TW201604122A - Imprint stamp and method for producing and applying an imprint stamp - Google Patents

Abstract

The imprint rubber stamp has an area-extensive support (10) having an upper side (92) and a bottom side (91), a layer (20) of stamp material, that is connected to the support (10) and having a bottom surface, wherein the bottom surface forms a stamp surface and has a stamp surface in at least one area, and is located below the bottom side (91) of the support (10), and has a frame (50) that is located around he support (10) and is connected to the support (10). The support (10) has a perforation (80) with a plurality of recesses that each have an opening at the bottom side (91) and an opening at the upper side (92), said recesses connecting said openings.

Description

Embossing stamper and method of manufacturing and applying stamping stamper

The present invention relates to an imprint stamper, particularly in connection with a nanoimprint method, and a method of making such an imprint stamper.

The stamper side of the stamping stamp has a three-dimensional surface configuration for use as a stamper structure, the lateral extension of the stamper structure defines the stamper face, and the stamper configuration can be fed to the stamping material in a variety of ways. . When the stamper face is pressed in, the stamping material must be deformable in a method-independent manner, and the structure of the three-dimensional surface structure of the stamper surface having the forming ability can be imitated. Therefore, this molding material for producing a three-dimensional surface configuration as an embossing negative mold must have sufficient hardness to cause deformation in the embossing material under pressure, as the case may be. In addition, the stamper construction must have sufficient strength and robustness to reuse the stamper configuration without damage to the surface structure of the die face.

Different methods can be used to feed this surface structure into the imprint material. Common to these methods is that it is desirable to have complete contact with the imprint material through a uniform distribution of the force through the die face. In this case, it is necessary to prevent the influence of the bubble generation, so that the stamper surface comes into contact with the imprint material, for example, under vacuum conditions, or at a feed angle, or by a deformable device containing a soft material such as ruthenium.

The simplest case is: the corresponding hardness in the die structure, and the embossed material In the case of corresponding deformability, the stamping structure is continuously delivered to the embossing material by pure pressure. A more precise and appropriate method is based on liquid or highly viscous embossing materials, which are not yet dimensionally stable during the construction acceptance phase. In this case, the stamper configuration can be easily brought into contact with the imprint material, but curing in the imprint material is also required. The curing is carried out according to the sensitivity of the imprinting material by discharging the solvent, inputting heat, dissipating heat, or UV irradiation, or by performing such operations in combination or sequentially. That is, the stamping stamp typically needs to be in constant contact with the stamping material prior to curing the stamping material by suitable means, and the forming needs to be maintained. After curing is complete, adhesion results in difficulty in demolding the stamper construction from the cured structure in the embossed material. Among them, in view of the large surface of the stamper structure, the airtight contact, and the adhesion of the material, it is generally difficult to perform the full-surface demolding along the surface normal or in a direction perpendicular to the surface. In the case where the stamper structure is lifted from the stamping material at a certain wedge angle, and the mold release is continued in a time-shifted or positionally offset manner from a position, the demolding operation can be simplified.

When a rigid stamper with no flexibility is used, it can be transmitted through a constant or increased wedge angle. Apply the above scheme. When a stamper having a relatively high flexibility is used, there may be a mold release property which is similar to the case where the label is peeled off and has a large local difference.

The imprint method is applied in the field of semiconductor fabrication or optical component fabrication, wherein the die structure has a minimum structural size of less than 1 mm (i.e., in the micrometer range) or less than 1 [mu]m (i.e., in the nanometer range). In the case of being in the nanometer range, this method is called a nanoimprint method. In the case of today's circular wafer substrates, the substrate diameter is typically from 200 mm to 300 mm. However, the application of the nanoimprint method is not limited to specific specifications, and the nanoimprint method can also be used. Larger substrate size and any external geometry, such as for solar panels with a few square meters of area. The concepts of "imprint method" and "imprint stamper" used herein are not limited to a certain length dimension, but include embodiments and applications in the micrometer and nanometer range, especially the nanoimprint method and nanometer. Embossing stamps.

For such applications in the size range of nanoimprinting, no distortion Sex is a basic requirement because the lateral stretching of the stamper structure can result in deviations in the embossed structure, mutual position and distance after forming, which in turn adversely affects the function of the component or the embossed structure. This requirement conflicts with the flexibility of the material for feeding the stamping structure into the imprinting material in a bubble free manner, as well as for time offset and spot offset demolding through the flexible stamper.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an imprint stamper in which the imprint stamper is pressed into an imprint material in a bubble-free manner without using a vacuum as much as possible, and in stamper construction and stamping. The imprinting material is allowed to cure or harden by contact with heat, heat (i.e., refrigeration) or preferably UV illumination when the material is in contact. Another object of the present invention is to demold the stamp structure from the cured stamping material in a manner that is less risky to damage, particularly for large area specifications. For the curing operation carried out at least under the application of force, it is necessary to maintain the shape stability of the stamper structure, in particular in the case of micro-structures and nanostructures, within a distance of several 100 mm or even several meters. The imprint method is carried out in a positionally accurate and repeatable manner. Wherein, the stamper structure does not allow lateral stretching during curing, that is, it needs to have anti-distortion or low-distortion characteristics, and, in the case of repeated use, with the previous or subsequent imprinting process using the stamping stamper It should also be undistorted or only minimally distorted. Another object of the present invention is to simplify the manufacturing process and reduce the manufacturing process of such an imprinting stamper. This is done to apply the stamping stamp to a suitable stamping method by simple components and at a lower cost.

The solution for achieving the above object of the present invention is the first patent application scope. And the method as set forth in claim 10 of the patent application. Advantageous developments of the invention are referred to the dependent items.

The embossing die of the present invention has a laterally substantially planar extending carrier comprising a top surface and a bottom surface, wherein the carrier can be elastically bent in a manner that does not undergo plastic deformation until a minimum bending radius is reached, or a A bending radius smaller than the minimum bending radius. For the purpose of demolding, such a minimum minimum bending radius that does not allow plastic deformation is required in the case where a time shift or a site offset is used to cause local bending of the carrier. For the distortion-free requirements of the carrier, it is suitable to use a metal material such as stainless steel, nickel or titanium, or an anti-distortion plastic or polymer which is embodied as a film, a sheet or a fabric. The carrier preferably extends laterally in a plane or partially in a plane. "Transversely planar extension" refers to a predominantly two-dimensional extension of the carrier in one face that is a multiple of the extent (corresponding to the thickness of the carrier) in a direction perpendicular to the surface of the carrier.

Further, the stamping stamper of the present invention has a layer stack comprising a layer of stamper material or comprising at least one layer of stamper material, any number of other intermediate layers of stamper material or of another intermediate material. An intermediate layer; wherein a lower surface of the layer constituting the stamper side is provided with a layer of a stamper material having a stamper surface in at least one region of the stamper side, within the extent of the stamper surface, The stamper side has a three-dimensional surface configuration for use as a stamper configuration that is capable of performing a forming operation in a formable embossing material. The laminated stack of the stamper layer is plated on the bottom surface of the carrier in such a manner that the thickness is as uniform as possible. The die layer has an elongation of at least the ruler surface of the die The three-dimensional surface structure having the forming ability is provided in the elongation. On the side opposite the stamper side and forming the joint side, the laminate stack of the stamper material is joined to the carrier on the bottom surface of the carrier at least over the extent of the stamper surface. The laminated stack of stamper materials may have a single layer of stamper material, or have at least one layer of stamper material, any number of other intermediate layers of stamper material, or an intermediate layer of another intermediate material, such The intermediate layer is used, for example, to establish a connection with the carrier. In the case where the difference is not obvious, the material and layer of the laminated stack are understood to be a stamper material and a layer of a stamper material for the stamping stamper according to the invention. In the composite body composed of the carrier and the laminated stack of the molding material, the stamper side including the stamper surface constitutes the bottom surface of the composite body. The laminated stack of the stamper layer is at least fixedly coupled to the carrier such that, in the case of using the stamping stamper, the laminated stack of the stamper material is at least at the pressure during the demolding of the stamping material The extended region of the die face is not separated from the carrier, or the die material is not arbitrarily separated from the carrier space without deformation. The laminated stack of stamper material is preferably fixedly attached to the bottom surface of the carrier.

A material having a higher elasticity or toughness and at the same time capable of achieving a shape having a higher shape stability is particularly suitable as a compression molding material for the imprint stamper of the present invention. In particular, the stamper construction is demolded from the embossed stamping structure of the stamping material, wherein the above characteristics are very important in the case where a large load is applied to the structure in the stamper material due to adhesion. Wherein, the stamper material is preferably susceptible to elastic deformation and stretching substantially without exceeding the stretching limit (e.g., _{Rp, 0.2} ), and the stamper material preferably recovers its originality after the demolding process. shape. At the same time, the molding material must have sufficient hardness to feed the molding material into the embossing material without undesired deformation of the molding structure. Therefore, depending on the imprint method, the imprint material, and its deformability, a polymer, an elastomer, a material such as polydimethylsiloxane (PDMS) or rhodium is suitably used as the imprint stamper for the present invention. Die material.

The embossing die has a) a laterally substantially planar extending carrier comprising a top surface and a bottom surface, and b) a laminated stack comprising a layer of molding material or comprising at least one layer of molding material, Any other intermediate layer composed of a stamper material or an intermediate layer composed of another intermediate material, wherein a layer of a stamper material is provided on a lower surface of the layer constituting the stamper side, at least on the side of the stamper a region having a stamper face having a three-dimensional surface configuration for use as a stamper structure capable of performing a forming operation in the formable embossing material within the extent of the stamper face, wherein On the side opposite to the side of the stamper, the layer stack is connected to the carrier on the bottom surface of the carrier at least within the extension of the stamper surface, so that the stamper material is not freed without deformation. Spatially separating from the carrier, wherein the edge of the carrier is attached to a frame surrounding the entire periphery of the carrier, or the edge of the carrier is fixedly attached to a flexible tensioning material surrounding the entire periphery of the carrier, The flexible tensioning material is circumferentially connected to the frame at a constant or variable distance from the periphery of the carrier, wherein the connection with the carrier is performed without stress or under tensile stress, so When the carrier is displaced, the carrier migrates under tensile stress, wherein the carrier rebounds to a rest position without offset, wherein the carrier is over the entire extent of the connected stamp face The offset from the rest position may be the same or locally different within the extension of the connected stamp face.

According to one embodiment of the embossing stamp of the present invention, the edge of the carrier is joined to a frame surrounding the entire periphery of the carrier. According to a preferred embodiment of the imprinting stamp of the present invention, the edge of the carrier is fixedly coupled to a flexible tensioning material (preferably a fabric) surrounding the entire periphery of the carrier, the flexible tensioning material being The carrier is circumferentially spaced apart by a constant or variable distance. Preferably, the carrier or the flexible tensioning material is in a flat A wraparound connection to the frame in the face. The "frame" concept and the above-described arrangement for establishing a connection with the frame comprise any device adapted to: limit it to a region surrounding the entire perimeter of the carrier, or to a wrap around a distance from the periphery of the carrier. In a manner in the region, a fixed connection to the carrier or the flexible tensioning material is established in a plane, wherein at least the stamp face remains unconnected. That is, a carrier plate made of glass is also suitable, for example, for use as a frame, wherein the carrier or the flexible tensioning material is only fixed in the peripheral region of the carrier, and wherein at least the region of the carrier is not associated with the stamper Face connection.

The carrier or the flexible tensioning material attached to the carrier establishes a connection to the frame without stress or tensile stress, so that when the carrier or flexible tensioning material is stress-free, the carrier is at rest In the position, and in the case where the carrier is displaced, for example, in the plane of the stamper, the carrier is moved under the action of tensile stress, or the carrier in the rest position is established when the connection is established by the tensile stress. It is in a plane in a rest position in which the carrier rebounds to a rest position without an offset. By "stressless connection" is meant that the carrier in the rest position is not under tensile stress and that the carrier in the rest position is in a plane in the rest position. The embossing stamp of the present invention is characterized in that, in the case where the carrier is at least offset, the carrier can be at least from any rest position (which can be an unstressed rest position and is not required to be in a plane). Under the action of stress, it is elastically moved into another position without plastic deformation, and rebounds to the same static position as the above-mentioned rest position after the end of the offset, and the two identical ones offset here During the migration, the carrier is able to achieve the same position without plastic deformation. When the connection to the carrier is established in a joint plane under the action of tensile stress, the rest position of the carrier is in a plane in practice, and the spring is generated in a self-flushing position. In the case of a sexual shift, the carrier returns to the same rest position as its previous rest position after the end of the offset.

This structure is similar to the structure of a bouncing turret. The flexible tensioning material or fabric can be bonded to the screen printing frame by tensile stress by conventional techniques in screen printing. The carrier can also be bonded to the flexible tensioning material. In addition, all other suitable techniques may be employed to establish a connection between the carrier and the tensioning material, or the tensioning material, wherein it has been proven that when the carrier is connected to the tensioning material, The ground is welded through a layer made of plastic (such as polyethylene).

With this configuration, the carrier can be offset from the rest position in an elastically resilient manner along the direction of the surface normal or in a direction perpendicular to the plane of the rest position, wherein the carrier is in the absence of offset Rebound to its previous rest position. The nature of the deflection depends primarily on the mechanical properties of the tensioning material, the length of the movable tensioning material between the frame and the edge of the carrier, and the frame stress. According to one embodiment employing a flexible tensioning material, a major portion of the stress caused by the deflection is absorbed by the tensioning material as the carrier is deflected. In the case where the carrier itself is flexible, the flexibility of the structure is enhanced. The flexibility of the carrier depends primarily on the material properties and thickness of the carrier. For the embossing stamp of the present invention, a flexible carrier is preferably employed to demold from the cured embossed material or to match the surface configuration. Therefore, the carrier is preferably capable of achieving a very small bending radius without plastic deformation. To match the configuration in the micrometer range, the carrier needs to have a number of different important characteristics. First, in order to achieve the smallest possible bend radius, the thickness of the material is a decisive factor. In the case of a 180° bend, the theoretical bending radius of the outer side is equal to the thickness of the material. In order to theoretically perfectly match the carrier having a thickness of 10 μm with a semi-cylindrical structure having a height of 5 μm and a width of 10 μm (i.e., a radius of 5 μm), the minimum required bending radius of the carrier on the outer side of the carrier is 15 μm. The carrier of the stamping stamp of the present invention should not be plastically deformed after the tensile stress is applied or by bending, so as to be reused, so that the stretch property of the carrier is another standard. Technically, the extension limit R _{p, 0.2 is} used as a criterion for the extension limit, which represents a stress limit from which the material undergoes a plastic deformation of 0.2% after a stress load is applied. The elastic modulus can be used as other criteria for the elastic properties of the carrier of the imprint stamper of the present invention. In order to satisfy the requirements for the stretchability against elastic load, a material such as rubber or ruthenium may be used as the carrier, but the carrier is required to have an undistorted or low-distortion property to reduce the distortion of the stamper structure. The relative length change ε (epsilon) is a quotient definition (ε = σ / E) obtained by dividing the stress σ (sigma) by the elastic modulus E. The relative length change ε is described by the absolute length change ΔL with respect to the observed length L. Therefore, in the case where the stress σ fed to the carrier due to the deflection of the tensioned carrier is the same, the larger the elastic modulus E of the carrier, the relative length change of the relative die face length L of the die face △ L will be smaller. In the case where the stress is 20 MPa and the elastic modulus of the material is 10 GPa, the length change ΔL with respect to the length of 100 mm is 200 μm. In the case where the elastic modulus is 100 GPa, the length variation is 20 μm. For example, rubber has an elastic modulus of less than 1 GPa, so rubber is not suitable as a carrier in terms of distortion in a carrier. The elastic modulus of the glass is 50 to 90 GPa, so that the requirement for distortion-free can be satisfactorily satisfied, but the glass has almost no stretching ability, but is easily broken under tensile load or bending load. R _{p, 0.2 is} not defined for the glass because the glass cannot undergo plastic deformation of 0.2%, but the tensile strength can be used as a comparative standard, and the tensile strength can be expressed as 30 MPa. In order to have the advantage of being relatively glass-supported, the carrier of the embossing stamp of the present invention has an elastic modulus E greater than 50 GPa, preferably greater than 90 GPa, and the carrier has a stretch limit R _{p, 0.2} greater than 30 MPa, preferably greater than 100 MPa.

In order to flexibly match the carrier to the surface configuration, it is preferred that the carrier or the flexible tensioning material establish a stress-free connection with the frame or establish a connection with a lower tensile stress. It has been found practically to use tensile stresses of less than 30 N/mm ² , preferably less than 20 N/mm ² , and more preferably less than 10 N/mm ² .

There are two situations that need to be distinguished when the carrier is offset, wherein the offset from the rest position or the rest position plane may be the same throughout the extension of the connected stamp faces, or may be in the carrier The extent of the connection of the die faces of the joints varies locally.

In the first case, the offset from the rest position occurs uniformly over the entire range of the stamper surface to which the carrier is attached, so that the offset is the same throughout the range of the stamper face. The above situation is, for example, seen in the embossing process, the stamper surface is pressed over the entire surface to a substrate having a degree of extension greater than the stamper surface, and the plane of the rest position of the carrier in the frame is moved toward the substrate. A plane deeper than the surface of the substrate for the force transfer of the stamper facing the substrate such that the carrier containing the stamp face is offset relative to its rest position in the frame. In this case, the carrier is flush offset at least within the extent of the die face, wherein the offset corresponds to the distance from the plane of the substrate surface. Fixing the stamper surface with respect to the surface of the substrate, and inputting other stamper pressure or other stamper force, in this contact state, a flat plate member can be pressed from the top surface of the carrier, thereby A uniform pressing force is achieved over the entire range of the stamper face, and the desired parallelism of the opposing substrate surface is achieved upon compaction. Thereby, the offset of the carrier from the rest position required for constructing the stamper pressure can be minimized, so that the stamping material on the stamper surface and the imprinted material on the substrate are subjected to almost no tensile stress contact. In this case, it is sufficient to cure the imprint material to minimize lateral stretching in the carrier. In some cases, the carrier is required to ensure reliable contact of the stamp face with the imprint material. The maximum offset from the rest position is 0.1 mm. It is important for the imprint method using the micro-structure and the nano-structure that the carrier only occurs without hindering the accuracy requirement as if the stamper surface is pressed to the substrate with a flush offset. Small stretch.

In the case of the embossing stamp of the present invention, the amount of deflection of the carrier from the rest position is the same throughout the extension of the stamp surface in terms of the amount of elastic offset of the carrier from the rest position. In the case of 0.1 mm, the transverse relative stretch ε = ΔL / L of the carrier in the maximum elongation L of the die face is less than 0.001, preferably less than 0.0001, and particularly preferably less than 0.00001.

In the case where the same degree of elastic deflection occurs in the range of the entire die face from the rest position as described above, and/or the top plate is pressed with a flat plate to apply additional die pressure, The maximum lateral extent of the embossing stamp of the present invention within the maximum extent of the stamp face is preferably less than the minimum dimension of the formable three-dimensional surface configuration within the stamp face.

In the second case, the offset is locally different within the extent of the die face to which the carrier is attached, which occurs in particular during the demolding process.

When the stamper is demolded from the cured imprint material on the flat substrate, it is necessary to distinguish between different demolding layouts. In the following, the rigid stamper which is fixed in the device with little flexibility or bending resistance is used as a starting point. For further observation, a wedge angle between a plane of the surface of the substrate and a plane of the stamper surface is defined, wherein the wedge angle is 0° when the planes are parallel to each other, and the wedge angle is when the planes are perpendicular to each other It is 90°. In the first case, the stamper containing the stamp face having a wedge angle of 0° (i.e., parallel to the surface of the substrate) is removed in a manner perpendicular to the surface of the substrate. Depending on the specific surface configuration, higher adhesion may occur in this case, and this adhesion needs to be overcome in order to perform demolding. In the second case, the stamper is first removed from the substrate from one side or from a point until between the plane of the substrate surface and the plane of the stamp face A wedge angle of a certain angle is generated, and then the stamper is removed from the surface of the substrate in a vertical direction while maintaining the wedge angle. In this way, the demolding can be carried out in sections and the demolding can be continued in the demolding front end in terms of space. The shear force resulting from the wedge angle facilitates the release process because such demolding causes the stamp to be peeled from the cured structure in the imprint material in a localized and time-continuous manner, and thus Compared to the case of full-face demolding, the adhesion to be overcome on the front end of the wedge corner is reduced. In the third case, starting from one side or from a point as in the second case, and demolding from 0° with a continuously increasing wedge angle until the stamp is completely from the imprint material Separation. To achieve this third scenario, the stamper can be rotatably secured in a simple device by a single-axis hinge that allows the stamp to be at 0° (i.e., parallel to the surface of the substrate) relative to the surface of the substrate. The arrangement is made and, for example, arranged at 90° to the surface of the substrate. Wherein, the stamper is rotatable within an angular range of the hinge. In the case where the substrate is in a corresponding arrangement, the imprint process can be carried out in a 0° position, wherein the substrate can also have the ability to move in the vertical direction towards the stamp to produce the pressure required for the stamping process. To perform demolding, the stamper located in the apparatus is caused to rotate the substrate from a 0° angular position to a larger opening angle, thereby maintaining a wedge angle between the substrate and the stamper according to the distance between the hinge and the stamper. Increase. The maximum angle at which the demolding is completed is related to the characteristics of the imprint material and the characteristics of the stamper, and the maximum angle may be from 0 to 90.

Combinations of the above may occur in practice, or may be arbitrarily combined in a specific application.

It is basically necessary to perform demolding through the stamping stamp of the present invention in a similar manner in the above three cases. However, in the case of the carrier connected to the laminated stack of the stamper layer within the extent of the die face, the connection of the carrier to the frame has flexibility and resilient properties, so In each of the demolding schemes, local wedge angles occur during demolding.

In the first case, the tensioning frame (with the tensioning plane of the carrier parallel to the plane of the substrate surface) is removed from the substrate surface in a direction perpendicular to the surface of the substrate during the demolding process. The distance between the plane of the tensioned carrier and the surface of the substrate is referred to as bounce. Due to the flexible tensioning and flexible bending properties of the carrier, the die face is not simultaneously demolded in a synchronized manner, but first the carrier is brought from its rest position in the frame over the entire extent of the die face. Offset until the spring force on the edge of the die face is sufficient to begin demolding in a manner that overcomes adhesion. Part of it will produce a wedge angle. The demolding is continued while maintaining the distance of the frame from the surface of the substrate and a demolding front end is formed until the force balance is reestablished, wherein the wedge angle is reduced. In the case where the distance between the frame and the surface of the substrate is further increased, the offset of the carrier is further increased in the region of the stamper surface that has not been demolded, thereby further increasing the local wedge angle of the stripping tip. And the stripping front is further advanced toward the center of the die face until the demolding is completed and the carrier is repositioned in its rest position in the tensioning frame. Thereby, even in the first arrangement described above, the advantages of the local shear force and the advantage of the continuous peeling of the stamping material from the cured stamping material by the stamper can be utilized. These release characteristics of the partial release front end are similarly exhibited in the conventional arrangement and combinations thereof, since the offset of the carrier from the rest position can be the same throughout the extension of the connected die faces Or locally varies within the extent of the connected stamp face, wherein the carrier rebounds to the previous rest position without offset.

According to one embodiment, the carrier of the stamping stamp is in the form of a film. For example, compared to fabrics, thin films have the advantage of less thickness fluctuations. In the case of fabrics, a local thickness maximum occurs at the entanglement point of the yarn, which is twice the thickness of the yarn itself. Maximum thickness and minimum thickness The deviation of the values is 100% of the minimum thickness. In the case of special fabric types, such as calendered fabrics, the thickness at the entanglement point can be reduced by the partially flattened yarn, wherein the thickness maximum and the minimum thickness deviation are usually not less than the thickness 25% of the minimum. For films commonly used in the art, thickness fluctuations need to be less than 25% of the average thickness. For the embossing stamper, the surface on the bottom surface of the carrier preferably has a flatness, wherein the laminated stack of the stamper material is disposed on the surface through the stamper surface. On this side, even in the case where the laminated stack of the plated stamping material is over-flated to the over-construction of the carrier, the configuration may evenly align the stamping structure during the stamping process. The pressure distribution has a negative impact. In the case of, for example, inputting pressure from the top surface of the carrier, the surface projection of the carrier exerts a greater load on the stamping structure than the surface depression, thus on the one hand it may lead to errors in the imprinting reflection, on the other hand This can result in faster wear of the stamp structure on the surface bumps. In particular, when the fabric is used as a carrier, it is necessary to pay attention to whether or not the above situation occurs at the entanglement point. According to an advantageous embodiment of the embossing stamp of the invention, preferably at least the surface on the bottom surface of the carrier has a good flatness, wherein at least in the surface profile on the side of the stamper, Within the extent of the die face, the surface maximum of the surface profile deviates from the surface minimum by less than 25% of the average thickness of the film, thereby exhibiting the advantage over the calendered fabric.

The thickness of the film suitable for use as a carrier may be, for example, several micrometers, depending on the particular material. The minimum thickness is primarily limited by manufacturability, stability, and processing capabilities. The thinner the film, the more flexible the carrier can be, and the better the carrier can match the surface configuration on the substrate. The thickness of the carrier is preferably less than 30 μm, more preferably less than 20 μm, still more preferably less than 10 μm, in terms of flexibility characteristics and compatibility with the microstructure. The thicker the film, the higher the stability of the carrier in the application, and, for example, the greater the elastic force that is applied through the stamping die during the demolding process. The optimum design for the thickness of the carrier depends on the material properties, including criteria for flexibility, bending ability, elasticity, stability and strength. In order to utilize the effect of the demolding tip during the demolding process, the maximum thickness is preferably at most 200%, and most preferably at most, in terms of advantageous bending properties, compared to the largest projection of the protruding surface of the construction. 100%, further preferably up to 50%, depending on the elastic properties of the materials employed. With regard to the material used for the carrier and embodied as a film, the maximum thickness depends on the requirement for the bending radius which is present when the film is used as a carrier for the embossing stamp of the invention. The bending radius that the film needs to achieve during the elastic deformation process so as to rebound back to the initial state in a manner that does not undergo plastic deformation. That is, the smaller the bending radius, the larger the deformation load. The carrier must be capable of achieving at least a minimum bend radius without plastic deformation, which is the minimum bend radius at which the demolding is carried out in the first demolding situation, wherein at least means that the carrier is preferably also A bending radius that is less than the minimum bending radius. In this case, in a stage immediately before the completion of the complete demolding, there is a central region (the last center point in the case of demolding) in which the die face has not been demolded, The outer region of the die face surrounding the central region has been demolded. Therefore, at this stage, the offset of the carrier within the extension of the connected stamp face is partially different, and in the vertical viewing section passing through the center, the offset is approximately equal to the arc segment. And, the carrier is deformed with a minimum bending radius, which is a bending radius at least that the carrier needs to achieve without plastic deformation. The radius of curvature depends on the height of the buckling of the clamping frame, i.e. the distance between the plane of the stamp face and the plane of the surface of the imprint material. The larger the buckling in the extreme case of demolding, the smaller the bending radius, since the deformation load increases as the bounce increases. The greater the adhesion, the greater the bounce needs to be at the limit of demolding. In general technical applications, bounces of up to 2 mm are used, and in special cases, bounces of 4 mm, 10 mm or 20 mm are also used. For example, when applied to a semiconductor substrate, the minimum bending radius that the carrier needs to achieve without plastic deformation is: 2mm, preferably 4mm, 10mm, 20mm at the limit of demolding. In the case, the bending radius of the maximum elongation (300 mm, preferably 200 mm, 100 mm) of the stamper surface. In general, the carrier needs to be deformable with a minimum bending radius or a bending radius smaller than the minimum bending radius within a range of its maximum displaceable length without plastic deformation, wherein the minimum bending radius is A limit case for the offset _Zmax of the carrier, wherein the stamper surface and the cured pressure are before the point at the center of the stamper surface is to be separated from the cured imprint material in a manner resistant to adhesion. a central region of the printed material connection (in the extreme case, a point located at the center of the stamper surface) from the rest position, in the case where the stamping stamper is spaced a distance from the rest position of the carrier in the vertical direction, The offset is offset in a manner that resists the ultimate adhesion between the stamp face and the cured imprint material.

According to a further development of the invention, the carrier has a light-transmissive perforation in the region of the stamp face. The perforations are formed by at least one or more recesses in the carrier, the recesses being accessible from the top surface of the carrier to the bottom surface so that light can pass from the top surface to the bottom surface. The notches can be arranged in any irregular pattern or in a regular arrangement. The photosensitive imprint material can be cured by using light in a certain wavelength range during the imprinting process through the perforations provided in the region of the stamper surface that is fixedly coupled to the carrier. Wherein, during contact between the imprinting stamp and the imprinting material, the UV-curable imprint material is irradiated with UV light from the back side of the carrier, and the UV light passes through the perforation in the region of the stamper surface. The bottom surface of the stamp is reached and touches the imprint material, and the imprint material is hardened in situ. The above scheme is preliminarily provided that the mold material and the intermediate material of the laminated stack are translucent to the desired wavelength range, and Less sufficient absorption is provided so that light having a desired wavelength can reach the imprint material from the top surface of the carrier through the molding material and the intermediate material of the laminated stack with sufficient strength. Therefore, the carrier has a light transmitting region and a light shielding region without a notch.

When a fabric is used, the fabric opening is translucent and the yarn is positioned above the shaded area, wherein the openings are typically in a fabric-like, regular arrangement. Where the film is used as a carrier, the notches can be of any arrangement, geometry and elongation. The notches can be made from the carrier by conventional techniques such as etching, drilling, laser cutting, erosion or stamping. Other solutions for implementing a carrier comprising a recess are: structuring the carrier with a recess, for example by casting, injection molding, electroplating or weaving.

For the photosensitive hardening process, a light-transmissive carrier such as a stainless steel film is not initially considered. Even if the perforation itself is not suitable for hardening the imprint material by light action, the masked area cannot be directly irradiated with light.

However, the present inventors have unexpectedly discovered that the photosensitive imprint material can be cured even in the shaded areas. On the one hand, depending on the reflective power of the surface of the substrate, the masked regions are illuminated by light reflection. However, the above scheme is limited when there is no reflection capability on the surface of the substrate.

On the other hand, the arrangement, geometry and elongation of the notches are preferably selected in such a manner that the region of the imprint material that is under the stamp surface and that is shielded by the carrier is sufficiently transmitted through the scattered light. Irradiation. This scattering effect can be further enhanced by geometric and material properties. In one aspect, the surface of the carrier can be constructed in the recesses in such a manner that the surface has a higher light reflection and light scattering effect. For this purpose, for example, it is particularly suitable to use a smooth metal surface. Furthermore, the surface of the carrier in the recess may have embossing, configuration or roughness that is capable of scattering light in different directions. The surface profile of the sidewalls of the recesses may have a shape Shaped so that light incident perpendicular to the top surface of the carrier is reflected and scattered to a higher degree than the direction perpendicular to the vertical direction. In the case where the fabric is used as a carrier, the circular shape of the yarn supports reflection of light incident from the top surface of the carrier in different directions due to the curvature of the yarn surface. In an embodiment in which the film is used as a carrier, the sidewalls of the notches may have a slope with respect to a vertical direction, so that the openings of the notches on the top surface of the carrier are larger than the openings of the notches on the bottom surface. Therefore, the light incident perpendicularly from the top surface is laterally reflected on the side wall, and the shielding area is irradiated on the bottom surface. Furthermore, the contours of the side walls of the recesses may be concave or convex, or may be implemented as any combination of concave or convex contours to produce scattering and reflection effects.

The scattering effect can be further enhanced to illuminate the shaded area by hardening the embossed material by illumination, using at least one undirected light source that does not emit parallel light, or specifically selecting a different vertical The direction of illumination in the direction of the plane of the carrier, thereby forcibly reflecting incident light in a direction on the sidewalls of the recesses, the direction being adapted to illuminate the shaded region on the bottom surface of the stamp face.

According to another embodiment, the carrier material has sufficient permeability for the wavelength used to cure the imprinted material.

Furthermore, the perforations in the region of the die face are also advantageous in terms of the strength of the bond stack of the stamper material to the carrier. According to another embodiment of the embossing stamp of the present invention, the cured material of the laminated stack of stamper materials is located within the recess of the perforations. Thereby, in addition to being attached to the bottom surface of the carrier, the laminated stack of the molding material is also anchored to the carrier, so that the molding material is compared to the case where the anchoring is not used, for example, when demolding is performed. The connection of the stack to the carrier is resistant to greater forces. The anchoring effect can be further enhanced, wherein the recesses in the carrier are in such an embodiment that the recess is located on the bottom surface of the carrier The cross section of the opening is smaller than the cross section of the recess above the opening on the bottom surface, so that the laminated stack of the molding material is disposed on the bottom surface of the carrier and from the bottom surface of the carrier through the recess on the bottom surface For the cured material whose opening extends into the recess, even if there is no surface adhesion to the carrier, the cured material is not arbitrarily separated or separated from the carrier space without external force or deformation. The laminated stack of stamper material on the bottom surface of the carrier is anchored to the carrier at least within the extent of the die face.

In an embodiment of the carrier having perforations, the stamp face may also be anchored in a manner that the carrier is embedded in a stack of stamper materials on the bottom surface and a material on the top surface of the carrier. And wherein the laminated stack of the molding material is fixedly coupled to the material on the top surface through the recesses. For example, the material of the laminated body of the stamping material on the bottom surface of the carrier is fixedly connected with a material on the top surface of the carrier, or is melted and integrated, wherein the material on the top surface of the carrier is Having a thickness of a material, and the opening of the material around the recess is greater than the largest cross-section of the corresponding recess, and the material passes through the opening of the recess on the top surface into the recess until it reaches The material of the laminated stack of stamper materials on the bottom surface. Preferably, the material on the top surface and the recess and the material of the laminated stack of the molding material on the bottom surface of the carrier are composed of the same material.

In this case, the material on the top surface should have a minimum thickness such that the material of the laminated stack of the molding material is disposed on the bottom surface of the carrier in the region of the molding surface and through the recess The material connection on the top surface of the carrier does not arbitrarily separate from the carrier space without external force or deformation.

In the embodiment in which the laminated stack of the molding material is anchored, even if the material of the laminated material of the molding material is not attached to the surface of the carrier in the region of the molding surface The function of the imprinting stamp can also be maintained by the surface separation caused by the demolding force, because the anchoring of the intermediate material or the mechanical connection of the stamping material to the carrier is maintained, and the mechanical connection is mainly used. To achieve integration in the demolding process.

By definition, even in the case where the stamped surface is surrounded or surrounded by a direct adjacent manner, the area under the recess and the depression in the recess in the carrier that is not on the recess opening in the carrier bottom surface The portion of the mold material or the intermediate material that is closedly covered is not generally considered to be a stamper surface, since such a region has no three-dimensional surface configuration in the stamp layer, such regions are not suitable for the stamping of the stamp structure.

According to another embodiment of the embossing stamp of the present invention, the carrier has one or more recesses that are not closed by the die material or the intermediate material on the recess opening on the bottom surface, and the recesses therein The inside is not closedly filled with a molding material or an intermediate material, and the notches are not closed by the material on the recess opening on the top surface, so air can pass through the side of the molding surface. The recess reaches the top surface of the carrier. Preferably, a plurality of such open, ventilated recesses that are not part of the die face are disposed in the die face to prevent air bubbles during the process of causing the stamping die to contact the embossing material, in particular The air under the surface of the stamper can be dissipated through the gas permeable recesses.

The invention also relates to a method of making the above-described embossing stamper, wherein the method comprises the steps of: providing a layer of forming material of a molding material, or providing a layer of molding material having a forming ability and at least a laminated stack of intermediate layers having a connecting side and a die side, providing a laterally extending carrier comprising a top surface and a bottom surface, the carrier having an extent greater than the extension of the stamp surface, The extension of the die face needs to be completely extended by the carrier Covering, the edge of the carrier is connected to a frame in such a manner as to surround the entire periphery of the carrier, or the edge of the carrier is connected to a flexible tensioning material around the entire periphery of the carrier, and The flexible tensioning material is connected to a frame in such a manner as to be circumferentially spaced from the periphery of the carrier, wherein the connecting operation is performed without stress or under tensile stress, so that the carrier is biased When moving, the carrier migrates under the action of tensile stress, wherein the carrier rebounds to a rest position without offset, wherein the carrier needs to be elastically rebounded to a shape without plastic deformation. When the shape is achieved, the carrier is offset from the rest position from a rest position within the entire extent of the stamp face, the offset being the same throughout the extent of the stamp face, or The elongation of the die face is partially different, and the carrier containing the layer of the molding material having the forming ability is arranged such that the elongation of the die face is completely The elongation of the carrier is covered, and the bottom surface of the carrier is brought into contact with the layer or stack of the molding material having the forming ability, so that the first layer or the laminated stack of the molding material having the forming ability is connected to the carrier On the bottom surface, or not spaced apart from the carrier by any space distance, on the stamper side of the layer of the mold material having the forming ability, three-dimensionally used as an imprinting negative mold in the elongation of the stamper surface Surface structure.

According to a first embodiment of the method of the invention, the layer of stamping material can have the three-dimensional surface configuration prior to establishing a connection with the carrier, wherein the three-dimensional surface texture is previously produced by any of the methods of the prior art. The layer of stamping material is embodied, for example, as a film. According to one embodiment, the compression molding material can be directly or through an intermediate layer, for example, by adhesion or lamination. The connecting side of the material is connected to the carrier. The connection of the layer or stack of the mold material having the forming ability is measured as the side opposite to the stamper side of the layer. The laminated stack may have a single layer of molding material having a forming ability, or a layer of at least one molding material of molding ability, any number of molding materials having another forming ability or another intermediate material. Other intermediate layers, for example for establishing a connection with the carrier. According to another embodiment, the three-dimensional surface configuration is produced on the side of the stamper after the layer stack is connected to the carrier, wherein the three-dimensional surface configuration is produced by any of the methods of the prior art.

According to a preferred embodiment of the method, the three-dimensional surface structure is produced on the stamper side of the layer of the mold material having the forming ability by profiling a main surface having the surface of the stamper The implementation within the elongation is a three-dimensional surface configuration of the imprinted male mold. In this case, the method includes the steps of providing the main surface, contouring the main surface, and releasing the layer of the moldable material having the forming ability from the main surface. To profile the main surface, the layer of the molding material having the forming ability is plated onto the main surface in an uncured state, the layer reflecting the surface of the main surface on the side of the stamper Constructed and cured in contact with the major surface.

In order to establish a connection between the carrier and the laminated stack of the molding material having the forming ability, the carrier is brought into contact with the connecting side of the laminated stack of the molding material having the forming ability by the bottom surface thereof, wherein The material is cured on the joined side of the laminated stack during the contact of the bottom surface, so that the material exhibits a stable shape on the joined side of the laminated stack of the molding material having the forming ability and is connected to the carrier.

According to another embodiment, the layer of the molding material having the forming ability in the solid state is brought into contact with the main surface, and the molding material is temporarily liquefied to the main table. The surface is contoured such that the mold material having the forming ability reflects the surface structure of the main surface on the side of the stamper in the stamper surface, and re-solidifies the layer of the mold material having the forming ability. According to another embodiment, a molding material having a molding ability in a solid state on a side of a stamper is pressed into a surface configuration of the main surface such that the molding material is plastically deformed and reflected in the molding material. The surface structure of the main surface.

In the curing step, the layer of the molding material having the forming ability can be cured by discharging the solvent, heating, dissipating heat or light. The carrier is preferably embodied as a film.

According to a further development of the method for producing the above-mentioned embossing stamper, the carrier has a light-transmissive perforation, wherein the perforation consists of at least one or more recesses in the carrier, the recesses being from the carrier The top surface reaches the bottom surface so that light can reach the bottom surface from the top surface of the carrier. Illumination is carried out from the top surface of the carrier through the light-transmissive perforations of the carrier, so that the uncured photosensitive molding material can be cured by illumination.

According to another embodiment of the method, the carrier is immersed in the moldable or uncured mold material or intermediate material by the bottom surface, and the degree of immersion is at least a small portion of the thickness of the carrier or the entire thickness of the carrier. The molding material and the uncured mold material or intermediate material are caused to extend into the perforations of the perforations of the carrier or through the notches to the top surface of the carrier and thereby anchor with the carrier. By "uncured" it is meant herein that the stamp material or intermediate material is plastically deformable, which is capable of changing shape with the stamper, the three-dimensional surface configuration or the perforations of the carrier under force, and reflecting the surface under ideal conditions, wherein This shape does not need to be stable under normal environmental conditions.

According to a further development of the method, in a further processing step, a second layer of a second coating thickness of the second material is plated onto the surface of the carrier and is liquid-plated. The second layer is cured such that a portion of the second material passes through the perforations in contact with the material of the laminated stack of the molding material. The second material is preferably plated in an uncured state. According to one embodiment of the improvement, the second material, which is solid, for example in the form of a film, can also be plated, and the second material can be temporarily liquefied and re-solidified to form the molding material. The material of the laminated stack on the bottom surface of the carrier establishes a connection. For light in a certain wavelength range suitable for curing the imprint material during illumination, the permeability of the second material is preferably not zero. When the second material is plated, a layer thickness and at least one extent around the recess are used, the extent being greater than the largest cross section of the corresponding recess. When the second layer is applied, the material of the second layer is brought into contact with the material on the bottom surface and/or the recesses through the recesses. At the latest when curing is carried out, the material of the laminated material of the second material and the molding material is mixed in at least one partition, thereby producing a mixed material in the partition after curing. Preferably, the second layer of the second material in a liquid state is plated prior to hardening the molding material or the intermediate material to facilitate coating the second material plated from the top surface in the hardening step. The molding material or intermediate material is hardened together and a fixed connection is established between the second material and the molding material or intermediate material. This hardening operation is preferably carried out using light in a certain wavelength range suitable for curing the stamper material, intermediate material and other materials. The second material plated from the top surface is preferably also composed of a mold material or an intermediate material having a forming ability of the laminated stack of the stamper layers. When plating from the top surface, the second material preferably has a certain layer thickness and elongation such that the carrier is at least in the region of the stamper surface by the material of the stack on the bottom surface, at the top surface The second material above, the laminated stack material or other materials located in at least one of the recesses are embedded.

The stamper of the present invention can be applied to produce a three-dimensional surface structure in an imprint material The embossing method comprises the steps of: providing an embossing material having a forming ability, which is preferably embodied as a layer on a substrate - arranging an embossing stamp having a transverse plane An extended carrier comprising a top surface and a bottom surface, - a laminated stack comprising a layer of molding material, or comprising at least one layer of molding material, any number of other intermediate layers of stamping material or another intermediate material An intermediate layer is formed, wherein a layer of a molding material is provided on a lower surface of the layer constituting the stamper side, and has a stamper surface in at least one region of the stamper side, within the extent of the stamper surface The stamper side has a three-dimensional surface configuration capable of performing a forming operation in the formable embossing material - wherein the laminate stack has an elongation at least on the side of the stamper on a side opposite the stamper side Within the range and the carrier are connected on the bottom surface of the carrier, so that the molding material is not arbitrarily separated from the carrier space without deformation, wherein the edge of the carrier is surrounded by the entire periphery of the carrier Frame connection Or, the edge of the carrier is fixedly attached to a flexible tensioning material in a manner surrounding the entire periphery of the carrier, the flexible tensioning material being circumferentially connected to a frame at a constant or variable distance from the periphery of the carrier. Wherein the connection to the carrier is carried out without stress or under the action of tensile stress, so that when the carrier is displaced, the carrier undergoes migration under the action of tensile stress, wherein the carrier is unbiased Rebounding to a rest position in the case of a shift, - pressing the stamper face of the embossed female mold having the three-dimensional surface configuration into the embossed material, wherein the carrier is over the entire extent of the connected stamper face The offset from the rest position is the same, - demolding the stamp face from the stamping material having the forming ability, wherein the offset of the carrier from the rest position is locally different within the extent of the connected stamp face.

According to one of the embodiments of the method, the liquid imprint material is plated on the substrate, the imprint material is susceptible to deformation, or the imprint material needs to be hardened to maintain the shape. In this case, the method includes another hardening step for the imprint material. The hardening operation can be performed by discharging the solvent, inputting heat, dissipating heat, or illuminating (for example, UV light). This hardening operation is performed while the stamper face is pressed into the imprint material. In the case of hardening with light, perforations in the carrier are preferably provided in the stamper face of the stamping stamp, and a stamper material and an intermediate material which are translucent to a desired wavelength are provided. The embossed material is cured by illuminating the embossed material from the top surface of the carrier with light of the intensity and wavelength required for curing through the recesses. The pressure for pressing the stamp face into the stamping material can be achieved by force transmission during tensioning of the carrier, in particular, the plane of the carrier is in contact with the stamper surface with the stamping material Offset from the rest position in the frame. To press the stamp face into the stamping material, an external pressure is preferably applied from the top of the carrier surface facing the stamper surface, wherein the stamping material is preferably cured without offset. Alternatively, the offset of the carrier from the rest position in the frame employed in performing the curing is only used to ensure contact of the die face with the die material.

For example, the stamper can be pressed into the stamping material from the top surface of the carrier by means of a roller, a flat plate or a squeegee, and the external pressure can be applied without the carrier being offset from its rest position in the frame. To the die face. The flat sheet is preferably constructed of glass or another light transmissive material for curing the embossed material through illumination through the perforations in the panel and carrier. The demolding can be carried out using the demolding layout described above. According to another embodiment of the method of producing a three-dimensional surface structure in the imprinting material, after the stamper is pressed into the layer of the imprinting material on the auxiliary substrate, the imprinting material is not cured in situ, but The imprint material is transferred to the substrate for hardening. To this end, a layer of flowable embossing material is placed between the three-dimensional surface configuration of the stamper face and the auxiliary substrate, so that a stamping material coating is applied to the stamper face. The stamp face is pressed into the layer of imprint material on the auxiliary substrate to be hardened by the desired three-dimensional surface configuration. Separating the embossed material layer in a separating step prior to the hardening operation, wherein the embossing stamper and the embossed material layer have a first portion having a three-dimensional surface configuration, and the auxiliary substrate and the embossed material The second portions of the layers are separated from each other. In the transferring step, the first portion of the embossed material layer having a three-dimensional surface configuration is pressed against the surface of the substrate to transfer the first portion of the embossed material layer to the surface of the substrate. In the hardening step, the first portion of the layer of imprint material is cured on the surface of the substrate. Wherein the attachment of the first portion of the layer of imprint material having a three-dimensional surface configuration is completed in the transferring step or the hardening step.

The invention and the technical environment will be further described below in conjunction with the accompanying drawings. It should be noted that the drawings, which are not to scale, illustrate several embodiments of the invention, but the invention is not limited thereto.

1‧‧‧imprint stamper

10‧‧‧ Carrier

11‧‧‧The area of the carrier with the die face

12.‧‧‧Side sidewalls with embossed construction

13‧‧‧Slanted sidewalls of the opposite surface normal to the notch

14‧‧‧ Opening of the notch on the underside of the carrier

15‧‧‧The opening of the notch on the top surface of the carrier

15b‧‧‧The opening of the notch on the top surface of the carrier

16‧‧‧Side sidewalls with concave contours

17‧‧‧The opening of the notch on the underside of the carrier

19‧‧‧ Any of the carriers located above the bottom surface of the carrier and facing the top surface of the carrier

20‧‧‧Molding material, a layer of stamping material in a laminated stack of stamping materials and intermediate materials

20b‧‧‧Other materials

21‧‧‧The area covered by the carrier

22‧‧‧Intermediate material, intermediate layer in a laminated stack of stamping materials and intermediate materials

23‧‧‧Material mixture areas, mixed materials

29‧‧‧Material mixed areas, mixed materials

30‧‧‧Molded surface, the extension of the die face, a three-dimensional surface structure used as a die structure on the die side in the die material

33‧‧‧The central area of the die face, in the extreme case, the point at the center of the die face

35‧‧‧Three-dimensional surface structure with forming ability in the die face, die structure, embossing die

36‧‧‧Compressed three-dimensional surface structure, imprinted structure in imprinted material

40‧‧‧Flexible tensioning materials, such as fabrics

50‧‧‧ Connection area of carrier or flexible tensioning material to fixed frame

60‧‧‧Frame, tensioning frame

70‧‧‧ Connection area between carrier and flexible tensioning material

80‧‧‧Perforation of the carrier

81‧‧‧Regular arrangement of perforated notches

82‧‧‧ Irregular arrangement of perforated notches

85‧‧‧Perforated rounded notches

86‧‧‧Perforated notches of any shape

87‧‧‧ a notch

87b‧‧‧ a notch

87c‧‧‧ a notch

88‧‧‧ a notch

88b‧‧‧ a notch

88c‧‧‧ a notch

91‧‧‧Bottom of the carrier

92‧‧‧ top surface of the carrier

100‧‧‧ Surface of the substrate

110‧‧‧The resting position of the substrate in the plane

120‧‧‧A plane of offset of the carrier over the entire extent of the die face

150‧‧‧ interface of two materials

210‧‧‧Carrier offset

220‧‧‧Carrier offset

230‧‧‧Carrier offset

250‧‧‧Space distance between the carrier and the die material, intermediate material or other material located in the recess

251‧‧‧Space distance between the carrier and the die material or intermediate material on the underside of the carrier

300‧‧‧ The direction perpendicular to the surface of the stationary position of the carrier, the direction of the surface normal of the tensioning plane of the carrier

310‧‧‧The direction of movement of the frame during demolding

350‧‧‧ force direction F ₁

351‧‧‧ force acting in the direction of F ₂

600‧‧‧Light source

620‧‧‧The reflected beam of the light source

610‧‧‧ Beam of light source into the area covered by the carrier

630‧‧‧Light source reaching the imprinted material beam

700‧‧‧ Imprinted material

800‧‧‧Substrate

810‧‧‧Sheet on the top surface of the carrier, glass plate

1 is a view of a top surface of an imprint stamper in the first embodiment; FIG. 2 is a cross-sectional view of the stamp stamper in the first embodiment; and FIG. 3 is an imprint stamper in the second embodiment. Cross-sectional view of FIG. 4 is a cross-sectional view of the stamping stamper in the second embodiment; Figure 5 is a top plan view of a top or bottom surface of the stamping stamp in the region of the stamper surface in an embodiment; Figure 6 is a partial cross-sectional view of the stamping stamp in another embodiment; A partial cross-sectional view of an imprinting stamper in another embodiment; FIG. 8 is a partial cross-sectional view of an imprinting stamper in another embodiment; FIG. 9 is a partial view of an imprinting stamper in another embodiment Cross-sectional view; FIG. 10 is a partial cross-sectional view of an imprinting stamp in another embodiment; and FIGS. 11a-d are cross-sectional views of one embodiment of a method of producing a three-dimensional surface texture in an imprint material on a substrate. Sectional view.

1 and 2 are a plan view of the stamping stamp 1 and a cross-sectional view of the stamper in the first embodiment, respectively. The embossing stamp 1 has a carrier 10 which can be embodied, for example, as a woven or film. A laminated stack of stamper material 20 is attached to the bottom surface 91 of the carrier 10, wherein the laminated stack consists of only one layer of material. Within the extent of the molding material 20 on the carrier 10, the stamp face 30 has a degree of elongation within which the layer of the stamp material 20 has a formable three-dimensional surface configuration. The carrier 10 is attached to the flexible tensioning material 40, such as a fabric, within the attachment region 70 in a manner surrounding its perimeter. In other embodiments, the molding material 20 can also be located on the flexible tensioning material 40, with the important feature that the molding surface 30 is located within the extent of the carrier. The flexible tensioning material 40 is attached to the fixed frame 60 in a stress-free manner within the attachment region 50 or is tensioned under tensile stress. In the present embodiment, the flexible tensioning material 40 is joined to the partitions of the surfaces of the frame members. The flexible tensioning material 40 can be joined to the frame 60 in any manner, with the important that the flexible tensioning material is at a certain tensile stress, at least when a certain minimum offset occurs. In the following case, when the carrier 10 is offset from its rest position, the carrier rebounds to its rest position after the end of the offset.

3 and 4 are cross-sectional views of the stamping stamp 1 in the second embodiment. Here, the carrier 10 is not connected to the flexible tensioning material 40, but is directly connected to the frame 60 in the connection region 50. These figures show the state of the carrier 10 after it has been offset from its tensioned rest position. 3 shows an offset 210 relative to the bottom surface 91 of the carrier 10, wherein the entire extent of the stamp face 30 has an offset 210 in the vertical direction 300 relative to the plane of the carrier in the rest position 110. The carrier is located in the plane 120 over the entire offset of the die face. This case discloses an application example of the stamping stamper 1 in which the stamper face 30 comes into contact with the surface 100 over its entire extent, for example in order to carry out the stamping process. In terms of absolute values, the offset 210 in FIG. 3 is smaller than the offset 230 in FIG. The amount of offset z(x) of the carrier 10 over the entire range of the stamp face 30 is the same as the offset 210. Figure 4 shows the extreme case of demolding, wherein the local offset z(x) of the carrier 10 within the stamp face 30 after increasing the offset of the carrier 10 relative to its rest position 110 in the vertical direction 300 having different sizes, and a last region (in the limit case of a point x is the x-coordinate _Z inner surface of the stamper 30) remains in contact with the inner surface 100 of the central region of the die surface 30 only, wherein this partial The amount of shift z(x _z ) is the same as the offset 230, and the point of the carrier on the edge of the stamp face 30 has an offset 220 that is different and smaller than the offset 230. The coordinate x _z is related to the geometry of the die face. The carrier 100 must be elastic so as to achieve at least a minimum bending radius of the bending portion 500 in this extreme case without plastic deformation, preferably a smaller bending radius, thereby re-elastically rebounding to the carrier. Rest position.

Figure 5 is a partial elevational view of the top surface 92 or bottom surface 91 of the stamping stamp in the region of the stamp face. FIG. 5 shows the stamp face 30 in the portion 11 of the carrier 10. In this implementation In this manner, the carrier 10 is preferably embodied as a film and has at least one perforation 80 in the die face 30, shown in phantom, defined by a plurality of recesses having various geometries and extending from the top surface to the bottom surface. The recesses may be arranged as regularly as in the arrangement 81 or in an irregular manner as in the arrangement 82. The recesses may be rounded as in the shape of a recess 85 or may have any shape as the recess 86 as exemplarily shown. According to an embodiment in which the fabric is used as a carrier, the notches are formed through the mesh.

Fig. 6 is a partial cross-sectional view showing an imprinting stamp 1 in another embodiment. Fig. 6 shows the case in the region of the stamper face 30 in the case where the top surface 92 of the carrier 10 provided with the recess 86 is irradiated with light. The molding material 20 is connected to the bottom surface 91 of the carrier. A stamper material 20 is also provided in the recess 86 until a certain depth of material thickness of the carrier 10 is reached. The non-directional light source 600 emits light in different directions and within a certain wavelength range, wherein the stamp material 20 can be transmitted by light in the wavelength range. Light 620 is reflected and scattered in the recess 86 of the carrier 10 on the surfaces such that the beam 610 having sufficient exposure intensity also reaches the stamper material 20 (especially within the stamp face 30) and is shielded by the carrier 10. Below the area 21, or to the surface 100 of the substrate, or applied during the imprinting of the imprint material.

Fig. 7 is a partial cross-sectional view showing an imprinting stamp 1 in another embodiment. The carrier 10 is embodied as a film comprising perforations 80 in the region of the stamp face 30. In the present embodiment, the laminated stack of the molding material has a layer of a molding material 20 and an intermediate layer 22. The laminated stack is connected to the bottom surface 91 of the carrier 10 on the side (connection side) opposite to the stamper surface 30. The intermediate material 22 of the laminated stack is disposed on the bottom surface 91 of the carrier 10 and extends into the recesses 87 and 88 until reaching a certain depth of the thickness of the material, wherein the recesses 87 and 88 are located in the bottom surface 91 of the carrier. The upper portion of the upper layer 22 is integral. The sidewalls 12 and 13 of the recess 88 have a relative The inclination in the vertical direction, wherein the opening 14 of the recess 88 on the bottom surface 91 of the carrier 10 has a smaller cross section than the opening 15 on the top surface 92 of the carrier 10. The sidewall 12 of the recess 88 also has an embossed configuration. The side wall 16 of the recess 87 has a concave profile, wherein the opening of the recess 87 on the bottom surface 91 of the carrier 10 is compared to the cross section of the recess 87 in any other plane 19 towards the top surface 92 of the carrier 10. The cross section of 17 is smaller, so that even in the case where the adhesion to the surface of the carrier 10 is insufficient, the stamper material 20 and the intermediate material 22 are not spaced apart from the carrier 10 by an arbitrary spatial distance without being deformed. In addition, a second material 20b is provided on the top surface 92 of the carrier 10, which is plated on the top surface 92 of the carrier 10 with a certain material thickness and a certain degree of extension around a recess and the recess. In the mouth, the extent is greater than the largest cross-section of the corresponding recess (the cross-section of the opening 15 in the case of the recess 88), and the second material passes through the recesses 88 and 87 on the top surface 92 of the carrier 10. The openings 15 and 15b extend into the recesses 88 and 87 until they reach the intermediate material 22 of the laminated stack and are fixedly coupled to the intermediate material 22 at the interface 150. The interface 150 can be located at any depth in the recess as shown in FIG. 7, or even in the plane of the bottom surface 91 of the carrier 10. Figure 8 shows an embodiment similar to that of Figure 7, in which the laminated stack of stamper materials consists of only one die material 20. Unlike FIG. 7, the molding material 20 and the material 20b are not attached to the surface of the carrier 10. Upon demolding the three-dimensional surface texture 35 from the embossed three-dimensional surface configuration 36 located on the surface 100 of the substrate, the molding material 20 and the material 20b are retained in a manner that is anchored in the recesses despite the lack of adhesion. On the substrate 10. For example, the molding material 20 and the material 20b have a spatial distance of 250 and 251 from the components of the carrier 10. However, the distances are not arbitrarily stretched, but are limited by the physical properties of the molding material 20 and the material 20b. The molding material 20 and the material 20b are joined to the carrier 10.

Figure 9 shows an embodiment similar to that of Figure 7, in which the carrier 10 is located The material on the top surface 92 is the same as the molding material 20 and is integrated therewith without an interface. Here, the side walls of the recesses 87c and 88c adopt a plan without contour or inclination. The molding material 20 on the top surface 92 of the carrier 10 is plated with a certain extent around the recess 87c or 88c which is greater than the largest cross section of the recess, so that the stamping material 20 is anchored at In the carrier 10, and even in the case where the adhesion to the surface of the carrier 10 is insufficient, the stamper material 20 is not spaced apart from the carrier 10 by an arbitrary spatial distance without being deformed.

Figure 10 shows an embodiment similar to that of Figures 7 and 9, wherein the material 20b on the top surface 92 of the carrier 10 has a degree of extension such that at least between the two notches of the die face 30 In the region of the carrier 10, the carrier 10 is completely embedded by the molding material 20 and the material 20b on the top surface 92. The material 20b and the molding material 20 together form a material mixture or a mixed material in the region 29, for example, by fusion, so that the composite does not have a clear interface between the molding material 20 and the material 20b.

Figures 11a through 11d are cross-sectional views of one embodiment of an imprint method for creating a three-dimensional surface configuration in an imprint material on a substrate. In Figure 11a, a layer of formable imprint material 700 is plated onto substrate 800. This layer of embossed material 700 can be uncured or cured. Fig. 11b shows the operation of arranging the stamping stamp 1 of the present invention to the layer of imprinting material, and pressing the stamper face 30 of the stamping female mold having the three-dimensional surface configuration 35 into the imprinting material 700. In the figure, the stamping stamper 1 is constructed between the frame 60 and the carrier 10 in a manner that does not have a flexible tensioning material. The molding material 20 is plated on the top surface 92 and the bottom surface 91 of the carrier 10, so that the carrier is embedded in the molding material at least in the extended region of the molding surface 30. The carrier 10 is provided with a perforation so that light can pass through the perforated recess 86 from the top surface 92 of the carrier 10 to the bottom surface 91 of the carrier 10. During the pressing of the layers of the imprinting material 700, the carrier 10 has a resilient offset relative to the frame fixing plane 110 due to the reduced spacing of the frame 60 from the substrate 800 in the direction toward the substrate 800. , the carrier 10 is located offset relative to the rest position of the frame in a fixed plane 110, therefore, the carrier frame 60 on the elastic connection 10, the stamper 30 in a direction toward the substrate surface 800 will force F ₁ is applied 350 to the platen Layer of material 700. In this state, the carrier 10 has an offset from the frame fixing plane 110 over the entire extent of the stamper face 30, regardless of the height difference of the three-dimensional surface configuration of the stamper face 35, the offset The dimensions within the extent of the die face 30 are the same. Figure 11c illustrates the step of curing the imprint material 700 by light irradiation in one embodiment of the imprint method. Another force F _{2 is} applied from the top surface 92 of the carrier 10 to the layers of the stamp face 30 and the imprint material 700, wherein a plate 810 disposed on the top surface 92 of the carrier 10 is applied to the carrier 10. The force F _{2 of the} bottom surface 91. After the application of the force F ₂ , the offset of the carrier 10 generated by the force F ₁ as shown in FIG. 11 b can be reduced or eliminated, thereby preventing the tensile stress induced by the displacement of the carrier 10 from causing lateral distortion of the carrier 10 . . For at least one wavelength range of light emitted by the lamp 600, the plate member 810 and the imprinting material 20 are translucent, and the light is adapted to effect curing of the layer of the imprinting material 700. The beam 630 passes through the plate member 810, through the die material 20 and the recess 86 of the carrier 10 to the layer of the imprint material 700. Figure 11d illustrates the step of demolding the stamp face 30 from the formable imprint material 700. The embossed material 700 has reflected the three-dimensional surface configuration of the stamp face 35 of the embossing stamp 1 on the surface 36 of the layer. In this case, whether or not the imprint material 700 is over-cured by irradiation, or whether the imprint material 700 reflects the three-dimensional surface structure of the stamper surface 35 after curing, there is no difference at present. To perform demolding, the frame 60 is subjected to a distance in a direction 310 away from the substrate surface 100 to release the stamping stamper 1 from the edge of the stamper face 30. Figure 11d shows the instant of demolding the last central region 33 of the stamp face 30, wherein the elastic offset of the carrier 10 relative to the frame fixing plane 110 is different in the stamp face 30.

1‧‧‧imprint stamper

10‧‧‧ Carrier

20‧‧‧Molding material, a layer of stamping material in a laminated stack of stamping materials and intermediate materials

20b‧‧‧Other materials

35‧‧‧Three-dimensional surface structure with forming ability in the die face, die structure, embossing die

36‧‧‧Compressed three-dimensional surface structure, imprinted structure in imprinted material

40‧‧‧Flexible tensioning materials, such as fabrics

50‧‧‧ Connection area of carrier or flexible tensioning material to fixed frame

60‧‧‧Frame, tensioning frame

70‧‧‧ Connection area between carrier and flexible tensioning material

87b‧‧‧ a notch

88b‧‧‧ a notch

91‧‧‧Bottom of the carrier

92‧‧‧ top surface of the carrier

100‧‧‧ Surface of the substrate

150‧‧‧ interface of two materials

250‧‧‧Space distance between the carrier and the die material, intermediate material or other material located in the recess

251‧‧‧Space distance between the carrier and the die material or intermediate material on the underside of the carrier

Claims (14)

An embossing stamper, particularly for a nanoimprint method, having a planar carrier (10) comprising a top surface (92) and a flat bottom surface (91), the carrier (10) having a plurality of recesses Perforations (80) each having an opening in the bottom surface (91) and an opening in the top surface (92), the recess connecting the openings, a layer of a molding material ( 20) connected to the carrier (10) and having a lower surface, wherein the lower surface constitutes a stamper side, has a stamper surface in at least one region, and the lower surface is located on a bottom surface of the carrier (10) (91) Below, and a frame (50), which is arranged around the carrier (10) and connected to the carrier (10). The embossing stamp of claim 1 is characterized in that the layer (20) of the stamping material is also located in the recesses and preferably also above the top surface (92), wherein the layer is The extent above the top surface (92) is preferably greater than the largest cross section of the corresponding recess. The stamping stamp of claim 1, wherein the layer (20) of the stamper material has an extent above the top surface (92) that is greater than a maximum cross-section of the corresponding recess. An imprint stamper according to any one of the preceding claims, characterized in that the carrier (10) is embedded in a layer (20) of the stamper material. The embossing stamper according to any of the preceding claims, characterized in that the carrier (10) is a film, and the carrier (10) has a thickness of less than 30 μm, in particular less than 20 μm, particularly preferably less than 10 μm. The embossing stamper according to any of the preceding claims, characterized in that the carrier (10) is flexible and/or has a flat bottom surface (91). An imprint stamper according to any one of the preceding claims, characterized in that the carrier (10) Having a rest position and an offset state from the rest position, and an elastic offset from the rest position of the carrier (10), and an offset along a normal direction of the surface of the carrier (10) In the case where the entire extent of the stamper surface is also 0.1 mm, the lateral relative stretch ε = ΔL / L of the carrier (10) in the maximum elongation L of the stamper face is less than 0.001, preferably Less than 0.0001, particularly preferably less than 0.00001. An embossing stamper according to any of the preceding claims, characterized in that the layer (20) of the stamper material is embodied as a laminated stack of more than one layer (20). An embossing stamper according to any one of the preceding claims, characterized in that a flexible tensioning material (40) is provided between the edge of the carrier (10) and the frame (50), which is circumferentially Disposed between the carrier (10) and the frame (50), the flexible tensioning material (40) is preferably circumferentially connected to the carrier (10) and to the frame (50) in a plane. A method of manufacturing an embossing stamp, particularly for a nanoimprint method, comprising the steps of providing a planar carrier (10) comprising a top surface (92) and a flat bottom surface (91), the carrier (10) a perforation (80) having a plurality of recesses, each of the recesses having an opening in the bottom surface (91) and an opening in the top surface (92), the recesses being open for the opening Establishing a connection, providing a layer (20) of a molding material having a lower surface constituting a stamper side, having a stamper face in at least one region and connected to the carrier (10), wherein the layer (20) Located below the bottom surface (91) of the carrier (10), and providing a frame (50), and establishing a connection for the frame (50) with the carrier (10), wherein the carrier (10) is located in the frame (50) )Inside. The method of claim 10, comprising the step of providing a major surface having a three-dimensional surface configuration (35) embodied as an embossed male mold within the extent of the stamp face, where the embossed male mold is not cured The main surface is profiled on the stamper side of the layer (20) of the forming material, and the layer (20) of the forming material is cured using illumination, wherein from the top of the carrier (10) The face (92) is subjected to the illumination operation in a manner that passes through the light transmissive perforations (80) of the carrier (10). The method of claim 10 or 11, wherein the layer (20) is connected to the carrier (10) in such a manner that the layer (20) is also located in the recesses and preferably also located Above the top surface (92). The method of claim 12, comprising the following processing step: by the bottom surface (91), the carrier (10) not yet connected to the layer (20) is submerged into the layer (20) and has a forming ability and is not yet cured. a material having a degree of immersion at least a fraction of the thickness of the carrier, wherein the forming material and the uncured material enter at least the recess of the perforation (80) of the carrier (10) and preferably pass through the recesses The top surface (92) of the carrier (10) is reached. The method of claim 10, comprising the steps of: providing a second portion of the layer (20), plating a second portion of the layer (20) to a top surface (92) of the carrier (10) And establishing a connection between the second portion of the layer (20) and the layer (20) on the bottom surface (91), wherein the carrier (10) is embedded in the layer (20) on the bottom surface (91) Between the second portion of the layer (20).