TW201519307A - Cleaning method of chip stacked structure and cleaning apparatus - Google Patents

Abstract

The prevent invention provide a cleaning method of chip stacked structure. Specially, the cleaning method is first to provide a chip stacked structure having a micro gap of 20~50[mu]m between a chip and a substrate, wherein the micro gap has a space which fluid can pass through. The cleaning method is then to provide a chemical cleaning solution and guide the chemical cleaning solution to flow through the micro gap, and after that remove the chemical cleaning solutionusing predetermined mode. Therefore, the cleaning method can effectively remove solder flux or other impurities from at least one micro gap of the chip stacked structure.

Description

Wafer stack structure cleaning method and washing equipment

The invention relates to a semiconductor clean technology, in particular to a cleaning method and a cleaning device for a wafer stack structure.

Press, the microprocessor chip includes a logic unit and a plurality of cache memories. If both the logic unit and the cache memory are configured in a two-dimensional (2-D) pattern, the physical size of the wafer will be fast. Taking the amount of memory (due to poor process of large-area wafers) limits the performance of the microprocessor.

In order to solve the 2-D resource problem on the wafer, a method of constructing a three-dimensional (3-D) integrated circuit is being actively developed. In general, a typical 3-D IC process consists of four steps: making a Via Formation, filling a Via Filling, Wafer Thinning, and Wafer Bonding. And the wafer cleaning step must be performed before and after each step to avoid contamination of the wafer during processing.

Furthermore, the steps of wafer bonding can be roughly divided into three types: chip to wafer (C2W), chip to chip (C2C), wafer to wafer (Wafer to Wafer, W2W). Type. However, whether the gap between wafer and wafer or wafer and wafer bonding is usually 20~50μm, how to remove the residual flux or other impurities in such tiny gap is the technical bottleneck that is urgently needed to overcome the challenge. .

At present, the industry mostly cleans semiconductor wafers by high-pressure cleaning, immersion cleaning, ultrasonic cleaning, and the like. Among them, the high-pressure washing process generally sprays the cleaning liquid onto the workpiece to be cleaned, but the cleaning method requires a very high liquid supply pressure, and usually requires a high-pressure pump with a working pressure of 80 kg or more, resulting in washing. The high cost of the process; the immersion cleaning process generally immerses the workpiece to be washed in the cleaning liquid, however, the cleaning method often cannot effectively remove the flux or other impurities remaining in the small gap of 20~50 μm; Ultrasonic cleaning process generally applies ultrasonic vibration to the workpiece to be cleaned. However, in order to improve the cleanliness of the workpiece, it is usually necessary to increase the output of ultrasonic vibration. As the output increases, the wafer on the substrate The possibility of damage such as patterns and patterns is relatively increased, which is detrimental to the electrical properties of the components.

Therefore, the present inventors have in view of the necessity of improvement in the conventional washing method, and have been actively researching and improving the cleaning method in the small gap with the experience of creative design and professional manufacturing in related fields for many years. The invention has finally been developed with careful consideration of the conditions.

The present invention is directed to the absence of the prior art, and proposes a cleaning method and a cleaning device for a wafer stack structure, mainly by controlling the flow direction of the chemical cleaning liquid to completely remove the three-dimensional and vertical interconnected wafer stack structure. Flux or other impurities in a small gap of 50 μm, which in turn can improve subsequent process yield.

In order to achieve the above object and effect, the present invention adopts the following technical solution: a method for cleaning a wafer stack structure, comprising the steps of: firstly, providing a wafer stack structure having at least one tiny between the wafer and the substrate; a gap having an inflow side and a first-class outlet side for allowing liquid to flow; and then, providing a chemical cleaning liquid, and allowing the chemical cleaning liquid to enter the minute gap from the inflow side, and further discharging from the outflow side; Subsequently, the wafer stack structure is washed with an organic solvent, and the chemical cleaning liquid remaining on the wafer stack structure is replaced with the organic solvent; finally, a drying step is performed to remove the residual structure on the wafer stack structure. The organic solvent.

The present invention further provides a cleaning apparatus for removing a flux remaining on a wafer stack structure, wherein the wafer stack structure has at least one minute gap between the wafer and the substrate, based on the cleaning method of the wafer stack structure described above. And the small gap has an inflow side and a first-class outlet side for allowing liquid to flow, and the cleaning device comprises a cleaning chamber, a carrying platform, a liquid supply device and a liquid discharging device. The loading platform is disposed in the cleaning chamber; the liquid supply device is disposed above the loading platform for applying a chemical cleaning liquid to the substrate, and the chemical cleaning liquid is along the substrate from the inflow side The small gap is inserted; the liquid pumping device is disposed above the load bearing platform for driving the chemical cleaning liquid flow through the small gap and discharging from the outflow side to completely remove the flux remaining in the minute gap.

Therefore, the present invention provides a chemical cleaning solution by a liquid supply device coupled with a liquid sampling device, and controls the chemical cleaning liquid to flow through a small gap of 20 to 50 μm in a three-dimensional, vertically interconnected wafer stack structure in a specific direction. Avoid damage to the wafer and/or pattern on the substrate, and completely remove the flux remaining in the small gap to obtain a better clean wafer stack structure to ensure the electrical characteristics of the device.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and further explanation of the scope of the invention.

1‧‧‧Washing equipment

10‧‧‧cleaning chamber

11‧‧‧Loading platform

12‧‧‧Liquid supply device

121‧‧‧Infusion tube

122‧‧‧Nozzles

13‧‧‧Sipping device

131‧‧‧Draining tube

132‧‧‧Pump holder

1321‧‧‧Sliding structure

1321a‧‧‧Roll type sliding structure

1321b‧‧‧brush type sliding structure

14‧‧‧ heating device

W‧‧‧ wafer stack structure

S‧‧‧Substrate

C‧‧‧ wafer

G‧‧‧Small gap

Gi‧‧‧ inflow side

Go‧‧‧ outflow side

1 is a schematic view showing the process of cleaning a wafer stack structure of the present invention.

2 is a schematic flow chart of a method for cleaning a wafer stack structure of the present invention.

Figure 3 is a schematic illustration of the cleaning apparatus of the present invention.

Fig. 4 is a view showing a state of use of the liquid supply device and the liquid suction device of the present invention.

The invention discloses a novel washing process, which is characterized by borrowing a liquid supply A liquid pumping device is provided to provide a chemical cleaning liquid, and the flow direction of the chemical cleaning liquid is controlled to effectively remove flux or other impurities in a small gap of 20 to 50 μm in the three-dimensional, vertically interconnected wafer stack structure. The process characteristics of the cleaning method of the wafer stack structure of the present invention are further described below with reference to a preferred embodiment and the accompanying drawings. Those skilled in the art can readily understand the advantages of the present invention and the advantages of the present invention. Various modifications and changes can be made to carry out or apply the method of the present invention without departing from the spirit of the invention.

Please refer to FIG. 1 and FIG. 2, wherein FIG. 2 is a schematic flow chart of a method for cleaning a wafer stack structure according to a preferred embodiment of the present invention. The wafer stack structure can be cleaned by sequentially performing the steps shown in FIG. 2 to obtain a better cleanliness wafer stack structure.

First, step S10 is performed to provide a wafer stack structure W to be cleaned (as shown in FIG. 1). Specifically, the wafer stack structure W includes a substrate S and at least one wafer C on the substrate S, wherein the wafer C is fixed on the substrate S by flip chip bonding; after the flip chip operation is completed, the wafer C and the substrate S are completed. Intrinsic bumps or solder balls (not shown) are soldered between them, so that there is a small gap G of 20 to 50 μm between the wafer C and the substrate S, and the minute gap G has an inflow side Gi that allows liquid to flow and is first-class. Side Go.

It should be noted that the wafer stack structure is required to remove the oxide or oil stain on the solder bumps on the substrate S or the bumps on the wafer C by using a flux (Flux) to achieve a good soldering effect. A relatively large amount of flux remains on W, and especially the flux remaining in the minute gap G is particularly difficult to remove.

Referring to FIG. 1, in order to completely remove the flux in the minute gap G, the present invention then performs step S12 to provide a chemical cleaning solution, and the chemical cleaning solution enters the minute gap G from the inflow side Gi, and further from the outflow side. Go is discharged. It should be noted that this step uses a liquid supply device 12 in conjunction with a liquid suction device 13 to achieve the above object.

When the liquid supply device 12 and the liquid suction device 13 are in use, the chemical cleaning liquid is applied on the substrate S by the liquid supply device 12, and the application position is adjacent to the inflow side Gi, and The suction device 13 is used to provide suction from the outflow side Go, so that the chemical cleaning liquid flows from the inflow side Gi along the surface of the substrate S into the minute gap G, and further flows through the minute gap G to flow out from the outflow side Go to take away the minute gap. Flux in G. It should be noted that the present invention does not limit the type of chemical cleaning liquid, and the chemical cleaning liquid used may vary depending on the type of the flux.

Referring to FIG. 3, in order to perform the above-mentioned cleaning operation on the wafer stack structure W (step S12), the present invention provides a cleaning apparatus 1 which only needs to be placed in the wafer stack structure W in use. The flux remaining in the minute gap G is removed. As shown, the washing apparatus 1 includes a washing chamber 10, a carrying platform 11, a liquid supply device 12, a liquid pumping device 13, and a heating device 14.

In this embodiment, the carrier platform 11 is fixed in the cleaning chamber 10 by a supporting structure (not shown), and provides a wafer stack structure W for carrying the cleaning; the liquid supply device 12 and the liquid pumping device 13 respectively a suspension structure (not shown) is movably disposed above the carrying platform 11 to provide and control the chemical cleaning liquid to remove the flux; the heating device 14 is fixed on the supporting structure and adjacent to the carrying platform 11 to enable the wafer The stacked structure W is cleaned at a suitable temperature, preferably between 70 and 80 ° C, more preferably 75 ° C.

It should be mentioned that the support structure and the suspension structure can achieve the effect of fixing a specific component, and the present invention does not limit the specific structure of the support structure and the suspension structure; It is within the scope of the present invention to provide a chemical cleaning solution for the liquid supply device 12 and the liquid suction device 13, and to control the flow direction of the chemical cleaning liquid.

In more detail, the liquid supply device 12 has an infusion tube 121 and a nozzle 122, wherein the infusion tube 121 is connected to a cleaning liquid supply end (not shown), and the nozzle 122 is fixed to one end of the infusion tube 121 and both Connected to each other, a chemical cleaning liquid can be applied from above the wafer C and the substrate S to the minute gap G. Preferably, a solenoid valve (not shown) can be disposed on the infusion tube 121 to control the amount of the chemical cleaning liquid.

The liquid suction device 13 includes a liquid discharge pipe 131 and a liquid suction seat 132, and the liquid discharge device The tube 131 has a first end and a second end, wherein the first end is connected to a vacuum suction device (not shown), and the second end is connected to the bottom end of the liquid suction seat 132; The bottom end of the liquid seat 132 is further provided with a sliding structure 1321, which may be a roller type sliding structure 1321a or a brush type sliding structure 1321b, so as to slide on the substrate S and accurately displace to any position to be cleaned. It should be noted that the present invention does not limit the specific aspect of the sliding structure 1321, and the sliding structure 1321 can only arbitrarily slide the liquid suction seat 132 on the substrate S.

According to a preferred embodiment of the present invention, after the cleaning operation of the chemical cleaning liquid is completed, the cleaning method of the wafer stack structure further includes step S14, changing the pure water and removing the chemical cleaning liquid by the same cleaning method. Specifically, in this step, the liquid supply device 12 is used in conjunction with the liquid suction device 13 to allow pure water to enter the minute gap G from the inflow side Gi of the small gap G, and further discharged from the outflow side Go to take away the minute gap. The chemical cleaning solution in G, and the subsequent drying process of the wafer stack structure W, can achieve a good drying effect. It is worth mentioning that the wafer/wafer stack structure W cleaned by the cleaning method of the wafer stack structure of the present invention can be applied to any drying method, such as IPA vapor drying, which is not limited by the present invention.

In summary, the present invention provides a chemical cleaning solution by means of a liquid supply device and a liquid suction device, and controls the chemical cleaning liquid to flow through the three-dimensional direction in a specific direction, compared with the manner in which the flux is removed in the prior wafer cleaning process. A small gap of 20~30μm in the vertically interconnected wafer stack structure can avoid pattern and/or wafer damage on the substrate, and can completely remove the residual flux in the small gap to obtain a better cleanness wafer. The stacked structure ensures the electrical properties of the product.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

S10~S14‧‧‧ Process steps

Claims (8)

A method for cleaning a wafer stack structure, comprising the steps of: providing a wafer stack structure having at least one minute gap between the wafer and the substrate, the minute gap having an inflow side for allowing liquid to circulate and a An outflow side; and a chemical cleaning solution is provided, and the chemical cleaning liquid enters the minute gap from the inflow side and is further discharged from the outflow side. The method of cleaning a wafer stack structure according to claim 1, wherein in the step of providing a chemical cleaning liquid, the chemical cleaning liquid is applied to the substrate by a liquid supply device, and the chemical cleaning liquid is applied The minute gap is entered from the inflow side along the substrate, and the chemical cleaning fluid stream is driven through the minute gap by a liquid pumping device and discharged from the outflow side. The method of cleaning a wafer stack structure according to claim 1, wherein after the step of providing a chemical cleaning liquid, further comprising a pure water washing step, allowing pure water to enter the minute gap from the inflow side, and further Discharged from the outflow side to carry away the chemical cleaning liquid in the minute gap. The method of cleaning a wafer stack structure according to claim 2, wherein after the pure water washing step, further comprising performing a drying step of removing pure water remaining on the wafer stack structure. A cleaning apparatus for removing a flux remaining on a wafer stack structure, wherein the wafer stack structure has at least one minute gap between the wafer and the substrate, and the minute gap has an inflow side for allowing liquid to flow and An rinsing device includes: a cleaning chamber; a carrier platform disposed in the cleaning chamber; a liquid supply device disposed above the carrier platform for applying a chemical cleaning solution to the substrate And the chemical cleaning liquid enters the minute gap from the inflow side along the substrate; and a liquid pumping device is disposed above the carrying platform for driving the chemical cleaning The liquid flow passes through the minute gap and is discharged from the outflow side to completely carry away the flux remaining in the minute gap. The cleaning device of claim 4, wherein the liquid supply device comprises an infusion tube and a nozzle in communication with the infusion tube, the liquid sampling device comprising a drain tube and a communication line with the drain tube Pumping seat. The cleaning device of claim 5, wherein the bottom end of the pumping seat is further provided with a slip structure. The washing apparatus of claim 6, wherein the sliding structure is a roller type sliding structure or a brush type sliding structure. The cleaning device of claim 4, further comprising a heating device disposed below the carrying platform.