TW201544288A - Electronic device - Google Patents

Abstract

An electronic device includes a laser direct structuring (LDS) plastic layer, a metal antenna trace, an acrylonitrile butadiene styrene (ABS) plastic layer having an affinity for metal, a metal ground layer, and a connection member. The metal antenna trace is formed on a surface of the LDS plastic layer. The ABS plastic layer is over-molded on a portion of a surface of the LDS plastic layer that does not include the metal antenna trace. The metal ground layer is formed on the ABS plastic layer. The connection member mechanically and electrically connects the metal antenna trace and the metal ground layer.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having an antenna structure.

With the expansion of the use of wireless technology, many electronic devices have installed antennas and wireless components.

On some portable electronic devices, the antenna is usually built in. It is common practice to fix the metal sheet to the back shell of the device by means of plastic hot melt or to attach the metal sheet directly to the back shell of the device.

Another method is to form the grounding portion and the antenna portion, and then fuse the grounding portion and the similar material on the antenna portion with ultrasonic waves. Usually, the antenna portion is formed by forming an antenna on a polycarbonate (PC). The grounding part is first shot out of the polycarbonate layer with low metal affinity, and then injected a second time on the polycarbonate layer with low metal affinity to form acrylonitrile-butadiene-styrene (Acrylonitrile) with high metal affinity. Butadiene styrene; ABS) layer, then a metal ground layer is formed on the ABS layer, and finally the polycarbonate layer of the ground portion is fused to the polycarbonate of the antenna portion. However, the conventional method requires separately preparing two parts, and then welding the two parts, and it is necessary to form a layer of material that can be welded to the other part on one part, so the conventional method prefabricates more parts, and the manufacturing method is complicated. Therefore, the cost is high.

According to the above problem, the embodiment of the present invention correspondingly proposes a new electronic device.

An electronic device according to an embodiment of the invention comprises a laser direct molding (LDS) special plastic layer, a metal antenna trace, and a metal affinity acrylonitrile-butadiene-styrene (ABS). a plastic layer, a metal ground layer and a connector. Metal antenna traces are formed on the surface of the LDS-specific plastic layer. The ABS plastic layer is injection molded on the surface of the LDS-specific plastic layer that does not contain metal antenna traces. The metal ground layer is formed on the ABS plastic layer. The connector mechanically and electrically connects the metal antenna trace to the metal ground plane.

An electronic device according to another embodiment of the present invention includes a secondary injection molded part, an antenna trace, a metal layer, and a connecting member. The overmolded part is composed of a special plastic layer of LDS and a metal layer of ABS plastic with affinity. The antenna trace is located in the LDS-specific plastic layer and is exposed outside the overmolded part. The metal layer is in the ABS plastic layer. The connector connects the antenna trace to the metal layer.

In some embodiments, the LDS-specific plastic layer comprises a polycarbonate containing a metal additive.

In some embodiments, the ABS plastic layer comprises a metal-containing ABS plastic.

In some embodiments, the electronic device further includes a pre-plated copper layer between the metal antenna trace and the LDS-dedicated plastic layer and between the metal ground layer and the ABS plastic layer.

In some embodiments, the connector comprises a solder joint or wire.

In some embodiments, the metal antenna traces comprise copper antenna traces; or the metal ground plane comprises a copper ground plane.

Since the plastic layer of ABS is molded on the plastic layer of LDS, the electronic device does not need to use two parts to form the antenna part, and the ultrasonic component is not used for welding. Therefore, the electronic device uses fewer components, and the manufacturing method is simple, so the cost is low. .

1‧‧‧Electronic device

11‧‧‧Second injection molded parts

12‧‧‧Antenna trace

13‧‧‧metal layer

14, 14'‧‧‧Connecting parts

111‧‧‧LDS special plastic layer

112‧‧‧ABS plastic layer

1111‧‧‧ surface

1112‧‧‧ shallow groove

1 is a schematic diagram of an electronic device according to an embodiment of the invention.

2 is a schematic view of an embodiment of the present invention, which separately illustrates an antenna, a laser-only direct-forming (LDS) plastic layer, and a metal-affinity acrylonitrile-butadiene-styrene (ABS) plastic layer.

FIG. 3 is another schematic diagram of an electronic device according to an embodiment of the invention.

Figure 4A is a cross-sectional view taken along line 1000-1000 of Figure 3.

4B is a schematic view of another embodiment of the present invention, illustrating another connector.

FIG. 1 is a schematic diagram of an electronic device 1 according to an embodiment of the invention. 2 is a schematic view of an embodiment of the present invention, which separately illustrates an antenna, a laser-only direct-forming (LDS) plastic layer, and a metal-affinity acrylonitrile-butadiene-styrene (ABS) plastic layer. FIG. 3 is another schematic diagram of an electronic device 1 according to an embodiment of the invention. Figure 4A is a cross-sectional view taken along line 1000-1000 of Figure 3.

Referring to FIGS. 1 to 4A, the electronic device 1 includes a secondary injection molded part 11, an antenna trace 12, a metal layer 13, and a connecting member 14. The overmolded part 11 is composed of a laser direct molding (LDS) special plastic layer 111 and a metal affinity acrylonitrile-butadiene-styrene (ABS) plastic layer 112. The antenna trace 12 is placed on the LDS-dedicated plastic layer 111 and exposed outside the overmolded part 11. The metal layer 13 is located on the ABS plastic layer 112. The connector 14 connects the antenna trace 12 to the metal layer 13.

In particular, in some embodiments, antenna trace 12 is a metal antenna trace. The antenna trace 12 is formed on a portion of the surface 1111 of the LDS-dedicated plastic layer 111. The ABS plastic layer 112 is injection molded on the surface of the LDS-dedicated plastic layer 111 that does not contain the antenna trace 12 (or is molded on a portion of the surface of the surface that does not contain the antenna trace 12). The metal layer 13 is a metal ground layer, and the metal layer 13 is formed on the ABS plastic layer 112. The connector 14 mechanically and electrically connects the antenna trace 12 to the metal layer 13.

In some embodiments, the electronic device 1 includes a portable device or a non-portable device. In some embodiments, the electronic device 1 can utilize the antenna traces 12 for wireless communication. In some embodiments, the outer casing of the electronic device 1 includes an LDS-dedicated plastic layer 111 and an ABS plastic layer 112; however, the invention is not limited thereto. In some embodiments, a part of the electronic device 1 includes an LDS-dedicated plastic layer 111 and an ABS plastic layer 112.

In some embodiments, the LDS-dedicated plastic layer 111 forms a recess, wherein the antenna trace 12 is formed on the bottom surface of the recess and extends partially to the outer edge of the recess, as shown in FIGS. 1 and 2; This is limited.

In some embodiments, the ABS plastic layer 112 forms a recess, wherein the LDS-dedicated plastic layer 111 is received in the recess formed by the ABS plastic layer 112, as shown in FIG. The invention is not limited thereto.

Referring to FIG. 2, the LDS-dedicated plastic layer 111 contains a material compatible with the LDS process. The LDS-dedicated plastic layer 111 is made of a mixture of a polymer material and a metal additive, wherein the metal additive is sensitive to laser light. The metal additive can be a metal complex or an organic metal complex. A pattern for fabricating the antenna trace 12 is formed on the LDS-dedicated plastic layer 111 by laser. The surface illuminated by the laser light etches the shallow trench 1112. The bottom surface of the shallow groove 1112 is a rough surface. The metal additive is activated by laser irradiation to produce a physicochemical reaction to form metal particles embedded in the rough bottom surface. The metal particles can be used as a metal nuclei in a subsequent metal deposition process. After patterning by laser, the overmolded part 11 can be placed in the plating solution so that laser direct structuring as the antenna trace 12 can be plated on the shallow groove 1112. In some embodiments, the LDS-specific plastic layer 111 comprises a polycarbonate containing a metal additive.

Antenna trace 12 can be fabricated from any metal suitable as an antenna. Antenna trace 12 can comprise at least one metal. In some embodiments, antenna trace 12 includes copper antenna traces. In some embodiments, a pre-copper strike is applied to the shallow trench 1112 prior to plating the antenna trace 12 such that a pre-plated copper layer is included between the antenna trace 12 and the LDS-dedicated plastic layer 111. .

In some embodiments, the ABS plastic layer 112 comprises an electroplated grade ABS, or the ABS plastic layer 112 comprises an ABS material suitable for electroplating. In some embodiments, the surface of the ABS plastic layer 112 that is plated with the metal layer 13 is a rough surface having a plurality of small pits that can secure the metal layer 13. In some embodiments, the rough surfaces of the plurality of craters are formed using an etching process. In some embodiments, the ABS plastic layer 112 comprises a metal-containing ABS plastic or material. After the surface of the ABS plastic layer 112 on which the metal layer 13 is plated is etched (for example, etched), the surface of the metal layer 13 is etched with metal particles. When the overmolded part 11 is placed in the plating solution, the metal layer 13 can be plated.

Metal layer 13 can be fabricated from any suitable metal. The metal layer 13 may comprise at least one metal. In some embodiments, metal layer 13 comprises a copper layer or a copper ground layer. In some embodiments, a pre-plated copper layer is formed between the ABS plastic layer 112 and the metal layer 13.

In some embodiments, the ABS plastic layer 112 forms a recess and the metal layer 13 covers the outer surface of the groove, as shown in Figure 2; however, the invention is not limited thereto. In some embodiments, the ABS plastic layer 112 constitutes a groove, and the metal layer 13 covers the outer surface of the groove and the groove opening edge of the covering portion; however, the invention is not limited thereto.

The connector 14 connects (or mechanically and electrically connects) the metal layer 13 to the antenna trace 12. Referring to Figure 4A, in some embodiments, the connector 14 includes a wire. In some embodiments, the wires may be fabricated separately or formed directly on the electronic device 1.

Further, referring to FIG. 4B, in some embodiments, the connector 14' includes a solder joint.

In at least one embodiment, the electronic device includes a structure consisting of an LDS-dedicated plastic layer that can form a metal trace of the antenna and an ABS plastic layer that can be formed with a ground layer, and the structure is an ABS plastic layer. After being injection molded into the special plastic layer of LDS, it is formed by plating metal on the LDS special plastic layer and the ABS plastic layer. Thus, the structure of the electronic device does not need to form two parts first, and then is formed by welding the two parts by ultrasonic waves. Therefore, the electronic device has few components, and the manufacturing method is simple, so the cost is low.

The technical content and technical features of the present disclosure have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the present disclosure is not to be construed as being limited by the scope of

1‧‧‧Electronic device

11‧‧‧Second injection molded parts

12‧‧‧Antenna trace

13‧‧‧metal layer

14‧‧‧Connecting parts

111‧‧‧LDS special plastic layer

112‧‧‧ABS plastic layer

1111‧‧‧ surface

Claims (12)

An electronic device comprising: a laser direct molding (LDS) special plastic layer; a metal antenna trace formed on the surface of the LDS special plastic layer; and a metal affinity acrylonitrile-butadiene-styrene (ABS) a plastic layer molded on the surface of the LDS-dedicated plastic layer that does not contain the metal antenna trace; a metal ground layer formed on the ABS plastic layer; and a connector for mechanically and electrically connecting the metal antenna trace With the metal ground plane. The electronic device according to claim 1, wherein the LDS-dedicated plastic layer comprises a polycarbonate containing a metal additive. The electronic device of claim 1 or 2, wherein the ABS plastic layer comprises a metal-containing ABS plastic. The electronic device according to claim 3, further comprising a pre-plated copper layer between the metal antenna trace and the LDS-dedicated plastic layer and between the metal ground layer and the ABS plastic layer. The electronic device of claim 4, wherein the connector comprises a solder joint or a wire. The electronic device of claim 4, wherein the metal antenna trace comprises a copper antenna trace; or the metal ground layer comprises a copper ground plane. An electronic device comprising: A two-shot injection molded part consisting of a laser-formed (LDS) special plastic layer and a metal affinity acrylonitrile-butadiene-styrene (ABS) plastic layer; an antenna trace is located in the The LDS special plastic layer is exposed outside the overmolded part; a metal layer is located on the ABS plastic layer; and a connecting member is connected to the antenna trace and the metal layer. The electronic device according to claim 7, wherein the LDS-dedicated plastic layer comprises a polycarbonate containing a metal additive. The electronic device of claim 7 or 8, wherein the ABS plastic layer comprises a metal-containing ABS plastic. The electronic device of claim 9, further comprising a pre-plated copper layer between the antenna trace and the LDS-dedicated plastic layer and between the metal layer and the ABS plastic layer. The electronic device of claim 10, wherein the connector comprises a solder joint or a wire. The electronic device of claim 10, wherein the antenna trace comprises a copper trace; or the metal layer comprises a copper layer.