TW201533162A - Addition-curable silicone resin composition, addition-curable silicone resin cured product, and optical semiconductor element sealed body - Google Patents

Addition-curable silicone resin composition, addition-curable silicone resin cured product, and optical semiconductor element sealed body Download PDF

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TW201533162A
TW201533162A TW103146180A TW103146180A TW201533162A TW 201533162 A TW201533162 A TW 201533162A TW 103146180 A TW103146180 A TW 103146180A TW 103146180 A TW103146180 A TW 103146180A TW 201533162 A TW201533162 A TW 201533162A
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Shohei SANADA
Noriaki Fukuda
Katsumasa Yamamoto
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Sumitomo Seika Chemicals
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/56Materials, e.g. epoxy or silicone resin
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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Abstract

The purpose of the present invention is to provide an addition-curable silicone resin composition having excellent interface adhesion and transparency. The purpose of the present invention is also to provide an addition-curable silicone resin cured product comprising said addition-curable silicone resin composition and to provide an optical semiconductor element sealed body. This addition-curable silicone resin composition contains an addition-curable silicone resin mixture and an adhesiveness-imparting agent. The adhesiveness-imparting agent contains a compound having a structural unit indicated by formula (1-3) and/or a structural unit indicated by formula (1-4), between a structural unit indicated by formula (1-1) and a structural unit indicated by formula (1-2). Each R1a in formula (1-1) and formula (1-2) independently indicates a C1-18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a C2-9 alkenyl group, or a C1-4 alkoxy group. Each R1b in formula (1-3) and formula (1-4) independently indicates a C1-18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a C2-9 alkenyl group, or a C1-4 alkoxy group. m in formula (1-3) indicates an integer 1-50 and n in formula (1-4) indicates an integer 1-1,500. Each A in formulas (1-1)-(1-3) independently indicates a C1-18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a C2-9 alkenyl group, a C1-4 alkoxy group, or a group indicated by formula (2). However, at least one A in formulas (1-1)-(1-3) indicates a group indicated by formula (2). R2a in formula (2) indicates a C1-8 alkylene group having some carbon atoms, excluding carbon atoms bonded to silicon atoms, substitutable by oxygen atoms. Each R2b independently indicates a C1-3 alkylene group and each R3 independently indicates a C1-18 alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a group including a sulfonyl group, an acyl group, a (meth) acryloyl oxyalkl group, or a silyl group. In formula (2), x is an integer 0-2 and Y is an oxygen atom or NH.

Description

加成硬化型聚矽氧樹脂組成物、加成硬化型聚矽氧樹脂硬化物、及光半導體元件密封體 Addition-hardening polyphthalocyanine resin composition, addition-hardening type polyoxymethylene resin cured product, and optical semiconductor element sealing body

本發明係關於一種界面接著性及透明性優異之加成硬化型聚矽氧樹脂組成物。又,本發明係關於一種使用該加成硬化型聚矽氧樹脂組成物而成之加成硬化型聚矽氧樹脂硬化物及光半導體元件密封體。 The present invention relates to an addition-curable polydecane resin composition excellent in interfacial adhesion and transparency. Moreover, the present invention relates to an addition-curable polyphthalocyanine cured product and an optical semiconductor element sealing body which are obtained by using the addition-curable polyoxyxylene resin composition.

於LED或光半導體裝置中,通常將透明樹脂用作發光元件之密封材料。作為該透明樹脂,有環氧樹脂或加成硬化型、縮合硬化型、UV硬化型等之聚矽氧樹脂。其中,加成硬化型聚矽氧樹脂藉由乙烯基矽基與氫矽基之矽氫化反應,而不生成副產物地形成耐候性、耐熱性等特性優異之硬化物,故而被用於白色LED等高亮度、高輸出之光半導體元件之密封材料用途。然而,該等加成硬化型聚矽氧樹脂對半導體材料之構成構件之接著性低。例如,近年來採用耐候性或耐濕性優異之PCT(聚(對苯二甲酸-1,4-環己二甲酯))代替耐候性或耐濕性等長期穩定性存在問題之PPA(聚鄰苯二甲醯胺樹脂)作為反射器材料,但PCT於分子內不具有氫鍵結性予體,因此一般的聚矽氧樹脂對PCT之接著性差。又,聚矽氧樹脂對廣泛用作電極之銀等貴金屬之接著性亦不充分。 In an LED or optical semiconductor device, a transparent resin is generally used as a sealing material for a light-emitting element. Examples of the transparent resin include an epoxy resin, a polyoxygen resin such as an addition curing type, a condensation curing type, and a UV curing type. Among them, the addition-hardening polyphthalocyanine resin is used for white LEDs by hydrogenation reaction of a vinyl fluorenyl group and a hydroquinone group to form a cured product excellent in weather resistance and heat resistance without forming by-products. The use of sealing materials for high-intensity, high-output optical semiconductor components. However, these addition-hardening type polyoxyxylene resins have low adhesion to constituent members of semiconductor materials. For example, in recent years, PCT (poly(tert-butylene terephthalate)) which is excellent in weather resistance or moisture resistance has been used in place of PPA (polymerization) which has problems in long-term stability such as weather resistance or moisture resistance. The phthalamide resin is used as a reflector material, but PCT does not have a hydrogen bonding property in the molecule, and therefore the general polyoxyxene resin has poor adhesion to PCT. Further, the polyoxyxene resin is insufficient in adhesion to a noble metal such as silver which is widely used as an electrode.

進而,存在如下問題:接著後,接著性亦因來自發光元件之發熱或溫度週期而降低,容易於PCT等之基材或貴金屬電極與聚矽氧樹脂之間產生剝離。 Further, there is a problem that the adhesiveness is further lowered by heat generation or temperature cycle from the light-emitting element, and it is easy to cause peeling between the substrate of PCT or the like and the noble metal electrode and the polyoxyn resin.

為了解決該等問題,藉由添加各種矽烷偶合劑等接著性賦予劑而謀求接著性之提高,但效果並不充分,進而具有接著性因明顯之吸濕而降低等變得缺乏耐久性之缺陷。 In order to solve such problems, it is possible to improve the adhesion by adding an adhesion imparting agent such as various decane coupling agents, but the effect is not sufficient, and further, defects such as decrease in durability due to significant moisture absorption and the like are lacking in durability. .

於專利文獻1中,揭示有一種摻合有具有環氧基之異三聚氰酸酯作為矽烷偶合劑以外之接著性賦予劑之加成硬化型聚矽氧樹脂組成物,於專利文獻2中,作為具有接著性之聚矽氧樹脂,揭示有一種官能基末端為羥基之含有胺基甲酸酯基之反應性改質聚矽氧樹脂。 Patent Document 1 discloses an addition-curable polydecane resin composition in which an isomeric cyanurate having an epoxy group is blended as an adhesion imparting agent other than a decane coupling agent, and Patent Document 2 discloses As a polyfluorene resin having an adhesive property, a reactive modified polyoxyxylene resin containing a urethane group having a functional group terminal hydroxyl group is disclosed.

專利文獻1:日本特開2006-137797號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-137797

專利文獻2:國際公開第2012/108609號 Patent Document 2: International Publication No. 2012/108609

然而,如專利文獻1所揭示之摻合異三聚氰酸酯之方法其提高對基材之接著性之效果並不充分。進而,異三聚氰酸酯難以相溶於聚矽氧樹脂,因此有無法充分獲得透明性之情況。 However, the method of blending isomeric cyanurate as disclosed in Patent Document 1 is insufficient in improving the adhesion to the substrate. Further, since the isomeric isocyanate is difficult to be dissolved in the polyoxynoxy resin, transparency may not be sufficiently obtained.

又,於利用與乙烯基之矽氫化反應之加成硬化型聚矽氧樹脂中,如專利文獻2所揭示之改質聚矽氧樹脂有如下之虞:於硬化時,該氫矽基與改質聚矽氧樹脂中之羥基產生作為副反應之脫氫反應,引起雜質之生成或樹脂物性之降低。 Further, in the addition-hardening polyoxyxene resin which is subjected to hydrogenation reaction with a vinyl group, the modified polyoxymethylene resin disclosed in Patent Document 2 has the following defects: in the case of hardening, the hydroquinone group is modified. The hydroxyl group in the polyoxygenated resin produces a dehydrogenation reaction as a side reaction, causing the formation of impurities or a decrease in the physical properties of the resin.

本發明之目的在於提供一種界面接著性及透明性優異之加成硬化型聚矽氧樹脂組成物。又,本發明之目的在於提供一種使用該加成硬化型聚矽氧樹脂組成物而成之加成硬化型聚矽氧樹脂硬化物及光半導體元件密封體。 An object of the present invention is to provide an addition-curable polydecane resin composition which is excellent in interfacial adhesion and transparency. Moreover, an object of the present invention is to provide an addition-curable polyphthalocyanine cured product and an optical semiconductor element sealing body which are obtained by using the addition-curable polyoxyxylene resin composition.

本發明係一種加成硬化型聚矽氧樹脂組成物,其係含有加成硬化型聚矽氧樹脂混合物及接著性賦予劑者,且上述接著性賦予劑含有於下述式(1-1)表示之結構單位與下述式(1-2)表示之結構單位之間具有下述式(1-3)表示之結構單位及/或下述式(1-4)表示之結構單位的化合物。 The present invention relates to an addition-curable polyfluorene-oxygen resin composition containing an addition-curable polyphthalocyanine resin mixture and an adhesion imparting agent, and the adhesion imparting agent is contained in the following formula (1-1) The structural unit represented by the following formula (1-2) has a structural unit represented by the following formula (1-3) and/or a structural unit represented by the following formula (1-4).

式(1-1)及式(1-2)中,R1a分別獨立地表示碳數1~18 之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基。式(1-3)及式(1-4)中,R1b分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基。式(1-3)中,m為1~50之整數,式(1-4)中,n為1~1500之整數。式(1-1)~(1-3)中,A分別獨立為碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、碳數1~4之烷氧基、或下述式(2)表示之基。其中,式(1-1)~(1-3)中,至少1個A為式(2)表示之基。 In the formulae (1-1) and (1-2), R 1a each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. Or an alkoxy group having 1 to 4 carbon atoms. In the formulae (1-3) and (1-4), R 1b each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. Or an alkoxy group having 1 to 4 carbon atoms. In the formula (1-3), m is an integer of 1 to 50, and in the formula (1-4), n is an integer of 1 to 1500. In the formulae (1-1) to (1-3), A is independently an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, an alkenyl group having 2 to 9 carbon atoms, and a carbon number of 1 Alkoxy group of ~4 or a group represented by the following formula (2). Among them, at least one of the formulae (1-1) to (1-3) is a group represented by the formula (2).

式(2)中,R2a表示除鍵結於矽原子之碳原子以外之一部分碳原子亦可經氧原子取代之碳數1~8之伸烷基(alkylene),R2b分別獨立地表示碳數1~3之伸烷基,R3分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、含磺醯基之基、醯基、(甲基)丙烯醯氧基烷基、或矽基。式(2)中,x為0~2之整數,Y為氧原子或NH。 In the formula (2), R 2a represents an alkylene group having 1 to 8 carbon atoms which may be substituted with an oxygen atom in addition to a carbon atom bonded to a halogen atom, and R 2b independently represents carbon. a 1-3 alkyl group, and R 3 independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, a sulfonyl group-containing group, a fluorenyl group, and a (meth) propylene group. Alkoxyalkyl, or fluorenyl. In the formula (2), x is an integer of 0 to 2, and Y is an oxygen atom or NH.

以下詳細敍述本發明。 The invention is described in detail below.

本發明者等人發現,藉由對加成硬化型聚矽氧樹脂混合物摻合具有特定結構之化合物作為接著性賦予劑,可獲得具有極其優異之界面接著性及透明性的加成硬化型聚矽氧樹脂組成物,從而完成了本發明。 The inventors of the present invention have found that by adding a compound having a specific structure to an addition-curable polyoxyxene resin mixture as an adhesion imparting agent, an addition-hardening type polymerization having extremely excellent interfacial adhesion and transparency can be obtained. The epoxy resin composition, thereby completing the present invention.

本發明之加成硬化型聚矽氧樹脂組成物含有於上述式 (1-1)表示之結構單位與上述式(1-2)表示之結構單位之間具有上述式(1-3)表示之結構單位及/或上述式(1-4)表示之結構單位的化合物(以下,亦稱為「本發明之接著性賦予劑」)作為接著性賦予劑。再者,式(1-1)及式(1-2)表示之結構單位意指分子末端。本發明之接著性賦予劑可為嵌段共聚物,亦可為無規共聚物。 The addition-hardening polyphthalocene resin composition of the present invention is contained in the above formula The structural unit represented by (1-1) and the structural unit represented by the above formula (1-2) have a structural unit represented by the above formula (1-3) and/or a structural unit represented by the above formula (1-4). The compound (hereinafter also referred to as "the adhesion imparting agent of the present invention") is used as an adhesion imparting agent. Further, the structural unit represented by the formula (1-1) and the formula (1-2) means a molecular terminal. The adhesion imparting agent of the present invention may be a block copolymer or a random copolymer.

本發明之接著性賦予劑可單獨使用1種,亦可組合2種以上而使用。 The adhesiveness imparting agent of the present invention may be used singly or in combination of two or more.

上述式(1-1)及上述式(1-2)中,R1a分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基。再者,於本說明書中,所謂「分別獨立」意指「可相同亦可不同」。 In the above formula (1-1) and the above formula (1-2), R 1a each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkene having 2 to 9 carbon atoms. a base or an alkoxy group having 1 to 4 carbon atoms. Furthermore, in the present specification, the phrase "separately independent" means "may be the same or different".

作為上述R1a所表示之碳數1~18之烷基,例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、新戊基、三級戊基、正己基、正庚基、2,2,4-三甲基戊基、正辛基、異辛基、正壬基、正癸基、正十二烷基等。其中,較佳為甲基。 Examples of the alkyl group having 1 to 18 carbon atoms represented by the above R 1a include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a tertiary butyl group, and a n-pentyl group. , neopentyl, tertiary amyl, n-hexyl, n-heptyl, 2,2,4-trimethylpentyl, n-octyl, isooctyl, n-decyl, n-decyl, n-dodecyl Wait. Among them, a methyl group is preferred.

作為上述R1a所表示之環烷基,例如可列舉:環戊基、環己基、環庚基、甲基環己基等。 Examples of the cycloalkyl group represented by the above R 1a include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a methylcyclohexyl group.

作為上述R1a所表示之芳基,例如可列舉:苯基、甲苯基、二甲苯基、乙基苯基、萘基等。其中,較佳為苯基。 Examples of the aryl group represented by the above R 1a include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, and a naphthyl group. Among them, a phenyl group is preferred.

作為上述R1a所表示之芳烷基,例如可列舉:苄基、α-苯乙基、β-苯乙基等。 Examples of the aralkyl group represented by the above R 1a include a benzyl group, an α-phenethyl group, and a β-phenethyl group.

作為上述R1a所表示之碳數2~9之烯基,例如可列舉:乙烯基、烯丙基、丁烯基、(甲基)丙烯醯氧基烷基等。 Examples of the alkenyl group having 2 to 9 carbon atoms represented by R 1a include a vinyl group, an allyl group, a butenyl group, and a (meth)acryloxyalkyl group.

再者,於本說明書中,上述「(甲基)丙烯醯基」意指丙烯醯基或甲基丙烯醯基。 In the present specification, the above "(meth)acryloyl group" means an acryloyl group or a methacryl group.

作為上述R1a所表示之碳數1~4之烷氧基,例如可列舉:甲氧基、乙氧基、正丙氧基、正丁氧基等。 Examples of the alkoxy group having 1 to 4 carbon atoms represented by the above R 1a include a methoxy group, an ethoxy group, a n-propoxy group, and a n-butoxy group.

於該等之中,上述R1a較佳為碳數1~18之烷基、芳基,更佳為甲基、苯基。 Among these, R 1a is preferably an alkyl group or an aryl group having 1 to 18 carbon atoms, more preferably a methyl group or a phenyl group.

上述式(1-3)及上述式(1-4)中,R1b分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基或碳數1~4之烷氧基。 In the above formula (1-3) and the above formula (1-4), R 1b each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkene having 2 to 9 carbon atoms. Alkoxy group having 1 or 4 carbon atoms.

作為上述R1b所表示之碳數1~18之烷基,例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、新戊基、三級戊基、正己基、正庚基、2,2,4-三甲基戊基、正辛基、異辛基、正壬基、正癸基、正十二烷基等。其中,較佳為甲基。 Examples of the alkyl group having 1 to 18 carbon atoms represented by the above R 1b include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a tertiary butyl group, and a n-pentyl group. , neopentyl, tertiary amyl, n-hexyl, n-heptyl, 2,2,4-trimethylpentyl, n-octyl, isooctyl, n-decyl, n-decyl, n-dodecyl Wait. Among them, a methyl group is preferred.

作為上述R1b所表示之環烷基,例如可列舉:環戊基、環己基、環庚基、甲基環己基等。 Examples of the cycloalkyl group represented by the above R 1b include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a methylcyclohexyl group.

作為上述R1b所表示之芳基,例如可列舉:苯基、甲苯基、二甲苯基、乙基苯基、萘基等。其中,較佳為苯基。 Examples of the aryl group represented by the above R 1b include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, and a naphthyl group. Among them, a phenyl group is preferred.

作為上述R1b所表示之芳烷基,例如可列舉:苄基、α-苯乙基、β-苯乙基等。 Examples of the aralkyl group represented by the above R 1b include a benzyl group, an α-phenethyl group, and a β-phenethyl group.

作為上述R1b所表示之碳數2~9之烯基,例如可列舉:乙烯基、烯丙基、丁烯基、(甲基)丙烯醯氧基烷基等。 Examples of the alkenyl group having 2 to 9 carbon atoms represented by the above R 1b include a vinyl group, an allyl group, a butenyl group, and a (meth)acryloxyalkylene group.

作為上述R1b所表示之碳數1~4之烷氧基,例如可列舉:甲 氧基、乙氧基、正丙氧基、正丁氧基等。 Examples of the alkoxy group having 1 to 4 carbon atoms represented by the above R 1b include a methoxy group, an ethoxy group, a n-propoxy group, and a n-butoxy group.

於該等之中,上述R1b較佳為碳數1~18之烷基、芳基、碳數2~9之烯基、碳數1~4之烷氧基,更佳為甲基、苯基。 Among these, R 1b is preferably an alkyl group having 1 to 18 carbon atoms, an aryl group, an alkenyl group having 2 to 9 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, more preferably a methyl group or a benzene group. base.

上述式(1-3)中,m為1~50之整數,較佳為2~45之整數。上述式(1-4)中,n為1~1500之整數,較佳為2~1400之整數。 In the above formula (1-3), m is an integer of from 1 to 50, preferably an integer of from 2 to 45. In the above formula (1-4), n is an integer of from 1 to 1,500, preferably an integer of from 2 to 1400.

於本發明之接著性賦予劑具有上述式(1-3)及上述式(1-4)之兩者之結構單位之情形時,m與n之比率較佳為m:n=1:0.5~1:160,更佳為m:n=1:1~1:120。 In the case where the adhesion imparting agent of the present invention has a structural unit of both the above formula (1-3) and the above formula (1-4), the ratio of m to n is preferably m: n = 1: 0.5~ 1:160, more preferably m:n=1:1~1:120.

再者,於m及/或n為2以上之情形時,重複單位中之各R1b可相同亦可不同。 Further, when m and/or n is 2 or more, each of R 1b in the repeating unit may be the same or different.

上述式(1-1)~(1-3)中,A分別獨立為碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、碳數1~4之烷氧基、或上述式(2)表示之基。 In the above formulae (1-1) to (1-3), A is independently an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, an alkenyl group having 2 to 9 carbon atoms, and a carbon number. An alkoxy group of 1 to 4 or a group represented by the above formula (2).

作為上述A所表示之碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、及碳數1~4之烷氧基,可分別列舉與上述R1a或上述R1b相同者。 The alkyl group having 1 to 18 carbon atoms represented by the above A, a cycloalkyl group, an aryl group, an aralkyl group, an alkenyl group having 2 to 9 carbon atoms, and an alkoxy group having 1 to 4 carbon atoms may be respectively listed. The above R 1a or the above R 1b is the same.

於本發明之接著性賦予劑不具有上述式(1-3)表示之結構單位之情形時,就提高接著性之效果優異等而言,較佳為上述式(1-1)及上述式(1-2)中之A均為式(2)表示之基。 In the case where the adhesion imparting agent of the present invention does not have the structural unit represented by the above formula (1-3), the effect of improving the adhesion is excellent, and the like, and the above formula (1-1) and the above formula (preferably) A in 1-2) is a group represented by the formula (2).

上述式(2)中,R2a表示除鍵結於矽原子之碳原子以外之一部分碳原子亦可經氧原子取代之碳數1~8之伸烷基。 In the above formula (2), R 2a represents an alkylene group having 1 to 8 carbon atoms which may be substituted with an oxygen atom in addition to a carbon atom bonded to a halogen atom.

作為上述R2a所表示之碳數1~8之伸烷基,例如可列舉:亞甲基、伸 乙基、伸正丙基、伸正丁基、伸正戊基、伸正己基、伸正辛基、及該等伸烷基之一部分碳原子經氧原子取代而成之基等。其中,較佳為伸乙基、伸正丙基、伸正丁基、伸正戊基、伸正己基、及該等伸烷基之一部分碳原子經氧原子取代而成之基。 Examples of the alkylene group having 1 to 8 carbon atoms represented by the above R 2a include a methylene group, an ethylidene group, an exo-propyl group, an exo-butyl group, a di-n-pentyl group, a hexyl group, a decyl group, and A group in which a part of carbon atoms of the alkyl group are substituted by an oxygen atom. Among them, a group in which an ethyl group, an exo-propyl group, an exo-butyl group, a pentyl group, a hexyl group, and a carbon atom of one of the alkyl groups are substituted with an oxygen atom is preferred.

上述式(2)中,R2b分別獨立地表示碳數1~3之伸烷基。作為上述R2b所表示之碳數1~3之伸烷基,可列舉:亞甲基、伸乙基、伸正丙基、及伸異丙基。 In the above formula (2), R 2b each independently represents an alkylene group having 1 to 3 carbon atoms. Examples of the alkylene group having 1 to 3 carbon atoms represented by the above R 2b include a methylene group, an ethylidene group, a stretched propyl group, and an extended isopropyl group.

再者,於式(2)中之x為2之情形時,2個R2b可相同亦可不同。 Furthermore, in the case where x in the formula (2) is 2, the two R 2b may be the same or different.

上述式(2)中,R3分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、含磺醯基之基、醯基、(甲基)丙烯醯氧基烷基、或矽基。 In the above formula (2), R 3 each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, a sulfonyl group-containing group, a fluorenyl group, or a (meth) propylene oxy group. Alkyl, or fluorenyl.

作為上述R3所表示之碳數1~18之烷基,例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、新戊基、三級戊基、正己基、正庚基、2,2,4-三甲基戊基、正辛基、異辛基、正壬基、正癸基、正十二烷基、正十八烷基等。再者,該等烷基之氫原子亦可被取代,具體而言,亦可將1個以上之氫原子以氯代基、溴代基等鹵代基取代。又,亦可將烷基末端之碳原子以三乙氧基矽基取代。作為上述R3所表示之碳數1~18之烷基,其中,較佳為乙基、正丙基、異丙基、正丁基、正己基、正庚基、正十二烷基、正十八烷基,更佳為乙基、正丙基、正丁基、正己基、正庚基。 Examples of the alkyl group having 1 to 18 carbon atoms represented by R 3 include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a tertiary butyl group, and a n-pentyl group. , neopentyl, tertiary amyl, n-hexyl, n-heptyl, 2,2,4-trimethylpentyl, n-octyl, isooctyl, n-decyl, n-decyl, n-dodecyl , n-octadecyl and the like. Further, the hydrogen atom of the alkyl group may be substituted, and specifically, one or more hydrogen atoms may be substituted with a halogen group such as a chloro group or a bromo group. Further, the carbon atom at the alkyl terminal may be substituted with a triethoxyindenyl group. The alkyl group having 1 to 18 carbon atoms represented by the above R 3 is preferably an ethyl group, a n-propyl group, an isopropyl group, an n-butyl group, a n-hexyl group, a n-heptyl group or an n-dodecyl group. The octadecyl group is more preferably ethyl, n-propyl, n-butyl, n-hexyl or n-heptyl.

作為上述R3所表示之環烷基,例如可列舉:環戊基、環己基、環庚基、甲基環己基等。其中,較佳為環戊基、環己基,更佳為環己 基。 Examples of the cycloalkyl group represented by the above R 3 include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a methylcyclohexyl group. Among them, a cyclopentyl group and a cyclohexyl group are preferred, and a cyclohexyl group is more preferred.

作為上述R3所表示之芳基,例如可列舉苯基、萘基、聯苯基等。該等芳基亦可具有取代基。於該芳基具有取代基之情形時,作為該取代基,例如可列舉:氟代基、氯代基、溴代基等鹵代基;甲基、乙基、正丙基、異丙基、正丁基等碳數1~4之烷基;將該等烷基之氫原子之至少1個以上以氟代基、氯代基、溴代基等鹵代基取代而成之鹵代烷基;甲氧基、乙氧基等烷氧基;將該等烷氧基之1個以上之氫原子以氟代基、氯代基、溴代基等鹵代基取代而成之鹵代烷氧基;或硝基等。作為上述R3所表示之芳基,其中,較佳為苯基、萘基、聯苯基,更佳為苯基。 Examples of the aryl group represented by the above R 3 include a phenyl group, a naphthyl group, and a biphenyl group. These aryl groups may also have a substituent. In the case where the aryl group has a substituent, examples of the substituent include a halogen group such as a fluoro group, a chloro group or a bromo group; a methyl group, an ethyl group, a n-propyl group, an isopropyl group, and the like. An alkyl group having 1 to 4 carbon atoms such as n-butyl group; a halogenated alkyl group in which at least one or more hydrogen atoms of the alkyl group are substituted with a halogen group such as a fluoro group, a chloro group or a bromo group; An alkoxy group such as an oxy group or an ethoxy group; a halogenated alkoxy group obtained by substituting one or more hydrogen atoms of the alkoxy group with a halogen group such as a fluoro group, a chloro group or a bromo group; or Base. The aryl group represented by the above R 3 is preferably a phenyl group, a naphthyl group or a biphenyl group, more preferably a phenyl group.

作為上述R3所表示之芳烷基,例如可列舉:苄基、甲基苄基、異丙烯基二甲基苄基、苯乙基、萘乙基等。其中,較佳為苄基、苯乙基,更佳為苯乙基。 Examples of the aralkyl group represented by the above R 3 include a benzyl group, a methylbenzyl group, an isopropenyldimethylbenzyl group, a phenethyl group, and a naphthylethyl group. Among them, a benzyl group or a phenethyl group is preferred, and a phenethyl group is more preferred.

作為上述R3所表示之含磺醯基之基,例如可列舉苯磺醯基、對甲苯磺醯基等。 Examples of the sulfonyl group-containing group represented by the above R 3 include a benzenesulfonyl group and a p-toluenesulfonyl group.

作為上述R3所表示之醯基,例如可列舉三氯乙醯基等。 Examples of the thiol group represented by the above R 3 include a trichloroethenyl group and the like.

作為上述R3所表示之(甲基)丙烯醯氧基烷基,例如可列舉甲基丙烯醯氧基乙基等。 Examples of the (meth)acryloxyalkyl group represented by the above R 3 include a methacryloxyethyl group and the like.

作為上述R3所表示之矽基,例如可列舉三甲基矽基等。 Examples of the fluorenyl group represented by the above R 3 include a trimethyl fluorenyl group and the like.

於該等之中,上述R3較佳為碳數1~18之烷基、環烷基、芳基、芳烷基,更佳為芳烷基,進而較佳為苯乙基。 Among these, R 3 is preferably an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group or an aralkyl group, more preferably an aralkyl group, and still more preferably a phenethyl group.

再者,於式(2)中之x為1以上之情形時,各R3可相同亦可不同。 Further, when x in the formula (2) is 1 or more, each R 3 may be the same or different.

上述式(2)中,x為0~2之整數,Y為氧原子或NH。 In the above formula (2), x is an integer of 0 to 2, and Y is an oxygen atom or NH.

上述x較佳為0或1之整數。 The above x is preferably an integer of 0 or 1.

再者,x為0之情形意指R2a與Y直接鍵結之情形。 Furthermore, the case where x is 0 means that R 2a is directly bonded to Y.

作為本發明之接著性賦予劑,就與加成硬化型聚矽氧樹脂混合物之相溶性、或原料之獲取性之觀點等而言,較佳為式(2)中之R3分別獨立為碳數1~18之烷基、環烷基、芳基、或芳烷基者。 It is preferable that R 3 in the formula (2) is independently carbon as the adhesion imparting agent of the present invention, from the viewpoint of compatibility with the addition-curable polyoxyxene resin mixture or the availability of raw materials. A number of 1 to 18 alkyl, cycloalkyl, aryl, or aralkyl groups.

本發明之接著性賦予劑之官能基為脲基(N-CO-NH)及/或胺基甲酸酯基(N-CO-O)。更詳細而言,所謂接著性賦予劑之官能基當量係指由(接著性賦予劑之分子量)/(脲基及胺基甲酸酯基之合計莫耳數)所定義且對應於m與n之比率者。本發明之接著性賦予劑之上述式(2)之官能基當量之較佳下限為100,較佳上限為12000。若本發明之接著性賦予劑之上述式(2)之官能基當量未達100,則有不顯示出與上述式(2)表示之基之官能基當量相稱之接著性,或者與加成硬化型聚矽氧樹脂混合物之相溶性較差之情況。若本發明之接著性賦予劑之上述式(2)之官能基當量超過12000,則有所獲得之加成硬化型聚矽氧樹脂組成物之接著性變得不充分之情況。 The functional group of the adhesion imparting agent of the present invention is a urea group (N-CO-NH) and/or a urethane group (N-CO-O). More specifically, the functional group equivalent of the adhesion imparting agent is defined by (the molecular weight of the adhesion imparting agent) / (the total number of moles of the urea group and the urethane group) and corresponds to m and n. The ratio. The lower limit of the functional group equivalent of the above formula (2) of the adhesion imparting agent of the present invention is preferably 100, and the upper limit is preferably 12,000. When the functional group equivalent of the above formula (2) of the adhesion imparting agent of the present invention is less than 100, it may not exhibit an adhesion commensurate with the functional group equivalent of the group represented by the above formula (2), or may be added to hardenability. The compatibility of the type of polyoxyxene resin mixture is poor. When the functional group equivalent of the above formula (2) of the adhesive agent of the present invention exceeds 12,000, the adhesion of the obtained addition-curable polydecane resin composition may be insufficient.

本發明之接著性賦予劑之上述式(2)之官能基當量的更佳之下限為200,更佳之上限為9000,進而較佳之下限為300,進而較佳之上限為8000。 The lower limit of the functional group equivalent of the above formula (2) of the adhesion imparting agent of the present invention is preferably 200, more preferably 9000, and still more preferably 300, and further preferably 8000.

作為本發明之接著性賦予劑之製造方法,例如可列舉使於下述式(3-1)表示之結構單位與下述式(3-2)表示之結構單位之間具有下述式(3-3)表示之結構單位及/或下述式(3-4)表示之結構單位的聚矽氧化合物(以下,亦稱為「具有胺基及/或羥基之聚矽氧化合物」)與下述式(4)表示之異氰酸酯化合物(以下,亦簡稱為「異氰酸酯化合物」)反 應之方法等。 In the method for producing the adhesion imparting agent of the present invention, for example, the structural unit represented by the following formula (3-1) and the structural unit represented by the following formula (3-2) have the following formula (3). -3) a structural unit represented by a structural unit represented by the following formula (3-4) (hereinafter, also referred to as "a polyoxyl compound having an amine group and/or a hydroxyl group") and The isocyanate compound (hereinafter, also referred to simply as "isocyanate compound") represented by the formula (4) is inversely The method should be the same.

式(3-1)及式(3-2)中,R1a分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基。式(3-3)及式(3-4)中,R1b分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基。式(3-3)中,m為1~50之整數,式(3-4)中,n為1~1500之整數。式(3-1)~式(3-3)中,B分別獨立為碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、碳數1~4之烷氧基、或下述式(5)表示之基。其中,式(3-1)~(3-3)中,至少1個B為式(5)表示之基。 In the formulae (3-1) and (3-2), R 1a each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. Or an alkoxy group having 1 to 4 carbon atoms. In the formula (3-3) and the formula (3-4), R 1b each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. Or an alkoxy group having 1 to 4 carbon atoms. In the formula (3-3), m is an integer of 1 to 50, and in the formula (3-4), n is an integer of 1 to 1500. In the formula (3-1) to the formula (3-3), B is independently an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, an alkenyl group having 2 to 9 carbon atoms, and a carbon number. An alkoxy group of 1 to 4 or a group represented by the following formula (5). Among them, at least one of the formulae (3-1) to (3-3) is a group represented by the formula (5).

再者,式(3-1)及式(3-2)中之R1a與式(1-1)及式(1-2)中 之R1a成為分別相同之基,式(3-3)及式(3-4)中之R1b與式(1-3)及式(1-4)中之R1b成為分別相同之基。 Further, R 1a in the formula (1-1) and (1-2) in the formula (3-1) and (3-2) each of R 1a becomes the same group, the formula (3-3) R 1b of the formula and the formula (1-3) (3-4) and the formula R (1-4) in the group 1b respectively become the same.

式(4)中,R3表示碳數1~18之烷基、環烷基、芳基、芳烷基、含磺醯基之基、醯基、(甲基)丙烯醯氧基烷基、或矽基。 In the formula (4), R 3 represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, a sulfonyl group-containing group, a fluorenyl group, a (meth) propylene decyloxyalkyl group, Or 矽基.

再者,式(4)中之R3與式(2)中之R3成為分別相同之基。 Further, the formula R (4) and in 3 of the formula R (2) in each of the three groups be the same.

式(5)中,R2a表示除鍵結於矽原子之碳原子以外之一部分碳原子亦可經氧原子取代之碳數1~8之伸烷基,R2b分別獨立地表示碳數1~3之伸烷基。式(5)中,x為0~2之整數,Y表示氧原子或NH。 In the formula (5), R 2a represents an alkylene group having 1 to 8 carbon atoms which may be substituted by an oxygen atom in addition to a carbon atom bonded to a halogen atom, and R 2b independently represents a carbon number of 1~. 3 alkylene. In the formula (5), x is an integer of 0 to 2, and Y represents an oxygen atom or NH.

於式(5)中之x為2之情形時,2個R2b可相同亦可不同。 In the case where x in the formula (5) is 2, the two R 2b may be the same or different.

再者,式(5)中之R2a與式(2)中之R2a成為分別相同之基,式(5)中之R2b與式(2)中之R2b成為分別相同之基。 Further, the formula R (5) in the formula R 2a (2) of the respective group 2a become the same, the formula (5) (2) of R in the formula R 2b and 2b, respectively, be the same group.

於利用上述製造方法製造之情形時,上述具有胺基及/或羥基之聚矽氧化合物之胺基當量及羥基當量相當於上述本發明之接著性賦予劑之官能基當量。再者,關於本發明之接著性賦予劑之官能基,於將具有胺基之聚矽氧化合物用作原料而製造接著性賦予劑之情形時為脲基(N-CO-NH),於將具有羥基之聚矽氧化合物用作原料之情形時為胺基甲酸酯基(N-CO-O)。 In the case of production by the above production method, the amine group equivalent and the hydroxyl group equivalent of the above-mentioned amine group and/or hydroxyl group-containing polyoxo compound correspond to the functional group equivalent of the above-mentioned binder of the present invention. In addition, the functional group of the adhesion imparting agent of the present invention is a urea group (N-CO-NH) when a polyfluorene oxide compound having an amine group is used as a raw material to produce an adhesion imparting agent. In the case where a polyoxonium compound having a hydroxyl group is used as a raw material, it is a urethane group (N-CO-O).

再者,作為測定上述具有胺基之聚矽氧化合物之胺基當量之方法,例如可列舉使用過氯酸之非水中和滴定等方法。又,上述具有羥基之聚矽氧化合物之羥基當量可利用上述具有羥基之聚矽氧化合物之羥值算出。作為求出上述具有羥基之聚矽氧化合物之羥值之方法,例如可列舉JIS K 5601-2-1所記載之方法等。 In addition, as a method of measuring the amine group equivalent of the above-mentioned amine group-containing polyoxo compound, for example, a method such as non-aqueous titration using perchloric acid may be mentioned. Further, the hydroxyl equivalent of the above polyoxyalkylene compound having a hydroxyl group can be calculated from the hydroxyl value of the polyoxyalkylene compound having a hydroxyl group. The method of obtaining the hydroxyl value of the polyoxosiloxane having a hydroxyl group is, for example, a method described in JIS K 5601-2-1.

作為上述具有胺基之聚矽氧化合物之合成方法,可使用美國專利第3355424號說明書、美國專利第2947771號說明書、美國專利第3890269號說明書等所揭示之方法,即,使用可使得具有烷基胺基之二烷氧基烷基矽烷單位插入至矽氧烷之鏈中之聚縮合反應。該反應通常於酸性或鹼性觸媒之存在下進行。該反應亦可以使用二烷氧基烷基矽烷及環狀矽氧烷之聚合反應之形式進行。進而,可使用日本特開平03-095227號公報所揭示的於鹼性觸媒及環狀聚醚之存在下對環狀有機聚矽氧烷及胺基烷基二矽氧烷進行加熱而使之反應的方法、或日本特開平05-043695號公報所揭示的於鹼性觸媒之存在下對環狀有機聚矽氧烷及胺基烷基聚矽氧烷進行加熱而使之反應的方法等。 As a method for synthesizing the above-mentioned amine group-containing polyoxo compound, a method disclosed in the specification of U.S. Patent No. 3,355,424, the specification of U.S. Patent No. 2,947,771, the specification of U.S. Patent No. 3,890,269, etc., The polyalkylene oxide unit of the amino group is inserted into the polycondensation reaction in the chain of the decane. This reaction is usually carried out in the presence of an acidic or basic catalyst. This reaction can also be carried out in the form of a polymerization reaction of a dialkoxyalkyl decane and a cyclic siloxane. Further, the cyclic organopolyoxane and the aminoalkyl dioxane can be heated in the presence of a basic catalyst and a cyclic polyether disclosed in JP-A-03-095227. A method of reacting a cyclic organopolysiloxane and an aminoalkyl polyoxyalkylene in the presence of a basic catalyst as disclosed in JP-A-2005-043695, and the like. .

又,作為上述具有羥基之聚矽氧化合物之合成方法,可使用日本特開平04-88024號公報等所揭示的使具有與矽原子鍵結之氫原子之聚有機矽氧烷與具有脂肪族不飽和烴基之有機矽化合物於鉑系觸媒之存在下進行加成的方法。於該方法中,首先,藉由使用鉑系觸媒之矽氫化,使具有與矽原子鍵結之氫原子之聚有機矽氧烷對具有脂肪族不飽和烴基之有機矽化合物進行加成。其次,藉由脫矽化將利用加成反應而生成之聚有機矽氧烷之分子鏈末端之三烷基矽基去除,將分子鏈末端變換為羥基而獲得含羥基之 聚有機矽氧烷。 Further, as a method for synthesizing the polyoxosiloxane having a hydroxyl group, a polyorganosiloxane having a hydrogen atom bonded to a ruthenium atom and having an aliphatic group can be used as disclosed in JP-A-2004-88024. A method of adding an organic sulfonium compound having a saturated hydrocarbon group in the presence of a platinum-based catalyst. In this method, first, a polyorganosiloxane having a hydrogen atom bonded to a ruthenium atom is added to an organic ruthenium compound having an aliphatic unsaturated hydrocarbon group by hydrogenation using a platinum-based catalyst. Next, the trialkylsulfonyl group at the end of the molecular chain of the polyorganosiloxane which is formed by the addition reaction is removed by deuteration, and the terminal of the molecular chain is converted into a hydroxyl group to obtain a hydroxyl group. Polyorganosiloxane.

作為上述具有胺基之聚矽氧化合物中之市售者,例如可列舉:KF-864、KF-865、KF-868、KF-857、KF-8001、KF-862(單胺型)、KF-859、KF-393、KF-860、KF-880、KF-8004、KF-8002、KF-8005、KF-867、KF-869、KF-861(二胺型)、X-22-1660B-3、X-22-9409(兩末端胺、側鏈苯基型)、PAM-E、KF-8010、X-22-161A、X-22-161B、KF-8012、KF-8008(兩末端胺型)(均為信越化學工業公司製造)、BY16-205、BY16-849、FZ-3785、BY16-872、BY16-213、FZ-3705(側鏈胺型)(均為Dow Corning Toray公司製造)、AMS-132、AMS-152、AMS-162(側鏈胺型)、DMS-A11、DMS-A12、DMS-A15、DMS-A21(兩末端胺型)(均為Gelest,Inc.製造)等。 As a commercially available one of the above-mentioned amine group-containing polyoxo compounds, for example, KF-864, KF-865, KF-868, KF-857, KF-8001, KF-862 (monoamine type), KF -859, KF-393, KF-860, KF-880, KF-8004, KF-8002, KF-8005, KF-867, KF-869, KF-861 (diamine type), X-22-1660B- 3, X-22-9409 (both terminal amine, side chain phenyl type), PAM-E, KF-8010, X-22-161A, X-22-161B, KF-8012, KF-8008 (both terminal amine Type) (all manufactured by Shin-Etsu Chemical Co., Ltd.), BY16-205, BY16-849, FZ-3785, BY16-872, BY16-213, FZ-3705 (side chain amine type) (all manufactured by Dow Corning Toray) , AMS-132, AMS-152, AMS-162 (side chain amine type), DMS-A11, DMS-A12, DMS-A15, DMS-A21 (both terminal amine type) (all manufactured by Gelest, Inc.), etc. .

作為上述具有羥基之聚矽氧化合物中之市售者,例如可列舉:X-22-4039、X-22-4015(側鏈甲醇型)、X-22-160AS、KF-6001、KF-6002、KF-6003(兩末端甲醇型)、X-22-170BX、X-22-170DX(單末端甲醇型)(均為信越化學工業公司製造)、SF8428(側鏈甲醇型)、SF8427、BY16-201、BY16-004(兩末端甲醇型)(均為Dow Corning Toray公司製造)、DMS-C15、DMS-C21(兩末端甲醇型)(均為Gelest,Inc.製造)等。 As a commercial one of the above-mentioned polyoxyl compounds having a hydroxyl group, for example, X-22-4039, X-22-4015 (side chain methanol type), X-22-160AS, KF-6001, KF-6002 can be cited. , KF-6003 (both end methanol type), X-22-170BX, X-22-170DX (single-end methanol type) (all manufactured by Shin-Etsu Chemical Co., Ltd.), SF8428 (side chain methanol type), SF8427, BY16- 201, BY16-004 (both terminal methanol type) (all manufactured by Dow Corning Toray Co., Ltd.), DMS-C15, DMS-C21 (both terminal methanol type) (all manufactured by Gelest, Inc.) and the like.

作為上述異氰酸酯化合物,例如可列舉:異氰酸乙酯、異氰酸正丙酯、異氰酸正丁酯、異氰酸正己酯、異氰酸正庚酯、異氰酸正十二烷基酯、異氰酸正十八烷基酯、異氰酸異丙酯、異氰酸三級丁酯、異氰酸2-氯乙酯、異氰酸三氯甲酯、異氰酸3-(三乙氧基矽基)丙酯、異氰酸環戊酯、異氰酸環己酯、反式-4-甲基環己基異氰酸酯、異氰酸苯酯、異氰酸鄰甲 苯酯、異氰酸間甲苯酯、異氰酸對甲苯酯、異氰酸4-乙基苯酯、異氰酸4-正丁基苯酯、異氰酸2,6-二甲基苯酯、異氰酸3,5-二甲基苯酯、異氰酸2,6-二異丙基苯酯、異氰酸3-氯-4-甲基苯酯、異氰酸2-甲氧基苯酯、異氰酸3-甲氧基苯酯、異氰酸4-甲氧基苯酯、異氰酸2-(三氟甲氧基)苯酯、異氰酸4-(三氟甲氧基)苯酯、異氰酸4-乙氧基苯酯、異氰酸2-(三氟甲基)苯酯、異氰酸3-(三氟甲基)苯酯、異氰酸4-(三氟甲基)苯酯、異氰酸3,5-雙(三氟甲基)苯酯、異氰酸2-氟苯酯、異氰酸3-氟苯酯、異氰酸4-氟苯酯、異氰酸2,4-二氟苯酯、異氰酸2,5-二氟苯酯、異氰酸3,4-二氟苯酯、異氰酸2-氯苯酯、異氰酸3-氯苯酯、異氰酸4-氯苯酯、異氰酸2-氯-5-(三氟甲基)苯酯、異氰酸4-氯-3-硝基苯酯、異氰酸2,3-二氯苯酯、異氰酸2,4-二氯苯酯、異氰酸2,5-二氯苯酯、異氰酸2,6-二氯苯酯、異氰酸3,4-二氯苯酯、異氰酸3,5-二氯苯酯、異氰酸2,4,6-三氯苯酯、異氰酸2-溴苯酯、異氰酸3-溴苯酯、異氰酸4-溴苯酯、異氰酸4-硝基苯酯、異氰酸1-萘酯、異氰酸2-聯苯酯、異氰酸苄酯、異氰酸苯乙酯、(R)-(+)-α-甲基苄基異氰酸酯、(S)-(-)-α-甲基苄基異氰酸酯、(R)-(-)-1-(1-萘基)乙基異氰酸酯、(S)-(+)-1-(1-萘基)乙基異氰酸酯、3-異丙烯基-α,α-二甲基苄基異氰酸酯、異氰酸苯磺醯酯、異氰酸對甲苯磺醯酯、三氯乙醯基異氰酸酯、異氰酸2-甲基丙烯醯氧基乙酯、異氰酸三甲基矽酯等。其中,就經濟性或獲取性等觀點而言,較佳為異氰酸乙酯、異氰酸正丙酯、異氰酸正丁酯、異氰酸正己酯、異氰酸正庚酯、異氰酸環己酯、異氰酸苯酯、異氰酸苄酯、異氰酸苯乙酯。 Examples of the above isocyanate compound include ethyl isocyanate, n-propyl isocyanate, n-butyl isocyanate, n-hexyl isocyanate, n-heptyl isocyanate, and n-dodecyl isocyanate. Ester, n-octadecyl isocyanate, isopropyl isocyanate, butyl isocyanate, 2-chloroethyl isocyanate, trichloromethyl isocyanate, isocyanate 3-( Triethoxymercapto)propyl ester, cyclopentyl isocyanate, cyclohexyl isocyanate, trans-4-methylcyclohexyl isocyanate, phenyl isocyanate, isocyanate Phenyl ester, m-toluene isocyanate, p-toluene isocyanate, 4-ethylphenyl isocyanate, 4-n-butylphenyl isocyanate, 2,6-dimethylphenyl isocyanate , 3,5-dimethylphenyl isocyanate, 2,6-diisopropylphenyl isocyanate, 3-chloro-4-methylphenyl isocyanate, 2-methoxy isocyanate Phenyl ester, 3-methoxyphenyl isocyanate, 4-methoxyphenyl isocyanate, 2-(trifluoromethoxy)phenyl isocyanate, 4-(trifluoromethoxy) isocyanate Phenyl ester, 4-ethoxyphenyl isocyanate, 2-(trifluoromethyl)phenyl isocyanate, 3-(trifluoromethyl)phenyl isocyanate, isocyanate 4-( Trifluoromethyl)phenyl ester, 3,5-bis(trifluoromethyl)phenyl isocyanate, 2-fluorophenyl isocyanate, 3-fluorophenyl isocyanate, 4-fluorobenzene isocyanate Ester, 2,4-difluorophenyl isocyanate, 2,5-difluorophenyl isocyanate, 3,4-difluorophenyl isocyanate, 2-chlorophenyl isocyanate, isocyanic acid 3-Chlorophenyl ester, 4-chlorophenyl isocyanate, 2-chloro-5-(trifluoromethyl)phenyl isocyanate, 4-chloro-3-nitrophenyl isocyanate, isocyanic acid 2,3-dichlorophenyl ester, 2,4-dichlorophenyl isocyanate, 2,5-dichlorophenyl isocyanate, 2,6-dichlorophenyl isocyanate, isocyanic acid 3, 4-dichloro Ester, 3,5-dichlorophenyl isocyanate, 2,4,6-trichlorophenyl isocyanate, 2-bromophenyl isocyanate, 3-bromophenyl isocyanate, isocyanic acid 4 -bromophenyl ester, 4-nitrophenyl isocyanate, 1-naphthyl isocyanate, 2-biphenyl isocyanate, benzyl isocyanate, phenylethyl isocyanate, (R)-( +)-α-methylbenzyl isocyanate, (S)-(-)-α-methylbenzyl isocyanate, (R)-(-)-1-(1-naphthyl)ethyl isocyanate, (S) -(+)-1-(1-naphthyl)ethyl isocyanate, 3-isopropenyl-α,α-dimethylbenzyl isocyanate, phenylsulfonyl isocyanate, p-toluenesulfonate isocyanate , trichloroacetic acid isocyanate, 2-methylpropenyloxyethyl isocyanate, trimethyl decyl isocyanate, and the like. Among them, from the viewpoints of economy or availability, ethyl isocyanate, n-propyl isocyanate, n-butyl isocyanate, n-hexyl isocyanate, n-heptyl isocyanate, and the like are preferred. Cyclohexyl cyanate, phenyl isocyanate, benzyl isocyanate, phenylethyl isocyanate.

作為上述具有胺基及/或羥基之聚矽氧化合物與上述異氰 酸酯化合物之反應中之上述異氰酸酯化合物之使用量,於上述式(5)之x為0且Y為NH之情形時,相對於具有胺基之聚矽氧化合物之胺基1莫耳,較佳為0.8~5莫耳,更佳為0.9~3莫耳。又,於上述式(5)之x為0且Y為氧原子之情形時,相對於具有羥基之聚矽氧化合物之羥基1莫耳,較佳為0.8~5莫耳,更佳為0.9~3莫耳。於上述式(5)之x為1或2且Y為NH之情形時,相對於具有胺基之聚矽氧化合物之胺基1莫耳,較佳為0.8~5莫耳,更佳為0.9~3莫耳。又,於式(5)之x為1或2且Y為氧原子之情形時,相對於具有胺基及羥基之聚矽氧化合物之胺基與羥基之合計1莫耳,較佳為0.8~5莫耳,更佳為0.9~3莫耳。此處所謂之胺基係可與上述異氰酸酯化合物反應之胺基,詳細而言為一級胺基及二級胺基。 As the above polyoxonium compound having an amine group and/or a hydroxyl group, and the above isocyanide The amount of the above-mentioned isocyanate compound used in the reaction of the acid ester compound is such that when x of the above formula (5) is 0 and Y is NH, it is relative to the amine group 1 mole of the polyoxonium compound having an amine group. Good is 0.8~5 moles, more preferably 0.9~3 moles. Further, when x in the above formula (5) is 0 and Y is an oxygen atom, it is preferably 0.8 to 5 m, more preferably 0.9 to the hydroxyl group of the polyoxonium compound having a hydroxyl group. 3 Mo Er. In the case where x of the above formula (5) is 1 or 2 and Y is NH, it is preferably 0.8 to 5 moles, more preferably 0.9, with respect to the amine group 1 mole of the polyoxonium compound having an amine group. ~3 moles. Further, when x in the formula (5) is 1 or 2 and Y is an oxygen atom, the total of the amine group and the hydroxyl group relative to the polyoxymethane compound having an amine group and a hydroxyl group is 1 mole, preferably 0.8 to 5 moles, more preferably 0.9 to 3 moles. The amine group referred to herein is an amine group which is reactive with the above isocyanate compound, and is specifically a primary amine group and a secondary amine group.

上述具有胺基及/或羥基之聚矽氧化合物與上述異氰酸酯化合物之反應亦可於溶劑之存在下進行。作為所使用之溶劑,只要為上述具有胺基及/或羥基之聚矽氧化合物容易溶解且不阻礙上述具有胺基及/或羥基之聚矽氧化合物與上述異氰酸酯化合物之反應者,則並無特別限定,例如可列舉:己烷、庚烷、苯、甲苯、二甲苯、氯苯、二氯苯、環己烷、二氯甲烷、氯仿、二乙醚、二異丙醚、丙酮、甲基乙基酮、甲基異丁基酮等。 The reaction of the above polyoxosiloxane having an amine group and/or a hydroxyl group with the above isocyanate compound can also be carried out in the presence of a solvent. The solvent to be used is not particularly limited as long as the polyoxonium compound having an amine group and/or a hydroxyl group is easily dissolved and does not inhibit the reaction of the above polyoxo compound having an amine group and/or a hydroxyl group with the above isocyanate compound. Particularly, for example, hexane, heptane, benzene, toluene, xylene, chlorobenzene, dichlorobenzene, cyclohexane, dichloromethane, chloroform, diethyl ether, diisopropyl ether, acetone, methyl ethyl Ketone, methyl isobutyl ketone, and the like.

上述具有胺基及/或羥基之聚矽氧化合物與上述異氰酸酯化合物之反應根據所使用之溶劑較佳為以-20~150℃之範圍內之溫度進行,更佳為以0~140℃之範圍內之溫度不使用溶劑而進行。 The reaction of the above polyamine oxide having an amine group and/or a hydroxyl group with the above isocyanate compound is preferably carried out at a temperature in the range of -20 to 150 ° C, more preferably in the range of 0 to 140 ° C, depending on the solvent to be used. The temperature inside is carried out without using a solvent.

本發明之加成硬化型聚矽氧樹脂組成物中之本發明之接著性賦予劑之含量的較佳下限為0.01質量%,較佳上限為15質量%。若本發 明之接著性賦予劑之含量未達0.01質量%,則有未充分發揮提高接著性之效果之情況。若本發明之接著性賦予劑之含量超過15質量%,則有對硬化物之硬度造成不良影響之情況。本發明之接著性賦予劑含量之更佳之下限為0.05質量%,更佳之上限為10質量%,進而較佳之下限為0.1質量%,進而較佳之上限為5質量%。 The lower limit of the content of the adhesion-imparting agent of the present invention in the addition-curable polyoxyxylene resin composition of the present invention is preferably 0.01% by mass, and the upper limit is preferably 15% by mass. If this hair When the content of the adhesion imparting agent is less than 0.01% by mass, the effect of improving the adhesion may not be sufficiently exhibited. When the content of the adhesion imparting agent of the present invention exceeds 15% by mass, the hardness of the cured product may be adversely affected. The lower limit of the content of the adhesion imparting agent of the present invention is preferably 0.05% by mass, more preferably 10% by mass, still more preferably 0.1% by mass, and still more preferably 5% by mass.

又,本發明之接著性賦予劑之含量相對於加成硬化型聚矽氧樹脂混合物100質量份,較佳之下限為0.01質量份,較佳之上限為20質量份。若本發明之接著性賦予劑之含量未達0.01質量份,則有未充分發揮提高接著性之效果之情況。若接著性賦予劑之含量超過20質量份,則有對硬化物之硬度造成不良影響之情況。本發明之接著性賦予劑之含量之更佳之下限為0.1質量份,更佳之上限為13質量份,進而較佳之下限為0.3質量份,進而較佳之上限為6質量份。 In addition, the content of the adhesion imparting agent of the present invention is preferably 0.01 parts by mass, and preferably 20 parts by mass, based on 100 parts by mass of the addition-curable polyoxirane resin mixture. When the content of the adhesion imparting agent of the present invention is less than 0.01 parts by mass, the effect of improving the adhesion may not be sufficiently exhibited. When the content of the adhesion imparting agent exceeds 20 parts by mass, the hardness of the cured product may be adversely affected. A more preferred lower limit of the content of the adhesion imparting agent of the present invention is 0.1 part by mass, more preferably an upper limit of 13 parts by mass, still more preferably a lower limit of 0.3 part by mass, and still more preferably an upper limit of 6 parts by mass.

本發明之加成硬化型聚矽氧樹脂組成物亦可在不阻礙本發明之目的之範圍內,除本發明之接著性賦予劑以外,含有其他接著性賦予劑。 The addition-curable polydecane resin composition of the present invention may contain other adhesion imparting agents in addition to the adhesion imparting agent of the present invention, within a range not inhibiting the object of the present invention.

本發明之加成硬化型聚矽氧樹脂組成物含有加成硬化型聚矽氧樹脂混合物。 The addition hardening type polyoxyxylene resin composition of the present invention contains an addition hardening type polyoxyxylene resin mixture.

上述加成硬化型聚矽氧樹脂混合物係含有藉由具有碳-碳雙鍵之矽基與氫矽基之矽氫化反應而硬化之加成硬化型聚矽氧樹脂的混合物。 The addition-hardening polyoxynoxy resin mixture contains a mixture of addition-curable polyoxynoxy resins which are hardened by hydrogenation reaction of a mercapto group having a carbon-carbon double bond with a hydroquinone group.

上述加成硬化型聚矽氧樹脂混合物較佳為含有:具有至少2個具有鍵結於矽原子之碳-碳雙鍵之取代基的聚有機矽氧烷(以下,亦稱為「含碳-碳雙鍵之聚有機矽氧烷」)、具有至少2個鍵結於矽原子之氫原子的聚有機 氫矽氧烷(以下,亦簡稱為「聚有機氫矽氧烷」)、及矽氫化反應觸媒。 The addition-hardening type polyoxyxene resin mixture preferably contains a polyorganosiloxane having at least two substituents having a carbon-carbon double bond bonded to a ruthenium atom (hereinafter, also referred to as "carbon-containing" a polyorganosiloxane having a carbon double bond"), a polyorganic having at least two hydrogen atoms bonded to a deuterium atom Hydroquinone (hereinafter also referred to as "polyorganohydroquinone") and a hydrogenation catalyst.

作為上述含碳-碳雙鍵之聚有機矽氧烷之分子結構,例如可列舉直鏈狀、環狀等結構,亦可於結構中具有支鏈。其中,較佳為主鏈由二有機矽氧烷單位之重複構成且兩末端由三有機矽烷氧基封端的直鏈狀結構。 The molecular structure of the polyorganosiloxane containing the carbon-carbon double bond may, for example, be a linear or cyclic structure, or may have a branch in the structure. Among them, a linear structure in which the main chain is composed of repeating units of diorganomoperoxane and the both ends are blocked by triorganosalkoxy groups is preferred.

作為上述含碳-碳雙鍵之聚有機矽氧烷中之具有鍵結於矽原子之碳-碳雙鍵之取代基,較佳為碳數為2~8者,具體而言例如可列舉:乙烯基、烯丙基、丁烯基、戊烯基、己烯基、庚烯基、丙烯醯基、甲基丙烯醯基等。其中,較佳為乙烯基、丙烯醯基、甲基丙烯醯基,更佳為乙烯基。 The substituent having a carbon-carbon double bond bonded to a ruthenium atom among the polyorganosiloxane containing the carbon-carbon double bond is preferably a carbon number of 2 to 8, and specifically, for example, Vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, propylene fluorenyl, methacryl fluorenyl and the like. Among them, a vinyl group, an acrylonitrile group, a methacryl fluorenyl group is preferred, and a vinyl group is more preferred.

於上述含碳-碳雙鍵之聚有機矽氧烷之分子結構為直鏈狀之情形時,具有碳-碳雙鍵之取代基可僅於分子鏈末端與中間之任一者鍵結於矽原子,亦可於分子鏈末端與中間之兩者鍵結於矽原子。 In the case where the molecular structure of the above-mentioned polyorganosiloxane containing a carbon-carbon double bond is linear, a substituent having a carbon-carbon double bond may be bonded to only one of the terminal and the middle of the molecular chain. An atom may also be bonded to a ruthenium atom at both the end and the middle of the molecular chain.

作為上述含碳-碳雙鍵之聚有機矽氧烷中之除具有碳-碳雙鍵之取代基以外之鍵結於矽原子之有機基,例如可列舉以下未經取代或經鹵素取代之1價烴基:甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基等碳數1~12之烷基;苯基、甲苯基、二甲苯基、萘基等碳數6~14之芳基;苄基、苯乙基、苯基丙基等芳烷基;或氯甲基、3-氯丙基、溴乙基、3,3,3-三氟丙基等鹵化烷基等。其中,較佳為烷基、芳基,更佳為甲基、苯基,進而較佳為甲基。 The organic group bonded to the ruthenium atom other than the substituent having a carbon-carbon double bond in the above-mentioned polyorganosiloxane containing a carbon-carbon double bond, for example, the following unsubstituted or halogen-substituted 1 Valence hydrocarbon group: methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-decyl, n-decyl, and the like, an alkyl group having 1 to 12 carbon atoms; a aryl group having 6 to 14 carbon atoms such as a benzyl group, a tolyl group, a xylyl group or a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group or a phenylpropyl group; or a chloromethyl group, a 3-chloropropyl group or a bromoethyl group; a halogenated alkyl group such as a 3,3,3-trifluoropropyl group or the like. Among them, an alkyl group or an aryl group is preferred, and a methyl group or a phenyl group is more preferred, and a methyl group is further preferred.

上述含碳-碳雙鍵之聚有機矽氧烷之黏度之較佳下限為100mPa‧s,較佳上限為10萬mPa‧s。於含碳-碳雙鍵之聚有機矽氧烷之黏度 處於該範圍內之情形時,所獲得之加成硬化型聚矽氧樹脂組成物之作業性良好,並且由該加成硬化型聚矽氧樹脂組成物所獲得之硬化物之物理特性良好。含碳-碳雙鍵之聚有機矽氧烷之黏度之更佳之下限為500mPa‧s,更佳之上限為1萬mPa‧s。 A preferred lower limit of the viscosity of the above-mentioned polyorganosiloxane containing a carbon-carbon double bond is 100 mPa‧s, and a preferred upper limit is 100,000 mPa‧s. Viscosity of polyorganosiloxanes containing carbon-carbon double bonds In the case of being in this range, the workability of the addition-hardening type polyoxyxylene resin composition obtained is good, and the physical properties of the cured product obtained from the addition-hardening type polyoxymethylene resin composition are good. A lower limit of the viscosity of the polyorganosiloxane containing a carbon-carbon double bond is 500 mPa‧s, and a more preferred upper limit is 10,000 mPa‧s.

再者,於本說明書中,上述「黏度」意指使用旋轉黏度計(BM型)於25℃之條件下所測得之值。 In the present specification, the above "viscosity" means a value measured using a rotational viscometer (BM type) at 25 °C.

作為上述含碳-碳雙鍵之聚有機矽氧烷,具體而言例如可列舉:分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基乙烯基矽氧烷共聚物、分子鏈兩末端由三甲基矽烷氧基封端之甲基乙烯基聚矽氧烷、分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基乙烯基矽氧烷-甲基苯基矽氧烷共聚物、分子鏈兩末端由二甲基乙烯基矽烷氧基封端之二甲基聚矽氧烷、分子鏈兩末端由二甲基乙烯基矽烷氧基封端之甲基乙烯基聚矽氧烷、分子鏈兩末端由二甲基乙烯基矽烷氧基封端之二甲基矽氧烷-甲基乙烯基矽氧烷共聚物、分子鏈兩末端由二甲基乙烯基矽烷氧基封端之二甲基矽氧烷-甲基乙烯基矽氧烷-甲基苯基矽氧烷共聚物、分子鏈兩末端由三乙烯基矽烷氧基封端之二甲基聚矽氧烷、由(R4)3SiO0.5(R4為具有烯基之未經取代或經取代之1價烴基,以下相同)表示之矽烷氧基單位、(R4)2R5SiO0.5(R5為烯基或包含烯基之基,以下相同)表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、及SiO2所表示之矽烷氧基單位構成之聚有機矽氧烷共聚物、由(R4)3SiO0.5所表示之矽烷氧基單位、(R4)2R5SiO0.5所表示之矽烷氧基單位、及SiO2所表示之矽烷氧基單位構成之聚有機矽氧烷共聚物、由(R4)2R5SiO0.5所表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、及 SiO2所表示之矽烷氧基單位構成之聚有機矽氧烷共聚物、由R4R5SiO所表示之矽烷氧基單位、及R4SiO1.5所表示之矽烷氧基單位、或R4SiO1.5所表示之矽烷氧基單位構成之聚有機矽氧烷共聚物、由(R4)3SiO0.5所表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、R4R5SiO所表示之矽烷氧基單位、R4SiO1.5所表示之矽烷氧基單位、及(R4)4Si2R6O(R6為2價烴基,以下相同)表示之矽烷氧基單位構成之聚有機矽氧烷共聚物、由(R4)2SiO所表示之矽烷氧基單位、R4R5SiO所表示之矽烷氧基單位、及(R4)4Si2R6O所表示之矽烷氧基單位構成之聚有機矽氧烷共聚物等。該等可單獨使用1種,亦可將2種以上組合而使用。 Specific examples of the polyorganosiloxane having a carbon-carbon double bond include a dimethyl methoxy oxane-methyl vinyl decane terminated by a trimethyl decyloxy group at both ends of the molecular chain. a copolymer, a methyl vinyl polyoxyalkylene terminated by a trimethyldecaneoxy group at both ends of the molecular chain, and a dimethyl methoxy alkane-methylethylene terminated at the two ends of the molecular chain by a trimethyldecyloxy group a quinone oxo-methylphenyl decane copolymer, a dimethylpolysiloxane having a dimethyl vinyl alkoxy group terminated at both ends of the molecular chain, and a dimethyl vinyl decane at both ends of the molecular chain Oxy-terminated methyl vinyl polyoxyalkylene, dimethyl methoxy alkane-methyl vinyl siloxane copolymer terminated by dimethyl vinyl decyloxy at both ends of the molecular chain, molecular chain two a dimethyl methoxy alkane-methylvinyl oxime-methyl phenyl siloxane copolymer terminated with a dimethylvinyl decyloxy group, and the two ends of the molecular chain are sealed by a trivinyl decyloxy group. the end of the dimethylpolysiloxane silicone siloxane by (R 4) 3 SiO 0.5 ( R 4 having the non-substituted alkenyl group or substituted monovalent hydrocarbon group of 1, hereinafter the same) table Silicon alkoxy UNIT silicon alkoxy units, (R 4) 2 R 5 SiO 0.5 (R 5 is an alkenyl group or comprises alkenyl group, the same applies hereinafter) represented by the, (R 4) 2 SiO represented by the silicon-alkoxy a polyorganosiloxane copolymer composed of a unit and a decyloxy unit represented by SiO 2 , a decyloxy unit represented by (R 4 ) 3 SiO 0.5 , and (R 4 ) 2 R 5 SiO 0.5 a polyorganooxyalkylene copolymer composed of a decyloxy unit and a decyloxy unit represented by SiO 2 , a decyloxy unit represented by (R 4 ) 2 R 5 SiO 0.5 , and (R 4 ) 2 SiO a polyorganosiloxane copolymer represented by a decyloxy unit and a decyloxy unit represented by SiO 2 , a decyloxy unit represented by R 4 R 5 SiO, and a decane represented by R 4 SiO 1.5 a polyorganosiloxane copolymer composed of an oxy unit or a decyloxy unit represented by R 4 SiO 1.5 , a decyloxy unit represented by (R 4 ) 3 SiO 0.5 , and (R 4 ) 2 SiO a decyloxy unit, a decyloxy unit represented by R 4 R 5 SiO, a decyloxy unit represented by R 4 SiO 1.5 , and (R 4 ) 4 Si 2 R 6 O (R 6 is a diorganohydrocarbyl group, the same as the above), a polyorganosiloxane copolymer represented by a decyloxy unit, a decyloxy unit represented by (R 4 ) 2 SiO, and a decyloxy unit represented by R 4 R 5 SiO And a polyorganosiloxane copolymer composed of a decyloxy unit represented by (R 4 ) 4 Si 2 R 6 O. These may be used alone or in combination of two or more.

作為上述R4,例如可列舉:甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基等碳數1~12之烷基;環戊基、環己基、環庚基等碳數3~8之環烷基;苯基、甲苯基、二甲苯基、萘基等碳數6~14之芳基;苄基、苯乙基、苯基丙基等芳烷基;或氯甲基、3-氯丙基、溴乙基、3,3,3-三氟丙基等鹵化烷基等。其中,上述R4較佳為烷基、芳基,更佳為甲基、苯基。 Examples of the above R 4 include a carbon number of 1 or more such as methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-decyl or n-decyl. Alkane having a carbon number of 3 to 8 such as a cyclopentyl group, a cyclohexyl group or a cycloheptyl group; an aryl group having a carbon number of 6 to 14 such as a phenyl group, a tolyl group, a xylyl group or a naphthyl group; An aralkyl group such as phenethyl or phenylpropyl; or a halogenated alkyl group such as chloromethyl, 3-chloropropyl, bromoethyl or 3,3,3-trifluoropropyl. Among them, the above R 4 is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group.

作為上述R5,較佳為碳數為2~8者,例如可列舉:乙烯基、烯丙基、丁烯基、戊烯基、己烯基、庚烯基、丙烯醯基、甲基丙烯醯基等。其中,較佳為乙烯基、丙烯醯基、甲基丙烯醯基,更佳為乙烯基。 The above R 5 is preferably a carbon number of 2 to 8, and examples thereof include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, a propylene group, and a methacryl group.醯基等. Among them, a vinyl group, an acrylonitrile group, a methacryl fluorenyl group is preferred, and a vinyl group is more preferred.

作為上述R6,例如可列舉:伸苯基、伸乙基、伸己基、伸辛基等。其中,較佳為伸苯基。 Examples of the above R 6 include a phenyl group, an ethyl group, a hexyl group, and an octyl group. Among them, a phenyl group is preferred.

作為上述含碳-碳雙鍵之聚有機矽氧烷中之市售者,例如可列舉:DMS-V21、DMS-V22、DMS-V25、DMS-V31、DMS-V33、 DMS-V35、DMS-V41、DMS-V42、DMS-V46、DMS-V25R、DMS-V35R(分子鏈兩末端由二甲基乙烯基矽烷氧基封端之二甲基聚矽氧烷)、PDV-0325、PDV-0331、PDV-0341、PDV-0346、PDV-0525、PDV-0535、PDV-0541、PDV-1625、PDV-1631、PDV-1635、PDV-1641、PDV-2331(分子鏈兩末端由二甲基乙烯基矽烷氧基封端之二甲基矽氧烷-二苯基矽氧烷共聚物)、VDT-123、VDT-127、VDT-131、VDT-431、VDT-731(分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基乙烯基矽氧烷共聚物)、PMV-9925(分子鏈兩末端由二甲基乙烯基矽烷氧基封端之苯基甲基聚矽氧烷)、PVV-3522(分子鏈兩末端由乙烯基苯基甲基封端之乙烯基苯基矽氧烷-苯基甲基矽氧烷共聚物)(均為Gelest,Inc.製造)等。 As a commercially available one of the above-mentioned polyorganosiloxane containing a carbon-carbon double bond, for example, DMS-V21, DMS-V22, DMS-V25, DMS-V31, DMS-V33, DMS-V35, DMS-V41, DMS-V42, DMS-V46, DMS-V25R, DMS-V35R (dimethyl polyoxyalkylene terminated by dimethyl vinyl alkoxy group at both ends of the molecular chain), PDV -0325, PDV-0331, PDV-0341, PDV-0346, PDV-0525, PDV-0535, PDV-0541, PDV-1625, PDV-1631, PDV-1635, PDV-1641, PDV-2331 (molecular chain two a dimethyl methoxy alkane-diphenyl decane copolymer terminated with a dimethylvinyl alkoxy group, VDT-123, VDT-127, VDT-131, VDT-431, VDT-731 ( a dimethyl methoxy alkane-methylvinyl fluorene copolymer terminated by a trimethyl decyloxy group at both ends of the molecular chain, PMV-9925 (both ends of the molecular chain are sealed by dimethyl vinyl decyloxy) Phenylmethyl polyoxane at the end, PVV-3522 (vinyl phenyl methoxy oxane-phenylmethyl decane copolymer terminated by a vinyl phenylmethyl group at both ends of the molecular chain) For the manufacture of Gelest, Inc.) and the like.

上述聚有機氫矽氧烷係與上述含碳-碳雙鍵之聚有機矽氧烷反應,作為交聯成分發揮作用。 The polyorganohydroquinoxane is reacted with the above-mentioned polyorganosiloxane having a carbon-carbon double bond to function as a crosslinking component.

作為上述聚有機氫矽氧烷,例如可使用具有直線狀、環狀、支鏈狀、三維網狀結構(樹脂狀)等分子結構之各種聚有機氫矽氧烷。 As the polyorganohydrohalosiloxane, for example, various polyorganohydrohalosiloxanes having a molecular structure such as a linear, a cyclic, a branched, or a three-dimensional network structure (resin) can be used.

上述聚有機氫矽氧烷於1分子中具有2個以上、較佳為3個以上之鍵結於矽原子之氫原子、即氫矽基(Si-H基)。於上述聚有機氫矽氧烷之分子結構為直線狀之情形時,該等Si-H基可僅位於分子鏈末端與中間部之任一者,亦可位於該兩者。 The polyorganohydroquinone has 2 or more, preferably 3 or more, hydrogen atoms bonded to a halogen atom, that is, a hydroquinone group (Si-H group) in one molecule. In the case where the molecular structure of the polyorganohydroquinone is linear, the Si-H groups may be located only at either the end of the molecular chain and the intermediate portion, or both.

上述聚有機氫矽氧烷之1分子中之矽原子之個數(聚合度)較佳為2~1000,更佳為3~100。 The number (degree of polymerization) of the ruthenium atoms in one molecule of the above polyorganohydroquinone is preferably from 2 to 1,000, more preferably from 3 to 100.

作為上述聚有機氫矽氧烷,例如可使用R7 aHbSiO(4 a-b/2)(R7係碳數為1~14之未經取代或經取代之1價烴基。R7之碳數較佳為1~10。 a及b較佳為0.7≦a≦2.1、0.001≦b≦1.0,且滿足0.8≦a+b≦3.0之正數,更佳為滿足1.0≦a+b≦2.5之正數)表示之聚有機氫矽氧烷。 As the above polyorganohydroquinone oxyalkylene, for example, R 7 a H b SiO (4 ab / 2) (R 7 -based unsubstituted or substituted monovalent hydrocarbon group having 1 to 14 carbon atoms; R 7 carbon can be used. The number is preferably from 1 to 10. a and b are preferably 0.7 ≦ a ≦ 2.1, 0.001 ≦ b ≦ 1.0, and satisfy a positive number of 0.8 ≦ a + b ≦ 3.0, more preferably satisfying 1.0 ≦ a + b ≦ 2.5 A polyorganohydroquinone represented by a positive number.

作為上述R7,例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、三級丁基、正戊基、新戊基、正己基、正辛基、正壬基、正癸基等碳數1~12之烷基;環戊基、環己基、環庚基等碳數3~8之環烷基;苯基、甲苯基、二甲苯基、萘基等碳數6~14之芳基;苄基、苯乙基、苯基丙基等芳烷基;乙烯基、烯丙基等烯基;或將該等烴基中之氫原子之一部分或全部以鹵素原子取代而成之基、例如氯甲基、3-氯丙基、溴乙基、3,3,3-三氟丙基等。其中,上述R7較佳為烷基、芳基,更佳為甲基或苯基,進而較佳為甲基。 Examples of the above R 7 include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, neopentyl, n-hexyl, n-octyl. a carbon number of 1 to 12 such as a fluorenyl group or a fluorenyl group; a cycloalkyl group having a carbon number of 3 to 8 such as a cyclopentyl group, a cyclohexyl group or a cycloheptyl group; a phenyl group, a tolyl group, a xylyl group, and a naphthyl group; An aryl group having 6 to 14 carbon atoms; an aralkyl group such as a benzyl group, a phenethyl group or a phenylpropyl group; an alkenyl group such as a vinyl group or an allyl group; or a part or all of a hydrogen atom in the hydrocarbon group; A group substituted with a halogen atom, for example, a chloromethyl group, a 3-chloropropyl group, a bromoethyl group, a 3,3,3-trifluoropropyl group or the like. Among them, the above R 7 is preferably an alkyl group or an aryl group, more preferably a methyl group or a phenyl group, and still more preferably a methyl group.

再者,上述R7可為相同之烴基,亦可不同。 Further, the above R 7 may be the same hydrocarbon group or different.

作為上述聚有機氫矽氧烷中之R7 aHbSiO(4 a-b/2)所表示之聚有機氫矽氧烷,具體而言例如可列舉:分子鏈兩末端由三甲基矽烷氧基封端之甲基氫聚矽氧烷、分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基氫矽氧烷共聚物、分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基氫矽氧烷-甲基苯基矽氧烷共聚物、分子鏈兩末端由二甲基氫矽烷氧基封端之二甲基聚矽氧烷、分子鏈兩末端由二甲基氫矽烷氧基封端之二甲基聚矽氧烷-甲基氫矽氧烷共聚物、分子鏈兩末端由二甲基氫矽烷氧基封端之二甲基矽氧烷-甲基苯基矽氧烷共聚物、分子鏈兩末端由二甲基氫矽烷氧基封端之甲基苯基聚矽氧烷、由(R4)3SiO0.5(R4如上所述)表示之矽烷氧基單位、(R4)2HSiO0.5所表示之矽烷氧基單位及SiO2所表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物、由(R4)2HSiO0.5所表示之矽烷氧基單位 及SiO2所表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物、由R4HSiO所表示之矽烷氧基單位及R4SiO1.5所表示之矽烷氧基單位、或HSiO1.5所表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物等。 Specific examples of the polyorganohydrohalosiloxane represented by R 7 a H b SiO (4 ab / 2) in the above polyorganohydroquinoxane include, for example, a trimethyldecyloxy group at both ends of the molecular chain. a blocked methyl hydrogen polyoxyalkylene, a dimethyl methoxy alkane-methylhydrooxane copolymer terminated at the two ends of the molecular chain by a trimethyl decyloxy group, and a trimethyl decane at both ends of the molecular chain Oxy-terminated dimethyloxane-methylhydroquinone-methylphenyl decane copolymer, dimethylpolyoxyl terminated by dimethylhydrohaloalkoxy at both ends of the molecular chain a dimethylpolyoxyalkylene-methylhydrooxane copolymer terminated by a dimethyl hydralkoxy group at both ends of the molecular chain, and a terminal end of the molecular chain terminated by a dimethylhydrogen alkoxy group a methyl oxoxane-methylphenyl decane copolymer, a methylphenyl polyoxyalkylene terminated at both ends of the molecular chain by dimethylhydrohaloalkoxy, and (R 4 ) 3 SiO 0.5 (R polyorganohydrogen siloxane copolymer consisting of silicon 4 described above) represents an alkoxy group of the silicon units, (R 4) 2 HSiO 0.5 units alkoxy silicon represented by silicon and an alkoxy group of units of SiO 2 represented by (R 4 ) 2 a polyorganohydrohalosiloxane copolymer composed of a decyloxy unit represented by HSiO 0.5 and a decyloxy unit represented by SiO 2 , a decyloxy unit represented by R 4 HSiO, and a decane represented by R 4 SiO 1.5 A polyorganohydrohalosiloxane copolymer composed of an oxy unit or a decyloxy unit represented by HSiO 1.5 .

作為R7 aHbSiO(4 a-b/2)所表示之聚有機氫矽氧烷以外之上述聚有機氫矽氧烷,具體而言例如可列舉:由(R4)3SiO0.5所表示之矽烷氧基單位、(R4)2HSiO0.5所表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、R4SiO1.5所表示之矽烷氧基單位、及(R4)4Si2R6O(R6如上所述)表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物;由(R4)3SiO0.5所表示之矽烷氧基單位、(R4)2HSiO0.5所表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、R5SiO1.5(R5如上所述)表示之矽烷氧基單位、及(R4)4Si2R6O所表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物;由(R4)3SiO0.5所表示之矽烷氧基單位、(R4)2SiO所表示之矽烷氧基單位、R4HSiO所表示之矽烷氧基單位、及(R4)4Si2R6O所表示之矽烷氧基單位構成之聚有機氫矽氧烷共聚物等。該等可單獨使用1種,亦可將2種以上組合而使用。 Specific examples of the polyorganohydrohalosiloxane other than the polyorganohydrohalosiloxane represented by R 7 a H b SiO (4 ab / 2) include, for example, (R 4 ) 3 SiO 0.5 a decyloxy unit, a decyloxy unit represented by (R 4 ) 2 HSiO 0.5 , a decyloxy unit represented by (R 4 ) 2 SiO, a decyloxy unit represented by R 4 SiO 1.5 , and (R 4 4 Si 2 R 6 O (R 6 as described above) represents a polyorganohydrohydroxane copolymer composed of a decyloxy unit; a decyloxy unit represented by (R 4 ) 3 SiO 0.5 , (R 4 ) a decyloxy unit represented by 2 HSiO 0.5 , a decyloxy unit represented by (R 4 ) 2 SiO, a decyloxy unit represented by R 5 SiO 1.5 (R 5 as described above), and (R 4 ) 4 a polyorganohydrohydroxane copolymer composed of a decyloxy unit represented by Si 2 R 6 O; a decyloxy unit represented by (R 4 ) 3 SiO 0.5 and a decane oxygen represented by (R 4 ) 2 SiO A base unit, a decyloxy unit represented by R 4 HSiO, and a polyorganohydrohalosiloxane copolymer composed of a decyloxy unit represented by (R 4 ) 4 Si 2 R 6 O. These may be used alone or in combination of two or more.

作為上述聚有機氫矽氧烷中之市售者,例如可列舉:DMS-H03、DMS-H11、DMS-H21、DMS-H25、DMS-H31、DMS-H41(分子鏈兩末端由二甲基氫矽烷氧基封端之二甲基聚矽氧烷)、HMS-013、HMS-031、HMS-064、HMS-071、HMS-082、HMS-151、HMS-301、HMS-501(分子鏈兩末端由三甲基矽烷氧基封端之二甲基矽氧烷-甲基氫矽氧烷共聚物)、HMS-991、HMS-992、HMS-993(分子鏈兩末端由三甲基矽烷氧基封端之甲基氫聚矽氧烷)、HMS-H271(分子鏈兩末端由二甲基氫矽烷氧基封端之二甲基矽氧烷-甲基氫矽氧烷共聚物)、HPM-502(分 子鏈兩末端由二甲基氫矽烷氧基封端之苯基甲基矽氧烷-甲基氫矽氧烷共聚物)、HDP-111(分子鏈兩末端由二甲基氫矽烷氧基封端之苯基(二甲基氫矽烷氧基)矽氧烷)(均為Gelest,Inc.製造)等。 As a commercially available one of the above polyorganohydroquinones, for example, DMS-H03, DMS-H11, DMS-H21, DMS-H25, DMS-H31, DMS-H41 (both ends of the molecular chain are dimethyl groups) Hydroquinoloxy-terminated dimethyl polyoxane), HMS-013, HMS-031, HMS-064, HMS-071, HMS-082, HMS-151, HMS-301, HMS-501 (molecular chain) a dimethyl methoxy alkane-methylhydroioxane copolymer terminated by a trimethyl decyloxy group, HMS-991, HMS-992, HMS-993 (trimethyl decane at both ends of the molecular chain) Oxy-terminated methylhydrogen polyoxyalkylene), HMS-H271 (dimethyl methoxy oxane-methylhydroioxane copolymer terminated at both ends of the molecular chain by dimethylhydrogenoloxy), HPM-502 (minutes a phenylmethyl methoxy-methane hydroxane copolymer terminated by a dimethylhydroquinoloxy group at both ends of the sub-chain, HDP-111 (both ends of the molecular chain are blocked by dimethylhydroperoxyloxy group) Phenyl (dimethylhydroquinoloxy) decane (all manufactured by Gelest, Inc.) and the like.

上述聚有機氫矽氧烷之含量係上述含碳-碳雙鍵之聚有機矽氧烷之硬化有效量,尤佳為成為如下比率,即,聚有機氫矽氧烷具有之Si-H基相對於含碳-碳雙鍵之聚有機矽氧烷中之每1個具有碳-碳雙鍵之取代基成為0.1~4.0個。若Si-H基相對於每1個具有碳-碳雙鍵之取代基未達0.1個,則有硬化反應不進行,難以獲得硬化物之情況。若Si-H基相對於每1個具有碳-碳雙鍵之取代基超過4.0個,則未反應之Si-H基大量殘留於硬化物中,因此有硬化物之物性經時地發生變化之虞。Si-H基更佳為相對於每1個具有碳-碳雙鍵之取代基成為1.0~3.0個之比率。 The content of the polyorganohydroquinone is a hardening effective amount of the above-mentioned polyorganosiloxane containing a carbon-carbon double bond, and particularly preferably a ratio such that the polyorganohydrohalosiloxane has a Si-H group relative thereto. The substituent having a carbon-carbon double bond in the polyorganosiloxane containing a carbon-carbon double bond is 0.1 to 4.0. When the Si-H group is less than 0.1 per one substituent having a carbon-carbon double bond, the curing reaction does not proceed, and it is difficult to obtain a cured product. When the Si-H group has more than 4.0 substituents per carbon-carbon double bond, the unreacted Si-H group remains in the cured product in a large amount, so that the physical properties of the cured product change with time. Hey. More preferably, the Si-H group is in a ratio of 1.0 to 3.0 per one substituent having a carbon-carbon double bond.

作為上述矽氫化反應觸媒,可使用先前公知者。具體而言,例如可列舉:鉑(包含鉑黑)、銠、鈀等鉑族金屬單質;H2PtCl4‧nH2O、H2PtCl6‧nH2O、NaHPtCl6‧nH2O、KHPtCl6‧nH2O、Na2PtCl6‧nH2O、K2PtCl4‧nH2O、PtCl4‧nH2O、PtCl2、Na2HPtCl4‧nH2O(其中,式中,n為0~6之整數,較佳為0或6之整數)等氯化鉑、氯鉑酸及氯鉑酸鹽;醇改質氯鉑酸(參照美國專利第3220972號說明書);氯鉑酸與烯烴之複合物(參照美國專利第3159601號說明書、美國專利第3159662號說明書、美國專利第3775452號說明書);使氧化鋁、氧化矽、碳等載體載持鉑黑、鈀等鉑族金屬而成者;銠-烯烴複合物;三(三苯基膦)氯化銠(威爾金森(Wikinson)觸媒);氯化鉑、氯鉑酸或氯鉑酸鹽與含乙烯基之矽氧烷之複合物;二氯二吡啶鉑(II)(參照日本特開平09-165453號公報);Pt2{[(CH2=CH)Me2Si]2O}3、 HPt2{[(CH2=CH)Me2Si2]O}2、PtCO(CH2=CH(Me)SiO)4、Pt(CH2=CH(Me)SiO)4等鉑之乙烯基矽氧烷錯合物(參照日本特開平11-152337號公報)等鉑族金屬系觸媒等。 As the above-mentioned hydrazine hydrogenation catalyst, those previously known can be used. Specific examples thereof include platinum (including platinum black), platinum group metal such as rhodium and palladium; H 2 PtCl 4 ‧nH 2 O, H 2 PtCl 6 ‧nH 2 O, NaHPtCl 6 ‧nH 2 O, KHPtCl 6 ‧nH 2 O, Na 2 PtCl 6 ‧nH 2 O, K 2 PtCl 4 ‧nH 2 O, PtCl 4 ‧nH 2 O, PtCl 2 , Na 2 HPtCl 4 ‧nH 2 O (wherein n is An integer of 0 to 6, preferably an integer of 0 or 6, such as platinum chloride, chloroplatinic acid, and chloroplatinate; an alcohol modified chloroplatinic acid (refer to US Pat. No. 3,220,972); chloroplatinic acid and olefin The composite (refer to the specification of U.S. Patent No. 3,159,601, the specification of U.S. Patent No. 3,159,662, and the specification of U.S. Patent No. 3,775,452); the carrier of alumina, yttrium oxide, carbon, etc. is supported by a platinum group metal such as platinum black or palladium. ; 铑-olefin complex; tris(triphenylphosphine) ruthenium chloride (Wikinson catalyst); complex of platinum chloride, chloroplatinic acid or chloroplatinate with vinyl-containing decane Platinum (II); (Japanese Unexamined Patent Publication No. Hei 09-165453); Pt 2 {[(CH 2 =CH)Me 2 Si] 2 O} 3 , HPt 2 {[(CH 2 =CH) )Me 2 Si 2 ]O} 2 , PtCO(CH 2 =CH(Me)SiO) 4 , P t (CH 2 = CH (Me ) SiO) 4 Si, etc. platinum vinyl siloxane complexes (see Japanese Patent Laid-Open Publication No. 11-152337), and other platinum group metal-based catalyst and the like.

上述矽氫化反應觸媒之含量只要為作為矽氫化反應之觸媒有效之量,則並無特別限定,較佳為於加成硬化型聚矽氧樹脂混合物中換算成鉑等金屬元素為0.1~1000ppm。於上述矽氫化反應觸媒之含量處於該範圍之情形時,加成反應充分得到促進,因此可使所獲得之加成硬化型聚矽氧樹脂組成物充分硬化,且於經濟方面有利。上述矽氫化反應觸媒之含量更佳為1~500ppm,進而較佳為1~20ppm。 The content of the ruthenium hydrogenation catalyst is not particularly limited as long as it is effective as a catalyst for the hydrazine hydrogenation reaction, and it is preferably 0.1 to 0.1% of the metal element such as platinum in the addition-curable polyoxirane resin mixture. 1000ppm. When the content of the above-mentioned rhodium hydrogenation catalyst is in this range, the addition reaction is sufficiently promoted, so that the obtained addition-curable polydecane resin composition can be sufficiently hardened and economically advantageous. The content of the above-mentioned rhodium hydrogenation catalyst is more preferably from 1 to 500 ppm, still more preferably from 1 to 20 ppm.

作為上述加成硬化型聚矽氧樹脂混合物,可使用公知者,就獲取之容易性而言,較佳為2液型之熱固性類型。 As the addition-curable polydecane resin mixture, a known one can be used, and in view of ease of availability, a two-component thermosetting type is preferable.

作為上述2液型之熱固性類型之加成硬化型聚矽氧樹脂混合物之市售品,例如可列舉:IVS4312、XE14-C2042、IVS4542、IVS4546、IVS4622、IVS4632、IVS4742、IVS4752、XE14-C2860、XE14-C3450、IVS5854(均為Momentive Performance Materials公司製造)、KER-2500、KER-2500N、KER-2600、KER-2700、KER-6150、KER-6075F、KER-6020F、SCR-1011、SCR-1012、SCR-1016、KER-6000、KER-6100、KER-6110、KER-6200、ASP-1031、ASP-1111、ASP-1120(均為信越化學工業公司製造)、OE-6351、OE-6336、OE-6370M、EG-6301、JCR-6125、JCR-6140、0E-6450、OE-6520、OE-6550、OE-6631、OE-6636、OE-6635、OE-6630、OE-6665N、SR7010(均為Dow Corning Torav公司製造)等。 As a commercial item of the thermosetting type addition hardening type polyoxyxene resin mixture of the above two liquid type, for example, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752, XE14-C2860, XE14 are mentioned. -C3450, IVS5854 (both manufactured by Momentive Performance Materials), KER-2500, KER-2500N, KER-2600, KER-2700, KER-6150, KER-6075F, KER-6020F, SCR-1011, SCR-1012, SCR-1016, KER-6000, KER-6100, KER-6110, KER-6200, ASP-1031, ASP-1111, ASP-1120 (all manufactured by Shin-Etsu Chemical Co., Ltd.), OE-6351, OE-6336, OE -6370M, EG-6301, JCR-6125, JCR-6140, 0E-6450, OE-6520, OE-6550, OE-6631, OE-6636, OE-6635, OE-6630, OE-6665N, SR7010 (both Manufactured for Dow Corning Torav).

本發明之加成硬化型聚矽氧樹脂組成物除加成硬化型聚矽氧樹脂混合物及本發明之接著性賦予劑以外,亦可在不損害本發明之目的或效果之範圍視需要含有添加劑。 The addition-hardening type polyoxyxylene resin composition of the present invention may contain an additive as needed in addition to the addition-hardening type polyoxyxylene resin mixture and the adhesion imparting agent of the present invention, without impairing the object or effect of the present invention. .

作為上述添加劑,例如可列舉:無機填充劑、抗氧化劑、無機螢光體、潤滑劑、紫外線吸收劑、熱光穩定劑、分散劑、抗靜電劑、聚合抑制劑、消泡劑、硬化促進劑、溶劑、抗老化劑、自由基抑制劑、接著性改良劑、難燃劑、界面活性劑、保存穩定性改良劑、抗臭氧老化劑、增黏劑、塑化劑、放射線阻斷劑、成核劑、偶合劑、導電性賦予劑、磷系過氧化物分解劑、顏料、金屬惰性化劑、物性調整劑等。 Examples of the above additives include inorganic fillers, antioxidants, inorganic phosphors, lubricants, ultraviolet absorbers, thermo-light stabilizers, dispersants, antistatic agents, polymerization inhibitors, antifoaming agents, and hardening accelerators. , solvent, anti-aging agent, free radical inhibitor, adhesion improver, flame retardant, surfactant, storage stability improver, ozone aging agent, tackifier, plasticizer, radiation blocker, A nucleating agent, a coupling agent, a conductivity imparting agent, a phosphorus-based peroxide decomposing agent, a pigment, a metal inerting agent, a physical property adjusting agent, and the like.

作為上述無機填充劑並無特別限定,可列舉不使光學特性降低之微粒子狀者。具體而言,例如可列舉:氧化鋁、氫氧化鋁、熔融氧化矽、晶質氧化矽、超微粉無定型氧化矽、疏水性超微粉氧化矽、滑石、碳酸鈣、硫酸鋇等。 The inorganic filler is not particularly limited, and examples thereof include those having no fine optical properties. Specific examples thereof include alumina, aluminum hydroxide, fused cerium oxide, crystalline cerium oxide, ultrafine powder amorphous cerium oxide, hydrophobic ultrafine powder cerium oxide, talc, calcium carbonate, barium sulfate, and the like.

作為上述無機螢光體,例如可列舉廣泛用於LED之釔、鋁、石榴石系之YAG系螢光體、ZnS系螢光體、Y2O2S系螢光體、紅色發光螢光體、藍色發光螢光體、綠色發光螢光體等。 Examples of the inorganic phosphor include a YAG-based phosphor, an ZnS-based phosphor, a Y 2 O 2 S-based phosphor, and a red-emitting phosphor which are widely used for LEDs, aluminum, and garnet. , blue luminescent phosphor, green luminescent phosphor, etc.

作為製造本發明之加成硬化型聚矽氧樹脂組成物之方法,例如可藉由將加成硬化型聚矽氧樹脂混合物、本發明之接著性賦予劑、及視需要使用之添加劑混合而製造。 The method for producing the addition-curable polydecane resin composition of the present invention can be produced, for example, by mixing an addition-curable polydecane resin mixture, an adhesion-imparting agent of the present invention, and an additive as needed. .

本發明之加成硬化型聚矽氧樹脂組成物可設為1液型或2液型。 The addition-hardening polyphthalocyanine resin composition of the present invention can be a one-liquid type or a two-liquid type.

本發明之加成硬化型聚矽氧樹脂組成物例如可塗佈於光半導體元件等 之基材並硬化而使用。 The addition-hardening polyphthalocyanine resin composition of the present invention can be applied, for example, to an optical semiconductor element or the like. The substrate is hardened and used.

作為將本發明之加成硬化型聚矽氧樹脂組成物塗佈於基材之方法,例如可列舉使用分注器之方法、灌注法、網版印刷、轉移成形、射出成形等方法。 The method of applying the addition-curable polydecane resin composition of the present invention to a substrate includes, for example, a method using a dispenser, a potting method, screen printing, transfer molding, and injection molding.

本發明之加成硬化型聚矽氧樹脂組成物可藉由室溫或加熱而硬化。藉由使本發明之加成硬化型聚矽氧樹脂組成物硬化而獲得之加成硬化型聚矽氧樹脂硬化物亦為本發明之一。 The addition hardening type polyoxymethylene resin composition of the present invention can be hardened by room temperature or heating. The addition-curable polyanthracene resin cured product obtained by curing the addition-curable polyoxyxylene resin composition of the present invention is also one of the inventions.

對本發明之加成硬化型聚矽氧樹脂組成物進行加熱而使其硬化時之最終加熱溫度通常為100℃以上,較佳為120℃以上,更佳為120~200℃,進而較佳為120~180℃。 The final heating temperature when the addition-curable polydecane resin composition of the present invention is heated and hardened is usually 100 ° C or higher, preferably 120 ° C or higher, more preferably 120 to 200 ° C, and still more preferably 120. ~180 °C.

作為本發明之加成硬化型聚矽氧樹脂組成物之用途,例如可列舉電子材料用之密封材料組成物、建築用密封劑組成物、汽車用密封劑組成物、接著劑組成物等。 The use of the composition of the addition-hardening type polyoxyxylene resin of the present invention is, for example, a sealing material composition for an electronic material, a sealant composition for a building, a sealant composition for an automobile, an adhesive composition, and the like.

作為上述電子材料,例如可列舉:引線框架、經配線過之捲帶式基板、配線板、玻璃、矽晶圓等支持構件、光半導體元件、半導體晶片、電晶體、二極體、閘流體等主動元件、或電容器、電阻器、線圈等被動元件等。其中,可較佳地用作光半導體元件之密封材料。 Examples of the electronic material include a lead frame, a wound tape substrate, a wiring board, a support member such as a glass or a germanium wafer, an optical semiconductor element, a semiconductor wafer, a transistor, a diode, a thyristor, and the like. Active components, or passive components such as capacitors, resistors, and coils. Among them, it can be preferably used as a sealing material for an optical semiconductor element.

光半導體元件被本發明之加成硬化型聚矽氧樹脂硬化物密封之光半導體元件密封體亦為本發明之一。 The optical semiconductor element sealing body in which the optical semiconductor element is sealed by the addition hardening type polyoxymethylene resin of the present invention is also one of the inventions.

又,本發明之加成硬化型聚矽氧樹脂組成物例如可用於顯示器材料、光記錄媒體材料、光學機器材料、光零件材料、光纖材料、光-電子功能有機材料、半導體積體電路周邊材料等用途。 Further, the addition-hardening polyphthalocyanine resin composition of the present invention can be used, for example, for display materials, optical recording medium materials, optical machine materials, optical component materials, optical fiber materials, photo-electron functional organic materials, and semiconductor integrated circuit peripheral materials. And other uses.

根據本發明,可提供一種界面接著性及透明性優異之加成硬化型聚矽氧樹脂組成物。又,根據本發明,可提供一種使用該加成硬化型聚矽氧樹脂組成物而成之加成硬化型聚矽氧樹脂硬化物及光半導體元件密封體。 According to the present invention, it is possible to provide an addition-curable polydecane resin composition which is excellent in interfacial adhesion and transparency. Moreover, according to the present invention, it is possible to provide an addition-curable polyphthalocyanine cured product and an optical semiconductor element sealing body which are obtained by using the addition-curable polyoxyxylene resin composition.

以下,揭示實施例而進而詳細地說明本發明,但本發明並不僅限於該等實施例。 Hereinafter, the present invention will be described in detail by explaining the examples, but the invention is not limited to the examples.

(製造例1) (Manufacturing Example 1)

(具有胺基之聚矽氧化合物與異氰酸苯乙酯之反應(接著性賦予劑A之製備)) (Reaction of an amine group-containing polyoxo compound with phenylethyl isocyanate (preparation of adhesion imparting agent A))

向安裝有磁轉子、溫度計及冷卻器之容量500mL之四口燒瓶中,在氮氣環境下加入具有胺基之聚矽氧化合物(信越化學工業公司製造,「X-22-1660B-3」,胺基當量2200g/mol)50.1g(胺基22.8mmol)及異氰酸苯乙酯(分子量147.18)3.61g(24.5mmol),於20℃下使用磁攪拌器攪拌5小時。藉由中和滴定確認到殘留胺基未達1%。其後,加入甲苯207g及水50g而分液,並濃縮有機層,藉此獲取透明液體(接著性賦予劑A)40.34g。 To a four-necked flask of 500 mL capacity equipped with a magnetic rotor, a thermometer, and a cooler, an amine group-containing polyoxo compound (X-22-6060-3, amine, manufactured by Shin-Etsu Chemical Co., Ltd., amine) was added under a nitrogen atmosphere. Base amount: 2200 g/mol) 50.1 g (amino group 22.8 mmol) and phenylethyl isocyanate (molecular weight: 147.18) 3.61 g (24.5 mmol) were stirred at 20 ° C for 5 hours using a magnetic stirrer. It was confirmed by neutralization titration that the residual amine group was less than 1%. Thereafter, 207 g of toluene and 50 g of water were added to separate the layers, and the organic layer was concentrated to obtain 40.34 g of a transparent liquid (adhesive imparting agent A).

藉由1H-NMR對接著性賦予劑A進行測定,結果確認到接著性賦予劑 A具有上述式(1-1)表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正丙基,x為0,Y為NH,R3為苯乙基)、上述式(1-2)表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正丙基,x為0,Y為NH,R3為苯乙基)、及上述式(1-4)表示之結構單位(R1b為甲基、苯基)。 When the adhesion-promoting agent A was measured by 1 H-NMR, it was confirmed that the adhesion-imparting agent A has the structural unit represented by the above formula (1-1) (R 1a is a methyl group, and A is represented by the formula (2). a group, R 2a is an exo-propyl group, x is 0, Y is NH, R 3 is a phenethyl group, and the structural unit represented by the above formula (1-2) (R 1a is a methyl group, and A is a formula (2) Further, R 2a is an epi-propyl group, x is 0, Y is NH, R 3 is a phenethyl group, and a structural unit represented by the above formula (1-4) (R 1b is a methyl group or a phenyl group).

(製造例2) (Manufacturing Example 2)

(具有胺基之聚矽氧化合物與異氰酸苯乙酯之反應(接著性賦予劑B之製備)) (Reaction of an amine group-containing polyoxo compound with phenylethyl isocyanate (preparation of adhesion imparting agent B))

向安裝有磁轉子、溫度計及冷卻器之容量100mL之四口燒瓶中,在氮氣環境下加入具有胺基之聚矽氧化合物(信越化學工業公司製造,「X-22-9409」,胺基當量670g/mol)7.24g(胺基10.8mmol)及異氰酸苯乙酯(分子量147.18)1.75g(11.9mmol),於20℃下使用磁攪拌器攪拌5小時。藉由中和滴定確認到殘留胺基未達1%。其後,加入甲苯50g及水10g而分液,並濃縮有機層,藉此獲取透明液體(接著性賦予劑B)2.55g。 To a four-necked flask equipped with a magnetic rotor, a thermometer, and a cooler in a volume of 100 mL, a polyoxyl compound having an amine group ("X-22-9409", an amine equivalent, was added under a nitrogen atmosphere). 670 g/mol) 7.24 g (amine group 10.8 mmol) and phenylethyl isocyanate (molecular weight 147.18) 1.75 g (11.9 mmol) were stirred at 20 ° C for 5 hours using a magnetic stirrer. It was confirmed by neutralization titration that the residual amine group was less than 1%. Thereafter, 50 g of toluene and 10 g of water were added to separate the layers, and the organic layer was concentrated to obtain 2.55 g of a transparent liquid (adhesive imparting agent B).

藉由1H-NMR對接著性賦予劑B進行測定,結果確認到接著性賦予劑B具有上述式(1-1)表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正丙基,x為0,Y為NH,R3為苯乙基)、上述式(1-2)表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正丙基,x為0,Y為NH,R3為苯乙基)、及上述式(1-4)表示之結構單位(R1b為甲基、苯基)。 When the adhesion-imparting agent B was measured by 1 H-NMR, it was confirmed that the adhesion-imparting agent B has the structural unit represented by the above formula (1-1) (R 1a is a methyl group, and A is represented by the formula (2). a group, R 2a is an exo-propyl group, x is 0, Y is NH, R 3 is a phenethyl group, and the structural unit represented by the above formula (1-2) (R 1a is a methyl group, and A is a formula (2) Further, R 2a is an epi-propyl group, x is 0, Y is NH, R 3 is a phenethyl group, and a structural unit represented by the above formula (1-4) (R 1b is a methyl group or a phenyl group).

(製造例3) (Manufacturing Example 3)

(具有羥基之聚矽氧化合物與異氰酸苯乙酯之反應(接著性賦予劑C之製備)) (Reaction of a polyoxyl compound having a hydroxyl group with phenylethyl isocyanate (preparation of an adhesion-imparting agent C))

向安裝有磁轉子、溫度計及冷卻器之容量50mL之四口燒瓶中,在氮 氣環境下加入具有羥基之聚矽氧化合物(信越化學工業公司製造,「X-22-4015」,羥基當量1867g/mol)4.99g(羥基2.67mmol)及異氰酸苯乙酯(分子量147.18)0.52g(3.53mmol),升溫至120℃後使用磁攪拌器攪拌10小時。藉由滴定確認到殘留羥基未達1%。其後,加入庚烷25g及水5g而分液,並濃縮有機層,藉此獲取透明液體(接著性賦予劑C)3.0g。 In a four-necked flask equipped with a magnetic rotor, a thermometer, and a cooler in a volume of 50 mL, in nitrogen A polyoxonium compound having a hydroxyl group ("X-22-4015", hydroxyl group equivalent: 1867 g/mol), 4.99 g (hydroxyl 2.67 mmol) and phenylethyl isocyanate (molecular weight: 147.18) were added under a gas atmosphere. 0.52 g (3.53 mmol) was heated to 120 ° C and stirred for 10 hours using a magnetic stirrer. It was confirmed by titration that the residual hydroxyl group was less than 1%. Thereafter, 25 g of heptane and 5 g of water were added to separate a liquid, and the organic layer was concentrated, whereby 3.0 g of a transparent liquid (adhesive imparting agent C) was obtained.

藉由1H-NMR對接著性賦予劑C進行測定,結果確認到接著性賦予劑C具有上述式(1-1)表示之結構單位(R1a為甲基,A為甲基)、上述式(1-2)表示之結構單位(R1a為甲基,A為甲基)、上述式(1-3)(R1b為甲基,A為式(2)表示之基,R2a為伸正4-氧雜己基,x為0,Y為氧原子,R3為苯乙基)、及上述式(1-4)表示之結構單位(R1b為甲基)。 When the adhesion-promoting agent C was measured by 1 H-NMR, it was confirmed that the adhesion-imparting agent C has the structural unit represented by the above formula (1-1) (R 1a is a methyl group, A is a methyl group), and the above formula (1-2) The structural unit (R 1a is a methyl group, A is a methyl group), the above formula (1-3) (R 1b is a methyl group, A is a group represented by the formula (2), and R 2a is a positive 4-oxahexyl group, x is 0, Y is an oxygen atom, R 3 is a phenethyl group, and a structural unit represented by the above formula (1-4) (R 1b is a methyl group).

(製造例4) (Manufacturing Example 4)

(具有羥基之聚矽氧化合物與異氰酸苯乙酯之反應(接著性賦予劑D之製備)) (Reaction of a polyoxyl compound having a hydroxyl group with phenylethyl isocyanate (preparation of an adhesion-imparting agent D))

向安裝有磁轉子、溫度計及冷卻器之容量50mL之四口燒瓶中,在氮氣環境下加入具有羥基之聚矽氧化合物(信越化學工業公司製造,「KF-6003」,羥基當量2545g/mol)5.00g(羥基1.96mmol)及異氰酸苯乙酯(分子量147.18)0.44g(2.99mmol),升溫至120℃後,使用磁攪拌器攪拌15小時。藉由滴定確認到殘留羥基未達1%。其後,加入庚烷26g及水5g而分液,並濃縮有機層,藉此獲取透明液體(接著性賦予劑D)4.1g。 To a four-necked flask equipped with a magnetic rotor, a thermometer, and a cooler in a volume of 50 mL, a polyoxonium compound having a hydroxyl group ("KF-6003", a hydroxyl equivalent of 2545 g/mol) was added under a nitrogen atmosphere. 5.00 g (hydroxyl 1.96 mmol) and phenylethyl isocyanate (molecular weight: 147.18), 0.44 g (2.99 mmol), and the mixture was heated to 120 ° C, and stirred for 15 hours using a magnetic stirrer. It was confirmed by titration that the residual hydroxyl group was less than 1%. Thereafter, 26 g of heptane and 5 g of water were added to separate liquid, and the organic layer was concentrated, whereby 4.1 g of a transparent liquid (adhesion imparting agent D) was obtained.

藉由1H-NMR對接著性賦予劑D進行測定,結果確認到接著性賦予劑D具有上述式(1-1)表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正4-氧雜己基,x為0,Y為氧原子,R3為苯乙基)、上述式(1-2) 表示之結構單位(R1a為甲基,A為式(2)表示之基,R2a為伸正4-氧雜己基,x為0,Y為氧原子,R3為苯乙基)、及上述式(1-4)表示之結構單位(R1b為甲基)。 When the adhesion-imparting agent D was measured by 1 H-NMR, it was confirmed that the adhesion-imparting agent D has the structural unit represented by the above formula (1-1) (R 1a is a methyl group, and A is represented by the formula (2). a group, R 2a is a 4-isohexyl group, x is 0, Y is an oxygen atom, R 3 is a phenethyl group, and the structural unit represented by the above formula (1-2) (R 1a is a methyl group, and A is a formula) (2) a group represented by R 2a is a 4-isohexyl group, x is 0, Y is an oxygen atom, R 3 is a phenethyl group, and a structural unit represented by the above formula (1-4) (R 1b is methyl).

(實施例1~12、比較例1~6) (Examples 1 to 12, Comparative Examples 1 to 6)

以表1所記載之摻合量將各成分均勻地混合,其後充分地脫氣,藉此製備加成硬化型聚矽氧樹脂組成物。 Each component was uniformly mixed in the blending amount shown in Table 1, and then sufficiently degassed to prepare an addition-curable polydecane resin composition.

再者,作為表1中之加成硬化型聚矽氧樹脂混合物A,使用OE-6630(Dow Corning Toray公司製造)A液及B液(1:4混合物)。加成硬化型聚矽氧樹脂混合物A為含有含碳-碳雙鍵之聚有機矽氧烷成分及聚有機氫矽氧烷成分之混合物。作為表1中之加成硬化型聚矽氧樹脂混合物B,使用OE-6370M(Dow Corning Toray公司製造)A液及B液(1:1混合物)。加成硬化型聚矽氧樹脂混合物B為含有含碳-碳雙鍵之聚有機矽氧烷成分及聚有機氫矽氧烷成分之混合物。作為表1中之接著性賦予劑E,使用縮水甘油氧基丙基三甲氧基矽烷(Dow Corning Toray公司製造,「Z-6040」),作為接著性賦予劑F,使用異三聚氰酸三縮水甘油酯(東京化成工業公司製造)。 Further, as the addition-hardening type polyoxymethylene resin mixture A in Table 1, OE-6630 (manufactured by Dow Corning Toray Co., Ltd.) A liquid and B liquid (1:4 mixture) were used. The addition-hardening polyxanthene resin mixture A is a mixture of a polyorganosiloxane component containing a carbon-carbon double bond and a polyorganohydroquinone component. As the addition-hardening type polyoxymethylene resin mixture B in Table 1, OE-6370M (Dow Corning Toray Co., Ltd.) A liquid and B liquid (1:1 mixture) were used. The addition-hardening polyoxyxene resin mixture B is a mixture of a polyorganosiloxane component containing a carbon-carbon double bond and a polyorganohydroquinone component. As the adhesion imparting agent E in Table 1, glycidoxypropyltrimethoxydecane ("Z-6040", manufactured by Dow Corning Toray Co., Ltd.) was used, and as the adhesion imparting agent F, isomeric cyanuric acid was used. Glycidyl ester (manufactured by Tokyo Chemical Industry Co., Ltd.).

<評價> <evaluation>

對實施例1~12及比較例1~6中所獲得之各加成硬化型聚矽氧樹脂組成物進行以下評價。將結果示於表1。 Each of the addition-curable polyphthalocyanine resin compositions obtained in Examples 1 to 12 and Comparative Examples 1 to 6 was subjected to the following evaluation. The results are shown in Table 1.

(1)硬度(D型、A型) (1) Hardness (D type, A type)

使含有加成硬化型聚矽氧樹脂混合物A之各加成硬化型聚矽氧樹脂組成物(實施例1~6及比較例1~3)流入樹脂製模具,並以150℃加熱2小時,使加成硬化型聚矽氧樹脂組成物硬化。使所獲得之硬化物自模具脫模, 製成半徑20mm×厚度6mm之硬化物,並設為硬度測定用試片。對所獲得之硬度測定用試片,使用橡膠硬度計(ASKER公司製造,D型)測定硬度(D型)。 Each of the addition-curable polydecane resin compositions (Examples 1 to 6 and Comparative Examples 1 to 3) containing the addition-curable polyoxyxylene resin mixture A was poured into a resin mold, and heated at 150 ° C for 2 hours. The addition hardening type polyoxymethylene resin composition is hardened. The obtained hardened material is released from the mold, A cured product having a radius of 20 mm and a thickness of 6 mm was prepared and used as a test piece for hardness measurement. The obtained hardness test piece was measured for hardness (D type) using a rubber hardness meter (manufactured by ASKER, Model D).

又,使含有加成硬化型聚矽氧樹脂混合物B之各加成硬化型聚矽氧樹脂組成物(實施例7~12及比較例4~6)流入樹脂製模具,並以150℃加熱4小時,使聚矽氧樹脂組成物硬化。使所獲得之硬化物自模具脫模,製成半徑20mm×厚度6mm之硬化物,並設為硬度測定用試片。對所獲得之硬度測定用試片,使用橡膠-塑膠硬度計(古里精機製作所公司製造,「KR-24A」)測定硬度(A型)。 Further, each of the addition-curable polydecane resin compositions (Examples 7 to 12 and Comparative Examples 4 to 6) containing the addition-curable polyoxyxylene resin mixture B was poured into a resin mold and heated at 150 ° C. In an hour, the polyoxymethylene resin composition is hardened. The obtained cured product was released from the mold to obtain a cured product having a radius of 20 mm and a thickness of 6 mm, and was used as a test piece for hardness measurement. The obtained hardness test piece was measured for hardness (type A) using a rubber-plastic hardness meter ("KR-24A" manufactured by Guri Seiki Co., Ltd.).

(2)對PPA之拉伸剪切接著強度 (2) Tensile shear strength to PPA

使實施例1~12及比較例1~6中所獲得之各加成硬化型聚矽氧樹脂組成物以接著部成為20×25mm之長方形之方式流入2塊PPA板(Kuraray公司製造,「GENESTAR TA112」,尺寸2×25×100mm)之間以成為2mm厚,並進行加熱(實施例1~6及比較例1~3係以150℃加熱2小時,實施例7~12及比較例4~6係以150℃加熱4小時)而使加成硬化型聚矽氧樹脂組成物硬化,從而製作拉伸剪切試片。作為接著基材之PPA板係使用以150℃乾燥1小時者。對所獲得之接著試片,使用拉伸試驗機(島津製作所公司製造,「AGS-X」)於夾具間距離100mm、試驗速度5mm/min之條件下進行拉伸剪切接著試驗,而測定拉伸剪切接著強度。 Each of the addition-curable polyxanthoxy resin compositions obtained in Examples 1 to 12 and Comparative Examples 1 to 6 was poured into two PPA sheets so that the adhesive portion became a rectangular shape of 20 × 25 mm (manufactured by Kuraray Co., Ltd., "GENESTAR TA112", size 2 × 25 × 100 mm) was 2 mm thick and heated (Examples 1 to 6 and Comparative Examples 1 to 3 were heated at 150 ° C for 2 hours, Examples 7 to 12 and Comparative Example 4 The 6-series was heated at 150 ° C for 4 hours to cure the addition-curable polydecane resin composition, thereby producing a tensile shear test piece. As the PPA board which is a base material, it is used for drying for 1 hour at 150 degreeC. The obtained test piece was subjected to tensile shear test and then subjected to tensile shear test using a tensile tester (manufactured by Shimadzu Corporation, "AGS-X") at a distance of 100 mm between the jigs and a test speed of 5 mm/min. Stretch the shear and then the strength.

(3)對PCT之拉伸剪切接著強度 (3) Tensile shear strength to PCT

使實施例1~12及比較例1~6中所獲得之各加成硬化型聚矽氧樹脂組成物以接著部成為20×25mm之長方形之方式流入2塊PCT板(三井化學公 司製造,「PROVEST C101LW」,尺寸2×25×100mm)之間以成為2mm厚,並進行加熱(實施例1~6及比較例1~3係以150℃加熱2小時,實施例7~12及比較例4~6係以150℃加熱4小時)而使加成硬化型聚矽氧樹脂組成物硬化,從而製作拉伸剪切試片。作為接著基材之PCT板係使用以150℃乾燥1小時者。對所獲得之接著試片,使用拉伸試驗機(島津製作所公司製造,「AGS-X」)於夾具間距離100mm、試驗速度5mm/min之條件下進行拉伸剪切接著試驗,而測定拉伸剪切接著強度。 Each of the addition-curable polydecane resin compositions obtained in Examples 1 to 12 and Comparative Examples 1 to 6 was flowed into two PCT plates in a rectangular shape having a 20 × 25 mm follow-up portion (Mitsui Chemicals Co., Ltd.) Manufactured, "PROVEST C101LW", size 2 × 25 × 100 mm) was heated to 2 mm thick (Examples 1 to 6 and Comparative Examples 1 to 3 were heated at 150 ° C for 2 hours, Examples 7 to 12) And Comparative Examples 4 to 6 were heated at 150 ° C for 4 hours to cure the addition-curable polydecane resin composition, thereby producing a tensile shear test piece. The PCT board which is a base material was used for drying at 150 ° C for 1 hour. The obtained test piece was subjected to tensile shear test and then subjected to tensile shear test using a tensile tester (manufactured by Shimadzu Corporation, "AGS-X") at a distance of 100 mm between the jigs and a test speed of 5 mm/min. Stretch the shear and then the strength.

(4)對鍍銀之銅板之拉伸剪切接著強度 (4) Tensile shear strength of silver plated copper plate

使實施例1~12及比較例1~6中所獲得之各加成硬化型聚矽氧樹脂組成物以接著部成為20×25mm之長方形之方式流入2塊鍍銀之銅板(尺寸2×25×100mm)之間以成為2mm厚,並進行加熱(實施例1~6及比較例1~3係以150℃加熱2小時,實施例7~12及比較例4~6係以150℃加熱4小時)而使加成硬化型聚矽氧樹脂組成物硬化,從而製作拉伸剪切試片。作為接著基材之鍍銀之銅板係使用以150℃乾燥1小時者。對所獲得之接著試片,使用拉伸試驗機(島津製作所公司製造,「AGS-X」)於夾具間距離100mm、試驗速度5mm/min之條件下進行拉伸剪切接著試驗,而測定拉伸剪切接著強度。 Each of the addition-curable polyphthalocyanine compositions obtained in Examples 1 to 12 and Comparative Examples 1 to 6 was poured into two silver-plated copper plates in a rectangular shape of 20 × 25 mm (the size was 2 × 25). ×100 mm) was heated to a thickness of 2 mm (Examples 1 to 6 and Comparative Examples 1 to 3 were heated at 150 °C for 2 hours, Examples 7 to 12 and Comparative Examples 4 to 6 were heated at 150 °C) The addition-hardening type polyoxymethylene resin composition was hardened to prepare a tensile shear test piece. As a copper plated silver plate which is a base material, it is used for drying for one hour at 150 degreeC. The obtained test piece was subjected to tensile shear test and then subjected to tensile shear test using a tensile tester (manufactured by Shimadzu Corporation, "AGS-X") at a distance of 100 mm between the jigs and a test speed of 5 mm/min. Stretch the shear and then the strength.

(5)透明性 (5) Transparency

使實施例1~12及比較例1~6中所獲得之各加成硬化型聚矽氧樹脂組成物以厚度成為1mm之方式流入PFA(四氟乙烯-全氟烷基乙烯基醚共聚物)盤,並進行加熱而使加成硬化型聚矽氧樹脂組成物硬化,從而製作全光線透過率試片。對所獲得之全光線透過率試片,使用霧度計(日本電色 工業公司製造,「NDH 2000」)測定全光線透過率。 Each of the addition-curable polyphthalocyanine resin compositions obtained in Examples 1 to 12 and Comparative Examples 1 to 6 was poured into PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer) so as to have a thickness of 1 mm. The disk was heated and the addition-hardening type polyoxymethylene resin composition was hardened to prepare a total light transmittance test piece. For the total light transmittance test piece obtained, use a haze meter (Japan Electric Color) Manufactured by an industrial company, "NDH 2000") measures the total light transmittance.

對於測定結果,將全光線透過率為90%以上之情形設為「○」,並將未達90%之情形設為「×」而評價透明性。 For the measurement results, the case where the total light transmittance was 90% or more was set to "○", and the case where the total light transmittance was less than 90% was set to "x", and the transparency was evaluated.

[產業上之可利用性] [Industrial availability]

根據本發明,可提供一種界面接著性、及透明性優異之加成硬化型聚矽氧樹脂組成物。又,根據本發明,可提供一種使用該加成硬化型聚矽氧樹脂組成物而成之加成硬化型聚矽氧樹脂硬化物及光半導體元件密封體。 According to the present invention, it is possible to provide an addition-curable polydecane resin composition which is excellent in interfacial adhesion and transparency. Moreover, according to the present invention, it is possible to provide an addition-curable polyphthalocyanine cured product and an optical semiconductor element sealing body which are obtained by using the addition-curable polyoxyxylene resin composition.

Claims (7)

一種加成硬化型聚矽氧樹脂組成物,含有加成硬化型聚矽氧樹脂混合物及接著性賦予劑,其特徵在於:該接著性賦予劑含有於下述式(1-1)表示之結構單位與下述式(1-2)表示之結構單位之間具有下述式(1-3)表示之結構單位及/或下述式(1-4)表示之結構單位的化合物, 式(1-1)及式(1-2)中,R1a分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基;式(1-3)及式(1-4)中,R1b分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、碳數2~9之烯基、或碳數1~4之烷氧基;式(1-3)中,m為1~50之整數,式(1-4)中,n為1~1500之整數;式(1-1)~(1-3)中,A分別獨立為碳數1~18之烷基、 環烷基、芳基、芳烷基、碳數2~9之烯基、碳數1~4之烷氧基、或下述式(2)表示之基;其中,式(1-1)~(1-3)中,至少1個A為式(2)表示之基; 式(2)中,R2a表示除鍵結於矽原子之碳原子以外之一部分碳原子亦可經氧原子取代之碳數1~8之伸烷基(alkylene),R2b分別獨立地表示碳數1~3之伸烷基,R3分別獨立地表示碳數1~18之烷基、環烷基、芳基、芳烷基、含磺醯基之基、醯基、(甲基)丙烯醯氧基烷基、或矽基;式(2)中,x為0~2之整數,Y為氧原子或NH。 The addition-hardening type polyoxyxylene resin composition containing the addition-hardening type polyoxy-oxy-resin-resin mixture and the adhesiveness imparting agent, and the adhesiveness imparting agent contains the structure represented by following formula (1-1). The unit and the structural unit represented by the following formula (1-2) have a structural unit represented by the following formula (1-3) and/or a compound represented by the following formula (1-4); In the formulae (1-1) and (1-2), R 1a each independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. Or an alkoxy group having 1 to 4 carbon atoms; in the formulae (1-3) and (1-4), R 1b independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group or an aralkyl group. a base, an alkenyl group having 2 to 9 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; in the formula (1-3), m is an integer of 1 to 50, and in the formula (1-4), n is 1~ An integer of 1500; in the formula (1-1) to (1-3), A is independently an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, and an alkenyl group having 2 to 9 carbon atoms. And an alkoxy group having 1 to 4 carbon atoms or a group represented by the following formula (2); wherein, in the formulae (1-1) to (1-3), at least one A is a group represented by the formula (2) ; In the formula (2), R 2a represents an alkylene group having 1 to 8 carbon atoms which may be substituted with an oxygen atom in addition to a carbon atom bonded to a halogen atom, and R 2b independently represents carbon. a 1-3 alkyl group, and R 3 independently represents an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group, an aralkyl group, a sulfonyl group-containing group, a fluorenyl group, and a (meth) propylene group. a decyloxy group or a fluorenyl group; in the formula (2), x is an integer of 0 to 2, and Y is an oxygen atom or NH. 如申請專利範圍第1項之加成硬化型聚矽氧樹脂組成物,其中,於式(2)中,R3為碳數1~18之烷基、環烷基、芳基、或芳烷基。 The addition hardening type polyoxyxylene resin composition according to the first aspect of the invention, wherein, in the formula (2), R 3 is an alkyl group having 1 to 18 carbon atoms, a cycloalkyl group, an aryl group or an aralkyl group. base. 如申請專利範圍第1或2項之加成硬化型聚矽氧樹脂組成物,其中,接著性賦予劑之含量為0.01~15質量%。 The addition-hardening type polyoxyxylene resin composition according to claim 1 or 2, wherein the content of the adhesion imparting agent is 0.01 to 15% by mass. 如申請專利範圍第1、2或3項之加成硬化型聚矽氧樹脂組成物,其中,加成硬化型聚矽氧樹脂混合物含有:具有至少2個具有鍵結於矽原子之碳-碳雙鍵之取代基的聚有機矽氧烷、具有至少2個鍵結於矽原子之氫原子的聚有機氫矽氧烷、及矽氫化反應觸媒。 The addition hardening type polyoxyxene resin composition of claim 1, wherein the addition hardening type polyoxyxene resin mixture comprises: having at least two carbon-carbons bonded to a germanium atom A polyorganosiloxane having a substituent of a double bond, a polyorganohydrohalosiloxane having at least two hydrogen atoms bonded to a halogen atom, and a hydrogenation reaction catalyst. 如申請專利範圍第4項之加成硬化型聚矽氧樹脂組成物,其中,聚有 機矽氧烷中之具有鍵結於矽原子之碳-碳雙鍵之取代基為乙烯基。 For example, the additive hardening type polyoxymethylene resin composition of claim 4, wherein The substituent having a carbon-carbon double bond bonded to a ruthenium atom in the oxime is a vinyl group. 一種加成硬化型聚矽氧樹脂硬化物,其係藉由使申請專利範圍第1、2、3、4或5項之加成硬化型聚矽氧樹脂組成物硬化而獲得。 An addition hardening type polyoxymethylene resin cured product obtained by hardening an addition hardening type polyoxymethylene resin composition of the first, second, third, fourth or fifth aspect of the patent application. 一種光半導體元件密封體,其光半導體元件被申請專利範圍第6項之加成硬化型聚矽氧樹脂硬化物密封。 An optical semiconductor element sealing body whose optical semiconductor element is sealed by an addition hardening type polyoxymethylene resin cured material of claim 6 of the patent application.
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