TW201604325A - Solvent vapor phase degreasing and defluxing compositions, methods, devices and systems - Google Patents

Solvent vapor phase degreasing and defluxing compositions, methods, devices and systems Download PDF

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TW201604325A
TW201604325A TW104111679A TW104111679A TW201604325A TW 201604325 A TW201604325 A TW 201604325A TW 104111679 A TW104111679 A TW 104111679A TW 104111679 A TW104111679 A TW 104111679A TW 201604325 A TW201604325 A TW 201604325A
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拉傑特S 巴蘇
萊恩 霍斯
傑佛瑞 比爾得
卡洛斯 羅伯多 西丹諾
漢諾羅爾 李廷爵
艾瑞克 波格司戴特
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哈尼威爾國際公司
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    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5018Halogenated solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5022Organic solvents containing oxygen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5027Hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5036Azeotropic mixtures containing halogenated solvents
    • C11D7/5068Mixtures of halogenated and non-halogenated solvents
    • C11D7/5077Mixtures of only oxygen-containing solvents
    • C11D7/5081Mixtures of only oxygen-containing solvents the oxygen-containing solvents being alcohols only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/028Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing halogenated hydrocarbons
    • C23G5/02809Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing halogenated hydrocarbons containing chlorine and fluorine
    • C23G5/02812Perhalogenated hydrocarbons
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • C11D2111/14
    • C11D2111/46
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/24Hydrocarbons
    • C11D7/248Terpenes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/261Alcohols; Phenols
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/263Ethers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/28Organic compounds containing halogen
    • C11D7/30Halogenated hydrocarbons
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

The present invention relates, in part, to compositions that include (a) a first component comprising an alcohol, (b) a second component selected from the group consisting of a glycol ether, a terpene, a halogenated hydrocarbon, and combinations thereof, (c) a third component selected from the group consisting of a hydrohaloether, a decahalopentane, and combinations thereof.

Description

溶劑氣相脫脂及去焊組合物、方法、裝置及系統 Solvent vapor phase degreasing and desoldering composition, method, device and system 相關申請案之交叉參考 Cross-reference to related applications

本申請案主張2014年4月11日申請及2015年1月30日申請之同在申請中的臨時專利申請案第61/978,278號及62/110,037號之權利,各自以引用的方式併入本文中。 The present application claims the benefit of the Provisional Patent Application Nos. 61/978,278 and 62/110,037, filed on Apr. 11, 2014, the entire disclosure of which is hereby incorporated by reference. in.

一般而言,本發明係關於用於基板材料之氣相脫脂及去焊之組合物,尤其溶劑或清潔組合物;及溶劑清潔方法、裝置及系統。 In general, the present invention relates to compositions for vapor phase degreasing and desoldering of substrate materials, particularly solvents or cleaning compositions; and solvent cleaning methods, apparatus and systems.

溶劑氣相脫脂及去焊為一種將油污基板(例如,印刷電路板或金屬製品、玻璃、陶瓷、塑膠或彈性體部件或複合材料)浸沒於諸如某些氯碳化物或氯氟碳化物流體或混合物之沸騰液體中,之後在第二貯槽或清潔區中用與用於第一清潔區中之氯碳化物或氯氟碳化物相同之清潔溶劑藉由浸沒或餾出物噴霧沖洗該部件之方法。隨後,藉由在冷凝蒸氣中維持經冷卻之部件直至溫度達至平衡來乾燥該等部件。 Solvent vapor phase degreasing and desoldering is the immersion of oily substrates (eg, printed circuit boards or metal articles, glass, ceramic, plastic or elastomeric components or composites) such as certain chlorocarbon or chlorofluorocarbon fluids or Method of rinsing the component by immersion or distillate spray in a boiling liquid of the mixture, followed by a cleaning solvent in the second storage tank or cleaning zone using the same cleaning solvent as the chlorocarbon or chlorofluorocarbon used in the first cleaning zone . The components are then dried by maintaining the cooled components in the condensed vapor until the temperature reaches equilibrium.

各種類型部件之溶劑清潔一般在分批、吊車輔助分批、傳送帶分批或內嵌型傳送帶脫脂器及去焊器設備中進行。該等內嵌傳送帶脫脂器及去焊器設備揭示於美國專利第5,007,179號(題目為「Cold Air Lock Vapor Seal」)中,共同轉讓予本發明之受讓人。部件亦可在敞頂去焊或脫脂設備中清潔,諸如揭示於1990年9月25日申請之美國專利 申請案第07/587,893號(現美國專利第5,075,982號)中,亦共同轉讓。在兩種類型設備中,設備之入口及/或出口端一般與周圍環境及設備內之溶劑敞開連通。為使藉由對流或擴散而自設備之溶劑耗損最小化,此項技術中之慣例為使用經水冷卻或經製冷劑冷卻之旋管,其在脫脂器/去焊器貯槽之熱或環境區中產生蒸氣覆蓋層(vapor blanket),諸如Rand之美國專利第4,261,111號中揭示,該專利以引用的方式併入本文中。 Solvent cleaning of various types of components is typically carried out in batch, crane assisted batch, conveyor batch or inline conveyor degreaser and defluxing equipment. The in-line conveyor degreaser and the de-soldering apparatus are disclosed in U.S. Patent No. 5,007,179, entitled "Cold Air Lock Vapor Seal", assigned to the assignee of the present invention. Parts can also be cleaned in open top de-soldering or degreasing equipment, such as the US patents filed on September 25, 1990. Application No. 07/587,893 (now U.S. Patent No. 5,075,982) is also commonly assigned. In both types of equipment, the inlet and/or outlet ends of the equipment are typically in open communication with the surrounding environment and the solvent within the equipment. In order to minimize solvent loss from equipment by convection or diffusion, it is customary in the art to use water cooled or refrigerant cooled coils in the heat or environmental zone of the degreaser/desolder tank. A vapor blanket is produced, as disclosed in U.S. Patent No. 4,261,111, the disclosure of which is incorporated herein by reference.

因此,在前述溶劑氣相脫脂方法中,一般已知使用單個有機氯碳化物或氯氟碳化物(CFC)流體來執行清潔、沖洗及乾燥步驟。在過去,尤其風行使用CFC-113及氟利昂(Freon)類溶劑。然而,已暗指其蒸氣擴散入環境為平流層臭氧之非所需全球耗竭之許多可能的促成原因之一。 Therefore, in the aforementioned solvent vapor phase degreasing method, it is generally known to perform a cleaning, rinsing, and drying step using a single organic chlorocarbon or chlorofluorocarbon (CFC) fluid. In the past, CFC-113 and Freon-based solvents were particularly popular. However, it has been implied that one of the many possible causes of the undesired global depletion of vapor diffusion into the environment as stratospheric ozone.

回應於環境問題,已發展某些基於氫氯氟碳化物(HCFC)之溶劑以向基於CFC之氣相脫脂及去焊方法提供更加環境可接受之替代物。雖然此等材料已在多種清潔應用中展示為預先使用之CFC材料的極佳取代物,但其僅被認為係彼等CFC之臨時替代物。在很大程度上,此係由於以下事實:所提議之材料仍具有較小、但有限的臭氧耗竭潛能,但比其替代之CFC的臭氧耗竭潛能小得多。因此,亦提議在未來全球逐步停止使用此等某些HCFC溶劑。一般咸信不含氯、溴或碘原子之有機溶劑將具有不導致平流層臭氧耗竭之趨勢。然而,不含上述鹵素原子之許多有機化學物質,諸如烴、醇、酯、醚、酮等,有時將含有非所需的可燃性或反應性特性。此外,已知某些全氟、飽和烴及氫氟碳具有許多所需的溶劑特性,諸如:零臭氧耗竭潛能;穩定、非反應性、與塑膠之高相容性;良好水置換潛能;一般無毒且惰性;及理想地適合於氣相溶劑清潔設備。然而,已發現許多該等全氟化碳對於許多常見有機及無機污物(例如,熔劑)為極差溶劑。雖然某些氫氟 碳可提供優於全氟化碳之改進但仍受限的清潔能力,但一直關注的問題是該等材料將展現類似於其烴類似物之非所需可燃性特性。 In response to environmental issues, certain hydrochlorofluorocarbon (HCFC)-based solvents have been developed to provide a more environmentally acceptable alternative to CFC-based gas phase degreasing and desoldering methods. While these materials have been shown to be excellent replacements for pre-used CFC materials in a variety of cleaning applications, they are only considered to be temporary replacements for their CFCs. To a large extent, this is due to the fact that the proposed material still has a small but limited ozone depletion potential, but is much less than the ozone depletion potential of its alternative CFC. Therefore, it is also proposed to phase out the use of some of these HCFC solvents in the future. It is generally believed that organic solvents that do not contain chlorine, bromine or iodine atoms will have a tendency to not cause depletion of stratospheric ozone. However, many organic chemicals, such as hydrocarbons, alcohols, esters, ethers, ketones, and the like, which do not contain the above halogen atoms, sometimes contain undesired flammability or reactivity characteristics. In addition, certain perfluorinated, saturated hydrocarbons and hydrofluorocarbons are known to have many desirable solvent characteristics, such as: zero ozone depletion potential; stable, non-reactive, high compatibility with plastics; good water exchange potential; generally non-toxic and Inert; and ideally suited for gas phase solvent cleaning equipment. However, many such perfluorocarbons have been found to be extremely poor solvents for many common organic and inorganic soils (e.g., fluxes). Although some hydrofluoric Carbon can provide improved but still limited cleaning capabilities over perfluorocarbons, but the concern has been that such materials will exhibit undesired flammability characteristics similar to their hydrocarbon analogs.

1991年6月12日公開之歐洲專利公開案0 431 458教示適用作清潔組合物之式CnFmH2n+2-m脂族氫氟碳,其中4≦n≦6且6≦m≦12。該參考文獻教示脂族氫氟碳為自油污部件移除熔劑、脂肪及油及灰塵中之活性組分。該參考文獻教示:為增加溶解熔劑之溶解力,可以各種量將選自烴、醇、酯及酮之有機溶劑添加至脂族氫氟碳中。 European Patent Publication No. 0 431 458, issued June 12, 1991, teaches the application of the formula C n F m H 2n+2-m aliphatic hydrofluorocarbons, of which 4≦n≦6 and 6≦m≦ 12. This reference teaches that aliphatic hydrofluorocarbons are active components in fluxes, fats, and oils and dusts that are removed from oily components. This reference teaches that in order to increase the solubility of the dissolved flux, an organic solvent selected from the group consisting of hydrocarbons, alcohols, esters and ketones can be added to the aliphatic hydrofluorocarbon in various amounts.

存在其他類型之清潔方法,諸如水清潔。水清潔一般涉及在清潔劑或界面活性劑之水溶液中清潔基板或部件,之後用純化水多次沖洗之步驟。隨後,藉由在空氣中超長蒸發或藉由能量密集型熱乾燥機來乾燥該部件。由於用於乾燥之高能源成本及提供由州及當局要求的在排污至地下水前之廢水溶液清除的額外資金投資及操作成本負擔,此方法並不總是合乎需要的。 There are other types of cleaning methods, such as water cleaning. Water cleaning generally involves the step of cleaning the substrate or component in an aqueous solution of a cleaning agent or surfactant followed by multiple rinses with purified water. The part is then dried by ultra-long evaporation in air or by an energy intensive heat dryer. This approach is not always desirable due to the high energy costs for drying and the additional capital investment and operating cost burdens required by the state and authorities to remove wastewater solutions prior to discharge to groundwater.

另一清潔方法(半水清潔)由以下組成:在具有或不具有表面活性劑輔助之情況下,在基於例如對自部件清潔之油、蠟及油脂具有高親和力之萜、酯或石油餾出物的烴溶劑中清潔基板。使用純化水,在高沸點烴溶劑中用多次沖洗步驟沖洗經清潔之基板。使烴溶劑相分離回洗滌聚水坑,同時在排污至地下水之前必須處理污水。因此,與乾燥能源及處理廢液有關之高成本顯而易見,類似於先前提及之水清潔方法。另一缺點為烴溶劑通常具有閃點,且此必須經謹慎處理或用不可燃的壓縮氣體(諸如氮氣)覆蓋以避免爆炸。氮氣比冷凝區中所含之碳氟化合物之密集蒸氣更短效。此外,在許多應用中,雖然待清潔之基板可與烴溶劑相容,但一些塑膠或金屬可與水性沖洗溶劑不相容,導致基板之吸水或生銹。 Another cleaning method (half-water cleaning) consists of distilling, ester or petroleum distillation with high affinity based on, for example, oils, waxes and greases cleaned from the parts, with or without surfactant assistance. The substrate is cleaned in a hydrocarbon solvent. The cleaned substrate is rinsed with a plurality of rinsing steps in a high boiling hydrocarbon solvent using purified water. The hydrocarbon solvent phase is separated back into the wash puddle while the sewage must be treated before it is drained to groundwater. Therefore, the high costs associated with drying energy and treating waste liquids are evident, similar to the previously mentioned water cleaning methods. Another disadvantage is that hydrocarbon solvents typically have a flash point and this must be handled with care or covered with a non-combustible compressed gas such as nitrogen to avoid explosion. Nitrogen is less effective than the dense vapor of fluorocarbons contained in the condensing zone. In addition, in many applications, although the substrate to be cleaned can be compatible with hydrocarbon solvents, some plastics or metals can be incompatible with aqueous rinse solvents, resulting in water absorption or rusting of the substrate.

在本發明之第一態樣中,提供溶劑清潔組合物,其包括(a)第一 組分,包含選自由甲醇、乙醇及異丙醇組成之群的醇;(b)第二組分,選自由二醇醚、萜、鹵化烴及其組合組成之群;及(c)第三組分,選自由氫氟碳(鹵化烴第二組分除外)、氫鹵醚、十鹵戊烷及其組合組成之群,其中第二組分與第三組分不相同。在其他態樣中,第三組分以與第一組分之至少一種醇形成共沸物或共沸物狀組合物之有效量提供。 In a first aspect of the invention, there is provided a solvent cleaning composition comprising (a) a first a component comprising an alcohol selected from the group consisting of methanol, ethanol, and isopropanol; (b) a second component selected from the group consisting of glycol ethers, hydrazines, halogenated hydrocarbons, and combinations thereof; and (c) third The component is selected from the group consisting of hydrofluorocarbons (other than the halogenated hydrocarbon second component), hydrohaloethers, decahalopentan, and combinations thereof, wherein the second component is different from the third component. In other aspects, the third component is provided in an amount effective to form an azeotrope or azeotrope-like composition with at least one alcohol of the first component.

在本發明之此第一態樣之某些實施例中,第二組分(b)包括鹵化烴,其較佳以本文中所描述之相對量提供。鹵化烴較佳包括由一(1)至十(10)個碳原子組成之化合物,其較佳包含或在一些實施例中由C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚及C5至C7環烯基組成,該等化合物經選自F、Cl、Br或I之至少一種鹵素取代。在某些實施例中,鹵化烴經至少一個Cl取代。在某些較佳實施例中,鹵化烴包含、基本上由或由反-1,2-二氯乙烯、過氯乙烯、三氯乙烯及其組合組成。 In certain embodiments of this first aspect of the invention, the second component (b) comprises a halogenated hydrocarbon, which is preferably provided in the relative amounts described herein. The halogenated hydrocarbon preferably comprises a compound consisting of one (1) to ten (10) carbon atoms, which preferably comprises or in some embodiments from a C 1 to C 8 alkyl group, a C 1 to C 8 alkenyl group, C a 1 to C 8 alcohol group, a C 1 to C 10 ether, and a C 5 to C 7 cycloalkenyl group, the compounds being substituted with at least one halogen selected from the group consisting of F, Cl, Br or I. In certain embodiments, the halogenated hydrocarbon is substituted with at least one Cl. In certain preferred embodiments, the halogenated hydrocarbon comprises, consists essentially of, or consists of trans-1,2-dichloroethylene, perchloroethylene, trichloroethylene, and combinations thereof.

在本發明之第一態樣之某些實施例中,第二組分(b)包括二醇醚,其較佳以本文中所描述之量提供。較佳實施例中之二醇醚包括結構R'O-R-OR',其中R選自C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚基、C5至C7環烷基、C5至C7環烯基、C5至C7雜環烷基及C5至C7雜環烯基,且各R'獨立地選自H、C1至C8烷基、C1至C8烯基、C1至C8醇基或C1至C10醚基、C5至C7環烷基、C5至C7環烯基、C5至C7雜環烷基及C5至C7雜環烯基。在某些實施例中,R為C1-C4烷基。在其他實施例中,二醇醚為根據結構R'-O-(CH2)2-O-R'之化合物,其中至少一個R'為H,且另一R'選自由C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚及C5至C7環烯基組成之群。在甚至其他實施例中,二醇醚選自由以下組成之群:乙二醇單丁醚、2-乙氧基乙醇、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必 醇、卡必醇溶纖劑、二乙氧基乙烷、二甲氧基乙烷、二丁氧基丁烷、二丙二醇甲醚、二丙二醇單正丁醚、二丙二醇單甲醚乙酸酯、丙二醇單甲醚、丙二醇單甲醚乙酸酯及/或丙二醇苯基醚。 In certain embodiments of the first aspect of the invention, the second component (b) comprises a glycol ether, which is preferably provided in the amounts described herein. The glycol ether in the preferred embodiment comprises the structure R'OR-OR' wherein R is selected from the group consisting of C 1 to C 8 alkyl, C 1 to C 8 alkenyl, C 1 to C 8 alcohol, C 1 to C a 10- ether group, a C 5 to C 7 cycloalkyl group, a C 5 to C 7 cycloalkenyl group, a C 5 to C 7 heterocycloalkyl group, and a C 5 to C 7 heterocycloalkenyl group, and each R′ is independently selected from the group consisting of H, C 1 to C 8 alkyl, C 1 to C 8 alkenyl, C 1 to C 8 alcohol or C 1 to C 10 ether, C 5 to C 7 cycloalkyl, C 5 to C 7 cycloalkenyl a C 5 to C 7 heterocycloalkyl group and a C 5 to C 7 heterocycloalkenyl group. In certain embodiments, R is a C 1 -C 4 alkyl. In other embodiments, the glycol ether is a compound according to the structure R'-O-(CH 2 ) 2 -O-R' wherein at least one R' is H and the other R' is selected from C 1 to C 8 A group consisting of an alkyl group, a C 1 to C 8 alkenyl group, a C 1 to C 8 alcohol group, a C 1 to C 10 ether, and a C 5 to C 7 cycloalkenyl group. In even other embodiments, the glycol ether is selected from the group consisting of ethylene glycol monobutyl ether, 2-ethoxyethanol, 2-methoxyethanol, 2-propoxyethanol, 2-phenoxy Ethanol, 2-benzylideneoxyethanol, methyl carbitol, carbitol cellosolve, diethoxyethane, dimethoxyethane, dibutoxybutane, dipropylene glycol methyl ether, Dipropylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and/or propylene glycol phenyl ether.

在本發明之第一態樣之某些實施例中,第二組分包括萜,其較佳以本文中所揭示之量提供。雖然萜可為本文中所提供之萜中之任一者或組合,但在某些態樣中萜包含、基本上由或由d-檸檬烯及/或蒎烯組成。 In certain embodiments of the first aspect of the invention, the second component comprises hydrazine, which is preferably provided in the amounts disclosed herein. Although hydrazine may be any one or combination of the oximes provided herein, in some aspects 萜 comprises, consists essentially of, or consists of d-limonene and/or decene.

在本發明之第一態樣之某些實施例中,第三組分較佳包含氫鹵醚(hydrohaloether)。在某些態樣中,氫鹵醚具有結構R-O-R',其中R及R'各自獨立地選自由C1至C20烷基、C1至C20烯基、C1至C20醇基、C1至C20醚基、C5至C7環烷基、C5至C7環烯基、C5至C7雜環烷基及C5至C7雜環烯基組成之群,其中R及/或R'中之至少一者在一或多個位置處經鹵素原子取代。在某些較佳實施例中,氫鹵醚為氫氟醚,其中在某些實施例中其具有或包括結構CH2OCF2CF2CF2CF3。較佳地,包括且較佳為氫鹵醚組分之第三組分以組合物之組分(a)、組分(b)及組分(c)之總量計,以約25重量%至約99重量%之量,在某些實施例中以約50重量%至約99重量%之量,在某些實施例中以約75重量%至約99重量%之量,在某些實施例中以約90重量%至約99重量%之量,且在某些實施例中以約92重量%至約96重量%之量存在於組合物中。 In certain embodiments of the first aspect of the invention, the third component preferably comprises a hydrohaloether. In certain aspects, hydrohalic ethers having the structure RO-R ', wherein R and R' are each independently selected from the group consisting of a C 1 to C 20 alkyl group, C 1 to C 20 alkenyl groups, C 1 to C 20 alcohol a group of C 1 to C 20 ether groups, C 5 to C 7 cycloalkyl groups, C 5 to C 7 cycloalkenyl groups, C 5 to C 7 heterocycloalkyl groups, and C 5 to C 7 heterocycloalkenyl groups, Wherein at least one of R and/or R' is substituted with a halogen atom at one or more positions. In certain preferred embodiments, the hydrohalide ether is a hydrofluoroether, wherein in certain embodiments it has or includes the structure CH 2 OCF 2 CF 2 CF 2 CF 3 . Preferably, the third component comprising, and preferably the hydrohalide component, is about 25% by weight based on the total of component (a), component (b) and component (c) of the composition. To an amount of about 99% by weight, in certain embodiments from about 50% to about 99% by weight, and in certain embodiments from about 75% to about 99% by weight, in certain embodiments The amount is present in the composition in an amount from about 90% to about 99% by weight, and in some embodiments from about 92% to about 96% by weight.

在本發明之第一態樣之某些實施例中,第三組分較佳包括十鹵戊烷(decahalopentane),其在某些較佳實施例中為十氟戊烷。在較佳實施例中,十氟戊烷包含、基本上由以下組成或選自由以下組成之群:1,1,1,2,3,4,4,5,5,5-十氟戊烷、1,1,1,2,2,3,4,5,5,5-十氟戊烷及/或1,1,1,2,3,3,4,5,5,5-十氟戊烷。十鹵戊烷較佳以組合物之組分(a)、組分(b)及組分(c)之總量計以約30重量%至約99重量%之量,在某些實施例中以約50重量%至約99重量%之量,在某些實施例中以約70重量%至 約99重量%之量,在某些實施例中以約90重量%至約99重量%之量,且在某些實施例中以約92重量%至約96重量%之量提供。 In certain embodiments of the first aspect of the invention, the third component preferably comprises a decahalopentane, which in certain preferred embodiments is decafluoropentane. In a preferred embodiment, decafluoropentane comprises, consists essentially of, or is selected from the group consisting of: 1,1,1,2,3,4,4,5,5,5-decafluoropentane 1,1,1,2,2,3,4,5,5,5-decafluoropentane and/or 1,1,1,2,3,3,4,5,5,5-decafluoro Pentane. Decanepentane is preferably present in an amount of from about 30% to about 99% by weight based on the total of component (a), component (b) and component (c) of the composition, in certain embodiments In an amount from about 50% to about 99% by weight, in some embodiments from about 70% to about An amount of about 99% by weight, in certain embodiments, is from about 90% to about 99% by weight, and in certain embodiments from about 92% to about 96% by weight.

在本發明之第二態樣中,提供溶劑清潔組合物,其包括(i)1-氯-3,3,3-三氟丙烯;及(ii)至少一種第二組分,其與第一態樣之第二組分相同且以關於第一態樣所描述者相同之濃度存在。在此第二態樣之某些實施例中,組分(i)包含基本上由1-氯-3,3,3-三氟丙烯及醇組成之共沸物或共沸物狀組合物,該醇選自由甲醇、乙醇及異丙醇組成之群,且在該等實施例中,組分(i)及組分(ii)較佳不形成分離共沸物。 In a second aspect of the invention, there is provided a solvent cleaning composition comprising (i) 1-chloro-3,3,3-trifluoropropene; and (ii) at least one second component, in combination with the first The second component of the aspect is identical and is present in the same concentration as described for the first aspect. In certain embodiments of this second aspect, component (i) comprises an azeotrope or azeotrope-like composition consisting essentially of 1-chloro-3,3,3-trifluoropropene and an alcohol, The alcohol is selected from the group consisting of methanol, ethanol and isopropanol, and in these embodiments, component (i) and component (ii) preferably do not form a separation azeotrope.

本發明之組合物可以可噴塗組合物、溶劑或霧劑之形式使用。在某些非限制性態樣中,該等組合物可用於自部件移除殘餘污物或表面污染之方法中。此類方法可包括將部件浸沒於本發明之溶劑組合物中。在某些實施例中,較佳提供本發明之溶劑組合物,且隨後加熱該組合物以形成包含組分(a)或組分(i)且實質性不存在第二組分(b)之可燃性抑制覆蓋層。隨後,較佳在可燃性抑制覆蓋層內乾燥該部件。 The compositions of the present invention can be used in the form of sprayable compositions, solvents or mists. In certain non-limiting aspects, the compositions can be used in a method of removing residual dirt or surface contamination from a component. Such methods can include immersing the component in the solvent composition of the present invention. In certain embodiments, it is preferred to provide a solvent composition of the present invention and subsequently heat the composition to form a component comprising either component (a) or component (i) and substantially no second component (b) Flammability suppression coating. Subsequently, the part is preferably dried in a flammability suppressing cover layer.

如本文中所使用,術語可燃性抑制覆蓋層意謂含有不具有根據ASTM E-681-09量測之燃燒極限之氣體的蒸氣空間,ASTM E-681-09以引用的方式併入本文中。 As used herein, the term flammability inhibiting cover layer means a vapor space containing a gas that does not have a combustion limit as measured according to ASTM E-681-09, which is incorporated herein by reference.

為輔助蒸氣覆蓋層之形成,第二組分之沸點可比:(1)在第一態樣之情況下,第一組分及第三組分(a)及(c)及/或其間形成之任何共沸物或共沸物狀組合物;及(2)在第二態樣之情況下,組分(i)(即1-氯-3,3,3-三氟丙烯)及/或1-氯-3,3,3-三氟丙烯與醇(若存在)(尤其甲醇、乙醇及異丙醇)之間形成的任何共沸物或共沸物狀組合物之沸點至少高10℃,在某些態樣中至少高25℃,且在其他態樣中至少高50℃ To aid in the formation of the vapor coating layer, the boiling point of the second component can be compared: (1) in the case of the first aspect, the first component and the third component (a) and (c) and/or formed therebetween Any azeotrope or azeotrope-like composition; and (2) in the second aspect, component (i) (i.e., 1-chloro-3,3,3-trifluoropropene) and/or 1 - the boiling point of any azeotrope or azeotrope-like composition formed between -chloro-3,3,3-trifluoropropene and an alcohol (if present), especially methanol, ethanol and isopropanol, is at least 10 ° C higher, At least 25 ° C in some cases and at least 50 ° C in other aspects

基於所提供之揭示內容,本發明之額外實施例及優勢將為顯而易見的。 Additional embodiments and advantages of the invention will be apparent from the disclosure.

5‧‧‧容器 5‧‧‧ Container

10‧‧‧聚水坑 10 ‧ ‧ puddle

18‧‧‧噴霧流 18‧‧‧ spray stream

20‧‧‧聚水坑 20‧‧ ‧ puddle

30‧‧‧聚水坑 30‧‧ ‧ puddle

35A‧‧‧聚水坑壁 35A‧‧ ‧ puddle wall

35B‧‧‧聚水坑壁 35B‧‧ ‧ puddle wall

40‧‧‧加熱器元件/加熱器 40‧‧‧heater element/heater

45‧‧‧蒸氣區 45‧‧‧Steam zone

50‧‧‧旋管 50‧‧‧ coil

50A‧‧‧上旋管 50A‧‧‧Upper coil

50B‧‧‧下旋管 50B‧‧‧ lower coil

圖1說明可用於本發明之一個實施例中之脫脂或去焊設備的部分示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates a partial schematic view of a degreasing or desoldering apparatus that can be used in one embodiment of the present invention.

根據本發明之第一態樣之某些實施例,較佳組合物,尤其溶劑或清潔組合物,包括(a)第一組分,基本上由或由一或多種醇組成;(b)第二組分,選自由二醇醚、萜及/或鹵化烴(十鹵戊烷除外)組成之群;及(c)第三組分,選自由氫氟碳、鹵化醚及/或十鹵戊烷組成之群,其中第二組分(b)及第三組分(c)不相同。在某些態樣中,第二組分(b)為沸點大於第一組分(a)或第三組分(c)之沸點之溶劑。在其他態樣中,第二組分(b)不與第一組分(a)及第三組分(c)中之任一者或兩者形成共沸物或共沸物狀組合物(或以不形成共沸物或共沸物狀組合物之量提供)。 According to some embodiments of the first aspect of the present invention, a preferred composition, particularly a solvent or cleaning composition, comprising (a) a first component consisting essentially of or consisting of one or more alcohols; (b) a two component selected from the group consisting of glycol ethers, hydrazines and/or halogenated hydrocarbons (except decahalopentan); and (c) third component selected from the group consisting of hydrofluorocarbons, halogenated ethers and/or decahalides A group of alkane compositions in which the second component (b) and the third component (c) are different. In some aspects, the second component (b) is a solvent having a boiling point greater than the boiling point of the first component (a) or the third component (c). In other aspects, the second component (b) does not form an azeotrope or azeotrope-like composition with either or both of the first component (a) and the third component (c) ( Or provided in an amount that does not form an azeotrope or azeotrope-like composition).

在本發明之第二態樣之某些實施例中,組合物,尤其溶劑或清潔組合物,較佳包括僅具有1-氯-3,3,3-三氟丙烯(HCFO-1233zd)或呈與醇之共沸物或共沸物狀組合物形式之第一組分,及如本文中關於第一態樣所描述之第二組分(b)。在該等實施例中,第二組分(b)較佳為沸點大於組合物或如本文中所描述在HCFO-1233zd與醇之間形成的任何共沸或共沸物狀組合物中所包括之HCFO-1233zd(無論順式或反式異構體或其組合)之沸點的溶劑。在其他態樣中,第二組分(b)不與HCFO-1233zd及/或醇形成共沸物或共沸物狀組合物(或以不形成共沸物或共沸物狀組合物之量提供)。 In certain embodiments of the second aspect of the invention, the composition, especially the solvent or cleaning composition, preferably comprises only 1-chloro-3,3,3-trifluoropropene (HCFO-1233zd) or a first component in the form of an azeotrope or azeotrope-like composition with an alcohol, and a second component (b) as described herein with respect to the first aspect. In such embodiments, the second component (b) preferably comprises a boiling point greater than the composition or any azeotrope or azeotrope-like composition formed between HCFO-1233zd and the alcohol as described herein. A solvent for the boiling point of HCFO-1233zd (whether cis or trans isomer or a combination thereof). In other aspects, the second component (b) does not form an azeotrope or azeotrope-like composition with HCFO-1233zd and/or an alcohol (or an amount that does not form an azeotrope or azeotrope-like composition) provide).

本發明之組合物尤其有利於作為自基板移除非所需殘渣,諸如自印刷電路板移除焊接熔劑或其他殘餘物,或自金屬或非金屬部件移除石油、基於合成或半合成之油或油脂之溶劑。特定言之,該等組合物作為冷清潔劑或作為噴霧(例如霧劑噴霧)有利地用於蒸氣脫脂機(尤其多聚水坑機)中。 The compositions of the present invention are particularly advantageous for removing undesirable residues from the substrate, such as removing solder flux or other residues from printed circuit boards, or removing petroleum, metal based or synthetic or semi-synthetic oils from metal or non-metallic components. Or a solvent for oils and fats. In particular, the compositions are advantageously used as a cold cleaner or as a spray (e.g., a spray of aerosol) in a vapor degreaser (especially in a polyfluring machine).

組分Component 組分(a)及組分(i)Component (a) and component (i)

術語「HCFO-1233zd」係指化合物1-氯-3,3,3-三氟丙烯,與其是否為順式形式或反式形式無關。術語「順-HCFO-1233zd」及「反-HCFO-1233zd」分別用於描述1-氯-3,3,3-三氟丙烯之順式形式及反式形式。因此,術語「HCFO-1233zd」在其範疇內包括順-HFCO-1233zd、反-HCFO-1233zd及此等之所有組合及混合物。 The term "HCFO-1233zd" refers to the compound 1-chloro-3,3,3-trifluoropropene regardless of whether it is in the cis form or the trans form. The terms "cis-HCFO-1233zd" and "trans-HCFO-1233zd" are used to describe the cis form and the trans form of 1-chloro-3,3,3-trifluoropropene, respectively. Thus, the term "HCFO-1233zd" includes within its scope cis-HFCO-1233zd, anti-HCFO-1233zd, and all combinations and mixtures thereof.

術語「順-HCFO-1233zd」意謂相對於HCFO-1233zd之所有異構體的順-HCFO-1233zd量為至少約95%,更佳至少約98%,甚至更佳至少約99%,甚至更佳至少約99.9%。在某些較佳實施例中,順-HCFO-1233zd組分為基本上純的順-HCFO-1233zd。 The term "cis-HCFO-1233zd" means that the amount of cis-HCFO-1233zd relative to all isomers of HCFO-1233zd is at least about 95%, more preferably at least about 98%, even more preferably at least about 99%, and even more. Good at least about 99.9%. In certain preferred embodiments, the cis-HCFO-1233zd component is substantially pure cis-HCFO-1233zd.

術語「反-HCFO-1233zd」意謂相對於HCFO-1233zd之所有異構體的反-HCFO-1233zd量為至少約95%,更佳至少約98%,甚至更佳至少約99%,甚至更佳至少約99.9%。在某些較佳實施例中,反-HCFO-1233zd組分為基本上純的反-HCFO-1233zd。 The term "trans-HCFO-1233zd" means that the amount of trans-HCFO-1233zd relative to all isomers of HCFO-1233zd is at least about 95%, more preferably at least about 98%, even more preferably at least about 99%, and even more. Good at least about 99.9%. In certain preferred embodiments, the trans-HCFO-1233zd component is substantially pure trans-HCFO-1233zd.

醇可指具有醇基連接於其中之任何組分。在某些非限制性實施例中,醇包括C1-C3醇,且在某些較佳實施例中,醇包含甲醇、乙醇或異丙醇中之至少一者。 An alcohol may refer to any component having an alcohol group attached thereto. In certain non-limiting embodiments, the alcohol comprises a C 1 -C 3 alcohol, and in certain preferred embodiments, the alcohol comprises methanol, ethanol or isopropanol is at least one.

組分(b)Component (b)

如本文中所使用,術語「二醇醚」係指基於烷二醇之烷基醚之一類溶劑化合物。在某些非限制性態樣中,其可由具有結構R'O-R-OR'之式I表示,其中R選自C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚基、C5至C7環烷基、C5至C7環烯基、C5至C7雜環烷基或C5至C7雜環烯基,其中前述中之任一者(若適用)可為直鏈或分支鏈且視情況可在一或多個位置處經取代。各R'獨立地選自H、C1至C8烷基、C1至C8烯基、C1至C8醇基或C1至C10醚基、C5至C7環烷基、C5至C7環 烯基、C5至C7雜環烷基或C5至C7雜環烯基,其中前述中之任一者(若適用)可為直鏈或分支鏈且可視情況在一或多個位置處經取代。在某些態樣中,至少一個R'不為H。 As used herein, the term "glycol ether" refers to a solvent compound of one of the alkyl ethers based on alkylene glycols. In certain non-limiting Formula aspects, which may be the structure having R'OR-OR 'of the I, wherein R is selected from a C 1 to C 8 alkyl group, a C 1 to C 8 alkenyl group, a C 1 to C 8 An alcohol group, a C 1 to C 10 ether group, a C 5 to C 7 cycloalkyl group, a C 5 to C 7 cycloalkenyl group, a C 5 to C 7 heterocycloalkyl group or a C 5 to C 7 heterocycloalkenyl group, wherein Any of the foregoing (if applicable) may be straight or branched and may optionally be substituted at one or more positions. Each R' is independently selected from H, C 1 to C 8 alkyl, C 1 to C 8 alkenyl, C 1 to C 8 alcohol or C 1 to C 10 ether, C 5 to C 7 cycloalkyl, C 5 to C 7 cycloalkenyl, C 5 to C 7 heterocycloalkyl or C 5 to C 7 heterocycloalkenyl, wherein any of the foregoing (if applicable) may be straight or branched and may be optionally Substituted at one or more locations. In some aspects, at least one R' is not H.

在前述之某些實施例中,R為C1-C5直鏈或分支鏈烷基部分且形成烷基醚之烷二醇。在某些態樣中,R為C2-C4直鏈或分支鏈烷基部分。在前述之甚至其他實施例中,R為乙基部分且形成乙烯醚之烷二醇且具有結構R'-O-(CH2)2-O-R'。各R'可如上文所指示定義。在某些態樣中,其包括至少一個C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚或C5至C7環烯基,其中任一者可為直鏈或分支鏈(若可適用)及/或視情況在一或多個位置處經取代。在甚至其他實施例中,至少一個R'為H,且第二個R'包括至少一個C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚或C5至C7環烯基,其中任一者可為直鏈或分支鏈或視情況在一或多個位置處經取代。在某些較佳實施例中,二醇醚選自以下各者中之一者或組合:乙二醇單丁醚(亦稱作「丁基溶纖劑」)、2-乙氧基乙醇(亦稱為「乙基溶纖劑」)、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必醇、2-(2-乙氧基乙氧基)乙醇(亦稱為「卡必醇溶纖劑」)、二乙氧基乙烷、二甲氧基乙烷、二丁氧基丁烷、二丙二醇甲醚、二丙二醇單正丁醚、二丙二醇單甲醚乙酸酯、丙二醇單甲醚、丙二醇單甲醚乙酸酯及/或丙二醇苯基醚。 In certain embodiments of the foregoing embodiments, R is a C 1 -C 5 straight or branched alkyl moiety and alkyl ethers of alkylene glycols is formed. In certain aspects, R is a C 2 -C 4 linear or branched alkyl moiety. In even other embodiments of the foregoing embodiments, R is ethyl and forming a portion of a vinyl ether and an alkylene glycol having the structure R'-O- (CH 2) 2 -O-R '. Each R' can be as defined above. In certain aspects, it includes at least one C 1 to C 8 alkyl group, a C 1 to C 8 alkenyl group, a C 1 to C 8 alcohol group, a C 1 to C 10 ether or a C 5 to C 7 cycloalkenyl group. Any of these may be linear or branched (if applicable) and/or substituted at one or more locations as appropriate. Even in this embodiment, other embodiments at least one R 'is H, and the second R' comprises at least one C 1 to C 8 alkyl group, a C 1 to C 8 alkenyl group, a C 1 to C 8 alcohol, a C 1 to C 10 ether or C 5 to C 7 cycloalkenyl, any of which may be straight or branched or, as the case may be, substituted at one or more positions. In certain preferred embodiments, the glycol ether is selected from one or a combination of ethylene glycol monobutyl ether (also known as "butyl cellosolve"), 2-ethoxyethanol (also known as "Ethyl cellosolve"), 2-methoxyethanol, 2-propoxyethanol, 2-phenoxyethanol, 2-benzylideneoxyethanol, methylcarbitol, 2-(2 -ethoxyethoxy)ethanol (also known as "carbitol alcohol cellosolve"), diethoxyethane, dimethoxyethane, dibutoxybutane, dipropylene glycol methyl ether, two Propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and/or propylene glycol phenyl ether.

如本文中所使用,術語「萜」意謂包含至少十個碳原子且含有至少一個且較佳至少兩個異戊二烯部分之化合物。在許多較佳實施例中,本發明之萜化合物由至少兩個異戊二烯C5單元(CH2=C(CH3)-CH=CH2)(各單元經取代或未經取代)之反應而形成,且因此許多本發明之萜化合物較佳具有至少10個碳原子且包括至少一個異戊二烯部分。如本文中所使用,術語「異戊二烯部分」係指包括自由基之分子 之任何部分,其可由經取代或未經取代之異戊二烯形成。在某些較佳實施例中,未經取代之萜為較佳。 As used herein, the term "萜" means a compound comprising at least ten carbon atoms and containing at least one and preferably at least two isoprene moieties. In many preferred embodiments, the indole compound of the present invention is composed of at least two isoprene C 5 units (CH 2 =C(CH 3 )-CH=CH 2 ) (each unit is substituted or unsubstituted) The reaction is formed, and thus many of the ruthenium compounds of the present invention preferably have at least 10 carbon atoms and include at least one isoprene moiety. As used herein, the term "isoprene moiety" refers to any moiety of a molecule that includes a free radical, which may be formed from a substituted or unsubstituted isoprene. In certain preferred embodiments, unsubstituted anthracene is preferred.

在許多較佳實施例中,本發明之萜化合物包含至少一種改質或未改質異戊二烯分子之頭對尾縮合產物。預期任何一或多種萜化合物適合根據本發明來使用,且考慮到本文中所含之教示內容,熟習此項技術者將能夠選擇用於任何特定應用之萜化合物的數目及類型而不需過度實驗。本發明之較佳萜為呈環狀或非環狀、飽和或不飽和、經取代或未經取代之結構的具有分子式(C5H8)n之烴,其中n較佳為2至約6,且甚至更佳2至4。根據本發明之具有式C10H16之萜(包括經取代形式)有時在本文中稱為單萜,而具有式C15H24之萜(包括經取代形式)有時在本文中稱為倍半萜。根據本發明之具有式C20H32之萜(包括經取代形式)有時在本文中稱為二萜,而具有式C30H24之萜(包括經取代形式)有時稱為三萜等。含有30或30個以上碳之萜通常由兩種萜前驅物以規則模式融合而形成。雖然預期所有該等萜適合根據本發明來使用,但一般較佳使用單萜。 In many preferred embodiments, the indole compounds of the present invention comprise a head-to-tail condensation product of at least one modified or unmodified isoprene molecule. It is contemplated that any one or more of the hydrazine compounds are suitable for use in accordance with the present invention, and in view of the teachings contained herein, those skilled in the art will be able to select the number and type of hydrazine compounds for any particular application without undue experimentation. . Preferred hydrazines of the invention are hydrocarbons of the formula (C 5 H 8 ) n in a cyclic or acyclic, saturated or unsaturated, substituted or unsubstituted structure, wherein n is preferably from 2 to about 6 And even better 2 to 4. The oxime (including substituted form) having the formula C 10 H 16 according to the present invention is sometimes referred to herein as a monoterpene, and the oxime (including substituted form) having the formula C 15 H 24 is sometimes referred to herein as Half a mile. The oxime (including substituted form) having the formula C 20 H 32 according to the present invention is sometimes referred to herein as diterpene, and the oxime (including substituted form) having the formula C 30 H 24 is sometimes referred to as triterpene, etc. . The ruthenium containing 30 or more carbons is usually formed by the fusion of two ruthenium precursors in a regular pattern. While it is contemplated that all such crucibles are suitable for use in accordance with the present invention, it is generally preferred to use a single crucible.

在某些較佳實施例中,本發明組合物之萜化合物較佳以主要比例包含且甚至更佳基本上由一或多種非環狀萜化合物組成。在非環狀萜中,預期該等化合物可在識別為頭對尾連接的類異戊二烯之一類化合物內或在不以彼方式連接之一類化合物內。較佳根據本發明之某些態樣使用之非環狀萜包括月桂烯(2-甲基-6-亞甲基辛-1,7-二烯)、別-羅勒萜、β-羅勒萜。 In certain preferred embodiments, the hydrazine compound of the compositions of the present invention preferably comprises, and even more preferably consists essentially of, one or more acyclic hydrazine compounds. In acyclic guanidines, it is contemplated that such compounds may be within one of the classes of isoprenoids identified as head-to-tail linkages or in a compound that is not linked in one way. Preferred acyclic guanidines for use in accordance with certain aspects of the invention include myrcene (2-methyl-6-methylene octane-1,7-diene), beni-tropium, and beta- basil.

在某些實施例中,本發明之萜化合物可包含環狀萜化合物。在環狀萜中,具有不同不飽和程度之單環、雙環、三環或四環化合物預期根據本發明來使用。在某些較佳實施例中,萜為具有式1-甲基-4-異丙烯基-1-環己烯(亦稱作「d-檸檬烯」)之環狀萜化合物,其具有以下結構。 In certain embodiments, the indole compounds of the present invention may comprise a cyclic amidine compound. Among the cyclic oximes, monocyclic, bicyclic, tricyclic or tetracyclic compounds having different degrees of unsaturation are contemplated for use in accordance with the present invention. In certain preferred embodiments, hydrazine is a cyclic hydrazine compound having the formula 1-methyl-4-isopropenyl-1-cyclohexene (also referred to as "d-limonene") having the following structure.

在某些較佳實施例中,萜為包含蒎烯之環狀萜化合物,其可具有以下化學結構: In certain preferred embodiments, hydrazine is a cyclic hydrazine compound comprising a terpene which may have the following chemical structure:

適合關於本發明之各種態樣使用之萜化合物的實例包括特惹萜、月桂烯、檸檬烯、視黃醛、蒎烯、薄荷醇、香草醇、法呢醇、植醇、萜品烯、δ-3蒈烯、萜品油烯、萜品醇、里哪醇(linalool)、莰烯、水芹烯、葑烯及其類似者以及其摻合物,包括所有其異構體。 Examples of hydrazine compounds suitable for use in various aspects of the invention include tacrolimus, myrcene, limonene, retinal, decene, menthol, vanillyl alcohol, farnesol, phytol, terpinene, δ- 3 terpene, terpinolene, terpineol, linalool, decene, hydrocelene, decene, and the like, and blends thereof, including all isomers thereof.

根據本發明之萜衍生物之其他實例包括萜之含氧衍生物,諸如含有羥基或羰基之醇、醛或酮;以及氫化衍生物。萜之含氧衍生物有時在本文中稱為類萜。在某些實施例中,本發明之基於二烯之化合物包含類萜鼠尾草酸(Carnosic acid)。鼠尾草酸為對應於經驗式C20H28O4之酚二萜。其天然存在於唇形科植物中。舉例而言,鼠尾草酸為種屬鼠尾草(Salvia officinalis/sage)及迷迭香(Rosmarinus officinalis/rosemary)主要發現於樹葉中之成分。鼠尾草酸亦發現於百里香(thyme)及馬郁蘭(marjoram)中(參見Linde於Salvia officinalis[Helv.Chim Acta 47,1234(1962)]及Wenkert等人於Rosmarinus officinalis[J.Org.Chem.30,2931(1965)]),且發現於各種其他種屬之鼠尾草中(參見Salvia canariensis[Savona and Bruno,J.Nat.Prod.46,594(1983)]及Salvia willeana[de la Torre等人,Phytochemistry 29,668(1990)])。其亦存在於三裂鼠尾草(Salvia triloba)及快樂鼠尾草(Salvia sclarea)中。其他可能的類萜說明如下: Other examples of the anthracene derivative according to the present invention include an oxygen-containing derivative of hydrazine, such as an alcohol, an aldehyde or a ketone containing a hydroxyl group or a carbonyl group; and a hydrogenated derivative. Oxygenated derivatives of hydrazine are sometimes referred to herein as terpenoids. In certain embodiments, the diene-based compound of the present invention comprises Carnosic acid. Carnosic acid is a phenol dioxime corresponding to the empirical formula C 20 H 28 O 4 . It is naturally found in plants of the family Labiatae. For example, carnosic acid is a component found mainly in leaves of Salvia officinalis/sage and rosemary (Rosmarinus officinalis/rosemary). Carnosic acid is also found in thyme and marjoram (see Linde in Salvia officinalis [Helv. Chim Acta 47, 1234 (1962)] and Wenkert et al. in Rosmarinus officinalis [J. Org. Chem. 30, 2931 (1965)]), and found in various other species of sage (see Salvia canariensis [Savona and Bruno, J. Nat. Prod. 46, 594 (1983)] and Salvia willeana [de la Torre et al, Phytochemistry 29, 668 (1990)]). It is also found in Salvia triloba and Salvia sclarea. Other possible categories are as follows:

如本文中所使用,術語「鹵化烴」係指其中至少一個位置經鹵素原子取代之烴鏈或烴環。烴鏈可包括C1至C20烷基、C1至C20烯基、C1至C20醇基、C1至C20醚、C5至C7環烯基、C5至C7雜環烷基或C5至C7雜環烯基,其中任一者可為直鏈或分支鏈(若可適用)及/或視情況在一或多個位置處經取代。在某些態樣中,其包括C1至C8烷基、C1至C8烯基、C1至C8醇基、C1至C10醚或C5至C7環烯基,其中任一者可為直鏈或分支鏈(若可適用)及/或視情況在一或多個位置處經取代。在前述實施例中之任一者中,烴較佳經選自F、Cl、Br或I之至少一種鹵素取代。 As used herein, the term "halogenated hydrocarbon" refers to a hydrocarbon or hydrocarbon ring in which at least one position is replaced by a halogen atom. The hydrocarbon chain may include a C 1 to C 20 alkyl group, a C 1 to C 20 alkenyl group, a C 1 to C 20 alcohol group, a C 1 to C 20 ether, a C 5 to C 7 cycloalkenyl group, a C 5 to C 7 hetero group. cycloalkyl or C 5 to C 7 heterocycloalkenyl, any of those which may be linear or branched (if applicable) and / or optionally substituted at one or more positions. In certain aspects, it includes a C 1 to C 8 alkyl group, a C 1 to C 8 alkenyl group, a C 1 to C 8 alcohol group, a C 1 to C 10 ether or a C 5 to C 7 cycloalkenyl group, wherein Either can be a straight or branched chain (if applicable) and/or substituted at one or more locations as appropriate. In any of the foregoing embodiments, the hydrocarbon is preferably substituted with at least one halogen selected from the group consisting of F, Cl, Br or I.

在某些實施例中,鹵化烴為C1至C5烷基或C1至C5烯基。在其他實施例中,其為含有至少一個氯原子之C2烯基。該等溶劑之非限制性實例包括反-1,2-二氯乙烯、全氯乙烯、三氯乙烯及其組合。在某些態樣中,用作第二組分之鹵化烴不包括十鹵戊烷,尤其十氟戊烷。 In certain embodiments, the halogenated hydrocarbon is a C 1 to C 5 alkyl group or a C 1 to C 5 alkenyl group. In other embodiments, it is a C 2 alkenyl group containing at least one chlorine atom. Non-limiting examples of such solvents include trans-1,2-dichloroethylene, perchloroethylene, trichloroethylene, and combinations thereof. In some aspects, the halogenated hydrocarbon used as the second component does not include decahalopentane, especially decafluoropentane.

組分(c)Component (c)

關於鹵化烴之以上描述同樣適用於組分(c)之氫氟烯烴,限制條件為至少一個F取代基存在於化合物中。 The above description regarding halogenated hydrocarbons applies equally to the hydrofluoroolefins of component (c), with the proviso that at least one F substituent is present in the compound.

如本文中所使用,氫鹵醚係指具有結構R-O-R'之一類溶劑。R及 R'可獨立地選自C1至C20烷基、C1至C20烯基、C1至C20醇基、C1至C20醚基、C5至C7環烷基、C5至C7環烯基、C5至C7雜環烷基或C5至C7雜環烯基,其中前述中之任一者(若可適用)可為直鏈或分支鏈且至少一個基團在一或多個位置處經鹵素原子取代。 As used herein, a hydrohalide ether refers to a solvent having one of the structures RO-R'. R and R' may be independently selected from C 1 to C 20 alkyl, C 1 to C 20 alkenyl, C 1 to C 20 alcohol, C 1 to C 20 ether, C 5 to C 7 cycloalkyl, C 5 to C 7 cycloalkenyl, C 5 to C 7 heterocycloalkyl or C 5 to C 7 heterocycloalkenyl, wherein any of the foregoing, if applicable, may be straight or branched and at least A group is substituted with a halogen atom at one or more positions.

在某些較佳實施例中,氫鹵醚為氫氟醚,其可包括根據前述之單體或聚合結構,其中R或R'取代基中之一或多者經氟原子取代。在某些非限制性實施例中,氫氟醚包括至少一種九氟烷基醚,其中烷基可包括1至10個碳原子。在某些非限制性實施例中,九氟烷基醚包括九氟丁醚及/或九氟異丁醚,包括(但不限於)以商品名NOVEC®市售之彼等物,尤其但不僅僅為NOVEC® 7200(購自3M)。在某些非限制性實施例中,氫鹵醚具有或者包括以下結構CH3OCF2CF2CF2CF3﹁﹁、(CF3)2CFCF2OCH3、CH3OCF2CF2CF3或此等結構與反-1,2-二氯乙烯之任何組合。 In certain preferred embodiments, the hydrohalide ether is a hydrofluoroether, which may include a monomer or polymeric structure according to the foregoing, wherein one or more of the R or R' substituents are substituted with a fluorine atom. In certain non-limiting embodiments, the hydrofluoroether includes at least one nonafluoroalkyl ether, wherein the alkyl group can include from 1 to 10 carbon atoms. In certain non-limiting embodiments, the nonafluoroalkyl ethers include nonafluorobutyl ether and/or nonafluoroisobutyl ether, including, but not limited to, those commercially available under the tradename NOVEC®, especially but not only Only NOVEC® 7200 (available from 3M). In certain non-limiting embodiments, the hydrohalide ether has or includes the structure CH3OCF2CF2CF2CF3 "", (CF3)2CFCF2OCH3, CH3OCF2CF2CF3 or any combination of such structures with trans-1,2-dichloroethylene.

如本文中所使用,「十鹵戊烷」意謂經10個鹵素原子取代之五碳烷基鏈,鹵素原子可選自F、Cl、Br或I。在某些較佳實施例中,十鹵戊烷為十氟戊烷。此類化合物之非限制性實例包括1,1,1,2,3,4,4,5,5,5-十氟戊烷、1,1,1,2,2,3,4,5,5,5-十氟戊烷及/或1,1,1,2,3,3,4,5,5,5-十氟戊烷。在某些實施例中,十鹵戊烷或十氟戊烷包括以商品名VERTREL®(購自DuPont)市售之至少一類化合物,包括(但不限於)VERTREL SFR及/或VERTREL XF。 As used herein, "decahalopentane" means a five carbon alkyl chain substituted with 10 halogen atoms, and the halogen atom may be selected from F, Cl, Br or I. In certain preferred embodiments, the decahalopentane is decafluoropentane. Non-limiting examples of such compounds include 1,1,1,2,3,4,4,5,5,5-decafluoropentane, 1,1,1,2,2,3,4,5, 5,5-Decafluoropentane and/or 1,1,1,2,3,3,4,5,5,5-decafluoropentane. In certain embodiments, decahalopentan or decafluoropentane includes at least one class of compounds commercially available under the tradename VERTREL® (available from DuPont) including, but not limited to, VERTREL SFR and/or VERTREL XF.

組分量Group component

本申請人咸信,基於本文中所含之教示內容及實例,熟習此項技術者將能夠根據特定應用之需要選擇本發明組合物之組分之各種相對量,無論在本發明之第一態樣或第二態樣中。然而,本申請人咸信如下文所描述之各種組分之相對量將在許多應用中為較佳。 Applicant's letter, based on the teachings and examples contained herein, those skilled in the art will be able to select various relative amounts of the components of the compositions of the present invention, depending on the needs of the particular application, regardless of the first state of the invention. Or the second aspect. However, Applicants believe that the relative amounts of the various components described below will be preferred in many applications.

第一組分(a)中所提供或作為組分(i)之一部分的醇較佳係以組合 物之總重量計大於約0重量%至約15重量%之量共同提供。在某些態樣中,醇係以組合物之總重量計約0.01重量%至約10重量%之量提供。在某些較佳實施例中,醇係以組合物之總重量計約1重量%至約5重量%之量提供。 The alcohol provided in the first component (a) or as part of the component (i) is preferably combined The total weight of the article is provided in an amount greater than about 0% by weight to about 15% by weight. In some aspects, the alcohol is provided in an amount from about 0.01% to about 10% by weight, based on the total weight of the composition. In certain preferred embodiments, the alcohol is provided in an amount from about 1% to about 5% by weight based on the total weight of the composition.

當用於第二組分(b)中時,尤其包括二醇醚之第二組分(b)較佳係以組合物之總重量計大於約0重量%至約30重量%之量提供。在某些較佳實施例中,尤其包括二醇醚之第二組分係以組合物之總重量計約0.01重量%至約25重量%之量提供。在某些較佳實施例中,視所使用之第三組分而定,尤其包括二醇醚之第二組分係以組合物之總重量計約1重量%至約20重量%之量提供。 When used in the second component (b), the second component (b), particularly including the glycol ether, is preferably provided in an amount of from greater than about 0% by weight to about 30% by weight based on the total weight of the composition. In certain preferred embodiments, the second component, including especially the glycol ether, is provided in an amount from about 0.01% to about 25% by weight based on the total weight of the composition. In certain preferred embodiments, depending on the third component used, especially the second component comprising the glycol ether is provided in an amount from about 1% to about 20% by weight based on the total weight of the composition. .

對於涉及組分(i)之本發明之第二態樣,二醇醚(當存在時)較佳係以組合物之總重量計約0.01重量%至約30重量%,更佳約0.05重量%至約10重量%,且甚至更佳約1重量%至約5重量%之量提供。在該等實施例中,組分(i)較佳係以組合物之總重量計約70重量%至約99.99重量%,更佳約90重量%至約99.95重量%,且甚至更佳約95重量%至約99重量%之量提供。 For the second aspect of the invention relating to component (i), the glycol ether, when present, is preferably from about 0.01% to about 30% by weight, more preferably about 0.05% by weight, based on the total weight of the composition. It is provided in an amount of up to about 10% by weight, and even more preferably from about 1% by weight to about 5% by weight. In such embodiments, component (i) is preferably from about 70% to about 99.99% by weight, more preferably from about 90% to about 99.95% by weight, and even more preferably about 95% by weight based on the total weight of the composition. Provided in an amount of from 5% by weight to about 99% by weight.

當第二組分(b)包含萜時,其較佳係以組合物之總重量計大於約0重量%至約30重量%之量提供。在某些較佳實施例中,萜係以組合物之總重量計約0.01重量%至約25重量%之量提供。在某些較佳實施例中,萜係以組合物之總重量計約1重量%至約20重量%之量提供。 When the second component (b) comprises hydrazine, it is preferably provided in an amount of from greater than about 0% by weight to about 30% by weight, based on the total weight of the composition. In certain preferred embodiments, the lanthanide is provided in an amount from about 0.01% to about 25% by weight based on the total weight of the composition. In certain preferred embodiments, the lanthanide is provided in an amount from about 1% to about 20% by weight based on the total weight of the composition.

對於涉及組分(i)之本發明之第二態樣,萜(當存在時)較佳係以組合物之總重量計約0.01重量%至約30重量%,更佳約0.05重量%至約10重量%,且甚至更佳約1重量%至約5重量%之量提供。在該等實施例中,組分(i)較佳係以組合物之總重量計約70重量%至約99.99重量%,更佳約90重量%至約99.95重量%,且甚至更佳約95重量%至約99重量%之量提供。 For the second aspect of the invention relating to component (i), hydrazine (when present) is preferably from about 0.01% to about 30% by weight, more preferably from about 0.05% by weight to about the total weight of the composition. Provided in an amount of 10% by weight, and even more preferably from about 1% by weight to about 5% by weight. In such embodiments, component (i) is preferably from about 70% to about 99.99% by weight, more preferably from about 90% to about 99.95% by weight, and even more preferably about 95% by weight based on the total weight of the composition. Provided in an amount of from 5% by weight to about 99% by weight.

當第二組分(b)包含鹵化烴時,其可以組合物之總重量計大於約0重量%至約50重量%,約0.01重量%至約40重量%,或約1重量%至約30重量%之量提供。 When the second component (b) comprises a halogenated hydrocarbon, it may be greater than about 0% to about 50% by weight, from about 0.01% to about 40% by weight, or from about 1% to about 30% by weight based on the total weight of the composition. Available in weight percent.

對於涉及組分(i)之本發明之第二態樣,鹵化烴(當存在時)較佳係以組合物之總重量計約0.01重量%至約95重量%,更佳約0.01重量%至約80重量%,且甚至更佳約1重量%至約50重量%,且在某些實施例中約1重量%至約30重量%之量提供。在該等實施例中,組分(i)較佳係以組合物之總重量計約5重量%至約99.99重量%,更佳約20重量%至約99.99重量%,且甚至更佳約50重量%至約99重量%之量提供。 For the second aspect of the invention relating to component (i), the halogenated hydrocarbon, when present, is preferably from about 0.01% to about 95% by weight, more preferably from about 0.01% by weight, based on the total weight of the composition. It is provided in an amount of about 80% by weight, and even more preferably from about 1% by weight to about 50% by weight, and in some embodiments from about 1% by weight to about 30% by weight. In such embodiments, component (i) is preferably from about 5% by weight to about 99.99% by weight, more preferably from about 20% by weight to about 99.99% by weight, and even more preferably about 50% by weight based on the total weight of the composition. Provided in an amount of from 5% by weight to about 99% by weight.

當第二組分(b)為反-1,2-二氯乙烯時,其較佳係以組合物之總重量計約1%至約99%,大於約5重量%至約50重量%,約6重量%至約30重量%,且在某些實施例中約6重量%至約20重量%之任何量提供。在某些較佳實施例中,反-1,2-二氯乙烯係以組合物之總重量計約6重量%至約35重量%之量提供。 When the second component (b) is trans-1,2-dichloroethylene, it is preferably from about 1% to about 99%, more than about 5% to about 50% by weight, based on the total weight of the composition, From about 6 wt% to about 30 wt%, and in some embodiments from about 6 wt% to about 20 wt%, any amount is provided. In certain preferred embodiments, the trans-1,2-dichloroethylene is provided in an amount from about 6% by weight to about 35% by weight based on the total weight of the composition.

對於涉及組分(i)之本發明之第二態樣,反-1,2-二氯乙烯(當存在時)較佳係以組合物之總重量計約5重量%至約95重量%,更佳約6重量%至約95重量%,且甚至更佳約6重量%至約80重量%,甚至更佳在某些實施例中約6重量%至約50重量%,且在某些實施例中約6重量%至約25重量%之量提供。在該等實施例中,組分(i)較佳係以組合物之總重量計約5重量%至約95重量%,更佳約5重量%至約94重量%,甚至更佳約20重量%至約94重量%,且在某些實施例中約50重量%至約94重量%之量提供。 For the second aspect of the invention relating to component (i), trans-1,2-dichloroethylene, when present, is preferably from about 5% by weight to about 95% by weight, based on the total weight of the composition, More preferably from about 6 wt% to about 95 wt%, and even more preferably from about 6 wt% to about 80 wt%, even more preferably from about 6 wt% to about 50 wt% in certain embodiments, and in certain embodiments Provided in an amount of from about 6% by weight to about 25% by weight in the examples. In such embodiments, component (i) is preferably from about 5% by weight to about 95% by weight, more preferably from about 5% by weight to about 94% by weight, even more preferably about 20% by weight based on the total weight of the composition. % to about 94% by weight, and in some embodiments from about 50% to about 94% by weight.

在某些態樣中,該等第三組分(c)係以組合物之總重量計大於0.01重量%至約99重量%之量提供。在某些態樣中,第三組分係以組合物之總重量計約25重量%至約99重量%,或在某些實施例中約20重量%至約99重量%之量提供。在某些較佳實施例中,第三組分(c)係以組合 物之總重量計約50重量%至約99重量%之量提供。在某些較佳實施例中,以組合物之總重量計,第三組分係以約70重量%至約99重量%之量提供,或第三組分係以約75重量%至約99重量%之量提供。在甚至其他實施例中,以組合物之總重量計,第三組分係以約90重量%至約99重量%之量提供,且在某些實施例中,第三組分係以約92重量%至約96重量%之量提供。 In some aspects, the third component (c) is provided in an amount from greater than 0.01% to about 99% by weight, based on the total weight of the composition. In certain aspects, the third component is provided in an amount from about 25% to about 99% by weight, or in some embodiments from about 20% to about 99% by weight, based on the total weight of the composition. In certain preferred embodiments, the third component (c) is combined The total weight of the article is provided in an amount of from about 50% by weight to about 99% by weight. In certain preferred embodiments, the third component is provided in an amount from about 70% to about 99% by weight, based on the total weight of the composition, or the third component is from about 75% to about 99%. Available in weight percent. In even other embodiments, the third component is provided in an amount from about 90% to about 99% by weight, based on the total weight of the composition, and in certain embodiments, the third component is about 92%. Provided in an amount by weight to about 96% by weight.

共沸及共沸物狀組合物Azeotrope and azeotrope-like composition

在某些實施例中,第一組分(a)及第三組分(c)形成共沸物狀組合物,或第一組分(i)包含共沸物或共沸物狀組合物。如本文中所使用,術語「共沸物狀」係關於絕對共沸或一般如同共沸混合物一樣表現之組合物。共沸混合物為兩種或兩種以上組分之系統,其中液體組合物及蒸氣組合物在所陳述壓力及溫度下相同。實際上,此意謂共沸混合物之組分為恆定沸騰或基本上恆定沸騰的,且一般無法在相變期間經熱力分離。由共沸混合物之沸騰或蒸發形成之蒸氣組合物與初始液體組合物相同或實質上相同。因此,共沸物狀組合物之液相及氣相中之組分濃度僅最低限度地(若真有)隨組合物沸騰或者蒸發而變化。相比而言,沸騰或蒸發非共沸混合物使液相之組分濃度變化至顯著程度。 In certain embodiments, the first component (a) and the third component (c) form an azeotrope-like composition, or the first component (i) comprises an azeotrope or azeotrope-like composition. As used herein, the term "azeotrope" refers to a composition that is absolutely azeotroped or generally behaves like an azeotrope. Azeotropic mixtures are systems of two or more components wherein the liquid composition and vapor composition are the same at the stated pressures and temperatures. In practice, this means that the components of the azeotrope are either constant boiling or substantially constant boiling and generally cannot be thermally separated during the phase change. The vapor composition formed by boiling or evaporation of the azeotrope is the same or substantially the same as the initial liquid composition. Thus, the concentration of the components in the liquid phase and the gas phase of the azeotrope-like composition varies only minimally (if any) as the composition boils or evaporates. In contrast, boiling or evaporating the non-azeotropic mixture changes the concentration of the components of the liquid phase to a significant extent.

如本文中所使用,關於共沸物狀組合物之組分的術語「基本上由......組成」意謂組合物以共沸物狀比含有所指示之組分,且可含有額外組分,限制條件為額外組分不形成新的共沸物狀系統。舉例而言,共沸物狀混合物基本上由形成二元共沸物之兩種化合物組成,其視情況可包括一或多種額外組分,限制條件為額外組分不使混合物非共沸且不與兩種化合物中之任一者或兩者形成共沸物。 As used herein, the term "consisting essentially of" with respect to a component of an azeotrope-like composition means that the composition contains the indicated component in an azeotrope-like ratio and may contain Additional components, with the proviso that the additional components do not form a new azeotrope-like system. For example, the azeotrope-like mixture consists essentially of two compounds that form a binary azeotrope, which may optionally include one or more additional components, with the proviso that the additional component does not make the mixture non-azeotropic and not An azeotrope is formed with either or both of the compounds.

如本文中所使用之指共沸組合物之術語「有效量」意謂與其他組分組合後,導致本發明之共沸物或共沸物狀組合物之形成的各組分之量。 The term "effective amount" as used herein, referring to an azeotropic composition, means the amount of each component which results in the formation of the azeotrope or azeotrope-like composition of the present invention when combined with other components.

如本文中所使用,關於沸點資料之術語「環境壓力」意謂圍繞相關介質之大氣壓。一般而言,環境壓力為14.7psia,但可變化+/- 0.5psi。 As used herein, the term "ambient pressure" with respect to boiling point data means the atmospheric pressure surrounding the relevant medium. In general, the ambient pressure is 14.7 psia, but can vary by +/- 0.5 psi.

本發明之共沸物狀組合物可藉由組合有效量之HFO-1233zd與較佳呈流體形式之一或多種醇來產生。此項技術中已知之用於組合兩種或兩種以上組分以形成組合物之多種方法中之任一者可經調適以用於本發明方法中。舉例而言,HFO-1233zd及醇可作為分批或連續反應及/或方法之一部分人工地及/或藉由機器混合、摻合或者組合,或經由兩種或兩種以上該等步驟之組合。根據本文中之本發明,熟習此項技術者將容易能夠製備根據本發明之共沸物狀組合物而不需過度實驗。 The azeotrope-like compositions of the present invention can be produced by combining an effective amount of HFO-1233zd with one or more alcohols, preferably in fluid form. Any of a variety of methods known in the art for combining two or more components to form a composition can be adapted for use in the methods of the invention. For example, HFO-1233zd and an alcohol may be mixed and blended or combined manually or/or by machine, or a combination of two or more of these steps, as part of a batch or continuous reaction and/or method. . In accordance with the invention herein, one skilled in the art will readily be able to prepare azeotrope-like compositions in accordance with the present invention without undue experimentation.

在一較佳實施例中,共沸物狀組合物包含有效量之HFO-1233zd及C1-C3醇。較佳地,C1-C3醇選自由甲醇、乙醇及異丙醇組成之群。該等共沸物之非限制性實例提供於美國專利第8,163,196號中,其內容以全文引用的方式併入本文中。在某些較佳實施例中,HFO-1233zd為反式異構體。 In a preferred embodiment, the azeotrope-like composition comprises an effective amount of HFO-1233zd and a C1-C3 alcohol. Preferably, the C1-C3 alcohol is selected from the group consisting of methanol, ethanol and isopropanol. Non-limiting examples of such azeotropes are provided in U.S. Patent No. 8,163,196, the disclosure of which is incorporated herein in its entirety. In certain preferred embodiments, HFO-1233zd is a trans isomer.

在某些實施例中,共沸物狀組合物包含有效量之反-HFO-1233zd及甲醇。此等二元共沸物狀組合物可基本上由約70wt.%至約99.95wt.%反-HFO-1233zd及約0.05wt.%至約30wt.%甲醇,更佳約90wt.%至約99.95wt.%反-HFO-1233zd及約0.05wt.%至約10wt.%甲醇,且甚至更佳約95wt.%至約99.95wt.%反-HFO-1233zd及約0.05wt.%至約5wt.%甲醇組成。在某些態樣中,該等反-HFO-1233zd/甲醇組合物之沸點為約17℃至約19℃,更佳約17℃至約18℃,甚至更佳約17℃至約17.5℃,且最佳約17.15℃±1℃,所有均在環境壓力下量測。 In certain embodiments, the azeotrope-like composition comprises an effective amount of trans-HFO-1233zd and methanol. The binary azeotrope-like compositions may consist essentially of from about 70 wt.% to about 99.95 wt.% trans-HFO-1233zd and from about 0.05 wt.% to about 30 wt.% methanol, more preferably from about 90 wt.% to about 99.95 wt.% anti-HFO-1233zd and about 0.05 wt.% to about 10 wt.% methanol, and even more preferably about 95 wt.% to about 99.95 wt.% anti-HFO-1233zd and about 0.05 wt.% to about 5 wt. .% methanol composition. In certain aspects, the anti-HFO-1233zd/methanol composition has a boiling point of from about 17 ° C to about 19 ° C, more preferably from about 17 ° C to about 18 ° C, even more preferably from about 17 ° C to about 17.5 ° C. And the best is about 17.15 ° C ± 1 ° C, all measured under ambient pressure.

在某些實施例中,共沸物狀組合物包含有效量之順-HFO-1233zd及甲醇。此等二元共沸物狀組合物基本上由約78wt.%至約99.9wt.% 順-HFO-1233zd及約0.1wt.%至約22wt.%甲醇,更佳約85wt.%至約99.9wt.%順-HFO-1233zd及約0.1wt.%至約15wt.%甲醇,且甚至更佳約88wt.%至約99.5wt.%順-HFO-1233zd及約0.5wt.%至約12wt.%甲醇組成。在某些態樣中,該等順-HFO-1233zd/甲醇組合物之沸點在環境壓力下為約35.2±1℃。 In certain embodiments, the azeotrope-like composition comprises an effective amount of cis-HFO-1233zd and methanol. These binary azeotrope-like compositions consist essentially of from about 78 wt.% to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 22 wt.% methanol, more preferably from about 85 wt.% to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 15 wt.% methanol, and even More preferably, it is from about 88 wt.% to about 99.5 wt.% cis-HFO-1233zd and from about 0.5 wt.% to about 12 wt.% methanol. In some aspects, the boiling point of the cis-HFO-1233zd/methanol composition is about 35.2 ± 1 °C at ambient pressure.

在其他實施例中,共沸物狀組合物包含有效量之反-HFO-1233zd及乙醇。此等二元共沸物狀組合物可基本上由約85wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約15wt.%乙醇,更佳約92wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約8wt.%乙醇,且甚至更佳約96wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約4wt.%乙醇組成。在某些態樣中,該等反-HFO-1233zd/乙醇組合物之正常沸點在環境壓力下為約18.1℃±1℃。 In other embodiments, the azeotrope-like composition comprises an effective amount of trans-HFO-1233zd and ethanol. The binary azeotrope-like compositions may consist essentially of from about 85 wt.% to about 99.9 wt.% trans-HFO-1233zd and from about 0.1 wt.% to about 15 wt.% ethanol, more preferably from about 92 wt.% to about 99.9 wt.% anti-HFO-1233zd and from about 0.1 wt.% to about 8 wt.% ethanol, and even more preferably from about 96 wt.% to about 99.9 wt.% anti-HFO-1233zd and from about 0.1 wt.% to about 4 wt. .% ethanol composition. In some aspects, the normal boiling point of the anti-HFO-1233zd/ethanol composition is about 18.1 °C ± 1 °C at ambient pressure.

在其他實施例中,共沸物狀組合物包含有效量之順-HFO-1233zd及乙醇。此等二元共沸物狀組合物可基本上由約65wt.%至約99.9wt.%順-HFO-1233zd及約0.1wt.%至約35wt.%乙醇,更佳約79wt.%至約99.9wt.%順-HFO-1233zd及約0.1wt.%至約21wt.%乙醇,且甚至更佳約88wt.%至約99.5wt.%順-HFO-1233zd及約0.5wt.%至約12wt.%乙醇組成。在某些態樣中,該等順-HFO-1233zd/乙醇組合物之正常沸點在環境壓力下為約37.4℃±1℃。 In other embodiments, the azeotrope-like composition comprises an effective amount of cis-HFO-1233zd and ethanol. The binary azeotrope-like compositions may consist essentially of from about 65 wt.% to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 35 wt.% ethanol, more preferably from about 79 wt.% to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 21 wt.% ethanol, and even more preferably from about 88 wt.% to about 99.5 wt.% cis-HFO-1233zd and from about 0.5 wt.% to about 12 wt. .% ethanol composition. In some aspects, the normal boiling point of the cis-HFO-1233zd/ethanol composition is about 37.4 ° C ± 1 ° C at ambient pressure.

在甚至其他實施例中,共沸物狀組合物包含有效量之反-HFO-1233zd及異丙醇。此等二元共沸物狀組合物可基本上由約90wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約10wt.%異丙醇,更佳約94wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約6wt.%異丙醇,且甚至更佳約95wt.%至約99.9wt.%反-HFO-1233zd及約0.1wt.%至約5wt.%異丙醇組成。在某些態樣中,該等反-HFO-1233zd/異丙醇組合物之正常沸點在環境壓力下為約17.9℃±1℃。 In even other embodiments, the azeotrope-like composition comprises an effective amount of trans-HFO-1233zd and isopropanol. These binary azeotrope-like compositions may consist essentially of from about 90 wt.% to about 99.9 wt.% trans-HFO-1233zd and from about 0.1 wt.% to about 10 wt.% isopropanol, more preferably about 94 wt.%. Up to about 99.9 wt.% trans-HFO-1233zd and from about 0.1 wt.% to about 6 wt.% isopropanol, and even more preferably from about 95 wt.% to about 99.9 wt.% anti-HFO-1233zd and about 0.1 wt. % to about 5 wt.% isopropanol composition. In some aspects, the normal boiling point of the anti-HFO-1233zd/isopropanol composition is about 17.9 ° C ± 1 ° C at ambient pressure.

在甚至其他實施例中,共沸物狀組合物包含有效量之順-HFO-1233zd及異丙醇。此等二元共沸物狀組合物基本上由約85wt.%至約99.9wt.%順-HFO-1233zd及約0.1wt.%至約15wt.%異丙醇,且甚至更佳約90wt.%至約99.9wt.%順-HFO-1233zd及約0.1wt.%至約10wt.%異丙醇組成。在某些態樣中,該等順-HFO-1233zd/異丙醇組合物之沸點在環境壓力下為約38.4±1℃,且甚至更佳為38.4±0.1℃。 In even other embodiments, the azeotrope-like composition comprises an effective amount of cis-HFO-1233zd and isopropanol. These binary azeotrope-like compositions consist essentially of from about 85 wt.% to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 15 wt.% isopropanol, and even more preferably about 90 wt. % to about 99.9 wt.% cis-HFO-1233zd and from about 0.1 wt.% to about 10 wt.% isopropanol. In some aspects, the boiling point of the cis-HFO-1233zd/isopropanol composition is about 38.4 ± 1 ° C at ambient pressure, and even more preferably 38.4 ± 0.1 ° C.

其他資訊Other information

在前述實施例中之任一者中,第二組分(b)較佳形成本發明之組合物。在某些較佳但非限制性態樣中,第二組分為溶劑,尤其根據本文中論述之方法及優勢能夠起作用之溶劑。在某些非限制性態樣中,溶劑能夠至少部分溶解焊接熔劑及與印刷電路板製造或自金屬或非金屬基板移除殘餘物(諸如油及油脂)有關之其他殘餘物。在其他實施例中,第二組分為高沸點溶劑化合物。 In any of the foregoing embodiments, the second component (b) preferably forms a composition of the invention. In certain preferred, but non-limiting aspects, the second component is a solvent, especially a solvent that can function according to the methods and advantages discussed herein. In certain non-limiting aspects, the solvent is capable of at least partially dissolving the solder flux and other residues associated with the manufacture of the printed circuit board or removal of residues (such as oils and greases) from the metal or non-metal substrate. In other embodiments, the second component is a high boiling solvent compound.

如本文中所使用,術語「高沸點溶劑」係指沸點大於至少第一組分及第三組分及/或與上文關於第一態樣或關於第二態樣(存在HCFO-1233zd(順式或反式))所述之該等組分形成之任何共沸物或共沸物狀組合物及/或與所存在的HCFO-1233zd及醇(尤其甲醇、乙醇及/或異丙醇)形成之任何共沸物或共沸物狀組合物之沸點的溶劑化合物。在某些較佳實施例中,「高沸點」化合物之沸點比至少第一組分及第三組分及/或與其關於第一態樣或關於第二態樣形成之任何共沸物或共沸物狀組合物的沸點,比HCFO-1233zd(順式或反式異構體)及/或與HCFO-1233zd及醇(尤其甲醇、乙醇及/或異丙醇)形成之任何共沸物或共沸物狀組合物的沸點至少高10℃,在某些較佳實施例中至少高25℃,且在某些較佳實施例中至少高50℃。 As used herein, the term "high boiling solvent" means having a boiling point greater than at least a first component and a third component and/or with respect to the first aspect above or with respect to the second aspect (the presence of HCFO-1233zd (shun) Any azeotrope or azeotrope-like composition formed by the components of formula or trans)) and/or with HCFO-1233zd and an alcohol (especially methanol, ethanol and/or isopropanol) present A solvent compound that forms the boiling point of any azeotrope or azeotrope-like composition. In certain preferred embodiments, the "high boiling point" compound has a boiling point greater than at least the first component and the third component and/or any azeotrope or total thereof formed with respect to the first aspect or with respect to the second aspect. The boiling point of the boiling composition, any azeotrope formed by HCFO-1233zd (cis or trans isomer) and/or with HCFO-1233zd and alcohol (especially methanol, ethanol and/or isopropanol) or The azeotrope-like composition has a boiling point at least 10 ° C higher, in some preferred embodiments at least 25 ° C higher, and in certain preferred embodiments at least 50 ° C higher.

本發明組合物可包括許多額外化合物或組分,包括界面活性劑、潤滑劑、穩定劑、金屬鈍化劑、腐蝕抑制劑、可燃性抑制劑及調 節組合物之特定特性(諸如成本或可燃性)的其他化合物及/或組分。為此目的,所有該等化合物及組分之存在是在本發明之廣泛範疇內。此等組分較佳以實現本文中論述之優勢、方法或用途之任何有效量提供。在某些非限制性實施例中,第二組分(b)(當存在時)與存在於組合物中之第一組分(a)或第三組分(c)中之任一者非共沸,或以與該等組分非共沸之量提供。 The compositions of the present invention may include a number of additional compounds or components, including surfactants, lubricants, stabilizers, metal passivators, corrosion inhibitors, flammability inhibitors, and modulations. Other compounds and/or components of the particular characteristics of the composition, such as cost or flammability. For this purpose, the presence of all such compounds and components is within the broad scope of the invention. These components are preferably provided in any effective amount to achieve the advantages, methods, or uses discussed herein. In certain non-limiting embodiments, the second component (b) (when present) is associated with any of the first component (a) or the third component (c) present in the composition. Azeotrope or provided in an amount that is not azeotroped with the components.

本申請人已驚人且意外地發現本發明之較佳組合物展現使其尤其合乎需要用於許多應用之特徵,包括在許多清潔及其他應用中作為溶劑,尤其用於清潔焊接熔劑以及作為霧劑及其他可噴塗組合物。特定言之,本申請人已認識到此等組合物往往展現相對較低全球變暖潛能(「GWP」),較佳小於約1000,更佳小於約500,且甚至更佳小於約150,更接近小於10。 The Applicant has surprisingly and unexpectedly discovered that the preferred compositions of the present invention exhibit features that make them particularly desirable for many applications, including as a solvent in many cleaning and other applications, particularly for cleaning solder fluxes and as aerosols. And other sprayable compositions. In particular, Applicants have recognized that such compositions tend to exhibit relatively low global warming potential ("GWP"), preferably less than about 1000, more preferably less than about 500, and even more preferably less than about 150, more Close to less than 10.

在某些實施例中,本發明包括一種包含本文中所描述之組合物、活性成分及視情況惰性成分及/或溶劑及/或霧劑推進劑之可噴塗組合物。在一較佳實施例中,本發明之組合物可在可噴塗組合物中單獨或以與其他已知推進劑組合之形式用作溶劑。溶劑組合物包含,更佳基本上由且甚至更佳由本發明之組合物組成。在某些實施例中,可噴塗組合物為霧劑。 In certain embodiments, the invention includes a sprayable composition comprising a composition, an active ingredient, and optionally an inert ingredient and/or a solvent and/or an aerosol propellant as described herein. In a preferred embodiment, the compositions of the present invention can be used as a solvent in the sprayable composition either alone or in combination with other known propellants. The solvent composition comprises, more preferably consists essentially of, and even more preferably consists of, the composition of the invention. In certain embodiments, the sprayable composition is an aerosol.

待噴塗之適合活性材料包括(但不限於)化妝品材料,諸如除臭劑、香料、噴發劑、清潔溶劑、潤滑劑、殺蟲劑;以及醫學材料,諸如抗哮喘藥物。術語醫學材料在本文中以其最廣泛意義使用,包括咸信或至少咸信在治療、診斷、疼痛緩解及類似治療方面有效之任何及所有材料,且因而將包括例如藥物及生物活性物質。 Suitable active materials to be sprayed include, but are not limited to, cosmetic materials such as deodorants, perfumes, hair sprays, cleaning solvents, lubricants, insecticides; and medical materials such as anti-asthmatic drugs. The term medical material is used herein in its broadest sense to include any and all materials that are effective in treating, diagnosing, pain relieving, and the like, and thus will include, for example, drugs and biologically active substances.

在本發明之某些較佳實施例中,本文中所描述之組合物可用作藉由擦拭、蒸氣脫脂或其他手段自各種基板清潔各種污物(諸如礦物油)、基於松香之熔劑、矽油、潤滑劑等之溶劑。在其他實施例中, 本發明之組合物用於蒸氣脫脂機中,尤其自印刷電路板移除焊接熔劑及其他殘餘物及/或自金屬或非金屬表面移除基於油或油脂之殘餘物。圖1提供一種可用於此類方法之裝置之部分圖解說明。此處,容器5分成三個聚水坑10、20及30,其中至少最初本文中所描述之組合物提供於所有聚水坑中。各聚水坑由聚水坑壁35A及35B分隔開,其具有不同尺寸。如所說明,在某些態樣中,壁35A及壁35B形成三個具有不同尺寸之定向聚水坑,以使得自聚水坑30溢出之流體流入聚水坑20中,且自聚水坑20溢出之流體流入聚水坑10中。至少聚水坑10進一步包括加熱器元件40。 In certain preferred embodiments of the invention, the compositions described herein can be used to clean various soils (such as mineral oil), rosin-based fluxes, eucalyptus oils from various substrates by wiping, vapor degreasing, or other means. , solvents such as lubricants. In other embodiments, The compositions of the present invention are useful in vapor degreasers, particularly to remove solder flux and other residues from printed circuit boards and/or to remove oil or grease based residues from metal or non-metal surfaces. Figure 1 provides a partial illustration of a device that can be used in such a method. Here, the container 5 is divided into three puddles 10, 20 and 30, at least initially the compositions described herein are provided in all of the puddles. Each of the puddles is separated by puddle walls 35A and 35B, which have different sizes. As illustrated, in some aspects, wall 35A and wall 35B form three directional water puddles having different sizes such that fluid overflowing from puddle 30 flows into puddle 20 and from the puddle 20 overflowing fluid flows into the puddle 10. At least the puddle 10 further includes a heater element 40.

最初,各聚水坑10、20及30均含有相同比率之本文中所描述之組合物之各組分。然而,隨時間之流逝,聚水坑10中之加熱器40將組合物加熱至高於第一態樣情況下之第一組分及第三組分或高於第二態樣情況下之組分(i)之沸點,但低於第二組分之沸點的溫度。此導致第一組分及第三組分(單獨或作為共沸物狀組合物)或組分(i)(若存在第二態樣)沸騰而自聚水坑10溢出。此等蒸氣最終在旋管50上冷凝且返回至至少一個聚水坑中。在某些態樣中,旋管可包括上旋管50A及下旋管50B之群。聚水坑30繼續級聯至聚水坑20且最終至聚水坑10。在此情況下,聚水坑中之濃度將變化,以使得聚水坑20及30含有更多第一態樣情況下之第一組分及第三組分或第二態樣情況下之組分(i),且聚水坑10含有更多第二組分。 Initially, each of the puddles 10, 20, and 30 contained the same ratio of components of the compositions described herein. However, over time, the heater 40 in the puddle 10 heats the composition to a higher level than the first component and the third component in the first aspect or higher than the second component. (i) the boiling point, but lower than the boiling point of the second component. This causes the first component and the third component (either alone or as an azeotrope-like composition) or component (i) (if a second aspect is present) to boil and overflow from the puddle 10. These vapors eventually condense on the coil 50 and return to at least one of the puddles. In some aspects, the coil can include a population of upper coil 50A and lower coil 50B. The puddles 30 continue to cascade to the puddle 20 and ultimately to the puddle 10. In this case, the concentration in the puddle will vary so that the puddles 20 and 30 contain more of the first component and the third component or the second component in the case of the first aspect. Sub-(i), and the puddle 10 contains more second components.

在該實施例中,聚水坑10提供一個區域,其中大多數污物及有機清潔劑可藉由浸沒入本發明之流體組合物中及/或藉由置放於本發明組合物之噴霧流18中而自基板(例如,塗佈有基於松香之熔劑或其他殘餘物之印刷電路板,或塗佈有石油、基於合成或半合成之油或油脂的金屬或非金屬部件)洗滌,從而經污染之液體掉入下方之聚水坑10中。隨後,在聚水坑20及30中沖洗基板以清潔部件且移除非所需殘 渣。部件可藉由保持在聚水坑中之一者(尤其聚水坑20或30)上方及/或使用已知方式之蒸發而經乾燥。 In this embodiment, the puddle 10 provides an area in which most of the soil and organic cleaning agent can be submerged into the fluid composition of the present invention and/or by the spray stream placed in the composition of the present invention. Washed from a substrate (eg, a printed circuit board coated with a rosin-based flux or other residue, or a metal or non-metallic component coated with petroleum, synthetic or semi-synthetic oil or grease) The contaminated liquid falls into the puddle 10 below. Subsequently, the substrate is rinsed in the puddles 20 and 30 to clean the parts and remove unwanted debris Slag. The components may be dried by being held over one of the puddles (especially the puddles 20 or 30) and/or by evaporation in a known manner.

待清潔之部件或基板可使用已知傳送帶或吊車構件傳送至聚水坑10及聚水坑10、20及30之間。貯槽可為習知或已知內嵌傳送帶化脫脂/去焊設備、獨立敞頂去焊貯槽或經修改以含有清潔及沖洗貯槽或聚水坑之敞頂去焊貯槽之一部分。 The parts or substrates to be cleaned can be transferred between the puddle 10 and the puddles 10, 20 and 30 using known conveyor belts or crane members. The sump may be part of a conventional or known in-line belt degreasing/desolding apparatus, a separate open top desolder sump or an open top desolder sump modified to contain a cleaning and rinsing tank or puddle.

在本發明之某些較佳態樣中,部件在蒸氣覆蓋層下或在由沸騰出聚水坑10之第一態樣之第一組分及第三組分(單獨或作為共沸物狀組合物)或第二態樣情況下之組分(i)之部分形成(至少部分)的蒸氣區45內乾燥。在某些態樣中,此蒸氣區不含或實質上不含第二組分。如本文中所使用,當提及蒸氣區中之第二組分含量時,「實質上不含」意謂所存在之第二組分量足夠低以使蒸氣組合物非可燃,或以其他方式造成與不存在第二組分之情況之蒸氣區的可燃性相比,蒸氣區之可燃性無實質性或甚至更佳無易於量測之增加。 In certain preferred aspects of the invention, the component is under the vapor coating or in the first component and the third component of the first aspect of the puddle 10 (either alone or as an azeotrope) The portion of component (i) in the case of the composition or the second aspect forms (at least partially) dried in the vapor zone 45. In some aspects, the vapor zone is free or substantially free of the second component. As used herein, when referring to a second component in a vapor zone, "substantially free" means that the amount of the second component present is sufficiently low to render the vapor composition non-flammable or otherwise cause The flammability of the vapor zone is not substantially or even better without the ease of measurement compared to the flammability of the vapor zone in the absence of the second component.

此蒸氣覆蓋層為有利的,因為其減小或減輕第三組分之可燃性及/或使爆炸可能性最小化。然而,在某些態樣中,其亦可包括一或多種額外惰性材料。該等材料可包括(但不限於)氮氣、二氧化碳、全氟化碳、氫氟碳或氫氯碳中之一或多者。 This vapor coating is advantageous because it reduces or reduces the flammability of the third component and/or minimizes the likelihood of explosion. However, in some aspects it may also include one or more additional inert materials. Such materials may include, but are not limited to, one or more of nitrogen, carbon dioxide, perfluorocarbon, hydrofluorocarbon or hydrochlorocarbon.

如所說明,蒸氣區45在各別聚水坑10、20及30上方形成。具有此項技術中已知類型(諸如揭示於美國專利第4,261,111號中,其內容以全文引用的方式併入本文中)之視情況選用之冷卻旋管50界定冷凝蒸氣之蒸氣區45之最上範圍以使冷凝物返回至聚水坑10、20或30中,較佳聚水坑10或30且最佳聚水坑30中。蒸氣區45內第一組分及第三組分(單獨或作為共沸組合物)或第二態樣情況下之組分(i)之濃度可在容器5中藉由使蒸氣冷凝物返回至聚水坑中及/或經由控制體積或水位感應轉換器(未展示)而自聚水坑10將流體泵送至聚水坑20及/或30來維持 在相對恆定濃度下。 As illustrated, vapor zone 45 is formed over respective puddles 10, 20, and 30. A cooling coil 50, as the case may be, which is of the type known in the art, such as disclosed in U.S. Patent No. 4,261,111, the disclosure of which is incorporated herein in its entirety by reference in its entirety in its entirety herein In order to return the condensate to the puddles 10, 20 or 30, it is preferred that the puddles 10 or 30 are in the optimum puddle 30. The concentration of component (i) in the first component and the third component (either alone or as an azeotropic composition) or in the second aspect of the vapor zone 45 can be returned to the vessel 5 by vapor condensate to The fluid is pumped from the puddle 10 to the puddles 20 and/or 30 in the puddles and/or via a control volume or water level induction transducer (not shown) to maintain At a relatively constant concentration.

本發明不限於如上文所論述及圖1中所說明之三個聚水坑配置。實際上,亦預期兩個聚水坑配置、四個聚水坑配置。為此目的,根據本文中之教示內容、目標及優勢可使用任何數目之聚水坑。 The invention is not limited to the three puddle configurations as discussed above and illustrated in FIG. In fact, two puddle configurations and four puddle configurations are also contemplated. For this purpose, any number of puddles may be used in accordance with the teachings, objectives, and advantages herein.

圖1之容器5描繪為敞頂型去焊器或脫脂器。然而,應理解容器5(呈其示意性形式)亦可表徵內嵌型脫脂器或去焊器,其中傳送帶構件(未展示)可用於自聚水坑10將部件依次傳送至聚水坑20及30。 The container 5 of Figure 1 is depicted as an open top type de-solder or degreaser. However, it should be understood that the container 5 (in its schematic form) may also characterize an in-line degreaser or de-solder, wherein a conveyor member (not shown) may be used to sequentially transfer components from the puddle 10 to the puddle 20 and 30.

基於本文中所提供之揭示內容,額外特徵及優勢對於熟習技術者將為顯而易見的。提供以下實例說明本發明之某些實施例。其不一定限制本發明。為此目的,至少基於所提供之揭示內容,該等實施例之修改對於熟習此項技術者將為顯而易見的。 Additional features and advantages will be apparent to those skilled in the art from this disclosure. The following examples are provided to illustrate certain embodiments of the invention. It does not necessarily limit the invention. For that reason, modifications of the embodiments will be apparent to those skilled in the art, at least in light of the disclosure.

實例-第一態樣Example - first aspect 實例1 Example 1

製備包括以下各者之混合物:3wt%甲醇;92wt%至96wt%十氟戊烷(作為Vertrel®市售);及1wt%至5wt%二醇醚,其選自2-乙氧基乙醇、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必醇、卡必醇溶纖劑、二乙氧基乙烷、二甲氧基乙烷及二丁氧基丁烷。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising: 3 wt% methanol; 92 wt% to 96 wt% decafluoropentane (commercially available as Vertrel®); and 1 wt% to 5 wt% glycol ether selected from 2-ethoxyethanol, 2 is prepared. -methoxyethanol, 2-propoxyethanol, 2-phenoxyethanol, 2-benzylideneoxyethanol, methylcarbitol, carbitol cellosolve, diethoxyethane, two Methoxyethane and dibutoxybutane. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例2 Example 2

製備包括以下各者之混合物:3wt%甲醇;92wt%至96wt%氫氟醚(HFE)(作為Novec® 7200市售);及1wt%至5wt%二醇醚,其選自2-乙氧基乙醇、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必醇、卡必醇溶纖劑、二乙氧基乙烷、二甲氧基乙烷及二丁氧基丁烷。用多種商業焊接心線(諸如,Kester 44、 Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising: 3 wt% methanol; 92 wt% to 96 wt% hydrofluoroether (HFE) (commercially available as Novec® 7200); and 1 wt% to 5 wt% glycol ether selected from 2-ethoxyl. Ethanol, 2-methoxyethanol, 2-propoxyethanol, 2-phenoxyethanol, 2-benzylideneoxyethanol, methyl carbitol, carbitol cellosolve, diethoxy B Alkane, dimethoxyethane and dibutoxybutane. Use a variety of commercial welding hearts (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) soldered the printed circuit board and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例3 Example 3

製備包括3wt%甲醇及97wt%十氟戊烷(作為VERTREL® SFR市售)之混合物。隨後,使此混合物與二醇醚2-丁氧基乙醇組合,使得摻合物提供為80%且二醇醚2-丁氧基乙醇為20%。用焊錫膏Alpha OM-338PT焊接印刷電路板,隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等板為清潔的。 A mixture comprising 3 wt% methanol and 97 wt% decafluoropentane (commercially available as VERTREL® SFR) was prepared. Subsequently, this mixture was combined with the glycol ether 2-butoxyethanol so that the blend was provided at 80% and the glycol ether 2-butoxyethanol was 20%. The printed circuit board was soldered with solder paste Alpha OM-338PT, then cleaned in boiling solvent for 10 min and removed and dried. These boards were found to be clean.

實例4 Example 4

製備包括3wt%甲醇及97wt%氫氟醚(HFE)(作為Novec® 7200DA市售)之混合物。隨後,使此混合物與二醇醚2-丁氧基乙醇組合,使得摻合物提供為80%且二醇醚2-丁氧基乙醇為20%。用焊錫膏Alpha OM-338PT焊接印刷電路板,隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等板為清潔的。 A mixture comprising 3 wt% methanol and 97 wt% hydrofluoroether (HFE) (commercially available as Novec® 7200DA) was prepared. Subsequently, this mixture was combined with the glycol ether 2-butoxyethanol so that the blend was provided at 80% and the glycol ether 2-butoxyethanol was 20%. The printed circuit board was soldered with solder paste Alpha OM-338PT, then cleaned in boiling solvent for 10 min and removed and dried. These boards were found to be clean.

實例-第二態樣Example - second aspect 實例1 Example 1

製備包括3wt%甲醇、6wt%至25wt%反-1,2-二氯乙烯及72wt%至92wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 6 wt% to 25 wt% trans-1,2-dichloroethylene and 72 wt% to 92 wt% trans-1233zd was prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例2 Example 2

製備包括3wt%甲醇、1wt%至5wt%丁基溶纖劑及92wt%至96wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔 度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 1 wt% to 5 wt% butyl cellosolve, and 92 wt% to 96 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleaning of these cleaning boards degree. The panels were found to be clean.

實例3 Example 3

製備包括3wt%甲醇、1wt%至5wt%d-檸檬烯及92wt%至96wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 1 wt% to 5 wt% d-limonene, and 92 wt% to 96 wt% trans-1233zd was prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例4 Example 4

製備包括3wt%甲醇、6wt%至25wt%反-1,2-二氯乙烯及72wt%至92wt%反-1233zd之混合物。用多種商業焊接熔劑(諸如,Kester 1544、Kester 197、Kester 186及Hygrade 209)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 6 wt% to 25 wt% trans-1,2-dichloroethylene and 72 wt% to 92 wt% trans-1233zd was prepared. The printed circuit board was soldered with a variety of commercial soldering fluxes (such as Kester 1544, Kester 197, Kester 186, and Hygrade 209) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例5 Example 5

製備包括3wt%甲醇、70wt%至90wt%反-1,2-二氯乙烯及10wt%至30wt%反-1233zd之混合物。用多種商業焊接熔劑(諸如,Kester 1544、Kester 197、Kester 186及Hygrade 209)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。隨後,視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 70 wt% to 90 wt% trans-1,2-dichloroethylene, and 10 wt% to 30 wt% trans-1233zd was prepared. The printed circuit board was soldered with a variety of commercial soldering fluxes (such as Kester 1544, Kester 197, Kester 186, and Hygrade 209) and then cleaned in boiling solvent for 10 min and removed and dried. Subsequently, the cleanliness of these cleaning panels was visually observed. The panels were found to be clean.

實例6 Example 6

製備包括3wt%甲醇、1wt%至5wt%丁基溶纖劑及92wt%至96wt%反-1233zd之混合物。用多種商業焊接熔劑(諸如,Kester 1544、Kester 197、Kester 186及Hygrade 209)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 1 wt% to 5 wt% butyl cellosolve, and 92 wt% to 96 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering fluxes (such as Kester 1544, Kester 197, Kester 186, and Hygrade 209) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例7 Example 7

製備包括3wt%甲醇、1wt%至5wt% d-檸檬烯及92wt%至96wt%反-1233zd之混合物。用多種商業焊接熔劑(諸如,Kester 1544、Kester 197、Kester 186及Hygrade 209)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 1 wt% to 5 wt% d-limonene, and 92 wt% to 96 wt% trans-1233zd was prepared. The printed circuit board was soldered with a variety of commercial soldering fluxes (such as Kester 1544, Kester 197, Kester 186, and Hygrade 209) and then cleaned in boiling solvent for 10 min and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例8 Example 8

製備包括3wt%甲醇、5wt%至25wt%反-1,2-二氯乙烯及72wt%至92wt%反-1233zd之混合物。用多種商業焊錫膏(諸如Indium SMQ51AC、Alpha 390、Indium NC-SMQ92J)焊接印刷電路板。在此情況下,使用刮漿刀,經由模板在板上塗覆焊錫膏,且隨後在熱空氣刀中加熱至450F。隨後,在沸騰溶劑中將其清潔10min,且移除並乾燥。視覺觀察此等清潔板之清潔度。發現該等板為清潔的。 A mixture comprising 3 wt% methanol, 5 wt% to 25 wt% trans-1,2-dichloroethylene, and 72 wt% to 92 wt% trans-1233zd was prepared. The printed circuit board is soldered with a variety of commercial solder pastes such as Indium SMQ51AC, Alpha 390, Indium NC-SMQ92J. In this case, a solder paste was applied to the board via a squeegee using a doctor blade and then heated to 450F in a hot air knife. Subsequently, it was washed in a boiling solvent for 10 min, and removed and dried. Visually observe the cleanliness of these cleaning boards. The panels were found to be clean.

實例9 Example 9

針對各以下組成,使霧劑閥捲曲到位,且經由閥添加HFC-134a以在罐中達成約20PSIG之壓力。用Kester 1544熔劑、Kester 44、Alpha Reliacore 15及Alpha Energized Plus焊接心線焊接印刷電路板。隨後,將混合物噴塗至表面上以論證混合物是否適用作霧劑。視情況,霧劑具有不同的共霧劑或不具有共霧劑,且視情況具有至少一種選自由除臭劑、香料、噴發劑、清潔溶劑、潤滑劑、殺蟲劑及醫學材料組成之群的活性成分。 The aerosol valve was crimped into place for each of the following compositions, and HFC-134a was added via a valve to achieve a pressure of about 20 PSIG in the can. The printed circuit board was soldered with Kester 1544 flux, Kester 44, Alpha Reliacore 15 and Alpha Energized Plus. Subsequently, the mixture is sprayed onto the surface to demonstrate whether the mixture is suitable for use as a spray. Optionally, the aerosol has a different co-fogging agent or no co-fogging agent, and optionally has at least one group selected from the group consisting of deodorants, fragrances, hair sprays, cleaning solvents, lubricants, insecticides, and medical materials. Active ingredient.

實例10 Example 10

製備包括以下各者之混合物:3wt%的甲醇、乙醇或異丙醇中之 一者;92wt%至96wt%反1233zd;及1wt%至5wt%二醇醚,其選自2-乙氧基乙醇、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必醇、卡必醇溶纖劑、二乙氧基乙烷、二甲氧基乙烷及二丁氧基丁烷。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 Preparation of a mixture comprising: 3 wt% of methanol, ethanol or isopropanol One; 92 wt% to 96 wt% anti-1233zd; and 1 wt% to 5 wt% glycol ether selected from the group consisting of 2-ethoxyethanol, 2-methoxyethanol, 2-propoxyethanol, 2-phenoxy Ethanol, 2-benzylideneoxyethanol, methyl carbitol, carbitol cellosolve, diethoxyethane, dimethoxyethane and dibutoxybutane. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例11 Example 11

製備包括6wt%至25wt%反-1,2-二氯乙烯及75wt%至94wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising 6 wt% to 25 wt% trans-1,2-dichloroethylene and 75 wt% to 94 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例12 Example 12

製備包括1wt%至5wt%丁基溶纖劑及95wt%至99wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising 1 wt% to 5 wt% butyl cellosolve and 95 wt% to 99 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例13 Example 13

製備包括1wt%至5wt%d-檸檬烯及95wt%至99wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising 1 wt% to 5 wt% d-limonene and 95 wt% to 99 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例14 Example 14

製備包括3wt%甲醇、1wt%至5wt%蒎烯及92wt%至96wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising 3 wt% methanol, 1 wt% to 5 wt% terpene, and 92 wt% to 96 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例15 Example 15

製備包括1wt%至5wt%蒎烯及95wt%至99wt%反-1233zd之混合物。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising 1 wt% to 5 wt% terpene and 95 wt% to 99 wt% trans-1233zd is prepared. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例16 Example 16

製備包括以下各者之混合物:95wt%至99wt%反1233zd;及1wt%至5wt%二醇醚,其選自2-乙氧基乙醇、2-甲氧基乙醇、2-丙氧基乙醇、2-苯氧基乙醇、2-苯甲醯氧基乙醇、甲基卡必醇、卡必醇溶纖劑、二乙氧基乙烷、二甲氧基乙烷及二丁氧基丁烷。用多種商業焊接心線(諸如,Kester 44、Alpha reliacore 15、Alpha Energized Plus)焊接印刷電路板,且隨後在沸騰溶劑中清潔10min且移除並乾燥。發現此等清潔板為清潔的。 A mixture comprising: 95 wt% to 99 wt% anti-1233zd; and 1 wt% to 5 wt% glycol ether selected from the group consisting of 2-ethoxyethanol, 2-methoxyethanol, 2-propoxyethanol, 2-phenoxyethanol, 2-benzylideneoxyethanol, methyl carbitol, carbitol cellosolve, diethoxyethane, dimethoxyethane and dibutoxybutane. The printed circuit board was soldered with a variety of commercial soldering cores (such as Kester 44, Alpha reliacore 15, Alpha Energized Plus) and then cleaned in boiling solvent for 10 min and removed and dried. These cleaning plates were found to be clean.

實例17 Example 17

針對以下組成,使霧劑閥捲曲到位,且經由閥添加HFO-1234ze以在罐中達成約20PSIG之壓力。用Kester 1544熔劑、Kester 44、Alpha Reliacore 15及Alpha Energized Plus焊接心線焊接印刷電路板。隨後,將混合物噴塗至表面上以論證混合物是否適用作霧劑。視情況,霧劑具有不同的共霧劑或不具有共霧劑,且視情況具有至少一種選自由除臭劑、香料、噴發劑、清潔溶劑、潤滑劑、殺蟲劑及醫學材料組成之群的活件成分。 The aerosol valve was crimped into place for the following composition, and HFO-1234ze was added via the valve to achieve a pressure of about 20 PSIG in the can. The printed circuit board was soldered with Kester 1544 flux, Kester 44, Alpha Reliacore 15 and Alpha Energized Plus. Subsequently, the mixture is sprayed onto the surface to demonstrate whether the mixture is suitable for use as a spray. Optionally, the aerosol has a different co-fogging agent or no co-fogging agent, and optionally has at least one group selected from the group consisting of deodorants, fragrances, hair sprays, cleaning solvents, lubricants, insecticides, and medical materials. The composition of the job.

由此描述本發明之幾個特定實施例之後,熟習此項技術者將容易想到各種改變、修改及改進。雖然未在本文中明確地陳述,但如藉由本發明變得顯而易見,該等改變、修改及改進意欲為本說明書之一部 分且意欲在本發明之精神及範疇內。因此,前述描述僅借助於實例而不為限制性的。本發明僅如以下申請專利範圍及其等效物中所界定來限制。 Various changes, modifications, and improvements will become apparent to those skilled in the art of the invention. Although not explicitly stated herein, it will be apparent from the present invention that such changes, modifications, and improvements are intended to be part of this specification. It is intended to be within the spirit and scope of the invention. Therefore, the foregoing description is by way of example only and not restrictive. The invention is limited only as defined by the following claims and their equivalents.

5‧‧‧容器 5‧‧‧ Container

10‧‧‧聚水坑 10 ‧ ‧ puddle

20‧‧‧聚水坑 20‧‧ ‧ puddle

30‧‧‧聚水坑 30‧‧ ‧ puddle

35A‧‧‧聚水坑壁 35A‧‧ ‧ puddle wall

35B‧‧‧聚水坑壁 35B‧‧ ‧ puddle wall

40‧‧‧加熱器元件/加熱器 40‧‧‧heater element/heater

45‧‧‧蒸氣區 45‧‧‧Steam zone

50A‧‧‧上旋管 50A‧‧‧Upper coil

50B‧‧‧下旋管 50B‧‧‧ lower coil

Claims (10)

一種用於自部件移除殘餘污物或表面污染之方法,其包含:A)將該部件浸沒於包含以下組分之液體溶劑組合物中:(a)第一組分,包含選自由甲醇、乙醇及異丙醇組成之群的醇;(b)第二組分,選自由二醇醚、萜、鹵化烴及其組合組成之群;及(c)第三組分,選自由氫鹵醚、十鹵戊烷、及其組合組成之群;B)蒸發該液體溶劑組合物之一部分以形成包含組分(a)及組分(c)之汽化部分的蒸氣空間,且組分(b)之量足夠低以使得可燃性抑制覆蓋層存在於該蒸氣空間中;及C)在該可燃性抑制覆蓋層內乾燥該部件。 A method for removing residual dirt or surface contamination from a component, comprising: A) immersing the component in a liquid solvent composition comprising: (a) a first component comprising selected from the group consisting of methanol, An alcohol of the group consisting of ethanol and isopropanol; (b) a second component selected from the group consisting of glycol ethers, hydrazines, halogenated hydrocarbons, and combinations thereof; and (c) a third component selected from the group consisting of hydrogen halides a group of decahalopentane, and combinations thereof; B) evaporating a portion of the liquid solvent composition to form a vapor space comprising vaporized portions of component (a) and component (c), and component (b) The amount is sufficiently low that the flammability inhibiting cover layer is present in the vapor space; and C) drying the component within the flammability suppressing cover layer. 如請求項1之方法,其中組分(c)之沸點比組分(a)及組分(b)或組分(a)與組分(b)之間形成的任何共沸物或共沸物狀組合物之沸點至少高10℃。 The method of claim 1, wherein the boiling point of component (c) is any azeotrope or azeotrope formed between component (a) and component (b) or component (a) and component (b). The boiling point of the composition of matter is at least 10 ° C higher. 如請求項1之方法,其中組分(c)之沸點比組分(a)及組分(b)或組分(a)與組分(b)之間形成的任何共沸物或共沸物狀組合物之沸點至少高25℃。 The method of claim 1, wherein the boiling point of component (c) is any azeotrope or azeotrope formed between component (a) and component (b) or component (a) and component (b). The boiling point of the composition of matter is at least 25 ° C higher. 如請求項1之方法,其中組分(c)之沸點比組分(a)及組分(b)或組分(a)與組分(c)之間形成的任何共沸物或共沸物狀組合物之沸點至少高50℃。 The method of claim 1, wherein the boiling point of component (c) is any azeotrope or azeotrope formed between component (a) and component (b) or between component (a) and component (c). The boiling point of the composition of matter is at least 50 ° C higher. 一種用於自部件移除殘餘污物或表面污染之方法,其包含:A)將該部件浸沒於包含以下組分之液體溶劑組合物中:(i)第一組分,包含1-氯-3,3,3-三氟丙烯;(ii)第二組分,選自由二醇醚、萜、鹵化烴及其組合組成之群;及視情況(iii)第三組分,選自由氫鹵醚、十鹵戊烷及其組合組成之群;B)蒸發該液體溶劑組合物之一部分以形成包含組分(i)及組 分(iii)(若存在)之汽化部分的蒸氣空間,且組分(ii)之量足夠低以使得可燃性抑制覆蓋層存在於該蒸氣空間中;及C)在該可燃性抑制覆蓋層內乾燥該部件。 A method for removing residual dirt or surface contamination from a component, comprising: A) immersing the component in a liquid solvent composition comprising: (i) a first component comprising 1-chloro- 3,3,3-trifluoropropene; (ii) a second component selected from the group consisting of glycol ethers, hydrazines, halogenated hydrocarbons, and combinations thereof; and, as the case may be, (iii) a third component selected from the group consisting of hydrogen halides a group consisting of ether, decahalopentane, and combinations thereof; B) evaporating a portion of the liquid solvent composition to form component (i) and group Dividing (iii) (if present) the vapor space of the vaporized portion, and the amount of component (ii) is sufficiently low that the flammability inhibiting coating layer is present in the vapor space; and C) within the flammability inhibiting coating layer Dry the part. 如請求項5之方法,其中組分(ii)之沸點比組分(i)及組分(iii)(若存在)之沸點至少高10℃。 The method of claim 5, wherein the boiling point of component (ii) is at least 10 ° C higher than the boiling point of component (i) and component (iii), if present. 如請求項5之方法,其中組分(ii)之沸點比組分(i)及組分(iii)(若存在)之沸點至少高25℃。 The method of claim 5, wherein the boiling point of component (ii) is at least 25 ° C higher than the boiling point of component (i) and component (iii), if present. 如請求項5之方法,其中組分(ii)之沸點比組分(i)及組分(iii)(若存在)之沸點至少高50℃。 The method of claim 5, wherein the boiling point of component (ii) is at least 50 ° C higher than the boiling point of component (i) and component (iii), if present. 一種溶劑組合物,其包含(a)第一組分,包含選自由甲醇、乙醇及異丙醇組成之群的醇,(b)第二組分,選自由二醇醚、萜、鹵化烴及其組合組成之群,(c)第三組分,選自由氫鹵醚、十鹵戊烷及其組合組成之群,其中該第二組分與該第三組分不相同。 A solvent composition comprising (a) a first component comprising an alcohol selected from the group consisting of methanol, ethanol, and isopropanol, and (b) a second component selected from the group consisting of glycol ethers, hydrazines, halogenated hydrocarbons, and a group of combinations thereof, (c) a third component selected from the group consisting of hydrohalide ethers, decahalopentan, and combinations thereof, wherein the second component is different from the third component. 一種可噴塗組合物,其包含待用推進劑及包含如請求項1之組合物之溶劑噴塗的材料。 A sprayable composition comprising a propellant to be used and a solvent sprayed material comprising the composition of claim 1.
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