TW201522541A - Curable composition, method for manufacturing cured film, cured film, and display device - Google Patents

Abstract

A curable composition capable of achieving high hardness even if heated at a low temperature is provided, and a method for manufacturing a cured film by using the curable composition, a cured film, and an organic EL display device and a liquid crystal display device using the cured film are provided. The curable composition is characterized by including a polymerizable compound having an ethylenically unsaturated bond, a polymerization initiator, an alkoxysilane compound, and an organic solvent, wherein a ratio of an urethane (meth)acrylate having 6 or more functions is 70 to 100 mass% in a solid component of a total solid component of the composition excluding the inorganic matter.

Description

Curing composition, method for producing cured film, cured film, and display Device

The present invention relates to a curable composition, a method for producing a cured film, a cured film, and an organic electroluminescence (EL) display device and a liquid crystal display device using the cured film.

A flat panel display such as a liquid crystal display device or an organic EL display device is widely used. Recently, in the manufacturing steps of these displays, it is necessary to reduce the heating temperature of various cured films in the manufacturing process from the viewpoint of reducing damage to the substrate, the circuit, and the like, and energy saving.

As such a curable composition, for example, Patent Document 1 discloses a thermosetting resin composition characterized in that it is an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride or an epoxy group-containing radical. The polymerizable compound and a copolymer of a monoolefin-based unsaturated compound are dissolved in an organic solvent.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 6-157716

However, the heating temperature of the curable composition described in Patent Document 1 must be 200° C. or more, and if it is heated at a low temperature (for example, 180° C. or lower and further 150° C. or lower), sufficient hardness cannot be obtained.

An object of the present invention is to solve the above problems, and an object thereof is to provide a curable composition which can obtain high hardness even when heated at a low temperature. Further, an object of the present invention is to provide a method for producing a cured film using the curable composition, a cured film, and an organic EL display device and a liquid crystal display device using the cured film.

The above problems of the present invention are solved by the means described in <1>, <7>, <10>, <13> or <14> below. Hereinafter, it will be described together with <2> to <6>, <8>, <9>, <11>, and <12> as preferred embodiments.

<1> A curable composition comprising (A) a polymerizable compound having an ethylenically unsaturated bond, (B) a polymerization initiator, (C) an alkoxydecane compound, and (D) an organic compound In the solid component excluding the inorganic substance in the total solid content of the composition, the ratio of the hexafunctional or higher (meth)acrylic acid urethane is 70% by mass to 100% by mass; <2> such as <1> The curable composition described further contains (E) inorganic particles; The hardening composition as described in <1> or <2>, wherein (B) the polymerization initiator contains an oxime ester compound, and <4> as described in any one of <1> to <3>. a curable composition, wherein (A) the polymerizable compound having an ethylenically unsaturated bond contains a polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane; <5> The curable composition according to any one of <1> to <4>, wherein the curable composition according to any one of <1> to <5> And a method of producing a cured film according to any one of <1> to <6>, wherein the step of applying the curable composition according to any one of <1> to <6> to a substrate (2) a step of removing a solvent from the applied curable composition; and (3) a step of performing thermal curing; <8> a method for producing a cured film according to <7>, wherein (3) The method of producing a cured film as described in <7> or <8>, wherein (2) the step of removing the solvent, and (3) the heat is performed. hardening Before the step, the step of performing the full exposure is performed; <10> a cured film obtained by hardening the curable composition according to any one of <1> to <6>; <11> such as <10> a cured film as described, which is a protective film; <12> The cured film according to <10> or <11>, wherein the pencil hardness at a load of 750 g measured according to Japanese Industrial Standard (JIS) K5600 is 2H or more; <13> an organic EL display The cured film according to any one of <10> to <12>, wherein the cured film according to any one of <10> to <12>.

According to the present invention, it is possible to provide a curable composition which can obtain high hardness even when heated at a low temperature. Further, a method for producing a cured film using the curable composition, a cured film, and an organic EL display device and a liquid crystal display device using the cured film can be provided.

1, 16, 440‧‧‧ TFT (thin film transistor)

2‧‧‧Wiring

3, 8, 280, 420‧‧ ‧ insulating film

4‧‧‧Flat film

5‧‧‧First electrode

6, 14, 15‧ ‧ glass substrate

7, 18, 282‧ ‧ contact holes

10‧‧‧Liquid crystal display device

12‧‧‧Backlight unit

17‧‧‧ hardened film

19‧‧‧ITO transparent electrode

20‧‧‧LCD

22, 122, 330‧‧‧ color filters

110‧‧‧ pixel substrate

111, 127‧‧‧ polarizing plate

112, 123‧‧‧ Transparent substrate

113, 370‧‧‧ common electrode

114‧‧‧Insulation

115‧‧‧ pixel electrodes

116, 121‧‧‧ alignment film

120‧‧‧ opposite substrate

124‧‧‧ phase difference film

125‧‧‧Detector electrodes for sensors

126‧‧‧Next layer

130‧‧‧Sensor Department

140, 400‧‧‧ liquid crystal layer

200‧‧‧lower display panel

210‧‧‧1st insulating substrate

220‧‧‧gate electrode

240‧‧‧gate insulating film

250‧‧‧Semiconductor layer

260, 262‧ ‧ ohmic contact layer

270‧‧‧ source electrode

272‧‧‧汲electrode

290‧‧‧Image electrode

300‧‧‧Upper display panel

310‧‧‧2nd insulating substrate

320‧‧‧ shading members

410‧‧‧Sensor electrode

430‧‧‧ drive electrode

1 is a schematic cross-sectional view showing an example of an organic EL display device, and shows a schematic cross-sectional view of a substrate in a bottom emission type organic EL display device, and has a planarizing film 4.

2 is a conceptual view showing an example of a liquid crystal display device, and shows a schematic cross-sectional view of an active matrix substrate in a liquid crystal display device, and has a cured film 17 as an interlayer insulating film.

FIG. 3 is a conceptual view showing an example of a liquid crystal display device having a touch panel function.

4 is a conceptual view showing a configuration of another example of a liquid crystal display device having a touch panel function.

Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be carried out in accordance with a representative embodiment of the present invention, but the present invention is not limited to such an embodiment. In the specification of the present application, "~" is used in the sense that the numerical values described before and after are included as the lower limit and the upper limit. Further, the term "organic EL element" in the present invention means an organic electroluminescence element.

In the expression of the group (atomic group) in the present specification, the substituted and unsubstituted expressions are not described as including a group having no substituent (atomic group), and also a group having a substituent (atomic group). For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

In the present specification, "(meth)acrylate" means acrylate and methacrylate, "(meth)acrylic" means acrylic acid and methacrylic acid, and "(meth)acryloyl group" means propylene oxime. And methacryl oxime.

In the present invention, "% by mass" and "% by weight" have the same meaning, and "parts by mass" and "parts by weight" have the same meaning.

Further, in the present invention, the combination of the preferred aspects is more preferable.

In the present invention, the molecular weight of the (A) polymerizable compound having an ethylenically unsaturated bond is determined by electrospray ionization-mass spectrometry (ESI-MS). In addition, about poly The molecular weight of the composition is a polystyrene-equivalent weight average molecular weight measured by Gel Permeation Chromatography (GPC) using tetrahydrofuran (THF) as a solvent.

Further, even in the case of (A) a polymerizable compound having an ethylenically unsaturated bond, the molecular weight of a compound having a molecular weight of 5001 or more is a gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent. The measured polystyrene-equivalent weight average molecular weight.

The curable composition of the present invention (hereinafter also referred to simply as "composition") is characterized by containing (A) a polymerizable compound having an ethylenically unsaturated bond, (B) a polymerization initiator, and (C) alkoxy group. The proportion of the 6-functional or higher (meth)acrylic acid urethane in the solid component excluding the inorganic substance from the total solid content of the composition is 70% by mass to 100% by mass, based on the decane compound and (D) the organic solvent. . By setting it as such a structure, it can harden at low temperature, and can obtain the hardened film of high hardness.

The curable composition of the present invention may further contain (E) inorganic particles, a polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid amide, a polyfunctional fluorenyl compound, and a blocking agent. Other components such as an isocyanate compound.

Specifically, a composition containing the following components is exemplified as a specific embodiment.

<First embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

A polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane compound (preferably a polymerizable monomer having an ethylenically unsaturated bond)

<Second embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

Polyfunctional thiol compound

<Third embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

Blocking isocyanate compound

<Fourth embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

(E) inorganic particles having an average particle diameter of 1 nm to 200 nm

<Fifth Embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

A polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane compound (preferably a polymerizable monomer having an ethylenically unsaturated bond)

Polyfunctional thiol compound

<Sixth embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

Polyfunctional thiol compound

Blocking isocyanate compound

<Seventh embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

(E) inorganic particles having an average particle diameter of 1 nm to 200 nm

Ethylene other than a 6-functional or higher (meth)acrylic acid urethane compound a polymerizable compound having an unsaturated bond (preferably a polymerizable monomer having an ethylenically unsaturated bond)

Polyfunctional thiol compound

<Eighth Embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

(E) inorganic particles having an average particle diameter of 1 nm to 200 nm

Polyfunctional thiol compound

Blocking isocyanate compound

<Ninth Embodiment>

6-functional or higher (meth)acrylic acid urethane

(B) polymerization initiator

(C) alkoxydecane compound

(D) organic solvent

(E) inorganic particles having an average particle diameter of 1 nm to 200 nm

A polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane compound (preferably a polymerizable monomer having an ethylenically unsaturated bond)

Polyfunctional thiol compound

Blocking isocyanate compound

<Tenth embodiment>

An embodiment in which a surfactant is further formulated in any of the first embodiment to the ninth embodiment

<(A) Polymerizable compound having an ethylenically unsaturated bond>

The curable composition of the present invention contains (A) a polymerizable compound having an ethylenically unsaturated bond.

The polymerizable compound having an ethylenically unsaturated bond in the present invention may be a low molecular compound, an oligomer or a polymer as long as it has an ethylenically unsaturated bond.

In addition, the content of (A) of the polymerizable compound having an ethylenically unsaturated bond is preferably 40% by mass or more, and more preferably 50% by mass based on the total solid content of the curable resin composition. The above is more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is not particularly limited, and is, for example, preferably 99% by mass or less, and more preferably 95% by mass or less. In addition, in the case of blending the inorganic particles described later, it is preferably 80% by mass or less, and more preferably 75% by mass or less. In addition, the "solid component" in the curable composition means a component excluding a volatile component such as an organic solvent.

The polymerizable compound having an ethylenically unsaturated bond used in the present invention contains a 6-functional or higher (meth)acrylic acid urethane.

Further, a polymerizable compound having an ethylenically unsaturated bond and a corresponding alkoxydecane compound described later is regarded as an alkoxydecane compound.

<<6-functional or higher (meth)acrylic acid urethane>>

In the curable composition of the present invention, inorganic substances are contained in the total solid content of the composition Among the solid components other than the above, the ratio of the hexafunctional or higher (meth)acrylic acid urethane is 70% by mass to 100% by mass, preferably 75% by mass to 100% by mass, and more preferably 80% by mass to 100% by mass. The mass%, and further preferably from 85 mass% to 100 mass%.

The polymerizable compound having an ethylenically unsaturated bond used in the present invention contains a 6-functional or higher (meth)acrylic acid urethane in a ratio of 70% by mass to 100% by mass, preferably 75% by mass to 100% by mass. The mass% is more preferably from 90% by mass to 100% by mass, and further preferably from 95% by mass to 100% by mass. In the above form, the effects of the present invention are more effectively exhibited.

In addition, the content of the 6-functional or higher (meth)acrylic acid urethane relative to the total solid content of the curable composition is preferably 40% by mass or more, more preferably 50% by mass or more, and further preferably 65% by mass. The upper limit is not particularly limited, and is preferably 95% by mass or less.

In addition, the content of the 6-functional or higher (meth)acrylic acid urethane is preferably 60% by mass or more based on the solid content excluding the inorganic substance (inorganic particles or the like) in the total solid content of the self-curable composition. More preferably, it is 70% by mass or more, and most preferably 80% by mass or more.

In addition, the content of the hexafunctional or higher (meth) acrylate urethane is preferably 60% by mass or more, more preferably 70% by mass or more, and most preferably 80% by mass or more based on the organic solid content of the curable composition. . In addition, the organic solid component in the present invention refers to a solid component of an organic substance excluding organic particles such as polymer particles, inorganic particles such as metal oxide particles, and pigment components other than organic inorganic pigments, from the solid content of the composition.

The number of (meth)acryloxy groups in the 6-functional or higher (meth)acrylic acid urethane is preferably 8 or more, more preferably 10 or more, and most preferably 12 or more. By setting such a configuration, the effects of the present invention are more effectively exhibited.

Further, the upper limit of the number of the (meth) acryloxy group is not particularly limited, and when it is not a polymer structure, it is preferably 50 or less, more preferably 30 or less, and still more preferably 20 or less.

The curable composition of the present invention may contain only one type of 6-functional or higher (meth)acrylic acid urethane, and may contain two or more types. When two or more cases are contained, it is preferable that the total amount is the said range.

The hexafunctional or higher (meth) acrylate urethane which can be used in the present invention is exemplified by a urethane addition polymerizable compound produced by an addition reaction of an isocyanate and a hydroxy group, and a Japanese patent can be exemplified. The urethane amides described in Japanese Patent Application Laid-Open No. Hei. No. Hei. .

The molecular weight of the 6-functional or higher (meth)acrylic acid urethane is preferably from 500 to 20,000, more preferably from 650 to 6,000, and still more preferably from 800 to 3,000, from the viewpoint of the hardness of the cured film.

By setting such a configuration, the effects of the present invention are more effectively exhibited.

The (meth) acryloxy group in the 6-functional or higher (meth) acrylate urethane may be either propylene methoxy or methacryloxy, or both. It is a propylene oxy group.

The number of the urethane bond in the 6-functional or higher (meth)acrylic acid urethane is not particularly limited, but is preferably 1 to 30, more preferably 1 to 20, and still more preferably 2 to 10. , especially good for 2~5, best 2 or 3.

The 6-functional or higher (meth)acrylic acid urethane is preferably a 6-functional or higher aliphatic (meth)acrylic acid urethane.

Further, the 6-functional or higher (meth)acrylic acid urethane preferably has an isocyanuric acid ring structure.

Further, the 6-functional or higher (meth)acrylic acid urethane preferably contains a core portion having one or more urethane bonds and a core portion and has one or more (methyl group). a compound having a terminal moiety of a propylene oxime group, more preferably a compound having two or more terminal moieties bonded to the core moiety, and further preferably having 2 to 5 bonded to the core moiety; The compound of the terminal moiety is particularly preferably a compound having 2 or 3 of the terminal moieties bonded to the core moiety.

The 6-functional or higher (meth)acrylic acid urethane is preferably a compound having at least a group represented by the following formula (Ae-1) or formula (Ae-2), more preferably at least having the following formula; A compound of the group represented by (Ae-1). Further, the 6-functional or higher (meth)acrylic acid urethane preferably has two or more groups selected from the group represented by the following formula (Ae-1) and the group represented by the formula (Ae-2). a compound of a group in a group consisting of a group.

Further, the terminal moiety in the hexafunctional or higher (meth)acrylic acid urethane is preferably a group represented by the following formula (Ae-1) or formula (Ae-2).

[Chemical 1]

In the formula (Ae-1) and the formula (Ae-2), R each independently represents an acryl group or a methacryl group, and the wave line portion indicates a bonding position with another structure.

Further, the 6-functional or higher (meth)acrylic acid urethane is preferably a compound having at least a group represented by the following formula (Ac-1) or (Ac-2), more preferably at least A compound of the group represented by the formula (Ac-1).

In addition, the core portion of the 6-functional or higher (meth)acrylic acid urethane is preferably the following formula from the viewpoints of hardness, low-temperature curability, adhesion, solvent resistance, and applicability. (Ac-1) or a group represented by the formula (Ac-2).

In the formula (Ac-1) and the formula (Ac-2), L ¹ to L ⁴ each independently represent a divalent hydrocarbon group having 2 to 20 carbon atoms, and the wave line portion indicates a bonding position with another structure.

L ¹ to L ⁴ are each independently preferably an alkylene group having 2 to 20 carbon atoms, more preferably an alkylene group having 2 to 10 carbon atoms, and more preferably an alkylene group having 4 to 8 carbon atoms. Further, the alkylene group may have a branched or cyclic structure, preferably a linear alkylene group.

Further, a 6-functional or higher (meth)acrylic acid urethane is preferably a group represented by the formula (Ac-1) or the formula (Ac-2), and is selected from the formula (Ae-1) and the formula (Ae-1) Ae-2) A compound in which two or three groups in a group consisting of groups represented by a group are bonded.

The 6-functional or higher (meth)acrylic acid urethane which can be preferably used in the present invention is exemplified below, but the present invention is of course not limited to these compounds.

[Chemical 4]

Commercial products of a 6-functional or higher (meth)acrylic acid urethane can be exemplified by U-6HA, UA-1100H, U-6LPA, U-15HA, U- available from Shin-Nakamura Chemical Industry Co., Ltd. 6H, U-10HA, U-10PA, UA-53H, UA-33H (both registered trademarks), or UA-306H, UA-306T, UA-306I, UA- available from Gongrongshe Chemical Co., Ltd. 510H, Laromer UA-9048, Laromer UA-9050, Laromer PR9052 available from BASF, available from Daicel-Allnex (EBECRYL) 220, EBEECRYL 5129, EBECRYL 8301, KRM8200, KRM8200AE, KRM8452, etc.

<<Other polymerizable compounds having ethylenic unsaturated bonds>>

The curable composition of the present invention may contain a polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane (also referred to as "other polymerization having an ethylenically unsaturated bond". The compound "), but preferably does not contain.

The polymerizable compound having an ethylenically unsaturated bond other than the 6-functional or higher (meth)acrylic acid amide may be a polymer (for example, a molecular weight of 2,000 or more) or a monomer (for example, a molecular weight of less than 2,000, preferably The molecular weight is 100 or more and less than 2,000), preferably a monomer.

The polymerizable compound having an ethylenically unsaturated bond other than the 6-functional or higher (meth)acrylic acid amide is preferably a (meth) acrylate compound. The number of functional groups of the (meth) acrylate compound is preferably from 2 to 6, more preferably from 3 to 6. By setting such a configuration, the effects of the present invention are more effectively exhibited.

Specific examples thereof include pentaerythritol tri(meth)acrylate and pentaerythritol tetra(methyl). Acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa(meth) acrylate, tris((meth) propylene methoxyethyl) isocyanurate, trimethylolpropane tris Acrylate, pentaerythritol tetra(meth)acrylate Ethylene Oxide (EO) modified body, dipentaerythritol hexa(meth)acrylate EO modified body, and the like.

Further, the other polymerizable compound having an ethylenically unsaturated bond may contain a 5-functional or less (meth)acrylic acid urethane. The following compounds can be exemplified as the 5-functional (meth)acrylic acid urethane.

[Chemistry 7]

In the case where the curable composition of the present invention contains a polymerizable compound having an ethylenically unsaturated bond other than a (functional) or more (meth)acrylic acid urethane, it is preferably a total solid content of the composition. It is contained in the range of 0.1% by mass to 20% by mass, more preferably in the range of 0.5% by mass to 10% by mass, and more preferably in the range of 1% by mass to 5% by mass.

The curable composition of the present invention may contain only one type of polymerizable compound having an ethylenically unsaturated bond other than a 6-functional or higher (meth)acrylic acid urethane, and may contain two or more kinds. When two or more cases are contained, it is preferable that the total amount is the said range.

<(B) Polymerization initiator>

The curable composition of the present invention contains (Component B) a polymerization initiator.

The polymerization initiator preferably contains a radical polymerization initiator.

The radical polymerization initiator which can be used in the present invention is a compound which can initiate and accelerate the polymerization of a 6-functional or higher (meth)acrylic acid urethane compound by light and/or heat. Among them, a photopolymerization initiator is preferred, and a photoradical polymerization initiator is more preferred.

The "light" is not particularly limited as long as it is an active energy ray that can impart energy to the starting species by the component B by irradiation, and broadly includes α rays, γ rays, X rays, and ultraviolet rays (Ultraviolet, UV), visible light, electron beam, etc. Among these active energy rays, it is preferred to contain at least ultraviolet rays.

Examples of the photopolymerization initiator include an oxime ester compound, an organic halogenated compound, an oxadiazole compound, a carbonyl compound, a ketal compound, a benzoin compound, an acridine compound, an organic peroxidation compound, an azo compound, and a coumarin compound. An azide compound, a metallocene compound, a hexaarylbiimidazole compound, an organoboric acid compound, a disulfonic acid compound, a phosphonium salt compound, a mercaptophosphine (oxide) compound. Among these compounds, in terms of sensitivity, an oxime ester compound or a hexaarylbiimidazole compound is preferred, and an oxime ester compound is more preferred.

The oxime ester compound can be used, for example, in JP-A-2000-80068, JP-A-2001-233842, JP-A-2004-534797, JP-A-2007-231000, and JP-A No. The compound described in JP-A-2009-134289.

The oxime ester compound is preferably a compound represented by the following formula (1) or formula (2).

[化8]

In the formula (1) or (2), Ar represents an aromatic group or a heteroaromatic group, R ¹ represents an alkyl group, an aromatic group or an alkoxy group, and R ² represents a hydrogen atom or an alkyl group, and further R ² may be used. Bonded to the Ar group to form a ring.

Ar represents an aromatic group or a heteroaromatic group, preferably a group obtained by removing one hydrogen atom from a benzene ring, a naphthalene ring or a carbazole ring, more preferably a naphthyl group or a carbazole which forms a ring together with R ² . base.

R ¹ represents an alkyl group, an aromatic group or an alkoxy group, preferably a methyl group, an ethyl group, a benzyl group, a phenyl group, a naphthyl group, a methoxy group or an ethoxy group, more preferably a methyl group, an ethyl group or a benzene group. Base or methoxy group.

R ² represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or a substituted alkyl group, more preferably a hydrogen atom, a substituted alkyl group or a tolylalkyl group which forms a ring together with Ar.

The oxime ester compound is more preferably a compound represented by the following formula (3), formula (4) or formula (5).

[Chemistry 9]

In the formulae (3) to (5), R ¹ represents an alkyl group, an aromatic group or an alkoxy group, and X represents -CH ₂ -, -C ₂ H ₄ -, -O- or S-, and R ^{3 is} independently R represents a halogen atom, and R ⁴ each independently represents an alkyl group, a phenyl group, an alkyl group-substituted amine group, an arylthio group, an alkylthio group, an alkoxy group, an aryloxy group or a halogen atom, and R ⁵ represents a hydrogen atom, An alkyl group or an aryl group, R ⁶ represents an alkyl group, n1 and n2 each independently represent an integer of 0 to 6, and n3 represents an integer of 0 to 5.

R ¹ represents an alkyl group, an aromatic group or an alkoxy group, preferably a group represented by R ¹¹ -X'-alkylene group (R ¹¹ represents an alkyl group or an aryl group, and X' represents a sulfur atom or an oxygen atom. ). R ^{11 is} preferably an aryl group, more preferably a phenyl group. The alkyl group and the aryl group as R ¹¹ may be substituted by a halogen atom (preferably a fluorine atom, a chlorine atom or a bromine atom) or an alkyl group.

X is preferably a sulfur atom.

R ³ and R ⁴ may be bonded at any position on the aromatic ring.

R ⁴ represents an alkyl group, a phenyl group, an alkyl group-substituted amine group, an arylthio group, an alkylthio group, an alkoxy group, an aryloxy group or a halogen atom, preferably an alkyl group, a phenyl group, an arylthio group or a halogen. The atom is more preferably an alkyl group, an arylthio group or a halogen atom, and further preferably an alkyl group or a halogen atom. The alkyl group is preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or an ethyl group. The halogen atom is preferably a chlorine atom, a bromine atom or a fluorine atom.

Further, the carbon number of R ⁴ is preferably from 0 to 50, more preferably from 0 to 20.

R ⁵ represents a hydrogen atom, an alkyl group or an aryl group, preferably an alkyl group. The alkyl group is preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or an ethyl group. The aryl group is preferably an aryl group having 6 to 10 carbon atoms.

R ⁶ represents an alkyl group, preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or an ethyl group.

N1 and n2 respectively represent the substitution number of R ³ on the aromatic ring in the formula (3) or the formula (4), and n3 represents the substitution number of R ⁴ on the aromatic ring in the formula (5).

N1 to n3 are each independently preferably an integer of 0 to 2, more preferably 0 or 1.

Examples of the oxime ester compound which can be preferably used in the present invention are shown below. However, the oxime ester compound used in the present invention is of course not limited to these compounds. Further, Me represents a methyl group, and Ph represents a phenyl group.

[化10]

Specific examples of the organic halogenated compound include: Bull Chem. Soc. Japan (42, 2924 (1969)), US Patent No. 3,905,815, and Japanese Patent Publication No. 46-4605. Japanese Patent Laid-Open Publication No. SHO-48-36281, Japanese Patent Laid-Open Publication No. Sho 55-32070, Japanese Patent Laid-Open Publication No. SHO-60-239736, Japanese Patent Laid-Open No. 61-169835 Japanese Laid-Open Patent Publication No. SHO-62- 582 837, Japanese Patent Laid-Open No. Hei. The compound described in the "Journal of Heterocyclic Chemistry" (1 (No. 3), (1970)) of MP Hutt, and the like, in particular, the trihalomethyl group is substituted for the evil. An azole compound or a s-triazine compound.

Examples of the hexaarylbiimidazole compound include various compounds described in each specification, such as Japanese Patent Publication No. Hei. 6-29285, U.S. Patent No. 3,479,185, U.S. Patent No. 4,311,783, and U.S. Patent No. 4,622,286.

The mercaptophosphine (oxide) compound may, for example, be a monodecylphosphine oxide compound or a bis-fluorenylphosphine oxide compound, and specific examples thereof include Yanjiagu (manufactured by Ciba Specialty Chemicals). Irgacure) 819, Darocure 4265, Darocure TPO, and the like.

The polymerization initiators may be used alone or in combination of two or more.

The total amount of the photopolymerization initiator in the curable composition of the present invention is preferably from 0.5 part by mass to 30 parts by mass, more preferably from 1 part by mass to 20% by mass based on 100 parts by mass of the total solid content of the composition. Parts, and preferably 1 part by mass to 10 parts by mass, especially Good is 2 parts by mass to 5 parts by mass.

<sensitizer>

In the curable composition of the present invention, a sensitizer may be added in addition to the polymerization initiator.

A typical sensitizer which can be used in the present invention is exemplified by JV Creello's "Adv. in Polymer Sci." (62, 1, (1984)). The sensitizer may specifically be: hydrazine, hydrazine, acridine orange, thioxanthone, 2-chlorothiazinone, benzoflavin, N-vinylcarbazole, 9,10-dibutoxyanthracene,蒽醌, coumarin, ketocoumarin, phenanthrene, camphorquinone, phenothiazine derivatives, and the like. The sensitizer is preferably added in a proportion of 50% by mass to 200% by mass based on the polymerization initiator.

<(C) alkoxydecane compound>

The curable composition of the present invention contains (C) an alkoxydecane compound. When an alkoxy decane compound is used, the adhesiveness of the film formed by the curable composition of this invention, and a board|substrate can be improved.

The alkoxydecane compound is not particularly limited as long as it has a group in which at least an alkoxy group is directly bonded to a ruthenium atom, and preferably has a dialkoxyalkyl group and/or a trialkoxy decane. The compound of the group is more preferably a compound having a trialkoxyalkyl group.

The alkoxydecane compound which can be used in the curable composition of the present invention is preferably a substrate, a ruthenium compound such as ruthenium, iridium oxide or ruthenium nitride, or a metal such as gold, copper, molybdenum, titanium or aluminum, and an insulating film. The adhesion-enhancing compound. Specifically, well-known 矽 An alkane coupling agent or the like is also effective. A decane coupling agent having an ethylenically unsaturated bond is preferred.

Examples of the decane coupling agent include γ-aminopropyltrimethoxydecane, γ-aminopropyltriethoxydecane, γ-glycidoxypropyltrialkoxydecane, and γ-glycidyloxy group. Propyl dialkoxy decane, γ-methyl propylene methoxy propyl trialkoxy decane, γ-methyl propylene methoxy propyl dialkoxy decane, γ-chloropropyl trialkoxy decane And γ-mercaptopropyltrialkoxydecane, β-(3,4-epoxycyclohexyl)ethyltrialkoxydecane, vinyltrialkoxydecane. More preferably, these compounds are γ-methacryloxypropyltrialkoxydecane or γ-acryloxypropyltrialkoxydecane or vinyltrialkoxydecane, γ-glycidol. Oxypropyl propyl alkoxy decane. These compounds may be used alone or in combination of two or more.

Commercially available products are KBM-403 or KBM-5103 manufactured by Shin-Etsu Chemical Co., Ltd.

The content of the alkoxydecane compound in the curable composition of the present invention is preferably from 0.1 part by mass to 30 parts by mass, more preferably 2 parts by mass, per 100 parts by mass of the total solid content of the curable composition. 20 parts by mass, and more preferably 2 parts by mass to 15 parts by mass. The alkoxydecane compound may be used alone or in combination of two or more. When two or more cases are contained, it is preferable that the total amount is the said range.

<(D) Organic Solvent>

The curable composition of the present invention contains (D) an organic solvent. The curable composition of the present invention is preferably prepared in the form of a solution obtained by dissolving component A, component B, and component C as essential components and an optional component described later in a solvent.

The organic solvent used in the curable composition of the present invention can be a known solution. The agent can be exemplified by ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol single Alkyl ether acetates, diethylene glycol dialkyl ethers, diethylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, butanediol diacetate, dipropylene glycol dialkyl Ethers, dipropylene glycol monoalkyl ether acetates, alcohols, esters, ketones, guanamines, lactones, and the like. Specific examples of such organic solvents can be referred to paragraph 0062 of Japanese Patent Laid-Open Publication No. 2009-098616.

Specifically, propylene glycol monomethyl ether acetate, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, 1,3-butylene glycol diacetate, and a ring are preferred. Hexanol acetate, propylene glycol diacetate, tetrahydrofurfuryl alcohol.

The boiling point of the organic solvent is preferably from 100 ° C to 300 ° C, more preferably from 120 ° C to 250 ° C from the viewpoint of coatability.

The organic solvent which can be used in the invention may be used alone or in combination of two or more. It is also preferred to use a solvent having a different boiling point.

From the viewpoint of adjusting the viscosity suitable for coating, the content of the organic solvent in the curable composition of the present invention is preferably from 100 parts by mass to 3,000 by mass based on 100 parts by mass of the total solid content of the curable composition. The portion is preferably from 200 parts by mass to 2,000 parts by mass, and more preferably from 250 parts by mass to 1,000 parts by mass.

The solid content concentration of the curable composition is preferably from 3% by mass to 50% by mass, more preferably from 20% by mass to 40% by mass.

The viscosity of the curable composition is preferably 1 mPa. s~200mPa. s, more preferably 2mPa. s~100mPa. s, the best is 3mPa. s~80mPa. s. Viscosity is preferably, for example It was measured at 25 ° C ± 0.2 ° C using a RE-80L rotary viscometer manufactured by Toki Sangyo Co., Ltd. Regarding the rotational speed at the time of measurement, the viscosity is less than 5 mPa. In the case of s, it is preferably measured at a rotation speed of 100 rpm, and the viscosity is 5 mPa. Above s and less than 10mPa. In the case of s, it is preferably measured at a rotational speed of 50 rpm, and the viscosity is 10 mPa. Above s and less than 30mPa. In the case of s, it is preferably measured at a rotation speed of 20 rpm, and the viscosity is 30 mPa. In the case of s or more, it is preferably measured at a number of revolutions of 10 rpm.

<(E) Inorganic Particles>

The curable composition of the present invention may contain inorganic particles. By containing inorganic particles, the hardness of the cured film becomes more excellent. Further, by containing inorganic particles, the adhesion to the substrate can be improved.

The average particle diameter of the inorganic particles used in the present invention is preferably from 1 nm to 200 nm, more preferably from 5 nm to 100 nm, most preferably from 5 nm to 50 nm. The average particle diameter refers to an arithmetic mean value obtained by measuring the particle diameter of an arbitrary 200 particles by an electron microscope. Further, when the shape of the particles is not spherical, the longest side is set to the particle diameter.

Further, from the viewpoint of the hardness of the cured film, the void ratio of the inorganic particles is preferably less than 10%, more preferably less than 3%, and most preferably no voids. The void ratio of the particles is an arithmetic mean of the ratio of the area of the void portion of the cross-sectional image obtained by the electron microscope to the total particle area of 200 particles.

The inorganic particles preferably contain beryllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba), strontium (Sc), strontium (Y), lanthanum (La), cerium (Ce). , Gd, Tb, Dy, Yb, Lu, Ti (Ti), Zr (Zr), Hf (Hf), Niobium (Nb), molybdenum (Mo), tungsten (W), zinc (Zn), boron (B), aluminum (Al), bismuth (Si), germanium (Ge), tin (Sn), lead (Pb), Metal oxide particles of atoms such as bismuth (Sb), bismuth (Bi), and strontium (Te) are more preferably cerium oxide, titanium oxide, titanium composite oxide, zinc oxide, zirconium oxide, indium/tin oxide, lanthanum/ Tin oxide, further preferably cerium oxide, titanium oxide, titanium composite oxide, or zirconia, is particularly preferable in terms of stability of particles, easy availability, hardness of cured film, transparency, and refractive index adjustment. Cerium oxide or titanium oxide.

The cerium oxide is preferably exemplified by cerium oxide, and more preferably cerium oxide particles.

The cerium oxide particles are not particularly problematic as long as they are particles of an inorganic oxide containing cerium oxide, and particles containing cerium oxide or a hydrate thereof as a main component (preferably 80% by mass or more) are preferable. The particles may also contain an aluminate as a minor component (e.g., less than 5% by mass). Examples of the aluminate contained as a small amount of components include sodium aluminate and potassium aluminate. Further, the cerium oxide particles may contain an inorganic salt such as sodium hydroxide, potassium hydroxide, lithium hydroxide or ammonium hydroxide or an organic salt such as tetramethylammonium hydroxide. An example of such a compound is exemplified by colloidal cerium oxide.

The dispersion medium of the colloidal cerium oxide is not particularly limited, and may be any of water, an organic solvent, and a mixture thereof. These dispersion media may be used alone or in combination of two or more.

In the present invention, the particles can also be used in the form of a dispersion prepared by mixing and dispersing particles in a suitable dispersant and a solvent using a mixing device such as a ball mill or a rod mill. Furthermore, in the curable composition of the present invention, Colloidal cerium oxide does not have to exist in a colloidal state.

When the content of the inorganic particles is adjusted, the amount of the inorganic particles is preferably 1 part by mass or more, and more preferably 5 parts by mass or more based on 100 parts by mass of the total solid content of the curable composition. Further, it is preferably 10 parts by mass or more. Further, it is preferably 80 parts by mass or less, more preferably 50 parts by mass or less, further preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less.

The inorganic particles may be contained alone or in combination of two or more. When two or more cases are contained, it is preferable that the total amount is the said range.

<Compound having an epoxy group, a compound having an oxetanyl group, a blocked isocyanate compound, a polyfunctional mercapto compound>

The curable composition of the present invention preferably contains at least one selected from the group consisting of a compound having an epoxy group, a compound having an oxetanyl group, a blocked isocyanate compound, and a polyfunctional fluorenyl compound. In the case of the above, the hardness of the obtained cured product is more excellent.

<<Compounds with epoxy groups>>

The curable composition of the present invention may also contain a compound having an epoxy group. The compound having an epoxy group may have one epoxy group in the molecule, but is preferably two or more.

Specific examples of the compound having two or more epoxy groups in the molecule include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolak type epoxy resin, and a cresol novolak type epoxy resin. Resin, aliphatic epoxy resin, etc.

These compounds are available as commercial products. For example, bisphenol A type epoxy resins are JER827, JER828, JER834, JER1001, JER1002, JER1003, JER1055, JER1007, JER1009, JER1010 (above is made by Japan Epoxy Resin), Apiclon (EPICLON) 860, Epiclon 1050, EPICLON 1051, Ai Epiclon (Electron) 1055 (above is manufactured by Di Aisheng (DIC) Co., Ltd.); bisphenol F-type epoxy resin is JER806, JER807, JER4004, JER4005, JER4007, JER4010 (above is Japan Epoxy) Resin), Apiclon (EPICLON) 830, Apiclon (EPICLON) 835 (above is manufactured by Di Aisheng (DIC) Co., Ltd.), LCE-21, RE-602S (above is Japanese chemical) (manufacturing), etc.; phenol novolac type epoxy resin is JER152, JER154, JER157S70, JER157S65 (above is made by Japan Epoxy Resin), Apiclon (EPICLON) N-740, Epiclon N-740, EPICLON N-770, EPICLON N-775 (above), etc.; cresol novolac type ring Oxygen resin is EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, Epicol (EPICLO) N) N-680, Epiclon (NPICLON) N-690, Epiclon (EPICLON) N-695 (above is manufactured by Di Ai Sheng (DIC) Co., Ltd.), EOCN-1020 (above is Nippon Chemical Co., Ltd.) ))); aliphatic epoxy resin is ADEKA RESIN EP-4080S, ADEKA RESIN EP-4085S, ADEKA RESIN EP-4088S (above ADEKA (manufactured by ADEKA), Celloxide 2021P, Celloxide 2081, Cyrusid (Celloxide) 2083, Celloxide 2085, EHPE 3150, EPOLEAD PB 3600, EPOLEAD PB 4700 (above, manufactured by Daicel Chemical Industry Co., Ltd.). Other examples include: ADEKA RESIN EP-4000S, ADEKA RESIN EP-4003S, ADEKA RESIN EP-4010S, ADEKA RESIN ) EP-4011S (above is made by ADEKA), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (above ADEKA) ) (share) manufacturing) and so on.

In addition, it is also possible to preferably use the Japanese Patent Publication No. Sho-58-49860, the Japanese Patent Publication No. Sho 56-17654, the Japanese Patent Publication No. Sho 62-39417, and the Japanese Patent Publication No. Sho 62-39418. A urethane compound having an oxirane skeleton, which is incorporated into the specification of the present application.

When the curable composition of the present invention contains a compound having an epoxy group, it is preferably contained in the range of 0.1% by mass to 20% by mass based on the total solid content of the composition, more preferably 0.5% by mass. It is contained in the range of 10% by mass, and more preferably contained in the range of 1% by mass to 5% by mass.

The curable composition of the present invention may contain only one compound having an epoxy group, or may contain two or more kinds. When two or more cases are contained, it is preferable that the total amount is the said range.

<<Compounds with oxetanyl>>

The curable composition of the present invention may also contain a compound having an oxetanyl group. A compound having an oxetanyl group may have one oxetanyl group in the molecule, but Good for 2 or more.

Specific examples of the compound having an oxetanyl group can be used: Aron Oxetane OXT-121, Aron Oxetane OXT-221, and argon oxetane Aron Oxetane OX-SQ, Aron Oxetane PNOX (above manufactured by East Asia Synthetic Co., Ltd.).

Further, the oxetanyl group-containing compound is preferably used alone or in combination with an epoxy group-containing compound.

When the curable composition of the present invention contains a compound having an oxetanyl group, it is preferably contained in the range of 0.1% by mass to 20% by mass based on the total solid content of the composition, more preferably 0.5% by mass. It is contained in the range of % to 10% by mass, and more preferably in the range of 1% by mass to 5% by mass.

The curable composition of the present invention may contain only one compound having an oxetanyl group, or may contain two or more kinds. When two or more cases are contained, it is preferable that the total amount is the said range.

<<Blocking isocyanate compound>>

The curable composition of the present invention may also contain a blocked isocyanate compound. The blocked isocyanate compound is not particularly limited as long as it is a compound having a blocked isocyanate group, and is preferably a compound having two or more blocked isocyanate groups in one molecule from the viewpoint of curability. The upper limit of the number of blocked isocyanate groups is not particularly limited, but is preferably 6 or less.

Further, the skeleton of the blocked isocyanate compound is not particularly limited, and may be any skeleton as long as it has two isocyanate groups in one molecule, and may be aliphatic or alicyclic. Group or aromatic polyisocyanate. For example, it is preferably used: 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, 1,3-trimethylene diisocyanate , 1,4-tetramethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,9-Jiu Methyl diisocyanate, 1,10-decethylene diisocyanate, 1,4-cyclohexane diisocyanate, 2,2'-diethyl ether diisocyanate, diphenylmethane-4,4'-diisocyanate, adjacent Xylene diisocyanate, m-xylene diisocyanate, p-xylene diisocyanate, methylene bis(cyclohexyl isocyanate), cyclohexane-1,3-dimethylene diisocyanate, cyclohexane-1,4- Dimethylene diisocyanate, 1,5-naphthalene diisocyanate, p-phenylene diisocyanate, 3,3'-methylene xylene-4,4'-diisocyanate, 4,4'-diphenyl ether diisocyanate Isocyanate compounds such as tetrachlorobenzene diisocyanate, norbornane diisocyanate, hydrogenated 1,3-xylene diisocyanate, hydrogenated 1,4-xylene diisocyanate, and the like Compounds derived type prepolymer backbone. Among these compounds, toluene diisocyanate (TDI) or diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), and isophorone diisocyanate (IPDI) are particularly preferable.

The parent structure of the blocked isocyanate compound in the composition of the present invention may, for example, be a biuret type, an isocyanurate type, an adduct type, a difunctional prepolymer type or the like.

Examples of the blocking agent for forming the closed structure of the blocked isocyanate compound include an anthracene compound, an indoleamine compound, a phenol compound, an alcohol compound, an amine compound, an active methylene compound, a pyrazole compound, a thiol compound, an imidazole compound, A quinone imine compound or the like. Among these compounds, it is particularly preferred to be selected from the group consisting of ruthenium compounds and indoleamines. A blocking agent in a compound, a phenol compound, an alcohol compound, an amine compound, an active methylene compound, or a pyrazole compound.

The blocked isocyanate compound which can be used in the composition of the present invention can be obtained as a commercially available product, and for example, Coronate AP stable M, Coronate 2503, Krona can be preferably used. Coronate 2515, Coronate 2507, Coronate 2513, Coronate 2555, Millionate MS-50 (above for the Japanese Polyurethane Industry ( () manufacturing), Takenate B-830, Takenate B-815N, Takenate B-820NSU, Takenate B-842N, tower Takenate B-846N, Takenate B-870N, Takenate B-874N, Takenate B-882N (above is Mitsui Chemicals Co., Ltd.) Manufactured), Duranat 17B-60P, Duranate 17B-60PX, Duranate 17B-60P, Duranate TPA-B80X, Duranai Duranate TPA-B80E, Duranate MF-B60X, Duranate MF-B60B, Duranate MF-K60X, Duranate MF- K60B, Duranate E402-B80B, Duranite ( Duranate) SBN-70D, Duranate SBB-70P, Duranate K6000 (above made by Asahi Kasei Chemicals), Desmodule BL1100, Germany Desmodule BL1265 MPA/X, Desmodule BL3575/1, Desmodule BL3272MPA, Desmodule BL3370MPA, Desmodule BL3475BA/SN, Desmodule BL5375MPA, Desmodule VPLS2078/2, Desmodule BL4265SN, Desmodule PL340, Desmo ( Desmodule) PL350, Sumidule BL3175 (above, manufactured by Sumitomo-Bayer Urethane).

When the curable composition of the present invention contains a blocked isocyanate compound, it is preferably contained in the range of 0.1% by mass to 20% by mass based on the total solid content of the composition, more preferably 0.5% by mass to 10% by mass. It is contained in the range of 1% by mass to 5% by mass.

The curable composition of the present invention may contain only one type of blocked isocyanate compound, and may contain two or more types. When two or more cases are contained, it is preferable that the total amount is the said range.

<<Multifunctional thiol compound>>

The curable composition of the present invention may also contain a polyfunctional mercapto compound. The polyfunctional fluorenyl compound is not particularly limited as long as it is a compound having two or more fluorenyl groups, and is preferably a compound having two to six fluorenyl groups, more preferably a compound having two to four fluorenyl groups. The polyfunctional mercapto compound is preferably an aliphatic polyfunctional mercapto compound. A preferred example of the aliphatic polyfunctional mercapto compound is a compound containing a combination of an aliphatic hydrocarbon group and -O-, -C(=O)-, and at least two hydrogen atoms of the aliphatic hydrocarbon group substituted with a mercapto group.

Examples of the aliphatic polyfunctional fluorenyl compound include pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyloxy)butane, and the like. Commercial products include, for example, Kalan Karenz MT-PE-1, Karenz MT-BD-1, Karenz MT-NR-1 (manufactured by Showa Denko).

In the case where the curable composition of the present invention contains a polyfunctional mercapto compound, it is preferably contained in the range of 0.1% by mass to 20% by mass based on the total solid content of the composition, more preferably 0.5% by mass to 10% by mass. It is contained in the range of %, and is preferably contained in the range of 1% by mass to 5% by mass.

The curable composition of the present invention may contain only one polyfunctional mercapto compound, and may contain two or more kinds. When two or more cases are contained, it is preferable that the total amount is the said range.

<<Sulfur ether compound>>

Further, the curable composition of the present invention may contain a thioether compound. By containing a thioether compound, a cured film excellent in adhesion properties and moisture resistance of the substrate can be obtained.

The thioether compound is not particularly limited as long as it has a polythioether bond, and is preferably a compound having a disulfide bond, a trisulfide bond, a tetrasulfide bond, a pentasulfide bond or a hexathioether bond, more preferably A compound having a disulfide bond, a trisulfide bond, or a tetrasulfide bond is further preferably a compound having a disulfide bond or a tetrasulfide bond. When a compound having a disulfide bond or a tetrasulfide bond is used, the moisture resistance is more excellent.

Further, the polythioether bond may be any of a linear chain, a branched chain or a cyclic chain, and is preferably a linear polythioether bond.

Further, the thioether compound is preferably a monovalent group in which an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic group, or a combination of two or more of these groups is bonded to each other on both sides of the polysulfide bond. a compound, more preferably bonded to the sides of the polysulfide bond A compound having a monovalent group of a group of a hydrocarbon group, an aromatic hydrocarbon group, or a combination of two or more of these groups. The aliphatic hydrocarbon group, aromatic hydrocarbon group or heterocyclic group may have a substituent. The substituent is not particularly limited, and examples thereof include an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic group, a halogen atom, a carboxyl group, a decylamino group, an alkoxy group, an alkoxycarbonyl group, and an anthracenyl group. Among them, it is particularly preferred to have a trialkoxyalkylene group as a substituent. That is, the thioether compound is particularly preferably a compound having an aliphatic hydrocarbon group having a trialkoxyalkylene group bonded to both sides of the polysulfide bond.

Specific examples of the thioether compound are shown below, but the present invention is not limited to the following specific examples. Further, in the following formula, Ph represents a phenyl group, Me represents a methyl group, and Et represents an ethyl group.

In the present invention, the thioether compounds may be used alone or in combination of two or more.

In the present invention, a thioether compound relative to the total solid content of the curable composition The content is preferably from 0.01% by mass to 20% by mass, more preferably from 0.1% by mass to 10% by mass, even more preferably from 0.5% by mass to 5% by mass. When it is in the above range, a cured film excellent in substrate adhesion and moisture resistance can be obtained.

In the curable composition of the present invention, other compounds (for example, an alkoxymethyl group-containing compound or the like) other than the above may be contained within a range not departing from the gist of the present invention. The alkoxymethyl group-containing compound is described in paragraphs 0192 to 0194 of JP-A-2011-221494.

In the present invention, a total amount of a compound selected from the group consisting of a polymerizable compound having an ethylenically unsaturated bond, a compound having an epoxy group, a compound having an oxetanyl group, a blocked isocyanate compound, and a polyfunctional fluorenyl compound is preferred. 90% by mass or more (preferably 95% by mass or more) of the total amount of the components hardened by heat or light contained in the composition, and more preferably selected from a polymerizable compound having an ethylenically unsaturated bond. The total amount of the compound in the blocked isocyanate compound is 90% by mass or more (preferably 95% by mass or more) based on the curable compound.

Further, in the case of containing at least one of a polymerizable compound having an ethylenically unsaturated bond, a compound having an epoxy group, a compound having an oxetanyl group, a blocked isocyanate compound, and a polyfunctional fluorenyl compound, it is preferably The total amount of these compounds is from 0.1% by mass to 20% by mass, more preferably from 1% by mass to 10% by mass, based on the curable compound. By setting such a configuration, the effects of the present invention are more effectively exhibited.

<Surfactant>

The curable composition of the present invention may also contain a surfactant.

As the surfactant, any of an anionic, cationic, nonionic or amphoteric surfactant may be used, and a preferred surfactant is a nonionic surfactant. The surfactant is preferably a nonionic surfactant, more preferably a fluorine surfactant.

Examples of the surfactant which can be used in the present invention include Megafac F142D, Megafac F172, Megafac F173, Megafac F176, and Megafac which are commercially available products. ) F177, Megafac F183, Megafac F479, Megafac F482, Megafac F554, Megafac F780, Megafac F781, Megafac F781-F, Megafac R30, Megafac R08, Megafac F-472SF, Megafac BL20, Megafac R-61, Megafac R- 90 (made by DiCai (DIC)), Fluorad FC-135, Fluorad FC-170C, Fluorad FC-430, Fluorad FC -431, Novec FC-4430 (made by Sumitomo 3M (share)), Asahi Guard AG7105, Asahi Guard 7000, Asahi Guard 950, Asahi Guard 7600, Surflon S-112, Surflon S-113, Surflon S-131, Surflon S-141, Surflon S- 145, Surflon S-382, Sha Fulong (Surfl On) SC-101, Surflon SC-102, Surflon SC-103, Surflon SC-104, Surflon SC-105, Sha Fulong ( Surflon) SC-106 (made by Asahi Glass Co., Ltd.), Eftop EF351, Eftop 352, Eftop 801, Eftop 802 (Mitsubishi Materials Electronics Co., Ltd.), Ftergent 250 (manufactured by Neos). In addition, in addition to the above, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Ployflow (manufactured by Kyoeisha Chemical Co., Ltd.), and Eftop (Mitsubishi Materials Electronics) may be mentioned. Chemical (share) manufacturing), Megafac (made by DiCai (DIC)), Fluorad (Sumitomo 3M (share) manufacturing), Asahi Guard, Shafulong ( Surflon) (made by Asahi Glass Co., Ltd.) and PolyFox (made by OMNOVA).

Further, as a surfactant, a copolymer having a structural unit A and a structural unit B represented by the following formula (W) and having tetrahydrofuran as a solvent by gel permeation chromatography is preferred. The measured polystyrene-equivalent weight average molecular weight (Mw) is 1,000 or more and 10,000 or less.

In the formula (W), R ^W1 and R ^W3 each independently represent a hydrogen atom or a methyl group, R ^W2 represents a linear alkylene group having 1 or more and 4 or less carbon atoms, and R ^W4 represents a hydrogen atom or a carbon number of 1 or more and 4 In the following alkyl group, L ^W represents an alkylene group having 3 or more and 6 or less carbon atoms, p and q are mass percentages indicating a polymerization ratio, p is a numerical value of 10% by mass or more and 80% by mass or less, and q is 20% by mass. The above numerical value is 90% by mass or less, r represents an integer of 1 or more and 18 or less, and S represents an integer of 1 or more and 10 or less.

The L ^{W is} preferably a branched alkyl group represented by the following formula (W-2). R ^W5 in the formula (W-2) represents an alkyl group having 1 or more and 4 or less carbon atoms, and preferably has a carbon number of 1 or more and 3 or less in terms of compatibility and wettability to a surface to be coated. The alkyl group is more preferably an alkyl group having 2 or 3 carbon atoms.

The sum (p+q) of p and q in the formula (W) is preferably p + q = 100, that is, 100% by mass.

The weight average molecular weight (Mw) of the copolymer is more preferably 1,500 or more and 5,000 or less.

Regarding the content of the surfactant in the curable composition of the present invention, in the case of formulating the surfactant, the content of the surfactant is preferably 100 parts by mass based on the total solid content of the curable composition. 0.001 parts by mass to 5.0 parts by mass, more preferably 0.01 parts by mass to 2.0 parts by mass.

The surfactant may be contained alone or in combination of two or more. When two or more cases are contained, it is preferable that the total amount is the said range.

<antioxidant>

The curable composition of the present invention may also contain an antioxidant. As the antioxidant, a known antioxidant may be contained. By adding an antioxidant, it is possible to prevent the coloration of the cured film, or to reduce the film thickness due to decomposition, and to improve the heat-resistant transparency.

Examples of such an antioxidant include phosphorus-based antioxidants, guanamines, guanidines, hindered amine-based antioxidants, sulfur-based antioxidants, phenolic antioxidants, ascorbic acid, zinc sulfate, saccharides, nitrites, and sub- Sulfate, thiosulfate, hydroxylamine derivative, and the like. Among these, from the viewpoint of coloring and thinning of the cured film, a phenolic antioxidant, a hindered amine-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant are preferable, and the phenolic antioxidant is preferable. Oxidizer. These antioxidants may be used alone or in combination of two or more.

Specific examples include the compounds described in paragraphs 0026 to 0031 of JP-A-2005-29515, and the compounds described in paragraphs 0106 to 0116 of JP-A-2011-227106. Enter the specification of this application.

Preferred commercial products include: Adekastab AO-60, Adekastab AO-80, Adekastab AO-412S (above Edico) (ADEKA) (manufactured by the company), Irganox 1035, Irganox 1098 (above, BASF).

The content of the antioxidant is not particularly limited, and is preferably 0.1% by mass to 10% by mass, more preferably 0.2% by mass to 5% by mass based on the total solid content of the curable composition. The amount % is further preferably 0.5% by mass to 4% by mass.

<Polymerization inhibitor>

The curable composition of the present invention may also contain a polymerization inhibitor. The polymerization inhibitor refers to a substance that performs hydrogen supply (or hydrogen transfer), energy supply (or energy), and a polymerization initiation radical component produced by a polymerization initiator by exposure or heat. Electron supply (or electron donation) or the like deactivates the polymerization starting radical and inhibits the initiation of polymerization. For example, the compound described in paragraphs 0154 to 0173 of JP-A-2007-334322 can be used.

Preferred examples of the compound include phenothiazine, phenoxazine, hydroquinone, and 3,5-dibutyl-4-hydroxytoluene.

The content of the polymerization inhibitor is not particularly limited, and is preferably 0.0001% by mass to 5% by mass based on the total solid content of the curable composition.

<Binder Polymer>

The curable composition of the present invention may contain a binder polymer from the viewpoint of improving the resolution and the film properties.

The binder polymer is not particularly limited, and a known one can be used, and a linear organic polymer is preferably used. Such a linear organic polymer can be used arbitrarily. It is preferred to select a linear or organic polymer which is soluble or swellable in water or weakly alkaline water for water development or weak alkaline water development. The linear organic polymer is selected for use not only as a film forming agent but also as a water or weakly alkaline water or an organic solvent developer. For example, if a water-soluble organic polymer is used, water development can be performed. Such a linear organic polymer may be exemplified by radical polymerization having a carboxylic acid group in a side chain. For example, Japanese Patent Publication No. Sho 59-44615, Japanese Patent Publication No. Sho 54-34327, Japanese Patent Publication No. Sho 58-12577, Japanese Patent Publication No. Sho 54-25957, Japanese Patent Laid-Open No. 54 A resin obtained by homopolymerizing or copolymerizing a monomer having a carboxyl group, as described in Japanese Laid-Open Patent Publication No. SHO 59-53836 A resin obtained by homopolymerizing or copolymerizing a monomer having an acid anhydride to hydrolyze or semi-esterify or semi-esterify an acid anhydride unit, or an epoxy acrylate obtained by modifying an epoxy resin with an unsaturated monocarboxylic acid and an acid anhydride. Ester and the like. Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and 4-carboxystyrene. Examples of the monomer having an acid anhydride include maleic anhydride.

Further, there is an acidic cellulose derivative having a carboxylic acid group in the side chain as well. In addition to this, a compound obtained by adding a cyclic acid anhydride to a polymer having a hydroxyl group is useful.

The binder polymer is preferably a resin obtained by copolymerizing (meth)acrylic acid with another (meth) acrylate.

The content of the binder polymer in the curable composition of the present invention is not particularly limited, and is preferably 1% by mass to 40% by mass, and more preferably 3% by mass to 30% by mass based on the total solid content of the curable composition. The mass%, and more preferably 4% by mass to 20% by mass.

<Other ingredients>

In the curable composition of the present invention, in addition to the components described above, other components such as a plasticizer, a thermal acid generator, and an acid proliferator may be added as needed. Regarding these components, for example, Japanese Patent Laid-Open Publication No. 2009-98616, Japanese Patent No. It is described in Japanese Laid-Open Patent Publication No. 2009-244801 and other known persons. In addition, various ultraviolet absorbers, metal deactivators, and the like described in "New Development of Polymer Additives (Nikko Kogyo Co., Ltd.)" can be added to the curable composition of the present invention.

<Cured material and its manufacturing method>

The cured product of the present invention is a cured product obtained by curing the curable composition of the present invention. The cured product is preferably a cured film. Further, the cured product of the present invention is preferably a cured product obtained by the method for producing a cured product of the present invention.

The method for producing a cured product of the present invention is not particularly limited as long as it is a method for producing a cured product by curing the curable composition of the present invention, and preferably includes the following steps (1) to (3).

(1) Step of applying the curable composition of the present invention to a substrate

(2) a step of removing a solvent from the applied curable composition

(3) Steps for performing thermal hardening

Further, the method for producing a cured product of the present invention preferably further comprises the following steps (1), (2), (2') and (3).

(1) Step of applying the curable composition of the present invention to a substrate

(2) a step of removing an organic solvent from the applied curable composition

(2') a step of hardening a hardenable composition from which an organic solvent has been removed by light

(3) a step of further hardening the hardened material hardened by light by heat

Further, the method for producing a cured product of the present invention is preferably a method for producing a cured film.

In the step of (1) coating, it is preferred to use the curability of the present invention. The composition was coated on a substrate to prepare a wet film containing a solvent. The substrate may be cleaned such as an alkali cleaning or a plasma cleaning before the curable composition is applied onto the substrate. Further, the surface of the substrate can be treated with hexamethyldiazane or the like after the substrate is cleaned. By performing this treatment, the adhesion of the curable composition to the substrate tends to be improved.

Examples of the substrate include an inorganic substrate, a resin, a resin composite material, and the like.

Examples of the inorganic substrate include glass, quartz, tantalum, tantalum nitride, and a composite substrate obtained by depositing molybdenum, titanium, aluminum, copper, or the like on such a substrate.

The resin may, for example, be a substrate comprising the following resins: polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polystyrene, poly Carbonate, polyfluorene, polyether oxime, polyarylate, allyl diglycol carbonate, polyamine, polyimide, polyamidimide, polyether quinone, polybenzoxazole, Polyphenylene sulfide, polycycloolefin, norbornene resin, fluororesin such as polychlorotrifluoroethylene, liquid crystal polymer, acrylic resin, epoxy resin, fluorene ketone resin, ionic polymer resin, cyanate resin, and A synthetic resin such as a bifuranic acid diester, a cyclic polyolefin, an aromatic ether, a maleimide-olefin copolymer, a cellulose, or an episulfide resin. These substrates are rarely used as they are in the above-described form, and a multilayer laminated structure such as a TFT element is usually formed depending on the form of the final product.

Since the curable composition of the present invention has good adhesion to a metal film or a metal oxide formed by sputtering, the substrate preferably contains a metal film formed by sputtering. The metal is preferably titanium, copper, aluminum, indium, tin, manganese, nickel, cobalt, molybdenum, tungsten, chromium, silver, lanthanum and oxides or alloys of the metals, more preferably molybdenum, titanium, aluminum, copper. And alloys of these metals. Further, the metal or the metal oxide may be used singly or in combination of two or more.

The method of applying the substrate is not particularly limited, and for example, an inkjet method, a slit coating method, a spray method, a roll coating method, a spin coating method, a cast coating method, a slit method, and a spin method can be used. , printing methods and other methods.

In the step (2) of removing the solvent, it is preferred to form a dried coating film on the substrate by removing the solvent from the applied film by pressure reduction (vacuum) and/or heating. The heating condition in the solvent removal step is preferably from 70 ° C to 130 ° C for about 30 seconds to 300 seconds. Further, in the solvent removal step, it is not necessary to completely remove the organic solvent in the curable composition, and it is only necessary to remove at least a part.

Further, in the present invention, from the viewpoint of improving the film hardness, the step of performing total exposure may be performed before (2) the step of removing the solvent and (3) the step of performing thermal curing.

Further, from the viewpoint of improving the film hardness, it is preferred to include (2') the hardenability of removing the organic solvent by light after the step of (2) removing the solvent and (3) performing the step of thermally hardening. The step of hardening the composition is more preferably a step of hardening the curable composition from which the organic solvent has been removed by full exposure. Further, in the case where the film is cured by light as described above, the curable composition of the present invention preferably contains a photopolymerization initiator.

In this case, it is preferable to perform energy exposure of about 50 mJ/cm ² to 3,000 mJ/cm ² using a mercury lamp or a light emitting diode (LED) lamp or the like.

In addition, in order to form a pattern, the pattern may also be performed after the (2) solvent removal step. The steps of exposure and development. The method of pattern exposure is preferably a method using a mask or a method such as direct drawing using a laser or the like. From the viewpoint of promoting hardening, it is preferred to carry out the total exposure or pattern exposure in a state of oxygen blocking. The method of blocking oxygen can be exemplified by exposure under a nitrogen atmosphere or by setting an oxygen blocking membrane.

For pattern exposure and development, a known method or a known developer can be used. For example, a pattern exposure method and a development method described in JP-A-2011-186398 and JP-A-2013-83937 can be preferably used.

(3) In the step of performing thermal curing, a polymerizable compound having an ethylenically unsaturated bond or the like may be polymerized by heating to form a cured film, or the cured cured product may be further cured. In the case where the polymerization is carried out by heating, the curable composition of the present invention preferably contains a thermal polymerization initiator.

The heating temperature is preferably 180 ° C or lower, more preferably 150 ° C or lower, and still more preferably 130 ° C or lower. The lower limit is preferably 80 ° C or higher, more preferably 90 ° C or higher. The method of heating is not particularly limited, and a known method can be used. For example, a hot plate, an oven, an infrared heater, etc. are mentioned.

Further, the heating time is preferably from about 1 minute to 30 minutes in the case of a hot plate, and is preferably from about 20 minutes to about 120 minutes in other cases. Within this range, the substrate and the device can be hardened without being damaged. From the viewpoint of shape adjustment after heating, it is also possible to first heat at a low temperature and then heat at a high temperature (additional baking step. For example, first heating at 90 ° C for 30 minutes, then heating at 120 ° C for 30 minutes) .

The cured film of the present invention is obtained by hardening the curable composition of the present invention. The resulting cured film.

The cured film of the present invention can be preferably used as a protective film or an interlayer insulating film. Further, the cured film of the present invention is preferably a cured film obtained by the method for producing a cured film of the present invention.

According to the curable composition of the present invention, a cured film having sufficient hardness can be obtained even if it is cured at a low temperature. For example, a cured film having a pencil hardness of 2H or more can be obtained. The protective film formed by curing the curable composition of the present invention is excellent in physical properties of the cured film, and thus is useful for use in an organic EL display device or a liquid crystal display device.

Since the curable composition of the present invention is excellent in curability and cured film properties, it is a cured member obtained by curing the curable composition of the present invention as a structural member of a device for a microelectromechanical system (MEMS). Or the resist pattern is used as a partition or as part of a mechanically driven part. Examples of such MEMS devices include a surface acoustic wave (SAW) filter, a Bulk Acoustic Wave (BAW) filter, a gyro sensor, a micro-shutter for display, and a sense of image. Parts such as detectors, electronic paper, inkjet heads, biochips, sealants, etc. More specific examples are exemplified in Japanese Patent Laid-Open Publication No. 2007-522531, Japanese Patent Laid-Open No. Hei. No. 2008-250200, and Japanese Patent Laid-Open No. 2009-263544.

Since the curable composition of the present invention is excellent in flatness and transparency, it can be used, for example, to form the bank layer (16) and the planarizing film (57) described in Fig. 2 of JP-A-2011-107476. The partition wall (12) and the flattening film (102) described in Fig. 4 (a) of Japanese Patent Laid-Open Publication No. 2010-9793, Japan The bank layer (221) and the third interlayer insulating film (216b) described in FIG. 10 of the Japanese Patent Publication No. 2010-27591, and the second aspect described in FIG. 4(a) of JP-A-2009-128577 The interlayer insulating film (125) and the third interlayer insulating film (126), and the planarizing film (12) and the pixel separating insulating film (14) described in FIG. 3 of JP-A-2010-182638. In addition, it can also be preferably used for: a spacer for holding a liquid crystal layer in a liquid crystal display device at a certain thickness, a color filter or a color filter protective film for a liquid crystal display device, and a facsimile machine (facsimile) An imaging optical system of an on-chip filter of an electronic photocopier, a solid-state imaging device, or the like, or a microlens of an optical fiber connector.

<Organic EL display device>

The organic EL display device of the present invention is characterized by having the cured film of the present invention.

The organic EL display device of the present invention is not particularly limited as long as it has a planarizing film or an interlayer insulating film formed using the curable composition of the present invention, and various known organic EL display devices having various structures or Liquid crystal display device.

Specific examples of the thin film transistor (TFT) included in the organic EL display device of the present invention include amorphous germanium-TFT, low-temperature polycrystalline germanium-TFT, and oxide semiconductor TFT. Since the cured film of the present invention is excellent in electrical characteristics, it can be preferably used in combination with these TFTs.

1 is a conceptual view showing an example of an organic EL display device, and shows a schematic cross-sectional view of a substrate in a bottom emission type organic EL display device, and has a planarizing film 4.

A bottom gate type TFT 1 is formed on the glass substrate 6 to cover the state of the TFT 1 to form an insulating film 3 containing Si ₃ N ₄ . After forming a contact hole (not shown) in the insulating film 3, a wiring 2 (having a height of 1.0 μm) connected to the TFT 1 via the contact hole is formed on the insulating film 3. The wiring 2 is a wiring for connecting the TFTs 1 or connecting the organic EL element formed in the subsequent step to the TFT 1.

Further, in order to flatten the unevenness due to the formation of the wiring 2, the planarizing film 4 is formed on the insulating film 3 in a state in which the unevenness due to the wiring 2 is filled.

A bottom emission type organic EL element is formed on the planarization film 4. That is, the first electrode 5 including ITO is formed on the planarizing film 4 via the contact hole 7 and connected to the wiring 2. Further, the first electrode 5 corresponds to the anode of the organic EL element.

The insulating film 8 having a shape covering the edge of the first electrode 5 is formed, and by providing the insulating film 8, a short circuit between the first electrode 5 and the second electrode formed in the subsequent step can be prevented.

Further, although not shown in FIG. 1, a hole transport layer, an organic light-emitting layer, and an electron transport layer are sequentially deposited by interposing a desired pattern mask, and then Al is formed on the entire upper surface of the substrate. The second electrode is bonded by a sealing glass plate and an ultraviolet curable epoxy resin, and sealed to obtain an active matrix type in which the organic EL elements are connected to the TFTs 1 for driving the respective organic EL elements. Organic EL display device.

<Liquid crystal display device>

The liquid crystal display device of the present invention is characterized by having the cured film of the present invention.

The liquid crystal display device of the present invention is not particularly limited except for the protective film, the planarizing film or the interlayer insulating film formed using the curable composition of the present invention. A known liquid crystal display device having various structures can be cited.

Further, examples of the liquid crystal driving method that can be employed in the liquid crystal display device of the present invention include a twisted nematic (TN) method, a vertical alignment (VA) method, and an in-plane switching (In-Plane-Switching, IPS). Mode, Fringe Field Switching (FFS) mode, Optically Compensated Bend (OCB) mode, etc.

The cured film of the present invention can also be used in a liquid crystal display device of a color filter on Array (COA) type, for example, as an organic insulating film of JP-A-2005-284291. (115), or an organic insulating film (212) of JP-A-2005-346054. Moreover, the specific alignment of the liquid crystal alignment film which can be taken by the liquid crystal display device of the present invention includes a rubbing alignment method, a light alignment method, and the like. Further, the polymer alignment support can be carried out by the Polymer Sustained Alignment (PSA) technique described in JP-A-2003-149647 or JP-A-2011-257734.

Further, the curable composition of the present invention and the cured film of the present invention are not limited to the above applications, and can be used in various applications. For example, in addition to the planarization film or the interlayer insulating film, it may be preferably used for a protective film, a spacer for holding a liquid crystal layer in a liquid crystal display device at a certain thickness, or a color for a solid-state imaging device. Microlenses and the like on the filter.

FIG. 2 is a conceptual cross-sectional view showing an example of an active matrix type liquid crystal display device 10. The color liquid crystal display device 10 has a backlight unit on the back surface In the liquid crystal panel of the liquid crystal panel of 12, the elements of the TFT 16 corresponding to all the pixels disposed between the two glass substrates 14 and the glass substrate 15 to which the polarizing film is attached are disposed. The wiring of the ITO transparent electrode 19 forming the pixel electrode is formed by the contact hole 18 formed in the cured film 17 for each element formed on the glass substrate. On the ITO transparent electrode 19, a layer of the liquid crystal 20 and a red-green-blue (RGB) color filter 22 in which a black matrix is disposed are provided.

The light source of the backlight is not particularly limited, and a known light source can be used. For example, a white LED, a multicolor LED such as blue/red/green, a fluorescent lamp (cold cathode tube), an organic EL, or the like can be given.

Further, the liquid crystal display device can be set to a three-dimensional (3D) (stereoscopic) type, or can be set to a touch panel type. In addition, the second interlayer insulating film (48) described in JP-A-2011-145686 or the interlayer insulating film described in JP-A-2009-258758 can be used. (520).

The touch panel type is exemplified by an in-cell type (for example, FIG. 5, FIG. 6, FIG. 7, and FIG. 8 of Japanese Patent Laid-Open Publication No. 2012-517051), and an on-cell type. (For example, FIG. 14 of Japanese Patent Laid-Open Publication No. 2012-43394, FIG. 2(b) of International Publication No. 2012/141148), One Glass Solution (OGS) type, single-layer capacitive touch Touch On Lens (TOL) type and other configurations (for example, FIG. 6 of Japanese Patent Laid-Open Publication No. 2013-164871).

In addition, FIG. 3 is a conceptual view showing an example of a liquid crystal display device having a touch panel function.

For example, the cured film of the present invention is suitable for use as a protective film between the layers in FIG. 3, and is also suitable for use in an interlayer insulating film which separates the detecting electrodes of the touch panel. Furthermore, the detecting electrodes of the touch panel are preferably silver, copper, aluminum, titanium, molybdenum, or alloys of the metals.

In Fig. 3, 110 denotes a pixel substrate, 140 denotes a liquid crystal layer, 120 denotes a counter substrate, and 130 denotes a sensor portion. The pixel substrate 110 has a polarizing plate 111, a transparent substrate 112, a common electrode 113, an insulating layer 114, a pixel electrode 115, and an alignment film 116 in this order from the lower side of FIG. The counter substrate 120 has an alignment film 121, a color filter 122, and a transparent substrate 123 in this order from the lower side of FIG. The sensor unit 130 has a retardation film 124, an adhesion layer 126, and a polarizing plate 127, respectively. In addition, in Fig. 3, 125 is a detecting electrode for a sensor. The cured film of the present invention can be used for an insulating layer (114) (also referred to as an interlayer insulating film) of a pixel substrate portion, various protective films (not shown), various protective films (not shown) of a pixel substrate portion, and Various protective films (not shown) to the substrate portion, various protective films (not shown) of the sensor portion, and the like.

Further, in the liquid crystal display device of the static driving method, a design pattern can be displayed by applying the present invention. As an example, the present invention can be applied as an insulating film of a polymer network type liquid crystal as described in JP-A-2001-125086.

4 is a conceptual view showing a configuration of another example of a liquid crystal display device having a touch panel function.

The liquid crystal display device includes a lower display panel 200 corresponding to a thin film transistor display panel including a thin film transistor (TFT) 440, and a lower display panel 200 And an upper display panel 300 corresponding to the color filter display panel having a plurality of color filters 330 on a surface facing the lower display panel 200, and a lower display panel 200 and an upper display panel 300. Liquid crystal layer 400. The liquid crystal layer 400 contains liquid crystal molecules (not shown).

The lower display panel 200 includes a first insulating substrate 210, a thin film transistor (TFT) disposed on the first insulating substrate 210, an insulating film 280 formed on the upper surface of the thin film transistor (TFT), and an insulating film 280. The upper pixel 290. The thin film transistor (TFT) may include a gate electrode 220, a gate insulating film 240 covering the gate electrode 220, a semiconductor layer 250, an ohmic contact layer 260, an ohmic contact layer 262, a source electrode 270, and a drain electrode 272.

In the insulating film 280, a contact hole 282 is formed such that the drain electrode 272 of the thin film transistor (TFT) is exposed.

The upper display panel 300 includes: a light blocking member 320 disposed on one surface of the second insulating substrate 310 and arranged in a matrix; a color filter 330 disposed on the second insulating substrate 310; and a color filter disposed on the color filter A common electrode 370 that applies a voltage to the liquid crystal layer 400 corresponding to the pixel electrode 290 of the lower display panel 200.

In the liquid crystal display device shown in FIG. 4, the sensing electrode 410, the insulating film 420, the driving electrode 430, and the protective film 280 are disposed on the other surface of the second insulating substrate 310. As described above, in the manufacture of the liquid crystal display device shown in FIG. 4, when the upper display panel 300 is formed, the sensing electrode 410, the insulating film 420, and the driving which are constituent elements of the touch screen can be collectively formed. Electrode 430 and the like. Especially the invention A cured film obtained by hardening the curable composition can be preferably used for the insulating film 420.

[Examples]

The invention is more specifically illustrated by the following examples. The materials, the amounts used, the ratios, the processing contents, the processing order, and the like shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In addition, unless otherwise indicated, "part" and "%" are the quality standards.

<Synthesis Example 1: Synthesis of A-5>

50.4 g of hexamethylene diisocyanate trimer (manufactured by Asahi Kasei Co., Ltd., TPA-100) and dipentaerythritol pentaacrylate (obtained by column purification of Aldrich manufacturer) 157.4 g in toluene solvent Into the mixture, 0.2 g of U-CAT SA 102 (manufactured by San-apro Co., Ltd.) as a hardening catalyst was added, and the mixture was heated at 60 ° C for 6 hours under a nitrogen atmosphere.

After standing to cool, the reaction mixture was purified by silica gel column chromatography, and fractionated to give 15-functional urethane amide A-5.

[化15]

<Synthesis Example 2: Synthesis of A-6>

In the same manner as in Synthesis Example 1, except that the hexamethylene diisocyanate trimer in the synthesis example 1 was changed to hexamethylene diisocyanate (manufactured by Tokyo Chemical Industry Co., Ltd.), 10 functional groups were obtained in the same manner as in Synthesis Example 1. Acrylic urethane A-6.

[Chemistry 16]

<Acrylic urethane acrylate>

A-1: NK Oligo U-15HA (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) with a functional base of 15

A-2: UA-306H (manufactured by Kyoeisha Chemical Co., Ltd.), with a functional base of 6

A-3: Laromer UA-9050 (manufactured by BASF) with a functional base of 8

A-4: NK Oligo U-10HA (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) with a functional group of 10

A-5: Synthesis Example 1, the number of functional groups is 15.

A-6: Synthesis Example 2, the number of functional groups is 10

A'-1: NK Oligo U-2PPA (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) with a functional base of 2

<Acrylate>

A'-2: dipentaerythritol hexaacrylate (DPHA, manufactured by Nippon Kayaku Co., Ltd.)

<Free radical polymerization initiator>

B-1: Compound 1 (synthetic product, see below), oxime ester compound

B-2: IRGACURE OXE-01 (manufactured by BASF), an oxime ester compound, the following structure

B-3: IRGACURE OXE-02 (manufactured by BASF), an oxime ester compound, the following structure

B-4: IRGACURE 907 (manufactured by BASF), aminoalkyl phenone compound

<Alkoxydecane compound>

C-1: KBM-403 (3-glycidoxypropyltriethoxydecane, manufactured by Shin-Etsu Chemical Co., Ltd.)

C-2: KBM-5103 (3-acryloxypropyltrimethoxydecane, manufactured by Shin-Etsu Chemical Co., Ltd.)

<organic solvent>

D-1: propylene glycol monomethyl ether acetate (manufactured by Daicel)

D-2: methylethyl diethylene glycol (manufactured by Daicel)

D-3: 1,3-butanediol diacetate

D-4: tetrahydrofurfuryl alcohol

<Inorganic Particles>

E-1: PMA-ST (manufactured by Nissan Chemical Industries Co., Ltd.), cerium oxide particles, with an average particle diameter of 10 nm to 15 nm

E-2: MIBK-ST-L (manufactured by Nissan Chemical Industry Co., Ltd.), cerium oxide particles, with an average particle diameter of 40 nm to 50 nm

<Multifunctional thiol compound>

S-1: Karenz MT-PE-1 (pentaerythritol tetrakis(3-mercaptobutyrate), manufactured by Showa Denko Co., Ltd.), functional group 4

S-2: Karenz MT-BD-1 (1,4-bis(3-mercaptobutyloxy)butane, manufactured by Showa Denko Co., Ltd.), having a functional group of 2

<blocking isocyanate compound>

S-3: Takenate B870N (Isophorone of Isophorone Diisocyanate, manufactured by Mitsui Chemicals Co., Ltd.)

S-4: Duranate 17B-60P (a blocked isocyanate compound having a biuret structure and a blocked structure of an oxime ester structure, manufactured by Asahi Kasei Chemicals Co., Ltd.)

<Surfactant>

W-1: Megafac F554 (made by DiCai (DIC) Co., Ltd.), fluorine-based surfactant

W-2: FTX-218 (manufactured by Neos), surfactant

<sensitizer>

I-1: DBA (dibutoxy oxime of the following structure) (manufactured by Kawasaki Chemical Industry Co., Ltd.)

<antioxidant>

J-1: Adekastab AO-60 (hindered phenolic antioxidant, manufactured by ADEKA)

<Polymerization inhibitor>

K-1: Phthathiazine

<thioether compound>

L-1: a compound of the following structure

(wherein Bu represents butyl)

[Chemistry 19]

(wherein Et represents ethyl)

<Synthesis of Compound 1 (B-1)> <<Synthesis of Compound A>>

Ethylcarbazole (100.0 g, 0.512 mol) was dissolved in 260 ml of chlorobenzene, and after cooling to 0 ° C, aluminum chloride (70.3 g, 0.527 mol) was added. Then, o-toluene chloride (81.5 g, 0.527 mol) was added dropwise over 40 minutes, and the mixture was warmed to room temperature (25 ° C, the same below) and stirred for 3 hours. Then, after cooling to 0 ° C, aluminum chloride (75.1 g, 0.563 mol) was added. 4-Chlorobutylphosphonium chloride (79.4 g, 0.563 mol) was added dropwise over 40 minutes, and the mixture was warmed to room temperature and stirred for 3 hours. A mixed solution of 156 ml of a 35 mass% hydrochloric acid aqueous solution and 392 ml of distilled water was cooled to 0 ° C, and the reaction solution was added dropwise. The precipitated solid was suction-filtered, washed with distilled water and methanol, and recrystallized from acetonitrile to obtain Compound A (yield: 164.4 g, yield: 77%).

[Chemistry 20]

<<Synthesis of Compound B>>

The obtained Compound A (20.0 g, 47.9 mmol) was dissolved in 64 ml of tetrahydrofuran (THF), and 4-chlorobenzenethiol (7.27 g, 50.2 mmol) and sodium iodide (0.7 g, 4.79 mmol) were added. Then, sodium hydroxide (2.0 g, 50.2 mmol) was added to the reaction liquid, and the mixture was refluxed for 2 hours. Then, after cooling to 0 ° C, SM-28 (11.1 g, 57.4 mmol, 28% methanol solution of sodium methoxide, manufactured by Wako Pure Chemical Industries, Ltd.) was added dropwise over 20 minutes, and the mixture was warmed to room temperature and stirred for 2 hours. . Then, after cooling to 0 ° C, isoamyl nitrite (6.73 g, 57.4 mmol) was added dropwise over 20 minutes, and the mixture was warmed to room temperature and stirred for 3 hours. The reaction solution was diluted with 120 ml of acetone and added dropwise to a 0.1N aqueous hydrochloric acid solution cooled to 0 °C. The precipitated solid was subjected to suction filtration, and then washed with distilled water. Then, recrystallization was carried out using acetonitrile to obtain Compound B having the following structure (yield: 17.0 g, yield: 64%).

[Chem. 21]

<<Synthesis of Compound 1>>

Compound B (18.0 g, 32.4 mmol) was dissolved in 90 ml of N-methylpyrrolidone (NMP), and triethylamine (Et ₃ N, 3.94 g, 38.9 mmol) was added. Then, after cooling to 0 ° C, acetamidine chloride (AcCl, 3.05 g, 38.9 mmol) was added dropwise over 20 minutes, and the mixture was heated to room temperature and stirred for 2 hours. The reaction liquid droplets were added to 150 ml of distilled water cooled to 0° C., and the precipitated solid was suction-filtered, and then washed with 200 ml of isopropanol cooled to 0° C., and dried to obtain Compound 1 (yield 19.5). g, yield 99%).

[化22]

Further, the structure of the obtained Compound 1 was identified by Nuclear Magnetic Resonance (NMR).

¹ H-NMR (400 MHz, CDCl ₃ ): δ = 8.86 (s, 1H), 8.60 (s, 1H), 8.31 (d, 1H, J = 8.0 Hz), 8.81 (d, 1H, J = 8.0 Hz) , 7.51 - 7.24 (m, 10H), 7.36 (q, 2H, 7.4 Hz), 3.24 - 3.13 (m, 4H), 2.36 (s, 3H), 2.21 (s, 3H), 1.50 (t, 3H, 7.4) Hz).

(Examples 1 to 19 and Comparative Examples 1 to 3) <Preparation of hardenable composition>

A solution and/or a dispersion of each component prepared and stirred in an organic solvent as described in the following Tables 1 and 2, and filtered by a filter made of polytetrafluoroethylene having a pore diameter of 0.3 μm to obtain the hardening of the present invention. Sexual composition. The unit of each component of the following table is a part by mass in addition to the solid content concentration. Further, the organic solvent means a part by mass in terms of solid content.

<Evaluation of pencil hardness>

Each of the prepared curable compositions was spin-coated on a glass substrate, and prebaked at 90 ° C for 120 seconds to obtain a coating film having a film thickness of 2.0 μm. Then, light irradiation of 500 mJ/cm ² (i-ray conversion) was performed by a high-pressure mercury lamp, and baking was performed at 120 ° C for 60 minutes in an oven to prepare a cured film.

The obtained cured film was subjected to a pencil hardness test by a method in accordance with JIS K5600 (load weight: 750 g) to evaluate the film strength. 2H or more is a practical range.

As shown in Tables 1 and 2, the curable composition of the present invention has high hardness even when it is cured at a low temperature.

<Production of display device>

In the display device shown in FIG. 4, the curable composition obtained in each of the examples of the present invention was used for a touch detection electrode protective film (insulating film, 420), and a display device was produced. Specifically, the protective film (420) is formed by ink-jet coating the curable composition obtained in each of the examples of the present invention, and pre-baking at 90 ° C for 120 seconds, by high pressure The mercury lamp was irradiated with light of 500 mJ/cm ² (i-ray conversion), and further baked at 120 ° C for 60 minutes in an oven. The other part of the display device is produced in accordance with the manufacturing method described in FIG. 19 of Japanese Laid-Open Patent Publication No. 2013-168125. The display device produced is excellent in display performance and touch detection performance.

110‧‧‧ pixel substrate

111, 127‧‧‧ polarizing plate

112, 123‧‧‧ Transparent substrate

113‧‧‧Common electrode

114‧‧‧Insulation

115‧‧‧ pixel electrodes

116, 121‧‧‧ alignment film

120‧‧‧ opposite substrate

122‧‧‧Color filters

124‧‧‧ phase difference film

125‧‧‧Detector electrodes for sensors

126‧‧‧Next layer

130‧‧‧Sensor Department

140‧‧‧Liquid layer

Claims (14)

A curable composition comprising a polymerizable compound having an ethylenically unsaturated bond, a polymerization initiator, an alkoxydecane compound, and an organic solvent, and a solid which excludes inorganic substances from the total solid content of the composition In the component, the ratio of the 6-functional or higher (meth)acrylic acid urethane is 70% by mass to 100% by mass. The curable composition according to claim 1, further comprising inorganic particles. The curable composition according to claim 1 or 2, wherein the polymerization initiator comprises an oxime ester compound. The curable composition according to claim 1 or 2, wherein the polymerizable compound having an ethylenically unsaturated bond contains the functional group other than the 6-functional or higher (meth)acrylic acid urethane A polymerizable compound having an ethylenically unsaturated bond. The curable composition according to claim 1 or 2, further comprising a polyfunctional mercapto compound. The curable composition according to claim 1 or 2, further comprising a blocked isocyanate compound. A method for producing a cured film, comprising: coating a curable composition as described in claim 1 or 2 a step on the substrate; a step of removing the solvent from the applied hardenable composition; and a step of performing thermal hardening. The method for producing a cured film according to claim 7, wherein the heat hardening temperature in the step of performing thermal hardening is 150 ° C or lower. The method for producing a cured film according to claim 7, wherein the step of performing total exposure is further included after the step of removing the solvent and before the step of performing thermal curing. A cured film obtained by curing a curable composition according to the first or second aspect of the invention. The cured film according to claim 10, which is a protective film. The cured film according to claim 10, wherein the pencil hardness at a load of 750 g measured according to Japanese Industrial Standard K5600 is 2H or more. An organic electroluminescence display device having the cured film according to claim 10 of the patent application. A liquid crystal display device having the cured film according to claim 10 of the patent application.