TW201519725A - Semifinished electric device, electric device and menufacturing method thereof - Google Patents

Abstract

A manufacturing method of an electric device includes following steps. A carrying plate is provided. A thin film is formed on the carrying plate. A substrate is formed on the thin film. An electric device layer is formed on the substrate. The thin film is dissolved by a solvent, wherein the solvent can dissolve the thin film and can't dissolve the substrate. Moreover, a semifinished electric device and an electric device manufactured by the manufacturing method are also provided.

Description

Electronic component semi-finished product, electronic component and manufacturing method thereof

The present invention relates to an electronic component semi-finished product, an electronic component, and a method of manufacturing the same.

Due to its advantages of light weight, impact resistance, flexibility, wearability and portability, flexible electronic components have become a new generation of forward-looking technology. However, in the current process of flexible electronic components, the main technical bottleneck is how to make the electronic component layer on the flexible substrate.

In the prior art, the flexible substrate is attached to the rigid substrate by using the release film. After the electronic component layer on the flexible substrate is completed, the electronic component layer and the flexible substrate are removed from the rigid substrate to complete. Flexible electronic components. However, in the process of removing the electronic component layer and the flexible substrate from the rigid substrate, the electronic component layer may be flexed and easily damaged. In addition, when the material of the flexible substrate (for example, a thin glass substrate) and the rigid substrate (for example, a hard glass substrate) are the same, the above-mentioned release film is made flexible. Electronic components may not be implemented.

The present invention provides a method of manufacturing an electronic component in which a substrate having the same or different materials and a carrier are separated by the method of manufacturing the electronic component, thereby producing various electronic components.

A method of manufacturing an electronic component of the present invention comprises the following steps. A carrier board is provided. A film layer is formed on the carrier. A substrate is formed on the film layer. An electronic component layer is formed on the substrate. The solvent layer dissolves the film layer in which the solvent dissolves the film layer and does not dissolve the substrate. The electronic component layer can be formed by one or more processes, such as a yellow lithography process, an inkjet process, or a printing process. In other words, the electronic component can be formed by a stacked architecture of multiple layers of patterned film layers. The electronic component layer is, for example, a touch sensor circuit or a display circuit.

An electronic component semi-finished product according to the present invention includes a carrier, a substrate disposed on the carrier, a film layer disposed between the carrier and the substrate, and an electronic component layer. The substrate is disposed between the electronic component layer and the film layer. The film layer can be dissolved in the solvent, and the substrate cannot be dissolved in the solvent. The solvent is used in subsequent processes of electronic component semi-finished products.

An electronic component of the present invention includes a substrate, an electronic component layer disposed on the substrate, and a residual film layer. The substrate is disposed between the electronic component layer and the remaining film layer, and the remaining film layer is a photosensitive polyimide.

An electronic component of the present invention includes a flexible substrate, an electronic component layer, and a photosensitive material. The thickness of the flexible substrate ranges from 5 micrometers (μm) to 100 micrometers. The flexible substrate has a surface and another surface opposite the surface. Electronic component layer Placed on the surface of the flexible substrate. The photosensitive material is on the other surface of the flexible substrate.

In an embodiment of the invention, the photosensitive material is a residual film layer. The flexible substrate is disposed between the electronic component layer and the remaining film layer. The residual film layer is a photosensitive polyimide.

In an embodiment of the invention, the electronic component layer is formed by a stacked structure of a plurality of patterned thin film layers.

In an embodiment of the invention, the electronic component layer is a touch sensing circuit or a display circuit.

In an embodiment of the invention, the electronic component is attached to the rigid substrate by an adhesive layer.

In an embodiment of the invention, the hard substrate is a cover sheet. A decorative layer is provided on at least one side surface of the cover sheet facing the electronic component layer.

In an embodiment of the invention, the hard substrate is a tempered glass substrate or a plastic substrate.

In an embodiment of the invention, at least a portion of the surface of the hard substrate facing the adhesive layer is a curved surface.

In an embodiment of the invention, the carrier plate has at least a uniform hole, and the step of forming a film layer on the carrier plate is: forming a film layer covering the through hole on the carrier plate.

In an embodiment of the invention, the step of dissolving the film layer by the solvent is such that the solvent penetrates the film layer from the through hole.

In an embodiment of the invention, the solvent penetrates the film from the through hole The steps are as follows: the carrier and at least the consistent holes are immersed in the solvent and the electronic component layer is not immersed in the solvent.

In an embodiment of the invention, the step of dissolving the film layer by the solvent is such that the carrier, the film layer, the substrate, and the electronic component layer are not mixed with the solvent.

In an embodiment of the invention, the step of forming the substrate on the film layer is: attaching the substrate to the film layer by using an adhesive layer; or directly forming the substrate on the film layer.

In an embodiment of the invention, the method of manufacturing the electronic component further includes removing the adhesive layer after dissolving the film layer with a solvent.

In an embodiment of the invention, the film layer is a photosensitive polyimide having the following formula (I), Wherein A is a tetravalent organic group containing at least one modifying group R ₁ , B and D are the same or different divalent organic groups, and C is a tetravalent organic group not containing a modifying group R ₁ , m An integer greater than 0, n is an integer equal to 0 or greater than 0, wherein the modifying group R ₁ is a group selected from the group consisting of:

Wherein R ₂ is an ethylenically unsaturated group.

In an embodiment of the invention, the film layer is a photosensitive polyimide having the following formula (II), Wherein B and D may be the same or different, each independently being a divalent organic group; A is a tetravalent organic group containing at least one modifying group R', and J is a tetravalent organic having no modifying group R' a group, n is equal to 0 or an integer greater than 0, m is an integer greater than 0, and R' is selected from the group consisting of: Wherein R represents an unsaturated group containing a vinyl group or a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted saturated or unsaturated organic group having C1-C20, and R2 is an unsaturated group containing a vinyl group.

In an embodiment of the invention, the film layer is a photosensitive polyimide having the following formula (III), Wherein A and C may be the same or different and each independently is a tetravalent organic group; and B is at least one selected from the group consisting of: a divalent organic group, wherein R is a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted C1-C20 saturated or unsaturated organic group, and R2 is a vinyl-containing unsaturated group; D is independently a divalent organic group; n is greater than 0 An integer, and m equals 0 or an integer greater than zero.

In an embodiment of the invention, the substrate includes the material described in the following formula (IV). Wherein x is an integer greater than 192 such that the material of the substrate is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper and lower molecular weights are dependent on the extent to which the monomer continues to react, and are not limited.

In an embodiment of the invention, the substrate includes the material described in the following formula (V). Wherein n is an integer of an integer greater than 104 such that the material of the substrate is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper limit of the maximum molecular weight depends on the extent to which the monomer continues to react, and is not limited.

In an embodiment of the invention, the substrate includes the material described in the following formula (VI). --- (VI), wherein m is an integer greater than 216, such that the material of the above substrate is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper limit of the maximum molecular weight depends on the extent to which the monomer continues to react, and is not limited.

In an embodiment of the invention, the solvent is an organic solvent having a ketone.

In an embodiment of the invention, the carrier plate has at least a uniform aperture, and the film layer covers the through hole.

In an embodiment of the invention, the electronic component semi-finished product further includes an adhesive layer disposed between the substrate and the film layer.

In the electronic component manufacturing method according to the embodiment of the present invention, at least a part of the film layer is removed by a solvent capable of dissolving the film layer and the substrate cannot be dissolved, and the substrate is separated from the carrier, thereby completing the electronic component. Due to the solvent removal film The step of the layer is independent of the characteristics of the substrate and the carrier. Therefore, the electronic component manufacturing method according to an embodiment of the present invention can be used to separate a substrate or a carrier having the same or different materials, thereby manufacturing various electronic components.

The above described features and advantages of the invention will be apparent from the following description.

110‧‧‧ Carrier Board

110a‧‧‧Tongkong

120‧‧‧ film layer

130‧‧‧Adhesive layer

200‧‧‧Electronic components

210‧‧‧Substrate

210a, 210b‧‧‧ surface

220‧‧‧Electronic component layer

222‧‧‧ patterned film layer

300‧‧‧Adhesive layer

400‧‧‧hard substrate

400a‧‧‧ surface

410‧‧‧Decorative layer

500‧‧‧ drive line

L‧‧‧Solvent

S, S’‧‧‧ semi-finished electronic components

1A to 1F are schematic cross-sectional views showing a method of manufacturing an electronic component according to a first embodiment of the present invention.

Figure 1G is a schematic illustration of an electronic component in accordance with an embodiment of the present invention.

2A to 2G are schematic cross-sectional views showing a method of manufacturing an electronic component according to a second embodiment of the present invention.

3A to 3F are schematic cross-sectional views showing a method of manufacturing an electronic component according to a third embodiment of the present invention.

First embodiment

1A to 1F are schematic cross-sectional views showing a method of manufacturing an electronic component according to a first embodiment of the present invention. Referring to FIG. 1A, first, a carrier 110 is provided. In this embodiment, the carrier 110 may have a through hole 110a. The through hole 110a can be formed by a computer numerical control (CNC) method or other suitable method. this In addition, the number of the through holes 110a is not limited to that depicted in FIG. 1. The number of the through holes 110a may be determined according to actual needs. For example, the larger the area of the substrate, the more the through holes 110a may be disposed. The carrier 110 of this embodiment may be a rigid carrier, and the material thereof is, for example, glass. However, the present invention is not limited thereto. In other embodiments, the material of the carrier 110 may be stainless steel, quartz, wafer, ceramic, or other suitable materials.

Referring to FIG. 1B, a film layer 120 is formed on the carrier 110. In detail, in the present embodiment, the film layer 120 covering the through hole 110a can be formed on the carrier 110. The film layer 120 of the present embodiment may be a photosensitive material. Further, the film layer 120 of the present embodiment may be a photosensitive polyimine having the following formula (I). Wherein A is a tetravalent organic group containing at least one modifying group R ₁ , B and D are the same or different divalent organic groups, and C is a tetravalent organic group not containing a modifying group R ₁ , m An integer greater than 0, n is an integer equal to 0 or greater than 0, wherein the modifying group R ₁ is a group selected from the group consisting of:

Wherein R ₂ is an ethylenically unsaturated group. However, the present invention is not limited thereto. In another embodiment, the film layer 120 may also be a photosensitive polyimide, a photosensitive photoresist or other suitable material having the following formula (II). Wherein B and D may be the same or different, each independently being a divalent organic group; A is a tetravalent organic group containing at least one modifying group R', and J is a tetravalent organic having no modifying group R' a group, n is equal to 0 or an integer greater than 0, m is an integer greater than 0, and R' is selected from the group consisting of: Wherein R represents an unsaturated group containing a vinyl group or a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted saturated or unsaturated organic group having C1-C20, and R2 is an unsaturated group containing a vinyl group. In still another embodiment, the film layer 120 may also be a photosensitive polyimine having the following formula (III). Wherein A and C may be the same or different and each independently is a tetravalent organic group; and B is at least one selected from the group consisting of: a divalent organic group, wherein R is a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted C1-C20 saturated or unsaturated organic group, and R2 is a vinyl-containing unsaturated group; D is independently a divalent organic group; n is greater than 0 An integer, and m equals 0 or an integer greater than zero. It should be noted that the material of the film layer 120 is for illustrative purposes, and is not intended to limit the film material of the present invention. In other embodiments, the film layer 120 may also be other suitable materials.

Referring to FIG. 1C, next, a substrate 210 is formed on the film layer 120. In the present embodiment, the substrate 210 can be formed directly on the film layer 120. Specifically, a suitable solution may be directly coated on the film layer 120, followed by curing the solution to form the substrate 210. In short, the substrate 210 can be formed by a film formation method. In this embodiment, the material of the substrate 210 and the carrier 110 may be different. However, the present invention is not limited thereto, and the material of the substrate 210 may be the same as that of the carrier 110. For example, in other embodiments, the carrier 110 may be thick glass, and the substrate 210 may be thin glass. The substrate 210 of the present embodiment is, for example, a flexible substrate, which may be made of plastic or other suitable material and may have a thickness of 5 micrometers (μm) to 100 micrometers. Further, the substrate 210 of the present embodiment may be a material described in the following formula (IV). Where x is an integer greater than 192 such that the material of the substrate 210 is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper limit of the maximum molecular weight depends on the extent to which the monomer continues to react, and is not limited. However, the present invention is not limited thereto. In another embodiment, the substrate 210 may also be a material described in the following formula (V). Wherein n is an integer greater than 104 such that the material of the substrate is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper limit of the maximum molecular weight depends on the extent to which the monomer continues to react, and is not limited. However, the present invention is not limited thereto. In still another embodiment, the substrate 210 may be a material described in the following formula (VI). --- (VI), wherein m is an integer greater than 216, such that the material of the substrate 210 is a high molecular weight film having a molecular weight of more than 80,000 or more, and the upper limit of the maximum molecular weight depends on the extent to which the monomer continues to react, and is not limited. It should be noted that the material and thickness of the substrate 210 are for illustrative purposes, and are not intended to limit the substrate material of the present invention. In other embodiments, the substrate 210 can also be a rigid substrate made of glass, quartz, wafer, ceramic, or other suitable material.

Referring to FIG. 1D, an electronic component layer 220 is formed on the substrate 210 to form an electronic component blank S. The electronic component semi-finished product S of the present embodiment includes a carrier 110, a substrate 210 disposed on the carrier 110, and a carrier 110 and a substrate. The film layer 120 between the 210 and the electronic component layer 220 are disposed between the electronic component layer 220 and the film layer 120. In the present embodiment, in the present embodiment, the electronic component layer 220 is formed by stacking a plurality of patterned thin film layers 222. The patterned film layer 222 can be a touch sensor circuit, a display circuit, or a combination thereof. However, the present invention is not limited thereto. In other embodiments, the electronic component layer 220 may also be other types of electronic component layers.

Referring to FIG. 1E and FIG. 1F, next, the film layer 120 is dissolved by the solvent L, in which the solvent L can dissolve the film layer 120 and the substrate 210 cannot be dissolved. In the present embodiment, the solvent L may be an organic solvent having a ketone type such as acetone, N-methylpyrrolidone (NMP), dimethylacetamide (DMAC), dimethylformamide ( DMF), dimethyl hydrazine (DMSO), toluene, xylene or a combination thereof. However, the present invention is not limited thereto, and the material of the solvent L is appropriately selected depending on the material of the film layer 120 and the substrate 210. For example, if the material of the film layer 120 is a photosensitive photoresist, such as 1-Methoxy-2-propanol acetate, the solvent L (ie, the stripping solution) can be correspondingly selected as Acetone, alcohol or other suitable material.

As shown in FIG. 1F, when the film layer 120 is dissolved, the carrier 110 can be naturally separated from the substrate 210, thereby completing the electronic component 200. The electronic component 200 includes a substrate 210 and an electronic component layer 220 disposed on the substrate 210. When the film layer 120 is not completely dissolved, the electronic component 200 may include a residual film layer 120. Even if the film layer 120 is almost completely dissolved and is invisible to the naked eye, the film layer 120 is once disposed on the substrate 110 of the electronic component 200 through a suitable instrument such as a gas chromatography-mass spectrometry (GC-MS). Evidence on surface 210b. The substrate 210 is disposed between the electronic component layer 220 and the remaining film layer 120. In other words, the substrate 210 has opposing two surfaces 210a, 210b. The electronic component layer 220 is disposed on the surface 210a, and the remaining film layer 120 is disposed on the surface 210b. The residual film layer 120 exposes a portion of the substrate 210.

It is worth mentioning that, by using the through hole 110a, the solvent L can effectively dissolve the film layer 120 to separate the carrier 110 and the substrate 210 without damaging the electronic component layer 220. In detail, as shown in FIG. 1E, in the present embodiment, the carrier 110 and the through hole 110a can be immersed in the solvent L and the electronic component layer 220 is not immersed in the solvent L. At this time, the solvent L can be infiltrated into the film layer 120 from the through hole 110a, and further dissolved. Through the design of the through hole 110a, the solvent L may not be in contact with the electronic component layer 220 while dissolving the film layer 120, and the electronic component layer 220 may not be damaged.

However, in other embodiments, the carrier 110 may not have the through hole 110a. Therefore, when the film layer 120 is dissolved in the embodiment in which the carrier 110 does not have the through hole 110a, the film layer 120 needs to be at least immersed in the solvent L by the solvent. L dissolves the film layer 120 from the exposed side of the film layer 120 to separate the carrier 110 from the substrate 210.

Figure 1G is a schematic illustration of an electronic component in accordance with an embodiment of the present invention. Referring to FIG. 1G , the electronic component 200 shown in FIG. 1F can be attached to the rigid substrate 400 by the adhesive layer 300 . When the electronic component 200 is attached to the rigid substrate 400, the adhesive layer 300 is located between the rigid substrate 400 and the electronic component layer 220, and the electronic component layer 220 is located between the adhesive layer 300 and the substrate 210. In other words, the electronic component 200 is attached to the rigid substrate 400 such that the surface 210b of the substrate 210 carrying the electronic component layer 220 faces the rigid substrate 400. In addition, it should be noted that FIG. 1G omits FIG. 1F remaining on the substrate. 210 depicts the residual film layer 120 of the surface 210b. The reason is that the residual film layer 120 is actually invisible to the naked eye and does not easily affect the visual perception of the user when using the electronic component 200. Although the residual film layer 120 may be invisible to the naked eye, it can still be detected by the appropriate apparatus described above.

In the embodiment, the rigid substrate 400 may be a cover plate. A decorative layer 410 is disposed on at least one side surface 400a of the cover sheet facing the electronic component layer 220. The decorative layer 410 can shield the driving line 500 electrically connected to the electronic component layer 220 and expose the electronic component layer 220. The hard substrate 400 may be a reinforced glass substrate, a plastic substrate, or another substrate of a suitable material. At least a portion of the surface 410a of the rigid substrate 400 facing the adhesive layer 300 may optionally be a curved surface. However, the invention is not limited thereto, and in other embodiments, the surface 410a may also be selectively planar.

Second embodiment

2A to 2G are schematic cross-sectional views showing a method of manufacturing an electronic component according to a second embodiment of the present invention. The electronic component manufacturing method of the present embodiment is similar to the electronic component manufacturing method of the first embodiment, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. The main difference between the electronic component manufacturing method of the present embodiment and the first embodiment is that the method of forming the substrate is different. The following illustrates the difference between the two, the two will not be repeated.

Referring to FIG. 2A, first, a carrier 110 is provided. Referring to FIG. 2B, next, a film layer 120 is formed on the carrier 110. Referring to FIG. 2C, next, a substrate 210 is formed on the film layer 120. Different from the first embodiment, in this embodiment, the adhesive can be utilized. The layer 130 attaches the substrate 210 to the film layer 120. Referring to Fig. 2D, an electronic component layer 220 is formed on the substrate 210 to form an electronic component blank S'. The electronic component semi-finished product S' of the present embodiment includes a carrier 110, a substrate 210 disposed on the carrier 110, a film layer 120 disposed between the carrier 110 and the substrate 210, and an electronic component layer 220, wherein the substrate 210 is disposed in the electronic device Between the element layer 220 and the film layer 120. Unlike the first embodiment, the electronic component blank S' further includes an adhesive layer 130 disposed between the substrate 210 and the film layer 120.

Referring to FIG. 2E and FIG. 2F, the film layer 120 is dissolved by the solvent L. As shown in FIG. 2F, when the film layer 120 is dissolved, the carrier 110 can be naturally separated from the substrate 210. Referring to FIG. 2G, the adhesive layer 130 can be removed. Specifically, in the present embodiment, the adhesive layer 130 can be dissolved by the solvent capable of dissolving the adhesive layer 130 [for example, propylene glycol methyl ether acetate (PGMEA)], and the adhesive layer 130 can be removed from the substrate 210. Here, the electronic component 200 of the present embodiment is completed.

Third embodiment

3A to 3F are schematic cross-sectional views showing a method of manufacturing an electronic component according to a third embodiment of the present invention. The electronic component manufacturing method of the present embodiment is similar to the electronic component manufacturing method of the first embodiment, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. The main difference between the electronic component manufacturing method of the present embodiment and the first embodiment is that the method of dissolving the film layer is different. The following illustrates the difference between the two, the two will not be repeated.

Referring to FIG. 3A, first, a carrier 110 is provided. Different from the first embodiment In this embodiment, the carrier 110 may have no through holes. Referring to FIG. 3B, next, a film layer 120 is formed on the carrier 110. Referring to FIG. 3C, next, a substrate 210 is formed on the film layer 120. Referring to FIG. 3D, an electronic component layer 220 is formed on the substrate 210 to form an electronic component blank S. Referring to FIG. 3E and FIG. 3F, the film layer 120 is then dissolved by the solvent L. Different from the first embodiment, when the solvent L is not easily damaged by the electronic component layer 220, the carrier 110, the film layer 120, the substrate 210, and the electronic component layer 220 (ie, the electronic component semi-finished product S) may be immersed in a solvent together. L. As shown in FIG. 3F, when the film layer 120 is dissolved, the carrier 110 can be naturally separated from the substrate 210, thereby completing the electronic component 200.

As described above, in the electronic component manufacturing method according to the embodiment of the present invention, at least a part of the film layer is removed by a solvent capable of dissolving the film layer and the substrate cannot be dissolved, and the substrate is separated from the carrier, thereby completing the electronic component. Since the step of removing the film layer by the solvent is independent of the characteristics of the substrate and the carrier, the electronic component manufacturing method according to an embodiment of the present invention can be used to separate a substrate or a carrier having the same or different materials, thereby manufacturing various electronic components.

Further, in the electronic component manufacturing method according to another embodiment of the present invention, the solvent is infiltrated into the film layer by the through hole of the carrier and further dissolved. Through the through holes, the solvent does not contact the electronic component layer when the film layer is dissolved, so that the solvent does not easily damage the electronic component layer, and the electronic component of one embodiment of the present invention has high yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of protection of the present invention This is subject to the definition of the scope of the patent application.

110‧‧‧ Carrier Board

110a‧‧‧Tongkong

120‧‧‧ film layer

210‧‧‧Substrate

210a, 210b‧‧‧ surface

220‧‧‧Electronic component layer

222‧‧‧ patterned film layer

L‧‧‧Solvent

Claims (24)

A method of manufacturing an electronic component, comprising: providing a carrier; forming a film on the carrier; forming a substrate on the film; forming an electronic component layer on the substrate; and dissolving the film with a solvent a layer in which the solvent dissolves the film layer and does not dissolve the substrate. The method of manufacturing an electronic component according to claim 1, wherein the carrier has at least a uniform hole, and the step of forming the film on the carrier is: forming a cover on the carrier to cover the at least one hole The film layer. The method for producing an electronic component according to claim 2, wherein the solvent is used to dissolve the film layer by allowing the solvent to infiltrate the film layer from the at least uniform pores. The method of manufacturing an electronic component according to claim 3, wherein the step of allowing the solvent to infiltrate the film layer from the at least a uniform hole is: displacing the carrier and the at least one of the consistent holes into the solvent The layer did not enter the solvent. The method of manufacturing an electronic component according to claim 1, wherein the step of dissolving the film layer by using the solvent is such that the carrier, the film layer, the substrate, and the electronic component layer are not dissolved together. Agent. The method of manufacturing an electronic component according to claim 1, wherein the step of forming the substrate on the film layer is: attaching the substrate to the film layer with an adhesive layer; or directly on the film The substrate is formed on the layer. The method of manufacturing an electronic component according to claim 6, wherein the step of forming the substrate on the film layer is: attaching the substrate to the film layer by using the adhesive layer, and manufacturing the electronic component The method further includes removing the adhesive layer after dissolving the film layer using the solvent. The method for producing an electronic component according to claim 1, wherein the film layer is a photosensitive polyimide having the following formula (I), Wherein A is a tetravalent organic group containing at least one modifying group R ₁ , B and D are the same or different divalent organic groups, and C is a tetravalent organic group not containing a modifying group R ₁ , m An integer greater than 0, n is an integer equal to 0 or greater than 0, wherein the modifying group R ₁ is a group selected from the group consisting of: Wherein R ₂ is an ethylenically unsaturated group. The method for producing an electronic component according to claim 1, wherein the film layer is a photosensitive polyimide having the following formula (II), Wherein B and D may be the same or different, each independently being a divalent organic group; A is a tetravalent organic group containing at least one modifying group R', and J is a tetravalent organic having no modifying group R' a group, n is equal to 0 or an integer greater than 0, m is an integer greater than 0, and R' is selected from the group consisting of: Wherein R represents an unsaturated group containing a vinyl group or a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted saturated or unsaturated organic group having C1-C20, and R2 is an unsaturated group containing a vinyl group. The method for producing an electronic component according to claim 1, wherein the film layer is a photosensitive polyimide having the following formula (III), Wherein A and C may be the same or different and each independently is a tetravalent organic group; and B is at least one selected from the group consisting of: a divalent organic group, wherein R is a group selected from the group consisting of: Wherein R1 is a substituted or unsubstituted C1-C20 saturated or unsaturated organic group, and R2 is a vinyl-containing unsaturated group; D is independently a divalent organic group; n is greater than 0 An integer, and m equals 0 or an integer greater than zero. The method for producing an electronic component according to claim 1, wherein the solvent is an organic solvent having a ketone. An electronic component semi-finished product comprising: a carrier board; a substrate disposed on the carrier board; a film layer disposed between the carrier board and the substrate; and an electronic component layer disposed on the electronic component layer Between the film layer and the film layer, the film layer can be dissolved in a solvent, and the substrate cannot be dissolved in the solvent. The electronic component semi-finished product of claim 12, wherein the carrier has at least a uniform aperture, and the membrane layer covers the at least consistent aperture. The electronic component semi-finished product according to claim 12, further comprising: an adhesive layer disposed between the substrate and the film layer. An electronic component comprising: a flexible substrate having a thickness of between 5 micrometers and 100 micrometers, the flexible substrate having a surface and another surface opposite to the surface; an electronic component layer, Disposed on the surface of the flexible substrate; and a photosensitive material on the other surface of the flexible substrate. The electronic component according to claim 15, wherein the photosensitive material is a residual film layer disposed between the electronic component layer and the residual film layer, and the residual film layer It is a photosensitive polyimine. The electronic component of claim 15, wherein the electronic component layer is formed by a stacked structure of a plurality of patterned thin film layers. The electronic component of claim 17, wherein the electronic component layer is a touch sensing circuit or a display circuit. The electronic component according to claim 18 is attached to a rigid substrate by an adhesive layer. The electronic component of claim 19, wherein the rigid substrate is a cover plate, and the cover plate is provided with a decorative layer on at least one side surface of the electronic component layer. The electronic component of claim 19, wherein the rigid substrate is a tempered glass substrate or a plastic substrate. The electronic component of claim 19, wherein at least a portion of a surface of the rigid substrate facing the adhesive layer is a curved surface. The electronic component of claim 15, wherein the photosensitive material is a photoresist. The electronic component of claim 23, wherein the component of the photoresist comprises monomethyl ether propylene glycol acetate.