TW201541604A - Package module with wiring electronic component and method for the same - Google Patents

Abstract

A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed according to the transformed parameters. The package module at least includes a substrate, the electronic component, and a molding layer. In addition, the transforming step refers to the dielectric constant of the molding layer.

Description

Package structure with line type electronic component and manufacturing method thereof

The present invention provides a package structure and a method of fabricating the same, and more particularly to a package structure having a line type electronic component and a method of fabricating the same.

In the design of some circuit board modules, some electronic components are buried in the circuit board, or printed on the circuit board. In the former embedded design process, the electronic components will consider the dielectric constant of the circuit board (dielectric constant) And a dissipation factor, such as a Micro-strip Transmission Line or a Coplanar Waveguide (CPW) architecture. The biggest advantage of the coplanar waveguide architecture compared to the microstrip transmission line is that all metals are on the same plane, so some processes can be eliminated.

However, in the process of designing an electronic module or a package structure with a circuit substrate, some electronic components are large in size, require a large space, and occupy a large area on the substrate, while other relatively small electronic components are When coexisting, the drop in the height of the large and small electronic components becomes an unusable space and forms a waste; on the other hand, as the function of the circuit board module increases, the number of required electronic components will increase, thus increasing The complexity and density of the pads and lines on the board.

Under the condition of not increasing the size of the circuit board module, but having more functions, how to make the electronic module and the circuit board module become miniaturized has become the goal pursued by the industry.

The main purpose of the present invention is to design and manufacture a line type electronic component in a mold layer by utilizing the characteristics of the material of the mold layer, and provide three-dimensional electrical properties through the mold layer. Connect the route.

Based on the above object, the present invention provides a method of fabricating a package structure having a line type electronic component, comprising: calculating a plurality of parameters required for a corresponding line type electronic component according to a specification of a predetermined electronic component; The parameter, the conversion process is calculated according to at least the dielectric constant of the encapsulation layer selected by the package structure; the package structure is formed according to the converted parameter, and the package structure comprises a substrate, a line type electronic component and a mold layer. The conversion process can selectively use the simulation software to fine tune the parameter values according to the allowable error range of the preset electronic component specifications.

The present invention provides a package structure having a line type electronic component including a substrate, a line type electronic component, and a mold layer. The line type electronic component comprises at least one transmission line, each transmission line has at least three connection segments, the first connection segment is located on the substrate, the second connection segment is located in the molding layer, the third connection segment is located on the upper surface of the molding layer, and the second The connecting section connects the first connecting section and the third connecting section.

In order to further understand the technology, method and effect of the present invention in order to achieve the intended purpose, reference should be made to the detailed description and drawings of the present invention. The drawings and the annexed drawings are intended to be illustrative and not to limit the invention.

1, 1', 1" ‧ ‧ package structure

10‧‧‧Substrate

20, 20', 20" ‧ ‧ seal layer

210, 210" ‧ ‧ holes

30‧‧‧Line Filter

310, 410, 910‧‧ transmission lines

320‧‧‧ Capacitance

312, 412, 912‧‧‧ first connection segment

314, 414, 914‧‧‧ second connection segment

316, 416, 916‧‧‧ third connection

318, 418‧‧‧ connection

40‧‧‧Line Coupler

50‧‧‧Electronic components

60‧‧‧ solder

70‧‧‧Substrate

80‧‧‧Second molding layer

90‧‧‧Line-type electronic components

920‧‧‧second transmission line

922‧‧‧fourth connection

924‧‧‧ fifth connection

926‧‧‧ sixth connection

D1, d2‧‧‧ spacing

L1, L2‧‧‧ length

W1, w2‧‧‧ width

S101, S102, S103‧‧‧ steps

1 is a flow chart showing the manufacturing of a package structure having a line type electronic component according to an embodiment of the present invention.

2 is a perspective view of a package structure according to a first embodiment of the present invention.

3A-3E are schematic cross-sectional views showing a manufacturing process of a package structure according to a first embodiment of the present invention.

4 is a frequency response diagram of a line filter simulation according to an embodiment of the present invention.

FIG. 5 is a perspective view of a package structure according to a second embodiment of the present invention.

6A-6E are schematic cross-sectional views showing a manufacturing process of a package structure according to a second embodiment of the present invention.

Figure 7 is a cross-sectional view showing a package structure in accordance with a third embodiment of the present invention.

The term "line type electronic component" as used in the present invention means that a part of the whole electronic component exists in the molding layer or the package structure, that is, the design and manufacture of the electronic component considers the dielectric of the molding layer material. The constant and loss coefficient are the line type electronic components of the present invention.

The line type electronic components in the following embodiments will use a filter and a coupler as an example to illustrate that the line type electronic component is formed in a three-dimensional package structure and a manufacturing method thereof. In practical applications, the type of the line type electronic component may also be a balun device. Inductance or any integrated component, the invention is not limited thereto.

1 is a manufacturing flow diagram of an embodiment of the present invention, and corresponding package structures 1, 1' are shown in FIGS. 2 and 5. 2 is a perspective view of a first embodiment of the present invention. The line type electronic component in the package structure 1 is a line filter 30. 3A-3E are schematic cross-sectional views of the manufacturing process, corresponding to the section line A-A of FIG.

Referring to FIGS. 2 and 3E, the package structure 1 includes a substrate 10, a mold layer 20', a line filter 30, and an electronic component 50. The substrate 10 may be a printed circuit board (PCB), a semiconductor substrate, or a low-temperature cofired ceramics (LTCC). The molding layer material is, for example, Epoxy Molding Compounds (EMCs). The electronic component 50 can be an active component, such as a die or packaged wafer, or a passive component such as a capacitor, resistor, inductor. Of course, in practical applications, the package structure 1 may include the substrate 10, the mold layer 20', and the line filter 30 without including the electronic component 50, as will be described later in the second embodiment.

In the present embodiment, the line filter 30 includes three transmission lines 310 and three capacitors 320, each of which is connected to one end of a transmission line 310. The three transmission lines 310 are mutually juxtaposed with each other, and the distance between adjacent two transmission lines 310 is d1. The number of the transmission lines 310, the capacitance value of the capacitor 320, the pitch d1 of the two adjacent transmission lines 310, the length of the transmission line 310, and the width w1 may be regarded as the same. The parameters of the line filter 30 are shown. The parameters are calculated according to the specifications of the preset filter, and all parameters are adjusted according to different requirements and specifications.

In this embodiment, each transmission line 310 is formed by a conductive line, and includes three first connection segments 312, four second connection segments 314, and two third connection segments 316. The transmission lines 310 on both sides further include a connection end 318 for connecting to the adjacent first connection section 312, respectively, as an input or an output of the line filter 30.

Next, a description will be given of a manufacturing method of the package structure 1, see FIG. 1 and FIGS. 3A-3E. In step S101, a planar (XY) printed filter is first implemented according to a preset filter specification and a design procedure. In this case, a plurality of parameters, such as a capacitance value and a parallel coupled line equivalent to the inductance, are obtained. length. At this point, it should be noted that the line width and line spacing of the parallel coupled line segments (width/gap) should refer to the minimum design specification of the local line electronic component process in the molding layer of the subsequent process, otherwise component design will occur. When I came out, I was faced with a situation where the process could not be coordinated. In addition, the length of the plane (X-Y) parallel coupled line segment at this time is not the final length, and is mainly used for reference in the subsequent three-dimensional layout in the mold layer. That is, a plurality of parameters obtained in this step may require a conversion calculation process, that is, the next step S102. For convenience of understanding, the parameter before conversion may be referred to as a plane parameter, and the converted parameter is referred to as a three-dimensional parameter.

Next, the parameter is converted in step S102, that is, the plane parameter of the previous step is converted into a three-dimensional parameter, which is a dielectric constant and a loss coefficient of the material of the sealing layer, and an electrical impedance of the connection segment structure and the connection point. In general, the value of the parameter before conversion will differ from the value of the parameter after conversion. After the conversion, the analog software can be used to finely adjust and verify according to the allowable error range of the preset filter, so that the line filter 30 conforms to the specifications of the preset filter, and finally the three-dimensional parameters are used as the subsequent manufacturing line type. The process basis of the filter. In this step, in addition to the fine-tuning and verification of the parameters of the line filter, the fine tuning and verification of the overall characteristics of the package structure 1 can be further performed, that is, the internal line-containing electronic components are included therein. The relevant parameters of the electrical connection between all electronic components are also fine-tuned and verified.

Next, in step S103, a package structure is formed according to the converted parameters, that is, the relevant parameters of the line filter 30 are implemented in the substrate 10 and the mold layer 20' to form the package structure 1. The relevant parameters of the electrical connection can also be formed in this step.

Further illustrated herein with respect to step S103, please refer to FIGS. 3A-3E and to FIG. 3A, a substrate 10 is provided to form an electronic component 50, a capacitor 320, a first connection segment 312, and a connection terminal 318 on the substrate 10. FIG. 3B, forming a mold layer 20 on the substrate 10. The mold layer 20 covers the substrate 10, the capacitor 320, the three first connection segments 312, the connection terminals 318, and the electronic components 50. Figure 3C, four holes 210 are formed in the mold layer 20'. Two holes 210 on the left and right sides expose one end of the first connecting section 312 on the left and right sides. Two holes 210 in the middle expose both ends of the first connecting section 312 in the middle. 3D, four second connecting segments 314 are formed in the holes 210, respectively, and are connected to the first connecting segments 312, respectively. 3E, two third connecting segments 316 are formed on the upper surface of the molding layer 20', and are respectively connected to the second connecting portion 314 to make the first connecting segment 312, the second connecting segment 314 and the third connecting segment 316 forms a transmission path.

The forming method of the second connecting portion 314 is, for example, using a through molding via (TMV). However, in other embodiments, the stacked stud bump may be used to form the second connection. Section 314, that is, the stacked conductive bumps are regarded as an electronic component, which is formed on the substrate together with other electronic components such as the first connecting segment and the capacitor, and is respectively connected to the first connecting segment; The sealing layer covers other electronic components such as capacitors, the first connecting segment, and exposes one end of the stacked conductive bumps.

The transmission line 310 can be routed over the substrate 10, and can also be routed in the encapsulation layer 20' and the surface of the encapsulation layer 20'. The encapsulation layer 20' actually provides more wiring space for the transmission line 310.

The transmission line 310 has only a part of the length of the surface of the substrate 10, and other portions exist in the surface of the molding layer or the surface, so the transmission line 310 occupies a straight line in the package structure 1. The line distance L1 will be less than the total length of the transmission line 310. Therefore, the space of the line filter 30 on the substrate 10 can be greatly reduced, and the area utilization rate of the substrate 10 is increased. The user can design the transmission line 310 in or on the molding layer 20' according to actual needs.

On the other hand, since the electronic component 50 and the transmission line 310 are both disposed in the encapsulation layer 20' or on the encapsulation layer 20', the electronic component 50 can be electrically connected to other transmission lines of the electronic component 50 or any of the connection segments. As such, there is considerable design flexibility in the space utilization of line electronic components and other electronic components 50.

Fig. 4 is a graph showing the result of frequency response simulation of the line filter 30 of the first embodiment of the present invention. The operating frequency of the preset filter can be approximately equal to 2.45 GHz, and the insertion loss and the return loss are used to indicate the case where the line filter 30 is filtered at an operating frequency of 2.45 GHz.

The following describes a second embodiment of the present invention. Referring to FIG. 5, this embodiment differs from the previous embodiment in that only the wired electronic component, such as the line coupler 40, is included in the package structure 1', and there is no other. Electronic component. Parts similar to those of the previous embodiment will not be described herein. In the present embodiment, the line coupler 40 includes two transmission lines 410 that are parallel to each other and extend in the same direction.

6A-6E are schematic cross-sectional views showing a manufacturing process of a package structure 1' according to a second embodiment of the present invention. 6A-6E are cross-sectional views taken along section line B-B of the package structure 1' of Fig. 5. The manufacturing method and steps are similar to those of the previous embodiment, and will not be described here.

The invention can also be used in a package on package (PoP). FIG. 7 is a cross-sectional view of a package structure 1 ′′ according to a third embodiment of the present invention. The difference from the first embodiment is that the package structure 1′′ includes the substrate 10 and the mold layer 20 ′. The second mold layer 80 and the solder 60 and the substrate 70. The line electronic component 90 includes a transmission line 910 in the encapsulation layer 20' and a second transmission line 920 in the second encapsulation layer 80. The transmission line 910 can be divided into a first connection segment 912, a second connection segment 914, and a third connection segment 916, and the second transmission line 920 can also be divided. It is divided into a fourth connecting section 922, a fifth connecting section 924 and a sixth connecting section 926.

In addition, the third connecting portion 916 and the solder 60 are located between the mold layer 20' and the substrate 70, the second transfer line 920 is on the substrate 70, and the second mold layer 80 is on the substrate. In detail, the second molding layer 80 covers the substrate 70, the fourth connecting portion 922 and the fifth connecting portion 924, and the sixth connecting portion 926 is located on the upper surface of the second molding layer 80. The transmission line 910 is electrically connected to the second transmission line 920 through the solder 60, and the fifth connection section connects the fourth connection section and the sixth connection section. The material, structure, and relative element relationship of the substrate 10, the mold layer 20', and the transmission line 910 are substantially the same as those of the first embodiment, and will not be further described herein.

The manufacturing method of the package includes the above steps S101, S102 and S103, and similar parts are not described here, and special attention is paid to the following. The parameters of step S101 need to include the specifications of the predetermined electronic components in the individual mold layer 20' and the second mold layer 80 that are converted into line electronic components.

In step S102, when calculating the parameters of the previous step, the dielectric constant and loss coefficient of the individual mold layer 20' and the second mold layer 80, and the electrical impedance of the solder 60 are considered. In other applications, if the package structure 1 ′′ has other electronic components 50 as in the first embodiment, it is also necessary to simultaneously consider the electrical impedance of the connection segments between the line-type electronic components and the electronic components 50 .

Step S103, forming the line type electronic component 90 in the package structure 1", meaning that the relevant parameters of the line type electronic component 90 are formed on the substrate 10 and the mold layer 20', the solder 60, and the substrate 70 and the second mold layer. 80 to form a package structure 1". In this step, the transmission line 910 can be separately formed in the encapsulation layer 20', and the second transmission line 920 is in the second encapsulation layer 80, and the two portions are connected through the solder 60. The substrate 10, the mold layer 20', and the transmission line 910 may be formed first, and the method is the same as that of the first embodiment, and will not be described here; after that, the solder 60 and the substrate 70 are formed on the mold layer 20', and then Forming a fourth connecting portion 922 on the substrate 70, forming a fifth connecting portion 924 and a second molding layer 80, and finally forming a sixth connecting portion 926. The method for forming the fifth connecting portion 924 is, for example, the through-through die-punching (through) Molding via, TMV) or stacked stud bumps.

The number, spacing, length, width, and arrangement of the embodiments of the present invention are merely examples of the types of parameters to illustrate how the present invention converts the specifications of the preset electronic components into line electronic components and implements them in the package structure. In other embodiments, the design of various parameters may also be performed for other types of electronic components, and the present invention does not limit the types of parameters. It should be particularly noted that, in practical applications, the line type electronic component may also be constituted by a transmission line, such as an inductor, so the number of transmission lines in the present invention is merely an example.

In summary, the line type electronic component of the present invention uses the mold layer as a wiring space, and the present invention provides a three-dimensional electrical connection route through the mold layer compared to the conventional two-dimensional plane electrical connection route. In addition, the present invention can integrate the characteristics of the molding layer material, such as dielectric constant, dissipation factor, material of the connection point, such as solder, connection structure of the connecting section, such as through-molded perforation, Stacked conductive bumps and the like, the circuit type electronic components are designed and manufactured in the package structure, and the design of the package structure is more flexible; and the local line type electronic components are formed in the space of the vertical substrate area direction, The area occupied by the line type electronic components on the substrate is reduced, and the purpose of miniaturization is achieved.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

S101, S102, S103‧‧‧ steps

Claims (10)

A manufacturing method of a package structure having a line type electronic component, comprising: calculating a plurality of parameters required for a line type electronic component according to a specification of a predetermined electronic component; converting the parameters; according to the converted The parameter forms the package structure, the package structure includes at least a substrate, the line type electronic component and a mold layer; wherein the converting step refers at least to a dielectric constant of the mold layer. The manufacturing method of the package structure according to claim 1, wherein the converting step further comprises: fine-tuning the parameters by using a simulation software. The manufacturing method of the package structure of claim 1, wherein the step of forming the line type electronic component in the package structure further comprises: forming at least one transmission line, wherein at least one first connection segment of the transmission line is located Forming the mold layer on the substrate, the mold layer comprising at least one second connection segment of the transmission line; forming at least one third connection segment of the transmission line above the mold layer; wherein the first connection The segment, the second connecting segment and the third connecting segment are electrically connected to each other. The method for manufacturing a package structure according to claim 3, further comprising: forming at least one solder and a substrate on the mold layer; forming at least a fourth connection segment on the substrate, the At least one of the four connection segments is connected to the third connection segment through the solder; at least a fifth connection segment and a second molding layer are formed; and at least a sixth connection segment is formed above the second molding layer; The fifth connecting segments respectively connect the fourth connecting segments and the sixth connecting segments. A package structure having a line type electronic component, comprising: a substrate; a line type electronic component comprising at least one transmission line; a molding layer, the molding layer is located on the substrate, wherein the transmission line has at least a first connecting segment and at least a second connecting segment And at least a third connecting segment, the first connecting segment is located on the substrate and covered by the molding layer, the second connecting segment is located in the molding layer, and the third connecting segment is located on the molding layer, and The second connecting segment is connected to the first connecting segment and the third connecting segment; wherein the line type electronic component is designed according to a plurality of parameters according to a specification of a preset electronic component and referring to the sealing layer The dielectric constant and the electrical impedance of the transmission line are calculated such that the line electronic component conforms to the specifications of the predetermined electronic component. The package structure of claim 5, further comprising an electronic component, the electronic component being located on the substrate, and the molding layer covering the electronic component. The package structure of claim 5, wherein the package structure further comprises: a substrate on the mold layer, wherein the third connection segment is located on the mold layer and the substrate a second transmission line is disposed on the substrate, the second transmission line has at least a fourth connection segment, at least a fifth connection segment, and at least a sixth connection segment, the fourth connection segment is electrically connected to the third a second molding layer, the second molding layer is disposed on the substrate, and covers the fourth connecting segment and the fifth connecting segment, and the sixth connecting segment is on the second molding layer The fifth connecting segment connects the fourth connecting segment and the sixth connecting segment, wherein the transmission line and the second transmission line form a transmission path. The package structure of claim 7, wherein the second connection segment or the fifth connection segment is a through molding via (TMV) or a stacked stud bump. The package structure of claim 5, wherein the parameters include a length and a width of the transmission line. The package structure of claim 5, wherein the substrate comprises a printed circuit board, a semiconductor substrate or a low temperature co-fired multilayer ceramic substrate.