TW201429307A - A light emitting diode system and control method thereof - Google Patents

Abstract

A light emitting diode (LED) system includes at least one light emitting diode (LED), and a wireless control system, at least one light emitting diode (LED) configured to provide lighting in an area, wireless control system configured to control the light emitting diode (LED) comprising at least one transceiver device in signal communication with the light emitting diode (LED), and a wireless control device comprising an input device and a display device operable by a user, the wireless control device configured to send input signals to the transceiver device responsive to user input to the input device for controlling the light emitting diode (LED) and to receive output signals for display on the display device to indicate the status of the light emitting diode (LED).

Description

Light-emitting diode system and control method thereof

The present invention generally relates to a light emitting diode system and a control method thereof, and more particularly to a light emitting diode system including a transceiver component and a wireless control component, and a control method thereof.

Light-emitting diodes (LEDs) are widely used in electronic devices such as displays, communication devices, and lamps. The development of LED technology has improved the efficiency and lifetime of light-emitting diodes (LEDs) and has made them smaller and lighter. However, most developments have focused on the structure and function of light-emitting diodes (LEDs) rather than the associated LED systems. Light-emitting diodes (LEDs) are a general part of an LED system that includes drive circuitry and associated electronic components such as resistors, capacitors, diodes, and circuit boards.

FIG. 1 illustrates a prior art LED system 10. Prior art LED system 10 includes an LED driver IC 12 and two light emitting diode (LED) wafers 14 that are electrically coupled to LED driver IC die 12. An LED driver IC 12 is provided to provide driving and functional circuitry for the light emitting diode (LED) wafer 14. The LED driver IC 12 includes a VIN pin, a SEN pin, a DIM pin, a SW pin, and a GND pin. LED system 10 also includes various electronic components, including resistors, capacitors, Schottky diodes, and inductors (which are generally mounted as shown). LED system 10 requires a relatively complex process to mount and interconnect all of the electronic components. In addition, a considerable amount of current and power is required to drive the electronic components, which generate a large amount of heat.

In view of the foregoing, an improved LED system is required for this skill, which is more efficient than prior art LED systems. However, the foregoing examples of the related art and the limitations associated therewith are illustrative and not limiting. After reading the specification and research drawings, the skilled artisan will be more aware of other limitations of the related art.

In one embodiment, the present invention provides an illumination system that includes at least one illumination component and a wireless control system. Each lighting element is raised in one area For lighting. A wireless control system can be signaled to each lighting element and control each lighting element. The wireless control system further includes at least one transceiver component and a wireless control component. Each transceiver component can be individually signaled to its corresponding lighting component. The wireless control element sends an input signal to each of the transceiver elements for controlling each of the lighting elements and receives a status signal from each of the transceiver elements for displaying the status of each of the lighting elements.

In another embodiment, the present invention provides a light emitting diode (LED) system including at least one light emitting diode (LED) and a wireless control system. Each of the light emitting diodes (LEDs) provides illumination in one of its regions. The wireless control system controls each of the light emitting diodes (LEDs). The wireless control system further includes at least one transceiver component and a wireless control component. Each transceiver component can be signally coupled to its corresponding light emitting diode (LED). The wireless control component further includes an input component and a display component. The wireless control component transmits an input signal to each of the transceiver components for controlling each of the light emitting diodes (LEDs), and receives a status signal for display on the display component for displaying each of the light emitting diodes The state of the polar body (LED).

In still another embodiment, the present invention provides a method of controlling a light emitting diode (LED) system, comprising the steps of: providing at least one light emitting diode (LED) illumination region; providing at least one transceiver component by receiving An input signal and a status signal can be signally connected to their corresponding light-emitting diodes (LEDs); a wireless control element is provided for signal connection with the transceiver elements, and an input signal is transmitted to the transceiver elements for controlling the light-emitting diodes ( LED), and receiving a status signal from the transceiver element for displaying the status of each of the light emitting diodes (LEDs); receiving an input signal transmitted from the wireless control element to each of the transceiver elements for controlling each of the light emitting diodes (LED); receiving a status signal sent from each transceiver element to the wireless control element for displaying the status of each of the light emitting diodes (LEDs).

The above and other features of the present invention will be described in detail in the detailed description of the invention and the accompanying drawings.

Referring to FIG. 2, the LED system 30 includes a substrate 32 and is mounted on the substrate 32. A light emitting diode (LED) 34 and an ASIC (application specific integrated circuit) die 36 mounted on the substrate 32 in electronic communication with the light emitting diode (LED) 34. In the present embodiment, although the LED system 30 includes only one special application integrated circuit (ASIC) die 36, it should be understood that the LED system can include a plurality of special application integrated circuit (ASIC) die 36, and This is limited to this. The substrate 32 serves as a mounting substrate and also provides functions for operating the light emitting diode (LED) 34 and the special application integrated circuit (ASIC) die 36 as an integrated component. Light-emitting diodes (LEDs) 34 may comprise conventional LEDs fabricated using known processes. Suitable light-emitting diodes (LEDs) are commercially available from Boise ID and SEMILEDS, Inc. of Miaoli County, Taiwan, China. The Special Application Integrated Circuit (ASIC) die 36 can include a semiconductor die having a special application integrated circuit 38 formed therein.

The light-emitting diode (LED) 34 may comprise a nitride material of a group of three elements, for example, gallium nitride (GaN), indium gallium nitride (GaN), aluminum gallium nitride (AlGaN), aluminum indium gallium nitride (AlInGaN). ), or other nitride materials of gallium, indium or aluminum. Further, the doped layer and the active layer of the light emitting diode (LED) 34 may be formed on a carrier substrate or a suitable material such as a bismuth (Si), tantalum carbide (SiC) or sapphire (Al ₂ O ₃ ) substrate. For example, the above-described light-emitting diode (LED) 34 may be ROC, Taiwan, the Miaoli SemiLEDs Co. (SEMILEDS, INC.) According to a thin vertical light emitting trademark MvpLED ^TM produced diode (U.S. Patent No. 7,723.718, the name of which is "a metal element of an epitaxial structure" (US Patent No. 7323, 718. entitled "Epitaxial". Stnicture For Metal Devices") has disclosed a method of making vertical light emitting diodes (VLEDs).

Referring to Figure 13, a schematic cross-sectional view of a light emitting diode (LED) 34 of an LED system is shown. The light emitting diode (LED) 34 can include an element substrate 72, a vertical light emitting diode (VLED) die 74 disposed on the component substrate 72, and an electrically insulating transparent passivation layer 76 encapsulating the vertical light emitting diode. (VLED) die 74. In the present embodiment, the light emitting diode (LED) 34 includes only one vertical light emitting diode (VLED) die 74 disposed on the element substrate 72. However, in practical applications, the light emitting diode (LED) 34 can A plurality of vertical light emitting diode (VLED) dies 74 are disposed on the element substrate 72 and disposed in a desired array to form a photovoltaic element, such as an LED display. The element substrate 72 may comprise a semiconductor material such as germanium (Si), or other kinds of materials such as gallium arsenide (GaAs), tantalum carbide (AsGa), aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ) or sapphire. (Al ₂ O ₃ ) substrate. The component substrate 72 can also include a cavity 78 and a back side 80, wherein a vertical light emitting diode (VLED) die 74 is disposed on the component substrate 72. The conductive bonding layer 82 can be used for electrical bonding between the vertical light emitting diode (VLED) die 74 and the component substrate 72.

With continued reference to FIG. 13, a vertical light emitting diode (VLED) die 74 can be fabricated and referenced in US Application No. 12/983,436, entitled "A Vertical Light Emitting Dipole (VLED) Die and Its Fabrication Method (US application serial no. 12/983, 436 entitled "Vertical Light Emitting Diode (VLED) Die And Method Of Fabrication"). The vertical light emitting diode (VLED) die 74 includes a first metal 84, a second metal 86, a p-type semiconductor layer 88 disposed on the first metal 84, and a multiple quantum well (MQW) layer 90 disposed on the p The type semiconductor layer 88 and an n-type semiconductor layer 92 are disposed on the multiple quantum well (MQW) layer 90. Preferred materials for the p-type semiconductor layer 88 may include p-GaN, and suitable materials of the other p-type semiconductor layer 88 may also include aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or aluminum indium gallium nitride ( AlInGaN). A preferred material for the n-type semiconductor layer 92 may include p-GaN, and suitable materials of the other n-type semiconductor layer 92 may also include aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), or aluminum indium gallium nitride ( AlInGaN). The multiple quantum well (MQW) layer 90 may comprise a semiconductor material, such as GaAs, disposed between the two layers of semiconductor material, such as between aluminum arsenide (AlAs) having a wider bandgap. . The n-type semiconductor layer 92 and the vertical light emitting diode (VLED) die 74 are electrically connected to the electrodes of the element substrate 72 by wire bonding wires 94.

Referring again to FIG. 2, the substrate 32 includes a front side (circuit surface) having a wire 40 formed thereon that electrically connects the special application integrated circuit (ASIC) die 36 to the light emitting diode (LED) 34. . As will be further explained, the application specific integrated circuit (ASIC) die 36 and the light emitting diode (LED) 34 can be mounted using suitable techniques such as flip chip or C4 bonding. On the substrate. Substrate 32 may comprise germanium or other semiconductor material such as gallium arsenide, and wires 40 may be fabricated using conventional semiconductor processes. In an embodiment, the substrate 32 may comprise a tantalum carbide (SiC) or sapphire substrate (Al ₂ O ₃ ). Alternatively, the substrate 32 may comprise a ceramic material, a printed circuit board (PCB) material, a metal core printed circuit board (PCB), an FR-4 printed circuit board (PCB), a metal lead frame, an organic lead frame, an anthrone A base substrate, or any package substrate used in the art.

Substrate 32 can be any polygonal shape (e.g., square, rectangular) and any suitable size. In addition, the substrate 32 can be a grain size such that the LED system 30 has a wafer level size similar to a chip scale package (CSP) or a system on a chip (SOC). Alternatively, substrate 32 can be wafer sized to provide a wafer level system.

Referring to FIG. 3, another embodiment LED system 30A is substantially similar to LED system 30 (FIG. 2), but includes a substrate 32A for providing additional electrical functionality. In particular, substrate 32A includes a semiconductor material having segments 42 in which special application integrated circuits (ASICs) 44 are utilized to perform additional electrical functions. Special Application Integrated Circuits (ASICs) 44 can include semiconductor components, circuits, and substrates integrated into substrate 32A. For example, special application integrated circuits (ASICs) 44 may include resistors, diodes (p-n), capacitors, gates, metal-oxide-semiconductor field effect transistors (MOSFETs), and flip-flops. Special Application Integrated Circuits (ASICs) 44 can be integrated with integrated circuit integrated circuit integrated circuit (ASIC) die 36 to provide on-board control of light emitting diodes (LEDs) 34. .

The semiconductor substrate 32A may comprise a portion of a semiconductor wafer having special application integrated circuits (ASICs) 44 formed thereon (using conventional semiconductor fabrication techniques, such as implantation, photo patterning). Light-emitting diodes (LEDs) 34 can be mounted to the blank portions of substrate 32A, spaced apart from application-specific integrated circuits (ASICs) 44, and utilize suitable connection components and interconnects with special application integrated circuits (ASICs). ) 44 electrical connections.

As shown in FIG. 4, the substrate 32 or 32A includes a back side 48 having a special application integrated circuit (ASIC) die 36 (FIG. 2) and a special application integrated circuit. (ASICs) 44 (Fig. 3) An array of contacts 46 that are electrically connected. Contact 46 is used as a terminal contact for the electronics and circuitry that connects LED system 30 (Fig. 2) or 30A (Fig. 3) to the outside world. Contact 46 may comprise a bump or pad made of a connectable material such as solder, metal or conductive polymer for connection to a module substrate, circuit board or other support substrate Corresponding to the electrode. In addition, the contacts 46 may be arranged in a suitable dense-area array, such as a ball grid array (BGA) or a fine ball grid array (FBGA). Furthermore, the contacts 46 and the special application integrated circuit (ASIC) die 36 can be made using suitable components, such as interconnects, conductive lines, redistribution wires, and conductive vias formed on the substrate 32 or 32A. (Fig. 2) and special application integrated circuits (ASICs) 44 (Fig. 3) are electrically connected.

Contact 46 can be used to combine and extend special application integrated circuit (ASIC) die 36 (FIG. 2), special application integrated circuit (ASICs) 44 (FIG. 3), and light emitting diode (LED) 34 (FIG. 2). ) Electrical function and provide intelligent control of LED system 30 (Fig. 2) or 30A (Fig. 3). For example, contact 44 can be used as a.) multi-purpose input-output 埠; b.) drive power input (AC or DC) of LED system 30 or 30A; c.) dimming control 埠; d.) Current setting 埠; e.) feedback sensor 埠; f.) communication 埠; and g.) general grounding 埠. In addition, special application integrated circuits (ASICs) 44 (Fig. 3) and LEDs 34 (Fig. 2) will form an integrated LED circuit.

Referring to Figures 5, 5A and 5B, an exemplary mounting arrangement for mounting a light emitting diode (LED) 34 and an application specific integrated circuit (ASIC) die 36 to a substrate 32 in the LED system 30 is illustrated. In FIG. 5A, the LED wafer 34 has a p-, n--same configuration, and is mounted as a board by using an interconnect 50 and a flip-chip bonding method such as C4 (controlled collapse chip connection). COB (chip-on-board) construction. Similarly, the Special Application Integrated Circuit (ASIC) die 36 includes interconnects 52 that are flip-chip mounted to the substrate 32 in the form of an on-board bonded wafer configuration. In FIG. 5B, the LED wafer 34 has a p-, n- different side structure, and is bonded to the LED wafer 34 and the substrate 32 by a die attach bonding layer 54 (eg, solder, silver paste). The wire bonding line 56 of the dot is mounted on the substrate 32.

Referring to Figures 6, 6A and 6B, the illuminating diode (LED) 34 and special applications will be clarified. An integrated circuit (ASIC) die 36 is mounted to an exemplary mounting arrangement of the substrate 32A in the LED system 30A. In FIG. 6A, the LED wafer 34 has a p-, n--same configuration, and is mounted as an on-board wafer using interconnect 50 and flip-chip bonding methods such as C4 (Controllable Collapse Wafer Connection). COB, chip-on-board) construction. In general, as previously described, a special application integrated circuit (ASIC) die 36 can be flip-chip mounted to a special application integrated circuit 44 on substrate 32A in the form of an on-board bonded wafer configuration. In FIG. 6B, the LED wafer 34 has a p-, n- different side structure, and is bonded to the LED wafer 34 and the substrate 32A by a die attach bonding layer 54 (for example, solder, silver paste). The wire bonding wires of the dots are attached to the substrate 32A.

Referring to Figures 7 and 7A, an exemplary electrical configuration of a special application integrated circuit (ASIC) die 36 and a light emitting diode (LED) 34 of LED system 30 or 30A is illustrated. As shown in FIG. 7A, a light emitting diode (LED) 34 can be electrically connected to a ground pin on a special application integrated circuit (ASIC) die 36 by a wire 40. Alternatively, a light emitting diode (LED) 34 can be attached to a dedicated ground pin on the substrate 32 or 32A.

Referring to Figures 8 and 8A, LED system 30 or 30A can also include multiple light emitting diodes (LEDs) 34A-34D that are directly mounted to substrate 32 or 32A. The light emitting diodes (LEDs) 34A-34D can all be set to produce the same wavelength and color light (eg, red, green, blue, white, ultraviolet light, laser, infrared light), or can be set to produce different combinations thereof. For example, the first light emitting diode (LED) 34A can generate white light, the second light emitting diode (LED) 34B can generate green light, the third light emitting diode (LED) 34C can generate blue light, and the fourth light emitting diode The polar body (LED) 34D can generate red light. In addition, special application integrated circuit (ASIC) die 36 and special application integrated circuit 44 (FIG. 3) can be modified to provide intelligent color control of light emitting diodes (LEDs) 34A-34D. As shown in FIG. 8A, light emitting diodes (LEDs) 34A-34D can be electrically connected in series and grounded to a ground pin on a special application integrated circuit (ASIC) die 36. Alternatively, light emitting diodes (LEDs) 34A-34D can be connected to dedicated ground pins on substrate 32 or 32A.

Referring to Figures 9 and 9A, LED system 30 or 30A can also include multiple light emitting diodes (LEDs) 34A-34D that are electrically connected in parallel. Alternatively, the light emitting diodes (LEDs) 34A-34D may be electrically connected in a multi-parallel series, and each series includes a plurality of light emitting diodes (LEDs) 34 connected in series.

The electrical characteristics of the LED system 30 or 30A are illustrated with reference to Figures 10, 10A and 10B. FIG. 10 illustrates an input/output configuration 44 for a particular application integrated circuit (ASIC) die 36. In general, the input/output structure and the special application integrated circuit of the special application integrated circuit (ASIC) die 36 are designed to integrate the light emitting diode 34 and the special application integrated circuit (ASIC) die 36 into one. Integrated components. Figure 10A illustrates an output configuration of a special application integrated circuit (ASIC) die 36 having a series of light emitting diodes (LEDs) 34 electrically connected in series to the ground; Figure 10B illustrates a special application integrated circuit (ASIC) die An output configuration of 36 having a single light emitting diode (LED) 34 electrically connected to the ground.

Table 1 illustrates the input 埠 configuration of the Special Application Integrated Circuit (ASIC) die 36.

Different package configurations of LED system 30 or 30A are illustrated with reference to Figures 11A-11C. In FIG. 11A, LED package 58A includes a substrate 32 or 32A, an application specific integrated circuit (ASIC) die 36, and a light emitting diode (LED) 34, essentially as previously described. Additionally, the light emitting diode (LED) 34 can include a phosphor layer 60 for producing white light. LED package 58A also includes a polymer lens 66 on substrate 32 or 32A that encapsulates LED system 30 or 30A. The polymeric lens 66 can comprise a suitable polymer, such as an epoxy formed by molding or other suitable process.

In FIG. 11B, the LED package 58B includes a substrate 32 or 32A, an application specific integrated circuit (ASIC) die 36, and a light emitting diode (LED) 34, essentially as previously described. Said. LED package 58A also includes a polymer lens 66 on substrate 32 or 32A that encapsulates LED system 30 or 30A. In this embodiment, the polymer lens 66 also includes a phosphor layer 62 for producing white light.

In FIG. 11C, LED package 58C includes substrate 32 or 32A, special application integrated circuit (ASIC) die 36, and light emitting diode (LED) 34, essentially as previously described. In this embodiment, the substrate 32 or 32A also includes a reflective recess 64 in which a special application integrated circuit (ASIC) die 36 and a light emitting diode (LED) 34 are mounted.

Referring to Figure 12, a simplified circuit diagram of an LED integrated circuit 68 formed by LED system 30 or 30A is illustrated. LED integrated circuit 68 includes contacts 46 on substrate 32 or 32A. The LED integrated circuit 68 also includes a special application integrated circuit 38 in a special application integrated circuit (ASIC) die 36. The LED integrated circuit 68 also includes a light emitting diode 34. Since the LED integrated circuit 68 has integrated component power consumption, the heat generation is less than the prior art LED system 10 (Fig. 1). In addition, the LED system 30 or 30A can be made smaller to provide a wafer level system.

Referring to FIG. 14, a light emitting diode (LED) system 30WCD can include at least one light emitting diode (LED) 34 and a wireless control system 100. Each of the light emitting diodes (LEDs) 34 provides illumination within a region 108 thereof. The wireless control system 100 is configured to control a light emitting diode (LED) 34. The wireless control system 100 includes at least one transceiver component 102 and a wireless control component 104. Each of the transceiver elements 102 can be signally coupled to its corresponding light emitting diode (LED) 34. The wireless control component 104 can be manipulated by the user 110 to transmit a signal 106 to each of the transceiver components 102 for manipulation of each of the light emitting diodes (LEDs) 34, as will be described herein when the signal 106 is transmitted from the wireless control component 104. Each transceiver component 102 can be defined as an input signal. The wireless control component 104 can also be manipulated by the user 110 to receive a signal 106 from each of the transceiver components 102 for displaying the status of each of the light emitting diodes (LEDs) 34, as will be explained herein, when the signal 106 is from each of the transceiver components The transmission 102 to the wireless control component 104 can be defined as a status signal.

In one embodiment, the light emitting diode (LED) system 30WCD can also be a general lighting system that includes at least one lighting component and a wireless control system. Each lighting element provides illumination in one of its areas. Wireless control system A signal connection is made to each lighting element and each lighting element is controlled. The wireless control system further includes at least one transceiver component and a wireless control component. Each transceiver component can be individually signaled to its corresponding illumination component. The wireless control element sends an input signal to each of the transceiver elements for controlling each of the lighting elements and receives a status signal from each of the transceiver elements for displaying the status of each of the lighting elements.

The transceiver component 102 can include a wireless communication component for signal connection to each of the light emitting diodes (LEDs) 34 via wireless communication. Alternatively, the transceiver component 102 can also include an electrical connection component for electrical connection to each of the light emitting diodes (LEDs) 34 via electrical connections. For example, a light emitting diode (LED) 34 can include an integrated transceiver component 102 as a complete device. Similarly, the transceiver component 102 can also include a separate component and be used separately from its corresponding light emitting diode (LED) 34. The transceiver component 102 can also control one or more LEDs 34, but Not limited to this. Each transceiver component 102 receives an input signal 106 transmitted from the wireless control component 104 for controlling each of the light emitting diodes (LEDs) 34. In addition, each transceiver element 102 also transmits a status signal 106 to the wireless control element 104 for displaying the status of each of the light emitting diodes (LEDs) 34.

The wireless control component 104 can include a stand-alone unit or a mobile communication device such as a mobile phone, a smart phone, a portable tablet, "IPAD" or "IPHONE", but is not limited thereto. The wireless control component 104 can also include an input device, such as a keyboard, for receiving input from the user 110 and controlling the signal 106. Display component 114 can display status information for wireless control component 104 and each of the light emitting diodes (LEDs) 34. Additionally, the wireless control component 104 can also include an automatic input device, such as an automation program 116, for controlling the signal 106. The wireless control component 104 or automation program 116 may also be protected by a password such that only authorized users 110 may initiate or provide input to the wireless control component 104. For example, the signal 106 can initiate the switching state of each of the light emitting diodes (LEDs) 34 separately or simultaneously, and can also control the brightness and color of each of the light emitting diodes (LEDs) 34 separately or simultaneously, but not Limited. In addition, the automation program 116 can also provide a graphical program for controlling each of the light emitting diodes (LEDs) 34. Still further, the automation program 116 and the display component 114 can display the status of each of the light emitting diodes (LEDs) 34, such as on/off, Dimming level or color level, but not limited to this.

A control method for a light emitting diode (LED) system 30WCD may include the steps of: providing at least one light emitting diode (LED) 34 to illuminate an area 108; providing at least one transceiver component 102 by corresponding to a signal 106 A light emitting diode (LED) 34 is used for signal connection; a wireless control component 104 is provided for signal connection with the transceiver component 102, and an input signal 106 is transmitted to the transceiver component 102 for controlling the light emitting diode (LED) 34, and Transceiver element 102 receives status signal 106 for displaying the status of each of the light emitting diodes (LEDs) 34. In an embodiment, a method of controlling a light emitting diode (LED) system 30WCD may further comprise the steps of: receiving an input signal 106 transmitted from the wireless control component 104 to each of the transceiver components 102 for controlling each of the two illuminations A polar body (LED) 34; receives a status signal 106 sent from each transceiver element 102 to the wireless control element 104 for displaying the status of each of the light emitting diodes (LEDs) 34. In addition, the above control method may also include the steps of using the automation program 116 to control the wireless control component 104, and the step of using the password to turn on the wireless control component 104, but not limited thereto.

As such, the present specification discloses an improved LED system. Although some illustrative embodiments and embodiments have been described above, those skilled in the art will recognize certain modifications, changes, additions, and sub-combinations. Accordingly, the scope of the appended claims and the scope of the appended claims are intended to cover all such modifications, changes, additions and sub-combinations.

10‧‧‧LED system

12‧‧‧LED driver IC

14‧‧‧Light Emitting Diode Wafer

30‧‧‧LED system

30A‧‧‧LED system

32‧‧‧Substrate

32A‧‧‧Substrate

34‧‧‧Lighting diode

34A‧‧‧First Light Emitting Diode

34B‧‧‧Second light-emitting diode

34C‧‧‧ Third Light Emitting Diode

34D‧‧‧4th LED

36‧‧‧Special application integrated circuit die

38‧‧‧Special application integrated circuit

40‧‧‧ wire

Section 42‧‧‧

44‧‧‧Special application integrated circuit

46‧‧‧Contacts

48‧‧‧ Back side

50‧‧‧Interconnects

52‧‧‧Interconnects

54‧‧‧ die attach layer

56‧‧‧ wire bonding line

58A‧‧‧LED package

58B‧‧‧LED package

58C‧‧‧LED package

60‧‧‧Fluorescent layer

62‧‧‧Fluorescent layer

64‧‧‧Reflective recess

66‧‧‧Polymer lenses

68‧‧‧LED integrated circuit

72‧‧‧ element substrate

74‧‧‧Vertical LED dies

76‧‧‧Electrically insulated transparent passivation layer

78‧‧‧ cavity

80‧‧‧ Back side

82‧‧‧Electrical bonding layer

84‧‧‧First metal

86‧‧‧Second metal

88‧‧‧p-type semiconductor layer

90‧‧‧Multiple Quantum Wells

92‧‧‧n type semiconductor layer

94‧‧‧Wired packaged wire

30WCD‧‧‧Lighting diode system

100‧‧‧Wireless Control System

102‧‧‧Transceiver components

104‧‧‧Wireless control components

106‧‧‧ signal

108‧‧‧Area

110‧‧‧Users

112‧‧‧ Input components

114‧‧‧Display components

116‧‧‧Automation program

The illustrative embodiments will be elucidated with reference to the drawings. The embodiments and the figures disclosed herein are illustrative and not restrictive.

1 is a circuit diagram of a prior art LED system.

2 is a schematic plan view of an LED system having integrated components and intelligent functions.

3 is a schematic plan view of an LED system with additional functionality built into a semiconductor substrate.

4 is a schematic bottom view of an LED system showing circuitry on a substrate; and FIG. 5 is a schematic plan view of an LED system equivalent to FIG.

5A is a schematic side elevational view of FIG. 5 illustrating a first application configuration of a special application integrated circuit (ASIC) and a light emitting diode (LED) wafer on a substrate.

5B is a schematic side elevational view of FIG. 5 illustrating a second application configuration of a special application integrated circuit (ASIC) and a light emitting diode (LED) wafer on a substrate.

Figure 6 is a schematic plan view of an LED system with additional functionality, equivalent to Figure 3.

Figure 6A is a schematic side elevational view of Figure 6 illustrating a first application configuration of a special application integrated circuit (ASIC) and a light emitting diode (LED) wafer on a substrate.

Figure 6B is a schematic side elevational view of Figure 6 illustrating a second application configuration of a special application integrated circuit (ASIC) and a light emitting diode (LED) wafer on a substrate.

Figure 7 is a schematic plan view of an LED system equivalent to Figure 2 or Figure 3.

7A is a schematic circuit diagram of the LED system of FIG. 7.

Figure 8 is a schematic plan view of an LED system having multiple LED wafers in series electrical connection.

Figure 8A is a schematic circuit diagram of the LED system of Figure 8.

Figure 9 is a schematic plan view of an LED system having multiple LED chip parallel electrical connections.

9A is a schematic circuit diagram of the LED system of FIG. 9.

Figure 10 is a simplified circuit diagram of a special application integrated circuit (ASIC) for an LED system.

Figure 10A is a circuit diagram of a first output configuration of a special application integrated circuit (ASIC) for an LED system.

Figure 10B is a circuit diagram of a second output configuration of a special application integrated circuit (ASIC) for an LED system.

Figure 11A is a schematic cross-sectional view of a first sealed package of an LED system.

Figure 11B is a schematic cross-sectional view of a second sealed package of the LED system.

Figure 11C is a schematic cross-sectional view of a third sealed package of the LED system.

Figure 12 is a circuit diagram of an LED integrated circuit formed by an LED system.

Figure 13 is a schematic cross-sectional view of a light emitting diode (LED) of an LED system.

Figure 14 is a schematic cross-sectional view of an LED system including a transceiver component and a wireless control component.

30WCD‧‧‧Lighting diode system

34‧‧‧Lighting diode

100‧‧‧Wireless Control System

102‧‧‧Transceiver components

104‧‧‧Wireless control components

106‧‧‧ signal

108‧‧‧Area

110‧‧‧Users

112‧‧‧ Input components

114‧‧‧Display components

116‧‧‧Automation program

Claims (20)

An illumination system comprising: at least one illumination element, wherein each illumination element provides illumination in an area thereof, respectively; and a wireless control system operatively coupled to each of the illumination elements and controlling each of the illumination elements, The wireless control system further includes: at least one transceiver component, wherein each of the transceiver components can be respectively connected to the corresponding lighting component; and a wireless control component that transmits an input signal to each transceiver component for control Each lighting element receives a status signal from each of the transceiver elements for displaying the status of each lighting element. The illumination system of claim 1, wherein each of the illumination elements comprises a light emitting diode (LED). The lighting system of claim 2, wherein the wireless control component further comprises a computer or a mobile communication device, wherein the computer and the mobile communication device respectively comprise: an input component that receives input from a user; And a display element that displays the status of each of the light emitting diodes (LEDs) to the user. The illumination system of claim 3, wherein the computer or the mobile communication device is controllable by an automated program for controlling the input signal and the status signal. The lighting system of claim 4, wherein the automated program is readable by a user for opening. The illumination system of claim 5, wherein each of the transceiver elements is disposed on the corresponding LED (LED). The illumination system of claim 5, wherein each of the transceiver elements comprises a separate component. A light emitting diode (LED) system comprising: at least one light emitting diode (LED), wherein each light emitting diode (LED) respectively Providing illumination in an area thereof; and a wireless control system that controls each of the light emitting diodes (LEDs), wherein the wireless control system further comprises: at least one transceiver component, wherein each of the transceiver components can respectively correspond thereto a light emitting diode (LED) for signal connection; and a wireless control component further comprising an input component and a display component, wherein the wireless control component transmits an input signal to each of the transceiver components relative to an input from the input component For controlling each of the light emitting diodes (LEDs), and receiving a status signal is displayed on the display element for displaying the state of each of the light emitting diodes (LEDs). The light emitting diode (LED) system of claim 8, wherein the wireless control component further comprises a computer. The light emitting diode (LED) system of claim 8, wherein the wireless control component further comprises a mobile communication device. A light emitting diode (LED) system as claimed in claim 8 wherein the wireless control component is controllable by an automated program for controlling the input signal and the status signal. A light emitting diode (LED) system as claimed in claim 8 wherein the wireless control element is readable by a user for opening. The light emitting diode (LED) system of claim 8, wherein each of the transceiver elements is electrically connected to the corresponding light emitting diode (LED). The light emitting diode (LED) system of claim 8, wherein each of the transceiver elements is wirelessly connected to the corresponding light emitting diode (LED). A method for controlling a light emitting diode (LED) system, comprising the steps of: providing at least one light emitting diode (LED) illumination region; providing at least one transceiver component by receiving an input signal and a status signal corresponding thereto The light emitting diode (LED) is signally connected; a wireless control component is provided for signal connection with the transceiver component, and the input signal is transmitted to the transceiver component for controlling the light emitting diode (LED), and The transceiver component receives the status signal for display each a state of a light emitting diode (LED); receiving the input signal transmitted from the wireless control element to each of the transceiver elements for controlling each of the light emitting diodes (LEDs); and receiving the sending from each of the transmitting and receiving elements The status signal of the wireless control element is for displaying the status of each of the light emitting diodes (LEDs). The control method of claim 15, wherein the wireless control component uses an automated program. The control method of claim 15, wherein the wireless control component uses a password. The control method of claim 15, wherein the wireless control component further comprises: an input component that receives a user input; and a display component that displays a state of each of the light emitting diodes (LEDs) To the user. The control method of claim 15, wherein the wireless control component further comprises a computer or a mobile communication device. The control method of claim 15, wherein the wireless control component is controllable by an automated program for controlling the input signal and the status signal.