TW201418658A - Method and device for preventing corrosion in hot water systems - Google Patents

Method and device for preventing corrosion in hot water systems Download PDF

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TW201418658A
TW201418658A TW102112436A TW102112436A TW201418658A TW 201418658 A TW201418658 A TW 201418658A TW 102112436 A TW102112436 A TW 102112436A TW 102112436 A TW102112436 A TW 102112436A TW 201418658 A TW201418658 A TW 201418658A
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hot water
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TWI641798B (en
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Peter D Hicks
David A Grattan
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Nalco Co
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D19/00Details
    • F24D19/0092Devices for preventing or removing corrosion, slime or scale
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/008Control or steering systems not provided for elsewhere in subclass C02F
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00Other methods of preventing corrosion or incrustation
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/20Treatment of water, waste water, or sewage by degassing, i.e. liberation of dissolved gases
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/30Treatment of water, waste water, or sewage by irradiation
    • C02F1/302Treatment of water, waste water, or sewage by irradiation with microwaves
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/30Treatment of water, waste water, or sewage by irradiation
    • C02F1/32Treatment of water, waste water, or sewage by irradiation with ultraviolet light
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/66Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/70Treatment of water, waste water, or sewage by reduction
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02Non-contaminated water, e.g. for industrial water supply
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/001Upstream control, i.e. monitoring for predictive control
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/005Processes using a programmable logic controller [PLC]
    • C02F2209/006Processes using a programmable logic controller [PLC] comprising a software program or a logic diagram
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/005Processes using a programmable logic controller [PLC]
    • C02F2209/008Processes using a programmable logic controller [PLC] comprising telecommunication features, e.g. modems or antennas
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/04Oxidation reduction potential [ORP]
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2303/00Specific treatment goals
    • C02F2303/08Corrosion inhibition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Hydrology & Water Resources (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

Disclosed is a method of controlling a real-time oxidation-reduction potential in a hot water system to inhibit corrosion in the hot water system. The method includes defining one or more operational protective zones in the hot water system. One or more of the operational protective zones includes an oxidation-reduction potential probe that is operable to measure a real-time oxidation-reduction potential in the hot water system at operating temperature and pressure. The probe transmits the measured real-time potential to the controller, which assesses and interprets the transmitted potential to determine whether it conforms to an oxidation-reduction potential setting. If the measured potential does not conform the oxidation-reduction potential setting, the controller is operable to feed or remove one or more active chemical species into or from the hot water system and further operable to change at least one system parameter.

Description

用於在熱水系統中防止腐蝕的方法及裝置 Method and apparatus for preventing corrosion in a hot water system 〔相關申請案之交叉引用〕[Cross-reference to relevant application]

本申請案為2007年7月24日申請之美國專利申請案第11/782,192號「Method and Device for Preventing Corrosion in Hot Water Systems」(現正在申請中)之部分連續申請案,該案之揭示內容以全文引用的方式併入本文中。 This application is a continuation-in-part of the United States Patent Application No. 11/782,192, filed on July 24, 2007, entitled "Method and Device for Preventing Corrosion in Hot Water Systems" (now in the process of application), the disclosure of the case This is incorporated herein by reference in its entirety.

本發明大體上係關於在熱水系統中降低或抑制腐蝕之方法。更特定言之,本發明係關於在一或多個操作保護區中在操作溫度及壓力下量測即時氧化還原電位及使用彼等量測值控制影響氧化還原電位之參數調整。本發明尤其係關於在簡單或複雜熱水系統中局部地及/或全面地降低或抑制腐蝕。 The present invention is generally directed to a method of reducing or inhibiting corrosion in a hot water system. More specifically, the present invention relates to the measurement of the instantaneous redox potential at operating temperatures and pressures in one or more operating protection zones and the use of such measured values to control parameter adjustments affecting the redox potential. In particular, the present invention relates to the local and/or overall reduction or suppression of corrosion in simple or complex hot water systems.

熱水系統一般由全鐵冶金(metallurgy)或混合冶金(諸如銅或銅合金系統、鎳及基於鎳之合金以及不鏽鋼)構成,且亦可與軟鋼組分混合。存在熱水系統之多種一般類別/組件,諸如鍋爐、熱水加熱器、熱交換器、蒸汽發生器、核動力電氣系統燃燒引擎及柴油冷卻劑系統、蒸發器系統、熱去鹽系統、造紙操作、醱酵製程、其類似物及所附接之輔助裝 置。其為經歷諸多氧化還原應力事件(REDOX Stress events)(亦即熱水系統中與氧化或還原電位有關的任何電化學事件)之動力操作系統。該等事件一般包括系統中涉及氧化還原電位(「ORP」)空間(space)或狀態(regime)的任何製程。 The hot water system is generally composed of metallurgy or mixed metallurgy (such as copper or copper alloy systems, nickel and nickel-based alloys, and stainless steel), and may also be mixed with the mild steel component. There are many general categories/components of hot water systems, such as boilers, hot water heaters, heat exchangers, steam generators, nuclear power electrical system combustion engines and diesel coolant systems, evaporator systems, thermal desalination systems, papermaking operations , fermentation process, its analogues and accompanying auxiliary equipment Set. It is a dynamic operating system that undergoes many REDOX Stress events (ie, any electrochemical events associated with oxidation or reduction potential in a hot water system). Such events generally include any process in the system involving redox potential ("ORP") space or regime.

此等事件由多種因素引起,包括各種組件洩漏、受洩漏空氣(air in-leakage)污染、發生故障之泵、密封件、真空管線及量規。此外,富氧水(諸如鍋爐補給水、返回之蒸汽冷凝液及/或表層或次表層原水)之使用增加、除氣器發生故障、蒸汽及渦輪機負載擺動以及與化學饋料泵有關之問題引起化學處理饋料速率之計劃外之減少或增加。不受控之氧化還原應力事件會造成嚴重腐蝕問題,諸如熱水系統中之局部腐蝕、應力腐蝕、腐蝕疲勞及/或流動加速腐蝕問題。此等問題依據其性質趨向於為電化學問題且由此與環境及結構材料相互作用之氧化還原特性相關聯。 These events are caused by a variety of factors, including leakage of various components, air in-leakage contamination, faulty pumps, seals, vacuum lines, and gauges. In addition, increased use of oxygen-enriched water (such as boiler feed water, return steam condensate and/or surface or subsurface raw water), deaerator failure, steam and turbine load swings, and problems associated with chemical feed pumps Unplanned reduction or increase in chemical processing feed rate. Uncontrolled redox stress events can cause serious corrosion problems such as localized corrosion, stress corrosion, corrosion fatigue, and/or flow accelerated corrosion problems in hot water systems. These problems are based on their nature tending to be associated with electrochemical problems and thus redox properties that interact with environmental and structural materials.

儘管現今實踐一些習知方法來鑑別熱水系統中之氧化還原應力事件,但由於熱水系統動力學,大多數氧化還原應力事件不可預測。此等方法由於其具有固有缺陷(參見下文)而不能得以廣泛實踐。因此,大多數氧化還原應力事件未被偵測到,由此未得以校正。不受控之氧化還原應力事件會在此等系統中引起嚴重腐蝕問題,該等腐蝕問題負面地影響設施裝備預期壽命、可靠性、生產能力、安全性、環境管制、資本支出及總設施操作成本。 Although some conventional methods have been practiced to identify redox stress events in hot water systems, most redox stress events are unpredictable due to hot water system dynamics. These methods cannot be widely practiced due to their inherent drawbacks (see below). Therefore, most redox stress events are not detected and thus are not corrected. Uncontrolled redox stress events can cause severe corrosion problems in such systems that negatively impact facility equipment life expectancy, reliability, production capacity, safety, environmental controls, capital expenditures, and total facility operating costs .

當前鑑別氧化還原應力事件包括線上儀器與抓樣濕式化學分析測試法。在兩種方法中,樣品在量測前必須首先進行樣品調節,諸如冷卻。線上儀器之實例包括溶氧計、陽離子電導率儀器、室溫ORP儀器、 pH儀、鈉分析儀、硬度分析儀、電導率計、二氧化矽分析儀、粒子及濁度計、還原劑分析儀及其類似物。典型地,在樣品冷卻後或在高溫下執行總體腐蝕監測(諸如試片及電化學分析)。抓樣測試法包括分析溶氧、pH值、硬度、二氧化矽電導率、總鐵及可溶性鐵、銅及二氧化矽、還原劑過量及其類似物。 Current identification of redox stress events includes on-line instrumentation and grab-type wet chemical analysis tests. In both methods, the sample must first be subjected to sample conditioning, such as cooling, prior to measurement. Examples of online instruments include dissolved oxygen meters, cation conductivity instruments, room temperature ORP instruments, pH meter, sodium analyzer, hardness analyzer, conductivity meter, cerium oxide analyzer, particle and turbidimeter, reducing agent analyzer and the like. Typically, overall corrosion monitoring (such as coupons and electrochemical analysis) is performed after the sample has cooled or at elevated temperatures. The sample test method includes analysis of dissolved oxygen, pH, hardness, cerium oxide conductivity, total iron and soluble iron, copper and cerium oxide, reducing agent excess and the like.

此等方法之一些缺陷包括以下所述。抓樣分析提供單一時間點量測值,因此不為針對氧化還原應力事件之可行連續監測方法。其亦通常具有不夠低水準之偵測極限。線上監測器不直接量測氧化還原應力,由此不能指示是否在任何特定時間發生氧化還原應力事件。腐蝕監測器偵測總體腐蝕,但不能量測由氧化還原應力事件引起的局部腐蝕速率之變化。線上還原劑分析儀量測還原劑之量,但並非在系統溫度及壓力下系統所經受的淨氧化還原應力。由此,在明顯還原劑存在下會存在氧化還原應力為此技術之另一缺陷。 Some of the deficiencies of these methods include those described below. Grab sample analysis provides a single point-of-time measurement and is therefore not a viable continuous monitoring method for redox stress events. It also usually has detection limits that are not low enough. The in-line monitor does not directly measure the redox stress and thus does not indicate whether a redox stress event occurs at any particular time. The corrosion monitor detects overall corrosion but does not measure changes in local corrosion rates caused by redox stress events. The on-line reductant analyzer measures the amount of reductant, but not the net redox stress experienced by the system at system temperature and pressure. Thus, the presence of redox stress in the presence of significant reducing agents is another drawback of this technique.

溶氧(「DO」)計具有類似缺陷。量測DO(氧化劑)之量但並不一定是系統所經受之淨氧化還原應力不為腐蝕應力之準確指示物。在DO量測前亦必須冷卻樣品,由此當氧化還原應力事件開始時偵測之延遲時間延長。此外,樣品管線中可能消耗氧氣會產生不準確之讀數。在明顯不存在DO下氧化還原應力亦可能存在,樣品中極少或無DO有可能是假陰性。另外,所有上述儀器購買起來均相對昂貴且需要頻繁校準及維護。 Dissolved oxygen ("DO") meters have similar defects. Measuring the amount of DO (oxidant) is not necessarily the exact indicator that the net redox stress experienced by the system is not a corrosion stress. The sample must also be cooled prior to DO measurement, thereby extending the detection delay time at the beginning of the redox stress event. In addition, oxygen that may be consumed in the sample line can produce inaccurate readings. Redox stress may also be present in the absence of apparent DO, and little or no DO in the sample may be false negative. In addition, all of the above instruments are relatively expensive to purchase and require frequent calibration and maintenance.

腐蝕試片提供總體系統腐蝕之時間平均結果。同樣,此技術不提供氧化還原應力事件之即時指示或控制。線上電化學腐蝕工具不適用於局部腐蝕測定且不能用於低電導率環境。 The corrosion coupon provides a time average result of overall system corrosion. Again, this technique does not provide an immediate indication or control of redox stress events. On-line electrochemical corrosion tools are not suitable for local corrosion measurements and cannot be used in low conductivity environments.

室溫ORP為對自系統獲取之樣品之淨ORP的直接量測。此技術之缺陷為其不能指示在系統溫度及壓力下所發生之事件。在操作溫度及壓力下發生的氧化還原應力事件在室溫下通常不能觀察到,因為過程動力學及熱力學隨溫度而變化。另外,室溫ORP量測裝置較不靈敏且很可能變得極化。該等裝置之可靠性不良且其需要頻繁校準及維護。 Room temperature ORP is a direct measure of the net ORP of a sample taken from the system. The drawback of this technique is that it does not indicate events that occur at system temperature and pressure. Redox stress events that occur at operating temperatures and pressures are generally not observed at room temperature because process kinetics and thermodynamics vary with temperature. In addition, the room temperature ORP measuring device is less sensitive and is likely to become polarized. These devices are poorly reliable and require frequent calibration and maintenance.

由此,現需要開發在熱水系統中在操作溫度及壓力下準確監測及控制即時ORP之方法。 Thus, there is a need to develop a method for accurately monitoring and controlling an immediate ORP at operating temperatures and pressures in a hot water system.

因此,本發明提供一種在熱水系統中在操作溫度及壓力下即時監測及控制ORP之方法。熱水系統中發生之諸多製程產生ORP,其又充當熱水系統之氧化還原應力指示物。與習知室溫量測相比,在系統操作溫度及壓力下即時進行ORP量測能夠即時指示系統中所發生之主要及次要氧化還原應力事件。該種即時ORP監測可用於量測、鑑別及評定系統中之氧化還原應力需要且可充當直接或間接腐蝕過程指示物。 Accordingly, the present invention provides a method of instantly monitoring and controlling an ORP at operating temperatures and pressures in a hot water system. Many processes occurring in hot water systems produce ORP, which in turn acts as a redox stress indicator for the hot water system. Instant ORP measurements at system operating temperatures and pressures provide immediate indication of major and minor redox stress events occurring in the system compared to conventional room temperature measurements. Such instant ORP monitoring can be used to measure, identify, and assess redox stress requirements in the system and can serve as a direct or indirect corrosion process indicator.

在一態樣中,本發明提供一種在熱水系統中控制即時ORP以在熱水系統中降低或抑制腐蝕之方法。該方法包括在熱水系統中指定一或多個操作保護區(「區(zone)」或「區(zones)」)。選擇至少一個(例如一個、兩個或兩個以上)指定區域且一或多個(例如一個、兩個或兩個以上)所選區域包括至少一個可操作以量測即時ORP且與控制器通信的ORP探針。當熱水系統處於操作溫度及壓力下時在一或多個(例如一個、兩個或兩個以上)所選區域中連續或間歇量測即時ORP。方法進一步包括將所量測之即時ORP傳輸至控制器及評定所量測之即時ORP或基於所量測之即 時ORP之計算之ORP是否符合ORP設定。對於所選區域中之每一者,ORP設定可為相同ORP設定,或對於所選區域中之至少兩者,可為不同ORP設定。若所量測之即時ORP或計算之ORP不符合ORP設定,則方法包括改變熱水系統中之參數。在一具體實例中,若所量測之即時ORP或計算之ORP不符合ORP設定,則方法包括執行以下操作中之至少一者:(i)向熱水系統中饋送有效量之一或多種活性化學物質,(ii)自熱水系統移除有效量之一或多種活性化學物質,及(iii)改變系統參數。 In one aspect, the present invention provides a method of controlling an immediate ORP in a hot water system to reduce or inhibit corrosion in a hot water system. The method includes assigning one or more operational protection zones ("zones" or "zones") in the hot water system. Selecting at least one (eg, one, two, or more) designated areas and one or more (eg, one, two, or more) selected areas including at least one operable to measure the immediate ORP and communicate with the controller ORP probe. Instant ORP is measured continuously or intermittently in one or more (eg, one, two or more) selected zones when the hot water system is at operating temperature and pressure. The method further includes transmitting the measured immediate ORP to the controller and evaluating the measured immediate ORP or based on the measured Whether the ORP calculated by the ORP meets the ORP setting. For each of the selected regions, the ORP settings can be the same ORP setting, or for at least two of the selected regions, can be set for different ORPs. If the measured immediate ORP or calculated ORP does not meet the ORP setting, the method includes changing the parameters in the hot water system. In one embodiment, if the measured immediate ORP or the calculated ORP does not meet the ORP setting, the method includes performing at least one of: (i) feeding the hot water system with one or more active amounts a chemical, (ii) removing an effective amount of one or more active chemicals from the hot water system, and (iii) changing system parameters.

在另一態樣中,本發明提供一種用於熱水系統之腐蝕控制裝置。熱水系統具有一或多個(例如一個、兩個或兩個以上)操作保護區,其中選擇一小組該等區域(較佳兩個或兩個以上區域)。在一具體實例中,該裝置包括與一或多個ORP探針通信之接收器。啟動一小組ORP探針且各經啟動之ORP探針可操作以在操作溫度及壓力下量測即時ORP。在一或多個所選區域中安裝至少一個ORP探針。在一具體實例中,裝置亦包括可操作以判讀自各經啟動之ORP探針傳達至接收器之所量測之即時ORP的處理器。處理器直接判讀所量測之即時ORP或判讀基於所量測之即時ORP之計算之ORP。在一具體實例中,腐蝕控制裝置可操作以基於所量測及判讀之ORP的一或多次反覆來改變或調整參數。 In another aspect, the present invention provides an erosion control apparatus for a hot water system. The hot water system has one or more (e.g., one, two or more) operational protection zones, wherein a small group of such zones (preferably two or more zones) is selected. In one embodiment, the apparatus includes a receiver in communication with one or more ORP probes. A small set of ORP probes is activated and each activated ORP probe is operable to measure an immediate ORP at operating temperature and pressure. At least one ORP probe is mounted in one or more selected zones. In one embodiment, the apparatus also includes a processor operative to interpret the measured instant ORP communicated from the activated ORP probe to the receiver. The processor directly interprets the measured immediate ORP or interprets the ORP based on the calculated instantaneous ORP calculation. In one embodiment, the corrosion control device is operative to change or adjust parameters based on one or more iterations of the measured and interpreted ORP.

根據至少一個具體實例,饋料裝置與傳輸器通信,該饋料裝置可操作以管理向熱水系統中引入一或多種活性化學物質以影響即時ORP之變化。在至少一個具體實例中,可操作以自熱水系統移除一種、兩種或兩種以上化學物質之化學物移除裝置與腐蝕控制裝置通信。若所判讀之即時ORP不符合ORP設定,則處理器可操作以經由傳輸器向饋料裝置或 化學物移除裝置發送輸出信號。 According to at least one specific example, the feed device is in communication with a conveyor operable to manage the introduction of one or more active chemicals into the hot water system to effect changes in the immediate ORP. In at least one embodiment, a chemical removal device operable to remove one, two or more chemicals from a hot water system is in communication with the corrosion control device. If the interpreted immediate ORP does not meet the ORP setting, the processor is operable to feed the feeder or via the transmitter The chemical removal device sends an output signal.

本發明之一優勢為提供一種在熱水系統中抑制腐蝕之方法,其基於在熱水系統中在操作溫度及壓力下量測即時ORP及對所量測之ORP作出反應,向熱水系統中饋送一或多種活性化學物質以維持ORP設定。 One advantage of the present invention is to provide a method for inhibiting corrosion in a hot water system based on measuring an immediate ORP at an operating temperature and pressure in a hot water system and reacting to the measured ORP to a hot water system One or more active chemicals are fed to maintain the ORP setting.

本發明之另一優勢為提供一種熱水系統腐蝕控制裝置,其包括接收器、處理器、傳輸器及饋料裝置,該等裝置一致地起作用以在熱水系統中之一或多個操作保護區中控制即時ORP。 Another advantage of the present invention is to provide a hot water system corrosion control apparatus that includes a receiver, a processor, a transmitter, and a feed device that operate in unison to operate one or more of the hot water systems Control the immediate ORP in the protected area.

本發明之另一優勢為藉由使系統參數之維護及控制改良來提高熱水系統效率。 Another advantage of the present invention is to improve the efficiency of the hot water system by improving the maintenance and control of system parameters.

本發明之另一優勢為藉由準確地防止腐蝕來降低各種熱水系統及組件之操作成本。 Another advantage of the present invention is to reduce the operating costs of various hot water systems and components by accurately preventing corrosion.

上文已相當廣泛地概述了本發明之特徵及技術優勢以使得以下實施方式可得以更好的理解。下文將描述本發明之其他特徵及優勢,其形成本發明申請專利範圍之主題。熟習此項技術者應瞭解,所揭示之概念及特定具體實例可容易地用作修改或設計其他具體實例以便執行本發明之相同目的之基礎。熟習此項技術者亦應認識到,該等等效具體實例不背離如在隨附申請專利範圍中所闡述的本發明之精神及範疇。 The features and technical advantages of the present invention are set forth in the <RTIgt; Other features and advantages of the invention will be described hereinafter which form the subject of the scope of the invention. It will be appreciated by those skilled in the art that the concept and specific embodiments disclosed may be readily utilized as a basis for modification or design of other embodiments. Those skilled in the art should also appreciate that such equivalent embodiments do not depart from the spirit and scope of the invention as set forth in the appended claims.

1‧‧‧除氣器出口 1‧‧‧ degasser outlet

2‧‧‧FW泵出口 2‧‧‧FW pump outlet

22‧‧‧饋送位置 22‧‧‧ Feeding location

圖1描繪簡化之3組件熱水系統,其中補給水流過「除氣器」、「FW泵」且流入「鍋爐」中,且鍋爐又產生「有用蒸汽」以供隨後用於各種製程中。 Figure 1 depicts a simplified 3-component hot water system in which makeup water flows through a "degasser", "FW pump" and into a "boiler", which in turn produces "useful steam" for subsequent use in various processes.

圖2說明較複雜之鍋爐組態,其包括複數個給水泵、複數 個熱交換器及蒸汽產生器。 Figure 2 illustrates a more complex boiler configuration that includes a plurality of feed pumps, plural Heat exchangers and steam generators.

圖3描繪各種「ORP控制區」,其中系統在各個溫度下之ORP設定可不同。 Figure 3 depicts various "ORP Control Zones" in which the system can have different ORP settings at various temperatures.

圖4說明在各個位置饋送多種氧化還原活性物質以控制單一位置之@T ORP®(Nalco公司之商標)。 Figure 4 illustrates @T ORP® (a trademark of Nalco Corporation) that feeds a variety of redox active species at various locations to control a single location.

如本文所用之「熱水系統(hot water system)」、「系統(system)」及其類似術語指熱水與金屬表面接觸之任何系統。「熱水(Hot water)」意謂溫度為約37℃至約370℃之水。系統可在大氣壓力或高達約4,000psi之壓力下或在低於該等壓力下操作。 As used herein, "hot water system", "system" and the like mean any system in which hot water is in contact with a metal surface. "Hot water" means water having a temperature of from about 37 ° C to about 370 ° C. The system can operate at atmospheric pressure or at pressures up to about 4,000 psi or below.

「ORP」、「@T ORP」、「at-T ORP」及「即時ORP(real-time ORP)」指在操作溫度及壓力下工業水系統之氧化還原電位。在本文之某些情況下,ORP指定為室溫ORP。 "ORP", "@T ORP", "at-T ORP" and "real-time ORP" refer to the redox potential of industrial water systems at operating temperatures and pressures. In some cases herein, ORP is specified as room temperature ORP.

「ORP探針(ORP probe)」指能夠量測及傳輸即時ORP信號之任何裝置。儘管可使用任何適合裝置,但較佳裝置揭示於現正在申請中之題為「High Temperature and Pressure Oxidation-Reduction Potential Measuring and Monitoring Device for Hot Water Systems」之美國專利申請案第11/668,048號中,該案以全文引用的方式併入本文中。典型地,ORP探針包括溫度偵測器、貴金屬電極及參考電極。 "ORP probe" means any device capable of measuring and transmitting an instantaneous ORP signal. Although any suitable device can be used, the preferred device is disclosed in U.S. Patent Application Serial No. 11/668,048, the entire disclosure of which is incorporated herein by reference. The case is hereby incorporated by reference in its entirety. Typically, an ORP probe includes a temperature detector, a noble metal electrode, and a reference electrode.

「活性化學物質(Active chemical species)」指氧化劑、還原劑、腐蝕抑制劑、腐蝕劑及對熱水系統中之ORP有影響或影響熱水系統中之ORP的其他物質。下文更詳細描述該等物質。 "Active chemical species" means oxidizing agents, reducing agents, corrosion inhibitors, corrosives, and other substances that affect or affect the ORP in hot water systems. These materials are described in more detail below.

「氧化還原應力(REDOX Stress)」指熱水系統中與氧化或還原電位直接或間接有關的任何電化學事件。 "REDOX Stress" refers to any electrochemical event in a hot water system that is directly or indirectly related to oxidation or reduction potential.

「控制系統(Controller system)」、「控制器(controller)」及其類似術語指手動操作器或電子裝置,其具有諸如以下組件:處理器、記憶體裝置、數位儲存媒體、陰極射線管、液晶顯示器、電漿顯示器、觸摸式螢幕或其他監測器及/或其他組件。在某些情況下,控制器可操作以與一或多個特殊應用積體電路、程式、電腦可執行指令或算法、一或多個硬佈線裝置、無線裝置及/或一或多個機械裝置整合。一些或所有控制系統功能可位於中央位置(諸如網路伺服器)以經由區域網路、廣域網路、無線網路、網際網路連接、微波鏈路、紅外鏈路及其類似物通信。另外,可包括其他組件(諸如信號調節器或系統監測器)以有助於信號處理算法。 "Controller system", "controller" and the like mean a manual operator or an electronic device having components such as a processor, a memory device, a digital storage medium, a cathode ray tube, and a liquid crystal. Display, plasma display, touch screen or other monitor and/or other components. In some cases, the controller is operative to integrate one or more special application circuits, programs, computer executable instructions or algorithms, one or more hardwired devices, wireless devices, and/or one or more mechanical devices Integration. Some or all of the control system functions may be located in a central location (such as a network server) to communicate via a regional network, a wide area network, a wireless network, an internet connection, a microwave link, an infrared link, and the like. In addition, other components, such as signal conditioners or system monitors, may be included to facilitate signal processing algorithms.

在一個具體實例中,方法包括自動控制器。在另一具體實例中,控制器為手動或半手動的,其中操作器判讀信號且確定給水(「FW」)化學,諸如氧氣或其他氧化劑、除氧劑或其他還原劑、腐蝕抑制劑及/或腐蝕劑劑量。在一具體實例中,所量測之ORP信號由根據所述方法控制FW化學之控制系統判讀。在一具體實例中,控制系統亦判讀所量測之溫度以確定添加或移除(若存在)活性化學物之量。控制系統亦可操作以判定除添加一或多種化學物質或自熱水系統移除一或多種化學物質以外或替代添加一或多種化學物質或自熱水系統移除一或多種化學物質,是否需要改變或調整系統參數。溫度偵測器亦可用於通知目的,諸如報警方案及/或控制方案。應瞭解,基於其他輸入(諸如pH值、DO水準及其他水組分/特性),控制方案可併入泵限制器、報警、智能控制及/或其類似物。 In one specific example, the method includes an automatic controller. In another embodiment, the controller is manual or semi-manual, wherein the operator interprets the signal and determines feed water ("FW") chemistry, such as oxygen or other oxidant, oxygen scavenger or other reducing agent, corrosion inhibitor and/or Or etchant dose. In one embodiment, the measured ORP signal is interpreted by a control system that controls FW chemistry according to the method. In one embodiment, the control system also interprets the measured temperature to determine the amount of active chemical added or removed, if present. The control system is also operable to determine whether it is necessary to add one or more chemicals or remove one or more chemicals from the hot water system or to add one or more chemicals or remove one or more chemicals from the hot water system, Change or adjust system parameters. The temperature detector can also be used for notification purposes, such as an alarm scheme and/or a control scheme. It will be appreciated that control schemes may incorporate pump limiters, alarms, intelligent controls, and/or the like based on other inputs such as pH, DO level, and other water components/characteristics.

預期所揭示之方法適用於各種熱水系統,包括直接與衛星活性化學物饋送設計。「直接(Direct)」饋送典型地指量測某一區域之即時ORP且向同一區域饋送活性化學物。「衛星(Satellite)」饋送通常指量測某一區域之即時ORP且向不同區域饋送活性化學物。代表性系統及系統組件包括冷凝器,管側與殼側;熱交換器;泵;密封件;軟鋼或基於銅之FW加熱器;基於銅之合金表面冷凝器;除氣器;水管及火管鍋爐;造紙機;冷凝液接收器;具有或不具有蒸汽祛水器之蒸汽冷凝液傳遞管線;製程液體熱交換器;蒸發器;去鹽系統;淡水冷凝器;調溫水源;流動加速腐蝕保護;空氣加熱器;柴油及汽油之引擎冷卻劑系統;及其類似物。 The disclosed method is expected to be applicable to a variety of hot water systems, including direct and satellite active chemical feed designs. A "direct" feed typically refers to measuring an immediate ORP of an area and feeding the same area with active chemicals. A "satellite" feed generally refers to measuring the instantaneous ORP of an area and feeding the active chemical to different areas. Representative system and system components include condenser, tube side and shell side; heat exchanger; pump; seal; mild steel or copper based FW heater; copper based alloy surface condenser; deaerator; water pipe and fire tube Boiler; paper machine; condensate receiver; steam condensate transfer line with or without steam decanter; process liquid heat exchanger; evaporator; desalting system; fresh water condenser; temperature control water source; Air heaters; engine coolant systems for diesel and gasoline; and the like.

其他例示性製程包括造紙製程,諸如牛皮紙制漿及漂白製程;晶圓拋光及平坦化製程(例如矽晶圓拋光);燃燒氣體排放(例如SO2、NOx、汞);醱酵製程;地熱製程;及水性有機氧化還原合成(亦即需要氧化還原引發劑之聚合製程)。 Other exemplary processes include papermaking process, such as a kraft pulping and bleaching processes; wafer polishing and planarization processes (e.g., silicon wafer polishing); combustion gas emission (e.g. SO 2, NO x, and mercury); Po fermentation process; geothermal Process; and aqueous organic redox synthesis (ie, a polymerization process requiring a redox initiator).

習知腐蝕控制方案使用單點饋料。所揭示之發明藉由精確確定所要活性化學物及彼等化學物之適當量/劑量來使用有目標之饋料。舉例而言,可區分相對氧化區(諸如低壓FW加熱器(基於銅之冶金))與較具還原性區(具有高壓FW加熱器(非基於銅之冶金))以減輕與流動加速腐蝕有關之問題。加壓水反應器區段之全鐵FW加熱器內的相對氧化條件相對於在蒸汽發生器中用於應力腐蝕開裂緩解的相對還原性最終FW加熱器狀態。 Conventional corrosion control schemes use a single point feed. The disclosed invention uses a targeted feed by precisely determining the appropriate amount/dose of the active chemical and its chemicals. For example, it is possible to distinguish between a relatively oxidized zone (such as a low pressure FW heater (metallurgy based on copper)) and a more reductive zone (with a high pressure FW heater (non-copper based metallurgy)) to mitigate the associated acceleration with flow. problem. The relative oxidation conditions within the fully iron FW heater of the pressurized water reactor section are relative to the relative reductive final FW heater state used in the steam generator for stress corrosion cracking relief.

本發明能夠偵測主要與次要氧化還原應力事件且對其作出反應。典型地,實施者已知系統腐蝕控制牽連及可能的氧化還原應激物且 能夠相應地選擇指定操作保護區中之一或多者來適當地監測既定系統之@T ORP空間。以此方式,可藉由基於作為主要氧化還原應力指示物之本地及/或遠端@T ORP讀數饋送或移除氧化還原活性物質來控制腐蝕。監測並量測@T ORP空間以評定且鑑別系統需要,隨後與已知/已制定度量標準比較以對氧化還原應力事件作出反應,解決且控制氧化還原應力事件。作為次要氧化還原應力之指示物,本發明可偵測由先前主要氧化還原應力產生之腐蝕過程,其中主要氧化還原應激物不再顯而易見。 The present invention is capable of detecting and reacting to major and minor redox stress events. Typically, the practitioner is aware of system corrosion control implicature and possible redox stressors and One or more of the designated operational protection zones can be selected accordingly to properly monitor the @T ORP space of the given system. In this manner, corrosion can be controlled by feeding or removing redox active species based on local and/or remote @T ORP readings as a primary redox stress indicator. The @T ORP space is monitored and measured to assess and identify system needs, and then compared to known/established metrics to react to redox stress events to resolve and control redox stress events. As an indicator of secondary redox stress, the present invention detects corrosion processes resulting from previous major redox stresses, where primary redox stressors are no longer apparent.

ORP探針可偵測促成熱水系統中之氧化還原應力事件的若干不同因素。舉例而言,所選區域中之ORP探針可充當該區域或另一區域中之腐蝕的直接指示物。在一具體實例中,量測第一所選區域之即時ORP,且若第一所選區域之所量測之即時ORP或計算之ORP不符合第一所選區域之ORP設定,則向第一所選區域中饋送一或多種活性化學物質。在另一具體實例中,量測第一所選區域之即時ORP,且若第一所選區域之所量測之即時ORP或計算之ORP不符合第一所選區域之ORP設定,則在一或多個其他所選區域中饋送一或多種活性化學物質。在另一具體實例中,量測一或多個所選區域之一或多個即時ORP,且基於一或多個所量測之即時ORP計算一或多個其他所選區域之一或多個其他即時ORP。 ORP probes can detect several different factors that contribute to redox stress events in hot water systems. For example, an ORP probe in a selected region can act as a direct indicator of corrosion in that region or another region. In a specific example, the instantaneous ORP of the first selected region is measured, and if the measured immediate ORP or the calculated ORP of the first selected region does not meet the ORP setting of the first selected region, then the first One or more active chemicals are fed to the selected area. In another embodiment, the instantaneous ORP of the first selected region is measured, and if the measured immediate ORP or the calculated ORP of the first selected region does not meet the ORP setting of the first selected region, then One or more active chemicals are fed in or in a plurality of other selected regions. In another embodiment, one or more of the selected regions are measured for one or more instant ORPs, and one or more other selected regions are calculated based on one or more measured instantaneous ORPs ORP.

如上所述,在一些情況下,使用第一區域中之所量測之ORP計算另一區域之ORP。該等計算可藉由關於系統動力學作出各種假定或藉由量測區域之間的溫度/水化學差異來進行。使用熟習此項技術者已知之混合電位理論及熱力學原理亦允許接近其他區域中之條件。然而,該等計算典型地遭受固有的不準確性;由此,較佳方法為在所選區域中當場量測即 時ORP。 As described above, in some cases, the ORP of another region is calculated using the measured ORP in the first region. These calculations can be made by making various assumptions about system dynamics or by measuring temperature/water chemistry differences between regions. The use of mixed potential theory and thermodynamic principles known to those skilled in the art also allows access to conditions in other regions. However, such calculations typically suffer from inherent inaccuracies; thus, the preferred method is to measure on the spot in the selected area. ORP.

對於針對某一系統確定或指定特定操作保護/控制區存在若干重要因素。任何特定系統之目標為實現該系統之@T ORP「設施特定鍋爐最佳實踐(Plant Specific Boiler Best Practice)」。舉例而言,某些設施由於控制原理、環境約束、經濟因素、工業標準等而限於某些化學處理。系統溫度亦可自一個設施至另一設施顯著變化,此需要調整所採用之特定控制原理,以下實施例中將對此作出更詳細說明。不同設施亦可具有獨特氧化還原應力基線,且相對於基線之不明智改變可能需要確定。 There are several important factors in determining or specifying a particular operational protection/control zone for a system. The goal of any particular system is to implement the @T ORP "Plant Specific Boiler Best Practice" for the system. For example, certain facilities are limited to certain chemical treatments due to control principles, environmental constraints, economic factors, industry standards, and the like. The system temperature can also vary significantly from one facility to another, which requires adjustment of the particular control principles employed, as will be explained in more detail in the following examples. Different facilities may also have unique redox stress baselines, and unwise changes relative to baseline may need to be determined.

其他因素包括有目的地添加或固有存在的特定ORP改變物質;系統中各種部分/實體之構造的工程用合金;所要之總體及局部腐蝕緩解;劑量限制;其他系統設計特異性;特殊考慮因素,諸如流動加速腐蝕、應力及腐蝕開裂;系統可變性。熟習此項技術者應瞭解如何評定此等及其他系統變數/特異性來針對特定設施或系統實施本發明。 Other factors include specific ORP altering substances that are purposely added or intrinsically present; engineering alloys for the construction of various parts/entities in the system; desired overall and localized corrosion mitigation; dose limitations; other system design specificities; special considerations, Such as flow accelerated corrosion, stress and corrosion cracking; system variability. Those skilled in the art will understand how to assess these and other system variables/specificities to implement the invention for a particular facility or system.

理想地,設施之任何部分的@T ORP氧化還原應力均可使用@T ORP進行量測並控制。亦即,向特定的一件裝備(或裝備群)中直接饋送氧化還原活性物質,當場量測該件裝備中水之@T ORP且加以控制以緩解腐蝕。本發明更特別地解決受保護部分本地之腐蝕及腐蝕產物之傳輸,以及伴隨的在系統別處該腐蝕傳輸之有害作用,包括積垢、熱傳遞表面塗層、渦輪沈積等。此類型之全裝備監測及控制方法由於系統限制及經濟因素通常不可行。因此,系統之部分典型地需要作為整個實體來處理。在一些情況下,鍋爐系統之整個給水系可為實體。或者,僅系統之小部分或系統部分之群為實體。預期可選擇並監測/控制任何部分、組件或實體(包括視為 一個實體之整個系統)。 Ideally, @T ORP redox stress in any part of the facility can be measured and controlled using @T ORP. That is, the redox active material is directly fed to a specific piece of equipment (or equipment group), and the @T ORP of the water in the equipment is measured on the spot and controlled to mitigate corrosion. The present invention more specifically addresses the transmission of corrosion and corrosion products locally in the protected portion, as well as the accompanying deleterious effects of the corrosion transmission elsewhere in the system, including fouling, heat transfer surface coating, turbine deposition, and the like. This type of full equipment monitoring and control method is often not feasible due to system constraints and economic factors. Therefore, parts of the system typically need to be handled as an entire entity. In some cases, the entire water supply system of the boiler system can be a solid. Or, only a small portion of the system or a group of system parts is an entity. It is expected that any part, component or entity may be selected and monitored/controlled (including The entire system of an entity).

在一態樣中,一個所選區域之ORP設定可與另一指定或所選區域重疊。在另一態樣中,一個所選區域之ORP設定完全獨立於各其他指定或所選區域。在另一態樣中,一個所選區域之ORP設定部分地取決於一或多個其他指定或所選區域中之因素。 In one aspect, the ORP setting of a selected area may overlap with another designated or selected area. In another aspect, the ORP setting of a selected region is completely independent of each other designated or selected region. In another aspect, the ORP setting of a selected region depends in part on one or more of the other specified or selected regions.

在一具體實例中,確定第一所選區域之ORP設定,且視情況確定其他所選區域(若存在)之其他ORP設定。在一個具體實例中,獨立地確定各其他ORP設定。或者,一或多個ORP設定可取決於一或多個其他ORP設定。ORP設定一般取決於且基於熱水系統之操作限制。 In one embodiment, the ORP setting of the first selected region is determined, and other ORP settings for other selected regions, if any, are determined as appropriate. In one specific example, each of the other ORP settings is determined independently. Alternatively, one or more ORP settings may depend on one or more other ORP settings. ORP settings generally depend on and are based on operational limitations of the hot water system.

可藉由任何適合方法完成任何特定系統之ORP設定確定。較佳方法描述於美國專利第7,666,312號「Method of Inhibiting Corrosion in Industrial Hot Water Systems by Monitoring and Controlling Oxidant/Reductant Feed through a Nonlinear Control Algorithm」中,該案以全文引用的方式併入本文中。然而,預期可採用熟習此項技術者已知之任何方法來確定ORP設定。在一具體實例中,ORP設定為選自一或多個單一值之ORP設定點。在另一具體實例中,ORP設定為選自一或多個值範圍之ORP設定範圍。任何所選區域之ORP設定可隨時間調整或變化。舉例而言,既定設施可具有概述系統之不同部分/組件在不同時間之ORP設定的時間表。此時間表典型地基於系統中可視系統改變需要而改變之操作因素。 The ORP setting determination for any particular system can be accomplished by any suitable method. A preferred method is described in "Method of Inhibiting Corrosion in Industrial Hot Water Systems by Monitoring and Controlling Oxidant/Reductant Feed through a Nonlinear Control Algorithm", which is incorporated herein by reference in its entirety. However, it is contemplated that any method known to those skilled in the art can be employed to determine the ORP setting. In one embodiment, the ORP is set to an ORP set point selected from one or more single values. In another embodiment, the ORP is set to an ORP setting range selected from one or more range of values. The ORP setting for any selected area can be adjusted or changed over time. For example, a given facility may have a schedule that outlines ORP settings for different portions/components of the system at different times. This schedule is typically based on operational factors that change as needed for visual system changes in the system.

一些區域可保持相對還原性且其他區域可為相對較具氧化性。舉例而言,參看圖2,熱交換器1及2可由在較具還原性條件下展現低腐蝕速率之合金製成。而熱交換器3可由在較具氧化性條件下展現較低腐 蝕速率之不同冶金製成。「蒸汽產生器(Steam Producer)」可能同樣需要保持在較具還原性條件下。將相應地調整並監測@T ORP控制區以均衡此等差異。 Some regions may remain relatively reductive and other regions may be relatively more oxidizing. For example, referring to Figure 2, heat exchangers 1 and 2 can be made of an alloy that exhibits a low corrosion rate under more reductive conditions. The heat exchanger 3 can exhibit lower rot under more oxidizing conditions. The etch rate is different from metallurgical. The "Steam Producer" may also need to be kept under more reductive conditions. The @T ORP control area will be adjusted and monitored accordingly to equalize these differences.

在一個具體實例中,一或多個所選區域可呈監測及/或報警模式,而一或多個其他所選區域呈控制模式。在一具體實例中,呈監測及/或報警模式之所選區域能夠在此等模式之間轉換。該種轉換可為手動控制的或自動的。下文呈現@T ORPTM系統設計可如何用於氧化還原應力控制的若干實施例。 In one embodiment, one or more selected regions may be in a monitoring and/or alarm mode, and one or more other selected regions are in a control mode. In a specific example, selected regions in the monitoring and/or alarm mode can be switched between these modes. This conversion can be manual or automatic. The following presents the ORP (TM) system design can be @T how to several embodiments redox stress control.

在另一具體實例中,在任何泵兩端量測@T ORP以偵測泵或密封件腐蝕或故障。在另一具體實例中,可使用該方法偵測熱交換器管洩漏,因為一種活性化學物質可經由熱交換器中之洩漏傳遞至另一側(例如殼側至管側或反之亦然)。另一實例為表面冷凝器冷卻水洩漏至FW冷凝液熱井中。在另一具體實例中,可使用該方法偵測外部活性化學物質(亦即系統污染物)之任何非所需侵擾。在一替代性具體實例中,可使用@T ORP形成系統中特定氧化還原應激物之「指紋(fingerprint)」。以此方式,其可用作隨著不時地將更多鍋爐補給水添加至系統中,伴隨著氧化還原應力增加,鍋爐管破裂之早期警告系統。 In another embodiment, @T ORP is measured across any pump to detect corrosion or failure of the pump or seal. In another embodiment, the method can be used to detect heat exchanger tube leaks because one active chemical can be transferred to the other side via a leak in the heat exchanger (eg, shell side to tube side or vice versa). Another example is the surface condenser cooling water leaking into the FW condensate hot well. In another embodiment, the method can be used to detect any undesired infestation of external active chemicals (ie, system contaminants). In an alternative embodiment, @T ORP can be used to form a "fingerprint" of a particular redox stressor in the system. In this way, it can be used as an early warning system for boiler tube rupture with increasing redox stress as the more boiler feed water is added to the system from time to time.

所量測或計算之ORP值可指示一或多個所選區域中之電化學活性物質之量。該種指示可在量測ORP之區域中直接可見或可在未直接量測ORP之另一區域中推斷出。在某些情況下,所量測或計算之ORP指示間接影響一或多個所選區域中之電化學活性物質之量的化學物之量。在更典型情況下,電化學活性物質直接影響所量測或計算之ORP。 The measured or calculated ORP value can indicate the amount of electrochemically active species in one or more selected regions. Such an indication may be directly visible in the region in which the ORP is measured or may be inferred in another region in which the ORP is not directly measured. In some cases, the measured or calculated ORP indicates the amount of chemical that indirectly affects the amount of electrochemically active species in one or more selected regions. In a more typical case, the electrochemically active material directly affects the measured or calculated ORP.

在一個具體實例中,方法包括在觸發事件後自所選區域中之一者向所選區域中之另一者勻變(ramping)。引起一或多個控制區中之即時ORP轉變或變化的任何事件可為觸發事件。熟習此項技術之人士將能夠分析該等選擇項且針對某一系統選擇一或多個觸發事件。舉例而言,使泵或系統之其他部分上線(或離線)可為觸發事件。由於下游用途改變(諸如在渦輪機驅動與其他較低壓力用途之間改變)所致的蒸汽壓力改變亦可選擇作為觸發事件。觸發亦可基於活化各種冷凝液流,此可在系統中引入特定氧化還原應激物。該等觸發事件可由探針、繼電器、監測器等偵測,而其餘可由一或多個控制區中之即時ORP改變偵測。此外,此等及其他事件之變化速率可決定自一個控制區向另一控制區之勻變速率,包括瞬時、定時、逐步或其他適合勻變模式。 In one specific example, the method includes ramping from one of the selected regions to the other of the selected regions after the triggering event. Any event that causes an immediate ORP transition or change in one or more control zones may be a triggering event. Those skilled in the art will be able to analyze the options and select one or more trigger events for a particular system. For example, bringing the pump or other parts of the system online (or offline) can be a triggering event. Steam pressure changes due to downstream usage changes, such as changes between turbine drive and other lower pressure applications, may also be selected as trigger events. Triggering can also be based on activating various condensate streams, which can introduce specific redox stressors into the system. The trigger events can be detected by probes, relays, monitors, etc., while the rest can be detected by immediate ORP changes in one or more control zones. In addition, the rate of change of these and other events may determine the rate of ramping from one control zone to another, including transient, timing, stepwise, or other suitable ramping modes.

代表性觸發事件亦可包括諸多定時操作或時間表或其他設施動力學。時間表可為固定啟動時間,繼而在一些系統操作中隨時間勻速上升。舉例而言,在引發FW流動後30分鐘,即時ORP應在所要ORP設定之100mV內。鍋爐滿負荷燃燒20分鐘後,即時ORP應勻速上升至ORP設定。勻變亦可在系統別處(諸如上游組件)已達到ORP設定時觸發。舉例而言,一旦上游控制區已達到其ORP設定(或在例如50mV內),啟動下游控制區或使其呈控制模式。即時ORP控制之該種工序為一種較佳觸發方法。 Representative trigger events can also include a number of timing operations or schedules or other facility dynamics. The schedule can be a fixed start-up time, and then rises at a constant rate over time in some system operations. For example, 30 minutes after the FW flow is initiated, the immediate ORP should be within 100 mV of the desired ORP setting. After the boiler is burned at full load for 20 minutes, the instant ORP should rise to the ORP setting at a constant rate. The ramp can also be triggered when the ORP setting has been reached elsewhere in the system (such as upstream components). For example, once the upstream control zone has reached its ORP setting (or within, for example, 50 mV), the downstream control zone is activated or brought into control mode. This process of instant ORP control is a preferred triggering method.

改變設施動力學亦可引發觸發及/或勻變。在一具體實例中,觸發事件可包括設施功率輸出改變。舉例而言,5%功率輸出降低可為引發系統之一或多個控制區中之即時ORP改變的觸發事件。用於引發即時 ORP改變之程序可為例如改變一或多個控制區之ORP設定的即時信號或逐漸勻變至新ORP設定。此程序可基於功率下降之速率或大小。此外,觸發及/或勻變機制可為多種信號及時間安排之複雜互連。 Changing the dynamics of the facility can also trigger triggering and/or ramping. In a specific example, the triggering event can include a facility power output change. For example, a 5% power output reduction can be a triggering event that triggers an immediate ORP change in one or more control zones of the system. Used to trigger instant The ORP change procedure can be, for example, changing the ORP setting of one or more control zones or gradually ramping to a new ORP setting. This procedure can be based on the rate or magnitude of power reduction. In addition, the triggering and/or ramping mechanism can be a complex interconnection of multiple signals and timings.

在一較佳具體實例中,FW化學之改變及調整包括向FW添加或自FW移除(在可能時)氧氣或其他氧化劑、除氧劑或其他還原劑、腐蝕抑制劑、腐蝕劑及/或其他活性化學物。根據定義,除氧劑為還原試劑,但並非所有還原劑必定為除氧劑。適用作除氧劑之還原試劑滿足在氧氣存在下存在反應放熱的熱力學要求。對於實際應用,在低溫下典型地需要合理活性。亦即,應存在一些有利的反應動力學。此外,對FW化學之其他改變及調整(諸如系統控制及腐蝕控制)可包括添加/移除其他氧化試劑(氧化劑)、其他還原試劑(還原劑)及/或其他活性或惰性化學物。 In a preferred embodiment, FW chemistry changes and adjustments include addition or removal of FW (if possible) from oxygen or other oxidants, oxygen scavengers or other reducing agents, corrosion inhibitors, corrosive agents, and/or other Active chemicals. By definition, oxygen scavengers are reducing agents, but not all reducing agents must be oxygen scavengers. The reducing agent suitable for use as an oxygen scavenger satisfies the thermodynamic requirements for the exothermic reaction in the presence of oxygen. For practical applications, reasonable activity is typically required at low temperatures. That is, there should be some favorable reaction kinetics. In addition, other changes and adjustments to FW chemistry, such as system control and corrosion control, may include the addition/removal of other oxidizing agents (oxidizing agents), other reducing agents (reducing agents), and/or other reactive or inert chemicals.

亦極需要還原試劑及其氧化產物不具腐蝕性且不形成在其於蒸汽產生裝備中形成時具腐蝕性之產物。典型地,某些除氧劑在某些pH範圍、溫度及壓力內最佳地起作用且亦以某種方式受催化影響。針對既定系統選擇適當除氧劑可基於本文所述之準則及熟習此項技術者之知識容易地確定。 It is also highly desirable that the reducing agent and its oxidation product are not corrosive and do not form a corrosive product when formed in steam generating equipment. Typically, certain oxygen scavengers function optimally in certain pH ranges, temperatures, and pressures and are also catalytically affected in some manner. Selection of an appropriate oxygen scavenger for a given system can be readily determined based on the criteria described herein and the knowledge of those skilled in the art.

較佳還原劑(亦即除氧劑)包括肼、亞硫酸鹽、亞硫酸氫鹽、碳醯肼、N,N-二乙基羥胺、氫醌、異抗壞血酸鹽或異抗壞血酸、甲基乙基酮肟、羥胺、羥丙二酸、乙氧喹、甲基四唑酮(methyltetrazone)、四甲基苯二胺、半卡脲、二乙基胺基乙醇、單乙醇胺、2-酮基葡糖酸鹽、抗壞血酸、硼氫化物、N-異丙基羥胺、五倍子酸、二羥基丙酮、鞣酸及其衍生物、食品級抗氧化劑、其類似物及任何組合。應瞭解任何活性化學物質可用於 本發明方法中。 Preferred reducing agents (ie, oxygen scavengers) include hydrazine, sulfite, bisulfite, carbonium, N,N-diethylhydroxylamine, hydroquinone, isoascorbate or isoascorbic acid, methyl ethyl Ketone oxime, hydroxylamine, hydroxymalonic acid, ethoxyquin, methyltetrazone, tetramethylphenylenediamine, hemicarbazide, diethylaminoethanol, monoethanolamine, 2-ketoglucose Acid salts, ascorbic acid, borohydrides, N-isopropylhydroxylamine, gallic acid, dihydroxyacetone, citric acid and its derivatives, food grade antioxidants, analogs thereof, and any combination. It should be understood that any active chemical can be used In the method of the invention.

代表性氧化劑包括氧氣、過氧化氫、有機(烷基及芳基)過氧化物及過酸、臭氧、醌、硝酸鹽及亞硝酸鹽之酸及鹼形式、其類似物及組合。 Representative oxidizing agents include oxygen, hydrogen peroxide, organic (alkyl and aryl) peroxides, and acid and base forms of peracids, ozone, hydrazine, nitrates and nitrites, analogs and combinations thereof.

代表性腐蝕劑(corrodant)包括無機酸(例如HCl、H2SO4、HNO3、H3PO4)及其鹽/衍生物;苛性鹼(例如Na、K、Li氫氧化物);氫氧化銨;螯合劑,諸如EDTA、NTA、HEDP;膦酸及聚膦酸;膦酸鹽;水可溶性及/或可分散性有機聚合物複合劑,諸如丙烯酸均聚物、共聚物及三元共聚物;丙烯醯胺;丙烯腈;甲基丙烯酸;苯乙烯磺酸;其類似物;及組合。 Representative corrodants include inorganic acids (eg, HCl, H 2 SO 4 , HNO 3 , H 3 PO 4 ) and salts/derivatives thereof; caustic (eg, Na, K, Li hydroxide); ammonium hydroxide Chelating agents such as EDTA, NTA, HEDP; phosphonic acid and polyphosphonic acid; phosphonates; water-soluble and/or dispersible organic polymer complexes such as acrylic acid homopolymers, copolymers and terpolymers; Acrylamide; acrylonitrile; methacrylic acid; styrenesulfonic acid; analogs thereof;

代表性腐蝕抑制劑包括磷酸鹽及聚磷酸鹽之鹼及胺鹽;中和胺;鉬酸鹽;鎢酸鹽;硼酸鹽;苯甲酸鹽;成膜抑制劑,諸如烷基、烯基及芳基聚胺及其衍生物;界面活性劑組成物,諸如美國專利第5,849,220號中所揭示者;寡聚膦基丁二酸化學物,諸如美國專利第5,023,000號中所揭示者;其類似物;及組合。 Representative corrosion inhibitors include bases and amine salts of phosphates and polyphosphates; neutralized amines; molybdates; tungstates; borates; benzoates; film-forming inhibitors such as alkyl, alkenyl and Aryl polyamines and derivatives thereof; surfactant compositions, such as those disclosed in U.S. Patent No. 5,849,220; oligophospho succinic acid chemistry, such as disclosed in U.S. Patent No. 5,023,000; ; and combination.

在本發明之另一具體實例中,自熱水系統移除一或多種化學物質。舉例而言,可經由膜法自主製程用水側流移除氧氣。任何適合膜可用於該種移除且熟習此項技術者將選擇適合膜及側流程序。氮氣或較低氧氣濃度載氣(或主製程用水側流)可存在於氣體可滲透膜之一側,且製程用水在膜之另一側。主製程用水側流中所存在之氧氣將自主製程用水側流擴散出以平衡其在膜兩端之分壓,由此隨後將降低主製程用水中之氧含量且降低ORP。在一具體實例中,可併入除氣器(參見例如圖1之組態) 或類似除氣製程以用逆流蒸汽(具有較低溶氧值)自主系統機械式移除或汽提不可冷凝之氣體(例如氧氣)。由此,主系統流之ORP由於其固有溶氧值之降低而降低。該種化學物質移除可在不向熱水系統中添加其他化學物質之情況下進行或結合該添加進行。 In another embodiment of the invention, one or more chemicals are removed from the hot water system. For example, oxygen can be removed by a membrane process autonomous process water sidestream. Any suitable membrane can be used for such removal and those skilled in the art will select suitable membrane and lateral flow procedures. Nitrogen or a lower oxygen concentration carrier gas (or main process water side stream) may be present on one side of the gas permeable membrane and the process water is on the other side of the membrane. The oxygen present in the main process water side stream diffuses the autonomous process water side stream to balance its partial pressure across the membrane, thereby subsequently reducing the oxygen content of the main process water and lowering the ORP. In a specific example, a degasser can be incorporated (see, for example, the configuration of Figure 1) Or a degassing process to mechanically remove or strip a non-condensable gas (eg, oxygen) with a countercurrent steam (having a lower dissolved oxygen value). Thus, the ORP of the main system flow is reduced due to a decrease in its inherent dissolved oxygen value. This chemical removal can be carried out without adding other chemicals to the hot water system or in combination with the addition.

在本發明之另一具體實例中,可單獨使用非化學技術或結合化學物添加/移除改變至少一個系統參數來調整或調適(conform)所量測之ORP。任一實際區域(或連接區域)之ORP可受ORP控制區上游之非化學物添加技術影響。代表性非化學技術及系統參數包括例如選擇特定類型之饋料泵或冷凝泵;分配系統製程流之流量;摻合或組合流;選擇熱水系統各個部分之構造材料以控制氧化速率;陰極保護;電磁波產生;物理特性改變;其類似物;及其組合。 In another embodiment of the invention, the non-chemical technique or combination of chemical addition/removal can be used to modify or conform to the measured ORP by changing at least one system parameter. The ORP of any actual zone (or junction zone) can be affected by non-chemical addition techniques upstream of the ORP control zone. Representative non-chemical techniques and system parameters include, for example, selecting a particular type of feed pump or condensate pump; distributing system process flow; blending or combining streams; selecting materials for various portions of the hot water system to control oxidation rate; cathodic protection ; electromagnetic wave generation; physical property changes; analogs thereof; and combinations thereof.

上文可藉由參考以下實施例更好的理解,該等實施例欲用於說明之目的,且不欲以任何方式限制本發明之範疇或其應用。 The above is a better understanding of the embodiments, which are intended to be illustrative, and are not intended to limit the scope of the invention or its application.

實施例1 Example 1

圖1描繪簡化之3組件熱水系統。補給水流過「除氣器」、「FW泵」且流入「鍋爐」中。鍋爐又產生「有用蒸汽」,其用於各種下游製程中。在此實施例中,可在除氣器出口(在圖1中標記為「1」)或FW泵出口(在圖1中標記為「2」)監測/控制ORP。當氧化還原應力獨立地存在於除氣器及/或FW泵中時可即時對其作出反應。亦可向除氣器中、在除氣器後及/或在FW泵後饋送活性化學物質以實現更特定的腐蝕控制。 Figure 1 depicts a simplified 3-component hot water system. The makeup water flows through the "degasser" and "FW pump" and flows into the "boiler". The boiler also produces "useful steam," which is used in a variety of downstream processes. In this embodiment, the ORP can be monitored/controlled at the degasser outlet (labeled "1" in Figure 1) or the FW pump outlet (labeled "2" in Figure 1). When the redox stress is independently present in the deaerator and/or the FW pump, it can be reacted immediately. Active chemicals can also be fed to the degasser, after the degasser and/or after the FW pump to achieve more specific corrosion control.

實施例2 Example 2

圖2說明較複雜之鍋爐組態,其包括複數個給水泵、複數 個熱交換器及蒸汽產生器(亦即鍋爐)。在該種組態中,可使用任何數量(亦即一個、兩個或兩個以上)之冷凝器、熱交換器、泵、鍋爐、製程蒸汽應用等。在圖2中,流動給水在其向「使用製程蒸汽」區域1及2移動時以實線箭頭展示。冷凝蒸汽在其向可包括熱交換器之殼側的各個設施位置中饋送或直接返回冷凝區時以虛線箭頭展示。必要時,不滿足鍋爐給水之設施水規範的冷凝液可以鍋爐排水(blow down)形式排出系統。 Figure 2 illustrates a more complex boiler configuration that includes a plurality of feed pumps, plural Heat exchangers and steam generators (ie boilers). In this configuration, any number (i.e., one, two or more) of condensers, heat exchangers, pumps, boilers, process steam applications, and the like can be used. In Figure 2, the flowing feed water is shown by solid arrows as it moves toward the "Use Process Steam" zones 1 and 2. The condensed steam is shown with dashed arrows as it feeds or returns directly to the condensing zone at various facility locations that may include the shell side of the heat exchanger. If necessary, the condensate that does not meet the boiler feed water specification can be discharged from the boiler in the form of a blow down.

可監測/控制ORP之位置及/或活性化學物質之饋送位置的實例在圖2中標記為「22」。該種使用者控制之定位允許針對特定單元及/或單元群之局部腐蝕保護能力以及全面腐蝕保護。 An example of a position at which the ORP can be monitored/controlled and/or a feed position of the active chemical is labeled "22" in FIG. This user controlled positioning allows for localized corrosion protection and overall corrosion protection for specific units and/or groups of cells.

實施例3 Example 3

圖3描繪系統在不同溫度下之ORP設定如何不同。圖3中所示之溫度可表示例如不同設施或同一設施之不同操作保護區/控制區。在此實施例中,ORP設定為選自以標記為「較佳(Preferred)」、「較寬(Broader)」及「最寬(Broadest)」之垂直線展示的一系列範圍的ORP設定範圍。視設施裝備之複雜性(亦即操作限制)而定,可用ORP設定範圍或點可變化。亦即,一些設施能夠處理狹窄或較佳ORP設定範圍,而其他設施僅能夠處理較寬ORP設定範圍。 Figure 3 depicts how the ORP settings of the system differ at different temperatures. The temperatures shown in Figure 3 may represent, for example, different facilities or control zones/control zones of different facilities or the same facility. In this embodiment, the ORP is set to a range of ORP settings selected from a range of vertical lines labeled "Preferred," "Broader," and "Broadest." Depending on the complexity of the facility equipment (ie, operational constraints), the range or point at which the ORP can be set can vary. That is, some facilities are capable of handling narrow or better ORP setting ranges, while other facilities are only capable of handling a wide ORP setting range.

@T ORP數值將典型地針對具有0.1當量濃度氯化鉀填充溶液之外部壓力平衡的參考電極(在圖3中稱作「EPBRE」)記錄。第一180℉控制區可由置於給水之「熱交換器2」後(圖2)的@T ORP探針量測並控制,且可緊鄰給水之「冷凝器」後(圖2)向給水中饋送活性化學物質。 The @T ORP value will typically be recorded for a reference electrode (referred to as "EPBRE" in Figure 3) having an external pressure balance of 0.1 equivalent of potassium chloride fill solution. The first 180°F control zone can be measured and controlled by the @T ORP probe placed after the “heat exchanger 2” of the feed water (Fig. 2), and can be placed in the feed water immediately after the “condenser” of the feed water (Fig. 2). Feed the active chemical.

第二350℉控制區可由置於給水之「熱交換器3」後(圖2) 的@T ORP探針量測並控制,且可緊鄰給水之「熱交換器3」前(圖2)向給水中饋送活性化學物質。 The second 350°F control zone can be placed after the “heat exchanger 3” placed in the feed water (Figure 2). The @T ORP probe is measured and controlled, and the active chemical can be fed to the feed water immediately before the "heat exchanger 3" of the feed water (Fig. 2).

第三500℉控制區可由置於給水之「熱交換器4」後(圖2)的@T ORP探針量測並控制,且可緊鄰給水之「熱交換器4」前(圖2)向給水中饋送活性化學物質。 The third 500°F control zone can be measured and controlled by the @T ORP probe placed after the “heat exchanger 4” of the feed water (Fig. 2), and can be placed immediately before the “heat exchanger 4” of the feed water (Fig. 2). Feed the water with active chemicals.

實施例4 Example 4

此實施例說明在各個位置饋送多種氧化還原活性物質來控制單一位置之@T ORP,如圖4所示。將控制用@T ORP探針直接置於2號氧化還原活性物質之饋送位置的上游。使用@T ORP探針量測饋送2號氧化還原活性物質前的@T ORP。隨後轉換@T ORP探針以控制另一氧化還原活性物質(1號)的饋送,在單一@T ORP探針之上游饋送。應注意,當關閉2號氧化還原活性物質(其經手動控制)時,該缺失之作用快速地使設施水化學物滲透且由@T ORP探針感測到。控制器(在此實施例中,1號氧化還原活性物質之控制器為自動的)立即引發1號氧化還原活性物質之額外饋送以補給2號氧化還原活性物質之不足。 This example illustrates the application of multiple redox active species at various locations to control a single position of @T ORP, as shown in FIG. The control @T ORP probe was placed directly upstream of the feed position of the No. 2 redox active material. @T ORP before feeding No. 2 redox active was measured using the @T ORP probe. The @T ORP probe was then switched to control the feed of another redox active (No. 1), fed upstream of a single @T ORP probe. It should be noted that when the No. 2 redox active material was shut down (which was manually controlled), the effect of this deletion quickly penetrated the facility water chemistry and was sensed by the @T ORP probe. The controller (in this embodiment, the controller of the redox active material No. 1 is automatic) immediately initiates an additional feed of the redox active material No. 1 to replenish the deficiency of the redox active material No. 2.

1號氧化還原活性物質之受控饋送能夠達成且維持@T ORP設定,由此使此事件期間熱交換器中之腐蝕最小。請注意,在重新手動開啟2號氧化還原活性物質時,腐蝕控制裝置(亦即@T ORP探針系統)立即藉由切斷1號氧化還原活性物質之饋送來均衡以維持用於腐蝕控制之所要@T ORP設定。 The controlled feeding of the redox active material No. 1 was able to achieve and maintain the @T ORP setting, thereby minimizing corrosion in the heat exchanger during this event. Please note that when re-opening the No. 2 redox active material manually, the corrosion control device (ie, the @T ORP probe system) is immediately balanced by cutting off the feed of the redox active material No. 1 to maintain corrosion control. Want @T ORP settings.

實施例5 Example 5

此實施例說明@T ORPTM探針對直接量測腐蝕事件之不可 預測反應及即時ORP量測值如何充當熱水系統中由氧化還原應力事件引起之腐蝕的直接指示物。 This example illustrates @T ORP TM probes unpredictable amount of direct and immediate reaction measured ORP value measured event of corrosion in hot water systems to act as what was caused directly indicative of the event redox stress corrosion.

@T ORP探針對FW中腐蝕產物之形成作出反應。FW中之氧化還原應力包括複共軛離子腐蝕對,如例如Fe2+/Fe3+或Cu+/Cu2+。在基於全鐵之FW加熱器中,高DO(亦即大於500ppb)水開始進入FW加熱器。最初,加熱器入口處之室溫ORP及即時ORP分別為-125mV及-280mV。在經歷額外的氧化還原應力事件時,加熱器入口處之室溫ORP及即時ORP分別升至-70mV及-30mV。與室溫ORP探針(僅增加55mV)比較,@T ORP探針之靈敏性(即時ORP增加250mV)顯而易見。最初,FW加熱器出口處之即時及室溫ORP探針分別為-540mV及-280mV。高氧化還原應力事件後,FW加熱器出口處之即時及室溫ORP探針分別變為-140mV及-280mV。重要的是要注意即時ORP升高400mV而室溫ORP展示無變化。 The @T ORP probe reacts to the formation of corrosion products in the FW. The redox stress in the FW includes a complex conjugated ion corrosion pair such as, for example, Fe 2+ /Fe 3+ or Cu + /Cu 2+ . In a full iron based FW heater, high DO (i.e., greater than 500 ppb) water begins to enter the FW heater. Initially, the room temperature ORP and the immediate ORP at the heater inlet were -125 mV and -280 mV, respectively. At the time of the additional redox stress event, the room temperature ORP and the immediate ORP at the heater inlet rose to -70 mV and -30 mV, respectively. The sensitivity of the @T ORP probe (instant ORP increased by 250 mV) was evident compared to the room temperature ORP probe (only 55 mV added). Initially, the immediate and room temperature ORP probes at the FW heater outlet were -540 mV and -280 mV, respectively. Immediately after the high redox stress event, the immediate and room temperature ORP probes at the FW heater exit were -140mV and -280mV, respectively. It is important to note that the immediate ORP is increased by 400 mV and the room temperature ORP shows no change.

不欲受限於任何特定理論;然而,關於FW加熱器出口處之室溫ORP量測值展示無變化之一個理論為在FW加熱器之入口處,在整個DO進入事件中,離開FW加熱器之DO保持不變。FW加熱器出口處之即時ORP數值如此顯著地升高的原因很可能歸因於FW加熱器自身中發生之腐蝕。此事件引起離子型氧化鐵物質之大量供應,@T ORP探針能偵測到該等物質而室溫ORP探針不能。 It is not intended to be limited to any particular theory; however, one theory that the room temperature ORP measurement at the exit of the FW heater exhibits no change is at the inlet of the FW heater, leaving the FW heater throughout the DO entry event. The DO remains the same. The reason why the instantaneous ORP value at the FW heater outlet is so significantly increased is likely to be attributed to corrosion occurring in the FW heater itself. This event caused a large supply of ionic iron oxide species that could be detected by the @T ORP probe and the room temperature ORP probe could not.

對於基於銅之FW加熱器可見相同作用,其中FW加熱器內之溶氧被耗盡。再次,在FW加熱器之出口處,室溫ORP量測值展示無變化,而@T ORP探針反應展示當經氧化之銅離子物質(共軛對)經釋放至FW中且離開FW加熱器時,數值升高,此僅由@T ORP探針感測到且不能 由室溫ORP儀器感測到。 The same effect can be seen for a copper based FW heater where the dissolved oxygen in the FW heater is depleted. Again, at the exit of the FW heater, the room temperature ORP measurement shows no change, while the @T ORP probe reaction shows that when the oxidized copper ionic species (conjugated pair) is released into the FW and leaves the FW heater When the value increases, this is only sensed by the @T ORP probe and cannot Sensed by a room temperature ORP instrument.

實施例6-非化學技術 Example 6 - Non-chemical technology

以下段落提供可用來控制熱水系統中之所量測之ORP的改變系統參數之非化學技術的數個實施例。熟習此項技術者將能夠使用此等技術而無需過度實驗。 The following paragraphs provide several examples of non-chemical techniques that can be used to control the changing system parameters of the measured ORP in a hot water system. Those skilled in the art will be able to use these techniques without undue experimentation.

泵選擇:眾所皆知,泵可為空氣進入(通常具有非所需影響)之不良執行者且可增加系統之氧化還原應力。視需要該種進入或相反地需要對其進行去除而定,饋料泵或冷凝泵類型之選擇會相當顯著地影響ORP量測值。舉例而言,泵設計參數(諸如活塞填料、止回閥、隔膜、密封件、密封管、葉輪等)均為可能發生故障及空氣進入之區域。在泵送之吸入階段,典型地在泵之較低壓力側發生空氣進入。 Pump Selection: As is well known, pumps can be poor performers of air entry (usually with undesired effects) and can increase the redox stress of the system. Depending on whether such entry or vice versa is required to be removed, the choice of feed pump or condensate pump type can significantly affect the ORP measurement. For example, pump design parameters (such as piston packing, check valves, diaphragms, seals, seals, impellers, etc.) are areas where failure and air ingress can occur. During the suction phase of pumping, air ingress typically occurs on the lower pressure side of the pump.

分配:流體流量及數量可經恰當地分配以使得一些或部分系統流量經由側流分流至數件設備中,此可影響固有ORP,且將其返回至主系統流。舉例而言,可使用電化學電離製程來影響其化學特性且由此影響側流中之ORP特性。 Allocation: Fluid flow and quantity may be properly distributed such that some or part of the system flow is split into several pieces of equipment via a side stream, which may affect the intrinsic ORP and return it to the main system stream. For example, an electrochemical ionization process can be used to affect its chemical properties and thereby affect the ORP characteristics in the lateral flow.

摻合:具有不同ORP特性之系統或製程流可以已知/受控/計算之比率摻合在一起以影響ORP且由此影響下游系統之腐蝕。 Blending: Systems or process streams with different ORP characteristics can be blended together at known/controlled/calculated ratios to affect the ORP and thereby affect the corrosion of downstream systems.

材料:由會影響ORP及腐蝕特性之不同材料製成的系統的各別區段可以特定組合併入並使用以達成熱水系統之適宜ORP。舉例而言,對溶氧具有大親和性以藉由在受控速率下氧化來局部降低製程用水中之溶氧值的材料(例如可有效氧化之任何材料,諸如鋁、鉻、其類似物及其組合,及甚至更具反應性之鋰、鈉、鎂、鋅、其類似物及其組合)。在該 製程之稍後時段,水則將具有較低之ORP值及降低之腐蝕其他材料之傾向,於是該等材料將得到更好的保護。此有點類似於陽極保護,但在此情況下,裝備之整個區域或整件裝備可能為陽極區以保護後續區域免受腐蝕力。將一或多種影響ORP之物質(例如一件硬體或系統組件)添加在需要特定ORP數值以達成腐蝕保護的後續區域的上游。儘管該件硬體一般被認為是金屬,但其並非必需為金屬。舉例而言,活性碳可經證明為有效的化學性質改變物質且由此亦為ORP改變物質。 Materials: Individual sections of a system made of different materials that affect ORP and corrosion characteristics can be incorporated and used in specific combinations to achieve a suitable ORP for the hot water system. For example, a material that has a large affinity for dissolved oxygen to locally reduce the dissolved oxygen value in the process water by oxidation at a controlled rate (eg, any material that can be effectively oxidized, such as aluminum, chromium, its analogs, and Combinations thereof, and even more reactive lithium, sodium, magnesium, zinc, analogs thereof, and combinations thereof). In the At a later time in the process, water will have a lower ORP value and a lower tendency to corrode other materials, so that the materials will be better protected. This is somewhat similar to anode protection, but in this case, the entire area of the equipment or the entire piece of equipment may be the anode area to protect the subsequent area from corrosive forces. One or more substances that affect the ORP (eg, a piece of hardware or system components) are added upstream of a subsequent area that requires a specific ORP value to achieve corrosion protection. Although the piece of hardware is generally considered to be a metal, it is not necessarily a metal. For example, activated carbon can be proven to be an effective chemically modifying substance and thus also an ORP altering substance.

陰極保護:可使用類似於陰極保護之外加電流來改變ORP空間,由此接觸製程用水之裝備區段或區域可得以陰極保護。在一種極端情況下,陰極保護可在足夠高之外加電化學電壓下操作以引入化學性質改變物質,如氫氣。氫氣隨後將處於且具有本身較低之ORP值且可局部(或在下游)與氧氣組合以降低所量測之ORP值。 Cathodic protection: An ORP space can be changed using a current similar to cathodic protection, whereby the equipment section or area that contacts the process water can be cathodically protected. In an extreme case, the cathodic protection can be operated at a sufficiently high level plus an electrochemical voltage to introduce a chemically modifying substance, such as hydrogen. The hydrogen will then be at and have a lower ORP value and can be combined locally (or downstream) with oxygen to reduce the measured ORP value.

電磁波:數件設備可處於電磁波產生(諸如光源、紫外線添加、誘導微波之波、其類似物及其組合)之區域中。電磁波來源可為連續或間歇的,諸如以受控方式、脈衝方式等。可使用波源經由其特定作用直接或間接影響任何區域中之ORP物質。舉例而言,UV光可活化水中之氧氣與亞硫酸鹽之間的鈷催化反應。 Electromagnetic waves: Several pieces of equipment can be in the area of electromagnetic wave generation (such as light sources, ultraviolet light addition, waves that induce microwaves, their analogs, and combinations thereof). The electromagnetic wave source can be continuous or intermittent, such as in a controlled manner, pulsed, or the like. The wave source can be used to directly or indirectly affect the ORP species in any region via its specific action. For example, UV light can activate a cobalt-catalyzed reaction between oxygen and sulfite in water.

物理特性:物理特性(例如溫度、壓力、流量、渦流及其類似特性)之有目的及局部變化可經設計以局部影響系統ORP且由此影響所產生之腐蝕性。 Physical Properties: The purposeful and local variations of physical properties (such as temperature, pressure, flow, eddy current, and the like) can be designed to locally affect the system ORP and thereby affect the resulting corrosivity.

本文所揭示並主張之所有組成物及方法可根據本發明產生並執行而無需過度實驗。雖然本發明可以多種不同形式實施,但本文詳細 描述本發明之特定較佳具體實例。本案為本發明原理之範例且並非意欲將本發明限於所說明之特定具體實例。另外,除非相反地明確說明,否則使用術語「一(a)」意欲包括「至少一(at least one)」或「一或多(one or more)」。舉例而言,「一個裝置(a device)」意欲包括「至少一個裝置(at least one device)」或「一或多個裝置(one or more device)」。 All of the compositions and methods disclosed and claimed herein can be made and executed in accordance with the present invention without undue experimentation. Although the invention can be implemented in many different forms, the details herein Specific preferred embodiments of the invention are described. The present invention is an example of the principles of the invention and is not intended to limit the invention to the particular embodiments illustrated. In addition, the term "a" is intended to include "at least one" or "one or more" unless explicitly stated to the contrary. For example, "a device" is intended to include "at least one device" or "one or more device."

以絕對術語或近似術語提供之任何範圍意欲涵蓋此兩種情況,且本文所用之任何定義意欲為闡明且非限制目的。儘管闡述本發明之廣泛範疇之數值範圍及參數為近似值,但在特定實施例中闡述之數值儘可能精確地報導。然而,任何數值固有地含有必然地源於在其各別測試量測值中發現之標準偏差的某些誤差。此外,本文中揭示之所有範圍應理解為涵蓋其中所包含之任何及所有子範圍(包括所有分數及整數值)。 Any range provided in absolute or approximate terms is intended to cover both, and any definitions used herein are intended to be illustrative and not limiting. Notwithstanding that the numerical ranges and parameters set forth in the broad scope of the invention are approximations, the values set forth in the particular embodiments are reported as accurately as possible. Any numerical value, however, inherently contains certain errors that are necessarily derived from the standard deviation found in its respective test measurement. In addition, all ranges disclosed herein are to be understood as encompassing any and all sub-ranges (including all the

此外,本發明涵蓋本文所述之一些或所有各種具體實例的任何及所有可能組合。本申請案中所引用的任何及所有專利、專利申請案、科學論文及其他參考文獻以及其中所引用的任何參考文獻以全文引用的方式併入本文中。亦應瞭解,本文所述之本發明較佳具體實例之各種變化及修改對熟習此項技術者將顯而易見。該等變化及修改可在不背離本發明之精神及範疇且不減小其預期優勢的情況下進行。因此,預期該等變化及修改由隨附申請專利範圍所涵蓋。 Furthermore, the invention encompasses any and all possible combinations of some or all of the various embodiments described herein. Any and all patents, patent applications, scientific papers, and other references cited in the present application, as well as any references cited therein, are hereby incorporated by reference in their entirety. It will also be apparent that various changes and modifications of the preferred embodiments of the invention described herein will be apparent. Such changes and modifications can be made without departing from the spirit and scope of the invention and without reducing its intended advantages. Accordingly, it is contemplated that such changes and modifications are covered by the scope of the accompanying claims.

1‧‧‧除氣器出口 1‧‧‧ degasser outlet

2‧‧‧FW泵出口 2‧‧‧FW pump outlet

Claims (24)

一種在熱水系統中控制即時氧化還原電位(「ORP」)以在該熱水系統中降低腐蝕之方法,該方法包含:(a)在該熱水系統中指定一或多個操作保護區(「區(zone)」或「區(zones)」);(b)選擇該等指定區域中之至少兩者,其中該等所選區域中之至少兩者包括至少一個可操作以量測該即時ORP且與控制器通信的ORP探針;(c)當該熱水系統處於操作溫度及壓力下時在該等所選區域中之一或多者中間歇或連續地量測該即時ORP;(d)將該所量測之即時ORP傳輸至該控制器;(e)評定該所量測之即時ORP或基於該所量測之即時ORP之計算之ORP是否符合ORP設定,其中對於該等所選區域中之每一者,該ORP設定為相同ORP設定,或對於該等所選區域中之至少兩者,為不同ORP設定;(f)若該所量測之即時ORP或該計算之ORP不符合該ORP設定,則執行以下操作中之至少一者:(i)向該熱水系統中饋送有效量之一或多種活性化學物質,(ii)自該熱水系統移除有效量之一或多種活性化學物質,及(iii)改變系統參數;及(g)在觸發事件後視情況自該等所選區域中之一者向該等所選區域中之另一者勻變(ramping)。 A method of controlling an immediate oxidation reduction potential ("ORP") in a hot water system to reduce corrosion in the hot water system, the method comprising: (a) designating one or more operational protection zones in the hot water system ( "zone" or "zones"; (b) selecting at least two of the designated zones, wherein at least two of the selected zones include at least one operable to measure the instant ORP probe in ORP and in communication with the controller; (c) intermittently or continuously measuring the instantaneous ORP in one or more of the selected regions when the hot water system is at operating temperature and pressure; d) transmitting the measured instant ORP to the controller; (e) assessing whether the measured instant ORP or the calculated ORP based on the measured immediate ORP meets the ORP setting, wherein for the For each of the selected regions, the ORP is set to the same ORP setting, or for different ORP settings for at least two of the selected regions; (f) if the measured immediate ORP or the calculated ORP If the ORP setting is not met, at least one of the following operations is performed: (i) feeding an effective amount to the hot water system One or more active chemicals, (ii) removing an effective amount of one or more active chemicals from the hot water system, and (iii) changing system parameters; and (g) selecting from the event after the trigger event One of the regions ramps to the other of the selected regions. 如申請專利範圍第1項之方法,其中該ORP探針包括溫度偵測器、貴金屬電極及參考電極。 The method of claim 1, wherein the ORP probe comprises a temperature detector, a noble metal electrode, and a reference electrode. 如申請專利範圍第1項之方法,其中該觸發事件基於時間表。 The method of claim 1, wherein the triggering event is based on a timetable. 如申請專利範圍第1項之方法,其中該等所選區域中之至少一者呈監測及/或報警模式,且至少一個其他所選區域呈控制模式。 The method of claim 1, wherein at least one of the selected regions is in a monitoring and/or alarm mode and at least one other selected region is in a control mode. 如申請專利範圍第4項之方法,其中該等所選區域中之至少一者能夠在該監測及/或報警模式與該控制模式之間手動或自動地轉換。 The method of claim 4, wherein at least one of the selected regions is capable of being manually or automatically switched between the monitoring and/or alarm mode and the control mode. 如申請專利範圍第1項之方法,其中該ORP設定隨時間變化。 The method of claim 1, wherein the ORP setting changes over time. 如申請專利範圍第1項之方法,其包括確定對應於第一所選區域之第一ORP設定,及視情況確定對應於其他所選區域之其他ORP設定。 A method of claim 1, wherein the method comprises determining a first ORP setting corresponding to the first selected region, and optionally determining other ORP settings corresponding to the other selected regions. 如申請專利範圍第7項之方法,其包括獨立地確定該第一ORP設定及/或獨立地確定對應於各其他所選區域之各其他ORP設定。 The method of claim 7, comprising independently determining the first ORP setting and/or independently determining each of the other ORP settings corresponding to each of the other selected regions. 如申請專利範圍第1項之方法,其包括基於該熱水系統之操作限制獨立地確定各所選區域之ORP設定。 The method of claim 1, which comprises independently determining an ORP setting for each selected region based on operational limits of the hot water system. 如申請專利範圍第1項之方法,其中該ORP設定選自由以下組成之群:選自一或多個單一值之ORP設定點及選自一或多個值範圍之ORP設定範圍。 The method of claim 1, wherein the ORP setting is selected from the group consisting of: an ORP set point selected from one or more single values and an ORP setting range selected from one or more range of values. 如申請專利範圍第1項之方法,其包括在第一所選區域中量測第一即時ORP,及若該第一所量測之即時ORP或基於該第一所量測之即時ORP之第一計算之ORP不符合該第一所選區域之該ORP設定,則對該第一所選區域執行該等操作中之至少一者;及/或量測該第一即時ORP,及若該第一所量測之即時ORP或該第一計算之ORP不符合該第一所選區域之該ORP設定,則在一或多個其他所選區域中執行該等操作中之一者;及/或在該等所選區域中之一或多者中量測一或多個即時ORP,及基於該等所量測之即時ORP中之一或多者計算一或多個其他所選區域之一或多個其他即時 ORP。 The method of claim 1, comprising measuring the first instant ORP in the first selected region, and if the first measured instantaneous ORP or based on the first measured instantaneous ORP If the calculated ORP does not meet the ORP setting of the first selected region, performing at least one of the operations on the first selected region; and/or measuring the first immediate ORP, and if the first One of the measured immediate ORPs or the first calculated ORP does not conform to the ORP setting of the first selected region, and one of the operations is performed in one or more other selected regions; and/or Measuring one or more immediate ORPs in one or more of the selected regions, and calculating one or more other selected regions based on one or more of the measured instantaneous ORPs or Multiple other instants ORP. 如申請專利範圍第1項之方法,其中該所量測之即時ORP或該計算之ORP指示該各別所選區域或另一所選區域中之電化學活性物質之量;及/或其中該所量測之即時ORP或該計算之ORP指示間接影響該各別所選區域或另一所選區域中之電化學活性物質之量的化學物之量。 The method of claim 1, wherein the measured immediate ORP or the calculated ORP indicates an amount of electrochemically active material in the respective selected region or another selected region; and/or wherein The measured immediate ORP or the calculated ORP indicates the amount of chemical that indirectly affects the amount of electrochemically active species in the respective selected zone or another selected zone. 如申請專利範圍第12項之方法,其中該電化學活性物質直接影響該即時ORP。 The method of claim 12, wherein the electrochemically active substance directly affects the immediate ORP. 如申請專利範圍第1項之方法,其包括自動及/或手動地執行該等操作中之至少一者。 The method of claim 1, wherein the method comprises performing at least one of the operations automatically and/or manually. 如申請專利範圍第1項之方法,其中該等活性化學物質選自由以下組成之群:氧化劑、還原劑、腐蝕抑制劑、腐蝕劑及其組合。 The method of claim 1, wherein the active chemical is selected from the group consisting of an oxidizing agent, a reducing agent, a corrosion inhibitor, an etchant, and combinations thereof. 如申請專利範圍第1項之方法,其包括經由網路操作該方法。 The method of claim 1, wherein the method comprises operating the method via a network. 如申請專利範圍第16項之方法,其中該網路為網際網路。 For example, the method of claim 16 wherein the network is an internet. 一種數位儲存媒體,其上儲存有電腦可執行指令,該等指令可操作以執行如申請專利範圍第1項之方法。 A digital storage medium having stored thereon computer executable instructions operable to perform the method of claim 1 of the patent application. 如申請專利範圍第1項之方法,其中該熱水系統選自由以下組成之群:化石燃料燃燒之水管或火管鍋爐;熱水加熱器;熱交換器;蒸汽發生器;核動力電氣系統,包括輕水反應器、加壓水反應器及沸水反應器;船用單元;燃燒引擎及柴油冷卻劑系統;蒸發器系統;熱去鹽系統;蒸發器系統;造紙操作,包括制漿製程及漂白製程;晶圓拋光及平坦化製程;燃燒氣體排放;醱酵製程;地熱製程;水性有機氧化還原合成;聚合製程;蒸汽噴射裝備;處理操作;及與其附接之輔助裝置。 The method of claim 1, wherein the hot water system is selected from the group consisting of a water or fire tube boiler for burning fossil fuels; a hot water heater; a heat exchanger; a steam generator; a nuclear power electrical system, Including light water reactor, pressurized water reactor and boiling water reactor; marine unit; combustion engine and diesel coolant system; evaporator system; thermal desalination system; evaporator system; papermaking operation, including pulping process and bleaching process Wafer polishing and planarization process; combustion gas emission; fermentation process; geothermal process; aqueous organic redox synthesis; polymerization process; steam injection equipment; processing operation; and auxiliary devices attached thereto. 如申請專利範圍第1項之方法,其包括自該熱水系統移除有效量之氧氣。 A method of claim 1, wherein the method comprises removing an effective amount of oxygen from the hot water system. 如申請專利範圍第20項之方法,其進一步包含使用氣體可滲透膜來移除該氧氣。 The method of claim 20, further comprising using a gas permeable membrane to remove the oxygen. 如申請專利範圍第20項之方法,其進一步包含使用除氣器來移除該氧氣。 The method of claim 20, further comprising using a degasser to remove the oxygen. 如申請專利範圍第1項之方法,其中改變系統參數包含選擇以下操作中之至少一者:選擇特定化學物饋料泵設計;選擇特定冷凝泵設計;分配流體流量及數量;以受控比率摻合具有不同ORP特性之系統或製程流;基於對溶氧之親和性選擇操作保護區之構造材料;外加電流以提供陰極保護;引入電磁波;調整物理特性;及其組合。 The method of claim 1, wherein changing the system parameters comprises selecting at least one of: selecting a particular chemical feed pump design; selecting a particular condensate pump design; distributing fluid flow and quantity; blending at a controlled ratio System or process flow with different ORP characteristics; construction material for operating the protection zone based on affinity for dissolved oxygen; application of current to provide cathodic protection; introduction of electromagnetic waves; adjustment of physical properties; 一種用於熱水系統之腐蝕控制裝置,其可操作以實施如申請專利範圍第1項之方法,該熱水系統具有複數個操作保護區(「區(zone)」或區「(zones)」),其中該等區域中之至少兩者為所選區域,該裝置包含:接收器,其與一或多個氧化還原電位(「ORP」)探針通信,其中啟動(activated)一小組該等ORP探針,各經啟動之ORP探針可操作以在操作溫度及壓力下量測即時ORP,且該等所選區域中之至少兩者包括該等ORP探針中之至少一者;處理器,其可操作以判讀自各經啟動之ORP探針傳達至該接收器之該所量測之即時ORP,其中該處理器直接判讀該所量測之即時ORP或判讀基於該所量測之即時ORP之計算之ORP;及傳輸器,其與饋料裝置通信,該饋料裝置可操作以管理向該熱水系統 中引入一或多種活性化學物質以影響該即時ORP之變化,其中若該所判讀之即時ORP不符合ORP設定,則該處理器可操作以經由該傳輸器向該饋料裝置發送輸出信號。 A corrosion control apparatus for a hot water system operable to implement the method of claim 1, wherein the hot water system has a plurality of operational protection zones ("zones" or "zones" And wherein at least two of the regions are selected regions, the device comprising: a receiver in communication with one or more redox potential ("ORP") probes, wherein a group is activated An ORP probe, each activated ORP probe operable to measure an immediate ORP at an operating temperature and pressure, and at least two of the selected regions comprise at least one of the ORP probes; Operative to interpret the measured instant ORP transmitted from the activated ORP probe to the receiver, wherein the processor directly interprets the measured instant ORP or interprets the measured immediate ORP based on the measured a calculated ORP; and a transmitter in communication with the feed device, the feed device operable to manage the hot water system One or more active chemicals are introduced to affect the change in the immediate ORP, wherein if the interpreted immediate ORP does not meet the ORP setting, the processor is operative to transmit an output signal to the feeder via the transmitter.
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