TW201603086A - Short-circuit element - Google Patents

Short-circuit element Download PDF

Info

Publication number
TW201603086A
TW201603086A TW104117931A TW104117931A TW201603086A TW 201603086 A TW201603086 A TW 201603086A TW 104117931 A TW104117931 A TW 104117931A TW 104117931 A TW104117931 A TW 104117931A TW 201603086 A TW201603086 A TW 201603086A
Authority
TW
Taiwan
Prior art keywords
electrode
short
conductor
heating element
electrodes
Prior art date
Application number
TW104117931A
Other languages
Chinese (zh)
Other versions
TWI683334B (en
Inventor
Yoshihiro Yoneda
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201603086A publication Critical patent/TW201603086A/en
Application granted granted Critical
Publication of TWI683334B publication Critical patent/TWI683334B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/572Means for preventing undesired use or discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/572Means for preventing undesired use or discharge
    • H01M50/574Devices or arrangements for the interruption of current
    • H01M50/583Devices or arrangements for the interruption of current in response to current, e.g. fuses
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Fuses (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

Provided is a short-circuit element in which melting of a fusible conductor reliably causes a short circuit between short circuit electrodes. This short-circuit element is provided with a first electrode (11), a second electrode (12) which is provided adjacent to the first electrode (11), a first fusible conductor (13) which is supported by the first electrode (11), and which, by being melted, aggregates across the interval between the first and second electrodes (11, 12), causing a short circuit between the first and second electrodes (11, 12), and a heat-generating conductor (14) which heats the first fusible conductor (13), wherein the first fusible conductor (13) is supported projecting towards the second electrode (12).

Description

短路元件 Short circuit component

本發明係關於藉由電氣訊號使開放狀態之電源線或訊號線物理且電氣短路之短路元件。 The present invention relates to short-circuiting elements that physically and electrically short-circuit power lines or signal lines in an open state by electrical signals.

本申請案係以在日本於2014年6月4日申請之日本專利申請號特願2014-116003為基礎主張優先權,參照此申請並援用於本申請案。 The present application claims priority on the basis of Japanese Patent Application No. 2014-116003, filed on Jun.

大多數可充電反覆利用之二次電池被加工成電池包並供應給使用者。尤其是重量能量密度高之鋰離子二次電池,為了確保使用者及電子機器之安全,一般而言,將過充電保護、過放電保護等數個保護電路內設於電池包,具有在既定情形阻斷電池包之輸出之功能。 Most rechargeable secondary batteries are processed into battery packs and supplied to the user. In particular, in order to ensure the safety of users and electronic equipment, lithium ion secondary batteries having a high weight and energy density are generally provided in a battery pack such as overcharge protection and overdischarge protection. The function of blocking the output of the battery pack.

此種保護元件,會有使用內設於電池包之FET開關進行輸出之ON/OFF,據以進行電池包之過充電保護或過放電保護動作之情形。然而,在因某種原因而使FET開關短路損壞之情形、或被施加雷電突波等而大電流瞬間流過之情形、或因電池單元之壽命使得輸出電壓異常降低、或相反地輸出過大之異常電壓、或電池單元之各個電壓不均變大之情形時,仍必須保護電池包或電子機器免於受到起火等意外之影響。因此,為了在上述可假設之任一異常狀態下皆能安全地阻斷電池單元之輸出,係使用由熔絲元件構成之保護元件,該熔絲元件具有以來自外部之訊號阻斷電流路徑之功能。 Such a protection element may be turned ON/OFF using an FET switch built in a battery pack to perform an overcharge protection or an overdischarge protection operation of the battery pack. However, in the case where the FET switch is short-circuited and damaged for some reason, or a large current flows instantaneously when a lightning surge or the like is applied, or the output voltage is abnormally lowered due to the life of the battery unit, or vice versa. When the abnormal voltage or the voltage unevenness of the battery unit becomes large, the battery pack or the electronic device must be protected from accidents such as fire. Therefore, in order to safely block the output of the battery cell in any of the above-mentioned abnormal states, a protection element composed of a fuse element having a signal blocking current path from the outside is used. Features.

作為適於鋰離子二次電池等之保護電路之保護元件,如專利文獻1記載,將可熔導體跨接於電流路徑上之第1電極、發熱體拉出電極、第2電極間而構成電流路徑之一部分,將此電流路徑上之可熔導體藉由過電流導致之自體發熱或設在保護元件內部之發熱體熔斷。此種保護元件,藉由使熔融後之液體狀可熔導體聚集在與發熱體相連之導體層上,分離第1、第2電極間以阻斷電流路徑。 As a protective element suitable for a protective circuit of a lithium ion secondary battery or the like, as disclosed in Patent Document 1, a current is formed by bridging a soluble conductor between a first electrode on a current path, a heating element drawing electrode, and a second electrode. In one part of the path, the fusible conductor on the current path is self-heated by the overcurrent or the heating element provided inside the protection element is blown. Such a protective element separates the first and second electrodes to block the current path by collecting the molten liquid-like soluble conductor on the conductor layer connected to the heating element.

[先行技術文獻] [Advanced technical literature]

專利文獻1:日本特開2010-003665號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-003665

專利文獻2:日本特開2004-185960號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-185960

專利文獻3:日本特開2012-003878號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2012-003878

此外,近年來,使用電池與馬達之HEV(Hybrid Electric Vehicle)或EV(Electric Vehicle)急速地普及。作為HEV或EV之動力源,從能量密度與輸出特性考量逐漸使用鋰離子二次電池。在汽車用途上,必須要高電壓、大電流。因此,開發了能承受高電壓、大電流之專用單元,但從製造成本上的問題考量,大多數情形藉由將複數個電池單元串聯、並聯,使用泛用單元確保所需之電壓電流。 Further, in recent years, HEVs (Hybrid Electric Vehicles) or EVs (Electric Vehicles) using batteries and motors have rapidly spread. As a power source of HEV or EV, a lithium ion secondary battery is gradually used from the viewpoint of energy density and output characteristics. In automotive applications, high voltage and high current are required. Therefore, a dedicated unit capable of withstanding high voltage and large current has been developed, but in consideration of manufacturing cost, in most cases, a plurality of battery cells are connected in series and in parallel, and a common unit is used to secure a required voltage and current.

此處,高速移動中之汽車等,會有急速之驅動力降低或急停而造成危險之情形,因此亦要求緊急狀態時之電池管理。例如,即使在行駛中產生電池系統之異常時,為避免危險,最好是能供應用以移動至修理工廠或安全場所之驅動力、或警示燈及空調用之驅動力。 Here, in a car that is moving at a high speed, there is a case where the driving force of the rapid speed is lowered or the emergency stop is dangerous, and therefore battery management in an emergency state is also required. For example, even if an abnormality of the battery system occurs during running, in order to avoid danger, it is preferable to supply a driving force for moving to a repair factory or a safe place, or a driving force for a warning light and an air conditioner.

然而,在專利文獻1之串聯有複數個電池單元之電池包,在僅於充放電路徑上設有保護元件之情形,當電池單元之一部分產生異常使保護元件作動時,電池包整體之充放電路徑即被阻斷,無法再持續供應電力。 However, in the battery pack in which a plurality of battery cells are connected in series in Patent Document 1, in the case where the protective component is provided only on the charge and discharge path, when one of the battery cells is abnormal and the protective component is activated, the battery pack is charged and discharged as a whole. The path is blocked and it is no longer possible to supply power continuously.

因此,有提出一種短路元件,為了僅排除以複數個單元構成之電池包內之異常電池單元、有效地活用正常之電池單元,能形成僅繞過異常電池單元之旁通路徑。 Therefore, there has been proposed a short-circuiting element capable of forming a bypass path that bypasses only an abnormal battery cell in order to exclude only an abnormal battery cell in a battery pack composed of a plurality of cells and to effectively utilize a normal battery cell.

於圖45顯示短路元件之一構成例,於圖45顯示適用短路元件之電池電路之電路圖。此短路元件100,如圖45及圖46所示,具有於充放電路徑上與電池單元101並聯且在正常時開放之第1、第2短路電極102,103、藉由熔融使第1、第2短路電極102,103間短路之兩個可熔導體104a,104b、以及與可熔導體104a串聯且使可熔導體104a,104b熔融之發熱體105。 Fig. 45 shows an example of the configuration of the short-circuiting element, and Fig. 45 shows a circuit diagram of the battery circuit to which the short-circuiting element is applied. As shown in FIGS. 45 and 46, the short-circuiting element 100 has the first and second short-circuit electrodes 102 and 103 which are connected in parallel with the battery cell 101 in the charge/discharge path and are normally opened, and the first and second short-circuits are caused by melting. The two fusible conductors 104a, 104b short-circuited between the electrodes 102, 103, and the heat generating body 105 which is connected in series with the fusible conductor 104a and melts the fusible conductors 104a, 104b.

短路元件100係於陶瓷基板等絕緣基板110上形成有發熱體105及與發熱體105一端連接之外部連接電極111。又,短路元件100係於發熱體105上,隔著玻璃等絕緣層112而形成有與發熱體105另一端連接之發熱體電極113、第1、第2短路電極102,103、以及與第1、第2短路電極102,103一起支撐可熔導體104a,104b之第1、第2支撐電極114,115。 The short-circuiting element 100 is formed on an insulating substrate 110 such as a ceramic substrate, and has a heating element 105 and an external connection electrode 111 connected to one end of the heating element 105. Further, the short-circuiting element 100 is connected to the heating element 105, and the heating element electrode 113 connected to the other end of the heating element 105, the first and second short-circuit electrodes 102, 103, and the first and the third are formed via the insulating layer 112 such as glass. 2 The short-circuit electrodes 102, 103 together support the first and second support electrodes 114, 115 of the fusible conductors 104a, 104b.

第1支撐電極114與露出於絕緣層112上之發熱體電極113連接且與第1短路電極102相鄰。第1支撐電極114係與第1短路電極102一起支撐一方之可熔導體104a之兩側。同樣地,第2支撐電極115與第2短路電極103相鄰,與第2短路電極103一起支撐另一方之可熔導體104b之兩側。 The first support electrode 114 is connected to the heat generating body electrode 113 exposed on the insulating layer 112 and adjacent to the first short-circuit electrode 102. The first support electrode 114 supports both sides of one of the fusible conductors 104a together with the first short-circuit electrode 102. Similarly, the second support electrode 115 is adjacent to the second short-circuit electrode 103, and supports the both sides of the other meltable conductor 104b together with the second short-circuit electrode 103.

短路元件100,係從外部連接電極111經由發熱體105、發熱體電極113、可熔導體104a而到達第1短路電極102,而構成對發熱體105之供電路徑。 The short-circuiting element 100 reaches the first short-circuit electrode 102 from the external connection electrode 111 via the heating element 105, the heating element electrode 113, and the soluble conductor 104a, and constitutes a power supply path to the heating element 105.

發熱體105係藉由透過此供電路徑之電流流通而自體發熱,藉由此熱(焦耳熱)使可熔導體104a,104b熔融。如圖46所示,發熱體105經由外部連接電極111而與FET等電流控制元件106連接。電流控制元件106控制成在電池單元101正常時限制對發熱體1105之供電,在異常時經由充放電路徑對發熱體105通以電流。 The heating element 105 is self-heated by the current flowing through the power supply path, and the soluble conductors 104a and 104b are melted by the heat (Joule heat). As shown in FIG. 46, the heating element 105 is connected to a current control element 106 such as an FET via an external connection electrode 111. The current control element 106 is controlled to restrict the supply of power to the heating element 1105 when the battery unit 101 is normal, and to apply current to the heating element 105 via the charging and discharging path when an abnormality occurs.

使用了短路元件100之電池電路,在電池單元101被檢測出異常電壓等時,即藉由保護元件107從充放電路徑上阻斷該電池單元101,且使電流控制元件106作動,對發熱體105通以電流。藉此,藉由發熱體105之熱使可熔導體104a,104b熔融。可熔導體104a,104b,在往相對寬廣面積之第1、第2短路電極102,103側偏靠後熔融,熔融導體於兩個短路電極102,103間凝結、結合。是以,短路電極102,103藉由可熔導體104a,104b之熔融導體而短路,藉此能形成繞過電池單元101之電流路徑。 When the battery unit 101 detects an abnormal voltage or the like, that is, the battery unit 101 is blocked from the charge and discharge path by the protection element 107, and the current control element 106 is actuated, the heating element is applied to the heating element. 105 is connected to current. Thereby, the fusible conductors 104a, 104b are melted by the heat of the heating element 105. The fusible conductors 104a and 104b are melted toward the first and second short-circuit electrodes 102 and 103 on the relatively wide area, and the molten conductor is condensed and bonded between the two short-circuit electrodes 102 and 103. Therefore, the short-circuit electrodes 102, 103 are short-circuited by the fused conductors of the fusible conductors 104a, 104b, whereby a current path bypassing the battery cell 101 can be formed.

又,短路元件100藉由可熔導體104a移動至第1短路電極102側且熔融,使第1支撐電極114與第1短路電極102間被開放,藉此由於阻斷對發熱體105之供電路徑,因此發熱體105之發熱停止。 Further, the short-circuiting element 100 is moved to the first short-circuiting electrode 102 side by the meltable conductor 104a and melted, and the first supporting electrode 114 and the first short-circuiting electrode 102 are opened, whereby the power supply path to the heating element 105 is blocked. Therefore, the heat generation of the heating element 105 is stopped.

此處,此種短路元件100,係被要求藉由可熔導體104a,104b之熔融確實地使短路電極102,103間短路。亦即,短路元件100,被要求藉由可熔導體104a,104b之熔融導體遍佈凝結於短路電極102,103間以使短路電極102,103短路,以使更多之熔融導體凝結於短路電極102,103上。 Here, in the short-circuiting element 100, it is required to reliably short-circuit the short-circuit electrodes 102, 103 by the melting of the fusible conductors 104a, 104b. That is, the short-circuiting element 100 is required to be condensed between the short-circuited electrodes 102, 103 by the molten conductors of the fusible conductors 104a, 104b so as to short-circuit the short-circuited electrodes 102, 103 so that more of the molten conductors are condensed on the short-circuited electrodes 102, 103.

然而,若為了使更多之熔融導體凝結於短路電極102,103上,相對地使短路電極102,103較第1、第2支撐電極114,115面積更寬廣,例如在短路元件100之回焊構裝時等,有可能可熔導體104a,104b會從第1、第2支撐電極114,115分離而移動至短路電極102,103上。因此,短路元件100,有在作動前對發熱體105之供電路徑即被阻斷且使短路電極102,103間短路之初期短路之風險。 However, in order to condense more of the molten conductor on the short-circuit electrodes 102, 103, the short-circuit electrodes 102, 103 are relatively wider than the first and second support electrodes 114, 115, for example, during the reflow assembly of the short-circuiting element 100, etc. The fusible conductors 104a, 104b may be separated from the first and second support electrodes 114, 115 and moved to the short-circuit electrodes 102, 103. Therefore, the short-circuiting element 100 has a risk that the power supply path to the heating element 105 is blocked before the operation and the initial short-circuit between the short-circuit electrodes 102 and 103 is short-circuited.

又,若為了減低初期短路風險而使短路電極102,103之面積狹窄,則亦有可熔導體104a,104b之熔融導體不遍佈凝結於短路電極102,103間,而無法使短路電極102,103間短路之風險。 Further, if the area of the short-circuit electrodes 102, 103 is narrowed in order to reduce the risk of the initial short-circuit, the melted conductors of the fusible conductors 104a, 104b may not lie between the short-circuit electrodes 102, 103, and the short-circuit electrodes 102, 103 may not be short-circuited.

因此,係期望有一種短路元件,能在電池電路等各種電路中,藉由可熔導體之熔融確實地使短路電極間短路而形成旁通電流路徑。 Therefore, it is desirable to have a short-circuiting element capable of forming a bypass current path by short-circuiting short-circuited electrodes by melting of a fusible conductor in various circuits such as a battery circuit.

為了解決上述課題,本發明之短路元件,具備:第1電極;第2電極,與上述第1電極相鄰設置;第1可熔導體,被上述第1電極支撐,藉由熔融而遍佈凝結於上述第1、第2電極間,使上述第1、第2電極短路;以及發熱體,加熱上述第1可熔導體;上述第1可熔導體,係往上述第2電極側突出而被支撐。 In order to solve the above problems, the short-circuiting element of the present invention includes: a first electrode; a second electrode disposed adjacent to the first electrode; and the first meltable conductor supported by the first electrode and condensed throughout the melting The first and second electrodes are short-circuited between the first and second electrodes, and the heating element heats the first meltable conductor. The first meltable conductor protrudes toward the second electrode and is supported.

根據本發明之短路元件,第1可熔導體,在發熱體發熱後藉由發熱體之熱熔融,突出於第2電極側之熔融導體凝結於第1電極周圍,藉此亦與和第1電極相鄰配置之第2電極接觸,而能使第1、第2電極間短路。 According to the short-circuiting element of the present invention, the first fusible conductor is thermally fused by the heat generating body after the heat generating body generates heat, and the molten conductor protruding from the second electrode side is condensed around the first electrode, thereby also the first electrode When the second electrodes adjacent to each other are in contact, the first and second electrodes can be short-circuited.

1‧‧‧短路元件 1‧‧‧Short-circuit components

2‧‧‧開關 2‧‧‧Switch

3‧‧‧供電路徑 3‧‧‧Power supply path

10‧‧‧絕緣基板 10‧‧‧Insert substrate

10a‧‧‧表面 10a‧‧‧ surface

10b‧‧‧背面 10b‧‧‧back

11‧‧‧第1電極 11‧‧‧1st electrode

11a‧‧‧外部連接端子 11a‧‧‧External connection terminal

12‧‧‧第2電極 12‧‧‧2nd electrode

12a‧‧‧外部連接端子 12a‧‧‧External connection terminal

13‧‧‧第1可熔導體 13‧‧‧1st fusible conductor

13a‧‧‧熔融導體 13a‧‧‧fused conductor

14‧‧‧發熱體 14‧‧‧heating body

15‧‧‧接合材 15‧‧‧Material

17‧‧‧絕緣層 17‧‧‧Insulation

18‧‧‧發熱體拉出電極 18‧‧‧Feature body pull-out electrode

18a‧‧‧下層部 18a‧‧‧ Lower Department

18b‧‧‧上層部 18b‧‧‧Upper Department

19‧‧‧發熱體電極 19‧‧‧Heating body electrode

21‧‧‧輔助可熔導體 21‧‧‧Auxiliary fusible conductor

22‧‧‧支撐電極 22‧‧‧Support electrode

23‧‧‧絕緣層 23‧‧‧Insulation

24‧‧‧助焊劑 24‧‧‧ Flux

25‧‧‧覆蓋構件 25‧‧‧ Covering components

26‧‧‧外部連接電極 26‧‧‧External connection electrode

28‧‧‧外部電路 28‧‧‧External circuit

32‧‧‧電流控制元件 32‧‧‧Current control components

35‧‧‧檢測元件 35‧‧‧Detection components

40‧‧‧短路元件 40‧‧‧Short-circuit components

50‧‧‧短路元件 50‧‧‧Short-circuit components

51‧‧‧第1電路 51‧‧‧1st circuit

52‧‧‧外部電路 52‧‧‧External Circuit

53‧‧‧外部電源 53‧‧‧External power supply

60‧‧‧短路元件 60‧‧‧Short-circuit components

70‧‧‧短路元件 70‧‧‧Short-circuit components

71‧‧‧發熱體供電電極 71‧‧‧heating body power supply electrode

72‧‧‧第2可熔導體 72‧‧‧2nd fusible conductor

80‧‧‧短路元件 80‧‧‧Short-circuit components

81‧‧‧第1絕緣層 81‧‧‧1st insulation layer

82‧‧‧第2絕緣層 82‧‧‧2nd insulation layer

83‧‧‧支撐電極 83‧‧‧Support electrode

90‧‧‧短路元件 90‧‧‧Short-circuit components

91‧‧‧高熔點金屬層 91‧‧‧High melting point metal layer

92‧‧‧低熔點金屬層 92‧‧‧low melting point metal layer

93‧‧‧開口部 93‧‧‧ openings

94‧‧‧開口部 94‧‧‧ openings

95‧‧‧開口部 95‧‧‧ openings

96‧‧‧導體帶 96‧‧‧Conductor belt

圖1係顯示適用本發明之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a short-circuiting element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖2係顯示適用本發明之短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 2 is a view showing a state in which the short-circuiting element of the present invention is actuated, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖3係顯示適用本發明之短路元件之電路構成圖。 Fig. 3 is a circuit diagram showing the short-circuiting element to which the present invention is applied.

圖4係顯示適用本發明之短路元件作動之狀態之電路構成圖。 Fig. 4 is a circuit configuration diagram showing a state in which the short-circuiting element of the present invention is actuated.

圖5係顯示具備輔助可熔導體之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 5 is a view showing a short-circuiting element having an auxiliary fusible conductor, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖6係顯示具備輔助可熔導體之短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 6 is a view showing a state in which a short-circuiting element having an auxiliary fusible conductor is actuated, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖7係顯示適用本發明之其他短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 7 is a view showing a state in which other short-circuiting elements of the present invention are actuated, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖8係顯示適用本發明之其他短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 8 is a view showing a state in which other short-circuiting elements of the present invention are actuated, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖9係顯示具備輔助可熔導體之其他短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 9 is a view showing another short-circuiting element having an auxiliary fusible conductor, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖10係顯示具備支撐電極之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 10 is a view showing a short-circuiting element including a supporting electrode, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖11係顯示具備支撐電極之其他短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 11 is a view showing another short-circuiting element having a supporting electrode, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖12(A)係表面構裝型之短路元件之俯視圖,圖12(B)係穿過短路元件之發熱體等而顯示之俯視圖,圖12(C)係圖12(A)之A-A’剖面圖。 Fig. 12(A) is a plan view showing a short-circuiting element of a surface-mount type, and Fig. 12(B) is a plan view showing a heat generating body or the like passing through the short-circuiting element, and Fig. 12(C) is an A-A of Fig. 12(A). 'Profile view.

圖13係顯示發熱體發熱中之表面構裝型之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 13 is a view showing a short-circuiting element of a surface structure type in which heat is generated in a heating element, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖14係顯示發熱體之發熱停止後之表面構裝型之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 14 is a view showing a short-circuiting element of a surface-mount type after the heat generation of the heating element is stopped, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖15係顯示具備支撐電極之表面構裝型之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 15 is a view showing a short-circuiting element having a surface structure of a supporting electrode, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖16係顯示表面構裝型之其他短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 16 is a view showing another short-circuiting element of the surface structure type, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖17係顯示具備支撐電極之表面構裝型之其他短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 17 is a view showing another short-circuiting element having a surface-mounting type of a supporting electrode, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖18係顯示對發熱體之供電路徑與第1、第2電極在電性上獨立之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 18 is a view showing a short-circuiting element electrically connected to the first and second electrodes of the heating element, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖19(A)(B)係顯示對發熱體之供電路徑與第1、第2電極在電性上獨立之短路元件之電路構成之圖。 19(A) and (B) are diagrams showing the circuit configuration of the short-circuiting element in which the power supply path of the heating element and the first and second electrodes are electrically independent.

圖20係顯示適用對發熱體之供電路徑與第1、第2電極在電性上獨立之短路元件之短路電路一例之圖。 Fig. 20 is a view showing an example of a short circuit for applying a short-circuiting element which is electrically independent of the power supply path of the heating element and the first and second electrodes.

圖21係顯示具備輔助可熔導體之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 21 is a view showing a short-circuiting element having an auxiliary fusible conductor, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖22係顯示於對發熱體之供電路徑上具備第2可熔導體之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 22 is a view showing a short-circuiting element including a second fusible conductor in a power supply path of the heat generating body, wherein (A) is a plan view and (B) is a cross-sectional view taken along line A-A'.

圖23係顯示具備第2可熔導體之短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 23 is a view showing a state in which a short-circuiting element having a second meltable conductor is actuated, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖24係顯示具備第2可熔導體及輔助可熔導體之短路元件之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 24 is a view showing a state of a short-circuiting element including a second fusible conductor and an auxiliary fusible conductor, wherein (A) is a plan view and (B) is a cross-sectional view taken along line A-A'.

圖25係顯示表面構裝型之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Fig. 25 is a view showing a short-circuiting element of a surface structure type, (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

圖26係於圖25所示之短路元件中除去第1可熔導體而顯示之俯視圖。 Fig. 26 is a plan view showing the short-circuiting element shown in Fig. 25 in which the first fusible conductor is removed.

圖27係顯示於圖25所示之短路元件中發熱體開始發熱之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Fig. 27 is a view showing a state in which the heating element starts to generate heat in the short-circuiting element shown in Fig. 25, wherein (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

圖28係顯示於圖25所示之短路元件中發熱體之發熱停止後之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Fig. 28 is a view showing a state after the heat generation of the heating element is stopped in the short-circuiting element shown in Fig. 25, wherein (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a B-B' profile. Figure.

圖29係顯示於第1、第2電極間亦設有絕緣層之短路元件之俯視圖。 Fig. 29 is a plan view showing a short-circuiting element in which an insulating layer is provided between the first and second electrodes.

圖30係顯示於覆蓋構件之頂面部設有第2電極之短路元件之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Fig. 30 is a view showing a short-circuiting element provided with a second electrode on the top surface of the covering member, wherein (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

圖31係顯示圖30所示之短路元件作動之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Fig. 31 is a view showing a state in which the short-circuiting element shown in Fig. 30 is actuated, (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B-B'.

圖32(A)係顯示將發熱體設於絕緣基板之背面側之短路元件之剖面圖,(B)係顯示將發熱體設於絕緣基板內部之短路元件之剖面圖。 32(A) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided on the back surface side of the insulating substrate, and (B) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided inside the insulating substrate.

圖33(A)係顯示將發熱體設於絕緣基板之背面側之短路元件之剖面圖,(B)係顯示將發熱體設於絕緣基板內部之短路元件之剖面圖。 33(A) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided on the back surface side of the insulating substrate, and (B) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided inside the insulating substrate.

圖34(A)係顯示將發熱體設於絕緣基板之背面側之短路元件之剖面圖,(B)係顯示將發熱體設於絕緣基板內部之短路元件之剖面圖。 Fig. 34(A) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided on the back surface side of the insulating substrate, and (B) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided inside the insulating substrate.

圖35(A)係顯示將發熱體設於絕緣基板之背面側之短路元件之剖面圖,(B)係顯示將發熱體設於絕緣基板內部之短路元件之剖面圖。 35(A) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided on the back surface side of the insulating substrate, and (B) is a cross-sectional view showing a short-circuiting element in which a heat generating body is provided inside the insulating substrate.

圖36係顯示具有高熔點金屬層與低熔點金屬層且具備被覆構造之可熔導體的立體圖,(A)係顯示以高熔點金屬層作為內層且以低熔點金屬層覆蓋的構造,(B)係顯示以低熔點金屬層作為內層且以高熔點金屬層覆蓋的構造。 36 is a perspective view showing a fusible conductor having a high melting point metal layer and a low melting point metal layer and having a coated structure, and (A) showing a structure in which a high melting point metal layer is used as an inner layer and covered with a low melting point metal layer, (B) The structure showing a low melting point metal layer as an inner layer and a high melting point metal layer is shown.

圖37係顯示具備高熔點金屬層與低熔點金屬層之積層構造之可熔導體的立體圖,(A)係顯示上下雙層構造,(B)係顯示內層及外層之三層構造。 37 is a perspective view showing a fusible conductor having a laminated structure of a high melting point metal layer and a low melting point metal layer, wherein (A) shows a top and bottom double layer structure, and (B) shows a three layer structure of an inner layer and an outer layer.

圖38係顯示具備高熔點金屬層與低熔點金屬層之多層構造之可熔導體的剖面圖。 38 is a cross-sectional view showing a fusible conductor having a multilayer structure of a high melting point metal layer and a low melting point metal layer.

圖39係顯示於高熔點金屬層之表面形成有線狀之開口部且露出低熔點金屬層之可熔導體的俯視圖,(A)係沿長度方向形成有開口部者,(B)係沿寬度方向形成有開口部者。 39 is a plan view showing a fusible conductor in which a linear opening is formed on a surface of a high melting point metal layer and a low melting point metal layer is exposed, wherein (A) is formed with an opening in the longitudinal direction, and (B) is in the width direction. An opening is formed.

圖40係顯示於高熔點金屬層之表面形成有圓形之開口部且露出低熔點金屬層之可熔導體的俯視圖。 Fig. 40 is a plan view showing a fusible conductor in which a circular opening portion is formed on the surface of the high melting point metal layer and the low melting point metal layer is exposed.

圖41係顯示於高熔點金屬層形成有圓形之開口部且於內部充填有低熔點金屬之可熔導體的俯視圖。 41 is a plan view showing a fusible conductor in which a circular opening portion is formed in a high melting point metal layer and a low melting point metal is filled inside.

圖42係顯示露出被高熔點金屬包圍之低熔點金屬之可熔導體之立體圖。 Figure 42 is a perspective view showing a fusible conductor exposing a low melting point metal surrounded by a high melting point metal.

圖43係顯示使用了圖42所示之可熔導體之短路元件之動作前之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖,(C)係B-B’剖面圖。 Figure 43 is a view showing a state before the operation of the short-circuiting element using the fusible conductor shown in Figure 42, (A) is a plan view, (B) is a cross-sectional view taken along line A-A', and (C) is B-B' Sectional view.

圖44係顯示使用了圖42所示之可熔導體之短路元件之動作前之狀態之圖,(A)係俯視圖,(B)係A-A’剖面圖。 Fig. 44 is a view showing a state before the operation of the short-circuiting element using the fusible conductor shown in Fig. 42, (A) is a plan view, and (B) is a cross-sectional view taken along line A-A'.

圖45係顯示參考例之短路元件之俯視圖。 Fig. 45 is a plan view showing a short-circuiting element of a reference example.

圖46係顯示使用參考例之短路元件之電池電路構成之圖。 Fig. 46 is a view showing the configuration of a battery circuit using the short-circuiting element of the reference example.

以下,參照圖式詳細說明適用本發明之短路元件、及短路電路。此外,本發明不僅限定於以下實施形態,在不脫離本發明要旨之範圍內當然可進行各種變更。又,圖式係以示意方式顯示,會有各尺寸之比率等與現實不同之情形。具體之尺寸等應參酌以下說明判斷。又,在圖式彼此間當然含有彼此之尺寸關係或比率不同之部分。 Hereinafter, a short-circuiting element and a short-circuiting circuit to which the present invention is applied will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below, and various modifications can be made without departing from the spirit and scope of the invention. Moreover, the drawings are shown in a schematic manner, and there are cases where the ratio of each size is different from the reality. The specific dimensions and the like should be judged by the following instructions. Further, the drawings naturally contain portions having different dimensional relationships or ratios from each other.

[短路元件1] [Short-circuit element 1]

適用本發明之短路元件1,如圖1(A)(B)所示,具備:第1電極11;第2電極12,與第1電極11相鄰設置;第1可熔導體13,被第1電極11支撐,藉由熔融而遍佈凝結於第1、第2電極11,12間,使第1、第2電極11,12短路;以及發熱體14,加熱第1可熔導體13。 The short-circuiting element 1 to which the present invention is applied includes a first electrode 11 as shown in Figs. 1(A) and (B), a second electrode 12 disposed adjacent to the first electrode 11, and a first fusible conductor 13 The first electrode 11 is supported, and is melted and spread between the first and second electrodes 11 and 12 to short-circuit the first and second electrodes 11 and 12, and the heating element 14 heats the first meltable conductor 13.

此等第1、第2電極11,12或發熱體14,例如係藉由對氧化鋁等之絕緣基板上進行高熔點金屬糊之印刷、燒成等而形成於同一平面上。又,第1、第2電極11,12或發熱體14,亦可使用由高熔點金屬構成之線材或板材等機構零件透過支撐於既定位置等來形成。 The first and second electrodes 11 and 12 or the heat generating body 14 are formed on the same plane by, for example, printing or baking a high melting point metal paste on an insulating substrate such as alumina. Further, the first and second electrodes 11 and 12 or the heat generating body 14 may be formed by being supported by a predetermined position or the like using a mechanical member such as a wire or a plate material made of a high melting point metal.

第1、第2電極11,12係近接配置且開放,構成藉由短路元件1之作動,如圖2(A)(B)所示後述之第1可熔導體13之熔融導體13a凝結、結合,而透過此熔融導體13a短路之開關2。第1、第2電極11,12分別於一端設有外部連接端子11a,12a。第1、第2電極11,12透過此等外部連接端子11a,12a而與電源電路或數位訊號電路之外部電路連接,藉由短路元件 1之動作,成為該外部電路之旁通電流路徑或對功能電路之供電路徑。 The first and second electrodes 11 and 12 are arranged in close proximity and open, and the short-circuiting element 1 is activated, and the molten conductor 13a of the first fusible conductor 13 to be described later, as shown in FIG. 2(A) and (B), is condensed and bonded. And the switch 2 short-circuited through the molten conductor 13a. The first and second electrodes 11, 12 are respectively provided with external connection terminals 11a, 12a at one end. The first and second electrodes 11, 12 are connected to the external circuit of the power supply circuit or the digital signal circuit through the external connection terminals 11a, 12a, by short-circuiting the components The action of 1 becomes the bypass current path of the external circuit or the power supply path to the functional circuit.

此外,在以機構零件構成之第1、第2電極11,12之一部分被支撐體支撐之場合,該支撐體較佳為熱傳導率10W/m‧K以下之絕緣材料。短路元件1,在支撐第1、第2電極11,12之一部分之支撐體被收納於例如熱傳導率25W/m‧K之較高氧化鋁陶瓷盒之情形,第1、第2電極11,12之熱係透過該支撐體釋放至氧化鋁陶瓷盒,而成為難以加熱之狀況。 Further, when one of the first and second electrodes 11, 12 constituted by the mechanical component is supported by the support, the support is preferably an insulating material having a thermal conductivity of 10 W/m‧K or less. The short-circuiting element 1 is in a case where a support supporting one of the first and second electrodes 11 and 12 is housed in a higher alumina ceramic case having a thermal conductivity of 25 W/m ‧ , for example, the first and second electrodes 11 and 12 The heat is released to the alumina ceramic case through the support, and it becomes difficult to heat.

因此,藉由以由熱傳導率10W/m‧K以下之絕緣材料構成之支撐體支撐第1、第2電極11,12,短路元件1即可防止傳至第1、第2電極11,12之發熱體14之熱經由支撐體釋放至泛用氧化鋁陶瓷等外殼體,迅速地將第1可熔導體13加熱、熔融。此外,支撐體之熱傳導率,藉由設為較外殼體低而能抑制對外殼體之放熱,藉由設成熱傳導率10W/m‧K以下,能充分抑制對泛用氧化鋁陶瓷之外殼體之放熱,進而在放熱抑制方面,較佳為使用最大熱傳導率2W/m‧K以下之塑膠或玻璃來作為支撐體材料。 Therefore, by supporting the first and second electrodes 11 and 12 with a support made of an insulating material having a thermal conductivity of 10 W/m‧K or less, the short-circuiting element 1 can be prevented from being transmitted to the first and second electrodes 11, 12 The heat of the heating element 14 is released to the outer casing such as a general-purpose alumina ceramic via the support, and the first meltable conductor 13 is quickly heated and melted. In addition, the thermal conductivity of the support is lower than that of the outer casing, and the heat release from the outer casing can be suppressed. By setting the thermal conductivity to 10 W/m‧K or less, the outer casing of the alumina ceramic can be sufficiently suppressed. In terms of heat release, it is preferable to use a plastic or glass having a maximum thermal conductivity of 2 W/m‧K or less as a support material in terms of heat release suppression.

第1可熔導體13能使用因發熱體14之發熱迅速熔融之任一金屬,可較佳地使用例如Sn或以Sn為主成分之無鉛焊料等低熔點金屬。 As the first fusible conductor 13, any metal which is rapidly melted by the heat generation of the heating element 14 can be used, and a low melting point metal such as Sn or a lead-free solder containing Sn as a main component can be preferably used.

又,第1可熔導體13亦可含有低熔點金屬與高熔點金屬。作為低熔點金屬,較佳為使用Sn或以Sn為主成分之無鉛焊料等焊料,作為高熔點金屬,較佳為使用Ag、Cu或以此等為主成分之合金等。藉由含有高熔點金屬與低熔點金屬,將短路元件1回焊構裝之情形,即使回焊溫度超過低熔點金屬層之熔融溫度而低熔點金屬熔融,亦可抑制低熔點金屬往外部流出,能維持第1可熔導體13之形狀。又,在熔斷時,亦藉由低熔點金屬熔融,熔蝕(焊料沖蝕)高熔點金屬,而能以高熔點金屬之熔點以下之溫 度迅速地熔斷。此外,第1可熔導體13如後說明般,能以各種構成來形成。 Further, the first meltable conductor 13 may also contain a low melting point metal and a high melting point metal. As the low-melting-point metal, solder such as Sn or a lead-free solder containing Sn as a main component is preferably used, and as the high-melting-point metal, Ag, Cu, or an alloy containing the same as the main component is preferably used. When the short-circuiting element 1 is reflowed by containing a high melting point metal and a low melting point metal, even if the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal is melted, the low melting point metal can be suppressed from flowing out to the outside. The shape of the first fusible conductor 13 can be maintained. Moreover, at the time of melting, the low melting point metal is also melted, and the high melting point metal is etched (solder eroded), and the temperature below the melting point of the high melting point metal can be used. The degree is quickly blown. Further, the first fusible conductor 13 can be formed in various configurations as will be described later.

第1可熔導體13形成為大致矩形板狀,透過連接用焊料等接合材15等連接於第1電極11上。此處,本發明之短路元件1中,第1可熔導體13係往第2電極12側突出而被支撐。第1可熔導體13,在短路元件1之作動前係與第1、第2電極11,12分離被支撐。又,第1可熔導體13,在發熱體14發熱後藉由發熱體14之熱熔融,熔融導體13a凝結於第1電極11周圍,藉此亦與和第1電極11相鄰配置之第2電極12接觸,而能使第1、第2電極11,12間短路。 The first fusible conductor 13 is formed in a substantially rectangular plate shape, and is connected to the first electrode 11 through a bonding material 15 such as solder for connection. Here, in the short-circuiting element 1 of the present invention, the first meltable conductor 13 protrudes toward the second electrode 12 side and is supported. The first fusible conductor 13 is supported separately from the first and second electrodes 11, 12 before the short-circuiting element 1 is actuated. Further, after the heat generating body 14 generates heat, the first meltable conductor 13 is thermally fused by the heat generating body 14, and the molten conductor 13a is condensed around the first electrode 11, thereby also being disposed adjacent to the first electrode 11 The electrodes 12 are in contact with each other to short-circuit the first and second electrodes 11, 12.

第1可熔導體13較佳為如圖1(B)所示與第2電極12分離且重疊於第2電極12。藉此,第1可熔導體13在藉由發熱體14之熱熔融後,即藉由張力或重力對第2電極12接觸,確實地使第1、第2電極11,12間短路。 The first soluble conductor 13 is preferably separated from the second electrode 12 and superposed on the second electrode 12 as shown in FIG. 1(B). As a result, the first meltable conductor 13 is brought into contact with the second electrode 12 by tension or gravity after being thermally fused by the heat generating body 14, thereby reliably short-circuiting the first and second electrodes 11, 12.

此外,第1可熔導體13,為了氧化防止、濕潤性提升等而在塗布有助焊劑24(參照圖12等)。 In addition, the first fusible conductor 13 is coated with the flux 24 (see FIG. 12 and the like) for oxidation prevention, wettability improvement, and the like.

[發熱體] [heating stuff]

使第1可熔導體13加熱、熔融之發熱體14,係通電則發熱之具有導電性之構件,由例如鎳鉻合金、W、Mo、Ru等或包含此等之材料構成。在將發熱體14設於絕緣基板上之場合,藉由使用網版印刷技術將此等合金或組成物、化合物之粉狀體與樹脂結合劑等混合而成糊狀者在絕緣基板上形成圖案、加以燒成等形成。 The heat generating body 14 that heats and melts the first meltable conductor 13 is a conductive member that generates heat when it is energized, and is made of, for example, a nickel-chromium alloy, W, Mo, Ru, or the like. When the heating element 14 is placed on an insulating substrate, the alloy or the composition, the powder of the compound, the resin binder, and the like are mixed by a screen printing technique to form a paste, and a pattern is formed on the insulating substrate. And formed by firing.

[絕緣層] [Insulation]

發熱體14透過絕緣層17與支撐第1可熔導體13之第1電極11連續, 能透過絕緣層17加熱第1電極11。絕緣層17係為了謀求發熱體14之保護及絕緣且使發熱體14之熱以良好效率傳至第1電極11而設置,由例如玻璃層構成。第1電極11藉由被發熱體14加熱而使第1可熔導體13熔融,且能使熔融導體13a易於凝結。 The heating element 14 is continuous with the first electrode 11 that supports the first soluble conductor 13 through the insulating layer 17. The first electrode 11 can be heated through the insulating layer 17. The insulating layer 17 is provided in order to protect and insulate the heating element 14 and to transfer the heat of the heating element 14 to the first electrode 11 with good efficiency, and is composed of, for example, a glass layer. The first electrode 11 is heated by the heating element 14 to melt the first meltable conductor 13, and the molten conductor 13a can be easily condensed.

又,發熱體14一端與發熱體拉出電極18連接,另一端與發熱體電極19連接。發熱體拉出電極18及發熱體電極19係與使發熱體14通電之外部電路之連接電極,發熱體14藉由外部電路而控制發熱體拉出電極18與發熱體電極19間之通電。 Further, one end of the heating element 14 is connected to the heating element drawing electrode 18, and the other end is connected to the heating element electrode 19. The heating element drawing electrode 18 and the heating element electrode 19 are connection electrodes of an external circuit for energizing the heating element 14, and the heating element 14 controls the energization between the heating element drawing electrode 18 and the heating element electrode 19 by an external circuit.

短路元件1亦可使發熱體拉出電極18支撐第1可熔導體13之一端。此時,短路元件1如圖1(A)(B)所示,將發熱體拉出電極18設於第2電極12之與第1電極11相反之側,跨第2電極12上而配置第1可熔導體13。藉由第1可熔導體13被第1電極11與發熱體拉出電極18支撐,短路元件1中,第1電極11及第1可熔導體13構成對發熱體14之通電路徑之一部分。因此,短路元件1,由於在第1可熔導體13熔融而使第1、第2電極11,12間短路後,即熔斷第1電極11與發熱體拉出電極18之間,阻斷對發熱體14之通電路徑,因此能使發熱停止。此外,發熱體拉出電極18,為了使更多之熔融導體13a凝結於第1電極11,較佳為形成為較第1電極11狹窄。 The short-circuiting element 1 can also cause the heating element pull-out electrode 18 to support one end of the first fusible conductor 13. At this time, as shown in FIG. 1 (A) and (B), the short-circuiting element 1 is provided on the side opposite to the first electrode 11 of the second electrode 12 as shown in FIG. 1 (A) and (B), and is disposed across the second electrode 12. 1 fusible conductor 13. The first meltable conductor 13 is supported by the first electrode 11 and the heat generating body pull-out electrode 18. In the short-circuiting element 1, the first electrode 11 and the first meltable conductor 13 constitute one of the energizing paths to the heat generating body 14. Therefore, the short-circuiting element 1 is short-circuited between the first and second electrodes 11 and 12 after the first meltable conductor 13 is melted, that is, between the first electrode 11 and the heating element drawing electrode 18, and the heat is blocked. The energization path of the body 14 thus stops the heat generation. Further, the heating element pulls out the electrode 18, and in order to condense more of the molten conductor 13a on the first electrode 11, it is preferably formed to be narrower than the first electrode 11.

[電路構成] [circuit composition]

短路元件1具有圖3所示之電路構成。亦即,短路元件1在動作前之狀態,藉由第1電極11與第1、第2電極11,12接近且分離而被絕緣,構成藉由第1可熔導體13熔融而短路之開關2。第1、第2電極11,12,藉由 串聯於構裝短路元件1之電路基板之電流路徑上,而組裝於電源電路等各種外部電路28A,28B間。 The short-circuiting element 1 has the circuit configuration shown in FIG. In other words, the short-circuiting element 1 is insulated from the first and second electrodes 11 and 12 by the first electrode 11 in the state before the operation, and the switch 1 is short-circuited by the melting of the first soluble conductor 13 . First and second electrodes 11, 12, by It is connected in series to the current path of the circuit board on which the short-circuiting element 1 is mounted, and is assembled between various external circuits 28A and 28B such as a power supply circuit.

又,短路元件1中,形成發熱體14從第1電極11經由第1可熔導體13、發熱體拉出電極18而連續,進而到達發熱體電極19之供電路徑3。 Further, in the short-circuiting element 1, the heating element 14 is formed to continue from the first electrode 11 through the first fusible conductor 13 and the heating element pulling-out electrode 18, and further to the power supply path 3 of the heating element electrode 19.

短路元件1通常係藉由透過發熱體電極19連接之電流控制元件32控制對供電路徑3之通電。電流控制元件32係控制對供電路徑之開關元件,與藉由例如FET構成、檢測組裝短路元件1之外部電路之物理短路之要否的檢測電路35連接。檢測電路35係檢測出是否產生使各種外部電路28A,28B(組裝有短路元件1)間通電之必要的電路,例如在電池包之異常電壓時之旁通電流路徑之建構、對網路通訊機器中之駭客或入侵而使資料伺服器迂迴之旁通訊號路徑的建構、或者裝置或軟體之啟動等,產生要藉由第1、第2電極11,12之短路而物理地、不可逆地使外部電路28A,28B間之電流路徑短路的必要時,係使電流控制元件32動作。 The short-circuiting element 1 normally controls the energization of the power supply path 3 by the current control element 32 connected through the heating element electrode 19. The current control element 32 controls the switching element of the power supply path to be connected to the detection circuit 35 which is constituted by, for example, a FET and detects the necessity of physical short circuit of the external circuit in which the short-circuit element 1 is assembled. The detecting circuit 35 detects whether or not a circuit necessary for energizing the various external circuits 28A, 28B (with the short-circuiting element 1 is assembled), for example, a bypass current path at the abnormal voltage of the battery pack, and a network communication device are detected. In the case of a hacker or an intrusion, the construction of the communication number path bypassing the data server, or the activation of the device or the software, etc., is caused by the short circuit of the first and second electrodes 11, 12 to be physically and irreversibly When the current path between the external circuits 28A, 28B is short-circuited, the current control element 32 is operated.

藉此,短路元件1,藉由電流控制元件32而使供電路徑3通電,發熱體14發熱。在透過供電路徑3使發熱體14通電後,如圖2(A)(B)所示,第1可熔導體13藉由發熱體14而被加熱、熔融,熔融導體13a凝結於第1電極11周圍,且亦與相鄰配置之第2電極12接觸。藉此,短路元件1中,已絕緣之第1、第2電極11,12透過熔融導體13a而短路,而連接外部電路28A,28B。 Thereby, the short-circuiting element 1 energizes the power supply path 3 by the current control element 32, and the heating element 14 generates heat. After the heating element 14 is energized through the power supply path 3, as shown in FIG. 2(A) and FIG. 2(B), the first soluble conductor 13 is heated and melted by the heating element 14, and the molten conductor 13a is condensed on the first electrode 11 It is also in contact with the second electrode 12 disposed adjacent to each other. Thereby, in the short-circuiting element 1, the insulated first and second electrodes 11, 12 are short-circuited by the molten conductor 13a, and the external circuits 28A and 28B are connected.

此時,短路元件1由於將第1可熔導體13往第2電極12側突出支撐,或較佳為重疊於第2電極12而支撐,因此在第1可熔導體13 藉由發熱體14之熱而熔融後,在熔融導體13a凝結於第1電極11周圍之過程中因張力或重力而對第2電極12接觸,能確實地使第1、第2電極11,12間短路。 At this time, the short-circuiting element 1 is supported by the first soluble conductor 13 on the second electrode 12 side, or is preferably superposed on the second electrode 12, so that the first fusible conductor 13 is provided. After being melted by the heat of the heat generating body 14, the second electrode 12 is brought into contact with the tension or gravity during the process in which the molten conductor 13a is condensed around the first electrode 11, and the first and second electrodes 11 and 12 can be surely made. Short circuit between.

又,短路元件1由於將第1可熔導體13往第2電極12側突出而支撐,或較佳為重疊於第2電極12而支撐,更佳為與發熱體拉出電極18一起支撐,因此例如在將短路元件1對外部電路回焊構裝時,亦能防止第1可熔導體13往第2電極12側偏靠而短路之初期短路或熔融導體13a未遍佈凝結於第1電極11與第2電極12間而成為未短路之事態。 Further, the short-circuiting element 1 is supported by protruding the first soluble conductor 13 toward the second electrode 12 side, or preferably by being superposed on the second electrode 12, and more preferably supported by the heating element pulling-out electrode 18, For example, when the short-circuiting element 1 is reflowed to the external circuit, it is possible to prevent the first meltable conductor 13 from being biased toward the second electrode 12 side and short-circuiting, or the molten conductor 13a is not condensed on the first electrode 11 and There is a state in which the second electrode 12 is not short-circuited.

又,短路元件1在第1、第2電極11,12間短路後,連接第1電極11與發熱體拉出電極18間之第1可熔導體13即熔斷。藉此,短路元件1中,透過第1可熔導體13連接之第1電極11與發熱體拉出電極18之間即被開放,而阻斷對發熱體14之供電路徑3。是以,對發熱體14之供電停止,發熱體14之發熱停止。將短路元件1動作時之電路構成顯示於圖4。 Further, after the short-circuiting element 1 is short-circuited between the first and second electrodes 11, 12, the first meltable conductor 13 connecting the first electrode 11 and the heating element drawing electrode 18 is melted. Thereby, in the short-circuiting element 1, the first electrode 11 connected to the first soluble conductor 13 and the heating element drawing electrode 18 are opened, and the power supply path 3 to the heating element 14 is blocked. Therefore, the power supply to the heating element 14 is stopped, and the heat generation of the heating element 14 is stopped. The circuit configuration when the short-circuiting element 1 is operated is shown in FIG.

[熔斷順序] [fuse sequence]

此處,短路元件1形成為在第1、第2電極11,12間短路後,連接第1電極11與發熱體拉出電極18之間之第1可熔導體13即熔斷。透過第1可熔導體13連接之第1電極11與發熱體拉出電極18,由於構成對發熱體14之供電路徑3,因此若在第1、第2電極11,12之短路前第1電極11與發熱體拉出電極18之間熔斷,則對發熱體14之供電停止,而有無法使第1、第2電極11,12間短路之虞。 Here, the short-circuiting element 1 is formed such that the first fusible conductor 13 between the first electrode 11 and the heating element drawing electrode 18 is blown after being short-circuited between the first and second electrodes 11 and 12. The first electrode 11 connected to the first fusible conductor 13 and the heating element drawing electrode 18 constitute the power supply path 3 to the heating element 14, so that the first electrode before the short circuit of the first and second electrodes 11 and 12 When the fuse 11 is blown between the heating element pull-out electrode 18, the power supply to the heating element 14 is stopped, and the first and second electrodes 11 and 12 cannot be short-circuited.

因此,短路元件1形成為,在發熱體14發熱後,第1電極 11與發熱體拉出電極18之間之阻斷前,第1、第2電極11,12間會先短路。具體而言,短路元件1中,發熱體拉出電極18配設於較第1、第2電極11,12更與發熱體14分離之位置。藉此,短路元件1,在發熱體14發熱後,第1電極11能較發熱體拉出電極18更快被傳遞熱。是以,在藉由第1電極11使往第2電極12側突出而被支撐之第1可熔導體13熔融後,能迅速地使熔融導體13a凝結於第1電極11周圍,且熔融導體13a能使第1、第2電極11,12間短路,其後阻斷發熱體拉出電極18。 Therefore, the short-circuiting element 1 is formed such that after the heating element 14 generates heat, the first electrode Before the blocking between the 11 and the heating element pull-out electrode 18, the first and second electrodes 11, 12 are short-circuited first. Specifically, in the short-circuiting element 1 , the heating element drawing electrode 18 is disposed at a position separated from the heating element 14 by the first and second electrodes 11 and 12 . Thereby, after the short-circuiting element 1 generates heat, the first electrode 11 can transfer heat faster than the heat-generating body pulls out the electrode 18. When the first meltable conductor 13 supported by the first electrode 11 and protruding toward the second electrode 12 side is melted, the molten conductor 13a can be quickly condensed around the first electrode 11, and the molten conductor 13a can be condensed. The first and second electrodes 11 and 12 can be short-circuited, and then the heating element can be pulled out of the electrode 18.

[輔助可熔導體] [Auxiliary Fusible Conductor]

又,短路元件1,亦可於第2電極12連接輔助可熔導體21,且發熱體14透過絕緣層17與第1、第2電極11,12連接。 Further, in the short-circuiting element 1, the auxiliary fusible conductor 21 may be connected to the second electrode 12, and the heating element 14 may be connected to the first and second electrodes 11, 12 through the insulating layer 17.

藉由於第2電極12亦設置輔助可熔導體21,而能如圖6所示,短路元件1,藉由第1可熔導體13及輔助可熔導體21之各熔融導體13a,21a使遍佈凝結於第1、第2電極11,12間之熔融導體之量增大,而能確實地使之短路。輔助可熔導體21能使用與第1可熔導體13相同材料形成。又,輔助可熔導體21亦如後說明般能藉由各種構成來形成。又,輔助可熔導體21係與第1可熔導體13同樣地藉由接合焊料等接合材15而接合於第2電極12。 Since the second electrode 12 is also provided with the auxiliary fusible conductor 21, as shown in FIG. 6, the short-circuiting element 1 can be condensed by the respective fused conductors 13a, 21a of the first fusible conductor 13 and the auxiliary fusible conductor 21. The amount of the molten conductor between the first and second electrodes 11 and 12 is increased, and the amount of the molten conductor can be reliably short-circuited. The auxiliary fusible conductor 21 can be formed using the same material as the first fusible conductor 13. Further, the auxiliary fusible conductor 21 can also be formed by various configurations as will be described later. Further, the auxiliary soluble conductor 21 is joined to the second electrode 12 by bonding the bonding material 15 such as solder, similarly to the first soluble conductor 13 .

此外,輔助可熔導體21較佳為從第2電極12往第1電極11側突出設置,突出至與第1電極11分離同時重疊之位置。又,輔助可熔導體21藉由支撐成亦與第1可熔導體13重疊,輔助可熔導體21之熔融導體21a與第1可熔導體13之熔融導體13a較易凝結,而能有助於第1、第2電極11,12間之短路。 Further, the auxiliary fusible conductor 21 preferably protrudes from the second electrode 12 toward the first electrode 11 side, and protrudes to a position overlapping with the first electrode 11 and overlapping. Further, the auxiliary fusible conductor 21 is supported to also overlap with the first fusible conductor 13, and the molten conductor 21a of the auxiliary fusible conductor 21 and the molten conductor 13a of the first fusible conductor 13 are more likely to be condensed, which can contribute to Short circuit between the first and second electrodes 11,12.

接合有輔助可熔導體21之第2電極12,係與第1電極11同樣地,透過絕緣層17與發熱體14呈連續。藉此,第2電極12能透過絕緣層17使發熱體14之熱以良好效率傳遞,能使輔助可熔導體21迅速地熔融。 The second electrode 12 to which the auxiliary soluble conductor 21 is bonded is continuous with the heat generating body 14 through the insulating layer 17 similarly to the first electrode 11. Thereby, the second electrode 12 can transmit the heat of the heat generating body 14 with good efficiency through the insulating layer 17, and the auxiliary soluble conductor 21 can be rapidly melted.

再者,藉由第2電極12之中空構造使熱容量降低、材料之低比熱化、材料之高熱傳導率化等來提升升溫速度,藉此加快輔助可熔導體21之熔融,使第1電極11與第2電極12間之短路較第1可熔導體13之熔融快,如此能確實地在第1電極11與發熱體拉出電極18間之阻斷前使第1、第2電極11,12間短路。 Further, the hollow structure of the second electrode 12 reduces the heat capacity, lowers the specific heat of the material, and increases the thermal conductivity of the material, thereby increasing the temperature increase rate, thereby accelerating the melting of the auxiliary soluble conductor 21, and the first electrode 11 is accelerated. The short circuit between the second electrode 12 and the second electrode 12 is faster than the melting of the first meltable conductor 13, so that the first and second electrodes 11 and 12 can be reliably held before the blocking between the first electrode 11 and the heating element drawing electrode 18. Short circuit between.

[短路元件40] [Short Circuit Element 40]

又,適用本發明之短路元件亦可如圖7(A)(B)所示,將發熱體拉出電極18設於第1電極11之與發熱體12相反側,將第1可熔導體13懸臂支撐於第2電極12上。此外,在短路元件40之說明中,對與上述之短路元件1相同之構件,賦予相同符號省略其詳細說明。 Further, as shown in FIGS. 7(A) and (B), the short-circuiting element of the present invention may be provided with the heating element drawing electrode 18 provided on the opposite side of the first electrode 11 from the heating element 12, and the first fusible conductor 13 may be provided. The cantilever is supported on the second electrode 12. In the description of the short-circuiting element 40, the same members as those of the above-described short-circuiting element 1 will be denoted by the same reference numerals and will not be described in detail.

此短路元件40中,藉由將第1可熔導體13往第2電極12側突出而支撐,較佳為支撐為與第2電極12重疊,而能如圖8(A)(B)所示,熔融導體13a在藉由發熱體14之發熱而熔融後,即藉由張力或重力對第2電極12接觸,確實地使第1、第2電極11,12間短路。 In the short-circuiting element 40, the first meltable conductor 13 is supported by the second electrode 12, and it is preferably supported so as to overlap the second electrode 12, as shown in Fig. 8(A) and (B). After the molten conductor 13a is melted by the heat generation of the heating element 14, the second electrode 12 is brought into contact by tension or gravity, and the first and second electrodes 11 and 12 are reliably short-circuited.

又,短路元件40亦同樣地,較佳為將發熱體拉出電極18配設於較第1、第2電極11,12更與發熱體14分離之位置,以在第1、第2電極11,12間短路後阻斷第1電極11與發熱體拉出電極18之間。 Further, similarly, in the short-circuiting element 40, it is preferable that the heat generating body pull-out electrode 18 is disposed at a position separated from the heat generating body 14 by the first and second electrodes 11, 12 so as to be at the first and second electrodes 11 After 12 short circuits, the first electrode 11 and the heating element pull-out electrode 18 are blocked.

又,短路元件40亦同樣地,如圖9(A)(B)所示,亦可於第2 電極12連接輔助可熔導體21,且發熱體14透過絕緣層17與第1、第2電極11,12連續。此情形亦同樣地,短路元件40中,將輔助可熔導體21從第2電極12往第1電極11側突出設置,較佳為突出至與第1電極11分離同時重疊之位置。又,輔助可熔導體21藉由支撐成亦與第1可熔導體13重疊,輔助可熔導體21之熔融導體21a與第1可熔導體13之熔融導體13a較易凝結,而能有助於第1、第2電極11,12間之短路。 Further, similarly, the short-circuiting element 40 may be as shown in FIG. 9(A) and FIG. The electrode 12 is connected to the auxiliary soluble conductor 21, and the heating element 14 is continuous with the first and second electrodes 11, 12 through the insulating layer 17. In this case as well, in the short-circuiting element 40, the auxiliary soluble conductor 21 is protruded from the second electrode 12 toward the first electrode 11 side, and preferably protrudes to a position overlapping with the first electrode 11 and overlapping. Further, the auxiliary fusible conductor 21 is supported to also overlap with the first fusible conductor 13, and the molten conductor 21a of the auxiliary fusible conductor 21 and the molten conductor 13a of the first fusible conductor 13 are more likely to be condensed, which can contribute to Short circuit between the first and second electrodes 11,12.

此外,上述之短路元件1,40,亦可如圖10、圖11所示,於第1、第2電極11,12之與發熱體拉出電極18相反側,設置支撐第1可熔導體13另一端之支撐電極22。短路元件1,40中,藉由將第1可熔導體13之兩端支撐於發熱體拉出電極18及支撐電極22,而能在回焊構裝時等之高溫度環境下亦能穩定支撐第1可熔導體13。 Further, as shown in FIGS. 10 and 11, the short-circuiting elements 1 and 40 may be provided on the opposite side of the first and second electrodes 11 and 12 from the heating element drawing electrode 18, and the first meltable conductor 13 may be supported. The other end of the support electrode 22. In the short-circuiting elements 1, 40, by supporting both ends of the first fusible conductor 13 on the heating element drawing electrode 18 and the supporting electrode 22, it is possible to stably support in a high temperature environment such as reflow soldering. The first fusible conductor 13.

[表面構裝類型] [surface structure type]

又,適用本發明之短路元件,能以能表面構裝之方式形成於外部電路基板。形成為表面構裝用之短路元件1,如圖12(A)~(C)所示,於絕緣基板10之表面10a形成發熱體14、發熱體拉出電極18、以及發熱體電極19,透過絕緣層17於發熱體14上積層有第1、第2電極11,12。第1可熔導體13係與第2電極12重疊且與第1電極11與發熱體拉出電極18連接。此外,圖12(A)係表面構裝型之短路元件1之俯視圖,圖12(B)係穿過短路元件1之發熱體14等而顯示之俯視圖,圖12(C)係圖12(A)之A-A’剖面圖。 Further, the short-circuiting element to which the present invention is applied can be formed on the external circuit board in a surface mountable manner. As shown in FIGS. 12(A) to (C), the short-circuiting element 1 formed in the surface structure forms a heating element 14, a heating element drawing electrode 18, and a heating element electrode 19 on the surface 10a of the insulating substrate 10, and transmits the same. The insulating layer 17 has the first and second electrodes 11 and 12 laminated on the heating element 14. The first meltable conductor 13 is overlapped with the second electrode 12 and connected to the first electrode 11 and the heating element drawing electrode 18. 12(A) is a plan view of the short-circuiting element 1 of the surface-mount type, and FIG. 12(B) is a plan view showing the heat-generating body 14 or the like passing through the short-circuiting element 1, and FIG. 12(C) is FIG. ) A-A' section view.

絕緣基板10係使用例如氧化鋁、玻璃陶瓷、多鋁紅柱石、氧化鋯等之具有絕緣性之構件形成為大致方形。絕緣基板10,除此之外亦可使用用於玻璃環氧基板、酚醛基板等之印刷配線基板之材料亦可,但必 須留意第1可熔導體13熔斷時之溫度。 The insulating substrate 10 is formed into a substantially square shape using an insulating member such as alumina, glass ceramic, mullite, or zirconia. In addition to the insulating substrate 10, a material for a printed wiring board such as a glass epoxy substrate or a phenolic substrate may be used, but it is necessary Attention should be paid to the temperature at which the first fusible conductor 13 is blown.

發熱體14,能將例如鎳鉻合金、W、Mo、Ru等之合金或組成物、化合物之粉狀體與樹脂結合劑等混合而成糊狀者使用網版印刷技術在絕緣基板10之表面10a上形成圖案、加以燒成等形成。又,發熱體拉出電極18及發熱體電極19,能將例如Ag等高熔點金屬糊使用網版印刷技術在絕緣基板10之表面10a上形成圖案、加以燒成等形成。 The heating element 14 can be mixed with an alloy or a composition such as a nickel-chromium alloy, W, Mo, or Ru, a powder of a compound, a resin binder, or the like to form a paste, and a screen printing technique is used on the surface of the insulating substrate 10. A pattern is formed on 10a, and it is formed by baking or the like. Further, the heating element pulls out the electrode 18 and the heating element electrode 19, and a high melting point metal paste such as Ag can be formed on the surface 10a of the insulating substrate 10 by a screen printing technique, and baked.

又,發熱體14,一端與發熱體拉出電極18連接,另一端與發熱體電極19連接。發熱體拉出電極18具有形成於絕緣基板10之表面10a且與發熱體14連接之下層部18a、以及積層於下層部18a上且與第1可熔導體13連接之上層部18b。發熱體拉出電極18之上層部18b,係從下層部18a形成至絕緣層17上,透過接合材15連接有第1可熔導體13。發熱體電極19,係與形成於絕緣基板10之背面10b之外部連接端子19a連接。發熱體14透過此外部連接端子19a而與外部電路連接。 Further, the heating element 14 has one end connected to the heating element drawing electrode 18 and the other end connected to the heating element electrode 19. The heating element drawing electrode 18 has a layer portion 18a formed on the surface 10a of the insulating substrate 10 and connected to the heating element 14, and a layer portion 18b laminated on the lower layer portion 18a and connected to the first meltable conductor 13. The upper portion 18b of the heating element drawing electrode 18 is formed from the lower layer portion 18a to the insulating layer 17, and the first fusible conductor 13 is connected through the bonding material 15. The heating body electrode 19 is connected to an external connection terminal 19a formed on the back surface 10b of the insulating substrate 10. The heating element 14 is connected to an external circuit through the external connection terminal 19a.

發熱體14在絕緣基板10之表面10a上被絕緣層17覆蓋。絕緣層17係謀求發熱體14之保護及絕緣,且係用以將發熱體14之熱以良好效率往第1、第2電極11,12傳遞而設置,由例如玻璃層構成。於絕緣層17上,以與發熱體14重疊之方式相鄰形成有第1、第2電極11,12,從發熱體14分離而形成有發熱體拉出電極18。藉由發熱體14加熱第1、第2電極11,12,可使第1可熔導體13之熔融導體13a容易地凝結。 The heating element 14 is covered by the insulating layer 17 on the surface 10a of the insulating substrate 10. The insulating layer 17 is provided to protect and insulate the heating element 14, and is configured to transmit heat of the heating element 14 to the first and second electrodes 11 and 12 with good efficiency, and is formed of, for example, a glass layer. The first and second electrodes 11 and 12 are formed adjacent to the heating element 14 so as to overlap the heating element 14, and the heating element drawing electrode 18 is formed by being separated from the heating element 14. When the first and second electrodes 11 and 12 are heated by the heating element 14, the molten conductor 13a of the first soluble conductor 13 can be easily condensed.

此外,絕緣層17亦可亦形成於絕緣基板10與發熱體14之間。亦即,短路元件1亦可將發熱體14形成於形成在絕緣基板10之表面10a之絕緣層17內部。 Further, the insulating layer 17 may also be formed between the insulating substrate 10 and the heating element 14. That is, the short-circuiting element 1 can also form the heat generating body 14 inside the insulating layer 17 formed on the surface 10a of the insulating substrate 10.

第1、第2電極11,12係從絕緣基板10之表面10a形成至絕緣層17上。又,第1、第2電極11,12係與形成於絕緣基板10之背面10b之外部連接端子11a,12a連接。短路元件1透過此外部連接端子11a,12a組裝於電源電路等各種外部電路。 The first and second electrodes 11, 12 are formed on the insulating layer 17 from the surface 10a of the insulating substrate 10. Further, the first and second electrodes 11, 12 are connected to the external connection terminals 11a, 12a formed on the back surface 10b of the insulating substrate 10. The short-circuiting element 1 is assembled to various external circuits such as a power supply circuit through the external connection terminals 11a and 12a.

於第1電極11與發熱體拉出電極18之間,連接跨第2電極12上而形成為板狀之第1可熔導體13。第1可熔導體13藉由形成於第1、第2電極11,12之玻璃等絕緣層23,與第1、第2電極11,12分離而被支撐,且藉由設於第1電極11及發熱體拉出電極18之接合焊料等接合材15能導通地支撐於第1電極11及發熱體拉出電極18。藉此,短路元件1形成第1電極11、第1可熔導體13、發熱體拉出電極18、發熱體14、至發熱體電極19之對發熱體14之供電路徑3。 Between the first electrode 11 and the heating element drawing electrode 18, a first fusible conductor 13 which is formed in a plate shape across the second electrode 12 is connected. The first soluble conductor 13 is separated from the first and second electrodes 11 and 12 by the insulating layer 23 formed of the glass of the first and second electrodes 11 and 12, and is provided on the first electrode 11 The bonding material 15 such as the bonding solder of the heating element drawing electrode 18 can be electrically connected to the first electrode 11 and the heating element drawing electrode 18. Thereby, the short-circuiting element 1 forms the first electrode 11, the first soluble conductor 13, the heating element drawing electrode 18, the heating element 14, and the power supply path 3 to the heating element 14 of the heating element electrode 19.

此外,絕緣部23係除去相鄰設置之第1、第2電極11,12所對向之一部分而形成。又,於發熱體拉出電極18亦形成有絕緣層23,防止連接用焊料等接合材15或熔融導體13a之流出。再者,第1可熔導體13,為了氧化防止、濕潤性提升等而塗布有助焊劑24。又,短路元件1中,絕緣基板10之表面10a上係被覆蓋構件25覆蓋。 Further, the insulating portion 23 is formed by removing one of the opposing portions of the first and second electrodes 11 and 12 which are disposed adjacent to each other. Moreover, the insulating layer 23 is also formed on the heating element drawing electrode 18, and the outflow of the bonding material 15 such as solder for connection or the molten conductor 13a is prevented. Further, the first fusible conductor 13 is coated with the flux 24 for oxidation prevention, wettability improvement, and the like. Further, in the short-circuiting element 1, the surface 10a of the insulating substrate 10 is covered by the covering member 25.

短路元件1,在發熱體14發熱後,如圖13(A)(B)所示,透過絕緣層17及第1、第2電極11,12加熱第1可熔導體13,熔融導體13a凝結於第2電極12間且使之短路。此時,短路元件1藉由將第1可熔導體13支撐為與第2電極12重疊,而藉由發熱體14之熱而熔融後,熔融導體13a因張力或重力而對第2電極12接觸,能確實地使第1、第2電極11,12間短路。此外,短路元件1中,藉由設於第1、第2電極11,12上之絕緣層23 而使熔融導體13a停留於第1、第2電極11,12間,能防止熔融導體13a往外部連接端子11a,12a側流出而對與外部電路之連接狀態造成影響的事態。 After the heat generating element 14 generates heat, the short-circuiting element 1 heats the first meltable conductor 13 through the insulating layer 17 and the first and second electrodes 11 and 12, and the molten conductor 13a is condensed as shown in Fig. 13 (A) and (B). The second electrode 12 is short-circuited between them. At this time, the short-circuiting element 1 is supported by the first electrode 13 to be superposed on the second electrode 12, and is melted by the heat of the heating element 14, and the molten conductor 13a is in contact with the second electrode 12 due to tension or gravity. It is possible to reliably short-circuit the first and second electrodes 11 and 12. Further, in the short-circuiting element 1, the insulating layer 23 provided on the first and second electrodes 11, 12 Further, the molten conductor 13a stays between the first and second electrodes 11 and 12, and it is possible to prevent the molten conductor 13a from flowing out to the external connection terminals 11a and 12a and affecting the connection state with the external circuit.

其次,如圖14(A)(B)所示,短路元件1中,第1可熔導體13在第1電極11與發熱體拉出電極18之間熔斷,阻斷對發熱體14之供電路徑3而停止發熱。 Next, as shown in FIG. 14(A) and FIG. 14(B), in the short-circuiting element 1, the first soluble conductor 13 is blown between the first electrode 11 and the heating element drawing electrode 18, and the power supply path to the heating element 14 is blocked. 3 and stop heating.

此處,短路元件1由於設於第1、第2電極11,12與發熱體14重疊且發熱體拉出電極18從發熱體14分離之位置,因此在發熱體14發熱後,能在第1電極11與發熱體拉出電極18間之供電路徑3之阻斷前先使第1、第2電極11,12間短路。 Here, since the short-circuiting element 1 is disposed at the position where the first and second electrodes 11 and 12 overlap the heating element 14 and the heating element drawing electrode 18 is separated from the heating element 14, the heating element 14 can be heated first. Before the blocking of the power supply path 3 between the electrode 11 and the heating element drawing electrode 18, the first and second electrodes 11, 12 are short-circuited.

此外,短路元件1亦可如圖12所示,使第1可熔導體13延伸於第1電極11之與第2電極12相反側。藉此,短路元件1能使凝結於第1、第2電極11,12間之熔融導體13a之量增大,而能確實地使之短路。 Further, as shown in FIG. 12, the short-circuit element 1 may extend the first soluble conductor 13 to the side opposite to the second electrode 12 of the first electrode 11. Thereby, the short-circuiting element 1 can increase the amount of the molten conductor 13a condensed between the first and second electrodes 11 and 12, and can reliably short-circuit it.

又,短路元件1亦可如圖15(A)(B)所示設置支撐電極22,用以支撐延伸於第1電極11之與第2電極12相反側之第1可熔導體13之端部。短路元件1中,藉由將第1可熔導體13之兩端支撐於發熱體拉出電極18及支撐電極22,而能在回焊構裝時等之高溫度環境下亦能穩定支撐第1可熔導體13。 Further, the short-circuiting element 1 may be provided with a supporting electrode 22 as shown in FIG. 15(A) and (B) for supporting the end of the first fusible conductor 13 extending on the opposite side of the first electrode 11 from the second electrode 12. . In the short-circuiting element 1, by supporting both ends of the first fusible conductor 13 on the heating element drawing electrode 18 and the supporting electrode 22, it is possible to stably support the first one in a high temperature environment such as reflow soldering. Fusible conductor 13.

又,上述之短路元件40亦同樣地能形成為表面構裝用。此短路元件40如圖16(A)(B)所示,於絕緣層17上,發熱體拉出電極18設於第1電極11之與第2電極12相反側,第1可熔導體13延伸於第2電極12上。此外,圖16所示之短路元件40除了圖12所示之短路元件1與第1、第2電極11,12之位置外具有相同構成。 Further, the short-circuiting element 40 described above can be similarly formed for surface mounting. As shown in FIG. 16(A) and FIG. 16(B), the short-circuiting element 40 is provided on the insulating layer 17, and the heating element drawing electrode 18 is provided on the opposite side of the first electrode 11 from the second electrode 12, and the first fusible conductor 13 is extended. On the second electrode 12. Further, the short-circuiting element 40 shown in FIG. 16 has the same configuration except for the positions of the short-circuiting element 1 and the first and second electrodes 11, 12 shown in FIG.

又,短路元件40亦同樣地可使第1可熔導體13延伸於第2電極12之與第1電極11相反側。藉此,短路元件40能使凝結於第1、第2電極11,12間之熔融導體13a之量增大,而能確實地使之短路。又,短路元件40亦可如圖17(A)(B)所示設置支撐電極22,用以支撐延伸於第1電極11之與第2電極12相反側之第1可熔導體13之端部。 Further, similarly, the short-circuiting element 40 can extend the first soluble conductor 13 to the side opposite to the first electrode 11 of the second electrode 12. Thereby, the short-circuiting element 40 can increase the amount of the molten conductor 13a condensed between the first and second electrodes 11 and 12, and can reliably short-circuit it. Further, the short-circuiting element 40 may be provided with a supporting electrode 22 as shown in FIG. 17(A) and (B) for supporting the end of the first fusible conductor 13 extending on the opposite side of the first electrode 11 from the second electrode 12. .

[短路元件50] [Short Circuit Element 50]

又,適用本發明之短路元件中,對發熱體14之供電路徑3與藉由第1可熔導體13短路之第1、第2電極11,12在電性上獨立亦可。此短路元件50係如圖18(A)(B)所示,於發熱體14一端連接發熱體拉出電極18,於發熱體14另一端形成有發熱體電極19,而形成對發熱體14之供電路徑3,第1可熔導體13不與發熱體拉出電極18連接而被第1電極11支撐。此外,在短路元件50之說明中,對與上述之短路元件1相同之構件,賦予相同符號省略其詳細說明。 Further, in the short-circuiting element to which the present invention is applied, the power supply path 3 of the heating element 14 and the first and second electrodes 11, 12 short-circuited by the first soluble conductor 13 may be electrically independent. As shown in FIGS. 18(A) and (B), the short-circuiting element 50 is connected to the heating element drawing electrode 18 at one end of the heating element 14, and the heating element electrode 19 is formed at the other end of the heating element 14 to form a heating element 14. In the power supply path 3, the first soluble conductor 13 is not connected to the heating element drawing electrode 18 and is supported by the first electrode 11. In the description of the short-circuiting element 50, the same members as those of the above-described short-circuiting element 1 will be denoted by the same reference numerals and will not be described in detail.

短路元件50中,支撐第1可熔導體13之第1電極11透過絕緣層17與發熱體14連接,發熱體14之熱以良好效率傳遞,藉此能使第1可熔導體13熔融。亦即,短路元件50中,發熱體14與第1電極11及第1可熔導體13在電性上獨立而為熱連接。 In the short-circuiting element 50, the first electrode 11 supporting the first meltable conductor 13 is connected to the heat generating body 14 through the insulating layer 17, and the heat of the heat generating body 14 is transmitted with good efficiency, whereby the first meltable conductor 13 can be melted. That is, in the short-circuiting element 50, the heating element 14 is electrically connected to the first electrode 11 and the first meltable conductor 13 independently of each other.

又,短路元件50中,供電路徑3透過設於發熱體拉出電極18之外部連接端子18a而與形成在外部電路之電源連接。 Further, in the short-circuiting element 50, the power feeding path 3 is connected to the external connection terminal 18a provided in the heating element drawing electrode 18, and is connected to a power source formed in the external circuit.

又,短路元件50中,第1可熔導體13藉由第1電極11往第2電極12側突出而被支撐,在藉由來自發熱體14之加熱使第1可熔導體13熔融後,藉由熔融導體13a凝結於第1電極11周圍而接觸於第2電極12, 藉此使第1、第2電極11,12間短路。 Further, in the short-circuiting element 50, the first meltable conductor 13 is supported by the first electrode 11 protruding toward the second electrode 12, and the first meltable conductor 13 is melted by heating from the heating element 14, and then borrowed. The molten conductor 13a is condensed around the first electrode 11 to contact the second electrode 12, Thereby, the first and second electrodes 11 and 12 are short-circuited.

短路元件50,由於組裝於外部電路之第1、第2電極11,12間之電流路徑與使第1可熔導體13熔斷之對發熱體14之供電路徑3在電性上獨立,因此不論外部電路之種類為何,均能將供電路徑3之電源電壓設定得較高,即使使用低額定值之發熱體14,亦能供應可得到足以使第1可熔導體13熔融之充分發熱量的電力。是以,根據短路元件50,作為透過第1、第2電極11,12使短路之外部電路,除了電源電路以外,亦能適用於流通微弱電流之數位訊號電路。 In the short-circuiting element 50, since the current path between the first and second electrodes 11 and 12 assembled in the external circuit and the power supply path 3 to the heating element 14 that fuses the first soluble conductor 13 are electrically independent, regardless of the external The type of the circuit can set the power supply voltage of the power supply path 3 to be high, and even if the heating element 14 of a low rated value is used, it is possible to supply electric power sufficient to generate sufficient heat amount for melting the first soluble conductor 13. Therefore, the external circuit that short-circuits the first and second electrodes 11 and 12 through the short-circuiting element 50 can be applied to a digital signal circuit that circulates a weak current in addition to the power supply circuit.

又,根據短路元件50,由於與組裝於外部電路之第1、第2電極11,12間之電流路徑在電性上獨立地形成對發熱體14之供電路徑3,因此能將控制對發熱體14之供電之電流控制元件32不拘外部電路之額定值為何而依據發熱體14之額定值來選擇,藉由使用控制低額定值之發熱體14(例如1A)之電流控制元件32,而能更廉價地製造。 Further, according to the short-circuiting element 50, since the current path between the first and second electrodes 11 and 12 assembled to the external circuit electrically forms the power supply path 3 to the heating element 14, the control can be performed on the heating element. The current control element 32 of the power supply of 14 is selected according to the rating of the external circuit, regardless of the rating of the external circuit, by using the current control element 32 of the heating element 14 (for example 1A) that controls the low rating. Can be manufactured cheaper.

[電路構成] [circuit composition]

其次,說明短路元件50之電路構成。圖19(A)顯示短路元件50之電路圖。圖20顯示適用短路元件50之短路電路60一例。 Next, the circuit configuration of the short-circuiting element 50 will be described. Fig. 19(A) shows a circuit diagram of the short-circuiting element 50. FIG. 20 shows an example of a short circuit 60 to which the short-circuiting element 50 is applied.

短路元件50,第1電極11及第2電極12在初期狀態下彼此開放,且構成藉由第1可熔導體13熔融即短路之開關2,具有藉由該開關2連接第1電極11與第2電極12之第1電路51。第1電路51串聯於組裝有短路元件50之電源電路或數位訊號電路等各種外部電路28A,28B間。 In the short-circuiting element 50, the first electrode 11 and the second electrode 12 are open to each other in an initial state, and a switch 2 that is short-circuited by the first soluble conductor 13 is formed, and the first electrode 11 and the first electrode 11 are connected by the switch 2 The first circuit 51 of the 2 electrode 12. The first circuit 51 is connected in series between various external circuits 28A, 28B such as a power supply circuit or a digital signal circuit in which the short-circuiting element 50 is incorporated.

又,短路元件50中,發熱體拉出電極18、發熱體14、以及發熱體電極19在初期狀態下構成對發熱體14之供電路徑3。供電路徑3, 由於與第1電路51電性上獨立,藉由發熱體14之熱使第1可熔導體13熔融,因此係與第1電路51熱連接。發熱體14一端透過發熱體拉出電極18連接於控制供電之電流控制元件32。又,發熱體14另一端透過發熱體電極19與對發熱體14供電之外部電源53連接。 Further, in the short-circuiting element 50, the heating element drawing electrode 18, the heating element 14, and the heating element electrode 19 constitute the power supply path 3 to the heating element 14 in an initial state. Power path 3, Since it is electrically independent of the first circuit 51, the first soluble conductor 13 is melted by the heat of the heating element 14, and therefore is thermally connected to the first circuit 51. One end of the heating element 14 is connected to the current control element 32 for controlling the power supply through the heating element drawing electrode 18. Further, the other end of the heating element 14 is connected to the external power source 53 that supplies power to the heating element 14 through the heating element electrode 19.

電流控制元件32係控制對供電路徑3供電之開關元件,與藉由例如FET構成、檢測第1電路51之物理短路之要否的檢測電路35連接。檢測電路35係檢測出是否產生使各種外部電路28A,28B(組裝有短路元件50之第1電路51)間通電之必要的電路,例如在電池包之異常電壓時之旁通電流路徑之建構、對網路通訊機器中之駭客或入侵而使資料伺服器迂迴之旁通訊號路徑的建構、或者裝置或軟體之啟動等,產生要藉由第1電路51之短路而物理地、不可逆地使外部電路28A,28B間之電流路徑短路的必要時,係使電流控制元件32動作。 The current control element 32 controls a switching element that supplies power to the power supply path 3, and is connected to a detection circuit 35 that is configured by, for example, an FET to detect the physical short circuit of the first circuit 51. The detection circuit 35 detects whether or not a circuit necessary for energizing the various external circuits 28A and 28B (the first circuit 51 in which the short-circuiting element 50 is incorporated) is generated, for example, the bypass current path is constructed when the battery pack is abnormally voltaged. The construction of the communication number path bypassing the hacker or the intrusion in the network communication device, or the activation of the device or the software, etc., is caused by the short circuit of the first circuit 51 to be physically and irreversibly When the current path between the external circuits 28A, 28B is short-circuited, the current control element 32 is operated.

藉此,在藉由對供電路徑3供應外部電源53之電力而發熱體14發熱,第1可熔導體13即熔融,熔融導體13a遍佈凝結於第1、第2電極11,12間。藉此,透過熔融導體13a使第1電極11與第2電極12短路,而連接外部電路28A,28B。 As a result, the heat generating body 14 generates heat by supplying the electric power of the external power source 53 to the power supply path 3, and the first soluble conductor 13 is melted, and the molten conductor 13a is condensed between the first and second electrodes 11 and 12. Thereby, the first electrode 11 and the second electrode 12 are short-circuited by the molten conductor 13a, and the external circuits 28A and 28B are connected.

此時,短路元件50中,由於對發熱體14之供電路徑3與第1電路51在電性上獨立地形成,因此可對發熱體14供電至第1、第2電極11,12短路為止。 At this time, in the short-circuiting element 50, since the power supply path 3 to the heating element 14 and the first circuit 51 are electrically formed independently, the heating element 14 can be supplied with power until the first and second electrodes 11 and 12 are short-circuited.

[輔助可熔導體] [Auxiliary Fusible Conductor]

又,短路元件50,亦可如圖21所示,於第2電極12連接輔助可熔導體21,且發熱體14透過絕緣層17與第1、第2電極11,12連接。藉此,短 路元件50,能藉由第1可熔導體13及輔助可熔導體21之各熔融導體13a,21a使遍佈凝結於第1、第2電極11,12間之熔融導體之量增大,而能確實地使之短路。 Further, as shown in FIG. 21, the short-circuiting element 50 may be connected to the second electrode 12 to the auxiliary soluble conductor 21, and the heating element 14 may be connected to the first and second electrodes 11, 12 through the insulating layer 17. By this, short The channel element 50 can increase the amount of the molten conductor that is condensed between the first and second electrodes 11 and 12 by the respective fused conductors 13a and 21a of the first and second soluble conductors 13 and 21, and can Make sure to short it.

此外,短路元件50亦同樣地,輔助可熔導體21較佳為從第2電極12往第1電極11側突出設置,突出至與第1電極11分離同時重疊之位置。又,輔助可熔導體21藉由支撐成亦與第1可熔導體13重疊,輔助可熔導體21之熔融導體21a與第1可熔導體13之熔融導體13a較易凝結,而能有助於第1、第2電極11,12間之短路。 Further, in the short-circuiting element 50, the auxiliary soluble conductor 21 is preferably protruded from the second electrode 12 toward the first electrode 11 side, and protrudes to a position overlapping with the first electrode 11 and overlapping. Further, the auxiliary fusible conductor 21 is supported to also overlap with the first fusible conductor 13, and the molten conductor 21a of the auxiliary fusible conductor 21 and the molten conductor 13a of the first fusible conductor 13 are more likely to be condensed, which can contribute to Short circuit between the first and second electrodes 11,12.

[短路元件70] [Short Circuit Element 70]

又,適用本發明之短路元件,亦可如圖22所示,於對發熱體14之供電路徑3上介在有第2可熔導體72。此短路元件70具有:發熱體供電電極71,與發熱體拉出電極18相鄰設置;以及跨載於發熱體拉出電極18及發熱體供電電極71間之第2可熔導體72。此外,在短路元件70之說明中,對與上述之短路元件1相同之構件,賦予相同符號省略其詳細說明。圖19(B)顯示短路元件70之電路圖。 Further, in the short-circuiting element of the present invention, as shown in Fig. 22, the second fusible conductor 72 may be interposed between the power supply path 3 of the heating element 14. The short-circuiting element 70 includes a heating element power supply electrode 71 disposed adjacent to the heating element drawing electrode 18, and a second fusible conductor 72 spanned between the heating element drawing electrode 18 and the heating element power supply electrode 71. In the description of the short-circuiting element 70, the same members as those of the above-described short-circuiting element 1 will be denoted by the same reference numerals and will not be described in detail. Fig. 19(B) shows a circuit diagram of the short-circuiting member 70.

發熱體供電電極71與發熱體拉出電極18相鄰設置,且透過第2可熔導體72與發熱體拉出電極18連接,藉此構成對發熱體14之供電路徑3。又,絕緣層17與作為與外部電路之連接端子之外部連接端子71a連接。發熱體供電電極71能使用與發熱體拉出電極18相同材料而在發熱體拉出電極18之形成時同時形成。 The heating element power supply electrode 71 is disposed adjacent to the heating element drawing electrode 18, and is connected to the heating element drawing electrode 18 through the second fusible conductor 72, thereby constituting the power supply path 3 to the heating element 14. Further, the insulating layer 17 is connected to an external connection terminal 71a as a connection terminal to an external circuit. The heating element power supply electrode 71 can be formed simultaneously with the formation of the heating element drawing electrode 18 using the same material as the heating element drawing electrode 18.

第2可熔導體72,跨載於相鄰設置之發熱體拉出電極18及發熱體供電電極71間,在短路元件70之作動前構成對發熱體14之供電路 徑3之一部分。第2可熔導體72能使用與第1可熔導體13相同材料形成。又,第2可熔導體72亦如後說明般能藉由各種構成來形成。 The second fusible conductor 72 is spanned between the adjacent heat generating body pull-out electrode 18 and the heat generating body power supply electrode 71, and constitutes a circuit for the heat generating body 14 before the short-circuiting element 70 is actuated. One of the trails 3. The second meltable conductor 72 can be formed using the same material as the first meltable conductor 13. Further, the second fusible conductor 72 can also be formed by various configurations as will be described later.

如圖23所示,短路元件70藉由在供電路徑3設置第2可熔導體72,而在發熱體14發熱後第2可熔導體72即熔斷,熔融導體72a分開凝結於發熱體拉出電極18與發熱體供電電極71,藉此阻斷供電路徑3而自動停止發熱體14之發熱。此時,短路元件70形成為第2可熔導體72不比第1可熔導體13先熔斷。 As shown in FIG. 23, the short-circuiting element 70 is provided with the second fusible conductor 72 in the power supply path 3, and after the heat generating body 14 generates heat, the second fusible conductor 72 is melted, and the molten conductor 72a is separately condensed on the heating element pulling-out electrode. 18 and the heating element power supply electrode 71 thereby blocking the power supply path 3 and automatically stopping the heat generation of the heating element 14. At this time, the short-circuiting element 70 is formed such that the second meltable conductor 72 is not melted first than the first meltable conductor 13.

[熔斷順序] [fuse sequence]

亦即,短路元件70中,透過第1可熔導體72連接之發熱體供電電極71與發熱體拉出電極18,由於構成對發熱體14之供電路徑3,因此若在第1、第2電極11,12之短路前發熱體供電電極71與發熱體拉出電極18之間熔斷,則對發熱體14之供電停止,而有無法使第1、第2電極11,12間短路之虞。 In other words, in the short-circuiting element 70, the heat generating body power supply electrode 71 connected to the first meltable conductor 72 and the heat generating body pull-out electrode 18 constitute the power supply path 3 to the heat generating body 14, so that the first and second electrodes are provided. When the short-circuiting of the heating element supply electrode 71 and the heating element drawing electrode 18 is short-circuited before the short circuit of 11,12, the power supply to the heating element 14 is stopped, and the first and second electrodes 11 and 12 cannot be short-circuited.

因此,短路元件70形成為,在發熱體14發熱後,發熱體供電電極71與發熱體拉出電極18之間之阻斷前,第1、第2電極11,12間會先短路。具體而言,短路元件70中,第1可熔導體13配設於較第2可熔導體72更接近發熱體14之位置。藉此,短路元件70,在發熱體14發熱後,第1可熔導體13能較第2可熔導體72更快被傳遞熱。是以,在發熱體14發熱後,能迅速地使第1可熔導體13,熔融導體13a凝結於第1電極11周圍,且熔融導體13a能使第1、第2電極11,12間短路,其後第2可熔導體72熔融而對發熱體14之供電路徑3。是以,短路元件70中,至第1、第2電極11,12間短路為止可確實地對發熱體14持續供電。 Therefore, the short-circuiting element 70 is formed so that the first and second electrodes 11 and 12 are short-circuited before the heat generating body 14 generates heat and before the heat generating body power supply electrode 71 and the heat generating body pull-out electrode 18 are blocked. Specifically, in the short-circuiting element 70, the first meltable conductor 13 is disposed closer to the heat generating body 14 than the second meltable conductor 72. Thereby, after the short-circuiting element 70 generates heat, the first fusible conductor 13 can transmit heat faster than the second fusible conductor 72. Therefore, after the heat generating body 14 generates heat, the first soluble conductor 13 and the molten conductor 13a can be quickly condensed around the first electrode 11, and the molten conductor 13a can short-circuit the first and second electrodes 11 and 12. Thereafter, the second fusible conductor 72 is melted to supply the power supply path 3 to the heating element 14. Therefore, in the short-circuiting element 70, the heating element 14 can be surely supplied with power until the short-circuit between the first and second electrodes 11 and 12.

又,短路元件70藉由將發熱體供電電極71與第1電極11電性連接,而作成與短路元件1相同之電路構成,且藉由功能分離成使第1可熔導體13為第1、第2電極11,12間之短路用、使第2可熔導體72為發熱體14之阻斷用,而能在短路元件1之電路中使短路與阻斷之序列更為確實。 Further, the short-circuiting element 70 is electrically connected to the first electrode 11 by the heating element feeding electrode 71, and is formed in the same circuit configuration as the short-circuiting element 1, and is separated by function to make the first soluble conductor 13 the first. The short circuit between the second electrodes 11 and 12 causes the second meltable conductor 72 to block the heating element 14, and the sequence of the short circuit and the blocking can be made more reliable in the circuit of the short-circuit element 1.

又,第1、第2可熔導體13,72由於剖面積越狹窄則越快熔斷,因此亦可藉由將第1可熔導體13之剖面積形成為較第2可熔導體72之剖面積狹窄,以在發熱體供電電極71與發熱體拉出電極18間之阻斷前使第1、第2電極11,12間短路。 Further, since the first and second fusible conductors 13, 72 are melted more rapidly as the cross-sectional area is narrower, the cross-sectional area of the first fusible conductor 13 can be formed to be smaller than the cross-sectional area of the second fusible conductor 72. The stenosis is short-circuited between the first and second electrodes 11 and 12 before blocking between the heating element power supply electrode 71 and the heating element drawing electrode 18.

又,亦可藉由改變第1、第2可熔導體13,72之材料,相對地使第2可熔導體72之熔點較第1可熔導體13之熔點高,以在發熱體供電電極71與發熱體拉出電極18間之阻斷前使第1、第2電極11,12間短路。例如,在將第1、第2可熔導體13,72作成低熔點金屬與高熔點金屬之積層構造時,藉由在第1可熔導體13增高低熔點金屬之比率,在第2可熔導體72增高高熔點金屬之比率等,而能設置熔點差。 Further, by changing the materials of the first and second fusible conductors 13, 72, the melting point of the second fusible conductor 72 can be relatively higher than the melting point of the first fusible conductor 13, so that the heating element power supply electrode 71 can be used. The first and second electrodes 11, 12 are short-circuited before blocking between the heating element drawing electrodes 18. For example, when the first and second fusible conductors 13, 72 are formed in a laminated structure of a low melting point metal and a high melting point metal, the ratio of the low melting point metal is increased in the first soluble conductor 13 to the second fusible conductor. 72 increases the ratio of the high melting point metal, etc., and can set the melting point difference.

[輔助可熔導體] [Auxiliary Fusible Conductor]

又,短路元件70,亦可如圖24所示於第2電極12連接輔助可熔導體21,且發熱體14透過絕緣層17與第1、第2電極11,12連接。藉此,短路元件70,能藉由第1可熔導體13及輔助可熔導體21之各熔融導體13a,21a使遍佈凝結於第1、第2電極11,12間之熔融導體之量增大,而能確實地使之短路。 Further, as shown in FIG. 24, the short-circuiting element 70 may be connected to the second electrode 12 to the auxiliary fusible conductor 21, and the heating element 14 may be connected to the first and second electrodes 11, 12 through the insulating layer 17. Thereby, the short-circuiting element 70 can increase the amount of the molten conductor that is condensed between the first and second electrodes 11 and 12 by the respective melted conductors 13a and 21a of the first and second soluble conductors 13 and 21. And can be sure to short-circuit it.

此外,短路元件70亦同樣地,輔助可熔導體21較佳為從第 2電極12往第1電極11側突出設置,突出至與第1電極11分離同時重疊之位置。又,輔助可熔導體21藉由支撐成亦與第1可熔導體13重疊,輔助可熔導體21之熔融導體21a與第1可熔導體13之熔融導體13a較易凝結,而能有助於第1、第2電極11,12間之短路。 In addition, the short-circuiting element 70 is similarly, and the auxiliary fusible conductor 21 is preferably from the first The 2 electrode 12 is protruded toward the first electrode 11 side, and protrudes to a position overlapping with the first electrode 11 and overlapping. Further, the auxiliary fusible conductor 21 is supported to also overlap with the first fusible conductor 13, and the molten conductor 21a of the auxiliary fusible conductor 21 and the molten conductor 13a of the first fusible conductor 13 are more likely to be condensed, which can contribute to Short circuit between the first and second electrodes 11,12.

又,上述短路元件50,70中,亦可將發熱體拉出電極18設於第1電極11之與第2電極12相反側,亦可將發熱體拉出電極18設於第2電極12之與第1電極11相反側。又,不論任一情形,均將第1可熔導體13懸臂支撐於第1電極11,往第2電極12側突出,較佳為重疊。進而,不論任一情形,第1可熔導體13均亦可延伸超過第2電極12上。又,不論任一情形,均亦可設置支撐第1可熔導體13端部之支撐電極。 Further, in the short-circuiting elements 50 and 70, the heating element drawing electrode 18 may be provided on the opposite side of the first electrode 11 from the second electrode 12, or the heating element drawing electrode 18 may be provided in the second electrode 12. The side opposite to the first electrode 11. Further, in either case, the first meltable conductor 13 is cantilevered on the first electrode 11 and protrudes toward the second electrode 12 side, and preferably overlaps. Further, the first fusible conductor 13 may extend beyond the second electrode 12 in either case. Further, in either case, a support electrode that supports the end of the first fusible conductor 13 may be provided.

[短路元件80] [Short Circuit Element 80]

又,適用本發明之短路元件,亦可形成為表面構裝用,且擴展第1、第2電極11,12對第1可熔導體13之支撐面積,防止第1可熔導體13之變形且防止初期短路。 Further, the short-circuiting element to which the present invention is applied may be formed for surface mounting, and the supporting area of the first and second electrodes 11, 12 to the first soluble conductor 13 may be expanded to prevent deformation of the first soluble conductor 13 and Prevent initial short circuit.

此短路元件80,如圖25、圖26所示,具備:絕緣基板10,設有發熱體14;第1絕緣層81,被覆發熱體14且積層有第1、第2電極11,12;第2絕緣層82,於第1、第2電極11,12上,以使第1、第2電極11,12所對向之各前端部露出之方式積層;以及發熱體拉出電極18,與第1、第2電極11,12相鄰,與發熱體14電氣連接。此外,圖26係除去短路元件80之第1可熔導體13後顯示之俯視圖。又,在短路元件80中,對與上述之短路元件1相同之構件,賦予相同符號省略其詳細說明。 As shown in FIGS. 25 and 26, the short-circuiting element 80 includes an insulating substrate 10 and a heating element 14; a first insulating layer 81 covering the heating element 14 and having the first and second electrodes 11 and 12 laminated thereon; The insulating layer 82 is laminated on the first and second electrodes 11 and 12 such that the front end portions of the first and second electrodes 11 and 12 face each other; and the heating element pulls out the electrode 18 and 1. The second electrodes 11, 12 are adjacent to each other and electrically connected to the heating element 14. In addition, FIG. 26 is a plan view showing the first fusible conductor 13 of the short-circuiting element 80 removed. In the short-circuiting element 80, the same members as those of the above-described short-circuiting element 1 will be denoted by the same reference numerals and will not be described in detail.

短路元件80,於絕緣基板10之表面10a形成有發熱體14、 發熱體拉出電極18、發熱體電極19,經由第1絕緣層81於發熱體14上積層有第1、第2電極11,12。第1絕緣層81係謀求發熱體14之保護及絕緣,且係用以將發熱體14之熱以良好效率往第1、第2電極11,12傳遞而設置,由例如玻璃層構成。於第1絕緣層81上,以與發熱體14重疊之方式相鄰形成有第1、第2電極11,12,從發熱體14分離而形成有發熱體拉出電極18。藉由發熱體14加熱第1、第2電極11,12,可使第1可熔導體13之熔融導體13a容易地凝結。發熱體拉出電極18具有形成於絕緣基板10之表面10a且與發熱體14連接之下層部18a、以及連接於下層部18a且積層於第1絕緣層81上而與第1可熔導體13連接之上層部18b。 The short-circuiting element 80 is formed with a heating element 14 on the surface 10a of the insulating substrate 10, The heating element pulls out the electrode 18 and the heating element electrode 19, and the first and second electrodes 11 and 12 are laminated on the heating element 14 via the first insulating layer 81. The first insulating layer 81 is provided to protect and insulate the heating element 14 and is provided to transfer the heat of the heating element 14 to the first and second electrodes 11 and 12 with good efficiency, and is formed of, for example, a glass layer. The first and second electrodes 11 and 12 are formed adjacent to the heating element 14 so as to overlap the heating element 14 , and the heating element drawing electrode 18 is formed by being separated from the heating element 14 . When the first and second electrodes 11 and 12 are heated by the heating element 14, the molten conductor 13a of the first soluble conductor 13 can be easily condensed. The heating element drawing electrode 18 has a layer portion 18a formed on the surface 10a of the insulating substrate 10 and connected to the heating element 14, and is connected to the lower layer portion 18a and laminated on the first insulating layer 81 to be connected to the first soluble conductor 13. The upper layer portion 18b.

在短路元件80之第1、第2電極11,12,係廣泛地形成於形成為矩形之絕緣基板10之長度方向,從絕緣基板10之寬度方向兩側緣形成至中央部,相隔既定間隔對向。又,第1、第2電極11,12除了對向之各前端部以外積層有第2絕緣層82。藉此,第1、第2電極11,12之對向之各前端部露出。 The first and second electrodes 11 and 12 of the short-circuiting element 80 are widely formed in the longitudinal direction of the rectangular insulating substrate 10, and are formed from both side edges in the width direction of the insulating substrate 10 to the central portion, with a predetermined interval therebetween. to. Further, the first and second electrodes 11, 12 are laminated with the second insulating layer 82 except for the respective distal end portions. Thereby, the front end portions of the first and second electrodes 11 and 12 facing each other are exposed.

短路元件80中,第1、第2電極11,12之短路長度形成為較長,藉此提升短路之確實性且降低第1、第2電極11,12之短路後之短路阻抗而能對應高額定電流。 In the short-circuiting element 80, the short-circuit lengths of the first and second electrodes 11 and 12 are formed to be long, thereby improving the reliability of the short-circuit and reducing the short-circuit impedance after the short-circuiting of the first and second electrodes 11 and 12, thereby being able to correspond to a high amount. Constant current.

第1可熔導體13,一端透過接合用焊料等接合材15連接於發熱體拉出電極18,另一端透過接合用焊料等接合材15連接於第1絕緣層81上所形成之支撐電極83。又,第1可熔導體13係支撐於設於第1、第2電極11,12之第2絕緣層82上,且藉由接合用焊料等接合材15電氣連接於第1電極11。亦即,由於短路元件80係於第1絕緣層81上廣泛地積層第1、 第2電極11,12,且除了此等第1、第2電極11,12之各前端部以外積層有第2絕緣層82,因此能藉由第2絕緣層82從第1可熔導體13中央部至側緣部廣泛地支撐。 One end of the first fusible conductor 13 is connected to the heating element drawing electrode 18 through a bonding material 15 such as solder for bonding, and the other end is connected to the supporting electrode 83 formed on the first insulating layer 81 through a bonding material 15 such as solder for bonding. Further, the first fusible conductor 13 is supported by the second insulating layer 82 provided on the first and second electrodes 11 and 12, and is electrically connected to the first electrode 11 by a bonding material 15 such as solder for bonding. That is, since the short-circuiting element 80 is widely laminated on the first insulating layer 81, Since the second insulating layers 82 are laminated on the second electrodes 11 and 12 except for the respective end portions of the first and second electrodes 11 and 12, the second insulating layer 82 can be provided from the center of the first soluble conductor 13 The part to the side edge is widely supported.

是以,根據短路元件80,能在回焊構裝時等防止第1可熔導體13彎曲,防止因第1可熔導體13之變形使第1、第2電極11,12間短路之初期短路。 According to the short-circuiting element 80, it is possible to prevent the first fusible conductor 13 from being bent during the reflow mounting or the like, and to prevent the initial short-circuit between the first and second electrodes 11 and 12 due to the deformation of the first soluble conductor 13. .

短路元件80中,對發熱體14通電,在開始發熱後,如圖27所示,發熱體14之熱經由第1絕緣層81、第1、第2電極11,12、及第2絕緣層82傳至第1可熔導體13,而開始熔融。此時,短路元件80,藉由在第1絕緣層81上廣泛地積層第1、第2電極11,12,而與發熱體14重疊。又,由於在第1、第2電極11,12上廣泛地積層第2絕緣層82,透過此第2絕緣層82支撐第1可熔導體13,因此能將發熱體14之熱以良好效率傳達至第1可熔導體13,在發熱後,能迅速地在第1、第2電極11,12上使第1可熔導體13熔融,而能使第1、第2電極11,12短路。 In the short-circuiting element 80, the heating element 14 is energized, and after the heat generation starts, as shown in FIG. 27, the heat of the heating element 14 passes through the first insulating layer 81, the first and second electrodes 11, 12, and the second insulating layer 82. It is transferred to the first fusible conductor 13 and starts to melt. At this time, the short-circuiting element 80 is superposed on the first insulating layer 81 by laminating the first and second electrodes 11 and 12 to overlap the heating element 14. Further, since the second insulating layer 82 is widely laminated on the first and second electrodes 11 and 12, and the first soluble conductor 13 is supported by the second insulating layer 82, the heat of the heating element 14 can be transmitted with good efficiency. When the first meltable conductor 13 is heated, the first meltable conductor 13 can be quickly melted on the first and second electrodes 11 and 12, and the first and second electrodes 11 and 12 can be short-circuited.

又,短路元件80係使第1、第2電極11,12與發熱體14重疊,且將發熱體拉出電極18配設於與發熱體14分離之位置,藉此能防止在第1、第2電極11,12之短路前發熱體拉出電極18與第1電極11熔斷而停止對發熱體14之供電的事態。 Further, in the short-circuiting element 80, the first and second electrodes 11 and 12 are overlapped with the heat generating body 14, and the heat generating body pull-out electrode 18 is disposed at a position separated from the heat generating body 14, thereby preventing the first and the first Before the short-circuiting of the two electrodes 11, 12, the heating element pull-out electrode 18 and the first electrode 11 are blown to stop the supply of power to the heating element 14.

短路元件80,在第1、第2電極11,12短路後,如圖28所示,發熱體拉出電極18與第1電極11熔斷,而阻斷對發熱體14之供電路徑3。 After the short-circuiting element 80 is short-circuited by the first and second electrodes 11 and 12, as shown in FIG. 28, the heating element drawing electrode 18 and the first electrode 11 are blown, and the power supply path 3 to the heating element 14 is blocked.

[全周支撐] [Full week support]

又,短路元件80亦可亦將第2絕緣層82從第1、第2電極11,12上積層於第1、第2電極11,12間,以確實地防止第1可熔導體13之中央部之彎曲。例如如圖29所示,第2絕緣層82具有開口,將第2絕緣層82積層於第1、第2電極11,12之各長度方向,且在長度方向兩端部形成於寬度方向,據以亦積層於第1、第2電極11,12間,藉此使第1、第2電極之相對向之各端部露出。第1可熔導體13搭載成覆蓋第2絕緣層82之開口。是以,第1可熔導體13能在全周被支撐而防止長度方向及寬度方向之彎曲。 Further, the short-circuiting element 80 may also laminate the second insulating layer 82 from the first and second electrodes 11 and 12 between the first and second electrodes 11 and 12 to reliably prevent the center of the first soluble conductor 13 The bending of the department. For example, as shown in FIG. 29, the second insulating layer 82 has an opening, and the second insulating layer 82 is laminated in each longitudinal direction of the first and second electrodes 11, 12, and both ends in the longitudinal direction are formed in the width direction. The first and second electrodes are also laminated between the first and second electrodes 11, 12 so that the opposite ends of the first and second electrodes are exposed. The first soluble conductor 13 is mounted to cover the opening of the second insulating layer 82. Therefore, the first fusible conductor 13 can be supported over the entire circumference to prevent bending in the longitudinal direction and the width direction.

因此,根據圖29所示之短路元件80,能在回焊構裝時等確實地防止第1可熔導體13彎曲,防止因第1可熔導體13之變形使第1、第2電極11,12間短路之初期短路。 Therefore, according to the short-circuiting element 80 shown in FIG. 29, it is possible to reliably prevent the first soluble conductor 13 from being bent during the reflow assembly or the like, and to prevent the first and second electrodes 11 from being deformed by the deformation of the first soluble conductor 13. Short circuit in the initial period of 12 short circuits.

[短路元件90] [Short Circuit Element 90]

又,適用本發明之短路元件,亦可形成為表面構裝用,且將第2電極12設於覆蓋構件。 Further, the short-circuiting element to which the present invention is applied may be formed for surface mounting, and the second electrode 12 may be provided on the covering member.

此短路元件90,如圖30所示,具備覆蓋絕緣基板10之表面上之覆蓋構件25,第2電極12係於覆蓋構件25之頂面部25b形成為與第1電極11對向。此外,在短路元件90中,對與上述之短路元件1相同之構件,賦予相同符號省略其詳細說明。 As shown in FIG. 30, the short-circuiting element 90 includes a covering member 25 that covers the surface of the insulating substrate 10. The second electrode 12 is formed on the top surface portion 25b of the covering member 25 so as to face the first electrode 11. In the short-circuiting element 90, the same members as those of the above-described short-circuiting element 1 will be denoted by the same reference numerals and will not be described in detail.

覆蓋構件25具有連接於絕緣基板10之表面10a之外緣部之側壁部25a與頂面部25b,能使用各種工程塑膠或與絕緣基板10相同之材料形成。覆蓋構件25係從覆蓋構件25之一側壁部25a至頂面部25b形成有第2電極12。 The cover member 25 has a side wall portion 25a and a top surface portion 25b which are connected to the outer edge portion of the surface 10a of the insulating substrate 10, and can be formed using various engineering plastics or the same material as the insulating substrate 10. The cover member 25 is formed with the second electrode 12 from one of the side wall portions 25a to the top surface portion 25b of the cover member 25.

短路元件90之第2電極12中,藉由覆蓋構件25搭載於絕 緣基板10,而與形成於絕緣基板10之表面10a之外部連接電極26連接。外部連接電極26,係與形成於絕緣基板10之背面10b之外部連接端子26a連接。短路元件90透過此外部連接端子26a組裝於電源電路等各種外部電路。 The second electrode 12 of the short-circuiting element 90 is mounted on the second electrode 12 by the covering member 25 The edge substrate 10 is connected to the external connection electrode 26 formed on the surface 10a of the insulating substrate 10. The external connection electrode 26 is connected to the external connection terminal 26a formed on the back surface 10b of the insulating substrate 10. The short-circuiting element 90 is assembled to various external circuits such as a power supply circuit through the external connection terminal 26a.

又,第2電極12與積層於絕緣層17上之第1電極11對向,且於與第1電極11之間配設有第1可熔導體13。 Further, the second electrode 12 faces the first electrode 11 laminated on the insulating layer 17, and the first soluble conductor 13 is disposed between the first electrode 11.

此種短路元件90,在發熱體14發熱後,如圖31所示,熱經由絕緣層17及第1電極11傳至第1可熔導體13而熔融。熔融導體13a凝結於第1電極11上,且亦凝結於在頂面部25b與第1電極11對向配置之第2電極12上。藉此,短路元件90能透過熔融導體13a使第1、第2電極11,12短路。短路元件90,在第1、第2電極11,12短路後,發熱體拉出電極18與第1電極11即熔斷,而阻斷對發熱體14之供電路徑3。 In the short-circuiting element 90, after the heat generating element 14 generates heat, as shown in FIG. 31, heat is transferred to the first meltable conductor 13 via the insulating layer 17 and the first electrode 11, and is melted. The molten conductor 13a is condensed on the first electrode 11, and is also condensed on the second electrode 12 disposed opposite to the first electrode 11 on the top surface portion 25b. Thereby, the short-circuiting element 90 can short-circuit the first and second electrodes 11, 12 through the molten conductor 13a. When the short-circuiting element 90 is short-circuited by the first and second electrodes 11 and 12, the heating element pulling-out electrode 18 and the first electrode 11 are melted, and the power supply path 3 to the heating element 14 is blocked.

[其他構成] [Other composition]

此外,上述之各短路元件1,40,50,70,80,90中,形成為板狀之第1可熔導體13較佳為具有與第1電極11之連接面積之2倍以上之面積。藉此,第1可熔導體13可確保使第1、第2電極11,12間短路之充分之熔融導體之量,且在端部被支撐於發熱體拉出電極18或支撐電極22之情形,亦能迅速地加以熔斷。 Further, in each of the short-circuiting elements 1, 40, 50, 70, 80, and 90 described above, the first fusible conductor 13 formed in a plate shape preferably has an area twice or more the area of connection with the first electrode 11. Thereby, the first soluble conductor 13 can secure the amount of the sufficient molten conductor that short-circuits the first and second electrodes 11 and 12, and is supported at the end portion of the heat generating body pulling electrode 18 or the supporting electrode 22 It can also be quickly blown.

又,上述之各短路元件1,40,50,70,80,90中,亦可藉由將第1可熔導體13以線材形成,此情形下,第1可熔導體13較佳為具有與第1電極11之連接長度之2倍以上之長度。藉此,第1可熔導體13可確保使第1、第2電極11,12間短路之充分之熔融導體之量,且在端部被支撐於發 熱體拉出電極18或支撐電極22之情形,亦能迅速地加以熔斷。 Further, in each of the short-circuiting elements 1, 40, 50, 70, 80, 90 described above, the first fusible conductor 13 may be formed of a wire. In this case, the first fusible conductor 13 preferably has a The length of the connection length of the first electrode 11 is twice or more. Thereby, the first fusible conductor 13 can secure a sufficient amount of the molten conductor that short-circuits the first and second electrodes 11 and 12, and is supported at the end. When the hot body pulls out the electrode 18 or the support electrode 22, it can be quickly melted.

再者,上述之各短路元件1,40,50,70,80,90中,第1、第2電極11,12之間隔,較佳為在第1、第2電極間隔之延長線上之第1電極11之寬度以下。例如,如圖1所示,短路元件1中,第1、第2電極11,12之間隔W1,較佳為在第1、第2電極間隔之延長線上之第1電極11之寬度W2以下。藉此,第1、第2電極11,12配置於更接近之位置,而能更確實地,在第1可熔導體13之熔融導體13a凝結於第1電極11周圍時亦接觸於第2電極12,能使熔融導體13a遍佈凝結於第1、第2電極11,12間。 Further, in each of the short-circuiting elements 1, 40, 50, 70, 80, and 90, the interval between the first and second electrodes 11, 12 is preferably the first line on the extension line between the first and second electrodes. The width of the electrode 11 is below. For example, as shown in Fig. 1, in the short-circuiting element 1, the interval W 1 between the first and second electrodes 11 and 12 is preferably the width W 2 of the first electrode 11 on the extension line of the first and second electrode intervals. the following. Thereby, the first and second electrodes 11 and 12 are disposed closer to each other, and the second electrode can be more reliably contacted when the molten conductor 13a of the first soluble conductor 13 is condensed around the first electrode 11 12, the molten conductor 13a can be condensed between the first and second electrodes 11, 12.

[塗布處理] [Coating treatment]

又,上述之各短路元件1,40,50,70,80,90之第1、第2電極11,12、發熱體拉出電極18、支撐電極22及發熱體供電電極71,可使用Cu或Ag等之一般電極材料形成,較佳為,在表面上藉由鍍敷處理等公知手法塗布有Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷等之被膜。藉此,短路元件1,40,50,70,80,90,可防止支撐電極22及發熱體供電電極71之氧化,確實地保持第1、第2可熔導體13,72熔融導體。又,將短路元件1,40,50,70,80,90回焊構裝之情形,藉由使連接第1、第2可熔導體13,72之連接用焊料等接合材15或形成第1、第2可熔導體13,72之外層之低熔點金屬熔融,可防止熔蝕(焊料沖蝕)第1、第2電極11,12、發熱體拉出電極18、支撐電極22及發熱體供電電極71。 Further, the first and second electrodes 11, 12 of the short-circuiting elements 1, 40, 50, 70, 80, 90, the heating element drawing electrode 18, the supporting electrode 22, and the heating element power supply electrode 71 may be made of Cu or For forming a general electrode material such as Ag, it is preferable to apply a film such as Ni/Au plating, Ni/Pd plating, or Ni/Pd/Au plating to a surface by a known method such as plating treatment. Thereby, the short-circuiting elements 1, 40, 50, 70, 80, 90 can prevent oxidation of the support electrode 22 and the heating element supply electrode 71, and reliably hold the first and second meltable conductors 13, 72 to fuse the conductor. Further, in the case where the short-circuiting elements 1, 40, 50, 70, 80, 90 are reflow-fitted, the first and second fusible conductors 13, 72 are connected to each other by a bonding material such as solder or the like. The low-melting-point metal of the outer layer of the second fusible conductors 13, 72 is melted, and the first and second electrodes 11, 12, the heating element drawing electrode 18, the supporting electrode 22, and the heating body are prevented from being welded (solder erosion). Electrode 71.

[發熱體之位置] [Location of the heating element]

又,表面構裝型之短路元件1,40,80,90,除了於絕緣基板10之表面10a形成發熱體14以外,亦可如圖32(A)、圖33(A)、圖34(A)、圖35(A)所示, 設於絕緣基板10之背面10b。此情形下,發熱體14在絕緣基板10之背面10b被絕緣層17被覆。又,構成對發熱體14之供電路徑3之發熱體電極19亦同樣地形成於絕緣基板10之背面10b。發熱體拉出電極18中,與發熱體14連接之下層部18a形成於絕緣基板10之背面10b,搭載第1可熔導體13之上層部18b形成於絕緣基板10之表面10a,下層部18a與上層部18b透過導電通孔而連續。 Further, the surface-mounting type short-circuiting elements 1, 40, 80, 90 may be formed as the heating element 14 on the surface 10a of the insulating substrate 10, as shown in Fig. 32(A), Fig. 33(A), and Fig. 34(A). ), as shown in Figure 35 (A), It is provided on the back surface 10b of the insulating substrate 10. In this case, the heating element 14 is covered by the insulating layer 17 on the back surface 10b of the insulating substrate 10. Further, the heat generating body electrode 19 constituting the power supply path 3 of the heat generating body 14 is similarly formed on the back surface 10b of the insulating substrate 10. In the heating element drawing electrode 18, the layer portion 18a is formed on the back surface 10b of the insulating substrate 10, and the upper portion 18b of the first soluble conductor 13 is formed on the surface 10a of the insulating substrate 10, and the lower layer portion 18a is formed. The upper portion 18b is continuous through the conductive via.

又,發熱體14較佳為在絕緣基板10之背面10b中形成於與第1、第2電極11,12重疊之位置。又,發熱體拉出電極18較佳為設在較第1、第2電極11,12更與發熱體14分離之位置。 Further, the heating element 14 is preferably formed at a position overlapping the first and second electrodes 11 and 12 on the back surface 10b of the insulating substrate 10. Further, it is preferable that the heating element drawing electrode 18 is provided at a position separated from the heating element 14 by the first and second electrodes 11 and 12.

又,亦可如圖32(B)、圖33(B)、圖34(B)、圖35(B)所示,短路元件1,40,80,90中,將發熱體14形成於絕緣基板10內部。此情形下,無需設置被覆發熱體14之絕緣層17。又,連接有發熱體14一端之發熱體電極19中,與發熱體14連接之一端部形成至絕緣基板10內部,透過導電通孔與設在絕緣基板10之背面10b之外部連接端子19a連接。發熱體拉出電極18中,與發熱體14連接之下層部18a形成至絕緣基板10內部,與搭載第1可熔導體13之上層部18b透過導電通孔而連續。 Further, as shown in FIGS. 32(B), 33(B), 34(B), and 35(B), in the short-circuiting elements 1, 40, 80, and 90, the heat generating body 14 may be formed on the insulating substrate. 10 internal. In this case, it is not necessary to provide the insulating layer 17 covering the heating element 14. Further, in the heat generating body electrode 19 to which one end of the heat generating body 14 is connected, one end portion connected to the heat generating body 14 is formed inside the insulating substrate 10, and is connected to the external connection terminal 19a provided on the back surface 10b of the insulating substrate 10 through the conductive via hole. In the heating element drawing electrode 18, the layer portion 18a is formed in the insulating substrate 10 under the connection with the heating element 14, and the layer portion 18b on which the first fusible conductor 13 is mounted passes through the conductive via hole and is continuous.

又,發熱體14較佳為在絕緣基板10之內部中形成於與第1、第2電極11,12重疊之位置。又,發熱體拉出電極18較佳為設在較第1、第2電極11,12更與發熱體17分離之位置。 Further, the heating element 14 is preferably formed at a position overlapping the first and second electrodes 11 and 12 in the inside of the insulating substrate 10. Further, it is preferable that the heating element drawing electrode 18 is provided at a position separated from the heating element 17 by the first and second electrodes 11 and 12.

短路元件1,40,80,90中,藉由發熱體14形成於絕緣基板10之背面10b或絕緣基板10之內部,而可使絕緣基板10之表面10a平坦化,藉此,能將第1、第2電極11,12及發熱體拉出電極18形成於表面10a上。 是以,短路元件1,40,80,90,能簡化第1、第2電極11,12及發熱體拉出電極18之製程,且謀求低高度。 In the short-circuiting elements 1, 40, 80, 90, the heat generating body 14 is formed on the back surface 10b of the insulating substrate 10 or the inside of the insulating substrate 10, whereby the surface 10a of the insulating substrate 10 can be planarized, whereby the first surface can be made The second electrodes 11, 12 and the heating element pull-out electrode 18 are formed on the surface 10a. Therefore, the short-circuiting elements 1, 40, 80, and 90 can simplify the processes of the first and second electrodes 11, 12 and the heating element drawing electrode 18, and achieve a low height.

又,短路元件1,40,80,90,在將發熱體14形成於絕緣基板10之背面10b或絕緣基板10之內部的情形下,亦能藉由使用精密陶瓷等熱傳導性優異之材料作為絕緣基板10之材料,而能藉由發熱體14與積層於絕緣基板10之表面10a上之情形同等地將第1可熔導體13加熱、熔斷。 Further, in the case where the short-circuiting elements 1, 40, 80, and 90 are formed on the back surface 10b of the insulating substrate 10 or the inside of the insulating substrate 10, it is also possible to use a material having excellent thermal conductivity such as precision ceramics as insulation. The material of the substrate 10 can be heated and melted by the heat-generating body 14 in the same manner as the laminated body 10a on the surface 10a of the insulating substrate 10.

[可熔導體之構成] [Composition of fusible conductor]

如上所述,第1、第2可熔導體13,72及輔助可熔導體21亦可含有低熔點金屬與高熔點金屬。此外,以下說明中,除了必須特別區分之情形除外,係將第1、第2可熔導體13,72及輔助可熔導體21總稱為「可熔導體13,72,21」。作為低熔點金屬,較佳為使用以Sn為主成分之無鉛焊料等焊料,作為高熔點金屬,較佳為使用Ag、Cu或以此等為主成分之合金等。此時,可熔導體13,72,21如圖36(A)所示,可使用設有高熔點金屬層91作為內層、設有低熔點金屬層92作為外層之可熔導體。此情形下,可熔導體13,72,21亦可作成高熔點金屬層91之全面被低熔點金屬層92覆蓋之構造,亦可係除了相對向之一對側面外均被覆蓋的構造。高熔點金屬層91及低熔點金屬層92之被覆構造,可使用鍍敷等公知之成膜技術來形成。 As described above, the first and second fusible conductors 13, 72 and the auxiliary soluble conductor 21 may also contain a low melting point metal and a high melting point metal. In addition, in the following description, the first and second fusible conductors 13, 72 and the auxiliary fusible conductor 21 are collectively referred to as "fusible conductors 13, 72, 21" except for the case where special distinction is necessary. As the low-melting-point metal, a solder such as a lead-free solder containing Sn as a main component is preferably used, and as the high-melting-point metal, Ag, Cu, or an alloy containing the same as a main component is preferably used. At this time, as shown in Fig. 36(A), the fusible conductors 13, 72, 21 can be made of a fusible conductor having a high melting point metal layer 91 as an inner layer and a low melting point metal layer 92 as an outer layer. In this case, the fusible conductors 13, 72, 21 may be formed such that the high-melting-point metal layer 91 is entirely covered by the low-melting-point metal layer 92, or may be covered except that one of the opposite sides is covered. The coating structure of the high melting point metal layer 91 and the low melting point metal layer 92 can be formed by a known film forming technique such as plating.

又,如圖36(B)所示,可熔導體13,72,21亦使用作為內層設有低熔點金屬層92、作為外層設有高熔點金屬層91之可熔導體。此情形下,可熔導體13,72,21亦可作成低熔點金屬層92之全面被高熔點金屬層91覆蓋之構造,亦可係除了相對向之一對側面外均被覆蓋的構造。 Further, as shown in Fig. 36(B), the fusible conductors 13, 72, 21 also use a fusible conductor having a low-melting-point metal layer 92 as an inner layer and a high-melting-point metal layer 91 as an outer layer. In this case, the fusible conductors 13, 72, 21 may be formed such that the low-melting-point metal layer 92 is entirely covered by the high-melting-point metal layer 91, or may be covered except that one of the opposite sides is covered.

又,可熔導體13,72,21亦可如圖37所示,作成積層有高熔 點金屬層91與低熔點金屬層92之積層構造。 Moreover, the fusible conductors 13, 72, 21 can also be formed as a laminate with high melting as shown in FIG. A layered structure of the point metal layer 91 and the low melting point metal layer 92.

此情形下,如圖37(A)所示,可熔導體13,72,21形成為由搭載於第1、第2電極11,12或發熱體拉出電極18、支撐電極22等之下層與積層於下層之上之上層構成的雙層構造,可於作為下層之高熔點金屬層91之上面積層作為上層之低熔點金屬層92,相反地亦可於作為下層之低熔點金屬層92之上面積層作為上層之高熔點金屬層91。或者,可熔導體13,72,21亦可如圖37(B)所示,形成為由內層與積層於內層之上下面之外層構成的三層構造,可於作為內層之高熔點金屬層91之上下面積層作為外層之低熔點金屬層92,相反地亦可於作為內層之低熔點金屬層92之上下面積層作為外層之高熔點金屬層91。 In this case, as shown in FIG. 37(A), the fusible conductors 13, 72, 21 are formed by being mounted on the first and second electrodes 11, 12, or the heating element drawing electrode 18, the supporting electrode 22, and the like. The two-layer structure formed by the upper layer on the lower layer may be used as the upper layer of the low-melting-point metal layer 92 as the lower layer of the high-melting-point metal layer 91 as the lower layer, or vice versa. The layer is laminated as the upper layer of the high melting point metal layer 91. Alternatively, the fusible conductors 13, 72, 21 may be formed as a three-layer structure composed of an inner layer and an outer layer laminated on the upper and lower layers of the inner layer as shown in Fig. 37(B), and may be used as a high melting point of the inner layer. The lower surface layer of the metal layer 91 serves as the outer layer of the low melting point metal layer 92, and conversely, the lower layer of the low melting point metal layer 92 as the inner layer as the outer layer of the high melting point metal layer 91.

又,可熔導體13,72,21亦可如圖38所示,亦可為交互積層高熔點金屬層91與低熔點金屬層92之四層以上的多層構造。此情形下,可熔導體13,72,21亦可為被構成最外層之金屬層覆蓋全面或除了相對向之一對側面外均被覆蓋的構造。 Further, as shown in FIG. 38, the fusible conductors 13, 72, 21 may have a multilayer structure in which four or more layers of the high-melting-point metal layer 91 and the low-melting-point metal layer 92 are alternately laminated. In this case, the fusible conductors 13, 72, 21 may also be constructed to be covered by a metal layer constituting the outermost layer or covered except for a pair of opposite sides.

又,可熔導體13,72,21亦可於構成內層之低熔點金屬層92之表面將高熔點金屬層91成條狀地局部積層。圖39係可熔導體13,72,21之俯視圖。 Further, the fusible conductors 13, 72, 21 may also partially deposit the high-melting-point metal layer 91 in a strip shape on the surface of the low-melting-point metal layer 92 constituting the inner layer. Figure 39 is a plan view of the fusible conductors 13, 72, 21.

圖39(A)所示之可熔導體13,72,21,係於低熔點金屬層92之表面於寬度方向相隔既定間隔在長度方向形成有複數條線狀之高熔點金屬層91,藉此沿著長度方向形成線狀之開口部93,低熔點金屬層92從此開口部93露出。可熔導體13,72,21,藉由低熔點金屬層92從開口部93露出,熔融後之低熔點金屬與高熔點金屬之接觸面積增加,能更加促進高熔點金 屬層91之侵蝕作用而提升熔斷性。開口部93能藉由例如對低熔點金屬層92施以構成高熔點金屬層91之金屬之部分鍍敷來加以形成。 The fusible conductors 13, 72, 21 shown in FIG. 39(A) are formed by forming a plurality of linear high-melting-point metal layers 91 in the longitudinal direction at a predetermined interval in the width direction on the surface of the low-melting-point metal layer 92. A linear opening 93 is formed along the longitudinal direction, and the low-melting-point metal layer 92 is exposed from the opening 93. The fusible conductors 13, 72, 21 are exposed from the opening portion 93 by the low-melting-point metal layer 92, and the contact area between the molten low-melting metal and the high-melting-point metal is increased, and the high melting point gold can be further promoted. The erosion of the genus layer 91 enhances the fusibility. The opening portion 93 can be formed by, for example, plating a portion of the metal forming the high melting point metal layer 91 on the low melting point metal layer 92.

又,圖39(B)所示,可熔導體13,72,21,亦可係於低熔點金屬層92之表面於長度方向相隔既定間隔在寬度方向形成複數條線狀之高熔點金屬層91,藉此沿著寬度方向形成線狀之開口部93。 Further, as shown in Fig. 39 (B), the fusible conductors 13, 72, 21 may be formed on the surface of the low-melting-point metal layer 92 by forming a plurality of linear high-melting-point metal layers 91 in the width direction at predetermined intervals in the longitudinal direction. Thereby, the linear opening portion 93 is formed along the width direction.

又,可熔導體13,72,21亦可如圖40所示,於低熔點金屬層92之表面形成高熔點金屬層91且於高熔點金屬層91全面形成圓形之開口部94,從此開口部94使低熔點金屬層92露出。開口部94能藉由例如對低熔點金屬層92施以構成高熔點金屬層91之金屬之局部鍍敷來加以形成。 Further, as shown in FIG. 40, the fusible conductors 13, 72, 21 may form a high-melting-point metal layer 91 on the surface of the low-melting-point metal layer 92 and form a circular opening 94 in the high-melting-point metal layer 91. The portion 94 exposes the low melting point metal layer 92. The opening portion 94 can be formed by, for example, applying a partial plating of a metal constituting the high melting point metal layer 91 to the low melting point metal layer 92.

可熔導體13,72,21,藉由低熔點金屬層92從開口部94露出,熔融後之低熔點金屬與高熔點金屬之接觸面積增加,能更加促進高熔點金屬之侵蝕作用而提升熔斷性。 The fusible conductors 13, 72, 21 are exposed from the opening portion 94 by the low-melting-point metal layer 92, and the contact area between the molten low-melting metal and the high-melting-point metal is increased, which further promotes the erosion of the high-melting-point metal and enhances the fusibility. .

又,可熔導體13,72,21亦可如圖41所示,於作為內層之高熔點金屬層91形成多數個開口部95,於此高熔點金屬層91使用鍍敷技術等成膜出低熔點金屬層92,並充填於開口部95內。藉此,可熔導體13,72,21中,由於熔融之低熔點金屬接觸於高熔點金屬之面積增大,因此能在更短時間內由低熔點金屬將高熔點金屬溶蝕。 Further, as shown in FIG. 41, the fusible conductors 13, 72, 21 may form a plurality of openings 95 in the high-melting-point metal layer 91 as an inner layer, and the high-melting-point metal layer 91 may be formed by plating or the like. The low melting point metal layer 92 is filled in the opening portion 95. Thereby, in the fusible conductors 13, 72, 21, since the area of the molten low melting point metal contacting the high melting point metal is increased, the high melting point metal can be eroded by the low melting point metal in a shorter time.

又,可熔導體13,72,21較佳為使低熔點金屬層92之體積形成為較高熔點金屬層91之體積大。可熔導體13,72,21,係藉由發熱體14之發熱而被加熱,藉由低熔點金屬熔融而溶蝕高熔點金屬,藉此能迅速地熔融、熔斷。是以,可熔導體13,72,21,藉由使低熔點金屬層92之體積形成為較高熔點金屬層91之體積大,而能促進此溶蝕作用,迅速地使第1、 第2電極11,12間短路。 Further, the fusible conductors 13, 72, 21 preferably have a volume of the low-melting-point metal layer 92 formed to be bulky of the higher-melting-point metal layer 91. The fusible conductors 13, 72, 21 are heated by the heat generation of the heating element 14, and the high melting point metal is melted by the melting of the low melting point metal, whereby the melting and melting can be rapidly melted. Therefore, the fusible conductors 13, 72, 21 can promote the dissolution by rapidly forming the volume of the low-melting-point metal layer 92 into a volume of the higher-melting-point metal layer 91, and quickly make the first The second electrodes 11, 12 are short-circuited.

又,可熔導體13,72,21亦可如圖42所示,具有形成為大致矩形板狀且被構成外層之高熔點金屬被覆而形成為較主面部13b,72b,21b厚之相對向的一對第1側緣部13c,72c,21c、以及構成內層之低熔點金屬露出且形成為厚度較第1側緣部13c,72c,21c薄之相對向的一對第2側緣部13d,72d,21d。 Further, as shown in FIG. 42, the fusible conductors 13, 72, 21 may be formed in a substantially rectangular plate shape and covered with a high melting point metal constituting the outer layer, and formed to be thicker than the main surface portions 13b, 72b, and 21b. The pair of first side edge portions 13c, 72c, 21c and the low melting point metal constituting the inner layer are exposed and formed to face the pair of second side edge portions 13d which are thinner than the first side edge portions 13c, 72c, 21c. , 72d, 21d.

第1側緣部13c,72c,21c,側面被高熔點金屬層91被覆,藉此形成為較可熔導體13,72,21之主面部13b,72b,21b厚。第2側緣部13d,72d,21d於側面露出有外周被高熔點金屬層91圍繞之低熔點金屬層92。第2側緣部13d,72d,21d中除了與第1側緣部13c,72c,21c相鄰之兩端部外均形成為與主面部13b,72b,21b相同厚度。 The first side edge portions 13c, 72c, and 21c are covered with the high melting point metal layer 91, and are formed thicker than the main surface portions 13b, 72b, and 21b of the fusible conductors 13, 72, and 21. The second side edge portions 13d, 72d, and 21d are exposed on the side surface with a low-melting-point metal layer 92 whose outer periphery is surrounded by the high-melting-point metal layer 91. The second side edge portions 13d, 72d, and 21d are formed to have the same thickness as the main surface portions 13b, 72b, and 21b except for the both end portions adjacent to the first side edge portions 13c, 72c, and 21c.

以上述方式構成之第1可熔導體13,如圖43所示,第1側緣部13c連接於第1、第2電極11,12間且沿著發熱體拉出電極18及支撐電極83上連接,第2側緣部13d以與形成於第1、第2電極11,12上之第2絕緣層82對向之方向被連接。 As shown in FIG. 43, the first side edge portion 13c is connected to the first and second electrodes 11 and 12 and pulls the electrode 18 and the supporting electrode 83 along the heating element. The second side edge portion 13d is connected to the second insulating layer 82 formed on the first and second electrodes 11, 12 in a direction opposite thereto.

藉此,短路元件1,能在回焊構裝時等確實地防止第1可熔導體13彎曲,防止因第1可熔導體13之變形使第1、第2電極11,12間短路之初期短路。又,短路元件1在發熱體14之發熱後,能使第1可熔導體13迅速地熔融,並使之凝結於第1、第2電極11,12上而使其短路。 By this means, the short-circuiting element 1 can reliably prevent the first fusible conductor 13 from being bent during the reflow molding or the like, and prevent the initial stage of short-circuiting between the first and second electrodes 11 and 12 due to the deformation of the first soluble conductor 13. Short circuit. Further, after the short-circuiting element 1 generates heat, the first meltable conductor 13 can be rapidly melted and condensed on the first and second electrodes 11 and 12 to be short-circuited.

亦即,第1側緣部13c由於被高熔點金屬被覆,低熔點金屬層92亦未露出,因此難以發揮熔蝕作用,至熔融為止需要花費較多熱能。是以,第1可熔導體13,即使因回焊構裝時等之加熱,在第1電極11與第 2電極12間亦不易彎曲,能防止因彎曲而接觸於第1、第2電極11,12所導致之第1、第2電極11,12間之初期短路。 In other words, since the first side edge portion 13c is covered with the high melting point metal and the low melting point metal layer 92 is not exposed, it is difficult to exhibit the etching action, and it takes a lot of heat to be melted. Therefore, even if the first meltable conductor 13 is heated by the reflow soldering or the like, the first electrode 11 and the first electrode The electrodes 12 are also less likely to be bent, and it is possible to prevent an initial short circuit between the first and second electrodes 11 and 12 caused by the first and second electrodes 11 and 12 being bent due to the bending.

又,第2側緣部13d形成為較第1側緣部13c相對薄。又,第2側緣部13d之側面露出有構成內層之低熔點金屬層92。藉此,第2側緣部13d發揮因低熔點金屬層92所致之高熔點金屬層91之侵蝕作用,且被侵蝕之高熔點金屬層91之厚度亦形成為較第1側緣部13c薄,藉此相較於藉由高熔點金屬層91而形成為較厚之第1側緣部13c,能以較少熱能使之迅速地熔融。 Further, the second side edge portion 13d is formed to be relatively thinner than the first side edge portion 13c. Further, a low-melting-point metal layer 92 constituting the inner layer is exposed on the side surface of the second side edge portion 13d. Thereby, the second side edge portion 13d exerts an erosive action on the high melting point metal layer 91 due to the low melting point metal layer 92, and the thickness of the etched high melting point metal layer 91 is also formed to be thinner than the first side edge portion 13c. Thereby, the first side edge portion 13c formed thicker by the high-melting-point metal layer 91 can be rapidly melted with less heat.

因此,短路元件1,藉由發熱體14發熱,第2側緣部13d所對向之第1電極11與第2電極12之間即迅速地熔融,熔融導體凝結、結合於第1、第2電極11,12上。藉此,短路元件1中,第1、第2電極11,12係短路。 Therefore, the short-circuiting element 1 generates heat by the heat generating element 14, and the first electrode 11 and the second electrode 12 which are opposed to each other by the second side edge portion 13d are rapidly melted, and the molten conductor is condensed and bonded to the first and second portions. On the electrodes 11, 12. Thereby, in the short-circuiting element 1, the first and second electrodes 11, 12 are short-circuited.

又,以上述方式構成之第2可熔導體72,如圖44所示,藉由將被高熔點金屬被覆之第1側緣部72c配設於發熱體拉出電極18與發熱體供電電極71之間,由於熔融需要相當之時間,因此可確保至第1可熔導體13熔融使第1、第2電極11,12間短路為止之時間,防止在短路前供電路徑3即被阻斷之事態。 Further, as shown in FIG. 44, the second meltable conductor 72 configured as described above is disposed on the heat generating body pull-out electrode 18 and the heat generating body power supply electrode 71 by the first side edge portion 72c covered with the high melting point metal. Between the time required for the melting, the time required for the first meltable conductor 13 to be melted to short-circuit the first and second electrodes 11 and 12 is prevented, and the power supply path 3 is prevented from being blocked before the short circuit. .

此外,未具備輔助可熔導體21之短路元件1,40,50,70中同樣地亦可將發熱體14連接於第1、第2電極11,12。例如如圖44所示,短路元件70中,藉由將發熱體14亦連接於第2電極12而加熱,能以良好效率使第1可熔導體13濕潤,使熔融導體凝結於第1、第2電極11,12間並使之短路。 Further, in the short-circuiting elements 1, 40, 50, and 70 which are not provided with the auxiliary fusible conductor 21, the heating element 14 may be connected to the first and second electrodes 11, 12 in the same manner. For example, as shown in FIG. 44, in the short-circuiting element 70, by heating the heating element 14 to the second electrode 12, the first soluble conductor 13 can be wetted with good efficiency, and the molten conductor can be condensed in the first and the first. The two electrodes 11, 12 are short-circuited.

具有此種構成之可熔導體13,72,21,係藉由以構成高熔點金屬層91之Ag等金屬覆蓋構成低熔點金屬層92之低熔點金屬箔而製造。作為由高熔點金屬覆蓋低熔點金屬層箔的工法,有能連續地對長條狀低熔點金屬箔施以高熔點金屬鍍敷之電鍍法,就作業效率方面、製造成本方面均為有利。 The fusible conductors 13, 72, 21 having such a configuration are produced by covering a low-melting-point metal foil constituting the low-melting-point metal layer 92 with a metal such as Ag constituting the high-melting-point metal layer 91. As a method of covering the low-melting-point metal layer foil with a high-melting-point metal, there is an electroplating method capable of continuously applying a high-melting-point metal plating to the elongated low-melting-point metal foil, which is advantageous in terms of work efficiency and manufacturing cost.

藉由電鍍施加高熔點金屬鍍敷後,長條狀低熔點金屬箔之邊緣部分、亦即側緣部中電場強度相對變強,高熔點金屬層91較厚地被鍍敷(參照圖42)。藉此,形成藉由高熔點金屬層形成有較厚之側緣部的長條狀導體帶96。其次,藉由將此導體帶96於與長度方向正交之寬度方向(圖42中C-C’方向)切斷成既定長度,以製造可熔導體13,72,21。藉此,可熔導體13,72,21中,導體帶96之側緣部成為第1側緣部13c,72c,21c,導體帶96之切斷面成為第2側緣部13d,72d,21d。又,第1側緣部13c,72c,21c被高熔點金屬覆蓋,第2側緣部13d,72d,21d,於端面(導體帶96之切斷面)中被上下一對之高熔點金屬層91與高熔點金屬層91夾持之低熔點金屬層92露出至外部。 After the high melting point metal plating is applied by electroplating, the electric field strength of the edge portion of the elongated low melting point metal foil, that is, the side edge portion is relatively increased, and the high melting point metal layer 91 is plated thickly (see FIG. 42). Thereby, an elongated strip conductor 96 having a thick side edge portion formed by the high melting point metal layer is formed. Then, the conductor strips 96 are cut into a predetermined length in the width direction (C-C' direction in Fig. 42) orthogonal to the longitudinal direction to manufacture the fusible conductors 13, 72, 21. Thereby, in the fusible conductors 13, 72, 21, the side edge portions of the conductor strips 96 become the first side edge portions 13c, 72c, 21c, and the cut surface of the conductor strip 96 becomes the second side edge portions 13d, 72d, 21d. . Further, the first side edge portions 13c, 72c, and 21c are covered with a high melting point metal, and the second side edge portions 13d, 72d, and 21d are a pair of upper and lower high melting point metal layers in the end surface (the cut surface of the conductor strip 96). The low-melting-point metal layer 92 sandwiched between the 91 and the high-melting-point metal layer 91 is exposed to the outside.

1‧‧‧短路元件 1‧‧‧Short-circuit components

2‧‧‧開關 2‧‧‧Switch

11‧‧‧第1電極 11‧‧‧1st electrode

11a‧‧‧外部連接端子 11a‧‧‧External connection terminal

12‧‧‧第2電極 12‧‧‧2nd electrode

12a‧‧‧外部連接端子 12a‧‧‧External connection terminal

13‧‧‧第1可熔導體 13‧‧‧1st fusible conductor

14‧‧‧發熱體 14‧‧‧heating body

15‧‧‧接合材 15‧‧‧Material

17‧‧‧絕緣層 17‧‧‧Insulation

18‧‧‧發熱體拉出電極 18‧‧‧Feature body pull-out electrode

19‧‧‧發熱體電極 19‧‧‧Heating body electrode

Claims (27)

一種短路元件,具備:第1電極;第2電極,與上述第1電極相鄰設置;第1可熔導體,被上述第1電極支撐,藉由熔融而遍佈凝結於上述第1、第2電極間,使上述第1、第2電極短路;以及發熱體,加熱上述第1可熔導體;上述第1可熔導體,係往上述第2電極側突出而被支撐。 A short-circuiting element includes: a first electrode; a second electrode disposed adjacent to the first electrode; and a first meltable conductor supported by the first electrode and fused to the first and second electrodes by melting The first and second electrodes are short-circuited, and the heating element heats the first meltable conductor; the first meltable conductor protrudes toward the second electrode side and is supported. 如申請專利範圍第1項之短路元件,其中,上述第1可熔導體係與上述第2電極分離且重疊於上述第2電極。 The short-circuiting element according to claim 1, wherein the first meltable conductive system is separated from the second electrode and overlaps the second electrode. 如申請專利範圍第1或2項之短路元件,其中,於上述第2電極之與上述第1電極之相反側、或上述第1電極之與上述第2電極之相反側,設有與上述發熱體電氣連接之發熱體拉出電極;藉由上述發熱體拉出電極支撐上述第1可熔導體之一端,形成經由上述第1電極及上述第1可熔導體對上述發熱體供電之供電路徑。 The short-circuiting element according to claim 1 or 2, wherein the heat is provided on the opposite side of the second electrode from the first electrode or on the side opposite to the second electrode of the first electrode The heating element of the body is electrically connected to pull out the electrode; and the one end of the first fusible conductor is supported by the heating element drawing electrode to form a feeding path for supplying power to the heating element via the first electrode and the first fusible conductor. 如申請專利範圍第3項之短路元件,其中,在藉由上述第1可熔導體之熔融導體而使上述第1、第2電極間短路後,阻斷上述第1電極與上述發熱體拉出電極之間。 The short-circuiting element of claim 3, wherein the first electrode and the heating element are pulled out by short-circuiting between the first and second electrodes by the molten conductor of the first fusible conductor Between the electrodes. 如申請專利範圍第4項之短路元件,其中,上述發熱體拉出電極配設於較上述第1、第2電極更與上述發熱體分離之位置。 The short-circuiting element of claim 4, wherein the heating element drawing electrode is disposed at a position separated from the heating element by the first and second electrodes. 如申請專利範圍第1或2項之短路元件,其中,於上述第2電極之與上述第1電極之相反側、或上述第1電極之與上述第2電極之相反側,設 有與上述發熱體電氣連接之發熱體拉出電極;上述發熱體拉出電極,構成與上述第1、第2電極及上述第1可熔導體在電性上獨立之對上述發熱體之供電路徑。 The short-circuiting element according to claim 1 or 2, wherein the second electrode is opposite to the first electrode or the first electrode is opposite to the second electrode a heating element drawing electrode electrically connected to the heating element; the heating element drawing electrode, and electrically connecting the first and second electrodes and the first fusible conductor to the heating path of the heating element . 如申請專利範圍第6項之短路元件,其具有:發熱體供電電極,與上述發熱體拉出電極相鄰設置;以及跨載於上述發熱體拉出電極及上述發熱體供電電極間之第2可熔導體。 A short-circuiting element according to claim 6, comprising: a heating element power supply electrode disposed adjacent to the heating element drawing electrode; and a second span between the heating element drawing electrode and the heating element power supply electrode Fusible conductor. 如申請專利範圍第7項之短路元件,其中,在上述第1可熔導體熔融並藉由該第1可熔導體之熔融導體使上述第1、第2電極間短路後,上述第2可熔導體熔融,阻斷上述發熱體拉出電極及上述發熱體供電電極間。 The short-circuiting element according to claim 7, wherein the second fusible element is melted and the first and second electrodes are short-circuited by the molten conductor of the first fusible conductor, and the second fusible The conductor is melted to block the heating element pull-out electrode and the heating element supply electrode. 如申請專利範圍第8項之短路元件,其中,上述第1可熔導體配設於較上述第2可熔導體接近上述發熱體之位置。 The short-circuiting element of claim 8, wherein the first fusible conductor is disposed closer to the heat generating body than the second meltable conductor. 如申請專利範圍第8項之短路元件,其中,上述第1可熔導體形成為剖面積較上述第2可熔導體狹窄。 The short-circuiting element of claim 8, wherein the first fusible conductor is formed to have a smaller cross-sectional area than the second fusible conductor. 如申請專利範圍第8項之短路元件,其中,上述第1可熔導體之熔點較上述第2可熔導體低。 The short-circuiting element of claim 8, wherein the first meltable conductor has a lower melting point than the second meltable conductor. 如申請專利範圍第3項之短路元件,其中,於上述第1、第2電極之與上述發熱體拉出電極相反側,具備支撐上述第1可熔導體之另一端之支撐電極。 The short-circuiting element according to the third aspect of the invention, wherein the first and second electrodes are provided on the opposite side of the heat-generating body pull-out electrode, and a support electrode that supports the other end of the first meltable conductor is provided. 如申請專利範圍第1或2項之短路元件,其中,上述發熱體透過絕緣層與上述第1電極或上述第1電極及上述第2電極連續。 The short-circuiting element according to claim 1 or 2, wherein the heat generating body is continuous with the first electrode or the first electrode and the second electrode through an insulating layer. 如申請專利範圍第13項之短路元件,其中,於上述第2電極連接有輔助可熔導體; 上述發熱體透過上述絕緣層亦與上述第2電極連續。 The short-circuiting component of claim 13, wherein the auxiliary electrode is connected to the second electrode; The heat generating body is also continuous with the second electrode through the insulating layer. 如申請專利範圍第1或2項之短路元件,其中,上述第1及/或第2電極之一部分被以熱傳導率10W/m‧K以下之絕緣材料構成之支撐體支撐。 The short-circuiting element according to claim 1 or 2, wherein one of the first and/or second electrodes is supported by a support made of an insulating material having a thermal conductivity of 10 W/m‧K or less. 如申請專利範圍第1或2項之短路元件,其具備:絕緣基板,設有上述發熱體;第1絕緣層,被覆上述發熱體且積層有上述第1、第2電極;第2絕緣層,於上述第1、第2電極上,以使上述第1、第2電極之對向之各前端部露出之方式積層;以及發熱體拉出電極,與上述第1、第2電極相鄰,與上述發熱體電氣連接;上述第1可熔導體係被上述第2絕緣層支撐,且一端連接於上述發熱體拉出電極,另一端連接於上述第1電極。 The short-circuiting element according to claim 1 or 2, comprising: an insulating substrate provided with the heat generating body; a first insulating layer covering the heat generating body and laminating the first and second electrodes; and a second insulating layer; The first and second electrodes are laminated so that the front end portions of the first and second electrodes face each other; and the heating element pulls out the electrodes adjacent to the first and second electrodes, and The heat generating body is electrically connected; the first meltable conductive system is supported by the second insulating layer, and one end is connected to the heat generating body drawing electrode, and the other end is connected to the first electrode. 如申請專利範圍第16項之短路元件,其中,上述第2絕緣層具有使上述第1、第2電極所對向之各前端部露出之開口,上述第1可熔導體被搭載成覆蓋上述第2絕緣層之上述開口。 The short-circuiting element of claim 16, wherein the second insulating layer has an opening that exposes each of the front end portions of the first and second electrodes, and the first soluble conductor is mounted to cover the first 2 The above opening of the insulating layer. 如申請專利範圍第1或2項之短路元件,其具備覆蓋構件;上述第2電極,與上述第1電極對向地形成於上述覆蓋構件之頂面部。 A short-circuiting element according to claim 1 or 2, comprising: a covering member; wherein the second electrode is formed on a top surface portion of the covering member opposite to the first electrode. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體係Sn或以Sn為主成分之合金、或係Pb或以Pb為主成分之合金。 The short-circuiting element according to claim 1 or 2, wherein the first meltable conductive system Sn or an alloy containing Sn as a main component or an alloy containing Pb or Pb as a main component. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體係積層有低熔點金屬與高熔點金屬之複合材料。 The short-circuiting element according to claim 1 or 2, wherein the first meltable conductive system is laminated with a composite material of a low melting point metal and a high melting point metal. 如申請專利範圍第7項之短路元件,其中,上述第2可熔導體係Sn或以Sn為主成分之合金、或係Pb或以Pb為主成分之合金。 The short-circuiting element according to claim 7, wherein the second fusible conductive system Sn or an alloy containing Sn as a main component or an alloy containing Pb or Pb as a main component. 如申請專利範圍第7項之短路元件,其中,上述第2可熔導體係積層有低熔點金屬與高熔點金屬之複合材料。 The short-circuiting element of claim 7, wherein the second fusible guiding system is laminated with a composite material of a low melting point metal and a high melting point metal. 如申請專利範圍第20項之短路元件,其中,上述低熔點金屬係Sn或包含40%以上之Sn之合金,上述高熔點金屬係Ag、Cu、或以Ag或Cu為主成分之合金。 The short-circuiting element according to claim 20, wherein the low-melting-point metal Sn or an alloy containing 40% or more of Sn, the high-melting-point metal is Ag, Cu, or an alloy containing Ag or Cu as a main component. 如申請專利範圍第22項之短路元件,其中,上述低熔點金屬係Sn或包含40%以上之Sn之合金,上述高熔點金屬係Ag、Cu、或以Ag或Cu為主成分之合金。 The short-circuiting element according to claim 22, wherein the low-melting-point metal Sn or an alloy containing 40% or more of Sn, the high-melting-point metal is Ag, Cu, or an alloy containing Ag or Cu as a main component. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體形成為板狀,具有與上述第1電極之連接面積之2倍以上之面積。 The short-circuiting element according to claim 1 or 2, wherein the first fusible conductor is formed in a plate shape and has an area twice or more than a connection area with the first electrode. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體為線狀,具有與上述第1電極之連接長度之2倍以上之長度。 The short-circuiting element according to claim 1 or 2, wherein the first fusible conductor has a linear shape and has a length twice or more the length of connection with the first electrode. 如申請專利範圍第1或2項之短路元件,其中,上述第1、第2電極之間隔,係在上述第1、第2電極間隔之延長線上之上述第1電極之寬度以下。 The short-circuiting element according to claim 1 or 2, wherein the interval between the first electrode and the second electrode is equal to or smaller than a width of the first electrode on an extension line of the first and second electrode intervals.
TW104117931A 2014-06-04 2015-06-03 Short circuit element TWI683334B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2014-116003 2014-06-04
JP2014116003A JP6381975B2 (en) 2014-06-04 2014-06-04 Short circuit element

Publications (2)

Publication Number Publication Date
TW201603086A true TW201603086A (en) 2016-01-16
TWI683334B TWI683334B (en) 2020-01-21

Family

ID=54766808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117931A TWI683334B (en) 2014-06-04 2015-06-03 Short circuit element

Country Status (5)

Country Link
JP (1) JP6381975B2 (en)
KR (1) KR102386943B1 (en)
CN (3) CN109585218B (en)
TW (1) TWI683334B (en)
WO (1) WO2015186739A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6580504B2 (en) * 2016-03-23 2019-09-25 デクセリアルズ株式会社 Protective element
JP6959964B2 (en) * 2016-03-23 2021-11-05 デクセリアルズ株式会社 Protective element
TW201740417A (en) * 2017-07-07 2017-11-16 Pao-Hsuan Chen Switching device including an insulative housing, a plurality of terminal electrodes, a first overcurrent protection device, and a first heat generating component

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073559Y2 (en) * 1989-04-17 1995-01-30 内橋エステック株式会社 Temperature sensitive switch
JP2000133318A (en) * 1998-08-21 2000-05-12 Sony Corp Battery pack
JP4244452B2 (en) * 1999-07-19 2009-03-25 ソニー株式会社 Battery pack
JP3692042B2 (en) * 2001-02-06 2005-09-07 ソニーケミカル株式会社 Secondary battery with protection circuit
JP2004185960A (en) 2002-12-03 2004-07-02 Kamaya Denki Kk Circuit protection element and its manufacturing method
JP4508199B2 (en) * 2007-02-05 2010-07-21 ソニー株式会社 Lead sealant film and non-aqueous electrolyte battery
JP5117917B2 (en) * 2008-04-21 2013-01-16 デクセリアルズ株式会社 Protective element and manufacturing method thereof
JP5072796B2 (en) 2008-05-23 2012-11-14 ソニーケミカル&インフォメーションデバイス株式会社 Protection element and secondary battery device
CN102035185B (en) * 2009-09-25 2014-09-17 乾坤科技股份有限公司 Protective element and manufacturing method thereof
TW201134073A (en) * 2010-03-22 2011-10-01 Skynet Electronic Co Ltd Series resonant converter with overload delay and short circuit protection mechanism
JP5260592B2 (en) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 Protective element, battery control device, and battery pack
JP5656466B2 (en) 2010-06-15 2015-01-21 デクセリアルズ株式会社 Protective element and method of manufacturing protective element
JP6249600B2 (en) * 2012-03-29 2017-12-20 デクセリアルズ株式会社 Protective element
CN202772791U (en) * 2012-08-16 2013-03-06 台达电子电源(东莞)有限公司 Short circuit protection circuit used for parallel connection power supply
TWM459600U (en) * 2012-11-26 2013-08-11 Shu-Ling Chen Apparatus for circuit protection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691995B (en) * 2018-07-25 2020-04-21 大陸商江門市鈞崴電子科技有限公司 Protection element and insulated conductive heating module and method for manufacturing insulated conductive heating module

Also Published As

Publication number Publication date
CN110429006A (en) 2019-11-08
KR20170012231A (en) 2017-02-02
CN109585218A (en) 2019-04-05
CN110429006B (en) 2022-04-29
JP6381975B2 (en) 2018-08-29
CN109585218B (en) 2020-09-01
JP2015230804A (en) 2015-12-21
CN106415771B (en) 2019-12-20
TWI683334B (en) 2020-01-21
WO2015186739A1 (en) 2015-12-10
KR102386943B1 (en) 2022-04-14
CN106415771A (en) 2017-02-15

Similar Documents

Publication Publication Date Title
CN106796857B (en) Protection element and mounting body
TWI594285B (en) Short circuit components and circuits using this
TWI683334B (en) Short circuit element
TWI628687B (en) Short element
JP6161967B2 (en) Short circuit element and circuit using the same
TWI653796B (en) Short-circuit element and short circuit
JP6246503B2 (en) Short circuit element and circuit using the same
TWI670739B (en) Switching element and switching circuit
TWI685870B (en) Short circuit element
TWI615940B (en) Short circuit element