TW201542079A - System and method for cooling an electronic element in an electronic device - Google Patents

Abstract

A method for cooling an electronic element in an electronic device is provided. A heat absorbing element is movably disposed in the electronic device, wherein the electronic element has a first temperature T1 and the absorbing element has a second temperature T2. When the first temperature T1 of the electronic element exceeds the second temperature T2 of the heat absorbing element, and the difference between the first temperature T1 and the second temperature T2 exceeds a predetermined value [Delta]T (T1-T2 > [Delta]T), the heat absorbing element is disposed on a first position and contacts the electronic element. When the first temperature T1 exceeds the second temperature T2, and the difference between the first temperature T1 and the second temperature T2 less than the predetermined value [Delta]T (0 < T1-T2 < [Delta]T), the heat absorbing element is moved from the first position to a second position and separates from the electronic element.

Description

Heat dissipation system and heat dissipation method for electronic components in electronic devices

The invention relates to a heat dissipation system and a heat dissipation method. More particularly, the present invention relates to a heat dissipation system and a heat dissipation method for electronic components in an electronic device.

Most of today's electronic product designs are lightweight and easy to carry. Therefore, the thickness of electronic products is becoming thinner and thinner. Generally, fans and through holes for providing heat dissipation in electronic products must be reduced in accordance with the thickness of electronic products to make heat dissipation. The effect is reduced, which will easily lead to overheating and damage of the electronic product. Furthermore, as the internal space of the electronic product decreases, the distance between the electronic components located inside the electronic product will be closer, and the heat generated by the electronic product will be more difficult to discharge and cause adverse effects.

In order to solve the foregoing problems, the present invention provides a heat dissipation method for dissipating heat of an electronic component in an electronic device, including: providing a heat absorbing component, and disposing the heat absorbing component in the electronic device in a movable manner Wherein the electronic component has a first temperature T1 and the heat absorbing component has a second temperature T2; when the first temperature T1 of the electronic component is higher than the second temperature T2 of the heat absorbing component by a predetermined temperature difference ΔT (T1-T2) >△T), so that the heat absorbing element is located in the electronic device One of the first positions and contacts the electronic component; and when the first temperature T1 is higher than the second temperature T2, and the temperature difference between the first temperature T1 and the second temperature T2 is lower than the preset temperature difference ΔT (0<T1-T2) <ΔT), the heat absorbing element is moved to a second position, and the heat absorbing element is separated from the electronic element.

In an embodiment of the invention, the preset temperature difference ΔT is between 3 and 8 ° C.

In an embodiment of the invention, the heat absorbing element has a high heat enthalpy material.

In an embodiment of the invention, the high heat enthalpy material is a vapor grown carbon fiber material.

In an embodiment of the invention, the heat absorbing element further has a heat insulating casing having a plurality of holes, and the high heat enthalpy material is disposed in the heat insulating casing.

In an embodiment of the invention, the high heat enthalpy material has a projection that protrudes from the heat insulating outer casing.

In an embodiment of the invention, the heat insulating casing has a protrusion, wherein the high heat enthalpy material contacts the protrusion to form a gap between the high heat enthalpy material and the inner wall of the heat insulating casing.

In an embodiment of the invention, the heat dissipation method further includes when the first temperature T1 is less than or equal to the second temperature T2 (T1-T2) 0) When the power or the rotational speed of one of the heat dissipating components in the electronic device is greater than a predetermined value, the heat absorbing component is moved from the first position to the third position. Wherein the aforementioned third position is between the first position and the second position.

In an embodiment of the invention, the heat dissipation method further includes when the first temperature T1 is less than or equal to the second temperature T2 (T1-T2) 0), and when the power or the rotational speed of one of the heat dissipating components in the electronic device is less than or equal to a preset value, the heat absorbing component is moved to the second position.

In an embodiment of the invention, the heat dissipation method further includes: when the heat absorbing element moves to the second position, the heat absorbing element is pulled away from the electronic device, and the other heat absorbing element is installed at the first position in the electronic device, so that It contacts electronic components.

The present invention further provides a heat dissipation system for dissipating heat from an electronic component of an electronic device, including a moving component, a heat absorbing component, a first detecting unit, and a control unit, wherein the first detecting unit uses The first temperature T1 of the electronic component and the second temperature T2 of the heat absorbing element are detected. The control unit is connected to the first detecting unit and the moving component. The moving component is movably disposed in the electronic device and disposed on the moving component for dissipating heat from the electronic component. When the heat absorbing element is located at a first position of the electronic device, the heat absorbing element contacts the electronic component. When the first temperature T1 is higher than the second temperature T2 and the temperature difference between the first temperature T1 and the second temperature T2 is lower than the preset temperature difference ΔT (0<T1-T2<ΔT), the first detecting unit transmits one The first detecting signal is sent to the control unit, and the control unit transmits a first driving signal to the moving component according to the first detecting signal, so that the moving component drives the heat absorbing component to move from the first position to the second position to disengage the electronic device.

In one embodiment of the present invention, the heat dissipation system S further includes a heat dissipating component and a second detecting unit connected to each other, wherein the heat dissipating component is configured to dissipate heat from the electronic component, and the second detecting unit is configured to detect the heat dissipating component Power or speed. When the second temperature T2 is less than or equal to the first temperature T1 (T1-T2) 0) The second detecting unit transmits a second detecting signal to the control unit, and the control unit transmits a second driving signal to the moving component according to the second detecting signal, so that the moving component moves from the first position to the third position. position.

100‧‧‧Electronic devices

110‧‧‧ Guide slot

111‧‧‧ openings

120‧‧‧ side

200‧‧‧heat absorption components

210‧‧‧Shell

211‧‧‧ hole

212‧‧‧ Protrusion

220‧‧‧High enthalpy materials

221‧‧‧protrusion

300‧‧‧Mobile components

400‧‧‧First detection unit

500‧‧‧Second detection unit

600‧‧‧Control unit

E‧‧‧Electronic components

G‧‧‧ gap

H‧‧‧Heat components

S‧‧‧heating system

S1~S8‧‧‧Steps

1 is a schematic view showing an electronic device, a heat absorbing element, and a moving element according to an embodiment of the present invention.

2 and 3 are schematic views showing different angles of view of the heat absorbing member in an embodiment of the present invention.

Figure 4 is a cross-sectional view showing the heat absorbing element in combination with the moving element in an embodiment of the present invention.

Figure 5 is a schematic view showing a heat dissipation system of an electronic device in an embodiment of the present invention.

Figure 6 is a schematic view showing the heat absorbing element in a first position in an embodiment of the present invention.

Figure 7 is a schematic view showing the heat absorbing element in a second position in an embodiment of the present invention.

Figure 8 is a schematic view showing the heat absorbing member of the embodiment of the present invention detached from the electronic device.

Figure 9 is a schematic view showing the heat absorbing element in a third position in an embodiment of the present invention.

Figure 10 is a flow chart showing a heat dissipation method according to an embodiment of the present invention.

The heat dissipation system and the heat dissipation method of the embodiment of the present invention are described below for dissipating heat from electronic components in the electronic device. However, it will be readily understood that the embodiments of the present invention are susceptible to many specific embodiments of the invention and can The specific embodiments disclosed are merely illustrative of the use in a particular method. The present invention is not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It will be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the context or context of the present disclosure, and should not be in an idealized or overly formal manner. Interpretation, unless specifically defined herein.

First, referring to FIG. 1 , an electronic device 100 in an embodiment of the present invention has a guiding slot 110 , wherein the opening 111 of the guiding slot 110 is located at one side 120 of the electronic device 100 . A heat absorbing element 200 is housed in a moving element 300, and the combined heat absorbing element 200 and moving element 300 can be inserted into the guide groove 110 through the aforementioned opening 111. For example, the foregoing electronic device 100 can be a notebook computer or a tablet computer.

2 and 3 are schematic views showing different angles of view of the heat absorbing element 200, and Fig. 4 is a cross-sectional view showing the heat absorbing element 200 combined with the moving element 300. As shown in FIGS. 2 to 4, the heat absorbing element 200 has a casing 210 and a high heat enthalpy material 220 accommodated inside the casing 210, wherein the high heat enthalpy material such as graphitized vapor grown carbon fiber (VGCF) . A plurality of holes 211 arranged in a matrix are formed on the outer casing 210 for enhancing heat transfer between the high heat enthalpy material 220 and the external environment. In the present embodiment, the high heat enthalpy material 220 has two projections 221 protruding from the outer casing 210 (as shown in FIG. 4).

It should be particularly noted that the outer casing 210 and the moving element 300 have a heat insulating material such as glass fiber, diatomaceous earth or calcium citrate. As shown in FIG. 4, the four corners of the outer casing 210 are formed with protrusions 212 for the high heat enthalpy material 220 and A gap G is created between the inner walls of the outer casing 210, so that thermal energy in the high heat enthalpy material 220 is less easily transmitted to the moving element 300 via the outer casing 210. In another embodiment of the present invention, a vacuum may be formed in the gap G to make the heat energy in the high heat enthalpy material 220 more difficult to transfer to the outer casing 210 or the moving element 300. When the electronic device 100 is used, the protruding portion 221 of the heat absorbing member 200 can be in contact with an electronic component in the electronic device 100, thereby lowering the temperature of the electronic component, thereby preventing the electronic component from being damaged by overheating.

As shown in FIG. 5 and FIG. 6 , the electronic device 100 further includes a heat dissipation system S. As shown in FIG. 5 , the electronic device 100 further includes the heat absorbing component 200 , the moving component 300 , and a first detecting unit 400 . The second detecting unit 500 and the control unit 600 are electrically connected to the moving component 300 and the first and second detecting units 400 and 500. The first detecting unit 400 is configured to detect the temperature (the first temperature T1) of one of the electronic components E in the electronic device 100 and the temperature of the high-heating material 220 in the heat absorbing element 200 (the second temperature T2). The second detecting unit 500 is configured to detect the power or the rotational speed P of one of the heat dissipating components H of the electronic device 100, wherein the heat dissipating component H is used for dissipating heat from the electronic component E, such as a fan or a water-cooling component. The aforementioned electronic component E is, for example, a central processing unit (CPU), a chipset, or a hard disk.

As shown in FIG. 6, when the user uses the electronic device 100 and the first temperature T1 of the electronic component E is higher than the second temperature T2 of the high heat enthalpy material 220 by a predetermined temperature difference ΔT (T1-T2>△) T), the heat absorbing element 200 and the moving element 300 can be located at a first position of the guiding groove 110, and at this time, one of the protruding portions 221 of the heat absorbing element 200 contacts the electronic component E, so that the heat energy generated by the electronic component E can be conducted. Stored in the high heat enthalpy material 220 of the heat absorbing element 200 (Fig. 4), thereby lowering the electron element The temperature of the piece E can reduce the power consumed by the heat sink element H.

As shown in FIGS. 5 and 7, when the electronic device 100 operates for a period of time, if the difference between the first temperature T1 and the second temperature T2 is lower than the preset temperature difference ΔT (0<T1-T2<ΔT) The first detecting unit 400 transmits a first detecting signal to the control unit 600, and the control unit 600 then transmits a first driving signal to the moving component 300, and then the control unit 600 can transmit a first driving signal to the mobile component 300. The moving component 300 and the heat absorbing component 200 are driven from the first position to the second position (FIG. 7) by a transmission mechanism (for example, a gear and a motor) to facilitate the user to take out the heat absorbing component 200 from the side 120 of the electronic device 100. And replacing the other heat absorbing member 200 to the moving member 300, and then reinserting it into the first position of the guide groove 110 (Fig. 6) to continue absorbing the heat energy generated by the electronic component E. In this embodiment, the preset temperature difference ΔT is about 3 to 8 ° C (for example, 5 ° C).

In another embodiment, when the moving component 300 and the heat absorbing component 200 are retracted from the first position to the second position, the moving component 300 and the heat absorbing component 200 can also be taken out by the guiding slot 110, and the user can replace the same. Another heat absorbing element 200 and another moving element 300. Alternatively, only the heat absorbing element 200 may be taken out of the moving element 300, and the other heat absorbing element 200 may be placed in the original moving element 300. The heat absorbing element 200 after taking out can be placed upright and dissipated by the holes 211 shown in the above FIGS. 2 and 3. As shown in FIG. 8, in another embodiment of the present invention, the width of the opening 111 may be smaller than the width of the moving component 300, wherein when the moving component 300 drives the heat absorbing component 200 to move from the first position to the second position, only The heat absorbing element 200 can be removed from the side 120, at which point the user can replace only the heat absorbing element 200 without replacing the moving element 300.

When the electronic device 100 is in a high speed operation state, the electronic component E A large amount of thermal energy is generated, and in order to prevent the electronic component E from being overheated and damaged, the heat dissipating component H also operates at a high speed. However, when the electronic device 100 is quickly switched from a high-speed operation state to a standby state, the temperature (the first temperature T1) of the electronic component E may be lowered to a higher heat in a short time due to the high-speed operation of the heat dissipation element H. The temperature of the tantalum material 220 (second temperature T2) is lower (T1 < T2), at which time the high heat enthalpy material 220 will not be able to absorb the thermal energy of the electronic component E. However, when the heat dissipating component H is subsequently operated by the high speed operation, the temperature of the electronic component E (the first temperature T1) may again return to be higher than the temperature of the high heat enthalpy material 220 (the second temperature T2) (T1>T2). At this time, the high heat enthalpy material 220 can continue to absorb the heat energy of the electronic component E. For example, when the electronic component E quickly returns to the standby state from the high-speed operating state, the temperature is lowered from 80 ° C to 40 ° C. At this time, the temperature of the high-heat 焓 220 material is 50 ° C, and then when the heat-dissipating component H returns to normal operation The temperature of the electronic component E is again restored from 40 ° C to 60 ° C (higher than 50 ° C of the high heat enthalpy material 220). Therefore, in this process, the high heat enthalpy material 220 of the heat absorbing element 200 must be temporarily separated from the electronic component E to prevent thermal energy from being poured back into the electronic component E.

Referring to FIGS. 5 and 9 , when the first detecting unit 400 detects that the first temperature T1 of the electronic component E is less than or equal to the second temperature T2 of the high heat enthalpy material 220 (T1-T2 ≦ 0), the Determining the power or rotational speed P of the heat dissipating component H detected by the second detecting unit 500. If the power or the rotational speed P of the heat dissipating component H is higher than a predetermined value p, in order to avoid reverse conduction of thermal energy in the high thermal material 220 To the electronic component E, the second detecting unit 500 transmits a second detecting signal to the control unit 600, and then the control unit 600 transmits a second driving signal to the moving component 300, so that the moving component 300 can drive the heat absorbing component 200. The first position moves to a third position. The temperature of the electronic component E (the first temperature T1) is restored to a higher temperature than the high temperature When the temperature of the material 220 (the second temperature T2) is higher (T1-T2>ΔT), the heat absorbing element 200 can be directly returned from the third position to the first position, wherein the third position can be, for example, between the first and the second. Between locations.

In addition, if the first temperature T1 is less than the second temperature T2, and the power or the rotational speed P of the heat dissipating component H is equal to or less than the preset value p, the heat absorbing element 200 cannot absorb the thermal energy generated by the electronic component E. For example, when the electronic component E is quickly returned to the standby state from a high-speed operation state, the temperature is lowered from 80 ° C to 40 ° C. At this time, the temperature of the high-heat 焓 220 material is 70 ° C (higher than 40 ° C of the electronic component E). Then, when the heat dissipating component H returns to normal operation, the temperature of the electronic component E will return from 40 ° C to 60 ° C. In this case, the moving element 300 can be caused to move the heat absorbing element 200 to the second position, so that the user can replace the other heat absorbing element 200 into the first position.

Referring to the foregoing embodiments disclosed in FIGS. 1-9, the present invention further provides a heat dissipation method (as shown in FIG. 10) for the electronic component E in the electronic device 100. First, a heat absorbing element 200 is provided and movably disposed in the electronic device 100 (step S1) for absorbing thermal energy generated by the electronic component E.

When the electronic device 100 is in the use state, the temperature of the electronic component E (the first temperature T1) in the electronic device 100 and the temperature of the heat absorbing component 200 (the second temperature T2) can be detected by the heat dissipation system S (step S2) ), the temperature data obtained may have the following conditions:

1. When the first temperature T1 is greater than a predetermined temperature difference ΔT (T1-T2>ΔT), it is determined whether the heat absorbing element 200 is located at the first position and contacts the electronic component E (step S3); if yes, Then, step S2 is re-executed; if not, the heat absorbing element 200 is moved to the first position by the moving component 300 and contacts the electronic component E (step S4).

2. When the first temperature T1 is higher than the second temperature T2, and the temperature difference between the first temperature T1 and the second temperature T2 is lower than the preset temperature difference ΔT (0<T1-T2<ΔT), the heat absorbing element 200 Moves to the second position and is separated from the electronic component E (step S5).

3. When the first temperature T1 is less than or equal to the second temperature T2 (T1-T2≦0), the relationship between the power or the rotational speed P of the heat dissipating component H and a predetermined value p is determined (step S6), if the heat dissipating component H When the power or the rotational speed P is greater than a predetermined value p, the heat absorbing element 200 is moved from the first position to the third position (step S7), and if the power or rotational speed P of the heat dissipating component H is less than or equal to a predetermined value p, the heat absorption The element 200 is moved to the second position and separated from the electronic component E (step S5), wherein the third position can be located, for example, between the first and second positions.

It should be understood that when the heat absorbing element 200 is moved to the second position, the user can pull the heat absorbing element 200 away from the electronic device 100 and install the other heat absorbing element 200 in the first position in the electronic device 100, so that It contacts the electronic component E (step S8) to continue to dissipate heat from the electronic component E.

In summary, the present invention provides a heat dissipation system and method for electronic components of an electronic device. The heat dissipation system and the heat dissipation method enable the electronic components to dissipate heat more quickly and reduce the consumption of heat dissipation components (such as fans). Power to provide power saving or mute effects.

Although the embodiments of the present invention and its advantages are disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Moreover, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, devices, methods and steps in the specific embodiments described in the specification. Processes, machines, manufacturing, material compositions, devices, methods, and steps that are presently or in the future can be understood by those of ordinary skill in the art, as long as they can be implemented in the embodiments described herein. The function or the achievement of substantially the same result can be used in accordance with the present invention. Accordingly, the scope of the invention includes the above-described processes, machines, manufactures, compositions, devices, methods, and steps. In addition, the scope of each of the claims constitutes an individual embodiment, and the scope of the invention also includes the combination of the scope of the application and the embodiments.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. In addition, each patent application scope is constructed as a separate embodiment, and various combinations of patents and combinations of embodiments are within the scope of the invention.

S1~S8‧‧‧Steps

Claims (13)

A heat dissipation method for dissipating heat from an electronic component of an electronic device, comprising: providing a heat absorbing component, and arranging the heat absorbing component in the electronic device in a movable manner, wherein the electronic component has a first The temperature T1, and the heat absorbing element has a second temperature T2; when the first temperature T1 of the electronic component is higher than the second temperature T2 of the heat absorbing component by a predetermined temperature difference ΔT (T1-T2> ΔT Providing the heat absorbing element at a first position in the electronic device and contacting the electronic component; and when the first temperature T1 is higher than the second temperature T2, and the first temperature T1 and the second temperature T2 When the temperature difference is lower than the preset temperature difference ΔT (0<T1-T2<ΔT), the heat absorbing element is moved to a second position, and the heat absorbing element is separated from the electronic element. The heat dissipation method according to claim 1, wherein the preset temperature difference ΔT is between 3 and 8 °C. The heat dissipation method of claim 1, wherein the heat absorption element has a high heat enthalpy material. The heat dissipation method according to claim 3, wherein the high heat enthalpy material is a vapor phase growth carbon fiber material. The heat dissipation method of claim 3, wherein the heat absorbing element further has a heat insulating casing having a plurality of holes, and the high heat enthalpy material is disposed in the heat insulating casing. The heat dissipation method of claim 5, wherein the high heat enthalpy material has a protrusion protruding from the heat insulating casing. The heat dissipation method of claim 5, wherein the heat insulating casing has a protrusion that contacts the protrusion to form a gap between the high heat enthalpy material and an inner wall of the heat insulating casing. The heat dissipation method of claim 1, wherein the method further comprises: when the first temperature T1 is less than or equal to the second temperature T2 (T1-T2) 0), and when the power or the rotational speed of one of the heat dissipating components of the electronic device is greater than a predetermined value, the heat absorbing component is moved from the first position to a third position. The heat dissipation method of claim 8, wherein the third position is between the first position and the second position. The heat dissipation method of claim 1, wherein the method further comprises: when the first temperature T1 is less than or equal to the second temperature T2 (T1-T2) 0), and when the power or the rotational speed of one of the heat dissipating components of the electronic device is less than or equal to a predetermined value, moving the heat absorbing component to the second position. The heat dissipation method of claim 10, wherein the method further comprises: when the heat absorbing element moves to the second position, the heat absorbing element is pulled away from the electronic device, and the other heat absorbing element is installed The first location within the electronic device to contact the electronic component. A heat dissipation system for dissipating heat from an electronic component of an electronic device, comprising: a moving component disposed in the electronic device in a movable manner; and a heat absorbing component disposed on the moving component for The electronic component performs heat dissipation, wherein the electronic component has a first temperature T1, and the heat absorbing element The device has a second temperature T2; a first detecting unit is configured to detect the first temperature T1 and the second temperature T2, and when the heat absorbing element is located at a first position of the electronic device, the heat absorbing element Contacting the electronic component; and a control unit connecting the first detecting unit and the moving component, when the first temperature T1 is higher than the second temperature T2 and the temperature difference between the first temperature T1 and the second temperature T2 is low During the preset temperature difference ΔT (0<T1-T2<ΔT), the first detecting unit transmits a first detecting signal to the control unit, and the control unit transmits a first detecting signal according to the first detecting signal. The first driving signal is sent to the moving component, so that the moving component drives the heat absorbing component to move from the first position to a second position to disengage the electronic device. The heat dissipation system of claim 12, wherein the heat dissipation system further comprises: a heat dissipation component for dissipating heat from the electronic component; and a second detection unit connected to the control unit for detecting The power or rotational speed of the heat dissipating component when the second temperature T2 is less than or equal to the first temperature T1 (T1-T2) 0) The second detecting unit transmits a second detecting signal to the control unit, and the control unit transmits a second driving signal to the moving component according to the second detecting signal, so that the moving component is configured by the first A position moves to a third position.