TW201418890A - Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing touch panel - Google Patents

Abstract

A photosensitive resin composition for ITO etching includes a binder polymer, a photopolymerizable compound, a photoinitiator, and a silane coupling agent. The silane coupling agent includes a silane compound having a mercapto alkyl group.

Description

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel

The present invention relates to a photosensitive resin composition, a photosensitive element, a method of forming a resist pattern, and a method of producing a touch panel.

The touch sensor portion of the touch panel includes a sensor portion and a wiring (lead wiring portion), and the sensor portion does not block the information of the screen in a range of the visible image (view area), and The information touched by the finger of the person is sensed and acquired, and the wiring is used to transmit the information.

A pattern of a transparent electrode having less absorption of visible light and having conductivity is formed in the sensor portion of the visible region. Further, a metal having a small resistance value is used for the lead wiring.

The sensor portion and the lead wiring portion are manufactured, for example, in the following manner. First, a photosensitive resin composition is laminated on polyethylene terephthalate or glass having a transparent electrode layer (layering step). Next, a predetermined portion of the photosensitive resin composition is irradiated with actinic rays to harden (or dissolve) the exposed portion (exposure step). Thereafter, the uncured portion (or the dissolved portion) is removed (developed) from the substrate, whereby a resist pattern containing a cured product of the photosensitive resin composition is formed on the substrate (developing step). The obtained resist pattern is subjected to an etching treatment to form a sensor pattern of the visible region on the substrate, and then the resist is peeled off (peeling step). Then, the lead wiring is formed from the sensor pattern of the formed transparent electrode by screen printing using silver paste or the like, thereby manufacturing the touch sensor portion of the touch panel.

2(a) to 2(e) are schematic cross-sectional views showing a conventional manufacturing method of the touch panel. In the manufacturing method, as the layering step, the photosensitive resin composition layer 16 is laminated on the transparent electrode layer 14 including the transparent electrode layer 14 and the laminated base material of the support substrate 12 (FIG. 2(a)). Next, a predetermined portion of the photosensitive resin composition layer 16 is irradiated with actinic rays to harden the exposed portion, and then the uncured portion is removed from the substrate to form a resist pattern containing the hardened portion (Fig. 2(b) ). Then, the laminated substrate on which the resist pattern is formed is subjected to an etching treatment to remove a part of the transparent electrode layer 14 from the support substrate 12 (FIG. 2(c)), and then the resist is removed and removed to support A sensor pattern of a visible region is formed on the substrate 12 (Fig. 2(d)). The lead wiring 18 from the formed sensor pattern is formed by screen printing using silver paste or the like, thereby manufacturing the touch sensor portion of the touch panel.

In the lamination step, a liquid photosensitive resin composition is previously applied to laminate a layer. However, in recent years, with the thin and light weight of the touch panel, the demand for forming a substrate of the touch sensor portion by the film is increasing, and a photosensitive element having good compatibility with the film substrate is being introduced. Manufacturing carried out.

In addition, due to the narrowness of the bezel of the touch panel, it is also required to The pitch of the wiring is narrowed. In screen printing using silver paste, L/S (line width/space width) is about 70/70 (unit: μm), but it is necessary to form lead wires having an L/S of 30/30 or less.

Therefore, as a method of forming a new touch sensor portion having a small L/S of the lead wiring, there are the following methods. A laminated resin substrate having a three-layer structure including a metal layer (for drawing wiring formation), a transparent electrode layer (for sensor pattern formation in a visible region), and a support substrate (film) is used, and a photosensitive resin composition is used. A layer is laminated (laminated) on the laminated substrate (layering step). Next, the predetermined portion of the photosensitive resin composition layer is irradiated with actinic rays to harden (or dissolve) the exposed portion (exposure step). Thereafter, the uncured portion (or the dissolved portion) is removed (developed) from the substrate, whereby a resist pattern containing a cured product of the photosensitive resin composition is formed on the substrate (developing step). With respect to the obtained resist pattern, the metal layer and the transparent electrode layer (first etching step) are removed by an etching process to form a pattern of the transparent electrode that leads the wiring and the visible region. Then, the photosensitive resin composition layer is re-laminated, exposed and developed, whereby only the unnecessary metal layer in the visible region is removed (second etching). By this method, a touch sensor portion having a narrow pitch of the lead wires is manufactured (for example, refer to Patent Document 1).

In principle, the method can change the L/S to 30/30 or less, which is a technology that can contribute greatly to the thinness and weight reduction of the touch panel. However, the surface of the substrate used on one side has a very high smoothness, and the photosensitive element to be used requires high adhesion.

In addition, for example, the composition described in Patent Document 2 to Patent Document 6 is disclosed as a photosensitive resin composition for forming a resist pattern.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent No. 4855536

Patent Document 2: Japanese Patent Laid-Open No. Hei 07-146553

Patent Document 3: Japanese Patent Laid-Open Publication No. 2005-107121

Patent Document 4: Japanese Patent Laid-Open Publication No. 2008-112145

Patent Document 5: Japanese Patent Laid-Open Publication No. 2010-276631

Patent Document 6: Japanese Patent Laid-Open No. 2011-128358

When a glass substrate is used as the support substrate, the transparent electrode is often formed by patterning using amorphous indium tin oxide (ITO), and then heating it for the purpose of lowering the resistance value. (annealing) treatment to carry out crystallization of ITO. However, when a film substrate is used as the support substrate, if the annealing treatment is performed, shrinkage of the substrate is caused and dimensional stability is deteriorated. Therefore, it is desirable to pattern using crystalline ITO.

However, the amorphous ITO can be sufficiently dissolved by a weak acid such as oxalic acid, but the crystalline ITO must be etched under a heating condition of about 40 to 50 ° C using concentrated hydrochloric acid (>20% by mass). Therefore, high acid resistance is required for the resist used for patterning.

Further, copper, an alloy of copper and nickel, a molybdenum-aluminum-molybdenum laminate, an alloy of silver and palladium, and copper are used for the metal layer. However, in recent years, in order to prevent rust, an alloy of copper and nickel is disposed on the outermost surface. Metal layers are becoming mainstream. Therefore, the resist needs to have adhesion to a metal layer containing copper, particularly a metal layer containing an alloy of copper and nickel.

In the conventional photosensitive resin composition, it is difficult to form a resist pattern that satisfactorily satisfies the above-described acid resistance and adhesion, and there is a problem that peeling occurs during ITO etching with hydrochloric acid.

As a result of intensive studies, the inventors of the present invention have found that a decane compound having a mercaptoalkyl group is added as a decane coupling agent to a photosensitive resin composition, and it is expected to improve acid resistance and adhesion.

That is, the first aspect of the present invention relates to a photosensitive resin composition for ITO etching, comprising a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a decane coupling agent, and the decane coupling agent includes A decane compound having a mercaptoalkyl group.

Since the photosensitive resin composition can form a resist pattern excellent in acid resistance and adhesion, it can be suitably used as a photosensitive resin composition for ITO etching, and particularly for etching a transparent conductive layer containing crystalline ITO. A photosensitive resin composition.

The above decane coupling agent may further comprise a decane compound having an amine group. According to such a photosensitive resin composition, development residue of the resist on the metal layer is suppressed, and etching time is expected to be shortened.

The above decane coupling agent may further comprise a decane compound having a (meth) propylene fluorenyloxy group. According to such a photosensitive resin composition, adhesion to a metal layer is expected to further improve.

The above photopolymerizable compound may contain bisphenol A type di(meth)acrylate Compound. According to such a photosensitive resin composition, the acid resistance of the resist is further improved, and peeling due to swelling of the resist can be more remarkably suppressed during ITO etching.

The photopolymerizable compound may include urethane di(meth)acrylate having a (poly)oxyethylene group and/or a polyoxypropylene group. Compound. Thereby, flexibility can be imparted to the resist, and more excellent adhesion can be ensured for a flexible substrate such as a film substrate.

According to a second aspect of the invention, there is provided a photosensitive element comprising: a support film; and a photosensitive resin composition layer comprising the photosensitive resin composition of the first aspect provided on one surface of the support film. According to the photosensitive element, since the photosensitive resin composition layer containing the photosensitive resin composition of the first aspect is provided, it is possible to efficiently form a substrate having high smoothness and to have excellent adhesion and excellent adhesion. Acid resistant resist pattern.

A third aspect of the present invention relates to a method for forming a resist pattern, comprising: forming, in a first step, a photosensitive resin composition layer containing the photosensitive resin composition of the first aspect; In the second step, a region of a part of the photosensitive resin composition layer is cured by irradiation with actinic rays to form a cured region; and a third step is performed by using the photosensitive resin composition layer other than the cured region The area is removed from the above substrate to obtain a resist pattern including the hardened region described above. According to the method for forming a resist pattern, it is possible to form a resist pattern having excellent adhesion to a substrate having high smoothness and having excellent acid resistance.

A fourth aspect of the present invention relates to a method of manufacturing a touch panel, comprising: etching a substrate on which a resist pattern is formed by a method of forming a resist pattern according to the third aspect; step. In the method of manufacturing a touch panel, since the resist pattern is formed of a photosensitive resin composition layer containing the photosensitive resin composition of the first aspect, the resist in the etching process is sufficiently suppressed. The peeling of the agent pattern or the like can be efficiently manufactured even with a touch panel having a small pitch (for example, a touch panel having a lead wiring having an L/S of 30/30 or less).

A fifth aspect of the present invention relates to a method of manufacturing a touch panel, comprising: a first step of providing a transparent conductive layer containing indium tin oxide on a surface of a support substrate and a surface of the support substrate; a resist pattern comprising a cured product of the photosensitive resin composition of the first aspect described above on the metal layer of the laminated substrate of the metal layer provided on the transparent conductive layer; and a second step of the metal layer and The transparent conductive layer is etched to form a buildup pattern including a residual portion of the transparent conductive layer and a residual portion of the metal layer; and a third step of removing the metal layer from a portion of the build-up pattern to form the transparent conductive layer The transparent electrode of the residual portion and the metal wiring including the remaining portion of the metal layer.

According to such a method of manufacturing a touch panel, it is possible to easily and efficiently manufacture a touch panel having a small pitch (for example, a touch panel having lead wires having an L/S of 30/30 or less).

The transparent conductive layer may contain crystalline indium tin oxide, and the etching in the second step may be etching using a strong acid. In the above manufacturing method, due to the resist Since the pattern is formed of the photosensitive resin composition layer containing the photosensitive resin composition of the first aspect described above, peeling of the resist pattern or the like is sufficiently suppressed even by etching with a strong acid. Therefore, the above-described manufacturing method can be suitably applied to the manufacture of a touch panel using a laminated substrate provided with a transparent conductive layer containing crystalline indium tin oxide.

According to the present invention, it is possible to provide a photosensitive resin composition which is excellent in adhesion to a substrate having high smoothness and has excellent acid resistance such as peeling off even by ITO etching using hydrochloric acid. Resist pattern. Moreover, according to the present invention, a photosensitive element using the photosensitive resin composition, a method of forming a resist pattern, and a method of manufacturing a touch panel are provided.

2‧‧‧Support film

4‧‧‧Photosensitive resin composition layer

6‧‧‧Protective film

10‧‧‧Photosensitive components

12‧‧‧Support substrate

14‧‧‧Transparent conductive layer

16‧‧‧Photosensitive resin composition layer

18‧‧‧Leading wiring

22‧‧‧Support substrate

24‧‧‧Transparent conductive layer

26‧‧‧metal layer

28‧‧‧Photosensitive resin composition layer

29‧‧‧resist pattern

30‧‧‧Photosensitive resin composition layer

31‧‧‧Resist

52‧‧‧X electrode (transparent electrode)

54‧‧‧Y electrode (transparent electrode)

56, 57‧‧‧ lead wiring

100‧‧‧ touch panel

Fig. 1 is a schematic cross-sectional view showing an embodiment of a photosensitive element of the present invention.

2(a) to 2(e) are schematic cross-sectional views showing a prior art manufacturing method of the touch panel.

3(a) to 3(h) are schematic cross-sectional views showing an embodiment of a method of manufacturing a touch panel of the present invention.

4 is a plan view showing an aspect of a touch panel obtained by the present invention.

Hereinafter, embodiments for carrying out the invention will be described in detail. However, the present invention is not limited to the following embodiments. Furthermore, in this specification, the so-called (A Acrylic acid means acrylic acid or methacrylic acid, the so-called (meth) acrylate means acrylate or methacrylate corresponding thereto, and the so-called (meth) acryloxy group means acryloxy group. Or methacryloxyloxy.

In the present specification, the (poly)oxyethylene group means at least one type of polyoxyethylene group in which an oxyethylene group or two or more vinyl groups are bonded by an ether bond, and a (poly)oxypropylene group. It means at least one of an oxypropylene group or a polyoxypropylene group in which two or more propylene groups are bonded by an ether bond. In addition, "EO modification" means a compound having a (poly)oxyethylene group, and "PO modification" means a compound having a (poly)oxypropylene group, and "EO.PO modification" is Refers to a compound having both (poly)oxyethylene and/or (poly)oxypropenyl groups.

<Photosensitive resin composition>

The photosensitive resin composition of the present embodiment (hereinafter, simply referred to as "photosensitive resin composition") is a photosensitive resin composition including (A) component: binder polymer, and (B) component: photopolymerization The compound, the component (C): a photopolymerization initiator, and the component (D): a decane coupling agent, and the component (D) contains a decane compound having a mercaptoalkyl group.

According to such a photosensitive resin composition, it is possible to form a resist pattern which is excellent in adhesion to a substrate having high smoothness and which is excellent in acid resistance such as peeling even when ITO is etched by hydrochloric acid. Therefore, the photosensitive resin composition of the present embodiment is suitably used as a photosensitive resin composition for ITO etching, and particularly a photosensitive resin composition for etching comprising a transparent conductive layer of crystalline ITO.

As one of the reasons for obtaining such an effect, it can be considered that the surface of the substrate is the most The metal layer provided on the surface forms a chemical bond such as a complex with a mercaptoalkyl group of a decane coupling agent to exhibit high adhesion. In the photo-curing reaction of the photosensitive resin composition of the present embodiment, a decane compound having a mercaptoalkyl group is reacted with a photopolymerizable compound to form a sulfide bond. Therefore, it is considered that the decane coupling agent is fixed in the polymer system of the cured product, and further, the sulfide bond brings chemical interaction to the substrate, whereby the adhesion between the resist and the metal surface is more strongly exhibited.

(A) Component: Adhesive polymer

The photosensitive resin composition contains at least one binder polymer as the component (A). The binder polymer is, for example, a polymer obtained by subjecting a polymerizable monomer (monomer) to radical polymerization.

Examples of the polymerizable monomer (monomer) include (meth)acrylic acid; alkyl (meth)acrylate; cycloalkyl (meth)acrylate; benzyl (meth)acrylate; Benzyl acrylate derivative, decyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, bicyclo (meth) acrylate Amyl ester, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-tri(meth)acrylate Fluoroethyl ester, 2,2,3,3-tetrafluoropropyl (meth)acrylate, α-bromoacrylic acid, α-chloroacrylic acid, dicyclopentenyloxyethyl (meth)acrylate, (methyl) Dicyclopentyloxyethyl acrylate, isobornyloxyethyl (meth)acrylate, cyclohexyloxyethyl (meth)acrylate, adamantylethyl (meth)acrylate, (meth)acrylic acid Dicyclopentenyloxypropoxyethyl ester, dicyclopentyloxypropoxyethyl (meth)acrylate, adamantyloxypropyl (meth)acrylate (meth) acrylate such as oxyethyl ester, β-furyl (meth)acrylate, β-styrene (meth)acrylate; styrene; vinyl toluene, α-methylstyrene, etc. in α- A styrene derivative which can be polymerized on a poly or aromatic ring; an acrylamide such as diacetone acrylamide; an ether compound of a vinyl alcohol such as acrylonitrile or vinyl-n-butyl ether; maleic acid Maleic anhydride; maleic acid monomethyl ester, maleic acid monoethyl ester, maleic acid monoisopropyl ester, etc. maleic acid monoester; fumaric acid, cinnamon An unsaturated carboxylic acid derivative such as an acid, α-cyano cinnamic acid, itaconic acid, crotonic acid or a propiolic acid may be used singly or in combination of two or more kinds.

The component (A) preferably has a structural unit derived from (meth)acrylic acid. When the component (A) has a structural unit derived from (meth)acrylic acid, the resolution and the releasability (resistance of the resist after etching) are excellent, and the total amount of the component (A) is used as a reference. (100% by mass, the same applies hereinafter), the content thereof is preferably from 10% by mass to 60% by mass, more preferably from 15% by mass to 50% by mass, even more preferably from 20% by mass to 35% by mass.

Further, from the viewpoint of further improving the acid developability and the releasability, the component (A) preferably has a structural unit derived from an alkyl (meth)acrylate.

The alkyl (meth)acrylate is preferably an ester of (meth)acrylic acid with an alkyl alcohol having 1 to 12 carbon atoms. Examples of such an alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. Ethyl acrylate, hexyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate may be used singly or in combination of two or more kinds.

When the component (A) has a structural unit derived from an alkyl (meth)acrylate, the content of the component (A) is preferably based on the total amount of the component (A), from the viewpoint of excellent resolution and adhesion. 40% by mass to 90% by mass, more preferably 50% by mass to 85% by mass, and still more preferably 65% by mass to 80% by mass.

The acid value of the component (A) is preferably from 90 mgKOH/g to 250 mgKOH/g, more preferably from 100 mgKOH/g to 240 mgKOH/g, even more preferably from 120 mgKOH/g to 235 mgKOH, from the viewpoint of excellent developability and adhesion. /g, particularly preferably from 130 mgKOH/g to 230 mgKOH/g.

The acid value is preferably 90 mgKOH/g or more, more preferably 100 mgKOH/g or more, still more preferably 120 mgKOH/g or more, and particularly preferably 130 mgKOH/g or more, from the viewpoint of shortening the development time.

In addition, the acid value is preferably 250 mgKOH/g or less, more preferably 240 mgKOH/g or less, and still more preferably 235 mgKOH/g or less, from the viewpoint of further improving the adhesion of the cured product of the photosensitive resin composition. Preferably it is 230 mgKOH/g or less. In the case of performing solvent development, it is preferred to adjust a polymerizable monomer (monomer) having a carboxyl group such as (meth)acrylic acid to a small amount.

The weight average molecular weight (Mw) of the component (A) is measured by gel permeation chromatography (GPC) (by conversion using a calibration curve of standard polystyrene), and developability The viewpoint of excellent adhesion is preferably 10,000 to 200,000, more preferably 20,000 to 100,000, still more preferably 25,000 to 80,000, and particularly preferably 30,000 to 60,000. From the viewpoint of excellent developability, it is preferably 200,000 or less, more preferably 100,000 or less, and furthermore The best is 80,000 or less, and the best is 60000 or less. From the viewpoint of excellent adhesion, it is preferably 10,000 or more, more preferably 20,000 or more, still more preferably 25,000 or more, and particularly preferably 30,000 or more.

The degree of dispersion (weight average molecular weight / number average molecular weight) of the component (A) is preferably 3.0 or less, more preferably 2.8 or less, still more preferably 2.5 or less, from the viewpoint of excellent resolution and adhesion.

As the component (A), one type of binder polymer may be used alone, or two or more types of binder polymers may be used arbitrarily in combination.

In the total amount of the component (A) and the component (B), the content of the component (A) in the photosensitive resin composition is preferably set in the viewpoint of the film formation property, the sensitivity, and the resolution. It is preferably 30 parts by mass to 70 parts by mass, more preferably 35 parts by mass to 65 parts by mass, and particularly preferably 40 parts by mass to 60 parts by mass. The content of the film (photosensitive resin composition layer) is preferably 30 parts by mass or more, more preferably 35 parts by mass or more, and particularly preferably 40 parts by mass or more. In addition, the content thereof is preferably 70 parts by mass or less, more preferably 65 parts by mass or less, and still more preferably 60 parts by mass or less from the viewpoint of sufficiently obtaining sensitivity and resolution.

(B) component: photopolymerizable compound

The photosensitive resin composition contains at least one photopolymerizable compound as the component (B). The photopolymerizable compound is not particularly limited as long as it is a photopolymerizable compound.

The photopolymerizable compound is preferably a radically polymerizable compound, more preferably a compound having an ethylenically unsaturated bond. As a compound having an ethylenically unsaturated bond Examples of the compound include a compound having one ethylenically unsaturated bond in the molecule, a compound having two ethylenically unsaturated bonds in the molecule, and a compound having three or more ethylenically unsaturated bonds in the molecule.

The component (B) preferably contains at least one compound having two ethylenically unsaturated bonds in its molecule. When the component (B) contains a compound having two ethylenically unsaturated bonds in the molecule, the content thereof is preferably from 5 parts by mass to 60 parts by mass based on 100 parts by mass of the total of the components (A) and (B). More preferably, it is 5 mass parts - 55 mass parts, and further preferably 10 mass parts - 50 mass parts.

Examples of the compound having two ethylenically unsaturated bonds in the molecule include a bisphenol A type di(meth)acrylate compound, a hydrogenated bisphenol A type di(meth)acrylate compound, and an amine group in the molecule. a diester (meth) acrylate compound of a formate bond, a polyalkylene glycol di(meth) acrylate having both (poly)oxyethylene groups and (poly)oxypropylene groups in the molecule, and trishydroxyl Methyl propane di(meth)acrylate.

The (B) component preferably contains a compound selected from the group consisting of a bisphenol A type di(meth) acrylate compound and a (poly) oxyethylene group and/or a (poly) oxypropylene group, from the viewpoint of further improving acid resistance. At least one of the group consisting of a urethane di(meth) acrylate compound (hereinafter referred to as "EO.PO modified urethane di(meth) acrylate compound") .

The bisphenol A type di(meth) acrylate compound is a compound represented by the following formula (1).

[Chemical 1]

In the formula (1), R ¹ and R ² each independently represent a hydrogen atom or a methyl group. XO and YO each independently represent an oxyethylene group or an oxypropylene group. m ₁ , m ₂ , n ₁ and n ₂ each independently represent 0 to 40. However, m ₁ + n ₁ and m ₂ + n ₂ are each 1 or more. When XO is an oxyethylene group and YO is an oxypropylene group, m ₁ + m ₂ is 1 to 40, and n ₁ + n ₂ is 0 to 20. When XO is an oxypropylene group and YO is an oxyethylene group, m ₁ + m ₂ is 0 to 20, and n ₁ + n ₂ is 1 to 40. m ₁ , m ₂ , n ₁ and n ₂ represent the number of constituent units constituting the unit. Therefore, an integer value is represented in a single molecule, and when it is an aggregate of a plurality of molecules, a rational number as an average value is represented. Hereinafter, the same is true for the number of constituent units constituting the unit.

In the formula (1), m ₁ + m _{2 is} preferably from 8 to 40, more preferably from 8 to 20, still more preferably from 8 to 10, from the viewpoint of excellent acid resistance.

When the photosensitive resin composition contains the bisphenol A type di(meth)acrylate compound as the component (B), the content is preferably 1 in 100 parts by mass of the total of the components (A) and (B). Parts by mass to 50 parts by mass, more preferably 5 parts by mass~ 50 parts by mass.

As EO. The PO-modified urethane di(meth) acrylate compound may, for example, be a compound represented by the following formula (2).

In the formula (2), R ³ each independently represents a hydrogen atom or a methyl group. OR ⁴ and OR ⁵ each independently represent an oxyethylene group or an oxypropylene group. R ⁶ represents an alkyl chain. m and n respectively represent 0 to 40. Among them, m+n is 1 or more. When OR ⁴ is an oxyethylene group and OR ⁵ is an oxypropylene group, the total amount of m is 1 to 40, and the total amount of n is 0 to 20. When OR ⁴ is an oxypropylene group and OR ⁵ is an oxyethylene group, the total amount of m is 0 to 20, and the total amount of n is 1 to 40. m and n represent the number of constituent units constituting the unit. Therefore, an integer value is represented in a single molecule, and when it is an aggregate of a plurality of molecules, a rational number as an average value is represented. Hereinafter, the same is true for the number of constituent units constituting the unit.

When the photosensitive resin composition contains EO. When the PO modified urethane di(meth)acrylate compound is the component (B), the content of the component (A) and the component (B) is preferably 1 part by mass per 100 parts by mass. 50 parts by mass, better It is 5 parts by mass to 50 parts by mass.

The photosensitive resin composition may further contain, as the component (B), a compound having one ethylenically unsaturated bond in the molecule, in addition to the compound having two ethylenically unsaturated bonds in the molecule.

Examples of the compound having one ethylenically unsaturated bond in the molecule include mercaptophenoxy polyoxyethylene acrylate, a phthalic acid-based compound, and an alkyl (meth)acrylate. Among these, from the viewpoint of improving the resolution, the adhesion, the shape of the resist, and the peeling property after hardening, it is preferable to contain nonylphenoxy polyoxyethylene acrylate or phthalic acid. A formic acid compound.

Examples of the phthalic acid-based compound having one ethylenically unsaturated bond in the molecule include γ-chloro-β-hydroxypropyl-β'-methacryloxyethyl-phthalic acid. Ester, 2-propenyloxyethyl-2-hydroxyethyl-phthalic acid, and 2-propenyloxyethyl-phthalic acid.

When the photosensitive resin composition contains a compound having one ethylenically unsaturated bond in the molecule as the component (B), the content is preferably 1 in 100 parts by mass of the total of the components (A) and (B). The mass fraction is preferably 20 parts by mass, more preferably 3 parts by mass to 15 parts by mass, and still more preferably 5 parts by mass to 12 parts by mass.

The content of the entire component (B) in the photosensitive resin composition is preferably 30 parts by mass to 70 parts by mass, more preferably set to 100 parts by mass based on the total amount of the component (A) and the component (B). 35 parts by mass to 65 parts by mass, particularly preferably 35 parts by mass to 50 parts by mass. When the content is 30 parts by mass or more, sufficient sensitivity and resolution tend to be easily obtained. If it is 70 parts by mass or less, it is easy to form The film (photosensitive resin composition layer) tends to have a good resist shape.

(C) component: photopolymerization initiator

The photosensitive resin composition contains at least one photopolymerization initiator as the component (C). The photopolymerization initiator is not particularly limited as long as it can polymerize the component (B), and can be suitably selected from photopolymerization initiators which are usually used.

As the component (C), benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1, 2-A can be mentioned. An aromatic ketone such as -1-[4-(methylthio)phenyl]-2-morpholinyl-acetone-1; an anthracene such as an alkyl hydrazine; a benzoin ether compound such as a benzoin alkyl ether; benzoin a benzoin compound such as alkyl benzoin; a benzyl derivative such as benzyl dimethyl ketal; 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-fluorophenyl) 2,4,5-triarylimidazole dimer such as -4,5-diphenylimidazole dimer; 9-phenyl acridine, 1,7-(9,9'-acridinyl) heptane Such as acridine derivatives and the like. These may be used alone or in combination of two or more.

The component (C) is preferably at least one selected from the group consisting of 2,4,5-triarylimidazole dimers, more preferably 2-(o-chlorophenyl)- from the viewpoint of further improving sensitivity and adhesion. 4,5-diphenylimidazole dimer. The structure of the 2,4,5-triarylimidazole dimer may be symmetrical or asymmetric.

The content of the component (C) in the photosensitive resin composition is preferably from 0.1 part by mass to 10 parts by mass, more preferably from 1 part by mass to 7 parts by mass per 100 parts by mass of the total of the component (A) and the component (B). The mass part is more preferably 2 parts by mass to 6 parts by mass, particularly preferably 3 parts by mass to 5 parts by mass. If the content of the component (C) is 0.1 part by mass or more, In the case where it is easy to obtain good sensitivity, resolution, or adhesion, when it is 10 parts by mass or less, a favorable resist shape tends to be easily obtained.

(D) component: decane coupling agent

The photosensitive resin composition contains a decane coupling agent as the component (D). The decane coupling agent may, for example, be a component (D1): a decane compound having a mercaptoalkyl group, or a component (D2): a decane compound having an amine group (preferably a decane compound having a ureido group), and (D3) having (methyl group) a decyl compound of propylene oxime. Among these, the photosensitive resin composition contains at least the component (D1).

When the photosensitive resin composition contains the component (D1) as the component (D), the following excellent effects are obtained, and the adhesion to the substrate having high smoothness is excellent, and ITO is used even by using hydrochloric acid. In the etching, it is also difficult to produce an excellent acid-resistant resist pattern such as peeling.

Further, the photosensitive resin composition may contain a decane coupling agent other than the component (D1) as the component (D).

For example, as the photosensitive resin composition, the component (D1) and the component (D3) may be used in combination as the component (D). When the photosensitive resin composition contains only the component (D1) as the component (D), a resist which exhibits excellent adhesion can be obtained, and on the other hand, development residue (ie, formation) of the copper substrate or the like is likely to occur. The resist on the copper substrate tends to be peeled off after etching, and the etching time tends to increase. On the other hand, when the photosensitive resin composition contains the component (D1) and the component (D3) as the component (D), excellent adhesion can be maintained, and development of a copper substrate or the like can be suppressed, and etching time can be obtained. Shortened.

Further, the photosensitive resin composition may contain both the (D1) component, the (D2) component, and the (D3) component as the component (D). According to such a photosensitive resin composition, generation of development residue on a copper substrate or the like can be suppressed, and higher adhesion can be achieved.

The (D1) component is preferably a decane compound (mercaptoalkyl alkoxy decane) having a mercaptoalkyl group and an alkoxy group. Examples of the (D1) component include mercaptopropylmethyldimethoxydecane. , mercaptopropyltrimethoxydecane, mercaptopropyltriethoxydecane, and the like. Among them, in view of the appearance of adhesion, it is preferably a mercaptopropyltrimethoxydecane which is likely to cause hydrolysis and can be crosslinked at three points.

The component (D2) is preferably a decane compound having a primary amino group at the terminal, and examples of such a component (D2) include 3-aminopropylmethoxydecane and aminopropyl ethoxy decane. N-2-(aminoethyl)-3-aminopropyltrimethoxydecane, 3-ureidopropyltriethoxydecane, 3-ureidopropyltrimethoxydecane, ureidomethyltrimethyl Oxydecane, ureidomethyltriethoxydecane, 2-ureidoethyltrimethoxydecane, 2-ureidoethyltriethoxydecane, 4-ureidobutyltrimethoxydecane, 4- Urea butyl triethoxy decane, and the like. In particular, in view of reactivity with the binder polymer, a decane compound having a functional group having a low reactivity with a carboxylic acid group such as a ureido group is preferably used in combination with the component (D1). 3-ureidopropyltriethoxydecane having a suppressing effect of development residue was observed.

Examples of the component (D3) include 3-methacryloxypropylmethyldimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, and 3-methylpropeneoxime. Propylmethyldiethoxydecane, 3-methylpropenyloxypropyltriethoxydecane. Among them, in view of the appearance of adhesion, it is optimal to be prone to hydrolysis, and 3-methylpropenyloxypropyltrimethoxydecane which can be crosslinked at 3 points can be carried out.

The content of the component (D) in the photosensitive resin composition is preferably 0.01 parts by mass to 10 parts by mass based on 100 parts by mass of the total of the components (A) and (B). More preferably, it is 0.05 mass part - 5 mass parts, and further preferably 0.1 mass part - 3 mass parts. When the content of the component (D) is more than the above range, development of the copper substrate or the like tends to occur, and there is a possibility that the resolution is lowered. The hardening of the bottom of the resist caused by a large increase in sensitivity is insufficient. On the other hand, when the content of the component (D) is within the above range, it is possible to sufficiently suppress the development residue on the copper substrate or the like and to achieve an appropriate hardenability sufficiently cured to the bottom of the resist. A good resist shape can be obtained by a sufficient effect up to the bottom of the resist, and the resistance to the etching liquid becomes better.

(other ingredients)

The photosensitive resin composition may contain components other than the components (A) to (D) as needed. For example, the photosensitive resin composition may contain a dye selected from the group consisting of sensitizing dyes, bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, and colorless crystal violet. (leuco crystal violet) at least one of the group consisting of.

Examples of the sensitizing dye include a dialkylaminodiphenyl ketone compound, a pyrazoline compound, an anthraquinone compound, a coumarin compound, a xanthone compound, a thioxanthone compound, an oxazole compound, and benzene. And oxazole compound, thiazole compound, benzothiazole compound, triazole compound, stilbene compound, triazine compound, thiophene compound, naphthalimide compound, triarylamine compound And an acridine compound. These may be used alone or in combination of two or more.

Further, the photosensitive resin composition may contain a polymerizable compound (oxetane compound or the like) having at least one cyclic ether group capable of cationic polymerization in the molecule; a cationic polymerization initiator; malachite green (malachite green) ), Victoria pure blue, brilliant green, methyl violet, etc.; tribromophenyl hydrazine, diphenylamine, benzylamine, triphenylamine, diethyl Photochromic agent such as aniline or o-chloroaniline; thermal coloring preventive agent; plasticizer such as p-toluenesulfonamide; pigment; filler; antifoaming agent; flame retardant; stabilizer; adhesion imparting agent; Dyeing agent; peeling accelerator; antioxidant; perfume; imaging agent; These may be used alone or in combination of two or more.

When the photosensitive resin composition contains other components (components other than the components (A) to (D)), the content of the components is preferably 100 parts by mass based on the total amount of the components (A) and (B). It is set to about 0.01 mass part to about 20 mass parts, respectively.

[Solution of photosensitive resin composition]

The photosensitive resin composition may be a liquid composition further containing at least one organic solvent. Examples of the organic solvent include alcohol solvents such as methanol and ethanol; ketone solvents such as acetone and methyl ethyl ketone; glycol ether solvents such as methyl cellosolve, ethyl cellosolve, and propylene glycol monomethyl ether; and aromatics such as toluene. A hydrocarbon solvent; an aprotic polar solvent such as N,N-dimethylformamide or the like. These may be used alone or in combination of two or more.

The content of the organic solvent contained in the photosensitive resin composition can correspond It is suitable for selection in terms of purpose. For example, the photosensitive resin composition can be used as a liquid composition having a solid content of about 30% by mass to 60% by mass (hereinafter, a photosensitive resin composition containing an organic solvent is also referred to as a "coating liquid").

The coating liquid is applied onto the surface of a support film, a metal plate or the like to be described later, and dried to form a photosensitive resin composition layer as a coating film of the photosensitive resin composition. The metal plate is not particularly limited and may be appropriately selected depending on the purpose and the like. The metal plate includes a metal plate containing a metal such as copper, a copper alloy, or an iron-based alloy such as nickel, chromium, iron, or stainless steel. As a preferable metal plate, a metal plate containing a metal such as copper, a copper-based alloy, or an iron-based alloy can be mentioned.

The thickness of the photosensitive resin composition layer to be formed is not particularly limited, and can be appropriately selected in accordance with the use thereof. The thickness (thickness after drying) of the photosensitive resin composition layer is preferably about 1 μm to 100 μm.

When the photosensitive resin composition layer is formed on the metal plate, the surface of the photosensitive resin composition layer opposite to the metal plate can be covered with a protective film. The protective film may, for example, be a polymer film such as polyethylene or polypropylene.

<Photosensitive element>

The photosensitive element (hereinafter simply referred to as "photosensitive element") of the present embodiment includes a support film and a photosensitive resin composition layer containing the photosensitive resin composition provided on one surface of the support film. According to the photosensitive element, since the photosensitive resin composition layer containing the photosensitive resin composition is provided, it is possible to efficiently form a substrate having high smoothness and to have excellent adhesion and excellent acid resistance. Resist pattern. The photosensitive element may have another layer such as a protective film as needed.

Fig. 1 is a schematic cross-sectional view showing an embodiment of a photosensitive element of the present invention. In the photosensitive element 10 shown in FIG. 1, a support film 2, a photosensitive resin composition layer 4 containing a photosensitive resin composition, and a protective film 6 are laminated in this order. The photosensitive resin composition layer 4 can also be called a coating film of a photosensitive resin composition. Further, the coating film is one in which the photosensitive resin composition is in an unhardened state.

The photosensitive element 10 can be obtained, for example, as follows. Applying a coating liquid as a photosensitive resin composition containing an organic solvent on the support film 2 to form a coating layer, and drying (removing at least a part of the organic solvent from the coating layer), thereby forming a photosensitive film Resin composition layer 4. Then, the surface of the photosensitive resin composition layer 4 opposite to the support film 2 is covered with the protective film 6, whereby the photosensitive resin composition layer 4 having the support film 2 and laminated on the support film 2 can be obtained. And a photosensitive element 10 laminated on the protective film 6 on the photosensitive resin composition layer 4. Further, the photosensitive element 10 does not have to have the protective film 6.

As the support film 2, a film containing a polyester such as polyethylene terephthalate or a polymer having heat resistance and solvent resistance such as a polyolefin such as polypropylene or polyethylene can be used.

The thickness of the support film 2 is preferably from 1 μm to 100 μm, more preferably from 5 μm to 50 μm, still more preferably from 5 μm to 30 μm. When the thickness of the support film 2 is 1 μm or more, the support film 2 can be prevented from being damaged when the support film 2 is peeled off. Further, when the thickness of the support film 2 is 100 μm or less, the decrease in resolution is suppressed.

As the protective film 6, it is preferable that the adhesion to the photosensitive resin composition layer 4 is smaller than the adhesion of the support film 2 to the photosensitive resin composition layer 4. specific In addition, as the protective film 6, a film containing a polyester such as polyethylene terephthalate or a polymer having heat resistance and solvent resistance such as polyolefin such as polypropylene or polyethylene can be used. As a commercially available product, ALPHAN MA-410, E-200, manufactured by Oji Paper Co., Ltd., polypropylene film manufactured by Shin-Etsu Film Co., Ltd., and PS-made by Teijin Co., Ltd. 25 other PS series polyethylene terephthalate film, Tamapoly NF-15A. Further, the protective film 6 may be the same as the support film 2.

The thickness of the protective film 6 is preferably from 1 μm to 100 μm, more preferably from 5 μm to 50 μm, still more preferably from 5 μm to 30 μm, particularly preferably from 15 μm to 30 μm. When the thickness of the protective film 6 is 1 μm or more, when the photosensitive resin composition layer 4 and the support film 2 are laminated on the substrate while the protective film 6 is peeled off, the protective film 6 can be prevented from being damaged. When the thickness of the protective film 6 is 100 μm or less, handleability and inexpensiveness are excellent.

Specifically, the photosensitive element 10 can be manufactured, for example, as follows. It can be produced by a production method including a step of preparing a coating liquid containing a photosensitive resin composition, a step of applying the coating liquid onto the support film 2 to form a coating layer, and The coating layer is dried to form a photosensitive resin composition layer 4.

The application of the coating liquid onto the support film 2 can be carried out by a known method such as roll coating, comma coating, gravure coating, air knife coating, die coating, or bar coating.

The drying of the coating layer is not particularly limited as long as at least a part of the organic solvent can be removed from the coating layer. For example, it is preferably carried out at 70 ° C to 150 ° C for about 5 minutes to 30 minutes. After drying, it prevents the organic solvent in the subsequent steps. From the viewpoint of the diffusion, the amount of the residual organic solvent in the photosensitive resin composition layer 4 is preferably 2% by mass or less.

The thickness of the photosensitive resin composition layer 4 in the photosensitive element 10 can be suitably selected according to the use. The thickness after drying is preferably from 1 μm to 100 μm, more preferably from 1 μm to 50 μm, still more preferably from 5 μm to 40 μm. By the thickness of the photosensitive resin composition layer 4 being 1 μm or more, industrial coating is easy. When the thickness of the photosensitive resin composition layer 4 is 100 μm or less, the adhesion and the resolution tend to be sufficiently obtained.

The form of the photosensitive element 10 is not particularly limited. For example, it may be in the form of a sheet or may be wound in a roll shape on a winding core. In the case of winding in a roll shape, it is preferable to wind the support film 2 to the outside. Examples of the winding core include plastics such as a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyvinyl chloride resin, and an ABS resin (acrylonitrile-butadiene-styrene copolymer). In the end face of the roll-shaped photosensitive element roll obtained as described above, it is preferable to provide an end face spacer from the viewpoint of protecting the end face, and it is preferable to provide moisture prevention from the viewpoint of resistance to fringe. End spacers. As the packing method, it is preferably packaged in a black sheet having a small moisture permeability.

The photosensitive element 10 can be suitably used, for example, in a method of forming a resist pattern to be described later.

<Method of Forming Resist Pattern>

The method for forming a resist pattern according to the present embodiment includes: (i) a laminating step of forming a photosensitive resin composition layer containing a photosensitive resin composition on a substrate; (ii) In the exposure step, a region of a portion of the photosensitive resin composition layer is cured by irradiation with actinic rays to form a cured region; and (iii) a developing step is performed outside the cured region of the photosensitive resin composition layer. The region is removed from the substrate, and a resist pattern containing a cured product (hardened region) of the photosensitive resin composition is formed on the substrate. The method of forming the resist pattern may further have other steps as needed. Hereinafter, each step will be described in detail.

(i) Lamination step

In the lamination step, a photosensitive resin composition layer containing a photosensitive resin composition is formed on a substrate.

The method of forming the photosensitive resin composition layer on the substrate is, for example, a method in which a coating liquid containing a photosensitive resin composition is applied onto a substrate and then dried.

In addition, as a method of forming a photosensitive resin composition layer on a base material, for example, a photosensitive resin composition layer of a photosensitive element is laminated on a base material after removing a protective film from a photosensitive element as needed. method. Lamination can be carried out by heating a photosensitive resin composition layer facing the photosensitive element while pressing the substrate. By lamination, a laminate in which a substrate, a photosensitive resin composition layer, and a support film are laminated in this order can be obtained.

The lamination is preferably carried out at a temperature of 70 ° C to 130 ° C, and preferably at a pressure of about 0.1 MPa to 1.0 MPa (about 1 kgf / cm ² to 10 kgf / cm ² ) for lamination. These conditions can be adjusted as needed. At the time of lamination, the substrate may be pre-heat treated, or the photosensitive resin composition layer may be heated to 70 ° C to 130 ° C.

(ii) Exposure step

In the exposure step, a region of a part of the photosensitive resin composition layer is irradiated with actinic rays, and the exposed portion irradiated with the actinic rays is photocured to form a latent image. Here, when the photosensitive element is used in the lamination step, the support film is present on the photosensitive resin composition layer. However, when the support film is transparent to actinic rays, the actinic radiation can be transmitted through the support film. On the other hand, when the support film exhibits light-shielding properties to actinic rays, the photosensitive resin composition layer is irradiated with actinic rays after the support film is removed.

As an exposure method, a method of irradiating an actinic ray in an image shape (mask exposure method) by a negative mask pattern or a positive mask pattern called an artwork is mentioned. In addition, direct exposure of the exposure method by laser direct imaging (LDI) exposure method or digital light processing (DLP) exposure method may be employed to irradiate the actinic ray in an image form. Methods.

From the viewpoint of obtaining the effect of the present invention more reliably, the wavelength (exposure wavelength) of the actinic ray is preferably in the range of 340 nm to 430 nm, and more preferably in the range of 350 nm to 420 nm.

(iii) development step

In the developing step, a region other than the cured region of the photosensitive resin composition layer (that is, an uncured portion of the photosensitive resin composition layer) is removed from the substrate by a development treatment, and is formed on the substrate. Hardening comprising a photosensitive resin composition layer The resist pattern of the object. Further, when the support film is present on the photosensitive resin composition layer subjected to the exposure step, the support film is removed and the development step is performed. In the development treatment, there are wet development and dry development, and wet development can be suitably used.

In the wet development, a developing solution corresponding to the photosensitive resin composition is used, and development is carried out by a known developing method. As a developing method, a dipping method is mentioned, The method, the spray method, and the method of brushing, slap, scraping, shaking, etc., from the viewpoint of improving the resolution, the most suitable one is a high-pressure spray method. The two or more methods described above may be combined and the development developing solution may be appropriately selected in accordance with the configuration of the photosensitive resin composition. Examples of the developer include an alkaline aqueous solution, an aqueous developing solution, and an organic solvent-based developing solution.

The alkaline aqueous solution for development is preferably a sodium carbonate solution of 0.1% by mass to 5% by mass, a potassium carbonate solution of 0.1% by mass to 5% by mass, a sodium hydroxide solution of 0.1% by mass to 5% by mass, or 0.1%. A sodium tetraborate solution of a mass % to 5% by mass. The pH of the alkaline aqueous solution is preferably in the range of 9 to 11. Further, the temperature is adjusted in accordance with the alkali developability of the photosensitive resin composition layer. A surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed in the alkaline aqueous solution.

The method of forming a resist pattern may further include the steps of: after removing the non-exposed portion to, optionally post-exposure heating for about ² to about 60 ℃ ~ 250 ℃ and / or ^{0.2J / cm 2 ~ 10J / cm} , Thereby, the resist pattern is further hardened.

<Manufacturing Method of Touch Panel>

The method for manufacturing a touch panel according to the present embodiment includes a step of performing an etching treatment on a substrate on which a resist pattern is formed by the method for forming a resist pattern. The formed resist pattern is used as a mask, and the conductor layer of the substrate or the like is etched. A pattern of the lead wiring and the transparent electrode is formed by an etching process, thereby manufacturing a touch panel.

3(a) to 3(h) are schematic cross-sectional views showing an embodiment of a method of manufacturing a touch panel of the present invention. The manufacturing method of the present aspect includes the first step of providing a laminated base material including the support base material 22, the transparent conductive layer 24 provided on one surface of the support base material 22, and the metal layer 26 provided on the transparent conductive layer 24. A resist pattern 29 containing a cured product of a photosensitive resin composition is formed on the metal layer 26; and in a second step, the metal layer 26 and the transparent conductive layer 24 are etched to form a residue and a metal layer including the transparent conductive layer 24. a laminated pattern of the residual portion of 26 (24+26 in FIG. 3(d)); and a third step, removing the metal layer from a portion of the laminated pattern to form a transparent electrode including the residual portion of the transparent conductive layer 24 and a metal containing layer The metal wiring of the residual part.

In the first step, first, as shown in FIG. 3(a), a transparent conductive layer 24 provided on the support substrate 22, on one side of the support substrate 22, and a metal layer provided on the transparent conductive layer 24 are provided. A photosensitive resin composition layer 28 containing a photosensitive resin composition is laminated on the metal layer 26 of the laminated base material of 26. The photosensitive resin composition layer 28 may be provided with a support film on the surface opposite to the metal layer 26.

The metal layer 26 may be a metal layer containing copper, an alloy of copper and nickel, a molybdenum-aluminum-molybdenum laminate, an alloy of silver and palladium, and copper. Among them, it can be more obvious From the viewpoint of obtaining the effect of the present invention, a metal layer containing copper or an alloy of copper and nickel can be suitably used.

The transparent conductive layer 24 contains indium tin oxide (ITO). The transparent conductive layer 24 preferably contains crystalline ITO from the viewpoint of not requiring annealing treatment.

Then, a region of a part of the photosensitive resin composition layer 28 is cured by irradiation with actinic rays to form a cured region, and then a region other than the cured region of the photosensitive resin composition layer is self-laminated on the substrate. Remove. Thereby, as shown in FIG. 3(b), a resist pattern 29 is formed on the laminated substrate.

In the second step, by the etching process, the resist pattern 29 is not used. The metal layer 26 and the transparent conductive layer 24 of the shielded region are removed from the support substrate 22.

The etching treatment method is appropriately selected corresponding to the layer to be removed. For example, as an etching liquid for removing a metal layer, a copper chloride solution, a ferric chloride solution, a phosphoric acid solution, etc. are mentioned. Further, as the etching liquid for removing the transparent conductive layer, oxalic acid, hydrochloric acid, aqua regia or the like can be used.

When the transparent conductive layer 24 is a crystalline ITO, it is necessary to use a strong acid such as concentrated hydrochloric acid as the etching liquid for removing the transparent conductive layer 24. However, in the manufacturing method of the present embodiment, the resist pattern includes the above-mentioned photosensitive light. Since the cured resin composition is cured, even in the etching treatment using a strong acid, peeling of the resist pattern or the like is sufficiently suppressed.

3(c) is a view showing an etching process, and in FIG. 3(c), a residual portion including the metal layer 26, a residual portion of the transparent conductive layer 24, and a residue of the resist pattern 28 are formed on the support substrate 22. Laminated body. In the manufacturing method of the present form, since The resist pattern 28 is removed from the laminate.

For the removal of the resist pattern 28, for example, an aqueous solution which is more alkaline than the alkaline aqueous solution used in the above development step can be used. As the strongly alkaline aqueous solution, a 1% by mass to 10% by mass aqueous sodium hydroxide solution, a 1% by mass to 10% by mass aqueous potassium hydroxide solution, or the like can be used. Among them, a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution of 1% by mass to 10% by mass is preferably used, and a 1% by mass to 5% by mass aqueous sodium hydroxide solution or a potassium hydroxide aqueous solution is more preferably used. Examples of the release method of the resist pattern include a immersion method, a spray method, and the like, and these may be used singly or in combination.

3(d) is a view showing a state in which the resist pattern is peeled off, and in FIG. 3(d), a build-up pattern including a residual portion of the metal layer 26 and a residual portion of the transparent conductive layer 24 is formed on the support substrate 22.

In the third step, a portion other than a portion for forming a metal wiring in the metal layer 26 is removed from the build-up pattern, and a metal wiring including a residue of the metal layer 26 and a transparent portion including the transparent conductive layer 24 are formed. electrode. Further, in the present embodiment, as a method of removing the metal layer 26 in the third step, a method of etching is employed. However, the method of removing the metal layer 26 in the third step is not necessarily limited to etching.

In the third step, first, the photosensitive resin composition layer 30 is formed on the laminated substrate subjected to the second step (Fig. 3(e)). Then, the resist 31 containing the cured product of the photosensitive resin composition layer 30 is formed by exposure and development of the photosensitive resin composition layer 30 (FIG. 3 (f)). Further, the photosensitive resin composition layer may be a layer containing the photosensitive resin composition of the above-described embodiment, or may be included A well-known layer of a photosensitive resin composition for etching.

Then, the metal layer 26 is removed from the portion of the build-up pattern where the resist 31 is not formed by the etching process. At this time, as the etching treatment liquid, the same as the etching liquid for removing the metal layer can be used.

3(g) is a view showing an etching process, and in FIG. 3(g), a transparent electrode including a residual portion of the transparent conductive layer 24 is formed on the support substrate 22, and is formed on a part of the transparent electrodes. A laminate of the metal layer 26 and the resist 31. The resist 31 is removed from the laminate, and as shown in FIG. 3(h), a transparent electrode including a residual portion of the transparent conductive layer 24 and a metal wiring including a residue of the metal layer 26 are formed on the support substrate 22.

4 is a plan view showing an aspect of a touch panel obtained by the present invention. In the touch panel 100, the X electrode 52 and the Y electrode 54 which are transparent electrodes are alternately arranged in parallel, and the X electrodes 52 provided in the same row in the longitudinal direction are connected to each other by one lead wiring 56, and are provided separately. The Y electrodes 54 on the same column in the width direction are connected to each other by one lead wiring 57.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.

Example

Hereinafter, the present invention will be specifically described by way of examples, but the invention is not limited to the examples.

(Manufacturing Example 1: Production of Adhesive Polymer (A-1))

30 g of methacrylic acid as a polymerizable monomer (monomer), methacryl 35 g of methyl ester and 35 g of butyl methacrylate (mass ratio: 30/35/35) were mixed with 0.5 g of azobisisobutyronitrile and 10 g of acetone, and the obtained solution was referred to as "solution a". A solution obtained by dissolving 0.6 g of azobisisobutyronitrile in 30 g of acetone was referred to as "solution b".

Into a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen introduction tube, 100 g of a mixture of acetone (80% by mass) and 20 g of propylene glycol monomethyl ether (in a mass ratio of 4:1) were placed, and then nitrogen gas was blown into the flask. The mixture was heated while stirring, and the temperature was raised to 80 °C.

The solution a was added dropwise to the above mixed liquid in the flask over 4 hours, and then the mixture was kept at 80 ° C for 2 hours while stirring. Then, the solution b was added dropwise to the solution in the flask over 10 minutes, and the solution in the flask was stirred at 80 ° C for 3 hours while stirring. Further, the solution in the flask was heated to 90 ° C for 30 minutes, and the mixture was kept at 90 ° C for 2 hours, and then cooled to obtain a solution of the binder polymer (A-1).

The binder polymer (A-1) had a nonvolatile content (solid content) of 42.8 mass%, a weight average molecular weight of 50,000, an acid value of 195 mgKOH/g, and a degree of dispersion of 2.58.

Further, the weight average molecular weight was measured by gel permeation chromatography (GPC) and converted using a calibration curve of standard polystyrene. The conditions for GPC are shown below.

GPC condition

Pump: Hitachi / L-6000 (manufactured by Hitachi, Ltd.)

Pipe column: The following total 3, pipe column specifications: 10.7mm φ × 300mm

Gelpack GL-R440

Gelpack GL-R450

Gelpack GL-R400M (above, manufactured by Hitachi Chemical Co., Ltd., trade name)

Dissolution: Tetrahydrofuran (THF)

Sample concentration: 120 mg of a resin solution having a solid content of 40% by mass was extracted and dissolved in 5 mL of THF to prepare a sample.

Measuring temperature: 40 ° C

Injection volume: 200μL

Pressure: 49Kgf/cm ² (4.8MPa)

Flow rate: 2.05mL/min

Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd.)

The examples and comparative examples were carried out by the following methods.

(Preparation of photosensitive resin composition (coating liquid))

The components shown in Tables 1 and 2 were mixed with 5 parts by mass of methanol, 12 parts by mass of toluene and 5 parts by mass of acetone in the amount shown in the table, thereby preparing Examples and Comparative Examples. A coating liquid of the photosensitive resin composition. The blending amount of the component (A) in the table is the mass (solid content) of the nonvolatile component. The details of each component shown in Table 1 and Table 2 are as follows.

((A) component)

A-1: The binder polymer (A-1) obtained in Production Example 1.

((B) component)

FA-321M: FA-321M (manufactured by Hitachi Chemical Co., Ltd., trade name), 2,2-bis(4-(methylpropenyloxypentaethoxy)phenyl)propane; UA-11: UA -11 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name), polyoxyethylene urethane dimethacrylate; UA-13: UA-13 (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name) , polyoxyethylene polyoxypropylene urethane dimethacrylate; FA-MECH: FA-MECH (manufactured by Hitachi Chemical Co., Ltd., trade name), γ-chloro-β-hydroxypropyl-β' - Methacryloxymethoxyethyl-phthalate.

((C) component)

B-CIM: B-CIM (manufactured by Hampford, product name), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl double Imidazole; EAB: EAB (manufactured by Hodogaya Chemical Industry Co., Ltd., product name), 4,4'-bis(diethylamino)diphenyl ketone.

((D) component)

. (D1) component

KBM-803: KBM-803 (manufactured by Shinetsu Silicon Co., Ltd., product name), 3-mercaptopropyltrimethoxydecane.

. (D2) component

AY43-031: AY43-031 (manufactured by Dow Corning Toray, product name), 3-ureidopropyl 矽 ;; KBE-573: KBE-573 (manufactured by Shin-Etsu Chemical Co., Ltd., product name), N-phenyl-3-aminopropyltrimethoxydecane; KBE-903: KBE-903 (manufactured by Shin-Etsu Lee Co., Ltd., Product name), 3-aminopropyltriethoxy decane; KBM-903: KBM-903 (manufactured by Shin-Etsu Chemical Co., Ltd., trade name), 3-aminopropyltriethoxydecane; KBE-9103: KBE-9103 (manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-triethoxydecyl-N-(1,3-dimethyl-butylene)propylamine; Z-6032: Z-6032 (east Manufactured by Lido Corning Co., Ltd., product name), aminoethylaminopropyltrimethoxydecane.

. (D3) component

SZ-6030: SZ-6030 (manufactured by Toray Dow Corning Corporation, trade name), methacryloxypropyltrimethoxydecane.

. (D1) a decane coupling agent other than the component (D3)

KBE-846: KBE-846 (manufactured by Shin-Etsu Chemical Co., Ltd., product name), bis(triethoxydecylpropyl) tetrasulfide; KBE-9007: KBE-9007 (manufactured by Shin-Etsu Lee Co., Ltd., product name) , 3-isocyanatopropyltriethoxydecane; KBE-403: KBE-403 (manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-glycidoxypropyltriethoxydecane; KBE-5103 : KBE-5103 (manufactured by Shin-Etsu Chemical Co., Ltd., product name), 3-propenyloxypropyltrimethoxydecane.

((E) component: component other than component (A) to component (D))

LCV: LCV (manufactured by Yamada Chemical Co., Ltd., product name), colorless crystal violet; TBC: DIC-TBC-5P (manufactured by Dainippon Ink Chemical Industry Co., Ltd., product name), 4-t-butylcatechol ;F-806P: bis(N,N-2-ethylhexyl)aminomethyl-5-carboxy-1,2,3-benzotriazole; AZCV-PW: AZCV-PW (Zhutu Valley Chemical Industry Co., Ltd.) Manufactured by the company, product name), [4-{bis(4-dimethylaminophenyl)methylene}-2,5-cyclohexadiene-1-ylidene].

<Production of photosensitive element>

The coating liquid of the photosensitive resin composition obtained above was uniformly applied to a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name "FB-40") having a thickness of 16 μm. The hot air convection dryer at 70 ° C and 110 ° C was sequentially dried to form a photosensitive resin composition layer having a film thickness of 15 μm after drying. A protective film (manufactured by Tamapoly Co., Ltd., product name "NF-15A") is bonded to the photosensitive resin composition layer, and a polyethylene terephthalate film (support film) is laminated in this order, and photosensitivity is obtained. A photosensitive layer of a resin composition layer and a protective film.

<Production of laminated substrate>

A film substrate is used in which a transparent conductive layer containing ITO is formed on the upper layer of the polyethylene terephthalate material, and a metal layer containing copper is formed on the upper layer of the transparent conductive layer, and the metal layer is the most A film substrate having a surface treated with rust prevention. The film substrate (hereinafter referred to as "substrate") was heated and heated to 80 ° C, and then the photosensitive element produced above was laminated (laminated) on the surface of the metal layer of the substrate. The laminate is formed by removing the protective film and adhering the photosensitive resin composition layer of the photosensitive element to the surface of the metal layer of the substrate, and at a temperature of 110 ° C and a lamination pressure of 4 kgf / cm ² (0.4 MPa). . In this manner, a laminated substrate in which a photosensitive resin composition layer and a polyethylene terephthalate film are laminated on the surface of the metal layer of the substrate is obtained.

<Evaluation of sensitivity>

The obtained laminated substrate was left to cool until it became 23 °C. Then, the laminated substrate was divided into three regions, and the 41-stage stage type having a concentration range of 0.00 to 2.00, a concentration stage of 0.05, a table size of 20 mm × 187 mm, and a size of each stage of 3 mm × 12 mm was used. A photo tool of the step tablet is adhered to the polyethylene terephthalate film in one of the regions. The exposure is a parallel light exposure machine using a short-ultraviolet (UV) lamp (Orc Manufacturing, Inc., product name "AHD-5000R") as a light source (Aoke Manufacturing Co., Ltd.) The product name "EXM-1201" was produced, and the photosensitive resin composition layer was exposed through a light tool and a polyethylene terephthalate film at an energy (exposure amount) of 100 mJ/cm ² . At this time, other areas not used are covered by a black sheet. Further, the other regions were exposed to light at an energy of 200 mJ/cm ² and 400 mJ/cm ² by the same method. In addition, the illuminance was measured using an ultraviolet illuminometer (manufactured by Ushio Electric Co., Ltd., product name "UIT-150") to which a probe corresponding to 405 nm was applied.

After the exposure, the polyethylene terephthalate film was peeled off from the laminated substrate, the photosensitive resin composition layer was exposed, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C for 16 seconds, thereby removing the unexposed portion. . Thus, a resist pattern containing a cured product of the photosensitive resin composition is formed on the surface of the metal layer of the substrate. According to the number of remaining stages (the number of stages) of the stage exposure meter obtained as the resist pattern (cured film) at each exposure amount, a calibration curve of the exposure amount and the number of stages is prepared, and the number of stages is determined. The exposure amount of the 20-stage was used to evaluate the sensitivity of the photosensitive resin composition. The sensitivity is represented by the number of stages obtained from the self-calibration curve being changed to the exposure amount of 20 stages, and the smaller the amount of exposure, the better the sensitivity. The results are shown in Tables 3 and 4.

<Evaluation of adhesion>

A matte pattern with a line width (L)/space width (S) (hereinafter referred to as "L/S") of 8/400 to 47/400 (unit: μm) is used, and the remaining portion of the 41-stage stage exposure meter is used. The energy of the number of stages becomes 20 stages, and the photosensitive resin composition layer of the said laminated base material is exposed. After the exposure, the same development processing as that of the above sensitivity was performed.

After development, the minimum value of the value of the line width/space width in the resist pattern formed by the space portion (unexposed portion) being completely removed and the line portion (exposed portion) not being formed with defects or defects is Evaluation of adhesion. The smaller the value, the better the adhesion. The results are shown in Tables 3 and 4.

<Analytical evaluation>

Using a mask pattern of L/S of 8/8 to 47/47 (unit: μm), the number of remaining segments of the 41-stage staged exposure meter becomes 20 segments of energy to the photosensitive resin composition layer of the laminated substrate. Exposure. After the exposure, the same development processing as that of the above sensitivity was performed.

After development, the minimum value of the value of the line width/space width in the resist pattern formed by the space portion (unexposed portion) being completely removed and the line portion (exposed portion) not being formed with defects or defects is Evaluate the resolution. The smaller the value, the better the resolution. The results are shown in Tables 3 and 4.

<Evaluation of etching resistance liquidity>

The etching resistance of the resist pattern was evaluated as follows. Using a mask pattern of L/S of 8/400 to 47/400 (unit: μm), the number of remaining segments of the 41-stage staged exposure meter becomes 20 segments of energy to the photosensitive resin composition layer of the laminated substrate. Exposure. After the exposure, the same development processing as that of the above sensitivity is performed to obtain a formation. Patterned substrate.

The obtained substrate was etched using a copper chloride-based solution until the metal layer on the surface disappeared. Thereafter, it is washed with water and dried. Further, the substrate on which the metal layer on the surface was removed was immersed in a 25% by mass aqueous hydrogen chloride solution for 1 minute or 2 minutes, and then washed with water and dried.

After the transparent conductive layer is removed by etching, the metal layer and the transparent conductive layer of the space portion (unexposed portion) are completely removed, and the line portion (exposed portion) is not formed with defects or defects. The minimum value among the values of the line width/space width is used to evaluate the adhesion after etching. The smaller the value, the higher the etching resistance and the better the adhesion. The case where the etching time for removing the transparent conductive layer was 1 minute was (μm/1 min), and the case where the etching time for removing the transparent conductive layer was 2 minutes was (μm/2 min), and the result was shown in Table 3 and Table 4.

Further, in Comparative Example 5 and Comparative Example 10, the coating liquid was gelatinized and it was very difficult to form a film, and it was difficult to use it as a product from the viewpoint of stability or yield. The reason why the coating liquid is gelatinized is that the amine group of the decane coupling agent used in each of the comparative examples acts on the carboxylic acid of the binder polymer.

2‧‧‧Support film

4‧‧‧Photosensitive resin composition layer

6‧‧‧Protective film

10‧‧‧Photosensitive components

Claims (10)

A photosensitive resin composition for indium tin oxide etching, comprising: a binder polymer; a photopolymerizable compound; a photopolymerization initiator; and a decane coupling agent, and the decane coupling agent comprises a decane compound having a mercaptoalkyl group. The photosensitive resin composition according to claim 1, wherein the decane coupling agent further comprises a decane compound having an amine group. The photosensitive resin composition according to claim 1 or 2, wherein the decane coupling agent further comprises a decane compound having a (meth) propylene fluorenyloxy group. The photosensitive resin composition according to any one of the first aspect, wherein the photopolymerizable compound contains a bisphenol A type di(meth)acrylate compound. The photosensitive resin composition according to any one of claims 1 to 4, wherein the photopolymerizable compound contains an amine group having a (poly)oxyethylene group and/or a (poly)oxypropylene group. Formate di(meth)acrylate compound. A photosensitive element comprising: a support film, and a photosensitive resin composition comprising the photosensitive resin composition according to any one of claims 1 to 5, which is provided on one side of the support film Layer of matter. A method of forming a resist pattern, comprising: In the first step, a photosensitive resin composition layer containing the photosensitive resin composition according to any one of claims 1 to 5 is formed on the substrate; and the second step is performed by actinic rays. Irradiation to cure a region of a part of the photosensitive resin composition layer to form a cured region; and third step of removing a region other than the cured region of the photosensitive resin composition layer from the substrate And a resist pattern including the above-described cured region is obtained. A method of manufacturing a touch panel, comprising: a step of performing an etching treatment on the substrate on which a resist pattern is formed by a method of forming a resist pattern according to claim 7 of the patent application. A method of manufacturing a touch panel, comprising: a first step of providing a support substrate, a transparent conductive layer containing indium tin oxide provided on one surface of the support substrate, and a metal provided on the transparent conductive layer A resist pattern containing a cured product of the photosensitive resin composition according to any one of claims 1 to 5 is formed on the metal layer of the laminated substrate of the layer; the second step, The metal layer and the transparent conductive layer are etched to form a build-up pattern including a residual portion of the transparent conductive layer and a residual portion of the metal layer; and a third step of removing the metal layer from a portion of the build-up pattern to form an inclusion a transparent electrode of a residual portion of the transparent conductive layer and a metal wiring including a residue of the metal layer. The method of manufacturing a touch panel according to claim 9, wherein the transparent conductive layer contains crystalline indium tin oxide, and the etching in the second step is etching using a strong acid.