TW201441060A - Gas enclosure systems and methods utilizing an auxiliary enclosure - Google Patents

Gas enclosure systems and methods utilizing an auxiliary enclosure Download PDF

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TW201441060A
TW201441060A TW103108995A TW103108995A TW201441060A TW 201441060 A TW201441060 A TW 201441060A TW 103108995 A TW103108995 A TW 103108995A TW 103108995 A TW103108995 A TW 103108995A TW 201441060 A TW201441060 A TW 201441060A
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gas
assembly
various embodiments
package
panel
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TW103108995A
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TWI627075B (en
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Justin Mauck
Alexander Sou-Kang Ko
Eliyahu Vronsky
Shandon Alderson
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Kateeva Inc
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Priority claimed from US13/802,304 external-priority patent/US9048344B2/en
Priority claimed from PCT/US2014/023820 external-priority patent/WO2014164932A2/en
Priority claimed from US14/205,340 external-priority patent/US9604245B2/en
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Abstract

The present teachings disclose various embodiments of a gas enclosure system can have a gas enclosure that can include a printing system enclosure and an auxiliary enclosure. In various embodiments of a gas enclosure system of the present teachings, a printing system enclosure can be isolated from an auxiliary enclosure. Various systems and methods of the present teachings can provide for the ongoing management of a printing system by utilizing various embodiments of isolatable enclosures. For example, various measurement and maintenance process steps for the management of a printhead assembly can be performed in an auxiliary enclosure, which can be isolated from a printing system enclosure of a gas enclosure system, thereby preventing or minimizing interruption of a printing process.

Description

利用一輔助包體的氣體包體系統及方法 Gas inclusion system and method using an auxiliary inclusion body 【相關申請案之交互參照】[Reciprocal Reference of Related Applications]

本申請案為2013年3月13日申請且2013年8月15日公開為US 2013/0206058之美國申請案第13/802,304號之部分連續案。美國申請案第13/802,304號為2012年12月19日申請且2013年9月26日公開為US 2013/0252533之美國申請案第13/720,830號之部分連續案。美國申請案第13/720,830號主張2011年12月22日申請之美國臨時申請案第61/579,233號之權益。2012年12月19日申請之美國申請案第13/720,830號為2010年1月5日申請且2013年2月26日頒予為US 8,383,202之美國申請案第12/652,040號之部分連續案,該美國申請案第12/652,040號為2008年6月13日申請且2008年12月18日公開為US 2008/0311307之美國申請案第12/139.391號之部分連續案。美國申請案第12/652,040號亦主張2009年1月5日申請之美國臨時申請案第61/142,575號之權益。本文列出之所有交互參照的申請案以引用方式整體併入。 This application is a continuation-in-part of U.S. Application Serial No. 13/802,304, filed on Mar. U.S. Application Serial No. 13/802,304 is a continuation-in-part of U.S. Application Serial No. 13/720,830, filed on Dec. U.S. Application Serial No. 13/720,830, the entire disclosure of which is incorporated herein by reference in its entire entire entire entire entire entire entire entire entire entire entire entire entire entire content US Application No. 13/720,830, filed on December 19, 2012, is a continuation of the application filed on January 5, 2010, and issued on February 26, 2013 to U.S. Application Serial No. 12/652,040, filed on This U.S. Application Serial No. 12/652,040 is incorporated herein by reference in its entirety in its entirety in its entirety in its entirety in the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all U.S. Application Serial No. 12/652, 040 also claims the benefit of U.S. Provisional Application No. 61/142,575, filed on Jan. 5, 2009. All cross-referenced applications listed herein are incorporated by reference in their entirety.

本教示內容係關於氣體包體系統之各種實施例,該氣體包體系統具有用於在各種基板大小及基板材料上製造OLED面板之惰性、大體上無粒子環境。 This teaching is directed to various embodiments of gas inclusion systems having an inert, substantially particle-free environment for fabricating OLED panels on a variety of substrate sizes and substrate materials.

對OLED顯示器技術潛力之關注受OLED顯示器技術屬性的推動,該等屬性包括顯示面板之示範,該等顯示面板具有高飽和色彩,為高對比度的、超薄的、快速響應的及能量有效的。另外,包括可撓性聚合物材料之各種基板材料可用於OLED顯示器技術之製造中。儘管用於小螢幕應用(主要用於手機)之顯示器的示範已用以突出該技術之潛力,但是在將製造定標至較大格式方面仍然存在挑戰。例如,已證明在比具有約130cm×150cm尺寸之第5.5代基板大的基板上進行OLED顯示器之高容量製造為有挑戰性的。 The focus on the potential of OLED display technology is driven by the technical attributes of OLED displays, including demonstrations of display panels that have high saturation, high contrast, ultra-thin, fast response, and energy efficient. Additionally, various substrate materials including flexible polymeric materials can be used in the fabrication of OLED display technology. While demonstrations of displays for small screen applications (primarily for cell phones) have been used to highlight the potential of this technology, there are still challenges in scaling manufacturing to larger formats. For example, high capacity fabrication of OLED displays on substrates larger than the 5.5th generation substrate having a size of about 130 cm x 150 cm has proven to be challenging.

有機發光二極體(OLED)裝置可藉由使用OLED列印系統在基板上列印各種有機薄膜以及其他材料來製造。此類有機材料可易於因氧化及其他化學過程而損壞。以可定標用於各種基板大小且可在惰性、大體上無粒子列印環境中進行之方式容納OLED列印系統可存在各種挑戰。用於大格式基板列印之製造工具需要大體上大型設施來進行容納。因此,將大型設施維持在惰性氣氛下(可需要氣體純化以移除諸如水蒸氣及氧之反應性大氣物種以及有機溶劑蒸氣)以及維持大體上無粒子列印環境存在顯著的工程挑戰。例如,提供基本上密閉式密封之大型設施可存在工程挑戰。另外,饋入及饋出OLED列印系統以用於操作該列印系統之各種電纜束、導線束及管道束可產生顯著的死體積,反應性氣體物種可吸留於該死體積中。因此,對於使氣體包體有效達成關於諸如氧及水蒸氣之反應性大氣成分以及有機蒸氣之含量的規範而言,此等電纜束、導線束及管道束可存在挑戰。此外,用於列印系統之操作中的此等電纜束、導線束及管道束可為 粒狀物質之持續不斷的來源。因而,在整體封閉氣體包體系統中提供及維持大體上惰性及無粒子環境提供額外挑戰,該等額外挑戰對於可在例如在露天、高流動性層流過濾罩下之大氣條件中進行的製程而言並不存在。 An organic light emitting diode (OLED) device can be fabricated by printing various organic thin films and other materials on a substrate using an OLED printing system. Such organic materials can be easily damaged by oxidation and other chemical processes. There are various challenges in accommodating an OLED printing system in a manner that can be scaled for various substrate sizes and can be performed in an inert, substantially particle-free printing environment. Manufacturing tools for large format substrate printing require a substantially large facility for containment. Therefore, maintaining large facilities under an inert atmosphere (gas purification may be required to remove reactive atmospheric species such as water vapor and oxygen as well as organic solvent vapors) and maintaining a substantially particle-free printing environment presents significant engineering challenges. For example, large facilities that provide a substantially hermetic seal can present engineering challenges. In addition, the various cable bundles, bundles, and bundles of tubes that are fed into and fed out of the OLED printing system for operating the printing system can produce significant dead volumes, and reactive gas species can be occluded in the dead volume. Thus, such cable bundles, wire bundles, and bundles of tubes can present challenges for gas inclusions to effectively achieve specifications for reactive atmospheric constituents such as oxygen and water vapor, as well as for organic vapors. In addition, such cable bundles, bundles, and bundles of tubes used in the operation of the printing system can be A continuous source of particulate matter. Thus, providing and maintaining a substantially inert and particle-free environment in an integrally enclosed gas inclusion system provides additional challenges to processes that can be performed in atmospheric conditions, such as under open air, high flow laminar flow hoods. It does not exist.

就該方面而言,將OLED列印自第3.5代定標至第8.5代及更大,同時提供可以最少停機時間將OLED列印系統容納於惰性、大體上無粒子氣體包體環境中之穩健包體系統存在諸多挑戰。因此,存在對氣體包體系統之各種實施例的需要,該氣體包體系統可將OLED列印系統容納於惰性、大體上無粒子環境中,且可容易地定標來提供在各種基板大小及基板材料上的OLED面板製造,同時亦提供以最少停機時間進行各種量測及維護程序。 In this respect, OLEDs are printed from the 3.5th generation to the 8.5th generation and larger, while providing robust operation with minimal downtime for OLED printing systems in an inert, substantially particle-free gas inclusion environment. There are many challenges in the inclusion system. Accordingly, there is a need for various embodiments of gas inclusion systems that can house an OLED printing system in an inert, substantially particle-free environment and can be easily scaled to provide a variety of substrate sizes and OLED panel fabrication on substrate materials also provides various measurement and maintenance procedures with minimal downtime.

本教示內容揭露可具有氣體包體之系統及方法之各種實施例,該氣體包體可包括:用於容納列印系統之氣體包體總成,亦即列印系統包體,該氣體包體總成可界定第一體積或工作體積;及輔助包體,該輔助包體界定第二體積。根據本教示內容,氣體包體之各種實施例可具有允許進入列印系統包體與輔助包體之間的開口及允許進入輔助包體與氣體包體外部之間的開口。在氣體包體之各種實施例中,開口可以可密封方式封閉。本教示內容之氣體包體之各種實施例可具有開口及可以可密封方式封閉之開口。根據本教示內容,可將輔助包體與列印系統包體隔離,例如,藉由以可密封方式封閉允許進入列印系統包體與輔助包體之間的開口來隔離。 The present teachings disclose various embodiments of systems and methods that can have a gas enclosure that can include a gas inclusion assembly for receiving a printing system, that is, a printing system package, the gas inclusion body The assembly may define a first volume or working volume; and an auxiliary enclosure defining a second volume. In accordance with the present teachings, various embodiments of the gas enclosure can have openings that allow access between the printing system enclosure and the auxiliary enclosure and allow access between the auxiliary enclosure and the exterior of the gas enclosure. In various embodiments of the gas enclosure, the opening can be closed in a sealable manner. Various embodiments of the gas enclosure of the present teachings can have openings and openings that can be hermetically sealed. In accordance with the teachings, the auxiliary package can be isolated from the printing system package, for example, by sealing in a sealable manner to allow access to the opening between the printing system package and the auxiliary package.

將輔助包體與列印系統包體隔離可允許與列印頭總成之各 種組件之管理有關的各種程序在列印製程受最少中斷或無中斷情況下進行。列印系統可包括列印頭管理系統之各種實施例,該列印頭管理系統可用於進行與列印頭總成相關聯之各種量測及維護程序。列印頭管理系統可包含若干子系統,該等子系統允許諸如以下者的此類量測任務:檢查噴嘴發射以及對來自列印頭中每一噴嘴之小滴體積、速度及軌跡之量測;及諸如以下者的維護任務:擦淨或吸乾噴嘴表面之過量油墨、藉由使油墨自油墨供應噴射穿過列印頭且進入廢料池中來引動及沖洗列印頭,及更換列印頭或列印頭裝置。 Separating the auxiliary package from the printing system package allows for each of the print head assemblies The various programs related to the management of the components are performed with minimal or no interruption in the printing process. The printing system can include various embodiments of a printhead management system that can be used to perform various measurement and maintenance procedures associated with the printhead assembly. The printhead management system can include subsystems that allow such measurement tasks, such as checking nozzle firing and measuring droplet volume, velocity, and trajectory from each nozzle in the printhead. And maintenance tasks such as wiping or sucking excess ink on the nozzle surface, priming and rinsing the print head by ejecting ink from the ink supply through the print head and into the waste pool, and replacing the print Head or print head unit.

因此,每一子系統皆可具有各種部件,該等部件本質上為可 消耗的,且需要更換,諸如更換吸墨紙、油墨及廢料儲器。各種可消耗部件可經封裝以準備例如以完全自動模式使用處置器進行插入。作為非限制性實例,吸墨紙可封裝於匣筒格式中,該匣筒格式可易於插入吸墨模組中供使用。舉另一非限制性實例而言,油墨可封裝於可更換儲器及匣筒格式中以用於在列印系統中。廢料儲器之各種實施例可封裝於匣筒格式中,該匣筒格式可易於插入沖洗池模組中供使用。另外,經受持續不斷使用之列印系統之各種組件的部件可需要週期性更換。例如,每一列印頭總成可包括介於約1個至約60個之間的列印頭裝置,其中每一列印頭裝置可在每一列印頭裝置中具有介於約1個至約30個之間的列印頭。因而,本教示內容之列印系統之各種實施例可具有介於約1個至約1800個之間的列印頭。在列印製程期間,可需要列印頭總成之權宜管理,例如但不限於列印頭裝置或列印頭之交換。列印頭更換模組可具有諸多部件,諸如列印頭裝置或列印頭,該等部件可易於插入列印頭總成中供使用。用於檢查噴嘴發射以及 基於來自每一噴嘴之小滴體積、速度及軌跡之光學偵測進行量測的量測系統可具有在使用之後可需要週期性更換的來源及偵測器。各種高使用率部件可經封裝以用於準備例如以完全自動模式使用處置器進行插入。就該方面而言,與列印系統之持續不斷管理有關之各種製程步驟可在輔助包體中執行,該輔助包體可與列印系統包體分離。可進行與列印頭管理程序相關聯之所有步驟以消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。 Therefore, each subsystem can have various components that are essentially Consumed and need to be replaced, such as replacement of blotting paper, ink and waste storage. The various consumable parts can be packaged to prepare for insertion using the handler, for example, in a fully automated mode. As a non-limiting example, the blotter paper can be packaged in a cartridge format that can be easily inserted into an ink absorbing module for use. By way of another non-limiting example, the ink can be packaged in a replaceable reservoir and cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into a rinse tank module for use. In addition, components that are subject to the various components of the continuously used printing system may require periodic replacement. For example, each printhead assembly can include between about 1 and about 60 printhead devices, wherein each printhead device can have between about 1 and about 30 in each printhead device. The print head between the two. Thus, various embodiments of the printing system of the present teachings can have between about 1 and about 1800 printheads. During the printing process, expediency management of the printhead assembly may be required, such as, but not limited to, the exchange of printhead devices or printheads. The printhead replacement module can have many components, such as a printhead device or a printhead, which can be easily inserted into the printhead assembly for use. Used to check nozzle emissions and A measurement system that measures based on optical detection of droplet volume, velocity, and trajectory from each nozzle can have a source and detector that can be periodically replaced after use. Various high usage components can be packaged for preparation for insertion using a handler, for example, in a fully automated mode. In this regard, various process steps associated with the ongoing management of the printing system can be performed in an auxiliary package that can be separated from the printing system package. All steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process.

此外,鑒於輔助包體之相對小的體積,輔助包體之恢復可比 整體列印系統包體之恢復耗費顯著較少的時間。對於本教示內容之系統及方法之各種實施例而言,輔助包體可小於或等於氣體包體系統之包體體積之約1%。在本教示內容之系統及方法之各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積之約2%。對於本教示內容之系統及方法之各種實施例而言,輔助包體可小於或等於氣體包體系統之包體體積之約5%。 在本教示內容之系統及方法之各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積之約10%。在本教示內容之系統及方法之各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積之約20%。 In addition, in view of the relatively small volume of the auxiliary package, the recovery of the auxiliary package is comparable The recovery of the overall printing system package takes significantly less time. For various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 1% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 2% of the volume of the inclusion body of the gas inclusion system. For various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 5% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 10% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 20% of the volume of the inclusion body of the gas inclusion system.

包括由列印系統包體界定之第一體積及由輔助包體界定之 第二體積的氣體包體系統之各種實施例可包括對諸如照明、氣體循環及過濾、氣體純化之各種環境參數之環境控制,及對氣體包體系統中維持的環境之熱控制。氣體包體系統之各種實施例可具有用於界定第一體積之列印 系統包體及界定第二體積之輔助包體兩者的一致受控環境。用於氣體包體系統之此種一致受控環境可提供例如惰性氣體環境及大體上無粒子環境,以用於需要此環境之諸多製程。或者,氣體包體系統之各種實施例可提供氣體包體系統之列印系統包體中的受控環境,該受控環境可維持在不同於針對輔助包體所維持的受控環境之條件下。 Including the first volume defined by the printing system package and defined by the auxiliary package Various embodiments of the second volume of gas inclusion system can include environmental control of various environmental parameters such as illumination, gas circulation and filtration, gas purification, and thermal control of the environment maintained in the gas inclusion system. Various embodiments of the gas inclusion system can have a print for defining the first volume A consistent controlled environment of both the system enclosure and the secondary enclosure defining the second volume. Such a consistent controlled environment for a gas inclusion system can provide, for example, an inert gas environment and a substantially particle free environment for many processes requiring this environment. Alternatively, various embodiments of the gas inclusion system can provide a controlled environment in the printing system package of the gas inclusion system that can be maintained under conditions other than the controlled environment maintained for the auxiliary package. .

如先前所提及,氣體包體之各種實施例可具有允許進入列印 系統包體與輔助包體之間的可密封開口或通道,以及允許進入輔助包體與氣體包體外部之間的開口。因此,可使輔助包體之各種實施例與氣體包體系統之列印系統包體隔離,以使得每一體積為獨立起作用之區段。此外,當列印系統包體與輔助包體隔離時,輔助包體與氣體包體外部之間的開口可對周圍或非惰性空氣開放而不污染列印系統包體。 As mentioned previously, various embodiments of gas inclusions may have access to print A sealable opening or passage between the system enclosure and the auxiliary enclosure, and an opening that allows access between the auxiliary enclosure and the exterior of the gas enclosure. Thus, various embodiments of the auxiliary package can be isolated from the printing system package of the gas enclosure system such that each volume is a separate active segment. In addition, when the printing system package is isolated from the auxiliary package, the opening between the auxiliary package and the exterior of the gas enclosure can be open to ambient or non-inert air without contaminating the printing system package.

對於氣體包體系統之各種實施例而言,可密封開口或通道可 包括(舉非限制性實例而言)包體面板開口或通道、門或窗。根據本教示內容之系統及方法,可密封開口或通道可允許進入兩個體積或隔室之間,諸如進入兩個包體之間或一包體與一氣體包體之外部環境之間。根據本教示內容,當以可密封方式封閉可密封開口時,可產生至少一個體積或隔室之隔離。例如,在本教示內容之各種實施例中,可藉由使用結構閉合件以可密封方式封閉允許進入列印系統包體與輔助包體之間的開口或通道來將列印系統包體與輔助包體隔離。類似地,可藉由使用結構閉合件以可密封方式封閉允許進入輔助包體與輔助包體外部環境之間的開口或通道來將輔助包體與氣體包體總成外部隔離。如隨後將更詳細地論述,結構閉合件可包括用於開口或通道之各種可密封覆蓋物;此種開口或通道包括包體面板開口 或通道、門或窗之非限制性實例。根據本教示內容之系統及方法,閘可為可用來使用氣動致動、液壓致動、電氣致動或手動致動來可逆地覆蓋或以可密封方式可逆地封閉任何開口或通道的任何結構閉合件。 For various embodiments of the gas inclusion system, the sealable opening or passage can be sealed Includes, by way of non-limiting example, a panel opening or channel, door or window. In accordance with the teachings and methods of the present teachings, a sealable opening or passageway can be allowed to enter between two volumes or compartments, such as between two enclosures or between an enclosure and an external environment of a gas enclosure. According to the present teachings, at least one volume or compartment isolation can be created when the sealable opening is sealed in a sealable manner. For example, in various embodiments of the present teachings, the printing system package and auxiliary can be sealed by sealing the opening or passage between the printing system package and the auxiliary package in a sealable manner by using a structural closure. Encapsulation isolation. Similarly, the auxiliary package can be externally isolated from the gas enclosure assembly by sealing the opening or passage between the auxiliary package and the external environment of the auxiliary package in a sealable manner using a structural closure. As will be discussed in more detail later, the structural closure can include various sealable covers for openings or passages; such openings or channels include an enclosure panel opening Or a non-limiting example of a channel, door or window. In accordance with the teachings and methods of the present teachings, the brake can be any structural closure that can be used to reversibly cover or reversibly seal any opening or passage in a sealable manner using pneumatic actuation, hydraulic actuation, electrical actuation, or manual actuation. Pieces.

此外,動態閉合件之使用可有效地以可密封方式封閉開口或 通道,且藉此有效地防止包體受諸如氧、水蒸氣之反應性氣體及有機蒸氣的污染。例如,在本教示內容之各種實施例中,可藉由使用動態閉合件有效地以可密封方式封閉允許進入列印系統包體與輔助包體之間的開口或通道來將列印系統包體與輔助包體隔離。類似地,可藉由使用動態閉合件有效地以可密封方式封閉允許進入輔助包體與輔助包體外部環境之間的開口或通道來將輔助包體與氣體包體總成外部隔離。根據本教示內容,動態閉合件可包括在各容積或隔室之間使用、例如在列印系統包體與輔助包體之間或輔助包體與氣體包體系統外部之間的開口或通道處使用之壓力差或氣簾。舉非限制性實例而言,可藉由在列印系統包體與輔助包體之間的開口或通道處使用壓力差來防止非惰性氣體反擴散至列印系統包體中而將列印系統包體與輔助包體動態地隔離。類似地,可藉由在輔助包體與氣體包體外部之間的開口或通道處使用壓力差來防止非惰性氣體反擴散至輔助包體中而將輔助包體與氣體包體外部動態地隔離。舉另一非限制性實例而言,可使用氣簾來將列印系統包體與輔助包體動態地隔離,該氣簾可有效地充當列印系統包體與輔助包體之間的擴散障壁。類似地,可使用氣簾來將輔助包體與氣體包體外部動態地隔離,該氣簾可有效地充當輔助包體與氣體包體外部之間的擴散障壁。 In addition, the use of dynamic closures effectively seals the opening in a sealable manner or The passage, and thereby effectively preventing the inclusion body from being contaminated by reactive gases such as oxygen, water vapor, and organic vapor. For example, in various embodiments of the present teachings, the printing system enclosure can be effectively sealed in a sealable manner by using a dynamic closure to allow access to the opening or passage between the printing system enclosure and the auxiliary package. Isolated from the auxiliary package. Similarly, the auxiliary enclosure can be externally isolated from the gas enclosure assembly by effectively closing the opening or passage between the auxiliary enclosure and the external environment of the auxiliary enclosure in a sealable manner using a dynamic closure. According to the present teachings, the dynamic closure can be used between the various volumes or compartments, such as between the printing system package and the auxiliary package or between the auxiliary package and the exterior of the gas enclosure system. Use the pressure difference or air curtain. By way of non-limiting example, the printing system can be prevented by using a pressure differential at the opening or channel between the printing system package and the auxiliary package to prevent non-inert gas from being diffused into the printing system package. The package is dynamically isolated from the auxiliary package. Similarly, the auxiliary enclosure can be dynamically isolated from the exterior of the gas enclosure by using a pressure differential at the opening or passage between the auxiliary enclosure and the exterior of the gas enclosure to prevent non-inert gas from diffusing back into the auxiliary enclosure. . As another non-limiting example, an air curtain can be used to dynamically isolate the printing system enclosure from the auxiliary enclosure, which can effectively act as a diffusion barrier between the printing system enclosure and the auxiliary enclosure. Similarly, an air curtain can be used to dynamically isolate the auxiliary enclosure from the exterior of the gas enclosure, which can effectively act as a diffusion barrier between the auxiliary enclosure and the exterior of the gas enclosure.

對於氣體包體系統之各種實施例而言,可使用動態閉合件及 結構閉合件之各種實施例的組合來以可密封方式封閉開口或通道。舉非限制性實例而言,可在允許進入列印系統包體與輔助包體之間的開口或通道之間,使用可密封覆蓋物與諸如壓力差或氣簾之動態閉合件組合來將列印系統包體與輔助包體隔離。類似地,可在允許進入輔助包體與氣體包體外部之間的開口或通道之間,使用可密封覆蓋物與諸如壓力差或氣簾之動態閉合件組合來將輔助包體與氣體包體外部隔離。舉另一非限制性實例而言,可在允許進入列印系統包體與輔助包體之間的開口或通道之間使用可密封覆蓋物來將列印系統包體與輔助包體隔離,而可在允許進入輔助包體與氣體包體外部之間的開口或通道之間使用諸如壓力差或氣簾之動態閉合件來將輔助包體與氣體包體外部隔離。 For various embodiments of gas inclusion systems, dynamic closures can be used and Combinations of various embodiments of structural closures seal the opening or passage in a sealable manner. By way of non-limiting example, a printable cover may be used in combination with a dynamic closure such as a pressure differential or air curtain between an opening or passage that allows access between the printing system package and the auxiliary package. The system package is isolated from the auxiliary package. Similarly, between the opening or the passage between the auxiliary enclosure and the exterior of the gas enclosure, a sealable covering can be used in combination with a dynamic closure such as a pressure differential or a curtain to enclose the auxiliary enclosure and the gas enclosure exterior. isolation. By way of another non-limiting example, a sealable cover can be used to isolate the printing system enclosure from the auxiliary enclosure between openings or passages that allow access between the printing system enclosure and the auxiliary enclosure. A dynamic closure such as a pressure differential or air curtain may be used to isolate the auxiliary enclosure from the exterior of the gas enclosure between openings or passages that allow access between the auxiliary enclosure and the exterior of the gas enclosure.

根據本教示內容之各種實施例,氣體包體可具有可為各種外 殼之輔助包體。輔助包體之各種實施例可構造為氣體包體總成中用以容納列印系統之區段。輔助包體之各種實施例可為例如但不限於可調式受控環境包體、轉移腔室以及負載鎖定腔室。諸如可調式受控環境包體、轉移腔室以及負載鎖定腔室之輔助包體的各種實施例可容易地自一位置移動至另一位置。在各種實施例中,輔助包體可界定可維持為惰性環境之第二體積。 對於本教示內容之氣體包體系統的實施例而言,用以容納界定第一體積之列印系統的氣體包體總成可具有一氣體體積,該氣體體積可維持在100ppm下或更低,例如在10ppm下或更低、在1.0ppm下或更低、或在0.1ppm下或更低,以用於各種反應性物種中的每一物種,包括諸如水蒸氣及氧之各種反應性大氣氣體以及有機溶劑蒸氣。另外,本教示內容之氣體包體系統、界定第二體積之輔助包體可具有一氣體體積,該氣體體積可維持在100ppm 下或更低,例如在10ppm下或更低、在1.0ppm下或更低、或在0.1ppm下或更低,以用於各種反應性物種中的每一物種,包括諸如水蒸氣及氧之各種反應性大氣氣體以及有機溶劑蒸氣。此外,氣體包體系統之各種實施例可提供低粒子列印環境,其滿足國際標準組織標準(ISO)14644-1:1999之標準,「潔淨室及相關聯受控環境-第1部分:空氣潔淨度的分類(Cleanrooms and associated controlled environments-Part 1:Classification of air cleanliness)」,如第1類至第5類所指定。 According to various embodiments of the present teachings, the gas enclosure may have various externalities The auxiliary body of the shell. Various embodiments of the auxiliary package can be constructed as sections of the gas enclosure assembly for receiving the printing system. Various embodiments of the auxiliary package can be, for example, but not limited to, an adjustable controlled environmental enclosure, a transfer chamber, and a load lock chamber. Various embodiments of an auxiliary package such as an adjustable controlled environment enclosure, a transfer chamber, and a load lock chamber can be easily moved from one location to another. In various embodiments, the auxiliary enclosure can define a second volume that can be maintained in an inert environment. For embodiments of the gas inclusion system of the present teachings, the gas inclusion assembly for receiving a printing system defining a first volume can have a gas volume that can be maintained at 100 ppm or less. For example, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower, for each of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen. And organic solvent vapor. Additionally, the gas inclusion system of the present teachings, the auxiliary package defining the second volume, can have a gas volume that can be maintained at 100 ppm. Lower or lower, for example at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower, for each species in various reactive species, including such as water vapor and oxygen Various reactive atmospheric gases as well as organic solvent vapors. In addition, various embodiments of the gas inclusion system provide a low particle printing environment that meets the International Standards Organization Standard (ISO) 14644-1:1999 standard, "Clean rooms and associated controlled environments - Part 1: Air Cleanrooms and associated controlled environments-Part 1: Classification of air cleanliness, as specified in categories 1 to 5.

如先前所提及,在大於第5.5代基板之基板上的OLED顯示器之製造存在顯著的工程挑戰,第5.5代基板具有約130cm×150cm之尺寸。對於藉由非OLED列印製造的平板顯示器而言,自約20世紀90年代初期起,各代母玻璃基板大小已經歷演化。指定為第1代之第一代母玻璃基板為約30cm×40cm,且因此可生產15"面板。在約20世紀90年代中期,用以生產平板顯示器之現存技術已演化至第3.5代母玻璃基板大小,其具有約60cm×72cm之尺寸。 As mentioned previously, there are significant engineering challenges in the fabrication of OLED displays on substrates larger than the 5.5th generation substrate, which has a size of about 130 cm x 150 cm. For flat panel displays manufactured by non-OLED printing, the size of each generation of mother glass substrates has evolved since the early 1990s. The first generation of the mother glass substrate designated as the first generation is about 30 cm x 40 cm, and thus a 15" panel can be produced. In the mid-1990s, the existing technology for producing flat panel displays has evolved to the 3.5th generation mother glass. The substrate size has a size of about 60 cm x 72 cm.

隨著各代已進步,第7.5代及第8.5代之母玻璃大小係用於非OLED列印製造製程之生產中。第7.5代母玻璃具有約195cm×225cm之尺寸,且可切割成每一基板八個42"平板或六個47"平板。第8.5代中所使用之母玻璃為大致220cm×250cm,且可切割成每一基板六個55"平板或八個46"平板。已瞭解OLED平板顯示器對諸如較真實色彩、較高對比度、薄度、可撓性、透明度以及能量效率之品質的應用前景,同時OLED製造實際上限於第3.5代及更小。當前,咸信OLED列印為最佳製造技術,其打破此限制且使OLED面板製造不僅適於第3.5代及更小的母玻璃大小,而且適於諸 如第5.5代、第7.5代以及第8.5代之最大母玻璃大小。OLED面板列印的特徵之一包括可使用各種基板材料,例如但不限於各種玻璃基板材料以及各種聚合物基板材料。就該方面而言,由玻璃基基板之使用所產生的術語所闡述的大小可適於具有適用於OLED列印之任何材料的基板。 As generations have progressed, the 7.5th and 8.5th generation mother glass sizes are used in the production of non-OLED printing manufacturing processes. The 7.5th generation mother glass has a size of about 195 cm x 225 cm and can be cut into eight 42" plates or six 47" plates per substrate. The mother glass used in the 8.5th generation is approximately 220 cm x 250 cm and can be cut into six 55" plates or eight 46" plates per substrate. The prospects for OLED flat panel displays for qualities such as more realistic colors, higher contrast, thinness, flexibility, transparency, and energy efficiency are known, while OLED manufacturing is actually limited to 3.5th generation and smaller. At present, Xianxin OLED printing is the best manufacturing technology, which breaks this limitation and makes OLED panel manufacturing not only suitable for the 3.5th generation and smaller mother glass size, but also suitable for The maximum mother glass size of the 5.5th, 7.5th, and 8.5th generations. One of the features of OLED panel printing includes the use of various substrate materials such as, but not limited to, various glass substrate materials and various polymeric substrate materials. In this regard, the terms set forth in the terms produced by the use of glass-based substrates can be adapted to substrates having any material suitable for OLED printing.

應涵蓋的是,廣泛多種之油墨調配物可在本教示內容之氣體 包體系統之各種實施例的惰性、大體上無粒子環境內列印。除用以列印OLED基板之發射層(EL)的各種油墨調配物之外,各種油墨調配物可包括包含適用於形成OLED裝置之電洞輸送層(HTL)、電洞注入層(HIL)、電子輸送層(ETL)以及電子注入層(EIL)中至少一者的一或多種組分的油墨。 It should be covered that a wide variety of ink formulations can be used in the gas of the present teachings. The various embodiments of the inclusion system are printed in an inert, substantially particle-free environment. In addition to various ink formulations for printing an emissive layer (EL) of an OLED substrate, various ink formulations can include a hole transport layer (HTL), a hole injection layer (HIL), suitable for forming an OLED device, An ink of one or more components of at least one of an electron transport layer (ETL) and an electron injection layer (EIL).

應進一步涵蓋的是,可使用噴墨列印將有機封裝層列印在 OLED面板上。應涵蓋的是,可使用噴墨列印來列印有機封裝層,因為噴墨列印可提供若干優點。首先,可消除一系列真空處理操作,因為此種基於噴墨之製造可在大氣壓力下執行。另外,在噴墨列印製程期間,可將有機封裝層定位來覆蓋OLED基板中於活性區域上或鄰近活性區域之部分,以便有效地封裝活性區域,包括該活性區域之側向邊緣。使用噴墨列印之靶向圖案化致使消除材料浪費,以及消除用以達成有機層之圖案化通常所需的額外處理。封裝油墨可包含可使用熱處理(例如烘焙)、UV曝光及其組合來固化的聚合物,該聚合物包括例如但不限於丙烯酸酯、甲基丙烯酸酯、胺基甲酸乙酯或其他材料,以及其共聚物及混合物。 It should be further covered that the organic encapsulation layer can be printed on by inkjet printing. On the OLED panel. It should be noted that ink jet printing can be used to print organic encapsulation layers because ink jet printing can provide several advantages. First, a series of vacuum processing operations can be eliminated because such inkjet based fabrication can be performed at atmospheric pressure. Additionally, during the inkjet printing process, the organic encapsulation layer can be positioned to cover portions of the OLED substrate on or adjacent to the active regions to effectively encapsulate the active regions, including the lateral edges of the active regions. The use of targeted patterning by inkjet printing results in the elimination of material waste and the elimination of the additional processing typically required to achieve patterning of the organic layer. The encapsulating ink can comprise a polymer that can be cured using heat treatment (eg, baking), UV exposure, and combinations thereof, including, but not limited to, acrylates, methacrylates, urethanes, or other materials, and Copolymers and mixtures.

關於OLED列印,根據本教示內容,已發現維持反應性物種 之大體上低含量係與提供滿足必要壽命規範之OLED平板顯示器關聯,該 等反應性物種例如但不限於諸如氧及水蒸氣之大氣成分以及OLED油墨中所使用之各種有機溶劑蒸氣。壽命規範對於OLED面板技術而言特別重要,因為此與顯示器產品長壽性直接關聯;該產品長壽性為用於所有面板技術之產品規範,其為當前OLED面板技術將要面臨之挑戰。為提供滿足必要壽命規範之面板,對本教示內容之氣體包體系統的各實施例而言,諸如水蒸氣、氧之反應性物種以及有機溶劑蒸氣中每一者的含量可維持在100ppm下或更低,例如在10ppm下或更低、在1.0ppm下或更低、或在0.1ppm下或更低。另外,OLED列印需要大體上無粒子環境。維持用於OLED列印之大體上無粒子環境特別重要,因為即使極小粒子亦可導致OLED面板上之可見缺陷。維持整體封閉系統中之大體上無粒子環境提供額外挑戰,該等額外挑戰對於可在諸如在露天、高流動性層流過濾罩下之大氣條件中進行的製程而言因粒子減少而並不存在。因此,維持針對大型設施中之惰性、無粒子環境的必要規範可存在各種挑戰。 Regarding OLED printing, according to the teachings, it has been found that maintaining reactive species The substantially low content is associated with providing an OLED flat panel display that meets the necessary life specifications, The reactive species such as, but not limited to, atmospheric constituents such as oxygen and water vapor, and various organic solvent vapors used in OLED inks. The life specification is particularly important for OLED panel technology because it is directly related to the longevity of the display product; the longevity of the product is a product specification for all panel technologies, which is a challenge for current OLED panel technology. To provide a panel that meets the necessary life specifications, for each embodiment of the gas inclusion system of the present teachings, each of the reactive species such as water vapor, oxygen, and organic solvent vapor may be maintained at 100 ppm or more. Low, for example at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower. In addition, OLED printing requires a substantially particle free environment. Maintaining a substantially particle-free environment for OLED printing is particularly important because even very small particles can cause visible defects on the OLED panel. Maintaining a substantially particle-free environment in an overall closed system provides additional challenges that do not exist due to particle reduction for processes that can be performed in atmospheric conditions such as under open air, high flow laminar flow filters . Therefore, there are various challenges in maintaining the necessary specifications for an inert, particle-free environment in large facilities.

在審查表1中所概述之資訊時,對於在一設施中列印OLED 面板的需要可得以說明,在該設施中諸如水蒸氣、氧之反應性物種以及有機溶劑蒸氣中每一者的含量可維持在100ppm下或更低,例如在10ppm下或更低、在1.0ppm下或更低、或在0.1ppmm下或更低。表1上所概述之資料係由對以大像素、旋塗裝置格式製造的每一附體試片(test coupon)之試驗產生,該附體試片包含針對紅、綠及藍中每一者的有機薄膜組合物。此類附體試片大體上更易於製造並測試,以達快速評估各種調配物及製程之目的。雖然附體試片試驗不應與列印面板之壽命試驗混淆,但是其可指示各種調配物及製程對壽命之影響。下表中所展示之結果表示附體試片製造 中製程步驟的變化,其中僅對在氮環境中所製造之附體試片改變轉塗環境,其中相較於在空氣中而非氮環境下以類似方式製造之附體試片而言,氮環境中的反應性物種小於1ppm。 Print OLEDs in a facility when reviewing the information outlined in Table 1. The need for a panel can be stated in which the content of each of the reactive species such as water vapor, oxygen, and organic solvent vapor can be maintained at or below 100 ppm, such as at 10 ppm or less at 1.0 ppm. Lower or lower, or at 0.1 ppmm or lower. The data summarized in Table 1 was generated from a test of each test coupon manufactured in a large pixel, spin coater format containing each of red, green and blue. Organic film composition. Such attached test strips are generally easier to manufacture and test for the purpose of quickly evaluating various formulations and processes. Although the attached test strip test should not be confused with the life test of the print panel, it can indicate the effect of various formulations and processes on the life. The results shown in the table below indicate the manufacture of the attached test piece. A variation of the process steps in which the transfer coating environment is changed only for the attached test piece produced in a nitrogen environment, wherein the nitrogen is compared to the attached test piece manufactured in a similar manner in air rather than nitrogen. The reactive species in the environment is less than 1 ppm.

經由檢查表1中之資料明顯的是,對於在不同處理環境下, 尤其在紅及藍狀況下所製造之附體試片而言,在有效減少有機薄膜組合物暴露於反應性物種之環境下進行列印可對各種EML之穩定性,及因此對壽命具有實質影響。 Obviously by checking the information in Table 1, for different processing environments, Particularly in the case of the attached test pieces produced under red and blue conditions, printing in an environment effective to reduce exposure of the organic film composition to reactive species can have a substantial effect on the stability of various EMLs, and thus on the life.

另外,如先前所論述,維持用於OLED列印之大體上無粒子 環境特別重要,因為即使極小粒子亦可導致OLED面板上之可見缺陷。當前,對生產OLED顯示器之設施的挑戰在於滿足商業化所需之低缺陷程度,以便維持諸如水蒸氣、氧之反應性物種以及有機溶劑蒸氣中每一者的低含量,以及維持充分的低粒子環境。另外,應涵蓋的是,氣體包體系統將具 有包括例如但不限於以下的屬性:氣體包體總成可容易定標以提供用於OLED列印系統之最佳化工作體積,同時提供最小化的惰性氣體體積,且另外提供在處理期間自外部對OLED列印系統之就緒進入(ready access),同時提供對內部之進入而達成以最小停機時間進行的維護。就該方面而言,根據本教示內容之各種實施例,提供用於需要惰性環境之各種空氣敏感製程的氣體包體總成,該氣體包體總成可包括可密封在一起的複數個壁框架構件及頂板框架構件。在一些實施例中,可使用例如螺栓及螺紋孔之可再用緊固件將複數個壁框架構件及頂板框架構件緊固在一起。對於根據本教示內容之氣體包體總成的各種實施例而言,可構造複數個框架構件來界定氣體包體框架總成,每一框架構件包含複數個面板框架區段。 Additionally, as discussed previously, substantially no particles are maintained for OLED printing The environment is particularly important because even very small particles can cause visible defects on the OLED panel. Currently, the challenge for facilities that produce OLED displays is to meet the low levels of defects required for commercialization in order to maintain low levels of each of the reactive species such as water vapor, oxygen, and organic solvent vapors, as well as to maintain adequate low particles. surroundings. In addition, it should be covered that the gas inclusion system will have There are attributes including, for example but not limited to, the gas inclusion assembly can be easily scaled to provide an optimized working volume for an OLED printing system while providing a minimum inert gas volume, and additionally provided during processing. External read-only access to the OLED printing system, while providing internal maintenance with minimal downtime. In this regard, in accordance with various embodiments of the present teachings, a gas inclusion assembly for various air-sensitive processes requiring an inert environment is provided, the gas inclusion assembly can include a plurality of wall frames sealable together Components and roof frame members. In some embodiments, a plurality of wall frame members and a top frame member can be fastened together using reusable fasteners such as bolts and threaded holes. For various embodiments of a gas enclosure assembly in accordance with the present teachings, a plurality of frame members can be configured to define a gas enclosure frame assembly, each frame member including a plurality of panel frame segments.

本教示內容之氣體包體總成可設計來以可使圍繞系統之包 體體積最小化的方式容納諸如OLED列印系統之列印系統。此種列印系統包體之各種實施例可以使列印系統包體之內部體積最小化且同時使適應各種OLED列印系統之各種覆蓋區的工作體積最佳化的方式來構造。例如,根據本教示內容之氣體包體系統之各種實施例的OLED列印系統可包含例如:花岡岩底座;可支撐OLED列印裝置之可移動橋接器;自加壓惰性氣體再循環系統之各種實施例延伸之一或多個裝置及設備,諸如基板浮動台、空氣軸承、軌道、導軌;用於將OLED膜形成材料沈積在基板上之噴墨印表機系統,其包括OLED油墨供應子系統及噴墨列印頭、一或多個機器人,及類似物。鑒於可包含OLED列印系統之各種組件,OLED列印系統之各種實施例可具有各種覆蓋區及形狀因子。如此構造之氣體包體總成的各種實施例另外提供在處理期間自外部對氣體包體總成內部之就緒進入, 以便容易進入列印系統以進行維護,同時使停機時間最小化。就該方面而言,根據本教示內容之氣體包體總成的各種實施例可相對於各種OLED列印系統之各種覆蓋區來成型。根據各種實施例,一旦已成型框架構件經構造來形成氣體包體框架總成,各種類型之面板即可以可密封方式安裝在構成框架構件之複數個面板區段中,以完成氣體包體總成之安裝。在氣體包體總成之各種實施例中,複數個框架構件可在一或多個位置處製造且隨後在另一位置處構造,該複數個框架構件包括例如但不限於複數個壁框架構件及至少一個頂板框架構件,以及用於安裝在面板框架區段中之複數個面板。此外,鑒於用以構造本教示內容之氣體包體總成之組件的可輸送性質,氣體包體總成之各種實施例可經由構造及解構的循環來重複地安裝並移除。 The gas inclusion assembly of the teachings can be designed to enclose a package around the system The manner in which the volume of the body is minimized accommodates a printing system such as an OLED printing system. Various embodiments of such a printing system package can minimize the internal volume of the printing system package while at the same time optimizing the working volume for various footprints of various OLED printing systems. For example, an OLED printing system in accordance with various embodiments of the gas inclusion system of the present teachings can include, for example, a granite base; a movable bridge that can support an OLED printing device; and various types of self-pressurizing inert gas recirculation systems. Embodiments extend one or more devices and apparatus, such as a substrate floating table, an air bearing, a track, a rail; an inkjet printer system for depositing an OLED film forming material on a substrate, including an OLED ink supply subsystem And ink jet print heads, one or more robots, and the like. Various embodiments of OLED printing systems can have various footprints and form factors in view of the various components that can include an OLED printing system. Various embodiments of the gas inclusion assembly thus constructed additionally provide ready access to the interior of the gas inclusion assembly from the outside during processing, This makes it easy to get into the printing system for maintenance while minimizing downtime. In this regard, various embodiments of gas inclusion assemblies in accordance with the present teachings can be formed with respect to various footprints of various OLED printing systems. According to various embodiments, once the formed frame members are configured to form a gas enclosure frame assembly, various types of panels may be sealably mounted in a plurality of panel sections constituting the frame members to complete the gas inclusion assembly. Installation. In various embodiments of the gas inclusion assembly, a plurality of frame members can be fabricated at one or more locations and then constructed at another location, including, but not limited to, a plurality of wall frame members and At least one roof frame member and a plurality of panels for mounting in the panel frame section. Moreover, in view of the transportable nature of the components of the gas enclosure assembly used to construct the present teachings, various embodiments of the gas enclosure assembly can be repeatedly installed and removed via a cycle of construction and deconstruction.

此外,可藉由使用用於可密封開口之結構閉合件來將輔助包 體之各種實施例與氣體包體系統之列印系統包體的工作體積隔離、與氣體包體外部隔離或與此二者同時隔離,該可密封開口可用以允許進入例如輔助包體與列印系統包體之間,或輔助包體與氣體包體外部之間。對於本教示內容之系統及方法的各種實施例而言,結構閉合件可包括用於開口或通道之各種可密封覆蓋物;此種開口或通道包括包體面板開口或通道、門或窗之非限制性實例。根據本教示內容之系統及方法,閘可為可用來使用氣動致動、液壓致動、電氣致動或手動致動來可逆地覆蓋或以可密封方式可逆地封閉任何開口或通道的任何結構閉合件。可藉由在氣體包體系統之工作體積與輔助包體之間的開口處或在輔助包體與氣體包體外部之間的開口處,使用諸如壓力差或氣簾之動態閉合件來將輔助包體之各種實施例與列 印系統包體之工作體積隔離、與氣體包體外部隔離或與此二者同時隔離。對於氣體包體系統之各種實施例而言,可使用結構閉合件及動態閉合件之各種實施例的組合來將輔助包體與列印系統包體之工作體積隔離、與氣體包體外部隔離或與此二者同時隔離。 In addition, the auxiliary package can be used by using a structural closure for the sealable opening Various embodiments of the body are isolated from the working volume of the printing system package of the gas enclosure system, isolated from the exterior of the gas enclosure, or both, which can be used to allow access to, for example, an auxiliary package and printing Between the system enclosures, or between the auxiliary enclosure and the exterior of the gas enclosure. For various embodiments of the systems and methods of the present teachings, the structural closure can include various sealable covers for openings or passages; such openings or passages include enclosure panel openings or passages, doors or windows. A restrictive example. In accordance with the teachings and methods of the present teachings, the brake can be any structural closure that can be used to reversibly cover or reversibly seal any opening or passage in a sealable manner using pneumatic actuation, hydraulic actuation, electrical actuation, or manual actuation. Pieces. The auxiliary package can be used by using a dynamic closure such as a pressure differential or an air curtain at the opening between the working volume of the gas enclosure system and the auxiliary package or at the opening between the auxiliary package and the exterior of the gas enclosure. Various embodiments and columns The working volume of the printing system package is isolated from the outside of the gas package or both. For various embodiments of the gas enclosure system, a combination of various embodiments of structural closures and dynamic closures can be used to isolate the auxiliary enclosure from the working volume of the printing system enclosure, from the exterior of the gas enclosure or Both are isolated at the same time.

對於本教示內容之系統及方法的各種實施例而言,輔助包體可小於或等於氣體包體系統之包體體積的約1%。在本教示內容之系統及方法的各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積的約2%。對於本教示內容之系統及方法的各種實施例而言,輔助包體可小於或等於氣體包體系統之包體體積的約5%。在本教示內容之系統及方法的各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積的約10%。在本教示內容之系統及方法的各種實施例中,輔助包體可小於或等於氣體包體系統之包體體積的約20%。因此,鑒於輔助包體之相對小的體積,輔助包體之恢復可比整體列印系統包體之恢復耗費顯著較少的時間。因此,利用輔助包體同時執行各種列印頭管理程序可使得氣體包體系統停機時間最小化或消除。 For various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 1% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 2% of the volume of the inclusion body of the gas inclusion system. For various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 5% of the volume of the inclusions of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 10% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the systems and methods of the present teachings, the auxiliary inclusions can be less than or equal to about 20% of the volume of the inclusion body of the gas inclusion system. Thus, in view of the relatively small volume of the auxiliary package, the recovery of the auxiliary package can be significantly less time consuming than the recovery of the overall printing system package. Thus, the simultaneous execution of various printhead management programs with the auxiliary package minimizes or eliminates gas package system downtime.

為確保氣體包體受密閉式密封,本教示內容之氣體包體總成的各種實施例提供將每一框架構件接合以便提供框架密封。可藉由使各種框架構件之間的交叉段緊密配合來充分地密封、例如密閉式密封內部,該等各種框架構件包括墊片或其他密封件。一旦完全構造,密封氣體包體總成可包含一內部及複數個內部轉角邊緣,至少一個內部轉角邊緣提供在每一框架構件與相鄰框架構件之交叉段處。框架構件之一或多者,例如至少一半的框架構件可包含沿其一或多個各別邊緣固定之一或多個可壓縮墊 片。一或多個可壓縮墊片可配置來在一旦複數個框架構件接合在一起且氣密面板獲安裝時,即建立密閉式密封之氣體包體總成。密封氣體包體總成可經形成具有由複數個可壓縮墊片密封的框架構件之轉角邊緣。對於每一框架構件,例如但不限於內壁框架表面、頂壁框架表面、垂直側壁框架表面、底壁框架表面及其組合而言,其可具備一或多個可壓縮墊片。 To ensure that the gas enclosure is hermetically sealed, various embodiments of the gas inclusion assembly of the present teachings provide for joining each frame member to provide a frame seal. The various frame members can include a gasket or other seal by adequately sealing, for example, a hermetic seal interior by mating the intersecting sections between the various frame members. Once fully constructed, the sealed gas inclusion assembly can include an inner and a plurality of inner corner edges, at least one inner corner edge being provided at the intersection of each frame member and an adjacent frame member. One or more of the frame members, such as at least half of the frame members, can include one or more compressible pads secured along one or more of its respective edges sheet. The one or more compressible gaskets can be configured to establish a hermetic sealed gas enclosure assembly once the plurality of frame members are joined together and the airtight panel is installed. The sealed gas inclusion body can be formed into a corner edge having a frame member sealed by a plurality of compressible gaskets. For each frame member, such as, but not limited to, an inner wall frame surface, a top wall frame surface, a vertical side wall frame surface, a bottom wall frame surface, and combinations thereof, it may be provided with one or more compressible gaskets.

對於氣體包體總成之各種實施例而言,每一框架構件可包含 複數個區段,該複數個區段經構架並製造來接收各種面板類型中的任何一者,該等面板類型可以可密封方式安裝在每一區段中以提供用於每一面板之氣密面板密封。在本教示內容之氣體包體總成的各種實施例中,每一區段框架可具有一區段框架墊片,該區段框架墊片與所選緊固件一起確保安裝在每一區段框架中之每一面板可提供用於每一面板且因此用於完全構造之氣體包體的氣密密封。在各種實施例中,氣體包體總成可具有處於每一壁面板中之窗面板或服務窗中之一或多者;其中每一窗面板或服務窗可具有至少一個手套套圈。在氣體包體總成之裝配期間,每一手套套圈可具有附接之手套,以便該手套可延伸至內部中。根據各種實施例,每一手套套圈可具有用以安裝手套之硬體,其中此種硬體利用圍繞每一手套套圈之墊片密封件,該等墊片密封件提供氣密密封來使經由手套套圈之洩漏或分子擴散最小化。對於本教示內容之氣體包體總成的各種實施例而言,硬體進一步經設計用以向終端使用者提供對手套套圈封蓋及去蓋之便利性。 For various embodiments of the gas inclusion assembly, each frame member can include a plurality of sections that are framed and fabricated to receive any of a variety of panel types that can be sealably mounted in each section to provide airtightness for each panel The panel is sealed. In various embodiments of the gas inclusion assembly of the present teachings, each segment frame can have a segment frame shim that, along with the selected fasteners, ensures installation in each segment frame Each of the panels can provide a hermetic seal for each panel and thus for a fully constructed gas enclosure. In various embodiments, the gas inclusion assembly can have one or more of a window panel or service window in each wall panel; wherein each window panel or service window can have at least one glove collar. Each glove collar may have an attached glove during assembly of the gas enclosure assembly so that the glove can extend into the interior. According to various embodiments, each glove collar may have a hardware for mounting the glove, wherein the hardware utilizes a gasket seal around each glove collar that provides a hermetic seal for passage through the glove Leakage or molecular diffusion of the ferrule is minimized. For various embodiments of the gas enclosure assembly of the present teachings, the hardware is further designed to provide the end user with the convenience of capping and uncovering the glove ferrule.

根據本教示內容之氣體包體系統的各種實施例可包括由複 數個框架構件及面板區段形成之氣體包體總成,以及氣體循環、過濾及純化組件。對於氣體包體系統之各種實施例而言,可在裝配製程期間安裝管 道系統。根據本教示內容之各種實施例,管道系統可安裝在已由複數個框架構件構造之氣體包體框架總成內。在各種實施例中,可在複數個框架構件接合來形成氣體包體框架總成之前將管道系統安裝在該等框架構件上。 用於氣體包體系統之各種實施例的管道系統可經配置以使得自一或多個管道系統入口吸入管道系統中之大體上所有氣體經由氣體循環及過濾迴路之各種實施例移動,以用於移除氣體包體系統內部之微粒物質。另外,氣體包體系統之各種實施例的管道系統可經配置以將氣體包體總成外部之氣體純化迴路的入口及出口與氣體包體總成內部之氣體循環及過濾迴路分離。 根據本教示內容之氣體包體系統的各種實施例,氣體循環及過濾系統可與例如但不限於粒子控制總成之組件流體連通。對於氣體包體總成之各種實施例而言,氣體循環及過濾系統可與電纜托盤總成排氣系統流體連通。對於氣體包體總成之各種實施例而言,氣體循環及過濾系統可與列印頭總成排氣系統流體連通。在氣體包體系統之各種實施例中,與氣體循環及過濾系統流體連通之粒子控制系統的各種組件可提供鄰近於定位在列印系統中之基板的低粒子區。 Various embodiments of gas inclusion systems in accordance with the teachings of the present teachings can include A gas inclusion assembly formed by a plurality of frame members and panel sections, and a gas circulation, filtration and purification assembly. For various embodiments of the gas inclusion system, the tube can be installed during the assembly process Road system. In accordance with various embodiments of the present teachings, the piping system can be mounted within a gas enclosure frame assembly that has been constructed from a plurality of frame members. In various embodiments, the piping system can be mounted on the frame members prior to joining the plurality of frame members to form the gas enclosure frame assembly. The piping system for various embodiments of the gas inclusion system can be configured to move substantially all of the gas from the one or more piping inlets into the piping system via various embodiments of the gas circulation and filtration circuits for Remove particulate matter inside the gas inclusion system. Additionally, the piping system of various embodiments of the gas inclusion system can be configured to separate the inlet and outlet of the gas purification circuit external to the gas inclusion assembly from the gas recycle and filtration circuits within the gas inclusion assembly. In accordance with various embodiments of the gas enclosure system of the present teachings, the gas circulation and filtration system can be in fluid communication with components such as, but not limited to, a particle control assembly. For various embodiments of the gas inclusion assembly, the gas circulation and filtration system can be in fluid communication with the cable tray assembly exhaust system. For various embodiments of the gas inclusion assembly, the gas circulation and filtration system can be in fluid communication with the printhead assembly exhaust system. In various embodiments of the gas inclusion system, various components of the particle control system in fluid communication with the gas circulation and filtration system can provide a low particle region adjacent to the substrate positioned in the printing system.

例如,氣體包體系統可具有在氣體包體總成內部之氣體循環 及過濾系統。此種內部過濾系統可具有處於該內部內之複數個風扇過濾器單元,且可經配置以在該內部內提供氣體之層流。層流可處於自內部頂部至內部底部之方向上或處於任何其他方向上。雖然由循環系統所產生之氣體流動不必為層流式,但是氣體層流可用以確保氣體在該內部中的徹底及完全翻轉。氣體層流亦可用以使紊流最小化,此種紊流為不合需要的,因為其可導致環境中之粒子聚集在此等紊流區域中,從而防止過濾系統將此 等粒子自環境移除。此外,為維持該內部中之所要溫度,可提供利用複數個熱交換器之熱調節系統,該熱調節系統例如與風扇或另一氣體循環裝置一起操作、與其相鄰或與其結合使用。氣體純化迴路可經配置來經由包體外部之至少一個氣體純化組件使來自氣體包體總成內部內之氣體循環。就該方面而言,氣體包體總成內部之循環及過濾系統與氣體包體總成外部之氣體純化迴路結合可提供大體上低微粒惰性氣體之持續循環,該大體上低微粒惰性氣體在整個氣體包體系統中具有大體上低含量之反應性物種。 For example, a gas inclusion system can have a gas circulation inside the gas inclusion body assembly And filtration system. Such an internal filtration system can have a plurality of fan filter units within the interior and can be configured to provide a laminar flow of gas within the interior. The laminar flow can be in the direction from the inner top to the inner bottom or in any other direction. Although the gas flow generated by the circulatory system does not have to be laminar, the gas laminar flow can be used to ensure complete and complete overturning of the gas in the interior. The laminar flow of gas can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in such turbulent regions, thereby preventing the filtration system from The particles are removed from the environment. Moreover, to maintain the desired temperature in the interior, a thermal conditioning system utilizing a plurality of heat exchangers can be provided, for example, operating with, adjacent to or in conjunction with a fan or another gas circulation device. The gas purification loop can be configured to circulate gas from within the interior of the gas enclosure assembly via at least one gas purification component external to the enclosure. In this regard, the internal circulation and filtration system of the gas inclusion assembly, in combination with the gas purification circuit external to the gas inclusion assembly, provides a continuous circulation of substantially low particulate inert gas throughout the entire process. There are substantially low levels of reactive species in the gas inclusion system.

氣體包體系統之各種實施例可經配置以維持極低含量之非 所要組分,例如有機溶劑及其蒸氣以及水、水蒸氣、氧及類似物,該氣體包體系統包括氣體包體總成,該氣體包體總成具有界定第一體積之氣體包體及界定具有氣體純化系統之第二體積之輔助包體。回顧而言,輔助包體之各種實施例可容易與環境調節系統組件整合,該等環境調節系統組件諸如氣體包體系統之照明組件、氣體循環及過濾組件、氣體純化組件以及恆溫組件。因此,包括輔助包體之氣體包體系統的各種實施例可具有用於界定第一體積之氣體包體及界定第二體積之輔助包體的一致受控環境。此種受控環境可提供例如用於需要此種環境之製程的惰性、熱受控且大體上無粒子環境。在本教示內容之氣體包體系統的各種實施例中,受控環境可提供例如用於需要此種環境之製程的熱受控且大體上無粒子環境。 Various embodiments of gas inclusion systems can be configured to maintain very low levels of non- a desired component, such as an organic solvent and its vapor, and water, water vapor, oxygen, and the like, the gas inclusion system including a gas inclusion body having a gas inclusion body defining a first volume and defining A secondary envelope having a second volume of the gas purification system. In retrospect, various embodiments of the auxiliary package can be easily integrated with environmental conditioning system components such as lighting assemblies for gas enclosure systems, gas circulation and filtration assemblies, gas purification assemblies, and thermostatic assemblies. Accordingly, various embodiments of a gas inclusion system including an auxiliary enclosure may have a consistent controlled environment for defining a first volume of gas inclusions and an auxiliary enclosure defining a second volume. Such a controlled environment can provide, for example, an inert, thermally controlled, and substantially particle free environment for processes requiring such an environment. In various embodiments of the gas inclusion system of the present teachings, the controlled environment can provide, for example, a thermally controlled and substantially particle free environment for processes requiring such an environment.

此外,包括輔助包體之氣體包體系統的各種實施例可提供氣 體包體系統之工作部分中的受控環境,該受控環境可維持在不同於針對輔助包體所維持的受控環境之條件下。因此,可使輔助包體之各種實施例與氣體包體系統之工作體積隔離,以便每一體積為獨立起作用之區段。對於 氣體包體系統之各種實施例而言,可使用用於開口的結構閉合件來將輔助包體與氣體包體系統之工作體積隔離,該開口諸如包體面板開口或通道、門或窗。對於本教示內容之系統及方法的各種實施例而言,結構閉合件可包括用於開口或通道之各種可密封覆蓋物;此種開口或通道包括包體面板開口或通道、門或窗之非限制性實例。根據本教示內容之系統及方法,閘可為可用來使用氣動致動、液壓致動、電氣致動或手動致動來可逆地覆蓋或以可密封方式可逆地封閉任何開口或通道的任何結構閉合件。可在氣體包體系統之工作體積與輔助包體之間使用諸如壓力差或氣簾之動態閉合件,以及動態閉合件及結構閉合件之各種實施例的組合來將輔助包體之各種實施例與氣體包體系統之工作體積隔離。另外,氣體包體之工作體積及輔助包體中之每一者可具有獨立受控環境,從而提供獨立調節例如但不限於溫度、照明、粒子控制以及氣體純化之能力。因此,可將用於輔助包體體積及氣體包體之工作體積的熱控制、照明控制、粒子控制以及惰性氣體環境控制之規範針對每一體積設定成相同或不同的。 In addition, various embodiments of a gas enclosure system including an auxiliary enclosure provide gas A controlled environment in the working portion of the body package system that can be maintained under conditions other than the controlled environment maintained for the auxiliary package. Thus, various embodiments of the auxiliary package can be isolated from the working volume of the gas enclosure system such that each volume is a separate active segment. for For various embodiments of the gas enclosure system, a structural closure for the opening can be used to isolate the auxiliary enclosure from the working volume of the gas enclosure system, such as an enclosure panel opening or passage, door or window. For various embodiments of the systems and methods of the present teachings, the structural closure can include various sealable covers for openings or passages; such openings or passages include enclosure panel openings or passages, doors or windows. A restrictive example. In accordance with the teachings and methods of the present teachings, the brake can be any structural closure that can be used to reversibly cover or reversibly seal any opening or passage in a sealable manner using pneumatic actuation, hydraulic actuation, electrical actuation, or manual actuation. Pieces. Various embodiments of the auxiliary package can be used with a combination of various embodiments of a dynamic closure and a structural closure between a working volume of the gas enclosure system and the auxiliary package, such as a pressure differential or a dynamic closure of the air curtain, and various embodiments of the dynamic closure and structural closure The working volume of the gas inclusion system is isolated. In addition, each of the working volume of the gas enclosure and the auxiliary package can have an independently controlled environment to provide independent adjustment of capabilities such as, but not limited to, temperature, illumination, particle control, and gas purification. Therefore, the specifications of the thermal control, the illumination control, the particle control, and the inert gas environment control for assisting the volume of the package and the working volume of the gas inclusion can be set to be the same or different for each volume.

除提供氣體循環、過濾以及純化組件之外,管道系統可經大 小設定且成形來在該管道系統中容納電線、導線束以及各種含流體管件中之至少一者,該電線、導線束以及各種含流體管件當捆束時可具有可觀的死體積,諸如水、水蒸氣、氧及類似物之大氣成分可捕集於該死體積中且難以藉由純化系統移除。另外,此等束為微粒物質之認定來源。在一些實施例中,電纜及光纜以及電線及導線束以及含流體管件之組合可大體上安置在管道系統內,且可分別與安置在內部內之光學系統、電氣系統、光學系統、機械系統以及流體系統中之至少一者操作地相關聯。因為氣體循環、 過濾以及純化組件可經配置以使得大體上所有循環惰性氣體經由管道系統吸入,所以可藉由使此等成束材料容納在管道系統內來有效地移除由此等束所產生之微粒以及捕集於各種成束材料之死體積中的大氣成分二者。 In addition to providing gas circulation, filtration, and purification components, the piping system can be large Smallly set and shaped to accommodate at least one of a wire, a bundle of wires, and various fluid containing tubular members in the piping system, the wire, bundle of wires, and various fluid containing tubular members having a substantial dead volume when bundled, such as water, The atmospheric constituents of water vapor, oxygen, and the like can be trapped in the dead volume and difficult to remove by the purification system. In addition, these bundles are the source of identification of particulate matter. In some embodiments, the cable and cable and the combination of the wire and bundle and the fluid containing tube can be disposed substantially within the piping system and can be separately associated with the optical system, electrical system, optical system, mechanical system, and At least one of the fluid systems is operatively associated. Because of gas circulation, The filtration and purification assembly can be configured such that substantially all of the circulating inert gas is drawn through the piping system, so that the particles produced by the bundle can be effectively removed by accommodating the bundled materials within the piping system and A collection of atmospheric constituents in the dead volume of various bundled materials.

本教示內容之系統及方法的各種實施例可包括具有第一體 積及第二體積之氣體包體以及氣體循環、過濾及純化組件的各種實施例,以及加壓惰性氣體再循環系統之另外的各種實施例。如隨後將更詳細地論述,可在用於各種氣動驅動裝置及設備之OLED列印系統的操作中利用此種加壓惰性氣體再循環系統。 Various embodiments of systems and methods of the present teachings can include having a first body Various embodiments of the second volume of gas inclusions and gas recycle, filtration and purification assemblies, as well as additional various embodiments of pressurized inert gas recycle systems. As will be discussed in more detail later, such pressurized inert gas recirculation systems can be utilized in the operation of OLED printing systems for various pneumatic drives and devices.

根據本教示內容,已解決若干工程挑戰以便在氣體包體系統中提供加壓惰性氣體再循環系統之各種實施例。首先,在無加壓惰性氣體再循環系統情況下氣體包體系統之典型操作下,可將氣體包體系統維持在相對於外部壓力之稍微正的內部壓力下,以便如若氣體包體系統中發生洩漏則防範外部氣體或空氣進入內部。例如,在典型操作下,對於本教示內容之氣體包體系統的各種實施例而言,可將氣體包體系統之內部維持在相對於包體系統外部之週遭氣氛的一壓力下,例如至少2mbarg之壓力、例如至少4mbarg之壓力、至少6mbarg之壓力、至少8mbarg之壓力或更高壓力。維持氣體包體系統內之加壓惰性氣體再循環系統可為有挑戰的,因為其要求關於維持氣體包體系統之稍微正的內部壓力,同時將加壓氣體引入氣體包體系統中之動態及持續不斷的平衡動作。此外,各種裝置及設備之可變需求可對本教示內容之各種氣體包體總成及系統產生不規則的壓力概況。在此類條件下維持保持在相對於外部環境之稍微正的壓力下的氣體包體系統之動態壓力平衡可提供持續不斷的OLED列印製程之整體性。 In accordance with the present teachings, several engineering challenges have been addressed to provide various embodiments of a pressurized inert gas recirculation system in a gas enclosure system. First, under typical operation of a gas inclusion system in the absence of a pressurized inert gas recirculation system, the gas inclusion system can be maintained at a slightly positive internal pressure relative to external pressure, such as occurs in a gas inclusion system. The leak prevents external gases or air from entering the interior. For example, under typical operation, for various embodiments of the gas enclosure system of the present teachings, the interior of the gas enclosure system can be maintained at a pressure relative to the ambient atmosphere outside the enclosure system, such as at least 2 mbarg. The pressure, for example a pressure of at least 4 mbarg, a pressure of at least 6 mbarg, a pressure of at least 8 mbarg or higher. Maintaining a pressurized inert gas recirculation system within a gas enclosure system can be challenging because it requires a slight positive internal pressure to maintain the gas inclusion system while introducing pressurized gas into the gas inclusion system. Continuous balancing action. In addition, the variable requirements of various devices and devices can create an irregular pressure profile for various gas inclusion assemblies and systems of the present teachings. Maintaining dynamic pressure balance of the gas enclosure system maintained under a slightly positive pressure relative to the external environment under such conditions can provide continuous OLED printing process integrity.

對於氣體包體系統之各種實施例而言,根據本教示內容之加 壓惰性氣體再循環系統可包括加壓惰性氣體迴路之各種實施例,該加惰性氣體迴路可利用壓縮機、累積器及鼓風機中之至少一者及其組合。包括加壓惰性氣體迴路之各種實施例的加壓惰性氣體再循環系統之各種實施例可具有特殊設計壓力受控旁路迴路,其可以穩定界定值來提供本教示內容之氣體包體系統中的惰性氣體之內部壓力。在氣體包體系統之各種實施例中,加壓惰性氣體再循環系統可經配置以當加壓惰性氣體迴路之累積器中的惰性氣體壓力超過預置閾值壓力時,經由壓力受控旁路迴路來使加壓惰性氣體再循環。閾值壓力可例如在介於約25psig至約200psig之範圍內,或更具體而言在介於約75psig至約125psig之範圍內,或更具體而言在介於約90psig至95psig之範圍內。就該方面而言,本教示內容之具有加壓惰性氣體再循環系統的氣體包體系統可維持在密閉式密封氣體包體中具有加壓惰性氣體再循環系統之平衡,該加壓惰性氣體再循環系統具有特殊設計壓力受控旁路迴路之各種實施例。 For various embodiments of the gas inclusion system, according to the teachings of this teaching The pressurized inert gas recirculation system can include various embodiments of a pressurized inert gas circuit that can utilize at least one of a compressor, an accumulator, and a blower, and combinations thereof. Various embodiments of pressurized inert gas recirculation systems including various embodiments of pressurized inert gas circuits may have specially designed pressure controlled bypass circuits that may stabilize the defined values to provide a gas inclusion system in the teachings of the present teachings. Internal pressure of the inert gas. In various embodiments of the gas inclusion system, the pressurized inert gas recirculation system can be configured to pass the pressure controlled bypass circuit when the inert gas pressure in the accumulator of the pressurized inert gas circuit exceeds a preset threshold pressure To recycle the pressurized inert gas. The threshold pressure can be, for example, in the range of from about 25 psig to about 200 psig, or more specifically in the range of from about 75 psig to about 125 psig, or, more specifically, in the range of from about 90 psig to 95 psig. In this regard, the present teachings have a gas inclusion system with a pressurized inert gas recirculation system that maintains a balance of a pressurized inert gas recirculation system in a hermetic sealed gas enclosure that The circulatory system has various embodiments of specially designed pressure controlled bypass circuits.

根據本教示內容,各種裝置及設備可安置在內部中且與具有 各種加壓惰性氣體迴路之加壓惰性氣體再循環系統之各種實施例流體連通,該等各種加壓惰性氣體迴路可利用各種加壓氣體源,諸如壓縮機、鼓風機中之至少一者及其組合。對於本教示內容之氣體包體及系統的各種實施例而言,使用各種氣動操作裝置及設備可提供低粒子產生效能且低維護率。可安置在氣體包體系統內部且與各種加壓惰性氣體迴路流體連通之示範性裝置及設備可包括例如但不限於氣動機器人、基板浮動台、空氣軸承、空氣襯套、壓縮氣體工具、氣動致動器中之一或多者及其組合。基板浮動 台以及空氣軸承可用於操作根據本教示內容之氣體包體系統之各種實施例的OLED列印系統之各種觀點。例如,利用空氣軸承技術之基板浮動台可用以將基板輸送至列印頭腔室中之位置中,且在OLED列印製程期間支撐基板。 According to the teachings, various devices and devices can be placed in the interior and have Various embodiments of pressurized inert gas recirculation systems of various pressurized inert gas circuits are in fluid communication, and the various pressurized inert gas circuits may utilize various pressurized gas sources, such as at least one of a compressor, a blower, and combinations thereof. . For various embodiments of the gas enclosures and systems of the present teachings, the use of various pneumatic operating devices and devices provides low particle generation performance with low maintenance. Exemplary devices and apparatus that can be disposed within the gas enclosure system and in fluid communication with various pressurized inert gas circuits can include, for example, but are not limited to, pneumatic robots, substrate floating tables, air bearings, air bushings, compressed gas tools, pneumatically induced One or more of the actuators and combinations thereof. Substrate floating The stage and air bearing can be used to operate various aspects of the OLED printing system of various embodiments of the gas enclosure system in accordance with the present teachings. For example, a substrate floating stage utilizing air bearing technology can be used to transport the substrate into a position in the printhead chamber and support the substrate during the OLED printing process.

將參考隨附圖式獲得本揭露內容之特徵及優點的較好理解,該等隨附圖式意欲例示而非限制本教示內容。 A better understanding of the features and advantages of the present disclosure will be obtained by reference to the accompanying drawings.

圖1為根據本教示內容之各種實施例的氣體包體系統的示意圖。 1 is a schematic illustration of a gas inclusion system in accordance with various embodiments of the present teachings.

圖2為根據本教示內容之各種實施例的氣體包體系統的左前部透視圖。 2 is a left front perspective view of a gas enclosure system in accordance with various embodiments of the present teachings.

圖3為根據本教示內容之各種實施例的氣體包體總成的右前部透視圖。 3 is a right front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖4描繪根據本教示內容之各種實施例的氣體包體總成的展開圖。 4 depicts an expanded view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖5為框架構件總成的展開前部透視圖,其描繪根據本教示內容之各種實施例的各種面板框架區段及區段面板。 5 is an expanded front perspective view of a frame member assembly depicting various panel frame sections and section panels in accordance with various embodiments of the present teachings.

圖6A、圖6B及圖6C為用於形成接頭之墊片密封件之各種實施例的頂部示意圖。 6A, 6B, and 6C are top schematic views of various embodiments of a gasket seal for forming a joint.

圖7A及圖7B為描繪根據本教示內容之氣體包體總成之各種實施例的框架構件之密封的各種透視圖。 7A and 7B are various perspective views depicting the sealing of frame members of various embodiments of a gas enclosure assembly in accordance with the present teachings.

圖8A及圖8B為與區段面板之密封有關的各種視圖,該區 段面板用於接收根據本教示內容之氣體包體總成的各種實施例的可易移除服務窗。 8A and 8B are various views related to the sealing of the segment panel, the region The segment panel is for receiving an easily removable service window of various embodiments of a gas enclosure assembly in accordance with the present teachings.

圖9A及圖9B為與區段面板之密封有關的放大透視截面圖,該區段面板用於接收根據本教示內容之各種實施例的嵌入面板或窗面板。 9A and 9B are enlarged perspective cross-sectional views of a seal of a segment panel for receiving an embedded panel or window panel in accordance with various embodiments of the present teachings.

圖10為用於根據本教示內容之氣體包體系統的各種實施例的包括照明系統之頂板的視圖。 10 is a view of a top panel including a lighting system for various embodiments of a gas enclosure system in accordance with the present teachings.

圖11為描繪用於根據本教示內容之氣體包體的各種實施例的照明系統之LED光譜的圖表。 11 is a chart depicting LED spectra of illumination systems for various embodiments of gas enclosures in accordance with the present teachings.

圖12為氣體包體總成之假想前部透視圖,其描繪安裝在根據本教示內容之各種實施例的氣體包體總成之內部中的管道系統(ductwork)。 12 is a phantom front perspective view of a gas inclusion assembly depicting a ductwork installed in the interior of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖13為氣體包體總成之假想頂部透視圖,其描繪安裝在根據本教示內容之各種實施例的氣體包體總成之內部中的管道系統。 13 is a hypothetical top perspective view of a gas inclusion assembly depicting a piping system installed in the interior of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖14為氣體包體總成之假想底部透視圖,其描繪安裝在根據本教示內容之各種實施例的氣體包體總成之內部中的管道系統。 14 is an imaginary bottom perspective view of a gas enclosure assembly depicting a piping system installed in the interior of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖15為根據本教示內容之各種實施例的氣體包體系統的示意圖。 15 is a schematic illustration of a gas enclosure system in accordance with various embodiments of the present teachings.

圖16為根據本教示內容之各種實施例的氣體包體系統的示意圖。 16 is a schematic illustration of a gas enclosure system in accordance with various embodiments of the present teachings.

圖17為根據本教示內容之各種實施例的氣體包體系統的示意圖。 17 is a schematic illustration of a gas enclosure system in accordance with various embodiments of the present teachings.

圖18為根據本教示內容之各種實施例的氣體包體系統的示意圖。 18 is a schematic illustration of a gas enclosure system in accordance with various embodiments of the present teachings.

圖19為根據本教示內容之各種實施例的氣體包體總成的前部透視圖。 19 is a front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖20A描繪如圖19中描繪之氣體包體總成之各種實施例及根據本教示內容之各種實施例的相關列印系統的展開圖。圖20B描繪圖20A中描繪之列印系統的放大iso透視圖。 20A depicts an expanded view of various embodiments of the gas inclusion assembly as depicted in FIG. 19 and related printing systems in accordance with various embodiments of the present teachings. Figure 20B depicts an enlarged iso perspective view of the printing system depicted in Figure 20A.

圖21描繪根據本教示內容之各種實施例的浮動台的透視圖。 21 depicts a perspective view of a floating stage in accordance with various embodiments of the present teachings.

圖22A為根據本教示內容之各種實施例的氣體包體系統的示意性橫截面圖。 22A is a schematic cross-sectional view of a gas enclosure system in accordance with various embodiments of the present teachings.

圖22B及圖22C為根據本教示內容之各種實施例的氣體包體系統之示意性橫截面圖,其描繪移動至用於維護之位置中的列印頭總成的連續移動。 22B and 22C are schematic cross-sectional views of a gas enclosure system depicting continuous movement of a printhead assembly in a position for maintenance, in accordance with various embodiments of the present teachings.

圖22D至圖22F為根據本教示內容之各種實施例的氣體包體系統的示意性橫截面圖。 22D-22F are schematic cross-sectional views of a gas enclosure system in accordance with various embodiments of the present teachings.

圖23描繪安裝在根據本教示內容之各種實施例的氣體包體總成之輔助包體中的維護站的透視圖。 23 depicts a perspective view of a maintenance station installed in an auxiliary package of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖24A及圖24B描繪根據本教示內容之系統及方法的各種實施例。 24A and 24B depict various embodiments of systems and methods in accordance with the present teachings.

圖25為根據本教示內容之各種實施例的氣體包體總成之輔助包體的透視圖。 25 is a perspective view of an auxiliary package of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖26A為根據本教示內容之系統及方法之各種實施例的OLED列印工具的前部透視圖。 26A is a front perspective view of an OLED printing tool in accordance with various embodiments of systems and methods of the present teachings.

圖26B為根據本教示內容之系統及方法之各種實施例的如圖26A中所示之OLED列印工具的第一假想透視圖。 26B is a first imaginary perspective view of the OLED printing tool shown in FIG. 26A in accordance with various embodiments of the systems and methods of the present teachings.

圖26C為根據本教示內容之系統及方法之各種實施例的如圖26A中所示之OLED列印工具的第二假想透視圖。 26C is a second imaginary perspective view of the OLED printing tool shown in FIG. 26A in accordance with various embodiments of the systems and methods of the present teachings.

圖27為根據本教示內容之列印系統之各種實施例的列印系統的iso透視圖。 27 is an iso perspective view of a printing system in accordance with various embodiments of the printing system in accordance with the present teachings.

圖28A為根據本教示內容之系統及方法之各種實施例的OLED列印工具的前部透視圖。 28A is a front perspective view of an OLED printing tool in accordance with various embodiments of systems and methods in accordance with the present teachings.

圖28B為根據本教示內容之系統及方法之各種實施例的如圖28A中描繪的OLED列印工具的示意性平面圖。 28B is a schematic plan view of the OLED printing tool depicted in FIG. 28A in accordance with various embodiments of the systems and methods of the present teachings.

圖28C為根據本教示內容的、根據與圖28A有關之系統及方法之各種實施例的OLED列印工具的示意性平面圖。 28C is a schematic plan view of an OLED printing tool in accordance with various embodiments of the system and method associated with FIG. 28A in accordance with the present teachings.

圖29A、圖29B及圖29C為具有輔助包體的本教示內容之氣體包體系統之各種實施例的示意性平面圖。 29A, 29B, and 29C are schematic plan views of various embodiments of a gas enclosure system having the teachings of an auxiliary package.

圖30A、圖30B及圖30C為具有輔助包體的本教示內容之氣體包體系統之各種實施例的示意性平面圖。 30A, 30B, and 30C are schematic plan views of various embodiments of a gas enclosure system having the teachings of an auxiliary package.

如先前所論述,基板浮動台及空氣軸承之各種實施例可適用於操作容納在根據本教示內容之氣體包體系統中的OLED列印系統之各種實施例。如圖1中對氣體包體系統500示意性所示,利用空氣軸承技術之基 板浮動台可用以將基板輸送至列印頭腔室中的位置中,以及在OLED列印製程期間支撐基板。在圖1中,用以容納列印系統之氣體包體總成1100可為負載鎖定系統,其可具有用於經由入口閘1112接收基板之入口腔室1110及用於將基板自入口腔室1110移動至氣體包體總成1100以供列印之第一包體閘1114。根據本教示內容之各種閘可用於將腔室彼此隔離且將腔室與外部週遭環境隔離。根據本教示內容,各種閘可選自實體閘及氣簾。 As previously discussed, various embodiments of the substrate floating table and air bearing can be adapted to operate various embodiments of an OLED printing system housed in a gas enclosure system in accordance with the present teachings. As shown schematically in Figure 1 for gas inclusion system 500, the basis of air bearing technology is utilized. A plate floating table can be used to transport the substrate into a position in the printhead chamber and to support the substrate during the OLED printing process. In FIG. 1, a gas enclosure assembly 1100 for housing a printing system can be a load lock system that can have an inlet chamber 1110 for receiving a substrate via an inlet gate 1112 and a substrate from the inlet chamber 1110. The gas package assembly 1100 is moved to the first package gate 1114 for printing. Various gates in accordance with the present teachings can be used to isolate the chambers from each other and to isolate the chamber from the surrounding environment. According to the teachings, the various gates can be selected from physical gates and air curtains.

在基板接收製程期間,入口閘1112可打開,而第一包體閘 1114可處於閉合位置以防止大氣氣體進入氣體包體總成1100。一旦基板接收在入口腔室1110中,即可閉合入口閘1112及第一包體閘1114二者,且可使用諸如氮、任何稀有氣體及其任何組合之惰性氣體來沖洗入口腔室1110,直至反應性大氣氣體在100ppm或更低之低含量下,例如在10ppm下或更低、在1.0ppm下或更低、或在0.1ppm下或更低。在大氣氣體已到達充分低含量之後,可打開閘第一包體閘1114,而入口閘1112仍保持閉合,以允許將基板2050自入口腔室1110輸送至氣體包體總成1100,如圖1中所描繪。基板自入口腔室1110輸送至氣體包體總成1100可經由例如但不限於氣體包體總成1100及入口腔室1110中所提供之浮動台達成。基板自入口腔室1110至氣體包體總成1100之輸送亦可經由例如但不限於基板輸送機器人達成,該基板輸送機器人可將基板2050置放至氣體包體總成1100中所提供之浮動台上。基板2050可在列印製程期間保持支撐於基板浮動台上。 During the substrate receiving process, the inlet gate 1112 can be opened while the first body gate is 1114 can be in a closed position to prevent atmospheric gases from entering the gas inclusion assembly 1100. Once the substrate is received in the inlet chamber 1110, both the inlet gate 1112 and the first body gate 1114 can be closed, and the inlet chamber 1110 can be flushed using an inert gas such as nitrogen, any noble gas, and any combination thereof until The reactive atmospheric gas is at a low content of 100 ppm or less, for example, at 10 ppm or less, at 1.0 ppm or less, or at 0.1 ppm or less. After the atmospheric gas has reached a sufficiently low level, the gate first cladding gate 1114 can be opened and the inlet gate 1112 remains closed to allow the substrate 2050 to be transported from the inlet chamber 1110 to the gas inclusion assembly 1100, as shown in the figure. Depicted in 1. Delivery of the substrate from the inlet chamber 1110 to the gas inclusion assembly 1100 can be accomplished via, for example, but not limited to, a gas enclosure assembly 1100 and a floating station provided in the inlet chamber 1110. The transfer of the substrate from the inlet chamber 1110 to the gas inclusion assembly 1100 can also be accomplished via, for example, but not limited to, a substrate transfer robot that can place the substrate 2050 into a floating table provided in the gas package assembly 1100 on. The substrate 2050 can remain supported on the substrate floating stage during the printing process.

氣體包體系統500之各種實施例可具有經由第二包體閘 1124與氣體包體總成1100流體連通之出口腔室1120。根據氣體包體系統500之各種實施例,在列印製程完成之後,可經由第二包體閘1124將基板2050 自氣體包體總成1100輸送至出口腔室1120。基板自氣體包體總成1100至出口腔室1120之輸送可經由例如但不限於氣體包體總成1100及出口腔室1120中所提供之浮動台達成。基板自氣體包體總成1100至出口腔室1120之輸送亦可經由例如但不限於基板輸送機器人達成,該基板輸送機器人可自氣體包體總成1100中所提供之浮動台拾取基板2050且將其輸送至出口腔室1120中。對於氣體包體系統500之各種實施例而言,當第二包體閘1124處於閉合位置中時,基板2050可經由出口閘1122自出口腔室1120取回以便防止反應性大氣氣體進入氣體包體總成1100。 Various embodiments of gas inclusion system 500 can have a second containment gate The outlet chamber 1120 is in fluid communication with the gas inclusion assembly 1100. According to various embodiments of the gas encapsulation system 500, the substrate 2050 can be transferred via the second inclusion gate 1124 after the printing process is completed. The gas inclusion assembly 1100 is delivered to the outlet chamber 1120. Delivery of the substrate from the gas inclusion assembly 1100 to the outlet chamber 1120 can be accomplished via, for example, but not limited to, a gas enclosure assembly 1100 and a floating station provided in the outlet chamber 1120. The transport of the substrate from the gas inclusion assembly 1100 to the exit chamber 1120 can also be accomplished via, for example, but not limited to, a substrate transport robot that can pick up the substrate 2050 from a floating table provided in the gas package assembly 1100 and It is delivered into the outlet chamber 1120. For various embodiments of the gas enclosure system 500, when the second body gate 1124 is in the closed position, the substrate 2050 can be retrieved from the outlet chamber 1120 via the outlet gate 1122 to prevent reactive atmospheric gases from entering the gas inclusions. Assembly 1100.

除包括分別經由第一包體閘1114及第二包體閘1124與氣體 包體總成1100流體連通之入口腔室1110及出口腔室1120的負載鎖定系統之外,氣體包體系統500可包括系統控制器1130。系統控制器1130可包括與一或多個記憶體電路(未圖示)通訊之一或多個處理器電路(未圖示)。 系統控制器1130亦可與包括入口腔室1110及出口腔室1120之負載鎖定系統通訊,且最終與OLED列印系統之列印噴嘴通訊。以此方式,系統控制器1130可協調閘1112、1114、1122以及1124之打開及閉合。系統控制器1130亦可控制向OLED列印系統之列印噴嘴的油墨分配。可經由本教示內容之負載鎖定系統的各種實施例來輸送基板2050,該負載鎖定系統包括入口腔室1110及出口腔室1120,該等腔室分別經由閘1114及閘1124,經由例如但不限於利用空氣軸承技術之基板浮動台或利用空氣軸承技術之基板浮動台與基板輸送機器人之組合來與氣體包體總成1100流體連通。 In addition to including gas through the first body gate 1114 and the second body gate 1124, respectively The gas enclosure system 500 can include a system controller 1130 in addition to the inlet chamber 1110 in which the body assembly 1100 is in fluid communication and the load lock system in the outlet chamber 1120. System controller 1130 can include one or more processor circuits (not shown) in communication with one or more memory circuits (not shown). The system controller 1130 can also communicate with a load lock system including an inlet chamber 1110 and an outlet chamber 1120, and ultimately with a print nozzle of the OLED printing system. In this manner, system controller 1130 can coordinate the opening and closing of gates 1112, 1114, 1122, and 1124. System controller 1130 can also control ink dispensing to the print nozzles of the OLED printing system. The substrate 2050 can be transported via various embodiments of the load lock system of the present teachings, the load lock system including an inlet chamber 1110 and an outlet chamber 1120, respectively, via a gate 1114 and a gate 1124, for example, but not limited to A gas floating body assembly 1100 is in fluid communication using a substrate floating table of air bearing technology or a combination of a substrate floating stage using air bearing technology and a substrate transfer robot.

圖1之負載鎖定系統的各種實施例亦可包括氣動控制系統 1150,其可包括真空源及可包括氮、任何稀有氣體及其任何組合之惰性氣體 源。容納在氣體包體系統500內之基板浮動系統可包括通常佈置在平坦表面上的多個真空埠及氣體軸承埠。基板2050可藉由諸如氮、任何稀有氣體及其任何組合之惰性氣體的壓力來提起且保持離開硬表面。軸承體積之泄流係藉助於多個真空埠完成。基板2050在基板浮動台上方之浮動高度通常隨氣體壓力及氣體流量而變化。氣動控制系統1150之真空及壓力可用於在基板2050於圖1之負載鎖定系統中之氣體包體總成1100內部處置期間,例如在列印期間對其進行支撐。控制系統1150亦可用於在基板2050經由圖1之負載鎖定系統輸送期間對其進行支撐,該負載鎖定系統包括分別經由閘1114及1124與氣體包體總成1100流體連通之入口腔室1110及出口腔室1120。為控制經由氣體包體系統500輸送基板2050,系統控制器1130分別經由閥1156及1158與惰性氣體源1152及真空1154通訊。未圖示之額外真空及惰性氣體供應管線及閥可提供至由圖1中之負載鎖定系統所例示的氣體包體系統500,以便進一步提供用於控制封閉環境所需之各種氣體及真空設施。 Various embodiments of the load lock system of Figure 1 may also include a pneumatic control system 1150, which may include a vacuum source and an inert gas that may include nitrogen, any noble gas, and any combination thereof source. The substrate floating system housed within the gas enclosure system 500 can include a plurality of vacuum ports and gas bearing ports typically disposed on a flat surface. Substrate 2050 can be lifted and held away from the hard surface by the pressure of an inert gas such as nitrogen, any noble gas, and any combination thereof. The discharge of the bearing volume is accomplished by means of a plurality of vacuum ports. The flying height of the substrate 2050 above the substrate floating table typically varies with gas pressure and gas flow. The vacuum and pressure of the pneumatic control system 1150 can be used to support the substrate 2050 during internal processing of the gas enclosure assembly 1100 in the load lock system of FIG. 1, such as during printing. Control system 1150 can also be used to support substrate 2050 during transport via the load lock system of FIG. 1 including inlet chamber 1110 in fluid communication with gas enclosure assembly 1100 via gates 1114 and 1124, respectively. Oral chamber 1120. To control delivery of substrate 2050 via gas inclusion system 500, system controller 1130 communicates with inert gas source 1152 and vacuum 1154 via valves 1156 and 1158, respectively. Additional vacuum and inert gas supply lines and valves, not shown, may be provided to the gas enclosure system 500 exemplified by the load lock system of Figure 1 to further provide various gas and vacuum facilities required for controlling the enclosed environment.

為給予根據本教示內容之氣體包體系統之各種實施例一更 具空間性的透視圖,圖2為氣體包體系統501之各種實施例的左前部透視圖。圖2描繪包括氣體包體總成100之各種實施例的負載鎖定系統,其將在隨後論述。氣體包體系統501可具有負載鎖定入口腔室1110,其可具有入口閘1112。圖2之氣體包體系統501可包括氣體純化系統3130,其用於向氣體包體總成100提供恆定惰性氣體供應,該惰性氣體具有大體上低含量的諸如水蒸氣及氧之反應性大氣物種,以及由OLED列印製程所產生之有機溶劑蒸氣。圖2之氣體包體系統501亦可具有如先前所論述的達成系統控 制功能之控制器系統1130。 In order to give various embodiments of the gas inclusion system according to the teachings of the present teaching A spatial perspective view, FIG. 2 is a left front perspective view of various embodiments of the gas enclosure system 501. 2 depicts a load lock system including various embodiments of a gas enclosure assembly 100, which will be discussed later. Gas enclosure system 501 can have a load lock inlet chamber 1110 that can have an inlet gate 1112. The gas inclusion system 501 of FIG. 2 can include a gas purification system 3130 for providing a constant inert gas supply to the gas inclusion body assembly 100 having a substantially low content of reactive atmospheric species such as water vapor and oxygen. And the organic solvent vapor produced by the OLED printing process. The gas inclusion system 501 of Figure 2 can also have system control as discussed previously Controller system 1130 for the function.

圖3為根據本教示內容之各種實施例的完全構造氣體包體 總成100的右前部透視圖。氣體包體總成100可含有用於維持氣體包體總成內部中之惰性環境的一或多種氣體。本教示內容之氣體包體系統可適用於維持內部中的惰性氣體氣氛。惰性氣體為在一組界定條件下不經歷化學反應之任何氣體。惰性氣體之一些常用實例可包括氮、任何稀有氣體及其任何組合。氣體包體總成100經配置以包圍且保護空氣敏感製程,諸如使用工業列印系統之有機發光二極體(OLED)列印。與OLED油墨反應之大氣氣體的實例包括水蒸氣及氧。如先前所論述,氣體包體總成100可經配置以維持密封氣氛且允許組件或列印系統有效地操作,同時避免對反應性材料及基板之污染、氧化以及其他方式之損壞。 3 is a fully constructed gas inclusion body in accordance with various embodiments of the present teachings. The right front perspective view of the assembly 100. The gas inclusion assembly 100 can contain one or more gases for maintaining an inert environment within the interior of the gas inclusion assembly. The gas inclusion system of the present teachings can be adapted to maintain an inert gas atmosphere in the interior. An inert gas is any gas that does not undergo a chemical reaction under a defined set of conditions. Some common examples of inert gases can include nitrogen, any noble gases, and any combination thereof. The gas inclusion assembly 100 is configured to enclose and protect an air sensitive process, such as an organic light emitting diode (OLED) printing using an industrial printing system. Examples of atmospheric gases that react with OLED inks include water vapor and oxygen. As previously discussed, the gas inclusion assembly 100 can be configured to maintain a sealed atmosphere and allow the assembly or printing system to operate efficiently while avoiding contamination, oxidation, and other damage to the reactive materials and substrates.

如圖3中所描繪,氣體包體總成100之各種實施例可包含組 成部件,該等組成部件包括前壁面板或第一壁面板210'、左壁面板或第二壁面板(未圖示)、右壁面板或第三壁面板230'、後壁面板或第四壁面板(未圖示)以及頂板面板250',該氣體包體總成可附接至靜置於底座(未圖示)上之底盤204。如隨後將更詳細地論述,圖3之氣體包體總成100的各種實施例可由前壁框架或第一壁框架210、左壁框架或第二壁框架(未圖示)、右壁框架或第三壁框架230、後壁面板或第四壁面板(未圖示)以及頂板框架250構造。頂板框架250之各種實施例可包括風扇過濾器單元罩蓋103,以及第一頂板框架管道105及第一頂板框架管道107。根據本教示內容之實施例,各種類型之區段面板可安裝在構成框架構件之複數個面板區段中的任何區段中。在圖1之氣體包體100的各種實施例中,在框架之構造期間可 將片狀金屬面板區段109焊接至框架構件中。對於氣體包體總成100之各種實施例而言,可經由氣體包體總成之構造及解構的循環來重複安裝並移除之區段面板的類型可包括如指示用於壁面板210'之嵌入面板110,以及如指示用於壁面板230'之窗面板120及可易移除服務窗130。 As depicted in FIG. 3, various embodiments of gas inclusion assembly 100 can include groups Forming components including front wall panel or first wall panel 210', left wall panel or second wall panel (not shown), right wall panel or third wall panel 230', rear wall panel or fourth A wall panel (not shown) and a top panel panel 250', the gas enclosure assembly can be attached to a chassis 204 that is resting on a base (not shown). As will be discussed in more detail later, various embodiments of the gas enclosure assembly 100 of FIG. 3 may be comprised of a front wall frame or first wall frame 210, a left or second wall frame (not shown), a right wall frame, or The third wall frame 230, the rear wall panel or the fourth wall panel (not shown) and the top panel frame 250 are constructed. Various embodiments of the roof frame 250 can include a fan filter unit cover 103, as well as a first top frame frame conduit 105 and a first top frame frame conduit 107. In accordance with embodiments of the present teachings, various types of segment panels can be mounted in any of a plurality of panel segments that form a frame member. In various embodiments of the gas enclosure 100 of Figure 1, during construction of the frame The sheet metal panel section 109 is welded into the frame member. For various embodiments of the gas inclusion assembly 100, the type of segment panels that can be repeatedly installed and removed via the cycle of construction and deconstruction of the gas enclosure assembly can include, for example, for the wall panel 210' The panel 110 is embedded, as well as the window panel 120 and the easily removable service window 130 as indicated for the wall panel 230'.

經由可易移除服務窗130可提供對包體100內部之就緒進 入,可移除的任何面板可用以提供對氣體包體系統內部之進入以達檢修及定期服務目的。用於服務或檢修之此種進入不同於由諸如窗面板120及可易移除服務窗130之面板所提供的進入,該等面板可提供在使用期間自氣體包體總成外部對氣體包體總成內部之終端使用者手套進入。例如,諸如附接至手套套圈140之手套142(如圖3中對面板230所示)之手套中的任何手套可在氣體包體系統之使用期間提供對內部之終端使用者進入。 Ready into the interior of the package 100 can be provided via the easily removable service window 130 In, any panel that can be removed can be used to provide access to the interior of the gas enclosure system for maintenance and periodic service purposes. Such access for service or overhaul differs from access provided by panels such as window panel 120 and the easily removable service window 130, which may provide for gas inclusions from outside the gas inclusion assembly during use. The end user gloves inside the assembly enter. For example, any of the gloves, such as the gloves 142 attached to the glove collar 140 (shown as panel 230 in FIG. 3), can provide end user access to the interior during use of the gas enclosure system.

圖4描繪如圖3中所描繪之氣體包體總成之各種實施例的展 開圖。氣體包體總成之各種實施例可具有複數個壁面板,包括前壁面板210'之外側透視圖、左壁面板220'之外側透視圖、右壁面板230'之內部透視圖、後壁面板240'之內部透視圖以及頂板面板250'之頂部透視圖,該等壁面板如圖3中所示可附接至靜置於底座202上之底盤204。OLED列印系統可安裝在底盤204之頂部上,此等列印製程已知為對大氣條件敏感的。根據本教示內容,氣體包體總成可由框架構件構造,該等框架構件例如壁面板210'之壁框架210、壁面板220'之壁框架220、壁面板230'之壁框架230、壁面板240'之壁框架240以及頂板面板250'之頂板框架250,隨後可將複數個區段面板安裝在該等框架構件中。就該方面而言,可需要使可經由本教示內容之氣體包體總成之各種實施例的構造及解構的循環而重複安裝並移除之區 段面板的設計成流線型。此外,可進行氣體包體總成100之成型來適應OLED系統之各種實施例的覆蓋區,以便在氣體包體總成之使用期間以及在維護期間,使得氣體包體總成中所需之惰性氣體的體積最小化,以及向終端使用者提供就緒進入。 Figure 4 depicts an exhibition of various embodiments of the gas inclusion assembly as depicted in Figure 3. Open map. Various embodiments of the gas enclosure assembly can have a plurality of wall panels, including a front side panel 210' outer side perspective view, a left wall panel 220' outer side perspective view, an inner perspective view of the right wall panel 230', a rear wall panel An internal perspective view of the 240' and a top perspective view of the top panel panel 250', which may be attached to the chassis 204 resting on the base 202 as shown in FIG. An OLED printing system can be mounted on top of the chassis 204, which is known to be sensitive to atmospheric conditions. According to the present teachings, the gas enclosure assembly may be constructed from frame members such as wall frame 210 of wall panel 210', wall frame 220 of wall panel 220', wall frame 230 of wall panel 230', wall panel 240 The wall frame 240 of the 'wall frame 240 and the top panel 250' can then be mounted with a plurality of segment panels in the frame members. In this regard, it may be desirable to repeat the installation and removal of the various configurations and destructuring cycles of the various embodiments of the gas inclusion assembly of the present teachings. The segment panel is designed to be streamlined. In addition, the gas inclusion assembly 100 can be formed to accommodate the footprint of various embodiments of the OLED system to provide the desired inertness in the gas inclusion assembly during use of the gas inclusion assembly and during maintenance. The volume of gas is minimized and ready access is provided to the end user.

使用前壁面板210'及左壁面板220'作為示範例,框架構件之 各種實施例可具有在框架構件構造期間焊接至框架構件中的片狀金屬面板區段109。嵌入面板110、窗面板120以及可易移除服務窗130可安裝在每一壁框架構件中,且可經由圖4之氣體包體總成100之構造及解構的循環而重複安裝並移除。如可見,在壁面板210'及壁面板220'之實例中,壁面板可具有鄰近可易移除服務窗130的窗面板120。類似地,如在示例性後壁面板240'中所描繪,壁面板可具有諸如窗面板125的窗面板,該窗面板具有兩個相鄰手套套圈140。對於根據本教示內容之壁框架構件的各種實施例而言,且如對圖3之氣體包體總成100所見,手套之此種佈置提供自氣體包體外部對封閉系統內之組成部件的輕易接取。因此,氣體包體之各種實施例可提供兩個或兩個以上手套套圈,以便終端使用者可將左手套及右手套延伸至內部中且操縱內部中之一或多個物品而不干擾內部內之氣態氣氛之組成。 例如,可定位窗面板120及服務窗130中之任何者以促進自氣體包體總成外部對氣體包體總成內部中之可調整組件的輕易接取。根據諸如窗面板120及服務窗130之窗面板的各種實施例,當不指示經由手套套圈手套之終端使用者進入時,此等窗可不包括手套套圈及手套套圈總成。 Using the front wall panel 210' and the left wall panel 220' as an example, the frame member Various embodiments may have sheet metal panel segments 109 that are welded into the frame members during construction of the frame members. The inset panel 110, the window panel 120, and the easily removable service window 130 can be mounted in each wall frame member and can be repeatedly installed and removed via the configuration and deconstruction cycle of the gas enclosure assembly 100 of FIG. As can be seen, in the example of wall panel 210' and wall panel 220', the wall panel can have a window panel 120 adjacent to the easily removable service window 130. Similarly, as depicted in the exemplary rear wall panel 240', the wall panel can have a window panel such as a window panel 125 having two adjacent glove ferrules 140. For various embodiments of the wall frame members in accordance with the present teachings, and as seen for the gas enclosure assembly 100 of Figure 3, such an arrangement of gloves provides for easy access from the exterior of the gas enclosure to the components within the enclosed system. Pick up. Thus, various embodiments of the gas enclosure can provide two or more glove ferrules so that the end user can extend the left and right gloves into the interior and manipulate one or more items in the interior without interfering with the interior The composition of the gaseous atmosphere inside. For example, any of the window panel 120 and the service window 130 can be positioned to facilitate easy access from the exterior of the gas enclosure assembly to the adjustable components in the interior of the gas enclosure assembly. According to various embodiments of window panels, such as window panel 120 and service window 130, such windows may not include glove collars and glove collar assemblies when not instructed by an end user via glove ferrule gloves.

如圖4中所描繪,壁面板及頂板面板之各種實施例可具有複 數個嵌入面板110。如圖4中可見,嵌入面板可具有各種形狀及縱橫比。除 嵌入面板之外,頂板面板250'可具有風扇過濾器單元罩蓋103,以及經安裝、經螺栓連接、經旋擰、經固定或經其他方式固緊至頂板框架250之第一頂板框架管道105及第二頂板框架管道107。如隨後將更詳細地論述,與頂板面板250'之管道107流體連通的管道系統可安裝在氣體包體總成內部內。根據本教示內容,此種管道系統可為氣體包體總成內部之氣體循環系統的部分,並且可提供用於將退出氣體包體總成之流動流分離,以便經由氣體包體總成外部之至少一個氣體純化組件進行循環。 As depicted in Figure 4, various embodiments of wall panels and roof panels may have complex A plurality of embedded panels 110. As can be seen in Figure 4, the embedded panels can have a variety of shapes and aspect ratios. except In addition to the inset panel, the top panel panel 250' can have a fan filter unit cover 103, and a first top panel frame conduit 105 that is mounted, bolted, screwed, secured, or otherwise secured to the top panel frame 250. And a second top frame frame pipe 107. As will be discussed in more detail later, the piping system in fluid communication with the conduit 107 of the roof panel 250' can be mounted within the interior of the gas enclosure assembly. According to the present teachings, such a piping system can be part of a gas circulation system inside the gas inclusion body assembly and can be provided for separating the flow stream exiting the gas inclusion body assembly for external passage via the gas inclusion body assembly. At least one gas purification component is circulated.

圖5為框架構件總成200之展開前部透視圖,其中壁框架 220可經構造以包括面板之完整補體。雖然不限於所展示之設計,但是使用壁框架220之框架構件總成200可用作根據本教示內容之框架構件總成之各種實施例的示範例。框架構件總成之各種實施例可包含安裝在根據本教示內容之各種框架構件之各種框架面板區段中的各種框架構件及區段面板。 Figure 5 is an exploded front perspective view of the frame member assembly 200, wherein the wall frame 220 can be constructed to include a complete complement of the panel. While not limited to the illustrated design, the frame member assembly 200 using the wall frame 220 can be used as an example of various embodiments of the frame member assembly in accordance with the present teachings. Various embodiments of the frame member assembly can include various frame members and segment panels that are mounted in various frame panel sections of various frame members in accordance with the present teachings.

根據本教示內容之各種框架構件總成的各種實施例,框架構 件總成200可包含諸如壁框架220之框架構件。對於諸如圖3之氣體包體總成100之氣體包體總成的各種實施例而言,可利用容納在此種氣體包體總成中之設備的製程可不僅需要提供惰性環境之密閉式密封包體,而且需要大體上無微粒物質之環境。就該方面而言,根據本教示內容之框架構件可利用用於構造框架之各種實施例的各種尺寸化金屬管材料。此類金屬管材料解決所要之材料屬性,包括但不限於其為高完整性材料,該高完整性材料不會降解而產生微粒物質,並且產生具有高強度而重量最佳之框架構件,提供自包含各種框架構件及面板區段之氣體包體總成之一位點至另一位點的就緒輸送、構造以及解構。滿足此等要求之任何材料可用以產生根 據本教示內容之各種框架構件。 Various embodiments of various frame member assemblies in accordance with the teachings herein, frame construction The piece assembly 200 can include a frame member such as a wall frame 220. For various embodiments of a gas inclusion assembly such as the gas inclusion assembly 100 of Figure 3, the process of utilizing the equipment contained in such a gas enclosure assembly may not only require a hermetic seal that provides an inert environment. Encapsulation, and requires an environment that is substantially free of particulate matter. In this regard, frame members in accordance with the present teachings can utilize various sized metal tube materials for constructing various embodiments of the frame. Such metal tube materials address desirable material properties including, but not limited to, high integrity materials that do not degrade to produce particulate matter and produce frame members with high strength and optimum weight, provided Ready transport, construction, and deconstruction of one of the gas inclusion assemblies of the various frame members and panel sections from one location to another. Any material that meets these requirements can be used to create roots Various frame members according to the teachings.

例如,根據本教示內容之框架構件的各種實施例,諸如框架 構件總成200,可由擠製金屬管件構造。根據框架構件之各種實施例,鋁、鋼以及各種金屬複合材料可利用來構造框架構件。在各種實施例中,具有例如但不限於2"w×2"h、4"w×2"h以及4"w×4"h之尺寸且具有1/8"至1/4"壁厚度的金屬管件可用以構造根據本教示內容之框架構件的各種實施例。 另外,各種管或其他形式之各種增強纖維聚合物複合材料為可利用的,該等材料具有包括但不限於以下之材料屬性:其為高完整性材料,該高完整性材料不會降解而產生微粒物質,並且產生具有高強度而重量最佳之框架構件,提供自一位點至另一位點之就緒輸送、構造以及解構。 For example, various embodiments of frame members in accordance with the present teachings, such as frames The component assembly 200 can be constructed from extruded metal tubing. Aluminum, steel, and various metal composite materials can be utilized to construct the frame members in accordance with various embodiments of the frame members. In various embodiments, having dimensions such as, but not limited to, 2"w x 2"h, 4"w x 2"h, and 4"w x 4"h and having a wall thickness of 1/8" to 1/4" Metal tubing can be used to construct various embodiments of the frame members in accordance with the present teachings. Additionally, various tubes or other forms of reinforcing fiber polymer composites are available that have material properties including, but not limited to, that are high integrity materials that are not degraded Particulate matter, and produces frame members with high strength and best weight, providing ready transport, construction, and deconstruction from one point to another.

關於自各種尺寸化金屬管材料構造各種框架構件,應涵蓋的 是,可進行用以產生框架焊製件之各種實施例的焊接。另外,可使用適當的工業黏合劑來進行各種框架構件自各種尺寸化建造材料之構造。應涵蓋的是,應以不會內在地產生穿過框架構件之洩漏路徑的方式來進行各種框架構件之構造。就該方面而言,可使用不內在地產生穿過氣體包體總成之各種實施例之框架構件之洩漏路徑的任何方法來進行各種框架構件之構造。此外,可漆塗或塗布根據本教示內容之框架構件的各種實施例,諸如圖4之壁框架220。對於由例如傾向於氧化之金屬管件材料製成之框架構件的各種實施例而言,在表面處形成之材料可產生微粒物質的情況下,可進行用以防止微粒物質形成之漆塗或塗布或諸如陽極處理之其他表面處理。 Regarding the construction of various frame members from various sized metal tube materials, should be covered Yes, welding of various embodiments for producing frame weldments can be performed. In addition, suitable industrial adhesives can be used to construct various frame members from various sized building materials. It should be understood that the construction of the various frame members should be performed in a manner that does not inherently create a leakage path through the frame members. In this regard, the construction of the various frame members can be performed using any method that does not inherently create a leakage path through the frame members of the various embodiments of the gas inclusion assembly. In addition, various embodiments of frame members in accordance with the present teachings, such as wall frame 220 of FIG. 4, may be painted or coated. For various embodiments of a frame member made of, for example, a metal tubular material that tends to oxidize, in the case where the material formed at the surface can produce particulate matter, a paint or coating to prevent the formation of particulate matter or Other surface treatments such as anodizing.

諸如圖5之框架構件總成200的框架構件總成可具有諸如壁 框架220之框架構件。壁框架220可具有頂部226以及底部228,頂壁框架 隔板227可緊固在該頂部上,且底壁框架隔板229可緊固在該底部上。如隨後將更詳細地論述,安裝在框架構件表面上之隔板為墊片密封系統的一部分,該墊片密封系統與安裝在框架構件區段中之面板的墊片密封結合來提供根據本教示內容之氣體包體總成之各種實施例的密閉式密封。諸如圖5之框架構件總成200之壁框架220的框架構件可具有若干面板框架區段,其中每一區段可製造來接收各種類型之面板,諸如但不限於嵌入面板110、窗面板120以及可易移除服務窗130。各種類型之面板區段可在框架構件之構造中形成。面板區段之類型可包括例如但不限於用以接收嵌入面板110之嵌入面板區段10、用以接收窗面板120之窗面板區段20,以及用以接收可易移除服務窗130的服務窗面板區段30。 A frame member assembly such as frame member assembly 200 of Figure 5 can have, for example, a wall Frame member of frame 220. The wall frame 220 can have a top 226 and a bottom 228, the top wall frame A partition 227 can be fastened to the top and the bottom wall frame partition 229 can be fastened to the bottom. As will be discussed in more detail later, the baffle mounted on the surface of the frame member is part of a shim sealing system that is sealed in combination with a shim of a panel mounted in the frame member section to provide guidance in accordance with the present teachings. A hermetic seal of various embodiments of the gaseous inclusion body of the content. A frame member such as the wall frame 220 of the frame member assembly 200 of FIG. 5 can have a plurality of panel frame segments, wherein each segment can be fabricated to receive various types of panels, such as, but not limited to, the inset panel 110, the window panel 120, and The service window 130 can be easily removed. Various types of panel sections can be formed in the construction of the frame members. Types of panel sections may include, for example, but are not limited to, an embedded panel section 10 for receiving the embedded panel 110, a window panel section 20 for receiving the window panel 120, and a service for receiving the easily removable service window 130. Window panel section 30.

每一類型之面板區段可具有用以接收面板之面板區段框 架,且可提供的是:每一面板可根據本教示內容以可密封方式緊固至每一面板區段中,以便構造密閉式密封氣體包體總成。例如,在描繪根據本教示內容之框架總成的圖5中,嵌入面板區段10展示為具有框架12,窗面板區段20展示為具有框架22,且服務窗面板區段30展示為具有框架32。對於本教示內容之壁框架總成的各種實施例而言,各種面板區段框架可為使用連續焊珠焊接至面板區段中以提供密閉式密封之金屬片材料。對於壁框架總成之各種實施例而言,各種面板區段框架可由包括選自增強纖維聚合物複合材料之建造材料的各種片狀材料製成,該等片狀材料可使用適當工業黏合劑來將安裝在面板區段中。如在關於密封之後續教示中更詳細地論述,每一面板區段框架可具有安置於其上之可壓縮墊片,以確保可形成用於安裝且緊固於每一面板區段中之每一面板的氣密密封件。除面板區段框 架之外,每一框架構件區段可具有與定位面板相關且與將面板牢固地緊固於面板區段中相關之硬體。 Each type of panel section may have a panel section frame for receiving a panel Racks, and it may be provided that each panel may be secured to each panel section in a sealable manner in accordance with the teachings herein to form a hermetic sealed gas enclosure assembly. For example, in Figure 5 depicting a frame assembly in accordance with the present teachings, the inset panel section 10 is shown with a frame 12, the window panel section 20 is shown with a frame 22, and the service window panel section 30 is shown with a frame 32. For various embodiments of the wall frame assembly of the present teachings, the various panel segment frames can be sheet metal materials that are welded into the panel sections using continuous beads to provide a hermetic seal. For various embodiments of the wall frame assembly, the various panel segment frames can be made from a variety of sheet materials including construction materials selected from the group consisting of reinforcing fiber polymer composites, which can be made using suitable industrial adhesives. Will be installed in the panel section. As discussed in more detail in the subsequent teachings regarding sealing, each panel section frame can have a compressible gasket disposed thereon to ensure that each of the panel sections can be formed for installation and secured in each panel section A panel of hermetic seals. In addition to the panel section box In addition to the shelves, each frame member section can have a hardware associated with the positioning panel and associated with securely fastening the panel to the panel section.

嵌入面板110及用於窗面板120之面板框架122的各種實施 例可由片狀金屬材料來構造,該片狀金屬材料諸如但不限於鋁、各種鋁合金以及不銹鋼。面板材料之屬性可與構成框架構件之各種實施例之結構材料的屬性相同。就該方面而言,具有用於各種面板構件之屬性的材料包括但不限於高完整性材料,該高完整性材料不會降解而產生微粒物質,並且產生具有高強度而重量最佳之框架構件,以便提供自一位點至另一位點之就緒輸送、構造以及解構。例如蜂巢核芯片狀材料之各種實施例可具有用作面板材料之必要屬性,以用於構造嵌入面板110及用於窗面板120之面板框架122。蜂巢核芯片狀材料可由以下各種材料製成:金屬以及金屬複合材料及聚合物二者,以及聚合物複合蜂巢核芯片狀材料。當由金屬材料製造時,可移除面板之各種實施例可具有包括於面板中之接地連接部,以確保在構造氣體包體總成時整體結構接地。 Various implementations of the embedded panel 110 and the panel frame 122 for the window panel 120 Examples may be constructed from sheet metal materials such as, but not limited to, aluminum, various aluminum alloys, and stainless steel. The properties of the panel material may be the same as those of the structural materials of the various embodiments that make up the frame member. In this regard, materials having properties for various panel members include, but are not limited to, high integrity materials that do not degrade to produce particulate matter and produce frame members having high strength and optimum weight. To provide ready delivery, construction, and deconstruction from one point to another. Various embodiments, such as honeycomb core chip material, may have the necessary attributes for use as a panel material for constructing the embedded panel 110 and the panel frame 122 for the window panel 120. The honeycomb core chip material can be made of various materials: metal and metal composite materials and polymers, and polymer composite honeycomb core chip materials. When fabricated from a metallic material, various embodiments of the removable panel can have a ground connection included in the panel to ensure that the overall structure is grounded when constructing the gas enclosure assembly.

鑒於用於構造本教示內容之氣體包體總成之組件的可輸送 性質,本教示內容之區段面板之各種實施例中的任何者可在氣體包體系統之使用期間重複安裝並移除,以提供對氣體包體總成內部之進入。 In view of the transportable components of the gas enclosure assembly used to construct the teachings Properties, any of the various embodiments of the section panels of the present teachings can be repeatedly installed and removed during use of the gas enclosure system to provide access to the interior of the gas enclosure assembly.

例如,用於接收可易移除服務窗面板130的面板區段30可 具有一組四個隔片,該等隔片之一係指示為窗引導隔片34。另外,構造來用於接收可易移除服務窗面板130的面板區段30可具有一組四個夾緊栓36,該等夾緊栓可用以使用安裝在用於每一可易移除服務窗130之服務窗框架132上的一組四個逆作用肘節夾具136來將服務窗130夾緊至服務窗面板 區段30中。此外,兩個窗手柄138各自可安裝在可易移除服務窗框架132上,以提供移除及安裝服務窗130之終端使用者便利性。可移除服務窗手柄的數目、類型以及置放可改變。另外,用於接收可易移除服務窗面板130的服務窗面板區段30可具有選擇性地安裝在每一服務窗面板區段30中之至少兩個窗夾具35。雖然描述為處於每一服務窗面板區段30之頂部及底部,但是至少兩個窗夾具可以作用來使服務窗130固緊於面板區段框架32中之任何方式來安裝。可使用工具來移除並安裝窗夾具35,以便允許移除並重新安裝服務窗130。 For example, the panel section 30 for receiving the easily removable service window panel 130 can be There is a set of four spacers, one of which is indicated as a window guiding spacer 34. Additionally, the panel section 30 configured to receive the easily removable service window panel 130 can have a set of four clamping pegs 36 that can be used for installation in each of the easily removable services. A set of four inverse toggle clamps 136 on the service window frame 132 of the window 130 to clamp the service window 130 to the service window panel In section 30. Additionally, two window handles 138 can each be mounted on the easily removable service window frame 132 to provide end user convenience for removing and installing the service window 130. The number, type, and placement of removable service window handles can be changed. Additionally, the service window panel section 30 for receiving the easily removable service window panel 130 can have at least two window clamps 35 selectively mounted in each service window panel section 30. Although described as being at the top and bottom of each service window panel section 30, at least two window clamps can be actuated in any manner that secures the service window 130 in the panel section frame 32. A window clamp 35 can be removed and installed using a tool to allow removal and reinstallation of the service window 130.

服務窗130之逆作用肘節夾具136以及安裝在面板區段30 上的包括夾緊栓36、窗引導隔片34以及窗夾具35之硬體可由任何適合材料以及材料之組合構造。例如,一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。可移除服務窗手柄138可由任何適合材料以及材料組合構造。例如,一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠、至少一種橡膠及其組合。諸如窗面板120之窗124或服務窗130之窗134的包體窗可包含任何適合材料以及材料組合。根據本教示內容之氣體包體總成的各種實施例,包體窗可包含透明材料及半透明材料。在氣體包體總成之各種實施例中,包體窗可包含二氧化矽基材料,例如但不限於諸如玻璃及石英,以及各種類型之聚合物基材料,例如但不限於諸如各種類別之聚碳酸酯、聚丙烯酸以及聚乙烯基。示範性窗材料之各種複合材料及其組合亦可用作根據本教示內容之透明材料及半透明材料。 The inverse action toggle clamp 136 of the service window 130 and the panel section 30 are mounted The upper hardware including the clamp pin 36, the window guide spacer 34, and the window clamp 35 can be constructed from any suitable material and combination of materials. For example, one or more of such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof. The removable service window handle 138 can be constructed from any suitable material and combination of materials. For example, one or more of such elements can comprise at least one metal, at least one ceramic, at least one plastic, at least one rubber, and combinations thereof. The enclosure window, such as window 124 of window panel 120 or window 134 of service window 130, can comprise any suitable material as well as a combination of materials. According to various embodiments of the gas inclusion assembly of the present teachings, the inclusion window may comprise a transparent material and a translucent material. In various embodiments of the gas inclusion body assembly, the inclusion window may comprise a cerium oxide based material such as, but not limited to, such as glass and quartz, and various types of polymer based materials such as, but not limited to, various types of poly Carbonate, polyacrylic acid and polyvinyl. Various composite materials of exemplary window materials and combinations thereof can also be used as the transparent material and translucent material in accordance with the teachings herein.

如將要在以下針對圖8A至圖9B之教示中所論述,壁框架 構件密封件及頂板框架構件密封件與氣密區段面板框架密封件結合在一起提供用於需要惰性環境之空氣敏感製程之密閉式密封氣體包體總成的各種實施例。氣體包體系統中有助於提供大體上低濃度反應性物種以及大體上低微粒環境之組件可包括但不限於密閉式密封氣體包體總成,以及高效氣體循環及粒子過濾系統,包括管道系統。提供用於氣體包體總成之有效密閉式密封可為有挑戰的;尤其在三個框架構件集合在一起形成三側接頭的情況下為有挑戰的。因此,三側接頭密封相對於提供用於氣體包體總成之可容易安裝密閉式密封而言存在尤其困難的挑戰,該可容易安裝密閉式密封可經由構造及解構循環來裝配並拆卸。 Wall frame as will be discussed below with respect to the teachings of Figures 8A-9B The combination of the component seal and the top frame member seal with the hermetic section panel frame seal provides various embodiments of a hermetically sealed gas package assembly for an air sensitive process requiring an inert environment. Components in a gas inclusion system that provide a substantially low concentration of reactive species and a substantially low particulate environment may include, but are not limited to, hermetic sealed gas inclusion assemblies, as well as high efficiency gas circulation and particle filtration systems, including piping systems. . Providing an effective hermetic seal for a gas inclusion assembly can be challenging; especially if the three frame members are brought together to form a three-sided joint. Thus, three-sided joint seals present a particularly difficult challenge relative to providing an easily mountable hermetic seal for a gas enclosure assembly that can be assembled and disassembled via construction and deconstruction cycles.

就該方面而言,根據本教示內容之氣體包體總成的各種實施 例經由接頭之有效墊片密封提供完全構造氣體包體系統之密閉式密封,並且提供圍繞負載軸承建造組件之有效墊片密封。不同於習知接頭密封,根據本教示內容之接頭密封:1)包括鄰接墊片段在三個框架構件接合的頂部及底部末端框架接頭接合帶處自正交定向墊片長度的均勻平行對準,從而避免角縫對準及密封;2)提供用於形成跨於整個接頭寬度之鄰接長度,從而增加三側接頭接合帶處之密封接觸面積;3)經設計具有隔片板,該等隔片板提供跨於所有垂直及水平以及頂部及底部三側接頭墊片密封件之均勻壓縮力。另外,墊片材料之選擇可影響提供密閉式密封的有效性,此將隨後論述。 In this regard, various implementations of gas inclusion assemblies in accordance with the teachings herein An example of an effective gasket seal through a joint provides a hermetic seal that fully constructs the gas enclosure system and provides an effective gasket seal around the load bearing construction assembly. Unlike conventional joint seals, joint seals in accordance with the present teachings: 1) include uniform parallel alignment of the length of the orthogonally oriented shims at the top and bottom end frame joint joints of the three frame members joined by the adjacent mat segments. , thereby avoiding angular seam alignment and sealing; 2) providing abutting lengths for forming across the width of the joint, thereby increasing the sealing contact area at the three-sided joint joint; 3) being designed with a spacer, the partition The sheet provides uniform compressive force across all vertical and horizontal and top and bottom three side joint gasket seals. Additionally, the choice of gasket material can affect the effectiveness of providing a hermetic seal, as will be discussed later.

圖6A至圖6C為描繪習知三側接頭密封件與根據本教示內 容之三側接頭密封件的比較的頂部示意圖。根據本教示內容之氣體包體總成的各種實施例,可存在例如但不限於可接合來形成氣體包體總成之至少 四個壁框架構件、頂板框架構件以及底盤,從而產生需要密閉式密封之複數個垂直、水平以及三側接頭。在圖6A中,由第一墊片I形成之習知三側墊片密封件的頂部示意圖,該第一墊片I在X-Y平面中與墊片II正交定向。 如圖6A中所示,由X-Y平面中正交定向形成之接縫具有介於由墊片寬度尺寸所界定的兩個片段之間的接觸長度W1。另外,如影線所指示,墊片III之終末端部分可鄰接墊片I及墊片II,該墊片III為於垂直方向上與墊片I及墊片II二者正交定向之墊片。在圖6B中,由第一墊片長度I形成之習知三側接頭墊片密封件的頂部示意圖,該第一墊片長度I正交於第二墊片長度II且具有接合兩個長度之45°面的接縫,其中該接縫具有介於兩個片段之間大於墊片材料之寬度的接觸長度W2。類似於圖6A之配置,如影線所指示,在垂直方向上與墊片I及墊片II二者正交之墊片III的端部可鄰接墊片I及墊片II。假設圖6A及圖6B中之墊片寬度相同,則圖6B之接觸長度W2大於圖6A之接觸長度W16A-6C are top schematic views depicting a comparison of a conventional three-sided joint seal with a three-sided joint seal in accordance with the present teachings. According to various embodiments of the gas inclusion assembly of the present teachings, there may be, for example, but not limited to, at least four wall frame members, a top frame member, and a chassis that are engageable to form a gas enclosure assembly, thereby creating a need for a hermetic seal A plurality of vertical, horizontal and three-sided joints. In FIG. 6A, a top schematic view of a conventional three-sided gasket seal formed from a first gasket I that is oriented orthogonal to the gasket II in the XY plane. As shown in FIG. 6A, the seam formed by the XY plane orthogonally oriented with the length of contact between the two segments W between the width dimension of the spacer 1 as defined. In addition, as indicated by the hatching, the final end portion of the spacer III may abut the spacer I and the spacer II, and the spacer III is a spacer oriented orthogonally to both the spacer 1 and the spacer II in the vertical direction. . In FIG. 6B, a top schematic view of a conventional three-sided joint gasket seal formed from a first gasket length I, the first gasket length I being orthogonal to the second gasket length II and having two lengths joined A 45° face seam wherein the seam has a contact length W 2 between the two segments that is greater than the width of the gasket material. Similar to the configuration of FIG. 6A, the ends of the spacers III orthogonal to both the spacers I and the spacers II in the vertical direction may abut the spacers I and the spacers II as indicated by the hatching. Assuming that the spacers in FIGS. 6A and 6B have the same width, the contact length W 2 of FIG. 6B is greater than the contact length W 1 of FIG. 6A.

圖6C為根據本教示內容之三側接頭墊片密封件的頂部示意 圖。第一墊片長度I可具有正交於墊片長度I之方向形成的墊片段I',其中墊片段I'具有可大致為所接合結構組件之寬度尺寸的長度,該所接合結構組件諸如用於形成本教示內容之氣體包體總成之各種壁框架構件的4"w×2"h或4"w×4"h金屬管。墊片II於X-Y平面中正交於墊片I,且具有墊片段II',該墊片段具有大致為所接合結構組件之寬度的與墊片段I'重疊之長度。墊片段I'及II'之寬度為所選可壓縮墊片材料之寬度。墊片III於垂直方向上與墊片I及墊片II二者正交定向。墊片段III'為墊片III之端部。墊片段III'自墊片段III'之正交定向形成達到墊片III之垂直長度。墊片段III'可經形成使得 該墊片段具有大致與墊片段I'及II'相同之長度及為所選可壓縮墊片材料之厚度的寬度。就該方面而言,圖6C中所示的三個對準段之接觸長度W3大於圖6A或圖6B中所示的分別具有接觸長度W1及W2之習知三轉角接頭密封件之接觸長度。 6C is a top plan view of a three-sided joint gasket seal in accordance with the teachings. The first spacer length I can have a pad segment I' formed orthogonal to the direction of the spacer length I, wherein the pad segment I' has a length that can be substantially the width dimension of the joined structural component, the bonded structural component A 4"w x 2" h or 4" w x 4" h metal tube such as various wall frame members used to form the gas enclosure assembly of the present teachings. Shim II is orthogonal to spacer I in the XY plane and has a pad segment II' having a length that is substantially overlapping the pad segment I' by the width of the bonded structural component. The width of the pad segments I' and II' is the width of the selected compressible gasket material. The spacer III is oriented orthogonally to both the spacer I and the spacer II in the vertical direction. The pad segment III' is the end of the spacer III. The orthogonal orientation of the pad segment III' from the pad segment III' is such that it reaches the vertical length of the spacer III. The pad segment III' can be formed such that the pad segment has a length that is substantially the same as the pad segments I' and II' and a width that is the thickness of the selected compressible gasket material. In this respect, the contact length W 3 of the three alignment segments shown in FIG. 6C is greater than the conventional three-corner joint seals having the contact lengths W 1 and W 2 shown in FIG. 6A or FIG. 6B, respectively. Contact length.

就該方面而言,根據本教示內容之三側接頭墊片密封在末端 接頭接合帶處產生均勻平行對準的墊片段,而非如圖6A及圖6B之狀況所示為正交對準的墊片。三側接頭墊片密封段之此種均勻平行對準提供用於跨於各段施加均勻側向密封力,以便促進由壁框架構件形成之接頭的頂部及底部轉角處的密閉式三側接頭密封。另外,各三側接頭密封件之均勻對準墊片段中每一段經選擇大致為所接合結構組件之寬度,從而提供均勻對準段之最大接觸長度。此外,根據本教示內容之接頭密封經設計具有隔片板,該等隔片板提供跨於建造接頭之所有垂直、水平及三側墊片密封件之均勻壓縮力。可討論的是,選用於針對圖6A及圖6B之實例給出的習知三側密封件的墊片材料之寬度可至少為所接合結構組件之寬度。 In this respect, the three-sided joint gasket according to the teachings is sealed at the end. Uniformly aligned pad segments are produced at the joint bond strips, rather than orthogonally aligned pads as shown in the conditions of Figures 6A and 6B. This uniform parallel alignment of the three-sided joint gasket seal segments provides for the application of a uniform lateral sealing force across the segments to facilitate the closure of the three-sided joint seal at the top and bottom corners of the joint formed by the wall frame members. . Additionally, each of the uniform alignment pad segments of each of the three side joint seals is selected to be substantially the width of the joined structural component to provide a maximum contact length for the uniform alignment segments. In addition, the joint seals in accordance with the present teachings are designed with spacer sheets that provide uniform compressive forces across all vertical, horizontal, and three-sided gasket seals of the construction joint. It can be discussed that the width of the gasket material selected for the conventional three-sided seals given for the examples of Figures 6A and 6B can be at least the width of the joined structural components.

在圖7A之展開透視圖中,描繪在所有框架構件已獲接合之 前的根據本教示內容之密封總成300,以使得該等墊片描繪成處於未壓縮狀態。在圖7A中,諸如壁框架310、壁框架350及頂板框架370的複數個壁框架構件可在由氣體包體總成之各種組件構造氣體包體之第一步驟中以可密封方式接合。根據本教示內容之框架構件密封件為一實質部件,其提供於氣體包體總成完全構造時之密閉式密封,並且提供可經由氣體包體總成之構造及解構的循環來實施的密封。雖然以下圖7A至圖7B之教示內容中給出的實例係用於密封氣體包體總成之一部分,但是此等教示內容適用於 本教示內容之任何氣體包體總成的整體。 In the expanded perspective view of Figure 7A, it is depicted that all of the frame members have been joined The prior sealing assembly 300 according to the present teachings is such that the shims are depicted in an uncompressed state. In FIG. 7A, a plurality of wall frame members, such as wall frame 310, wall frame 350, and roof frame 370, are sealably engageable in a first step of constructing a gas enclosure from various components of the gas enclosure assembly. The frame member seal in accordance with the present teachings is a substantial component that provides a hermetic seal when the gas enclosure assembly is fully constructed and provides a seal that can be implemented via a cycle of construction and deconstruction of the gas enclosure assembly. Although the examples given in the teachings of Figures 7A-7B below are used to seal a portion of a gas enclosure assembly, such teachings apply to The entirety of any gas inclusion assembly of this teaching.

圖7A中描繪的第一壁框架310可具有安裝有隔片板312之 內部側311、垂直側314及安裝有隔片板316之頂表面315。第一壁框架310可具有安置於且黏附至由隔片板312形成的空間的第一墊片320。在將第一墊片320安置於且黏附至由隔片板312形成的空間之後所留下的間隙302可延伸第一墊片320之垂直長度,如圖7A中所示。如圖7A中所描繪,順應性墊片320可安置於且黏附至由隔片板312形成的空間,且可具有垂直墊片長度321、曲線墊片長度323及墊片長度325,該墊片長度325在平面中與內部框架構件311上的垂直墊片長度321形成90°且終止於壁框架310之垂直側314。在圖7A中,第一壁框架310可具有頂表面315,該頂表面上安裝有隔片板316,從而於表面315上形成空間,第二墊片340安置於且黏附至該空間靠近壁框架310之內邊緣317。在將第二墊片340安置於且黏附至由隔片板316形成的空間之後所留下的間隙304可延伸第二墊片340之水平長度,如圖7A中所示。另外,如陰影線所指示,墊片340之長度345與墊片320之長度325均勻平行且相接對準。 The first wall frame 310 depicted in FIG. 7A can have a spacer plate 312 mounted thereon. The inner side 311, the vertical side 314, and the top surface 315 on which the spacer plate 316 is mounted. The first wall frame 310 may have a first spacer 320 disposed and adhered to a space formed by the spacer plate 312. The gap 302 left after the first spacer 320 is disposed and adhered to the space formed by the spacer plate 312 may extend the vertical length of the first spacer 320 as shown in FIG. 7A. As depicted in FIG. 7A, the compliant shim 320 can be disposed and adhered to the space formed by the spacer plate 312 and can have a vertical shim length 321 , a curved shim length 323 , and a shim length 325 . The length 325 forms 90° in the plane with the vertical shim length 321 on the inner frame member 311 and terminates at the vertical side 314 of the wall frame 310. In FIG. 7A, the first wall frame 310 can have a top surface 315 on which a spacer plate 316 is mounted to form a space on the surface 315, the second gasket 340 being disposed and adhered to the space adjacent to the wall frame Edge 317 within 310. The gap 304 left after the second spacer 340 is disposed and adhered to the space formed by the spacer plate 316 may extend the horizontal length of the second spacer 340 as shown in FIG. 7A. Additionally, as indicated by the hatching, the length 345 of the spacer 340 is evenly parallel and aligned with the length 325 of the spacer 320.

圖7A中所描繪的第二壁框架350可具有外部框架側353、 垂直側354及安裝有隔片板356之頂表面355。第二壁框架350可具有安置於且黏附至由隔片板356形成的第一墊片空間的第一墊片360。在將第一墊片360安置於且黏附至由隔片板356形成的空間之後所留下的間隙306可延伸第一墊片360之水平長度,如圖7A中所示。如圖7A中所描繪,順應性墊片360可具有水平長度361、曲線長度363及長度365,該長度365於頂表面355所在平面上形成90°且終止於外部框架構件353。 The second wall frame 350 depicted in FIG. 7A can have an outer frame side 353, The vertical side 354 and the top surface 355 of the spacer plate 356 are mounted. The second wall frame 350 can have a first gasket 360 disposed and adhered to the first gasket space formed by the spacer sheets 356. The gap 306 left after the first spacer 360 is disposed and adhered to the space formed by the spacer plate 356 may extend the horizontal length of the first spacer 360 as shown in FIG. 7A. As depicted in FIG. 7A, the compliant shim 360 can have a horizontal length 361, a curved length 363, and a length 365 that forms 90° on the plane of the top surface 355 and terminates at the outer frame member 353.

如圖7A的展開透視圖中所指示,壁框架310之內部框架構 件311可接合至壁框架350之垂直側354以便形成氣體包體框架總成之一建造接頭。關於如此形成的建造接頭之密封,在如圖7A中所描繪的根據本教示內容之壁框架構件之末端接頭接合帶處的墊片密封之各種實施例中,墊片320之長度325、墊片360之長度365及墊片340之長度345皆相接且均勻對準。另外,如隨後將更詳細論述,本教示內容之隔片板之各種實施例可提供一均勻壓縮,其介於用於密閉式密封本教示內容之氣體包體總成之各種實施例的可壓縮墊片材料的約20%與約40%撓度(deflection)之間。 The internal frame structure of the wall frame 310 as indicated in the expanded perspective view of Figure 7A The piece 311 can be joined to the vertical side 354 of the wall frame 350 to form one of the gas enclosure frame assemblies to form the joint. With respect to the seal of the build joint thus formed, in various embodiments of the shim seal at the end joint joint strip of the wall frame member according to the present teachings as depicted in Figure 7A, the length 325 of the shim 320, the shim The length 365 of the 360 and the length 345 of the spacer 340 are all aligned and evenly aligned. Additionally, as will be discussed in greater detail below, various embodiments of the spacer sheets of the present teachings can provide a uniform compression that is compressible between various embodiments of a gas enclosure assembly for hermetic sealing of the teachings. Between about 20% of the gasket material and about 40% deflection.

圖7B描繪在所有框架構件接合之後的根據本教示內容之密 封總成300,以使得該等墊片描繪成處於壓縮狀態。圖7B為展示第一壁框架310、第二壁框架350與頂板框架370之間的頂部末端接頭接合帶處形成的三側接頭轉角密封之細節的透視圖,該頂板框架係以假想線展示。如圖7B中所示,由隔片板界定之墊片空間可測定為一寬度,以使得在接合壁框架310、壁框架350及頂板框架370(以假想線示出)之後,介於用於形成垂直、水平及三側墊片密封件之可壓縮墊片材料的約20%與約40%撓度之間的均勻壓縮確保:壁框架構件接頭處密封之所有表面處的墊片密封可提供密閉式密封。另外,墊片間隙302、304及306(未圖示)經尺寸設定以便在介於可壓縮墊片材料的約20%與約40%撓度之間的最佳壓縮之後,每一墊片可如圖7B中對墊片340及墊片360所示填充墊片間隙。因此,除藉由界定每一墊片所安置且黏附之空間來提供均勻壓縮之外,經設計提供間隙之隔片板之各種實施例亦確保:每一壓縮墊片可符合於由隔片板界定之空間內,而不以可形成洩漏路徑之方式起皺或膨出或以其他方式不規則地 形成壓縮狀態。 Figure 7B depicts the density according to the teachings after all of the frame members are joined The assembly 300 is sealed such that the shims are depicted in a compressed state. 7B is a perspective view showing details of a three-sided joint corner seal formed at a top end joint joint band between the first wall frame 310, the second wall frame 350, and the top plate frame 370, the top frame being shown in phantom lines. As shown in FIG. 7B, the spacer space defined by the spacer sheets can be measured as a width such that after joining the wall frame 310, the wall frame 350, and the top frame 370 (shown as phantom lines), Uniform compression between about 20% and about 40% deflection of the compressible gasket material forming the vertical, horizontal and three-sided gasket seals ensures that the gasket seal at all surfaces of the seal at the wall frame member joint provides containment Sealed. Additionally, the shim gaps 302, 304, and 306 (not shown) are sized such that after optimal compression between about 20% and about 40% deflection of the compressible gasket material, each shim can be The spacer gap is filled in FIG. 7B for spacer 340 and spacer 360. Thus, in addition to providing uniform compression by defining the space in which each shim is placed and adhered, various embodiments of the septum plate designed to provide clearance also ensure that each compression shim can conform to the septum plate Wrinkling or bulging or otherwise irregularly in a defined space without forming a leak path A compressed state is formed.

根據本教示內容之氣體包體總成之各種實施例,各種類型之 區段面板可使用安置在每一面板區段框架上之可壓縮墊片材料來密封。結合框架構件墊片密封,用於形成各種區段面板與面板區段框架之間的密封件的可壓縮墊片之位置及材料可提供幾乎沒有或沒有氣體洩漏之密閉式密封氣體包體總成。另外,用於諸如圖5的嵌入面板110、窗面板120及可易移除服務窗130的所有類型面板之密封設計可在此類面板之重複移除及安裝之後提供持久的面板密封,可需要此類面板之重複移除及安裝來進入氣體包體總成之內部例如以供維修。 Various embodiments of gas inclusion assemblies in accordance with the teachings herein, various types The segment panels can be sealed using a compressible gasket material disposed on the frame of each panel segment. In combination with the frame member gasket seal, the position and material of the compressible gasket for forming the seal between the various segment panels and the panel segment frame provides a hermetic seal gas inclusion assembly with little or no gas leakage. . Additionally, the seal design for all types of panels such as the inset panel 110, the window panel 120, and the easily removable service window 130 of Figure 5 can provide a durable panel seal after repeated removal and installation of such panels, which may be required Such panels are repeatedly removed and installed to access the interior of the gas enclosure assembly, for example, for servicing.

例如,圖8A為描繪服務窗面板區段30及可易移除服務窗 130之展開圖。如先前所論述,服務窗面板區段30可經製造用於接收可易移除服務窗130。對於氣體包體總成之各種實施例而言,諸如可移除服務面板區段30之面板區段可具有面板區段框架32以及安置在面板區段框架32上的可壓縮墊片38。在各種實施例中,與將可易移除服務窗130緊固在可移除服務窗面板區段30中有關的硬體可向終端使用者提供安裝及重新安裝的便利性,且同時確保在按所需藉由需要直接進入氣體包體總成內部之終端使用者將可易移除服務窗130安裝及重新安裝於面板區段30中時維持氣密密封。可易移除服務窗130可包括剛性窗框架132,其可由例如但不限於金屬管材料構造,如對構造本教示內容之任何框架構件所述。服務窗130可利用速動緊固硬體,例如但不限於逆作用肘節夾具136以便提供服務窗130的終端使用者就緒移除及重新安裝。 For example, Figure 8A depicts a service window panel section 30 and an easily removable service window An expanded view of 130. As previously discussed, the service window panel section 30 can be manufactured for receiving the easily removable service window 130. For various embodiments of the gas enclosure assembly, a panel section such as the removable service panel section 30 can have a panel section frame 32 and a compressible gasket 38 disposed on the panel section frame 32. In various embodiments, the hardware associated with securing the easily removable service window 130 in the removable service window panel section 30 provides the end user with ease of installation and reinstallation while at the same time ensuring The end user, who needs to access the interior of the gas enclosure assembly as needed, maintains a hermetic seal when the easily removable service window 130 is installed and reinstalled in the panel section 30. The easily removable service window 130 can include a rigid window frame 132 that can be constructed of, for example, but not limited to, a metal tube material, as described for any frame member that constructs the present teachings. The service window 130 may utilize a snap action fastening hardware such as, but not limited to, a reverse toggle clamp 136 to provide an end user of the service window 130 ready to remove and reinstall.

如圖8A之可移除服務窗面板區段30的前視圖中所示,可 易移除服務窗130可具有固緊於窗框架132上的一組四個肘節夾具136。服務窗130可定位於面板區段框架30中、於一界定距離處以用於確保一適當壓縮力抵靠墊片38。使用一組四個窗引導隔片34,如圖8B中所示,該等窗引導隔片可安裝在面板區段30之每個轉角中以用於將服務窗130定位在面板區段30中。一組夾緊栓36各自可經提供來接收可易移除服務窗130之逆作用肘節夾具136。根據服務窗130經由安裝及移除的循環達成密閉式密封之各種實施例,服務窗框架132之機械強度之組合結合藉由一組窗引導隔片34提供的服務窗130相對於可壓縮墊片38之界定位置可確保:一旦例如但不限於使用緊固在各別夾緊栓36中之逆作用肘節夾具136將服務窗130固緊在適當位置中時,服務窗框架132即可在如藉由一組窗引導隔片34設定的界定壓縮下將均勻力提供在面板區段框架32上。該組窗引導隔片34經定位以使得窗130對墊片38之壓縮力使可壓縮墊片38撓曲約20%與約40%之間。就該方面而言,服務窗130之構造以及面板區段30之製造提供服務窗130於面板區段30中之氣密密封。如先前論述,窗夾具35可在將服務窗130緊固至面板區段30中之後安裝至面板區段30中,且在需要移除服務窗130時予以移除。 As shown in the front view of the removable service window panel section 30 of Figure 8A, The easy-to-remove service window 130 can have a set of four toggle clamps 136 that are secured to the window frame 132. The service window 130 can be positioned in the panel section frame 30 at a defined distance for securing a suitable compressive force against the shim 38. The spacers 34 are guided using a set of four windows, as shown in Figure 8B, which can be mounted in each corner of the panel section 30 for positioning the service window 130 in the panel section 30. . A set of clamping pegs 36 can each be provided to receive an inverse toggle clamp 136 that can be easily removed from the service window 130. In accordance with various embodiments in which the service window 130 achieves a hermetic seal via a cycle of installation and removal, the combination of mechanical strength of the service window frame 132 incorporates a service window 130 provided by a set of window guide spacers 34 relative to the compressible gasket. The defined position of 38 can ensure that the service window frame 132 can be, for example, but not limited to, using the inverse toggle clamp 136 fastened in the respective clamp pin 36 to secure the service window 130 in place. A uniform force is provided on the panel section frame 32 by a defined compression set by the set of window guiding spacers 34. The set of window guiding spacers 34 are positioned such that the compressive force of the window 130 against the spacer 38 deflects the compressible spacer 38 by between about 20% and about 40%. In this regard, the construction of the service window 130 and the manufacture of the panel section 30 provide a hermetic seal of the service window 130 in the panel section 30. As previously discussed, the window clamp 35 can be installed into the panel section 30 after securing the service window 130 into the panel section 30 and removed when the service window 130 needs to be removed.

逆作用肘節夾具136可使用任何適合機構及機構組合來固 緊至可易移除服務窗框架132。可使用的適合固緊機構之實例包括至少一種黏合劑(例如但不限於環氧樹脂或膠結劑)、至少一個螺栓、至少一個螺釘、至少一個其他緊固件、至少一個狹槽、至少一個軌道、至少一種焊料及其組合。逆作用肘節夾具136可直接連接至可移除服務窗框架132,或間接經由配接板來連接。逆作用肘節夾具136、夾緊栓36、窗引導隔片34及窗夾 具35可由任何適合材料及材料之組合構造。例如,一或多個此類元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。 The inverse toggle clamp 136 can be secured using any suitable mechanism and combination of mechanisms The service window frame 132 is easily removed. Examples of suitable fastening mechanisms that can be used include at least one adhesive (such as, but not limited to, an epoxy or cement), at least one bolt, at least one screw, at least one other fastener, at least one slot, at least one track, At least one solder and combinations thereof. The inverse toggle clamp 136 can be directly coupled to the removable service window frame 132 or indirectly via a mating plate. Reverse acting toggle clamp 136, clamping bolt 36, window guiding spacer 34 and window clamp The implement 35 can be constructed from any suitable material and combination of materials. For example, one or more such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof.

除密封可易移除服務窗之外,氣密密封亦可提供用於嵌入面 板及窗面板。在面板區段中可重複安裝及移除之其他類型的區段面板包括例如但不限於如圖5中所示的嵌入面板110及窗面板120。如圖5中可見,窗面板120之面板框架122經構造類似於與嵌入面板110。因此,根據氣體包體總成之各種實施例,用於接收嵌入面板及窗面板之面板區段的製造可相同。就該方面而言,嵌入面板及窗面板之密封可使用相同原理來實施。 In addition to sealing for easy removal of service windows, hermetic seals are also available for insert surfaces Board and window panel. Other types of segment panels that can be repeatedly installed and removed in the panel section include, for example, but are not limited to, the inset panel 110 and the window panel 120 as shown in FIG. As can be seen in Figure 5, the panel frame 122 of the window panel 120 is constructed similar to and embedded in the panel 110. Thus, depending on various embodiments of the gas enclosure assembly, the manufacture of the panel sections for receiving the embedded panels and window panels can be the same. In this regard, the sealing of the embedded panel and the window panel can be implemented using the same principles.

參考圖9A及圖9B,且根據本教示內容之各種實施例,諸如 圖1之氣體包體總成100的氣體包體之任何面板可包括一或多個嵌入面板區段10,該等嵌入面板區段可具有經配置來接收各別嵌入面板110之框架12。 圖9A為指示出圖9B中所示的放大部分之透視圖。在圖9A中,嵌入面板110描繪成相對於嵌入框架12來定位。如圖9B中可見,嵌入面板110附著至框架12,其中框架12可例如由金屬構造。在一些實施例中,金屬可包含鋁、鋼、銅、不銹鋼、鉻、合金及其組合及類似物。可在嵌入面板區段框架12中製作複數個盲螺孔14。面板區段框架12經構造以便在嵌入面板110與框架12之間包含墊片16,其中可安置可壓縮墊片18。盲螺孔14可具有M5變體。螺釘15可藉由盲螺孔14來接收,從而壓縮嵌入面板110與框架12之間的墊片16。一旦緊固至抵靠墊片16之位置中,嵌入面板110即於嵌入面板區段10內形成氣密密封。如先前論述,此種面板密封可實施用於各種區段面板,包括但不限於如圖5中所示的嵌入面板110及窗面板120。 Referring to Figures 9A and 9B, and in accordance with various embodiments of the present teachings, such as Any of the panels of the gas enclosure of the gas enclosure assembly 100 of FIG. 1 can include one or more embedded panel sections 10 that can have a frame 12 configured to receive the respective embedded panels 110. Fig. 9A is a perspective view showing an enlarged portion shown in Fig. 9B. In FIG. 9A, the inset panel 110 is depicted as being positioned relative to the inset frame 12. As seen in Figure 9B, the inlay panel 110 is attached to the frame 12, wherein the frame 12 can be constructed, for example, from metal. In some embodiments, the metal can comprise aluminum, steel, copper, stainless steel, chromium, alloys, combinations thereof, and the like. A plurality of blind screw holes 14 can be made in the embedded panel section frame 12. The panel section frame 12 is configured to include a gasket 16 between the embedded panel 110 and the frame 12, wherein a compressible gasket 18 can be disposed. The blind screw hole 14 can have an M5 variant. The screw 15 can be received by the blind screw hole 14 to compress the gasket 16 embedded between the panel 110 and the frame 12. Once secured to the position against the shim 16, the inset panel 110 forms a hermetic seal within the inset panel section 10. As previously discussed, such panel seals can be implemented for various segment panels including, but not limited to, the inset panel 110 and the window panel 120 as shown in FIG.

根據依據本教示內容之可壓縮墊片之各種實施例,用於框架 構件密封及面板密封之可壓縮墊片材料可選自各種可壓縮聚合物材料,例如但不限於任何類別的閉合單胞聚合物材料,在此項技術中亦稱為展成橡膠材料或展成聚合物材料。簡言之,閉合單胞聚合物係以氣體藉以包封於離散單胞內之方式製備,其中每一離散單胞藉由聚合物材料包封。需要用於框架及面板組件之氣密密封的可壓縮閉合單胞聚合物墊片材料之性質包括但不限於其穩固地抵抗廣泛範圍化學物種之化學攻擊,擁有極佳濕氣障壁性質,在寬的溫度範圍內具有彈性及其耐永久壓縮定型。一般而言,相較於開放單胞結構聚合物材料,閉合單胞聚合物材料具有較高尺寸穩定性、較低濕氣吸收係數及較高強度。可製成閉合單胞聚合物材料之各種類型的聚合物材料包括例如但不限於聚矽氧、氯丁橡膠、乙烯-丙烯-二烯三聚物(EPT);使用乙烯-丙烯-二烯-單體(EPDM)、乙烯腈、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物製成之聚合物及複合物。 According to various embodiments of compressible gaskets in accordance with the teachings of the present invention, for use in a frame The compressible gasket material of the component seal and the panel seal may be selected from various compressible polymer materials such as, but not limited to, any type of closed cell polymer material, also referred to in the art as a cast rubber material or exhibit. Polymer material. Briefly, closed cell polymers are prepared by encapsulating a gas in a discrete unit cell, wherein each discrete unit cell is encapsulated by a polymeric material. The properties of the compressible closed cell polymer gasket material required for hermetic sealing of the frame and panel assembly include, but are not limited to, chemical attack against a wide range of chemical species, with excellent moisture barrier properties, in width The temperature range is elastic and resistant to permanent compression set. In general, closed unit cell materials have higher dimensional stability, lower moisture absorption coefficient, and higher strength than open cell structure polymeric materials. Various types of polymeric materials that can be made into closed unit cell polymeric materials include, for example, but are not limited to, polyfluorene oxide, neoprene, ethylene-propylene-diene terpolymer (EPT); use of ethylene-propylene-diene- Polymers and composites made from monomer (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof.

閉合單胞聚合物之合乎需要的材料性質僅在包含塊體材料 之單胞在使用期間保持完整的情況下才會得以維持。就該方面而言,以可超出針對閉合單胞聚合物所設定的材料規範、例如超出適用於指定溫度或壓縮範圍內之規範之方式使用此種材料,可引起墊片密封件之劣化。在用於密封框架面板區段中的框架構件及區段面板之閉合單胞聚合物墊片之各種實施例中,此類材料之壓縮不應超出約50%與約70%之間的撓度,且就最佳效能而言,可介於約20%與約40%撓度之間。 The desirable material properties of closed cell polymers are only in the inclusion of bulk materials The unit cell will be maintained while it remains intact during use. In this regard, the use of such materials in a manner that exceeds the material specifications set for the closed cell polymer, for example, beyond the specifications applicable to the specified temperature or compression range, can cause degradation of the gasket seal. In various embodiments of the closure unit cell gasket for sealing the frame members and the segment panels in the frame panel section, the compression of such materials should not exceed a deflection of between about 50% and about 70%. And for optimal performance, it can be between about 20% and about 40% deflection.

除閉合單胞可壓縮墊片材料之外,用於構造根據本教示內容 之氣體包體總成之實施例的具有所要屬性之一類可壓縮墊片材料之另一實例包括中空擠製可壓縮墊片材料類。作為一類材料,中空擠製墊片材料具 有所要屬性,包括但不限於其穩固地抵抗廣泛範圍化學物種之化學攻擊,擁有極佳濕氣障壁性質,在寬的溫度範圍內具有彈性及其耐永久壓縮定型。此類中空擠製可壓縮墊片材料可具有多種形狀因子,例如但不限於U型單胞、D型單胞、方形單胞、矩形單胞以及中空擠製墊片材料之多種定製形狀因子中的任何形狀因子。各種中空擠製墊片材料可由用於閉合單胞可壓縮墊片製作之聚合物材料製造。中空擠製墊片之各種實施例可由例如但不限於以下者製成:聚矽氧、氯丁橡膠、乙烯-丙烯-二烯三聚物(EPT);使用乙烯-丙烯-二烯-單體(EPDM)、乙烯基腈、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物製成之聚合物及複合物。此類中空單胞墊片材料之壓縮不應超出約50%撓度以便維持所要屬性。 In addition to closing the unit cell compressible gasket material, for construction according to the teachings Another example of a compressible gasket material having one of the desirable attributes of an embodiment of a gas inclusion assembly includes a hollow extruded compressible gasket material. As a class of materials, hollow extruded gasket materials Some attributes, including but not limited to chemical attacks that are robust against a wide range of chemical species, have excellent moisture barrier properties, are elastic over a wide temperature range and are resistant to permanent compression set. Such hollow extruded compressible gasket materials can have a variety of form factors such as, but not limited to, U-shaped unit cells, D-type unit cells, square unit cells, rectangular unit cells, and various custom shape factors for hollow extruded gasket materials. Any shape factor in . Various hollow extruded gasket materials can be made from polymeric materials used to seal unit cell compressible gaskets. Various embodiments of hollow extruded gaskets can be made, for example, but not limited to, polyfluorene, neoprene, ethylene-propylene-diene terpolymer (EPT); use of ethylene-propylene-diene-monomer Polymers and composites made of (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof. The compression of such hollow cell gasket materials should not exceed about 50% deflection in order to maintain the desired properties.

雖然已給出閉合單胞可壓縮墊片材料類別及中空擠製可壓 縮墊片材料類別作為實例,但是具有所要屬性之任何可壓縮墊片材料均可用於密封結構組件,諸如各種壁及頂板框架構件;並且如本教示內容所提供,密封面板區段框架內之各種面板。 Although the closed cell compressible gasket material category and hollow extrusion pressure have been given The shim material category is exemplified, but any compressible gasket material having the desired properties can be used for sealing structural components, such as various wall and ceiling frame members; and as provided by the teachings, various types within the sealing panel section frame panel.

圖10為本教示內容之頂板面板(諸如圖3之氣體包體總成 100之頂板面板250')之各種實施例的底部視圖。根據本教示內容之氣體包體總成之各種實施例,照明設備可安裝在頂板面板(諸如圖3之氣體包體總成100之頂板面板250')之內部頂表面上。如圖10中所描繪,具有內部部分251之頂板框架250可具有安裝在各種框架構件之內部部分上的照明設備。例如,頂板框架250可具有兩個頂板框架區段40,該等頂板框架區段共同具有兩個頂板框架橫樑42及44。每一頂板框架區段40可具有朝向頂板框架250內部定位的第一側41及朝向頂板框架250外部定位的第二側 43。對於根據本教示內容為氣體包體系統提供照明設備之各種實施例而言,可安裝數對照明元件46。每對照明元件46可包括鄰近第一側41之第一照明元件45及鄰近頂板框架區段40之第二側43之第二照明元件47。圖10中所示的照明元件之數目、定位及分組為示範性的。照明元件之數目及分組可以任何所要或適合方式變化。在各種實施例中,該等照明元件可平坦地安裝,而在其他實施例中,該等照明元件可經安裝以使得其可移動至各種位置及角度。照明元件之置放不限於頂部面板頂板433,而可另外地或以替代方式位於圖3中所示的氣體包體總成100之任何其他內部表面、外部表面及表面組合上。 Figure 10 is a top panel of the teachings (such as the gas inclusion assembly of Figure 3) A bottom view of various embodiments of a top panel panel 250' of 100. In accordance with various embodiments of the gas enclosure assembly of the present teachings, the illumination device can be mounted on an interior top surface of a ceiling panel, such as the roof panel 250' of the gas enclosure assembly 100 of FIG. As depicted in Figure 10, the top frame 250 having the inner portion 251 can have illumination devices mounted on the interior portions of the various frame members. For example, the roof frame 250 can have two roof frame sections 40 that collectively have two roof frame beams 42 and 44. Each top frame frame section 40 can have a first side 41 positioned toward the interior of the top plate frame 250 and a second side positioned toward the exterior of the top plate frame 250 43. For various embodiments that provide illumination for a gas enclosure system in accordance with the present teachings, pairs of illumination elements 46 can be installed. Each pair of lighting elements 46 can include a first lighting element 45 adjacent the first side 41 and a second lighting element 47 adjacent the second side 43 of the top plate frame section 40. The number, positioning, and grouping of lighting elements shown in Figure 10 are exemplary. The number and grouping of lighting elements can vary in any desired or suitable manner. In various embodiments, the lighting elements can be mounted flat, while in other embodiments, the lighting elements can be mounted such that they can be moved to various positions and angles. The placement of the lighting elements is not limited to the top panel top panel 433, but may additionally or alternatively be located on any other interior surface, exterior surface, and surface combination of the gas enclosure assembly 100 shown in FIG.

各種照明元件可包含任何數目、類型之燈或燈之組合,例如 鹵素燈、白色燈、白熾燈、弧光燈或發光二極體或裝置(LED)。例如,每一照明元件可包含1個LED至約100個LED,約10個LED至約50個LED或大於100個LED。LED或其他照明裝置可發射色譜內、色譜外或其組合之任何色彩或色彩之組合。根據用於噴墨列印OLED材料之氣體包體總成之各種實施例,由於一些材料對光的一些波長敏感,所以安裝在氣體包體總成中的照明裝置的光之波長可經具體選擇來避免處理期間的材料降解。 例如,4X冷白色LED可用作4X黃色LED或其任何組合。4X冷白色LED之一實例為可購自加利福尼亞州森尼維爾(Sunnyvale)之IDEC公司的LF1B-D4S-2THWW4。可使用的4X黃色LED之一實例為亦可購自IDEC公司的LF1B-D4S-2SHY6。LED或其他照明元件可定位在或懸掛於頂板框架250之內部部分251上或氣體包體總成之另一表面上的任何位置上。照明元件不限於LED。可使用任何適合的照明元件或照明元件之組合。圖11為 IDEC LED光譜之圖表,且展示相應於峰值強度為100%時之強度的X軸及相應於以奈米計之波長的Y軸。展示以下者之光譜:LF1B黃色類型、黃色螢光燈、LF1B白色類型LED、LF1B冷白色類型LED及LF1B紅色類型LED。 其他光譜及光譜之組合可根據本教示內容之各種實施例來使用。 Various lighting elements can include any number, type of lamp or combination of lights, such as Halogen, white, incandescent, arc or LED or device (LED). For example, each lighting element can include from 1 LED to about 100 LEDs, from about 10 LEDs to about 50 LEDs or greater than 100 LEDs. LEDs or other illumination devices can emit any color or combination of colors within the chromatogram, outside of the chromatogram, or a combination thereof. According to various embodiments of gas inclusion assemblies for ink jet printing OLED materials, the wavelength of light of the illumination device mounted in the gas enclosure assembly can be specifically selected because some materials are sensitive to some wavelengths of light. To avoid material degradation during processing. For example, a 4X cool white LED can be used as a 4X yellow LED or any combination thereof. An example of a 4X cold white LED is LF1B-D4S-2THWW4, available from IDEC Corporation of Sunnyvale, California. An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, also available from IDEC Corporation. The LED or other lighting element can be positioned or suspended from the inner portion 251 of the top plate frame 250 or anywhere on the other surface of the gas enclosure assembly. The lighting elements are not limited to LEDs. Any suitable lighting element or combination of lighting elements can be used. Figure 11 is A chart of the IDEC LED spectrum and showing the X-axis corresponding to the intensity at 100% peak intensity and the Y-axis corresponding to the wavelength in nanometers. Show the spectrum of the following: LF1B yellow type, yellow fluorescent light, LF1B white type LED, LF1B cold white type LED and LF1B red type LED. Other combinations of spectra and spectra may be used in accordance with various embodiments of the present teachings.

根據本教示內容之氣體包體系統可具有在氣體包體總成內 部之氣體循環及過濾系統。此種內部過濾系統可具有處於該內部內之複數個風扇過濾器單元,且可經配置以在該內部內提供氣體之層流。層流可處於自內部頂部至內部底部之方向上或處於任何其他方向上。雖然由循環系統所產生之氣體流動不必為層流式,但是氣體層流可用以確保氣體在該內部中的徹底及完全翻轉。氣體層流亦可用以使紊流最小化,此種紊流為不合需要的,因為其可導致環境中之粒子聚集在此等紊流區域中,從而防止過濾系統將此等粒子自環境移除。 A gas enclosure system according to the teachings can have a gas inclusion body assembly Department of gas circulation and filtration system. Such an internal filtration system can have a plurality of fan filter units within the interior and can be configured to provide a laminar flow of gas within the interior. The laminar flow can be in the direction from the inner top to the inner bottom or in any other direction. Although the gas flow generated by the circulatory system does not have to be laminar, the gas laminar flow can be used to ensure complete and complete overturning of the gas in the interior. Gas laminar flow can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in such turbulent regions, thereby preventing the filtration system from removing such particles from the environment. .

圖12描繪循環及過濾系統1500之右前部假想透視圖,該循 環及過濾系統可包括氣體包體總成100之管道系統總成1501及風扇過濾器單元總成1502。包體管道系統總成1501可具有前壁面板管道系統總成1510。如圖所示,前壁面板管道系統總成1510可具有前壁面板入口管道1512、第一前壁面板豎板1514及第二前壁面板豎板1516,該等前壁面板豎板二者均與前壁面板入口管道1512流體連通。第一前壁面板豎板1514展示為具有出口1515,該出口與風扇過濾器單元罩蓋103之頂板管道1505以可密封方式嚙合。以相似方式,第二前壁面板豎板1516展示為具有出口1517,該出口與風扇過濾器單元罩蓋103之頂板管道1507以可密封方式嚙合。就該方面而言,前壁面板管道系統總成1510提供用於利用前壁面板入口管道 1512來使惰性氣體在氣體包體系統內自底部循環穿過每一前壁面板豎板1514及1516,且將空氣分別遞送穿過出口1505及1507,以使得空氣可由例如風扇過濾器單元總成1502之風扇過濾器單元1552過濾。鄰近風扇過濾器單元1552的是熱交換器1562,該熱交換器作為熱調節系統之部分可維持惰性氣體在所要溫度下循環穿過氣體包體總成100。 Figure 12 depicts a hypothetical perspective view of the right front of the circulation and filtration system 1500. The ring and filtration system can include a piping system assembly 1501 of the gas inclusion assembly 100 and a fan filter unit assembly 1502. The body duct system assembly 1501 can have a front wall panel duct system assembly 1510. As shown, the front wall panel duct system assembly 1510 can have a front wall panel inlet duct 1512, a first front wall panel riser 1514, and a second front wall panel riser 1516, both of which are front panel panel risers It is in fluid communication with the front wall panel inlet duct 1512. The first front wall panel riser 1514 is shown with an outlet 1515 that is sealably engaged with the top plate duct 1505 of the fan filter unit cover 103. In a similar manner, the second front wall panel riser 1516 is shown with an outlet 1517 that is sealably engaged with the top plate conduit 1507 of the fan filter unit cover 103. In this regard, the front wall panel duct system assembly 1510 is provided for utilizing the front wall panel inlet duct 1512 to circulate the inert gas from the bottom through each of the front wall panel risers 1514 and 1516 in the gas enclosure system and to deliver air through the outlets 1505 and 1507, respectively, such that the air can be assembled, for example, by a fan filter unit. The fan filter unit 1552 of 1502 filters. Adjacent to the fan filter unit 1552 is a heat exchanger 1562 that, as part of the thermal conditioning system, maintains the inert gas circulating through the gas inclusion assembly 100 at the desired temperature.

右壁面板管道系統總成1530可具有右壁面板入口管道 1532,該右壁面板入口管道經由右壁面板第一豎板1534及右壁面板第二豎板1536與右壁面板上部管道1538流體連通。右壁面板上部管道1538可具有第一管道入口端1535及第二管道出口端1537,該第二管道出口端1537與後壁管道系統總成1540之後壁面板上部管道1546流體連通。左壁面板管道系統總成1520可具有與對右壁面板總成1530所述相同之組件,其中圖12中明示經由第一左壁面板豎板1524及第一左壁面板豎板1524與左壁面板上部管道(未圖示)流體連通之左壁面板入口管道1522。後壁面板管道系統總成1540可具有後壁面板入口管道1542,該後壁面板入口管道與左壁面板總成1520及右壁面板總成1530流體連通。另外,後壁面板管道系統總成1540可具有後壁面板底部管道1544,該後壁面板底部管道可具有後壁面板第一入口1541及後壁面板第二入口1543。後壁面板底部管道1544可經由第一隔框1547及第二隔框1549與後壁面板上部管道1546流體連通,其中隔框結構可用於例如但不限於將各種電纜束、導線束及管件束及類似物自氣體包體總成100外部饋送至內部中。管道開口1533提供用於將電纜束、導線束及管件束及類似物移出後壁面板上部管道1546,該等電纜束、導線束及管件束及類似物可經由隔框1549而穿過後壁面板上部管道1546。隔框 1547及隔框1549可使用如先前所述之可移除嵌入面板來密閉式密封於外部上。後壁面板上部管道經由通氣孔545與例如但不限於風扇過濾器單元1554流體連通,該通氣孔之一轉角展示於圖12中。就該方面而言,左壁面板管道系統總成1520、右壁面板管道系統總成1530及後壁面板管道系統總成1540提供用於分別利用壁面板入口管道1522、1532及1542以及後面板下部管道1544來使惰性氣體於氣體包體總成內自底部循環,該後面板下部管道如先前所述經由各種豎板、管道、隔框通道及類似物與通氣孔1545流體連通。因此,空氣可由例如循環及過濾系統1500之風扇過濾器單元總成1502之風扇過濾器單元1554過濾。鄰近風扇過濾器單元1554的是熱交換器1564,該熱交換器作為熱調節系統之部分可維持惰性氣體在所要溫度下循環穿過氣體包體總成100。如隨後將更詳細論述,用於風扇過濾器單元總成、諸如包括循環及過濾系統1500之風扇過濾器單元1552及1554的風扇過濾器單元總成1502的風扇過濾器單元之數目、尺寸及形狀可根據處理期間列印系統中基板之實體位置來選擇。相對於基板之實體行程來選擇的用於風扇過濾器單元總成之風扇過濾器單元之數目、尺寸及形狀可在基板製造製程期間鄰近基板提供低粒子區。 The right wall panel duct system assembly 1530 can have a right wall panel inlet duct 1532, the right wall panel inlet duct is in fluid communication with the right wall panel upper duct 1538 via the right wall panel first riser 1534 and the right wall panel second riser 1536. The right wall panel upper conduit 1538 can have a first conduit inlet end 1535 and a second conduit outlet end 1537 that is in fluid communication with the rear wall duct system assembly 1540 followed by the wall panel upper conduit 1546. The left wall panel duct system assembly 1520 can have the same components as described for the right wall panel assembly 1530, wherein the first left wall panel riser 1524 and the first left wall panel riser 1524 and the left wall are illustrated in FIG. The upper wall duct (not shown) is in fluid communication with the left wall panel inlet duct 1522. The rear wall panel duct system assembly 1540 can have a rear wall panel inlet duct 1542 that is in fluid communication with the left wall panel assembly 1520 and the right wall panel assembly 1530. Additionally, the rear wall panel duct system assembly 1540 can have a rear wall panel bottom duct 1544 that can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. The rear wall panel bottom duct 1544 can be in fluid communication with the rear wall panel upper duct 1546 via the first bulkhead 1547 and the second bulkhead 1549, wherein the bulkhead structure can be used, for example, but not limited to, to bundle various cable bundles, wire harnesses, and pipe bundles. The analog is fed from the outside of the gas inclusion assembly 100 to the interior. A conduit opening 1533 is provided for removing cable bundles, bundles and bundles of tubes and the like from the rear wall panel upper conduit 1546, which may pass through the upper portion of the rear wall panel via the bulkhead 1549. Pipe 1546. Spacer 1547 and bulkhead 1549 can be hermetically sealed to the exterior using a removable inset panel as previously described. The rear wall panel upper duct is in fluid communication with, for example, but not limited to, a fan filter unit 1554 via a vent 545, one of which is shown in FIG. In this regard, the left wall panel duct system assembly 1520, the right wall panel duct system assembly 1530, and the rear wall panel duct system assembly 1540 are provided for utilizing the wall panel inlet ducts 1522, 1532, and 1542, respectively, and the lower portion of the rear panel. A conduit 1544 is used to circulate the inert gas from the bottom within the gas inclusion assembly, which is in fluid communication with the vent 1545 via various risers, conduits, bulkhead passages, and the like, as previously described. Thus, air may be filtered by fan filter unit 1554, such as fan filter unit assembly 1502 of circulation and filtration system 1500. Adjacent to the fan filter unit 1554 is a heat exchanger 1564 that maintains the inert gas as part of the thermal conditioning system circulating through the gas inclusion assembly 100 at the desired temperature. The number, size and shape of the fan filter unit for the fan filter unit assembly, such as the fan filter unit assembly 1502 including the fan filter units 1552 and 1554 of the circulation and filtration system 1500, as discussed in more detail later, It can be selected based on the physical location of the substrate in the printing system during processing. The number, size, and shape of the fan filter units for the fan filter unit assembly selected relative to the physical travel of the substrate can provide a low particle area adjacent the substrate during the substrate fabrication process.

在圖12中,展示穿過開口1533之電纜饋送。如隨後將更詳 細論述,本教示內容之氣體包體總成之各種實施例提供用於使電纜束、導線束及管件束及類似物穿過管道系統。為消除圍繞此類束形成之洩漏路徑,可使用各種使用保形材料來密封呈束狀的不同尺寸電纜、導線及管件之方法。圖12中亦展示包體管道系統總成1501之導管I及導管II,該等導管展示為風扇過濾器單元罩蓋103之部分。導管I將惰性氣體之出口提供至 外部氣體純化系統,而導管II提供純化惰性氣體至氣體包體總成100內部之循環及過濾迴路的返回。 In Figure 12, a cable feed through opening 1533 is shown. As will be more detailed later In detail, various embodiments of the gas inclusion assembly of the present teachings are provided for passing cable bundles, bundles of wire and bundles of tubes and the like through a piping system. To eliminate leakage paths formed around such bundles, various methods of using conformal materials to seal bundles of different sizes of cables, wires, and tubing can be used. Also shown in Fig. 12 is conduit I and conduit II of the body conduit system assembly 1501, which are shown as part of the fan filter unit cover 103. Conduit I provides an outlet for the inert gas to An external gas purification system, while conduit II provides a recycle of the inert gas to the interior of the gas inclusion assembly 100 and the return of the filtration circuit.

在圖13中,展示包體管道系統總成1501之頂部假想透視 圖。可見左壁面板管道系統總成1520與右壁面板管道系統總成1530之對稱性質。對於右壁面板管道系統總成1530而言,右壁面板入口管道1532經由右壁面板第一豎板1534及右壁面板第二豎板1536與右壁面板上部管道1538流體連通。右壁面板上部管道1538可具有第一管道入口端1535及第二管道出口端1537,該第二管道出口端1537與後壁管道系統總成1540之後壁面板上部管道1546流體連通。類似地,左壁面板管道系統總成1520可具有左壁面板入口管道1522,該左壁面板入口管道經由左壁面板第一豎板1524及左壁面板第二豎板1526與左壁面板上部管道1528流體連通。左壁面板上部管道1528可具有第一管道入口端1525及第二管道出口端1527,該第二管道出口端1527與後壁管道系統總成1540之後壁面板上部管道1546流體連通。 另外,後壁面板管道總成可具有後壁面板入口管道1542,該後壁面板入口管道與左壁面板總成1520及右壁面板總成1530流體連通。另外,後壁面板管道系統總成1540可具有後壁面板底部管道1544,該後壁面板底部管道可具有後壁面板第一入口1541及後壁面板第二入口1543。後壁面板底部管道1544可經由第一隔框1547及第二隔框1549與後壁面板上部管道1546流體連通。如圖12及圖13中所示,管道系統總成1501可提供惰性氣體自前壁面板管道系統總成1510之有效循環,該有效循環使惰性氣體分別經由前壁面板出口1515及1517自前壁面板入口管道1512循環至頂板面板管道1505及1507,且提供惰性氣體自左壁面板總成1520、右壁面板總成1530及後壁 面板管道系統總成1540之有效循環,該等有效循環使空氣分別自入口管道1522、1532及1542循環至通氣孔1545。一旦惰性氣體經由頂板面板管道1505及1507及通氣孔1545排入包體100之風扇過濾器單元罩蓋103下方之包體區域中,如此排出的惰性氣體可經由風扇過濾器單元總成1502之風扇過濾器單元1552及1554來過濾。另外,循環惰性氣體可藉由為熱調節系統之部分的熱交換器1562及1564來維持在所要溫度下。 In Figure 13, the top imaginary perspective of the packaged pipe system assembly 1501 is shown. Figure. The symmetrical nature of the left wall panel duct system assembly 1520 and the right wall panel duct system assembly 1530 can be seen. For the right wall panel duct system assembly 1530, the right wall panel inlet duct 1532 is in fluid communication with the right wall panel upper duct 1538 via the right wall panel first riser 1534 and the right wall panel second riser 1536. The right wall panel upper conduit 1538 can have a first conduit inlet end 1535 and a second conduit outlet end 1537 that is in fluid communication with the rear wall duct system assembly 1540 followed by the wall panel upper conduit 1546. Similarly, the left wall panel duct system assembly 1520 can have a left wall panel inlet duct 1522 that passes through the left wall panel first riser 1524 and the left wall panel second riser 1526 and the left wall panel upper duct 1528 is in fluid communication. The left wall panel upper duct 1528 can have a first duct inlet end 1525 and a second duct outlet end 1527 that is in fluid communication with the rear wall duct system assembly 1540 followed by the wall panel upper duct 1546. Additionally, the rear wall panel duct assembly can have a rear wall panel inlet duct 1542 that is in fluid communication with the left wall panel assembly 1520 and the right wall panel assembly 1530. Additionally, the rear wall panel duct system assembly 1540 can have a rear wall panel bottom duct 1544 that can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. The rear wall panel bottom duct 1544 can be in fluid communication with the rear wall panel upper duct 1546 via the first bulkhead 1547 and the second bulkhead 1549. As shown in Figures 12 and 13, the ductwork assembly 1501 provides an effective circulation of inert gas from the front wall panel ductwork assembly 1510 that allows inert gas to pass from the front wall via the front wall panel outlets 1515 and 1517, respectively. The panel inlet duct 1512 is circulated to the top panel ducts 1505 and 1507 and provides inert gas from the left wall panel assembly 1520, the right wall panel assembly 1530 and the rear wall. The effective circulation of the panel duct system assembly 1540 circulates air from the inlet ducts 1522, 1532, and 1542 to the vents 1545, respectively. Once the inert gas is discharged into the body region under the fan filter unit cover 103 of the package 100 via the top panel ducts 1505 and 1507 and the vent holes 1545, the exhaust gas thus discharged can pass through the fan of the fan filter unit assembly 1502. Filter units 1552 and 1554 are used for filtering. Additionally, the recycle inert gas can be maintained at the desired temperature by heat exchangers 1562 and 1564 that are part of the thermal conditioning system.

圖14為包體管道系統總成1501之底部假想視圖。入口管道 總成1509包括彼此流體連通之前壁面板入口管道1512、左壁面板入口管道1522、右壁面板入口管道1532及後壁面板入口管道1542。如先前所論述,導管I將惰性氣體之出口提供至外部氣體純化系統,而導管II提供純化惰性氣體至氣體包體總成100內部之循環及過濾迴路的返回。 Figure 14 is an imaginary view of the bottom of the body piping system assembly 1501. Inlet pipe The assembly 1509 includes a front wall panel inlet duct 1512, a left wall panel inlet duct 1522, a right wall panel inlet duct 1532, and a rear wall panel inlet duct 1542 in fluid communication with one another. As previously discussed, the conduit I provides an outlet for the inert gas to the external gas purification system, while the conduit II provides a recycle of the purified inert gas to the interior of the gas inclusion assembly 100 and the return of the filtration loop.

對於入口管道系統總成1509中包括的每一入口管道而言, 跨於每一管道底部存在均勻分佈的表面開口(apparent opening),出於本教示內容之目的將各組開口具體突顯為前壁面板入口管道1512之開口1504、左壁面板入口管道1522之開口1521、右壁面板入口管道1532之開口1531及右壁面板入口管道1542之開口1541。由於此類開口為跨於每一入口管道底部之表面開口,所以此類開口提供用於惰性氣體在包體100內之有效吸收以用於持續循環及過濾。氣體包體總成之各種實施例的惰性氣體之持續循環及過濾為粒子控制系統之一部分,其可提供用於在氣體包體系統之各種實施例內維持大體上無粒子環境。氣體循環及過濾系統之各種實施例可經設計來提供具有空浮微粒之低粒子環境,其滿足國際標準組織標準(ISO)14644-1:1999之標準:「潔淨室及相關聯受控環境-第1部分:空氣潔淨度的 分類」,如第1類至第5類所指定。 For each inlet pipe included in the inlet duct system assembly 1509, There is an evenly distributed surface opening across the bottom of each pipe, and for each of the purposes of this teaching, each set of openings is specifically highlighted as an opening 1504 of the front wall panel inlet duct 1512 and an opening 1521 of the left wall panel inlet duct 1522. The opening 1531 of the right wall panel inlet duct 1532 and the opening 1541 of the right wall panel inlet duct 1542. Since such openings are surface openings across the bottom of each inlet conduit, such openings provide for effective absorption of inert gas within the enclosure 100 for continuous cycling and filtration. The continuous circulation and filtration of the inert gas of various embodiments of the gas inclusion body assembly is part of a particle control system that can be provided for maintaining a substantially particle free environment within various embodiments of the gas inclusion system. Various embodiments of gas circulation and filtration systems can be designed to provide a low particle environment with airborne particulates that meets the International Standards of Organizations (ISO) 14644-1:1999 standard: "Clean rooms and associated controlled environments - Part 1: Air cleanliness Classification, as specified in categories 1 through 5.

除利用氣體循環及過濾系統來提供氣體之層流從而確保氣 體在內部中的徹底及完全翻轉的氣體包體系統之外,可提供利用複數個熱交換器之熱調節系統來維持該內部中之所要溫度。例如,複數個熱交換器可提供來與風扇或另一氣體循環裝置一起操作、與其相鄰或與其結合使用。氣體純化迴路可經配置來經由包體外部之至少一個氣體純化組件使來自氣體包體總成內部內之氣體循環。就該方面而言,氣體包體總成內部之循環及過濾系統與氣體包體總成外部之氣體純化迴路結合可提供大體上低微粒惰性氣體之持續循環,該大體上低微粒惰性氣體在整個氣體包體系統中具有大體上低含量之反應性物種。具有氣體純化系統之氣體包體系統之各種實施例可經配置來維持極低含量之非所要組分,例如有機溶劑及其蒸氣,以及水、水蒸氣、氧及類似物。 In addition to the use of gas circulation and filtration systems to provide a laminar flow of gas to ensure gas In addition to the thoroughly and completely inverted gas inclusion system in the interior, a thermal conditioning system utilizing a plurality of heat exchangers can be provided to maintain the desired temperature in the interior. For example, a plurality of heat exchangers can be provided for operation with, adjacent to or in conjunction with a fan or another gas circulation device. The gas purification loop can be configured to circulate gas from within the interior of the gas enclosure assembly via at least one gas purification component external to the enclosure. In this regard, the internal circulation and filtration system of the gas inclusion assembly, in combination with the gas purification circuit external to the gas inclusion assembly, provides a continuous circulation of substantially low particulate inert gas throughout the entire process. There are substantially low levels of reactive species in the gas inclusion system. Various embodiments of a gas inclusion system having a gas purification system can be configured to maintain very low levels of undesirable components, such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.

圖15為展示氣體包體系統502之示意圖。根據本教示內容 之氣體包體系統502之各種實施例可包括用於容納列印系統之氣體包體總成1101、與氣體包體總成1101流體連通之氣體純化迴路3130及至少一個熱調節系統3140。另外,氣體包體系統502之各種實施例可具有加壓惰性氣體再循環系統3000,其可供應惰性氣體用於操作各種裝置,諸如用於OLED列印系統之基板浮動台。加壓惰性氣體再循環系統3000之各種實施例可利用壓縮機、鼓風機及兩者之組合作為加壓惰性氣體再循環系統3000之各種實施例的來源,如隨後將更詳細論述。另外,氣體包體系統502可具有在氣體包體系統502內部之循環及過濾系統(未圖示)。 FIG. 15 is a schematic diagram showing a gas inclusion system 502. According to the teachings Various embodiments of the gas inclusion system 502 can include a gas inclusion assembly 1101 for housing a printing system, a gas purification circuit 3130 in fluid communication with the gas inclusion assembly 1101, and at least one thermal conditioning system 3140. Additionally, various embodiments of the gas inclusion system 502 can have a pressurized inert gas recirculation system 3000 that can supply an inert gas for operating various devices, such as a substrate floating table for an OLED printing system. Various embodiments of pressurized inert gas recirculation system 3000 may utilize a compressor, a blower, and a combination of both as a source of various embodiments of pressurized inert gas recirculation system 3000, as will be discussed in greater detail below. Additionally, the gas enclosure system 502 can have a circulation and filtration system (not shown) within the gas enclosure system 502.

如圖15中所描繪,對於根據本教示內容之氣體包體總成之 各種實施例而言,管道系統之設計可將循環穿過氣體純化迴路3130之惰性氣體與在氣體包體總成之各種實施例內部持續過濾及循環之惰性氣體分離。氣體純化迴路3130包括自氣體包體總成1101至溶劑移除組件3132且隨後到達氣體沖洗系統3134之出口管線3131。純化除去溶劑及諸如氧及水蒸氣之其他反應性氣體物種的惰性氣體隨後經由入口管線3133返回至氣體包體總成1101。氣體純化迴路3130亦可包括適當的導管及連接件,以及感測器,例如氧、水蒸氣及溶劑蒸氣感測器。諸如風扇、鼓風機或馬達及類似物之氣體循環單元可單獨提供在或整合在例如氣體純化系統3134中,以便使氣體循環穿過氣體純化迴路3130。根據氣體包體總成之各種實施例,雖然溶劑移除系統3132及氣體純化系統3134在圖15中示意地展示為獨立單元,但是溶劑移除系統3132及氣體純化系統3134可作為單一純化單元來予以容納。 As depicted in Figure 15, for a gas inclusion assembly in accordance with the teachings herein In various embodiments, the piping system is designed to separate the inert gas circulating through the gas purification circuit 3130 from the inert gas continuously filtered and circulated within various embodiments of the gas inclusion assembly. The gas purification circuit 3130 includes an outlet line 3131 from the gas inclusion body assembly 1101 to the solvent removal assembly 3132 and then to the gas rinsing system 3134. The inert gas purified to remove solvent and other reactive gas species such as oxygen and water vapor is then returned to gas inclusion assembly 1101 via inlet line 3133. Gas purification circuit 3130 can also include suitable conduits and connections, as well as sensors such as oxygen, water vapor, and solvent vapor sensors. A gas circulation unit such as a fan, blower or motor and the like may be provided separately or integrated in, for example, a gas purification system 3134 to circulate gas through the gas purification circuit 3130. Depending on various embodiments of the gas inclusion body assembly, although solvent removal system 3132 and gas purification system 3134 are shown schematically as separate units in Figure 15, solvent removal system 3132 and gas purification system 3134 can be used as a single purification unit. To accommodate.

圖15之氣體純化迴路3130可具有置放在氣體純化系統3134 上游之溶劑移除系統3132,以使得自氣體包體總成1101循環之惰性氣體經由出口管線3131通過溶劑移除系統3132。根據各種實施例,溶劑移除系統3132可為基於吸收來自通過圖15之溶劑移除系統3132之惰性氣體的溶劑蒸氣之溶劑捕集系統。例如但不限於諸如活性炭、分子篩及類似物之吸附劑的一或多個床可有效地移除多種有機溶劑蒸氣。對於氣體包體系統之各種實施例而言,可採用冷捕集技術來移除溶劑移除系統3132中之溶劑蒸氣。如先前所述,對於根據本教示內容之氣體包體系統之各種實施例而言,諸如氧、水蒸氣及溶劑蒸氣感測器之感測器可用於監視此類物種自持續循環穿過氣體包體系統(諸如圖15之氣體包體系統502)之惰性氣體的有效 移除。溶劑移除系統之各種實施例可指示諸如活性炭、分子篩及類似物之吸附劑何時達到容量,以使得吸附劑之一或多個床可再生或更換。分子篩之再生可涉及加熱分子篩、使分子篩與混合氣體接觸、其組合及類似者。 配置來捕集包括氧、水蒸氣及溶劑之各種物種的分子篩可藉由加熱及暴露於包含氫之混合氣體來再生,該混合氣體為例如包含約96%的氮及4%的氫之混合氣體,該等百分比係以體積計或以重量計。活性炭之物理再生可在惰性環境下使用類似加熱程序來進行。 The gas purification circuit 3130 of Figure 15 can be placed in a gas purification system 3134 The upstream solvent removal system 3132 is such that inert gas circulated from the gas inclusion assembly 1101 passes through the solvent removal system 3132 via the outlet line 3131. According to various embodiments, the solvent removal system 3132 can be a solvent capture system based on solvent vapors that absorb inert gases from the solvent removal system 3132 of FIG. One or more beds such as, but not limited to, adsorbents such as activated carbon, molecular sieves, and the like, are effective to remove a variety of organic solvent vapors. For various embodiments of the gas inclusion system, cold trapping techniques can be employed to remove solvent vapors from the solvent removal system 3132. As previously described, for various embodiments of gas inclusion systems in accordance with the present teachings, sensors such as oxygen, water vapor, and solvent vapor sensors can be used to monitor such species from a continuous cycle through a gas package. The inert gas of the bulk system (such as the gas inclusion system 502 of Figure 15) is effective Remove. Various embodiments of the solvent removal system can indicate when the adsorbent, such as activated carbon, molecular sieves, and the like, reaches a capacity such that one or more beds of the adsorbent can be regenerated or replaced. Regeneration of the molecular sieve can involve heating the molecular sieve, contacting the molecular sieve with the mixed gas, combinations thereof, and the like. The molecular sieve configured to capture various species including oxygen, water vapor, and solvent can be regenerated by heating and exposure to a mixed gas containing hydrogen, which is, for example, a mixed gas containing about 96% of nitrogen and 4% of hydrogen. The percentages are by volume or by weight. Physical regeneration of activated carbon can be carried out using a similar heating procedure in an inert environment.

任何適合的氣體純化系統均可用於圖15之氣體純化迴路 3130之氣體純化系統3134。例如可購自新罕布夏斯特拉瑟姆(Statham)的MBRAUN Inc.或馬薩諸塞州埃塞克斯(Amesbury)的Innovative Technology之氣體純化系統可適用於整合至根據本教示內容之氣體包體總成之各種實施例中。氣體純化系統3134可用於純化氣體包體系統502內的一或多種惰性氣體,例如純化氣體包體總成內的整體氣體氣氛。如先前所述,為使氣體循環穿過氣體純化迴路3130,氣體純化系統3134可具有氣體循環單元,諸如風扇、鼓風機或馬達及類似物。就該方面而言,氣體純化系統可取決於包體之體積來選擇,該包體之體積可界定使惰性氣體移動穿過氣體純化系統之體積流率。對於具有體積至多約4m3的氣體包體總成之氣體包體系統之各種實施例而言,可使用可以約84m3/h移動之氣體純化系統。對於具有體積至多約10m3的氣體包體總成之氣體包體系統之各種實施例而言,可使用可以約155m3/h移動之氣體純化系統。對於具有介於約52m3與114m3之間體積的氣體包體總成之各種實施例而言,可使用一個以上氣體純化系統。 Any suitable gas purification system can be used in the gas purification system 3134 of the gas purification circuit 3130 of FIG. For example, a gas purification system available from MBRAUN Inc. of Statham, New Jersey or Innovative Technology of Amesbury, Mass., can be adapted for integration into gas inclusions in accordance with the teachings herein. The various embodiments of the assembly. The gas purification system 3134 can be used to purify one or more inert gases within the gas inclusion system 502, such as the overall gas atmosphere within the purified gas inclusion assembly. As previously described, to circulate gas through the gas purification circuit 3130, the gas purification system 3134 can have a gas circulation unit such as a fan, blower or motor, and the like. In this regard, the gas purification system can be selected depending on the volume of the inclusion body, the volume of which can define the volumetric flow rate at which the inert gas moves through the gas purification system. For various embodiments of a gas inclusion system having a gas inclusion body having a volume of up to about 4 m3, a gas purification system that can move about 84 m3 /h can be used. For various embodiments of a gas inclusion system having a gas inclusion body having a volume of up to about 10 m 3 , a gas purification system that can move at about 155 m 3 /h can be used. For various embodiments having a gas inclusion body volume between about 52 m 3 and 114 m 3 , more than one gas purification system can be used.

任何適合的氣體過濾器或純化裝置均可包括在本教示內容 之氣體沖洗系統3134中。在一些實施例中,氣體純化系統可包含兩個平行的純化裝置,以使得該等裝置之一可離線取出用於維護而另一裝置可用於繼續系統操作而不中斷。在一些實施例中,例如,氣體純化系統可包含一或多個分子篩。在一些實施例中,氣體純化系統可包含至少第一分子篩及第二分子篩,以使得在該等分子篩之一變得以雜質飽和或另外視為不足以有效操作時,系統可切換至另一分子篩,同時使飽和或非有效分子篩再生。 可提供控制單元用於判定每一分子篩之操作效率,用於在不同分子篩之操作之間進行切換,用於使一或多個分子篩再生,或用於其組合。如先前所述,分子篩可獲再生及再用。 Any suitable gas filter or purification device can be included in this teaching The gas is flushed into the system 3134. In some embodiments, the gas purification system can include two parallel purification devices such that one of the devices can be taken offline for maintenance while the other device can be used to continue system operation without interruption. In some embodiments, for example, a gas purification system can include one or more molecular sieves. In some embodiments, the gas purification system can include at least a first molecular sieve and a second molecular sieve such that when one of the molecular sieves becomes saturated with impurities or otherwise deemed insufficient for efficient operation, the system can be switched to another molecular sieve, At the same time, the saturated or non-effective molecular sieve is regenerated. A control unit can be provided for determining the operational efficiency of each molecular sieve for switching between operations of different molecular sieves, for regenerating one or more molecular sieves, or for combinations thereof. As previously described, the molecular sieve can be regenerated and reused.

圖15之熱調節系統3140可包括至少一個冷卻器3142,該冷 卻器可具有用於使冷卻劑循環至氣體包體總成中之流體出口管線3141及用於使冷卻劑返回至冷卻器之流體入口管線3143。至少一個流體冷卻器3142可提供用於冷卻氣體包體系統502內之氣體氣氛。對於本教示內容之氣體包體系統之各種實施例而言,流體冷卻器3142將冷卻流體遞送至包體內之熱交換器,其中惰性氣體在包體內部之過濾系統上傳遞。至少一個流體冷卻器亦可具備氣體包體系統502以便冷卻自包封於氣體包體系統502內之設備放出的熱。例如但在不限制的情況下,至少一個流體冷卻器亦可提供用於氣體包體系統502以便冷卻自OLED列印系統放出的熱。熱調節系統3140可包含熱交換或帕耳帖裝置,且可具有各種冷卻容量。例如,對於氣體包體系統之各種實施例而言,冷卻器可提供介於約2kW與約20kW之間的冷卻容量。氣體包體系統之各種實施例可具有可冷卻一或多種流體之複數個 流體冷卻器。在一些實施例中,流體冷卻器可將多種流體用作冷卻劑,該等流體例如但不限於作為熱交換流體之水、防凍劑、致冷劑及其組合。適當的無洩漏鎖定連接件可用於連接相關聯之導管與系統組件。 The thermal conditioning system 3140 of Figure 15 can include at least one cooler 3142 that is cold The damper may have a fluid outlet line 3141 for circulating coolant into the gas inclusion assembly and a fluid inlet line 3143 for returning the coolant to the chiller. At least one fluid cooler 3142 can provide a gas atmosphere for cooling the gas inclusion system 502. For various embodiments of the gas enclosure system of the present teachings, the fluid cooler 3142 delivers a cooling fluid to a heat exchanger within the enclosure, wherein the inert gas is delivered over a filtration system within the enclosure. The at least one fluid cooler may also be provided with a gas enclosure system 502 for cooling the heat evolved from equipment enclosed within the gas enclosure system 502. For example, but without limitation, at least one fluid cooler may also be provided for the gas inclusion system 502 to cool the heat evolved from the OLED printing system. The thermal conditioning system 3140 can include a heat exchange or Peltier device and can have various cooling capacities. For example, for various embodiments of a gas inclusion system, the chiller can provide a cooling capacity between about 2 kW and about 20 kW. Various embodiments of the gas inclusion system can have a plurality of ones that can cool one or more fluids Fluid cooler. In some embodiments, the fluid cooler can use a variety of fluids as the coolant, such as, but not limited to, water as a heat exchange fluid, antifreeze, refrigerant, and combinations thereof. A suitable leak-free locking connection can be used to connect the associated conduit and system components.

如圖15中所示,氣體包體系統之各種實施例可包括加壓惰 性氣體再循環系統3000。加壓惰性氣體再循環迴路之各種實施例可利用壓縮機、鼓風機及其組合。 As shown in Figure 15, various embodiments of the gas inclusion system can include pressurized inertia Gas recirculation system 3000. Various embodiments of pressurized inert gas recirculation loops may utilize compressors, blowers, and combinations thereof.

例如,如圖16中所示,氣體包體系統503之各種實施例可 具有外部氣體迴路3200,該外部氣體迴路用於整合及控制適用於操作氣體包體系統503之各種觀點的惰性氣體源3201及潔淨乾燥空氣(CDA)源3203。氣體包體系統503亦可包括內部粒子過濾及氣體循環系統之各種實施例,以及如先前所述之外部氣體純化系統之各種實施例。除用於整合及控制惰性氣體源3201及CDA源3203之外部迴路3200之外,氣體包體系統503可具有壓縮機迴路3250,該壓縮機迴路可供應惰性氣體用於操作可安置於氣體包體系統503內部中的各種裝置及設備。 For example, as shown in FIG. 16, various embodiments of gas inclusion system 503 can be There is an external gas circuit 3200 for integrating and controlling an inert gas source 3201 and a clean dry air (CDA) source 3203 suitable for operating various aspects of the gas inclusion system 503. Gas inclusion system 503 can also include various embodiments of internal particle filtration and gas circulation systems, as well as various embodiments of external gas purification systems as previously described. In addition to the external circuit 3200 for integrating and controlling the inert gas source 3201 and the CDA source 3203, the gas enclosure system 503 can have a compressor circuit 3250 that can supply an inert gas for operation to be placed in the gas enclosure Various devices and devices within the system 503.

圖16之壓縮機迴路3250可包括經配置處於流體連通之壓縮 機3262、第一累積器3264及第二累積器3268。壓縮機3262可經配置來將自氣體包體總成1101吸取之惰性氣體壓縮至所要壓力。壓縮機迴路3250之入口側可經由氣體包體總成出口3252經管線3254與氣體包體總成1101流體連通,該線路具有閥3256及止回閥3258。壓縮機迴路3250可經由外部氣體迴路3200與氣體包體總成1101於壓縮機迴路3250之出口側上流體連通。累積器3264可安置在壓縮機3262與壓縮機迴路3250同外部氣體迴路3200之接合面之間,且可經配置來產生5psig或更高的壓力。第二累積器 3268可處於壓縮機迴路3250中以用於提供歸因於壓縮機活塞以約60Hz循環之阻尼波動。對於壓縮機迴路3250之各種實施例而言,第一累積器3264可具有介於約80加侖與約160加侖之間的容量,而第二累積器可具有介於約30加侖與約60加侖之間的容量。根據氣體包體系統503之各種實施例,壓縮機3262可為零流入壓縮機。各種類型的零流入壓縮機可在不將大氣氣體洩漏至本教示內容之氣體包體系統之各種實施例中的情況下進行操作。 零流入壓縮機之各種實施例可例如在利用對需要壓縮惰性氣體之各種裝置及設備的使用的OLED列印製程期間持續運作。 The compressor circuit 3250 of Figure 16 can include compression configured to be in fluid communication The machine 3262, the first accumulator 3264, and the second accumulator 3268. The compressor 3262 can be configured to compress the inert gas drawn from the gas inclusion assembly 1101 to a desired pressure. The inlet side of compressor circuit 3250 can be in fluid communication with gas enclosure assembly 1101 via gas line assembly outlet 3252 via line 3254 having valve 3256 and check valve 3258. The compressor circuit 3250 can be in fluid communication with the gas inclusion assembly 1101 on the outlet side of the compressor circuit 3250 via the external gas circuit 3200. Accumulator 3264 can be disposed between the junction of compressor 3262 and compressor circuit 3250 and external gas circuit 3200 and can be configured to produce a pressure of 5 psig or greater. Second accumulator 3268 can be in compressor circuit 3250 for providing damping fluctuations due to the compressor piston cycling at about 60 Hz. For various embodiments of the compressor circuit 3250, the first accumulator 3264 can have a capacity between about 80 gallons and about 160 gallons, and the second accumulator can have between about 30 gallons and about 60 gallons. Capacity between. According to various embodiments of the gas enclosure system 503, the compressor 3262 can flow into the compressor at zero. Various types of zero inflow compressors can operate without impeding atmospheric gas leakage into various embodiments of the gas enclosure system of the present teachings. Various embodiments of zero inflow compressors may continue to operate, for example, during OLED printing processes utilizing the use of various devices and devices that require compression of inert gases.

累積器3264可經配置來接收及累積來自壓縮機3262之壓縮 惰性氣體。累積器3264可按需要供應壓縮惰性氣體於氣體包體總成1101中。例如,累積器3264可提供氣體來維持氣體包體總成1101之各種組件之壓力,該等組件諸如但不限於以下一或多者:氣動機器人、基板浮動台、空氣軸承、空氣襯套、壓縮氣體工具、氣動致動器及其組合。如圖16中對氣體包體系統503所示,氣體包體總成1101可具有包封於其中的OLED列印系統2003。如圖16中示意性描繪,噴墨列印系統2003可由列印系統底座2100支撐,該列印系統底座可為花岡岩平台。列印系統底座2100可支撐基板支撐設備,諸如卡盤,例如但不限於真空卡盤;具有壓力埠之基板浮動卡盤;及具有真空及壓力埠之基板浮動卡盤。在本教示內容之各種實施例中,基板支撐設備可為基板浮動台,諸如圖16中所指示的基板浮動台2200。基板浮動台2200可用於基板之無摩擦支撐。除低粒子產生浮動台之外,對基板之無摩擦y軸傳送而言,列印系統2003可具有利用空氣襯套之y軸運動系統。另外,列印系統2003可具有至少一個X,Z軸托架總成,該 總成具有藉由低粒子產生X軸空氣軸承總成提供之運動控制。諸如X軸空氣軸承總成的低粒子產生運動系統之各種組件可用於替代例如各種粒子產生線性機械軸承系統。對於本教示內容之氣體包體及系統之各種實施例而言,各種氣動操作裝置及設備之使用可提供低粒子產生效能及低維護率。 壓縮機迴路3250可經配置來持續將加壓惰性氣體供應至氣體包體系統503之各個裝置及設備。除供應加壓惰性氣體之外,利用空氣軸承技術之噴墨列印系統2003之基板浮動台2200亦利用真空系統3270,該真空系統在閥3274處於打開位置時經由管線3272與氣體包體總成1101流體連通。 Accumulator 3264 can be configured to receive and accumulate compression from compressor 3262 Inert gas. Accumulator 3264 can supply a compressed inert gas to gas inclusion assembly 1101 as needed. For example, accumulator 3264 can provide gas to maintain the pressure of various components of gas enclosure assembly 1101, such as but not limited to one or more of the following: pneumatic robots, substrate floats, air bearings, air bushings, compression Gas tools, pneumatic actuators, and combinations thereof. As shown in FIG. 16 for gas inclusion system 503, gas inclusion assembly 1101 can have an OLED printing system 2003 encased therein. As schematically depicted in Figure 16, the inkjet printing system 2003 can be supported by a printing system mount 2100, which can be a granite rock platform. The printing system base 2100 can support a substrate support device, such as a chuck, such as but not limited to a vacuum chuck; a substrate floating chuck having a pressure gauge; and a substrate floating chuck having a vacuum and pressure. In various embodiments of the present teachings, the substrate support apparatus can be a substrate floating stage, such as the substrate floating stage 2200 as indicated in FIG. The substrate floating stage 2200 can be used for frictionless support of the substrate. In addition to the low particle generating floating stage, the printing system 2003 can have a y-axis motion system utilizing an air bushing for frictionless y-axis transfer of the substrate. Additionally, the printing system 2003 can have at least one X, Z-axis bracket assembly, The assembly has motion control provided by the low particle generating X-axis air bearing assembly. Various components of the low particle generating motion system, such as the X-axis air bearing assembly, can be used in place of, for example, various particle-generating linear mechanical bearing systems. For various embodiments of the gas enclosures and systems of the present teachings, the use of various pneumatic operating devices and devices provides low particle generation efficiency and low maintenance. The compressor circuit 3250 can be configured to continuously supply pressurized inert gas to various devices and devices of the gas enclosure system 503. In addition to supplying a pressurized inert gas, the substrate floating stage 2200 of the ink jet printing system 2003 utilizing air bearing technology also utilizes a vacuum system 3270 that is coupled to the gas inclusion body via line 3272 when valve 3274 is in the open position. 1101 is in fluid communication.

根據本教示內容之加壓惰性氣體再循環系統可具有如圖16 中對壓縮機迴路3250所示的壓力受控旁路迴路3260,該壓力受控旁路迴路起作用來補償使用期間加壓氣體之可變需求,從而為本教示內容之氣體包體系統之各種實施例提供動態平衡。對於根據本教示內容之氣體包體系統之各種實施例而言,旁路迴路可於累積器3264內維持恆定壓力而不干擾或改變包體1101內之壓力。旁路迴路3260可於旁路迴路之入口側上具有第一旁路入口閥3261,該第一旁路入口閥閉合直至使用旁路迴路3260。旁路迴路3260亦可具有在第二閥3263閉合時可使用的背壓調節器3266。旁路迴路3260可具有安置在旁路迴路3260之出口側處的第二累積器3268。對於利用零流入壓縮機之壓縮機迴路3250之實施例而言,旁路迴路3260可補償可在使用氣體包體系統期間隨著時間而發生之小壓力偏離。旁路迴路3260可在旁路入口閥3261處於打開位置時於旁路迴路3260之入口側上與壓縮機迴路3250流體連通。在旁路入口閥3261打開時,若氣體包體總成1101內部內不再需要來自壓縮機迴路3250之惰性氣體,則經由旁路迴路3260分流之惰性 氣體可再循環至壓縮機。壓縮機迴路3250經配置來在累積器3264中的惰性氣體之壓力超出預置閾值壓力時經由旁路迴路3260來分流惰性氣體。累積器3264之預置閾值壓力在每分鐘至少約1立方呎(cfm)之流率下可介於約25psig與約200psig之間,或在每分鐘至少約1立方呎(cfm)之流率下介於約50psig與約150psig之間,或在每分鐘至少約1立方呎(cfm)之流率下介於約75psig與約125psig之間,或在每分鐘至少約1立方呎(cfm)之流率下介於約90psig與約95psig之間。 A pressurized inert gas recirculation system according to the teachings of the present teachings can have a Figure 16 In the pressure controlled bypass circuit 3260 shown in compressor circuit 3250, the pressure controlled bypass circuit acts to compensate for the variable demand of pressurized gas during use, thereby providing various aspects of the gas inclusion system for the teachings. Embodiments provide dynamic balancing. For various embodiments of the gas enclosure system in accordance with the present teachings, the bypass loop can maintain a constant pressure within the accumulator 3264 without interfering with or changing the pressure within the enclosure 1101. The bypass circuit 3260 can have a first bypass inlet valve 3261 on the inlet side of the bypass circuit that closes until the bypass circuit 3260 is used. The bypass circuit 3260 can also have a back pressure regulator 3266 that can be used when the second valve 3263 is closed. The bypass circuit 3260 can have a second accumulator 3268 disposed at the outlet side of the bypass circuit 3260. For embodiments that utilize a zero-inflow compressor compressor circuit 3250, the bypass circuit 3260 can compensate for small pressure deviations that can occur over time during use of the gas inclusion system. The bypass circuit 3260 can be in fluid communication with the compressor circuit 3250 on the inlet side of the bypass circuit 3260 when the bypass inlet valve 3261 is in the open position. When the bypass inlet valve 3261 is opened, if the inert gas from the compressor circuit 3250 is no longer needed inside the gas inclusion body assembly 1101, the inertia is bypassed via the bypass circuit 3260. The gas can be recycled to the compressor. The compressor circuit 3250 is configured to split the inert gas via the bypass circuit 3260 when the pressure of the inert gas in the accumulator 3264 exceeds a preset threshold pressure. The preset threshold pressure of the accumulator 3264 can be between about 25 psig and about 200 psig at a flow rate of at least about 1 cubic foot (cfm) per minute, or at a flow rate of at least about 1 cubic inch (cfm) per minute. Between about 50 psig and about 150 psig, or between about 75 psig and about 125 psig at a flow rate of at least about 1 cubic foot (cfm) per minute, or at least about 1 cubic inch (cfm) per minute. The ratio is between about 90 psig and about 95 psig.

壓縮機迴路3250之各種實施例可利用不同於零流入壓縮機 的各種壓縮機,諸如變速壓縮機或可經控制處於開啟或關閉狀態之壓縮機。如先前所論述,零流入壓縮機確保大氣反應性物種無法引入氣體包體系統中。因此,防止大氣反應性物種引入氣體包體系統中之任何壓縮機配置均可用於壓縮機迴路3250。根據各種實施例,氣體包體系統503之壓縮機3262可容納於例如但不限於密閉式密封外殼中。外殼內部可經配置與惰性氣體源流體連通,該惰性氣體為例如與形成用於氣體包體總成1101之惰性氣體氣氛相同的惰性氣體。對於壓縮機迴路3250之各種實施例而言,壓縮機3262可經控制處於恆定速度下以便維持恆定壓力。在不利用零流入壓縮機之壓縮機迴路3250之其他實施例中,壓縮機3262可在達到最大閾值壓力時關閉,且在達到最小閾值壓力時開啟。 Various embodiments of compressor circuit 3250 may utilize a different flow from zero to the compressor Various compressors, such as variable speed compressors or compressors that can be controlled to be in an open or closed state. As previously discussed, zero inflow compressors ensure that atmospheric reactive species cannot be introduced into the gas inclusion system. Thus, any compressor configuration that prevents atmospheric reactive species from being introduced into the gas inclusion system can be used for the compressor circuit 3250. According to various embodiments, the compressor 3262 of the gas enclosure system 503 can be housed in, for example, but not limited to, a hermetic sealed enclosure. The interior of the outer casing can be configured to be in fluid communication with an inert gas source, such as the same inert gas as the inert gas atmosphere used to form the gas inclusion body assembly 1101. For various embodiments of the compressor circuit 3250, the compressor 3262 can be controlled to be at a constant speed to maintain a constant pressure. In other embodiments that do not utilize zero-inflow compressor compressor circuit 3250, compressor 3262 can be turned off when the maximum threshold pressure is reached and turned on when the minimum threshold pressure is reached.

在圖17中,對於氣體包體系統504而言,利用真空鼓風機 3290之鼓風機迴路3280係展示用於操作噴墨列印系統2003之基板浮動台2200,該噴墨列印系統係容納於氣體包體總成1101中。如先前對壓縮機迴路3250所論述,鼓風機迴路3280可經配置來持續將加壓惰性氣體供應至列 印系統2003之基板浮動台2200。 In Figure 17, for a gas enclosure system 504, a vacuum blower is utilized The blower circuit 3280 of 3290 shows a substrate floating table 2200 for operating the ink jet printing system 2003, which is housed in a gas enclosure assembly 1101. As previously discussed for compressor circuit 3250, blower circuit 3280 can be configured to continuously supply pressurized inert gas to the column Substrate floating table 2200 of printing system 2003.

可利用加壓惰性氣體再循環系統之氣體包體系統之各種實 施例可具有利用各種加壓氣體源之各種迴路,該等加壓氣體源諸如壓縮機、鼓風機及其組合中之至少一者。在圖17中,對於氣體包體系統504而言,壓縮機迴路3250可與外部氣體迴路3200流體連通,該外部氣體迴路可用於為高消耗歧管3225以及低消耗歧管3215供應惰性氣體。對於根據本教示內容之氣體包體系統之各種實施例而言,如圖17中對氣體包體系統504所示,高消耗歧管3225可用於將惰性氣體供應至各種裝置及設備,諸如但不限於基板浮動台、氣動機器人、空氣軸承、空氣襯套及壓縮氣體工具中之一或多者及其組合。對於根據本教示內容之氣體包體系統之各種實施例而言,低消耗歧管3215可用於將惰性氣體供應至各種設備及裝置,諸如但不限於隔離器及氣動致動器中之一或多者及其組合。 Various types of gas inclusion systems that can utilize pressurized inert gas recirculation systems Embodiments may have various circuits that utilize various sources of pressurized gas, such as at least one of a compressor, a blower, and combinations thereof. In FIG. 17, for gas inclusion system 504, compressor circuit 3250 can be in fluid communication with external gas circuit 3200, which can be used to supply inert gas to high consumption manifold 3225 and low consumption manifold 3215. For various embodiments of a gas enclosure system in accordance with the present teachings, as shown for gas enclosure system 504 in FIG. 17, high consumption manifold 3225 can be used to supply inert gas to various devices and devices, such as but not It is limited to one or more of a substrate floating table, a pneumatic robot, an air bearing, an air bushing, and a compressed gas tool, and combinations thereof. For various embodiments of the gas enclosure system in accordance with the present teachings, the low consumption manifold 3215 can be used to supply inert gas to one or more of various devices and devices, such as, but not limited to, isolators and pneumatic actuators. And their combinations.

對於圖17之氣體包體系統504之各種實施例而言,鼓風機 迴路3280可用於將加壓惰性氣體供應至基板浮動台2200之各種實施例,而與外部氣體迴路3200流體連通之壓縮機迴路3250可用於將加壓惰性氣體供應至例如但不限於氣動機器人、空氣軸承、空氣襯套及壓縮空氣工具中之一或多者及其組合。除供應加壓惰性氣體之外,利用空氣軸承技術之OLED噴墨列印系統2003之基板浮動台2200亦利用真空鼓風機3290,該真空鼓風機在閥3294處於打開位置時經由管線3292與氣體包體總成1101流體連通。 鼓風機迴路3280之外殼3282可維持第一鼓風機3284以用於將加壓惰性氣體源供應至基板浮動台2200,且使第二鼓風機3290充當基板浮動台2200之真空源,該基板浮動台容納於氣體包體總成1101之惰性氣體環境中。可 使鼓風機適於用作加壓惰性氣體源或真空源以用於基板浮動台之各種實施例之屬性包括例如但不限於其具有高可靠性;使得其維護率低;具有變速控制;且具有廣範圍之流動體積;各種實施例能夠提供介於約100m3/h與約2,500m3/h之間的體積流量。鼓風機迴路3280之各種實施例另外可具有位於鼓風機迴路3280之入口端處的第一隔離閥3283,以及位於鼓風機迴路3280之出口端處的止回閥3285及第二隔離閥3287。鼓風機迴路3280之各種實施例可具有可為例如但不限於閘閥、蝶形閥、針閥或球閥之可調節閥3286,以及用於自鼓風機迴路3280至基板浮動台2200將惰性氣體維持在界定溫度下之熱交換器3288。 For various embodiments of the gas enclosure system 504 of FIG. 17, the blower circuit 3280 can be used to supply pressurized inert gas to various embodiments of the substrate floating table 2200, while the compressor circuit 3250 is in fluid communication with the external gas circuit 3200. It can be used to supply pressurized inert gas to one or more of, for example, but not limited to, a pneumatic robot, an air bearing, an air bushing, and a compressed air tool, and combinations thereof. In addition to supplying a pressurized inert gas, the substrate floating stage 2200 of the OLED inkjet printing system 2003 utilizing air bearing technology also utilizes a vacuum blower 3290 that is coupled to the gas inclusion body via line 3292 when valve 3294 is in the open position. In 1101, it is in fluid communication. The outer casing 3282 of the blower circuit 3280 can maintain the first blower 3284 for supplying a source of pressurized inert gas to the substrate floating stage 2200, and the second blower 3290 serves as a vacuum source for the substrate floating stage 2200, the substrate floating stage being housed in the gas The inclusion body assembly 1101 is in an inert gas atmosphere. Attributes of various embodiments that may be adapted to be used as a pressurized inert gas source or vacuum source for a substrate floating table include, for example, but are not limited to, having high reliability; such that its maintenance rate is low; with shift control; volume of the wide range of flow; various embodiments can be provided interposed between the volume flow rate of about 100m 3 / h and about 2,500m 3 / h. Various embodiments of the blower circuit 3280 may additionally have a first isolation valve 3283 at the inlet end of the blower circuit 3280, and a check valve 3285 and a second isolation valve 3287 at the outlet end of the blower circuit 3280. Various embodiments of the blower circuit 3280 can have an adjustable valve 3286 that can be, for example, but not limited to, a gate valve, a butterfly valve, a needle valve, or a ball valve, and for maintaining the inert gas at a defined temperature from the blower circuit 3280 to the substrate floating table 2200. Heat exchanger 3288.

圖17描繪外部氣體迴路3200,其亦展示於圖16中,用於整 合及控制適用於操作圖16之氣體包體系統503及圖17之氣體包體系統504的各個觀點之惰性氣體源3201及潔淨乾燥氣體(CDA)源3203。圖16及圖17之外部氣體迴路3200可包括至少四個機械閥。此等閥門包含第一機械閥3202、第二機械閥3204、第三機械閥3206及第四機械閥3208。此等各種閥門位於各種流動管線內之各位置處,該等流動管線允許控制惰性氣體(例如氮、任何稀有氣體及其任何組合)及空氣源(諸如潔淨乾燥空氣(CDA))兩者。受包容惰性氣體管線3210自受包容惰性氣體源3201延伸。受包容惰性氣體管線3210持續隨低消耗歧管管線3212線性延伸,該低消耗歧管管線與低消耗歧管3215流體連通。交叉管線第一區段3214自第一流動接合帶3216延伸,該第一流動接合帶位於受包容惰性氣體管線3210、低消耗歧管管線3212與交叉管線第一區段3214之交叉點處。交叉管線第一區段3214延伸至第二流動接合帶3218。壓縮機惰性氣體管線3220自壓縮機迴路3250 之累積器3264延伸且終止於第二流動接合帶3218。CDA管線3222自CDA源3203延伸且持續隨高消耗歧管管線3224延伸,該高消耗歧管管線與高消耗歧管3225流體連通。第三流動接合帶3226位於交叉管線第二區段3228、潔淨乾燥空氣管線3222與高消耗歧管管線3224之交叉點處。交叉管線第二區段3228自第二流動接合帶3218延伸至第三流動接合帶3226。高消耗性之各種組件可於維護期間藉助於高消耗管3225來供應CDA。使用閥3204、3208及3230來隔離壓縮機可防止諸如氧及水蒸氣之反應性物種污染壓縮機及累積器內之惰性氣體。 Figure 17 depicts an external gas circuit 3200, also shown in Figure 16, for the entire The inert gas source 3201 and the clean dry gas (CDA) source 3203 are applied to control various aspects of the gas inclusion system 503 of FIG. 16 and the gas inclusion system 504 of FIG. The outer gas circuit 3200 of Figures 16 and 17 can include at least four mechanical valves. These valves include a first mechanical valve 3202, a second mechanical valve 3204, a third mechanical valve 3206, and a fourth mechanical valve 3208. These various valves are located at various locations within various flow lines that allow control of both inert gases (e.g., nitrogen, any noble gases, and any combination thereof) and air sources (such as clean dry air (CDA)). The contained inert gas line 3210 extends from the contained inert gas source 3201. The contained inert gas line 3210 continues to extend linearly with the low consumption manifold line 3212, which is in fluid communication with the low consumption manifold 3215. The crossover line first section 3214 extends from a first flow bond belt 3216 that is located at the intersection of the contained inert gas line 3210, the low consumption manifold line 3212, and the cross line first section 3214. The crossover line first section 3214 extends to the second flow bond belt 3218. Compressor inert gas line 3220 from compressor circuit 3250 The accumulator 3264 extends and terminates in the second flow bond belt 3218. The CDA line 3222 extends from the CDA source 3203 and continues to extend with the high consumption manifold line 3224, which is in fluid communication with the high consumption manifold 3225. The third flow bond belt 3226 is located at the intersection of the cross line second section 3228, the clean dry air line 3222, and the high consumption manifold line 3224. The crossover line second section 3228 extends from the second flow bond belt 3218 to the third flow bond belt 3226. The various components of high consumption can be supplied to the CDA by means of a high consumption tube 3225 during maintenance. The use of valves 3204, 3208, and 3230 to isolate the compressor prevents reactive species such as oxygen and water vapor from contaminating the inert gas within the compressor and accumulator.

如先前所論述,本教示內容揭露氣體包體系統之各種實施 例,該氣體包體系統可包括界定第一體積之氣體包體總成及界定第二體積之輔助包體。氣體包體系統之各種實施例可具有輔助包體,該輔助包體可以可密封方式構造為氣體包體總成之一區段,且易與氣體循環、過濾及純化組件整合來形成可保持惰性、大體上無粒子環境而幾乎不或不中斷列印製程之氣體包體系統,該惰性、大體上無粒子環境係用於需要此環境之諸多製程。例如,可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。 As discussed previously, the present teachings disclose various implementations of gas inclusion systems For example, the gas inclusion system can include a gas inclusion body defining a first volume and an auxiliary package defining a second volume. Various embodiments of the gas inclusion system can have an auxiliary package that can be configured in a sealable manner as a section of the gas inclusion assembly and that is easily integrated with the gas circulation, filtration, and purification components to form an inert A gas inclusion system that is substantially free of particle environments and that has little or no interruption in the printing process. This inert, substantially particle-free environment is used in many processes that require this environment. For example, all steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process.

根據本教示內容之各種系統及方法,構造為氣體包體總成各 區段之列印系統包體及輔助包體之各種實施例可以提供獨立起作用的框架構件總成區段方式來構造。圖18之氣體包體系統505除具有對氣體包體系 統502至504所揭露的所有元件之外,可具有界定第一體積的氣體包體總成1101之第一氣體包體總成區段1101-S1及界定第二體積的氣體包體總成1101之第二氣體包體總成區段1101-S2。若所有閥V1、V2、V3及V4均打開,則氣體純化迴路3130基本上如先前對圖15之氣體包體總成及系統1101所述來操作。在V3及V4閉合的情況下,僅第一氣體包體總成區段1101-S1與氣體純化迴路3130流體連通。此種閥狀態可在例如但不限於以下情況使用:當第二氣體包體總成區段1101-S2可以可密封方式封閉且藉此在需要第二氣體包體總成區段1101-S2向大氣開放之各種量測及維護程序期間與第一氣體包體總成區段1101-S1隔離時。在V1及V2閉合的情況下,僅第二氣體包體總成區段1101-S2與氣體純化迴路3130流體連通。此種閥狀態可在例如但不限於以下情況使用:在第二氣體包體總成區段1101-S2已向大氣開放之後恢復該區段期間。如先前對與圖15有關的本教示內容所提及,對氣體純化迴路3130之要求係相對於氣體包體總成1101之總體積來指定。因此,藉由將氣體純化系統之來源貢獻於氣體包體總成區段之恢復,可大體上減少恢復時間,該氣體包體總成區段諸如第二氣體包體總成區段1101-S2,其於圖18中描繪為體積顯著小於氣體包體1101之總體積。 In accordance with various systems and methods of the present teachings, various embodiments of a printing system package and an auxiliary package configured as segments of a gas enclosure assembly can be constructed in a manner that provides an independently functioning frame member assembly segment. The gas inclusion system 505 of FIG. 18, in addition to having all of the elements disclosed for the gas inclusion systems 502-504, may have a first gas inclusion assembly section 1101 defining a first volume of gas inclusion assembly 1101. -S1 and a second gas inclusion body segment 1101-S2 defining a second volume of gas inclusion assembly 1101. If all of the valves V 1, V 2, V 3 and V 4 are opened, the gas purification circuit 3130 to 1101 substantially as previously described operation of gas bag assembly and body 15 of the system of FIG. In the case of V 3 and V 4 is closed, only the first section of the gas bag body assembly 1101-S1 and in fluid communication with a gas purification circuit 3130. Such a valve condition can be used, for example, but not limited to, when the second gas inclusion body section 1101-S2 can be hermetically sealed and thereby requires a second gas inclusion body section 1101-S2 The various gas inclusion assembly sections 1101-S1 are isolated during various measurement and maintenance procedures for atmospheric opening. In the case where V 1 and V 2 is closed, only the second section of the gas bag body assembly 1101-S2 and gas purification circuit 3130 is in fluid communication. Such a valve state can be used, for example, but not limited to, during the recovery of the second gas inclusion body assembly section 1101-S2 after it has been opened to the atmosphere. As previously mentioned for the teachings associated with FIG. 15, the requirements for the gas purification circuit 3130 are specified relative to the total volume of the gas inclusion assembly 1101. Thus, the recovery time can be substantially reduced by contributing to the recovery of the source of the gas purification system, such as the second gas inclusion assembly section 1101-S2, by contributing to the recovery of the gas inclusion body assembly section. It is depicted in Figure 18 as having a volume that is significantly smaller than the total volume of the gas inclusions 1101.

另外,輔助包體之各種實施例可容易地與一組專用環境調節 系統組件整合,該等組件諸如照明組件、氣體循環及過濾組件、氣體純化組件及恆溫組件。就該方面而言,包括可以可密封方式構造為氣體包體總成之一區段的輔助包體之氣體包體系統之各種實施例可具有一受控環境,該受控環境經設定與由容納列印系統之氣體包體總成所界定的第一體積一致。另外,包括可以可密封方式構造為氣體包體總成之一區段的輔助包體 之氣體包體系統之各種實施例可具有一受控環境,該受控環境經設定與由容納列印系統之氣體包體總成所界定的第一體積之受控環境不同。 In addition, various embodiments of the auxiliary package can be easily adjusted with a dedicated set of environments System components are integrated, such as lighting components, gas circulation and filtration components, gas purification components, and thermostatic components. In this regard, various embodiments of a gas enclosure system including an auxiliary enclosure that can be configured in a sealable manner as a section of a gas inclusion assembly can have a controlled environment that is set and controlled by The first volume defined by the gas inclusion assembly that houses the printing system is identical. In addition, including an auxiliary body that can be configured in a sealable manner as a section of the gas inclusion body assembly Various embodiments of the gas inclusion system can have a controlled environment that is set differently than the controlled environment of the first volume defined by the gas inclusion assembly that houses the printing system.

回顧而言,用於本教示內容之氣體包體系統之實施例中的氣 體包體總成之各種實施例可以如下成型方式來構造:最小化氣體包體總成之內部體積,且同時最佳化用於適應OLED列印系統設計之各種覆蓋區的工作體積。例如,根據本教示內容之成型氣體包體總成之各種實施例可針對本教示內容之氣體包體總成之各種實施例具有介於約6m3與約95m3之間的氣體包體體積,從而涵蓋第3.5代至第10代之基板大小。根據本教示內容之成型氣體包體總成之各種實施例可具有例如但不限於介於約15m3與約30m3之間的氣體包體體積,該氣體包體體積可適用於例如具有第5.5代至第8.5代基板大小之OLED列印。輔助包體之各種實施例可構造為氣體包體總成之一區段,且易與氣體循環及過濾以及純化組件整合來形成一氣體包體系統,該氣體包體系統可維持惰性、大體上無粒子環境以用於需要此種環境之各製程。 In retrospect, various embodiments of the gas inclusion assembly for use in embodiments of the gas inclusion system of the present teachings can be constructed in a manner that minimizes the internal volume of the gas inclusion assembly and is optimal at the same time. It is used to adapt to the working volume of various coverage areas of OLED printing system design. For example, according to various gases forming the bag body of the cartridge according to the present teachings of the embodiments may be directed to various embodiments of the present teachings block assembly of the gas bag between the gas bag body having a volume of between about 6m 3 and about 95m 3, Thus, the substrate size of the 3.5th to the 10th generation is covered. Various embodiments of the shaped gas encapsulation assembly in accordance with the present teachings can have, for example, but are not limited to, a gas inclusion volume between about 15 m 3 and about 30 m 3 , the gas inclusion volume being applicable, for example, to have a 5.5th OLED printing of the 8.5th generation substrate size. Various embodiments of the auxiliary package can be constructed as a section of a gas inclusion assembly and are easily integrated with gas recycle and filtration and purification components to form a gas inclusion system that maintains inertness, substantially A particle-free environment for each process that requires such an environment.

根據本教示內容之系統及方法之各種實施例,框架構件構 造、面板構造、框架及面板密封以及氣體包體總成(諸如圖3之氣體包體總成100)之構造可適用於具有多種大小及設計之氣體包體總成。例如但在不限制的情況下,涵蓋第3.5代至第10代基板大小的本教示內容之成型氣體包體總成之各種實施例可具有介於約6m3與約95m3之間的內部體積,對未成型且具有相當總額尺寸之包體而言,該內部體積可在體積上節省約30%與約70%之間。氣體包體總成之各種實施例可具有各種框架構件,該等框架構件經構造來為氣體包體總成提供輪廓,以便於最佳化適應本教示內容 之列印系統之各種實施例的工作體積;同時最小化惰性氣體體積,且以允許於處理期間自外部對OLED列印系統的就緒進入。就該方面而言,本教示內容之各種氣體包體總成之成型拓撲及體積可變化。 Depending on various embodiments of the systems and methods of the present teachings, the construction of frame member construction, panel construction, frame and panel seals, and gas enclosure assemblies (such as gas enclosure assembly 100 of FIG. 3) can be adapted to a variety of sizes. And design of the gas inclusion body assembly. For example, but without limitation, covers the 3.5th generation to generation of the first substrate 10 forming the various sizes of gas inclusions cartridge teachings of the present embodiments may have an internal volume of between about and about 6m 3 to 95m 3 For internal bodies that are unformed and have a substantial total size, the internal volume can be saved between about 30% and about 70% in volume. Various embodiments of the gas inclusion assembly can have various frame members that are configured to contour the gas inclusion assembly to facilitate optimization of various embodiments of the printing system adapted to the teachings herein. Volume; while minimizing the volume of inert gas, and allowing ready access to the OLED printing system from the outside during processing. In this regard, the molding topology and volume of the various gas inclusion assemblies of the present teachings can vary.

此外,本教示內容之氣體包體系統之各種實施例可利用具有 輔助包體之氣體包體總成,該輔助包體可以可密封方式構造為氣體包體總成之一區段,以便容易地執行與列印系統之持續不斷管理有關的各種程序,例如但不限於與管理列印頭總成有關的製程。對於具有輔助包體之氣體包體總成之各種實施例而言,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積之約1%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積之約2%。對於氣體包體總成之各種實施例而言,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積之約5%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積之約10%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積之約20%。與列印系統之持續不斷管理有關的各種程序,例如但不限於與列印頭總成之管理有關的各種製程步驟,皆可於輔助包體內執行。根據本教示內容之各種系統及方法,輔助包體可與氣體包體系統之列印系統封閉部分分離,從而確保最小程度中斷或不中斷列印過程。此外,鑒於輔助包體之相對小的體積,輔助包體之恢復可耗費顯著小於整體列印系統包體之恢復的時間。 Moreover, various embodiments of the gas enclosure system of the present teachings can be utilized with a gas inclusion body of the auxiliary package, the auxiliary package being sealably constructed as a section of the gas inclusion assembly for easily performing various procedures related to the continuous management of the printing system, for example, but not Limited to the process associated with managing the printhead assembly. For various embodiments of the gas inclusion assembly having an auxiliary inclusion, the auxiliary frame member assembly section can be less than or equal to about 1% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the gas inclusion assembly, the auxiliary frame member assembly section can be less than or equal to about 2% of the volume of the inclusion body of the gas inclusion system. For various embodiments of the gas inclusion assembly, the auxiliary frame member assembly section can be less than or equal to about 5% of the volume of the inclusion body of the gas inclusion system. In various embodiments of the gas inclusion body assembly, the auxiliary frame member assembly section can be less than or equal to about 10% of the volume of the inclusion body of the gas enclosure system. In various embodiments of the gas inclusion assembly, the auxiliary frame member assembly section can be less than or equal to about 20% of the volume of the inclusion body of the gas enclosure system. Various procedures related to the ongoing management of the printing system, such as, but not limited to, various process steps associated with the management of the printhead assembly, can be performed within the auxiliary package. In accordance with various systems and methods of the present teachings, the auxiliary package can be separated from the closed portion of the printing system of the gas enclosure system to ensure minimal or no interruption in the printing process. Moreover, in view of the relatively small volume of the auxiliary package, the recovery of the auxiliary package can be significantly less than the recovery time of the overall printing system package.

另外,本教示內容之氣體包體總成之各種實施例可以提供獨 立起作用之框架構件總成區段之方式來構造。回顧而言,關於圖5,根據本 教示內容之氣體包體總成及系統之各種實施例的框架構件總成可包括框架構件,該框架構件具有以可密封方式安裝至框架構件上的各種面板。例如但在不限制的情況下,壁框架構件總成或壁面板總成可為包括以可密封方式安裝至壁框架構件上之各種面板的壁框架構件。因此,各種完全構造面板總成,諸如但不限於壁面板總成、頂板面板總成、壁及頂板面板總成、底座支撐面板總成及類似物,均為各種類型的框架構件總成。本教示內容之氣體包體總成可提供用於具有各種框架構件總成區段之氣體包體總成之各種實施例,其中每一框架構件總成區段為氣體包體總成總體積之一部分。構成氣體包體總成之各種實施例的各種框架構件總成區段可一般而言具有至少一個框架構件。對於氣體包體總成之各種實施例而言,構成氣體包體總成之各種框架構件總成區段可一般而言具有至少一個框架構件總成。構成氣體包體總成之各種實施例的各種框架構件總成區段可一般而言具有至少一個框架構件及一框架構件總成之組合。 In addition, various embodiments of the gas inclusion assembly of the present teachings can provide independence Constructed in the manner of a functional frame member assembly section. In retrospect, regarding Figure 5, according to this The frame assembly assembly of the various embodiments of the gas inclusion assembly and system of the teachings can include a frame member having various panels that are sealably mounted to the frame member. For example, but without limitation, the wall frame member assembly or wall panel assembly can be a wall frame member that includes various panels that are sealably mounted to the wall frame member. Accordingly, various fully constructed panel assemblies, such as, but not limited to, wall panel assemblies, roof panel assemblies, wall and ceiling panel assemblies, base support panel assemblies, and the like, are various types of frame member assemblies. The gas inclusion assembly of the present teachings can provide various embodiments for a gas inclusion assembly having various frame member assembly sections, wherein each frame member assembly section is the total volume of the gas inclusion assembly. portion. The various frame member assembly sections that make up the various embodiments of the gas enclosure assembly can generally have at least one frame member. For various embodiments of the gas inclusion assembly, the various frame member assembly sections that make up the gas enclosure assembly can generally have at least one frame member assembly. The various frame member assembly sections that make up the various embodiments of the gas enclosure assembly can generally have a combination of at least one frame member and a frame member assembly.

根據本教示內容,各種框架構件總成區段可經由例如但不限 於封閉每一框架構件總成區段共有之開口或通道或其組合來分成諸多區段。例如,在各種實施例中,輔助框架構件總成區段可藉由覆蓋每一框架構件總成區段共有之框架構件或框架構件面板內之開口或通道或其組合;藉此有效地封閉開口或通道或其組合而分離。在各種實施例中,輔助框架構件總成區段可藉由密封每一框架構件總成區段共有之開口或通道或其組合而分離。就該方面而言,可以可密封方式封閉開口或通道或其組合可導致分離,從而中斷界定工作體積之氣體包體框架構件總成區段與界定第二體積之輔助包體的每一體積之間的流體連通,其中每一體積為氣體包體總 成內含有的總體積之一部分。以可密封方式封閉開口或通道可藉此將氣體包體總成之工作體積與界定第二體積之輔助框架構件總成區段隔離。 According to the present teachings, various frame member assembly sections may be via, for example, but not limited to The openings or channels or combinations thereof that are common to each of the frame member assembly sections are divided into a plurality of sections. For example, in various embodiments, the auxiliary frame member assembly section can cover the opening or channel or combination thereof within the frame member or frame member panel common to each frame member assembly section; thereby effectively closing the opening Or channels or a combination thereof to separate. In various embodiments, the auxiliary frame member assembly sections can be separated by sealing openings or channels or combinations thereof that are common to each frame member assembly section. In this regard, the closure of the opening or channel or combination thereof in a sealable manner may result in separation, thereby interrupting the gas inclusion frame member assembly section defining the working volume and each volume of the auxiliary package defining the second volume. Fluid communication, where each volume is the total gas inclusion One part of the total volume contained within. Closing the opening or passage in a sealable manner thereby isolates the working volume of the gas enclosure assembly from the auxiliary frame member assembly section defining the second volume.

圖19描繪根據本教示內容之氣體包體總成之各種實施例的 氣體包體總成1000的透視圖。氣體包體總成1000可包括前面板總成1200'、中間面板總成1300'以及後面板總成1400'。前面板總成1200'可包括前頂板面板總成1260'、可具有用於接收基板之開口1242的前壁面板總成1240'以及前底座面板總成1220'。後面板總成1400'可包括後頂板面板總成1460'、後壁面板總成1440'及後底座面板總成1420'。中間面板總成1300'可包括第一中間包體面板總成1340'、中間壁及頂板面板總成1360',及第二中間包體面板總成1380'以及中間底座面板總成1320'。另外,中間面板總成1300'可包括第一列印頭管理系統輔助面板總成1330'以及第二列印頭管理系統輔助面板總成(未圖示)。構造為氣體包體總成之一區段的輔助包體之各種實施例可以可密封方式與氣體包體系統之工作體積隔離。輔助包體之此種實體隔離可允許各種程序,例如但不限於列印頭總成上之各種維護程序,在幾乎不或不中斷列印製程的情況下進行,藉此最小化或消除氣體包體系統停機時間。 19 depicts various embodiments of a gas inclusion assembly in accordance with the present teachings. A perspective view of the gas inclusion assembly 1000. The gas inclusion assembly 1000 can include a front panel assembly 1200', an intermediate panel assembly 1300', and a rear panel assembly 1400'. The front panel assembly 1200' can include a front roof panel assembly 1260', a front wall panel assembly 1240' that can have an opening 1242 for receiving a substrate, and a front base panel assembly 1220'. The rear panel assembly 1400' can include a rear roof panel assembly 1460', a rear wall panel assembly 1440', and a rear base panel assembly 1420'. The intermediate panel assembly 1300' can include a first intermediate body panel assembly 1340', an intermediate wall and roof panel assembly 1360', and a second intermediate body panel assembly 1380' and an intermediate base panel assembly 1320'. Additionally, the intermediate panel assembly 1300' can include a first printhead management system auxiliary panel assembly 1330' and a second printhead management system auxiliary panel assembly (not shown). Various embodiments of the auxiliary package configured as a section of the gas inclusion body may be sealed from the working volume of the gas enclosure system in a sealable manner. Such physical isolation of the auxiliary package may allow for various procedures, such as, but not limited to, various maintenance procedures on the printhead assembly, with little or no interruption to the printing process, thereby minimizing or eliminating gas packets. Body system downtime.

如圖20A中所描繪,氣體包體總成1000可包括前底座面板 總成1220'、中間底座面板總成1320'及後底座面板總成1420',該等總成在完全構造時形成相接底座或底盤,OLED列印系統2000可安裝於該相接底座或底盤上。以與對於圖3之氣體包體總成100所述類似的方式,包含氣體包體總成1000之前面板總成1200'、中間面板總成1300'及後面板總成1400'的各種框架構件及面板可圍繞OLED列印系統2000來接合。因此,諸如氣 體包體總成1000的完全構造氣體包體總成在與各種環境控制系統整合時可形成氣體包體系統之各種實施例,其包括OLED列印系統2000之各種實施例。根據如先前所述的本教示內容之氣體包體系統的各種實施例,藉由氣體包體總成界定的內部體積之環境控制可包括:藉由具有特定波長之燈的數目及置放進行的照明控制、使用氣體循環及過濾系統之各種實施例對微粒物質之控制、使用氣體純化系統之各種實施例對反應性氣體物種之控制,以及使用熱控制系統之各種實施例對氣體包體總成之溫度控制。 As depicted in Figure 20A, the gas enclosure assembly 1000 can include a front base panel Assembly 1220', intermediate base panel assembly 1320' and rear base panel assembly 1420', the assemblies form a docking base or chassis when fully constructed, and the OLED printing system 2000 can be mounted to the docking base or chassis on. Various frame members including the gas body assembly 1000 front panel assembly 1200', the intermediate panel assembly 1300', and the rear panel assembly 1400', and in a manner similar to that described for the gas inclusion assembly 100 of FIG. The panels can be joined around the OLED printing system 2000. Therefore, such as gas The fully constructed gas inclusion assembly of body package assembly 1000 can form various embodiments of gas inclusion systems when integrated with various environmental control systems, including various embodiments of OLED printing system 2000. According to various embodiments of the gas inclusion system of the present teachings as previously described, the environmental control of the internal volume defined by the gas inclusion body may include: by the number and placement of lamps having a particular wavelength Control of particulate matter by various embodiments of lighting control, gas circulation and filtration systems, control of reactive gas species using various embodiments of gas purification systems, and gas inclusion assemblies using various embodiments of thermal control systems Temperature control.

圖20B中以展開圖展示的諸如圖20A之OLED列印系統2000 的OLED噴墨列印系統可包含若干裝置及設備,該等裝置及設備允許墨滴於基板上特定位置上之可靠置放。此等裝置及設備可包括但不限於列印頭總成、油墨遞送系統、運動系統、基板支撐設備、基板加載及卸載系統以及列印頭管理系統。 An OLED printing system 2000 such as that of FIG. 20A, shown in an expanded view in FIG. 20B The OLED inkjet printing system can include a number of devices and devices that allow for reliable placement of ink drops at specific locations on the substrate. Such devices and devices may include, but are not limited to, a print head assembly, an ink delivery system, a motion system, a substrate support device, a substrate loading and unloading system, and a printhead management system.

列印頭總成可包括至少一個噴墨頭,該噴墨頭具有能夠以受 控速率、速度及大小噴射油墨微滴的至少一個孔口。該噴墨頭係受油墨供應系統饋送,該油墨供應系統提供油墨至噴墨頭。如圖20B之展開圖中所示,OLED噴墨列印系統2000可具有諸如基板2050之基板,該基板可藉由諸如卡盤之基板支撐設備支撐,該基板支撐設備例如但不限於真空卡盤、具有壓力埠之基板浮動卡盤以及具有真空埠及壓力埠之基板浮動卡盤。在本教示內容之系統及方法的各種實施例中,基板支撐設備可為基板浮動台。如隨後將更詳細地論述,圖20B之基板浮動台2200可用於支撐基板2050,且可與Y軸運動系統結合成提供用於基板2050之無摩擦傳送的基板傳送系統之部分。圖20A及圖20B中所示之OLED噴墨列印系統2000之基 板浮動台2200可界定基板2050於列印製程期間穿過圖19之氣體包體總成1000之行程。列印需要列印頭總成與基板之間的相對運動。此係使用運動系統完成,該運動系統通常為門架式或分體式軸XYZ系統。列印頭總成可移動越過靜置不動基板(門架式),或在分體式軸配置之情況下,列印頭與基板兩者均可移動。在另一實施例中,列印頭總成可大體上為靜置不動的;例如,在X軸及Y軸上,且基板可相對於該等列印頭在X軸及Y軸上移動,其中Z軸運動藉由基板支撐設備提供或藉由與列印頭總成相關聯之Z軸運動系統提供。由於該等列印頭相對於基板移動,因此油墨之微滴在正確時間經噴射以便沈積於基板上之所要位置中。可使用基板加載及卸載系統插入基板以及自印表機移除基板。取決於印表機配置,此可使用機械傳送機、具有傳送總成之基板浮動台或具有端接器之基板轉移機器人來完成。列印頭管理系統可包含若干子系統,該等子系統允許諸如以下者的此類管理任務:檢查噴嘴發射以及對來自列印頭中每一噴嘴之小滴體積、速度及軌跡之量測;及諸如以下者的維護任務:擦淨或吸乾噴嘴表面之過量油墨、藉由使油墨自油墨供應噴射穿過列印頭且進入廢料池中來引動及沖洗列印頭,及更換列印頭。鑒於可包含OLED列印系統之各種組件,OLED列印系統之各種實施例可具有各種覆蓋區及形狀因子。 The print head assembly can include at least one inkjet head that is capable of being subjected to Controlling the rate, speed, and size to eject at least one orifice of the ink droplet. The inkjet head is fed by an ink supply system that supplies ink to the inkjet head. As shown in the expanded view of FIG. 20B, the OLED inkjet printing system 2000 can have a substrate such as a substrate 2050 that can be supported by a substrate support device such as a chuck, such as but not limited to a vacuum chuck. A substrate floating chuck having a pressure enthalpy and a substrate floating chuck having a vacuum crucible and a pressure crucible. In various embodiments of the systems and methods of the present teachings, the substrate support apparatus can be a substrate floating stage. As will be discussed in more detail later, the substrate floating stage 2200 of FIG. 20B can be used to support the substrate 2050 and can be combined with a Y-axis motion system to provide portions of the substrate transport system for frictionless transfer of the substrate 2050. The basis of the OLED inkjet printing system 2000 shown in Figures 20A and 20B The plate floating stage 2200 can define the travel of the substrate 2050 through the gas inclusion assembly 1000 of FIG. 19 during the printing process. Printing requires relative movement between the print head assembly and the substrate. This is done using a motion system, typically a gantry or split shaft XYZ system. The print head assembly can be moved over a stationary substrate (gantry) or, in the case of a split shaft configuration, both the print head and the substrate can be moved. In another embodiment, the printhead assembly can be substantially stationary; for example, on the X-axis and the Y-axis, and the substrate can move relative to the printheads on the X-axis and the Y-axis, Wherein the Z-axis motion is provided by a substrate support device or by a Z-axis motion system associated with the printhead assembly. As the print heads move relative to the substrate, the droplets of ink are ejected at the correct time for deposition in a desired location on the substrate. The substrate can be inserted into the substrate using a substrate loading and unloading system and the substrate removed from the printer. Depending on the printer configuration, this can be done using a mechanical conveyor, a substrate floating table with a transfer assembly, or a substrate transfer robot with a terminator. The printhead management system can include subsystems that allow such management tasks as: checking nozzle firing and measuring the droplet volume, velocity, and trajectory from each nozzle in the printhead; And maintenance tasks such as wiping or sucking excess ink on the nozzle surface, priming and rinsing the print head by ejecting ink from the ink supply through the print head and into the waste pool, and replacing the print head . Various embodiments of OLED printing systems can have various footprints and form factors in view of the various components that can include an OLED printing system.

在圖20B之OLED列印系統2000的展開圖中,列印系統之 各種實施例可包括藉由基板浮動台底座2220支撐之基板浮動台2200。基板浮動台底座2220可安裝在列印系統底座2100上。OLED列印系統之基板浮動台2200可支撐基板2050以及界定基板2050於OLED基板之列印期間可移動穿過氣體包體總成1000之行程。就該方面而言,基板浮動台2200可與 如圖20B中所描繪之Y軸運動系統的運動系統結合提供基板2050穿過列印系統之無摩擦傳送。 In the expanded view of the OLED printing system 2000 of FIG. 20B, the printing system Various embodiments may include a substrate floating table 2200 supported by a substrate floating table base 2220. The substrate floating table base 2220 can be mounted on the printing system base 2100. The substrate floating stage 2200 of the OLED printing system can support the substrate 2050 and define a stroke of the substrate 2050 that can be moved through the gas inclusion assembly 1000 during printing of the OLED substrate. In this regard, the substrate floating table 2200 can be The motion system of the Y-axis motion system as depicted in Figure 20B combines to provide frictionless transfer of the substrate 2050 through the printing system.

圖21描繪根據本教示內容之各種實施例的用於無摩擦支撐 的浮動台,該浮動台與傳送系統結合達成諸如圖20B之基板2050的負載之穩定傳送。浮動台之各種實施例可用於本教示內容之氣體包體系統的各種實施例之任何者。如先前所論述,本教示內容之氣體包體系統的各種實施例可處理一系列的OLED平板顯示器基板大小,即自小於具有約61cm×72cm之尺寸的第3.5代基板的大小以及進展至更大代數的大小。應涵蓋的是,氣體包體系統之各種實施例可處理具有約130cm×150cm之尺寸的第5.5代基板大小,以及具有約195cm×225cm之尺寸的第7.5代基板大小,且可切割成每一基板八個42"平板或六個47"平板及更大。第8.5代基板為大致220×250cm,且可切割成每一基板六個55"平板或八個46"平板。然而,基板代數大小不斷進步,以使得當前可利用的具有約285cm×305cm之尺寸的第10基板代似乎不會是最終一代的基板大小。另外,由玻璃基基板之使用所產生的術語所闡述的大小可適於具有適用於OLED列印之任何材料的基板。對於OLED噴墨列印系統之各種實施例,各種基板材料可用於基板2050,例如但不限於各種玻璃基板材料以及各種聚合物基板材料。因此,在本教示內容之氣體包體系統的各種實施例中,存在需要於列印期間穩定傳送的各種基板大小及材料。 21 depicts a frictionless support in accordance with various embodiments of the present teachings. A floating stage that, in conjunction with the transport system, achieves a stable transfer of the load of the substrate 2050, such as FIG. 20B. Various embodiments of the floating station can be used with any of the various embodiments of the gas enclosure system of the present teachings. As previously discussed, various embodiments of the gas inclusion system of the present teachings can handle a range of OLED flat panel display substrate sizes, i.e., from a size less than a 3.5th generation substrate having a size of about 61 cm x 72 cm and progressing to greater The size of the algebra. It should be understood that various embodiments of the gas inclusion system can process a 5.5th generation substrate size having a size of about 130 cm x 150 cm, and a 7.5th generation substrate size having a size of about 195 cm x 225 cm, and can be cut into each The substrate has eight 42" plates or six 47" plates and larger. The 8.5th generation substrate is approximately 220 x 250 cm and can be cut into six 55" plates or eight 46" plates per substrate. However, the substrate algebra size continues to advance so that the currently available 10th substrate generation having a size of about 285 cm x 305 cm does not seem to be the final generation substrate size. Additionally, the dimensions set forth in the terms produced by the use of glass-based substrates can be adapted to substrates having any material suitable for OLED printing. For various embodiments of OLED inkjet printing systems, various substrate materials can be used for substrate 2050 such as, but not limited to, various glass substrate materials and various polymeric substrate materials. Thus, in various embodiments of the gas enclosure system of the present teachings, there are various substrate sizes and materials that require stable delivery during printing.

如圖21中所描繪,根據本教示內容之各種實施例的基板浮 動台2200可具有用於支撐複數個浮動台區的浮動台底座2220。基板浮動台2200可具有區2210,其中壓力及真空二者可經由複數個埠來施加。具有壓 力控制及真空控制二者的此種區可在區2210與基板(未圖示)之間提供流體彈簧。具有壓力控制及真空控制二者的區2210為具有雙向剛度之流體彈簧。負載與浮動台表面之間存在的間隙稱為飛行高度(fly height)。諸如圖21之基板浮動台2200的區2210之區可提供用於諸如基板之負載的可控制飛行高度,在該區中,使用複數個壓力埠及真空埠來產生具有雙向剛度之流體彈簧。 As depicted in Figure 21, the substrate floats in accordance with various embodiments of the present teachings The stage 2200 can have a floating table base 2220 for supporting a plurality of floating stages. The substrate floating stage 2200 can have a zone 2210 in which both pressure and vacuum can be applied via a plurality of turns. With pressure Such a zone of both force control and vacuum control provides a fluid spring between zone 2210 and a substrate (not shown). Zone 2210, which has both pressure control and vacuum control, is a fluid spring with bi-directional stiffness. The gap that exists between the load and the surface of the floating table is called the fly height. A region of zone 2210, such as substrate floating table 2200 of Figure 21, can provide a controllable fly height for loads such as substrates in which a plurality of pressure ports and vacuum ports are used to create a fluid spring having bi-directional stiffness.

鄰近區2210的分別是第一過渡區2211及第二過渡區2212, 且隨後鄰近第一過渡區2211及第二過渡區2212的分別是壓力唯一區2213及2214。在該等過渡區中,壓力噴嘴與真空噴嘴之比率朝向壓力唯一區逐漸增加,以便提供自區2210至區2213及2214的逐漸過渡。如圖21中所指示,圖14B描繪三個區之展開圖。對於基板浮動台之各種實施例,例如如圖21中所描繪,壓力唯一區2213、2214係描繪為包含導軌結構。對於基板浮動台之各種實施例,諸如圖21之壓力唯一區2213、2214的壓力唯一區可包含連續板,諸如對圖21的壓力-真空區2210所描繪之連續板。 The adjacent area 2210 is a first transition area 2211 and a second transition area 2212, respectively. And then adjacent to the first transition zone 2211 and the second transition zone 2212 are pressure unique zones 2213 and 2214, respectively. In the transition zones, the ratio of pressure nozzles to vacuum nozzles gradually increases toward the pressure only zone to provide a gradual transition from zone 2210 to zones 2213 and 2214. As indicated in Figure 21, Figure 14B depicts an expanded view of three zones. For various embodiments of the substrate floating table, such as depicted in FIG. 21, the pressure unique regions 2213, 2214 are depicted as including a rail structure. For various embodiments of the substrate floating table, the pressure unique zone, such as the pressure unique zones 2213, 2214 of FIG. 21, can comprise a continuous plate, such as the continuous plate depicted for the pressure-vacuum zone 2210 of FIG.

對於如圖21中所描繪之浮動台的各種實施例,壓力-真空 區、過渡區與壓力唯一區之間可存在基本上一致高度,以使得在公差範圍內,該等三個區基本上位於一個平面中且長度可變化。例如但在不限制的情況下,為提供對規模及比例之感覺,對於本教示內容之浮動台的各種實施例而言,過渡區可為約400mm,而壓力唯一區可為約2.5m,且壓力-真空區可為約800mm。在圖21中,壓力唯一區2213及2214不會提供具有雙向剛度之流體彈簧,且因此不會提供區2210可提供之控制。因此,負載於壓力唯一區上方之飛行高度可通常大於基板於壓力-真空區上方之飛行高 度,以便允許足夠的高度從而使得負載將不會在壓力唯一區中與浮動台碰撞。例如但在不限制的情況下,可需要處理一OLED面板基板,其在諸如區2213及2214的壓力唯一區上方具有約150μ至約300μ之間的飛行高度,以及隨後諸如區2210的壓力-真空區上方具有約30μ至約50μ之間的飛行高度。 For various embodiments of the floating table as depicted in Figure 21, pressure-vacuum There may be a substantially uniform height between the zone, the transition zone and the pressure zone, such that within the tolerances, the three zones are substantially in one plane and the length may vary. For example, but without limitation, to provide a sense of scale and proportion, for various embodiments of the floating station of the present teachings, the transition zone may be about 400 mm and the pressure only zone may be about 2.5 m, and The pressure-vacuum zone can be about 800 mm. In Figure 21, the pressure unique zones 2213 and 2214 do not provide a fluid spring with bi-directional stiffness and therefore do not provide the control that the zone 2210 can provide. Therefore, the flying height above the unique zone of pressure can generally be greater than the flying height of the substrate above the pressure-vacuum zone. Degrees in order to allow sufficient height so that the load will not collide with the floating table in the unique zone of pressure. For example, but without limitation, it may be desirable to process an OLED panel substrate having a flying height between about 150[mu] to about 300[mu] above the pressure unique regions such as regions 2213 and 2214, and subsequently a pressure-vacuum such as region 2210. Above the zone there is a flying height of between about 30μ and about 50μ.

基板浮動台2200之各種實施例可容納於氣體包體中,該氣 體包體包括本教示內容之氣體包體總成,例如但不限於圖3及圖19中描繪及描述之彼等氣體包體總成,該氣體包體總成可與如圖15至圖18所描述之彼等者的各種系統功能整合。例如,氣體包體系統之各種實施例可利用加壓惰性氣體再循環系統,以用於各種氣動操作裝置及設備的操作。另外,如先前所論述,本教示內容之氣體包體總成的實施例可維持在相對於外部環境之稍微正的壓力下,例如但不限於約2mbarg至約8mbarg之間的壓力下。維持氣體包體系統內之加壓惰性氣體再循環系統可為有挑戰的,因為其要求關於維持氣體包體系統之稍微正的內部壓力,同時將加壓氣體連續引入氣體包體系統中之動態及持續不斷的平衡動作。此外,各種氣動操作裝置及設備之可變需求可對本教示內容之各種氣體包體總成及系統產生不規則的壓力概況。因此,在此類條件下維持保持在相對於外部環境之稍微正的壓力下的氣體包體系統之動態壓力平衡可提供持續不斷的OLED列印製程之整體性。 Various embodiments of the substrate floating table 2200 can be housed in a gas enclosure, the gas The body package includes a gas inclusion assembly of the teachings such as, but not limited to, the gas inclusion assemblies depicted and described in Figures 3 and 19, which may be as shown in Figures 15-18. The integration of various system functions described by them. For example, various embodiments of gas inclusion systems may utilize a pressurized inert gas recirculation system for operation of various pneumatic operating devices and equipment. Additionally, as previously discussed, embodiments of the gas inclusion assembly of the present teachings can be maintained at a slightly positive pressure relative to the external environment, such as, but not limited to, a pressure of between about 2 mbarg to about 8 mbarg. Maintaining a pressurized inert gas recirculation system within a gas enclosure system can be challenging because it requires a slight positive internal pressure to maintain the gas inclusion system while continuously introducing pressurized gas into the gas inclusion system. And continuous balancing action. In addition, the variable requirements of various pneumatic operating devices and equipment can create an irregular pressure profile for various gas inclusion assemblies and systems of the present teachings. Thus, maintaining dynamic pressure balance of a gas enclosure system that maintains a slightly positive pressure relative to the external environment under such conditions can provide continuous OLED printing process integrity.

返回參考圖20B,列印系統底座2100可包括第一豎板(不 可見)及第二豎板2122,橋接器2130係安裝於該第二豎板上。對於OLED列印系統2000之各種實施例而言,橋接器2130可支撐第一X,Z軸托架總成 2301及第二X,Z軸托架總成2302,該等總成可分別控制第一列印頭總成2501及第二列印頭總成2502之移動。儘管圖20B描繪兩個托架總成及兩個列印頭總成,但是對於OLED噴墨列印系統2000之各種實施例而言,可存在單一托架總成及單一列印頭總成。例如,第一列印頭總成2501及第二列印頭總成2502之任一者可安裝在X,Z軸托架總成上,而用於檢查基板2050之特徵的攝影機系統可安裝在第二X,Z軸托架總成上。OLED噴墨列印系統2000之各種實施例可具有單一列印頭系統,例如第一列印頭總成2501及第二列印頭總成2502之任一者可安裝於X,Z軸托架總成上,而用於固化列印於基板2050上之封裝層的UV燈可安裝於第二X,Z軸托架總成上。對於OLED噴墨列印系統2000之各種實施例而言,可存在單一列印頭總成,例如第一列印頭總成2501及第二列印頭總成2502之任一者安裝於X,Z軸托架總成上,而用於固化列印於基板2050上之封裝層的熱源可安裝於第二托架總成上。 Referring back to FIG. 20B, the printing system base 2100 can include a first riser (not Visible) and the second riser 2122, the bridge 2130 is mounted on the second riser. For various embodiments of the OLED printing system 2000, the bridge 2130 can support the first X, Z-axis bracket assembly 2301 and a second X, Z-axis bracket assembly 2302 that can control movement of the first printhead assembly 2501 and the second printhead assembly 2502, respectively. Although FIG. 20B depicts two carriage assemblies and two print head assemblies, for various embodiments of the OLED inkjet printing system 2000, there may be a single carriage assembly and a single print head assembly. For example, any of the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted on the X, Z-axis bracket assembly, and the camera system for inspecting the features of the substrate 2050 can be mounted on The second X, Z-axis bracket assembly. Various embodiments of the OLED inkjet printing system 2000 can have a single printhead system, for example, any of the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted to an X, Z-axis bracket On the assembly, a UV lamp for curing the encapsulation layer printed on the substrate 2050 can be mounted on the second X, Z-axis carrier assembly. For various embodiments of the OLED inkjet printing system 2000, there may be a single printhead assembly, such as one of the first printhead assembly 2501 and the second printhead assembly 2502, mounted to X, A heat source for curing the encapsulation layer printed on the substrate 2050 can be mounted on the second carrier assembly.

在圖20B中,第一X,Z軸托架總成2301可用來將第一列印 頭總成2501定位於基板2050上方,該第一列印頭總成可安裝於第一Z軸移動板2310上,該基板展示為支撐於基板浮動台2200上。第二X,Z軸托架總成2302可經類似配置用於控制第二列印頭總成2502相對於基板2050的X-Z軸移動。諸如圖20B之第一列印頭總成2501及第二列印頭總成2502的每一列印頭總成可具有安裝於至少一個列印頭裝置中的複數個列印頭,如第一列印頭總成2501之部分視圖中所描繪,該部分視圖描繪複數個列印頭2505。列印頭裝置可包括例如但不限於連至至少一個列印頭的流體及電子連接件;每一列印頭具有能夠以受控速率、速度及大小噴射油墨之複數個噴 嘴或孔口。對於列印系統2000之各種實施例,列印頭總成可包括介於約1個至約60個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中的介於約1個至約30個之間的列印頭。例如工業噴墨頭之列印頭可具有介於約16個至約2048個之間的噴嘴,該等噴嘴可射出介於約0.1pL至約200pL之間的微滴體積。 In Figure 20B, the first X, Z-axis carriage assembly 2301 can be used to print the first print The head assembly 2501 is positioned above the substrate 2050, and the first print head assembly is mountable on the first Z-axis moving plate 2310, the substrate being shown supported on the substrate floating table 2200. The second X, Z-axis carriage assembly 2302 can be similarly configured to control the movement of the second print head assembly 2502 relative to the X-Z axis of the substrate 2050. Each of the printhead assemblies, such as the first printhead assembly 2501 and the second printhead assembly 2502 of Figure 20B, can have a plurality of printheads mounted in at least one of the printhead assemblies, such as the first column Depicted in a partial view of the printhead assembly 2501, the partial view depicts a plurality of printheads 2505. The printhead device can include, for example, but not limited to, fluid and electrical connections to at least one of the printheads; each printhead has a plurality of sprays capable of ejecting ink at a controlled rate, speed, and size. Mouth or orifice. For various embodiments of the printing system 2000, the printhead assembly can include between about 1 and about 60 printhead devices, wherein each printhead device can have a printhead device in each of the printhead devices. A print head between about 1 and about 30. For example, a printhead of an industrial inkjet head can have between about 16 and about 2048 nozzles that can eject a droplet volume between about 0.1 pL and about 200 pL.

根據圖20A及圖20B之氣體包體總成1000及列印系統2000 之各種實施例,列印系統可具有可鄰近於列印頭總成安裝的列印頭管理系統,例如第一列印頭管理系統2701及第二列印頭管理系統2702可分別安裝在第一列印頭管理系統平台2703及第二列印頭管理系統平台2704上。圖20B中將第一列印頭管理系統平台2703及第二列印頭管理系統平台2704描繪成附著至浮動台底座2100。列印頭管理系統之各種實施例可在列印頭總成上執行各種量測任務及維護任務。在列印頭上執行之各種量測可包括例如但不限於檢查噴嘴發射、量測小滴體積、速度及軌跡,以及調諧列印頭以使得每一噴嘴噴射已知體積之小滴。維護列印頭可包括例如但不限於以下程序:諸如列印頭沖洗及引動,此需要收集及圍堵自列印頭射出之油墨;於沖洗或引動程序之後移除過量油墨,以及列印頭或列印頭裝置之更換。 在列印製程中,例如對於OLED顯示面板基板之列印而言,噴嘴之可靠發射對於確保列印製程可製造合格OLED面板顯示器而言係關鍵的。因此必要的是,與列印頭管理相關聯之各種程序可容易且可靠地進行來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印 製程之前將該污染物移除。 Gas inclusion assembly 1000 and printing system 2000 according to Figs. 20A and 20B In various embodiments, the printing system can have a printhead management system mountable adjacent to the printhead assembly, for example, the first printhead management system 2701 and the second printhead management system 2702 can be mounted first The print head management system platform 2703 and the second print head management system platform 2704 are mounted. The first print head management system platform 2703 and the second print head management system platform 2704 are depicted in FIG. 20B as being attached to the floating stage base 2100. Various embodiments of the printhead management system can perform various measurement tasks and maintenance tasks on the printhead assembly. The various measurements performed on the printhead can include, for example, but are not limited to, inspecting nozzle emissions, measuring droplet volume, velocity, and trajectory, and tuning the printheads such that each nozzle ejects droplets of known volume. Maintenance of the print head may include, for example but without limitation, a process such as print head rinsing and priming, which requires collecting and containing ink ejected from the print head; removing excess ink after rinsing or priming procedures, and print heads Or replacement of the print head unit. In a printing process, such as for the printing of OLED display panel substrates, reliable emission of the nozzles is critical to ensure that the printing process can produce a qualified OLED panel display. It is therefore necessary that the various procedures associated with printhead management can be easily and reliably performed to eliminate or minimize the exposure of the printing system package to contaminants such as air and water vapor and various organic vapors and Particulate pollutants. According to various systems and methods of the present teachings, the printing system package can be introduced to achieve a sufficiently low level of contamination so that the purification system can affect the printing of contaminants. The contaminant is removed prior to the process.

根據本教示內容之氣體包體系統的各種實施例,鑒於數目眾 多的列印頭裝置及列印頭,第一列印頭管理系統2701及第二列印頭管理系統2702可容納於輔助包體中,該輔助包體可在列印製程期間隔離,以便在幾乎不或不中斷列印製程的情況下執行各種量測任務及維護任務。如圖20B中可見,可見第一列印頭總成2501相對於第一列印頭管理系統2701定位,以準備執行可藉由第一列印頭管理系統設備2707、2709及2711執行的各種量測程序及維護程序。設備2707、2709及2011可為用於執行各種列印頭管理功能的各種子系統或模組中之任何者。例如,設備2707、2709及2011可為小滴量測模組、列印頭更換模組、沖洗池模組及吸墨紙模組中之任何者。 Various embodiments of a gas enclosure system in accordance with the teachings herein, in view of the number The plurality of print head devices and the print heads, the first print head management system 2701 and the second print head management system 2702 can be housed in the auxiliary package, and the auxiliary package can be isolated during the printing process so as to be Perform various measurement tasks and maintenance tasks with little or no interruption in the printing process. As can be seen in Figure 20B, it can be seen that the first printhead assembly 2501 is positioned relative to the first printhead management system 2701 in preparation for performing various amounts that can be performed by the first printhead management system devices 2707, 2709, and 2711. Test procedures and maintenance procedures. Devices 2707, 2709, and 2011 can be any of a variety of subsystems or modules for performing various printhead management functions. For example, the devices 2707, 2709, and 2011 can be any of a droplet measurement module, a printhead replacement module, a rinse tank module, and a blotter paper module.

回顧而言,列印頭總成可包括介於約1個至約60個列印頭 裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中之介於約1個至約30個之間的列印頭。因此,本教示內容之列印系統的各種實施例可具有介於約1個至約1800個之間的列印頭。數目眾多的列印頭可需要根據所需而週期性地執行持續不斷的量測及維護程序。例如,小滴量測模組可用於維護任務,諸如檢查噴嘴發射以及對來自列印頭中每一噴嘴之小滴體積、速度及軌跡之量測。沖洗池模組可用於藉由使油墨自油墨供應噴射穿過列印頭且進入廢料池中來引動及沖洗列印頭,同時吸墨紙模組可用於擦拭或吸乾噴墨噴嘴表面之過量油墨。 In retrospect, the printhead assembly can include between about 1 and about 60 printheads. A device wherein each of the printhead devices can have between about 1 and about 30 printheads in each of the printhead devices. Thus, various embodiments of the printing system of the present teachings can have between about 1 and about 1800 printheads. A large number of print heads may require periodic measurement and maintenance procedures to be performed as needed. For example, the droplet measurement module can be used for maintenance tasks, such as checking nozzle firing and measuring the droplet volume, velocity, and trajectory from each nozzle in the printhead. The rinsing pool module can be used to priming and rinsing the print head by ejecting ink from the ink supply through the print head and into the waste pool, while the blotter module can be used to wipe or blot excess of the surface of the ink jet nozzle Ink.

就該方面而言,每一子系統皆可具有各種部件,該等部件本 質上為可消耗的,且需要更換,諸如更換吸墨紙、油墨及廢料儲器。各種可消耗部件可經封裝以準備例如以完全自動模式使用處置器進行插入。作 為非限制性實例,吸墨紙可封裝於匣筒格式中,該匣筒格式可易於插入吸墨模組中供使用。舉另一非限制性實例而言,油墨可封裝於可更換儲器及匣筒格式中以用於列印系統中。廢料儲器之各種實施例可封裝於匣筒格式中,該匣筒格式可易於插入沖洗池模組中供使用。另外,經受持續不斷使用之列印系統之各種組件的部件可需要週期性更換。在列印製程期間,可需要列印頭總成之權宜管理,例如但不限於列印頭裝置或列印頭之交換。 列印頭更換模組可具有諸多部件,諸如列印頭裝置或列印頭,該等部件可易於插入列印頭總成中供使用。用於檢查噴嘴發射以及基於來自每一噴嘴之小滴體積、速度及軌跡之光學偵測進行量測的小滴量測模組可具有在使用之後可需要週期性更換的來源及偵測器。各種可消耗及高使用率部件可經封裝以用於準備例如以完全自動模式使用處置器進行插入或藉由終端使用者緩和交換進行插入。因此,利用輔助包體進行列印系統之各部件的自動化或終端使用者緩和交換可確保列印製程可以不受中斷方式持續進行。 如圖20B中所描繪,第一列印頭管理系統設備2707、2709及2711可安裝於線性導軌運動系統2705上,以用於相對於第一列印頭總成2501來定位。 In this respect, each subsystem can have various components, and the components It is consumable and needs to be replaced, such as replacing blotting paper, ink and waste storage. The various consumable parts can be packaged to prepare for insertion using the handler, for example, in a fully automated mode. Make By way of non-limiting example, the blotter paper can be packaged in a cartridge format that can be easily inserted into an ink absorbing module for use. By way of another non-limiting example, the ink can be packaged in a replaceable reservoir and cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into a rinse tank module for use. In addition, components that are subject to the various components of the continuously used printing system may require periodic replacement. During the printing process, expediency management of the printhead assembly may be required, such as, but not limited to, the exchange of printhead devices or printheads. The printhead replacement module can have many components, such as a printhead device or a printhead, which can be easily inserted into the printhead assembly for use. The droplet measurement module for inspecting nozzle emissions and measuring optical detection based on droplet volume, velocity and trajectory from each nozzle may have sources and detectors that may need to be periodically replaced after use. The various consumable and high usage components can be packaged for preparation for insertion, for example, using a handler in a fully automated mode or by an end user mitigation exchange. Thus, automated or end-user mitigation of the various components of the printing system with the auxiliary package ensures that the printing process can continue uninterrupted. As depicted in FIG. 20B, first printhead management system devices 2707, 2709, and 2711 can be mounted on linear guide motion system 2705 for positioning relative to first printhead assembly 2501.

關於具有可經封閉而與第一工作體積分開以及以可密封方 式與該第一工作體積隔離之輔助包體的氣體包體總成之各種實施例,再次參考圖20A。如圖20B中所描繪,OLED列印系統2000上可存在四個隔離器;第一隔離器組2110(未圖示位於相反側上之第二隔離器)以及第二隔離器組2112(未圖示位於相反側上之第二隔離器),該等隔離器組支撐OLED列印系統2000之基板浮動台2200。對於圖20A之氣體包體總成1000,第一隔離器組2110及第二隔離器組2112可安裝在每一各別隔離器壁面板中,諸 如安裝在中間底座面板總成1320'之第一隔離器壁面板1325'及第二隔離器壁面板1327'中。對於圖20A之氣體包體總成1000,中間底座總成1320'可包括第一列印頭管理系統輔助面板總成1330'以及第二列印頭管理系統輔助面板總成1370'。圖20A之氣體包體總成1000描繪可包括第一背壁面板總成1338'之第一列印頭管理系統輔助面板總成1330'。類似地,亦描繪可包括第二背壁面板總成1378'之第二列印頭管理系統輔助面板總成1370'。第一列印頭管理系統輔助面板總成1330'之第一背壁面板總成1338'可以與對第二背壁面板總成1378'所示類似之方式構造。第二列印頭管理系統輔助面板總成1370'之第二背壁面板總成1378'可構造自具有第二密封支撐面板1375之第二背壁框架總成1378,該第二密封支撐面板可以可密封方式安裝至第二背壁框架總成1378。第二密封支撐面板1375可具有第二通道1365,該第二通道鄰近於底座2100之第二端(未圖示)。第二密封件1367可安裝於圍繞第二通道1365之第二密封支撐面板1375上。第一密封件可類似地圍繞用於第一列印頭管理系統輔助面板總成1330'之第一通道來定位及安裝。輔助面板總成1330'及輔助面板總成1370'中之每一通道可加以適應,以使得諸如圖20B之第一維護系統平台2703及第二維護系統平台2704之每一維護系統平台通過各通道。如隨後將更詳細地論述,為以可密封方式隔離輔助面板總成1330'及輔助面板總成1370',諸如圖20A之第二通道1365的通道必須為可密封的。應涵蓋的是,諸如充氣式密封件、波紋管密封件及唇形密封件之各種密封件可用於圍繞於附著至列印系統底座之維護平台來密封諸如圖20A之第二通道1365的通道。 Regarding having a sealable and separate from the first working volume and being sealable Various embodiments of a gas inclusion assembly of an auxiliary package isolated from the first working volume are again referenced to FIG. 20A. As depicted in Figure 20B, there may be four isolators on the OLED printing system 2000; a first isolator group 2110 (not shown on the opposite side of the second isolator) and a second isolator group 2112 (not shown) A second isolator, shown on the opposite side, supports the substrate floating table 2200 of the OLED printing system 2000. For the gas inclusion assembly 1000 of Figure 20A, a first isolator set 2110 and a second isolator set 2112 can be mounted in each individual isolator wall panel, For example, it is mounted in the first isolator wall panel 1325' and the second isolator wall panel 1327' of the intermediate base panel assembly 1320'. For the gas enclosure assembly 1000 of Figure 20A, the intermediate base assembly 1320' can include a first printhead management system auxiliary panel assembly 1330' and a second printhead management system auxiliary panel assembly 1370'. The gas inclusion body assembly 1000 of Figure 20A depicts a first printhead management system auxiliary panel assembly 1330' that can include a first back wall panel assembly 1338'. Similarly, a second printhead management system auxiliary panel assembly 1370' that can include a second back wall panel assembly 1378' is also depicted. The first back wall panel assembly 1338' of the first printhead management system auxiliary panel assembly 1330' can be constructed in a manner similar to that shown for the second back wall panel assembly 1378'. The second back wall panel assembly 1378' of the second print head management system auxiliary panel assembly 1370' can be constructed from a second back wall frame assembly 1378 having a second seal support panel 1375, which can be configured Mounted to the second back wall frame assembly 1378 in a sealable manner. The second seal support panel 1375 can have a second passage 1365 adjacent the second end of the base 2100 (not shown). The second seal 1367 can be mounted on the second seal support panel 1375 surrounding the second passage 1365. The first seal can similarly be positioned and mounted about the first passage for the first printhead management system auxiliary panel assembly 1330'. Each of the auxiliary panel assembly 1330' and the auxiliary panel assembly 1370' can be adapted such that each of the first maintenance system platform 2703 and the second maintenance system platform 2704 of FIG. 20B passes through each channel . As will be discussed in more detail later, to isolate the auxiliary panel assembly 1330' and the auxiliary panel assembly 1370' in a sealable manner, the passages such as the second passage 1365 of Figure 20A must be sealable. It should be contemplated that various seals, such as inflatable seals, bellows seals, and lip seals, can be used to seal a passage such as the second passage 1365 of Figure 20A about a maintenance platform attached to the print system base.

第一列印頭管理系統輔助面板總成1330'及第二列印頭管理 系統輔助面板總成1370'可分別包括第一底板面板總成1341'之第一列印頭總成開口1342及第二底板面板總成1381'之第二列印頭總成開口1382。圖20A中將第一底板面板總成1341'描繪為中間面板總成1300'之第一中間包體面板總成1340'的部分。第一底板面板總成1341'係由第一中間包體面板總成1340'及第一列印頭管理系統輔助面板總成1330'二者共用的面板總成。圖20A中將第二底板面板總成1381'描繪成中間面板總成1300'之第二中間包體面板總成1380'的部分。第二底板面板總成1381'係由第二中間包體面板總成1380'及第二列印頭管理系統輔助面板總成1370'二者共用的面板總成。 The first print head management system auxiliary panel assembly 1330' and the second print head management The system auxiliary panel assembly 1370' can include a first printhead assembly opening 1342 of the first backplane panel assembly 1341' and a second printhead assembly opening 1382 of the second backplane panel assembly 1381', respectively. The first floor panel assembly 1341' is depicted in FIG. 20A as part of the first intermediate body panel assembly 1340' of the intermediate panel assembly 1300'. The first floor panel assembly 1341' is a panel assembly that is shared by both the first intermediate body panel assembly 1340' and the first row head management system auxiliary panel assembly 1330'. The second floor panel assembly 1381' is depicted in Figure 20A as part of the second intermediate body panel assembly 1380' of the intermediate panel assembly 1300'. The second floor panel assembly 1381' is a panel assembly that is shared by both the second intermediate body panel assembly 1380' and the second row head management system auxiliary panel assembly 1370'.

如先前所提及,第一列印頭總成2501可容納在第一列印頭 總成包體2503中,且第二列印頭總成2502可容納在第二列印頭總成包體2504中。如隨後將更詳細地論述,第一列印頭總成包體2503及第二列印頭總成包體2504可具有位於可具有輪緣(未圖示)的底部處之開口,以使得各種列印頭總成可經定位用於列印製程期間的列印。另外,形成外殼的第一列印頭總成包體2503及第二列印頭總成總體2504之部分可如先前對各種面板總成所述來構造,以使得框架總成構件及面板能夠提供密閉式密封包體。 As mentioned previously, the first print head assembly 2501 can be accommodated in the first print head The assembly head 2503 is in the assembly and the second print head assembly 2502 can be received in the second print head assembly package 2504. As will be discussed in more detail later, the first printhead assembly body 2503 and the second printhead assembly package 2504 can have openings at the bottom that can have a rim (not shown) to enable various The printhead assembly can be positioned for printing during the printing process. Additionally, portions of the first printhead assembly body 2503 and the second printhead assembly body 2504 that form the outer casing can be constructed as previously described for the various panel assemblies to enable the frame assembly members and panels to provide Closed sealed enclosure.

諸如先前對各種框架構件之密閉式密封所述,可壓縮墊片可 圍繞第一列印頭總成開口1342及第二列印頭總成開口1382之每一者附著,或替代地,圍繞第一列印頭總成包體2503及第二列印頭總成包體2504之輪緣附著。 Compressible gaskets, such as previously described for hermetic seals of various frame members Attaching each of the first printhead assembly opening 1342 and the second printhead assembly opening 1382, or alternatively, surrounding the first printhead assembly package 2503 and the second printhead assembly package The rim of the body 2504 is attached.

如圖20A中所描繪,第一列印頭總成對接墊片1345及第二 列印頭總成對接墊片1385可分別圍繞第一列印頭總成開口1342及第二列印 頭總成開口1382附著。在各種列印頭量測及維護程序期間,第一列印頭總成2501及第二列印頭總成2502可分別藉由第一X,Z軸托架總成系統2301及第二X,Z軸托架總成2302分別定位在第一底板面板總成1341'之第一列印頭總成開口1342以及第二底板面板總成1381'之第二列印頭總成開口1382上方。就該方面而言,對於各種列印頭量測及維護程序而言,第一列印頭總成2501及第二列印頭總成2502可分別定位在第一底板面板總成1341'之第一列印頭總成開口1342及第二底板面板總成1381'之第二列印頭總成開口1382上方,無需覆蓋或密封第一列印頭總成開口1342及第二列印頭總成開口1382。第一X,Z軸托架總成2301及第二X,Z軸托架總成2302可分別將第一列印頭總成包體2503及第二列印頭總成包體2504分別與第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'對接。在各種列印頭量測及維護程序中,此種對接可有效地封閉第一列印頭總成開口1342及第二列印頭總成開口1382,而無需密封第一列印頭總成開口1342及第二列印頭總成開口1382。對於各種列印頭量測及維護程序而言,該對接可包括列印頭總成包體與列印頭管理系統面板總成之每一者之間的墊片密封件之形成。結合諸如圖20A之第二通道1365及互補第一通道的可密封封閉通道,當第一列印頭總成包體2503及第二列印頭總成包體2504與第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'對接來以可密封方式封閉第一列印頭總成開口1342及第二列印頭總成開口1382時,如此形成之組合結構為密閉式密封的。 As depicted in Figure 20A, the first print head assembly docking pad 1345 and the second The print head assembly docking pad 1385 can respectively surround the first print head assembly opening 1342 and the second print The head assembly opening 1382 is attached. During the various printhead measurement and maintenance procedures, the first printhead assembly 2501 and the second printhead assembly 2502 can be coupled to the first X, Z-axis carriage assembly system 2301 and the second X, respectively. The Z-axis bracket assembly 2302 is positioned over the first printhead assembly opening 1342 of the first floor panel assembly 1341' and the second printhead assembly opening 1382 of the second floor panel assembly 1381', respectively. In this regard, for various printhead measurement and maintenance procedures, the first printhead assembly 2501 and the second printhead assembly 2502 can be positioned respectively in the first backplane panel assembly 1341' a print head assembly opening 1342 and a second print head assembly opening 1382 of the second bottom panel assembly 1381', without covering or sealing the first print head assembly opening 1342 and the second print head assembly Opening 1382. The first X, Z-axis bracket assembly 2301 and the second X- and Z-axis bracket assembly 2302 can respectively respectively respectively the first print head assembly body 2503 and the second print head assembly package 2504 A print head management system auxiliary panel assembly 1330' and a second print head management system auxiliary panel assembly 1370' are docked. In various print head measurement and maintenance procedures, such docking effectively closes the first print head assembly opening 1342 and the second print head assembly opening 1382 without sealing the first print head assembly opening 1342 and the second row of print head assemblies opening 1382. For various printhead measurement and maintenance procedures, the docking may include the formation of a shim seal between the printhead assembly package and each of the printhead management system panel assemblies. In combination with a sealable closed passage such as the second passage 1365 of FIG. 20A and the complementary first passage, when the first print head assembly body 2503 and the second print head assembly package 2504 and the first print head management system The auxiliary panel assembly 1330' and the second row of print head management system auxiliary panel assemblies 1370' are butted to seal the first print head assembly opening 1342 and the second print head assembly opening 1382 in a sealable manner. The combined structure is hermetically sealed.

因此,第一列印頭總成開口1342及第二列印頭總成開口 1382之密封可將第一列印頭管理系統輔助面板總成1330'作為輔助包體區段 以及將第二列印頭管理系統輔助面板總成1370'作為輔助包體區段與氣體包體總成1000之剩餘體積分離。對於各種列印頭量測及維護程序而言,第一列印頭總成2501及第二列印頭總成2502可分別對接於第一列印頭總成開口1342及第二列印頭總成開口1382上方Z軸方向上之一墊片上,藉此封閉第一列印頭總成開口1342及第二列印頭總成開口1382。根據本教示內容,取決於於Z軸方向上施加至第一列印頭總成包體2503及第二列印頭總成包體2504之力,第一列印頭總成開口1342及第二列印頭總成開口1382可予以覆蓋或密封。就該方面而言,於Z軸方向上施加至第一列印頭總成包體2503的可密封第一列印頭總成開口1342之力可將第一列印頭管理系統輔助面板總成1330'作為輔助包體區段與構成氣體包體總成1000的剩餘框架構件總成區段隔離。類似地,於Z軸方向上施加至第二列印頭總成包體2504的可密封第二列印頭總成開口1382之力可將第二列印頭管理系統輔助面板總成1370'作為輔助包體區段與構成氣體包體總成1000的剩餘框架構件總成區段隔離。 Therefore, the first print head assembly opening 1342 and the second print head assembly opening The 1382 seal can be used as the auxiliary package section for the first print head management system auxiliary panel assembly 1330' And separating the second column of print head management system auxiliary panel assembly 1370' as an auxiliary package section from the remaining volume of the gas inclusion body assembly 1000. For various print head measurement and maintenance procedures, the first print head assembly 2501 and the second print head assembly 2502 can be respectively connected to the first print head assembly opening 1342 and the second print head total The opening 1382 is formed on one of the spacers in the Z-axis direction, thereby closing the first print head assembly opening 1342 and the second print head assembly opening 1382. According to the teachings, the first print head assembly opening 1342 and the second are dependent on the force applied to the first print head assembly body 2503 and the second print head assembly body 2504 in the Z-axis direction. The printhead assembly opening 1382 can be covered or sealed. In this aspect, the force of the sealable first print head assembly opening 1342 applied to the first print head assembly body 2503 in the Z-axis direction can be used to the first print head management system auxiliary panel assembly. 1330' is isolated as an auxiliary containment section from the remaining frame member assembly sections that make up the gas inclusion body assembly 1000. Similarly, the force applied to the sealable second printhead assembly opening 1382 of the second printhead assembly body 2504 in the Z-axis direction can be used as the second printhead management system auxiliary panel assembly 1370'. The auxiliary body section is isolated from the remaining frame member assembly sections that make up the gas enclosure assembly 1000.

圖22A至圖22F為氣體包體總成1001之示意性橫截面圖, 其可進一步例示第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'之各種觀點。諸如圖20A及圖20B之列印系統2000的列印系統之各種實施例可為對稱的,且可具有用於分別定位第一列印頭總成2501及第二列印頭總成2502的第一X,Z軸托架總成2301及第二X,Z軸托架總成2302。此外,氣體包體總成之各種實施例可具有第一輔助包體及第二輔助包體,諸如圖20A之第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370',其用於對接第一X軸托架總成及 第二X軸托架總成,該等托架總成可具有至少一個列印頭總成以及可需要維護之其他各種設備。就該方面而言,對於圖22A至圖22D,鑒於本教示內容之各種列印系統的列印系統對稱性,對第一列印頭管理系統輔助面板總成1330'所闡述之以下教示內容可適用於第二列印頭管理系統輔助面板總成1370'。 22A-22F are schematic cross-sectional views of a gas inclusion body assembly 1001, It may further illustrate various aspects of the first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly 1370'. Various embodiments of a printing system such as the printing system 2000 of Figures 20A and 20B can be symmetrical and can have a first position for positioning the first print head assembly 2501 and the second print head assembly 2502, respectively. An X, Z-axis bracket assembly 2301 and a second X- and Z-axis bracket assembly 2302. In addition, various embodiments of the gas inclusion assembly can have a first auxiliary package and a second auxiliary package, such as the first print head management system auxiliary panel assembly 1330' of FIG. 20A and the second print head management system. An auxiliary panel assembly 1370' for docking the first X-axis bracket assembly and A second X-axis bracket assembly that can have at least one printhead assembly and various other devices that may require maintenance. In this regard, with respect to Figures 22A-22D, in view of the symmetry of the printing system of the various printing systems of the present teachings, the following teachings set forth for the first print head management system auxiliary panel assembly 1330' may be Applicable to the second column head management system auxiliary panel assembly 1370'.

圖22A描繪氣體包體總成1001之示意性橫截面圖,其展示 第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'。圖22A之第一列印頭管理系統輔助面板總成1330'可容納第一列印頭管理系統2701,該第一列印頭管理系統可由第一列印頭管理系統定位系統2705相對於第一列印頭總成開口1342來定位。第一列印頭總成開口1342為位於第一底板面板總成1341'中之開口,該第一底板面板總成為由第一列印頭管理系統輔助面板總成1330'及第一中間包體面板總成1340'共用之面板。第一列印頭管理系統定位系統2705可安裝在第一列印頭管理系統平台2703上,該第一列印頭管理系統平台可穩固地安裝至底座2100之第一末端2101上。第一列印頭管理系統平台2703可自底座2100之第一末端2101延伸穿過第一通道1361至第一列印頭系統輔助面板總成1330'中。類似地,如圖22A中所描繪,圖22A之第二列印頭管理系統輔助面板總成1370'可容納第二列印頭管理系統2702,該第二列印頭管理系統可由第二列印頭管理系統定位系統2706相對於第二列印頭總成開口1382來定位。第二列印頭總成開口1382為位於第一底板面板總成1381'中之開口,該第一底板面板總成為由第二列印頭管理系統輔助面板總成1370'及第二中間包體面板總成1380'共用之面板。第二列印頭管理系統定位系統2706可安裝在第二列印頭管理 系統平台2704上,該第二列印頭管理系統平台可自底座2100之第二末端2102延伸穿過第二通道1365至第二列印頭管理系統輔助面板總成1370'中。 Figure 22A depicts a schematic cross-sectional view of a gas inclusion assembly 1001, shown The first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly 1370'. The first print head management system auxiliary panel assembly 1330' of FIG. 22A can accommodate a first print head management system 2701 that can be operated by a first print head management system positioning system 2705 relative to the first The print head assembly opening 1342 is positioned. The first print head assembly opening 1342 is an opening in the first floor panel assembly 1341'. The first floor panel is always the first print head management system auxiliary panel assembly 1330' and the first intermediate package. Panel assembly 1340' shared panel. The first print head management system positioning system 2705 can be mounted on a first print head management system platform 2703 that can be securely mounted to the first end 2101 of the base 2100. The first printhead management system platform 2703 can extend from the first end 2101 of the base 2100 through the first passage 1361 to the first printhead system auxiliary panel assembly 1330'. Similarly, as depicted in FIG. 22A, the second print head management system auxiliary panel assembly 1370' of FIG. 22A can accommodate a second print head management system 2702 that can be printed by a second print head. Head management system positioning system 2706 is positioned relative to second printhead assembly opening 1382. The second print head assembly opening 1382 is an opening in the first floor panel assembly 1381'. The first floor panel is always a second print head management system auxiliary panel assembly 1370' and a second intermediate package. Panel assembly 1380' shared panel. The second print head management system positioning system 2706 can be installed in the second print head management On the system platform 2704, the second printhead management system platform can extend from the second end 2102 of the base 2100 through the second channel 1365 to the second printhead management system auxiliary panel assembly 1370'.

第一密封件1363可在第一密封支撐面板1335之第一外表面 1337上圍繞第一通道1361來安裝。類似地,第二密封件1367可在第二密封支撐面板1375之第二外部表面1377上圍繞第二通道1365來安裝。相關於圖22A之密封件1361及1367,應涵蓋的是,提供機械密封件之各種墊片可用於密封通道1361及1367。 The first seal 1363 can be on the first outer surface of the first seal support panel 1335 The 1337 is mounted around the first channel 1361. Similarly, the second seal 1367 can be mounted around the second passage 1365 on the second outer surface 1377 of the second seal support panel 1375. With respect to seals 1361 and 1367 of Figure 22A, it should be noted that various gaskets providing mechanical seals can be used to seal passages 1361 and 1367.

在各種實施例中,可使用用於密封通道1361及1367之充氣 式墊片。充氣式墊片之各種實施例可自增強彈性體材料製成為中空模製結構,該結構在未充氣時可為凹陷構型、盤旋構型或平坦構型。在各種實施例中,墊片可安裝在第一密封支撐面板1335之第一外表面1337上以及第二密封支撐面板1375之第二外表面1377上,以用於分別圍繞底座2100以可密封方式封閉通道1361及1367。因此,當使用例如但不限於惰性氣體之各種適當流體介質之任何介質來充氣時,用於圍繞底座2100以可密封方式封閉通道1361及1367的充氣式墊片之各種實施例可分別在安裝表面與衝擊表面之間形成一緊密障壁,該安裝表面諸如第一密封支撐面板1335之第一外表面1337及第二密封支撐面板1375之第二外表面1377,該衝擊表面諸如底座2100之第一末端2101及第二末端2012之表面。在各種實施例中,充氣式墊片可分別安裝於底座第一末端2101及第二末端2012上,從而密封通道1361及1367。就該方面而言,對於各種實施例,底座2100之第一末端2101及第二末端2012可為安裝表面,且第一密封支撐面板1335之第一外表面1337及第二密封支撐面板1375之第二外表面1377可分別為衝擊表面。就該 方面而言,保形密封件之各種實施例可用來以可密封方式封閉通道1361及1365。 In various embodiments, inflation for sealing channels 1361 and 1367 can be used Gasket. Various embodiments of the inflatable gasket can be made from a self-reinforced elastomeric material into a hollow molded structure that can be in a recessed configuration, a spiral configuration, or a flat configuration when not inflated. In various embodiments, the gasket can be mounted on the first outer surface 1337 of the first seal support panel 1335 and the second outer surface 1377 of the second seal support panel 1375 for sealing in a sealable manner around the base 2100, respectively. Channels 1361 and 1367 are closed. Thus, various embodiments of the inflatable gasket for sealing the passages 1361 and 1367 in a sealable manner around the base 2100 can be respectively mounted on the mounting surface when inflated using any of a variety of suitable fluid media such as, but not limited to, an inert gas. Forming a tight barrier between the impact surface, such as a first outer surface 1337 of the first seal support panel 1335 and a second outer surface 1377 of the second seal support panel 1375, such as the first end of the base 2100 2101 and the surface of the second end 2012. In various embodiments, inflatable gaskets can be mounted to the first end 2101 and the second end 2012 of the base, respectively, thereby sealing the channels 1361 and 1367. In this regard, for various embodiments, the first end 2101 and the second end 2012 of the base 2100 can be a mounting surface, and the first outer surface 1337 of the first sealing support panel 1335 and the second sealing support panel 1375 The two outer surfaces 1377 can each be an impact surface. That should In aspects, various embodiments of the conformal seal can be used to seal the channels 1361 and 1365 in a sealable manner.

除充氣式墊片之各種實施例以外,諸如波紋管密封件或唇形 密封件之可撓性密封件亦可用於密封諸如圖22A之通道1361及1365的通道。可撓性密封件之各種實施例可永久地附接,例如附接至第一密封支撐面板1335之第一外表面1337及第二密封支撐面板1375之第二外表面1377。 或者,可撓性密封件之各種實施例可永久地附接至底座2100之第一末端2101及第二末端2102。此種永久附接密封件可提供用於適應底座2100之各種平移及振動移動所需要的可撓性,而同時提供用於諸如通道1361及1365之通道的密閉式密封。 In addition to various embodiments of inflatable gaskets, such as bellows seals or lips The flexible seal of the seal can also be used to seal passages such as channels 1361 and 1365 of Figure 22A. Various embodiments of the flexible seal may be permanently attached, such as to the first outer surface 1337 of the first seal support panel 1335 and the second outer surface 1377 of the second seal support panel 1375. Alternatively, various embodiments of the flexible seal can be permanently attached to the first end 2101 and the second end 2102 of the base 2100. Such a permanent attachment seal can provide the flexibility needed to accommodate the various translational and vibratory movements of the base 2100 while providing a hermetic seal for passages such as channels 1361 and 1365.

關於與本教示內容之氣體包體總成的各種實施例之密閉式 密封有關的各種挑戰,圍繞明確界定之邊緣形成保形密封件可為有問題的。在氣體包體之各種實施例中,其中圍繞一結構進行密封,該結構諸如分別附著至底座2100之第一末端2101及第二末端2012的第一列印頭管理系統平台2703及第二列印頭管理系統平台2703。此等平台結構可製造來消除需要密封的明確界定之邊緣。例如,附著至底座2100之第一末端2101及第二末端2012的第一列印頭管理系統平台2703及第二列印頭管理系統平台2703最初可製造成具有用於促進密封之圓形側向邊緣。附著至底座2100之第一末端2101及第二末端2012的第一列印頭管理系統平台2703及第二列印頭管理系統平台2703可由可提供用於支撐列印頭管理系統所需要的穩定性且亦經改質用於促進密封之材料製成,該材料例如但不限於花岡岩及鋼。 Closed version of various embodiments of the gas inclusion assembly with the teachings of the present teachings Sealing the various challenges associated with forming a conformal seal around a well defined edge can be problematic. In various embodiments of the gas enclosure, wherein a seal is applied around a structure, such as a first printhead management system platform 2703 and a second print respectively attached to the first end 2101 and the second end 2012 of the base 2100, respectively. Head management system platform 2703. These platform structures can be fabricated to eliminate well-defined edges that require sealing. For example, the first printhead management system platform 2703 and the second printhead management system platform 2703 attached to the first end 2101 and the second end 2012 of the base 2100 can be initially fabricated to have a circular lateral orientation for facilitating sealing. edge. The first printhead management system platform 2703 and the second printhead management system platform 2703 attached to the first end 2101 and the second end 2012 of the base 2100 can be provided with stability required to support the printhead management system It is also made of materials modified to promote sealing, such as, but not limited to, granite and steel.

圖22B及圖22C例示本教示內容之氣體包體總成1001的各 種開口及通道之覆蓋及密封,該等圖例示例如對於與列印頭總成管理有關的各種程序而言,第一列印頭總成2501相對於第一列印頭管理系統輔助面板總成1330'的定位。如先前所提及,對第一列印頭管理系統輔助面板總成1330'之以下教示內容亦可適用於第二列印頭管理系統輔助面板總成1370'。 22B and 22C illustrate each of the gas inclusion assemblies 1001 of the present teachings. Covering and sealing of openings and passages, examples of such illustrations, for various procedures related to the management of the print head assembly, the first print head assembly 2501 relative to the first print head management system auxiliary panel assembly Positioning of the 1330'. As previously mentioned, the following teachings for the first print head management system auxiliary panel assembly 1330' may also be applied to the second print head management system auxiliary panel assembly 1370'.

在圖22B中,第一列印頭總成2501可包括具有至少一個列 印頭之列印頭裝置2505,該至少一個列印頭包括複數個噴嘴或孔口。列印頭裝置2505可容納在第一列印頭總成包體2503中,該第一列印頭總成包體可具有第一列印頭總成包體開口2507,列印頭裝置2505可自該第一列印頭總成包體開口定位,以使得在列印期間,該等噴嘴以受控速率、速度及大小來噴射油墨至安裝在基板浮動台2200上之基板上。如先前所論述,第一X,Z軸托架總成2301可在列印製程期間受控制來將第一列印頭總成2501定位在基板上方以供列印。另外,如圖22B中所描繪,對於氣體包體總成1001之各種實施例,具有可控制X-Z軸移動的第一X,Z軸托架總成2301可將第一列印頭總成2501定位在第一列印頭總成開口1342上方。如圖22B中所描繪,第一底板面板總成1341'之第一列印頭總成開口1342為第一中間包體面板總成1340'及第一列印頭管理系統輔助面板總成1330'共用。 In FIG. 22B, the first print head assembly 2501 can include at least one column A printhead device 2505 of the printhead, the at least one printhead comprising a plurality of nozzles or orifices. The print head device 2505 can be received in the first print head assembly package 2503. The first print head assembly package can have a first print head assembly package opening 2507, and the print head device 2505 can The first row of print head assembly opening openings are positioned such that during printing, the nozzles eject ink at a controlled rate, speed and size onto the substrate mounted on the substrate floating table 2200. As previously discussed, the first X, Z-axis carriage assembly 2301 can be controlled to position the first printhead assembly 2501 over the substrate for printing during the printing process. Additionally, as depicted in FIG. 22B, for various embodiments of the gas enclosure assembly 1001, a first X, Z-axis carriage assembly 2301 having controllable XZ-axis movement can position the first printhead assembly 2501 Above the first row of printhead assembly openings 1342. As depicted in Figure 22B, the first printhead assembly opening 1342 of the first floor panel assembly 1341' is a first intermediate package panel assembly 1340' and a first printhead management system auxiliary panel assembly 1330' Share.

圖22B之第一列印頭總成包體2503可包括第一列印頭總成 包體輪緣2509,該輪緣可為圍繞第一列印頭總成開口1342與第一底板面板總成1341'的對接表面。第一列印頭總成包體輪緣2509可嚙合第一列印頭總成對接墊片1345,該對接墊片在圖22B中描繪成圍繞第一列印頭總成開口1342附著。儘管第一列印頭總成包體輪緣2509經展示描繪成一向內突出結 構,但是可在第一列印頭總成包體2503上構造各種輪緣中之任何者。另外,儘管第一列印頭總成對接墊片1345在圖22B中描繪成圍繞第一列印頭總成開口1342附著,但一般從業者將瞭解的是,墊片1345可附著至第一列印頭總成包體輪緣2509。第一列印頭總成對接墊片1345可為如先前對密封框架構件總成所述之墊片材料中的任何材料。在圖22B之氣體包體總成1001的各種實施例中,第一列印頭總成對接墊片1345可為充氣式墊片,諸如墊片1363。就該方面而言,第一列印頭總成對接墊片1345可為如先前對圖22A所述之充氣式墊片。如先前所提出,第一密封件1363可圍繞第一通道1361安裝在第一密封支撐面板1335之第一外表面1337上。 The first print head assembly body 2503 of Figure 22B can include a first print head assembly The body rim 2509 can be an abutment surface that surrounds the first row of head assembly openings 1342 and the first floor panel assembly 1341'. The first printhead assembly wrap rim 2509 can engage the first printhead assembly docking pad 1345, which is depicted in Fig. 22B as being attached around the first printhead assembly opening 1342. Although the first print head assembly body rim 2509 is depicted as an inwardly protruding knot Any of the various rims can be constructed on the first print head assembly body 2503. Additionally, although the first printhead assembly docking pad 1345 is depicted in FIG. 22B as being attached around the first printhead assembly opening 1342, it will be understood by those of ordinary skill that the spacer 1345 can be attached to the first column. The print head assembly body rim 2509. The first row of print head docking pads 1345 can be any of the gasket materials as previously described for the sealing frame member assembly. In various embodiments of the gas enclosure assembly 1001 of FIG. 22B, the first printhead assembly docking pad 1345 can be an inflatable gasket, such as a gasket 1363. In this regard, the first row of print head docking pads 1345 can be an inflatable gasket as previously described with respect to Figure 22A. As previously suggested, the first seal 1363 can be mounted about the first channel 1361 on the first outer surface 1337 of the first seal support panel 1335.

如圖22B及圖22C中所描繪,對於可以完全自動模式進行 的各種量測及維護程序而言,第一列印頭總成2501可保持定位在第一列印頭總成開口1342上方。就該方面而言,可藉由第一X,Z軸托架總成2301在Z軸方向上調節第一列印頭總成2501,以便相對於第一列印頭管理系統2701將列印頭裝置2505定位在第一列印頭總成開口1342上方。另外,可在第一列印頭管理系統定位系統2705上、在Y-X軸方向上調節第一列印頭管理系統2701,以便相對於列印頭裝置2505定位第一列印頭管理系統2701。在與列印頭總成之管理有關的各種程序中,可藉由第一X,Z軸托架總成2301在Z軸方向上進行進一步調節而將第一列印頭總成2501置放成與第一列印頭總成對接墊片1345接觸,從而將第一列印頭總成包體2503置放在一位置中來覆蓋第一列印頭總成開口1342(未圖示)。如圖22C中所描繪,對於與列印頭總成之管理有關的各種維護程序而言,例如但不限於需要直接進入第一列印頭管理系統輔助面板總成1330'內部之維護程序,可藉由第一X,Z軸 托架總成2301在Z軸方向上進行更進一步調節來使第一列印頭總成2501與第一列印頭總成對接墊片1345對接,從而密封第一列印頭總成開口1342。如先前所提及,第一列印頭總成對接墊片1345可為如先前對各種框架構件的密閉式密封所述之可壓縮墊片材料,或如先前對圖22A所述之充氣式墊片。另外,如圖22C中所描繪,充氣式墊片1363可經充氣,藉此以可密封方式封閉第一通道1361。此外,形成外殼的第一列印頭總成包體2503之部分可如先前對各種面板總成所述來構造,以使得框架總成構件及面板能夠提供密閉式包體。因此,對於圖22C而言,當第一列印頭總成開口1342及第一通道1361以可密封方式封閉時,可將第一列印頭管理系統輔助面板總成1330'與氣體包體總成1001之剩餘體積隔離。 As depicted in Figures 22B and 22C, for fully automatic mode The first print head assembly 2501 can remain positioned above the first print head assembly opening 1342 in terms of various measurement and maintenance procedures. In this regard, the first print head assembly 2501 can be adjusted in the Z-axis direction by the first X, Z-axis carriage assembly 2301 to print the print head relative to the first print head management system 2701. Device 2505 is positioned above first printhead assembly opening 1342. Additionally, the first print head management system 2701 can be adjusted in the Y-X axis direction on the first print head management system positioning system 2705 to position the first print head management system 2701 relative to the print head unit 2505. In various programs related to the management of the print head assembly, the first print head assembly 2501 can be placed by the first X, Z-axis carriage assembly 2301 in the Z-axis direction for further adjustment. The first print head assembly wrap 2503 is placed in contact with the first print head assembly pad 1345 to cover the first print head assembly opening 1342 (not shown). As depicted in Figure 22C, for various maintenance procedures related to the management of the printhead assembly, such as, but not limited to, maintenance procedures that require direct access to the first printhead management system auxiliary panel assembly 1330', By the first X, Z axis The carriage assembly 2301 is further adjusted in the Z-axis direction to interface the first print head assembly 2501 with the first print head assembly docking pad 1345 to seal the first print head assembly opening 1342. As previously mentioned, the first row of print head docking pads 1345 can be a compressible gasket material as previously described for the hermetic seal of various frame members, or an inflatable cushion as previously described with respect to Figure 22A. sheet. Additionally, as depicted in Figure 22C, the inflatable gasket 1363 can be inflated thereby sealing the first passage 1361 in a sealable manner. In addition, portions of the first printhead assembly body 2503 that form the outer casing can be constructed as previously described for the various panel assemblies such that the frame assembly members and panels can provide a closed enclosure. Therefore, for FIG. 22C, when the first print head assembly opening 1342 and the first passage 1361 are hermetically sealed, the first print head management system auxiliary panel assembly 1330' and the gas inclusion body can be The remaining volume of 1001 is isolated.

在圖22D及圖22E中,描繪氣體包體1001之各種實施例, 其中第一列印頭管理系統2701及第二列印頭管理系統2702可分別安裝在第一列印頭管理系統平台2703及第二列印頭管理系統平台2704上。在圖22D及圖22E中,第一列印頭管理系統平台2703及第二列印頭管理系統平台2704係分別包封於第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'中。如先前所提及,對第一列印頭管理系統輔助面板總成1330'之以下教示內容亦可適用於第二列印頭管理系統輔助面板總成1370'。就該方面而言,如圖22D中所描繪,可藉由第一X,Z軸托架總成2301以在Z軸方向上施加的足夠力來使第一列印頭總成2501與第一列印頭總成對接墊片1345對接,以使得第一列印頭總成開口1342可獲密封。因此,對於圖22D而言,當第一列印頭總成開口1342以可密封方式封閉時,可將第一列印頭管理系統輔助面板總成1330'與氣體包體總成1001之剩餘體積隔 離。 In Figures 22D and 22E, various embodiments of a gas enclosure 1001 are depicted, The first print head management system 2701 and the second print head management system 2702 can be respectively installed on the first print head management system platform 2703 and the second print head management system platform 2704. In FIG. 22D and FIG. 22E, the first print head management system platform 2703 and the second print head management system platform 2704 are respectively wrapped in the first print head management system auxiliary panel assembly 1330' and the second print. Head management system auxiliary panel assembly 1370'. As previously mentioned, the following teachings for the first print head management system auxiliary panel assembly 1330' may also be applied to the second print head management system auxiliary panel assembly 1370'. In this regard, as depicted in FIG. 22D, the first print head assembly 2501 and the first can be made by the first X, Z-axis bracket assembly 2301 with sufficient force applied in the Z-axis direction. The printhead assembly docking pad 1345 is docked such that the first printhead assembly opening 1342 can be sealed. Thus, for FIG. 22D, when the first printhead assembly opening 1342 is hermetically sealed, the first printhead management system auxiliary panel assembly 1330' can be residual with the gas inclusion assembly 1001. Separate from.

如先前對圖22A至圖22C的氣體包體總成1001之各種實施 例所教示,在與列印頭總成之管理有關的各種程序期間,列印頭可保持定位在第一列印頭總成開口1342上方,而不覆蓋或密封第一列印頭總成開口1342以便封閉第一列印頭總成開口1342。在氣體包體總成1001之各種實施例中,例如但不限於對於各種維護程序而言,可藉由調節Z軸將列印頭總成包體置放成與墊片接觸以便覆蓋列印頭總成開口。就該方面而言,可以兩種方式解釋圖22E。在第一解釋中,第一列印頭總成對接墊片1345及第二列印頭總成對接墊片1385可由諸如先前對各種框架構件之密閉式密封所述之可壓縮墊片材料製成。在圖22E中,第一列印頭總成2501已在Z軸方向上定位在第一列印頭管理系統2701上方,以使得墊片1345已壓縮,藉此以可密封方式封閉第一列印頭總成開口1342。相較而言,第二列印頭總成2502已在Z軸方向上定位在第二列印頭管理系統2702上方,以便與第二列印頭總成對接墊片1385接觸,藉此覆蓋第二列印頭總成開口1382。在第二解釋中,第一列印頭總成對接墊片1345及第二列印頭總成對接墊片1385可為如先前對圖22A所述之充氣式墊片。在圖22E中,第一列印頭總成2501可在Z軸方向上定位在第一列印頭管理系統2701上方,以便在第一列印頭總成對接墊片1345獲充氣之前與其接觸,藉此覆蓋第一列印頭總成開口1342。相較而言,第二列印頭總成2502已在Z軸方向上定位在第二維護系統總成2702上方,以便當第二列印頭總成對接墊片1385獲充氣時,第二列印頭總成開口1382以可密封方式封閉。 Various implementations of the gas inclusion assembly 1001 as previously described with respect to Figures 22A-22C As taught by the example, during various procedures associated with the management of the printhead assembly, the printhead can remain positioned over the first printhead assembly opening 1342 without covering or sealing the first printhead assembly opening. 1342 to close the first printhead assembly opening 1342. In various embodiments of the gas inclusion assembly 1001, such as, but not limited to, for various maintenance procedures, the printhead assembly can be placed in contact with the spacer to cover the printhead by adjusting the Z-axis. The assembly is open. In this regard, Figure 22E can be interpreted in two ways. In a first explanation, the first row of printhead docking pads 1345 and the second row of head assembly docking pads 1385 can be made of a compressible gasket material such as the hermetic seal previously described for various frame members. . In Figure 22E, the first print head assembly 2501 has been positioned over the first print head management system 2701 in the Z-axis direction such that the spacer 1345 has been compressed thereby sealing the first print in a sealable manner. The head assembly opening 1342. In comparison, the second print head assembly 2502 has been positioned over the second print head management system 2702 in the Z-axis direction to contact the second print head assembly docking pad 1385, thereby overwriting the The two-row head assembly opening 1382. In a second explanation, the first printhead assembly docking pad 1345 and the second row of printhead docking pads 1385 can be inflatable gaskets as previously described with respect to Figure 22A. In FIG. 22E, the first print head assembly 2501 can be positioned over the first print head management system 2701 in the Z-axis direction to contact the first print head assembly docking pad 1345 prior to being inflated. Thereby the first print head assembly opening 1342 is covered. In comparison, the second print head assembly 2502 has been positioned over the second maintenance system assembly 2702 in the Z-axis direction so that when the second print head assembly docking pad 1385 is inflated, the second column The printhead assembly opening 1382 is sealed in a sealable manner.

圖22F描繪的是,例如所例示的使用第一列印頭管理系統輔 助面板總成1330'及第二列印頭管理系統輔助面板總成1370'界定之體積可使用例如但不限於閘-閥總成之覆蓋物密封。對第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'之以下教示內容可適用於列印頭管理系統面板總成及氣體包體總成之各種實施例。如圖22F中所描繪,分別使用例如但不限於第一列印頭總成閘閥1347及第二列印頭總成閘閥1387封閉第一列印頭總成開口1342及第二列印頭總成開口1382,可分別提供第一列印頭總成2501及第二列印頭總成2502之持續操作。如對圖22F之第一列印頭管理系統輔助面板總成1330'所描繪,使用第一列印頭總成閘閥1347以可密封方式封閉第一列印頭總成開口1342以及以可密封方式圍繞底座2100封閉第一通道1361可遠程地且自動地進行。類似地,如對圖22F之第二列印頭管理系統輔助面板總成1370'所描繪,使用第二列印頭總成閘閥1387以可密封方式封閉第二列印頭總成開口1382可遠程地且自動地進行。應涵蓋的是,可藉由隔離由輔助框架構件總成區段界定之體積、例如藉由第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'界定之體積來促進各種列印頭量測及維護程序,同時仍提供利用第一列印頭總成2501及第二列印頭總成2502之列印製程的持續性。 Figure 22F depicts, for example, the use of the first print head management system as exemplified The volume defined by the booster panel assembly 1330' and the second row of printhead management system auxiliary panel assemblies 1370' can be sealed using a cover such as, but not limited to, a gate-valve assembly. The following teachings for the first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly 1370' can be applied to the print head management system panel assembly and the gas package assembly. Various embodiments. As depicted in FIG. 22F, the first print head assembly opening 1342 and the second print head assembly are closed using, for example, but not limited to, a first print head assembly gate valve 1347 and a second print head assembly gate valve 1387, respectively. The opening 1382 can provide continuous operation of the first print head assembly 2501 and the second print head assembly 2502, respectively. As depicted in the first print head management system auxiliary panel assembly 1330' of FIG. 22F, the first print head assembly gate valve 1347 is used to seal the first print head assembly opening 1342 in a sealable manner and in a sealable manner Closing the first passage 1361 around the base 2100 can be performed remotely and automatically. Similarly, as depicted in the second print head management system auxiliary panel assembly 1370' of FIG. 22F, the second print head assembly gate 1387 can be used to seal the second print head assembly opening 1382 in a sealable manner. It is done automatically and automatically. It should be noted that the volume defined by the auxiliary frame member assembly section can be isolated, for example by the first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly 1370 'Defined volume to facilitate various print head measurement and maintenance procedures while still providing continuity with the printing process of the first print head assembly 2501 and the second print head assembly 2502.

如先前所提及,第一列印頭總成對接墊片1345及第二列印 頭總成對接墊片1385可分別圍繞第一列印頭總成開口1342及第二列印頭總成開口1382附著。另外,如圖22F中所描繪,第一列印頭總成對接墊片1345及第二列印頭總成對接墊片1385可分別圍繞第一列印頭總成包體輪緣2509及第二列印頭總成包體輪緣2510附著。當指示第一列印頭總成2501及第二列印頭總成2502之維護時,第一列印頭總成閘閥1347及第二列印頭總成閘 閥1387可打開,且第一列印頭總成2501及第二列印頭總成2502可與第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'對接,如先前所述。 As mentioned previously, the first print head assembly docking pad 1345 and the second print The head assembly docking pads 1385 can be attached around the first printhead assembly opening 1342 and the second printhead assembly opening 1382, respectively. In addition, as depicted in FIG. 22F, the first print head assembly butt pad 1345 and the second print head assembly docking pad 1385 can surround the first print head assembly wrap rim 2509 and the second, respectively. The print head assembly body rim 2510 is attached. When the maintenance of the first print head assembly 2501 and the second print head assembly 2502 is indicated, the first print head assembly gate valve 1347 and the second print head assembly gate The valve 1387 can be opened, and the first print head assembly 2501 and the second print head assembly 2502 can be combined with the first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly. 1370' docking as previously described.

例如但在不限制的情況下,可藉由分別隔離第一列印頭管理 系統輔助面板總成1330'及第二列印頭管理系統面板總成1370'來在第一列印頭管理系統2701及第二列印頭管理系統2702上執行與列印頭總成之管理有關的任何程序,而不中斷列印製程。應進一步涵蓋的是,新列印頭或列印頭總成至系統中之加載,或列印頭或列印頭總成自系統之移除可藉由分別將第一列印頭管理系統輔助面板總成1330'及第二中間列印頭管理系統面板總成1370'隔離來進行,而不中斷列印製程。可例如但不限於使用機器人來自動地促進此等活動。例如但在不限制的情況下,可對儲存在藉由諸如圖22F之第一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'的輔助框架構件總成區段界定之體積中的列印頭進行機器人取回,接著將第一列印頭總成2501之列印頭裝置2505或第二列印頭總成2502之列印頭裝置2506上的故障列印頭用機器人改換成有效列印頭。此隨後可接著將故障列印頭自動貯存於第一列印頭管理系統2701或第二列印頭管理系統2702中之模組中。此等維護程序可在不中斷持續不斷進行的列印製程的情況下以自動模式實施。 For example, but without limitation, it can be managed by isolating the first print head separately The system auxiliary panel assembly 1330' and the second column head management system panel assembly 1370' are implemented on the first column head management system 2701 and the second column head management system 2702 in connection with the management of the print head assembly. Any program without interrupting the printing process. It should be further covered that the loading of the new printhead or printhead assembly into the system, or the removal of the printhead or printhead assembly from the system, can be aided by the first printhead management system, respectively. The panel assembly 1330' and the second intermediate printhead management system panel assembly 1370' are isolated without interrupting the printing process. Such activities may be facilitated automatically, for example, but not limited to, using a robot. For example, but without limitation, an auxiliary frame member stored in an auxiliary panel assembly 1330' and a second head management system auxiliary panel assembly 1370', such as the first print head management system of FIG. 22F, may be used. The print head in the volume defined by the assembly section is robotically retrieved, and then the first print head assembly 2501 print head device 2505 or the second print head assembly 2502 print head device 2506 The faulty print head is changed to a valid print head by the robot. This can then be automatically stored in the module in the first print head management system 2701 or the second print head management system 2702. These maintenance procedures can be implemented in an automatic mode without interrupting the ongoing printing process.

故障列印頭機器人於第一列印頭管理系統2701或第二列印 頭管理系統2702中之貯存之後,藉由分別使用例如但不限於第一列印頭總成閘閥1347及第二列印頭總成閘閥1387來封閉第一列印頭總成開口1342及第二列印頭總成開口1382,可以可密封方式封閉及隔離藉由分別諸如第 一列印頭管理系統輔助面板總成1330'及第二列印頭管理系統輔助面板總成1370'的輔助框架構件總成區段所界定之體積。此外,可隨後例如根據先前教示內容將藉由輔助框架構件總成區段所界定之體積向大氣開放,以使得故障列印頭可獲取回及更換。如隨後將更詳細地論述,由於氣體純化系統之各種實施例係相對於整體氣體包體總成之體積來設計,因此氣體純化資源可專門用於沖洗藉由輔助框架構件總成區段空間所界定之體積中的顯著減小的體積,藉此顯著地減少藉由輔助框架構件總成區段所界定之體積的系統恢復時間。就該方面而言,需要將輔助框架構件總成區段向大氣開放的與管理列印頭總成有關的各種程序可在不中斷或最少中斷持續不斷進行之列印製程的情況下實施。 The faulty print head robot is in the first print head management system 2701 or the second print After storage in the head management system 2702, the first printhead assembly opening 1342 and the second are closed by using, for example, but not limited to, a first printhead assembly gate valve 1347 and a second printhead assembly gate valve 1387, respectively. The print head assembly opening 1382 can be sealed and isolated in a sealable manner by A print head management system auxiliary panel assembly 1330' and a second print head management system auxiliary panel assembly 1370' of the auxiliary frame member assembly section defined by the volume. In addition, the volume defined by the auxiliary frame member assembly section can then be opened to the atmosphere, for example, according to prior teachings, such that the faulty print head can be retrieved and replaced. As will be discussed in more detail later, since various embodiments of the gas purification system are designed relative to the volume of the overall gas inclusion body assembly, the gas purification resources can be dedicated to rinsing by the auxiliary frame member assembly section space. A significantly reduced volume in the defined volume, thereby significantly reducing the system recovery time by the volume defined by the auxiliary frame member assembly section. In this regard, various procedures associated with managing the printhead assembly that require the auxiliary frame member assembly section to be open to the atmosphere can be implemented without interruption or minimal interruption of the ongoing printing process.

圖23描繪容納於根據本教示內容之氣體包體總成及系統的 各種實施例的第一列印頭管理系統輔助面板總成1330'內的第一列印頭管理系統2701之展開圖。如先前所論述,列印頭管理系統可包括例如但不限於小滴量測模組、沖洗站、吸墨站及列印頭交換站。在列印頭管理系統之各種實施例中,小滴量測模組可對列印頭執行量測,諸如檢查噴嘴發射、量測小滴體積、速度及軌跡,以及調諧列印頭以使得每一噴嘴噴射已知體積之小滴。對於列印頭管理系統之各種實施例而言,沖洗站可用於引動及沖洗列印頭,此需要收集及圍堵自列印頭射出之油墨,同時吸墨站可用於在引動程序或沖洗程序之後移除過量油墨。另外,列印頭管理系統可包括一或多個列印頭交換站,其用於:接收已自列印頭總成移除的一或多個列印頭或列印頭裝置,該列印頭總成諸如圖20B之第一列印頭總成2501及第二列印頭總成2502;且用於儲存列印頭或列印頭裝置,該等列印頭或列印頭 裝置可於與管理列印頭總成有關的各種程序期間加載至第一列印頭總成2501及第二列印頭總成2502中。 Figure 23 depicts a gas inclusion assembly and system housed in accordance with the teachings of the present invention. An expanded view of the first print head management system 2701 within the first print head management system auxiliary panel assembly 1330' of various embodiments. As previously discussed, the printhead management system can include, for example, but is not limited to, a droplet measurement module, a rinsing station, an ink absorbing station, and a printhead exchange station. In various embodiments of the printhead management system, the droplet measurement module can perform measurements on the printhead, such as checking nozzle firing, measuring droplet volume, velocity, and trajectory, and tuning the printhead to make each A nozzle ejects droplets of known volume. For various embodiments of the printhead management system, the rinsing station can be used to priming and flushing the printhead, which requires collecting and enclosing the ink ejected from the printhead, while the ink absorbing station can be used in the priming procedure or rinsing procedure. Excess ink is then removed. Additionally, the printhead management system can include one or more printhead exchange stations for receiving one or more printheads or printhead devices that have been removed from the printhead assembly, the print The head assembly, such as the first print head assembly 2501 and the second print head assembly 2502 of Figure 20B; and for storing print heads or print head devices, such print heads or print heads The device can be loaded into the first printhead assembly 2501 and the second printhead assembly 2502 during various programs associated with managing the printhead assembly.

根據本教示內容之列印頭管理系統(諸如圖23之第一列印 頭管理系統2701、設備2707、2709及2011)的各種實施例可為用於執行各種功能的各種模組。例如,設備2707、2709及2011可為小滴量測模組、列印頭更換模組、沖洗池模組及吸墨紙模組中之一或多者。第一列印頭管理系統2701可安裝在第一列印頭管理系統定位系統2705上。第一列印頭管理系統定位系統2705可提供Y軸移動來選擇性地將帶有列印頭總成之各種模組的每一者與第一列印頭總成開口1342對準,該列印頭總成具有帶至少一個列印頭之列印頭裝置,諸如圖22B之列印頭裝置2505。帶有列印頭總成(該列印頭總成具有帶至少一個列印頭之列印頭裝置)之各種模組的定位可使用第一列印頭管理系統定位系統2705以及諸如圖20B之第一X,Z軸托架總成2301的列印頭總成定位系統之組合來進行。對於本教示內容之氣體總成系統的各種實施例而言,列印頭管理系統定位系統2705可提供第一列印頭管理系統2701之各種模組相對於第一列印頭總成開口1342的Y-X定位,而第一X-Z軸托架總成2301可提供第一列印頭總成2501於第一列印頭總成開口1342上方的X-Z定位。就該方面而言,帶有至少一個列印頭之列印頭裝置可定位在第一列印頭總成開口1342上方或其內來接受維護。 A print head management system according to the teachings (such as the first print of Figure 23) The various embodiments of the head management system 2701, devices 2707, 2709, and 2011) may be various modules for performing various functions. For example, the devices 2707, 2709, and 2011 can be one or more of a droplet measurement module, a printhead replacement module, a rinse tank module, and a blotter paper module. The first print head management system 2701 can be mounted on the first print head management system positioning system 2705. The first print head management system positioning system 2705 can provide Y-axis movement to selectively align each of the various modules with the print head assembly with the first print head assembly opening 1342, the column The printhead assembly has a printhead device with at least one printhead, such as the printhead assembly 2505 of Figure 22B. The positioning of the various modules with the printhead assembly (the printhead assembly having at least one printhead) can use the first printhead management system positioning system 2705 and such as Figure 20B. A combination of the first X, Z-axis carriage assembly 2301's printhead assembly positioning system is utilized. For various embodiments of the gas assembly system of the present teachings, the printhead management system positioning system 2705 can provide various modules of the first printhead management system 2701 relative to the first printhead assembly opening 1342. The YX is positioned while the first XZ-axis carriage assembly 2301 can provide XZ positioning of the first print head assembly 2501 above the first print head assembly opening 1342. In this regard, a printhead device with at least one printhead can be positioned over or within the first printhead assembly opening 1342 for maintenance.

圖24A描繪容納於根據本教示內容之氣體包體總成及系統 的各種實施例的第一列印頭管理系統輔助面板總成1330'內的第一列印頭管理系統2701A之展開圖。如圖24A中所描繪,輔助面板總成1330'展示為缺少前部可移除服務窗,以便更清楚地觀察第一列印頭管理系統2701A之細 節。根據本教示內容之列印頭管理系統(諸如圖24A之第一列印頭管理系統2701A、設備2707、2709及2011)的各種實施例可為用於執行各種功能的各種子系統或模組。例如,設備2707、2709及2011可為小滴量測模組、列印頭沖洗池模組及吸墨紙模組。如圖24A中所描繪,列印頭更換模組2713可提供用於對接至少一個列印頭裝置2505的位置。在第一列印頭管理系統2701A之各種實施例中,第一列印頭管理系統輔助面板總成1330'可維持於與維持氣體包體總成1000(參見圖19)相同的環境規範。第一列印頭管理系統輔助面板總成1330'可具有處置器2530,該處置器經定位用於實施與各種列印頭管理程序相關聯的任務。例如,每一子系統皆可具有各種部件,該等部件本質上為可消耗的,且需要更換,諸如更換吸墨紙、油墨及廢料儲器。各種可消耗部件可經封裝以準備例如以完全自動模式使用處置器進行插入。作為非限制性實例,吸墨紙可封裝於匣筒格式中,該匣筒格式可易於插入吸墨模組中供使用。舉另一非限制性實例而言,油墨可封裝於可更換儲器及匣筒格式中以用於列印系統中。廢料儲器之各種實施例可封裝於匣筒格式中,該匣筒格式可易於插入沖洗池模組中供使用。另外,經受持續不斷使用之列印系統之各種組件的部件可需要週期性更換。在列印製程期間,可需要列印頭總成之權宜管理,例如但不限於列印頭裝置或列印頭之交換。列印頭更換模組可具有諸多部件,諸如列印頭裝置或列印頭,該等部件可易於插入列印頭總成中供使用。用於檢查噴嘴發射以及基於來自每一噴嘴之小滴體積、速度及軌跡之光學偵測進行量測的小滴量測模組可具有在使用之後可需要週期性更換的來源及偵測器。各種可消耗及高使用率部件可經封裝以用於準備例如以完全自動模式使用處置器進行插入。 處置器2530可具有安裝至臂2534之端接器2536。可使用端接器構型之各種實施例,例如葉片型端接器、夾片型端接器及夾鉗型端接器。端接器之各種實施例可包括機械抓握及夾緊總成,以及氣動或真空輔助總成來致動端接器之各部分或以其他方式保持列印頭裝置或來自列印頭裝置之列印頭。 24A depicts a gas inclusion assembly and system housed in accordance with the teachings of the present invention. An expanded view of the first print head management system 2701A within the first print head management system auxiliary panel assembly 1330' of various embodiments. As depicted in Figure 24A, the auxiliary panel assembly 1330' is shown lacking a front removable service window to more clearly observe the details of the first print head management system 2701A. Section. Various embodiments of a printhead management system (such as the first printhead management system 2701A, devices 2707, 2709, and 2011 of Figure 24A) in accordance with the teachings herein can be various subsystems or modules for performing various functions. For example, the devices 2707, 2709, and 2011 can be a droplet measurement module, a printhead rinse tank module, and a blotter paper module. As depicted in Figure 24A, the printhead replacement module 2713 can provide a location for docking at least one of the printhead devices 2505. In various embodiments of the first printhead management system 2701A, the first printhead management system auxiliary panel assembly 1330' can be maintained at the same environmental specifications as the maintenance gas enclosure assembly 1000 (see Figure 19). The first print head management system auxiliary panel assembly 1330' can have a handler 2530 that is positioned to perform tasks associated with various print head management programs. For example, each subsystem can have various components that are inherently consumable and need to be replaced, such as replacing blotter paper, ink, and waste reservoirs. The various consumable parts can be packaged to prepare for insertion using the handler, for example, in a fully automated mode. As a non-limiting example, the blotter paper can be packaged in a cartridge format that can be easily inserted into an ink absorbing module for use. By way of another non-limiting example, the ink can be packaged in a replaceable reservoir and cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into a rinse tank module for use. In addition, components that are subject to the various components of the continuously used printing system may require periodic replacement. During the printing process, expediency management of the printhead assembly may be required, such as, but not limited to, the exchange of printhead devices or printheads. The printhead replacement module can have many components, such as a printhead device or a printhead, which can be easily inserted into the printhead assembly for use. The droplet measurement module for inspecting nozzle emissions and measuring optical detection based on droplet volume, velocity and trajectory from each nozzle may have sources and detectors that may need to be periodically replaced after use. Various consumable and high usage components can be packaged for preparation for insertion using the handler, for example, in a fully automated mode. The handler 2530 can have a terminator 2536 mounted to the arm 2534. Various embodiments of the terminator configuration can be used, such as blade type terminators, clip type terminators, and clamp type terminators. Various embodiments of the terminator can include a mechanical grip and clamping assembly, and a pneumatic or vacuum assist assembly to actuate portions of the terminator or otherwise hold the printhead device or from the printhead device Print the head.

關於列印頭裝置或列印頭之更換,圖24A之列印頭管理系 統2701A的列印頭更換模組2713可包括用於具有至少一個列印頭的列印頭裝置之對接站以及用於列印頭之儲存容器。由於每一列印頭總成(參見圖20B)可包括介於約1個至約60個之間的列印頭裝置,且由於每一列印頭裝置可具有介於約1個至約30個之間的列印頭,因此本教示內容之列印系統的各種實施例可具有介於約1個至約1800個之間的列印頭。在列印頭更換模組2013之各種實施例中,在列印頭裝置獲對接時,安裝至列印頭裝置之每一列印頭可維持於可操作條件下同時在列印系統中處於未使用狀態。 例如,當置放於對接站中時,每一列印頭裝置上之每一列印頭可連接至油墨供應及電氣連接件。來源可提供至每一列印頭裝置上之每一列印頭,以使得可在對接時施加週期性發射脈衝至每一列印頭之每一噴嘴,以便確保該等噴嘴保持引動且不堵塞。圖24A之處置器2530可鄰近列印頭總成2500定位。如圖24A中所描繪,列印頭總成2500可對接於第一列印頭管理系統輔助面板總成1330'上方。在用於交換列印頭之程序期間,處置器2530可自列印頭總成2500移除目標部件,即為列印頭或具有至少一個列印頭之列印頭裝置。處置器2530可自列印頭更換模組2013取回諸如列印頭裝置或列印頭的更換部件,並完成更換製程。經移除部件可置放在列印頭更換模組2713中以供取回。 Regarding the replacement of the print head device or the print head, the print head management system of Figure 24A The printhead replacement module 2713 of the 2701A can include a docking station for a printhead device having at least one printhead and a storage container for the printhead. Since each print head assembly (see FIG. 20B) can include between about 1 and about 60 print head devices, and since each print head device can have between about 1 and about 30 The various print heads, and thus the various embodiments of the printing system of the present teachings, can have between about 1 and about 1800 print heads. In various embodiments of the printhead replacement module 2013, each of the printheads mounted to the printhead device can be maintained in an operable condition while not being used in the printing system while the printhead device is docked. status. For example, each of the print heads on each of the print head devices can be coupled to the ink supply and electrical connections when placed in the docking station. A source can be provided to each of the printheads on each of the printhead devices such that a periodic firing pulse can be applied to each of the nozzles of each of the printheads during docking to ensure that the nozzles remain energized and are not clogged. The handler 2530 of Figure 24A can be positioned adjacent to the printhead assembly 2500. As depicted in Figure 24A, the printhead assembly 2500 can be docked over the first printhead management system auxiliary panel assembly 1330'. During the process for swapping the printheads, the handler 2530 can remove the target component from the printhead assembly 2500, either a printhead or a printhead device having at least one printhead. The handler 2530 can retrieve replacement components such as a printhead device or a printhead from the printhead replacement module 2013 and complete the replacement process. The removed component can be placed in the printhead replacement module 2713 for retrieval.

如圖24B中所描繪,輔助面板總成1330'可具有安裝在前面 板上的第一可移除服務窗130A及第二可移除服務窗130B,以用於自諸如圖20A之氣體包體1000的氣體包體外部之就緒進入。另外,諸如負載鎖1350之負載鎖可安裝在輔助面板總成1330'之壁面板上。根據本教示內容之各種實施例,如對圖24A所述的闡述為藉由處置器執行之列印頭管理程序可藉由終端使用者經由各種手套套圈遠程地執行,如圖24A及圖24B中的手套及手套套圈之各種位置所示。 As depicted in Figure 24B, the auxiliary panel assembly 1330' can have a front mounted The first removable service window 130A and the second removable service window 130B on the board are for ready access from outside the gas enclosure such as the gas enclosure 1000 of FIG. 20A. Additionally, a load lock such as load lock 1350 can be mounted to the wall panel of the auxiliary panel assembly 1330'. In accordance with various embodiments of the present teachings, the printhead management process illustrated by FIG. 24A as illustrated by FIG. 24A can be performed remotely by the end user via various glove ferrules, as shown in FIGS. 24A and 24B. The various positions of the gloves and glove ferrules are shown.

此外,對於本教示內容之系統及方法的各種實施例而言,負 載鎖1350可用於轉移用於本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。圖24A之列印頭管理系統2701A的各種更換部件為例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭及列印頭裝置,且可使用圖24A之處置器2530,使用負載鎖1350轉移至輔助面板總成1330'中,以及可移動至圖24A之列印頭管理系統2701A。相反地,例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭及列印頭裝置之需要更換的部件可藉由圖24A之處置器2530自列印頭管理系統2701A移除,並置放在負載鎖1350中。根據本教示內容,負載鎖1350可具有向諸如圖20A之氣體包體1000的氣體包體外部開放的閘,而允許進入輔助面板總成1330'之閘為閉合的,從而在用於轉移部件之程序期間僅將負載鎖1350暴露於周圍氣體。在用於取回部件之程序、用於更換部件之程序或兩者已完成之後,允許進入氣體包體外部的用於負載鎖1350之閘可閉合,且負載鎖1350可經歷恢復程序來將負載鎖之氣體環境復原至目標規範。在下一步驟中,負載鎖1350與輔助面板總成1330'之間的閘可打開,以便自輔助面板總成1330'取 回或移除部件以及將更換部件轉移至輔助面板總成1330'皆可藉由諸如圖24A之處置器2530的處置器來進行。 Moreover, for various embodiments of the systems and methods of the present teachings, negative The load lock 1350 can be used to transfer various components of the subsystems and modules of the various embodiments of the print head management system used in the present teachings. The various replacement components of the printhead management system 2701A of Figure 24A are, for example, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device, and the handler 2530 of Figure 24A can be used. Transfer to the auxiliary panel assembly 1330' using the load lock 1350, and move to the printhead management system 2701A of Figure 24A. Conversely, components that need to be replaced, such as, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device, may be self-printing head management system 2701A by the handler 2530 of Figure 24A. Removed and placed in load lock 1350. In accordance with the present teachings, the load lock 1350 can have a gate that is open to the exterior of the gas enclosure, such as the gas enclosure 1000 of Figure 20A, while allowing access to the auxiliary panel assembly 1330' to be closed, thereby being used for transferring components. Only load lock 1350 is exposed to ambient gas during the procedure. After the procedure for retrieving the component, the procedure for replacing the component, or both have been completed, the gate for the load lock 1350 that is allowed to enter the outside of the gas enclosure can be closed, and the load lock 1350 can undergo a recovery procedure to load The gas environment of the lock is restored to the target specification. In the next step, the gate between the load lock 1350 and the auxiliary panel assembly 1330' can be opened for retrieval from the auxiliary panel assembly 1330'. Returning or removing the components and transferring the replacement components to the auxiliary panel assembly 1330' can all be performed by a handler such as the handler 2530 of Figure 24A.

鑒於負載鎖1350相較於輔助面板總成1330'之體積而言大體 上小的體積,恢復時間比用於輔助面板總成1330'之恢復時間大體上短,從而允許負載鎖1350與輔助面板總成1330'之間的部件在不中斷列印製程情況下之就緒轉移。另外,若指示需要直接進入輔助面板總成1330'之任何維護,則可移除服務窗130A及130B可允許自諸如圖20A之氣體包體1000的氣體包體外部對輔助面板總成1330'之此種直接進入。鑒於輔助面板總成1330'相較於諸如圖20A之氣體包體1000的氣體包體的工作體積之體積而言大體上小的體積,用於輔助面板總成1330'之恢復時間比用於氣體包體之整體工作體積的恢復時間大體上短。因此,可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。就該方面而言,輔助面板總成1330'之各種實施例可提供用於列印頭管理系統中之部件的完全自動化更換,同時維持惰性、無粒子環境且幾乎不或不中斷列印製程。 In view of the fact that the load lock 1350 is substantially larger than the volume of the auxiliary panel assembly 1330' With a small volume, the recovery time is substantially shorter than the recovery time for the auxiliary panel assembly 1330', allowing the components between the load lock 1350 and the auxiliary panel assembly 1330' to be ready for transfer without interrupting the printing process. . Additionally, if any maintenance that requires direct access to the auxiliary panel assembly 1330' is indicated, the removable service windows 130A and 130B may allow for external auxiliary panel assembly 1330' from a gas enclosure such as the gas enclosure 1000 of Figure 20A. This kind of direct entry. In view of the substantially small volume of the auxiliary panel assembly 1330' compared to the volume of the working volume of the gas enclosure such as the gas enclosure 1000 of Figure 20A, the recovery time for the auxiliary panel assembly 1330' is greater than that for the gas The recovery time of the overall working volume of the inclusion body is substantially short. Thus, all steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process. In this regard, various embodiments of the auxiliary panel assembly 1330' can provide for a fully automated replacement of components in the printhead management system while maintaining an inert, particle-free environment with little or no interruption in the printing process.

圖25例示第一列印頭管理系統輔助面板總成1330'之展開透 視圖。如所指示,應涵蓋的是,諸如第一列印頭管理系統輔助面板總成1330'之各種列印頭管理系統面板總成的體積可為約2m3。應涵蓋的是,輔助框架構件總成區段之各種實施例可具有約1m3之體積,而對於輔助框架構件總成區段之各種實施例而言,該體積可為約10m3。對於諸如圖3之氣體包體 總成100及圖19之氣體包體總成1000的氣體包體總成之各種實施例而言,輔助框架構件總成區段可為氣體包體系統之包體體積的分數值。例如,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積的約1%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積的約2%。對於氣體包體總成之各種實施例而言,輔助框架構件總成區段可小於或等於氣體包體系統之總體積的約5%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積的約10%。在氣體包體總成之各種實施例中,輔助框架構件總成區段可小於或等於氣體包體系統之包體體積的約20%。因此,鑒於輔助包體之相對小的體積,輔助包體之恢復可耗費顯著小於整體列印系統包體之恢復的時間。 Figure 25 illustrates an expanded perspective view of the first print head management system auxiliary panel assembly 1330'. As indicated, it should be contemplated that the volume of the various printhead management system panel assemblies, such as the first printhead management system auxiliary panel assembly 1330', may be about 2 m3 . It should be contemplated that various embodiments of the auxiliary frame member assembly section can have a volume of about 1 m 3 , while for various embodiments of the auxiliary frame member assembly section, the volume can be about 10 m 3 . For various embodiments of a gas inclusion assembly such as gas inclusion assembly 100 of FIG. 3 and gas inclusion assembly 1000 of FIG. 19, the auxiliary frame member assembly section can be an inclusion body of a gas inclusion system The fractional value of the volume. For example, the auxiliary frame member assembly section can be less than or equal to about 1% of the volume of the inclusion body of the gas enclosure system. In various embodiments of the gas inclusion body assembly, the auxiliary frame member assembly section can be less than or equal to about 2% of the volume of the inclusion body of the gas enclosure system. For various embodiments of the gas inclusion assembly, the auxiliary frame member assembly section can be less than or equal to about 5% of the total volume of the gas enclosure system. In various embodiments of the gas inclusion assembly, the auxiliary frame member assembly section can be less than or equal to about 10% of the volume of the inclusion body of the gas enclosure system. In various embodiments of the gas inclusion body assembly, the auxiliary frame member assembly section can be less than or equal to about 20% of the volume of the inclusion body of the gas inclusion system. Thus, in view of the relatively small volume of the auxiliary package, the recovery of the auxiliary package can be significantly less than the recovery time of the overall printing system package.

與列印頭管理相關聯之各種程序可以全自動化模式進行。如 隨後將更詳細地論述,在一些情形中,在可於與列印頭總成之管理有關的各種程序期間指示一定程度之終端使用者介入的情況下,終端使用者進入可經由例如使用手套套圈在外部進行。如先前所論述,如圖19至圖25中所描繪,具有作為氣體包體總成之一區段的輔助包體之氣體包體總成的各種實施例有效地減小OLED列印製程期間所需要的惰性氣體之體積,而同時提供對氣體包體內部之就緒進入。 The various programs associated with printhead management can be performed in a fully automated mode. Such as As will be discussed in more detail later, in some cases, where a degree of end user intervention can be indicated during various procedures associated with the management of the printhead assembly, the end user can enter via, for example, a glove cover. The circle is performed externally. As previously discussed, various embodiments of a gas inclusion assembly having an auxiliary inclusion as a section of a gas inclusion assembly are effective in reducing OLED printing processes as depicted in Figures 19-25. The volume of inert gas required, while at the same time providing ready access to the interior of the gas enclosure.

除具有構造為氣體包體總成之一區段的輔助包體之氣體包 體系統的各種實施例之外,輔助包體之各種實施例可與氣體包體系統相關聯而無需構造為氣體包體總成之輔助框架構件總成區段。 a gas package having an auxiliary package configured as a section of a gas inclusion assembly In addition to the various embodiments of the body system, various embodiments of the auxiliary package can be associated with the gas enclosure system without the need for an auxiliary frame member assembly section configured as a gas enclosure assembly.

例如,對於本教示內容之氣體包體系統的各種實施例而言, 輔助包體可為可調式受控環境包體。根據本教示內容,可調式受控環境包體就設計及構造之靈活性而言為可調式的,該靈活性可包括例如開口之數目及類型、環境控制系統、用於構造之材料的大小、選擇廣度,以及安裝便利性。例如,在各種實施例中,可調式受控環境包體可為軟壁構造,其中架構可為例如鋼、粉末塗布鋼或鋁,且面板可由約1mm至2mm厚的例如乙烯、聚氯乙烯及聚氨酯的可撓性聚合物片狀材料製造。對於軟壁構造之各種實施例而言,可撓性聚合物片狀材料可作為一系列帶材、完整片材以及帶材及片材之組合來安裝。在輔助包體之其他實施例中,可調式受控環境包體可為硬壁構造,其中面板材料為諸如剛性塑膠的剛性材料,例如丙烯酸或聚碳酸酯材料或強化玻璃材料。對於硬壁構造之各種實施例而言,諸如壁面板、窗面板及門面板的硬壁構造之各種面板可選自不同材料。 在本教示內容之各種實施例中,可調式受控環境包體可為硬壁構造及軟壁構造之組合。可針對包括例如但不限於以下者之屬性來選擇用於本教示內容之可調式受控環境包體之各種實施例的面板材料:低粒子產生、高光學透明度、有效靜電散逸及機械耐久性。 For example, for various embodiments of the gas enclosure system of the present teachings, The auxiliary enclosure can be an adjustable controlled environment enclosure. According to the present teachings, the adjustable controlled environment enclosure is adjustable in terms of design and construction flexibility, which may include, for example, the number and type of openings, the environmental control system, the size of the material used to construct, Choose breadth and ease of installation. For example, in various embodiments, the adjustable controlled environment enclosure can be a soft wall construction, where the architecture can be, for example, steel, powder coated steel, or aluminum, and the panels can be from about 1 mm to 2 mm thick, such as ethylene, polyvinyl chloride, and Polyurethane flexible polymer sheet material. For various embodiments of the soft wall construction, the flexible polymeric sheet material can be installed as a series of strips, a complete sheet, and a combination of strip and sheet. In other embodiments of the auxiliary package, the adjustable controlled environment enclosure can be a hard wall construction wherein the panel material is a rigid material such as a rigid plastic such as an acrylic or polycarbonate material or a tempered glass material. For various embodiments of hard wall construction, various panels of hard wall construction such as wall panels, window panels, and door panels can be selected from different materials. In various embodiments of the present teachings, the adjustable controlled environment enclosure can be a combination of a hard wall construction and a soft wall construction. Panel materials for various embodiments of the tunable controlled environmental enclosure for the present teachings can be selected for properties including, for example, but not limited to, low particle generation, high optical transparency, effective electrostatic dissipation, and mechanical durability.

除可調式受控環境包體之外,輔助包體之各種實施例可為轉 移腔室。在其他實施例中,輔助腔室可為負載鎖定腔室。根據本教示內容,輔助包體之各種實施例可具有與氣體包體系統之工作體積分開的獨立環境控制系統,而輔助包體之其他實施例可使用與氣體包體系統之工作體積相同的環境控制系統來維持。輔助包體之各種實施例可為靜置不動的,而輔助包體之其他實施例可為可移動的,諸如可位於輪子上或軌道總成上,以使得其可容易鄰近氣體包體系統定位以供使用。 In addition to the adjustable controlled environment enclosure, various embodiments of the auxiliary enclosure may be Move the chamber. In other embodiments, the auxiliary chamber can be a load lock chamber. In accordance with the present teachings, various embodiments of the auxiliary package may have an independent environmental control system separate from the working volume of the gas enclosure system, while other embodiments of the auxiliary package may use the same working volume as the gas enclosure system. Control system to maintain. Various embodiments of the auxiliary package may be stationary, while other embodiments of the auxiliary package may be movable, such as may be located on a wheel or on a track assembly such that it can be easily positioned adjacent to the gas enclosure system. For use.

圖26A描繪根據本教示內容之各種實施例的OLED列印工 具4000的透視圖,該OLED列印工具可包括第一模組3400、列印模組3500以及第二模組3600。諸如第一模組3400之各種模組可具有第一轉移腔室3410,該第一轉移腔室可具有諸如閘3412之閘,該閘用於第一轉移腔室3410之每一側來適應具有指定功能之各種腔室。如圖26A中所描繪,第一轉移腔室3410可具有負載鎖定閘(未圖示)以及緩衝閘(未圖示),該負載鎖定閘用於整合第一負載鎖定腔室3450與第一轉移腔室3410,且該緩衝閘用於整合第一緩衝腔室3460與第一轉移腔室3410。第一轉移腔室3410之閘3412可用於可移動的腔室或單元,諸如但不限於負載鎖定腔室。可為終端使用者提供觀察窗來例如監視一製程,該等觀察窗諸如第一轉移腔室3410之觀察窗3402及3404,以及第一緩衝腔室3460之觀察窗3406。列印模組3500可包括氣體包體總成3510,該氣體包體總成可具有第一面板總成3520、列印系統包體總成3540以及第二面板總成3560。類似於圖19之氣體包體總成1000,氣體包體總成3510可容納列印系統之各種實施例。第二模組3600可包括第二轉移腔室3610,該第二轉移腔室可具有諸如閘3612之閘,該閘用於第二轉移腔室3610之每一側來適應具有指定功能之各種腔室。如圖26A中所描繪,第二轉移腔室3610可具有負載鎖定閘(未圖示)以及緩衝閘(未圖示),該負載鎖定閘用於整合第二負載鎖定腔室3650與第二轉移腔室3610,且該緩衝閘用於整合第二緩衝腔室3660與第二轉移腔室3610。第二轉移腔室3610之閘3612可用於可移動的腔室或單元,諸如但不限於負載鎖定腔室。可為終端使用者提供觀察窗來例如監視一製程,該等觀察窗諸如第二轉移腔室3610之觀察窗3602及3604。 26A depicts an OLED printer in accordance with various embodiments of the present teachings. With a perspective view of 4000, the OLED printing tool can include a first module 3400, a printing module 3500, and a second module 3600. Various modules, such as first module 3400, can have a first transfer chamber 3410 that can have a gate, such as gate 3412, for each side of first transfer chamber 3410 to accommodate having Specify the various chambers for the function. As depicted in Figure 26A, the first transfer chamber 3410 can have a load lock gate (not shown) and a buffer lock (not shown) for integrating the first load lock chamber 3450 with the first transfer The chamber 3410 is for integrating the first buffer chamber 3460 with the first transfer chamber 3410. The gate 3412 of the first transfer chamber 3410 can be used with a movable chamber or unit such as, but not limited to, a load lock chamber. An observation window can be provided to the end user to, for example, monitor a process such as viewing windows 3402 and 3404 of the first transfer chamber 3410 and the viewing window 3406 of the first buffer chamber 3460. The print module 3500 can include a gas inclusion assembly 3510 that can have a first panel assembly 3520, a printing system package assembly 3540, and a second panel assembly 3560. Similar to the gas inclusion assembly 1000 of Figure 19, the gas enclosure assembly 3510 can accommodate various embodiments of the printing system. The second module 3600 can include a second transfer chamber 3610 that can have a gate such as a gate 3612 for each side of the second transfer chamber 3610 to accommodate various chambers having a specified function room. As depicted in Figure 26A, the second transfer chamber 3610 can have a load lock gate (not shown) and a buffer lock (not shown) for integrating the second load lock chamber 3650 with the second transfer The chamber 3610 is used to integrate the second buffer chamber 3660 with the second transfer chamber 3610. The gate 3612 of the second transfer chamber 3610 can be used with a movable chamber or unit such as, but not limited to, a load lock chamber. An observation window can be provided to the end user to monitor, for example, a process such as viewing windows 3602 and 3604 of the second transfer chamber 3610.

第一負載鎖定腔室3450及第二負載鎖定腔室3650分別與第 一轉移腔室3410及第二轉移腔室3610可附著地相關聯,或該等負載鎖定腔室可為可移動的,諸如可位於輪子上或軌道總成上以便其可容易鄰近腔室定位以供使用。如先前對圖1之氣體包體系統500所述,負載鎖定腔室可安裝至支撐結構且可具有至少兩個閘。例如,第一負載鎖定腔室3450可藉由第一支撐結構3454支撐,且可具有第一閘3452以及第二閘(未圖示),該第二閘可允許與第一轉移模組3410流體連通。類似地,第二負載鎖定腔室3650可藉由第二支撐結構3654支撐,且可具有第二閘3652以及第一閘(未圖示),該第一閘可允許與第二轉移模組3610流體連通。 The first load lock chamber 3450 and the second load lock chamber 3650 are respectively A transfer chamber 3410 and a second transfer chamber 3610 can be adhesively associated, or the load lock chambers can be movable, such as can be located on a wheel or on a track assembly so that they can be easily positioned adjacent to the chamber to For use. As previously described for the gas enclosure system 500 of Figure 1, the load lock chamber can be mounted to the support structure and can have at least two gates. For example, the first load lock chamber 3450 can be supported by the first support structure 3454 and can have a first gate 3452 and a second gate (not shown) that can allow fluid with the first transfer module 3410 Connected. Similarly, the second load lock chamber 3650 can be supported by the second support structure 3654, and can have a second gate 3652 and a first gate (not shown), which can be allowed to interact with the second transfer module 3610 Fluid communication.

圖26B為圖26A之OLED列印工具4000的第一假想透視 圖,該圖尤其描繪複數個風扇過濾器單元鄰近基板行進位置之置放。如先前所論述,可根據列印系統中之基板在處理期間的實體位置來選擇循環及過濾系統之風扇過濾器單元總成的風扇過濾器單元的數目、大小以及形狀。相對於基板之實體行進選擇的風扇過濾器單元總成之風扇過濾器單元的數目、大小以及形狀可在基板製造製程期間提供鄰近基板的低粒子區。 圖26A至圖26C之列印模組3500的各種實施例亦可包括受控顆粒級別,其滿足國際標準組織(ISO)14644-1:1999之標準,「潔淨室及相關聯受控環境-第1部分:空氣潔淨度的分類」,如第1類至第5類所指定。在圖26B之例示性實例中,風扇過濾器單元之陣列可沿基板在處理期間橫穿的路徑定位,此等風扇過濾器單元例如第一模組3400之風扇過濾器單元3422及3423,以及第二模組3500之風扇過濾器單元3522、3542、3544以及3562,如圖26B中所描繪。風扇過濾器單元可包括於其他腔室中,該等風扇過濾 器單元諸如位於第二模組3600之轉移腔室3610內的一或多個風扇過濾器單元,或類似於第一模組3400之風扇過濾器單元3422及3423,其位於第一緩衝腔室3460或第二緩衝腔室3660內。如先前所述,本教示內容之循環及過濾系統的各種實施例無需提供氣流之降流方向。對於本教示內容之系統及方法的各種實施例而言,管道系統及風扇過濾器單元可經定位來跨於基板(諸如基板2050)之表面於側向方向以及於垂直方向上提供大體上層流,如圖26B中所描繪。此等層流可增強或以其他方式提供微粒控制。 Figure 26B is a first imaginary perspective of the OLED printing tool 4000 of Figure 26A. In particular, the figure depicts the placement of a plurality of fan filter units adjacent to a substrate travel position. As previously discussed, the number, size, and shape of the fan filter unit of the fan filter unit assembly of the circulation and filtration system can be selected based on the physical location of the substrate in the printing system during processing. The number, size, and shape of the fan filter units of the selected fan filter unit assembly relative to the physical travel of the substrate can provide a low particle region adjacent the substrate during the substrate fabrication process. The various embodiments of the printing module 3500 of Figures 26A-26C may also include a controlled particle level that meets the International Standards Organization (ISO) 14644-1:1999 standard, "Clean Room and Associated Controlled Environment - Part 1: Classification of Air Cleanliness, as specified in Classes 1 to 5. In the illustrative example of FIG. 26B, the array of fan filter units can be positioned along a path that the substrate traverses during processing, such fan filter units such as fan filter units 3422 and 3423 of the first module 3400, and Fan modules 3522, 3542, 3544, and 3562 of the second module 3500 are depicted in Figure 26B. The fan filter unit can be included in other chambers, and the fan filters The unit is such as one or more fan filter units located within the transfer chamber 3610 of the second module 3600, or similar to the fan filter units 3422 and 3423 of the first module 3400, located in the first buffer chamber 3460 Or within the second buffer chamber 3660. As previously stated, various embodiments of the teachings of the circulation and filtration system of the present teachings do not need to provide a direction of downflow of the airflow. For various embodiments of the systems and methods of the present teachings, the duct system and fan filter unit can be positioned to provide a substantially laminar flow in a lateral direction and in a vertical direction across a surface of a substrate, such as substrate 2050, As depicted in Figure 26B. Such laminar flow may enhance or otherwise provide particle control.

圖26C為圖26A之OLED列印工具4000的第二假想透視 圖,該圖展示根據本教示內容之處置器及列印系統的更多細節。如先前所論述,OLED列印工具4000可包括第一負載鎖定腔室3450,該第一負載鎖定腔室可以可密封方式耦接至第一轉移腔室3410。第一負載鎖定腔室3450可藉由一埠來與轉移腔室3410流體連通,該埠可例如為不透氣閘。當打開此不透氣閘時,第一負載鎖定腔室3450之內部可由處置器進入,該處置器諸如圖26C中所描繪之第一轉移腔室3410中的處置器3430。圖26C中所示之處置器3430可具有底座3432、臂總成3434以及端接器3436。鄰近第一轉移模組列印系統閘3418之處置器3430可將基板定位於浮動台2200之輸入端上,該浮動台可藉由列印系統底座2100支撐。鑒於第一模組3400內處置器3430之位置,處置器3430可鄰近於第一模組3400之任何腔室,且可例如將基板定位於任何腔室中。就該方面而言,如工作流程可要求的,處置器3430可經由第一模組緩衝閘3416來將基板定位於緩衝腔室3460中。 處置器3430可為具有各種自由度的機器人總成,以便操縱基板(諸如基板2050),該基板在圖26C中展示為支撐於列印系統2000之浮動台2200上。 處置器3430可使用端接器(諸如端接器3436)來操縱基板。諸如端接器3436之端接器可包括經配置來藉由重力支撐基板的托盤或框架,或端接器可牢固地抓握或夾緊基板以允許例如將轉移腔室自一位置固緊至下一位置,或用於將基板自面朝上或面朝下構型重新定向至一或多個其他構型。可使用端接器構型之各種實施例,例如叉型端接器、葉片型端接器、夾片型端接器以及夾鉗型端接器。端接器之各種實施例可包括機械抓握及夾緊總成,以及氣動或真空輔助總成來致動端接器之各部分或以其他方式保持基板。 端接器之各種實施例可包括真空吸杯。 Figure 26C is a second imaginary perspective of the OLED printing tool 4000 of Figure 26A. The figure shows more details of the handler and printing system in accordance with the teachings. As previously discussed, the OLED printing tool 4000 can include a first load lock chamber 3450 that can be sealably coupled to the first transfer chamber 3410. The first load lock chamber 3450 can be in fluid communication with the transfer chamber 3410 by a weir, such as a gas impermeable brake. When the airtight gate is opened, the interior of the first load lock chamber 3450 can be accessed by a handler such as the handler 3430 in the first transfer chamber 3410 depicted in Figure 26C. The handler 3430 shown in Figure 26C can have a base 3432, an arm assembly 3434, and a terminator 3436. A handler 3430 adjacent to the first transfer module print system gate 3418 can position the substrate on the input of the floating stage 2200, which can be supported by the printing system base 2100. In view of the location of the handler 3430 within the first module 3400, the handler 3430 can be adjacent to any of the chambers of the first module 3400 and can, for example, position the substrate in any of the chambers. In this regard, the handler 3430 can position the substrate in the buffer chamber 3460 via the first module buffer gate 3416 as may be required by the workflow. The handler 3430 can be a robotic assembly having various degrees of freedom to manipulate a substrate, such as a substrate 2050, which is shown in FIG. 26C as being supported on a floating table 2200 of the printing system 2000. The handler 3430 can use a terminator, such as the terminator 3436, to manipulate the substrate. A terminator such as terminator 3436 can include a tray or frame configured to support the substrate by gravity, or the terminator can securely grip or clamp the substrate to allow, for example, to secure the transfer chamber from a position to The next position, or for redirecting the substrate from face up or face down configuration to one or more other configurations. Various embodiments of the terminator configuration can be used, such as a fork type terminator, a blade type terminator, a clip type terminator, and a clamp type terminator. Various embodiments of the terminator can include a mechanical grip and clamping assembly, and a pneumatic or vacuum assist assembly to actuate portions of the terminator or otherwise retain the substrate. Various embodiments of the terminator can include a vacuum cup.

關於如圖26C中所描繪之OLED列印工具4000之其他特 徵,如先前對圖3之氣體包體總成100及圖19之氣體包體總成1000所論述,OLED列印工具4000之列印模組3500可包括氣體包體總成3510。氣體包體總成3510可具有第一面板總成3520、列印系統包體總成3540以及第二面板總成3560。列印模組3500可具有維持為惰性氣體環境的內部環境,且如先前所論述,該內部環境可經密封(例如,密閉式密封)隔離週遭環境。另外,第一模組3400與第二模組3600及所有相關聯的腔室可同樣具有維持為惰性氣體環境之內部環境,以便OLED列印工具4000可經完全密封(例如,密閉式密封)隔離週遭環境且具有維持為惰性氣體環境之內部環境。如隨後將更詳細地論述,列印頭管理系統(諸如圖20B及圖23之列印頭管理系統2701與圖24A之列印頭管理系統2701A)可定位於列印系統包體總成區域3570中,鄰近第一橋接器端2132及列印頭總成2500。包括各種包封內部區域之所有者的包封系統(諸如列印工具4000)可受監視及控制來維持指定級別的以下一或多者:氣體純度、污染物或微粒。回顧而言,可使用氣 體來維持惰性氣體環境,該氣體諸如氮、任何稀有氣體及其任何組合。氣體包體系統內之惰性氣體環境可具有對於本教示內容之氣體包體系統的各種實施例而言維持於以下含量的反應性物種(諸如水蒸氣、氧)以及有機溶劑蒸氣中的每一者:100ppm或更低,例如10ppm或更低,1.0ppm或更低,或0.1ppm或更低。 Regarding other special features of the OLED printing tool 4000 as depicted in Figure 26C As previously discussed with respect to the gas inclusion assembly 100 of FIG. 3 and the gas inclusion assembly 1000 of FIG. 19, the printing module 3500 of the OLED printing tool 4000 can include a gas inclusion assembly 3510. The gas inclusion assembly 3510 can have a first panel assembly 3520, a printing system package assembly 3540, and a second panel assembly 3560. The print module 3500 can have an internal environment maintained in an inert gas environment, and as previously discussed, the internal environment can be sealed (eg, hermetic seal) to isolate the surrounding environment. In addition, the first module 3400 and the second module 3600 and all associated chambers can have an internal environment maintained in an inert gas environment so that the OLED printing tool 4000 can be completely sealed (eg, hermetic seal). The surrounding environment has an internal environment that maintains an inert gas environment. As will be discussed in more detail later, the printhead management system (such as the printhead management system 2701 of Figures 20B and 23 and the printhead management system 2701A of Figure 24A) can be positioned in the print system package assembly area 3570. The first bridge end 2132 and the print head assembly 2500 are adjacent. An encapsulation system, including various owners of the inner regions of the encapsulation, such as printing tool 4000, can be monitored and controlled to maintain one or more of the following levels: gas purity, contaminants, or particulates. In retrospect, gas can be used The body maintains an inert gas environment such as nitrogen, any noble gases, and any combination thereof. The inert gas environment within the gas inclusion system can have each of the reactive species (such as water vapor, oxygen) and organic solvent vapor maintained at the following levels for various embodiments of the gas inclusion system of the present teachings. : 100 ppm or less, such as 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less.

對於圖26C之OLED列印工具4000的各種實施例而言,第 一處理模組3400可包括緩衝或固持模組3460,其經配置來提供各別環境受控區域,以便適應正在製造的各別基板。各種環境受區域可沿緩衝或固持模組之指定(例如,垂直)軸彼此偏移,以便提供「堆疊緩衝器」構型。 以此方式,可將一或多個基板緩衝或儲存於OLED列印工具4000之惰性環境內,諸如排隊以用於一或多個其他模組中之進一步處理。各別基板可使用處置器3430傳送至各別環境受控區域,該處置器可具有用於機器人操作之端接器3436,該端接器如圖26C中所描繪可為叉型端接器。回顧而言,各種OLED基板可為第3.5代至第8.5代及以上,以便基板尺寸可自約60cm×72cm改變至約220cm×250cm及更大尺寸。為經由各種操作進一步固緊基板,此等叉型端接器可裝備機械抓握及夾緊總成,或可設計來使用機械抽吸或真空抽吸。 For the various embodiments of the OLED printing tool 4000 of Figure 26C, A processing module 3400 can include a buffer or retention module 3460 that is configured to provide separate environmentally controlled regions to accommodate the individual substrates being fabricated. The various environment-receiving regions can be offset from each other along a designated (eg, vertical) axis of the buffer or retention module to provide a "stack buffer" configuration. In this manner, one or more substrates can be buffered or stored in an inert environment of the OLED printing tool 4000, such as queued for further processing in one or more other modules. The individual substrates can be transferred to respective environmentally controlled regions using a handler 3430, which can have a terminator 3436 for robotic operation, which can be a forked terminator as depicted in Figure 26C. In retrospect, various OLED substrates can be from the 3.5th generation to the 8.5th generation and above, so that the substrate size can be changed from about 60 cm x 72 cm to about 220 cm x 250 cm and larger. To further secure the substrate via various operations, the forked terminators can be equipped with mechanical grip and clamping assemblies, or can be designed to use mechanical suction or vacuum suction.

如先前對圖1之氣體包體系統500所述,圖26C之第一負載 鎖定腔室3450可經由閘3452接收基板。當基板接收於負載鎖定腔室3450中時,該腔室可獲隔離且可由惰性氣體(諸如氮、任何稀有氣體及其任何組合)沖洗,直至反應性大氣氣體處於100ppm或更低的低含量,例如10ppm或更低,1.0ppm或更低,或0.1ppm或更低的低含量。基板自負載鎖定腔 室3450至第一轉移模組3400之輸送可藉由處置器3430執行,該處置器可將基板(諸如基板2050)置放於列印模組3500中之浮動台2200上。如圖26C中所描繪,浮動台2200可藉由列印系統底座2100支撐。基板2050可在列印製程期間保持支撐於基板浮動台上,且可藉由Y軸定位系統相對於列印頭總成2500來移動,該列印頭總成可安裝至X軸托架總成2300。列印模組3500之列印系統2000可用來在OLED裝置製造期間將一或多個薄膜層可控制地沈積於基板上。列印模組3500亦可耦接至諸如圖26C之第二模組3600的輸出包體區域。如對第一模組3400之處置器3430所描繪,第二模組3600可具有第二轉移模組輸出閘3614,且可具有定位於第二轉移模組3610中之處置器。浮動台2200及Y軸定位系統可隨基板於列印模組3500中之行進延伸,以便基板可行進至鄰近第二轉移模組列印系統閘3614的位置,且可容易由定位於第二轉移模組3610中之處置器接取,以便轉移至第二模組3600中。如對定位於第一轉移模組3410中之處置器3430所述,處置器可位於第二模組3600中,以便容易將基板定位於第二模組3600之任何腔室中。就該方面而言,如工作流程可要求的,定位於第二轉移腔室3610中之處置器可將基板定位於緩衝器3660中。 As previously described for the gas inclusion system 500 of Figure 1, the first load of Figure 26C The lock chamber 3450 can receive the substrate via the gate 3452. When the substrate is received in the load lock chamber 3450, the chamber can be isolated and flushed with an inert gas such as nitrogen, any noble gas, and any combination thereof until the reactive atmospheric gas is at a low level of 100 ppm or less, For example, 10 ppm or less, 1.0 ppm or less, or a low content of 0.1 ppm or less. Substrate self-load locking cavity The transfer of the chamber 3450 to the first transfer module 3400 can be performed by a handler 3430 that can place a substrate (such as the substrate 2050) on the floating stage 2200 in the printing module 3500. As depicted in Figure 26C, the floating stage 2200 can be supported by the printing system base 2100. The substrate 2050 can be supported on the substrate floating stage during the printing process and can be moved relative to the print head assembly 2500 by a Y-axis positioning system mountable to the X-axis bracket assembly 2300. The printing system 2000 of the printing module 3500 can be used to controllably deposit one or more thin film layers on the substrate during fabrication of the OLED device. The print module 3500 can also be coupled to an output package area such as the second module 3600 of FIG. 26C. As depicted by the processor 3430 of the first module 3400, the second module 3600 can have a second transfer module output gate 3614 and can have a handler positioned in the second transfer module 3610. The floating stage 2200 and the Y-axis positioning system can extend along with the travel of the substrate in the printing module 3500, so that the substrate can travel to a position adjacent to the second transfer module printing system gate 3614, and can be easily positioned by the second transfer. The handler in module 3610 is accessed for transfer to second module 3600. As described for the handler 3430 positioned in the first transfer module 3410, the handler can be located in the second module 3600 to facilitate positioning of the substrate in any of the chambers of the second module 3600. In this regard, the handler positioned in the second transfer chamber 3610 can position the substrate in the buffer 3660 as may be required by the workflow.

在第一模組3400、列印模組3500以及第二模組3600內,基 板可按各種製程所要或在單一沈積操作期間重新定位。在OLED列印工具之各種實施例中,第一模組3400、列印模組3500以及第二模組3600內之惰性環境可藉由共同共用的環境控制系統來維持。對於OLED列印工具之各種實施例而言,第一模組3400、列印模組3500以及第二模組3600內之惰性環境可由獨立環境控制系統來維持。諸如在涉及列印模組3500的一或多個 沈積操作之後或在其他處理之後,第二負載鎖定腔室3650可用來使用第二轉移模組3610中之處置器將基板轉移出第二模組3600。 In the first module 3400, the printing module 3500, and the second module 3600, the base The plates can be repositioned as desired for various processes or during a single deposition operation. In various embodiments of the OLED printing tool, the inert environment within the first module 3400, the printing module 3500, and the second module 3600 can be maintained by a common environmental control system. For various embodiments of the OLED printing tool, the inert environment within the first module 3400, the printing module 3500, and the second module 3600 can be maintained by an independent environmental control system. Such as one or more related to the printing module 3500 After the deposition operation or after other processing, the second load lock chamber 3650 can be used to transfer the substrate out of the second module 3600 using the handler in the second transfer module 3610.

列印系統2000可包括具有一或多個列印頭裝置的至少一個 列印頭總成,該等列印頭裝置可具有至少一個列印頭,例如就噴嘴列印而言,該列印頭可為熱噴流型、噴嘴噴流型或噴墨型。該至少一個列印頭總成可安裝至架空托架,諸如經配置來以「面朝上」構型將一或多個薄膜層沈積於基板上。例如,可藉由一或多個列印頭沈積的一或多個薄膜層可包括電子注入或輸送層、電洞注入或輸送層、阻擋層或發射層中之一或多者。 此等材料可提供一或多個電氣功能層。可使用列印技術沈積諸如單體或聚合物材料之其他材料,如本文所述之其他實例所述,該等材料諸如用於為正在製造的基板4000提供一或多個封裝層。 Printing system 2000 can include at least one of having one or more printhead devices A print head assembly, the print head assembly having at least one print head, for example, for nozzle printing, the print head can be a thermal spray type, a nozzle spray type or an ink jet type. The at least one printhead assembly can be mounted to an overhead carrier, such as configured to deposit one or more film layers onto the substrate in a "face up" configuration. For example, one or more thin film layers that may be deposited by one or more printheads may include one or more of an electron injecting or transporting layer, a hole injecting or transporting layer, a barrier layer, or an emissive layer. These materials may provide one or more electrical functional layers. Other materials, such as monomeric or polymeric materials, may be deposited using printing techniques, such as those used to provide one or more encapsulation layers for the substrate 4000 being fabricated, as described in other examples herein.

儘管OLED列印工具4000之各種實施例可利用圖20B之列 印系統2000,但是列印系統之其他實施例(諸如圖27之示範性列印系統2001)可容易利用於OLED列印工具4000中。圖27為列印系統2001之前部透視圖,該列印系統展示為具有安裝於橋接器2130頂部上的電纜托盤總成排氣系統2400,以便含有及排出由電纜束之持續移動所形成的微粒物質。如先前對圖20B之列印系統2000及圖27之列印系統2001所述,列印系統2001之各種實施例可具有許多特徵。例如,列印系統2001可藉由列印系統底座2101支撐。第一豎板2120及第二豎板2122可安裝於列印系統底座2101之上,橋接器2130可安裝於該第一豎板及該第二豎板之上。對於噴墨列印系統2001之各種實施例而言,橋接器2130可支撐至少一個X,Z軸托架總成2300,該托架總成可在X軸方向上相對於基板支撐設備2250移動穿 過電纜載體運道2401。在列印系統2001之各種實施例中,第二X,Z軸托架總成可安裝於橋接器2130上。對於具有兩個X,Z軸托架總成的列印系統2001之實施例而言,列印頭總成可安裝於每一X,Z軸托架上,或如對圖20B之列印系統2000所述,諸如攝影機、UV燈以及熱源之各種裝置可安裝於列印系統2001之兩個X,Z軸托架總成中的至少一者上。根據列印系統2001之各種實施例,用於支撐基板2050之基板支撐設備2250可為浮動台,其類似於圖20B之列印系統2000的基板浮動台2200;或其可為卡盤,如先前對圖20B之列印系統2000所述。圖27之列印系統2001可具有固有的低粒子產生X軸運動系統,X,Z托架總成2300可安裝於該低粒子產生X軸運動系統中且使用空氣軸承線性滑件總成來定位於橋接器2130上。空氣軸承線性滑件總成之各種實施例可包繞整體橋接器2130,從而允許X,Z托架總成2300於橋接器2130上之無摩擦移動,且允許提供可保留X,Z托架總成2300之行進準確度的三點式安裝,以及耐偏斜性。 Although various embodiments of the OLED printing tool 4000 can utilize the columns of Figure 20B The printing system 2000, but other embodiments of the printing system, such as the exemplary printing system 2001 of FIG. 27, can be readily utilized in the OLED printing tool 4000. Figure 27 is a front perspective view of the printing system 2001, shown as having a cable tray assembly exhaust system 2400 mounted on top of the bridge 2130 to contain and discharge particulates formed by continuous movement of the cable bundle substance. As previously described with respect to the printing system 2000 of FIG. 20B and the printing system 2001 of FIG. 27, various embodiments of the printing system 2001 can have many features. For example, the printing system 2001 can be supported by the printing system base 2101. The first riser 2120 and the second riser 2122 can be mounted on the printing system base 2101, and the bridge 2130 can be mounted on the first riser and the second riser. For various embodiments of the inkjet printing system 2001, the bridge 2130 can support at least one X, Z-axis carriage assembly 2300 that can be moved relative to the substrate support apparatus 2250 in the X-axis direction. Pass the cable carrier path 2401. In various embodiments of the printing system 2001, the second X, Z-axis bracket assembly can be mounted to the bridge 2130. For embodiments of the printing system 2001 having two X, Z-axis carriage assemblies, the print head assembly can be mounted on each X, Z-axis carriage, or as shown in Figure 20B. As described in 2000, various devices such as cameras, UV lamps, and heat sources can be mounted on at least one of the two X, Z-axis bracket assemblies of the printing system 2001. According to various embodiments of the printing system 2001, the substrate supporting apparatus 2250 for supporting the substrate 2050 may be a floating stage similar to the substrate floating stage 2200 of the printing system 2000 of FIG. 20B; or it may be a chuck, as before The printing system 2000 of Figure 20B is described. The printing system 2001 of Figure 27 can have an inherent low particle generation X-axis motion system, and the X, Z bracket assembly 2300 can be mounted in the low particle generation X-axis motion system and positioned using an air bearing linear slider assembly. On the bridge 2130. Various embodiments of the air bearing linear slider assembly can wrap around the integral bridge 2130, thereby allowing frictionless movement of the X, Z bracket assembly 2300 on the bridge 2130, and allowing for the provision of a retainable X, Z bracket total A three-point installation with 2300 travel accuracy and resistance to skewness.

自圖28A至圖30C之圖式序列描繪用於以完全自動化模式 或遠程操作員輔助模式進行列印頭管理之系統及方法的各種實施例,其幾乎不或不中斷持續不斷進行的製程,同時維持惰性、大體上無粒子製程環境。回顧而言,列印頭總成可包括約1個至約60個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中的介於約1個至約30之間的列印頭。因此,本教示內容之列印系統的各種實施例可具有介於約1個至約1800個之間的列印頭。此外,例如工業噴墨頭之列印頭可具有介於約16個至約2048個之間的噴嘴,該等噴嘴可射出介於約0.1pL至200pL之間的微滴體積。數目眾多的列印頭可需要根據所需而週期性地執行持續不斷 的量測及維護程序。根據本教示內容之各種系統及方法,與列印系統之各種組件的持續不斷的管理有關的各種製程步驟,諸如與持續不斷的量測及維持程序有關的各種製程步驟,可使用諸如圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A的列印頭管理系統來執行。列印頭管理系統之各種實施例可包括各種子系統或模組,諸如列印頭更換模組、小滴量測模組、列印頭沖洗池模組以及吸墨紙模組。 The sequence from Figure 28A to Figure 30C is depicted for use in fully automated mode Or remote operator assisted mode embodiments of systems and methods for printhead management that have little or no interruption to ongoing processes while maintaining an inert, substantially particle-free process environment. In review, the printhead assembly can include between about 1 and about 60 printhead devices, wherein each printhead device can have between about 1 and about 30 in each printhead device. The print head between. Thus, various embodiments of the printing system of the present teachings can have between about 1 and about 1800 printheads. Additionally, a printhead such as an industrial inkjet head can have between about 16 and about 2048 nozzles that can eject a droplet volume between about 0.1 pL and 200 pL. A large number of print heads can be continuously executed as needed Measurement and maintenance procedures. In accordance with various systems and methods of the present teachings, various process steps associated with the ongoing management of various components of the printing system, such as various process steps associated with ongoing measurement and maintenance procedures, may be utilized, such as FIG. 20B and The print head management system 2701 of Fig. 23 and the print head management system of the print head management system 2701A of Fig. 24A are executed. Various embodiments of the printhead management system can include various subsystems or modules, such as a printhead replacement module, a droplet measurement module, a printhead rinse cell module, and a blotter paper module.

每一子系統或模組皆可具有各種部件,該等部件本質上為可 消耗的,且需要更換,諸如更換吸墨紙、油墨及廢料儲器。各種可消耗部件可經封裝以準備例如以完全自動模式使用處置器進行插入。作為非限制性實例,吸墨紙可封裝於匣筒格式中,該匣筒格式可易於插入吸墨模組中供使用。舉另一非限制性實例而言,油墨可封裝於可更換儲器及匣筒格式中以用於列印系統中。廢料儲器之各種實施例可封裝於匣筒格式中,該匣筒格式可易於插入沖洗池模組中供使用。另外,經受持續不斷使用之列印系統之各種組件的部件可需要週期性更換。在列印製程期間,可需要列印頭總成之權宜管理,例如但不限於列印頭裝置或列印頭之交換。列印頭更換模組可具有諸多部件,諸如列印頭裝置或列印頭,該等部件可易於插入列印頭總成中供使用。用於檢查噴嘴發射以及基於來自每一噴嘴之小滴體積、速度及軌跡之光學偵測進行量測的小滴量測模組可具有在使用之後可需要週期性更換的來源及偵測器。各種可消耗及高使用率部件可經封裝以用於準備例如以完全自動模式使用處置器進行插入。 Each subsystem or module can have various components that are essentially Consumed and need to be replaced, such as replacement of blotting paper, ink and waste storage. The various consumable parts can be packaged to prepare for insertion using the handler, for example, in a fully automated mode. As a non-limiting example, the blotter paper can be packaged in a cartridge format that can be easily inserted into an ink absorbing module for use. By way of another non-limiting example, the ink can be packaged in a replaceable reservoir and cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into a rinse tank module for use. In addition, components that are subject to the various components of the continuously used printing system may require periodic replacement. During the printing process, expediency management of the printhead assembly may be required, such as, but not limited to, the exchange of printhead devices or printheads. The printhead replacement module can have many components, such as a printhead device or a printhead, which can be easily inserted into the printhead assembly for use. The droplet measurement module for inspecting nozzle emissions and measuring optical detection based on droplet volume, velocity and trajectory from each nozzle may have sources and detectors that may need to be periodically replaced after use. Various consumable and high usage components can be packaged for preparation for insertion using the handler, for example, in a fully automated mode.

對於本教示內容之系統及方法之各種實施例(由圖28A至圖30C表示的彼等實施例)而言,例如舉非限制性實例而言,列印系統包 體可與輔助包體之各種實施例隔離。因此,對用於列印系統各部件之自動化或終端使用者緩和交換的輔助包體之利用可確保列印製程可在最少中斷或無中斷情況下持續進行。氣體包體之各種實施例可具有允許進入列印系統包體與輔助包體之間的可密封開口或通道,以及允許進入輔助包體與氣體包體外部之間的開口。因此,可使輔助包體之各種實施例與氣體包體系統之列印系統包體隔離,以使得每一體積為獨立起作用之區段。此外,當列印系統包體與輔助包體隔離時,輔助包體與氣體包體外部之間的開口可對周圍或非惰性空氣開放而不污染列印系統包體。 For various embodiments of the systems and methods of the present teachings (the embodiments represented by Figures 28A-30C), for example, by way of non-limiting example, a printing system package The body can be isolated from various embodiments of the auxiliary package. Thus, the use of an auxiliary package for automated or end-user mitigation of the various components of the printing system ensures that the printing process can be continued with minimal or no interruption. Various embodiments of the gas enclosure may have a sealable opening or passage that allows access between the printing system enclosure and the auxiliary enclosure, as well as an opening that allows access between the auxiliary enclosure and the exterior of the gas enclosure. Thus, various embodiments of the auxiliary package can be isolated from the printing system package of the gas enclosure system such that each volume is a separate active segment. In addition, when the printing system package is isolated from the auxiliary package, the opening between the auxiliary package and the exterior of the gas enclosure can be open to ambient or non-inert air without contaminating the printing system package.

對於氣體包體系統之各種實施例而言,輔助包體可使用用於 一開口之結構閉合件來與氣體包體系統之列印系統包體隔離,該開口諸如包體面板開口或通道、門或窗。對於本教示內容之系統及方法之各種實施例而言,結構閉合件可包括用於開口或通道之各種可密封覆蓋物;此種開口或通道包括包體面板開口或通道、門或窗之非限制性實例。根據本教示內容之系統及方法,閘可為可用來使用氣動致動、液壓致動、電氣致動或手動致動來可逆地覆蓋或以可密封方式可逆地封閉任何開口或通道的任何結構閉合件。可在氣體包體系統之工作體積與輔助包體之間使用諸如壓力差或氣簾之動態閉合件,以及動態閉合件及結構閉合件之各種實施例的組合來將輔助包體之各種實施例與氣體包體系統之工作體積隔離。另外,氣體包體之工作體積及輔助包體中之每一者可具有獨立受控環境,從而提供獨立調節例如但不限於溫度、照明、粒子控制以及氣體純化之能力。因此,可將用於輔助包體體積及氣體包體之工作體積的熱控制、照明控制、粒子控制以及惰性氣體環境控制之規範針對每一體積設定成相同或不同的。 For various embodiments of the gas inclusion system, an auxiliary package can be used for An open structural closure is isolated from the printing system enclosure of the gas enclosure system, such as an enclosure panel opening or passage, door or window. For various embodiments of the systems and methods of the present teachings, the structural closure can include various sealable covers for openings or passages; such openings or passages include enclosure panel openings or passages, doors or windows. A restrictive example. In accordance with the teachings and methods of the present teachings, the brake can be any structural closure that can be used to reversibly cover or reversibly seal any opening or passage in a sealable manner using pneumatic actuation, hydraulic actuation, electrical actuation, or manual actuation. Pieces. Various embodiments of the auxiliary package can be used with a combination of various embodiments of a dynamic closure and a structural closure between a working volume of the gas enclosure system and the auxiliary package, such as a pressure differential or a dynamic closure of the air curtain, and various embodiments of the dynamic closure and structural closure The working volume of the gas inclusion system is isolated. In addition, each of the working volume of the gas enclosure and the auxiliary package can have an independently controlled environment to provide independent adjustment of capabilities such as, but not limited to, temperature, illumination, particle control, and gas purification. Therefore, the specifications of the thermal control, the illumination control, the particle control, and the inert gas environment control for assisting the volume of the package and the working volume of the gas inclusion can be set to be the same or different for each volume.

圖28A至圖28C描繪用於以完全自動化模式或遠程操作員 輔助模式進行列印頭管理之列印系統及方法的各種實施例,其幾乎不或不中斷持續不斷進行的製程,同時維持OLED列印工具4001中的惰性、大體上無粒子製程環境。相較於圖26A至圖26C之OLED列印系統4000而言,圖28A至圖28C之OLED列印工具4001的各種實施例可包括輔助包體,諸如例如但不限於轉移腔室、負載鎖定腔室以及可調式受控環境包體。對於本教示內容之系統及方法之實施例而言,OLED列印工具4001可具有輔助包體,該輔助包體可維持於用於受控環境的與用於列印模組3500之受控環境的規範相同的規範下。在本教示內容之系統及方法之各種實施例中,OLED列印工具4001可具有輔助包體,該輔助包體可維持於用於受控環境的與用於列印模組3500之受控環境的規範不同的規範下,而不折衷OLED列印工具4001之環境的整體性。 28A-28C depicting for use in a fully automated mode or remote operator The auxiliary mode performs various embodiments of the printhead management printing system and method that hardly or uninterrupted the ongoing process while maintaining an inert, substantially particle-free process environment in the OLED printing tool 4001. Various embodiments of the OLED printing tool 4001 of FIGS. 28A-28C may include an auxiliary package such as, for example, but not limited to, a transfer chamber, a load lock cavity, as compared to the OLED printing system 4000 of FIGS. 26A-26C Room and adjustable controlled environment enclosure. For embodiments of the system and method of the present teachings, the OLED printing tool 4001 can have an auxiliary package that can be maintained in a controlled environment for the printed environment and for the printing module 3500. The specifications are the same under the specification. In various embodiments of the system and method of the present teachings, the OLED printing tool 4001 can have an auxiliary package that can be maintained in a controlled environment for the printing environment and for the printing module 3500. The specification is different under the specification, without compromising the integrity of the environment of the OLED printing tool 4001.

如圖28A中所描繪,OLED列印工具4001之列印系統模組 3500可具有第三模組3700,其耦接至列印系統包體總成3540。第三模組3700可鄰近於橋接器2130之第一橋接器端2132定位,其中安裝於X軸托架總成2300上之列印頭總成2500可鄰近於第三模組3700定位。圖28A之第三模組3700可具有第三轉移腔室3710,該第三轉移腔室可為用於OLED列印工具4001之輔助包體,其適用於實施各種列印頭維持程序。圖28A之第三模組3700可具有第三負載鎖定腔室,該第三負載鎖定腔室可耦接至第三轉移腔室3710。在本教示內容之系統及方法的各種實施例中,第三腔室3700可鄰近於第二橋接器端2134定位。對於本教示內容之系統及方法的各種實施例而言,列印系統模組3500可具有諸如圖28A之第三模組3700的模組, 其鄰近於第一橋接器端2132及第二橋接器端2134。另外,雖然單一托架展示為用於圖28A中所示之OLED列印工具4001的列印系統2000,但是諸如圖20B之列印系統的列印系統可具有額外托架,該托架可具有各種裝置,諸如安裝於第二托架上之列印頭總成、攝影機、UV燈以及熱源,如先前對圖20B之列印系統2000及圖27之列印系統2001所述。 As shown in FIG. 28A, the printing system module of the OLED printing tool 4001 The 3500 can have a third module 3700 coupled to the printing system package assembly 3540. The third module 3700 can be positioned adjacent to the first bridge end 2132 of the bridge 2130, wherein the print head assembly 2500 mounted on the X-axis bracket assembly 2300 can be positioned adjacent to the third module 3700. The third module 3700 of FIG. 28A can have a third transfer chamber 3710 that can be an auxiliary package for the OLED printing tool 4001 that is suitable for implementing various print head maintenance procedures. The third module 3700 of FIG. 28A can have a third load lock chamber that can be coupled to the third transfer chamber 3710. In various embodiments of the systems and methods of the present teachings, the third chamber 3700 can be positioned adjacent to the second bridge end 2134. For various embodiments of the system and method of the present teachings, the printing system module 3500 can have a module such as the third module 3700 of FIG. 28A. It is adjacent to the first bridge end 2132 and the second bridge end 2134. Additionally, while a single bay is shown as a printing system 2000 for the OLED printing tool 4001 shown in Figure 28A, a printing system such as the printing system of Figure 20B can have additional brackets that can have Various devices, such as a printhead assembly mounted on a second carriage, a camera, a UV lamp, and a heat source are as previously described for the printing system 2000 of Figure 20B and the printing system 2001 of Figure 27.

在圖28A中,儘管未展示與第三模組3700相關聯的額外腔 室,但是腔室可耦接至第三轉移腔室3710之第一側3702上,且可經由閘3714來進入第三轉移腔室3710。類似地,腔室可耦接第三轉移腔室3710之第二側3704上,且可經由閘3718來進入第三轉移腔室3710。耦接至第三轉移腔室3710的各種額外腔室可適用於各種列印頭維持程序。對於OLED列印工具4001之各種實施例而言,第三模組3700之第三轉移腔室3710可用來容納處置器,而與第三轉移模組3710相關聯的額外腔室可用來儲存及轉移本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。在OLED列印工具4001之各種實施例中,列印系統包體總成3540可具有一體積或區域,其諸如鄰近於第一橋接器端2132之第一列印系統包體總成區域3570及鄰近於第二橋接器端2134之第二列印系統包體總成區域3572。根據本教示內容之OLED列印工具的各種實施例,第一列印系統包體總成區域3570及第二列印系統包體總成區域3572中一者或兩者可用來容納列印頭管理系統,其諸如圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A(亦參見圖26C)。就該方面而言,例如,位於第三轉移模組3710中之處置器可於與第三轉移模組3710及位於列印系統模組3500中之列印頭維持系統相關聯的各種腔室(諸如但不限於負載鎖定腔室 3750)之間移動部件。 In FIG. 28A, although an additional cavity associated with the third module 3700 is not shown The chamber, but the chamber can be coupled to the first side 3702 of the third transfer chamber 3710 and can enter the third transfer chamber 3710 via the gate 3714. Similarly, the chamber can be coupled to the second side 3704 of the third transfer chamber 3710 and can enter the third transfer chamber 3710 via the gate 3718. The various additional chambers coupled to the third transfer chamber 3710 can be adapted for a variety of printhead maintenance procedures. For various embodiments of the OLED printing tool 4001, the third transfer chamber 3710 of the third module 3700 can be used to house a handler, and the additional chamber associated with the third transfer module 3710 can be used for storage and transfer. The teachings herein include various components of the subsystems and modules of various embodiments of the printhead management system. In various embodiments of the OLED printing tool 4001, the printing system package assembly 3540 can have a volume or region, such as a first printing system package assembly region 3570 adjacent to the first bridge end 2132 and A second print system package assembly region 3572 adjacent to the second bridge end 2134. In accordance with various embodiments of the OLED printing tool of the present teachings, one or both of the first printing system package assembly region 3570 and the second printing system package assembly region 3572 can be used to accommodate printhead management. The system, such as the printhead management system 2701 of Figures 20B and 23 and the printhead management system 2701A of Figure 24A (see also Figure 26C). In this regard, for example, the processor located in the third transfer module 3710 can be in various chambers associated with the third transfer module 3710 and the print head maintenance system located in the print system module 3500 ( Such as but not limited to a load lock chamber Move parts between 3750).

圖28B為圖28A中所示之OLRD列印工具4001的平面圖, 根據本教示內容之各種實施例,其中第三轉移腔室3710為輔助包體。第三轉移腔室3710可具有閘3412,該閘可提供對負載鎖定腔室3750之進入,且可具有閘3416,該閘可提供對列印模組3500之進入。第三負載鎖定腔室3750可具有閘3752,該閘可提供自OLED列印工具4001外部對第三負載鎖定腔室3750之進入。如先前所論述,處置器3430及處置器3630可具有選用於基板處置任務之特徵。根據本教示內容,圖28B之處置器3730可具有選用於處置與諸如列印頭管理系統2700之列印頭管理系統相關聯的各種部件的特徵。列印頭管理系統2700可為例如但不限於諸如圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A之列印頭管理系統。如先前參考圖28A之教示內容所提及,列印頭管理系統可位於諸如列印模組3500之3570或3572的體積或區域中。如圖28B中所描繪,容納於界定第三轉移腔室3710之輔助包體內的處置器3730可經定位,以便該處置器可進入列印系統包體總成區域3570,該列印系統包體總成區域鄰近於X軸托架總成2300。安裝至橋接器2130的托架總成2300可支撐列印頭總成2500,該列印頭總成可包括複數個列印頭裝置。處置器3730之各種實施例可具有各種端接器構型,例如叉型端接器、葉片型端接器、夾片型端接器以及夾鉗型端接器,該等端接器可選用於操縱列印頭管理系統之各種部件。根據本教示內容,端接器可包括機械抓握及夾緊總成,以及氣動或真空輔助總成來致動端接器之各部分或以其他方式保持列印頭管理系統之各種部件,諸如例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。 28B is a plan view of the OLRD printing tool 4001 shown in FIG. 28A. According to various embodiments of the present teachings, wherein the third transfer chamber 3710 is an auxiliary package. The third transfer chamber 3710 can have a gate 3412 that can provide access to the load lock chamber 3750 and can have a gate 3416 that can provide access to the print module 3500. The third load lock chamber 3750 can have a gate 3752 that can provide access to the third load lock chamber 3750 from outside the OLED print tool 4001. As previously discussed, the handler 3430 and the handler 3630 can have features selected for substrate handling tasks. In accordance with the present teachings, the handler 3730 of FIG. 28B can have features selected for handling various components associated with a printhead management system such as the printhead management system 2700. The printhead management system 2700 can be, for example but not limited to, a printhead management system 2701 such as those of Figures 20B and 23 and a printhead management system of the printhead management system 2701A of Figure 24A. As mentioned previously with reference to the teachings of FIG. 28A, the printhead management system can be located in a volume or area such as 3570 or 3572 of the printing module 3500. As depicted in Figure 28B, the handler 3730 housed within the auxiliary package defining the third transfer chamber 3710 can be positioned such that the handler can enter the printing system package assembly region 3570, which prints the system package The assembly area is adjacent to the X-axis bracket assembly 2300. The carriage assembly 2300 mounted to the bridge 2130 can support the printhead assembly 2500, which can include a plurality of printhead assemblies. Various embodiments of the handler 3730 can have various terminator configurations, such as fork-type terminators, blade-type terminators, clip-type terminators, and clamp-type terminators, which can be used with the terminators For manipulating the various components of the print head management system. In accordance with the present teachings, the terminator can include a mechanical grip and clamping assembly, and a pneumatic or vacuum assist assembly to actuate portions of the terminator or otherwise retain various components of the printhead management system, such as For example, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device.

關於根據本教示內容之各種實施例的列印頭更換,圖28B 之處置器3730可例如自安裝於X軸托架總成2300上之列印頭總成2500取回需要更換的部件,諸如列印頭或列印頭裝置。在後一步驟中,處置器3730可自列印頭,例如自管理系統2700取回更換部件。一旦已取回更換部件,處置器3730隨後可將諸如列印頭裝置或列印頭之更換部件插入列印頭總成2500中以便完成列印頭更換程序。此外,對於圖28B之OLED列印工具4001的各種實施例而言,第三模組3700之第三轉移腔室3710可用來容納處置器,而負載鎖定腔室3750可用來儲存及轉移本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。儲存於負載鎖定腔室3750中的用於列印頭管理系統2700之各種更換部件可藉由處置器3730接取且移動至列印頭管理系統2700,該等更換部件例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。相反地,例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置的需要更換之部件可藉由處置器3730自列印頭管理系統2700移除且置放於負載鎖定腔室3750中。在列印頭管理程序之各種實施例中,諸如列印頭裝置或列印頭之部件可藉由處置器3730自負載鎖定腔室3750移除且插入列印頭總成2500中。可打開負載鎖定腔室3750之閘3752,同時閉合閘3712及閘3716,以便自負載鎖定腔室3750取回或移除部件,且將更換部件轉移至負載鎖定腔室3750可藉由處置器或位於OLED列印工具4001外部處於周圍空氣中的終端使用者來進行。 With respect to print head replacement in accordance with various embodiments of the present teachings, FIG. 28B The handler 3730 can retrieve components that need to be replaced, such as a printhead or printhead device, for example from a printhead assembly 2500 mounted on the X-axis carriage assembly 2300. In the latter step, the handler 3730 can retrieve the replacement component from the printhead, such as from the management system 2700. Once the replacement component has been retrieved, the handler 3730 can then insert a replacement component, such as a printhead device or printhead, into the printhead assembly 2500 to complete the printhead replacement procedure. In addition, for various embodiments of the OLED printing tool 4001 of FIG. 28B, the third transfer chamber 3710 of the third module 3700 can be used to house a handler, and the load lock chamber 3750 can be used to store and transfer the teachings. The various components of the various embodiments of the head management system and the various components of the module. The various replacement components for the printhead management system 2700 stored in the load lock chamber 3750 can be accessed by the handler 3730 and moved to the printhead management system 2700, such as but not limited to blotting paper. A cartridge, an ink cartridge, a waste reservoir, a print head, and a print head device. Conversely, components that need to be replaced, such as, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device, may be removed from the printhead management system 2700 by the handler 3730 and Placed in the load lock chamber 3750. In various embodiments of the printhead management program, components such as a printhead device or printhead can be removed from the load lock chamber 3750 by the handler 3730 and inserted into the printhead assembly 2500. The gate 3752 of the load lock chamber 3750 can be opened while the gate 3712 and the gate 3716 are closed to retrieve or remove components from the load lock chamber 3750, and transferring the replacement component to the load lock chamber 3750 can be by a handler or The end user located in the ambient air outside the OLED printing tool 4001 performs.

在用於取回部件之程序、用於更換部件之程序或兩者已完成之後,可閉合負載鎖定腔室3750之閘3752,且負載鎖定腔室3750可經歷恢 復程序來將該腔室之氣體環境復原至目標規範。鑒於負載鎖定腔室3750相較於OLED列印工具4001之體積而言大體上小的體積,恢復時間比用於OLED列印工具4001之恢復時間大體上短。可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。就該方面而言,OLED列印工具4001之各種實施例可提供用於列印頭管理系統中之部件的完全自動化更換,同時維持惰性、無粒子環境且幾乎不或不中斷列印製程。 雖然各種列印頭管理程序可以完全自動化模式進行,但是在可於與列印頭總成之管理有關的各種程序期間指示一定程度之終端使用者介入的情況下,終端使用者進入可經由例如使用手套套圈在外部進行。 After the procedure for retrieving the component, the procedure for replacing the component, or both have been completed, the gate 3752 of the load lock chamber 3750 can be closed and the load lock chamber 3750 can undergo recovery A procedure is performed to restore the gas environment of the chamber to the target specification. In view of the substantially small volume of the load lock chamber 3750 compared to the volume of the OLED print tool 4001, the recovery time is substantially shorter than the recovery time for the OLED print tool 4001. All steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process. In this regard, various embodiments of OLED printing tool 4001 can provide for fully automated replacement of components in a printhead management system while maintaining an inert, particle-free environment with little or no interruption in the printing process. While various printhead management programs can be performed in a fully automated mode, end user access can be via, for example, use, in the event that a certain level of end user intervention can be indicated during various procedures associated with the management of the printhead assembly. The glove ferrule is carried out on the outside.

諸如圖28C中以平面圖描繪的OLED列印工具4002之OLED 列印工具之各種實施例可具有輔助包體3550,該輔助包體可為負載鎖定腔室或可調式受控環境包體。輔助包體3550可具有第一閘3552及第二閘3554。列印系統包體3500可具有一體積或區域,其分別諸如第一列印系統包體總成區域3570及第二列印系統包體總成區域3572(亦參見圖26C)。對於OLED列印工具4002之各種實施例而言,圖28C之列印系統包體3500的體積或區域3570及3572可用來例如容納列印頭管理系統,諸如圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A。如圖28C中所描繪,對於OLED列印工具4002之各種實施例而言,體積或區域3570可用來容納列印頭管理系統2700以及處置器3530。對於圖28C之各種實施 例而言,列印頭管理系統2700及處置器3530可例如定位於列印系統包體總成區域3570中,其鄰近於X軸托架總成2300。列印頭總成2500可安裝於X軸托架總成2300(亦參見圖26C)上,該X軸托架總成支撐於橋接器2130上。列印頭總成2500可包括複數個列印頭裝置。處置器3530之各種實施例可具有各種端接器構型,例如叉型端接器、葉片型端接器、夾片型端接器以及夾鉗型端接器,該等端接器可選用於操縱列印頭管理系統之各種部件,諸如例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。 An OLED such as the OLED printing tool 4002 depicted in plan view in FIG. 28C Various embodiments of the printing tool can have an auxiliary package 3550, which can be a load lock chamber or an adjustable controlled environment package. The auxiliary package 3550 can have a first gate 3552 and a second gate 3554. The print system package 3500 can have a volume or area such as a first print system package assembly area 3570 and a second print system package assembly area 3572, respectively (see also Figure 26C). For various embodiments of the OLED printing tool 4002, the volume or regions 3570 and 3572 of the printing system package 3500 of Figure 28C can be used, for example, to accommodate a printhead management system, such as the printhead management of Figures 20B and 23. System 2701 and print head management system 2701A of Figure 24A. As depicted in FIG. 28C, for various embodiments of the OLED printing tool 4002, a volume or region 3570 can be used to house the printhead management system 2700 and the handler 3530. For the various implementations of Figure 28C For example, printhead management system 2700 and handler 3530 can be positioned, for example, in print system package assembly area 3570 adjacent to X-axis carriage assembly 2300. The printhead assembly 2500 can be mounted to an X-axis bracket assembly 2300 (see also FIG. 26C) that is supported on the bridge 2130. The printhead assembly 2500 can include a plurality of printhead devices. Various embodiments of the handler 3530 can have various terminator configurations, such as fork-type terminators, blade-type terminators, clip-type terminators, and clamp-type terminators, which can be used with the terminators The various components of the printhead management system are manipulated, such as, for example, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device.

關於列印頭更換,對於OLED列印工具4002之各種實施例 而言,置器3530可例如自安裝於X軸托架總成2300上之列印頭總成2500取回需要更換的部件,例如列印頭或列印頭裝置。在後一步驟中,處置器3530可例如自列印頭管理系統2700取回更換部件。一旦已取回更換部件,處置器3530隨後可將諸如列印頭裝置或列印頭之更換部件插入列印頭總成2500中以便完成列印頭更換程序。此外,對於圖28C之OLED列印工具4002的各種實施例而言,輔助包體3550可用來儲存及轉移本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。儲存於輔助包體3550中之列印頭管理系統2700的各種更換部件可藉由處置器3530接取且移動至列印頭管理系統2700,該等更換部件例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。相反地,例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置的需要更換之部件可藉由處置器3730自列印頭管理系統2700移除且置放於輔助包體3550中。在列印頭管理程序之各種實施例中,諸如列印頭裝置或列印頭之部件可藉由處置 器3530自輔助包體3550移除且插入列印頭總成2500中。可打開輔助包體3550之閘3552,同時閉合閘3554,以便自輔助包體3550取回或移除部件,且將更換部件轉移至輔助包體3550可藉由處置器或位於OLED列印工具4002外部處於周圍空氣中的終端使用者來進行。 Various embodiments of the OLED printing tool 4002 with respect to print head replacement In other words, the applicator 3530 can retrieve components that need to be replaced, such as a printhead or printhead device, from, for example, the printhead assembly 2500 mounted on the X-axis carriage assembly 2300. In the latter step, the handler 3530 can retrieve the replacement component, for example, from the printhead management system 2700. Once the replacement component has been retrieved, the handler 3530 can then insert a replacement component, such as a printhead device or printhead, into the printhead assembly 2500 to complete the printhead replacement procedure. In addition, for various embodiments of the OLED printing tool 4002 of FIG. 28C, the auxiliary package 3550 can be used to store and transfer various components of the subsystems and modules of various embodiments of the printhead management system of the present teachings. The various replacement components of the printhead management system 2700 stored in the auxiliary package 3550 can be accessed by the handler 3530 and moved to the printhead management system 2700, such as but not limited to a blotter cartridge, Ink cartridges, waste reservoirs, printheads, and printhead devices. Conversely, components that need to be replaced, such as, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, a printhead, and a printhead device, may be removed from the printhead management system 2700 by the handler 3730 and Placed in the auxiliary package 3550. In various embodiments of the printhead management program, components such as printhead devices or printheads can be disposed of by The device 3530 is removed from the auxiliary package 3550 and inserted into the printhead assembly 2500. The gate 3552 of the auxiliary package 3550 can be opened while the gate 3554 is closed to retrieve or remove the component from the auxiliary package 3550, and the transfer of the replacement component to the auxiliary package 3550 can be by the handler or located in the OLED printing tool 4002. The external user is in the surrounding air.

在用於取回部件之程序、用於更換部件之程序或兩者已完成 之後,可閉合輔助包體3550之閘3552,且輔助包體3550可經歷恢復程序來將該輔助包體之氣體環境復原至目標規範。鑒於輔助包體3550相較於OLED列印工具4002之體積而言大體上小的體積,恢復時間比用於OLED列印工具4002之恢復時間大體上短。可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。就該方面而言,OLED列印工具4002之各種實施例可提供用於列印頭管理系統中之部件的完全自動化更換,同時維持惰性、無粒子環境且幾乎不或不中斷列印製程。雖然各種列印頭管理程序可以完全自動化模式進行,但是在可於與列印頭總成之管理有關的各種程序期間指示一定程度之終端使用者介入的情況下,終端使用者進入可經由例如使用手套套圈在外部進行。 The procedure for retrieving parts, the procedure for replacing parts, or both have been completed Thereafter, the gate 3552 of the auxiliary package 3550 can be closed, and the auxiliary package 3550 can undergo a recovery procedure to restore the gaseous environment of the auxiliary package to the target specification. In view of the substantially small volume of the auxiliary package 3550 compared to the volume of the OLED printing tool 4002, the recovery time is substantially shorter than the recovery time for the OLED printing tool 4002. All steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process. In this regard, various embodiments of OLED printing tool 4002 can provide for fully automated replacement of components in a printhead management system while maintaining an inert, particle-free environment with little or no interruption in the printing process. While various printhead management programs can be performed in a fully automated mode, end user access can be via, for example, use, in the event that a certain level of end user intervention can be indicated during various procedures associated with the management of the printhead assembly. The glove ferrule is carried out on the outside.

圖29A至圖29C描繪用於以完全自動化模式或遠程操作員 輔助模式進行列印頭管理之列印系統及方法的各種實施例,其幾乎不或不中斷持續不斷進行的製程,同時維持列印系統包體1102中的惰性、大體上無粒子製程環境。對於可於圖29A至圖29C之氣體包體系統506中執行的 各種列印頭管理程序而言,輔助包體1010可維持於用於受控環境的與列印系統包體1102之受控環境相同的規範下。圖29A至29C之氣體包體系統506的各種實施例可併入OLED列印工具中,諸如併入圖26A之OLED列印工具4000及圖28A之OLED列印工具4001中。 29A-29C depicting for use in a fully automated mode or remote operator The auxiliary mode performs various embodiments of the printhead management printing system and method that hardly or uninterrupted the ongoing process while maintaining an inert, substantially particle-free process environment in the printing system package 1102. For execution in the gas inclusion system 506 of Figures 29A-29C For various printhead management programs, the auxiliary package 1010 can be maintained under the same specifications as the controlled environment of the printing system package 1102 for a controlled environment. Various embodiments of the gas inclusion system 506 of Figures 29A through 29C can be incorporated into an OLED printing tool, such as the OLED printing tool 4000 of Figure 26A and the OLED printing tool 4001 of Figure 28A.

圖29A至圖29C描繪氣體包體系統506,該氣體包體系統可 包括列印系統包體1102及列印系統2002,該列印系統可具有列印頭總成2500。列印系統包體1102可為任何氣體包體,其中列印系統2002可容納及維持於目標受控環境中。列印系統包體1102可具有一受控環境,該受控環境可包括用於反應性物種(諸如水蒸氣及氧)之目標規範以及用於微粒物質之目標規範。列印系統包體1102可例如但不限於如對圖1、圖3、圖15、圖18以及圖19所述之氣體包體總成中之任何者。如先前所述,列印系統2002可為任何列印系統,其例如但不限於包括圖20B及圖27之非限制性實例。列印頭總成2500可具有至少一個列印頭。如先前所述,列印頭管理系統2700可為任何列印頭管理系統,其例如但不限於包括圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A的非限制性實例。 29A-29C depict a gas enclosure system 506 that can be A printing system enclosure 1102 and a printing system 2002 are included, which may have a printhead assembly 2500. The printing system enclosure 1102 can be any gas enclosure in which the printing system 2002 can be housed and maintained in a target controlled environment. The printing system enclosure 1102 can have a controlled environment that can include target specifications for reactive species such as water vapor and oxygen as well as target specifications for particulate matter. The printing system package 1102 can be, for example but not limited to, any of the gas inclusion assemblies as described with respect to Figures 1, 3, 15, 18, and 19. As previously described, the printing system 2002 can be any printing system such as, but not limited to, a non-limiting example including FIGS. 20B and 27. The printhead assembly 2500 can have at least one printhead. As previously described, the printhead management system 2700 can be any printhead management system such as, but not limited to, a printhead management system 2701 comprising the printhead management system 2701 of Figures 20B and 23 and a printhead management system 2701A of Figure 24A. A restrictive example.

圖29A至圖29C之輔助包體1010可具有第一閘1012及第二 閘1014,該第一閘及第二閘在正常操作期間可保持閉合。對於氣體包體系統506之各種實施例而言,圖29A至圖29C中所描繪之輔助包體1010可為負載鎖定腔室。對於氣體包體系統506之各種實施例而言,圖29A至圖29C中所描繪之輔助包體1010可為硬壁可調式受控環境包體。在氣體包體系統506之其他實施例中,圖29A至圖29C中所描繪之輔助包體1010可為轉移腔室。對於氣體包體總成506之各種實施例而言,輔助包體之受控環境可 包括用於反應性物種(諸如水蒸氣及氧)以及各種有機蒸氣之目標規範以及用於微粒物質之目標規範。在圖29A至圖29C之氣體包體506的各種實施例中,可將輔助包體1010維持至與維持列印系統包體1102相同的環境規範。對於圖29A至圖29C之氣體包體506的各種實施例而言,可將輔助包體1010及列印系統包體1102維持至不同的環境規範。圖29A及圖29B之氣體包體系統506可具有處置器3830,該處置器經定位用於實施與列印頭管理程序相關聯的任務。處置器3830可具有安裝至臂3834的端接器3836。 可使用端接器構型之各種實施例,例如葉片型端接器、夾片型端接器以及夾鉗型端接器。端接器之各種實施例可包括機械抓握及夾緊總成,以及氣動或真空輔助總成來致動端接器之各部分或以其他方式保持列印頭管理系統之各種部件,諸如例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。 The auxiliary package 1010 of FIGS. 29A to 29C may have a first gate 1012 and a second Gate 1014, the first and second gates may remain closed during normal operation. For various embodiments of the gas inclusion system 506, the auxiliary package 1010 depicted in Figures 29A-29C can be a load lock chamber. For various embodiments of the gas inclusion system 506, the auxiliary package 1010 depicted in Figures 29A-29C can be a hard wall adjustable controlled environmental enclosure. In other embodiments of the gas inclusion system 506, the auxiliary package 1010 depicted in Figures 29A-29C can be a transfer chamber. For various embodiments of the gas inclusion assembly 506, the controlled environment of the auxiliary package can be Target specifications for reactive species such as water vapor and oxygen, as well as various organic vapors, and target specifications for particulate matter are included. In various embodiments of the gas enclosure 506 of FIGS. 29A-29C, the auxiliary enclosure 1010 can be maintained to the same environmental specifications as the print system enclosure 1102. For the various embodiments of the gas enclosure 506 of Figures 29A-29C, the auxiliary package 1010 and the printing system package 1102 can be maintained to different environmental specifications. The gas enclosure system 506 of Figures 29A and 29B can have a handler 3830 that is positioned to perform the tasks associated with the printhead management program. The handler 3830 can have a terminator 3836 that is mounted to the arm 3834. Various embodiments of the terminator configuration can be used, such as blade type terminators, clip type terminators, and clamp type terminators. Various embodiments of the terminator can include a mechanical grip and clamping assembly, and a pneumatic or vacuum assist assembly to actuate portions of the terminator or otherwise retain various components of the printhead management system, such as, for example, However, it is not limited to a blotter cartridge, an ink cartridge, a waste reservoir, a print head, and a print head device.

關於列印頭更換,圖29A之處置器3830可鄰近於列印系統 2002之列印頭總成2500及列印頭管理系統2700定位。在用於列印頭更換之程序期間,處置器3830可自列印頭總成2500移除目標部件;該目標部件為列印頭或具有至少一個列印頭之列印頭裝置。在用於圖29A之氣體包體系統506的列印頭更換的各種程序中,經移除之部件可置放於列印頭管理系統2700中以供稍後取回。對於自列印系統包體1102移除一經移除之部件而言,可打開第二閘1024,同時將第一閘1012保持閉合,以便處置器3830可將已經移除之部件置放於輔助包體1010中。在後一步驟中,處置器3830可自列印頭管理系統2700取回更換部件。或者,處置器3830可自輔助包體1010取回更換部件。一旦已取回更換部件,處置器3830隨後可將諸如列印 頭裝置或列印頭之更換部件插入列印頭總成中以便完成列印頭更換程序。在完成部件於列印系統包體1102與輔助包體1010之間的移動之後,可閉合閘1014,以便列印系統包體1102可與輔助包體1010隔離。可打開閘1012且可藉由來源(處置器或終端使用者)取回置放於輔助包體1010中的經移除之部件,且可將額外功能部件(更換列印頭或更換列印頭裝置)置放於輔助包體1010中以用於後一列印頭交換程序。最終,在閉合閘1012之後,輔助包體1010可經歷恢復程序,以便達到用於反應性物種(諸如水蒸氣及氧)之目標規範以及用於微粒物質之目標規範,以便當需要時可起始後一列印頭更換程序。在氣體包體系統506之各種實施例中,輔助包體1010可具有與列印系統包體1102相同的用於受控環境之規範。對於圖29A之氣體包體系統506的各種實施例而言,輔助包體1010可具有與列印系統包體1102不同的用於受控環境之規範。 Regarding print head replacement, the handler 3830 of Figure 29A can be adjacent to the printing system In 2002, the head assembly 2500 and the print head management system 2700 were positioned. During the process for printhead replacement, the handler 3830 can remove the target component from the printhead assembly 2500; the target component is a printhead or a printhead device having at least one printhead. In various procedures for printhead replacement for the gas enclosure system 506 of Figure 29A, the removed components can be placed in the printhead management system 2700 for later retrieval. For removing the removed component from the printing system package 1102, the second gate 1024 can be opened while the first gate 1012 remains closed so that the handler 3830 can place the removed component in the auxiliary package. In body 1010. In the latter step, the handler 3830 can retrieve the replacement component from the printhead management system 2700. Alternatively, the handler 3830 can retrieve the replacement component from the auxiliary package 1010. Once the replacement component has been retrieved, the handler 3830 can then print such as A replacement component of the head unit or printhead is inserted into the printhead assembly to complete the printhead replacement procedure. After completing the movement of the component between the printing system package 1102 and the auxiliary package 1010, the gate 1014 can be closed so that the printing system package 1102 can be isolated from the auxiliary package 1010. The gate 1012 can be opened and the removed component placed in the auxiliary package 1010 can be retrieved by the source (handler or end user) and additional features can be replaced (replacement of the print head or replacement of the print) The head unit) is placed in the auxiliary package 1010 for use in the subsequent print head exchange program. Finally, after closing gate 1012, auxiliary enclosure 1010 can undergo a recovery procedure to achieve target specifications for reactive species (such as water vapor and oxygen) and target specifications for particulate matter to initiate when needed The latter print head replacement program. In various embodiments of the gas inclusion system 506, the auxiliary package 1010 can have the same specifications for the controlled environment as the printing system package 1102. For various embodiments of the gas enclosure system 506 of FIG. 29A, the auxiliary package 1010 can have a different specification for the controlled environment than the printing system package 1102.

對於圖29B之氣體包體系統506而言,處置器3830可定位於輔助包體1010中,以便處置器3830之端接器3836可容易到達列印系統之列印頭總成2500以及列印頭管理系統2700。 For the gas enclosure system 506 of Figure 29B, the handler 3830 can be positioned in the auxiliary package 1010 such that the terminator 3836 of the handler 3830 can easily reach the printhead assembly 2500 of the printing system and the printhead Management system 2700.

關於用於圖29B之氣體包體系統506的列印頭更換之程序,可打開第二閘1014,同時將閘1012保持閉合,以便處置器3830可自列印系統2002之列印頭總成2500移除目標部件;該目標部件為列印頭或具有至少一個列印頭之列印頭裝置。在用於圖29B之氣體包體系統506的列印頭更換之各種程序中,經移除之部件可置放於列印頭管理系統2700中以供稍後取回。對於自列印系統包體1102移除一經移除之部件而言,可打開第二閘1014,同時將閘1012保持閉合,以便處置器3830可將已經移除之部件置放 於輔助包體1010中。在後一步驟中,處置器3830可自列印頭管理系統2700取回更換部件。或者,處置器3830可自輔助包體1010取回更換部件。一旦已取回更換部件,處置器3830隨後可將諸如列印頭裝置或列印頭之更換部件插入列印頭總成中以便完成列印頭更換程序。在經移除之部件處於輔助包體1010中之後,即已將更換部件插入列印系統包體1102之列印頭總成2500中,且處置器3830處於輔助包體1010內,並且可閉合閘1014,以便列印系統包體1102可與輔助包體1010隔離。在更換部件已插入列印頭總成中及閘1014已閉合之後的任何時間,可打開閘1012,且處置器3830可將經移除之部件置放至輔助包體1010外部的一位置,且可將額外功能部件(更換列印頭或更換列印頭裝置)置放於輔助包體1010中以用於後一列印頭交換程序。最終,輔助包體1010可經歷恢復程序,以便達到用於反應性物種(諸如水蒸氣及氧)之目標規範以及用於微粒物質之目標規範,以便當需要時可起始後一列印頭更換程序。在氣體包體系統506之各種實施例中,輔助包體1010可具有用於受控環境的與列印系統包體1102相同之規範。對於圖29B之氣體包體系統506的各種實施例而言,輔助包體1010可具有與列印系統包體1102不同的用於受控環境之規範。 With respect to the printhead replacement procedure for the gas enclosure system 506 of FIG. 29B, the second gate 1014 can be opened while the gate 1012 remains closed so that the handler 3830 can self-print the printhead assembly 2500 of the printing system 2002. The target component is removed; the target component is a printhead or a printhead device having at least one printhead. In various procedures for printhead replacement for the gas enclosure system 506 of Figure 29B, the removed components can be placed in the printhead management system 2700 for later retrieval. For removing the removed component from the printing system enclosure 1102, the second gate 1014 can be opened while the gate 1012 remains closed so that the handler 3830 can place the removed component In the auxiliary package 1010. In the latter step, the handler 3830 can retrieve the replacement component from the printhead management system 2700. Alternatively, the handler 3830 can retrieve the replacement component from the auxiliary package 1010. Once the replacement component has been retrieved, the handler 3830 can then insert a replacement component, such as a printhead device or printhead, into the printhead assembly to complete the printhead replacement procedure. After the removed component is in the auxiliary package 1010, the replacement component has been inserted into the printhead assembly 2500 of the printing system package 1102, and the handler 3830 is within the auxiliary package 1010 and the brake can be closed. 1014, so that the printing system package 1102 can be isolated from the auxiliary package 1010. At any time after the replacement component has been inserted into the printhead assembly and the gate 1014 has been closed, the gate 1012 can be opened and the handler 3830 can place the removed component to a position external to the auxiliary package 1010. Additional features (replacement of the printhead or replacement of the printhead device) can be placed in the auxiliary package 1010 for use in the subsequent print head exchange program. Finally, the auxiliary package 1010 can undergo a recovery procedure to achieve target specifications for reactive species such as water vapor and oxygen as well as target specifications for particulate matter to initiate a subsequent print head replacement procedure when needed. . In various embodiments of the gas inclusion system 506, the auxiliary package 1010 can have the same specifications as the printing system package 1102 for a controlled environment. For various embodiments of the gas enclosure system 506 of Figure 29B, the auxiliary package 1010 can have a different specification for the controlled environment than the printing system package 1102.

此外,對於圖29A及圖29B之氣體包體系統506的各種實 施例而言,輔助包體1010可用來儲存及轉移本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。儲存於輔助包體1010中之列印頭管理系統2700的各種更換部件可藉由處置器3830接取且經由閘1014移動至列印頭管理系統2700,同時閉合閘1012來維持氣體包體系統506中之惰性環境,該等更換部件例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、 列印頭以及列印頭裝置。相反地,需要更換的部件可藉由處置器3830經由閘1014來自列印頭管理系統2700移除,同時閉合閘1012且將經移除之部件置放於輔助包體1010中。在後一步驟中,可打開輔助包體1010之閘1012,同時閉合閘1014,以便自輔助包體3550取回或移除部件,且將更換部件轉移至輔助包體3550可藉由處置器或位於圖29A及圖29B之氣體包體系統506外部處於周圍空氣中的終端使用者來進行。 In addition, various implementations of the gas inclusion system 506 of Figures 29A and 29B By way of example, the auxiliary package 1010 can be used to store and transfer the various components of the subsystems and modules of various embodiments of the printhead management system of the present teachings. The various replacement components of the printhead management system 2700 stored in the auxiliary package 1010 can be accessed by the handler 3830 and moved to the printhead management system 2700 via the gate 1014 while the gate 1012 is closed to maintain the gas enclosure system 506. In an inert environment, such replacement components such as, but not limited to, blotter cartridges, ink cartridges, waste reservoirs, The print head and the print head device. Conversely, the components that need to be replaced can be removed from the printhead management system 2700 via the gate 1014 by the handler 3830 while the gate 1012 is closed and the removed components are placed in the auxiliary package 1010. In the latter step, the gate 1012 of the auxiliary package 1010 can be opened while the gate 1014 is closed to retrieve or remove the component from the auxiliary package 3550 and the replacement component can be transferred to the auxiliary package 3550 by means of a handler or The end user in the ambient air outside of the gas enclosure system 506 of Figures 29A and 29B is operated by the end user.

在用於取回部件之程序、用於更換部件之程序或兩者已完成 之後,可閉合輔助包體1010之閘1012,且輔助包體1010可經歷恢復程序來將該輔助包體之氣體環境復原至目標規範。鑒於輔助包體1010相較於圖29A及圖29B之氣體包體系統506之體積而言大體上小的體積,恢復時間比用於圖29A及圖29B之氣體包體系統506之恢復時間大體上短。可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。 就該方面而言,圖29A及圖29B之氣體包體系統506的各種實施例可提供用於列印頭管理系統中之部件的完全自動化更換,同時維持惰性、無粒子環境且幾乎不或不中斷列印製程。 The procedure for retrieving parts, the procedure for replacing parts, or both have been completed Thereafter, the gate 1012 of the auxiliary package 1010 can be closed, and the auxiliary package 1010 can undergo a recovery procedure to restore the gaseous environment of the auxiliary package to the target specification. In view of the substantially small volume of the auxiliary package 1010 compared to the volume of the gas inclusion system 506 of Figures 29A and 29B, the recovery time is substantially greater than the recovery time of the gas inclusion system 506 for Figures 29A and 29B. short. All steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air and water vapor and various organic vapors, as well as particulate contaminants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process. In this regard, various embodiments of the gas enclosure system 506 of Figures 29A and 29B can provide for fully automated replacement of components in a printhead management system while maintaining an inert, particle-free environment with little or no Interrupt the printing process.

在不脫離用於維持列印頭陣列之自動化製程的精神的情況下,可對用於圖29A及圖29B之各種實施例的列印頭更換程序做出變化。例如,在各種實施例中,當閉合輔助包體1010之閘1012且打開輔助包體1010之閘1014時,圖29A及圖29B之處置器3830可自列印頭總成2500移 除列印頭部件且將其置放於輔助包體1010中,該列印頭部件為列印頭或具有至少一個列印頭之列印頭裝置。在下一步驟中,如先前對圖29A及圖29B所述,當閉合輔助包體1010之閘1014時,可打開閘1012以允許自輔助包體1010取回經移除之部件且將更換部件置放於輔助包體1010中。一旦已取回經移除之部件且該更換部件位於輔助包體1010內,則可閉合閘1012,且輔助包體1010可經歷恢復程序以達到用於反應性物種(諸如水蒸氣及氧)之目標規範以及達到用於微粒物質之目標規範。一旦將輔助包體1010置於適當受控環境規範中,則可打開閘1014且可將更換部件插入列印頭總成中。當已將該更換部件插入列印頭總成中時,可閉合閘1014,以便列印系統包體1102可與輔助包體1010隔離。 Variations in the print head replacement procedure for the various embodiments of Figures 29A and 29B can be made without departing from the spirit of the automated process for maintaining the printhead array. For example, in various embodiments, when the gate 1012 of the auxiliary package 1010 is closed and the gate 1014 of the auxiliary package 1010 is opened, the handler 3830 of Figures 29A and 29B can be moved from the printhead assembly 2500. In addition to the print head component and placed in the auxiliary package 1010, the print head component is a printhead or a printhead device having at least one printhead. In the next step, as previously described with respect to Figures 29A and 29B, when the gate 1014 of the auxiliary package 1010 is closed, the gate 1012 can be opened to allow the removed component to be retrieved from the auxiliary package 1010 and the replacement component Placed in the auxiliary package 1010. Once the removed component has been retrieved and the replacement component is located within the auxiliary package 1010, the gate 1012 can be closed and the auxiliary package 1010 can undergo a recovery procedure to achieve for reactive species such as water vapor and oxygen. Target specifications and target specifications for particulate matter. Once the auxiliary package 1010 is placed in a suitably controlled environmental specification, the gate 1014 can be opened and the replacement component can be inserted into the printhead assembly. When the replacement component has been inserted into the printhead assembly, the gate 1014 can be closed so that the print system package 1102 can be isolated from the auxiliary package 1010.

在圖29C中,對於如圖29A及圖29B所述之列印頭更換程 序的各種實施例而言,終端使用者可經由在如由處置器經由各種手套套圈遠程地執行時所闡述之操縱來執行。儘管圖29C中展示兩個手套套圈,但是應瞭解的是,為達提供對各種位置(例如,如先前圖1中對氣體包體總成100所示之情況及如圖24B中所示之情況)之遠程進入的目的,手套套圈可置放於若干位置處。 In Fig. 29C, the print head replacement process as described in Figs. 29A and 29B For various embodiments of the sequence, the end user can be executed via manipulation as set forth when executed remotely by the handler via various glove ferrules. Although two glove ferrules are shown in Figure 29C, it will be appreciated that the various positions are provided for the various positions (e.g., as shown previously in Figure 1 for the gas enclosure assembly 100 and as shown in Figure 24B). Case) For the purpose of remote entry, the glove ferrule can be placed at several locations.

圖30A至圖30C描繪用於以完全自動化模式或遠程操作員 輔助模式進行列印頭管理之列印系統及方法的各種實施例,其幾乎不或不中斷持續不斷進行的製程,同時維持列印系統包體1102中的惰性、大體上無粒子製程環境。對於可於圖30A至圖30C之氣體包體系統507中執行的各種列印頭管理程序而言,輔助包體1020可維持於用於受控環境的與列印系統包體1102之受控環境不同的規範下,而不折衷列印系統包體1102之環 境的整體性。圖29A至29C之氣體包體系統506的各種實施例可併入OLED列印工具中,諸如併入圖26A之OLED列印工具4000及圖28A之OLED列印工具4001中。 30A to 30C depicting use in a fully automated mode or remote operator The auxiliary mode performs various embodiments of the printhead management printing system and method that hardly or uninterrupted the ongoing process while maintaining an inert, substantially particle-free process environment in the printing system package 1102. The auxiliary package 1020 can be maintained in a controlled environment with the printing system package 1102 for a controlled environment for various print head management programs that can be executed in the gas package system 507 of Figures 30A through 30C. Under different specifications, without compromise the printing system package 1102 ring The integrity of the environment. Various embodiments of the gas inclusion system 506 of Figures 29A through 29C can be incorporated into an OLED printing tool, such as the OLED printing tool 4000 of Figure 26A and the OLED printing tool 4001 of Figure 28A.

圖30A至圖30C描繪氣體包體系統507,該氣體包體系統可 包括列印系統包體1102及列印系統2002,該列印系統可具有列印頭總成2500。列印系統包體1102可為任何氣體包體,其中列印系統2002可容納及維持於目標受控環境中。列印系統包體1102可具有一受控環境,該受控環境可包括用於反應性物種(諸如水蒸氣及氧)之目標規範以及用於微粒物質之目標規範。列印系統包體1102可例如但不限於如對圖1、圖3、圖15、圖18以及圖19所描繪之氣體包體總成中之任何者。如本文先前所述,列印系統2002可為任何列印系統,其例如但不限於包括圖20B及圖27之非限制性實例。列印頭總成2500可具有至少一個列印頭。如先前所述,列印頭管理系統2700可為任何列印頭管理系統,其例如但不限於包括圖20B及圖23之列印頭管理系統2701及圖24A之列印頭管理系統2701A的非限制性實例。 30A-30C depict a gas inclusion system 507 that can be A printing system enclosure 1102 and a printing system 2002 are included, which may have a printhead assembly 2500. The printing system enclosure 1102 can be any gas enclosure in which the printing system 2002 can be housed and maintained in a target controlled environment. The printing system enclosure 1102 can have a controlled environment that can include target specifications for reactive species such as water vapor and oxygen as well as target specifications for particulate matter. The printing system package 1102 can be, for example but not limited to, any of the gas inclusion assemblies as depicted in Figures 1, 3, 15, 18, and 19. As previously described herein, the printing system 2002 can be any printing system such as, but not limited to, a non-limiting example including FIGS. 20B and 27. The printhead assembly 2500 can have at least one printhead. As previously described, the printhead management system 2700 can be any printhead management system such as, but not limited to, a printhead management system 2701 comprising the printhead management system 2701 of Figures 20B and 23 and a printhead management system 2701A of Figure 24A. A restrictive example.

圖30A至圖30C之輔助包體1020可具有開口1022及閘1024 以及導管1026,該導管可與惰性氣體源流體連通。在正常操作期間,輔助包體1020之閘1024可維持於閉合位置。對於氣體包體系統507之各種實施例而言,圖30A至圖30C中所描繪之輔助包體1020可為具有軟壁構造的可調式受控環境包體。對於氣體包體系統507之各種實施例而言,圖30A至圖30C中所描繪之輔助包體1020可為具有硬壁構造的可調式受控環境包體。在氣體包體系統507之其他實施例中,圖30A至圖30C中所描繪之輔助包體1020可為具有硬壁構造及軟壁構造之組合的可調式受控環境包體。 The auxiliary package 1020 of FIGS. 30A to 30C may have an opening 1022 and a gate 1024. And a conduit 1026 that is in fluid communication with an inert gas source. During normal operation, the gate 1024 of the auxiliary package 1020 can be maintained in the closed position. For various embodiments of the gas inclusion system 507, the auxiliary package 1020 depicted in Figures 30A-30C can be an adjustable controlled environmental enclosure having a soft wall configuration. For various embodiments of the gas inclusion system 507, the auxiliary package 1020 depicted in Figures 30A-30C can be an adjustable controlled environmental enclosure having a hard wall configuration. In other embodiments of the gas inclusion system 507, the auxiliary package 1020 depicted in Figures 30A-30C can be an adjustable controlled environmental enclosure having a combination of a hard wall configuration and a soft wall configuration.

對於氣體包體系統507之各種實施例而言,開口1022可為 一通道,例如但不限於具有固體材料之窗或門。在氣體包體系統507中之各種實施例中,開口1022可為可撓性門道,該門道可例如藉由具有可撓性聚合物片狀材料帶材之簾幕覆蓋,藉此提供進入及退出輔助包體1020的就緒通道。根據圖30A至圖30C之氣體包體系統507的各種實施例,如先前所論述,動態閉合件之各種實施例可用於有效地密封開口1022。對於輔助包體之各種實施例而言,開口1022可為一窗,該窗可藉由可撓性聚合物材料覆蓋,藉此提供材料進入及退出輔助包體1020的就緒通道。在輔助包體之各種實施例中,開口1022可為一通道,例如但不限於窗或門,除藉由可撓性聚合物材料覆蓋之外,該通道可具有一氣簾,以便用於將輔助包體與氣體包體系統507外部隔離。在輔助包體之各種實施例中,開口1022可為一通道,例如但不限於窗或門,該通道可具有一氣簾,以便用於將輔助包體與氣體包體系統507外部隔離。如隨後將更詳細地論述,除氣簾之外,可利用輔助包體1020與列印系統包體1102之間的壓力差來隔離具有開口1022之輔助包體1020。圖30A及圖30B之氣體包體系統507可具有處置器3830,該處置器經定位用於實施與列印頭管理程序相關聯的任務。處置器3830可具有安裝至臂3834的端接器3836。可使用端接器構型之各種實施例,例如葉片型端接器、夾片型端接器以及夾鉗型端接器。端接器之各種實施例可包括機械抓握及夾緊總成,以及氣動或真空輔助總成來致動端接器之各部分或以其他方式保持列印頭裝置或來自列印頭裝置之列印頭。 For various embodiments of the gas inclusion system 507, the opening 1022 can be A channel such as, but not limited to, a window or door having a solid material. In various embodiments in the gas enclosure system 507, the opening 1022 can be a flexible doorway that can be covered, for example, by a curtain having a strip of flexible polymeric sheet material to provide access and exit. The ready channel of the auxiliary package 1020. According to various embodiments of the gas enclosure system 507 of Figures 30A-C, various embodiments of the dynamic closure can be used to effectively seal the opening 1022, as previously discussed. For various embodiments of the auxiliary package, the opening 1022 can be a window that can be covered by a flexible polymeric material, thereby providing a ready passage for material to enter and exit the auxiliary package 1020. In various embodiments of the auxiliary package, the opening 1022 can be a channel such as, but not limited to, a window or a door, which can have an air curtain for use in assisting it, in addition to being covered by a flexible polymeric material. The inclusions are externally isolated from the gas inclusion system 507. In various embodiments of the auxiliary package, the opening 1022 can be a channel such as, but not limited to, a window or door that can have an air curtain for isolating the auxiliary package from the exterior of the gas enclosure system 507. As will be discussed in more detail later, in addition to the air curtain, the auxiliary package 1020 having the opening 1022 can be isolated using a pressure differential between the auxiliary package 1020 and the printing system package 1102. The gas enclosure system 507 of Figures 30A and 30B can have a handler 3830 that is positioned to perform the tasks associated with the printhead management program. The handler 3830 can have a terminator 3836 that is mounted to the arm 3834. Various embodiments of the terminator configuration can be used, such as blade type terminators, clip type terminators, and clamp type terminators. Various embodiments of the terminator can include a mechanical grip and clamping assembly, and a pneumatic or vacuum assist assembly to actuate portions of the terminator or otherwise hold the printhead device or from the printhead device Print the head.

如圖30A至圖30C所指示,輔助包體1020之導管1026可與 惰性氣體源流體連通,從而對於圖30A之氣體包體系統507的各種實施例 而言,可將輔助包體1020維持至用於反應性物種(諸如氧及水蒸氣)以及有機溶劑蒸氣之目標規範,該規範與列印系統包體1102之規範相同。在圖30A之氣體包體系統507的各種實施例中,輔助包體1020之氣體環境可維持於用於反應性物種(諸如氧及水蒸氣)以及有機溶劑蒸氣之目標規範下,該規範不同於列印系統包體1102之規範。根據氣體包體系統507之各種實施例,可過濾惰性氣體源中的微粒物質。回顧而言,氣體包體總成可維持於大氣壓之上的壓力下。應涵蓋的是,例如在各種列印頭管理程序之各種製程步驟期間,輔助包體1020之壓力可保持於大氣壓值之上且低於列印系統包體1102壓力值的一值下,以便阻滯或防止氣體自輔助包體1020擴散至列印系統包體1102。就該方面而言,對於圖30A至圖30C之氣體包體系統507的各種實施例而言,輔助包體1020之用於反應性物種(諸如水蒸氣及氧)之目標規範以及用於微粒物質之目標規範可不與用於列印系統包體1102之彼等目標規範一樣嚴格。 As indicated in Figures 30A-30C, the catheter 1026 of the auxiliary package 1020 can be The inert gas source is in fluid communication such that various embodiments of the gas inclusion system 507 of FIG. 30A In other words, the auxiliary package 1020 can be maintained to a target specification for reactive species such as oxygen and water vapor, as well as organic solvent vapors, which is the same as the specification for the printing system package 1102. In various embodiments of the gas inclusion system 507 of Figure 30A, the gaseous environment of the auxiliary inclusion 1020 can be maintained under target specifications for reactive species such as oxygen and water vapor and organic solvent vapors, which is different from the specification. Print the specification of the system package 1102. According to various embodiments of the gas inclusion system 507, particulate matter in the source of inert gas can be filtered. In retrospect, the gas inclusion body can be maintained at a pressure above atmospheric pressure. It should be noted that, for example, during various process steps of various print head management procedures, the pressure of the auxiliary package 1020 can be maintained above the atmospheric pressure value and below a value of the pressure value of the printing system package 1102 to The stagnation or prevention of gas diffuses from the auxiliary package 1020 to the printing system package 1102. In this regard, for various embodiments of the gas inclusion system 507 of Figures 30A-C, the target specification for the auxiliary inclusions 1020 for reactive species, such as water vapor and oxygen, and for particulate matter The target specifications may not be as stringent as their target specifications for printing system package 1102.

關於列印頭更換,圖30A之處置器3830可鄰近於列印系統 2002之列印頭總成2500及列印頭管理系統2700定位。在用於交換列印頭之程序期間,處置器3830可自列印頭總成2500移除目標部件;該目標部件為列印頭或具有至少一個列印頭之列印頭裝置。在用於圖30A之氣體包體系統576的列印頭更換之各種程序中,經移除之部件可置放於列印頭管理系統2700中以供稍後取回。對於自列印系統包體1102移除一經移除之部件而言,可打開閘1024,以便處置器3830可將已移除之部件置放於輔助包體1020中。當打開閘1024時,可如先前所述使用動態閉合件之各種實施例來密封開口1022。在後一步驟中,處置器3830可自列印頭管理系統2700取回更換 部件。或者,處置器3830可自輔助包體1020取回更換部件。一旦已取回更換部件,處置器3830隨後可將諸如列印頭裝置或列印頭之更換部件插入列印頭總成中以便完成列印頭更換程序。在完成部件於列印系統包體1102與輔助包體1010之間的移動之後,可閉合閘1024,以便列印系統包體1102可與輔助包體1020隔離。對於氣體包體系統507之各種實施例而言,可將處置器於列印系統包體1102與輔助包體1010之間移動部件的過渡時間最小化,以便結合維持於列印系統包體1102中相對於輔助包體1020之惰性氣體環境的壓力之正壓力,在列印頭更換程序期間,可擴散入列印系統包體中之任何反應性物種及微粒物質可容易藉由氣體純化系統及氣體循環及過濾系統移除。另外,如先前所論述,可將氣簾與開口1020結合使用,以便將輔助包體與氣體包體系統506外部隔離。置放於輔助包體1020中的經移除之部件可藉由定位於輔助包體1020外部的來源(處置器或終端使用者)來取回,且額外功能部件(更換列印頭或更換列印頭裝置)可置放於輔助包體1020中以用於後一列印頭交換程序。 Regarding the print head replacement, the handler 3830 of Figure 30A can be adjacent to the printing system In 2002, the head assembly 2500 and the print head management system 2700 were positioned. During the process for swapping the printheads, the handler 3830 can remove the target component from the printhead assembly 2500; the target component is a printhead or a printhead device having at least one printhead. In various procedures for printhead replacement for the gas package system 576 of Figure 30A, the removed components can be placed in the printhead management system 2700 for later retrieval. For removal of a removed component from the printing system enclosure 1102, the gate 1024 can be opened so that the handler 3830 can place the removed component in the auxiliary enclosure 1020. When the gate 1024 is opened, the various openings of the dynamic closure can be used to seal the opening 1022 as previously described. In the latter step, the handler 3830 can be retrieved from the printhead management system 2700 for replacement. component. Alternatively, the handler 3830 can retrieve the replacement component from the auxiliary package 1020. Once the replacement component has been retrieved, the handler 3830 can then insert a replacement component, such as a printhead device or printhead, into the printhead assembly to complete the printhead replacement procedure. After completing the movement of the component between the printing system package 1102 and the auxiliary package 1010, the gate 1024 can be closed so that the printing system package 1102 can be isolated from the auxiliary package 1020. For various embodiments of the gas inclusion system 507, the transition time of the moving component of the handler between the printing system enclosure 1102 and the auxiliary enclosure 1010 can be minimized for integration in the printing system enclosure 1102. Relative to the positive pressure of the inert gas environment of the auxiliary package 1020, any reactive species and particulate matter that can diffuse into the printing system package during the printhead replacement process can be easily utilized by gas purification systems and gases. The circulation and filtration system is removed. Additionally, as previously discussed, the air curtain can be used in conjunction with the opening 1020 to isolate the auxiliary enclosure from the exterior of the gas enclosure system 506. The removed components placed in the auxiliary enclosure 1020 can be retrieved by a source (handler or end user) positioned external to the auxiliary enclosure 1020, and additional features (replacement of the printhead or replacement column) The print head device can be placed in the auxiliary package 1020 for use in the subsequent print head exchange program.

對於圖30B之氣體包體系統507而言,處置器3500可定位 於輔助包體1020中,以便處置器3830之端接器3836可容易到達列印系統之列印頭總成2500以及列印頭管理系統2700。 For the gas enclosure system 507 of Figure 30B, the handler 3500 can be positioned In the auxiliary package 1020, the terminator 3836 of the handler 3830 can easily reach the printhead assembly 2500 of the printing system and the printhead management system 2700.

關於用於圖30B之氣體包體系統507的列印頭更換之程序, 可打開閘1024,以便處置器3830可自列印系統2002之列印頭總成2500移除目標部件且將經移除之部件置放於輔助包體1020中;該目標部件為列印頭或具有至少一個列印頭之列印頭裝置。如先前所論述,開口1024可使用結構閉合件之各種實施例來封閉或使用動態閉合件之各種實施例有效地密 封。處置器3830可自輔助包體1020取回更換部件,且將該更換部件插入列印系統2002之列印頭總成2500中以便完成更換程序。一旦已將該更換部件插入列印頭總成2500中且處置器3830位於輔助包體1020內,則可閉合閘1024,以便列印系統包體1102可與輔助包體1020隔離。在已完成更換程序之後的任何時間,處置器3830可將經移除之部件經由開口1022定位於輔助包體1010外部的一位置,且可將額外功能部件(更換列印頭或更換列印頭裝置)置放於輔助包體1020中以用於後一列印頭交換程序。 Regarding the procedure for replacing the print head of the gas inclusion system 507 of FIG. 30B, The gate 1024 can be opened so that the handler 3830 can remove the target component from the printhead assembly 2500 of the printing system 2002 and place the removed component in the auxiliary package 1020; the target component is the printhead Or a printhead device having at least one printhead. As previously discussed, the opening 1024 can be effectively closed using various embodiments of the structural closure to seal or use various embodiments of the dynamic closure. seal. The handler 3830 can retrieve the replacement component from the auxiliary package 1020 and insert the replacement component into the printhead assembly 2500 of the printing system 2002 to complete the replacement process. Once the replacement component has been inserted into the printhead assembly 2500 and the handler 3830 is within the auxiliary package 1020, the gate 1024 can be closed so that the print system package 1102 can be isolated from the auxiliary package 1020. At any time after the replacement procedure has been completed, the handler 3830 can position the removed component via the opening 1022 to a location external to the auxiliary enclosure 1010, and can add additional features (replace the printhead or replace the printhead) The device) is placed in the auxiliary package 1020 for use in the subsequent print head exchange program.

此外,對於圖30A及圖30B之氣體包體系統506的各種實 施例而言,輔助包體1010可用來儲存及轉移本教示內容之列印頭管理系統的各種實施例之子系統及模組的各種部件。儲存於輔助包體1020中之列印頭管理系統2700的各種更換部件可藉由處置器3830接取且經由閘1024移動至列印頭管理系統2700,同時開口1022可使用結構閉合件之各種實施例來封閉或使用動態閉合件之各種實施例有效地密封,以便維持氣體包體系統507中之惰性環境,該等更換部件例如但不限於吸墨紙匣筒、油墨匣筒、廢料儲器、列印頭以及列印頭裝置。相反地,需要更換的部件可藉由處置器3830經由閘1024來自列印頭管理系統2700移除,同時開口1022可使用結構閉合件之各種實施例來封閉或使用動態閉合件之各種實施例有效地密封,且將該經移除之部件置放於輔助包體1020中。在後一步驟中,當閉合閘1024時,自輔助包體3550取回或移除部件,以及將更換部件轉移至輔助包體3550可藉由處置器或位於圖30A及圖30B之氣體包體系統506外部處於周圍空氣中的終端使用者來進行。可進行與列印頭管理程序相關聯之所有步驟來消除或最小化列印系統包體對污染物之暴露,該污染物諸如空氣 及水蒸氣及各種有機蒸氣,以及微粒污染物。根據本教示內容之各種系統及方法,列印系統包體可經引入達到充分低的污染程度,以便純化系統可在污染物可影響列印製程之前將該污染物移除。就該方面而言,圖30A及圖30B之氣體包體系統507的各種實施例可提供用於列印頭管理系統中之部件的完全自動化更換,同時維持惰性、無粒子環境且幾乎不或不中斷列印製程。 In addition, various embodiments of the gas inclusion system 506 of FIGS. 30A and 30B By way of example, the auxiliary package 1010 can be used to store and transfer the various components of the subsystems and modules of various embodiments of the printhead management system of the present teachings. The various replacement components of the printhead management system 2700 stored in the auxiliary package 1020 can be accessed by the handler 3830 and moved to the printhead management system 2700 via the gate 1024, while the opening 1022 can utilize various implementations of the structural closure. Various embodiments for closing or using dynamic closures are effectively sealed to maintain an inert environment in the gas enclosure system 507, such as, but not limited to, a blotter cartridge, an ink cartridge, a waste reservoir, The print head and the print head device. Conversely, the components that need to be replaced can be removed from the printhead management system 2700 by the handler 3830 via the gate 1024, while the openings 1022 can be closed using various embodiments of the structural closure or various embodiments of the dynamic closure are effective. The ground is sealed and the removed component is placed in the auxiliary package 1020. In the latter step, when the gate 1024 is closed, the component is retrieved or removed from the auxiliary package 3550, and the replacement component is transferred to the auxiliary package 3550 by the handler or the gas enclosure of Figures 30A and 30B. The system 506 is external to the end user in the ambient air. All steps associated with the printhead management program can be performed to eliminate or minimize exposure of the printing system package to contaminants such as air And water vapor and various organic vapors, as well as particulate pollutants. In accordance with various systems and methods of the present teachings, the printing system enclosure can be introduced to achieve a sufficiently low level of contamination so that the purification system can remove contaminants before they can affect the printing process. In this regard, various embodiments of the gas enclosure system 507 of Figures 30A and 30B can provide for fully automated replacement of components in a printhead management system while maintaining an inert, particle-free environment with little or no Interrupt the printing process.

在圖30C中,對於如對圖30A及圖30B所述之列印頭更換 程序的各種實施例而言,終端使用者可經由在如由處置器經由各種手套套圈遠程地執行時所闡述之操縱來執行。儘管圖30C中展示兩個手套套圈,但是應瞭解的是,為達提供對各種位置(例如,如先前圖1中對氣體包體總成100所示之情況及如圖24B中所示之情況)之遠程進入的目的,手套套圈可置放於若干位置處。 In Figure 30C, the print head replacement as described with respect to Figures 30A and 30B For various embodiments of the procedure, the end user can be executed via manipulation as set forth when executed remotely by the handler via various glove ferrules. Although two glove ferrules are shown in Figure 30C, it will be appreciated that the various positions are provided for the various positions (e.g., as previously shown for gas inclusion assembly 100 in Figure 1 and as shown in Figure 24B). Case) For the purpose of remote entry, the glove ferrule can be placed at several locations.

本說明書中所提及之所有出版物、專利以及專利申請案均以 引用方式併入本文,以達到與每一個別出版物、專利或專利申請案具體地及個別地經指示以引用方式併入相同之程度。 All publications, patents, and patent applications mentioned in this specification are The citations are incorporated herein by reference to the extent of the extent of the disclosure of the disclosure of each of the disclosures of

雖然本文已展示且描述本揭露內容之實施例,但是對於熟習該項技術者將顯而易見的是,此等實施例僅以舉例說明方式來提供。在不脫離本揭露內容的情況下,熟習該項技術者現將思及眾多變化、改變以及替代。應瞭解的是,可使用本文所述之揭露內容的實施例的各種替代例來實踐本揭露內容。以下申請專利範圍意欲界定本揭露內容之範疇,且屬於此等申請專利範圍及其等效者之範疇內的方法及結構欲由申請專利範圍涵蓋。 Although the embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that these embodiments are provided by way of illustration only. Those skilled in the art will now be aware of numerous changes, modifications, and substitutions without departing from the disclosure. It should be appreciated that the present disclosure may be practiced with various alternatives to the embodiments disclosed herein. The following claims are intended to define the scope of the disclosure, and the methods and structures falling within the scope of the claims and their equivalents are intended to be covered by the claims.

Claims (30)

一種氣體包體系統,其包含:一氣體包體,其包含:一列印系統包體,其界定一第一體積;一輔助包體,其界定一第二體積;其中該氣體包體具有允許進入該列印系統包體與該輔助包體之間的一第一可密封開口及允許自該氣體包體外部進入該輔助包體之一第二可密封開口;一工業列印系統,其容納在該列印系統包體內,該工業列印系統包含:一列印頭總成,其包含至少一個列印頭裝置;一基板支撐設備,其用於支撐一基板;以及一運動系統,其用於相對於該基板來相對地定位該列印頭總成;以及一處置器,其位於該氣體包體中,其中該處置器之位置鄰近該第一開口以允許該處置器執行需要於該列印系統包體與該輔助包體之間移動之操作。 A gas inclusion system comprising: a gas inclusion comprising: a printing system package defining a first volume; an auxiliary package defining a second volume; wherein the gas inclusion has an allowable entry a first sealable opening between the printing system package and the auxiliary package and a second sealable opening allowing access to the auxiliary package from the outside of the gas package; an industrial printing system, which is housed in The printing system package includes: a print head assembly including at least one print head device; a substrate support device for supporting a substrate; and a motion system for relative Positioning the printhead assembly relative to the substrate; and a handler positioned in the gas enclosure, wherein the handler is positioned adjacent the first opening to allow the handler to perform the printing system required The operation of moving between the package and the auxiliary package. 如申請專利範圍第1項之氣體包體系統,其中將該列印系統包體之該第一體積維持為一惰性氣體環境。 The gas inclusion system of claim 1, wherein the first volume of the printing system package is maintained in an inert gas environment. 如申請專利範圍第2項之氣體包體系統,其中該第一體積之該惰性氣體環境係使用選自氮、任何稀有氣體及其組合之氣體來維持。 The gas inclusion system of claim 2, wherein the first volume of the inert gas environment is maintained using a gas selected from the group consisting of nitrogen, any noble gas, and combinations thereof. 如申請專利範圍第2項之氣體包體系統,其中含於該列印系統包體內部中之該惰性氣氛包含含量各為100ppm或100ppm以下之水及氧。 The gas inclusion system of claim 2, wherein the inert atmosphere contained in the interior of the printing system package comprises water and oxygen in an amount of 100 ppm or less. 如申請專利範圍第2項之氣體包體系統,其中含於該列印系統包體內部中之該惰性氣氛包含含量各為1ppm或1ppm以下之水及氧。 The gas inclusion system of claim 2, wherein the inert atmosphere contained in the interior of the printing system package comprises water and oxygen in an amount of 1 ppm or less. 如申請專利範圍第1項之氣體包體系統,其中該輔助包體之該第二體積介於該氣體包體總體積之約1%至約10%之間。 The gas inclusion system of claim 1, wherein the second volume of the auxiliary package is between about 1% and about 10% of the total volume of the gas inclusion. 如申請專利範圍第1項之氣體包體系統,其中該處置器具有一端接器。 The gas inclusion system of claim 1, wherein the handler has an end connector. 如申請專利範圍第7項之氣體包體系統,其中該端接器係選自一葉片型端接器、一夾鉗型端接器及一夾片型端接器。 The gas inclusion system of claim 7, wherein the terminator is selected from the group consisting of a blade type terminator, a clamp type terminator, and a clip type terminator. 如申請專利範圍第1項之氣體包體系統,其中該處置器定位於界定該第一體積之該列印系統包體中。 The gas inclusion system of claim 1, wherein the handler is positioned in the printing system enclosure defining the first volume. 如申請專利範圍第1項之氣體包體系統,其中該處置器定位於界定一第二體積之該輔助包體中。 The gas inclusion system of claim 1, wherein the handler is positioned in the auxiliary package defining a second volume. 如申請專利範圍第1項之氣體包體系統,其進一步包含容納在該氣體包體中之一列印頭管理系統。 The gas inclusion system of claim 1, further comprising a printhead management system housed in the gas enclosure. 如申請專利範圍第11項之氣體包體系統,其中該列印頭管理系統定位於該輔助包體中。 The gas inclusion system of claim 11, wherein the print head management system is positioned in the auxiliary package. 如申請專利範圍第11項之氣體包體系統,其中該列印頭管理系統定位於該列印系統包體中。 The gas inclusion system of claim 11, wherein the print head management system is positioned in the printing system package. 如申請專利範圍第1項之氣體包體系統,其中界定一第二體積之該輔助包體係構造為該氣體包體之一區段。 The gas inclusion system of claim 1, wherein the auxiliary package system defining a second volume is configured as a section of the gas inclusion. 如申請專利範圍第1項之氣體包體系統,其中界定一第二體積之該輔助包體為一可調式受控環境包體。 The gas inclusion system of claim 1, wherein the auxiliary package defining a second volume is an adjustable controlled environmental enclosure. 如申請專利範圍第15項之氣體包體系統,其中該可調式受控環境包體為可容易移動的。 A gas inclusion system as claimed in claim 15 wherein the adjustable controlled environment enclosure is easily movable. 如申請專利範圍第1項之氣體包體系統,其中界一第二體積之該輔助包體為一轉移腔室。 The gas inclusion system of claim 1, wherein the auxiliary volume of the second volume is a transfer chamber. 如申請專利範圍第1項之氣體包體系統,其中該輔助包體為一負載鎖定腔室。 The gas inclusion system of claim 1, wherein the auxiliary package is a load lock chamber. 如申請專利範圍第1項之氣體包體系統,其中該基板支撐設備可支撐一基板,該基板具有介於約第3.5代到約第10代之間的一大小。 The gas inclusion system of claim 1, wherein the substrate support apparatus supports a substrate having a size between about 3.5th generation and about 10th generation. 如申請專利範圍第1項之氣體包體系統,其中該基板支撐設備可支撐一基板,該基板具有介於約第5代至約第8.5代之間的一大小。 The gas inclusion system of claim 1, wherein the substrate support device supports a substrate having a size between about 5th generation and about 8.5th generation. 如申請專利範圍第1項之氣體包體系統,其中該基板支撐設備為一浮動台。 The gas inclusion system of claim 1, wherein the substrate supporting device is a floating table. 一種用於一工業列印系統之自動化維護的方法,該方法包含:將一氣體包體維持於一惰性氣體環境中,該氣體包體包含:一列印系統包體,其中一工業列印系統容納在該列印系統包體內;一輔助包體,其相鄰於該列印系統包體;以及一第一可密封開口,其允許進入該列印系統包體與該輔助包體之間;其中對於維持該列印系統包體中之一惰性環境而言,當該第一可密封開口為打開時,將該輔助包體維持於一惰性環境中;將一處置器鄰近於該列印系統包體與該輔助包體之間的該第一可密封開口來定位; 使用該處置器自該列印系統移除一部件;以及使用該處置器將該經移除之部件移動至該輔助包體。 A method for automated maintenance of an industrial printing system, the method comprising: maintaining a gas inclusion in an inert gas environment, the gas inclusion comprising: a printing system package, wherein an industrial printing system accommodates In the printing system package; an auxiliary package adjacent to the printing system package; and a first sealable opening permitting access between the printing system package and the auxiliary package; For maintaining an inert environment in the printing system package, when the first sealable opening is open, maintaining the auxiliary package in an inert environment; placing a handler adjacent to the printing system package Positioning the first sealable opening between the body and the auxiliary package; Using the handler to remove a component from the printing system; and using the handler to move the removed component to the auxiliary package. 如申請專利範圍第22項之方法,其進一步包含經由介於該輔助腔室與該氣體包體外部之間的一第二可密封開口自該輔助腔室移除該經移除之部件,其中當該輔助包體暴露於一非惰性氣體時,該列印系統包體與該輔助包體之間的該第一可密封開口獲密封。 The method of claim 22, further comprising removing the removed component from the auxiliary chamber via a second sealable opening between the auxiliary chamber and the exterior of the gas enclosure, wherein The first sealable opening between the printing system package and the auxiliary package is sealed when the auxiliary package is exposed to a non-inert gas. 如申請專利範圍第22項之方法,其進一步包含:使用該處置器取回用於該列印系統之一更換部件;以及使用該處置器將該更換部件插入該列印系統中;其中取回及更換一更換部件之該等步驟可在自該列印系統移除一部件之該步驟之後進行或在將該經移除之部件移動至該腔室之該步驟之後進行。 The method of claim 22, further comprising: using the handler to retrieve a replacement component for the printing system; and using the handler to insert the replacement component into the printing system; wherein the retrieval is performed; And the steps of replacing a replacement component may be performed after the step of removing a component from the printing system or after the step of moving the removed component to the chamber. 如申請專利範圍第23項之方法,其進一步包含:當該第二可密封開口被打開時,將用於該列印系統之一更換部件置放至該輔助包體中;封閉該第二可密封開口;以及將該輔助包體之該氣體環境恢復至一惰性氣體環境;其中自該輔助包體移除該經移除之部件及將一更換部件置放於該輔助包體中之該步驟可以任何次序進行。 The method of claim 23, further comprising: when the second sealable opening is opened, placing a replacement component for the printing system into the auxiliary package; closing the second Sealing the opening; and restoring the gaseous environment of the auxiliary package to an inert gas environment; wherein the step of removing the removed component from the auxiliary package and placing a replacement component in the auxiliary package It can be done in any order. 如申請專利範圍第19項之方法,其中該輔助包體之該第二體積介於該氣體包體總體積之約1%至約5%之間。 The method of claim 19, wherein the second volume of the auxiliary package is between about 1% and about 5% of the total volume of the gas inclusion body. 如申請專利範圍第19項之方法,其中該列印系統可列印一OLED基 板,該OLED基板具有介於約第3.5代至約第10代之間的一大小。 The method of claim 19, wherein the printing system can print an OLED base The OLED substrate has a size between about 3.5th generation and about 10th generation. 如申請專利範圍第19項之方法,其中該氣體包體之該惰性氣體環境係使用選自氮、任何稀有氣體及其組合之氣體來維持。 The method of claim 19, wherein the inert gas environment of the gas inclusion is maintained using a gas selected from the group consisting of nitrogen, any noble gas, and combinations thereof. 如申請專利範圍第19項之方法,其中該氣體包體之該惰性氣體環境包含含量各為1ppm或1ppm以下之水及氧。 The method of claim 19, wherein the inert gas atmosphere of the gas inclusion body comprises water and oxygen in an amount of 1 ppm or less. 如申請專利範圍第19項之方法,其中該氣體包體之該惰性氣體環境包含含量各為100ppm或100ppm以下之水及氧。 The method of claim 19, wherein the inert gas atmosphere of the gas inclusion body comprises water and oxygen in an amount of 100 ppm or less.
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