TW201506508A - Direct lighting type backlight module - Google Patents
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- TW201506508A TW201506508A TW102128137A TW102128137A TW201506508A TW 201506508 A TW201506508 A TW 201506508A TW 102128137 A TW102128137 A TW 102128137A TW 102128137 A TW102128137 A TW 102128137A TW 201506508 A TW201506508 A TW 201506508A
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Abstract
Description
本發明有關於一種背光模組,特別是有關於一種直下式背光模組。 The invention relates to a backlight module, in particular to a direct type backlight module.
傳統之液晶顯示器之背光模組係配置於液晶面板背面,以提供液晶面板所需之顯示光源。背光模組依光源位置可分為「側光式」及「直下式」設計,其中「直下式」設計之背光模組漸漸地採用多個發光二極體作為光源,以取代傳統的白熱燈管或螢光燈管。當發光二極體作為光源時,通常是預留一段展光距離,再設置於液晶面板的下方,以提供液晶面板均勻的出光源。所以「直下式」設計之背光模組會很厚。 The backlight module of the conventional liquid crystal display is disposed on the back of the liquid crystal panel to provide a display light source required for the liquid crystal panel. The backlight module can be divided into "side-light" and "straight-down" designs according to the position of the light source. The backlight module of the "straight down" design gradually uses a plurality of light-emitting diodes as a light source to replace the traditional white heat lamp. Or fluorescent tube. When the light-emitting diode is used as a light source, a light-expanding distance is usually reserved and disposed under the liquid crystal panel to provide a uniform light source of the liquid crystal panel. Therefore, the "direct-down" design of the backlight module will be very thick.
「側光式」背光模組的架構是從側面入光,所以會比較薄;但是要使用的發光二極體顆數至少是同尺寸之「直下式」背光模組的2.5倍。 The structure of the "side-light" backlight module is lighter from the side, so it will be thinner; however, the number of LEDs to be used is at least 2.5 times that of the "direct-type" backlight module of the same size.
因此,若能直接將發光二極體貼合在勻光板的背面,就可以兼前述兩者之優勢而有之。但實作上,直接貼合時,光線的強度在正視角方向(也就是發光二極體發光面之法線方向)上會最強,若以勻光板上之展光結構將發光二極體正視角方向的光線朝側面反射,則又會在展光結構邊 緣形成一圈暗帶,俗稱光學品味不良。 Therefore, if the light-emitting diode can be directly attached to the back surface of the light-removing plate, the advantages of both of them can be combined. However, in practice, when directly bonding, the intensity of the light will be strongest in the direction of the positive viewing angle (that is, the normal direction of the light-emitting surface of the light-emitting diode). If the light-emitting structure on the light-shading plate is used, the light-emitting diode will be positive. The light in the direction of the view is reflected toward the side, and it will be on the side of the light-emitting structure. The edge forms a circle of dark bands, commonly known as optical taste.
有鑑於此,如何研發出一種背光模組,同時改善上述所帶來的缺失及不便,實乃相關業者目前刻不容緩之一重要課題。 In view of this, how to develop a backlight module and improve the above-mentioned lack of inconvenience and inconvenience is an important issue that the relevant industry is currently unable to delay.
本發明之一技術態樣是在提供一種直下式背光模組,用以解決以上先前技術所提到的困難。 One aspect of the present invention is to provide a direct type backlight module for solving the difficulties mentioned in the prior art.
根據本發明一實施方式,這種直下式背光模組包含一透光板體、至少一個圓錐形凹部、至少一發光二極體元件與至少一光反射部。透光板體包含相對之出光面與入光面。圓錐形凹部設於出光面上,包含一尖端底部與一凸曲面內壁。凸曲面內壁連接於尖端底部與出光面之間,且圍繞尖端底部。發光二極體元件抵接入光面,其中尖端底部於入光面之一正投影落於發光二極體元件上。光反射部抵接入光面,並傾斜地伸向發光二極體元件,用以反射光線回透光板體內。光反射部與入光面之夾角至少為:tan-1T/(Φ-W),其中T為發光二極體元件之厚度,Φ為圓錐形凹部之最大孔徑,W為發光二極體元件之寬度。 According to an embodiment of the invention, the direct type backlight module comprises a light transmissive plate body, at least one conical recess, at least one light emitting diode element and at least one light reflecting portion. The light transmissive plate body includes a light emitting surface and a light incident surface. The conical recess is disposed on the light emitting surface and includes a tip bottom and a convex curved inner wall. The inner surface of the convex curved surface is connected between the bottom of the tip and the light exiting surface, and surrounds the bottom of the tip. The light emitting diode element is coupled to the light surface, wherein the bottom of the tip is projected onto the light emitting diode element on one of the light incident surfaces. The light reflecting portion is in contact with the light surface and obliquely extends toward the light emitting diode element for reflecting the light back into the light transmitting plate body. The angle between the light reflecting portion and the light incident surface is at least: tan -1 T / (Φ - W), wherein T is the thickness of the light emitting diode element, Φ is the maximum aperture of the conical recess, and W is the light emitting diode element The width.
在本發明一或多個實施方式中,光反射部形成於一電路板上。這個電路板承載發光二極體元件並電性連接發光二極體元件。發光二極體元件夾設於電路板與入光面之間。 In one or more embodiments of the present invention, the light reflecting portion is formed on a circuit board. The circuit board carries the light-emitting diode elements and is electrically connected to the light-emitting diode elements. The light emitting diode element is sandwiched between the circuit board and the light incident surface.
在本發明一或多個實施方式中,發光二極體元件之出光面與可撓式片體之一面皆抵接入光面,以致一凹陷部 形成於可撓式片體與入光面之間,且發光二極體元件位於凹陷部內。 In one or more embodiments of the present invention, the light-emitting surface of the light-emitting diode element and one surface of the flexible sheet body are all connected to the light surface, so that a depressed portion Formed between the flexible sheet and the light incident surface, and the light emitting diode element is located in the recess.
在本發明一或多個實施方式中,光反射部即為這個凹陷部之至少一內壁,或者是,光反射部,例如為可撓式片體上之金屬鍍膜,依附於這個凹陷部之至少一內壁上。 In one or more embodiments of the present invention, the light reflecting portion is at least one inner wall of the recessed portion, or the light reflecting portion is, for example, a metal plating film on the flexible sheet body, attached to the recessed portion. At least one inner wall.
在本發明一或多個實施方式中,直下式背光模組更包含一光學透鏡。光學透鏡包含一本體、一凹槽與一貫穿孔。本體位於電路板與入光面之間,包含相對之第一面與第二面。第一面抵接入光面,第二面抵接電路板。凹槽形成於本體之第一面。貫穿孔位於凹槽內,且貫穿本體之第二面。發光二極體元件位於凹槽與貫穿孔內。 In one or more embodiments of the present invention, the direct type backlight module further includes an optical lens. The optical lens comprises a body, a recess and a consistent perforation. The body is located between the circuit board and the light incident surface, and includes a first surface and a second surface opposite to each other. The first side is abutted to the smooth surface, and the second side is abutted to the circuit board. The groove is formed on the first side of the body. The through hole is located in the groove and penetrates through the second side of the body. The light emitting diode element is located in the recess and the through hole.
在本發明一或多個實施方式中,光反射部即為凹槽之至少一內壁,或者是,光反射部,例如為金屬鍍膜,依附於凹槽之至少一內壁上。 In one or more embodiments of the present invention, the light reflecting portion is at least one inner wall of the groove, or the light reflecting portion is, for example, a metal plating film attached to at least one inner wall of the groove.
在本發明一或多個實施方式中,光反射部為一光反射片與一光反射物塗層其中之一。 In one or more embodiments of the present invention, the light reflecting portion is one of a light reflecting sheet and a light reflecting material coating.
在本發明一或多個實施方式中,光反射部具有光反射圖案與光擴散圖案至少其中一者。 In one or more embodiments of the present invention, the light reflecting portion has at least one of a light reflecting pattern and a light diffusing pattern.
綜上所述,藉由本發明之直下式背光模組之設計,光反射部可讓光線反射回透光板體內,以補償出光面於圓錐形凹部之周圍區域之亮度,而消除暗帶的現象,進而提高出光面之均勻亮度並解決面光源亮暗不勻的問題。 In summary, with the design of the direct type backlight module of the present invention, the light reflecting portion can reflect the light back into the transparent plate body to compensate the brightness of the light surface in the surrounding area of the conical concave portion, thereby eliminating the dark band phenomenon. , thereby improving the uniform brightness of the light-emitting surface and solving the problem of unevenness of the surface light source.
100、101、102、103、104‧‧‧直下式背光模組 100, 101, 102, 103, 104‧‧‧ direct type backlight module
110‧‧‧透光板體 110‧‧‧Translucent plate
111‧‧‧出光面 111‧‧‧Glossy surface
111J‧‧‧交接處 111J‧‧‧ junction
112‧‧‧環形區域 112‧‧‧ring area
112R‧‧‧環形區域最外緣 112R‧‧‧ outermost edge of the ring zone
113‧‧‧光學微結構 113‧‧‧Optical microstructure
114‧‧‧入光面 114‧‧‧Into the glossy surface
120‧‧‧圓錐形凹部 120‧‧‧Conical recess
121‧‧‧尖端底部 121‧‧‧ tip bottom
122‧‧‧凸曲面內壁 122‧‧‧ convex curved inner wall
200‧‧‧光源 200‧‧‧Light source
210‧‧‧基板 210‧‧‧Substrate
211‧‧‧可撓式片體 211‧‧‧Flexible sheet
211U‧‧‧上表面 211U‧‧‧ upper surface
211L‧‧‧下表面 211L‧‧‧ lower surface
212‧‧‧凹陷部 212‧‧‧Depression
212S‧‧‧內壁表面 212S‧‧‧ inner wall surface
220‧‧‧發光二極體元件 220‧‧‧Lighting diode components
221‧‧‧發光面 221‧‧‧Lighting surface
222‧‧‧連接腳位 222‧‧‧Connected feet
230、231、232‧‧‧光反射部 230, 231, 232‧‧‧Light Reflecting Department
235‧‧‧光學圖案 235‧‧‧ optical pattern
240‧‧‧發光二極體元件 240‧‧‧Lighting diode components
241‧‧‧導線架 241‧‧‧ lead frame
242‧‧‧發光二極體晶粒 242‧‧‧Light-emitting diode grains
243‧‧‧封裝體 243‧‧‧Package
244‧‧‧內腔 244‧‧‧ lumen
244L‧‧‧假想延伸線 244L‧‧‧imaginary extension line
250‧‧‧光學透鏡 250‧‧‧ optical lens
251‧‧‧本體 251‧‧‧ Ontology
251U‧‧‧第一面 251U‧‧‧ first side
251L‧‧‧第二面 251L‧‧‧ second side
252‧‧‧凹槽 252‧‧‧ Groove
252S‧‧‧內壁表面 252S‧‧‧ inner wall surface
253‧‧‧貫穿孔 253‧‧‧through holes
300‧‧‧顯示裝置 300‧‧‧ display device
310‧‧‧顯示面板 310‧‧‧ display panel
D、K、M、R、S‧‧‧線段 D, K, M, R, S‧‧‧ segments
W‧‧‧寬度 W‧‧‧Width
T‧‧‧厚度 T‧‧‧ thickness
α‧‧‧入射角、反射角 Α‧‧‧incident angle, reflection angle
θ‧‧‧夾角 Θ‧‧‧ angle
Φ‧‧‧最大孔徑 Φ‧‧‧Maximum aperture
P‧‧‧正投影 P‧‧‧projection
L1‧‧‧第一光線 L1‧‧‧First light
L2‧‧‧第二光線 L2‧‧‧second light
L3‧‧‧補償光線 L3‧‧‧Compensated light
2-2‧‧‧剖面線 2-2‧‧‧ hatching
X、Y、Z‧‧‧軸向 X, Y, Z‧‧‧ axial
第1圖繪示本發明一實施方式之直下式背光模組的分解圖。 FIG. 1 is an exploded view of a direct type backlight module according to an embodiment of the present invention.
第2圖繪示第1圖之2-2剖面圖。 Fig. 2 is a cross-sectional view taken along line 2-2 of Fig. 1.
第3A圖繪示一實施方式之直下式背光模組的剖視圖與光路示意圖。 FIG. 3A is a cross-sectional view and an optical path diagram of a direct type backlight module according to an embodiment.
第3B圖繪示第3A圖之直下式背光模組的尺寸關係圖。 FIG. 3B is a diagram showing the dimensional relationship of the direct type backlight module of FIG. 3A.
第4A圖繪示一實施方式之直下式背光模組的剖視圖。 FIG. 4A is a cross-sectional view showing a direct type backlight module according to an embodiment.
第4B圖繪示第4A圖之光學透鏡的俯視圖。 Fig. 4B is a plan view showing the optical lens of Fig. 4A.
第5圖繪示一實施方式之直下式背光模組的剖視圖。 FIG. 5 is a cross-sectional view showing a direct type backlight module according to an embodiment.
第6圖繪示一實施方式之直下式背光模組的剖視圖。 FIG. 6 is a cross-sectional view showing a direct type backlight module according to an embodiment.
第7圖繪示本發明一實施方式之一顯示裝置的示意圖。 FIG. 7 is a schematic view showing a display device according to an embodiment of the present invention.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示本發明一實施方式之直下式背光模組100的分解圖。如第1圖所示,本實施方式之直下式背光模組100包含一透光板體110、多個圓錐形凹部120與一光源200。透光板體110包含相對之出光面111與入光面114。這些圓錐形凹部120間隔地排列於出光面111上。光源200包含一電路板210與多個發光二極體元件220。這些發光二 極體元件220為發光二極體封裝結構,並分別間隔地排列於電路板210上,且分別一一對齊這些圓錐形凹部120,用以提供光線經由入光面114進入透光板體110,以便光線於出光面111產生面光源。 FIG. 1 is an exploded view of a direct type backlight module 100 according to an embodiment of the present invention. As shown in FIG. 1 , the direct type backlight module 100 of the present embodiment includes a light transmissive plate body 110 , a plurality of conical recesses 120 , and a light source 200 . The light transmissive plate body 110 includes a light emitting surface 111 and a light incident surface 114. These conical recesses 120 are spaced apart from each other on the light exit surface 111. The light source 200 includes a circuit board 210 and a plurality of light emitting diode elements 220. These two lights The polar body component 220 is a light emitting diode package structure, and is respectively arranged on the circuit board 210 at intervals, and the conical recesses 120 are respectively aligned one by one to provide light to enter the light transmissive plate body 110 via the light incident surface 114. So that the light generates a surface light source on the light exit surface 111.
第2圖繪示第1圖之2-2剖面圖,為方便解釋,第2圖也繪示發光二極體元件220及其周邊相關結構。每個發光二極體元件220夾設於電路板210與入光面114之間,更具體地,發光二極體元件220之頂面具有一發光面221,發光面221平貼入光面114,發光二極體元件220之底面具有連接腳位222,連接腳位222電性連接於電路板210之表面。 2 is a cross-sectional view taken along line 2-2 of FIG. 1. For convenience of explanation, FIG. 2 also shows the light-emitting diode element 220 and its peripheral related structure. Each of the light emitting diode elements 220 is interposed between the circuit board 210 and the light incident surface 114. More specifically, the top surface of the light emitting diode element 220 has a light emitting surface 221, and the light emitting surface 221 is flatly attached to the light surface 114. The bottom surface of the LED component 220 has a connection pin 222 electrically connected to the surface of the circuit board 210.
如第2圖所示,每一個圓錐形凹部120包含一尖端底部121與一凸曲面內壁122。若俯視出光面111時,圓錐形凹部120於出光面111上呈圓形,圓錐形凹部120之中心點即為尖端底部121。 As shown in FIG. 2, each of the conical recesses 120 includes a tip end portion 121 and a convex curved inner wall 122. When the light exit surface 111 is viewed from above, the conical concave portion 120 has a circular shape on the light exit surface 111, and the center point of the conical concave portion 120 is the tip end bottom portion 121.
尖端底部121於入光面114之一正投影P落於發光二極體元件220之發光面221上,甚至可精準地落於發光二極體元件220之發光面221之一中心上。凸曲面內壁122分別連接尖端底部121與出光面111,介於尖端底部121與出光面111之間,且完整地圍繞尖端底部121。換言之,圓錐形凹部120之凸曲面內壁122之剖面係為二弧線,這兩個弧線分別由圓錐形凹部120二相對側之出光面111對稱且彎弧地向下延伸,最終彼此相交並共同指向發光二極體元件220之末端形成尖端底部121。各弧線係為由複數個不 同斜率之線條所組成之曲線。 The front projection P of the tip end portion 121 on the light-emitting surface 221 of the light-emitting diode element 220 is evenly projected on the light-emitting surface 221 of the light-emitting diode element 220, and even falls on the center of one of the light-emitting surfaces 221 of the light-emitting diode element 220. The convex curved inner wall 122 connects the tip bottom portion 121 and the light exit surface 111, respectively, between the tip bottom portion 121 and the light exit surface 111, and completely surrounds the tip bottom portion 121. In other words, the cross-section of the convex curved inner wall 122 of the conical recess 120 is a two-curve line, and the two arcs are respectively symmetrical and curved downwardly from the light-emitting surface 111 on the opposite sides of the conical recess 120, and finally intersect each other and jointly The tip end of the light emitting diode element 220 forms a tip bottom portion 121. Each arc is composed of a plurality of A curve composed of lines with the same slope.
從光學設計的角度觀之,發光二極體元件220的50%強度展光角度會落在圓錐形凹部120內;換句話說,發光二極體元件220產生的光線,大部分落在凸曲面內壁122;極少部分落在圓錐形凹部120外,也就是直接大角度的射向出光面111,這些都可稱之為一次光學。受出光面111及凸曲面內壁122反射的光線,則相應的稱之為二次光學。 From the perspective of optical design, the 50% intensity of the light-emitting diode element 220 will fall within the conical recess 120; in other words, the light generated by the LED element 220 mostly falls on the convex surface. The inner wall 122; a small portion falls outside the conical recess 120, that is, directly at a large angle to the light exit surface 111, which may be referred to as primary optics. The light reflected by the light-emitting surface 111 and the convex curved inner wall 122 is correspondingly referred to as secondary optics.
當發光二極體元件220之多個光線分別抵達這個凸曲面內壁122不同斜率之線條時,會在凸曲面內壁122上產生全反射,形成所繪示的第一光線L1,這些第一光線L1是被反射成水平方向(如X軸)運動,而與出光面111或入光面114平行,有效成為可受控之二次光學,這些二次光學將隨光程路徑發散,最終被出光面111或入光面114上設計的光學微結構(pattern)引導出來,藉以成為均勻出光面。 When a plurality of light rays of the LED body 220 respectively reach the lines of different slopes of the convex curved inner wall 122, total reflection is generated on the convex curved inner wall 122 to form the first light L1, which is first. The light L1 is reflected in a horizontal direction (such as the X-axis), and parallel to the light-emitting surface 111 or the light-incident surface 114, effectively becomes a controllable secondary optics. These secondary optics will diverge with the optical path, and finally The optical pattern designed on the light-emitting surface 111 or the light-incident surface 114 is guided to form a uniform light-emitting surface.
然而,當發光二極體元件220之一次光學光線落點超出圓錐形凹部120時,會形成大角度全反射且不受控制的二次光學,如圖所繪示的第二光線L2。這些第二光線L2是因為一次光學並非抵達這個凸曲面內壁122而是抵達出光面111,例如,抵達凸曲面內壁122與出光面111之交接處111J(或稱轉折點)。第二光線L2在交接處111J產生全反射,所以會彈向入光面114;展光角度大於第二光線L2的其他不受控制的二次光學也都會在交接處111J之外產生 全反射。因此,從出光面111正上方觀之,就會形成一段相對陰暗的環形區域112,造成光學品味不良。 However, when the primary optical ray of the illuminating diode element 220 falls beyond the conical recess 120, a large angle total reflection and uncontrolled secondary optics are formed, such as the second ray L2 as illustrated. These second rays L2 are because the primary optics does not reach the convex curved inner wall 122 but arrives at the light exiting surface 111, for example, reaching the intersection 111J (or turning point) of the convex curved inner wall 122 and the light emitting surface 111. The second light ray L2 is totally reflected at the intersection 111J, so it will bounce toward the light incident surface 114; other uncontrolled secondary optics having a light illuminating angle greater than the second light ray L2 will also be generated outside the intersection 111J. Total reflection. Therefore, viewed from directly above the light-emitting surface 111, a relatively dark annular region 112 is formed, resulting in poor optical taste.
因此,本發明之發明人殫精竭慮,找出前述光學品味不良的現象與造成此一現象的物理原因,並孜孜矻矻加以研究,終而提出如下諸實施方式,以解決前述之環形區域112暗帶問題。第3A圖繪示一實施方式之直下式背光模組101的剖視圖與光路示意圖。如第3A圖,本發明之一實施方式中,光源200更包含一或多個光反射部230。光反射部230位於電路板210與入光面114之間,其一側抵接入光面114,另側傾斜地伸向發光二極體元件220,故,光反射部230與入光面114不相互平行。 Therefore, the inventors of the present invention have deliberately tried to find out the aforementioned phenomenon of poor optical taste and the physical cause of the phenomenon, and have studied it, and finally proposed the following embodiments to solve the aforementioned dark band of the annular region 112. problem. FIG. 3A is a cross-sectional view and an optical path diagram of the direct type backlight module 101 according to an embodiment. As shown in FIG. 3A, in an embodiment of the present invention, the light source 200 further includes one or more light reflecting portions 230. The light reflecting portion 230 is located between the circuit board 210 and the light incident surface 114, and has one side abutting the light surface 114 and the other side obliquely extending toward the light emitting diode element 220. Therefore, the light reflecting portion 230 and the light incident surface 114 are not Parallel to each other.
如此,參考第3A圖所示,由於光反射部230與入光面114不相互平行,相較於入光面114為傾斜狀,光反射部230可將發光二極體元件220側向所漏出之微光反射至透光板體110內,以便讓多個補償光線L3從所述環形區域112出光,補償所述環形區域112不足之亮度,進而讓所述環形區域112之亮度較接近圓錐形凹部120之凸曲面內壁122之亮度,改善面光源亮暗不勻的問題。 Thus, as shown in FIG. 3A, since the light reflecting portion 230 and the light incident surface 114 are not parallel to each other, and the light incident surface 114 is inclined, the light reflecting portion 230 can laterally leak the light emitting diode element 220. The low light is reflected into the light-transmitting plate body 110, so that the plurality of compensating light beams L3 are emitted from the annular region 112 to compensate for the insufficient brightness of the annular region 112, so that the brightness of the annular region 112 is closer to the conical shape. The brightness of the convex curved inner wall 122 of the concave portion 120 improves the problem of unevenness of the surface light source.
反觀第2A圖,由於第2A圖之電路板210表面與入光面114表面彼此大致平行,故,發光二極體元件220側向所露出之微光無法被利用至透光板體110內,進而無法有效地補強所述環形區域112之亮度。 In contrast, in FIG. 2A, since the surface of the circuit board 210 of FIG. 2A and the surface of the light incident surface 114 are substantially parallel to each other, the shimmering light emitted from the side of the light-emitting diode element 220 cannot be utilized in the light-transmitting plate body 110. Further, the brightness of the annular region 112 cannot be effectively reinforced.
在一些實施方式中,若光反射部230的尺寸有限而無法對應到被所述環形區域112反射而來之第二光線L2, 將無法提供補償光線L3回出光面111上,為此,如第3A圖,光反射部230朝遠離發光二極體元件220之方向(如X軸),可至少側向延伸至所述環形區域112最外緣112R所垂直對應至入光面114的區域,以便讓這個光反射部230得以反射被所述環形區域112反射而來之第二光線L2。 In some embodiments, if the size of the light reflecting portion 230 is limited and cannot correspond to the second light ray L2 reflected by the annular region 112, The compensation light L3 will not be provided on the light-receiving surface 111. For this reason, as shown in FIG. 3A, the light-reflecting portion 230 may extend at least laterally to the annular region in a direction away from the light-emitting diode element 220 (such as the X-axis). The outermost edge 112R of the 112 corresponds to the area of the light incident surface 114 so that the light reflecting portion 230 can reflect the second light ray L2 reflected by the annular region 112.
第3B圖繪示第3A圖之直下式背光模組101的尺寸關係圖。詳細來說,如第3B圖,圓錐形凹部120具有一最大孔徑Φ,最大孔徑Φ為圓錐形凹部120二相對側之出光面111與凸曲面內壁122之交接處111J(或稱轉折點)彼此間之最小直線距離。線段R為尖端底部121與上述轉折點處於同一高度時之水平間距,即為最大孔徑Φ之半徑(Φ/2)。發光二極體元件220具有一厚度T與一寬度W。 厚度T為發光二極體元件220之頂面至底面(如Z軸)的一最小長度。寬度W為發光二極體元件220之頂面沿剖面方向(如X軸)延伸之一最小長度。由於尖端底部121於入光面114之正投影P落於發光二極體元件220之發光面221之中心上,因此,線段D為W/2,則線段K為線段R與線段D的相差值,即(Φ/2-W/2)。由於第二光線L2抵達出光面111之入射角α等於反射角α,因此,線段M為線段K的2倍值,即為(Φ-W)。 FIG. 3B is a diagram showing the dimensional relationship of the direct type backlight module 101 of FIG. 3A. In detail, as shown in FIG. 3B, the conical recess 120 has a maximum aperture Φ, and the maximum aperture Φ is the intersection 111111 (or turning point) of the light-emitting surface 111 on the opposite side of the conical recess 120 and the convex curved inner wall 122. The minimum linear distance between the two. The line segment R is the horizontal distance when the tip end portion 121 is at the same height as the above-mentioned turning point, that is, the radius (Φ/2) of the maximum aperture Φ. The light emitting diode element 220 has a thickness T and a width W. The thickness T is a minimum length from the top surface to the bottom surface (e.g., the Z-axis) of the light-emitting diode element 220. The width W is a minimum length of the top surface of the light-emitting diode element 220 extending in the cross-sectional direction (e.g., the X-axis). Since the orthographic projection P of the tip bottom portion 121 on the light incident surface 114 falls on the center of the light emitting surface 221 of the light emitting diode element 220, the line segment D is W/2, and the line segment K is the difference between the line segment R and the line segment D. That is (Φ/2-W/2). Since the incident angle α of the second light ray L2 reaching the light exiting surface 111 is equal to the reflection angle α, the line segment M is twice the value of the line segment K, that is, (Φ-W).
如此,當光反射部230與入光面114之間的夾角為θ時,線段S,的直線距離,至少為tanθ=厚度T/(最大孔徑Φ-寬度W),才能讓光反射部230得以反射發光二極體元件220之光線至所述環形區域112。換句話說,光反射部 230與入光面114之夾角θ為tan-1T/(Φ-W),調整夾角θ也可讓光反射部230得以反射發光二極體元件220之光線至所述環形區域112。 Thus, when the angle between the light reflecting portion 230 and the light incident surface 114 is θ, the linear distance of the line segment S is at least tan θ=thickness T/(maximum aperture Φ-width W), so that the light reflecting portion 230 can be obtained. Light from the LED component 220 is reflected to the annular region 112. In other words, the angle θ between the light reflecting portion 230 and the light incident surface 114 is tan -1 T / (Φ - W), and adjusting the angle θ allows the light reflecting portion 230 to reflect the light of the light emitting diode element 220. The annular region 112 is described.
回第3A圖,在一些實施方式中,電路板210,例如為可撓式電路板或可撓式金屬芯印刷電路板。電路板210包含相對之上表面211U與下表面211L。發光二極體元件220與光反射部230都設於上表面211U上。此實施方式中,光反射部230為電路板210之上表面211U之部份,例如樹脂亮光漆或金屬鍍面。 Referring back to FIG. 3A, in some embodiments, the circuit board 210 is, for example, a flexible circuit board or a flexible metal core printed circuit board. The circuit board 210 includes a relatively upper surface 211U and a lower surface 211L. Both the light emitting diode element 220 and the light reflecting portion 230 are provided on the upper surface 211U. In this embodiment, the light reflecting portion 230 is a portion of the upper surface 211U of the circuit board 210, such as a resin varnish or a metal plating surface.
當發光二極體元件220之出光面111與電路板210之上表面211U都抵接入光面114時,電路板210被彎曲而形成一凹陷部212於電路板210與入光面114之間,且發光二極體元件220位於凹陷部212內。凹陷部212之一或多個內壁表面212S即為光反射部230,且光反射部230環繞這個發光二極體元件220。 When the light emitting surface 111 of the LED component 220 and the upper surface 211U of the circuit board 210 are both connected to the light surface 114, the circuit board 210 is bent to form a recess 212 between the circuit board 210 and the light incident surface 114. And the light emitting diode element 220 is located in the recess 212. One or more of the inner wall surfaces 212S of the recessed portion 212 is the light reflecting portion 230, and the light reflecting portion 230 surrounds the light emitting diode element 220.
部份之實施方式中,由於第3A圖的電路板210每次都要精準地被彎曲後才會形成凹陷部212,才能讓光反射部230產生傾斜,才能讓光反射部230對位到正確的位置,以達成上述補償光線L3的功效。因此,在一些實施方式中,如第4A圖與第4B圖所示,這個直下式背光模組102中,具有一透光之光學透鏡250或不透光之外蓋。以光學透鏡250為例,光學透鏡250包含一本體251、一凹槽252與一貫穿孔253。本實施方式中,本體251包含相對之第一面251U與第二面251L。第一面251U抵接入光面114,第 二面251L抵接電路板210。凹槽252形成於本體251之第一面251U,使得第一面251U圍繞凹槽252。貫穿孔253位於凹槽252內,且自凹槽252底部貫穿至本體251之第二面251L。發光二極體元件220恰位於貫穿孔253內。光反射部231為凹槽252內壁表面252S,例如為光學透鏡250之一部分,並環繞發光二極體元件220。由俯視觀之,貫穿孔253為內壁表面252S之中心點(第4B圖),且內壁表面252S之剖面係為二直線,各直線對稱地自入光面114向下延伸至貫穿孔253(第4A圖)。 In some embodiments, since the circuit board 210 of FIG. 3A is accurately bent each time to form the recessed portion 212, the light reflecting portion 230 can be tilted to allow the light reflecting portion 230 to be aligned correctly. The position to achieve the above effect of compensating for the light L3. Therefore, in some embodiments, as shown in FIGS. 4A and 4B, the direct type backlight module 102 has a light transmissive optical lens 250 or a opaque outer cover. Taking the optical lens 250 as an example, the optical lens 250 includes a body 251, a recess 252 and a uniform through hole 253. In the present embodiment, the body 251 includes a first surface 251U and a second surface 251L opposite to each other. The first surface 251U is connected to the light surface 114, the first The two sides 251L abut the circuit board 210. The groove 252 is formed on the first face 251U of the body 251 such that the first face 251U surrounds the groove 252. The through hole 253 is located in the recess 252 and penetrates from the bottom of the recess 252 to the second surface 251L of the body 251. The light emitting diode element 220 is located just inside the through hole 253. The light reflecting portion 231 is an inner wall surface 252S of the recess 252, for example, a portion of the optical lens 250, and surrounds the light emitting diode element 220. The through hole 253 is a center point of the inner wall surface 252S (FIG. 4B), and the inner wall surface 252S has two straight lines, and each of the straight lines extends symmetrically from the light incident surface 114 to the through hole 253. (Fig. 4A).
安裝時,先將光學透鏡250放置於電路板210上,使得發光二極體元件220進入貫穿孔253與凹槽252內,再將光學透鏡250與發光二極體元件220緊靠入光面114,使得光學透鏡250之第一面251U與發光二極體元件220之發光面221都抵靠入光面114,且光學透鏡250與發光二極體元件220都被夾設於入光面114與電路板210之間。本實施方式中,電路板210不限為硬式電路板或可撓式電路板。 During installation, the optical lens 250 is first placed on the circuit board 210 such that the LED component 220 enters the through hole 253 and the recess 252, and the optical lens 250 and the LED component 220 are pressed against the light surface 114. The first surface 251U of the optical lens 250 and the light emitting surface 221 of the light emitting diode element 220 both abut the light incident surface 114, and the optical lens 250 and the light emitting diode element 220 are both disposed on the light incident surface 114 and Between the boards 210. In this embodiment, the circuit board 210 is not limited to a hard circuit board or a flexible circuit board.
其他實施方式中,第5圖繪示一實施方式之直下式背光模組103的剖視圖。如第5圖所示,第5圖之直下式背光模組103與第4A圖之直下式背光模組102大致雷同,只是光反射部232係另外形成於凹槽252之一或多個內壁表面252S上,讓光反射部232依附於凹槽252之內壁上,且環繞發光二極體元件220。舉例來說,光反射部232為光反射片(例如塑膠片)或光反射物塗層(例如金屬鍍膜)。 In other embodiments, FIG. 5 is a cross-sectional view of the direct type backlight module 103 according to an embodiment. As shown in FIG. 5, the direct type backlight module 103 of FIG. 5 is substantially the same as the direct type backlight module 102 of FIG. 4A except that the light reflecting portion 232 is additionally formed on one or more inner walls of the recess 252. On the surface 252S, the light reflecting portion 232 is attached to the inner wall of the recess 252 and surrounds the light emitting diode element 220. For example, the light reflecting portion 232 is a light reflecting sheet (for example, a plastic sheet) or a light reflecting material coating (for example, a metal plating film).
此外,由第5圖可知,本發明所屬技術領域中具有通常知識者,還是可以視情況需要,選擇光反射部為平面、全平面、弧面或其組合。 In addition, as can be seen from FIG. 5, those having ordinary knowledge in the technical field to which the present invention pertains can select a light reflecting portion as a plane, a full plane, a curved surface, or a combination thereof as occasion demands.
此外,上述各實施方式中,為了讓光反射部230提高光學性能,光反射部230具有光學圖案235間隔地形成於光反射部上。光學圖案235例如是光反射圖案、光擴散圖案或二者皆是(圖中未示)。光學圖案235亦可為均勻或不均勻地分佈。 Further, in each of the above embodiments, in order to improve the optical performance of the light reflecting portion 230, the light reflecting portion 230 has the optical pattern 235 formed at intervals on the light reflecting portion. The optical pattern 235 is, for example, a light reflecting pattern, a light diffusing pattern, or both (not shown). The optical patterns 235 may also be uniformly or unevenly distributed.
本發明不限光反射部之顏色與材質。光反射部之顏色例如可為白色、銀色或其他合適的顏色。光反射部可為一具有亮色塗層的塑膠或為一高反光係數之金屬(例如銀、鋁、金、鉻、銅、鈀、鈦或其他金屬及合金),但不僅限於此。 The invention is not limited to the color and material of the light reflecting portion. The color of the light reflecting portion may be, for example, white, silver or other suitable color. The light reflecting portion may be a plastic having a bright color coating or a metal having a high light reflecting coefficient (for example, silver, aluminum, gold, chromium, copper, palladium, titanium or other metals and alloys), but is not limited thereto.
此外,回第3A圖所示,為確保透光板體110提供更好的出光效率,透光板體110更包含多個擴散用或反射用之光學微結構113。光學微結構113間隔地形成於出光面111上,此實施方式中,光學微結構113僅形成於出光面111之環形區域112上,使得光學微結構113可更強化補償光線L3朝所述環形區域112出光的亮度。當然,本發明所屬技術領域中具有通常知識者,還是可以視情況需要,選擇將光學微結構113形成於出光面111與入光面114上。 In addition, as shown in FIG. 3A, in order to ensure better light-emitting efficiency of the light-transmitting plate body 110, the light-transmitting plate body 110 further includes a plurality of optical microstructures 113 for diffusion or reflection. The optical microstructures 113 are formed on the light-emitting surface 111 at intervals. In this embodiment, the optical microstructures 113 are formed only on the annular region 112 of the light-emitting surface 111, so that the optical microstructures 113 can strengthen the compensation light L3 toward the annular region. 112 brightness of the light. Of course, those having ordinary knowledge in the technical field of the present invention may choose to form the optical microstructures 113 on the light-emitting surface 111 and the light-incident surface 114 as occasion demands.
為解決面光源亮暗不勻的現象,直下式背光模組100亦可選擇將發光元件本身的出光角度予以收斂,使得發光元件之光線都集中於圓錐形凹部120之凸曲面內壁122 上。如此,第6圖繪示一實施方式之直下式背光模組104的剖視圖。如第6圖所示,直下式背光模組104之透光板體110與多個圓錐形凹部120與上述相同,以下不再加以贅述。直下式背光模組104之發光二極體元件240包含導線架241、發光二極體晶粒242(die)與封裝體243。發光二極體晶粒242電性連接導線架241。封裝體243包覆導線架241與發光二極體晶粒242,以形成一發光二極體封裝晶片。封裝體243內具有一內腔244,發光二極體晶粒242位於這個內腔244內,對齊其中一個圓錐形凹部120之尖端底部121。 In order to solve the phenomenon that the surface light source is uneven, the direct-lit backlight module 100 may also converge the light-emitting angle of the light-emitting element itself, so that the light of the light-emitting element is concentrated on the convex curved inner wall 122 of the conical recess 120. on. As such, FIG. 6 is a cross-sectional view of the direct type backlight module 104 of an embodiment. As shown in FIG. 6, the light-transmissive plate body 110 of the direct-type backlight module 104 and the plurality of conical recesses 120 are the same as described above, and will not be further described below. The LED component 240 of the direct type backlight module 104 includes a lead frame 241, a light emitting diode die 242 and a package 243. The LED die 242 is electrically connected to the lead frame 241. The package body 243 covers the lead frame 241 and the light emitting diode die 242 to form a light emitting diode package wafer. The package body 243 has an inner cavity 244 therein. The light emitting diode die 242 is located in the inner cavity 244 and is aligned with the tip bottom portion 121 of one of the conical recesses 120.
由於封裝體243之剖面具有二直線分別傾斜地向上延伸,由導線架241朝出光面111之方向(如Z軸)逐漸地相互遠離,且這兩個直線之假想延伸線244L分別恰通過凸曲面內壁122與出光面111之交接處111J。如此,藉由封裝體243內壁所形成的角度限制,發光二極體晶粒242本身的出光角度被限縮,使得發光二極體晶粒242大部分之光線都集中於圓錐形凹部120之凸曲面內壁122後,可有效受成為可受控之二次光學,大大縮小環形區域112的暗帶。 Since the cross section of the package body 243 has two straight lines extending obliquely upward, the direction of the lead frame 241 toward the light exit surface 111 (such as the Z axis) is gradually away from each other, and the imaginary extension lines 244L of the two straight lines pass through the convex curved surface respectively. The intersection of the wall 122 and the light exit surface 111 is 111J. Thus, by the angle limitation formed by the inner wall of the package body 243, the light exiting angle of the light emitting diode die 242 itself is limited, so that most of the light of the light emitting diode die 242 is concentrated in the conical recess 120. After the convex curved inner wall 122, it can be effectively subjected to controllable secondary optics, which greatly reduces the dark band of the annular region 112.
第7圖繪示本發明一實施方式之一顯示裝置300的示意圖。如第7圖所示,顯示裝置300包含一顯示面板310與上述直下式背光模組(例如101),直下式背光模組100位於顯示面板310之一側,以提供顯示面板310足夠的發光亮度。 FIG. 7 is a schematic diagram of a display device 300 according to an embodiment of the present invention. As shown in FIG. 7, the display device 300 includes a display panel 310 and the above-described direct type backlight module (for example, 101). The direct type backlight module 100 is located on one side of the display panel 310 to provide sufficient brightness of the display panel 310. .
如此,藉由本發明之直下式背光模組之設計,因為光反射部將光線反射至圓錐形凹部之周圍區域,補償了圓錐形凹部之周圍區域之亮度,或發光二極體晶粒本身的出光角度被限縮以對應圓錐形凹部,避免暗帶現象的產生,進而提高出光面之均勻亮度並解決面光源亮暗不勻的問題。 Thus, with the design of the direct type backlight module of the present invention, since the light reflecting portion reflects the light to the surrounding area of the conical concave portion, the brightness of the surrounding area of the conical concave portion or the light output of the light emitting diode die itself is compensated. The angle is limited to correspond to the conical recess, avoiding the occurrence of the dark band phenomenon, thereby improving the uniform brightness of the light-emitting surface and solving the problem of unevenness of the surface light source.
101‧‧‧直下式背光模組 101‧‧‧Direct type backlight module
110‧‧‧透光板體 110‧‧‧Translucent plate
111‧‧‧出光面 111‧‧‧Glossy surface
112‧‧‧環形區域 112‧‧‧ring area
112R‧‧‧環形區域最外緣 112R‧‧‧ outermost edge of the ring zone
113‧‧‧光學微結構 113‧‧‧Optical microstructure
114‧‧‧入光面 114‧‧‧Into the glossy surface
120‧‧‧圓錐形凹部 120‧‧‧Conical recess
121‧‧‧尖端底部 121‧‧‧ tip bottom
122‧‧‧凸曲面內壁 122‧‧‧ convex curved inner wall
200‧‧‧光源 200‧‧‧Light source
210‧‧‧電路板 210‧‧‧ boards
211U‧‧‧上表面 211U‧‧‧ upper surface
211L‧‧‧下表面 211L‧‧‧ lower surface
212‧‧‧凹陷部 212‧‧‧Depression
212S‧‧‧內壁表面 212S‧‧‧ inner wall surface
220‧‧‧發光二極體元件 220‧‧‧Lighting diode components
221‧‧‧發光面 221‧‧‧Lighting surface
230‧‧‧光反射部 230‧‧‧Light Reflecting Department
235‧‧‧光學圖案 235‧‧‧ optical pattern
L2‧‧‧第二光線 L2‧‧‧second light
L3‧‧‧補償光線 L3‧‧‧Compensated light
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TW102128137A TWI486687B (en) | 2013-08-06 | 2013-08-06 | Direct lighting type backlight module |
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US10312408B2 (en) | 2016-10-06 | 2019-06-04 | Lextar Electronics Corporation | Light emitting diode chip scale packaging structure and direct type backlight module |
US10754191B2 (en) | 2018-10-10 | 2020-08-25 | Coretronic Corporation | Display light source module having encapsulated LEDs and reflective recess with reflective patterns |
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CN102214766A (en) * | 2010-04-02 | 2011-10-12 | 游森溢 | Encapsulating structure for light-emitting diode |
TWI456805B (en) * | 2012-01-17 | 2014-10-11 | Univ Nat Central | Led lens |
CN202796936U (en) * | 2012-06-11 | 2013-03-13 | 琉明斯光電科技股份有限公司 | Polycrystalline wide-angle light emitting diode |
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US10312408B2 (en) | 2016-10-06 | 2019-06-04 | Lextar Electronics Corporation | Light emitting diode chip scale packaging structure and direct type backlight module |
TWI688128B (en) * | 2016-10-06 | 2020-03-11 | 隆達電子股份有限公司 | Light emitting diode chip scale packaging structure and direct type backlight module |
US10754191B2 (en) | 2018-10-10 | 2020-08-25 | Coretronic Corporation | Display light source module having encapsulated LEDs and reflective recess with reflective patterns |
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