TW201515759A - Jig for processing units, method of manufacture and laser processing method - Google Patents

Abstract

The invention provides a jig 1A for use with a processing platform which is to be configured on a processing platform 3 of a laser processing apparatus for laser drilling processing, and a processed object 2, which is the substrate to be processed, placed on an upper side of the jig which is disposed between a bottom surface side of the processed object 2 and the upper side of the processed platform 3, and the jig includes a laminated portion in which reflective layers are laminated in the shape of sheets. In the process of laser drilling, the laser beam is irradiated on the processed object 2 to form a through hole in the processed object 2 and the reflective layer reflects the laser beam passing through the processed object 2, and the reflective layers are removably laminated with an adhesive layers in a sheet-like shape.

Description

Manufacturing method for processing table, jig for processing table, and laser processing method

The present invention relates to a jig for a processing table placed between a processing table and a workpiece provided in a laser processing apparatus.

If a printed circuit board is placed directly on a processing table provided in a laser processing apparatus, and laser drilling is performed, a laser beam is irradiated onto the processing table, causing damage to the processing table. In addition, machining debris generated during laser processing can accumulate on the processing table.

Therefore, when performing laser drilling, a jig for protecting the processing table is used. In the case of a jig, in order to correspond to a high-energy laser beam, a material such as copper which has high durability (high reflectance and high thermal conductivity) for a laser beam is used. Previously, a single layer of copper foil or copper plate or the like was used as a jig.

However, even in the case of using such a jig, it is impossible to completely prevent the damage of the jig or the accumulation of machining debris. Therefore, when the damage of the jig or the accumulation of the processing chips occurs, the jig must be exchanged. Compared with the fixture of the copper plate, the single-layer copper foil has a low durability and is susceptible to damage of the fixture. As a result, if a single-layer copper foil jig is used, the frequency of exchange of the jig becomes high, and loss (Loss) occurs in the production time of the printed circuit board.

On the other hand, in the case of a jig using a copper plate, it is necessary to prepare a copper plate for use in the jig. In addition, it is necessary to entrust the external processing for the adsorption of the copper plate, so that the manufacturing cost (Cost) of the jig is increased, and the manufacturing period is prolonged.

In another example of the damage prevention measure of the processing table, there is a method described in Patent Document 1. In this method, polyethylene terephthalate (PET) is used as a protective sheet on the surface of a Green sheet to prevent the laser beam from directly illuminating the table. This prevents damage to the workbench.

(previous technical literature) (Patent Literature)

(Patent Document 1) Japanese Patent Laid-Open Publication No. 2003-211277

However, since PET does not reflect the laser beam and absorbs it, it is not possible to function as a protective film for the processing table for laser drilling using high energy (through hole drilling) (green film is available) For low energy processing). Further, in the case where a copper foil having a high reflectance of the laser beam is used as the protective film, the material cost is improved as compared with PET. Therefore, if all the workpieces are followed by the protective film, the manufacturing cost increases.

The present invention has been made in view of the above, and aims to obtain a jig for a processing table, a method for manufacturing a jig for a processing table, and a laser processing method which are low-cost and can easily maintain a jig function.

In order to solve the above problems and achieve the object, the processing station of the present invention is used. The jig is placed on the processing table during the laser drilling process, and is disposed on the bottom surface side of the workpiece by placing the workpiece on the upper side, and the jig for the processing table has a reflective layer. The reflective layer reflects a laser beam that is irradiated onto the workpiece, and the reflective layer has a laminate portion in which each of the reflective layers is peelably formed by laminating a layer.

According to the present invention, it is possible to achieve a low cost and an effect of easily maintaining the function of the jig.

1A to 1E‧‧‧ fixtures

2‧‧‧Processed objects

3‧‧‧Processing table

11(1) to 11(N), 11(X), 21A, 21B‧‧‧ copper foil layers

12(1) to 12(3)‧‧‧ Materials for printed circuit boards

15‧‧‧ Damage Department

16, 31‧ ‧ holes

20‧‧‧Laser beam

21‧‧‧Laser oscillator

22‧‧‧ resin layer

23‧‧‧Processing position (hole position)

24‧‧‧ Concentrating lens

25X, 25Y‧‧‧ galvanometer

26X, 26Y‧‧‧ Detector Scanner

30‧‧ ‧ Laser Processing Department

33(1) to 33(N-1), 33(X)‧‧‧

50‧‧‧ copper plate

70‧‧‧ Laser processing control device

100‧‧‧ Laser processing equipment

Fig. 1 is a view showing the configuration of a laser processing apparatus of an embodiment.

Fig. 2 is a view showing the configuration of a jig for a processing table of an embodiment.

Fig. 3 is a view for explaining laser processing of a workpiece using a jig.

Figure 4-1 is a cross-sectional view of a portion other than the hole of the jig.

Figure 4-2 shows a cross-sectional view of the hole portion of the fixture.

Fig. 5 is a view for explaining the peeling of the copper foil layer forming the jig.

Fig. 6 is a view for explaining a process of peeling off a plurality of layers of the copper foil layer.

Fig. 7 is a view showing the configuration of a jig in which a plurality of copper foil layers are laminated on a copper plate thicker than a copper foil layer.

Fig. 8 is a view showing the configuration of a jig in which a material for a printed circuit board is laminated.

Fig. 9 is a view showing a configuration of a jig in a case where a plurality of copper foil layers are laminated on the upper layer side of the material for a printed circuit board.

Hereinafter, a jig for a processing table, a method for manufacturing a jig for a processing table, and a laser processing method according to an embodiment of the present invention will be described in detail based on the drawings. Further, the present invention is not limited by this embodiment.

Implementation type

Fig. 1 is a view showing the configuration of a laser processing apparatus of an embodiment. The laser processing apparatus 100 is a device for performing laser drilling processing on a workpiece (workpiece) 2 belonging to a substrate to be processed by irradiating a laser beam (pulse laser light) 20. In the present embodiment, laser processing is performed using a jig (Jig) 1A in which a plurality of layers of copper foil which are peelably laminated.

The laser processing apparatus 100 includes a laser oscillator 21 that oscillates the laser beam 20, a laser processing unit 30 that performs laser processing of the workpiece 2, and a laser processing control device 70. The laser processing control device 70 is connected to the laser oscillator 21 and the laser processing unit 30 (not shown in FIG. 1), and controls the laser oscillator 21 and the laser processing unit 30.

The laser oscillator 21 oscillates the laser beam 20 and sends it to the laser processing unit 30. The laser processing unit 30 includes: a Galvanometer mirror 25X, 25Y; a Galvanometer scanner 26X, 26Y; an f θ lens (condensing lens) 24; and a processing table (XY table) 3.

The convection scanners 26X and 26Y have a function of changing the trajectory of the laser beam 20 to move the irradiation position of the workpiece 2, and the laser beam 20 is applied to the workpiece 2 in each of the set processing regions ( Scanning in the second-element area within the galvanic area. The galvano scanners 26X and 26Y rotate the galvanomirrors 25X and 25Y by a predetermined angle in order to scan the laser beam 20 in the X-Y direction.

The galvanomirrors 25X, 25Y reflect the laser beam 20 and are biased toward the predetermined angle. The galvanomirror 25X deflects the laser beam 20 in the X direction, and the galvanomirror 25Y deflects the laser beam 20 in the Y direction.

The f θ lens 24 is a lens having a telecentricity. The f θ lens 24 biases the laser beam 20 in a direction perpendicular to the principal surface of the workpiece 2, and condenses (illuminates) the laser beam 20 at the processing position (hole position 23) of the workpiece 2.

The workpiece 2 is an object to be processed such as a printed circuit board, and is subjected to drilling at a plurality of positions. The workpiece 2 is composed of, for example, a copper foil (conductor layer), a resin (insulating layer), and a copper foil (conductor layer).

The processing table 3 mounts the jig (the jig for the processing table) 1A and the workpiece 2, and moves in the XY plane by driving of a motor (Motor) (not shown). Thereby, the processing table 3 moves the jig 1A and the workpiece 2 in the in-plane direction of the XY plane. The jig 1A is placed on the processing table 3, and the workpiece 2 is placed on the jig 1A. The jig 1A protects the processing table 3 from isolating the laser beam 20 to prevent damage to the processing table 3.

The range (laserable area) that can be subjected to laser processing by the operation of the current detecting mechanism (the current detecting scanners 26X, 26Y, the galvanomirrors 25X, 25Y) is not subjected to the movement of the processing table 3 (scanning) (Scan) area).

In the laser processing apparatus 100, after the processing table 3 is moved in the XY plane, the laser beam 20 is scanned by the current detecting scanners 26X and 26Y. The processing table 3 is sequentially moved so that the center of each of the current detecting regions is located immediately below the center of the f θ lens 24 (the origin of the current detection). The galvanometer mechanism operates in such a manner that each hole position 23 set in the current detecting region sequentially becomes the irradiation position of the laser beam 20. The movement of the processing table 3 between the flow detection regions and the secondary beam scanning of the laser beam 20 in the current detecting region by the current detecting mechanism are sequentially performed in the plane of the workpiece 2. Take this All the hole positions 23 of the workpiece 2 are subjected to laser processing.

Fig. 2 is a view showing the configuration of a jig for a processing table of an embodiment. The fixture 1A is slightly flat. When the hole processing of the workpiece 2 is performed, the jig 1A is placed on the processing table 3. Then, the workpiece 2 is placed on the jig 1A.

The processing table 3 is provided with a plurality of holes 31 for vacuum-adsorbing the jig 1A. Further, the jig 1A is provided with a plurality of holes 16 for vacuum-absorbing the workpiece 2. The arrangement position (arrangement interval) of the holes 16 of the jig 1A is the same as the arrangement position (arrangement interval) of the holes 31 on the processing table 3, or may be an arrangement position (arrangement interval) in which a part of the holes is omitted to reduce the hole. Configure the density.

Also, the apertures 16 and 31 may be of different apertures. In addition, the size of the main surface of the jig 1A may be any size if it is equal to or less than the size of the main surface of the processing table 3 and is equal to or larger than the size of the main surface of the workpiece 2 . In other words, the size of the main surface of the jig 1A can be any size if the jig 1A does not exceed the processing table 3 and the workpiece 2 does not exceed the size of the jig 1A.

When the hole processing of the workpiece 2 is performed, the jig 1A is placed on the processing table 3 so that the hole 16 overlaps the hole 31, and then the workpiece 2 is placed on the jig 1A. Then, the jig 1A and the workpiece 2 are fixed to the processing table 3 by vacuum suction from the bottom surface side of the processing table 3. Thereafter, laser processing of the workpiece 2 is performed.

Fig. 3 is a view for explaining laser processing of a workpiece using a jig. In the third drawing, a cross-sectional view of the workpiece 2, the jig 1A, and the processing table 3 is shown. The workpiece 2 is composed of, for example, a three-layer structure of a copper foil layer 21A, a resin layer 22, and a copper foil layer 21B. Specifically, the lowermost layer is the copper foil layer 21B, and the uppermost layer is copper. Foil layer 21A. The intermediate layer of the copper foil layers 21A and 21B is the resin layer 22.

When the laser processing is performed, the workpiece 2 is placed on the jig 1A so that the lowermost copper foil layer 21B is attached to the upper surface of the jig 1A. When the workpiece 2 is irradiated with the laser beam 20 in this state, the copper foil layer 21A of the workpiece 2, the resin layer 22, and the copper foil layer 21B are sequentially opened. Thereby, a through hole is formed in the workpiece 2. After the through hole is formed in the workpiece 2, the laser beam 20 is stopped, and the laser drilling process is performed at the next processing position.

At this time, after the through hole is formed in the workpiece 2, the laser beam 20 is irradiated to the lower side of the workpiece 2 until the laser beam 20 is stopped. Since the jig 1A is disposed below the workpiece 2, the laser beam 20 is reflected by the jig 1A and does not reach the processing table 3. Thereby, damage of the processing table 3 can be prevented.

Fig. 4-1 is a cross-sectional view of a portion other than the hole of the jig, and Fig. 4-2 is a cross-sectional view of the hole portion of the jig. Fig. 4-1 shows a cross-sectional shape of the jig 1A in the case where the jig 1A is cut in a direction parallel to the depth direction of the hole 16 except for the hole 16. Further, Fig. 4-2 shows the cross-sectional shape of the jig 1A in the case where the jig 1 is cut in a direction parallel to the depth direction of the hole 16 at the hole 16.

The jig 1A uses a plurality of layers of the copper foil layer 11 having a high reflectance (for example, a reflectance of 90% or more is preferable) and a high thermal conductivity (for example, 200 W/m.K or more) for the laser beam 20. (1) to 11 (N) (N series of 2 or more natural numbers). Each of the copper foil layers 11(1) to 11(N) reflects a reflective layer of the laser beam 20. Further, the adhesion between the respective copper foil layers 11 (1) to 11 (N) is an adhesive layer 33 (1) to 33 (N-1) which is a prepreg which is an adhesive layer for a printed circuit board. (N is a natural number of 2 or more).

The copper foil layers 11 (1) to 11 (N) are laminated in a plate shape between the adjacent copper foil layers and the subsequent layers 33 (1) to 33 (N-1). In other words, the copper foil layers 11 (1) to 11 (N) which are the laminated portions are formed into a plate shape in a peelable manner. For example, the copper foil layer 11 (2) can be laminated from the copper foil layer 11 (3) to the copper foil layer 11 (3) with the adhesion layer 33 (2) interposed therebetween. The copper foil layer 11(1) is laminated from the copper foil layer 11(2) to the copper foil layer 11(2) with the adhesion layer 33(1) interposed therebetween. on. Further, in the following description, the copper foil layers 11(1) to 11(N) will be referred to as a copper foil layer 11 (X), and the subsequent layers 33(1) to 33(N-1) will be referred to as an adhesive layer. The case of 33(X).

As described above, in the present embodiment, a material having a thin copper foil or the like but having a certain degree of durability to the laser is laminated with the adhesive layer, and an adsorption hole is formed in the material to form the jig 1A. For example, a jig 1A having a thickness of 1.02 mm is produced by alternately laminating copper foil layers 11 (1) to 11 (15) having a thickness of 12 μm and adhesion layers 33 (1) to 33 (14) having a thickness of 60 μm.

When the jig 1A is produced, for example, the copper foil layers 11(1) to 11(N) and the subsequent layers 33(1) to 33(N-1) are alternately laminated to be used in the process of the printed circuit board. A press machine or the like presses the copper foil layers 11 (1) to 11 (N) and the subsequent layers 33 (1) to 33 (N-1) in the thickness direction (stacking direction) to form a copper foil layer 11 Each of the copper foil layers of (1) to 11 (N) may be peeled off, and the laminate may have a plate shape. Then, holes 16 are formed for the laminated copper foil layers 11(1) to 11(N) and the subsequent layers 33(1) to 33(N-1). This hole 16 is formed by a boring machine or the like used in the process of a printed circuit board.

Fig. 5 is a view for explaining the peeling of the copper foil layer forming the jig. Multilayer copper foil layers 11(1) to 11(N) and subsequent layers 33(1) to 33(N-1) are laminated The jig 1A performs laser processing of the workpiece 2. At this time, when the laser beam 20 is repeatedly irradiated onto the workpiece 2, the damaged portion 15 may be generated in the copper foil layer 11 (1) which is the uppermost layer of the jig 1A (S1).

When the copper foil layer 11 (1) is damaged, the copper foil layer 11 (1) and the subsequent layer 33 (1) are peeled off from the jig 1A (S2). The jig in which the copper foil layer 11 (1) and the subsequent layer 33 (1) are peeled off is used as the jig 1B and is used for laser processing on the workpiece 2 (S3). Thereafter, when the copper foil layers 11 (2) to 11 (N-1) are damaged, the damaged copper foil layer and the subsequent layer are peeled off. Since each of the copper foil layers 11 (2) to 11 (N-1) is sequentially damaged from the upper layer side, the jig is sequentially peeled off from the upper layer side. Further, depending on the case, the subsequent layer 33(1) may remain in the jig 1B. However, the jig 1B may remain in the jig 1B.

Further, when the processing chips are deposited on the uppermost copper foil layer 11 (X) of the jig 1A, the uppermost copper foil layer 11 (X) and the subsequent layer 33 (X) may be peeled off. As described above, by using the jig 1A, only the uppermost copper foil layer 11 (X) and the subsequent layer 33 (X) can be removed to reproduce the function of the jig 1A. As a result, the following advantages can be obtained.

(A) When the jig 1A is installed once, the uppermost layer of the jig is removed, and the frequency of exchange of the jig 1A is lowered. As a result, the loss of production time can be reduced.

(B) The jig 1A can be manufactured by using a process of a printed circuit board, so that the jig 1A can be easily and quickly produced. Further, since it is not necessary to separate the jig from the workpiece 2 and the film layer, the manufacturing cost can be reduced.

Further, since the copper foil and the subsequent layer used for the production of the jig 1A are generally used in a process of a printed circuit board, it is easy to obtain and the manufacturing cost can be reduced.

If the machining process continues to perform laser processing in the state where the machining debris is deposited on the jig 1A, the machining debris enters between the jig 1A and the workpiece 2, so that the workpiece 2 is processed. tilt. As a result, when the laser beam 20 is irradiated onto the workpiece 2, the focus shift of the laser beam 20 occurs, and the hole beam processing cannot be performed to a predetermined shape. In addition, if the laser processing is continued in the state in which the jig 1A is damaged, the reflected light reflected in the direction parallel to the incident direction of the laser beam 20 in the flat jig without damage is not damaged by the jig. It is flat and does not reflect in a direction parallel to the incident direction of the laser beam 20, and becomes scattered and scattered. As a result, it is impossible to open the hole into a predetermined shape by the reflected light from the laser beam 20 at the damage.

In the present embodiment, when the copper foil layer 11 (X) is damaged, the uppermost copper foil layer 11 (X) is peeled off at least from the jig 1A. Thereby, the focus shift of the laser beam can be prevented, and the reflected light of the laser beam from the damage can be prevented. Therefore, the drilling of a predetermined shape can be performed.

Moreover, the laminated material used for the jig 1A is not limited to the copper foil layer 11 (X), and other materials may be used. The fixture 1A can use a laminate material corresponding to the wavelength of the laser beam 20. For example, the jig 1A uses a laminate material that reflects 90% or more of the laser beam 20.

For example, in the case where the laser beam 20 is a CO ₂ laser, copper or aluminum having high reflectivity and high thermal conductivity for the CO ₂ laser or the like can be used as the build-up material of the jig 1A.

Moreover, the thickness of the laminated material used for the jig 1A, the number of laminated layers, the lamination method, the removal method, the number of peeling layers, and the like can be arbitrarily set. For example, when the copper foil layer 11 (X) is damaged or when the processing chips are deposited on the copper foil layer 11 (X), the plurality of copper foil layers 11 (X) and the subsequent layer 33 (X) are peeled off.

Fig. 6 is a view for explaining a process of peeling off a plurality of copper foil layers and an adhesive layer. Fig. 6 shows that the "copper foil layer 11 (1) + the subsequent layer 33 (1)" is peeled off, The case of "copper foil layer 11 (2) + subsequent layer 33 (2)". In this case, the copper foil layer 11 (2) may be damaged or not damaged. Further, the "copper foil layer 11 (1) + the adhesive layer 33 (1)" and the "copper foil layer 11 (2) + the adhesive layer 33 (2)" may be peeled off together, and may be peeled off layer by layer. Further, depending on the case, the subsequent layer 33 (2) may remain in the jig 1B. However, the jig 1B may remain in the jig 1B.

Further, in the present embodiment, the case where the jig 1A is formed using the copper foil layer 11 (X) and the subsequent layer 33 (X) will be described. However, it may be laminated on a copper plate thicker than the copper foil layer 11 (X). A plurality of copper foil layers 11 (X) and a subsequent layer 33 (X) are used to form a jig.

Fig. 7 is a view showing the configuration of a jig in which a plurality of copper foil layers are laminated on a copper plate thicker than a copper foil layer. The jig 1C is formed by laminating a plurality of copper foil layers 11 (1) to 11 (N) and subsequent layers 33 (1) to 33 (N-1) on a copper plate 50 thicker than the copper foil layer 11 (X). According to this configuration, even when the laser processing is performed using the copper foil layer 11 (N) remaining as the last peeling, the copper foil is present on the lower layer side of the copper foil layer 11 (N) remaining, even if In the event that the copper foil layer 11 (N) is penetrated during laser processing, there is no concern that the processing table 3 is damaged.

Further, a part or all of the copper foil layer 11 (X) and the copper plate 50 from which the subsequent layer 33 (X) is peeled off may be reused in the jig 1C. Specifically, on the copper plate after the copper foil layer 11 (X) and the adhesion layer 33 (X) are peeled off, a plurality of layers of the copper foil layer 11 (X) and the subsequent layer 33 (X) are laminated to form a new jig 1C.

In addition, this embodiment describes the case where the jig 1A is formed using the copper foil layers 11 (1) to 11 (N) and the subsequent layers 33 (1) to 33 (N-1). However, it is also possible to The other materials used in the manufacture of the printed circuit board are laminated to form a jig.

Figure 8 shows the treatment of the material used for the printed circuit board. A diagram of the composition. The jig 1D is formed by laminating a plurality of layers of printed circuit board materials 12(1) to 12(3) and subsequent layers 33(1) to 33(2). The printed circuit board materials 12 (1) to 12 (3) have a three-layer structure of, for example, a copper foil layer, a resin layer, and a copper foil layer. Further, the printed circuit board materials 12(1) to 12(3) constituting the jig 1D are not limited to three layers, but may be two or four or more layers. The printed circuit board materials 12(1) to 12(3) are, for example, a Resin coated copper foil (RCC), or a heat resistant glass (Glass) cloth substrate epoxy (Epoxy) resin copper foil laminate. (FR-4) and so on.

Further, when RCC or FR-4 is used for the jig 1D, a copper plate may be disposed on the lower side of the RCC or FR-4. In addition, at least two of the copper foil layers 11 (X), RCC or FR-4 may be combined. For example, a plurality of layers of the copper foil layer 11 may be laminated on the upper layers of the printed circuit board materials 12(1) to 12(3) and the subsequent layers 33(1) to 33(2) such as RCC or FR-4. X) and the subsequent layer 33 (X) are used to form a jig.

Fig. 9 is a view showing a configuration of a jig in a case where a plurality of copper foil layers are laminated on the upper layer side of the material for a printed circuit board. The jig 1E is attached to the upper layers of the printed circuit board materials 12(1) to 12(3) and the subsequent layers 33(1) to 33(2), and a plurality of layers of the copper foil layer 11 (X) and the subsequent layer 33 ( Formed by X).

As described above, depending on the embodiment, the plurality of copper foil layers 11 (X) and the adhesive layer 33 (X) are laminated to form the jig 1A, and the copper foil layer 11 (X) is damaged or the copper foil layer 11 is formed. (X) When the machining chips are deposited, the uppermost copper foil layer 11 (X) and the subsequent layer 33 (X) can be peeled off. Thereby, damage of the processing table 3 can be prevented, and the jig function can be easily restored. Further, the jig 1A can be produced in a short time and at low cost by using the processes and materials of the existing printed circuit board. Therefore, the jig function of the jig 1A belonging to the jig for the processing table can be easily maintained at low cost.

(industrial use)

As described above, the jig for a processing table of the present invention, the manufacturing method of the jig for a processing table, and the laser processing method are suitable for laser drilling.

1A‧‧‧ fixture

2‧‧‧Processed objects

3‧‧‧Processing table

16, 31‧ ‧ holes

Claims (10)

A jig for a processing table is placed on a processing table at the time of laser drilling, and is disposed on the bottom surface side of the workpiece by placing the workpiece on the upper side, and the jig for the processing table The reflection layer is configured to reflect a laser beam that is irradiated onto the workpiece, and the reflection layer has a laminate portion in which each of the reflection layers is peelably separated into a plate shape by a subsequent layer. The jig for a processing table according to the first aspect of the invention, wherein the reflective layer is a copper foil layer. The jig for a processing table according to the second aspect of the invention, wherein a copper plate thicker than the copper foil layer is disposed on a lower layer side of the laminated portion. The jig for a processing table according to the second aspect of the invention, wherein the RCC or the FR-4 is disposed on a lower layer side of the laminated portion. The jig for a processing table according to claim 1, wherein the reflective layer is RCC or FR-4. The jig for a processing table according to any one of the first aspect of the present invention, wherein the laminated portion is provided with a first hole for vacuum-adsorbing the workpiece, and the first hole is disposed. The position is the same as the arrangement position of the second hole provided in the processing table and vacuum-adsorbing the workpiece and the laminated portion, or the position of a part of the hole is omitted to reduce the arrangement density of the hole. A manufacturing method of a jig for a processing table, comprising a laminating step of laminating a reflective layer with a reflective layer and laminating a layer by a subsequent layer, the reflective layer being illuminated The laser beam incident on the workpiece is reflected. The manufacturing method of the jig for a processing table according to claim 7, wherein the laminating step has a stacking step of stacking the reflective layer and the subsequent layer; and a pressurizing step of stacking the aforementioned reflection The layer and the subsequent layer are pressurized in the stacking direction. The manufacturing method of the jig for a processing table according to the seventh or eighth aspect of the invention, further comprising the step of opening the hole for the reflective layer at a predetermined position, the predetermined position and the laser drilling process The positions of the holes used for vacuum-adsorbing the workpiece and the reflective layer on the processing table placed on the processing table are the same or a part of the holes are omitted to reduce the hole arrangement density. A laser processing method comprising: a first placing step of placing a processing table fixture on a processing table, wherein the processing layer is formed by laminating the reflective layer with each reflective layer releasably by an adhesive layer Forming a plate shape, the reflective layer reflects the laser beam irradiated on the workpiece; the second placing step of placing the workpiece on the upper surface side of the processing table fixture; and the laser processing step The light beam is irradiated onto the workpiece, and the workpiece is subjected to the drilling process; and the peeling step is performed when the processing table is damaged or when the processing chip is stacked on the processing table. The uppermost reflective layer and the subsequent layer of the fixture are peeled off.