TW201528560A - Light emitting diode package cup - Google Patents
Light emitting diode package cup Download PDFInfo
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- TW201528560A TW201528560A TW103101004A TW103101004A TW201528560A TW 201528560 A TW201528560 A TW 201528560A TW 103101004 A TW103101004 A TW 103101004A TW 103101004 A TW103101004 A TW 103101004A TW 201528560 A TW201528560 A TW 201528560A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
本發明是有關於一種發光二極體封裝技術,且特別是有關於一種可調節封裝膠體的膠量之發光二極體封裝杯及發光二極體封裝元件。 The invention relates to a light emitting diode packaging technology, and in particular to a light emitting diode package cup and a light emitting diode package component which can adjust the glue amount of the encapsulant.
以目前背光封裝製程而言,雖然封裝時的點膠量由機器控制,但仍需人為設定參數,且每次點膠之參數皆不固定,如此一來,不但得花費校正機器參數的時間,且每次封裝時的膠量亦有一定程度之差異,若發生人員疏失或機台不穩定時,便會出現凸杯的情況。若膠體膨脹後,表面接觸到光導板(light guide plate),造成背光色彩不均勻的現象。 In the current backlight packaging process, although the amount of dispensing during packaging is controlled by the machine, it is still necessary to manually set parameters, and the parameters of each dispensing are not fixed, so that not only the time for correcting the machine parameters is required, And the amount of glue at each package is also different to some extent. If there is a person's negligence or the machine is unstable, a convex cup will appear. If the surface of the colloid expands, the surface contacts the light guide plate, resulting in uneven color of the backlight.
現行之發光二極體封裝杯需將點膠量設定於精準的範圍內,否則將造成每次點膠的品質不一,甚至因膠量過多造成膠體黏貼於光導板。因此,如何能使膠面高度達到一致,且無需耗費過多時間校正膠量參數,實屬當前重要研發課題之一,亦成為當前相關領域極需改進的目標。 In the current LED package cup, the dispensing amount should be set within a precise range, otherwise the quality of each dispensing will be different, and even the glue will stick to the light guide plate due to excessive glue. Therefore, how to make the rubber surface height consistent, and does not need to spend too much time to adjust the glue amount parameters, is one of the current important research and development topics, and has become the goal of improvement in the current related fields.
本發明之一態樣是在提供一種發光二極體封裝杯,以解決先前技術的問題。 One aspect of the present invention is to provide a light emitting diode package cup to solve the problems of the prior art.
於一實施例中,本發明所提供的發光二極體封裝杯包含杯體、至少一溢膠孔及至少一發光二極體。杯體內側之封裝空間用以填充封裝膠體。溢膠孔具有溢膠入口,形成於杯體的內側,使接觸到溢膠入口之部份封裝膠體流入溢膠孔,藉以調節封裝空間內之封裝膠體的膠量。發光二極體設置於杯體之內側。 In one embodiment, the LED package cup of the present invention comprises a cup body, at least one overflow hole and at least one light emitting diode. The package space inside the cup is used to fill the encapsulant. The overflow hole has an overflow inlet formed on the inner side of the cup body, so that a part of the encapsulant contacting the overflow inlet flows into the overflow hole, thereby adjusting the amount of the encapsulation glue in the package space. The light emitting diode is disposed on the inner side of the cup body.
於一實施例中,溢膠孔係盲孔,具有盲孔尾端,且溢膠入口至杯體的底部之垂直距離大於盲孔尾端至杯體的底部之垂直距離,使接觸到溢膠入口之部份封裝膠體係流入盲孔並留存於盲孔中。 In an embodiment, the overflow hole is a blind hole having a blind hole tail end, and a vertical distance from the glue inlet to the bottom of the cup body is greater than a vertical distance from the tail end of the blind hole to the bottom of the cup body, so that the glue is contacted. A portion of the encapsulant system at the inlet flows into the blind hole and remains in the blind hole.
於一實施例中,溢膠孔係通孔,具有溢膠出口形成於杯體的外側,且溢膠入口至杯體的底部之垂直距離大於溢膠出口至杯體的底部之垂直距離,使接觸到溢膠入口之部份封裝膠體得以從溢膠出口流出。 In one embodiment, the overflow hole is a through hole having an overflow outlet formed on the outer side of the cup, and a vertical distance from the overflow inlet to the bottom of the cup is greater than a vertical distance from the overflow outlet to the bottom of the cup, so that A portion of the encapsulant that is in contact with the overflow inlet is allowed to flow out of the overflow outlet.
於一實施例中,發光二極體封裝杯更包含至少一儲存槽體,設置於杯體的外側且包覆溢膠出口,使接觸到溢膠入口之部份封裝膠體從溢膠出口流出至儲存槽體。 In one embodiment, the LED package cup further comprises at least one storage tank body disposed on the outer side of the cup body and covering the overflow outlet, so that a part of the encapsulant contacting the overflow inlet flows out from the overflow outlet to the overflow outlet. Store the tank.
於一實施例中,儲存槽體與杯體係以立體印刷或射出成型形成。 In one embodiment, the storage tank body and the cup system are formed by embossing or injection molding.
於一實施例中,儲存槽體係可脫離槽體。 In one embodiment, the reservoir system can be detached from the tank.
於一實施例中,在部份封裝膠體已流入儲存槽體 後,可脫離槽體用以受沖壓或切割而離開杯體。 In one embodiment, a portion of the encapsulant has flowed into the storage tank Thereafter, the tank can be detached from the tank for being punched or cut away from the cup.
於一實施例中,溢膠孔於杯體上係以機械鑽孔形成。 In one embodiment, the overflow hole is formed by mechanical drilling on the cup.
於一實施例中,本發明所提供的發光二極體封裝元件包含如上所述之發光二極體封裝杯、支架、發光二極體晶片及封裝膠體。支架被發光二極體封裝杯所包覆,並且在杯體底部裸露出部分支架之表面,作為預定的固晶區。發光二極體晶片設置於固晶區之表面的支架上。封裝膠體填於發光二極體封裝杯內,並且覆蓋發光二極體晶片。 In one embodiment, the LED package of the present invention comprises the LED package cup, the holder, the LED chip and the encapsulant as described above. The bracket is covered by the LED package cup, and a part of the surface of the bracket is exposed at the bottom of the cup as a predetermined solid crystal region. The light emitting diode chip is disposed on the support on the surface of the die bonding region. The encapsulant is filled in the LED package cup and covers the LED chip.
於一實施例中,封裝膠體內更包括波長轉換物質,可將部份發光二極體晶片所發出第波長光轉換成第二波長光,且第二波長光與其它未被波長轉換物質轉換的第波長光在射出封裝膠體後可混合成為白光。 In an embodiment, the encapsulant further comprises a wavelength converting substance, which converts the first wavelength light emitted by the partial LED chip into the second wavelength light, and the second wavelength light is converted with the other wavelength conversion material. The first wavelength light can be mixed into white light after being emitted from the encapsulant.
綜上所述,本發明之技術方案與現有技術相比具有明顯的優點和有益效果。藉由上述技術方案,可達到相當的技術進步,並具有產業上的廣泛利用價值,其優點係能使膠面高度達到一致,且無需耗費過多時間校正膠量參數。 In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the above technical solution, considerable technological progress can be achieved, and the industrial use value is widely used, and the advantage is that the rubber surface height can be consistent, and it is not necessary to spend too much time to correct the glue amount parameter.
100、200、300‧‧‧發光二極體封裝杯 100, 200, 300‧‧‧Light Emitting Cups
110、210、310‧‧‧杯體 110, 210, 310‧‧‧ cups
111、211、311‧‧‧杯體底部 111, 211, 311‧‧‧ cup bottom
112、212、312‧‧‧封裝空間 112, 212, 312‧‧‧ package space
113、213、313‧‧‧封裝膠體 113,213,313‧‧‧Package colloid
114、214、314、400、500‧‧‧支架 114, 214, 314, 400, 500‧‧‧ bracket
115、215、315‧‧‧波長轉換物質 115, 215, 315‧ ‧ wavelength conversion substances
116、216、316‧‧‧表面 116, 216, 316‧‧‧ surface
120、130、220、230、320、330‧‧‧溢膠孔 120, 130, 220, 230, 320, 330‧‧ ‧ plastic holes
121、131、221、231、321、331‧‧‧溢膠入口 121, 131, 221, 231, 321, 331 ‧ ‧ overflow entrance
140、240、340‧‧‧發光二極體 140, 240, 340‧‧‧Lighting diodes
141、241、341‧‧‧導線 141, 241, 341‧‧‧ wires
170、180、270、280、370、380‧‧‧膠體 170, 180, 270, 280, 370, 380‧ ‧ colloid
222、232‧‧‧盲孔尾端 222, 232‧‧ ‧ blind hole end
322、332‧‧‧溢膠出口 322, 332‧‧ ‧ spilled rubber exports
350、360、515、516、525、526、535、536、545、546、555、556‧‧‧儲存槽體 350, 360, 515, 516, 525, 526, 535, 536, 545, 546, 555, 556‧‧‧ storage tank
410~450、411~451、510~550、511~551‧‧‧發光二極體封裝元件 410~450, 411~451, 510~550, 511~551‧‧‧Light emitting diode package components
D1、D2、D3、D4‧‧‧垂直距離 D1, D2, D3, D4‧‧‧ vertical distance
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1A圖是依照本發明第一實施例之發光二極體封裝杯於溢膠前的剖面示意圖;第1B圖是依照本發明第一實施例之發光二極體封裝杯於 溢膠後的剖面示意圖;第2A圖是依照本發明第二實施例之發光二極體封裝杯於溢膠前的剖面示意圖;第2B圖是依照本發明第二實施例之發光二極體封裝杯於溢膠後的剖面示意圖;第3A圖是依照本發明第三實施例之發光二極體封裝杯於溢膠前的剖面示意圖;第3B圖是依照本發明第三實施例之發光二極體封裝杯於溢膠後的剖面示意圖;第4圖是依照本發明一實施例所繪示之一種發光二極體封裝元件於溢膠後與支架分離的示意圖;以及第5圖是依照本發明一實施例所繪示之另一種發光二極體封裝元件於溢膠後與支架分離的示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A cross-sectional view of the front side of the glue; FIG. 1B is a light-emitting diode package cup according to the first embodiment of the present invention. 2A is a schematic cross-sectional view of a light-emitting diode package cup according to a second embodiment of the present invention before overflowing; and FIG. 2B is a light-emitting diode package according to a second embodiment of the present invention; FIG. 3A is a schematic cross-sectional view of a light-emitting diode package cup according to a third embodiment of the present invention before overflowing; and FIG. 3B is a light-emitting diode according to a third embodiment of the present invention; FIG. 4 is a schematic view showing a light emitting diode package component separated from a bracket after overflowing according to an embodiment of the present invention; and FIG. 5 is a schematic view of the present invention according to the present invention; Another schematic diagram of the LED package component shown in one embodiment is separated from the bracket after overflowing.
為了使本發明之敘述更加詳盡與完備,以下將以圖式及詳細說明清楚說明本發明之精神,任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後,當可由本發明所教示之技術,加以改變及修飾,其並不脫離本發明之精神與範圍。另一方面,眾所週知的元件與步驟並未描述於實施例中,以避免對本發明造成不必要的限制。 In order to make the present invention more detailed and complete, the present invention will be clearly described in the following description and detailed description. The teachings of the present invention are subject to change and modifications without departing from the spirit and scope of the invention. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessarily limiting the invention.
第1A圖是依照本發明第一實施例之發光二極體封裝杯100於溢膠前的剖面示意圖。如第1A圖所示,發光二極體封裝杯100包含杯體110、溢膠孔120、130及發光二 極體140。杯體110內側之封裝空間112用以填充封裝膠體113。發光二極體140設置於杯體110之內側。溢膠孔120、130形成於杯體110的內側,分別具有溢膠入口121、131。於一實施例中,於杯體110上之溢膠孔120、130係以機械鑽孔形成通孔,使得封裝膠體113之表面116接觸到溢膠入口121、131時,部份封裝膠體113可藉溢膠孔120、130流出至杯體110外側,藉以調節封裝空間112內之封裝膠體113的膠量。當封裝膠體113注入杯體110內側之封裝空間112時,隨著注入之封裝膠體113愈來愈多,封裝膠體113之表面116也愈來愈高,且由於封裝膠體113之表面116具有表面張力,所以封裝膠體113之表面116會呈現中央較高的曲面。 FIG. 1A is a schematic cross-sectional view of a light-emitting diode package cup 100 according to a first embodiment of the present invention before overflowing. As shown in FIG. 1A, the LED package cup 100 includes a cup body 110, an overflow hole 120, 130, and a light emitting diode. Polar body 140. The package space 112 inside the cup 110 is used to fill the encapsulant 113. The light emitting diode 140 is disposed inside the cup body 110. The overflow holes 120, 130 are formed on the inner side of the cup body 110, and have overflow inlets 121, 131, respectively. In one embodiment, the overflow holes 120, 130 on the cup body 110 are mechanically drilled to form a through hole, so that when the surface 116 of the encapsulant 113 contacts the overflow inlets 121, 131, the partial encapsulant 113 can be The overflow of the glue holes 120, 130 flows out to the outside of the cup body 110, thereby adjusting the amount of glue of the encapsulant 113 in the package space 112. When the encapsulant 113 is injected into the encapsulation space 112 inside the cup 110, as the encapsulation 113 is injected more and more, the surface 116 of the encapsulant 113 is also higher and higher, and since the surface 116 of the encapsulant 113 has surface tension Therefore, the surface 116 of the encapsulant 113 will have a higher central curved surface.
第1B圖是依照本發明第一實施例之發光二極體封裝杯100於溢膠後的剖面示意圖。如1B圖所示,當封裝膠體113注入杯體110內側之封裝空間112時,一旦封裝膠體113之表面116接觸到溢膠入口121、131,部份封裝膠體113可流入溢膠孔120、130,而自溢膠孔120、130流出的膠體170、180會流出至杯體110外側,也因為溢膠孔120、130的關係,封裝膠體113之表面116會幾乎呈現平面。 FIG. 1B is a cross-sectional view showing the LED package 100 of the first embodiment of the present invention after overflowing. As shown in FIG. 1B, when the encapsulant 113 is injected into the encapsulation space 112 inside the cup 110, once the surface 116 of the encapsulant 113 contacts the overflow inlets 121, 131, part of the encapsulant 113 can flow into the overflow holes 120, 130. The colloids 170, 180 flowing out of the overflow holes 120, 130 will flow out to the outside of the cup 110. Also, due to the relationship of the overflow holes 120, 130, the surface 116 of the encapsulant 113 will appear almost flat.
第2A圖是依照本發明第二實施例之發光二極體封裝杯200於溢膠前的剖面示意圖。如第2A圖所示,發光二極體封裝杯200包含杯體210、溢膠孔220、230及發光二極體240。封裝膠體213填充於杯體210內側之封裝空間 212中。發光二極體240設置於杯體210之內側。形成於杯體210內側的溢膠孔220、230係盲孔,溢膠孔220具有溢膠入口221及盲孔尾端222,而溢膠孔230具有溢膠入口231及盲孔尾端232。於一實施例中,於杯體210上之溢膠孔220、230係以機械鑽孔形成盲孔,使得封裝膠體213之表面216接觸到溢膠入口221、231時,部份封裝膠體213可流入至溢膠孔220、230留存,藉以調節封裝空間112內之封裝膠體113的膠量。溢膠入口221、231至盲孔尾端222、232具有一傾斜度。以溢膠孔220為例,溢膠入口221至杯體底部211之垂直距離D2大於盲孔尾端222至杯體底部211之垂直距離D1。 2A is a schematic cross-sectional view of the LED package cup 200 according to the second embodiment of the present invention before overflowing. As shown in FIG. 2A, the LED package cup 200 includes a cup body 210, overflow holes 220 and 230, and a light-emitting diode 240. The encapsulant 213 is filled in the package space inside the cup 210 212. The light emitting diode 240 is disposed inside the cup body 210. The overflow holes 220 and 230 formed on the inner side of the cup body 210 are blind holes, and the overflow glue holes 220 have a glue overflow inlet 221 and a blind hole tail end 222, and the overflow rubber hole 230 has a glue overflow inlet 231 and a blind hole tail end 232. In one embodiment, the overflow holes 220, 230 on the cup body 210 are mechanically drilled to form a blind hole, so that when the surface 216 of the encapsulant 213 contacts the overflow inlets 221, 231, the partial encapsulant 213 can be The inflow into the overflow holes 220, 230 is retained, thereby adjusting the amount of glue of the encapsulant 113 in the package space 112. The overflow glue inlets 221, 231 to the blind hole ends 222, 232 have an inclination. Taking the overflow hole 220 as an example, the vertical distance D2 of the overflow inlet 221 to the bottom 211 of the cup is greater than the vertical distance D1 of the blind end 222 to the bottom 211 of the cup.
第2B圖是依照本發明第二實施例之發光二極體封裝杯200於溢膠後的剖面示意圖。如第2B圖所示,當封裝膠體213注入杯體210內側之封裝空間212時,一旦封裝膠體213之表面216接觸到溢膠入口221、231,部份封裝膠體213可流入溢膠孔220、230。由於部份封裝膠體213自溢膠入口221、231流入溢膠孔220、230,膠體270、280會留存於溢膠孔220、230中。原先封裝膠體213之表面216具有表面張力,呈現中央較高的曲面(如第2A圖所繪示),因為溢膠孔220、230提供了封裝膠體213可流通的通道,故封裝膠體213之表面216會呈現幾乎平面(如第2B圖所繪示)。 FIG. 2B is a schematic cross-sectional view of the LED package cup 200 according to the second embodiment of the present invention after overflowing. As shown in FIG. 2B, when the encapsulant 213 is injected into the package space 212 inside the cup 210, once the surface 216 of the encapsulant 213 contacts the overflow inlets 221 and 231, a portion of the encapsulant 213 can flow into the overflow hole 220. 230. Since a part of the encapsulant 213 flows into the overflow holes 220 and 230 from the overflow inlets 221 and 231, the colloids 270 and 280 remain in the overflow holes 220 and 230. The surface 216 of the original encapsulant 213 has a surface tension and exhibits a centrally higher curved surface (as shown in FIG. 2A). Since the overflow holes 220 and 230 provide a passage through which the encapsulant 213 can flow, the surface of the encapsulant 213 is provided. 216 will appear almost flat (as shown in Figure 2B).
第3A圖是依照本發明第三實施例之發光二極體封裝杯300於溢膠前的剖面示意圖。如第3A圖所示,發光二 極體封裝杯300包含杯體310、溢膠孔320、330及發光二極體340。封裝膠體313填充於杯體310內側之封裝空間312中。發光二極體340設置於杯體310之內側。形成於杯體310內側的溢膠孔320、330係通孔,溢膠孔320具有溢膠入口321及溢膠出口322,而溢膠孔330具有溢膠入口331及溢膠出口332。於一實施例中,溢膠孔320、330於杯體310上係以機械鑽孔形成通孔,使得封裝膠體313之表面316接觸到溢膠入口321、331時,部份封裝膠體313可流入溢膠孔320、330,藉以調節封裝空間312內之封裝膠體313的膠量。溢膠入口321、331至溢膠出口322、332具有一傾斜度,可使接觸到溢膠入口321、331之部份封裝膠體313得以從溢膠出口322、332流出。以溢膠孔320為例,溢膠入口321至杯體底部311之垂直距離D4大於溢膠出口322至杯體底部311之垂直距離D3。 FIG. 3A is a schematic cross-sectional view of the LED package cup 300 according to the third embodiment of the present invention before overflowing. As shown in Figure 3A, the light is two The polar package cup 300 includes a cup body 310, overflow holes 320, 330, and a light emitting diode 340. The encapsulant 313 is filled in the encapsulation space 312 inside the cup 310. The light emitting diode 340 is disposed inside the cup 310. The overflow holes 320 and 330 formed on the inner side of the cup body 310 are through holes. The overflow metal holes 320 have an overflow inlet 321 and an overflow outlet 322, and the overflow holes 330 have an overflow inlet 331 and an overflow outlet 332. In one embodiment, the overflow holes 320, 330 are mechanically drilled to form through holes on the cup 310, so that when the surface 316 of the encapsulant 313 contacts the overflow inlets 321, 331, part of the encapsulant 313 can flow in. The glue holes 320, 330 are used to adjust the amount of glue of the encapsulant 313 in the package space 312. The overflow inlets 321 and 331 to the overflow outlets 322 and 332 have an inclination to allow a portion of the encapsulant 313 contacting the overflow inlets 321, 331 to flow out of the overflow outlets 322, 332. Taking the overflow hole 320 as an example, the vertical distance D4 of the overflow inlet 321 to the bottom 311 of the cup is greater than the vertical distance D3 of the overflow outlet 322 to the bottom 311 of the cup.
於一實施例中,發光二極體封裝杯300更包含儲存槽體350、360,設置於杯體310的外側且分別包覆溢膠出口322、332,使接觸到溢膠入口321之部份封裝膠體313從溢膠出口322流出至儲存槽體350,而接觸到溢膠入口331之部份封裝膠體313從溢膠出口332流出至儲存槽體360。 In one embodiment, the LED package cup 300 further includes storage tanks 350 and 360 disposed on the outer side of the cup 310 and respectively covering the overflow outlets 322 and 332 so as to contact the overflow inlet 321 The encapsulant 313 flows out of the overflow outlet 322 to the storage tank 350, and a portion of the encapsulant 313 that contacts the overflow inlet 331 flows out of the overflow outlet 332 to the storage tank 360.
第3B圖是依照本發明第三實施例之發光二極體封裝杯300於溢膠後的剖面示意圖。於第3B圖所示,當封裝膠體313注入杯體310內側之封裝空間312時,一旦封裝膠體313之表面316接觸到溢膠入口321、331,部份封裝 膠體313可自溢膠入口321、331流入溢膠孔320、330,而膠體370、380會從溢膠出口322、332流出至儲存槽體350、360留存。原先封裝膠體313之表面316具有表面張力,呈現中央較高的曲面(如第3A圖所繪示),因為溢膠孔320、330提供了封裝膠體313可流通的通道,故封裝膠體313之表面316會呈現幾乎平面(如第3B圖所繪示)。 FIG. 3B is a cross-sectional view of the LED package cup 300 according to the third embodiment of the present invention after overflowing. As shown in FIG. 3B, when the encapsulant 313 is injected into the package space 312 inside the cup 310, once the surface 316 of the encapsulant 313 contacts the overflow inlets 321, 331, the package is partially packaged. The colloid 313 can flow into the overflow holes 320, 330 from the overflow inlets 321 and 331, and the colloids 370, 380 will flow out from the overflow outlets 322, 332 to the storage tanks 350, 360. The surface 316 of the original encapsulant 313 has a surface tension and exhibits a centrally higher curved surface (as shown in FIG. 3A). Since the overflow holes 320, 330 provide a passage through which the encapsulant 313 can flow, the surface of the encapsulant 313 is provided. 316 will appear almost flat (as shown in Figure 3B).
如第3A、3B圖所示,於一實施例中,儲存槽體350、360與杯體310係以立體印刷(three-dimensional printing)或射出成型形成。其中立體印刷係以立體印刷設備(stereo lithography apparatus)依靠電腦輸入設計圖來製造出立體實物的技術,其工作原理為:設計者使用電腦輔助設計軟體設計一件物品,然後將設計圖的電子文件傳送至立體印刷設備。立體印刷設備讀取文件後將設計的立體圖形拆解為無數層二維截面圖,隨後按順序並疊加地印出每一層。 As shown in FIGS. 3A and 3B, in one embodiment, the storage tanks 350, 360 and the cup 310 are formed by three-dimensional printing or injection molding. The three-dimensional printing system uses a stereo lithography apparatus to input a design drawing to create a three-dimensional physical object. The working principle is that the designer uses a computer-aided design software to design an article, and then the electronic file of the design drawing. Transfer to a three-dimensional printing device. After reading the file, the three-dimensional printing device disassembles the designed three-dimensional figure into a multi-layer two-dimensional sectional view, and then prints each layer in order and superimposedly.
於一實施例中,儲存槽體350、360係可脫離槽體。當封裝膠體313注入杯體310內側之封裝空間312並且表面316接觸到溢膠入口321、331時,部份封裝膠體313流入溢膠孔320、330,自溢膠入口321、331流入溢膠孔320、330,而膠體370、380會從溢膠出口322、332流出至儲存槽體350、360。將儲存槽體350、360自杯體310外側脫離,便可將填充於封裝空間312內封裝膠體313的多餘膠體370、380移除。於一實施例中,在部份封裝膠體313已流入儲存槽體350、360後,儲存槽體350、360可受沖壓或切割而離開杯體310。 In one embodiment, the storage tanks 350, 360 are detachable from the tank. When the encapsulant 313 is injected into the encapsulation space 312 inside the cup 310 and the surface 316 contacts the overflow inlets 321 and 331 , a part of the encapsulant 313 flows into the overflow holes 320 , 330 , and flows into the overflow holes from the overflow inlets 321 , 331 . 320, 330, and the colloids 370, 380 will flow out of the overflow outlets 322, 332 to the storage tanks 350, 360. The excess colloids 370, 380 of the encapsulant 313 filled in the encapsulation space 312 can be removed by detaching the storage tanks 350, 360 from the outside of the cup 310. In one embodiment, after a portion of the encapsulant 313 has flowed into the storage tanks 350, 360, the storage tanks 350, 360 can be stamped or cut away from the cup 310.
如上所述之發光二極體封裝杯係可用於發光二極體封裝元件。舉例而言,如第1A圖所示,於一實施例中,本發明所提供的發光二極體封裝元件包含於杯體110上具有溢膠孔120、130之發光二極體封裝杯100、支架114、發光二極體晶片140及封裝膠體113。支架114被發光二極體封裝杯100所包覆,並且在杯體底部111裸露出部分支架114之表面,作為預定的固晶區。發光二極體晶片140設置於固晶區之表面的支架114上。封裝膠體113填充於發光二極體封裝杯100內,並且覆蓋發光二極體晶片140。同樣地,如第2A圖所示,發光二極體封裝元件可包含於杯體210上具有盲孔形式的溢膠孔220、230之發光二極體封裝杯200、支架214、發光二極體晶片240及封裝膠體213。如第3A圖所示,發光二極體封裝元件可包含於杯體310上具有通孔形式的溢膠孔320、330之發光二極體封裝杯300、支架314、發光二極體晶片340及封裝膠體313。 The light-emitting diode package cup as described above can be used for a light-emitting diode package component. For example, as shown in FIG. 1A, in an embodiment, the LED package component of the present invention comprises a light-emitting diode package cup 100 having a glue hole 120, 130 on the cup body 110, The bracket 114, the LED chip 140 and the encapsulant 113 are provided. The holder 114 is covered by the LED package cup 100, and a portion of the surface of the holder 114 is exposed at the bottom portion 111 of the cup as a predetermined solid crystal region. The LED wafer 140 is disposed on the support 114 on the surface of the die bonding region. The encapsulant 113 is filled in the LED package cup 100 and covers the LED wafer 140. Similarly, as shown in FIG. 2A, the LED package component can include a light-emitting diode package cup 200, a holder 214, and a light-emitting diode on the cup body 210 having the glue holes 220, 230 in the form of blind holes. Wafer 240 and encapsulant 213. As shown in FIG. 3A, the LED package component can include a light emitting diode package cup 300 having a plastic via hole 320, 330 in the form of a through hole, a holder 314, and a light emitting diode chip 340. The encapsulant 313 is encapsulated.
如第1A圖所示,於一實施例中,封裝膠體113內更包括波長轉換物質115。當發光二極體晶片140(如:藍光發光二極體)藉由導線141連接至外部電源,使發光二極體晶片140發出第一波長光(如:藍光)。而波長轉換物質115可將部份發光二極體晶片140所發出第一波長光轉換成第二波長光(如:黃光),且第二波長光與其它未被波長轉換物質115轉換的第一波長光在射出封裝膠體113後可混合成為白光。同樣地,如第2A、3A圖所示,當發光二極體晶片240、340藉由導線241、341連接至外部電源, 使發光二極體晶片240、340發出第一波長光。而波長轉換物質215、315可將部份發光二極體晶片240、340所發出第一波長光轉換成第二波長光,且第二波長光與其它未被波長轉換物質215、315轉換的第一波長光在射出封裝膠體213、313後可混合成為白光。 As shown in FIG. 1A, in an embodiment, the encapsulant 113 further includes a wavelength converting substance 115. When the LED chip 140 (eg, a blue light emitting diode) is connected to an external power source through the wire 141, the LED chip 140 emits light of a first wavelength (eg, blue light). The wavelength converting substance 115 converts the first wavelength light emitted by the partial light emitting diode chip 140 into the second wavelength light (for example, yellow light), and the second wavelength light and the other wavelength converted by the wavelength converting substance 115 are not converted. A wavelength of light can be mixed into white light after exiting the encapsulant 113. Similarly, as shown in FIGS. 2A and 3A, when the LED chips 240 and 340 are connected to an external power source by wires 241 and 341, The LED wafers 240, 340 are caused to emit light of a first wavelength. The wavelength converting substances 215 and 315 can convert the first wavelength light emitted by the partial light emitting diode chips 240 and 340 into the second wavelength light, and the second wavelength light and the other wavelengths not converted by the wavelength converting substances 215 and 315. A wavelength of light can be mixed into white light after exiting the encapsulants 213, 313.
第4圖是依照本發明一實施例所繪示之一種發光二極體封裝元件410~450於溢膠後與支架400分離的示意圖。如第2B、4圖所示,支架400係連結多個杯體210上具有盲孔形式的溢膠孔220、230之發光二極體封裝杯200,其中多個發光二極體封裝杯200係以陣列形式排列。當發光二極體晶片240已設置於發光二極體封裝杯200中,並將封裝膠體213填充至發光二極體封裝杯200中,多餘的膠體270、280會留存於溢膠孔220、230中,而形成多個發光二極體封裝元件410~450。當多個發光二極體封裝元件410~450形成之後,以沖壓或切割的方式將支架400與多個發光二極體封裝元件410~450分離,以形成多個發光二極體封裝元件411~451。 FIG. 4 is a schematic diagram of a light emitting diode package component 410-450 being separated from the bracket 400 after overflowing according to an embodiment of the invention. As shown in FIGS. 2B and 4, the bracket 400 is a light-emitting diode package cup 200 having a plurality of cup holes 210 having overflow holes 220 and 230 in the form of blind holes, wherein the plurality of light-emitting diode package cups 200 are connected. Arranged in an array. When the LED chip 240 is disposed in the LED package cup 200 and the encapsulant 213 is filled into the LED package cup 200, the excess colloids 270 and 280 remain in the overflow holes 220 and 230. A plurality of light emitting diode package members 410 to 450 are formed. After the plurality of LED package components 410-450 are formed, the bracket 400 is separated from the plurality of LED package components 410-450 by stamping or cutting to form a plurality of LED package components 411~ 451.
同樣地,當支架係連結多個杯體外側具有儲存槽體的通孔形式溢膠孔之發光二極體封裝杯時,也可於發光二極體封裝元件形成之後,以沖壓或切割的方式將支架與多個發光二極體封裝元件分離,且儲存槽體也會藉此與多個發光二極體封裝元件分離。第5圖是依照本發明一實施例所繪示之另一種發光二極體封裝元件510~550於溢膠後與支架500分離的示意圖。如第3B、5圖所示,支架500係 連結多個杯體310上具有通孔形式的溢膠孔320、330之發光二極體封裝杯300。其中多個發光二極體封裝杯300係以陣列形式排列,而杯體310之外側有儲存槽體350、360包覆溢膠出口322、332。當發光二極體晶片340已設置於發光二極體封裝杯300中,並將封裝膠體313填充至發光二極體封裝杯300中,多餘的膠體370、380會經由溢膠孔320、330流至儲存槽體350、360,並留存於儲存槽體350、360中,而形成多個發光二極體封裝元件510~550。當多個發光二極體封裝元件510~550形成之後,以沖壓或切割的方式將多個發光二極體封裝元件510~550自支架500上脫離,以形成多個發光二極體封裝元件511~551,且具有膠體的儲存槽體515、516、525、526、535、536、545、546、555、556也會藉此與發光二極體封裝元件511~551分離。 Similarly, when the bracket is connected to the light-emitting diode package cup with the through-hole hole overflowing in the outer side of the plurality of cup bodies, the stamping or cutting may be performed after the light-emitting diode package component is formed. The bracket is separated from the plurality of light emitting diode package components, and the storage tank body is thereby separated from the plurality of light emitting diode package components. FIG. 5 is a schematic diagram of another LED package component 510-550 being separated from the bracket 500 after overflowing according to an embodiment of the invention. As shown in Figures 3B and 5, the stent 500 is A light emitting diode package cup 300 having a plurality of cup bodies 310 having overflow holes 320, 330 in the form of through holes is connected. The plurality of LED packages 300 are arranged in an array, and the outer sides of the cup 310 have storage tanks 350 and 360 covering the overflow outlets 322 and 332. When the LED chip 340 has been disposed in the LED package cup 300 and the encapsulant 313 is filled into the LED package cup 300, the excess colloids 370, 380 flow through the overflow holes 320, 330. The storage tanks 350 and 360 are stored in the storage tanks 350 and 360 to form a plurality of light emitting diode package components 510 to 550. After the plurality of LED packages 510-550 are formed, the plurality of LED packages 510-550 are detached from the holder 500 by stamping or cutting to form a plurality of LED packages 511. ~551, and the colloidal storage tanks 515, 516, 525, 526, 535, 536, 545, 546, 555, 556 are also separated from the LED package components 511-551.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧發光二極體封裝杯 100‧‧‧Lighting diode package cup
110‧‧‧杯體 110‧‧‧ cup body
111‧‧‧杯體底部 111‧‧‧ cup bottom
112‧‧‧封裝空間 112‧‧‧Package space
113‧‧‧封裝膠體 113‧‧‧Package colloid
114‧‧‧支架 114‧‧‧ bracket
115‧‧‧波長轉換物質 115‧‧‧ wavelength conversion substances
116‧‧‧表面 116‧‧‧ surface
120、130‧‧‧溢膠孔 120, 130‧‧‧ spilled holes
121、131‧‧‧溢膠入口 121, 131‧‧ ‧ spill entrance
140‧‧‧發光二極體 140‧‧‧Lighting diode
141‧‧‧導線 141‧‧‧ wire
170、180‧‧‧膠體 170, 180‧‧‧ colloid
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CN113659059A (en) * | 2021-07-09 | 2021-11-16 | 深圳市佑明光电有限公司 | LED lamp bead, illuminating lamp and manufacturing method of LED lamp bead |
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2014
- 2014-01-10 TW TW103101004A patent/TW201528560A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113659059A (en) * | 2021-07-09 | 2021-11-16 | 深圳市佑明光电有限公司 | LED lamp bead, illuminating lamp and manufacturing method of LED lamp bead |
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