TW201532487A - High performance package and packaging method thereof - Google Patents

Abstract

A packaging method of making a circuit element package with good heat dissipation and high power, comprising the following steps: forming a copper foil wiring on a single-sided printed circuit board, and printing the conductive paste on a plurality of preset positions on the copper foil wiring, and then fixedly disposing the circuit core of the circuit element on each conductive paste; forming a plurality of surface copper bumps on a copper board, and printing the conductive paste on each copper bump; positioning and superposing the printed circuit board fixedly disposed with the circuit core and the copper board printed with the conductive paste on each other, and each circuit core is aligned with the corresponding conductive paste on the copper bump; injecting the airtight insulation adhesive into the interval between the printed circuit board and the copper board, followed by subjecting one surface of the copper board which is opposite to the copper bumps to an etching process for forming at least two terminal electrodes; making a plating perforation at one terminal electrode of each package so as to electrically connect the terminal electrode to the circuit core via the single-sided printed circuit board; cutting to separate the individual circuit element to form the package.

Description

High-performance package and packaging method thereof

The present invention relates to a package for a semiconductor circuit component and a package method thereof, and more particularly to a surface mount component package method and package that have a power requirement and a heat dissipation effect.

At present, the surface mount structure of discrete circuit components such as diodes, light-emitting diodes, transistors and thyristors is roughly 1, cylindrical glass/plastic package; 2, lead frame (Lead- Frame) has a leaded package; 3, square-lead-free lead-package (Flat-pack leadless); and 4, flip-chip package and other common types.

Among them, the flip chip package is light, thin, short, and small. However, due to the high process, the inconvenience of customers, the aging of parts and the poor life test, the commercial customers are rarely used directly in the power and Focus on better aging life applications. In contrast, the foregoing three are the mainstream of the current power package. However, with the higher electrical requirements, higher power, heat transfer and high temperature, the three package process technologies have also become the threshold of the prior art. In addition, with environmental requirements, the limitations of packaging process and packaging materials are still to be overcome. Cost and technology.

Therefore, even if these three discrete components with or without pins are applied to the pick and place automation technology of surface mount technology on a printed circuit board, there is currently no technical problem, but such discrete The yield, automation and cost of the component process have become the main issues of the current industry. However, compared with the power improvement of the component package, the heat transfer improvement is the bottleneck and the primary problem to be solved.

It is an object of the present invention to simplify the fabrication of discrete circuit components while at the same time improving the electrical (current, power and aging characteristics) and mechanical and heat dissipation properties of the components.

Another object of the present invention is to simplify the discrete circuit component packaging process, thereby reducing the processing procedure and improving the degree of automation, process yield, and achieving the purpose of reduction.

Another object of the present invention is to simplify the types of materials required for the fabrication of discrete circuit components, and to comply with environmental regulations such as RoHS (Restriction of Hazardous Substances Directive) Halgon Free, WEEE (Waste Electrical and Electronic Equipment Directive), and more emphasis on heat. The electrical and electrothermal effects of the conductive material selection and eutectic bonding enable the components to have high quality and optimized life quality.

To achieve the above and other objects, the present invention provides a method of packaging a circuit component package having good heat dissipation and high electrical power, comprising: forming a copper foil line on a single-sided printed circuit board, and multiplying the copper foil line a conductive adhesive is printed at a set position, and a circuit core of the circuit component is fixed on each conductive paste; a plurality of surface copper bumps are formed on a copper plate, and a conductive paste is printed on each copper bump; a circuit is fixed The core printed circuit board is printed with conductive The copper plates of the glue are positioned and nested with each other, and each circuit core is aligned with the corresponding conductive adhesive on the copper bump; the airtight insulating glue is injected between the printed printed circuit board and the copper plate, and then the etching process is performed by etching Forming at least two end electrodes of each package body on the opposite side of the copper plate; forming a plated through hole at one end electrode of each package body to pass the end electrode through the copper foil line of the single-sided printed circuit board Electrically connected to the core of the circuit; and the cutting is performed to separate the individual circuit components to form the package.

The present invention further provides a circuit component package manufactured according to the above method, comprising: a single-sided printed circuit board having a copper foil line thereon; and a circuit core having at least two electrodes, one of the electrodes being electrically connected thereto Single-sided printed circuit board copper foil line; a plurality of surface copper bumps formed by a copper plate, wherein one copper bump is electrically connected to the other electrode of the circuit core, and the other copper bump is via a plating The through hole is electrically connected to the copper foil line of the single-sided printed circuit board to be electrically connected to the other electrode of the circuit core.

110‧‧‧Printed circuit board

111,1212,1312‧‧‧copper foil line

112, 1211, 1311‧‧‧FR4

220‧‧‧Process stage copper plate structure

221‧‧‧ copper bumps

301,501,1121,1221,1222

1321,1322,1323,1324‧‧‧ conductive adhesive 401,1131,1231,1232,1331 1332‧‧‧ circuit core

601,1151,1241,1341‧‧‧Airtight insulation

702,703,1111,1112,1251 1252,1253,1351,1352 1353,1354‧‧‧Independent copper block, conductive terminal of component

801,1261,1361,1362‧‧‧Plated perforation

901‧‧‧ cutting line

1000, 1100, 1200, 1300 ‧ ‧ finished package

1141‧‧‧Metal wire

1-2 are respectively a top view and a cross-sectional view showing a single-sided printed wiring board according to an embodiment of the present invention.

2-1 and 2-2 are respectively a top view and a cross-sectional view showing a copper plate having a surface copper bump according to an embodiment of the present invention.

Figure 3 shows the printing of a conductive paste on the metal area of the printed wiring board of Figure 1-1.

FIG. 4 shows that the circuit core is placed in the conductive paste of FIG. 3 in a die bonding manner on the printed wiring board of FIG.

Figure 5 shows the printing of a conductive paste at the copper bump of Figure 2-1.

Fig. 6 is a cross-sectional view showing the two structures of Fig. 5 and Fig. 4 being positioned and fitted to each other.

FIG. 7 is a cross-sectional view showing the end electrode of the package completed by an etching process by injecting a gas-tight insulating paste between the printed circuit board and the copper plate of FIG.

Figure 8 is a cross-sectional view showing the formation of plated perforations in the structure of Figure 7.

Figure 9 shows the cutting in the longitudinal and transverse directions along the black thick broken line to separate the individual circuit components.

Figure 10 shows a cross-sectional view of the finished product after separation of a single circuit component package.

Figure 11 is a cross-sectional view showing another embodiment of the package of the present invention in which one of the electrodes of the circuit component is fabricated by metal wire bonding.

Figures 12-1 and 12-2 show cross-sectional views of the finished core structure of the two circuit cores and their appearance terminal electrodes, respectively, suitable for use in the circuit of the present invention.

13-1 and 13-2 respectively show a cross-sectional view of an array of finished products of a plurality of circuit independent circuits of the present invention and an appearance terminal electrode thereof.

According to a preferred embodiment of the present invention, a single-sided circuit substrate 110 as shown in FIGS. 1-1 and 1-2 can be fabricated by using a printed circuit board commonly used in the industry, such as a circuit board using FR4 as the substrate 112. The substrate 110 has an array of strip-shaped copper foil lines 111 formed on its upper surface. Figure 1-1 is its front (top) view, and Figure 1-2 is its cross-sectional view.

2-1 and 2-2 are respectively a top view and a cross-sectional view showing a copper plate having a surface copper bump according to an embodiment of the present invention. As shown in the figure, a suitable thickness of copper plate can be firstly formed by surface etching or surface copper plating thickening to form an array of copper bumps. 221 copper plate structure 220.

Figure 3 shows the step of printing a conductive paste on the metal area of the printed wiring board of Figure 1-1. The setting of the appropriate amount of the conductive paste 301 is completed by dispensing or printing at a predetermined position on the copper foil line 111 of the circuit substrate 110. Suitable conductive adhesives can be tin, lead, or conductive adhesives such as silver, aluminum, nickel, copper or alloys. Then, in the solid crystal process, the circuit core 401 is sequentially placed on the conductive paste 301 by using a pick and place program, and the result shown in FIG. 4 can be obtained. FIG. 4 shows the case where the core of the circuit is placed in the conductive paste of FIG. 3 in a die bonding manner on the printed wiring board of FIG.

Then, the copper plate 220 shown in FIG. 2 is taken first, and a proper amount of the conductive adhesive 501 is fixed at the copper bumps 221 by printing or dispensing, as shown in FIG. 5. Next, the copper plate of the conductive paste printed in FIG. 5 is placed in a proper position on the circuit core 401 shown in FIG. 4 according to the positioning alignment manner. Thereafter, through the soldering furnace or the high-temperature baking process, the electrical conduction between the two ends of the circuit core 401, that is, the copper plate, the circuit core and the circuit-conducting structure of the printed circuit board are completed. Fig. 6 is a cross-sectional view showing the two structures of Fig. 5 and Fig. 4 positioned and fitted to each other.

Next, a fluid-like insulating material 601 (such as an insulating material such as telluride, oxide, glass, epoxy ester, or 2-polyimine) is injected between the copper plate 220 of FIG. 6 and the printed circuit board 110, and After high temperature baking and other processes, airtight insulation protection around the core component 401 of the circuit can be formed.

Then, the exposed surface of the copper plate 220 of FIG. 6 is subjected to emulsion printing, and then exposed, developed, etched, cleaned, etc., to obtain independent copper blocks 702 and 703. Fig. 7 shows a cross-sectional view of the terminal electrode of the package after the sleeve is filled with the airtight insulating glue between the printed circuit board and the copper plate.

FIG. 8 is a cross-sectional view showing a plated through hole 801 in which the independent copper block 703 and the printed circuit board 110 are electrically connected in a drill-through manner. The circuit core 401 having the upper and lower metals can electrically conduct the conductive terminals 703 by plating the through holes 801. At this time, the two conductive terminals 702 and 703 of the circuit component of the present invention are constructed.

Thereafter, the cutting in the longitudinal direction and the lateral direction along the black thick broken line is shown in Fig. 9 to separate the individual circuit elements. This can be cut in the longitudinal and transverse directions by a diamond knife or a laser knife according to the thick black dotted line 901 indicated in Fig. 9 to separate each circuit component. At this time, the component package 1000 can be obtained, and its lateral cross section is as shown in FIG. Thereafter, the component package 1000 may be subjected to a barrel plating process to complete the coating of the outer end electrode, and the coating component may include a metal such as nickel, tin, lead, silver, gold, copper, aluminum or an alloy thereof.

Figure 10 shows a preferred embodiment of a circuit component suitable for use in the method of fabricating a packaged circuit component of the present invention. The circuit element with high heat dissipation efficiency and high electric power of the present invention may have a diode die of upper and lower electrodes as a circuit core. As will be understood by those skilled in the art, the individual discrete circuit component packages of the present invention described in the above description are of course not limited to diodes. Others such as light emitting diodes; transistors or thyristors, etc., are equally applicable. In addition, the various views in the drawings of the present specification are not shown in a precise relative size. For the sake of illustration, some of these scales may be magnified.

Figure 11 is a cross-sectional view showing another embodiment of the package of the present invention in which one of the electrodes of the circuit component is fabricated by metal wire bonding. The package structure 1100 is slightly different from the package 1000. The inside of the package 1100 is a copper wire 111 on a printed circuit board that is bridged and turned on by a metal wire 1411 (which may be gold, aluminum, silver or copper wire, etc.) and plated. The function of electrically conducting the perforation 841.

Figures 12-1 and 12-2 show cross-sectional views of the finished core structure of the two circuit cores and their appearance terminal electrodes, respectively, suitable for use in the circuit of the present invention. The package 1200 differs from the package 1000 described above in that only the packaged circuit core is replaced by a single upper and lower positive and negative electrode 401 (FIG. 10, package 1000) having a plurality of connected circuit cores 1231, 1232. The outer end electrodes 1251, 1252, and 1253 of the package body 1200 are as shown in FIG. 12-2.

13-1 and 13-2 respectively show a cross-sectional view of an array of finished products of a plurality of circuit independent circuits of the present invention and an appearance terminal electrode thereof. The difference between the package 1300 and the package 1200 is only that a plurality of circuit cores 1331 and 1332 are electrically connected to the circuit cores 1231 and 1232 in the package 1200 by a plurality of independent circuit cores 1331 and 1332.

Although the present invention has been described above by way of a preferred example, the above description is not intended to limit the invention. Any changes and variations may be made by those skilled in the art without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

111‧‧‧copper foil line

112‧‧‧FR4

301,501‧‧‧ conductive adhesive

401‧‧‧ circuit core

601‧‧‧Airtight insulation

702,703‧‧‧Independent copper block, conductive terminal of component

801‧‧‧Plated perforation

1000‧‧‧Package finished products

Claims (9)

A packaging method for a circuit component package having good heat dissipation and high electric power, comprising: forming a copper foil line on a single-sided printed circuit board, and printing a conductive adhesive on a plurality of set positions on the copper foil line, and then Forming a circuit core of the circuit component on a conductive paste; forming a plurality of surface copper bumps on a copper plate, and printing a conductive paste on each of the copper bumps; and printing the printed circuit board with the circuit core and the printed conductive adhesive The copper plates are positioned and nested with each other, and each circuit core is aligned with the corresponding conductive adhesive on the copper bump; a gas-tight insulating glue is injected between the assembled printed circuit board and the copper plate, and then an etching process is performed thereon. Forming at least two end electrodes of each package body on a side opposite to the copper bump; forming a plated through hole at one end electrode of each package body to pass the end electrode through the copper foil line of the single-sided printed circuit board Electrically connected to the core of the circuit; and the cutting is performed to separate the individual circuit components to form the package. The method of claim 1, wherein the circuit component is a diode. The method of claim 1, wherein the circuit component is a transistor. The method of claim 1, wherein the single-sided printed wiring board is an FR4 printed wiring board. The method of claim 1, wherein the conductive adhesive is tin or lead rubber, and may be a conductive adhesive such as silver, aluminum, nickel, copper or an alloy thereof. The method of claim 1, wherein the hermetic insulating material is a telluride, an oxide, a glass, an epoxy ester, or a 2-polyimine insulating material. The method of claim 1, further comprising: subjecting the circuit component package to a barrel plating process to form a coating of the terminal electrode. The method of claim 7, wherein the coated component comprises nickel, tin, lead, silver, gold, copper or aluminum metal or an alloy thereof. A circuit component package having good heat dissipation and high electric power, comprising: a single-sided printed circuit board having a copper foil line thereon; a circuit core having at least two electrodes, one of the electrodes being electrically connected to the single side a printed circuit board copper foil line; a plurality of surface copper bumps formed by a copper plate, wherein one copper bump is electrically connected to the other electrode of the circuit core, and the other copper bump is electrically perforated via a plating The copper foil line is connected to the single-sided printed circuit board to be electrically connected to the other electrode of the circuit core.