TW201500194A - Adhesive component - Google Patents

Abstract

The present invention relates to an adhesive component. The adhesive component includes a carried film, a buffer layer which includes an opening, a first adhesive film and a releasing film. The carried film and the buffer layer are disposed on two opposite surfaces of the first glue film respectively. A first protecting film is disposed on a surface of the carried film adjacent to the first adhesive film. The first protecting film is correspondingly located at the opening. The release film is disposed on a surface of the first glue film away from the buffer layer. The adhesive component further includes a second protecting film disposed on a surface of the release film adjacent to the first adhesive film, so as to separate the release film from the first protecting film.

Description

Bonding structure

The present invention relates to a bonding structure applied to a touch display device.

The existing touch display device, such as a mobile phone with a touch function, a tablet computer, etc., is required to be connected by a bonding structure in order to make an effective fit between the touch module and the display module. Fit, seal and other effects. However, in practical applications, after the touch module and the display module are assembled, it is often found that the adhesive substance in the adhesive structure is adhered or transferred to the surface of the touch module or the display module, for example, The release agent in the bonding structure is transferred to the sensing substrate of the touch module, causing flaws in the appearance and quality of the touch module.

In view of the above, there is provided an adhesive structure capable of preventing contamination or transfer defects of a device to be pasted.

An adhesive structure comprising a carrier film, a buffer layer having an opening, a first adhesive layer, and a release film, wherein the carrier film and the first adhesive layer are disposed on two opposite surfaces of the buffer layer, and the carrier film is adjacent to the first a first protective film is disposed on the surface of the adhesive layer, and the first protective film is disposed at an opening of the buffer layer, and the release film is disposed on a surface of the first adhesive layer away from the buffer layer, the adhesive structure The second protective film is disposed on the surface of the release film adjacent to the first adhesive layer to block mutual contact between the release film and the first protective film.

Compared with the prior art, in the bonding structure of the present invention, a second protective film is disposed between the release film and the first adhesive layer, thereby preventing the second protective film from being effectively prevented during application. The substance on the film adheres or is transferred to one of the modules to be attached, such as a touch module, to avoid the poor appearance and poor quality of the touch module.

10‧‧‧bonding structure

100‧‧‧ carrying film

200‧‧‧First protective film

300‧‧‧buffer layer

400‧‧‧First adhesive layer

500‧‧‧Second protective film

600‧‧‧Second adhesive layer

700‧‧‧ release film

710‧‧‧ Main body

720‧‧‧Extension

20‧‧‧Touch display device

210‧‧‧Touch Module

220‧‧‧ display module

Figure 1 is an exploded perspective view of the bonded structure of the present invention.

2 is a schematic view showing the planar structure of the bonded structure of the present invention.

3 is a schematic cross-sectional view of the bonding structure of FIG. 2 taken along line III-IIII.

4 is a schematic cross-sectional view showing the structure of the adhesive junction of the present invention applied to a touch display device.

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

1 to 3, wherein FIG. 1 is an exploded view of the bonding structure of the present invention, FIG. 2 is a schematic view of the bonding structure of the present invention, and FIG. 3 is a third embodiment of the bonding structure of FIG. Schematic diagram of the section structure. In this embodiment, the bonding structure 10 is preferably applied to a touch display device, such as a touch mobile phone or a tablet computer, for performing the touch module in the touch display device with other modules, such as a display module. Fit the connection. It can be understood that the bonding structure 10 can also be applied to other modules to be attached, and is not limited to the touch display device.

The bonding structure 10 includes a carrier film 100 , a first protective film 200 , a buffer layer 300 , a first adhesive layer 400 , a second protective film 500 , a second adhesive layer 600 , and a release film 700 . The carrier film 100, the buffer layer 300, the first adhesive layer 400, and the release film 700 are sequentially stacked, the first protective film 200 is disposed between the carrier film 100 and the buffer layer 300, and the second protective film 500 is disposed at the first The adhesive layer 400 is between the adhesive film 700 and the release film 700. The second adhesive layer 600 is disposed between the second protective film 500 and the release film 700.

The buffer layer 300 has a certain elasticity. In the present embodiment, the buffer layer 300 is an acrylic foam or foam.

It should be noted that, in order to not affect the normal operation of the touch module, in the touch display module, the buffer layer 300 having the buffering and adhesiveness in the bonding structure 10 is disposed on the edge portion of the touch display module, and It does not correspond to the touch display device receiving the touch operation and the partial setting of displaying the image. Therefore, in the present embodiment, both the buffer layer 300 and the first adhesive layer 400 have a frame shape with a hollow opening.

The carrier film 100 is adhered to the buffer layer 300 and covers the buffer layer 300 and a region of the hollow opening thereof for preventing the buffer layer 300 from being deformed or contaminated. The carrier film 100 can be made of a PET material and has a certain viscosity of a transparent film.

The first protective film 200 is disposed corresponding to the position of the hollow opening of the buffer layer 300, and the area of the first protective film 200 is slightly smaller than the area of the hollow opening of the buffer layer 300. After the bonding structure 10 is combined, as shown in FIG. 3, the first protective film 200 is embedded in the hollow opening of the buffer layer 300. The first protective film 200 is attached to the surface of the carrier film 100 adjacent to the buffer layer 300 under the adhesive action of the carrier film 100.

Preferably, the distance between the outer edge of the first protective film 200 and the inner edge of the buffer layer 300 is not less than 1 mm.

The first protective film 200 may be a transparent film made of PET. The first protective film 200 may also vary according to the shape of the buffer layer 300.

The first adhesive layer 400 is disposed on the lower surface of the buffer layer 300 for providing a bonding force for a module to be attached, such as a touch module, for bonding with other modules, such as a display module.

The release film 700 is disposed on a surface of the first adhesive layer 400 away from the buffer layer 300 and integrally covers the first adhesive layer 400 and a region of the hollow opening thereof. The release film 700 can prevent the buffer layer 300 from being deformed and prevent dust. And the like is adhered to the first adhesive layer 400. In the present embodiment, the release film 700 is formed by applying a release agent or eucalyptus oil to a substrate made of PET.

The release film 700 includes a body portion 710 and an extension portion 720 that covers the buffer layer 300 and its hollow opening region. The extension portion 720 is a portion that extends from the edge portion of the main body portion 710 to facilitate the user to grip the release film 700.

The second protective film 500 is disposed on the surface of the release film 700 adjacent to the first adhesive layer 400 and corresponding to the hollow opening of the first adhesive layer 400 for blocking the first protective film 200 and the release film 700 to prevent the release film. The 700 is directly in contact with the first protective film 200, and the area of the second protective film 500 is smaller than the area of the hollow opening of the first adhesive layer 400.

Preferably, the outer edge of the second protective film 500 is spaced from the inner edge of the hollow opening of the first adhesive layer 400 by no more than 1 mm.

The second adhesive layer 600 is disposed between the second protective film 500 and the release film 700 for bonding the second protective film 500 and the release film 700.

Preferably, the second adhesive layer 600 is a viscous silicone, and the second adhesive layer 600 has a cross-sectional area of 3 mm*6 mm and is disposed at a position corresponding to the main body portion 710 adjacent to the extending portion 720. In other embodiments of the present invention, the second adhesive layer 600 is not limited to one.

Preferably, the adhesion between the carrier film 100 and the buffer layer 300 is greater than the adhesion between the release film 700 and the first adhesive layer 400, so as to tear the release film 700 from the first adhesive layer 400. After being attached to the module to be attached, for example, the touch module, the touch module can effectively prevent the carrier film 100 from being detached from the buffer layer 300 when being transported integrally with the remaining portion of the bonding structure 10. The control module is contaminated or damaged. The carrier film 100 and the release film 700 may be films of the same nature and material.

Alternatively, when the release film 700 has a certain viscosity, the adhesive structure 10 can omit the second adhesive layer 600.

In addition, the second protective film 500 can also extend and cover the entire first adhesive layer 400. At this time, the adhesion between the second protective film 500 and the release film 700 is greater than that of the second protective film 500 and the first adhesive layer 400. The adhesion between the second protective film 500 and the surface of the first adhesive layer 400 is a smooth surface.

Please refer to FIG. 4 , which is a schematic cross-sectional view of the touch display device 20 .

The touch display device 20 includes a touch module 210 and a display module 220. The touch module 210 is configured to receive a touch operation of the user and determine a location for receiving the touch operation. The touch module 210 includes touch sensing. Substrate (not shown) and other auxiliary structures. The display module 220 is configured to display an image, including a display panel, a backlight module, and the like. The bonding structure 10 is disposed between the touch module 210 and the display module 220 for bonding the two modules 210 and 220.

When the touch module 210 and the display module 220 are pasted, first, the second protective film 500, the second adhesive layer 600, and the release film 700 in the adhesive structure 10 are completely peeled off from the first adhesive layer 400. Then, the first adhesive layer 400, the buffer layer 300, the first protective film 200, and the carrier film 100 are fixed on the jig; then, the touch module 210 is bonded to the first adhesive layer 400, and finally, the carrier film is bonded; The first protective film 200 is peeled off from the buffer layer 300, and the display module 220 is bonded to the buffer layer 300.

Compared with the prior art, the second protective film 500 is further disposed between the release film 700 and the first adhesive layer 400, thereby effectively preventing substances on the release film 700 from passing through the first protective film during application. The adhesive module 200 is adhered or transferred to the touch module 210, that is, the oil on the release film 700 is prevented from being transferred to the touch sensing substrate 211 through the first protective film 200, resulting in poor appearance and quality of the touch module 210. Not good.

Optionally, an adhesive layer may be further disposed between the first protective film 200 and the buffer layer 300 to better fit the display module 220.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

no

10‧‧‧bonding structure

100‧‧‧ carrying film

200‧‧‧First protective film

300‧‧‧buffer layer

400‧‧‧First adhesive layer

500‧‧‧Second protective film

600‧‧‧Second adhesive layer

700‧‧‧ release film

710‧‧‧ Main body

720‧‧‧Extension

Claims (10)

An adhesive structure comprising a carrier film, a buffer layer having an opening, a first adhesive layer, and a release film, wherein the carrier film and the first adhesive layer are disposed on two opposite surfaces of the buffer layer, and the carrier film is adjacent to the first a first protective film is disposed on the surface of the adhesive layer, and the first protective film is disposed at an opening of the buffer layer, and the release film is disposed on a surface of the first adhesive layer away from the buffer layer, wherein the adhesive layer The connection structure further includes a second protective film disposed on the surface of the release film adjacent to the first adhesive layer to block mutual contact between the release film and the first protective film. The bonding structure of claim 1, wherein the second protective layer is disposed corresponding to the opening of the buffer layer, and the area of the second protective film is smaller than the area of the opening. The bonding structure of claim 2, wherein the outer edge of the second protective film is separated from the inner edge of the opening by no more than 1 mm. The bonding structure of claim 1, wherein the adhesion between the second protective layer and the release film is greater than the adhesion between the second protective layer and the first adhesive layer. The bonding structure of claim 4, wherein the surface of the second protective layer adjacent to the first adhesive layer is a smooth surface. The bonding structure of claim 1, wherein at least part of the surface of the release film that is in contact with the second protective film is further provided with a second adhesive layer, and the second adhesive layer is used for bonding the release film and The second protective film enables the release film and the second protective film to be simultaneously peeled off from the first adhesive layer. The adhesive structure of claim 6, wherein the release film comprises a main body portion and an extension portion, the main body portion covers the entire second adhesive layer and the opening, and the extension portion extends from an edge of the main body portion. The second adhesive layer is disposed at a position of the main body portion adjacent to the extension portion. The bonding structure of claim 1, wherein an outer edge of the first protective film is apart from an inner edge of the opening by no more than 1 mm. The bonding structure according to any one of claims 1 to 8, wherein an adhesive force between the carrier film and the buffer layer is greater than an adhesion between the release film and the first adhesive layer. The bonding structure of claim 1, wherein the buffer layer is a foam.