TW201519713A - Pre-positioning method for printed circuit board in chip on film process and flexible printed circuit board - Google Patents

Abstract

A pre-positioning method for printed circuit board in chip on film process includes the following steps. A plurality of engaging points is defined in a flexible printed circuit board. The flexible printed circuit board is attracted by a magnetic head on the plurality of engaging points to move the flexible printed circuit board. The flexible printed circuit board is also disclosed. The pre-positioning method decreases a contact area on the flexible printed circuit board relative to a conventional sucker. Electrical elements on flexible printed circuit board cannot be interrupted by the pre-positioning method.

Description

Circuit board pre-positioning method and flexible circuit board in film flip chip

The invention relates to a circuit board pre-positioning method and a flexible circuit board, and relates to a circuit board pre-positioning method and a flexible circuit board applied in a film flip chip.

The COF (Chip On Film) process in the process of the liquid crystal panel is to heat-press the liquid crystal wafer and the driving flexible circuit board as a soft board. The conventional method is to perform displacement element and fixing by sucking a flexible circuit board by a suction cup, but as the circuit board is light and thin, the size of the circuit board is made smaller and the wiring on the circuit board is more and more dense. Since the suction cup adsorption circuit board requires at least a suction area of 3 mm in diameter, the suction cup position often collides with the dense electronic components on the circuit board when the flexible circuit board is adsorbed in a conventional manner, and it is necessary to reserve the adsorption position on the circuit board. Change the routing of the board to affect the optimization of the circuit wiring.

In view of the above, it is necessary to provide a circuit board pre-positioning method that does not affect electronic components on a circuit board in film flip-chip and a flexible circuit board that uses the method to pre-position.

A method for pre-positioning a circuit board in a film flip chip includes the following steps:

Configuring a plurality of adsorption points on a flexible circuit board; and

The flexible circuit board is moved by a plurality of magnetic heads adsorbing a plurality of adsorption points on the flexible circuit board.

Preferably, the step of setting a plurality of adsorption points on the flexible circuit board further comprises:

Select the location of the complex adsorption point;

Erasing the coating on the selected adsorption point; and

A magnetic material is added to the plurality of adsorption sites.

Preferably, the method for pre-positioning the flexible circuit board in the film flip-chip further comprises: the plurality of adsorption points being located in a space of the circuit wiring of the flexible circuit board.

Preferably, the method for pre-positioning the flexible circuit board in the film flip-chip further comprises: setting the plurality of adsorption points on both sides of a center of gravity of the flexible circuit board.

Preferably, the magnetic material is nickel.

Preferably, the plurality of magnetic heads are direct-acting reciprocating electromagnets.

A flexible circuit board having circuit wiring, wherein the flexible circuit board is provided with a plurality of adsorption points in a space of the circuit wiring, and the plurality of adsorption points face one side of the flexible circuit board Magnetic material is attached.

Preferably, the magnetic material is nickel.

Preferably, the plurality of adsorption points are located on both sides of the center of gravity of the flexible circuit board.

Compared with the prior art, the pre-positioning method of the circuit board in the film flipping adopts magnetic adsorption to move the flexible circuit board, and the moving mode of the original suction cup reduces the contact area, and does not affect the electronic components on the circuit board, and Increased space utilization of flexible circuit boards.

1 is a schematic plan view of a flexible circuit board in accordance with an embodiment of the present invention.

2 is a side elevational view of the flexible circuit board of FIG. 1.

3 is a schematic view of the flexible flexible circuit board of FIG. 1 when it is adsorbed by a magnetic head.

4 is a flow chart of a method for pre-positioning a circuit board in a film flip-chip in FIG.

FIG. 5 is a flow chart showing the steps of setting a plurality of adsorption points on a flexible circuit board in FIG.

Referring to FIG. 1 and FIG. 2, in a preferred embodiment of the present invention, a flexible circuit board 10 is provided with circuit traces 11, a plating layer 13, and a plurality of adsorption points 15. The plurality of adsorption points 15 are located in the vacant space of the circuit trace 11 and are distributed on both sides of the center of gravity of the flexible circuit board 10. Each adsorption point 15 is recessed inwardly and coated with a layer of magnetic material 19, which may be iron, cobalt, nickel or alloy materials thereof. The plurality of adsorption points 15 are located in the space of the circuit trace 11 and do not affect the wiring of the flexible circuit board 10. The adsorption points 15 are distributed on both sides of the center of gravity of the flexible circuit board 10 to move the flexible circuit board. Keep at 10 o'clock.

Referring to FIG. 3, when a flexible circuit board in a film flip chip is pre-positioned, the plurality of magnetic heads 30 are respectively adsorbed on the corresponding adsorption points 15 of the flexible circuit board 10. The flexible circuit board 10 is lifted up by the adsorption of the magnetic head 30 and the adsorption point 15 and moved to a designated position for subsequent fabrication. The magnetic head 30 is an electromagnet and a direct-acting reciprocating electromagnet can be used. The size of the magnetic head 30 can be adjusted and replaced according to the size of the adsorption point 15.

Referring to FIG. 4 and FIG. 5, a method for pre-positioning a flexible circuit board in a film flip chip includes the following steps:

Step S10: setting a plurality of adsorption points on a flexible circuit board, wherein the step of setting a plurality of adsorption points on the flexible circuit board further comprises the following steps:

Step S101: Selecting a position of the adsorption point. In the embodiment, the plurality of adsorption points are selected in a space of the circuit wiring of the flexible circuit board and distributed on both sides of the center of gravity of the flexible circuit board.

Step S103: erasing the coating on the selected adsorption point.

Step S105: adding a magnetic material to the plurality of adsorption points. The magnetic material may be iron, cobalt, nickel or an alloy thereof.

Step S20: moving the flexible circuit board by a plurality of magnetic heads adsorbing a plurality of adsorption points on the flexible circuit board. The plurality of magnetic heads are direct-acting reciprocating electromagnets.

In the embodiment, the manner of moving the flexible circuit board relative to the original suction cup by magnetic adsorption reduces the contact area, improves the space utilization of the flexible circuit board, and satisfies the optimization of the layout of the electronic components on the flexible circuit board.

Different from the conventional fixed cup area and the flatness of the adsorption range, the electromagnetic adsorption method can be used for a variety of shape heads, and the time for the electronic control head to be used in the mobile pick-and-place process is better than the original suction cup pressure. The valve control method shortens the overall working hours to increase the competitiveness of the product. In addition, the direct-acting reciprocating electromagnet adopting the principle of electromagnetic conversion and suction can enhance the strong holding force when the flexible circuit board moves for a long stroke, and has long life, no jitter in the radial direction, low noise, fast response speed and stable movement. Reliable and so on.

The flexible circuit board can be added to the adsorption point setting process during manufacture, and the adsorption point is selected on the flexible circuit board and the nickel plating surface is reserved on the adsorption point to facilitate the subsequent pre-filming of the flexible circuit board. The choice of adsorption point location increases the flexibility of the adsorption operation.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Flexible circuit board

11‧‧‧Circuit trace

13‧‧‧ plating

15‧‧ ‧ adsorption point

19‧‧‧ Magnetic materials

30‧‧‧ head

no

Claims (9)

A method for pre-positioning a circuit board in a film flip chip, the method comprising the steps of:
And forming a plurality of adsorption points on a flexible circuit board; and moving the flexible circuit board by a plurality of magnetic heads adsorbing a plurality of adsorption points on the flexible circuit board. The method for pre-positioning a circuit board in a film flip-chip according to claim 1, wherein the step of providing a plurality of adsorption points on the flexible circuit board further comprises:
Select the location of the complex adsorption point;
Erasing the coating on the selected adsorption point; and adding a magnetic material to the plurality of adsorption points. The method for pre-positioning a circuit board in a film flip-chip according to claim 2, wherein the method for pre-positioning the flexible circuit board in the film flip-chip further comprises: the circuit of the plurality of adsorption points located on the flexible circuit board The rest of the space. The method for pre-positioning a circuit board in a film flip-chip according to claim 3, wherein the method for pre-positioning the flexible circuit board in the film flip-chip further comprises: setting the plural on both sides of a center of gravity of the flexible circuit board Adsorption point. The method of pre-positioning a circuit board in a film flip-chip according to claim 2, wherein the magnetic material is nickel. The method for pre-positioning a circuit board in a film flip-chip according to claim 1, wherein the plurality of magnetic heads are direct-acting reciprocating electromagnets. A flexible circuit board having circuit wiring, wherein the flexible circuit board is provided with a plurality of adsorption points in a space of the circuit wiring, and the plurality of adsorption points face one side of the flexible circuit board Magnetic material is attached. The flexible circuit board of claim 7, wherein the magnetic material is nickel. The flexible circuit board of claim 7, wherein the plurality of adsorption points are located on both sides of a center of gravity of the flexible circuit board.