TW201523937A - LED thin film circuit board and decorating material - Google Patents

Abstract

A light emitting diode circuit board and a decorating material are provided. The decorating material includes a substrate and an LED film board disposed thereon. The LED film board includes a film, a first metal line, a second metal line, and plurality LEDs. The film has a first edge and a second edge opposite each other and an inner portion between the first and second edges. The first metal lines is disposed on the first and second edges while the second metal line connected to the first metal line is extended into the inner portion, wherein a resistance of the first metal line is lower than that of the second metal line. The LEDs are disposed on and electrically connected to the second metal line.

Description

Light-emitting diode film circuit board and decorative materials

The present invention relates to a circuit board and a decorative material, and more particularly to a light-emitting diode thin film circuit board having uniform brightness and a decorative material using the light-emitting diode thin film circuit board.

The light-emitting diode has advantages such as long life, small volume, high shock resistance, low heat generation, and low power consumption, and thus has been widely used as an indicator or a light source in households and various devices. In recent years, light-emitting diodes have developed toward high power, so their applications have expanded to road lighting, large outdoor billboards, traffic lights and related fields.

Generally, the light-emitting diode light source module is configured such that a plurality of light-emitting diode wafers are arranged in a matrix on a substrate. However, the conductive impedance of the conductive line disposed on the substrate for transmitting power is proportional to the length of the conductive line, so inevitably, the impedance of the conductive line near the input end of the power source is less than that of the conductive input terminal. The impedance of the line may cause uneven brightness of the light-emitting diode of the light-emitting diode light source module.

When used in applications where the light-emitting area is small, for example, as a backlight for a display panel The source may be less likely to find uneven brightness of the light-emitting diode or achieve uniform brightness through other auxiliary objects. Or, when applied to fields such as road lighting, large outdoor billboards, or traffic lights, the number of single-use LEDs is not large, and the illumination is concentrated in a certain area, so the brightness is Uniformity requirements are lower.

The present invention provides a light-emitting diode thin film circuit board which can make the light-emitting luminance of the light-emitting diode uniform.

The present invention provides a decorative material in which the light emitting diode has a uniform light emitting luminance.

The light emitting diode thin film circuit board of the present invention comprises a film substrate, a first conductive metal wire, a second conductive metal wire and a plurality of light emitting diodes. The film substrate has opposite first side edges, second side edges, and inner regions between the first side edges and the second side edges, and the first conductive metal lines are disposed on the first side edges and the second side edges. The second conductive metal line is connected to the first conductive metal line and extends from the first conductive metal line in the inner region, wherein the material of the first conductive metal line is different from the material of the second conductive metal line, and the first conductive metal line The impedance is lower than the impedance of the second conductive metal line. The light emitting diode is disposed on the second conductive metal line and electrically connected to the second conductive metal line.

The decorative material of the present invention comprises a substrate and the above-mentioned light-emitting diode thin film circuit board, wherein the above-mentioned light-emitting diode thin film circuit board is disposed on the substrate

In an embodiment of the light emitting diode thin film circuit board or the decorative material of the present invention, the second conductive metal wire is disposed between the first conductive metal wire and the film substrate.

In an embodiment of the light emitting diode thin film circuit board or decorative material of the present invention, wherein the thickness of the first conductive metal wire is greater than the thickness of the second conductive metal wire, or the width of the first conductive metal wire is greater than the second conductive metal The width of the line.

In an embodiment of the light-emitting diode thin film circuit board or decorative material of the present invention, wherein the first conductive metal wire is a copper foil or an aluminum foil.

In an embodiment of the light-emitting diode thin film circuit board or decorative material of the present invention, the second conductive metal wire of the light-emitting diode thin film circuit board is silver glue or carbon glue.

In an embodiment of the light-emitting diode thin film circuit board or decorative material of the present invention, the material of the film substrate is polyethylene terephthalate (Polyester, PET), polycarbonate (Polycarbonate, PC), poly Polyimide (PI) or a combination thereof.

In an embodiment of the light-emitting diode thin-film circuit board or the decorative material of the present invention, the light-emitting diode thin-film circuit board further includes an insulating layer covering the film substrate, the first conductive metal wire and the second Above the conductive metal line, the light emitting diode is exposed from the insulating layer.

In an embodiment of the decorative material of the present invention, wherein the substrate is glass or wallpaper.

Based on the above, the arrangement of the conductive metal wires of the light-emitting diode thin film circuit board of the present invention is different from the configuration of the conductive lines of the conventional light-emitting diode light source module. The arrangement method can improve the brightness unevenness of the light-emitting diode when used in a large area, and thus the light-emitting diode film circuit board can be further applied to the decorative material for large-area decoration, and the light-emitting diode is expanded. The application of the body.

The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧Light Diode Thin Film Board

110‧‧‧film substrate

112‧‧‧ first side

114‧‧‧Second side

116‧‧‧Internal area

120‧‧‧First conductive metal wire

130‧‧‧Second conductive metal wire

140‧‧‧Lighting diode

150‧‧‧Insulation

160‧‧‧Fixed parts

300‧‧‧Decorative materials

200‧‧‧Substrate

R1~R10‧‧‧ equivalent resistance

1 is a partially exploded perspective view of a light emitting diode thin film circuit board according to an embodiment of the present invention.

Figure 2 is a schematic view of the line A-A of Figure 1.

3 to 5 are circuit diagrams of a light-emitting diode thin film circuit board.

6 to 8 are schematic structural views of a light-emitting diode thin film circuit board.

FIG. 9 is a schematic view showing a light-emitting diode thin film circuit board applied to a decorative material as a decoration.

Fig. 10A is a schematic view showing that a first conductive metal wire is formed on a film substrate in a bent manner.

FIG. 10B is a schematic view showing the first conductive metal wire being fixed to the film substrate by a fixing member in a perforation manner.

1 is a partial view of a light-emitting diode thin film circuit board according to an embodiment of the invention Fig. 2 is a schematic view of the A-A section line of Fig. 1. Referring to FIG. 1 and FIG. 2 , the LED substrate 100 includes a film substrate 110 , a first conductive metal line 120 , a second conductive metal line 130 , and a plurality of LEDs 140 . The film substrate 110 has opposite first side edges 112, second side edges 114, and inner regions 116 between the first side edges 112 and the second side edges 114, and the first conductive metal lines 120 are disposed on the first side edges. 112 and the second side 114. The second conductive metal line 130 is connected to the first conductive metal line 120 and extends from the first conductive metal line 120 in the inner region 116 , wherein the material of the first conductive metal line 120 is different from the material of the second conductive metal line 130 , and The impedance of the first conductive metal line 120 is lower than the impedance of the second conductive metal line 130. The light emitting diode 140 is disposed on the second conductive metal line 130 and electrically connected to the second conductive metal line 130.

In this embodiment, the material of the film substrate 110 may be made of poly-p-phenylene Either one or a combination of polyethylene terephthalate (Polyester, PET), polycarbonate (Polycarbonate, PC) or polyimide (PI) is made transparent or transparent, and is selected according to actual needs.

In the above, the second conductive metal line 130 is, for example, silver glue or carbon glue, which can be The first conductive metal wire 120 is a copper foil or an aluminum foil, and the conductive metal wire 120 can be attached, bent (as shown in FIG. 10A ), coated, and coated with a conductive adhesive. The fixing member 160 is riveted in a perforated manner (as shown in FIG. 10B). The second conductive metal line 130 formed on the film substrate 110 by printing may be disposed between the first conductive metal line 120 and the film substrate 110. It should be noted that the impedance of the first conductive metal line 120 of this embodiment is lower than that of the second conductive The manner of the impedance of the metal line 130 is selected in addition to the materials of the first conductive metal line 120 and the second conductive metal line 130, and the thickness of the first conductive metal line 120 is greater than the second conductive The thickness of the metal line 130, or the width of the first conductive metal line 120 is greater than the width of the second conductive metal line 130, or the thickness and width of the first conductive metal line 120 are greater than the thickness and width of the second conductive metal line 130. .

In detail, as described in the prior art, the impedance will follow the conductive metal line The length is proportional to, but by the formula of the resistance: ρ = Rs / l, where ρ is the equivalent resistance (that is, the impedance), l is the length of the material, s is the area, it is known that the impedance is inversely proportional to the area of the conductive metal wire Therefore, it is considered that the distance between the second conductive metal line 130 and the power input end is longer, and the thickness and/or width of the first conductive metal line 120 is greater than the thickness and/or width of the second conductive metal line 130. Considering that the impedance of the first conductive metal line 120 can be reduced, and the impedance between the second conductive metal line 130 and the power input end is made as close as possible, so that the light-emitting brightness of each of the light-emitting diodes 140 is the same or similar. The light-emitting diode thin film circuit board 100 is made to have uniform illumination.

In addition, the light emitting diode thin film circuit board 100 may further include a film covering the film. The insulating layer 150 over the substrate 110, the first conductive metal lines 120 and the second conductive metal lines 130, and the light emitting diodes 140 are exposed from the insulating layer 150. The arrangement of the insulating layer 150 can prevent the first conductive metal line 120 or the second conductive metal line 130 from being short-circuited by contact with other potentially conductive articles or dust particles in the air, thereby affecting the normal operation of the light-emitting diode thin film circuit board 100.

The matching of the first conductive metal line 120 and the second conductive metal line 130 described above The arrangement may be that the light emitting diodes 140 are connected in series by the second conductive metal lines 130, and the first conductive metal lines 120 connect the series circuits in parallel, as shown in FIG. Alternatively, the first conductive metal line 120 and the second conductive metal line 130 may be disposed in a manner that the light emitting diodes 140 are connected in parallel by the second conductive metal lines 130, and the first conductive metal lines 120 connect the parallel conductive circuits. Connected in parallel, as shown in Figure 4. Through such a setting, the equivalent resistances R1 to R10 have the following relationship: R1 + R10 is equal to R2 + R9 is equal to R3 + R8 is equal to R4 + R7 is equal to R5 + R6. Of course, the first conductive metal line 120 and the second conductive metal line 130 may be arranged in a manner that the light-emitting diodes 140 are simultaneously connected in series or in parallel by the second conductive metal lines 130, and the first conductive metal lines 120 are further These circuits are connected in parallel as shown in FIG. In such a setting manner, the equivalent resistances R1 to R8 have the following relationship: R1 + R5 is equal to R2 + R6 is equal to R3 + R7 is equal to R4 + R8. The actual arrangement of the LEDs 140, the first conductive metal lines 120 and the second conductive metal lines 130 of the LED thin film circuit board 100 may be as shown in FIG. 6 to FIG. 8. It should be noted that FIG. 6~ The configuration of FIG. 8 is for illustrative purposes only and does not fully cooperate with the circuit modes of FIGS. 3 to 5.

FIG. 9 is a diagram of applying the above-mentioned light-emitting diode thin film circuit board to a decorative material. The schematic is used as a decoration. Referring to FIG. 7 , FIG. 8 and FIG. 9 , the decorative material 300 includes a substrate 200 and the above-mentioned light emitting diode thin film circuit board 100 , and the above-mentioned light emitting diode thin film circuit board 100 is disposed on the substrate 200 , and The substrate 200 of the present embodiment is glass, but when applied to the field of decoration, the substrate 200 may also be a wallpaper, a wall or other possible items, and is not limited to the contents described in the embodiment.

Please refer to FIG. 1 and FIG. 9 simultaneously, and the LED thin film circuit board 100 can be It is used as a decoration in the glass window embedded in the wall. And when the above-described light-emitting diode thin film circuit board 100 is applied to the decorative material 300 for large-area arrangement, each of the light-emitting diodes is made by making the impedance between the second conductive metal wire 130 and the power input terminal similar. The body 140 has the same or similar luminance of illumination to provide uniform illumination of the LED thin film circuit board 100. Incidentally, the LEDs on the LED thin film circuit board 100 can be fully bright, partially bright, or completely dark at the same time by the control of the circuit, and can be controlled by circuit control. The pattern is bright. In this way, not only can the home environment be decorated by the pattern, but also the light source of the home environment can be used while all the light-emitting diodes 140 are fully illuminated.

In summary, the light emitting diode thin film circuit board of the present invention is guided by the first The electric metal wire and the second conductive metal wire are made of different materials and have different impedances, and are further matched with the arrangement of the individual structures to achieve a similar impedance between the second conductive metal wire and the power input end when inputting power. Further, the light-emitting diode thin film circuit board has uniform brightness. The application of the LED film circuit board in the decorative material can not only be used to decorate the indoor environment, but also enhance the taste of the home by pattern, and can also be used as a home when all the LEDs are fully illuminated. The source of the environment.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Light Diode Thin Film Board

110‧‧‧film substrate

112‧‧‧ first side

114‧‧‧Second side

116‧‧‧Internal area

120‧‧‧First conductive metal wire

130‧‧‧Second conductive metal wire

140‧‧‧Lighting diode

Claims (18)

A light-emitting diode thin-film circuit board comprising: a film substrate having a first side, a second side, and an inner region between the first side and the second side; a first conductive metal line disposed on the first side and the second side; a second conductive metal line connected to the first conductive metal line and extending from the first conductive metal line to the inner area The material of the first conductive metal wire is different from the material of the second conductive metal wire, and the impedance of the first conductive metal wire is lower than the impedance of the second conductive metal wire; and the plurality of light emitting diodes, The second conductive metal wire is disposed on the second conductive metal wire and electrically connected to the second conductive metal wire. The light-emitting diode thin-film circuit board of claim 1, wherein the second conductive metal wire is disposed between the first conductive metal wire and the film substrate. The illuminating diode thin film circuit board of claim 1, wherein the first conductive metal wire has a thickness greater than a thickness of the second conductive metal wire. The light emitting diode thin film circuit board of claim 1, wherein a width of the first conductive metal wire is greater than a width of the second conductive metal wire. The light-emitting diode thin film circuit board of claim 1, wherein the first conductive metal wire is a copper foil or an aluminum foil. The light-emitting diode thin film circuit board of claim 1, wherein the second conductive metal wire is silver glue or carbon glue. The light-emitting diode thin film circuit board of claim 1, wherein the film substrate is made of polyethylene terephthalate, polycarbonate, polyimine or a combination thereof. The light-emitting diode thin-film circuit board of claim 1, wherein the circuit connections of the light-emitting diodes are series, parallel or series-parallel. The illuminating diode thin film circuit board of claim 1, further comprising an insulating layer covering the film substrate, the first conductive metal wire and the second conductive metal wire, and the illuminating The diode is exposed from the insulating layer. A decorative material comprising: a substrate; a light-emitting diode film circuit board disposed on the substrate, comprising: a film substrate having a first side, a second side, and the first side An inner region between the one side and the second side; a first conductive metal line disposed on the first side and the second side; a second conductive metal line, and the first conductive The metal wires are connected and extend from the first conductive metal wire in the inner region, wherein the material of the first conductive metal wire is different from the material of the second conductive metal wire, and the impedance of the first conductive metal wire is lower than An impedance of the second conductive metal line; and a plurality of light emitting diodes disposed on the second conductive metal line and electrically connected to the second conductive metal line. The decorative material according to claim 10, wherein the second conductive material The metal wire is disposed between the first conductive metal line and the film substrate. The decorative material according to claim 10, wherein the thickness of the first conductive metal wire is greater than the thickness of the second conductive metal wire. The decorative material of claim 10, wherein the width of the first conductive metal wire is greater than the width of the second conductive metal wire. The decorative material according to claim 10, wherein the first conductive metal wire is a copper foil or an aluminum foil. The decorative material according to claim 10, wherein the second conductive metal wire of the light emitting diode thin film circuit board is silver glue or carbon glue. The decorative material according to claim 10, wherein the film substrate is made of polyethylene terephthalate, polycarbonate, polyimine or a combination thereof. The light-emitting diode thin-film circuit board further includes an insulating layer covering the film substrate, the first conductive metal wire and the second conductive metal wire, and the decorative material according to claim 10, The light emitting diodes are exposed from the insulating layer. The decorative material according to claim 10, wherein the substrate is glass or wallpaper.