TW201421526A - Charged-particle radiation apparatus - Google Patents

Charged-particle radiation apparatus Download PDF

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TW201421526A
TW201421526A TW102134772A TW102134772A TW201421526A TW 201421526 A TW201421526 A TW 201421526A TW 102134772 A TW102134772 A TW 102134772A TW 102134772 A TW102134772 A TW 102134772A TW 201421526 A TW201421526 A TW 201421526A
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defect
image
control unit
processing
images
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TW102134772A
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TWI553688B (en
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Takehiro Hirai
Ryo Nakagaki
Kenji Obara
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Hitachi High Tech Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical or photographic arrangements associated with the tube
    • H01J37/222Image processing arrangements associated with the tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24592Inspection and quality control of devices

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The present invention is a charged-particle radiation apparatus provided with a defect observation device for observing defects on a sample, the apparatus being provided with a control unit and a display unit, the control unit performing drift-correction processing according to a plurality of correction conditions on at least one image obtained by the defect-observation device, and the plurality of correction conditions and a plurality of corrected images on which drift-correction processing has been performed are associated and displayed on the display unit as a first screen.

Description

帶電粒子束裝置 Charged particle beam device

本發明係有關具備半導體裝置的缺陷觀察裝置之帶電粒子束裝置。 The present invention relates to a charged particle beam device including a defect observation device of a semiconductor device.

半導體製造中為了確保高良率,早期發現製造工程中發生的缺陷並施行對策係十分重要。近年來隨著半導體的微細化,對其良率造成影響的缺陷亦多樣化,應列為觀察對象的製造工程亦在增加。舉例來說,愈來愈多的案例顯示,由於使試料帶電而造成可能發生像漂移(drift)之製造工程,會成為缺陷觀察的對象工程。 In order to ensure high yields in semiconductor manufacturing, it is important to detect defects occurring in manufacturing engineering and implement countermeasures at an early stage. In recent years, with the miniaturization of semiconductors, the defects affecting the yield are also diversified, and the manufacturing engineering to be observed is also increasing. For example, more and more cases show that manufacturing engineering that may cause drift like the charging of the sample becomes the object of defect observation.

SEM(Scanning Electron Microscope)式缺陷觀察裝置,係為用來觀察這類多種多樣缺陷之裝置,一般而言係針對前面順位的缺陷檢査裝置所檢測出之缺陷位置圖像,以比前面順位的缺陷檢査裝置還高畫質來觀察。具體而言,是將試料平台移動前面順位的缺陷檢査裝置所輸出之缺陷座標,以觀察對象之缺陷會落入視野內的程度的低倍率拍攝,來查明正確的缺陷位置,接著移動試料平台、或是移動拍攝中心讓缺陷位置來到視野中心,再以適 於缺陷觀察的高倍率來取得觀察用之圖像。像這樣以低倍率圖像來查明缺陷位置的理由在於,前面順位的缺陷檢査裝置所輸出之缺陷座標中,會於裝置規格範圍內含有誤差,故在以SEM式缺陷觀察裝置取得高畫質缺陷圖像時,必須要有用來修正該誤差之處理。取得高畫質缺陷圖像的工程之自動化技術,便是ADR(Automatic Defect Review/Redetection)。 SEM (Scanning Electron Microscope) type defect observation device is a device for observing such various defects, generally for the defect position image detected by the defect inspection device of the previous position, with a defect than the previous position The inspection device is also of high quality for observation. Specifically, the defect coordinates outputted by the defect inspection device that moves the sample platform in front of the position are photographed at a low magnification to observe the extent that the defect of the object falls within the field of view to find the correct defect position, and then move the sample platform. Or move the shooting center to let the defect position come to the center of the field of view, and then The image for observation is obtained at a high magnification of defect observation. The reason why the defect position is ascertained by the low-magnification image as described above is that the defect coordinates outputted by the defect inspection device of the front-order position contain an error within the device specification range, so that the SEM-type defect observation device achieves high image quality. In the case of a defective image, there must be a process for correcting the error. The engineering automation technology for obtaining high-definition defect images is ADR (Automatic Defect Review/Redetection).

ADR當中,因應前面順位的缺陷檢査裝置的缺陷座標檢測精度或試料特性,必須將低倍率圖像的取得條件、高倍率圖像的取得條件等予以最佳化,以便兼顧ADR的缺陷檢測率和包含圖像取得時間在內的ADR產能;但一般而言,ADR的缺陷檢測率和產能是互為取捨(trade-off)的關係,故就算對經驗豐富的熟練者來說,要決定最佳條件仍是件困難的作業,期盼使最佳條件設定作業變得容易。 In the ADR, it is necessary to optimize the acquisition conditions of the low-magnification image and the acquisition conditions of the high-magnification image in order to balance the defect detection rate of the ADR with the defect coordinate detection accuracy or the sample characteristics of the defect inspection device of the previous position. ADR capacity including image acquisition time; but in general, ADR's defect detection rate and capacity are trade-off relationships, so even for experienced programmers, it is best to decide the best. The condition is still a difficult job, and it is expected to make the optimal condition setting work easier.

此外,以高畫質取得之缺陷圖像為依據而查明缺陷種類的作業之自動化技術即ADC(Automatic Defect Classification)亦開始實用化,特別是在生產線中,運用ADC的工程逐漸擴大。ADC中,ADC的缺陷分類正確率與包含圖像取得時間在內的ADC產能同樣也是互為取捨的關係,故決定最佳條件是件困難的作業,期盼使最佳條件設定作業變得容易。 In addition, the automatic technology (ADC), which is an automation technology for identifying defects, based on the defect image obtained with high image quality, has also begun to be put into practical use. Especially in the production line, the engineering using ADC has been gradually expanded. In the ADC, the defect classification accuracy of the ADC is also a trade-off relationship with the ADC capacity including the image acquisition time. Therefore, it is difficult to determine the optimal condition, and it is expected to make the optimal condition setting easy. .

專利文獻1中揭示一種技術,其在掃描電子顯微鏡中,取得複數張掃描觀察視野而得到之畫格 (frame)圖像,並算出各畫格圖像間的漂移量,然後修正漂移量且將畫格圖像疊合,藉此,即使發生像漂移的情形下仍可得到鮮明的圖像。 Patent Document 1 discloses a technique in which a plurality of scanning observation fields are obtained in a scanning electron microscope. The image is framed, and the amount of drift between the image frames is calculated, and then the amount of drift is corrected and the frame image is superimposed, whereby a sharp image can be obtained even in the case of image drift.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕國際公開2010/070815號手冊 [Patent Document 1] International Publication No. 2010/070815

然而,專利文獻1之技術,是以進行自動測長的情形下的像漂移為對象。專利文獻1當中,雖然能夠穩定地算出高倍率圖像中的測長值,但若運用在缺陷觀察裝置的情形下,會產生以下問題。 However, the technique of Patent Document 1 is directed to image drift in the case of performing automatic length measurement. In Patent Document 1, although the length measurement value in the high-magnification image can be stably calculated, when the defect observation device is used, the following problem occurs.

專利文獻1所設想之,以製造圖樣的自動測長為目的之掃描電子顯微鏡當中,使用者會依每種樣品或製程參數(recipe)來設定測長對象之製造圖樣,在一種樣品或製程參數內,測長對象之製造圖樣的種類是有限的。亦即,在自動測長當中,是在事先決定好的座標,對事先決定好的製造圖樣予以測長,故例如在樣品之間,最佳參數不會變動。 According to Patent Document 1, in the scanning electron microscope for the purpose of manufacturing the automatic length measurement of the pattern, the user sets the manufacturing pattern of the length measuring object according to each sample or process recipe, in a sample or process parameter. Inside, the type of manufacturing pattern of the length measuring object is limited. That is, in the automatic length measurement, the coordinates determined in advance are measured, and the predetermined manufacturing pattern is measured, so that the optimum parameters do not change, for example, between samples.

相對於此,SEM式缺陷觀察裝置當中,由於會取得前面順位的缺陷檢査裝置所檢測出之缺陷位置圖像,故因缺陷位置不同,應取得之座標及製造圖樣會變 動。是故,就算是在同一樣品或製程參數內,應取得之座標位置及製造圖樣也會多種多樣。如此一來,在取得之圖像中,由於帶電造成的像漂移之程度也會因每種製造圖樣等而變化,故最佳參數的設定成為問題。以往,會發生像漂移的製造工程甚少成為缺陷觀察對象,但近年來由於半導體的微細化或製造工程的複雜化,針對會發生像漂移的製造工程,也逐漸有必要藉由SEM式缺陷觀察裝置來取得高畫質的缺陷圖像,並分析缺陷。 On the other hand, in the SEM type defect observation apparatus, since the defect position image detected by the defect inspection apparatus of the front position is obtained, the coordinates and the manufacturing pattern to be obtained may vary depending on the position of the defect. move. Therefore, even within the same sample or process parameters, the coordinates and manufacturing drawings to be obtained can be varied. As a result, in the acquired image, since the degree of image drift due to charging changes due to each manufacturing pattern or the like, the setting of the optimum parameter becomes a problem. In the past, manufacturing processes such as drift have rarely become defects. However, in recent years, due to the miniaturization of semiconductors and the complication of manufacturing engineering, it is necessary to observe SEM-based defects for manufacturing processes where image drift occurs. The device is used to obtain high-definition defect images and analyze defects.

本發明乃有鑑於此一狀況而研發,係提供一種技術,是在具備缺陷觀察裝置的帶電粒子束裝置中,即使發生像漂移的情形下,仍能容易地決定觀察圖像的最佳參數條件。 The present invention has been developed in view of such a situation, and provides a technique for easily determining the optimum parameter condition of an observed image even in the case where image drift occurs in a charged particle beam device including a defect observation device. .

為了解決上述課題,例如採用申請專利範圍所記載之構成。本申請案包括複數種解決上述問題之手段,若要舉出一例,則是提供一種帶電粒子束裝置,具備觀察試料上的缺陷之缺陷觀察裝置,該帶電粒子束裝置,其特徵為,具備:控制部;及顯示部;前述控制部,係針對以前述缺陷觀察裝置取得的1張以上圖像,以複數個修正條件執行漂移修正處理,將前述複數個修正條件、及執行前述漂移修正處理後的複數個修正圖像建立對應,並顯示於前述顯示部以作為第1畫面。 In order to solve the above problems, for example, the configuration described in the scope of the patent application is adopted. The present application includes a plurality of means for solving the above problems, and an example of the present invention provides a charged particle beam device including a defect observation device for observing defects on a sample, the charged particle beam device having: a control unit; and a control unit that performs a drift correction process on a plurality of correction conditions on the one or more images acquired by the defect observation device, and performs the plurality of correction conditions and the drift correction process The plurality of corrected images are associated and displayed on the display unit as the first screen.

按照本發明,在具備缺陷觀察裝置的帶電粒子束裝置中,即使發生像漂移的情形下,仍能容易地決定觀察圖像的最佳參數條件。 According to the present invention, in the charged particle beam device including the defect observation device, even when the image drift occurs, the optimum parameter condition of the observed image can be easily determined.

本發明相關之其他特徴,由本說明書敍述、所附圖面便可明瞭。此外,上述以外的問題、構成及效果,將藉由以下實施例之說明而明瞭。 Other features related to the present invention will be apparent from the description and the drawings. In addition, the problems, configurations, and effects other than the above will be apparent from the description of the embodiments below.

101‧‧‧電子槍 101‧‧‧Electronic gun

102‧‧‧鏡頭 102‧‧‧ lens

103‧‧‧掃描偏向器 103‧‧‧Scan deflector

104‧‧‧對物透鏡 104‧‧‧object lens

105‧‧‧試料 105‧‧‧ samples

106‧‧‧平台 106‧‧‧ platform

107‧‧‧一次電子束 107‧‧‧One electron beam

108‧‧‧二次粒子 108‧‧‧ secondary particles

109‧‧‧二次粒子檢測器 109‧‧‧Secondary particle detector

110‧‧‧電子光學系統控制部 110‧‧‧Electronic Systems Control Department

111‧‧‧A/D變換部 111‧‧‧A/D conversion department

112‧‧‧平台控制部 112‧‧‧ Platform Control Department

113‧‧‧全體控制部及分析部 113‧‧‧All Control Department and Analysis Department

114‧‧‧圖像處理部 114‧‧‧Image Processing Department

115‧‧‧操作部 115‧‧‧Operation Department

116‧‧‧記憶裝置 116‧‧‧ memory device

117‧‧‧光學式顯微鏡 117‧‧‧Optical microscope

201‧‧‧操作/分析部 201‧‧‧Operation/Analysis Department

202‧‧‧缺陷資料記憶部 202‧‧‧Defect Data Memory Department

203‧‧‧圖像資料記憶部 203‧‧‧Image Data Memory Department

204‧‧‧分析參數記憶部 204‧‧‧Analytical parameter memory

205‧‧‧分析結果資料記憶部 205‧‧‧Analysis Results Data Memory Department

〔圖1〕本發明SEM式缺陷觀察裝置的全體構成示意模型圖。 Fig. 1 is a schematic model view showing the overall configuration of a SEM type defect observation apparatus of the present invention.

〔圖2〕圖1的全體控制部及分析部詳細圖示意圖。 FIG. 2 is a detailed schematic view of the entire control unit and the analysis unit of FIG. 1. FIG.

〔圖3〕像漂移修正的概念圖。 [Fig. 3] A conceptual diagram of the image drift correction.

〔圖4〕第1實施例之畫格累計張數的設定處理流程圖。 Fig. 4 is a flow chart showing the process of setting the number of frames accumulated in the first embodiment.

〔圖5〕用來進行畫格圖像的累計張數最佳化設定之GUI一例,為圖4步驟403中顯示之畫面的第1例。 [Fig. 5] An example of a GUI for optimizing the number of accumulated sheets of the frame image is the first example of the screen displayed in step 403 of Fig. 4 .

〔圖6〕用來進行畫格圖像的累計張數最佳化設定之GUI一例,為圖4步驟403中顯示之畫面的第2例。 [Fig. 6] An example of a GUI for optimizing the number of accumulated sheets of the frame image is a second example of the screen displayed in step 403 of Fig. 4 .

〔圖7〕第2實施例之條件設定處理流程圖,為兼顧ADR缺陷檢測率和產能之條件設定處理流程圖。 [Fig. 7] A flow chart of a condition setting process in the second embodiment, which is a process flow setting process for both ADR defect detection rate and throughput.

〔圖8〕用來兼顧ADR缺陷檢測率和產能之條件設定的GUI一例,為圖7步驟704中顯示之畫面例。 [Fig. 8] An example of a GUI for setting the condition of the ADR defect detection rate and the capacity, and is an example of a screen displayed in step 704 of Fig. 7.

〔圖9〕第3實施例之條件設定處理流程圖,為兼顧ADC分類正確率和產能之條件設定處理流程圖。 [Fig. 9] A flow chart of a condition setting process in the third embodiment, which is a process flow setting process that takes into consideration both the ADC classification accuracy rate and the throughput.

〔圖10〕用來兼顧ADC分類正確率和產能之條件設定的GUI一例,為圖9步驟904中顯示之畫面例。 [Fig. 10] An example of a GUI for setting the conditions of the ADC classification accuracy and productivity, and is an example of a screen displayed in step 904 of Fig. 9.

〔圖11〕第4實施例之條件設定處理流程圖,為兼顧ADR缺陷檢測率和產能、以及兼顧ADC分類正確率和產能之條件設定處理流程圖。 [Fig. 11] A flowchart of the condition setting processing of the fourth embodiment, which is a flowchart for setting a condition that takes into consideration both the ADR defect detection rate and the throughput, and the ADC classification accuracy and productivity.

以下參照所附圖面,說明本發明之實施例。另,所附圖面雖是遵照本發明原理而揭示具體的實施例,但它們係用來理解本發明,絕非用來限縮解釋本發明。 Embodiments of the present invention will be described below with reference to the drawings. In addition, the drawings are intended to be illustrative of the invention, and are not intended to limit the invention.

帶電粒子束裝置,是將帶有電子或陽離子等電荷的粒子(帶電粒子)在電場中加速,並照射至試料之裝置。帶電粒子束裝置是利用試料和帶電粒子之間的相互作用,來進行試料之觀察、分析、加工等。帶電粒子束裝置之例子,可舉出電子顯微鏡、電子束描繪裝置、離子加工裝置、離子顯微鏡等。在這些帶電粒子束裝置中,掃描型電子顯微鏡(SEM:Scanning Electron Microscope)是將電子照射至試料,並將電子和試料之間的相互作用檢測成為訊號,藉此進行微細構造觀察或構成元素分析之裝置。以下,作為具備缺陷觀察裝置的帶電粒子束裝置之一例,係講述SEM式缺陷觀察裝置。 The charged particle beam device is a device that accelerates an electric field (charged particles) having a charge such as an electron or a cation in an electric field and irradiates the sample. The charged particle beam device uses the interaction between the sample and the charged particles to observe, analyze, and process the sample. Examples of the charged particle beam device include an electron microscope, an electron beam drawing device, an ion processing device, and an ion microscope. In these charged particle beam apparatus, a scanning electron microscope (SEM) scans electrons to a sample, and detects an interaction between an electron and a sample as a signal, thereby performing fine structure observation or elemental analysis. Device. Hereinafter, as an example of a charged particle beam apparatus including a defect observation apparatus, an SEM type defect observation apparatus will be described.

以下,說明SEM式缺陷觀察裝置的構成例。 作為系統的一種構成例,係說明在SEM式缺陷觀察裝置中進行製程參數設定之例子,但系統構成並不限於此,構成系統的裝置的一部分或全部亦可以相異之裝置構成。舉例來說,本實施例之製程參數設定處理,亦可藉由與SEM式缺陷觀察裝置網路連接之製程參數管理裝置或缺陷自動分類裝置來進行。 Hereinafter, a configuration example of the SEM type defect observation device will be described. As an example of the configuration of the system, an example in which the process parameter setting is performed in the SEM type defect observation device will be described. However, the system configuration is not limited thereto, and some or all of the devices constituting the system may be configured as different devices. For example, the process parameter setting process of this embodiment may also be performed by a process parameter management device or a defect automatic classification device that is connected to the SEM type defect observation device.

所謂SEM式缺陷觀察裝置,是指以光學式或SEM式檢査裝置等前面順位的缺陷檢査裝置所檢測出之缺陷座標、或是以依據設計佈局(layout)資料而藉由模擬等所抽出之觀察點座標資訊來作為輸入資訊,以適於觀察或分析之條件,來取得缺陷或觀察座標的高畫質SEM圖像之裝置。 The SEM type defect observation device refers to a defect coordinate detected by a defect inspection device such as an optical or SEM type inspection device, or an observation obtained by simulation or the like according to design layout data. Point coordinate information is used as input information to obtain a high quality SEM image of a defect or observation coordinate, which is suitable for observation or analysis.

圖1為本實施例之SEM式缺陷觀察裝置的全體構成示意模型圖。圖1的SEM式缺陷觀察裝置,具備:電子槍101、鏡頭102、掃描偏向器103、對物透鏡104、試料105、二次粒子檢測器109等光學要素所構成之電子光學系統。 Fig. 1 is a schematic view showing the overall configuration of a SEM type defect observation apparatus of the present embodiment. The SEM type defect observation apparatus of FIG. 1 includes an electro-optical system including optical elements such as an electron gun 101, a lens 102, a scanning deflector 103, a counter lens 104, a sample 105, and a secondary particle detector 109.

此外,SEM式缺陷觀察裝置,具備:平台106,令保持作為觀察對象之試料105的試料台在XY面內移動;及電子光學系控制部110,控制該電子光學系統所包含之各種光學要素;及A/D變換部111,將二次粒子檢測器109的輸出訊號予以量子化;及平台控制部112,控制平台106。上述電子光學系統、電子光學系統控制部110、A/D變換部111、平台106、及平台控制部 112,係構成SEM圖像的拍攝手段亦即掃描電子顯微鏡(SEM)。此外,SEM式缺陷觀察裝置,亦可具備光學式顯微鏡117以作為前面順位的缺陷檢査裝置。 Further, the SEM type defect observation apparatus includes a stage 106 for moving a sample stage holding the sample 105 as an observation target in the XY plane, and an electro-optical system control unit 110 for controlling various optical elements included in the electro-optical system; The A/D conversion unit 111 quantizes the output signal of the secondary particle detector 109, and the platform control unit 112 controls the platform 106. The electronic optical system, the electro-optical system control unit 110, the A/D conversion unit 111, the platform 106, and the platform control unit 112 is a scanning electron microscope (SEM) which is a means for capturing an SEM image. Further, the SEM type defect observation device may be provided with an optical microscope 117 as a defect inspection device in front of the position.

又,SEM式缺陷觀察裝置,具備全體控制部及分析部113、圖像處理部114、操作部115、記憶裝置116。操作部115具備顯示器(顯示部)、鍵盤、滑鼠等。在記憶裝置116,存儲有藉由SEM取得之圖像。 Further, the SEM type defect observation device includes the entire control unit and the analysis unit 113, the image processing unit 114, the operation unit 115, and the memory device 116. The operation unit 115 includes a display (display unit), a keyboard, a mouse, and the like. In the memory device 116, an image obtained by SEM is stored.

SEM式缺陷觀察裝置中,從電子槍101發射的一次電子束(primary electron beam)107,會在鏡頭102收斂,並在掃描偏向器103偏向。又,一次電子束107在掃描偏向器103偏向後,會在對物透鏡104收斂,而照射至試料105。 In the SEM type defect observation apparatus, a primary electron beam 107 emitted from the electron gun 101 converges on the lens 102 and is deflected at the scanning deflector 103. Further, after the scanning electron deflector 103 is deflected by the scanning deflector 103, the primary electron beam 107 converges on the objective lens 104 and is irradiated to the sample 105.

從受到一次電子束107照射之試料105,會因應試料105的形狀或材質而產生二次電子或反射電子等二次粒子108。產生之二次粒子108,會在二次粒子檢測器109被檢測後,在A/D變換部111變換成數位訊號。有時會將變換成數位訊號的二次粒子檢測器109的輸出訊號,稱為圖像訊號。 The sample 105 irradiated with the primary electron beam 107 generates secondary particles 108 such as secondary electrons or reflected electrons depending on the shape or material of the sample 105. The generated secondary particles 108 are detected by the secondary particle detector 109, and then converted into digital signals by the A/D conversion unit 111. The output signal of the secondary particle detector 109, which is converted into a digital signal, is sometimes referred to as an image signal.

A/D變換部111的輸出訊號,會被輸出至圖像處理部114,圖像處理部114會形成SEM圖像。圖像處理部114使用生成的SEM圖像,執行漂移修正處理。此外,圖像處理部114亦可使用生成的SEM圖像,來執行各種各種圖像分析處理,如執行缺陷檢測等圖像處理之ADR處理、或將缺陷依種類別自動分類之ADC處理等。 The output signal of the A/D conversion unit 111 is output to the image processing unit 114, and the image processing unit 114 forms an SEM image. The image processing unit 114 performs a drift correction process using the generated SEM image. Further, the image processing unit 114 can also perform various kinds of image analysis processing using the generated SEM image, such as ADR processing for performing image processing such as defect detection, ADC processing for automatically classifying defects according to categories, and the like.

鏡頭102、掃描偏向器103、對物透鏡104等電子光學系統之控制,是由電子光學系統控制部110執行。此外,試料105之位置控制,是由受到平台控制部112控制的平台106執行。全體控制部及分析部113,係為統括控制SEM式缺陷觀察裝置全體之控制部,其處理來自具備顯示器、鍵盤、滑鼠等之操作部115及記憶裝置116的輸入資訊,控制電子光學系統控制部110、平台控制部112、圖像處理部114等,並視必要將處理結果輸出至操作部115中包含之顯示部或記憶裝置116。 The control of the electron optical system such as the lens 102, the scanning deflector 103, and the objective lens 104 is performed by the electro-optical system control unit 110. Further, the position control of the sample 105 is performed by the platform 106 controlled by the platform control unit 112. The overall control unit and the analysis unit 113 are control units that collectively control the entire SEM type defect observation device, and process input information from the operation unit 115 and the memory device 116 including a display, a keyboard, a mouse, and the like, and control the electronic optical system control. The unit 110, the platform control unit 112, the image processing unit 114, and the like output the processing result to the display unit or the memory device 116 included in the operation unit 115 as necessary.

圖像處理部114、全體控制部及分析部113,係藉由電腦等資訊處理裝置而構成。舉例來說,全體控制部及分析部113,是由CPU、記憶部(例如記憶體及硬碟等)、及具備顯示器、鍵盤、滑鼠等之操作部115所構成。在此情形下,全體控制部及分析部113能夠藉由軟體來實現,能藉由CPU執行所需演算處理的程式來實現。同樣地,圖像處理部114亦能藉由軟體來實現。另,圖像處理部114、全體控制部及分析部113,可由個別的資訊處理裝置來構成,亦可由一個資訊處理裝置來構成。 The image processing unit 114, the overall control unit, and the analysis unit 113 are configured by an information processing device such as a computer. For example, the overall control unit and the analysis unit 113 are constituted by a CPU, a storage unit (for example, a memory and a hard disk), and an operation unit 115 including a display, a keyboard, a mouse, and the like. In this case, the overall control unit and the analysis unit 113 can be realized by software, and can be realized by a program in which the CPU executes a required arithmetic process. Similarly, the image processing unit 114 can also be implemented by software. Further, the image processing unit 114, the overall control unit, and the analysis unit 113 may be configured by individual information processing devices, or may be configured by one information processing device.

此外,圖像處理部114、全體控制部及分析部113中執行之處理,亦可以硬體方式來實現。藉由硬體執行的情形下,可將執行處理的複數個演算器積聚於配線基板上、或半導體晶片乃至於封裝內,藉此實現。 Further, the processing executed by the image processing unit 114, the entire control unit, and the analysis unit 113 may be implemented in a hardware manner. In the case of hardware execution, a plurality of actuators performing processing can be accumulated on a wiring substrate, or a semiconductor wafer or a package, thereby realizing.

圖2揭示圖1的全體控制部及分析部113之詳細圖。圖2所示之操作/分析部201,係為將圖1之全 體控制部及分析部113和操作部115予以整合表現之物。 FIG. 2 shows a detailed view of the overall control unit and the analysis unit 113 of FIG. 1. The operation/analysis unit 201 shown in FIG. 2 is the whole of FIG. The body control unit, the analysis unit 113, and the operation unit 115 integrate and express the objects.

操作/分析部201,具備缺陷資料記憶部202、圖像資料記憶部203、分析參數記憶部204、分析結果資料記憶部205。缺陷資料記憶部202、圖像資料記憶部203、分析參數記憶部204、分析結果資料記憶部205,亦可由構成全體控制部及分析部113之資訊處理裝置的硬碟來構成。此外,當操作/分析部201組裝於圖1所示SEM式缺陷觀察裝置的情形下,缺陷資料記憶部202、圖像資料記憶部203、分析參數記憶部204、及分析結果資料記憶部205,亦可整合在圖1之記憶裝置116中。 The operation/analysis unit 201 includes a defect data storage unit 202, an image data storage unit 203, an analysis parameter storage unit 204, and an analysis result data storage unit 205. The defect data storage unit 202, the image data storage unit 203, the analysis parameter storage unit 204, and the analysis result data storage unit 205 may be configured by a hard disk constituting the information processing device of the entire control unit and the analysis unit 113. Further, when the operation/analysis unit 201 is assembled in the SEM type defect observation apparatus shown in FIG. 1, the defect data storage unit 202, the image data storage unit 203, the analysis parameter storage unit 204, and the analysis result data storage unit 205, It can also be integrated in the memory device 116 of FIG.

在缺陷資料記憶部202,存儲有前面順位的檢查裝置中所檢測出之缺陷座標等缺陷資訊。在圖像資料記憶部203,存儲有以SEM式缺陷觀察裝置拍攝之缺陷圖像。此處,缺陷圖像亦可包含以缺陷檢査裝置拍攝之低倍率圖像、及ADR處理後的高倍率圖像。在分析參數記憶部204,存儲有圖像取得或圖像分析時所執行之複數個執行條件(複數個參數)。複數個執行條件的例子,有畫格的累計張數、加速電壓的電壓值、探針電流的電流值等參數。此外,複數個執行條件,亦可存儲有ADR條件、ADC條件等參數。在分析結果資料記憶部205,存儲有操作/分析部201之處理結果資料。舉例來說,在分析結果資料記憶部205,存儲有以複數個執行條件處理之圖像、或藉由各執行條件處理時之處理時間或產能資訊等。 The defect data storage unit 202 stores defect information such as defect coordinates detected by the inspection device of the previous order. The image data storage unit 203 stores a defective image captured by the SEM type defect observation device. Here, the defective image may include a low-magnification image captured by the defect inspection device and a high-magnification image after the ADR process. The analysis parameter storage unit 204 stores a plurality of execution conditions (a plurality of parameters) executed when image acquisition or image analysis is performed. Examples of a plurality of execution conditions include parameters such as the cumulative number of frames, the voltage value of the acceleration voltage, and the current value of the probe current. In addition, a plurality of execution conditions may also store parameters such as ADR conditions and ADC conditions. The analysis result data storage unit 205 stores the processing result data of the operation/analysis unit 201. For example, the analysis result data storage unit 205 stores an image processed by a plurality of execution conditions, or processing time or capacity information when processed by each execution condition.

操作/分析部201,會因應來自操作部115的操作指示,藉由組裝於全體控制部及分析部113的CPU,執行規定程式。如此一來,操作/分析部201便能實現複數個功能。舉例來說,操作/分析部201會從缺陷資料記憶部202取得缺陷資訊,從圖像資料記憶部203取得缺陷圖像。接著,操作/分析部201會從分析參數記憶部204取得複數個執行條件,針對各執行條件對缺陷圖像執行處理。操作/分析部201會將執行處理後的圖像等資訊存儲於分析結果資料記憶部205。 The operation/analysis unit 201 executes a predetermined program by the CPUs incorporated in the entire control unit and the analysis unit 113 in response to an operation instruction from the operation unit 115. In this way, the operation/analysis unit 201 can implement a plurality of functions. For example, the operation/analysis unit 201 acquires the defect information from the defect data storage unit 202, and acquires the defect image from the image data storage unit 203. Next, the operation/analysis unit 201 acquires a plurality of execution conditions from the analysis parameter storage unit 204, and performs processing on the defective image for each execution condition. The operation/analysis unit 201 stores information such as an image after execution of the processing in the analysis result data storage unit 205.

另,並不限於將圖1所示之全體控制部及分析部113組裝於SEM式缺陷觀察裝置之構成,亦可獨立於圖1所示SEM式缺陷觀察裝置之外,來構成圖2所示之操作/分析部201。在此情形下,SEM式缺陷觀察裝置與操作/分析部201,例如是透過網路而連接。 Further, the configuration in which the entire control unit and the analysis unit 113 shown in FIG. 1 are incorporated in the SEM type defect observation device is not limited, and may be configured as shown in FIG. 2 independently of the SEM type defect observation device shown in FIG. 1 . Operation/analysis unit 201. In this case, the SEM type defect observation device and the operation/analysis unit 201 are connected, for example, through a network.

圖3為像漂移修正的概念圖。此處,說明對發生漂移的三張第1畫格圖像301、第2畫格圖像302、第3畫格圖像303執行漂移修正之例子。首先,以第2畫格圖像302為基準,算出第1畫格圖像301的漂移量,並依算出之漂移量相對應的量來將疊合位置錯開而累計(304)。同樣地,以第2畫格圖像302為基準,算出第3畫格圖像303的漂移量,並依算出之漂移量相對應的量來將疊合位置錯開而累計(304)。考量算出之漂移量而將三張畫格圖像疊合之結果,便是畫格累計圖像304。 Figure 3 is a conceptual diagram of the image drift correction. Here, an example in which the drift correction is performed on the three first frame images 301, the second frame image 302, and the third frame image 303 in which the drift occurs will be described. First, the amount of drift of the first frame image 301 is calculated based on the second frame image 302, and the overlapping positions are shifted by the amount corresponding to the calculated amount of drift (304). Similarly, the amount of drift of the third frame image 303 is calculated based on the second frame image 302, and the overlapping positions are shifted by the amount corresponding to the calculated amount of drift (304). The result of superimposing the calculated drift amount and superimposing the three frame images is the frame cumulative image 304.

圖3之示例當中,係以第2畫格圖像302為 基準來算出漂移量,但亦可以最初取得的第1畫格圖像301為基準,亦可在連續的畫格圖像間反覆做算出漂移量之處理。此外,此處作為最終的漂移修正圖像305,是在畫格累計圖像304中,將共三張的畫格圖像301、302、303的共通部分切割出來,但亦可施以下述處理,即,對於所需圖像尺寸尚有不足的區域以特定的像素值填補,或是以從周邊像素值藉由圖像處理算出之像素值來填補不足的區域等。這些像漂移修正處理,是由圖像處理部114執行。另,像漂移修正處理,亦可由全體控制部及分析部113執行。 In the example of FIG. 3, the second frame image 302 is Although the amount of drift is calculated by the reference, the first frame image 301 obtained first may be used as a reference, and the process of calculating the amount of drift may be repeated between consecutive frame images. Further, here, as the final drift correction image 305, the common portion of the total of three frame images 301, 302, and 303 is cut out in the frame cumulative image 304, but the following processing may be applied. That is, the area where the required image size is insufficient is filled with a specific pixel value, or the area where the pixel value is calculated from the peripheral pixel value by image processing is used to fill the insufficient area. These image drift correction processing is executed by the image processing unit 114. Further, the image drift correction processing may be executed by the entire control unit and the analysis unit 113.

<第1實施例> <First Embodiment>

以下,說明SEM式缺陷觀察裝置中第1實施例之執行條件的最佳化處理。圖4為畫格圖像累計張數最佳化處理的流程圖。以下,作為執行條件之一例,說明將畫格圖像的累計張數予以最佳化之處理。此處,以下處理之主體,係為全體控制部及分析部113。 Hereinafter, the optimization processing of the execution conditions of the first embodiment of the SEM type defect observation apparatus will be described. Fig. 4 is a flow chart showing the optimization process of the cumulative number of frames in the frame. Hereinafter, a process of optimizing the number of accumulated sheets of the frame image will be described as an example of the execution conditions. Here, the main body of the following processing is the overall control unit and the analysis unit 113.

步驟401中,首先,全體控制部及分析部113會從分析參數記憶部204取得關於畫格累計張數的複數個參數。接下來,全體控制部及分析部113會從圖像資料記憶部203取得作為評估對象之最大數量的畫格圖像。 In step 401, first, the overall control unit and the analysis unit 113 acquire a plurality of parameters regarding the cumulative number of frames in the analysis parameter storage unit 204. Next, the entire control unit and the analysis unit 113 acquire the maximum number of frame images to be evaluated from the image data storage unit 203.

步驟402中,全體控制部及分析部113會利用圖像處理部114,針對取得之畫格圖像,使畫格累計張數變化(亦即,遵照取得之複數個參數),來執行漂移修 正處理。全體控制部及分析部113,會將漂移修正處理等執行結果存儲於分析結果資料記憶部205。 In step 402, the overall control unit and the analysis unit 113 use the image processing unit 114 to change the cumulative number of frames in the acquired frame image (that is, to follow the obtained plurality of parameters) to perform the drift repair. Processing. The overall control unit and the analysis unit 113 store the execution result such as the drift correction processing in the analysis result data storage unit 205.

接著,步驟403中,全體控制部及分析部113會將畫格累計張數與各累計張數中的漂移修正處理結果的圖像,以能夠瞭解對應關係的形式,一覧顯示於操作部115的顯示部(如顯示器)。該操作部115的顯示部畫面詳如後述。 Next, in step 403, the overall control unit and the analysis unit 113 display the image of the cumulative number of frames and the image of the result of the drift correction processing in each of the cumulative number of sheets in the form of the correspondence relationship, and display them in the operation unit 115. Display unit (such as a display). The display screen of the operation unit 115 will be described later in detail.

接著,步驟404中,使用者從一覧顯示的漂移修正圖像當中,選擇最佳的圖像。全體控制部及分析部113透過操作部115,接收由使用者選擇之圖像的資訊。如此一來,便能容易地設定最佳的漂移修正條件。 Next, in step 404, the user selects the best image from among the displayed drift correction images. The overall control unit and the analysis unit 113 receive information of an image selected by the user via the operation unit 115. In this way, the optimum drift correction condition can be easily set.

最後,步驟405中,全體控制部及分析部113會使設定好的漂移修正條件,反映在記憶裝置116中存儲的製程參數上。如此一來,便能運用於下次以降的缺陷觀察。只要遵照這樣的流程圖,使用者便能容易地設定最佳的漂移修正條件。 Finally, in step 405, the overall control unit and the analysis unit 113 reflect the set drift correction condition on the process parameters stored in the memory device 116. In this way, it can be applied to the next observation of defects. By following such a flow chart, the user can easily set the optimum drift correction condition.

圖5為用來進行畫格圖像的累計張數最佳化設定之GUI(第1畫面)一例,為圖4步驟403中顯示之畫面的第1例。 FIG. 5 is an example of a GUI (first screen) for optimizing the number of accumulated sheets of the frame image, and is a first example of the screen displayed in step 403 of FIG.

圖5的GUI,具備畫格累計張數顯示部501、及顯示修正處理前的累計圖像之修正處理前圖像顯示部502、及顯示修正處理後的累計圖像之修正處理後圖像顯示部503、及顯示修正處理的執行時間之處理時間顯示部504。 The GUI of FIG. 5 includes a frame total number of sheets display unit 501, an image display unit 502 before the correction processing of the integrated image before the correction processing, and an image display after the correction processing of the integrated image after the correction processing. The unit 503 and the processing time display unit 504 that displays the execution time of the correction processing.

在畫格累計張數顯示部501顯示有畫格累計張數,其比較評估了作為評估對象之最小畫格累計張數、最小畫格累計張數的2倍、最小畫格累計張數的4倍。另,畫格累計張數之選擇並不限於此方法,可為最小值、中央值、最大值的組合,亦可不為固定值,而能夠由使用者任意設定。此外,比較數亦不限定為3種類,可將作為評估對象之畫格累計張數全部一覧顯示,亦可採用反覆複數次選擇處理,來分階段地篩選出最佳值之方式。 In the frame cumulative number display unit 501, the number of accumulated frames is displayed, and the comparison evaluates the minimum number of frames to be evaluated, the number of sheets of the smallest frame, and the number of sheets of the smallest frame. Times. Further, the selection of the cumulative number of frames is not limited to this method, and may be a combination of the minimum value, the central value, and the maximum value, or may not be a fixed value, and can be arbitrarily set by the user. Further, the number of comparisons is not limited to three types, and the total number of frames to be evaluated may be displayed one by one, or the method of selecting the optimum values in stages may be used in a plurality of times.

在修正處理前圖像顯示部502,顯示有針對各累計張數於修正處理前之累計圖像。如圖5所示,當發生像漂移的情形下,藉由累計圖像,評估對象的圖像中所含有的圖樣邊緣部分的錯位會醒目(變粗)顯示。在本例當中,由於發生像漂移,故累計張數愈增加,評估對象的圖像中所含有的圖樣邊緣部分的錯位愈會加大顯示。另,在作為缺陷觀察對象的樣品中,也存在有無需執行漂移修正處理的樣品,故藉由顯示尚未執行漂移修正處理之畫格累計圖像,便能夠判斷是否需做漂移修正處理。 The pre-correction processing image display unit 502 displays an integrated image for each accumulated number of sheets before the correction processing. As shown in FIG. 5, in the case where image drift occurs, by accumulating the image, the misalignment of the edge portion of the pattern contained in the image of the evaluation object is highlighted (thickened). In this example, since the image drift occurs, the cumulative number of sheets increases, and the misalignment of the edge portion of the pattern contained in the image of the evaluation object increases. Further, in the sample to be observed as a defect, there is also a sample that does not need to perform the drift correction processing. Therefore, by displaying the frame integrated image in which the drift correction processing has not been performed, it is possible to determine whether or not the drift correction processing is necessary.

此外,在修正處理後圖像顯示部503,顯示有針對各累計張數於修正處理後之累計圖像。藉由修正處理,各累計張數中圖樣邊緣部分的錯位會變小。像這樣,各畫格累計張數相對應之修正處理前圖像及修正處理後圖像,是以能與畫格累計張數建立對應的形式顯示出來。 Further, after the correction processing, the image display unit 503 displays the integrated image after the correction processing for each accumulated number of sheets. By the correction processing, the misalignment of the edge portion of the pattern in each accumulated number of sheets becomes small. In this way, the image before the correction processing and the image after the correction processing corresponding to the total number of sheets of each frame are displayed in a form that can be associated with the cumulative number of frames.

此外,在處理時間顯示部504,是以能夠瞭解與各畫格累計張數、各畫格累計圖像之間的對應關係的形 式,顯示有漂移修正處理時間。使用者能夠從實際執行漂移修正處理後的結果之漂移修正圖像(503)、及漂移修正處理所需處理時間(504)的組合當中,容易地選擇出最佳條件。圖5例子當中,選擇了累計張數為8張之圖像(505)。選擇最佳圖像後按下按鈕506,則所選擇的最佳條件(此處為累計張數=8)便保存至製程參數以作為下次以降的漂移修正條件。 Further, the processing time display unit 504 is a shape that can understand the correspondence relationship with the number of sheets of each frame and the integrated image of each frame. The formula shows the drift correction processing time. The user can easily select the optimum condition from the combination of the drift correction image (503) and the processing time required for the drift correction processing (504), which actually performs the drift correction processing. In the example of Fig. 5, an image with an accumulated number of sheets of 8 sheets (505) is selected. After selecting the best image and pressing button 506, the selected optimal condition (here, the cumulative number of sheets = 8) is saved to the process parameters as the next drift correction condition.

以下,說明畫格圖像的累計張數最佳化設定中所顯示之另一畫面例。圖6為用來進行畫格圖像的累計張數最佳化設定之GUI(第2畫面)一例,為圖4步驟403中顯示之畫面的第2例。 Hereinafter, another example of the screen displayed in the cumulative number-of-sheets optimization setting of the frame image will be described. FIG. 6 is an example of a GUI (second screen) for optimizing the number of accumulated sheets of the frame image, and is a second example of the screen displayed in step 403 of FIG.

SEM式缺陷觀察裝置中,當觀察到前面順位的缺陷檢查裝置所檢測出的缺陷座標的情形下,由於發生缺陷的製造圖樣有多種多樣,故因應多種多樣的製造圖樣而進行條件設定係十分重要。理想而言,若存在一種參數是針對多種多樣的製造圖樣均有效,那麼可採用該參數;但這樣的參數另一方面來說多為處理時間較長者。使用者必需考量與處理時間之間的平衡來設定最佳參數,係為一件難度高的作業。 In the SEM type defect observation apparatus, when the defect coordinates detected by the defect inspection apparatus of the front position are observed, since the manufacturing pattern of the defect is various, it is important to perform the condition setting system in response to various manufacturing patterns. . Ideally, if one parameter is valid for a wide variety of manufacturing drawings, then this parameter can be used; but such parameters, on the other hand, are mostly longer processing times. The user must consider the balance between the processing time and the processing time to set the optimal parameters, which is a difficult task.

圖6為將圖5示例之畫格累計張數最佳化設定運用於複數個評估樣品之結果,以累積度數來表示。圖6的圖表當中,橫軸表示畫格累計張數601、縱軸(左)表示累積度數602、縱軸(右)表示漂移修正處理時間603。此外,在圖6的圖表中,描繪了各畫格累計張數中 的平均漂移修正處理時間,並顯示有該描繪點的近似直線605。圖6示例當中,是將修正處理時間以直線近似來顯示,但依修正處理演算法不同有時可能不顯示成直線狀,在這種情況下亦可以近似曲線來顯示,只要能夠確認對於複數個評估樣品的累積度數、及各畫格累計張數中的漂移修正處理時間即可。 Fig. 6 is a graph showing the results of optimizing the cumulative number of frames in the example of Fig. 5 for a plurality of evaluation samples, expressed as cumulative degrees. In the graph of FIG. 6, the horizontal axis represents the cumulative number of frames 601, the vertical axis (left) represents the cumulative degree 602, and the vertical axis (right) represents the drift correction processing time 603. In addition, in the graph of Fig. 6, the total number of sheets in each frame is depicted. The average drift corrects the processing time and displays an approximate line 605 of the plotted point. In the example of Fig. 6, the correction processing time is displayed by a straight line approximation. However, depending on the correction processing algorithm, it may not be displayed in a straight line. In this case, the curve may be displayed as an approximate curve, as long as it can be confirmed for a plurality of It is sufficient to evaluate the cumulative number of samples and the drift correction processing time in the total number of sheets of each frame.

像這樣藉由圖表顯示,對於複數個評估樣品,使用者便能對判斷為最佳之結果做綜合確認。舉例來說,能夠從累積度數成為100%的畫格累計張數(604),對於所有的評估樣品判斷出實現使用者可滿足畫質之最小畫格累計張數。圖6示例當中,當畫格累積數為14的情形下,累積度數成為100%。是故,只要將畫格累計數訂為14,對於所有的評估樣品,使用者便能得到判斷為最佳之畫質。另,此時可確認出漂移修正處理時間為300ms左右。 By displaying the graph in this way, for a plurality of evaluation samples, the user can comprehensively confirm the result judged to be the best. For example, it is possible to determine the cumulative number of sheets of the frame that the user can satisfy the image quality for all the evaluation samples from the cumulative number of frames in which the cumulative degree is 100% (604). In the example of Fig. 6, in the case where the cumulative number of frames is 14, the cumulative degree becomes 100%. Therefore, as long as the cumulative number of frames is set to 14, the user can obtain the image quality judged to be the best for all the evaluation samples. In addition, at this time, it can be confirmed that the drift correction processing time is about 300 ms.

此外,當漂移修正處理時間有上限的情形下,例如可顯示作為上限的漂移修正處理時間606a、606b。該上限時間可以事先設定,亦可設計成能由使用者任意輸入。舉例來說,606a為將作為上限的漂移修正處理時間的上限時間設定成350ms之情形。在此情形下,所有累計畫格數的漂移修正處理時間均未滿上限時間,故使用者只要選擇累積度數成為100%之畫格累積數即可。 Further, when the drift correction processing time has an upper limit, for example, the drift correction processing time 606a, 606b as the upper limit can be displayed. The upper limit time can be set in advance or can be designed to be arbitrarily input by the user. For example, 606a is a case where the upper limit time of the drift correction processing time as the upper limit is set to 350 ms. In this case, the drift correction processing time of all the accumulated frame numbers is less than the upper limit time, so the user only needs to select the cumulative number of frames in which the cumulative degree becomes 100%.

舉例來說,606b為將作為上限的漂移修正處理時間的上限時間設定成250ms之情形。可知滿足此上限 時間的,是畫格累計數為12以下者。此處,當畫格累計數為12的情形下,累積度數為95%,可確認出使用者判斷為最佳之畫質為95%左右。可知,使用者若在此上限時間當中將畫格累計數訂為12,便能得到近乎使用者滿足的畫質。像這樣,能夠考量每一畫格累計數的累積度數602與漂移修正處理時間603雙方,選擇出最佳參數。使用者選擇最佳畫格累計數後按下按鈕608,則所選擇的最佳條件(此處為累計張數=14)便保存至製程參數以作為下次以降的漂移修正條件。 For example, 606b is a case where the upper limit time of the drift correction processing time as the upper limit is set to 250 ms. It is known that this upper limit is met. The time is the number of frames with a cumulative number of 12 or less. Here, when the cumulative number of frames is 12, the cumulative degree is 95%, and it can be confirmed that the image quality judged by the user is about 95%. It can be seen that if the user sets the cumulative number of frames to 12 in the upper limit time, the image quality that is almost satisfied by the user can be obtained. In this way, it is possible to select both the cumulative degree 602 and the drift correction processing time 603 for each accumulated number of frames, and select the optimal parameter. When the user selects the optimal number of frames and presses the button 608, the selected optimal condition (here, the cumulative number of sheets = 14) is saved to the process parameters as the next drift correction condition.

另,上述例子當中,作為執行條件的一例,係說明將畫格累計張數最佳化之處理,但欲最佳化之執行條件(參數)並不限定於畫格累計張數。如上所述,作為執行條件,亦可針對加速電壓的電壓值、探針電流的電流值等參數做最佳化處理。在此情形下,關於複數個加速電壓的條件會在顯示部顯示圖像,使用者則選擇最佳的加速電壓條件。另,當設定加速電壓等條件的情形下,可在畫格累計張數的最佳化處理前執行。 In the above example, as an example of the execution condition, the process of optimizing the number of frames to be integrated is described. However, the execution condition (parameter) to be optimized is not limited to the number of frames to be accumulated. As described above, as the execution condition, parameters such as the voltage value of the acceleration voltage and the current value of the probe current can be optimized. In this case, the condition for a plurality of accelerating voltages displays an image on the display portion, and the user selects an optimum accelerating voltage condition. In addition, when a condition such as an acceleration voltage is set, it can be performed before the optimization process of the number of frames accumulated.

按照本實施例,係對複數個漂移修正條件(畫格累積數)執行漂移修正處理,並使複數個漂移修正條件、及以複數個漂移修正條件執行修正處理後之漂移修正圖像建立對應而顯示。是故,即使發生像漂移的情形下,也能容易地決定觀察圖像的最佳修正條件。此外,就算因作為觀察對象的製造圖樣的多樣性,而最佳漂移修正條件會依每一評估樣品而變化的情形下,使用者仍能容易 地設定最佳條件。 According to the present embodiment, the drift correction processing is performed on a plurality of drift correction conditions (the cumulative number of frames), and the plurality of drift correction conditions and the drift correction image subjected to the correction processing by the plurality of drift correction conditions are associated with each other. display. Therefore, even in the case where the image drift occurs, the optimum correction condition of the observed image can be easily determined. In addition, even in the case where the optimum drift correction condition varies depending on each evaluation sample due to the diversity of the manufacturing pattern to be observed, the user can still easily Set the best conditions.

<第2實施例> <Second embodiment>

以下,說明SEM式缺陷觀察裝置中第2實施例之執行條件的最佳化處理。第2實施例係有關兼顧缺陷自動觀察(ADR:Automatic Defect Review/Redetection)的缺陷檢測率和產能之最佳觀察條件設定處理。ADR處理,係修正前面順位的缺陷檢査裝置所輸出之缺陷座標的誤差,檢測缺陷區域、缺陷座標等,並取得高畫質缺陷圖像。圖7為兼顧ADR的缺陷檢測率和產能之條件設定處理流程圖。以下,作為執行條件之一例,說明將畫格圖像的累計張數予以最佳化之處理。 Hereinafter, the optimization processing of the execution conditions of the second embodiment of the SEM type defect observation apparatus will be described. The second embodiment is an optimum observation condition setting process for both the defect detection rate and the throughput of the automatic defect improvement (ADR) (Automatic Defect Review/Redetection). The ADR process corrects the error of the defect coordinates outputted by the defect inspection device of the previous order, detects the defect area, the defect coordinates, and the like, and obtains a high-definition defect image. Fig. 7 is a flow chart showing a condition setting process for both the defect detection rate and the capacity of the ADR. Hereinafter, a process of optimizing the number of accumulated sheets of the frame image will be described as an example of the execution conditions.

SEM式缺陷觀察裝置中,當將前面順位的缺陷檢査裝置所檢測出之缺陷座標的圖像以ADR自動拍攝的情形下,考量缺陷檢查裝置的缺陷檢測座標精度,首先以將缺陷納入視野內之低倍率來取得圖像,利用取得之低倍率圖像進行缺陷檢測,接著以檢測出之缺陷座標會成為視野中心的方式,取得高畫質的高倍率圖像。進行缺陷檢測的低倍率圖像,比起使用者看起來的印象,能不能以ADR做缺陷檢測係更加重要。是故,ADR進行缺陷檢測之低倍率圖像中,ADR是否能正確檢測缺陷位置,乃是參數設定的重要指標。 In the SEM type defect observation device, when the image of the defect coordinate detected by the defect inspection device of the front position is automatically captured by the ADR, the defect detection coordinate accuracy of the defect inspection device is considered, firstly, the defect is included in the field of view. The image is acquired at a low magnification, and the obtained low-magnification image is used for defect detection, and then the high-magnification image of high image quality is obtained so that the detected defect coordinates become the center of the field of view. Low-magnification images for defect detection are more important than ADR for defect detection systems. Therefore, whether ADR can correctly detect the defect position in the low-magnification image of ADR for defect detection is an important indicator for parameter setting.

一般而言,畫格累計圖像當中,隨著累計張數增加,雜訊成分會減少,故從缺陷檢測率的觀點看來, 累計張數愈多愈理想,但若增加累計張數,則處理時間亦會增加。特別是,當進行漂移修正處理的情形下,必須有算出各畫格圖像間的漂移量之處理,故畫格累計所需之處理時間增加會造成問題。在這樣的條件下,必須考量ADR的缺陷檢測率與包含畫格累計處理時間在內的ADR產能之間的平衡來設定最佳條件,在製程參數設定中是一件難度高的設定項目。 In general, in the cumulative image of the frame, as the cumulative number of sheets increases, the noise component decreases, so from the viewpoint of the defect detection rate, The more the cumulative number of sheets is, the better it is. However, if the cumulative number of sheets is increased, the processing time will also increase. In particular, in the case where the drift correction processing is performed, it is necessary to have a process of calculating the amount of drift between the respective frame images, so that an increase in the processing time required for the accumulation of the frames causes a problem. Under such conditions, it is necessary to consider the balance between the ADR defect detection rate and the ADR capacity including the frame cumulative processing time to set the optimal conditions, which is a difficult setting item in the process parameter setting.

以下,說明圖7之流程圖。此處,以下處理之主體,係為全體控制部及分析部113。 Hereinafter, the flowchart of Fig. 7 will be described. Here, the main body of the following processing is the overall control unit and the analysis unit 113.

步驟701中,首先,全體控制部及分析部113會從分析參數記憶部204取得關於畫格累計張數的複數個參數。接下來,全體控制部及分析部113會從圖像資料記憶部203取得作為評估對象之最大數量的畫格圖像。 In step 701, first, the overall control unit and the analysis unit 113 acquire a plurality of parameters relating to the cumulative number of frames from the analysis parameter storage unit 204. Next, the entire control unit and the analysis unit 113 acquire the maximum number of frame images to be evaluated from the image data storage unit 203.

接著,步驟702中,全體控制部及分析部113會利用圖像處理部114,針對取得之畫格圖像,使畫格累計張數變化(亦即,遵照取得之複數個參數),來執行漂移修正處理。 Next, in step 702, the overall control unit and the analysis unit 113 use the image processing unit 114 to perform a change in the cumulative number of frames in the acquired frame image (that is, in accordance with the plurality of parameters obtained). Drift correction processing.

接著,步驟703中,首先,全體控制部及分析部113會對漂移修正處理前的各畫格累計圖像執行ADR處理。又,全體控制部及分析部113會針對使畫格累計張數變化而執行漂移修正處理後之各畫格累計圖像,執行ADR處理。接下來,全體控制部及分析部113,會將ADR處理之執行結果存儲於分析結果資料記憶部205。 Next, in step 703, first, the overall control unit and the analysis unit 113 perform ADR processing on each of the frame integrated images before the drift correction processing. Further, the overall control unit and the analysis unit 113 perform ADR processing on each of the frame-accumulated images after the drift correction processing is performed to change the number of frames. Next, the overall control unit and the analysis unit 113 store the execution result of the ADR process in the analysis result data storage unit 205.

接著,步驟704中,全體控制部及分析部113將各畫格累計張數的漂移修正圖像、及ADR對各漂移修正圖像檢測出之缺陷位置、及各漂移修正圖像的ADR產能,以能夠瞭解對應關係的形式,一覧顯示於操作部115的顯示部(如顯示器)。該操作部115的顯示部畫面詳如後述。 Next, in step 704, the overall control unit and the analysis unit 113 convert the drift correction image of the number of frames accumulated, the defect position detected by the ADR to each of the drift correction images, and the ADR capacity of each of the drift correction images. The display unit (such as a display) displayed on the operation unit 115 is displayed in a form in which the correspondence can be understood. The display screen of the operation unit 115 will be described later in detail.

接著,步驟705中,使用者從一覧顯示的漂移修正圖像與ADR執行結果當中,選擇最佳的圖像。全體控制部及分析部113透過操作部115,接收由使用者選擇之圖像的資訊。如此一來,便能容易地設定考量ADR後的最佳漂移修正條件。 Next, in step 705, the user selects the best image from among the displayed drift correction image and the ADR execution result. The overall control unit and the analysis unit 113 receive information of an image selected by the user via the operation unit 115. In this way, the optimum drift correction condition after considering the ADR can be easily set.

最後,步驟706中,全體控制部及分析部113會使考量ADR後的最佳漂移修正條件,反映在記憶裝置116中存儲的製程參數上。如此一來,便能運用於下次以降的缺陷觀察。只要遵照這樣的流程圖,使用者便能容易地設定考量ADR後的最佳漂移修正條件。 Finally, in step 706, the overall control unit and the analysis unit 113 reflect the optimal drift correction condition after the consideration of ADR on the process parameters stored in the memory device 116. In this way, it can be applied to the next observation of defects. By following such a flowchart, the user can easily set the optimal drift correction condition after considering the ADR.

圖8為用來兼顧ADR缺陷檢測率和產能之條件設定的GUI一例,為圖7步驟704中顯示之畫面例。 FIG. 8 is an example of a GUI for setting the condition of the ADR defect detection rate and the capacity, and is an example of a screen displayed in step 704 of FIG.

圖8的GUI,具備ADR結果的顯示選擇部801、及畫格累計張數顯示部802、及顯示修正處理前的累計圖像之修正處理前圖像顯示部803、及顯示修正處理後的累計圖像之修正處理後圖像顯示部806、及顯示修正處理的執行時間之處理時間顯示部807、及顯示ADR產能之產能顯示部808。 The GUI of FIG. 8 includes a display selection unit 801 having an ADR result, a frame total number of sheets display unit 802, and an image display unit 803 before the correction processing of the integrated image before the display correction processing, and an accumulation after the display correction processing. The image display unit 806 after the image correction processing, the processing time display unit 807 that displays the execution time of the correction processing, and the capacity display unit 808 that displays the ADR capacity.

ADR結果的顯示選擇部801,係選擇是否將ADR結果一併重疊顯示,當勾選的情形下,ADR結果(缺陷區域804及缺陷座標805)會以重疊於圖像的形式顯示。圖8示例當中,是將ADR所檢測出之缺陷區域804顯示成以多角形集群(grouping)之結果,但亦可不做集群處理,而可將檢測出之所有缺陷區域套疊(overlay)顯示。此外,圖8示例當中,ADR所檢測出之缺陷座標805是採用缺陷區域804的重心,但例如亦可定義出考量像素值等之缺陷特徴量(如輝度等),並以判斷最可能為缺陷的像素作為缺陷座標,只要採用與ADR缺陷檢測演算法相對應之定義即可。 The display selection unit 801 of the ADR result selects whether or not to superimpose the ADR results together. When the check is made, the ADR result (the defective area 804 and the defective coordinates 805) are displayed in a superimposed manner on the image. In the example of FIG. 8, the defect area 804 detected by the ADR is displayed as a result of polygon grouping, but all of the detected defect areas may be overlaid and displayed without clustering. In addition, in the example of FIG. 8, the defect coordinate 805 detected by the ADR is the center of gravity of the defect area 804, but for example, a defect characteristic such as a luminance value (such as luminance) may be defined, and the most likely defect is determined. The pixel is used as the defect coordinate as long as the definition corresponding to the ADR defect detection algorithm is adopted.

在畫格累計張數顯示部802顯示有畫格累計張數,其比較評估了作為評估對象之最小畫格累計張數、最小畫格累計張數的2倍、最小畫格累計張數的4倍。另,畫格累計張數之選擇並不限於此方法,可為最小值、中央值、最大值的組合,亦可不為固定值,而能夠由使用者任意設定。此外,比較數亦不限定為3種類,可將作為評估對象之畫格累計張數全部一覧顯示,亦可採用反覆複數次選擇處理,來分階段地篩選出最佳值之方式。 The total number of sheets of the frame is displayed on the frame cumulative number display unit 802, and the comparison is performed to estimate the minimum number of frames to be evaluated, the number of sheets of the smallest frame, and the number of sheets of the smallest frame. Times. Further, the selection of the cumulative number of frames is not limited to this method, and may be a combination of the minimum value, the central value, and the maximum value, or may not be a fixed value, and can be arbitrarily set by the user. Further, the number of comparisons is not limited to three types, and the total number of frames to be evaluated may be displayed one by one, or the method of selecting the optimum values in stages may be used in a plurality of times.

在修正處理前圖像顯示部803,顯示有針對各累計張數於修正處理前之累計圖像。當發生像漂移的情形下,藉由累計圖像,評估對象的圖像中所含有的圖樣或缺陷的邊緣部分的錯位會醒目(變粗)顯示。圖8例子當中,由於像漂移及雜訊成分的緣故,若累計張數愈少則缺 陷區域804會檢測成愈寬。其結果,當畫格累計張數為4、8的情形下,相對於缺陷位置811,缺陷座標805會偏離而被檢測出來。另,在作為缺陷觀察對象的樣品中,也存在有無需執行漂移修正處理的樣品,故藉由顯示尚未執行漂移修正處理之畫格累計圖像,便能夠判斷是否需做漂移修正處理。 Before the correction processing, the image display unit 803 displays an integrated image for each accumulated number of sheets before the correction processing. In the case where image drift occurs, by accumulating the image, the misalignment of the edge portion of the pattern or the defect contained in the image of the evaluation object is conspicuous (thickening) display. In the example of Fig. 8, due to the drift and noise components, if the cumulative number of sheets is less, the number is missing. The trapped area 804 is detected as wider. As a result, when the cumulative number of frames is 4 or 8, the defective coordinates 805 are deviated and detected relative to the defect position 811. Further, in the sample to be observed as a defect, there is also a sample that does not need to perform the drift correction processing. Therefore, by displaying the frame integrated image in which the drift correction processing has not been performed, it is possible to determine whether or not the drift correction processing is necessary.

此外,在修正處理後圖像顯示部806,顯示有針對各累計張數於修正處理後之累計圖像。如圖8所示,各畫格累計張數相對應之修正處理前圖像及修正處理後圖像,是以能與畫格累計張數建立對應的形式顯示出來。另,藉由修正處理,各累計張數中圖樣或缺陷的邊緣部分的錯位會變小,其結果,缺陷區城804相較於修正處理前會變小。如此一來,相對於缺陷位置811,缺陷座標805的偏離也會變小。 Further, after the correction processing, the image display unit 806 displays the integrated image after the correction processing for each accumulated number of sheets. As shown in FIG. 8, the pre-correction processed image and the corrected processed image corresponding to the cumulative number of frames in each frame are displayed in a form that can be associated with the cumulative number of frames. Further, by the correction processing, the misalignment of the edge portion of the pattern or the defect in each of the cumulative number of sheets becomes small, and as a result, the defective area 804 becomes smaller than before the correction processing. As a result, the deviation of the defective coordinates 805 becomes smaller with respect to the defect position 811.

此外,漂移修正處理時間,是以能夠瞭解與各畫格累計張數、顯示有ADR結果的各畫格累計圖像之間的對應關係的形式,而顯示於處理時間顯示部807。又,包含漂移修正處理時間在內的ADR產能,是以能夠瞭解與各畫格累計張數、顯示有ADR結果的各畫格累計圖像之間的對應關係的形式,而顯示於產能顯示部808。當運用ADR的情形下所探討之處理時間,經常是包含漂移修正處理時間在內的ADR產能,故理想是不僅標記漂移修正處理時間(807),還併記ADR產能(808)。 Further, the drift correction processing time is displayed on the processing time display unit 807 in a form in which the correspondence relationship between the accumulated number of sheets of each of the frames and the integrated image of each of the frames in which the ADR result is displayed is known. In addition, the ADR capacity including the drift correction processing time is displayed on the capacity display unit in a form that can understand the correspondence relationship between the accumulated number of frames and the integrated image of each frame in which the ADR result is displayed. 808. The processing time discussed in the case of using ADR is often the ADR capacity including the drift correction processing time. Therefore, it is desirable to mark not only the drift correction processing time (807) but also the ADR capacity (808).

像這樣,只要利用GUI,使用者便能從實際 執行漂移修正處理後之圖像、及針對各漂移修正圖像之ADR結果、及對各漂移修正圖像之ADR產能的組合當中容易地選擇出最佳條件(809)。選擇最佳圖像後按下按鈕810,則所選擇的最佳條件(此處為累計張數=8)便保存至製程參數以作為下次以降的考量ADR後之漂移修正條件。 Like this, as long as the GUI is used, the user can actually The optimal condition (809) is easily selected among the combination of the image after the drift correction processing, the ADR result for each drift correction image, and the ADR capacity for each drift correction image. After the best image is selected and the button 810 is pressed, the selected optimal condition (here, the cumulative number of sheets = 8) is saved to the process parameter as the drift correction condition after the next ADR consideration.

此外,圖7的步驟704中,亦可與圖6示例之畫面顯示同樣的內容。針對複數個樣品考量ADR後之漂移修正條件最佳化作業,可如同圖6示例之內容般對應。圖6當中,會顯示圖5中使用者判斷為最佳之圖像的累積度數。相對於此,考量ADR後之漂移修正條件最佳化的情形下,只要想成是顯示圖8中使用者考量ADR後判斷為最佳之圖像的累積度數即可。另,本實施例當中,並不限定於累積度數,亦可顯示其他資訊。舉例來說,使用者判斷為最佳之圖像,係指能夠正確檢測出缺陷座標,故將使用者判斷為最佳之圖像的缺陷座標與其他畫格累計數的圖像的缺陷座標做比較,藉此便能針對各畫格累計數,算出缺陷的檢測率。在此情形下,圖表中還會顯示針對各畫格累計數之檢測率。此外,圖6當中是將漂移修正處理時間作為第二軸做圖表顯示,但考量ADR後之漂移修正條件最佳化的情形下,亦可將包含漂移修正處理時間在內的ADR產能做圖表顯示。 Further, in step 704 of FIG. 7, the same content as that of the screen illustrated in FIG. 6 may be displayed. The drift correction condition optimization operation after considering ADR for a plurality of samples can correspond to the content of the example of FIG. 6. In Fig. 6, the cumulative degree of the image judged to be the best in Fig. 5 is displayed. On the other hand, in the case where the drift correction condition after the ADR is optimized, it is only necessary to display the cumulative degree of the image determined to be the best after the user considers the ADR in FIG. In addition, in this embodiment, it is not limited to the cumulative degree, and other information may be displayed. For example, if the user judges that the image is the best, it means that the defect coordinates can be detected correctly, so the defect coordinates of the image of the image that is judged to be the best image by the user and the defect coordinates of the image of the other frame are made. By comparison, the detection rate of the defect can be calculated for each frame cumulative number. In this case, the detection rate for the cumulative number of each frame is also displayed in the chart. In addition, in FIG. 6, the drift correction processing time is displayed as a second axis, but in the case where the drift correction condition after the ADR is optimized, the ADR capacity including the drift correction processing time can be displayed as a graph. .

按照本實施例,就算因作為觀察對象的製造圖樣的多樣性,而最佳漂移修正條件會依每一樣品而變化 的情形下,仍能容易地選擇考量ADR後之漂移修正條件。此外,設定處理中,會顯示包含漂移修正處理時間在內的ADR產能,故能夠容易地設定兼顧ADR缺陷檢測率和產能之條件。 According to the present embodiment, the optimum drift correction condition varies depending on each sample even in view of the diversity of the manufacturing pattern to be observed. In the case of the situation, the drift correction condition after considering the ADR can still be easily selected. Further, in the setting process, the ADR capacity including the drift correction processing time is displayed, so that it is possible to easily set the conditions for both the ADR defect detection rate and the throughput.

<第3實施例> <Third embodiment>

以下,說明SEM式缺陷觀察裝置中第3實施例之執行條件的最佳化處理。第3實施例係有關兼顧缺陷自動分類(ADC:Automatic Defect Classification)的分類正確率和產能之最佳觀察條件設定處理。ADC處理,係依據以高畫質取得之缺陷圖像,將缺陷種類予以分類(查明缺陷種類)。圖9為兼顧ADC的分類正確率和產能之條件設定處理流程圖。以下,作為執行條件之一例,說明將畫格圖像的累計張數予以最佳化之處理。 Hereinafter, the optimization processing of the execution conditions of the third embodiment in the SEM type defect observation apparatus will be described. The third embodiment is an optimum observation condition setting process for classifying the correct rate and productivity of the automatic defect classification (ADC: Automatic Defect Classification). The ADC process classifies defect types (identify defect types) based on defective images obtained with high image quality. Fig. 9 is a flow chart showing the process of setting the conditions for the classification accuracy and productivity of the ADC. Hereinafter, a process of optimizing the number of accumulated sheets of the frame image will be described as an example of the execution conditions.

ADC中為了確保正確率,必須以高畫質來分析缺陷,ADC的對象亦即高倍率圖像之取得條件十分重要。依ADC的演算法不同,有時不僅是高倍率圖像,還會併用低倍率圖像,但此處說明係假定對於ADC正確率造成較大影響的圖像為高倍率圖像。 In order to ensure the correct rate in the ADC, the defect must be analyzed with high image quality, and the object of the ADC, that is, the acquisition condition of the high-magnification image is very important. Depending on the algorithm of the ADC, sometimes not only high-magnification images but also low-magnification images, but the description here assumes that the image that has a large influence on the correctness of the ADC is a high-magnification image.

一般而言,進行漂移修正後的畫格累計圖像當中,隨著累計張數增加,雜訊成分會減少,故從ADC的分類正確率的觀點看來,累計張數愈多愈理想,但若增加累計張數,則包含漂移修正處理時間在內的ADC處理時間亦會增加。此外,適於使用者目視分類之畫質、與 ADC中能得到充分正解率之畫質未必一致,故必須考量ADC分類正確率與畫格累計張數、及包含漂移修正處理時間在內的ADC處理時間之間的平衡性,來設定最佳條件。因此,兼顧ADC分類正確率和產能之條件最佳化,在製程參數設定中為一難度高的作業。 In general, in the integrated image of the frame after the drift correction, as the cumulative number of sheets increases, the noise component decreases. Therefore, from the viewpoint of the classification accuracy of the ADC, the more the cumulative number of sheets, the better, but If the cumulative number of sheets is increased, the ADC processing time including the drift correction processing time will also increase. In addition, it is suitable for the user to visually classify the image quality, and The image quality in the ADC that can obtain a sufficient positive solution rate is not necessarily the same. Therefore, it is necessary to consider the balance between the ADC classification correct rate and the cumulative number of frames and the ADC processing time including the drift correction processing time to set the optimal conditions. . Therefore, the conditions for optimizing the classification accuracy and productivity of the ADC are optimized, and it is a difficult operation in the process parameter setting.

以下,說明圖9之流程圖。此處,以下處理之主體,係為全體控制部及分析部113。 Hereinafter, the flowchart of Fig. 9 will be described. Here, the main body of the following processing is the overall control unit and the analysis unit 113.

步驟901中,首先,全體控制部及分析部113會從分析參數記憶部204取得關於畫格累計張數的複數個參數。接下來,全體控制部及分析部113會從圖像資料記憶部203取得作為評估對象之最大數量的畫格圖像。 In step 901, first, the overall control unit and the analysis unit 113 acquire a plurality of parameters relating to the cumulative number of frames from the analysis parameter storage unit 204. Next, the entire control unit and the analysis unit 113 acquire the maximum number of frame images to be evaluated from the image data storage unit 203.

接著,步驟902中,全體控制部及分析部113會利用圖像處理部114,針對取得之畫格圖像,使畫格累計張數變化(亦即,遵照取得之複數個參數),來執行漂移修正處理。 Next, in step 902, the overall control unit and the analysis unit 113 use the image processing unit 114 to perform a change in the number of accumulated frames (that is, in accordance with the plurality of parameters obtained) with respect to the acquired frame image. Drift correction processing.

接著,步驟903中,首先,全體控制部及分析部113會對漂移修正處理前的各畫格累計圖像執行ADC處理。又,全體控制部及分析部113會針對使畫格累計張數變化而執行漂移修正處理後之各畫格累計圖像,執行ADC處理。接下來,全體控制部及分析部113,會將ADC處理之執行結果存儲於分析結果資料記憶部205。 Next, in step 903, first, the overall control unit and the analysis unit 113 perform ADC processing on each of the frame-accumulated images before the drift correction processing. Further, the overall control unit and the analysis unit 113 perform ADC processing on the image integration images after the drift correction processing is performed to change the cumulative number of frames. Next, the overall control unit and the analysis unit 113 store the execution result of the ADC processing in the analysis result data storage unit 205.

接著,步驟904中,全體控制部及分析部113將各畫格累計張數的漂移修正圖像、及ADC對各漂移修 正圖像之分類結果、及各漂移修正圖像的ADC產能,以能夠瞭解對應關係的形式,一覧顯示於操作部115的顯示部(如顯示器)。該操作部115的顯示部畫面詳如後述。 Next, in step 904, the overall control unit and the analysis unit 113 correct the drift correction image of each frame and the ADC for each drift correction. The classification result of the positive image and the ADC capacity of each of the drift correction images are displayed on the display unit (such as a display) of the operation unit 115 in a form in which the correspondence can be understood. The display screen of the operation unit 115 will be described later in detail.

接著,步驟905中,使用者從一覧顯示的漂移修正圖像與ADC的分類結果當中,選擇最佳的圖像。全體控制部及分析部113透過操作部115,接收由使用者選擇之圖像的資訊。如此一來,便能容易地設定考量ADC後的最佳漂移修正條件。 Next, in step 905, the user selects the best image from among the classification results of the drift correction image and the ADC displayed. The overall control unit and the analysis unit 113 receive information of an image selected by the user via the operation unit 115. In this way, the optimum drift correction condition after considering the ADC can be easily set.

最後,步驟906中,全體控制部及分析部113會使考量ADC後的最佳漂移修正條件,反映在記憶裝置116中存儲的製程參數上。如此一來,便能運用於下次以降的缺陷觀察。只要遵照這樣的流程圖,使用者便能容易地設定考量ADC後的最佳漂移修正條件。 Finally, in step 906, the overall control unit and the analysis unit 113 reflect the optimal drift correction condition after the ADC is considered, on the process parameters stored in the memory device 116. In this way, it can be applied to the next observation of defects. By following such a flow chart, the user can easily set the optimum drift correction condition after considering the ADC.

圖10為用來兼顧ADC分類正確率和產能之條件設定的GUI一例,為圖9步驟904中顯示之畫面例。 FIG. 10 is an example of a GUI for setting the condition of the ADC classification accuracy and productivity, and is an example of a screen displayed in step 904 of FIG.

圖10的GUI,具備ADC結果的顯示選擇部1001、及畫格累計張數顯示部1002、及顯示修正處理前的累計圖像之修正處理前圖像顯示部1003、及顯示對於修正處理前的累計圖像的ADC結果之第1ADC結果顯示部1004、及顯示修正處理後的累計圖像之修正處理後圖像顯示部1006、及顯示對於修正處理後的累計圖像的ADC結果之第2ADC結果顯示部1007、及顯示修正處理的執行時間之處理時間顯示部1008、及顯示ADC產能之 產能顯示部1009。 The GUI of FIG. 10 includes a display selection unit 1001 with an ADC result, a frame count display unit 1002, and a pre-correction image display unit 1003 for displaying an integrated image before the correction processing, and a display before the correction processing. The first ADC result display unit 1004 of the ADC result of the integrated image, and the image display unit 1006 after the correction processing of the integrated image after the correction processing is displayed, and the second ADC result of the ADC result of the integrated image after the correction processing is displayed. The display unit 1007 and the processing time display unit 1008 that displays the execution time of the correction processing and the display ADC capacity Capacity display unit 1009.

ADC結果的顯示選擇部1001,係選擇是否將ADC結果一併重疊顯示,當勾選的情形下,會顯示ADC結果(缺陷區域1005、第1ADC結果顯示部1004、第2ADC結果顯示部1007)。圖10示例當中,是將ADC所檢測出之缺陷區域1005顯示成以多角形集群(grouping)之結果,但亦可不做集群處理,而可將檢測出之所有缺陷區域套疊(overlay)顯示。 The display result selection unit 1001 of the ADC result selects whether or not to superimpose the ADC results together. When the check is made, the ADC result (the defective area 1005, the first ADC result display unit 1004, and the second ADC result display unit 1007) is displayed. In the example of FIG. 10, the defective area 1005 detected by the ADC is displayed as a result of polygon grouping, but all the defective areas detected may be overlaid without clustering.

在畫格累計張數顯示部1002顯示有畫格累計張數,其比較評估了作為評估對象之最小畫格累計張數、最小畫格累計張數的2倍、最小畫格累計張數的4倍。另,畫格累計張數之選擇並不限於此方法,可為最小值、中央值、最大值的組合,亦可不為固定值,而能夠由使用者任意設定。此外,比較數亦不限定為3種類,可將作為評估對象之畫格累計張數全部一覧顯示,亦可採用反覆複數次選擇處理,來分階段地篩選出最佳值之方式。 In the frame cumulative number display unit 1002, the total number of frames is displayed, and the comparison is performed to estimate the minimum number of frames to be evaluated, the number of sheets of the smallest frame, and the number of sheets of the smallest frame. Times. Further, the selection of the cumulative number of frames is not limited to this method, and may be a combination of the minimum value, the central value, and the maximum value, or may not be a fixed value, and can be arbitrarily set by the user. Further, the number of comparisons is not limited to three types, and the total number of frames to be evaluated may be displayed one by one, or the method of selecting the optimum values in stages may be used in a plurality of times.

在修正處理前圖像顯示部1003,顯示有針對各累計張數於修正處理前之累計圖像。當發生像漂移的情形下,藉由累計圖像,評估對象的圖像中所含有的圖樣或缺陷的邊緣部分的錯位會醒目(明亮)顯示。圖10例子當中,由於像漂移及雜訊成分的緣故,若累計張數愈少則缺陷區域1005會檢測成愈寬。另,在作為缺陷觀察對象的樣品中,也存在有無需執行漂移修正處理的樣品,故藉由顯示尚未執行漂移修正處理之畫格累計圖像,便能夠判 斷是否需做漂移修正處理。 The pre-correction processing image display unit 1003 displays an integrated image for each accumulated number of sheets before the correction processing. In the case where the image drift occurs, by accumulating the image, the misalignment of the edge portion of the pattern or the defect contained in the image of the evaluation object is highlighted (bright). In the example of Fig. 10, due to the drift and noise components, the defect area 1005 is detected to be wider as the cumulative number of sheets is smaller. Further, in the sample to be observed as a defect, there is also a sample that does not need to perform the drift correction processing, so that it is possible to judge by displaying the integrated image of the frame in which the drift correction processing has not been performed. Whether to do drift correction processing.

在第1ADC結果顯示部1004,顯示有針對各累計張數,對於修正處理前之累計圖像的ADC結果。圖10例子當中,當畫格累計張數為4的情形下,ADC的分類結果無法確定,顯示為「Unknown」。當畫格累計張數為8的情形下,則被分類成「Short」(短路),在本例中其並未得到正確的分類結果。此外,當畫格累計張數為16的情形下,則被分類成「Dust」(異物),而得到正確的分類結果。 The first ADC result display unit 1004 displays an ADC result for the cumulative image before the correction process for each accumulated number of sheets. In the example of Fig. 10, when the cumulative number of frames is 4, the classification result of the ADC cannot be determined and is displayed as "Unknown". When the total number of frames in the frame is 8, it is classified as "Short" (short circuit), and in this example, it does not get the correct classification result. In addition, when the cumulative number of frames is 16, it is classified as "Dust" (foreign matter), and the correct classification result is obtained.

此外,在修正處理後圖像顯示部1006,顯示有針對各累計張數於修正處理後之累計圖像。如圖10所示,各畫格累計張數相對應之修正處理前圖像及修正處理後圖像,是以能與畫格累計張數建立對應的形式顯示出來。另,藉由修正處理,各累計張數中圖樣或缺陷的邊緣部分的錯位會變小,其結果,缺陷區城1005相較於修正處理前會變小。 Further, after the correction processing, the image display unit 1006 displays the integrated image after the correction processing for each accumulated number of sheets. As shown in FIG. 10, the pre-correction processed image and the corrected processed image corresponding to the cumulative number of frames in each frame are displayed in a form that can be associated with the cumulative number of frames. Further, by the correction processing, the misalignment of the edge portion of the pattern or the defect in each of the cumulative number of sheets becomes small, and as a result, the defective area 1005 becomes smaller than before the correction processing.

在第2ADC結果顯示部1007,顯示有針對各累計張數,對於修正處理後之累計圖像的ADC結果。圖10例子當中,當畫格累計張數為4的情形下,即使於修正處理後ADC的分類結果仍無法確定,顯示為「Unknown」。當畫格累計張數為8的情形下,則被分類成「Dust」(異物),相對於修正處理前已得到正確的分類結果。此外,當畫格累計張數為16的情形下,則被分類成「Dust」。 The second ADC result display unit 1007 displays an ADC result for the cumulative image after the correction processing for each accumulated number of sheets. In the example of Fig. 10, when the cumulative number of frames is 4, the classification result of the ADC cannot be determined even after the correction processing, and the display is "Unknown". When the cumulative number of frames is 8, it is classified as "Dust" (foreign matter), and the correct classification result is obtained before the correction processing. In addition, when the cumulative number of frames is 16, it is classified as "Dust".

此外,漂移修正處理時間,是以能夠瞭解與各畫格累計張數、顯示有ADC結果的各畫格累計圖像之間的對應關係的形式,而顯示於處理時間顯示部1008。又,包含漂移修正處理時間在內的ADC產能,是以能夠瞭解與各畫格累計張數、顯示有ADC結果的各畫格累計圖像之間的對應關係的形式,而顯示於產能顯示部1009。當運用ADC的情形下所探討之處理時間,經常是包含漂移修正處理時間在內的ADC產能,故理想是不僅標記漂移修正處理時間(1008),還併記ADC產能(1009)。另,ADC處理經常與ADR處理並列做管線化(pipeline)處理。特別是,依處理對象的樣品數不同,有時ADC與ADR的產能係為同等,故此處並未將ADC與ADR的產能特地區別顯示。但,若欲正確辨識ADC產能的情形下,亦可將ADC與ADR的產能區別顯示。 Further, the drift correction processing time is displayed on the processing time display unit 1008 in a form in which the correspondence relationship between the cumulative number of sheets of each of the frames and the integrated image of each of the frames in which the ADC result is displayed is known. In addition, the ADC production capacity including the drift correction processing time is displayed on the capacity display unit in a form that can understand the correspondence relationship between the accumulated number of frames and the integrated image of each frame in which the ADC result is displayed. 1009. When the processing time in the case of using the ADC is often the ADC capacity including the drift correction processing time, it is desirable to not only mark the drift correction processing time (1008), but also the ADC capacity (1009). In addition, ADC processing is often side-by-side with ADR processing for pipeline processing. In particular, depending on the number of samples to be processed, the productivity of the ADC and the ADR may be the same. Therefore, the capacity of the ADC and the ADR are not specifically displayed here. However, if the ADC capacity is to be correctly identified, the capacity difference between the ADC and the ADR can also be displayed.

像這樣,只要利用GUI,使用者便能從實際執行漂移修正處理後之圖像、及針對各漂移修正圖像之ADC結果、及對各漂移修正圖像之ADC產能的組合當中容易地選擇出最佳條件(1010)。選擇最佳圖像後按下按鈕1011,則所選擇的最佳條件(此處為累計張數=8)便保存至製程參數以作為下次以降的考量ADC後之漂移修正條件。 In this way, by using the GUI, the user can easily select from the combination of the image after the actual drift correction processing, the ADC result for each drift correction image, and the ADC capacity of each drift correction image. The best condition (1010). After selecting the best image and pressing button 1011, the selected optimal condition (here, the cumulative number of sheets = 8) is saved to the process parameter as the drift correction condition after the ADC is considered next time.

此外,圖9的步驟904中,亦可與圖6示例之畫面顯示同樣的內容。針對複數個樣品考量ADC後之漂移修正條件最佳化作業,可如同圖6示例之內容般對 應。圖6當中,會顯示圖5中使用者判斷為最佳之圖像的累積度數。相對於此,考量ADC後之漂移修正條件最佳化的情形下,只要想成是顯示圖10中使用者考量ADC後判斷為最佳之圖像的累積度數即可。另,本實施例當中,並不限定於累積度數,亦可顯示其他資訊。舉例來說,使用者判斷為最佳之圖像,係指能夠正確進行缺陷分類之圖像,故將使用者判斷為最佳之圖像的ADC結果與其他畫格累計數的圖像的ADC結果做比較,藉此便能針對各畫格累計數,算出缺陷分類的正確率。在此情形下,圖表中還會顯示針對各畫格累計數之缺陷分類正確率。此外,圖6當中是將漂移修正處理時間作為第二軸做圖表顯示,但考量ADC後之漂移修正條件最佳化的情形下,亦可將包含漂移修正處理時間在內的ADC產能做圖表顯示。 Further, in step 904 of FIG. 9, the same content as that of the screen illustrated in FIG. 6 may be displayed. The drift correction condition optimization operation after considering the ADC for a plurality of samples can be as the example of FIG. should. In Fig. 6, the cumulative degree of the image judged to be the best in Fig. 5 is displayed. On the other hand, in the case where the drift correction condition after the ADC is optimized is considered, it is only necessary to display the cumulative degree of the image judged to be the best after the user considers the ADC in FIG. In addition, in this embodiment, it is not limited to the cumulative degree, and other information may be displayed. For example, the image that the user judges to be the best image refers to an image that can correctly perform the defect classification image, so the user judges the ADC image of the best image and the image of the accumulated number of other frames. The results are compared so that the correct rate of defect classification can be calculated for each frame count. In this case, the defect classification correct rate for each frame count is also displayed in the graph. In addition, in FIG. 6, the drift correction processing time is displayed as a second axis, but in the case where the drift correction condition after the ADC is optimized, the ADC capacity including the drift correction processing time can also be displayed as a graph. .

按照本實施例,就算因作為觀察對象的製造圖樣的多樣性,而最佳漂移修正條件會依每一樣品而變化的情形下,仍能容易地選擇考量ADC後之漂移修正條件。此外,設定處理中,會顯示包含漂移修正處理時間在內的ADC產能,故能夠容易地設定兼顧ADC缺陷分類正確率和產能之條件。 According to the present embodiment, even in the case where the optimum drift correction condition varies depending on each sample due to the diversity of the manufacturing pattern to be observed, the drift correction condition after the ADC can be easily selected. In addition, during the setting process, the ADC capacity including the drift correction processing time is displayed, so that it is possible to easily set the conditions for the accuracy and productivity of the ADC defect classification.

<第4實施例> <Fourth embodiment>

以下,說明SEM式缺陷觀察裝置中第4實施例之執行條件的最佳化處理。第4實施例係有關實現兼顧ADR缺陷檢測率和產能、及兼顧ADC分類正確率和產能之觀 察條件設定處理。圖11為實現兼顧ADR缺陷檢測率和產能、以及兼顧ADC分類正確率和產能之條件設定處理流程圖。以下,作為執行條件之一例,說明將畫格圖像的累計張數予以最佳化之處理。 Hereinafter, the optimization processing of the execution conditions of the fourth embodiment of the SEM type defect observation apparatus will be described. The fourth embodiment is about achieving the ADR defect detection rate and productivity, and taking into account the accuracy of ADC classification and productivity. Check the condition setting process. Fig. 11 is a flow chart showing the process of setting conditions for achieving both ADR defect detection rate and throughput, and taking into account the accuracy and capacity of the ADC classification. Hereinafter, a process of optimizing the number of accumulated sheets of the frame image will be described as an example of the execution conditions.

圖11是將圖7示例之流程、與圖8示例之流程予以整合而成。此處,以下處理之主體,係為全體控制部及分析部113。 Fig. 11 is a view in which the flow of the example of Fig. 7 and the flow of the example of Fig. 8 are integrated. Here, the main body of the following processing is the overall control unit and the analysis unit 113.

步驟1101中,首先,全體控制部及分析部113會從分析參數記憶部204取得關於畫格累計張數的複數個參數。接下來,全體控制部及分析部113會從圖像資料記憶部203取得作為評估對象之最大數量的畫格圖像。 In step 1101, first, the entire control unit and the analysis unit 113 acquire a plurality of parameters relating to the cumulative number of frames from the analysis parameter storage unit 204. Next, the entire control unit and the analysis unit 113 acquire the maximum number of frame images to be evaluated from the image data storage unit 203.

接著,步驟1102中,全體控制部及分析部113會利用圖像處理部114,針對取得之畫格圖像,使畫格累計張數變化(亦即,遵照取得之複數個參數),來執行漂移修正處理。 Next, in step 1102, the overall control unit and the analysis unit 113 use the image processing unit 114 to perform a change in the number of frames accumulated (that is, in accordance with the plurality of parameters obtained) with respect to the acquired frame image. Drift correction processing.

接著,步驟1103中,首先,全體控制部及分析部113會對漂移修正處理前的各畫格累計圖像執行ADR處理。全體控制部及分析部113會針對使畫格累計張數變化而執行漂移修正處理後之各畫格累計圖像,執行ADR處理。接下來,全體控制部及分析部113,會將ADC處理之執行結果存儲於分析結果資料記憶部205。 Next, in step 1103, first, the overall control unit and the analysis unit 113 perform ADR processing on each of the frame integrated images before the drift correction processing. The overall control unit and the analysis unit 113 performs ADR processing on each of the frame-accumulated images after the drift correction processing is performed to change the cumulative number of frames. Next, the overall control unit and the analysis unit 113 store the execution result of the ADC processing in the analysis result data storage unit 205.

接著,步驟1104中,全體控制部及分析部113將各畫格累計張數的漂移修正圖像、及ADR對各漂移修正圖像檢測出之缺陷位置、及各漂移修正圖像的 ADR產能,以能夠瞭解對應關係的形式,一覧顯示於操作部115的顯示部(如顯示器)。此處係顯示圖8的畫面。 Next, in step 1104, the overall control unit and the analysis unit 113 convert the drift correction image of the number of frames accumulated, the defect position detected by the ADR to each of the drift correction images, and the respective drift correction images. The ADR capacity is displayed on the display portion (such as a display) of the operation unit 115 in a form capable of understanding the correspondence. The screen of Fig. 8 is displayed here.

接著,步驟1105中,使用者從一覧顯示的漂移修正圖像與ADR執行結果當中,選擇最佳的圖像。全體控制部及分析部113透過操作部115,接收由使用者選擇之圖像的資訊。 Next, in step 1105, the user selects the best image from among the displayed drift correction image and the ADR execution result. The overall control unit and the analysis unit 113 receive information of an image selected by the user via the operation unit 115.

接著,步驟1106中,首先,全體控制部及分析部113會對漂移修正處理前的各畫格累計圖像執行ADC處理。又,全體控制部及分析部113會針對使畫格累計張數變化而執行漂移修正處理後之各畫格累計圖像,執行ADC處理。接下來,全體控制部及分析部113,會將ADC處理之執行結果存儲於分析結果資料記憶部205。 Next, in step 1106, first, the overall control unit and the analysis unit 113 perform ADC processing on each of the frame-accumulated images before the drift correction processing. Further, the overall control unit and the analysis unit 113 perform ADC processing on the image integration images after the drift correction processing is performed to change the cumulative number of frames. Next, the overall control unit and the analysis unit 113 store the execution result of the ADC processing in the analysis result data storage unit 205.

接著,步驟1107中,全體控制部及分析部113將各畫格累計張數的漂移修正圖像、及ADC對各漂移修正圖像之分類結果、及各漂移修正圖像的ADC產能,以能夠瞭解對應關係的形式,一覧顯示於操作部115的顯示部(如顯示器)。此處係顯示圖10的畫面。 Next, in step 1107, the overall control unit and the analysis unit 113 convert the drift correction image of the number of frames in each frame, the classification result of the ADC to each of the drift correction images, and the ADC capacity of each of the drift correction images. The form of the correspondence relationship is known to be displayed on the display portion (such as a display) of the operation unit 115. The screen of Fig. 10 is displayed here.

接著,步驟1108中,使用者從一覧顯示的漂移修正圖像與ADC的分類結果當中,選擇最佳的圖像。全體控制部及分析部113透過操作部115,接收由使用者選擇之圖像的資訊。 Next, in step 1108, the user selects the best image from among the classification results of the drift correction image and the ADC displayed. The overall control unit and the analysis unit 113 receive information of an image selected by the user via the operation unit 115.

最後,步驟1109中,全體控制部及分析部 113會使考量ADR後的最佳漂移修正條件,及考量ADC後的最佳漂移修正條件,反映在記憶裝置116中存儲的製程參數上。 Finally, in step 1109, the overall control unit and the analysis unit 113 will consider the optimal drift correction condition after ADR, and the optimal drift correction condition after considering the ADC, reflected in the process parameters stored in the memory device 116.

遵照這樣的流程圖,使用者便能容易地設定兼顧ADR缺陷檢測率和產能之最佳條件、及兼顧ADC分類正確率和產能之最佳條件。 By following such a flow chart, the user can easily set the optimum conditions for taking into consideration the ADR defect detection rate and productivity, and the optimum conditions for both the ADC classification accuracy and the throughput.

按照本實施例,能夠連續設定ADR與ADC雙方之漂移修正條件。如上所述,由於ADC與ADR的產能可能並不同等,故例如在步驟1107中,亦可將ADC與ADR的產能區別顯示。如此一來,還能夠一面比較ADC與ADR雙方的產能,一面決定最佳的漂移修正條件。此外,藉由連續設定ADR與ADC雙方的漂移修正條件,便能將步驟1102中處理的漂移修正圖像在步驟1106中直接利用,亦能縮短處理時間。 According to this embodiment, the drift correction conditions of both the ADR and the ADC can be continuously set. As described above, since the capacity of the ADC and the ADR may not be equal, for example, in step 1107, the capacity of the ADC and the ADR may be displayed differently. In this way, it is possible to determine the optimum drift correction conditions while comparing the capacity of both the ADC and the ADR. Further, by continuously setting the drift correction conditions of both the ADR and the ADC, the drift correction image processed in step 1102 can be directly used in step 1106, and the processing time can be shortened.

另,本發明並非由上述實施例所限定,還包含各種變形例。舉例來說,上述實施例是為了便於說明本發明而詳加說明,並非限定於一定要具備所說明之所有構成。此外,可將某實施例構成的一部分置換成其他實施例之構成,又,亦可於某一實施例之構成追加其他實施例之構成。此外,針對各實施例的構成的一部分,可追加、刪除或置換其他構成。 Further, the present invention is not limited to the above embodiments, and various modifications are also included. For example, the above-described embodiments are described in detail for the convenience of the description of the present invention, and are not necessarily limited to all of the configurations described. Further, a part of the configuration of a certain embodiment may be replaced with a configuration of another embodiment, and a configuration of another embodiment may be added to the configuration of a certain embodiment. Further, other configurations may be added, deleted, or replaced for a part of the configuration of each embodiment.

此外,如上所述,全體控制部及分析部113、圖像處理部114,亦可由實現實施例功能的軟體程式碼來實現。在此情形下,亦可設計成將記錄程式碼的記憶媒體 提供給資訊處理裝置,而該資訊處理裝置(或CPU)讀取記憶媒體中存儲之程式碼。在此情形下,從記憶媒體讀取出來的程式碼本身便實現前述實施例之功能,該程式碼本身,及記憶其之記憶媒體會構成本發明。作為像這樣用來供給程式碼的記憶媒體,例如可使用軟碟、CD-ROM、DVD-ROM、硬碟、光碟機、磁光碟(magneto-optic disc)、CD-R、磁帶、非揮發性的記憶卡、ROM等。另,藉由記錄有程式的記錄媒體,亦可將既有的裝置升級(upgrade)。 Further, as described above, the overall control unit, the analysis unit 113, and the image processing unit 114 may be realized by a software program code that realizes the functions of the embodiment. In this case, it can also be designed as a memory medium for recording code. Provided to the information processing device, the information processing device (or CPU) reads the code stored in the memory medium. In this case, the code itself read from the memory medium implements the functions of the foregoing embodiments, and the code itself, and the memory medium in which it is stored, constitute the present invention. As a memory medium for supplying code like this, for example, a floppy disk, a CD-ROM, a DVD-ROM, a hard disk, a compact disk, a magneto-optic disc, a CD-R, a magnetic tape, and a non-volatile one can be used. Memory card, ROM, etc. In addition, the existing device can be upgraded by recording the recording medium with the program.

此外,亦可設計成依據程式碼的指示,在資訊處理裝置上運轉的OS(作業系統)等會進行實際處理的一部分或全部,並藉由該處理來實現前述實施例之功能。又,亦可設計成將實現實施例功能的軟體程式碼透過網路配送,並將其存儲於資訊處理裝置的記憶裝置或CD-RW、CD-R等記憶媒體,於使用時,該資訊處理裝置的CPU會讀取該記憶裝置或該記憶媒體中存儲的程式碼以執行。 Further, it is also possible to design an OS (operation system) or the like operating on the information processing device to perform part or all of the actual processing in accordance with the instruction of the code, and to implement the functions of the foregoing embodiments by the processing. In addition, the software code for implementing the functions of the embodiment may be designed to be distributed over the network and stored in a memory device of the information processing device or a memory medium such as a CD-RW or a CD-R. The CPU of the device reads the code stored in the memory device or the memory medium for execution.

本發明已記述了有關具體例子,但它們於任何觀點看來均非為了限定,而是為了說明。本技術領域中具有通常知識者應當明瞭,若欲實施本發明,相應之硬體、軟體、及韌體有多數種組合。舉例來說,實現本實施例所記載功能的程式碼,可藉由組譯器(assembler)、C/C++、perl、Shell、PHP、Java(註冊商標)等廣域程式或腳本(script)語言來實行。 The present invention has been described with respect to specific examples, but they are not intended to be limiting, but are intended to be illustrative. It will be apparent to those of ordinary skill in the art that, in order to practice the present invention, there are many combinations of hardware, software, and firmware. For example, the code for implementing the functions described in this embodiment can be a wide-area program or a script language such as an assembler, C/C++, perl, shell, PHP, or Java (registered trademark). Come and implement.

此外,圖面中的控制線或資訊線係揭示說明上認為有必要者,未必揭示製品上所有控制線或資訊線。亦可設計成所有的構成相互連接。 In addition, the control lines or information lines in the drawing reveal that all the control lines or information lines on the product are not necessarily disclosed. It can also be designed such that all the components are connected to each other.

501‧‧‧畫格累計張數顯示部 501‧‧‧Drawing number of pictures

502‧‧‧修正處理前圖像顯示部 502‧‧‧Revised image display before processing

503‧‧‧修正處理後圖像顯示部 503‧‧‧Revision processed image display unit

504‧‧‧處理時間顯示部 504‧‧‧Processing time display

Claims (15)

一種帶電粒子束裝置,係具備觀察試料上的缺陷之缺陷觀察裝置,該帶電粒子束裝置,其特徵為,具備:控制部;及顯示部;前述控制部,係針對以前述缺陷觀察裝置取得的1張以上圖像,以複數個修正條件執行漂移(drift)修正處理,將前述複數個修正條件、及執行前述漂移修正處理後的複數個修正圖像建立對應,並顯示於前述顯示部以作為第1畫面。 A charged particle beam device comprising a defect observation device for observing a defect in a sample, the charged particle beam device comprising: a control unit; and a display unit; wherein the control unit is obtained by the defect observation device One or more images are subjected to drift correction processing under a plurality of correction conditions, and the plurality of correction conditions and a plurality of correction images subjected to the above-described drift correction processing are associated with each other and displayed on the display unit as The first screen. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部係針對前述複數個修正圖像執行缺陷自動觀察處理,並將藉由前述缺陷自動觀察處理檢測出之缺陷位置,重疊至前述複數個修正圖像而顯示於前述第1畫面。 The charged particle beam device of claim 1, wherein the control unit performs an automatic defect observation process on the plurality of modified images, and superimposes the defect position detected by the defect automatic observation process to the foregoing A plurality of corrected images are displayed on the first screen. 如申請專利範圍第2項之帶電粒子束裝置,其中,前述控制部係將針對前述複數個修正圖像的前述缺陷自動觀察處理之產能資訊,與前述複數個修正條件建立對應,並顯示於前述第1畫面。 The charged particle beam device according to claim 2, wherein the control unit associates the capacity information of the defect automatic observation processing on the plurality of corrected images with the plurality of correction conditions, and displays the foregoing The first screen. 如申請專利範圍第2項之帶電粒子束裝置,其中,前述控制部係將使用者所選擇的前述複數個修正條件之分布以及每個前述複數個修正條件的前述缺陷自動觀察處理之檢測率的至少一者,顯示於前述顯示部以作為第2 畫面。 The charged particle beam device of claim 2, wherein the control unit selects a distribution of the plurality of correction conditions selected by a user and a detection rate of the defect automatic observation processing for each of the plurality of correction conditions At least one is displayed on the display unit as the second Picture. 如申請專利範圍第4項之帶電粒子束裝置,其中,前述控制部係將針對前述1張以上圖像的前述漂移修正處理之執行時間以及針對前述複數個修正圖像的前述缺陷自動觀察處理之產能資訊的至少一者,顯示於前述第2畫面。 The charged particle beam device of claim 4, wherein the control unit automatically performs an observation processing time of the drift correction processing on the one or more images and the defect automatic observation processing on the plurality of corrected images. At least one of the capacity information is displayed on the second screen. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部係針對前述複數個修正圖像執行缺陷自動分類處理,並將藉由前述缺陷自動分類處理得出之分類結果,與前述複數個修正圖像建立對應而顯示於前述第1畫面。 The charged particle beam device of claim 1, wherein the control unit performs defect automatic classification processing on the plurality of modified images, and classifies the classification result by the automatic defect classification processing, and the foregoing plural number The corrected images are displayed and displayed on the first screen. 如申請專利範圍第6項之帶電粒子束裝置,其中,前述控制部係將針對前述複數個修正圖像的前述缺陷自動分類處理之產能資訊,與前述複數個修正條件建立對應,並顯示於前述第1畫面。 The charged particle beam device of claim 6, wherein the control unit associates the capacity information for the defect automatic classification processing on the plurality of corrected images with the plurality of correction conditions, and displays the foregoing The first screen. 如申請專利範圍第6項之帶電粒子束裝置,其中,前述控制部係將使用者所選擇的前述複數個修正條件之分布以及每個前述複數個修正條件的前述缺陷自動分類處理之正確率的至少一者,顯示於前述顯示部以作為第2畫面。 The charged particle beam device of claim 6, wherein the control unit automatically classifies the distribution of the plurality of correction conditions selected by a user and the defect of each of the plurality of correction conditions At least one of them is displayed on the display unit as a second screen. 如申請專利範圍第8項之帶電粒子束裝置,其中,前述控制部係將針對前述1張以上圖像的前述漂移修正處理之執行時間以及針對前述複數個修正圖像的前述缺陷自動分類處理之產能資訊的至少一者,顯示於前述第2 畫面。 The charged particle beam device according to claim 8, wherein the control unit automatically classifies the execution time of the drift correction processing for the one or more images and the defect for the plurality of corrected images. At least one of the capacity information is shown in the second Picture. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部係將針對前述1張以上圖像的前述漂移修正處理之執行時間,與前述複數個修正條件建立對應,並顯示於前述第1畫面。 The charged particle beam device according to claim 1, wherein the control unit associates the execution time of the drift correction processing for the one or more images with the plurality of correction conditions, and displays the 1 screen. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部係將前述漂移修正處理前的前述1張以上圖像,與前述複數個修正條件建立對應,並顯示於前述第1畫面。 The charged particle beam device according to claim 1, wherein the control unit associates the one or more images before the drift correction processing with the plurality of correction conditions and displays the image on the first screen. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部係將使用者所選擇的前述複數個修正條件之分布,顯示於前述顯示部以作為第2畫面。 The charged particle beam device according to claim 1, wherein the control unit displays the distribution of the plurality of correction conditions selected by the user on the display unit as the second screen. 如申請專利範圍第12項之帶電粒子束裝置,其中,前述控制部係將針對前述1張以上圖像的前述漂移修正處理之執行時間,與前述複數個修正條件的前述分布建立對應,並顯示於前述第2畫面。 The charged particle beam device according to claim 12, wherein the control unit associates the execution time of the drift correction processing for the one or more images with the distribution of the plurality of correction conditions, and displays In the second screen above. 如申請專利範圍第1項之帶電粒子束裝置,其中,前述控制部,係針對前述複數個修正圖像執行缺陷自動觀察處理,並將藉由前述缺陷自動觀察處理檢測出之缺陷位置,重疊至前述複數個修正圖像而顯示於前述第1畫面,針對前述複數個修正圖像執行缺陷自動分類處理,並將藉由前述缺陷自動分類處理得出之分類結果,與前述複 數個修正圖像建立對應而顯示於前述顯示部以作為第2畫面。 The charged particle beam device according to claim 1, wherein the control unit performs defect automatic observation processing on the plurality of corrected images, and superimposes the defect position detected by the defect automatic observation processing to Displaying the plurality of modified images on the first screen, performing defect automatic classification processing on the plurality of modified images, and performing classification result obtained by the defect automatic classification processing, and the foregoing complex A plurality of corrected images are associated with each other and displayed on the display unit as a second screen. 如申請專利範圍第14項之帶電粒子束裝置,其中,前述控制部係將針對前述複數個修正圖像的前述缺陷自動觀察處理之產能資訊以及針對前述複數個修正圖像的前述缺陷自動分類處理之產能資訊,區隔顯示於前述第2畫面。 The charged particle beam device of claim 14, wherein the control unit automatically classifies the capacity information of the defect automatic observation processing for the plurality of modified images and the defect for the plurality of modified images. The capacity information is displayed on the second screen.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI823419B (en) * 2021-06-22 2023-11-21 日商日立全球先端科技股份有限公司 Sample observation device and method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6145133B2 (en) * 2015-06-04 2017-06-07 株式会社日立ハイテクノロジーズ Charged particle beam equipment
JP7107653B2 (en) * 2017-08-31 2022-07-27 東レエンジニアリング先端半導体Miテクノロジー株式会社 Image generation method
JP7080123B2 (en) * 2018-07-23 2022-06-03 株式会社キーエンス Image inspection equipment
CN112640026A (en) * 2018-08-28 2021-04-09 Asml荷兰有限公司 Time-dependent defect inspection apparatus
JP2020187876A (en) * 2019-05-13 2020-11-19 株式会社日立ハイテク Charged particle beam device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361894B2 (en) 2002-10-22 2008-04-22 Hitachi High-Technologies Corporation Method of forming a sample image and charged particle beam apparatus
JP4065847B2 (en) 2001-11-21 2008-03-26 株式会社日立ハイテクノロジーズ Sample image forming method and charged particle beam apparatus
WO2003044821A1 (en) * 2001-11-21 2003-05-30 Hitachi High-Technologies Corporation Sample imaging method and charged particle beam system
GB2450502B (en) * 2007-06-26 2012-03-07 Statoil Asa Microbial enhanced oil recovery
JP4696097B2 (en) * 2007-07-23 2011-06-08 株式会社日立ハイテクノロジーズ Sample image forming method and charged particle beam apparatus
JP5292043B2 (en) * 2008-10-01 2013-09-18 株式会社日立ハイテクノロジーズ Defect observation apparatus and defect observation method
US8125518B2 (en) * 2008-12-15 2012-02-28 Hitachi High-Technologies Corporation Scanning electron microscope
US8094924B2 (en) * 2008-12-15 2012-01-10 Hermes-Microvision, Inc. E-beam defect review system
US8664596B2 (en) * 2009-06-23 2014-03-04 Hermes Microvision, Inc. Method for characterizing identified defects during charged particle beam inspection and application thereof
JP5462875B2 (en) * 2009-07-16 2014-04-02 株式会社日立ハイテクノロジーズ Charged particle beam microscope and measuring method using the same
US20120295171A1 (en) * 2010-01-22 2012-11-22 Konica Minolta Holdings, Inc. Fuel Cell System
WO2011089911A1 (en) * 2010-01-25 2011-07-28 株式会社日立ハイテクノロジーズ Charged particle beam microscope and method of measurement employing same
JP5174863B2 (en) * 2010-07-28 2013-04-03 株式会社日立ハイテクノロジーズ Image acquisition condition setting device and computer program

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI823419B (en) * 2021-06-22 2023-11-21 日商日立全球先端科技股份有限公司 Sample observation device and method

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