TW201533167A - Curable organopolysiloxane composition, member for transducers - Google Patents

Curable organopolysiloxane composition, member for transducers Download PDF

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TW201533167A
TW201533167A TW103145844A TW103145844A TW201533167A TW 201533167 A TW201533167 A TW 201533167A TW 103145844 A TW103145844 A TW 103145844A TW 103145844 A TW103145844 A TW 103145844A TW 201533167 A TW201533167 A TW 201533167A
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curable
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organopolyoxane
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Takuya Ogawa
Sawako INAGAKI
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Dow Corning Toray Co Ltd
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Abstract

To provide a curable organopolysiloxane composition having excellent mechanical characteristics and/or electrical characteristics, and particularly one capable of producing a silicone elastomer cured product capable of being used as a member for transducers. A curable organopolysiloxane composition comprising an organopolysiloxane and at least one type of inorganic microparticles having an average primary particle diameter of not less than 50 nm, wherein the mass fraction of monovalent aromatic hydrocarbon groups having from 6 to 10 carbons (Z) in the total of organopolysiloxanes is not less than 0.2% by mass and not greater than 50% by mass, and the mass fraction of straight-chain organopolysiloxanes having a certain chain length range and a group capable of a curing reaction (W) in the total of organopolysiloxanes is not less than 50% by mass.

Description

可固化之有機聚矽氧烷組合物,轉換器之構件 Curable organopolyoxane composition, component of converter

本發明係關於能夠有利地用於電及/或電子應用、尤其轉換器在之可固化之有機聚矽氧烷組合物。特定而言,本發明提供可固化之有機聚矽氧烷組合物,其藉由固化形成之有機聚矽氧烷固化產物可有利地用作電活性聚矽氧彈性體材料,該材料能夠用作轉換器之介電層或電極層。本發明尤其係關於可固化之有機聚矽氧烷組合物,其有機聚矽氧烷固化產物具有適於用作介電材料且更尤其而言適於用作轉換器之介電層之電特性及機械特性。本發明進一步係關於使用可固化之有機聚矽氧烷組合物形成之電活性聚合物材料之產生方法及含有此電活性聚合物材料之轉換器之構件。本申請案主張對2013年12月27日提出申請之日本專利申請案第2013-272971號之優先權,其內容以引用方式併入本文中。 The present invention relates to organopolyoxane compositions which can be advantageously used in electrical and/or electronic applications, in particular in which the converter is curable. In particular, the present invention provides a curable organopolyoxane composition which can be advantageously used as an electroactive polyoxyxene elastomer material by curing the formed organopolyoxane cured product, which material can be used as The dielectric layer or electrode layer of the converter. The invention relates in particular to a curable organopolyoxane composition having an organopolyoxyalkylene cured product having electrical properties suitable for use as a dielectric material and more particularly as a dielectric layer for a converter. And mechanical properties. The invention further relates to a method of producing an electroactive polymer material formed using a curable organopolyoxane composition and a member of a converter comprising the electroactive polymer material. The present application claims priority to Japanese Patent Application No. 2013-272971, filed on Dec. 27, 2013, which is hereby incorporated by reference.

A.G.Benjanariu等人指示,介電聚合物係用於人工肌肉之潛在材料(A.G.Benjanariu等人,「New elastomeric silicone based networks applicable as electroactive systems,」Proc.of SPIE SPIE第7976卷79762V-1至79762V-8(2011))。在此處,其展示使用加成可固化聚矽氧橡膠形成之具有單峰或雙峰網絡之材料的物理特性。為形成此聚矽氧橡膠,使用具有4個矽鍵結氫原子之短鏈有機氫矽氧烷作為交聯劑 來交聯具有乙烯基之直鏈聚(二甲基矽氧烷)(PDMS)聚合物。另外,在B.Kussmaul等人,Actuator 2012,第13屆新致動器國際會議,Bremen,Germany,2012年6月18-20日,第374至378頁中,提及一種致動器,其中將藉由使用交聯劑使用作電偶極之基團鍵結至聚二甲基矽氧烷來以化學方式改質之有機聚二甲基矽氧烷夾於電極之間作為介電彈性體致動器材料。 AGBenjanariu et al. indicate that dielectric polymers are potential materials for artificial muscles (AGBenjanariu et al., "New elastomeric silicone based networks applicable as electroactive systems," Proc. of SPIE SPIE No. 7976 Volume 79762V-1 to 79762V- 8 (2011)). Here, it shows the physical properties of a material having a unimodal or bimodal network formed using an addition curable polyoxyxene rubber. To form the polyoxyxene rubber, a short-chain organic hydroquinone having 4 hydrazine-bonded hydrogen atoms is used as a crosslinking agent. To crosslink a linear poly(dimethyloxane) (PDMS) polymer having a vinyl group. In addition, an actuator is mentioned in B. Kussmaul et al., Actuator 2012, 13th International Conference on New Actuators, Bremen, Germany, June 18-20, 2012, pages 374-378. The chemically modified organic polydimethyl methoxy hydride is sandwiched between the electrodes as a dielectric elastomer by using a crosslinking agent as a group of an electric dipole bonded to a polydimethyl siloxane. Actuator material.

然而,在上述任一參考文獻中並未揭示可固化之有機聚矽氧烷組合物之特定組成,且另外,在實踐中,可固化之有機聚矽氧烷組合物之物理性質對用於工業應用中各種類型轉換器之材料而言不足。因此,業內需要達成能夠滿足作為各種類型轉換器之材料之實際應用的機械特性與電特性之電活性聚合物材料。特定而言,業內非常需要固化並提供具有極佳物理特性之電活性聚合物材料之可固化之有機聚矽氧烷組合物。 However, the specific composition of the curable organopolyoxane composition is not disclosed in any of the above references, and additionally, in practice, the physical properties of the curable organopolyoxane composition are used in the industry. Insufficient materials for various types of converters in the application. Accordingly, there is a need in the art to achieve electroactive polymer materials that are capable of meeting the mechanical and electrical properties of the practical application of materials for various types of converters. In particular, there is a great need in the art for a curable organopolyoxane composition that cures and provides an electroactive polymer material having excellent physical properties.

另一方面,已眾所周知將無機微粒(例如導熱填充劑、螢光填充劑及增強填充劑)摻和於電及/或電子應用中之可固化之有機聚矽氧烷組合物中。舉例而言,專利文件1至3揭示具有含苯基矽氧烷之加成可固化有機聚矽氧烷且闡述可添加無機微粒。 On the other hand, it has been known to incorporate inorganic microparticles (e.g., thermally conductive fillers, fluorescent fillers, and reinforcing fillers) into curable organopolyoxane compositions for electrical and/or electronic applications. For example, Patent Documents 1 to 3 disclose an addition curable organopolyoxyalkylene having a phenyloxysiloxane and it is stated that inorganic fine particles can be added.

然而,該等加成可固化有機聚矽氧烷係缺乏橡膠彈性之密封劑,且並未闡述關於提供拉伸斷裂伸長率不小於200%之彈性體之可固化之有機聚矽氧烷組合物的任何內容。另外,該等文件並未闡述或建議向具有預定高芳族含量之可固化之矽氧烷基質提供橡膠彈性或添加無機微粒、尤其介電無機微粒。 However, the addition-curable organopolysiloxanes lack a rubber-elastic sealant, and do not clarify a curable organopolyoxane composition for providing an elastomer having a tensile elongation at break of not less than 200%. Any content. Additionally, these documents do not address or suggest providing rubber elasticity or the addition of inorganic particulates, especially dielectric inorganic particulates, to a curable oxyalkylene having a predetermined high aromatic content.

引文列表 Citation list 專利文獻 Patent literature

專利文件1:日本未審查專利申請公開案第2013-159670A號。 Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-159670A.

專利文件2:日本未審查專利申請公開案第2010-084118A號。 Patent Document 2: Japanese Unexamined Patent Application Publication No. 2010-084118A.

專利文獻3:日本未經審查專利公開申請案(PCT公開案之翻譯)第2012-507582A號 Patent Document 3: Japanese Unexamined Patent Publication Application (Translation of PCT Publication) No. 2012-507582A

非專利文獻 Non-patent literature

非專利文件1:「New elastomeric silicone based networks applicable as electroactive systems」,Proc.of SPIE第7976卷79762V-1至79762V-8(2011) Non-Patent Document 1: "New elastomeric silicone based networks applicable as electroactive systems", Proc. of SPIE No. 7976 Volume 79762V-1 to 79762V-8 (2011)

非專利文件2:Actuator 2012,第13屆新致動器國際會議,Bremen,Germany,2012年6月18-20日,第374至378頁 Non-Patent Document 2: Actuator 2012, 13th International Conference on New Actuators, Bremen, Germany, June 18-20, 2012, pp. 374-378

本發明解決了習用可固化之聚有機矽氧烷組合物之問題,且其目標係提供具有極佳機械特性及/或電特性且尤其能夠產生能夠用作轉換器之構件之聚矽氧彈性體固化產物之可固化之有機聚矽氧烷組合物。 The present invention solves the problems of conventional curable polyorganosiloxane compositions and aims to provide polyoxyxene elastomers having excellent mechanical and/or electrical properties and, in particular, capable of producing components that can be used as converters. A curable organopolyoxane composition of the cured product.

本發明之另一目標係提供可固化之有機聚矽氧烷組合物,其能夠藉由提供極佳機械特性及/或電特性、且尤其提供高比介電常數、高介電崩潰強度及低楊氏模數(Young's modulus)來實現高能量密度;能夠在用作轉換器之介電層時因極佳機械強度(亦即拉伸強度、撕裂強度、伸長率及諸如此類)而達成耐久性及實際位移量;且能夠製造能夠用作轉換器用材料之固化產物。另外,可將各種類型之填充劑(包含已經表面處理之填充劑)與本發明之可固化之有機聚矽氧烷組合物摻和以獲得期望電特性,且本發明之可固化之有機聚矽氧烷組合物可包括脫模添加劑以防止在模製成薄片時斷裂,且亦可包括用於改良介電崩潰特性之添加劑。 Another object of the present invention is to provide a curable organopolyoxane composition capable of providing high specific dielectric constant, high dielectric breakdown strength and low by providing excellent mechanical and/or electrical properties. Young's modulus to achieve high energy density; ability to achieve durability due to excellent mechanical strength (ie tensile strength, tear strength, elongation, and the like) when used as a dielectric layer for a converter And the actual amount of displacement; and it is possible to manufacture a cured product which can be used as a material for a converter. In addition, various types of fillers (including fillers that have been surface treated) can be blended with the curable organopolyoxane compositions of the present invention to achieve desired electrical properties, and the curable organic polyfluorenes of the present invention The oxyalkylene composition may include a release additive to prevent breakage upon molding into a sheet, and may also include an additive for improving dielectric breakdown characteristics.

本發明之其他目標係提供可固化之有機聚矽氧烷組合物之產生方法,提供能夠用作轉換器用電活性聚合物材料之可固化聚矽氧彈性 體材料,提供此一可固化聚矽氧彈性體材料之產生方法,及提供使用可固化聚矽氧彈性體材料之各種類型之轉換器。 Another object of the present invention is to provide a process for the production of a curable organopolyoxane composition, which provides a curable polyoxoelastic which can be used as an electroactive polymer material for a converter. The bulk material provides a method of producing the curable polyoxyxene elastomer material and provides various types of converters using the curable polyoxyxide elastomer material.

藉由以下物質來達成本發明目標:可固化之有機聚矽氧烷組合物,其包括由下式(I)代表之有機聚矽氧烷:Ra aRb bSiO(4-a-b)/2 (I) The object of the present invention is attained by a curable organopolyoxane composition comprising an organopolyoxane represented by the following formula (I): R a a R b b SiO (4-ab)/ 2 (I)

(其中Ra係具有6至10個碳之單價芳族烴基團,且Rb係至少一種類型之單價官能基(然而,Rb係除具有6至10個碳之單價芳族烴基團外之基團),其中Rb之至少一部分係能夠進行固化反應之基團,且0<a、0<b、1.9<a+b<2.1,且一或多個類型之無機微粒,其具有不小於50nm之平均初級顆粒直徑,其中,全部有機聚矽氧烷中具有6至10個碳之單價芳族烴基團之質量分數(Z)不小於0.2質量%且不大於50質量%,且全部有機聚矽氧烷中由下式(II)代表之直鏈有機聚矽氧烷之質量分數(W)不小於50質量%:R1R2 2Si(OSiR3R4)n(OsiR3R1)mOsiR1R2 2 (II) (wherein R a is a monovalent aromatic hydrocarbon group having 6 to 10 carbons, and R b is at least one type of monovalent functional group (however, R b is in addition to a monovalent aromatic hydrocarbon group having 6 to 10 carbons) a group), wherein at least a portion of R b is a group capable of undergoing a curing reaction, and 0 < a, 0 < b, 1.9 < a + b < 2.1, and one or more types of inorganic fine particles having a diameter of not less than An average primary particle diameter of 50 nm, wherein the mass fraction (Z) of the monovalent aromatic hydrocarbon group having 6 to 10 carbons in all the organopolysiloxanes is not less than 0.2% by mass and not more than 50% by mass, and all of the organic polymerization The mass fraction (W) of the linear organopolyoxane represented by the following formula (II) in the oxane is not less than 50% by mass: R 1 R 2 2 Si(OSiR 3 R 4 ) n (OsiR 3 R 1 ) m OsiR 1 R 2 2 (II)

(其中R1係能夠進行固化反應之基團,R2、R3及R4各自獨立地、相同或不同地代表氫原子、具有1至10個碳之單價脂肪族烴基團及具有6至10個碳之單價芳族烴基團;n及m係分別滿足條件200<n及0=<m=<(n/20)之數值)。 (wherein R 1 is a group capable of undergoing a curing reaction, and R 2 , R 3 and R 4 each independently, identically or differently represent a hydrogen atom, a monovalent aliphatic hydrocarbon group having 1 to 10 carbons, and have 6 to 10 The monovalent aromatic hydrocarbon group of carbon; the n and m systems respectively satisfy the values of the conditions 200 < n and 0 = < m = < (n / 20).

在此處,單價芳族烴基團之質量分數(Z)較佳地不小於0.5質量%且不大於30質量%。另外,直鏈有機聚矽氧烷之質量分數(W)較佳地 不小於75.0質量%且不大於99.9質量%。另外,可固化之有機聚矽氧烷組合物更佳地同時具有「Z」及「W」之該等較佳態樣。另外,具有6至10個碳之單價芳族烴基團較佳係苯基。另外,一或多個類型之平均初級顆粒直徑不小於50nm之無機微粒較佳地包含在1kHz及室溫下比介電常數不小於10之介電無機微粒,且更佳地藉由一或多個類型之表面處理劑對部分或所有無機微粒實施表面處理。 Here, the mass fraction (Z) of the monovalent aromatic hydrocarbon group is preferably not less than 0.5% by mass and not more than 30% by mass. In addition, the mass fraction (W) of the linear organopolyoxane is preferably Not less than 75.0% by mass and not more than 99.9% by mass. Further, the curable organopolyoxane composition preferably has such preferred embodiments of "Z" and "W" at the same time. Further, the monovalent aromatic hydrocarbon group having 6 to 10 carbons is preferably a phenyl group. Further, one or more types of inorganic fine particles having an average primary particle diameter of not less than 50 nm preferably comprise dielectric inorganic fine particles having a specific dielectric constant of not less than 10 at 1 kHz and at room temperature, and more preferably by one or more Each type of surface treatment agent performs a surface treatment on some or all of the inorganic particles.

本發明之可固化之有機聚矽氧烷組合物之固化機制並無特定限制,但能夠進行固化反應之基團可為能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團,且較佳係能夠進行由矽氫化反應代表之加成固化反應之基團(尤其係矽鍵結不飽和烴基團(例如烯基)或矽原子鍵結氫原子)。有利於實現較佳機械特性及/或電特性之其他組成特徵將闡述於後文中。 The curing mechanism of the curable organopolyoxane composition of the present invention is not particularly limited, but the group capable of performing the curing reaction may be a curing reaction capable of undergoing a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction reaction. The group, and preferably, is capable of undergoing an addition curing reaction group represented by a hydrogenation reaction (particularly, a hydrazine-bonded unsaturated hydrocarbon group (for example, an alkenyl group) or a hydrazine atom-bonded hydrogen atom). Other constituent features that are advantageous for achieving better mechanical and/or electrical properties are set forth below.

藉由本發明,可產生具有極佳機械特性及/或電特性且尤其能夠用作轉換器之構件之聚矽氧彈性體固化產物。 By the present invention, a polyoxyxene elastomer cured product having excellent mechanical and/or electrical properties and particularly capable of being used as a member of a converter can be produced.

另外,本發明可提供一種可固化之有機聚矽氧烷組合物,在用作轉換器之介電層時,可藉由極佳機械特性及/或電特性(尤其因高比介電常數、高介電崩潰強度及低楊氏模數達成之高能量密度)及極佳機械強度(具體而言,拉伸強度、撕裂強度、伸長率及諸如此類))來達成耐久性及實際位移;因此,可固化之有機聚矽氧烷組合物可產生能夠用作轉換器用材料之固化產物。 In addition, the present invention can provide a curable organopolyoxane composition which, when used as a dielectric layer of a converter, can have excellent mechanical properties and/or electrical properties (especially due to high specific dielectric constant, High dielectric breakdown strength and low energy density achieved by low Young's modulus) and excellent mechanical strength (specifically, tensile strength, tear strength, elongation, and the like) to achieve durability and actual displacement; The curable organopolyoxane composition produces a cured product that can be used as a material for the converter.

本發明亦可提供可固化之有機聚矽氧烷組合物之產生方法;能夠用作轉換器用電活性聚合物材料之可固化聚矽氧彈性體材料;此一可固化聚矽氧彈性體材料之產生方法;及使用可固化聚矽氧彈性體材料之各種類型之轉換器。 The invention can also provide a method for producing a curable organopolyoxane composition; a curable polyoxyxene elastomer material capable of being used as an electroactive polymer material for a converter; the curable polyoxyxene elastomer material a method of producing; and various types of converters using a curable polyoxyxene elastomer material.

1‧‧‧致動器 1‧‧‧Actuator

2‧‧‧致動器 2‧‧‧Actuator

3‧‧‧感測器 3‧‧‧Sensor

4‧‧‧發電元件 4‧‧‧Power generation components

10a‧‧‧介電層 10a‧‧‧ dielectric layer

10b‧‧‧介電層 10b‧‧‧ dielectric layer

11a‧‧‧電極層(導電層) 11a‧‧‧electrode layer (conducting layer)

11b‧‧‧電極層(導電層) 11b‧‧‧electrode layer (conducting layer)

12‧‧‧導線 12‧‧‧ wire

13‧‧‧電源 13‧‧‧Power supply

20a‧‧‧介電層 20a‧‧‧ dielectric layer

20b‧‧‧介電層 20b‧‧‧ dielectric layer

20c‧‧‧介電層 20c‧‧‧ dielectric layer

21a‧‧‧電極層(導電層) 21a‧‧‧Electrode layer (conducting layer)

21b‧‧‧電極層(導電層) 21b‧‧‧Electrode layer (conductive layer)

21c‧‧‧電極層(導電層) 21c‧‧‧electrode layer (conducting layer)

21d‧‧‧電極層(導電層) 21d‧‧‧electrode layer (conductive layer)

22‧‧‧導線 22‧‧‧Wire

23‧‧‧電源 23‧‧‧Power supply

30‧‧‧介電層 30‧‧‧Dielectric layer

31a‧‧‧上部電極層 31a‧‧‧Upper electrode layer

31b‧‧‧上部電極層 31b‧‧‧Upper electrode layer

31c‧‧‧上部電極層 31c‧‧‧ upper electrode layer

32a‧‧‧下部電極層 32a‧‧‧lower electrode layer

32b‧‧‧下部電極層 32b‧‧‧lower electrode layer

32c‧‧‧下部電極層 32c‧‧‧lower electrode layer

40a‧‧‧介電層 40a‧‧‧ dielectric layer

40b‧‧‧介電層 40b‧‧‧ dielectric layer

41a‧‧‧電極層 41a‧‧‧electrode layer

41b‧‧‧電極層 41b‧‧‧electrode layer

[圖1]圖1圖解說明堆疊介電層之本發明之致動器1之剖面圖。 [Fig. 1] Fig. 1 illustrates a cross-sectional view of an actuator 1 of the present invention in which a dielectric layer is stacked.

[圖2]圖2圖解說明堆疊介電層及電極層之本發明之致動器2之剖面圖。 2] Fig. 2 illustrates a cross-sectional view of an actuator 2 of the present invention in which a dielectric layer and an electrode layer are stacked.

[圖3]圖3圖解說明本發明之感測器3之構形。 Fig. 3 illustrates the configuration of the sensor 3 of the present invention.

[圖4]圖4展示堆疊介電層之本發明之發電元件4之剖面圖。 Fig. 4 shows a cross-sectional view of a power generating element 4 of the present invention in which a dielectric layer is stacked.

藉由努力探究,本發明者發現,藉由可固化之有機聚矽氧烷組合物來獲得具有極佳機械特性及/或電特性之聚矽氧彈性體固化產物,該可固化之有機聚矽氧烷組合物包括:由下式(I)代表之有機聚矽氧烷:Ra aRb bSiO(4-a-b)/2 (I) By diligently exploring, the inventors have found that a curable organopolysiloxane cured product having excellent mechanical properties and/or electrical properties is obtained by a curable organopolyoxane composition. The oxyalkylene composition comprises: an organopolyoxane represented by the following formula (I): R a a R b b SiO (4-ab)/2 (I)

其中,Ra係具有6至10個碳之單價芳族烴基團,且Rb係至少一種類型之單價官能基(然而,Rb係除具有6至10個碳之單價芳族烴基團外之基團),其中Rb之至少一部分係能夠進行固化反應之基團,且0<a、0<b、1.9<a+b<2.1;且一或多個類型之無機微粒,其具有不小於50nm之平均初級顆粒直徑,其中全部有機聚矽氧烷中具有6至10個碳之單價芳族烴基團之質量分數(Z)不小於0.2質量%且不大於50質量%,且全部有機聚矽氧烷中由下式(II)代表之直鏈有機聚矽氧烷之質量分數(W)不小於50質量%:R1R2 2Si(OSiR3R4)n(OSiR3R1)mOSiR1R2 2 (II) Wherein R a is a monovalent aromatic hydrocarbon group having 6 to 10 carbons, and R b is at least one type of monovalent functional group (however, R b is in addition to a monovalent aromatic hydrocarbon group having 6 to 10 carbons) a group), wherein at least a portion of R b is a group capable of undergoing a curing reaction, and 0 < a, 0 < b, 1.9 < a + b <2.1; and one or more types of inorganic fine particles having a diameter of not less than An average primary particle diameter of 50 nm, wherein the mass fraction (Z) of the monovalent aromatic hydrocarbon group having 6 to 10 carbons in all the organopolysiloxanes is not less than 0.2% by mass and not more than 50% by mass, and all of the organic polyfluorene The mass fraction (W) of the linear organopolyoxane represented by the following formula (II) in the oxane is not less than 50% by mass: R 1 R 2 2 Si(OSiR 3 R 4 ) n (OSiR 3 R 1 ) m OSiR 1 R 2 2 (II)

其中,R1係能夠進行固化反應之基團,R2、R3及R4各自獨立地、相同或不同地代表氫原子、具有1至10個碳之單價脂肪族烴基團及具 有6至10個碳之單價芳族烴基團;n及m係分別滿足條件200<n及0=<m=<(n/20)之數值。因此,本發明者已完成本發明。 Wherein R 1 is a group capable of undergoing a curing reaction, and R 2 , R 3 and R 4 each independently represent, independently or differently represent a hydrogen atom, a monovalent aliphatic hydrocarbon group having 1 to 10 carbons, and have 6 to 10 The monovalent aromatic hydrocarbon group of carbon; the n and m systems respectively satisfy the values of the conditions 200 < n and 0 = < m = < (n / 20). Accordingly, the inventors have completed the present invention.

<有機聚矽氧烷> <Organic polyoxane>

本發明中所使用由通式(I):Ra aRb bSiO(4-a-b)/2代表之有機聚矽氧烷含有一種或複數種有機聚矽氧烷,其整體具有可固化性,且含有具有6至10個碳之單價芳族烴(相對於全部有機聚矽氧烷,其質量分數(Z)不小於0.2質量%且不大於50質量%),且相對於全部有機聚矽氧烷由上式(II)代表之直鏈有機聚矽氧烷之質量分數(W)不小於50質量%。另外,因單價芳族烴Ra係必選取代基,故a>0,且更具體而言,a值必須為使得相對於全部有機聚矽氧烷具有6至10個碳之單價芳族烴之質量分數(Z)不小於0.2質量%且不大於50質量%之範圍內的數值。在此處,含有具有6至10個碳之單價芳族烴之有機聚矽氧烷可與由上式(II)代表之直鏈有機聚矽氧烷相同或不同,但由上式(I)代表之有機聚矽氧烷較佳地含有複數種可固化之有機聚矽氧烷,在該情形下,單價芳族烴之質量分數(Z)滿足相對於全部有機聚矽氧烷之上述範圍,且相對於全部有機聚矽氧烷由上式(II)代表之直鏈有機聚矽氧烷之質量分數(W)不小於50質量%。假設全部有機聚矽氧烷中單價芳族烴之質量分數(Z)滿足上述範圍,則具有6至10個碳之單價芳族烴可含於構成有機聚矽氧烷之任一可固化或不可固化之有機聚矽氧烷中。 The organopolyoxane represented by the general formula (I): R a a R b b SiO (4-ab)/2 used in the present invention contains one or more kinds of organopolysiloxanes, and the whole has curability. And containing a monovalent aromatic hydrocarbon having 6 to 10 carbons (the mass fraction (Z) is not less than 0.2% by mass and not more than 50% by mass relative to all of the organopolysiloxane), and relative to all the organic polyfluorene The mass fraction (W) of the linear organopolyoxane represented by the above formula (II) is not less than 50% by mass. In addition, since the monovalent aromatic hydrocarbon Ra is a mandatory substituent, a>0, and more specifically, the a value must be a monovalent aromatic hydrocarbon having 6 to 10 carbons relative to the total organopolysiloxane. The mass fraction (Z) is not less than 0.2% by mass and not more than 50% by mass. Here, the organopolyoxane containing a monovalent aromatic hydrocarbon having 6 to 10 carbons may be the same as or different from the linear organopolyoxane represented by the above formula (II), but is given by the above formula (I) The organic polyoxoxane represented preferably contains a plurality of curable organopolyoxyalkylenes, in which case the mass fraction (Z) of the monovalent aromatic hydrocarbons satisfies the above range relative to the total organopolyoxane. And the mass fraction (W) of the linear organopolyoxane represented by the above formula (II) with respect to all the organopolyoxyalkylene is not less than 50% by mass. Assuming that the mass fraction (Z) of the monovalent aromatic hydrocarbon in all of the organopolysiloxanes satisfies the above range, the monovalent aromatic hydrocarbon having 6 to 10 carbons may be contained in any of the organic polyoxanes which may be cured or not. Cured in organic polyoxane.

首先,闡述具有6至10個碳之單價芳族烴基團Ra。此單價芳族烴基團例示為苯基、萘基、經取代苯基及經取代萘基,且具體實例包含苯基、萘基、鄰甲苯基、間甲苯基、對甲苯基、二甲苯基、乙基苯基及諸如此類。另一方面,儘管經芳族烴基團取代之脂肪族烴基團(亦即芳基烷基)嚴格而言並非芳族烴基團,但其亦視為本發明中之單價芳族烴基團。該等基團例示為苄基、苯乙基及諸如此類。在該等基團中,自經濟學及工業生產力之角度考慮,苯基較佳。 First, a monovalent aromatic hydrocarbon group R a having 6 to 10 carbons is illustrated. The monovalent aromatic hydrocarbon group is exemplified by a phenyl group, a naphthyl group, a substituted phenyl group, and a substituted naphthyl group, and specific examples include a phenyl group, a naphthyl group, an o-tolyl group, a m-tolyl group, a p-tolyl group, a xylyl group, Ethyl phenyl and the like. On the other hand, although the aliphatic hydrocarbon group substituted by the aromatic hydrocarbon group (i.e., arylalkyl group) is not strictly an aromatic hydrocarbon group, it is also considered to be a monovalent aromatic hydrocarbon group in the present invention. Such groups are exemplified by benzyl, phenethyl and the like. Among these groups, phenyl is preferred from the viewpoint of economics and industrial productivity.

單價芳族烴基團之含量(相對於可固化之有機聚矽氧烷組合物中之全部有機矽氧烷組份之質量分數:Z)不小於0.2質量%且不大於50質量%。若Z小於0.2質量%,則介電崩潰強度改良效應不能充分展現於所獲得固化產物中,而另一方面,若其超過50質量%,則所獲得固化產物之彈性模數過高且模製產物因過脆而不適當。Z之較佳範圍為不小於0.5質量%且不大於30質量%,且更佳範圍為不小於0.5質量%且不大於10質量%。 The content of the monovalent aromatic hydrocarbon group (relative to the mass fraction of all the organic decane components in the curable organopolyoxane composition: Z) is not less than 0.2% by mass and not more than 50% by mass. If Z is less than 0.2% by mass, the dielectric breakdown strength improving effect cannot be sufficiently exhibited in the obtained cured product, and on the other hand, if it exceeds 50% by mass, the obtained cured product has an excessively high modulus of elasticity and molded. The product is not brittle due to being too brittle. A preferred range of Z is not less than 0.5% by mass and not more than 30% by mass, and more preferably not less than 0.5% by mass and not more than 10% by mass.

該等單價芳族烴基團含於構成部分或所有有機矽氧烷組份之含有單價芳族烴基團之有機聚矽氧烷中。該等含有單價芳族烴基團之有機聚矽氧烷例示為在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/二苯基矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/二苯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二苯基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二苯基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之甲基苯基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之甲基苯基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經甲基苯基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經甲基苯基乙烯基矽氧基封端之聚二苯基矽氧烷及諸如此類。 The monovalent aromatic hydrocarbon groups are contained in an organopolyoxane containing a monovalent aromatic hydrocarbon group constituting part or all of the organic decane component. The organopolyoxyalkylene group containing a monovalent aromatic hydrocarbon group is exemplified by a dimethyl methoxy oxyalkylene/methyl phenyl siloxane copolymer terminated with a dimethylvinyl methoxy group at two molecular terminals. a dimethyl methoxy alkane/methylvinyl fluorene/methyl phenyl siloxane copolymer terminated with dimethylvinyl methoxy at the end of two molecules, at the end of two molecules via dimethyl a vinyl methoxy-terminated polymethylphenyl siloxane, a dimethyl methoxy oxane/diphenyl siloxane copolymer terminated with a dimethylvinyl methoxy group at the end of two molecules a dimethyl methoxy oxane/methylphenyl decane copolymer terminated with dimethylhydroquinone at the end of two molecules, terminated with dimethylhydroquinone at the end of two molecules Polymethylphenyl sulfoxane, a dimethyl methoxy oxane/diphenyl decane copolymer terminated with dimethylhydroquinone at the end of two molecules, and a trimethyl group at the end of two molecules a nonyloxy-terminated diphenyloxane/methylvinylaluminoxane copolymer, a diphenylphosphonium/methylhydroquinone terminated by a trimethylmethoxy group at two molecular ends Alkane copolymerization a methylphenyl siloxane/methylvinyl decane copolymer terminated with a trimethyl methoxy group at the end of two molecules, and a terminal terminated by a trimethyl methoxy group at two molecular ends a phenyl phenyl oxane/methylhydroquinoxane copolymer, a polymethylphenyl siloxane having a methyl phenylvinyloxy group terminated at the end of two molecules, at the end of two molecules Phenyl phenyl vinyl oxy-terminated polydiphenyl siloxane and the like.

本發明中所使用由通式(I):Ra aRb bSiO(4-a-b)/2代表之有機聚矽氧烷 整體具有可固化性,且在式(I)中,Rb係至少一種類型之單價官能基(然而,Rb係除具有6至10個碳之單價芳族烴基團外之基團),且Rb之至少一部分具有能夠進行固化反應之基團。在此處,取代基Rb可為一種類型或兩種或更多種類型之官能基,前提係至少一部分該取代基係能夠進行固化反應之基團且取代基Rb並非Ra,且取代基Rb之一部分較佳係能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之反應性基團。 The organopolyoxane represented by the general formula (I): R a a R b b SiO (4-ab)/2 used in the present invention has curability as a whole, and in the formula (I), the R b system At least one type of monovalent functional group (however, R b is a group other than a monovalent aromatic hydrocarbon group having 6 to 10 carbons), and at least a portion of R b has a group capable of undergoing a curing reaction. Here, the substituents R b may be one type or two or more types of functional group, provided at least a part of the system-based substituent group capable of curing reaction and is not a substituent R b R a, and a substituted A part of the group R b is preferably a reactive group capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction.

另外,取代基Rb之一部分尤佳係非反應性官能基。另外,作為取代基Rb之一部分之能夠進行固化反應之反應性基團可為一種類型或兩種或更多種類型的反應性基團(例如加成反應性官能基及光反應性官能基之組合)。 Further, a part of the substituent R b is particularly preferably a non-reactive functional group. Further, the reactive group capable of undergoing a curing reaction as a part of the substituent R b may be one type or two or more types of reactive groups (for example, an addition reactive functional group and a photoreactive functional group) Combination).

作為非反應性基團之取代基Rb之具體例示為烷基,例如甲基、乙基、丙基、丁基、己基及諸如此類。自經濟學之角度考慮,甲基較佳。 Specific examples of the substituent R b as a non-reactive group are an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, and the like. From the perspective of economics, the methyl group is preferred.

作為反應性基團之取代基Rb係能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之反應性基團。尤佳地,Rb之一部分係能夠藉由加成反應進行固化之反應性基團。能夠進行加成反應之反應性基團之實例包含:苯乙烯基、(甲基)丙烯酸基團、乙烯基醚基團及諸如此類,其係加成可聚合官能基;含有硫醇基團之有機基團(其係硫醇-烯反應活性基團)及烯基之組合;含有BH基團之有機基團(其係硼氫化反應活性基團)及烯基之組合;含有矽原子鍵結氫原子之有機基團(其係矽氫化反應活性基團)及烯基之組合;含有二烯基團之有機基團(其係狄爾斯-阿爾德反應(Diels-Alder reaction)活性基團)及烯基之組合;及諸如此類。在組合該等兩種類型之反應性基團時,尤佳地組合使用具有僅一類反應性基團之化合物及具有另一類反應性基團之化合物。 The substituent R b as a reactive group is a reactive group capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction. More preferably, a portion of R b is a reactive group capable of being cured by an addition reaction. Examples of reactive groups capable of undergoing an addition reaction include: a styryl group, a (meth)acrylic group, a vinyl ether group, and the like, which are addition polymerizable functional groups; organic groups containing thiol groups a group (which is a thiol-ene reactive group) and a combination of alkenyl groups; a BH group-containing organic group (which is a hydroboration reactive group) and a combination of alkenyl groups; a combination of an organic group of an atom (which is a hydrogenation-reactive group) and an alkenyl group; an organic group containing a diene group (which is a Diels-Alder reaction active group) And combinations of alkenyl groups; and the like. When combining the two types of reactive groups, it is especially preferred to use a compound having only one type of reactive group and a compound having another type of reactive group.

其他能夠進行固化反應之反應性基團例示為羥基及具有1至4個碳之烷氧基、具體而言甲氧基、乙氧基、丙氧基及諸如此類,但並不限於此。 Other reactive groups capable of undergoing a curing reaction are exemplified by a hydroxyl group and an alkoxy group having 1 to 4 carbons, specifically, a methoxy group, an ethoxy group, a propoxy group, and the like, but are not limited thereto.

本發明中所使用由通式(I):Ra aRb bSiO(4-a-b)/2代表之有機聚矽氧烷整體較佳係藉由加成反應可固化之有機聚矽氧烷,且上述能夠進行固化反應之基團較佳係能夠進行加成反應之基團。能夠進行加成反應之基團如上所述。 The organopolyoxane represented by the general formula (I): R a a R b b SiO (4-ab)/2 used in the present invention is preferably an organic polyoxyalkylene which is curable by an addition reaction. Further, the group capable of undergoing the curing reaction is preferably a group capable of undergoing an addition reaction. The group capable of undergoing the addition reaction is as described above.

特定而言,式(I)中之Rb係選自由以下組成之群之基團:具有1至10個碳之視情況經取代之單價烴基團(然而,Rb係除具有6至10個碳之單價芳族烴基團外之基團)、氫原子、具有2至8個碳之烯基、具有1至4個碳之烷氧基及羥基,且Rb之至少一部分較佳係能夠進行加成反應之選自由以下組成之群的基團:氫原子及具有2至8個碳之烯基。 In particular, R b in formula (I) is selected from the group consisting of: optionally substituted monovalent hydrocarbon groups having from 1 to 10 carbons (however, R b is in addition to from 6 to 10 a group other than the monovalent aromatic hydrocarbon group of carbon), a hydrogen atom, an alkenyl group having 2 to 8 carbons, an alkoxy group having 1 to 4 carbons, and a hydroxyl group, and at least a part of R b is preferably capable of proceeding The addition reaction is selected from the group consisting of a hydrogen atom and an alkenyl group having 2 to 8 carbons.

在該等基團中,考慮到高反應速率及低副反應,Rb之至少一部分較佳係矽氫化反應活性基團,亦即矽原子鍵結氫原子及烯基。在此處,自經濟學之角度考慮,乙烯基作為烯基係較佳的。 In such groups, in view of the high reaction rate and low side reactions, at least a portion of R b is preferably a hydrogenation reactive group, that is, a halogen atom bonded to a hydrogen atom and an alkenyl group. Here, from the viewpoint of economics, a vinyl group is preferred as an alkenyl group.

在本發明中所使用由通式(I):Ra aRb bSiO(4-a-b)/2代表之有機聚矽氧烷中,整體而言,矽原子上取代基之比例(矽原子上總取代基數相對於矽原子之質量分數;a+b)在1.9<a+b<2.1範圍內。若取代基之比例在此範圍之外,則所獲得固化產物之聚矽氧彈性體之機械特性(尤其拉伸斷裂伸長率及彈性模數)不足,且不適當。另外,因1.9<a+b<2.1,故意指本發明中所使用之有機聚矽氧烷整體含有具有二有機矽氧烷單元之諸多鏈聚矽氧烷結構。 In the organopolyoxane represented by the general formula (I): R a a R b b SiO (4-ab)/2 , as used in the present invention, the ratio of the substituent on the ruthenium atom as a whole (矽 atom) The total number of substituents relative to the mass fraction of the ruthenium atom; a + b) is in the range of 1.9 < a + b < 2.1. If the ratio of the substituent is outside this range, the mechanical properties (especially tensile elongation at break and modulus of elasticity) of the obtained polyoxyxene elastomer of the cured product are insufficient and are not appropriate. Further, since 1.9 < a + b < 2.1, it is meant that the organopolysiloxane used in the present invention as a whole contains a plurality of chain polyoxyalkylene structures having diorganosiloxane units.

本發明中所使用由通式(I):Ra aRb bSiO(4-a-b)/2代表之有機聚矽氧烷亦以不小於50質量%之量含有由下式(II)代表之直鏈有機聚矽氧烷。該等直鏈有機聚矽氧烷之含量不小於50質量%。若該含量在此範圍之外,則作為固化產物之聚矽氧彈性體之機械特性(尤其斷裂伸長率)不 能達到滿意範圍。較佳拉伸斷裂特性係拉伸斷裂伸長率不小於200%,如根據JIS K 6249所量測,且用於實現此特性之直鏈有機聚矽氧烷之較佳含量在不小於70質量%且不大於99.9質量%範圍內。 The organopolyoxane represented by the formula (I): R a a R b b SiO (4-ab)/2 used in the present invention is also represented by the following formula (II) in an amount of not less than 50% by mass. Straight chain organic polyoxane. The content of the linear organopolyoxane is not less than 50% by mass. If the content is outside this range, the mechanical properties (especially the elongation at break) of the polyoxyxene elastomer as a cured product cannot reach a satisfactory range. The tensile elongation at break is preferably not less than 200%, as measured according to JIS K 6249, and the preferred content of the linear organopolyoxane for achieving this property is not less than 70% by mass. And not more than 99.9 mass%.

R1R2 2Si(OSiR3R4)n(OSiR3R1)mOSiR1R2 2 (II) R 1 R 2 2 Si(OSiR 3 R 4 ) n (OSiR 3 R 1 ) m OSiR 1 R 2 2 (II)

(在該式中,R1係能夠進行固化反應之基團,R2、R3及R4各自獨立地、相同或不同地代表具有1至10個碳之單價脂肪族烴基團及具有6至10個碳之單價芳族烴基團;n及m係滿足條件200<n及0=<m=<(n/20)之數值)。 (In the formula, R 1 is a group capable of undergoing a curing reaction, and R 2 , R 3 and R 4 each independently, identically or differently represent a monovalent aliphatic hydrocarbon group having 1 to 10 carbons and have 6 to A monovalent aromatic hydrocarbon group of 10 carbons; n and m systems satisfy the values of the conditions 200 < n and 0 = < m = < (n / 20).

在式(II)中,R1係能夠進行固化反應之基團,且可為與Rb之反應性基團相同之基團,但出於上述原因,能夠進行加成反應之反應性基團較佳。特定而言,其較佳係矽氫化反應活性基團,亦即矽原子鍵結氫原子或乙烯基。R2、R3及R4各自獨立地、相同或不同地係具有1至10個碳之單價脂肪族烴基團及具有6至10個碳之單價芳族烴基團,且例示為甲基、乙基、丙基、丁基、己基、苯基、萘基、經取代苯基、經取代萘基、苄基、苯乙基及諸如此類,但自經濟學之角度考慮,甲基及苯基較佳。另外,無需贅言,由式(II)代表之直鏈有機聚矽氧烷中之單價芳族烴基團亦以單價芳族烴基團之質量分數(Z)包含於由式(I)代表的有機聚矽氧烷中。 In the formula (II), R 1 is a group capable of undergoing a curing reaction, and may be the same group as the reactive group of R b , but for the above reasons, a reactive group capable of undergoing an addition reaction Preferably. In particular, it is preferably a hydrogenation reactive group, that is, a ruthenium atom-bonded hydrogen atom or a vinyl group. R 2 , R 3 and R 4 are each independently, identically or differently a monovalent aliphatic hydrocarbon group having 1 to 10 carbons and a monovalent aromatic hydrocarbon group having 6 to 10 carbons, and are exemplified as methyl group and B group. Base, propyl, butyl, hexyl, phenyl, naphthyl, substituted phenyl, substituted naphthyl, benzyl, phenethyl and the like, but from the economic point of view, methyl and phenyl are preferred . Further, it is needless to say that the monovalent aromatic hydrocarbon group in the linear organopolyoxane represented by the formula (II) is also included in the organic poly group represented by the formula (I) by the mass fraction (Z) of the monovalent aromatic hydrocarbon group. In the oxime.

在式(II)中,n係超過200之數值。若其係不大於200之數值,則所獲得固化產物之機械特性(尤其斷裂伸長率)較低,且由此不適用於本發明中。考慮到模製處理性,不大於20,000之數值較佳。另一方面,m值並無不同上限,但類似於上文考慮到所獲得固化產物之斷裂伸長率其必須係不大於(n/20)之值。另外,此條件與針對本發明問題之源於以下事實之有利改良密切相關:下文所闡述可固化之有機聚矽氧烷組合物中之全部矽氧烷組份皆滿足指定組成特徵。 In formula (II), n is a value exceeding 200. If it is not more than 200, the mechanical properties (especially elongation at break) of the obtained cured product are low, and thus are not suitable for use in the present invention. A value of not more than 20,000 is preferable in view of molding processability. On the other hand, there is no upper limit to the value of m, but similarly to the above, considering the elongation at break of the obtained cured product, it must be not more than (n/20). Additionally, this condition is closely related to the advantageous improvement of the present invention due to the fact that all of the decane components of the curable organopolyoxane composition described below satisfy the specified compositional characteristics.

構成本發明中所使用可固化之有機聚矽氧烷組合物之反應性有 機聚矽氧烷之具體實例包含在兩個分子末端經二甲基乙烯基矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/二苯基矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/二苯基矽氧烷共聚物、在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之聚甲基乙烯基矽氧烷、在兩個分子末端經三甲基矽氧基封端之聚甲基氫矽氧烷、在兩個分子末端經三甲基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二苯基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二苯基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之甲基苯基矽氧烷/甲基乙烯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之甲基苯基矽氧烷/甲基氫矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷/甲基苯基矽氧烷共聚物、在兩個分子末端經三甲基矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷/甲基苯基矽氧烷共聚物、 二甲基氫功能MQ樹脂、二甲基乙烯基功能MQ樹脂、在兩個分子末端經二苯基乙烯基矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經二苯基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二苯基乙烯基矽氧基封端之聚二苯基矽氧烷、在兩個分子末端經甲基苯基乙烯基矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經甲基苯基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經甲基苯基乙烯基矽氧基封端之聚二苯基矽氧烷、含有二甲基乙烯基矽氧基((CH3)2(CH2=CH)SiO1/2)及苯基矽氧基(C6H5SiO3/2)之共聚物、含有二甲基氫矽氧基((CH3)2HSiO1/2)及苯基矽氧基(C6H5SiO3/2)之共聚物、含有二甲基乙烯基矽氧基((CH3)2(CH2=CH)SiO1/2)、二甲基矽氧基((CH3)2SiO2/2)及苯基矽氧基(C6H5SiO3/2)之共聚物、含有二甲基氫矽氧基((CH3)2HSiO1/2)、二甲基矽氧基((CH3)2SiO2/2)及苯基矽氧基(C6H5SiO3/2)之共聚物、含有甲基乙烯基矽氧基((CH3)(CH2=CH)SiO2/2)及苯基矽氧基(C6H5SiO3/2)之共聚物、含有甲基氫矽氧基((CH3)HSiO2/2)及苯基矽氧基(C6H5SiO3/2)之共聚物及諸如此類。在該等實例中,尤佳地,組合使用含有矽原子鍵結氫原子之有機聚矽氧烷及含有矽原子鍵結不飽和烴基團之有機聚矽氧烷作為本應用發明之有機聚矽氧烷或構成有機聚矽氧烷的組份。 Specific examples of the reactive organopolyoxyalkylene constituting the curable organopolyoxane composition used in the present invention include polydimethyl hydrazine terminated at two molecular terminals via dimethylvinyl hydroxy group. Oxyalkane, a dimethyl methoxy alkane/methylvinyl decane copolymer terminated with a dimethylvinyl methoxy group at the end of two molecules, and a dimethyl vinyl oxime at the end of two molecules a dimethyl methoxy oxane/methylphenyl decane copolymer at the base end, dimethyl methoxy oxane/methyl vinyl fluorene terminated by a dimethylvinyl methoxy group at two molecular terminals An alkane/methylphenyl decane copolymer, a polymethylphenyl decane terminated by a dimethylvinyl methoxy group at two molecular ends, and a dimethyl vinyl group at the end of two molecules a methoxy-terminated dimethyl methoxy oxane/diphenyl decane copolymer, a polydimethyl methoxy alkane terminated by a dimethyl hydroquinone at two molecular ends, in two molecules a dimethyl methoxy oxane/methylhydroioxane copolymer terminated with a dimethylhydroquinoneoxy group and a dimethyl hydroxy group at the end of two molecules a quinone oxo/methylphenyl decane copolymer, a polymethylphenyl siloxane having a dimethylhydroquinone-terminated at two molecular ends, and a dimethyl hydrogen at the ends of two molecules a methoxy-terminated dimethyl methoxy oxane/diphenyl decane copolymer, dimethyl methoxy oxane/methylhydroxyloxy terminated with dimethylhydroquinone at the end of two molecules An alkane/methylphenyl decane copolymer, a polymethylvinyl siloxane having a trimethyl methoxy group terminated at two molecular ends, and a trimethyl methoxy group at the end of two molecules a polymethylhydroquinone, a dimethyl methoxy alkane/methylvinyl decane copolymer terminated with a trimethyl methoxy group at the end of two molecules, and a trimethyl group at the end of two molecules a methoxy-terminated dimethyl methoxy oxane/methylhydroquinoxane copolymer, a diphenyl oxirane/methyl vinyl oxime terminated at the end of two molecules via a trimethyl methoxy group An alkane copolymer, a diphenyl methoxy oxane/methylhydroquinoxane copolymer terminated with a trimethyl methoxy group at two molecular ends, terminated by a trimethyl methoxy group at two molecular ends Methylphenyl decane / Vinyl vinyl alkane copolymer, methyl phenyl siloxane/methyl hydrazine copolymer terminated with trimethyl methoxy group at the end of two molecules, trimethyl group at the end of two molecules a methoxy-terminated dimethyl methoxy oxane/methylvinyl fluorene/methyl phenyl decane copolymer, a dimethyl hydrazine terminated by a trimethyl methoxy group at two molecular ends Oxylkane/methylhydroquinone/methylphenyl decane copolymer, dimethyl hydrogen functional MQ resin, dimethylvinyl functional MQ resin, diphenyl vinyl oxime at the ends of two molecules a polycapped dimethyl oxoxane, a polymethylphenyl siloxane having a diphenylvinyloxy group terminated at two molecular ends, and a diphenylvinyl fluorene at the end of two molecules. Oxy-terminated polydiphenyl fluorene oxide, polydimethyl methoxy oxane terminated by methyl phenyl vinyl methoxy group at two molecular ends, methyl phenyl ethylene at the ends of two molecules a oxy-terminated polymethylphenyl sulfoxane, a polydiphenyl fluorene terminated with a methylphenylvinyl methoxy group at the end of two molecules, containing dimethylvinyl fluorene Group ((CH 3) 2 (CH 2 = CH) SiO 1/2) and phenyl silicon group (C 6 H 5 SiO 3/2) the copolymer containing silicon dimethylhydrogensiloxy group ((CH 3 a copolymer of 2 HSiO 1/2 ) and phenyl decyloxy (C 6 H 5 SiO 3/2 ) containing dimethylvinyl decyloxy ((CH 3 ) 2 (CH 2 =CH)SiO 1 /2 ), a copolymer of dimethyl decyloxy ((CH 3 ) 2 SiO 2/2 ) and phenyl decyloxy (C 6 H 5 SiO 3/2 ), containing dimethylhydroquinoneoxy ( a copolymer of (CH 3 ) 2 HSiO 1/2 ), dimethyl decyloxy ((CH 3 ) 2 SiO 2/2 ) and phenyl decyloxy (C 6 H 5 SiO 3/2 ), containing a a copolymer of a vinyl methoxy group ((CH 3 )(CH 2 =CH)SiO 2/2 ) and a phenyl fluorenyloxy group (C 6 H 5 SiO 3/2 ), containing a methylhydroquinoneoxy group ( a copolymer of (CH 3 )HSiO 2/2 ) and a phenyldecyloxy group (C 6 H 5 SiO 3/2 ) and the like. In these examples, it is particularly preferred to use an organic polysiloxane having a hydrogen atom bonded to a ruthenium atom and an organopolysiloxane having a ruthenium atom-bonded unsaturated hydrocarbon group as the organic polyoxane of the present invention. An alkane or a component constituting an organopolyoxyalkylene.

反應性有機聚矽氧烷之數量平均分子量(Mw)較佳地在250至100,000範圍內。另外,對在10(l/s)剪切速率條件下於25℃下使用配備有20mm直徑錐板之流變儀量測之反應性有機聚矽氧烷之黏度並不施加特定限制,但此黏度較佳地在1mPa s至50,000mPa s範圍內,且尤佳地在5mPa s至10,000mPa s範圍內。 The number average molecular weight (Mw) of the reactive organopolyoxane is preferably in the range of from 250 to 100,000. In addition, there is no particular limitation on the viscosity of the reactive organopolyoxane measured at a shear rate of 10 (l/s) at 25 ° C using a rheometer equipped with a 20 mm diameter cone plate, but this The viscosity is preferably in the range of 1 mPa s to 50,000 mPa s, and particularly preferably in the range of 5 mPa s to 10,000 mPa s.

另外,可藉由適當地組合上述各種反應性有機聚矽氧烷來構成本發明之可固化之有機聚矽氧烷組合物之矽氧烷組份,從而單價芳族烴基團之質量分數(Z)及在分子鏈之兩個末端具有反應性基團之直鏈 有機聚矽氧烷之質量分數(W)在指定範圍內。 Further, the oxirane component of the curable organopolyoxane composition of the present invention can be constituted by appropriately combining the above various reactive organopolysiloxanes, thereby mass fraction of the monovalent aromatic hydrocarbon group (Z) And a linear chain having a reactive group at both ends of the molecular chain The mass fraction (W) of the organopolyoxane is within the specified range.

<平均初級顆粒直徑不小於50nm之無機微粒> <Inorganic fine particles having an average primary particle diameter of not less than 50 nm>

另外,本發明之可固化之有機聚矽氧烷組合物之特徵在於組合物含有具有上述特徵之有機聚矽氧烷及至少一種類型之平均初級顆粒直徑不小於50nm的無機微粒。因此,可獲得具有難以使用習用可固化之有機聚矽氧烷組合物獲得之極佳機械特性及/或電特性之聚矽氧彈性體固化產物。 Further, the curable organopolyoxane composition of the present invention is characterized in that the composition contains an organopolysiloxane having the above characteristics and at least one type of inorganic fine particles having an average primary particle diameter of not less than 50 nm. Therefore, a polyoxyxene elastomer cured product having excellent mechanical properties and/or electrical properties which are difficult to obtain using a conventional curable organopolyoxane composition can be obtained.

微粒之平均初級顆粒直徑不小於50nm。微粒可為不同顆粒直徑之微粒之混合物。可藉由業內常用之量測方法來量測平均顆粒直徑。舉例而言,若平均顆粒直徑不小於50nm且不大於大約500nm,則可藉由平均化藉由顯微鏡觀察(使用透射式電子顯微鏡(TEM)、場發射型透射式電子顯微鏡(FE-TEM)、掃描電子顯微鏡(SEM)、場發射型掃描電子顯微鏡(FE-SEM)或諸如此類)量測之顆粒直徑來量測平均初級顆粒直徑。另一方面,若平均顆粒直徑不小於大約500nm,則可藉由雷射繞射-散射型粒度分佈量測裝置或諸如此類直接測定平均初級顆粒直徑值。 The average primary particle diameter of the particles is not less than 50 nm. The microparticles can be a mixture of microparticles of different particle diameters. The average particle diameter can be measured by a measurement method commonly used in the industry. For example, if the average particle diameter is not less than 50 nm and not more than about 500 nm, it can be observed by microscopy by averaging (using a transmission electron microscope (TEM), a field emission type transmission electron microscope (FE-TEM), The average primary particle diameter is measured by a scanning electron microscope (SEM), a field emission type scanning electron microscope (FE-SEM) or the like to measure the particle diameter. On the other hand, if the average particle diameter is not less than about 500 nm, the average primary particle diameter value can be directly measured by a laser diffraction-scattering type particle size distribution measuring device or the like.

該等無機微粒之功能及類型並無特定限制,但實例包含導電無機微粒、絕緣無機微粒、導熱無機微粒及介電無機微粒。較佳地,在本發明組合物中使用一或多個選自該等微粒之類型。特定而言,較佳使用介電無機微粒,且尤佳地介電無機微粒係如下介電無機微粒:其中平均初級顆粒直徑不小於50nm之一或多個類型之無機微粒中之至少一部分在1kHz及室溫下具有不小於10的比介電常數。另外,無機微粒之較佳大小(平均初級顆粒直徑)之上限為20,000nm(20微米),但考慮到至用於下文所闡述轉換器之薄膜之處理性,10,000nm(10微米)更佳。 The function and type of the inorganic fine particles are not particularly limited, but examples include conductive inorganic fine particles, insulating inorganic fine particles, thermally conductive inorganic fine particles, and dielectric inorganic fine particles. Preferably, one or more types selected from the group of particles are used in the compositions of the invention. In particular, it is preferred to use dielectric inorganic fine particles, and particularly preferably, the dielectric inorganic fine particles are dielectric inorganic fine particles in which at least one of the average primary particle diameter is not less than 50 nm or at least a part of a plurality of types of inorganic fine particles is at 1 kHz. And a specific dielectric constant of not less than 10 at room temperature. Further, the upper limit of the preferable size (average primary particle diameter) of the inorganic fine particles is 20,000 nm (20 μm), but 10,000 nm (10 μm) is more preferable in view of the rationality of the film used for the converter described below.

<介電無機微粒(C)> <Dielectric inorganic particles (C)>

有利的是,介電無機微粒(C)係在1kHz及室溫下之比介電常數不小於10之介電無機微粒(C1)。藉由在包括可固化之有機聚矽氧烷之固化產物中攜載介電無機微粒,轉換器所需之物理特性及電特性皆得以滿足。 Advantageously, the dielectric inorganic fine particles (C) are dielectric inorganic fine particles (C1) having a specific dielectric constant of not less than 10 at 1 kHz and room temperature. By carrying dielectric inorganic particles in a cured product comprising a curable organopolyoxyalkylene, the physical and electrical properties required for the converter are met.

舉例而言,介電無機微粒可選自由下式(C2)代表之金屬氧化物(在下文中亦稱為「金屬氧化物(C2)」):Ma naMb nbOnc (C2) For example, the dielectric inorganic fine particles may be selected from a metal oxide represented by the following formula (C2) (hereinafter also referred to as "metal oxide (C2)"): M a na M b nb O nc (C2)

(在該式中,Ma係週期表之第2族金屬元素;Mb係週期表之第4族金屬元素;na係介於0.9至1.1之間之數值;nb係介於0.9至1.1之間之數值;且nc係介於2.8至3.2之間之數值) (In the formula, the second metal element M a system of the Periodic Table; Group 4 metal element M b of the Periodic Table of the system; of Na-based value between 0.9 to 1.1; Nb-based range of 0.9 to 1.1 The value between; and the nc is between 2.8 and 3.2)

金屬氧化物(C2)中之週期表第2族金屬元素Ma之較佳實例包含鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)及鋇(Ba)。引用鈦(Ti)作為週期表第4族金屬元素Mb之較佳實例。在由式(C2)代表之金屬氧化物之顆粒中,Ma及Mb各自可為單一元素或可為兩種或更多種元素。 Preferred examples of the Group 2 metal element M a of the periodic table in the metal oxide (C2) include beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba). Titanium (Ti) is cited as a preferred example of the Group 4 metal element M b of the periodic table. In the particles of the metal oxide represented by the formula (C2), each of M a and M b may be a single element or may be two or more elements.

金屬氧化物(C2)之具體實例包含鈦酸鋇、鈦酸鈣及鈦酸鍶。 Specific examples of the metal oxide (C2) include barium titanate, calcium titanate, and barium titanate.

舉例而言,介電無機微粒可選自由下式(C3)代表之金屬氧化物(在下文中亦稱為「金屬氧化物(C3)」):Ma naMb' nb'Onc (C3) For example, the dielectric inorganic fine particles may be selected from a metal oxide represented by the following formula (C3) (hereinafter also referred to as "metal oxide (C3)"): M a na M b' nb' O nc (C3)

(在該式中,Ma係週期表之第2族金屬元素;Mb'係週期表之第5週期金屬元素;na係介於0.9至1.1之間之數值;nb'係介於0.9至1.1之間之數值;且 nc係介於2.8至3.2之間之數值) (In the formula, Ma is a Group 2 metal element of the periodic table; M b ' is the fifth periodic metal element of the periodic table; na is a value between 0.9 and 1.1; nb' is between 0.9 and The value between 1.1; and the nc is between 2.8 and 3.2)

金屬氧化物(C3)中之週期表第2族金屬元素Ma之較佳實例包含鈹(Be)、鎂(Mg)、鈣(Ca)、鍶(Sr)及鋇(Ba)。週期表第5週期金屬元素Mb'之較佳實例包含錫(Sn)、銻(Sb)、鋯(Zr)及銦(In)。在由式(C3)代表之金屬氧化物之顆粒中,Ma及Mb'各自可為單一類型之元素或可為兩種或更多種元素。 Preferred examples of the Group 2 metal element M a of the periodic table in the metal oxide (C3) include beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba). Preferred examples of the metal element M b ' of the fifth period of the periodic table include tin (Sn), bismuth (Sb), zirconium (Zr), and indium (In). In the particles of the metal oxide represented by the formula (C3), each of M a and M b ' may be a single type of element or may be two or more elements.

金屬氧化物(C3)之具體實例包含錫酸鎂、錫酸鈣、錫酸鍶、錫酸鋇、銻酸鎂、銻酸鈣、銻酸鍶、銻酸鋇、鋯酸鎂、鋯酸鈣、鋯酸鍶、鋯酸鋇、銦酸鎂、銦酸鈣、銦酸鍶及銦酸鋇。 Specific examples of the metal oxide (C3) include magnesium stannate, calcium stannate, barium stannate, barium stannate, magnesium citrate, calcium citrate, barium strontium citrate, barium strontium citrate, magnesium zirconate, calcium zirconate, Barium zirconate, barium zirconate, magnesium indium, calcium indium, barium indiumate and barium indium.

另外,在與該等金屬氧化物顆粒之組合中,可允許使用其他金屬氧化物之顆粒,例如鋯鈦酸鉛、鈦酸鋅、鈦酸鉛、氧化鈦或諸如此類(尤其除先前所列示之彼等外之氧化鈦複合氧化物)。另外,可使用包括其他金屬元素之固體溶液作為介電無機微粒(C)。在此情形下,其他金屬元素例示為La(鑭)、Bi(鉍)、Nd(釹)、Pr(鐠)及諸如此類。 In addition, in combination with such metal oxide particles, particles of other metal oxides may be permitted, such as lead zirconate titanate, zinc titanate, lead titanate, titanium oxide or the like (especially in addition to those previously listed) Their other titanium oxide composite oxides). In addition, a solid solution including other metal elements may be used as the dielectric inorganic fine particles (C). In this case, other metal elements are exemplified as La (镧), Bi (铋), Nd (钕), Pr (鐠), and the like.

在該等無機微粒中,介電無機微粒(C)之較佳實例包含一或多種類型之選自由以下組成之群之無機微粒:氧化鈦、鈦酸鋇、鈦酸鍶、鋯鈦酸鉛,以及鈦酸鋇之鋇及鈦位置部分地經鹼土金屬(例如鈣或鍶)、鋯或稀土金屬(例如釔、釹、釤或鏑)取代之複合金屬氧化物。氧化鈦、鈦酸鋇、鋯鈦酸鋇鈣及鈦酸鍶更佳,且氧化鈦及鈦酸鋇最佳。 Among the inorganic fine particles, preferred examples of the dielectric inorganic fine particles (C) include one or more types of inorganic fine particles selected from the group consisting of titanium oxide, barium titanate, barium titanate, lead zirconate titanate, And a composite metal oxide in which barium titanate and titanium are partially replaced by an alkaline earth metal such as calcium or barium, zirconium or a rare earth metal such as lanthanum, cerium, lanthanum or cerium. Titanium oxide, barium titanate, barium zirconate titanate and barium titanate are more preferred, and titanium oxide and barium titanate are preferred.

介電無機微粒(C)之形態可為任一形態,例如球形、扁平狀、針狀、纖維狀或諸如此類。其平均初級顆粒直徑不小於50nm,但考慮到可固化之有機聚矽氧烷組合物之模製處理性、尤其薄膜可成形性,50nm至5,000nm之範圍較佳。若無機微粒係形態為扁平狀、針狀、纖維狀或諸如此類之各向異性微粒,則儘管對該等微粒之縱橫比並不施加限制,但該縱橫比通常可不小於5。 The form of the dielectric inorganic fine particles (C) may be in any form such as a spherical shape, a flat shape, a needle shape, a fibrous shape or the like. The average primary particle diameter is not less than 50 nm, but in view of mold handling property, particularly film formability, of the curable organopolyoxane composition, a range of 50 nm to 5,000 nm is preferred. If the inorganic fine particles are in the form of flat, needle-like, fibrous or the like, the aspect ratio is usually not less than 5 although the aspect ratio of the fine particles is not limited.

對介電無機微粒(C)之粒度分佈並不施加特定限制,且介電無機 微粒可為單分散微粒,或另一選擇為,可藉由以較高密度填充降低微粒之間之空隙分數來產生顆粒直徑分佈以改良機械強度。作為粒度分佈之量度,藉由雷射光繞射方法量測之累積粒度分佈曲線中之90%累積面積下顆粒直徑(D90)對10%累積面積下顆粒直徑(D10)之比率(D90/D10)較佳地不小於2。另外,對粒度分佈形狀(顆粒直徑及顆粒濃度之間之關係)並不施加限制。可具有所謂的平頂形分佈或多峰(亦即雙峰(亦即具有兩個山型分佈)、三峰或諸如此類)之粒度分佈。 The specific limitation is not imposed on the particle size distribution of the dielectric inorganic fine particles (C), and the dielectric inorganic fine particles may be monodisperse fine particles, or alternatively, the void fraction between the fine particles may be reduced by filling at a higher density. A particle diameter distribution is produced to improve mechanical strength. As a measure of the particle size distribution, with the particle diameter at the cumulative particle size distribution curve by the method of laser light diffraction in the amount of 90% cumulative area (D 90) to (D 10) of the ratio of the particle diameter at 10% cumulative area (D 90 /D 10 ) is preferably not less than 2. In addition, no limitation is imposed on the shape of the particle size distribution (the relationship between the particle diameter and the particle concentration). There may be a so-called flat top distribution or a multimodal (i.e., bimodal (i.e., having two mountain distributions), three peaks, or the like) particle size distribution.

為得到類似於彼等上述粒度分佈之介電無機微粒(C)之粒度分佈,可採用多種方法,例如組合使用兩種或更多種類型之具有不同平均直徑或粒度分佈之微粒,及摻和藉由篩分或類似方法獲得之多種顆粒直徑分數之顆粒以產生期望粒度分佈,或諸如此類。 In order to obtain a particle size distribution of dielectric inorganic particles (C) similar to those of the above particle size distribution, various methods may be employed, for example, combining two or more types of particles having different average diameters or particle size distributions, and blending Particles of various particle diameter fractions obtained by sieving or the like to produce a desired particle size distribution, or the like.

另外,該等介電無機微粒(C)可使用下文所闡述多種類型之表面處理劑來處理。 Further, the dielectric inorganic fine particles (C) can be treated using various types of surface treating agents as described below.

考慮到所獲得固化產物之機械特性及介電特性,相對於組合物之總體積,本發明之可固化之有機聚矽氧烷組合物中介電無機微粒(C)之摻和量(填充比率)可不小於10%、較佳地不小於15%及另外較佳地不小於20%。另外,相對於組合物之總體積之此摻和量較佳地不大於70%及另外較佳地不大於60%。 In view of the mechanical properties and dielectric properties of the obtained cured product, the blending amount (filling ratio) of the electro-organic inorganic fine particles (C) of the curable organopolysiloxane composition of the present invention is relative to the total volume of the composition. It may be not less than 10%, preferably not less than 15%, and further preferably not less than 20%. Further, the blending amount with respect to the total volume of the composition is preferably not more than 70% and further preferably not more than 60%.

在本發明之可固化之有機聚矽氧烷組合物中,一或多個類型之平均初級顆粒直徑不小於50nm之無機微粒較佳係介電無機微粒(C),但其亦可包含下列導電無機微粒、絕緣無機微粒及導熱無機微粒。 In the curable organopolyoxane composition of the present invention, one or more types of inorganic fine particles having an average primary particle diameter of not less than 50 nm are preferably dielectric inorganic fine particles (C), but they may also contain the following conductive materials. Inorganic fine particles, insulating inorganic fine particles, and thermally conductive inorganic fine particles.

可用於本文中之導電無機微粒並無特定限制,前提係其可賦予有機聚矽氧烷組合物之固化產物導電性。導電無機微粒之具體實例包含:導電碳,例如導電碳黑、石墨、氣相生長之碳(VGCF)或諸如此類;及金屬粉末,例如鉑、金、銀、銅、鎳、錫、鋅、鐵、鋁或諸如此類之粉末;以及經塗覆顏料,例如銻摻雜氧化錫、磷摻雜氧化錫、 使用氧化錫/銻、氧化錫、氧化銦、氧化銻、銻酸鋅表面處理之針狀氧化鈦及經氧化錫或諸如此類表面處理之石墨或碳須晶;經至少一種類型之導電金屬氧化物(其選自由錫摻雜氧化銦(ITO)、氟摻雜氧化錫(FTO)及磷摻雜氧化錫及磷摻雜氧化鎳組成之群)塗覆之顏料;具有導電性且在二氧化鈦顆粒表面中含有氧化錫及磷之顏料;視情況使用下文所闡述各種類型之表面處理劑對該等導電無機微粒進行表面處理。該等導電無機微粒可以一種類型或以兩種或更多種類型之組合來使用。 The conductive inorganic fine particles usable herein are not particularly limited as long as they impart conductivity to the cured product of the organopolyoxane composition. Specific examples of the conductive inorganic fine particles include: conductive carbon such as conductive carbon black, graphite, vapor grown carbon (VGCF) or the like; and metal powder such as platinum, gold, silver, copper, nickel, tin, zinc, iron, Aluminum or the like; and coated pigments such as antimony doped tin oxide, phosphorus doped tin oxide, a needle-shaped titanium oxide surface-treated with tin oxide/niobium oxide, tin oxide, indium oxide, antimony oxide or zinc antimonate, and graphite or carbon whisker such as surface-treated with tin oxide or the like; and at least one type of conductive metal oxide ( It is selected from pigments coated with tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), and phosphorus-doped tin oxide and phosphorus-doped nickel oxide; conductive and in the surface of titanium dioxide particles Pigments containing tin oxide and phosphorus; the conductive inorganic particles are surface treated as appropriate using various types of surface treatment agents as set forth below. The conductive inorganic fine particles may be used in one type or in a combination of two or more types.

另外,導電無機微粒可為纖維,例如玻璃纖維、二氧化矽氧化鋁纖維、氧化鋁纖維、碳纖維或諸如此類;或針狀增強材料,例如硼酸鋁須晶、鈦酸鉀須晶或諸如此類;或無機填充劑材料,例如玻璃珠、滑石、雲母、石墨、矽灰石、白雲石或諸如此類,該等微粒之表面已經導電物質(例如金屬或諸如此類)塗覆。 Further, the conductive inorganic fine particles may be fibers such as glass fibers, cerium oxide alumina fibers, alumina fibers, carbon fibers or the like; or acicular reinforcing materials such as aluminum borate whiskers, potassium titanate whiskers or the like; or inorganic A filler material such as glass beads, talc, mica, graphite, apatite, dolomite or the like, the surfaces of which are coated with a conductive substance such as a metal or the like.

藉由將導電無機微粒摻和至組合物中可增加有機聚矽氧烷固化產物之比介電常數。端視該等導電無機微粒之應用,其相對於可固化之有機聚矽氧烷組合物之摻和量較佳地在0.01質量%至10質量%範圍內,且更佳地在0.05質量%至5質量%範圍內。在導電無機微粒之摻和量背離上述較佳範圍時,不能獲得摻和效應,或可降低固化產物之介電崩潰強度。 The specific dielectric constant of the organopolyoxyalkylene cured product can be increased by blending conductive inorganic particles into the composition. Regarding the application of the conductive inorganic fine particles, the blending amount thereof relative to the curable organopolyoxane composition is preferably in the range of 0.01% by mass to 10% by mass, and more preferably 0.05% by mass to Within 5 mass%. When the blending amount of the conductive inorganic fine particles deviates from the above preferred range, the blending effect cannot be obtained, or the dielectric collapse strength of the cured product can be lowered.

可用於本發明中之絕緣無機微粒並無特定限制,前提係其通常係已知絕緣無機微粒,亦即體積電阻率為1010歐姆cm至1018歐姆cm之無機材料顆粒,且可以粒子、薄片及纖維(包含須晶)中之任一形態使用。較佳具體實例包含球形顆粒、扁平狀顆粒及陶瓷纖維、金屬矽酸鹽顆粒(例如氧化鋁)、氧化鐵、氧化銅、雲母及滑石及諸如石英、非晶型二氧化矽及玻璃等顆粒。另外,該等絕緣無機微粒可使用下文所闡述各種類型之表面處理劑來進行表面處理。該等電絕緣無機微粒可 以一種類型或以兩種或更多種類型之組合來使用。 The insulating inorganic fine particles usable in the present invention are not particularly limited, provided that they are generally known as insulating inorganic fine particles, that is, inorganic material particles having a volume resistivity of 10 10 ohm cm to 10 18 ohm cm, and may be particles or flakes. And any of the fibers (including whiskers) used. Preferred specific examples include spherical particles, flat particles and ceramic fibers, metal silicate particles (for example, alumina), iron oxide, copper oxide, mica and talc, and particles such as quartz, amorphous ceria, and glass. Further, the insulating inorganic fine particles may be subjected to surface treatment using various types of surface treating agents as described below. The electrically insulating inorganic fine particles may be used in one type or in a combination of two or more types.

藉由將絕緣無機微粒摻和至組合物中可增加有機聚矽氧烷固化產物之機械強度及介電崩潰強度,且有時可觀察到比介電常數增加。端視該等絕緣無機顆粒之應用,其相對於可固化之有機聚矽氧烷組合物之摻和量較佳地在0.1質量%至20質量%範圍內,且更佳地在0.1質量%至5質量%範圍內。在絕緣無機顆粒之摻和量背離上述較佳範圍時,不能獲得摻和效應,或可降低固化產物之機械強度。 The mechanical strength and dielectric breakdown strength of the organopolyoxyalkylene cured product can be increased by blending the insulating inorganic fine particles into the composition, and sometimes the specific dielectric constant is observed to increase. Regarding the application of the insulating inorganic particles, the blending amount thereof relative to the curable organopolyoxane composition is preferably in the range of 0.1% by mass to 20% by mass, and more preferably 0.1% by mass to Within 5 mass%. When the blending amount of the insulating inorganic particles deviates from the above preferred range, the blending effect cannot be obtained, or the mechanical strength of the cured product can be lowered.

可用於本發明中之導熱無機微粒之實例為金屬氧化物顆粒,例如氧化鎂、氧化鋅、氧化鎳、氧化釩、氧化銅、氧化鐵、氧化銀及諸如此類;及無機化合物顆粒,例如氮化鋁、氮化硼、碳化矽、氮化矽、碳化硼、碳化鈦、金剛石、金剛石樣碳及諸如此類。氧化鋅、氮化硼、碳化矽及氮化矽較佳。藉由將一或多個類型之該等導熱無機微粒摻和至組合物中,可增加有機聚矽氧烷固化產物之熱導率。端視該等導熱無機微粒之應用,其相對於可固化之有機聚矽氧烷組合物之摻和量較佳地在0.1質量%至30質量%範圍內。 Examples of the thermally conductive inorganic fine particles usable in the present invention are metal oxide particles such as magnesium oxide, zinc oxide, nickel oxide, vanadium oxide, copper oxide, iron oxide, silver oxide, and the like; and inorganic compound particles such as aluminum nitride. , boron nitride, tantalum carbide, tantalum nitride, boron carbide, titanium carbide, diamond, diamond-like carbon, and the like. Zinc oxide, boron nitride, tantalum carbide and tantalum nitride are preferred. By incorporating one or more types of such thermally conductive inorganic particles into the composition, the thermal conductivity of the organopolyoxyalkylene cured product can be increased. In view of the application of the thermally conductive inorganic fine particles, the blending amount with respect to the curable organopolyoxane composition is preferably in the range of 0.1% by mass to 30% by mass.

本發明之可固化之有機聚矽氧烷組合物含有有機聚矽氧烷及至少一種類型之平均初級顆粒直徑不小於50nm之無機微粒,但更有利的是,較佳地有機聚矽氧烷組合物滿足下文[1]、[2]及[3]項之組成特徵。 The curable organopolyoxane composition of the present invention contains an organic polyoxoxane and at least one type of inorganic fine particles having an average primary particle diameter of not less than 50 nm, but more advantageously, an organic polyoxane combination is preferred. The material satisfies the composition characteristics of items [1], [2] and [3] below.

[1]相對於可固化之有機聚矽氧烷組合物中之全部有機聚矽氧烷組份,可固化之有機聚矽氧烷組合物以不小於0.1質量%且不大於10質量%之量含有由通式:MaMR bDcDR dTeTR fQg代表之有機聚矽氧烷,其中(a+c)/(b+d+e+f+g)之值小於3。在此處,在上述通式中,M係三有機矽氧基單元;D係二有機矽氧基單元;T係單有機矽氧基單元;Q係由SiO4/2代表之矽氧基單元;且每一矽氧基單元上之取代基R係能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之 基團。 [1] The curable organopolyoxane composition is not less than 0.1% by mass and not more than 10% by mass relative to all of the organopolyoxane component in the curable organopolyoxane composition. Containing an organopolyoxane represented by the formula: M a M R b D c D R d T e T R f Q g , wherein (a+c)/(b+d+e+f+g) Less than 3. Here, in the above formula, M is a triorganosyloxy unit; a D is a diorganomethoxy unit; a T is a monoorganomethoxy unit; and a Q is a decyl unit represented by SiO 4/2 . And the substituent R on each of the methoxy units is a group capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction.

[2]相對於可固化之有機聚矽氧烷組合物中之全部矽氧烷組份,可固化之有機聚矽氧烷組合物以不小於75質量%且不大於99.9質量%之量含有僅在兩個分子末端具有能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團的反應性有機聚矽氧烷。 [2] The curable organopolyoxane composition contains the amount in an amount of not less than 75% by mass and not more than 99.9% by mass, based on the entire oxyalkylene component in the curable organopolyoxane composition. A reactive organopolyoxyalkylene having a group capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction at two molecular terminals.

[3]可固化之有機聚矽氧烷組合物至少含有:(S)在分子中具有至少兩個能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團之反應性有機聚矽氧烷,反應性有機聚矽氧烷S在兩個能夠進行固化反應之基團之間具有小於10,000之平均分子量;及(L)在分子中具有至少兩個能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團之反應性有機聚矽氧烷,反應性有機聚矽氧烷L在兩個基團之間具有不小於10,000且不大於150,000之分子量;且組份(S)及組份(L)之摻和比率為1:99至20:80。 [3] The curable organopolyoxane composition contains at least: (S) reactivity having at least two groups capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction in a molecule An organic polyoxyalkylene oxide having a mean molecular weight of less than 10,000 between two groups capable of undergoing a curing reaction; and (L) having at least two capable of undergoing a condensation reaction in the molecule a reactive organopolyoxane which is a group which undergoes a reaction, a peroxidation reaction or a photoreaction to carry out a curing reaction, and the reactive organopolyoxane L has a molecular weight of not less than 10,000 and not more than 150,000 between the two groups; And the blending ratio of the component (S) and the component (L) is 1:99 to 20:80.

上述特徵[1]至[3]進一步詳細闡述於下文中。尤佳地,本發明之有機聚矽氧烷滿足所有該等條件。 The above features [1] to [3] are explained in further detail below. More preferably, the organopolyoxane of the present invention satisfies all of these conditions.

就特徵[1]而言,相對於本發明之可固化之有機聚矽氧烷組合物中之全部矽氧烷組份,由MaMR bDcDR dTeTR fQg(其中(a+c)/(b+d+e+f+g)之值小於3)代表之反應性有機聚矽氧烷之質量分數較佳地不小於0.1質量%且不大於10質量%,且尤佳地不小於0.1質量%且不大於5質量%。在該比例小於0.1質量%時,聚矽氧烷組份中之交聯點數過低,且由此存在在固化反應之後機械強度及介電崩潰強度不足之風險。相反,超過10質量%之比例並不適宜,此乃因交聯點數過多,且由此固化後彈性模數較高且斷裂伸長率較低。 With respect to the feature [1], with respect to all of the oxane component in the curable organopolyoxane composition of the present invention, by M a M R b D c D R d T e T R f Q g (wherein the value of (a+c)/(b+d+e+f+g) is less than 3) represents that the mass fraction of the reactive organopolyoxane is preferably not less than 0.1% by mass and not more than 10% by mass. And particularly preferably not less than 0.1% by mass and not more than 5% by mass. When the ratio is less than 0.1% by mass, the number of crosslinking points in the polyoxyalkylene component is too low, and thus there is a risk that mechanical strength and dielectric breakdown strength are insufficient after the curing reaction. On the contrary, a ratio of more than 10% by mass is not preferable because the number of crosslinking points is excessive, and thus the modulus of elasticity after curing is high and the elongation at break is low.

就特徵[2]而言,相對於可固化之有機聚矽氧烷組合物中之全部有機聚矽氧烷組份,僅在兩個分子末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷之重量分數較佳地不小於75質量%且不大於 99.9質量%。若此比例在上述範圍之外,則並不適宜,此乃因作為固化產物之聚矽氧彈性體之高斷裂伸長率不能達成或介電崩潰強度不足。在此處,對於能夠進行固化反應之基團而言,可使用能夠進行縮合反應、加成反應、過氧化反應或光反應之基團。然而,出於與彼等上文所闡述類似之原因,此基團較佳地能夠進行加成反應。在該等能夠進行加成反應之基團中,基團較佳地在矽氫化反應中有活性,亦即該基團係含有矽原子鍵結氫原子之基團或含有脂肪族不飽和鍵之基團(例如具有2至20個碳之烯基或諸如此類)。其具體實例包含在兩個分子末端經二甲基氫矽氧基封端之聚二甲基矽氧烷及在兩個分子末端經二甲基乙烯基矽氧基封端之聚二甲基矽氧烷。為進一步適用於該等聚合物之材料特性(例如機械特性、介電特性、耐熱特性或諸如此類),該等聚合物之一部分甲基可經乙基、丙基、丁基、己基或苯基取代。 With respect to the feature [2], reactive organic polymerization having a group capable of undergoing a curing reaction at only two molecular terminals with respect to all of the organopolyoxane components in the curable organopolyoxane composition The weight fraction of the oxane is preferably not less than 75% by mass and not more than 99.9 mass%. If the ratio is outside the above range, it is not preferable because the high elongation at break of the polysiloxane elastomer as a cured product cannot be achieved or the dielectric collapse strength is insufficient. Here, as the group capable of undergoing a curing reaction, a group capable of undergoing a condensation reaction, an addition reaction, a peroxidation reaction, or a photoreaction can be used. However, for reasons similar to those set forth above, this group is preferably capable of undergoing an addition reaction. In such groups capable of undergoing an addition reaction, the group is preferably active in a hydrogenation reaction, that is, the group contains a group in which a halogen atom is bonded to a hydrogen atom or contains an aliphatic unsaturated bond. a group (for example, an alkenyl group having 2 to 20 carbons or the like). Specific examples thereof include polydimethyl methoxy oxane terminated with dimethylhydroquinone at the end of two molecules and polydimethyl hydrazine terminated by dimethylvinyl hydroxy groups at the ends of two molecules. Oxytomane. To further suit the material properties of such polymers (eg, mechanical, dielectric, heat resistant, or the like), a portion of the methyl groups of the polymers may be substituted with ethyl, propyl, butyl, hexyl or phenyl groups. .

僅在兩個分子鏈末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷之數量平均分子量(Mw)在250至100,000範圍內。另外,對在10(l/s)剪切速率條件下於25℃下使用配備有20mm直徑錐板之流變儀量測之反應性有機聚矽氧烷之黏度並不施加特定限制,但此黏度較佳地在1mPa s至100,000mPa s範圍內,且尤佳地在5mPa s至10,000mPa s範圍內。 The number average molecular weight (Mw) of the reactive organopolyoxane having only a group capable of undergoing a curing reaction at the end of two molecular chains is in the range of 250 to 100,000. In addition, there is no particular limitation on the viscosity of the reactive organopolyoxane measured at a shear rate of 10 (l/s) at 25 ° C using a rheometer equipped with a 20 mm diameter cone plate, but this The viscosity is preferably in the range of from 1 mPa s to 100,000 mPa s, and more preferably in the range of from 5 mPa s to 10,000 mPa s.

就特徵[3]而言,在本發明中,較佳使用反應性有機聚矽氧烷(S)(其係在分子中具有至少兩個能夠進行固化反應之基團之反應性有機聚矽氧烷,在兩個能夠進行固化反應之基團之間具有小於10,000之平均分子量)及反應性有機聚矽氧烷(L)(其係在分子中具有至少兩個能夠進行固化反應之基團之反應性有機聚矽氧烷,在兩個能夠進行固化反應之基團之間具有不小於10,000且不大於150,000之分子量)。該等反應性有機聚矽氧烷分別作為短鏈非反應性聚合物部分及長鏈非反應性聚合物部分含於分子中。在此處,在僅在分子鏈之兩個末端具有反 應性官能基之鏈型有機聚矽氧烷之情形下,在該兩個能夠進行交聯反應之基團之間之分子量定義為非反應性聚矽氧烷部分(不包含兩個末端之矽氧基單元)之分子量。在多個能夠進行交聯反應之基團之間之分子量之情形下,此分子量為最長部分之分子量。 In the case of the feature [3], in the present invention, it is preferred to use a reactive organopolyoxane (S) which is a reactive organopolyoxy group having at least two groups capable of undergoing a curing reaction in the molecule. An alkane having an average molecular weight of less than 10,000 between two groups capable of undergoing a curing reaction) and a reactive organopolyoxane (L) having at least two groups capable of undergoing a curing reaction in the molecule The reactive organopolyoxane has a molecular weight of not less than 10,000 and not more than 150,000 between two groups capable of undergoing a curing reaction. The reactive organopolyoxanes are contained in the molecule as a short chain non-reactive polymer portion and a long chain non-reactive polymer portion, respectively. Here, there is an inverse at only the two ends of the molecular chain In the case of a functional organofunctional chain polyorganosiloxane, the molecular weight between the two groups capable of undergoing a crosslinking reaction is defined as a non-reactive polyoxane moiety (excluding both ends) The molecular weight of the oxy unit). In the case of a molecular weight between a plurality of groups capable of undergoing a crosslinking reaction, this molecular weight is the molecular weight of the longest portion.

在以上述摻和比率一起使用組份(S)及組份(L)作為用於可固化之有機聚矽氧烷之原始材料時,可在構成藉由固化反應獲得之聚矽氧彈性體之聚矽氧鏈組份中引入不同鏈長度之部分。藉由此方式,可減少所獲得聚矽氧彈性體之永久應變,且可降低機械能轉化損失。特定而言,在將本發明之聚矽氧彈性體用於轉換器之介電層中時,組份(S)與組份(L)之此組合應用具有提高能量轉化效率之實際優點。 When the component (S) and the component (L) are used together as the raw material for the curable organopolyoxane in the above blending ratio, the polyoxyxene elastomer obtained by the curing reaction may be formed. Part of the chain length is introduced into the polyoxyxene chain component. In this way, the permanent strain of the obtained polyoxyxene elastomer can be reduced, and the mechanical energy conversion loss can be reduced. In particular, when the polyxene oxide elastomer of the present invention is used in a dielectric layer of a converter, the combined use of component (S) and component (L) has the practical advantage of improving energy conversion efficiency.

如先前所提及,可使用能夠進行縮合反應、加成反應、過氧化反應或光反應之基團作為該等組份之能夠進行固化反應之基團。然而,出於與彼等上文所闡述類似之原因,此較佳係能夠進行加成反應之基團。在能夠進行加成反應之基團中,基團較佳地係矽氫化反應活性基團,亦即該基團係含有矽原子鍵結氫原子或含有脂肪族不飽和鍵之基團(例如具有2至20個碳之烯基或諸如此類)。反應性有機聚矽氧烷(S)及(L)之具體實例係經引用作為由MaMR bDcDR dTeTR fQg代表之反應性有機聚矽氧烷之實例;及經引用作為僅在兩個分子鏈末端具有能夠進行固化反應之基團之反應性有機聚矽氧烷之實例。為進一步適用於在固化之後之機械特性及熱特性,一部分甲基可經乙基、丙基、丁基、己基或苯基取代。 As mentioned previously, a group capable of undergoing a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction may be used as a group capable of undergoing a curing reaction of the components. However, for reasons similar to those set forth above, this is preferably a group capable of undergoing an addition reaction. In the group capable of undergoing an addition reaction, the group is preferably a hydrogenation-reactive group, that is, the group contains a hydrogen atom bonded to a halogen atom or a group containing an aliphatic unsaturated bond (for example, 2 to 20 carbon alkenyl groups or the like). Specific examples of the reactive organopolyoxyalkylenes (S) and (L) are cited as examples of reactive organopolyoxyalkylene represented by M a M R b D c D R d T e T R f Q g And an example of a reactive organopolyoxyalkylene which is cited as having only a group capable of undergoing a curing reaction at the end of two molecular chains. To further suit the mechanical and thermal properties after curing, a portion of the methyl group may be substituted with ethyl, propyl, butyl, hexyl or phenyl.

組份(S)及下列組份(L)之摻和比率(質量比率)S:L之值之較佳範圍為1:99至40:60。若摻和比率值在此範圍之外,則藉由固化本發明之可固化之有機聚矽氧烷組合物獲得之固化產物不能滿足至少一種特性(包含高斷裂伸長率、高機械強度、高介電崩潰強度及低彈性模數)。 The preferred range of the blending ratio (mass ratio) S:L of the component (S) and the following component (L) is from 1:99 to 40:60. If the blend ratio value is outside this range, the cured product obtained by curing the curable organopolyoxane composition of the present invention cannot satisfy at least one property (including high elongation at break, high mechanical strength, high dielectric Electrical collapse strength and low elastic modulus).

<SiH/Vi比率> <SiH/Vi ratio>

藉由矽氫化反應來有利地固化可固化之有機聚矽氧烷組合物,且本發明之有機聚矽氧烷中矽鍵結氫原子(H)對矽鍵結不飽和烴基團(Vi)之摻和比率(莫耳比率)較佳地在0.5至3.0範圍內。在此值在上述範圍之外時,在藉由矽氫化反應固化之後之殘餘官能基可不利地影響固化產物之材料物理性質。 The curable organopolyoxane composition is advantageously cured by a hydrazine hydrogenation reaction, and the hydrazine-bonded hydrogen atom (H) in the organopolysiloxane of the invention is bonded to an unsaturated hydrocarbon group (Vi) The blend ratio (molar ratio) is preferably in the range of 0.5 to 3.0. When the value is outside the above range, the residual functional group after curing by the hydrazine hydrogenation reaction may adversely affect the material physical properties of the cured product.

本發明之可固化之有機聚矽氧烷組合物較佳地含有用於用於固化有機聚矽氧烷組份之固化觸媒(B)。 The curable organopolyoxane composition of the present invention preferably contains a curing catalyst (B) for curing the organopolyoxane component.

本發明中所使用之組份(B)較佳係通常稱為矽氫化反應觸媒者,且並無特定限制,前提係其係能夠促進矽氫化反應之物質。實例包含基於鉑之觸媒、基於銠之觸媒及基於鈀之觸媒。在該等觸媒中,由於觸媒活性較高,故尤其引用鉑族元素觸媒及鉑族元素化合物觸媒作為組份(B)。並不特定限制,基於鉑之觸媒例示為鉑精細粉末、鉑黑、氯鉑酸、醇改質氯鉑酸、氯鉑酸-二烯烴錯合物、烯烴-鉑錯合物;鉑-羰基錯合物,例如雙(乙醯乙酸)鉑、雙(乙醯基丙酮酸)鉑或諸如此類;氯鉑酸-烯基矽氧烷錯合物,例如氯鉑酸-二乙烯基四甲基二矽氧烷錯合物、氯鉑酸-四乙烯基四甲基環四矽氧烷錯合物或諸如此類;鉑-烯基矽氧烷錯合物,例如鉑-二乙烯基四甲基二矽氧烷錯合物、鉑-四乙烯基四甲基環四矽氧烷合物或諸如此類;及氯鉑酸與乙炔醇之間之錯合物。由於對矽氫化反應之觸媒活性較高,故組份(B)之推薦實例為鉑-烯基矽氧烷錯合物,且尤其為鉑1,3-二乙烯基-1.1,3,3-四甲基二矽氧烷錯合物。 The component (B) used in the present invention is preferably a compound which is generally referred to as a hydrazine hydrogenation reaction catalyst, and is not particularly limited, provided that it is a substance capable of promoting a hydrogenation reaction of hydrazine. Examples include platinum-based catalysts, ruthenium-based catalysts, and palladium-based catalysts. Among these catalysts, since the catalytic activity is high, a platinum group element catalyst and a platinum group element compound catalyst are particularly cited as the component (B). Without limitation, the platinum-based catalyst is exemplified by platinum fine powder, platinum black, chloroplatinic acid, alcohol modified chloroplatinic acid, chloroplatinic acid-diolefin complex, olefin-platinum complex; platinum-carbonyl a complex such as bis(acetonitrile) platinum, bis(ethylmercaptopyruvate) platinum or the like; a chloroplatinic acid-alkenyl alkoxylate complex such as chloroplatinic acid-divinyltetramethyl a oxane complex, a chloroplatinic acid-tetravinyltetramethylcyclotetraoxane complex or the like; a platinum-alkenyl alkane complex, such as platinum-divinyltetramethyldifluorene An oxane complex, a platinum-tetravinyltetramethylcyclotetraoxane complex or the like; and a complex between chloroplatinic acid and acetylene alcohol. The preferred example of component (B) is a platinum-alkenyl alkane complex, especially platinum 1,3-divinyl-1.1,3,3, due to the higher catalytic activity of the hydrogenation reaction. - Tetramethyldioxane complex.

另外,為進一步改良鉑-烯基矽氧烷錯合物之穩定性,可將該等鉑-烯基矽氧烷錯合物溶於諸如以下等有機矽氧烷寡聚物中:1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷、1,3-二烯丙基-1,1,3,3-四甲基二矽氧烷、1,3-二乙烯基-1,3-二甲基-1,3-二苯基二矽氧烷、1,3-二乙烯基-1,1,3,3-四苯基二矽氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷 或諸如此類之烯基矽氧烷寡聚物;或二甲基矽氧烷寡聚物;或諸如此類。特定而言,較佳使用溶於烯基矽氧烷寡聚物中之鉑-烯基矽氧烷錯合物。 Further, in order to further improve the stability of the platinum-alkenyl alkane complex, the platinum-alkenyl alkoxylate complex may be dissolved in an organic oxane oligomer such as: 1,3 -divinyl-1,1,3,3-tetramethyldioxane, 1,3-diallyl-1,1,3,3-tetramethyldioxane, 1,3- Divinyl-1,3-dimethyl-1,3-diphenyldioxane, 1,3-divinyl-1,1,3,3-tetraphenyldioxane, 1, 3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane Or an alkenyl alkoxy olefin oligomer such as; or a dimethyl methoxy olefin oligomer; or the like. In particular, a platinum-alkenyl alkoxylate complex dissolved in an alkenyloxyalkane oligomer is preferably used.

在無特定限制之情況下,組份(B)之利用量可為能夠促進本發明組合物之有機聚矽氧烷組份之加成反應的任何量。相對於有機聚矽氧烷組份之總質量,組份(B)中所含鉑族金屬原子(例如鉑原子)之濃度通常在0.01ppm至500ppm範圍內,較佳地在0.1ppm至100ppm範圍內,且尤佳地在0.1ppm至50ppm範圍內。 The component (B) may be utilized in any amount which is capable of promoting the addition reaction of the organopolyoxane component of the composition of the present invention, without particular limitation. The concentration of the platinum group metal atom (for example, platinum atom) contained in the component (B) is usually in the range of 0.01 ppm to 500 ppm, preferably in the range of 0.1 ppm to 100 ppm, based on the total mass of the organopolyoxane component. Internal, and particularly preferably in the range of 0.1 ppm to 50 ppm.

本發明之可固化之有機聚矽氧烷組合物之較佳實施例的一實例為包括以下必選成份之組合物:至少一種類型之在分子中具有至少兩個矽原子鍵結氫原子之反應性有機氫聚矽氧烷(A1),氫原子之重量分數為0.01重量%至2.0重量%;至少一種類型之具有超過200之重複單元數且在兩個分子末端具有烯基之反應性有機聚矽氧烷(A2);烯基之重量分數為0.05重量%至5.0重量%;矽氫化反應觸媒(B);及介電無機微粒(C1);其在1kHz及室溫下具有不小於10之比介電常數。 An example of a preferred embodiment of the curable organopolyoxane composition of the present invention is a composition comprising the following optional ingredients: at least one type of reaction having at least two ruthenium atoms bonded to a hydrogen atom in the molecule The organoorganohydropolysiloxane (A1) having a hydrogen atom weight fraction of 0.01% by weight to 2.0% by weight; at least one type of reactive organic polymer having a repeating unit number of more than 200 and having an alkenyl group at two molecular terminals a siloxane (A2); a weight fraction of an alkenyl group of 0.05% by weight to 5.0% by weight; a hydrogenation reaction catalyst (B); and a dielectric inorganic fine particle (C1); which has not less than 10 at 1 kHz and room temperature. The specific dielectric constant.

在此處,(A1)之較佳實例係在兩個分子末端經二甲基氫矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經三甲基矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷共聚物及在兩個分子末端經二甲基氫矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷共聚物。另一方面,(A2)之實例係在兩個分子末端經二甲基乙烯基矽氧基封端之聚二甲基矽氧烷、在兩個分子末端經二甲基乙烯基矽氧基封端之聚甲基苯基矽氧烷、在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基乙烯基矽氧烷共聚物及在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基矽氧烷/甲基苯基矽氧烷共聚物。為進一步優化材料特性(例如機械特性、介電特性、耐熱性及諸如此類),可使用乙基、丙基、丁基、己 基或苯基來取代聚合物之一部分甲基。 Here, a preferred example of (A1) is a polydimethyl methoxy alkane terminated with a dimethylhydroquinone group at the end of two molecules, and terminated with a trimethyl methoxy group at the end of two molecules. a dimethyl methoxy oxane/methylhydroquinoxane copolymer and a dimethyl methoxy oxane/methylhydroquinoxane copolymer terminated by a dimethylhydroquinone group at two molecular ends. On the other hand, an example of (A2) is a polydimethylsiloxane having a terminal end of two molecular groups terminated by dimethylvinyloxyl group, and a dimethylvinyl alkoxy group at the end of two molecules. a polymethylphenyl sulfoxane, a dimethyl methoxy oxane/methylvinyl decane copolymer terminated with a dimethylvinyl methoxy group at the end of two molecules, and at the end of two molecules a dimethyl methoxy oxane/methyl phenyl siloxane copolymer terminated with dimethylvinyl methoxy. To further optimize material properties (such as mechanical properties, dielectric properties, heat resistance, and the like), ethyl, propyl, butyl, and hexyl can be used. The base or phenyl group is substituted for a part of the methyl group of the polymer.

對(A1)及(A2)之分子量並不施加特定限制,只要氫原子之重量分數及烯基之重量分數在上述範圍內即可。然而,矽氧烷單元數較佳為5至1,500。 The molecular weight of (A1) and (A2) is not particularly limited as long as the weight fraction of the hydrogen atom and the weight fraction of the alkenyl group are within the above range. However, the number of units of the oxane is preferably from 5 to 1,500.

本發明之可固化之有機聚矽氧烷組合物可進一步提供有下述特性。 The curable organopolyoxane composition of the present invention can be further provided with the following characteristics.

本發明之可固化之有機聚矽氧烷組合物亦可含有至少一種類型之平均初級顆粒直徑小於50nm之無機微粒。 The curable organopolyoxane composition of the present invention may also contain at least one type of inorganic particulate having an average primary particle diameter of less than 50 nm.

至少一種類型之平均初級顆粒直徑小於50nm之無機微粒之功能及諸如此類並無特定限制,前提係平均初級顆粒直徑小於50nm,且甚至可使用所謂的奈米碳材料(例如單層、雙層及多層碳奈米管、富勒烯、金屬囊封之富勒烯、單層及多層石墨烯、碳奈米纖維及諸如此類)作為介電無機顆粒。 The function of at least one type of inorganic fine particles having an average primary particle diameter of less than 50 nm and the like are not particularly limited, provided that the average primary particle diameter is less than 50 nm, and even so-called nanocarbon materials (for example, single layer, double layer, and multilayer) may be used. Carbon nanotubes, fullerenes, metal-encapsulated fullerenes, single-layer and multi-layer graphene, carbon nanofibers and the like are used as dielectric inorganic particles.

至少一種類型之平均初級顆粒直徑小於50nm之無機微粒之較佳實例係增強無機微粒,其例示為發煙二氧化矽、濕潤二氧化矽、經研磨二氧化矽、碳酸鈣、矽藻土、精細研磨石英、各種類型之除氧化鋁-氧化鋅外之金屬氧化物粉末、玻璃纖維、碳纖維及諸如此類。另外,其可在使用下文所闡述之各種類型之表面處理劑處理之後使用。其中,尤其推薦二氧化矽。 Preferred examples of at least one type of inorganic fine particles having an average primary particle diameter of less than 50 nm are reinforcing inorganic fine particles, which are exemplified by fumed cerium oxide, wet cerium oxide, ground cerium oxide, calcium carbonate, diatomaceous earth, fine Grinding quartz, various types of metal oxide powders other than alumina-zinc oxide, glass fibers, carbon fibers, and the like. Additionally, it can be used after treatment with various types of surface treatment agents as set forth below. Among them, cerium oxide is especially recommended.

自機械強度改良之角度考慮,較佳實例係平均初級顆粒直徑不大於10nm、比表面積不小於50m2/g且不大於300m2/g之部分聚集之發煙二氧化矽。另外,自可分散性改良之角度考慮,使用下述矽烷偶合劑處理之發煙二氧化矽較佳。然而,若可固化之有機聚矽氧烷(A)係加成可固化,則並不使用經矽氮烷表面處理之發煙二氧化矽作為增強無機顆粒。該等增強無機顆粒可以單一類型使用,或可以兩種或更多種類型之組合使用。 From the viewpoint of mechanical strength improvement, preferred examples are partially concentrated fumed cerium oxide having an average primary particle diameter of not more than 10 nm and a specific surface area of not less than 50 m 2 /g and not more than 300 m 2 /g. Further, from the viewpoint of improvement in dispersibility, fumed cerium oxide treated with the following decane coupling agent is preferred. However, if the curable organopolyoxane (A) is additive curable, the cerium-doped surface treated fumed cerium oxide is not used as the reinforcing inorganic particles. The reinforcing inorganic particles may be used in a single type or may be used in combination of two or more types.

藉由將增強無機微粒摻和至組合物中,可增加有機聚矽氧烷固化產物之機械強度及介電崩潰強度。該等增強無機微粒相對於可固化之有機聚矽氧烷組合物之摻和量較佳地在0.1質量%至30質量%範圍內,且更佳地在0.1質量%至10質量%範圍內。在摻和量背離上述較佳範圍時,不能獲得摻和無機微粒之效應或可固化之有機聚矽氧烷組合物之模製處理性可有所降低。 By blending the reinforcing inorganic particles into the composition, the mechanical strength and dielectric collapse strength of the organopolyoxyalkylene cured product can be increased. The blending amount of the reinforcing inorganic fine particles with respect to the curable organopolyoxane composition is preferably in the range of 0.1% by mass to 30% by mass, and more preferably in the range of 0.1% by mass to 10% by mass. When the blending amount deviates from the above preferred range, the effect of not incorporating the inorganic fine particles or the moldable processability of the curable organopolyoxane composition can be lowered.

可使用一或多個類型之表面處理劑對本發明之可固化之有機聚矽氧烷組合物中所使用的部分或所有無機微粒(不論顆粒直徑、功能或諸如此類如何)進行表面處理。表面處理之類型可為親水性處理或疏水化處理且並無特定限制,但疏水化處理較佳。在使用經受疏水化處理之無機微粒時,可以高填充比率將無機微粒分散至有機聚矽氧烷組合物中。另外,組合物之黏度增加受阻抑,且模製可處理性有所改良。 One or more types of surface treatment agents may be used to surface treat some or all of the inorganic particulates (regardless of particle diameter, function, or the like) used in the curable organopolyoxyalkylene composition of the present invention. The type of the surface treatment may be a hydrophilic treatment or a hydrophobization treatment and is not particularly limited, but a hydrophobizing treatment is preferred. When the inorganic fine particles subjected to the hydrophobization treatment are used, the inorganic fine particles can be dispersed into the organopolyoxane composition at a high filling ratio. In addition, the viscosity increase of the composition is suppressed, and the mold processability is improved.

表面處理可藉由使用表面處理劑處理(或塗覆處理)無機微粒來實施。用於疏水化之表面處理劑例示為至少一種類型之選自由以下組成之群之表面處理劑:有機鈦化合物、有機矽化合物、有機鋯化合物、有機鋁化合物及有機磷化合物。表面處理劑可以單一類型或以兩種或更多種類型之組合使用。 The surface treatment can be carried out by treating (or coating) the inorganic fine particles with a surface treating agent. The surface treatment agent for hydrophobization is exemplified by at least one type of surface treatment agent selected from the group consisting of an organotitanium compound, an organic cerium compound, an organozirconium compound, an organoaluminum compound, and an organophosphorus compound. The surface treatment agents may be used singly or in combination of two or more types.

有機鈦化合物例示為諸如以下等偶合劑:烷氧基鈦、鈦螯合物、丙烯酸鈦或諸如此類。該等化合物中之較佳偶合劑例示為烷氧基鈦化合物,例如鈦酸四異丙基酯或諸如此類;及鈦螯合物,例如四異丙基雙(二辛基磷酸酯)鈦酸酯或諸如此類。 The organotitanium compound is exemplified by a coupling agent such as titanium alkoxide, titanium chelate, titanium acrylate or the like. Preferred coupling agents in such compounds are exemplified by titanium alkoxide compounds such as tetraisopropyl titanate or the like; and titanium chelates such as tetraisopropylbis(dioctyl phosphate) titanate or And so on.

有機矽化合物例示為低分子量有機矽化合物,例如矽烷、矽氮烷、矽氧烷或諸如此類;及有機矽聚合物或寡聚物,例如聚矽氧烷、聚碳矽氧烷或諸如此類。較佳矽烷例示為所謂的矽烷偶合劑。該等矽烷偶合劑之代表性實例包含烷基三烷氧基矽烷(例如甲基三甲氧基矽 烷、乙烯基三甲氧基矽烷、己基三甲氧基矽烷、辛基三甲氧基矽烷或諸如此類)、含有有機官能基之三烷氧基矽烷(例如縮水甘油氧基丙基三甲氧基矽烷、環氧基環己基乙基三甲氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、胺基丙基三甲氧基矽烷或諸如此類)。較佳矽氧烷及聚矽氧烷包含六甲基二矽氧烷、1,3-二己基-四甲基二矽氧烷、在一分子末端經三烷氧基矽烷基封端之聚二甲基矽氧烷、在一分子末端經三烷氧基矽烷基封端且在另一分子末端經二甲基乙烯基封端之聚二甲基矽氧烷、在一分子末端經三烷氧基矽烷基封端且在另一分子末端經有機官能基封端之聚二甲基矽氧烷、在兩個分子末端經三烷氧基矽烷基封端之聚二甲基矽氧烷、在兩個分子末端經有機官能基封端之聚二甲基矽氧烷或諸如此類。在此情形下之矽氧烷鍵數n較佳為2至150。矽氮烷之較佳實例包含六甲基二矽氮烷、1,3-二己基-四甲基二矽氮烷及諸如此類。較佳聚碳矽氧烷例示為在聚合物主鏈中具有Si-C-C-Si-O鍵之聚合物。 The organic ruthenium compound is exemplified as a low molecular weight organic ruthenium compound such as decane, decane, decane or the like; and an organic ruthenium polymer or oligomer such as polyoxyalkylene, polycarbazane or the like. Preferred decanes are exemplified by the so-called decane coupling agents. Representative examples of such decane coupling agents include alkyl trialkoxy decanes (e.g., methyltrimethoxy fluorene). Alkane, vinyltrimethoxynonane, hexyltrimethoxydecane, octyltrimethoxydecane or the like), alkoxy decane containing an organofunctional group (for example, glycidoxypropyltrimethoxydecane, epoxy) Cyclohexylethyltrimethoxydecane, methacryloxypropyltrimethoxydecane, aminopropyltrimethoxydecane or the like). Preferably, the decane and the polyoxyalkylene comprise hexamethyldioxane, 1,3-dihexyl-tetramethyldioxane, and a polyalkylene terminated by a trialkoxyalkylene group at one terminal. a methyloxane, a polydimethyloxane terminated with a trialkoxyalkylene group at one molecule and terminated with a dimethylvinyl group at the other end of the molecule, and a trialkoxy group at the end of one molecule. a polydimethyl methoxy alkane terminated by an alkyl group and terminated with an organic functional group at the other molecular end, and a polydimethyl methoxy alkane terminated by a trialkoxy fluorenyl group at the end of two molecules, Two polydimethylsiloxanes terminated at the end of the molecule via an organofunctional group or the like. The number n of the oxane bonds in this case is preferably from 2 to 150. Preferred examples of the decane alkane include hexamethyldioxane, 1,3-dihexyl-tetramethyldiazepine, and the like. Preferred polycarbomethoxyanes are exemplified as polymers having Si-C-C-Si-O linkages in the polymer backbone.

有機鋯化合物例示為烷氧基鋯化合物(例如四異丙氧基鋯或諸如此類)及鋯螯合物。 The organic zirconium compound is exemplified by an alkoxy zirconium compound (e.g., tetraisopropoxy zirconium or the like) and a zirconium chelate.

有機鋁化合物例示為烷氧基鋁及鋁螯合物。 The organoaluminum compound is exemplified by aluminum alkoxide and aluminum chelate.

有機磷化合物例示為亞磷酸酯、磷酸酯及磷酸螯合物。 The organophosphorus compound is exemplified by a phosphite, a phosphate, and a phosphoric acid chelate.

在該等表面處理劑中,有機矽化合物較佳。在該等有機矽化合物中,矽烷、矽氧烷及聚矽氧烷較佳。如先前所闡述,最佳使用在一分子末端經三烷氧基矽烷基封端之烷基三烷氧基矽烷及聚二甲基矽氧烷。 Among these surface treatment agents, an organic ruthenium compound is preferred. Among these organic ruthenium compounds, decane, decane and polyoxane are preferred. As explained previously, it is preferred to use an alkyltrialkoxydecane and a polydimethyloxane which are terminated at the molecular end with a trialkoxyalkylene group.

表面處理劑對無機微粒總量之比例較佳地不小於0.1質量%且不大於10質量%,且更佳地不小於0.3質量%且不大於5質量%。另外,處理濃度係所供給無機顆粒對所供給表面處理劑之比率,且較佳地在處理之後去除過量表面處理劑。 The ratio of the surface treating agent to the total amount of the inorganic fine particles is preferably not less than 0.1% by mass and not more than 10% by mass, and more preferably not less than 0.3% by mass and not more than 5% by mass. Further, the treatment concentration is the ratio of the supplied inorganic particles to the supplied surface treatment agent, and preferably the excess surface treatment agent is removed after the treatment.

本發明之可固化之有機聚矽氧烷組合物可進一步包括用於改良脫模性或介電崩潰特性之添加劑。可有利地使用藉由將此有機聚矽氧烷組合物固化為薄片獲得之電活性聚矽氧彈性體片作為構成轉換器之電活性膜(介電層或電極層)。然而,在聚矽氧彈性體片在薄膜模製期間之脫模性較差時,且尤其在以高速產生介電膜時,介電膜可因脫模而受損。然而,本發明之可固化之有機聚矽氧烷組合物具有極佳脫模性,且由此該可固化之有機聚矽氧烷組合物之有利之處在於可在不使膜受損的情況下改良膜之產生速度。此添加劑進一步改良本發明之可固化之有機聚矽氧烷組合物之該等特徵,且此添加劑可以單一類型或以兩種或更多種類型之組合使用。另一方面,根據添加劑之名稱,使用改良介電崩潰特性之添加劑來改良藉由固化獲得之聚矽氧彈性體片之介電崩潰強度。 The curable organopolyoxane composition of the present invention may further comprise an additive for improving mold release or dielectric breakdown characteristics. An electroactive polysiloxane elastomer sheet obtained by curing the organopolyoxane composition into a sheet can be advantageously used as an electroactive film (dielectric layer or electrode layer) constituting the converter. However, when the release property of the polyoxyxene elastomer sheet during film molding is poor, and particularly when a dielectric film is produced at a high speed, the dielectric film may be damaged by demolding. However, the curable organopolyoxane composition of the present invention has excellent mold release property, and thus the curable organopolyoxane composition is advantageous in that it does not damage the film. The rate at which the film is produced is improved. This additive further improves these characteristics of the curable organopolyoxane composition of the present invention, and the additive may be used singly or in combination of two or more types. On the other hand, according to the name of the additive, an additive which improves dielectric breakdown characteristics is used to improve the dielectric breakdown strength of the polyoxyxene elastomer sheet obtained by curing.

可使用之脫模改良添加劑(亦即脫模劑)例示為基於羧酸之脫模劑、基於酯之脫模劑、基於醚之脫模劑、基於酮之脫模劑、基於醇之脫模劑、基於氟之脫模劑及諸如此類。該等脫模劑可以單一類型單獨使用或可以兩種或更多種類型之組合使用。另外,儘管脫模劑不含矽原子,但亦可使用含有矽原子之脫模劑,或可使用該等脫模劑之混合物。 The mold release improving additive (that is, the release agent) which can be used is exemplified as a carboxylic acid-based release agent, an ester-based release agent, an ether-based release agent, a ketone-based release agent, and an alcohol-based release agent. Agent, fluorine-based release agent and the like. These release agents may be used singly in a single type or in combination of two or more types. Further, although the releasing agent does not contain a halogen atom, a releasing agent containing a halogen atom may be used, or a mixture of the releasing agents may be used.

不含矽原子之脫模劑可選自(例如)由以下組成之群:飽和或不飽和脂肪族羧酸,例如棕櫚酸、硬脂酸或諸如此類;該等脂肪族羧酸之鹼金屬鹽(例如硬脂酸鈉、硬脂酸鎂、硬脂酸鈣或諸如此類);脂肪族羧酸與醇之酯(例如硬脂酸2-乙基己基酯、甘油三硬脂酸酯、新戊四醇單硬脂酸酯或諸如此類)、脂肪族烴(液體石蠟、石蠟或諸如此類)、醚(二硬脂基醚或諸如此類)、酮(二硬脂基酮或諸如此類)、高碳數醇(2-十六烷基十八醇或諸如此類)及該等化合物之混合物。 The release agent containing no halogen atoms may be selected, for example, from the group consisting of saturated or unsaturated aliphatic carboxylic acids such as palmitic acid, stearic acid or the like; alkali metal salts of such aliphatic carboxylic acids ( For example, sodium stearate, magnesium stearate, calcium stearate or the like; esters of aliphatic carboxylic acids with alcohols (eg 2-ethylhexyl stearate, glyceryl tristearate, neopentyl alcohol) Monostearate or the like), an aliphatic hydrocarbon (liquid paraffin, paraffin or the like), an ether (distearyl ether or the like), a ketone (distearyl ketone or the like), a high carbon number alcohol (2- Cetylstearyl alcohol or the like and mixtures of such compounds.

含有矽原子之脫模劑較佳係基於聚矽氧之不可固化脫模劑。該 等基於聚矽氧之脫模劑之具體實例包含非有機改質聚矽氧油,例如聚二甲基矽氧烷、聚甲基苯基矽氧烷、聚(二甲基矽氧烷-甲基苯基矽氧烷)共聚物、聚(二甲基矽氧烷-甲基(3,3,3-三氟丙基)矽氧烷共聚物或諸如此類;及改質聚矽氧油,例如胺基改質聚矽氧、胺基聚醚改質聚矽氧、環氧基改質聚矽氧、羧基改質聚矽氧、聚氧基伸烷基改質聚矽氧或諸如此類。該等基於聚矽氧之脫模劑可具有任何結構,例如直鏈、部分具支鏈之直鏈或環狀型結構。另外,對該等聚矽氧油之25℃下黏度並不施加特定限制。此黏度較佳地在10mPa s至100,000mPa s範圍內,且尤佳地在50mPa s至10,000mPa s範圍內。 The release agent containing a ruthenium atom is preferably a polyfluorene-based non-curable release agent. The Specific examples of polyoxo-based release agents include non-organic modified polyoxyxides such as polydimethylsiloxane, polymethylphenyloxane, poly(dimethyloxane-methyl) Phenyl phenyl oxyalkylene) copolymer, poly(dimethyl methoxy oxane-methyl (3,3,3-trifluoropropyl) decane copolymer or the like; and modified polyoxyl oil, for example Amine-based modified polyfluorene oxide, amino polyether modified polyfluorene oxide, epoxy modified polyoxynium, carboxyl modified polyoxyn, polyoxyalkylene modified polyoxyl or the like. The polyoxon release agent may have any structure such as a linear, partially branched linear or cyclic structure. Further, the viscosity of the polyoxygenated oil at 25 ° C is not subject to specific restrictions. The viscosity is preferably in the range of 10 mPa s to 100,000 mPa s, and particularly preferably in the range of 50 mPa s to 10,000 mPa s.

儘管對脫模改良添加劑之摻和量並不施加特定限制,但相對於可固化之有機聚矽氧烷組合物之總量,此量較佳地不小於0.1質量%且不大於30質量%。 Although no particular limitation is imposed on the blending amount of the demolding improving additive, the amount is preferably not less than 0.1% by mass and not more than 30% by mass based on the total amount of the curable organopolyoxane composition.

另一方面,介電崩潰特性改良劑較佳係電絕緣改良劑。介電崩潰特性改良劑例示為鋁或鎂氫氧化物或鹽、黏土礦物質及該等物質之混合物。具體而言,介電崩潰特性改良劑可選自由以下組成之群:矽酸鋁、硫酸鋁、氫氧化鋁、氫氧化鎂、煅燒黏土、蒙脫石、水滑石、滑石及該等試劑之混合物。另外,在可能需要時,可藉由表面處理方法對此絕緣改良劑進行表面處理。 On the other hand, the dielectric breakdown property improver is preferably an electrical insulation improver. The dielectric breakdown property improver is exemplified by aluminum or magnesium hydroxide or a salt, clay mineral, and a mixture of such materials. Specifically, the dielectric breakdown property modifier may be selected from the group consisting of aluminum citrate, aluminum sulfate, aluminum hydroxide, magnesium hydroxide, calcined clay, montmorillonite, hydrotalcite, talc, and mixtures thereof. . In addition, the insulation modifier may be surface treated by a surface treatment method as may be required.

儘管對絕緣改良添加劑之摻和量並不施加特定限制,但相對於可固化之有機聚矽氧烷組合物之總量,此量較佳地不小於0.1質量%且不大於30質量%。 Although no particular limitation is imposed on the blending amount of the insulating modified additive, the amount is preferably not less than 0.1% by mass and not more than 30% by mass based on the total amount of the curable organopolyoxane composition.

本發明之可固化之有機聚矽氧烷組合物可包括具有不同於反應性有機聚矽氧烷之高介電官能基的其他有機聚矽氧烷。 The curable organopolyoxane composition of the present invention may comprise other organopolyoxane having a different high dielectric functional group than the reactive organopolyoxane.

以相同方式,本發明之可固化之有機聚矽氧烷組合物可進一步包括在分子中包括具有高介電官能基及至少一個能夠以縮合固化反應、加成固化反應、過氧化固化反應或光固化反應進行反應之基團的 化合物。藉由固化反應將此高介電官能基引入所獲得之固化產物(亦即電活性聚矽氧彈性體)中。 In the same manner, the curable organopolyoxane composition of the present invention may further comprise including a high dielectric functional group in the molecule and at least one capable of undergoing a condensation curing reaction, an addition curing reaction, a peroxidation curing reaction or light. Curing reaction Compound. This high dielectric functional group is introduced into the obtained cured product (i.e., electroactive polysiloxane elastomer) by a curing reaction.

對於本發明之可固化之有機聚矽氧烷組合物而言,反應性有機聚矽氧烷之一部分或全部可為進一步具有高介電官能基之反應性有機聚矽氧烷。 For the curable organopolyoxane composition of the present invention, part or all of the reactive organopolyoxane may be a reactive organopolyoxane further having a high dielectric functional group.

若將藉由固化本發明之可固化之有機聚矽氧烷組合物獲得之聚矽氧彈性體用於介電層,則介電層之比介電常數較佳地較高,且可引入高介電官能基以改良彈性體之比介電常數。 If a polyoxyxene elastomer obtained by curing the curable organopolyoxane composition of the present invention is used for a dielectric layer, the dielectric constant of the dielectric layer is preferably higher and can be introduced high. Dielectric functional groups to improve the specific dielectric constant of the elastomer.

具體而言,可藉由例如以下方法增加可固化之有機聚矽氧烷組合物及藉由固化可固化之有機聚矽氧烷組合物獲得之固化聚矽氧彈性體的介電性質:向可固化之有機聚矽氧烷組合物中添加賦予高介電性質之組份,將賦予高介電性質之基團引入構成可固化之有機聚矽氧烷組合物之有機聚矽氧烷組份中,或該等方法之組合。該等具體實施例及能夠引入之高介電官能基將於下文中予以闡釋。 Specifically, the dielectric properties of the curable polyoxyxene elastomer obtained by curing the curable organopolyoxane composition and the cured curable organopolyoxane composition can be increased by, for example, the following method: A component imparting high dielectric properties is added to the cured organopolyoxane composition, and a group imparting high dielectric properties is introduced into the organopolyoxane component constituting the curable organopolyoxane composition. , or a combination of these methods. These specific examples and the high dielectric functional groups that can be introduced are explained below.

在第一實施例中,可固化之有機聚矽氧烷組合物係包括具有高介電基團之有機矽化合物之可固化之有機聚矽氧烷組合物。在此可固化組合物中,可固化組合物中所含有之部分或所有反應性有機聚矽氧烷係進一步具有高介電官能基之反應性有機聚矽氧烷,且藉由固化獲得之聚矽氧彈性體之比介電常數有所增加。 In a first embodiment, the curable organopolyoxane composition comprises a curable organopolyoxane composition comprising an organic cerium compound having a high dielectric group. In the curable composition, a part or all of the reactive organopolyoxyalkylene contained in the curable composition further has a high dielectric functional reactive organopolysiloxane, and the polymer obtained by curing The specific dielectric constant of the cerium oxide elastomer is increased.

在第二實施例中,藉由將具有高介電基團之有機矽化合物添加至可固化之有機聚矽氧烷組合物中,藉由固化獲得之聚矽氧彈性體之比介電常數有所增加。具有高介電基團之有機矽化合物可與此可固化組合物中用於固化之組份分開添加。 In the second embodiment, by adding an organic germanium compound having a high dielectric group to the curable organopolyoxane composition, the specific dielectric constant of the polyoxyxene elastomer obtained by curing has Increased. An organic cerium compound having a high dielectric group can be added separately from the component for curing in the curable composition.

在第三實施例中,將具有高介電基團及與可固化組合物中所含有之反應性有機聚矽氧烷反應之官能基的有機化合物添加至可固化之有機聚矽氧烷組合物中,由此增加藉由固化獲得之聚矽氧彈性體之比 介電常數。由於有機化合物之與此可固化組合物中之反應性有機聚矽氧烷反應之官能基,在該有機化合物與該有機聚矽氧烷之間形成鍵,由此將高介電基團引入藉由固化獲得之聚矽氧彈性體中。 In a third embodiment, an organic compound having a high dielectric group and a functional group reactive with a reactive organic polyoxyalkylene contained in the curable composition is added to the curable organopolyoxane composition Thereby increasing the ratio of the polysiloxane elastomer obtained by curing Dielectric constant. Due to the functional group of the organic compound reacting with the reactive organopolyoxane in the curable composition, a bond is formed between the organic compound and the organopolyoxane, thereby introducing a high dielectric group In the polyoxynene elastomer obtained by curing.

在本發明之第四實施例中,藉由將可與可固化之有機聚矽氧烷組合物混溶且具有高介電基團之有機化合物添加至可固化之有機聚矽氧烷組合物中,藉由固化獲得之聚矽氧彈性體之比介電常數有所增加。由於此可固化組合物中有機化合物與有機聚矽氧烷之間之可混溶性,將具有該等高介電基團之有機化合物納入藉由固化獲得之聚矽氧彈性體之基質中。 In a fourth embodiment of the present invention, an organic compound which is miscible with the curable organopolyoxane composition and has a high dielectric group is added to the curable organopolyoxane composition. The specific dielectric constant of the polyoxyxene elastomer obtained by curing is increased. Due to the miscibility between the organic compound and the organopolyoxane in the curable composition, the organic compound having the high dielectric groups is incorporated into the matrix of the polysiloxane elastomer obtained by curing.

對本發明中之高介電基團並無特定限制,且高介電基團可為與不含該基團時之介電性質相比,能夠增加藉由固化本發明之可固化之有機聚矽氧烷組合物獲得之所獲得固化產物之介電性質的任何基團。在不受限制的情況下,本發明中所使用高介電基團之實例列示於下文中。 There is no particular limitation on the high dielectric group in the present invention, and the high dielectric group can increase the curable organic polycondensation by curing the present invention as compared with the dielectric property when the group is not contained. Any group of dielectric properties of the cured product obtained obtained from the oxyalkylene composition. Examples of high dielectric groups used in the present invention are listed below without limitation.

a)鹵素原子及含有鹵素原子之基團 a) a halogen atom and a group containing a halogen atom

對鹵素原子並無特定限制,且鹵素原子例示為氟原子及氯原子。可選擇含有鹵素原子之基團作為具有一或多個一或多種類型之選自氟原子及氯原子之原子之有機基團,如例示為經鹵素取代之烷基、經鹵素取代之芳基及經鹵素取代之芳基烷基。含有鹵素之有機基團之具體實例包含但不限於氯甲基、3-氯丙基、3,3,3-三氟丙基及全氟烷基。藉由引入該等基團,亦可預期改良本發明組合物及自組合物獲得之固化產物之脫模性。 The halogen atom is not particularly limited, and the halogen atom is exemplified by a fluorine atom and a chlorine atom. A group containing a halogen atom may be selected as an organic group having one or more types of atoms selected from a fluorine atom and a chlorine atom, such as an alkyl group substituted by a halogen, an aryl group substituted with a halogen, and An arylalkyl group substituted with a halogen. Specific examples of the organic group containing a halogen include, but are not limited to, a chloromethyl group, a 3-chloropropyl group, a 3,3,3-trifluoropropyl group, and a perfluoroalkyl group. By introducing such groups, it is also contemplated to improve the release properties of the compositions of the invention and the cured products obtained from the compositions.

b)含有氮原子之基團 b) a group containing a nitrogen atom

含有氮原子之基團例示為硝基、氰基(例如氰基丙基及氰基乙基)、醯胺基、亞胺基、脲基、硫脲基及異氰酸酯基團。 The group containing a nitrogen atom is exemplified by a nitro group, a cyano group (for example, a cyanopropyl group and a cyanoethyl group), a decylamino group, an imido group, a urea group, a thiourea group, and an isocyanate group.

c)含有氧原子之基團 c) a group containing an oxygen atom

含有氧原子之基團例示為醚基團、羰基及酯基團。 The group containing an oxygen atom is exemplified by an ether group, a carbonyl group, and an ester group.

d)雜環基團 d) heterocyclic groups

雜環基團例示為咪唑基團、吡啶基團、呋喃基團、吡喃基團、噻吩基團、酞青素基團及該等基團之複合物。 The heterocyclic group is exemplified by an imidazole group, a pyridyl group, a furan group, a pyran group, a thiophene group, an anthraquinone group, and a complex of such groups.

e)含硼基團 e) boron-containing groups

含硼基團例示為硼酸酯基團及硼酸鹽基團。 Boron-containing groups are exemplified as borate groups and borate groups.

f)含磷基團 f) phosphorus-containing groups

含磷基團例示為膦基團、氧化膦基團、膦酸酯基團、亞磷酸酯基團及磷酸酯基團。 Phosphorus-containing groups are exemplified by phosphine groups, phosphine oxide groups, phosphonate groups, phosphite groups, and phosphate groups.

g)含硫基團 g) sulfur-containing groups

含硫基團例示為硫醇基團、硫醚基團、亞碸基團、碸基團、硫酮基團、磺酸酯基團及磺醯胺基團。 Sulfur-containing groups are exemplified by thiol groups, thioether groups, anthracene groups, anthracene groups, thioketone groups, sulfonate groups, and sulfonamide groups.

本發明之可固化之有機聚矽氧烷組合物可包括通常摻和於有機聚矽氧烷組合物中之添加劑。只要不損害本發明之可固化之有機聚矽氧烷組合物之目標,可摻和任何添加劑,例如固化阻滯劑(固化阻抑劑)、阻燃劑、耐熱改良劑、著色劑、溶劑或諸如此類。若可固化之有機聚矽氧烷組合物係加成反應可固化型有機聚矽氧烷組合物,則固化阻滯劑(固化阻抑劑)例示為(但不限於)炔烴醇,例如2-甲基-3-丁炔-2-醇、3,5-二甲基-1-己炔-3-醇、2-苯基-3-丁炔-2-醇或諸如此類;烯炔化合物,例如3-甲基-3-戊烯-1-炔、3,5-二甲基-3-己烯-1-炔或諸如此類;及苯并三唑。相對於總組合物(以質量計),固化阻滯劑(固化阻抑劑)之所利用濃度較佳地在1ppm至50,000ppm範圍內。 The curable organopolyoxane composition of the present invention may comprise an additive typically incorporated into an organopolyoxane composition. Any additive such as a curing retarder (curing inhibitor), a flame retardant, a heat resistance improver, a colorant, a solvent or may be blended as long as the object of the curable organopolyoxane composition of the present invention is not impaired. And so on. If the curable organopolyoxane composition is an addition reaction curable organopolyoxane composition, the curing retarder (curing inhibitor) is exemplified by, but not limited to, an alkyne alcohol, for example, 2 -methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol or the like; an enyne compound, For example, 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexene-1-yne or the like; and benzotriazole. The concentration of the curing retarder (curing inhibitor) is preferably in the range of 1 ppm to 50,000 ppm with respect to the total composition (by mass).

只要不損害本發明之目標,可藉由組合本發明之用於轉換器之可固化之有機聚矽氧烷組合物與除該有機聚矽氧烷外之聚合物來進行雜合。藉由將有機聚矽氧烷與介電常數高於有機聚矽氧烷之聚合物雜合,可增加本發明組合物及自該組合物獲得之固化產物之介電常數。 雜合涵蓋有機聚矽氧烷與非有機聚矽氧烷聚合物之所謂的聚合物摻和及藉由將有機聚矽氧烷與其他聚合物鍵結在一起形成之熔接聚合物(亦即所謂的共聚物)。 Hybridization can be carried out by combining the curable organopolyoxane composition for a converter of the present invention with a polymer other than the organopolyoxane, as long as the object of the present invention is not impaired. By intermingling the organopolyoxane with a polymer having a higher dielectric constant than the organopolyoxane, the dielectric constant of the composition of the present invention and the cured product obtained from the composition can be increased. Hybrids encompass so-called polymer blending of organic polyoxyalkylenes with non-organic polyoxyalkylene polymers and fusion polymers formed by bonding organopolysiloxanes to other polymers (also known as so-called fusion polymers) Copolymer).

本發明之可固化之有機聚矽氧烷組合物之固化類型可為縮合固化、加成固化、過氧化固化或光固化,然而,加成可固化之有機聚矽氧烷組合物較佳。在此可固化系統中,可根據引入上述介電官能基之方法,將丙烯酸基團、甲基丙烯酸基團、環氧基或硫醇基團引入可固化之有機聚矽氧烷組合物中之有機聚矽氧烷分子鏈中。除加成固化反應外,藉由使用此光可固化部分或電子束可固化部分,亦可使用光固化反應或電子束固化反應。若使用該等組合反應,則可將能夠藉由光或電子束固化之稱為單體及/或寡聚物之化合物(例如(甲基)丙烯酸酯及多官能(甲基)丙烯酸酯化合物)進一步添加至可固化組合物中。另外,可添加所謂的光敏劑。 The curing type of the curable organopolyoxane composition of the present invention may be condensation curing, addition curing, peroxidation curing or photocuring, however, the addition curable organopolyoxane composition is preferred. In this curable system, an acrylic group, a methacrylic group, an epoxy group or a thiol group can be introduced into the curable organopolyoxane composition according to the method of introducing the above-mentioned dielectric functional group. The organic polyoxane is in the molecular chain. In addition to the addition curing reaction, a photocuring reaction or an electron beam curing reaction may also be used by using the photocurable portion or the electron beam curable portion. When such a combination reaction is used, a compound called a monomer and/or an oligomer (for example, a (meth) acrylate and a polyfunctional (meth) acrylate compound) which can be cured by light or electron beam can be used. Further added to the curable composition. In addition, a so-called photosensitizer can be added.

在將作為藉由至少部分地固化本發明之可固化之有機聚矽氧烷組合物所獲得轉換器之構件的介電聚矽氧彈性體熱模製成2.0mm厚度片時,其具有下文列示之如基於JIS K 6249所量測之機械性質。 When a dielectric polyoxyxene elastomer as a member of a converter obtained by at least partially curing the curable organopolyoxane composition of the present invention is hot molded into a 2.0 mm thick sheet, it has the following columns It is shown as a mechanical property measured based on JIS K 6249.

(1)室溫下之楊氏模數(MPa)可設定於0.1MPa至10MPa範圍內,且尤佳範圍為0.1MPa至2.5MPa。 (1) The Young's modulus (MPa) at room temperature can be set in the range of 0.1 MPa to 10 MPa, and particularly preferably in the range of 0.1 MPa to 2.5 MPa.

(2)室溫下之撕裂強度(N/mm)可設定為不小於1N/mm及尤佳地不小於2N/mm。 (2) The tear strength (N/mm) at room temperature may be set to not less than 1 N/mm and particularly preferably not less than 2 N/mm.

(3)室溫下之撕裂強度(MPa)可設定為不小於1MPa及尤佳地不小於2MPa。 (3) The tear strength (MPa) at room temperature may be set to not less than 1 MPa and particularly preferably not less than 2 MPa.

(4)斷裂伸長率(%)可設定為不小於200%,且自轉換器位移量之角度考慮,尤佳地在200%至1,000%範圍內。 (4) The elongation at break (%) may be set to not less than 200%, and is particularly preferably in the range of 200% to 1,000% from the viewpoint of the displacement amount of the converter.

作為藉由固化本發明之可固化之有機聚矽氧烷組合物所獲得轉換器之構件的介電聚矽氧彈性體具有下文所列示介電特性。 The dielectric polyoxyxene elastomer as a member of the converter obtained by curing the curable organopolyoxane composition of the present invention has the dielectric properties listed below.

(1)在將可固化之有機聚矽氧烷組合物熱模製成0.07mm厚度片時,介電崩潰強度(V/微米)可設定為不小於20V/微米。儘管較佳介電崩潰強度將根據轉換器之應用而變化,但介電崩潰強度尤佳地在不小於30V/微米範圍內。 (1) When the curable organopolyoxane composition is thermoformed into a 0.07 mm thick sheet, the dielectric collapse strength (V/micron) can be set to not less than 20 V/micron. Although the preferred dielectric breakdown strength will vary depending on the application of the converter, the dielectric breakdown strength is particularly preferably in the range of not less than 30 V/micron.

(2)在將可固化之有機聚矽氧烷組合物熱模製成1mm厚度片時,在1MHz量測頻率及23℃量測溫度下所量測之比介電常數可設定為不小於3.0。儘管較佳比介電常數將根據介電層之所需形式及轉換器類型而改變,但在上述量測條件下比介電常數之尤佳範圍係不小於5.0。 (2) When the curable organopolyoxane composition is hot-molded into a 1 mm-thick sheet, the specific dielectric constant measured at a measurement frequency of 1 MHz and a measurement temperature of 23 ° C can be set to not less than 3.0. . Although the preferred specific dielectric constant will vary depending on the desired form of the dielectric layer and the type of converter, a preferred range of specific dielectric constants under the above-described measurement conditions is not less than 5.0.

本發明之可固化之有機聚矽氧烷組合物可藉由以下方式來產生:在擠出機或捏合機(更具體而言,至少一種類型之選自由以下組成之群之機械部件:雙螺桿擠出機、雙螺桿捏合機及單葉型擠出機)中捏合可固化之有機聚矽氧烷組份、固化觸媒、在1kHz及室溫下比介電常數不小於10之介電無機微粒及視情況至少一種類型之無機微粒及其他添加劑。特定而言,在本發明中,藉由使用自由體積為至少5,000(L/h)之雙螺桿擠出機捏合反應性有機聚矽氧烷組份、介電無機微粒及表面處理劑,可能且較佳地藉由以下方式來產生可固化之有機聚矽氧烷組合物:形成包括高濃度(例如至少80質量%)無機微粒之聚矽氧橡膠化合物(母料)且然後藉由添加及捏合其他反應性有機聚矽氧烷組份、固化觸媒及其他組份來形成可固化之有機聚矽氧烷組合物。 The curable organopolyoxane composition of the present invention can be produced by an extruder or a kneader (more specifically, at least one type of mechanical component selected from the group consisting of: twin screw In the extruder, twin-screw kneader and single-leaf extruder, the organic polyoxane component, the curing catalyst, and the dielectric constant of dielectric constant of not less than 10 at 1 kHz and room temperature are kneaded. Particles and optionally at least one type of inorganic particulates and other additives. Specifically, in the present invention, it is possible to knead a reactive organopolyoxane component, a dielectric inorganic fine particle, and a surface treatment agent by using a twin-screw extruder having a free volume of at least 5,000 (L/h). The curable organopolyoxane composition is preferably produced by forming a polyoxyxylene rubber compound (masterbatch) comprising a high concentration (for example, at least 80% by mass) of inorganic fine particles and then adding and kneading Other reactive organopolyoxyalkylene components, curing catalysts, and other components form a curable organopolyoxane composition.

無機微粒以高濃度充分分散於藉由上述產生方法獲得之可固化之有機聚矽氧烷組合物中,且由此可產生具有良好電特性及機械特性之轉換器之構件。另外,可在產生轉換器之構件期間獲得均勻膜樣固化產物,所獲得膜樣固化產物之電特性及機械特性極佳,且用於層壓或諸如此類之處置能力極佳。 The inorganic fine particles are sufficiently dispersed at a high concentration in the curable organopolyoxane composition obtained by the above production method, and thereby a member of a converter having good electrical characteristics and mechanical characteristics can be produced. In addition, a uniform film-like cured product can be obtained during the generation of the member of the converter, the obtained film-like cured product is excellent in electrical characteristics and mechanical properties, and excellent in handling ability for lamination or the like.

在上述捏合製程中,對不含固化觸媒之聚矽氧橡膠化合物(母料) 形成期間之溫度並不施加特定限制。然而,此溫度設定於40℃至200℃範圍內,且可設定於100℃至180℃範圍內。在使用雙螺桿擠出機或諸如此類之連續製程中,處理期間之滯留時間可設定為約30秒至5分鐘。 In the above kneading process, a polysulfide rubber compound (masterbatch) containing no curing catalyst The temperature during formation does not impose a specific limit. However, this temperature is set in the range of 40 ° C to 200 ° C and can be set in the range of 100 ° C to 180 ° C. In a continuous process using a twin-screw extruder or the like, the residence time during the treatment can be set to about 30 seconds to 5 minutes.

由於藉由固化或半固化本發明之可固化之有機聚矽氧烷組合物獲得之電活性聚矽氧彈性體之介電特性及機械特性,故其可尤其有利地用作選自由以下組成之群之轉換器之構件:人工肌肉、致動器、感測器及發電元件。具體而言,在將可固化之有機聚矽氧烷組合物模製成片樣或膜樣形狀之後,通常可藉由加熱、藉由高能量束輻照或諸如此類來固化該構件。儘管對用於將可固化之有機聚矽氧烷組合物模製成膜樣形狀之方法並不施加特定限制,但該方法例示為以下方法:藉由使用習用已知塗覆方法將可固化之有機聚矽氧烷組合物塗覆於基板上來形成塗覆膜,藉由使可固化之有機聚矽氧烷組合物通過配備有期望形狀之狹縫之擠出機來模製,或諸如此類。 Owing to the dielectric properties and mechanical properties of the electroactive polyoxosiloxane obtained by curing or semi-curing the curable organopolyoxane composition of the invention, it can be used particularly advantageously as being selected from the group consisting of The components of the group converter: artificial muscles, actuators, sensors and power generation components. In particular, after molding the curable organopolyoxane composition into a sheet or film-like shape, the member can typically be cured by heating, by high energy beam irradiation, or the like. Although no particular limitation is imposed on the method for molding the curable organopolyoxane composition into a film-like shape, the method is exemplified as a method of curing by using a conventional coating method known in the art. The organopolyoxane composition is applied to the substrate to form a coating film, which is molded by passing the curable organopolyoxane composition through an extruder equipped with a slit of a desired shape, or the like.

此類型之膜樣可固化之有機聚矽氧烷組合物之厚度可設定於(例如)0.1微米至5,000微米範圍內。端視塗覆方法及存在或不存在揮發性溶劑,可使所獲得固化產物之厚度薄於應用組合物時之厚度。 The thickness of the film-curable organopolyoxane composition of this type can be set, for example, in the range of from 0.1 micron to 5,000 microns. Depending on the coating method and the presence or absence of a volatile solvent, the thickness of the cured product obtained can be made thinner than when the composition is applied.

在藉由上述方法產生膜樣可固化之有機聚矽氧烷組合物之後,可對可固化之有機聚矽氧烷組合物實施熱固化、室溫固化或高能量束輻照固化,同時在介電無機微粒之目標定向方向上施加電場或磁場,或在藉由施加固定時間段之磁場或電場使填充劑定向之後實施固化。儘管對每一固化操作或每一固化操作期間之條件並不施加特定限制,但若可固化之有機聚矽氧烷組合物係加成可固化之有機聚矽氧烷組合物,則固化較佳係在90℃至180℃之溫度範圍內藉由在此溫度範圍內滯留30秒至30分鐘來實施。 After the film-form curable organopolyoxane composition is produced by the above method, the curable organopolyoxane composition can be subjected to thermal curing, room temperature curing or high energy beam irradiation curing, and simultaneously The electric or magnetic field is applied to the target orientation direction of the electro-chemical particles, or after the filler is oriented by applying a magnetic field or an electric field for a fixed period of time. Although no particular limitation is imposed on the conditions during each curing operation or each curing operation, if the curable organopolyoxane composition is added to the curable organopolyoxane composition, curing is preferred. It is carried out in the temperature range of 90 ° C to 180 ° C by staying in this temperature range for 30 seconds to 30 minutes.

對用於轉換器之聚矽氧彈性體之厚度並不施加特定限制,且厚 度可為(例如)1微米至2,000微米。本發明之用於轉換器之聚矽氧彈性體可堆疊為一層或兩層或更多層。另外,可在介電彈性體層之兩個尖端提供電極層,且可使用轉換器本身由多個堆疊電極層及介電彈性體層構成之構形。此一構形每一單層之用於轉換器之聚矽氧彈性體之厚度可為0.1微米至1,000微米。若該等層堆疊為至少2層,則每一單層之厚度可為0.2微米至2,000微米。 No specific limitation is imposed on the thickness of the polyoxynene elastomer used for the converter, and is thick The degree can be, for example, from 1 micron to 2,000 microns. The polyoxyxene elastomers for converters of the present invention may be stacked in one or two or more layers. In addition, an electrode layer may be provided at both tips of the dielectric elastomer layer, and a configuration in which the converter itself is composed of a plurality of stacked electrode layers and a dielectric elastomer layer may be used. The thickness of the polyoxyxene elastomer for the converter of each of the single layers may be from 0.1 micron to 1,000 microns. If the layers are stacked in at least 2 layers, each single layer may have a thickness of from 0.2 micron to 2,000 microns.

儘管對兩種或更多種類型之聚矽氧彈性體固化層之形成方法並不施加特定限制,可使用下列方法中之任一者:(1)在藉由在基板上塗覆可固化之有機聚矽氧烷組合物並固化來獲得聚矽氧彈性體固化層之後,在同一固化層上施加可固化之有機聚矽氧烷組合物以重複塗覆及固化,從而堆疊層;(2)以堆疊方式在基板上以未固化或半固化狀態塗覆可固化之有機聚矽氧烷組合物,且固化所有以堆疊方式塗覆之各種可固化之有機聚矽氧烷組合物;或(3)組合(1)及(2)方法之方法。 Although no particular limitation is imposed on the formation method of the two or more types of the polyoxysiloxane elastomer-cured layer, any of the following methods may be used: (1) by coating a curable organic layer on a substrate. After the polyoxyalkylene composition is cured and cured to obtain a cured layer of the polyoxyxene elastomer, a curable organopolyoxane composition is applied on the same cured layer to repeat coating and curing, thereby stacking the layers; (2) Stacking the curable organopolyoxane composition on the substrate in an uncured or semi-cured state, and curing all of the various curable organopolyoxane compositions coated in a stacked manner; or (3) A method of combining the methods of (1) and (2).

舉例而言,在本應用發明中,可藉由以下方式來產生:藉由模塗在基板上塗覆可固化之有機聚矽氧烷組合物,固化以形成兩個或更多個堆疊聚矽氧彈性體固化層,且然後使所獲得聚矽氧彈性體固化層黏著至電極上。對於此構形而言,兩個或更多個堆疊聚矽氧彈性體固化層較佳係介電層,且電極較佳係導電層。 For example, in the present invention, it can be produced by coating a curable organopolyoxane composition on a substrate by die coating, curing to form two or more stacked polyoxynitrides. The elastomer cures the layer and then the resulting cured layer of the polyoxyxene elastomer is adhered to the electrode. For this configuration, the two or more stacked polyoxyxene elastomer cured layers are preferably dielectric layers, and the electrodes are preferably electrically conductive layers.

可藉由狹縫塗覆進行高速塗覆,且此塗覆方法具有高產量。在塗覆含有有機聚矽氧烷組合物之單層之後,可藉由塗覆包括不同有機聚矽氧烷組合物之層來產生本發明之具有多層構形之轉換器。另外,可藉由同時塗覆多個含有每一有機聚矽氧烷組合物之層來產生。 High speed coating can be carried out by slit coating, and this coating method has a high yield. After coating a monolayer comprising an organopolyoxane composition, the converter of the present invention having a multilayer configuration can be produced by coating a layer comprising a different organopolyoxane composition. Alternatively, it can be produced by simultaneously coating a plurality of layers containing each organopolyoxane composition.

作為轉換器之構件之薄膜樣聚矽氧彈性體可藉由以下方式來獲得:將可固化之有機聚矽氧烷組合物塗覆於基板上,且然後在室溫下及藉由加熱或藉由使用高能量束輻照(例如紫外輻照或諸如此類)來固化總成。另外,在堆疊薄膜樣介電聚矽氧彈性體時,可將未固化之可 固化之有機聚矽氧烷組合物施加在固化層上且然後依序固化,或可將未固化之可固化之有機聚矽氧烷組合物堆疊成層,且然後可同時固化該等層。 A film-like polyoxyxene elastomer as a component of the converter can be obtained by applying a curable organopolyoxane composition to a substrate and then heating or lending at room temperature The assembly is cured by irradiation with a high energy beam, such as ultraviolet radiation or the like. In addition, when stacking a film-like dielectric polyoxynene elastomer, uncured The cured organopolyoxane composition is applied to the cured layer and then sequentially cured, or the uncured curable organopolyoxane composition can be stacked into layers and the layers can then be cured simultaneously.

薄膜樣聚矽氧彈性體尤其可用作用於轉換器之介電層。可藉由在薄膜樣聚矽氧彈性體之兩端配置電極層來形成轉換器。另外,藉由將導電無機顆粒摻和至本發明之可固化之有機聚矽氧烷組合物中,可賦予電極層功能。另外,在本發明之說明書中,有時將「電極層」簡稱為「電極」。 Film-like polyoxyxides are especially useful as dielectric layers for converters. The converter can be formed by arranging electrode layers on both ends of the film-like polyoxynastomer. Further, the electrode layer function can be imparted by blending the conductive inorganic particles into the curable organopolyoxane composition of the present invention. Further, in the specification of the present invention, the "electrode layer" may be simply referred to as "electrode".

轉換器之構件之一實施例係薄膜,且係片樣或膜樣。膜厚度通常為1微米至2,000微米,且該膜可具有單層、兩層或更多層或更大數目之堆疊層結構。另外,在可能需要時,堆疊電活性聚矽氧彈性體層在用作介電層時可以5微米至10,000微米之膜厚度來使用,或可堆疊該等層以獲得更大厚度。 One embodiment of the components of the converter is a film and is a sheet or film. The film thickness is usually from 1 micrometer to 2,000 micrometers, and the film may have a single layer, two or more layers or a larger number of stacked layer structures. In addition, the stacked electroactive polyoxyxene elastomer layers may be used as a film thickness of 5 micrometers to 10,000 micrometers when used as a dielectric layer, or may be stacked to obtain a greater thickness, as may be required.

可藉由以下方式來形成作為轉換器之構件之薄膜樣聚矽氧彈性體層:堆疊相同薄膜樣聚矽氧彈性體,或堆疊兩種或更多種類型具有不同物理特性或固化前組合物之薄膜樣聚矽氧彈性體。另外,薄膜樣聚矽氧彈性體層可起介電層或電極層功能。特定而言,在較佳轉換器構件中,介電層之厚度為1微米至1,000微米,且電極層之厚度為0.05微米至100微米。 The film-like polyoxyxene elastomer layer can be formed as a member of the converter by stacking the same film-like polyoxynene elastomer, or stacking two or more types having different physical properties or pre-curing compositions. Film-like polyoxynene elastomer. In addition, the thin film-like polyoxyxide elastomer layer can function as a dielectric layer or an electrode layer. In particular, in a preferred converter member, the thickness of the dielectric layer is from 1 micron to 1,000 microns, and the thickness of the electrode layer is from 0.05 microns to 100 microns.

本發明轉換器之特性在於,具有藉由固化本發明之可固化之有機聚矽氧烷組合物產生之轉換器的此構件,且本發明轉換器可具有尤其包括高度堆疊之層結構(亦即兩個或更多個介電層)之結構。本發明轉換器可進一步具有包括3個或更多個介電層之結構。具有此高度堆疊結構類型之轉換器能夠因包括多個層而產生更大力。另外,藉由堆疊多層,可獲得大於藉由使用單層所獲得位移之位移。 The converter of the present invention is characterized by having such a member of a converter produced by curing the curable organopolyoxane composition of the present invention, and the converter of the present invention may have a layer structure including, in particular, a highly stacked layer (i. The structure of two or more dielectric layers). The converter of the present invention may further have a structure including three or more dielectric layers. A converter having this type of highly stacked structure can generate more force by including multiple layers. In addition, by stacking a plurality of layers, a displacement greater than that obtained by using a single layer can be obtained.

可在用於本發明轉換器之介電層之兩端包括電極。所利用之電 極材料例示為金屬及金屬合金,例如金、鉑、銀、鈀、銅、鎳、鋁、鈦、鋅、鋯、鐵、鈷、錫、鉛、銦、鉻、鉬、錳或諸如此類;金屬氧化物,例如銦-錫化合物氧化物(ITO)、銻-錫化合物氧化物(ATO)、氧化釕、氧化鈦、氧化鋅、氧化錫及諸如此類;碳材料,例如碳奈米管、碳奈米角、碳奈米片、碳纖維、碳黑或諸如此類;及導電樹脂,例如聚(伸乙基-3,4-二氧基噻吩)(PEDOT)、聚苯胺、聚吡咯或諸如此類。可使用導電彈性體及具有分散在樹脂中之導電填充劑之導電樹脂。 Electrodes may be included at both ends of the dielectric layer used in the converter of the present invention. Electricity used The polar material is exemplified by metals and metal alloys such as gold, platinum, silver, palladium, copper, nickel, aluminum, titanium, zinc, zirconium, iron, cobalt, tin, lead, indium, chromium, molybdenum, manganese or the like; For example, indium-tin compound oxide (ITO), bismuth-tin compound oxide (ATO), cerium oxide, titanium oxide, zinc oxide, tin oxide, and the like; carbon materials such as carbon nanotubes, carbon nanohorns , carbon nanosheet, carbon fiber, carbon black or the like; and a conductive resin such as poly(extended ethyl-3,4-dioxythiophene) (PEDOT), polyaniline, polypyrrole or the like. A conductive elastomer and a conductive resin having a conductive filler dispersed in the resin can be used.

電極可僅包括導電物質中之一種物質,或可包括兩種或更多種該等導電物質。若電極包括兩種或更多種類型之導電物質,則至少一種類型之導電物質可用作活性物質,且可用作用於降低另一電極之電阻之導電材料。 The electrode may include only one of the conductive materials, or may include two or more of the conductive materials. If the electrode includes two or more types of conductive materials, at least one type of conductive material can be used as the active material, and can be used as a conductive material for lowering the electrical resistance of the other electrode.

用於本發明轉換器之介電層之總厚度可設定於10微米至2,000微米(2mm)範圍內,但此總厚度尤其可設定為不小於200微米之值。特定而言,形成介電層之介電聚矽氧彈性體層之每一單層的厚度較佳為0.1微米500微米,且此厚度尤佳為0.1微米至200微米。與使用單層相比,藉由堆疊該等聚矽氧彈性體薄層之兩層或更多層,可改良諸如介電崩潰電壓、介電常數及位移量等特性。 The total thickness of the dielectric layer used in the converter of the present invention can be set in the range of 10 micrometers to 2,000 micrometers (2 mm), but the total thickness can be set to a value of not less than 200 micrometers. Specifically, the thickness of each of the single layers of the dielectric polyoxyxide elastomer layer forming the dielectric layer is preferably 0.1 μm to 500 μm, and the thickness is particularly preferably 0.1 μm to 200 μm. Characteristics such as dielectric breakdown voltage, dielectric constant, and displacement amount can be improved by stacking two or more layers of the thin layers of the polyoxysiloxane elastomers as compared with the use of a single layer.

術語「轉換器」在本發明中意指用於將某一類型之能量轉換成不同類型之能量之元件、機器或裝置。此轉換器例示為用於將電能轉換成機械能之人工肌肉及致動器;用於將機械能轉換成電能之感測器及發電元件;用於將電能轉換成音能之揚聲器、麥克風及耳機;用於將化學能轉換成電能之燃料電池;及用於將電能轉換成光能之發光二極體。 The term "converter" as used in the present invention means an element, machine or device for converting a certain type of energy into a different type of energy. The converter is exemplified as an artificial muscle and an actuator for converting electrical energy into mechanical energy; a sensor and a power generating element for converting mechanical energy into electrical energy; a speaker for converting electrical energy into sound energy, a microphone and a headphone; a fuel cell for converting chemical energy into electrical energy; and a light emitting diode for converting electrical energy into light energy.

本發明轉換器由於本發明轉換器之介電及機械特性而尤其能夠用作人工肌肉、致動器、感測器或發電元件。預計人工肌肉用於諸如 以下等應用中:機器人、護理設備、康復訓練設備或諸如此類。下文將以本發明實例之形式來闡釋作為致動器之實施例。 The converter of the present invention is particularly useful as an artificial muscle, actuator, sensor or power generating component due to the dielectric and mechanical properties of the converter of the present invention. Artificial muscles are expected to be used, for example In applications such as robots, nursing equipment, rehabilitation equipment or the like. Embodiments as actuators will be explained below in the form of examples of the invention.

圖1展示堆疊介電層之本發明實施例之致動器1之剖面圖。在此實施例中,介電層係由(例如)2個介電層構成。致動器1配備有介電層10a及10b、電極層11a及11b、導線12及電源13。電極層11a及11b覆蓋介電層之各別接觸表面,且該等電極層經由各別導線12連結至電源13。 1 shows a cross-sectional view of an actuator 1 of an embodiment of the present invention in which a dielectric layer is stacked. In this embodiment, the dielectric layer is composed of, for example, two dielectric layers. The actuator 1 is provided with dielectric layers 10a and 10b, electrode layers 11a and 11b, wires 12, and a power source 13. The electrode layers 11a and 11b cover respective contact surfaces of the dielectric layer, and the electrode layers are coupled to the power source 13 via respective wires 12.

致動器1可藉由在電極層11a與電極層11b之間施加電壓來驅動。藉由施加電壓,介電層10a及10b因介電性質而變薄,且此使其平行於電極層11a及11b之面伸長。亦即,可將電能轉換成移動或位移之力或機械能。 The actuator 1 can be driven by applying a voltage between the electrode layer 11a and the electrode layer 11b. By applying a voltage, the dielectric layers 10a and 10b are thinned by dielectric properties, and are elongated parallel to the faces of the electrode layers 11a and 11b. That is, electrical energy can be converted into force or mechanical energy for movement or displacement.

圖2展示堆疊介電層及電極層之本發明實施例之致動器2之剖面圖。舉例而言,根據本發明實施例,介電層係由3層構成,且電極層係由4層構成。致動器2配備有介電層20a、20b及20c、電極層21a、21b、21c及21d;導線22;及電源23。電極層21a、21b、21c及21d各自覆蓋介電層之各別接觸表面,且該等電極層經由各別導線22連接至電源23。電極層交替連接至不同電壓側,且電極層21a及21c連接至與電極層21b及21d不同之側。 2 shows a cross-sectional view of an actuator 2 of an embodiment of the present invention in which a dielectric layer and an electrode layer are stacked. For example, according to an embodiment of the invention, the dielectric layer is composed of three layers, and the electrode layer is composed of four layers. The actuator 2 is provided with dielectric layers 20a, 20b, and 20c, electrode layers 21a, 21b, 21c, and 21d, a wire 22, and a power source 23. The electrode layers 21a, 21b, 21c, and 21d each cover respective contact surfaces of the dielectric layer, and the electrode layers are connected to the power source 23 via respective wires 22. The electrode layers are alternately connected to different voltage sides, and the electrode layers 21a and 21c are connected to the side different from the electrode layers 21b and 21d.

藉由在電極層21a與電極層21b之間施加電壓、在電極層21b與電極層21c之間施加電壓且在電極層21c與電極層21d之間施加電壓,可驅動致動器2。藉由施加電壓,介電層20a、20b及20c因介電性質而變薄,且此使其平行於電極層21a、21b、21c及21d之面伸長。亦即,可將電能轉換成移動或位移之力或機械能。 The actuator 2 can be driven by applying a voltage between the electrode layer 21a and the electrode layer 21b, applying a voltage between the electrode layer 21b and the electrode layer 21c, and applying a voltage between the electrode layer 21c and the electrode layer 21d. By applying a voltage, the dielectric layers 20a, 20b, and 20c are thinned by dielectric properties, and are elongated parallel to the faces of the electrode layers 21a, 21b, 21c, and 21d. That is, electrical energy can be converted into force or mechanical energy for movement or displacement.

儘管將致動器之實施例闡述為本發明轉換器之實例,但在自外側向本發明轉換器施加機械能(例如壓力或諸如此類)時,可在相互絕緣之電極層之間生成電位差形式之電能。亦即,其可用作用於將機械 能轉換成電能之感測器。感測器之此實施例將闡述於下文中。 Although the embodiment of the actuator is illustrated as an example of the converter of the present invention, when mechanical energy (e.g., pressure or the like) is applied from the outside to the converter of the present invention, a potential difference form can be formed between mutually insulated electrode layers. Electrical energy. That is, it can be used as a machine for A sensor that can be converted into electrical energy. This embodiment of the sensor will be explained below.

圖3展示本發明實施例之感測器3之結構。感測器3具有以下結構:其中介電層30佈置在以矩陣樣模式配置之上部電極層31a、31b及31c與下部電極層32a、32b及32c之間。根據本發明實施例,舉例而言,將電極層佈置為在垂直方向及水平方向上分別具有三列之矩陣模式。可藉由絕緣層來保護每一電極層之不接觸介電層30之面。另外,介電層30可包括兩層或更多層含有有機聚矽氧烷之相同介電層。 Figure 3 shows the structure of a sensor 3 in accordance with an embodiment of the present invention. The sensor 3 has a structure in which the dielectric layer 30 is disposed between the upper electrode layers 31a, 31b, and 31c and the lower electrode layers 32a, 32b, and 32c in a matrix-like mode. According to an embodiment of the present invention, for example, the electrode layers are arranged in a matrix mode having three columns in the vertical direction and the horizontal direction, respectively. The surface of each electrode layer that does not contact the dielectric layer 30 can be protected by an insulating layer. Additionally, dielectric layer 30 can include two or more layers of the same dielectric layer containing an organopolyoxane.

在將外力施加至此感測器3之表面時,介於上部電極層與下部電極層之間之介電層30之厚度在施加位置處發生變化,且電極層之間之靜態電容因此厚度變化而變化。藉由量測因該等電極層之間之此靜態電容變化而引起之電極層之間之電位差,可檢測外力。亦即,此實施例可用作用於將機械能轉換成電能之感測器。 When an external force is applied to the surface of the sensor 3, the thickness of the dielectric layer 30 interposed between the upper electrode layer and the lower electrode layer changes at the application position, and the static capacitance between the electrode layers thus varies. Variety. The external force can be detected by measuring the potential difference between the electrode layers caused by the change in the static capacitance between the electrode layers. That is, this embodiment can be used as a sensor for converting mechanical energy into electrical energy.

另外,儘管在本發明實施例之感測器3中形成3對夾有介電層之相對電極層,但可根據應用適當地選擇電極層之數量、大小、佈局或諸如此類。 In addition, although three pairs of opposite electrode layers sandwiching the dielectric layer are formed in the sensor 3 of the embodiment of the present invention, the number, size, layout, or the like of the electrode layers may be appropriately selected depending on the application.

發電元件係用於將機械能轉換成電能之轉換器。此發電元件可應用於發電裝置,其始於藉由天然能(例如波力、水力、水力或諸如此類)之發電以及因振動、撞擊、壓力變化或諸如此類引起之發電。此發電元件之實施例將闡述於下文中。 A power generation component is a converter for converting mechanical energy into electrical energy. This power generating element can be applied to a power generating device, which starts with power generation by natural energy (for example, wave force, water power, water power, or the like) and power generation due to vibration, impact, pressure change, or the like. Embodiments of this power generating component will be described below.

圖4展示堆疊介電層之本發明實施例之發電元件4之剖面圖。在此實施例中,介電層係由(例如)2個介電層構成。發電元件4係由介電層40a及40b以及電極層41a及41b構成。電極層41a及41b經配置覆蓋所接觸各別介電層之一個面。 4 shows a cross-sectional view of a power generating component 4 of an embodiment of the present invention in which a dielectric layer is stacked. In this embodiment, the dielectric layer is composed of, for example, two dielectric layers. The power generating element 4 is composed of dielectric layers 40a and 40b and electrode layers 41a and 41b. The electrode layers 41a and 41b are configured to cover one face of the respective dielectric layers that are in contact.

電極層41a及41b電連接至未圖解說明之負載。此發電元件4可藉由改變電極層41a與41b之間之距離來改變靜態電容,從而生成電能。亦即,由於藉由介電層40a及40b形成靜電場而造成呈靜電荷感應狀態 之電極層41a與41b之間之元件形狀發生變化,故電荷分佈發生偏移,電極層之間之靜態電容因該偏移而發生變化,且在電極層之間產生電位差。 The electrode layers 41a and 41b are electrically connected to a load not illustrated. This power generating element 4 can change the static capacitance by changing the distance between the electrode layers 41a and 41b, thereby generating electric energy. That is, since the electrostatic field is formed by the dielectric layers 40a and 40b, the electrostatic charge sensing state is caused. The shape of the element between the electrode layers 41a and 41b changes, so that the charge distribution shifts, and the static capacitance between the electrode layers changes due to the offset, and a potential difference is generated between the electrode layers.

在本發明實施例中,由於自在平行於圖4中所展示發電元件4之電極層41a及41b之面的方向上施加壓縮力之狀態(上圖)變成如同一圖中所展示之未施加壓縮的狀態(下圖),故在電極層41a與41b之間產生電位差,且可藉由以電力形式輸出此電位差變化來實現發電元件之功能。亦即,可將機械能轉換成電能。另外,可將多個元件配置在基板上,且可藉由串聯或並聯該多個元件來構造生成更大電量之發電裝置。 In the embodiment of the present invention, since the state in which the compressive force is applied in the direction parallel to the faces of the electrode layers 41a and 41b of the power generating element 4 shown in Fig. 4 (upper panel) becomes uncompressed as shown in the same figure. In the state (below), a potential difference is generated between the electrode layers 41a and 41b, and the function of the power generating element can be realized by outputting this potential difference change in the form of electric power. That is, mechanical energy can be converted into electrical energy. In addition, a plurality of components may be disposed on the substrate, and a power generating device that generates a larger amount of electricity may be constructed by connecting the plurality of components in series or in parallel.

本發明轉換器可在空氣、水、真空或有機溶劑中進行操作另外,本發明轉換器可根據轉換器之使用環境來適當地密封。對密封方法並不施加特定限制,且此密封方法例示為使用樹脂材料或諸如此類密封。 The converter of the present invention can be operated in air, water, vacuum or an organic solvent. Further, the converter of the present invention can be appropriately sealed according to the use environment of the converter. No particular limitation is imposed on the sealing method, and this sealing method is exemplified by using a resin material or the like.

[工業適用性] [Industrial Applicability]

本發明之可固化之有機聚矽氧烷組合物可有利地用於需要具有極佳機械特性及電特性之彈性體的應用(例如產生轉換器)中。本發明之可固化之有機聚矽氧烷組合物可包括所謂的B階材料而非僅包括未固化之可固化組合物,該B階材料呈反應性有機聚矽氧烷部分反應且未完全固化之狀態。本發明之B階材料例示為呈凝膠樣或具有流動性之狀態之材料。因此,本發明之實施例亦包括呈以下狀態之構件:其中可固化之有機聚矽氧烷組合物之固化反應已進行了一部分,且其中轉換器之構件呈凝膠樣或流體狀態。另外,呈此半固化狀態類型之轉換器之構件可由單層或堆疊層之薄膜樣聚矽氧彈性體構成。 The curable organopolyoxane composition of the present invention can be advantageously used in applications requiring an elastomer having excellent mechanical and electrical properties (e.g., producing a converter). The curable organopolyoxane composition of the present invention may comprise a so-called B-stage material rather than only an uncured curable composition which is partially reacted and not fully cured in a reactive organopolyoxane. State. The B-stage material of the present invention is exemplified as a material which is in a gel-like state or in a fluid state. Accordingly, embodiments of the present invention also include members in which the curing reaction of the curable organopolyoxane composition has been carried out in part, and wherein the members of the converter are in a gel-like or fluid state. Further, the member of the converter in the semi-cured state type may be composed of a single layer or a stacked layer of a film-like polyoxynene elastomer.

[實例] [Example]

為例示本發明,現將給出實踐實例。然而應理解,該等實踐實 例並不限制本發明範圍。另外,在下文中「%」代表質量百分數。 The present invention will be described by way of example, and practical examples will now be given. However, it should be understood that such practices are The examples do not limit the scope of the invention. In addition, "%" below represents the mass percentage.

實踐實例1 Practice example 1

向14.22%在25℃下黏度為2,000mPa s且兩個末端經二甲基乙烯基矽氧基封端之二甲基聚矽氧烷(A21)(乙烯基含量為0.23%)添加85.35%平均顆粒直徑為1.0微米之球形鈦酸鋇(由Fuji Titanium Industry有限公司產生,HPBT-1B)、0.356%在一分子末端經三甲氧基矽烷基封端且在另一分子末端經二甲基乙烯基封端之聚矽氧烷(平均聚合度=25)及0.071% 1,1,3-三甲基-3,3-二苯基-1-羧基癸基二矽氧烷。在使用Ross混合器均勻混合之後,在150℃下將混合物進一步加熱且混合30分鐘以獲得聚矽氧彈性體基質。 85.35% was added to 14.22% of dimethyl methoxide (A 21 ) (vinyl content of 0.23%) having a viscosity of 2,000 mPa s at 25 ° C and dimethylvinyl methoxy group terminated at both ends. Spherical barium titanate (produced by Fuji Titanium Industry Co., Ltd., HPBT-1B) having an average particle diameter of 1.0 μm, 0.356% terminated with trimethoxydecyl group at one molecule end and dimethylethylene at the other molecule end Base-terminated polyoxyalkylene (average degree of polymerization = 25) and 0.071% 1,1,3-trimethyl-3,3-diphenyl-1-carboxyindenyldioxane. After uniformly mixing using a Ross mixer, the mixture was further heated and mixed at 150 ° C for 30 minutes to obtain a polyoxyxene elastomer matrix.

向此聚矽氧橡膠基質中添加在兩個分子末端經二甲基氫矽氧基封端之聚二甲基矽氧烷(A11;SiH含量:0.015%)、含有二甲基氫矽氧基((CH3)2HSiO1/2)及苯基矽氧基(C6H5SiO3/2)(A16;SiH含量:0.66%)之共聚物、含有0.67%(基於鉑)1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑錯合物之在兩個末端具有二甲基乙烯基矽氧基之二甲基聚矽氧烷之溶液及四甲基四乙烯基環四矽氧烷作為反應控制劑以得到表1中所展示之摻和比率。混合混合物直至均勻為止(大約10分鐘)以獲得聚矽氧彈性體組合物。在此處,此聚矽氧彈性體組合物中之所有SiH官能基對所有乙烯基之莫耳比(SiH基團/乙烯基)為1.3。 To the polyoxymethylene rubber matrix, polydimethyl methoxyoxane (A 11 ; SiH content: 0.015%) terminated with dimethylhydroquinone at the end of two molecules and containing dimethylhydroquinone oxygen was added. a copolymer of (CH 3 ) 2 HSiO 1/2 ) and phenyl decyloxy (C 6 H 5 SiO 3/2 ) (A 16 ; SiH content: 0.66%), containing 0.67% (based on platinum) 1 , a solution of 3-divinyl-1,1,3,3-tetramethyldioxanane platinum complex dimethyl methoxide having dimethylvinyloxime at both ends And tetramethyltetravinylcyclotetraoxane was used as a reaction control agent to obtain the blend ratios shown in Table 1. The mixture was mixed until homogeneous (about 10 minutes) to obtain a polyoxyxene elastomer composition. Here, the molar ratio of all SiH functional groups to all vinyl groups (SiH groups/vinyl groups) in this polyoxyxene elastomer composition is 1.3.

在此處,相對於可固化之聚矽氧彈性體組合物中之全部矽氧烷組份,具有6至10個碳之單價芳族烴基團之質量分數(Z)為0.49%;在兩個分子末端具有反應性基團且具有200個以上重複單元之有機聚矽氧烷之質量分數(W)為85.2%;相對於可固化之有機聚矽氧烷組合物中之全部矽氧烷組份,由MaMR bDcDR dTeTR fQg(其中(a+c)/(b+d+e+f+g)之值小於3)代表之反應性有機聚矽氧烷(X)之質量分數為1.6%;相對於可固化之有機聚矽氧烷組合物中之全部矽氧烷組份,在兩個分 子末端具有反應性基團之有機聚矽氧烷(Y)之質量分數為98.4%;反應性有機聚矽氧烷(S)(在分子中具有至少兩個能夠進行固化反應之基團且在兩個能夠進行固化反應之基團之間具有小於10,000的平均分子量)對反應性有機聚矽氧烷(L)(在分子中具有至少兩個能夠進行固化反應之基團及在兩個能夠進行固化反應之基團之間具有不小於10,000且不大於150,000的分子量)之摻和比率(質量比率:S/L)為1.6/98.4。 Here, the mass fraction (Z) of the monovalent aromatic hydrocarbon group having 6 to 10 carbons is 0.49% with respect to all of the oxane component in the curable polyoxyxene elastomer composition; The mass fraction (W) of the organopolyoxane having a reactive group at the molecular end and having more than 200 repeating units is 85.2%; relative to all the oxane component in the curable organopolyoxane composition Reactive organopolyfluorene represented by M a M R b D c D R d T e T R f Q g (where (a+c)/(b+d+e+f+g) has a value less than 3) The mass fraction of oxyalkylene (X) is 1.6%; an organopolyoxane having a reactive group at the end of two molecules with respect to all of the oxane component in the curable organopolyoxane composition ( Y) has a mass fraction of 98.4%; a reactive organopolysiloxane (S) (having at least two groups capable of undergoing a curing reaction in the molecule and having less than 10,000 between two groups capable of undergoing a curing reaction) Average molecular weight) to a reactive organopolyoxane (L) having at least two groups capable of undergoing a curing reaction in the molecule and two groups capable of undergoing a curing reaction The blend ratio (mass ratio: S/L) having a molecular weight of not less than 10,000 and not more than 150,000 was 1.6/98.4.

將此聚矽氧彈性體組合物在150℃下壓製固化15分鐘,且然後在150℃下於烘箱中後固化60分鐘。基於JIS K 6249,量測所獲得固化產物之楊氏模數、拉伸強度、斷裂伸長率及撕裂強度。為量測機械強度,製造為2mm厚度片。基於JIS K 6253量測6mm厚片之硬度計A硬度。 The polyoxyxene elastomer composition was press cured at 150 ° C for 15 minutes and then post cured in an oven at 150 ° C for 60 minutes. The Young's modulus, tensile strength, elongation at break, and tear strength of the obtained cured product were measured based on JIS K 6249. To measure the mechanical strength, a 2 mm thick piece was produced. The hardness A hardness of a 6 mm thick piece was measured based on JIS K 6253.

另外,將此聚矽氧彈性體組合物在150℃下壓製固化15分鐘以產生0.07mm厚片,且使用介電崩潰電壓油測試儀(亦即由Soken Electric有限公司製得之PORTATEST 100A-2)量測介電崩潰強度。類似地,將聚矽氧彈性體組合物在150℃下壓製固化15分鐘以產生1mm厚片,且以100Hz至30MHz之量測頻率範圍在23℃之量測溫度下使用由Wayne Kerr Electronics製得之LCR計6530P/D2量測介電常數。在該等值中,將在1MHz下量測之值用於實踐實例及對比實例中。該等結果展示於表4.1及4.2中。 Further, the polyoxyxene elastomer composition was press-cured at 150 ° C for 15 minutes to produce a 0.07 mm thick sheet, and a dielectric breakdown voltage oil tester (i.e., PORTATEST 100A-2 manufactured by Soken Electric Co., Ltd.) was used. ) Measuring dielectric breakdown strength. Similarly, the polyoxyxene elastomer composition was compression cured at 150 ° C for 15 minutes to produce a 1 mm thick sheet, and was measured at a measurement frequency ranging from 100 Hz to 30 MHz at a measurement temperature of 23 ° C using Wayne Kerr Electronics. The LCR meter 6530P/D2 measures the dielectric constant. Among the values, the values measured at 1 MHz were used in practical examples and comparative examples. These results are shown in Tables 4.1 and 4.2.

實踐實例2至16及對比實例1至2 Practical Examples 2 to 16 and Comparative Examples 1 to 2

實施與實踐實例1相同之程序,只是改變交聯劑及聚合物之添加量及化學結構,或在可能需要時使用表1至3中所列示之微粒以獲得聚矽氧橡膠組合物。以相同方式計算上述Z、X、Y及S/L值。以相同方式加熱並固化所獲得之組合物,且評估機械強度及電特性。結果展示於表4.1、4.2及5中。另外,在該等表中,上文未闡述之交聯劑及聚合物之化學結構如下所述。 The same procedure as in Practical Example 1 was carried out except that the addition amount and chemical structure of the crosslinking agent and the polymer were changed, or the particles listed in Tables 1 to 3 were used as needed to obtain a polyoxyethylene rubber composition. The above Z, X, Y and S/L values were calculated in the same manner. The obtained composition was heated and cured in the same manner, and mechanical strength and electrical properties were evaluated. The results are shown in Tables 4.1, 4.2 and 5. Further, in the tables, the chemical structures of the crosslinking agent and the polymer not described above are as follows.

A22:在兩個分子末端經二甲基乙烯基矽氧基封端之聚二甲基矽氧烷 A 22 : polydimethyl methoxy oxane terminated by dimethyl vinyl oxyl at the end of two molecules

A23:在兩個分子末端經二甲基乙烯基矽氧基封端之聚甲基苯基矽氧烷 A 23 : polymethylphenyl sulfoxide terminated with dimethylvinyl oxyl at the end of two molecules

A24:在兩個分子末端經二苯基乙烯基矽氧基封端之聚甲基苯基矽氧烷 A 24 : polymethylphenyl sulfoxide terminated with diphenylvinyl hydroxy groups at the ends of two molecules

A12:在兩個分子末端經三甲基矽烷基矽氧基封端之二甲基甲基氫矽氧烷共聚物 A 12 : dimethylmethylhydroquinone copolymer terminated by a trimethyldecyloxy group at the end of two molecules

A13:在兩個分子末端經二甲基氫矽氧基封端之聚二甲基矽氧烷 A 13 : polydimethyl methoxy oxane terminated by dimethyl hydroquinone at the end of two molecules

A14:在兩個分子末端經三甲基矽烷基矽氧基封端之二甲基矽氧烷/甲基氫矽氧烷共聚物 A 14 : dimethyl methoxy oxane/methyl hydrazine oxyalkylene copolymer terminated at the end of two molecules via trimethyl decyl decyloxy

A15:在兩個分子末端經二甲基氫矽氧基封端之聚二苯基矽氧烷 A 15 : polydiphenyl fluorene terminated by dimethyl hydroquinone at the end of two molecules

反應控制劑:四甲基四乙烯基環四矽氧烷 Reaction control agent: tetramethyltetravinylcyclotetraoxane

Pt觸媒(矽氫化反應觸媒):1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷鉑錯合物 Pt catalyst (hydrazine hydrogenation catalyst): 1,3-divinyl-1,1,3,3-tetramethyldioxane platinum complex

如表4.1、4.2及5中所闡釋,具有組成組份:可固化之有機聚矽氧烷(含有在兩個分子末端具有反應性基團且具有200個以上重複單元之有機聚矽氧烷且含有預定量單價芳族烴基團)及無機微粒(具有不小於50nm之平均初級顆粒直徑)之可固化之有機聚矽氧烷組合物提供具有極佳機械特性(由斷裂伸長率代表)及電特性(由介電崩潰強度代表)的聚矽氧彈性體。另外,使用介電無機微粒作為無機微粒使得能夠減小固化產物之彈性模數且增加其介電崩潰強度,且使得能夠設計有利地用於轉換器應用中之聚矽氧彈性體。 As explained in Tables 4.1, 4.2 and 5, having a constituent component: a curable organopolyoxane (containing an organopolyoxane having a reactive group at two molecular terminals and having more than 200 repeating units and A curable organopolyoxane composition containing a predetermined amount of a monovalent aromatic hydrocarbon group and inorganic fine particles (having an average primary particle diameter of not less than 50 nm) provides excellent mechanical properties (represented by elongation at break) and electrical properties (Polyoxime elastomer represented by dielectric breakdown strength). In addition, the use of dielectric inorganic fine particles as the inorganic fine particles makes it possible to reduce the elastic modulus of the cured product and increase its dielectric collapse strength, and enables design of a polyoxyxene elastomer which is advantageously used in converter applications.

另一方面,如表5中所展示,藉由固化除本發明可固化之有機聚矽氧烷外之物質所獲得之聚矽氧彈性體整體而言難以同時達成固化產物彈性模數之減小及其介電崩潰強度之增加,而此在實踐實例中已實現。 On the other hand, as shown in Table 5, it is difficult to simultaneously achieve a reduction in the elastic modulus of the cured product as a whole by the curing of the polyoxyxene elastomer obtained by curing the substance other than the organopolysiloxane which is curable by the present invention. And the increase in dielectric breakdown strength, which has been achieved in practical examples.

1‧‧‧致動器 1‧‧‧Actuator

10a‧‧‧介電層 10a‧‧‧ dielectric layer

10b‧‧‧介電層 10b‧‧‧ dielectric layer

11a‧‧‧電極層 11a‧‧‧electrode layer

11b‧‧‧電極層 11b‧‧‧electrode layer

12‧‧‧導線 12‧‧‧ wire

13‧‧‧電源 13‧‧‧Power supply

Claims (22)

一種可固化之有機聚矽氧烷組合物,其包括由下式(I)代表之有機聚矽氧烷:Ra aRb bSiO(4-a-b)/2 (I)其中Ra係具有6至10個碳之單價芳族烴基團,且Rb係至少一種類型之單價官能基,其限制條件為Rb係除具有6至10個碳之單價芳族烴基團外之基團,其中Rb之至少一部分係能夠進行固化反應之基團,且0<a、0<b、1.9<a+b<2.1;及至少一種類型之平均初級粒徑不小於50nm之無機微粒;其中全部有機聚矽氧烷中該等具有6至10個碳之單價芳族烴基團之質量分數(Z)不小於0.2質量%且不大於50質量%;且全部有機聚矽氧烷中由下式(II)代表之直鏈有機聚矽氧烷之質量分數(W)不小於50質量%:R1R2 2Si(OSiR3R4)n(OSiR3R1)mOSiR1R2 2 (II)其中R1係能夠進行固化反應之基團,R2、R3及R4各自獨立地、相同或不同地係氫原子、具有1至10個碳之單價脂肪族烴基團及具有6至10個碳之單價芳族烴基團;n及m係分別滿足條件200<n及0=<m=<(n/20)之數值。 A curable organopolyoxane composition comprising an organopolyoxane represented by the following formula (I): R a a R b b SiO (4-ab)/2 (I) wherein R a has a monovalent aromatic hydrocarbon group of 6 to 10 carbons, and R b is at least one type of monovalent functional group, with the proviso that R b is a group other than a monovalent aromatic hydrocarbon group having 6 to 10 carbons, wherein At least a part of R b is a group capable of undergoing a curing reaction, and 0 < a, 0 < b, 1.9 < a + b <2.1; and at least one type of inorganic fine particles having an average primary particle diameter of not less than 50 nm; The mass fraction (Z) of the monovalent aromatic hydrocarbon group having 6 to 10 carbons in the polyoxyalkylene is not less than 0.2% by mass and not more than 50% by mass; and all of the organopolyoxane is represented by the following formula (II) The linear organic polyoxane represented by the mass fraction (W) is not less than 50% by mass: R 1 R 2 2 Si(OSiR 3 R 4 ) n (OSiR 3 R 1 ) m OSiR 1 R 2 2 (II) Wherein R 1 is a group capable of undergoing a curing reaction, and R 2 , R 3 and R 4 are each independently, identically or differently a hydrogen atom, a monovalent aliphatic hydrocarbon group having 1 to 10 carbons, and having 6 to 10 Carbon monovalent aromatic Group; and n-m system satisfy the condition 200 <n and 0 = <m = <(n / 20) of values. 如請求項1之可固化之有機聚矽氧烷組合物,其中該等單價芳族烴基團之該質量分數(Z)不小於0.5質量%且不大於30質量%。 The curable organopolyoxane composition of claim 1, wherein the mass fraction (Z) of the monovalent aromatic hydrocarbon groups is not less than 0.5% by mass and not more than 30% by mass. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該等直鏈有機聚矽氧烷之該質量分數(W)不小於75.0質量%且不大於99.9質量%。 The curable organopolyoxane composition of claim 1 or 2, wherein the mass fraction (W) of the linear organopolysiloxanes is not less than 75.0% by mass and not more than 99.9% by mass. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該具有6至10個碳之單價芳族烴基團係苯基。 The curable organopolyoxane composition of claim 1 or 2, wherein the monovalent aromatic hydrocarbon group having 6 to 10 carbons is a phenyl group. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該至少一種類型之平均初級顆粒直徑不小於50nm之無機微粒包含在1kHz及室溫下比介電常數不小於10之介電無機微粒。 The curable organopolyoxane composition according to claim 1 or 2, wherein the at least one type of inorganic fine particles having an average primary particle diameter of not less than 50 nm comprises a dielectric constant of not less than 10 at 1 kHz and room temperature. Electrical inorganic particles. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該能夠進行固化反應之基團係能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團。 The curable organopolyoxane composition of claim 1 or 2, wherein the group capable of undergoing a curing reaction is capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction reaction. 如請求項1或2之可固化之有機聚矽氧烷組合物,其另外滿足下文在[1]、[2]及[3]中所闡述之所有組成特徵:[1]相對於該可固化之有機聚矽氧烷組合物中之全部有機聚矽氧烷組份,該可固化之有機聚矽氧烷組合物以不小於0.1質量%且不大於10質量%之量含有由通式:MaMR bDcDR dTeTR fQg代表之有機聚矽氧烷,其中(a+c)/(b+d+e+f+g)之值小於3;其中,在上述通式中,M係三有機矽氧基單元;D係二有機矽氧基單元;T係單有機矽氧基單元;Q係由SiO4/2代表之矽氧基單元;且該等矽氧基單元中之每一者上之取代基R係能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團;[2]相對於該可固化之有機聚矽氧烷組合物中之全部矽氧烷組份,該可固化之有機聚矽氧烷組合物以不小於75質量%且不大於99.9質量%之量含有僅在兩個分子末端具有能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團的反應性有機聚矽氧烷;[3]該可固化之有機聚矽氧烷組合物含有:(S)在分子中具有至少兩個能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團之反應性有機聚矽氧烷,該反應性有機聚矽氧 烷S在該兩個能夠進行固化反應之基團之間具有小於10,000之平均分子量,及(L)在分子中具有至少兩個能夠以縮合反應、加成反應、過氧化反應或光反應進行固化反應之基團之反應性有機聚矽氧烷,該反應性有機聚矽氧烷L在該兩個能夠進行固化反應之基團之間具有不小於10,000且不大於150,000之分子量,且組份(S)及組份(L)之摻和比率(質量比率)為1:99至20:80。 The curable organopolyoxane composition of claim 1 or 2, which additionally satisfies all of the compositional features set forth in [1], [2] and [3] below: [1] relative to the curable The entire organopolyoxane component in the organopolyoxane composition, the curable organopolyoxane composition containing the formula: M in an amount of not less than 0.1% by mass and not more than 10% by mass a M R b D c D R d T e T R f Q g represents an organopolyoxane wherein the value of (a+c)/(b+d+e+f+g) is less than 3; In the above formula, M is a triorganosyloxy unit; a D is a diorganomethoxy unit; a T is a monoorganomethoxy unit; and a Q is a decyl unit represented by SiO 4/2 ; and the oxime The substituent R on each of the oxy units is a group capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction; [2] relative to the curable organopolyoxane The curable organopolyoxane composition containing, in an amount of not less than 75% by mass and not more than 99.9% by mass in the composition, having only a condensation reaction at the end of two molecules, is added in an amount of not less than 75% by mass and not more than 99.9% by mass. a reactive organopolyoxane which reacts, peroxidizes or photoreacts a group which undergoes a curing reaction; [3] the curable organopolyoxane composition contains: (S) having at least two capable molecules in the molecule a reactive organopolyoxyalkylene group which undergoes a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction, and the reactive organopolyoxyalkylene S is in the two groups capable of undergoing a curing reaction. a reactive organopolyoxyalkylene having an average molecular weight of less than 10,000 and (L) having at least two groups capable of undergoing a curing reaction by a condensation reaction, an addition reaction, a peroxidation reaction or a photoreaction in the molecule, The reactive organopolyoxane L has a molecular weight of not less than 10,000 and not more than 150,000 between the two groups capable of undergoing a curing reaction, and the blend ratio (mass) of the component (S) and the component (L) The ratio) is 1:99 to 20:80. 如請求項7之可固化之有機聚矽氧烷組合物,其中相對於該可固化之有機聚矽氧烷組合物中之該等全部有機聚矽氧烷組份,由上文[1]之通式MaMR bDcDR dTeTR fQg代表之該等反應性有機聚矽氧烷之重量分數不大於5質量%。 The curable organopolyoxane composition of claim 7, wherein the total organopolyoxane component in the curable organopolyoxane composition is as described in [1] above The weight fraction of the reactive organopolysiloxanes represented by the formula M a M R b D c D R d T e T R f Q g is not more than 5% by mass. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該能夠進行固化反應之基團係能夠進行加成反應之基團,式(I)中之Rb係選自由以下組成之群之基團:具有1至10個碳之視情況經取代之單價烴基團(其限制條件為Rb係除具有6至10個碳之單價芳族烴基團外之基團)、氫原子、具有2至8個碳之烯基、具有1至4個碳之烷氧基及羥基,且Rb之至少一部分係能夠進行加成反應之選自氫原子及具有2至8個碳之烯基之基團。 The curable organopolyoxane composition according to claim 1 or 2, wherein the group capable of undergoing a curing reaction is a group capable of undergoing an addition reaction, and the R b in the formula (I) is selected from the group consisting of Group of groups: a monovalent hydrocarbon group substituted with 1 to 10 carbons as appropriate (with the limitation that R b is a group other than a monovalent aromatic hydrocarbon group having 6 to 10 carbons), a hydrogen atom An alkenyl group having 2 to 8 carbons, an alkoxy group having 1 to 4 carbons, and a hydroxyl group, and at least a part of R b is selected from a hydrogen atom and an alkene having 2 to 8 carbons capable of undergoing an addition reaction. Base group. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該有機聚矽氧烷含有具有矽鍵結氫原子之有機聚矽氧烷及具有矽鍵結不飽和烴基團之有機聚矽氧烷,其中該有機聚矽氧烷中該等矽鍵結氫原子及該等矽鍵結不飽和烴基團之摻和比率(莫耳比率)為0.5:1.0至3.0:1.0(矽鍵結氫原子:矽鍵結不飽和烴基團)。 The curable organopolyoxane composition according to claim 1 or 2, wherein the organopolysiloxane comprises an organopolysiloxane having a hydrazine-bonded hydrogen atom and an organopoly group having a hydrazine-bonded unsaturated hydrocarbon group. a siloxane having a blend ratio (molar ratio) of the hydrazine-bonded hydrogen atoms and the hydrazine-bonded unsaturated hydrocarbon groups in the organopolyoxane of from 0.5:1.0 to 3.0:1.0 (矽 bond Hydrogen atom: 矽-bonded unsaturated hydrocarbon group). 如請求項1或2之可固化之有機聚矽氧烷組合物,其包括至少一種類型之反應性有機氫聚矽氧烷,其中該有機聚矽氧烷在分子中具有至少兩個矽鍵結氫原子,氫原子之重量分數為0.01重量% 至2.0重量%,及至少一種類型之反應性有機聚矽氧烷,其中重複單元數超過200,其在分子鏈之兩個末端具有烯基,烯基之重量分數為0.05重量%至5.0重量%;該組合物進一步包括:矽氫化反應觸媒;及介電無機微粒,其在1kHz及室溫下具有不小於10之比介電常數。 The curable organopolyoxane composition of claim 1 or 2, comprising at least one type of reactive organohydrogenpolyoxane, wherein the organopolyoxyalkylene has at least two hydrazone linkages in the molecule The hydrogen atom and the hydrogen atom have a weight fraction of 0.01% by weight. Up to 2.0% by weight, and at least one type of reactive organopolyoxane, wherein the number of repeating units exceeds 200, which has an alkenyl group at both ends of the molecular chain, and the weight fraction of the alkenyl group is 0.05% by weight to 5.0% by weight The composition further comprises: a hydrazine hydrogenation reaction catalyst; and a dielectric inorganic fine particle having a dielectric constant of not less than 10 at 1 kHz and room temperature. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中該有機聚矽氧烷之至少一部分係具有高介電官能基之有機聚矽氧烷。 The curable organopolyoxane composition of claim 1 or 2, wherein at least a portion of the organopolyoxyalkylene is an organopolyoxane having a high dielectric functional group. 如請求項1或2之可固化之有機聚矽氧烷組合物,其進一步包括具有高介電官能基之化合物(參與該固化反應之有機聚矽氧烷除外)。 The curable organopolyoxane composition of claim 1 or 2, which further comprises a compound having a high dielectric functional group (except for the organopolyoxyalkylene participating in the curing reaction). 如請求項1或2之可固化之有機聚矽氧烷組合物,其進一步包括至少一種類型之平均初級顆粒直徑小於50nm之無機微粒。 The curable organopolyoxane composition of claim 1 or 2, further comprising at least one type of inorganic particulate having an average primary particle diameter of less than 50 nm. 如請求項14之可固化之有機聚矽氧烷組合物,其中該至少一種類型之平均初級顆粒直徑小於50nm之無機微粒進一步含有增強無機微粒。 The curable organopolyoxane composition of claim 14, wherein the at least one inorganic fine particle having an average primary particle diameter of less than 50 nm further contains reinforcing inorganic fine particles. 如請求項1或2之可固化之有機聚矽氧烷組合物,其中藉由一或多種類型之表面處理劑對部分或所有該等無機微粒進行表面處理。 The curable organopolyoxane composition of claim 1 or 2, wherein some or all of the inorganic microparticles are surface treated by one or more types of surface treatment agents. 如請求項1或2之可固化之有機聚矽氧烷組合物,其進一步包括用於改良脫模性或介電崩潰特性之添加劑。 The curable organopolyoxane composition of claim 1 or 2, further comprising an additive for improving release properties or dielectric breakdown characteristics. 一種有機聚矽氧烷固化產物,其具有不小於200%之根據JIS K 6249量測之拉伸斷裂伸長率,該產物係藉由至少部分地固化如請求項1至17中任一項之可固化之有機聚矽氧烷組合物來形成。 An organic polyoxane cured product having a tensile elongation at break according to JIS K 6249 of not less than 200%, the product being at least partially cured as claimed in any one of claims 1 to 17. The cured organopolyoxane composition is formed. 一種轉換器之構件,該構件係藉由至少部分地固化如請求項1至17中任一項之可固化之有機聚矽氧烷組合物來形成。 A member of a converter formed by at least partially curing the curable organopolyoxane composition of any one of claims 1 to 17. 一種轉換器,其包括佈置在至少一對電極之間之聚矽氧彈性體中間層,該聚矽氧彈性體中間層係藉由如請求項1至17中任一項之可固化之有機聚矽氧烷組合物之固化反應或部分固化反應來形成。 A converter comprising an intermediate layer of a polyoxyxene elastomer disposed between at least one pair of electrodes, the intermediate layer of the polyoxyxene elastomer being curable by organic polymerization according to any one of claims 1 to 17. The curing reaction or partial curing reaction of the decane composition is formed. 如請求項20之轉換器,其中堆疊至少兩個聚矽氧彈性體層。 A converter according to claim 20, wherein at least two layers of polyoxyxene elastomer are stacked. 一種產生如請求項1至17中任一項之可固化之有機聚矽氧烷組合物之方法,該方法包括以下步驟:使用至少一種選自由以下組成之群之機械部件摻和至少兩種構成該可固化之有機聚矽氧烷組合物之組份:雙螺桿擠出機、雙螺桿捏合機及單螺桿葉片型擠出機。 A method of producing a curable organopolyoxane composition according to any one of claims 1 to 17, the method comprising the steps of: blending at least two of at least one mechanical component selected from the group consisting of The components of the curable organopolyoxane composition: a twin-screw extruder, a twin-screw kneader, and a single-screw blade type extruder.
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