TW201519756A - Circuit board structure for isolating signal interference - Google Patents

Abstract

The present invention relates to a circuit board structure for isolating signal interference, which is mainly composed of the lamination including a first circuit layer (TOP layer), a second circuit layer (GND layer), a third circuit layer (VCC layer), and a fourth circuit layer (BOT layer), wherein the first circuit layer comprises a plurality (four pairs) of grounding pair sets arranged in parallel. Each grounding pair set is independently disposed and not connected to the others. A first and a second grounding portions, which are adjacent and electrically connected to each other, are defined on the grounding pair set. In addition, the second circuit layer has a cutting portion at a position relative to each grounding pair set. As such, through the design of the first and second grounding portions, decays can be suppressed while signals will not interfere with each other due to the cutting portion. Furthermore, the second circuit layer has a design of a hollow portion, so as to effectively balance impedance.

Description

Circuit board structure for isolating signal interference

The invention provides a circuit board structure, in particular to a circuit board structure capable of suppressing attenuation, preventing signal interference from interfering with each other and balancing impedance.

Press, the use of electrical connectors has been quite extensive, whether it is USB or HDMI or coaxial cable connectors, etc., have been widely used by the public, however, the commonly used connector circuit board structure, where the ground ( GND) is mostly combined with the negative pole of the power supply. The biggest disadvantage of this method is that serious signal interference problems also occur.

Therefore, how to solve the above problems and deficiencies in the above-mentioned applications, that is, the inventors of the present invention and those involved in the industry are eager to study the direction of improvement.

Therefore, the inventors of the present invention have collected the relevant information in view of the above-mentioned deficiencies, and through multi-party evaluation and consideration, and through years of experience accumulated in the industry, through continuous trial and modification, the design can suppress such attenuation. Invention patents for circuit board structures that do not interfere with each other and balance impedance with signal interference.

The main object of the present invention is to suppress the attenuation through the design of the first and second grounding portions, and to make the signals not interfere with each other through the cutting portion, and the second circuit layer also has a bare space design. To effectively balance the impedance.

The main structure for achieving the above purpose includes a first circuit layer, a second circuit layer disposed on one side of the first circuit layer, a third circuit layer disposed on the other surface of the second circuit layer, and a second circuit layer disposed away from the second circuit layer A fourth circuit layer at the circuit level, wherein each layer is characterized by: The first circuit layer includes a plurality of ground pair groups arranged in parallel, each of the ground pair groups being independently disposed and not connected to each other, and two adjacent and electrically connected groups are defined on the ground pair group One And a second grounding portion, and a differential signal pair group is disposed at one side of the grounding pair, and each of the differential signal pair groups respectively includes a first signal portion and a second signal portion that are independently disconnected, and the differential signal The two sides of the group respectively have a pair of ground base pairs extending from both sides of the ground pair group, and similarly, the ground base pairs are not connected to each other.

The second circuit layer includes a cutting portion located between the positions of the corresponding ground pair groups, and the cutting portion is in a non-conducting form, and the side of the second circuit layer is paired with the grounding base. One end is electrically connected, and has a bare space at a position corresponding to each of the differential signal pair groups. Similarly, the bare space portion is in a non-conductive form.

The third circuit layer belongs to a VCC power supply layer.

The fourth circuit layer is linked to the differential signal pair information.

Therefore, when the present invention is to be electrically conductive, the cores of the two differential signal coaxial lines are electrically connected to the first signal portion and the second signal portion of the differential signal pair, respectively. The woven mesh of the outer layer of the same axis is electrically connected to the first grounding portion and the second grounding portion. If there are four pairs of grounding pairs, four pairs of differential signal coaxial lines are indicated, so that the design of the common grounding portion and the cutting portion is utilized. The way to achieve the advantages of the signals do not interfere with each other and suppress the attenuation, and the design of the bare space to achieve the advantage of balanced impedance.

With the above technology, it is possible to break through the problem of serious signal interference problems existing in the conventional connector circuit board, and achieve the practical progress of the present invention as the above advantages.

1‧‧‧First circuit layer

11‧‧‧ Grounding pair

111‧‧‧First grounding

112‧‧‧Second grounding

113‧‧‧ Grounding base pair

12‧‧‧Differential signal pair group

121‧‧‧First Signal Department

122‧‧‧Second Signal Department

2‧‧‧Second circuit layer

21‧‧‧ Cutting Department

22‧‧‧ naked room

3‧‧‧ third circuit layer

4‧‧‧ fourth circuit layer

5‧‧‧ coaxial line

51‧‧‧First coaxial cable

511‧‧‧First weaving net

512‧‧‧First core

52‧‧‧Second coaxial cable

521‧‧‧Second weaving net

522‧‧‧second core

The first figure is a side cross-sectional view of the circuit board structure of the present invention.

The second figure is a plan view of the first circuit layer of the present invention.

The third figure is a plan view of the second circuit layer of the present invention.

The fourth figure is a plan view of the third circuit layer of the present invention.

Figure 5 is a plan view of the fourth circuit layer of the present invention.

The sixth figure is a schematic diagram of the implementation of the circuit board combined with the coaxial line of the present invention.

In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention.

Please refer to the first to fifth figures, which are side sectional views of the circuit board structure of the present invention, a plan view of the first circuit layer, a plan view of the second circuit layer, a plan view of the third circuit layer, and a fourth circuit layer. The plan view clearly shows that the present invention comprises: a first circuit layer 1, the first circuit layer 1 comprises a plurality of ground pair groups 11 arranged in parallel, and a plurality of the ground pair groups 11 are respectively defined. a first grounding portion 111, and a plurality of second grounding portions 112 respectively defined on each of the grounding pair groups 11 and disposed adjacent to the first grounding portion 111, wherein the second grounding portion 112 is The first grounding portion 111 is electrically connected to each other, and each of the grounding pair groups 11 are independently and non-connected; a plurality of differential signal pair groups 12 arranged in parallel are arranged, and each of the differential signal pair groups 12 is respectively disposed on the grounding pair. Each of the differential signal pair groups 12 includes a first signal portion 121 and a second signal portion 122 disposed adjacent to the first signal portion 121, and the first signal portion 121 and the second portion. The signal sections 122 are independently disconnected; the plurality of grounding pairs are respectively 11 The side extends to surround the differential signal pair group 12 and the adjacent grounding base pair pair 113, and each of the ground base pair groups 113 are independently and non-connected; a second circuit disposed at one side of the first circuit layer 1 The layer 2 and the second circuit layer 2 include a plurality of cutting portions 21 of non-conducting form, and the positions of the cutting portions 21 are correspondingly located between the pair of grounding base pairs 113, and the side of the second circuit layer 2 is The grounding base is electrically connected to one end of the group 113, and the second circuit layer 2 has a plurality of bare portions 22 respectively corresponding to the positions of the differential signal pairs 12, and the bare portion 22 is in a non-conducting form; a third circuit layer 3 disposed on a side of the second circuit layer 2 away from the first circuit layer 1; and a fourth circuit layer 4 disposed on a side of the third circuit layer 3 facing away from the second circuit layer 2, fourth The circuit layer 4 is linked to each of the differential signal pair groups 12.

Please also refer to the second, third and sixth figures, which are the plan view of the first circuit layer, the plan view of the second circuit layer and the implementation diagram of the circuit board combined with the coaxial line. It can be clearly seen from the figure. When implementing the present invention, one of the cores of a pair of coaxial wires 5 (that is, two coaxial wires) is first electrically connected to the first signal portion 121, and the other core is connected to the second signal portion. 122 electrical connection, therefore, the two cores are independent and not connected, however, while connecting the core, The outer woven mesh is electrically connected to the ground pair.

Further, the woven mesh connection method is further described in detail, wherein the pair of coaxial wires 5 include a first coaxial wire 51 and a second coaxial wire 52, and the first coaxial wire 51 further includes a first woven mesh 511 and a first wire core. 512, the second coaxial wire 52 further includes a second woven mesh 521 and a second core 522. Therefore, when the circuit board is connected, the first core 512 and the second core 522 can be respectively connected to the first ground. The first woven mesh 511 and the second woven mesh 521 are electrically connected to each other, and the first woven mesh 511 and the second woven mesh 521 are respectively connected to the first grounding portion 111. The second grounding portion 112 is electrically connected, and the first grounding portion 111 and the second grounding portion 112 are connected together, so that the grounding of the first coaxial line 51 and the second coaxial line 52 are commonly connected together. But the signal ends are separate.

Another important point is that the grounding base pair group 113 sandwiches the differential signal pair 12 in the middle.

When the operation is performed, since the first grounding portion 111 and the second grounding portion 112 are connected together, and the grounding base pair group 113 is sandwiched between the differential signal pair group 12, the electronic characteristics can be achieved. The anti-attenuation characteristic is better. Similarly, since the cutting portion 21 is ingeniously disposed in the middle of each of the grounding pair groups 11, the signals on both sides are effectively isolated, so that the noise does not interfere with each other, and the bare space is left. 22 is also cleverly placed directly below the differential signal pair 12, which also effectively isolates the noise.

However, the above description is only the preferred embodiment of the present invention, and thus it is not intended to limit the scope of the present invention. Therefore, the simple modification and equivalent structural changes of the present specification and the drawings should be treated similarly. It is included in the scope of the patent of the present invention and is combined with Chen Ming.

In summary, the circuit board structure of the isolated signal interference of the present invention can achieve its efficacy and purpose when used. Therefore, the present invention is an invention with excellent practicability, and is an application for conforming to the invention patent, To file an application, I hope that the review committee will grant the invention as soon as possible to protect the inventor's hard work. If there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate and feel polite.

1‧‧‧First circuit layer

11‧‧‧ Grounding pair

111‧‧‧First grounding

112‧‧‧Second grounding

113‧‧‧ Grounding base pair

12‧‧‧Differential signal pair group

121‧‧‧First Signal Department

122‧‧‧Second Signal Department

Claims (6)

A circuit board structure for isolating signal interference, comprising: a first circuit layer, the first circuit layer comprising: a plurality of ground pair groups arranged in parallel, each of the ground pair groups being independently and not connected; a first grounding portion respectively defined on each of the pair of grounding pairs; and a plurality of second grounding portions respectively defined on each of the pair of grounding pairs and adjacently disposed at a side of the first grounding portion, the first The two grounding portions are electrically connected to the first grounding portion. The circuit board structure of the isolated signal interference according to claim 1, further comprising: a plurality of differential signal pair groups arranged in parallel, each of the differential signal pair groups being respectively disposed at one side of the ground pair group, and each The first signal portion and the second signal portion adjacent to the first signal portion are respectively connected to each other, and the first signal portion and the second signal portion are independently disconnected; A plurality of grounding base pair groups respectively extending from the two sides of the pair of grounding pairs and adjacent to each other, and each of the grounding base pair groups are independently and non-connected. The device of claim 2, wherein the first circuit layer is provided with a second circuit layer on one side, and the second circuit layer includes a plurality of non-conductive forms of the cutting portion, and each of the The position of the cutting portion is correspondingly located between the pair of grounding base pairs, and the side of the second circuit layer is electrically connected to one end of the pair of grounding bases. The device of claim 3, wherein the second circuit layer is provided with a third circuit layer on a side of the first circuit layer, and the third circuit layer is a power circuit layer. The device of claim 4, wherein the third circuit layer is disposed at a side of the second circuit layer opposite to the second circuit layer, and the fourth circuit layer is associated with each of the differential signal pairs. link. The circuit board structure of the interference signal interference according to claim 3, wherein the second circuit layer has a plurality of bare spaces corresponding to the positions of the differential signal pairs, and the bare space is in a non-conducting form. .