TW201510087A - Polyarylene sulfide resin compotion and molded article thereof - Google Patents

Polyarylene sulfide resin compotion and molded article thereof Download PDF

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TW201510087A
TW201510087A TW103127008A TW103127008A TW201510087A TW 201510087 A TW201510087 A TW 201510087A TW 103127008 A TW103127008 A TW 103127008A TW 103127008 A TW103127008 A TW 103127008A TW 201510087 A TW201510087 A TW 201510087A
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polyarylene sulfide
sulfide resin
resin
mass
acid
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TW103127008A
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Yasuyuki Yoshino
Akira Kawamura
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Dainippon Ink & Chemicals
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02Polythioethers; Polythioether-ethers

Abstract

The invention discloses a polyarylene sulfide resin composition, which includes a polyarylene sulfide resin, and at least one other component selected from a group consisted of an inorganic filler, a thermoplastic resin other than a polyarylene sulfide resin, an elastomer, and a crosslinking resin having two or more crosslinking functional groups. The polyarylene sulfide resin may be obtained by a method including a step of reacting a diiodoaromatic compound, elemental sulfur with a polymerization inhibitor in a melting mixture including the diiodoaromatic compound, elemental sulfur and the polymerization inhibitor. The polyarylene sulfide resin further has a hydroxyl group and/or an amino group derived from the polymerization inhibitor.

Description

聚芳硫醚樹脂組成物及其成形品 Polyarylene sulfide resin composition and molded article thereof

本發明是有關於一種聚芳硫醚樹脂組成物及其成形品。 The present invention relates to a polyarylene sulfide resin composition and a molded article thereof.

近年來,在以電氣電子零件領域為代表的各種領域中,作為應對環境的對策而向低鹵化的發展越發活躍。 In recent years, in various fields represented by the field of electrical and electronic components, the development of low-halogenation has become more active as a countermeasure against the environment.

以聚苯硫醚(polyphenylene sulfide)樹脂(以下,有時簡稱為「PPS樹脂」)為代表的聚芳硫醚(polyarylene sulfide)樹脂(以下,有時簡稱為「PAS樹脂」)即便不使用鹵素系阻燃劑亦可獲得高阻燃性,因此作為無鹵素(halogen free)材料而備受矚目。 A polyarylene sulfide resin (hereinafter sometimes abbreviated as "PAS resin") typified by a polyphenylene sulfide resin (hereinafter sometimes referred to as "PPS resin") may be used without using a halogen. The flame retardant is also highly flame-retardant, and is therefore attracting attention as a halogen free material.

聚苯硫醚樹脂例如可藉由如下溶液聚合而製造,即以對二氯苯與硫化鈉、或硫氫化鈉及氫氧化鈉作為原料,使該些於有機極性溶劑中進行聚合反應(例如,參照專利文獻1、專利文獻2)。目前市售的聚苯硫醚樹脂通常是藉由該方法而生產。 The polyphenylene sulfide resin can be produced, for example, by solution polymerization in which p-dichlorobenzene and sodium sulfide, or sodium hydrosulfide and sodium hydroxide are used as a raw material to carry out polymerization in an organic polar solvent (for example, Refer to Patent Document 1 and Patent Document 2). Commercially available polyphenylene sulfide resins are usually produced by this method.

但是,利用該方法獲得的聚合產物通常包含氯化鈉等副產物及有機極性溶劑,因此需要用以將該些去除的精製處理。另外,即便進行精製處理,亦難以將樹脂中的氯原子充分去除的情 況並不罕見。 However, since the polymerization product obtained by this method usually contains by-products such as sodium chloride and an organic polar solvent, a purification treatment for removing these is required. In addition, even if the refining treatment is performed, it is difficult to sufficiently remove the chlorine atoms in the resin. It is not uncommon.

聚芳硫醚樹脂的其他製造方法已知有如下方法,即不使用含有氯原子的原料及極性溶劑而使二碘芳香族化合物與單質硫進行熔融聚合(參照專利文獻3、專利文獻4、專利文獻5)。利用該方法獲得的聚芳硫醚樹脂雖含有碘原子,但例如藉由將聚合反應物或聚合反應後的粗製品於減壓下加熱而使碘昇華,可將碘原子相對容易地充分去除至低濃度。即,根據該利用熔融聚合的方法,可期待能夠容易地製造實質上不含氯原子且充分降低了鹵素原子的濃度的聚芳硫醚樹脂。 In another method for producing a polyarylene sulfide resin, there is known a method in which a diiodo aromatic compound and elemental sulfur are melt-polymerized without using a raw material containing a chlorine atom and a polar solvent (see Patent Document 3, Patent Document 4, and Patent). Document 5). Although the polyarylene sulfide resin obtained by this method contains an iodine atom, for example, the iodine atom can be sufficiently easily removed by heating the polymerization reaction product or the crude product after the polymerization reaction under reduced pressure to sublimate iodine. Low concentration. That is, according to the method using melt polymerization, it is expected that a polyarylene sulfide resin which does not substantially contain chlorine atoms and sufficiently reduces the concentration of halogen atoms can be easily produced.

[現有技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

[專利文獻1]美國專利第2,513,188號說明書 [Patent Document 1] US Patent No. 2,513,188

[專利文獻2]美國專利第2,583,941號說明書 [Patent Document 2] US Patent No. 2,583,941

[專利文獻3]美國專利第4,746,758號說明書 [Patent Document 3] US Patent No. 4,746,758

[專利文獻4]美國專利第4,786,713號說明書 [Patent Document 4] US Patent No. 4,786,713

[專利文獻5]日本專利2010-501661號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2010-501661

但是,以所述利用熔融聚合的方法獲得的聚芳硫醚樹脂於成形加工時等因加熱而產生的氣體(gas)的量相對多,在該方面上需要進一步改良。特別是,關於將聚芳硫醚樹脂與無機質填充劑、各種熱塑性樹脂、彈性體(elastomer)等其他材料混合而 製備的樹脂組成物,有氣體產生的問題變得顯著的傾向。若氣體產生量多,則有產生成形品的品質降低等問題的可能性,因此抑制氣體產生對於成形用材料而言於實用上非常重要。 However, in the polyarylene sulfide resin obtained by the method of melt polymerization, the amount of gas generated by heating during molding processing is relatively large, and further improvement is required in this respect. In particular, the polyarylene sulfide resin is mixed with other materials such as an inorganic filler, various thermoplastic resins, and elastomers. In the prepared resin composition, there is a tendency that the problem of gas generation becomes remarkable. When the amount of gas generated is large, there is a possibility that the quality of the molded article is lowered. Therefore, suppression of gas generation is very important for the molding material.

因此,本發明所欲解決的主要課題在於針對含有藉由使二碘芳香族化合物與單質硫進行熔融聚合的方法而獲得的聚芳硫醚樹脂的樹脂組成物,抑制由加熱所致的產生氣體量。 Therefore, the main object of the present invention is to suppress the generation of gas by heating by using a resin composition of a polyarylene sulfide resin obtained by a method of melt-polymerizing a diiodo aromatic compound and elemental sulfur. the amount.

本發明者等人進行各種研究,結果發現,可藉由在使二碘芳香族化合物與單質硫進行熔融聚合的聚芳硫醚樹脂的製造方法中,使用具有特定官能基的聚合抑制劑而解決所述課題,從而完成了本發明。 The inventors of the present invention conducted various studies and found that it can be solved by using a polymerization inhibitor having a specific functional group in a method for producing a polyarylene sulfide resin in which a diiodo aromatic compound and elemental sulfur are melt-polymerized. The subject matter described above has thus completed the present invention.

即,本發明是有關於一種聚芳硫醚樹脂組成物,其含有聚芳硫醚樹脂、及選自由無機質填充劑、所述聚芳硫醚樹脂以外的熱塑性樹脂、彈性體、及具有兩個以上交聯性官能基的交聯性樹脂所組成的組群中的至少一種其他成分(以下,有時簡稱為「所述其他成分」)。所述聚芳硫醚樹脂可藉由包括使二碘芳香族化合物、單質硫、及聚合抑制劑於包含所述二碘芳香族化合物、所述單質硫及所述聚合抑制劑的熔融混合物中反應的步驟的方法而獲得,且具有源自所述聚合抑制劑的羥基及/或胺基。 That is, the present invention relates to a polyarylene sulfide resin composition comprising a polyarylene sulfide resin, and a thermoplastic resin selected from the group consisting of an inorganic filler, the polyarylene sulfide resin, an elastomer, and two At least one other component (hereinafter, simply referred to as "the other component") of the group consisting of the crosslinkable resin of the above crosslinkable functional group. The polyarylene sulfide resin can be reacted by including a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing the diiodo aromatic compound, the elemental sulfur, and the polymerization inhibitor. Obtained by the method of the step, and having a hydroxyl group and/or an amine group derived from the polymerization inhibitor.

根據本發明,可針對含有藉由使二碘芳香族化合物與單質硫進行熔融聚合的方法而獲得的聚芳硫醚樹脂的樹脂組成物, 抑制由用於成形等的加熱所致的產生氣體量。 According to the present invention, a resin composition containing a polyarylene sulfide resin obtained by a method of melt-polymerizing a diiodo aromatic compound and elemental sulfur can be used. The amount of generated gas due to heating for forming or the like is suppressed.

本發明的聚芳硫醚樹脂組成物可成為實質上不含氯原子且充分降低了鹵素原子的濃度者。進而,本發明的聚芳硫醚樹脂組成物基於聚芳硫醚樹脂與選自無機質填充劑、熱塑性樹脂、彈性體、及具有兩個以上交聯性官能基的交聯性樹脂中的其他成分的組合,可表現出於機械特性、耐酸性、耐鹼性、耐熱水性、模腔平衡性(cavity balance)的方面亦優異的特性。模腔平衡性關係到藉由使用具有多個模腔的模具的射出成形而同時成形多個成形品時的各模腔的填充度的均勻性。若成形材料的模腔平衡性不充分,則有變得容易產生一部分模腔未經充分填充的成形不良的傾向。 The polyarylene sulfide resin composition of the present invention can be a substance which substantially does not contain a chlorine atom and sufficiently reduces the concentration of a halogen atom. Further, the polyarylene sulfide resin composition of the present invention is based on a polyarylene sulfide resin and other components selected from the group consisting of inorganic fillers, thermoplastic resins, elastomers, and crosslinkable resins having two or more crosslinkable functional groups. The combination can exhibit excellent characteristics in terms of mechanical properties, acid resistance, alkali resistance, hot water resistance, and cavity balance. The cavity balance is related to the uniformity of the filling degree of each cavity when a plurality of molded articles are simultaneously formed by injection molding using a mold having a plurality of cavities. When the cavity balance of the molding material is insufficient, there is a tendency that a molding failure in which a part of the cavity is not sufficiently filled is likely to occur.

以下,對本發明的較佳的實施方式進行詳細說明。但是,本發明並不限定於以下實施方式。 Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

本實施方式的聚芳硫醚樹脂組成物含有聚苯硫醚樹脂等聚芳硫醚樹脂。該聚芳硫醚樹脂可藉由包括在包含二碘芳香族化合物、單質硫、及聚合抑制劑的熔融混合物中,使二碘芳香族化合物、單質硫及聚合抑制劑反應的步驟的方法而獲得。 The polyarylene sulfide resin composition of the present embodiment contains a polyarylene sulfide resin such as a polyphenylene sulfide resin. The polyarylene sulfide resin can be obtained by a method comprising the steps of reacting a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor. .

二碘芳香族化合物具有芳香族環、及直接鍵結於芳香族環的兩個碘原子。二碘芳香族化合物可列舉:二碘苯、二碘甲苯、 二碘二甲苯、二碘萘、二碘聯苯、二碘二苯甲酮、二碘二苯醚及二碘二苯基碸等,但並不限定於該些。兩個碘原子的取代位置並無特別限定,較佳為兩個取代位置位於分子內儘可能遠的位置。較佳的取代位置為對位、及4,4'-位。 The diiodo aromatic compound has an aromatic ring and two iodine atoms directly bonded to the aromatic ring. Examples of the diiodo aromatic compound include diiodobenzene and diiodotoluene. Diiodoxylene, diiodonaphthalene, diiodobiphenyl, diiodobenzophenone, diiododiphenyl ether, diiododiphenylphosphonium, etc., but are not limited thereto. The substitution position of the two iodine atoms is not particularly limited, and it is preferred that the two substitution positions are located as far as possible within the molecule. Preferred substitution positions are the para position and the 4,4'-position.

二碘芳香族化合物的芳香族環亦可經選自苯基、碘原子以外的鹵素原子、羥基、硝基、胺基、碳原子數1~6的烷氧基、羧基、羧酸酯、芳基碸及芳基酮中的至少一種取代基取代。其中,就聚芳硫醚樹脂的結晶度及耐熱性等觀點而言,經取代的二碘芳香族化合物相對於未經取代的二碘芳香族化合物的比例較佳為0.0001質量%~5質量%的範圍,更佳為0.001質量%~1質量%的範圍。 The aromatic ring of the diiodo aromatic compound may also be a halogen atom selected from a phenyl group or an iodine atom, a hydroxyl group, a nitro group, an amine group, an alkoxy group having 1 to 6 carbon atoms, a carboxyl group, a carboxylate group, and an aromatic group. Substituting at least one substituent in the quinone and aryl ketone. In view of the crystallinity and heat resistance of the polyarylene sulfide resin, the ratio of the substituted diiodo aromatic compound to the unsubstituted diiodo aromatic compound is preferably 0.0001% by mass to 5% by mass. The range is more preferably in the range of 0.001% by mass to 1% by mass.

單質硫意指僅由硫原子構成的物質(S8、S6、S4、S2等),其形態並無限定。具體而言,可使用作為日本藥局法所規定醫藥品而市售的單質硫,亦可使用可以通用的方式獲取的包含S8及S6等的混合物。單質硫的純度亦無特別限定。單質硫若於室溫(23℃)下為固體,則可為粒形狀或粉末狀。單質硫的粒徑並無特別限定,較佳為0.001mm~10mm的範圍,更佳為0.01mm~5mm的範圍,進而較佳為0.01mm~3mm的範圍。 Elemental sulfur means a substance composed only of sulfur atoms (S 8 , S 6 , S 4 , S 2 , etc.), and its form is not limited. Specifically, elemental sulfur which is commercially available as a pharmaceutical product prescribed by the Japanese Pharmacopoeia Law can be used, and a mixture containing S 8 and S 6 which can be obtained in a general manner can also be used. The purity of elemental sulfur is also not particularly limited. If the elemental sulfur is a solid at room temperature (23 ° C), it may be in the form of a pellet or a powder. The particle size of the elemental sulfur is not particularly limited, but is preferably in the range of 0.001 mm to 10 mm, more preferably in the range of 0.01 mm to 5 mm, and still more preferably in the range of 0.01 mm to 3 mm.

聚合抑制劑為於聚芳硫醚樹脂的聚合反應中抑制或終止該聚合反應的化合物,且包含至少一種可於聚芳硫醚樹脂的主鏈的末端導入羥基及/或胺基的化合物。視需要,亦可併用不具有該些官能基的化合物等作為聚合抑制劑。聚合抑制劑可具有羥基 及/或胺基,亦可藉由聚合的終止反應等而生成羥基或胺基。例如,可使用下述式(I)或式(II)所表示的化合物作為聚合抑制劑。式(I)中,X表示羥基或胺基。 The polymerization inhibitor is a compound which inhibits or terminates the polymerization reaction in the polymerization reaction of the polyarylene sulfide resin, and contains at least one compound which can introduce a hydroxyl group and/or an amine group at the terminal of the main chain of the polyarylene sulfide resin. As the polymerization inhibitor, a compound or the like which does not have such a functional group may be used in combination as needed. The polymerization inhibitor may have a hydroxyl group And/or an amine group, or a hydroxyl group or an amine group may be formed by a termination reaction of polymerization or the like. For example, a compound represented by the following formula (I) or formula (II) can be used as a polymerization inhibitor. In the formula (I), X represents a hydroxyl group or an amine group.

式(I)所表示的化合物例如可列舉2-碘苯酚、2-胺基苯胺等。式(II)所表示的化合物可列舉2-碘二苯甲酮。 Examples of the compound represented by the formula (I) include 2-iodophenol and 2-aminoaniline. The compound represented by the formula (II) is exemplified by 2-iodobenzophenone.

根據式(I)所表示的化合物,導入下述式(I-1)所表示的一價基團作為主鏈的末端基。式(I-1)中的X為源自聚合抑制劑的羥基或胺基。 According to the compound represented by the formula (I), a monovalent group represented by the following formula (I-1) is introduced as a terminal group of the main chain. X in the formula (I-1) is a hydroxyl group or an amine group derived from a polymerization inhibitor.

根據式(II)所表示的化合物,導入下述式(II-1)所表 示的一價基團作為主鏈的末端基。源自式(II)所表示的化合物的羥基例如可藉由式(II)中的羰基的碳原子與硫自由基鍵結而導入至聚芳硫醚樹脂中。 According to the compound represented by the formula (II), the following formula (II-1) is introduced. The monovalent group shown is the terminal group of the main chain. The hydroxyl group derived from the compound represented by the formula (II) can be introduced into the polyarylene sulfide resin by, for example, bonding a carbon atom of a carbonyl group in the formula (II) to a sulfur radical.

可認為式(I-1)或式(II-1)所表示的基團是藉由在聚芳硫醚樹脂的主鏈中源自原料(單質硫)而存在的雙硫鍵(disulfide bond)於熔融溫度下發生自由基開裂而產生的硫自由基、與式(I)所表示的化合物或式(II)所表示的化合物進行鍵結而導入至聚芳硫醚樹脂中。該些特定結構的構成單元的存在是本實施方式的藉由熔融聚合而獲得的聚芳硫醚樹脂的特徵所在。 The group represented by the formula (I-1) or the formula (II-1) is considered to be a disulfide bond which is derived from a raw material (elemental sulfur) in the main chain of the polyarylene sulfide resin. The sulfur radical generated by radical cracking at the melting temperature is bonded to the compound represented by the formula (I) or the compound represented by the formula (II) to be introduced into the polyarylene sulfide resin. The presence of the constituent units of the specific structures is characteristic of the polyarylene sulfide resin obtained by melt polymerization of the present embodiment.

本實施方式的聚芳硫醚樹脂是藉由在將包含二碘芳香族化合物、單質硫、聚合抑制劑、及視需要的觸媒的混合物加熱而獲得的熔融混合物中進行熔融聚合而生成。關於熔融混合物中的二碘芳香族化合物的比例,相對於單質硫1莫耳,較佳為0.5莫耳~2莫耳的範圍,更佳為0.8莫耳~1.2莫耳的範圍。另外,關於混合物中的聚合抑制劑的比例,相對於固體硫1莫耳,較佳為0.0001莫耳~0.1莫耳的範圍,更佳為0.0005~0.05的範圍。 The polyarylene sulfide resin of the present embodiment is produced by melt polymerization in a molten mixture obtained by heating a mixture containing a diiodide aromatic compound, elemental sulfur, a polymerization inhibitor, and an optional catalyst. The proportion of the diiodo aromatic compound in the molten mixture is preferably in the range of 0.5 mol to 2 mol, more preferably in the range of 0.8 mol to 1.2 mol, based on the elemental sulfur 1 mol. Further, the ratio of the polymerization inhibitor in the mixture is preferably in the range of 0.0001 mol to 0.1 mol, more preferably in the range of 0.0005 to 0.05, relative to the solid sulfur 1 mol.

添加聚合抑制劑的時期並無特別限制,可將包含二碘芳香族化合物、單質硫及視需要添加的觸媒的混合物進行加熱,於混合物的溫度成為較佳為200℃~320℃的範圍、更佳為250℃~320℃的範圍的時間點添加聚合抑制劑。 The period in which the polymerization inhibitor is added is not particularly limited, and a mixture containing a diiodide aromatic compound, elemental sulfur, and optionally a catalyst may be heated, and the temperature of the mixture is preferably in the range of 200 ° C to 320 ° C. More preferably, a polymerization inhibitor is added at a time point in the range of 250 ° C to 320 ° C.

可於熔融混合物中添加硝基化合物作為觸媒來調節聚合速度。該硝基化合物通常可使用各種硝基苯衍生物。硝基苯衍生物例如可列舉:1,3-二碘-4-硝基苯、1-碘-4-硝基苯、2,6-二碘-4-硝基苯酚及2,6-二碘-4-硝基胺。觸媒的量通常只要為作為觸媒而添加的量即可,例如較佳為相對於單質硫100質量份為0.01質量份~20質量份的範圍。 A nitro compound can be added to the molten mixture as a catalyst to adjust the polymerization rate. As the nitro compound, various nitrobenzene derivatives can be usually used. Examples of the nitrobenzene derivative include 1,3-diiodo-4-nitrobenzene, 1-iodo-4-nitrobenzene, 2,6-diiodo-4-nitrophenol, and 2,6-di Iodine-4-nitroamine. The amount of the catalyst is usually an amount to be added as a catalyst. For example, it is preferably in the range of 0.01 part by mass to 20 parts by mass based on 100 parts by mass of the elemental sulfur.

熔融聚合的條件可以使聚合反應適當進行的方式適宜調整。熔融聚合的溫度較佳為175℃以上且所生成的聚芳硫醚樹脂的熔點+100℃以下的範圍,更佳為180℃~350℃的範圍。熔融聚合是於絕對壓力較佳為1[cPa]~100[kPa]的範圍、更佳為13[cPa]~60[kPa]的範圍下進行。熔融聚合的條件無須為固定。例如,聚合初期可將溫度設為較佳為175℃~270℃的範圍、更佳為180℃~250℃的範圍,且將絕對壓力設為6.7[kPa]~100[kPa]的範圍,其後,一面連續地或呈階段狀地升溫及減壓一面進行聚合,聚合後期可將溫度設為較佳為270℃以上且所生成的聚芳硫醚樹脂的熔點+100℃以下的範圍、更佳為300℃~350℃的範圍,且將絕對壓力設為1[cPa]~6[kPa]的範圍而進行聚合。於本說明書中,樹脂的熔點意指使用示差掃描量熱計(珀金埃爾默(PerkinElmer)製 造的DSC(示差掃描量熱計(differential scanning calorimeter))裝置Pyris Diamond)依據日本工業標準(Japanese Industrial Standards,JIS)K 7121而測定的值。 The conditions of the melt polymerization can be suitably adjusted in such a manner that the polymerization reaction proceeds appropriately. The temperature of the melt polymerization is preferably 175 ° C or higher and the melting point of the produced polyarylene sulfide resin is +100 ° C or lower, more preferably 180 ° C to 350 ° C. The melt polymerization is carried out in a range where the absolute pressure is preferably from 1 [cPa] to 100 [kPa], more preferably from 13 [cPa] to 60 [kPa]. The conditions of the melt polymerization need not be fixed. For example, in the initial stage of polymerization, the temperature may be preferably in the range of 175 ° C to 270 ° C, more preferably in the range of 180 ° C to 250 ° C, and the absolute pressure may be in the range of 6.7 [kPa] to 100 [kPa]. Thereafter, the polymerization is carried out while continuously raising or depressurizing in a stepwise manner, and the temperature in the late stage of polymerization can be preferably 270 ° C or higher and the melting point of the produced polyarylene sulfide resin + 100 ° C or lower, and more. The polymerization is carried out in a range of from 300 ° C to 350 ° C and an absolute pressure of from 1 [cPa] to 6 [kPa]. In the present specification, the melting point of the resin means the use of a differential scanning calorimeter (PerkinElmer) The manufactured DSC (differential scanning calorimeter) device Pyris Diamond) is a value measured in accordance with Japanese Industrial Standards (JIS) K 7121.

就防止氧化交聯反應且獲得高聚合度的觀點而言,熔融聚合較佳為於非氧化性環境下進行。於非氧化性環境下,氣相的氧濃度較佳為小於5體積%,更佳為小於2體積%,進而較佳為氣相實質上不含氧。非氧化性環境較佳為氮、氦、及氬等惰性氣體環境。 From the viewpoint of preventing the oxidative crosslinking reaction and obtaining a high degree of polymerization, the melt polymerization is preferably carried out in a non-oxidizing atmosphere. In a non-oxidizing environment, the oxygen concentration in the gas phase is preferably less than 5% by volume, more preferably less than 2% by volume, and further preferably the gas phase is substantially free of oxygen. The non-oxidizing environment is preferably an inert gas atmosphere such as nitrogen, helium or argon.

熔融聚合例如可使用具備加熱裝置、減壓裝置及攪拌裝置的熔融混練機而進行。熔融混練機例如可列舉:班伯里混練機(Banbury mixer)、捏合機(kneader)、連續混練機、單軸擠出機、及雙軸擠出機。 The melt polymerization can be carried out, for example, using a melt kneader equipped with a heating device, a pressure reducing device, and a stirring device. Examples of the melt kneading machine include a Banbury mixer, a kneader, a continuous kneader, a single-screw extruder, and a twin-screw extruder.

用於熔融聚合的熔融混合物較佳為實質上不含溶劑。更具體而言,熔融混合物中所含的溶劑的量相對於二碘芳香族化合物、單質硫、聚合抑制劑、及視需要的觸媒的合計100質量份,較佳為10質量份以下的範圍,更佳為5質量份以下的範圍,進而較佳為1質量份以下的範圍。溶劑的量亦可為0質量份以上的範圍、0.01質量份以上的範圍、或0.1質量份以上的範圍。 The molten mixture for melt polymerization is preferably substantially free of solvent. More specifically, the amount of the solvent contained in the molten mixture is preferably 10 parts by mass or less based on 100 parts by mass of the total of the diiodide aromatic compound, the elemental sulfur, the polymerization inhibitor, and the optional catalyst. It is more preferably in the range of 5 parts by mass or less, and still more preferably in the range of 1 part by mass or less. The amount of the solvent may be in the range of 0 parts by mass or more, in the range of 0.01 parts by mass or more, or in the range of 0.1 parts by mass or more.

亦可在將熔融聚合後的熔融混合物(反應產物)冷卻而獲得固體狀態的混合物後,於減壓下、或非氧化性環境的大氣壓下,將混合物加熱而使聚合反應進一步進行。藉此,不僅可進一步增大分子量,而且可使所生成的碘分子昇華而將其去除,因此 可將聚芳硫醚樹脂中的碘原子濃度抑制得低。藉由冷卻至較佳為100℃~260℃的範圍、更佳為130℃~250℃的範圍、進而較佳為150℃~230℃的範圍的溫度,可獲得固體狀態的混合物。冷卻至固體狀態後的加熱可於與熔融聚合相同的溫度及壓力條件下進行。 After the molten mixture (reaction product) after melt polymerization is cooled to obtain a mixture in a solid state, the mixture is heated under reduced pressure or atmospheric pressure in a non-oxidizing atmosphere to further carry out the polymerization reaction. Thereby, not only the molecular weight can be further increased, but also the generated iodine molecules can be sublimated and removed, thereby The concentration of iodine atoms in the polyarylene sulfide resin can be suppressed to be low. The mixture in a solid state can be obtained by cooling to a temperature of preferably from 100 ° C to 260 ° C, more preferably from 130 ° C to 250 ° C, and still more preferably from 150 ° C to 230 ° C. The heating after cooling to a solid state can be carried out under the same temperature and pressure conditions as the melt polymerization.

藉由熔融聚合步驟而獲得的包含聚芳硫醚樹脂的反應產物亦可藉由以該狀態直接投入至熔融混練機中等方法而製造樹脂組成物,但較佳為於該反應產物中添加溶解該反應產物的溶劑而製備溶解物,於該溶解物的狀態下自反應裝置中提取反應產物,其原因在於,不僅生產性優異,而且進而反應性亦良好。溶解該反應產物的溶劑的添加較佳為於熔融聚合後進行,但亦可於熔融聚合的反應後期進行,另外,亦可為如上所述般在將熔融混合物(反應產物)冷卻而獲得固體狀態的混合物後,於加壓下、減壓下、或非氧化性環境的大氣壓下,將混合物加熱而使聚合反應進一步進行之後。製備該溶解物的步驟亦可於非氧化性環境下進行。另外,加熱溶解的溫度只要為溶解所述反應產物的溶劑的熔點以上的範圍即可,較佳為200℃~350℃的範圍,更佳為210℃~250℃的範圍,且較佳為於加壓下進行。 The reaction product containing the polyarylene sulfide resin obtained by the melt polymerization step can also be used to produce a resin composition by directly feeding it into a melt kneader in this state, but it is preferred to add and dissolve the reaction product. The solvent of the reaction product is used to prepare a lysate, and the reaction product is extracted from the reaction apparatus in the state of the lysate, because the productivity is excellent and the reactivity is also good. The addition of the solvent for dissolving the reaction product is preferably carried out after the melt polymerization, but may be carried out later in the reaction of the melt polymerization, or may be obtained by cooling the molten mixture (reaction product) as described above to obtain a solid state. After the mixture is heated under pressure, under reduced pressure, or under a non-oxidizing atmosphere, the polymerization reaction is further carried out. The step of preparing the solute can also be carried out in a non-oxidizing environment. Further, the temperature for heating and dissolving may be in a range of not less than the melting point of the solvent in which the reaction product is dissolved, preferably in the range of 200 ° C to 350 ° C, more preferably in the range of 210 ° C to 250 ° C, and preferably in the range of 210 ° C to 250 ° C. It is carried out under pressure.

關於用以製備所述溶解物的且溶解所述反應產物的溶劑的調配比例,相對於包含聚芳硫醚樹脂的反應產物100質量份,較佳為90質量份~1000質量份,更佳為200質量份~400質量份的範圍。 The blending ratio of the solvent for preparing the solute and dissolving the reaction product is preferably from 90 parts by mass to 1000 parts by mass, more preferably from 90 parts by mass to 1000 parts by mass, based on 100 parts by mass of the reaction product containing the polyarylene sulfide resin. A range of 200 parts by mass to 400 parts by mass.

溶解反應產物的溶劑例如可使用於菲利普斯法(Phillips method)等溶液聚合中用作聚合反應溶劑的溶劑。較佳的溶劑的例子可列舉:N-甲基-2-吡咯啶酮(以下,簡記為NMP)、N-環己基-2-吡咯啶酮、2-吡咯啶酮、1,3-二甲基-2-咪唑啉酮酸、ε-己內醯胺、N-甲基-ε-己內醯胺等脂肪族環狀醯胺化合物、六甲基磷酸三醯胺(HMPA)、四甲基脲(TMU)、二甲基甲醯胺(DMF)、及二甲基乙醯胺(DMA)等醯胺化合物、聚乙二醇二烷基醚(聚合度為2000以下,且具有碳數1~20的烷基者)等醚化聚乙二醇化合物、以及四亞甲基亞碸、及二甲基亞碸(DMSO)等亞碸化合物。其他可使用的溶劑的例子可列舉選自由以下溶劑所組成的組群中的一種以上的溶劑:二苯甲酮、二苯醚、二苯基硫醚、4,4'-二溴聯苯、1-苯基萘、2,5-二苯基-1,3,4-噁二唑、2,5-二苯基噁唑、三苯基甲醇、N,N-二苯基甲醯胺、苯偶醯、蒽、4-苯甲醯基聯苯、二苯甲醯基甲烷、2-聯苯羧酸、二苯并噻吩、五氯苯酚、1-苄基-2-吡咯二酮、9-茀酮、2-苯甲醯基萘、1-溴萘、1,3-二苯氧基苯、茀、1-苯基-2-吡咯啶酮、1-甲氧基萘、1-乙氧基萘、1,3-二苯基丙酮、1,4-二苯甲醯基丁烷、菲、4-苯甲醯基聯苯、1,1-二苯基丙酮、鄰,鄰'-聯苯酚、2,6-二苯基苯酚、聯三伸苯、2-苯基苯酚、噻嗯、3-苯氧基苄醇、4-苯基苯酚、9,10-二氯蒽、三苯基甲烷、4,4'-二甲氧基二苯甲酮、9,10-二苯基蒽、熒蒽(fluoranthene)、鄰苯二甲酸二苯酯、碳酸二苯酯、2,6-二甲氧基萘、2,7-二甲氧基萘、4-溴二苯醚、芘、9,9'-聯-茀、4,4'-亞異丙基-二苯酚、ε-己內醯胺 (epsilon-caprolactam)、N-環己基-2-吡咯啶酮、間苯二甲酸二苯酯及對苯二甲酸二苯酯及1-氯萘。 The solvent which dissolves the reaction product can be, for example, a solvent used as a polymerization solvent in solution polymerization such as the Phillips method. Examples of preferred solvents include N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP), N-cyclohexyl-2-pyrrolidone, 2-pyrrolidone, and 1,3-dimethylene. Aliphatic cyclic guanamine compounds such as keto-2-imidazolidinone, ε-caprolactam, N-methyl-ε-caprolactam, trimethylamine hexamethylphosphate (HMPA), tetramethyl A guanamine compound such as urea (TMU), dimethylformamide (DMF), and dimethylacetamide (DMA), polyethylene glycol dialkyl ether (degree of polymerization of 2000 or less, and carbon number 1) An etherified polyethylene glycol compound such as an alkyl group of ~20), and an anthracene compound such as tetramethylenefluorene or dimethylarylene (DMSO). Examples of other solvent which can be used include one or more solvents selected from the group consisting of benzophenone, diphenyl ether, diphenyl sulfide, 4,4'-dibromobiphenyl, 1-phenylnaphthalene, 2,5-diphenyl-1,3,4-oxadiazole, 2,5-diphenyloxazole, triphenylmethanol, N,N-diphenylformamide, Benzophenone, anthracene, 4-benzylidenebiphenyl, benzhydrylmethane, 2-biphenylcarboxylic acid, dibenzothiophene, pentachlorophenol, 1-benzyl-2-pyrroledione, 9 -fluorenone, 2-benzylidene naphthalene, 1-bromonaphthalene, 1,3-diphenoxybenzene, anthracene, 1-phenyl-2-pyrrolidone, 1-methoxynaphthalene, 1-B Oxynaphthalene, 1,3-diphenylacetone, 1,4-dibenylbutane, phenanthrene, 4-benzylidenebiphenyl, 1,1-diphenylacetone, o-, o-'- Biphenol, 2,6-diphenylphenol, hydrazine, 2-phenylphenol, thiophene, 3-phenoxybenzyl alcohol, 4-phenylphenol, 9,10-dichloropurine, triphenyl Methane, 4,4'-dimethoxybenzophenone, 9,10-diphenylanthracene, fluoranthene, diphenyl phthalate, diphenyl carbonate, 2,6-di Methoxynaphthalene, 2,7-dimethoxynaphthalene, 4-bromodiphenyl ether, , 9,9' - fluorene, 4,4'-isopropylidene - diphenol, [epsilon] caprolactam (epsilon-caprolactam), N-cyclohexyl-2-pyrrolidone, diphenyl isophthalate and diphenyl terephthalate and 1-chloronaphthalene.

自反應裝置中提取的該溶解物較佳為進行後處理後,與所述其他成分進行熔融混練而製備樹脂組成物,其原因在於,反應性變得更良好。溶解物的後處理的方法並無特別限制,例如可列舉以下方法。 The dissolved material extracted from the reaction apparatus is preferably subjected to post-treatment, and is melt-kneaded with the other components to prepare a resin composition because the reactivity is further improved. The method of post-treatment of the dissolved matter is not particularly limited, and examples thereof include the following methods.

(1)將該溶解物直接、或者在添加酸或鹼後,於減壓下或常壓化下將溶劑蒸餾去除,繼而將溶劑蒸餾去除後的固形物利用選自水、該溶解物所使用的溶劑(或者對於低分子聚合物(polymer)具有同等的溶解度的有機溶劑)、丙酮、甲基乙基酮、及醇類等中的溶劑洗滌1次或2次以上,進而進行中和、水洗、過濾及乾燥的方法。 (1) The solute is directly or after adding an acid or a base, the solvent is distilled off under reduced pressure or under normal pressure, and then the solid matter obtained by distilling off the solvent is selected from water selected from the lysate. The solvent (or an organic solvent having the same solubility for a low molecular weight polymer), the solvent in acetone, methyl ethyl ketone, and an alcohol or the like is washed once or twice, and further neutralized and washed. , filtration and drying methods.

(2)於該溶解物中添加水、丙酮、甲基乙基酮、醇、醚、鹵化烴、芳香族烴、及脂肪族烴等溶劑(可溶於該溶解物的溶劑,且至少對於聚芳硫醚樹脂為不良溶劑的溶劑)作為沈澱劑,使包含聚芳硫醚樹脂及無機鹽等的固體狀產物沈澱,並對固體狀產物進行過濾分離、洗滌及乾燥的方法。 (2) adding a solvent such as water, acetone, methyl ethyl ketone, alcohol, ether, halogenated hydrocarbon, aromatic hydrocarbon, or aliphatic hydrocarbon to the solute (a solvent soluble in the solute, and at least for the poly The aryl sulfide resin is a solvent of a poor solvent. As a precipitation agent, a solid product containing a polyarylene sulfide resin, an inorganic salt or the like is precipitated, and the solid product is subjected to filtration, separation, washing and drying.

(3)於該溶解物中添加該溶解物所使用的溶劑(或者對於低分子聚合物具有同等的溶解度的有機溶劑)並攪拌後,進行過濾而將低分子量聚合物去除後,利用選自水、丙酮、甲基乙基酮、及醇等中的溶劑洗滌1次或2次以上,其後進行中和、水洗、過濾及乾燥的方法。 (3) adding a solvent (or an organic solvent having an equivalent solubility to a low molecular weight polymer) to the solute, stirring the mixture, and filtering the low molecular weight polymer to remove the The solvent in acetone, methyl ethyl ketone, and alcohol is washed once or twice, and then neutralized, washed with water, filtered, and dried.

此外,於如所述(1)~(3)所例示的後處理方法中,聚芳硫醚樹脂的乾燥可於真空中進行,亦可於空氣中或如氮氣般的惰性氣體環境中進行。亦可於氧濃度為5體積%~30體積%的範圍的氧化性環境中或減壓條件下進行熱處理,而使聚芳硫醚樹脂進行氧化交聯。 Further, in the post-treatment method as exemplified in the above (1) to (3), the drying of the polyarylene sulfide resin may be carried out in a vacuum, or may be carried out in the air or in an inert gas atmosphere such as nitrogen. The polyarylene sulfide resin may be subjected to oxidative crosslinking by performing heat treatment in an oxidizing atmosphere or a reduced pressure condition in an oxygen concentration of from 5% by volume to 30% by volume.

藉由熔融聚合而獲得的包含聚芳硫醚樹脂的反應產物含有源自原料的碘原子。因此,聚芳硫醚樹脂通常以含有碘原子的混合物的狀態用於樹脂組成物的製備等。該混合物中的碘原子的濃度例如相對於聚芳硫醚樹脂為0.01ppm~10000ppm的範圍,較佳為10ppm~5000ppm的範圍。利用碘分子的昇華性,亦可將碘原子濃度抑制得低,在該情況下,亦可設為900ppm以下的範圍、較佳為100ppm以下的範圍、進而10ppm以下的範圍。進而雖亦可將碘原子去除至檢測極限以下,但若考慮生產性,則不實用。檢測極限例如為0.01ppm左右。藉由熔融聚合而獲得的本實施方式的聚芳硫醚樹脂或含其的反應產物於含有碘原子的方面例如可與藉由菲利普斯法等二氯芳香族化合物於有機極性溶劑中的溶液聚合法而獲得的聚芳硫醚明確區別。 The reaction product containing a polyarylene sulfide resin obtained by melt polymerization contains an iodine atom derived from a raw material. Therefore, the polyarylene sulfide resin is usually used in the preparation of a resin composition or the like in a state of a mixture containing an iodine atom. The concentration of the iodine atom in the mixture is, for example, in the range of 0.01 ppm to 10,000 ppm with respect to the polyarylene sulfide resin, and preferably in the range of 10 ppm to 5000 ppm. The iodine atom concentration can be suppressed to be low by the sublimation property of the iodine molecule. In this case, the range may be 900 ppm or less, preferably 100 ppm or less, and further 10 ppm or less. Further, although the iodine atom can be removed to the detection limit or less, it is not practical if productivity is considered. The detection limit is, for example, about 0.01 ppm. The polyarylene sulfide resin of the present embodiment obtained by melt polymerization or a reaction product containing the same may be, for example, a solution polymerization of a dichloroaromatic compound such as a Phillips method in an organic polar solvent, in terms of containing an iodine atom. The polyarylene sulfide obtained by the method is clearly distinguished.

一實施方式的作為聚芳硫醚樹脂的聚苯硫醚樹脂例如具有包含下述通式(10)所表示的重複單元(芳硫醚單元)的主鏈。 The polyphenylene sulfide resin as the polyarylene sulfide resin of the embodiment has, for example, a main chain comprising a repeating unit (arylene sulfide unit) represented by the following formula (10).

式(10)所表示的重複單元更佳為以對位鍵結的下述式(10a)所表示的重複單元、及以間位鍵結的下述式(10b)所表示的重複單元。 The repeating unit represented by the formula (10) is more preferably a repeating unit represented by the following formula (10a) which is bonded by a para position, and a repeating unit represented by the following formula (10b) which is a meta-bond.

該些之中,式(10a)所表示的以對位鍵結的重複單元於樹脂的耐熱性及結晶性的方面較佳。 Among these, the repeating unit bonded by the formula represented by the formula (10a) is preferable in terms of heat resistance and crystallinity of the resin.

一實施方式的聚苯硫醚樹脂可包含下述通式(11)所表示的具有作為鍵結於芳香族環的側鏈的取代基的重複單元。 The polyphenylene sulfide resin of one embodiment may contain a repeating unit having a substituent which is a side chain bonded to an aromatic ring represented by the following formula (11).

(式中,R20及R21分別獨立地表示氫原子、碳原子數1~4的烷基、硝基、胺基、苯基、甲氧基、或乙氧基) (wherein R 20 and R 21 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a nitro group, an amine group, a phenyl group, a methoxy group, or an ethoxy group)

其中,就結晶度及耐熱性的降低的觀點而言,聚苯硫醚樹脂較佳為實質上不含通式(11)的重複單元。更具體而言,關於式(11)所表示的重複單元的比例,相對於式(10)所表示的重複單元與式(11)所表示的重複單元的合計,較佳為2質量%以下,更佳為0.2質量%以下。 Among them, the polyphenylene sulfide resin preferably contains substantially no repeating unit of the formula (11) from the viewpoint of a decrease in crystallinity and heat resistance. More specifically, the ratio of the repeating unit represented by the formula (11) is preferably 2% by mass or less based on the total of the repeating unit represented by the formula (10) and the repeating unit represented by the formula (11). More preferably, it is 0.2 mass% or less.

本實施方式的聚芳硫醚樹脂主要由所述芳硫醚單元構成,但通常於主鏈中亦包含源自原料的單質硫的下述式(20)所表示的基於雙硫鍵的構成單元。 The polyarylene sulfide resin of the present embodiment is mainly composed of the arylene sulfide unit, but usually contains a disulfide bond-based constituent unit represented by the following formula (20) which is derived from the elemental sulfur of the raw material in the main chain. .

就耐熱性、機械強度的方面而言,關於式(20)所表示的構成單元的比例,相對於芳硫醚單元與式(20)所表示的構成部位的合計,較佳為2.9質量%以下的範圍,更佳為1.2質量%以下的範圍。 In terms of heat resistance and mechanical strength, the ratio of the constituent unit represented by the formula (20) is preferably 2.9 mass% or less based on the total of the constituent portions represented by the aryl sulfide unit and the formula (20). The range is preferably 1.2% by mass or less.

本實施方式的聚芳硫醚樹脂的熔點較佳為250℃~ 300℃的範圍,更佳為265℃~300℃的範圍。聚芳硫醚樹脂於300℃下的熔融黏度(V6)較佳為1[Pa.s]~2000[Pa.s]的範圍,更佳為5[Pa.s]~1700[Pa.s]的範圍。此處,熔融黏度(V6)意指使用流量測試儀(flow tester),於溫度300℃、荷重1.96MPa下,利用孔口長度(orifice length)與孔口直徑的比(孔口長度/孔口直徑)為10/1的孔口保持6分鐘後的熔融黏度。 The polyarylene sulfide resin of the present embodiment preferably has a melting point of 250 ° C. The range of 300 ° C, more preferably 265 ° C ~ 300 ° C range. The melt viscosity (V6) of the polyarylene sulfide resin at 300 ° C is preferably 1 [Pa. s]~2000[Pa. The range of s] is more preferably 5 [Pa. s]~1700[Pa. The scope of s]. Here, the melt viscosity (V6) means the ratio of the orifice length to the orifice diameter (the orifice length/orifice) at a temperature of 300 ° C and a load of 1.96 MPa using a flow tester. The orifice having a diameter of 10/1 maintained the melt viscosity after 6 minutes.

本實施方式的聚芳硫醚樹脂組成物可含有一種或兩種以上的無機質填充劑。藉由調配無機填充劑,可獲得高剛性、高耐熱穩定性的組成物。無機填充劑例如可列舉:碳黑、碳酸鈣、二氧化矽及氧化鈦等粉末狀填充劑,滑石(talc)及雲母(mica)等板狀填充劑,玻璃珠(glass beads)、二氧化矽珠及玻璃球(glass balloon)等粒狀填充劑,玻璃纖維、碳纖維及矽灰石(wollastonite)纖維等纖維狀填充劑,以及玻璃鱗片(glass flake)。聚芳硫醚樹脂組成物尤佳為含有選自由玻璃纖維、碳纖維、碳黑、及碳酸鈣所組成的組群中的至少一種無機質填充劑。 The polyarylene sulfide resin composition of the present embodiment may contain one or two or more inorganic fillers. By blending an inorganic filler, a composition having high rigidity and high heat resistance stability can be obtained. Examples of the inorganic filler include powdery fillers such as carbon black, calcium carbonate, cerium oxide, and titanium oxide; plate-shaped fillers such as talc and mica; glass beads and cerium oxide. Granular fillers such as beads and glass balloons, fibrous fillers such as glass fibers, carbon fibers and wollastonite fibers, and glass flakes. The polyarylene sulfide resin composition is particularly preferably at least one inorganic filler selected from the group consisting of glass fibers, carbon fibers, carbon black, and calcium carbonate.

無機填充劑的含量相對於聚芳硫醚樹脂100質量份,較佳為1質量份~300質量份的範圍,更佳為5質量份~200質量份的範圍,進而較佳為15質量份~150質量份的範圍。藉由無機質填充劑的含量在該些範圍內,可獲得於保持成形品的機械強度的方面更優異的效果。 The content of the inorganic filler is preferably from 1 part by mass to 300 parts by mass, more preferably from 5 parts by mass to 200 parts by mass, even more preferably from 15 parts by mass to 100 parts by mass per 100 parts by mass of the polyarylene sulfide resin. A range of 150 parts by mass. When the content of the inorganic filler is within these ranges, it is possible to obtain an effect that is more excellent in maintaining the mechanical strength of the molded article.

本實施方式的聚芳硫醚樹脂組成物可含有選自熱塑性樹脂、彈性體、及交聯性樹脂中的聚芳硫醚樹脂以外的樹脂。該 些樹脂亦可與無機質填充劑一併調配於樹脂組成物中。 The polyarylene sulfide resin composition of the present embodiment may contain a resin other than the polyarylene sulfide resin selected from the group consisting of a thermoplastic resin, an elastomer, and a crosslinkable resin. The These resins may also be blended with the inorganic filler in the resin composition.

調配於聚芳硫醚樹脂組成物中的熱塑性樹脂例如可列舉:聚酯、聚醯胺、聚醯亞胺、聚醚醯亞胺、聚碳酸酯、聚苯醚、聚碸、聚醚碸、聚醚醚酮、聚醚酮、聚乙烯、聚丙烯、聚四氟乙烯、聚二氟乙烯、聚苯乙烯、丙烯腈-丁二烯-苯乙烯(Acrylonitrile Butadiene Styrene,ABS)樹脂、矽酮樹脂、及液晶聚合物(液晶聚酯等)。 The thermoplastic resin to be blended in the composition of the polyarylene sulfide resin may, for example, be a polyester, a polyamide, a polyimine, a polyether quinone, a polycarbonate, a polyphenylene ether, a polyfluorene or a polyether oxime. Polyetheretherketone, polyetherketone, polyethylene, polypropylene, polytetrafluoroethylene, polydifluoroethylene, polystyrene, acrylonitrile butadiene styrene (ABS) resin, fluorenone resin And liquid crystal polymer (liquid crystal polyester, etc.).

聚醯胺為具有醯胺鍵(-NHCO-)的聚合物。聚醯胺樹脂例如可列舉:(i)由二胺與二羧酸的縮聚獲得的聚合物、(ii)由胺基羧酸的縮聚獲得的聚合物、及(iii)由內醯胺的開環聚合獲得的聚合物等。聚醯胺可單獨使用或組合兩種以上而使用。 Polyamine is a polymer having a guanamine bond (-NHCO-). The polyamine resin may, for example, be (i) a polymer obtained by polycondensation of a diamine and a dicarboxylic acid, (ii) a polymer obtained by polycondensation of an aminocarboxylic acid, and (iii) open from an indoleamine. A polymer obtained by ring polymerization or the like. Polyamine can be used singly or in combination of two or more.

用以獲得聚醯胺的二胺的例子可列舉:脂肪族系二胺、芳香族系二胺、及脂環族系二胺類。脂肪族系二胺較佳為直鏈狀或具有側鏈的碳數3~18的二胺。較佳的脂肪族系二胺的例子可列舉:1,3-三亞甲基二胺、1,4-四亞甲基二胺、1,5-五亞甲基二胺、1,6-六亞甲基二胺、1,7-七亞甲基二胺、1,8-八亞甲基二胺、2-甲基-1,8-辛二胺、1,9-九亞甲基二胺、1,10-十亞甲基二胺、1,11-十一亞甲基二胺、1,12-十二亞甲基二胺、1,13-十三亞甲基二胺、1,14-十四亞甲基二胺、1,15-十五亞甲基二胺、1,16-十六亞甲基二胺、1,17-十七亞甲基二胺、1,18-十八亞甲基二胺、2,2,4-三甲基六亞甲基二胺、及2,4,4-三甲基六亞甲基二胺。該些可單獨使用或組合兩種以上而使用。 Examples of the diamine for obtaining polyamine may be an aliphatic diamine, an aromatic diamine, and an alicyclic diamine. The aliphatic diamine is preferably a linear or branched diamine having 3 to 18 carbon atoms. Examples of preferred aliphatic diamines include 1,3-trimethylenediamine, 1,4-tetramethylenediamine, 1,5-pentamethylenediamine, 1,6-six. Methylenediamine, 1,7-heptamethylenediamine, 1,8-octamethylenediamine, 2-methyl-1,8-octanediamine, 1,9-nonamethylenediene Amine, 1,10-decamethylenediamine, 1,11-undecethylenediamine, 1,12-dodeethylenediamine, 1,13-trimethylenediamine, 1, 14-tetramethylmethylenediamine, 1,15-pentadecyldiamine, 1,16-hexamethylenediamine, 1,17-heptadedomethylenediamine, 1,18- Octadecyldiamine, 2,2,4-trimethylhexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine. These may be used alone or in combination of two or more.

芳香族系二胺較佳為具有伸苯基的碳數6~27的二胺。較佳的芳香族系二胺的例子可列舉:鄰苯二胺、間苯二胺、對苯二胺、間苯二甲基二胺、對苯二甲基二胺、3,4-二胺基二苯醚、4,4'-二胺基二苯醚、4,4'-二胺基二苯基甲烷、3,3'-二胺基二苯基碸、4,4'-二胺基二苯基碸、4,4'-二胺基二苯基硫醚、4,4'-二(間胺基苯氧基)二苯基碸、4,4'-二(對胺基苯氧基)二苯基碸、聯苯胺、3,3'-二胺基二苯甲酮、4,4'-二胺基二苯甲酮、2,2-雙(4-胺基苯基)丙烷、1,5-二胺基萘、1,8-二胺基萘、4,4'-雙(4-胺基苯氧基)聯苯、2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙烷、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、4,4'-二胺基-3,3'-二乙基-5,5'-二甲基二苯基甲烷、4,4'-二胺基-3,3',5,5'-四甲基二苯基甲烷、2,4-二胺基甲苯、及2,2'-二甲基聯苯胺。 The aromatic diamine is preferably a diamine having 6 to 27 carbon atoms which has a phenyl group. Examples of preferred aromatic diamines include o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, m-xylylenediamine, p-xylylenediamine, and 3,4-diamine. Diphenyl ether, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylanthracene, 4,4'-diamine Diphenyl hydrazine, 4,4'-diaminodiphenyl sulfide, 4,4'-bis(m-aminophenoxy)diphenylanthracene, 4,4'-di(p-aminobenzene) Oxy)diphenylphosphonium, benzidine, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 2,2-bis(4-aminophenyl) Propane, 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 4,4'-bis(4-aminophenoxy)biphenyl, 2,2-bis[4-(4-amine Phenoxy group) phenyl] hexafluoropropane, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-double ( 3-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 4,4'-diamino-3,3'-diethyl-5,5'-di Methyl diphenylmethane, 4,4'-diamino-3,3',5,5'-tetramethyldiphenylmethane, 2,4-diaminotoluene, and 2,2'-di Methyl benzidine.

該些可單獨使用或組合兩種以上而使用。 These may be used alone or in combination of two or more.

脂環族系二胺較佳為具有伸環己基的碳數4~15的二胺。較佳的脂環族系二胺的例子可列舉:4,4'-二胺基-二伸環己基甲烷、4,4'-二胺基-二伸環己基丙烷、4,4'-二胺基-3,3'-二甲基-二伸環己基甲烷、1,4-二胺基環己烷、及哌嗪。該些可單獨使用或組合兩種以上而使用。 The alicyclic diamine is preferably a diamine having a carbon number of 4 to 15 having a cyclohexylene group. Examples of preferred alicyclic diamines include: 4,4'-diamino-dicyclohexylmethane, 4,4'-diamino-dicyclohexylpropane, 4,4'-di Amino-3,3'-dimethyl-dicyclohexylmethane, 1,4-diaminocyclohexane, and piperazine. These may be used alone or in combination of two or more.

用以獲得聚醯胺的二羧酸可列舉:脂肪族系二羧酸、芳香族系二羧酸、及脂環族系二羧酸。 Examples of the dicarboxylic acid used to obtain the polyamine are an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, and an alicyclic dicarboxylic acid.

脂肪族系二羧酸較佳為碳數2~18的飽和或不飽和的二 羧酸。較佳的脂肪族系二羧酸的例子可列舉:乙二酸、丙二酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、十三烷二酸、十四烷二酸、十五烷二酸、十八烷二酸、順丁烯二酸、及反丁烯二酸。該些可單獨使用或組合兩種以上而使用。 The aliphatic dicarboxylic acid is preferably a saturated or unsaturated carbon having 2 to 18 carbon atoms. carboxylic acid. Examples of preferred aliphatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacic acid. Undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, octadecanedioic acid, maleic acid, and fumaric acid. These may be used alone or in combination of two or more.

芳香族系二羧酸較佳為具有伸苯基的碳數8~15的二羧酸。較佳的芳香族系二羧酸的例子可列舉:間苯二甲酸、對苯二甲酸、甲基對苯二甲酸、聯苯-2,2'-二羧酸、聯苯-4,4'-二羧酸、二苯基甲烷-4,4'-二羧酸、二苯醚-4,4'-二羧酸、二苯基碸-4,4'-二羧酸、2,6-萘二羧酸、2,7-萘二羧酸、及1,4-萘二羧酸。該些可單獨使用或組合兩種以上而使用。進而,亦可在能夠熔融成形的範圍內使用偏苯三甲酸、均苯三甲酸、及均苯四甲酸等多元羧酸。 The aromatic dicarboxylic acid is preferably a dicarboxylic acid having a phenyl group and having a carbon number of 8 to 15. Examples of preferred aromatic dicarboxylic acids include isophthalic acid, terephthalic acid, methyl terephthalic acid, biphenyl-2,2'-dicarboxylic acid, and biphenyl-4,4'. -dicarboxylic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenyl ether-4,4'-dicarboxylic acid, diphenylphosphonium-4,4'-dicarboxylic acid, 2,6- Naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, and 1,4-naphthalene dicarboxylic acid. These may be used alone or in combination of two or more. Further, a polyvalent carboxylic acid such as trimellitic acid, trimesic acid, or pyromellitic acid may be used in the range in which melt molding is possible.

胺基羧酸較佳為碳原子數4~18的胺基羧酸。較佳的胺基羧酸的例子可列舉:4-胺基丁酸、6-胺基己酸、7-胺基庚酸、8-胺基辛酸、9-胺基壬酸、10-胺基癸酸、11-胺基十一酸、12-胺基十二酸、14-胺基十四酸、16-胺基十六酸、及18-胺基十八酸。該些可單獨使用或組合兩種以上而使用。 The aminocarboxylic acid is preferably an aminocarboxylic acid having 4 to 18 carbon atoms. Examples of preferred aminocarboxylic acids include 4-aminobutyric acid, 6-aminohexanoic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 9-aminononanoic acid, and 10-amino group. Capric acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, 14-aminotetradecanoic acid, 16-aminohexadecanoic acid, and 18-aminooctadecanoic acid. These may be used alone or in combination of two or more.

用以獲得聚醯胺的內醯胺例如可列舉:ε-己內醯胺、ω-十二內醯胺、ζ-庚內醯胺、及η-辛內醯胺。該些可單獨使用或組合兩種以上而使用。 Examples of the indoleamine which is used to obtain polyamine are ε-caprolactam, ω-dodecanamide, hydrazine-heptaneamine, and η-octeneamine. These may be used alone or in combination of two or more.

較佳的聚醯胺的原料的組合可列舉:ε-己內醯胺(尼龍6)、1,6-六亞甲基二胺/己二酸(尼龍6,6)、1,4-四亞甲基二胺/己 二酸(尼龍4,6)、1,6-六亞甲基二胺/對苯二甲酸、1,6-六亞甲基二胺/對苯二甲酸/ε-己內醯胺、1,6-六亞甲基二胺/對苯二甲酸/己二酸、1,9-九亞甲基二胺/對苯二甲酸、1,9-九亞甲基二胺/對苯二甲酸/ε-己內醯胺、1,9-九亞甲基二胺/1,6-六亞甲基二胺/對苯二甲酸/己二酸、及間苯二甲基二胺/己二酸。該些之中,進而較佳為由如下組合獲得的聚醯胺樹脂:1,4-四亞甲基二胺/己二酸(尼龍4,6)、1,6-六亞甲基二胺/對苯二甲酸/ε-己內醯胺、1,6-六亞甲基二胺/對苯二甲酸/己二酸、1,9-九亞甲基二胺/對苯二甲酸、1,9-九亞甲基二胺/對苯二甲酸/ε-己內醯胺、或1,9-九亞甲基二胺/1,6-六亞甲基二胺/對苯二甲酸/己二酸。 Preferred combinations of the raw materials of the polyamidamine include ε-caprolactam (nylon 6), 1,6-hexamethylenediamine/adipic acid (nylon 6,6), and 1,4-four. Methylene diamine / Diacid (nylon 4,6), 1,6-hexamethylenediamine/terephthalic acid, 1,6-hexamethylenediamine/terephthalic acid/ε-caprolactam, 1, 6-hexamethylenediamine/terephthalic acid/adipic acid, 1,9-nonamethylenediamine/terephthalic acid, 1,9-nonamethylenediamine/terephthalic acid/ ε-Caprolactam, 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/adipic acid, and m-xylylenediamine/adipic acid . Among these, a polyamide resin obtained by a combination of 1,4-tetramethylenediamine/adipic acid (nylon 4,6) and 1,6-hexamethylenediamine is further preferred. /terephthalic acid/ε-caprolactam, 1,6-hexamethylenediamine/terephthalic acid/adipic acid, 1,9-nonamethylenediamine/terephthalic acid, 1 , 9-nonamethylenediamine/terephthalic acid/ε-caprolactam, or 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/ Adipic acid.

熱塑性樹脂的含量相對於聚芳硫醚樹脂100質量份,較佳為1質量份~300質量份的範圍,更佳為3質量份~100質量份的範圍,進而較佳為5質量份~45質量份的範圍。藉由聚芳硫醚樹脂以外的熱塑性樹脂的含量在該些範圍內,可獲得耐熱性、耐化學品性及機械物性進一步提高的效果。 The content of the thermoplastic resin is preferably from 1 part by mass to 300 parts by mass, more preferably from 3 parts by mass to 100 parts by mass, even more preferably from 5 parts by mass to 45 parts by mass per 100 parts by mass of the polyarylene sulfide resin. The range of parts by mass. When the content of the thermoplastic resin other than the polyarylene sulfide resin is within these ranges, an effect of further improving heat resistance, chemical resistance, and mechanical properties can be obtained.

調配於聚芳硫醚樹脂組成物中的彈性體多數情況下是使用熱塑性彈性體。熱塑性彈性體例如可列舉:聚烯烴系彈性體、氟系彈性體及矽酮系彈性體。此外,於本說明書中,熱塑性彈性體被分類為彈性體,而並非所述熱塑性樹脂。 The elastomer blended in the polyarylene sulfide resin composition is often a thermoplastic elastomer. Examples of the thermoplastic elastomer include a polyolefin-based elastomer, a fluorine-based elastomer, and an anthrone-based elastomer. Further, in the present specification, the thermoplastic elastomer is classified into an elastomer, not the thermoplastic resin.

彈性體(特別是熱塑性彈性體)較佳為具有可與羥基或胺基反應的官能基。藉此,可獲得於接著性及耐衝擊性等方面特別優異的樹脂組成物。所述官能基可列舉:環氧基、羧基、異氰 酸酯基、噁唑啉基、及式:R(CO)O(CO)-或R(CO)O-(式中,R表示碳原子數1~8的烷基)所表示的基團。具有所述官能基的熱塑性彈性體例如可藉由α-烯烴與具有所述官能基的乙烯基聚合性化合物的共聚合而獲得。α-烯烴例如可列舉:乙烯、丙烯及丁烯-1等碳原子數2~8的α-烯烴類。具有所述官能基的乙烯基聚合性化合物例如可列舉:(甲基)丙烯酸及(甲基)丙烯酸酯等α,β-不飽和羧酸及其烷基酯、順丁烯二酸、反丁烯二酸、衣康酸及其他碳原子數4~10的α,β-不飽和二羧酸及其衍生物(單酯或二酯、及其酸酐等)、以及(甲基)丙烯酸縮水甘油酯等。該些之中,就提高韌性及耐衝擊性的方面而言,較佳為具有選自由環氧基、羧基、及式:R(CO)O(CO)-或R(CO)O-(式中,R表示碳原子數1~8的烷基)所表示的基團所組成的組群中的至少一種官能基的乙烯-丙烯共聚物及乙烯-丁烯共聚物。 The elastomer (particularly a thermoplastic elastomer) preferably has a functional group reactive with a hydroxyl group or an amine group. Thereby, a resin composition which is particularly excellent in adhesion and impact resistance can be obtained. The functional group may, for example, be an epoxy group, a carboxyl group or an isocyanide. An acid group, an oxazoline group, and a group represented by the formula: R(CO)O(CO)- or R(CO)O- (wherein R represents an alkyl group having 1 to 8 carbon atoms). The thermoplastic elastomer having the functional group can be obtained, for example, by copolymerization of an α-olefin and a vinyl polymerizable compound having the functional group. Examples of the α-olefin include α-olefins having 2 to 8 carbon atoms such as ethylene, propylene and butene-1. Examples of the vinyl polymerizable compound having the functional group include α,β-unsaturated carboxylic acids such as (meth)acrylic acid and (meth)acrylate, and alkyl esters thereof, maleic acid, and counter-butylene. Arogate, itaconic acid and other α,β-unsaturated dicarboxylic acids having 4 to 10 carbon atoms and derivatives thereof (monoesters or diesters, their anhydrides, etc.), and glycidol (meth)acrylate Ester and the like. Among these, in terms of improving toughness and impact resistance, it is preferred to have an epoxy group, a carboxyl group, and a formula: R(CO)O(CO)- or R(CO)O-(form). In the above, R represents an ethylene-propylene copolymer and an ethylene-butene copolymer of at least one functional group in the group consisting of groups represented by an alkyl group having 1 to 8 carbon atoms.

彈性體的含量因其種類、用途而異,因此無法一概地進行規定,例如相對於聚芳硫醚樹脂100質量份,較佳為1質量份~300質量份的範圍,更佳為3質量份~100質量份的範圍,進而較佳為5質量份~45質量份的範圍。藉由彈性體的含量在該些範圍內,可獲得於確保成形品的耐熱性、韌性的方面更優異的效果。 The content of the elastomer varies depending on the type and use thereof, and therefore cannot be specified. For example, it is preferably in the range of 1 part by mass to 300 parts by mass, more preferably 3 parts by mass, per 100 parts by mass of the polyarylene sulfide resin. The range of ~100 parts by mass is further preferably in the range of 5 parts by mass to 45 parts by mass. When the content of the elastomer is within these ranges, it is possible to obtain an effect that is more excellent in ensuring heat resistance and toughness of the molded article.

調配於聚芳硫醚樹脂組成物中的交聯性樹脂具有兩個以上交聯性官能基。交聯性官能基可列舉:環氧基、酚性羥基、胺基、醯胺基、羧基、酸酐基、及異氰酸酯基等。交聯性樹脂例如可列舉:環氧樹脂、酚樹脂、及胺基甲酸酯樹脂。 The crosslinkable resin blended in the composition of the polyarylene sulfide resin has two or more crosslinkable functional groups. Examples of the crosslinkable functional group include an epoxy group, a phenolic hydroxyl group, an amine group, a decylamino group, a carboxyl group, an acid anhydride group, and an isocyanate group. Examples of the crosslinkable resin include an epoxy resin, a phenol resin, and a urethane resin.

環氧樹脂較佳為芳香族系環氧樹脂。芳香族系環氧樹脂亦可具有鹵基或羥基等。較佳的芳香族系環氧樹脂的例子可列舉:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、聯苯型環氧樹脂、四甲基聯苯型環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、三苯基甲烷型環氧樹脂、四苯基乙烷型環氧樹脂、二環戊二烯-苯酚加成反應型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚酚醛清漆型環氧樹脂、萘酚芳烷基型環氧樹脂、萘酚-苯酚共縮酚醛清漆型環氧樹脂、萘酚-甲酚共縮酚醛清漆型環氧樹脂、芳香族烴甲醛樹脂改質酚樹脂型環氧樹脂、及聯苯酚醛清漆型環氧樹脂。該些芳香族系環氧樹脂可單獨使用或組合兩種以上而使用。該些芳香族系環氧樹脂之中,特別是就與其他樹脂成分的相容性優異的方面而言,較佳為酚醛清漆型環氧樹脂,更佳為甲酚酚醛清漆型環氧樹脂。 The epoxy resin is preferably an aromatic epoxy resin. The aromatic epoxy resin may have a halogen group or a hydroxyl group. Examples of preferred aromatic epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, and tetramethylbiphenyl. Epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin , dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, naphthol novolac type epoxy resin, naphthol aralkyl type epoxy resin, naphthol-phenol co-shrinkage A novolak type epoxy resin, a naphthol-cresol copolyphenolic epoxidized epoxy resin, an aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resin, and a biphenol novolak type epoxy resin. These aromatic epoxy resins may be used singly or in combination of two or more. Among these aromatic epoxy resins, a novolac type epoxy resin is preferable, and a cresol novolak type epoxy resin is more preferable because it is excellent in compatibility with other resin components.

交聯性樹脂的含量相對於聚芳硫醚樹脂100質量份,較佳為1質量份~300質量份的範圍,更佳為3質量份~100質量份的範圍,進而較佳為5質量份~30質量份的範圍。藉由交聯性樹脂的含量在該些範圍內,可特別顯著地獲得提高成形品的剛性及耐熱性的效果。 The content of the crosslinkable resin is preferably from 1 part by mass to 300 parts by mass, more preferably from 3 parts by mass to 100 parts by mass, even more preferably 5 parts by mass, per 100 parts by mass of the polyarylene sulfide resin. ~30 parts by mass range. When the content of the crosslinkable resin is within these ranges, the effect of improving the rigidity and heat resistance of the molded article can be particularly remarkably obtained.

聚芳硫醚樹脂組成物可含有具有可與羥基或胺基反應的官能基的矽烷化合物。所述矽烷化合物例如可列舉:γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、 β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷及γ-縮水甘油氧基丙基甲基二甲氧基矽烷等矽烷偶合劑(coupling agent)。 The polyarylene sulfide resin composition may contain a decane compound having a functional group reactive with a hydroxyl group or an amine group. Examples of the decane compound include γ-glycidoxypropyltrimethoxydecane and γ-glycidoxypropyltriethoxydecane. --(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropylmethyldiethoxydecane, and γ-glycidoxypropylmethyldimethoxydecane An isodecane coupling agent.

矽烷化合物的含量例如相對於聚芳硫醚樹脂100質量份,較佳為0.01質量份~10質量份的範圍,進而更佳為0.1質量份~5質量份的範圍。藉由矽烷化合物的含量在該些範圍內,可獲得提高聚芳硫醚樹脂與所述其他成分的相容性的效果。 The content of the decane compound is preferably in the range of 0.01 parts by mass to 10 parts by mass, and more preferably in the range of 0.1 part by mass to 5 parts by mass, per 100 parts by mass of the polyarylene sulfide resin. By the content of the decane compound being within these ranges, an effect of improving the compatibility of the polyarylene sulfide resin with the other components can be obtained.

本實際方式的聚芳硫醚樹脂組成物亦可含有脫模劑、著色劑、耐熱穩定劑、紫外線穩定劑、發泡劑、防銹劑、阻燃劑及潤滑劑等其他添加劑。添加劑的含量例如較佳為相對於聚芳硫醚樹脂100質量份為1質量份~10質量份的範圍。 The polyarylene sulfide resin composition of the present embodiment may further contain other additives such as a release agent, a colorant, a heat stabilizer, a UV stabilizer, a foaming agent, a rust preventive, a flame retardant, and a lubricant. The content of the additive is, for example, preferably in the range of 1 part by mass to 10 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.

聚芳硫醚樹脂組成物可利用將藉由所述方法而獲得的聚芳硫醚樹脂與所述其他成分進行熔融混練的方法,例如以顆粒(pellet)狀的複合物(compound)等形態獲得。熔融混練的溫度例如較佳為250℃~350℃的範圍,進而更佳為290℃~330℃的範圍。熔融混練可使用雙軸擠出機等而進行。 The polyarylene sulfide resin composition can be obtained by melt-kneading the polyarylene sulfide resin obtained by the above method and the other components, for example, in the form of a pellet-like compound. . The temperature of the melt kneading is, for example, preferably in the range of 250 ° C to 350 ° C, and more preferably in the range of 290 ° C to 330 ° C. The melt kneading can be carried out using a twin screw extruder or the like.

本實施方式的聚芳硫醚樹脂組成物可單獨或與所述其他成分等材料組合,藉由如射出成形、擠出成形、壓縮成形及吹塑成形(blow molding)般的各種熔融加工法,加工成耐熱性、成形加工性、尺寸穩定性等優異的成形品。本實施方式的聚芳硫醚樹脂組成物由於加熱時的氣體產生量少,故而可容易地製造高品質的成形品。 The polyarylene sulfide resin composition of the present embodiment may be used alone or in combination with materials such as the other components, and may be subjected to various melt processing methods such as injection molding, extrusion molding, compression molding, and blow molding. It is processed into a molded article excellent in heat resistance, moldability, dimensional stability, and the like. Since the polyarylene sulfide resin composition of the present embodiment has a small amount of gas generated during heating, a high-quality molded article can be easily produced.

本實施方式的聚芳硫醚樹脂組成物亦具備聚芳硫醚樹脂原本所具有的耐熱性、尺寸穩定性等各種性能,因此例如可用以藉由例如射出成形、壓縮成形而獲得連接器(connector)、印刷基板(printing substrate)及密封成形品等電氣.電子零件、燈反射器(lamp reflector)及各種電力組件(electrical component)零件等汽車零件、各種建築物、飛機及汽車等的內裝用材料、辦公自動化(Office Automation,OA)機器零件、相機(camera)零件及鐘錶零件等精密零件等。另外,本實際方式的聚芳硫醚樹脂組成物可廣泛用作用於複合體(composite)、片材(sheet)及管(pipe)等的擠出成形及拉抽成形等各種成形加工用材料、以及纖維或膜(film)用材料。 The polyarylene sulfide resin composition of the present embodiment also has various properties such as heat resistance and dimensional stability which the polyarylene sulfide resin originally has. Therefore, for example, a connector can be obtained by, for example, injection molding and compression molding. ), printed substrate (printing substrate) and sealed molded products and other electrical. Automotive parts such as electronic parts, lamp reflectors, and various electrical component parts, interior materials for various buildings, airplanes, and automobiles, office automation (OA) machine parts, cameras ( Camera) Precision parts such as parts and watch parts. Further, the polyarylene sulfide resin composition of the present invention can be widely used as various molding materials for extrusion molding, drawing and the like of composites, sheets, pipes, and the like. And materials for fibers or films.

[實施例] [Examples]

以下,列舉實施例對本發明更具體地進行說明。但是,本發明並不限定於該些實施例。 Hereinafter, the present invention will be more specifically described by way of examples. However, the invention is not limited to the embodiments.

1.評價法 Evaluation method

1-1.PPS樹脂的熔融黏度 1-1. Melt viscosity of PPS resin

使用島津製作所製造的流量測試儀CFT-500C,將PPS樹脂於300℃、荷重:1.96×106Pa、L/D=10/1的條件下保持6分鐘後,測定熔融黏度。 Using a flow tester CFT-500C manufactured by Shimadzu Corporation, the PPS resin was held at 300 ° C under a load of 1.96 × 10 6 Pa and L/D = 10/1 for 6 minutes, and then the melt viscosity was measured.

1-2.PPS樹脂的熔點 1-2. The melting point of PPS resin

使用珀金埃爾默製造的DSC,將PPS樹脂的樣品(sample)自50℃以20℃/min升溫至350℃,將聚合物熔解時的吸熱峰值 (peak)的峰值溫度設為熔點。 Using a DSC manufactured by PerkinElmer, the sample of the PPS resin was heated from 50 ° C at 20 ° C / min to 350 ° C to absorb the endothermic peak when the polymer was melted. The peak temperature of (peak) is set to the melting point.

1-3.PPS樹脂中的碘含量 1-3. Iodine content in PPS resin

使用戴安儀器(Dionex Instruments)燃燒氣體吸收裝置,使PPS樹脂燃燒,並使純水將所產生的氣體及殘渣吸收。利用戴安離子層析(Dionex Ion Chromatography)定量吸收液中的碘離子。 The Pion resin is burned using a Dionex Instruments combustion gas absorption device, and pure water is used to absorb the generated gas and residue. Iodine ions in the absorbing solution were quantified by Dionex Ion Chromatography.

1-4.PPS樹脂中的雙硫鍵的比例 1-4. Proportion of disulfide bonds in PPS resin

使用理學電氣工業股份有限公司製造的螢光X射線分析裝置ZSX100e,測定硫原子總量(硫總量),基於下述式,求出PPS樹脂中的雙硫鍵的比例。 The total amount of sulfur atoms (total amount of sulfur) was measured using a fluorescent X-ray analyzer ZSX100e manufactured by Rigaku Denki Co., Ltd., and the ratio of the disulfide bonds in the PPS resin was determined based on the following formula.

1-5.彎曲特性 1-5. Bending characteristics

.標準試驗方法...美國材料與試驗協會(American Society for Testing and Materials,ASTM)D-790 . Standard Test Method...American Society for Testing and Materials (ASTM) D-790

.試片...3.2mm(厚)×12.7mm(寬)×127mm(長) . Test piece...3.2mm (thickness) × 12.7mm (width) × 127mm (long)

.試驗結果...試驗數n=10的平均值 . Test result...the average of the test number n=10

1-6.夏比衝擊強度(Charpy impact strength) 1-6. Charpy impact strength

.標準試驗方法...國際標準化組織(International Organization for Standardization,ISO)179-1(無凹口(notch)/有凹口) . Standard Test Method... International Organization for Standardization (ISO) 177-1 (notch/notch)

.試片...4.0mm(厚)×10.0mm(寬)×100mm(長) . Test piece...4.0mm (thickness) × 10.0mm (width) × 100mm (long)

.試驗結果...試驗數n=10的平均值 . Test result...the average of the test number n=10

1-7.耐酸性試驗/耐鹼性試驗 1-7. Acid resistance test / alkali resistance test

於以成為預定的彎曲應變的方式對試片負載彎曲應力的狀態下,將試片浸漬於試驗溶液中,調查直至試片斷裂的時間。於試片中央部設置切削凹口。 The test piece was immersed in the test solution in a state where the test piece was subjected to bending stress so as to have a predetermined bending strain, and the time until the test piece was broken was investigated. A cutting recess is provided in the center of the test piece.

.耐酸性試驗溶液...Sunpole原液(商品名,含有鹽酸及界面活性劑的界面活性劑,大日本除蟲菊製造) . Acid resistance test solution...Sunpole stock solution (trade name, surfactant containing hydrochloric acid and surfactant, manufactured by Dainiper)

.耐鹼性試驗溶液...Domesto原液(商品名,含有次氯酸鈉、氫氧化鈉及界面活性劑的鹼性洗劑,日本李佛(Nippon Lever)製造) . Alkali resistance test solution...Domesto stock solution (trade name, alkaline lotion containing sodium hypochlorite, sodium hydroxide and surfactant, manufactured by Nippon Lever)

.試片...1.6mm(厚)×12.7mm(寬)×127mm(長) . Test piece...1.6mm (thickness) × 12.7mm (width) × 127mm (long)

.彎曲應變...1.2%(ASTM D-790中所規定的彎曲特性試驗方法中的彎曲應力負載於試片的狀態) . Bending strain...1.2% (the bending stress in the test method for bending characteristics specified in ASTM D-790 is loaded on the test piece)

.評價項目...直至試片斷裂的時間 . Evaluation item... until the test piece breaks

.試驗結果...試驗數n=5的平均值 . Test result...the average of the test number n=5

1-8.耐熱水性試驗 1-8. Hot water resistance test

將試片浸漬於95℃的熱水中,調查彎曲強度的經時變化。 The test piece was immersed in hot water at 95 ° C, and the change in bending strength with time was investigated.

.試片...3.2mm(厚)×12.7mm(寬)×127mm(長) . Test piece...3.2mm (thickness) × 12.7mm (width) × 127mm (long)

.彎曲強度的試驗方法...ASTM D-790 . Test method for bending strength...ASTM D-790

.評價項目...1000小時、3000小時後的彎曲強度相對於初期強度的保持率 . Evaluation item...Preservation rate of bending strength after 1000 hours and 3000 hours with respect to initial strength

.試驗結果...試驗數n=5的平均值 . Test result...the average of the test number n=5

1-9.模腔平衡性 1-9. Cavity balance

使用具有40個模腔的墊圈(washer)模具,在將最接近一次澆道(sprue)的位置的模腔(C1)完全填充的範圍內,於最低的成形條件下將PPS複合物射出成形。成形條件是設為75噸成形機、料缸(cylinder)溫度320℃、模具溫度140℃、無保壓。 Using a washer mold having 40 cavities, the PPS composite was injection molded under the lowest forming conditions in a range in which the cavity (C1) closest to the primary sprue was completely filled. The molding conditions were set to a 75-ton molding machine, a cylinder temperature of 320 ° C, a mold temperature of 140 ° C, and no holding pressure.

比較成型後的位於與模腔(C1)相同流道(runner)的且距離一次澆道最遠的模腔(C10)的填充度。填充度(質量%)是由模腔(C10)的成形品相對於模腔(C1)的成形品的質量比求出。可謂模腔(C10)的填充度越高,模腔平衡性越優異。基於填充度,並按照以下基準判定各組成物的模腔平衡性。 The degree of filling of the molded cavity (C10) which is located at the same runner as the cavity (C1) and which is farthest from the primary runner is compared. The degree of filling (% by mass) is determined from the mass ratio of the molded article of the cavity (C10) to the molded article of the cavity (C1). It can be said that the higher the filling degree of the cavity (C10), the more excellent the cavity balance. The cavity balance of each composition was determined based on the degree of filling and according to the following criteria.

AA:100質量%~90質量%的範圍 AA: range of 100% by mass to 90% by mass

A:89質量%~80質量%的範圍 A: range of 89% by mass to 80% by mass

B:79質量%~70質量%的範圍 B: range of 79% by mass to 70% by mass

C:69質量%~60質量%的範圍 C: range of 69% by mass to 60% by mass

D:59%質量以下的範圍 D: range below 59% by mass

1-10.產生氣體量 1-10. The amount of gas produced

使用氣相層析質譜分析(gas chromatography mass spectrometry)裝置,將聚芳硫醚樹脂或樹脂組成物的預定量的樣品於325℃下加熱15分鐘,以質量%定量此時的產生氣體量。 A predetermined amount of the sample of the polyarylene sulfide resin or the resin composition was heated at 325 ° C for 15 minutes using a gas chromatography mass spectrometry apparatus, and the amount of generated gas at this time was quantified by mass%.

2.聚苯硫醚樹脂(PPS樹脂)的合成(表1) 2. Synthesis of polyphenylene sulfide resin (PPS resin) (Table 1)

(合成例1) (Synthesis Example 1)

將對二碘苯(東京化成股份有限公司,對二碘苯純度98.0% 以上)300.0g、固體硫(關東化學股份有限公司製造,硫(粉末))27.00g、2-碘苯胺(東京化成股份有限公司製造)2.0g於氮氣環境下加熱至180℃,並將該些溶解及混合。其次,升溫至220℃,減壓至絕對壓力26.6kPa。一面以體系內成為320℃且絕對壓力133Pa的方式階段性地改變溫度與壓力而對所獲得的熔融混合物進行加熱,一面進行8小時熔融聚合。反應結束後,添加NMP 200g,於220℃下進行加熱攪拌,並對所獲得的溶解物進行過濾。於過濾後的溶解物中添加NMP 320g,進行濾餅(cake)洗滌過濾。向所獲得的包含NMP的濾餅添加離子交換水1L,於高壓釜(autoclave)中以200℃攪拌10分鐘。繼而對濾餅進行過濾,向過濾後的濾餅添加70℃的離子交換水1L而進行濾餅洗滌。向所獲得的含水濾餅添加離子交換水1L並攪拌10分鐘。繼而對濾餅進行過濾,向過濾後的濾餅添加70℃的離子交換水1L而進行濾餅洗滌。再次重複該操作後,將濾餅於120℃下乾燥4小時,獲得PPS樹脂91g。所獲得的PPS樹脂的碘含量為200ppm,雙硫鍵的比例為0.2質量%。 Will di-iodobenzene (Tokyo Chemical Co., Ltd., the purity of diiodobenzene 98.0% 300.0 g of the above, solid sulfur (manufactured by Kanto Chemical Co., Ltd., sulfur (powder)), 27.00 g, 2-iodoaniline (manufactured by Tokyo Chemical Industry Co., Ltd.), 2.0 g, heated to 180 ° C under a nitrogen atmosphere, and these were Dissolve and mix. Next, the temperature was raised to 220 ° C, and the pressure was reduced to an absolute pressure of 26.6 kPa. The obtained molten mixture was heated stepwise by changing the temperature and pressure so as to be 320 ° C in the system and an absolute pressure of 133 Pa, and the melt polymerization was carried out for 8 hours. After completion of the reaction, 200 g of NMP was added, and the mixture was heated and stirred at 220 ° C, and the obtained dissolved matter was filtered. 320 g of NMP was added to the filtered lysate, and the cake was washed and filtered. To the obtained NMP-containing filter cake, 1 L of ion-exchanged water was added, and the mixture was stirred at 200 ° C for 10 minutes in an autoclave. Then, the cake was filtered, and 1 L of ion-exchange water at 70 ° C was added to the filtered cake to carry out filter cake washing. To the obtained aqueous filter cake, 1 L of ion-exchanged water was added and stirred for 10 minutes. Then, the cake was filtered, and 1 L of ion-exchange water at 70 ° C was added to the filtered cake to carry out filter cake washing. After repeating this operation again, the cake was dried at 120 ° C for 4 hours to obtain 91 g of a PPS resin. The obtained PPS resin had an iodine content of 200 ppm and a disulfide bond ratio of 0.2% by mass.

(合成例2) (Synthesis Example 2)

使用「二苯基二硫醚(住友精化股份有限公司DPDS)」代替所述「2-碘苯胺」,除此以外,以與合成例1相同的方式獲得PPS樹脂91g。 Further, 91 g of a PPS resin was obtained in the same manner as in Synthesis Example 1, except that "diphenyldisulfide (Sumitomo Chemical Co., Ltd. DPDS)" was used instead of the "2-iodoaniline".

(合成例3) (Synthesis Example 3)

向高壓釜中添加N-甲基吡咯啶酮(以下,簡稱為NMP)600g、 硫化鈉五水合物336.3g(2.0mol),於氮氣環境下升溫至200℃,藉此將水-NMP混合物蒸餾去除。繼而,向該體系中添加將對二氯苯292.53g與2,5-二氯苯胺1.62g溶解於NMP 230g中而成的溶液,於氮氣環境下以220℃反應5小時,進而以240℃反應2小時。將反應容器冷卻後提取內容物,採樣一部分,利用氣相層析儀對未反應的2,5-二氯苯胺進行定量。另外,將剩餘的漿料(slurry)利用熱水洗滌數次,將聚合物濾餅過濾分離。將該濾餅於80℃下進行減壓乾燥,而獲得粉末狀的PPS樹脂。測定紅外吸收光譜(spectrum),結果於3380cm-1附近觀測到可視為源自胺基的吸收光譜。 600 g of N-methylpyrrolidone (hereinafter abbreviated as NMP) and 336.3 g (2.0 mol) of sodium sulfide pentahydrate were added to the autoclave, and the temperature was raised to 200 ° C under a nitrogen atmosphere, thereby distilling the water-NMP mixture. Remove. Then, a solution obtained by dissolving 292.53 g of p-dichlorobenzene and 1.62 g of 2,5-dichloroaniline in 230 g of NMP was added to the system, and the reaction was carried out at 220 ° C for 5 hours under nitrogen atmosphere, and further reacted at 240 ° C. 2 hours. After cooling the reaction vessel, the contents were extracted, a portion was sampled, and unreacted 2,5-dichloroaniline was quantified by a gas chromatograph. Further, the remaining slurry was washed several times with hot water, and the polymer cake was separated by filtration. The cake was dried under reduced pressure at 80 ° C to obtain a powdery PPS resin. The infrared absorption spectrum was measured, and as a result, an absorption spectrum which can be regarded as an amine group was observed in the vicinity of 3380 cm -1 .

3.聚苯硫醚樹脂組成物(PPS複合物) 3. Polyphenylene sulfide resin composition (PPS composite)

3-1.原料 3-1. Raw materials

為了製備PPS樹脂組成物而準備以下材料。 The following materials were prepared in order to prepare a PPS resin composition.

(熱塑性彈性體) (thermoplastic elastomer)

.ELA:乙烯/縮水甘油基甲基丙烯酸(3質量%)/丙烯酸甲酯(27質量%)的共聚物(住友化學工業公司製造,「Bondfast 7L」) . ELA: copolymer of ethylene/glycidyl methacrylic acid (3 mass%) / methyl acrylate (27 mass%) (manufactured by Sumitomo Chemical Industries, Ltd., "Bondfast 7L")

(熱塑性樹脂) (thermoplastic resin)

.PA6T:以對苯二甲酸65莫耳%、間苯二甲酸25莫耳%、己二酸10莫耳%作為必需單體成分進行反應而獲得的芳香族聚醯胺(熔點310℃,Tg 120℃) . PA6T: aromatic polydecylamine obtained by reacting 65 mol% of terephthalic acid, 25 mol% of isophthalic acid, and 10 mol% of adipic acid as essential monomer components (melting point 310 ° C, Tg 120 °C)

.PA9T:使壬二胺與對苯二甲酸反應而獲得的聚醯胺(可樂麗(Kuraray)股份有限公司製造,「Genestar N1000A」) . PA9T: Polydecylamine obtained by reacting decane diamine with terephthalic acid (manufactured by Kuraray Co., Ltd., "Genestar N1000A")

.PA46:聚醯胺46(日本帝斯曼工程塑膠(DSM Japan Engineering Plastics)股份有限公司製造,「Stanyl TS300」) . PA46: Polyamide 46 (manufactured by DSM Japan Engineering Plastics Co., Ltd., "Stanyl TS300")

.PPE:聚(2,6-二甲基-1,4-伸苯基)醚(固有黏度0.45dl/g(30℃,氯仿中)) . PPE: poly(2,6-dimethyl-1,4-phenylene) ether (intrinsic viscosity 0.45 dl/g (30 ° C, in chloroform))

.PES:芳香族聚碸樹脂(住友化學工業股份有限公司製造,品名:Sumika Excel PES4100P) . PES: Aromatic polyfluorene resin (manufactured by Sumitomo Chemical Industries, Ltd., product name: Sumika Excel PES4100P)

.PAR:藉由以下方法而合成的芳香族聚酯 . PAR: aromatic polyester synthesized by the following method

於具備攪拌翼、氮氣導入口的聚合裝置中將3,3',5,5'-四甲基-1,1'-聯苯-4,4'-二醇2.42Kg(10.0莫耳)與間甲酚50g溶解於包含氫氧化鈉1.0Kg的30L的脫氧水中而獲得水溶液。另外,將64g的溴化四丁基銨、間苯二甲醯氯1.62Kg(8.0莫耳)、對苯二甲醯氯0.41Kg(2.0莫耳)溶解於5L的二氯甲烷而獲得有機溶液。一面將水溶液於氮氣氣流下攪拌一面添加有機溶液,於25℃下持續攪拌30分鐘後,將水溶液相去除。將包含產物的有機溶液相利用蒸餾水重複洗滌後,注入至丙酮浴中而獲得沈澱,進而利用丙酮進行洗滌而獲得芳香族聚酯。其後,利用真空乾燥機於200℃下且約10Pa的減壓條件下進行3小時真空乾燥而獲得3.2 kg的芳香族聚酯。 3,3',5,5'-tetramethyl-1,1'-biphenyl-4,4'-diol 2.42 Kg (10.0 mol) in a polymerization apparatus equipped with a stirring blade and a nitrogen inlet 50 g of m-cresol was dissolved in 30 L of deoxygenated water containing 1.0 kg of sodium hydroxide to obtain an aqueous solution. In addition, 64 g of tetrabutylammonium bromide, m-xylylene chloride 1.62 Kg (8.0 mol), and terephthalic acid chloride 0.41 Kg (2.0 mol) were dissolved in 5 L of dichloromethane to obtain an organic solution. . The organic solution was added while stirring the aqueous solution under a nitrogen gas stream, and stirring was continued at 25 ° C for 30 minutes, and then the aqueous phase was removed. The organic solution phase containing the product was repeatedly washed with distilled water, poured into an acetone bath to obtain a precipitate, and further washed with acetone to obtain an aromatic polyester. Thereafter, vacuum drying was carried out by vacuum drying at 200 ° C under a reduced pressure of about 10 Pa for 3 hours to obtain 3.2. Kg of aromatic polyester.

.LCP:藉由以下方法而合成的熱致型(thermotropic)液晶聚酯樹脂 . LCP: a thermotropic liquid crystal polyester resin synthesized by the following method

將對苯二酚55.1g(0.5莫耳)、4,4'-二羥基聯苯93.1g(0.5莫耳)、對苯二甲酸116.3g(0.7莫耳)、2,6-二羧基萘64.9g(0.3莫耳)、對羥基苯甲酸621.5g(4.5莫耳)、乙酸酐612.5g(6莫耳)添加至具備冷卻器及攪拌機的反應容器中並於氮氣環境下一面進行攪拌一面進行升溫,於170℃下回流60分鐘。繼而,一面將作為副產物的乙酸去除一面歷時4小時使反應容器緩慢地上升至370℃,進而於370℃下將反應體系減壓至25kPa。進而於該溫度下一面將作為副產物的乙酸去除一面歷時2小時將壓力減壓至0.5kPa~1kPa而進行聚合。繼而,於370℃下進行1小時聚合。其間一面將副生的乙酸去除,一面於強力的攪拌下進行聚合,其後,將體系緩慢地冷卻,將於200℃下獲得的液晶聚酯樹脂提取至體系外。 55.1 g (0.5 mol) of hydroquinone, 93.1 g (0.5 mol) of 4,4'-dihydroxybiphenyl, 116.3 g (0.7 mol) of terephthalic acid, and 24.9-dicarboxynaphthalene 64.9 g (0.3 mol), 621.5 g (4.5 mol) of p-hydroxybenzoic acid, and 612.5 g (6 mol) of acetic anhydride were added to a reaction vessel equipped with a cooler and a stirrer, and the mixture was heated while stirring under a nitrogen atmosphere. It was refluxed at 170 ° C for 60 minutes. Then, while removing acetic acid as a by-product, the reaction vessel was slowly raised to 370 ° C for 4 hours, and the reaction system was further reduced to 25 kPa at 370 ° C. Further, at this temperature, acetic acid as a by-product was removed, and the pressure was reduced to 0.5 kPa to 1 kPa for 2 hours to carry out polymerization. Then, polymerization was carried out at 370 ° C for 1 hour. While the by-produced acetic acid was removed, polymerization was carried out under vigorous stirring, and thereafter, the system was slowly cooled, and the liquid crystal polyester resin obtained at 200 ° C was extracted out of the system.

(矽烷偶合劑) (decane coupling agent)

.環氧矽烷:γ-縮水甘油氧基丙基三甲氧基矽烷 . Epoxy decane: γ-glycidoxypropyltrimethoxydecane

(無機質填充劑) (Inorganic filler)

.GF:玻璃纖維短切股線(chopped strand)(纖維直徑10μm,長度3mm) . GF: glass fiber chopped strand (fiber diameter 10 μm, length 3 mm)

.CF:瀝青系碳纖維,拉伸彈性模數560GPa . CF: pitch-based carbon fiber, tensile modulus 560GPa

.碳黑:石墨化碳黑 . Carbon black: graphitized carbon black

.CaCO3(碳酸鈣):丸尾鈣股份有限公司製造,「Caltex 5」(粉末狀,平均粒徑1.2μm) . CaCO 3 (calcium carbonate): manufactured by Marui Co., Ltd., "Caltex 5" (powder, average particle size 1.2 μm)

3-2.複合物的製作與評價 3-2. Fabrication and evaluation of composites

使用滾筒(tumbler)以表2~表4所示的調配組成將各原料均勻混合後,使用雙軸混練擠出機(TEM-35B,東芝機械)於300℃下進行熔融混練,而獲得顆粒狀的複合物。將所獲得的複合物於料缸溫度300℃、模具溫度140℃的條件下進行射出成形,製成用於彎曲特性、艾氏衝擊(Izod impact)強度、耐酸性試驗、耐鹼性試驗或耐熱水性試驗的試片,進行各種評價。另外,針對PPS樹脂單獨體、及複合物,測定產生氣體量。將評價結果示於各表。 The raw materials were uniformly mixed using a tumbler in the composition shown in Tables 2 to 4, and then melt-kneaded at 300 ° C using a biaxial kneading extruder (TEM-35B, Toshiba Machine) to obtain a pellet. Complex. The obtained composite was injection-molded at a cylinder temperature of 300 ° C and a mold temperature of 140 ° C to prepare for bending properties, Izod impact strength, acid resistance test, alkali resistance test or heat resistance. The test piece of the water-based test was subjected to various evaluations. Further, the amount of generated gas was measured for the PPS resin alone and the composite. The evaluation results are shown in the respective tables.

如由各表所示的結果所明確般,可確認調配合成例1的PPS樹脂與無機質填充劑、各種樹脂而獲得的樹脂組成物的產生氣體量與使用未經取代的聚合抑制劑而獲得的PSS樹脂的合成例2相比顯著降低。進而,使用合成例1的PPS樹脂而獲得的樹脂組成物於機械特性(彎曲、衝擊)、耐酸性、耐鹼性、耐熱水性、模腔平衡性的方面亦優異。 As is clear from the results shown in the respective tables, the amount of generated gas of the resin composition obtained by blending the PPS resin of Synthesis Example 1 with the inorganic filler and various resins can be confirmed by using an unsubstituted polymerization inhibitor. The synthesis of Example 2 of the PSS resin was remarkably lowered. Further, the resin composition obtained by using the PPS resin of Synthesis Example 1 is also excellent in mechanical properties (bending, impact), acid resistance, alkali resistance, hot water resistance, and cavity balance.

Claims (3)

一種聚芳硫醚樹脂組成物,其含有聚芳硫醚樹脂、及選自由無機質填充劑、所述聚芳硫醚樹脂以外的熱塑性樹脂、彈性體、及具有兩個以上交聯性官能基的交聯性樹脂所組成的組群中的至少一種其他成分,且所述聚芳硫醚樹脂可藉由包括使二碘芳香族化合物、單質硫、及聚合抑制劑於包含所述二碘芳香族化合物、所述單質硫及所述聚合抑制劑的熔融混合物中反應的步驟的方法而獲得,且具有源自所述聚合抑制劑的羥基及/或胺基。 A polyarylene sulfide resin composition comprising a polyarylene sulfide resin and a thermoplastic resin selected from the group consisting of inorganic fillers, polyarylene sulfide resins, elastomers, and having two or more crosslinkable functional groups At least one other component of the group consisting of a crosslinkable resin, and the polyarylene sulfide resin may include a diiodide aromatic compound, elemental sulfur, and a polymerization inhibitor to include the diiodo aromatic A method of the step of reacting a compound, the elemental sulfur, and the molten mixture of the polymerization inhibitor, and having a hydroxyl group and/or an amine group derived from the polymerization inhibitor. 如申請專利範圍第1項所述的聚芳硫醚樹脂組成物,其中所述聚合抑制劑包含下述式(I)或式(II)所表示的化合物, [式中,X表示羥基或胺基]。 The polyarylene sulfide resin composition according to claim 1, wherein the polymerization inhibitor comprises a compound represented by the following formula (I) or formula (II), [wherein, X represents a hydroxyl group or an amine group]. 一種成形品,其是將如申請專利範圍第1項或第2項所述的聚芳硫醚樹脂組成物成形而獲得。 A molded article obtained by molding a polyarylene sulfide resin composition as described in claim 1 or 2.
TW103127008A 2013-08-09 2014-08-07 Polyarylene sulfide resin compotion and molded article thereof TW201510087A (en)

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