TWI618901B - Method for maintenance of an industrial printing system - Google Patents

Method for maintenance of an industrial printing system Download PDF

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TWI618901B
TWI618901B TW105117833A TW105117833A TWI618901B TW I618901 B TWI618901 B TW I618901B TW 105117833 A TW105117833 A TW 105117833A TW 105117833 A TW105117833 A TW 105117833A TW I618901 B TWI618901 B TW I618901B
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assembly
gas
panel
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TW201632802A (en
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賈斯汀 默克
亞歷山大 守康 高
伊莉亞 沃斯凱
珊登 歐德森
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凱特伊夫公司
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Abstract

本教示係關於氣密式密封型氣體包體總成及系統的各種實施例,該氣體包體總成及系統可易於傳送及組裝且可提供用於維持最小惰性氣體體積以及對其中所包封之各種裝置及設備的最大接取。本教示之氣密式密封型氣體包體總成及系統的各種實施例可具有氣體包體總成,其係以某種方式建構,以使得氣體包體總成之內部體積最小化,且同時使用來容納各種OLED列印系統之多種佔據面積的工作空間最佳化。如此建構之氣體包體總成的各種實施例另外提供:在處理期間自外部對氣體包體總成之內部的輕鬆接取,以及為了維護而對內部的輕鬆接取,同時使停機時間最小化。 The present teachings are directed to various embodiments of hermetically sealed gas inclusion assemblies and systems that are easily transportable and assembled and that are provided for maintaining and encapsulating a minimum inert gas volume therein. The maximum access to various devices and equipment. Various embodiments of the hermetically sealed gas inclusion assembly and system of the present teachings can have a gas inclusion assembly that is constructed in a manner to minimize the internal volume of the gas inclusion assembly while simultaneously Workspace optimization to accommodate multiple footprints of various OLED printing systems. Various embodiments of the gas inclusion assembly thus constructed additionally provide for easy access to the interior of the gas enclosure assembly from the outside during processing, as well as easy internal access for maintenance while minimizing downtime .

Description

用於維護工業用列印系統的方法 Method for maintaining an industrial printing system 【相關申請案之交互參照】[Reciprocal Reference of Related Applications]

本申請案係2012年12月19日申請之美國申請案第13/720,830號的部分接續申請案。本申請案主張2012年11月30日申請之美國臨時申請案第61/732,173號的權益,且另外主張2013年2月14日申請之美國臨時申請案第61/764,973號的權益。所有交互參照之申請案的全文納入本文中。 This application is a continuation-in-part application of U.S. Application Serial No. 13/720,830, filed on December 19, 2012. The present application claims the benefit of U.S. Provisional Application No. 61/732,173, filed on Nov. 30, 2012, and the benefit of U.S. Provisional Application No. 61/764,973, filed on Feb. 14, 2013. The full text of all cross-referenced applications is incorporated herein.

本教示係關於氣密式密封型氣體包體總成及系統的各種實施例,該氣體包體總成及系統可易於傳送及組裝且可提供用於維持最小惰性氣體體積以及對其中所包封之各種裝置及設備的最大接取。 The present teachings are directed to various embodiments of hermetically sealed gas inclusion assemblies and systems that are easily transportable and assembled and that are provided for maintaining and encapsulating a minimum inert gas volume therein. The maximum access to various devices and equipment.

對OLED顯示技術之潛力的興趣受到OLED顯示技術屬性的驅使,該等屬性包括具有高度飽和之顏色、高對比度、超薄、快速響應且高效節能之顯示面板的證實。另外,包括撓性聚合物材料之多種基板材料可用於製造OLED顯示技術。儘管對用於小螢幕應用(主要用於手機)之顯示器的證實已用來強調該技術之潛力,但使製造擴展至更大型式仍存在挑戰。例如,在比尺寸約為130cm X 150cm之第5.5代基板大的基板上製 造OLED顯示器尚未得到證實。 Interest in the potential of OLED display technology is driven by the attributes of OLED display technologies, including the validation of display panels with highly saturated colors, high contrast, ultra-thin, fast response, and energy efficient display panels. Additionally, a variety of substrate materials including flexible polymeric materials can be used to fabricate OLED display technologies. While the validation of displays for small screen applications (primarily for cell phones) has been used to underscore the potential of this technology, there are still challenges in extending manufacturing to larger scales. For example, it is made on a substrate larger than the 5.5th generation substrate having a size of about 130 cm X 150 cm. OLED displays have not been confirmed.

可藉由使用OLED列印系統在基板上列印各種有機薄膜以及其他材料來製造有機發光二極體(OLED)裝置。此等有機材料可容易因氧化及其他化學處理而受損壞。以某種方式來封裝(housing)OLED列印系統以使得其可針對各種基板大小來縮放且可在惰性、大致上無粒子之列印環境中完成可提出多種挑戰。因為用於列印大型面板基板列印之設備需要很大空間,所以將大型設施維持在惰性氣氛下(其不斷需要氣體淨化來移除諸如水蒸汽及氧氣之反應性大氣物種以及有機溶劑蒸汽)提出很大的工程挑戰。例如,提供氣密式密封之大型設施可提出工程挑戰。另外,饋入及饋出OLED列印系統之用於操作該列印系統的各種纜線、接線及管線可對有效地使氣體包體在大氣成分(諸如氧氣及水蒸汽)之含量方面符合規格提出挑戰,因為該等纜線、接線及管線可產生很大的無效體積,此等反應性物種可被吸留在該無效體積中。此外,希望將此設施保持在惰性環境中來進行處理,從而提供輕鬆接取以便在停機時間最少的情況下進行維護。除了大致上無反應性物種之外,用於OLED裝置之列印環境亦需要大致上低粒子之環境。就此而言,在整個被包封系統中提供及維持大致上無粒子之環境提出額外挑戰,而用於可在諸如露天、高流量層流過濾罩之大氣條件下完成的處理之粒子減少並未提出此等額外挑戰。 An organic light emitting diode (OLED) device can be fabricated by printing various organic thin films and other materials on a substrate using an OLED printing system. These organic materials can be easily damaged by oxidation and other chemical treatments. Having the OLED printing system in some way so that it can be scaled for various substrate sizes and can be done in an inert, substantially particle-free printing environment can present a variety of challenges. Because equipment for printing large panel substrates requires a lot of space, large facilities are maintained under an inert atmosphere (which continuously requires gas purification to remove reactive atmospheric species such as water vapor and oxygen, and organic solvent vapors). Put forward a lot of engineering challenges. For example, large facilities that provide a hermetic seal can present engineering challenges. In addition, the various cables, wiring and lines used to operate the printing system for feeding and feeding out of the OLED printing system are effective in meeting the specifications of the gas inclusions in terms of atmospheric composition such as oxygen and water vapor. Challenges arise because such cables, wiring, and lines can create large ineffective volumes, and such reactive species can be occluded in the void volume. In addition, it is desirable to maintain this facility in an inert environment for easy access to maintenance with minimal downtime. In addition to substantially non-reactive species, printing environments for OLED devices also require a substantially low particle environment. In this regard, providing and maintaining a substantially particle-free environment throughout the encapsulated system presents additional challenges, while particle reduction for treatments that can be performed under atmospheric conditions such as open-air, high flow laminar flow filters is not Ask these additional challenges.

因此,存在對氣體包體之各種實施例的需要,該氣體包體可將OLED列印系統封裝在惰性、大致上無粒子之環境中,且可容易縮放來提供用於在多種基板大小及基板材料上製造OLED面板,同時亦提供在處理期間自外部對OLED列印系統之輕鬆接取,以及對內部之輕鬆接取以便 在停機時間最少的情況下進行維護。 Accordingly, there is a need for various embodiments of gas inclusions that can package an OLED printing system in an inert, substantially particle-free environment and can be easily scaled for use in a variety of substrate sizes and substrates. The OLED panel is fabricated on the material, while also providing easy access to the OLED printing system from the outside during processing and easy access to the interior. Perform maintenance with minimal downtime.

本教示揭示氣體包體總成之各種實施例,該氣體包體總成可密封地建構並且與氣體循環組件、過濾組件及淨化組件整合來形成氣體包體總成及系統,該氣體包體總成及系統可維持惰性、大致上無粒子之環境來用於需要此環境的處理。氣體包體總成及系統之此等實施例可將各種反應性物種中之每一物種的含量維持在100ppm或更低,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低,該等反應性物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽。此外,氣體包體總成之各種實施例可提供滿足ISO 14644第3級及第4級無塵室標準之低粒子環境。 The present teachings disclose various embodiments of a gas inclusion assembly that is sealably constructed and integrated with a gas circulation assembly, a filtration assembly, and a purification assembly to form a gas inclusion assembly and system, the total gas inclusion The system can maintain an inert, substantially particle-free environment for processing that requires this environment. Such embodiments of the gas inclusion body assembly and system can maintain the content of each of the various reactive species at 100 ppm or less, such as 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less, Such reactive species include various reactive atmospheric gases such as water vapor and oxygen, as well as organic solvent vapors. In addition, various embodiments of the gas inclusion assembly provide a low particle environment that meets ISO 14644 Class 3 and Class 4 clean room standards.

多種技術領域之一般技藝人士可瞭解氣體包體總成之實施例對多種技術領域的效用。儘管諸如化學、生物技術、高科技及製藥技術之諸多不同技術可受益於本教示,但使用OLED列印來例證根據本教示之氣體包體總成及系統的各種實施例之效用。可封裝OLED列印系統之氣體包體總成系統的各種實施例可提供多個特徵,該等特徵諸如但不限於:在建構及解構週期中提供氣密式密封型包體的密封、包體體積之最小化,以及在處理期間與維護期間自外部對內部之輕鬆接取。如隨後將討論,氣體包體總成之各種實施例的此等特徵可對功能性有影響,該功能性諸如但不限於:結構完整性,其為在處理期間維持反應性物種之低含量提供方便;以及快速包體體積翻轉,其使維護週期期間之停機時間最小化。因此,為OLED面板列印提供效用之各種特徵及規格亦可為多種技術領域提供益處。 One of ordinary skill in the art will appreciate the utility of embodiments of gas inclusion assemblies in a variety of technical fields. While many different techniques, such as chemistry, biotechnology, high technology, and pharmaceutical technology, may benefit from the teachings, OLED printing is used to illustrate the utility of various embodiments of gas inclusion assemblies and systems in accordance with the present teachings. Various embodiments of a gas inclusion assembly system that can package an OLED printing system can provide a number of features such as, but not limited to, a seal, an enclosure that provides a hermetic sealed envelope during construction and deconstruction cycles. Minimize volume and easy access to the interior from the outside during processing and maintenance. As will be discussed later, these features of various embodiments of the gas inclusion body assembly can have an effect on functionality such as, but not limited to, structural integrity, which provides for maintaining a low level of reactive species during processing. Convenient; and fast body volume rollover, which minimizes downtime during the maintenance cycle. Thus, the various features and specifications that provide utility for OLED panel printing can also provide benefits in a variety of technical fields.

如前面所提及,在比尺寸約為130cm X 150cm之第5.5代基 板大的基板上製造OLED顯示器尚未得到證實。大約從1990年代初開始,對於藉由除OLED列印以外之技術所製造之平板顯示器,各代母玻璃基板大小已經歷演變。被稱為第1代(Gen 1)之第一代母玻璃基板約為30cm x 40cm,且因此可產生15"面板。大約在1990年代中期,用於生產平板顯示器之現有技術已演變為第3.5代之母玻璃基板大小,其尺寸約為60cm x 72cm。 As mentioned earlier, the 5.5th generation base is about 130cm X 150cm in specific dimensions. The manufacture of OLED displays on large substrates has not been confirmed. Since the early 1990s, the size of each generation of mother glass substrates has evolved for flat panel displays manufactured by technologies other than OLED printing. The first generation of mother glass substrates, referred to as Gen 1 (Gen 1), is approximately 30 cm x 40 cm, and thus can produce 15" panels. In the mid-1990s, the prior art for the production of flat panel displays has evolved to 3.5. The size of the mother glass substrate is about 60 cm x 72 cm.

隨著各代的進步,第7.5代及第8.5代之母玻璃大小已投入生產,用於除OLED列印製造處理以外之處理。第7.5代母玻璃之尺寸約為195cm x 225cm,且每個基板可切割成八個42"平板或六個47”平板。第8.5代中所使用之母玻璃約為220 x 250cm,且每個基板可切割成六個55”平板或八個46”平板。已實現OLED平板顯示器之品質保證,諸如更真實之顏色、更高之對比度、薄、可撓性、透明度及能源效率,同時OLED製造實際上被限於G 3.5及更小。目前,OLED列印被認為係打破此限制並且不僅針對第3.5代及更小之母玻璃大小,而且針對最大之母玻璃大小(諸如第5.5代、第7.5代及第8.5代)來實現OLED面板製造之最佳製造技術。一般技藝人士將瞭解的是,OLED面板列印之特徵中之一者包括可使用多種基板材料,例如但不限於多種玻璃基板材料以及多種聚合物基板材料。就此而言,由基於玻璃的基板之使用所產生的術語所列舉之大小可適用於適合在OLED列印中使用之任何材料的基板。 With the advancement of generations, the size of the 7.5th and 8.5th generation mother glass has been put into production for processing other than OLED printing manufacturing. The 7.5th generation mother glass is approximately 195cm x 225cm in size and each substrate can be cut into eight 42" plates or six 47" plates. The mother glass used in the 8.5th generation is approximately 220 x 250 cm, and each substrate can be cut into six 55" plates or eight 46" plates. Quality assurance of OLED flat panel displays has been achieved, such as more realistic colors, higher contrast, thinness, flexibility, transparency and energy efficiency, while OLED manufacturing is actually limited to G 3.5 and smaller. Currently, OLED printing is believed to break this limitation and not only for the 3.5th and smaller mother glass sizes, but also for the largest mother glass sizes (such as the 5.5th, 7.5th, and 8.5th generations) to implement OLED panels. The best manufacturing technology for manufacturing. One of ordinary skill in the art will appreciate that one of the features of OLED panel printing includes the use of a variety of substrate materials such as, but not limited to, a variety of glass substrate materials and a variety of polymeric substrate materials. In this regard, the terminology recited by the terms used in the use of glass-based substrates is applicable to substrates suitable for any material used in OLED printing.

關於OLED列印,根據本教示,已經發現維持反應性物種之大致上低含量與提供滿足必要壽命規格之OLED平板顯示器有關,該等反應性物種例如但不限於:諸如氧氣及水蒸汽之大氣成分,以及OLED墨水 中所使用之各種有機溶劑蒸汽。壽命規格對OLED面板技術特別重要,因為此直接與顯示器產品耐久性有關;耐久性係所有面板技術之產品規格,目前係OLED面板技術要滿足的挑戰。為了提供滿足必要壽命規格之面板,可利用本教示之氣體包體總系統的各種實施例來將諸如水蒸汽、氧氣以及有機溶劑蒸汽之反應性物種中之每一者的含量維持在100ppm或更低,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低。另外,OLED列印需要大致上無粒子之環境。維持用於OLED列印之大致上無粒子之環境特別重要,因為即使極小之粒子亦可導致OLED面板上之可見缺陷。目前,OLED顯示器要滿足商品化所需之低缺陷水平係一個挑戰。在整個被包封系統中維持大致上無粒子之環境提出額外挑戰,而用於可在諸如露天、高流量層流過濾罩之大氣條件下完成的處理之粒子減少並未提出此等額外挑戰。因此,在大型設施中維持惰性、無粒子環境的必要規格可提出多種挑戰。 With regard to OLED printing, it has been found in accordance with the present teachings that maintaining a substantially low level of reactive species is associated with providing an OLED flat panel display that meets the necessary life specifications such as, but not limited to, atmospheric components such as oxygen and water vapor. And OLED inks Various organic solvent vapors used in the process. Lifetime specifications are particularly important for OLED panel technology because it is directly related to the durability of the display product; durability is the product specification for all panel technologies and is currently a challenge for OLED panel technology. In order to provide panels that meet the necessary life specifications, various embodiments of the gas inclusion system of the present teachings can be utilized to maintain the content of each of the reactive species, such as water vapor, oxygen, and organic solvent vapor, at 100 ppm or more. Low, for example 10 ppm or less, 1.0 ppm or less or 0.1 ppm or less. In addition, OLED printing requires an environment that is substantially free of particles. Maintaining a substantially particle-free environment for OLED printing is particularly important because even very small particles can cause visible defects on the OLED panel. At present, it is a challenge for OLED displays to meet the low defect levels required for commercialization. The additional challenge of maintaining a substantially particle-free environment throughout the encapsulated system does not present such additional challenges for particle reduction for treatments that can be performed under atmospheric conditions such as open-air, high flow laminar flow filters. Therefore, maintaining the necessary specifications for an inert, particle-free environment in large facilities presents multiple challenges.

可查閱表1中所概括之資訊來例示對於在一設施中列印OLED面板之需要,在該設施中,諸如水蒸汽、氧氣以及有機溶劑蒸汽之反應性物種中之每一者的含量可維持在100ppm或更低,例如,10ppm或更低、1.0ppm或更低或者0.1ppm或更低。表1中所概括之資料係由對試樣(test coupon)中之每一者的測試而產生,該試樣包含以大像素、旋塗裝置格式製成的用於紅色、綠色及藍色中之每一者的有機薄膜組成物。此等試樣大致上更易於製造及測試,以便快速評估各種調配物及處理。儘管試樣測試不應與列印面板之壽命測試相混淆,但試樣測試可指示各種調配物及處理對壽命的影響。下表中所展示之結果表示在試樣之製造的處理步驟中的變化,其中僅在反應性物種小於1ppm的氮氣環境中製造之試樣的旋塗 環境發生改變,此與以類似方式製造但係在空氣而非氮氣環境中製造之試樣產生比較。 The information summarized in Table 1 can be consulted to illustrate the need to print an OLED panel in a facility in which the content of each of the reactive species such as water vapor, oxygen, and organic solvent vapor can be maintained. At 100 ppm or less, for example, 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. The data summarized in Table 1 was generated by testing each of the test coupons, which were made in red, green, and blue in a large pixel, spin coating format. An organic film composition for each of them. These samples are generally easier to manufacture and test in order to quickly evaluate various formulations and treatments. Although the sample test should not be confused with the life test of the print panel, the sample test can indicate the effect of various formulations and treatments on the life. The results shown in the table below represent variations in the processing steps of the manufacture of the sample, wherein the spin coating of the sample produced only in a nitrogen environment having a reactive species of less than 1 ppm The environment changes, which is compared to samples made in a similar manner but made in an air rather than a nitrogen environment.

經由檢查表1中關於在不同處理環境下製造之試樣的資料,特別係在紅色及藍色之狀況下,顯而易見的是:在有效地減少將有機薄膜組成物曝露於反應性物種的環境中之列印可對各種EL之穩定性有實質影響,且因此對壽命有實質影響。 By examining the data in Table 1 for samples made in different treatment environments, especially in the red and blue conditions, it is apparent that in effectively reducing the exposure of the organic film composition to reactive species. The printing can have a substantial impact on the stability of the various ELs and thus have a substantial impact on life.

因此,將OLED列印自第3.5代縮放至第8.5代及更大且同時提供穩健的包體環境存在挑戰,該包體環境可將OLED列印系統容納於惰性、大致上無粒子之氣體包體環境中。預期的是,根據本教示,此氣體包體將具有多種屬性,該等屬性包括:例如但不限於一種氣體包體,其可易於縮放來為OLED列印系統提供最佳化之工作空間,同時提供最小化之惰性氣體體積,並且另外提供在處理期間自外部對OLED列印系統之輕鬆接取,同時提供對內部之接取以便在停機時間最少的情況下進行維護。 Therefore, there is a challenge in printing OLEDs from the 3.5th generation to the 8.5th generation and larger while providing a robust inclusion environment that accommodates the OLED printing system in an inert, substantially particle-free gas package. In the body environment. It is contemplated that, in accordance with the present teachings, the gas inclusions will have a variety of attributes including, for example, but not limited to, a gas inclusion that can be easily scaled to provide an optimized workspace for the OLED printing system while A minimum inert gas volume is provided, and an easy access to the OLED printing system from the outside during processing is provided, while providing internal access for maintenance with minimal downtime.

根據本教示之各種實施例,提供用於需要惰性環境之各種空氣敏感型處理的氣體包體總成,該氣體包體總成可包括可密封在一起的複數個壁框架構件及天花板框架構件。在一些實施例中,可使用例如螺栓及螺紋孔之可重複使用的緊固件將複數個壁框架構件及天花板框架構件緊固在一起。對於根據本教示之氣體包體總成的各種實施例,複數個框架構件可經建構來界定氣體包體框架總成,每一框架構件包含複數個面板框架區段。 In accordance with various embodiments of the present teachings, a gas inclusion assembly for various air-sensitive processes requiring an inert environment is provided, the gas inclusion assembly can include a plurality of wall frame members and ceiling frame members that can be sealed together. In some embodiments, a plurality of wall frame members and ceiling frame members can be fastened together using reusable fasteners such as bolts and threaded holes. For various embodiments of the gas inclusion assembly in accordance with the present teachings, a plurality of frame members can be constructed to define a gas enclosure frame assembly, each frame member including a plurality of panel frame segments.

本教示之氣體包體總成可經設計來以某種方式容納諸如OLED列印系統之系統,以使得可使圍繞系統之包體的體積最小化。氣體包體總成之各種實施例可以某種方式建構,以使得使氣體包體總成之內部體積最小化,且同時使用來容納各種OLED列印系統之各種佔據面積的工作空間最佳化。如此建構之氣體包體總成的各種實施例另外提供:在處理期間自外部對氣體包體總成之內部的輕鬆接取,以及為了維護而對內部的輕鬆接取,同時使停機時間最小化。就此而言,根據本教示之氣體包體總成的各種實施例可針對各種OLED列印系統之各種佔據面積來進行輪廓塑造(contoured)。根據各種實施例,一旦經輪廓塑造之框架構件經建構來形成氣體包體框架總成,則可將各種類型之面板密封地安裝於包含框架構件的複數個面板區段中,來完成氣體包體總成之安裝。在氣體包體總成之各種實施例中,複數個框架構件(包括例如但不限於複數個壁框架構件及至少一個天花板框架構件)以及用於安裝於面板框架區段中的複數個面板可在一個位置或多個位置製造,且隨後在另一位置建構。此外,考慮到用來建構本教示之氣體包體總成之組件的可傳送性質,在建構及解構週期中可反 復安裝及移除氣體包體總成之各種實施例。 The gas inclusion assembly of the present teachings can be designed to accommodate systems such as OLED printing systems in a manner such that the volume of the enclosure surrounding the system can be minimized. Various embodiments of the gas inclusion body assembly can be constructed in a manner to minimize the internal volume of the gas inclusion body assembly and at the same time optimize the workspace for accommodating various footprints of various OLED printing systems. Various embodiments of the gas inclusion assembly thus constructed additionally provide for easy access to the interior of the gas enclosure assembly from the outside during processing, as well as easy internal access for maintenance while minimizing downtime . In this regard, various embodiments of gas inclusion assemblies in accordance with the present teachings can be contoured for various footprints of various OLED printing systems. According to various embodiments, once the contoured frame member is constructed to form a gas enclosure frame assembly, various types of panels may be sealingly mounted in a plurality of panel sections including the frame members to complete the gas inclusions Installation of the assembly. In various embodiments of the gas inclusion assembly, a plurality of frame members (including, but not limited to, a plurality of wall frame members and at least one ceiling frame member) and a plurality of panels for mounting in the panel frame section are One location or multiple locations are manufactured and then constructed in another location. In addition, considering the transportable nature of the components of the gas inclusion assembly used to construct the present teachings, it may be reversed during the construction and deconstruction cycles. Various embodiments of the re-installation and removal of the gas inclusion assembly.

為確保氣體包體被氣密式密封,本教示之氣體包體總成的各種實施例提供用於連接每一框架構件以便提供框架密封。內部可被充分密封,例如藉由各種框架構件之間緊密配合的相交處而被氣密式密封,該等相交處包括墊圈或其他密封件。一旦完全建構,密封的氣體包體總成則可包含一內部及複數個內部角邊緣,至少一個內部角邊緣係提供在每一框架構件與一相鄰框架構件之相交處。該等框架構件中之一或多者(例如該等框架構件之至少一半)可包含沿其一或多個對應邊緣固定的一或多個可壓縮墊圈。一旦將複數個框架構件連接在一起且安裝了氣密式面板,則該或該等可壓縮墊圈可經組配來產生氣密式密封型氣體包體總成。密封的氣體包體總成可形成為具有藉由複數個可壓縮墊圈來密封的框架構件之角邊緣。對於每一框架構件,例如但不限於內部壁框架表面、頂部壁框架表面、垂直側壁框架表面、底部壁框架表面及其組合可具備一或多個可壓縮墊圈。 To ensure that the gas enclosure is hermetically sealed, various embodiments of the gas inclusion assembly of the present teachings are provided for joining each frame member to provide a frame seal. The interior may be sufficiently sealed, such as by a tight fit of the various frame members, which include gaskets or other seals. Once fully constructed, the sealed gas inclusion assembly can include an inner and a plurality of inner corner edges, at least one of which is provided at the intersection of each frame member and an adjacent frame member. One or more of the frame members (eg, at least half of the frame members) can include one or more compressible gaskets secured along one or more corresponding edges thereof. Once the plurality of frame members are joined together and an airtight panel is installed, the or the compressible gaskets can be assembled to create a hermetic sealed gas inclusion assembly. The sealed gas inclusion assembly can be formed with a corner edge of a frame member that is sealed by a plurality of compressible gaskets. One or more compressible gaskets may be provided for each frame member, such as, but not limited to, an interior wall frame surface, a top wall frame surface, a vertical sidewall frame surface, a bottom wall frame surface, and combinations thereof.

對於氣體包體總成之各種實施例,每一框架構件可包含複數個區段,該等區段經構架及製造來接納可密封地安裝於每一區段中的多種面板類型中之任一者,以便為每一面板提供氣密式面板密封。在本教示之氣體包體總成的各種實施例中,每一區段框架可具有區段框架墊圈,該區段框架墊圈與所選緊固件一起確保安裝於每一區段框架中之每一面板可為每一面板提供氣密式密封,且因此為完全建構之氣體包體提供氣密式密封。在各種實施例中,氣體包體總成可具有位於壁面板中之每一者中的窗口面板或服務窗口中之一或多者;其中每一窗口面板或服務窗口可具有至少一個手套埠(gloveport)。在氣體包體總成之組裝期間,每一手套埠可使 手套得以附接以使得該手套可延伸至該內部中。根據各種實施例中,每一手套埠可具有用於安裝手套之硬體,其中此硬體在每一手套埠周圍利用墊圈密封,其提供氣密式密封以便使透過手套埠之洩漏或分子擴散最小化。對於本教示之氣體包體總成的各種實施例,該硬體經進一步設計用於為終端使用者對手套埠進行封蓋(capping)及開蓋(uncapping)提供方便。 For various embodiments of the gas inclusion assembly, each frame member can include a plurality of sections that are framed and fabricated to receive any of a variety of panel types that are sealably mounted in each section In order to provide a hermetic panel seal for each panel. In various embodiments of the gas inclusion assembly of the present teachings, each segment frame can have a segment frame washer that, along with the selected fastener, ensures that each of the segment frames is mounted The panels provide a hermetic seal for each panel and thus provide a hermetic seal for the fully constructed gas enclosure. In various embodiments, the gas inclusion assembly can have one or more of a window panel or service window located in each of the wall panels; wherein each window panel or service window can have at least one glove pocket ( Gloveport). During the assembly of the gas inclusion assembly, each glove can be The glove is attached such that the glove can extend into the interior. According to various embodiments, each glove can have a hardware for mounting the glove, wherein the hardware is sealed with a gasket around each glove, which provides a hermetic seal for leakage or molecular diffusion through the glove minimize. For various embodiments of the gas inclusion assembly of the present teachings, the hardware is further designed to facilitate capping and uncapping of the glove for the end user.

根據本教示之氣體包體總成及系統的各種實施例可包括由複數個框架構件及面板區段形成之氣體包體總成,以及氣體循環組件、過濾組件及淨化組件。對於氣體包體總成及系統之各種實施例,可在組裝處理期間安裝管道(ductwork)。根據本教示之各種實施例,可將管道安裝於已由複數個框架構件建構而成之氣體包體框架總成中。在各種實施例中,可在複數個框架構件被連接來形成氣體包體框架總成之前將管道安裝於該複數個框架構件上。用於氣體包體總成及系統之各種實施例的管道可經組配以使得自一或多個管道入口吸入該管道中之大致全部氣體被移動通過在氣體包體總成及系統內部之用於移除顆粒物的氣體循環及過濾迴路之各種實施例。另外,氣體包體總成及系統之各種實施例的管道可經組配來將在氣體包體總成外部的氣體淨化迴路之入口及出口與在氣體包體總成內部的氣體循環及過濾迴路分開。 Various embodiments of gas inclusion assemblies and systems in accordance with the present teachings can include a gas inclusion assembly formed from a plurality of frame members and panel sections, as well as a gas circulation assembly, a filtration assembly, and a purification assembly. For various embodiments of the gas inclusion assembly and system, a ductwork can be installed during the assembly process. In accordance with various embodiments of the present teachings, the conduit can be mounted in a gas enclosure frame assembly that has been constructed from a plurality of frame members. In various embodiments, a conduit can be mounted to the plurality of frame members prior to the plurality of frame members being joined to form the gas enclosure frame assembly. The conduits for various embodiments of the gas inclusion assembly and system can be assembled such that substantially all of the gas drawn into the conduit from one or more conduit inlets is moved through the gas inclusion assembly and system interior Various embodiments of gas circulation and filtration circuits for removing particulate matter. Additionally, the gas inclusion assembly and the conduits of various embodiments of the system can be configured to combine the inlet and outlet of the gas purification circuit external to the gas inclusion assembly with the gas circulation and filtration circuit within the gas inclusion assembly. separate.

例如,氣體包體總成及系統可具有在氣體包體總成內部的氣體循環及過濾系統。此內部過濾系統可具有在該內部中之複數個風扇過濾單元,且可經組配來在該內部中提供氣體的層流。該層流可在自該內部之頂部至該內部之底部的方向上,或在任何其他方向上。儘管藉由循環系統所產生之氣流無需為層狀的,但氣體之層流可用來確保內部中之氣體之徹 底及完全的翻轉。氣體之層流亦可用來使紊流最小化,此紊流係不受歡迎的,因為其可導致環境中之粒子在此等紊流區域中聚集,從而阻礙過濾系統自環境中移除彼等粒子。此外,為了在內部中維持所需溫度,可提供利用複數個熱交換器之熱調節系統,其例如與風扇或另一氣體循環裝置一起操作、相鄰或結合使用。氣體淨化迴路可經組配來使來自氣體包體總成之內部的氣體循環通過在該包體外部的至少一個氣體淨化組件。就此而言,在氣體包體總成內部的循環及過濾系統與在氣體包體總成外部的氣體淨化迴路相結合,可在整個氣體包體總成中提供大致上低微粒的惰性氣體之連續循環,該惰性氣體具有大致上低含量之反應性物種。氣體淨化系統可經組配來維持不需要的成分之極低含量,該等成分例如有機溶劑及其蒸汽,以及水、水蒸汽、氧氣及類似物。 For example, the gas inclusion assembly and system can have a gas circulation and filtration system inside the gas inclusion assembly. The internal filtration system can have a plurality of fan filtration units in the interior and can be configured to provide a laminar flow of gas in the interior. The laminar flow may be in the direction from the top of the interior to the bottom of the interior, or in any other direction. Although the airflow generated by the circulatory system does not need to be layered, the laminar flow of the gas can be used to ensure the gas in the interior. Bottom and complete flip. The laminar flow of gas can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in such turbulent areas, thereby preventing the filtration system from removing them from the environment. particle. Furthermore, in order to maintain the desired temperature in the interior, a thermal conditioning system utilizing a plurality of heat exchangers, for example, operating, adjacent or in combination with a fan or another gas circulation device may be provided. The gas purification circuit can be assembled to circulate gas from the interior of the gas inclusion assembly through at least one gas purification component external to the enclosure. In this regard, the circulation and filtration system within the gas inclusion assembly, in combination with the gas purification circuit external to the gas inclusion assembly, provides continuous flow of substantially low particulate inert gas throughout the gas inclusion assembly. Circulating, the inert gas has a substantially low content of reactive species. Gas purification systems can be formulated to maintain very low levels of undesirable components such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.

除了提供氣體循環組件、過濾組件及淨化組件之外,管道亦可經設定大小及設定形狀來在其中容納電線、線束以及各種含流體之管線中之至少一者,該等管線在成束時可具有相當大之無效體積,諸如水、水蒸汽、氧氣及類似物之大氣成分可被截留在該無效體積中且難以藉由淨化系統將其移除。在一些實施例中,電纜、電線及線束以及含流體之管線中之任一者的組合可大致上佈置於管道中,且可操作性地與佈置於內部中之電氣系統、機械系統、流體系統及冷卻系統中之至少一者分別相關聯。因為氣體循環組件、過濾組件及淨化組件可經組配以使得大致上全部循環惰性氣體通過該管道,所以,藉由使各種成束材料包含於該管道中,可自此等成束材料之相當大的無效體積有效地沖洗掉截留在此等成束材料之無效體積中的大氣成分。 In addition to providing a gas circulation assembly, a filtration assembly, and a purification assembly, the conduit can also be sized and shaped to accommodate at least one of a wire, a wire harness, and various fluid-containing lines therein. With a relatively large void volume, atmospheric constituents such as water, water vapor, oxygen, and the like can be trapped in the void volume and difficult to remove by the purification system. In some embodiments, a combination of any of a cable, a wire and a wire harness, and a fluid containing line may be disposed substantially in the conduit and operatively associated with an electrical system, a mechanical system, a fluid system disposed within the interior At least one of the cooling systems is associated with each other. Since the gas circulation assembly, the filtration assembly, and the purification assembly can be assembled such that substantially all of the circulating inert gas passes through the conduit, the various bundle materials can be equivalent thereto by including various bundle materials in the conduit. The large ineffective volume effectively flushes away atmospheric constituents trapped in the ineffective volume of such bundled materials.

根據本教示之氣體包體總成及系統的各種實施例可包括由複數個框架構件及面板區段形成之氣體包體總成,以及氣體循環組件、過濾組件及淨化組件,且另外包括加壓惰性氣體再循環系統之各種實施例。如隨後將更為詳細地討論,此加壓惰性氣體再循環系統可在OLED列印系統之操作中用於各種氣動驅動式裝置及設備利用。 Various embodiments of gas inclusion assemblies and systems in accordance with the present teachings can include a gas inclusion assembly formed from a plurality of frame members and panel sections, as well as a gas circulation assembly, a filtration assembly, and a purification assembly, and additionally including pressurization Various embodiments of an inert gas recirculation system. As will be discussed in more detail later, this pressurized inert gas recirculation system can be utilized in a variety of pneumatically driven devices and equipment operations in the operation of OLED printing systems.

根據本教示,解決了若干工程挑戰,以便在氣體包體總成及系統中提供加壓惰性氣體再循環系統之各種實施例。首先,在無加壓系統惰性氣體再循環系統的氣體包體總成及系統之典型操作下,氣體包體總成可相對於外部壓力維持在小幅正內部壓力下,以便在氣體包體總成及系統中出現任何洩漏時防止外部氣體或空氣進入內部。例如,在典型操作下,對於本教示之氣體包體總成及系統的各種實施例,氣體包體總成之內部可相對於在包體系統外部的周圍大氣維持在例如至少為2mbarg之壓力下,例如,維持在至少為4mbarg之壓力下、維持在至少為6mbarg之壓力下、維持在至少為8mbarg之壓力下,或維持在更高之壓力下。在氣體包體總成系統中維持加壓惰性氣體再循環系統可具有挑戰性,因為其關於維持氣體包體總成及系統之小幅正內部壓力而同時持續地引入加壓氣體至氣體包體總成及系統中提出了動態及持續平衡作用。此外,各種裝置及設備之可變的需求可產生本教示之各種氣體包體總成及系統之不規則壓力分佈。在此等條件下,對相對於外部環境保持在小幅正壓力下的氣體包體總成維持動態壓力平衡可提供正在進行的OLED列印處理之完整性。 In accordance with the present teachings, several engineering challenges have been addressed to provide various embodiments of pressurized inert gas recirculation systems in gas inclusion assemblies and systems. First, under typical operation of a gas inclusion assembly and system of a non-pressurized system inert gas recirculation system, the gas inclusion assembly can be maintained at a small positive internal pressure relative to external pressure for gas inclusion assembly Prevent any outside air or air from entering the interior when any leaks occur in the system. For example, under typical operation, for various embodiments of the gas inclusion assembly and system of the present teachings, the interior of the gas enclosure assembly can be maintained at a pressure of, for example, at least 2 mbarg relative to the ambient atmosphere outside the enclosure system. For example, it is maintained at a pressure of at least 4 mbarg, maintained at a pressure of at least 6 mbarg, maintained at a pressure of at least 8 mbarg, or maintained at a higher pressure. Maintaining a pressurized inert gas recirculation system in a gas inclusion assembly system can be challenging because it maintains a small positive internal pressure of the gas inclusion assembly and system while continuously introducing pressurized gas to the gas inclusion total Dynamic and continuous balancing is proposed in the system. In addition, the variable requirements of various devices and devices can result in irregular pressure distributions for various gas inclusion assemblies and systems of the present teachings. Under these conditions, maintaining a dynamic pressure balance of the gas inclusion assembly maintained at a small positive pressure relative to the external environment provides the integrity of the ongoing OLED printing process.

對於氣體包體總成及系統之各種實施例,根據本教示之加壓惰性氣體再循環系統可包括可利用壓縮機、累積器(accumulator)及鼓風機 及其組合中之至少一者的加壓惰性氣體迴路之各種實施例。包括加壓惰性氣體迴路之各種實施例的加壓惰性氣體再循環系統之各種實施例可具有特別設計之壓力控制型旁通迴路,該旁通迴路可在本教示之氣體包體總成及系統中提供處於穩定的所定義值的惰性氣體內部壓力。在氣體包體總成及系統之各種實施例中,加壓惰性氣體再循環系統可經組配來當加壓惰性氣體迴路之累積器中的惰性氣體之壓力超出預先設定之臨界壓力時,經由壓力控制型旁通迴路來再循環加壓惰性氣體。臨界壓力可例如在約25psig(磅/平方吋表壓)至約200psig之間的範圍內,或更具體而言在約75psig至約125psig之間的範圍內,或更具體而言在約90psig至約95psig之間的範圍內。就此而言,具有擁有特別設計之壓力控制型旁通迴路的加壓惰性氣體再循環系統的本教示之氣體包體總成及系統可維持在氣密式密封型氣體包體中具有加壓惰性氣體再循環系統之平衡。 For various embodiments of gas inclusion assemblies and systems, pressurized inert gas recirculation systems in accordance with the present teachings can include available compressors, accumulators, and blowers Various embodiments of pressurized inert gas circuits of at least one of the combinations and combinations thereof. Various embodiments of pressurized inert gas recirculation systems including various embodiments of pressurized inert gas circuits may have specially designed pressure controlled bypass circuits that may be used in the gas inclusion assemblies and systems of the present teachings. The internal pressure of the inert gas at a stable defined value is provided. In various embodiments of the gas inclusion assembly and system, the pressurized inert gas recirculation system can be configured to pass through when the pressure of the inert gas in the accumulator of the pressurized inert gas loop exceeds a predetermined threshold pressure A pressure controlled bypass circuit recirculates the pressurized inert gas. The critical pressure can, for example, range between about 25 psig to about 200 psig, or more specifically between about 75 psig to about 125 psig, or more specifically about 90 psig to Within the range of about 95 psig. In this regard, the gas inclusion assembly and system of the present teachings having a pressurized inert gas recirculation system having a specially designed pressure controlled bypass circuit can maintain a pressurized inertness in a hermetically sealed gas enclosure. The balance of the gas recirculation system.

根據本教示,各種裝置及設備可佈置於內部中且與具有各種加壓惰性氣體迴路之加壓惰性氣體再循環系統之各種實施例流體連通,該等加壓惰性氣體迴路可利用多種加壓氣體源,諸如壓縮機、鼓風機及其組合中之至少一者。對於本教示之氣體包體及系統的各種實施例,各種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。可佈置於氣體包體總成及系統之內部中且與各種加壓惰性氣體迴路流體連通的示例性裝置及設備可包括:例如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。基板漂浮台以及空氣軸承可用於操作根據本教示之氣體包體總成的各種實施例之OLED列印系統的各方面。例如,利用空氣軸承技術之基板漂浮台可 用來將基板傳送至列印頭腔室中之位置中,以及用來在OLED列印處理期間支撐基板。 In accordance with the present teachings, various devices and apparatus can be disposed in the interior and in fluid communication with various embodiments of a pressurized inert gas recirculation system having various pressurized inert gas circuits that can utilize a plurality of pressurized gases A source, such as at least one of a compressor, a blower, and combinations thereof. For various embodiments of the gas enclosures and systems of the present teachings, the use of various pneumatically operated devices and devices provides low particle generation performance and low maintenance. Exemplary devices and apparatus that may be disposed in the interior of the gas containment assembly and system and in fluid communication with various pressurized inert gas circuits may include, for example, but are not limited to, pneumatic robots, substrate floating tables, air bearings, air casings, One or more of a compressed gas tool, a pneumatic actuator, and combinations thereof. The substrate floating table and air bearing can be used to operate aspects of the OLED printing system of various embodiments of the gas inclusion assembly in accordance with the present teachings. For example, a substrate floating platform using air bearing technology can Used to transfer the substrate into a position in the printhead chamber and to support the substrate during the OLED printing process.

A‧‧‧管線/反應性物種 A‧‧‧pipeline/reactive species

B‧‧‧電線/惰性氣體物種 B‧‧‧Wire/Inert Gas Species

C‧‧‧同軸電纜 C‧‧‧Coaxial cable

D‧‧‧無效空間 D‧‧‧Invalid space

FH1‧‧‧第一懸浮高度 FH 1 ‧‧‧First levitation height

FH2‧‧‧第二懸浮高度 FH 2 ‧‧‧Second levitation height

I‧‧‧第一墊圈/第一墊圈長度/束 I‧‧‧First washer/first washer length/bundle

I’‧‧‧墊圈分段 I’‧‧‧Washer segmentation

II‧‧‧墊圈/第二墊圈長度/管道 II‧‧‧Gasket/Second Washer Length/Pipeline

II’‧‧‧墊圈分段 II’‧‧·washer segmentation

III‧‧‧墊圈/惰性氣體 III‧‧‧Gas/Inert Gas

III’‧‧‧墊圈分段 III’‧‧·washer segmentation

W1‧‧‧接觸長度 W 1 ‧‧‧contact length

W2‧‧‧接觸長度 W 2 ‧‧‧contact length

W3‧‧‧接觸長度 W 3 ‧‧‧Contact length

V1‧‧‧閥 V 1 ‧‧‧ valve

V2‧‧‧閥 V 2 ‧‧‧ valve

V3‧‧‧閥 V 3 ‧‧‧ valve

V4‧‧‧閥 V 4 ‧‧‧ valve

10‧‧‧嵌入式面板區段 10‧‧‧Embedded panel section

12‧‧‧框架 12‧‧‧Frame

14‧‧‧盲螺紋孔 14‧‧‧Blind threaded holes

15‧‧‧螺釘 15‧‧‧ screws

16‧‧‧壓縮墊圈 16‧‧‧Compressed washers

20‧‧‧窗口面板區段 20‧‧‧window panel section

22‧‧‧框架 22‧‧‧Frame

30‧‧‧服務窗口面板區段 30‧‧‧Service window panel section

32‧‧‧框架 32‧‧‧Frame

34‧‧‧窗口導引間隔物 34‧‧‧Window guiding spacer

35‧‧‧窗口夾 35‧‧‧Window folder

36‧‧‧夾緊座 36‧‧‧Clamping seat

38‧‧‧可壓縮墊圈 38‧‧‧Compressible washers

40‧‧‧天花板框架區段 40‧‧‧Ceiling frame section

41‧‧‧第一側 41‧‧‧ first side

42‧‧‧天花板框架梁 42‧‧‧ ceiling frame beams

43‧‧‧第二側 43‧‧‧ second side

44‧‧‧天花板框架梁 44‧‧‧ ceiling frame beams

45‧‧‧第一照明元件 45‧‧‧First lighting element

46‧‧‧照明元件 46‧‧‧Lighting elements

47‧‧‧第二照明元件 47‧‧‧second lighting element

50‧‧‧OLED列印系統 50‧‧‧OLED printing system

54‧‧‧基板漂浮台 54‧‧‧Substrate floating table

56‧‧‧橋 56‧‧ ‧Bridge

58‧‧‧空氣軸承 58‧‧‧Air bearing

70‧‧‧花崗岩台 70‧‧‧ Granite table

87‧‧‧間隔物/間隔塊 87‧‧‧ spacer/spacer block

89‧‧‧間隔物/間隔塊 89‧‧‧ spacer/spacer block

90‧‧‧間隔塊條 90‧‧‧ interval block

91‧‧‧間隔物/間隔塊 91‧‧‧ spacer/spacer block

92‧‧‧橫向側 92‧‧‧ lateral side

93‧‧‧間隔物/間隔塊 93‧‧‧ spacer/spacer block

94‧‧‧頂部表面 94‧‧‧ top surface

95‧‧‧間隔物/間隔塊 95‧‧‧ spacer/spacer block

96‧‧‧底部表面 96‧‧‧ bottom surface

97‧‧‧間隔物/間隔塊 97‧‧‧ spacer/spacer block

100‧‧‧氣體包體總成 100‧‧‧ gas inclusion assembly

103‧‧‧風扇過濾單元罩蓋 103‧‧‧Fan filter unit cover

105‧‧‧第一天花板框架管道 105‧‧‧First ceiling frame duct

107‧‧‧第二天花板框架管道 107‧‧‧Second ceiling frame duct

109‧‧‧薄片金屬面板區段 109‧‧‧Sheet metal panel section

110‧‧‧嵌入式面板 110‧‧‧Embedded panel

120‧‧‧窗口面板 120‧‧‧window panel

122‧‧‧面板框架 122‧‧‧ Panel frame

124‧‧‧窗口 124‧‧‧ window

130‧‧‧易於移除之服務窗口 130‧‧‧Easy to remove service window

131‧‧‧內部表面 131‧‧‧Internal surface

132‧‧‧服務窗口框架 132‧‧‧Service window frame

134‧‧‧窗口 134‧‧‧ window

136‧‧‧反作用肘節夾 136‧‧‧Reaction toggle clamp

138‧‧‧窗口把手 138‧‧‧Window handle

140‧‧‧手套埠 140‧‧‧Gloves

142‧‧‧手套 142‧‧‧ gloves

150‧‧‧蓋子 150‧‧‧ cover

151‧‧‧內部表面 151‧‧‧Internal surface

152‧‧‧側 152‧‧‧ side

153‧‧‧外部表面 153‧‧‧External surface

154‧‧‧輪緣 154‧‧ rim

155‧‧‧螺釘桿 155‧‧‧ Screw rod

156‧‧‧有肩螺釘 156‧‧‧ shoulder screws

157‧‧‧頭部/有肩螺釘頭部 157‧‧‧ head/shoulder head

160‧‧‧手套埠硬體總成 160‧‧‧Gloves hardware assembly

161‧‧‧後部板 161‧‧‧ rear panel

162‧‧‧螺紋螺釘頭部 162‧‧‧Threaded screw head

163‧‧‧前部板 163‧‧‧front board

164‧‧‧凸緣 164‧‧‧Flange

165‧‧‧槽口/開口 165‧‧‧ notch/opening

166‧‧‧卡口式閂鎖 166‧‧‧ bayonet latch

167‧‧‧鎖定凹部 167‧‧‧Lock recess

168‧‧‧槽口 168‧‧‧ notch

169‧‧‧O型環密封件 169‧‧‧O-ring seals

200‧‧‧框架構件總成 200‧‧‧Frame component assembly

201‧‧‧前部外圍邊緣 201‧‧‧ front peripheral edge

202‧‧‧底座 202‧‧‧Base

204‧‧‧底盤 204‧‧‧Chassis

205‧‧‧右側外圍邊緣 205‧‧‧ right peripheral edge

207‧‧‧後部外圍邊緣 207‧‧‧ rear peripheral edge

210‧‧‧前部壁框架/第一壁框架 210‧‧‧Front wall frame/first wall frame

210’‧‧‧前部壁面板/第一壁面板 210'‧‧‧Front wall panel / first wall panel

220‧‧‧壁框架 220‧‧‧ wall frame

220’‧‧‧左側壁面板/壁面板 220’‧‧‧Left wall panel/wall panel

226‧‧‧頂部 226‧‧‧ top

227‧‧‧頂部壁框架間隔板 227‧‧‧Top wall frame spacer

228‧‧‧底部 228‧‧‧ bottom

229‧‧‧底部壁框架間隔板 229‧‧‧Bottom wall frame spacer

230‧‧‧右側或第三壁框架/壁框架 230‧‧‧Right or third wall frame/wall frame

230’‧‧‧右側壁面板/第三壁面板/壁面板 230'‧‧‧right wall panel / third wall panel / wall panel

240‧‧‧壁框架 240‧‧‧ wall frame

240’‧‧‧後部壁面板/壁面板 240'‧‧‧Rear wall panel/wall panel

250‧‧‧天花板框架 250‧‧‧ ceiling frame

250’‧‧‧天花板面板 250'‧‧‧ Ceiling panel

251‧‧‧內部部分 251‧‧‧ internal part

300‧‧‧密封總成 300‧‧‧ Sealing assembly

302‧‧‧間隙/墊圈間隙 302‧‧‧Gap/washer clearance

304‧‧‧間隙/墊圈間隙 304‧‧‧Gap/washer clearance

306‧‧‧墊圈間隙 306‧‧‧Washer clearance

310‧‧‧壁框架/第一壁框架 310‧‧‧ wall frame / first wall frame

311‧‧‧內部側/內部框架構件 311‧‧‧Internal side/internal frame members

312‧‧‧間隔板 312‧‧‧ spacer

314‧‧‧垂直側 314‧‧‧Vertical side

315‧‧‧頂部表面 315‧‧‧ top surface

316‧‧‧間隔板 316‧‧‧ Spacer

317‧‧‧內部邊緣 317‧‧‧Internal edge

320‧‧‧第一墊圈/墊圈 320‧‧‧First washer/washer

321‧‧‧垂直墊圈長度 321‧‧‧Vertical gasket length

323‧‧‧曲線墊圈長度 323‧‧‧ Curved washer length

325‧‧‧墊圈長度/長度 325‧‧‧Washer length/length

340‧‧‧第二墊圈/墊圈 340‧‧‧Second washer/washer

345‧‧‧長度 345‧‧‧ length

350‧‧‧壁框架/第二壁框架 350‧‧‧ wall frame/second wall frame

353‧‧‧外部框架側 353‧‧‧External frame side

354‧‧‧垂直側 354‧‧‧Vertical side

355‧‧‧頂部表面 355‧‧‧ top surface

356‧‧‧間隔板 356‧‧‧ Spacer

360‧‧‧第一墊圈/墊圈 360‧‧‧First washer/washer

361‧‧‧水平長度 361‧‧‧ horizontal length

363‧‧‧曲線長度 363‧‧‧ Curve length

365‧‧‧長度 365‧‧‧ length

370‧‧‧天花板框架 370‧‧‧ ceiling frame

400‧‧‧氣體包體框架總成 400‧‧‧ gas inclusion frame assembly

402‧‧‧升降器總成 402‧‧‧lifter assembly

404‧‧‧升降器總成 404‧‧‧lifter assembly

406‧‧‧升降器總成 406‧‧‧lifter assembly

408‧‧‧磨損墊 408‧‧‧ wear pad

410‧‧‧安裝板 410‧‧‧Installation board

412‧‧‧第一夾鉗座 412‧‧‧First clamp seat

413‧‧‧第二夾鉗座 413‧‧‧Second clamp seat

414‧‧‧第一夾鉗 414‧‧‧First clamp

415‧‧‧第二夾鉗 415‧‧‧second clamp

416‧‧‧千斤頂曲柄 416‧‧‧ jack crank

418‧‧‧千斤頂軸桿 418‧‧‧ jack shaft

422‧‧‧千斤頂底座 422‧‧‧ jack base

424‧‧‧腳座 424‧‧‧ feet

426‧‧‧整平腳 426‧‧‧ leveling feet

433‧‧‧頂部面板天花板 433‧‧‧Top panel ceiling

500‧‧‧管道總成 500‧‧‧ Pipeline assembly

502‧‧‧入口管道總成 502‧‧‧Inlet pipe assembly

505‧‧‧天花板管道 505‧‧‧ ceiling duct

507‧‧‧天花板管道 507‧‧‧ ceiling duct

510‧‧‧前部壁面板管道總成 510‧‧‧Front wall panel pipe assembly

511‧‧‧開口 511‧‧‧ openings

512‧‧‧前部壁面板入口管道 512‧‧‧Front wall panel inlet duct

514‧‧‧第一前部壁面板豎管 514‧‧‧First front wall panel standpipe

515‧‧‧出口 515‧‧‧Export

516‧‧‧第二前部壁面板豎管 516‧‧‧Second front wall panel standpipe

517‧‧‧出口 517‧‧‧Export

520‧‧‧左側壁面板管道總成 520‧‧‧Left wall panel pipe assembly

521‧‧‧開口 521‧‧‧ openings

522‧‧‧左側壁面板入口管道 522‧‧‧Left wall panel inlet duct

524‧‧‧第一左側壁面板豎管 524‧‧‧First left side panel riser

525‧‧‧第一管道入口端 525‧‧‧First pipe inlet end

526‧‧‧左側壁面板第二豎管 526‧‧‧Second wall tube for left side wall panel

527‧‧‧第二管道出口端 527‧‧‧Second pipe outlet

528‧‧‧左側壁面板上部管道 528‧‧‧ upper wall panel upper duct

530‧‧‧右側壁面板總成 530‧‧‧right wall panel assembly

531‧‧‧開口 531‧‧‧ openings

532‧‧‧右側壁面板入口管道 532‧‧‧ right wall panel inlet pipe

533‧‧‧管道開口 533‧‧‧pipe opening

534‧‧‧右側壁面板第一豎管 534‧‧‧First wall tube for the right side wall panel

535‧‧‧第一管道入口端 535‧‧‧First pipe inlet end

536‧‧‧右側壁面板第二豎管/後部壁面板上部管道 536‧‧‧Right wall panel second riser/rear wall panel upper duct

537‧‧‧第二管道出口端 537‧‧‧Second pipe outlet

538‧‧‧右側壁面板上部管道 538‧‧‧ upper wall panel upper duct

540‧‧‧後部壁管道總成 540‧‧‧ rear wall duct assembly

541‧‧‧後部壁面板第一入口 541‧‧‧The first entrance to the rear wall panel

542‧‧‧後部壁面板入口管道 542‧‧‧Rear wall panel inlet duct

543‧‧‧後部壁面板第二入口 543‧‧‧Second entrance to the rear wall panel

544‧‧‧後部壁面板底部管道 544‧‧‧The bottom wall panel of the rear wall panel

545‧‧‧通風口 545‧‧‧ vents

547‧‧‧隔框 547‧‧‧Box

549‧‧‧第二隔框/隔框 549‧‧‧Second frame/frame

600‧‧‧氣體包體總成 600‧‧‧ gas inclusion assembly

605‧‧‧回流管道 605‧‧‧Return pipe

610‧‧‧嵌入式面板 610‧‧‧Embedded panel

630‧‧‧右側壁面板 630‧‧‧right wall panel

631‧‧‧開口 631‧‧‧ openings

632‧‧‧管道 632‧‧‧ Pipes

633‧‧‧滑動罩蓋 633‧‧‧Sliding cover

634‧‧‧第一束管道入口 634‧‧‧First bundle of pipe entrances

635‧‧‧頂部 635‧‧‧ top

636‧‧‧第二束管道入口 636‧‧‧Second bundle entrance

637‧‧‧上部分 637‧‧‧上上

640‧‧‧後部壁面板 640‧‧‧ rear wall panel

700‧‧‧漂浮台 700‧‧‧Floating table

710‧‧‧壓力-真空區 710‧‧‧Pressure-vacuum zone

720‧‧‧第一過渡區 720‧‧‧First transition zone

722‧‧‧第二過渡區 722‧‧‧Second transition zone

740‧‧‧僅壓力區 740‧‧‧pressure zone only

742‧‧‧熱交換器/僅壓力區 742‧‧‧Heat exchanger / pressure zone only

744‧‧‧熱交換器 744‧‧‧ heat exchanger

752‧‧‧風扇過濾單元 752‧‧‧Fan filter unit

754‧‧‧風扇過濾單元 754‧‧‧Fan filter unit

760‧‧‧基板之部分 760‧‧‧Part of the substrate

800‧‧‧漂浮台 800‧‧‧Floating station

810‧‧‧壓力-真空區 810‧‧‧Pressure-vacuum zone

820‧‧‧第一過渡區 820‧‧‧First transition zone

822‧‧‧第二過渡區 822‧‧‧Second transition zone

840‧‧‧僅壓力區 840‧‧‧ only pressure zone

842‧‧‧僅壓力區 842‧‧‧ only pressure zone

860‧‧‧基板 860‧‧‧Substrate

1000‧‧‧氣體包體總成 1000‧‧‧ gas inclusion assembly

1010‧‧‧氣體包體總成 1010‧‧‧ gas inclusion assembly

1050‧‧‧列印系統 1050‧‧‧Printing system

1051‧‧‧第一隔離體 1051‧‧‧First isolation body

1052‧‧‧漂浮台支撐體 1052‧‧‧Floating table support

1053‧‧‧第二隔離體 1053‧‧‧Second isolation

1054‧‧‧基板漂浮台 1054‧‧‧Substrate floating table

1058‧‧‧基板 1058‧‧‧Substrate

1070‧‧‧底座 1070‧‧‧Base

1070-1A‧‧‧陰影線 1070-1A‧‧‧Shaded line

1070-1B‧‧‧陰影線 1070-1B‧‧‧Shaded line

1070-2A‧‧‧陰影線結構 1070-2A‧‧‧Shaded structure

1070-2B‧‧‧陰影線結構 1070-2B‧‧‧Shaded structure

1071‧‧‧第一上表面/頂部表面 1071‧‧‧First upper surface/top surface

1072‧‧‧第一端部 1072‧‧‧ first end

1073‧‧‧第二上表面 1073‧‧‧Second upper surface

1074‧‧‧第二端部 1074‧‧‧second end

1075‧‧‧第一豎管 1075‧‧‧First standpipe

1076‧‧‧第一側 1076‧‧‧ first side

1077‧‧‧第二豎管 1077‧‧‧Second riser

1078‧‧‧第二側 1078‧‧‧ second side

1079‧‧‧橋 1079‧‧ ‧Bridge

1080‧‧‧第一列印頭總成 1080‧‧‧first print head assembly

1081‧‧‧第二列印頭總成 1081‧‧‧Second print head assembly

1082‧‧‧列印頭裝置 1082‧‧‧Print head device

1083‧‧‧列印頭裝置 1083‧‧‧Printing head device

1084‧‧‧第一列印頭總成包體 1084‧‧‧First print head assembly body

1085‧‧‧第二列印頭總成包體 1085‧‧‧Second print head assembly body

1086‧‧‧第一列印頭總成包體開口 1086‧‧‧First print head assembly opening

1088‧‧‧第一列印頭總成包體輪緣 1088‧‧‧First print head assembly body rim

1089‧‧‧第二列印頭總成包體輪緣 1089‧‧‧Second print head assembly body rim

1090‧‧‧第一列印頭總成定位系統 1090‧‧‧First print head assembly positioning system

1091‧‧‧第二列印頭總成定位系統 1091‧‧‧Second print head assembly positioning system

1092‧‧‧第一X軸托架 1092‧‧‧First X-axis bracket

1094‧‧‧第一Z軸活動板 1094‧‧‧First Z-axis movable board

1100‧‧‧前部框架總成 1100‧‧‧Front frame assembly

1100’‧‧‧前部面板總成 1100’‧‧‧Front panel assembly

1120‧‧‧前部底座框架/前部包體總成底座 1120‧‧‧Front base frame / front body assembly base

1120’‧‧‧前部底座面板總成 1120'‧‧‧Front base panel assembly

1121‧‧‧第一前部包體隔離體座 1121‧‧‧First front body isolation body seat

1122‧‧‧底盤 1122‧‧‧Chassis

1123‧‧‧第一前部包體隔離體壁框架 1123‧‧‧First front body insulation wall frame

1127‧‧‧第二前部包體隔離體壁框架 1127‧‧‧Second front body insulation wall frame

1140‧‧‧前部壁框架 1140‧‧‧Front wall frame

1140’‧‧‧前部壁面板總成 1140'‧‧‧Front wall panel assembly

1142‧‧‧開口 1142‧‧‧ openings

1144‧‧‧橋框架 1144‧‧ ‧Bridge frame

1146‧‧‧嵌入式框架 1146‧‧‧Inline frame

1147‧‧‧墊圈 1147‧‧‧Washers

1148‧‧‧開口 1148‧‧‧ openings

1150‧‧‧閘閥門總成 1150‧‧‧gate valve assembly

1151‧‧‧第一軌道 1151‧‧‧First track

1152‧‧‧第二軌道 1152‧‧‧second track

1153‧‧‧第一托架 1153‧‧‧First bracket

1154‧‧‧第二托架 1154‧‧‧second bracket

1158‧‧‧門 1158‧‧‧

1160‧‧‧前部天花板框架 1160‧‧‧Front ceiling frame

1160’‧‧‧天花板面板總成 1160'‧‧‧ Ceiling panel assembly

1200‧‧‧中間框架總成 1200‧‧‧Intermediate frame assembly

1200’‧‧‧中間面板總成 1200’‧‧‧Intermediate panel assembly

1220‧‧‧中間包體底座 1220‧‧‧Intermediate body base

1220’‧‧‧中間底座面板總成 1220'‧‧‧Intermediate base panel assembly

1221‧‧‧第一中間包體隔離體座 1221‧‧‧First intermediate inclusion body seat

1222‧‧‧底盤 1222‧‧‧Chassis

1223‧‧‧第一中間包體隔離體壁框架 1223‧‧‧First intermediate inclusion body wall frame

1224‧‧‧第一框架構件 1224‧‧‧First frame member

1225‧‧‧通道 1225‧‧‧ channel

1225’‧‧‧第一隔離體壁面板 1225'‧‧‧First isolation wall panel

1226‧‧‧第二框架構件 1226‧‧‧Second frame member

1227‧‧‧第二中間包體隔離體壁框架 1227‧‧‧Second intermediate inclusion body wall frame

1227’‧‧‧第二隔離體壁面板 1227'‧‧‧Second isolation wall panel

1228‧‧‧面板 1228‧‧‧ panel

1230’‧‧‧第一中間維護系統面板總成 1230'‧‧‧First Intermediate Maintenance System Panel Assembly

1235‧‧‧第一密封件支撐面板 1235‧‧‧First seal support panel

1237‧‧‧第一外表面 1237‧‧‧First outer surface

1238’‧‧‧第一後部壁面板總成 1238'‧‧‧First rear wall panel assembly

1240‧‧‧第一中間包體框架總成 1240‧‧‧First intermediate body frame assembly

1240’‧‧‧第一中間包體面板總成 1240'‧‧‧First intermediate body panel assembly

1241‧‧‧第一底板總成 1241‧‧‧First floor assembly

1241’‧‧‧第一底板總成 1241'‧‧‧ First floor assembly

1242‧‧‧第一列印頭總成開口 1242‧‧‧The first print head assembly opening

1245‧‧‧第一列印頭總成對接墊圈 1245‧‧‧First print head assembly butt washer

1247‧‧‧第一列印頭總成閘閥 1247‧‧‧First print head assembly gate valve

1250‧‧‧第一維護系統總成 1250‧‧‧First Maintenance System Assembly

1251‧‧‧第一維護系統定位系統 1251‧‧‧First Maintenance System Positioning System

1252‧‧‧液滴校準模組 1252‧‧‧Drop Calibration Module

1253‧‧‧第一維護系統總成平台 1253‧‧‧First Maintenance System Assembly Platform

1254‧‧‧沖洗盆模組 1254‧‧‧ Washing basin module

1256‧‧‧吸墨模組 1256‧‧‧ ink absorbing module

1260‧‧‧天花板框架總成 1260‧‧‧ ceiling frame assembly

1260’‧‧‧中間壁及天花板面板總成 1260'‧‧‧Intermediate wall and ceiling panel assembly

1261‧‧‧第一通道 1261‧‧‧First Passage

1263‧‧‧第一密封件 1263‧‧‧First seal

1265‧‧‧第二通道 1265‧‧‧second channel

1267‧‧‧第二密封件 1267‧‧‧Second seal

1270’‧‧‧第二中間維護系統面板總成 1270'‧‧‧Second intermediate maintenance system panel assembly

1275‧‧‧第二密封件支撐面板 1275‧‧‧Second seal support panel

1277‧‧‧第二外表面 1277‧‧‧Second outer surface

1278‧‧‧第二後部壁框架總成 1278‧‧‧Second rear wall frame assembly

1278’‧‧‧第二後部壁面板總成 1278'‧‧‧Second rear wall panel assembly

1280‧‧‧第二中間包體框架總成 1280‧‧‧Second intermediate body frame assembly

1280’‧‧‧第二中間包體面板總成 1280'‧‧‧Second intermediate body panel assembly

1281’‧‧‧第二底板總成 1281'‧‧‧Second floor assembly

1282‧‧‧第二列印頭總成開口 1282‧‧‧Second print head assembly opening

1285‧‧‧第二列印頭總成對接墊圈 1285‧‧‧Second print head assembly butt washer

1287‧‧‧第二列印頭總成閘閥 1287‧‧‧Second print head assembly gate valve

1290‧‧‧第二維護系統總成 1290‧‧‧Second maintenance system assembly

1291‧‧‧第二維護系統定位系統 1291‧‧‧Second maintenance system positioning system

1293‧‧‧第二維護總成系統平台 1293‧‧‧Second Maintenance Assembly System Platform

1300‧‧‧後部框架總成 1300‧‧‧ rear frame assembly

1300’‧‧‧後部面板總成 1300'‧‧‧ rear panel assembly

1320‧‧‧後部底座框架 1320‧‧‧Back base frame

1320’‧‧‧後部底座面板總成 1320'‧‧‧ rear base panel assembly

1321‧‧‧第一後部包體隔離體座 1321‧‧‧First rear body isolation seat

1322‧‧‧底盤 1322‧‧‧Chassis

1323‧‧‧後部中間包體隔離體壁框架 1323‧‧‧Rear intermediate inclusion body wall frame

1327‧‧‧第二後部包體隔離體壁框架 1327‧‧‧Second rear body insulation wall frame

1340‧‧‧後部壁框架 1340‧‧‧ rear wall frame

1340’‧‧‧後部壁面板總成 1340'‧‧‧ rear wall panel assembly

1360‧‧‧後部天花板框架 1360‧‧‧ Rear ceiling frame

1360’‧‧‧後部天花板面板總成 1360'‧‧‧ rear ceiling panel assembly

1500‧‧‧氣體包體總成/氣體包體總成腔室 1500‧‧‧Gas Inclusion Assembly/Gas Inclusion Assembly Chamber

1500-S1‧‧‧第一框架構件總成區段 1500-S1‧‧‧First frame member assembly section

1500-S2‧‧‧第二框架構件總成區段 1500-S2‧‧‧Second frame member assembly section

1510‧‧‧入口腔室 1510‧‧‧ entrance chamber

1512‧‧‧第一入口閘/閘 1512‧‧‧First entrance gate/gate

1514‧‧‧閘 1514‧‧‧ brake

1520‧‧‧出口腔室 1520‧‧‧Outlet chamber

1522‧‧‧閘 1522‧‧‧ brake

1524‧‧‧閘 1524‧‧‧ brake

1550‧‧‧基板 1550‧‧‧Substrate

1600‧‧‧系統控制器 1600‧‧‧System Controller

1700‧‧‧氣動控制系統 1700‧‧‧Pneumatic control system

1710‧‧‧惰性氣體源 1710‧‧‧Inert gas source

1712‧‧‧閥 1712‧‧‧Valve

1720‧‧‧真空源 1720‧‧‧Vacuum source

1722‧‧‧閥 1722‧‧‧ valve

2000‧‧‧氣體包體總成及系統 2000‧‧‧Gas inclusion body assembly and system

2100‧‧‧氣體包體總成及系統 2100‧‧‧Gas inclusion assembly and system

2130‧‧‧氣體淨化系統 2130‧‧‧Gas purification system

2131‧‧‧氣體淨化出口線路 2131‧‧‧ gas purification exit line

2132‧‧‧溶劑移除系統 2132‧‧‧Solvent removal system

2133‧‧‧入口線路 2133‧‧‧Entry line

2134‧‧‧氣體淨化系統 2134‧‧‧Gas purification system

2140‧‧‧熱調節系統 2140‧‧‧ Thermal Regulation System

2141‧‧‧急冷器 2141‧‧‧Quencher

2142‧‧‧第一熱交換器 2142‧‧‧First heat exchanger

2143‧‧‧流體出口線路 2143‧‧‧ Fluid outlet line

2144‧‧‧第二熱交換器 2144‧‧‧second heat exchanger

2145‧‧‧流體入口線路 2145‧‧‧ fluid inlet line

2146‧‧‧第三熱交換器 2146‧‧‧ third heat exchanger

2150‧‧‧過濾系統 2150‧‧‧Filter system

2151‧‧‧風扇過濾單元 2151‧‧‧Fan filter unit

2152‧‧‧風扇過濾單元 2152‧‧‧Fan filter unit

2153‧‧‧風扇過濾單元 2153‧‧‧Fan filter unit

2154‧‧‧風扇過濾單元 2154‧‧‧Fan filter unit

2155‧‧‧風扇過濾單元 2155‧‧‧Fan filter unit

2156‧‧‧風扇過濾單元 2156‧‧‧Fan filter unit

2160‧‧‧壓縮機迴路 2160‧‧‧Compressor circuit

2161‧‧‧第一旁通入口閥 2161‧‧‧First bypass inlet valve

2162‧‧‧壓縮機 2162‧‧‧Compressor

2163‧‧‧第二閥 2163‧‧‧Second valve

2164‧‧‧累積器 2164‧‧‧ accumulator

2165‧‧‧壓力控制型旁通迴路 2165‧‧‧Pressure controlled bypass circuit

2168‧‧‧第二累積器 2168‧‧‧Second accumulator

2169‧‧‧加壓惰性氣體再循環系統 2169‧‧‧ Pressurized inert gas recirculation system

2170‧‧‧管道系統 2170‧‧‧Pipe system

2171‧‧‧第一管道入口 2171‧‧‧First pipe entrance

2172‧‧‧第二管道入口 2172‧‧‧Second pipe entrance

2173‧‧‧第一管道導管 2173‧‧‧First conduit

2174‧‧‧第二管道導管 2174‧‧‧Second conduit

2175‧‧‧第一管道出口 2175‧‧‧First pipe exit

2176‧‧‧第二管道出口 2176‧‧‧Second pipe exit

2190‧‧‧鼓風機迴路 2190‧‧‧Blower circuit

2192‧‧‧殼體 2192‧‧‧shell

2193‧‧‧第一隔離閥 2193‧‧‧First isolation valve

2194‧‧‧第一鼓風機 2194‧‧‧First blower

2195‧‧‧止回閥 2195‧‧‧ check valve

2196‧‧‧可調整閥 2196‧‧‧Adjustable valve

2197‧‧‧第二隔離閥 2197‧‧‧Second isolation valve

2198‧‧‧熱交換器 2198‧‧‧ heat exchanger

2200‧‧‧氣體包體總成及系統 2200‧‧‧Gas inclusion assembly and system

2300‧‧‧氣體包體總成及系統 2300‧‧‧Gas inclusion assembly and system

2400‧‧‧氣體包體總成及系統 2400‧‧‧Gas inclusion assembly and system

2500‧‧‧外部迴路 2500‧‧‧External loop

2501‧‧‧氣體包體總成出口 2501‧‧‧ gas inclusion assembly outlet

2502‧‧‧第一機械閥 2502‧‧‧First mechanical valve

2503‧‧‧線路 2503‧‧‧ lines

2504‧‧‧第二機械閥 2504‧‧‧Second mechanical valve

2505‧‧‧閥 2505‧‧‧ valve

2506‧‧‧第三機械閥 2506‧‧‧ third mechanical valve

2507‧‧‧止回閥 2507‧‧‧ check valve

2508‧‧‧第四機械閥 2508‧‧‧fourth mechanical valve

2509‧‧‧封裝惰性氣體源 2509‧‧‧Encapsulated inert gas source

2510‧‧‧封裝惰性氣體線路 2510‧‧‧Encapsulated inert gas lines

2512‧‧‧清潔乾燥空氣源/CDA源 2512‧‧‧Clean dry air source/CDA source

2513‧‧‧低消耗量歧管 2513‧‧‧Low consumption manifold

2514‧‧‧交叉線第一區段 2514‧‧‧ Cross section first section

2516‧‧‧第一流量接點 2516‧‧‧First flow contact

2518‧‧‧第二流量接點 2518‧‧‧second flow contact

2520‧‧‧壓縮機惰性氣體線路 2520‧‧‧Compressor inert gas line

2522‧‧‧CDA線路 2522‧‧‧CDA line

2524‧‧‧高消耗量歧管線路 2524‧‧‧High consumption manifold line

2525‧‧‧高消耗量歧管 2525‧‧‧High consumption manifold

2526‧‧‧第三流量接點 2526‧‧‧ third flow contact

2528‧‧‧交叉線第二區段 2528‧‧‧ Cross section second section

2530‧‧‧閥 2530‧‧‧Valve

2550‧‧‧真空系統 2550‧‧‧vacuum system

2552‧‧‧線路 2552‧‧‧ lines

2554‧‧‧閥 2554‧‧‧Valves

3000‧‧‧氣體包體設備 3000‧‧‧Gas inclusion equipment

3100‧‧‧氣體包體總成及系統 3100‧‧‧Gas inclusion assembly and system

藉由參考隨附圖式,將獲得對本揭露內容之特徵及優勢的更好理解,該等隨附圖式意欲例展示而非限制本教示。 A better understanding of the features and advantages of the present disclosure will be obtained by the accompanying drawings.

圖1為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 1 is a schematic illustration of a gas inclusion assembly and system in accordance with various embodiments of the present teachings.

圖2為根據本教示之各種實施例的氣體包體總成及系統的左前部透視圖。 2 is a left front perspective view of a gas enclosure assembly and system in accordance with various embodiments of the present teachings.

圖3為根據本教示之各種實施例的氣體包體總成之右前部透視圖。 3 is a right front perspective view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖4描繪根據本教示之各種實施例的氣體包體總成之分解視圖。 4 depicts an exploded view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖5為框架構件總成之分解的前透視圖,其描繪根據本教示之各種實施例的各種面板框架區段及區段面板。 5 is an exploded front perspective view of a frame member assembly depicting various panel frame sections and section panels in accordance with various embodiments of the present teachings.

圖6A為手套埠蓋子之後部透視圖,而圖6B為根據本教示之氣體包體總成的各種實施例的手套埠蓋子之有肩螺釘(shoulder screw)的擴展視圖。 6A is a rear perspective view of the glove cartridge cover, and FIG. 6B is an expanded view of the shoulder screw of the glove cartridge cover in accordance with various embodiments of the gas enclosure assembly of the present teachings.

圖7A為手套埠封蓋總成之卡口式閂鎖的擴展透視圖,而圖7B為手套埠封蓋總成之截面圖,其展示有肩螺釘之頭部與卡口式閂鎖中之凹部的嚙合。 Figure 7A is an expanded perspective view of the bayonet latch of the glove gland cap assembly, and Figure 7B is a cross-sectional view of the glove gland cap assembly showing the head of the shoulder screw and the bayonet latch Engagement of the recess.

圖8A至圖8C為用於形成接縫之墊圈密封的各種實施例之 頂部示意圖。 8A-8C are various embodiments of a gasket seal for forming a seam The top schematic.

圖9A及圖9B為描繪根據本教示之氣體包體總成的各種實施例之框架構件的密封之各種透視圖。 9A and 9B are various perspective views depicting the sealing of frame members of various embodiments of gas inclusion assemblies in accordance with the present teachings.

圖10A至圖10B為與根據本教示之氣體包體總成的各種實施例的區段面板之密封相關的各種視圖,該區段面板用於接納易於移除之服務窗口。 10A-10B are various views related to sealing of segment panels in accordance with various embodiments of the gas enclosure assembly of the present teachings for receiving a service window that is easily removable.

圖11A至圖11B為與根據本教示之各種實施例之區段面板的密封相關之放大的透視截面圖,該區段面板用於接納嵌入式面板或窗口面板。 11A-11B are enlarged perspective cross-sectional views associated with sealing of a segment panel in accordance with various embodiments of the present teachings for receiving an embedded panel or window panel.

圖12A為根據本教示之各種實施例的底座,其包括底盤及擱置於底盤上之複數個間隔塊。圖12B為圖12A中所指示之間隔塊的擴展透視圖。 12A is a base including a chassis and a plurality of spacer blocks resting on the chassis, in accordance with various embodiments of the present teachings. Figure 12B is an expanded perspective view of the spacer block indicated in Figure 12A.

圖13為與根據本教示之各種實施例的底盤相關聯之壁框架構件及天花板構件的分解視圖。 13 is an exploded view of a wall frame member and a ceiling member associated with a chassis in accordance with various embodiments of the present teachings.

圖14A為根據本教示之各種實施例的氣體包體總成之一建構階段之透視圖,其中升降器總成位於升高的位置中。圖14B為圖14A中所指示之升降器總成的分解視圖。 14A is a perspective view of one stage of construction of a gas enclosure assembly in accordance with various embodiments of the present teachings, with the elevator assembly in an elevated position. Figure 14B is an exploded view of the elevator assembly indicated in Figure 14A.

圖15為氣體包體總成之假想前部透視圖,其描繪安裝於根據本教示之各種實施例的氣體包體總成內部的管道。 15 is a phantom front perspective view of a gas enclosure assembly depicting a conduit mounted within a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖16為氣體包體總成之假想頂部透視圖,其描繪安裝於根據本教示之各種實施例的氣體包體總成內部的管道。 16 is an imaginary top perspective view of a gas enclosure assembly depicting a conduit mounted within a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖17為氣體包體總成之假想底部透視圖,其描繪安裝於根 據本教示之各種實施例的氣體包體總成內部的管道。 Figure 17 is an imaginary bottom perspective view of the gas inclusion assembly, depicted in the root A conduit inside the gas enclosure assembly in accordance with various embodiments of the present teachings.

圖18A為展示電纜、線及管線以及類似物之多個束的示意性表示。圖18B描繪氣體吹掃經過經由根據本教示之管道的各種實施例來饋送之此等束。 Figure 18A is a schematic representation showing a plurality of bundles of cables, wires and lines, and the like. Figure 18B depicts such a bundle of gas purges fed through various embodiments via a conduit in accordance with the present teachings.

圖19為展示如何藉由惰性氣體(B)吹掃過該等束所選路通過之管道來主動沖洗吸留在電纜、線、管線以及類似物之多個束之無效空間中的反應性物種(A)之示意性表示。 Figure 19 is a diagram showing how reactive species that are immersed in the dead spaces of a plurality of bundles of cables, wires, pipelines, and the like are actively flushed by purging the tubes through which the selected passages are passed by inert gas (B). Schematic representation of (A).

圖20A為根據本教示之氣體包體總成及系統的各種實施例之選路通過管道的電纜及管線之假想透視圖。圖20B為圖20A中所示之開口的放大視圖,其展示根據本教示之氣體包體總成的各種實施例之用於封閉住該開口之罩蓋的細節。 20A is an phantom perspective view of cables and tubing for routing through a conduit in accordance with various embodiments of the present gas enclosure assembly and system. 20B is an enlarged view of the opening shown in FIG. 20A showing details of a cover for closing the opening in accordance with various embodiments of the gas enclosure assembly of the present teachings.

圖21為根據本教示之各種實施例的用於氣體包體總成及系統之天花板之視圖,該天花板包括照明系統。 21 is a view of a ceiling for a gas enclosure assembly and system including a lighting system in accordance with various embodiments of the present teachings.

圖22為描繪根據本教示之各種實施例的用於氣體包體總成及系統組件之照明系統的LED光譜之曲線圖。 22 is a graph depicting LED spectra for an illumination system for a gas inclusion assembly and system components in accordance with various embodiments of the present teachings.

圖23為根據本教示之各種實施例的氣體包體總成之視圖的前部透視圖。 23 is a front perspective view of a view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖24描繪根據本教示之各種實施例的如圖23中所描繪之氣體包體總成的各種實施例之分解視圖。 24 depicts an exploded view of various embodiments of the gas enclosure assembly as depicted in FIG. 23, in accordance with various embodiments of the present teachings.

圖25描繪根據本教示之各種實施例的氣體包體總成之各種實施例之部分分解的前部透視圖。 25 depicts a partially exploded front perspective view of various embodiments of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖26描繪根據本教示之各種實施例的如圖25中所描繪之氣 體包體總成的各種實施例之部分分解的側面透視圖。 Figure 26 depicts the gas as depicted in Figure 25 in accordance with various embodiments of the present teachings. A partially exploded side perspective view of various embodiments of the body pack assembly.

圖27A及圖27B描繪根據本教示之各種實施例的如圖26中所描繪之氣體包體總成的擴展視圖。 27A and 27B depict an expanded view of the gas enclosure assembly as depicted in FIG. 26, in accordance with various embodiments of the present teachings.

圖28為穿過根據本教示之各種實施例的框架構件總成的截面圖,該框架構件總成包括底座及豎管。 28 is a cross-sectional view through a frame member assembly in accordance with various embodiments of the present teachings, the frame member assembly including a base and a standpipe.

圖29為根據本教示之各種實施例的氣體包體總成之視圖的前部透視圖。 29 is a front perspective view of a view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖30描繪根據本教示之各種實施例的如圖29中所描繪之氣體包體總成的各種實施例之分解視圖。 FIG. 30 depicts an exploded view of various embodiments of the gas enclosure assembly as depicted in FIG. 29, in accordance with various embodiments of the present teachings.

圖31A為根據圖29中所描繪之氣體包體的各種實施例之氣體包體總成的橫截面圖。 31A is a cross-sectional view of a gas inclusion assembly in accordance with various embodiments of the gas enclosure depicted in FIG.

圖31B及圖31C為圖29中所描繪之氣體包體總成的橫截面圖,其描繪根據本教示之各種實施例的移動至維護位置中的列印頭總成之連續移動。 31B and 31C are cross-sectional views of the gas enclosure assembly depicted in FIG. 29 depicting the continuous movement of the printhead assembly moved into the maintenance position in accordance with various embodiments of the present teachings.

圖31D至圖31F為根據圖29中所描繪之氣體包體的各種實施例之氣體包體總成的橫截面圖。 31D-31F are cross-sectional views of a gas inclusion assembly in accordance with various embodiments of the gas enclosure depicted in FIG.

圖32描繪根據本教示之各種實施例的安裝於如圖29中所描繪之氣體包體總成的框架總成區段中之維護台的透視圖。 32 depicts a perspective view of a maintenance station mounted in a frame assembly section of the gas enclosure assembly as depicted in FIG. 29, in accordance with various embodiments of the present teachings.

圖33為根據本教示之各種實施例的如圖29中所描繪之氣體包體總成之框架總成區段的透視圖。 33 is a perspective view of a frame assembly section of the gas enclosure assembly as depicted in FIG. 29, in accordance with various embodiments of the present teachings.

圖34A及圖34B為本教示之氣體包體總成及相關系統組件的各種實施例之示意圖。 34A and 34B are schematic illustrations of various embodiments of the gas inclusion assembly and associated system components of the teachings.

圖35為氣體包體總成及系統之示意圖,其描繪通過根據本教示之各種實施例的氣體包體總成之氣體循環之實施例。 35 is a schematic illustration of a gas inclusion assembly and system depicting an embodiment of a gas cycle through a gas inclusion assembly in accordance with various embodiments of the present teachings.

圖36為氣體包體總成及系統之示意圖,其描繪通過根據本教示之各種實施例的氣體包體總成之氣體循環之實施例。 36 is a schematic illustration of a gas inclusion assembly and system depicting an embodiment of a gas cycle through a gas inclusion assembly in accordance with various embodiments of the present teachings.

圖37為根據本教示之各種實施例的氣體包體總成之橫截面示意圖。 37 is a schematic cross-sectional view of a gas enclosure assembly in accordance with various embodiments of the present teachings.

圖38為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 38 is a schematic illustration of a gas inclusion assembly and system in accordance with various embodiments of the present teachings.

圖39為根據本教示之各種實施例的氣體包體總成及系統的示意圖。 39 is a schematic illustration of a gas inclusion assembly and system in accordance with various embodiments of the present teachings.

圖40為展示用於根據本教示之各種實施例的氣體包體總成及系統的各種操作模式之閥位置之表,該氣體包體總成及系統可利用外部氣體迴路。 40 is a table showing valve positions for various modes of operation of a gas inclusion assembly and system in accordance with various embodiments of the present teachings, the gas inclusion assembly and system utilizing an external gas circuit.

圖41為描繪根據本教示之各種實施例的漂浮台之前部透視圖。 41 is a front perspective view depicting a floating table in accordance with various embodiments of the present teachings.

圖42為圖40中所指示之用於根據本教示之各種實施例的漂浮台之區域的擴展視圖。 42 is an expanded view of the area indicated in FIG. 40 for a floating table in accordance with various embodiments of the present teachings.

圖43A及圖43B為展示基板在如圖40中所描繪之漂浮台上方行進期間所產生的彎曲之示意性截面圖。 43A and 43B are schematic cross-sectional views showing the curvature produced by the substrate during travel over the floating table as depicted in FIG.

圖44為描繪根據本教示之漂浮台的各種實施例之漂浮台的前部透視圖。 44 is a front perspective view of a floating table depicting various embodiments of a floating table in accordance with the present teachings.

圖45A及圖45B為展示基板在如圖43中所描繪之漂浮台上 方行進期間的大致平坦佈置之示意性截面圖。 45A and 45B show the substrate on a floating table as depicted in FIG. A schematic cross-sectional view of a substantially flat arrangement during square travel.

如前面所討論,基板漂浮台以及空氣軸承之各種實施例可用於封裝在根據本教示之氣體包體總成中的OLED列印系統之各種實施例的操作。如圖1中關於氣體包體總成及系統2000示意性地展示,利用空氣軸承技術之基板漂浮台可用來將基板傳送至列印頭腔室中之位置中,以及用來在OLED列印處理期間支撐基板。在圖1中,氣體包體總成1500可為可具有入口腔室1510之負載鎖定系統,該入口腔室用於經由第一入口閘1512及閘1514接納基板,以便將基板自入口腔室1510移動至氣體包體總成1500來進行列印。根據本教示之各種閘可用來將腔室彼此隔離以及與外部周圍環境隔離。根據本教示,各種閘可選自實體閘及氣體簾幕。 As discussed above, various embodiments of the substrate floating table and air bearing can be used to operate the various embodiments of the OLED printing system packaged in the gas inclusion assembly in accordance with the present teachings. As schematically illustrated in FIG. 1 with respect to gas inclusion assembly and system 2000, a substrate floating table utilizing air bearing technology can be used to transfer the substrate into a position in the printhead chamber and for printing on the OLED. Support the substrate during the period. In FIG. 1 , the gas inclusion assembly 1500 can be a load lock system that can have an inlet chamber 1510 for receiving a substrate via a first inlet gate 1512 and a gate 1514 to route the substrate from the inlet chamber 1510 Move to the gas inclusion assembly 1500 for printing. Various gates in accordance with the present teachings can be used to isolate chambers from each other and from the surrounding environment. According to the present teachings, the various gates can be selected from physical gates and gas curtains.

在基板接納處理期間,閘1512可打開,而閘1514可處於關閉位置以便防止大氣氣體進入氣體包體總成1500。一旦基板被接納於入口腔室1510中,則兩個閘1512及1514均可關閉,且可使用諸如氮氣、稀有氣體中之任一者及其任一組合的惰性氣體來沖洗入口腔室1510,直至反應性大氣氣體係處於100ppm或更低之低含量,例如10ppm或更低、1.0ppm或更低或者0.1ppm或更低。大氣氣體達到足夠低的含量之後,閘1514可打開,而閘1512保持關閉,以便允許基板1550自入口腔室1510傳送至氣體包體總成腔室1500,如圖1中所描繪。自入口腔室1510至氣體包體總成腔室1500之基板傳送可經由例如但不限於腔室1500及1510中所提供之漂浮台。自入口腔室1510至氣體包體總成腔室1500之基板傳送亦可經由例如但不限於基板傳送機器人,該基板傳送機器人可將基板1550置放至腔室 1500中所提供之漂浮台上。在列印處理期間,基板1550可保持支撐於基板漂浮台上。 During the substrate receiving process, the gate 1512 can be opened and the gate 1514 can be in a closed position to prevent atmospheric gases from entering the gas inclusion assembly 1500. Once the substrate is received in the inlet chamber 1510, both gates 1512 and 1514 can be closed, and the inlet chamber 1510 can be flushed using an inert gas such as nitrogen, a noble gas, or any combination thereof. Until the reactive atmospheric gas system is at a low level of 100 ppm or less, such as 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. After the atmospheric gas reaches a sufficiently low level, the gate 1514 can be opened and the gate 1512 remains closed to allow the substrate 1550 to be transferred from the inlet chamber 1510 to the gas inclusion assembly chamber 1500, as depicted in FIG. Substrate transfer from the inlet chamber 1510 to the gas inclusion assembly chamber 1500 can be via, for example, but not limited to, a floating table provided in the chambers 1500 and 1510. Substrate transfer from the inlet chamber 1510 to the gas inclusion assembly chamber 1500 can also be via a substrate transfer robot, such as, but not limited to, a substrate transfer robot that can place the substrate 1550 into the chamber Floating platform provided in 1500. The substrate 1550 can remain supported on the substrate floating table during the printing process.

氣體包體總成及系統2000之各種實施例可具有經由閘1524與氣體包體總成1500流體連通的出口腔室1520。根據氣體包體總成及系統2000之各種實施例,列印處理完成之後,可將基板1550經由閘1524自氣體包體總成1500傳送至出口腔室1520。自氣體包體總成腔室1500至出口腔室1520之基板傳送可係經由例如但不限於腔室1500及1520中所提供之漂浮台。自氣體包體總成腔室1500至出口腔室1520之基板傳送亦可經由例如但不限於基板傳送機器人,該基板傳送機器人可自腔室1500中所提供之漂浮台拾取基板1550並且將其傳送至腔室1520中。對於氣體包體總成及系統2000之各種實施例,當閘1524處於關閉位置以便防止反應性大氣氣體進入氣體包體總成1500時,可經由閘1522自出口腔室1520取回基板1550。 Various embodiments of the gas inclusion assembly and system 2000 can have an outlet chamber 1520 in fluid communication with the gas inclusion assembly 1500 via a gate 1524. According to various embodiments of the gas inclusion assembly and system 2000, after the printing process is complete, the substrate 1550 can be transferred from the gas inclusion assembly 1500 to the outlet chamber 1520 via the gate 1524. Substrate transfer from the gas inclusion assembly chamber 1500 to the exit chamber 1520 can be via, for example, but not limited to, floating stations provided in chambers 1500 and 1520. The substrate transfer from the gas inclusion assembly chamber 1500 to the outlet chamber 1520 can also be via a substrate transfer robot such as, but not limited to, a substrate transfer robot that can pick up the substrate 1550 from the floating table provided in the chamber 1500 and transfer it Into the chamber 1520. For various embodiments of the gas inclusion assembly and system 2000, when the gate 1524 is in the closed position to prevent reactive atmospheric gases from entering the gas inclusion assembly 1500, the substrate 1550 can be retrieved from the outlet chamber 1520 via the gate 1522.

除了包括分別經由閘1514及閘1524與氣體包體總成1500流體連通之入口腔室1510及出口腔室1520之負載鎖定系統之外,氣體包體總成及系統2000亦可包括系統控制器1600。系統控制器1600可包括與一或多個記憶體電路(未圖示)連通之一或多個處理器電路(未圖示)。系統控制器1600亦可與包括入口腔室1510及出口腔室1520之負載鎖定系統連通,且最終與OLED列印系統之列印噴嘴連通。以此方式,系統控制器1600可協調閘1512、1514、1522及1524之打開與關閉。系統控制器1600亦可控制至OLED列印系統之列印噴嘴的墨水分配。可經由例如但不限於利用空氣軸承技術的基板漂浮台或利用空氣軸承技術之基板漂浮台與基板傳送機器人之組合來將基板1550傳送通過本教示之負載鎖定系統之各種實施例, 該負載鎖定系統包括分別經由閘1514及閘1524與氣體包體總成1500流體連通的入口腔室1510及出口腔室1520。 In addition to the load lock system including the inlet chamber 1510 and the outlet chamber 1520 in fluid communication with the gas inclusion assembly 1500 via the gate 1514 and the gate 1524, the gas inclusion assembly and system 2000 can also include a system controller 1600. . System controller 1600 can include one or more processor circuits (not shown) in communication with one or more memory circuits (not shown). System controller 1600 can also be in communication with a load lock system including inlet chamber 1510 and outlet chamber 1520, and ultimately in communication with the print nozzles of the OLED printing system. In this manner, system controller 1600 can coordinate the opening and closing of gates 1512, 1514, 1522, and 1524. System controller 1600 can also control the ink distribution to the print nozzles of the OLED printing system. The substrate 1550 can be transported through various embodiments of the load lock system of the present teachings via, for example, but not limited to, a substrate floating platform utilizing air bearing technology or a combination of a substrate floating platform and a substrate transfer robot utilizing air bearing technology. The load lock system includes an inlet chamber 1510 and an outlet chamber 1520 in fluid communication with the gas inclusion assembly 1500 via a gate 1514 and a gate 1524, respectively.

圖1之負載鎖定系統的各種實施例亦可包括氣動控制系統1700,該氣動控制系統可包括真空源及惰性氣體源,該惰性氣體源可包括氮氣、稀有氣體中之任一者及其任一組合。封裝在氣體包體總成及系統2000中之基板漂浮系統可包括多個真空埠及氣體軸承埠,該等埠通常佈置於平坦表面上。可藉由諸如氮氣、稀有氣體中之任一者及其任一組合的惰性氣體之壓力自硬質表面提起基板1550並且保持其離開硬質表面。軸承體積之流出係藉由多個真空埠來實現。基板1550在基板漂浮台上方之懸浮高度通常隨氣體壓力及氣體流量而變。氣動控制系統1700之真空及壓力可用來在圖1之負載鎖定系統中之氣體包體總成1500內部的處置期間,例如列印期間,支撐基板1550。控制系統1700亦可用來在傳送通過圖1之負載鎖定系統期間支撐基板1550,該負載鎖定系統包括分別經由閘1514及閘1524與氣體包體總成1500流體連通的入口腔室1510及出口腔室1520。為了控制傳送基板1550通過氣體包體總成及系統2000,系統控制器1600分別經由閥1712及1722與惰性氣體源1710及真空源1720連通。可將額外的真空及惰性氣體供應線路及閥(未圖示)提供給圖1中之負載鎖定系統所例示的氣體包體總成及系統2000,來進一步提供控制被包封環境所需的各種氣體及真空設施。 Various embodiments of the load lock system of FIG. 1 can also include a pneumatic control system 1700 that can include a vacuum source and an inert gas source, which can include any of nitrogen, a rare gas, and any combination. The substrate floating system packaged in the gas inclusion assembly and system 2000 can include a plurality of vacuum ports and gas bearing ports, which are typically disposed on a flat surface. The substrate 1550 can be lifted from the hard surface by a pressure of an inert gas such as nitrogen, a noble gas, or any combination thereof, and held away from the hard surface. The outflow of the bearing volume is achieved by a plurality of vacuum ports. The levitation height of the substrate 1550 above the substrate floating table is typically a function of gas pressure and gas flow. The vacuum and pressure of the pneumatic control system 1700 can be used to support the substrate 1550 during disposal within the gas enclosure assembly 1500 in the load lock system of FIG. 1, such as during printing. Control system 1700 can also be used to support substrate 1550 during transport through the load lock system of FIG. 1, the load lock system including inlet chamber 1510 and outlet chamber in fluid communication with gas enclosure assembly 1500 via gate 1514 and gate 1524, respectively. 1520. In order to control the transfer substrate 1550 through the gas inclusion assembly and system 2000, system controller 1600 is in communication with inert gas source 1710 and vacuum source 1720 via valves 1712 and 1722, respectively. Additional vacuum and inert gas supply lines and valves (not shown) may be provided to the gas enclosure assembly and system 2000 illustrated in the load lock system of Figure 1 to further provide the various controls required to control the enclosed environment. Gas and vacuum facilities.

為了給根據本教示之氣體包體總成及系統的各種實施例提供更為立體之視角,圖2係氣體包體總成及系統2000之各種實施例的左前部透視圖。圖2描繪包括氣體包體總成1500、入口腔室1510及第一閘1512 之負載鎖定系統。圖2之氣體包體總成及系統2000可包括氣體淨化系統2130,其用於給氣體包體總成1500提供具有大致上低含量之反應性大氣物種(諸如水蒸汽及氧氣以及由OLED列印處理產生的有機溶劑蒸汽)的惰性氣體的恆定供應。圖2之氣體包體總成及系統2000亦具有如前面所討論的用於系統控制功能之系統控制器1600。 To provide a more holistic view of various embodiments of the gas inclusion assembly and system in accordance with the present teachings, FIG. 2 is a left front perspective view of various embodiments of the gas inclusion assembly and system 2000. 2 depicts a gas inclusion assembly 1500, an inlet chamber 1510, and a first gate 1512 The load lock system. The gas inclusion body assembly and system 2000 of FIG. 2 can include a gas purification system 2130 for providing the gas inclusion assembly 1500 with a substantially low level of reactive atmospheric species (such as water vapor and oxygen and printing by OLED). A constant supply of inert gas to treat the resulting organic solvent vapor). The gas inclusion assembly and system 2000 of Figure 2 also has a system controller 1600 for system control functions as discussed above.

圖3為根據本教示之各種實施例的完全建構之氣體包體總成100之右前部透視圖。氣體包體總成100可含有用於在氣體包體總成內部中維持惰性環境的一或多種氣體。本教示之氣體包體總成及系統可用於在內部中維持惰性氣體氣氛。惰性氣體可為在一組所定義條件下不會經歷化學反應之任何氣體。惰性氣體之一些常用實例可包括氮氣、稀有氣體中之任一者及其任一組合。氣體包體總成100經組配來包圍且保護空氣敏感型處理,諸如使用工業列印系統之有機發光二極體(OLED)墨水列印。與OLED墨水起反應的大氣氣體之實例包括水蒸汽及氧氣。如前面所討論,氣體包體總成100可經組配來維持密封之氣氛且允許組件或列印系統有效地操作,同時避免對其他反應性材料及基板的污染、氧化及損壞。 3 is a right front perspective view of a fully constructed gas enclosure assembly 100 in accordance with various embodiments of the present teachings. The gas inclusion body assembly 100 can contain one or more gases for maintaining an inert environment within the interior of the gas inclusion body assembly. The gas inclusion assembly and system of the present teachings can be used to maintain an inert gas atmosphere in the interior. The inert gas can be any gas that does not undergo a chemical reaction under a defined set of conditions. Some common examples of inert gases may include any of nitrogen, a noble gas, and any combination thereof. The gas inclusion assembly 100 is assembled to surround and protect against air sensitive processing, such as organic light emitting diode (OLED) ink printing using an industrial printing system. Examples of atmospheric gases that react with OLED inks include water vapor and oxygen. As previously discussed, the gas inclusion assembly 100 can be assembled to maintain a sealed atmosphere and allow the assembly or printing system to operate efficiently while avoiding contamination, oxidation, and damage to other reactive materials and substrates.

如圖3中所描繪,氣體包體總成之各種實施例可包含組件部分,該等組件部分包括前部或第一壁面板210'、左側或第二壁面板(未圖示)、右側或第三壁面板230'、後部或第四壁面板(未圖示)以及天花板面板250',其中氣體包體總成可附接至擱置於底座(未圖示)上之底盤204。如隨後將更為詳細地討論,圖1之氣體包體總成100的各種實施例可由前部或第一壁框架210、左側或第二壁框架(未圖示)、右側或第三壁框架230、後部或第四壁面板(未圖示)以及天花板框架250建構而成。天花板框架 250之各種實施例可包括風扇過濾單元罩蓋103以及第一天花板框架管道105及第二天花板框架管道107。根據本教示之實施例,各種類型之區段面板可安裝於包含框架構件之複數個面板區段中之任一者中。在圖1之氣體包體總成100的各種實施例中,薄片金屬面板區段109可在框架之建構期間焊接至框架構件中。對於氣體包體總成100之各種實施例,在氣體包體總成之建構及解構週期中可反復安裝及移除的區段面板之類型可包括:關於壁面板210'所指示之嵌入式面板110,以及關於壁面板230'所指示之窗口面板120及易於移除之服務窗口130。 As depicted in Figure 3, various embodiments of the gas enclosure assembly can include component parts including a front or first wall panel 210', a left or second wall panel (not shown), a right side or A third wall panel 230', a rear or fourth wall panel (not shown), and a ceiling panel 250', wherein the gas enclosure assembly can be attached to the chassis 204 resting on a base (not shown). As will be discussed in greater detail later, various embodiments of the gas enclosure assembly 100 of FIG. 1 may be from a front or first wall frame 210, a left or second wall frame (not shown), a right or third wall frame. 230, a rear or fourth wall panel (not shown) and a ceiling frame 250 are constructed. Ceiling frame Various embodiments of 250 may include a fan filter unit cover 103 and a first ceiling frame duct 105 and a second ceiling frame duct 107. In accordance with embodiments of the present teachings, various types of segment panels can be mounted in any of a plurality of panel segments including frame members. In various embodiments of the gas enclosure assembly 100 of Figure 1, the sheet metal panel section 109 can be welded into the frame member during construction of the frame. For various embodiments of the gas inclusion assembly 100, the types of segment panels that can be repeatedly installed and removed during the construction and deconstruction cycle of the gas inclusion assembly can include: embedded panels as indicated with respect to the wall panel 210' 110, and a window panel 120 as indicated by wall panel 230' and a service window 130 that is easily removable.

儘管易於移除之服務窗口130可提供對包體100之內部的輕鬆接取,但任何可移除之面板可用來提供對氣體包體總成及系統之內部的接取,以便進行修理及定期服務。用於服務或修理之此接取與諸如窗口面板120及易於移除之服務窗口130之面板所提供之接取不同該等面板可提供在使用期間自氣體包體總成之外部對氣體包體總成之內部的終端使用者手套接取。例如,如圖3中關於面板230所展示,手套中之任一者(諸如附接至手套埠140之手套142)可提供在氣體包體總成系統之使用期間對內部的終端使用者接取。 While the easy-to-remove service window 130 provides for easy access to the interior of the enclosure 100, any removable panel can be used to provide access to the gas enclosure assembly and the interior of the system for repair and periodic maintenance. service. This access for service or repair differs from that provided by a panel such as window panel 120 and service window 130 that is easily removable, such panels may provide for gas inclusions from outside the gas inclusion assembly during use. The end user's gloves inside the assembly are picked up. For example, as shown with respect to panel 230 in FIG. 3, any of the gloves, such as glove 142 attached to glove cassette 140, can provide access to internal end users during use of the gas enclosure assembly system. .

圖4描繪圖3中所描繪之氣體包體總成的各種實施例之分解視圖。氣體包體總成之各種實施例可具有複數個壁面板,包括前部壁面板210'之外側透視圖、左側壁面板220'之外側透視圖、右側壁面板230'之內部透視圖、後部壁面板240’之內部透視圖以及天護板面板250'之頂部透視圖,如圖3中所展示,該等壁面板可附接至擱置於底座202上之底盤204。OLED列印系統可安裝於底盤204之頂部上,其中已知列印處理對大氣條件 敏感。根據本教示,氣體包體總成可由框架構件建構而成,例如壁面板210'之壁框架210、壁面板220'之壁框架220、壁面板230'之壁框架230、壁面板240'之壁框架240以及天花板面板250'之天花板框架250,隨後將複數個區段面板安裝於該等框架構件中。就此而言,可能需要簡化在本教示之氣體包體總成的各種實施例之建構及解構週期中可反復安裝及移除的區段面板之設計。此外,可進行氣體包體總成100之輪廓塑造來容納OLED列印系統之各種實施例的佔據面積,以便使氣體包體總成中所需要之惰性氣體的體積最小化,並且在氣體包體總成之使用期間以及在維護期間給終端使用者提供輕鬆接取。 4 depicts an exploded view of various embodiments of the gas inclusion assembly depicted in FIG. Various embodiments of the gas enclosure assembly can have a plurality of wall panels including an outer side perspective view of the front wall panel 210', an outer side perspective view of the left side wall panel 220', an interior perspective view of the right side wall panel 230', and a rear wall An interior perspective view of the panel 240' and a top perspective view of the sky panel panel 250', as shown in FIG. 3, can be attached to the chassis 204 resting on the base 202. An OLED printing system can be mounted on top of the chassis 204, where printing processing is known to atmospheric conditions sensitive. According to the present teachings, the gas inclusion body assembly may be constructed from a frame member, such as the wall frame 210 of the wall panel 210', the wall frame 220 of the wall panel 220', the wall frame 230 of the wall panel 230', and the wall of the wall panel 240'. The frame 240 and the ceiling frame 250 of the ceiling panel 250' are then mounted in the plurality of segment panels in the frame members. In this regard, it may be desirable to simplify the design of the segment panels that can be repeatedly installed and removed during the construction and deconstruction cycles of various embodiments of the gas enclosure assembly of the present teachings. In addition, contouring of the gas inclusion assembly 100 can be performed to accommodate the footprint of various embodiments of the OLED printing system to minimize the volume of inert gas required in the gas inclusion assembly and in the gas inclusions The end user is provided with easy access during use and during maintenance.

使用前部壁面板210'及左側壁面板220'作為示例,框架構件之各種實施例可具有在框架構件建構期間焊接至框架構件中的薄片金屬面板區段109。嵌入式面板110、窗口面板120及易於移除之服務窗口130可安裝於壁框架構件中之每一者中,且可在圖4之氣體包體總成100的建構及解構週期中反復安裝及移除。如可看出,在壁面板210'及壁面板220'之實例中,壁面板可具有靠近易於移除之服務窗口130的窗口面板120。類似地,如示例性後部壁面板240’中所描繪,壁面板可具有諸如窗口面板125之窗口面板,其具有兩個相鄰之手套埠140。對於根據本教示之壁框架構件的各種實施例,且及如關於圖3之氣體包體總成100所看出,此手套佈置提供自氣體包體之外部對被包封系統中的組件部分的輕鬆接取。因此,氣體包體之各種實施例可提供兩個或兩個以上手套埠,以使得終端使用者可將左側手套及右側手套延伸至內部中並且操縱內部中之一或多個物品而不擾亂內部中之氣態氣氛的組成物。例如,窗口面板120及服務窗口130中之任一者 可經定位來促進自氣體包體總成之外部對氣體包體總成之內部中的可調整組件的輕鬆接取。根據諸如窗口面板120及服務窗口130之窗口面板之各種實施例,當未指示經由手套埠手套之終端使用者接取時,此等窗口可能不包括手套埠及手套埠總成。 Using the front wall panel 210' and the left side wall panel 220' as an example, various embodiments of the frame member can have a sheet metal panel section 109 that is welded into the frame member during construction of the frame member. The embedded panel 110, the window panel 120, and the easily removable service window 130 can be mounted in each of the wall frame members and can be repeatedly installed during the construction and deconstruction cycle of the gas enclosure assembly 100 of FIG. Remove. As can be seen, in the example of wall panel 210' and wall panel 220', the wall panel can have a window panel 120 adjacent the service window 130 that is easily removable. Similarly, as depicted in the exemplary rear wall panel 240', the wall panel can have a window panel such as a window panel 125 having two adjacent glove pockets 140. For various embodiments of the wall frame members in accordance with the present teachings, and as seen with respect to the gas enclosure assembly 100 of FIG. 3, this glove arrangement is provided from the exterior of the gas enclosure to the component portions of the encapsulated system. Easy to pick up. Thus, various embodiments of the gas enclosure can provide two or more glove pockets such that the end user can extend the left and right gloves into the interior and manipulate one or more items in the interior without disturbing the interior The composition of the gaseous atmosphere in the middle. For example, any of the window panel 120 and the service window 130 The positioning can be positioned to facilitate easy access to the adjustable components in the interior of the gas enclosure assembly from outside the gas inclusion assembly. According to various embodiments of window panels, such as window panel 120 and service window 130, such windows may not include glove and glove assembly when not received by an end user via glove/glove gloves.

如圖4中所描繪之壁面板及天花板面板的各種實施例可具有複數個嵌入式面板110。如圖4中可看出,嵌入式面板可具有多種形狀及縱橫比。除了嵌入式面板之外,天花板面板250'亦可具有安裝、栓接、擰緊、固定或以其他方式固定至天花板框架250之風扇過濾單元罩蓋103以及第一天花板框架管道105及第二天花板框架管道107。如隨後將更為詳細地討論,與天花板面板250'之管道107流體連通的管道可安裝於氣體包體總成之內部中。根據本教示,此管道可為在氣體包體總成內部的氣體循環系統之一部分,並且提供用於分離退出氣體包體總成之流以便循環通過在氣體包體總成外部的至少一個氣體淨化組件。 Various embodiments of the wall panel and ceiling panel as depicted in FIG. 4 can have a plurality of embedded panels 110. As can be seen in Figure 4, the embedded panel can have a variety of shapes and aspect ratios. In addition to the inset panel, the ceiling panel 250' can also have a fan filter unit cover 103 that is mounted, bolted, screwed, secured, or otherwise secured to the ceiling frame 250, as well as the first ceiling frame duct 105 and the second ceiling frame Pipe 107. As will be discussed in greater detail later, a conduit in fluid communication with the conduit 107 of the ceiling panel 250' can be mounted in the interior of the gas enclosure assembly. According to the present teachings, the conduit may be part of a gas circulation system inside the gas inclusion assembly and provide a flow for separating the exit gas inclusion assembly for circulation through at least one gas purge external to the gas inclusion assembly Component.

圖5係框架構件總成200之分解的前部透視圖,其中壁框架220可建構成包括多個面板之完整補充。儘管不限於所展示之設計,但使用壁框架220之框架構件總成200可用作根據本教示之框架構件總成的各種實施例之示例。框架構件總成之各種實施例可由各種框架構件以及安裝於根據本教示之各種框架構件的各種框架面板區段中之區段面板組成。 5 is an exploded front perspective view of the frame member assembly 200, wherein the wall frame 220 can be constructed to include a complete complement of multiple panels. Although not limited to the illustrated design, the frame member assembly 200 using the wall frame 220 can be used as an example of various embodiments of the frame member assembly in accordance with the present teachings. Various embodiments of the frame member assembly can be comprised of various frame members and segment panels that are mounted in various frame panel sections of various frame members in accordance with the present teachings.

根據本教示之各種框架構件總成的各種實施例,框架構件總成200可由諸如壁框架220之框架構件組成。對於氣體包體總成之各種實施例,諸如圖3之氣體包體總成100,可利用封裝在此氣體包體總成中之設備的處理可能不僅需要提供惰性環境之氣密式密封型包體,而且需要大致上 無顆粒物之環境。就此而言,根據本教示之框架構件可利用各種尺寸之金屬管材料來進行框架之各種實施例的建構。此等金屬管材料解決所需之材料屬性,該等屬性包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之框架構件,從而提供包含各種框架構件及面板區段之氣體包體總成自一個地點至另一地點之方便的傳送、建構及解構。一般技藝人士將容易理解的是,滿足此等要求之任何材料可用於產生根據本教示之各種框架構件。 According to various embodiments of the various frame member assemblies of the present teachings, the frame member assembly 200 can be comprised of a frame member such as a wall frame 220. For various embodiments of the gas inclusion assembly, such as the gas inclusion assembly 100 of Figure 3, the processing of the equipment packaged in the gas inclusion assembly may require not only an airtight sealed package that provides an inert environment. Body, and need to be roughly No particulate matter environment. In this regard, frame members in accordance with the present teachings can utilize various sizes of metal tube materials for the construction of various embodiments of the frame. These metal tube materials address the desired material properties, including but not limited to: high integrity materials that will not degenerate to produce particulate matter, and frame members that produce high strength yet have the best weight to provide The gas inclusion assembly comprising various frame members and panel sections is conveniently conveyed, constructed and deconstructed from one location to another. One of ordinary skill in the art will readily appreciate that any material that meets such requirements can be used to produce the various frame members in accordance with the present teachings.

例如,根據本教示之框架構件的各種實施例,諸如框架構件總成200,可由擠製金屬管線建構而成。根據框架構件之各種實施例,鋁、鋼及多種金屬複合材料可用於建構框架構件。在各種實施例中,尺寸為例如但不限於2”wX2”h、4”wX2”h及4”wX4”h且壁厚度為1/8”至1/4”之金屬管可用來建構根據本教示之框架構件的各種實施例。另外,可利用多種管或其他形式之多種強化纖維聚合物複合材料,該等材料所具有的材料屬性包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之框架構件,從而提供自一個地點至另一地點之方便的傳送、建構及解構。 For example, various embodiments of frame members in accordance with the present teachings, such as frame member assembly 200, may be constructed from extruded metal lines. According to various embodiments of the frame members, aluminum, steel, and various metal composite materials can be used to construct the frame members. In various embodiments, metal tubes having dimensions such as, but not limited to, 2"wX2"h, 4"wX2"h, and 4"wX4"h and having a wall thickness of 1/8" to 1/4" can be used to construct Various embodiments of the frame members are taught. In addition, a variety of tubes or other forms of reinforcing fiber polymer composites may be utilized, the material properties of which include, but are not limited to, high integrity materials that will not degenerate to produce particulate matter, and produce high strength but It also has the best weight of frame members to provide convenient transfer, construction and deconstruction from one location to another.

關於由各種尺寸之金屬管材料建構各種框架構件,預期的是,可進行焊接來產生框架焊接件之各種實施例。另外,由各種尺寸之建築材料建構各種框架構件可使用適當之工業黏合劑來接下。預期的是,各種框架構件之建構應以將不會本質上產生穿過框架構件之洩漏路徑的方式進行。就此而言,對於氣體包體總成之各種實施例,各種框架構件之建構可使用不會本質上產生穿過框架構件之洩漏路徑的任何方法進行。此外, 根據本教示之框架構件的各種實施例,諸如圖4之壁框架220,可被塗漆或塗布。對於由容易發生例如氧化的金屬管線材料製成的框架構件之各種實施例,其中形成於表面處的材料可產生顆粒物,可進行塗漆或塗布或諸如陽極處理之其他表面處理來防止顆粒物之形成。 With regard to the construction of various frame members from various sizes of metal tube materials, it is contemplated that welding can be performed to create various embodiments of the frame weldments. In addition, the construction of various frame members from various sizes of building materials can be accomplished using suitable industrial adhesives. It is contemplated that the construction of the various frame members should be performed in a manner that will not inherently create a leak path through the frame members. In this regard, for various embodiments of the gas inclusion assembly, the construction of the various frame members can be performed using any method that does not inherently create a leak path through the frame members. In addition, Various embodiments of frame members in accordance with the present teachings, such as wall frame 220 of Figure 4, may be painted or coated. For various embodiments of frame members made of metal line materials susceptible to, for example, oxidation, wherein the material formed at the surface can produce particulate matter, painting or coating or other surface treatment such as anodizing can be performed to prevent formation of particulate matter. .

諸如圖5之框架構件總成之框架構件總成200可具有諸如壁框架220之框架構件。壁框架220可具有頂部226,頂部壁框架間隔板227可緊固至該頂部上;以及底部228,底部壁框架間隔板229可緊固至該底部上。如隨後將更為詳細地討論,安裝於框架構件之表面上的間隔板係墊圈密封系統之一部分,該墊圈密封系統與安裝於框架構件區段中之面板的墊圈密封相結合,來提供根據本教示之氣體包體總成的各種實施例之氣密式密封。諸如圖5之框架構件總成200之壁框架220的框架構件可具有若干面板框架區段,其中每一區段可被製造來接納各種類型之面板,諸如但不限於嵌入式面板110、窗口面板120及易於移除之服務窗口130。各種類型之面板區段可在框架構件之建構處理中形成。面板區段之類型可包括:例如但不限於用於接納嵌入式面板110之嵌入式面板區段10、用於接納窗口面板120之窗口面板區段20,以及用於接納易於移除之服務窗口130之服務窗口面板區段30。 The frame member assembly 200, such as the frame member assembly of FIG. 5, can have a frame member such as a wall frame 220. The wall frame 220 can have a top 226 to which the top wall frame spacer 227 can be fastened; and a bottom 228 to which the bottom wall frame spacer 229 can be fastened. As will be discussed in more detail later, the spacer plate mounted on the surface of the frame member is part of a gasket sealing system that is combined with a gasket seal of a panel mounted in the frame member section to provide A hermetic seal of various embodiments of the gas inclusion assembly is taught. A frame member, such as wall frame 220 of frame member assembly 200 of Figure 5, can have a number of panel frame segments, wherein each segment can be fabricated to receive various types of panels, such as, but not limited to, inlaid panel 110, window panel 120 and service window 130 that is easy to remove. Various types of panel sections can be formed in the construction process of the frame members. Types of panel sections may include, for example but without limitation, an inlaid panel section 10 for receiving the inset panel 110, a window panel section 20 for receiving the window panel 120, and a service window for receiving easy removal Service window panel section 30 of 130.

每一類型之面板區段可具有用來接納面板之面板區段框架,且可使得每一面板可密封地緊固至根據本教示之每一面板區段中,以便建構氣密式密封型氣體包體總成。例如,在描繪根據本教示之框架總成的圖5中,嵌入式面板區段10經展示為具有框架12,窗口面板區段20經展示為具有框架22,且服務窗口面板區段30經展示為具有框架32。對於本 教示之壁框架總成的各種實施例,各種面板區段框架可為使用連續焊珠焊接至面板區段中以提供氣密式密封之金屬薄片材料。對於壁框架總成之各種實施例,各種面板區段框架可由多種薄片材料製成,包括選自強化纖維聚合物複合材料之建築材料,可使用適當之工業黏合劑將該等材料安裝於面板區段中。如關於密封之後續教示中將更為詳細地討論,每一面板區段框架可具有佈置於其上之可壓縮墊圈,來確保可為安裝及緊固於每一面板區段中的每一面板形成氣密式密封。除了面板區段框架之外,每一面板構件區段亦可具有與定位面板以及將面板牢固地緊固於面板區段中相關的硬體。 Each type of panel section can have a panel section frame for receiving a panel, and each panel can be sealingly fastened to each panel section in accordance with the present teachings to construct a hermetic sealed gas Inclusion body assembly. For example, in Figure 5 depicting a frame assembly in accordance with the present teachings, the inlaid panel section 10 is shown with a frame 12, the window panel section 20 is shown with a frame 22, and the service window panel section 30 is shown To have a frame 32. For this In various embodiments of the teaching wall frame assembly, the various panel section frames can be sheet metal materials that are welded into the panel sections using continuous bead to provide a hermetic seal. For various embodiments of the wall frame assembly, the various panel segment frames can be made from a variety of sheet materials, including building materials selected from the group of reinforced fiber polymer composites that can be mounted to the panel region using suitable industrial adhesives. In the paragraph. As will be discussed in more detail in the subsequent teachings of sealing, each panel section frame can have a compressible gasket disposed thereon to ensure that each panel can be mounted and fastened in each panel section. A hermetic seal is formed. In addition to the panel section frame, each panel member section may also have hardware associated with the positioning panel and securely fastening the panel to the panel section.

嵌入式面板110及用於窗口面板120之面板框架122的各種實施例可由諸如但不限於鋁、各種鋁合金及不銹鋼薄片金屬材料建構而成。面板材料之屬性可與構成框架構件之各種實施例的結構性材料之屬性相同。就此而言,材料具有用於各種面板構件之屬性,包括但不限於:將不會退化而產生顆粒物的高完整性材料,以及產生具有高強度卻又具有最佳重量之面板,以便提供自一個地點至另一地點之方便的傳送、建構及解構。例如蜂巢心薄片材料之各種實施例可具有必要屬性來用作面板材料,以便建構嵌入式面板110及用於窗口面板120之面板框架122。蜂巢心薄片材料可由多種材料製成,即金屬及金屬複合材料與聚合材料,以及聚合物複合材料蜂巢心薄片材料。當由金屬材料製成時,可移除之面板的各種實施例可具有包括於面板中之接地連接,來確保當氣體包體總成得以建構時,整個結構被接地。 Various embodiments of the embedded panel 110 and the panel frame 122 for the window panel 120 may be constructed from metal materials such as, but not limited to, aluminum, various aluminum alloys, and stainless steel sheets. The properties of the panel material may be the same as those of the structural materials that make up the various embodiments of the frame member. In this regard, the material has properties for various panel members, including but not limited to: high integrity materials that will not degenerate to produce particulate matter, and panels that produce high strength yet have the best weight to provide from a single Convenient transfer, construction and deconstruction from location to location. Various embodiments, such as honeycomb core sheet materials, may have the necessary attributes for use as panel materials to construct the embedded panel 110 and the panel frame 122 for the window panel 120. The honeycomb core sheet material can be made from a variety of materials, namely metal and metal composites and polymeric materials, as well as polymeric composite honeycomb core sheets. When made of a metallic material, various embodiments of the removable panel can have a ground connection included in the panel to ensure that when the gas enclosure assembly is constructed, the entire structure is grounded.

考慮到用來建構本教示之氣體包體總成的氣體包體總成組 件的可傳送性質,在氣體包體總成及系統之使用期間可反復安裝及移除本教示之區段面板的各種實施例中之任一者,來提供對氣體包體總成之內部的接取。 Considering the gas inclusion assembly of the gas inclusion assembly used to construct the present teachings The transferable nature of the piece can be repeatedly installed and removed during use of the gas inclusion assembly and system to provide for the interior of the gas inclusion assembly. Pick up.

例如,用於接納易於移除之服務窗口面板130的面板區段30可具有一組四個間隔物,該等間隔物中之一者被指示為窗口導引間隔物34。另外,被建構用於接納易於移除之服務窗口面板130之面板區段30可具有一組四個夾緊座(clamping cleat)36,該等夾緊座可用來使用一組四個反作用肘節夾136來將服務窗口130夾緊至服務窗口面板區段30中,該等反作用肘節夾係安裝於用於易於移除之服務窗口130中之每一者的服務窗口框架132上。此外,窗口把手138中之每一者中的兩個可安裝於易於移除之服務窗口框架132上,用來為終端使用者移除及安裝服務窗口130提供方便。可移除之服務窗口把手之數量、類型及置放可改變。另外,用於接納易於移除之服務窗口面板130的服務窗口面板區段30可具有選擇性地安裝於每一服務窗口面板區段30中的至少兩個窗口夾35。儘管被描繪成位於服務窗口面板區段30中之每一者的頂部及底部,但是至少兩個窗口夾可以任何方式安裝,以便用來用來將服務窗口130固定在面板區段框架32中。可使用工具來移除及安裝窗口夾35,以便允許移除及重新安裝服務窗口130。 For example, panel section 30 for receiving service window panel 130 that is easily removable may have a set of four spacers, one of which is indicated as window guiding spacer 34. Additionally, the panel section 30 constructed to receive the service window panel 130 that is easily removable can have a set of four clamping cleats 36 that can be used to use a set of four reaction toggles. A clip 136 is used to clamp the service window 130 into the service window panel section 30, which are mounted on the service window frame 132 for each of the service windows 130 that are easily removable. Additionally, two of each of the window handles 138 can be mounted to the service window frame 132 that is easily removable for facilitating removal and installation of the service window 130 for the end user. The number, type and placement of removable service window handles can be changed. Additionally, the service window panel section 30 for receiving the service window panel 130 that is easily removable may have at least two window clips 35 selectively mounted in each of the service window panel sections 30. Although depicted as being located at the top and bottom of each of the service window panel sections 30, at least two window clips can be mounted in any manner for use in securing the service window 130 in the panel section frame 32. A window clip 35 can be removed and installed using a tool to allow removal and reinstallation of the service window 130.

服務窗口130之反作用肘節夾136以及安裝於面板區段30上之硬體(包括夾緊座36、窗口導引間隔物34以及窗口夾35)可由任何合適之材料及材料之組合建構而成。例如,此等元件中之一或多者可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。可移除之服務窗口把手138可由任何合適之材料及材料之組合建構而成。例如,此等元件中 之一或多者可包含至少一種金屬、至少一種陶瓷、至少一種塑膠、至少一種橡膠及其組合。包體窗口(諸如窗口面板120之窗口124或服務窗口130之窗口134)可包含任何合適之材料以及材料之組合。根據本教示之氣體包體總成的各種實施例,包體窗口可包含透明材料及半透明材料。在氣體包體總成之各種實施例中,包體窗口可包含:二氧化矽基材料,例如但不限於諸如玻璃及石英;以及各種類型之聚合物基材料,例如但不限於各種類別之聚碳酸酯、丙烯酸類及乙烯類。一般技藝人士可理解的是,示例性窗口材料之各種複合材料及其組合亦可用作根據本教示之透明材料及半透明材料。 The reaction toggle clamp 136 of the service window 130 and the hardware (including the clamp seat 36, the window guide spacer 34 and the window clamp 35) mounted on the panel section 30 can be constructed from any suitable combination of materials and materials. . For example, one or more of such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof. The removable service window handle 138 can be constructed from any suitable combination of materials and materials. For example, in these components One or more may comprise at least one metal, at least one ceramic, at least one plastic, at least one rubber, and combinations thereof. The inclusion window (such as window 124 of window panel 120 or window 134 of service window 130) may comprise any suitable material and combination of materials. According to various embodiments of the gas inclusion assembly of the present teachings, the inclusion window may comprise a transparent material and a translucent material. In various embodiments of the gas inclusion assembly, the inclusion window may comprise: a cerium oxide based material such as, but not limited to, such as glass and quartz; and various types of polymer based materials such as, but not limited to, various types of poly Carbonate, acrylic and vinyl. It will be understood by those of ordinary skill in the art that various composite materials of the exemplary window materials and combinations thereof can also be used as the transparent material and translucent material in accordance with the present teachings.

如自圖5中之框架構件總成200可看出,易於移除之服務窗口面板130可具有帶有蓋子150之手套埠。儘管將圖3展示為所有手套埠具有向外延伸之手套,但是如圖5中所展示,亦可封蓋住手套埠,此取決於終端使用者是否需要對氣體包體總成之內部的遠程接取。如圖6A至圖7B中所描繪,封蓋總成之各種實施例提供用於當終端使用者未使用手套時將蓋子牢固地鎖定於手套上,且同時在終端使用者希望使用手套時提供輕鬆接取。 As can be seen from the frame member assembly 200 of FIG. 5, the service window panel 130 that is easily removable can have a glove pocket with a cover 150. Although Figure 3 shows all of the gloves having an outwardly extending glove, as shown in Figure 5, the glove can also be capped, depending on whether the end user needs to remotely internal the gas enclosure assembly. Pick up. As depicted in Figures 6A-7B, various embodiments of the closure assembly are provided for securely locking the lid to the glove when the end user is not using the glove, while at the same time providing ease when the end user wishes to use the glove Pick up.

圖6A中展示蓋子150,其可具有內部表面151、外部表面153及可經輪廓塑造以便抓握之側面152。自蓋子150之輪緣154延伸的係三個有肩螺釘156。如圖6B中所展示,每一有肩螺釘係設置於輪緣154中,以使得螺釘桿155自輪緣154延伸一設定的距離,以使得頭部157不緊靠輪緣154。在圖7A至圖7B中,手套埠硬體總成160可經修改來提供包括鎖定機構之封蓋總成,其用於當包體被加壓來相對於包體外部具有正壓力時封 蓋住手套埠。 A cover 150 is shown in FIG. 6A, which may have an interior surface 151, an exterior surface 153, and a side 152 that may be contoured for gripping. Three shoulder screws 156 extend from the rim 154 of the cover 150. As shown in FIG. 6B, each shoulder screw is disposed in the rim 154 such that the screw shaft 155 extends a predetermined distance from the rim 154 such that the head 157 does not abut the rim 154. In Figures 7A-7B, the glove raft hardware assembly 160 can be modified to provide a closure assembly including a locking mechanism for sealing when the bag is pressurized to have a positive pressure relative to the exterior of the package. Cover the gloves.

對於圖6A之手套埠硬體總成160的各種實施例,卡口式夾緊可提供蓋子150在手套埠硬體總成160上之封閉,且同時提供快速耦合設計以便於終端使用者對手套的輕鬆接取。在圖7A中所展示之手套埠硬體總成160之頂部擴展視圖中,手套埠總成160可包含後部板161以及前部板163,該前部板具有用於安裝手套之螺紋螺釘頭部162及凸緣164。在凸緣164上展示了卡口式閂鎖166,該卡口式閂鎖具有用於接納有肩螺釘156(圖6B)之有肩螺釘頭部157的槽口165。有肩螺釘156中之每一者可與手套埠硬體總成160之卡口式閂鎖166中之每一者對準及嚙合。卡口式閂鎖166之槽口168具有位於槽口168之一端的開口165及位於另一端的鎖定凹部167。一旦每一有肩螺釘頭部157被插入至每一開口165中,則可旋轉蓋子150,直至有肩螺釘頭部緊靠槽口168之靠近鎖定凹部167的一端。圖7B中所展示之截面圖描繪在氣體包體總成系統在使用中時用於封蓋住手套之鎖定特徵。在使用期間,包體中之惰性氣體的內部氣體壓力比氣體包體總成外部的壓力高出一設定的量。該正壓力可填充手套(圖3),以使得在本教示之氣體包體總成的使用期間當手套被壓縮在蓋子150下方時,使有肩螺釘頭部157移動至鎖定凹部167中,從而確保手套埠窗口將被牢固地封蓋。然而,終端使用者可藉由經輪廓塑造以便抓握之側面152抓握住蓋子150,並且在不使用時容易地使固定在卡口式閂鎖中之蓋子脫齧。圖7B另外展示窗口134之內部表面131上的後部板161,以及窗口134之外部表面上的前部板163,該等板均具有O型環密封件169。 For the various embodiments of the glove 埠 hardware assembly 160 of FIG. 6A, the bayonet clamp can provide closure of the cover 150 on the glove raft hardware assembly 160 while providing a quick coupling design for the end user to pair the glove Easy to pick up. In the top expanded view of the glove box hardware assembly 160 shown in FIG. 7A, the glove box assembly 160 can include a rear panel 161 and a front panel 163 having a threaded screw head for mounting gloves 162 and flange 164. A bayonet latch 166 is shown on the flange 164 having a notch 165 for receiving a shouldered screw head 157 with a shoulder screw 156 (Fig. 6B). Each of the shoulder screws 156 can be aligned and engaged with each of the bayonet latches 166 of the glove box hardware assembly 160. The notch 168 of the bayonet latch 166 has an opening 165 at one end of the slot 168 and a locking recess 167 at the other end. Once each shoulder screw head 157 is inserted into each opening 165, the cover 150 can be rotated until the shoulder screw head abuts the end of the notch 168 near the locking recess 167. The cross-sectional view shown in Figure 7B depicts the locking features used to cap the glove when the gas enclosure assembly system is in use. During use, the internal gas pressure of the inert gas in the enclosure is higher than the pressure outside the gas enclosure assembly by a set amount. The positive pressure can fill the glove (Fig. 3) such that when the glove is compressed under the cover 150 during use of the gas enclosure assembly of the present teaching, the shoulder screw head 157 is moved into the locking recess 167, thereby Make sure the glove 埠 window will be securely capped. However, the end user can grasp the cover 150 by contouring the side 152 for gripping and easily disengage the cover secured in the bayonet latch when not in use. Figure 7B additionally shows the rear panel 161 on the interior surface 131 of the window 134, and the front panel 163 on the exterior surface of the window 134, each having an O-ring seal 169.

如以下關於圖8A至圖9B的教示中將更為詳細地討論,壁 框架構件及天花板框架構件密封件與氣密式區段面板框架密封件一起提供氣密式密封型氣體包體總成之各種實施例,以便用於需要惰性環境之空氣敏感型處理。氣體包體總成及系統之有助於提供大致上低濃度之反應性物種以及大致上低微粒環境的組件可包括但不限於:氣密式密封型氣體包體總成,以及包括管道之高效氣體循環及粒子過濾系統。為氣體包體總成提供有效氣密式密封可具有挑戰性,尤其在三個框架構件合到一起來形成三面接縫之處。因此,三面接縫密封對為可在建構及解構週期中組裝及拆卸的氣體包體總成提供可易於安裝之氣密式密封提出特別困難之挑戰。 As will be discussed in more detail below with respect to the teachings of Figures 8A-9B, the wall The frame member and ceiling frame member seal together with the hermetic segment panel frame seal provide various embodiments of a hermetic sealed gas enclosure assembly for use in air sensitive processing requiring an inert environment. Components of the gas inclusion assembly and system that contribute to providing substantially low concentrations of reactive species and substantially low particulate environments may include, but are not limited to, hermetic sealed gas inclusion assemblies, and efficient piping including Gas circulation and particle filtration systems. Providing an effective hermetic seal for the gas inclusion body assembly can be challenging, especially where the three frame members are brought together to form a three-sided seam. Thus, the three-sided seam seal presents a particularly difficult challenge to provide an airtight seal that can be easily assembled for assembly and disassembly of the gas inclusion assembly during construction and deconstruction cycles.

就此而言,根據本教示之氣體包體總成的各種實施例經由接縫之有效墊圈密封以及在承受負載的建築組件周圍提供有效墊圈密封來提供完全建構之氣體包體總成及系統的氣密式密封。與習知的接縫密封不同的是,根據本教示之接縫密封:1)在頂部及底部終端框架接合點(三個框架構件在此處連接)處包括來自正交定向之墊圈長度的緊靠之墊圈分段的均勻的平行對準,從而避免有角的縫對準及密封,2)提供用於形成跨越接縫之整個寬度的緊靠長度,從而增加三面接合點處的密封接觸面積,3)經設計成具有間隔板,該等間隔板提供跨越所有垂直及水平以及頂部及底部三面接縫墊圈密封的均勻壓縮力。另外,墊圈材料之選擇可影響提供氣密式密封之有效性,隨後將對此進行討論。 In this regard, various embodiments of the gas inclusion assembly in accordance with the present teachings provide a fully constructed gas inclusion assembly and system gas via an effective gasket seal of the seam and an effective gasket seal around the load-bearing building component. Closed seal. Unlike conventional seam seals, seam seals in accordance with the present teachings: 1) include tightness from orthogonally oriented washer lengths at the top and bottom terminal frame joints (where the three frame members are joined) Uniform parallel alignment of the gasket segments to avoid angular seam alignment and sealing, 2) providing abutting length for forming the entire width across the seam, thereby increasing the sealing contact area at the three-sided joint 3) Designed to have spacers that provide uniform compression across all vertical and horizontal and top and bottom three-sided seam gasket seals. In addition, the choice of gasket material can affect the effectiveness of providing a hermetic seal, which will be discussed later.

圖8A至圖8C為頂部示意圖,其描繪習知的三面接縫密封與根據本教示之三面接縫密封的比較。根據本教示之氣體包體總成的各種實施例,可存在例如但不限於至少四個壁框架構件、天花板框架構件及底盤,上述各者可被連接來形成氣體包體總成,從而產生需要氣密式密封之 複數個垂直、水平及三面接縫。圖8A中為藉由第一墊圈I形成之習知的三面墊圈密封之頂部示意圖,該第一墊圈在X-Y平面中與墊圈II正交定向。如圖8A中所展示,X-Y平面中藉由正交定向所形成的縫具有在兩個分段之間的接觸長度W1,該接觸長度由墊圈之寬度的尺寸來定義。另外,如陰影線所指示,墊圈III之終端部分可緊靠墊圈I及墊圈II,該墊圈III係在垂直方向上與墊圈I及墊圈II兩者正交定向的墊圈。圖8B中為藉由第一墊圈長度I所形成之習知的三面接縫墊圈密封的頂部示意圖,該第一墊圈長度I與第二墊圈長度II正交,且具有連接兩個長度之45°面的縫,其中該縫具有在兩個分段之間的接觸長度W2,該接觸長度大於墊圈材料之寬度。與圖8A之組配類似的是,如陰影線所指示,墊圈III之末端部分可緊靠墊圈I及墊圈II,該墊圈III在垂直方向上與墊圈I及墊圈II兩者正交。假定圖8A及圖8B中的墊圈寬度相同,則圖8B之接觸長度W2大於圖8A之接觸長度W18A-8C are top schematic views depicting a comparison of a conventional three-sided seam seal with a three-sided seam seal in accordance with the present teachings. In accordance with various embodiments of the gas inclusion assembly of the present teachings, there may be, for example, but not limited to, at least four wall frame members, ceiling frame members, and a chassis, each of which may be coupled to form a gas enclosure assembly, thereby creating a need A plurality of vertical, horizontal and three-sided seams of a hermetic seal. Figure 8A is a top plan view of a conventional three-sided gasket seal formed by a first gasket I oriented orthogonally to the gasket II in the XY plane. Shown in Figure 8A, slot oriented perpendicular to the XY plane formed by the contact having a length W 1 between the two segments, the contact length is defined by the width dimension of the gasket. Additionally, as indicated by the hatching, the terminal portion of the washer III can abut the washer I and the washer II, which is a washer oriented orthogonally to both the washer I and the washer II in the vertical direction. Figure 8B is a top plan view of a conventional three-sided seam gasket seal formed by a first gasket length I, the first gasket length I being orthogonal to the second gasket length II and having a connection of two lengths of 45° A seam of a face, wherein the seam has a contact length W 2 between the two segments, the contact length being greater than the width of the gasket material. Similar to the assembly of Fig. 8A, as indicated by the hatching, the end portion of the washer III can abut the washer I and the washer II, which is orthogonal to both the washer 1 and the washer II in the vertical direction. Assuming that the washers in FIGS. 8A and 8B have the same width, the contact length W 2 of FIG. 8B is greater than the contact length W 1 of FIG. 8A.

圖8C係根據本教示之三面接縫墊圈密封的頂部示意圖。第一墊圈長度I可具有形成為與墊圈長度I之方向正交的墊圈分段I',其中墊圈分段I'之長度大約為所連接的結構組件之寬度的尺寸,該組件諸如用來形成本教示之氣體包體總成的各種壁框架構件的4”w X 2”h或4”w X 4”h金屬管。墊圈II在X-Y平面中與墊圈I正交,且具有墊圈分段II',該墊圈分段II'具有與墊圈分段I'重疊之長度,該長度大約為所連接之結構組件的寬度。墊圈分段I'及II'之寬度為所選擇的之可壓縮墊圈材料的寬度。墊圈III在垂直方向上與墊圈I及墊圈II兩者正交定向。墊圈分段III'係墊圈III之末端部分。墊圈分段III'係藉由墊圈分段III'與墊圈III之垂直長度的正交定向 而形成。墊圈分段III'可經形成以使得其長度與墊圈分段I'及墊圈分段II'大約相同,且其寬度為所選擇之可壓縮墊圈材料的厚度。就此而言,圖8C中所展示之三個對準分段的接觸長度W3大於圖8A或圖8B中之任一者中所展示之習知的三角接縫密封的長度(分別具有接觸長度W1及W2)。 Figure 8C is a top schematic view of a three-sided seam gasket seal in accordance with the present teachings. The first washer length I may have a washer segment I' formed to be orthogonal to the direction of the length I of the washer, wherein the length of the washer segment I' is approximately the size of the width of the connected structural component, such as for forming The 4"w X 2"h or 4"w X 4"h metal tube of the various wall frame members of the gas inclusion assembly of the present teachings. The washer II is orthogonal to the washer I in the XY plane and has a washer segment II' having a length that overlaps the washer segment I', which is approximately the width of the connected structural component. The width of the gasket segments I' and II' is the width of the compressible gasket material selected. The washer III is oriented orthogonally to both the washer I and the washer II in the vertical direction. The washer segment III' is the end portion of the washer III. The washer segment III' is formed by the orthogonal orientation of the vertical length of the washer segment III' and the washer III. The gasket segment III' can be formed such that its length is about the same as the gasket segment I' and the gasket segment II', and the width is the thickness of the compressible gasket material selected. In this regard, the contact length W 3 of the three alignment segments shown in FIG. 8C is greater than the length of the conventional triangular seam seal shown in any of FIG. 8A or FIG. 8B (with contact length, respectively) W 1 and W 2 ).

就此而言,根據本教示之三面接縫墊圈密封在終端接合點處由否則將正交對準的墊圈(如圖8A及圖8B中所展示)產生墊圈分段之均勻的水平對準。三面接縫墊圈密封分段之此均勻的水平對準提供用於施加跨越該等分段之均勻的橫向密封力,來促進由壁框架構件所形成之頂部及底部接角處的氣密式三面接縫密封。另外,每一三面接縫密封之均勻對準的墊圈分段中之每一分段經選擇成大約為所連接之結構組件的寬度,從而提供均勻對準的分段之最大接觸長度。此外,根據本教示之接縫密封經設計成具有間隔板,該等間隔板提供跨越建築接縫之所有垂直、水平及三面墊圈密封的均勻壓縮力。可認為經選擇用於針對圖8A及圖8B之實例所給出的習知三面密封的墊圈材料之寬度可至少為所連接之結構組件的寬度。 In this regard, the three-sided seam gasket seal in accordance with the present teachings produces a uniform horizontal alignment of the gasket segments at the terminal joints by washers that would otherwise be orthogonally aligned (as shown in Figures 8A and 8B). This uniform horizontal alignment of the three-sided seam gasket seal segments provides for a uniform transverse sealing force across the segments to promote airtight three sides at the top and bottom corners formed by the wall frame members Seam seal. In addition, each of the uniformly aligned washer segments of each three-sided seam seal is selected to be approximately the width of the joined structural component to provide a maximum contact length for the uniformly aligned segments. In addition, seam seals in accordance with the present teachings are designed to have spacer panels that provide uniform compressive forces across all of the vertical, horizontal, and three-sided gasket seals of the building seam. The width of the gasket material selected for the conventional three-sided seal given for the examples of Figures 8A and 8B can be considered to be at least the width of the joined structural component.

圖9A之分解透視圖描繪所有框架構件被連接在一起之前的根據本教示之密封總成300,以便描繪未壓縮狀態下之墊圈。在圖9A中,諸如壁框架310、壁框架350以及天花板框架370之複數個壁框架構件可在由氣體包體總成之各種組件來建構氣體包體之第一步驟中密封地連接起來。根據本教示之框架構件密封係確保以下情形的實質部分:氣體包體總成一旦被完全建構則被氣密式密封,並且提供可在氣體包體總成之建構及解構週期中實行的密封。儘管以下關於圖9A至圖9B的教示中給出之實例係用於氣體包體總成之一部分的密封,但是一般技藝人士將瞭解的是,此 等教示適用於本教示之氣體包體總成中之任一者的整體。 The exploded perspective view of Figure 9A depicts the seal assembly 300 according to the present teachings before all of the frame members are joined together to depict the gasket in an uncompressed state. In FIG. 9A, a plurality of wall frame members, such as wall frame 310, wall frame 350, and ceiling frame 370, may be sealingly joined in a first step of constructing a gas enclosure from various components of the gas enclosure assembly. The frame member seal according to the present teachings ensures that a substantial portion of the gas enclosure assembly is hermetically sealed once fully constructed and provides a seal that can be implemented during the construction and deconstruction cycle of the gas inclusion assembly. Although the examples given below with respect to the teachings of Figures 9A-9B are for sealing a portion of a gas enclosure assembly, one of ordinary skill in the art will appreciate that this The teachings are applicable to the entirety of any of the gas inclusion assemblies of the present teachings.

圖9A中所描繪之第一壁框架310可具有:內部側311,間隔板312係安裝於該內部側上;垂直側314;以及頂部表面315,間隔板316係安裝於該頂部表面上。第一壁框架310可具有第一墊圈320,該第一墊圈佈置於由間隔板312形成之空間中且黏附至該空間。在第一墊圈320佈置於由間隔板312形成之空間中且黏附至該空間後剩餘的間隙302可容第一墊圈320之垂直長度通過,如圖9A中所展示。如圖9A中所展示,順應墊圈320可佈置於由間隔板312所形成之空間中且黏附至該空間,且可具有垂直墊圈長度321、曲線墊圈長度323以及墊圈長度325,墊圈長度325係形成為與內部框架構件311上之垂直墊圈長度321在平面中成90°且在壁框架310之垂直側314處終止。在圖9A中,第一壁框架310可具有頂部表面315,間隔板316係安裝於該頂部表面上,從而在表面315上靠近壁框架310之內部邊緣317形成一空間,第二墊圈340係佈置於該空間中且黏附至該空間。在第一墊圈340佈置於由間隔板316形成之空間中且黏附至該空間後剩餘的間隙304可容第二墊圈340之水平長度通過,如圖9A中所展示。此外,如陰影線所指示,墊圈340之長度345與墊圈320之長度325均勻地平行且相連地對準。 The first wall frame 310 depicted in Figure 9A can have an inner side 311 on which the spacer 312 is mounted, a vertical side 314, and a top surface 315 upon which the spacer 316 is mounted. The first wall frame 310 may have a first gasket 320 disposed in a space formed by the partition plate 312 and adhered to the space. The gap 302 remaining after the first gasket 320 is disposed in the space formed by the spacer 312 and adhered to the space can pass through the vertical length of the first gasket 320, as shown in FIG. 9A. As shown in FIG. 9A, the compliant gasket 320 can be disposed in the space formed by the spacer 312 and adhered to the space, and can have a vertical gasket length 321, a curved gasket length 323, and a gasket length 325, the gasket length 325 being formed. The length of the vertical washer 321 on the inner frame member 311 is 90° in the plane and terminates at the vertical side 314 of the wall frame 310. In FIG. 9A, the first wall frame 310 can have a top surface 315 to which the spacer 316 is mounted such that a space is formed on the surface 315 adjacent the inner edge 317 of the wall frame 310, and the second gasket 340 is arranged In this space and adhere to the space. The gap 304 remaining after the first gasket 340 is disposed in the space formed by the spacer 316 and adhered to the space can pass through the horizontal length of the second gasket 340, as shown in FIG. 9A. Moreover, as indicated by the hatching, the length 345 of the washer 340 is uniformly parallel and connected in alignment with the length 325 of the washer 320.

圖9A中所描繪之第二壁框架350可具有外部框架側353、垂直側354及頂部表面355,間隔板356係安裝於該頂部表面上。第二壁框架350可具有第一墊圈360,該第一墊圈佈置於由間隔板356形成的一空間中且黏附至該空間。在第一墊圈360佈置於由間隔板356形成之空間中且黏附至該空間後剩餘的間隙306可容第一墊圈360之水平長度通過,如圖9A 中所展示。如圖9A中所描繪,順應墊圈360可具有水平長度361、曲線長度363以及長度365,長度365係在頂部表面355之平面中形成為90°且在外部框架構件353處終止。 The second wall frame 350 depicted in Figure 9A can have an outer frame side 353, a vertical side 354, and a top surface 355 upon which the spacer 356 is mounted. The second wall frame 350 may have a first gasket 360 disposed in a space formed by the partition plate 356 and adhered to the space. The gap 306 remaining after the first gasket 360 is disposed in the space formed by the partition plate 356 and adhered to the space can accommodate the horizontal length of the first gasket 360, as shown in FIG. 9A. Shown in the middle. As depicted in FIG. 9A, the compliant washer 360 can have a horizontal length 361, a curved length 363, and a length 365 that is formed at 90° in the plane of the top surface 355 and terminates at the outer frame member 353.

如圖9A之分解透視圖中所指示,壁框架310之內部框架構件311可連接至壁框架350之垂直側354,從而形成氣體包體總成之一建築接縫。關於如此形成的建築接縫之密封,在如圖9A中所描繪的根據本教示之壁框架構件的終端接合點處之墊圈密封的各種實施例中,墊圈320之長度325、墊圈360之長度365以及墊圈340之長度345全部相連地且均勻地對準。另外,如隨後將更為詳細地討論,本教示之間隔板的各種實施例可提供均勻壓縮,此壓縮介於用於氣密式密封本教示之氣體包體總成的各種實施例的可壓縮墊圈材料之約20%至約40%撓曲之間。 As indicated in the exploded perspective view of Figure 9A, the inner frame member 311 of the wall frame 310 can be coupled to the vertical side 354 of the wall frame 350 to form a building seam of the gas enclosure assembly. With respect to the seal of the building seam thus formed, in various embodiments of the gasket seal at the terminal joint of the wall frame member according to the present teachings as depicted in FIG. 9A, the length 325 of the washer 320, the length of the washer 360 365 And the lengths 345 of the washers 340 are all aligned and evenly aligned. In addition, as will be discussed in greater detail later, various embodiments of the present spacer between the present teachings can provide uniform compression that is compressible between various embodiments of a gas inclusion assembly for hermetically sealing the present teachings. Between about 20% and about 40% deflection of the gasket material.

圖9B描繪所有框架構件被連接在一起之後的根據本教示之密封總成300,以便描繪壓縮狀態下之墊圈。圖9B係透視圖,其展示在第一壁框架310、第二壁框架350及以假想視圖來展示之天花板框架370之間的頂部終端接合點處所形成的三面接縫之角密封的細節。如圖9B中所展示,間隔板所界定之墊圈空間可被確定為一寬度,以使得在壁框架310、壁框架350及以假想視圖來展示之天花板框架370連接在一起後,介於用於形成垂直、水平及三面墊圈密封之可壓縮墊圈材料的約20%至約40%撓曲之間的均勻壓縮確保在壁框架構件之接縫處獲密封的所有表面處的墊圈密封可提供氣密式密封。另外,墊圈間隙302、304及306(未圖示)經設定尺寸,以使得在介於可壓縮墊圈材料之約20%至約40%撓曲之間的最佳壓縮後,每一墊圈可填充墊圈間隙,如圖9B中關於墊圈340及墊圈360所展示。 因此,除了藉由界定一空間且每一墊圈係佈置於該空間中且黏附至該空間來提供均勻壓縮之外,經設計來提供間隙之間隔板的各種實施例亦確保每一壓縮之墊圈可適應由間隔板所界定之空間而不會在壓縮狀態下起皺或膨出或以其他方式不規則地形成,從而可能形成洩漏路徑。 Figure 9B depicts the seal assembly 300 in accordance with the present teachings after all of the frame members have been joined together to depict the gasket in a compressed state. Figure 9B is a perspective view showing details of the angular seal of the three-sided seam formed at the top end joint between the first wall frame 310, the second wall frame 350, and the ceiling frame 370 shown in an imaginary view. As shown in FIG. 9B, the gasket space defined by the spacers can be determined to be a width such that after the wall frame 310, the wall frame 350, and the ceiling frame 370 shown in an imaginary view are joined together, Uniform compression between about 20% and about 40% of the compressible gasket material forming the vertical, horizontal and three-sided gasket seals ensures that the gasket seal at all surfaces sealed at the seam of the wall frame member provides airtightness Sealed. Additionally, the gasket gaps 302, 304, and 306 (not shown) are sized such that after optimal compression between about 20% to about 40% deflection of the compressible gasket material, each gasket can be filled The gasket gap is shown in Figure 9B with respect to washer 340 and washer 360. Thus, in addition to providing uniform compression by defining a space in which each gasket is disposed in the space and adhered to the space, various embodiments designed to provide a spacer between the gaps also ensure that each compressed gasket is The space defined by the spacers is accommodated without wrinkling or bulging in a compressed state or otherwise irregularly formed, thereby possibly forming a leak path.

根據本教示之氣體包體總成的各種實施例,各種類型之區段面板可使用佈置於面板區段框架中之每一者上的可壓縮墊圈材料來密封。與框架構件墊圈密封相結合,用來形成各種區段面板與面板區段框架之間的密封之可壓縮墊圈的位置及材料可提供具有很少的氣體洩漏或沒有氣體洩漏之氣密式密封型氣體包體總成。另外,所有類型之面板(諸如圖5之嵌入式面板110、窗口面板120及易於移除之服務窗口130)的密封設計可提供在此等面板之反復移除及安裝之後的耐久性面板密封,需要此等面板之反復移除及安裝來接取氣體包體總成之內部,以便例如進行維護。 In accordance with various embodiments of the gas enclosure assembly of the present teachings, various types of segment panels can be sealed using a compressible gasket material disposed on each of the panel segment frames. In combination with the frame member gasket seal, the position and material of the compressible gasket used to form the seal between the various segment panels and the panel segment frame provides a hermetic seal with little or no gas leakage. Gas inclusion assembly. In addition, the sealed design of all types of panels, such as the inlaid panel 110 of FIG. 5, the window panel 120, and the easily removable service window 130, provides a durable panel seal after repeated removal and installation of such panels. Repeated removal and installation of such panels is required to access the interior of the gas enclosure assembly for, for example, maintenance.

例如,圖10A係描繪服務窗口面板區段30及易於移除之服務窗口130的分解視圖。如前面所討論,服務窗口面板區段30可經製造用於接納易於移除之服務窗口130。對於氣體包體總成之各種實施例,諸如可移除之服務面板區段30之面板區段可具有面板區段框架32以及佈置於面板區段框架32上的可壓縮墊圈38。在各種實施例中,與將易於移除之服務窗口130緊固於可移除之服務窗口面板區段30中相關的硬體可為終端使用者進行安裝及重新安裝提供方便,且同時確保當需要直接接取氣體包體總成之內部的終端使用者需要易於移除之服務窗口130被安裝及重新安裝於面板30中時,維持氣密式密封得以。易於移除之服務窗口130可包括剛性窗口框架132,該剛性窗口框架可由例如但不限於經描述用於建構本教示之框 架構件中之任一者的金屬管材料建構而成。服務窗口130可利用快速作用緊固硬體,例如但不限於反作用肘節夾136,以便提供終端使用者對服務窗口130之輕鬆移除及重新安裝。圖10A中所展示的係前面提及的圖7A至圖7B之手套埠硬體總成160,其展示一組3個卡口式閂鎖166。 For example, FIG. 10A depicts an exploded view of service window panel section 30 and service window 130 that is easily removed. As previously discussed, the service window panel section 30 can be manufactured for receiving a service window 130 that is easily removable. For various embodiments of the gas enclosure assembly, a panel section such as the removable service panel section 30 can have a panel section frame 32 and a compressible gasket 38 disposed on the panel section frame 32. In various embodiments, the hardware associated with securing the service window 130 that is easily removable to the removable service window panel section 30 facilitates installation and reinstallation for the end user while ensuring The service window 130, which requires direct access to the interior of the gas enclosure assembly, needs to be easily removed, and the airtight seal is maintained when the service window 130 that is easily removed is installed and reinstalled in the panel 30. The service window 130 that is easily removable may include a rigid window frame 132 that may be, for example, but not limited to, the frame described for constructing the present teachings. The metal tube material of any of the structural members is constructed. The service window 130 can be fastened with a fast acting hardware such as, but not limited to, a reaction toggle clamp 136 to provide easy removal and reinstallation of the service window 130 by the end user. The glove cartridge hardware assembly 160 of FIGS. 7A-7B, previously shown in FIG. 10A, shows a set of three bayonet latches 166.

如圖10A之可移除之服務窗口面板區段30之前視圖中所展示,易於移除之服務窗口130可具有固定在窗口框架132上之一組四個肘節夾136。可將服務窗口130以所定義的距離定位至面板區段框架30中,以確保抵靠在墊圈38上之適當壓縮力。使用如圖10B中所展示之一組四個窗口導引間隔物34,其可安裝於面板區段30之每一角中,以便將服務窗口130定位於面板區段30中。可提供一組夾緊座36中之每一者來接納易於移除之服務窗口130的反作用肘節夾136。根據在安裝及移除週期中對服務窗口130的氣密式密封之各種實施例,服務窗口框架132之機械強度與藉由一組窗口導引間隔物34所提供之服務窗口130相對於可壓縮墊圈38之所定義位置相結合,可確保一旦例如但不限於使用緊固於對應之夾緊座36中之反作用肘節夾136將服務窗口130固定於適當位置,服務窗口框架132則可在面板區段框架32上提供均勻的力,其具有由一組窗口導引間隔物34所設定之所定義壓縮。該組窗口導引間隔物34經定位,以使得窗口130對墊圈38之壓縮力使可壓縮墊圈38撓曲約20%至約40%之間。就此而言,服務窗口130之建構以及面板區段30之製造提供面板區段30中之服務窗口130的氣密式密封。如前面所討論,可在將服務窗口130緊固於面板區段30中後將窗口夾35安裝至面板區段30中,且在需要移除服務窗口130時而移除窗口夾35。 As shown in the front view of the removable service window panel section 30 of FIG. 10A, the service window 130 that is easily removable may have a set of four toggle clamps 136 that are secured to the window frame 132. The service window 130 can be positioned into the panel section frame 30 at a defined distance to ensure proper compression against the washer 38. A set of four window guiding spacers 34, as shown in FIG. 10B, can be used, which can be mounted in each corner of the panel section 30 to position the service window 130 in the panel section 30. A set of clamping seats 36 can be provided to receive the reaction toggle clamp 136 of the service window 130 that is easily removable. According to various embodiments of the hermetic seal of the service window 130 during the installation and removal cycle, the mechanical strength of the service window frame 132 is comparable to the service window 130 provided by the set of window guide spacers 34. The combination of the defined positions of the washers 38 ensures that the service window frame 132 can be in the panel once, for example, but not limited to, the use of the reaction toggle clamp 136 secured in the corresponding clamp seat 36 to secure the service window 130 in place. A uniform force is provided on the segment frame 32 with the defined compression set by a set of window guiding spacers 34. The set of window guiding spacers 34 are positioned such that the compressive force of the window 130 against the washer 38 deflects the compressible gasket 38 by between about 20% and about 40%. In this regard, the construction of the service window 130 and the manufacture of the panel section 30 provide a hermetic seal of the service window 130 in the panel section 30. As previously discussed, the window clamp 35 can be installed into the panel section 30 after the service window 130 is secured in the panel section 30, and the window clamp 35 is removed when the service window 130 needs to be removed.

可使用任何合適之裝置以及裝置之組合將反作用肘節夾136固定至易於移除之服務窗口框架132。可使用的合適之固定裝置的實例包括:至少一黏合劑,例如但不限於環氧樹脂或水泥;至少一螺栓;至少一螺釘;至少一其他緊固件;至少一槽口;至少一軌道;至少一焊接點及其組合。反作用肘節夾136可直接連接至可移除之服務窗口框架132或經由接頭板來間接連接。反作用肘節夾136、夾緊座36、窗口導引間隔物34以及窗口夾35可由任何合適之材料及材料之組合建構而成。例如,一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。 The reaction toggle clamp 136 can be secured to the service window frame 132 that is easily removable using any suitable device and combination of devices. Examples of suitable fastening means that can be used include: at least one adhesive such as, but not limited to, epoxy or cement; at least one bolt; at least one screw; at least one other fastener; at least one notch; at least one track; A solder joint and its combination. The reaction toggle clamp 136 can be directly coupled to the removable service window frame 132 or indirectly via a connector plate. The reaction toggle clamp 136, the clamp seat 36, the window guide spacer 34, and the window clamp 35 can be constructed from any suitable combination of materials and materials. For example, one or more of such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof.

除了密封易於移除之服務窗口之外,氣密式密封亦可被提供用於嵌入式面板及窗口面板。可在面板區段中反復安裝及移除的其他類型之區段面板包括:例如但不限於嵌入式面板110及窗口面板120,如圖5中所展示。如圖5中可看出,窗口面板120之面板框架122係與嵌入式面板110類似地建構而成。因此,根據氣體包體總成之各種實施例,用於接納嵌入式面板及窗口面板之面板區段的製造可相同。就此而言,可使用相同原理來實行嵌入式面板及窗口面板之密封。 In addition to sealing the service window that is easy to remove, a hermetic seal can also be provided for the embedded panel and the window panel. Other types of segment panels that may be repeatedly installed and removed in the panel section include, for example, but are not limited to, the embedded panel 110 and the window panel 120, as shown in FIG. As can be seen in Figure 5, the panel frame 122 of the window panel 120 is constructed similarly to the embedded panel 110. Thus, depending on various embodiments of the gas enclosure assembly, the manufacture of the panel sections for receiving the embedded panels and window panels can be the same. In this regard, the same principle can be used to implement the sealing of the embedded panel and the window panel.

參考圖11A及圖11B,且根據本教示之各種實施例,氣體包體(諸如圖1之氣體包體總成100)之面板中之任一者可包括一或多個嵌入式面板區段10,該或該等嵌入式面板區段可具有經組配來接納對應之嵌入式面板110之框架12。圖11A係指示圖11B中所展示之放大部分的透視圖。在圖11A中,嵌入式面板110經描繪為相對於嵌入式框架12來定位。如圖11B中可看出,將嵌入式面板110貼附於框架12,其中框架12可例如由金屬建構而成。在一些實施例中,該金屬可包含鋁、鋼、銅、不銹鋼、鉻、 合金及其組合以及類似物。可在嵌入式面板區段框架12中製作複數個盲螺孔14。面板區段框架12經建構以便包含介於嵌入式面板110與框架12之間的墊圈16,可壓縮墊圈18可佈置於其中。盲螺孔14可為M5品種。螺釘15可由盲螺孔14接納,從而壓縮介於嵌入式面板110與框架12之間的墊圈16。一旦抵靠墊圈16緊固至適當位置,嵌入式面板110則在嵌入式面板區段10中形成氣密式密封。如前面所討論,可針對多種區段面板實行此面板密封,該等區段面板包括但不限於圖5中所展示之嵌入式面板110及窗口面板120。 11A and 11B, and in accordance with various embodiments of the present teachings, any of the panels of a gas enclosure (such as the gas enclosure assembly 100 of FIG. 1) can include one or more embedded panel sections 10 The or the embedded panel sections can have a frame 12 that is assembled to receive a corresponding embedded panel 110. Fig. 11A is a perspective view showing an enlarged portion shown in Fig. 11B. In FIG. 11A, the embedded panel 110 is depicted as being positioned relative to the inlaid frame 12. As can be seen in Figure 11B, the embedded panel 110 is attached to the frame 12, wherein the frame 12 can be constructed, for example, from metal. In some embodiments, the metal may comprise aluminum, steel, copper, stainless steel, chromium, Alloys and combinations thereof and the like. A plurality of blind screw holes 14 can be made in the embedded panel section frame 12. The panel section frame 12 is constructed to include a gasket 16 between the embedded panel 110 and the frame 12 in which the compressible gasket 18 can be disposed. The blind screw hole 14 can be of the M5 variety. The screw 15 can be received by the blind screw hole 14 to compress the gasket 16 between the embedded panel 110 and the frame 12. Once secured against the gasket 16 in place, the inset panel 110 forms a hermetic seal in the embedded panel section 10. As discussed above, this panel seal can be implemented for a variety of segment panels, including but not limited to the embedded panel 110 and window panel 120 shown in FIG.

根據本教示之可壓縮墊圈的各種實施例,用於框架構件密封及面板密封的可壓縮墊圈材料可選自多種可壓縮聚合物材料,例如但不限於封閉胞體(closed-cell)聚合物材料之類別中的任何材料,在此項技術中亦稱為膨脹橡膠材料或膨脹聚合物材料。簡單而言,封閉胞體聚合物係以氣體被包封在離散胞體中之方式製備;其中每一離散胞體係由聚合物材料所包封。需要在框架組件及面板組件之氣密式密封中使用的可壓縮封閉胞體聚合物墊圈材料之特性包括但不限於:該等材料在廣泛化學物種之化學腐蝕下表現穩健;擁有極好之防潮特性;在廣泛之溫度範圍內有彈性;以及其能夠抵抗永久性壓縮變形。大體而言,與開放胞體結構型聚合物材料相比,封閉胞體聚合物材料具有較高之尺寸穩定性、較低之吸濕係數及較高之強度。用來製造封閉胞體聚合物材料之各種類型的聚合物材料包括:例如但不限於聚矽氧、氯丁橡膠(neoprene)、乙烯-丙烯-二烯三元共聚物(EPT);使用甲基-丙烯-二烯單體(EPDM)製造之聚合物及複合材料、乙烯基晴(vinyl nitrile)、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合 物。 According to various embodiments of the compressible gasket of the present teachings, the compressible gasket material for the frame member seal and the panel seal can be selected from a variety of compressible polymer materials such as, but not limited to, closed-cell polymer materials. Any material in the class is also referred to in the art as an expanded rubber material or an expanded polymeric material. Briefly, a closed cell polymer is prepared in such a manner that a gas is encapsulated in discrete cell bodies; wherein each discrete cell system is encapsulated by a polymeric material. The properties of the compressible, closed cell polymer gasket material that are required for use in the hermetic seal of the frame assembly and the panel assembly include, but are not limited to, those materials that perform robustly under chemical corrosion by a wide range of chemical species; have excellent moisture resistance Characteristics; elastic in a wide range of temperatures; and its resistance to permanent compression deformation. In general, closed cell polymeric materials have higher dimensional stability, lower moisture absorption coefficient, and higher strength than open cell structured polymeric materials. The various types of polymeric materials used to make the closed cell polymeric material include, for example, but are not limited to, polyoxynium, neoprene, ethylene-propylene-diene terpolymer (EPT); - Polymers and composites made from propylene-diene monomer (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof Things.

僅當包含塊狀材料之胞體在使用期間保持完整時,封閉胞體聚合物之所需材料特性才得以維持。就此而言,以可能超出針對封閉胞體聚合物所設定之材料規格(例如超出在規定溫度或壓縮範圍中使用之規格)的方式來使用此材料可能引起墊圈密封之退化。在用於密封框架面板區段中之框架構件及區段面板的封閉胞體聚合物墊圈之各種實施例中,此等材料之壓縮不應超出約50%至約70%之間的撓曲,且為了實現最佳性能,壓縮可介於約20%至約40%之間的撓曲。 The desired material properties of the closed cell polymer are maintained only when the cell body comprising the bulk material remains intact during use. In this regard, the use of this material in a manner that may exceed the material specifications set for the closed cell body polymer (e.g., beyond the specifications used in the specified temperature or compression range) may cause degradation of the gasket seal. In various embodiments of the closed cell polymer gasket for sealing the frame members and segment panels in the frame panel section, the compression of such materials should not exceed about 50% to about 70% deflection. And for optimum performance, the compression can be between about 20% and about 40% deflection.

除了封閉胞體可壓縮墊圈材料之外,具有所需性質以便用於建構根據本教示之氣體包體總成之實施例的可壓縮墊圈材料類別的另一實例包括空心擠製型可壓縮墊圈材料類別。作為一種材料類別,空心擠製型墊圈材料具有所需屬性,包括但不限於:該等墊圈材料在廣泛化學物種之化學腐蝕下表現穩健;擁有極好之防潮特性;在廣泛之溫度範圍內有彈性;以及其能夠抵抗永久性壓縮變形。此等空心擠製型可壓縮墊圈材料可表現為廣泛多種外觀尺寸,諸如:例如但不限於U型胞體、D型胞體、正方形胞體、矩形胞體,以及多種定製外觀尺寸空心擠製型墊圈材料中之任一者。各種空心擠製型墊圈材料可由用於封閉胞體可壓縮墊圈製造之聚合物材料製成。例如但不限於空心擠製墊圈之各種實施例可由以下製成:聚矽氧、氯丁橡膠、乙烯-丙烯-二烯三元共聚物(EPT)、使用甲基-丙烯-二烯單體(EPDM)製造之聚合物及複合材料、乙烯基晴、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物。為了維持所需屬性,此等空心胞體墊圈材料之壓縮不應超出約50%的撓曲。 In addition to the closed cell body compressible gasket material, another example of a class of compressible gasket materials having desirable properties for constructing an embodiment of a gas inclusion body in accordance with the present teachings includes a hollow extruded compressible gasket material category. As a material class, hollow extruded gasket materials have desirable properties including, but not limited to, those gasket materials that perform well under chemical corrosion of a wide range of chemical species; have excellent moisture barrier properties; and have a wide temperature range Elastic; and it is resistant to permanent compression deformation. These hollow extruded compressible gasket materials can be expressed in a wide variety of appearance sizes such as, but not limited to, U-shaped cell bodies, D-type cell bodies, square cell bodies, rectangular cell bodies, and a variety of custom-made exterior sizes. Any of the types of gasket materials. Various hollow extruded gasket materials can be made from polymeric materials used to seal cell body compressible gaskets. Various embodiments such as, but not limited to, hollow extruded gaskets can be made from polyoxyn, chloroprene, ethylene-propylene-diene terpolymer (EPT), using methyl-propylene-diene monomers ( Polymers and composites made from EPDM), vinyl styrene, styrene-butadiene rubber (SBR) and various copolymers and blends thereof. In order to maintain the desired properties, the compression of such hollow cell gasket materials should not exceed about 50% deflection.

一般技藝人士可易於理解的是,儘管已作為實例來給出封閉胞體可壓縮墊圈材料類別及空心擠製型可壓縮墊圈材料類別,但可使用具有所需屬性的任何可壓縮墊圈材料來密封諸如各種壁框架構件及天花板框架構件之結構組件,以及密封面板區段框架中之各種面板,如本教示所提供。 One of ordinary skill in the art will readily appreciate that although a closed cell compressible gasket material class and a hollow extruded compressible gasket material class have been given as examples, any compressible gasket material having the desired properties can be used to seal. Structural components such as various wall frame members and ceiling frame members, as well as various panels in the sealed panel section frame, as provided by the present teachings.

可進行由複數個框架構件來建構氣體包體總成(諸如圖3及圖4之氣體包體總成100,或如隨後將討論的圖23及圖24之氣體包體總成1000)以便使損壞系統組件之風險最小化,該等系統組件諸如:例如但不限於墊圈密封件、框架構件、管道及區段面板。例如,墊圈密封件係在由複數個框架構件建構氣體包體期間可能容易損壞之組件。根據本教示之各種實施例,提供材料及方法以便在根據本教示之氣體包體的建構期間最小化或消除損壞氣體包體總成之各種組件的風險。 A gas inclusion assembly (such as the gas inclusion assembly 100 of Figures 3 and 4, or the gas inclusion assembly 1000 of Figures 23 and 24 as will be discussed later) can be constructed from a plurality of frame members to enable The risk of damaging system components such as, for example but not limited to, gasket seals, frame members, pipes, and section panels. For example, a gasket seal is a component that can be easily damaged during construction of a gas enclosure by a plurality of frame members. In accordance with various embodiments of the present teachings, materials and methods are provided to minimize or eliminate the risk of damaging various components of the gas enclosure assembly during construction of the gas enclosure in accordance with the present teachings.

圖12A係諸如圖3之氣體包體總成100的氣體包體總成之初始建構階段的透視圖。儘管使用諸如氣體包體總成100之氣體包體總成來例證本教示之氣體包體總成的建構,但是一般技藝人士可認識到,此等教示適用於氣體包體總成之各種實施例。如圖12A中所描繪,在氣體包體總成之初始建構階段期間,首先將複數個間隔塊置放在由底座202支撐之底盤204上。該等間隔塊可比安裝於底盤204上之各種壁框架構件上所佈置的可壓縮墊圈材料厚。可將一系列間隔塊置放在底盤204之外圍邊緣上之多個位置處,在該等位置處,可在組裝期間將氣體包體總成之各種壁框架構件置放在一系列間隔塊上且置放至靠近底盤204之位置中而不接觸底盤204。需要以某種方式在底盤204上組裝各種壁框架構件,以使得可防護對 佈置於各種壁框架構件上以便與底盤204密封之可壓縮墊圈材料的任何損壞。因此,間隔塊之使用防止對佈置於各種壁框架構件上以便與底盤204形成氣密式密封之可壓縮墊圈材料的此損壞,在該等間隔塊上可將各種壁面板組件置放至底盤204上之初始位置中。例如但不限於,如圖12A中所展示,前部外圍邊緣201可具有間隔物93、95及97,前部壁框架構件可擱置於該等間隔物上;右側外圍邊緣205可具有間隔物89及91,右側壁框架構件可擱置於該等間隔物上;且後部外圍邊緣207可具有兩個間隔物,後部壁框架構件可擱置於該等間隔物上,展示了其中一個間隔物87。可使用任何數量、類型之間隔塊及其組合。一般技藝人士將理解的是,可根據本教示將間隔塊定位在底盤204上,儘管圖12A至圖14B中之每一者中未例示相異之間隔塊。 Figure 12A is a perspective view of the initial construction phase of a gas inclusion assembly such as the gas inclusion body assembly 100 of Figure 3. Although a gas inclusion assembly such as gas inclusion assembly 100 is used to exemplify the construction of the gas inclusion assembly of the present teachings, one of ordinary skill in the art will recognize that such teachings are applicable to various embodiments of gas inclusion assemblies. . As depicted in FIG. 12A, during the initial construction phase of the gas inclusion assembly, a plurality of spacer blocks are first placed on the chassis 204 supported by the base 202. The spacer blocks may be thicker than the compressible gasket material disposed on the various wall frame members mounted on the chassis 204. A series of spacer blocks can be placed at a plurality of locations on the peripheral edge of the chassis 204 at which various wall frame members of the gas enclosure assembly can be placed over a series of spacer blocks during assembly. And placed in a position close to the chassis 204 without contacting the chassis 204. It is desirable to assemble various wall frame members on the chassis 204 in some manner to enable protection against Any damage to the compressible gasket material disposed on the various wall frame members to seal against the chassis 204. Thus, the use of spacers prevents such damage to the compressible gasket material disposed on the various wall frame members to form a hermetic seal with the chassis 204 on which various wall panel assemblies can be placed onto the chassis 204. In the initial position. For example, without limitation, as shown in FIG. 12A, the front peripheral edge 201 can have spacers 93, 95, and 97 on which the front wall frame members can rest; the right peripheral edge 205 can have spacers 89 And 91, the right side wall frame member can rest on the spacers; and the rear peripheral edge 207 can have two spacers on which the rear wall frame members can rest, showing one of the spacers 87. Any number, type of spacer blocks, and combinations thereof can be used. One of ordinary skill in the art will appreciate that the spacer blocks can be positioned on the chassis 204 in accordance with the present teachings, although distinct spacer blocks are not illustrated in each of Figures 12A-14B.

在圖12B中展示根據本教示之關於由組件框架構件來組裝氣體包體之各種實施例的示例性間隔塊,圖12B係圖12A之圓圈部分中所展示之第三間隔塊91的透視圖。示例性間隔塊91可包括附接至間隔塊之橫向側92的間隔塊條(spacer block strap)90。間隔塊可由任何合適之材料以及材料之組合製成。例如,每一間隔塊可包含超高分子量聚乙烯。間隔塊條90可由任何合適之材料以及材料之組合製成。在一些實施例中,間隔塊條90包含尼龍(nylon)材料、聚亞烷基材料或類似物。間隔塊91具有頂部表面94及底部表面96。間隔塊87、89、93、95、97及任何其他所使用的間隔塊可以相同或類似之實體屬性來組配且可包含相同或類似之材料。間隔塊可以允許穩定的置放而又容易移除之方式擱置於、夾緊於或以其他方式容易地佈置於底盤204之外圍上部邊緣。 An exemplary spacer block for various embodiments of assembling a gas enclosure from a component frame member in accordance with the present teachings is shown in FIG. 12B, which is a perspective view of a third spacer block 91 shown in the circled portion of FIG. 12A. The exemplary spacer block 91 can include a spacer block strap 90 attached to the lateral side 92 of the spacer block. The spacer block can be made of any suitable material and combination of materials. For example, each spacer block can comprise ultra high molecular weight polyethylene. The spacer strip 90 can be made of any suitable material and combination of materials. In some embodiments, the spacer strip 90 comprises a nylon material, a polyalkylene material, or the like. Spacer block 91 has a top surface 94 and a bottom surface 96. The spacer blocks 87, 89, 93, 95, 97 and any other spacer blocks used may be grouped together with the same or similar physical attributes and may comprise the same or similar materials. The spacer blocks may be placed, clamped, or otherwise easily disposed on the peripheral upper edge of the chassis 204 in a manner that allows for stable placement while being easily removed.

在圖13中所呈現之分解透視圖中,框架構件可包含前部壁框架210、左側壁框架220、右側壁框架230、後部壁框架240以及天花板或頂部框架250,該等框架可附接至擱置於底座202上之底盤204。OLED列印系統50可安裝於底盤204之頂部上。 In the exploded perspective view presented in Figure 13, the frame member can include a front wall frame 210, a left side wall frame 220, a right side wall frame 230, a rear wall frame 240, and a ceiling or top frame 250 that can be attached to The chassis 204 rests on the base 202. The OLED printing system 50 can be mounted on top of the chassis 204.

根據本教示之氣體包體總成及系統的各種實施例之OLED列印系統50可包含例如:花崗岩底座;移動式橋,其可支撐OLED列印裝置;自加壓惰性氣體再循環系統延伸之一或多個裝置及設備,諸如基板漂浮台、空氣軸承、軌道、軌條;用於將OLED成膜材料沈積至基板上之噴墨印表機系統,其包括OLED墨水供應子系統及噴墨列印頭;一或多個機器人及類似物。考慮到可包含OLED列印系統50之組件的多樣性,OLED列印系統50之各種實施例可具有多種佔據面積及外觀尺寸。 The OLED printing system 50 of various embodiments of the gas inclusion assembly and system in accordance with the present teachings can include, for example, a granite base; a mobile bridge that can support an OLED printing device; and a self-pressurizing inert gas recirculation system One or more devices and devices, such as substrate floating tables, air bearings, rails, rails; inkjet printer systems for depositing OLED film-forming materials onto substrates, including OLED ink supply subsystems and inkjets Print head; one or more robots and the like. Various embodiments of OLED printing system 50 can have a variety of footprints and appearance sizes in view of the variety of components that can include OLED printing system 50.

OLED噴墨列印系統可由若干裝置及設備組成,該等裝置及設備允許墨水液滴至基板上之特定位置上的可靠置放。此等裝置及設備可包括但不限於:列印頭總成;墨水輸送系統;運動系統;基板支撐設備,諸如漂浮台或卡盤;基板裝載及卸載系統;以及列印頭維護系統。列印頭總成由至少一個噴墨頭組成,該至少一個噴墨頭具有能夠以受控制之速率、速度及大小來噴射墨水液滴的至少一個孔口。該噴墨頭係由墨水供應系統供給,該墨水供應系統提供墨水至噴墨頭。列印需要列印頭總成與基板之間的相對運動。此運動係藉由運動系統來實現,該運動系統通常為門架或分體軸XYZ系統。列印頭總成可在固定基板上方移動(門架式),或在分體軸組配之狀況下,列印頭與基板均可移動。在另一實施例中,列印台可為固定的,且基板可相對於列印頭在X軸及Y軸上移動,其中在基板 處或列印頭處提供Z軸運動。隨著列印頭相對於基板移動,在正確的時間噴射墨水液滴,以便將其沈積於基板上之所需位置中。使用基板裝載及卸載系統來插入基板並且自印表機移除基板。取決於印表機組配,此操作可藉由機械輸送機、基板漂浮台或具有末端執行器之機器人來實現。列印頭維護系統可由若干子系統(亦即,模組)組成,該等子系統允許進行維護任務,諸如液滴體積校準、噴墨噴嘴表面之擦拭、起動以便噴射墨水至廢料盆中。 An OLED inkjet printing system can be comprised of a number of devices and devices that allow for the secure placement of ink droplets to specific locations on a substrate. Such devices and devices may include, but are not limited to, a printhead assembly; an ink delivery system; a motion system; a substrate support device such as a float station or chuck; a substrate loading and unloading system; and a printhead maintenance system. The printhead assembly is comprised of at least one inkjet head having at least one orifice capable of ejecting ink droplets at a controlled rate, speed and size. The ink jet head is supplied by an ink supply system that supplies ink to the ink jet head. Printing requires relative movement between the print head assembly and the substrate. This movement is achieved by a motion system, typically a gantry or split shaft XYZ system. The print head assembly can be moved over the fixed substrate (gantry type), or the print head and the substrate can be moved in the case of the split shaft assembly. In another embodiment, the printing station can be fixed, and the substrate can be moved on the X-axis and the Y-axis relative to the printing head, wherein the substrate Z-axis motion is provided at or at the print head. As the print head moves relative to the substrate, ink droplets are ejected at the correct time to deposit them in the desired locations on the substrate. A substrate loading and unloading system is used to insert the substrate and remove the substrate from the printer. Depending on the printer unit, this can be done by a mechanical conveyor, a substrate floating table or a robot with an end effector. The printhead maintenance system can be comprised of a number of subsystems (i.e., modules) that allow for maintenance tasks such as droplet volume calibration, wiping of the inkjet nozzle surface, and activation to eject ink into the waste basin.

根據本教示之關於氣體包體之組裝的各種實施例,如圖13中所展示之前部或第一壁框架210、左側或第二壁框架220、右側或第三壁框架230、後部或第四壁框架240以及天花板框架250可按系統次序一起建構,並且隨後附接至安裝於底座202上之底盤204。如前面所討論,可使用門架起重機將框架構件之各種實施例定位在間隔塊上,以便防止對可壓縮墊圈材料之損壞。例如,使用門架起重機,可將前部壁框架210擱置於至少三個間隔塊上,諸如圖12A中所展示之底盤204的外圍上部邊緣201上之間隔塊93、95及97。在將前部壁框架210置放於間隔塊上之後,可將壁框架220及壁框架230按任何次序相繼地或循序地置放於間隔塊上,該等間隔塊已分別設置於底盤204之外圍邊緣203及外圍邊緣205上。根據本教示之關於由組件框架構件來組裝氣體包體的各種實施例,可將前部壁框架210置放於間隔塊上,隨後將左側壁框架220及右側壁框架230置放於間隔塊上,以使得該左側壁框架及該右側壁框架處於適當位置以便栓接或以其他方式緊固至前部壁框架210。在各種實施例中,可將後部壁框架240置放於間隔塊上,以使得該後部壁框架處於適當位置以便栓接或緊固至左側壁框 架220及右側壁框架230。對於各種實施例,一旦壁框架已固定在一起來形成相連的壁框架包體總成,則可將頂部天花板框架250貼附於此壁框架包體總成,來形成完整之氣體包體框架總成。在本教示之關於氣體包體總成之建構的各種實施例中,完整之氣體包體框架總成在此組裝階段係擱置於複數個間隔塊上以便保護各種框架構件墊圈之完整性。 According to various embodiments of the present teachings relating to the assembly of gas enclosures, such as the front or first wall frame 210, the left or second wall frame 220, the right or third wall frame 230, the rear or the fourth as shown in FIG. The wall frame 240 and the ceiling frame 250 can be constructed together in a system order and then attached to the chassis 204 mounted on the base 202. As discussed above, various embodiments of the frame members can be positioned on the spacer block using a gantry crane to prevent damage to the compressible gasket material. For example, using a gantry crane, the front wall frame 210 can rest on at least three spacer blocks, such as spacer blocks 93, 95 and 97 on the peripheral upper edge 201 of the chassis 204 shown in Figure 12A. After the front wall frame 210 is placed on the spacer block, the wall frame 220 and the wall frame 230 may be successively or sequentially placed on the spacer block in any order, and the spacer blocks are respectively disposed on the chassis 204. The peripheral edge 203 and the peripheral edge 205. According to various embodiments of the present teachings for assembling a gas enclosure from a component frame member, the front wall frame 210 can be placed on the spacer block, and then the left side wall frame 220 and the right side wall frame 230 are placed on the spacer block. The left side wall frame and the right side wall frame are in position to be bolted or otherwise fastened to the front wall frame 210. In various embodiments, the rear wall frame 240 can be placed on the spacer block such that the rear wall frame is in place for bolting or fastening to the left side wall frame The frame 220 and the right side wall frame 230. For various embodiments, once the wall frames have been secured together to form an associated wall frame inclusion assembly, the top ceiling frame 250 can be attached to the wall frame inclusion assembly to form a complete gas inclusion frame. to make. In various embodiments of the present teachings relating to the construction of gas inclusion assemblies, the complete gas inclusion frame assembly is placed over a plurality of spacer blocks during this assembly phase to protect the integrity of the various frame member gaskets.

如圖14A中所展示,對於本教示之關於氣體包體總成之建構的各種實施例,隨後可定位氣體包體框架總成400以使得間隔物可被移除,以便為將氣體包體框架總成400附接至底盤204作準備。圖14A描繪氣體包體框架總成400,使用升降器總成402、升降器總成404及升降器總成406將其升高至自間隔塊提升且離開間隔塊的位置。在本教示之各種實施例中,升降器總成402、404及406可附接在氣體包體框架總成400之外圍周圍。在附接了該等升降器總成之後,可藉由致動每一升降器總成來提升或延伸該等升降器總成中之每一者而自間隔塊提起完全建構之氣體包體框架總成,藉此提升氣體包體框架總成400。如圖14A中所展示,氣體包體框架總成400經展示為提升至複數個間隔塊之上方,其先前係擱置於該等間隔塊上。隨後可將該複數個間隔塊自其在底盤204上之擱置位置移除,以使得隨後可將框架可隨後被降下至底盤204上,並隨後將其附接至底盤204。 As shown in FIG. 14A, for various embodiments of the present teachings relating to the construction of a gas inclusion body assembly, the gas inclusion frame assembly 400 can then be positioned such that the spacers can be removed to facilitate the gas inclusion frame. Assembly 400 is attached to chassis 204 in preparation. FIG. 14A depicts a gas enclosure frame assembly 400 that is raised using lifter assembly 402, lifter assembly 404, and lifter assembly 406 to a position that is lifted from the spacer block and exits the spacer block. In various embodiments of the present teachings, lifter assemblies 402, 404, and 406 can be attached around the periphery of the gas enclosure frame assembly 400. After the lifter assemblies are attached, the fully constructed gas enclosure frame can be lifted from the spacer block by actuating each of the lifter assemblies to lift or extend each of the lifter assemblies The assembly, thereby enhancing the gas enclosure frame assembly 400. As shown in Figure 14A, the gas enclosure frame assembly 400 is shown as being lifted over a plurality of spacer blocks that were previously placed on the spacer blocks. The plurality of spacer blocks can then be removed from their resting position on the chassis 204 such that the frame can then be subsequently lowered onto the chassis 204 and subsequently attached to the chassis 204.

圖14B係根據本教示之升降器總成的各種實施例且如圖14A中所描繪之相同升降器總成402的分解視圖。如所展示,升降器總成402包括磨損墊408、安裝板410、第一夾鉗座(clamp mount)412及第二夾鉗座413。第一夾鉗414及第二夾鉗415經展示為符合對應之夾鉗座412及 413。千斤頂曲柄416附接至千斤頂軸桿418之頂部。千斤頂底座422被展示為千斤頂軸桿418之下端部的一部分。千斤頂底座422下方係腳座424,該腳座經組配來接納千斤頂軸桿418之下端部且可連接至千斤頂軸桿418之下端部。亦展示整平腳426,且其經組配來被腳座424接納。一般技藝人士可易於認識到,適合用於提升操作之任何裝置可用來自間隔塊升高氣體包體框架總成,以使得可移除間隔塊且將完整之氣體包體總成降下至底盤上。例如,代替諸如上述402、404及406之一或多個提升器總成,可使用液壓提升器、氣動提升器或電動提升器。 14B is an exploded view of the same elevator assembly 402 as depicted in FIG. 14A in accordance with various embodiments of the elevator assembly of the present teachings. As shown, the lifter assembly 402 includes a wear pad 408, a mounting plate 410, a first clamp mount 412, and a second clamp seat 413. The first clamp 414 and the second clamp 415 are shown as conforming to the corresponding clamp seat 412 and 413. A jack crank 416 is attached to the top of the jack shaft 418. The jack base 422 is shown as part of the lower end of the jack shaft 418. Below the jack base 422 is a footrest 424 that is assembled to receive the lower end of the jack shaft 418 and is connectable to the lower end of the jack shaft 418. Flattening feet 426 are also shown and are assembled to be received by foot 424. One of ordinary skill in the art will readily recognize that any device suitable for use in lifting operations may be used to raise the gas enclosure frame assembly from the spacer block such that the spacer block is removable and the complete gas inclusion assembly is lowered onto the chassis. For example, instead of one or more of the lifter assemblies such as 402, 404, and 406 described above, a hydraulic lifter, a pneumatic lifter, or an electric lifter can be used.

根據本教示之關於氣體包體總成之建構的各種實施例,可提供複數個緊固件且該複數個緊固件經組配來將複數個框架構件緊固在一起,並隨後將氣體包體框架總成緊固至底盤。該複數個緊固件可包括一或多個緊固件部分,其沿每一框架構件之每一邊緣佈置於一位置處,在該位置處對應之框架構件經組配來與複數個框架構件中之一相鄰框架構件相交。複數個緊固件及可壓縮墊圈可經組配以使得,當框架構件被連接在一起時,可壓縮墊圈係佈置成靠近內部且硬體靠近外部,以便硬體不會給本教示之氣密式包體總成提供複數個洩漏路徑。 In accordance with various embodiments of the present teachings relating to the construction of a gas enclosure assembly, a plurality of fasteners can be provided and the plurality of fasteners assembled to secure a plurality of frame members together, and then the gas inclusion frame The assembly is fastened to the chassis. The plurality of fasteners can include one or more fastener portions disposed at each of the edges of each frame member at a location at which the corresponding frame members are assembled into a plurality of frame members An adjacent frame member intersects. A plurality of fasteners and compressible gaskets can be assembled such that when the frame members are joined together, the compressible gaskets are arranged close to the interior and the hardware is close to the exterior so that the hardware does not impart airtightness to the present teachings. The body assembly provides a plurality of leak paths.

複數個緊固件可包含沿該等框架構件中之一或多者的邊緣之複數個螺栓,以及沿複數個框架構件中之一或多個不同框架構件的邊緣之複數個螺紋孔。複數個緊固件可包含複數個固定的螺栓。該等螺栓可包含自對應面板之外表面延伸出去的螺栓頭。該等螺栓可凹陷至框架構件中之凹部中。夾鉗、螺釘、鉚釘、黏合劑及其他緊固件可用來將該等框架構件固定在一起。該等螺栓或其他緊固件可延伸穿過該等框架構件中之一或 多者的外壁並且進入位於一或多個相鄰框架構件之側壁或頂部壁中的螺紋孔中或其他互補的緊固件特徵中。 The plurality of fasteners can include a plurality of bolts along an edge of one or more of the frame members, and a plurality of threaded holes along an edge of one or more of the plurality of frame members. A plurality of fasteners can include a plurality of fixed bolts. The bolts may include bolt heads that extend from the outer surface of the corresponding panel. The bolts can be recessed into the recesses in the frame member. Clamps, screws, rivets, adhesives, and other fasteners can be used to secure the frame members together. The bolts or other fasteners may extend through one of the frame members or The outer walls of the plurality are also inserted into threaded holes in the side walls or top walls of one or more adjacent frame members or other complementary fastener features.

如圖15至圖17中所描繪,對於用於建構氣體包體之方法的各種實施例,可將管道安裝於藉由將壁框架構件及天花板框架構件連接在一起而形成的內部部分中。對於氣體包體總成之各種實施例,可在建構處理期間安裝管道。根據本教示之各種實施例,可將管道安裝於已由複數個框架構件建構而成之氣體包體框架總成中。在各種實施例中,可在複數個框架構件被連接來形成氣體包體框架總成之前將管道安裝於該複數個框架構件上。用於氣體包體總成及系統之各種實施例的管道可經組配以使得自一或多個管道入口吸入管道中之大致全部氣體被移動通過在氣體包體總成內部之用於移除顆粒物的氣體循環及過濾迴路之各種實施例。另外,氣體包體總成及系統之各種實施例的管道可經組配來將在氣體包體總成外部的氣體淨化迴路之入口及出口與在氣體包體總成內部的用於移除顆粒物之氣體循環及過濾迴路分開。根據本教示之管道的各種實施例可由金屬薄片製成,該金屬薄片例如但不限於厚度約為80密耳之鋁薄片。 As depicted in Figures 15-17, for various embodiments of the method for constructing a gas enclosure, the conduit can be mounted in an interior portion formed by joining the wall frame member and the ceiling frame member together. For various embodiments of the gas inclusion assembly, the conduit can be installed during the construction process. In accordance with various embodiments of the present teachings, the conduit can be mounted in a gas enclosure frame assembly that has been constructed from a plurality of frame members. In various embodiments, a conduit can be mounted to the plurality of frame members prior to the plurality of frame members being joined to form the gas enclosure frame assembly. The conduits for various embodiments of the gas inclusion assembly and system can be assembled such that substantially all of the gas from the one or more conduit inlet suction conduits is moved through the interior of the gas enclosure assembly for removal Various embodiments of gas circulation and filtration circuits for particulate matter. Additionally, the gas inclusion assembly and the conduits of various embodiments of the system can be assembled to remove the particulate matter from the inlet and outlet of the gas purge circuit external to the gas inclusion assembly and within the gas inclusion assembly. The gas circulation and filtration circuit are separated. Various embodiments of the conduits in accordance with the present teachings can be made from sheet metal such as, but not limited to, aluminum flakes having a thickness of about 80 mils.

圖15描繪氣體包體總成100之管道總成500的右前部假想透視圖。包體管道總成500可具有前部壁面板管道總成510。如所展示,前部壁面板管道總成510可具有前部壁面板入口管道512、第一前部壁面板豎管514及第二前部壁面板豎管516,該等豎管均與前部壁面板入口管道512流體連通。第一前部壁面板豎管514經展示為具有出口515,該出口係與風扇過濾單元罩蓋103之天花板管道505密封地嚙合。以類似之方式,第二前部壁面板豎管516經展示為具有出口517,該出口係與風扇過濾單元罩蓋103 之天花板管道507密封地嚙合。就此而言,前部壁面板管道總成510提供用於利用前部壁面板入口管道512、經由每一前部壁面板豎管514及516使惰性氣體在氣體包體總成中自底部開始循環,並且分別經由出口505及507輸送空氣,以使得空氣可藉由例如風扇過濾單元752來過濾。如隨後將更為詳細地討論,可根據處理期間基板在列印系統中之實體位置來選擇風扇過濾單元之數量、大小及形狀。靠近風扇過濾單元752的係熱交換器742,該熱交換器作為熱調節系統之一部分可將循環通過氣體包體總成100之惰性氣體維持在所需溫度。 15 depicts an anterior perspective view of the right front of the duct assembly 500 of the gas enclosure assembly 100. The body duct assembly 500 can have a front wall panel duct assembly 510. As shown, the front wall panel duct assembly 510 can have a front wall panel inlet duct 512, a first front wall panel riser 514, and a second front wall panel riser 516, both of which are front and front Wall panel inlet conduit 512 is in fluid communication. The first front wall panel riser 514 is shown with an outlet 515 that sealingly engages the ceiling duct 505 of the fan filter unit cover 103. In a similar manner, the second front wall panel riser 516 is shown with an outlet 517 that is coupled to the fan filter unit cover 103. The ceiling duct 507 is sealingly engaged. In this regard, the front wall panel duct assembly 510 is provided for utilizing the front wall panel inlet duct 512 to circulate inert gas from the bottom in the gas enclosure assembly via each of the front wall panel risers 514 and 516. And air is delivered via outlets 505 and 507, respectively, such that the air can be filtered by, for example, fan filter unit 752. As will be discussed in more detail later, the number, size, and shape of the fan filter units can be selected based on the physical location of the substrate in the printing system during processing. The system heat exchanger 742 is adjacent to the fan filter unit 752, which maintains the inert gas circulating through the gas inclusion assembly 100 at a desired temperature as part of the thermal conditioning system.

右側壁面板管道總成530可具有右側壁面板入口管道532,其經由右側壁面板第一豎管534及右側壁面板第二豎管536與右側壁面板上部管道538流體連通。右側壁面板上部管道538可具有第一管道入口端535及第二管道出口端537,該第二管道出口端537與後部壁管道總成540之後部壁面板上部管道536流體連通。左側壁面板管道總成520可具有與關於右側壁面板總成530所描述之組件相同的組件,其中左側壁面板入口管道522在圖15中清晰可見,該左側壁面板入口管道經由第一左側壁面板豎管524及第一左側壁面板豎管524與左側壁面板上部管道(未圖示)流體連通。後部壁面板管道總成540可具有後部壁面板入口管道542,其與左側壁面板總成520及右側壁面板總成530流體連通。另外,後部壁面板管道總成540可具有後部壁面板底部管道544,其可具有後部壁面板第一入口541及後部壁面板第二入口543。後部壁面板底部管道544可經由第一隔框(bulkhead)547及第二隔框549與後部壁面板上部管道536流體連通,該等隔框結構可用來將例如但不限於電纜、線及管線以及類似物之各種束自氣體包體總成 100之外部饋送至內部中。管道開口533提供用於將電纜、線及管線以及類似物之多個束自後部壁面板上部管道536中移出,該等束可經由隔框549通過上部管道536。可使用如前面所述之可移除之嵌入式面板在外部氣密式密封隔框547及隔框549。後部壁面板上部管道經由通氣孔545與例如但不限於風扇過濾單元754流體連通,圖15中展示該通氣孔之一角。就此而言,左側壁面板管道總成520、右側壁面板管道總成530及後部壁面板管道總成540提供用於分別利用壁面板入口管道522、532及542以及後部面板下部管道544使惰性氣體在氣體包體總成中自底部開始循環,該等管道經由前面所述之各種豎管、管道、隔框通道及類似物與通氣孔545流體連通,以使得空氣可藉由例如風扇過濾單元754來過濾。靠近風扇過濾單元754的係熱交換器744,該熱交換器作為熱調節系統之一部分可將循環通過氣體包體總成100之惰性氣體維持在所需溫度。 The right side wall panel duct assembly 530 can have a right side wall panel inlet duct 532 that is in fluid communication with the right side wall panel upper duct 538 via the right side wall panel first riser 534 and the right side wall panel second riser 536. The right side wall panel upper duct 538 can have a first duct inlet end 535 and a second duct outlet end 537 that is in fluid communication with the rear wall duct assembly 540 rear wall panel upper duct 536. The left side wall panel duct assembly 520 can have the same components as described with respect to the right side wall panel assembly 530, with the left side wall panel inlet duct 522 being clearly visible in Figure 15, the left side wall panel inlet duct passing through the first left side wall The panel riser 524 and the first left side wall panel riser 524 are in fluid communication with the left side wall panel upper duct (not shown). The rear wall panel duct assembly 540 can have a rear wall panel inlet duct 542 that is in fluid communication with the left side wall panel assembly 520 and the right side wall panel assembly 530. Additionally, the rear wall panel duct assembly 540 can have a rear wall panel bottom duct 544 that can have a rear wall panel first inlet 541 and a rear wall panel second inlet 543. The rear wall panel bottom duct 544 can be in fluid communication with the rear wall panel upper duct 536 via a first bulkhead 547 and a second bulkhead 549, which can be used to, for example, but not limited to, cables, wires, and pipelines, and Various bundles of analogs from gas inclusion assemblies The outside of 100 is fed into the interior. A conduit opening 533 is provided for removing a plurality of bundles of cables, wires and lines, and the like, from the rear wall panel upper conduit 536, which may pass through the upper conduit 536 via the bulkhead 549. The removable airtight sealed frame 547 and bulkhead 549 can be externally sealed using a removable embedded panel as previously described. The rear wall panel upper duct is in fluid communication with, for example, but not limited to, a fan filter unit 754 via a vent 545, one of which is shown in FIG. In this regard, the left side wall panel duct assembly 520, the right side wall panel duct assembly 530, and the rear wall panel duct assembly 540 are provided for inert gas using the wall panel inlet ducts 522, 532, and 542 and the rear panel lower duct 544, respectively. Circulating from the bottom in the gas inclusion assembly, the conduits being in fluid communication with the vents 545 via various risers, conduits, bulkhead passages and the like as previously described such that air may be passed through, for example, a fan filter unit 754 To filter. The system heat exchanger 744 is adjacent to the fan filter unit 754, which maintains the inert gas circulating through the gas inclusion assembly 100 at a desired temperature as part of the thermal conditioning system.

圖15中展示經由開口533之電纜饋送。如隨後將更為詳細地討論,本教示之氣體包體總成的各種實施例提供用於使電纜、線及管線以及類似物之多個束穿過管道。為了消除在此等束周圍形成之洩漏路徑,可使用各種方法,該等方法用於使用保形材料來密封一束中之不同大小的電纜、線及管線。圖15中亦展示包體管道總成500之導管I及導管II,該等導管被展示為風扇過濾單元罩蓋103之一部分。導管I提供惰性氣體至外部空氣淨化系統之出口,而導管II提供淨化之惰性氣體至在氣體包體總成100內部的氣體循環及粒子過濾迴路的回流。 Cable feeding via opening 533 is shown in FIG. As will be discussed in greater detail later, various embodiments of the gas inclusion assembly of the present teachings are provided for passing a plurality of bundles of cables, wires and lines, and the like, through a conduit. In order to eliminate the leakage path formed around such bundles, various methods can be used for sealing different sizes of cables, wires and lines in a bundle using a conformal material. Also shown in Fig. 15 is conduit I and conduit II of the body conduit assembly 500, which are shown as part of the fan filter unit cover 103. The conduit I provides an inert gas to the outlet of the external air purification system, while the conduit II provides a purge of the inert gas to the gas circulation inside the gas inclusion assembly 100 and the reflux of the particle filtration circuit.

圖16中展示包體管道總成500之頂部假想透視圖。可看出左側壁面板管道總成520及右側壁面板管道總成530之對稱性質。對於右側 壁面板管道總成530,右側壁面板入口管道532經由右側壁面板第一豎管534及右側壁面板第二豎管536與右側壁面板上部管道538流體連通。右側壁面板上部管道538可具有第一管道入口端535及第二管道出口端537,該第二管道出口端537與後部壁管道總成540之後部壁面板上部管道536流體連通。類似地,左側壁面板管道總成520可具有左側壁面板入口管道522,其經由左側壁面板第一豎管524及左側壁面板第二豎管526與左側壁面板上部管道528流體連通。左側壁面板上部管道528可具有第一管道入口端525及第二管道出口端527,其中第二管道出口端527與後部壁管道總成540之後部壁面板上部管道536流體連通。另外,後部壁面板管道總成可具有後部壁面板入口管道542,其與左側壁面板總成520及右側壁面板總成530流體連通。另外,後部壁面板管道總成540可具有後部壁面板底部管道544,其可具有後部壁面板第一入口541及後部壁面板第二入口543。後部壁面板底部管道544可經由第一隔框547及第二隔框549與後部壁面板上部管道536流體連通。圖15及圖16中所展示之管道總成500可提供:惰性氣體自前部壁面板管道總成510的之有效循環,該前部壁面板管道總成使惰性氣體自前部壁面板入口管道512分別經由前部壁面板出口515及517循環至天花板面板管道505及507;以及惰性氣體自左側壁面板總成520、右側壁面板總成530及後部壁面板管道總成540之有效循環,上述三個總成使空氣分別自入口管道522、532及542循環至通氣孔545。一旦經由天花板面板管道505及507以及通氣孔545將惰性氣體排出至在包體100之風扇過濾單元罩蓋103下方的包體區域中,則如此排出的惰性氣體可經由風扇過濾單元752及754過濾。另外,可藉由熱交換器742及744將循環之惰性氣體維持在所需 溫度,該等熱交換器係熱調節系統之一部分。 An imaginary perspective view of the top of the package duct assembly 500 is shown in FIG. The symmetrical nature of the left side wall panel duct assembly 520 and the right side wall panel duct assembly 530 can be seen. For the right side The wall panel duct assembly 530, the right side wall panel inlet duct 532 is in fluid communication with the right side wall panel upper duct 538 via the right side wall panel first riser 534 and the right side wall panel second riser 536. The right side wall panel upper duct 538 can have a first duct inlet end 535 and a second duct outlet end 537 that is in fluid communication with the rear wall duct assembly 540 rear wall panel upper duct 536. Similarly, the left side wall panel duct assembly 520 can have a left side wall panel inlet duct 522 that is in fluid communication with the left side wall panel upper duct 528 via the left side wall panel first riser 524 and the left side wall panel second riser 526. The left side wall panel upper duct 528 can have a first duct inlet end 525 and a second duct outlet end 527, wherein the second duct outlet end 527 is in fluid communication with the rear wall duct assembly 540 rear wall panel upper duct 536. Additionally, the rear wall panel duct assembly can have a rear wall panel inlet duct 542 that is in fluid communication with the left side wall panel assembly 520 and the right side wall panel assembly 530. Additionally, the rear wall panel duct assembly 540 can have a rear wall panel bottom duct 544 that can have a rear wall panel first inlet 541 and a rear wall panel second inlet 543. The rear wall panel bottom duct 544 can be in fluid communication with the rear wall panel upper duct 536 via the first bulkhead 547 and the second bulkhead 549. The duct assembly 500 shown in Figures 15 and 16 provides for efficient circulation of inert gas from the front wall panel duct assembly 510 which causes inert gas from the front wall panel inlet duct 512, respectively. Circulation to ceiling panel ducts 505 and 507 via front wall panel outlets 515 and 517; and effective circulation of inert gas from left side wall panel assembly 520, right side wall panel assembly 530 and rear wall panel duct assembly 540, The assembly circulates air from inlet conduits 522, 532, and 542 to vent 545, respectively. Once the inert gas is discharged into the body region below the fan filter unit cover 103 of the package 100 via the ceiling panel ducts 505 and 507 and the vent 545, the exhaust gas thus discharged can be filtered through the fan filter units 752 and 754. . In addition, the circulating inert gas can be maintained at a desired temperature by heat exchangers 742 and 744. Temperature, these heat exchangers are part of a thermal conditioning system.

圖17係包體管道總成500之底部假想視圖。入口管道總成502包括前部壁面板入口管道512、左側壁面板入口管道522、右側壁面板入口管道532及後部壁面板入口管道542,該等入口管道彼此流體連通。對於入口管道總成502中所包括之每一入口管道,存在清晰可見的開口,該等開口跨每一管道之底部均勻分佈,為達本教示之目的,將該等開口之集合特別突顯為前部壁面板入口管道512之開口511、左側壁面板入口管道522之開口521、右側壁面板入口管道532之開口531以及後部壁面板入口管道542之開口541。跨每一入口管道之底部清晰可見的此等開口提供對包體100中之惰性氣體的有效吸取,以實現連續循環及過濾。氣體包體總成之各種實施例的惰性氣體之連續循環及過濾提供用於在氣體包體總成系統之各種實施例中維持大致上無粒子之環境。氣體包體總成系統之各種實施例可維持在關於顆粒物之ISO 14644第4級。氣體包體總成系統之各種實施例可維持在關於對粒子污染特別敏感之處理的ISO 14644第3級規格。如前面所討論,導管I提供惰性氣體至外部空氣淨化系統之出口,而導管II提供淨化之惰性氣體至在氣體包體總成100內部的過濾及循環迴路之回流。 Figure 17 is an imaginary view of the bottom of the body pipe assembly 500. The inlet duct assembly 502 includes a front wall panel inlet duct 512, a left side wall panel inlet duct 522, a right side wall panel inlet duct 532, and a rear wall panel inlet duct 542 that are in fluid communication with each other. For each inlet conduit included in the inlet conduit assembly 502, there are clearly visible openings that are evenly distributed across the bottom of each conduit, and for the purposes of this teaching, the collection of such openings is particularly prominent The opening 511 of the wall panel inlet duct 512, the opening 521 of the left side wall panel inlet duct 522, the opening 531 of the right side wall panel inlet duct 532, and the opening 541 of the rear wall panel inlet duct 542. These openings, which are clearly visible across the bottom of each inlet conduit, provide effective suction of the inert gas in the enclosure 100 for continuous circulation and filtration. Continuous circulation and filtration of the inert gases of various embodiments of the gas inclusion assembly provides for maintaining a substantially particle free environment in various embodiments of the gas inclusion assembly system. Various embodiments of the gas inclusion assembly system can be maintained at ISO 14644 level 4 for particulate matter. Various embodiments of the gas inclusion assembly system can maintain ISO 14644 Class 3 specifications for treatments that are particularly sensitive to particle contamination. As previously discussed, the conduit I provides an inert gas to the outlet of the external air purification system, while the conduit II provides a purge of the inert gas to the filtration and recycle loops within the gas inclusion assembly 100.

在根據本教示之氣體包體總成及系統的各種實施例中,電纜、線及管線以及類似物之多個束可操作性地與佈置於氣體包體總成及系統之內部中之電氣系統、機械系統、流體系統及冷卻系統(例如用於OLED列印系統之操作)相關聯。可經由管道來饋送此等束,以便沖洗吸留在電纜、線及管線以及類似物之多個束之無效空間中的反應性大氣氣體,諸如水蒸汽及氧氣。根據本教示,已發現形成於電纜、線及管線之多個束中之 無效空間會產生被吸留之反應性物種的儲積(reservoir),其可顯著地延長使氣體包體總成滿足關於執行空氣敏感型處理之規格所可能花費的時間。對於本教示之可用於列印OLED裝置的氣體包體總成及系統之各種實施例,各種反應性物種中之每一物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽,可將其維持在100ppm或更低,例如為10ppm或更低、1.0ppm或更低或者0.1ppm或更低。 In various embodiments of gas inclusion assemblies and systems in accordance with the present teachings, a plurality of bundles of cables, wires and lines, and the like, are operatively associated with electrical systems disposed within the interior of the gas enclosure assembly and system , mechanical systems, fluid systems, and cooling systems (eg, for operation of OLED printing systems) are associated. These bundles can be fed via a conduit to flush reactive atmospheric gases, such as water vapor and oxygen, occluded in the dead spaces of the plurality of bundles of cables, wires and lines and the like. According to the teachings, it has been found that it is formed in a plurality of bundles of cables, wires and pipelines. The ineffective space creates a reservoir of occluded reactive species that can significantly extend the time it takes for the gas inclusion assembly to meet specifications for performing air sensitive processing. For various embodiments of the gas inclusion assemblies and systems that can be used to print OLED devices, each of the various reactive species includes various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors, It can be maintained at 100 ppm or less, for example, 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less.

為了理解經由管道來饋送之纜線可如何導致減少自成束之電纜、線及管線以及類似物中之無效體積沖洗掉被吸留之反應性大氣氣體所花費的時間,參考圖18A至圖19。圖18A描繪束I之擴展視圖,該束可為可包括諸如管線A之管線的束,管線A係用於輸送各種墨水、溶劑及類似物至列印系統,諸如圖13之列印系統50。圖18A之束I可另外包括諸如電線B之電接線,或諸如同軸電纜C之纜線。此等管線、線及電纜可束在一起且自外部至內部選路通過,以便連接至包含OLED列印系統之各種裝置及設備。如圖18A之陰影區域中所看出,此等束可產生很大的無效空間D。在圖18B之示意性透視圖中,當電纜、線及管線束I係經由管道II來饋送時,惰性氣體III可連續地吹掃經過該束。圖19之擴展截面圖描繪惰性氣體連續地吹掃經過成束之管線、線及電纜如何可有效地增加自此等束中之無效體積移除被吸留之反應性物種之速率。反應性物種A(圖19中由物種A所佔據之集體區域來指示)自無效體積擴散之速率與無效體積外的反應性物種(圖19中由惰性氣體物種B所佔據之集體區域來指示)之濃度成反比。換言之,若緊靠在該無效體積外之體積中的反應性物種之濃度較高,則擴散之速率降低。若藉由惰性氣體流使此區域中之反應性物種濃度自緊 靠在該無效體積外的體積連續地降低,則藉由質量作用,反應性物種自無效體積擴散之速率增加。另外,藉由相同原理,隨著被吸留之反應性物種有效地自彼等空間被移除,惰性氣體可擴散至無效體積中。 In order to understand how the cable fed via the conduit can result in reduced time spent rinsing the occluded reactive atmospheric gas from the ineffective volume of the bundled cables, wires and lines, and the like, reference is made to Figures 18A-19. . Figure 18A depicts an expanded view of beam I, which may be a bundle that may include a pipeline such as pipeline A, which is used to convey various inks, solvents, and the like to a printing system, such as printing system 50 of Figure 13. The bundle I of Figure 18A may additionally include an electrical wiring such as wire B, or a cable such as coaxial cable C. These lines, wires and cables can be bundled together and routed from the outside to the inside for connection to various devices and equipment including OLED printing systems. As seen in the shaded area of Figure 18A, these bundles can create a large dead space D. In the schematic perspective view of Fig. 18B, when the cable, wire and bundle I are fed via conduit II, the inert gas III can be continuously purged through the bundle. Figure 19 is an expanded cross-sectional view depicting how the inert gas is continuously purged through the bundled lines, wires, and cables to effectively increase the rate at which the occluded reactive species are removed from the ineffective volume in the bundles. The rate of diffusion of reactive species A (indicated by the collective region occupied by species A in Figure 19) from the ineffective volume and the reactive species outside the void volume (indicated by the collective region occupied by inert gas species B in Figure 19) The concentration is inversely proportional. In other words, if the concentration of the reactive species in the volume immediately outside the void volume is higher, the rate of diffusion decreases. If the concentration of reactive species in this region is self-tightening by inert gas flow As the volume outside the void volume decreases continuously, the rate at which the reactive species diffuse from the ineffective volume increases by mass action. In addition, by the same principle, as the occluded reactive species are effectively removed from their spaces, the inert gas can diffuse into the void volume.

圖20A係氣體包體總成600之各種實施例的後部角之透視圖,以及穿過回流管道605進入氣體包體總成600之內部的假想視圖。對於氣體包體總成600之各種實施例,後部壁面板640可具有嵌入式面板610,該嵌入式面板經組配來提供對例如電氣隔框之接取。電纜、線及管線以及類似物之束可經由隔框饋送至電纜選路管道中,該管道諸如右側壁面板630中所展示之管道632,其中可移除之嵌入式面板已被移除來顯露選路進入第一電纜、線及管線束管道入口636中之束。可將該束自該入口饋送至氣體包體總成600之內部中,且在穿過氣體包體總成600之內部中的回流管道605的假想視圖中展示該束。關於電纜、線及管線束選路的氣體包體總成之各種實施例可具有諸如圖20A中所展示之一個以上的電纜、線及管線束入口,圖20A描繪用於另一束之第一束管道入口634及第二束管道入口636。圖20B描繪用於電纜、線及管線束之束管道入口634的擴展視圖。束管道入口634可具有開口631,該開口經設計來與滑動罩蓋633形成密封。在各種實施例中,開口631可容納可撓性密封模組,諸如由Roxtec公司提供之用於電纜入口密封之模組,該等模組可容納一束中之電纜、線及管線以及類似物的各種直徑。另一選擇為,滑動罩蓋633之頂部635以及開口631之上部分637可具有佈置於每一表面上的保形材料,以使得該保形材料可在經由諸如束管道入口634之入口來饋送的一束中之各種大小直徑的電纜、線及管線以及類似物周圍形成密封。 20A is a perspective view of a rear corner of various embodiments of a gas inclusion assembly 600, and an imaginary view through the return conduit 605 into the interior of the gas inclusion assembly 600. For various embodiments of the gas enclosure assembly 600, the rear wall panel 640 can have an embedded panel 610 that is assembled to provide access to, for example, an electrical bulkhead. A bundle of cables, wires and lines, and the like, can be fed into the cable routing conduit via a bulkhead, such as the conduit 632 shown in the right side wall panel 630, wherein the removable embedded panel has been removed to reveal The route is routed into the bundle of the first cable, line, and bundle conduit entry 636. The bundle can be fed from the inlet into the interior of the gas enclosure assembly 600 and displayed in an imaginary view through the return conduit 605 in the interior of the gas enclosure assembly 600. Various embodiments of gas inclusion assemblies for cable, wire and line bundle routing may have more than one cable, wire and bundle inlet, such as shown in Figure 20A, and Figure 20A depicts the first for another bundle. A bundle conduit inlet 634 and a second bundle conduit inlet 636. Figure 20B depicts an expanded view of a bundle conduit inlet 634 for cables, wires, and bundles. The bundle conduit inlet 634 can have an opening 631 that is designed to form a seal with the sliding cover 633. In various embodiments, the opening 631 can accommodate a flexible sealing module, such as a module for cable entry sealing provided by Roxtec, which can accommodate a bundle of cables, wires and lines, and the like. Various diameters. Alternatively, the top portion 635 of the sliding cover 633 and the upper portion 637 of the opening 631 can have a conformal material disposed on each surface such that the conformal material can be fed through an inlet such as a beam conduit inlet 634. A bundle of cables, wires and lines of various sizes and sizes, and the like, are formed in a bundle.

圖21係本教示之天花板面板的各種實施例之底部視圖,該天花板面板諸如圖3之氣體包體總成及系統100之天花板面板250'。根據本教示之關於氣體包體之組裝的各種實施例,可將照明安裝於天花板面板之內部頂部表面上,該天花板面板諸如圖3之氣體包體總成及系統100之天花板面板250'。如圖21中所描繪,具有內部部分251之天花板框架250可具有安裝於各種框架構件之內部部分上的照明。例如,天花板框架250可具有兩個天花板框架區段40,該等區段共同具有兩個天花板框架梁42及44。每一天花板框架區段40可具有朝向天花板框架250之內部來定位的第一側41以及朝向天花板框架250之外部來定位的第二側43。對於根據本教示之為氣體包體提供照明的各種實施例,可安裝數對照明元件46。每一對照明元件46可包括靠近天花板框架區段40的第一側41之第一照明元件45以及靠近天花板框架區段40的第二側43之第二照明元件47。圖21中所展示之照明元件的數量、定位及分組係示例性的。照明元件之數量及分組可以任何所需之方式或合適之方式改變。在各種實施例中,可將該等照明元件安裝成平的,而在其他實施例中可安裝該等照明元件以使得其可移動至多種位置及角度。該等照明元件之置放並不限於頂部面板天花板433,而是除此之外或作為另一選擇,可安裝於圖3中所展示之氣體包體總成及系統100的任何其他內部表面、外部表面及表面之組合上。 21 is a bottom view of various embodiments of the ceiling panel of the present teachings, such as the gas enclosure assembly of FIG. 3 and the ceiling panel 250' of system 100. In accordance with various embodiments of the present teachings regarding the assembly of gas enclosures, the illumination can be mounted to an interior top surface of a ceiling panel, such as the gas enclosure assembly of Figure 3 and the ceiling panel 250' of system 100. As depicted in Figure 21, a ceiling frame 250 having an interior portion 251 can have illumination mounted on an interior portion of various frame members. For example, the ceiling frame 250 can have two ceiling frame sections 40 that collectively have two ceiling frame beams 42 and 44. Each ceiling frame section 40 can have a first side 41 that is positioned toward the interior of the ceiling frame 250 and a second side 43 that is positioned toward the exterior of the ceiling frame 250. For various embodiments that provide illumination for the gas enclosure in accordance with the present teachings, pairs of illumination elements 46 can be installed. Each pair of lighting elements 46 can include a first lighting element 45 proximate the first side 41 of the ceiling frame section 40 and a second lighting element 47 proximate the second side 43 of the ceiling frame section 40. The number, positioning, and grouping of lighting elements shown in Figure 21 are exemplary. The number and grouping of lighting elements can be varied in any desired manner or in a suitable manner. In various embodiments, the lighting elements can be mounted flat, while in other embodiments the lighting elements can be mounted such that they can be moved to a variety of positions and angles. The placement of the lighting elements is not limited to the top panel ceiling 433, but may alternatively or alternatively be mounted to the gas enclosure assembly shown in FIG. 3 and any other interior surface of the system 100, A combination of external surfaces and surfaces.

各種照明元件可包含任何數量、類型之燈或其組合,例如鹵素燈、白燈、白熾燈、弧光燈或發光二極體或裝置(LED)。例如,每一照明元件可包含1個LED至約100個LED,約10個LED至約50個LED,或超過100個LED。LED或其他照明裝置可發射色譜中、色譜外或其組合之 任何顏色或顏色組合。根據用於噴墨列印OLED材料的氣體包體總成之各種實施例,因為一些材料對一些波長之光敏感,所以安裝於氣體包體總成中之照明裝置的光之波長可經特別選擇來避免處理期間的材料退化。例如,可使用4X冷白色LED,亦可使用4X黃色LED或其任何組合。4X冷白色LED之一實例係可自IDEC公司(Sunnyvale,California)購得之LF1B-D4S-2THWW4。可使用的4X黃色LED之一實例係亦可自IDEC公司購得的LF1B-D4S-2SHY6。LED或其他照明元件可定位或懸掛在天花板框架250之內部部分251上或氣體包體總成之另一表面上的任何位置。照明元件並不限於LED。可使用任何合適之照明元件或照明元件之組合。圖22係IDEC LED光譜之曲線圖,且展示對應於當峰值強度為100%時的強度之x軸以及對應於波長(單位為奈米)之y軸。展示LF1B黃色型、黃色螢光燈、LF1B白色型LED、LF1B冷白色型LED以及LF1B紅色型LED之光譜。根據本教示之各種實施例,可使用其他光譜或光譜之組合。 The various lighting elements can include any number, type of lamps, or combinations thereof, such as halogen lamps, white lamps, incandescent lamps, arc lamps, or light emitting diodes or devices (LEDs). For example, each lighting element can include from 1 LED to about 100 LEDs, from about 10 LEDs to about 50 LEDs, or more than 100 LEDs. LEDs or other illumination devices can be emitted in the chromatogram, outside the chromatogram or a combination thereof Any color or combination of colors. According to various embodiments of gas inclusion assemblies for ink jet printing OLED materials, the wavelength of light of the illumination device mounted in the gas enclosure assembly can be specifically selected because some materials are sensitive to light of some wavelengths. To avoid material degradation during processing. For example, a 4X cool white LED can be used, or a 4X yellow LED or any combination thereof can be used. An example of a 4X cold white LED is LF1B-D4S-2THWW4 available from IDEC Corporation (Sunnyvale, California). An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, also available from IDEC Corporation. The LED or other lighting element can be positioned or suspended from the inner portion 251 of the ceiling frame 250 or anywhere on the other surface of the gas enclosure assembly. Lighting elements are not limited to LEDs. Any suitable lighting element or combination of lighting elements can be used. Figure 22 is a graph of the IDEC LED spectrum and shows the x-axis corresponding to the intensity when the peak intensity is 100% and the y-axis corresponding to the wavelength (in nanometer). Shows the spectrum of LF1B yellow, yellow fluorescent, LF1B white LED, LF1B cool white LED and LF1B red LED. Other spectra or combinations of spectra may be used in accordance with various embodiments of the present teachings.

回顧前文,氣體包體總成之各種實施例係以某種方式建構,以使得使氣體包體總成之內部體積最小化,且同時使用來容納各種OLED列印系統之各種佔據面積的工作空間最佳化。如此建構之氣體包體總成的各種實施例另外提供:在處理期間自外部對氣體包體總成之內部的輕鬆接取,以及為了維護而對內部的輕鬆接取,同時使停機時間最小化。就此而言,根據本教示之氣體包體總成的各種實施例可針對各種OLED列印系統之各種佔據面積來進行輪廓塑造。 Recalling the foregoing, various embodiments of gas inclusion assemblies are constructed in a manner that minimizes the internal volume of the gas inclusion assembly and simultaneously accommodates various footprints of various OLED printing systems. optimization. Various embodiments of the gas inclusion assembly thus constructed additionally provide for easy access to the interior of the gas enclosure assembly from the outside during processing, as well as easy internal access for maintenance while minimizing downtime . In this regard, various embodiments of gas inclusion assemblies in accordance with the present teachings can be contoured for various footprints of various OLED printing systems.

一般技藝人士可瞭解的是,關於框架構件建構、面板建構、框架及面板密封以及氣體包體總成(諸如圖3之氣體包體總成100)之建構 的本教示可適用於多種大小及設計之氣體包體總成。例如但不限於,涵蓋第3.5代至第10代之基板大小的本教示之經輪廓塑造之氣體包體總成的各種實施例可具有約6m3至約95m3之間的內部體積,其可為未經輪廓塑造且具有相對較大尺寸的包體節省約30%至約70%之間的體積。氣體包體總成之各種實施例可具有各種框架構件,該等框架構件經建構來提供氣體包體總成之輪廓,以便容納OLED列印系統以實現其功能且同時使工作空間最佳化以使惰性氣體體積最小化,且亦允許在處理期間自外部對OLED列印系統的輕鬆接取。就此而言,本教示之各種氣體包體總成可在經輪廓塑造之拓撲及體積上變化。 One of ordinary skill in the art will appreciate that the teachings of frame member construction, panel construction, frame and panel sealing, and gas inclusion assembly (such as gas inclusion assembly 100 of Figure 3) can be applied to a variety of sizes and designs. The gas inclusion body assembly. Shaping the inclusion of various gases such as, but not limited to, the present teachings encompass 3.5th generation through substrate 10 instead of the size of the contoured assembly embodiments may have an internal volume of between about 6m 3 to about 95m 3, which may be A volume of between about 30% and about 70% is saved for an enclosure that is not contoured and has a relatively large size. Various embodiments of the gas inclusion assembly can have various frame members that are configured to provide a contour of the gas enclosure assembly to accommodate the OLED printing system to perform its function while optimizing the workspace. The inert gas volume is minimized and also allows easy access to the OLED printing system from the outside during processing. In this regard, the various gas inclusion assemblies of the present teachings can vary in topology and volume through contour shaping.

圖23提供根據本教示之氣體包體總成的實例。氣體包體總成1000可包括前部框架總成1100、中間框架總成1200以及後部框架總成1300。前部框架總成1100可包括前部底座框架1120;前部壁框架1140,其可具有用於接納基板之開口1142;以及前部天花板框架1160。中間框架總成1200可包括第一中間包體框架總成1240、中間壁及天花板框架總成1260以及第二中間包體框架總成1280。後部框架總成1300可包括後部底座框架1320、後部壁框架1340以及後部天花板框架1360。用陰影線展示之區域描繪氣體總成1000之可用工作體積,該可用工作體積係可用來容納OLED列印系統之體積。氣體包體總成1000之各種實施例經輪廓塑造,以便使操作諸如OLED列印處理之空氣敏感型處理所需要的再循環之惰性氣體的體積最小化,且同時允許對OLED列印系統之輕鬆接取(在操作期間遠程接取,或藉由經由易於移除之面板的輕鬆接取來直接接取)。對於根據本教示之涵蓋第3.5代至第10m代之基板大小的氣體包體總成之各種實施例,根據本教 示之經輪廓塑造的氣體包體總成之各種實施例可具有約6m3至約95m3之間的氣體包體體積,例如但不限於約15m3至約30m3之間,此可用於例如第5.5代至第8.5代基板大小之OLED列印。根據本案發明之某些實施例,基板支撐設備可支撐一基板,該基板具有在約第5代至約第10代之間的一大小。根據本案發明之某些實施例,基板支撐設備可支撐一基板,該基板具有在約第3.5代至約第8.5代之間的一大小。 Figure 23 provides an example of a gas inclusion assembly in accordance with the present teachings. The gas inclusion assembly 1000 can include a front frame assembly 1100, an intermediate frame assembly 1200, and a rear frame assembly 1300. The front frame assembly 1100 can include a front base frame 1120; a front wall frame 1140 that can have an opening 1142 for receiving a substrate; and a front ceiling frame 1160. The intermediate frame assembly 1200 can include a first intermediate package frame assembly 1240, an intermediate wall and ceiling frame assembly 1260, and a second intermediate package frame assembly 1280. The rear frame assembly 1300 can include a rear base frame 1320, a rear wall frame 1340, and a rear ceiling frame 1360. The hatched area depicts the available working volume of the gas assembly 1000, which can be used to accommodate the volume of the OLED printing system. Various embodiments of the gas inclusion assembly 1000 are contoured to minimize the volume of recycled inert gas required to operate an air sensitive process such as an OLED print process, while at the same time allowing for easy OLED printing systems Pick up (remote access during operation, or direct access via easy access via easy-to-remove panels). For various embodiments of gas inclusion assemblies of substrate sizes from 3.5th to 10th generations in accordance with the present teachings, various embodiments of contoured gas inclusion assemblies in accordance with the present teachings can have from about 6 m 3 to A gas inclusion volume between about 95 m3 , such as, but not limited to, between about 15 m3 and about 30 m3 , which can be used for OLED printing of, for example, 5.5th to 8.5th generation substrate sizes. In accordance with certain embodiments of the present invention, a substrate support apparatus can support a substrate having a size between about 5th generation and about 10th generation. In accordance with certain embodiments of the present invention, a substrate support apparatus can support a substrate having a size between about 3.5th generation and about 8.5th generation.

氣體包體總成1000可具有本教示中關於示例性氣體包體總成100所列舉之所有特徵。例如但不限於,氣體包體總成1000可利用根據在建構及解構週期中提供氣密式密封型包體的本教示之密封。基於氣體包體總成1000之氣體包體系統的各種實施例可具有氣體淨化系統,該氣體淨化系統可將各種反應性物種中之每一物種的含量維持在100ppm或更低,例如為10ppm或更低、1.0ppm或更低或者0.1ppm或更低,該等反應性物種包括諸如水蒸汽及氧氣之各種反應性大氣氣體,以及有機溶劑蒸汽。 The gas inclusion assembly 1000 can have all of the features recited in the present teachings with respect to the exemplary gas inclusion assembly 100. For example, without limitation, the gas inclusion assembly 1000 can utilize a seal according to the present teachings that provide a hermetic seal type enclosure during construction and deconstruction cycles. Various embodiments of the gas inclusion system based on the gas inclusion body assembly 1000 can have a gas purification system that maintains the content of each of the various reactive species at 100 ppm or less, for example, 10 ppm or Lower, 1.0 ppm or lower, or 0.1 ppm or lower, such reactive species include various reactive atmospheric gases such as water vapor and oxygen, as well as organic solvent vapors.

此外,基於氣體包體總成1000之氣體包體總成及系統的各種實施例可具有循環及過濾系統,該循環及過濾系統可提供滿足ISO 14644第3級及第4級無塵室標準的無粒子環境。另外,如隨後將更為詳細地討論,基於本教示之氣體包體總成(諸如氣體包體總成100及氣體包體總成1000)之氣體包體總成系統的各種實施例可具有加壓惰性氣體再循環系統之各種實施例,該加壓惰性氣體再循環系統可用來操作例如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。對於本教示之氣體包體及系統的各種實施例,各種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。 In addition, various embodiments of gas inclusion assemblies and systems based on gas inclusion assembly 1000 can have a circulation and filtration system that provides ISO 14644 Class 3 and Class 4 clean room standards. No particle environment. Additionally, as will be discussed in greater detail later, various embodiments of gas inclusion assembly systems based on the present teachings of gas inclusion assemblies (such as gas inclusion assembly 100 and gas inclusion assembly 1000) may have Various embodiments of a pressurized inert gas recirculation system operable to operate, for example, but not limited to, a pneumatic robot, a substrate floating table, an air bearing, an air casing, a compressed gas tool, a pneumatic actuator, and One or more of the combinations. For various embodiments of the gas enclosures and systems of the present teachings, the use of various pneumatically operated devices and devices provides low particle generation performance and low maintenance.

圖24係氣體包體總成1000之分解視圖,其描繪各種框架構件,該等框架構件可被建構來提供根據本教示之氣密式密封型氣體包體。如前面關於圖3及圖13的氣體包體100之各種實施例所討論,OLED噴墨列印系統1050可由若干裝置及設備組成,該等裝置及設備允許墨水液滴至諸如基板1058之基板上之特定位置上的可靠置放,該基板經展示為由基板漂浮台1054支撐。基板漂浮台1054可用於支撐基板1058,並且提供基板1058之無摩擦輸送。OLED列印系統之基板漂浮台1054可界定基板1058在基板之OLED列印期間可被移動通過系統1000所經過的行程。考慮到可包含OLED列印系統1050之多種組件,OLED列印系統1050之各種實施例可具有多種佔據面積及外觀尺寸。根據OLED噴墨列印系統之各種實施例,多種基板材料可用於基板1058,例如但不限於多種玻璃基板材料以及多種聚合物基板材料。 24 is an exploded view of a gas inclusion assembly 1000 depicting various frame members that can be constructed to provide a hermetic sealed gas enclosure in accordance with the present teachings. As discussed above with respect to various embodiments of the gas enclosure 100 of FIGS. 3 and 13, the OLED inkjet printing system 1050 can be comprised of a number of devices and devices that allow ink droplets to be deposited onto a substrate such as substrate 1058. The substrate is shown as being supported by the substrate floating table 1054 with a reliable placement at a particular location. The substrate floating station 1054 can be used to support the substrate 1058 and provide frictionless delivery of the substrate 1058. The substrate floating platform 1054 of the OLED printing system can define the path that the substrate 1058 can be moved through the system 1000 during OLED printing of the substrate. Various embodiments of OLED printing system 1050 can have a variety of footprints and appearance sizes in view of the various components that can include OLED printing system 1050. According to various embodiments of OLED inkjet printing systems, a variety of substrate materials can be used for substrate 1058, such as, but not limited to, a variety of glass substrate materials and a variety of polymeric substrate materials.

根據本教示之氣體包體總成的各種實施例,如前面關於氣體包體總成100所描述,氣體包體總成之建構可圍繞整個OLED列印系統來進行,從而使氣體包體總成之體積最小化並且提供對內部的輕鬆接取。在圖24中,可考慮OLED列印系統1050來給出輪廓塑造之實例。 According to various embodiments of the gas inclusion assembly of the present teachings, as described above with respect to the gas inclusion assembly 100, the construction of the gas inclusion assembly can be performed around the entire OLED printing system to provide a gas inclusion assembly The volume is minimized and provides easy access to the interior. In Figure 24, an example of contour shaping can be given in view of OLED printing system 1050.

如圖24中所展示,OLED列印系統1050上可存在六個隔離體:第一隔離體組1051(未展示該組中在對立面上的第二隔離體)及第二隔離體組1053(未展示該組中在對立面上的第二隔離體),該等隔離體組支撐OLED列印系統1050之基板漂浮台1054。漂浮台1054係支撐於漂浮台底座1052上。除了在圖24中不可見且定位成與第一隔離體1051及第二隔離體1053相對之兩個隔離體之外,亦存在支撐OLED列印系統底座1070之一 組兩個隔離體。前部包體底座1120可具有支撐第一前部包體隔離體壁框架1123之第一前部包體隔離體座1121。第二前部包體隔離體壁框架1127係由第二前部包體隔離體座(未圖示)支撐。類似地,中間包體底座1220可具有支撐第一中間包體隔離體壁框架1223之第一中間包體隔離體座1221。第二中間包體隔離體壁框架1227係由第二中間包體隔離體座(未圖示)支撐。最後,後部包體底座1320可具有支撐後部包體隔離體壁框架1323之第一後部包體隔離體座1321。第二後部包體隔離體壁框架1327係由第二後部包體隔離體座(未圖示)支撐。隔離體壁框架構件之各種實施例已圍繞每一隔離體來進行輪廓塑造,藉此使圍繞每一隔離體支撐構件之體積最小化。另外,關於底座1120、1220及1320之每一隔離體壁框架所展示的陰影面板區段係可移除之面板,該等面板可被移除來例如維修隔離體。前部包體總成底座1120可具有底盤1122,而中間包體總成底座1220可具有底盤1222,且後部包體總成底座1320可具有底盤1322。當該等底座被完全建構來形成相連的底座時,可將OLED列印系統安裝於藉此形成之相連的底盤上,安裝方式與將OLED列印系統50安裝於圖13之底盤204上類似。如前面所描述,隨後可圍繞OLED列印系統1050將壁框架構件及天花板框架構件連接起來,該等壁框架構件及天花板框架構件諸如:前部框架總成1100之壁框架1140、天花板框架1160;中間框架總成1200之第一中間包體框架總成1240、中間壁及天花板框架總成1260及第二中間包體框架總成1280';以及後部框架總成1300之壁框架1340及天花板框架1360。因此,本教示之氣密式密封型經輪廓塑造的框架構件總成的各種實施例有效地減小氣體包體總成1000中之惰性氣體的體積,而同時提供對OLED列印系統之各種裝置及 設備的輕鬆接取。 As shown in FIG. 24, there may be six spacers on the OLED printing system 1050: a first spacer set 1051 (the second spacer on the opposite side of the set is not shown) and a second spacer set 1053 (not shown) A second spacer on the opposite side of the set is shown, the set of spacers supporting the substrate floating platform 1054 of the OLED printing system 1050. The floating platform 1054 is supported on the floating platform base 1052. In addition to the two spacers that are not visible in FIG. 24 and are positioned opposite the first spacer 1051 and the second spacer 1053, there is also one of the OLED printing system mounts 1070. Group two spacers. The front enclosure base 1120 can have a first front enclosure spacer seat 1121 that supports the first front enclosure spacer wall frame 1123. The second front body spacer wall frame 1127 is supported by a second front body spacer seat (not shown). Similarly, the intermediate package base 1220 can have a first intermediate inclusion body seat 1221 that supports the first intermediate inclusion body wall frame 1223. The second intermediate body spacer wall frame 1227 is supported by a second intermediate body spacer seat (not shown). Finally, the rear enclosure base 1320 can have a first rear enclosure spacer 1321 that supports the rear enclosure spacer wall frame 1323. The second rear enclosure spacer wall frame 1327 is supported by a second rear enclosure spacer (not shown). Various embodiments of the spacer body wall frame members have been contoured around each of the spacers, thereby minimizing the volume surrounding each of the spacer support members. Additionally, the shaded panel sections shown with respect to each of the spacer wall frames of the bases 1120, 1220, and 1320 are removable panels that can be removed, for example, to service the spacers. The front body assembly base 1120 can have a chassis 1122, and the intermediate body assembly base 1220 can have a chassis 1222, and the rear body assembly base 1320 can have a chassis 1322. When the bases are fully constructed to form a connected base, the OLED printing system can be mounted to the associated chassis formed thereby, similar to mounting the OLED printing system 50 to the chassis 204 of FIG. As previously described, the wall frame member and the ceiling frame member can then be joined around the OLED printing system 1050, such as the wall frame 1140 of the front frame assembly 1100, the ceiling frame 1160; First intermediate body frame assembly 1240 of intermediate frame assembly 1200, intermediate wall and ceiling frame assembly 1260 and second intermediate body frame assembly 1280'; and rear frame assembly 1300 wall frame 1340 and ceiling frame 1360 . Accordingly, various embodiments of the hermetically sealed, contoured frame member assembly of the present teachings effectively reduce the volume of inert gas in the gas enclosure assembly 1000 while providing various means for the OLED printing system. and Easy access to the device.

此外,本教示之氣體包體總成的各種實施例可以某種方式來建構以便提供單獨起作用之框架構件總成區段。參考圖5進行回顧,根據本教示之氣體包體總成及系統的各種實施例之框架構件總成可包括具有密封地安裝於框架構件上之各種面板的框架構件。例如但不限於,壁框架構件總成或壁面板總成可為包括密封地安裝於壁框架構件上之各種面板的壁框架構件。因此,各種完全建構之面板總成,諸如但不限於壁面板總成、天花板面板總成、壁及天花板面板總成、底座支撐面板總成及類似物,係各種類型之框架構件總成。本教示之氣體包體總成的各種實施例之模組化性質可提供具有各種框架構件總成區段之氣體包體總成的實施例,其中每一框架構件總成區段係氣體包體總成之總體積的一部分。包含氣體包體總成之各種實施例的各種框架構件總成區段可共同具有至少一個框架構件。對於氣體包體總成之各種實施例,包含氣體包體總成之各種框架構件總成區段可共同具有至少一個框架構件總成。包含氣體包體總成之各種實施例的各種框架構件總成區段可共同具有至少一個框架構件及至少一個框架構件總成之組合。 Moreover, various embodiments of the gas inclusion assembly of the present teachings can be constructed in a manner to provide a separately functioning frame member assembly section. Referring back to Figure 5, the frame member assembly of various embodiments of the gas inclusion assembly and system in accordance with the present teachings can include a frame member having various panels that are sealingly mounted to the frame member. For example, without limitation, the wall frame member assembly or wall panel assembly can be a wall frame member that includes various panels that are sealingly mounted to the wall frame member. Accordingly, various fully constructed panel assemblies, such as, but not limited to, wall panel assemblies, ceiling panel assemblies, wall and ceiling panel assemblies, base support panel assemblies, and the like, are various types of frame member assemblies. The modular nature of the various embodiments of the gas inclusion assembly of the present teachings can provide embodiments of gas inclusion assemblies having various frame member assembly sections, wherein each frame member assembly section is a gas inclusion body Part of the total volume of the assembly. The various frame member assembly sections comprising various embodiments of the gas inclusion body assembly can have at least one frame member in common. For various embodiments of the gas inclusion assembly, the various frame member assembly sections comprising the gas inclusion assembly can collectively have at least one frame member assembly. The various frame member assembly sections comprising the various embodiments of the gas inclusion assembly can collectively have a combination of at least one frame member and at least one frame member assembly.

根據本教示,可經由例如但不限於封閉框架構件總成區段中之每一者所共有的開口或通道或其組合來將各種框架構件總成區段分成多個區段。例如,在各種實施例中,可藉由覆蓋住在每一框架構件總成區段所共有的框架構件或框架構件面板中之開口或通道或其組合(藉此有效地封閉該開口或通道或其組合)來分離框架構件總成區段。在各種實施例中,可藉由密封每一框架構件總成區段所共有的開口或通道或其組合(藉此有 效地封閉該開口或通道或其組合)來分離框架構件總成區段。密封地封閉開口或通道或其組合可導致分離,該分離會中斷每一框架構件總成區段之每一體積之間的流體連通,其中每一體積係氣體包體總成中所包含之總體積的一部分。密封地封閉開口或通道可藉此隔離每一框架構件總成區段中所包含之每一體積。 In accordance with the present teachings, various frame member assembly sections can be divided into a plurality of sections via openings or passages or combinations thereof, such as but not limited to, each of the closed frame member assembly sections. For example, in various embodiments, the opening or channel or combination thereof in the frame member or frame member panel common to each frame member assembly section can be covered (by thereby effectively closing the opening or passage or The combination thereof) separates the frame member assembly sections. In various embodiments, the openings or channels or combinations thereof that are common to each frame member assembly section can be sealed (by having The opening or channel or combination thereof is effectively closed to separate the frame member assembly section. Sealing the closed opening or passage or combination thereof may result in separation that interrupts fluid communication between each volume of each frame member assembly section, wherein each volume is contained in the total gas inclusion assembly Part of the volume. Sealingly closing the opening or passageway can thereby isolate each volume contained in each frame member assembly section.

因此,參考圖24,底座1070可具有:第一端部1072及第二端部1074,其界定寬度;以及第一側1076及第二側1078,其界定長度。與底座1070正交且安裝於該底座上的可為第一豎管1075及第二豎管1077,橋1079安裝於該第一豎管及該第二豎管上。對於OLED列印系統1050之各種實施例,橋1079可支撐第一列印頭總成定位系統1090及第二列印頭總成定位系統1091,該等定位系統分別用於控制第一列印頭總成1080及第二列印頭總成1081在基板漂浮台1054上方之X-Z軸移動。儘管圖24描繪兩個定位系統及兩個列印頭總成,但是對於OLED列印系統1050之各種實施例,可存在單個定位系統及單個列印頭總成。此外,對於OLED列印系統1050之各種實施例,可存在安裝於定位系統上之單個列印頭總成,例如第一列印頭總成1080及第二列印頭總成1081中之任一者,而用於檢查基板1058之特徵的攝影機系統可安裝於第二定位系統上。根據氣體包體總成1000之各種實施例,列印頭維護系統可例如但不限於在底座1070之第一上表面1071及第二上表面1073上安裝成靠近列印頭總成。 Thus, referring to FIG. 24, the base 1070 can have a first end 1072 and a second end 1074 defining a width, and a first side 1076 and a second side 1078 defining a length. The first vertical tube 1075 and the second vertical tube 1077 are orthogonal to the base 1070 and mounted on the base. The bridge 1079 is mounted on the first vertical tube and the second vertical tube. For various embodiments of the OLED printing system 1050, the bridge 1079 can support a first print head assembly positioning system 1090 and a second print head assembly positioning system 1091 for controlling the first print head, respectively The assembly 1080 and the second row of print head assemblies 1081 move on the XZ axis above the substrate floating table 1054. Although FIG. 24 depicts two positioning systems and two printhead assemblies, for various embodiments of the OLED printing system 1050, there may be a single positioning system and a single printhead assembly. Moreover, for various embodiments of the OLED printing system 1050, there may be a single printhead assembly mounted on the positioning system, such as any of the first printhead assembly 1080 and the second printhead assembly 1081. The camera system for inspecting the features of the substrate 1058 can be mounted to the second positioning system. According to various embodiments of the gas enclosure assembly 1000, the printhead maintenance system can be mounted, for example, but not limited to, on the first upper surface 1071 and the second upper surface 1073 of the base 1070 proximate to the printhead assembly.

此外,參考圖24,可將面板安裝於底座1220之第一框架構件1224及第二框架構件1226上,且可將墊圈貼附於每一面板上。該等墊圈可用來封閉該等面板與底座1070之間的通道中之每一者。另外,橋框架1144 可支撐中間框架總成1200,並且提供用來支撐嵌入式框架之各種實施例的架構。插入至橋框架1144中之嵌入式框架的各種實施例可具有允許列印頭總成行進的開口,且亦可支撐閘閥總成,該閘閥門總成用於封閉允許列印頭總成行進之開口。藉由密封地封閉底座周圍之通道以及密封地封閉允許列印頭總成行進之開口,中間框架總成1200圍繞安裝於底座1070上之橋1079所粗略界定之體積可與氣體包體總成1000的剩餘部分體積隔離。 Further, referring to FIG. 24, the panel can be mounted to the first frame member 1224 and the second frame member 1226 of the base 1220, and a gasket can be attached to each panel. The washers can be used to enclose each of the passages between the panels and the base 1070. In addition, the bridge frame 1144 The intermediate frame assembly 1200 can be supported and an architecture for supporting various embodiments of the embedded frame can be provided. Various embodiments of the inlaid frame inserted into the bridge frame 1144 can have openings that allow the printhead assembly to travel, and can also support a gate valve assembly that is used to close the printhead assembly. Opening. By sealingly closing the passage around the base and sealingly closing the opening that allows the printhead assembly to travel, the intermediate frame assembly 1200 is roughly defined by the bridge 1079 mounted on the base 1070 to be comparable to the gas enclosure assembly 1000. The remaining part of the volume is isolated.

分離氣體包體之離散區段之示例性用途可為,對列印頭總成(諸如列印系統1050之第一列印頭總成1080及第二列印頭總成1081)執行各種維護程序。此等維護程序可包括:例如但不限於更換列印頭總成中之列印頭而無需使氣體包體總成向大氣開放。此外,因為中間框架總成1200圍繞安裝於底座1070上之橋1079所粗略界定之部分體積可與氣體包體總成1000之剩餘體積完全隔離,所以該部分體積可向諸如但不限於水蒸汽及氧氣之大氣物種開放,而不會污染氣體包體總成之剩餘的更大體積。藉由限制可曝露於大氣物種之體積,可在短得多的時間內完成系統復原。一般技藝人士將瞭解的是,儘管作為示例來呈現列印頭總成之維護的實例,但是需要氣體包體總成之各種處理可易於利用氣體包體總成,在此氣體包體總成中可將多個區段離散地分離來提供單獨起作用之框架構件總成區段,其中至少一個區段可具有總包體體積之大致上較小的部分體積。 An exemplary use for separating discrete sections of gas enclosures may be to perform various maintenance procedures on the printhead assembly, such as the first printhead assembly 1080 and the second printhead assembly 1081 of the printing system 1050. . Such maintenance procedures may include, for example, but not limited to, replacing the printhead in the printhead assembly without opening the gas enclosure assembly to the atmosphere. Moreover, because the portion of the intermediate frame assembly 1200 that is roughly defined by the bridge 1079 mounted on the base 1070 can be completely isolated from the remaining volume of the gas enclosure assembly 1000, the volume can be such as, but not limited to, water vapor and The atmospheric species of oxygen are open without contaminating the remaining larger volume of the gas inclusion assembly. System recovery can be accomplished in a much shorter period of time by limiting the volume that can be exposed to atmospheric species. One of ordinary skill in the art will appreciate that although an example of maintenance of a printhead assembly is presented as an example, various processes requiring a gas inclusion assembly may readily utilize a gas inclusion assembly in which the gas inclusion assembly is The plurality of segments can be discretely separated to provide a separately functioning frame member assembly section, wherein at least one of the segments can have a substantially smaller partial volume of the total inclusion volume.

圖25描繪根據圖23及圖24之氣體包體總成1000的各種實施例之部分分解透視圖。圖25中指示各種完整之面板總成,該等面板總成可以多種方式分離以便界定:第一框架構件總成區段,其界定第一體積;以及第二框架構件總成區段,其界定第二體積。 Figure 25 depicts a partially exploded perspective view of various embodiments of the gas enclosure assembly 1000 in accordance with Figures 23 and 24. Various complete panel assemblies are indicated in Figure 25, which panel assemblies can be separated in a variety of ways to define: a first frame member assembly section defining a first volume; and a second frame member assembly section defining Second volume.

在圖25中,例如但不限於,氣體包體總成1000可包括前部面板總成1100'、中間面板總成1200'以及後部面板總成1300'。前部面板總成1100'可包括前部天花板面板總成1160'、前部壁面板總成1140'以及前部底座面板總成1120',而後部面板總成1300'可包括後部天花板面板總成1360'、後部壁面板總成1340'以及後部底座面板總成1320'。如自圖24之關於前部框架總成1100及中間面板框架1200之分解圖可看出,圖25之前部面板總成1100'及中間面板總成1200'共同具有橋框架1144。中間面板總成1200'可包括第一中間包體面板總成1240'、中間壁及天花板面板總成1260'以及第二中間包體面板總成1280',該等總成在密封地安裝於中間底座面板總成1220'上時可覆蓋底座1070,該底座包括第一豎管1075及第二豎管1077,橋1079係安裝於該第一豎管及該第二豎管上。如前面所討論,橋1079可支撐第一列印頭總成定位系統1090,該定位系統可控制列印頭總成1080在基板漂浮台1054(見圖24)上方之移動。用於將列印頭總成1080定位在基板漂浮台1054(見圖24)上方的第一列印頭總成定位系統1090可包括第一X軸托架1092及第一Z軸活動板1094,第一列印頭總成1080可安裝於該活動板上。第二列印頭總成定位系統1091可被類似地組配來控制第二列印頭總成1081在基板漂浮台1054(見圖24)上方之X-Z軸移動。 In FIG. 25, for example, without limitation, the gas enclosure assembly 1000 can include a front panel assembly 1100', a middle panel assembly 1200', and a rear panel assembly 1300'. The front panel assembly 1100' can include a front ceiling panel assembly 1160', a front wall panel assembly 1140', and a front base panel assembly 1120', while the rear panel assembly 1300' can include a rear ceiling panel assembly 1360', rear wall panel assembly 1340' and rear base panel assembly 1320'. As can be seen from the exploded view of front frame assembly 1100 and intermediate panel frame 1200 of FIG. 24, front panel assembly 1100' and intermediate panel assembly 1200' of FIG. 25 collectively have a bridge frame 1144. The intermediate panel assembly 1200' can include a first intermediate body panel assembly 1240', an intermediate wall and ceiling panel assembly 1260', and a second intermediate body panel assembly 1280' that are sealingly mounted in the middle The base panel assembly 1220' can cover the base 1070. The base includes a first riser 1075 and a second riser 1077. The bridge 1079 is mounted on the first riser and the second riser. As previously discussed, the bridge 1079 can support a first printhead assembly positioning system 1090 that can control the movement of the printhead assembly 1080 over the substrate float table 1054 (see Figure 24). A first printhead assembly positioning system 1090 for positioning the printhead assembly 1080 above the substrate float table 1054 (see FIG. 24) can include a first X-axis bracket 1092 and a first Z-axis movable plate 1094, The first print head assembly 1080 can be mounted to the movable plate. The second row of print head assembly positioning systems 1091 can be similarly configured to control the movement of the second print head assembly 1081 over the X-Z axis above the substrate float table 1054 (see Figure 24).

圖26描繪氣體包體總成1000之部分分解的側面透視圖,該氣體包體總成包括前部面板總成1100'之各種區段,以及中間面板總成1200'及後部面板總成1300'。前部面板總成1100'可包括嵌入式框架1146,可看出該嵌入式框架係安裝於橋框架1144中,該橋框架係前部面板總成1100'及中間面板總成1200'兩者所共有的框架構件。嵌入式框架1146可包括開口 1148,圍繞該開口可貼附有墊圈1147。在嵌入式框架1146上方指示閘閥門總成1150。閘閥門總成1150可安裝於嵌入式框架1146上方。如圖27A及圖27B中可看出,閘閥門總成1150可具有門1158,該門係經由第一托架1153及第二托架1154安裝至Y-Z定位系統,該Y-Z定位系統用於使門1158在嵌入式框架1146之開口1148上方移動,以及用於將門1158嚙合來密封地覆蓋住開口1148。在圖27A中,包括第一軌道1151及第二軌道1152之定位系統可分別具有第一托架1153及第二托架1154,該等托架可與軌條導軌系統嚙合。如一般技藝人士可瞭解的是,軌條導軌系統可包括多個組件,該等組件諸如:例如但不限於軌條、軸承及致動器,用來控制定位系統之移動且因此控制門1158之移動。在圖27A中,圍繞開口1148展示墊圈1147。墊圈1147可為如前面關於密封框架構件總成所描述之墊圈材料中的任一者。在圖27A中,門1158被縮回,以使得可分別藉由第一列印頭總成定位系統1090及第二列印頭總成定位系統1091使列印頭總成1080及1081藉由在開口1148(見圖24及圖25)中行進而在漂浮台1054上方移動。在圖27B中,展示門1158覆蓋住開口1148。門1158所安裝至之定位系統(包括第一托架1153及第二托架1154)可將門1158定位在開口1148上方以便密封地嚙合墊圈1147,藉此密封地封閉開口1148。 26 depicts a side perspective view of a partial exploded view of a gas enclosure assembly 1000 including various sections of a front panel assembly 1100', and an intermediate panel assembly 1200' and a rear panel assembly 1300' . The front panel assembly 1100' can include an inlaid frame 1146 that can be seen to be mounted in a bridge frame 1144 that is both a front panel assembly 1100' and a middle panel assembly 1200'. Shared frame components. The inlaid frame 1146 can include an opening 1148, a gasket 1147 can be attached around the opening. A gate valve assembly 1150 is indicated above the inlaid frame 1146. The gate valve assembly 1150 can be mounted over the inlaid frame 1146. As can be seen in Figures 27A and 27B, the gate valve assembly 1150 can have a door 1158 that is mounted to the YZ positioning system via a first bracket 1153 and a second bracket 1154 for use in a door 1158 moves over opening 1148 of inlaid frame 1146 and is used to engage door 1158 to sealingly cover opening 1148. In FIG. 27A, the positioning system including the first track 1151 and the second track 1152 can have a first bracket 1153 and a second bracket 1154, respectively, which can be engaged with the rail rail system. As will be appreciated by those of ordinary skill in the art, the rail rail system can include a plurality of components such as, for example, but not limited to, rails, bearings, and actuators for controlling movement of the positioning system and thus controlling the door 1158 mobile. In FIG. 27A, a gasket 1147 is shown around the opening 1148. The gasket 1147 can be any of the gasket materials described above with respect to the seal frame member assembly. In FIG. 27A, the door 1158 is retracted such that the print head assemblies 1080 and 1081 can be made by the first print head assembly positioning system 1090 and the second print head assembly positioning system 1091, respectively. The opening 1148 (see Figures 24 and 25) travels over the floating table 1054. In FIG. 27B, display door 1158 covers opening 1148. The positioning system to which the door 1158 is mounted (including the first bracket 1153 and the second bracket 1154) can position the door 1158 over the opening 1148 to sealingly engage the washer 1147, thereby sealingly closing the opening 1148.

圖28描繪穿過與前部面板總成1100'及後部面板總成1300'相關聯之中間底座面板總成1220'的截面圖。如圖28中所指示,通道1225可定位在底座1070周圍;其中底座1070延伸穿過第一框架構件1224。在框架構件1224中,提供框架結構的面板(諸如面板1228)可密封地安裝於框架構件1224中。預期的是,提供機械密封之多種墊圈可用於密封通道1225。 在各種實施例中,可使用用於密封通道1225之充氣式墊圈。充氣式墊圈之各種實施例可由強化彈性材料製成為空心模製結構,該結構在未充氣時可為凹面構型、迴旋狀構型或扁平構型。在各種實施例中,墊圈可安裝於面板1228上,以便密封地封閉底座1070周圍之通道1225。因此,當使用多種適當之流體介質(例如但不限於惰性氣體)中之任一者予以充氣時,用於封閉底座1070周圍之通道1225的充氣式墊圈之各種實施例可在安裝表面(諸如面板1228之內表面)與衝擊表面(諸如底座1070之表面)之間形成緊密障壁。在各種實施例中,充氣式墊圈可安裝於底座1070上,以便密封地封閉底座1070周圍之通道1225,以使得底座1070可為安裝表面且面板1228之內表面可為衝擊表面。就此而言,保形密封可密封地封閉通道1225。 28 depicts a cross-sectional view through the intermediate base panel assembly 1220' associated with the front panel assembly 1100' and the rear panel assembly 1300'. As indicated in FIG. 28, the channel 1225 can be positioned around the base 1070; wherein the base 1070 extends through the first frame member 1224. In the frame member 1224, a panel providing a frame structure, such as the panel 1228, is sealably mounted in the frame member 1224. It is contemplated that a variety of gaskets that provide a mechanical seal can be used to seal the passage 1225. In various embodiments, an inflatable gasket for sealing the passage 1225 can be used. Various embodiments of the inflatable gasket may be fabricated from a reinforced elastomeric material into a hollow molded structure that may be in a concave configuration, a convoluted configuration, or a flat configuration when not inflated. In various embodiments, a gasket can be mounted to the panel 1228 to sealingly close the channel 1225 around the base 1070. Thus, various embodiments of the inflatable gasket for closing the passage 1225 around the base 1070 can be on a mounting surface (such as a panel) when inflated using any of a variety of suitable fluid media, such as, but not limited to, an inert gas. A tight barrier is formed between the inner surface of 1228) and the impact surface, such as the surface of the base 1070. In various embodiments, an inflatable gasket can be mounted to the base 1070 to sealingly close the passage 1225 around the base 1070 such that the base 1070 can be a mounting surface and the inner surface of the panel 1228 can be an impact surface. In this regard, the conformal seal sealably closes the channel 1225.

除了充氣式墊圈之各種實施例之外,永久性附接(例如附接至面板1228以及附接至底座1070)的可撓性密封件,諸如波紋管密封件或唇形密封件,亦可用於密封通道1225。此永久性附接的密封件可提供實現底座1070之各種平移移動及振動移動所需要的可撓性,而同時為通道1225提供氣密式密封。 In addition to the various embodiments of the inflatable gasket, a flexible seal, such as a bellows seal or a lip seal, that is permanently attached (eg, attached to the panel 1228 and attached to the base 1070) can also be used The channel 1225 is sealed. This permanently attached seal provides the flexibility needed to achieve the various translational and vibratory movements of the base 1070 while providing a hermetic seal to the channel 1225.

如一般技藝人士可瞭解的是,圍繞有明顯邊界之邊緣(well-defined edge)形成保形密封可能有問題。在指示了圍繞諸如底座1070之結構的密封之氣體包體之各種實施例中,此結構可經製造來消除有明顯邊界之邊緣,在此等邊緣處需要密封。在圖24之列印系統1050的各種實施例中,最初可將底座1070製造成具有底座1070之磨圓的橫側邊緣以促進密封,如陰影線1070-1A關於第一側1076所指示以及陰影1070-1B關於第二側1078所指示。在圖24之列印系統1050的各種實施例中,可稍後修改底 座1070以使其具有多個結構,該等結構被安裝來提供底座1070之磨圓的橫側邊緣以促進密封,如陰影線結構1070-2A關於第一側1076所指示以及陰影線結構1070-2B關於第二側1078所指示。底座1070可由可提供支撐列印系統所需要之穩定性的材料製成,該材料例如但不限於花崗岩及鋼。如圖28中所指示,可易於修改此等材料。儘管對使用墊圈來封閉中間底座面板總成1220'中之底座1070周圍的通道1225給出一實例,但一般技藝人士將瞭解的是,跨越底座總成1220'之框架構件1226對底座1070周圍之封閉(見圖24)可使用相同的原理來進行。 As one of ordinary skill will appreciate, forming a conformal seal around a well-defined edge can be problematic. In various embodiments indicating a sealed gas enclosure surrounding a structure such as base 1070, the structure can be fabricated to eliminate edges having significant boundaries at which seals are required. In various embodiments of the printing system 1050 of FIG. 24, the base 1070 can be initially fabricated to have a rounded lateral side edge of the base 1070 to facilitate sealing, as indicated by the hatched lines 1070-1A with respect to the first side 1076 and shadows. 1070-1B is indicated with respect to the second side 1078. In various embodiments of the printing system 1050 of Figure 24, the bottom can be modified later The seat 1070 is configured to have a plurality of structures that are mounted to provide a rounded lateral side edge of the base 1070 to facilitate sealing, as indicated by the hatched structure 1070-2A with respect to the first side 1076 and the hatched structure 1070- 2B is indicated with respect to the second side 1078. The base 1070 can be made of a material that provides the stability needed to support the printing system, such as, but not limited to, granite and steel. As indicated in Figure 28, such materials can be readily modified. Although an example is given for the use of a gasket to enclose the channel 1225 around the base 1070 in the intermediate base panel assembly 1220', one of ordinary skill in the art will appreciate that the frame member 1226 spanning the base assembly 1220' is adjacent to the base 1070. Closure (see Figure 24) can be performed using the same principles.

如前面所討論,列印頭總成之維護可包括各種校準程序及維護程序。例如,為了列印OLED顯示面板基板,每一列印頭總成(諸如圖24之第一列印頭總成1080及第二列印頭總成1081)可具有安裝於至少一個列印頭裝置中的複數個列印頭。在各種實施例中,列印頭裝置可包括:例如但不限於通向至少一個列印頭的流體及電子連接;每一列印頭具有能夠以受控制之速率、速度及大小來噴射墨水之複數個噴嘴或孔口。對於圖24之第一列印頭總成1080及第二列印頭總成1081的各種實施例,每一列印頭總成可包括約1個至約60個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中之約1個至約30個之間的列印頭。例如工業噴墨頭之列印頭可具有約16個至約2048個噴嘴,該等噴嘴可射出約0.1pL至約200pL之間的液滴體積。校準列印頭可包括:例如但不限於檢查噴嘴發射、量測液滴體積、速度及方向,以及調諧列印頭,以使得每一噴嘴噴射均勻體積之液滴。維護列印頭可包括例如但不限於諸如以下程序:列印頭起動,此需要收集及圍阻自列印頭射出之墨水;在起動程序之後移除多餘墨水; 以及列印頭替換。在列印處理中,例如為了列印OLED顯示面板基板,噴嘴之可靠發射對確保列印處理可製造優質OLED面板顯示器很關鍵。因此,需要容易地且可靠地實行與列印頭維護相關聯之各種程序;尤其是無需將氣體包體總成之內部曝露於諸如以下各種反應性成分:例如但不限於來自於大氣的氧氣及水蒸汽,以及例如但不限於來自列印處理之有機溶劑蒸汽。 As discussed above, the maintenance of the printhead assembly can include various calibration procedures and maintenance procedures. For example, to print an OLED display panel substrate, each of the print head assemblies (such as the first print head assembly 1080 and the second print print head assembly 1081 of FIG. 24) can be mounted in at least one print head device Multiple print heads. In various embodiments, the printhead device can include, for example but without limitation, fluid and electrical connections to at least one of the printheads; each printhead has a plurality of inks that are capable of ejecting ink at a controlled rate, speed, and size. Nozzles or orifices. For various embodiments of the first print head assembly 1080 and the second print head assembly 1081 of FIG. 24, each print head assembly can include between about 1 and about 60 print head assemblies, wherein Each of the print head devices can have between about 1 and about 30 print heads in each of the print head devices. For example, a printhead of an industrial inkjet head can have from about 16 to about 2048 nozzles that can eject a droplet volume of between about 0.1 pL and about 200 pL. Calibrating the print head can include, for example, but not limited to, inspecting nozzle emissions, measuring drop volume, speed and direction, and tuning the print head such that each nozzle ejects a uniform volume of droplets. Maintaining the print head can include, for example, but is not limited to, a program such as: print head activation, which requires collection and containment of ink ejected from the print head; removal of excess ink after the start-up procedure; And print head replacement. In the printing process, for example for printing an OLED display panel substrate, reliable emission of the nozzle is critical to ensure that the printing process can produce a high quality OLED panel display. Accordingly, there is a need to readily and reliably perform the various procedures associated with printhead maintenance; in particular, it is not necessary to expose the interior of the gas inclusion assembly to various reactive components such as, but not limited to, oxygen from the atmosphere and Water vapor, and for example, but not limited to, organic solvent vapor from a printing process.

就此而言,對於圖24之氣體包體總成的各種實施例,維護系統可例如但不限於在底座1070之頂部表面1071上安裝成靠近第一列印頭總成1080,以及在底座1070之頂部表面1073上安裝成靠近第二列印頭總成1081。此維護系統可包括:例如但不限於用於執行各種列印頭校準程序之液滴校準台;用於在沖洗或起動程序期間收集及圍阻自列印頭射出之墨水的沖洗台;以及用於在已於沖洗台處執行沖洗或起動程序之後移除多餘墨水的吸墨台。在例行維護期間,此等程序可在完全自動化的模式下執行。在一些情況下,當維護程序期間可能指示一定程度之人為干預時,可經由例如手套埠之使用來在外部完成終端使用者接取。如前面所討論,圖23至圖28之氣體包體總成1000的各種實施例有效地減小OLED列印處理期間所需要之惰性氣體的體積,而同時提供對氣體包體之內部的輕鬆接取。 In this regard, for various embodiments of the gas enclosure assembly of FIG. 24, the maintenance system can be mounted, for example, but not limited to, on the top surface 1071 of the base 1070 proximate to the first printhead assembly 1080, and at the base 1070 The top surface 1073 is mounted adjacent to the second row of print head assemblies 1081. The maintenance system can include, for example but without limitation, a droplet calibration station for performing various printhead calibration procedures; a rinse station for collecting and enclosing ink ejected from the printhead during a flush or start procedure; An ink absorbing station that removes excess ink after a rinsing or starting procedure has been performed at the rinsing station. These programs can be executed in fully automated mode during routine maintenance. In some cases, when a certain degree of human intervention may be indicated during the maintenance procedure, the end user access may be completed externally via, for example, the use of a glove. As previously discussed, the various embodiments of the gas inclusion assembly 1000 of Figures 23 through 28 effectively reduce the volume of inert gas required during the OLED printing process while providing easy access to the interior of the gas enclosure. take.

此外,若列印頭維護需要對列印頭總成或各種維護台中之任一者的直接接取,則使門1158密封地封閉住開口1148(如關於圖27A及圖27B所描述)以及密封地封閉底座1070周圍之通道(如關於圖28所描述)可將一框架構件總成區段所界定之體積與氣體包體總成1000之剩餘體積隔離開,該框架構件總成區段包括中間面板總成1200'及中間底座面板總成1220'之被隔離部分。此外,一般技藝人士將理解的是,使門1158密封地封 閉住開口1148(如關於圖27A、圖27B及圖28所描述)以及密封地封閉底座1070周圍之通道(如關於圖28所描述)可遠程且自動地完成。對於氣體包體總成1000之各種實施例,此維護框架構件總成區段之此被隔離體積之部分體積可小於或等於經輪廓塑造之氣體包體總成的各種實施例之總體積的約20%。對於氣體包體總成1000之各種實施例,此維護框架構件總成區段之此被隔離體積之部分體積可小於或等於經輪廓塑造之氣體包體總成的各種實施例之總體積的約50%。藉由大大減少需要終端使用者直接接取來進行列印頭維護的氣體包體總成之部分,可大大減少系統復原時間。 In addition, if the printhead maintenance requires direct access to either the printhead assembly or any of the various maintenance stations, the door 1158 is hermetically sealed to the opening 1148 (as described with respect to Figures 27A and 27B) and sealed. The passage around the ground enclosure 1070 (as described with respect to FIG. 28) may isolate the volume defined by a frame member assembly section from the remaining volume of the gas enclosure assembly 1000, the frame member assembly section including the middle The panel assembly 1200' and the isolated portion of the intermediate base panel assembly 1220'. Moreover, it will be understood by those of ordinary skill in the art that the door 1158 is hermetically sealed. Closing the opening 1148 (as described with respect to Figures 27A, 27B, and 28) and sealingly enclosing the passage around the base 1070 (as described with respect to Figure 28) can be accomplished remotely and automatically. For various embodiments of the gas inclusion assembly 1000, the portion of the volume of the isolated volume of the maintenance frame member assembly section can be less than or equal to about the total volume of the various embodiments of the contoured gas inclusion assembly. 20%. For various embodiments of the gas inclusion assembly 1000, the portion of the volume of the isolated volume of the maintenance frame member assembly section can be less than or equal to about the total volume of the various embodiments of the contoured gas inclusion assembly. 50%. System recovery time can be greatly reduced by greatly reducing the portion of the gas package assembly that requires direct access by the end user for printhead maintenance.

圖29描繪根據本教示之氣體包體總成的各種實施例之氣體包體總成1010的透視圖。氣體包體總成1010可包括前部面板總成1100'、中間面板總成1200'以及後部面板總成1300'。前部面板總成1100'可包括前部天花板面板總成1160';前部壁面板總成1140',其具有用於接納基板之開口1142;以及前部底座面板總成1120'。後部面板總成1300'可包括後部天花板面板總成1360'、後部壁面板總成1340'及後部底座面板總成1320'。中間面板總成1200'可包括第一中間包體面板總成1240'、中間壁及天花板面板總成1260'及第二中間包體面板總成1280',以及中間底座面板總成1220'。另外,中間面板總成1200'可包括第一中間維護系統面板總成1230'以及第二中間維護系統面板總成(未圖示)。 29 depicts a perspective view of a gas enclosure assembly 1010 in accordance with various embodiments of the gas inclusion assembly of the present teachings. The gas enclosure assembly 1010 can include a front panel assembly 1100', a middle panel assembly 1200', and a rear panel assembly 1300'. The front panel assembly 1100' can include a front ceiling panel assembly 1160'; a front wall panel assembly 1140' having an opening 1142 for receiving a substrate; and a front base panel assembly 1120'. The rear panel assembly 1300' can include a rear ceiling panel assembly 1360', a rear wall panel assembly 1340', and a rear base panel assembly 1320'. The intermediate panel assembly 1200' can include a first intermediate body panel assembly 1240', an intermediate wall and ceiling panel assembly 1260', and a second intermediate body panel assembly 1280', and an intermediate base panel assembly 1220'. Additionally, the intermediate panel assembly 1200' can include a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly (not shown).

圖30描繪根據本教示之氣體包體總成的各種實施例之氣體包體1010的分解透視圖。氣體包體總成1010可封裝OLED列印系統1050,該OLED列印系統可包括由基板漂浮台底座1052支撐的基板漂浮台1054。基板漂浮台底座1052可安裝於底座1070上。OLED列印系統之基板漂浮台 1054可支撐基板1058,並且界定基板1058在基板之OLED列印期間可被移動通過系統1010所經過的行程。基板漂浮台1054可提供基板1058之無摩擦輸送。對於圖30之氣體包體總成1010,OLED列印系統1050上可存在四個隔離體:第一隔離體組1051(未展示對立面上之第二隔離體)以及第二隔離體組1053(未展示對立面上之第二隔離體),該等隔離體組支撐OLED列印系統1050之基板漂浮台1054。底座1070可包括第一豎管1075及第二豎管1077,橋1079安裝於該第一豎管及該第二豎管上。對於OLED列印系統1050之各種實施例,橋1079可支撐第一列印頭總成定位系統1090及第二定位系統1091,該等定位系統可分別控制第一列印頭總成1080及第二列印頭總成1081之移動。對於OLED列印系統1050之各種實施例,可存在單個定位系統及單個列印頭總成。對於OLED列印系統1050之各種實施例,可存在單個列印頭總成,例如第一列印頭總成1080及第二列印頭總成1081中之任一者,而用於檢查基板1058之特徵的攝影機系統可安裝至第二定位系統。 FIG. 30 depicts an exploded perspective view of a gas enclosure 1010 in accordance with various embodiments of the gas inclusion assembly of the present teachings. The gas inclusion assembly 1010 can enclose an OLED printing system 1050 that can include a substrate floating platform 1054 supported by a substrate floating platform base 1052. The substrate floating platform base 1052 can be mounted on the base 1070. Substrate floating platform of OLED printing system 1054 can support substrate 1058 and define the path through which substrate 1058 can be moved through system 1010 during OLED printing of the substrate. The substrate floating station 1054 can provide frictionless transport of the substrate 1058. For the gas inclusion assembly 1010 of Figure 30, there may be four spacers on the OLED printing system 1050: a first spacer set 1051 (the second spacer on the opposite side is not shown) and a second spacer set 1053 (not A second spacer on the opposite side is shown that supports the substrate floating platform 1054 of the OLED printing system 1050. The base 1070 can include a first riser 1075 and a second riser 1077, and the bridge 1079 is mounted on the first riser and the second riser. For various embodiments of the OLED printing system 1050, the bridge 1079 can support the first print head assembly positioning system 1090 and the second positioning system 1091, and the positioning systems can respectively control the first print head assembly 1080 and the second The movement of the print head assembly 1081. For various embodiments of OLED printing system 1050, there may be a single positioning system and a single printhead assembly. For various embodiments of the OLED printing system 1050, there may be a single printhead assembly, such as any of the first printhead assembly 1080 and the second printhead assembly 1081, for inspection of the substrate 1058 The camera system of the features can be mounted to a second positioning system.

用於將第一列印頭總成1080定位在基板漂浮台1054上方的第一列印頭總成定位系統1090可包括第一X軸托架1092及第一Z軸活動板1094,第一列印頭總成包體1084可安裝於該活動板上。第二列印頭總成定位系統1091可被類似地組配來控制可包括第二列印頭總成包體1085之第二列印頭總成1081的X-Z軸移動。如圖30中關於第一列印頭總成1080所描繪,其中第一列印頭總成包體1084係以局部視圖來描繪,列印頭總成之各種實施例可具有安裝於該第一列印頭總成包體中之複數個列印頭裝置1082。對於列印系統1050之各種實施例,列印頭總成可包括約1個至約60 個之間的列印頭裝置,其中每一列印頭裝置可具有位於每一列印頭裝置中之約1個至約30個之間的列印頭。如隨後將更為詳細地討論,考慮到需要持續維護的列印頭裝置及列印頭的數量很大,可看出第一維護系統總成1250經定位以實現對第一列印頭總成1080之輕鬆接取。 The first print head assembly positioning system 1090 for positioning the first print head assembly 1080 above the substrate floating table 1054 can include a first X-axis bracket 1092 and a first Z-axis movable plate 1094, the first column The printhead assembly body 1084 can be mounted to the movable panel. The second row of print head assembly positioning systems 1091 can be similarly configured to control the X-Z axis movement of the second print head assembly 1081 that can include the second print head assembly body 1085. As depicted in FIG. 30 with respect to the first print head assembly 1080, wherein the first print head assembly body 1084 is depicted in a partial view, various embodiments of the print head assembly can have the first embodiment mounted thereon. A plurality of printhead devices 1082 in the head assembly are printed. For various embodiments of the printing system 1050, the printhead assembly can include from about 1 to about 60 A printhead device between each of the printhead devices, wherein each of the printhead devices can have between about 1 and about 30 printheads in each of the printhead devices. As will be discussed in more detail later, considering the large number of printhead devices and printheads that require ongoing maintenance, it can be seen that the first maintenance system assembly 1250 is positioned to achieve the first printhead assembly. Easy access to 1080.

如圖30中所描繪,氣體包體總成1010可包括前部底座面板總成1120'、中間底座面板總成1220'及後部底座面板總成1320',該等總成在被完全建構時形成相連的底座,可將OLED列印系統1050安裝於藉此形成之相連的底盤上,安裝方式與將OLED列印系統50安裝於圖13之底盤204上類似。第一隔離體組1051及第二隔離體組可安裝於對應之隔離體壁面板(諸如中間底座面板總成1220'之第二隔離體壁面板1225'及第二隔離體壁面板1227')中之每一者中。隨後可圍繞OLED列印系統1050將包含前部面板總成1100'、中間面板總成1200'及後部面板總成1300'之各種面板構件及面板連接起來以便形成氣體包體總成1010之各種實施例,其方式與關於圖3的氣體包體總成100之建構所描述的類似。 As depicted in FIG. 30, the gas enclosure assembly 1010 can include a front base panel assembly 1120', an intermediate base panel assembly 1220', and a rear base panel assembly 1320' that are formed when fully constructed A contiguous pedestal mounts the OLED printing system 1050 to the associated chassis formed thereby, similar to mounting the OLED printing system 50 to the chassis 204 of FIG. The first spacer set 1051 and the second spacer set can be mounted in a corresponding spacer wall panel (such as the second spacer wall panel 1225' and the second spacer wall panel 1227' of the intermediate base panel assembly 1220'). In each of them. Various panel members and panels including the front panel assembly 1100', the intermediate panel assembly 1200', and the rear panel assembly 1300' can then be joined around the OLED printing system 1050 to form various implementations of the gas enclosure assembly 1010. For example, the manner is similar to that described with respect to the construction of the gas inclusion assembly 100 of FIG.

對於圖30之氣體包體總成1010,中間底座總成1220'可包括第一中間維護系統面板總成1230'以及第二中間維護系統面板總成1270'。第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'可分別包括第一底板(floor panel)總成1241'之第一列印頭總成開口1242及第二底板總成1281'之第二列印頭總成開口1282。圖30中將第一底板總成1241'描繪成中間面板總成1200'之第一中間包體面板總成1240'的一部分。第一底板總成1241'係第一中間包體面板總成1240'及第一中間維護系統面板總成1230'兩者所共有的面板總成。圖30中將第二底板總成1281'描繪成中間面板總成 1200'之第二中間包體面板總成1280'的一部分。第二底板總成1281'係第二中間包體面板總成1280'及第二中間維護系統面板總成1270'兩者所共有的面板總成。 For the gas enclosure assembly 1010 of Figure 30, the intermediate base assembly 1220' can include a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly 1270'. The first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' can respectively include a first print head assembly opening 1242 of the first floor panel assembly 1241' and a second bottom plate total The second column of the 1281' print head assembly opening 1282. The first backplane assembly 1241' is depicted in FIG. 30 as part of the first intermediate package panel assembly 1240' of the intermediate panel assembly 1200'. The first floor assembly 1241' is a panel assembly common to both the first intermediate body panel assembly 1240' and the first intermediate maintenance system panel assembly 1230'. The second bottom plate assembly 1281' is depicted in FIG. 30 as an intermediate panel assembly A portion of the second intermediate body panel assembly 1280' of 1200'. The second floor assembly 1281' is a panel assembly common to both the second intermediate body panel assembly 1280' and the second intermediate maintenance system panel assembly 1270'.

如前面所提及,第一列印頭總成1080可封裝在第一列印頭總成包體1084中,且第二列印頭總成1081可封裝在第二列印頭總成包體1085中。如隨後將更為詳細地討論,第一列印頭總成包體1084及第二列印頭總成包體1085可具有位於可具有輪緣(未圖示)的底部之開口,以使得各種列印頭總成可經定位以便在列印處理期間進行列印。另外,第一列印頭總成包體1084及第二列印頭總成總體1085之形成殼體的各部分可如前面關於各種面板總成所描述來建構,以使得框架總成構件及面板能夠提供氣密式包體。可圍繞第一列印頭總成開口1242及第二列印頭總成開口1282中之每一者貼附可壓縮墊圈,或另一選擇為,分別圍繞第一列印頭總成包體1084及第二列印頭總成包體1085的輪緣貼附可壓縮墊圈。如圖30中所描繪,可分別圍繞第一列印頭總成開口1242及第二列印頭總成開口1282貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。第一列印頭總成定位系統1090及第二列印頭總成定位系統1091可將第一列印頭總成包體1084及第二列印頭總成包體1085分別與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接。對於各種列印頭維護程序,該對接可包括在該等列印頭總成包體中之每一者與該等維護系統面板總成中之每一者之間形成墊圈密封。當第一列印頭總成包體1084及第二列印頭總成包體1085與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接來密封地封閉第一列印頭總成開口1242及第二列印頭總 成開口1282時,如此形成的組合式結構被氣密式密封。 As mentioned previously, the first print head assembly 1080 can be packaged in the first print head assembly body 1084, and the second print head assembly 1081 can be packaged in the second print head assembly package. 1085. As will be discussed in greater detail later, the first printhead assembly body 1084 and the second printhead assembly body 1085 can have openings at the bottom that can have a rim (not shown) to enable various The printhead assembly can be positioned for printing during the printing process. Additionally, portions of the first print head assembly body 1084 and the second print head assembly body 1085 that form the housing can be constructed as previously described with respect to various panel assemblies such that the frame assembly members and panels Can provide a gas-tight package. A compressible gasket may be attached around each of the first printhead assembly opening 1242 and the second printhead assembly opening 1282, or alternatively, to surround the first printhead assembly enclosure 1084, respectively. And the rim of the second row of print head assembly body 1085 is attached with a compressible gasket. As depicted in FIG. 30, the first print head assembly butt washer 1245 and the second print head assembly can be attached to the first print head assembly opening 1242 and the second print head assembly opening 1282, respectively. Washer 1285. The first print head assembly positioning system 1090 and the second print head assembly positioning system 1091 can respectively perform the first print head assembly body 1084 and the second print head assembly package 1085 with the first intermediate maintenance The system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' are docked. For various printhead maintenance procedures, the docking can include forming a gasket seal between each of the printhead assembly enclosures and each of the maintenance system panel assemblies. When the first print head assembly body 1084 and the second print head assembly body 1085 are docked with the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' to sealingly close the first A print head assembly opening 1242 and a second print head total When the opening 1282 is formed, the thus formed combined structure is hermetically sealed.

在各種列印頭維護程序期間,第一列印頭總成1080及第二列印頭總成1081可分別藉由第一列印頭總成定位系統1090及第二列印頭總成定位系統1091分別定位在第一底板總成1241'之第一列印頭總成開口1242以及第二底板總成1281'之第二列印頭總成開口1282上方。就此而言,對於各種列印頭維護程序,第一列印頭總成1080及第二列印頭總成1081可分別定位在第一底板總成1241'之第一列印頭總成開口1242及第二底板總成1281'之第二列印頭總成開口1282上方,而不覆蓋或密封第一列印頭總成開口1242及第二列印頭總成開口1282。此外,對於各種列印頭維護程序,第一列印頭總成開口1242及第二列印頭總成開口1282之封閉可將第一中間維護系統面板總成1230'作為一區段並且將第二中間維護系統面板總成1270'作為一區段與氣體包體總成1010之剩餘體積分開。對於各種列印頭維護程序,第一列印頭總成1080及第二列印頭總成1081可分別在第一列印頭總成開口1242及第二列印頭總成開口1282上方在Z軸方向中對接在墊圈上,藉此封閉第一列印頭總成開口1242及第二列印頭總成開口1282。根據本教示,取決於在Z軸方向上施加至第一列印頭總成包體1084及第二列印頭總成包體1085的力,第一列印頭總成開口1242及第二列印頭總成開口1282可被覆蓋或密封。就此而言,在Z軸方向上施加至第一列印頭總成包體1084的可密封第一列印頭總成開口1242的力可將第一中間維護系統面板總成1230'作為一區段與包含氣體包體總成1010的剩餘框架構件總成區段隔離開。類似地,在Z軸方向上施加至第二列印頭總成包體1085的可密封第二列印頭總成開口1282的力可將第二中間維護系統面板總成1270'作為一區段 與包含氣體包體總成1010的剩餘框架構件總成區段隔離開。 The first print head assembly 1080 and the second print head assembly 1081 can be used by the first print head assembly positioning system 1090 and the second print head assembly positioning system, respectively, during various print head maintenance procedures. 1091 is positioned over the first printhead assembly opening 1242 of the first backplane assembly 1241' and the second printhead assembly opening 1282 of the second backplane assembly 1281', respectively. In this regard, for various printhead maintenance procedures, the first printhead assembly 1080 and the second printhead assembly 1081 can be positioned in the first printhead assembly opening 1242 of the first backplane assembly 1241', respectively. And the second printhead assembly opening 1282 of the second backplane assembly 1281' does not cover or seal the first printhead assembly opening 1242 and the second printhead assembly opening 1282. In addition, for various printhead maintenance procedures, the closure of the first printhead assembly opening 1242 and the second printhead assembly opening 1282 can take the first intermediate maintenance system panel assembly 1230' as a section and will The two intermediate maintenance system panel assembly 1270' is separated as a section from the remaining volume of the gas enclosure assembly 1010. For various printhead maintenance procedures, the first printhead assembly 1080 and the second printhead assembly 1081 can be over the first printhead assembly opening 1242 and the second printhead assembly opening 1282, respectively. The shaft is butted against the washer, thereby closing the first print head assembly opening 1242 and the second print head assembly opening 1282. According to the present teachings, the first print head assembly opening 1242 and the second column are dependent on the force applied to the first print head assembly body 1084 and the second print head assembly body 1085 in the Z-axis direction. The printhead assembly opening 1282 can be covered or sealed. In this regard, the force applied to the sealable first printhead assembly opening 1242 of the first printhead assembly body 1084 in the Z-axis direction can treat the first intermediate service system panel assembly 1230' as a zone. The segments are isolated from the remaining frame member assembly sections that include the gas inclusion assembly 1010. Similarly, the force applied to the sealable second printhead assembly opening 1282 of the second printhead assembly body 1085 in the Z-axis direction can treat the second intermediate service system panel assembly 1270' as a section Separate from the remaining frame member assembly sections that include the gas inclusion assembly 1010.

預期的是,在氣體包體總成1010之各種實施例中,罩蓋(諸如,例如但不限於前面關於圖26以及圖27A及圖27B所描述之閘閥總成)可安裝於第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'中。此罩蓋可用來分別覆蓋第一中間維護系統面板總成1230'之第一列印頭總成開口1242及第二中間維護系統面板總成1270'之第二列印頭總成開口1282。如隨後將更為詳細地討論,使用罩蓋(諸如,例如但不限於閘閥總成)來封閉第一列印頭總成開口1242及第二列印頭總成開口1282可允許在不對接列印頭總成的情況下將第一框架構件總成區段與第二框架構件總成區段隔離開。就此而言,可在不中斷列印處理之情況下執行各種維護程序。 It is contemplated that in various embodiments of the gas inclusion assembly 1010, a cover such as, for example, but not limited to, the gate valve assembly previously described with respect to Figures 26 and 27A and 27B can be mounted to the first intermediate maintenance System panel assembly 1230' and second intermediate maintenance system panel assembly 1270'. The cover can be used to cover the first printhead assembly opening 1242 of the first intermediate maintenance system panel assembly 1230' and the second printhead assembly opening 1282 of the second intermediate maintenance system panel assembly 1270', respectively. As will be discussed in greater detail later, the use of a cover such as, for example, but not limited to, a gate valve assembly to close the first printhead assembly opening 1242 and the second printhead assembly opening 1282 may allow for misalignment of the columns. In the case of the printhead assembly, the first frame member assembly section is isolated from the second frame member assembly section. In this regard, various maintenance procedures can be performed without interrupting the printing process.

氣體包體總成1010之圖30描繪可包括第一後部壁面板總成1238'之第一中間維護系統面板總成1230'。類似地,亦描繪可包括第二後部壁面板總成1278'之第二中間維護系統面板總成1270'。第一中間維護系統面板總成1230'之第一後部壁面板總成1238'的建構方式可與關於第二後部壁面板總成1278'所展示的類似。第二中間維護系統面板總成1270'之第二後部壁面板總成1278'可由具有第二密封件支撐面板1275之第二後部壁框架總成1278建構而成,該第二密封件支撐面板密封地安裝至第二後部壁框架總成1278。第二密封件支撐面板1275可具有第二通道1265,該第二通道靠近底座1070之第二端部(未圖示)。第二密封件1267可圍繞第二通道1265安裝於第二密封件支撐面板1275上。 FIG. 30 of gas inclusion assembly 1010 depicts a first intermediate maintenance system panel assembly 1230' that may include a first rear wall panel assembly 1238'. Similarly, a second intermediate maintenance system panel assembly 1270' that can include a second rear wall panel assembly 1278' is also depicted. The first rear wall panel assembly 1238' of the first intermediate maintenance system panel assembly 1230' can be constructed in a manner similar to that shown with respect to the second rear wall panel assembly 1278'. The second rear wall panel assembly 1278' of the second intermediate maintenance system panel assembly 1270' can be constructed from a second rear wall frame assembly 1278 having a second seal support panel 1275 that supports the panel seal Mounted to the second rear wall frame assembly 1278. The second seal support panel 1275 can have a second passage 1265 that is adjacent the second end of the base 1070 (not shown). The second seal 1267 can be mounted to the second seal support panel 1275 around the second passage 1265.

圖31A至圖31F係氣體包體總成1010之示意性橫截面圖, 其可進一步例示第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'之各方面。如一般技藝人士可瞭解,考慮到可具有分別用於定位第一列印頭總成1080及第二列印頭總成1081的第一列印頭總成定位系統1090及第二列印頭總成定位系統1091之列印系統1050的對稱性(見圖30),針對圖31A至圖31D所例示之關於第一中間維護系統面板總成1230'的以下教示可適用於第二中間維護系統面板總成1270'。 31A through 31F are schematic cross-sectional views of a gas inclusion body assembly 1010, It may further illustrate aspects of the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270'. As will be appreciated by those of ordinary skill in the art, it is contemplated that there may be a first print head assembly positioning system 1090 and a second print head total for positioning the first print head assembly 1080 and the second print head assembly 1081, respectively. The symmetry of the printing system 1050 of the positioning system 1091 (see FIG. 30), the following teachings regarding the first intermediate maintenance system panel assembly 1230' illustrated with respect to FIGS. 31A-31D are applicable to the second intermediate maintenance system panel. Assembly 1270'.

圖31A描繪氣體包體總成1010之示意性橫截面圖,其展示第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'。圖31A之第一中間維護系統面板總成1230'可封裝第一維護系統總成1250,可藉由第一維護系統定位系統1251相對於第一列印頭總成開口1242來定位該第一維護系統總成。第一列印頭總成開口1242係第一底板總成1241'中之開口,該第一底板總成係第一中間維護系統面板總成1230'及第一中間包體面板總成1240'所共有的面板。第一維護系統定位系統1251可安裝於第一維護系統總成平台1253上,該第一維護系統總成平台可穩固地安裝至底座1070之第一端部1072上。第一維護系統總成平台1253可自底座1070之第一端部1072延伸穿過第一通道1261,進入第一中間維護系統面板總成1230'。類似地,如圖31A中所描繪,圖31A之第二中間維護系統面板總成1270'可封裝第二維護系統總成1290,可藉由第二維護系統定位系統1291相對於第二列印頭總成開口1282來定位該第二維護系統總成。第二列印頭總成開口1282係第一底板總成1281'中之開口,該第一底板總成係第二中間維護系統面板總成1270'及第二中間包體面板總成1280'所共有的面板。第二維護系統定位系統1291可安裝於第二維護總成系統平台1293上,該第二維護總成系 統平台可自底座1070之第二端部1074延伸穿過通道1265,進入第二中間維護系統面板總成1270'。第一密封件1263可圍繞第一通道1261安裝於第一密封件支撐面板1235的第一外表面1237上。類似地,第二密封件1267可圍繞第二通道1265安裝於第二密封件支撐面板1275的第二外表面1277上。第一密封件1263及第二密封件1267可為如前面關於圖28所描述之充氣式墊圈。第一密封件1263及第二密封件1267之各種實施例可為永久性附接(例如,分別附接至第一外表面1237及第二外表面1277,並且附接至底座1070之底座第一端部1072及底座1070之第二端部1074)的可撓性密封件。如前面所討論,可撓性密封件可為諸如波紋管密封件或唇形密封件之密封件。此永久性附接的密封件可提供實現底座1070之各種平移及振動移動所需要的可撓性,而同時為第一通道1261及第二通道1265提供氣密式密封。 31A depicts a schematic cross-sectional view of a gas enclosure assembly 1010 showing a first intermediate maintenance system panel assembly 1230' and a second intermediate maintenance system panel assembly 1270'. The first intermediate maintenance system panel assembly 1230' of FIG. 31A can package the first maintenance system assembly 1250, which can be positioned relative to the first printhead assembly opening 1242 by the first maintenance system positioning system 1251. System assembly. The first print head assembly opening 1242 is an opening in the first bottom plate assembly 1241'. The first bottom plate assembly is a first intermediate maintenance system panel assembly 1230' and a first intermediate package panel assembly 1240'. Shared panel. The first maintenance system positioning system 1251 can be mounted to the first maintenance system assembly platform 1253 that can be securely mounted to the first end 1072 of the base 1070. The first maintenance system assembly platform 1253 can extend from the first end 1072 of the base 1070 through the first passage 1261 into the first intermediate maintenance system panel assembly 1230'. Similarly, as depicted in FIG. 31A, the second intermediate maintenance system panel assembly 1270' of FIG. 31A can package the second maintenance system assembly 1290 with respect to the second print head by the second maintenance system positioning system 1291. Assembly opening 1282 to position the second maintenance system assembly. The second print head assembly opening 1282 is an opening in the first bottom plate assembly 1281'. The first bottom plate assembly is a second intermediate maintenance system panel assembly 1270' and a second intermediate cover panel assembly 1280'. Shared panel. The second maintenance system positioning system 1291 can be installed on the second maintenance assembly system platform 1293, and the second maintenance assembly system The platform can extend from the second end 1074 of the base 1070 through the channel 1265 into the second intermediate maintenance system panel assembly 1270'. The first seal 1263 can be mounted around the first passage 1261 on the first outer surface 1237 of the first seal support panel 1235. Similarly, a second seal 1267 can be mounted about the second channel 1265 on the second outer surface 1277 of the second seal support panel 1275. The first seal 1263 and the second seal 1267 can be inflatable gaskets as previously described with respect to FIG. Various embodiments of the first seal 1263 and the second seal 1267 can be permanently attached (eg, attached to the first outer surface 1237 and the second outer surface 1277, respectively, and attached to the base of the base 1070 first A flexible seal for the end portion 1072 and the second end portion 1074 of the base 1070. As previously discussed, the flexible seal can be a seal such as a bellows seal or a lip seal. This permanently attached seal provides the flexibility needed to achieve the various translational and vibratory movements of the base 1070 while providing a hermetic seal for the first passage 1261 and the second passage 1265.

圖31B及圖31C例示出本教示之氣體包體總成1010的各種開口及通道之覆蓋及密封,其例示出相對於第一中間維護系統面板總成1230'來定位第一列印頭總成1080以便進行各種維護程序。如前面所提及,關於第一中間維護系統面板總成1230'之以下教示亦可適用於第二中間維護系統面板總成1270'。 31B and 31C illustrate various openings and channels covering and sealing of the gas enclosure assembly 1010 of the present teachings, illustrating the positioning of the first print head assembly relative to the first intermediate maintenance system panel assembly 1230'. 1080 for various maintenance procedures. As mentioned previously, the following teachings regarding the first intermediate maintenance system panel assembly 1230' may also be applied to the second intermediate maintenance system panel assembly 1270'.

在圖31B中,第一列印頭總成1080可包括具有至少一個列印頭之列印頭裝置1082,該至少一個列印頭包括複數個噴嘴或孔口。列印頭裝置1082可封裝在第一列印頭總成包體1084中,該第一列印頭總成包體可具有第一列印頭總成包體開口1086,列印頭裝置1082可自該第一列印頭總成包體開口被定位,以使得在列印期間,該等噴嘴以受控制之速率、速度及大小來噴射墨水至安裝於漂浮台1054上之基板上;該漂浮台係由漂浮 台支撐體1052支撐。如前面所討論,在列印處理期間可控制第一列印頭總成定位系統1090來將第一列印頭總成1080定位在基板上方以便進行列印。另外,如圖31B中所描繪,對於氣體包體總成1010之各種實施例,具有可控制之X-Z軸移動的第一列印頭總成定位系統1090可將第一列印頭總成1080定位在第一列印頭總成開口1242上方。如圖31B中所描繪,第一底板總成1241'之第一列印頭總成開口1242係第一中間包體面板總成1240'及第一中間維護系統面板總成1230'所共有的。 In FIG. 31B, the first printhead assembly 1080 can include a printhead device 1082 having at least one printhead that includes a plurality of nozzles or orifices. The printhead device 1082 can be packaged in a first printhead assembly body 1084, the first printhead assembly package can have a first printhead assembly package opening 1086, and the printhead assembly 1082 can The package openings from the first printhead assembly are positioned such that during printing, the nozzles eject ink at a controlled rate, speed and size onto a substrate mounted on the floating table 1054; Taiwan is floating The table support 1052 is supported. As discussed above, the first printhead assembly positioning system 1090 can be controlled during the printing process to position the first printhead assembly 1080 over the substrate for printing. Additionally, as depicted in FIG. 31B, for various embodiments of the gas inclusion assembly 1010, a first printhead assembly positioning system 1090 having controllable XZ-axis movement can position the first printhead assembly 1080 Above the first row of printhead assembly openings 1242. As depicted in Figure 31B, the first printhead assembly opening 1242 of the first backplane assembly 1241' is common to the first intermediate package panel assembly 1240' and the first intermediate maintenance system panel assembly 1230'.

圖31B之第一列印頭總成包體1084可包括第一列印頭總成包體輪緣1088,該輪緣可為圍繞第一列印頭總成開口1242與第一底板總成1241'對接的表面。第一列印頭總成包體輪緣1088可嚙合第一列印頭總成對接墊圈1245,該第一列印頭總成對接墊圈在圖31B中係描繪成圍繞第一列印頭總成開口1242來貼附的。一般技藝人士將瞭解的是,儘管展示第一列印頭總成包體輪緣1088被描繪成向內突出之結構,但可在第一列印頭總成包體1084上建構多種輪緣中之任一者。另外,儘管圖31B中描繪第一列印頭總成對接墊圈1245係圍繞第一列印頭總成開口1242來貼附的,但一般從業人士將瞭解的是,墊圈1245可貼附於第一列印頭總成包體輪緣1088。第一列印頭總成對接墊圈1245可為如前面關於密封框架構件總成所描述之墊圈材料中之任一者。在圖31B之氣體包體總成1010的各種實施例中,第一列印頭總成對接墊圈1245可為充氣式墊圈,諸如墊圈1263。就此而言,第一列印頭總成對接墊圈1245可為如前面關於圖28所描述之充氣式墊圈。如前面所呈現,第一密封件1263可圍繞第一通道1261安裝於第一密封件支撐面板1235的第一外表面1237上。 The first print head assembly body 1084 of FIG. 31B can include a first print head assembly body rim 1088 that can surround the first print head assembly opening 1242 and the first bottom plate assembly 1241 'Docking surface. The first row of print head assembly body rims 1088 can engage the first row of print head assembly docking washers 1245, which are depicted in FIG. 31B as surrounding the first print head assembly The opening 1242 is attached. One of ordinary skill in the art will appreciate that although the first print head assembly body rim 1088 is depicted as being inwardly projecting, a plurality of rims can be constructed in the first print head assembly body 1084. Either. Additionally, although the first printhead assembly docking washer 1245 is depicted in FIG. 31B as being attached around the first printhead assembly opening 1242, one of ordinary skill in the art will appreciate that the washer 1245 can be attached to the first The print head assembly body rim 1088. The first row of print head docking washers 1245 can be any of the gasket materials previously described with respect to the seal frame member assembly. In various embodiments of the gas enclosure assembly 1010 of FIG. 31B, the first printhead assembly docking washer 1245 can be an inflatable gasket, such as a washer 1263. In this regard, the first row of print head docking washers 1245 can be an inflatable gasket as previously described with respect to FIG. As previously presented, the first seal 1263 can be mounted about the first channel 1261 on the first outer surface 1237 of the first seal support panel 1235.

如圖31B及圖31C中所描繪,對於可在完全自動化的模式下執行之各種維護程序,第一列印頭總成1080可保持定位在第一列印頭總成開口1242上方。就此而言,可藉由第一列印頭總成定位系統1090在Z軸方向上調整第一列印頭總成1080,以便在第一列印頭總成開口1242上方相對於第一維護系統總成1250來定位列印頭裝置1082。另外,可於第一維護系統定位系統1251上在Y-X軸方向上調整第一維護系統總成1250,以便相對於列印頭裝置1082來定位第一維護系統總成1250。在各種維護程序期間,可藉由第一列印頭總成定位系統1090在Z軸方向上所作的進一步調整來將第一列印頭總成1080置放成與第一列印頭總成對接墊圈1245接觸,從而將第一列印頭總成包體1084置放在覆蓋第一列印頭總成開口1242的位置中(未圖示)。如圖31C中所描繪,對於各種維護程序,例如但不限於需要直接接取第一中間維護系統面板總成1230'之內部之維護程序,可藉由第一列印頭總成定位系統1090在Z軸方向上所作的更進一步調整來將第一列印頭總成1080與第一列印頭總成對接墊圈1245對接,從而密封第一列印頭總成開口1242。如前面所提及,第一列印頭總成對接墊圈1245可為如前面關於各種框架構件的氣密式密封所描述之可壓縮墊圈材料,或為如前面關於圖28所描述之充氣式墊圈。另外,如圖31C中所描繪,充氣式墊圈1263可被充氣,藉此密封地封閉第一通道1261。此外,第一列印頭總成包體1084之形成殼體的各部分可如前面關於各種面板總成所描述來建構,以使得框架總成構件及面板能夠提供氣密式包體。因此,對於圖31C,當第一列印頭總成開口1242及第一通道1261被密封地封閉時,可將第一中間維護系統面板總成1230'與氣體包體總成1010之剩餘體積隔離開。 As depicted in Figures 31B and 31C, the first printhead assembly 1080 can remain positioned above the first printhead assembly opening 1242 for various maintenance procedures that can be performed in a fully automated mode. In this regard, the first print head assembly 1080 can be adjusted in the Z-axis direction by the first print head assembly positioning system 1090 to be positioned above the first print head assembly opening 1242 relative to the first maintenance system. Assembly 1250 locates printhead device 1082. Additionally, the first maintenance system assembly 1250 can be adjusted in the Y-X axis direction on the first maintenance system positioning system 1251 to position the first maintenance system assembly 1250 relative to the printhead device 1082. During the various maintenance procedures, the first print head assembly 1080 can be placed into docking with the first print head assembly by further adjustments made in the Z-axis direction by the first print head assembly positioning system 1090. The washer 1245 is in contact such that the first print head assembly body 1084 is placed in a position that covers the first print head assembly opening 1242 (not shown). As depicted in FIG. 31C, for various maintenance procedures, such as, but not limited to, maintenance procedures that require direct access to the interior of the first intermediate maintenance system panel assembly 1230', the first printhead assembly positioning system 1090 can be utilized. Further adjustments made in the Z-axis direction interface the first print head assembly 1080 with the first print head assembly mating washer 1245 to seal the first print head assembly opening 1242. As mentioned previously, the first printhead assembly docking washer 1245 can be a compressible gasket material as described above with respect to the hermetic seal of various frame members, or an inflatable gasket as previously described with respect to FIG. . Additionally, as depicted in FIG. 31C, the inflatable gasket 1263 can be inflated thereby sealingly closing the first passage 1261. In addition, the portions of the first printhead assembly body 1084 that form the housing can be constructed as previously described with respect to various panel assemblies to enable the frame assembly members and panels to provide a gas-tight enclosure. Thus, for FIG. 31C, the first intermediate maintenance system panel assembly 1230' can be isolated from the remaining volume of the gas enclosure assembly 1010 when the first printhead assembly opening 1242 and the first passage 1261 are hermetically sealed. open.

圖31D及圖31E中描繪氣體包體1010之各種實施例,其中第一維護系統總成1250及第二維護系統總成1290可分別安裝於第一維護系統總成平台1253及第二維護系統總成平台1293上。在圖31D及圖31E中,第一維護系統總成平台1253及第二維護系統總成平台1293分別包封在第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'中。如前面所提及,關於第一中間維護系統面板總成1230'之以下教示亦可適用於第二中間維護系統面板總成1270'。就此而言,如圖31D中所描繪,可利用由第一列印頭總成定位系統1090在Z軸方向上施加之足夠的力來將第一列印頭總成1080與第一列印頭總成對接墊圈1245對接,以使得第一列印頭總成開口1242可被密封。因此,對於圖31D,當第一列印頭總成開口1242被密封地封閉時,可將第一中間維護系統面板總成1230'與氣體包體總成1010之剩餘體積隔離開。 Various embodiments of the gas enclosure 1010 are depicted in Figures 31D and 31E, wherein the first maintenance system assembly 1250 and the second maintenance system assembly 1290 can be mounted to the first maintenance system assembly platform 1253 and the second maintenance system, respectively. On the platform 1293. In FIG. 31D and FIG. 31E, the first maintenance system assembly platform 1253 and the second maintenance system assembly platform 1293 are respectively enclosed in the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270'. in. As mentioned previously, the following teachings regarding the first intermediate maintenance system panel assembly 1230' may also be applied to the second intermediate maintenance system panel assembly 1270'. In this regard, as depicted in FIG. 31D, the first print head assembly 1080 and the first print head can be utilized with sufficient force applied by the first print head assembly positioning system 1090 in the Z-axis direction. The assembly docking washer 1245 is docked such that the first printhead assembly opening 1242 can be sealed. Thus, for FIG. 31D, the first intermediate maintenance system panel assembly 1230' can be isolated from the remaining volume of the gas enclosure assembly 1010 when the first printhead assembly opening 1242 is hermetically sealed.

如前面關於圖31A至圖31C的氣體包體總成1010之各種實施例所教示,列印頭在各種維護程序期間可保持定位在第一列印頭總成開口1242上方,而不覆蓋或密封第一列印頭總成開口1242以致於封閉第一列印頭總成開口1242。在氣體包體總成1010之各種實施例中,對於各種維護程序,可藉由調節Z軸來將列印頭總成包體置放成與墊圈接觸,以便覆蓋列印頭總成開口。就此而言,可以兩種方式來解釋圖31E。在第一種解釋中,第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285可由諸如前面關於各種框架構件之氣密式密封所描述之可壓縮墊圈材料製成。在圖31E中,第一列印頭總成1080已在Z軸方向上定位在第一維護系統總成1250上方,以使得墊圈1245已被壓縮,藉此密封地封閉第一列印頭總成開口 1242。相比之下,第二列印頭總成1081已在Z軸方向上定位在第二維護系統總成1290上方,以便與第二列印頭總成對接墊圈1285接觸,藉此密封地覆蓋第二列印頭總成開口1282。在第二種解釋中,第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285可為如前面關於圖28所描述之充氣式墊圈。在圖31E中,第一列印頭總成1080可在Z軸方向上定位在第一維護系統總成1250上方,以便與第一列印頭總成對接墊圈1245接觸,藉此覆蓋第一列印頭總成開口1242。相比之下,第二列印頭總成1081已在Z軸方向上定位在第二維護系統總成1290上方,以使得當第二列印頭總成對接墊圈1285被充氣時,第二列印頭總成開口1282被密封地封閉。 As previously taught with respect to various embodiments of the gas enclosure assembly 1010 of Figures 31A-31C, the printhead can remain positioned over the first printhead assembly opening 1242 during various maintenance procedures without covering or sealing. The first printhead assembly opening 1242 is such that the first printhead assembly opening 1242 is closed. In various embodiments of the gas enclosure assembly 1010, the printhead assembly package can be placed in contact with the gasket to adjust the Z-axis to cover the printhead assembly opening for various maintenance procedures. In this regard, Figure 31E can be explained in two ways. In a first explanation, the first row of printhead docking washers 1245 and the second row of printhead assembly butt washers 1285 can be made of a compressible gasket material such as that described above with respect to hermetic seals of various frame members. In FIG. 31E, the first print head assembly 1080 has been positioned over the first maintenance system assembly 1250 in the Z-axis direction such that the washer 1245 has been compressed, thereby sealingly closing the first print head assembly. Opening 1242. In contrast, the second print head assembly 1081 has been positioned over the second maintenance system assembly 1290 in the Z-axis direction to contact the second print head assembly docking washer 1285, thereby sealingly covering the first The two-row printhead assembly has an opening 1282. In the second interpretation, the first printhead assembly butt washer 1245 and the second printhead assembly docking washer 1285 can be inflatable gaskets as previously described with respect to FIG. In FIG. 31E, the first print head assembly 1080 can be positioned over the first maintenance system assembly 1250 in the Z-axis direction to contact the first print head assembly mating washer 1245, thereby covering the first column The print head assembly has an opening 1242. In contrast, the second print head assembly 1081 has been positioned over the second maintenance system assembly 1290 in the Z-axis direction such that when the second print head assembly docking washer 1285 is inflated, the second column The printhead assembly opening 1282 is hermetically sealed.

圖31F描繪的是,可使用罩蓋(諸如,例如但不限於閘閥總成)來密封例如使用第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來例示之維護體積。關於第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'之以下教示可適用於維護系統面板總成及氣體包體總成之各種實施例。如圖31F中所描繪,分別使用例如但不限於第一列印頭總成閘閥1247及第二列印頭總成閘閥1287來封閉第一列印頭總成開口1242及第二列印頭總成開口1282可分別提供第一列印頭總成1080及第二列印頭總成1081之連續操作。如關於圖31F的第一中間維護系統面板總成1230'所描繪,使用第一列印頭總成閘閥1247來密封地封閉第一列印頭總成開口1242(如關於圖27A及圖27B所描述)以及密封地封閉底座1070周圍之第一通道1261(如關於圖28所描述)可遠程且自動地完成。類似地,如關於圖31F的第二中間維護系統面板總成1270'所描繪,使用第二列印頭總成閘閥1287來密封地封閉第二列印頭總成開口1282(如關於圖27A及圖 27B所描述)可遠程且自動地完成。預期的是,可藉由隔離例如由第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'所界定之維護體積來促進各種列印頭維護體積程序,同時仍然提供利用第一列印頭總成1080及第二列印頭總成1081之列印處理的持續。 Figure 31F depicts that a cover (such as, for example, but not limited to, a gate valve assembly) can be used to seal maintenance, for example, using the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270'. volume. The following teachings regarding the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' are applicable to various embodiments of the maintenance system panel assembly and gas enclosure assembly. As depicted in FIG. 31F, the first printhead assembly opening 1242 and the second printhead total are closed using, for example, but not limited to, a first printhead assembly gate valve 1247 and a second printhead assembly gate valve 1287, respectively. The opening 1282 can provide continuous operation of the first print head assembly 1080 and the second print head assembly 1081, respectively. As depicted with respect to the first intermediate maintenance system panel assembly 1230' of Figure 31F, the first printhead assembly gate valve 1247 is used to sealingly close the first printhead assembly opening 1242 (as with respect to Figures 27A and 27B) The first channel 1261 (as described with respect to FIG. 28) that sealingly encloses the base 1070 can be completed remotely and automatically. Similarly, as depicted with respect to the second intermediate maintenance system panel assembly 1270' of FIG. 31F, the second printhead assembly gate valve 1287 is used to sealingly close the second printhead assembly opening 1282 (as with respect to FIG. 27A and Figure The description of 27B) can be done remotely and automatically. It is contemplated that various printhead maintenance volume programs can be facilitated by isolating maintenance volumes, such as defined by the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270', while still providing utilization The printing process of the first print head assembly 1080 and the second print head assembly 1081 continues.

如前面所提及,可分別圍繞第一列印頭總成開口1242及第二列印頭總成開口1282貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。另外,如圖31F中所描繪,可分別圍繞第一列印頭總成包體輪緣1088及第二列印頭總成包體輪緣1089貼附第一列印頭總成對接墊圈1245及第二列印頭總成對接墊圈1285。當指示第一列印頭總成1080及第二列印頭總成1081之維護時,第一列印頭總成閘閥1247及第二列印頭總成閘閥1287可打開,且第一列印頭總成1080及第二列印頭總成1081可如前面所描述與第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'對接。 As mentioned previously, the first print head assembly butt washer 1245 and the second print head assembly butt washer can be attached around the first print head assembly opening 1242 and the second print head assembly opening 1282, respectively. 1285. In addition, as depicted in FIG. 31F, the first print head assembly docking washer 1245 can be attached to the first print head assembly body rim 1088 and the second print head assembly body rim 1089, respectively. The second row of print head assemblies abuts the washer 1285. When the maintenance of the first print head assembly 1080 and the second print head assembly 1081 is indicated, the first print head assembly gate valve 1247 and the second print head assembly gate valve 1287 can be opened and the first print is printed. The head assembly 1080 and the second row of print head assemblies 1081 can interface with the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' as previously described.

例如但不限於,可在不中斷列印處理之情況下分別藉由隔離第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來完成可在第一維護系統總成1250及第二維護系統總成1290上提供維護之任何維護程序。進一步預期的是,可在不中斷列印處理之情況下分別藉由隔離第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270'來完成以下操作:將新列印頭或列印頭總成裝載至系統中,或自系統中移除列印頭或列印頭總成。可例如但不限於藉由使用機器人來自動地促進此等活動。例如但不限於,可完成對儲存在維護體積(諸如圖31F之第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')中之列印頭的自動取 回,隨後將第一列印頭總成1080之列印頭裝置1082上或第二列印頭總成1081之列印頭裝置1083上的故障列印頭自動更換為起作用之列印頭。此後可將故障列印頭自動沈積至位於第一維護系統總成1250或第二維護系統總成1290中的模組中。可在不中斷正在進行之列印處理的情況下在自動化模式下執行此等維護程序。 For example, but not limited to, the first maintenance system assembly can be completed by isolating the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270', respectively, without interrupting the printing process. Any maintenance procedures for maintenance are provided on the 1250 and the second maintenance system assembly 1290. It is further contemplated that the following operations can be accomplished by isolating the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270', respectively, without interrupting the printing process: a new print head Or the printhead assembly is loaded into the system or the printhead or printhead assembly is removed from the system. Such activities may be facilitated automatically, for example, but not limited to, by the use of a robot. For example, without limitation, automatic removal of printheads stored in a maintenance volume (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270' of Figure 31F) may be completed. Thereafter, the defective print head on the print head unit 1082 of the first print head assembly 1080 or the print head unit 1083 of the second print head assembly 1081 is automatically replaced with the active print head. Thereafter, the failed print head can be automatically deposited into a module located in the first maintenance system assembly 1250 or the second maintenance system assembly 1290. These maintenance procedures can be performed in automated mode without interrupting the ongoing printing process.

在將故障列印頭自動沈積於第一維護系統總成1250或第二維護系統總成1290中之後,可藉由分別使用例如但不限於第一列印頭總成閘閥1247及第二列印頭總成閘閥1287封閉第一列印頭總成開口1242及第二列印頭總成開口1282來分別密封地封閉及隔離維護體積(諸如第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')。此外,隨後可根據先前教示例如通過個別的中間維護系統面板總成開口而將維護體積(諸如第一中間維護系統面板總成1230'及第二中間維護系統面板總成1270')向大氣開放,以使得可取回及替換故障列印頭。如隨後將更為詳細地討論,因為氣體淨化系統之各種實施例係針對整個氣體包體總成之體積來設計,所以氣體淨化資源可專門用來沖洗維護體積空間之已顯著減小的體積,藉此顯著減少維護體積之系統復原時間。就此而言,可在不中斷正在進行之列印處理或對正在進行之列印處理造成最少中斷的情況下執行需要將維護體積向大氣開放之維護程序。 After the faulty print head is automatically deposited in the first maintenance system assembly 1250 or the second maintenance system assembly 1290, for example, but not limited to, the first print head assembly gate valve 1247 and the second print, respectively The head assembly gate valve 1287 closes the first row of print head assembly openings 1242 and the second row of print head assembly openings 1282 to sealingly seal and isolate the maintenance volume, respectively (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate portion Maintenance system panel assembly 1270'). In addition, the maintenance volume (such as the first intermediate maintenance system panel assembly 1230' and the second intermediate maintenance system panel assembly 1270') can then be opened to the atmosphere according to previous teaching examples, such as through individual intermediate maintenance system panel assembly openings, So that the faulty print head can be retrieved and replaced. As will be discussed in more detail later, because various embodiments of the gas purification system are designed for the volume of the entire gas inclusion body assembly, the gas purification resources can be specifically utilized to flush the significantly reduced volume of the maintenance volume. This significantly reduces the system recovery time for maintenance volumes. In this regard, maintenance procedures that require the maintenance volume to be open to the atmosphere can be performed without interrupting the ongoing printing process or causing minimal disruption to the ongoing printing process.

圖32描繪根據本教示之氣體包體總成及系統的各種實施例之第一維護系統總成1250的擴展視圖。如前面所討論,維護系統可包括:例如但不限於用於執行各種列印頭校準程序之液滴校準台;用於在沖洗或起動程序期間收集及圍阻自列印頭射出之墨水的沖洗台;以及用於在已於 沖洗台處執行沖洗或起動程序之後移除多餘墨水的吸墨台。另外,維護系統可包括用於以下操作之一或多個台:用於接納已自第一列印頭總成1080及第二列印頭總成1081移除之一或多個列印頭或列印頭裝置,或用於儲存可在維護程序期間裝載至第一列印頭總成1080及第二列印頭總成1081中的列印頭或列印頭裝置。 32 depicts an expanded view of a first maintenance system assembly 1250 of various embodiments of gas inclusion assemblies and systems in accordance with the present teachings. As previously discussed, the maintenance system can include, for example, but not limited to, a droplet calibration station for performing various printhead calibration procedures; for flushing and enclosing the ink ejected from the printhead during the flushing or starting procedure Taiwan; An ink absorbing station that removes excess ink after performing a rinsing or starting procedure at the rinsing station. Additionally, the maintenance system can include one or more of the following operations for receiving one or more printheads that have been removed from the first printhead assembly 1080 and the second printhead assembly 1081 or The print head device, or for storing print heads or print head devices that can be loaded into the first print head assembly 1080 and the second print head assembly 1081 during the maintenance process.

根據本教示之維護系統總成的各種實施例(諸如圖32之第一維護系統總成1250)可包括液滴校準模組1252、沖洗盆模組1254及吸墨模組1256。第一維護系統總成1250可安裝於第一維護系統定位系統1251上。第一維護系統定位系統1251可提供Y軸移動來選擇性地將各種模組中之每一者以及列印頭總成與第一列印頭總成開口1242對準,其中該列印頭總成具有配備至少一個列印頭之列印頭裝置,諸如圖31B之列印頭裝置1082。各種模組以及列印頭總成的定位可使用維護系統定位系統1251及第一列印頭總成定位系統1090之組合來完成,其中該列印頭總成具有配備至少一個列印頭之列印頭裝置。維護系統定位系統1252可提供第一維護系統總成1250的各種模組相對於第一列印頭總成開口1242之Y-X定位,而第一列印頭總成定位系統1090可提供第一列印頭總成1080在第一列印頭總成開口1242上方之X-Z定位。就此而言,配備至少一個列印頭之列印頭裝置可定位在第一列印頭總成開口1242上方或其中來接受維護。 Various embodiments of the maintenance system assembly in accordance with the present teachings (such as the first maintenance system assembly 1250 of FIG. 32) can include a droplet calibration module 1252, a wash basin module 1254, and an ink absorbing module 1256. The first maintenance system assembly 1250 can be mounted to the first maintenance system positioning system 1251. The first maintenance system positioning system 1251 can provide Y-axis movement to selectively align each of the various modules and the printhead assembly with the first printhead assembly opening 1242, wherein the printhead is total A printhead device having at least one printhead, such as the printhead device 1082 of Figure 31B. The positioning of the various modules and printhead assemblies can be accomplished using a combination of a maintenance system positioning system 1251 and a first printhead assembly positioning system 1090, wherein the printhead assembly has at least one printhead Print head device. The maintenance system positioning system 1252 can provide YX positioning of the various modules of the first maintenance system assembly 1250 relative to the first print head assembly opening 1242, while the first print head assembly positioning system 1090 can provide the first print The head assembly 1080 is positioned at XZ above the first printhead assembly opening 1242. In this regard, a printhead device equipped with at least one printhead can be positioned over or in the first printhead assembly opening 1242 for maintenance.

圖33例示第一中間維護系統面板總成1230'之擴展透視圖,其中描繪被封蓋且具有手套之手套埠。如所展示,預期的是,諸如第一中間維護系統面板總成1230'之各種維護系統面板總成的體積可為約2m3。預期的是,維護系統面板總成之各種實施例可具有約1m3之體積,而在維護 系統面板總成之各種實施例中,該體積可為約10m3。對於氣體包體總成之各種實施例,諸如圖29之氣體包體總成1010,框架構件總成區段可小於或等於氣體包體總成之總體積的約1%。在氣體包體總成之各種實施例中,框架構件總成區段可小於或等於氣體包體總成之總體積的約2%。在氣體包體總成之各種實施例中,框架構件總成區段可小於或等於氣體包體總成之總體積的約10%。對於氣體包體總成之各種實施例,框架構件總成區段可小於或等於氣體包體總成之總體積的約50%。 Figure 33 illustrates an expanded perspective view of a first intermediate maintenance system panel assembly 1230' depicting a gloved glove that is capped and has a glove. As shown, it is contemplated that the volume of various maintenance system panel assemblies, such as the first intermediate maintenance system panel assembly 1230', can be about 2 m3 . It is contemplated that various embodiments of the maintenance system panel assembly can have a volume of about 1 m 3 , while in various embodiments of the maintenance system panel assembly, the volume can be about 10 m 3 . For various embodiments of the gas inclusion body assembly, such as the gas inclusion body assembly 1010 of Figure 29, the frame member assembly section can be less than or equal to about 1% of the total volume of the gas inclusion body assembly. In various embodiments of the gas inclusion body assembly, the frame member assembly section can be less than or equal to about 2% of the total volume of the gas inclusion body assembly. In various embodiments of the gas inclusion body assembly, the frame member assembly section can be less than or equal to about 10% of the total volume of the gas inclusion body assembly. For various embodiments of the gas inclusion body assembly, the frame member assembly section can be less than or equal to about 50% of the total volume of the gas inclusion body assembly.

根據本教示之氣體包體總成及系統可具有在氣體包體總成內部的氣體循環及過濾系統。此內部過濾系統可具有在內部中之複數個風扇過濾單元,且可經組配來在內部中提供氣體的層流。該層流可在自內部之頂部至內部之底部的方向上,或在任何其他方向上。儘管藉由循環系統所產生之氣流無需為層狀的,但氣體之層流可用來確保內部中之氣體之徹底及完全的翻轉。氣體之層流亦可用來將紊流最小化,此紊流係不受歡迎的,因為其可導致環境中之粒子在此等紊流區域中聚集,從而阻礙過濾系統自環境中移除彼等粒子。此外,為了在內部中維持所需之溫度,可提供利用複數個熱交換器之熱調節系統,其例如與風扇或另一氣體循環裝置一起操作、相鄰或結合使用。氣體淨化迴路可經組配來使來自氣體包體總成之內部的氣體循環通過在包體外部的至少一個氣體淨化組件。就此而言,在氣體包體總成內部的過濾及循環系統與在氣體包體總成外部的氣體淨化迴路相結合,可在整個氣體包體總成中提供大致上低微粒的惰性氣體之連續循環,該惰性氣體具有大致上低含量之反應性物種。氣體淨化系統可經組配來維持不需要的成分之極低含量,該等成分例如有機溶劑及其蒸汽, 以及水、水蒸汽、氧氣及類似物。 The gas inclusion assembly and system in accordance with the present teachings can have a gas circulation and filtration system within the gas inclusion assembly. This internal filtration system can have a plurality of fan filtration units in the interior and can be configured to provide a laminar flow of gas in the interior. The laminar flow may be in the direction from the top of the interior to the bottom of the interior, or in any other direction. Although the gas stream produced by the circulatory system need not be layered, the laminar flow of gas can be used to ensure complete and complete inversion of the gas in the interior. The laminar flow of gas can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in such turbulent areas, thereby preventing the filtration system from removing them from the environment. particle. Furthermore, in order to maintain the desired temperature in the interior, a thermal conditioning system utilizing a plurality of heat exchangers, such as operating, adjacent or in combination with a fan or another gas circulation device, may be provided. The gas purification circuit can be assembled to circulate gas from the interior of the gas inclusion assembly through at least one gas purification component external to the enclosure. In this regard, the filtration and circulation system within the gas inclusion assembly, in combination with the gas purification circuit external to the gas inclusion assembly, provides continuous flow of substantially low particulate inert gas throughout the gas inclusion assembly. Circulating, the inert gas has a substantially low content of reactive species. Gas purification systems can be formulated to maintain very low levels of undesired components such as organic solvents and their vapors, And water, steam, oxygen and the like.

圖34A為展示氣體包體總成及系統2100之示意圖。氣體包體總成及系統2100之各種實施例可包含根據本教示之氣體包體總成1500、與氣體包體總成1500流體連通之氣體淨化迴路2130以及至少一個熱調節系統2140。另外,氣體包體總成之各種實施例可具有加壓惰性氣體再循環系統2169,該加壓惰性氣體再循環系統可供應惰性氣體來操作各種裝置,該等裝置諸如用於OLED列印系統之基板漂浮台。如隨後將更為詳細地討論,加壓惰性氣體再循環系統2169可利用壓縮機、鼓風機及兩者之組合作為用於惰性氣體再循環系統2169之各種實施例的源頭。另外,氣體包體總成及系統2100可具有在氣體包體總成及系統2100內部的過濾及循環系統(未圖示)。 FIG. 34A is a schematic diagram showing a gas inclusion assembly and system 2100. Various embodiments of the gas inclusion assembly and system 2100 can include a gas inclusion assembly 1500 in accordance with the present teachings, a gas purification circuit 2130 in fluid communication with the gas inclusion assembly 1500, and at least one thermal conditioning system 2140. Additionally, various embodiments of the gas inclusion assembly can have a pressurized inert gas recirculation system 2169 that can supply an inert gas to operate various devices, such as for OLED printing systems. The substrate floats. As will be discussed in greater detail later, the pressurized inert gas recirculation system 2169 can utilize a compressor, a blower, and a combination of both as a source for various embodiments of the inert gas recirculation system 2169. Additionally, the gas inclusion assembly and system 2100 can have a filtration and circulation system (not shown) within the gas inclusion assembly and system 2100.

對於根據本教示之氣體包體總成的各種實施例,管道之設計可將循環通過圖34A之氣體淨化迴路2130之惰性氣體與對於氣體包體總成之各種實施例係在內部被持續過濾及循環的惰性氣體分開。氣體淨化迴路2130包括出口線路2131,該出口線路係自氣體包體總成1500至溶劑移除組件2132,且隨後至氣體淨化系統2134。已淨化而不含溶劑及諸如氧氣及水蒸汽之其他反應性氣體物種的惰性氣體隨後經由入口線路2133被傳回至氣體包體總成1500。氣體淨化迴路2130亦可包括適當之導管及連接件以及感測器,例如氧氣、水蒸汽及溶劑蒸汽感測器。可在例如氣體淨化系統2134中單獨地提供或整合諸如風扇、鼓風機或馬達及類似物之氣體循環單元,以便使氣體循環通過氣體淨化迴路2130。根據氣體包體總成之各種實施例,儘管圖33中所展示之示意圖中將溶劑移除系統2132及氣體淨化系統 2134展示為獨立的單元,但溶劑移除系統2132及氣體淨化系統2134可作為單個淨化單元封裝在一起。熱調節系統2140可包括至少一個急冷器(chiller)2141,該急冷器可具有用於將冷卻劑循環至氣體包體總成中之流體出口線路2143以及用於將冷卻劑傳回至急冷器中之流體入口線路2145。 For various embodiments of the gas inclusion assembly in accordance with the present teachings, the conduit is designed to continuously filter the inert gas circulating through the gas purge circuit 2130 of FIG. 34A and the various embodiments of the gas inclusion assembly. The circulating inert gas is separated. The gas purification circuit 2130 includes an outlet line 2131 that is from the gas inclusion assembly 1500 to the solvent removal assembly 2132 and then to the gas purification system 2134. The inert gas that has been purified without solvent and other reactive gas species such as oxygen and water vapor is then passed back to the gas inclusion assembly 1500 via inlet line 2133. The gas purification circuit 2130 can also include suitable conduits and connections as well as sensors such as oxygen, water vapor, and solvent vapor sensors. A gas circulation unit such as a fan, a blower or a motor and the like may be separately provided or integrated in, for example, the gas purification system 2134 to circulate the gas through the gas purification circuit 2130. According to various embodiments of the gas inclusion assembly, although the solvent removal system 2132 and the gas purification system are illustrated in the schematic shown in FIG. 2134 is shown as a separate unit, but solvent removal system 2132 and gas purification system 2134 can be packaged together as a single purification unit. The thermal conditioning system 2140 can include at least one chiller 2141 that can have a fluid outlet line 2143 for circulating coolant into the gas inclusion assembly and for transferring coolant back to the chiller Fluid inlet line 2145.

圖34A之氣體淨化迴路2130可具有置放在氣體淨化系統2134上游之溶劑移除系統2132,以使得自氣體包體總成1500所循環之惰性氣體經由出口線路2131通過溶劑移除組件2132。根據各種實施例,溶劑移除系統2132可為溶劑截留系統,該系統係基於自通過圖34A之溶劑移除系統2132的惰性氣體吸附溶劑蒸汽。例如但不限於諸如活性炭、分子篩及類似物的吸附劑之一或多個床層可有效地移除多種有機溶劑蒸汽。對於氣體包體總成之各種實施例,在溶劑移除系統2132中可採用冷阱技術來移除溶劑蒸汽。如前面所提及,對於根據本教示之氣體包體總成的各種實施例,諸如氧氣、水蒸汽及溶劑蒸汽感測器之感測器可用來監測此等物種自連續循環通過氣體包體總成系統(諸如圖34之氣體包體總成系統2100)的惰性氣體之有效移除。溶劑移除系統之各種實施例可指示諸如活性炭、分子篩及類似物之吸附劑何時已達到容量,以使得可再生或替換吸附劑之該或該等床層。分子篩之再生可涉及加熱分子篩、使分子篩與合成氣體(forming gas)接觸,及其組合以及類似物。經組配來截留包括氧氣、水蒸汽及溶劑之各種物種的分子篩可藉由加熱及曝露於包含氫氣之合成氣體來再生,該合成氣體例如為包含約96%氮氣及4%氫氣之合成氣體,其中該等百分比係以體積計或以重量計。活性炭之實體再生可使用在惰性環境下加熱之類似程序來完成。 The gas purification circuit 2130 of FIG. 34A can have a solvent removal system 2132 disposed upstream of the gas purification system 2134 such that inert gas circulated from the gas inclusion assembly 1500 passes through the solvent removal assembly 2132 via the outlet line 2131. According to various embodiments, the solvent removal system 2132 can be a solvent retention system based on the inert gas adsorption solvent vapor from the solvent removal system 2132 of Figure 34A. One or more beds, such as, but not limited to, adsorbents such as activated carbon, molecular sieves, and the like, are effective to remove a variety of organic solvent vapors. For various embodiments of the gas inclusion assembly, a cold trap technique can be employed in the solvent removal system 2132 to remove solvent vapor. As mentioned previously, for various embodiments of gas inclusion assemblies in accordance with the present teachings, sensors such as oxygen, water vapor, and solvent vapor sensors can be used to monitor the continuous circulation of such species through the gas inclusion body. Effective removal of inert gas into a system, such as gas inclusion assembly system 2100 of Figure 34. Various embodiments of the solvent removal system can indicate when the adsorbent, such as activated carbon, molecular sieves, and the like, has reached capacity such that the bed or layers of adsorbent can be regenerated or replaced. Regeneration of the molecular sieve can involve heating the molecular sieve, contacting the molecular sieve with a forming gas, combinations thereof, and the like. Molecular sieves that are formulated to retain various species including oxygen, water vapor, and solvent can be regenerated by heating and exposure to a synthesis gas comprising hydrogen, such as a synthesis gas comprising about 96% nitrogen and 4% hydrogen. Wherein the percentages are by volume or by weight. The physical regeneration of activated carbon can be accomplished using a similar procedure for heating in an inert environment.

任何合適之氣體淨化系統可用於圖34A之氣體淨化迴路2130的氣體淨化系統2134。例如可自MBRAUN公司(Statham,New Hampshire)或Innovative Technology of Amesbury公司(Massachusetts)購得的氣體淨化系統可用於整合至本教示之氣體包體總成的各種實施例中。氣體淨化系統2134可用來淨化氣體包體總成及系統2100中之一或多種惰性氣體,例如淨化氣體包體總成中之整個氣體氣氛。如前面所提及,為了使氣體循環通過氣體淨化迴路2130,氣體淨化系統2134可具有氣體循環單元,諸如風扇、鼓風機或馬達以及類似物。就此而言,可取決於包體之體積來選擇氣體淨化系統,該體積可界定用於使惰性氣體移動通過氣體淨化系統之體積流率。對於具有體積達約4m3之氣體包體總成的氣體包體總成及系統之各種實施例;可使用可移動約84m3/h之氣體淨化系統。對於具有體積達約10m3之氣體包體總成的氣體包體總成及系統之各種實施例;可使用可移動約155m3/h之氣體淨化系統。對於體積介於約52-114m3之間的氣體包體總成之各種實施例,可使用一個以上的氣體淨化系統。 Any suitable gas purification system can be used with the gas purification system 2134 of the gas purification circuit 2130 of Figure 34A. Gas purification systems, such as those available from MBRAUN (Statham, New Hampshire) or Innovative Technology of Amesbury (Massachusetts), can be used in various embodiments of the gas inclusion assembly of the present teachings. The gas purification system 2134 can be used to purge the gas inclusion assembly and one or more inert gases in the system 2100, such as the entire gas atmosphere in the purge gas inclusion assembly. As mentioned previously, in order to circulate gas through the gas purification circuit 2130, the gas purification system 2134 may have a gas circulation unit such as a fan, a blower or a motor, and the like. In this regard, the gas purification system can be selected depending on the volume of the enclosure, which volume can define the volumetric flow rate for moving the inert gas through the gas purification system. For various embodiments of gas inclusion assemblies and systems having a gas inclusion body having a volume of up to about 4 m3 ; a gas purification system that can move about 84 m3 /h can be used. For various embodiments of gas inclusion assemblies and systems having a gas inclusion body having a volume of up to about 10 m 3 ; a gas purification system that can move about 155 m 3 /h can be used. For various embodiments of gas inclusion assemblies having a volume between about 52-114 m3 , more than one gas purification system can be used.

本教示之氣體淨化系統2134中可包括任何合適之氣體過濾器或淨化裝置。在一些實施例中,氣體淨化系統可包含兩個平行的淨化裝置,以使得該等裝置中之一者可自線路上取下以便進行維護,且另一裝置可用來繼續系統操作而不中斷。在一些實施例中,例如,氣體淨化系統可包含一或多個分子篩。在一些實施例中,氣體淨化系統可至少包含第一分子篩以及第二分子篩,以使得當該等分子篩中之一者變得雜質飽和時或另外被視為不足以有效地操作時,該系統可切換至另一分子篩,同時再生該飽和的或無效率的分子篩。可提供控制單元,此控制單元係用於確定每一 分子篩之操作效率,用於在不同分子篩之操作之間切換,用於再生一或多個分子篩,或用於其組合。如前面所提及,可再生及重複使用分子篩。 Any suitable gas filter or purification device can be included in the gas purification system 2134 of the present teachings. In some embodiments, the gas purification system can include two parallel purification devices such that one of the devices can be removed from the line for maintenance and another device can be used to continue system operation without interruption. In some embodiments, for example, the gas purification system can include one or more molecular sieves. In some embodiments, the gas purification system can include at least a first molecular sieve and a second molecular sieve such that when one of the molecular sieves becomes saturated with impurities or otherwise deemed insufficient for efficient operation, the system can Switch to another molecular sieve while regenerating the saturated or inefficient molecular sieve. A control unit is provided, which is used to determine each The operating efficiency of molecular sieves for switching between operations of different molecular sieves, for regenerating one or more molecular sieves, or for combinations thereof. As mentioned previously, molecular sieves can be regenerated and reused.

關於圖34A之熱調節系統2140,可提供至少一個流體急冷器2141,用來冷卻氣體包體總成及系統2100中之氣體氣氛。對於本教示之氣體包體總成的各種實施例,流體急冷器2141將冷卻的流體輸送至包體中之熱交換器,其中使惰性氣體通過在該包體內部之過濾系統。亦可為氣體包體總成及系統2100提供至少一個流體急冷器,用來冷卻由包封在氣體包體2100中之設備產生的熱量。例如但不限於,亦可為氣體包體總成及系統2100提供至少一個流體冷卻機,用來冷卻由OLED列印系統產生的熱量。熱調節系統2140可包含熱交換裝置或帕耳帖(Peltier)裝置,且可具有各種冷卻能力。例如,對於氣體包體總成及系統之各種實施例,急冷器可提供約2kW至約20kW之冷卻能力。流體急冷器1136及1138可急冷一或多種流體。在一些實施例中,該等流體急冷器可利用多種流體作為冷卻劑,例如但不限於作為熱交換流體的水、防凍劑、製冷劑及其組合。適當之無洩漏的鎖定連接件可用於連接相關聯之導管及系統組件。 With respect to the thermal conditioning system 2140 of Figure 34A, at least one fluid chiller 2141 can be provided for cooling the gas inclusion assembly and the gas atmosphere in the system 2100. For various embodiments of the gas inclusion assembly of the present teachings, fluid chiller 2141 delivers the cooled fluid to a heat exchanger in the enclosure, wherein the inert gas is passed through a filtration system internal to the enclosure. The gas inclusion assembly and system 2100 can also be provided with at least one fluid chiller for cooling the heat generated by the equipment enclosed in the gas enclosure 2100. For example, without limitation, the gas inclusion assembly and system 2100 can also be provided with at least one fluid cooler for cooling the heat generated by the OLED printing system. The thermal conditioning system 2140 can include a heat exchange device or a Peltier device and can have various cooling capabilities. For example, for various embodiments of gas inclusion assemblies and systems, the chiller can provide a cooling capacity of from about 2 kW to about 20 kW. Fluid chillers 1136 and 1138 can quench one or more fluids. In some embodiments, the fluid chillers can utilize a variety of fluids as a coolant, such as, but not limited to, water as a heat exchange fluid, antifreeze, refrigerant, and combinations thereof. A suitable leak-free locking connection can be used to connect the associated conduit and system components.

如關於圖23及圖24的氣體包體總成1000或關於圖29及圖30之氣體包體總成1010所描繪之氣體包體總成的各種實施例可具有界定第一體積之第一框架構件總成區段以及界定第二體積之第二框架構件總成區段,其中每一體積可與另一體積分開。對於圖23及圖24的氣體包體總成1000之各種實施例,或對於圖29及圖30之氣體包體總成1010,關於圖34A之氣體包體總成所描述之所有系統特徵可被包括作為此等實施例之系統特徵,此等實施例具有界定第一體積之第一框架構件總成區段以及界定第二 體積之第二框架構件總成區段,其中每一體積可與另一體積分開。另外,如圖34B中關於氣體總成及系統2100所描繪,對於具有界定第一體積之第一框架構件總成區段以及界定第二體積之第二框架構件總成區段的氣體包體總成之各種實施例,可使每一體積與氣體淨化迴路2130單獨流體連通。 Various embodiments, such as the gas inclusion assembly 1000 of FIGS. 23 and 24 or the gas inclusion assembly 10 depicted with respect to the gas inclusion assembly 1010 of FIGS. 29 and 30, can have a first frame defining a first volume A component assembly section and a second frame member assembly section defining a second volume, wherein each volume is separable from the other volume. For the various embodiments of the gas inclusion assembly 1000 of Figures 23 and 24, or for the gas inclusion assembly 1010 of Figures 29 and 30, all of the system features described with respect to the gas inclusion assembly of Figure 34A can be Included as a system feature of such embodiments, the embodiments have a first frame member assembly section defining a first volume and defining a second A second frame member assembly section of volume, wherein each volume can be separated from another volume. Additionally, as depicted in relation to gas assembly and system 2100 in Figure 34B, for a gas inclusion body having a first frame member assembly section defining a first volume and a second frame member assembly section defining a second volume In various embodiments, each volume can be separately in fluid communication with the gas purification circuit 2130.

如圖34B中所描繪,氣體包體總成及系統2100之氣體包體總成1500可具有界定第一體積之第一框架構件總成區段1500-S1及界定第二體積之第二框架構件總成區段1500-S2。若所有閥V1、V2、V3及V4打開,則氣體淨化迴路2130基本上如前面關於圖34A的氣體包體總成及系統1500所描述來操作。在V3及V4之封閉的情況下,僅第一框架構件總成區段1500-S1與氣體淨化迴路2130流體連通。此閥狀態可例如但不限於在需要第二框架構件總成區段1500-S2向大氣開放的維護處理期間密封地封閉第二框架構件總成區段1500-S2並藉此將其與框架構件總成區段1500-S1隔離開時使用。在V1及V2封閉的情況下,僅第二框架構件總成區段1500-S2與氣體淨化迴路2130流體連通。此閥狀態可例如但不限於在第二框架構件總成區段1500-S2已向大氣開放之後的該區段的復原期間使用。如前面所提及,對氣體淨化迴路2130之要求係針對氣體包體總成1500之總體積來規定的。因此,藉由將氣體淨化系統之資源專門用於諸如第二框架構件總成區段1500-S2的框架構件總成區段之復原,可大大減少復原時間,其中圖34B中描繪該第二框架構件總成區段之體積顯著小於氣體包體1500之總體積。 As depicted in Figure 34B, the gas inclusion assembly 1500 of the gas inclusion assembly and system 2100 can have a first frame member assembly section 1500-S1 defining a first volume and a second frame member defining a second volume. Assembly section 1500-S2. If all of the valves V 1, V 2, V 3 and V 4 is opened, the gas purification circuit 2130 operates substantially 1500 as previously described gas bag assembly and body of the system with respect to Figure 34A. In the case of V 3 and V 4 is closed, the only the first frame member and the assembly section 1500-S1 2130 gas purifying fluid circuit communication. This valve state may, for example, but not limited to, sealingly enclose the second frame member assembly section 1500-S2 during maintenance processing that requires the second frame member assembly section 1500-S2 to open to the atmosphere and thereby combine it with the frame member The assembly section 1500-S1 is used when it is isolated. At V 1 and V 2 closed case, only the second frame member and the assembly section 1500-S2 fluid circuit communication with gas purifier 2130. This valve state may be used, for example, but not limited to, during restoration of the section after the second frame member assembly section 1500-S2 has been opened to the atmosphere. As mentioned previously, the requirements for the gas purification circuit 2130 are specified for the total volume of the gas inclusion body assembly 1500. Thus, by utilizing the resources of the gas purification system exclusively for the restoration of the frame member assembly section, such as the second frame member assembly section 1500-S2, the recovery time can be greatly reduced, wherein the second frame is depicted in Figure 34B. The volume of the component assembly section is significantly less than the total volume of the gas enclosure 1500.

如圖35及圖36中所描繪,該或該等風扇過濾單元可經組配來提供通過內部之氣體的大致層流。根據本教示之氣體包體總成的各種實施例,一或多個風扇單元佈置成與氣體氣氛包體之第一內部表面相鄰,且 該或該等管道入口佈置成與氣體氣氛包體之第二對立內部表面相鄰。例如,氣體氣氛包體可包含內部天花板及底部內部外圍,該或該等風扇單元可佈置成與該內部天花板相鄰,且該或該等管道入口可包含佈置成與該底部內部外圍相鄰之複數個入口開口,該複數個入口開口係如圖15至圖17中所展示的管道系統(ductwork system)之一部分。 As depicted in Figures 35 and 36, the or the fan filter units can be assembled to provide a substantially laminar flow of gas through the interior. According to various embodiments of the gas inclusion assembly of the present teachings, one or more fan units are disposed adjacent to the first interior surface of the gas atmosphere enclosure, and The or each conduit inlet is disposed adjacent to a second opposing interior surface of the gas atmosphere enclosure. For example, the gas atmosphere enclosure can include an interior ceiling and a bottom interior perimeter, the or the fan unit can be disposed adjacent to the interior ceiling, and the or the conduit inlet can include an arrangement adjacent to the bottom interior perimeter A plurality of inlet openings are part of a ductwork system as shown in Figures 15-17.

圖35係沿根據本教示之各種實施例的氣體包體總成及系統2200之長度截取的橫截面圖。圖35之氣體包體總成及系統2200可包括:可封裝OLED列印系統50之氣體包體1500,以及氣體淨化系統2130(亦參見圖34)、熱調節系統2140、過濾及循環系統2150以及管道系統2170。熱調節系統2140可包括流體急冷器2141,該流體急冷器與急冷器出口線路2143及急冷器入口線路2145流體連通。經急冷之流體可退出流體急冷器2141,流過急冷器出口線路2143,且可被輸送至熱交換器,對於如圖35中所展示的氣體包體總成及系統之各種實施例,該等熱交換器可定位成靠近複數個風扇過濾單元中之每一者。可經由急冷器入口線路2145將流體自靠近風扇過濾單元之熱交換器傳回至急冷器2141,以便將流體維持在恆定之所需溫度。如前面所提及,急冷器出口線路2141及急冷器入口線路2143與複數個熱交換器流體連通,該複數個熱交換器包括第一熱交換器2142、第二熱交換器2144及第三熱交換器2146。根據如圖34中所展示之氣體包體總成及系統的各種實施例,第一熱交換器2142、第二熱交換器2144及第三熱交換器2146分別與過濾系統2150之第一風扇過濾單元2152、第二風扇過濾單元2154及第三風扇過濾單元2156熱連通。 35 is a cross-sectional view taken along the length of a gas enclosure assembly and system 2200 in accordance with various embodiments of the present teachings. The gas inclusion body assembly and system 2200 of FIG. 35 can include: a gas enclosure 1500 that can package the OLED printing system 50, and a gas purification system 2130 (see also FIG. 34), a thermal conditioning system 2140, a filtration and circulation system 2150, and Piping system 2170. The thermal conditioning system 2140 can include a fluid chiller 2141 that is in fluid communication with the chiller outlet line 2143 and the chiller inlet line 2145. The quenched fluid may exit the fluid chiller 2141, flow through the chiller outlet line 2143, and may be delivered to a heat exchanger, such as various embodiments of the gas inclusion assembly and system as shown in FIG. The heat exchanger can be positioned proximate to each of the plurality of fan filter units. Fluid may be passed back to the chiller 2141 via a chiller inlet line 2145 from a heat exchanger adjacent the fan filter unit to maintain the fluid at a constant desired temperature. As mentioned previously, the chiller outlet line 2141 and the chiller inlet line 2143 are in fluid communication with a plurality of heat exchangers including a first heat exchanger 2142, a second heat exchanger 2144, and a third heat. Switch 2146. According to various embodiments of the gas inclusion assembly and system as shown in FIG. 34, the first heat exchanger 2142, the second heat exchanger 2144, and the third heat exchanger 2146 are respectively filtered with the first fan of the filtration system 2150. The unit 2152, the second fan filter unit 2154, and the third fan filter unit 2156 are in thermal communication.

在圖35中,諸多箭頭描繪至各種風扇過濾單元及來自各種 風扇過濾單元之流動,且亦描繪管道系統2170中之流動,該管道系統包括如圖34之簡化示意圖中所描繪之第一管道導管2173及第二管道導管2174。第一管道導管2173可經由第一管道入口2171接收氣體,且可經由第一管道出口2175退出。類似地,第二管道導管2174可經由第二管道入口2172接收氣體,且可經由第二管道出口2176退出。另外,如圖34中所展示,管道系統2170藉由有效地界定空間2180來分離在內部再循環通過過濾系統2150之惰性氣體,該空間經由氣體淨化出口線路2131與氣體淨化系統2130流體連通。包括如圖15至圖17所描繪之管道系統的各種實施例之此循環系統提供大致層流,使紊流最小化,促進包體之內部中的氣體氣氛之循環、翻轉及顆粒物過濾,並且提供通過在氣體包體總成外部的氣體淨化系統之循環。 In Figure 35, many arrows are drawn to various fan filter units and from various The flow of the fan filtration unit, and also the flow in the piping system 2170, includes a first conduit conduit 2173 and a second conduit conduit 2174 as depicted in the simplified schematic of FIG. The first conduit conduit 2173 can receive gas via the first conduit inlet 2171 and can exit via the first conduit outlet 2175. Similarly, the second conduit conduit 2174 can receive gas via the second conduit inlet 2172 and can exit via the second conduit outlet 2176. Additionally, as shown in FIG. 34, the piping system 2170 separates the inert gas that is internally recirculated through the filtration system 2150 by effectively defining the space 2180, which is in fluid communication with the gas purification system 2130 via the gas purification outlet line 2131. The circulatory system including various embodiments of the piping system as depicted in Figures 15-17 provides a substantially laminar flow that minimizes turbulence, promotes circulation, inversion, and particulate filtration of the gaseous atmosphere within the interior of the enclosure, and provides The circulation through the gas purification system outside of the gas inclusion body assembly.

圖36係沿根據本教示之氣體包體總成的各種實施例之氣體包體總成及系統2300之長度截取的橫截面圖。與圖35之氣體包體總成2200相同的是,圖36之氣體包體總成系統2300可包括:可封裝OLED列印系統50之氣體包體1500,以及氣體淨化系統2130(亦參見圖34)、熱調節系統2140、過濾及循環系統2150以及管道系統2170。對於氣體包體總成2300之各種實施例,熱調節系統2140(其可包括與急冷器出口線路2143及急冷器入口線路2145流體連通之流體急冷器2141)可與複數個熱交換器流體連通,該複數個熱交換器例如為如圖36中所描繪之第一熱交換器2142及第二熱交換器2144。根據如圖36中所展示之氣體包體總成及系統的各種實施例,諸如第一熱交換器2142及第二熱交換器2144之各種熱交換器可藉由定位成靠近管道出口(諸如管道系統2170之第一管道出口2175及第二管道出口2176)而與循環的惰性氣體熱連通。就此而言,自管道入口(諸如管道 入口,諸如管道系統2170之第一管道入口2171及第二管道入口2172)所傳回以便進行過濾的惰性氣體可在分別循環通過例如圖36之過濾系統2150的第一風扇過濾單元2152、第二風扇過濾單元2154及第三風扇過濾單元2156之前得到熱調節。 36 is a cross-sectional view taken along the length of the gas inclusion assembly and system 2300 of various embodiments of the gas inclusion assembly in accordance with the present teachings. As with the gas inclusion assembly 2200 of FIG. 35, the gas inclusion assembly system 2300 of FIG. 36 can include a gas enclosure 1500 that can encapsulate the OLED printing system 50, and a gas purification system 2130 (see also FIG. 34). ), thermal conditioning system 2140, filtration and circulation system 2150, and piping system 2170. For various embodiments of the gas inclusion assembly 2300, the thermal conditioning system 2140 (which may include a fluid chiller 2141 in fluid communication with the chiller outlet line 2143 and the chiller inlet line 2145) may be in fluid communication with a plurality of heat exchangers, The plurality of heat exchangers are, for example, a first heat exchanger 2142 and a second heat exchanger 2144 as depicted in FIG. According to various embodiments of the gas inclusion assembly and system as shown in Figure 36, various heat exchangers, such as first heat exchanger 2142 and second heat exchanger 2144, can be positioned adjacent to the pipe outlet (such as a pipe) The first conduit outlet 2175 and the second conduit outlet 2176 of system 2170 are in thermal communication with the circulating inert gas. In this regard, from the pipe entrance (such as the pipe The inlet, such as the first conduit inlet 2171 and the second conduit inlet 2172 of the conduit system 2170, may be passed back through the first fan filter unit 2152, second, for example, through the filtration system 2150 of FIG. 36, respectively. The fan filter unit 2154 and the third fan filter unit 2156 are previously thermally adjusted.

如自圖35及圖36中展示通過包體之惰性氣體循環之方向的箭頭可看出,風扇過濾單元經組配來提供自包體之頂部向下,朝向底部的大致層流。例如,可自Flanders公司(Washington,North Carolina)或Envirco公司(Sanford,North Carolina)購得之風扇過濾單元可用於整合於根據本教示之氣體包體總成的各種實施例中。風扇過濾單元之各種實施例可經由每一單元交換約350立方呎每分鐘(CFM)至約700CFM之惰性氣體。如圖35及圖36中所展示,因為風扇過濾單元為並列佈置而非串列佈置,所以在包含複數個風扇過濾單元之系統中可交換的惰性氣體之量可與所使用之單元的數量成比例。在靠近包體之底部處,氣流被引向複數個管道入口,在圖35及圖36中將該複數個管道入口示意性地指示為第一管道入口2171及第二管道入口2172。如前面關於圖15至圖17所討論,將管道入口大致上定位於包體之底部以及引起氣體自上部風扇過濾單元的向下流動促進包體中之氣體氣氛的良好翻轉,並且促進整個氣體氣氛的徹底翻轉及通過氣體淨化系統的移動,該氣體淨化系統係結合該包體來使用的。藉由使氣體氣氛循環通過管道(該管道分離惰性氣流以便循環通過氣體淨化迴路2130)並且使用過濾及循環系統2150來促進包體中之氣體氣氛的層流及徹底翻轉,在氣體包體總成之各種實施例中可將反應性物種(諸如水及氧氣,以及溶劑中之每一者)中之每一者的含量維持在100ppm或更低,例如1ppm 或更低,例如0.1ppm或更低。 As can be seen from the arrows in the direction of the inert gas circulation of the inclusions as shown in Figures 35 and 36, the fan filter units are assembled to provide a substantially laminar flow from the top of the enclosure down toward the bottom. For example, a fan filter unit available from Flanders, Inc. (Washington, North Carolina) or Envirco (Sanford, North Carolina) can be used in various embodiments of the gas inclusion assembly in accordance with the present teachings. Various embodiments of the fan filter unit can exchange between about 350 cubic centimeters per minute (CFM) to about 700 CFM of inert gas via each unit. As shown in Figures 35 and 36, because the fan filter units are arranged side by side rather than in a tandem arrangement, the amount of inert gas that can be exchanged in a system comprising a plurality of fan filter units can be the same as the number of units used. proportion. Near the bottom of the enclosure, the airflow is directed to a plurality of conduit inlets, which are schematically indicated in Figures 35 and 36 as a first conduit inlet 2171 and a second conduit inlet 2172. As discussed above with respect to Figures 15-17, the conduit inlet is positioned substantially at the bottom of the enclosure and causes a downward flow of gas from the upper fan filtration unit to promote a good turnover of the gas atmosphere in the enclosure and promotes the overall gas atmosphere. The complete overturning and movement through the gas purification system is used in conjunction with the enclosure. The gas inclusion body assembly is circulated through a conduit (which separates the inert gas stream for circulation through the gas purification circuit 2130) and uses a filtration and circulation system 2150 to promote laminar flow and complete overturning of the gas atmosphere in the enclosure. The content of each of the reactive species (such as water and oxygen, and each of the solvents) can be maintained at 100 ppm or less, such as 1 ppm, in various embodiments. Or lower, for example 0.1 ppm or less.

根據用於OLED列印系統之氣體包體總成系統的各種實施例,可根據處理期間基板在列印系統中之實體位置來選擇風扇過濾單元之數量。因此,儘管圖35及圖36中展示3個風扇過濾單元,但風扇過濾單元之數量可變化。例如,圖37為沿氣體包體總成及系統2400之長度截取的橫截面圖,該氣體包體總成及系統與圖23及圖24以及圖29及圖30中所描繪之氣體包體總成及系統類似。氣體包體總成及系統2400可包括氣體包體總成1500,該氣體包體總成封裝支撐於底座1220上之OLED列印系統1050。OLED列印系統之基板漂浮台1054界定基板在基板之OLED列印期間可被移動通過系統2400所經過的行程。因此,氣體包體總成及系統2400之過濾系統2150具有適當數量之風扇過濾單元;該等風扇過濾單元被展示為2151-2155,對應於基板在處理期間通過OLED列印系統1050之實體行程。另外,圖37之示意性截面圖描繪氣體包體之各種實施例的輪廓塑造,此輪廓塑造可有效地減小OLED列印處理期間所需要之惰性氣體的體積,且同時提供對氣體包體1500之內部的輕鬆接取(在操作期間例如使用安裝於各種手套埠中之手套來遠程接取,或在維護操作之情況下藉由可移除之面板來直接接取)。 According to various embodiments of the gas inclusion assembly system for an OLED printing system, the number of fan filtration units can be selected based on the physical location of the substrate in the printing system during processing. Thus, although three fan filter units are shown in Figures 35 and 36, the number of fan filter units can vary. For example, FIG. 37 is a cross-sectional view taken along the length of the gas inclusion assembly and system 2400. The gas inclusion assembly and system are generally associated with the gas inclusions depicted in FIGS. 23 and 24 and FIGS. 29 and 30. The system is similar to the system. The gas inclusion assembly and system 2400 can include a gas inclusion assembly 1500 that encapsulates the OLED printing system 1050 supported on the base 1220. The substrate floating table 1054 of the OLED printing system defines the path that the substrate can be moved through the system 2400 during OLED printing of the substrate. Thus, the gas inclusion assembly and filtration system 2150 of system 2400 has an appropriate number of fan filtration units; these fan filtration units are shown as 2151-2155, corresponding to the physical travel of the substrate through the OLED printing system 1050 during processing. In addition, the schematic cross-sectional view of FIG. 37 depicts the contouring of various embodiments of a gas enclosure that effectively reduces the volume of inert gas required during the OLED printing process, while providing a gas inclusion 1500. Easy internal access (for remote access during operation, for example, using gloves installed in various gloves, or directly with removable panels for maintenance operations).

氣體包體總成及系統之各種實施例可將加壓惰性氣體再循環系統用於各種氣動操作型裝置及設備的操作。另外,如前面所討論,本教示之氣體包體總成的實施例可相對於外部環境維持在小幅正壓力下,例如但不限於約2mbarg至約8mbarg之間。在氣體包體總成系統中維持加壓惰性氣體再循環系統可具有挑戰性,因為其關於維持氣體包體總成及系統之 小幅正內部壓力而同時持續地引入加壓氣體至氣體包體總成及系統中提出了動態及持續平衡作用。此外,各種裝置及設備之可變的需求可產生本教示之各種氣體包體總成及系統之不規則壓力分佈。在此等條件下,對相對於外部環境保持在小幅正壓力下的氣體包體總成維持動態壓力平衡可提供正在進行的OLED列印處理之完整性。 Various embodiments of the gas inclusion assembly and system can utilize a pressurized inert gas recirculation system for operation of various pneumatically operated devices and equipment. Additionally, as discussed above, embodiments of the gas inclusion assembly of the present teachings can be maintained at a small positive pressure relative to the external environment, such as, but not limited to, between about 2 mbarg and about 8 mbarg. Maintaining a pressurized inert gas recirculation system in a gas inclusion assembly system can be challenging as it relates to maintaining a gas inclusion assembly and system A small positive internal pressure while continuously introducing pressurized gas into the gas inclusion assembly and system provides dynamic and sustained balancing. In addition, the variable requirements of various devices and devices can result in irregular pressure distributions for various gas inclusion assemblies and systems of the present teachings. Under these conditions, maintaining a dynamic pressure balance of the gas inclusion assembly maintained at a small positive pressure relative to the external environment provides the integrity of the ongoing OLED printing process.

如圖38中所展示,氣體包體總成及系統3000之各種實施例可具有外部氣體迴路2500,該外部氣體迴路用於整合及控制惰性氣體源2509及清潔乾燥空氣(CDA)源2512,以便用於氣體包體總成及系統3000之操作的各方面。一般技藝人士將瞭解的是,氣體包體總成及系統3000亦可包括內部粒子過濾及氣體循環系統之各種實施例以及如前面所描述之外部氣體淨化系統的各種實施例。除了用於整合及控制惰性氣體源2509及CDA源2512之外部迴路2500,氣體包體總成及系統3000亦可具有壓縮機迴路2160,該壓縮機迴路可供應惰性氣體,用來操作可佈置於氣體包體總成及系統3000之內部中的各種裝置及設備。 As shown in FIG. 38, various embodiments of the gas inclusion assembly and system 3000 can have an external gas circuit 2500 for integrating and controlling the inert gas source 2509 and the clean dry air (CDA) source 2512 so that Various aspects of the operation of the gas inclusion assembly and system 3000. One of ordinary skill in the art will appreciate that the gas inclusion assembly and system 3000 can also include various embodiments of internal particle filtration and gas circulation systems as well as various embodiments of external gas purification systems as previously described. In addition to the external circuit 2500 for integrating and controlling the inert gas source 2509 and the CDA source 2512, the gas inclusion assembly and system 3000 can also have a compressor circuit 2160 that can supply an inert gas for operation to be placed Various devices and equipment in the interior of the gas inclusion assembly and system 3000.

圖38之壓縮機迴路2160可包括被組配成流體連通之壓縮機2162、第一累積器2164及第二累積器2168。壓縮機2162可經組配來將自氣體包體總成1500抽出之惰性氣體壓縮至所需壓力。壓縮機迴路2160之入口側可通過線路2503經由氣體包體總成出口2501與氣體包體總成1500流體連通,該線路具有閥2505及止回閥2507。壓縮機迴路2160可經由外部氣體迴路2500在壓縮機迴路2160之出口側上與氣體包體總成1500流體連通。累積器2164可佈置於壓縮機2162與壓縮機迴路2160與外部氣體迴路2500之接點之間,且可經組配來產生5psig或更高之壓力。由於壓縮機活塞在約 60Hz下循環,第二累積器2168可位於壓縮機迴路2160中以便提供阻尼波動。對於壓縮機迴路2160之各種實施例,第一累積器2164可具有在約80加侖至約160加侖之間的容量,而第二累積器可具有在約30加侖至約60加侖之間的容量。根據氣體包體總成及系統3000之各種實施例,壓縮機2162可為零入侵壓縮機。各種類型之零入侵壓縮機可在不使大氣氣體洩漏至本教示之氣體包體總成及系統的各種實施例中的情況下操作。例如在利用需要壓縮之惰性氣體的各種裝置及設備之OLED列印處理中,零入侵壓縮機之各種實施例可連續運行。 The compressor circuit 2160 of FIG. 38 can include a compressor 2162, a first accumulator 2164, and a second accumulator 2168 that are configured to be in fluid communication. Compressor 2162 can be assembled to compress the inert gas withdrawn from gas inclusion assembly 1500 to the desired pressure. The inlet side of compressor circuit 2160 can be in fluid communication with gas enclosure assembly 1500 via line 2503 via gas enclosure assembly outlet 2501 having valve 2505 and check valve 2507. The compressor circuit 2160 can be in fluid communication with the gas inclusion body assembly 1500 on the outlet side of the compressor circuit 2160 via an external gas circuit 2500. The accumulator 2164 can be disposed between the compressor 2162 and the junction of the compressor circuit 2160 and the external gas circuit 2500 and can be assembled to produce a pressure of 5 psig or higher. Since the compressor piston is about Circulating at 60 Hz, a second accumulator 2168 can be located in the compressor circuit 2160 to provide damping ripple. For various embodiments of the compressor circuit 2160, the first accumulator 2164 can have a capacity of between about 80 gallons to about 160 gallons, and the second accumulator can have a capacity of between about 30 gallons to about 60 gallons. According to various embodiments of the gas inclusion assembly and system 3000, the compressor 2162 can zero invade the compressor. Various types of zero intrusion compressors can operate without exposing atmospheric gases to the various embodiments of the gas inclusion assemblies and systems of the present teachings. Various embodiments of the zero-invasive compressor can operate continuously, for example, in OLED printing processes utilizing various devices and equipment that require compressed inert gas.

累積器2164可經組配來接收及累積來自壓縮機2162的壓縮之惰性氣體。累積器2164可提供氣體包體總成1500中所需要的壓縮之惰性氣體。例如,累積器2164可提供氣體來維持氣體包體總成1500之各種組件的壓力,該等組件諸如但不限於氣動機器人、基板漂浮台、空氣軸承、空氣套管、壓縮氣體工具、氣動致動器及其組合中之一或多者。如圖38中關於氣體包體總成及系統3000所展示,氣體包體總成1500可具有包封在其中之OLED列印系統50。如圖24及圖30中所展示,OLED列印系統50可藉由花崗岩台70支撐且可包括基板漂浮台54,該基板漂浮台用於將基板傳送至列印頭腔室中之位置中並且在OLED列印處理期間支撐基板。另外,可使用支撐於橋56上之空氣軸承58來代替例如線性機械軸承。對於本教示之氣體包體及系統的各種實施例,多種氣動操作型裝置及設備之使用可提供低粒子生成性能並且具有低維護性。壓縮機迴路2160可經組配來連續地供應加壓惰性氣體至氣體包體設備3000之各種裝置及設備中。除了加壓惰性氣體的供應之外,利用空氣軸承技術的OLED列印系統50之基板漂浮台54 亦利用真空系統2550,當閥2554處於打開位置時,該真空系統經由線路2552與氣體包體總成1500連通。 The accumulator 2164 can be assembled to receive and accumulate compressed inert gas from the compressor 2162. The accumulator 2164 can provide the compressed inert gas required in the gas inclusion assembly 1500. For example, the accumulator 2164 can provide gas to maintain the pressure of various components of the gas enclosure assembly 1500 such as, but not limited to, a pneumatic robot, a substrate float table, an air bearing, an air casing, a compressed gas tool, pneumatic actuation One or more of the devices and their combinations. As shown with respect to gas inclusion assembly and system 3000 in FIG. 38, gas inclusion assembly 1500 can have an OLED printing system 50 encased therein. As shown in Figures 24 and 30, the OLED printing system 50 can be supported by a granite table 70 and can include a substrate floating table 54 for transferring the substrate into a position in the printhead chamber and The substrate is supported during the OLED printing process. Alternatively, an air bearing 58 supported on the bridge 56 can be used instead of, for example, a linear mechanical bearing. For various embodiments of the gas enclosures and systems of the present teachings, the use of a variety of pneumatically operated devices and devices provides low particle generation performance and low maintenance. The compressor circuit 2160 can be assembled to continuously supply pressurized inert gas to various devices and equipment of the gas enclosure apparatus 3000. In addition to the supply of pressurized inert gas, the substrate floating platform 54 of the OLED printing system 50 utilizing air bearing technology Vacuum system 2550 is also utilized that is in communication with gas enclosure assembly 1500 via line 2552 when valve 2554 is in the open position.

根據本教示之加壓惰性氣體再循環系統可具有如圖38中關於壓縮機迴路2160所展示之壓力控制型旁通迴路2165,該旁通迴路用來補償在使用期間對加壓氣體之可變的需求,藉此為本教示之氣體包體總成及系統的各種實施例提供動態平衡。對於根據本教示之氣體包體總成及系統的各種實施例,旁通迴路可在不中斷或改變包體1500中之壓力的情況下維持累積器2164中的恆定壓力。旁通迴路2165可具有位於旁通迴路2165之入口側上的第一旁通入口閥2161,除非使用旁通迴路2165,否則該第一旁通入口閥係封閉的。旁通迴路2165亦可具有可在第二閥2163封閉時使用的背壓調節器。旁通迴路2165可具有佈置於旁通迴路2165之出口側的第二累積器2168。對於利用零入侵壓縮機之壓縮機迴路2160的各種實施例,旁通迴路2165可補償在氣體包體總成及系統之使用期間隨著時間的過去可能發生的少量壓力偏差。當旁通入口閥2161係處於打開位置時,旁通迴路2165可在旁通迴路2165之入口側上與壓縮機迴路2160流體連通。當旁通入口閥2161打開時,若氣體包體總成1500之內部中不需要來自壓縮機迴路2160之惰性氣體,則可使經由旁通迴路2165分流之惰性氣體再循環至壓縮機。壓縮機迴路2160經組配成當累積器2164中之惰性氣體的壓力超出預先設定之臨界壓力時,經由旁通迴路2165來分流惰性氣體。累積器2164的預先設定之臨界壓力在至少約1立方呎每分鐘(cfm)之流率下可介於約25psig至約200psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約50psig至約150psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約 75psig至約125psig之間,或在至少約1立方呎每分鐘(cfm)之流率下可介於約90psig至約95psig之間。 The pressurized inert gas recirculation system in accordance with the present teachings can have a pressure controlled bypass circuit 2165 as shown in Fig. 38 with respect to compressor circuit 2160, which is used to compensate for variable pressure of pressurized gas during use. The need to provide dynamic balancing of the various embodiments of the gas inclusion assembly and system taught herein. For various embodiments of the gas inclusion assembly and system in accordance with the present teachings, the bypass circuit can maintain a constant pressure in the accumulator 2164 without interrupting or changing the pressure in the enclosure 1500. The bypass circuit 2165 can have a first bypass inlet valve 2161 located on the inlet side of the bypass circuit 2165, unless the bypass circuit 2165 is used, the first bypass inlet valve is closed. The bypass circuit 2165 can also have a back pressure regulator that can be used when the second valve 2163 is closed. The bypass circuit 2165 can have a second accumulator 2168 disposed on the outlet side of the bypass circuit 2165. For various embodiments of a compressor circuit 2160 that utilizes a zero-intrusion compressor, the bypass circuit 2165 can compensate for a small amount of pressure deviation that may occur over time during use of the gas inclusion assembly and system. When the bypass inlet valve 2161 is in the open position, the bypass circuit 2165 can be in fluid communication with the compressor circuit 2160 on the inlet side of the bypass circuit 2165. When the bypass inlet valve 2161 is open, if the inert gas from the compressor circuit 2160 is not required in the interior of the gas inclusion assembly 1500, the inert gas split through the bypass circuit 2165 can be recirculated to the compressor. The compressor circuit 2160 is configured to split the inert gas via the bypass circuit 2165 when the pressure of the inert gas in the accumulator 2164 exceeds a predetermined threshold pressure. The pre-set critical pressure of the accumulator 2164 can be between about 25 psig to about 200 psig at a flow rate of at least about 1 cubic inch per minute (cfm), or at a flow rate of at least about 1 cubic inch per minute (cfm). Lower may be between about 50 psig to about 150 psig, or may be between about at least about 1 cubic inch per minute (cfm). Between 75 psig and about 125 psig, or between about 90 psig to about 95 psig at a flow rate of at least about 1 cubic inch per minute (cfm).

壓縮機迴路2160之各種實施例可利用除零侵入壓縮機以外的多種壓縮機,諸如變速壓縮機或可受控制而處於打開狀態或關閉狀態之壓縮機。如前面所討論,零入侵壓縮機確保無大氣反應性物種可被引入至氣體包體總成及系統中。因此,防止大氣反應性物種被引入至氣體包體總成及系統中之任何壓縮機組配可用於壓縮機迴路2160。根據各種實施例,氣體包體總成及系統3000之壓縮機2162可封裝在例如但不限於氣密式密封型殼體中。該殼體內部可組配成與惰性氣體源流體連通,該惰性氣體例如與形成用於氣體包體總成1500之惰性氣體氣氛的惰性氣體相同。對於壓縮機迴路2160之各種實施例,壓縮機2162可被控制在恆定之速度來維持恆定之壓力。在不利用零入侵壓縮機之壓縮機迴路2160的其他實施例中,可在達到最大臨界壓力時關閉壓縮機2162,且在達到最小臨界壓力時打開壓縮機2162。 Various embodiments of compressor circuit 2160 may utilize a variety of compressors other than zero intrusion compressors, such as variable speed compressors or compressors that may be controlled to be in an open or closed state. As discussed earlier, zero-intrusion compressors ensure that no atmospheric reactive species can be introduced into the gas inclusion assembly and system. Thus, any compressor assembly that prevents atmospheric reactive species from being introduced into the gas inclusion assembly and system can be used in the compressor circuit 2160. According to various embodiments, the gas inclusion assembly and compressor 2162 of system 3000 may be packaged in, for example, but not limited to, a hermetic sealed housing. The interior of the housing can be configured to be in fluid communication with an inert gas source, such as the inert gas forming the inert gas atmosphere for the gas inclusion assembly 1500. For various embodiments of the compressor circuit 2160, the compressor 2162 can be controlled at a constant speed to maintain a constant pressure. In other embodiments that do not utilize a zero intrusion compressor compressor circuit 2160, the compressor 2162 can be turned off when the maximum critical pressure is reached and the compressor 2162 is opened when the minimum critical pressure is reached.

在關於氣體包體總成及系統3100的圖39中,展示鼓風機迴路2190及鼓風機真空迴路2550,該等迴路係用於封裝在氣體包體總成1500中的OLED列印系統1050之基板漂浮台1054的操作。如前面關於壓縮機迴路2160所討論,鼓風機迴路2190可經組配來連續地供應加壓惰性氣體至基板漂浮台54。 In FIG. 39 regarding the gas inclusion assembly and system 3100, a blower circuit 2190 and a blower vacuum circuit 2550 are shown for use in a substrate floating platform of an OLED printing system 1050 packaged in a gas inclusion assembly 1500. 1054 operation. As discussed above with respect to compressor circuit 2160, blower circuit 2190 can be assembled to continuously supply pressurized inert gas to substrate floating table 54.

可利用加壓惰性氣體再循環系統之氣體包體總成及系統的各種實施例可具有利用多種加壓氣體源之各種迴路,諸如壓縮機、鼓風機及其組合中之至少一者。在關於氣體包體總成及系統3100之圖39中,壓縮 機迴路2160可與外部氣體迴路2500流體連通,該外部氣體迴路可用於為高消耗量歧管(high consumption manifold)2525以及低消耗量歧管2513供應惰性氣體。對於根據本教示的氣體包體總成及系統之各種實施例,如圖39中關於氣體包體總成及系統3000所展示,高消耗量歧管2525可用來供應惰性氣體至各種裝置及設備,諸如但不限於基板漂浮台、氣動機器人、空氣軸承、空氣套管及壓縮空氣工具及其組合中之一或多者。對於根據本教示之氣體包體總成及系統的各種實施例,低消耗量2513可用來供應惰性氣體至各種設備及裝置,諸如但不限於隔離體及氣動致動器及其組合中之一或多者。 Various embodiments of gas inclusion assemblies and systems that may utilize a pressurized inert gas recirculation system may have various circuits utilizing a plurality of pressurized gas sources, such as at least one of a compressor, a blower, and combinations thereof. In Figure 39 on the gas inclusion assembly and system 3100, compression The machine circuit 2160 can be in fluid communication with an external gas circuit 2500 that can be used to supply an inert gas to the high consumption manifold 2525 and the low consumption manifold 2513. For various embodiments of the gas inclusion assembly and system in accordance with the present teachings, as shown in FIG. 39 with respect to the gas inclusion assembly and system 3000, the high consumption manifold 2525 can be used to supply inert gases to various devices and equipment. One or more of such as, but not limited to, a substrate floating table, a pneumatic robot, an air bearing, an air cannula, and a compressed air tool, and combinations thereof. For various embodiments of gas inclusion assemblies and systems in accordance with the present teachings, low consumption 2513 can be used to supply inert gas to one of various devices and devices, such as, but not limited to, one of a separator and a pneumatic actuator, and combinations thereof. More.

對於氣體包體總成及系統3100之各種實施例,鼓風機迴路2190可用來供應加壓惰性氣體至基板漂浮台1054之各種實施例,而與外部氣體迴路2500流體連通之壓縮機迴路2160可用來供應加壓惰性氣體至例如但不限於氣動機器人、空氣軸承、空氣套管及壓縮氣體工具及其組合中之一或多者。除了加壓惰性氣體之供應之外,利用空氣軸承技術的OLED列印系統1050之基板漂浮台54亦利用鼓風機真空2550,該鼓風機真空在閥2554處於打開位置時經由線路2552與氣體包體總成1500連通。鼓風機迴路2190之殼體2192可維持:第一鼓風機2194,其用於供應加壓惰性氣體源至基板漂浮台1054;以及第二鼓風機2550,其在惰性氣體環境中充當用於基板漂浮台1054之真空源。對於基板漂浮台之各種實施例,可使得鼓風機適合於用作加壓惰性氣體源或真空源的屬性包括:例如但不限於鼓風機具有高可靠性;使鼓風機具有低維護性,具有變速控制且具有廣泛之流量體積;各種實施例能夠提供介於約100m3/h至約2,500m3/h之間的體積流量。鼓風 機迴路2190之各種實施例可另外具有:位於鼓風機迴路2190之入口端的第一隔離閥2193;以及位於鼓風機迴路2190之出口端的止回閥2195及第二隔離閥2197。鼓風機迴路2190之各種實施例可具有:可調整閥2196,該可調整閥可為例如但不限於閘閥、蝶形閥或球形閥;以及熱交換器2198,其用於將自鼓風機總成2190至基板漂浮台系統1054之惰性氣體維持在所定義之溫度。 For various embodiments of the gas inclusion assembly and system 3100, the blower circuit 2190 can be used to supply various embodiments of pressurized inert gas to the substrate floatation station 1054, while the compressor circuit 2160 in fluid communication with the external gas circuit 2500 can be used to supply Pressurizing the inert gas to one or more of, for example, but not limited to, a pneumatic robot, an air bearing, an air casing, and a compressed gas tool, and combinations thereof. In addition to the supply of pressurized inert gas, the substrate floating table 54 of the OLED printing system 1050 utilizing air bearing technology also utilizes a blower vacuum 2550 that is coupled to the gas inclusion assembly via line 2552 when valve 2554 is in the open position. 1500 connected. The housing 2192 of the blower circuit 2190 can maintain: a first blower 2194 for supplying a source of pressurized inert gas to the substrate floatation stage 1054; and a second blower 2550 that acts as a substrate floating platform 1054 in an inert gas environment Vacuum source. For various embodiments of the substrate floating table, attributes that may be suitable for use as a source of pressurized inert gas or vacuum source include, for example, but not limited to, a blower having high reliability; providing a low maintenance of the blower, having variable speed control and having the broad flow volume; various embodiments can be provided between about 100m 3 / h to a volume flow rate of between about 2,500m 3 / h. Various embodiments of the blower circuit 2190 can additionally have: a first isolation valve 2193 at the inlet end of the blower circuit 2190; and a check valve 2195 and a second isolation valve 2197 at the outlet end of the blower circuit 2190. Various embodiments of the blower circuit 2190 can have: an adjustable valve 2196, which can be, for example, but not limited to, a gate valve, a butterfly valve, or a ball valve; and a heat exchanger 2198 for use from the blower assembly 2190 to The inert gas of the substrate floating table system 1054 is maintained at a defined temperature.

圖39描繪亦在圖38中展示的外部氣體迴路2500,該外部氣體迴路用於整合及控制惰性氣體源2509及清潔乾燥空氣(CDA)源2512,以便用於圖38之氣體包體總成及系統3000及圖39之氣體包體總成及系統3100之操作的各方面。圖38及圖39之外部氣體迴路2500可包括至少四個機械閥。此等閥包含第一機械閥2502、第二機械閥2504、第三機械閥2506及第四機械閥2508。此等各種閥在各種流動線路中係位於允許對以下兩者進行控制的位置中:惰性氣體,例如,諸如氮氣、稀有氣體中之任一者及其任一組合;以及空氣源,諸如清潔乾燥空氣(CDA)。封裝惰性氣體線路2510自封裝惰性氣體源2509延伸。封裝惰性氣體線路2510作為低消耗量歧管線路2512繼續線性地延伸,該低消耗量歧管線路與低消耗量歧管2513流體連通。交叉線第一區段2514自第一流量接點2516延伸,該第一流量接點位於封裝惰性氣體線路2510、低消耗量歧管線路2512及交叉線第一區段2514之相交處。交叉線第一區段2514延伸至第二流量接點2518。壓縮機惰性氣體線路2520自壓縮機迴路2160之累積器2164延伸,且在第二流量接點2518處終止。CDA線路2522自CDA源2512延伸,且作為高消耗量歧管線路2524繼續延伸,該高消耗量歧管線路與高消耗量歧管2525流體連通。 第三流量接點2526定位在交叉線第二區段2528、清潔乾燥空氣線路2522及高消耗量歧管線路2524之相交處。交叉線第二區段2528自第二流量接點2518延伸至第三流量接點2526。 Figure 39 depicts an external gas circuit 2500, also shown in Figure 38, for integrating and controlling an inert gas source 2509 and a clean dry air (CDA) source 2512 for use with the gas inclusion assembly of Figure 38 and Various aspects of the operation of system 3000 and gas inclusion assembly of FIG. 39 and system 3100. The outer gas circuit 2500 of Figures 38 and 39 can include at least four mechanical valves. The valves include a first mechanical valve 2502, a second mechanical valve 2504, a third mechanical valve 2506, and a fourth mechanical valve 2508. These various valves are located in various flow lines in a position that allows control of either an inert gas, such as, for example, nitrogen, a noble gas, any combination thereof, and an air source, such as a clean dry Air (CDA). Packaged inert gas line 2510 extends from packaged inert gas source 2509. The packaged inert gas line 2510 continues to linearly extend as a low consumption manifold line 2512 that is in fluid communication with the low consumption manifold 2513. The first line segment 2514 of the cross line extends from the first flow contact 2516, which is located at the intersection of the package inert gas line 2510, the low consumption manifold line 2512, and the first line 2514 of the intersection line. The first line segment 2514 of the cross line extends to the second flow contact 2518. Compressor inert gas line 2520 extends from accumulator 2164 of compressor circuit 2160 and terminates at second flow contact 2518. The CDA line 2522 extends from the CDA source 2512 and continues to extend as a high consumption manifold line 2524 that is in fluid communication with the high consumption manifold 2525. The third flow contact 2526 is positioned at the intersection of the cross line second section 2528, the clean dry air line 2522, and the high consumption manifold line 2524. The cross line second section 2528 extends from the second flow contact 2518 to the third flow contact 2526.

關於外部氣體迴路2500之描述且參考圖40,以下係一些各種操作模式之概述,其中圖40係用於氣體包體總成及系統之各種操作模式之閥位置的表。 With respect to the description of the external gas circuit 2500 and with reference to Figure 40, the following is a summary of some of the various modes of operation, with Figure 40 being a table of valve positions for various operating modes of the gas inclusion assembly and system.

圖40之表指示一種處理模式,其中閥狀態產生僅惰性氣體壓縮機操作模式。在如圖38中所展示且在圖40中關於閥狀態所指示之處理模式中,第一機械閥2502及第三機械閥2506處於封閉組配。第二機械閥2504及第四機械閥2508處於打開組配。由於此等特定的閥組配,允許壓縮之惰性氣體流向低消耗量歧管2513且流向高消耗量歧管2525。在正常操作下,阻止來自封裝惰性氣體源之惰性氣體及來自CDA源之清潔乾燥空氣流向低消耗量歧管2513及高消耗量歧管2525中之任一者。 The table of Figure 40 indicates a mode of operation in which the valve state produces only an inert gas compressor mode of operation. In the processing mode as shown in FIG. 38 and indicated in FIG. 40 with respect to the valve state, the first mechanical valve 2502 and the third mechanical valve 2506 are in a closed assembly. The second mechanical valve 2504 and the fourth mechanical valve 2508 are in an open assembly. Due to these particular valve combinations, the compressed inert gas is allowed to flow to the low consumption manifold 2513 and to the high consumption manifold 2525. Under normal operation, the inert gas from the packaged inert gas source and the clean dry air from the CDA source are prevented from flowing to either the low consumption manifold 2513 and the high consumption manifold 2525.

如圖40中所指示且參考圖39,存在用於維護及復原之一系列閥狀態。本教示之氣體包體總成及系統的各種實施例可不時地需要維護,且另外需要從系統故障中復原。在此特定模式中,第二機械閥2504及第四機械閥2508處於封閉組配。第一機械閥2502及第三機械閥2506處於打開組配。封裝惰性氣體源及CDA源提供惰性氣體,該惰性氣體將由低消耗量歧管2513供應至為低消耗量且另外具有在復原期間將難以有效地沖洗之無效體積之彼等組件。此等組件之實例包括氣動致動器。對比而言,在維護期間可藉由高消耗量歧管2525、CDA供應至為高消耗量之彼等組件。使用閥2504、2508、2530隔離壓縮機防止了諸如氧氣及水蒸汽之反應性物 種污染壓縮機及累積器中之惰性氣體。 As indicated in Figure 40 and with reference to Figure 39, there is a series of valve states for maintenance and recovery. Various embodiments of the gas inclusion assemblies and systems of the present teachings may require maintenance from time to time and additionally require recovery from system failure. In this particular mode, the second mechanical valve 2504 and the fourth mechanical valve 2508 are in a closed assembly. The first mechanical valve 2502 and the third mechanical valve 2506 are in an open assembly. The packaged inert gas source and CDA source provide an inert gas that will be supplied by the low consumption manifold 2513 to those components that are low in consumption and additionally have an ineffective volume that would be difficult to effectively flush during recovery. Examples of such components include pneumatic actuators. In contrast, the high-volume manifold 2525, CDA can be supplied to their components for high consumption during maintenance. Isolating the compressor with valves 2504, 2508, 2530 prevents reactants such as oxygen and water vapor An inert gas in a contaminated compressor and accumulator.

在維護或復原已完成之後,必須經由若干週期來沖洗氣體包體總成,直至諸如氧氣及水的各種反應性大氣物種中之每一物種已達到足夠低的含量,例如100ppm或更低,例如10ppm或更低,1.0ppm或更低或者0.1ppm或更低。如圖40中所指示且參考圖39,在沖洗模式期間,第三機械閥2506封閉且第五機械閥2530亦處於封閉組配。第一機械閥2502、第二機械閥2504及第四機械閥2508處於打開組配。由於此特定的閥組配,僅允許封裝惰性氣體流動且允許其流向低消耗量歧管2513及高消耗量歧管2525兩者。 After the maintenance or recovery has been completed, the gas inclusion body assembly must be flushed through several cycles until each of the various reactive atmospheric species, such as oxygen and water, has reached a sufficiently low level, such as 100 ppm or less, for example 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less. As indicated in Figure 40 and with reference to Figure 39, during the flush mode, the third mechanical valve 2506 is closed and the fifth mechanical valve 2530 is also in a closed assembly. The first mechanical valve 2502, the second mechanical valve 2504, and the fourth mechanical valve 2508 are in an open assembly. Due to this particular valve assembly, only the package inert gas flow is allowed and allowed to flow to both the low consumption manifold 2513 and the high consumption manifold 2525.

如圖40中所指示且參考圖38,「無流量」模式及洩漏測試模式係根據需要來使用之模式。「無流量」模式係具有如下閥狀態組配之模式,其中第一機械閥2502、第二機械閥2504、第三機械閥2506及第四機械閥2508均處於封閉組配。此封閉組配產生系統之「無流量」模式,在此模式中無來自惰性氣體源、CDA源或壓縮機源中之任一者的氣體可到達低消耗量歧管2513或高消耗量歧管2525。當系統不使用且可長期保持閒置時,此「無流量模式」可為有用的。洩漏測試模式可用於偵測系統中之洩漏。洩漏測試模式使用專門壓縮之惰性氣體,該惰性氣體將系統與圖39之高消耗量歧管2525隔離開,以便對低消耗量歧管2513之低消耗量組件(諸如隔離體及氣動致動器)進行洩漏檢查。在此測試模式中,第一機械閥2502、第三機械閥2506及第四機械閥2508均處於封閉組配。僅第二機械閥2504處於打開組配。因此,壓縮氮氣能夠自壓縮機惰性氣體源2519流向低消耗量歧管2513,且不存在流向高消耗量歧管2525之氣體。 As indicated in FIG. 40 and with reference to FIG. 38, the "no flow" mode and the leak test mode are modes that are used as needed. The "no flow" mode has a valve state combination mode in which the first mechanical valve 2502, the second mechanical valve 2504, the third mechanical valve 2506, and the fourth mechanical valve 2508 are all in a closed configuration. This closed assembly produces a "no flow" mode in which no gas from any of the inert gas source, CDA source or compressor source can reach the low consumption manifold 2513 or the high consumption manifold 2525. This "no flow mode" can be useful when the system is not in use and can remain idle for long periods of time. The leak test mode can be used to detect leaks in the system. The leak test mode uses a specially compressed inert gas that isolates the system from the high consumption manifold 2525 of Figure 39 for low consumption components of low consumption manifold 2513 (such as separators and pneumatic actuators) ) Perform a leak check. In this test mode, the first mechanical valve 2502, the third mechanical valve 2506, and the fourth mechanical valve 2508 are all in a closed assembly. Only the second mechanical valve 2504 is in the open assembly. Thus, compressed nitrogen can flow from the compressor inert gas source 2519 to the low consumption manifold 2513 and there is no gas flowing to the high consumption manifold 2525.

漂浮台之各種實施例可在本教示之氣體包體總成及系統的各種實施例中之任一者中用來實現諸如OLED平板顯示器基板之負載之穩定輸送。預期的是,無摩擦漂浮台可在本教示之惰性氣體包體的各種實施例中之任一者提供諸如OLED基板之負載的穩定輸送以便進行列印。 Various embodiments of the floating station can be used to achieve stable delivery of loads such as OLED flat panel display substrates in any of the various embodiments of the gas inclusion assembly and system of the present teachings. It is contemplated that the frictionless floatation station can provide stable delivery of loads such as OLED substrates for printing in any of the various embodiments of the inert gas inclusions of the present teachings.

例如,在圖1中,氣體包體總成及系統2000可包括氣體包體總成1500,其具有入口閘1512及出口閘1522,該等閘用於將諸如OLED平板顯示器基板之基板移進及移出氣體包體系統2000。在圖37中,氣體包體總成及系統2400可具有所展示之支撐於底座1200上的氣體包體總成1500,該氣體包體總成可封裝OLED列印系統50。OLED列印系統50之基板漂浮台54界定基板(未圖示)在OLED平板顯示器基板之噴墨列印期間可被移動通過惰性氣體包體總成及系統2400所經過的行程。如前面關於圖38所討論,氣體包體總成及系統之各種實施例可具有外部迴路,該外部迴路包括:例如但不限於可提供在漂浮台之操作中所使用之加壓惰性氣體及真空的壓縮機迴路以及真空源。如前面關於圖39所討論,利用鼓風機技術的外部迴路之各種實施例可提供用來操作漂浮台之加壓惰性氣體以及真空源。 For example, in FIG. 1, gas inclusion assembly and system 2000 can include a gas inclusion assembly 1500 having an inlet gate 1512 and an outlet gate 1522 for moving substrates such as OLED flat panel substrates into and out. The gas inclusion system 2000 is removed. In FIG. 37, the gas inclusion assembly and system 2400 can have a gas inclusion assembly 1500 as shown mounted on a base 1200 that can encapsulate the OLED printing system 50. The substrate floating table 54 of the OLED printing system 50 defines a path through which the substrate (not shown) can be moved through the inert gas inclusion assembly and system 2400 during inkjet printing of the OLED flat panel display. As discussed above with respect to FIG. 38, various embodiments of the gas inclusion assembly and system can have an external circuit including, for example, but not limited to, pressurized inert gas and vacuum that can be used in the operation of the floating table. Compressor circuit as well as vacuum source. As discussed above with respect to Figure 39, various embodiments of the external circuit utilizing blower technology can provide pressurized inert gas and a vacuum source for operating the floating table.

如前面所討論,本教示之氣體包體總成及系統的各種實施例可處理一系列大小的OLED平板顯示器基板,範圍從比尺寸約為61cm x 72cm之第3.5代基板更小開始,並且漸進為更高代的大小。預期的是,氣體包體總成及系統之各種實施例可處理尺寸約為130cm X 150cm之第5.5代母玻璃大小,以及尺寸約為195cm x 225cm之第7.5代,且每個基板可切割成八個42"平板或六個47”平板及更大。如前面所討論,第8.5代大約為 220cm x 250cm,且每個基板可切割成六個55”平板或八個46”平板。然而,基板代的大小不斷推進,以使得尺寸約為285cm x 305cm之當前可用的第10代不會是基板大小的終極代。另外,由基於玻璃之基板之使用所產生的術語所列舉之大小可適用於適合於在OLED列印中使用之任何材料的基板。因此,在本教示之氣體包體總成及系統的各種實施例中,存在列印期間需要穩定輸送的多種基板大小及材料。 As discussed above, various embodiments of the gas inclusion assembly and system of the present teachings can process a range of OLED flat panel display substrates, starting from smaller than the 3.5th generation substrate having a size of approximately 61 cm x 72 cm, and progressively. For the size of the higher generation. It is contemplated that various embodiments of the gas inclusion assembly and system can handle a 5.5th generation mother glass size of about 130 cm X 150 cm and a 7.5th generation size of about 195 cm x 225 cm, and each substrate can be cut into Eight 42" plates or six 47" plates and larger. As discussed earlier, the 8.5th generation is approximately 220cm x 250cm and each substrate can be cut into six 55" plates or eight 46" plates. However, the size of the substrate generation continues to advance so that the currently available 10th generation having a size of about 285 cm x 305 cm will not be the ultimate generation of substrate size. In addition, the sizing of terms derived from the use of glass-based substrates can be applied to substrates suitable for any material used in OLED printing. Thus, in various embodiments of the gas inclusion assembly and system of the present teachings, there are a variety of substrate sizes and materials that require stable delivery during printing.

在圖41中描繪根據本教示之各種實施例的漂浮台。當前技術之漂浮台700可具有區710,在該區中可經由複數個埠施加壓力及真空。具有壓力及真空控制之此區可有效地在區710與基板(未圖示)之間提供具有雙向剛度之流體彈簧(fluidic spring),藉此產生對基板與區710之間的間隙之實質控制。存在於負載與漂浮台表面之間的間隙被稱為懸浮高度(fly height)。圖41之漂浮台700的諸如區710之區可為諸如基板之負載提供可控制之懸浮高度,在該區中使用複數個壓力埠及真空埠產生具有雙向剛度之流體彈簧。 A floating station in accordance with various embodiments of the present teachings is depicted in FIG. The prior art floating station 700 can have a zone 710 in which pressure and vacuum can be applied via a plurality of turns. This zone with pressure and vacuum control effectively provides a fluidic spring with bi-directional stiffness between zone 710 and the substrate (not shown), thereby creating substantial control of the gap between substrate and zone 710. . The gap existing between the load and the surface of the floating table is referred to as the fly height. The region of the floating table 700 of Figure 41, such as zone 710, can provide a controllable levitation height for loads such as substrates in which a plurality of pressure enthalpy and vacuum enthalpy are used to create a fluid spring having bi-directional stiffness.

靠近區710的分別係第一過渡區720及第二過渡區722,且隨後靠近第一過渡區720及第二過渡區722的分別係僅壓力區740及742。在該等過渡區中,壓力噴嘴與真空噴嘴之比率朝向僅壓力區逐漸增加,來提供自區710至區740及742之逐步過渡。如圖41中所指示,圖42描繪三個區之擴展視圖。對於例如如圖41中所描繪之基板漂浮台之各種實施例,僅壓力區740、742經描繪成由軌條結構組成。對於基板漂浮台之各種實施例,僅壓力區(諸如圖41之僅壓力區740、742)可由連續板(諸如關於圖41的壓力-真空區710所描繪之連續板)組成。 The first transition zone 720 and the second transition zone 722 are adjacent to the zone 710, respectively, and then the first transition zone 720 and the second transition zone 722 are respectively only the pressure zones 740 and 742. In such transition zones, the ratio of pressure nozzles to vacuum nozzles gradually increases toward the pressure zone only to provide a gradual transition from zone 710 to zones 740 and 742. As indicated in Figure 41, Figure 42 depicts an expanded view of three zones. For various embodiments, such as the substrate floating table depicted in Figure 41, only the pressure zones 740, 742 are depicted as being comprised of a rail structure. For various embodiments of the substrate floating table, only the pressure zone (such as the pressure zone only 740, 742 of Figure 41) may be comprised of a continuous plate (such as the continuous plate depicted with respect to the pressure-vacuum zone 710 of Figure 41).

對於如圖41中所描繪之漂浮台的各種實施例,壓力-真空區、過渡區與僅壓力區之間可存在基本上均勻的高度,以使得在容限內,三個區基本上位於一個平面中。一般技藝人士將瞭解的是,各種區之長度可變化。例如但不限於,為了提供尺度及比例感,對於各種基板,過渡區可為約400mm,而僅壓力區可為約2.5m,且壓力-真空區可為約800mm。 For various embodiments of the floating table as depicted in Figure 41, there may be a substantially uniform height between the pressure-vacuum zone, the transition zone and only the pressure zone such that within tolerance, the three zones are substantially one In the plane. One of ordinary skill will appreciate that the length of the various zones can vary. For example, without limitation, to provide a sense of scale and proportion, the transition zone can be about 400 mm for each substrate, and only the pressure zone can be about 2.5 m, and the pressure-vacuum zone can be about 800 mm.

在圖41中,僅壓力區740及742不提供具有雙向剛度之流體彈簧,且因此不提供區710可提供之控制。因此,負載在僅壓力區上方的懸浮高度通常大於基板在壓力-真空區上方的懸浮高度,以便在僅壓力區中允許足夠的高度,以使得負載將不會與漂浮台碰撞。例如但不限於,可能需要處理OLED面板基板在諸如區740及742的僅壓力區上方具有約150μ至約300μ之間的懸浮高度,且隨後在諸如區710的壓力-真空區上方具有約30μ至約50μ之間的懸浮高度。 In FIG. 41, only pressure zones 740 and 742 do not provide a fluid spring having bi-directional stiffness, and thus do not provide control that zone 710 can provide. Therefore, the levitation height of the load above only the pressure zone is typically greater than the levitation height of the substrate above the pressure-vacuum zone to allow sufficient height in only the pressure zone so that the load will not collide with the floating table. For example, without limitation, it may be desirable to process the OLED panel substrate to have a levitation height of between about 150[mu] and about 300[mu] above the pressure only regions, such as regions 740 and 742, and then have about 30 [mu] to above the pressure-vacuum region, such as region 710. A suspension height of between about 50μ.

對於漂浮台700之各種實施例,具有為所有區提供可變懸浮高度以及跨漂浮台之均勻高度的不同區之組合的結果為,當基板在漂浮台上方行進時可能發生基板撓曲。圖43A及圖43B描繪當基板760在漂浮台700上方行進時的基板撓曲。在圖43A中,當基板760在漂浮台700上方行進時,基板760之駐留於壓力-真空區710上方的部分具有第一懸浮高度FH1,而基板760之駐留於僅壓力區740上方的部分具有第二懸浮高度FH2,且基板760之駐留於過渡區720上方的部分具有可變懸浮高度。在圖43B中,當基板760在漂浮台700上方以相反方向行進時,基板760之駐留於壓力-真空區710上方的部分具有第一懸浮高度FH1,而基板760之駐留於僅壓力區742上方的部分具有第二懸浮高度FH2,且基板760之駐留於過渡區722 上方的部分可具有可變懸浮高度。因此,在基板150在漂浮台200上方的任一行進方向中,基板760中之撓曲顯而易見。 For various embodiments of the floating table 700, the result is a combination of different zones that provide variable levitation height for all zones and a uniform height across the floating table, as substrate deflection may occur as the substrate travels over the floating table. 43A and 43B depict substrate deflection as substrate 760 travels over floating table 700. Portion 710 having a first upper vacuum region levitation height FH 1, and the substrate 760 resides just above the pressure zone 740 - in FIG. 43A, when the substrate 760 travels over the floating station 700, the substrate 760 residing in the pressure There is a second levitation height FH 2 and the portion of the substrate 760 that resides above the transition zone 720 has a variable levitation height. In FIG 43B, when the substrate 760 travels in the opposite direction over the floating station 700, the substrate 760 residing on the pressure - vacuum region above the portion 710 having a first suspension height FH 1, the substrate 760 and the pressure zone 742 reside in only The upper portion has a second levitation height FH 2 and the portion of the substrate 760 that resides above the transition region 722 can have a variable levitation height. Thus, in any direction of travel of the substrate 150 above the floating table 200, the deflection in the substrate 760 is apparent.

在可封裝列印系統(該列印系統用於列印例如但不限於OLED顯示面板基板)的本教示之氣體包體總成及系統之各種實施例中,某種程度之基板撓曲可能對製造物品並無不利影響。然而,對於利用根據本教示之氣體包體總成及系統的列印處理之各種實施例,基板撓曲可對製造物品具有不利影響。 In various embodiments of the gas package assembly and system of the present teachings of a packageable printing system for printing, for example, but not limited to, an OLED display panel substrate, some degree of substrate deflection may be There is no adverse effect on the manufactured goods. However, for various embodiments utilizing the printing process of the gas inclusion assembly and system in accordance with the present teachings, substrate deflection can have a detrimental effect on the article of manufacture.

因此,如圖44中所描繪之漂浮台的各種實施例可具有可變過渡區高度,以便在基板在漂浮台上方移動時將諸如OLED平板顯示器基板之負載維持大致平坦。圖44描繪具有傾斜佈置的第一過渡區820及第二過渡區822,該等過渡區分別介於壓力-真空區810與第一僅壓力區840及第二僅壓力區842之間。第一過渡區820及第二過渡區822之傾斜佈置提供壓力-真空區810與第一僅壓力區840及第二僅壓力區842之間的高度差。如圖44中所描繪,在容限內,第一僅壓力區840及第二僅壓力區842基本上位於同一平面中,而壓力-真空區810位於與僅壓力區平行之平面中。由壓力-真空區810相對於第一僅壓力區840及第二僅壓力區842界定之基本上平行的平面偏移了一高度差,該高度差補償在各種區上方之懸浮高度的差。 Thus, various embodiments of the floating table as depicted in FIG. 44 can have a variable transition zone height to maintain a substantially flat load such as an OLED flat panel display substrate as the substrate moves over the floating table. 44 depicts a first transition zone 820 and a second transition zone 822 having a slanted arrangement between the pressure-vacuum zone 810 and the first pressure-only zone 840 and the second pressure-only zone 842, respectively. The slanted arrangement of the first transition zone 820 and the second transition zone 822 provides a height difference between the pressure-vacuum zone 810 and the first pressure-only zone 840 and the second pressure-only zone 842. As depicted in FIG. 44, within the tolerance, the first pressure only zone 840 and the second pressure only zone 842 are substantially in the same plane, while the pressure-vacuum zone 810 is in a plane parallel to the pressure zone only. The substantially parallel plane defined by the pressure-vacuum zone 810 relative to the first pressure-only zone 840 and the second pressure-only zone 842 is offset by a height difference that compensates for the difference in levitation height above the various zones.

如前面關於如圖41中所描繪之基板漂浮台之各種實施例所討論,在圖44中將僅壓力區840、842描繪成由軌條結構組成。對於基板漂浮台之各種實施例,僅壓力區(諸如圖44之僅壓力區840、842)可由連續板(諸如關於圖44的壓力-真空區810所描繪之連續板)組成。 As discussed above with respect to various embodiments of the substrate floating table as depicted in FIG. 41, only pressure zones 840, 842 are depicted in FIG. 44 as being comprised of a rail structure. For various embodiments of the substrate floating table, only the pressure zone (such as the pressure zone only 840, 842 of FIG. 44) may be comprised of a continuous plate (such as the continuous plate depicted with respect to the pressure-vacuum zone 810 of FIG. 44).

如圖45A及圖45B中所描繪,對於根據本教示之漂浮台700 的各種實施例,具有為所有區提供可變懸浮高度以及跨漂浮台之不同高度的不同區之組合的結果為,當基板在漂浮台上方行進時,基板可維持大致平坦之佈置。 Floating station 700 in accordance with the present teachings, as depicted in Figures 45A and 45B Various embodiments, with the result of providing a combination of variable levitation heights for all zones and different zones across different heights of the floating table, the substrate can maintain a substantially flat arrangement as the substrate travels over the floating table.

在圖45A中,當基板860在漂浮台800上方行進時,基板860之駐留於壓力-真空區810上方的部分具有第一懸浮高度FH1,而基板860之駐留於僅壓力區840上方的部分具有第二懸浮高度FH2。然而,過渡區820具有傾斜佈置,該傾斜佈置提供壓力-真空區810與僅壓力區840之間的高度差,該高度差可補償壓力-真空區810與僅壓力區840之間的懸浮高度差,當基板860在三個不同區上方行進時,基板860維持大致平坦之佈置。在圖45B中,當基板860在漂浮台800上方行進時,基板860之駐留於壓力-真空區810上方的部分具有第一懸浮高度FH1,而基板860之駐留於僅壓力區842上方的部分具有第二懸浮高度FH2。然而,過渡區842具有傾斜佈置,該傾斜佈置提供壓力-真空區810與僅壓力區842之間的高度差,該高度差可補償壓力-真空區810與僅壓力區842之間的懸浮高度差,當基板860在三個不同區上方行進時,基板860維持大致平坦之佈置。因此,在基板860在漂浮台800上方的任一行進方向中,基板860可維持大致平坦之佈置。 Portion 810 having a first upper vacuum region levitation height FH 1, and the substrate 860 resides just above the pressure zone 840 - in FIG. 45A, when the substrate 860 travels over the floating station 800, the substrate 860 residing in the pressure Has a second levitation height FH 2 . However, the transition zone 820 has a slanted arrangement that provides a height difference between the pressure-vacuum zone 810 and only the pressure zone 840 that compensates for the difference in levitation height between the pressure-vacuum zone 810 and only the pressure zone 840 Substrate 860 maintains a generally flat arrangement as substrate 860 travels over three different zones. Portion 810 having a first upper vacuum region levitation height FH 1, and the substrate 860 resides just above the pressure zone 842 - in FIG. 45B, when the substrate 860 travels over the floating station 800, the substrate 860 residing in the pressure Has a second levitation height FH 2 . However, the transition zone 842 has a slanted arrangement that provides a height difference between the pressure-vacuum zone 810 and only the pressure zone 842 that compensates for the difference in levitation height between the pressure-vacuum zone 810 and only the pressure zone 842 Substrate 860 maintains a generally flat arrangement as substrate 860 travels over three different zones. Thus, in any direction of travel of the substrate 860 above the floating table 800, the substrate 860 can maintain a substantially flat arrangement.

漂浮台700及漂浮台800之各種實施例可容納於氣體包體中,該氣體包體包括本教示之氣體包體總成,例如但不限於關於圖3、圖23及圖29所描繪及描述之彼等氣體包體總成,其可與關於圖34所描述之各種系統功能整合。可具有外部迴路(諸如但不限於關於圖38及圖39所描繪之彼等外部迴路,其可提供加壓惰性氣體以及真空)之各種實施例的氣體包體之各種實施例以及氣體包體及系統的各種實施例可利用漂浮台之各 種實施例,來根據本教示在惰性氣體環境中輸送負載。 Various embodiments of the floating table 700 and the floating table 800 can be housed in a gas enclosure that includes the gas inclusion assembly of the present teachings, such as but not limited to that depicted and described with respect to Figures 3, 23, and 29 They are gas inclusion assemblies that can be integrated with the various system functions described with respect to FIG. Various embodiments of gas inclusions of various embodiments that may have external circuits such as, but not limited to, those external circuits depicted in Figures 38 and 39 that provide pressurized inert gas and vacuum, and gas inclusions and Various embodiments of the system may utilize the various floating tables Embodiments are directed to transporting loads in an inert gas environment in accordance with the teachings.

本說明書中所提及之所有公告、專利及專利申請案係以引用方式納入本文中,其程度就如同已具體及單獨地指示將每一單獨的公告、專利或專利申請案以引用方式納入一樣。 All publications, patents, and patent applications mentioned in this specification are hereby incorporated by reference as if the same .

儘管本文已展示及描述本揭露內容之實施例,但對於熟習該項技術者而言將顯而易見的是,僅藉由舉例之方式提供此等實施例。現在,熟習該項技術者將在不脫離本揭露內容之情況下想到眾多變化、變更及替換。應理解的是,可採用本文所述之揭露內容的實施例之各種替代方案來實踐本揭露內容。希望以下申請專利範圍界定本揭露內容之範疇,且藉此來涵蓋在此等申請專利範圍及其均等物之範疇內的方法及結構。 Although the embodiments of the present disclosure have been shown and described, it will be apparent to those skilled in the art that these embodiments are provided by way of example only. Many variations, modifications, and alternatives will now occur to those skilled in the art without departing from the disclosure. It should be understood that the present disclosure may be practiced with various alternatives to the embodiments disclosed herein. It is intended that the scope of the present disclosure be defined by the scope of the claims and the scope of the claims

Claims (15)

一種用於維護一工業用列印系統的方法,其包括:在一所定義規格之內控制一氣體包體中的一處理環境,該處理環境係不同於在該氣體包體之外的一環境,該氣體包體包括:一第一包體區段,其界定該氣體包體之一第一體積,其中該第一包體區段經組配以封裝該工業用列印系統,該工業用列印系統包括具有至少一列印頭的一列印頭總成;一第二包體區段,其界定該氣體包體之一第二體積,其中該第二包體區段經組配以封裝用於執行一維護程序及一校準程序中之一者的至少一裝置;一第一開口,其經組配以被選擇性地開啟及封閉以選擇性地將該第一包體區段及該第二包體區段置放成與彼此流體連通;及一第二開口,其經組配以選擇性地提供在該第二包體區段及該氣體包體之外的該環境之間的接取;定位該第一開口靠近該列印頭總成;及在該第一開口開啟且該第二開口封閉的同時,在所述至少一列印頭上執行該維護程序及該校準程序中之一者。 A method for maintaining an industrial printing system, comprising: controlling a processing environment in a gas inclusion within a defined specification, the processing environment being different from an environment outside the gas inclusion The gas inclusion body includes: a first inclusion body segment defining a first volume of the gas inclusion body, wherein the first inclusion body segment is assembled to package the industrial printing system, the industrial use The printing system includes a row of print head assemblies having at least one print head; a second package section defining a second volume of the gas enclosure, wherein the second package sections are assembled for packaging At least one device for performing one of a maintenance procedure and a calibration procedure; a first opening configured to be selectively opened and closed to selectively select the first enclosure section and the first The two-package sections are placed in fluid communication with each other; and a second opening is assembled to selectively provide a connection between the second enclosure section and the environment outside the gas enclosure Positioning the first opening adjacent to the printhead assembly; and at the first opening Open and the second opening is closed while the at least one print head, and executes the maintenance program by one of the calibration procedure. 如申請專利範圍第1項之方法,其進一步包括:在定位該列印頭總成之後,以該列印頭總成來密封該第一開口;其中所述密封將該第二包體區段自該第一包體區段隔離開。 The method of claim 1, further comprising: sealing the first opening with the printhead assembly after positioning the printhead assembly; wherein the sealing the second package section Isolated from the first body section. 如申請專利範圍第2項之方法,其進一步包括:藉由開啟該第二開口而同時維持該第二包體區段自該第一包體區段隔離開,從該氣體包體之外 的該環境接取該第二包體區段。 The method of claim 2, further comprising: maintaining the second enclosure section from the first enclosure section by opening the second opening, from outside the gas enclosure The environment receives the second enveloping section. 如申請專利範圍第3項之方法,其進一步包括:將一替換列印頭及一替換列印頭總成中之至少一者裝載至該第二包體區段中。 The method of claim 3, further comprising: loading at least one of a replacement printhead and a replacement printhead assembly into the second package section. 如申請專利範圍第4項之方法,其進一步包括:自該第二包體區段移除一故障列印頭及一故障列印頭總成中之至少一者。 The method of claim 4, further comprising: removing at least one of a faulty printhead and a faulty printhead assembly from the second body section. 如申請專利範圍第5項之方法,其進一步包括:藉由封閉該第二開口而同時維持該第二包體區段自該第一包體區段隔離開,將該第二包體區段自該氣體包體之外的該環境隔離開;及在該所定義規格之內控制該第二包體區段中的該處理環境。 The method of claim 5, further comprising: closing the second enclosure portion while maintaining the second enclosure section from the first enclosure section, the second enclosure section The environment is isolated from the gas enclosure; and the processing environment in the second enclosure section is controlled within the defined specification. 如申請專利範圍第1項之方法,其中該第二包體區段之該第二體積是該氣體包體之一總體積的約1%至約10%。 The method of claim 1, wherein the second volume of the second inclusion section is from about 1% to about 10% of the total volume of one of the gas inclusions. 如申請專利範圍第1項之方法,其中該第二包體區段之該第二體積是該氣體包體之一總體積的約2%至約5%。 The method of claim 1, wherein the second volume of the second inclusion section is from about 2% to about 5% of the total volume of one of the gas inclusions. 如申請專利範圍第1項之方法,其中控制該處理環境包括:控制反應性物種的含量,以避免在該工業用列印系統中處理的材料及基板受到污染、氧化及損壞。 The method of claim 1, wherein controlling the processing environment comprises: controlling the content of the reactive species to avoid contamination, oxidation, and damage of materials and substrates processed in the industrial printing system. 如申請專利範圍第9項之方法,其中所述反應性物種的含量被控制在約100ppm或更少。 The method of claim 9, wherein the content of the reactive species is controlled to be about 100 ppm or less. 如申請專利範圍第9項之方法,其中所述反應性物種的含量被控制在約1ppm或更少。 The method of claim 9, wherein the content of the reactive species is controlled to be about 1 ppm or less. 如申請專利範圍第1項之方法,其中控制該處理環境包括:提供在該氣體包體中之一惰性氣體處理環境。 The method of claim 1, wherein controlling the processing environment comprises providing an inert gas treatment environment in the gas enclosure. 如申請專利範圍第12項之方法,其中藉由使用選自氮氣、一稀有氣體及其組合的氣體來提供該惰性氣體處理環境。 The method of claim 12, wherein the inert gas treatment environment is provided by using a gas selected from the group consisting of nitrogen, a rare gas, and combinations thereof. 如申請專利範圍第1項之方法,其中控制該處理環境包括:提供在該氣體包體中之一低粒子處理環境。 The method of claim 1, wherein controlling the processing environment comprises providing a low particle processing environment in the gas inclusion. 如申請專利範圍第1項之方法,其中該工業用列印系統經組配以在具有約第3.5代至約第10代之一大小的一基板上執行一列印程序。 The method of claim 1, wherein the industrial printing system is configured to perform a printing process on a substrate having a size from about 3.5th generation to about the 10th generation.
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