TW201439575A - FMCW radar level meter and signal traceback and phase-locking method thereof - Google Patents

FMCW radar level meter and signal traceback and phase-locking method thereof Download PDF

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TW201439575A
TW201439575A TW102111863A TW102111863A TW201439575A TW 201439575 A TW201439575 A TW 201439575A TW 102111863 A TW102111863 A TW 102111863A TW 102111863 A TW102111863 A TW 102111863A TW 201439575 A TW201439575 A TW 201439575A
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signal
frequency signal
high frequency
substrate
circuit board
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TW102111863A
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TWI516787B (en
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yi-zhu Lin
Shu-Qian Zheng
yi-yan Li
hui-zhi Xu
zhao-kai Zheng
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Finetek Co Ltd
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Abstract

The invention is a frequency modulated continuous waves (FMCW) radar level meter and a signal traceback and phase-locking method thereof. It comprises a high-frequency signal module, a low-frequency signal processing module and an operation and display module which are sequentially-connected. A signal generator of the high-frequency signal module generates a first high-frequency signal, which is transmitted to a substance under test from an antenna. The substance under test reflects a second high-frequency signal different from the first high-frequency signal. The Antenna receives the reflected second high-frequency signal. Then the second high-frequency signal is processed by the low-frequency signal processing module. The second high-frequency signal is compared with the first high-frequency signal. The distance is computed and displayed by the operation and display module. Thereby, the second high-frequency signal is processed by the high-frequency signal module and the low-frequency signal processing module for solving the problem of noise of the radar level meter and temperature coefficient drift.

Description

FMCW雷達物位計及其訊號追溯與相位鎖定方法 FMCW radar level gauge and its signal traceability and phase locking method

本發明係一種FMCW雷達物位計,尤指一種具有訊號追溯與相位鎖定的FMCW雷達物位計。 The invention relates to an FMCW radar level gauge, in particular to an FMCW radar level gauge with signal traceability and phase locking.

近來工業發展越來越科技化與精密化,為了能即時監控儲存槽之物質的準位或量測開放式的空間,如河川或水庫的水位、礦場的物質準位等,因此發展出利用天線發射高頻(GHz等級)的電磁波以偵測距離或物質準位的FMCW雷達物位計,該FMCW雷達物位計主要是由微波收發電路與天線組合而成,其利用FMCW(Frequency Modulated Continuous Waves)的訊號調變方法,由FMCW雷達物位計發送一發射訊號,並由待測物質反射一接收訊號,藉由偵測發射訊號與反射之接收訊號的頻率差異,以計算FMCW雷達物位計與該待測物體的距離或換算為物質準位。 Recently, industrial development has become more and more technological and precise. In order to monitor the level of materials in storage tanks or measure open space, such as the water level of rivers or reservoirs and the material level of mines, it has been developed and utilized. The antenna transmits a high frequency (GHz level) electromagnetic wave to detect the distance or material level of the FMCW radar level gauge. The FMCW radar level gauge is mainly composed of a microwave transceiver circuit and an antenna, which utilizes FMCW (Frequency Modulated Continuous). Waves) signal modulation method, the FMCW radar level gauge sends a transmission signal, and the received signal is reflected by the test substance, and the FMCW radar level is calculated by detecting the frequency difference between the transmitted signal and the reflected received signal. Calculate the distance from the object to be tested or convert it to the material level.

該FMCW雷達物位計之微波收發電路係由一高頻的振盪器(Oscillator)產生第一高頻訊號,該第一高頻訊號經由一鎖相迴路(PLL)再透過天線發射至待測物質,該待測物質反射該第一高頻訊號而為第二高頻訊號,FMCW 雷達物位計由天線接收該第二高頻訊號並與第一高頻訊號經混頻器取得其頻率差而可得到中頻訊號,該中頻訊號經過計算後即可得FMCW雷達物位計與該待測物質之間的距離。 The microwave transceiver circuit of the FMCW radar level meter generates a first high frequency signal by a high frequency oscillator (Oscillator), and the first high frequency signal is transmitted through a phase locked loop (PLL) to the substance to be tested through the antenna. The substance to be tested reflects the first high frequency signal and is the second high frequency signal, FMCW The radar level gauge receives the second high frequency signal from the antenna and obtains the intermediate frequency signal by obtaining the frequency difference between the first high frequency signal and the first high frequency signal, and the intermediate frequency signal is calculated to obtain the FMCW radar level meter. The distance from the substance to be tested.

由於微波收發電路中的振盪器、鎖相迴路與混頻器體積小且工作於高頻,易受外界雜訊干擾與溫度變化的影響,而有產生雜訊與溫度係數飄移的問題。 Since the oscillator, the phase-locked loop and the mixer in the microwave transceiver circuit are small in size and operate at high frequencies, they are susceptible to external noise interference and temperature changes, and have problems of noise and temperature coefficient drift.

如前揭所述,現有FMCW雷達物位計之振盪器、鎖相迴路與混頻器係工作於於高頻,易受外界干擾與溫度變化影響,而有產生雜訊與溫度係數飄移的問題,因此本發明主要目的在提供一FMCW雷達物位計及其訊號追溯與相位鎖定方法,係將待測物質反射的訊號經帶通濾波,再與原發射訊號比對取得其中頻訊號,再經低頻直流阻隔即可解決現有雷達物位計之雜訊與溫度係數飄移的問題。 As mentioned above, the existing FMCW radar level gauge oscillator, phase-locked loop and mixer system work at high frequency, which is susceptible to external interference and temperature changes, and has problems of noise and temperature coefficient drift. Therefore, the main purpose of the present invention is to provide an FMCW radar level gauge and a signal tracing and phase locking method thereof, which is characterized in that the signal reflected by the material to be tested is band-pass filtered, and then the intermediate frequency signal is compared with the original transmitted signal to obtain the intermediate frequency signal, and then Low-frequency DC blocking can solve the problem of noise and temperature coefficient drift of existing radar level gauges.

為達成前述目的所採取的主要技術手段係令前述FMCW雷達物位計,包含有:一高頻訊號模組,其包含有一訊號產生器、一訊號耦合器、一低雜訊放大器、一帶通濾波器與一混頻器,該訊號耦合器包含有一TX訊號端、一RX訊號端、一RF訊號端與一LO訊號端,該TX訊號端係與訊號產生器電連接 ,該RX訊號端係與低雜訊放大器電連接,該RF訊號端係連接至一RF連接器以與外部一天線連接,該低雜訊放大器係與帶通濾波器電連接,該混頻器包含有一RX輸入端、一LO輸入端與一IF輸出端,該RX輸入端係與帶通濾波器電連接,該LO輸入端係與訊號耦合器之LO訊號端電連接;一低頻訊號處理模組,其包含有一直流阻隔器、一帶拒濾波器與一功率放大器,該直流阻隔器係與混頻器的IF輸出端電連接,該帶拒濾波器係與直流阻隔器電連接,該功率放大器係與帶拒濾波器電連接;以及一運算及顯示模組,其包含有一類比/數位轉換器、一微控制器與一顯示器,該類比/數位轉換器係與功率放大器電連接,該微控制器分別與類比數位轉換器以及顯示器電連接。 The main technical means adopted to achieve the foregoing objectives is that the FMCW radar level gauge includes: a high frequency signal module including a signal generator, a signal coupler, a low noise amplifier, and a band pass filter. And a mixer, the signal coupler includes a TX signal terminal, an RX signal terminal, an RF signal terminal and an LO signal terminal, and the TX signal terminal is electrically connected to the signal generator The RX signal end is electrically connected to the low noise amplifier, and the RF signal end is connected to an RF connector to be connected to an external antenna. The low noise amplifier is electrically connected to the band pass filter. The mixer is electrically connected. An RX input terminal, an LO input terminal and an IF output terminal are electrically connected to the band pass filter, and the LO input terminal is electrically connected to the LO signal end of the signal coupler; a low frequency signal processing mode The group includes a DC blocker, a band rejection filter and a power amplifier electrically connected to the IF output of the mixer, the band rejection filter being electrically connected to the DC blocker, the power amplifier Electrically coupled to the rejection filter; and an arithmetic and display module including a analog/digital converter, a microcontroller, and a display electrically coupled to the power amplifier, the micro control The devices are electrically connected to the analog digital converter and the display, respectively.

為達成前述目的所採取的主要技術手段係令前述FMCW雷達物位計之訊號追溯與相位鎖定方法,係由一FMCW雷達物位計執行以下步驟:發射一第一高頻訊號至一待測物質,並接收該待測物質反射之一與第一高頻訊號不同的第二高頻訊號;對第二高頻訊號執行訊號放大與帶通濾波後,與第一高頻訊號混頻以取得其頻率差的中頻訊號;阻隔中頻訊號的低頻雜訊並經功率放大後,據以計算 出該中頻訊號代表之待測物質的距離。 The main technical means adopted to achieve the above objectives is the signal traceability and phase locking method of the FMCW radar level gauge. The FMCW radar level gauge performs the following steps: transmitting a first high frequency signal to a substance to be tested. Receiving a second high frequency signal different from the first high frequency signal by the reflection of the material to be tested; performing signal amplification and band pass filtering on the second high frequency signal, and mixing with the first high frequency signal to obtain the same IF signal with a frequency difference; low-frequency noise blocking the IF signal and after power amplification, The distance of the substance to be tested represented by the intermediate frequency signal.

利用前述元件組成的FMCW雷達物位計,由高頻訊號模組之訊號產生器產生第一高頻訊號,並將該第一高頻訊號送入訊號耦合器之TX訊號端,該訊號耦合器係將該第一高頻訊號分別送至LO訊號端及RF訊號端,RF訊號端的第一高頻訊號係透過RF連接器經天線發射至該待測物質,該第一高頻訊號在待測物質上反射後即為不同頻率之第二高頻訊號,天線接收其反射之第二高頻訊號,再由RF訊號端將反射之第二高頻訊號由RX訊號端送至低雜訊放大器與帶通濾波器以濾除雜訊並取得所需頻帶,再送至混頻器的RX輸入端,混頻器將LO輸入端之第一高頻訊號與RX輸入端之第二高頻訊號的頻率差轉換為中頻訊號,再由IF輸出端送至直流阻隔器以隔離其直流訊號,該帶拒濾波器係取得該中頻訊號所選的頻帶,並由功率放大器放大訊號後送至類比/數位轉換器轉換為數位訊號,微控制器計算該訊號代表的距離,並由顯示器顯示該距離,藉由高頻訊號模組之帶通濾波器以及低頻訊號處理模組之直流阻隔器與帶拒濾波器,處理該第二高頻訊號與中頻訊號,可解決現有雷達物位計之雜訊與溫度係數飄移的問題。 Using the FMCW radar level gauge composed of the foregoing components, the first high frequency signal is generated by the signal generator of the high frequency signal module, and the first high frequency signal is sent to the TX signal end of the signal coupler, the signal coupler The first high frequency signal is sent to the LO signal end and the RF signal end respectively, and the first high frequency signal of the RF signal end is transmitted to the test object through the antenna through the RF connector, and the first high frequency signal is to be tested. After the material is reflected, it is the second high frequency signal of different frequencies, the antenna receives the second high frequency signal reflected by the antenna, and then the second high frequency signal reflected by the RF signal end is sent from the RX signal end to the low noise amplifier and A bandpass filter filters out the noise and obtains the desired frequency band, which is then sent to the RX input of the mixer. The mixer combines the first high frequency signal at the LO input with the second high frequency signal at the RX input. The difference is converted into an intermediate frequency signal, and then sent from the IF output to the DC blocker to isolate the DC signal. The band rejection filter obtains the frequency band selected by the intermediate frequency signal, and the power amplifier amplifies the signal and sends it to the analog/ Digital converter converts to digital signal, micro control Calculating the distance represented by the signal, and displaying the distance by the display, processing the second high frequency signal by using a band pass filter of the high frequency signal module and a DC blocker and a rejection filter of the low frequency signal processing module With the IF signal, it can solve the problem of noise and temperature coefficient drift of the existing radar level meter.

10‧‧‧高頻訊號模組 10‧‧‧High Frequency Signal Module

11‧‧‧訊號產生器 11‧‧‧Signal Generator

111‧‧‧振盪器 111‧‧‧Oscillator

112‧‧‧鎖相迴路 112‧‧‧ phase-locked loop

12‧‧‧主動式倍頻器 12‧‧‧Active Frequency Multiplier

13‧‧‧訊號耦合器 13‧‧‧Signal coupler

14‧‧‧低雜訊放大器 14‧‧‧Low noise amplifier

15‧‧‧帶通濾波器 15‧‧‧Bandpass filter

16‧‧‧混頻器 16‧‧‧ Mixer

20‧‧‧低頻訊號處理模組 20‧‧‧Low frequency signal processing module

21‧‧‧直流阻隔器 21‧‧‧DC blocker

22‧‧‧帶拒濾波器 22‧‧‧Rejection filter

23‧‧‧功率放大器 23‧‧‧Power Amplifier

24‧‧‧低頻濾波器 24‧‧‧Frequency filter

25‧‧‧高頻濾波器 25‧‧‧High frequency filter

30‧‧‧運算及顯示模組 30‧‧‧Operation and display module

31‧‧‧類比/數位轉換器 31‧‧‧ Analog/Digital Converter

32‧‧‧微控制器 32‧‧‧Microcontroller

33‧‧‧顯示器 33‧‧‧ display

40‧‧‧RF連接器 40‧‧‧RF connector

50‧‧‧本體 50‧‧‧ body

51‧‧‧高頻電路板 51‧‧‧High frequency circuit board

52‧‧‧微控制器電路板 52‧‧‧Microcontroller Board

53‧‧‧電源電路板 53‧‧‧Power circuit board

54‧‧‧顯示器電路板 54‧‧‧Display circuit board

60‧‧‧整合式電路板 60‧‧‧Integrated circuit board

61‧‧‧第一基板 61‧‧‧First substrate

62‧‧‧第二基板 62‧‧‧second substrate

63‧‧‧第三基板 63‧‧‧ Third substrate

64‧‧‧高頻電路金屬層 64‧‧‧High frequency circuit metal layer

65‧‧‧高頻電路接地層 65‧‧‧High frequency circuit ground plane

66‧‧‧中頻電路接地層 66‧‧‧Intermediate frequency circuit ground plane

67‧‧‧中頻電路金屬層 67‧‧‧Medium frequency circuit metal layer

圖1是本發明第一較佳實施例的電路方塊圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a circuit in accordance with a first preferred embodiment of the present invention.

圖2是本發明第一較佳實施例之雷達物位計的剖面圖。 Figure 2 is a cross-sectional view showing a radar level gauge according to a first preferred embodiment of the present invention.

圖3是本發明第一較佳實施例之雷達物位計的局部分解圖。 Figure 3 is a partially exploded view of a radar level gauge in accordance with a first preferred embodiment of the present invention.

圖4是本發明第一較佳實施例之整合式電路板的剖面圖。 Figure 4 is a cross-sectional view showing an integrated circuit board in accordance with a first preferred embodiment of the present invention.

圖5是本發明第二較佳實施例的電路方塊圖。 Figure 5 is a block diagram of a circuit in accordance with a second preferred embodiment of the present invention.

關於本發明的第一較佳實施例,請參閱圖1所示,其包含有一高頻訊號模組10、一低頻訊號處理模組20與一運算及顯示模組30,該高頻訊號模組10、低頻訊號處理模組20與運算及顯示模組30是依序串接。 Referring to FIG. 1 , a high frequency signal module 10 , a low frequency signal processing module 20 and an operation and display module 30 , the high frequency signal module 10. The low frequency signal processing module 20 and the computing and display module 30 are serially connected in sequence.

該高頻訊號模組10包含有一訊號產生器(OSC&PLL)11、一主動式倍頻器(Active Frequency Multiplier)12、一訊號耦合器(Coupler)13、一低雜訊放大器(LNA:Low Noise Amplifier)14、一帶通濾波器(Band Pass Filter)15與一混頻器(Mixer)16,該訊號產生器11係與主動式倍頻器12電連接,該訊號耦合器13包含有一TX訊號端、一RX訊號端、一RF訊號端與一LO訊號端,該TX訊號端係與主動式倍頻器12電連接,該RX訊號端係與低雜訊放大器14電連接,該RF訊號端係連接至一RF連接器40以與外部一天線(圖中未示)連接,該低雜訊放大器14係與帶通濾波器15電連接,該混頻器16包含 有一RX輸入端、一LO輸入端與一IF輸出端,該RX輸入端係與帶通濾波器15電連接,該LO輸入端係與訊號耦合器13之LO訊號端電連接;該訊號產生器11包含有一振盪器(OSC)111與一鎖相迴路(PLL)112,該振盪器111係一壓控石英震盪器(VCXO:Voltage-Controlled Oscillator)或一溫控石英震盪器(TCXO:Temperature-Controlled Oscillator),藉由振盪器(OSC)111與鎖相迴路(PLL)112使訊號產生器11輸出一第一高頻訊號,該第一高頻訊號為線性變化的鋸齒波形(Triangularly)或弦波(Sine/Cosin);該主動式倍頻器12係將訊號產生器11輸出之第一高頻訊號的頻率乘以兩倍,該訊號耦合器13係將第一高頻訊號送至RF連接器40與混頻器16,或是將RF連接器40接收之一第二高頻訊號送至低雜訊放大器14,該低雜訊放大器14係放大該第二高頻訊號並由帶通濾波器15濾波,該混頻器16係用以處理該第一高頻訊號與該第二高頻訊號之頻率差。 The high frequency signal module 10 includes a signal generator (OSC & PLL) 11, an active frequency multiplier 12, a signal coupler 13, and a low noise amplifier (LNA: Low Noise Amplifier). 14. A Band Pass Filter 15 and a Mixer 16, the signal generator 11 is electrically connected to the active frequency multiplier 12, and the signal coupler 13 includes a TX signal terminal. An RX signal terminal, an RF signal terminal and an LO signal terminal, the TX signal terminal is electrically connected to the active frequency multiplier 12, and the RX signal terminal is electrically connected to the low noise amplifier 14, and the RF signal terminal is connected. The RF connector 40 is connected to an external antenna (not shown), and the low noise amplifier 14 is electrically connected to the band pass filter 15, and the mixer 16 includes An RX input terminal, an LO input terminal and an IF output terminal are electrically connected to the band pass filter 15, and the LO input terminal is electrically connected to the LO signal end of the signal coupler 13; the signal generator 11 includes an oscillator (OSC) 111 and a phase locked loop (PLL) 112, which is a voltage controlled quartz oscillator (VCXO: Voltage-Controlled Oscillator) or a temperature controlled quartz oscillator (TCXO: Temperature- Controlled Oscillator, the oscillator generator 11 outputs a first high frequency signal by a oscillator (OSC) 111 and a phase locked loop (PLL) 112. The first high frequency signal is a linearly varying sawtooth waveform (Triangularly) or string. Wave (Sine/Cosin); the active frequency multiplier 12 multiplies the frequency of the first high frequency signal outputted by the signal generator 11 by two times, and the signal coupler 13 sends the first high frequency signal to the RF connection. The device 40 and the mixer 16 or the RF connector 40 receives a second high frequency signal to the low noise amplifier 14, the low noise amplifier 14 amplifies the second high frequency signal and is filtered by the band pass. The filter 15 is configured to process the first high frequency signal and the second high frequency signal The frequency difference.

該低頻訊號處理模組20包含有一直流阻隔器(DC Block)21、一帶拒濾波器(Twin-T Notch Filter)22與一功率放大器(Power Amplifier)23,該直流阻隔器21係與混頻器16的IF輸出端電連接,該帶拒濾波器22係與直流阻隔器21電連接,該功率放大器23係與帶拒濾波器22電連接。 The low frequency signal processing module 20 includes a DC block 21, a Twin-T Notch Filter 22 and a Power Amplifier 23, and the DC blocker 21 is connected to the mixer. The IF output terminal of 16 is electrically connected, and the band rejection filter 22 is electrically connected to the DC blocker 21, and the power amplifier 23 is electrically connected to the band rejection filter 22.

該運算及顯示模組30包含有一類比/數位轉換器(A/D Converter)31、一微控制器(MCU)32與一顯示器(D/P:Display)33,該類比/數位轉換器31係與功率放大器23電連接,該微控制器32分別與類比/數位轉換器31以及顯示器33電連接。 The operation and display module 30 includes an analog/digital converter (A/D converter) 31, a microcontroller (MCU) 32 and a display (D/P: Display) 33. The analog/digital converter 31 is The power amplifier 23 is electrically connected, and the microcontroller 32 is electrically connected to the analog/digital converter 31 and the display 33, respectively.

該FMCW雷達物位計係由高頻訊號模組10之訊號產生器11產生第一高頻訊號,並由主動式倍頻器12將其頻率提升兩倍,再將該第一高頻訊號送入訊號耦合器13之TX訊號端,該訊號耦合器13係將該第一高頻訊號分別送至LO訊號端及RF訊號端,RF訊號端的第一高頻訊號係透過RF連接器40並由天線發射至待測物質,該第一高頻訊號碰到待測物質後即反射不同頻率的第二高頻訊號,並由天線接收該第二高頻訊號,再由RF訊號端將第二高頻訊號經由RX訊號端送至低雜訊放大器14與帶通濾波器15濾除雜訊並取得所需頻帶,接著送至混頻器16的RX輸入端,混頻器16將LO輸入端之第一高頻訊號與RX輸入端之第二高頻訊號之間的頻率差轉換為中頻訊號,再由IF輸出端送至直流阻隔器21以隔離其直流訊號,該帶拒濾波器22係取得該中頻訊號所選的頻帶,並由功率放大器23放大訊號後送至類比/數位轉換器31轉換為數位訊號,微控制器32計算該數位訊號代表的距離,並由顯示器33顯示該距離;藉由高頻訊號模組10之帶通濾波器15 以及低頻訊號處理模組20之直流阻隔器21與帶拒濾波器22濾除該第二高頻訊號與中頻訊號的雜訊並補償溫度係數飄移,可解決現有雷達物位計之雜訊與溫度係數飄移的問題。 The FMCW radar level meter generates a first high frequency signal from the signal generator 11 of the high frequency signal module 10, and the frequency is doubled by the active frequency multiplier 12, and then the first high frequency signal is sent. The signal coupler 13 sends the first high frequency signal to the LO signal end and the RF signal end, and the first high frequency signal of the RF signal end passes through the RF connector 40 and is connected to the TX signal end of the signal coupler 13 The antenna is emitted to the substance to be tested, and the first high frequency signal reflects the second high frequency signal of different frequencies after hitting the substance to be tested, and the second high frequency signal is received by the antenna, and the second high frequency is received by the RF signal end. The frequency signal is sent to the low noise amplifier 14 and the band pass filter 15 via the RX signal terminal to filter out the noise and obtain the required frequency band, and then sent to the RX input terminal of the mixer 16, and the mixer 16 inputs the LO input terminal. The frequency difference between the first high frequency signal and the second high frequency signal at the RX input is converted into an intermediate frequency signal, which is then sent from the IF output to the DC blocker 21 to isolate the DC signal. The band rejection filter 22 is Obtaining the frequency band selected by the intermediate frequency signal, and amplifying the signal by the power amplifier 23 and sending it to the analogy The digital converter 31 converts the digital signal into a digital signal, and the microcontroller 32 calculates the distance represented by the digital signal and displays the distance by the display 33; the band pass filter 15 of the high frequency signal module 10 And the DC blocker 21 and the rejection filter 22 of the low frequency signal processing module 20 filter out the noise of the second high frequency signal and the intermediate frequency signal and compensate the temperature coefficient drift, thereby solving the noise of the existing radar level meter and The problem of temperature coefficient drift.

請參閱圖2與3所示,本發明之FMCW雷達物位計包含有一本體50,該本體50係供依序疊合一高頻電路板(RF PCB)51、一微控制器電路板(MCU PCB)52、一電源電路板(POWER PCB)53與一顯示器電路板(Display PCB)54,該高頻電路板51係供設置前述高頻訊號模組10與低頻訊號處理模組20,並設有RF連接器40,該微控制器電路板52係供設置前述運算及顯示模組30之類比/數位轉換器31以及微控制器32,該電源電路板53係供設置電源電路,該顯示器電路板54係供設置前述運算及顯示模組30之顯示器33;藉由在高頻電路板51與電源電路板53之間夾設微控制器電路板52,可作為阻隔屏蔽以減少電源電路板53之電源輻射干擾該高頻電路板51之中頻訊號,並可減少微控制器電路板52之控制訊號傳送至高頻電路板51的距離,使其傳輸最短及損耗最低。 Referring to FIGS. 2 and 3, the FMCW radar level gauge of the present invention comprises a body 50 for sequentially stacking a high frequency circuit board (RF PCB) 51 and a microcontroller circuit board (MCU). A high-voltage circuit module 51 and a low-frequency signal processing module 20 are provided for the high-frequency circuit board 51 and a display circuit board 54. An RF connector 40 is provided for the analog/digital converter 31 and the microcontroller 32 of the computing and display module 30. The power circuit board 53 is provided with a power supply circuit. The display circuit The board 54 is provided with the display 33 of the computing and display module 30; the microcontroller circuit board 52 is interposed between the high frequency circuit board 51 and the power circuit board 53, and can be used as a barrier shield to reduce the power circuit board 53. The power source radiates interference with the frequency signal in the high frequency circuit board 51, and can reduce the distance that the control signal of the microcontroller circuit board 52 is transmitted to the high frequency circuit board 51, so that the transmission is shortest and the loss is the lowest.

請參閱圖4所示,本發明進一歩提供一整合式電路板60,係整合前述之高頻電路板(RF PCB)51、微控制器電路板(MCU PCB)52、電源電路板(POWER PCB)53於同一片電路板中,該整合式電路板60包含有依序疊合的一 第一基板(Core Layerl)61、一第二基板(Core Layer2)62與一第三基板(Core Layer3)63,該第一基板61表面設有一高頻電路金屬層(RF Components)64用於連接高頻訊號模組10之各元件,如圖所示之混頻器16;該第一基板61與第二基板62之間夾設有一高頻電路接地層(RF GND)65以提供高頻訊號模組10之各元件的接地;該第二基板62與第三基板63之間夾設有一中頻電路接地層(IF GND)66以提供低頻訊號處理模組20之各元件的接地;該第三基板63底面設有一中頻電路金屬層(IF Power)67用於連接之電源電路及低頻訊號處理模組20的各元件,如圖所示之直流阻隔器21;該高頻電路金屬層64與中頻電路金屬層67分設有多條微帶線(Micro Strip);又第一基板61表面與第三基板63底面之元件、微帶線以及各金屬層可透過灌孔或盲孔連接。 Referring to FIG. 4, the present invention further provides an integrated circuit board 60 which integrates the aforementioned high frequency circuit board (RF PCB) 51, a microcontroller circuit board (MCU PCB) 52, and a power circuit board (POWER PCB). 53 in the same circuit board, the integrated circuit board 60 includes a sequentially stacked one a first substrate (Core Layer) 62, a second substrate (Core Layer 2) 62 and a third substrate (Core Layer 3) 63. The surface of the first substrate 61 is provided with a high frequency circuit metal layer (RF) 64 for connection. The components of the high-frequency signal module 10 are as shown in the mixer 16; a high-frequency circuit ground layer (RF GND) 65 is interposed between the first substrate 61 and the second substrate 62 to provide a high-frequency signal. Grounding of each component of the module 10; an intermediate frequency circuit ground layer (IF GND) 66 is interposed between the second substrate 62 and the third substrate 63 to provide grounding of each component of the low frequency signal processing module 20; The bottom surface of the three substrate 63 is provided with an intermediate frequency circuit metal layer (IF Power) 67 for connecting the power supply circuit and the components of the low frequency signal processing module 20, such as the DC blocker 21 shown in the figure; the high frequency circuit metal layer 64 A plurality of micro strips are disposed in the metal layer 67 of the intermediate frequency circuit; the components of the surface of the first substrate 61 and the bottom surface of the third substrate 63, the microstrip lines, and the metal layers are connected through the filling holes or the blind holes. .

關於本發明的第二較佳實施例,請參閱圖5所示,其低頻訊號處理模組20進一歩包含有一相互串接的一低頻濾波器24與一高頻濾波器25,該低頻濾波器24係與帶拒濾波器22電連接,該高頻濾波器25係與功率放大器23電連接,該帶拒濾波器22輸出的中頻訊號進一歩經由低頻濾波器24與高頻濾波器25濾除雜訊並進行溫度係數補償後,可減少第二高頻訊號與中頻訊號受外界雜訊與溫度影響的問題。 Referring to FIG. 5, the low frequency signal processing module 20 further includes a low frequency filter 24 and a high frequency filter 25 connected in series, the low frequency filter. The 24 series is electrically connected to the rejection filter 22, and the high frequency filter 25 is electrically connected to the power amplifier 23. The intermediate frequency signal outputted by the rejection filter 22 is further filtered through the low frequency filter 24 and the high frequency filter 25. In addition to noise and temperature coefficient compensation, the problem of the second high frequency signal and the intermediate frequency signal being affected by external noise and temperature can be reduced.

10‧‧‧高頻訊號模組 10‧‧‧High Frequency Signal Module

11‧‧‧訊號產生器 11‧‧‧Signal Generator

111‧‧‧振盪器 111‧‧‧Oscillator

112‧‧‧鎖相迴路 112‧‧‧ phase-locked loop

12‧‧‧主動式倍頻器 12‧‧‧Active Frequency Multiplier

13‧‧‧訊號耦合器 13‧‧‧Signal coupler

14‧‧‧低雜訊放大器 14‧‧‧Low noise amplifier

15‧‧‧帶通濾波器 15‧‧‧Bandpass filter

16‧‧‧混頻器 16‧‧‧ Mixer

20‧‧‧低頻訊號處理模組 20‧‧‧Low frequency signal processing module

21‧‧‧直流阻隔器 21‧‧‧DC blocker

22‧‧‧帶拒濾波器 22‧‧‧Rejection filter

23‧‧‧功率放大器 23‧‧‧Power Amplifier

30‧‧‧運算及顯示模組 30‧‧‧Operation and display module

31‧‧‧類比/數位轉換器 31‧‧‧ Analog/Digital Converter

32‧‧‧微控制器 32‧‧‧Microcontroller

33‧‧‧顯示器 33‧‧‧ display

40‧‧‧RF連接器 40‧‧‧RF connector

Claims (9)

一種FMCW雷達物位計,包含有:一高頻訊號模組,其包含有一訊號產生器、一訊號耦合器、一低雜訊放大器、一帶通濾波器與一混頻器,該訊號耦合器包含有一TX訊號端、一RX訊號端、一RF訊號端與一LO訊號端,該TX訊號端係與訊號產生器電連接,該RX訊號端係與低雜訊放大器電連接,該RF訊號端係連接至一RF連接器以與外部一天線連接,該低雜訊放大器係與帶通濾波器電連接,該混頻器包含有一RX輸入端、一LO輸入端與一IF輸出端,該RX輸入端係與帶通濾波器電連接,該LO輸入端係與訊號耦合器之LO訊號端電連接;一低頻訊號處理模組,其包含有一直流阻隔器、一帶拒濾波器與一功率放大器,該直流阻隔器係與混頻器的IF輸出端電連接,該帶拒濾波器係與直流阻隔器電連接,該功率放大器係與帶拒濾波器電連接;以及一運算及顯示模組,其包含有一類比/數位轉換器、一微控制器與一顯示器,該類比/數位轉換器係與功率放大器電連接,該微控制器分別與類比數位轉換器以及顯示器電連接。 An FMCW radar level gauge includes: a high frequency signal module including a signal generator, a signal coupler, a low noise amplifier, a band pass filter and a mixer, the signal coupler comprising There is a TX signal end, an RX signal end, an RF signal end and an LO signal end. The TX signal end is electrically connected to the signal generator, and the RX signal end is electrically connected to the low noise amplifier, and the RF signal end is connected. Connected to an RF connector for connection to an external antenna, the low noise amplifier is electrically connected to a band pass filter, the mixer includes an RX input, an LO input and an IF output, the RX input The end system is electrically connected to the band pass filter, and the LO input end is electrically connected to the LO signal end of the signal coupler; and the low frequency signal processing module comprises a DC blocker, a band rejection filter and a power amplifier, The DC blocker is electrically connected to the IF output of the mixer, the band rejection filter is electrically connected to the DC blocker, the power amplifier is electrically connected to the band rejection filter; and an operation and display module includes There is a kind of ratio/number Converter, a microcontroller and a display, such ratio / digital converter system and the power amplifier electrically connected to the microcontroller are connected to the analog to digital converter and a display electrically. 如請求項1所述之FMCW雷達物位計,該低頻訊號處理模組進一歩包含有一低頻濾波器,該低頻濾波器係串接於帶拒濾波器與功率放大器之間。 The FMCW radar level gauge according to claim 1, wherein the low frequency signal processing module further comprises a low frequency filter serially connected between the band rejection filter and the power amplifier. 如請求項2所述之FMCW雷達物位計,該低頻訊號處理模組進一歩包含有一高頻濾波器,該高頻濾波器係串 接於低頻濾波器與功率放大器之間。 The FMCW radar level gauge according to claim 2, wherein the low frequency signal processing module further comprises a high frequency filter, the high frequency filter string Connected between the low frequency filter and the power amplifier. 如請求項3所述之FMCW雷達物位計,該訊號產生器包含有一振盪器與一鎖相迴路,該振盪器係一壓控石英震盪器(VCXO)或一溫控石英震盪器(TCXO)。 The FMCW radar level gauge according to claim 3, wherein the signal generator comprises an oscillator and a phase locked loop, the oscillator being a voltage controlled quartz oscillator (VCXO) or a temperature controlled quartz oscillator (TCXO). . 如請求項4所述之FMCW雷達物位計,該訊號產生器係輸出線性變化的鋸齒波形(Triangularly)或弦波(Sine/Cosin)。 The FMCW radar level gauge according to claim 4, wherein the signal generator outputs a linearly varying sawtooth waveform or a sine wave (Sine/Cosin). 如請求項1至5中任一項所述之FMCW雷達物位計,其包含有一本體,該本體係供依序疊合一高頻電路板(RF PCB)、一微控制器電路板(MCU PCB)、一電源電路板(POWER PCB)與一顯示器(Display PCB),該高頻電路板係設置高頻訊號模組與低頻訊號處理模組以及RF連接器,該微控制器電路板係設置運算及顯示模組之類比/數位轉換器以及微控制器,該電源電路板係設置一電源電路,該顯示器電路板係設置運算及顯示模組之顯示器,該高頻電路板與電源電路板之間係夾設該微控制器電路板。 The FMCW radar level gauge according to any one of claims 1 to 5, comprising a body for sequentially stacking a high frequency circuit board (RF PCB) and a microcontroller circuit board (MCU) PCB), a power circuit board (POWER PCB) and a display (Display PCB), the high frequency circuit board is provided with a high frequency signal module and a low frequency signal processing module and an RF connector, the microcontroller circuit board setting An analog/digital converter of an arithmetic and display module, and a microcontroller, wherein the power circuit board is provided with a power supply circuit, the display circuit board is a display for setting an operation and display module, and the high frequency circuit board and the power circuit board The microcontroller circuit board is interposed. 如請求項1至5中任一項所述之FMCW雷達物位計,其包含有一本體,該本體係供容置一整合式電路板,該整合式電路板包含有依序疊合的一第一基板、一第二基板與一第三基板,該第一基板表面設有一高頻電路金屬層(RF Components)用於連接高頻訊號模組,該第一基板與第二基板之間夾設有一高頻電路接地層(RF GND),該第二基板與第三基板之間夾設有一中頻電路接地層(IF GND),該第三基板底面設有一中頻電路金屬層(IF Power),其用於連接之電源電路及低頻訊號處理模組,第一基板表面與第 三基板底面之各元件或多數個微帶線或各金屬層係透過灌孔或盲孔連接。 The FMCW radar level gauge according to any one of claims 1 to 5, comprising a body, the system for accommodating an integrated circuit board, the integrated circuit board comprising a first layer a substrate, a second substrate and a third substrate, the first substrate surface is provided with a high frequency circuit metal layer (RF components) for connecting the high frequency signal module, and the first substrate and the second substrate are interposed There is a high frequency circuit ground plane (RF GND), an intermediate frequency circuit ground layer (IF GND) is interposed between the second substrate and the third substrate, and an intermediate frequency circuit metal layer (IF Power) is disposed on the bottom surface of the third substrate. , the power circuit and the low frequency signal processing module for connecting the first substrate surface and the first Each element or a plurality of microstrip lines or metal layers of the bottom surface of the three substrates are connected through a filling hole or a blind hole. 如請求項6所述之FMCW雷達物位計,其包含有一本體,該本體係供容置一整合式電路板,該整合式電路板包含有依序疊合的一第一基板、一第二基板與一第三基板,該第一基板表面設有一高頻電路金屬層(RF Components)用於連接高頻訊號模組,該第一基板與第二基板之間夾設有一高頻電路接地層(RF GND),該第二基板與第三基板之間夾設有一中頻電路接地層(IF GND),該第三基板底面設有一中頻電路金屬層(IF Power),其用於連接之電源電路及低頻訊號處理模組,第一基板表面與第三基板底面之各元件或多數個微帶線或各金屬層係透過灌孔或盲孔連接。 The FMCW radar level gauge according to claim 6, comprising a body, the system for accommodating an integrated circuit board, the integrated circuit board comprising a first substrate and a second stacked in sequence a substrate and a third substrate, wherein a surface of the first substrate is provided with a high frequency circuit metal layer (RF) for connecting the high frequency signal module, and a high frequency circuit ground layer is sandwiched between the first substrate and the second substrate (RF GND), an intermediate frequency circuit ground layer (IF GND) is interposed between the second substrate and the third substrate, and an IF Power metal layer (IF Power) is disposed on the bottom surface of the third substrate for connecting The power circuit and the low-frequency signal processing module, the components of the first substrate surface and the bottom surface of the third substrate or the plurality of microstrip lines or the metal layers are connected through the filling holes or the blind holes. 一種FMCW雷達物位計之訊號追溯與相位鎖定方法,係由一FMCW雷達物位計執行以下步驟:發射一第一高頻訊號至一待測物質,並接收該待測物質反射之一與第一高頻訊號不同的第二高頻訊號;對第二高頻訊號執行訊號放大與帶通濾波後,與第一高頻訊號混頻以取得其頻率差的中頻訊號;阻隔中頻訊號的低頻雜訊並經功率放大後,據以計算出該中頻訊號代表之待測物質的距離。 A signal tracking and phase locking method for a FMCW radar level gauge is performed by an FMCW radar level gauge performing the following steps: transmitting a first high frequency signal to a substance to be tested, and receiving one of the reflections of the substance to be tested a second high frequency signal having a different high frequency signal; after performing signal amplification and band pass filtering on the second high frequency signal, mixing with the first high frequency signal to obtain an intermediate frequency signal having a frequency difference; blocking the intermediate frequency signal After the low frequency noise is amplified by power, the distance of the substance to be tested represented by the intermediate frequency signal is calculated.
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US9678196B2 (en) 2015-04-15 2017-06-13 U&U Engineering Inc Sensor for detecting parking lot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9678196B2 (en) 2015-04-15 2017-06-13 U&U Engineering Inc Sensor for detecting parking lot

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