film layer ( For example, the seismic reflection of the interface formed by the first mesh layer 138) enhances the impact bearing force of the substrate 102. It should be noted that the design of the touch element 108 in the mesh layer can be applied to various designs of the touch element 108 of the foregoing embodiment, and the peripheral traces 114 can be connected to at least a portion of the touch elements 108. Made with the same process.

請參考第22圖,第22圖為本發明觸控面板之第十八實施例的部分剖面示意圖。本實施例與前一實施例的不同處在於矽基強化層110並未覆蓋大部分之接合墊136,而由第二網格層140所形成的周邊走線114覆蓋部分矽基強化層110並與相對應的接合墊136直接接觸並電連接,所以矽基強化層110內不須設置接觸洞1101。本實施例之接合墊136仍由第一網格層138形成並設置在裝飾層112上。 Please refer to FIG. 22, which is a partial cross-sectional view showing the eighteenth embodiment of the touch panel of the present invention. The difference between this embodiment and the previous embodiment is that the ruthenium-based enhancement layer 110 does not cover most of the bond pads 136, and the peripheral traces 114 formed by the second mesh layer 140 cover a portion of the ruthenium-based enhancement layer 110 and The contact pads 136 are in direct contact with and electrically connected, so that the contact holes 1101 are not required to be disposed in the ruthenium-based reinforcement layer 110. The bond pads 136 of the present embodiment are still formed by the first mesh layer 138 and disposed on the decorative layer 112.

請參考第23圖,第23圖為本發明觸控面板之第十九實施例的部分剖面示意圖。本實施例與第十七、十八實施例的不同處主要在於接合墊136是由第二網格層140所形成,因此當周邊走線114是由第一網格層138所形成時,其可藉由矽基強化層110中的接觸洞1101而與上層的第二網格層140相接並進而電連接於接合墊136。根據本實施例,也可視為部分之周邊走線114同時包含下部走線1141與上部走線1142,分別由第一網格層138與第二網格層140所構成,其中下部走線1141延伸連接於由第一網格層138構成的第一軸向電極108X,而上部走線1142延伸連接於對應的接合墊136。另一 方面,第二軸向電極108Y則直接連接於由第二網格層140所形成之各對應周邊走線114,並經由該周邊走線114而電連接於對應的接合墊136。 Please refer to FIG. 23. FIG. 23 is a partial cross-sectional view showing the nineteenth embodiment of the touch panel of the present invention. The difference between this embodiment and the seventeenth and eighteenth embodiments is mainly that the bonding pad 136 is formed by the second mesh layer 140, so when the peripheral trace 114 is formed by the first mesh layer 138, The second mesh layer 140 of the upper layer may be connected to and electrically connected to the bonding pad 136 by the contact hole 1101 in the germanium-based strengthening layer 110. According to this embodiment, the partial peripheral traces 114 may also include a lower trace 1141 and an upper trace 1142, respectively formed by the first mesh layer 138 and the second mesh layer 140, wherein the lower trace 1141 extends. The first axial electrode 108X is formed by the first mesh layer 138, and the upper trace 1142 is extended to the corresponding bonding pad 136. another In one aspect, the second axial electrode 108Y is directly connected to each of the corresponding peripheral traces 114 formed by the second mesh layer 140, and is electrically connected to the corresponding bonding pad 136 via the peripheral trace 114.

請參考第24圖,第24圖為本發明觸控面板之第二十實施例的部分剖面示意圖。本實施例與前一實施例的差異在於矽基強化層110並未覆蓋部分周邊走線114,因此由第一網格層138所形成的至少部分周邊走線114直接與設置於其上側且由第二網格層140所形成的接合墊136相接,不須像前一實施例必須經由矽基強化層110的接觸洞1101來電連接兩者。或者,也可以視為部分周邊走線114同時包括下部走線1141與上部走線1142,兩者係上下堆疊以互相電連接。 Please refer to FIG. 24, which is a partial cross-sectional view showing a twentieth embodiment of the touch panel of the present invention. The difference between this embodiment and the previous embodiment is that the ruthenium-based enhancement layer 110 does not cover a portion of the peripheral traces 114, so that at least a portion of the peripheral traces 114 formed by the first grid layer 138 are directly disposed on the upper side thereof and are The bond pads 136 formed by the second mesh layer 140 are connected without the need to electrically connect the two via the contact holes 1101 of the ruthenium-based enhancement layer 110 as in the previous embodiment. Alternatively, it can be considered that the partial peripheral traces 114 include both the lower trace 1141 and the upper trace 1142, which are stacked on top of each other to be electrically connected to each other.

請參考第25圖,第25圖為本發明觸控面板之第二十一實施例的部分剖面示意圖。在本實施例中,接合墊136由第二網格層140所形成並位於矽基強化層110上,且矽基強化層110完整覆蓋裝飾層112與遮光區的第一網格層138,接合墊136係經由矽基強化層110的接觸洞1101而電連接於由第一網格層138所形成之對應周邊走線114。另一方面,也可以視為各周邊走線114同時包括下部走線1141與上部走線1142,下部走線1141經由接觸洞1101而與其上部走線1142相接並電連接於接合墊136。 Please refer to FIG. 25, which is a partial cross-sectional view showing the twenty-first embodiment of the touch panel of the present invention. In the present embodiment, the bonding pad 136 is formed by the second mesh layer 140 and located on the ruthenium-based strengthening layer 110, and the ruthenium-based strengthening layer 110 completely covers the decorative layer 112 and the first mesh layer 138 of the light-shielding region, and is bonded. Pad 136 is electrically coupled to corresponding peripheral traces 114 formed by first mesh layer 138 via contact holes 1101 of ruthenium-based enhancement layer 110. On the other hand, it can be considered that each of the peripheral traces 114 includes both the lower trace 1141 and the upper trace 1142. The lower trace 1141 is connected to the upper trace 1142 via the contact hole 1101 and electrically connected to the bonding pad 136.

相較於習知技術,由於本發明觸控面板的剛性基板表面設有揚氏模數不大於60Gpa的矽基強化層,且矽基強化層與基板表面直接接觸的面積大於基板面積的50%,或是藉由矽基強化層的設置而使導電材料與基板表面直接接觸的面積小於基板面積的50%,其可以有效改善觸控面板被撞擊時震波在基板與導電材料介面發生反射而導致基板破裂之問題,有效提高觸控面板的撞擊承受力。此外,由於聚矽氧烷含有Si-O-Si鍵,且係作為主鏈結構,因此其光學特性、釋氣(outgassing)以及熱穩定性的表現也較佳,從而可以使得觸控面板的電性及光學等特性能夠維持在一定品質。也就是說,在觸控面板的製程過程中,聚矽氧烷比較不會有顏色改變(例如黃變或白霧現象),且釋氣(outgassing)量較少所以不易導致觸控元件的片電阻上升很多。 Compared with the prior art, the surface of the rigid substrate of the touch panel of the present invention is provided with a ruthenium-based strengthening layer having a Young's modulus of not more than 60 GPa, and the area of the ruthenium-based strengthening layer directly contacting the substrate surface is greater than 50% of the substrate area. Or the area of the conductive material directly contacting the surface of the substrate is less than 50% of the area of the substrate by the arrangement of the ruthenium-based strengthening layer, which can effectively improve the reflection of the shock wave on the substrate and the conductive material interface when the touch panel is impacted. The problem of substrate rupture effectively improves the impact tolerance of the touch panel. In addition, since the polyoxyalkylene contains a Si-O-Si bond and functions as a main chain structure, its optical characteristics, outgassing, and thermal stability are also better, so that the touch panel can be made electrically. Properties such as sex and optics can be maintained at a certain quality. That is to say, during the process of the touch panel, the polysiloxane does not have a color change (for example, yellowing or white fog), and the amount of outgassing is small, so that the touch element is not easily caused. The resistance rises a lot.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100‧‧‧觸控面板 100‧‧‧ touch panel

102‧‧‧基板 102‧‧‧Substrate

102a‧‧‧表面 102a‧‧‧ surface

104‧‧‧透光區 104‧‧‧Light transmission area

106‧‧‧遮光區 106‧‧‧ shading area

108‧‧‧觸控元件 108‧‧‧Touch components

108X‧‧‧第一軸向電極 108X‧‧‧first axial electrode

108X1‧‧‧第一電極部 108X1‧‧‧First electrode section

108X2‧‧‧第一連接部 108X2‧‧‧First connection

108Y‧‧‧第二軸向電極 108Y‧‧‧second axial electrode

108Y2‧‧‧第二連接部 108Y2‧‧‧Second connection

110‧‧‧矽基強化層 110‧‧‧矽基层层

112‧‧‧裝飾層 112‧‧‧Decorative layer

114‧‧‧周邊走線 114‧‧‧ perimeter wiring

116‧‧‧保護層 116‧‧‧Protective layer

118‧‧‧絕緣層 118‧‧‧Insulation

120、122‧‧‧導電層 120, 122‧‧‧ conductive layer

T‧‧‧總厚度 T‧‧‧ total thickness

Claims (15)

一種觸控面板,其包括:一硬質之基板;一觸控元件,其具有多個電極設置於該基板之一表面上;以及一矽基強化層(silicon-based strengthening layer),設置於該基板之該表面上且至少位於部分該等電極與該基板之間,以使該等電極與該基板的接觸面積小於該基板面積的50%,且該矽基強化層的揚氏模數(Young’s Modulus)不大於60Gpa。 A touch panel includes: a rigid substrate; a touch element having a plurality of electrodes disposed on a surface of the substrate; and a silicon-based strengthening layer disposed on the substrate The surface is at least partially between the electrodes and the substrate such that the contact area of the electrodes with the substrate is less than 50% of the area of the substrate, and the Young's Modulus of the bismuth-based strengthening layer (Young's Modulus) ) no more than 60Gpa. 如請求項1所述之觸控面板,其中該矽基強化層包括聚矽氧烷。 The touch panel of claim 1, wherein the ruthenium-based strengthening layer comprises polyoxyalkylene. 如請求項2所述之觸控面板,其中該矽基強化層包括熱固型聚矽氧烷。 The touch panel of claim 2, wherein the ruthenium-based strengthening layer comprises a thermosetting polyoxyalkylene. 如請求項2所述之觸控面板,其中該聚矽氧烷係以溶凝膠法合成。 The touch panel of claim 2, wherein the polyoxyalkylene is synthesized by a sol gel method. 如請求項2所述之觸控面板,其中該聚矽氧烷中的反應性官能基佔3~50重量百分比。 The touch panel of claim 2, wherein the reactive functional group in the polyoxyalkylene is from 3 to 50% by weight. 如請求項2所述之觸控面板,其中該矽基強化層的揚氏模數小於6Gpa。 The touch panel of claim 2, wherein the 矽-based strengthening layer has a Young's modulus of less than 6 GPa. 如請求項1所述之觸控面板,其中該矽基強化層的厚度介於0.4微米至50微米。 The touch panel of claim 1, wherein the ruthenium-based strengthening layer has a thickness of from 0.4 micrometers to 50 micrometers. 如請求項1所述之觸控面板,其具有一透光區與一遮光區,該遮光區位於該透光區之至少一側,且該觸控面板另包括一裝飾層設於該遮光區內。 The touch panel of claim 1 , which has a light-transmissive area and a light-shielding area, the light-shielding area is located on at least one side of the light-transmissive area, and the touch panel further includes a decorative layer disposed in the light-shielding area Inside. 如請求項8所述之觸控面板,包括至少一周邊走線設置在該遮光區,且與該觸控元件電性連接。 The touch panel of claim 8 includes at least one peripheral trace disposed in the light-shielding region and electrically connected to the touch component. 如請求項8所述之觸控面板,其中該矽基強化層設置於該透光區且延伸設置到該遮光區並位於該裝飾層與該基板之間。 The touch panel of claim 8, wherein the ruthenium-based reinforcement layer is disposed in the light-transmissive region and extends to the light-shielding region and between the decorative layer and the substrate. 如請求項8所述之觸控面板,其中該矽基強化層設置於該透光區且延伸設置到該遮光區並設於該裝飾層表面,使得該裝飾層位於部分該矽基強化層與該基板之間。 The touch panel of claim 8, wherein the ruthenium-based reinforcement layer is disposed on the light-transmissive region and extends to the light-shielding region and is disposed on the surface of the decorative layer such that the decorative layer is located in a portion of the ruthenium-based reinforcement layer Between the substrates. 如請求項10或11所述之觸控面板,包括一保護層設置於該矽基強化層與該裝飾層之間。 The touch panel of claim 10 or 11, comprising a protective layer disposed between the ruthenium-based strengthening layer and the decorative layer. 如請求項10或11所述之觸控面板,包括一無機介質層設置於該矽基強化層與該基板之間。 The touch panel of claim 10 or 11, comprising an inorganic dielectric layer disposed between the ruthenium-based strengthening layer and the substrate. 如請求項1所述之觸控面板,其中部分該等電極之係直接設置於該基板表面,且該矽基強化層直接設置於該基板表面的面積至少佔該基板的面積之90%以上。 The touch panel of claim 1, wherein a part of the electrodes is directly disposed on the surface of the substrate, and the area of the ruthenium-based strengthening layer directly disposed on the surface of the substrate accounts for at least 90% of the area of the substrate. 如請求項1所述之觸控面板,其中該硬質之基板為一強化玻璃,且該等電極是由透明導電材料或是金屬所構成。 The touch panel of claim 1, wherein the hard substrate is a tempered glass, and the electrodes are made of a transparent conductive material or a metal.
TW103130480A 2014-09-03 2014-09-03 Touch panel TW201610769A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763133B (en) * 2020-11-20 2022-05-01 中國商宸美(廈門)光電有限公司 Touch panel and method for forming the same
US11675448B2 (en) 2020-12-11 2023-06-13 Tpk Advanced Solutions Inc. Touch panel and method for forming the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763133B (en) * 2020-11-20 2022-05-01 中國商宸美(廈門)光電有限公司 Touch panel and method for forming the same
US11675448B2 (en) 2020-12-11 2023-06-13 Tpk Advanced Solutions Inc. Touch panel and method for forming the same

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