TW201528560A - Light emitting diode package cup - Google Patents

Abstract

A light-emitting diode package cup of the present invention includes a cup body, a sealant overflow hole, and a light-emitting diode. A package space in the inner side of the cup body is configured to fill with a sealant. The sealant overflow hole has a sealant overflow entrance in the inner side of the cup body, and a part of the sealant that contacts the sealant overflow entrance flows into the sealant overflow hole so as to adjust a amount of the sealant in the package space. The light-emitting diode is disposed on the inner side of the cup body.

Description

LED package cup

The invention relates to a light emitting diode packaging technology, and in particular to a light emitting diode package cup and a light emitting diode package component which can adjust the glue amount of the encapsulant.

In the current backlight packaging process, although the amount of dispensing during packaging is controlled by the machine, it is still necessary to manually set parameters, and the parameters of each dispensing are not fixed, so that not only the time for correcting the machine parameters is required, And the amount of glue at each package is also different to some extent. If there is a person's negligence or the machine is unstable, a convex cup will appear. If the surface of the colloid expands, the surface contacts the light guide plate, resulting in uneven color of the backlight.

In the current LED package cup, the dispensing amount should be set within a precise range, otherwise the quality of each dispensing will be different, and even the glue will stick to the light guide plate due to excessive glue. Therefore, how to make the rubber surface height consistent, and does not need to spend too much time to adjust the glue amount parameters, is one of the current important research and development topics, and has become the goal of improvement in the current related fields.

One aspect of the present invention is to provide a light emitting diode package cup to solve the problems of the prior art.

In one embodiment, the LED package cup of the present invention comprises a cup body, at least one overflow hole and at least one light emitting diode. The package space inside the cup is used to fill the encapsulant. The overflow hole has an overflow inlet formed on the inner side of the cup body, so that a part of the encapsulant contacting the overflow inlet flows into the overflow hole, thereby adjusting the amount of the encapsulation glue in the package space. The light emitting diode is disposed on the inner side of the cup body.

In an embodiment, the overflow hole is a blind hole having a blind hole tail end, and a vertical distance from the glue inlet to the bottom of the cup body is greater than a vertical distance from the tail end of the blind hole to the bottom of the cup body, so that the glue is contacted. A portion of the encapsulant system at the inlet flows into the blind hole and remains in the blind hole.

In one embodiment, the overflow hole is a through hole having an overflow outlet formed on the outer side of the cup, and a vertical distance from the overflow inlet to the bottom of the cup is greater than a vertical distance from the overflow outlet to the bottom of the cup, so that A portion of the encapsulant that is in contact with the overflow inlet is allowed to flow out of the overflow outlet.

In one embodiment, the LED package cup further comprises at least one storage tank body disposed on the outer side of the cup body and covering the overflow outlet, so that a part of the encapsulant contacting the overflow inlet flows out from the overflow outlet to the overflow outlet. Store the tank.

In one embodiment, the storage tank body and the cup system are formed by embossing or injection molding.

In one embodiment, the reservoir system can be detached from the tank.

In one embodiment, a portion of the encapsulant has flowed into the storage tank Thereafter, the tank can be detached from the tank for being punched or cut away from the cup.

In one embodiment, the overflow hole is formed by mechanical drilling on the cup.

In one embodiment, the LED package of the present invention comprises the LED package cup, the holder, the LED chip and the encapsulant as described above. The bracket is covered by the LED package cup, and a part of the surface of the bracket is exposed at the bottom of the cup as a predetermined solid crystal region. The light emitting diode chip is disposed on the support on the surface of the die bonding region. The encapsulant is filled in the LED package cup and covers the LED chip.

In an embodiment, the encapsulant further comprises a wavelength converting substance, which converts the first wavelength light emitted by the partial LED chip into the second wavelength light, and the second wavelength light is converted with the other wavelength conversion material. The first wavelength light can be mixed into white light after being emitted from the encapsulant.

In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the above technical solution, considerable technological progress can be achieved, and the industrial use value is widely used, and the advantage is that the rubber surface height can be consistent, and it is not necessary to spend too much time to correct the glue amount parameter.

100, 200, 300‧‧‧Light Emitting Cups

110, 210, 310‧‧‧ cups

111, 211, 311‧‧‧ cup bottom

112, 212, 312‧‧‧ package space

113,213,313‧‧‧Package colloid

114, 214, 314, 400, 500‧‧‧ bracket

115, 215, 315‧ ‧ wavelength conversion substances

116, 216, 316‧‧‧ surface

120, 130, 220, 230, 320, 330‧‧ ‧ plastic holes

121, 131, 221, 231, 321, 331 ‧ ‧ overflow entrance

140, 240, 340‧‧‧Lighting diodes

141, 241, 341‧‧‧ wires

170, 180, 270, 280, 370, 380‧ ‧ colloid

222, 232‧‧ ‧ blind hole end

322, 332‧‧ ‧ spilled rubber exports

350, 360, 515, 516, 525, 526, 535, 536, 545, 546, 555, 556‧‧‧ storage tank

410~450, 411~451, 510~550, 511~551‧‧‧Light emitting diode package components

D1, D2, D3, D4‧‧‧ vertical distance

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; A cross-sectional view of the front side of the glue; FIG. 1B is a light-emitting diode package cup according to the first embodiment of the present invention. 2A is a schematic cross-sectional view of a light-emitting diode package cup according to a second embodiment of the present invention before overflowing; and FIG. 2B is a light-emitting diode package according to a second embodiment of the present invention; FIG. 3A is a schematic cross-sectional view of a light-emitting diode package cup according to a third embodiment of the present invention before overflowing; and FIG. 3B is a light-emitting diode according to a third embodiment of the present invention; FIG. 4 is a schematic view showing a light emitting diode package component separated from a bracket after overflowing according to an embodiment of the present invention; and FIG. 5 is a schematic view of the present invention according to the present invention; Another schematic diagram of the LED package component shown in one embodiment is separated from the bracket after overflowing.

In order to make the present invention more detailed and complete, the present invention will be clearly described in the following description and detailed description. The teachings of the present invention are subject to change and modifications without departing from the spirit and scope of the invention. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessarily limiting the invention.

FIG. 1A is a schematic cross-sectional view of a light-emitting diode package cup 100 according to a first embodiment of the present invention before overflowing. As shown in FIG. 1A, the LED package cup 100 includes a cup body 110, an overflow hole 120, 130, and a light emitting diode. Polar body 140. The package space 112 inside the cup 110 is used to fill the encapsulant 113. The light emitting diode 140 is disposed inside the cup body 110. The overflow holes 120, 130 are formed on the inner side of the cup body 110, and have overflow inlets 121, 131, respectively. In one embodiment, the overflow holes 120, 130 on the cup body 110 are mechanically drilled to form a through hole, so that when the surface 116 of the encapsulant 113 contacts the overflow inlets 121, 131, the partial encapsulant 113 can be The overflow of the glue holes 120, 130 flows out to the outside of the cup body 110, thereby adjusting the amount of glue of the encapsulant 113 in the package space 112. When the encapsulant 113 is injected into the encapsulation space 112 inside the cup 110, as the encapsulation 113 is injected more and more, the surface 116 of the encapsulant 113 is also higher and higher, and since the surface 116 of the encapsulant 113 has surface tension Therefore, the surface 116 of the encapsulant 113 will have a higher central curved surface.

FIG. 1B is a cross-sectional view showing the LED package 100 of the first embodiment of the present invention after overflowing. As shown in FIG. 1B, when the encapsulant 113 is injected into the encapsulation space 112 inside the cup 110, once the surface 116 of the encapsulant 113 contacts the overflow inlets 121, 131, part of the encapsulant 113 can flow into the overflow holes 120, 130. The colloids 170, 180 flowing out of the overflow holes 120, 130 will flow out to the outside of the cup 110. Also, due to the relationship of the overflow holes 120, 130, the surface 116 of the encapsulant 113 will appear almost flat.

2A is a schematic cross-sectional view of the LED package cup 200 according to the second embodiment of the present invention before overflowing. As shown in FIG. 2A, the LED package cup 200 includes a cup body 210, overflow holes 220 and 230, and a light-emitting diode 240. The encapsulant 213 is filled in the package space inside the cup 210 212. The light emitting diode 240 is disposed inside the cup body 210. The overflow holes 220 and 230 formed on the inner side of the cup body 210 are blind holes, and the overflow glue holes 220 have a glue overflow inlet 221 and a blind hole tail end 222, and the overflow rubber hole 230 has a glue overflow inlet 231 and a blind hole tail end 232. In one embodiment, the overflow holes 220, 230 on the cup body 210 are mechanically drilled to form a blind hole, so that when the surface 216 of the encapsulant 213 contacts the overflow inlets 221, 231, the partial encapsulant 213 can be The inflow into the overflow holes 220, 230 is retained, thereby adjusting the amount of glue of the encapsulant 113 in the package space 112. The overflow glue inlets 221, 231 to the blind hole ends 222, 232 have an inclination. Taking the overflow hole 220 as an example, the vertical distance D2 of the overflow inlet 221 to the bottom 211 of the cup is greater than the vertical distance D1 of the blind end 222 to the bottom 211 of the cup.

FIG. 2B is a schematic cross-sectional view of the LED package cup 200 according to the second embodiment of the present invention after overflowing. As shown in FIG. 2B, when the encapsulant 213 is injected into the package space 212 inside the cup 210, once the surface 216 of the encapsulant 213 contacts the overflow inlets 221 and 231, a portion of the encapsulant 213 can flow into the overflow hole 220. 230. Since a part of the encapsulant 213 flows into the overflow holes 220 and 230 from the overflow inlets 221 and 231, the colloids 270 and 280 remain in the overflow holes 220 and 230. The surface 216 of the original encapsulant 213 has a surface tension and exhibits a centrally higher curved surface (as shown in FIG. 2A). Since the overflow holes 220 and 230 provide a passage through which the encapsulant 213 can flow, the surface of the encapsulant 213 is provided. 216 will appear almost flat (as shown in Figure 2B).

FIG. 3A is a schematic cross-sectional view of the LED package cup 300 according to the third embodiment of the present invention before overflowing. As shown in Figure 3A, the light is two The polar package cup 300 includes a cup body 310, overflow holes 320, 330, and a light emitting diode 340. The encapsulant 313 is filled in the encapsulation space 312 inside the cup 310. The light emitting diode 340 is disposed inside the cup 310. The overflow holes 320 and 330 formed on the inner side of the cup body 310 are through holes. The overflow metal holes 320 have an overflow inlet 321 and an overflow outlet 322, and the overflow holes 330 have an overflow inlet 331 and an overflow outlet 332. In one embodiment, the overflow holes 320, 330 are mechanically drilled to form through holes on the cup 310, so that when the surface 316 of the encapsulant 313 contacts the overflow inlets 321, 331, part of the encapsulant 313 can flow in. The glue holes 320, 330 are used to adjust the amount of glue of the encapsulant 313 in the package space 312. The overflow inlets 321 and 331 to the overflow outlets 322 and 332 have an inclination to allow a portion of the encapsulant 313 contacting the overflow inlets 321, 331 to flow out of the overflow outlets 322, 332. Taking the overflow hole 320 as an example, the vertical distance D4 of the overflow inlet 321 to the bottom 311 of the cup is greater than the vertical distance D3 of the overflow outlet 322 to the bottom 311 of the cup.

In one embodiment, the LED package cup 300 further includes storage tanks 350 and 360 disposed on the outer side of the cup 310 and respectively covering the overflow outlets 322 and 332 so as to contact the overflow inlet 321 The encapsulant 313 flows out of the overflow outlet 322 to the storage tank 350, and a portion of the encapsulant 313 that contacts the overflow inlet 331 flows out of the overflow outlet 332 to the storage tank 360.

FIG. 3B is a cross-sectional view of the LED package cup 300 according to the third embodiment of the present invention after overflowing. As shown in FIG. 3B, when the encapsulant 313 is injected into the package space 312 inside the cup 310, once the surface 316 of the encapsulant 313 contacts the overflow inlets 321, 331, the package is partially packaged. The colloid 313 can flow into the overflow holes 320, 330 from the overflow inlets 321 and 331, and the colloids 370, 380 will flow out from the overflow outlets 322, 332 to the storage tanks 350, 360. The surface 316 of the original encapsulant 313 has a surface tension and exhibits a centrally higher curved surface (as shown in FIG. 3A). Since the overflow holes 320, 330 provide a passage through which the encapsulant 313 can flow, the surface of the encapsulant 313 is provided. 316 will appear almost flat (as shown in Figure 3B).

As shown in FIGS. 3A and 3B, in one embodiment, the storage tanks 350, 360 and the cup 310 are formed by three-dimensional printing or injection molding. The three-dimensional printing system uses a stereo lithography apparatus to input a design drawing to create a three-dimensional physical object. The working principle is that the designer uses a computer-aided design software to design an article, and then the electronic file of the design drawing. Transfer to a three-dimensional printing device. After reading the file, the three-dimensional printing device disassembles the designed three-dimensional figure into a multi-layer two-dimensional sectional view, and then prints each layer in order and superimposedly.

In one embodiment, the storage tanks 350, 360 are detachable from the tank. When the encapsulant 313 is injected into the encapsulation space 312 inside the cup 310 and the surface 316 contacts the overflow inlets 321 and 331 , a part of the encapsulant 313 flows into the overflow holes 320 , 330 , and flows into the overflow holes from the overflow inlets 321 , 331 . 320, 330, and the colloids 370, 380 will flow out of the overflow outlets 322, 332 to the storage tanks 350, 360. The excess colloids 370, 380 of the encapsulant 313 filled in the encapsulation space 312 can be removed by detaching the storage tanks 350, 360 from the outside of the cup 310. In one embodiment, after a portion of the encapsulant 313 has flowed into the storage tanks 350, 360, the storage tanks 350, 360 can be stamped or cut away from the cup 310.

The light-emitting diode package cup as described above can be used for a light-emitting diode package component. For example, as shown in FIG. 1A, in an embodiment, the LED package component of the present invention comprises a light-emitting diode package cup 100 having a glue hole 120, 130 on the cup body 110, The bracket 114, the LED chip 140 and the encapsulant 113 are provided. The holder 114 is covered by the LED package cup 100, and a portion of the surface of the holder 114 is exposed at the bottom portion 111 of the cup as a predetermined solid crystal region. The LED wafer 140 is disposed on the support 114 on the surface of the die bonding region. The encapsulant 113 is filled in the LED package cup 100 and covers the LED wafer 140. Similarly, as shown in FIG. 2A, the LED package component can include a light-emitting diode package cup 200, a holder 214, and a light-emitting diode on the cup body 210 having the glue holes 220, 230 in the form of blind holes. Wafer 240 and encapsulant 213. As shown in FIG. 3A, the LED package component can include a light emitting diode package cup 300 having a plastic via hole 320, 330 in the form of a through hole, a holder 314, and a light emitting diode chip 340. The encapsulant 313 is encapsulated.

As shown in FIG. 1A, in an embodiment, the encapsulant 113 further includes a wavelength converting substance 115. When the LED chip 140 (eg, a blue light emitting diode) is connected to an external power source through the wire 141, the LED chip 140 emits light of a first wavelength (eg, blue light). The wavelength converting substance 115 converts the first wavelength light emitted by the partial light emitting diode chip 140 into the second wavelength light (for example, yellow light), and the second wavelength light and the other wavelength converted by the wavelength converting substance 115 are not converted. A wavelength of light can be mixed into white light after exiting the encapsulant 113. Similarly, as shown in FIGS. 2A and 3A, when the LED chips 240 and 340 are connected to an external power source by wires 241 and 341, The LED wafers 240, 340 are caused to emit light of a first wavelength. The wavelength converting substances 215 and 315 can convert the first wavelength light emitted by the partial light emitting diode chips 240 and 340 into the second wavelength light, and the second wavelength light and the other wavelengths not converted by the wavelength converting substances 215 and 315. A wavelength of light can be mixed into white light after exiting the encapsulants 213, 313.

FIG. 4 is a schematic diagram of a light emitting diode package component 410-450 being separated from the bracket 400 after overflowing according to an embodiment of the invention. As shown in FIGS. 2B and 4, the bracket 400 is a light-emitting diode package cup 200 having a plurality of cup holes 210 having overflow holes 220 and 230 in the form of blind holes, wherein the plurality of light-emitting diode package cups 200 are connected. Arranged in an array. When the LED chip 240 is disposed in the LED package cup 200 and the encapsulant 213 is filled into the LED package cup 200, the excess colloids 270 and 280 remain in the overflow holes 220 and 230. A plurality of light emitting diode package members 410 to 450 are formed. After the plurality of LED package components 410-450 are formed, the bracket 400 is separated from the plurality of LED package components 410-450 by stamping or cutting to form a plurality of LED package components 411~ 451.

Similarly, when the bracket is connected to the light-emitting diode package cup with the through-hole hole overflowing in the outer side of the plurality of cup bodies, the stamping or cutting may be performed after the light-emitting diode package component is formed. The bracket is separated from the plurality of light emitting diode package components, and the storage tank body is thereby separated from the plurality of light emitting diode package components. FIG. 5 is a schematic diagram of another LED package component 510-550 being separated from the bracket 500 after overflowing according to an embodiment of the invention. As shown in Figures 3B and 5, the stent 500 is A light emitting diode package cup 300 having a plurality of cup bodies 310 having overflow holes 320, 330 in the form of through holes is connected. The plurality of LED packages 300 are arranged in an array, and the outer sides of the cup 310 have storage tanks 350 and 360 covering the overflow outlets 322 and 332. When the LED chip 340 has been disposed in the LED package cup 300 and the encapsulant 313 is filled into the LED package cup 300, the excess colloids 370, 380 flow through the overflow holes 320, 330. The storage tanks 350 and 360 are stored in the storage tanks 350 and 360 to form a plurality of light emitting diode package components 510 to 550. After the plurality of LED packages 510-550 are formed, the plurality of LED packages 510-550 are detached from the holder 500 by stamping or cutting to form a plurality of LED packages 511. ~551, and the colloidal storage tanks 515, 516, 525, 526, 535, 536, 545, 546, 555, 556 are also separated from the LED package components 511-551.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Lighting diode package cup

110‧‧‧ cup body

111‧‧‧ cup bottom

112‧‧‧Package space

113‧‧‧Package colloid

114‧‧‧ bracket

115‧‧‧ wavelength conversion substances

116‧‧‧ surface

120, 130‧‧‧ spilled holes

121, 131‧‧ ‧ spill entrance

140‧‧‧Lighting diode

141‧‧‧ wire

170, 180‧‧‧ colloid

Claims (10)

A light-emitting diode package cup comprising: a cup body, one of the inner packaging spaces for filling an encapsulant; and at least one overflow hole having an overflow inlet formed on the inner side of the cup for contacting the A portion of the glue inlet enters the overflow hole to adjust the amount of glue of the encapsulant in the package space; and at least one light emitting diode is disposed on the inner side of the cup. The light-emitting diode package cup according to claim 1, wherein the overflow hole is a blind hole, and has a blind hole tail end, and a vertical distance of the overflow glue inlet to the bottom of the cup body is greater than the blind hole tail The vertical distance from the end to the bottom of the cup causes the portion of the encapsulant system that contacts the overflow inlet to flow into the blind hole and remain in the blind hole. The light-emitting diode package cup according to claim 1, wherein the overflow hole is a through hole, and an overflow outlet is formed on an outer side of the cup, and a vertical distance of the overflow inlet to a bottom of the cup is obtained. A vertical distance greater than the overflow of the overflow outlet to the bottom of the cup allows the encapsulant to contact the overflow outlet from the overflow outlet. The illuminating diode package cup according to claim 3, further comprising: at least one storage tank body disposed on the outer side of the cup body and covering the overflow glue The outlet is such that a portion of the encapsulant that contacts the overflow inlet flows from the overflow outlet to the storage tank. The light-emitting diode package cup according to claim 4, wherein the storage tank body and the cup system are formed by stereo printing or injection molding. The light-emitting diode package cup according to claim 5, wherein the storage tank system is detachable from the tank body. The illuminating diode package cup of claim 6, wherein the detachable groove body is used to be punched or cut away from the cup after a portion of the encapsulant has flowed into the storage tank. The light-emitting diode package cup according to claim 1, wherein the overflow hole is formed by mechanical drilling on the cup. A light emitting diode package component comprising: the light emitting diode package cup according to any one of claims 1 to 8; a holder covered by the light emitting diode package cup, and in the cup a portion of the surface of the body is exposed as a predetermined die-bonding region; a light-emitting diode chip is disposed on the surface of the surface of the die-bonding region; and an encapsulant is filled in the light-emitting diode The cup is enclosed in the cup and covers the light emitting diode chip. The light-emitting diode package component of claim 9, wherein the package body further comprises a wavelength conversion substance, wherein a portion of the light emitted by the LED chip is converted into a second wavelength light. And the second wavelength light and the other first wavelength light not converted by the wavelength conversion substance may be mixed into white light after being emitted from the encapsulant.