TW201416938A - Apparatus and method for manufacturing electrode film - Google Patents
Apparatus and method for manufacturing electrode film Download PDFInfo
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- TW201416938A TW201416938A TW102135010A TW102135010A TW201416938A TW 201416938 A TW201416938 A TW 201416938A TW 102135010 A TW102135010 A TW 102135010A TW 102135010 A TW102135010 A TW 102135010A TW 201416938 A TW201416938 A TW 201416938A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Physics & Mathematics (AREA)
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- Manufacturing Of Printed Wiring (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
本發明係關於一種製造電極膜裝置與其方法,尤指一種製造供觸控螢幕使用的電極膜之裝置與方法。 The present invention relates to an electrode film device and a method thereof, and more particularly to an apparatus and method for manufacturing an electrode film for use in a touch screen.
一種觸控螢幕裝置其定義為一種輸入裝置,該觸控螢幕裝置會檢測在一顯示螢幕上一用戶的一接觸位置,以執行一電子設備的整體控制,包括控制一個顯示器的螢幕。 A touch screen device is defined as an input device that detects a contact position of a user on a display screen to perform overall control of an electronic device, including controlling a screen of a display.
觸控螢幕裝置包括電阻式、電容式、超聲波式,光(紅外線)傳感器類型,和一個電磁感應型和信號放大型,在設計上其困難度的水準之差別和加工技術皆是多樣化的,且取決於觸控螢幕裝置的操作方法。因此,可以選擇一種現有的觸控螢幕裝置來研究,以便開發更好的產品。具體地說明,除了光學特性、機械特性、環境特性、與輸入屬性,操作方法是可以考慮耐久性和經濟可行性來選擇的。 Touch screen devices include resistive, capacitive, ultrasonic, optical (infrared) sensor types, and an electromagnetic induction type and signal amplification type, which are diverse in design difficulty and processing techniques. And depending on how the touch screen device is operated. Therefore, an existing touch screen device can be selected for research to develop a better product. Specifically, in addition to optical properties, mechanical properties, environmental characteristics, and input properties, the method of operation can be selected in consideration of durability and economic feasibility.
在觸控螢幕面板的製造過程中,光蝕刻法和絲網印刷法是用來形成一感應器,該感應器是以一銦錫氧化物透明電極和相關的佈線技術製成。然而,在光蝕刻法中,該過程是複雜的,且製造成本會因為光蝕刻而增加。以絲網印刷法而言,是難以精確地控制該過程,使得它難以在銦錫氧化物和外週電極部分之間保持精準的公差,並且,因為絲網印刷法印刷的線寬是非常微小的,因而使得大量的死角無法形成電 極,且因為高溫乾燥過程所致,會在銦錫氧化物之微小線寬部分會生成一個裂縫。於是,造成生產效率的降低。 In the manufacture of touch screen panels, photolithography and screen printing are used to form an inductor made of an indium tin oxide transparent electrode and associated wiring techniques. However, in photolithography, the process is complicated and manufacturing costs are increased by photolithography. In the case of screen printing, it is difficult to precisely control the process, making it difficult to maintain precise tolerance between indium tin oxide and peripheral electrode portions, and because the line width of screen printing is very small So that a large number of dead ends can not form electricity Extremely, and because of the high temperature drying process, a crack will be formed in the tiny line width portion of indium tin oxide. As a result, production efficiency is reduced.
本發明之一目的即在於提供一種製造電極膜裝置與方法,該膜具有一以壓印法製成的微小凹版圖案,且環繞於一輥,以裝載一導電材料,該導電材料具有開口面積增加的凹版圖案。 It is an object of the present invention to provide an electrode film apparatus and method having a micro intaglio pattern formed by imprinting and surrounding a roll for loading a conductive material having an increased open area. Gravure pattern.
本發明之另一目的即在於提供一種製造電極膜裝置與方法,係利用一輥到輥填充法同時形成一微小感應器與一架線線路。 Another object of the present invention is to provide an electrode film apparatus and method for simultaneously forming a minute inductor and a wire line by a roll-to-roll filling method.
本發明之一種製造電極膜裝置之實施例包括:一第一支撐輥,該第一支撐輥之部分接觸一基片,該基片上形成有一凹版圖案,且增加該凹版圖案之一開口之一面積;一電極材料塗佈單元,係於該基片上將一電極材料主要填充於凹版圖案,凹版圖案具有加大的該開口之該面積;一電極材料刮除單元,係可接觸基片以刮除塗佈於基片上的電極材料,再將刮除的電極材料二次填充於凹版圖案,凹版圖案具有加大的開口之面積;一硬化單元,係硬化填充於凹版圖案內的電極材料;及一清潔單元,係移除殘留於基片之一表面上且已經硬化的電極材料。 An embodiment of the present invention for manufacturing an electrode film device includes: a first support roller, a portion of the first support roller contacting a substrate, an intaglio pattern is formed on the substrate, and an area of one of the openings of the intaglio pattern is increased An electrode material coating unit is characterized in that an electrode material is mainly filled in the gravure pattern on the substrate, the gravure pattern has an enlarged area of the opening; an electrode material scraping unit can contact the substrate to scrape off An electrode material coated on the substrate, and then the scraped electrode material is secondarily filled in the gravure pattern, the gravure pattern has an enlarged opening area; a hardening unit hardens the electrode material filled in the intaglio pattern; and The cleaning unit removes the electrode material that has remained on the surface of one of the substrates and has hardened.
該電極材料刮除單元包括一刮刀,該刮刀係沿著該基片之一寬度方向與保持一預定的角度以施加一壓力於基片上。 The electrode material scraping unit includes a doctor blade that is held at a predetermined angle along a width direction of the substrate to apply a pressure to the substrate.
該電極材料刮除單元更包括一刮刀臂,以從垂直方向移動該刮刀。 The electrode material scraping unit further includes a scraper arm to move the scraper from a vertical direction.
該清潔單元包括:一清潔體,係接觸於該基片之該表面;一第一清潔輥與一第二清潔輥,係環繞於該清潔體之二 端;及一清潔導輥,係導引清潔體以與基片的表面進行緊密的接觸。 The cleaning unit comprises: a cleaning body contacting the surface of the substrate; a first cleaning roller and a second cleaning roller surrounding the cleaning body And a cleaning guide roller guiding the cleaning body to make close contact with the surface of the substrate.
該清潔體包括一清潔液,該清潔液係異丙醇和丙酮的混合溶液。 The cleaning body includes a cleaning liquid which is a mixed solution of isopropyl alcohol and acetone.
製造電極膜裝置更包括一第二支撐輥,係設置於該清潔導輥具有該基片之一側的相反側,且支撐被清潔導輥所施壓力的基片。 The electrode film assembly further includes a second support roller disposed on the opposite side of the cleaning guide roller having one side of the substrate and supporting the substrate pressed by the cleaning guide roller.
該硬化單元運用熱、熱風、紅外線、或近紅外光至已經填充於該凹版圖案內的該電極材料,進而硬化電極材料。 The hardening unit applies heat, hot air, infrared rays, or near-infrared light to the electrode material that has been filled in the intaglio pattern, thereby hardening the electrode material.
當該基片接觸該第一支撐輥,且第一支撐輥的外圓周是曲線的,該凹版圖案之該開口之該面積是增加的。 When the substrate contacts the first support roller and the outer circumference of the first support roller is curved, the area of the opening of the intaglio pattern is increased.
該凹版圖案之該開口之該面積的增加是依據該第一支撐輥的一直徑或一半徑的尺寸。 The increase in the area of the opening of the intaglio pattern is based on a diameter or a radius of the first support roll.
該第一支撐輥之一直徑係50mm或更大,與800mm或更小。 One of the first support rollers has a diameter of 50 mm or more and 800 mm or less.
該凹版圖案之該開口之該面積的增加是依據該基片的一厚度尺寸。 The increase in the area of the opening of the intaglio pattern is based on a thickness dimension of the substrate.
該基片之一厚度係200μm或更大,和800μm或更小。 One of the substrates has a thickness of 200 μm or more, and 800 μm or less.
本發明之一種製造電極膜的方法之實施例包括以下步驟:準備一基片,該基片上形成有一凹版圖案,且部分接觸一第一支撐輥,一電極材料被塗佈於基片上,以主要填充於該凹版圖案;及清除刮除被塗佈於該基片之電極材料,以使清除刮除的電極材料二次填充於凹版圖案內;其中,於該主要與第二次的填充時,且當基片接觸該第一支撐輥時,凹版圖案之一開口之一面積的增加係用以填充電極材料,而第一支撐輥的外圓周是呈曲線的。 An embodiment of the method of manufacturing an electrode film of the present invention comprises the steps of: preparing a substrate having an intaglio pattern formed thereon and partially contacting a first support roller, an electrode material being coated on the substrate to mainly Filling the gravure pattern; and removing and scraping the electrode material coated on the substrate to refill the scraped electrode material in the intaglio pattern; wherein, in the main and second filling, And when the substrate contacts the first support roller, an increase in the area of one of the openings of the intaglio pattern is used to fill the electrode material, and the outer circumference of the first support roller is curved.
該製造電極膜的方法更包括以下步驟:於第二次填充之後,硬化該已經填充入該凹版圖案之電極材料。 The method of manufacturing an electrode film further includes the step of hardening the electrode material that has been filled into the intaglio pattern after the second filling.
製造電極膜的方法更包括以下步驟:於硬化之後,移除殘留於該基片之一表面上的已硬化電極材料。 The method of manufacturing an electrode film further includes the step of removing the hardened electrode material remaining on one surface of the substrate after hardening.
依據本發明之一實施例,利用一自動輥到輥法以持續生產觸控螢幕面板,則生產率會增加。 According to an embodiment of the present invention, productivity is increased by utilizing an automatic roll-to-roll method to continuously produce a touch screen panel.
一具有一微小凹版圖案之膜係環繞於一輥,該環繞於該輥之凹版圖案其一開口之一面積是增加的,於是增進了填充率與耐久性。 A film having a micro-gravure pattern is wound around a roll, and the area of one of the openings of the intaglio pattern surrounding the roll is increased, thereby improving the filling rate and durability.
前面的概述僅是說明性的,而並非旨在以任何方式進行限制。除了說明性的方面,實施例和上面描述的特徵,與更進一步的實施例和特徵將因為參考圖式和下面的詳細說明而變得顯而易見。 The foregoing summary is illustrative only and is not intended to be limiting in any way. The embodiments and the features described above, as well as further embodiments and features will be apparent from the description and drawings.
S100~S400‧‧‧步驟 S100~S400‧‧‧Steps
a’‧‧‧改變線寬 a’‧‧‧Change line width
a‧‧‧初始線寬 A‧‧‧ initial line width
k‧‧‧預設門檻值 k‧‧‧Preset threshold
100‧‧‧基片 100‧‧‧ substrates
110‧‧‧透明基體 110‧‧‧Transparent substrate
120‧‧‧樹酯層 120‧‧‧ resin layer
122‧‧‧凹版圖案 122‧‧‧ gravure pattern
130‧‧‧電極層 130‧‧‧electrode layer
132‧‧‧電極材料 132‧‧‧Electrode materials
135‧‧‧殘渣 135‧‧‧residue
136‧‧‧銀 136‧‧‧Silver
137‧‧‧炭黑 137‧‧‧carbon black
140‧‧‧黑色層 140‧‧‧Black layer
200‧‧‧輥 200‧‧‧roll
300‧‧‧模子 300‧‧‧ mold
430‧‧‧電極材料塗佈單元 430‧‧‧Electrode material coating unit
440‧‧‧電極材料清除刮除單元 440‧‧‧Electrode material removal and scraping unit
442‧‧‧刮刀 442‧‧‧ scraper
444‧‧‧刮刀臂 444‧‧‧ scraper arm
450‧‧‧硬化單元 450‧‧‧hardening unit
460‧‧‧清潔單元 460‧‧‧ cleaning unit
460a‧‧‧第一清潔單元 460a‧‧‧First cleaning unit
460b‧‧‧第二清潔單元 460b‧‧‧Second cleaning unit
460c‧‧‧第三清潔單元 460c‧‧‧ third cleaning unit
462‧‧‧清潔體 462‧‧‧ Cleaning body
464‧‧‧清潔導輥 464‧‧‧Clean guide roller
466a‧‧‧第一清潔輥 466a‧‧‧First cleaning roller
466b‧‧‧第二清潔輥 466b‧‧‧Second cleaning roller
520‧‧‧第一輥 520‧‧‧First roll
530a‧‧‧第一導輥 530a‧‧‧First guide roller
530b‧‧‧第二導輥 530b‧‧‧Second guide roller
530c‧‧‧第三導輥 530c‧‧‧third guide roller
542‧‧‧第一支撐輥 542‧‧‧First support roller
544‧‧‧第二支撐輥 544‧‧‧Second support roller
544’‧‧‧第二支撐輥 544’‧‧‧second support roller
544”‧‧‧第二支撐輥 544"‧‧‧second support roller
550‧‧‧第二輥 550‧‧‧second roll
本發明包括附圖以提供對本發明概念之進一步了解,而且將附圖併入並組成說明書之一部份。圖式描述本發明之例示具體實施例,而且與說明一起用以解釋本發明之原理。在圖式中:圖1係本發明之一種製造電極膜的方法之一較佳實施例之流程圖;圖2A與圖2B係本發明之製造電極膜的方法之一較佳實施例之圖式;圖3A與圖3B係本發明之一較佳實施例之形成一凹版圖案之連續圖式;圖4A至圖4F係本發明之一較佳實施例之於一樹酯層上形成一凹版圖案之剖面圖式; 圖5係本發明之一較佳實施例之形成一電極層之剖面圖式;圖6係本發明之一較佳實施例之選擇性地移除一電極層之剖面圖式;圖7係本發明之一較佳實施例之形成一黑色層之剖面圖式;圖8係本發明之一較佳實施例之形成一電極層於一樹酯層的一凹版圖案之剖面圖式;圖9A與圖9B係本發明之一較佳實施例之一樹酯層之一凹版圖案之一開口的面積在增加之剖面圖式;圖10係本發明之一較佳實施例之一觸控螢幕面板製造裝置之一整體結構圖式;圖11A至圖11D係圖10之A、B、C、D之放大圖式;圖12A至圖12C係在一凹版圖案之底部連續層疊銀與炭黑之連續圖式;圖13係因一第二支撐輥之一直徑不夠大,一基片在一清潔體與該基片接觸之一點上未被該第二支撐輥所支撐之狀況圖式;圖14係當兩個或更多清潔單元設置於一基片之運送方向上肢另一較佳實施例圖式;圖15係一具有複數個構件套的案例圖式,該構件套包括一電極材料塗佈單元、一電極材料清除刮除單元、一硬化單元、及一清潔單元,係設置於一基片的一運送方向上;以及圖16係本發明之製造電極膜的方法之另一較佳實施例之流程圖。 The present invention includes the drawings to provide a further understanding of the concept of the invention, and the drawings are incorporated in and constitute a part of the specification. The drawings illustrate the exemplary embodiments of the invention and, BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a preferred embodiment of a method for fabricating an electrode film of the present invention; FIG. 2A and FIG. 2B are diagrams showing a preferred embodiment of a method for fabricating an electrode film of the present invention; 3A and 3B are successive views of a gravure pattern formed by a preferred embodiment of the present invention; and FIGS. 4A to 4F show a gravure pattern formed on a resin layer according to a preferred embodiment of the present invention. Sectional pattern 5 is a cross-sectional view showing an electrode layer formed in accordance with a preferred embodiment of the present invention; and FIG. 6 is a cross-sectional view showing a preferred embodiment of the present invention for selectively removing an electrode layer; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 8 is a cross-sectional view showing an intaglio pattern of an electrode layer on a resin layer in accordance with a preferred embodiment of the present invention; FIG. 9A and FIG. 9B is a cross-sectional view of one of the intaglio patterns of one of the resin layers of one of the preferred embodiments of the present invention; FIG. 10 is a touch screen panel manufacturing apparatus according to a preferred embodiment of the present invention; FIG. 11A to FIG. 11D are enlarged views of A, B, C, and D of FIG. 10; FIG. 12A to FIG. 12C are continuous patterns of continuously stacking silver and carbon black at the bottom of a gravure pattern; Figure 13 is a view showing a state in which one of the second support rollers is not sufficiently large, and a substrate is not supported by the second support roller at a point where the cleaning body is in contact with the substrate; Or more cleaning units are disposed in the transport direction of a substrate in another preferred embodiment; FIG. 15 is a a case diagram of a plurality of component sleeves, the component sleeve comprising an electrode material coating unit, an electrode material removal and scraping unit, a hardening unit, and a cleaning unit disposed in a transport direction of a substrate; And Figure 16 is a flow chart of another preferred embodiment of the method of fabricating an electrode film of the present invention.
值得注意的是,圖式不一定是按比例繪製的,所呈遞的各種特徵的簡化表述是在說明本發明的基本原理。本發明所公開的具體設計特徵,包括特定的尺寸、方向、位置和形狀其部分將由特定預期的應用和使用環境來確定。 It is noted that the drawings are not necessarily drawn to scale, and a simplified representation of the various features presented is illustrative of the basic principles of the invention. The specific design features disclosed herein, including specific dimensions, orientations, positions, and shapes, are to be determined by the particular intended application and use.
參考數字意指在整個圖式中與本發明相同或等效的元件。 Reference numerals mean elements that are identical or equivalent to the present invention throughout the drawings.
以下描述僅陳述本發明的一個原則。因此,熟悉該項技藝之人士可以實施本發明的原理,並於一個概念中創立各種裝置與本發明技術的範圍,即使沒有明確說明或在說明書中明確地揭露了圖式。尚有必須更進一步理解的是,在說明書中描述的所有條件和實施例意在理解本發明的概念,但本發明並不受限於該實施例,且本發明在本說明書中將會有具體說明。 The following description merely sets forth one principle of the invention. Thus, a person skilled in the art can implement the principles of the present invention and the various embodiments and the scope of the present invention are set forth in a concept, even if not explicitly stated or clearly disclosed in the specification. It is to be understood that all the conditions and embodiments described in the specification are intended to understand the concept of the invention, but the invention is not limited to the embodiment, and the invention will be Description.
參照圖式的詳細描述後,上述目的、特徵和優點將變得更加顯而易見,並且本發明的技術精神可以很容易地由熟悉該項技藝之人士所進行。然而,在描述本發明中,如果認為相關的已知結構或功能的具體描述可能模糊本發明的主旨,其描述將可以省略。在下文中,本發明的實施例將參照圖式以進行詳細說明。 The above objects, features, and advantages will become more apparent from the detailed description of the drawings, and the technical spirit of the invention can be readily made by those skilled in the art. However, in describing the present invention, if a detailed description of related known structures or functions is considered to obscure the gist of the present invention, the description thereof may be omitted. Hereinafter, embodiments of the invention will be described in detail with reference to the drawings.
有關於本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。 The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
圖1係本發明之一種製造電極膜的方法之一較佳實施例之流程圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing a preferred embodiment of a method of fabricating an electrode film of the present invention.
請參考圖1,該製造電極膜的方法包括以下步驟:(S100) 形成一凹版圖案;(S200)形成一電極圖案或一電極層;(S300)移除該電極層;及(S400)形成一黑色層。 Referring to FIG. 1, the method for manufacturing an electrode film includes the following steps: (S100) Forming a gravure pattern; (S200) forming an electrode pattern or an electrode layer; (S300) removing the electrode layer; and (S400) forming a black layer.
於步驟(S100)形成一凹版圖案中,該凹版圖案形成於一透明基體之一頂部表面之一樹酯層。 In the step (S100), a gravure pattern is formed, and the gravure pattern is formed on one of the top surfaces of one of the transparent substrates.
以本實施例而言,該透明基體110係透明的。更詳細的說明,透明基體110是一具有預定透明度的基體。 In the present embodiment, the transparent substrate 110 is transparent. In more detail, the transparent substrate 110 is a substrate having a predetermined transparency.
舉例說明,透明基體110使用聚對苯二甲酸乙酯、聚酰胺、丙烯酸、聚萘二甲酸或玻璃形成一透明薄膜。若透明基體110製造成一透明薄膜,一黏著劑可與該薄膜相互結合的。 For example, the transparent substrate 110 is formed into a transparent film using polyethylene terephthalate, polyamide, acrylic acid, polynaphthalene dicarboxylic acid or glass. If the transparent substrate 110 is fabricated as a transparent film, an adhesive can be bonded to the film.
該樹酯層120在透明基體110上形成薄片狀,凹版圖案則形成於該薄片狀樹酯層上。 The resin layer 120 is formed into a sheet shape on the transparent substrate 110, and a gravure pattern is formed on the sheet-like resin layer.
更具體地說明,在樹酯層120上的凹版圖案之一寬度是介於1-20μm之間,而凹版圖案之一深度是介於1-15μm之間。一凹版圖案與另一相鄰的凹版圖案之一間距係介於200-600μm之間。因此,凹版圖案的結構會依據使用者的所需而有所改變。 More specifically, one of the intaglio patterns on the resin layer 120 has a width of between 1 and 20 μm , and one of the intaglio patterns has a depth of between 1 and 15 μm . The spacing between one intaglio pattern and one of the adjacent intaglio patterns is between 200 and 600 μm . Therefore, the structure of the intaglio pattern may vary depending on the needs of the user.
請參考圖3A至圖3B與圖4A至圖4F圖,係本發明之形成一凹版圖案之一實施例之連續圖式與本發明之於一樹酯層上形成一凹版圖案之一實施例的複數個剖面圖式。 Please refer to FIG. 3A to FIG. 3B and FIG. 4A to FIG. 4F , which are the plural embodiments of the embodiment of the present invention for forming a gravure pattern and the embodiment of the present invention for forming a gravure pattern on a resin layer. Profile view.
如圖3A與圖3B所示,當採用紫外線固化樹酯或熱固型樹酯於樹酯層120上時,一模子300被壓下至尚未硬化的樹酯層120上,再加熱以硬化樹酯層120,接著移除該模子300,於是形成一凹版圖案。本實施例中,模子300採用一很低的表面粗糙度的材料,且模子300是用以形成凹版圖案的。因此,在形成凹版圖案後,會有令人滿意的4%或低於4%之霧度。在其中的過程,為可以平順地分開模子300與樹 酯層120,在壓印下模子300之前,必須先對模子表面進行表面處理。關於表面處理的一個案例,係使用一濺鍍法或其他表面處理方法,且配合具有1200-1500Å厚度之二氧化矽,以進行表面處理。 As shown in FIG. 3A and FIG. 3B, when ultraviolet curable resin or thermosetting resin is used on the resin layer 120, a mold 300 is pressed onto the unhardened resin layer 120, and heated to harden the tree. The ester layer 120 is then removed from the mold 300 to form a gravure pattern. In this embodiment, the mold 300 is made of a material having a very low surface roughness, and the mold 300 is used to form a gravure pattern. Therefore, after forming the intaglio pattern, there is a satisfactory haze of 4% or less. In the process in which the mold 300 and the tree can be smoothly separated The ester layer 120 must be surface treated on the surface of the mold before the mold 300 is embossed. In one case of surface treatment, a sputtering method or other surface treatment method was used, and a 1200-1500 Å thick cerium oxide was used for surface treatment.
相對於凹版圖案而製造凸出的複數個浮雕,因而製造出模子300。 A plurality of convex reliefs are produced with respect to the intaglio pattern, thereby producing the mold 300.
請參考圖4A至圖4F,樹酯層120的凹版圖案的一長度軸部分其形狀可以是下列任一種:長方形、三角形、不規則四邊形、半圓形、圓形、橢圓形、以及多邊形。若模子的浮雕是長方形,則形成於樹酯層120上的凹版圖案也是長方形的。若模子的浮雕是三角形,則形成於樹酯層120上的凹版圖案也是三角形的。若模子的浮雕是梯形,則形成於樹酯層120上的凹版圖案也是梯形的。 Referring to FIGS. 4A through 4F, a length axis portion of the intaglio pattern of the resin layer 120 may be any of the following shapes: a rectangle, a triangle, a trapezoid, a semicircle, a circle, an ellipse, and a polygon. If the relief of the mold is rectangular, the intaglio pattern formed on the resin layer 120 is also rectangular. If the relief of the mold is a triangle, the intaglio pattern formed on the resin layer 120 is also triangular. If the relief of the mold is trapezoidal, the intaglio pattern formed on the resin layer 120 is also trapezoidal.
在步驟(S200)形成一電極圖案或一電極層中,一電極層130形成於該有圖案的樹酯層120。 In the step (S200) of forming an electrode pattern or an electrode layer, an electrode layer 130 is formed on the patterned resin layer 120.
圖5係本發明之形成一電極層之一實施例之剖面圖式。 Figure 5 is a cross-sectional view showing an embodiment of forming an electrode layer of the present invention.
請參考圖5,電極層130是由以下任一種所形成,即銅、鎳、鉻、鐵、鎢、磷、鈷、銀、碳化銀、鏻化鎳、氧化銅、及無機物,如二硫化矽。電極層130的理想厚度是介於0.01-10μm,且是使用一種無電解電鍍法、沉積法或塗佈法。 Referring to FIG. 5, the electrode layer 130 is formed by any one of copper, nickel, chromium, iron, tungsten, phosphorus, cobalt, silver, silver carbide, nickel telluride, copper oxide, and inorganic substances such as antimony disulfide. . The ideal thickness of the electrode layer 130 is between 0.01 and 10 μm , and an electroless plating, deposition or coating method is used.
表面處理是需要進行的,才可以在電極層130與樹酯層120之間增進黏著性,進而形成一表面處理層。使用鹼性溶液、催化劑處理、等離子體/電漿或離子束處理的化學蝕刻可以應用於該表面處理。 Surface treatment is required to promote adhesion between the electrode layer 130 and the resin layer 120 to form a surface treatment layer. Chemical etching using an alkaline solution, catalyst treatment, plasma/plasma or ion beam treatment can be applied to the surface treatment.
本實施例的製造電極膜方法在步驟(S300)之移除電極層130之前,更包括一步驟,將凹版圖案覆蓋於具有抗腐蝕樹 酯的電極層130。 The method for manufacturing an electrode film of the present embodiment further includes a step of covering the electrode layer 130 with the anti-corrosion tree before the electrode layer 130 is removed in the step (S300). Ester electrode layer 130.
在本實施例中之覆蓋抗腐蝕樹酯的步驟中,透明基體環繞於一輥上,以增加凹版圖案之開口之面積。凹版圖案係形成於樹酯層120上,且被塗上一層樹酯。關於凹版圖案的詳細說明,將於以下的形成黑色層140的步驟中說明。 In the step of covering the corrosion-resistant resin in this embodiment, the transparent substrate is wound around a roll to increase the area of the opening of the intaglio pattern. A gravure pattern is formed on the resin layer 120 and is coated with a layer of resin. A detailed description of the gravure pattern will be described in the following step of forming the black layer 140.
圖6係本發明之選擇性移除一電極層之一實施例之剖視圖。 Figure 6 is a cross-sectional view showing one embodiment of the selective removal of an electrode layer of the present invention.
請參考圖6,在移除電極層130的步驟中,塗佈有一層抗腐蝕樹酯的樹酯層120會在一蝕刻液中沉澱。於是,電極層130會被選擇性地從樹酯層120的表面移除。具有抗腐蝕特性的樹酯填充入一凹版中,該凹版即為凹版圖案的一範圍,且在該蝕刻液中沉澱,以選擇性地移除形成於樹酯層120之該表面上的電極層130與填充於凹版內的樹酯。以本實施例而言,使用於蝕刻製程的化學製品包括硝酸、硫酸、鹽酸、硫酸銅、氯化鐵、及氯化銅。 Referring to FIG. 6, in the step of removing the electrode layer 130, the resin layer 120 coated with a layer of anti-corrosion resin is precipitated in an etching solution. Thus, the electrode layer 130 is selectively removed from the surface of the resin layer 120. The resin having corrosion resistance is filled in a gravure which is a range of the intaglio pattern and precipitated in the etching solution to selectively remove the electrode layer formed on the surface of the resin layer 120 130 and a resin filled in the intaglio. In the present embodiment, the chemical used in the etching process includes nitric acid, sulfuric acid, hydrochloric acid, copper sulfate, iron chloride, and copper chloride.
在步驟(S400)形成該黑色層140中,黑色層140是形成於樹酯層120的凹版圖案中。 In the black layer 140 formed in the step (S400), the black layer 140 is formed in the intaglio pattern of the resin layer 120.
圖7係本發明之形成一黑色層之一實施例之剖視圖。 Figure 7 is a cross-sectional view of one embodiment of the present invention forming a black layer.
請參考圖7,黑色層140可由無電解電鍍法、電鍍法、塗佈法或應用填充方法所形成。黑色層140包括以下至少一種化學物:銅、銀、碳化銀、鋁、鎳、鉻、和磷化鎳。 Referring to FIG. 7, the black layer 140 may be formed by electroless plating, electroplating, coating, or applying a filling method. The black layer 140 includes at least one of the following chemicals: copper, silver, silver carbide, aluminum, nickel, chromium, and nickel phosphide.
以上所述之本發明之一種製造電極膜方法的較佳實施例中,電極層與黑色層係使用以下之觸控螢幕面板製造裝置所形成的。然而,由於其形成程序是相同的,所以將形成一黑色層之程序當成一範例作說明。 In a preferred embodiment of the method of manufacturing an electrode film of the present invention described above, the electrode layer and the black layer are formed using the following touch panel manufacturing apparatus. However, since the forming procedure is the same, the procedure of forming a black layer is taken as an example.
圖10係本發明之一觸控螢幕面板製造裝置之整體輪廓 之一實施例圖式。 Figure 10 is an overall outline of a touch screen panel manufacturing apparatus of the present invention One embodiment schema.
如圖10所示,本實施例之觸控螢幕面板製造裝置包括一第一輥520,係位於一基片100附近,且被基片100所環繞;一第二輥550,係位於基片100附近,且被基片100所環繞;複數個導輥530a、530b、530c,係導引且運送基片100;一第一支撐輥542和一第二支撐輥544,係支撐基片100;一電極材料塗佈單元430,係可塗佈一電極材料132於基片100上的樹酯層120;一電極材料刮除單元440,係可移除樹酯層120之表面上的該電極材料132;一硬化單元450,係硬化填充於凹版圖案122內的電極材料132;及一清潔單元460,係可清潔樹酯層120之表面。 As shown in FIG. 10, the touch screen panel manufacturing apparatus of the present embodiment includes a first roller 520 located near a substrate 100 and surrounded by the substrate 100. A second roller 550 is located on the substrate 100. Nearby, and surrounded by the substrate 100; a plurality of guide rollers 530a, 530b, 530c guide and transport the substrate 100; a first support roller 542 and a second support roller 544, supporting the substrate 100; The electrode material coating unit 430 is a resin layer 132 coated with an electrode material 132 on the substrate 100; an electrode material scraping unit 440 is used to remove the electrode material 132 on the surface of the resin layer 120. A curing unit 450 hardens the electrode material 132 filled in the intaglio pattern 122; and a cleaning unit 460 cleans the surface of the resin layer 120.
該電極材料塗佈單元430、電極材料刮除單元440、硬化單元450、及清潔單元460係連續地沿著基片100的一運送方向設置於第一輥520與第二輥550之間。 The electrode material coating unit 430, the electrode material scraping unit 440, the hardening unit 450, and the cleaning unit 460 are continuously disposed between the first roller 520 and the second roller 550 along a conveying direction of the substrate 100.
第一輥520與第二輥550係位於觸控螢幕面板製造裝置的兩端,以進行旋轉,環繞於第一輥520之基片100是持續地被運送著,以環繞於第二輥550。這是在一種狀態下,即基片100之二端懸掛於第一輥520與第二輥550上。 The first roller 520 and the second roller 550 are located at both ends of the touch screen panel manufacturing apparatus for rotation, and the substrate 100 surrounding the first roller 520 is continuously transported to surround the second roller 550. This is in a state in which both ends of the substrate 100 are suspended from the first roller 520 and the second roller 550.
複數個導輥530a、530b、530c係位於第一輥520與第二輥550之間的基片100的一運送路徑上,以導引基片100的運送。複數個導輥530a、530b、530c可依據所需分配的位置分類為一第一導輥530a、一第二導輥530b、一第三導輥530c。複數個導輥530a、530b、530c的數量也可視本發明之所需而有所變化。 A plurality of guide rollers 530a, 530b, 530c are located on a transport path of the substrate 100 between the first roller 520 and the second roller 550 to guide the transport of the substrate 100. The plurality of guide rollers 530a, 530b, 530c can be classified into a first guide roller 530a, a second guide roller 530b, and a third guide roller 530c according to the position to be dispensed. The number of plurality of guide rollers 530a, 530b, 530c may also vary depending on the needs of the present invention.
電極材料塗佈單元430係位於基片100的運送路徑,以將電極材料132塗佈於基片100的樹酯層120。當基片100 於一間隔時被運送或未持續地被塗佈,電極材料132會被繼續地塗佈於其上。電極材料132一次塗佈的量或塗佈速度是可依基片100的運送速度、凹版圖案122的一寬度與一深度、以及電極材料132的一黏滯度而求得。當電極材料132塗佈於樹酯層120上,部分的電極材料132可填充於凹版圖案122內,但仍有殘餘物留在樹酯層120的表面。然而,電極材料刮除單元440的出現是要令殘餘在樹酯層表面的電極材料132可以再次填充於樹酯層120的凹版圖案122中。電極材料刮除單元140將於其後進行說明。於本實施例之案例中,只要基片100之部分接觸到輥200,一個由壓印法所形成之微小凹版圖案層(如圖3所示)之上的基片100即會被運送走。因此,增加了凹版圖案之開口之面積,進而形成電極層,如圖8所示。在使用電極塗佈單元將電極材料塗佈於基片上,以使電極材料主要地填充於凹版圖案中之後,塗佈於基片上的電極材料會被刮除,於是,電極材料可以再次被填充於具有較大面積的開口的凹版圖案中,以產生一電極膜。電極層130的材料是可以用以下化學物所製成:銅、鎳、鉻、鐵、鎢、磷、鈷、銀、碳化銀、磷化鎳、氧化銅和無機物質(二氧化矽)。 The electrode material coating unit 430 is located in the transport path of the substrate 100 to apply the electrode material 132 to the resin layer 120 of the substrate 100. When the substrate 100 The electrode material 132 is continuously applied thereto as it is shipped at a time interval or is not continuously applied. The amount of coating or coating speed of the electrode material 132 at one time can be determined by the transport speed of the substrate 100, a width and a depth of the intaglio pattern 122, and a viscosity of the electrode material 132. When the electrode material 132 is coated on the resin layer 120, a portion of the electrode material 132 may be filled in the intaglio pattern 122, but still residue remains on the surface of the resin layer 120. However, the electrode material scraping unit 440 is present such that the electrode material 132 remaining on the surface of the resin layer can be refilled in the intaglio pattern 122 of the resin layer 120. The electrode material scraping unit 140 will be described later. In the case of this embodiment, as long as a portion of the substrate 100 is in contact with the roller 200, a substrate 100 above the micro-gravure pattern layer (shown in Fig. 3) formed by the imprint method is carried away. Therefore, the area of the opening of the intaglio pattern is increased, thereby forming an electrode layer as shown in FIG. After the electrode material is coated on the substrate using the electrode coating unit so that the electrode material is mainly filled in the intaglio pattern, the electrode material coated on the substrate is scraped off, and thus the electrode material can be filled again. An intaglio pattern having a larger area of opening to create an electrode film. The material of the electrode layer 130 can be made of the following chemicals: copper, nickel, chromium, iron, tungsten, phosphorus, cobalt, silver, silver carbide, nickel phosphide, copper oxide, and inorganic substances (cerium oxide).
本發明之另一實施例中,只要基片的一部分接觸到該輥而增加了凹版圖案的開口之面積,且進而形成一黑色層,則於凹版圖案內形成有電極層的基片就會被運送出去。在使用電極塗佈單元將給黑色層準備的材料塗佈於基片上,以使該給黑色層準備的材料主要地填充於凹版圖案中之後,塗佈於基片上的給黑色層準備的材料會被刮除,於是,給黑色層準備的材料可以再次被填充於具有較大面積的開口的凹版圖 案中,以產生一電極膜。給黑色層準備的材料是可以用以下化學物所製成:銅、鎳、鉻、銀、碳化銀、鋁、磷化鎳、和導電聚合物。 In another embodiment of the present invention, as long as a portion of the substrate contacts the roller to increase the area of the opening of the intaglio pattern, and further a black layer is formed, the substrate having the electrode layer formed in the intaglio pattern is Shipped out. After the material prepared for the black layer is coated on the substrate using the electrode coating unit, so that the material prepared for the black layer is mainly filled in the intaglio pattern, the material applied to the black layer on the substrate is Being scraped off, then the material prepared for the black layer can be filled again in a gravure with an opening of a larger area In the case, an electrode film is produced. The material prepared for the black layer can be made of the following chemicals: copper, nickel, chromium, silver, silver carbide, aluminum, nickel phosphide, and a conductive polymer.
對一導電層塗佈法而言,噴塗法、輥塗法、刮刀塗佈法、狹縫式塗佈法、逗號塗佈法、逆輥塗佈法皆適用。 For a conductive layer coating method, a spray coating method, a roll coating method, a knife coating method, a slit coating method, a comma coating method, and a reverse roll coating method are all applicable.
黑色層140所形成的產物其透射率是85%或更高,其霧度為4%或更少。(霧度儀:NDH5000)以圖2A所示的實施例而言,一個輥的直徑尺寸可用以參考,以製造一感應器,該感應器係偵測接觸與否及執行不同的操作功能。圖9A與圖9B係環繞於輥上之一具有一微小凹版圖案之透明基體所形成之一圖案之一外形的二剖視圖,其中,該微小凹版圖案係由壓印方法所形成的。在此,a與a’係定義成一初始線寬與一改變線寬。b係定義成一輥的半徑。c定義成一薄膜的厚度。 The product formed by the black layer 140 has a transmittance of 85% or more and a haze of 4% or less. (Haze meter: NDH5000) In the embodiment shown in Fig. 2A, the diameter of one roll can be used as a reference to make a sensor that detects contact or not and performs different operational functions. 9A and 9B are two cross-sectional views showing an outer shape of a pattern formed by a transparent substrate having a micro intaglio pattern on a roll, wherein the micro intaglio pattern is formed by an imprint method. Here, a and a' are defined as an initial line width and a changed line width. b is defined as the radius of a roll. c is defined as the thickness of a film.
表一顯示當開口的面積增加時,凹版圖案之開口之線寬的改變狀況。表二顯示凹版圖案之容積的改變狀況。 Table 1 shows the change in the line width of the opening of the intaglio pattern as the area of the opening increases. Table 2 shows the change in the volume of the intaglio pattern.
請參考表一,可以確認的是凹版圖案的開口其線寬的增加是與輥半徑2b與薄膜厚度c是一致的。意即,輥直徑2b較小,且薄膜厚度較大,則凹版圖案的開口其線寬也就增加。 Referring to Table 1, it can be confirmed that the opening of the gravure pattern has an increase in line width which is consistent with the roll radius 2b and the film thickness c. That is, when the roll diameter 2b is small and the film thickness is large, the line width of the opening of the intaglio pattern is increased.
當凹版圖案之凹版其深度是10μm,L是圖案的初始長度且其值為100mm,L’則是圖案的一改變長度。容積的增加量與增加比將顯示於表二中。 When the intaglio of the intaglio pattern has a depth of 10 μm , L is the initial length of the pattern and its value is 100 mm, and L' is a changed length of the pattern. The volume increase and increase ratios will be shown in Table 2.
請參考表二,可以確認的是,凹版圖案之開口面積是增加的,且凹版圖案的容積也增加。 Referring to Table 2, it can be confirmed that the opening area of the gravure pattern is increased, and the volume of the gravure pattern is also increased.
因此,依據本發明之製造電極膜方法之實施例,電極層130或黑色層140並無死角,且電極層130或黑色層140係經由開口線寬所致的凹版圖案之容積的改變與輥直徑所致的凹版圖案之開口線寬的改變所形成。尤其地,如圖9A與圖9B所示,凹版圖案之開口線寬a’較之一較低表面的寬度(凹版圖案的初始寬度)為大,如同透明基體環繞於輥之表面的寬度。於是,凹版圖案的容積即增加了。 Therefore, according to the embodiment of the method for manufacturing an electrode film of the present invention, the electrode layer 130 or the black layer 140 has no dead angle, and the electrode layer 130 or the black layer 140 is a volume change of the intaglio pattern and the roll diameter caused by the opening line width. A change in the opening line width of the resulting intaglio pattern is formed. In particular, as shown in Figs. 9A and 9B, the opening line width a' of the intaglio pattern is larger than the width of one of the lower surfaces (the initial width of the intaglio pattern) as the width of the transparent substrate surrounding the surface of the roller. Thus, the volume of the intaglio pattern is increased.
於本實施例中,凹版圖案之開口線寬a’與該較低表面之寬度a的差距大於一預設門檻值k。以這個案例而言,該預設門檻值定義成具有填充材料(用以形成電)的最小參考面積,且該填充材料是很容易填充入凹版圖案。就本實施例而言,該差距是大於該最小參考面積,意即預設門檻值k係取決於開口之線寬a’的增加。凹版圖案之開口線寬的增加亦取決於電極層的厚度,電極層包括透明基體與樹酯層120。 In this embodiment, the difference between the opening line width a' of the intaglio pattern and the width a of the lower surface is greater than a predetermined threshold value k. In this case, the preset threshold value is defined as a minimum reference area having a filling material (to form electricity), and the filling material is easily filled into the intaglio pattern. For the present embodiment, the difference is greater than the minimum reference area, meaning that the preset threshold value k is dependent on the increase in the line width a' of the opening. The increase in the opening line width of the intaglio pattern also depends on the thickness of the electrode layer, which includes the transparent substrate and the resin layer 120.
請參考表一與表二,在製造電極模方法的實施例中,凹版圖案之開口線寬是依據輥直徑而有所變化;當輥直徑減少時,薄膜厚度增加,凹版圖案之開口線寬也增加了。因此, 填充充效率得以增加,且微小線寬之填充特性也增加了。 Referring to Table 1 and Table 2, in the embodiment of the method for manufacturing the electrode mold, the opening line width of the gravure pattern varies depending on the diameter of the roll; when the roll diameter is decreased, the film thickness is increased, and the opening line width of the gravure pattern is also increased. therefore, Filling efficiency is increased, and the filling characteristics of minute line widths are also increased.
於是,本實施例中第一支撐輥的直徑是50mm或更大、1500mm或更小、100mm或更大、與800mm或更小。電極膜厚度是200μm或更大、和800μm或更小。 Thus, the diameter of the first support roller in this embodiment is 50 mm or more, 1500 mm or less, 100 mm or more, and 800 mm or less. The electrode film thickness is 200 μm or more, and 800 μm or less.
在本案例中,若第一支撐輥之直徑是50mm或更小,圖案開口面積是很明顯地增加。因此,電極材料會過度填充。相反地,若第一支撐輥之半徑是800mm或更大,增加開口面積的效率就不明顯了。 In this case, if the diameter of the first support roller is 50 mm or less, the pattern opening area is remarkably increased. Therefore, the electrode material is overfilled. Conversely, if the radius of the first support roller is 800 mm or more, the efficiency of increasing the opening area is not significant.
電極材料刮除單元440於基片的運送方向中是位於電極材料塗佈單元430之後。當刮除樹酯層120之表面上的電極材料132時,電極材料刮除單元440是接觸於樹酯層120的表面上,以將電極材料132填充於凹版圖案122中。換言之,塗佈於樹酯層120上的電極材料132與基片100是一起運送的。若樹酯層120表面的電極材料132遇到電極材料刮除單元440時,電極材料132會被電極材料刮除單元440所擋住,於是不會與基片100一起被運送走,反而會以與運送基片100的方向之相反方向被刮除回去。當樹酯層120表面的材料132被電極材料刮除單元440刮除回去後,樹酯層120表面的材料132會經由電極材料刮除單元440施以的壓力而填充入凹版圖案122中。 The electrode material scraping unit 440 is located behind the electrode material coating unit 430 in the transport direction of the substrate. When the electrode material 132 on the surface of the resin layer 120 is scraped off, the electrode material scraping unit 440 is in contact with the surface of the resin layer 120 to fill the electrode material 132 in the intaglio pattern 122. In other words, the electrode material 132 coated on the resin layer 120 is carried together with the substrate 100. If the electrode material 132 on the surface of the resin layer 120 encounters the electrode material scraping unit 440, the electrode material 132 is blocked by the electrode material scraping unit 440, and thus will not be transported together with the substrate 100, but instead The opposite direction of the direction in which the substrate 100 is transported is scraped back. When the material 132 on the surface of the resin layer 120 is scraped off by the electrode material scraping unit 440, the material 132 on the surface of the resin layer 120 is filled into the intaglio pattern 122 via the pressure applied by the electrode material scraping unit 440.
電極材料刮除單元440包括一刮刀442與一刮刀臂444。該刮刀臂444裝設於觸控螢幕面板製造裝置之一側,以從相對於基片100的垂直方向移動。當一旋轉軸耦接於刮刀臂444之一端且以一特別角度固定時,該旋轉軸開始旋轉,其中,該特別角度是因使用者而定的。該刮刀442的寬度是等於或大於基片100的寬度,且刮刀442的邊緣沿著基 片100的寬度方向以一個預設的角度與基片100接觸。刮刀442與基片100形成的角度是銳角。刮刀442的材質是不會與電極材料132產生化學反應的,且具有一預定的剛性,以施加預定壓力於基片100上。 The electrode material scraping unit 440 includes a scraper 442 and a scraper arm 444. The blade arm 444 is mounted on one side of the touch panel manufacturing apparatus to move from a vertical direction with respect to the substrate 100. When a rotating shaft is coupled to one end of the scraper arm 444 and fixed at a particular angle, the rotating shaft begins to rotate, wherein the special angle is user-dependent. The width of the blade 442 is equal to or greater than the width of the substrate 100, and the edge of the blade 442 is along the base. The width direction of the sheet 100 is in contact with the substrate 100 at a predetermined angle. The angle formed by the doctor blade 442 and the substrate 100 is an acute angle. The material of the blade 442 is not chemically reacted with the electrode material 132 and has a predetermined rigidity to apply a predetermined pressure to the substrate 100.
電極材料刮除單元440是固定於刮刀442的邊緣上,且以一預定角度施以一預定壓力於基片100上。因此,當基片100被運送且電極材料132填充入凹版圖案122時,電極材料132不會隨著基片100一起被運送走。也就是說,因電極材料刮除單元440的相對移動與基片100將自樹酯層120的表面被刮除,當電極材料132被電極材料刮除單元440所阻擋時,電極材料即被填充入凹版圖案122中(如第11A圖所示)。因著電極材料132是以與基片100被運送方向的相反方向被刮除的,電極材料132是幾乎被從基片100之樹酯層120之表面完全移除的,其中,該表面是通過電極材料刮除單元440的。本案例中,刮刀442接觸基片100而形成一銳角,以使被刮刀442所刮除的電極材料132可以有效地填充於凹版圖案122中。 The electrode material scraping unit 440 is fixed to the edge of the blade 442 and applies a predetermined pressure to the substrate 100 at a predetermined angle. Therefore, when the substrate 100 is transported and the electrode material 132 is filled into the intaglio pattern 122, the electrode material 132 is not carried away along with the substrate 100. That is, since the relative movement of the electrode material scraping unit 440 and the substrate 100 are scraped from the surface of the resin layer 120, when the electrode material 132 is blocked by the electrode material scraping unit 440, the electrode material is filled. Into the intaglio pattern 122 (as shown in Fig. 11A). Since the electrode material 132 is scraped in the opposite direction to the direction in which the substrate 100 is transported, the electrode material 132 is almost completely removed from the surface of the resin layer 120 of the substrate 100, wherein the surface is passed The electrode material scrapes off the unit 440. In this case, the blade 442 contacts the substrate 100 to form an acute angle so that the electrode material 132 scraped off by the blade 442 can be effectively filled in the intaglio pattern 122.
刮刀442是旋轉地耦接於刮刀臂444,且經由刮刀臂444作垂直的移動。因此,刮刀442接觸基片100的角度與施加於基片100上的壓力皆是可調整的。意即,電極材料刮除單元440施加於基片100上的壓力可經由調整刮刀442接觸基片100的角度或是刮刀臂444在垂直方向的一位置,而得以調整。當電極材料刮除單元440施加於基片100上的壓力較大,電極材料132可備有效地移除;但若壓力過大,基片100會被破壞。 The scraper 442 is rotationally coupled to the scraper arm 444 and moves vertically via the scraper arm 444. Therefore, the angle at which the blade 442 contacts the substrate 100 and the pressure applied to the substrate 100 are both adjustable. That is, the pressure applied to the substrate 100 by the electrode material scraping unit 440 can be adjusted by adjusting the angle of the blade 100 to the substrate 100 or a position of the blade arm 444 in the vertical direction. When the pressure applied to the substrate 100 by the electrode material scraping unit 440 is large, the electrode material 132 can be effectively removed; however, if the pressure is too large, the substrate 100 may be destroyed.
第一支撐輥542從電極材料刮除單元440的另一相反側 支撐被電極材料刮除單元440施加壓力的基片100。基片100也是被第一支撐輥542所支撐,因此基片100可以預防鬆脫,概因電極材料刮除單元440的壓力與電極材料刮除單元440密切地接觸基片100。 The first support roller 542 is from the opposite side of the electrode material scraping unit 440 The substrate 100 that is pressed by the electrode material scraping unit 440 is supported. The substrate 100 is also supported by the first support roller 542, so that the substrate 100 can be prevented from being loosened, and the pressure of the electrode material scraping unit 440 is in close contact with the electrode material scraping unit 440 to closely contact the substrate 100.
硬化單元450位於電極材料刮除單元440之後側,且提供加熱、熱風、照射紅外線或近紅外線至基片100,以硬化填充入樹酯層120的凹版圖案122之電極材料132。 The hardening unit 450 is located on the rear side of the electrode material scraping unit 440, and supplies heating, hot air, infrared rays or near infrared rays to the substrate 100 to harden the electrode material 132 filled in the intaglio pattern 122 of the resin layer 120.
清潔單元460移除殘留於樹酯層120表面的電極材料132。大部分樹酯層120表面的電極材料132是由電極材料刮除單元440所刮除,以再填充於凹版圖案122中,但仍有電極材料132的殘渣135是殘留在樹酯層120表面的。清潔單元460可移除殘渣135,該殘渣135是電極材料刮除單元440沒有刮除的殘留於樹酯層120表面的電極材料132(如第十一C所示)。清潔單元460包括一清潔體462、一第一清潔輥466a、一第二清潔輥466b、及一清潔導輥464。 The cleaning unit 460 removes the electrode material 132 remaining on the surface of the resin layer 120. The electrode material 132 on the surface of most of the resin layer 120 is scraped off by the electrode material scraping unit 440 to be refilled in the intaglio pattern 122, but the residue 135 of the electrode material 132 remains on the surface of the resin layer 120. . The cleaning unit 460 can remove the residue 135, which is the electrode material 132 remaining on the surface of the resin layer 120 that is not scraped off by the electrode material scraping unit 440 (as shown in the eleventh C). The cleaning unit 460 includes a cleaning body 462, a first cleaning roller 466a, a second cleaning roller 466b, and a cleaning guide roller 464.
清潔體462係環繞於該第一清潔輥466a與該第二清潔輥466b之間,且接觸於樹酯層120表面,以移除殘留於樹酯層120表面之電極材料132的殘渣135。在基片100被運送且清潔體462環繞於第一清潔輥466a與第二清潔輥466b之間時,清潔體462可以與基片100被運送方向相同或相反的方向運送。當基片100已經運送走了,清潔體462即可固定住。 The cleaning body 462 is wound between the first cleaning roller 466a and the second cleaning roller 466b and is in contact with the surface of the resin layer 120 to remove the residue 135 of the electrode material 132 remaining on the surface of the resin layer 120. When the substrate 100 is transported and the cleaning body 462 is wrapped between the first cleaning roller 466a and the second cleaning roller 466b, the cleaning body 462 may be transported in the same or opposite direction as the substrate 100 is transported. When the substrate 100 has been transported away, the cleaning body 462 can be fixed.
清潔體462係朝著基片100而被該清潔導輥464施以壓力,如此可以接觸到樹酯層120表面,以移除殘渣135,該殘渣135是殘留於基片100表面的電極材料132。該第二支撐輥544位於清潔導輥464之另一相反側與基片100之間。第二支撐輥544支撐被清潔導輥464所施壓的基片100。基 片100是被第二支撐輥544所支撐,所以基片100可以在清潔導輥464所施壓的方向保持密切地與清潔體462接觸,而不會鬆脫。第二支撐輥544也提供運送基片100的力量。當清潔體462接觸基片100時,在清潔體462接觸於基片100的一點上,因為摩擦力,運送速度會比較低。運送基片100的速度必須是一定的,該速度是相對於第一輥520與第二輥550之間的複數個點的。若在某一點是速度較低的,則基片100會被扭曲。在基片100接觸清潔體462之某一點處,提供足夠運送基片100之力量是必須的,於是,在該點上的運送速度才能保持與其他點的速度一樣。為提供足夠的運送力給基片100,基片100與第二支撐輥544之間的摩擦力也必須具備。為了提高基片100和第二支撐輥544之間的摩擦力,基片100的運送方向也會在支撐輥544的前面與後面作切換。運送方向的切換顯示了基片100相對於第二支撐輥544被彎曲成一預定的角度,如圖10之一側所示。若基片100的運送方向被第二支撐輥544切換,基片100和第二支撐輥544之間的接觸面積會增加,以進而增加摩擦力。因著基片100和第二支撐輥544之間的接觸面積增加了,當第二支撐輥544沿著其旋轉方向平順地旋轉,基片100也不會打滑。以本案例而言,基片100的運送方向會隨著不同的角度而更改,如圖10所示,理想的角度是90度或更大。當基片100的運送方向其更改角度愈大時,基片100會更穩定地被運送著。 The cleaning body 462 is pressed toward the substrate 100 by the cleaning guide roller 464 so as to be in contact with the surface of the resin layer 120 to remove the residue 135, which is the electrode material 132 remaining on the surface of the substrate 100. . The second support roller 544 is located between the other opposite side of the cleaning guide roller 464 and the substrate 100. The second support roller 544 supports the substrate 100 pressed by the cleaning guide roller 464. base The sheet 100 is supported by the second support roller 544, so that the substrate 100 can be kept in close contact with the cleaning body 462 in the direction in which the cleaning guide roller 464 is pressed without being loosened. The second support roller 544 also provides the force to transport the substrate 100. When the cleaning body 462 contacts the substrate 100, at a point where the cleaning body 462 contacts the substrate 100, the conveyance speed is relatively low due to the frictional force. The speed at which the substrate 100 is transported must be constant relative to a plurality of points between the first roll 520 and the second roll 550. If the speed is lower at some point, the substrate 100 will be distorted. At a point where the substrate 100 contacts the cleaning body 462, it is necessary to provide sufficient force to transport the substrate 100 so that the transport speed at that point remains the same as the speed of the other points. In order to provide sufficient transport force to the substrate 100, the friction between the substrate 100 and the second support roller 544 must also be provided. In order to increase the frictional force between the substrate 100 and the second supporting roller 544, the conveying direction of the substrate 100 is also switched in front of and behind the supporting roller 544. The switching of the transport direction shows that the substrate 100 is bent at a predetermined angle with respect to the second support roller 544, as shown on one side of FIG. If the transport direction of the substrate 100 is switched by the second support roller 544, the contact area between the substrate 100 and the second support roller 544 is increased to further increase the frictional force. Since the contact area between the substrate 100 and the second support roller 544 is increased, when the second support roller 544 is smoothly rotated in the rotational direction thereof, the substrate 100 does not slip. In this case, the transport direction of the substrate 100 will vary with different angles, as shown in Fig. 10, and the ideal angle is 90 degrees or more. When the transport direction of the substrate 100 is changed to a larger angle, the substrate 100 is more stably transported.
第二支撐輥544運送著基片100,導輥530b、530c環繞於第二輥550上(如圖11D所示)。 The second support roller 544 carries the substrate 100, and the guide rollers 530b, 530c surround the second roller 550 (as shown in Fig. 11D).
如上圖所示,清潔體462係被動式與樹脂層120的表面 接觸,以除去電極材料132的殘渣135。在本案例中,為了有效地除去殘留在電極材料132的殘渣135,清潔體462更可具有清潔液。該清潔液係異丙醇和丙酮的混合溶液,比例範圍是9:1至8:2。清潔液會軟化仍然殘留在樹脂層120的表面上的電極材料132的殘渣135。 As shown in the above figure, the cleaning body 462 is passive and the surface of the resin layer 120 Contact to remove residue 135 of electrode material 132. In this case, in order to effectively remove the residue 135 remaining in the electrode material 132, the cleaning body 462 may further have a cleaning liquid. The cleaning solution is a mixed solution of isopropyl alcohol and acetone in a ratio ranging from 9:1 to 8:2. The cleaning liquid softens the residue 135 of the electrode material 132 remaining on the surface of the resin layer 120.
至少兩個清潔單元460可以在基片100的運送方向進行串聯。根據本案例,清潔單元460包括一第一清潔單元460a、一第二清潔單元460b和第三清潔單元460c,該三單元串聯在基片100的運送方向,且沿第二支撐輥544的一外圓周上而設置。在本案例中,清潔液是包括在第一清潔單元460a中的清潔體462之中,且是在第一清潔單元460a之一前側,但清潔液可能會或可能不會被包括在第二清潔單元460b與第三清潔單元460c中的二清潔體462中,該二清潔體462分別在第二清潔單元460b與第三清潔單元460c的後側。第一清潔單元460a可將清潔液應用於的樹脂層120的表面,以軟化在樹脂層120的表面上的電極材料132的殘渣135。第二清潔單元460b設置在第一清潔單元460a的後側,以清除由第一清潔單元460a中所軟化殘留在樹脂層120的表面上之電極材料132的殘渣135。設置於第二清潔單元460b後側的第三清潔單元460c移除了清潔液,該清潔液係由第一清潔單元460a施加在樹脂層120的表面上,並停留在其上而沒有被第二清潔單元460b所清除。清潔液完全是由第三清潔單元460c所清除,因此污垢不會產生在觸控螢幕面板上,於是第二輥550就不會被清潔液所污染。如上所述,如果有至少兩個清潔單元460是以串聯的方式排列於基片100的運送方向上,殘留在樹脂層120表面上電極材料132的殘渣135會被 移除好幾次。相對應地,與其中只有一個清潔單元460的情況相比,該至少兩個清潔單元460的情況,將可被充分地移除殘渣135。如果只有一個清潔單元460,則需要以較大的壓力才能完全移除去電極材料132的殘渣135;但是,如果有複數個清潔單元460,則殘渣135會經過多次的移除,因此不需要施加較大的壓力到基片100上,故可以防止基片100被損壞或變形。 At least two cleaning units 460 may be connected in series in the transport direction of the substrate 100. According to the present example, the cleaning unit 460 includes a first cleaning unit 460a, a second cleaning unit 460b, and a third cleaning unit 460c that are connected in series in the transport direction of the substrate 100 and along an outer side of the second support roller 544. Set on the circumference. In this case, the cleaning liquid is included in the cleaning body 462 in the first cleaning unit 460a, and is on the front side of one of the first cleaning units 460a, but the cleaning liquid may or may not be included in the second cleaning. In the two cleaning bodies 462 of the unit 460b and the third cleaning unit 460c, the two cleaning bodies 462 are respectively on the rear side of the second cleaning unit 460b and the third cleaning unit 460c. The first cleaning unit 460a may apply a cleaning liquid to the surface of the resin layer 120 to soften the residue 135 of the electrode material 132 on the surface of the resin layer 120. The second cleaning unit 460b is disposed on the rear side of the first cleaning unit 460a to remove the residue 135 of the electrode material 132 remaining on the surface of the resin layer 120 softened by the first cleaning unit 460a. The third cleaning unit 460c disposed on the rear side of the second cleaning unit 460b removes the cleaning liquid which is applied on the surface of the resin layer 120 by the first cleaning unit 460a and stays thereon without being second The cleaning unit 460b is removed. The cleaning liquid is completely removed by the third cleaning unit 460c, so dirt is not generated on the touch screen panel, and the second roller 550 is not contaminated by the cleaning liquid. As described above, if at least two cleaning units 460 are arranged in series in the transport direction of the substrate 100, the residue 135 of the electrode material 132 remaining on the surface of the resin layer 120 is Remove it several times. Correspondingly, in the case of the at least two cleaning units 460, the residue 135 will be sufficiently removed as compared to the case where there is only one cleaning unit 460. If there is only one cleaning unit 460, it is necessary to use a large pressure to completely remove the residue 135 of the electrode material 132; however, if there are a plurality of cleaning units 460, the residue 135 is removed multiple times, so it is not necessary A large pressure is applied to the substrate 100, so that the substrate 100 can be prevented from being damaged or deformed.
這裡,當兩個或更多的清潔單元460設置於基片100的運送方向上,第二支撐輥544的直徑必須要夠大,以便穩定地支撐基片100。如圖13所示,係一種狀況,即一基片沒有被第二支承輥在某一點所支撐,該點是一清潔體與基片接觸之處,起因則是第二支承輥的直徑不夠大。如圖13所示,如果第二支撐輥544’的直徑’不夠大時,基片100和所述第二支撐輥544’的接觸表面其長度是小的,因此,清潔導輥464則無法設置在所述接觸在基片100和第二支撐輥544’的該接觸表面上。在本案例中,基片100可以在清潔體462與清潔導輥464支撐的基片100的接觸點上不被第二支撐輥544’所支撐,使得基片100不會緊密地接觸清潔導輥464,於是便無法產生令人滿意的清潔結果,或是基片被清潔導輥464扭曲或損壞。因此,如圖10所示,第二支承輥544的直徑大於清潔導輥464,使得清潔體462和基片100的接觸點被設置在基片100和第二支撐輥544的接觸面上。在本案例中,第二支撐輥544與清潔導輥464理想的直徑比是2至7比1(2~7:1),更好的是5至7比1(5~7:1)。這裡,當第二支撐輥544相對於清潔導輥464的直徑比小於2時,如圖13所示,複數個個清潔導輥464難以在第二支撐輥544 周圍接觸,使清潔單元的清潔能力減低了,從而可能導致已完成的基片產生錯誤。當第二支撐輥544相對於清潔導輥464的直徑比超過7時,基片100與第二支撐輥544的接觸面積增加,使得運送力可有效地傳遞到基片100,但是第二支撐輥544過度佔有相當大的空間,於是第二支撐輥544的製造成本會增加。相反地,當第二支撐輥544相對於清潔導輥464的直徑之比為2至7時,基片100和第二支撐輥544的接觸面積是穩定的,以便發出一足夠的運送力到基片100;再者,當基片被清潔乾淨了,且複數個清潔單元是在與基片100接觸時,基片100的運送速度在清潔單元中還是恆定地保持著。當第二支撐輥544相對於清潔導輥464的直徑比為2至7,基片100和第二支撐輥544的接觸面積即增加,因此較大的運送力可以提供到基片100。 Here, when two or more cleaning units 460 are disposed in the transport direction of the substrate 100, the diameter of the second support roller 544 must be large enough to stably support the substrate 100. As shown in Fig. 13, there is a case where a substrate is not supported by a second supporting roller at a point which is a place where the cleaning body comes into contact with the substrate, and the cause is that the diameter of the second supporting roller is not large enough. . As shown in FIG. 13, if the diameter ' of the second support roller 544' is not large enough, the contact surface of the substrate 100 and the second support roller 544' has a small length, and therefore, the cleaning guide roller 464 cannot be set. The contact is on the contact surface of the substrate 100 and the second support roller 544'. In this case, the substrate 100 may not be supported by the second support roller 544' at the contact point of the cleaning body 462 with the substrate 100 supported by the cleaning guide roller 464, so that the substrate 100 does not closely contact the cleaning guide roller. 464, then a satisfactory cleaning result could not be produced, or the substrate was twisted or damaged by the cleaning guide roller 464. Therefore, as shown in FIG. 10, the diameter of the second backup roller 544 is larger than that of the cleaning guide roller 464, so that the contact point of the cleaning body 462 and the substrate 100 is disposed on the contact faces of the substrate 100 and the second support roller 544. In this case, the ideal diameter ratio of the second support roller 544 to the cleaning guide roller 464 is 2 to 7 to 1 (2 to 7:1), more preferably 5 to 7 to 1 (5 to 7:1). Here, when the diameter ratio of the second support roller 544 to the cleaning guide roller 464 is less than 2, as shown in FIG. 13, the plurality of cleaning guide rollers 464 are difficult to be at the second support roller 544. The surrounding contact reduces the cleaning ability of the cleaning unit, which may cause errors in the completed substrate. When the diameter ratio of the second support roller 544 to the cleaning guide roller 464 exceeds 7, the contact area of the substrate 100 with the second support roller 544 is increased, so that the conveyance force can be efficiently transmitted to the substrate 100, but the second support roller The 544 excessively occupies a considerable space, and thus the manufacturing cost of the second support roller 544 is increased. Conversely, when the ratio of the diameter of the second support roller 544 to the cleaning guide roller 464 is 2 to 7, the contact area of the substrate 100 and the second support roller 544 is stable so as to emit a sufficient transport force to the base. Sheet 100; Further, when the substrate is cleaned and a plurality of cleaning units are in contact with the substrate 100, the transport speed of the substrate 100 is constantly maintained in the cleaning unit. When the diameter ratio of the second support roller 544 to the cleaning guide roller 464 is 2 to 7, the contact area of the substrate 100 and the second support roller 544 is increased, so that a large conveying force can be supplied to the substrate 100.
另一實施例為,兩個或更多的清潔單元460在基片100的運送方向串聯設置,如圖10所示。第二支承輥544”的數量與清潔單元460相同。因此,當第二支承輥544”與清潔單元460的數量相同時,只有一個清潔導輥464是與一個第二支撐輥544接觸,因此第二支撐輥544”的直徑’可以是較小的。複數個清潔單元460不需要沿著第二支承輥544”的外圓周上設置,設置清潔單元460的位置是較隨意的。然而,複數個第二支撐輥544”是必須的,且該複數個第二支撐輥544”必須可以被單獨控制,因此本實施例的結構比圖6更加複雜,且基片100的運送方向在第二支承輥544”中沒有切換。因此,在基片100和第二支撐輥544”之間的接觸面積減少,提供到基片100的運送力是不夠的。 In another embodiment, two or more cleaning units 460 are disposed in series in the transport direction of the substrate 100, as shown in FIG. The number of the second backup rollers 544" is the same as that of the cleaning unit 460. Therefore, when the number of the second backup rollers 544" and the cleaning unit 460 is the same, only one cleaning guide roller 464 is in contact with one second support roller 544, so The diameter ' of the two support rollers 544" may be smaller. The plurality of cleaning units 460 need not be disposed along the outer circumference of the second backup roller 544", and the position of the cleaning unit 460 is relatively random. However, a plurality of second support rollers 544" are necessary, and the plurality of second support rollers 544" must be individually controllable, so the structure of the present embodiment is more complicated than that of FIG. 6, and the transport direction of the substrate 100 is There is no switching in the second backup roller 544". Therefore, the contact area between the substrate 100 and the second support roller 544" is reduced, and the conveying force supplied to the substrate 100 is insufficient.
如上所述,清潔單元的配置不限於如圖10所示的實施 例,但可以以各種形式進行修改,並且可以如圖13與圖14的實施例來呈現。然而,通過上述的原因,可以認為,如圖10所示,在第二支撐輥544之前與之後切換基片100的運送方向,第二支撐輥544的直徑是夠大的,因此清潔體462和基片100的接觸點是設置在基片100和第二支撐輥544的接觸表面上,這是最好的實施例。 As described above, the configuration of the cleaning unit is not limited to the implementation as shown in FIG. For example, but modifications can be made in various forms, and can be presented in the embodiments of Figures 13 and 14. However, for the above reasons, it can be considered that, as shown in FIG. 10, before and after the second support roller 544, the transport direction of the substrate 100 is switched, the diameter of the second support roller 544 is large enough, so the cleaning body 462 and The contact point of the substrate 100 is provided on the contact surface of the substrate 100 and the second support roller 544, which is the best embodiment.
以另一個實施例而言,如果需要的話,例如,形成在觸控螢幕面板上的電極層130在高度方向具有不同材料,或雖然電極材料132的量是足夠的,卻沒有在一次應用時填充在凹版圖案122中,複數套由電極材料塗佈單元430,電極材料刮除單元440,硬化單元450和清潔單元460組成的構件套是需要設置在基片100的運送方向上,如圖15所示。因此,與該構件套數量相同的電極材料層132中的材料可依次層疊在凹版圖案122中。 In another embodiment, if desired, for example, the electrode layer 130 formed on the touch screen panel has a different material in the height direction, or although the amount of the electrode material 132 is sufficient, it is not filled in one application. In the gravure pattern 122, a plurality of sets of the electrode material coating unit 430, the electrode material scraping unit 440, the hardening unit 450 and the cleaning unit 460 are required to be disposed in the transport direction of the substrate 100, as shown in FIG. Show. Therefore, the materials in the electrode material layer 132 having the same number of the component sleeves may be sequentially stacked in the intaglio pattern 122.
例如,為了層疊具有銀的電極層130和具有碳黑的頂層下面的兩層,三組構件套均在基片100的運送方向串聯設置。當基片100通過該組構件套時,首先,在塗佈銀136於樹脂層120上之後,該銀136被填充在凹版圖案122中,填充的銀136被硬化,和仍殘留在樹脂層120的表面上電極材料132的殘渣135被移除後,銀136則填充在凹版圖案122中(參照圖12A)。當持續地運送基片100和銀136時,一系列上述步驟都在對銀136和炭黑137進行,銀136和碳黑137會依次層疊在凹版圖案122中,以從下部形成電極圖案(參見圖12B與圖12)。 For example, in order to laminate the electrode layer 130 having silver and the two layers below the top layer having carbon black, the three sets of component sleeves are disposed in series in the transport direction of the substrate 100. When the substrate 100 passes through the set of member sleeves, first, after the silver 136 is coated on the resin layer 120, the silver 136 is filled in the intaglio pattern 122, the filled silver 136 is hardened, and remains in the resin layer 120. After the residue 135 of the surface upper electrode material 132 is removed, the silver 136 is filled in the intaglio pattern 122 (refer to FIG. 12A). When the substrate 100 and the silver 136 are continuously transported, a series of the above steps are performed on the silver 136 and the carbon black 137, and the silver 136 and the carbon black 137 are sequentially laminated in the intaglio pattern 122 to form an electrode pattern from the lower portion (see Figure 12B and Figure 12).
在此期間,以層疊具有銀的電極層130之一下層和其具有炭黑的上層,有兩組構件套均在基片100的傳送方向串聯 設置。如上所述,當電極材料有兩層時,與三層電極材料相比,在程序數量上會減少,而該三層電極材料之能見度可能會降低。 In the meantime, in order to laminate the lower layer of one of the electrode layers 130 having silver and the upper layer thereof having carbon black, there are two sets of member sleeves which are connected in series in the transport direction of the substrate 100. Settings. As described above, when the electrode material has two layers, the number of programs is reduced as compared with the three-layer electrode material, and the visibility of the three-layer electrode material may be lowered.
請參考圖16,根據製造電極模方法之一實施例,在沒有形成電極層130的步驟和選擇地移除電極層130的步驟中,通過壓印在微小凹版圖案上所形成的薄膜是環繞在輥上,以增加形成在電極層130的圖案開口的面積,如圖8所示。在使用電極材料塗佈單元將電極材料填充在凹版圖案的基片上後,塗佈在基片上的電極材料會被刮除,使得電極材料被二次填充在具有增加面積的開口之凹版圖案,以製造電極膜。作為電極層130,銅、鎳、鉻、鐵、鎢、磷、鈷、銀、碳化銀、磷化鎳、氧化銅、無機物和導電聚合物皆可使用。 Referring to FIG. 16, according to an embodiment of the method of manufacturing an electrode mold, in the step of not forming the electrode layer 130 and selectively removing the electrode layer 130, the film formed by imprinting on the micro gravure pattern is surrounded by On the roller, the area of the pattern opening formed in the electrode layer 130 is increased as shown in FIG. After the electrode material is filled on the substrate of the intaglio pattern using the electrode material coating unit, the electrode material coated on the substrate is scraped off, so that the electrode material is secondarily filled in an intaglio pattern having an opening of an increased area, An electrode film is produced. As the electrode layer 130, copper, nickel, chromium, iron, tungsten, phosphorus, cobalt, silver, silver carbide, nickel phosphide, copper oxide, inorganic materials, and a conductive polymer can be used.
如上所述,該複數個實施例已配合圖式和說明書進行了描述。實施例的選擇和描述是為了解釋本發明及其實際應用的原理,從而使熟悉該項技藝之人士能夠製造和利用本發明的各種實施例,以及各種替換和修改模式。如從以上的說明可知,本發明的某些方面,並非對所示的具體細節加以限制,因此可以瞭解,其他的修改和應用,或其等同物,同樣會發生在熟悉該項技藝之人士處。許多變化、修改、變形和其它用途和本結構的應用,在考慮本說明書和附圖之後,對於熟悉該項技藝之人士將變得顯而易見。所有這些變化、修改、變形和其它用途,在不脫離本發明的精神和範圍下,將被視為涵蓋以下的申請專利範圍中。 As described above, the plurality of embodiments have been described in conjunction with the drawings and the description. The embodiment was chosen and described in order to explain the invention and the embodiments of the invention, As will be apparent from the foregoing description, certain aspects of the present invention are not limited to the specific details shown, and it is understood that other modifications and applications, or equivalents thereof, may also occur to those skilled in the art. . Numerous variations, modifications, variations and other uses and applications of the present invention will become apparent to those skilled in the art after consideration of this specification and the appended claims. All such changes, modifications, variations and other uses are intended to be included within the scope of the appended claims.
S100~S400‧‧‧步驟 S100~S400‧‧‧Steps
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