TW201528757A - Electronic apparatus - Google Patents

Abstract

The present disclosure relates to an electronic apparatus with a double card frame for receiving a first chip card and a second chip card. The electronic apparatus includes a housing with a first receiving groove and a second receiving groove. The first chip card is received in the first receiving groove, and the second chip card is received in the second receiving groove. The electronic apparatus further includes a first lid, a second lid and a connecting shaft. The first lid and the second lid are rotatably mounted to the connecting shaft, and the connecting shaft is rotatably mounted to the housing. The first lid and the second lid rotate around the connecting shaft for covering or being away from the first chip card and the second card.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a dual card structure.

Due to the increasing functional requirements of portable electronic devices, electronic devices with dual-card structures have emerged. The user can use two wafer cards on one electronic device to meet the needs of the user. A dual-wafer card connecting device for a mobile communication mobile phone, wherein a mounting portion for accommodating a first wafer card and a second wafer card is disposed on the mounting portion, wherein the mounting portion is provided with an insertion slot, the first wafer card and the second wafer card The placement portion is inserted by the insertion slot. Although the plug-in type wafer card connecting device can meet the needs of the user, when the chip card is replaced, the user inserts and pulls the wafer card back and forth by external force, which often damages the wafer card and reduces the service life of the chip card. .

In view of the above, it is necessary to provide an electronic device having a dual card structure that is simple in structure and convenient to pick up and place a wafer card.

An electronic device having a dual card structure for accommodating a first wafer card and a second wafer card, the electronic device comprising a housing, the housing is provided with a first receiving body for accommodating the first wafer card a slot and a second receiving slot for receiving the second chip card. The electronic device further includes a first cover, a second cover, and a connecting shaft. The first cover plate and the second cover plate are respectively rotatably mounted on the connecting shaft, and the connecting shaft is rotatably mounted on the housing. When the first wafer card and the second wafer card are respectively received in the first receiving slot and the second receiving slot, the first cover and the second cover are respectively rotated along the connecting shaft to cover or Far from the first wafer card and the second wafer card.

The electronic device of the present invention has a simple structure and is convenient for picking up and placing a wafer card, and the first cover plate and the second cover plate are rotatably mounted on the connecting shaft. After the first wafer card and the second wafer card are respectively placed in the first receiving slot and the second receiving slot of the housing, the first cover and the second cover are respectively rotated along the connecting shaft to cover The first wafer card and the second wafer card extend the life of the wafer card.

1 is a schematic view showing the assembly of an electronic device having a dual card structure and a first wafer card and a second wafer card according to a preferred embodiment of the present invention.

2 is a partial structural view of the housing shown in FIG. 1.

3 is an exploded perspective view of the first cover plate, the second cover plate and the connecting shaft shown in FIG. 1.

4 is an exploded perspective view of the electronic device having the dual card structure shown in FIG. 1 and the first wafer card and the second wafer card.

Referring to FIG. 1 , an electronic device 100 having a dual card structure in a preferred embodiment of the present invention is a mobile phone including a housing 10 , a first cover 20 , a second cover 30 , a connecting shaft 40 , and a printed circuit board . Component 50. The first cover plate 20 and the second cover plate 30 are rotatably connected to the connecting shaft 40. The connecting shaft 40 is rotatably mounted on the housing 10. A first chip card 200 and a second chip card 300 are respectively received in the housing 10. The first cover 20 and the second cover 30 are respectively attached to the first wafer card 200 and the second On the wafer card 300. The housing 10 is capped on the printed circuit board assembly 50, and the first wafer card 200 and the second wafer card 300 are electrically connected to the printed circuit board assembly 50.

Referring to FIG. 2 , the housing 10 defines a receiving slot 11 , and the receiving slot 11 includes a bottom wall 111 and opposite first sidewalls 112 and second sidewalls 113 . A first receiving slot 114 , a second receiving slot 115 , and a third receiving slot 116 connected between the first receiving slot 114 and the second receiving slot 115 are defined in the bottom wall 111 . The first receiving slot 114 is disposed adjacent to the first sidewall 112 , and the second receiving slot 115 is disposed adjacent to the second sidewall 113 . A first receiving hole 117 and a first recessed hole 1141 are formed in the bottom wall of the first receiving slot 114. The second receiving slot 118 defines a second receiving hole 118 and a second opposite hole. Groove 1151. In the embodiment, the first receiving slot 114 and the second receiving slot 115 respectively accommodate the first wafer card 200 and the second wafer card 300. The third receiving slot 116 includes two opposite inner walls 1161 , and a mounting hole 1162 is defined in each inner wall 1161 . The first receiving hole 114 defines a first matching hole 1142 adjacent to one side of the first side wall 112 , and the second receiving hole 115 defines a second matching hole 1152 adjacent to the second side wall 113 .

A first fastening groove 1120 is defined in the first sidewall 112 , and the first fastening groove 1120 extends to the bottom wall 111 . A first protrusion 1121 is protruded from a bottom surface of the first fastening groove 1120 on the first sidewall 112. A second fastening groove 1130 is defined in the second sidewall 113 , and the second fastening groove 1130 extends to the bottom wall 111 . A second protrusion 1131 is protruded from the second fastening groove 1130 of the second sidewall 113. The first protrusion 1121 is disposed opposite to the second protrusion 1131 . The first protrusion 1121 is adjacent to the first matching hole 1142 . The second protrusion 1131 is adjacent to the second matching hole 1152 .

Referring to FIG. 3 , the first cover 20 includes a main body portion 21 , a latching portion 22 , a plurality of connecting portions 23 , and a grounding end 24 . The holding portion 22 and the plurality of connecting portions 23 are oppositely disposed on both sides of the main body portion 21 and are respectively connected to the main body portion 21. One end of the main body portion 21 extends to form the ground end 24.

A plurality of test holes 211 are provided in the main body portion 21. Before the electronic device leaves the factory, it is required to test whether the chip card can be electrically connected to the printed circuit board inside the electronic product. At this time, an external test device is used to connect the test hole on the printed circuit board to the position to be tested. If the external test device and the printed circuit board are conductive, it indicates that the wafer card can be used normally when mounted on the printed circuit board. The holding portion 22 is substantially an L-shaped plate body, and includes a fixed end 221 and a holding end 222 perpendicularly connected to the fixed end 221 . A first through hole 223 is defined in the fixed end 221 , and a second through hole 224 is defined in the holding end 222 . The first through hole 223 extends away from the inner wall of the second through hole 224 to extend out of the first bending piece 2231. The second through hole 224 extends adjacent to the inner wall of the first through hole 223 to extend the second bending piece. 2241. Each connecting portion 23 includes a connecting piece 231. One end of the connecting piece 231 is fixedly connected to the main body portion 21. The other end of the connecting piece 231 is continuously bent to form a substantially annular rotating portion 232. The grounding end 24 includes a fixing piece 241 and a resisting piece 242 connected to one end of the fixing piece 241.

The second cover plate 30 is similar in structure to the first cover plate 20 and includes a main body portion 31, a latching portion 32, a plurality of connecting portions 33, and a grounding end 34. The second cover plate 30 is different from the first cover plate 20 in that the distance between the plurality of connecting portions 33 on the main body portion 31 is different from the interval between the plurality of connecting portions 23 on the main body portion 21, the holding portion 32 and the position of the plurality of connecting portions 33 on the two sides of the main body portion 31 are opposite to the positions of the holding portion 22 and the plurality of connecting portions 23 on the two sides of the main body portion 21, and the resisting piece 342 of the grounding end 34 faces the same The catching portion 32 extends. In the embodiment, the first cover 20 and the second cover 30 are made of stainless steel.

The connecting shaft 40 has a cylindrical rod shape whose diameter matches the diameter of the rotating portion 232 of the connecting portion 23 and the diameter of the rotating portion 332 of the connecting portion 33.

Referring to FIG. 4, the printed circuit board assembly 50 includes a printed circuit board 51, two spring pieces 52, and two conductive members 53. A plurality of conductive regions (not shown) are disposed on the printed circuit board 51. In the present embodiment, the two elastic pieces 52 and the two conductive members 53 are respectively soldered to the conductive regions of the printed circuit board 51 corresponding thereto. The first wafer card 200 and the second wafer card 300 are electrically connected to the printed circuit board 51 by the two conductive members 53.

Referring to FIG. 2-4, the assembly process of the electronic device 100 is further described below. The plurality of rotating portions 232 of the first cover 20 and the plurality of rotating portions 332 of the second cover 30 are sleeved on the connecting shaft 40. The opposite ends of the connecting shaft 40 are respectively received in the two mounting holes 1162. . The printed circuit board 51 is mounted on one side of the housing 10. A spring 52 is received in the first matching hole 1142, and another elastic piece 52 is received in the second matching hole 1152. A conductive member 53 is received in the first recessed hole 1141, and another conductive member 53 is received in the second recessed hole 1151. The position of the portion of the conductive region of the printed circuit board 51 corresponds to the positions of the first receiving hole 117 and the second receiving hole 118.

The use of the electronic device 100 is further described below. The first wafer card 200 is placed in the first receiving slot 114. The conductive sheet (not shown) on the first wafer card 200 is in contact with the conductive member 53 received in the first recessed hole 1141. The holding portion 22 of the first cover 20 rotates the connecting portion 23 along the connecting shaft 40 under the action of an external force, and the main body portion 21 covers the first wafer card 200. The grounding end 24 is received in the first receiving hole 117, and the resisting piece 242 is pressed against the corresponding conducting area, so that the static electricity on the first cover 20 is led out by the grounding end 24 The first wafer card 200 is protected from electrostatic damage. The first through hole 223 of the fixed end 221 corresponds to the position of the first matching hole 1142, and the first bending piece 2231 is abutted on the elastic piece 52 of the first matching hole 1142 so that the The static electricity on the first cover 20 is led out by the elastic to protect the first wafer card 200 from electrostatic damage. The holding portion 22 is received in the first fastening groove 1120. The second through hole 224 of the holding end 222 corresponds to the position of the first protrusion 1121. The first protrusion 1121 is received. In the second through hole 224, the second bending piece 2241 is abutted against the first protrusion 1121, so that the holding portion 22 is fixedly attached to the first side wall 112, and the first wafer card 200 is stably mounted on the first wafer card 200. Inside the housing 10. When the first wafer card 200 needs to be replaced, the second bending piece 2241 is disengaged from the first protrusion 1121 by an external force, and the first cover 20 is rotated on the connecting shaft 40. The first wafer card 200 is exposed. The mounting process of the second wafer card 300 is consistent with the installation process of the first wafer card 200. The holding portion 32 of the second cover is received in the second fastening slot 1130, and the second wafer card 300 is stable. Installed in the housing 10.

The electronic device 100 of the present invention has a simple structure and convenient access to the wafer card, and the first cover 20 and the second cover 30 are rotatably mounted on the connecting shaft 40. After the first wafer card 200 and the second wafer card 300 are respectively placed in the first receiving slot 114 and the second receiving slot 115 of the housing 10, the first cover 20 and the second cover 30 are respectively The connecting shaft 40 rotates to cover the first wafer card 200 and the second wafer card 300, thereby prolonging the service life of the wafer card.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧Electronic devices

200‧‧‧First chip card

300‧‧‧second chip card

10‧‧‧shell

20‧‧‧First cover

30‧‧‧Second cover

40‧‧‧Connected shaft

50‧‧‧Printed circuit board assembly

11‧‧‧ accommodating slots

111‧‧‧ bottom wall

112‧‧‧First side wall

113‧‧‧ second side wall

114‧‧‧First storage trough

115‧‧‧Second holding trough

116‧‧‧3rd storage trough

117‧‧‧First accommodating hole

118‧‧‧Second accommodating hole

1141‧‧‧ first recess

1151‧‧‧ second recess

1161‧‧‧ inner wall

1162‧‧‧ mounting holes

1142‧‧‧First matching hole

1152‧‧‧Second mating hole

1120‧‧‧First card slot

1130‧‧‧Second card slot

1121‧‧‧First bulge

1131‧‧‧second bulge

21‧‧‧ Main body

22‧‧‧Card Department

23‧‧‧Connecting Department

24‧‧‧ Grounding

31‧‧‧ Main body

32‧‧‧Cars Department

33‧‧‧Connecting Department

34‧‧‧ Grounding terminal

332‧‧‧Rotation

211‧‧‧ test hole

221‧‧‧ fixed end

222‧‧‧ card holder

223‧‧‧ first through hole

224‧‧‧second through hole

2231‧‧‧First bent piece

2241‧‧‧Second bent piece

231‧‧‧Connecting piece

232‧‧‧Rotation

241‧‧‧Fixed piece

242‧‧‧Resistance film

51‧‧‧Printed circuit board

52‧‧‧Shrap

53‧‧‧Connecting parts

no

100‧‧‧Electronic devices

200‧‧‧First chip card

300‧‧‧second chip card

10‧‧‧shell

20‧‧‧First cover

30‧‧‧Second cover

40‧‧‧Connected shaft

50‧‧‧Printed circuit board assembly

Claims (9)

An electronic device having a dual card structure for accommodating a first wafer card and a second wafer card, the electronic device comprising a housing, wherein the housing is provided with a first receiving slot for receiving the first wafer card And the second receiving slot of the second chip card; the improvement is that the electronic device further includes a first cover plate, a second cover plate and a connecting shaft, and the first cover plate and the second cover plate are respectively rotatably mounted The connecting shaft is rotatably mounted on the connecting shaft. When the first wafer card and the second wafer card are respectively received in the first receiving slot and the second receiving slot, the first cover The plate and the second cover are respectively rotated along the connecting shaft to cover or away from the first wafer card and the second wafer card. An electronic device having a dual-card structure according to claim 1, wherein the housing has a receiving groove, and the receiving groove includes a bottom wall, and the first receiving groove is spaced apart from the bottom wall. a second receiving slot and a third receiving slot connected between the first receiving slot and the second receiving slot. The third receiving slot includes two opposite inner walls, and each inner wall defines a mounting hole. The connecting shaft is received in the mounting hole. An electronic device having a dual-card structure according to the second aspect of the invention, wherein the bottom wall of the first receiving slot defines a first recessed hole, and the bottom wall of the second receiving slot defines a second recessed hole, the electronic The device further includes a printed circuit board component including a printed circuit board and two conductive members mounted on one side of the housing, the printed circuit board being provided with a plurality of conductive regions, the two conductive members being soldered The two conducting members are respectively received in the first recessed hole and the second recessed hole in the corresponding conductive region. An electronic device having a dual-card structure according to claim 3, wherein the accommodating groove comprises two opposite first sidewalls and a second sidewall, the first receiving slot is adjacent to the first sidewall a second matching hole, the second receiving hole defines a second matching hole adjacent to the second side wall, the printed circuit board component further includes two elastic pieces, and the two elastic pieces are respectively soldered on the conductive area of the printed circuit board, the two The elastic pieces are respectively received in the first matching hole and the second matching hole. The electronic device having a dual-card structure according to claim 4, wherein the first cover comprises a grounding end and a main body, and the grounding end comprises a fixing piece and a resistance connected to one end of the fixing piece. The grounding end is fixed to one end of the main body by the fixing piece, and the first receiving hole has a first receiving hole at one end of the first receiving slot, and the second receiving hole is opened at one end of the second receiving slot. The grounding end is received in the first receiving hole, and the grounding end of the second cover is received in the second receiving hole, and the resisting piece abuts on the conductive area of the printed circuit board. The electronic device with a dual card structure according to claim 5, wherein the first cover comprises a holding portion, and the holding portion comprises a fixed end and a holding end perpendicularly connected to the fixed end, The fixing portion is fixed on the main body portion. The fixing end defines a first through hole. The inner wall of the first through hole extends out of the first bending piece, and the first bending piece is resisted. A shrapnel on the piece. An electronic device having a dual-card structure according to claim 6, wherein the holding end defines a second through hole, and an inner wall of the second through hole extends from the second bent piece, the first a first protrusion is protruded from a sidewall, the first protrusion is received in the second through hole, the second bending piece abuts the first protrusion, and the holding portion is attached to the first side wall on. The electronic device with a double card structure according to claim 5, wherein the first cover plate comprises a plurality of connecting portions, each connecting portion comprises a connecting piece, and one end of each connecting piece is connected to the main body portion, and One end is continuously bent to form a rotating portion, and the rotating portion is sleeved on the connecting shaft. An electronic device having a dual-card structure according to claim 5, wherein a plurality of test holes are formed in the main body portion, and an external test device is connected to the to-be-tested position on the printed circuit board through the plurality of test holes. The main portion of the first cover is attached to the first wafer card, and the main portion of the second cover is attached to the second wafer, and the first wafer card and the conductive chip on the second wafer card Contacting the two conductive members respectively.