TW201543045A - Test device for image sensor and test method thereof - Google Patents

Abstract

This invention relates to a test device for image sensors and its test method, wherein a test head is provided with a chip pick-up/place and light transmission channel, which includes a first end surface and a second end surface corresponding to each other. The first end surface is coupled to a light source device while the second end surface leans against a light sensing surface of the image sensor. The light emitted by the light source device is transmitted to the light sensing surface of the image sensor through the chip pick-up/place and light transmission channel. The chip pick-up/place and light transmission channel further communicates with a negative voltage source that drives a second end surface of the chip pick-up/place and light transmission channel detection tube to pick-up and place the image sensor. As such, the chip pick-up/place and light transmission channel of this invention has efficacies of light transmission for chip inspection and sucking and placing for moving the chips by coupling to the light source device and communicating with the negative voltage source at the same time.

Description

Image sensor test device and test method thereof

The present invention relates to a test device for an image sensor and a test method thereof, and more particularly to a test device and a test method thereof that simultaneously have both optical transmission and suction transfer.

With the proliferation of digital cameras, mobile phones, tablets, notebook computers, car cameras, and various types of monitors, the huge demand for camera devices has increased, and the field of image sensor testing has been gradually developed. .

Please refer to FIG. 4. FIG. 4 is a schematic diagram of a conventional image sensor detecting device. As shown in the figure, the conventional image sensor detecting apparatus mainly includes a pick-and-place arm 91, a mobile wafer slot 92, and a detecting head 93. The actual operation mode of the conventional image sensor detecting device is as follows: First, the picking arm 91 moves to the top of the wafer carrying tray 94 to suck a wafer C to be tested; then, the mobile wafer slot 92 moves to the pick and place arm. 91, the pick-and-place arm 91 places the wafer C to be tested into the mobile wafer slot 92; then, the mobile wafer slot 92 carrying the wafer C to be tested moves below the detecting head 93; The detecting head 93 is moved down to abut the wafer C to be tested and tested. As a result, the measured wafers are returned to the wafer carrier disk 94 in the reverse order described above.

However, the above-described conventional image sensor detecting device and the like The detection method, the entire carrying process is too complicated, and the cost of the equipment is increased due to the separate holding arm 91. In addition, the mobile chip slot 92 of the conventional device integrates a Socket and a shuttle, and the power line, the signal line, and the ground line of the Socket must also be moved according to the movement. Special wiring and design will result in complex design of the overall wiring, and it will be easier to use long-term use to cause damage to the line, affecting detection efficiency and yield.

The main object of the present invention is to provide a test device for an image sensor and a test method thereof, which can enable a wafer pick-and-place and optical transmission channel to simultaneously absorb, place, and transmit light for wafer transfer. In order to avoid the conventional wafer pick-and-place arm, the efficiency and yield can be greatly improved, and the probability of device damage can be reduced, and the cost can be significantly reduced. In addition, the present invention can be retrofitted using existing equipment without the need to repurchase dedicated equipment, thereby avoiding equipment cost.

In order to achieve the above object, a test device for an image sensor includes: a test head having a wafer pick-and-place and optical transmission channel, and the wafer pick-and-place optical transmission channel includes a first end face corresponding to each other And a second end face. The first end face is coupled to a light source device, and the second end face is for abutting to a light sensing surface of an image sensor, and the light emitted by the light source device is taken by the wafer pick-and-place and light transmission channel. And delivered to the light sensing surface of the image sensor. The wafer pick-and-place optical transmission channel is further connected to a negative pressure source, which drives the second end face of the wafer pick-and-place optical transmission channel to take the image sensor. Accordingly, the wafer pick-and-place and light transmission channel of the present invention is coupled to the light source device and simultaneously connected To the negative pressure source, the wafer pick-and-place and optical transmission channels simultaneously have the functions of optical transmission for wafer inspection, and suction and placement for transferring wafers.

Wherein, the sidewall of the wafer pick-and-place and light transmission channel of the present invention may have at least one exhaust port, and the test head may further include an exhaust passage, and one end of the exhaust passage is connected to the at least one exhaust port, and the row The other end of the air passage is coupled to the negative pressure source. Accordingly, the vent of the present invention can be disposed on the sidewall of the wafer pick-and-place illuminating channel to avoid affecting or obstructing light incident on the first end face or light exiting the second end face. Preferably, the sidewall of the wafer pick-and-place and optical transmission channel of the present invention can have two exhaust ports, and the two exhaust ports are disposed at the same axial height and different radial orientations of the wafer pick-and-place and light transmission channels. At the office. Accordingly, the arrangement of the plurality of exhaust ports can increase the probability of the exhaust ports being aligned with the exhaust passages to increase the convenience of installation.

Furthermore, the present invention may further include a wafer slot under the test head for accommodating the image sensor; in addition, the bottom surface of the groove of the wafer slot of the present invention may be provided with a plurality of metal pads, and the image sensor The utility model further comprises a lower contact surface of the plurality of contacts, and the plurality of contacts respectively correspond to the plurality of metal pads. Accordingly, the wafer slot of the present invention can be used to accommodate and test an image sensor, wherein a plurality of contacts disposed by the lower surface of the image sensor wafer are disposed corresponding to the bottom surface of the slot of the electrical contact slot. A plurality of metal pads form an electrical connection for the supply of the power supply and the transmission of the detection signal.

Additionally, the present invention can further include a transfer shuttle, and the transfer shuttle can be selectively moved into or out of between the test head and the wafer slot. Accordingly, the present invention can load and unload image sensor wafers through the transfer shuttle for the wafer pick-and-place and light transmission channels to pick up, transfer or place the wafer.

To achieve the foregoing objective, a method for testing an image sensor includes the following steps: First, a test head includes a wafer pick-and-place and optical transmission channel connected to a negative pressure source, and the test head is detached through the wafer. The optical transmission channel picks up an image sensor and transfers the image sensor to a chip slot; then, the test head illuminates the image sensor through the wafer pick-and-place light transmission channel, and the image sensor performs And; when the detection is completed, the test head picks up the image sensor through the wafer pick-and-place and light transmission channel, and moves the image sensor out of the wafer slot. Accordingly, the wafer pick-and-place and optical transmission channel of the present invention simultaneously performs the optical transfer of the wafer transfer step and the wafer detection step.

In the step of transferring the image sensor to the chip slot of the test head of the present invention, the method further includes the following steps: First, the transfer shuttle moves to the bottom of the test head, and the transfer shuttle carries an image sense. Next, the wafer pick-and-place and light transmission channel of the test head is lowered and the image sensor is sucked onto the transfer shuttle; then, the wafer pick-and-place and light transmission channel of the test head rises, and the transfer shuttle is moved away from the detector. Below the test head; finally, the wafer pick-and-place and light transmission channels of the test head are lowered, and the image sensor is inserted into the wafer slot. Accordingly, the present invention can make the wafer pick-and-place and light transmission channel of the test head only need to carry out the lifting and descending transfer operations by the assistance of the transfer shuttle to simplify the wafer transfer work and improve the transfer efficiency.

Similarly, in the step of moving the image sensor out of the chip slot by the test head of the present invention, the method further includes the following steps: first, the test head sucks the image sensor through the wafer pick-and-place and light transmission channel, and raises the image. The sensor moves out of the wafer slot; then, the transfer shuttle moves under the test head; and the wafer pick-and-place and light transmission channel of the test head drops The image sensor is placed on the transfer shuttle; finally, the wafer pick-and-place and light transmission path of the test head rises, and the transfer shuttle moves out of the test head.

Moreover, in the test method of the image sensor of the present invention, when the image sensor performs the detection, the wafer pick-and-place and light transmission channel of the test head always abuts on the image sensor, which can avoid wafer fetching on the one hand. The light transmission channel is leaked, and the test head can also act as a crimping device to ensure that the image sensor is firmly accommodated in the chip slot to avoid detection interruption caused by poor contact.

[study]

91‧‧‧Remove arm

92‧‧‧Mobile wafer slot

93‧‧‧Detector

94‧‧‧ wafer carrier

C‧‧‧Samps to be tested

[this creation]

2‧‧‧Test head

200‧‧‧ side wall

210‧‧‧Exhaust port

22‧‧‧ first end face

23‧‧‧second end face

24‧‧‧ wafer pick-and-place and optical transmission channel

25‧‧‧Exhaust Road

3‧‧‧Light source device

4‧‧‧Image sensor

41‧‧‧Light sensing surface

42‧‧‧Under junction

43‧‧‧Contacts

5‧‧‧ wafer slot

50‧‧‧Slot bottom

51‧‧‧Metal pad

6‧‧‧Transporting shuttle

7‧‧‧negative source

1 is a schematic cross-sectional view of a preferred embodiment of the present invention.

2 is a cross-sectional view of a test head in accordance with a preferred embodiment of the present invention.

3A to 3D are schematic cross-sectional views showing respective steps of a test method according to a preferred embodiment of the present invention.

4 is a schematic diagram of a conventional image sensor detecting device.

Before the present invention is described in detail in the present embodiment, it is to be noted that in the following description, similar elements will be denoted by the same reference numerals.

Please refer to FIG. 1 , FIG. 2 , and FIG. 3A to FIG. 3D . FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the image sensor of the present invention, and FIG. 2 is a test device of the image sensor of the present invention. A cross-sectional view of a test head of a preferred embodiment, and FIGS. 3A through 3D are cross-sectional views of various steps of a test method in accordance with a preferred embodiment of the present invention. As shown in the figure, this implementation The test device of the image sensor mainly comprises a test head 2, a wafer slot 5, and a transfer shuttle 6, wherein the wafer slot 5 is located under the test head 2, and the wafer slot 5 is provided for the content. The image sensor 4 is used for testing; and the transfer shuttle 6 is selectively moved into or out of between the test head 2 and the wafer slot 5, as shown in Figures 3A through 3D.

Furthermore, the test head 2 of the present embodiment is provided with a wafer pick-and-place optical transmission channel 24, and the wafer pick-and-place optical transmission channel 24 includes a first end surface 22 and a second end surface 23 which are opposite to each other. The first end surface 22 is coupled to a light source device 3, and the second end surface 23 is used to abut the light sensing surface 41 of one of the image sensors 4.

Accordingly, the light emitted by the light source device 3 can be sent to the light sensing surface 41 of the image sensor 4 by the wafer pick-and-place and light transmission channel 24 for the detection to proceed. In addition, the wafer pick-and-place optical transmission channel 24 is further connected to a negative pressure source 7, which drives the second end face 23 of the wafer pick-and-place optical transmission channel 24 to pick up or place the image sensor 4. Further, in the embodiment, the sidewall 200 of the wafer pick-and-place optical transmission channel 24 defines two exhaust ports 210, and the test head 2 further includes an exhaust passage 25, and one end of the exhaust passage 25 is connected to the second One of the exhaust ports 210, and the other end of the exhaust passage 25 is coupled to the negative pressure source 7.

The two exhaust ports 210 are disposed at the same axial height and different radial orientations of the wafer pick-and-place and light transmission channels 24 to increase the probability of alignment of the exhaust ports 210 and the exhaust channels 25 when installed. It can increase the convenience of installation. In addition, the bottom surface 50 of the wafer slot 5 of the embodiment is provided with a plurality of metal pads 51, and the image sensor 4 further includes a lower contact surface 42 of the plurality of contacts 43, and the plurality of contacts 43 respectively correspond to Plural metal Pad 51. Accordingly, the plurality of contacts 43 disposed by the lower surface 42 of the image sensor wafer 4 are electrically connected to the plurality of metal pads 51 electrically connected to the groove bottom surface 50 of the wafer slot 5, thereby forming a power connection. Supply and detection signal transmission.

In addition, please refer to FIG. 3A to FIG. 3D together. FIG. 3A to FIG. 3D are schematic cross-sectional views showing the steps of the testing method according to a preferred embodiment of the present invention. The actual operation steps of this embodiment are as follows: First, as shown in FIG. 3A, the transfer shuttle 6 is moved under the test head 2, and the transfer shuttle 6 carries the image sensor 4 to be tested; then, the test head 2 The wafer pick-and-place optical transmission channel 24 is lowered and transferred to the shuttle shuttle 6, so that the wafer pick-and-place optical transmission channel 24 picks up the image sensor 4; in addition, the wafer pick-and-place and optical transmission channel 24 of the test head 2 rises. And the transfer shuttle 6 is moved away from the test head 2, at this time, the wafer pick-and-place light transmission channel 24 still sucks the image sensor 4, as shown in FIG. 3B; and further, the test head 2 wafer pick-and-place light The transmission channel 24 is lowered to allow the image sensor 4 to be inserted into the wafer slot 5.

In addition, as shown in FIG. 3C, the test head 2 illuminates the image sensor 4 through the wafer pick-and-place light transmission channel 24, and the image sensor 4 performs detection. However, in the embodiment, when the image sensor 4 performs the detection, the wafer pick-and-place and light transmission channel 24 of the test head 2 always abuts on the image sensor 4, which can avoid wafer pick-and-place and light transmission on the one hand. The channel 24 is leaked from the bottom, and the test head 2 can also serve as a crimping device to ensure that the image sensor 4 is firmly accommodated in the wafer slot 5, thereby avoiding detection interruption caused by poor contact.

When the detection is completed, the test head 2 sucks the image sensor 4 through the wafer pick-and-place and light transmission channel 24, and rises and moves the image sensor 4 out of the crystal. a slot 5; then, the transfer shuttle 6 is moved under the test head 2; further, the wafer pick-and-place light transmission channel 24 of the test head 2 is lowered and the image sensor 4 is placed on the transfer shuttle 6 Finally, the wafer pick-and-place and light transmission channel 24 of the test head 2 rises, and the transfer shuttle 6 is moved away from the test head 2.

In summary, the wafer pick-and-place optical transmission channel 24 of the present embodiment is coupled to the negative pressure source 7 by being coupled to the light source device 3, and the wafer pick-and-place optical transmission channel 24 is also used for wafer inspection. The optical transmission, as well as the functions of picking and placing the wafer for transfer, so as to avoid the conventional wafer pick-and-place arm, can greatly improve the efficiency and the yield, and can significantly reduce the cost. Moreover, the present invention can be retrofitted using existing equipment without the need to repurchase dedicated equipment to avoid equipment cost.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

2‧‧‧Test head

200‧‧‧ side wall

210‧‧‧Exhaust port

22‧‧‧ first end face

23‧‧‧second end face

24‧‧‧ wafer pick-and-place and optical transmission channel

25‧‧‧Exhaust Road

3‧‧‧Light source device

4‧‧‧Image sensor

41‧‧‧Light sensing surface

42‧‧‧Under junction

43‧‧‧Contacts

5‧‧‧ wafer slot

50‧‧‧Slot bottom

51‧‧‧Metal pad

7‧‧‧negative source

Claims (10)

A test device for an image sensor includes: a test head having a wafer pick-and-place optical transmission channel, the wafer pick-and-place optical transmission channel including a first end surface and a second end surface, the first end surface The first end surface is coupled to the light source device, and the second end surface is coupled to a light sensing surface of an image sensor. The light is transmitted to the light sensing surface of the image sensor by the wafer pick-and-place optical transmission channel; wherein the wafer pick-and-place optical transmission channel is further connected to a negative pressure source, which drives the wafer to be taken The second end face of the illuminating transmission channel picks up the image sensor. The test device of the image sensor of claim 1, wherein the sidewall of the wafer pick-and-place optical transmission channel defines at least one exhaust port, the test head further includes an exhaust passage, and one end of the exhaust passage is connected to The at least one exhaust port is coupled to the negative pressure source at the other end of the exhaust passage. The test device of the image sensor of claim 2, wherein the sidewall of the wafer pick-and-place optical transmission channel has two exhaust ports, and the two exhaust ports are disposed in the same manner as the wafer pick-and-place and optical transmission channels. Axial height and different radial orientations. The test device of the image sensor of claim 1, further comprising a chip slot under the test head for receiving the image sensor. The test device of the image sensor of claim 4, further comprising a transfer In the shuttle, the transfer shuttle is selectively moved into or out of the test head and the wafer slot. The test device of the image sensor of claim 4, wherein the bottom surface of the slot of the chip slot is provided with a plurality of metal pads, and the image sensor further comprises a lower contact surface of the plurality of contacts, the image sensor The plurality of contacts correspond to the plurality of metal pads, respectively. A method for testing an image sensor includes the following steps: (A). A test head includes a wafer pick-and-place optical transmission channel connected to a negative pressure source, and the test head is sucked through the wafer pick-and-place optical transmission channel An image sensor and transferring the image sensor to a chip slot; (B) the test head illuminates the image sensor through the wafer pick-and-place light transmission channel, the image sensing And (C). After the detection is completed, the test head picks up the image sensor through the wafer pick-and-place optical transmission channel, and moves the image sensor out of the wafer slot. The method of testing the image sensor of claim 7, wherein the step (A) comprises the following steps: (A1). A transfer shuttle moves under the test head, and the transfer shuttle carries the An image sensor; (A2). The wafer pick-and-place optical transmission channel of the test head is lowered and the image sensor is sucked onto the transfer shuttle; (A3). The wafer pick-and-place of the test head The optical transmission channel rises, the transfer shuttle moves away from the underside of the test head; and, (A4). the wafer pick-and-place optical transmission channel of the test head drops, The image sensor is inserted into the wafer slot. The method of testing the image sensor of claim 8, wherein the step (C) comprises the following steps: (C1). the test head sucks the image sensor through the wafer pick-and-place optical transmission channel and rises Moving the image sensor out of the wafer slot; (C2). moving the shuttle to the underside of the test head; (C3). the wafer pick-and-place light transmission channel of the test head is lowered and the image is sensed The detector is placed on the transfer shuttle; and, (C4), the wafer pick-and-place optical transmission channel of the test head rises, and the transfer shuttle is moved away from the test head. The test method of the image sensor of claim 7, wherein in the step (B), when the image sensor performs the detection, the wafer pick-and-place optical transmission channel of the test head always abuts the image. Sensor.