TW201606599A - Film touch sensor and method of preparing the same - Google Patents
Film touch sensor and method of preparing the same Download PDFInfo
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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Abstract
Description
本發明係關於一種薄膜式觸控感測器。特定言之,本發明係關於:一種薄膜式觸控感測器,其藉由使一分離層形成於一載體基板上且接著實施該觸控感測器之形成程序而製備;及該薄膜式觸控感測器之製備方法。 The invention relates to a thin film touch sensor. In particular, the present invention relates to a thin film touch sensor prepared by forming a separation layer on a carrier substrate and then performing a forming process of the touch sensor; and the film type A method of preparing a touch sensor.
各種電子裝置採用被視為下一代輸入技術之一觸控輸入模式。就此而言,已主動地進行諸多研究及發展以提供能夠應用於各種環境中且藉由觸控而準確地辨識輸入資訊之一觸控感測器。 Various electronic devices adopt a touch input mode that is regarded as a next-generation input technology. In this regard, many research and developments have been actively pursued to provide a touch sensor that can be applied to various environments and accurately recognize input information by touch.
例如,由於具有一觸控顯示器之電子裝置已聚焦於具有改良可攜性之一超輕型且低功率之薄膜式可撓顯示器作為下一代顯示器,所以需要可應用於該顯示器中之觸控感測器。 For example, since an electronic device having a touch display has been focused on an ultra-light and low-power thin film flexible display having improved portability as a next-generation display, touch sensing that can be applied to the display is required. Device.
在可在不損害其性質之情況下彎曲、摺疊或捲收之一可撓基板上製備該可撓顯示器,且該可撓顯示器可呈一可撓LCD、一可撓OLED、電子紙等等之形式。 The flexible display can be prepared on a flexible substrate that can be bent, folded or rolled without damaging its properties, and the flexible display can be a flexible LCD, a flexible OLED, an electronic paper, or the like. form.
為將該觸控輸入模式應用於此一可撓顯示器,需要具有良好彎曲性、恢復性、可撓性及可伸展性之一觸控感測器。 In order to apply the touch input mode to such a flexible display, a touch sensor having good bendability, recovery, flexibility, and extensibility is required.
可使用一薄膜式觸控感測器(例如包括嵌入一透明樹脂基板中之佈線之一佈線板)來製備該可撓顯示器。 The flexible display can be prepared using a thin film touch sensor such as a wiring board including a wiring embedded in a transparent resin substrate.
可藉由包括以下步驟之一程序而製備該佈線板:使金屬佈線形成於一基板上;施加及烘乾用於覆蓋該金屬佈線且形成一透明樹脂基板之一透明樹脂溶液;及自該基板剝離該透明樹脂基板。 The wiring board can be prepared by a program comprising the steps of: forming a metal wiring on a substrate; applying and drying a transparent resin solution for covering the metal wiring and forming a transparent resin substrate; and from the substrate The transparent resin substrate is peeled off.
使有機釋放材料(諸如矽樹脂及氟樹脂)及無機釋放材料(諸如類鑽碳(DLC)之一薄膜及氧化鋯之一薄膜)預先形成於該基板之表面上以使剝離有效。 An organic release material such as an anthraquinone resin and a fluororesin and an inorganic release material such as a film of a diamond-like carbon (DLC) and a film of zirconia are preliminarily formed on the surface of the substrate to make peeling effective.
然而,該等無機釋放材料無法自該基板之表面(其上可殘留該金屬佈線及該樹脂基板之一部分)有效地剝離該金屬佈線及該樹脂基板,同時該有機釋放材料可自該金屬佈線及該樹脂基板之表面露出。 However, the inorganic release materials are not capable of effectively stripping the metal wiring and the resin substrate from the surface of the substrate (on which the metal wiring and a portion of the resin substrate may remain), and the organic release material may be from the metal wiring and The surface of the resin substrate is exposed.
即,不管是否使用該等釋放材料,均難以誘發自該基板完全剝離該金屬佈線。 That is, it is difficult to induce complete peeling of the metal wiring from the substrate regardless of whether or not the release material is used.
韓國專利第10-1191865號揭示一種用於製備一可撓基板之方法,該可撓基板具有嵌入其內之金屬佈線,該方法包括:使一犧牲層、金屬佈線及一聚合物材料形成於一基板上;及藉由一溶劑或光而移除該犧牲層以自該基板剝離該金屬佈線及該聚合物材料。 Korean Patent No. 10-1191865 discloses a method for preparing a flexible substrate having a metal wiring embedded therein, the method comprising: forming a sacrificial layer, a metal wiring, and a polymer material in one And removing the sacrificial layer by a solvent or light to strip the metal wiring and the polymer material from the substrate.
然而,難以在一大尺寸產品中實施根據上述方法之該犧牲層之移除,且難以在無法在一高溫條件中實施之上述方法中使用各種基底薄膜。 However, it is difficult to carry out the removal of the sacrificial layer according to the above method in a large-sized product, and it is difficult to use various base films in the above method which cannot be carried out in a high temperature condition.
本發明之一目的係提供:一種薄膜式觸控感測器,其中一分離層在該觸控感測器之形成程序之前形成於一載體基板上且與該載體基板分離,使得該分離層可用作為一層覆蓋佈線;及一種製備該薄膜式觸控感測器之方法。 An object of the present invention is to provide a thin film touch sensor in which a separation layer is formed on a carrier substrate and separated from the carrier substrate before the forming process of the touch sensor, so that the separation layer is available. As a layer of covered wiring; and a method of preparing the thin film touch sensor.
本發明之另一目的係提供:一種薄膜式觸控感測器,其包括一絕緣層,該絕緣層形成於一透明導電層之圖案上,使得該絕緣層可用 作為一平坦化層;及一種製備該薄膜式觸控感測器之方法。 Another object of the present invention is to provide a thin film touch sensor including an insulating layer formed on a pattern of a transparent conductive layer so that the insulating layer can be used. As a planarization layer; and a method of preparing the thin film touch sensor.
本發明之又一目的係提供:一種薄膜式觸控感測器,其實施於一載體基板上以提供高清晰度及耐熱性(相較於已直接形成於一基底薄膜上之一習知觸控感測器),且可應用各種基底薄膜;及一種製備該薄膜式觸控感測器之方法。 Still another object of the present invention is to provide a thin film touch sensor that is implemented on a carrier substrate to provide high definition and heat resistance (compared to a conventional touch that has been formed directly on a base film) A sensor is used, and various substrate films can be applied; and a method of preparing the film type touch sensor.
本發明之又一目的係提供:一種薄膜式觸控感測器,其中一分離層形成於一載體基板上,其他組件層形成於該分離層上,且一基底薄膜黏著於該等其他組件層上,該薄膜式觸控感測器在與該載體基板分離之後與一電路板附接;及一種製備該薄膜式觸控感測器之方法。 Another object of the present invention is to provide a thin film touch sensor in which a separation layer is formed on a carrier substrate, other component layers are formed on the separation layer, and a substrate film is adhered to the other component layers. The film type touch sensor is attached to a circuit board after being separated from the carrier substrate; and a method of preparing the film type touch sensor.
本發明之又一目的係提供:一種薄膜式觸控感測器,其無需在使一分離層與載體基板分離之後移除該分離層;及一種製備該薄膜式觸控感測器之方法。 Another object of the present invention is to provide a thin film touch sensor that does not need to remove the separation layer after separating a separation layer from the carrier substrate; and a method of preparing the thin film touch sensor.
本發明之又一目的係提供:一種薄膜式觸控感測器,其進一步包括分離層與絕緣層之間之一彈性控制保護層以因該分離層與該絕緣層之間之消除應力能力之一差異而抑制裂痕產生;及一種製備該薄膜式觸控感測器之方法。 Another object of the present invention is to provide a thin film touch sensor further comprising an elastic control protective layer between the separation layer and the insulating layer due to the stress relieving ability between the separation layer and the insulating layer. A difference inhibits crack generation; and a method of preparing the thin film touch sensor.
本發明之目的不受限於上述目的,且熟習技術者將自以下描述瞭解本發明之其他未提及目的。 The object of the present invention is not limited by the above objects, and those skilled in the art will understand the other unmentioned objects of the present invention from the following description.
根據本發明之一態樣,提供一種薄膜式觸控感測器,其包括:一分離層;一電極圖案層,其形成於該分離層上且包括一感測電極及形成於該感測電極之一端處之一襯墊電極;一絕緣層,其形成於該電極圖案層上;及一基底薄膜,其形成於該絕緣層上。 According to an aspect of the present invention, a thin film touch sensor includes: a separation layer; an electrode pattern layer formed on the separation layer and including a sensing electrode and formed on the sensing electrode a pad electrode at one end; an insulating layer formed on the electrode pattern layer; and a base film formed on the insulating layer.
另外,該薄膜式觸控感測器可進一步包括形成於該分離層與該電極圖案層之間之一保護層。 In addition, the thin film touch sensor may further include a protective layer formed between the separation layer and the electrode pattern layer.
該絕緣層可在25℃處具有其與該保護層之間之300MPa或更小之 一彈性模數差。 The insulating layer may have a 300 MPa or less between the protective layer and the protective layer at 25 ° C A difference in modulus of elasticity.
另外,該絕緣層可在25℃處具有其與該保護層之間之100MPa或更小之一彈性模數差。 Further, the insulating layer may have a difference in elastic modulus of 100 MPa or less between the protective layer and the protective layer at 25 °C.
此外,該薄膜式觸控感測器可進一步包括形成於該襯墊電極之底部上之一襯墊圖案層。 In addition, the thin film touch sensor may further include a pad pattern layer formed on a bottom of the pad electrode.
在本發明中,該襯墊圖案層可由選自由一金屬、一金屬奈米線、一金屬氧化物、碳奈米管、石墨烯、一導電聚合物及一導電油墨組成之群組之至少一者形成。 In the present invention, the liner pattern layer may be at least one selected from the group consisting of a metal, a metal nanowire, a metal oxide, a carbon nanotube, a graphene, a conductive polymer, and a conductive ink. Formed.
該襯墊圖案層可由兩個或兩個以上導電層組成。 The liner pattern layer may be composed of two or more conductive layers.
該絕緣層可經形成以覆蓋該電極圖案層,且可在與該電極圖案層接觸之表面之相對表面上使該絕緣層平坦化。 The insulating layer may be formed to cover the electrode pattern layer, and the insulating layer may be planarized on an opposite surface of a surface in contact with the electrode pattern layer.
該絕緣層可由選自由一有機絕緣薄膜及一無機絕緣薄膜組成之群組之至少一者形成。 The insulating layer may be formed of at least one selected from the group consisting of an organic insulating film and an inorganic insulating film.
該電極圖案層可為一透明導電層。 The electrode pattern layer can be a transparent conductive layer.
該透明導電層可由選自由一金屬、一金屬奈米線、一金屬氧化物、碳奈米管、石墨烯、一導電聚合物及一導電油墨組成之群組之至少一者形成。 The transparent conductive layer may be formed of at least one selected from the group consisting of a metal, a metal nanowire, a metal oxide, a carbon nanotube, graphene, a conductive polymer, and a conductive ink.
該電極圖案層可進一步包括一橋電極。 The electrode pattern layer may further include a bridge electrode.
該電極圖案層可由兩個或兩個以上導電層組成。 The electrode pattern layer may be composed of two or more conductive layers.
該分離層可形成於一載體基板上且接著與該載體基板分離。 The separation layer can be formed on a carrier substrate and then separated from the carrier substrate.
當該分離層與該載體基板分離時,其可具有1N/25mm或更小之一剝離強度。 When the separation layer is separated from the carrier substrate, it may have a peel strength of 1 N/25 mm or less.
另外,當該分離層與該載體基板分離時,其可具有0.1N/25mm或更小之一剝離強度。 In addition, when the separation layer is separated from the carrier substrate, it may have a peel strength of 0.1 N/25 mm or less.
在該分離層與該載體基板剝離之後,其可具有30mN/m至70mN/m之一表面能。 After the separation layer is peeled off from the carrier substrate, it may have a surface energy of from 30 mN/m to 70 mN/m.
該分離層可具有其與該載體基板之間之10mN/m或更大之一表面能差。 The separation layer may have a surface energy difference of 10 mN/m or more between the separation layer and the carrier substrate.
該載體基板可由一玻璃製成。 The carrier substrate can be made of a glass.
該分離層可由一有機聚合物製成。 The separation layer can be made of an organic polymer.
該有機聚合物可包括選自由聚醯亞胺、聚乙烯醇、聚醯胺酸、聚醯胺、聚乙烯、聚苯乙烯、聚降冰片烯、苯基馬來醯亞胺共聚物、聚偶氮苯、聚伸苯基苯二醯胺、聚酯、聚甲基丙烯酸甲酯、聚芳酯、肉桂酸酯聚合物、香豆素聚合物、苄甲內醯胺聚合物、查耳酮聚合物及芳族乙炔聚合物組成之群組之至少一者。 The organic polymer may comprise a polymer selected from the group consisting of polyimine, polyvinyl alcohol, polyglycolic acid, polyamine, polyethylene, polystyrene, polynorbornene, phenyl maleimide copolymer, poly couple Nitrobenzene, polyphenylene phthalamide, polyester, polymethyl methacrylate, polyarylate, cinnamate polymer, coumarin polymer, benzalkonium polymer, chalcone polymerization At least one of the group consisting of an aromatic acetylene polymer.
該分離層可具有10nm至1000nm之一厚度。 The separation layer may have a thickness of one of 10 nm to 1000 nm.
該分離層可具有50nm至500nm之一厚度。 The separation layer may have a thickness of one of 50 nm to 500 nm.
另外,該薄膜式觸控感測器可進一步包括與該襯墊電極電連接之一電路板。 Additionally, the thin film touch sensor can further include a circuit board electrically connected to the pad electrode.
該電路板可透過該分離層而與該襯墊電極連接。 The circuit board is connectable to the pad electrode through the separation layer.
該電路板可透過該襯墊圖案層而與該襯墊電極連接。 The circuit board is connectable to the pad electrode through the pad pattern layer.
該基底薄膜可為選自由一偏光片、一各向同性薄膜、一延遲薄膜及一保護薄膜組成之群組之任何者。 The base film may be any one selected from the group consisting of a polarizer, an isotropic film, a retardation film, and a protective film.
另外,該薄膜式觸控感測器可進一步包括形成於該絕緣層與該基底薄膜之間之一黏著層。 In addition, the thin film touch sensor may further include an adhesive layer formed between the insulating layer and the base film.
該黏著層可由一壓感黏著劑(PSA)或一黏著劑形成。 The adhesive layer may be formed of a pressure sensitive adhesive (PSA) or an adhesive.
根據本發明之另一態樣,提供一種用於製備上述薄膜式觸控感測器之方法,其包括以下步驟:使一分離層形成於一載體基板上;使包括一感測電極及一襯墊電極之一電極圖案層形成於該分離層上;使一絕緣層形成於該電極圖案層上;將一基底薄膜附接至該絕緣層;及藉由使該分離層與該載體基板分離而移除該載體基板。 According to another aspect of the present invention, a method for preparing the above-described thin film touch sensor includes the steps of: forming a separation layer on a carrier substrate; including a sensing electrode and a lining One electrode pattern layer of the pad electrode is formed on the separation layer; an insulating layer is formed on the electrode pattern layer; a base film is attached to the insulating layer; and by separating the separation layer from the carrier substrate The carrier substrate is removed.
在本發明中,可藉由將一黏著劑黏著於該基底薄膜與該絕緣層 之間而實施該基底薄膜之附接。 In the present invention, an adhesive can be adhered to the base film and the insulating layer. The attachment of the base film is performed between.
另外,可藉由將一壓感黏著劑(PSA)黏著於該基底薄膜與該絕緣層之間而實施該基底薄膜之附接。 Alternatively, the attachment of the base film can be carried out by adhering a pressure sensitive adhesive (PSA) between the base film and the insulating layer.
用於製備該薄膜式觸控感測器之該方法可進一步包括以下步驟:在形成該分離層之後,使一保護層形成於該分離層上;及移除該保護層之一部分(其對應於其中形成該襯墊電極之一區域),使得該分離層被曝露。藉此,可在此一保護層及該曝露分離層上實施該電極圖案層之形成。 The method for preparing the thin film touch sensor may further include the steps of: forming a protective layer on the separation layer after forming the separation layer; and removing a portion of the protective layer (which corresponds to Wherein a region of the pad electrode is formed such that the separation layer is exposed. Thereby, the formation of the electrode pattern layer can be performed on the protective layer and the exposed separation layer.
另外,用於製備該薄膜式觸控感測器之該方法可進一步包括在形成該分離層之後使一保護層形成於該分離層上之步驟,且該保護層之形成可經實施使得待形成該襯墊電極之該分離層之一區域被部分地曝露。藉此,可在此一保護層及該曝露分離層上實施該電極圖案層之形成。 In addition, the method for preparing the thin film touch sensor may further include the step of forming a protective layer on the separation layer after forming the separation layer, and the formation of the protective layer may be implemented such that it is to be formed A region of the separation layer of the pad electrode is partially exposed. Thereby, the formation of the electrode pattern layer can be performed on the protective layer and the exposed separation layer.
此外,用於製備該薄膜式觸控感測器之該方法可進一步包括以下步驟:在形成該襯墊電極之前,使一襯墊圖案層預先形成於待形成該襯墊電極之一區域中。 Furthermore, the method for preparing the thin film touch sensor may further include the step of pre-forming a pad pattern layer in a region of the pad electrode to be formed before forming the pad electrode.
可藉由通過升離或剝離使該分離層與該載體基板分離而實施該載體基板之移除。 The removal of the carrier substrate can be carried out by separating the separation layer from the carrier substrate by lift-off or lift-off.
可藉由使用1N/25mm或更小之一力來使該分離層與該載體基板分離而實施該載體基板之移除。 The removal of the carrier substrate can be carried out by using a force of 1 N/25 mm or less to separate the separation layer from the carrier substrate.
另外,用於製備該薄膜式觸控感測器之該方法可進一步包括以下步驟:在移除該載體基板之後,將一電路板附接至該襯墊電極。 Additionally, the method for fabricating the thin film touch sensor can further include the step of attaching a circuit board to the pad electrode after removing the carrier substrate.
此外,用於製備該薄膜式觸控感測器之該方法可進一步包括以下步驟:在移除該載體基板之後,將一電路板附接至該襯墊圖案層。 Moreover, the method for preparing the thin film touch sensor may further include the step of attaching a circuit board to the pad pattern layer after removing the carrier substrate.
根據本發明之薄膜式觸控感測器及其製備方法具有以下效應: The thin film type touch sensor and the preparation method thereof according to the present invention have the following effects:
第一,該分離層可被用作為一層覆蓋佈線,此係因為其係在該觸控感測器之形成程序之前形成於一載體基板上且與該載體基板分離,藉此提高程序之效率及生產率。 First, the separation layer can be used as a layer of overlay wiring because it is formed on a carrier substrate and separated from the carrier substrate before the formation process of the touch sensor, thereby improving the efficiency of the program and productivity.
第二,經形成於一透明導電層之圖案上之該絕緣層可被用作為一平坦化層,藉此提高用於製備一觸控感測器之程序的效率。 Second, the insulating layer formed on the pattern of a transparent conductive layer can be used as a planarization layer, thereby improving the efficiency of a program for preparing a touch sensor.
第三,將該觸控感測器實施於一載體基板上之程序可提供高清晰度及耐熱性且可應用各種基底薄膜。 Third, the procedure for implementing the touch sensor on a carrier substrate provides high definition and heat resistance and can be applied to various substrate films.
第四,該襯墊圖案層(其經形成於該分離層上作為一單一層或由一金屬或一金屬氧化物組成之複數個層)可有效地減小與一電路板之一接觸電阻,藉此提高程序之穩定性。 Fourth, the liner pattern layer (which is formed as a single layer on the separation layer or a plurality of layers composed of a metal or a metal oxide) can effectively reduce contact resistance with a circuit board. This improves the stability of the program.
第五,該襯墊圖案層可在無需移除經形成於該載體基板上之該分離層之情況下與一電路板附接,藉此提高程序之效率。 Fifth, the liner pattern layer can be attached to a circuit board without removing the separation layer formed on the carrier substrate, thereby increasing the efficiency of the program.
第六,在該分離層與該載體基板分離之後,無需移除該分離層,藉此達成簡單程序且克服可發生於該觸控感測器之一移除程序中的問題。 Sixth, after the separation layer is separated from the carrier substrate, there is no need to remove the separation layer, thereby achieving a simple procedure and overcoming the problems that can occur in one of the touch sensor removal procedures.
第七,該彈性控制保護層(其進一步經形成於該分離層與該絕緣層之間)可因該分離層與該絕緣層之間之消除應力能力之一差異而抑制裂痕產生。 Seventh, the elastic control protective layer (which is further formed between the separation layer and the insulating layer) can suppress crack generation due to a difference in stress-relieving ability between the separation layer and the insulating layer.
10‧‧‧載體基板 10‧‧‧ Carrier substrate
20‧‧‧分離層 20‧‧‧Separation layer
30‧‧‧保護層 30‧‧‧Protective layer
40‧‧‧襯墊圖案層 40‧‧‧ liner pattern layer
41‧‧‧第一襯墊圖案層 41‧‧‧First pad pattern layer
42‧‧‧第二襯墊圖案層 42‧‧‧Second pad pattern layer
50‧‧‧電極圖案層 50‧‧‧electrode pattern layer
51‧‧‧第一電極層 51‧‧‧First electrode layer
52‧‧‧第二電極層 52‧‧‧Second electrode layer
60‧‧‧感光性光阻劑 60‧‧‧Photosensitive photoresist
70‧‧‧絕緣層 70‧‧‧Insulation
80‧‧‧黏著層 80‧‧‧Adhesive layer
100‧‧‧基底薄膜 100‧‧‧base film
110‧‧‧電路板 110‧‧‧Circuit board
PE‧‧‧襯墊電極 PE‧‧‧ gasket electrode
SE‧‧‧感測電極 SE‧‧‧Sensing electrode
圖1至圖4係展示根據本發明之實施例之薄膜式觸控感測器之各結構的橫截面圖。 1 to 4 are cross-sectional views showing respective structures of a film type touch sensor according to an embodiment of the present invention.
圖5a至圖5k示意性地展示根據本發明之一實施例之用於製備一薄膜式觸控感測器之程序。 5a-5k schematically illustrate a procedure for preparing a thin film touch sensor in accordance with an embodiment of the present invention.
在下文中,將如下詳細地描述根據本發明之一薄膜式觸控感測器及其製備方法之較佳實施例。 Hereinafter, a preferred embodiment of a thin film type touch sensor and a method of fabricating the same according to the present invention will be described in detail below.
透過實施例之各者之以下詳細描述將明白根據本發明之薄膜式觸控感測器及其製備方法之特徵及優點。 The features and advantages of the thin film touch sensor and the method of fabricating the same according to the present invention will be apparent from the following detailed description of the embodiments.
圖1至圖4係展示根據本發明之實施例之薄膜式觸控感測器之各結構的橫截面圖。 1 to 4 are cross-sectional views showing respective structures of a film type touch sensor according to an embodiment of the present invention.
本發明將提供一種薄膜式觸控感測器,其中一分離層係在該觸控感測器之形成程序之前形成於一載體基板上且與該載體基板分離,使得該分離層可被用作為一層覆蓋佈線,藉此確保高清晰度及耐熱性(與已直接形成於一基底薄膜上之一習知觸控感測器不同),且允許應用各種基底薄膜。 The present invention provides a thin film touch sensor in which a separation layer is formed on a carrier substrate and separated from the carrier substrate before the formation process of the touch sensor, so that the separation layer can be used as One layer covers the wiring, thereby ensuring high definition and heat resistance (unlike one of the conventional touch sensors that have been formed directly on a base film), and allows various substrate films to be applied.
本發明將使一襯墊圖案層形成於該分離層上作為一單一層或由一金屬或一金屬氧化物組成之複數個層,以有效地減小與一電路板之一接觸電阻,藉此提高程序之穩定性。 The present invention will form a liner pattern layer on the separation layer as a single layer or a plurality of layers composed of a metal or a metal oxide to effectively reduce contact resistance with one of the circuit boards. Improve the stability of the program.
如圖1中所展示,本發明之薄膜式觸控感測器可包括:一分離層;一電極圖案層,其經形成於該分離層上且包括一感測電極及經形成於該感測電極之一端處之一襯墊電極;一絕緣層,其經形成於該電極圖案層上;及一基底薄膜,其經形成於該絕緣層上。 As shown in FIG. 1 , the thin film touch sensor of the present invention may include: a separation layer; an electrode pattern layer formed on the separation layer and including a sensing electrode and formed on the sensing layer a pad electrode at one end of the electrode; an insulating layer formed on the electrode pattern layer; and a base film formed on the insulating layer.
該分離層可係由一有機聚合物(例如選自由聚醯亞胺、聚乙烯醇、聚醯胺酸、聚醯胺、聚乙烯、聚苯乙烯、聚降冰片烯、苯基馬來醯亞胺共聚物、聚偶氮苯、聚伸苯基苯二醯胺、聚酯、聚甲基丙烯酸甲酯、聚芳酯、肉桂酸酯聚合物、香豆素聚合物、苄甲內醯胺聚合物、查耳酮聚合物及芳族乙炔聚合物組成之群組之至少一者)製成。 The separation layer may be composed of an organic polymer (for example selected from the group consisting of polyimine, polyvinyl alcohol, polyglycolic acid, polyamine, polyethylene, polystyrene, polynorbornene, phenyl malayan) Amine copolymer, polyazobenzene, polyphenylene phthalamide, polyester, polymethyl methacrylate, polyarylate, cinnamate polymer, coumarin polymer, benzalkonium amide polymerization It is made of at least one of a group consisting of a substance, a chalcone polymer and an aromatic acetylene polymer.
分離層20經形成於一載體基板10上,隨後,在電極圖案層經形成於分離層20上之後,分離層20與載體基板10分離。 The separation layer 20 is formed on a carrier substrate 10, and then, after the electrode pattern layer is formed on the separation layer 20, the separation layer 20 is separated from the carrier substrate 10.
當分離層與載體基板分離時,分離層較佳地具有1N/25mm或更小,更佳地,0.1N/25mm或更小之一剝離強度。即,較佳地,分離層由可使在分離層20與載體基板10之分離期間所施加之一物理力維持 於1N/25mm,特定言之,0.1N/25mm內之一材料形成。 When the separation layer is separated from the carrier substrate, the separation layer preferably has a peel strength of 1 N/25 mm or less, more preferably 0.1 N/25 mm or less. That is, preferably, the separation layer is maintained by a physical force that can be applied during the separation of the separation layer 20 from the carrier substrate 10. In 1N/25mm, in particular, one material of 0.1N/25mm is formed.
若分離層20之剝離強度超過1N/25mm,則難以使分離層與載體基板清楚地分離,因此可使分離層20保留於載體基板上。另外,可在分離層20、保護層30、電極圖案層50及絕緣層70之至少一者上產生裂痕。 If the peeling strength of the separation layer 20 exceeds 1 N/25 mm, it is difficult to clearly separate the separation layer from the carrier substrate, so that the separation layer 20 can be left on the carrier substrate. Further, cracks may be generated in at least one of the separation layer 20, the protective layer 30, the electrode pattern layer 50, and the insulating layer 70.
特定言之,分離層20之剝離強度較佳為0.1N/25mm或更小,此係因為其允許在與載體基板分離之後控制薄膜產生卷邊。卷邊會劣化黏著及切割程序之效率,但其不會影響薄膜式觸控感測器之本身功能。因此,可有利地最小化卷邊產生。 Specifically, the peeling strength of the separation layer 20 is preferably 0.1 N/25 mm or less because it allows the film to be curled after being separated from the carrier substrate. Curling can degrade the efficiency of the adhesion and cutting process, but it does not affect the function of the thin film touch sensor itself. Therefore, curling can be advantageously minimized.
分離層較佳地具有10nm至1000nm,更佳地,50nm至500nm之一厚度。若分離層之厚度小於10nm,則分離層可經不平坦地形成以誘發不平坦電極圖案之形成,分離層之剝離強度可經局部地提高以引起破壞,或無法在分離層與載體基板分離之後控制卷邊。若分離層之厚度大於1000nm,則可不再降低分離層之剝離強度,且可劣化薄膜之可撓性。 The separation layer preferably has a thickness of from 10 nm to 1000 nm, more preferably from 50 nm to 500 nm. If the thickness of the separation layer is less than 10 nm, the separation layer may be unevenly formed to induce formation of an uneven electrode pattern, and the peel strength of the separation layer may be locally increased to cause damage or may not be separated from the carrier substrate after the separation layer is separated from the carrier substrate Control the curling. If the thickness of the separation layer is more than 1000 nm, the peel strength of the separation layer can be no longer lowered, and the flexibility of the film can be deteriorated.
在分離層自載體基板剝離之後,分離層較佳地具有30mN/m至70mN/m之一表面能。另外,分離層較佳地具有其與載體基板之間之10mN/m或更大之一表面能差。分離層應維持與載體基板之穩定黏著直至其與載體基板分離,且接著應在不破壞薄膜式觸控感測器或不產生卷邊之情況下被容易地分離。當分離層之表面能滿足30mN/m至70mN/m之範圍時,可控制其剝離強度,可確保分離層與相鄰保護層或電極圖案層之間之良好黏著以改良程序之效率。另外,當分離層滿足其與載體基板之間之10mN/m或更大之一表面能差時,可容易地使分離層與載體基板分離以防止破壞薄膜式觸控感測器或在薄膜式觸控感測器之各層中產生裂痕。 After the separation layer is peeled off from the carrier substrate, the separation layer preferably has a surface energy of from 30 mN/m to 70 mN/m. Further, the separation layer preferably has a surface energy difference of 10 mN/m or more between it and the carrier substrate. The separation layer should maintain a stable adhesion to the carrier substrate until it is separated from the carrier substrate, and should then be easily separated without damaging the thin film touch sensor or creating curling. When the surface of the separation layer can satisfy the range of 30 mN/m to 70 mN/m, the peel strength can be controlled to ensure good adhesion between the separation layer and the adjacent protective layer or electrode pattern layer to improve the efficiency of the process. In addition, when the separation layer satisfies a surface energy difference of 10 mN/m or more between the carrier substrate and the carrier substrate, the separation layer can be easily separated from the carrier substrate to prevent damage to the thin film type touch sensor or in the film type. Cracks are formed in the layers of the touch sensor.
分離層20充當覆蓋形成於其上之一電極圖案層50之一層或充當 在分離層20與載體基板分離之後保護電極圖案層50免於外部接觸之一層。 The separation layer 20 serves as a layer covering one of the electrode pattern layers 50 formed thereon or serves as a layer The electrode pattern layer 50 is protected from external contact with one layer after the separation layer 20 is separated from the carrier substrate.
至少一保護層30可進一步形成於分離層20上。由於僅分離層20難以達成完全保護電極圖案免於外部接觸或影響,所以可形成用於保護目的之至少一保護層30。 At least one protective layer 30 may be further formed on the separation layer 20. Since only the separation layer 20 is difficult to achieve complete protection of the electrode pattern from external contact or influence, at least one protective layer 30 for protection purposes can be formed.
保護層30可包括一有機絕緣薄膜及一無機絕緣薄膜之至少一者且可通過塗佈及固化或沈積而形成。 The protective layer 30 may include at least one of an organic insulating film and an inorganic insulating film and may be formed by coating and curing or deposition.
保護層可經形成使得對應於其中將形成襯墊電極之一區域之保護層之一部分通過圖案化而被移除或其中將形成襯墊電極之一區域被排除。較佳地,保護層可經形成使得分離層被曝露。當附接一電路板時,此允許襯墊電極與該電路板之間連接良好。 The protective layer may be formed such that a portion of the protective layer corresponding to a region in which the pad electrode is to be formed is removed by patterning or a region where the pad electrode is to be formed is excluded. Preferably, the protective layer can be formed such that the separation layer is exposed. This allows a good connection between the pad electrode and the board when a board is attached.
襯墊圖案層40可形成於襯墊電極之底部上。當襯墊電極與電路板連接時,襯墊圖案層用於降低接觸電阻。若當襯墊電極與電路板連接時接觸電阻足夠低,則可省略襯墊圖案層。 A pad pattern layer 40 may be formed on the bottom of the pad electrode. The pad pattern layer serves to reduce the contact resistance when the pad electrode is connected to the circuit board. If the contact resistance is sufficiently low when the pad electrode is connected to the board, the pad pattern layer can be omitted.
襯墊圖案層40可由選自由一金屬、一金屬奈米線、一金屬氧化物、碳奈米管、石墨烯、一導電聚合物及一導電油墨組成之群組之至少一者形成。 The liner pattern layer 40 may be formed of at least one selected from the group consisting of a metal, a metal nanowire, a metal oxide, a carbon nanotube, graphene, a conductive polymer, and a conductive ink.
該金屬之實例可包含金(Au)、銀(Ag)、銅(Cu)、鉬(Mo)、鋁、鈀、釹及Ag-Pd-Cu(APC)之一合金。 Examples of the metal may include an alloy of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), aluminum, palladium, rhodium, and Ag-Pd-Cu (APC).
該金屬奈米線之實例可包含銀奈米線、銅奈米線、鋯奈米線及金奈米線。 Examples of the metal nanowire may include a silver nanowire, a copper nanowire, a zirconium nanowire, and a golden nanowire.
該金屬氧化物之實例可包含氧化銦錫(ITO)、氧化銦鋅(IZO)、氧化銦鋅錫(IZTO)、氧化鋁鋅(AZO)、氧化鎵鋅(GZO)、摻氟氧化錫(FTO)、氧化鋅(ZnO)、氧化銦錫-Ag-氧化銦錫(ITO-Ag-ITO)、氧化銦鋅-Ag-氧化銦鋅(IZO-Ag-IZO)、氧化銦鋅錫-Ag-氧化銦鋅錫(IZTO-Ag-IZTO)及氧化鋁鋅-Ag-氧化鋁鋅(AZO-Ag-AZO)。 Examples of the metal oxide may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), fluorine-doped tin oxide (FTO). ), zinc oxide (ZnO), indium tin oxide-Ag-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-Ag-indium zinc oxide (IZO-Ag-IZO), indium zinc sulfide-Ag-oxidation Indium zinc tin oxide (IZTO-Ag-IZTO) and zinc oxide-Ag-alumina zinc oxide (AZO-Ag-AZO).
另外,襯墊圖案層40可由碳材料(諸如碳奈米管(CNT)及石墨烯)形成。 In addition, the pad pattern layer 40 may be formed of a carbon material such as a carbon nanotube (CNT) and graphene.
該導電聚合物之實例可包含聚吡咯、聚噻吩、聚乙炔、PEDOT及聚苯胺。 Examples of the conductive polymer may include polypyrrole, polythiophene, polyacetylene, PEDOT, and polyaniline.
該導電油墨可為金屬粉末及一可固化聚合物黏合劑之一混合物。 The conductive ink can be a mixture of a metal powder and a curable polymer binder.
為減小電阻及與一電路板之接觸電阻,襯墊圖案層40可由兩個或兩個以上導電層(例如一第一襯墊圖案層41及一第二襯墊圖案層42)組成,如圖2a及圖2b中所展示。 In order to reduce the resistance and the contact resistance with a circuit board, the pad pattern layer 40 may be composed of two or more conductive layers (for example, a first pad pattern layer 41 and a second pad pattern layer 42), such as Shown in Figures 2a and 2b.
具體而言,襯墊圖案層40可具有:其中層壓一金屬氧化物且將一金屬層壓於該金屬氧化物上之一結構;其中層壓一金屬且將一金屬氧化物層壓於該金屬上之一結構;其中層壓一金屬,將一金屬氧化物層壓於該金屬上,且將一金屬進一步層壓於該金屬氧化物上之一結構;及其中層壓一金屬氧化物,將一金屬層壓於該金屬氧化物上,且將一金屬氧化物進一步層壓於該金屬上之一結構。 Specifically, the liner pattern layer 40 may have a structure in which a metal oxide is laminated and a metal is laminated on the metal oxide; wherein a metal is laminated and a metal oxide is laminated thereon a structure on a metal; wherein a metal is laminated, a metal oxide is laminated on the metal, and a metal is further laminated on the metal oxide; and a metal oxide is laminated thereon, A metal is laminated to the metal oxide and a metal oxide is further laminated to one of the structures on the metal.
電極圖案層50可形成於分離層20或保護層30上。電極圖案層50可包括:一感測電極(SE),其感測觸控操作;及一襯墊電極(PE),其形成於感測電極(SE)之一端處。感測電極(SE)可包括用於感測觸控操作之一電極及連接至該電極之一佈線圖案。襯墊電極(PE)可與一電路板電連接。 The electrode pattern layer 50 may be formed on the separation layer 20 or the protective layer 30. The electrode pattern layer 50 may include: a sensing electrode (SE) that senses a touch operation; and a pad electrode (PE) formed at one end of the sensing electrode (SE). The sensing electrode (SE) may include one of an electrode for sensing a touch operation and a wiring pattern connected to the electrode. The pad electrode (PE) can be electrically connected to a circuit board.
電極圖案層50可為一透明導電層,且可由選自由一金屬、一金屬奈米線、一金屬氧化物、碳奈米管、石墨烯、一導電聚合物及一導電油墨組成之群組之至少一者形成。 The electrode pattern layer 50 can be a transparent conductive layer and can be selected from the group consisting of a metal, a metal nanowire, a metal oxide, a carbon nanotube, a graphene, a conductive polymer, and a conductive ink. At least one is formed.
該金屬之實例可包含金(Au)、銀(Ag)、銅(Cu)、鉬(Mo)、鋁、鈀、釹及Ag-Pd-Cu(APC)之一合金。 Examples of the metal may include an alloy of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), aluminum, palladium, rhodium, and Ag-Pd-Cu (APC).
該金屬奈米線之實例可包含銀奈米線、銅奈米線、鋯奈米線及 金奈米線。 Examples of the metal nanowire may include a silver nanowire, a copper nanowire, a zirconium nanowire, and Jinnai line.
該金屬氧化物之實例可包含氧化銦錫(ITO)、氧化銦鋅(IZO)、氧化銦鋅錫(IZTO)、氧化鋁鋅(AZO)、氧化鎵鋅(GZO)、摻氟氧化錫(FTO)、氧化鋅(ZnO)、氧化銦錫-Ag-氧化銦錫(ITO-Ag-ITO)、氧化銦鋅-Ag-氧化銦鋅(IZO-Ag-IZO)、氧化銦鋅錫-Ag-氧化銦鋅錫(IZTO-Ag-IZTO)及氧化鋁鋅-Ag-氧化鋁鋅(AZO-Ag-AZO)。 Examples of the metal oxide may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), fluorine-doped tin oxide (FTO). ), zinc oxide (ZnO), indium tin oxide-Ag-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-Ag-indium zinc oxide (IZO-Ag-IZO), indium zinc sulfide-Ag-oxidation Indium zinc tin oxide (IZTO-Ag-IZTO) and zinc oxide-Ag-alumina zinc oxide (AZO-Ag-AZO).
另外,電極圖案層50可由碳材料(諸如碳奈米管(CNT)及石墨烯)形成。 In addition, the electrode pattern layer 50 may be formed of a carbon material such as a carbon nanotube (CNT) and graphene.
該導電聚合物之實例可包含聚吡咯、聚噻吩、聚乙炔、PEDOT及聚苯胺。 Examples of the conductive polymer may include polypyrrole, polythiophene, polyacetylene, PEDOT, and polyaniline.
該導電油墨可為金屬粉末及一可固化聚合物黏合劑之一混合物。 The conductive ink can be a mixture of a metal powder and a curable polymer binder.
為減小電阻,電極圖案層50可由兩個或兩個以上導電層(例如一第一電極層51及一第二電極層52)組成,如圖2a中所展示。 To reduce the electrical resistance, the electrode pattern layer 50 may be composed of two or more conductive layers (eg, a first electrode layer 51 and a second electrode layer 52), as shown in Figure 2a.
例如,電極圖案層50可由ITO、AgNW(銀奈米線)或一金屬網之一單一層、或包括一透明金屬氧化物(諸如ITO)之一第一層51及形成於該ITO電極層上之一金屬或AgNW之一第二層52之兩個或兩個以上層組成以不斷降低電阻。 For example, the electrode pattern layer 50 may be formed of a single layer of ITO, AgNW (silver nanowire) or a metal mesh, or a first layer 51 including a transparent metal oxide (such as ITO) and formed on the ITO electrode layer. One or two or more layers of the second layer 52 of one of the metals or AgNW are configured to continuously reduce the electrical resistance.
另外,電極圖案層50可包括一金屬或一金屬氧化物之至少一層以改良導電率。更具體而言,可藉由使一金屬或一金屬氧化物之一透明導電層形成於分離層或保護層上且進一步層壓一透明導電層以形成一電極圖案而獲得電極圖案層;或可藉由將至少一透明導電層層壓於分離層或保護層上且進一步形成一金屬或一金屬氧化物之一透明導電層以形成一電極圖案而獲得電極圖案層。例如,該電極圖案可具有:其中使一金屬或一金屬氧化物之一圖案層進一步形成於分離層與電極圖案層之間之一結構;其中使一金屬或一金屬氧化物之一圖案層進一 步形成於電極圖案層與絕緣層之間之一結構;或其中使一金屬或一金屬氧化物之一圖案層進一步形成於保護層與電極圖案層之間之一結構且可進一步形成一透明導電材料之至少一電極圖案層。 In addition, the electrode pattern layer 50 may include at least one layer of a metal or a metal oxide to improve conductivity. More specifically, the electrode pattern layer may be obtained by forming a transparent conductive layer of a metal or a metal oxide on the separation layer or the protective layer and further laminating a transparent conductive layer to form an electrode pattern; The electrode pattern layer is obtained by laminating at least one transparent conductive layer on the separation layer or the protective layer and further forming a transparent conductive layer of one metal or one metal oxide to form an electrode pattern. For example, the electrode pattern may have a structure in which a pattern layer of a metal or a metal oxide is further formed between the separation layer and the electrode pattern layer; wherein a pattern of one metal or one metal oxide is layered into one Forming a structure between the electrode pattern layer and the insulating layer; or forming a metal or a metal oxide pattern layer further formed between the protective layer and the electrode pattern layer and further forming a transparent conductive At least one electrode pattern layer of material.
電極圖案層50之適用層壓結構可(例如)包含:其中層壓一金屬氧化物層且將一銀奈米線層層壓於該金屬氧化物層上之一結構;其中層壓一金屬氧化物層且將一金屬層層壓於該金屬氧化物層上之一結構;其中層壓一金屬氧化物層且將一金屬網電極層層壓於該金屬氧化物層上之一結構;其中層壓一銀奈米線層且將一金屬氧化物層層壓於該銀奈米線層上之一結構;其中層壓一金屬層且將一金屬氧化物層層壓於該金屬層上之一結構;其中層壓一金屬網電極層且將一金屬氧化物層層壓於該金屬網電極層上之一結構;其中層壓一金屬氧化物層,將一銀奈米線層層壓於該金屬氧化物層上,且將一金屬層層壓於該銀奈米線層上之一結構;其中層壓一銀奈米線層、將一金屬氧化物層層壓於該銀奈米線層上,且將一金屬層層壓於該金屬氧化物層上之一結構。 A suitable laminate structure of the electrode pattern layer 50 may, for example, comprise: a structure in which a metal oxide layer is laminated and a silver nanowire layer is laminated on the metal oxide layer; wherein a metal oxide is laminated a layer of a metal layer laminated on the metal oxide layer; wherein a metal oxide layer is laminated and a metal mesh electrode layer is laminated on the metal oxide layer; Pressing a silver nanowire layer and laminating a metal oxide layer on one of the silver nanowire layers; laminating a metal layer and laminating a metal oxide layer on the metal layer a structure in which a metal mesh electrode layer is laminated and a metal oxide layer is laminated on the metal mesh electrode layer; wherein a metal oxide layer is laminated, and a silver nanowire layer is laminated thereon a metal oxide layer, and a metal layer is laminated on one of the silver nanowire layers; wherein a silver nanowire layer is laminated, and a metal oxide layer is laminated on the silver nanowire layer And a metal layer is laminated on one of the structures on the metal oxide layer.
可根據觸控感測器之信號處理及電阻而修改此等電極層壓結構,因此,本發明不限於此。 The electrode laminate structures can be modified according to the signal processing and resistance of the touch sensor, and thus the present invention is not limited thereto.
電極圖案層可經組態以在第一電極圖案層與第二電極圖案層之間具有一絕緣層。另外,該絕緣層可經受圖案化以形成接觸孔,使得第二導電層可充當一橋電極。 The electrode pattern layer can be configured to have an insulating layer between the first electrode pattern layer and the second electrode pattern layer. Additionally, the insulating layer can be patterned to form contact holes such that the second conductive layer can act as a bridge electrode.
此外,依據觸控感測器模式而描述電極圖案層之結構。 Further, the structure of the electrode pattern layer is described in accordance with the touch sensor mode.
電極圖案層較佳地具有用於電容模式(諸如互電容模式及自電容模式)中之圖案結構。 The electrode pattern layer preferably has a pattern structure for use in a capacitive mode such as a mutual capacitance mode and a self capacitance mode.
互電容模式可具有一水平軸及一垂直軸之一柵格電極結構。該水平軸及該垂直軸上之電極之間的相交點可具有一橋電極。替代地,該水平軸及該垂直軸上之各電極圖案層可經形成且其等之各者可彼此電隔開。 The mutual capacitance mode may have a grid electrode structure of one horizontal axis and one vertical axis. The intersection between the horizontal axis and the electrodes on the vertical axis may have a bridge electrode. Alternatively, the horizontal axis and each of the electrode pattern layers on the vertical axis may be formed and each of them may be electrically separated from each other.
自電容模式可具有使用各位置中之一電極來辨識電容之變化之一電極層結構。 The self-capacitance mode may have an electrode layer structure that uses one of the electrodes in each position to recognize a change in capacitance.
電極圖案層50上可具有一感光性光阻劑60,如圖2b中所展示。 可通過光微影來形成此一電極圖案層50,且可根據一電極圖案層之類型而在形成該電極圖案層之後保留或移除感光性光阻劑。保留之感光性光阻劑可用於保護該電極圖案層。 The electrode pattern layer 50 can have a photosensitive photoresist 60 as shown in Figure 2b. The electrode pattern layer 50 may be formed by photolithography, and the photosensitive photoresist may be retained or removed after the electrode pattern layer is formed according to the type of the electrode pattern layer. A retained photosensitive photoresist can be used to protect the electrode pattern layer.
絕緣層70經形成於電極圖案層50上以抑制電極圖案之腐蝕且保護電極圖案之表面。絕緣層70填充電極或佈線中之一間隙,且其經較佳地形成以具有某一厚度。即,宜使絕緣層在與電極圖案層50接觸之表面的相對表面上平坦化,使得電極之不平坦部分不被顯露。 The insulating layer 70 is formed on the electrode pattern layer 50 to suppress corrosion of the electrode pattern and protect the surface of the electrode pattern. The insulating layer 70 fills one of the gaps in the electrode or wiring, and is preferably formed to have a certain thickness. That is, it is preferable that the insulating layer is planarized on the opposite surface of the surface in contact with the electrode pattern layer 50, so that the uneven portion of the electrode is not exposed.
25℃處之絕緣層與保護層之間之一彈性模數差以達到300MPa或更小較佳,以100MPa或更小更佳,以因此等層之間之消除應力能力之一差來抑制裂痕產生。若25℃處之絕緣層與保護層之間之該彈性模數差超過300MPa,則歸因於絕緣層與保護層之間之消除應力能力失衡而產生裂痕。 The difference in modulus of elasticity between the insulating layer and the protective layer at 25 ° C is preferably 300 MPa or less, more preferably 100 MPa or less, so that cracks are suppressed by a difference in stress-relieving ability between the layers. produce. If the difference in elastic modulus between the insulating layer and the protective layer at 25 ° C exceeds 300 MPa, cracks are generated due to an imbalance in the stress-relieving ability between the insulating layer and the protective layer.
在25℃之條件(其落於一使用者之使用環境中)下,量測此一彈性模數差。 This elastic modulus difference is measured under conditions of 25 ° C which fall within the environment in which a user is used.
絕緣層可係由能夠使25℃處之其與保護層之間之一彈性模數差達到300MPa或更小的任何有機絕緣材料形成。例如,宜使用可熱固化或可UV固化之有機聚合物。 The insulating layer may be formed of any organic insulating material capable of causing one of the elastic modulus differences between the protective layer and the protective layer to be 300 MPa or less at 25 ° C. For example, it is preferred to use a thermally curable or UV curable organic polymer.
絕緣層可係由選自由環氧樹脂化合物、丙烯酸化合物及三聚氰胺化合物組成之群組中之至少一者形成。 The insulating layer may be formed of at least one selected from the group consisting of an epoxy resin compound, an acrylic compound, and a melamine compound.
絕緣層70本身可充當由一壓感黏著劑(PSA)或一黏著劑組成之一黏著層。此一絕緣層可包括選自由聚酯、聚醚、聚胺基甲酸酯、環氧樹脂、矽及丙烯酸酯組成之群組中之至少一者。當絕緣層70充當一黏著層時,基底薄膜100可直接附接於絕緣層70上,如圖1及圖2中所展示。 The insulating layer 70 itself can serve as an adhesive layer composed of a pressure sensitive adhesive (PSA) or an adhesive. The insulating layer may comprise at least one selected from the group consisting of polyesters, polyethers, polyurethanes, epoxies, enamels, and acrylates. When the insulating layer 70 acts as an adhesive layer, the base film 100 can be directly attached to the insulating layer 70, as shown in FIGS. 1 and 2.
如圖3中所展示,用於附接之一額外黏著層80亦可係形成於絕緣層70與基底薄膜100之間。黏著層80可係由一壓感黏著劑(PSA)或一黏著劑形成。為此,可使用可熱固化黏著劑及可UV固化黏著劑兩者。 黏著層可係在附接之前預先形成於基底薄膜之一表面上,其中可使用一非載體薄膜(NCF)類型之黏著劑或壓感黏著劑(PSA)薄膜。替代地,可經由塗佈於絕緣層上來形成黏著層,且接著可將基底薄膜附接於黏著層上。在此情況中,塗佈一透光樹脂(OCR)類型之液體黏著劑且接著將待附接之基底薄膜放置於該OCR類型之液體黏著劑上,接著進行固化。用於基底薄膜100之附接之黏著劑或壓感黏著劑(PSA)宜為聚酯、聚醚、聚胺基甲酸酯、環氧樹脂、矽或丙烯酸黏著劑。 As shown in FIG. 3, an additional adhesive layer 80 for attachment may also be formed between the insulating layer 70 and the base film 100. The adhesive layer 80 can be formed of a pressure sensitive adhesive (PSA) or an adhesive. For this purpose, both heat curable adhesives and UV curable adhesives can be used. The adhesive layer may be preformed on one surface of the base film prior to attachment, wherein a non-carrier film (NCF) type adhesive or a pressure sensitive adhesive (PSA) film may be used. Alternatively, the adhesive layer may be formed by coating on the insulating layer, and then the base film may be attached to the adhesive layer. In this case, a light-transmitting resin (OCR) type liquid adhesive is applied and then the base film to be attached is placed on the OCR type liquid adhesive, followed by curing. The adhesive or pressure sensitive adhesive (PSA) for attachment of the base film 100 is preferably a polyester, a polyether, a polyurethane, an epoxy resin, a enamel or an acrylic adhesive.
在本發明中,基底薄膜100可為一透明薄膜或一偏光片。 In the present invention, the base film 100 can be a transparent film or a polarizer.
若透明薄膜具有良好透明度、機械強度及熱穩定性,則其不受限制。透明薄膜之特定實例可包含:熱塑性樹脂,例如聚酯樹脂,諸如聚對苯二甲酸乙二酯、聚間苯二甲酸乙二酯、聚萘二甲酸乙二酯及聚對苯二甲酸丁二酯;纖維素樹脂,諸如二乙醯纖維素及三乙醯纖維素;聚碳酸酯樹脂;丙烯酸酯樹脂,諸如聚甲基丙烯酸甲酯及聚乙基丙烯酸甲酯;苯乙烯樹脂,諸如聚苯乙烯及丙烯腈-苯乙烯共聚物;聚烯烴樹脂,諸如聚乙烯、聚丙烯、具有一環狀或降冰片烯結構之聚烯烴、及乙烯-丙烯共聚物;氯乙烯樹脂;醯胺樹脂,諸如尼龍及芳族聚醯胺;醯亞胺樹脂;聚醚碸樹脂;碸樹脂;聚醚醚酮樹脂;聚苯硫醚樹脂;乙烯醇樹脂;二氯亞乙烯樹脂;乙烯基丁縮醛樹脂;烯丙基樹脂;聚甲醛樹脂;及環氧樹脂。另外,可使用由熱塑性樹脂之一摻合物組成之一薄膜。此外,可使用可熱固化或可UV固化樹脂,諸如(甲基)丙烯酸酯、胺基甲酸酯、丙烯酸胺基甲酸酯、環氧樹脂及矽樹脂。此一透明薄膜可具有一適合厚度。例如,考量依據強度及處置或薄層性質之可加工性,透明薄膜之厚度可在自1μm至500μm,較佳 地,自1μm至300μm,更佳地,自5μm至200μm之範圍內。 If the transparent film has good transparency, mechanical strength and thermal stability, it is not limited. Specific examples of the transparent film may include: a thermoplastic resin such as a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate Ester; cellulose resin, such as diethyl phthalocyanine and triethyl hydrazine cellulose; polycarbonate resin; acrylate resin, such as polymethyl methacrylate and polyethyl methacrylate; styrene resin, such as polyphenylene Ethylene and acrylonitrile-styrene copolymer; polyolefin resin such as polyethylene, polypropylene, polyolefin having a cyclic or norbornene structure, and ethylene-propylene copolymer; vinyl chloride resin; guanamine resin, such as Nylon and aromatic polyamine; quinone imine resin; polyether oxime resin; oxime resin; polyetheretherketone resin; polyphenylene sulfide resin; vinyl alcohol resin; dichloroethylene vinyl resin; vinyl butyral resin; Allyl resin; polyacetal resin; and epoxy resin. Further, a film composed of a blend of one of thermoplastic resins may be used. Further, heat curable or UV curable resins such as (meth) acrylate, urethane, urethane acrylate, epoxy resin and enamel resin may be used. The transparent film can have a suitable thickness. For example, considering the strength and the processability of the treatment or the properties of the thin layer, the thickness of the transparent film may be from 1 μm to 500 μm, preferably. Ground, from 1 μm to 300 μm, more preferably, from 5 μm to 200 μm.
透明薄膜可含有至少一適合添加劑。該添加劑之實例可包含一UV吸收劑、一抗氧化劑、一潤滑劑、一塑化劑、一脫模劑、一防著色劑、一抗燃劑、一成核劑、一抗靜電劑、一顏料及一著色劑。透明薄膜可包括各種功能層,其包含一硬塗佈層、一抗反射層及一氣體障壁層,但本發明不限於此。即,亦可根據所要用途而包含其他功能層。 The transparent film may contain at least one suitable additive. Examples of the additive may include a UV absorber, an antioxidant, a lubricant, a plasticizer, a mold release agent, a color preventive agent, a flame retardant, a nucleating agent, an antistatic agent, and a Pigments and a colorant. The transparent film may include various functional layers including a hard coat layer, an anti-reflection layer, and a gas barrier layer, but the invention is not limited thereto. That is, other functional layers may be included depending on the intended use.
若需要,則透明薄膜可經表面處理。例如,可藉由乾燥方法(諸如電漿、電暈及底漆處理)或藉由化學方法(諸如包含皂化作用之鹼處理)而實施表面處理。 The transparent film can be surface treated if desired. For example, the surface treatment can be carried out by a drying method such as plasma, corona and primer treatment or by a chemical method such as treatment with a base containing saponification.
另外,透明薄膜可為一各向同性薄膜、一延遲薄膜或一保護薄膜。 Alternatively, the transparent film can be an isotropic film, a retardation film or a protective film.
就各向同性薄膜而言,較佳地滿足40nm或更小,較佳地,15nm或更小之一平面內延遲量(Ro)及-90nm至+75nm,較佳地,-80nm至+60nm,特定言之,-70nm至+45nm之一厚度延遲量(Rth),平面內延遲量(Ro)及厚度延遲量(Rth)由以下方程式表示。 In the case of an isotropic film, it is preferable to satisfy 40 nm or less, preferably, an in-plane retardation (Ro) of 15 nm or less and -90 nm to +75 nm, preferably -80 nm to +60 nm. Specifically, one of -70 nm to +45 nm thickness retardation amount (Rth), the in-plane retardation amount (Ro), and the thickness retardation amount (Rth) are represented by the following equation.
Ro=[(nx-ny)×d] Ro=[(nx-ny)×d]
Rth=[(nx+ny)/2-nz]×d Rth=[(nx+ny)/2-nz]×d
其中nx及ny分別為一薄膜平面之一主折射率,nz係薄膜之厚度方向上之一折射率,且d係薄膜之一厚度。 Wherein nx and ny are respectively a primary refractive index of a film plane, a refractive index of a thickness direction of the nz-based film, and a thickness of one of the d-type films.
可藉由一聚合物薄膜之單軸向延伸或雙軸向延伸、一聚合物之塗佈或一液晶之塗佈而製備延遲薄膜,且其一般用於改良或控制光學性質,例如視角補償、感色靈敏度改良、光洩漏防止或一顯示器之色彩控制。 The retardation film can be prepared by uniaxially extending or biaxially extending a polymer film, coating a polymer, or coating a liquid crystal, and is generally used to improve or control optical properties, such as viewing angle compensation, Improved color sensitivity, light leakage prevention or color control of a display.
延遲薄膜可包含一半波(1/2)片或四分之一波(1/4)片、一正C-板、一負C板、一正A板、一負A板及一雙軸向板。 The retardation film may comprise half-wave (1/2) or quarter-wave (1/4), a positive C-plate, a negative C-plate, a positive A-plate, a negative A-plate, and a biaxial board.
保護薄膜可為:一聚合物樹脂薄膜,其包括在其至少一表面上之一壓感黏著劑(PSA)層;或一自黏性薄膜,諸如聚丙烯。保護薄膜可用於保護觸控感測器且改良可加工性。 The protective film may be: a polymer resin film comprising a pressure sensitive adhesive (PSA) layer on at least one surface thereof; or a self-adhesive film such as polypropylene. The protective film can be used to protect the touch sensor and improve processability.
偏光片可為用於一顯示器面板中之任何已知偏光片。 The polarizer can be any known polarizer used in a display panel.
具體而言,可藉由將一保護層層壓於一偏光器(其藉由使用碘或二向色顏料來對一拉伸聚乙烯醇樹脂薄膜染色而獲得)之至少一表面上,藉由定向一液晶以提供一偏光器功能,或藉由將一定向樹脂(諸如聚乙烯醇)塗佈於一透明薄膜上,接著進行拉伸及染色而製備偏光片,但本發明不限於此。 Specifically, by laminating a protective layer on at least one surface of a polarizer obtained by dyeing a stretched polyvinyl alcohol resin film using iodine or a dichroic pigment, The liquid crystal is oriented to provide a polarizer function, or a polarizer is prepared by applying a certain resin (such as polyvinyl alcohol) to a transparent film, followed by stretching and dyeing, but the invention is not limited thereto.
如圖4中所展示,薄膜式觸控感測器可與一電路板電連接。該電路板可為一可撓印刷電路板(FPCB)且用於使本發明之薄膜式觸控感測器與一觸控開關電路電連接。可使用一導電黏著劑來將薄膜式觸控感測器與該電路板附接。 As shown in FIG. 4, the thin film touch sensor can be electrically connected to a circuit board. The circuit board can be a flexible printed circuit board (FPCB) and is used to electrically connect the thin film touch sensor of the present invention to a touch switch circuit. A conductive adhesive can be used to attach the thin film touch sensor to the circuit board.
電路板110具有形成於其之一端處且對應於一襯墊電極(PE)之一電極,且其透過一導電黏著劑而與襯墊電極(PE)電連接。為降低電路板與襯墊電極(PE)之間之接觸電阻,電路板亦可透過一襯墊圖案層40而與襯墊電極(PE)電連接。例如,電路板可藉由透過分離層將其與襯墊圖案層附接而與薄膜式觸控感測器連接,如圖4中所展示。 The circuit board 110 has an electrode formed at one end thereof and corresponding to one of the pad electrodes (PE), and is electrically connected to the pad electrode (PE) through a conductive adhesive. To reduce the contact resistance between the board and the pad electrode (PE), the board can also be electrically connected to the pad electrode (PE) through a pad pattern layer 40. For example, the circuit board can be connected to the thin film touch sensor by attaching it to the pad pattern layer through a separate layer, as shown in FIG.
可透過襯墊圖案層而實施電路板及襯墊電極之連接以降低電路板與襯墊電極之間之接觸電阻,且此可根據生產程序及產品規格而選擇性地被應用。 The connection of the circuit board and the pad electrode can be implemented through the pad pattern layer to reduce the contact resistance between the circuit board and the pad electrode, and this can be selectively applied according to the production procedure and product specifications.
另外,電路板可與藉由移除分離層之一部分而曝露之襯墊電極或襯墊圖案層連接。可藉由使用一蝕刻溶液(其可根據分離層20之材料而變動)之一濕式蝕刻程序而實施分離層20之部分移除。 Additionally, the circuit board can be connected to a pad electrode or pad pattern layer that is exposed by removing a portion of the separation layer. Partial removal of the separation layer 20 can be performed by a wet etching procedure using an etching solution that can vary depending on the material of the separation layer 20.
例如,若分離層20由一聚合物(諸如聚醯亞胺、聚乙烯醇及聚醯胺酸)組成,則可使用KOH、TMAH或胺之一鹼性溶液,而若分離層 由一聚合物(諸如聚酯、肉桂酸酯、香豆素、查耳酮及芳族乙炔)組成,則可使用磷酸、乙酸或硝酸之一酸性溶液。 For example, if the separation layer 20 is composed of a polymer such as polyimine, polyvinyl alcohol, and polyglycolic acid, an alkaline solution of KOH, TMAH or amine can be used, and if the separation layer From a polymer such as polyester, cinnamate, coumarin, chalcone and aromatic acetylene, an acidic solution of one of phosphoric acid, acetic acid or nitric acid can be used.
將在下文中參考圖5a至圖5k來描述根據本發明之上述薄膜式觸控感測器之製備方法。 A method of fabricating the above-described thin film type touch sensor according to the present invention will be described hereinafter with reference to FIGS. 5a to 5k.
圖5a至圖5k示意性地展示根據本發明之一實施例之用於製備一薄膜式觸控感測器之程序。 5a-5k schematically illustrate a procedure for preparing a thin film touch sensor in accordance with an embodiment of the present invention.
如圖5a中所展示,使用一有機聚合物薄膜來塗佈一載體基板以形成一分離層20。 As shown in Figure 5a, a carrier substrate is coated with an organic polymer film to form a separation layer 20.
可藉由此項技術中已知之一習知塗佈方法而實施分離層之形成。 The formation of the separation layer can be carried out by one of the conventional coating methods known in the art.
例如,可涉及旋轉塗佈、模具塗佈、噴射塗佈、輥式塗佈、網版塗佈、狹縫塗佈、浸漬塗佈、凹版塗佈及其類似者。 For example, it may involve spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating, and the like.
載體基板10可為一玻璃,但不限於此。即,若其他種類之基板係可忍耐電極形成之一程序溫度且在一高溫處維持平坦不變形之耐熱材料,則可將該等基板用作為載體基板10。 The carrier substrate 10 may be a glass, but is not limited thereto. That is, if other types of substrates can withstand the formation of a program temperature of the electrodes and maintain a flat, non-deformable heat-resistant material at a high temperature, the substrates can be used as the carrier substrate 10.
在塗佈之後,分離層20通過熱固化或UV固化而經受固化。可單獨或組合地實施此等熱固化及UV固化。 After coating, the separation layer 20 is subjected to curing by heat curing or UV curing. These thermal curing and UV curing can be carried out singly or in combination.
如圖5b中所展示,將一有機絕緣材料塗佈於分離層上以形成一保護層30。 As shown in Figure 5b, an organic insulating material is applied to the separation layer to form a protective layer 30.
保護層30之一部分經受用於將其移除之圖案化以提供一區域來形成一襯墊圖案層40,如圖5c中所展示。 A portion of the protective layer 30 is subjected to patterning for removal thereof to provide a region to form a liner pattern layer 40, as shown in Figure 5c.
可在形成保護層30之後通過圖案化而移除保護層30以形成用於連接一電路之襯墊圖案層,或可藉由塗佈有機絕緣材料(除其中將形成襯墊圖案層之區域之外)而形成保護層30。可使用於連接一電路之襯墊圖案層形成於其中不形成保護層之部分中。在本發明之一實施例中,描述:通過圖案化而實施保護層30之移除。 The protective layer 30 may be removed by patterning after forming the protective layer 30 to form a pad pattern layer for connecting a circuit, or may be coated with an organic insulating material (except for a region in which the pad pattern layer is to be formed) The protective layer 30 is formed. A liner pattern layer for connecting a circuit can be formed in a portion in which the protective layer is not formed. In an embodiment of the invention, it is described that the removal of the protective layer 30 is performed by patterning.
接著,如圖5d中所展示,藉由將一金屬沈積於剩餘保護層及其中移除保護層之區域上且允許該金屬層僅保留於其中保護層經受圖案化之區域中而形成一襯墊圖案層40。 Next, as shown in FIG. 5d, a liner is formed by depositing a metal on the remaining protective layer and the region where the protective layer is removed and allowing the metal layer to remain only in the region where the protective layer is subjected to patterning. Pattern layer 40.
襯墊圖案層40可由選自由一金屬、一金屬奈米線、一金屬氧化物、碳奈米管、石墨烯、一導電聚合物及一導電油墨組成之群組之至少一者形成,且其可鑑於電阻而由一單一導電層或兩個或兩個以上導電層組成。就一單一層而言,襯墊圖案層可由一金屬及一金屬氧化物之至少一者形成。就兩個層而言,較佳地形成銅之一第一襯墊圖案層及具有比一電極材料更佳之導電率之一材料(諸如金)之一第二襯墊圖案層。另外,當一襯墊電極由具有一較低電阻之一材料形成以提供與一電路連接之足夠低的接觸電阻時,可省略襯墊圖案層。在本發明之一實施例中,描述:襯墊圖案層具有兩個層之一層壓結構。 The liner pattern layer 40 may be formed of at least one selected from the group consisting of a metal, a metal nanowire, a metal oxide, a carbon nanotube, a graphene, a conductive polymer, and a conductive ink, and It may consist of a single conductive layer or two or more conductive layers in view of the resistance. For a single layer, the liner pattern layer can be formed from at least one of a metal and a metal oxide. For the two layers, one of the first liner pattern layers of copper and one of the second liner pattern layers of one of the materials (such as gold) having a conductivity better than that of the electrode material is preferably formed. In addition, the pad pattern layer may be omitted when a pad electrode is formed of a material having a lower resistance to provide a sufficiently low contact resistance to be connected to a circuit. In an embodiment of the invention, it is described that the liner pattern layer has a laminate structure of two layers.
接著,使一電極圖案層形成於保護層及襯墊圖案層上。 Next, an electrode pattern layer is formed on the protective layer and the liner pattern layer.
如圖5e中所展示,使一第一電極層51形成為銀奈米線(AgNW)之一透明導電層,且使一金屬之一第二電極層52形成於第一電極層51上。接著,使一感光性光阻劑60形成於金屬導電層上,如圖5f中所展示。隨後,用於選擇性圖案化之一光微影程序經實施以形成一電極圖案層50,如圖5g中所展示。 As shown in FIG. 5e, a first electrode layer 51 is formed as one of the silver nanowires (AgNW) transparent conductive layer, and one of the metal second electrode layers 52 is formed on the first electrode layer 51. Next, a photosensitive photoresist 60 is formed on the metal conductive layer as shown in Figure 5f. Subsequently, one photolithography process for selective patterning is implemented to form an electrode pattern layer 50, as shown in Figure 5g.
可藉由一濺鍍方法(例如化學氣相沈積(CVD)、物理氣相沈積(PVD)、電漿增強型化學氣相沈積(PECVD))、一印刷方法(例如網版印刷、凹版印刷、逆向平版印刷、噴墨印刷)或一濕式或乾式電鍍方法而形成透明導電層。特定言之,可在安置於一基板上之一遮罩上實施濺鍍以形成一電極圖案層,該遮罩具有所要電極圖案形狀。在藉由上述方法而形成導電層之後,可藉由光微影而形成該電極圖案層。 Can be by a sputtering method (such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD)), a printing method (such as screen printing, gravure printing, A transparent conductive layer is formed by reverse lithography, inkjet printing, or a wet or dry plating method. In particular, sputtering may be performed on a mask disposed on a substrate to form an electrode pattern layer having a desired electrode pattern shape. After the conductive layer is formed by the above method, the electrode pattern layer can be formed by photolithography.
可將一負型感光性光阻劑或一正型感光性光阻劑用作為感光性光阻劑60。若需要,則可使此光阻劑保留於電極圖案層50上。替代 地,可移除此光阻劑。在本發明之一實施例中,描述:使用一負型感光性光阻劑且在圖案化之後使其保留於一電極圖案上。 A negative photosensitive resist or a positive photosensitive resist can be used as the photosensitive photoresist 60. This photoresist can be left on the electrode pattern layer 50 if necessary. Alternative Ground, this photoresist can be removed. In one embodiment of the invention, it is described that a negative photosensitive resist is used and left on an electrode pattern after patterning.
此外,可根據電極圖案結構而實施一額外電極圖案之形成。 Further, the formation of an additional electrode pattern can be performed according to the electrode pattern structure.
其後,一絕緣層70經形成以覆蓋電極圖案層50,如圖5h中所展示。絕緣層70可具有相同於電極之厚度或可比電極厚,使得絕緣層具有一平坦化上表面。即,絕緣層較佳地由具有適合黏彈性之一絕緣材料形成,使得電極之不平坦部分不被轉印。 Thereafter, an insulating layer 70 is formed to cover the electrode pattern layer 50, as shown in Figure 5h. The insulating layer 70 may have the same thickness as the electrode or may be thicker than the electrode such that the insulating layer has a planarized upper surface. That is, the insulating layer is preferably formed of an insulating material having a suitable viscoelasticity such that the uneven portion of the electrode is not transferred.
具體而言,可藉由將絕緣層之一液體材料塗佈於電極圖案層上,接著進行熱固化或UV固化而實施絕緣層之形成。 Specifically, the formation of the insulating layer can be performed by applying a liquid material of one of the insulating layers to the electrode pattern layer, followed by thermal curing or UV curing.
可藉由此項技術中已知之一習知塗佈方法而實施用於形成絕緣層之塗佈。 Coating for forming an insulating layer can be carried out by a conventional coating method known in the art.
例如,可涉及旋轉塗佈、模具塗佈、噴射塗佈、輥式塗佈、網版塗佈、狹縫塗佈、浸漬塗佈、凹版塗佈及其類似者。 For example, it may involve spin coating, die coating, spray coating, roll coating, screen coating, slit coating, dip coating, gravure coating, and the like.
接著,使一黏著層80形成於絕緣層上以附接一基底薄膜100,如圖5i中所展示。在將基底薄膜附接至絕緣層之前使黏著層80預先形成於基底薄膜之一表面上,其中可使用一非載體薄膜(NCF)類型之黏著劑或壓感黏著劑(PSA)薄膜。替代地,可通過塗佈於絕緣層70上而形成黏著層80,且接著可將基底薄膜100附接於黏著層80上。在此情況中,塗佈一透光樹脂(OCR)類型之液體黏著劑且接著將待附接之基底薄膜放置於該OCR類型之液體黏著劑上,接著進行固化。 Next, an adhesive layer 80 is formed on the insulating layer to attach a base film 100, as shown in Figure 5i. The adhesive layer 80 is preliminarily formed on one surface of the base film before attaching the base film to the insulating layer, and a non-carrier film (NCF) type adhesive or a pressure sensitive adhesive (PSA) film may be used. Alternatively, the adhesive layer 80 may be formed by coating on the insulating layer 70, and then the base film 100 may be attached to the adhesive layer 80. In this case, a light-transmitting resin (OCR) type liquid adhesive is applied and then the base film to be attached is placed on the OCR type liquid adhesive, followed by curing.
接著,如圖5j中所展示,使其上形成電極之分離層20與載體基板10分離。 Next, as shown in FIG. 5j, the separation layer 20 on which the electrodes are formed is separated from the carrier substrate 10.
在本發明中,藉由剝離而實施分離層20與載體基板之分離。 In the present invention, the separation of the separation layer 20 from the carrier substrate is carried out by lift-off.
剝離方法之實例可包含(但不限於)升離或剝離。 Examples of the stripping method may include, but are not limited to, lift-off or peeling.
對於剝離,可施加1N/25mm或更小,較佳地,0.1N/25mm或更小之一力,且可根據分離層之剝離強度而變動該力。若剝離強度超過 1N/25mm,則會在自載體基板之剝離期間破壞薄膜式觸控感測器且會將一過量力施加至薄膜式觸控感測器,藉此引起薄膜式觸控感測器變形且無法充當一裝置。 For peeling, one force of 1 N/25 mm or less, preferably 0.1 N/25 mm or less may be applied, and the force may be varied depending on the peel strength of the separation layer. If the peel strength exceeds 1N/25mm will damage the thin film touch sensor during the peeling from the carrier substrate and apply an excessive force to the thin film touch sensor, thereby causing the thin film touch sensor to be deformed and unable to Act as a device.
其後,將薄膜式觸控感測器與一電路板110附接,其中一導電黏著劑可用於與電路板110附接。 Thereafter, a thin film touch sensor is attached to a circuit board 110, wherein a conductive adhesive is available for attachment to the circuit board 110.
導電黏著劑係指具有散佈於環氧樹脂、矽、胺基甲酸酯、丙烯酸或聚醯亞胺樹脂之一黏合劑中之一導電填充劑(諸如金、銀、銅、鎳、碳、鋁及鍍金)之一黏著劑。 Conductive adhesive means one of conductive adhesives (such as gold, silver, copper, nickel, carbon, aluminum) dispersed in one of epoxy, hydrazine, urethane, acrylic or polyimide resin. And gold plating) is one of the adhesives.
當在與載體基板10分離之後附接電路板110時,較佳地在分離層20之方向上使用導電黏著劑來實施附接。電路板110可透過分離層20而與襯墊電極(PE)附接,或其可透過經由分離層20形成於襯墊電極(PE)之底部上之襯墊圖案層40而與襯墊電極(PE)附接。 When the circuit board 110 is attached after being separated from the carrier substrate 10, the attachment is preferably performed using a conductive adhesive in the direction of the separation layer 20. The circuit board 110 may be attached to the pad electrode (PE) through the separation layer 20, or may pass through the pad pattern layer 40 formed on the bottom of the pad electrode (PE) via the separation layer 20 and the pad electrode ( PE) attached.
如圖5k中所展示,電路板110透過襯墊圖案層40而與襯墊電極(PE)附接。即,在本發明之一實施例中,描述:電路板藉由經由分離層之導電黏著劑而與襯墊圖案層附接,藉此允許電路板及襯墊電極(PE)之連接。 As shown in Figure 5k, the circuit board 110 is attached to the pad electrode (PE) through the pad pattern layer 40. That is, in one embodiment of the invention, it is described that the circuit board is attached to the pad pattern layer by a conductive adhesive via the separation layer, thereby allowing the connection of the circuit board and the pad electrode (PE).
藉由本範明而製備之薄膜式觸控感測器可經使用使得其基底薄膜安置於附接至一顯示器面板之一可見側中或其基底薄膜安置於該顯示器面板之該側中。另外,薄膜式觸控感測器之分離層可附接至其他光學薄膜,諸如一偏光片及一透明薄膜。 A thin film touch sensor prepared by the present invention can be used such that its base film is disposed in a visible side attached to one of the display panels or a substrate film thereof is disposed in the side of the display panel. In addition, the separation layer of the thin film touch sensor can be attached to other optical films, such as a polarizer and a transparent film.
因此,根據本發明之薄膜式觸控感測器及其製備方法可因其實施於一載體基板上而提供高清晰度及耐熱性(其在已直接形成於一基底薄膜上之一習知觸控感測器之情況中係不可能的),且可應用各種基底薄膜。即,可使用具有弱耐熱性之一基底薄膜,此係因為其在形成一電極之後被附接。 Therefore, the thin film type touch sensor and the preparation method thereof according to the present invention can provide high definition and heat resistance (which is a conventional touch formed on a base film) because it is implemented on a carrier substrate. It is not possible in the case of a sensor, and various substrate films can be applied. That is, a base film having weak heat resistance can be used because it is attached after forming an electrode.
另外,一電路板可透過形成於載體基板上之分離層而附接且接 著在不移除或移除分離層之情況下與分離層分離,藉此提高程序之效率。 In addition, a circuit board can be attached and connected through a separation layer formed on the carrier substrate. Separation from the separation layer without removing or removing the separation layer, thereby increasing the efficiency of the procedure.
此外,分離層之剝離強度及表面能可在程序期間經參數化以提高程序之效率且防止產生裂痕。 In addition, the peel strength and surface energy of the separation layer can be parameterized during the procedure to increase the efficiency of the process and prevent cracking.
儘管已展示及描述本發明之特定實施例,但熟習技術者應瞭解,其不意欲將本發明限制於較佳實施例,且熟習技術者應明白,可在不背離本發明之精神及範疇之情況下作出各種改變及修改。 Although a particular embodiment of the invention has been shown and described, it will be understood by those skilled in the art Various changes and modifications are made in the circumstances.
因此,本發明之範疇將由隨附申請專利範圍及其等效物界定。 Accordingly, the scope of the invention is defined by the scope of the appended claims and their equivalents.
20‧‧‧分離層 20‧‧‧Separation layer
30‧‧‧保護層 30‧‧‧Protective layer
40‧‧‧襯墊圖案層 40‧‧‧ liner pattern layer
50‧‧‧電極圖案層 50‧‧‧electrode pattern layer
70‧‧‧絕緣層 70‧‧‧Insulation
100‧‧‧基底薄膜 100‧‧‧base film
PE‧‧‧襯墊電極 PE‧‧‧ gasket electrode
SE‧‧‧感測電極 SE‧‧‧Sensing electrode
Claims (39)
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KR1020140176198A KR101586739B1 (en) | 2014-07-31 | 2014-12-09 | Film Touch Sensor and Method for Fabricating the Same |
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TW201606599A true TW201606599A (en) | 2016-02-16 |
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CN109564797A (en) * | 2016-08-19 | 2019-04-02 | 东友精细化工有限公司 | Film touch sensor and works including the film touch sensor |
CN110221731A (en) * | 2018-03-02 | 2019-09-10 | 宸鸿光电科技股份有限公司 | The direct patterning method and its touch panel of touch panel |
TWI672620B (en) * | 2018-03-02 | 2019-09-21 | 宸鴻光電科技股份有限公司 | Direct pattern process for forming touch panel and touch panel thereof |
TWI725216B (en) * | 2016-11-25 | 2021-04-21 | 南韓商東友精細化工有限公司 | Touch sensor integrated with oled and oled display device comprising the same |
TWI821999B (en) * | 2022-04-19 | 2023-11-11 | 大勤化成股份有限公司 | Touch layer structure and manufacturing method |
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KR101191865B1 (en) | 2011-04-20 | 2012-10-16 | 한국기계연구원 | Fabrication method of flexible substrate having buried metal electrode and the flexible substrate thereby |
KR20140008607A (en) * | 2012-07-09 | 2014-01-22 | 한국기계연구원 | Method using sacrificial substrate for manufacturing flexible substrate with buried metal trace and flexible substrate manufactured thereby |
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2014
- 2014-12-09 KR KR1020140176198A patent/KR101586739B1/en active IP Right Grant
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2015
- 2015-05-13 KR KR1020150066559A patent/KR20160016563A/en not_active Application Discontinuation
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TWI821999B (en) * | 2022-04-19 | 2023-11-11 | 大勤化成股份有限公司 | Touch layer structure and manufacturing method |
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KR101586739B1 (en) | 2016-01-20 |
KR20160016563A (en) | 2016-02-15 |
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