TW201418719A - Probe card structure 4 - Google Patents

Abstract

A probe card structure (4) comprises a plurality of signal pins, a signal coaxial cable and a substrate. The plurality of signal pins are made of conductive materials, wherein one end of the signal pin is used for point-contacting an electronic object under test. The signal coaxial cable is electrically connected to one of the signal pins. The substrate is provided with a power supply circuit and is electrically connected to another of the signal pins. An impedance value of the power supply circuit is much less than an impedance value of the signal coaxial cable.

Description

Probe card structure (4)

The present invention relates to a probe card, and more particularly to a probe card structure (4).

According to the method for detecting whether the electrical connection between the precision electronic components of the electronic product is true, a probe card is used as a transmission interface between the test signal and the power signal between the detecting machine and the electronic object to be tested. The electronic component to be tested generally receives the high frequency power signal from the detector to supply the power required for the electronic component to be tested.

However, the transmission line of the power signal of the conventional probe card is usually designed with the same impedance as the transmission line of the test signal. In other words, when the detector transmits a high-frequency power signal to the probe card, the power supply of the probe card The high impedance generated by the line at high frequencies usually causes a certain degree of attenuation of the power signal. In this way, the electronic component to be tested is likely to stop operating due to insufficient power supply or to generate a misjudgment of the test signal.

In view of this, the main object of the present invention is to provide a probe card structure (4) for avoiding a large attenuation of a power signal when transmitting a high frequency power signal.

In order to achieve the above object, the probe card structure (4) provided by the present invention is configured to transmit a power signal and a test signal of a detecting machine to an electronic object to be tested, thereby supplying power to the electronic object to be tested through the power signal. And electrically detecting the electronic object to be tested through the test signal; the probe card structure (4) comprises a plurality of signal pins, a substrate and at least one signal coaxial cable; wherein the signal pins are made of conductive materials Formed, and one end thereof is used to touch the electronic object to be tested; the substrate is made of a dielectric material having a specific dielectric constant for connection with the detector, and one of the first conductors is embedded therein a power conductor, and a plurality of first ground conductors disposed around the first power conductor; the first power conductor is electrically connected to the detector and the other end of the at least one signal pin for transmitting The signal pin transmits the power signal to the electronic object to be tested; the first grounding conductor is used as a ground; the signal coaxial cable includes one of the central positions a signal line, a dielectric layer covering the signal line, and a ground line outside the dielectric layer; the signal line is electrically connected to the detector and the other end of the at least one signal pin for transmitting the corresponding signal The pin transmits the test signal to the electronic object to be tested; the dielectric layer is used for isolating the signal line and the ground line; the ground line is used for grounding. According to the above concept, the first power conductor meets the following conditions: /5≦H _P1 /T _P1 <1; wherein, H _P1 is the thickness of the first power conductor; T _{P1 is} the substrate is around the first power conductor, and two first grounds adjacent thereto The thickness of the dielectric material between the conductors.

According to the above concept, the present invention further provides a probe card structure (4) including a plurality of signal pins, a substrate, a carrier plate and a signal coaxial cable; wherein the signal pins are made of a conductive material, and one end thereof is used to touch the electronic object to be tested; the substrate has a specific dielectric constant a dielectric material for connecting to the detector, wherein a first power conductor made of a conductor and a plurality of first ground conductors disposed around the first power conductor are embedded therein; The first power conductor is electrically connected to the detecting for transmitting the power signal; the first grounding conductor is used for grounding; the carrier is connected to the substrate, and has a second made of a conductor a power conductor, and a plurality of second ground conductors disposed around the second power conductor; the second power conductor is coupled to the first power conductor and at least one of the signal pins for transmitting the power signal Corresponding to the probe; the second grounding conductor is used as a ground; the signal coaxial cable includes a signal line at a central position, a dielectric layer covering the signal line, and a bit a grounding wire outside the dielectric layer; the signal line is electrically connected to the detecting machine and the other end of the at least one signal pin for transmitting the test signal to the electronic object to be tested through the corresponding signal pin; the dielectric layer The signal line and the ground line are isolated; the ground line is used as a ground.

According to the above concept, the second power conductor conforms to the following condition: 1/5 ≦H _P2 /T _P2 <1; wherein, H _P2 is the thickness of the second power conductor; T _{P2 is} the carrier board The thickness of the dielectric material between the second power conductor and the second ground conductor adjacent thereto.

Thereby, through the above design, each of the power conductors can have a low impedance The value of the value, in order to avoid the large attenuation of the probe card structure when transmitting high frequency power signals.

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings.

The power signal and the test signal outputted by the power terminal 110 and the signal terminal 120 of the machine 100 are transmitted to an electronic object 200 to be tested, thereby supplying power to the electronic object 200 to be tested through the power signal, and the test signal is received through the test signal. The electronic object 200 is electrically tested. The probe card structure includes a plurality of signal pins 10, a substrate 20, a carrier 30, and a power coaxial cable 40. Wherein: the signal pins 10 are made of metal, and of course, other conductive materials may be used, and one end thereof is used to touch the to-be-tested part or the power supply part of the electronic object 200 to be tested.

One side of the substrate 20 is for connection to the detector 100. In this embodiment, the substrate 20 is a multilayer printed circuit board, and is formed with a first signal conductor 21 made of a conductor, a first power conductor 22, and a plurality of surrounding first signal conductors 21. The first ground conductor 23 of the first power conductor 22 is embedded therein. The first power conductor 22 is connected to the power terminal 110.

The carrier 30 is connected to the other side of the substrate 20. In this embodiment, The carrier 30 is a multi-layer ceramic (MLC), and is formed with a second signal conductor 31 made of a conductor, a second power conductor 32, and a plurality of conductive signals surrounding the second signal. The body 31 and the second ground conductor 33 of the second power conductor 32 are embedded therein. One end of the second signal conductor 31 is connected to the first signal conductor 21, and the other end is connected to the signal pin 10 for touching the to-be-measured portion of the electronic object 200 to be tested. The second power conductor 32 has one end connected to the first power conductor 22 and the other end connected to the signal pin 100 for touching the to-be-powered portion of the electronic object 200 to be tested.

The signal coaxial cable 40 includes a signal line 41 at a central position, a dielectric layer 42 covering the signal line 41, and a ground line 43 outside the dielectric layer 42. The signal line 41 is connected to the power terminal 110 of the detector 100 and the first power conductor 22 of the substrate 20 for transmitting the power signal. The dielectric layer 42 is used to isolate the signal line 41 from the ground line 43 to avoid a short circuit. The grounding wire 43 is used as a ground.

Therefore, the signal line 41 of the signal coaxial cable 40, the first signal conductor 21 of the substrate 20 and the second signal conductor 31 of the carrier 30 are connected in series to form a signal line for conducting the detector. The test signal outputted by the signal terminal 120 of the 100 is transmitted to the to-be-tested portion of the electronic object 200 to be tested through the corresponding probe 10. The first power conductor 22 of the substrate 20 and the second power conductor 32 of the carrier 30 are connected in series to form a power line for conducting the power signal output from the power terminal 110 of the detector 100. The corresponding probe 10 is transmitted to the to-be-powered portion of the electronic object 200 to be tested.

Therefore, the first power conductor 22 of the substrate 20 and the second power conductor 32 of the carrier 30 are designed according to the following conditions: 1. H _P1 /T _P1 ≧Φ _S1 /Φ _S2 ; H _P2 /T _P2 ≧Φ _S1 /Φ _S2 ;3. 1/5≦H _P1 /T _P1 <1;4. 1/5≦H _P2 /T _P2 <1;5. R _P1 ≦R _S ;6. R _P2 ≦R _S ;7. E _P1 ≧E _S ;8. E _P2 ≧E _S ; as shown in FIG. 2 to FIG. 4, wherein H _P1 is the thickness of the first power conductor 22; T _{P1 is} the The thickness of the dielectric material between the first power conductor 22 and the two first ground conductors 23 adjacent to the first power conductor 22; R _P1 is the resistivity of the first power conductor 22; E _{P1 is} the substrate The dielectric constant of 20; H _P2 is the thickness of the second power conductor 32; T _{P2 is} the carrier 30 between the second power conductor 32 and the second ground conductor 33 adjacent thereto. The dielectric material thickness; R _P2 is the resistivity of the second signal conductor 32; E _{P2 is} the dielectric constant of the carrier 30; R _{S is} the resistivity of the signal line 41; E _{S is} the dielectric constant of the dielectric layer 42 ; diameter Φ _S1 for the signal lines 41; Φ _S2 for Path length of the coat layer 42.

In this way, the power conductors 22 and 32 are designed to have a low resistivity value which is much lower than the low resistance value of the signal line. The electrical coefficient, and the ratio of the thickness of the high conductor to the thickness of the dielectric material, enable the power conductors 22, 32 to have higher capacitance values, so that they have a very low reactance value at high frequencies. When the power conductors 22 and 32 transmit the high frequency signal, they have a very low impedance value far lower than the signal line, so that the high frequency power signal outputted by the detector 100 is transmitted to the electronic object 200 to be tested. This can avoid the situation where the power signal is greatly attenuated.

Of course, in practical implementation, according to the gap between the parts to be tested of the electronic object to be tested 200, the circuit design may be designed using only the substrate 20, or only the substrate 20 or only the carrier 30, using the above conditions. The object of the invention can be achieved. In addition, the above description is only a preferred embodiment of the present invention, and equivalent structural changes in the application of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

10‧‧‧Signal needle

20‧‧‧Substrate

21‧‧‧First Signal Conductor

22‧‧‧First power conductor

23‧‧‧First grounding conductor

30‧‧‧ Carrier Board

31‧‧‧Second signal conductor

32‧‧‧Second power conductor

33‧‧‧Second grounding conductor

40‧‧‧ Signal coaxial cable

41‧‧‧Signal line

42‧‧‧ dielectric layer

43‧‧‧ Grounding wire

100‧‧‧Detector

110‧‧‧Power terminal

120‧‧‧ Signal Terminal

200‧‧‧Electronic objects to be tested

1 is a structural view of a first preferred embodiment of the present invention; FIG. 2 is a cross-sectional view of a signal coaxial cable; FIG. 3 is a cross-sectional view taken along line AA of FIG. 1; .

10‧‧‧Signal needle

20‧‧‧Substrate

21‧‧‧First Signal Conductor

22‧‧‧First power conductor

23‧‧‧First grounding conductor

30‧‧‧ Carrier Board

31‧‧‧Second signal conductor

32‧‧‧Second power conductor

33‧‧‧Second grounding conductor

40‧‧‧ Signal coaxial cable

100‧‧‧Detector

110‧‧‧Power terminal

120‧‧‧ Signal Terminal

200‧‧‧Electronic objects to be tested

Claims (12)

A probe card structure (4) for transmitting a power signal and a test signal of a test machine to an electronic object to be tested, thereby supplying power to the electronic object to be tested through the power signal, and transmitting the test object through the test signal The electronic object to be tested is electrically detected; the probe card structure (4) comprises: a plurality of signal pins, which are made of a conductive material, and one end of which is used to touch the electronic object to be tested; and a substrate to have a specific a medium constant dielectric material for connecting to the detector, wherein a first power conductor made of a conductor and a plurality of first ground conductors disposed around the first power conductor are embedded therein The first power conductor is electrically connected to the detector and the other end of the at least one signal pin for transmitting the power signal to the electronic object to be tested through the corresponding signal pin; the first ground conduction The body is used as a grounding; a signal coaxial cable includes a signal line at a central position, a dielectric layer covering the signal line, and a ground line outside the dielectric layer; The signal line is electrically connected to the other end of the detector and the at least one signal pin for transmitting the test signal to the electronic object to be tested through the corresponding signal pin; the dielectric layer is used for isolating the signal line from the ground The grounding wire is used as a grounding; the first power conductor conforms to the following condition: 1/5≦H _P1 /T _P1 <1; wherein, H _P1 is the thickness of the first power conductor; T _P1 is The thickness of the dielectric material between the substrate and the two first ground conductors adjacent to the first power conductor. The probe card structure (4) of claim 1, wherein the first power conductor further conforms to the following condition: R _P1 ≦ R _S ; wherein R _P1 is a resistivity of the first power conductor; _S is the resistivity of the signal line. The probe card structure (4) of claim 1, wherein the first power conductor further conforms to the following condition: E _P1 ≧ E _S ; wherein, E _{P1 is} a dielectric constant of the substrate; E _{S is} the medium The dielectric constant of the layer. The probe card structure (4) according to claim 1, wherein the first power conductor further meets the following condition: H _P1 /T _P1 ≧Φ _S1 /Φ _S2 ; wherein Φ _{S1 is} the line of the signal line Diameter; Φ _S2 is the diameter of the dielectric layer. The probe card structure (4) according to claim 1, further comprising a carrier board connected to the substrate, and having a second power source conductor made of a conductor and a plurality of power supply bodies disposed around the second power source conductor a second grounding conductor; the second power conductor is connected to the first power conductor and the corresponding signal pin; the second ground conductor is used as a ground; in addition, the second power conductor is matched The following condition is: 1/5≦H _P2 /T _P2 <1; wherein, H _P2 is the thickness of the second power conductor; T _{P2 is} the carrier adjacent to the second power conductor, adjacent thereto The thickness of the dielectric material between the two second ground conductors. The probe card structure (4) of claim 5, wherein the second signal conductor is more in conformity with the following condition: R _P2 ≦ R _S ; wherein R _P2 is a resistivity of the second signal conductor; _S is the resistivity of the signal line. The probe card structure (4) of claim 5, wherein the second signal conductor is more in conformity with the following condition: E _P2 ≧ E _S ; wherein E _P2 is a dielectric constant of the carrier; E _{S is} the The dielectric constant of the dielectric layer. The probe card structure (4) according to claim 5, wherein the second power conductor further meets the following condition: H _P2 /T _P2 ≧Φ _S1 /Φ _S2 ; wherein Φ _{S1 is} the line of the signal line Diameter; Φ _S2 is the diameter of the dielectric layer. A probe card structure (4) for transmitting a power signal and a test signal of a test machine to an electronic object to be tested, thereby supplying power to the electronic object to be tested through the power signal, and transmitting the test object through the test signal The electronic object to be tested is electrically detected; the probe card structure (4) comprises: a plurality of signal pins, which are made of a conductive material, and one end of which is used to touch the electronic object to be tested; and a substrate to have a specific a medium constant dielectric material for connecting to the detector, wherein a first power conductor made of a conductor and a plurality of first ground conductors disposed around the first power conductor are embedded therein The first power conductor is electrically connected to the detecting for transmitting the power signal; the first grounding conductor is used for grounding; a carrier is connected to the substrate and has a conductor a second power conductor, and a plurality of second ground conductors disposed around the second power conductor; the second power conductor and the first power conductor and at least one of the signal pins Connecting, for transmitting the power signal to the corresponding probe; the second grounding conductor is used as a grounding; the signal coaxial cable includes a signal line at a central position and covering the signal line a dielectric layer and a grounding wire outside the dielectric layer; the signal line is electrically connected to the detecting machine and the other end of the at least one signal pin for transmitting the test signal to the to-be-tested device through the corresponding signal pin The electronic device is configured to isolate the signal line from the ground line; the ground line is used as a ground; the second power conductor meets the following conditions: 1/5≦H _P2 /T _P2 <1; Wherein, _{P P2} is the thickness of the second power conductor; T _P2 is the thickness of the dielectric material between the carrier and the second ground conductor adjacent to the second power conductor. The probe card structure (4) according to claim 9, wherein the second signal conductor is more in conformity with the following condition: R _P2 ≦ R _S ; wherein R _P2 is a resistivity of the second signal conductor; _S is the resistivity of the signal line. The probe card structure (4) according to claim 9, wherein the second signal conductor is more in conformity with the following condition: E _P2 ≧ E _S ; wherein E _P2 is a dielectric constant of the carrier; E _{S is} the The dielectric constant of the dielectric layer. The probe card structure (4) according to claim 9, wherein the second power conductor further conforms to the following condition: H _P2 /T _P2 ≧Φ _S1 /Φ _S2 ; wherein Φ _{S1 is} the line of the signal line Diameter; Φ _S2 is the diameter of the dielectric layer.