TW201542693A - Polysilsesquioxane-based sealing material composition for uv-led and use of metal alkoxide therefor - Google Patents

Abstract

Use of a metal alkoxide as a curing accelerator for a polysilsesquioxane-based sealing material for UV-LED, said sealing material providing a cured product that has a light transmittance of 65% or more at 260 nm; and a polysilsesquioxane-based sealing material composition for UV-LED, which contains a polysilsesquioxane-based sealing material and a metal alkoxide.

Description

Use of polysilsesquioxane encapsulating material composition for UV-LED and metal alkoxide used therefor

The present invention relates to the use of polysilsesquioxane-based encapsulating material compositions for UV-LEDs and metal alkoxides therefor.

Patent Document 1 describes an encapsulating material obtained by using acetonitrile pyruvate as a curing accelerator for a condensed epoxy resin encapsulating material.

Prior technical literature Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-112975

However, this encapsulating material has absorption in the UV region, and therefore, it is not necessarily satisfactory as a packaging material for UV-LED.

The present invention includes the inventions of the following [1] and [2].

[1] The use of a metal alkoxide as a curing accelerator for a polysilsesquioxane-based encapsulating material for UV-LEDs having a transmittance of light of 260 nm as a cured product of 65% or more.

[2] A polysilsesquioxane-based encapsulating material composition for a UV-LED, which comprises a polysesquioxane-based encapsulating material and a metal alkoxide.

According to the present invention, it is possible to provide a composition of a polysilsesquioxane-based encapsulating material suitable for emitting an element of light in an ultraviolet region (particularly, a UV-C region) and a metal alkoxide used therefor.

Fig. 1 is a graph showing the results of ultraviolet/visible transmittance measurement of the cured product obtained in Example 1.

2 is a measurement result of ultraviolet light/visible light transmittance of the cured product obtained in Comparative Example 1.

The invention is described in detail below.

<Polysilsesquioxane encapsulant>

In the present invention, a polysilsesquioxane-based encapsulating material, for example, Azumax Co., Ltd., "His sesquioxane. T-resin"

<URL:http://www.azmax.co.jp/cnt_catalog_chemical/ Pt/attach_20110517_135825.pdf> such as the polysesquioxanes described.

Examples of the polysilsesquioxane-based encapsulating material include, for example, an encapsulating material containing a resin A having an organic polyoxymethane structure represented by the formula (1).

(wherein R ¹ each independently represents an alkyl group, R ² each independently represents an alkoxy group or a hydroxyl group, and p ¹ , q ¹ , a ¹ , and b ¹ represent [p ¹ + b ¹ × q ¹ ]: [a ¹ × q ¹ ]=1: a positive number of 0.25~9.)

It is preferred to further contain the oligomer B having the structure of the organopolyoxane represented by the formula (2), and the mixing ratio of the resin A to the oligomer B, more preferably the resin A: oligomer B = 100: 0.1 ~20 (mass ratio). By using the resin A as a main component, it is possible to suppress deterioration due to ultraviolet light or to improve heat resistance.

(wherein R ¹ and R ² represent the same meanings as in the above formula (1), and p ² , q ² , r ² , a ² , and b ² represent [a ² × q ² ] / [(p ² + b ² ×q ² )+a ² ×q ² +(r ² +q ² )] = 0 to 0.3 of 0 or more.)

The alkyl group represented by R ¹ may be linear or branched, or may have a cyclic structure, but is preferably a linear or branched alkyl group, more preferably a linear one. alkyl. The number of carbon atoms of the alkyl group is not particularly limited, but is preferably 1 to 10, more preferably 1 to 6, still more preferably 1 to 3, and particularly preferably 1.

R ² each independently represents an alkoxy group or a hydroxyl group.

When R ² is an alkoxy group, the alkoxy group may be linear or branched, or may have a cyclic structure, but is preferably a linear or branched alkoxy group, more preferably It is a linear alkoxy group. The carbon number of the alkoxy group is not particularly limited, but is preferably 1 to 3, more preferably 1 to 2, particularly preferably 1.

Each of R ¹ and R ² may be a group of the same kind or a different base.

The resin A-based R ¹ has one or more selected from the group consisting of a methyl group and an ethyl group, and R ² has one selected from the group consisting of a methoxy group, an ethoxy group, an isopropoxy group, and a hydroxyl group. In the above, R ¹ is preferably ^one or more selected from the group consisting of a methyl group and an ethyl group, and R ² is one selected from the group consisting of a methoxy group, an ethoxy group, and an isopropoxy group. The above is better with the hydroxyl group.

The weight average molecular weight (Mw) of the resin A is usually 1,500 or more and 8,000 or less. When the weight average molecular weight of the resin A satisfies this range, the formability at the time of curing can be improved. The weight average molecular weight of the resin A is preferably 1,500 or more and 7,000 or less, more preferably 2,000 or more and 5,000 or less.

Resin A is synthesized, for example, by using an organic ruthenium compound having a functional group capable of generating a decane bond as a starting material, corresponding to each of the above repeating units. The "functional group which can generate a siloxane bond", for example, has a halogen atom, a hydroxyl group, and an alkoxy group. Examples of the organic ruthenium compound include an organic trihalo decane and an organic trialkoxy decane. Resin A can be synthesized by reacting the starting materials of these materials in a ratio corresponding to the existence ratio of each repeating unit by a hydrolysis condensation method. As the resin A, a commercially available oxime resin, an alkoxy oligomer or the like can be used.

The oligomer B-based R ¹ has one or more selected from the group consisting of a methyl group and an ethyl group, and R ² has a group selected from the group consisting of a methoxy group, an ethoxy group, an isopropoxy group, and a hydroxyl group. More preferably, R ¹ is a methyl group, and R ² is preferably a methoxy group or a hydroxyl group.

The weight average molecular weight of oligomer B is usually less than 1,500. When the weight average molecular weight of the oligomer B satisfies this range, the moldability at the time of curing can be improved. The weight average molecular weight of the oligomer B is preferably 200 or more, less than 1,500, and more preferably 250 to 1,000.

The oligomer B is, for example, the above-mentioned respective repeating units constituting the oligomer B Correspondingly, an organic ruthenium compound having a functional group capable of generating a decane bond is used as a starting material for synthesis. The "functional group capable of generating a decane bond" means the same meaning as the above. Examples of the organic ruthenium compound include an organic trihalo decane and an organic trialkoxy decane. The oligomer B can be synthesized by reacting the starting materials of these or the like in a ratio corresponding to the existence ratio of each repeating unit by a hydrolysis condensation method.

The difference from the weight average molecular weight of the resin A can also be controlled, for example, by controlling the reaction temperature at which the starting material is subjected to a hydrolysis condensation reaction, the rate of addition to the starting material in the reaction system, and the like. As the oligomer B, an ophthalmic resin, an alkoxy oligomer or the like which is commercially available can be used.

The weight average molecular weight of Resin A and oligomer B was measured using a commercially available GPC apparatus using standard polystyrene.

The polysilsesquioxane-based encapsulating material before curing can be used by being dissolved in a solvent in order to easily package an element provided on a substrate. At this time, the viscosity of the obtained solution was adjusted to be 10 mPa at 25 ° C. s to 10000mPa. s can.

The solvent may be any one of the encapsulating materials before curing, and may be, for example, a ketone solvent such as acetone or methyl ethyl ketone; an alcohol solvent such as methanol, ethanol, isopropanol or n-propanol; a hydrocarbon solvent such as cyclohexane, heptane or benzene; an acetate solvent such as methyl acetate or ethyl acetate; an ether solvent such as diethyl ether or tetrahydrofuran; ethylene glycol monomethyl ether and ethylene glycol Ethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monoethylhexyl ether, ethylene glycol monophenyl ether, ethylene glycol monobenzyl Ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene Alcohol monoisopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monoethylhexyl ether, diethylene glycol monophenyl ether, diethylene glycol monobenzyl Ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monoisopropyl ether, propylene glycol monobutyl ether, propylene glycol monohexyl ether, propylene glycol monoethylhexyl ether, propylene glycol monophenyl ether, propylene glycol monobenzyl ether , dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monoisopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monohexyl ether, dipropylene glycol monoethylhexyl ether, dipropylene glycol monophenyl ether a glycol ether solvent such as dipropylene glycol monobenzyl ether; ethylene glycol monoethyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol monobutyl ether acetate, Glycol monohexyl ether acetate, ethylene glycol monoethylhexyl ether acetate, ethylene glycol monophenyl ether acetate, ethylene glycol monobenzyl ether acetate, etc. The ethylene glycol ester solvent of the glycol ether solvent described.

The polysilsesquioxane-based encapsulating material may be used alone or in combination of two or more.

<hardening accelerator>

The hardening accelerator in the present invention is a metal alkoxide. The metal alkoxide is a compound represented by the following formula (3).

M(OR) _n (3)

(wherein M represents a metal ion. R represents an organic group (alkyl group). n represents a valence of a metal ion.)

Examples of the metal (M) in the metal alkoxide include aluminum, gallium, titanium, zirconium, hafnium, zinc, and the like. Among them, the emission of ultraviolet rays (especially the UV-C zone) The light of the domain is preferably aluminum or zirconium, more preferably aluminum. The alkoxy group (OR) is, for example, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a sec-butoxy group, a tert-butoxy group or the like, and is preferably an isopropoxy group. The metal alkoxide is preferably an aluminium alkoxide or an alkoxy zirconium oxide. The alkane oxides are, for example, triethylaluminum oxide, triisopropylaluminum oxide, tris-butylaluminum oxide, tritert-butadiene alumina or the like. Examples of the zirconium isopropoxide include tetraisopropoxide zirconia, triple sec-butadiene zirconia, and the like.

The hardening accelerator can be used by dissolving in a solvent such as an organic solvent. The solvent to be used at this time may be any one which dissolves the organometallic complex, and is preferably an alcohol, an ester or an ether. The concentration of the hardening accelerator is preferably from 0.01% to 10%.

The amount of the hardening accelerator to be used is usually 10 ppm to 500 ppm (parts per million by weight), preferably 10 ppm to 200 ppm, more preferably 10 ppm to 100 ppm, based on the polysilsesquioxane-based encapsulating material.

The hardening accelerator prepares the resin A and the oligomer B in a separate solution, and it is preferred to mix the solutions before use.

The hardening accelerator may be used alone or in combination of two or more.

<hardening of packaging materials>

In the use of the present invention, a pre-cured encapsulating material containing the above polysilsesquioxane-based encapsulating material and a curing accelerator is usually encapsulated on an element provided on a substrate, and then cured. That is, the packaging method of the UV-LED component used in the present invention includes the following steps: a first step of disposing a component on a substrate, and a polysilsesquioxane-based encapsulating material and the following The composition of the poly-sesquioxane-based encapsulating material of the solvent a is encapsulated in the first step, the second step of the device provided on the substrate, and the hardening of the polysilsesquioxane-based encapsulating material encapsulated in the second step The third step.

The component placement on the substrate can be performed by a conventional method. A semiconductor light-emitting device such as an electrode or a wiring may be provided with other necessary configurations.

The above packaging step is usually performed by supplying a package material before hardening to the substrate by a dedicated dispenser. The amount of the sealing material before the hardening is varied depending on the structure, area, volume, structure of other electrodes, wire wiring, and the like of the substrate, the element, and the like, but the components, the wire wiring, and the light-emitting element are buried. The thickness of the encapsulating material is preferably as thin as possible, more preferably in an amount of 2 mm or less. In particular, a power LED for visible light having a light-emitting output current of 100 mA or more, which has been developed in recent years, generates a UV-LED having a wavelength of 350 nm or less, and this tendency is remarkable. Therefore, the thickness of the package material on the light-emitting element is thin. Preferably.

The curing conditions may be set to a temperature and a time at which the polycondensation reaction usually occurs. Specifically, in the air at atmospheric pressure, the temperature is preferably from 100 to 200 ° C, more preferably from 120 to 200 ° C. The time is preferably 1 to 5 hours. Further, in order to effectively promote volatilization or polycondensation reaction of the residual solvent in the encapsulating material, the curing temperature can be increased stepwise to harden.

The transmittance of the 260 nm light of the cured product is 65% or more, preferably 67% or more, and more preferably 70 to 93%.

Example

The apparatus and measurement conditions used for the measurement of the ultraviolet/visible transmittance described in the following examples are as follows.

<UV/visible transmittance measurement>

Device name: UV-3600 manufactured by Shimadzu Corporation

Attachment: integration sphere ISR-3100

Measuring wavelength: 220~800nm

Background measurement: atmosphere

Measuring speed: medium speed

Resin A is a resin (A-1) having a structure of an organopolyoxane represented by the above formula (1) (Mw=3500, in the above formula (1), R ¹ =methyl group, R ² =methoxy group or Hydroxyl). The existence ratio of each repeating unit of the resin (A-1) is shown in Table 1. Further, the oligomer B is an oligomer (B-1) having an organic polyoxoxane structure represented by the above formula (2) (Mw = 450, in the above formula (2), R ¹ = methyl group, R ² = methoxy). The existence ratio of each repeating unit of the oligomer (B-1) is shown in Table 2.

Example 1

In the flask provided in the water bath, 135 g of the resin (A-1) and 72.7 g of isopropyl alcohol were added, and the mixture was heated and stirred to bring the internal temperature to 85 ° C to dissolve the resin (A-1). Next, 15 g of the above oligomer (B-1) was added, and the mixture was stirred for 1 hour or more to dissolve the oligomer (B-1) to obtain a mixture.

After adding 47.2 g of 2-butoxyethyl acetate to the obtained mixture, the isopropyl alcohol was distilled off under the conditions of a temperature of 80 ° C and a pressure of 4 kPa A until the isopropyl alcohol concentration became 1% by mass or less. A polysilsesquioxane-based encapsulating material composition (α1) having a mixing ratio of the resin (A-1) and the oligomer (B-1) of 90:10 (weight ratio) was obtained.

With respect to the polysilsesquioxane-based encapsulating material composition (α1), triisopropylaluminum oxide was added to an isopropanol solution of 0.1% by weight of triisopropylaluminum with respect to α1 of 100 ppm (mass basis). The mixture was stirred and mixed to obtain a polysilsesquioxane-based encapsulating material composition (α1-1). Then, about 3.8 g of the composition (α1-1) was placed in an aluminum cup, and the temperature was raised from room temperature to 150 ° C at a rate of 3.7 ° C / minute in an oven, and left at 150 ° C for 5 hours to obtain a composition. A cured product of the substance (α1-1). The resulting cured product had a thickness of 1.7 mm. Figure 1 shows the measurement results of the ultraviolet/visible transmittance of the cured product. The ultraviolet/visible transmittance at 260 nm is 70%.

Comparative example 1

12.7 g of methyltrimethoxydecane, 11.2 g of dimethyldimethoxydecane, 3.3 g of methanol, 8.1 g of water, and 4.8 g of a 5 mass% solution of Acetylacetone aluminum in a flask were placed in a flask. The plug was sealed, stirred with a stirrer (Stirrer), and heated in a warm water bath at 50 ° C for 8 hours, and then returned to room temperature to prepare a resin liquid.

7.3 g of this resin solution was placed in a Teflon (registered trademark) disk (Schale) having a diameter of 5 cm, and kept at 40 ° C for 4 hours, then heated to 65 ° C for 3 hours, and then heated to 150 ° C for 1 hour. The mixture was kept at 150 ° C for 3 hours to obtain a cured product. The thickness of the cured product at this time was 0.9 mm. Figure 2 shows the measurement results of the ultraviolet/visible transmittance of the cured product. The ultraviolet/visible transmittance at 260 nm is 0%.

Industrial availability

The present invention can be used as, for example, a packaging material for UV-LEDs.

Claims (2)

A metal alkoxide used as a curing accelerator for a polysilsesquioxane-based encapsulating material for UV-LEDs having a transmittance of light of 260 nm as a cured product of 65% or more. A polysilsesquioxane-based encapsulating material composition for a UV-LED, which comprises a polysilsesquioxane-based encapsulating material and a metal alkoxide.