TW201606235A - Lamp device - Google Patents

Abstract

The present invention provides a lamp device, which includes a plurality of heat dissipating bases. Each of the heat dissipating bases has two sides formed thereon with a first engagement unit and a second engagement unit, respectively. The adjacent heat dissipating bases are combined with each other by connecting the first engagement units to the second engagement units, so as to receive at least one power source circuit and mount at least one light emitting module on one surface thereof. The power source circuit supplies power to the light emitting module for driving the light emitting module to emit light. The heat dissipating bases conduct the heat generated by the light emitting modules during a light emitting operation, or further conduct the heat generated by the power source circuit during a power supply operation. As a result, the present invention provides a streetlamp structure with a heat dissipating function combined with a power supply housing so as to lower the implementation cost of the streetlamp.

Description

Lighting fixture 【0001】

The present invention relates to a lighting device, and more particularly to a lighting device.

【0002】

Generally, the lighting device mainly projects a light by a light-emitting element for illumination purposes, such as a light emitting diode (LED) or a conventional light bulb or a conventional fluorescent lamp. However, when the illuminating element generates high heat due to energization, if the conventional illuminating device does not have good heat dissipating measures, it may cause the conventional illuminating device to malfunction and reduce its service life. Therefore, the light-emitting component of the conventional lamp can also be combined with a heat-dissipating module to dissipate heat by using the heat-dissipating module to prevent the light-emitting component from generating high heat during actual operation.

[0003]

In the process of electro-optical conversion, not all electrical energy is converted into visible light, but most of the electrical energy is converted into thermal energy, and a small part of electrical energy is converted into visible light. For example, 20% to 40% of electrical energy is converted into visible light, so that current LED products Most development focus on application development falls on solving thermal issues.

[0004]

The heat dissipation problem will be paid so much attention. The main reason is that when the operating temperature of the LED itself is too high, the luminous efficiency of the LED will be weakened, resulting in a decline in the luminous flux of the LED and a shortened service life. Therefore, the LED product generally independently designs the heat dissipating component and connects the substrate and the circuit board for setting the LED to conduct the heat energy generated when the LED emits light, thereby preventing thermal energy from accumulating in the LED itself to reduce the temperature of the LED body, and further, the LED The heat source of the product is not only the LED, but also the power circuit generates a large amount of heat when it is powered.

[0005]

In this way, heat dissipation components must be designed for the light source and the power supply circuit to solve the heat dissipation problem, so the heat dissipation component not only needs to provide a large heat dissipation area for the light source, and the heat dissipation component occupies more than 50% of the volume of the LED product, and is also directed to the power supply. The circuit provides the heat dissipation area, so the general LED product manufacturer needs to spend a lot of cost on the heat dissipating component of the light source, and consumes a lot of cost on the heat dissipating component of the power circuit, and the integration development threshold of the power circuit is high, therefore, generally LED product manufacturers also spend a lot of money on configuring power circuits and their heat-dissipating components. Therefore, LED manufacturers are contemplating how to reduce costs in heat dissipation and power supply without affecting the overall performance of LED products.

[0006]

In summary, the present invention provides a luminaire device that combines a casing of a power supply circuit with a heat dissipating component to form a casing having a heat dissipating function and is used as a pedestal for arranging the illuminating diode. Thereby, the cost of configuring the heat dissipating component of the LED product is greatly reduced.

【0007】

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a luminaire device that provides a heat dissipating component in combination with a housing of a power supply circuit to further conduct thermal energy generated by the light source and the power supply circuit to reduce the cost of disposing the heat dissipating component.

[0008]

A secondary object of the present invention is to provide a luminaire device that provides an assembly that can be assembled to increase the heat dissipation area by splicing.

【0009】

The invention provides a lamp device comprising a plurality of heat dissipation bases, at least one power supply circuit and at least one light emitting module. A first engaging unit and a second engaging unit are respectively disposed on the outer side of the heat dissipating base, and the adjacent heat dissipating bases are connected to the second engaging units by the first engaging units. The power circuit is disposed inside one of the heat dissipation bases and electrically connected to an external power source; the light emitting module is disposed on the heat dissipation base, and is electrically connected to the power circuit, and the power circuit transmits The substrate is powered to the light emitting module and drives the light emitting modules to emit light.

[0010]

Furthermore, the present invention provides another street light device including a heat dissipation base connected to the light emitting module via a power supply circuit, and the heat energy transmitted by the heat dissipation base is not less than the heat energy generated by the light emitting module and the power circuit. Thereby, the heat energy generated by the light-emitting module during the light-emitting and the heat energy generated by the power supply circuit during the power supply are simultaneously transmitted to reduce the installation cost of the heat-dissipating component of the light-emitting module and the power circuit.

10‧‧‧Lighting fixtures
12‧‧‧ Thermal base
12a‧‧‧First cooling base
12b‧‧‧Second cooling base
12c‧‧‧ Third cooling base
122‧‧‧First engagement unit
1221‧‧‧first groove
1222‧‧‧First flange
124‧‧‧Second snap-in unit
1241‧‧‧second flange
1242‧‧‧second groove
128‧‧‧Heat components
14‧‧‧Lighting module
14a‧‧‧First lighting module
14b‧‧‧second lighting module
14c‧‧‧3rd lighting module
142a‧‧‧first lampshade
142b‧‧‧second lampshade
142c‧‧‧ third lampshade
144a‧‧‧First substrate
144b‧‧‧second substrate
144c‧‧‧ third substrate
146a‧‧‧First LED Diode Wafer
146b‧‧‧Second light-emitting diode chip
146c‧‧‧3rd LED Diode Wafer
15a‧‧‧First power circuit
15b‧‧‧second power circuit
15c‧‧‧ Third circuit
16‧‧‧Front cover
18‧‧‧ rear cover
182‧‧‧ fixed mouth
20‧‧‧Fixed rod
F1‧‧‧ front opening
F2‧‧‧ front opening
F3‧‧‧ front opening
B1‧‧‧After opening
B2‧‧‧After opening
B3‧‧‧After opening

[0011]

First: a schematic structural view of a preferred embodiment of the present invention;
FIG. 2 is a schematic view showing a light-emitting diode chip disposed on a heat dissipation base of a preferred embodiment of the present invention; FIG.
FIG. 3 is a schematic view showing a single heat dissipation base plus a lamp cover according to a preferred embodiment of the present invention; FIG.
FIG. 4 is a schematic view showing a heat dissipating fin disposed on a single heat dissipating base according to a preferred embodiment of the present invention; and a fifth drawing showing a state of use of a preferred embodiment of the present invention.

[0012]

In order to provide a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiment and the detailed description are as follows:

[0013]

Please refer to FIG. 1 to FIG. 2 , which are schematic diagrams showing the structure of the preferred embodiment of the present invention and the heat dissipation base. As shown in the first and second figures, the lamp device 10 of the present invention may include a plurality of heat dissipation bases 12a, 12b, 12c, a plurality of light-emitting modules 14a, 14b, 14c and power supply circuits 15a, 15b, 15c. The first light-emitting module 14a, the second light-emitting module 14b, and the third light-emitting module 14c, the first light-emitting module 14a includes a first light-cover 142a, a first substrate 144a and a plurality of The first LED module 146a, the second LED module 14b includes a second lamp housing 142b, a second substrate 144b and a plurality of second LED chips 146b. The third lighting module 14c includes a third lamp housing. 142c, a third substrate 144c and a plurality of third LED chips 146c.

[0014]

The first light-emitting module 14a, the second light-emitting module 14b, and the third light-emitting module 14c are respectively disposed on one surface of the heat-dissipating bases 12a, 12b, and 12c. In this embodiment, the first heat-dissipating base 12a and the first The second heat dissipation base 12b and the third heat dissipation base 12c are exemplified. Therefore, the first light-emitting module 14a, the second light-emitting module 14b and the third light-emitting module 14c are respectively provided with a first heat dissipation base 12a and a second heat dissipation. One side of the base 12b and the third heat dissipation base 12c. The first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation base 12c conduct heat generated when the first light emitting module 14a, the second light emitting module 14b, and the third light emitting module 14c emit light.

[0015]

In addition, the thermal energy transmitted by the first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation base 12c is greater than any of the first light emitting module 14a, the second light emitting module 14b, and the third light emitting module 14c, respectively. The generated thermal energy, that is, the heat dissipation energy transmitted by the first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation base 12c is greater than any of the first light emitting module 14a and the second light emitting module 14b. The heat energy generated by the third light-emitting module 14c is greater than the first light-emitting module 12a, the second heat-dissipating base 12b, and the third heat-dissipating base 12c. The heat energy generated by the group 14b and the third light emitting module 14c.

[0016]

As shown in the second figure, the first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation base 12c have front openings F1, F2, and F3, respectively, and a first heat dissipation base 12a and a second heat dissipation base. The rear end of the seat 12b and the third heat dissipation base 12c has rear openings B1, B2, and B3, respectively. The power supply circuit of the embodiment is a first power supply circuit 15a, a second power supply circuit 15b and a third power supply circuit 15c. The power supply circuits 15a, 15b, and 15c are respectively inserted into the first heat dissipation base 12a and the second heat dissipation base. The socket 12b and the third heat dissipation base 12c, that is, the first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c respectively have an accommodation space for the power supply circuits 15a, 15b, 15c to be disposed. The first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c are inside.

[0017]

In addition, the first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c also transmit heat energy generated when the power supply circuits 15a, 15b, and 15c are powered, and the first heat dissipation base 12a and the second The heat energy transmitted by the heat dissipation base 12b and the third heat dissipation base 12c is greater than the heat energy generated by any of the power supply circuits 15a, 15b, and 15c, and the first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation. The heat energy transmitted by the pedestal 12c is not less than the thermal energy generated by any one of the power circuit 15a, 15b, 15c and any of the first lighting module 14a, the second lighting module 14b and the third lighting module 14c. The thermal energy transmitted by the first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c is not less than the power supply circuits 15a, 15b, 15c and the first light emitting module 14a and the second light emitting module 14b. The heat energy generated by the third light emitting module 14c.

[0018]

The first light emitting diode wafer 146a, the second light emitting diode wafer 146b and the third light emitting diode wafer 146c are respectively disposed on the first substrate 144a, the second substrate 144b and the third substrate 144c, whereby the first power source The circuit 15a is electrically connected to the first LED substrate 146a via the first substrate 144a, the second power circuit 15a is electrically connected to the second LED substrate 146b via the second substrate 144b, and the third power circuit 15c is passed through the third substrate. The 144c is electrically connected to the third LED chip 146c. The first lamp cover 142a, the second lamp cover 142b and the third lamp cover 142c respectively cover the first light-emitting diode wafer 146a, the second light-emitting diode wafer 146b and the third light-emitting diode wafer 146c, and the first light cover 142a, The second lamp cover 142b and the third lamp cover 142c also cover the first substrate 144a, the second substrate 144b, and the third substrate 144c, respectively.

[0019]

In this embodiment, the first light-emitting module 14a, the second light-emitting module 14b, and the third light-emitting module 14c are taken as an example. However, the present invention is not limited thereto, and only the first light-emitting module 14a may be disposed according to the use requirement. Any one of the second lighting module 14b and the third lighting module 14c or a combination thereof. In addition, the luminaire device 10 of the present embodiment is further provided with a front shielding member 16 and a rear shielding member 18, and the front shielding member 16 seals the first heat dissipation base 12a, the second heat dissipation base 12b, and the third heat dissipation base 12c. The front opening F1, F2, F3, the rear shielding member 18 seals the first heat dissipation base 12a, the second heat dissipation base 12b, the rear openings B1, B2, B3 of the third heat dissipation base 12c, and the rear shielding member 18 is provided There is a fixed port 182.

[0020]

Please refer to the third and fourth figures, which are schematic diagrams of a single heat dissipation base 12 in which a light-emitting module 14 and a single heat dissipation base 12 are provided with heat dissipation fins 128 according to a preferred embodiment of the present invention. As shown in the third figure, a heat dissipation base 12 is provided with a light-emitting module 14 on one side. As shown in the fourth figure, the other surface of the heat dissipation base 12 is provided with a plurality of fins 128. Moreover, the first engaging unit 122 and the second engaging unit 124 are respectively disposed on the two sides of the heat dissipation base 12, and the first engaging unit 122 of the embodiment includes a first recess 1221 and a first flange. 1222, the second engaging unit 124 is oppositely arranged with one of the second flange 1241 and a second recess 1242, and the first engaging unit 122 and the second engaging unit 124 are closely matched, so as shown in the first figure. The first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c shown in the second figure are connected to each other by the adjacent first engagement unit 122 and the second engagement unit 124. The first heat dissipation base 12a, the second heat dissipation base 12b and the third heat dissipation base 12c are spliced to each other.

[0021]

Therefore, the present invention can further reduce the size of the mold for manufacturing the heat dissipation base 12 by assembling a corresponding number of heat dissipation bases 12 according to the use requirements, so as to increase the heat dissipation area and the required area of the light-emitting module 14. In terms of manufacturing cost considerations, the size of the mold is a larger proportion of cost considerations.

[0022]

Please refer to the fifth figure, which is a schematic diagram of a state of use according to a preferred embodiment of the present invention. As shown, the luminaire device 10 of the present invention further includes a fixing rod 20 that is inserted into one of the heat dissipation pedestals 12a, 12b, 12c. The power supply circuits 15a, 15b, 15c (shown in the second figure) of the heat dissipation bases 12a, 12b, 12c are electrically connected to an external power source (not shown) via a fixed rod, for example, a commercial power supply, a generator, and a power supply. The power supply and the like are supplied to the light-emitting modules 14a, 14b, and 14c, and the light-emitting modules 14a, 14b, and 14c are driven to emit light, and the heat generated by the light-emitting modules 14a, 14b, and 14c when emitting light passes through the heat dissipation base 12a. 12b, 12c are radiated to the contact air to dissipate heat, that is, the heat dissipating base 12a, 12b, 12c as a whole as a heat dissipating component, and at the same time serve as a casing of the power supply circuits 15a, 15b, 15c, and the heat dissipating bases 12a, 12b, 12c are also The internal power supply circuits 15a, 15b, 15c are dissipated. Thus, the cost of building the luminaire device 10 is reduced by the combination of the heat dissipating component and the housing of the power circuit.

[0023]

In summary, the lamp device of the present invention provides a power supply circuit by using a heat dissipation base and is used to conduct heat generated when the light-emitting module emits light and heat energy generated when the conductive element circuit is powered. The housing is combined with the heat dissipating component, thereby reducing the cost of installing the luminaire device. At the same time, the heat dissipating susceptor itself has an assembly mechanism, and a corresponding number of heat dissipating pedestals can be combined according to the use requirements to provide better heat dissipation performance and larger Set the required area of the light module.

10‧‧‧Lighting fixtures

12a‧‧‧First cooling base

12b‧‧‧Second cooling base

12c‧‧‧ Third cooling base

14a‧‧‧First lighting module

14b‧‧‧second lighting module

14c‧‧‧3rd lighting module

142a‧‧‧first lampshade

142b‧‧‧second lampshade

142c‧‧‧ third lampshade

16‧‧‧Front cover

18‧‧‧ rear cover

182‧‧‧ fixed mouth

Claims (9)

[Item 1] A luminaire device comprising:
a plurality of heat-dissipating pedestals are respectively provided with a first engaging unit and a second engaging unit, and the adjacent heat-dissipating bases are respectively connected to the second engaging unit according to the first engaging unit And combination;
At least one power supply circuit is disposed inside one of the heat dissipation bases and electrically connected to an external power source; and at least one light emitting module is disposed on one surface of the heat dissipation bases and electrically connected The power circuit outputs power to the light emitting module and drives the light emitting module to emit light. [Item 2] The luminaire device of claim 1, wherein the illuminating module comprises:
a substrate disposed on one surface of the heat dissipation base and electrically connected to the power circuit; and a plurality of light emitting diode chips disposed on the substrate and electrically connected to the substrate, wherein the power circuit transmits the substrate Powering the light-emitting diode chips and driving the light-emitting diode wafers to emit light, and the heat-dissipating susceptors conduct heat generated when the light-emitting diode wafers emit light. [Item 3] The luminaire device of claim 1, wherein the first engaging unit is provided with a first flange or/and a first recess, and the second engaging unit is provided with a second flange or/and a second Groove. [Item 4] The luminaire device of claim 1, further comprising a fixing rod inserted in one of the heat dissipation bases, the power circuit being connected to the external power source via the fixing rod. [Item 5] The luminaire device of claim 1, wherein the heat dissipation pedestals further conduct heat energy generated by the power circuit during power supply. [Item 6] The luminaire device of claim 1, wherein the heat dissipation by the heat dissipation base is greater than the thermal energy generated by the illumination module. [Item 7] A luminaire device comprising:
a heat sink base;
a power supply circuit is attached to the inside of the heat dissipation base and electrically connected to an external power source; and a light emitting module is disposed on one surface of the heat dissipation base and electrically connected to the power circuit The light-emitting module is powered to the light-emitting module and drives the light-emitting module to emit light. The heat-dissipating base conducts heat generated by the light-emitting module and simultaneously transmits heat generated by the power circuit. [Item 8] The luminaire device of claim 7, wherein the illuminating module comprises:
a substrate disposed on the heat dissipation base and electrically connected to the power circuit; and a plurality of light emitting diode chips disposed on the substrate and electrically connected to the substrate, wherein the power circuit is powered by the substrate The light-emitting diode chips drive the light-emitting diode wafers to emit light, and the heat-dissipating susceptors conduct heat generated when the light-emitting diode wafers emit light. [Item 9] The luminaire device of claim 7, wherein the heat dissipation by the heat dissipation base is not less than the thermal energy generated by the illumination module and the power supply circuit.